Technical Brief
Radiation Hardened Plastic Production and QCI Flow

This document outlines the production flow and lot assurance testing for the Renesas Radiation Hardened Plastic
Products for space applications. In general, this applies to products with part numbers ISL7xxxxSLHM andISL7xxxxSEHM. See the datasheet for each individual device for more information specific to each device.

Contents
1.

Radiation Hardened Plastic Production Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22.

Radiation Hardened Plastic Lot Acceptance Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
2.2
2.3

3.

Preconditioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Sampling Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Radiation Lot Assurance Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

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Radiation Hardened Plastic Production and QCI Flow Technical Brief

1.

Radiation Hardened Plastic Production TestingThis section outlines the production flow that 100% of the radiation hardened plastic products receive. This testingflow aligns with industry accepted standards including SAE AS6294/1 and NASA PEMS-INST-001.
Initial Electrical Test 25⁰C,
MIN/MAX Temp

Serialization

Radiography

Acoustic Microscopy

Temperature Cycling

Initial Electrical Test 25⁰CStatic Burn-in

Post Static Electrical Test

Dynamic Burn-in

Final Electrical Test 25⁰C

Engineering ReviewNoPDA<5%

Final Electrical Test Min/Max TemperatureRadiography

Acoustic Microscopy

External/Visual, Packing

Yes

Production Test Report
and Data Pack

Figure 1. Flow ChartR34ZZ0006EU0103 Rev.1.03
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Radiation Hardened Plastic Production and QCI Flow Technical Brief

Table 1. Radiation Hardened Plastic Production Test Flow Screening
Test

Test Method Used

Notes

Initial Electrical Test

Per device specification (Datasheet),
Read and Record

Laser Serialization

MIL-STD-1580 for PEMsRadiography

MIL-STD-1580 for PEMs

Acoustic Microscopy

J-STD-020, J-STD-035

Includes 4hr post-Bake 125⁰C

Temperature Cycling

MIL-STD-883, Method 1010

20 cycles, -65 to 150⁰C

Electrical Test

Per device specification (Datasheet),
Read and Record

Test performed at nominal operating
temperature (25⁰C)

Dynamic Burn-in

MIL-STD-883, Method 1015 for Class S

BI test performed at +135⁰C

Post Dynamic Burn-in Electrical Test

Per device specification, Read andRecord

Test performed at 25⁰C

Static Burn-in test

MIL-STD-883, Method 1015 for Class S

BI test performed at +135⁰CFinal Parametric and Functional ElectricalTest

Per device specification, Read andRecord

Test performed at nominal operating
temperature (25⁰C), and the minimumand maximum rated temperatures, deltaanalysis for PDA performed at 25⁰C only

Calculate Percent Defective

Maximum Acceptable PDA, based on
25⁰C delta analysis<5%Radiography

MIL-STD-1580 for PEMs

Acoustic Microscopy

J-STD-020, J-STD-035

Select Samples for Lot Assurance Testing
Coplanarity Screening, External Visual,
Packaging

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Test performed at nominal operating
temperature (25⁰C), and the minimum
and maximum rated temperatures

Includes 4hr post-Bake 125⁰C
See below for sample size selection
criteria

MIL-STD-1580 for PEMs

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Radiation Hardened Plastic Production and QCI Flow Technical Brief

2.

Radiation Hardened Plastic Lot Acceptance Testing

When units have gone through the production test flow outlined in the previous section, the products enter lot
acceptance testing. These screenings are done on a lot-by-lot basis. For package related stresses, Subgroups 2and 3 in the flowchart are intended to ensure that the package is reliably built and no defects exist. Subgroup 1
testing is intended to show any early life failures because of the die or wafer processing.
Lastly, radiation lot acceptance testing is performed per the device specification. The radiation test samples are
not included in any of the subgroup testing and they are selected directly after completing the production flow.

2.1

Preconditioning

All samples selected for lot acceptance testing are exposed to a pre-conditioning step. Preconditioning consists ofthe following:
1. Precondition bake at 125°C +5°/-0°C for 4 hours minimum
2. Moisture Soaka. MSL 1 85°C, 85%RH 168 hours
b. MSL 2 85°C, 60%RH 168 hoursc.

MSL 3 30°C, 60%RH 192 hours

3. SMT Device Reflow Simulation

2.2Sampling Requirements
Lot Acceptance Test(s)Lot Size

Samples Required Based on Lot Size
40–60

61–120

121–240

241–500>500

Total Samples Required (All samples go throughPrecondition Bake, Moisture Soak, SMT Reflow
Simulation, and C-SAM)

36(0)

48(0)

69(0)

96(0)

135(0)

Subgroup 1 (Life test)

12(0)

16(0)

23(0)

32(0)

45(0)

Subgroup 2 (Biased HAST)

12(0)

16(0)

23(0)

32(0)

45(0)

Subgroup 3 (Temp Cycle)

12(0)

16(0)

23(0)

32(0)

45(0)

Radiation Testing

4(0)

4(0)

4(0)

4(0)

4(0)

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Radiation Hardened Plastic Production and QCI Flow Technical Brief

2.3

Radiation Lot Assurance Testing

Samples for radiation lot assurance testing are selected from material that has undergone the production test flow.
There are four samples per wafer lot tested. This testing qualifies the entire wafer lot for total ionizing doseradiation per the datasheet specification on a given part.
This section outlines the lot assurance testing that the radiation hardened plastic products receive with sampling
requirements outlined in Sampling Requirements. This testing flow aligns with industry accepted standards
including SAE AS6294/1 and NASA PEMS-INST-001

RLAT Testing

C-SAM 2-Preconditioning-Moisture Soak
-SMT Device Reflow Simulation

C-SAM

Electrical Test
25°C, Min, Max
Temperatures

Split into
Subgroups
Subgroup 1

Life Test

Subgroup 3
Subgroup 2

Temp Cycle

Biased HASTElectrical Test
25°C, Min, Max
Temperatures

Electrical Test
25°C, Min, MaxTemperatures

Failure Analysis(If Necessary)

Electrical Test
25°C, Min, Max
Temperatures

C-SAM
Failure Analysis(If Necessary)
Failure Analysis(If Necessary)

QCI Report andRecommendation

Figure 2. Flow Chart for Lot Acceptance Testing of Palm Bay PEMS Products

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Radiation Hardened Plastic Production and QCI Flow Technical Brief

Table 2. Flow Table for Lot Acceptance Testing of Palm Bay PEMS Products
Test

Sub Test

Test Method and Conditions

Radiation Analysis

MIL-STD-883 TM 1019

External Visual Inspection

MIL-STD-1580 for PEMSPreconditioning

Moisture SoakJESD22-A113 paragraph 4.5 per applicablemoisture sensitivity level (MSL) per J-STD-020

SMT Devices
Reflow Simulation (with flux application, cleaning,and drying)

JESD22-A113, paragraph 4.6 through 4.9.
Peak solder reflow temperature +235°C

Through-hole devices
Resistance to soldering temperature

JESD22-B106

Acoustic Microscopy(C-SAM)

All parts

J-STD-020, J-STD-035

Electrical Measurements

Per device specification, Read and Record

Measure at 25°C, minimum and maximum
rated temperatures

Life Test
Subgroup 1

High Temperature Operational Life Testing(HTOL)MIL-STD-883, Method 1005, Condition D
TA = 125°C, 2000hrs minimum or TA = 135°C,
1600hrs minimum

Electrical measurements (per device
specification, Read and Record

Measure at 25C, minimum and maximum rated
temperatures

Biased HASTJESD22-A110 with continuous bias (96hrs,+130C, 85% RH).

Electrical measurements (per device
specification, Read and Record

Measure at 25C, minimum and maximum rated
temperatures

Temperature Cycling

MIL-STD-883, Method 1010 Condition C, -65C
to 150C, 500 cycles minimum

Electrical measurements (per device
specification, Read and Record

Measure at 25°C, minimum and maximum
rated temperatures

Acoustic Microscope inspection (C-SAM)

J-STD-020, J-STD-035

Includes 4hr post-Bake 125⁰C

Highly Accelerated Stress
Test (HAST) Subgroup 2Temperature Cycling
Subgroup 3

3.

Revision History
Revision

Date

Description

1.03

Jun 2, 2023

Updated Table 2.

1.02

Feb 16, 2022

Updated description on page 1.

1.01

Apr 12, 2021

Corrected two typos.
Updated Figure 2

1.00

Apr 7, 2021

Initial release.

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