Datasheet
HS3xxxHigh Performance Relative Humidity and Temperature Sensor
The HS3xxx series (HS300x and HS310x) is a highly
accurate, fully calibrated relative humidity andtemperature sensor. While the HS300x devices comein a standard package with open air inlet, theHS310x devices feature a hydrophobic membrane,making it dust resistant and waterproof with IP67
rating. Both sensor versions, waterproof and nonwaterproof, are available in three different accuracy
classes: HS3x01, HS3x02 and HS3x03. The MEMS
sensor features a proprietary sensor-level protection,
ensuring high reliability and long-term stability.
Integrated calibration using a NIST traceable andverified production setup that is calibrated to ISO/IEC
17025 standards and temperature-compensation
logic provides fully corrected RH and temperature
values via a standard I2C output. No user calibrationof the output data is required.
The high accuracy, fast measurement response time,and long-term stability combined with the small
package size make the HS3xxx series ideal for awide number of applications ranging from portabledevices to products designed for harshenvironments.
The HS3xxx series digital sensor accurately
measures relative humidity and temperature levels.
The measured data is internally corrected andcompensated for accurate operation over a wide
range of temperature and humidity levels – user
calibration is not required.

Applications■

Climate control systems■

Home appliances■

Weather stations■

Industrial automation■

Medical equipment■

Automotive cabin climate control

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Features■

Humidity range: 0% to 100% RH■

NIST traceability for relative humidity andtemperature■

Hydrophobic membrane, IP67 rating (HS310x)■

Humidity accuracy: ±1.5% RH, typical (HS3x01,
10% to 90% RH, 25 C)■

14-bit resolution: 0.01% RH, typical■

Independent programmable resolution settings:
8, 10, 12, 14 bits■

Fast RH response time: 1 second time constant,typical (with 1m/sec air flow), 4 seconds time
constant, typical (in still air)■Temperature sensor accuracy: ±0.2°C, typical(HS3x01, -10°C to +80°C)■

Low current consumption: 1.0µA average(8-bit resolution, 1.8V supply), 24.4µA average(14-bit resolution, 3.3V supply), one RH andtemperature measurement per second■

Excellent stability against aging■

Highly robust protection from harsh environmental
conditions and mechanical shock■

Very low power consumption

Physical Characteristics■

Supply voltage: 2.3V to 5.5V■

Extended supply voltage: 1.8V (-20°C to +125°C)■

Operating temperature: -40°C to +125°C■

3.0 × 2.41 × 0.8 mm DFN-style 6-LGA package(HS300x)■

3.0 × 2.41 × 0.9 mm DFN-style 6-LGA package(HS310x)

Product Image

Page 1© 2024 Renesas Electronics

HS3xxx Datasheet

Contents
1.

2.

3.

Pin Information .............................................................................................................................................4
1.1

Pin Assignments ...................................................................................................................................4

1.2

Pin Descriptions....................................................................................................................................4

1.3

Functional Diagram ..............................................................................................................................4

Specifications ...............................................................................................................................................5
2.1

Absolute Maximum Ratings ..................................................................................................................5

2.2

Recommended Operating Conditions...................................................................................................5

Humidity and Temperature Sensor Performance ......................................................................................6
3.1

Humidity Sensor Specification ..............................................................................................................6

3.2

Temperature Sensor Specification .......................................................................................................6

3.3

Sleep Current .......................................................................................................................................7

3.4

Humidity Sensor Accuracy Graphs .......................................................................................................7

3.5

Temperature Sensor Accuracy Graphs ................................................................................................84.

Conditioning .................................................................................................................................................85.

PCB Layout Guide ........................................................................................................................................96.

Application Circuit ........................................................................................................................................97.

Sensor Interface .........................................................................................................................................10
7.1

I2C Features and Timing .....................................................................................................................10

7.2

Sensor Slave Address ........................................................................................................................10

7.3

I2C Communication .............................................................................................................................11

7.4

Measurement Mode............................................................................................................................11

7.5

Measurement Requests (MR).............................................................................................................11

7.6

Data Fetch (DF) ..................................................................................................................................12

7.7

Calculating Humidity and Temperature Output ...................................................................................13

7.8

Status Bits ..........................................................................................................................................13

7.9

Accessing the Non-Volatile Memory ...................................................................................................13

7.10 Setting the Measurement Resolution..................................................................................................14
7.11 Reading the HS3xxx ID Number.........................................................................................................15
8.

Soldering Information ................................................................................................................................15

9.

Storage and Handling.................................................................................................................................16

10. Quality and Reliability ................................................................................................................................16
11. Package Outline Drawings.........................................................................................................................17
12. Marking Diagram ........................................................................................................................................17
13. Ordering Information ..................................................................................................................................17
14. Revision History .........................................................................................................................................17

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FiguresFigure 1. Pin Assignments for 3.0 × 2.41 mm 6-LGA Package – Top View ........................................................... 4
Figure 2. Functional Diagram of HS3xxx ................................................................................................................ 4
Figure 3. Sleep Current Variation over Temperature, VDD at 3.3V.......................................................................... 7
Figure 4. HS3x01 RH Accuracy Tolerance at 25°C ................................................................................................ 7
Figure 5. HS3x01 RH Accuracy over Temperature ................................................................................................ 7
Figure 6. HS3x02 RH Accuracy Tolerance at 25°C ................................................................................................ 7
Figure 7. HS3x02 RH Accuracy over Temperature ................................................................................................ 7
Figure 8. HS3x03 RH Accuracy Tolerance at 25°C ................................................................................................ 8
Figure 9. HS3x03 RH Accuracy over Temperature ................................................................................................ 8
Figure 10. HS3x01 Temperature Sensor Accuracy Tolerance ............................................................................... 8
Figure 11. HS3x03 Temperature Sensor Accuracy Tolerance ............................................................................... 8
Figure 12. Milled PCB Openings for Thermal Isolation ........................................................................................... 9
Figure 13. HS3xxx Application Circuit .................................................................................................................... 9
Figure 14. Timing Diagram ................................................................................................................................... 10
Figure 15. START and STOP Condition Waveform.............................................................................................. 11
Figure 16. Measurement Request ........................................................................................................................ 11
Figure 17. Data Fetch ........................................................................................................................................... 12
Figure 18. Sequence of Commands to Enter Programming Mode ....................................................................... 13
Figure 19. Sequence of Commands to Change the Relative Humidity Resolution ............................................... 14
Figure 20. Recommended Soldering Profile ......................................................................................................... 15

TablesTable 1. I2C Timing Parameters ........................................................................................................................... 10
Table 2. Non-Volatile Memory Registers .............................................................................................................. 14
Table 3. Register Values for Different Resolution Settings ................................................................................... 15

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1. Pin Information
1.1

Pin Assignments
VC

SDA

SCL

3

2

1
Pin 1
marker on
bottom side

4

5

6

VDD

NC

VSS

Figure 1. Pin Assignments for 3.0 × 2.41 mm 6-LGA Package – Top View

1.2

Pin Descriptions

Pin Number

Pin Name

Type

1

SCL

IN/OUT

Serial clock.

2

SDA

IN/OUT

Serial data.

3

VC

-

Connect a 0.1µF decoupling capacitor from VC to ground .

4

VDD

IN

Supply voltage.

5

NC [1]-Do not connect.

6

VSS

IN

Ground.

1.

1.3

Description“NC” stands for not connected / no connection required / not bonded.

Functional Diagram
Clock
Generator

Biasing

Humidity
SensorMUXADC

Calibration
Logic

I2C SerialInterface

I/O

Temperature
SensorFigure 2. Functional Diagram of HS3xxx

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2. Specifications
2.1

Absolute Maximum Ratings

Caution: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to suchconditions can adversely impact product reliability and result in failures not covered by warranty.
Parameter

SymbolMinimum

Maximum

Unit

Supply Voltage

-

-0.3

6.0

V

Storage Temperature Range

-

-55

125

°C

2.2

Recommended Operating Conditions

Important: The HS3xxx series sensors are optimized to perform best in the more common temperature andhumidity ranges of 10°C to 50°C and 20% RH to 80% RH, respectively. If operated outside of these conditions
for extended periods, especially at high humidity levels, the sensors may exhibit an offset. In most cases, thisoffset is temporary and will gradually disappear once the sensor is returned to normal temperature and humidity
conditions. The amount of the shift and the duration of the offset vary depending on the duration of exposure andthe severity of the relative humidity and temperature conditions. The time needed for the offset to disappear canalso be decreased by using the procedures described in the Conditioning section.
Parameter

Condition

Minimum

TypicalMaximum

Unit

-

-

3.3

5.5

V

Operating temperature from -20°C to
125°C

1.8

-

5.5

V

Operating Humidity Range

-

0

-

100

%RH

Operating Temperature Sensor Range

-

-40

-

125

°C

-40°C to 85°C

-

0.6

1

-40°C to 125°C

-

1

3

8-bit resolution

1.0

1.5

1.7

10-bit resolution

2.0

2.6

2.8

12-bit resolution

5.5

7.0

7.1

14-bit resolution

20.1

24.4

24.4

-

0.10

-

8-bit resolution

-

0.60

-

10-bit resolution

-

1.40

-

12-bit resolution

-

4.60

-

14-bit resolution

-

17.00

-

Operating Supply Voltage
Extended Operating Supply Voltage

Sleep Current

Sleep Mode

Average Current [ 1 ]One RH +temperature
measurement/sec
ond

Wake-up

Measurement Time1.

Humidity or
temperatureincluding thedigitalcompensation

µA

µA

ms

Minimum, typical and maximum average currents are given at 1.8V, 3.3V and 5.5V VDD respectively.

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3. Humidity and Temperature Sensor Performance
3.1

Humidity Sensor Specification

Humidity Sensor Specification, TA = +25°C, VDD = 2.3V to 5.5V
Parameter

Condition

Minimum

TypicalMaximum

Unit

-

0

-

100

%RH

-

±1.5

-

-

±1.8

-

-

±2.5

-

8-bit

-

0.7

-

14- bit

-

0.01

-

-

-

±1.0

%RH

-

0.014

-

%RH

-

±0.15

-

%RH

-

-

±0.1

-

%RH/Yr

20% to 80% RH, 1 meter/sec
air flow-1-

20% to 80% RH Still Air

3.0

4.0

6.0

Operating Range
HS3x01
Accuracy [1]HS3x02HS3x03

Resolution

10% to 90% RH
20% to 80% RH

Hysteresis-

Noise in Humidity (RMS)

14-bitHS3x01

Non-Linearity from Response Curve

HS3x02HS3x03

10% to 90% RH

1.

Monotonic increases from 10% to 90% RH after sensor has been stabilized at 50% RH.

2.

Initial value to 63% of total variation.

3.2

%RH

20% to 80% RH

Long-Term Stability

Response Time Constant [2] (τH)

%RH

sec

Temperature Sensor Specification

Temperature Sensor Specification, TA = +25°C, VDD = 2.3V to 5.5V
Parameter

Condition

Minimum

TypicalMaximum

Unit

-

-40

-

125

°C

-10°C to 80°C

-

±0.2

-

0°C to 70°C

-

±0.25

-

8- bit-0.9-

14-bit

-

0.015

-

Range
HS3x01
AccuracyHS3x02HS3x03

Resolution°C°C

Response Time Constant [1] (τT)

-

2.0

-

-

Sec.

Long-Term Stability

-

-

-

0.02

°C/Yr

VDD ≥ 2.8V

-

0.03

0.1

°C/V

1.8V < VDD < 2.8V

-

1.25

2.25

°C/V

Supply Voltage Dependency [2]1.

Response time depends on system thermal mass and air flow.

2.

Temperature accuracy can be optimized for specified supply voltages upon request.

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3.3

Sleep Current

The sleep current of the HS3xxx series depends on the operating temperature (see Figure 3). Note that there isno significant dependence of the sleep current on the supply voltage.

Figure 3. Sleep Current Variation over Temperature, VDD at 3.3V

3.4

Humidity Sensor Accuracy Graphs

The typical relative humidity sensor accuracy tolerances are shown in the following figures.

Figure 4. HS3x01 RH Accuracy Tolerance at 25°C

Figure 5. HS3x01 RH Accuracy over Temperature

Figure 6. HS3x02 RH Accuracy Tolerance at 25°C

Figure 7. HS3x02 RH Accuracy over Temperature

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Figure 8. HS3x03 RH Accuracy Tolerance at 25°C

3.5

Figure 9. HS3x03 RH Accuracy over Temperature

Temperature Sensor Accuracy Graphs

The typical and maximum temperature sensor accuracy tolerances are shown in the following figures.

Figure 10. HS3x01 Temperature Sensor Accuracy
Tolerance

Figure 11. HS3x03 Temperature Sensor Accuracy
Tolerance

4. Conditioning
After soldering or prolonged storage outside the nominal storage conditions, a conditioning routine must be
applied to ensure high sensor accuracy. Not following this routine will result in a slowly disappearing offset in therelative humidity readings. When a relative humidity sensor is exposed to the high heat associated with thesoldering process, the sensor element tends to dry out. To avoid an offset in the relative humidity readings, thesensor element must be rehydrated after the soldering process.
Recommended rehydration process:■A relative humidity of 75% RH at room temperature for at least 12 hours
Or■

A relative humidity of 40% to 50% RH at room temperature for 3 to 5 days

To avoid relative humidity reading offset after prolonged storage outside the recommended storage conditions,use the following procedure to recondition the humidity sensor.
1. Bake at a temperature of 100°C with a humidity < 10% RH for 10 to 12 hours.
2. Rehydrate the sensor at a humidity of 75% RH and a temperature between 20°C to 30°C for 12 to 14 hours.

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5. PCB Layout Guide
When designing the PCB, undesired heat transfer paths to the HS3xxx series must be minimized. Excessive
heat from other components on the PCB will result in inaccurate temperature and relative humidity
measurements. As such, solid metal planes for power supplies should be avoided in the vicinity of thesensor since these will act as thermal conductors. To further reduce the heat transfer from othercomponents on the board, openings can be milled into the PCB as shown in Figure 12.

Figure 12. Milled PCB Openings for Thermal Isolation

6. Application Circuit
VDD
RP

RP

1 SCL

VSS 6

2 SDA

NC 5

3 VC

VDD 4

0.1µF

0.1µF

RP = Pull-up resistor (2.2kΩ typical)

Figure 13. HS3xxx Application Circuit

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7. Sensor Interface
The HS3xxx series sensor uses a digital I2C-compatible communication protocol. To accommodate multiple
devices, the protocol uses two bi-directional open-drain lines: the Serial Data Line (SDA) and the Serial ClockLine (SCL). Pull-up resistors to VDD are required. Several slave devices can share the bus; however only one
master device can be present on the line.

7.1

I2C Features and Timing

The HS3xxx series sensor operates as a slave device on the I2C bus with support for 100kHz and 400kHz bit
rates. Each transmission is initiated when the master sends a 0 START bit (S), and the transmission is
terminated when the master sends a 1 STOP bit (P). These bits are only transmitted while the SCL line is HIGH.

SDAtSUDATtLOWtHDSTAtBUS

SCL

tHDSTAtHDDATtHIGHtSUSTAtSUSTO

Figure 14. Timing Diagram
Table 1. I2C Timing Parameters
Parameter

SymbolMinimum

TypicalMaximumUnit

SCL Clock Frequency [1]

fSCL

20

-

400

kHz

START Condition Hold Time Relative to SCL Edge

tHDSTA

0.1

-

-

µs

Minimum SCL Clock LOW Width [2]

tLOW

0.6

-

-

µs

Minimum SCL Clock HIGH Width [2]

tHIGH

0.6

-

-

µs

START Condition Setup Time Relative to SCL EdgetSUSTA

0.1

-

-

µs

Data Hold Time on SDA Relative to SCL EdgetHDDAT

0

-

0.5

µs

Data Setup Time on SDA Relative to SCL EdgetSUDAT

0.1

-

-

µs

STOP Condition Setup Time on SCL

tSUSTO

0.1

-

-

µs

Bus Free Time Between STOP Condition and START Condition

tBUS

1

-

-

µs

1.

The minimum frequency of 20kHz applies to test only; no minimum under normal operations.

2.

Combined LOW and HIGH widths must equal or exceed the minimum SCL period

7.2

Sensor Slave Address

The HS3xxx series default I2C address is 44HEX. The device will respond only to this 7-bit address. See section
7.3 for further information.
Custom I2C address can be provided upon request.

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7.3

I2C Communication

The sensor transmission is initiated when the master sends a 0 START bit (S). The transmission is terminatedwhen the master sends a 1 STOP bit (P). These bits are only transmitted while the SCL line is HIGH (see Figure
15 for waveforms).
Once the START condition has been set, the SCL line is toggled at the prescribed data rate, clocking
subsequent data transfers. Data on the SDA line is always sampled on the rising edge of the SCL line and mustremain stable while SCL is HIGH to prevent false START or STOP conditions.
START Condition
SCL

STOP Condition
SCL

START

STOP

SDA

SDA

Figure 15. START and STOP Condition Waveform

After the START bit, the master device sends the 7-bit slave address (see section 7.2) to the HS3xxx, followedby the read/write bit, which indicates the transfer direction of any subsequent data. This bit is set to 1 to indicate
a read from slave to master or set to 0 to indicate a write from master to slave.
All transfers consist of 8 bits and a response bit: 0 for Acknowledge (ACK) or 1 for Not Acknowledge (NACK).
After the ACK is received, another data byte can be transferred or the communication can be stopped with a
STOP bit.

7.4

Measurement Mode

The HS3xxx is factory-programmed to operate in Sleep Mode. In Sleep Mode, the sensor waits for commands
from the master before taking measurements. The digital core only performs conversions when it receives a
Measurement Request command (MR); otherwise, it is always powered down.

7.5

Measurement Requests (MR)The MR command is required to wake up the HS3xxx from its Sleep Mode. Initiate the Measurement Request bysending the 7-bit slave address followed by an eighth bit = 0 (WRITE).
A measurement cycle consists of a humidity and temperature conversion followed by the digital signal processor(DSP) correction calculations. At the end of a measurement cycle, the digital output register will be updated
before powering down.
The output is always scaled to 14 bits. The order of the bits is big-endian.
S

1

0

0

0

1

0

0

W A
(0)

S

Wait forSlave ACK

Device Slave Addre ss [6:0]S

Sta rt Condition

S

Stop Condition

A

Acknowle dge (ACK)

Slave Address Bit(MSB f irst)

W

Read/Writ e(Ex ample: Write = 0)

Figure 16. Measurement Request

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7.6

Data Fetch (DF)At the end of a measurement cycle, valid data can be fetched. The status bits of the DF results can be used todetect if the data is valid or stale (see section 7.8); otherwise, wait for the measurements to complete before
performing the DF.
The DF command starts with the 7-bit slave address followed by an eighth bit = 1 (READ). The HS3xxx as aslave sends an acknowledge (ACK) indicating success.
The number of data bytes returned by the HS3xxx is determined by when the master sends the NACK and
STOP condition. The full 14 bits of the humidity data are fetched in the first two bytes. The two MSBs of the first
byte are the status bits.
The 14 bits of temperature data follow the humidity data. The last two bits (LSBs) of the fourth data byte areundetermined and should be masked off. In the event that the temperature data is not needed, the read can beterminated by sending a NACK after the second byte.
Alternatively, if only 8-bit resolution is desired for the temperature output, the read can be terminated after the
3rd byte by issuing a NACK followed by a stop bit. The measurement time depends on the configured sensor
resolution. The following table lists examples when the resolutions for the relative humidity and temperature
measurements are the same. For different relative humidity and temperature resolution settings, themeasurement times in 3 should be used, along with the 0.1ms wake-up time.
For example, an 8-bit relative humidity measurement and a 12-bit temperature measurement results in a total
measurement time of:
0.1ms + (1.4ms/2) + (10ms/2) = 5.8ms
RH+T measurement times (including wake-up time) at different resolution settings.

1.
S

1

0

0

0

1

0

0

Resolution [1](bits)

Measurement
Time (ms)

8

1.4

10

2.9

12

10

14

35

Same resolutions are assumed for both relative humidity and temperature.

R A 15 14 13 12 11 10 9(1)

Device Slave Addre ss [6:0]

1

0

0

0

1

0

0

Sta rt Condition

S

7

6

5

4

3

2

1

8

Hum idity Dat a [1 3:8]

Stop Condition

Slave Address Bit (MSB f irst)

A

2

0

N

S

Hum idity Dat a [7 :0]

Master ACK

R A 15 14 13 12 11 10 9(1)

Device Slave Addre ss [6:0]SA

Hum idity Dat a [1 3:8]

Wait for S lav e ACK
S

8

A

7

Master ACK
6

5

4

3

2

1

0

A 15 14 13 12 11 10 9

Hum idity Dat a [7 :0]

Acknowle dge (ACK)N

Master NACK

Not Acknowledge(NACK)Com mand or Data Bit (Ex ample : Bit 2)

8

Temp. Data [15:8 ]

R

A

7

6

5

4

3

2

Temp. Data [7:2]

1

0

N S

Mask [1:0 ]Read/Writ e(Read = 1)

Sta tus Bit

Figure 17. Data Fetch

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7.7

Calculating Humidity and Temperature Output

The entire output of the HS3xxx is 4 bytes. The relative humidity (in percent) and the temperature (in degrees
Celsius) are calculated with Equation 1 and Equation 2, respectively.
Equation 1

 Humidity [13 : 0] =
Humidity [%RH]  ∗ 100
214 − 1Equation 2

 Temperature [15 : 2] 
[ o C] Temperature= ∗ 165 − 40
214 − 1



7.8

Status Bits

The status bits are used to indicate the current state of the fetched data. The two MSBs of the humidity data byte
are the status bits (see the following table).
Status Bits
00B

Definition
Valid Data: Data that has not been fetched since the last measurement cycle.
Stale Data: Data that has already been fetched since the last measurement cycle.

01B

7.9

Note: If a data fetch is performed before or during the first measurement after power-on reset, then the stale
status will be returned, but this data is actually invalid since the first measurement has not been completed.

Accessing the Non-Volatile Memory

The HS3xxx series non-volatile memory stores its measurement resolution setting and its ID number. To change
the sensor resolution or read the ID number, the master must place the HS3xxx into programming mode while
the chip is powering up. The figure below shows the sequence of commands needed to enter the programming
mode, which must be sent within 10ms after applying power to the sensor. The master must send the I2C
address and a Write bit followed by the command 0xA0|0x00|0x00.

Figure 18. Sequence of Commands to Enter Programming Mode

This command takes 120µs to process, after which the master has access to the non-volatile memory registers
listed in the following table. All of these registers are 16 bits wide.
To return to normal sensor operation and perform measurements, the master must send the I2C address and a
Write bit, followed by the command: 0x80|0x00|0x00.

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Table 2. Non-Volatile Memory Registers
Address

Register Description

0x06

Humidity Sensor Resolution – Read Register (bits 11:10).

0x46

Humidity Sensor Resolution – Write Register (bits 11:10).

0x11

Temperature Sensor Resolution – Read Register (bits 11:10).

0x51

Temperature Sensor Resolution – Write Register (bits 11:10).

0x1E

Read Sensor ID – Upper 2 bytes.

0x1F

Read Sensor ID – Lower 2 bytes.

7.10 Setting the Measurement Resolution
The HS3xxx series relative humidity and temperature measurement resolutions can be set independently to 8,
10, 12, or 14-bits by writing to the non-volatile memory and are initially set to 14-bits by default. The procedure to
set the humidity sensor resolution is illustrated in the following figure. The relative humidity and temperature
resolution can be read in registers 0x06 and 0x11, respectively, or written in registers 0x46 or 0x51. The
resolution information is stored in bits [11:10] of these registers, as listed in Table 3. All the other bits in theseregisters must be left unchanged. As such, before writing new resolution settings, the contents of the readregisters must be read, and only bits [11:10] can be changed in the write registers. Once bits [11:10] arechanged to set the desired resolution, the entire register must be written back to the HS3xxx sensor.

Figure 19. Sequence of Commands to Change the Relative Humidity Resolution

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Table 3. Register Values for Different Resolution Settings
Resolution Register
bits [11:10]

Resolution(bits)

00B

8

01B

10

10B

12

11B

14

The sensor non-volatile memory requires 120µs to load the data into the registers after step 1 and requires 14ms
to write the data after step 4. Failure to comply with these processing times may result in data corruption andintroduce errors in sensor measurements. The procedure to change the temperature sensor resolution is thesame as that depicted in Figure 19, except the register address in Step 1 must be set to 0x11 and the register
address in Step 4 will be 0x51.

7.11 Reading the HS3xxx ID Number
The sensor ID is a 32-bit number and can be read in a similar fashion as illustrated in steps 1 and 2 of Figure 19,
using the appropriate register address values. The ID number is stored in two registers, with the upper and lower
16 bits stored in register addresses 0x1E and 0x1F, respectively.

8. Soldering Information
This section discusses soldering considerations for the HS3xxx. When a relative humidity sensor is exposed tothe high heat associated with the soldering process, the sensor element tends to dry out. Care must also betaken when selecting the temperatures and durations involved in the soldering process to avoid irreversibly
damaging the sensor element.
The recommended soldering profile for a lead-free (RoHS-compliant) process is shown below.

Figure 20. Recommended Soldering Profile

R36DS0045EU0101 Rev.1.01
Jun 17, 2024

Page 15

HS3xxx Datasheet
It is important to ensure this temperature profile is measured at the sensor itself. Measuring the profile at a larger
component with a higher thermal mass means the temperature at the small sensor will be higher than expected.
For manual soldering, the contact time must be limited to 5 seconds with a maximum iron temperature of 350°C.
In either case, a board wash after soldering is not recommended. Therefore, if a solder paste is used, it isstrongly recommended that a “no clean” solder paste is used to avoid the need to wash the PCB.
After soldering, please follow the recommended rehydration process found in section 4, Conditioning. Otherwise,in the relative humidity readings, there might be an initial offset, which will slowly disappear as the sensor is
exposed to ambient conditions.

9. Storage and Handling
Recommendation: Once the sensors are removed from their original packaging, store them in metal-in antistatic
bags.
Avoid using polyethylene antistatic bags as they may affect sensor accuracy.
The nominal storage conditions are 10°C to 50°C and humidity levels within 20% to 60% RH. If stored outside ofthese conditions for extended periods of time, the sensor readings may exhibit an offset. The sensor can bereconditioned and brought back to its calibration state by applying the procedure described in section 4,
Conditioning.

10. Quality and Reliability
The HS3xxx series is available as a qualified product for consumer and industrial market applications. All data
specified parameters are guaranteed if not stated otherwise.

R36DS0045EU0101 Rev.1.01
Jun 17, 2024

Page 16HS3xxx Datasheet

11. Package Outline Drawings
The package outline drawings are located at the end of this document and are accessible from the Renesas
website. The package information is the most current data available and is subject to change without revision ofthis document.

12. Marking Diagram
H3xx
YWXX

PIN 1 Dot■Line 1: Sensor type (for example, H301 = HS3001)■

Line 2:

Inlet (HS300x only)●

First character: Year (for example, 4 = 2024)

Inlet with membrane(HS310x only)●

Second character: Workweek (for example, X = 31)●

Third and fourth character: Lot sequential code

13. Ordering Information
Part Number

Package Description

Carrier Type

Temperature Range

HS3001

Digital Relative Humidity and Temperature Sensor.
±1.5% RH (typical), 3.0 × 2.41 × 0.8 mm, 6-LGA

Tape-40°C to +125°C

HS3002

Digital Relative Humidity and Temperature Sensor.
±1.8% RH (typical), 3.0 × 2.41 × 0.8 mm, 6-LGA

Tape-40°C to +125°C

HS3003

Digital Relative Humidity and Temperature Sensor.
±2.5% RH (typical), 3.0 × 2.41 × 0.8 mm, 6-LGA

Tape-40°C to +125°C

HS3101

Digital Relative Humidity and Temperature Sensor withhydrophobic membrane.

Reel-40°C to +125°C

HS3102

Digital Relative Humidity and Temperature Sensor withhydrophobic membrane.

Reel-40°C to +125°C

Reel-40°C to +125°C±1.5% RH (typical), 3.0 × 2.41 × 0.9 mm, 6-LGA±1.8% RH (typical), 3.0 × 2.41 × 0.9 mm, 6-LGA

HS3103

Digital Relative Humidity and Temperature Sensor withhydrophobic membrane.
±2.5% RH (typical), 3.0 × 2.41 × 0.9 mm, 6-LGA

14. Revision History
Revision

Date

1.01

Jun 17, 2024

Description
 Updated PCB Layout Guide section.
 Updated Marking Diagram and associated text.
 Updated Product Image on page 1.

1.00

Mar 7, 2024

R36DS0045EU0101 Rev.1.01
Jun 17, 2024

Initial release.

Page 17

Package Outline Drawing
Package Code: LHG6D1
LHG6 3.0 x 2.4 x 0.8 mm Body, 1.0mm Pitch
PSC-4719-01, Revision: 02, Date Created: Oct 28, 2024

3.00 ±0.10(2.80)(0.11)(0.33)

Pin1 Corner

2

1

3

1.42
(2.21)
2.40 ±0.10

1.84

6

(R0.12)(R0.24)

Top View

5

1.00

0.25x0.50
Rectangular Port

4

0.35
0.35

Bottom View

0.10 C(0.18)

0.80 ±0.10

Seating Plane
0.08 CCSide View

0.35
1.00
0.61

1.49

2.71

Recommended Land Pattern Dimension© Renesas Electronics Corporation

Notes:
1. All Dimension are in mm. Angles in degrees.
2. Top down view. As viewed on PCB.
3. Land Pattern Recommendation per IPC-7351B
generic requirement for surface mount designand land pattern.

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