Application Note
Renesas RA Family

EK-RA6M3G Example Project Bundle
Introduction
This document describes the contents of the Example Project Bundle for the EK-RA6M3G kit. The Example
Projects contained within the bundle show how to write code for the various Renesas Flexible Software
Package (FSP) modules supported by the EK-RA6M3G kit.
Flexible Software Package is an optimized software package designed to provide easy to use, scalable,
high-quality software for embedded system design. The primary goal is to provide lightweight, efficientdrivers that meet common use cases in embedded systems. FSP code quality is enforced by peer reviews,
automated requirements-based testing, and automated static analysis. FSP provides uniform and intuitive
APIs that are well documented. Each module is supported with detailed user documentation including
example code. FSP modules can be used on any MCU in the RA family, provided the MCU has any
peripherals required by the module. FSP modules can be configured at build-time to optimize the size of themodule for the feature set required by the application.

Supported Kit
EK-RA6M3G

Supported FSP Version
FSP v5.6.0

Supported Toolchains
For the latest version of each Integrated Development Environment (IDE) and toolchain listed below, pleaserefer to the FSP release notes

e² studio with GCC Arm Embedded
Keil MDK with Arm compiler toolchain
IAR EWARM with IAR toolchain for Arm

1. Using the Example Projects
To use EK-RA6M3G Example Projects, follow the steps mentioned in the following documents:


Example Project Usage Guide
https://github.com/renesas/ra-fsp-examples/blob/master/example_projects/Example%20Project%20Usage%20Guide.pdf
e² studio AC6 porting Guide
https://en-support.renesas.com/knowledgeBase/19375553

Users who are new to the FSP are recommended to refer to the section Starting Development > Tutorial:
Your First RA MCU Project – Blinky in the RA FSP Documentation prior to attempting to program or debug
an example project.

R20AN0565EU0153 Rev.1.53
Oct.14.24

Page 1 of 7

Renesas RA Family

EK-RA6M3G Example Project Bundle

2. List of Example Projects Supported on Different Toolchains in the Bundle
The following table lists example projects supported by each IDE. These are ready to import using the importprocess for each IDE.
Note:
1. Additional example projects other than those mentioned above, may be available in the example
project repository. However, they are supported with older version of FSP. Please refer theexample_projects/version_info_table.md file in the repository to identify the appropriate FSP version
for the example project of interest.
2. All projects supported by e2 studio/GCC are supported with e2 studio/AC6 via port from GCC.
Table 1. IDE Support for the Example Project
Example Project
FileX_block_media_sram
FileX_exFAT_block_media_sdmmc
acmphsadc
adc_gpt_periodic_sampling
agt
cac
can
can_fifo
clock_output
cpp
crc
dma_spi
dmac
doc
drw
elc
ethernetflash_hp
freertos
glcdc
gpt
gpt_input_capture
icu
iic_master
iic_slaveiwdt
jpeg_codec
kint
lpm
lvd
mbed_crypto
pdc
qspi
rtc
sci_i2c
sci_spi

R20AN0565EU0153 Rev.1.53
Oct.14.24

IDE Support
e² studio/GCC
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported

IAR

Keil MDK

Supported

Supported

Supported

Supported

Supported
Supported
Supported

Supported
Supported
Supported

Supported

Supported

Supported

Supported

Supported

Supported

Supported

Supported

Page 2 of 7

Renesas RA Family

Example Project
sci_uart
sdhi
spi
ssi
usb_composite
usb_hcdc
usb_hhid
usb_hmsc
usb_hmsc_baremetal
usb_hvnd
usb_multiportusb_pcdc
usb_phid
usb_pmsc
usb_pvnd
vee_flashwdt
wifi
wifi_on_chip_http_client
wifi_on_chip_udp_freertos

R20AN0565EU0153 Rev.1.53
Oct.14.24

EK-RA6M3G Example Project Bundle
IDE Support
e² studio/GCC
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported

IAR
Supported

Keil MDK
Supported

Supported

Supported

Supported

Supported

Page 3 of 7

Renesas RA Family

EK-RA6M3G Example Project Bundle

Website and Support
Visit the following URLs to learn about key elements of the RA family, download components and related
documentation, and get support.
RA Product Information
RA Product Support ForumRA Flexible Software Package
Renesas Support

R20AN0565EU0153 Rev.1.53
Oct.14.24

renesas.com/rarenesas.com/ra/forum
renesas.com/FSP
renesas.com/support

Page 4 of 7

Renesas RA Family

EK-RA6M3G Example Project Bundle

Revision History

R20AN0565EU0153 Rev.1.53
Oct.14.24

Page 5 of 7

Renesas RA Family

Rev.
1.00
1.01
1.02
1.04
1.05
1.06

Date
Apr.23.20
Jun.1.20
Jul.09.20
Aug.12.20
Sep.03.20
Sep.14.20

1.07
1.08
1.09
1.10
1.11
1.12
1.13
1.14
1.15
1.16
1.17
1.18
1.19
1.20
1.21
1.22
1.23
1.24
1.25
1.26
1.27
1.28
1.29
1.30
1.31
1.32
1.33
1.34
1.35
1.36
1.37
1.38
1.39
1.40
1.41
1.42
1.43
1.44
1.45

Oct.12.20
Oct.23.20
Nov.02.20
Dec.01.20
Feb.02.21
Mar.10.21
Apr.06.21
May.03.21
May.13.21
Jun.16.21
Jul.12.21
Jul.26.21
Aug.30.21
Sep.10.21
Sep.29.21
Oct.20.21
Dec.20.21
Mar.21.22
Apr.11.22
Jul.18.22
Aug.11.22
Sep.20.22
Oct.17.22
Nov.14.22
Dec.01.22
Jan.10.23
Mar.24.23
Apr.28.23
Jun.01.23
Jul.17.23
Sep.18.23
Sep.26.23
Oct.23.23
Nov.06.23
Dec.05.23
Dec.19.23
Jan.29.24
Mar.11.24
Mar.21.24

EK-RA6M3G Example Project Bundle
Description
Page
Summary—First release document.
—
Examples updated for IAR.
—
Updated for FSP v1.2.0.
NA
Package updated to include this document.
—
Updated for FSP v1.3.0.
—
This revision includes changes to the code files. There are no changes
to this document.
—
Added support for FSP v2.0.0.
—
Updated support for IAR and Keil, added VEEPROM.
—
Added support for FSP v2.1.0.
—
Added support for FSP v2.2.0.
—
Added support for FSP v2.3.0.
—
Added support for USB COMPOSITE, USB HVND, and USB PVND.
—
Added support for FSP v2.4.0.
—
Added support for FSP v3.0.0.
—
Added support for FSP v3.0.0 (2).
—Added support for FSP v3.0.0 (4).
—Added support for FSP v3.1.0 (1).
—
Added support for FSP v3.1.0 (2).
—Added support for FSP v3.1.0 (3).
—
Added support for FSP v3.2.0.
—
Added support for FSP v3.3.0 (2).
—Added support for FSP v3.4.0 (2).
—Added support for FSP v3.5.0 (2).
—Added support for FSP v3.6.0.
—
Added support for FSP v3.6.0 (2).
—Added support for FSP v3.8.0 (1).
—
Added support for FSP v3.8.0 (2).
—Added support for FSP v4.0.0.
—
Added support for FSP v4.0.0 (2).
—Added support for FSP v4.1.0 (1).
—
Added support for FSP v4.1.0 (2).
—Added support for FSP v4.2.0 (1).
—
Added support for FSP v4.3.0 (2).
—Added support for FSP v4.4.0 (1).
—
Added support for FSP v4.4.0 (2).
—Added support for FSP v4.5.0 (1).
—
Added support for FSP 4.5.0 (2).
—Added support for FSP v4.6.0 (1).
—
Added support for FSP v4.6.0 (2).
—Added support for FSP v5.0.0 (2).
—Added support for FSP v5.0.0 (3).
—
Added support for FSP v5.1.0 (2).
—Added support for FSP v5.1.0 (4).
—Added support for FSP v5.2.0 (1).
—
Added support for FSP v5.2.0 (2).

R20AN0565EU0153 Rev.1.53
Oct.14.24

Page 6 of 7

Renesas RA Family
1.46
1.47
1.48
1.49
1.50
1.51
1.52
1.53

Apr.09.24
May.09.24
May.30.24
Jun.14.24
Jul.05.24
Aug.15.24
Sep.10.24
Oct.14.24

EK-RA6M3G Example Project Bundle
—
—
—
—
—
—
—
—

R20AN0565EU0153 Rev.1.53
Oct.14.24

Added support for FSP v5.2.0 (3).
Added support for FSP v5.3.0 (1).
Added support for FSP v5.3.0 (2).
Added support for FSP v5.3.0 (3).
Added support for FSP v5.4.0 (1).
Added support for FSP v5.4.0 (2).
Added support for FSP v5.5.0 (1).
Added support for FSP v5.5.0 (2).

Page 7 of 7

General Precautions in the Handling of Microprocessing Unit and Microcontroller
Unit Products
The following usage notes are applicable to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usage notes on the
products covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.
1.

Precaution against Electrostatic Discharge (ESD)
A strong electrical field, when exposed to a CMOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps
must be taken to stop the generation of static electricity as much as possible, and quickly dissipate it when it occurs. Environmental control must be
adequate. When it is dry, a humidifier should be used. This is recommended to avoid using insulators that can easily build up static electricity.
Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test andmeasurement tools including work benches and floors must be grounded. The operator must also be grounded using a wrist strap. Semiconductor2.

devices must not be touched with bare hands. Similar precautions must be taken for printed circuit boards with mounted semiconductor devices.
Processing at power-on
The state of the product is undefined at the time when power is supplied. The states of internal circuits in the LSI are indeterminate and the states ofregister settings and pins are undefined at the time when power is supplied. In a finished product where the reset signal is applied to the external resetpin, the states of pins are not guaranteed from the time when power is supplied until the reset process is completed. In a similar way, the states of pins
in a product that is reset by an on-chip power-on reset function are not guaranteed from the time when power is supplied until the power reaches the3.

level at which resetting is specified.
Input of signal during power-off state
Do not input signals or an I/O pull-up power supply while the device is powered off. The current injection that results from input of such a signal or I/O
pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal

4.

elements. Follow the guideline for input signal during power-off state as described in your product documentation.
Handling of unused pins
Handle unused pins in accordance with the directions given under handling of unused pins in the manual. The input pins of CMOS products are
generally in the high-impedance state. In operation with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of
the LSI, an associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal

5.

become possible.
Clock signals
After applying a reset, only release the reset line after the operating clock signal becomes stable. When switching the clock signal during program
execution, wait until the target clock signal is stabilized. When the clock signal is generated with an external resonator or from an external oscillator
during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Additionally, when switching to a clock signal

6.

produced with an external resonator or by an external oscillator while program execution is in progress, wait until the target clock signal is stable.
Voltage application waveform at input pin
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL(Max.) and VIH (Min.) due to noise, for example, the device may malfunction. Take care to prevent chattering noise from entering the device when the7.

input level is fixed, and also in the transition period when the input level passes through the area between VIL (Max.) and VIH (Min.).
Prohibition of access to reserved addresses
Access to reserved addresses is prohibited. The reserved addresses are provided for possible future expansion of functions. Do not access these8.

addresses as the correct operation of the LSI is not guaranteed.
Differences between products
Before changing from one product to another, for example to a product with a different part number, confirm that the change will not lead to problems.
The characteristics of a microprocessing unit or microcontroller unit products in the same group but having a different part number might differ in termsof internal memory capacity, layout pattern, and other factors, which can affect the ranges of electrical characteristics, such as characteristic values,
operating margins, immunity to noise, and amount of radiated noise. When changing to a product with a different part number, implement a systemevaluation test for the given product.

Notice1.

Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products
and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of yourproduct or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by you or third parties arising from the useof these circuits, software, or information.
2. Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving patents, copyrights,
or other intellectual property rights of third parties, by or arising from the use of Renesas Electronics products or technical information described in thisdocument, including but not limited to, the product data, drawings, charts, programs, algorithms, and application examples.
3. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics
or others.
4. You shall be responsible for determining what licenses are required from any third parties, and obtaining such licenses for the lawful import, export,
manufacture, sales, utilization, distribution or other disposal of any products incorporating Renesas Electronics products, if required.
5. You shall not alter, modify, copy, or reverse engineer any Renesas Electronics product, whether in whole or in part. Renesas Electronics disclaims any
and all liability for any losses or damages incurred by you or third parties arising from such alteration, modification, copying or reverse engineering.
6. Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The intended applications foreach Renesas Electronics product depends on the product’s quality grade, as indicated below.
"Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; homeelectronic appliances; machine tools; personal electronic equipment; industrial robots; etc.
"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key
financial terminal systems; safety control equipment; etc.
Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas
Electronics document, Renesas Electronics products are not intended or authorized for use in products or systems that may pose a direct threat tohuman life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause serious property damage (spacesystem; undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics
disclaims any and all liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics productthat is inconsistent with any Renesas Electronics data sheet, user’s manual or other Renesas Electronics document.
7. No semiconductor product is absolutely secure. Notwithstanding any security measures or features that may be implemented in Renesas Electronics
hardware or software products, Renesas Electronics shall have absolutely no liability arising out of any vulnerability or security breach, including but
not limited to any unauthorized access to or use of a Renesas Electronics product or a system that uses a Renesas Electronics product. RENESASELECTRONICS DOES NOT WARRANT OR GUARANTEE THAT RENESAS ELECTRONICS PRODUCTS, OR ANY SYSTEMS CREATED USINGRENESAS ELECTRONICS PRODUCTS WILL BE INVULNERABLE OR FREE FROM CORRUPTION, ATTACK, VIRUSES, INTERFERENCE,
HACKING, DATA LOSS OR THEFT, OR OTHER SECURITY INTRUSION (“Vulnerability Issues”). RENESAS ELECTRONICS DISCLAIMS ANY AND
ALL RESPONSIBILITY OR LIABILITY ARISING FROM OR RELATED TO ANY VULNERABILITY ISSUES. FURTHERMORE, TO THE EXTENTPERMITTED BY APPLICABLE LAW, RENESAS ELECTRONICS DISCLAIMS ANY AND ALL WARRANTIES, EXPRESS OR IMPLIED, WITHRESPECT TO THIS DOCUMENT AND ANY RELATED OR ACCOMPANYING SOFTWARE OR HARDWARE, INCLUDING BUT NOT LIMITED TO
THE IMPLIED WARRANTIES OF MERCHANTABILITY, OR FITNESS FOR A PARTICULAR PURPOSE.
8. When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for
Handling and Using Semiconductor Devices” in the reliability handbook, etc.), and ensure that usage conditions are within the ranges specified byRenesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation characteristics, installation, etc. Renesas
Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of suchspecified ranges.
9. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specificcharacteristics, such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Unless designated as a high reliability
product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics
products are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily
injury, injury or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as
safety design for hardware and software, including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment foraging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult and impractical, you areresponsible for evaluating the safety of the final products or systems manufactured by you.
10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas
Electronics product. You are responsible for carefully and sufficiently investigating applicable laws and regulations that regulate the inclusion or use ofcontrolled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics products in compliance with all theseapplicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliancewith applicable laws and regulations.
11. Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale isprohibited under any applicable domestic or foreign laws or regulations. You shall comply with any applicable export control laws and regulations
promulgated and administered by the governments of any countries asserting jurisdiction over the parties or transactions.
12. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells ortransfers the product to a third party, to notify such third party in advance of the contents and conditions set forth in this document.
13. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.
14. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas
Electronics products.
(Note1)(Note2)“Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlledsubsidiaries.
“Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
(Rev.5.0-1 October 2020)

Corporate Headquarters

Contact information

TOYOSU FORESIA, 3-2-24 Toyosu,
Koto-ku, Tokyo 135-0061, JapanFor further information on a product, technology, the most up-to-dateversion of a document, or your nearest sales office, please visit:www.renesas.com/contact/.

www.renesas.com

Trademarks
Renesas and the Renesas logo are trademarks of Renesas Electronics
Corporation. All trademarks and registered trademarks are the propertyof their respective owners.

© 2024 Renesas Electronics Corporation. All rights reserved.