POWER

MAY 16, 2024
CHRIS ALLEXANDRE
SVP AND GM OF POWER PRODUCT GROUPRENESAS ELECTRONICS CORPORATION© 2024 Renesas Electronics Corporation. All rights reserved.

AT A GLANCE
POWER

Our products and technologies

2023 Revenue

Power Management
Integrated Circuit (PMIC)

Computing Power

Catalog Power Management

Battery Management
System (BMS)

Discrete &WideBandgap

ASIC
PMIC

Battery Management
Catalog PowerManagement

Diversified portfolio serving key segments & megatrends

Computing Power

Industrial Automation

Infrastructure andData Center

Renewable Energy

Energy Storage

Building Automation

EV ChargerClient

Discrete &Wide Band Gap

IndustrialAutomotive(Control, Infotainment,ADAS)

IoTAutomotive xEVeMobility
PMIC: Power Management Integrated Circuit* Catalog Power Management includes products such as Intelligent Power Devices, drivers & gate controllers, & catalog DC/DC© 2024 Renesas Electronics Corporation. All rights reserved.

Infrastructure

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EXPANDING POWER PORTFOLIO WITH GaNACCELERATING POWER GROWTH BY BROADENING OFFERINGACCESSING ADDITIONAL SAM

expanding $13B* SAM in

Infrastructure & Computing

xEV / eMobility

Industrial

2H 2024

Attached to drivers and controllers = solutions enabling full end-to end power ecosystem

140W/240W USB PD3.1

350W 2-Wheeler OBC

1.8kW Server Power Supply 2-4kW Storage bi-directional charger

Source Yole, Wall Street Research* Estimated SAM in 2030
© 2024 Renesas Electronics Corporation. All rights reserved.

3

POWER STRATEGY AND SEGMENT FOCUS
Focus areas
Infrastructure / AI & Computing
AI infrastructure
Other server & Cloud
Client (AI on the edge)

Automotive
Automotive xEV
Other automotive

Strategy
Vertical approach

Solution & attach approach▪ Laser focus on fast growing SAM
with tailored solutions for eachmarket▪ Full BOM focus withmore products per systems (IC+ Discrete)▪ Dedicated engineering &segment teams (Sales/FAE & BU)- Center of application expertise▪ Strategic / lead customers
engagement, and duplication tomore customers throughwinning combinations

Industrial© 2024 Renesas Electronics Corporation. All rights reserved.

4▪ Solution and attach play :• Power attached to Renesas
Digital footprint (MCU,MPU, SoC)
• Attach to Power products(power tree)▪ Expansion of catalog portfolio
to deliver power tree

GROWTH DRIVERS
POWER

Revenue

Growth drivers(oku yen)
8,000

AutomotiveControl
Infotainment

6,000ADASxEV

Industrial

Infrastructure

2,000Compute PowerPower discrete & Wide Bandgap
Catalog Power

Automotive
xEV

Power discrete & Wide Bandgap
Battery Management System
Catalog Power

Growth driver

IIoT

4,000

Infrastructure& AI

Industrial

PMIC attach to SoC/MPU/MCU
Catalog PowerPower discrete & Wide Bandgap
Battery Management System

OtherAutomotive

PMIC attach to SoC/MPU/MCU
Catalog Power
Compute Power

IoT & Client

PMIC (Client)
Battery Management System
Catalog Power

IoT02023

2030* FX $1 = 100yen, €1 = 120yen© 2024 Renesas Electronics Corporation. All rights reserved.

Wide Bandgap: SiC / GaN

5POWER PORTFOLIO FUELING LARGE OPPORTUNITYCOMPREHENSIVE PRODUCTS PORTFOLIO FOR APPLICATION IN AI & DATACENTER SERVERS
Renesas existing products & content$700-$2,200
Power Contentper Rack

Switch$100-$200

PHY$250-$1,000

GPUSwitch
SoC

…

PHY

$80-$400$180-$300$120-$400

…

GPU

…

GPU

48V Power Distribution

DDRCPU

200G NICx32x2x10

AC/DC

AC/DC

AC/DC

Vertical PowerHigh Density Modules(own + partners)

DDR5 PMIC

Custom Performance
Testing Tools

Performance
Optimization
SoftwareRenesas new products & opportunity
PoL , e-Fuse
MOSFETs, GaN FETs
Controllers & Drivers… AC/DC

Source: Renesas estimates© 2024 Renesas Electronics Corporation. All rights reserved.

48V IBCPHYAI ServerGPU

4th Gen Digital Multiphase Controllers
3rd Gen Smart Power Stages

6

BROAD ADOPTION ACROSS DIVERSE APPLICATIONSTOP RANKED AND ESTABLISHED SUPPLIER ACROSS ALL KEY PLAYERS
Renesas’ differentiating factors

Renesas adoption▪ All top 7 cloud providers x64platforms

Digital controller leadership▪ Innovative 4th gen. high performance solution▪ Flexible & fully programmable controller▪ Current and next-gen reference
design wins for top 2 CPUsuppliers▪ Optimized with high efficiency power stage

Hyperscale CSP focused design▪ Native support▪ All major infrastructure OEMs
▪ All mobile computing OEMs
▪ All major xPU suppliers▪ Custom tools, software, and modeling support

Tier-1, Reliable quality Supplier▪ 3 of 3 US CSP ARM platforms▪ 2 of 2 US AI SoC suppliers▪ 3 of 4 US CSP AI platforms▪ 2 top networking customers▪ > 2.5Bu Smart Power Stages Shipped▪ > 300Mu Digital Controllers Shipped© 2024 Renesas Electronics Corporation. All rights reserved.

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AI SYSTEM POWER SAM IS GROWING EXPONENTIALLYDRIVEN BY POWER CONTENT, POWER ASP, AND SYSTEM UNIT VOLUMES
Power consumption per SoC(Watts)

CPUSwitch

GPU/TPU

4,000

Compute Power SAM($M)■ AI Power SAM

Growth Drivers■ Non-AI Power SAM

6,000

CAGR

3,000

5-10%

4,000
2,000
65%

2,000

1,000

02024

Source: Renesas estimates with confidential customer forecast© 2024 Renesas Electronics Corporation. All rights reserved.

2030

2023

2027

2030

Source: Renesas estimates with confidential customer forecast

8Higher selling price per Amp
Vertical and Modular Power
Lateral Power (CPU) $/phase: 1x
Vertical/Modular Power $/phase: 3.5x-6x

2023: 2.5M SoCs
2030: 15M SoCs

45%

2018

3x to 5x more sockets for power
CPU: $20-$40 power per SoC
AI: $75-$200+ power per SoC

AI SoC volume growth54%040-50%Higher power content per SoC> 20% CAGRRENESAS POWERS EDGE / CLIENT AI
EDGE / CLIENT AI ACHIEVES SCALE
PC shipment forecast(Unit)

AI PC contents increase

AI PC Volume

400M$3+ content

Standard PC

Std PC Unit Volume

AI PC Share

70%

300M

CPUAI PC-based power revenue

GPUCAGR

VR

95%

60%
200M

100M

$7+ content

AI PC
CPU

19%0M2024

2027

2030

GPUNPUHBM

NeuralProcessing Unit

MemorySource: Canalys, PC Analysis Sept 2023, with Renesas estimates© 2024 Renesas Electronics Corporation. All rights reserved.

VR+PMIC

2023

2024

2025

2026

Renesas expects to power >60% ofAI PC system

30+ customer platform in design
Source: Renesas estimates with confidential customer forecast9AI WILL ACCELERATE REVENUE GROWTH THROUGH 2030
GROWTH DRIVERS ACROSS AI CLIENT, AI INFRASTRUCTURES AND SERVER & CLOUD
ExistingbusinessIn active design
with Renesas

Expectedbusiness

Computing power Renesas revenue■ AI Revenue ■ Non-AI Revenue

30+ AI PC platforms

AI client$/SoC$3
US CSP1: 2 platforms
US CSP2: 1 platform

Next-gen AI PC

1,500$7+
US CSP1: 1 platform
US CSP3: 2 platforms

US CSP4: 2 platforms

AIinfrastructure

US xPU1: 1 platform

US xPU1: 4 platforms
US xPU2: 4 platforms

US xPU3: 2 platforms$/SoC$50-$100$75 - $200

$175

~25% Market Share~35% Market share by 2025

Other server& Cloud$/SoC(oku yen)

<15%1,000>50%50002023$30-$45© 2024 Renesas Electronics Corporation. All rights reserved.

CAGR$40-$60

2027

2030

Source: Renesas estimates with confidential customer forecast

10PORTFOLIO SERVING ALL AUTOMOTIVE MARKET
MORE CONTENT IN ALL CARS, ACCELERATION WITH xEVGlobal xEV production(M Unit)60

DC/DC, OBC
Si MOSFET, SiC,
IGBT and GaN

CAGR

4014%

20Faster charging

02022

2030

PWR TAM of semiconductor in xEVInverter, Battery Management
IGBT, SiC, Driver
BMS
More range($B)

Other body and chassis applications
Functional safety PMIC
Catalog products & solutions

2016%

100

Scalable platform

CAGR

2022

Source: TechInsight Jan 2024
© 2024 Renesas Electronics Corporation. All rights reserved.

112030DISCRETE & WIDE BANDGAP BUSINESS UPDATEEXPANDING BUSINESS BEYOND AUTOMOTIVE & DIVERSIFICATION OF CUSTOMER BASE
New products road map

High voltage product business▪ Moving to include Industrial package / module inaddition to Auto bare die▪ Expanding to North America, Europe, India, andSouth Korea

2024

IGBTSiC

2025

Industrial
Auto &Industrial

Asia
Japan
EU

China 2023 IGBTGen1 (Planar)

RevenueAsiaJapan© 2024 Renesas Electronics Corporation. All rights reserved.

Tractioninverter, DC/DCxEV12Gen2 (Trench)

12” Naka
12” Kofu
6” Takasaki

8” Fab TBD

Discrete/6-in-1 HPD/Case-type Modules

PKG/ModuleEU2028(650~1700V)

SiC FabChina

2027(750~1200V)

Auto

IGBT FabIndustrial

2026

TMM (Transfer Molded Modules)

On-Board
Charger

PV, ESS, Charging
Station, UPS

NEAR TERM IGBT OUTLOOKFOCUS ON DIVERSIFICATION TO ENABLE SUSTAINABLE AND CONSISTENT GROWTH
IGBT design-in momentum

New business – volume forecast(oku yen)
1,000■ Automotive ■ Industrial

800

CAGR

100%
CAGR

■ Confirmed D-ins ■ Active Opportunities

Automotive2 x Europe Tier 2 (TR)South Korea Tier 1 (TR)Japan Tier 1 (TR)Europe Tier 1 (Exciter)

180%

600

Recent Engagement / D-Ins

400

240%

CAGR

115%

Industrial

2000202120222023© 2024 Renesas Electronics Corporation. All rights reserved.

2 x Japan HVAC OEM
Multiple China PV manufacturers
Europe Tier 1 for wind power
Major Japan home appliance OEM

13202420272030

SiC DEVELOPMENT UPDATEPROGRESS IN TECHNOLOGY DEVELOPMENT, GETTING READY FOR LAUNCHHigh performance, Ruggedness, Quality & Supply Assurance
SiC family development plan

Performance benchmarking
10202520262027

SiC MOSFET development
Gen1 650/750/1200/1700V

DC/DC, OBC, Industrial UPS, Motor drive

Gen 1 750V/1200

Traction

Gen2 750/1200V

SiC fabrication
Secure wafer supply through LTA
with Wolfspeed

RonAa (mohm cm2), 175℃

2024

9

▪ Gen 1 ready to go for programs ramping in 2025-2026▪ Accelerated improvements with Gen 2Competitor D
Competitor C876

Traction5DC/DC,OBC
4RonAa, @ 175degC▪ Fab launch on track for 2H/2024▪ 6” Gen 1 SiC MOS: MP start from 2025
▪ 8” SiC fab identified for Gen 2 MP

1,200V class MOSFETCompetitor B
Competitor C
Competitor A

Gen1 Planar 6”

Competitor D
Competitor E

6” Takasaki

Purchase epi wafer© 2024 Renesas Electronics Corporation. All rights reserved.

Future customer
requirements fortraction apps (SOP2028 onwards)

Gen2 Trench 6”,8”8”(TBD)
In-house Epi

3142023

SOP 2024-2026(Year)

2027-2028

POWER SOLUTION SELL STRATEGY TO SCALE

LEVERAGE RENESAS STRENGTH AND FOOTPRINT IN DIGITAL AND IN ANY MARKETS~$3B SAM in 2024 for attach with Renesas digital and power
SAM growing ~10% CAGR to 2030
Renesas existing businessPower attach withRenesas digital

Potential power attach

SoC/MCU/MPU

Power Tree

Shipping ~4B unit/year
5,000+ customers(PMIC, DC-DC,Switches, e-Fuse)

Server AI power
Power attach withRenesas power

Power Tree

Shipping ~400M unit/year
50+ of customers(DC-DC, e-Fuse)

IGBT/FET (SiC/GaN)

Gate Drivers
Controllers (GaN)

Shipping ~2B unit/year
100+ customers© 2024 Renesas Electronics Corporation. All rights reserved.

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Growing Catalog revenue
CAGR >15%
through increased attach▪ Saving time to market
for customers by delivering
proven and validatedsolutions▪ Delivering more
power efficient andgreener solutions▪ Extending Renesas quality
into power attach solutions

SUMMARYGET POWERED BY RENESAS

Comprehensive power portfolio and strong IP
Clear path to steep growth & diversified revenue profile
with a vertical segment focus and solution strategy
Accelerated growth in AI infrastructure and edge AI
Increasing presence in high voltage business. Capitalize
on Automotive content expansion, accelerate with xEVHyper-focus on solution sell to Renesas existing footprint,
both digital and power© 2024 Renesas Electronics Corporation. All rights reserved.

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THANK YOU

(FORWARD-LOOKING STATEMENTS)

The statements in this presentation with respect to the plans, strategies and forecasts of Renesas Electronics and its consolidated subsidiaries(collectively “we”) are forward-looking statements involving risks and uncertainties. Such forward looking statements do not represent any
guarantee by management of future performance. In many cases, but not all, we use such words as “aim,” “anticipate,” “believe,” “continue,”“endeavor,” “estimate,” “expect,” “initiative,” “intend,” “may,” “plan,” “potential,” “probability,” “project,” “risk,” “seek,” “should,” “strive,”“target,” “will” and similar expressions to identify forward looking statements. You can also identify forward-looking statements by discussionsof strategy, plans or intentions. These statements discuss future expectations, identify strategies, contain projections of our results ofoperations or financial condition, or state other forward-looking information based on our current expectations, assumptions, estimates andprojections about our business and industry, our future business strategies and the environment in which we will operate in the future.
Known and unknown risks, uncertainties and other factors could cause our actual results, performance or achievements to differ materiallyfrom those contained or implied in any forward-looking statement, including, but not limited to: general economic conditions in our markets,
which are primarily Japan, North America, Asia and Europe; demand for, and competitive pricing pressure on, our products and services in themarketplace; our ability to continue to win acceptance of its products and services in these highly competitive markets; and movements incurrency exchange rates, particularly the rate between the yen and the U.S. dollar. Among other factors, a worsening of the w orld economy, aworsening of financial conditions in the world markets, and a deterioration in the domestic and overseas stock markets, would cause actual
results to differ from the projected results forecast.
This presentation is based on the economic, regulatory, market and other conditions as in effect on the date hereof. It should be understoodthat subsequent developments may affect the information contained in this presentation, which neither we nor our advisors or
representatives are under an obligation to update, revise or affirm.