Stamp

GENERAL CHAIR
Y. Ohki (Waseda University)

Dr. Naoshi HIRAIISEIM2001 Secretariat
Dept. of Electrical, Electronics, andComputer Engineering
Waseda University
3-4-1 Ohkubo, Shinjuku-ku, Tokyo
169-8555, Japan

POSTCARD[]TECHNICAL PROGRAM COMMITTEE
Chair: T. Okamoto (CRIEPI)PUBLICATION COMMITTEE
Chair: H. Nishikawa (Shibaura Inst. Tech.)

INTERNATIONAL ADVISORY COMMITTEE
Chair: A. Bulinski (Canada)
Members:
T. Blackburn (Australia)
U. Gäfvert (Sweden)
M. Iwamoto (Japan)
M. Kosaki (Japan)
J-U. Lee (Korea)
T. Mizutani (Japan)
M. Nagao (Japan)
M. Onoda (Japan)
J. C. Paul (India)
K. T. Sirait (Indonesia)
G. Stone (Canada)
H. Xie (China)

I plan to attend the ISEIM2001 and will beaccompanied byperson(s).

D. K. Das-Gupta (UK)
R. Gorur (USA)
Ho-Gi Kim (Korea)
C. Laurent (France)
Y. H. Lee (Korea)
G. C. Montanari (Italy)
Y. Ohki (Japan)
R. Patsch (Germany)
S. Sangkasaad (Thailand)
J. Smit (Netherlands)
M. Taylor (UK)Z. Yan (China)]

I intend to submit
subject area of ;(number) paper(s) in theACEID LIAISON COMMITTEE
Chair: T. Ito (Japan)

12345678910Comments:

and2001 Asian Conference on ElectricalInsulation Diagnosis (ACEID2001)
November 19 - 22, 2001
Hotel Sungarden Himeji, Himeji, Japan

CALL FOR
PAPERSLOCAL ARRANGEMENT COMMITTEE
Chair: M. Onoda (Himeji Inst. Tech.)[2001 International Symposium onElectrical Insulating Materials(ISEIM 2001)

SECRETARIAT
N. Hirai (Waseda University)

Impo rt a nt Addresses
Abstracts: Program Committee Chair
Prof. Tatsuki Okamoto, CRIEPI
E-mail: tatsuki@criepi.denken.or.jp(Abstracts should be sent via e-mails.)

Manuscripts: Publication Committee Chair
Dr. Hiroyuki Nishikawa,
Department of Electrical Engineering,
Shibaura Institute of Technology,
3-9-14 Shibaura, Minato-ku, Tokyo, 108-8548, Japan(Manuscripts should be sent by regular mail or courier)Inquiry: Secretary
Dr. Naoshi Hirai, Waseda University
E-mail: nhirai@mn.waseda.ac.jp(Inquiry should be sent via e-mails.)

Sponsored by:
IEEJ Technical Committee on Dielectrics andElectrical Insulation
IEEE Dielectrics and Electrical Insulation Society
In cooperation with:
Korean Institute of Electrical and Electronic
Material Engineers
Chinese Electrotechnical Society
Kansai Section of IEEJIEEJ Investigation Committee on Insulation Lifetimeof Dielectric Materials and Electrical Apparatus
Himeji Institute of Technology

Invitation
ISEIM2001 at Himeji, Japan will be held on Nov. 19-22,
2001. The previous conferences were held in Tokyo, Japan(1995) and Toyohashi, Japan (1998). The organizing committee
cordially invites you to participate in the conference.
About Himeji
A city of 460,000 people, Himeji is located in the heart of theHimeji plain in the southwestern part of Hyogo Prefecture.
Progressively amalgamating adjacent towns and villages since
its municipal inauguration in 1889, Himeji now stretches 23.5
km to the east and west 21.3 km to the north and south andboasts a total area of 273 square kilometers. Himeji is said tohave been populated by human beings for about 10,000 years, anotion supported by the discovery of ancient artifacts
throughout the city. Himeji Castle and Horyu-ji Buddhist
Temple in Nara were given the World Cultural Heritage status
for the first time in Japan, by the World Heritage Committee ofUNESCO in 1993. The huge plain including Himeji flourishedover the years as an industry and transportation center inproximity to the cities of Kyoto, Osaka and Kobe.

Language
The working language of the symposium is English.
matter will appear in English.

To the Secretariat of ISEIM2001(nhirai@mn.waseda.ac.jp)

Submission of Papers
You are invited to submit an abstract of not more than 200
words to the Program Committee Chair preferably via e-mail by
March 20, 2001. The abstract should include title, author'sname(s) and affiliation(s) and the mailing and e-mail addresses,
phone and fax numbers of the corresponding author. Acceptance orrejection notices will be mailed by the end of May 2001 to thecorresponding authors. The authors of accepted papers will berequested to submit camera-ready manuscripts by July 31, 2001 toPublication Committee Chair. Accepted papers will be publishedin the Symposium Proceedings.

Registration
Registration fee including banquet fee is ¥35,000 (Japanese yen)for members of IEEJ, IEEE, CES, or KIEEME, ¥40,000 for
non-members, and ¥15,000 for students with valid IDs.

Main Topics
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.

Electrical Conduction and Breakdown in Dielectrics
Space Charge, Surface and Interfacial Phenomena
Electrical Insulation for Apparatus and Cables
Aging and Degradation, their Detection and Monitoring
Test and Measurement Techniques
Insulation Design and Reliability
Eco-friendly Dielectric Materials and Recycling
Dielectric Materials for Electronics
New and Functional Dielectric Materials
Dielectric Phenomena and Their Applications

Papers on the following topics are particularly welcome:polymeric insulators and outdoor insulation, space charge
measurements, on-line monitoring and diagnostics of power
apparatus, GIS and cables, diagnosis of GIS, DC cables,development of polymeric cables and joints for higher electricfields, organic and inorganic thin films, new and functional
materials including biological and medical dielectrics, andferroelectric materials.

Technical Visits
The following technical visits to local industries will bearranged in the afternoon of November 21 (Wed).
A : Japan Synchrotron Radiation Research Institute (SPring-8)
B : Kansai Advanced Research Center, Communications
Research Laboratory
C : Mitsubishi Electric Corporation, Ako Works for Large
Transformers

2001 International Symposium on
Electrical Insulating Materials

All printed

Accommodations
Conference special room rates including breakfast, service andtaxes are ¥8,500 for single and ¥16,000 for double rooms. The
hotel reservation should be sent by fax (+81-78-391-3983) ore-mail (danryokobe_ec@kns.jtb.co.jp) to the Japan Travel Bureau(JTB) by the end of September 2001 using the hotel reservation
form.

DearSir

I am sending you, without obligation, my name andcorrespondence address and ask for keeping me informed
about future developments in the organization ofISEIM2001.
□Prof. □Dr. □Mr. □Ms.
Family name (Please print)
Given nameCompany affiliation
StreetTown, ZipCountryPhone

ISEIM 2001 WWW Site
More information about ISEIM2001 is available at the following
web site:

http://w w w .w aseda.ac.jp/conf erence/ISEIM
2001/index.html

PLEASE KEEP IN MIND
Important Dates
Abstract Due: March 20, 2001
Manuscript Due: July 31, 2001
Conference Dates: Novem ber 19 - 22, 2001

:Fax
e-mail(Address for Correspondence)