AN5522
Application note

Ultrasound behavior and guidelines of analog MEMS microphone IMP23ABSU

Introduction
The purpose of this application note is to help the user to design an industrial ultrasound microphone system with ST's
IMP23ABSU MEMS analog microphone, outlining the guidelines for handling the microphone and for hardware integration.
This document does not modify the content of the official datasheet. Please refer to the datasheet for parameter specifications.

AN5522 - Rev 2 - September 2020
For further information contact your local STMicroelectronics sales office.

www.st.com

AN5522
Overview of ST MEMS microphones

1

Overview of ST MEMS microphones
This section introduces the current state-of-the-art MEMS microphone mechanical structure to help and guide
testing in the ultrasound frequency range and designing suitable hardware ultrasonic systems.

1.1

Mechanical structure of MEMS microphones
As a standalone object, the MEMS microphone is composed of a parallel plate capacitor (plates named“membrane” and “backplate”), whose capacitive change is caused by sound, passing through the acoustic holes
in the fixed backplate, that moves the membrane. The ventilation hole allows static pressure equalization between
the microphone and the ambient environment. There is no membrane deflection due to static pressure.
Figure 1. Section of the MEMS microphone parallel plate capacitor structure

For a more detailed explanation on MEMS microphone structure and main parameters, refer to AN4426: Tutorial
for MEMS microphones on www.st.com.

1.2

Helmholtz frequency
The MEMS microphone is inserted in a properly designed package, creating a front chamber and a backchamber, that determines the frequency response behavior of the microphone. The substrate thickness is chosen
to optimize the trade-off between robustness and the minimum impact on the Helmholtz frequency. The
IMP23ABSU device components are assembled in a metal package as shown in Figure 2.
Figure 2. MEMS microphone inserted into a standard metal package

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AN5522
Helmholtz frequency

Helmholtz resonance is the phenomenon of air resonance in a cavity, such as when one blows across the top ofan empty bottle. The name comes from a device created in the 1850s by Hermann Von Helmholtz, the "Helmholtz
resonator", which he, the author of the classic study of acoustic science, used to identify the various frequencies
or musical pitches present in music and other complex sounds. If the volume of the MEMS cavity is greater than
the neck, the resonator corresponds exactly to a Helmholtz resonator. More commonly this condition is notrespected since the volume of the MEMS cavity is smaller than the entire volume created by the gasket cavity.
Hence, since the equations regulating the behavior of a stationary wave inside an acoustic cavity are complex
and depend on the geometry of every involved acoustic cavity, the use of a simulating tool like COMSOL® ismandatory.
For further details on the COMSOL® tool for MEMS microphone gasket simulation, refer to paragraph 1.2 of
AN4427: Gasket design for optimal acoustic performance in MEMS microphones, available on www.st.com.

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AN5522Ultrasound capability of analog microphones

2

Ultrasound capability of analog microphones
Standard MEMS microphones are intended to operate in the audio bandwidth which is defined between 20 Hz(lower audio band limit) and 20 kHz (upper audio band limit). This section explains the theoretical study of the
behavior of ST analog MEMS microphones in the ultrasound band, i.e. from 20 kHz to 80 kHz. The standard
audio band must, however, be considered on the whole because all the frequency response values arenormalized as standard procedure to the 1 kHz 94 dBSPL Sensitivity value.

2.1

Theoretical ultrasound behavior simulation
As noted in the previous sections, in order to determine the best practices for gasket design, simulation
experiments have been performed using the COMSOL® tool. The method consists of simulating the effect ofdefined geometries placed close to the sound inlet of the microphone. These simulations have been performed,
checking how such geometries can modify the frequency response of the ST bottom port analog MEMS
microphone IMP23ABSU. The purpose is to study the ultrasound behavior of the microphone's mechanicalsystem. As a general consideration, low-frequency behavior depends on the ventilation hole and the backchamber dimension while the high-frequency response depends on the geometry of the front chamber only.
The first simulation consists of the calculation of the frequency response of the acoustic system defined by the
combination of the MEMS microphone front chamber, the substrate inlet and a cylindrical tube with fixed radius(250 µm) and 1.5 mm length (plus 0.1 mm solder paste thickness). This geometry simulates a standard PCB inlet
structure.
Figure 3. Simulation of MEMS microphone - thick, standard board application

Since the resonance frequency of the system is close to 15 kHz and the 3 dB flatness is up to 17 kHz, a gasket
based on a standard PCB is good for voice band related applications.
The second simulation consists of the calculation of the frequency response of the acoustic system defined by the
combination of the MEMS microphone front chamber, the substrate inlet and a cylindrical tube with fixed radius(250 µm) and 0.3 mm length (plus 0.1 mm solder paste thickness). This geometry simulates a flex PCB inlet
structure and is close to the limit of the pure free field, i.e. the bare device without an additional gasket.
Figure 4. Simulation of MEMS microphone - thin, flex board application

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AN5522
Theoretical ultrasound behavior simulation

Since the resonance frequency of the system is close to 30 kHz and the 3 dB flatness is up to 15 kHz, a gasket
based on a thin PCB is good for general audio band related applications that extend to the near ultrasound field.
The results of these two use-case simulations demonstrate that the second case, the flex PCB, is the one to bepreferred for having a flat frequency response across the widest part of the audio and near-ultrasound spectrum.
For further details on MEMS microphone gasket design and optimization, refer to AN4427: Gasket design for
optimal acoustic performance in MEMS microphones on www.st.com.

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Experimental results

2.2
2.2.1

Experimental results
Ultrasound test setup
The standard free-field setup for audio measurements is composed of an anechoic chamber, a loudspeaker (awoofer, a tweeter or a coaxial speaker, depending on the frequency range of interest), a reference microphone, anacquisition system and a device under test (DUT). The setup should be thermally controlled and the audio fieldmust be equalized (typically at 94 dBSPL). The standard procedure for the system equalization is depicted in thefollowing figure.
Figure 5. Flowchart of the tester equalization procedure

The frequency response of a microphone DUT defines its reaction to the acoustical stimuli at different frequencies
and it is typically normalized with respect to 1 kHz, 94 dBSPL. To minimize any effect due to misalignment
between the reference microphone, the DUT and the acoustic source, amplified by the small acoustic ultrasoundwavelengths, the substitution method for the measurement has been preferred. The detailed composition of themeasurement setup is the following:•
Reference microphone: GRAS 46BD•
Loudspeaker: L400 Ultrasound Speaker - Pettersson Elektronik AB•
Acquisition system: analog input module from Audio Precision APx525
For further details, refer to the available literature: Calibration of the pressure sensitivity of microphones by a freefield method at frequencies up to 80 kHz, A. J. Zuckerwar, G. C. Herring, B. R. Elbing, The Journal of the
Acoustical Society of America 119(1):320-9, January 2006)

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Experimental results

2.2.2

Ultrasound test results
Experimental tests have been performed on N.100 samples on the flex PCB simulated in Section 2.1 Theoreticalultrasound behavior simulation and described in Section 3.2 ST reference design guidelines and have been
submitted to the R&R process. The average ultrasound frequency response has been recorded and the following
graph has been added to the IMP23ABSU datasheet.
Figure 6. Average IMP23ABSU ultrasound frequency response

The punctual limits of the ultrasound frequency response can be inferred from the average behavior and thestandard deviation of the measurements on characterization samples. The results are shown in the following
table.
Table 1. Ultrasound frequency response limits and typical values for IMP23ABSU normalized sensitivity
Frequency [Hz]

Min.

Typ.

Max.

20000

7.5

12.5

17.5

25000

12.5

17.5

22.5

30000

12.5

17.5

22.5

45000

-2.5

2.5

7.5

60000

-2.5

2.5

7.5

70000

-12.5

-7.5

-2.5

80000

-12.5

-7.5

-2.5

The repeatability and reproducibility of these results can help the application developer to consider these values
as the typical microphone behavior in the ultrasound frequency spectrum and to add them in their equalization
procedure (real-time or post-processing software procedures). The low-pass filtering effect above 50 kHz (which
differs from the flex PCB gasket simulation results) is due to internal electronics filtering and it is fully repeatable.

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AN5522
Experimental results

Figure 7. Full 20 Hz-80 kHz frequency response band normalized with respect to the 1 kHz 94 dBSPL
sensitivity, in logarithmic scale

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AN5522Ultrasound applications

3

Ultrasound applications

3.1

Overview of ultrasound applications
This section describes some MEMS sensor application families that involve ultrasonic analysis and datacollection.
•
Industrial applications–
A broad segment for ultrasound microphone applications is the industrial-related predictive
maintenance field. Most machine failures can be discovered early, making them treatable issues
instead of replaceable downtime issues. Excessive vibration, especially in the ultrasonic range, andtemperature increases are indicators of mechanical failure on the horizon, but we also know thatmicroscopic changes in friction forces, detectable early with ultrasound, provide a bigger window ofopportunity for scheduled maintenance.
–
Another important application field is air/gas leakage detection. When a tube containing fluid starts toleak, it emits an ultrasound characteristic pattern which depends on the diameter of the leakage holeand on the pressure of the fluid inside the tube.
•
Telecommunications–
Partial electrostatic discharge is another possible application sector. It has been proven that defects
on high-voltage cables can produce an electrical discharge that can be detected from the acousticaleffect that it generates while breaking the air dielectric.
–
Another important application area related to telecommunications is data transmission via
ultrasound. For example, Google Chromecast broadcasts data packets in the near ultrasound BW so
Android devices can detect if a Chromecast device is in the room and pair to it.
•

Personal electronics–
A general application involving ultrasound detection in personal electronics is the acquisition ofultrasound signals from pets. For example, in particular cases it has been proven that animals suchas guinea pigs emit a characteristic ultrasound pattern during their birth. Another application is related
to the “bat detector”. Bats localize objects in space emitting ultrasound signals (up to 200 kHz), andultrasound microphones can be used to hear the reflected and transmitted signal, detecting in this way
a bat’s presence.
–
Finally, an innovative application includes proximity and smart pen detection. Ultrasound signals can beused for proximity/occupancy detection and smart pen detection in tablets.

The research field of ultrasound applications is broad and the related market is currently under definition andexpansion.

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AN5522
ST reference design guidelines

3.2

ST reference design guidelines
As pointed out throughout this application note, in the ultrasound range [20 Hz-80 kHz] the DUT must be as close
as possible to the free-field environment, meaning that the acoustical path between the sound inlet and the outerenvironment must be minimized. For this reason, the recommendation for using ST MEMS microphone
IMP23ABSU is to solder the devices on flex PCBs of thickness 250 µm, which is the current standard for
microphone modules on smartphone platforms. The proposed ultrasound adapter should be a flex printed circuitboard like the following.
Figure 8. Reference design adapter for IMP23ABSU ultrasound applications

Our recommendation is to keep the microphone distant from the other application components and to keep the
microphone gasket unsealed with respect to the ultrasound vibrating object to be detected.

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AN5522

Revision history
Table 2. Document revision history

AN5522 - Rev 2

Date

VersionChanges

31-Aug-2020

1

Initial release16-Sep-2020

2

Minor textual updates

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AN5522
Contents

Contents1

2

3Overview of ST MEMS microphones . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.1

Mechanical structure of MEMS microphones . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.2

Helmholtz frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Ultrasound capability of analog microphones . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1

Theoretical ultrasound behavior simulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2.2

Experimental results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2.1

Ultrasound test setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.2.2

Ultrasound test results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Ultrasound applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.1

Overview of ultrasound applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.2

ST reference design guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
List of figures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

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AN5522
List of figures

List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.

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Section of the MEMS microphone parallel plate capacitor structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
MEMS microphone inserted into a standard metal package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Simulation of MEMS microphone - thick, standard board application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Simulation of MEMS microphone - thin, flex board application. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Flowchart of the tester equalization procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Average IMP23ABSU ultrasound frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Full 20 Hz-80 kHz frequency response band normalized with respect to the 1 kHz 94 dBSPL sensitivity, in
logarithmic scale . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Reference design adapter for IMP23ABSU ultrasound applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

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© 2020 STMicroelectronics – All rights reserved

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