Release Note

RZ/V2H AI Software Development Kit Version 4.00
Release Note

R11AN0840EJ0400
Version.4.00
31 May, 2024

Introduction
RZ/V2H AI Software Development Kit (AI SDK) is an AI application development environment for RZ/V2H
Evaluation Board Kit. This release note describes the contents of the RZ/V2H AI SDK.

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RZ/V2H AI Software Development Kit Version 4.00

Release Note

Contents
1.

Release Items.......................................................................................................................... 3

1.1

Name and Version ................................................................................................................................... 3

1.2

Target Board ............................................................................................................................................ 3

1.3

Features .................................................................................................................................................. 4

1.4

Related Software ..................................................................................................................................... 5

1.5

File Contents ........................................................................................................................................... 5

1.5.1

RZ/V2H AI SDK ..................................................................................................................................... 6

1.5.2

RZ/V2H AI SDK Source Code ............................................................................................................... 7

1.6Component .............................................................................................................................................. 72.

How to install and use AI SDK ................................................................................................. 8

Version History ............................................................................................................................... 9

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RZ/V2H AI Software Development Kit Version 4.00

Release Note

1. Release Items
The release items in the RZ/V2H AI SDK are as follows.

1.1

Name and Version
RZ/V2H AI Software Development Kit Version 4.00

1.2

Target Board
RZ/V2H Evaluation Board Kit (Secure type) [RTK0EF0168C04000BJ]

Note:

Any software support provided is for evaluation purposes only.

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RZ/V2H AI Software Development Kit Version 4.00
1.3Release NoteFeatures
This package provides standard components necessary to develop AI applications.
1.

RZ/V2H AI SDK⚫

Provided as RTK0EF0180F04000SJ.zip.

⚫

SD Card Image Files
These are WIC image files (.wic.bmap and .wic.gz), which contains the followings for RZ/V2Hevaluation Board Kit.
✓Bootloader✓

Linux Kernal Images✓

Linux Device Tree✓

Linux Root Filesystem

User can use the WIC image files to easily create a SD Card to boot the Linux on RZ/V2HEvaluation Board Kit.
User must prepare the SD card with a capacity of 16GB or larger for write these WIC image files tothe SD card.
⚫

Cross Compiler
This is a compiler for Linux application, which runs on RZ/V2H Evaluation Board Kit.

⚫

RZ/V2H AI SDK Installer
This is an installer for AI application development environment, which runs on Docker.
It includes DRP-AI Translator i8 v1.01 installer.

2.

RZ/V2H AI SDK Source CodeProvided as RTK0EF0180F04000SJ_linux-src.zip.

⚫

Yocto Linux Recipe
This is the Linux source code of RZ/V2H AI SDK.

1.4

Major updates•

Supported DRP-AI TVM v2.2.1.

•

Increased free space on the Linux Root Filesystem to approximately 10 GB.

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RZ/V2H AI Software Development Kit Version 4.00
1.5

Release Note

Related Software
DRP-AI TVM v2.2.1
https://github.com/renesas-rz/rzv_drp-ai_tvm/tree/v2.2.1

1.6

File Contents
Files contained in AI Software Development Kit is based on following software.
•

RZ/V2H DRP-AI Driver v1.00➢

GitHub Link: https://github.com/renesas-rz/rzv2h_drp-ai_driver/tree/V1.00•RZ/V2H Graphics Library Evaluation Version v1.2.1•

RZ/V2H Video Codec Library v3.0.0•

RZ/V2H OpenCV Accelerator v1.00 (supporting OpenCV 4.1.0)•➢

GitHub Link: https://github.com/renesas-rz/rzv2h_opencv_accelerator/tree/V1.00➢

OpenCV GitHub Link: https://github.com/opencv/opencv/tree/4.1.0

Tesseract v3.05.01 (tesseract, tesseract-lang)Please refer to the section 1.7 Component regarding the Linux kernel version and components.

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RZ/V2H AI Software Development Kit Version 4.00
1.6.1

Release Note

RZ/V2H AI SDKTable 1-1 RZ/V2H AI SDK Contents list shows the file contents of RTK0EF0180F04000SJ.zip.
Table 1-1 RZ/V2H AI SDK Contents list
Contents
r11an0840ej0400-rzv2h-ai-sdk.pdf
board_setup
eSD.zip
core-image-weston-rzv2h-evk-ver1.wic.bmap
core-image-weston-rzv2h-evk-ver1.wic.gz

ai_sdk_setup
poky-glibc-x86_64-core-image-weston-aarch64-rzv2hevk-ver1-toolchain-3.1.26.sh

Explanation
This document
Files required for booting the board.
Bootloader for eSD
SD Card image files containing the followings forRZ/V2H Evaluation Board Kit.
✓ Bootloader✓ Linux Kernel Image (The boot program)✓ Linux Device Tree File (The configuration filefor booting)✓ Linux Root Filesystem
Files required for installing RZ/V2H AI SDK on
Ubuntu PC.
Application cross compiler installer.

Dockerfile

Dockerfile for installing RZ/V2H AI SDK

DRP-AI_Translator_i8-v1.01-Linux-x86_64-Install

DRP-AI Translator i8 installer

references
linux_licenses.zip
core-image-weston-rzv2h-evk-ver1.manifest
documents

Reference information
Linux license information. Referred by Linux
License List.
Manifest file that contains software component
information.
Related documents

r20ut5336ej0101-drp-ai-translator-i8.pdf

DRP-AI Translator i8 User's Manual(Document only for DRP-AI Translator i8 user)

r20ut5184ej0102-drp-ai.pdf

DRP-AI Quantizer User’s Manual(Document only for DRP-AI Translator i8 user)

r11an0841ej0400-rzv2h-ai-sdk(Linux License List).pdf

List of license information included in Linux files
and application cross compiler. Copyrightinformation is not included.

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RZ/V2H AI Software Development Kit Version 4.00
1.6.2

Release Note

RZ/V2H AI SDK Source CodeTo see the file contents of RTK0EF0180F04000SJ_linux-src.zip, please refer to README.txt included inthe package.
For more information on RZ/V2H AI SDK Source Code, please refer to following web page.
https://renesas-rz.github.io/rzv_ai_sdk/4.00/howto_build_aisdk_v2h.html

1.7

Component
Table 1-2 Component list

Component
Yocto Linux
OpenCV
OpenCL

OpenGLES
OpenMAX ILVersion
Yocto version: 3.1.26 (Dunfell)
Kernel version: 5.10.145-cip17
4.1.0
1.1, 1.2, 2.0 Full Profile.
3.0 Full Profile

1.1, 2.0, 3.0, 3.1 and 3.2
1.1

Explanation

This is not guaranteed to bebackwards compatible with theprevious versions of OpenCL.
This is used for H.264 encoding.

Other components installed to the root filesystem are listed in the below manifest file.
Please refer to “references/core-image-weston-rzv2h-evk-ver1.manifest”

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RZ/V2H AI Software Development Kit Version 4.00

Release Note

2. How to install and use AI SDK
Please see the RZ/V AI SDK GitHub pages (https://renesas-rz.github.io/rzv_ai_sdk/4.00/).

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RZ/V2H AI Software Development Kit Version 4.00

Release Note

Version History
Ver.
3.00
4.00

Date
29 Feb, 2024
31 May, 2024

DescriptionPage
SummaryIssued.
Supported DRP-AI TVM v2.2.1Increased free space on the Linux Root Filesystem toapproximately 10 GB.

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General Precautions in the Handling of Microprocessing Unit and Microcontroller
Unit Products
The following usage notes are applicable to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usage notes on theproducts covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.
1.

Precaution against Electrostatic Discharge (ESD)
A strong electrical field, when exposed to a CMOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps
must be taken to stop the generation of static electricity as much as possible, and quickly dissipate it when it occurs. Environmental control must beadequate. When it is dry, a humidifier should be used. This is recommended to avoid using insulators that can easily build up static electricity.
Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test andmeasurement tools including work benches and floors must be grounded. The operator must also be grounded using a wrist strap. Semiconductor2.

devices must not be touched with bare hands. Similar precautions must be taken for printed circuit boards with mounted semiconductor devices.
Processing at power-on
The state of the product is undefined at the time when power is supplied. The states of internal circuits in the LSI are indeterminate and the states ofregister settings and pins are undefined at the time when power is supplied. In a finished product where the reset signal is applied to the external resetpin, the states of pins are not guaranteed from the time when power is supplied until the reset process is completed. In a similar way, the states of pins
in a product that is reset by an on-chip power-on reset function are not guaranteed from the time when power is supplied until the power reaches the3.

level at which resetting is specified.
Input of signal during power-off state
Do not input signals or an I/O pull-up power supply while the device is powered off. The current injection that results from input of such a signal or I/O
pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal

4.

elements. Follow the guideline for input signal during power-off state as described in your product documentation.
Handling of unused pins
Handle unused pins in accordance with the directions given under handling of unused pins in the manual. The input pins of CMOS products are
generally in the high-impedance state. In operation with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity ofthe LSI, an associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal

5.

become possible.
Clock signals
After applying a reset, only release the reset line after the operating clock signal becomes stable. When switching the clock signal during program
execution, wait until the target clock signal is stabilized. When the clock signal is generated with an external resonator or from an external oscillator
during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Additionally, when switching to a clock signal

6.

produced with an external resonator or by an external oscillator while program execution is in progress, wait until the target clock signal is stable.
Voltage application waveform at input pin
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL(Max.) and VIH (Min.) due to noise, for example, the device may malfunction. Take care to prevent chattering noise from entering the device when the7.

input level is fixed, and also in the transition period when the input level passes through the area between VIL (Max.) and VIH (Min.).
Prohibition of access to reserved addresses
Access to reserved addresses is prohibited. The reserved addresses are provided for possible future expansion of functions. Do not access these8.

addresses as the correct operation of the LSI is not guaranteed.
Differences between products
Before changing from one product to another, for example to a product with a different part number, confirm that the change will not lead to problems.
The characteristics of a microprocessing unit or microcontroller unit products in the same group but having a different part number might differ in termsof internal memory capacity, layout pattern, and other factors, which can affect the ranges of electrical characteristics, such as characteristic values,
operating margins, immunity to noise, and amount of radiated noise. When changing to a product with a different part number, implement a systemevaluation test for the given product.

Notice1.

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“Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
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