SH8M31
Datasheet

60V Nch+Pch Power MOSFET

l外 形 図SymbolVDSS
RDS(on)(Max.)
IDPD

Tr1:Nch Tr2:Pch
60V-60V

65mΩ

70mΩ

±4.5A±4.5A

SOP82.0Wl特 長l内 部 回 路 図

1) 低オン抵抗2) 小型面実装パッケージ(SOP8)で省スペース
3) 鉛フリー対応済み、RoHS準拠
4) ハロゲンフリー

l包 装 仕 様l用 途
スイッチング

包装形態

EmbossedTape

リールサイズ (mm)330122500TB
SH8M31タイプ テープ幅 (mm)
基本発注単位(個)テーピングコード標印

l 絶 対 最 大 定 格 (Ta = 25°C、特に指定のない限り)

Parameter

Symbolドレイン・ソース間電圧

VDSS
ID
IDP*1
VGSS
PD*2
PD*3
TjTstg

ドレイン電流 (直流)
ドレイン電流 (パルス)ゲート・ソース間電圧
全許容損失

トータル

ジャンクション温度
保存温度

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Value
Tr1:Nch Tr2:Pch
60-60±4.5±4.5±18±18±20±20
2.0
1.4
150
-55 ～ +150

Unit
VAA
VW℃℃

20171114 - Rev.002

SH8M31

Datasheetl熱 抵 抗Parameter

Symbol

熱抵抗 (ジャンクション・外気間)トータル

RthJA*2
RthJA*3

Values

Unit

Min.

Typ.

Max.

--62.5
89.2℃/W

ValuesMin. Typ. Max.

Unit

l 電 気 的 特 性 (Ta = 25°C)

Parameter

Symbol Type

ドレイン・ソース降伏電圧 V(BR)DSS

Conditions

Tr1 VGS = 0V, ID = 1mA60--

Tr2 VGS = 0V, ID = -1mA-60---63.7-60-

Tr1 VDS = 60V, VGS = 0V--1

Tr2 VDS = -60V, VGS = 0V---1

Tr1 VGS = ±20V, VDS = 0V--±10

Tr2 VGS = ±20V, VDS = 0V--±10

Tr1 VDS = 10V, ID = 1mA

1.0-3.0

Tr2 VDS = -10V, ID = -1mA-1.0--3.0

ドレイン・ソース降伏電圧 ΔV(BR)DSS Tr1 ID = 1mA, referenced to 25℃
温度係数
ΔTj
Tr2 ID = -1mA, referenced to 25℃
ドレイン遮断電流

IDSS

ゲート漏れ電流IGSSゲートしきい値電圧VGS(th)ゲートしきい値電圧
温度係数

ΔVGS(th)

Tr1 ID = 1mA, referenced to 25℃--4.4-ΔTj

Tr2 ID = -1mA, referenced to 25℃
VGS = 10V, ID = 4.5A

-3.04665

Tr1 VGS = 4.5V, ID = 4.5A

-52

73

VGS = 4.0V, ID = 4.5A

-55

77

VGS = -10V, ID = -4.5A-5070

Tr2 VGS = -4.5V, ID = -4.5A

-55

80

VGS = -4.0V, ID = -4.5A

-60

85

Tr1f=1MHz, open drain
Tr2-5.84.0-

Tr1 VDS = 10V, ID = 4.5A

3.0--Tr2 VDS = -10V, ID = -4.5A

6.5--

ドレイン・ソース間オン抵抗

RDS(on)*4ゲート抵抗

RG

順伝達アドミタンス|Yfs| *4VmV/℃
μA
μA
VmV/℃mΩΩ
S*1 Pw ≦ 10μs, Duty cycle ≦ 1%
*2 セラミック基板実装時 (30×30×0.8mm)*3 銅箔基板実装時 (40×40×0.8mm)*4 パルス

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20171114 - Rev.002

SH8M31

Datasheetl 電 気 的 特 性 (Ta = 25°C)<Tr1>

Parameter

SymbolValuesConditions

UnitMin.

Typ.

Max.

入力容量

Ciss

VGS = 0V-500-

出力容量

Coss

VDS = 10V-120-

帰還容量

Crss

f = 1MHz-55-

ターンオン遅延時間td(on)*4

VDD ⋍ 30V, VGS = 10V-

12-上昇時間

tr*4

ID = 2.3A-18-ターンオフ遅延時間

td(off)*4

RL = 13Ω-40-下降時間

tf*4

RG = 10Ω-13-

pF

ns

<Tr2>
Parameter

SymbolValuesConditions

Unit

Min.

Typ.

Max.

入力容量

Ciss

VGS = 0V

-

2500-

出力容量

Coss

VDS = -10V-

540-

帰還容量

Crss

f = 1MHz-140-

ターンオン遅延時間td(on)*4

VDD ⋍ -30V, VGS = -10V-17-

上昇時間

tr*4

ID = -2.3A-18-

ターンオフ遅延時間td(off)*4

RL = 13Ω-100-

下降時間

tf*4

RG = 10Ω

-40-

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pF

ns

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20171114 - Rev.002

SH8M31

Datasheetl ゲ ー ト 電 荷 量 特 性 (Ta = 25°C)<Tr1>
Parameter

Symbolゲート総電荷量

Conditions

Qg*4

ゲート･ソース間電荷量

Qgs*4

ゲート･ドレイン間電荷量

Qgd*4

VDD ⋍ 30V, ID = 4.5A
VGS = 5.0V

Values
Min.

Typ.

Max.

-

7.0-

-

1.6--

2.5

-

Unit

nC

<Tr2>
Parameter

Symbolゲート総電荷量

Conditions

Qg*4

ゲート･ソース間電荷量

Qgs*4

ゲート･ドレイン間電荷量

Qgd*4

VDD ⋍ -30V, ID = -4.5A
VGS = -10V

Values
Min.

Typ.

Max.

-40--5.5--5.0-

UnitnCl 内 部 ダ イ オ ー ド 特 性 (ソース･ドレイン間) (Ta = 25°C)<Tr1>
Parameter

Symbol

ソース電流(直流)IS

ソース電流(パルス)

ISP*1

順方向電圧

VSD*4Conditions
Ta = 25℃

Values
Min.

Typ.

Max.

--

1.67

--

18-

-

1.2

Unit

A

VGS = 0V, IS = 4.5A

V

<Tr2>
Parameter

Symbol

ソース電流(直流)IS

ソース電流(パルス)

ISP*1

順方向電圧

VSD*4

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Conditions
Ta = 25℃

Values
Min.

Typ.

Max.

---1.67---18---1.2

UnitA

VGS = 0V, IS = -4.5A

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SH8M31

Datasheetl 電 気 的 特 性 曲 線 <Tr1>

Fig.1 Power Dissipation Derating Curve

Fig.2 Maximum Safe Operating Area

Fig.3 Normalized Transient Thermal
Resistance vs. Pulse Width

Fig.4 Single Pulse Maximum Powerdissipationwww.rohm.com© 2017 ROHM Co., Ltd. All rights reserved.

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SH8M31

Datasheetl 電 気 的 特 性 曲 線 <Tr1>

Fig.5 Typical Output Characteristics(I)Fig.6 Typical Output Characteristics(II)Fig.7 Breakdown Voltage vs.
Junction Temperaturewww.rohm.com© 2017 ROHM Co., Ltd. All rights reserved.

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20171114 - Rev.002

SH8M31

Datasheetl 電 気 的 特 性 曲 線 <Tr1>

Fig.8 Typical Transfer Characteristics

Fig.9 Gate Threshold Voltage vs.
Junction Temperature

Fig.10 Forward Transfer Admittance vs.
Drain Current

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20171114 - Rev.002

SH8M31

Datasheetl 電 気 的 特 性 曲 線 <Tr1>

Fig.11 Drain Current Derating Curve

Fig.12 Static Drain - Source On - StateResistance vs. Gate Source Voltage

Fig.13 Static Drain - Source On - State
Resistance vs. Junction Temperaturewww.rohm.com© 2017 ROHM Co., Ltd. All rights reserved.

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20171114 - Rev.002

SH8M31

Datasheetl 電 気 的 特 性 曲 線 <Tr1>

Fig.14 Static Drain - Source On - State
Resistance vs. Drain Current (I)Fig.15 Static Drain - Source On - State
Resistance vs. Drain Current (II)Fig.16 Static Drain - Source On - State
Resistance vs. Drain Current (III)Fig.17 Static Drain - Source On - State
Resistance vs. Drain Current (Ⅳ)

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20171114 - Rev.002

SH8M31

Datasheetl 電 気 的 特 性 曲 線 <Tr1>

Fig.18 Typical Capacitance vs.
Drain - Source Voltage

Fig.19 Switching Characteristics

Fig.20 Dynamic Input Characteristics

Fig.21 Source Current vs.
Source Drain Voltage

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10/19

20171114 - Rev.002

SH8M31

Datasheetl 電 気 的 特 性 曲 線 <Tr2>

Fig.1 Power Dissipation Derating Curve

Fig.2 Maximum Safe Operating Area

Fig.3 Normalized Transient ThermalResistance vs. Pulse Width

Fig.4 Single Pulse Maximum Powerdissipationwww.rohm.com© 2017 ROHM Co., Ltd. All rights reserved.

11/19

20171114 - Rev.002

SH8M31

Datasheetl 電 気 的 特 性 曲 線 <Tr2>

Fig.5 Typical Output Characteristics(I)Fig.6 Typical Output Characteristics(II)Fig.7 Breakdown Voltage vs.
Junction Temperaturewww.rohm.com© 2017 ROHM Co., Ltd. All rights reserved.

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20171114 - Rev.002

SH8M31

Datasheetl 電 気 的 特 性 曲 線 <Tr2>

Fig.8 Typical Transfer Characteristics

Fig.9 Gate Threshold Voltage vs.
Junction Temperature

Fig.10 Forward Transfer Admittance vs.
Drain Current

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13/19

20171114 - Rev.002

SH8M31

Datasheetl 電 気 的 特 性 曲 線 <Tr2>

Fig.11 Drain Current Derating Curve

Fig.12 Static Drain - Source On - State
Resistance vs. Gate Source Voltage

Fig.13 Static Drain - Source On - State
Resistance vs. Junction Temperaturewww.rohm.com© 2017 ROHM Co., Ltd. All rights reserved.

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20171114 - Rev.002

SH8M31

Datasheetl 電 気 的 特 性 曲 線 <Tr2>

Fig.14 Static Drain - Source On - State
Resistance vs. Drain Current (I)Fig.15 Static Drain - Source On - State
Resistance vs. Drain Current (II)Fig.16 Static Drain - Source On - State
Resistance vs. Drain Current (III)Fig.17 Static Drain - Source On - State
Resistance vs. Drain Current (Ⅳ)

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20171114 - Rev.002

SH8M31

Datasheetl 電 気 的 特 性 曲 線 <Tr2>

Fig.18 Typical Capacitance vs.
Drain - Source Voltage

Fig.19 Switching Characteristics

Fig.20 Dynamic Input Characteristics

Fig.21 Source Current vs.
Source Drain Voltage

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20171114 - Rev.002

SH8M31l測 定 回 路 図

Datasheet<Tr1>

図 1-1 スイッチング時間測定回路

図 1-2 スイッチング波形

図 2-1 ゲート電荷量測定回路

図 2-2 ゲート電荷量波形

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SH8M31l測 定 回 路 図

Datasheet<Tr2>

図 3-1 スイッチング時間測定回路

図 3-2 スイッチング波形

図 4-1 ゲート電荷量測定回路

図 4-2 ゲート電荷量波形

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SH8M31

Datasheetl外 形 寸 法 図

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20171114 - Rev.002

Notice
Precaution on using ROHM Products
1.

Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transportequipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including caraccessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury orserious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for SpecificApplications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPANUSAEU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ2.

ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, whicha failure or malfunction of our Products may cause. The following are examples of safety measures:[a] Installation of protection circuits or other protective devices to improve system safety[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3.

Our Products are designed and manufactured for use under standard conditions and not under any special orextraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation ofproduct performance, reliability, etc, prior to use, must be necessary:[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,H2S, NH3, SO2, and NO2[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items[f] Sealing or coating our Products with resin or other coating materials[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue offlux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering[h] Use of the Products in places subject to dew condensation

4.

The Products are not subject to radiation-proof design.

5.

Please verify and confirm characteristics of the final or mounted products in using the Products.

6.

In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affectproduct performance and reliability.

7.

De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.

8.

Confirm that operation temperature is within the specified range described in the product specification.

9.

ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined inthis document.

Precaution for Mounting / Circuit board design
1.

When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect productperformance and reliability.

2.

In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E© 2015 ROHM Co., Ltd. All rights reserved.

Rev.003

Precautions Regarding Application Examples and External Circuits
1.

If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of thecharacteristics of the Products and external components, including transient characteristics, as well as staticcharacteristics.

2.

You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not beapplied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation
1.

Product performance and soldered connections may deteriorate if the Products are stored in the places where:[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation[d] the Products are exposed to high Electrostatic

2.

Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time isexceeding the recommended storage time period.

3.

Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.

4.

Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products ofwhich storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights
1.

All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.

2.

ROHM shall not have any obligations where the claims, actions or demands arising from the combination of theProducts with other articles such as components, circuits, systems or external equipment (including software).

3.

No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution
1.

This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2.

The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior writtenconsent of ROHM.

3.

In no event shall you use in any way whatsoever the Products and the related technical information contained in theProducts or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.

4.

The proper names of companies or products described in this document are trademarks or registered trademarks ofROHM, its affiliated companies or third parties.

Notice-PGA-E© 2015 ROHM Co., Ltd. All rights reserved.

Rev.003

Datasheet
General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any priornotice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale srepresentative.

3.

The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of orconcerning such information.

Notice – WE

© 2015 ROHM Co., Ltd. All rights reserved.

Rev.001