MMIC 2-18GHz 90° Splitter / Combiner

MQS-0218

1 Device Overview
1.1 General Description
The MQS-0218 is a MMIC 2GHz – 18GHz 90° splitter/combiner.
Wire bondable 50Ω terminations are available on-chip. Passive GaAs
MMIC technology allows production of smaller constructions that
replace larger form factor circuit board constructions. Tight
fabrication tolerances allow for less unit to unit variation than
traditional splitter/combiner technologies. The MQS-0218 isavailable as a wire bondable chip and connectorized module. Lowvariation allows for accurate simulations using the provided S4P filetaken from measured production units. Applications include single
sideband upconverters, image rejection downconverters, IQ
modulators, balanced amplifiers, and microwave correlators. The
MQS-0218 is not recommended for applications involving reflectedsignals.

Bare Die

Module1.2 Features
▪
▪
▪
▪
▪
▪

Designed for C to Ku-band applications
High amplitude and phase balanceHigh isolation
Low insertion loss
On-chip 50Ω load terminations
S4P data MQS-0218CH.zip, MQS-0218UA.zip

1.3 Functional Block Diagram
Input

90° OutputIsolated

0° Output

1.4 Part Ordering Options11Part
NumberDescription

Package

GreenStatus

ProductLifecycle

ExportClassification

MQS-0218CH

Wire bondable dieCHRoHS

Active

EAR99

MQS-0218UA

Connectorized

UARoHS

Active

EAR99

Refer to our website for a list of definitions for terminology presented in this table.

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3.4

Table of Contents
123

Device Overview ............................... 1
1.1

General Description .................... 1

1.2

Features ................................... 1

1.3

Functional Block Diagram ............ 1

1.4Part Ordering Options ................. 1

Port Diagram ............................. 3

2.2

Port Functions ........................... 3

Specifications ................................... 4
3.1

Absolute Maximum Ratings .......... 43.2

Package Information .................... 4

3.3

Electrical Specifications .............. 5

3.3.1

Bare Die ............................. 5

3.3.2

Connectorized Module .......... 5

Typical Performance Plots ........... 6

3.4.1

Bare Die ............................. 6

3.4.2

Connectorized Module .......... 7

4Application Information ...................... 95Die Mounting Recommendations ....... 125.1
Mounting and Bonding
Recommendations .............................. 12Port Configurations and Functions ...... 3
2.1

MQS-0218

65.2

Handling Precautions ................ 12

5.3

Bonding Diagram ...................... 13

5.3.1

Four Port Device ............... 13

5.3.2

Isolated Port Terminated..... 13

Mechanical Data ............................. 14
6.1

CH Package Outline Drawing ..... 14

6.2

UA Package Outline Drawing...... 14

Revision History
Revision Code-Revision Date
August 2018

Copyright © 2018 Marki Microwave, Inc.

Comment
Datasheet Initial Release

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MQS-0218

2 Port Configurations and Functions
2.1 Port Diagram
A top-down view of the MQS-0218CH package outline drawing is shown below. Onlyports 1 or 2 may be used as an input. Ports 3 and 4 are not recommended as inputs.
Device is not recommended for applications requiring reflected signals. Ports 1 – 4
correspond to the UA package designation.

50Ω
Termination
4 pc

2.2 Port Functions2Port

Configuration
AConfiguration
B

Description

Port 1Input

90° Output

Port 1 is DC short to port
3 and open to ground.

Port 290° Output

Input

Port 2 is DC short to port
4 and open to ground.

Port 30° Output

Isolated

Port 3 is DC short to port
1 and open to ground.

Port 4Isolated

0° Output

Port 4 is DC short to port
2 and open to ground.

GroundCH package ground path isprovided through thesubstrate and ground bondpads.

Pad

2GroundEquivalent Circuit

Each configuration describes a different application of the same product.

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3 Specifications
3.1 Absolute Maximum Ratings
The Absolute Maximum Ratings indicate limits beyond which damage may occur to thedevice. If these limits are exceeded, the device may be inoperable or have a reducedlifetime.
Parameter

Maximum Rating

Units

DC Current at any port

TBDmA

Power Handling, at any Port

TBD

dBm

Operating Temperature-55 to +100°C

Storage Temperature-65 to +125°C

3.2 Package Information
Parameter
ESD

Details

RatingHuman Body Model (HBM), per MIL-STD-750, Method 1020

N/A

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3.3 Electrical Specifications3
The electrical specifications apply at TA=+25°C in a 50Ω system.
Min and Max limits are guaranteed at TA=+25°C.

3.3.1 Bare Die
Parameter
Coupling
Nominal Phase Shift
Amplitude Balance

Phase Balance

Frequency
(GHz)

Min

2-18

dB

90

Degrees±23-18±1±42-17±3±717-18±5
1.4

2-18

9Impedance

50

Nominal Phase Shift
Amplitude Balance

Phase Balance

Min

2-18

Typ.

dB

Units

3dB

90

Degrees±1±52-17±3±1217-18±6
1.418

VSWR

1.17

Impedance

503Max3-18

8.5

Degrees

Ω±22-18

dB

dB

2-3

Excess Through Line
Insertion LossIsolation

4.217
1.25

3.3.2 Connectorized Module
Frequency
Parameter
(GHz)

Units

3VSWR

CouplingMax

2-3

Excess Through Line
Insertion LossIsolation

Typ.

4.2dB

DegreesdBdB

ΩDevice is not symmetric. Operation not guaranteed when ports 3 or 4 are used as an input.

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MQS-0218

3.4 Typical Performance Plots4
3.4.1 Bare Die

4All measurements taken in a 50Ω environment. On-chip load was not used when taking
measurements.

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MQS-0218

3.4.2 Connectorized ModuleCopyright © 2018 Marki Microwave, Inc.

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MQS-0218

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MQS-0218

4 Application Information
Quadrature signal generation is useful for many applications in analog signal processing. Marki
MQH/S MMIC quadrature hybrids and 90˚ Splitter/Combiners offer this functionality in a small
factor with high repeatability. Below are applications and how they can be realized with the MQHand MQS product lines.
Quadrature Hybrids vs 90˚ Splitter/Combiners
Some products are ‘true’ quadrature hybrids, while others are 90˚ Splitter/Combiners. Aquadrature hybrid is symmetric about all four ports, meaning that in a splitting application any port
can be used as an input, with the isolated and output ports following from this selection. Likewise,
for a combining application, any port can be used as an output.
A 90˚ Splitter/Combiner is not symmetric. When splitting, only ports 1 and 2 can be used as aninput. If ports 3 or 4 were used, there would be significant phase walk-off between the outputports. As a combiner, only ports 1 and 2 are suitable as output ports. The phase walk-off
introduced when using ports 3 or 4 as an output means that reflected signals recombine andcancel poorly inside a 90° Splitter/Combiner.
Single Sideband and Image Reject Mixers

The primary application for the MQH and MQS series is as IF or LO quadrature signal
splitter/combiners. They can be used in combination with the MMIQ series of IQ mixers to create
broadband single sideband and image reject mixers. Either 90˚ Splitter/Combiners or quadraturehybrids can be used as the IF hybrid, but if a 90˚ Splitter/Combiner is used only one sideband (orimage) is accessible, whereas if a quadrature hybrid is used than both sidebands are accessible.
If 90˚ Splitter/Combiner is used for a single sideband upconverter or image reject mixer, port 1(or 2) should be used as the IF input/output and ports 2 and 3 (or 1 and 4) should be connected to
the I and Q ports. Selecting port 1 or 2 to terminate will select which sideband of the mixer toreject.

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MQS-0218

Balanced Amplifiers

In a balanced amplifier, the poor return loss of an amplifier is compensated for with a quadrature
hybrid. In this application, the reflections from the input or output are collected at the isolated
port of the quadrature hybrid and terminated.
Since a 90˚ Splitter/Combiner is not completely symmetric, reflected signals will not terminate aswell as with a quadrature hybrid. An MQH option is recommended for this application. If a 90˚Splitter/Combiner is used for a single sideband upconverter or image reject mixer, port 1 (or 2)
should be used as the IF input/output and ports 2 and 3 (or 1 and 4) should be connected to the I
and Q ports. Selecting port 1 or 2 to terminate will select which sideband of the mixer to reject.
Testing/simulation is recommended when considering if a 90° Splitter/Combiner is suitable.

Reflectionless Filter

Similar to a balanced amplifier, a reflectionless filter will terminate reflections that are out of bandfor a filter (but in band for the quadrature hybrid) at the isolated port.
Since a 90˚ Splitter/Combiner is not completely symmetric, reflected signals will not terminate aswell as with a quadrature hybrid. An MQH option is recommended for this application. If a 90˚Splitter/Combiner is used for a single sideband upconverter or image reject mixer, port 1 (or 2)
should be used as the IF input/output and ports 2 and 3 (or 1 and 4) should be connected to the I
and Q ports. Selecting port 1 or 2 to terminate will select which sideband of the mixer to reject.
Testing/simulation is recommended when considering if a 90° Splitter/Combiner is suitable

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MQS-0218

Reflective Applications

Unlike in the previous applications, reflective applications only work well with a quadrature hybrid(not a 90˚ Splitter/Combiner). In these applications a signal is reflected off of two identicalstructures (typically a PIN diode) and the output signal is collected at the isolated port. In thiscase the desired signal is deliberately reflected.
Since a 90˚ Splitter/Combiner is not completely symmetric, you will have poor results if you use
these for reflective applications.

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MQS-0218

5 Die Mounting Recommendations
5.1 Mounting and Bonding Recommendations
Marki MMICs should be attached directly to a ground plane with conductive epoxy. Theground plane electrical impedance should be as low as practically possible. This will
prevent resonances and permit the best possible electrical performance. Datasheet
performance is only guaranteed in an environment with a low electrical impedance ground.
Mounting - To epoxy the chip, apply a minimum amount of conductive epoxy to themounting surface so that a thin epoxy fillet is observed around the perimeter of the chip.
Cure epoxy according to manufacturer instructions.
Wire Bonding - Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire.
Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding
force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use
the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should bestarted on the chip and terminated on the package or substrate.
Circuit Considerations – 50 Ω transmission lines should be used for all high frequency
connections in and out of the chip. In circumstances where the chip more than .001”
thinner than the substrate, a heat spreading spacer tab is optional to further reducebondwire length and parasitic inductance.
Special Considerations for 90° Splitters – Transitions between the chip andtransmission line should be as close to 50 Ω as possible. Small impedance mismatches will
result in poor phase balance mid-band due to reflections. Length and number of wirebonds should be adjusted to tune inductance for an optimal 50 Ω match. In the modules,
chip transitions are optimized for broadband performance.

5.2

Handling Precautions

General Handling
Chips should be handled with care using tweezers or a vacuum collet. Users should takeprecautions to protect chips from direct human contact that can deposit contaminants,
like perspiration and skin oils on any of the chip's surfaces.
Cleaning and Storage: Do not attempt to clean the chip with a liquid cleaning system or
expose the bare chips to liquid. Once the ESD sensitive bags the chips are stored in areopened, chips should be stored in a dry nitrogen atmosphere.

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MQS-0218

5.3 Bonding Diagram
The MQS-0218 has 50Ω loads near each I/O port, allowing the user to terminate the isolated port
on-chip.
5.3.1 Four Port Device

5.3.2 Isolated Port TerminatedCopyright © 2018 Marki Microwave, Inc.

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6MQS-0218

Mechanical Data

6.1 CH Outline Drawing

1.
2.

CH Substrate material is 0.004 in thick GaAs.
I/O trace finish is 5 microns Au. Ground plane finish is 4 microns Au.

6.2 UA Package Outline Drawing

Marki Microwave reserves the right to make changes to the product(s) or information contained herein without notice.
Marki Microwave makes no warranty, representation, or guarantee regarding the suitability of its products for any
particular purpose, nor does Marki Microwave assume any liability whatsoever arising out of the use or application of any
product.

© Marki Microwave, Inc.