EPO-TEK® H20E
Technical Data Sheet
For Reference Only
Electrically Conductive, Silver Epoxy

Date:
Rev:
No. of Components:
Mix Ratio by Weight:
Specific Gravity:
Pot Life:
Shelf Life- Bulk:
Shelf Life- Syringe:
NOTES:

November 2019
XVII
Two
1:1
Part A: 2.03
Part B: 3.07 Syringe: 2.67
2.5 Days
One year at room temperature
One year at -40°C

Recommended Cure: 150°C / 1 Hour
Minimum Alternative Cure(s):May not achieve performance properties below
150°C / 5 Minutes
120°C / 15 Minutes
80°C / 3 Hours● Container(s) should be kept closed when not in use.
● Filled systems should be stirred thoroughly before mixing and prior to use.
● Performance properties (rheology, conductivity, others) of the product may vary from those stated on the data sheet when bi-pak/syringe packaging or
post-processing of any kind is performed. Epoxy’s warranties shall not apply to any products that have been reprocessed or repackaged from Epoxy’sdelivered status/container into any other containers of any kind, including but not limited to syringes, bi-paks, cartridges, pouches, tubes, capsules, films
or other packages.

Product Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chipbonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its
high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is still the conductive adhesive ofchoice for new applications. Also available in a single component frozen syringe.
Typical Properties: Cure condition: 150°C / 1 Hour
Different batches, conditions & applications yield differing results.
Data below is not guaranteed. To be used as a guide only, not as a specification. * denotes test on lot acceptance basis
PHYSICAL PROPERTIES:* Color (before cure):
Part A: Silver
Part B: Silver* Consistency:
Smooth thixotropic paste* Viscosity (23°C) @ 100 rpm:
2,200 - 3,200 cPs
Thixotropic Index:
4.6* Glass Transition Temp:≥ 80 °C (Dynamic Cure: 20-200°C/ISO 25 Min; Ramp -10-200°C @20°C/Min)
Coefficient of Thermal Expansion (CTE):
Below Tg:
31 x 10-6 in/in°C
Above Tg:
158 x 10-6 in/in°C
Shore D Hardness:
75
Lap Shear @ 23°C:
1,475 psi
Die Shear @ 23°C:≥ 10 Kg
3,556 psi
Degradation Temp:
425 °C
Weight Loss:@ 200°C:
0.59 %@ 250°C:
1.09 %@ 300°C:
1.67 %
Suggested Operating Temperature:< 300 °C (Intermittent)
Storage Modulus:
808,700 psi
Ion Content* Particle Size:

Cl-:
NH4+:

73 ppm98 ppm
≤ 45

Na+:
2 ppm
K+:
3 ppm
microns

ELECTRICAL AND THERMAL PROPERTIES:
Thermal Conductivity:
2.5 W/mK based on standard method: Laser Flash
Thermal Conductivity:
29 W/mK based on Thermal Resistance Data: R = L x K-1 x A-1)
Thermal Resistance (Junction to Case):
TO-18 package with nickel-gold metallized 20 x 20 mil chips and bonded with H20E
(2mils thick)
EPO-TEK® H20E: 6.7 to 7.0°C/W
Solder: 4.0 to 5.0°C/W* Volume Resistivity @ 23°C:≤ 0.0004 Ohm-cm

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com

EPO-TEK® H20E
Technical Data Sheet
For Reference Only
Electrically Conductive, Silver Epoxy

EPO-TEK® H20E Suggested Applications
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Semiconductor IC Packaging
Die-attaching chips to leadframes; compatible with Si and MEM’s chips, 260ºC lead-free reflow and JEDEC
Level I packaging requirements.
Capable of being snap cured in-line, as well as traditional box oven techniques.
Adhesive for solderless flip chip packaging and ultra fine pitch SMD printing.
Hybrid Micro-electronics
A comparable alternative to solder and eutectic die attach, in terms of thermal peformance; very commonly nomore than 1-2ºC/watt difference in thermal resistance.
Die-attaching of quartz crystal oscillators (QCO) to the Au posts of TO-can style lead-frame.
Used with GaAs chips for microwave/radar applications up to 77GHz.
SMD attach adhesive which can be cured simultaneously with die-attach processes.
o Compatible with Au, Ag, Ag-Pd terminations of capacitors and resistor SMDs.
NASA approved low outgassing adhesive.
Adhesive for EMI and Rf shielding of Rf, microwave and IR devices.
Electronic & PCB Circuit AssemblyUsed to make electrical contacts in acoustical applications of speakers/microphones.
Electrical connection of piezo’s to PCB. Pads of PZT are connected to many kinds of circuits using H20E,including ink jet heads, MEMs and ultrasound devices.
Automotive applications include pressure sensing and accelerometer circuits.
Electrically conductive adhesive (ECA) for connections of circuits to Cu coils in Rf antenna applications such as
smart cards and RFID tags.
ECA for attaching SMDs to membrane switch flex circuits. Compatible with Ag-PTF and carbon graphite PCBpads. A low temperature “solder free” solution.
Solar-Photovoltaic industryo ECA for the electrical connection of transparent conductive oxide (TCO) to PCB pads.
o Replacement of solder joints of Cu/Sn ribbon wire, from cell-to-cell; a common “solar cell stringing”
adhesive.
o Die-attach of III-V semiconductor chips to substrates used in solar concentrator technology, such as
CdTe and GaAs.
o An effective heat-sink on thermal substrates using Cu, BeO, aluminum nitride, etc.
o Ability to be dispensed in high volumes via dots, arrays, and writing methods.
Opto-Electronic Packaging Applications
Adhesive for fiber optic components using DIP, Butterfly or custom hybrid IC packages. As an ECA, it attaches
waveguides, die bonds laser diodes and heat sinks the high power laser circuits.
Die-attaching IR-detector chips onto PCBs or TO-can style headers.
Die-attaching LED chips to substrates using single chip packages, or arrays.
o Adhesion to Ag, Au and Cu plated leadframes and PCBs.
Electrical connection of ITO to PCBs found in LCD industry.
o A low temp ECA for OLED displays and organically printable electronics.

EPO-TEK® H20E Advantages & Application Notes:
Processing Info: It can be applied by many dispensing, stamping, and screen printing techniques.
•Dispensing: Compatible with pressure/time delivery, auger screws, fluid jetting and G27 needles, in a single-component fashion.
•Screen Printing: Best using >200 metal mesh, with polymer squeegee blade with 80D hardness.
•Stamping: Small dots 6 mil in diameter can be realized.
Misc/Other Notes:•
Many technical papers written over 30-40 year lifetime. Contact techserv@epotek.com•
Over 1 trillion chips attached at a single company: no failures, Six Sigma and Certified Parts Supplier award winner.
•Versatility in curing techniques including box oven, SMT style tunnel oven, heater gun, hot plate, IR, convection, or inductor coil.
•Many custom modified products available, for the following improvements: viscosity and appearance, flexibility and thermal
conductivity. Contact techserv@epotek.com for your best recommendation.
Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com