Call for papers

ReMAR 2024
The 6th IEEE/IFToMM International Conference on Reconfigurable Mechanisms and Robots
Honorary Chair
Jian S. Dai (CN/UK)
General ChairDongming Gan (US)General Co‐ChairsCarl Nelson (US)Volkert van der Wijk (NL)
Fengfeng Xi (CA), Xilun Ding (CN)Program ChairsMark Yim (US), Ketao Zhang (UK),
Guangbo Hao (IE), Mark Plecnik (US)Organizing Committee Chairs
Yu She (US), Jared Butler (US), Pierre
Larochelle (US), Guowu Wei (UK)Awards & Sponsor Chairs
Mary Frecker (US), Gim Song (SG)Chin‐Hsing Kuo (AU), Long Wang (US)Scientific Committee
S.K. Agrawal (US), J. Angeles (CA), S.P.
Bai (DK), D. Caldwell (IT), M.
Ceccarelli (IT), J. Dias (AE), M. Frecker(US), P. Fanghella (IT), R. Di Gregorio(IT), C. Gosselin (CA), J. Ge(US), J.
Herder (NL), L. Howell (US), M. Husty(AT), A. Kecskeméthy (DE), V. Krovi(US), X.W. Kong (UK), P. Larochelle(US), A. Müller (AT), A. Murray (US), J.
McCarthy(US), V. Parenti‐Castelli (IT),A. Perez‐Gracia (US), B. Ravani (US),W.M. Shen (US), L. Seneviratne (AE),
H.J. Su (US), Y. Takeda (JP), F. Thomas(ES), R. Voyles (US), H. Wurdemann(UK), M. Yim (US), Z. You (UK), J.W.
Zhang (DE).
Program Committee
A. Arrieta (US), G. Berselli (IT), F.
Cannella (IT), C. Canali (IT), G.
Carbone (IT), S. Caro (FR), C. Chen(AU), G.M. Chen (CN), L. Cui (AU), H.
Feng (CN), L. Guo(CN), K.Y. Hang (US),K.L. Hsu (TW), Y. Jin (UK), R.J. Kang(CN), X. Kang (CN), P. Lambert (CA), D.
Lau (HK), J.W. Lee (KOR), B. Li (CN), X.
Ma (HK), D. Martins (BR), T. Nelson(US), L. Notash (CA), L. Nurahmi (ID),
N. Robson(US), U. Shah (UAE), E.
Singla (IN), C. Sung (US), P.
Voglewede (US), L. Wang (US), G.W.
Wei (UK), F.G. Xie (CN), Q.S. Xu (MO),J.J. Yu (CN), H.H. Zhang (US), J.G. Zhao(US), J.S. Zhao (CN).

June 24-27, 2024, Chicago, IL, US
Following successful completion in London (2009), Tianjin (2012), Beijing (2015), Delft(2018), and Toronto (2021), the 6th IEEE/IFToMM International conference on
Reconfigurable Mechanisms and Robots (ReMAR2024) will be held in Chicago, US, on
June 24‐27, 2024. We aim at a highly inspiring event by bringing together researchers
from a variety of research areas pertaining to reconfigurable mechanisms and robots.
Venue
The Conference will take place at the Holiday Inn Chicago North‐Evanston. Chicago, on
Lake Michigan in Illinois, is among the largest cities in the U.S. Famed for its boldarchitecture, the city is also renowned for its museums with convenient internationaland domestic airports.
Submission and publication
Authors are required to submit a full‐length paper, which should be 6‐8 pages.
Submitted papers will be reviewed by members of the Program Committee andselected external reviewers. All accepted papers will be included in conference
proceedings published by IEEE Xplore indexed by EI, Scopus, Web of Science andselected papers will be further reviewed for publication in special issues of leadinginternational journals (SCI).
Deadlines
30 January 2024 ‐ Submission of full draft paper
04 March 2024 ‐ Acceptance notification
22 March 2024 ‐ Submission of final paper
Topics of Interest• Reconfigurable Mechanisms and Robots• Planar and Spatial Deployable Mechanisms• Metamorphic Mechanisms and Robots• Kinematics and Dynamics of Reconfiguration• Cable‐Driven Parallel Robots• Engineering Origami• Variable Topology Modelling• Reconfigurable Manufacturing Systems• Application of Reconfigurable Systems• Compliant Mechanisms and robots• Soft Mechanisms and robots• Morphing mechanisms and applications

Registration
Regular early fee: $ 680.00
IFToMM member early fee: $ 630.00
Student early fee: $ 450.00
Early bird registration: May 1, 2024
Regular late fee: $ 730.00
IFToMM member late fee: $ 680.00
Student late fee: $ 500.00
Website: https://cvent.me/8DML0r
E‐mail: dgan@purdue.edu