RSM002P03
Datasheet

Pch -30V -200mA Small Signal MOSFETl Outline

VDSS-30V

SOT-723

RDS(on)(Max.)

1.4Ω

SC-105AA

ID±200mA

PD

150mW

VMT3

l Inner circuitl Features
1) Low on-resistance.
2) Small package (VMT3)3) 4V drive.
4) Lead Free/RoHS Compliant.

l Packaging specifications

Packingl Application

Reel size (mm)Tape width (mm)Type

Switching

Basic ordering unit (pcs)
Taping code
Marking

Embossed
Tape180
88000
T2L
WP

l Absolute maximum ratings (Ta = 25°C ,unless otherwise specified)Parameter
Drain - Source voltageContinuous drain current
Pulsed drain current
Gate - Source voltage
Power dissipation
Junction temperature
Operating junction and storage temperature range

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Symbol

Value

Unit

VDSS
ID
IDP*1
VGSS
PD*2
Tj-30

V±200±400±20150
150-55 to +150mAmA
VmW

Tstg

1/10℃℃

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RSM002P03

Datasheetl Thermal resistanceParameter

SymbolRthJA*2

Thermal resistance, junction - ambient

Values
Min.

Typ.

Max.

--833

Unit℃/Wl Electrical characteristics (T a = 25°C)

Parameter

SymbolDrain - Source breakdown
voltage
Breakdown voltage
temperature coefficientConditions

V(BR)DSS VGS = 0V, ID = -1mA
ΔV(BR)DSS ID = -1mA

Values

Unit

Min.

Typ.

Max.

-30

--V--20.7

-mV/℃

ΔTj

referenced to 25℃

Zero gate voltage
drain current

IDSS

VDS = -30V, VGS = 0V

---1

μA

Gate - Source leakage current

IGSS

VGS = ±20V, VDS = 0V

--±10

μA

Gate threshold voltage

VGS(th)VDS = -10V, ID = -1mA-1.0--2.5

VGate threshold voltagetemperature coefficient

ΔVGS(th)ID = -1mA-

3.1-mV/℃

VGS = -10V, ID = -200mA-0.9

1.4RDS(on)*3 VGS = -4.5V, ID = -150mA

-1.4

2.1

VGS = -4.0V, ID = -150mA

-1.6

2.4

VDS = -10V, ID = -150mA200--

Static drain - sourceon - state resistance
Forward Transfer
AdmittanceΔTj|Yfs| *3referenced to 25℃

ΩmS*1 Pw ≤ 10μs, Duty cycle ≤ 1%
*2 Each teminal mounted on a recommended land
*3 Pulsed

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Datasheetl Electrical characteristics (Ta = 25°C)

ValuesParameter

SymbolConditions

Unit
Min.

Typ.

Max.

Input capacitanceCiss

VGS = 0V-30-

Output capacitanceCoss

VDS = -10V-

4-

Reverse transfer capacitance

Crssf = 1MHz-5-

Turn - on delay timetd(on)*3

VDD ⋍ -15V,VGS = -10V-

8-

Rise time

tr*3

ID = -150mA-5-

Turn - off delay timetd(off)*3

RL ⋍ 100Ω

-30-

Fall time

tf*3

RG = 10Ω-40-pFnsl Body diode electrical characteristics (Source-Drain) (Ta = 25°C)

ValuesParameter

SymbolContinuous forward current

ISPulse forward current

ISPForward voltage

VSD*3

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Conditions

Ta = 25℃
VGS = 0V, IS = -100mA

3/10

Unit
Min.

Typ.

Max.

--125mA--400mA---1.2V

20160802 - Rev.004

RSM002P03

Datasheetl Electrical characteristic curves

Fig.1 Power Dissipation Derating Curve

Fig.2 Drain Current Derating Curve

Fig.3 Typical Output Characteristics(I)Fig.4 Typical Output Characteristics(II)www.rohm.com© 2016 ROHM Co., Ltd. All rights reserved.

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Datasheetl Electrical characteristic curves

Fig.5 Breakdown Voltage vs.
Junction Temperature

Fig.6 Typical Transfer Characteristics

Fig.7 Gate Threshold Voltage vs.
Junction Temperature

Fig.8 Forward Transfer Admittance vs.
Drain Current

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Datasheetl Electrical characteristic curves

Fig.9 Static Drain - Source On - StateResistance vs. Gate Source Voltage

Fig.10 Static Drain - Source On - State
Resistance vs. Junction Temperature

Fig.11 Static Drain - Source On - State
Resistance vs. Drain Current (I)www.rohm.com© 2016 ROHM Co., Ltd. All rights reserved.

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Datasheetl Electrical characteristic curves

Fig.12 Static Drain - Source On - State
Resistance vs. Drain Current (lI)

Fig.13 Static Drain - Source On - State
Resistance vs. Drain Current (Ill)Fig.14 Static Drain - Source On - State
Resistance vs. Drain Current (lV)www.rohm.com© 2016 ROHM Co., Ltd. All rights reserved.

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Datasheetl Electrical characteristic curves

Fig.15 Typical Capacitance vs.
Drain - Source Voltage

Fig.16 Switching Characteristics

Fig.17 Source Current vs.
Source Drain Voltage

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Datasheetl Measurement circuits
Fig.1-1 Switching Time Measurement Circuit

Fig.1-2 Switching Waveformsl NoticeThis product might cause chip aging and breakdown under the large electrified environment.
Please consider to design ESD protection circuit.

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Datasheetl Dimensions

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Notice
Precaution on using ROHM Products
1.

Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for SpecificApplications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPANUSAEU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ

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products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
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3.

Our Products are designed and manufactured for use under standard conditions and not under any special or
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product performance, reliability, etc, prior to use, must be necessary:[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,H2S, NH3, SO2, and NO2[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items[f] Sealing or coating our Products with resin or other coating materials[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue offlux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering[h] Use of the Products in places subject to dew condensation

4.

The Products are not subject to radiation-proof design.

5.

Please verify and confirm characteristics of the final or mounted products in using the Products.

6.

In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affectproduct performance and reliability.

7.

De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.

8.

Confirm that operation temperature is within the specified range described in the product specification.

9.

ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined inthis document.

Precaution for Mounting / Circuit board design
1.

When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect productperformance and reliability.

2.

In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E© 2015 ROHM Co., Ltd. All rights reserved.

Rev.003

Precautions Regarding Application Examples and External Circuits
1.

If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of thecharacteristics of the Products and external components, including transient characteristics, as well as staticcharacteristics.

2.

You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not beapplied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation
1.

Product performance and soldered connections may deteriorate if the Products are stored in the places where:[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation[d] the Products are exposed to high Electrostatic

2.

Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time isexceeding the recommended storage time period.

3.

Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.

4.

Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products ofwhich storage time is exceeding the recommended storage time period.

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When disposing Products please dispose them properly using an authorized industry waste company.

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This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2.

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3.

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4.

The proper names of companies or products described in this document are trademarks or registered trademarks ofROHM, its affiliated companies or third parties.

Notice-PGA-E© 2015 ROHM Co., Ltd. All rights reserved.

Rev.003