Datasheet
HS41xxHigh-Performance Relative Humidity and Temperature Sensor with Analog Output
The HS41xx series is a highly accurate, fully
calibrated automotive grade relative humidity andtemperature sensor with an analog output. While theHS410x series comes in a standard package with anopen air inlet, the HS411x series features ahydrophobic membrane, making it dust resistant andwaterproof with IP67 rating. Both sensor versions,waterproof and non-waterproof, are available in two
different accuracy classes, HS41x1 and HS41x3.
The MEMS sensor features a proprietary sensorlevel protection, ensuring high reliability and longterm stability.
Integrated calibration using a NIST traceable andverified production setup that is calibrated to ISO/IEC
17025 standards and temperature-compensation
logic provides fully corrected RH and temperature
values via an analog output. User calibration of theoutput data is not required.
The high accuracy, fast measurement response time,and long-term stability, combined with the small
package size, makes the HS41xx ideal for a wide
number of applications ranging from portable devices
to products designed for harsh environments.
The HS41xx are digital sensors at their core.
Measurements are then converted to ratio-metricanalog output. This makes the HS41xx suitable forhigh-noise environment applications.

Physical Characteristics

Features■

Humidity range: 0% to 100%RH■

Industrial grade, JEDEC qualified, -40°C to+105°C■

Automotive grade, AEC-Q100 qualified, Grade 2,-40°C to +105°C■

ESD Human Body Model, JESD22-A114, Class 2■

ESD Charged Device Model, JESD22-C101,Class C2■NIST traceability for relative humidity andtemperature■

Hydrophobic membrane, IP67 rating (HS411x)■

10% to 90% ratio-metric analog output voltage■

RH accuracy: ±1.5%RH, typical (HS41x1)■

Fast RH response time: 4 seconds time constant,typical■Temperature sensor accuracy: ±0.2°C, typical(HS41x1, -10°C to +80°C)■

Very low current consumption: 92µA average(3.3V supply)■

Excellent stability against aging and volatilecompounds■

Highly robust protection from harsh environmental
conditions and mechanical shock

Applications■

Supply voltage of 1.71V to 3.6V

Climate control systems■

Operating temperature of -40°C to +105°C

Instrumentation■■

2.5 × 2.5 × 0.9 mm DFN-style 8-LGA package

Home appliances■■

Weather stations■

Building automation■

HVAC systems■

Medical equipment■

Data logging systems■

Product Image

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HS41xx Datasheet

Contents
1.

2.

3.

Pin Information .............................................................................................................................................4
1.1

Pin Assignments ...................................................................................................................................4

1.2

Pin Descriptions....................................................................................................................................4

1.3

Functional Diagram ..............................................................................................................................4

Specifications ...............................................................................................................................................5
2.1

Absolute Maximum Ratings ..................................................................................................................5

2.2

Recommended Operating Conditions...................................................................................................5

Humidity and Temperature Sensor Performance ......................................................................................6
3.1

Humidity Sensor Specifications ............................................................................................................6

3.2

Temperature Sensor Specifications......................................................................................................6

3.3

Humidity Sensor Accuracy Graphs .......................................................................................................7

3.4

Temperature Sensor Accuracy Graphs ................................................................................................84.

Sensor Startup ..............................................................................................................................................8

5.

Conditioning .................................................................................................................................................86.

PCB Layout Guide ........................................................................................................................................87.

Application Circuit ........................................................................................................................................98.

Converting Output Signal ............................................................................................................................99.

Soldering Information ................................................................................................................................11

10. Storage and Handling.................................................................................................................................12
11. Quality and Reliability ................................................................................................................................12
12. Package Outline Drawings.........................................................................................................................12
13. Marking Diagram ........................................................................................................................................12
14. Ordering Information ..................................................................................................................................12
15. Revision History .........................................................................................................................................13

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List of Figures
Figure 1. Pin Assignments – Top View ................................................................................................................... 4
Figure 2. Functional Diagram for HS41xx............................................................................................................... 4
Figure 3. HS41x1 RH Accuracy Tolerance at 25°C ................................................................................................ 7
Figure 4. HS41x1 RH Accuracy over Temperature ................................................................................................ 7
Figure 5. HS41x3 RH Accuracy Tolerance at 25°C ................................................................................................ 7
Figure 6. HS41x3 RH Accuracy over Temperature ................................................................................................ 7
Figure 7. HS41x1 Temperature Sensor Accuracy Tolerance ................................................................................. 8
Figure 8. HS41x3 Temperature Sensor Accuracy Tolerance ................................................................................. 8
Figure 9. Milled PCB Openings for Thermal Isolation ............................................................................................. 9
Figure 10. HS41xx Application Circuit .................................................................................................................... 9
Figure 11. Relative Humidity vs. VRH Output Analog Voltage ............................................................................. 10
Figure 12. Temperature vs. VT Output Analog Voltage ........................................................................................ 10
Figure 13. Recommended Soldering Profile ......................................................................................................... 11

List of Tables
Table 1. Humidity Sensor Specifications, TA = +25°C, VDD = 1.71V to 3.6V ........................................................... 6
Table 2. Temperature Sensor Specifications, TA = +25°C, VDD = 1.71V to 3.6V .................................................... 6

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1. Pin Information
1.1

Pin Assignments
4

3

2

1

7

8

9

5

6

Figure 1. Pin Assignments – Top View

1.2

Pin Descriptions

Pin Number

Pin Name

Type

Description

1

VRH [0]Out

Analog RH output voltage.

2

VSS

In

Ground.

3

VSS

In

Ground.

4

VT [0]

Out

Analog temperature output voltage.

5

VDD

In

Supply voltage.

6

NC [2]-

Connect to VSS, VDD or leave floating

7

NC [2]-

Connect to VSS, VDD or leave floating

8

VSS

In

Ground.

9

DAP-

Connect to VSS or leave floating

1.

VRH and VT requires a capacitor (for more information, see Application Circuit).

2.

“NC” stands for not connected / no connection required / not bonded.

1.3

Functional Diagram

Figure 2. Functional Diagram for HS41xx

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2. Specifications
2.1

Absolute Maximum Ratings

Caution: The absolute maximum ratings are stress ratings only. Stresses greater than those listed below cancause permanent damage to the device. Functional operation of the HS41xx at absolute maximum ratings is not
implied. Exposure to absolute maximum rating conditions might affect device reliability.
Parameter
Supply Voltage
Storage Temperature Range

2.2

Conditions

Minimum

Maximum

Unit

-

-0.3

3.6

V

-40

125

°C

Recommended 0 to 60°C

Recommended Operating Conditions

Important: The HS41xx series sensors are optimized to perform best in the more common temperature andhumidity ranges of 10°C to 50°C and 20% RH to 80% RH, respectively. If operated outside of these conditions
for extended periods, especially at high humidity levels, the sensors may exhibit an offset. In most cases, thisoffset is temporary and will gradually disappear once the sensor is returned to normal temperature and humidity
conditions. The amount of the shift and the duration of the offset vary depending on the duration of exposure andthe severity of the relative humidity and temperature conditions.[1] The time needed for the offset to disappear
can also be decreased by using the procedures described in chapter 5.
Parameter

Condition

Minimum

TypicalMaximum

Unit

-

1.71

3.3

3.6

V

VDD = 1.8V

-

82

95

VDD = 3.3V

-

92

110

Humidity and temperature measurement

-

1.7

2.3

ms

-40

-

105

°C

Operating Supply Voltage
Average Current
Measurement TimeOperating Temperature Range
1.

-

µA

At TA = +25°C, VDD = +1.71V to +3.6V unless otherwise noted.

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3. Humidity and Temperature Sensor Performance
3.1

Humidity Sensor Specifications
Table 1. Humidity Sensor Specifications, TA = +25°C, VDD = 1.71V to 3.6V
Parameter

Condition

Minimum

TypicalMaximum

Unit

-

0

-

100

%RH

HS41x1

10% to 90%RH

-

±1.5

-

HS41x3

20% to 80%RH

-

±2.5

-

Range
Accuracy [1][2]%RH

Resolution

14- bit

-

0.04

-

%RH

Hysteresis

-

-

-

±1.0

%RH

-

±0.15

-

%RH

-

±0.1

-

%RH/Yr

3.0

4.0

6.0

sec

Non-Linearity from Response Curve

HS41x1

10% to 90%RH

HS41x3

20% to 80%RH

Long-Term Stability
Response Time Constant [3] (τH)
1.

20% to 80% RH Still Air

Monotonic increases from 10 to 90% RH after sensor has been stabilized at 50% RH.

2.

For more information, see section 3.3.

3.

Initial value to 63% of total variation. The response time depends on system airflow.

3.2

Temperature Sensor Specifications
Table 2. Temperature Sensor Specifications, TA = +25°C, VDD = 1.71V to 3.6V
Parameter

Condition

Minimum

TypicalMaximum

Unit

-

-40

-

105

°C

HS41x1-10°C to 80°C

-

±0.2

-

HS41x30°C to 70°C

-

±0.25

-

Range
Accuracy [1]°C

Resolution

-

-

0.01

-

°C

Response Time Constant [2] (τT)

-

-

>2.0

-

Sec.

Long-Term Stability

-

-

-

0.03

°C/Yr

Supply Voltage Dependency [ 3 ]

-

-

0.03

0.1

°C/V

1.

For more information, see section 0.

2.

Initial value to 63% of total variation. The response time depends on system thermal mass and air flow.

3.

Temperature accuracy can be optimized for specified supply voltages upon request.

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3.3

Humidity Sensor Accuracy Graphs

The typical and maximum relative humidity sensor accuracy tolerances are shown in the following figures.

Figure 3. HS41x1 RH Accuracy Tolerance at 25°C

Figure 4. HS41x1 RH Accuracy over Temperature

Figure 5. HS41x3 RH Accuracy Tolerance at 25°C

Figure 6. HS41x3 RH Accuracy over Temperature

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HS41xx Datasheet

3.4

Temperature Sensor Accuracy Graphs

The typical and maximum temperature sensor accuracy tolerances are shown in the following figures.

Figure 7. HS41x1 Temperature Sensor Accuracy
Tolerance

Figure 8. HS41x3 Temperature Sensor Accuracy
Tolerance

4. Sensor Startup
The HS41xx sensor requires a typical 100ms to start up, after which temperature and relative humidity
measurement data will be provided on the corresponding pins.

5. Conditioning
After soldering or prolonged storage outside the nominal storage conditions, a conditioning routine must be
applied to ensure high sensor accuracy. Not following this routine will result in a slowly disappearing offset in therelative humidity readings. When a relative humidity sensor is exposed to the high heat associated with thesoldering process, the sensor element tends to dry out. To avoid an offset in the relative humidity readings, thesensor element must be rehydrated after the soldering process.
Recommended rehydration process:■A relative humidity of 75% RH at room temperature for at least 12 hours, or■A relative humidity of 40% to 50% RH at room temperature for 3 to 5 days

To avoid relative humidity reading offset after prolonged storage outside the recommended storage conditions
use the following procedure to recondition the humidity sensor.
1. Bake at a temperature of 100°C with a humidity < 10% RH for 10 to 12 hours.
2. Rehydrate the sensor at a humidity of 75% RH and a temperature between 20°C to 30°C for 12 to 14 hours.

6. PCB Layout Guide
When designing the PCB, undesired heat transfer paths to the HS41xx must be minimized. Excessive heat fromother components on the PCB will result in inaccurate temperature and relative humidity measurements. As
such, solid metal planes for power supplies should be avoided in the vicinity of the sensor because thesewill act as thermal conductors. To further reduce the heat transfer from other components on the board,
openings can be milled into the PCB as shown in Figure 9.

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HS41xx Datasheet

Figure 9. Milled PCB Openings for Thermal Isolation

7. Application Circuit
The HS41xx sensor requires a 2.2µF ceramic capacitor connected to the ground on both the VRH and VT
outputs. It is also recommended to buffer the output of the relative humidity and temperature signals before
processing the analog voltage. The buffer should have a low input leakage current, < 1nA, and a low input offset
voltage, < 1mV, to ensure high signal integrity.

Figure 10. HS41xx Application Circuit

8. Converting Output Signal
The voltage levels of the filtered analog output signal are ratio-metric with VDD. The default output range for the
relative humidity and temperature is from 10% to 90%.
Each HS41xx sensor is individually calibrated so that a standard linear fitting equation can be used to obtain themeasured temperature and RH value. Figure 11 and Figure 12 shows the RH and temperature graphically.
The relative humidity (in percent) and the temperature (in degrees Celsius) are calculated with Equation 1 andEquation 2, respectively.

𝐻𝐻𝐻𝐻𝐻𝐻𝐻𝐻𝐻𝐻𝐻𝐻𝐻𝐻𝐻𝐻 [%𝑅𝑅𝑅𝑅] = 125 ∗𝑉𝑉𝑉𝑉𝑉𝑉− 12.5𝑉𝑉𝑉𝑉𝑉𝑉

𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇 [°𝐶𝐶] = 181.25 ∗R36DS0049EU0102 Rev.1.02
Jun 14, 2024

𝑉𝑉𝑉𝑉
− 58.125
𝑉𝑉𝑉𝑉𝑉𝑉

Equation 1

Equation 2

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HS41xx Datasheet

Figure 11. Relative Humidity vs. VRH Output Analog Voltage

Figure 12. Temperature vs. VT Output Analog Voltage

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9. Soldering Information
This section discusses soldering considerations for the HS41xx.
Standard reflow ovens can be used to solder the HS41xx series sensor to the PCB. The peak temperature (Tp)for use with the JEDEC J-STD-020D standard soldering profile is 260°C. For manual soldering, the contact timemust be limited to 5 seconds at up to 350°C. In either case, if solder paste is used, it is recommended to use“no-clean” solder paste to avoid the need to wash the PCB.
When a relative humidity sensor is exposed to the high heat associated with the soldering process, the sensor
element tends to dry out. To avoid an offset in the relative humidity readings, the sensor element must be
rehydrated after the soldering process. Care must also be taken when selecting the temperatures and durations
involved in the soldering process to avoid irreversibly damaging the sensor element.
The recommended soldering profile for a lead-free (RoHS-compliant) process is shown below.

Figure 13. Recommended Soldering Profile

It is important to ensure this temperature profile is measured at the sensor itself. Measuring the profile at a larger
component with a higher thermal mass means the temperature at the small sensor will be higher than expected.
For manual soldering, the contact time must be limited to 5 seconds with a maximum iron temperature of 350°C.
In either case, a board wash after soldering is not recommended. Therefore, if a solder paste is used, it isstrongly recommended that a “no-clean” solder paste is used to avoid the need to wash the PCB.
After soldering, the recommended rehydration process of section 5 should be done. Otherwise, there may be an
initial offset in the relative humidity readings, which will slowly disappear as the sensor get exposed to ambientconditions.

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10. Storage and Handling
Recommendation: Once the sensors are removed from their original packaging, store them in metal-in antistatic
bags.
Avoid using polyethylene antistatic bags as they may affect sensor accuracy.
The nominal storage conditions are 10 to 50°C, and humidity levels within 20% to 60%RH. If stored outside ofthese conditions for extended periods of time, the sensor readings may exhibit an offset. The sensor can bereconditioned and brought back to its calibration state by applying the procedure described in section 5.

11. Quality and Reliability
The HS41xx is available as a qualified product for consumer and industrial market applications. All data specified
parameters are guaranteed if not stated otherwise.

12. Package Outline Drawings
The package outline drawings are located at the end of this document and are accessible from the Renesas
website. The package information is the most current data available and is subject to change without revision ofthis document.

13. Marking Diagram
41xx

Inlet (HS410x only)

Mark legend:Line 1: Sensor type (for example, 4111)

Inlet with membran(HS411x only)

YWSN
Pin 1 DotLine 2:First character:Year (for example, 3 = 2023)
Second character:
Week code (for example, X = 31)
Third and fourth character: Test Release Sequence Number

14. Ordering Information
Part Number

Package Description

Carrier Type

Temperature Range

HS4101

Relative Humidity and Temperature Sensor, Analog Output.
±1.5% RH (Typical), 2.5 × 2.5 × 0.9 mm, 8-LGA

Reel-40°C to +105°C

HS4103

Relative Humidity and Temperature Sensor, Analog Output.
±2.5% RH (Typical), 2.5 × 2.5 × 0.9 mm, 8-LGA

Reel-40°C to +105°C

HS4111

Relative Humidity and Temperature Sensor, with Membrane,
Analog Output.
±1.5% RH (Typical), 2.5 × 2.5 × 0.9 mm, 8-LGA

Reel-40°C to +105°C

HS4113

Relative Humidity and Temperature Sensor, with Membrane,
Analog Output.
±2.5% RH (Typical), 2.5 × 2.5 × 0.9 mm, 8-LGA

Reel-40°C to +105°C

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15. Revision History
Revision

Date

1.02

Jun 14, 2024

Description
Updated PCB Layout Guide section.
 Added Functional Diagram

1.01

Oct 05, 2023

 Added Conditioning section
 Updated Pin Assignments and Pin Descriptions
 Updated performance characteristics

1.00

Aug 29, 2023

R36DS0049EU0102 Rev.1.02
Jun 14, 2024

Initial release.

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Package Outline Drawing
Package Code: LVG8D3
8-LGA 2.50 x 2.50 x 0.90 mm Body, 0.50mm Pitch
PSC-4861-03, Revision: 03 Date Created: Aug 27, 2024

0.25 X 0.35 (8x)2.50±0.10
PIN1
CORNER(2.30)

A(0.38)PIN1
CORNER(0.10)

0.250 ∠45°
(2.30)

2.50±0.10

0.852±0.10

1.95

0.64
Ø0.30
HOLE
0.64

(R0.13)0.50(R0.25)1.80±0.10

TOP VIEW

Solde rmask Opening

BOTTOM VIEW

0.90±0.10
0.08 C
Seating Plane(0.18)C

Solder mask

Package Edge

SIDE VIEW

Exposed Metal

Detail A
0.25

NOTES:
0.852

1.60

2.60

1.
2.
3.
4.

0.50
0.50

Package Outline

1.80

RECOMMENDED LAND PATTERN(PCB Top View, NSMD Design)© Renesas Electronics Corporation

JEDEC compatible
All dimensions are in mm, angles in degrees.
Use ±0.05 mm for non-toleranced dimensions.
Numbers in ( ) are for reference only.

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