Application Note

RL78 Family
Renesas Sensor I2C Communication Middleware Control Module Software
Integration SystemIntroduction
This application note explains sensor I2C communication middleware control module for Renesas sensors
using Software Integration System (SIS).
The sensor I2C communication middleware SIS module is a driver interface function layer to absorb thedifference between the sensor control modules (HS300x SIS module, FS2012 SIS module and ZMOD4XXX
SIS module) and IIC Communication (Master mode) component.
Hereinafter, the modules described in this application note is abbreviated as following,- The sensor I2C communication middleware module: COMMS SIS module
The detail descriptions include “Overview”, “API Information” and “COMMS (Sensor I2C CommunicationMiddleware) API Functions” of this SIS module are described in application note “Renesas Sensor Control
Modules Software Integration System (R01AN6192)”.
Please refer to “Renesas Sensor Control Modules Software Integration System (R01AN6192)” for using thisSIS module.

Target Device• Sensors: Renesas Electronics HS300x High Performance Relative Humidity and Temperature Sensor(HS300x sensor)
 Renesas Electronics FS2012 Renesas High Performance Flow Sensor Module (FS2012sensor)
 Renesas Electronics Digital Gas Senser ZMOD4410 (ZMOD4410 Indoor Air QualityPlatform) and ZMOD4510 (ZMOD4510 Outdoor Air Quality Platform)• RL78 Family MCUs:
MCUs supported the following IIC Communication (Master mode) component
 Serial Interface IICA
 Simplified I2C using Serial Array Unit (SAU)• Operation confirmed MCU: RL78/G23 (IIC Communication (Master mode) component)
When using this application note with other Renesas MCUs, careful evaluation is recommended after making
modifications to comply with the alternate MCU.

Target Compiler• Renesas Electronics C/C++ Compiler Package for RL78 Family

R01AN6193EJ0111 Rev.1.11
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RL78 Family

Renesas Sensor I2C Communication Middleware Control Module Software Integration System

Reference Documents
Renesas Electronics HS300x Datasheet (August 8, 2021) (R36DS0010EU0701)
Renesas Electronics FS2012 Series Datasheet (August 24, 2018)
Renesas Electronics ZMOD4410 Datasheet (December 17, 2021)
Renesas Electronics ZMOD4510 Datasheet (June 30, 2021)
Smart Configurator User’s Manual : RL78 API Reference (R20UT4852)
RL78/G23 User’s Manual: The latest version can be downloaded from the Renesas Electronics website.
Technical Update/Technical NewsThe latest information can be downloaded from the Renesas Electronics website.
• RL78 Family Compiler CC-RL User's Manual (R20UT3123)
The latest versions can be downloaded from the Renesas Electronics website.
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R01AN6193EJ0111 Rev.1.11
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RL78 Family

Renesas Sensor I2C Communication Middleware Control Module Software Integration SystemContents
Revision History ................................................................................................................................ 4
General Precautions in the Handling of Microprocessing Unit and Microcontroller Unit Products.... 5Notice ................................................................................................................................................ 6

R01AN6193EJ0111 Rev.1.11
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RL78 Family

Renesas Sensor I2C Communication Middleware Control Module Software Integration System

Revision History
Rev.
1.00
1.10

Date
December 9, 2021
March 1, 2022

Description
Page
SummaryFirst Release
Application note “Renesas Sensor Control Modules Software
Integration System (R01AN6192)” is updated.

1.11

March 3, 2023

-R01AN6193EJ0111 Rev.1.11
March 3. 23

Bug fix

Page 4 of 4

General Precautions in the Handling of Microprocessing Unit and Microcontroller
Unit Products
The following usage notes are applicable to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usage notes on theproducts covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.
1.

Precaution against Electrostatic Discharge (ESD)
A strong electrical field, when exposed to a CMOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps
must be taken to stop the generation of static electricity as much as possible, and quickly dissipate it when it occurs. Environmental control must beadequate. When it is dry, a humidifier should be used. This is recommended to avoid using insulators that can easily build up static electricity.
Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test andmeasurement tools including work benches and floors must be grounded. The operator must also be grounded using a wrist strap. Semiconductor2.

devices must not be touched with bare hands. Similar precautions must be taken for printed circuit boards with mounted semiconductor devices.
Processing at power-on
The state of the product is undefined at the time when power is supplied. The states of internal circuits in the LSI are indeterminate and the states ofregister settings and pins are undefined at the time when power is supplied. In a finished product where the reset signal is applied to the external resetpin, the states of pins are not guaranteed from the time when power is supplied until the reset process is completed. In a similar way, the states of pins
in a product that is reset by an on-chip power-on reset function are not guaranteed from the time when power is supplied until the power reaches the3.

level at which resetting is specified.
Input of signal during power-off state
Do not input signals or an I/O pull-up power supply while the device is powered off. The current injection that results from input of such a signal or I/O
pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal

4.

elements. Follow the guideline for input signal during power-off state as described in your product documentation.
Handling of unused pins
Handle unused pins in accordance with the directions given under handling of unused pins in the manual. The input pins of CMOS products are
generally in the high-impedance state. In operation with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity ofthe LSI, an associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal

5.

become possible.
Clock signals
After applying a reset, only release the reset line after the operating clock signal becomes stable. When switching the clock signal during program
execution, wait until the target clock signal is stabilized. When the clock signal is generated with an external resonator or from an external oscillator
during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Additionally, when switching to a clock signal

6.

produced with an external resonator or by an external oscillator while program execution is in progress, wait until the target clock signal is stable.
Voltage application waveform at input pin
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL(Max.) and VIH (Min.) due to noise, for example, the device may malfunction. Take care to prevent chattering noise from entering the device when the7.

input level is fixed, and also in the transition period when the input level passes through the area between VIL (Max.) and VIH (Min.).
Prohibition of access to reserved addresses
Access to reserved addresses is prohibited. The reserved addresses are provided for possible future expansion of functions. Do not access these8.

addresses as the correct operation of the LSI is not guaranteed.
Differences between products
Before changing from one product to another, for example to a product with a different part number, confirm that the change will not lead to problems.
The characteristics of a microprocessing unit or microcontroller unit products in the same group but having a different part number might differ in termsof internal memory capacity, layout pattern, and other factors, which can affect the ranges of electrical characteristics, such as characteristic values,operating margins, immunity to noise, and amount of radiated noise. When changing to a product with a different part number, implement a systemevaluation test for the given product.

Notice1.

Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products
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Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of suchspecified ranges.
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products are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily
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12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or RenesasElectronics products.
(Note1)(Note2)“Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlledsubsidiaries.
“Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
(Rev.4.0-1 November 2017)

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