Technical Data | February 2021

3M™ OneFilm WSS Semiconductor Temporary Bonding Film Series
Product Description
3M™ OneFilm WSS Semiconductor Temporary Bonding Film Series is a multi-layer Pressure Sensitive Adhesive(PSA) film designed for the temporary bonding solutions of wafers/panels to transparent carriers.
3M OneFilm WSS (wafer support system) film series has excellent heat resistance, high adhesion and chemicalresistance. These properties help provide a rigid, uniform support surface that helps minimize stress on the waferduring the subsequent processing steps, resulting in less warpage and higher yields in semiconductor fan-out wafer
level packaging (fan-out WLP), fan-out panel level packaging (fan-out PLP) and through silicon via (TSV) process.
The unique multi-layer film doesn’t require any additional cross-linking or polymerization steps such as heat-baking
or ultraviolet curing. With the laser active elastomeric film, a laser is used to de-bond the glass carrier, allowing
easy, low force, chemical free separation of the support carrier from the adhesive surface. The adhesive is thenpeeled from the wafer using a simple peeling operation.

Key Features•••

Provides excellent thermal stability for customer build-up processes
Offers clean-dry & simple process (non-curing) steps
Provides good lamination properties with excellent wettability

Product Construction/Material Description
Note:

The following technical information and data should be considered representative or typical only and should not be used
for specification purposes.

3M™ OneFilm WSS Semiconductor Temporary Bonding Film
Layer description

Thickness (µm)
14001-H1

14001-H4

Laser Active Elastomeric Film (LAEF)

1010Interlayer Adhesive
Polyimide Film
Pressure Sensitive Adhesive
Total30255011530253095

3M™ OneFilm WSS Semiconductor Temporary Bonding Film SeriesApplications••••••

Fan-out IC packaging temporary bonding support - reconstitution/mold/redistribution/solder reflow
IC packaging wafer process temporary bonding support
LED/PMIC wafer backside metallization process support
Silicone interposer thinning/metallization/passivation process
3D TSV temporary wafer support
Large PCB/glass handling process

Application Techniques•••••

Heating (70oC) lamination on glass carrier
Low level vacuum assist wafer/panel bonding to glass carrier- Temperature: > 50oC
- Vacuum: 0.1~0.5 Torr
- Force: 10~50 kg
Carrier lift-off by IR or UV wavelength laser scanning- Wavelength: UV-308, 355 nm/IR-1064 nm- Spot size: ~1.5 mm, dot-linear scanning techniqueLaser scanning speed: 1.0~5.0 m/sec
3M™ Wafer De-Taping Tape 3305 is used to peel the PSA from the wafer or panel

Typical Physical Properties and Performance Characteristics
Note: The following technical information and data should be considered representative or typical only and should not be used for specification
purposes. Final product specifications and testing methods will be outlined in the products Certificate of Analysis (COA) that is shipped with thecommercialized product.

3M™ OneFilm WSS Semiconductor Temporary Bonding Film Series
Property

MethodAppearance
PSA Adhesion to Steel (gf/inch)
Adhesion to Glass (gf/inch)
Elongation at Break (%)
Film Total Thickness

Value

Naked eye
ASTM D-3330

14001-H1
Dark brown / black
185

14001-H4
Dark brown / black
415

ASTM D-3330
ASTM D-3579
ASTM D-3652>1,00080115>1,0008095Storage and Shelf Life
The shelf life of 3M™ OneFilm WSS Semiconductor Temporary Bonding Film Series is 6 months from the date ofmanufacture when stored in the original packaging materials and stored at 21°C (70°F) and 50% relative humidity.

Certificate of Analysis (COA)The 3M Certificate of Analysis (COA) for this product is established when the product is manufactured and deemedcommercially available from 3M. The COA contains the 3M test methods, specifications limits and test results forthe product’s performance attributes that the product will be supplied against. Contact your local 3M representative
for this product’s COA.

3M™ OneFilm WSS Semiconductor Temporary Bonding Film Series

Regulatory: For regulatory information about this product, contact your 3M representative.
Technical Information: The technical information, recommendations and other statements contained in this document are based
upon tests or experience that 3M believes are reliable, but the accuracy or completeness of such information is not guaranteed.
Product Use: Many factors beyond 3M’s control and uniquely within user’s knowledge and control can affect the use andperformance of a 3M product in a particular application. Given the variety of factors that can affect the use and performance of a3M product, user is solely responsible for evaluating the 3M product and determining whether it is fit for a particular purpose
and suitable for user’s method of application.
Warranty, Limited Remedy, and Disclaimer: Unless an additional warranty is specifically stated on the applicable 3M productpackaging or product literature, 3M warrants that each 3M product meets the applicable 3M product specification at the time
3M ships the product. 3M MAKES NO OTHER WARRANTIES OR CONDITIONS, EXPRESS OR IMPLIED, INCLUDING, BUT
NOT LIMITED TO, ANY IMPLIED WARRANTY OR CONDITION OF MERCHANTABILITY OR FITNESS FOR A PARTICULARPURPOSE OR ANY IMPLIED WARRANTY OR CONDITION ARISING OUT OF A COURSE OF DEALING, CUSTOM OR USAGE
OF TRADE. If the 3M Product does not conform to this warranty, then the sole and exclusive remedy is, at 3M’s option,
replacement of the 3M product or refund of the purchase price.
Limitation of Liability: Except where prohibited by law, 3M will not be liable for any loss or damage arising from the 3M product,whether direct, indirect, special, incidental or consequential, regardless of the legal theory asserted, including warranty, contract,negligence or strict liability.

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