ANALOG & CONNECTIVITY

MAY 16, 2024
DAVIN LEE
SVP AND GM OF ANALOG & CONNECTIVITY PRODUCT GROUPRENESAS ELECTRONICS CORPORATION© 2024 Renesas Electronics Corporation. All rights reserved.

AT A GLANCEANALOG & CONNECTIVITY
Our products / technologies

2023 Revenue

Full system solution of memory
interface products for DDR5

Standard products
Rad Hard

Broadest and deepest silicontiming portfolio

Sensor

IoT

Sensors and sensor signal
conditioners© 2024 Renesas Electronics Corporation. All rights reserved.

Timing products

Custom Mixed-signal

Connectivity (BLE, Wi-Fi, NFC, DECT,Sub-GHz, PLC etc.)

Infrastructure

2Memory interface

Connectivity

Automotive

Industrial

GROWTH DRIVERS
ANALOG & CONNECTIVITY
Revenue

Growth drivers(oku yen)
6,000

Automotive

4,000

Control
Infotainment
ADAS
xEV

IIoT

Automotive

Connectivity (NFC, UWB, BLE),
Sensors, GreenPAK

Industrial

Solution Sell in Mass Market:
GreenPAK/FPGAs, Standard
products, Connectivity &Sensors

Growth driver

Industrial
2,000

Infrastructure

IoT
02023

IoT

Low power, intelligent
Connectivity solutions ideallysuited for edge IoT

2030* FX $1 = 100yen, €1 = 120yen© 2024 Renesas Electronics Corporation. All rights reserved.

InfrastructureMarket leadership & content
expansion in DDR5 and MCR
solution

MCR: Multiplexer Combined Ranks, NFC: Near Filed Communication, UWB: Ultra Wide Band, BLE Bluetooth Low Energy

3MEMORY INTERFACE OVERVIEWMemory Interface Market

Penetration of AI-optimized servers(oku yen)

2,500

Launch of AI PCs

2,000

CAGR

10%

1,500

Expansion of Multiplexer Combined Ranks (MCR) DIMM

1,000

Leading share in Data Center memory interface &Client market segment

50002023

2027

2030

Global teams for productivity and support

Source: Renesas estimates* FX $1 = 100yen, €1 = 120yen© 2024 Renesas Electronics Corporation. All rights reserved.

4RENESAS MEMORY LEADING DDR5 TRANSITION
EXANDING CHIPSET CONTENT
DDR5 DIMM RAMP

Chipset content ($)

Comprehensive DDR5 Chip Set

DDR4 server system▪ PMIC

DDR5 server system▪ Temp Sensor
10x▪ SPD Hub
▪ Registered Clock Driver▪ Data Buffer

3x

2023

2024

2025

2026

2027

Source: Renesas estimates© 2024 Renesas Electronics Corporation. All rights reserved.

DDR4 RDIMM DDR5 RDIMM
Source: Renesas estimates

5DDR5MCR-DIMM

NEW CLASS OF HIGH BANDWIDTH SOLUTIONS: MCR/MR DIMM
OPTIMIZED SOLUTION FOR SYSTEM MEMORY IMPROVEMENT

Comparison*1 of High bandwidth technologies(Relative to RDIMM baseline)

High bandwidthworkloads

GDDRx

HBM

MCR-DIMM

RDIMM

2.0

Robust eco-systemof suppliers

MCR/MRDIMM

Adding option
for usingclient gradeDRAM
optimizes cost

Significant
improvement
in memory
performance

1.5

RDIMM baseline
1.00.5Collaboration at
JEDEC for evolving
best-in-classspecification

0.0

Performance

Capacity*1: All metrics are estimated per SoC from various sources© 2024 Renesas Electronics Corporation. All rights reserved.

6

GB/$GB/wattCONNECTIVITY OVERVIEW
Connectivity SAM
12Adoption of smart devices at the edge
CAGR

■ Low Power Connectivity■ Localization & Identity

Connected end-to-end systems

1029%($B)
8

Increased real-time compute and data movement611%

4Security and privacy concerns

2020232027

2030

Advanced technologies as a combination of our own andacquired technologies

Source: Renesas estimates© 2024 Renesas Electronics Corporation. All rights reserved.

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CONNECTIVITY @ THE EDGE - SCALABLE STRATEGYChallenges

Scalable strategy

Ultra low power architecture

Low powerbudgets

Real-time
responses

Data integrity

Localization &Identity connectivity

Software platform© 2024 Renesas Electronics Corporation. All rights reserved.

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CONNECTIVITY @ THE EDGE - COMPETITIVE ADVANTAGE
Low Power @ the edge

Performance where it matters

Leveraging Renesas unique architecture delivering up to
50% less power than the nearest competitor in class

Functional & performance advantages
for key customer needs>2yrs on 2 AA batteries

Enabling secure access with widest margin

10yrs on CR2032 cell

Double the interference robustness of nearest
competition in noisy environmentsReduced cost of ownership

Scalable integration with MCU

Integration of key components to reduce BOM

Seamless integration into the Renesas
EP ecosystem significantly reduces
development time

Reducing customer board size by 30%
Integration of Power Management & MCU

Removal of complex matching circuitry© 2024 Renesas Electronics Corporation. All rights reserved.

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SOLUTION SELL

Interface

Connectivity> 500*1of Winning Combo’s
TimingMCU

MemoryGreenPAK~ 3,000 oku yen / year
*2Sensors*1: Numbers based on the launch until the end of 2023, *2: Renesas estimates© 2024 Renesas Electronics Corporation. All rights reserved.

10of potential SAM expansion

SUMMARY
DDR5 / MCR ramp and content increase driving
memory interface growth
Connectivity products ideally suited to address market
demands as connectivity at the edge increases
Solution sell leveraging MCU market share & broad
product portfolio
Ease of use software platform enabling faster marketadoption© 2024 Renesas Electronics Corporation. All rights reserved.

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THANK YOU© 2024 Renesas Electronics Corporation. All rights reserved.

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(FORWARD-LOOKING STATEMENTS)

The statements in this presentation with respect to the plans, strategies and forecasts of Renesas Electronics and its consolidated subsidiaries(collectively “we”) are forward-looking statements involving risks and uncertainties. Such forward looking statements do not represent any
guarantee by management of future performance. In many cases, but not all, we use such words as “aim,” “anticipate,” “believe,” “continue,”“endeavor,” “estimate,” “expect,” “initiative,” “intend,” “may,” “plan,” “potential,” “probability,” “project,” “risk,” “seek,” “should,” “strive,”“target,” “will” and similar expressions to identify forward looking statements. You can also identify forward-looking statements by discussionsof strategy, plans or intentions. These statements discuss future expectations, identify strategies, contain projections of our results ofoperations or financial condition, or state other forward-looking information based on our current expectations, assumptions, estimates andprojections about our business and industry, our future business strategies and the environment in which we will operate in the future.
Known and unknown risks, uncertainties and other factors could cause our actual results, performance or achievements to differ materiallyfrom those contained or implied in any forward-looking statement, including, but not limited to: general economic conditions in our markets,
which are primarily Japan, North America, Asia and Europe; demand for, and competitive pricing pressure on, our products and services in themarketplace; our ability to continue to win acceptance of its products and services in these highly competitive markets; and movements incurrency exchange rates, particularly the rate between the yen and the U.S. dollar. Among other factors, a worsening of the w orld economy, aworsening of financial conditions in the world markets, and a deterioration in the domestic and overseas stock markets, would cause actual
results to differ from the projected results forecast.
This presentation is based on the economic, regulatory, market and other conditions as in effect on the date hereof. It should be understoodthat subsequent developments may affect the information contained in this presentation, which neither we nor our advisors or
representatives are under an obligation to update, revise or affirm.