Metal
ThermalInterface
Materials• Liquid Metal• Compressible Metal• Solder• TIM Fluxes
Products• Au/Sn Solder• In/Pb Solders• Pure Indium• Informs• SMA-TIM• SAC Pb-Free Solders

86W/m•K

2

Metal Thermal Interface Materials
Introduction
Metal Thermal Interface Materials
Radically Improve:• Heat Dissipation Efficiency in Electronic Devices• Thermal Conductivity for High Power Devices with
Power Densities in Excess of 50W/cm2• End-of-Life Performance at the Thermal Interface– to Avoid Failures Common with Fluidic Solutions
Such as Greases• Portable Device Battery Performance – by Reducing
Thermal Resistance and Cooling Fan Size
• Portable Device Use Profile – by Reducing
Heatsink Size and Mass
• Compliance with RoHS While Accommodating
Step Soldering Requirements• Medical• Cryogenics• Automotives• Power Devices

Indium Corporation Has Solutions for:• Telecom• Computing• Semiconductors• LEDs• Photonics

Applications
Some Applications Include:• Semiconductor Integrated Circuits• Power QFNs
• Power Device to PCB Attach (TO220, etc.)• Telecom• Die-Attach (Photonics, MOSFETS, LED etc.)• Laser Diodes

Products

Packaging• Au/Sn Solder• Tape and Reel

• In/Pb Solders• Syringe• Pure Indium• Bottle• Informs• Custom Packaging

Types of Metal TIMs:• Liquid• Compressible Metal• Solderable• Low-Melting Alloy

Superior
ThermalConductivity• Sn/Pb Solders• SAC Pb-Free Solders

Problem:• Increased
Power
Demands• Reduced
PackageSize

www.indium.com/TIM

Solved.

3

LiquidIndalloy® Alloys
Liquid at Room Temperature
Introduction
Several very low melting point Indalloy® alloys are liquid atroom temperature. These gallium-based alloys are finding
increased use in various applications as a replacement for
toxic mercury, which has a high vapor pressure at room
temperature. These alloys have reduced toxicity and lower
vapor pressure than mercury.

Excellent Thermal andElectrical Conductivity
Alloy systems that are liquid at room temperature have a highdegree of thermal conductivity far superior to ordinary
non-metallic liquids. This results in the use of these materials
for specific heat conducting and/or dissipation applications.
Other advantages of these liquid alloy systems are theirinherent high densities and electrical conductivities.

Wetting to Metallic and
Non-Metallic Surfaces
These alloys will wet most metallic surfaces once oxides
have been sufficiently removed from the substrate surface.
However, gallium is very reactive with some metals, even atroom temperature. At high temperatures, gallium dissolves
most metals, although a number, including Na, K, Au, Mg, Pb,
Ni and interestingly Hg, are only slightly soluble at moderatetemperatures.1
As stated, gallium is corrosive to all metals except tungsten
and tantalum which have a high resistance to corrosion.
Columbium, titanium and molybdenum have resistance tocorrosion but less than tungsten and tantalum.2
Gallium and the gallium alloys, like indium, have the ability to
wet to many non-metallic surfaces such as glass and quartz.
Gently rubbing the gallium alloy into the surface may help
induce wetting.

Packaging
Alloys are packaged in polyethylene bottles and shipped inaccordance with applicable federal regulations.

Storage/Shelf Life
Unopened bottles have a guaranteed one-year shelf life. It is
recommended that, as the alloy is removed from the bottle,
the volume be replaced with dry argon. This will minimize thepossibility of oxidation at the surface of the alloy. If the alloy
has been stored below its melting point and has solidified, itshould be re-melted and thoroughly shaken or mixed before
use. Care should be taken in reheating the alloy in the original
packaging provided. Temperatures should not exceed 65.6°C.
1. Pergamon Texts in Inorganic Chemistry Volume 12, The Chemistry of
ALUMINUM, GALLIUM, INDIUM, and THALLIUM by K. Wade &  A. J. Banister,
University of Durham, Pergamon Press, 1975.

Note: These alloys form a thin dull looking oxide skin that is
easily dispersed with mild agitation. The oxide-free surfaces
are bright and lustrous.

2. Lyon, Richard N., ed. Liquid Metals Handbook. 2nd ed. Washington DC:
1952

Applications
Typical applications for these materials include thermostats,switches, barometers, heat transfer systems, and thermalcooling and heating designs.
Uniquely, they can be used to conduct heat and/or electricity
between non-metallic and metallic surfaces.
Indalloy
NumberType

Liquidus

Solidus

Composition

Densitylb/in3Specific
Gravity

46L

Ordinary Alloy

7.6°C

6.5°C

61.0Ga/25.0In/13.0Sn/1.0Zn

0.2348

6.50

51

Eutectic Alloy

10.7°C

10.7°C

62.5Ga/21.5In/16.0Sn

0.23486.50

60

Eutectic Alloy

15.7°C

15.7°C

75.5Ga/24.5In

0.2294

6.35

77

Ordinary Alloy

25.0°C

15.7°C

95Ga/5In

0.2220

6.15

14

Pure Metal

29.78°C

29.78°C

100Ga

0.2131

5.904

TIM@indium.com

4

Metal Thermal Interface Materials
Compressible Metal–SMA-TIM
Introduction
Indium’s Soft Metal Alloy Thermal Interface Materials(SMA-TIM) exhibit superior thermal conductivity,
compressibility and ease of application. SMA-TIM preforms
constructed of indium with our heat-spring processing
technology are a highly effective choice for high-end
cooling devices.

Specifications
Typical Dimensions
		Application Pressure
Alloy Purity Level
Max. Operational Temp.
Thermal Conductivity

25.4mm x 25.4mm x .05-.3mm(1" x 1" x .002"-.012")>20psi99.99% In
140°C
86W/m•K

Compressed Interface Application
An SMA-TIM made of indium offers uniform thermal
resistance at lower applied stresses in compressedinterfaces. The malleability of indium minimizes surface
resistance and increases heat flow. Our patent pending
heat-spring technology will further reduce the thermal resistance.

Reliability
Indium’s high-end thermal interface materials deliver superior
performance. As SMA-TIM products are made of metal, they do
not experience pump out problems even under power cycling. The
heat-spring material, which does not contain silicone, will conform tosurface irregularities, thereby reducing thermal resistance throughthe life of the TIM. Due to its solid state, the SMA-TIM also resists
bake out as shown in the diagram below.

Heat-Springwww.indium.com/TIM

Baseline
Thermal Grease5

Solderable Metal
Introduction
Thermal interface materials are useful for a variety of
applications, but solder thermal interface materials (sTIM)
are especially suited to high-end device cooling. To improvepackage reliability, it is especially important to choose theright alloy. Indium, in particular, should be considered as asTIM because of its high thermal conductivity, compressibility(SMA-TIM), and ease of application.

Specifications
Max. Operational Temp.
Standard Purity Level
Typical Size
		

125°C
99.99%
25.4mm x 25.4mm x .05-.3mm(1" x 1" x .002"-.012")

Applications
Indium Preforms may be used in a variety of processes.
• Compressed Between Two Surfaces Without Reflow(SMA-TIM) Soft Metal Alloy-TIM
The extreme malleability of indium allows it to minimize
surface resistance – thereby increasing heat flow. The
graph below demonstrates this phenomenon.
• Soldered Between Two Surfaces(sTIM) Solder-TIM
Used to further improve thermal resistance, this application
may require the use of a flux to reduce oxides on soldering
surfaces.
• Cold-Welding
Another process that is used to create a thermal interface
involves reflowing indium preforms onto each solderable
surface. Then, indium-coated surfaces should be cleaned
and pressed together to form a fluxless cold-weld solder
joint. (See the Application Note: Etching Indium to Remove
Oxides for more information about this process.)

Storage and Packaging
SMA-TIM Preforms come in a variety of packaging options,
including tape & reel and custom adhesive carriers for
direct-attach to heat-sinks. To minimize excessive handlingand oxidation due to air exposure, it is recommended to keep
TIM preforms in their original container in a cool dry place.
Indium SMA-TIMs, when exposed to air, will self-passivate toa level of approximately 10 nanometers and will have a usefullife of at least six months. SMA-TIMs can also be stored in an
inert atmosphere such as nitrogen.

Properties
Indalloy
Electrical Conductivity ('% of IACS) (1.72microhms-cm)
Thermal Conductivity (W/m•K) (@ 85°C)
Coefficient of Thermal Expansion (µin/µin per °C) (@20°C)
Density (lb/cu. in.)
Mass Density (gm/cm3)
Tensile Strength (PSI)
Shear Strength (PSI)
Young's Modulus (PSI X 10x6)%Elongation
Brinell Hardness (2mm ball, 4kg load)Latent Heat of Fusion (J/g)
Melting Point (°C)

#4
24
86
29
0.2641
7.31
273
890
1.57
22 to 41
0.9
28.47
156.7

Material Safety Data Sheet
The MSDS for this product can be found online at
http://www.indium.com/techlibrary/msds.php

TIM@indium.com

6

Metal Thermal Interface Materials
Solderable
Introduction
Solder Preforms are used in a variety of applications that
require precise amounts of solder.
Preforms come in standard shapes such as squares,
rectangles, washers and discs. Typical sizes range from.254mm (.010”) up to 50.8mm (2”). Smaller and larger
sizes, as well as custom shapes, are also available.
Dimensions can be held to tight tolerances to assurevolume accuracy.

Selecting Alloys
A wide assortment of alloys is available in liquidus
temperatures that range from 47°C to 1063°C. Alloys can be
indium–contained, gold-contained, lead–free, fusible or standard
tin–lead, as well as many others.
1. Alloy selection should be based on strength and otherrequired physical properties, as well as the preferredsoldering temperature and the operating  temperatureof the device being soldered. A general rule is to select analloy that melts at least 50°C higher than the operationaltemperature of the part being soldered.
2. Next, consider the materials being soldered and whatsolder is most compatible with them. For example,
tin–based solders will scavenge the gold from gold-platedparts, forming brittle intermetallics, so indium-based
solders are generally recommended in these cases.
3. Metals and alloys have different characteristics that canaffect the ease with which they can be made into different
shapes and thicknesses. It is important to consider the
shape of the final preform in the alloy selection process.
4. The operating environment of the completed assembly isalso an important consideration for alloy selection. Will
it operate in very high or very low temperatures, or be
subjected to vibration? If so, you need to select an alloythat will stand up to these conditions.
Our Application Engineers will work with you to determine thebest alloy for your application.

Selecting Dimensions
The location of the solder joint and the volume of solder
needed will determine the size and shape of the preform.
Once the flat dimensions (diameter, length, width) havebeen determined, the thickness can be adjusted to achieve
the desired volume of solder. Generally, for through–holeconnections, add 10–20% to the calculated volume for a goodfillet. For pad to pad joints, figure about 5% less surface area
than the pad.
Each Solder Preform should have a burr tolerance specified.
You should stay as close to standard tolerances as possible
to avoid adding cost and lead time to your preforms.
Indium Corporation has an extensive library of sizes andshapes from which you can choose, or we can create a
set–up specifically for your application. Using an existing
preform size can eliminate the additional time associatedwith creating a new set–up.

Dimensional Specification Recommendations
Width/length or diameter:

Typical Tolerances

Up to 2.54mm (0.100”)
Over 2.54mm (0.100”)± 0.051mm (± 0.002”)± 0.127mm (± 0.005”)

Up to 0.025mm (0.001”)
0.025mm (0.001”) to 0.050mm (0.002”)> 0.050mm (0.002”) to 0.254mm (0.010”)> 0.254mm (0.010”) to 0.508mm (0.020”)> 0.508mm (0.020”) to 1.27mm (0.050”)> 1.27mm (0.050”)± 0.005mm (0.0002”)± 0.0076mm (0.0003”)± 0.0127mm (0.0005”)± 0.0254mm (0.0010”)± 0.0635mm (0.0025”)± 5%

Thickness:

Burr Tolerances (Discs, Squares & Rectangles):≤ 1.27mm (0.050”)> 1.27mm (0.050”) to 12.7mm (0.500”)> 12.7mm (0.500”)

0.050mm (0.002”)
0.076mm (0.003”)
0.127mm (0.005”)≤ 2.54mm (0.100”)
When thickness ≥ 2/3 of I.D.

0.076mm (0.003”)
0.127mm (0.005”)

Burr Tolerances (Washers & Frames):www.indium.com/TIM

7

Flux-Coated Preforms
Features• Eliminates the need for manual fluxing• Eliminates excessive flux residue• Increases productivity• Applies flux precisely where it is needed• Applies a uniform amount every time

Introduction
Flux Coated Preforms eliminate the costly production stepof separate fluxing and increase throughput yields. Flux
Coatings for Preforms are available in no-clean and rosin-based
chemistries with a variety of activity levels to suit yoursubstrate metallizations.

Flux Coatings
Indium Corporation’s unique coating process can control
the amount of flux to tight tolerances. Flux Coatings aremeasured and applied by weight percentage. The coatings
range from 1-3% and standard tolerances are controlled at+/- .5%. Coatings can be applied to most sizes and shapesof preforms.

Using Flux-Coated Preforms In Soldering
For certain soldering applications, flux coated preforms
may offer the greatest number of benefits over other moreconventional forms of solder. For applications other than active
device manufacture, flux can be incorporated as an integral
part of the preform design to meet customer needs for the
precise amounts of flux, easy automation, and elimination of
costly separate flux applications.
In general, fluxes should be avoided in active device assembly
due to the difficulty in removing the flux residue after soldering.
If care is taken to ensure the joining surfaces and the
preforms are thoroughly clean, and if a reducing atmosphere at  350°C is used, flux coating is usually not necessary.
Flux coated Indalloy soft solder preforms eliminate thenecessity of manually applying external liquid fluxes inoperations such as vapor phase soldering of back-plane wiring
assemblies and capacitor manufacture. Flux coated preforms
are manufactured with the exact amount of flux required forthe specific application, providing a high degree of consistencyfrom one bond to another. Flux percentages can be specified
between 0.5% and 3% by weight with a tolerance of ±0.5%.
The most popular percentage being 1.0% by weight.
Indalloy flux types are available in non-activated pure gum
rosin (type R), mildly activated rosin (type RMA) and fully
activated rosin (type RA). RMA fluxes have a small but highly
effective amount of an activator added to increase fluxing
action over the R type. RA fluxes contain a small amountof an amine hydrochloride activator that provides superior
fluxing action, as compared to R and RMA type fluxes. RA
flux finds use in soldering assemblies where a high degree offluxing action is desired, e.g. soldering to tarnished copper ornickel plate. RSA, an enhanced version, is also available forpreform coating. This flux is the strongest of the rosin types.
NC-7 and NC-9 fluxes are specially formulated RMA type
fluxes that, along with the R type flux, leave nonconductive
and non-corrosive residues that can safely be left on an
assembly without fear of corrosion. However, for aesthetic orvisual inspection purposes, the flux residue can be removed
using a bipolar solvent to remove both the rosin portion andthe ionizable activator portion of the flux. This is most often
accomplished using vapor degreasing equipment.
In summary, the use of Indalloy flux coated preforms canresult in the following advantages:
1. All fluxes used to coat preforms, when reflowed using astandard Sn63 profile, pass SIR tests.
2. The precise amount of flux and alloy are delivered to thesolder joint.
3. The costly production step of separate fluxing is eliminated.
4. Bonding is faster because the flux is positioned where it
is required, next to the surfaces to be joined, unlike thecase with flux-filled preforms.
5. Because less flux is used, post solder cleaning is easier.
6. The flux quantity is uniform in thickness and consistent inamount from piece to piece.
7. The dull, flux-coated surface is ideal for IR reflow.
8. Since the flux on flux coated preforms contains no solvent,voiding is typically less than when manually applying liquid
flux to uncoated preforms.

TIM@indium.com

8

Metal Thermal Interface Materials
Suggestions for Solder Preform Design
Solder preforms are manufactured solder shapesthat come in standard forms such as squares,
rectangles, discs, washers and frames.  They can also
be manufactured with custom geometries. Preforms
provide consistent part-to-part dimensions that result inconstant solder volumes, thereby insuring consistency
in solder assembly. Because preforms are made witha uniform shape and size, automation of the assembly
process can be easily implemented, resulting in fasterproduction and reduced costs.
Tooling design changes can increase costs rapidly,
especially when experimenting with multiple shapes
and sizes. A “trial and error” approach to determining
the best preform geometry for an application that
includes solders containing precious metals can also
create unnecessary expenditures. It is best to do all
the preform design homework before committing to
final tooling. This application note will explore some
simple ways to arrive at the optimum preform size andshape while reducing costs. The principles below canbe used in concert with one another.
1) Avoid using solder alloys that contain precious metals
when determining the optimum preform geometry
Determining the best geometry can be doneusing a less expensive alloy. For example, if theapplication calls for Au/Sn solder, use 90Pb/10Sn
or some other lower cost alloy to optimize preformdimensions to determine the required solder
volume for the joint. Higher lead containing alloys
are preferred since the density of lead is closer
to gold than tin. If the application restricts the 2dimensional shape of the preform, varying the
thickness is a good way to arrive at the appropriate
volume of solder required.
2) Cut preforms by hand from solder ribbon or sheet
when prototyping
Changes to tooling design can add cost and impact
the overall total cost of preforms. Fabricating small
volumes of preforms manually can be an economic
method of arriving at the optimum preform shapeand size.
Standard alloys and many specialty solder alloys
can be purchased in ribbon or sheet form in widths
close to that of one dimension of the preform. Usinga sharp cutting instrument, such as an X-Acto knife,
cut the experimental shape from the ribbon or sheet.

www.indium.com/TIM

3) Begin evaluations using thin solder materials
If the proper preform thickness is in question, it isbest to begin with the thinnest preform possible. If
the appropriate volume is not immediately achieved
with one preform, they can be stacked. Multiple
preforms will flow together and function as one.
For example, after attempting to use a preform thatis .002” thick, it is evident that the volume of solder
provided by the preform is insufficient. The amountof solder can be doubled by stacking two preforms,
which would equate to having one preform that is.004” thick. The solder volume can be tripled, andeven quadrupled until the proper volume is achieved.
This allows for the appropriate thickness of a single
production preform to be determined.
4) Use the simplest preform geometry possible
Engineering charges for intricate designs can cost
substantially more than less complex designs.
Design the solder locations so that they can beadequately bonded using simple preform geometries
such as washers, frames, discs, rectangles, etc.
5) Determine from the solder supplier the sizes andshapes for which tooling exists
An important issue in any soldering applicationis the resultant volume of solder at the joint
after reflow. The size and shape of the preformare generally secondary considerations. Often
existing tooling that yields slightly different x and ydimensions from the ideal size can be utilized if the
thickness of the preform is adjusted accordingly to
produce the same solder volume.
For example, the design of an application calls
for a solder preform in the shape of a 1.2” x 1.2”
square. The solder supplier does not have tooling forthis size but has existing tooling for a 1.0” x 1.0”
preform. To avoid additional tooling costs the 1.0”
x 1.0” size is selected and the preform thickness
increased to yield the same solder volume.

9

Informs
Reinforced Indium and Solder Alloy Fabrications
Introduction
Informs® are patented fabrications in which braided, woven, or

random-fiber metal or non-metal substrate materials are sandwiched
between layers of pure indium or solder alloy. In the manufacturing
process, material from the surface layers passes through thesubstrate matrix to cold weld where the metals meet within
the matrix. The process produces a reinforced indium or solder
fabrication with improved strength and handling characteristics.
The layers may also be adhered to the substrate without cold welding
at the interface so the substrate can flex to accommodate shear or
thermally-induced forces. Another option, would be to adhere an outerindium or alloy layer to only one side of a substrate.
For solder applications, flux may be incorporated within the matrix orapplied as a coating.
After the laminating process is complete, parts are cut or punched
into discs, washers, rectangles and other shapes to suit specificapplication requirements. Strip materials can also be provided forcustom sizing by the user.

Product Advantages
Informs offer dramatically improved handling when compared toconventional solder alloy or indium sheet, foil, ribbon or large
preform materials. InFORMS also offer increased tensile andcompressive strength via the substrate materials while retaining
the unique attributes of the outer layer metal (e.g. the softness,ductility, and other advantages of indium).

Applications
Informs provide engineers with an enhanced material for thedevelopment of new, or the improvement of existing, applications.
They can be used in cryogenic or vacuum seals, EMI and RFI shielding,ground straps, stand-offs, thermal mismatch devices or backplaneassembly washers. While a number of metals may be used, indium
should be considered in many applications because of its unique
attributes. For example, Indium readily wets glass, quartz, and glazed

ceramics. When compared to conventional solders, indium-based
solders significantly reduce scavenging and leaching of gold and otherprecious metals.

Substrates and Outer Layer Metals
Informs can be produced from a wide range of metal and non-metal
substrates depending on the needs of the application. Informs havebeen successfully produced using tin plated copper shielding mesh,stainless steel mesh, and even woven and random-fiber fiberglass cloth.
Please contact our Technical Support Engineers if you would like us towork with you to develop samples for experimentation, including special
substrate materials, layer thicknesses, or outer layer metallizations.
In applications where the metal meets in the substrate matrix, metals
used on outer layers may be dissimilar as long as they are compatible
with each other. Where the application does not require cold weldingof the outer layers, the layers may also be dissimilar. In either case,compatibility with the substrate material must be considered inapplications development. Most compatibility issues are documented
in solder technical guides. However, if in question, it’s always a goodidea to contact Indium Corporation for advice. When solder alloys are
specified, published temperature guidelines are applicable.

Dimensional Specifications
Informs are produced in sheet form and can be cut or punched intolarge unique shapes for applications such as cryogenic or vacuum
seals, or into small preforms for tasks such as component assembly.
Dimensional tolerances can be held to those normally specified forstandard solder preforms, but may vary depending on the part size,
thickness, substrate, and outer layer materials. Please contact us if
you have special requirements.

Summary
Informs add handling capability to soft and ductile indium and solder
alloys. They also strengthen and yet retain, the unique attributes ofthe metals selected for the outer layers. InFORMS offer countless
opportunities for solving difficult application problems.

Tape and Reel Packaging
Introduction
Solder Preforms are used in a variety of applications that requireprecise amounts of solder. Dimensions can be held to tight tolerances
to assure volume accuracy. Solder preforms are available in a varietyof alloys, including indium, gold, tin, lead, and many others.
Solder Preforms come in standard shapes, such as squares,
rectangles, washers, and discs. Typical sizes range from 0.010”(.254mm) up to 2” (50.8mm). Smaller and larger sizes, as well as
custom shapes, are also available.
Tape and Reel packaging of preforms allows for easier use in highvolume and automated manufacturing environments.

Applications
Tape and Reel Preforms offer advantages over loose-packed
preforms in many applications. Some common examples are:• Automation – Tape and Reel Preforms allow for easy use with pick
and place equipment in SMT lines. They can be precisely placed as
fast as your equipment will allow.
• Solder Fortification – There are certain instances in SMT
applications where simply printing paste does not provide sufficient
solder volume. Rather than resort to step stenciling or dispensing,a placed preform can be more efficient by giving you precise,repeatable solder volume.

Flexibility
Tape and Reel pockets areavailable in a wide rangeof sizes to accommodate
various preform shapes
and sizes.

Shelf Life
The shelf life of solder
preforms is dependent
on the alloy composition.
Pb-free alloys, and alloys
with lead content of less than 70%, have a shelf life of 1-year fromthe date of manufacture (DOM). Alloys with lead content >70% havea shelf life of 6-months from the DOM.

Technical Support
Indium Corporation’s internationally experienced engineers provide
in-depth technical assistance to our customers. Thoroughly knowledgeable
in all facets of Material Science as it applies to the electronics andsemiconductor sectors, Technical Support Engineers provide expert
advice in solder properties, alloy compatibility and selection of solder
preforms, wire, ribbon and paste. Indium Corporation Technical Support
engineers provide Rapid Response to all technical inquiries.

TIM@indium.com

10

Metal Thermal Interface Materials
Clad Solder Preforms
Benefits• Maintains standoff• Bridges gaps
• Adds strength to solder joints

Introduction
Clad Solder Preforms are manufactured shapes thatdeliver a precise amount of solder while maintaining
and/or bridging a particular gap. They consist of acopper layer that is clad on one or both sides with a
specified thickness of solder. Dimensions can be held totight tolerances to assure volume accuracy. Clad solder
preforms come in standard shapes and sizes such as
squares, rectangles, washers, frames and discs.
Typical sizes range from .254mm up to 50.8mm.
Smaller and larger sizes, as well as custom shapes,
are also available.

Alloys/Materials
Typical alloys include:• Sn62/Sn63• 96.5Sn/3.5Ag• Sn10• Other alloys are available upon request.

When possible, we suggest filling each package with thequantity of clad solder preforms that will be consumed in
one shift.

Storage and Handling Procedures
Clad Solder Preforms should be kept in their unopened
container in a cool dry place until time of use, preferably
in a nitrogen dry box. After opening, any unused preforms
should be stored in these same conditions.

SafetyEating, drinking and smoking should be avoided whilehandling preforms. Hands should be washed immediately
following use. If possible, preforms should be handled withprotective gloves or finger cots.

Applications• Heat Sink Attach• Pin Soldering• 3D Soldering• Jumper Bridges• Connectors

The core material is OFHC Copper:• Annealed Per ASTM-B152• F scale• Tensile Strength 35,000 psi max.
• Other coppers are available upon request.

And other soldering applications where the following
properties are desired:• Strength• Wear Resistance• Formability• Electrical Properties• Thermal Properties

Packaging

Compatible Products

Clad Solder Preforms are packaged in formats similar tostandard preforms and take into consideration the sizeand strength of the preform. Common packing methods
include jars, boxes (stack or layer pack) and tape & reel.
Most packages can be backfilled with argon upon request.

www.indium.com/TIM• Clad Solder Preforms can be flux coated with any of
our standard preform flux coatings.
• Indium Corporation’s liquid fluxes and TACfluxes.

11

FluxesRosin/Resin Based Liquid Soldering Fluxes
Flux
Rosin/Resin Bas
SolderingTemperature Range
Metallization
To Be Soldered
Activation
Solids Content
Water Resistivity
Extract (ohm-cm)
Specific Gravity
Boiling Point
Flash Point
IPN
Thinner#5R
Heat Stabilized Resin#5RMA
Heat Stabilized Resin#5RA
Heat Stabilized Resin

125ºC - 350ºC

125ºC - 350ºC

125ºC - 350ºC

Au, Ag, Pt,
Pd, Clean Cu
None Added
47%

Au, Ag, Pt, Pd,
Clean Cu, Sn, Solder Plate
Mildly Activated46%

Ni, Rh, Cd, Brass, Bronze
BeCu, Pb, Oxidized Cu
Fully Activated44%>100,000>100,000>50,000

.90
84°C
11°C
84072

.91
.88
84°C
84°C
11°C
11°C
84032
84039
#8300 (Part Number 84041) - all fluxes

All information is for reference only. Not to be used as incoming product specifications.

Flux RemovalStandard Packaging

Since the post solder residues of types R and RMA
fluxes are considered non-corrosive, non-conductive andnon-hydroscopic, flux removal is not usually necessary.
If cleaning is desired this is best accomplished with acommercially available flux residue remover.

These liquid soldering fluxes are packaged in 2
different size plastic containers:•1 U.S. pint (0.473 liter)•1 U.S. gallon (3.785 liter)

Best practice is to always remove RA residues inelectronics applications.

NC-506 Flux
Features• Suitable for Pin-Grid Array and standard Ball
Grid Array applications• Excellent solderability to all common surface
metallizations• No-clean residue• Can be used for printing, dipping, and pintransfer deposition• Offers high yields in BGA bumping process• Suitable for both Pb-Free or Sn/Pb applications

Introduction
Ball Attach Flux NC-506 is a low viscosity
thixotropic no-clean flux designed for use in ball
attachment to substrates (BGA manufacturing). It isespecially useful in applications requiring soldering
to surface finishes with tenacious oxides, such as
nickel. It can also be used wherever a no-clean ball
attach flux is needed, and is suitable for a variety
of different deposition methods.

Properties
		
Value
Test Method
Flux type Classification: ROL1
J-STD-004 (IPC-TM-650:
			
2.3.32 and 2.3.33)
Typical Viscosity:
320kcpsBrookfield HB DVII+-CP
			(5rpm)SIR (ohms, post cleaning): Pass (>109 after 7 days @ J-STD-004 (IPC-TM-650:
		85ºC & 85% RH)
2.6.3.3 IPC-B-24
Typical Acid Value:
103mg KOH/g
Titration
Typical Tack Strength:
250g
J-STD-005 (IPC-TM-650:
			
2.4.44)
Shelf Life:
6 months (-20°C to +5°C)* Viscosity change/			
microscope examination		information is for reference only. Not to be used as incomingAllproduct specifications.

TIM@indium.com

12

Fluxes
WS-366 Interconnect Flux
Benefits• Excellent cleanability, residue can be removed withroom temperature water• Can be used for printing, dipping, and pin transfer
deposition• Offers high yields in BGA bumping process• Excellent solderability• Wide process window• Suitable for Sn/Pb, Pb-Free, and high lead-containing
applications• Designed for Flip-Chip applications

Introduction
WS-366 Interconnect Flux is a high viscosity paste-type
flux designed for use in BGA bumping and board levelattachment. It can also be used wherever a water-soluble
flux with excellent cleanability is desired.

Properties
Flux type Classification:
Color:
Stencil Life:
Shelf Life:
SIR (ohms, post cleaning):
Typical Viscosity:
Brookfield:
Halide Content:
Acid Value:
Tack Strength:

H1Amber to brown>8 hours at room temperature
3 months at 0 to +30°C
Pass (>109 after 7 days @ 85ºC & 85% RH)
425 kcps at 5rpm
<3% Cl equivalent
30-50
100-400g

All information is for reference only. Not to be used as incoming
product specifications.

Fluxless Soldering
Some applications are very sensitive to the use of a flux due
to the post reflow residue that may be present. Also, flux may
be a problem in a vacuum environment or in an application inwhich it must be free of corrosive or volatile materials.
If gold is used for the outer metalization on the parts to bejoined, acceptable wetting may be possible without the useof a flux. If this is not possible, a reducing atmosphere may
be used to remove the oxides and result in sufficient wetting.
Below are suggestions and helpful hints for choosing a
reducing atmosphere that fits your application.
• Common reducing atmospheres are:88% nitrogen, 12% hydrogen
90% nitrogen, 10% hydrogen
95% nitrogen,   5% hydrogen
100% hydrogen• The higher the reflow temperature the more effective theoxidation removal using a reducing atmosphere. A reflow
temperature that is 350°C and above is the best foroxide removal.

www.indium.com/TIM• Nitrogen or argon is sometimes used in fluxless
soldering because it prevents the formation of oxides
during reflow. However, these gases do not remove
preexisting oxides on the metalization, only thehydrogen can do that.
Fluxless soldering is also used when joining the two
substrates together where flux residue would be detrimental
to the operation of the final product. For example, voiding
due to flux entrapment can result in poor performance
because of reduded electrical or thermal conductivity.
In an application where a reducing atmosphere is notpractical, two or more metalizations can be joined using
flux in the initial pre-coating of the substrates. After precoating is complete, the flux residue can be removed using
an appropriate solvent. The cleaned parts can then beassembled without a flux and reflowed a final time to join
them. This method is especially effective when fairly large
pieces need to be joined and flux entrapment can not betolerated.

13

Metal Thermal Interface Materials
Bonding Non-Metallic Materials
Using Indium and High Indium Alloys
Application

Bonding Procedure

A unique property of indium is that it will wet and bond tocertain non-metallics such as glass, glazed ceramics, mica,
quartz and various metallic oxides.

Apply indium to the heated non-metallic using an indium-plated
nickel felt applicator. Rub gently until the non-metallic is
coated with a thin film of indium.

Metal/Alloy Selection

Surface Preparation
Before bonding, thoroughly clean the non-metallic substratewith a strong alkaline cleaner. Rinse with distilled water andrinse again with electronics grade organic solvent, such asacetone. In the case of glass, quartz or glazed ceramics,
adhesion is enhanced by heating the material to about
350°C, then cooling to about 200°C.

To bond a non-metallic substrate to a metallic substrate,precoat the non-metallic surface with indium as describedabove. Precoat the metallic surface with the same indium
alloy as used on the non-metallic surface, using anappropriate flux. Completely remove the flux residue. Bring
the two precoated surfaces in contact with each other andreflow at 20-30°C over the liquidus temperature of the solder
used to precoat.
In most cases, ultrasonic energy, like that generated by an
ultrasonic soldering iron or pot, is effective in promoting
wetting of the surface. Bond strengths of 400-700 PSI are
typical of this technique.

The following list of four alloys are recommended for bonding non-metallic materials. The melting
temperatures and some of the properties of the individual alloys are also listed.

Indalloy
Number# 1E

Liquidus

SolidusTensileStrength
PSI

118°C

E

1720

Electrical
Conductivity% of IACS
11.7

ThermalCoefficientof Expansionµ in/in/°C
@20°C
20

ThermalConductivity
W/m•K
@85°C
34

Composition

52In 48Sn

#3

237°C

143°C

1650

22.1

15

67

90In 10Ag

#4

157°C

MP

273

24.0

29

86

100In

# 290

143°C

E

800

23.0

22

73

97In 3Ag

E= Eutectic, MP= Melting Point

TIM@indium.com

Application Notes

Indalloy #4 (100% indium) and Indalloy #1E (52In48Sn)
exhibit the best wetting quality on non-metallics. Indalloy #3(90In10Ag) and Indalloy #290(97In3Ag) exhibit slightly lower
wettability, but higher strength, due to the hardening effect of
the silver present.

To bond two non-metallic substrates together, precoat eachsurface with indium as described above. Bring the two
precoated substrates in contact with each other and reflow
at 20-30°C over the liquidus temperature of the solder used
to precoat.

14

Metal Thermal Interface Materials
Designing a sTIM
For Worst Case Bondline Thickness
Contact area in a thermal interface is a key consideration,
especially in real-world applications involving surfaces thatare not ideal.

Application Notes

Typical flip-chip die surfaces on laminate packages canvary .001”/.4”(1cm), and the same is true with lidded
components. Most of this variation occurs because ofstresses imparted during the attachment of the die or
package. On the heatsink side, manufacturing methods vary
– as does surface planarity. The first part of planning thedesired thickness of your thermal interface material (TIM) is
to determine a stack-up dimension of tolerances. Take into
account maximum surface variations at ambient conditions
and during operational temperatures (including burn-in) tocompensate for the least ideal assembly that is possible
from your procedure.
Assembly can also increase the gap between the heatgenerating component and the lid or heat sink. For instance,
on a 1cm die, 1° of misalignment creates a gap of .007”(Refer to Fig.#2). Misalignment needs to be filled with athermal interface material for proper conduction.

Finally, it is important to make sure there is some TIM
between the two interfaced surfaces at the closest point.
It may be necessary to add .001” of sTIM thickness to thepreviously estimated stack-up thickness. Even an ideally flat,aligned interface should have a .001” sTIM bondline.

Suggested Preform Thickness(1cm x 1cm interface)
Die Curvature(μm)

Lid Curvature (μm)

Misalignment (μm)

Suggested Thickness (μm)

10

10

10

60-90

10

10

30

80-10010303090-11030

1030

90-110101050100-130

10

30

50

110-140

30

10

50

110-140

30

50

80

180-200

50

50

80

200-230

Less roughness, less curvature, smaller area and reduced
CTE will enable a thinner bondline.

Fig.#1 Heatsink/Board WarpFig.

www.indium.com/TIM

Fig.#2 Compound Warp/Alignment

15

Etching Indium to Remove Oxides
The formation of metal oxides on indium is selfpassivating. A thickness of 80-100 Angstromsof oxide is all that will form on the surface.
Prior to using indium in a sealing or cold
welding application, it is recommended that
this oxide layer be removed. Here is therecommended procedure for oxide removal:

2. Mildly etch the indium surfaces in asolution of 5-10% hydrochloric acid (byvolume) at room temperature for 1 to 5
minutes, depending on oxide thickness,
until surface appears bright. This willremove the 80-100 Angstroms of oxidethat form on the surface.

4. Rinse off the water with acetone (preferred)or isopropyl alcohol.
5. Blow-dry with dry nitrogen.
Note: Because this procedure slightly etches
the metallic surface, exposing a larger surface
area to oxidation, only the indium that is going to
be used immediately should be cleaned by thisprocedure. Return any unused, etched indium tostorage under nitrogen or argon.

Indium Cold Welding
Indium has the unique ability to cold weld toitself.  If the surfaces have been coated withindium (minimum 0.002”-0.003”), they can bejoined by following this procedure:
1. Degrease the indium with an organic
solvent, such as acetone, to remove anyorganic contaminants that may be on thesurface.
2. Mildly etch the indium surfaces in asolution of 5-10% hydrochloric acid (byvolume) at room temperature for 1 to 5
minutes, depending on oxide thickness,
until surface appears bright.  This willremove the 80-100 Angstroms of oxidethat form on the surface. [Indium isself-passivating and will form an oxide
layer that is only 80-100 Angstroms thick.  
The oxide, once removed, will reform to
the 30-40 Angstroms level immediately
and to the 80-100 Angstroms level in
about 3 days. This oxide layer reduces
indium’s ability to cold weld.]
3. Thoroughly rinse twice in DI water.
4. Rinse off the water with acetone(preferred) or isopropyl alcohol.

Indium ribbon being etched in thehydrochloric acid solution for 1
minute to remove oxide layer.

Etched indium ribbon woundback on itself and coldwelded to form a loop.

Pure indium ribbon withnormal oxide layer of
80-100 Å (formed atroom temperature inambient conditions).

5. Blow-dry with dry nitrogen.
6. A mild pressure is all that is usually required
to join the indium surfaces together.
7. Use caution to properly align the indium
before joining, as they will not easily
separate without damaging the joint. They
will stick like contact cement.

TIM@indium.com

Application Notes

1. Degrease the indium with an organic
solvent, such as acetone, to remove anyorganic contaminants that may be on thesurface.

3. Thoroughly rinse twice in DI water.

16

Metal Thermal Interface Materials
Material

Technical Specifications

Diamond
SiC
Ag
Cu
Au100
Au
BeO
Al
AlN
W
Zn
Ni
Fe
In100
In97 Ag3
Sn100
Pd
Pt
In90Ag10
In90 Ag10
Sn
Sn91 Zn9
Au80 Sn20
Sn77.2 In20
Ag2.8
Sn62.5
Pb36.1
Ag1.4
Sn63 Pb37
Sn60 Pb40
Sn62 Pb36
Ag2
Sn50 Pb50
Sn70 Pb18
In12
Pb60 Sn40
Au88 Ge12
Sn40 Pb60
In80 Pb15
Ag5
Pb70 Sn30
In70 Pb30
Pb80 Sn20
Pb100
In52 Sn48
In50 Sn50
Sn96.5
Ag3.5
Sn60 Bi40

ThermalThermalConductivity Conductivity
SolidusIndalloy W/m•K at W/m•K at Liquidus
300K
85C(C) MP/E (C)
Number1300-2400
611
429
401
200

4
290
128

318
317
250
240
200
180
116
91
84-90
82

86
73
73

1064

156.7
143.3
232

MP

MP
E
MP

143.3

72
72
67
3

67

237

61
57

199
280

54

187

143

66
201
182

57

227
104
106
109

50.9
49.8

E
E

199
280
175

50

179

E

179

50
49

183
191

E

183
183

49
116

48

212

183

9

46.7

45

167

154

130
183

44
44

238
356

183
356

43

154

149

41
38
37
35
34
34

257
175
280
327
118
125

183
165
183

33

221

30

170

44
43.6

2
141
204
149
170
1E
1

40.5

121

33

37.4
35

281-338

E

MP
E
E

118
118
221
138

Material
In60 Pb40
Sn95 Sb5
Pb88 Sn10
Ag2
Au96.76
Si3.24
Pb90 Ag5
Sn5
Pb92.86
In4.76Ag2.38
Pb90 Sn10
Pb89.5
Sn10.5
Pb90 In5
Ag5
Pb92.5 In5
Ag2.5
Sb
Pb37.5
Sn37.5 In25
Pb97.5
Ag1.5 Sn1
Pb95 Sn5
Pb94.5Ag5.5
In50 Pb50
Pb95 In5
Bi58 Sn42
Pb60 In40
Pb75 In25
Pb81 In19
Alloy 42
Bi52 Pb30
Sn18
Boron
Nitride filled
Silicone
Bi55.5
Pb44.5
SolverFilled Phase
ChangeAg - Filled
Die Attach
Molding
Compounds
BT Epoxy
FR-4
Air

ThermalThermalConductivity Conductivity
SolidusIndalloy W/m•K at W/m•K at Liquidus
300K
85C(C) MP/E (C)
Number
205
133

29
28

181
240

173
235

228

27

290

267

184

27

363

E

155

25

292

MP

6

25

300

MP

25

302

275

242

25

302

275

12

25

310

290

25

310

300

23

181

134

23

309

23

312

308

23

365

304

22
21
19
19
18
17

210
313
138.3
231
260
275

184
300
138.3
197
240
260

13

96

E

96

4

124

E

124

159

28

35.8

164

363

24
5
165
171

35.2

229
7
11
281
206
10
150

35

E

E

309

15.6
39
6
255
3.0 - 8
1.3 - 5
0.6 - 0.7
0.19
0.11
0.03

Typical Indium Applications
Indium, the 49th element, was discovered in Germany
in 1863. In 1934, Indium Corporation of America was thefirst to begin commercial development of indium, and is
still the leading refiner, fabricator, and marketer of thisversatile silver-white metal. Indium is used in a wide
variety of applications, based on its unique attributes.

Soldering
When indium is included in solder compositions, many
advantages are realized. Compared to conventional
tin-lead solders, indium alloys exhibit lower crack
propagation and improved resistance to thermal fatigue.
Indium will reduce gold scavenging that can occur withwww.indium.com/TIM

tin-based solder on gold or gold-plated parts. Its ductility
will allow some materials with different coefficients ofthermal expansion to be joined together. In spite of themetal’s softness, it can strengthen materials it is alloyedwith.

Bonding
The unique properties of indium make it an ideal bonding
material, especially when bonding non-metals such as
quartz, glass, and glazed ceramics. Indium can also becold welded to itself. It easily deforms under pressure
and will fill voids between two surfaces, even at cryogenic
temperatures.

17

Structure  

Electrical Properties

Face centered tetragonal at 25°C:  
a = 0.32525 nm and c = 0.49465 nm

Electrical resistivity:
°C
		
20
154
181
222
280

Mass Characteristics
Atomic weight:

114.82

Electrochemical equivalent:Electrode potential:
Electronegativity:

Magnetic Properties
Magnetic susceptibility, Volumetric:  7.0 x 10 -6 mks

Thermal Properties

Nuclear Properties

Melting point:
156.6°C
Boiling point:
2080°C
Coefficient of thermal expansion:
Linear, 24.8µm/m•K at 20°C

Natural isotope distribution:
Mass Number
113•115
115

Specific heat:
°C
25
127
156.63 (solid)
156.63 (liquid)
227
327
427
Latent heat of fusion:
Latent heat of vaporization:
Thermal conductivity:

Thermal neutron cross section
For 2.2 km/s neutrons:

Vapor pressure:
°C
1215
1421
1693
2080

J/kg•K
233
252
264
257
256
255
254

Valence 3, 396.4µg/C
In0gIn 3+ + 3e, 0.38V
1.7 Pauling’s

%
4.3
95.7
absorption,190± 10b;
scattering, 2.2± 0.5b
3 also 2 and 1
0.157nm49
4.12eV
Kr4d 10 5s 2 5p 1
133k-cal/g-mole

Valences shown:
Atomic radius/Goldschmidt:
Atomic number:Photoelectric work function:
Electronic structure:
First ionization energy:
28.47 kJ/kg
1959.42 kJ/kg
83.7 W/m•K at 0°C

kPa
0.1013
1.013
10.13
101.3

Low-Temperature Alloys
Indium is also the basis for many low melting point fusible
alloys. These alloys are often used to hold products, suchas eyeglass lenses or turbine blades, while the products
are being worked on. Then the alloy can be removed withminimal heat, keeping the product from being damaged.
Indium  is also used with gallium to create alloys that are
liquid at room temperature.

Thin Films
Thin films of indium-tin oxide (ITO) on clear glass orplastic function as transparent electrical conductors and/Mechanical Properties
Tensile strength:
K
295
76
4
Compressive strength:
Hardness:
Elastic modulus at 20°C:
Poisson’s at 20°C:
Bulk modulus:
Tensile modulus:

MPa
1.6
15.0
31.9
2.14 MPa
0.9HB12.74 GPa in tension
0.449835.3 GPa
10.6 GPaor infrared reflectors. Typical uses of thin films of ITO
include LCD flat panel displays, touch screen CRT’s,
EL lamps and displays, EMI shields, solar panelsand energy efficient windows. Aircraft and automobile
windshields are coated with ITO for demisting anddeicing. Other indium chemicals are used in alkaline
batteries, replacing toxic mercury compounds.

High-Purity Indium
High-purity indium (99.9999 and 99.99999) is used in
III-V compound semiconductors such as laser diodes.

TIM@indium.com

Physical Constants

Density:
°C
gm/cc
20
7.30
164
7.026
194
7.001
228
6.974
271
6.939
300
6.916
Volume change on freezing, 2.5% contractionnΩ-m
3.38 K — Super conducting
84
291
301
319
348

18

Technical Support
Indium’s Process Simulation Lab
provides Applications Engineers with the tools
to work with you and industry partners on
designed experiments to fully characterize SMT
assembly materials and their use in leadingedge technology applications, including:• Solder Paste Response-To-Pause Testing andTransfer Efficiency Calculations• Voiding Analysis and Characterization on BGA
and CSP Components Using Solder Paste,
Epoxy Flux, and
No-Flow Underfill
Materials in
Micro Via-In-Pad
Applications• Feasibility Studies for
New Technologies
and Materials• Reflow Profile
Optimization

Indium’s Process Simulation Lab Capabilities:• Stencil Printing• Precision Syringe
Dispensing• Fully Automated 3D
Solder Paste Inspection• Component Placement• Acoustic Microscope
Inspection• Temperature-Humidity-Bias
Testing (SIR & ECM)
• MechanicalStrength Testing• Forced Air Convection andInfrared Reflow• TG/DTA & DSC Analysis• Wave Soldering• Thermal Cycling• X-Ray Analysis• And More...

• Wetting Balance Testing

Technical Support—When You Need It.
You have challenges, opportunities, and new processes to address.
Indium’s technical expertise is available in several forms:

Online Support:

Phone and Email:• Powerful, Interactive,• Personal Service
Online Technical Knowledgebase • Customized Information• See Technical Support Directory• http://knowledge.indium.com• Available 24/7

Training Workshops:• Customer-Rated Answers• General or Specific Training• Your Site or Off-Site• Customized to Meet Your Needs

www.indium.com/TIM

Site Visits:• Total Focus on
YOUR Issues• Spotlight onYour Process19Technical Support Directory
Asia PacificnnRichard Brooks
Tel: +1 817 528 3697
MANAGER of Technical Services
Fax: +65 6268 5646
rbrooks@indium.com			
Yong-Kwang Chia
TECHNICAL MANAGER
ykchia@indium.com

nNorth America

Sze-Pei Lim

n

B
n
S
Tel: +65 6268 8678 n
Fax: +65 6268 5646
Mobile: +65 9842 7593 n
GS
Tel: +60 12 289 6560 nnArea TECHNICAL Manager	Fax: +65 6268 5646
splim@indium.com			

S
n
G
n
S
n Damian Santhanasamy Tel: +60 17 465 2071 n
TECHNICAL ENGINEER
Fax: +65 6268 5646
dsanthanasamy@indium.com
Mobile: +60 17 416 5814 n
GSn Mario Scalzo
Tel: +65 6305 0139
n
TECHNICAL SUPPORT ENGINEER
Fax: +65 6268 5646
mscalzo@indium.com			
BnSn Grace Soh
Tel: +65 9336 6389 n
TECHNICAL ENGINEER
Fax: +65 6268 5646
gsoh@indium.com			
G
n

n

China

n

n

Sehar Samiappan

Assistant TECHNICAL Manager
ssamiappan@indium.com

nGulf Guo

Tel: +60 4587 1766
Fax: +60 4587 1766
Mobile: +60 12 483 9314

Wisdom QunAndy Wei

Tel: +86 (0)136 096 20615

TECHNICAL SERVICE ENGINEER
awei@indium.com
nMartin Wen
Aaron Yan
Derek Wang

TECHNICAL PROJECTS MANAGER
mfenner@indium.com

Tel: +86 (0)138 127 39985
nnDavid McKeen

Cristian Tudor
TECHNICAL SUPPORT ENGINEER
ctudor@indium.com

nTel: +44 1908 580401
Fax: +44 1908 580411

Tel: +1 315 853 4900  x7594
TECHNICAL SUPPORT ENGINEER
Fax: +1 315 853 1000
NORTHEAST U.S.
ebriggs@indium.com			Ivan Castellanos

Tel: +52 333 441 4009
TECHNICAL SUPPORT ENGINEER
Fax: +52 333 670 5106
MEXICO
icastellanos@indium.com			Jim Hisert

Tel: +40 723 171 398
Fax: +40 256 491 008
		Graham Wilson

Confidentiality
Indium Corporation recognizes the importanceof confidentiality in the design of solutions. Asa trusted partner, our engineers will work withyou to help you find the right solution for yourassembly problems. We can help you find theright alloy for performance and the best solder
form for ease of assembly.

Ning-Cheng Lee, Ph.D.

Tel: +1 315 853 4900  x7592
Fax: +1 315 853 1000

B
n

G
n

Tel: +1 315 853 4900  x7541
VICE PRESIDENT, TECHNICAL SUPPORT, Fax: +1 315 853 1000
Metals & Chemicals
jslattery@indium.com

PRINCIPAL APPLICATIONS ENGINEER
psocha@indium.com

Tel: +1 315 853 4900  x7570
Fax: +1 315 853 1000

S
Karthik Vijayamadhavan Tel: +1 315 853 4900  x7519 n
TECHNICAL SUPPORT ENGINEER
Fax: +1 315 853 1000
WESTERN U.S.
Mobile: +1 315 534 1360
kvijay@indium.com			nSn

Tel: +1 315 853 4900  x7613
Fax: +1 315 853 1000  

Tel: +1 315 853 4900  x7521
TECHNICAL SUPPORT ENGINEER
Fax: +1 315 853 1000
MIDWEST U.S.
cnash@indium.com			Paul Sochan

Tel: +1 508 930 2242
Fax: +1 508 533 5678

Christopher Nashn

Tel: +44 1908 580401
Applications Engineer
Fax: +44 1908 580411
gwilson@indium.com			GnFax: +1 315 853 1000

Ronald C. Lasky, Ph.D., PE

James Slattery

S
n

G
n
S
n

Tel: +1 315 853 4900  x7689
TECHNICAL SUPPORT ENGINEER
Fax: +1 315 853 1000
Southwest/Rocky Mountains U.S.
bjudd@indium.com

n

n

G
n

Edward Briggs

VICE PRESIDENT TECHNOLOGY
nclee@indium.com

Tel: +86 (0)138 127 99637

Tel: +44 1506 412087 S
CONTINENTAL PCBA SPECIALIST
Fax: +44 1506 414857
dmckee@indium.com		

nSn

Tel: +1 315 853 4900  x7504
TECHNICAL SUPPORT ENGINEER
Fax: +1 315 853 1000
SOUTHEAST U.S.
ebastow@indium.com			

SENIOR TECHNOLOGIST
rlasky@indium.com

EuropeMichael Fenner

Eric Bastow

Frank Komitsky Jr., Ph.D., PE Tel: +1 315 853 4900  x7539

n

TECHNICAL SERVICE ENGINEER
dwang@indium.com

n

B
n

n

Tel: +86 (0)139 237 08051

TECHNICAL SERVICE ENGINEER
ayan@indium.comnSn

Tel: +1 315 853 4900  x7556
TECHNICAL SUPPORT ENGINEER
Fax: +1 315 853 1000
(HQ-BASED)
canglin@indium.com			

MARKET MANAGER
fkomitsky@indium.com

TECHNICAL SERVICE ENGINEER
mwen@indium.com
nChris Anglin

Brandon Judd

TECHNICAL SERVICE ENGINEER
wqu@indium.com
n

G
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