3M™ Trizact™ CMP Pads

RedefiningCMP.
Designed to deliver
predictable, stable, consistent
performance to your Chemical
Mechanical Planarization
process – every time.

Advanced performancefor your advanced nodes.

With trends like IoT, smart cities, connected

Our Trizact CMP Pads blend 3M’s knowhow in molding, surface modification andmicroreplication, delivering an innovative
pad for CMP process for advanced node
semiconductor manufacturing.

transportation, mobile and edge computing driving• Uses precisely engineered three-our world, semiconductor devices that deliver morememory and speed are in demand. The pressure
is on to improve performance and cost-effective
consistency of the Chemical Mechanical Planarization(CMP) process of semiconductor manufacturing.
Demand to continually increase yield leaves no roomfor variation in a fab’s production that risks waste or
device reliability. 3M is redefining CMP products withour 3M™ Trizact™ CMP Pads to help ensure consistent
CMP process performance.

dimensional microreplicated asperities andpores to define the pad texture and help
ensure consistent performance pad-to-pad– meeting the demands of advanced node
CMP processes.

• Asperities and pores are arranged intoindependent unit cells to enable uniform
pressure across the wafer.

• Our highly controlled microreplication
process delivers repeatable and tunable
CMP pads.

Reduced variability andincreased repeatability– helping to deliver
improved yield.
Innovative groove design of the 3M™ Trizact™ CMP
Pad with independent unit cells — shown here asan optical microscope image.

Consistency.

Improved yield.

Designed to deliver the CMP
performance you need,
3M™ Trizact™ CMP Pads areengineered using our proprietary
microreplication process. The
result is a pad that is consistentand well characterized, helping toensure that tomorrow’s pad is thesame as today’s.

Consistent and repeatable
CMP performance helps leadto increased yield. Trizact CMP
Pads help increase planarization
efficiency, reduce defects, andimprove productivity and output.

• Uniformity in the polishingprocess• Consistent texture from padto pad• Improved planarization

efficiency to enable advanced
node CMP• Reduced dishing and erosion

Reducedconsumables.
Our proprietary approach to
microreplication helps to delivera longer pad life and eliminates
the need for a diamond padconditioner.

• Reduced metal contaminationrisk• Lower cost of ownership• Longer life, less downtime• Less pad debris for fewer
defects• Stability through pad life

Visit us at 3M.com/TrizactCMP to learn more and connect with our experts.
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Electronics Materials Solutions Division
3M Center, Building 224-3N-11
St. Paul, MN 55144-1000 USA
Web www.3M.com/electronics
Phone 1-800-810-8513

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Issued: 6/19 15107HB60-5005-0154-3

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Used under license by 3M subsidiaries and affiliates.