SML-P12x/P13x Series
PICOLED

Data Sheet

TM■Features• Ultra compact, thin size 1.0×0.6mm• Original device technology enables high brightness
and high reliability• Lead Free/RoHS Compliant.

■Outline■Size

1006 (0402)
1.0×0.6mm (t=0.2mm)

Color
Type

V

U

U2

D

Y3

Y

W

Y2

M2

M

F

P

E

B

WB

■Dimensions■Recommended Solder Pattern
1
0.6

0.6

0.6

+0.05
0 . 2 -0.02（0.08)

0.5
0.4

0.5

Cat hode i ndex
4-R0.15

0.52

PCB Bonding Direction

Tolerance : ±0.05

Electrode
0 .4(unit : mm)(unit : mm)■Moisture sensitivity level(MSL) :Level 3

■Specifications
Absolute Maximum Ratings (Ta=25ºC)

Electrical and Optical Characteristics (Ta=25ºC)

Power Forward Peak Forward Reverse

Part No.

Chip Structure

Forward Voltage VF Reverse Current IR

Operating Temp. Storage Temp.

Emitting color

Dissipation

Current Current Voltage

PD(mW) IF(mA) IFP(mA) VR(V)

Topr(ºC)

Tstg(ºC)

50

IF

Max.

VR

Min.*

(μA)

(V)

(nm)

(nm)

(nm)

625

630

635

25

60

615

620

625

40

85

610

615

620

25

70

602

605

608

63

100

593

596

599

40

90

587

590

593

40

100

582

585

588

25

70

577

580

583

16

50
25

SML-P12U2T (R)OrangeSML-P12Y3T (R)
52

2.1
20

AlGaInP Yellow

SML-P12WT (R)

100*1

20

10

SML-P12Y2T (R)5

SML-P12M2T (R)-40～+85

Typ. Max.*2-40～+100

5IF

Luminous Intensity IV

(mA)

2.0

SML-P12YT (R)

2

(V)

Red

SML-P12DT (R)/Chromaticity coordinate(x,y)

Typ.

SML-P12VT (R)
SML-P12UT (R)Dominant Wavelength λD

Min.

Typ.

20

573

576

579

10

SML-P12MT (R)

569

572

575

10

25

SML-P13FT (R)

563

566

569

6.3

18.0

557

560

563

4.0

10.0

520

527

535

56

110

465

470

475

9.0

25

90

150

56

150

Yellowish green

SML-P13PT (R)

54

2.2

52

2.1

34

3.0

Green

SMLP13EC8T
SMLP13BC8T

Blue

InGaN

10
33

SCMP13WBC8W *3

50*1

5

100

2.9

(x, y) (0.30, 0.30)

IF(mA) (mcd) (mcd) (mA)

5

20

5

White

(x, y) (0.29, 0.29)

SMLP13WBC9W *3*1 : Duty 1/10, 1kHz *2 : Measurement tolerance:±1nm、*3:Brightness for white color is noted with chromaticity coordinate(x,y).
*PICOLEDTM is ROHM's pending trademark.

Red text : Not Recommended for New Designs＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
www.rohm.com
1/10©2021 ROHM Co., Ltd. All rights reserved
2021.11 - Rev.015

[SML-P12x/P13x series][Data Sheet]■Electrical Characteristics Curves

FORWARD CURRENT : IF [mA]100
Ta=25ºC

Fig.2 Luminous Intensity Atmosphere Temperature

SML-P12VT (R)
SML-P12UT (R)
SML-P12U2T (R)
SML-P12DT (R)
SML-P12Y3T (R)
SML-P12YT (R)
SML-P12WT (R)
SML-P12Y2T (R)
SML-P12M2T (R)
SML-P12MT (R)
SML-P13FT (R)
SML-P13PT (R)RELATIVE LUMINOUS INTENSITY [a.u.]

Fig.1 Forward Current- Forward Voltages

Reference

10

1.0
1.5

2.0

ATMOSPHERE TEMPERATURE : Ta [ºC]

Fig.4 Derating

1.2

RELATIVE LUMINOUS INTENSITY

Ta=25ºC

1.0

0.8
SML-P12VT (R)
SML-P12UT (R)
SML-P12U2T (R)
SML-P12DT (R)
SML-P12Y3T (R)
SML-P12YT (R)
SML-P12WT (R)
SML-P12Y2T (R)
SML-P12M2T (R)
SML-P12MT (R)
SML-P13FT (R)
SML-P13PT (R)

0.2

0.1
0

5

10

15

FORWARD CURRENT : IF [mA]

MAXIMUM FORWARD CURRENT : [mA]

Fig.3 Luminous Intensity - Forward Current

0.4

IF=20mA

2.5

FORWARD VOLTAGE : VF [V]0.6

SML-P12VT (R)
SML-P12UT (R)
SML-P12U2T (R)
SML-P12DT (R)
SML-P12Y3T (R)
SML-P12YT (R)
SML-P12WT (R)
SML-P12Y2T (R)
SML-P12M2T (R)
SML-P12MT (R)
SML-P13FT (R)
SML-P13PT (R)

SML-P12VT (R)
SML-P12UT (R)
SML-P12U2T (R)
SML-P12DT (R)
SML-P12Y3T (R)
SML-P12YT (R)
SML-P12WT (R)
SML-P12Y2T (R)
SML-P12M2T (R)
SML-P12MT (R)
SML-P13FT (R)
SML-P13PT (R)20

AMBIENT TEMPERATURE : Ta [ºC]＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
www.rohm.com
2/10©2021 ROHM Co., Ltd. All rights reserved
2021.11 - Rev.015

[SML-P12x/P13x series][Data Sheet]■Electrical Characteristics Curves

Reference

Fig.1 Forward Current- Forward Voltages

Fig.2 Luminous Intensity Atmosphere Temperature

SMLP13EC8T
SMLP13BC8T
SCMP13WBC8W
SMLP13WBC9W

RELATIVE LUMINOUS INTENSITY [a.u.]

FORWARD CURRENT : IF [mA]100

Ta=25ºC

10

2

2.2

2.4

2.6

2.8

3

3.2

3.4

3.6

3.8

MAXIMUM FORWARD CURRENT : [mA]

RELATIVE LUMINOUS INTENSITY1

0.8

SMLP13EC8T
SMLP13BC8T
SCMP13WBC8W
SMLP13WBC9W

0.6

0.4

Ta=25ºC
SMLP13EC8T
SMLP13BC8T
SCMP13WBC8W
SMLP13WBC9W

1.2
1
0.8
0.6
0.4
0.2
0

2

4

6

8

FORWARD CURRENT : IF [mA]

10 20 30 40 50 60 70 80 90 100

Fig.4 Derating

2

0

1.2

ATMOSPHERE TEMPERATURE : Ta [ºC]Fig.3 Luminous Intensity - Forward Current

1.4

1.4

4

FORWARD VOLTAGE : VF [V]1.6

IF=5mA-40 -30 -20 -10 0

1

1.8

1.6

10

15
14

SMLP13EC8T
SMLP13BC8T
SCMP13WBC8W
SMLP13WBC9W

13
12
11
10
9
8
7
6
5

4
3
2

1
0

-40

-20

0

20

40

60

80

100

AMBIENT TEMPERATURE : Ta [ºC]＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
www.rohm.com
3/10©2021 ROHM Co., Ltd. All rights reserved
2021.11 - Rev.015

[SML-P12x/P13x series][Data Sheet]■Viewing Angle

Reference

SCANNING ANGLE (deg)X - Y

ｽｷｬﾝ方向(Scanning Direction)

20

10

0

10

ｽｷｬﾝ方向(Scanning Direction)

20

30

50
60

70

80

80

90
100

90
100

90
100

Y

X'

50

RELATIVE INTENSITY

20

10

ｽｷｬﾝ方向(Scanning Direction)

10

50

60
70

80

0

50

RELATIVE INTENSITY (%)

20

30

40

ｽｷｬﾝ方向(Scanning Direction)

40

10

0

30

10

30

70

50

60
70

80

40

50
60

60

70

70

80

80
90
100

SMLP13EC8T
SMLP13BC8T
SCMP13WBC8W
SMLP13WBC9W

20

40
50

60

Y'

X' - Y'

20

50

90
100

50

SCANNING ANGLE (deg)

SCANNING ANGLE (deg)
30

40

70

80

0

30

60

70

SML-P12VT (R)
SML-P12UT (R)
SML-P12U2T (R)
SML-P12DT (R)
SML-P12Y3T (R)
SML-P12YT (R)
SML-P12WT (R)
SML-P12Y2T (R)
SML-P12M2T (R)
SML-P12MT (R)
SML-P13FT (R)
SML-P13PT (R)

20

50

60

X - Y

10

40

50

0

0

30

40

50

10

20

30

40

X

SCANNING ANGLE (deg)X' - Y'

50

0

50

X

90
100
Y

RELATIVE INTENSITY

80

90
100

X'

50

0

50

RELATIVE INTENSITY (%)

90
100
Y'

＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
www.rohm.com
4/10©2021 ROHM Co., Ltd. All rights reserved
2021.11 - Rev.015

[SML-P12x/P13x series][Data Sheet]■Rank Reference of Brightness**Measurement tolerance:±10%

Red(V,U,U2)(Ta=25ºC, IF＝20mA)

Rank
G
H
J
K
L
1.0〜1.6 1.6〜2.5 2.5〜4.0 4.0〜6.3 6.3〜10
Iv(mcd)SML-P12VT
SML-P12UT
SML-P12U2T

M

N

P

Q

10〜16

16〜25

25〜40

40〜63

M

N

P

Q

10〜16

16〜25

25〜40

40〜63

M

N

P

Q

10〜16

16〜25

25〜40

40〜63

L

M

N

P

Q

6.3〜10

10〜16

16〜25

25〜40

40〜63

M

N

P

Q

10〜16

16〜25

25〜40

40〜63

M

N

P

Q

R

9〜14

14〜22

22〜36

36〜56

56〜90

M

N

P

Q

R

9〜14

14〜22

22〜36

36〜56

56〜90

T

U

R

S

T

U

V

Orange(D)X(Ta=25ºC, IF＝20mA)

Rank
G
H
J
K
L
1.0〜1.6 1.6〜2.5 2.5〜4.0 4.0〜6.3 6.3〜10
Iv(mcd)SML-P12DT

R

S

T

U

V

X

(Ta=25ºC, IF＝20mA)

Rank
G
H
J
K
L
1.0〜1.6 1.6〜2.5 2.5〜4.0 4.0〜6.3 6.3〜10
Iv(mcd)SML-P12Y3T
SML-P12YT
SML-P12WT
SML-P12Y2T

R

S

T

U

V

H

W

X

63〜100 100〜160 160〜250 250〜400 400〜630 630〜1000 1000〜1600

Yellowish Green(M2,M,)
G

W

63〜100 100〜160 160〜250 250〜400 400〜630 630〜1000 1000〜1600

Yellow(Y3,Y,W,Y2)

Rank
Iv(mcd)W

63〜100 100〜160 160〜250 250〜400 400〜630 630〜1000 1000〜1600(Ta=25ºC, IF＝20mA)

J

K

1.0〜1.6 1.6〜2.5 2.5〜4.0 4.0〜6.3

R

S

T

U

V

W

X

63〜100 100〜160 160〜250 250〜400 400〜630 630〜1000 1000〜1600

SML-P12M2T

SML-P12MT

Green(F,P)(Ta=25ºC, IF＝20mA)

Rank
G
H
J
K
L
1.0〜1.6 1.6〜2.5 2.5〜4.0 4.0〜6.3 6.3〜10
Iv(mcd)SML-P13FT
SML-P13PT

R

S

T

U

W

X

63〜100 100〜160 160〜250 250〜400 400〜630 630〜1000 1000〜1600

Green(E)
Rank
Iv(mcd)V(Ta=25ºC, IF＝5mA)

G

H

J

K

L

0.9〜1.4 1.4〜2.2 2.2〜3.6 3.6〜5.6 5.6〜9.0

S

T

U

V

W

90〜140 140〜220 220〜360 360〜560 560〜900

SMLP13EC8T

Blue(B)
Rank
Iv(mcd)(Ta=25ºC, IF＝5mA)

G

H

J

K

L

0.9〜1.4 1.4〜2.2 2.2〜3.6 3.6〜5.6 5.6〜9.0

S

T

U

V

W

90〜140 140〜220 220〜360 360〜560 560〜900

SMLP13BC8T

White(WB)
Rank
Iv(mcd)(Ta=25ºC, IF＝5mA)

N

P

Q

R

14～22

22～36

36～56

56～90

S

V

W

90～140 140～220 220～360 360～560 560～900

SCMP13WBC8W

SMLP13WBC9W■Chromaticity Diagram
0.4

0.4

F
H

0.3

SMLP13WBC9W

K
CIE y

CIE y

SCMP13WBC8W

3

0.3

2

A
1
0.2

0.2
0.2

0.3

0.4

CIE x

0.2

0.3

（Ｔａ＝25℃、If=5mA)（Ｔａ＝25℃、If=5mA)
A

F

0.4

CIE x

H

1

K

2

3

x

y

x

y

x

y

x

y

x

y

x

y

x

y

0.280

0.248

0.283

0.305

0.287

0.295

0.304

0.330

0.262

0.252

0.292

0.260

0.297

0.310

0.296

0.276

0.304

0.330

0.307

0.315

0.330

0.360

0.277

0.236

0.280

0.282

0.306

0.283

0.283

0.305

0.307

0.315

0.311

0.294

0.330

0.318

0.292

0.260

0.297

0.310

0.320

0.306

0.264

0.267

0.287

0.295

0.296

0.276

0.311

0.294

0.280

0.282

0.306

0.283

0.316

0.342

Measurement tolerance：±0.02

Measurement tolerance：±0.02＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
www.rohm.com
5/10©2021 ROHM Co., Ltd. All rights reserved
2021.11 - Rev.015

[SML-P12x/P13x series][Data Sheet]
4.00 ± 0. 1

φ 1 . 5 +00 . 1

5 .5 03 . 50 ±0 . 0 5

A

0 ～0 . 50

8. 0 01 .7 5 ±0 . 1■Taping(T86)

1 . 10 ± 0. 0 5

2 .0 0 ± 0 .0 5

0 .7 0 ±0 . 0 5
0. 3 2 ± 0. 0 5

A部詳 細Enlarged drawing of "A"
11 . 4 ±1

φ 18 0 - 30

φ 6 0 + 01

φ1 3

Unit:ｍｍNote)Tolerance is within ±0.2mm unlessotherwise specified.

Packing quantity
5,000pcs/reel

Pulling
Direction■Part No. Construction*"-"will be taken out for emitting color

Special Code will be applied for

Chromaticity rank

Rank sign

WB/B/E series.

Emitting color WB/B/E series.

(for white LED）

(Brightness Rank)*

S

M

L

－

Series name

SML Chip LED

P

1

2

Package TypeChip type

M

T

Emitting Color

Resin Color

6

Taping Specification

0Standard Type

V

Red

T

E1 1.6x0.8 t=0.36mm

1

Low Current TypeURed

W Milky White

D1 1.6x0.8 t=0.55mm

2High Brightness type

U2

Red

B

H1

3

D

OrangeY3

Yellow

Y2

YellowY

Yellow
Yellow

2.0x1.25 t=0.8mm

401 3.0x2.0 t=1.3mm

5

3.5x2.8 t=1.9mm

6

A1 1.6x1.15 t=0.55mm

7W

3.4x1.25 t=1.1mm

8

M2 Yellowish green

Z1/ZN

81/82

Ultra High Brightness typeK1 4.5x2.0 t=0.6mm

M

Yellowish green

S1 3.2x1.6 t=1.85mm

F

Green

P2 1.0x1.0 t=0.2mm

P

Green

52 1.3x1.5 t=0.6mm

E

Green

P34

1.0x1.0 t=0.2mm

B

Blue

P36

1.5x1.0 t=0.2mm

WB

White

VN 3.5x2.8 t=0.6mm

T Phototransistors
RGB

Chip LED

8

P1 1.0x0.6 t=0.2mm

M1

SCM

T

01 3.0x1.5 t=2.2mm

Red/Green/Blue

Transparent Colorless

Black

R

P

Special Control Symbol

T86 Cathode at sprocket hole side(the top)
For white LED,1

cathode at sprocket hole side

*Concerning the Brightness rank.
*Please refer to the rank chart above forluminous intensity classification.
*Part name is individual for each rank.
*When shipped as sample,the part name will
be a representative part name.
General products are free of ranks.
Please contact sales if rank appointment
is needed.

■Packing Specification
Complying with IPC/JEDEC J-STD-033.

＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
www.rohm.com
6/10©2021 ROHM Co., Ltd. All rights reserved
2021.11 - Rev.015

[SML-P12x/P13x series][Data Sheet]■Precaution (Surface Mount Device)
１．Storage
If the product is heated during the reflow under the condition of hygroscopic state,
it may vaporize and expand which will influence the performance of the product.
Therefore, the package is waterproof. Please use the product following the conditions:・Using Conditions
Classification Temperature
Humidity
Expiration Date
Remark
①BeforeWithin 1 year
5～30℃
30～70%RH
Storage with waterproof package
usingfrom Receiving②After opening
Please storing in the airtight container
5～30℃ Below 70%RH
Within 168hpackagewith our desiccant (silica gel)・Baking
Bake the product in case of below:①The expiration date is passed.
②The color of 5% and 10% on humidity indicator card is not green.
(Even if the product is before expiration date.)・Baking Conditions
Temperature
Time
Humidity
60±3℃
12～24hBelow 20%RH
・Bake products in reel.
・Reel and embossed tape are easy to be deformed when baking,Remarkso please try not to apply stress on it.
・Recommend bake once.
２．Application Methods
２－１．Precaution for Drive System and Off Mode
Design the circuit without the electric load exceeding the ABSOLUTE MAXIMUM RATING thatapplies on the products. If drive by constant voltage, it may cause current deviation of the LED andresult in deviation of luminous intensity, so we recommend to drive by constant current.
(Deviation of VF Value will cause deviation of current in LED.) Furthermore, for off mode,
please do not apply voltage neither forward nor reverse. Especially, for the products with theAg-paste used in the die bonding, there’s high possibility to cause electro migration and resultin function failure.
２－２．About Derating
It is considered that derating characteristics will not result in LED chip's electrical destruction.
Even within the derating, the reliability and luminous life can be affected depending on operating
conditions and ambient environment. So we would be appreciate it if you can confirm with yourapplication again.
２－３．About product life
Depending on operating conditions and environment(applied current, ambient temperature andhumidity, corrosive gas), decreasing of luminosity and change of chromaticity may occur even
within the specification conditions.
Please contact our sales office if you use it for the following applications.
①It requires long luminosity life
②It is always lit
２－４．Applied Stress on ProductNo resin hardening agent such as filler is used in the sealing resin of the product.
Therefore, please pay attention to the overstress on it which may influence its reliability.
２－５．Usage
The Product is LED. We are not responsible for the usage as the diode such as Protection Chip,
Rectifier, Switching and so on.

＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
www.rohm.com
7/10©2021 ROHM Co., Ltd. All rights reserved
2021.11 - Rev.015

[SML-P12x/P13x series][Data Sheet]

３．Others
３－１．Surrounding Gas
Notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) oralkali gas (ammonia), it may result in low soldering ability (caused by the change in quality ofthe plating surface ) or optical characteristics changes (light intensity, chrominance) and change
in quality of cause die bonding (Ag-paste) materials. All of the above will function failure of
the products.
Therefore, please pay attention to the storage environment for mounted product (concern thegenerated gas of the surrounding parts of the products and the atmospheric environment).
３－２．Electrostatic Damage
The product is part of semiconductor and electrostatic sensitive, there’s high possibility to be damagedby the electrostatic discharge. Please take appropriate measures to avoid the static electricity fromhuman body and earthing of production equipment. Especially, InGaN type LEDs have lower resistancevalue of electrostatic discharge and it is recommended to introduce the ESD protection circuit.
The resistance values of electrostatic discharge (actual values) vary with products, therefore,
please call our Sales staffs for inquiries.
３－３． Electromagnetic Wave
Applications with strong electromagnetic wave such as, IH cooker, will influence the reliability of LED,
therefore please evaluate before using it.

＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
www.rohm.com
8/10©2021 ROHM Co., Ltd. All rights reserved
2021.11 - Rev.015

[SML-P12x/P13x series][Data Sheet]

４．Mounting
４－１. Soldering
・No resin hardening agent such as filler is used in the sealing resin of the product. Therefore, resin
expansion and moisture absorption at humidity will cause heat stress during soldering process andfinally has bad influence on the product’s reliability.
・The product is not guaranteed for flow soldering.
・Do not expose the product in the environment of high temperature (over 100℃) or rapid temperature
shift (within 3℃/sec. of temperature gradient) during the flow soldering of surrounding parts.
In case of carrying out flow soldering of surrounding parts without recommended conditions, pleasecontact us for inquiries.
・Please set appropriate reflow temperature based on our product usage conditions and specification.
・The max for reflowing is 2 times, please finish the second reflow soldering and flow solderingwith other parts within the usage limitation after open the moistureproof package.
・Compare with N2 reflow, during air reflow, because of the heat and surrounding conditions,
it may cause the discoloration of the resin.
・For our product that has no solder resist, because of its solder amount and soldering conditions,one of its specific characteristics is that solder will penetrate into LED. Thus, there's high possibility
that will influence its reliability.Therefore, please be informed, concerning it before using it.
４－２. Automatic Mounting
４-２-１. Suction nozzle
Excessive load may cause damage inside the LED product, so select an optimal suction nozzle
according to the material and shape of the LED product.
４-２-２. Mini Package (Smaller than 1608 size)
・Vibration may result in low mounting rate since it will cause the static electricity of product andadhere to top cover tape. Therefore, the magnet should be set on parts feeder cassette of
the mounter to control the product stabilization. In addition, it is recommended to set ionizer
to prevent electrostatic charge.
４－３. Mounting Location
The stress like bending stress of circuit board dividing after mounting, may cause LED package crack
or damage of LED internal junction, therefore, please concern the mounting direction and position
to avoid bending or screwing with great stress of the circuit board.

Stress strength according tohe mounting position:
A＞B＞C＞D

0.6mm

４―４. Mechanical Stress after Mounting
The mechanical stress may damage the LED after Circuit Mounting,so please pay attention to the touch on product.
４－５．Soldering Pattern for Recommendation
We recommend the soldering pattern that shows on the right.
It will be different according to mounting situation of circuit board,
therefore, please concern before designing.

0.5mm

0.4mm
0.5mm

PCB Bonding Direction※The product has adopted the electrode structure that it should solder
with back electrode of the product.
Reference
Thus, please be informed that the shape of electrode pin of
Mask open area ratio：80%
solder fillet formation is not guaranteed.
Mask thickness：80～100μm
The through hole on electrode surface is for conduction of front
and rear electrodes but not for formation of solder fillet.
＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
www.rohm.com©2021 ROHM Co., Ltd. All rights reserved

9/10

2021.11 - Rev.015

[SML-P12x/P13x series][Data Sheet]

４－６．Reflow Profile
For reflow profile, please refer to the conditions below:(※)■Meaning of marks, Conditions
Mark
Tsmax
Tsmin
ts
TL
tL
TP
tP
ΔTR/ΔtΔTD/ΔtMeanings

Conditions
180℃
Minimum of pre-heating temperature
140℃
Time from Tsmin to Tsmax
Over 60sec.
Reference temperature
230～260℃
Retention time for TL Within 40sec.
Peak temperature
260℃(Max)
Time for peak temperature Within 10sec.
Temperature rising rate Under 3℃/sec.
Temperature decreasing rate Over -3℃/sec.
Maximum of pre-heating temperature※Above conditions are for reference. Therefore, evaluate by customer’s own circuit boards andreflow furnaces before using, because stress from circuit boards and temperature variations of reflow
furnaces vary by customer’s own conditions.
４－７．Attention Points in Soldering Operation
This product was developed as a surface mount LED especially suitable for reflow soldering.
So reflow soldering is recommended. In case of implementing manual soldering,please take care of following points.
①SOLDER USED
Sn-Cu，Sn-Ag-Cu，Sn-Ag-Bi-Cu②HAND SOLDERING CONDITION
LED products do not contain reinforcement material such as a glass fillers.
So thermal stress by soldering greatly influence its reliability.
Please keep following points for manual soldering.
ITEM

a)

b)

RECOMMENDED CONDITION
Condition ) Temp. of iron top less than
400℃ within 3 sec.
Heating method
Heating on PCB pattern, not direct to theLED. (Fig-1)
Handling after Please handle after the part temp.
soldering goes down to room temp.

SOLDERING IRON

Fig-1

SOLDERING
LAND

４－８．Cleaning after Soldering
Please follow the conditions below if the cleaning is necessary after soldering.
Solvent
We recommend to use alcohols solvent such as, isopropyl alcohols
Temperature
Under 30℃ within 3 minutes
Ultrasonic Cleaning
15W／Below 1 liter (capacity of tank)
DryingUnder 100℃ within 3 minutes＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
www.rohm.com
10/10©2021 ROHM Co., Ltd. All rights reserved
2021.11 - Rev.015

NoticeNotes1) The information contained herein is subject to change without notice.
2) Before you use our Products, please contact our sales representative and verify the latest specifications.
3) Although ROHM is continuously working to improve product reliability and quality, semiconductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safetymeasures such as complying with the derating characteristics, implementing redundant andfire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no
responsibility for any damages arising out of the use of our Poducts beyond the rating specified by
ROHM.
4) Examples of application circuits, circuit constants and any other information contained herein areprovided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
5) The technical information specified herein is intended only to show the typical functions of andexamples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
any license to use or exercise intellectual property or other rights held by ROHM or any otherparties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use ofsuch technical information.
6) The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communication, consumer systems, gaming/entertainment sets) as well as the applications indicated inthis document.
7) The Products specified in this document are not designed to be radiation tolerant.
8) For use of our Products in applications requiring a high degree of reliability (as exemplified
below), please contact and consult with a ROHM representative : transportation equipment (i.e.
cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety
equipment, medical systems, servers, solar cells, and power transmission systems.
9) Do not use our Products in applications requiring extremely high reliability, such as aerospaceequipment, nuclear power control systems, and submarine repeaters.
10) ROHM shall have no responsibility for any damages or injury arising from non-compliance withthe recommended usage conditions and specifications contained herein.
11) ROHM has used reasonable care to ensure the accuracy of the information contained in thisdocument. However, ROHM does not warrants that such information is error-free, and ROHM
shall have no responsibility for any damages arising from any inaccuracy or misprint of suchinformation.
12) Please use the Products in accordance with any applicable environmental laws and regulations,such as the RoHS Directive. For more details, including RoHS compatibility, please contact a
ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting
non-compliance with any applicable laws or regulations.
13) When providing our Products and technologies contained in this document to other countries,
you must abide by the procedures and provisions stipulated in all applicable export laws andregulations, including without limitation the US Export Administration Regulations and the Foreign
Exchange and Foreign Trade Act.
14) This document, in part or in whole, may not be reprinted or reproduced without prior consent of
ROHM.

Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.

ROHM Customer Support System
http://www.rohm.com/contact/

www.rohm.com© 2015 ROHM Co., Ltd. All rights reserved.

R1107 A

Datasheet
General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any priornotice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.

3.

The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of orconcerning such information.

Notice – WE

© 2015 ROHM Co., Ltd. All rights reserved.

Rev.001