User’s Manual
ISL91301BII-L-EV1Z, ISL91301BII-H-EV1Z
User’s Manual: Evaluation Board

Core Power Solutions

Rev 0.00

Apr 2018

USER’S MANUAL
ISL91301BII-L-EV1Z, ISL91301BII-H-EV1Z
Evaluation Board

1.

UG140
Rev.0.00
Apr 4, 2018

Overview

The ISL91301BII-L-EV1Z and ISL91301BII-H-EV1Z platform allows quick evaluation of the high performancefeatures of the ISL91301B multi-output PMIC, which has four controllers capable of configuring its power stages for
1+1+1+1 channel outputs. Each channel can deliver up to 4A per phase continuous output current for a 2.8V ~ 5.5V
supply voltage, and 3A per phase current for a wider 2.5V ~ 5.5V supply voltage. The ISL91301B uses R5™
modulator technology to maintain accurate voltage regulation, while providing excellent efficiency and transient
response. It also supports the standard I2C and SPI communication protocols, ideal for systems using a single-cellbattery.

1.1

Key Features• Small, compact design• Supports both I2C and SPI bus communication protocols• Adjustable VOUT and independent DVS control for all four channels• Real-time fault protection and monitoring (OC, UV, OV, OT)• Six layer board design optimized for thermal performance and efficiency• Connectors, test points, and jumpers for easy measurements• Built-in load transient circuits for each output channel

1.2

Specifications

The board operates at the following conditions:• ISL91301BII-L-EV1Z (VIN_SEL = GND)
• Input voltage rating from 2.5V to 5.5V
• 1+1+1+1 configuration with 3A maximum load current/phase• ISL91301BII-H-EV1Z (VIN_SEL = AVIN)• Input voltage rating from 2.8V to 5.5V
• 1+1+1+1 configuration with 4A maximum load current/phase• Programmable output voltage range of 0.3V to 2V• 4MHz default switching frequency• DVS slew rate of 2.5mV/µs• Power-up sequence: Buck1→Buck2→Buck3→Buck4, 1ms delay between each rail
• Power-down sequence: Buck1, 2, 3, and 4 power down at the same time
• Operating temperature range: -40°C to +85°C• VOUT1, 2, 3, and 4 = 0.9V

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1.3

1. Overview

Ordering Information
Part Number

Description

ISL91301BII-L-EV1Z

Evaluation board for ISL91301BII
VIN_SEL = GND
VIN = 2.5V to 5.5V
Max Current = 3A per phase

ISL91301BII-H-EV1Z

Evaluation board for ISL91301BII
VIN_SEL = AVIN
VIN = 2.8V to 5.5V
Max Current = 4A per phase

1.4

Related Literature

For a full list of related documents, visit our website• ISL91301B product page

1.5

Block Diagrams

2.5V to 5.5V
2.5V to 5.5V

43

MPIO<3:0>

GPIO<1:0>

INT

WDOG_RST

AVIN

VOUT1

PVIN_A

PH_D

VOUT1 (3A)

RTN1
PVIN_B

VOUT2
PH_B

PVIN_CISL91301BIIZ

RTN2
VOUT3

PVIN_D

PH_A
VIN_SEL
1.5V to 5.5V

EN

1.8V

VIO

VOUT2 (3A)

VOUT3 (3A)

RTN3
VOUT4
PH_C

AVIN_FILTGND

PGND_A

VOUT4 (3A)

RTN4
PGND_BPGND_CPGND_D

Figure 1. ISL91301B 1+1+1+1 Block Diagram (3A/Phase, VIN_min = 2.5V)

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ISL91301BII-L-EV1Z, ISL91301BII-H-EV1Z

2.8V to 5.5V
2.8V to 5.5V

1. Overview

4

3

MPIO<3:0>

GPIO<1:0>

INT

WDOG_RST

AVIN

VOUT1

PVIN_A

PH_D

VOUT1 (4A)

RTN1
PVIN_B

VOUT2
PH_B

PVIN_CISL91301BIIZ

RTN2
VOUT3

PVIN_D

PH_A
VIN_SEL

AVIN
1.5V to 5.5V

EN

1.8V

VIO

VOUT2 (4A)

VOUT3 (4A)

RTN3
VOUT4
PH_C

AVIN_FILTGND

PGND_A

VOUT4 (4A)

RTN4
PGND_BPGND_CPGND_D

Figure 2. ISL91301B 1+1+1+1 Block Diagram (4A/Phase, VIN_min = 2.8V)

1.6

Contents

The evaluation board contains:• ISL91301BII-L-EV1Z or ISL91301BII-H-EV1Z evaluation board• Evaluation software• Mini USB I2C dongle with USB cable (ISLUSBMINIEVAL1Z)• All applicable documentation

1.7

Recommended Equipment• 0V to 10V power supply with at least 5A current sourcing capability (VIN SUPPLY BIAS)• 0V to 10V power supply with at least 1A current sourcing capability (VCC_6V SUPPLY BIAS)• Electronic loads capable of sinking current up to 5A• Digital multimeter• 500MHz quad-trace oscilloscope• Dual edge slew rate controllable signal generator• Differential probe (for load transient current measurement)

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2.

2. Functional Description

Functional Description

The ISL91301BII-L-EV1Z and ISL91301BII-H-EV1Z evaluation boards provide a simple platform to demonstrate thefunctionalities of the feature-rich ISL91301B PMIC. The board has a 0.9V output (default) on each of its output
channels after start-up and each output voltage can be programmed by the I2C/SPI. The evaluation board isfunctionally optimized for best performance, working harmoniously with the factory default tuning on the ISL91301B.
The input power and load connections are provided through multi-pin connectors for high current operations.
The ISL91301BII-L-EV1Z and ISL91301BII-H-EV1Z evaluation boards are shown in Figures 9 and 10. Table 1 lists
the evaluation board’s key test points and jumpers. The ISL91301B’s internal registers can be accessed by the I2C/SPI
through the on-board header J24 (SPI) and J42B (I2C).
Table 1. Description of Important Test Points and Jumpers
Test Point(s)J6(+), J7(-)

Description
Header for connecting VIN supply

J35(+), J65(-)

Buck1 header for connecting external load

J37(+), J58(-)

Buck2 header for connecting external load

J57(+), J36(-)

Buck3 header for connecting external load

J64(+), J38(-)

Buck4 header for connecting external load

J3

VIN Kelvin connection for efficiency measurements

J15

Buck1 VOUT Kelvin connection for efficiency measurements

J18

Buck2 VOUT Kelvin connection for efficiency measurements

J56

Buck3 VOUT Kelvin connection for efficiency measurements

J63

Buck4 VOUT Kelvin connection for efficiency measurements

TP1

VCC_6V supply for VIO LDO and load transient circuits

J60

Buck1 driver input for load transient circuit

J61

Buck2 driver input for load transient circuit

J62

Buck3 driver input for load transient circuit

J66

Buck4 driver input for load transient circuit

J52

Load transient current sense, 1A/10mV

J55

Load transient current sense, 1A/10mVJ59

Load transient current sense, 1A/10mV

J67

Load transient current sense, 1A/10mV

J24

Header for connecting to SPI interface

J42B

Header for connecting to I2C interface

SW1

Enable/disable IC

The evaluation software Graphical User Interface (GUI) window for the ISL91301B is shown in Figure 8 on page 10.
The schematics of the ISL91301BII-L-EV1Z and ISL91301BII-H-EV1Z evaluation boards are shown in Figures 13,
16, and 17. The PCB layout images for all layers are shown in Figures 18 through 25. The ISL91301BII-L-EV1Z and
ISL91301BII-H-EV1Z evaluation board bill of materials is shown in “Bill of Materials” on page 21.

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2.1

2. Functional Description

Operating Range

The ISL91301BII-L-EV1Z’s VIN range is 2.5V to 5.5V with 3A per phase IOUT range. The ISL91301BII-H-EV1Z’s
VIN range is 2.8V to 5.5V with 4A per phase IOUT range. The adjustable VOUT range for both versions is 0.3V to 2.0V.
The operating ambient temperature range is -40°C to +85°C.

2.2

Quick Start Guide

The default output voltage for the ISL91301BII-L-EV1Z and ISL91301BII-H-EV1Z evaluation boards is set at
0.9V for all four outputs. No jumper configurations are needed to power up the part into its default state. All thesettings and features are instead loaded through the one-time programmable memory inside the IC when minimum
bias conditions are met. Refer to the “Setup Guide” for information about powering up the board for proper
operation.

2.2.1

Setup Guide(1) Place scope probes on the VOUT test point and other test points of interest.
(2) Connect a power supply to J6 (VIN supply) and J7 (GND), with the voltage set between 2.5V and 5.5V.
This will bias the PVIN and AVIN pins of the IC, but no startup sequence has initiated and the quiescentcurrent should be less than 1mA.
(3) Connect a second power supply to TP1 (VCC_6V), with the voltage set to 6V. This will bias the VIO andChip Enable pin as well as the on-board load transient circuits. The ISL91301B will boot up its internalreference, load the default register settings, and initiate a power-on sequence by toggling SW1 to the“ENABLE” position. All four outputs should turn on in Pulse Skipping mode if there are no external loads
present, and VOUT should default to 0.9V.
(4) During the startup sequence, all four outputs should turn on sequentially, from Buck1 to Buck2 to Buck3
and then Buck4. Buck1 will turn on with a 1.4ms delay from the Chip Enable pin going high, while theother buck regulators will turn on 1ms apart.
(5) To initiate a shutdown sequence, toggle SW1 to the “DISABLE” position, and the ISL91301B will turn off
all the buck regulators at the same time.

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2.2.2

2. Functional Description

I2C/SPI Communication

The ISL91301B supports I2C communication by default. A USB to I2C communication dongle(ISLUSBMINIEVAL1Z) is included with each ISL91301BII-L-EV1Z or ISL91301BII-H-EV1Z purchase, and
the GUI will support this tool across all operating systems.
(1) To communicate with the ISL91301B through I2C, connect the USB to I2C dongle to J42B. Make sure R93
is present on the board, as it provides the pull-up from SPI_SS to 1.8V VIO supply.
Note: For the SPI communication option using the GUI, contact your local sales office.

Figure 3. Communication Dongle Connection

2.2.3

Efficiency Measurement(1) Connect a power supply at J6 (VIN supply), with the voltage set between 2.5V and 5.5V
(ISL91301BII-L-EV1Z) or a voltage between 2.8V and 5.5V (ISL91301BII-H-EV1Z). The current limit
should be set high enough to support the maximum load current with additional head room. If the power
supply supports remote sense lines, use a Kelvin connection on J3. Otherwise, connect a multimeter at J3.
(2) Apply 6V to TP1 (VCC_6V) to initiate the startup sequence and all four outputs will turn on. To get an
accurate single channel measurement, disable the other three outputs using the GUI.
(3) Turn on the electronic load at VOUTx. The connection should be made at J35 (VOUT1), J37 (VOUT2),
J57 (VOUT3), or J64 (VOUT4). Make sure the load current does not exceed 3A per phase(ISL91301BII-L-EV1Z) or 5A per phase (ISL91301BII-H-EV1Z), and the correct wire size is used when
attaching the electronic load.
(4) Measure the output voltage with a multimeter. The voltage should regulate within datasheet specification
limits.

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ISL91301BII-L-EV1Z, ISL91301BII-H-EV1Z

2. Functional Description(5) To determine efficiency, measure input and output voltages at the Kelvin sense test points (S+ and S-),
which are located at the J3 (VIN SENSE) and J15 (BUCK1 SENSE), J18 (BUCK2 SENSE), J56 (BUCK3SENSE), or J63 (BUCK4 SENSE) headers. Measure the input and output currents from the VIN power
supply and the electronic load. Calculate efficiency based on these measurements. For detailed setup
information, refer to Figure 11 on page 13.

2.2.4

Load Transient Measurement(1) Complete the setup procedure. The ISL91301BII-L-EV1Z should already be powered up with 2.5V to
5.5V at J6 (VIN supply) and 6V at TP1 (VCC_6V). The ISL91301BII-H-EV1Z should already be powered
up with 2.8V to 5.5V at J6 (VIN supply) and 6V at TP1 (VCC_6V).
(2) Connect a slew rate controllable signal generator to transient load circuit input, J60 (TRANSIENT 1
PULSE GEN), J61 (TRANSIENT 2 PULSE GEN), J62 (TRANSIENT 3 PULSE GEN), or J63(TRANSIENT 4 PULSE GEN).
(3) Program the signal generator to pulse mode. Set the frequency to 100Hz, the ON duration to 200µs, andthe signal amplitude from 0V to 2V. The load transient circuit starts to turn on when the input is ~2.6V.
When in doubt, always connect the signal generator output to an oscilloscope set to a 1MΩ termination.
The slew rate of the pulse, both rising and falling, should be conservatively slow, for example, 1µs.
(4) Connect a differential probe to monitor load current across the sense resistors J52 (ISENSE1), J55(ISENSE2), J59 (ISENSE3), or J67 (ISENSE4). The load current can be accurately converted to a voltage
at 1A/10mV. Ensure the vertical scale of the oscilloscope is set properly to display the full amplitude of theload profile.
(5) Connect a second differential probe at the VOUT sense points connected to the VOUT decoupling
capacitors, J15 (BUCK1 SENSE), J18 (BUCK2 SENSE), J56 (BUCK3 SENSE), or J63 (BUCK4SENSE).
(6) Set the oscilloscope to measure the rise and fall times and maximum level of the load current. Slowly
increase the signal generator amplitude and slew rate until the desired load profile is achieved. For detailed
setup information, refer to Figure 12 on page 13.

J61, Connect Signal Generator“Transient 2 Pulse Gen”

J55, Connect Differential
Probe to “ISENSE2”, 10mV/1A

Signal Generator Set to Pulse Mode

Figure 4. BUCK1 Transient Load Connection Example

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2.3

2. Functional Description

Evaluation Software Installation and Use(1) Extract the package and double-click AutoRun.exe. Follow the instructions that appear to install theMultiphase PMIC I2C Control Tool Software.
(2) Attach the USB - I2C interface (ISLUSBMINIEVAL1Z) dongle to the computer using the supplied USB
cable.
(3) Attach the USB - I2C interface dongle to J42B of the ISL91301BII-x-EV1Z. Following the instructions in“Setup Guide” on page 6, connect the power supplies, DC load, and other test equipment to the ISL91301BIIx-EV1Z evaluation board, then apply power.
(4) Start the Multiphase PMIC Control Tool software. Select Start > Programs > Renesas > Multiphase PMIC I2CControl Tool.
(5) Select ISL91301B from the “Select Product” drop down menu. Click “Connect” button on the GUI toestablish connection between GUI and the dongle . The LED light on the dongle will lit. If a connection is notdetected, the software shows a red X next to I2C Communication. Press Reset to reconnect the dongle.

(6) After the evaluation software establishes a connection to the USB-I2C interface dongle, the software loads a
blank startup script by default and reads all the pertinent register values to show on screen.
(7) Buck1, Buck2, Buck3, and Buck4 are all enabled, and the default DVS0 values should be 0.9V. If no fault
conditions occurred during the board power-up during Step 3, all the fault indicators (UV, OV, OC) should beclear instead of red.
(8) To change the output voltage, enter the desired value in voltages in the DVS0 control. Four default DVS
values are also loaded as part of the ISL91301B one time programmable memory space. Navigate to any ofthem and activate a DVS command by clicking the DVS Pointer.

Figure 5. DVS Pointer Selection(9) Changing the ‘Max Voltage’ controls will change the internal feedback divider between ratios of 1x, 0.8x, and
0.6x. This will change the maximum output voltage the ISL91301B can support with the maximum being 2V.
Keep in mind the smallest DVS resolution the IC and the software can support will be no less than the
maximum voltage divided by 1024.
(10) After the evaluation software runs without hiccup, it polls all the registers at 2s intervals by default. Thisfeature can be disabled by deselecting the ‘Continuous Read’ function. Alternatively, click the ‘Read All
Once’ control to perform a one-time read of all the registers.

Figure 6. Continuous Read and Manual Read all Options(11) The fault indicators will self clear after the software performs a read of the register either through theContinuous Read or the ‘Read All Once’ function. Three additional replica fault indicators (UV, OV, and OC)

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ISL91301BII-L-EV1Z, ISL91301BII-H-EV1Z

2. Functional Description

latch the faults so they will clear only after the user clicks the ‘Push To Clear’ control in the event of a
spurious fault condition.

Figure 7. Fault Indicators

Note: The default switching frequency of the ISL91301B is set to 4MHz and the slew rates for both DVS andpower-up/down are set to 2.5mV/µs. These settings, along with many other features, are programmable only throughan OTP request or a startup script, and are not supported by the evaluation software. For more information, pleasecontact your local sales representative.
Green check mark indicates agood connection to the I2C Dongle

Enable/Disablefor each Buck

Four active DVS
per Buck withpointer selection

Fault monitoring
and latched states

Red indicates anover-temperature fault

Figure 8. ISL91301B Evaluation Software Window

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ISL91301BII-L-EV1Z, ISL91301BII-H-EV1Z

3.

3. PCB Layout Guidelines

PCB Layout Guidelines

The ISL91301BII-L-EV1Z and ISL91301BII-H-EV1Z are 6-layer FR4 boards. The main components are the
ISL91301B and its passive filter components, test points, and connectors. A 220nH inductor is located close to eachphase node of the ISL91301B, and 3x22µF plus 4x4.3µF capacitors are populated at the output of each inductor. PVIN
is distributed using a power plane on an inner layer with a 10µF capacitor placed in close proximity to the PVIN and
PGND balls of the power stage. In addition, a 10µF AVIN filter capacitor is placed next to the ISL91301B referenced
to a quiet ground plane.
Proper PCB layout is a critical design step when ensuring that the designed converter works under optimum
conditions. The ISL91301B’s power loop is composed of the inductor, output capacitors, phase node, and PGND pins.
Keep this loop as short as possible and the connecting traces among them direct, short, and wide. The phase nodes of
the ISL91301B are very noisy, so keep remote sense signals away from traces coming out of the phase nodes, and do
not route them under the inductor in an adjacent layer. The input capacitor should be placed as close as possible to the
PVIN and PGND pins, and a large unbroken ground plane should connect all the decoupling capacitors together.
The heat of the ISL91301B is mainly dissipated through the GND and PHASE plane vias under the IC. To maximize
thermal performance, use as much copper area as possible connecting to these vias. In addition, a solid ground plane is
helpful for better EMI performance.

3.1

Summary of Key Layout Strategies• Place input capacitors as close as possible to their respective PVIN and PGND pins to minimize parasitic loop
inductance.
• Route phase nodes with short, wide traces and avoid any sensitive nodes.
• Route the remote sense lines directly to the load using small, low inductance capacitors at the load for bypassing.
• Output capacitors should be close to the inductors and have a low impedance path to the PGND pins.
• Keep digital and phase nodes from intersecting the AVIN_FILT, VOUT, and RTN lines.
• Create a PGND plane on the second layer of the PCB below the power components and bumps carrying highswitching currents.

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ISL91301BII-L-EV1Z, ISL91301BII-H-EV1Z

3.2

3. PCB Layout Guidelines

ISL91301BII-L/H-EV1Z Evaluation Board
VIN Supply
VIN

GND

GND

GND
BUCK4
(J64)

BUCK3
(J57)
VOUT4

VOUT3

VOUT1
BUCK1
(J35)

VOUT2
BUCK2
(J37)

GND

GND

GND

VCC_6V Supply(TP1)

SPI Connector(J24)

I2C Connector(J42B)

Figure 9. ISL91301BII-L/H-EV1Z Top View

Figure 10. ISL91301BII-L/H-EV1Z Bottom View

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3. PCB Layout Guidelines

VIN Supply - 2.8V to 5.5V (J6 and J7)
VIN

VIN Sense (J3)

GND

BUCK3 Sense(J56)

BUCK4 Sense(J63)

BUCK2 Sense(J18)

BUCK1 Sense(J15)

VCC_6V Supply(TP1)

Figure 11. ISL91301BII-L/H-EV1Z Efficiency Measurement Connections

VIN Sense (J3)Transient 4 Pulse Gen(J66)

VIN Supply - 2.8V to 5.5V (J6 and J7)
VIN

Transient 3 Pulse Gen
(J62)

GND

ISENSE4(J67)

BUCK4 Sense(J63)

ISENSE3(J59)
BUCK3 Sense(J56)

BUCK1 Sense(J15)
ISENSE1(J52)

BUCK2 Sense(J18)
ISENSE2(J55)
VCC_6V Supply(TP1)

Transient 1 Pulse Gen(J60)

Transient 2 Pulse Gen(J61)

Figure 12. ISL91301BII-L/H-EV1Z Load Transient Measurement Connections

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ISL91301BII-L-EV1Z, ISL91301BII-H-EV1Z

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UG140 Rev.0.00
Apr 4, 2018

3.3

Page 14 of 26

3. PCB Layout Guidelines

Figure 13. ISL91301BII-L/H-EV1Z Schematic - Page 1

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Apr 4, 20188863,B66

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Page 15 of 26

3. PCB Layout Guidelines

Figure 14. ISL91301BII-L/H-EV1Z Schematic - Page 2

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ISL91301BII-L-EV1Z, ISL91301BII-H-EV1Z

UG140 Rev.0.00
Apr 4, 201873
9&&B9Magnitude of input signal at J60 ( Sig_IN1) sets load current.

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Page 16 of 26

Magnitude of input signal at J61 ( Sig_IN2) sets load current.

Figure 15. ISL91301BII-L/H-EV1Z Schematic - Page 3-Current Measurement 2

3. PCB Layout Guidelines

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ISL91301BII-L-EV1Z, ISL91301BII-H-EV1Z

UG140 Rev.0.00
Apr 4, 2018

Transient Load Circuit for Buck 3

Magnitude of input signal at J62 ( Sig_IN3) sets load current.

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Page 17 of 26

Magnitude of input signal at J66 ( Sig_IN4) sets load current.

Figure 16. ISL91301BII-L/H-EV1Z Schematic - Page 4

73
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3. PCB Layout Guidelines

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ISL91301BII-L-EV1Z, ISL91301BII-H-EV1Z

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Apr 4, 20185
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Figure 17. ISL91301BII-L/H-EV1Z Schematic - Page 5%571

3. PCB Layout Guidelines

Page 18 of 26

23(1ISL91301BII-L-EV1Z, ISL91301BII-H-EV1Z

3.4

3. PCB Layout Guidelines

ISL91301BII-L/H-EV1Z PCB Layout

Figure 18. Top Silkscreen Layer

Figure 19. Top Layer

Figure 20. Layer 2 (PVIN Plane)

Figure 21. Layer 3 (GND Plane)

UG140 Rev.0.00
Apr 4, 2018

Page 19 of 26

ISL91301BII-L-EV1Z, ISL91301BII-H-EV1Z

3. PCB Layout Guidelines

Figure 22. Layer 4 (IO Communications)Figure 23. Layer 5 (GND Plane)

Figure 24. Bottom Layer (Remote Sense Lines)

Figure 25. Bottom Silk Screen Layer

UG140 Rev.0.00
Apr 4, 2018

Page 20 of 26

ISL91301BII-L-EV1Z, ISL91301BII-H-EV1Z

3.5

3. PCB Layout Guidelines

Bill of Materials

Qty

Top Components

Bottom Components

5

C85, C86, C124, C158

C93

82pF, NP0, 0603

Description

Taiyo Yuden

Manufacturer

QVS107CG820JCHT

Part Number

1

C92

1000pF, 100V, X7R, 0603

Taiyo Yuden

HMK107B7102KA-T

2

C126, C127

0.1µF, 10V, X5R, 0402

Taiyo Yuden

LMK105BJ104KV-F

1C40

1µF, 10V, X5R, 0402

Taiyo Yuden

LMK105BJ105KV-F

2

C128, C129

1µF, 10V, X5R, 0603

Taiyo Yuden

LMK107BJ105KA-T

16

C41, C42, C43, C44, C77,
C78, C79, C84, C113,
C114, C115, C116, C148,
C150, C151, C152

4.3µF Multi-Terminal, 4V,
X5R, 0402

Murata

LLD154R60G435ME01

7

C1, C2, C3, C4, C7, C8

10µF, 10V, X5R, 0603

Taiyo Yuden

LMK107BBJ106MAHT

1C1010µF, 10V, X5R, 0402

Samsung
Electronics

CL05A106MP5NUNC

13

C17, C60, C61, C62, C64,
C104, C123, C125, C131,
C139, C157, C159

22µF, 10V, X5R, 0603

TDK

C1608X5R1A226M080AC

3

C5, C6, C103

220µF, 6.3V, Polymer
Tant, D Case

KEMET

T520D227M006ATE040

21

R53, R62, R108, R119,
R91, R92, R103, R114

0Ω, 1/10W, 0603

Panasonic

ERJ-3GEY0R00VRES SMD 0.0Ω Jumper
3/4W 2010

StackpoleRMCF2010ZT0R00

1

C94

C91

R73, R74, R78, R76,
R85, R81, R99, R94,
R100, R125, R122,
R126, R213
R87

16

R55, R56, R57, R58, R64,
R65, R66, R67, R106,
R107, R109, R110, R117,
R118, R120, R121

0.04Ω, 1%, 1W, 2010

VishayWSL2010R0400FEA18

4

R52, R61, R105, R116

100Ω, 1%, 1/10W, 0603

Panasonic

ERJ-3EKF1000V

15

R31, R32, R39, R40, R42,
R212, R54, R63, R104,
R115

R72, R89, R90, R101,
R112

1.0kΩ, 1%, 1/10W, 0603

Panasonic

ERJ-3EKF1001V

1

R71

2.61kΩ, 1%, 1/10W, 0603

Panasonic

ERJ-3EKF2611V

1R70

10kΩ, 1%, 1/10W, 0603

Panasonic

ERJ-3EKF1002V

1

R111

10kΩ, 1%, 1/10W, 0603

Panasonic

ERJ-3EKF1002V

4

L1, L2, L3, L4

0.22µH, 12mΩ, 6.6Asat,
2520 Inductor

CyntecHMQR25201T-R22MSR

4

Q1, Q4, Q7, Q9

TRANS NPN 40V 0.2A
SOT-23

Fairchild

MMBT3904

4

Q2, Q5, Q6, Q8

TRANS PNP 40V 0.2A
SOT-23

Fairchild

MMBT3906

9J6, J7, J35, J36, J37, J38,
J57, J58, J64, J65

Conn Banana JackThreaded 12AWG

Cinch
Connectivity

108-0740-102

21TP1, TP2, TP4, TP5, TP7,
TP9, TP10, TP11, TP12,
TP13, TP14, TP15, TP16,
TP17, TP18, TP21, TP23,
TP24, TP27, TP28, TP29

Conn-Gen, Compact Test
Point, Vertical, White

Keystone

5007

UG140 Rev.0.00
Apr 4, 2018

Page 21 of 26

ISL91301BII-L-EV1Z, ISL91301BII-H-EV1Z
Qty

Top Components

17

J3, J15, J18, J20, J21, J22,
J23, J52, J55, J56, J59,
J60, J61, J62, J63, J66,
J67

2 Pin Header, 100 mil
spacing

FCI

77311-118-02LF

1J42

3 Pin Header, 100 mil
spacing

HarwinM22-2510305

1J24

2x5 Pin Header, 100 mil
spacing

HarwinM20-9980545

1

J42B

Right Angle Connector

HarwinM50-3901042

1

SW1

Switch-Toggle, SMD,
6PIN, SPDT, 2POS,
ON-NONE-ON, ROHS

ITT
INDUSTRIES/
C&K DIVISION

GT11MSCBE

2

TP25, TP26

Turret Binding Post

Keystone1514-2

1

U1

ISL91301IILZ, 0.4mm
Pitch WLCSP

RenesasISL91301IILZ

4U2, U3, U8, U12

IC OPAMP VFB 200MHZ
RRO SOT23-5

Texas
Instruments

OPA356AIDBVRIC REG LDO ADJ 1A
10DFN

Renesas

ISL80101IRAJZ

14U4U5, U6, U7, U11

1
1

Bottom Components

3. PCB Layout Guidelines

U9
U10

UG140 Rev.0.00
Apr 4, 2018

Description

Manufacturer

Part Number

MOSFET N-CH 30V 100A Infineon
8TDSON

BSC011N03LSCT-ND

IC Translator LVL
100MBPS 14TSSO

Maxim

MAX3023EUD+-ND

Linear Regulator IC Fixed
Output 3.3V 150mA
6-UTDFN (1.6x1.6)

RenesasISL9008AIENZ-T

Page 22 of 26

ISL91301BII-L-EV1Z, ISL91301BII-H-EV1Z

4.

4. Typical Performance Curves

Typical Performance Curves

EN Trigger Rising

EN Trigger Falling

CH1: BUCK1, 600mV/Div

CH1: BUCK1, 600mV/Div
CH2: BUCK2, 500mV/Div
CH2: BUCK2, 500mV/Div
CH3: BUCK3, 500mV/Div
CH3: BUCK3, 500mV/Div
CH4: BUCK4, 500mV/Div
CH4: BUCK4, 500mV/Div

1ms/Div

1ms/Div

Figure 26. Startup by EN, VOUT1, 2, 3, 4 = 0.9V

Figure 27. Shutdown by EN, VOUT1, 2, 3, 4 = 0.9V

95

Efficiency (%)

90

85

80

VIN = 2.8V

VIN = 3.3V

VIN = 3.8V

VIN = 4.3V

VIN = 4.8V
75
0.1

1
IOUT (A)4

Figure 28. Single-Phase Efficiency (VOUT = 1V), Continuous Load Sweep (0.1A to 4A), Switching Frequency = 4MHz

3.8VIN 1VOUT 220nH 4MHz
Overshoot = +41mV
Undershoot = -40mV

4A
100mA

25A/µs

40µs/Div
Load Step Slew Rate: 25A/µs, 0.1A to 4A
220nH Inductor (Cyntec PIFE25201T-R22MS)
2x22µF Capacitor (0603 6.3V Murata)
2x4.3µF Capacitor (0402 Low ESL Murata)

Figure 29. Single-Phase Load Transient (4A/160ns)

UG140 Rev.0.00
Apr 4, 2018

Page 23 of 26

ISL91301BII-L-EV1Z, ISL91301BII-H-EV1Z

5.

5. Revision History

Revision History

Rev.

Date

0.00

Apr 4, 2018

UG140 Rev.0.00
Apr 4, 2018

Description
Initial release

Page 24 of 26

Notice1.

Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible forthe incorporation or any other use of the circuits, software, and information in the design of your product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by
you or third parties arising from the use of these circuits, software, or information.

2.

Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving patents, copyrights, or other intellectual property rights of third parties, by orarising from the use of Renesas Electronics products or technical information described in this document, including but not limited to, the product data, drawings, charts, programs, algorithms, and application
examples.

3.

No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others.

4.

You shall not alter, modify, copy, or reverse engineer any Renesas Electronics product, whether in whole or in part. Renesas Electronics disclaims any and all liability for any losses or damages incurred by

5.

Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The intended applications for each Renesas Electronics product depends on theyou or third parties arising from such alteration, modification, copying or reverse engineering.

product’s quality grade, as indicated below.
"Standard":

Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronicequipment; industrial robots; etc.

"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key financial terminal systems; safety control equipment; etc.
Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are
not intended or authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause
serious property damage (space system; undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics disclaims any and all
liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that is inconsistent with any Renesas Electronics data sheet, user’s manual orother Renesas Electronics document.
6.

When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for Handling and Using Semiconductor Devices” in thereliability handbook, etc.), and ensure that usage conditions are within the ranges specified by Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation
characteristics, installation, etc. Renesas Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such specified
ranges.

7.

Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific characteristics, such as the occurrence of failure at a
certain rate and malfunctions under certain use conditions. Unless designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas
Electronics document, Renesas Electronics products are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily injury, injury
or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety design for hardware and software, including but not limited to
redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficultand impractical, you are responsible for evaluating the safety of the final products or systems manufactured by you.

8.

Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. You are responsible for carefully andsufficiently investigating applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics
products in compliance with all these applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance with applicablelaws and regulations.

9.

Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws
or regulations. You shall comply with any applicable export control laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties ortransactions.

10. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells or transfers the product to a third party, to notify such third
party in advance of the contents and conditions set forth in this document.
11. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products.
(Note 1)

“Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled subsidiaries.

(Note 2)

“Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
(Rev.4.0-1 November 2017)

http://www.renesas.com

SALES OFFICES
Refer to "http://www.renesas.com/" for the latest and detailed information.
Renesas Electronics America Inc.
1001 Murphy Ranch Road, Milpitas, CA 95035, U.S.A.
Tel: +1-408-432-8888, Fax: +1-408-434-5351
Renesas Electronics Canada Limited
9251 Yonge Street, Suite 8309 Richmond Hill, Ontario Canada L4C 9T3
Tel: +1-905-237-2004
Renesas Electronics Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K
Tel: +44-1628-651-700, Fax: +44-1628-651-804
Renesas Electronics Europe GmbH
Arcadiastrasse 10, 40472 Düsseldorf, Germany
Tel: +49-211-6503-0, Fax: +49-211-6503-1327
Renesas Electronics (China) Co., Ltd.
Room 1709 Quantum Plaza, No.27 ZhichunLu, Haidian District, Beijing, 100191 P. R. China
Tel: +86-10-8235-1155, Fax: +86-10-8235-7679
Renesas Electronics (Shanghai) Co., Ltd.
Unit 301, Tower A, Central Towers, 555 Langao Road, Putuo District, Shanghai, 200333 P. R. China
Tel: +86-21-2226-0888, Fax: +86-21-2226-0999
Renesas Electronics Hong Kong Limited
Unit 1601-1611, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong
Tel: +852-2265-6688, Fax: +852 2886-9022
Renesas Electronics Taiwan Co., Ltd.
13F, No. 363, Fu Shing North Road, Taipei 10543, Taiwan
Tel: +886-2-8175-9600, Fax: +886 2-8175-9670
Renesas Electronics Singapore Pte. Ltd.
80 Bendemeer Road, Unit #06-02 Hyflux Innovation Centre, Singapore 339949
Tel: +65-6213-0200, Fax: +65-6213-0300
Renesas Electronics Malaysia Sdn.Bhd.
Unit 1207, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: +60-3-7955-9390, Fax: +60-3-7955-9510
Renesas Electronics India Pvt. Ltd.
No.777C, 100 Feet Road, HAL 2nd Stage, Indiranagar, Bangalore 560 038, India
Tel: +91-80-67208700, Fax: +91-80-67208777
Renesas Electronics Korea Co., Ltd.
17F, KAMCO Yangjae Tower, 262, Gangnam-daero, Gangnam-gu, Seoul, 06265 Korea
Tel: +82-2-558-3737, Fax: +82-2-558-5338© 2018 Renesas Electronics Corporation. All rights reserved.
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