Engineer-to-Engineer Notea

EE-326

Technical notes on using Analog Devices DSPs, processors and development tools
Visit our Web resources http://www.analog.com/ee-notes and http://www.analog.com/processors or email processor.support@analog.com or processor.tools.support@analog.com for technical support.

Blackfin® Processor and SDRAM Technology
Contributed by Fabian Plepp

Rev 2 – December 11, 2008

Introduction
The Analog Devices Blackfin® family of processors provides an External Bus Interface Unit (EBIU) withwhich to interface to SDRAM.
This EE-Note covers the following topics:
Register settings and their meaning

SDRAM initialization



SDRAM hardware designUsing less than 16MB of SDRAM



Performance optimization

Power optimization
This EE-Note discusses SDR-SDRAM (not DDR-SDRAM) devices only.
Furthermore, this document applies to ADSP-BF53x, ADSP-BF52x, ADSP-BF51x and
ADSP-BF561 processors only. It does not apply to ADSP-BF54x processors.

Although this document covers basic aspects of SDRAM functionality, you should read The ABCs of
SDRAM (EE-126)[1] for more information.
This document is separated into different topics, so you do not need to read the entire document when you
are looking for specific information.

Copyright 2008, Analog Devices, Inc. All rights reserved. Analog Devices assumes no responsibility for customer product design or the use or application ofcustomers’ products or for any infringements of patents or rights of others which may result from Analog Devices assistance. All trademarks and logos are propertyof their respective holders. Information furnished by Analog Devices applications and development tools engineers is believed to be accurate and reliable, however
no responsibility is assumed by Analog Devices regarding technical accuracy and topicality of the content provided in Analog Devices Engineer-to-Engineer Notes.

aTable of Contents
Introduction .................................................................................................................................................................................................1
Table of Contents......................................................................................................................................................................................2
1 Brief Introduction to SDRAM .........................................................................................................................................................5
1.1 Basics of SDRAM............................................................................................................................................................................5
1.2 SDRAM Parameters in Blackfin Registers .....................................................................................................................6
1.2.1 EBCAW (SDRAM External Bank Column Address Width) ...................................................................................6
1.2.2 EBSZ (SDRAM External Bank Size)............................................................................................................................6
1.2.3 SDRAM Timing.........................................................................................................................................................................6
1.3 Multiprocessor Environment Options...............................................................................................................................7
1.3.1 BGSTAT (Bus Grant Status)..........................................................................................................................................7
1.3.2 PUPSD (Power-Up Startup Delay) ..............................................................................................................................7
1.3.3 CDDBG (Control Disable During Grant)................................................................................................................7
1.4 Mobile/ Low-Power SDRAM Options......................................................................................................................................8
1.4.1 PASR (Partial Array Self Refresh) .......................................................................................................................8
1.4.2 TCSR (Temperature-Compensated Self-Refresh) ...............................................................................................8
1.5 Options to Fit the SDRAM Timing......................................................................................................................................81.5.1 Blackfin Output / SDRAM Input Equation (Write) ........................................................................................91.5.2 Blackfin Input / SDRAM Output Equation (Read).........................................................................................10
2 SDRAM Initialization........................................................................................................................................................................10
2.1 SDRAM Initialization Via an Emulator and VisualDSP++ .XML Files........................................................10
2.2 Initialization Using Memory-Mapped Registers.....................................................................................................12
2.3 Initialization Using System Services........................................................................................................................15
2.4 SDRAM Initialization by the Values in the OTP Memory ..................................................................................17
2.5 Initializing Memory via Initialization Code Before Loading the Application..............................18
3 Using an .LDF File to Place Data and Program Code in Memory ...........................................................................21
4 SDRAM Hardware Design .....................................................................................................................................................................23
4.1 Connecting SDRAM to a Blackfin Processor (Schematics)................................................................................23
4.1.1 ADSP-BF53x Series Processors.................................................................................................................................23
4.1.2 ADSP-BF561 Processors (16-bit SDRAM)..............................................................................................................23
4.1.3 ADSP-BF561 Processors (32-bit SDRAM)..............................................................................................................24
4.2 High-Speed Design.....................................................................................................................................................................25
4.2.1 Effects that Impact Signal Quality...................................................................................................................25
4.2.2 Avoid Reflections...........................................................................................................................................................26
4.3 Design Guidelines for the SDRAM Connection..........................................................................................................27
4.3.1 Component Placement Considerations...................................................................................................................27
4.3.2 Using the Rounding Function of Your Layout Tool at Trace Edges ................................................28
4.3.3 Placing the VCC and GND Planes with as Little Distance as Possible.......................................28

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a4.3.4 Insulating Critical Signals by Placing Them in the Inner Layers ..............................................29
4.3.5 Placing the Series Resistor Close to the SDRAM ......................................................................................29
4.3.6 Avoiding Trenches in the GND Plane...................................................................................................................29
4.3.7 Minimizing Back-Current Paths from Vias.......................................................................................................30
4.3.8 Make use of the drive strength control functionality ........................................................................31
4.3.9 Make use of the slew control functionality................................................................................................31
5 Using a Blackfin Processor with Less than 16 MB of SDRAM ..................................................................................31
5.1 System Settings..........................................................................................................................................................................32
5.2 Changing the .LDF File .........................................................................................................................................................32
5.2.1 Excursus: Background....................................................................................................................................................33
5.3 SDRAMs with 2 Banks ................................................................................................................................................................34
6 Increasing the SDRAM Performance of Your System........................................................................................................35
6.1 Optimal Multi-Bank Accesses .............................................................................................................................................35
6.2 Optimal Pages Accesses .........................................................................................................................................................36
Pages for the ADSP-BF53x Processors ..............................................................................................................................37
Pages for ADSP-BF561 Processors........................................................................................................................................38
6.3 SDRAM Performance Items for Core Accesses ............................................................................................................39
6.3.1 Code Overlays ....................................................................................................................................................................40
6.4 SDRAM Performance Items When Using Cache ..............................................................................................................40
Code........................................................................................................................................................................................................40
Data........................................................................................................................................................................................................40
7 Optimizing Power Consumption.....................................................................................................................................................41
7.1 Introduction: Power-Consumption Figures.................................................................................................................41
7.2 Tips for Lowering SDRAM Power Consumption ............................................................................................................41
7.3 Mobile SDRAM.................................................................................................................................................................................42
7.4 Going into Hibernate and Recover .................................................................................................................................42
Step 1 ...................................................................................................................................................................................................42
Step 2 ...................................................................................................................................................................................................43
Step 3 ...................................................................................................................................................................................................43
7.5 Structuring Data for Low Power Consumption..........................................................................................................43
Appendices ....................................................................................................................................................................................................44
Appendix A: Glossary .......................................................................................................................................................................44
Appendix B: Code Examples, Schematics, and Excursus..............................................................................................47
Initialization Code (Chapter 2)........................................................................................................................................47
Schematics to Interface SDRAM to the Blackfin Processor (Chapter 4)...................................................48
ADSP-BF561 in 16-Bit Mode ......................................................................................................................................................49
ADSP-BF561 in 32-Bit Mode ......................................................................................................................................................50
Excursus: Calculating Z0 (Chapter 4)..............................................................................................................................51

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aCalculating the Inductance of a Microstrip Trace................................................................................................52
Calculating the Capacitance .................................................................................................................................................52
IPC’s and Douglas Brooks’ approach of Z0 (Chapter 4)........................................................................................53
Microstrip Trace ...........................................................................................................................................................................53
Embedded Microstrip Trace ......................................................................................................................................................53
Stripline Trace..............................................................................................................................................................................53
Asymmetric Stripline Trace....................................................................................................................................................53
Dielectric Constants of Printed Circuit Boards (PCBs) (Chapter 4) .......................................................54
Several Commonly Available Woven Glass Reinforces Laminates......................................................................54
List of Non-Woven or Very-Low Glass Content Laminate Materials ..............................................................54
References ....................................................................................................................................................................................................55
Readings.........................................................................................................................................................................................................55
Document History ......................................................................................................................................................................................56

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a
1 Brief Introduction to SDRAM
This section describes SDRAM (Synchronous Dynamic Random Access Memory) parameters andSDRAM-related system setups. This provides a base on which to build a better understanding of the EBIU
(External Bus Interface Unit) register variables. Further, it will give you a foundation from which to baseother decisions. It is not a detailed discussion of SDRAM; refer to The ABCs of SDRAM (EE-126)[1] formore details.
1.1 Basics of SDRAM

Although SRAM stores binary data using transistors, DRAM uses a capacitor and a transistor: The
capacitor is the storage itself; when charged, it will be a logical 1, otherwise a logical 0. The transistor
acts as a gate that controls access to the cell and traps the charge. The disadvantage of this technology isthat capacitors discharge over time.
To prevent the loss of data, the DRAM must be refreshed periodically to restore the charge on the memory
cells. Thus, a read and write operation must be performed to every memory location in the memory arrayat least once during the refresh rate period, which is typically specified in milliseconds.

Figure 1. SDRAM

The DRAM cells are organized in an array of rows and columns. Every single cell can be accessed by awell-defined row and column address. The row is often called the page, and the number of columns isreferred to as the page size. The address is time multiplexed; the row address is transmitted first, then thecolumn address is transmitted.
The /RAS (row access strobe) and by the /CAS (column access strobe) signals control the time
multiplexing of the row and column address. The /RAS signal indicates that a row address is available tobe loaded into the address buffer and decoded by the internal row address decoder. After a short delay, the/CAS signal indicates that the column address, which is available in the address buffer, is forwarded to thecolumn address decoder.
If /WE is high, a read command is processed. The cells that are addressed by a row are read out
completely, amplified, and written back to the cells. The columns that are addressed are transmitted overthe data bus.

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a
If the /WE is low, a write command is processed. The isolated writing of a single cell is not possible; thus,
a complete row is first read into a buffer. In the buffer, the elements to be changed are written, and thecomplete row is written back to the array.
1.2 SDRAM Parameters in Blackfin Registers
1.2.1 EBCAW (SDRAM External Bank Column Address Width)

Often, the external bank column address width is called the page size of the SDRAM. Blackfin processors
support page sizes of 512 bytes (8 bits), 1 Kbytes (9 bits), 2 Kbytes (10 bits), and 4 Kbytes (11 bits).

Besides the byte address bit, which is the least significant bit (LSB), these bits are the least significant bitsof the logical address. Depended on the width of the column address, the row address and bank havedifferent bits positions in the logical address. For example, with a column addressing width (CAW) of
11 bits, the row address has its LSB at bit 12 of the logical 32-bit address[31:0]. This is a very importantparameter if you want to access the SDRAM consciously. The number of the row address depends on thesize of the SDRAM. To determine the column addressing width in the data sheet, find how many address
pins are dedicated to column addressing. For a detailed overview, refer to the EBIU chapter of theBlackfin processor’s Hardware Reference.
1.2.2 EBSZ (SDRAM External Bank Size)

The SDRAM external bank size can be determined by the following formula:

MemorySize =Bank size x Number of Data pins x Number of Banks
8

For example, the MT48LC32M16A2 has 8 Mbytes x 16 pins x 4 banks, which is 536,870,912 bits,
equaling 64 Mbytes.
To use less than 16 MB, refer to Using a Blackfin Processor with Less than 16 MB of SDRAM.
1.2.3 SDRAM Timing
Clock
Cmd

Pre

ACTIV

Address

ACTIV

READ

Row

Column
Data

Data

t RAS

t RP

t RCD

CL

Figure 2. SDRAM Timing

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a
The SDRAM timing of SDRAM CAS Latency ( CL ), SDRAM bank activate command delay ( t RAS ),SDRAM bank precharge delay ( t RP ), RAS to CAS delay ( t RCD ), and write to precharge delay ( t WR ) aredescribed in detail in the EBIU chapter of your processor’s Hardware Reference.
1.3 Multiprocessor Environment Options

Blackfin processors can be used in a multiprocessor environment. One approach to interfacing theprocessors with one another is to share external memory and pass the messages via external memory to
the other processors. In order to provide arbitration functionality, Blackfin processors have dedicated pins
for this purpose.
To use the Blackfin processor in a multiprocessor environment with shared memory, you must connect the/BR, /BG, and /BGH pins to provide an access control. When the external device requires access to the bus,
it asserts the Bus Request (/BR pin) signal. If no other request is pending, the external bus request will be
granted. The processor will three-state the data and address bus, and the bus grant (/BG pin) signal will beasserted. When the bus is granted to another external device, any data or instruction fetch from theexternal memory will stop the processor until the bus is released and the access can be executed. Whenthe external device releases /BR, the processor deasserts /BG and continues execution from the point at
which it stopped. The processor asserts the /BGH pin when it is ready to start another external port access,but is held off because the bus was previously granted.
1.3.1 BGSTAT (Bus Grant Status)

When the bus has been granted, the BGSTAT bit in the SDSTAT register is set. This bit can be used by theprocessor to check the bus status to avoid initiating a transaction that would be delayed by the externalbus grant.
1.3.2 PUPSD (Power-Up Startup Delay)

This option sets a delay of 15 system clock cycles for the power-up start sequence. If one processor passes
the SDRAM to another processor, it has to send the SDRAM into self-refresh mode. Once self refresh
mode is engaged, the SDRAM provides its own internal clocking, causing it to perform its own autorefresh cycles. The SDRAM must remain in self-refresh mode for a minimum period equal to t RAS .
The procedure for exiting self-refresh mode requires a sequence of commands. First, CLK must be stable(stable clock is defined as a signal cycling within timing constraints specified for the clock pin) prior to
CKE going back high. When CKE is high, the SDRAM must have NOP commands issued for t XSR because
this length of time is required for the completion of any internal refresh in progress. To take the time
period t XSR into account, a delay of 15 cycles will occur until the Blackfin processor starts its power-up
sequence.
1.3.3 CDDBG (Control Disable During Grant)

If you are working in a multiprocessor environment with shared memory, where other devices than theBlackfin processor have access to memory, this feature enables the external memory interface of theprocessor to additionally three-state the address and data pins, its memory control pins (SRAS, SCAS, SWE,
SA10, and SCKE), and its clock pin (CLKOUT).

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a1.4 Mobile/ Low-Power SDRAM Options

Blackfin processors support mobile SDRAM chips (also called low-power SDRAM). Depending on theseries of Blackfin processors, you can use 3.3V, 2.5V, and 1.8V SDRAM. In order to use 2.5V and 1.8V
chips, verify in the processor’s data sheet (electrical specifications) that the processor is able to have an
output low voltage (maximum) as dictated by the SDRAM device data sheet. The mobile SDRAM
achieves low power consumption not only by its lower voltage, but also by its low currents. Anotheradvantage of mobile SDRAM is the ability to deactivate the self-refresh of the several banks you are notusing and to reduce the self-refresh rate by defining the temperature. These features enable you to
optimize power consumption for your specific application. If not otherwise stated in the Blackfin data
sheet, at 1.8V VDDEXT (the maximal frequency of the system clock) is limited to 100 MHz.

1.8V
2.5 V
3.3 V

ADSP-BF51x

ADSP-BF52x

ADSP-BF533/2/1

ADSP-BF537/6/4

ADSP-BF539/8

ADSP-BF561

9

9

9

9
9

9
9

9
9

8
9/8*

8
9/8*

8
9/8*

9

9

9

*Depending on selected SDRAM device.
Figure 3. Supported SDRAM voltages by processor series

To use the extended registers of mobile SDRAM, the EMREN bit must be set.
1.4.1 PASR (Partial Array Self Refresh)

Every refresh consumes power. If the application does not need to store the complete memory in special
modes, this feature provides a way to disable the refresh of several banks of the SDRAM. The benefit ofthis feature is lower power consumption.
Take for example, an application that stores data (e.g., a picture) into SDRAM, does some signal
processing, transmits the data or stores it to a non-volatile memory(e.g., flash), and goes back into sleep
mode. Most of the SDRAM is needed only for the signal processing. The data is absolved after
processing, so the banks in which the data is placed does not need to be refreshed.
1.4.2 TCSR (Temperature-Compensated Self-Refresh)

In standard SDRAMs, the self-refresh rate is set to the worst-case scenario: A high temperature will cause
a higher discharge of the capacitors, which requires a higher refresh rate to maintain the data. But a higher
refresh rate will effect higher power consumption. By means of the TCSR bit, the user application is able toset the self-refresh rate according to the temperature, which it is measuring.
1.5 Options to Fit the SDRAM Timing

Sometimes the timing parameter specification of an SDRAM does not fit the specification of the EBIU.
Therefore, the PLL control register provides an option to delay the output signal and shift the input latch
mechanism for 200 ps.

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aFigure 4. PLL_CTL register (copied from Hardware Reference)Bit 6 and bit 7 (Figure 4) provide a delay to the SDRAM signals. Apply the output delay when thespecification of a write access will be violated. It will delay the data hold for 200 ps. The input delay must
be applied when the specification of a read access will be violated. It delays the latch of the incoming data
signal by 200 ps.
t sclk

CLKOUT Periodt SSDAT

Data Setup Before CLKOUT (BF data sheet)t AC

Access time from CLK (SDRAM data sheet)t DH

Input Hold time (SDRAM data sheet)t HSDAT

Data Hold after CLKOUT (BF data sheet)t OH

Output Hold time (SDRAM data sheet)t OLZ

Delay to the output high impedance from CLK (SDRAM data sheet)t OHZ

Delay from high impedance to signal from CLK (SDRAM data sheet)

1.5.1 Blackfin Output / SDRAM Input Equation (Write)

For SDRAM input, the following equation must be valid:t DH < t HSDATt SCLKt HSDATt DH

Figure 5. Timing

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a1.5.2 Blackfin Input / SDRAM Output Equation (Read)

This case applies especially when setting the SDRAM clock to 133 MHz, which places the timing
parameters at the limit of the specification.
t SCLK
Clock

DQ

Data

tOLZ

t SSDAT

tOH

Data

tOHZ

t AC

Figure 6. Timing

To verify that the read operation processed correctly, ensure that t sclk > t SSDAT + t AC

2 SDRAM Initialization
SDRAM initialization impacts application performance and SDRAM power consumption. Therefore, abetter understanding of the settings is highly desirable. This section describes how to set up the EBIU
(External Bus Interface Unit) registers in order to run your application. In order to initialize the SDRAM,
use one of the following approaches:

SDRAM initialization via an emulator and VisualDSP++® .XML files



SDRAM initialization by setting the registers within the application



SDRAM initialization by using the VisualDSP++ system service model

SDRAM initialization by an initialization file before loading the actual application



SDRAM initialization by the values in the OTP (One Time Programmable) memory

2.1 SDRAM Initialization Via an Emulator and VisualDSP++ .XML Files

In the early stages of software development, you upload your software via an in-circuit emulator (ICE).
The emulator can set up the EBIU registers automatically when you upload a program to the processor.
To enable this functionality, from the VisualDSP++ Settings menu, chose Target Options. From theresulting Target Options dialog box (Figure 7), select the Use XML reset values option.

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aFigure 7. Target Options dialog box

For VisualDSP++ release 4.5 or lower the values are taken from an .xml file (extensible markup
language) named ADSP-BF5XX-proc.xml (where XX stands for the architecture; e.g., ADSP-BF537proc.xml or ADSP-BF561-proc.xml). These files are located in the <install_path>\Analog
Devices\VisualDSP X.X\System\ArchDef directory. By changing these values, you can configure thesettings of the EBIU. Figure 8 shows a portion of a processor .XML file. For more information, refer to“custom board support” in VisualDSP++ Help.

Figure 8: A portion of the ADSP-BF5xx-proc.xml file (VisualDSP++ 4.5)

The processor .xml file is read at startup only. Any editing while VisualDSP++ IDDE is up and runningwill not take effect. Ensure that you have edited the values before invoking VisualDSP++ development
tools. When VisualDSP++ tools are running, the values in the .XML files are used to set the corresponding
SDRAM values of the Analog Devices EZ-KIT Lite® development board.
For VisualDSP++ release 5.0 or higher, it’s not recommended to modify the .XML
files in the ArchDef folder directly. Use the custom board support which is describedin the following paragraph.

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aWith custom board support in VisualDSP++ release 5.0 or higher, it is easier to set reset values in an
application: This feature enables developers to have multiple sets of reset settings and to change between
them without having to start up VisualDSP++ tools again. Open a text editor and place code like thefollowing into a file and save it. In this example (Listing 1), the filename is
My_custom_board_reset_settings.xml:<?xml version="1.0" standalone="yes"?><custom-visualdsp-proc-xml
xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance"
xsi:noNamespaceSchemaLocation="\Program Files\Analog Devices\VisualDSP
5.0\System\ArchDef\ADSP-custom-board.xsd"
processor-family="BLACKFIN"
file="My_custom_board_reset_settings.xml"><!-- ************************************************************************* --><!-- ******* My_custom_board_reset_settings.xml--><!-- ************************************************************************* --><custom-register-reset-definitions><register name="EBIU_SDRRC" reset-value="0x03A0" core="Common" /><register name="EBIU_SDBCTL" reset-value="0x25" core="Common" /><register name="EBIU_SDGCTL" reset-value="0x0091998D" core="Common" /></custom-register-reset-definitions></custom-visualdsp-proc-xml>
Listing 1. Example custom board reset settings (VisualDSP++ 5.0)

To enable this feature in VisualDSP++ development tools, perform the following steps:
1. From the Settings menu, choose Session.
2. In the Session Settings dialog box, select Enable customizations.
3. In
Customboard
supportfile
name,navigatetothe“My_custom_board_reset_settings.xml” that contains the SDRAM reset values.

file

named

Whenever the processor is reset by VisualDSP++ tools, these reset values will be set in the registers.
2.2 Initialization Using Memory-Mapped Registers

The classical approach to initializing the SDRAM controller is to assign the values directly to thememory-mapped registers (MMRs).
As an example, we take a mobile SDRAM data sheet1.

1

Samsung K4M56163 R(B)N/G/L/F Mobile SDRAM

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aFigure 9. Example: portion of a data sheet for mobile SDRAM

Figure 10: Address configuration specification in the data sheet

Before setting the SDRAM registers, we must first configure the PLL. For our example, we are using asystem clock frequency of 133 MHz. First, we calculate the refresh rate:
RDIV =

f SCLK ⋅ t REF− (t RAS + t RP )NRA

From the data sheet (-75), we get the following information:fSCLK = 133 MHz
t REF = 64 ms
NRA = 8192
tRAS = 45 ns at 133 MHz: t RAS = 6 cycles
tRP = 18 ns at 133 MHz: t RP = 3 cycles
RDIV =

133 ⋅ 106 ⋅ 64 ⋅10−3− (6 + 3) = 1030.0625 ≈ 1030 in Hex : 0x406
8192

Further, we need to calculate the following values:tRCD = 18 ns at 133 MHz: t RCD = 3 cycles
For Samsung specific devices, t WR is called t RDL .
t WR = t RDL = 2 cycles

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aAfterwards, we have to ensure that all derived parameters from the timings we specify are also within the
SDRAM specification. So we have to control:t XSR = t RAS + t PR-> 6 cycles + 3 cycles = 9 cycles at 133 MHz : 67.5 ns

t RRD = t RCD + 1-> 3 cycles + 1 cycle = 4 cycles at 133 MHz : 30 ns

t RC = t RAS + t PR-> 6 cycles + 3 cycles = 9 cycles at 133 MHz : 67.5 ns

t RFC = t RAS + t PR-> 6 cycles + 3 cycles = 9 cycles at 133 MHz : 67.5 ns

If we compare these values with the SDRAM’s data sheet, we notice we are within the specifications.
Additionally, we have to enable the extended register to set the temperature and the partial self-refresh.
The PASR can be set to following settings:


PASR_ALL – All four SDRAM banks refreshed in self-refresh

PASR_B0_B1 – SDRAM banks 0 and 1 are refreshed in self-refresh

PASR_B0 – Only SDRAM bank 0 is refreshed in self-refresh

Listing 2 shows the initialization in C.
//SDRAM Refresh Rate Setting*pEBIU_SDRRC = 0x406;//SDRAM Memory Bank Control Register*pEBIU_SDBCTL =EBCAW_9| //Page size 512
EBSZ_64| //64 MB of SDRAM
EBE;//SDRAM enable//SDRAM Memory Global Control Register*pEBIU_SDGCTL= ~CDDBG& // Control disable during bus grant off~FBBRW& // Fast back to back read to write off~EBUFE& // External buffering enabled off~SRFS& // Self-refresh setting off~PSM& // Powerup sequence mode (PSM) first~PUPSD& // Powerup start delay (PUPSD) off
TCSR| // Temperature compensated self-refresh at 85
EMREN| // Extended mode register enabled on
PSS| // Powerup sequence start enable (PSSE) on
TWR_2| // Write to precharge delay TWR = 2 (14-15 ns)
TRCD_3| // RAS to CAS delay TRCD =3 (15-20ns)
TRP_3| // Bank precharge delay TRP = 2 (15-20ns)
TRAS_6| // Bank activate command delay TRAS = 4
PASR_B0| // Partial array self refresh Only SDRAM Bank0
CL_3| // CAS latency
SCTLE; // SDRAM clock enable
Listing 2. Initialization via registers

The code in assembly language can be found in Initialization Code (Chapter 2).
What will happen if we need to change the PLL settings later in the application? To obtain the best
memory performance, we have to change our settings as well. If memory performance does not matter, wehave to calculate the values at the worst-case scenario.

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aExamples of initializing the SDRAM on the ADSP-BF537 EZ-KIT Lite (in assembler and C) and on the
ADSP-BF561 EZ-KIT Lite (in C) are included together with this EE-Note.
2.3 Initialization Using System Services

Another way to initialize the SDRAM is to handle the setup in the application itself. The most
comfortable way to change the EBIU settings is by means of system services. The main advantage ofusing the EBIU system service is that you can set the EBIU without any calculations. And second benefit
is that the changes to the EBIU are in accordance to the PLL changes, so you do not need to be concerned
about the actual system clock frequency.
The initialization is done by the adi_ebiu_init function. We will take the same SDRAM as in thesection above.
To perform an initialization using the system services, we have to pass the SDRAM parameters to thesystem. Therefore, we are using a command structure called ADI_EBIU_COMMAND_PAIR. (Table 1).
To initialize the structure in our example, we set the variables (for the -75) as shown in Listing 3.
// set the sdram to 64 MB
ADI_EBIU_SDRAM_BANK_VALUE bank_size = {0, ADI_EBIU_SDRAM_BANK_64MB};//set the sdram to 9 bit Column Address Width (like we see in the Address//Configuration)// A0-A8 -> 9bits Column Address
ADI_EBIU_SDRAM_BANK_VALUE bank_caw = {0,(ADI_EBIU_SDRAM_BANK_SIZE)ADI_EBIU_SDRAM_BANK_COL_9BIT}; // 9bit CAW//set the twr to 2 sclk + no time
ADI_EBIU_TIMING_VALUE MyTWR = {{0, ADI_EBIU_TIMING_UNIT_PICOSEC}};2,// 0 ns// 2 cycle//set refresh rate to 64ms at 8192 rows as seen in the data sheet
ADI_EBIU_TIMING_VALUE Refresh = {// SDRAM Refresh rate:
8192,// 8192 cycles{64, ADI_EBIU_TIMING_UNIT_MILLISEC}}; // 64ms//set TRAS to 45ns
ADI_EBIU_TIME MyTRAS = {45, ADI_EBIU_TIMING_UNIT_NANOSEC};//set TRP to 18ns
ADI_EBIU_TIME MyTRP = {18, ADI_EBIU_TIMING_UNIT_NANOSEC};//set TRCD to 18ns
ADI_EBIU_TIME MyTRCD = {18, ADI_EBIU_TIMING_UNIT_NANOSEC};//set CAS threshold frequency
u32 MyCAS = 133;//Enable Extended Mode Register because we are using Mobile SDRAM
ADI_EBIU_SDRAM_EMREN MyEMREN = ADI_EBIU_SDRAM_EMREN_ENABLE;//Refresh only the first bank
ADI_EBIU_PASR MyPASR = ADI_EBIU_PASR_INT0_ONLY;//Temperature Compensation at 85°C
ADI_EBIU_SDRAM_TCSR MyTCSR = ADI_EBIU_SDRAM_TCSR_85DEG;//we don't have any registered buffer
ADI_EBIU_SDRAM_EBUFE MyEBUFE = ADI_EBIU_SDRAM_EBUFE_DISABLE;//no fast-back-to-back read/write
ADI_EBIU_SDRAM_FBBRW MyFBBRW = ADI_EBIU_SDRAM_FBBRW_DISABLE;

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a//Do not disable the control during bus grant
ADI_EBIU_SDRAM_CDDBG MyCDDBG = ADI_EBIU_SDRAM_CDDBG_DISABLE;//We don't need any delay at Power Up
ADI_EBIU_SDRAM_PUPSD MyPUPSD = ADI_EBIU_SDRAM_PUPSD_NODELAY;//Do first the refresh
ADI_EBIU_SDRAM_PSM MyPSM = ADI_EBIU_SDRAM_PSM_REFRESH_FIRST;
Listing 3.Initialization of the EBIU structure

Table 1. Overview of EBIU commands

After setting up the parameters, we need to initialize the service. Therefore, we bundle the parameters to acommand table and afterwards call the adi_EBIU_init function.
ADI_EBIU_COMMAND_PAIR Sdram_Values[] = {{ ADI_EBIU_CMD_SET_SDRAM_BANK_SIZE,{ ADI_EBIU_CMD_SET_SDRAM_BANK_COL_WIDTH,{ ADI_EBIU_CMD_SET_SDRAM_CL_THRESHOLD,{ ADI_EBIU_CMD_SET_SDRAM_TRASMIN,{ ADI_EBIU_CMD_SET_SDRAM_TRPMIN,{ ADI_EBIU_CMD_SET_SDRAM_TRCDMIN,{ ADI_EBIU_CMD_SET_SDRAM_TWRMIN,{ ADI_EBIU_CMD_SET_SDRAM_REFRESH,{ ADI_EBIU_CMD_SET_SDRAM_FBBRW,{ ADI_EBIU_CMD_SET_SDRAM_EMREN,{ ADI_EBIU_CMD_SET_SDRAM_PASR,{ ADI_EBIU_CMD_SET_SDRAM_TCSR,{ ADI_EBIU_CMD_SET_SDRAM_EBUFE,{ ADI_EBIU_CMD_SET_SDRAM_CDDBG,{ ADI_EBIU_CMD_SET_SDRAM_PUPSD,{ ADI_EBIU_CMD_SET_SDRAM_PSM,{ ADI_EBIU_CMD_END, 0}(void*)&bank_size },(void*)&bank_caw },(void*)&MyCAS},(void*)&MyTRAS},(void*)&MyTRP},(void*)&MyTRCD},(void*)&MyTWR},(void*)&Refresh},(void*)&MyFBBRW},(void*)&MyEMREN},(void*)&MyPASR},(void*)&MyTCSR},(void*)&MyEBUFE},(void*)&MyCDDBG},(void*)&MyPUPSD},(void*)&MyPSM},};//Init the service and ensure that the Refresh rate is reset if fsclk is changing
Result = adi_ebiu_Init( Sdram_Values, true);// true enables automatic adjustment
Listing 4. Initialization of the EBIU

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aCode examples that demonstrate the use of system services for the ADSP-BF537 and the ADSP-BF561
processors are located in the .ZIP file attached to this EE-Note.
2.4 SDRAM Initialization by the Values in the OTP Memory

Devices with One-Time-Programmable (OTP) memory (ADSP-BF51x, ADSP-BF52x and ADSP-BF54x
processors) offer an additional approach to initializing the EBIU register settings. During booting, theboot ROM program is able to initialize the EBIU settings by the programmed values in the OTP. The OTP
consists of a region called the Preboot Settings (PBS) block, which must be programmed via the
OTP_write function.
The PBS02L page contains the EBIU settings. Refer to your processor’s Hardware Reference for an
overview.
After setting up the EBIU control registers, the boot process accesses the SDRAM at address 0x00000000
in order to initialize the SDRAM. By default, setting a read access will be performed. Since a read accessconsumes more time than a write access, this access can be customized by the
OTP_EBIU_POWERON_DUMMY_WRITE bit (Figure 11), which replaces the read access with a write access andsaves time. By using this option, you must ensure that no important data is stored at this address before
going to reset or hibernate.

Figure 11. Dummy write option/* Declare local variable */DU64 Data;.
.
/* Enable the EBIU Init settings */Data.h = 0x04000000| //use the content of PBS02L for the EBIU...
| //other settings
Data.l = ...
otp_write(0x18, OTP_LOWER_HALF, &Data);/* Assign SDRAM values *//* The low data byte is the EBIU_SDGCTL register */Data.l =~CDDBG& // Control disable during bus grant off~FBBRW& // Fast back to back read to write off~EBUFE& // External buffering enabled off~SRFS& // Self-refresh setting off~PSM& // Powerup sequence mode (PSM) first~PUPSD& // Powerup start delay (PUPSD) off
TCSR| // Temperature compensated self-refresh at 85
EMREN| // Extended mode register enabled on

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a
PSS
TWR_2
TRCD_3
TRP_3
TRAS_6
PASR_B0
CL_3
SCTLE;| // Powerup sequence start enable (PSSE) on| // Write to precharge delay TWR = 2 (14-15 ns)| // RAS to CAS delay TRCD =3 (15-20ns)| // Bank precharge delay TRP = 2 (15-20ns)| // Bank activate command delay TRAS = 4| // Partial array self refresh Only SDRAM Bank0| // CAS latency/* The upper 32 bit are EBIU_SDBCTL(0-15) and EBIU_SDRRC (16-27). Further we will
Set the dummy write bit (32), which will speed up the initialization*/
Data.h =0x80000000(0x406)<<16
EBCAW_9
EBSZ_64
EBE;| // dummy write bit| // Refresh rate
| //Page size 512| //64 MB of SDRAM//SDRAM enable;
otp_write(0x1A, OTP_LOWER_HALF, &Data);
Listing 5. Initialization via PBS

2.5 Initializing Memory via Initialization Code Before Loading the Application

If you want to place instruction and data sections into your SDRAM at initialization time, you must use an
initialization file that initializes the SDRAM before the application is loaded. Therefore, start a projectand code an initialization file. Build this project into a .DXE file. The initialization .DXE file can be
included into a loader file of your actual application via the Project Options dialog box(Project:Load:Options page).

Figure 12. Specifying project load options

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aListing 6 shows an example of how initialization code can be implemented.
#include <defBF537.h>.section program;//save all registers on the stack[--SP] = ASTAT;...
[--SP] = L3;//Setup the PLL Settings//Ensure no other interrupt will disturb us
CLI R1;//Setup the voltage regulator
P0.L = lo(VR_CTL);
P0.H = hi(VR_CTL);
R0 = 0x40DB (z);w[P0] = R0;//Wait the VR settings are done
idle;//Setup the DIV of ssclk and cclk
P0.L = lo(PLL_DIV);
R0 = 0x0003 (z);w[P0] = R0;//Setup wait cycles until PLL is set
P0.L = lo(PLL_LOCKCNT);
R0 = 0x200 (z);w[P0] = R0;//Setup the PLL
P0.L = lo(PLL_CTL);
R0 = 0x2000 (z);w[P0] = R0;//Wait the PLL settings are done
idle;//restore interrupts
STI R1;//Our program needs 4 MBs of RAM
P0.L = lo(EBIU_AMGCTL);
P0.H = hi(EBIU_AMGCTL); //Asynchronous Memory Global Control Register//Uncomment your setting
R0 = 0x00F0//|AMBEN_NONE(Z);//No Asynchronous Memory//|AMBEN_B0(Z);//1MB Asynchronous Memory//|AMBEN_B0_B1(Z);//2MB Asynchronous Memory//|AMBEN_B0_B1_B2(Z);//3MB Asynchronous Memory|AMBEN_ALL(Z);//4MB Asynchronous Memory
W[P0] = R0;//Setup the SDRAM//SDRAM Refresh Rate Setting
P0.H = hi(EBIU_SDRRC);
P0.L = lo(EBIU_SDRRC);
R0 = 0x406 (z);w[P0] = R0;

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a//SDRAM Memory Bank Control Register
P0.H = hi(EBIU_SDBCTL);
P0.L = lo(EBIU_SDBCTL);
R0 =EBCAW_9| //Page size 512
EBSZ_64| //64 MB of SDRAM
EBE;//SDRAM enable
w[P0] = R0;//SDRAM Memory Global Control Register
P0.H = hi(EBIU_SDGCTL);
P0.L = lo(EBIU_SDGCTL);
R0.H=
hi(
~CDDBG& // Control disable during bus grant off~FBBRW& // Fast back to back read to write off~EBUFE& // External buffering enabled off~SRFS& // Self-refresh setting off~PSM& // Powerup sequence mode (PSM) first~PUPSD& // Powerup start delay (PUPSD) off
TCSR| // Temperature compensated self-refresh at 85
EMREN| // Extended mode register enabled on
PSS| // Powerup sequence start enable (PSSE) on
TWR_2| // Write to precharge delay TWR = 2 (14-15 ns)
TRCD_3| // RAS to CAS delay TRCD =3 (15-20ns)
TRP_3| // Bank precharge delay TRP = 2 (15-20ns)
TRAS_6| // Bank activate command delay TRAS = 4
PASR_B0| // Partial array self refresh Only SDRAM Bank0
CL_3| // CAS latency
SCTLE); // SDRAM clock enable
R0.L=

lo(

~CDDBG~FBBRW~EBUFE~SRFS~PSM~PUPSD
TCSR
EMREN
PSS
TWR_2
TRCD_3
TRP_3
TRAS_6
PASR_B0
CL_3
SCTLE& // Control disable during bus grant off& // Fast back to back read to write off& // External buffering enabled off& // Self-refresh setting off& // Powerup sequence mode (PSM) first& // Powerup start delay (PUPSD) off| // Temperature compensated self-refresh at 85| // Extended mode register enabled on| // Powerup sequence start enable (PSSE) on| // Write to precharge delay TWR = 2 (14-15 ns)| // RAS to CAS delay TRCD =3 (15-20ns)| // Bank precharge delay TRP = 2 (15-20ns)| // Bank activate command delay TRAS = 4| // Partial array self refresh Only SDRAM Bank0| // CAS latency) ; // SDRAM clock enable[P0] = R0;
ssync;//Restore registers from the stack
L3 = [SP++];...
ASTAT = [SP++];
RTS;
Listing 6. Initialization via an initialization file

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a
3 Using an .LDF File to Place Data and Program Code in Memory
If the SDRAM is initialized before the application is loaded (see SDRAM Initialization by the Values in
the OTP Memory), you can place data and code into the memory sections. Therefore, you must define amemory region in the Linker Description File (.LDF) and inform the linker as to the data or code that is tobe placed into memory.
Let’s assume we want to place data in SDRAM bank 1. If we take a closer look into a standard Linker
Description File (.LDF) which is generated by the VisualDSP++ Expert Linker wizard (in this example wewill have 512 MB of SDRAM), we see the internal SDRAM banks are named separately:
MEMORY{ MEM_SYS_MMRS[…]
MEM_SDRAM0_BANK0
MEM_SDRAM0_BANK1
MEM_SDRAM0_BANK2MEM_SDRAM0_BANK3} /* MEMORY */{ TYPE(RAM) START(0xFFC00000) END(0xFFDFFFFF) WIDTH(8) }{ TYPE(RAM) START(0x00000004) END(0x07ffffff) WIDTH(8) }{ TYPE(RAM) START(0x08000000) END(0x0fffffff) WIDTH(8) }{ TYPE(RAM) START(0x10000000) END(0x17ffffff) WIDTH(8) }{ TYPE(RAM) START(0x18000000) END(0x1fffffff) WIDTH(8) }Listing 7.Assigning memory

We will find the memory label “MEM_SDRAM0_BANK1” in the “SECTIONS” area again:
PROCESSOR p0{
OUTPUT($COMMAND_LINE_OUTPUT_FILE)RESOLVE(start, 0xFFA00000)
KEEP(start, _main)
SECTIONS{[...]
sdram0_bank1{
INPUT_SECTION_ALIGN(4)INPUT_SECTIONS($OBJECTS(sdram0) $LIBRARIES(sdram0))
INPUT_SECTIONS($OBJECTS(sdram0_bank1) $LIBRARIES(sdram0_bank1))
INPUT_SECTIONS($OBJECTS(sdram0_data) $LIBRARIES(sdram0_data))
INPUT_SECTIONS($OBJECTS(cplb) $LIBRARIES(cplb))
INPUT_SECTIONS($OBJECTS(data1) $LIBRARIES(data1))
INPUT_SECTIONS($OBJECTS(voldata) $LIBRARIES(voldata))
INPUT_SECTIONS($OBJECTS(constdata) $LIBRARIES(constdata))
INPUT_SECTIONS($OBJECTS(cplb_data) $LIBRARIES(cplb_data))
INPUT_SECTIONS($OBJECTS(.edt) $LIBRARIES(.edt))
INPUT_SECTIONS($OBJECTS(.cht) $LIBRARIES(.cht))} > MEM_SDRAM0_BANK1[...]} /* SECTIONS */} /* p0 */Listing 8. Specifying memory sections

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a
We see that several libraries and objects are mapped into this memory space. You can map an object orlibrary to more than one memory section. In this case, the linker decides which part of the data or code isplaced into each section of memory.
To place data explicitly in one memory section if using C/C++, use the pragma section directive. In ourcase, we want to place the global variable x into internal SDRAM bank 1. The label sdram0_bank1 is
only mapped to internal SDRAM bank 1 and no other section. So we will use this label to map our
variable.
//define a variable which lies in SDRAM Bank 1#pragma section ("sdram0_bank1")
long int x = 0;

We can do the same with our instruction code by assigning the prototypes of our functions to a section://define a function prototype of a function which lies in SDRAM Bank 1#pragma section ("sdram0_bank1")
void foo();

As described in Increasing the SDRAM Performance of Your System, sometimes it is useful to map a data
section manually to prevent delays caused by opening and closing a page. Therefore, we define our own
memory section in the .LDF file:
MEM_SDRAM0_BANK2MEM_SDRAM0_BANK3//define my own page
MEM_SDRAM0_BANK3_PAGE0{ TYPE(RAM) START(0x02000000) END(0x02ffffff) WIDTH(8) }{ TYPE(RAM) START(0x03000800) END(0x03ffffff) WIDTH(8) }{ TYPE(RAM) START(0x03000000) END(0x030007FF) WIDTH(8) }In the SECTIONS part of the Linker Description File, we will link all objects labeled MyDefinedMemory
into this memory space.
sdram0_bank3_page_0{
INPUT_SECTION_ALIGN(4)INPUT_SECTIONS($OBJECTS(MyDefinedMemory) )} > MEM_SDRAM0_BANK3_PAGE0

Afterwards, in our C/C++ file, we place our array into this memory section.
//define an array which lies in my own defined memory space (Bank 3 Page 0)#pragma section ("MyDefinedMemory")
long int MyArray[100];

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a
4 SDRAM Hardware Design
Since the SDRAM is driven by frequencies greater than 50 MHz, the hardware layout must fulfill therequirements of high-speed design. Nowadays, hardware designs satisfy many standards concerning EMI
and EMC. They have to ensure the signal integrity at high frequencies, and many of them are set in a low
power environment. Therefore, the right printed circuit board (PCB) design is a key factor. This section
explains how to design the connection between the Blackfin processor and the SDRAM on a PCB.
4.1 Connecting SDRAM to a Blackfin Processor (Schematics)

Blackfin processors provide a glueless interface to SDRAM. Depending on the Blackfin processor,
SDRAMs with a power supply requirement of 1.8V to 3.3V are supported.
A common design mistake occurs when is the Blackfin processor address pins are not connected to the
SDRAM correctly.
The address lines must be connected as described next.
4.1.1 ADSP-BF53x Series Processors
Connect Blackfin processor’s ADDR1 to the SDRAM A0, ADDR2 to A1, etc.


Do not use the ADDR11 of the Blackfin; connect SA10 to A10

Connect ADDR18 to the SDRAM’s BA0Connect ADDR19 to the SDRAM’s BA1Connect /ABE0 to the DQML pin (for 16-bit SDRAM) or to DQM of the chip(s) connected to D0-D7

Connect /ABE1 to the DQMH pin (for 16-bit SDRAM) or to DQM of the chip(s) connected to D8-D15

Figure 13. ADSP-BF53x processors: connections between the Blackfin processor and SDRAM
4.1.2 ADSP-BF561 Processors (16-bit SDRAM)
Connect the Blackfin processor’s ADDR2 to the SDRAM’s A1, ADDR3 to A2, etc.
Connect the Blackfin processor’s SDQM3 to the SDRAM’s A0Do not use the ADDR11 of the Blackfin processor; connect SA10 to A10

Connect ADDR18 to the SDRAM’s BA0

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a

Connect ADDR19 to the SDRAM’s BA1Connect SDQM0 to DQML or to DQM (see above)Connect SDQM1 to DQMH or to DQM (see above)Connect the /SMSx to the /CS lines(when using x16 and are using more than one SDRAM: to each chip one /SMS line)(when using x8 and are using more than two SDRAMs: to each pair of two one /SMS line)
BF561
SDQM3
A2-A10, A12-A17
SA10
A18 A19
D0-D15
SDQM0
SDQM1
SRAS
SCAS
SWE
SMS0-SMS3
SCKE
CLK0_OUT SCLK

SDRAM
A0
A1-A9, A11-A16
A10
BA0 BA1
DQ0-DQ15
DQML
DQMH
RAS
CAS
WE
CS
CKE
CLK

Figure 14. ADSP-BF561 processors: connections between the Blackfin processor and 16-bit SDRAM
4.1.3 ADSP-BF561 Processors (32-bit SDRAM)
Connect the Blackfin processor’s ADDR2 to the SDRAM’s A0, ADDR3 to A1, etc.


Do not use the ADDR12 of the Blackfin; connect SA10 to A10

Connect ADDR18 to the SDRAM’s BA0Connect ADDR19 to the SDRAM’s BA1Connect SDQM0 to DQML of SDRAM1(D0-D15)

Connect SDQM1 to DQMH of SDRAM1



Connect SDQM3 to DQML of SDRAM2(D16-D31)

Connect SDQM4 to DQMH of SDRAM2

If you are using 8-bit SDRAM
Connect SDQM0 to DQM of SDRAM1(D0-D7)

Connect SDQM0 to DQM of SDRAM2(D8-D15)

Connect SDQM0 to DQM of SDRAM3 (D16-D23)

Connect SDQM0 to DQM of SDRAM4 (D24-D31)

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aFigure 15. ADSP-BF561 processors: connections between the Blackfin processor and 32-bit SDRAM

Another problem is caused when the /BR pin is left floating. The Blackfin processor interprets the signal
as bus request and will answer with the /BG signal, which will block the parallel bus for an infinite time.
So always put a pull-up resistor on the /BR pin.
Use decoupling capacitors to decouple the SDRAM power supply.
Add a series resistor close to each data pin of the SDRAM. The next section explains how to determine
the resistance.
4.2 High-Speed Design

The layout of the SDRAM connection is a critical factor, especially on low-power designs. This section
explains how to optimize the design of the SDRAM layout to fit your application’s requirements. The
most critical connections are the clock, the lower address lines, the DQM, and the data lines.
4.2.1 Effects that Impact Signal Quality

This section describes effects that are influenced by your hardware design.
Reflection

If the impedance of a connection line is equivalent to the input resistance of the receiver, the energy will
be fully absorbed by the resistance. Otherwise, the transmission’s energy will be thrown back. This willinterfere with the desired signal by superposition.
Coupling

The currents conducted through different traces influence each other. When a changing current flows
down trace A, it creates a changing magnetic field that couples into trace B. The coupling generates acurrent in trace B that is dependent upon the coupling factor. The inducted current’s direction is opposite
to the current in trace A; this effect is negative if two signal traces influence each other (crosstalk). But
the effect can also be positive when the influence is between the signal line and its return line (GND). The
coupled signal helps to boost the return signal, and the returning signal boosts the primary signal.

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a4.2.2 Avoid Reflections

Calculate the characteristic impedance to add the correct termination resistor.
There are several ways to terminate a transmission line:Series termination

Parallel termination



Thevenin termination



Termination by diodesAC termination

The most important techniques for SDRAM devices are described next.
Series Termination

For SDRAM, use a series termination (Figure 16). Place the series resistor close to the output pin of thetransmitter. The advantage is that there will not be any DC current draw (like if you are using a parallel
termination). This is essential for low-power designs. The disadvantage is that there will be a nearly 100%
refection at the receiver, which is thrown back to the transmitter. Since the lengths of SDRAM traces areshort and the traces of one signal from the Blackfin processor to each of the SDRAM chips have nearly
the same length, this effect will not impact the SDRAM’s functionality.

Figure 16. Using series termination

To avoid a second reflection from the driver (transmitter), the resistor must have the right value. The
value for the series termination resistor has to be set so that the sum of it and the output impedance of thedriver equals the impedance of the trace. As an equation, we get the following:

R S = Z 0 − Z OUT , whereby ZOUT is the output impedance of the transmitter
The read command is more critical than a write command. Thus, place the resistor of the data line as close
as possible to the SDRAM data pin.
Parallel Termination

The alternative is to use a parallel termination (Figure 17). As mentioned earlier, this is not necessary forstandard SDRAM when you follow the design guidelines at the end of this chapter.

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aFigure 17. Using parallel termination

Reflection coefficent ρ =ZL − Z0
ZL + Z0

To keep the reflection as low as possible, the parallel termination resistor (ZL) should be equivalent to Z0.
Consider whether you even need termination. An additional resistor emits further EMI.
Note that for ADSP-BF51x and ADSP-BF52x processors termination is mandatory.
Consult the datasheet for more details.

4.3 Design Guidelines for the SDRAM Connection

With regard to EMC and signal integrity, the following design guidelines are recommended. When you
start your SDRAM PCB layout, do not treat all signals the same, consider the importance of each signal
and place the traces of the most critical signals first. The following succession is suggested:
1. Clock distribution
2. Data lines and DQM lines, command lines including SA10
3. Address lines
4. Other signals (e.g., CKE)
4.3.1 Component Placement Considerations

Consider the following points while laying out your PCB:

Place the SDRAM chips close to the Blackfin processor.

Keep the traces as short as possible.

When you are distributing a signal, all traces should have the same path length (Figure 18) to thedevices (if possible). Avoid loops like the one shown in Figure 19.

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a
S
D
R
A
M

S
D
R
A
M

Figure 19. Wrong: traces that loop around4.3.2 Using the Rounding Function of Your Layout Tool at Trace Edges

Figure 20 shows a PCB trace edge that does not use rounding. Figure 21 shows the same trace edge when
the rounding feature is enabled.

Figure 20. Wrong: Trace edges lack rounding

Figure 21. Right: Trace edges are rounded
4.3.3 Placing the VCC and GND Planes with as Little Distance as Possible

Figure 22 shows a 4-layer PCB, which does not insulate the critical signals. Figure 23 shows proper
insulation of a 4-layer PCB..
critical signals
other signals
VCC

GND

Figure 22. Wrong: VCC and GND planes are too far apartother signals
VCC
GND
critical signals
Bold layer
As thin as possible

Figure 23. Right: VCC and GND planes are close together

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a4.3.4 Insulating Critical Signals by Placing Them in the Inner Layers

Figure 24 shows a 6-layer PCB, in which critical signals are not insulated. Figure 25 shows proper
insulation.

Figure 24. Wrong: critical signals not properly insulated

Figure 25. Right: minimize the distance between critical signals and the ground plane
4.3.5 Placing the Series Resistor Close to the SDRAM

Figure 26 shows a signal path that with too many vias; the series resistor is too far from the SDRAM.
Figure 27 shows a short signal path without vias and a series resistor that is next to the SDRAM.

Figure 26. Wrong: too many vias in critical signal path and series resistor is too far away

Figure 27. Right: the series resistor is close to the SDRAM
4.3.6 Avoiding Trenches in the GND Plane

Figure 28 shows a GND plane with a trench. The GND plane in Figure 29 avoids having a trench.

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aFigure 28. Wrong: ground plane with a trench

Figure 29. Right: ground plane without a trench
4.3.7 Minimizing Back-Current Paths from Vias

If you are not able to avoid a direction change in a via from one layer to another, try to minimize the wayof the back current. Figure 30 shows a signal path that runs in two directions from the via. The directionchange in Figure 31 is better.

Figure 30. Wrong: layer-to-layer direction change

Figure 31. Right: avoiding a direction changeBlackfin® Processor and SDRAM Technology (EE-326)

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a4.3.8 Make use of the drive strength control functionality

To reduce electromagnetic emissions, lower the drive strength of the EBIU pins. But keep an eye on thesignals: We have to ensure that we supply enough current to load the capacity of lines and pins within thetiming specifications. 00b within the bit fields indicates low drive strength (see data sheet), 01b indicateshigh drive strength.

Figure 32. The Drive Strength control register of the BF52x
4.3.9 Make use of the slew control functionality

A smoother transition also helps reducing electromagnetic emissions. Verify again whether you staywithin the timing specifications after changing it to slower slew rate. 00b indicates a faster slew rate, 01b
a slower slew rate.

Figure 33. The Slew Rate register of the BF52x

5 Using a Blackfin Processor with Less than 16 MB of SDRAM
Using less than 16 MBs (128 Mbits) of SDRAM is especially important for low-power applications. Thissection provides guidance for applications that use less than 16 MBs.

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a
5.1 System Settings

On the hardware side, there are no special settings. Just connect the address lines as described in SDRAM
Hardware Design.
The first step in using less than 16 MB is setting the SDRAM external bank size bits of the EBIU_SDBCTL(SDRAM memory bank control) register to 16 Mbytes. This configures the Blackfin processor's internal
address to expect 16 Mbytes, and the address space will be fragmented as shown in Figure 34.

Figure 34. Address space

The “aliased” address space’s content is a copy of the according bank, and every write access to this spaceresults in a write access into the “real” bank. This must be considered by the Linker Description File(.LDF), or the Blackfin processor will place instructions and data into addresses that do not exist.
This type of address failure cannot be detected by the Blackfin processor. There is nofunctionality that tests whether an address is valid. This will cause failures later in yourapplication when the core is tries to read from a non-existent address space, getting dummy
values, and then interprets this as valid instruction code or data.
5.2 Changing the .LDF FileFirst, ensure that the .LDF file will not be changed by the Expert Linker wizard. Therefore, open the
Project Options dialog box (Project -> Project Options) to the Remove Startup Code/LDF pageand select the Leave the files in the project, but stop regenerating them option (Figure 35).

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aFigure 35. Ensuring that the .LDF file will not be changed

Doing so allows you to change the .LDF file manually.
For example, if we use a 64-Mbit SDRAM (8 MB), the address space in the Linker Description File has:
MEM_SDRAM0_BANK0 { TYPE(RAM) START(0x00000000) END(0x001FFFFF) WIDTH(8) }MEM_SDRAM0_BANK1 { TYPE(RAM) START(0x00400000) END(0x005FFFFF) WIDTH(8) }MEM_SDRAM0_BANK2 { TYPE(RAM) START(0x00800000) END(0x009FFFFF) WIDTH(8) }MEM_SDRAM0_BANK3 { TYPE(RAM) START(0x00C00000) END(0x00DFFFFF) WIDTH(8) }Figure 36. Ensuring that the .LDF file will not be changed

As shown in Figure 36, there are gaps of 2 MB in our address space.
5.2.1 Excursus: BackgroundThe .LDF file specifies where code and data are placed in memory space. The EBIU settings configure theSDRAM controller of the Blackfin processor and specify size, timing, and features of the SDRAM. Since
the EBIU settings cannot set to that of an 8 MB SDRAM, we have to set the SDRAM size to 16 MB.
What does this mean to the addressing? We are using an SDRAM with a column address width (CAW) of
10 bits, which means we can address 2^10 = 1024 columns. With each column and row address, we are
addressing 2 bytes (for x16 SDRAM). Now, we have set the RAM to 16 MBs (=16777216 bytes), whichmeans we have a row address width of 13 (memory size / (data width * 2^addresses) = 16777216/(2 bytes* 2^10)= 8192= 2^13), but we are using only a 8 MB RAM, which has a row address width of 12. But thecontroller has calculated a row address width of 13. The row address and the column address are sent to
the SDRAM time multiplexed. Looking at your SDRAM, you see 12 address lines and 2 bank addresslines. But the controller has calculated 13 and is using 13. Since the 13th address line is not connected, youwill address the same physical address independent of the state of bit 13 of the row address. This is why
the memory space is mirrored.
For example, row address 0x1000 will access the same data as row address 0x0000. It is critical when you
place something into aliased memory space, because you overwrite something in the other address space.

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aTherefore, we define the .LDF file that way, so we will not place anything into the mirrored RAM:
MEM_SDRAM0_BANK0 { TYPE(RAM) START(0x00000000) END(0x001FFFFF) WIDTH(8) }MEM_SDRAM0_BANK1 { TYPE(RAM) START(0x00400000) END(0x005FFFFF) WIDTH(8) }MEM_SDRAM0_BANK2 { TYPE(RAM) START(0x00800000) END(0x009FFFFF) WIDTH(8) }MEM_SDRAM0_BANK3 { TYPE(RAM) START(0x00C00000) END(0x00DFFFFF) WIDTH(8) }5.3 SDRAMs with 2 Banks

Several SDRAMs have only two banks. The hardware connection has to be like Figure 37.
Addr[1]

BlackfinAddr[18]Addr[19]

A0

SDRAM
BA

Figure 37. Hardware connection for SDRAM with two banks
BA is the bank selection pin of the SDRAM. It must be connected with the Addr[18] of the Blackfin

processor. Leave Addr[19] floating. Connect the other addresses as described in SDRAM Hardware
Design. Set the EBIU_SDBCTL (SDRAM memory bank control) register to 16 Mbytes. The logical address
space will be fragmented as shown in Figure 38.

Figure 38. Fragmented logical address space

So we have to use adjust the .LDF file again to set up the memory space. Proceed as described above.
Figure 39 shows an example memory space for a 16-Mbit (2 MB) SDRAM.
MEM_SDRAM0_BANK0 { TYPE(RAM) START(0x00000000) END(0x000FFFFF) WIDTH(8) }MEM_SDRAM0_BANK1 { TYPE(RAM) START(0x00400000) END(0x004FFFFF) WIDTH(8) }Figure 39. Example: Memory space for a 16-Mbit (2-MB) SDRAM

As shown, there is a 3-MB gap in our address space.

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a
6 Increasing the SDRAM Performance of Your System
In many applications, execution time is one of the key factors. The placement of data and instructions canhave a significant impact to the processing speed of your application. This section presents an overview ofthe possible ways of increasing SDRAM performance. For a system approach, refer to System
Optimization Techniques for Blackfin Processors (EE-324)[2].
6.1 Optimal Multi-Bank Accesses

It is time-consuming to open a page via the activate command or close a page via the precharge command.
Thus, reducing page changeovers results in better SDRAM performance.
A case that applies to many applications is coping data from one array to another via memory DMA. The
problem occurs when both arrays are on the same internal bank. If this happens within a page, it will not
be a problem, but if the dimension of the two arrays exceeds the page size, the DMA will access at least
two pages.
Figure 40 shows how the DMA works within a bank (single bank access).

Figure 40. Accesses to one memory bank

The data is placed on different pages on the same bank. An activate and precharge must be executed after
each switch between source and destination DMA. Additionally, we need to take into account that thecore (or the cache) is may access the bank as well. There is a delay every time between the reads and thewrites. This delay can be enlarged by the internal DMA architecture: The DMA is designed as a feedback
control state machine, which introduces additional wait states under special circumstances.
To avoid such a time-consuming case, organize the memory in a way that allows inter-bank DMA copies.
Figure 41 shows such an approach.

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aFigure 41. Multi-banking approach via DMA and core

The core gets its code from bank 0, and the MDMA transfer runs from bank 3 to bank 2. Figure 42 shows
the sequence of the data transfer between two banks. As shown, the number of precharge commands andactivate commands decreases significantly. As discussed earlier, because precharge and activatecommands are time-intensive procedures, this technique saves a lot of time.

Figure 42. Intelligent bank accesses

6.2 Optimal Pages Accesses

This section describes how to improve page accesses. If you are able to keep accesses within a page, now
further activate and precharge commands are necessary (besides those that are issued to do the refresh).
The following description shows how to access pages separately.
Open the Remove Startup Code/LDF page of the Project Options dialog box (Project -> Project
Options) and select the Leave the files in the project, but stop regenerating them option.
Also, select the Remove the generated LDF check box. Be sure to confirm the selections by clicking the
OK button.

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aFigure 43. Project Options dialog box settings

Now we are able to change the Linker Description File (.LDF).
Pages for the ADSP-BF53x Processors

ADSP-BF53x processors have a 16-bit memory interface. The address mapping scheme is defined in
Figure 44.

Figure 44. ADSP-BF53x memory mapping scheme

There are different page sizes, depending on the SDRAM being used. Table 2 shows 16-bit EBIU page
size with regard to the EBCAW bits.
EBCAW

Page bytes in Hex

8 bits0x200

9 bits0x400

10 bits

0x800

11 bits

0x1000

Table 2. Page sizes for 16-bit EBIU

Consider a column address width of 10 bits. Every page has 0x800 bytes, and we are able to define ourmemory mapping in the .LDF file (Listing 9).

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a
MEMORY{...
/* We define 10 pages in bank 0 of a 10-bit memory of a BF53x
SDRAM_BANK_0_PAGE_0
SDRAM_BANK_0_PAGE_1
SDRAM_BANK_0_PAGE_2
SDRAM_BANK_0_PAGE_3
SDRAM_BANK_0_PAGE_4
SDRAM_BANK_0_PAGE_5
SDRAM_BANK_0_PAGE_6
SDRAM_BANK_0_PAGE_7
SDRAM_BANK_0_PAGE_8
SDRAM_BANK_0_PAGE_9{ TYPE(RAM) START(0x00000000) END(0x000007FF) WIDTH(8) }{ TYPE(RAM) START(0x00000800) END(0x00000FFF) WIDTH(8) }{ TYPE(RAM) START(0x00001000) END(0x000017FF) WIDTH(8) }{ TYPE(RAM) START(0x00001800) END(0x00001FFF) WIDTH(8) }{ TYPE(RAM) START(0x00002000) END(0x000027FF) WIDTH(8) }{ TYPE(RAM) START(0x00002800) END(0x00002FFF) WIDTH(8) }{ TYPE(RAM) START(0x00003000) END(0x000037FF) WIDTH(8) }{ TYPE(RAM) START(0x00003800) END(0x00003FFF) WIDTH(8) }{ TYPE(RAM) START(0x00004000) END(0x000047FF) WIDTH(8) }{ TYPE(RAM) START(0x00004800) END(0x00004FFF) WIDTH(8) }//if we would define a section for each page we have to define 8192...
//so we define sections only for the amount of pages which are performance//relevant
SDRAM_BANK_0_OTHER{ TYPE(RAM) START(0x00005000) END(0x00FFFFFF) WIDTH(8) }/* the pages on the second bank… */SDRAM_BANK_1_PAGE_0{ TYPE(RAM) START(0x01000000) END(0x010007FF) WIDTH(8) }SDRAM_BANK_1_PAGE_1{ TYPE(RAM) START(0x01000800) END(0x01000FFF) WIDTH(8) }SDRAM_BANK_1_PAGE_2{ TYPE(RAM) START(0x01001000) END(0x010017FF) WIDTH(8) }SDRAM_BANK_1_PAGE_3{ TYPE(RAM) START(0x01001800) END(0x01001FFF) WIDTH(8) }SDRAM_BANK_1_PAGE_4{ TYPE(RAM) START(0x01002000) END(0x010027FF) WIDTH(8) }SDRAM_BANK_1_PAGE_5{ TYPE(RAM) START(0x01002800) END(0x01002FFF) WIDTH(8) }SDRAM_BANK_1_PAGE_6{ TYPE(RAM) START(0x01003000) END(0x010037FF) WIDTH(8) }...
}PROCESSOR p0{
SECTIONS{...
sdram0_page_0{
INPUT_SECTION_ALIGN(4)INPUT_SECTIONS($OBJECTS(sdram0page0) )} > SDRAM_BANK_0_PAGE_0...
}}

Listing 9. Splitting memory into pages
Pages for ADSP-BF561 Processors

ADSP-BF561 processors have a 32-bit memory interface. When using the 16-bit interface, addressing is
the same as for ADSP-BF53x processors. The 32-bit address mapping scheme of the ADSP-BF561
processor is defined in Figure 45.

Figure 45. ADSP-BF561 memory mapping scheme

Table 3 shows page size for 32-bit EBIU with regard to the EBCAW bits.

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a
EBCAW

Page bytes in Hex

8 bits0x400

9 bits0x800

10 bits

0x1000

11 bits

0x2000

Table 3. Page sizes for 32-bit EBIU

What’s the advantage of accessing the pages separately? If we can ensure that we stay within a page, noadditional precharge and activate commands are needed, saving time.
Figure 46 shows a peripheral DMA approach to avoid page switches. The DMA writes the incoming data
to pages to different banks.

Figure 46. Open page DMA approach

6.3 SDRAM Performance Items for Core Accesses

Core accesses are the most performance-critical SDRAM accesses. So, if you do not use data cache forany reason, you must have a strategy to organize accesses to the SDRAM. This section describes thereason for this bottleneck and how to handle it.
Buffers are used to handle the data transfer between the system clock domain and the core clock domain.
These buffers are organized as a state machine, which enables you to change the core and system clock
without concern for internal processes. Depended on the core/system clock ratio, wait states are
introduced to organize reads and writes by the core to and from the system domain.
One approach to solving this problem is to work with DMA transfers. Therefore, we are using DMA totransfer data that we want to process into internal memory. DMA has an internal FIFO buffer structure
and can read from SDRAM without additional time penalties. Software planning and design is essential,
especially when working with very large (size of the array >> internal data memory) multi-dimensional
arrays. In this case, your algorithm must access this array in different manners. You can use DMA toorder the array optimally for your algorithm.

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a6.3.1 Code Overlays

A disadvantage of using cache is that the cache expects a program flow that may not fit to your program;thus, it results often in cache misses. Another approach is to load the necessary code into internal memory
by DMA transfer; the code will be organized by an intelligent overlay manager that can predict which
piece of code is needed next. Whether there are any performance improvements by using an overlay
manager depends very much on your system design and on program flow. For most applications, an
optimization of the cache will be a better and easier approach to improve system performance. The firstchallenge is to identify the modules of your program that are relatively independent and do not need tocall each other directly. Separate the overlays from the program, and place their machine code in thelarger memory. Develop an overlay manager that organizes intelligent DMA transfers of the overlays
from the SDRAM to the internal memory.
6.4 SDRAM Performance Items When Using Cache
Code

Optimizing memory for cache access means reducing cache misses. We have to organize the code anddata in a way that minimizes cache misses. When optimizing the code for cache accesses, keep the codestraight as possible and declare functions that are not often used in the program code as inline. This keeps
the code compact and minimizes the number of cache misses. Functions that are often called should beplaced into internal memory, if possible.
Data

Look at the algorithm and try to find a way to perform sequential data accesses. An example for a Fast
Fourier Transformation (FFT) that accesses the data sequentially is shown in Writing Efficient FloatingPoint FFTs for ADSP-TS201 TigerSHARC® Processors (EE-218)[8]. In C, a multi-dimensional array has
the following order in memory (here a 3-D array):

A 0,0,0 , A 0,0,1 , A 0,0,2 , A 0,1,0 , A 0,1,1 , A 0,1,2 , A 0,2,0 , A 0,2,1 , A 0,2,´2 , A1,0,0 , A1,0,1 , A1,0,2 , A1,1,0 , A1,1,1 , A1,1,2 ,A 1,2,0 , A 1,2,1 , A 1,2,´2 , A 2,0,0 , A 2,0,1 , A 2,0,2 , A 2,1,0 , A 2,1,1 , A 2,1,2 , A 2,2,0 , A 2,2,1 , A 2,2,´2
Listing 10 shows the code to fill an array by the sequential access.
for (i=0;i<3; i++){for (j=0;j<3; j++){for (k=0;k<3; k++){ MyArray[i][j][k] = getValue();}}};
Listing 10. Accessing an array optimal

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a
7 Optimizing Power Consumption
Blackfin processors are used often in portable applications or low-power applications. In suchapplications, it is essential to drive the power consumption as low as possible. The SDRAM boosts power
consumption by a high percentage. Therefore, the right choice, use of, and configuration of SDRAM are
fundamental to low-power design. This section provides an overview of ways to minimize power
consumption.
7.1 Introduction: Power-Consumption Figures

Although various standard symbols (Table 4) are used by device manufacturers to define power
consumption, the procedures used to measure these figures vary. Thus, there are differences ininterpreting these values.
SymbolMeaning

I CC1

Operating current in active mode

I CC2Precharge standby current

I CC3

No operating/ standby current

I CC4

Operating current in burst mode / all banks
activated

I CC5

Auto-refresh current

I CC6

Self-refresh current

Table 4. Power consumption measurement symbols

7.2 Tips for Lowering SDRAM Power Consumption

Following are tips toward lowering SDRAM power consumption.
Use as less SDRAM as possible.

Use 1.8V or 2.5V mobile SDRAM (this is not possible for all Blackfin processors, see Brief
Introduction to SDRAM).



Lower the refresh rate in a low-temperature environment. The refresh rate of 64 ms is specified for the
worst-case scenario – high temperature. Thus, you still have room left to lower it when you areoperating in a standard environment.



Try to do data transfers between memory banks (not within memory banks).

Enable the self-refresh bit (SRFS) in the EBIU_SDGCTL register. In this mode, the power dissipation of
the SDRAM is at the lowest point.

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a7.3 Mobile SDRAM

Use mobile SDRAM or low-power SDRAM for embedded applications with high power-consumption
requirements. In these applications, the SDRAM is used very infrequently; thus, most of the time it is in
the idle state. Mobile SDRAM offers special modes that reduce the power consumption when the
SDRAM is in idle mode. Features that are supported by Blackfin processors are temperature-compensatedself-refresh (TCSR) and partial-array self-refresh. The temperature-compensated self-refresh featureallows you to reduce the self-refresh frequency while it is in the idle state at temperatures below 45°C.
The leakage of the memory cells is very temperature dependent; when the temperature is high, the leakage
is higher than when the temperature is low. The self-refresh rate for standard SDRAM is set to a worstcase value for the highest temperature, and the SDRAM is specified. At the Blackfin processor, you can
set the temperature via the TCSR bit of the EBIU_SDGCTL register. The value of TCSR indicates thetemperature border (for example, 45°C means you are operating below 45°C).
Many applications use most of the SDRAM devices only to buffer data arrays, which occurs after theprocessing. For these applications, the partial-array self-refresh feature is a good approach to saving
power. This feature enables your application to select the memory banks that are to be refreshed duringidle mode. If you have any code on the SDRAM, place it at SDRAM bank 0 and bank 1; otherwise, it will
be lost.
For this application, use a low-voltage (1.8V or 2.5V) Blackfin processor.
7.4 Going into Hibernate and Recover

ADSP-BF537, ADSP-BF54x, and ADSP-BF52x processors preserve SDRAM content while the processor
is sent to hibernate mode. Therefore, the CKELOW bit in the VR_CTL register must be set to 1 to maintain the
CKE signal low during hibernate, which will prevent the SDRAM from losing data. The content of internal
memory and all registers (except the VR_CTL register) will be lost. Therefore, the program has to write all
the register settings and the internal memory content to SDRAM.
The following steps are used to go into hibernate mode and recover the data.
Step 1

Save all important registers to the SDRAM.
Save the important data of your internal memory to the SDRAM.
Ensure that the CKELOW bit is set in the VR_CTL register and the self-refresh bit in the SDGCTL register.
Send the processor into hibernate mode (Figure 47 and Listing 11).

Figure 47. Going into Hibernate mode

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aSaveTheMemory();
SaveTheRegister();//Let's setup the RTC to wake up
SetupRTC();
IntMask = cli();*pVR_CTL = (WAKE| //wake by
CKELOW | //keeps the content of the SDRAM
CANWE| //ensures that the CAN RX can wake up the BF(*pVR_CTL & ~FREQ)); // Send to hibernate
Listing 11. Going into Hibernate mode
Step 2The processor is in hibernate mode (Figure 48). The content of all registers except VR_CTL are lost. The
data is stored in SDRAM.

Figure 48. Hibernate mode
Step 3After waking up the processor from hibernate mode (Figure 49), the processor boots in the initialization
file. By checking the CKELOW bit, the processor determines whether it is coming from hibernate or fromreset. When the Blackfin processor is coming from reset, the processor continues the boot process;otherwise, it calls a routine to restore the internal memory and the registers and then jumps to the
execution code.

Figure 49. Recovering from hibernate mode

7.5 Structuring Data for Low Power Consumption

Not only are the precharge and activate operations time consuming, they also have a massive impact on
power consumption. Therefore, keep the number of these operations as low as possible.
A precharge operation during the application will be executed at page breaks and SDRAM refreshes.
Therefore, organize the data in a way that keeps the number of page breaks as low as possible. Refer toIncreasing the SDRAM Performance of Your System for examples.

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aAppendices
Appendix A: Glossary

access time

The time from the start of one device access to the time when the next
access can be started.

array

Memory area for data storage. The array consists of rows and columns,
where each memory cell is located at an address where an intersection
occurs. Each bit in memory is found by its row and column coordinates

asynchronous

A process where operations proceed independently.

auto precharge

An SDRAM function that closes a page at the end of a burst operation.

auto refresh

A mode where an internal oscillator establishes the refresh rate, and aninternal counter keeps track of the address to be refreshed.

bank

A bank can mean the number of physical banks (same as rows) on the
SDRAM module. It can also mean the number of internal logical banks(usually 4 banks nowadays) within an individual SDRAM device.

burst mode

Bursting is a rapid transfer of data to a series of memory cell locations.

bypass capacitor

A capacitor with the primary function of stabilizing a power supply voltage,
especially for an adjacent device or circuit

bus cycle

A single transaction between a memory device and the system domain of
the Blackfin processor.

CAS

Column address strobe. A control signal that latches a column address into
the SDRAM control register.

CAS-before-RAS (CBR)

Column address strobe before row address strobe. CBR is a fast refresh
function that keeps track of the next row to be refreshed.

columnPart of the memory array. A bit is stored where a row and column intersect.

crosstalkA signal induced in one wire or trace by current in another wire or trace

DDR

Double data rate. The data is transferred on the rising and falling edge of theclock. Since the address lines keep the same, data of sequential addresses
are transferred.

DQM

Data mask signal used for masking during a write cycle. There is one DQM
signal per eight I/Os.

DRAM

Dynamic Random Access Memory. A type of memory device usually used
for mass storage in computer systems. The term dynamic refers to theconstant refresh the memory must have to retain data.

EBIU

External Bus Interface Unit. It provides mainly the synchronous external
memory interface to SDRAM which is compliant to the PC100 and PC133
standard and an asynchronous interface to SRAM, ROM, FIFO, flash
memory, and FPGA/ASIC designs.

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a
EMC

Compliance to rules and regulations controlling EMI

EMI

Interference caused by electromagnetic radiation

external buffer

An external buffer is needed to drive the SDRAM command, clock, clock
enable, and address pins, if they have a higher load than 50 pF. The
resulting capacitance is the number of input pins multiplied by thecapacitance of a SDRAM input pin (an input pin of the SDRAM has around
4.5 pF [consult your SDRAM data sheet]) plus the capacitance of the PCB
track.

FBBRWFast back-to-back read-to-write. In the standard application, the write
command is delayed by one clock cycle after a read command is processed.
Fast-back-to-back-read-to-write enables to write directly after the readcommand processing without the 1-cycle delay. Due to the fact that yourdata bus has to switch quickly between the read and write data, this feature
is very dependent on the capacity of your data bus. This includes thenumber of SDRAM chips and the design of the data bus circuit paths.

FPM

Fast page mode. A common SDRAM data access scheme.

hibernate

A special power mode of the Blackfin processor that provided the lowest
power dissipation. The I/O supply keeps established while the core is
powered down. The Blackfin processor can be awoken by several external
events.

interleaving

The process of read/writing data alternately from two or more pages in the
SDRAM.

JEDEC

Joint Electron Device Engineering Council

latency

The length of time, usually expressed in clock cycles, from a request to reada memory location and when the data is actually ready.

memory cycle time

The time it takes for a complete memory operation (such as a read or write)
to take place.

microstrip

A trace configuration where there is a reference plane on only one side of asignal trace

OTP Memory

One-Time-Programmable Memory. On-chip memory, which can be used(among other things) to store setup values and keys for the Blackfin security
scheme.

page

The number of bytes that can be accessed with one row address.

page mode

An operation that takes place when RAS is taken logic low and a column
address is strobed in. The SDRAM remembers the last row address andstays on that row and moves to the new column address.

PCB

Printed circuit board

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a
RAS

Row address strobe. The control signal that latches the row address into the
SDRAM. It is used in conjunction with the column address to select anindividual memory location.

RAS to CAS delay

The time between a row access strobe and a column address strobe.

read time

The time required for data to appear at the output once the row and column
address become valid. Read time is also referred to as access time.

refreshA periodic restoration of an SDRAM cell charge needed to maintain data.

refresh cycle

The time period in which one row of an SDRAM is refreshedrefresh period

The minimum time that each row in the SDRAM must be refreshedrowPart of the memory array. A bit is stored where a row and column intersect.

SDR

Single data rate. The data is transferred only once at one clock cycle. Thisdefinition was introduced to differentiate this SDRAM from DDR.

SDRAM self-refresh

In normal operating mode, the Blackfin processor will control the refresh of
the data cells by sending an auto-refresh command. But if the application
has a need to give up control over the SDRAM )for example, when theprocessor is going into hibernate mode or in a multiprocessor application),
the SDRAM has to take over the responsibility of its data consistency.
Another case to send the SDRAM in self-refresh is reducing power
consumption. When the Blackfin processor is sending a self-refreshcommand, the SDRAM will clock itself and will do self-refresh cycles. The
disadvantage is the delay when you want to access a SDRAM in selfrefresh.

strobeAn input control signal that latches data synchronously into the SDRAM

stripline

A circuit board configuration in which a signal trace is placed between two
reference planes

synchronous memory

A memory device that has its signals synchronized to a reference clock.

termination

One or more components used in conjunction with a transmission line tocontrol signal reflections

write time

The time from which data is latched into the SDRAM until it is actuallystored in a memory location.

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aAppendix B: Code Examples, Schematics, and Excursus
Initialization Code (Chapter 2)

Listing 12 shows an example of initialization in assembly language.
//SDRAM Refresh Rate Setting
P0.H = hi(EBIU_SDRRC);
P0.L = lo(EBIU_SDRRC);
R0 = 0x406 (z);w[P0] = R0;//SDRAM Memory Bank Control Register
P0.H = hi(EBIU_SDBCTL);
P0.L = lo(EBIU_SDBCTL);
R0 =EBCAW_9| //Page size 512
EBSZ_64| //64 MB of SDRAM
EBE;//SDRAM enable
w[P0] = R0;//SDRAM Memory Global Control Register
P0.H = hi(EBIU_SDGCTL);
P0.L = lo(EBIU_SDGCTL);
R0.H=
hi(
~CDDBG& // Control disable during bus grant off~FBBRW& // Fast back to back read to write off~EBUFE& // External buffering enabled off~SRFS& // Self-refresh setting off~PSM& // Powerup sequence mode (PSM) first~PUPSD& // Powerup start delay (PUPSD) off
TCSR| // Temperature compensated self-refresh at 85
EMREN| // Extended mode register enabled on
PSS| // Powerup sequence start enable (PSSE) on
TWR_2| // Write to precharge delay TWR = 2 (14-15 ns)
TRCD_3| // RAS to CAS delay TRCD =3 (15-20ns)
TRP_3| // Bank precharge delay TRP = 2 (15-20ns)
TRAS_6| // Bank activate command delay TRAS = 4
PASR_B0| // Partial array self refresh Only SDRAM Bank0
CL_3| // CAS latency
SCTLE); // SDRAM clock enable
R0.L=

lo(

~CDDBG~FBBRW~EBUFE~SRFS~PSM~PUPSD
TCSR
EMREN
PSS
TWR_2
TRCD_3
TRP_3
TRAS_6
PASR_B0
CL_3
SCTLE& // Control disable during bus grant off& // Fast back to back read to write off& // External buffering enabled off& // Self-refresh setting off& // Powerup sequence mode (PSM) first& // Powerup start delay (PUPSD) off| // Temperature compensated self-refresh at 85| // Extended mode register enabled on| // Powerup sequence start enable (PSSE) on| // Write to precharge delay TWR = 2 (14-15 ns)| // RAS to CAS delay TRCD =3 (15-20ns)| // Bank precharge delay TRP = 2 (15-20ns)| // Bank activate command delay TRAS = 4| // Partial array self refresh Only SDRAM Bank0| // CAS latency) ; // SDRAM clock enable[P0] = R0;
Listing 12. Initialization code example in assembly language

Blackfin® Processor and SDRAM Technology (EE-326)

Page 47 of 56

U1A

J14
K14
L14
J13
K13
L13
K12
L12
M12
M13
M14
N14
N13
N12
M11
N11
P13
P12
P11

Blackfin® Processor and SDRAM Technology (EE-326)

B14

B13
E12
D13
C14
D12
C13

D14
N10
P10

CLKOUT_SCLK

SCKE
SA10
SRAS
SCAS
SWE
SMS

BR
BGH
BG

ADSP-BF537

G12
F13
F14
E14
G13
G14
H14
E13

AMS3
AMS2
AMS1
AMS0
AOE
ARE
AWE
ARDY

D15
D14
D13
D12
D11
D10
D09
D08
D07
D06
D05
D04
D03
D02
D01
D00

P4
P5
N5
M5
P6
N6
M6
P7
N7
M7
P8
N8
M8
P9
N9
M9

ABE0 H12
H13
ABE1

A01
A02
A03
A04
A05
A06
A07
A08
A09
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19

VDD
R17
10k

VDD

VDD

CLK
CAS
CKE
DQML
DQMH
RAS
WE
CS
VDD
VDD
VDD
VDDQ
VDDQ
VDDQ
VDDQ
VSSQ
VSSQ
VSSQ
VSSQ

38
17
37
15
39
18
16
19
1
14
27
3
9
43
49
6
12
46
52

DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15

2
4
5
7
8
10
11
13
42
44
45
47
48
50
51
53

MT48LC16M16/TSOP54

A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
BA0
BA1

U2
23
24
25
26
29
30
31
32
33
34
22
35
36
20
21

R10
TBD

R9
TBD

Date:

Size
A

Title

R2
TBD

R1
TBD
R12
TBD

R4
TBD
R13
TBD

R5
TBD
R14
TBD

R6
TBD

Wednesday , September 13, 2006 Sheet

Document Number<Doc>Interf ace the Blackf in to SDRAM

R11
TBD

R3
TBD

1

R15
TBD

R7
TBD

of

1

Rev
1.0

R16
TBD

R8
TBD

a

Schematics to Interface SDRAM to the Blackfin Processor (Chapter 4)

The next few pages show implementation examples. These schematics are given to illustrate the rightconnection between SDRAM and the Blackfin processor (rather than as an approach to signal integrity).

Page 48 of 56

a
ADSP-BF561 in 16-Bit Mode
52
46
12
6
49
43
9
3
27
14
1

VDD

U13A
A25
A24
A23
A22
A21
A20
A19
A18
A17
A16
A15
A14
A13
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
ABE3SDQM3
ABE2SDQM2
ABE1SDQM1
ABE0SDQM0
D31
D30
D29
D28
D27
D26
D25
D24
D23
D22
D21
D20
D19
D18
D17
D16
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
AMS3
AMS2
AMS1
AMS0
AOE
ARE
AWE
ARDY
SCLK0_CLKOUTSCLK1_CLKOUT
SCKE
SA10
SRAS
SCAS
SWE
SMS3
SMS2
SMS1
SMS0
BR
BG
BGH

VDD
C3
A2
D4
B2
F5
A3
C4
B3
F6
B4
E5
A5
E6
B5
C6
A6
D7
F11
C14
B14
G10
B15
G11
D13

SWE
SRAS
ABE1SDQM1
ABE0SDQM0
SCKE
SCAS

38
21
20
36
35
22
34
33
32
31
30
29
26
25
24
23

A13
A12
SA10
A10
A9
A8
A7
A6
A5
A4
A3
A2
ABE3SDQM3

A15
A14
B13
E11

MT48LC16M16/TSOP54

CS
WE
RAS
DQMH
DQML
CKE
CAS
CLK
BA1
BA0
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0

DQ15
DQ14
DQ13
DQ12
DQ11
DQ10
DQ9
DQ8
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0

53
51
50
48
47
45
44
42
13
11
10
8
7
5
4
2

D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0

U5

M15
J12
L16
K12
L15
K13
K15
K14
J16
J13
J15
H14
H16
H13
H15
H12

MT48LC16M16/TSOP54

VDD
G12
G13
G15
F14
F16
F12
F15
F13
E15
D16
D15
E14
C16
E12
C15
B16

VDD

52
46
12
6
49
43
9
3
27
14
1
19
SWE
16
SRAS 18
ABE1SDQM139
ABE0SDQM015
SCKE 37
SCAS 17
38
21
20
A13
36
A12
35
SA10
22
A10
34
A9
33
A8
32
A7
31
A6
30
A5
29
A4
26
A3
25
A2
24
ABE3SDQM3 23

A7
E7
B7
C8
C7
B8
A8
D9
A11
A12
B10
D11
C10
D10
E10
A10
C9
B9
E9
B12
A13
C12

19
16
18
39
15
37
17

VSSQ
VSSQ
VSSQ
VSSQ
VDDQ
VDDQ
VDDQ
VDDQ
VDD
VDD
VDD

VSSQ
VSSQ
VSSQ
VSSQ
VDDQ
VDDQ
VDDQ
VDDQ
VDD
VDD
VDD
CS
WE
RAS
DQMH
DQML
CKE
CAS
CLK
BA1
BA0
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0

DQ15
DQ14
DQ13
DQ12
DQ11
DQ10
DQ9
DQ8
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0

53
51
50
48
47
45
44
42
13
11
10
8
7
5
4
2

D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0

U14

R37

VDD

10k
ADSP-BF561_BGABlackfin® Processor and SDRAM Technology (EE-326)

Page 49 of 56

a
ADSP-BF561 in 32-Bit Mode
52
46
12
6
49
43
9
3
27
14
1

VDD

U15A
A25
A24
A23
A22
A21
A20
A19
A18
A17
A16
A15
A14
A13
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
ABE3SDQM3
ABE2SDQM2
ABE1SDQM1
ABE0SDQM0
D31
D30
D29
D28
D27
D26
D25
D24
D23
D22
D21
D20
D19
D18
D17
D16
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
AMS3
AMS2
AMS1
AMS0
AOE
ARE
AWE
ARDY
SCLK0_CLKOUTSCLK1_CLKOUT
SCKE
SA10
SRAS
SCAS
SWE
SMS3
SMS2
SMS1
SMS0
BR
BG
BGH

VDD
C3
A2
D4
B2
F5
A3
C4
B3
F6
B4
E5
A5
E6
B5
C6
A6
D7
F11
C14
B14
G10
B15
G11
D13

SWE
SRAS
ABE1SDQM3
ABE0SDQM2
SCKE
SCAS

19
16
18
39
15
37
17

To Blackfin
To SDRAM

38

A14
A13
SA10
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2

A15
A14
B13
E11

21
20
36
35
22
34
33
32
31
30
29
26
25
24
23

To Blackfin

CLK
BA1
BA0
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0

DQ15
DQ14
DQ13
DQ12
DQ11
DQ10
DQ9
DQ8
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0

53
51
50
48
47
45
44
42
13
11
10
8
7
5
4
2

D31
D30
D29
D28
D27
D26
D25
D24
D23
D22
D21
D20
D19
D18
D17
D16

MT48LC16M16/TSOP54
52
46
12
6
49
43
9
3
27
14
1

VDD
To SDRAM 1

VDD

SWE
SRAS
ABE1SDQM1
ABE0SDQM0
SCKE
SCAS

19
16
18
39
15
37
17

To Blackfin
38

A7
E7
B7
C8
C7
B8
A8
D9

B12
A13
C12

CS
WE
RAS
DQMH
DQML
CKE
CAS

To Blackfin

M15
J12
L16
K12
L15
K13
K15
K14
J16
J13
J15
H14
H16
H13
H15
H12

A11
A12
B10
D11
C10
D10
E10
A10
C9
B9
E9

MT48LC16M16/TSOP54

U16

To SDRAM 2

G12
G13
G15
F14
F16
F12
F15
F13
E15
D16
D15
E14
C16
E12
C15
B16

VSSQ
VSSQ
VSSQ
VSSQ
VDDQ
VDDQ
VDDQ
VDDQ
VDD
VDD
VDD

A14
A13
SA10
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2

To SDRAMTo Blackfin

21
20
36
35
22
34
33
32
31
30
29
26
25
24
23

VSSQ
VSSQ
VSSQ
VSSQ
VDDQ
VDDQ
VDDQ
VDDQ
VDD
VDD
VDD
CS
WE
RAS
DQMH
DQML
CKE
CAS
CLK
BA1
BA0
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0

DQ15
DQ14
DQ13
DQ12
DQ11
DQ10
DQ9
DQ8
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0

53
51
50
48
47
45
44
42
13
11
10
8
7
5
4
2

D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
To Blackfin

U17

R40

VDD

10k
ADSP-BF561_BGABlackfin® Processor and SDRAM Technology (EE-326)

Page 50 of 56

aExcursus: Calculating Z0 (Chapter 4)This section describes the Telegrapher’s equation approach.
The SDRAM connection is a transmission line. This is the reason the telegrapher’s equations accurately
model the propagation of electrical currents and voltages along the structure. The trace is not an ideal
conductor, so we have to use an equivalent circuit diagram (Figure 50) that includes the influence of the
trace itself.
Input

L
Rs
C

Rp

Figure 50. Equivalent circuit including the influence of the trace itself

But a trace consists not only of one of these structures. We can imagine a connection line (Figure 51) as anearly infinite series of them.

Input

L

L
Rs

Rs
C

Rp

C

Rp

Figure 51. A connection line made up of infinite traces

The variable ZC is a function of the impedance and depends on the frequency. If you want to write it
mathematically correct, you have to write ZC(ω).
The variable Z0 is a single-valued constant showing the value of characteristic impedance at a particularfrequency ω0.
We simplify the model by defining the impedances Y and Z:
Z = jωL+Rs
Y = jωC+1/Rp

The resulting impedance is the sum of the impedance of Z and the impedance of Y and all the other stages
in parallel. We assume we have n elements each with the same Rp, Rs, C, and L.

Blackfin® Processor and SDRAM Technology (EE-326)

Page 51 of 56

a
Z
1
~
Zc = +
1 Y
n
~ +
Zc n
Multiply both sides by (1 +

Y~
Zc )
n

Y~
Z
Y~
~
~
Z c (1 + Z c ) = (1 + Z c ) + Z c ⇔nnn~ 2 Z Z~
Zc = + Zc ⇔
Y n
Z Z~
~
+ Zc
Zc =
Y n

Assuming a transmission line consists of infinite elements with the length 0:
Z c = lim
n →∞

Z Z~
+ Zc =Y nZ=
YjωL + RsjωΧ + 1/Rp

As you increase the frequency, the terms R and G may eventually be neglected as they are overwhelmedby jωL and jωC, respectively, leading to a steady plateau in impedance. The fine balance between the
inductive impedance jωL and the capacitive admittance jωC holds the impedance constant at highfrequencies. This constant-impedance plateau greatly aids the design of high-speed digital circuits, as it
makes possible the termination of transmission lines with a single resistor. The value of characteristic
impedance at the plateau is called Z0.

Z 0 = lim ( Z C (ω )) =
ω →∞

L
C

Calculating the Inductance of a Microstrip Trace

It is strongly recommended to measure these values, but to estimate the value you can use the following
formulas:⎛ 2π ⋅ h ⎞L ≅ 5 ⋅ ln⎜⎟⎝ w ⎠whereby:
L is the inductance in nH/inchh ís the height above the plane (mils)
w is the trace width (mils)
Calculating the Capacitance

C=ε 0 * ε r *AdBlackfin® Processor and SDRAM Technology (EE-326)

Page 52 of 56

awhereby:
A is the length times the width of the trace
d is the distance between ground and the trace
This must be calculated for every ground plane.
IPC’s and Douglas Brooks’ approach of Z0 (Chapter 4)

IPC and Douglas Brooks offer some equations for PCBs, which are very easy to use.
Microstrip Trace

Z0 =⎛ 5.98 ⋅ H ⎞ln⎜⎟
ε r + 1.41 ⎝ 0.8 ⋅ W + T ⎠87

Embedded Microstrip Trace

Z0 =⎛ 5.98 ⋅ H ⎞ln⎜⎟( −1.55⋅ H 1)
⎝ 0.8 ⋅ W + T ⎠⎡⎤ε r ⎢1 − e H ⎥⎣⎦60

Stripline Trace

Z0 =⎛ 1.9 ⋅ (2 H + T ) ⎞ln⎜⎟
ε r ⎝ 0.8 ⋅ W + T ⎠60

Asymmetric Stripline Trace

Z0 =

H ⎞
⎛ 1.9 ⋅ (2 H + T ) ⎞⎛
ln⎜
⎟⎜1 −
⎟
ε r ⎝ 0.8 ⋅ W + T ⎠⎝ 4 ⋅ H 1 ⎠80

whereby H1 > H

Blackfin® Processor and SDRAM Technology (EE-326)

Page 53 of 56

aDielectric Constants of Printed Circuit Boards (PCBs) (Chapter 4)

The tables are taken from A Survey and Tutorial of Dielectric Materials Used in the Manufacture ofPrinted Circuit Boards[7].
Several Commonly Available Woven Glass Reinforces Laminates

List of Non-Woven or Very-Low Glass Content Laminate Materials

Blackfin® Processor and SDRAM Technology (EE-326)

Page 54 of 56

aReferences[1] The ABCs of SDRAM (EE-126), Rev. 1, March 2002. Analog Devices, Inc.
[2] System Optimization Techniques for Blackfin Processors (EE-324), Rev. 1, July 2007. Analog Devices, Inc.
[3] ADSP-BF52x Blackfin Processor Hardware Reference (Volume 1 of 2) Revision 0.31 (Preliminary). May, 2008.
Analog Devices, Inc.
[4] ADSP-BF52x Blackfin Processor Hardware Reference (Volume 2 of 2) Revision 0.3 (Preliminary). September, 2007.
Analog Devices, Inc.
[5] ADSP-BF533 Blackfin Processor Hardware Reference. Rev 3.2, July 2006. Analog Devices, Inc.
[6] ADSP-BF537 Blackfin Processor Hardware Reference. Rev 3.0, December 2007. Analog Devices, Inc.
[7] ADSP-BF561 Blackfin Processor Hardware Reference. Rev 1.1, February 2007. Analog Devices, Inc.
[8] ADSP-BF522/523/524/525/526/527 Blackfin Embedded Processor Preliminary Data Sheet. Rev PrE, August 2008.
Analog Devices, Inc.
[9] ADSP-BF512/ADSP-BF514/ADSP-BF516/ADSP-BF518 Blackfin Embedded Processor Preliminary Data Sheet.
Rev PrC, October 2008. Analog Devices, Inc.
[10] ADSP-BF531/ADSP-BF532/ADSP-BF533 Blackfin Embedded Processor Data Sheet. Rev F, 2008. Analog Devices, Inc.
[11] ADSP-BF534/ADSP-BF536/ADSP-BF537 Blackfin Embedded Processor Data Sheet. Rev E, March 2008.
Analog Devices, Inc.
[12] ADSP-BF538/ADSP-BF539 Blackfin Embedded Processor Data Sheet. Rev B, 2008. Analog Devices, Inc.
[13] ADSP-BF561 Blackfin Embedded Processor Data Sheet. Rev C, 2007. Analog Devices, Inc.
[14] A Survey and Tutorial of Dielectric Materials Used in the Manufacture of Printed Circuit Boards - By Lee W. Ritchey,
Speeding Edge, for publication in November 1999 issue of Circuitree magazine. Copyright held by Lee Ritchey of
Speeding Edge, September 1999.
[15] Writing Efficient Floating-Point FFTs for ADSP-TS201 TigerSHARC® Processors (EE-218), Rev. 2, March 2004[16] Micron Technical Note 48-09 LVTTL DERATING FOR SDRAM SLEW RATE VIOLATIONS[17] High Speed Digital Design – A Handbook of Black Magic by Howard W. Johnson and Martin Graham, 1993 PTR
Prentice Hall, ISBN 0-13-395724-1[18] High-Speed Signal Propagation – Advanced Black Magic by Howard W. Johnson and Martin Graham, 2003, PTR
Prentice Hal, ISBN 0-13-084408-X[19] EMV-Design Richtlinien by Bernd Föste and Stefan Öing, 2003 Franzis’ Verlag GmbH, ISBN 3-7723-5499-8

Readings[20] ADSP-BF53x/ADSP-BF56x Blackfin Processor Programming Reference. Rev 1.2, February 2007. Analog Devices, Inc.

Blackfin® Processor and SDRAM Technology (EE-326)

Page 55 of 56

aDocument History
Revision

Description

Rev 2 – December 11, 2008
by Fabian Plepp

Provides a more detailed description of the SDRAM initialization. Also, adds
information on drive strength control for ADSP-BF52x devices. Incorporates
support for ADSP-BF51x processors.

Rev 1 – May 12, 2008
by Fabian Plepp

Initial public release. Adds Low Power section, OTP and ADSP-BF52x processors.

Rev 0 – August 21, 2006
by Fabian Plepp

Internal version (draft).

Blackfin® Processor and SDRAM Technology (EE-326)

Page 56 of 56