ST portfolio forsmartphone platforms

Contents
4
6
8
10
13
17
21
25
28
29
30

Introduction
Snapshot of ST mobile portfolio
Processor unit subsystem
Power management subsystem
Connectivity subsystem
UI subsystem
Camera subsystem
Display subsystem
Memory/SIM subsystem
Audio subsystem
LDO and protections in smartphones

3

Introduction

Smartphones are the most commony used computing devices. They exhibit powerful hardware
capabilities and complex operating systems, allowing advanced features and AI applications,internet and cloud access, image and video acquisition, gaming, and core phone functions such as
voice calls and SMS. To perform such a variety of applications, smartphones must include many
devices, including a large set of sensors ( MEMS and Imaging) and devices to support several
wireless communications protocols like Bluetooth, Wi-Fi, UWB, NFC, 4G/5G.
STMicroelectronics is a leading semiconductor supplier in the mobile industry whitch provides
solutions for both mobile platform suppliers and mobile device manufacturers (OEM/ODM), withfocus on specific high-volume applications.

SMARTPHONE PLATFORM
The technologies in all modern smartphones enable many applications and can be quite complex in terms of system design.
The hearth of this platform is the application processor (AP) which ST does not supply but offers many devices to cover mostof the remaining system.
To better represent the smartphone platform, we can divide it into subsystems (main functional domains, as illustrated below),
so we can analyze each subsystem separately. Besides the AP, a modern smartphone can be represented by the following set
of functional blocks domains: Display domain, UI domain, Power domain, Audio domain, Connectivity domain, RF domain,
Memory domain, and cameras domain.

Display/
Touchscreen

UI & Sensors

PowerManagement

Audio

Back Camera

Processor Unit
Wireless
Connectivity

Front Camera

Face ID

4

SIM/Memory

RF Module

The following block diagram expands on the previous illustration by showing the ST products for each subsystem, which aredetailed separately in the following sections.

Battery chargers
and adapters

Power management
MCU

Wirelesschargers
USB type-C
PD adapters &quick chargers

Wirelesschargers IC

Battery
charger IC

Switch-cap
cargerUSB type-C& PD controllers

USB port
protection

USB dataline
protection

SIM/Memory
eSIM

SIM

SIM card
protection

Flash

UI & sensors

Display/Touchscreen
Touchscreen
controller

AMOLED
PMIC

SerialEEPROM

Display ESD
protection

Display
DriverHaptics driver

LCD backlight& LED control

Ambient
light sensor

Fingerprint
sensor
Processor unit

Smart
reset

eCompass

Sensors
ESD protection

Pressure
sensors

Accelerometers

iNEMO-Inertial
modules

Application
processor

EIS / OIS

Wireless connectivity
UWB

Back camera

DDR

NFC
controller

WLAN/BT/GPS

60GHz radio

Antenna
protection

MCU
PMIC

Time-of-Flightsensors
iToF/dToF

Secureelement

Ambient
light sensor

Low dropout(LDO)
Linear regulators
CMOS image
sensorProtection

RF Module
Amplifiers

Filters

3G/4G/5G
transceiver

AntennatunersFront camera

Accessories
Smart pen

SerialEEPROM

Protection

SerialEEPROM

Time-of-Flightsensors

CMOS image
sensor

Earbuds &headset (TWS)

Low dropout(LDO)
Linear regulators

Face authentication
Audio
MEMS
microphone

Audio
codec

Audio
amplifier

Audio ESD
protection

Time-of-Flightsensor
iToF
SerialEEPROM

Global shutter
image sensor
Low dropout(LDO)
Linear regulators

VCSEL &
laser driver
ProtectionNote:• pink box: not covered by ST products• light blue: covered by ST products• dark blue: external functions/devices

5

Snapshot of ST
Mobile Portfolio

ST provides a range of products to help on the designof leading-edge mobile devices. We enhance theuser experience with products such as motion andenvironmental sensors, imaging-related products, andMCUs for specific low-power tasks. We provide secure
elements and secure near field communication (NFC)
solutions, and touch-sensor controllers with multi-touchcapabilities. We protect devices with integrated passive
device technologies, ESD protection and EMI filtering
products, and a range of analog products. We also
power devices with high-efficiency power and energy
management products optimized for battery-powered
designs, including touchscreen power management,
and wireless charging solutions. We also improveconnectivity with our RF product range, which includes
smart antenna tuning and RFSOI FEM solutions.

6

Accelerometer

6-axis IMUs

Magnetometer

Pressure sensors

iToF & dToF

Spectometers

GS sensor

H3LIS331DL
LIS2DW12LSM6DSO
LSM6DSOX
LSM6DSV16X
LSM6DSO16IS

LIS2MDL

LPS22HH
LPS22DF
LPS28DFWVL53 family
VD55H1

VD6283

VD56G3
VD55G0

NFC controller

eSIM

NFC/eSE/eSIM

60 GHz transceiver

MCU

Wireless charging

MemoryST21NFC

ST33

ST54

ST60

STM8 & STM32
familySTWLC38/98 (RX)STWBC2-HP (TX)

M24 family of
EEPROM

OLED controller

Touch controller

Force sensors

Secure element

Smart reset

LDOs

Protections

STMP30FingerTip

FSR1AD04

STSAFE-S320

STM65XX
STM66XXLDLN025
LD56010 / 57100/ 59030

TCPP02-M18
ESDARF02

7

Processor Unit
Subsystem

ST is member of the Android Ready SE Alliance and offers StrongBox on a complete range oftamper-resistant secure elements:• for smartphone devices having an ST54 NFC/eSE solution to support NFC secure services,
StrongBox is fully embedded into the ST54 Secure Element functionalities• for smartphone devices targeting both eSIM and StrongBox functionalities, a combined ST33
eSIM + STrongBox solution is available• for smartphone devices with no secure element, STSAFE-S320 offers a discrete and very costeffective solution to support StrongBox.
STSAFE-S320, discrete secure element supporting StrongBox
Embedded JavaCard OS / Global platform 2.3
KeyMint, Weaver and secure storage applets
Highly secure and common criteria EAL5+ certified
JavaCard open protection profile
Android Ready SE

8Discrete hardware, small WLCSP footprint < 5mm2

PROCESSOR UNIT SUBSYSTEM

Application processor

Vbat

GPU
ISP
Modem

PMIC

Sensor hub

SDRAM

SecureElement

Platform & processor

PROCESSOR UNIT SUBSYSTEM BILL OF MATERIAL
Secure element
STSAFE-S320

9

Power Management
Subsystem
ST offers high integration combinedwith a broad IP portfolio, complete
system competency, and state-of-theart technology for power management
in mobile applications. We offer a wide
range of products from simple power
management ICs to highly-integrated
devices that mix power management
blocks with advanced analog and digital
functionality.
The STCHARGE family offers PowerTx and Power Rx products for wirelesscharging solutions able to support thelatest Qi BPP, EPP, and up to 100W with
proprietary protocols. In order to enable
fast system solution deployment, ST
developed a proprietary high-power
wireless charging proprietary protocol:
STSuperCharge (STSC).

WBC transmitters (PTx)•••

Industry-first monolithic transmitter with integrated
full bridge inverter and low BOM
Limitless wireless power architecture for wide range
of applications
Future proof - ready for standard and proprietary
protocol evolution≤ 15 W••WPC Qi 1.3 BPP or EPP compatible
Device-to-device charging with reverse power transfer•

High power with proprietary STSuperCharge (STSC)
protocolLIMITLESS W≤ 15 W

15W – 70 W

≤ 100 W

Wearables, TWS
E-cigarettes,
Trackers

Smartphones,
Tablets
Power tools,
industrial

Laptops, tablets
Power tools,
industrial

Wearables, TWS
Portables,
E-cigarettes

Laptops, tablets
Power tools,
industrial

Laptops, tablets
Power tools,
industrial

STWBC86

STWBC2-HP

STWBC2-HP

STWLC38JRSTWLC98JRSTWLC99JR• Qi 1.3 EPP• Proprietary STSC

• Qi 1.3 EPP• 2.5W and 5W ref.

• Qi 1.3 EPP• Dual-mode up to• Qi 1.3 EPP• Dual-mode up to

12 W transmitter

15 W transmitter≤5W• Qi 1.2.4 BPP
compatible• Monolithic Tx

10

WLC receivers (PRx)• Qi 1.3 EPP
compatiblereference design

supportdesignsAlmost all OEMs have their own fast charging protocol (see figure below). ST can support this requirement with dedicated
MCUs (8-bit or 32-bit) for the implementation of each protocol. Furthermore, the new Switched Capacitor Charger family
enables fast charging with the state-of-the-art efficiency performance supporting both wired and wireless battery charging
functions.

POWER MANAGEMENT SUBSYSTEM BLOCK DIAGRAM

Protection
Vbat

Battery
charger

USB type-C

Application
processor

Protection

Wirelesscharging

MCU

Power domain

POWER MANAGEMENT SUBSYSTEM BILL OF MATERIAL
Wireless charging

MCU

Protection

Switch capacitor
charger

STWBC2-HP (TX)
STWBC86 (TX)
STWLC38 (RX)STWLC98 (RX)STWLC99* (RX)STM8s

ESDA25P35-1U1M
TCPP01-M12

STSWC58*
STSWC68*

Note *: Product not released yet. Please contact the the local sales representative

11

TURNKEY SOLUTIONS• STEVAL-ISB68WA (wearable 2.5W receiver reference design using STWLC68)• STEVAL-ISB68RX (5W receiver evaluation board using STWLC68)• STEVAL-WLC38RX* (Qi 1.3 compatible 5W receiver evaluation board using STWLC38)• STEVAL-WBC86TX* (Qi 1.2.4 compatible 5W transmitter evaluation board using STWBC86)
Note *: Product not released yet. Please contact the local sales representative
STEVAL-WLC38RX (Q4 2022 – tentative target date)
STEVAL-WBC86TX (Q4 2022 – tentative target date)

SW BASKET• STSW-ISB68GUI (PC GUI for prototyping with STWLC68)• STSW-WPSTUDIO* (ST Wireless Power Studio PC GUI for fast prototyping and mass production for all products
except STWBC2-xx family)• STSW-WLC38FWBPP* (5W BPP compatible receiver FW)• STSW-WBC86FWBPP* (5W BPP compatible transmitter FW)

12

Connectivity
Subsystem

The connectivity domain includes all the connectivity options offered in smartphones.
The mobile market predominately uses integrated system-on-chip (SoC) solutions combining atleast Wi-Fi, Bluetooth®, and GPS. ST is more focused on the other connectivity options that candeliver competitive advantages to mobile makers, such as NFC. ST can offer a wide range of
products enabling NFC data exchange or advanced mobile payment solutions, based on embedded
secure elements.
ST provides a full range of NFC and eSE / eSIM products and solutions to address secure mobiletransaction applications from the state-of-the art ST21NFC NFC controller to the ST54 integrating
the widely deployed ST33 secure element. ST54 now allows a new level of integration by merging
NFC, eSE, and eSIM in the single-die ST54J solution in a compact WLCSP package.
Another connectivity solution offered by ST is the ST60 RF transceiver for the 60 GHz band. It
provides a very power-efficient wireless link with a high data rate, eliminating the need for physicalcables and connectors for short range (a few centimeters) point-to-point communications.

SMARTPHONE RF SUBSYSTEM BLOCK DIAGRAM
PMIC
Vbat

NFC/eSEST60

WLAN/BT/GPS

Protection

Connectivity domain
13

ST21NFC FOR NFC CONTROLLER
ST21NFCDJ is the 4th generation ST NFC controller integrating a high-performance RF booster to provide the best user
experience and ensure a high level of interoperability to ease integration and certification efforts for OEMs.

ST54 FOR INTEGRATED SOLUTIONSIn order to manage secure mobile transactions, ST provides a large range of ST54 integrated solutions merging our ST21NFC
NFC controller and the proven ST33 secure element. The first generation is a system-in-package (ST54H) housed in a BGA
package, while the new ST54J/K system-on-chip (SoC) optimized for convergence is available as a single die in a thin WLCSP
package.
The ST54J/K delivers performance-boosting integration for mobile and IoT devices with the added benefit of the ST softwarepartner ecosystem for smoother user experiences in mobile payments and e-ticketing transactions, as well as more convenient
remote mobile provisioning to support multiple operator subscriptions.

ST33 eSIM: #1 source at Tier 1 OEMs

Application
processor• Few hundred millions shipped to date

NFC SW Stack• GSMA SAS-UP certified since 2019
SIM
ST33
eSIM
ST33

ST54

ST54 NFC+SE: reference in Android ecosystem• Recognized RF performances• Single die WLCSP form factor (ST54J, ST54K)• eSIM convergence support (flagships)• Support of UWB secure transactions

NFC+ eSE/eSIM

ST21 NFC controller: validated by most tier 1 OEMs

HIGH-SPEED 60GHZ RF TRANSCEIVER
ST60 is a 60 GHz V-Band transceiver for contactless connectivity up to 480 Mbps. It offers best-in-class wireless performancewith transfer speeds up to 6.25 Gbps, along with very low power consumption.
The ST60A3G1 has a miniature form factor, optimized bill of materials and low-power operation. The ST60A3G1 is a highspeed RF transceiver compliant with eUSB2, UART and I²C protocols.
The ST60A3G1 meets the requirements of mobile applications by virtue of its compactness, low-power operation, ease of use,
and its innovative architecture design for optimized system bill of materials.

TYPICAL APPLICATIONSPoint to point
Short range
No pairing

14

Up to 480 Mbps (eUSB2)

Ultra low power

Small footprint withintegrated antenna-20°C to 85°C

• Contactless test factory
automation and after sales
services• Life proof hole-lesspersonal devices• Contactless accessories• Contactless personalequipment docking hub
and data transfer

STPAY-MOBILE
The increasing need for trusted payment transactions has been driving the banking card market towards EMV chipand-pin
solutions. The STPay family offers a comprehensive range of Java OS-based banking solutions, covering awide range of
payment applications.
An end-to-end solution for smartphone OEMs, STPay-Mobile simplifies the deployment of digital wallets around the world.
Based on the ST54 single-chip solution, the all-in-one STPay-Mobile platform enables more convenient and more secureservices. It allows end consumers to use their smartphones as a card to pay, travel, unlock their car, and access restricted
areas.
STPay-Mobile brings the most advanced value proposition to smartphone OEMs and public transit agencies (PTAs) and iscompatible with over 50 PTAs worldwide. The solution is based on NFC technology powered by Snowball Technology, themarket leader in mobile ticketing platforms. It offers a one-stop-shop solution for fast and stable mobile transactions. STPayMobile eliminates the need for updates on PTA readers and back-end sites, and streamlines service delivery. It allows OEMs to
deploy mobile wallets across several platforms and devices, while ensuring long-term viability
STPay-Mobile provides OEMs with easy access to many token service provider (TSP) schemes, such as MasterCard and Visa.
This plug & play solution brings users an enhanced online, in-app, and in-store payment experience.

OEM
WalletPTA OEM
App

SDK

SDK

OEM server

On-Board platform

Android SW stack
Public Transit
Agency Server

OMAPI

NCI

NFC/eSE

STPay-Mobile

An ST cloud-based solution powered byPayment center

SP-TSM

Notification service

SDK/Plug-in
gateway

Perso Data
Preparation

Operation
Management

Multi-transit scheme

NFC Ant

TransitApplet*MOT (China)

ST54

MOC (China)(*) Transit applets are: Calypso,
CIPURSE™, MIFARE®, MOT, MOC

Flexible solution for platform development• On-premise (server-to-server connection)• SaaS (in-cloud hosting data center)

OEM
WalletBank OEM
App

SDK

SDK

Android SW stack
POS terminal

OMAPI

NCI

STPay-Mobile

OEM server

Detokenization /Tokenization

An ST cloud-based solution
SP-TSM

Notification service

Perso Data
Preparation

Operation
Management

SDK/Plug-in
gateway

Multi Payment scheme
Token Service Provider (TSPs)

NFC/eSE
Payment applets

MDESS

ST54
NFC Ant

Payment networks

VTS
Bank issuers

Authorization

15

CONNECTIVITY DOMAIN BILL OF MATERIAL
NFC/eSE
ST21NFC
ST54

16

60GHz

Protection

ST60A2

USBULC6-2M6

UI
Subsystem

The unique STMicroelectronics portfolio of MEMS sensors supports OEM and ODM in enabling all
the most advanced user interaction functionalities. Starting from accurate calculation of acceleration(linear or angular), velocity, and object position, MEMS sensors help recognize player actions as welldetect special conditions and movements like nearing phones to ears for call answering. ST has thebroadest offer of motion sensors, including accelerometers and 6-axis inertial measurement units(IMU).
Manufactured with our innovative MEMS silicon technologies, they all feature ultralow power
consumption and high accuracy and stability over time and temperature variations. The latest
applications also pressure sensors to add advanced capabilities to mobile phones and their linked
accessories, such as Wireless E911 location. To complete the offering on UI, ST includes smart reset
devices able to extend the functionality of existing phone buttons by enabling hidden features (hardreset, factory reset, etc). Together with partners, ST is able to offer a force sensor solution (ST offersa dedicated 8-channel standalone strain gauge controller) to emulate physical sensors and enable
full waterproof designs.

Analogvoltage out

Drive circuit - FSR1AD04*
MUX

PGA

Host controller
Application

ADC

OS
Proprietary touchalgorithm

Processor

Digitalforce data

DriverVBGA43 3.5x3.5x0.6mm thickness, 0.5mm pitch
Note *: Product not released on st.com. Please contact the marketing owner

17

UI SUBSYSTEM BLOCK DIAGRAM
UI domain
Smart reset
Force
sensor (*)

Protection
Haptic driver+ Actuator
Fingerprint

Inertial
sensorTemp sensor

Pressure
sensorPMIC

Vbat

MEMS SENSORS FUNCTIONALITIESST propose a wide range of MEMS sensors for the mobile and mobile accessories markets.

Low-power IMUs with Machine Learning Core
User interface

Optical image
stabilization

LSM6DSOX, LSM6DSV16X, LSMDSO16IS

Low power accelerometer
LIS2DW12

Altimeter

Activityrecognition

High-performance magnetometer
LIS2MDL

High-performance barometer
Gesture recognition(display wakeup)

LPS22HH
Shock detection

Waterproof pressure sensors
LPS27HHW, LPS28DFW

IMU
Inertial measurement units (IMU) combine an accelerometer and a gyroscope in a compact 6-axis system. The integration ofmultiple sensor outputs bring motion sensing systems to the level of accuracy required for the most demanding applications,such as enhanced gesture recognition, gaming, augmented reality, indoor navigation, and localization-based services. In its
latest generation of IMUs particularly suited to mobile applications, ST is embedding machine learning cores (MLC) for context
awareness. This enables accurate low-power edge processing that, together with the finite state machine (FSM), allows theprecise analysis and reconstruction of user activities and gestures.

18

Advanced Processing in the Edge
FSM and MLC 2.0; ASC(1) with ST libraries!

Low noise Accelerometer and Gyro
60ug /√Hz (All FS), 2.8mpds /√Hz

High Accuracy ODRWork at higher precision, when it is needed

Embedded Sensor Fusion
Low ower, low latency – high performance

Qvar™ with FSM & MLC processing
User interface (touch, long press, swipe)
Note 1: Adaptive System Configuration

PRESSURE SENSORSThe pressure sensors in mobile phones and accessories can be used in various use cases, such as to improve the activity
recognition tasks, ambient pressure monitoring, emergency E911 enablement, and automatic airplane mode.

Activity recognition

Vertical detection

Airplane mode detection

Vertical context detection
Stair count / Man fall down
Pose & fitness monitoring

Altitude monitoring
Indoor V position for E911
Ambient pressure monitor

Recognize take-off and landing
to set the radio/GPS signal

The ST absolute digital output barometer integrates the consolidated pressure sensor in the new fully molded package tofurther improve robustness, reliability, and moisture resistance, while reducing package thickness.
Waterproof pressure sensors are also available in the ST pressure sensor portfolio. They are resistant to chemicals likechlorine, bromine, and salt water, as well as soaps and detergents. The LPS28DFW is an ultracompact piezoresistive
waterproof pressure sensor, which functions as a digital output barometer. Thanks to the dual fullscale (FS) mode, the device
provides wide coverage of both altimeter and water depth (up to 30 meters).
Another winning feature of the LPS28DFW is its lower power consumption and lower RMS noise. The LPS28DFW is the rightpressure sensor for delivering the high level of functionality users want and expect in personal electronics and consumer
applications.

Water proofing package up to 10 bar
Wider full scale up to 4 bar
LPS27HHWLPS28DFW

Smallest 10 Bar WP Pressure sensor

Dual Full Scale WP Pressure Sensor(2.7 x 2.7 x 1.7 mm CLGA)(2.8 x 2.8 x 1.95 mm CLGA)

Ultra low power consumption
Package robust to mechanical stress

19

UI SUBSYSTEM BILL OF MATERIAL
Pressure

eCompassIMU
LSM6DSO/X

LPS22HH

LSM6DST/X

LPS22DF

LIS2MDLLIS2DW12LSM6DSR/X

LPS27HHW

H3LIS331DL

LSM6DSV16X

LPS28DFW

Smart Reset

Accelerometer

LSM6DSO16IS

Protection

Force Sensors

STM6519
STM6520
STM6524
STM6600

ESDZV5-1BF4
ESDZV5-1BV2

FSR1AD04*

STM6620
Note *: Please contact the local sales representative

TURNKEY SOLUTIONS FOR MEMS SENSORS• STEVAL-MKI109V3 (motherboard; professional MEMS tool)• STEVAL-MKI181V1 (LIS2MDL)• STEVAL-MKI192V1 (LPS22HH)• STEVAL-MKI224V1 (LPS22DF)• STEVAL-MKI213V1 (LPS27HHW)• STEVAL-MKI225A (LPS28DFW)• STEVAL-MKI196V1 (LSM6DSO)• STEVAL-MKI197V1 (LSM6DSOX)• STEVAL-MKI194V1 (LSM6DSR)• STEVAL-MKI195V1 (LSM6DSRX)
All adapter boards for standard DIL24 socket can be used with the following boards:• SensorTile.box STEVAL-MKSBOX1V1• STM32 Nucleo expansion X-NUCLEO-IKS01A3

FW BASKET• AlgoBuilderSuite

20

CameraSubsystem
Smartphones are able to take high quality
photos thanks to high-performance,
multi-megapixel sensors, as well as
devices that help compensate forshaking, adapt to ambient light levels,and optimize camera focus.
The latest smartphones integrate several
cameras, many of which require opticalstabilization. ST offers MEMS IMUs,
widely used for the OIS (optical image
stabilization). Many system topologies
can be adopted to enable OIS insmartphones, including those based on
STM32 MCUs.

Single 6x IMU for addressing multiple camera

Platform-based OIS

One Aux SPI

Main

OIS / EIS

MCU

6X

One main

I3C / SPI / I2C
#1

OIS

#2

Target value

U/I
OIS / EIS

I3C / SPI / I2COIS

Aux SPI
6X

Camera modules

Serial bus
option 1

Serial bus
option 2

OIS#1

UI / OIS / EISOIS / EIS

OIS

#2

OIS

#N

OIS controller
embedded on AP

AP
OIS

AP

#N

Supporting 3 OIS camera system by adding sub controllers

Supporting multiple OIS camera system by adding sub controllers
Camera modules

6X

One Aux SPI
One main

I3C / SPI / I2C

OIS master

6X#1

One mainTarget value
OIS sub 1

I3C / SPI / I2C

#2

AP

AP
OIS sub 2

One Aux SPI#3

Monitoring gyro raw data

Camera modules

OIS master#1

OIS sub 1#2

OIS sub 2#3

OIS sub 3#4

21

SMARTPHONE CAMERA SUBSYSTEM BLOCK DIAGRAMVCSEL +LDD

EEPROM

iToF sensor

Protection

LDO

ALS

Camera #1

Protection

ToF
Vbat
Lens
actuators

EEPROM

MCU
Lens
actuators

EEPROM

Camera #n

A+G

Protection

Back cameras domain
VCSEL +LDD

EEPROM

iToF sensor

Proximity

Protection

Application
processor

LDO
Vbat

EEPROM

CameraProtection

Front cameras domain
VCSEL +LDD

EEPROM

iToF sensor

Proximity

Protection

LDO
Vbat

EEPROM

GS camera

Protection

Face authentication

ALS AND TOF
Ambient light sensors (ALS) can be used with front and rear cameras to help to evaluate the light source, optimize the whitebalance, and compensate for light source flicker.
STMicroelectronics offers a family of high-accuracy and target-reflectance-independent Time-of-Flight (ToF) ranging sensors
as well as a new high-resolution 3D Time-of-Flight camera. ST pioneered highvolume production of fully integrated miniature
direct ToF products. The products feature a vertical cavity surface emission laser (VCSEL) logic implementing a ranging
algorithm, an array of single photon avalanche diode (SPAD) detectors, and an ultralow power ranging architecture that isperfectly suited to the assisting camera focus algorithm.
In addition to laser autofocus assist, FlightSense sensors can address other use cases, including touch-to-focus and scene
understanding enhancement.
The introduction of the high-resolution indirect ToF sensors enable exciting new use cases, including support for photographic
Bokeh effect as well as high-performance face identification to enable secure phone unlock and support secure payments.

22Key benefits of ToF
Laser
autofocus

Scene
understanding

Single-point AF assist
Touch-to-focus
Multiple camera selection

GestureKey benefits of GS sensors

Key benefits of ALS

Power efficient, high resolution,high sensitivity 3D Sensor​

Power efficient, high resolution,high sensitivity 3D Sensor​

Secure faceunlock forsecure payment

Userinteraction

Bokehassistance3D scanning

Secure faceunlock forsecure payment

Bokehassistance3D scanning

ToF
actif

ToF
hiddenEEPROM
STMicroelectronics has been the number one serial EEPROM supplier for over 10 years thanks to a complete range ofdensities and packages, which brings flexibility in design and enable reliable parameter management. The latest serial
EEPROMs designed with advanced technology offer the required features for storing image sensor parameters.

2D NEAR INFRARED CAMERA
2D near infrared camera for under-OLED face authentication and other user interactions.
STMicroelectronics has been the number supplier in camera sensors with global shutter pixels for 5 years.
The sensors are optimized for sharp and sensitive light sensing for wavelengths up to 940nm, enabling high performance
under-OLED sensing.
ST has the most compact global shutter sensors available, even while offering larger resolutions. The 644x604 version allows
tiny modules enabling excellent horizontal and vertical fields-of-view. The very low power management of ST sensors is key formobile usage.
The pixel size enables very thin camera modules and high near-IR sensitivity.
Through one of its partners, ST offers a turnkey solution for face authentication that is compatible with under-OLED
constraints.

VD55GO (0,4 Mpixels)• 644x604 pixels

Globalshutter
sensor• Only 2.6x2.5mm2 sensor• 2.6 µm BSI GS pixel, low noise• Auto-expo & defect correction• 4 immediate contexts• 4 multi purpose IO
strobe, PWM, Synch, GPIO, …

VD56G3 (1.5 Mpixels)• 1364x1124 pixels• Only 3.6x4.3mm2 sensor• 2.6µm BSI GS pixel, low noise• Auto-expo & defect correction• 4 immediate contexts• 8 multi purpose IO
strobe, PWM, Synch, GPIO, …

• Full Hardware Optical FlowLDO FOR SENSORS
Wide input voltage range from 1.1V to 5.5V, low dropout, low output noise, high PSRR, excellent stability, and very low
consumption make our LDOs ideal for mobiles, sensors, and wireless modules. The tiny chip-scale package (CSP) 0.65 x 0.65
mm outline ensures a compact circuit footprint with low impact on PCB size.

23

CAMERA SUBSYSTEM BILL OF MATERIAL
TOF

ALS

MCU

Protection

VL53L1CA
VL53L3CA

VD6283

ESDARF02-1BU2CK

VL53L4CA

VD6282

STM32G0

VL53L5CA

ECMF2-40A100N6
ECMF4-2450A60N10

VL53L8CA
VD55H1

MemoryLDO

GS Camera

LDLN025
M24C64X-FCU

LD59030

M24128X-FCU

LD57100

M24256X-F

LD56100

M24512X-FCU*

LD39130S

VD56G3
VD55G0LD56050
Note *: Product not released yet. Please contact the the local sales representative

TURNKEY SOLUTIONS• X-NUCLEO-6283A1 (6-channel ambient light sensor, with flicker extraction expansion board based on VD6283 for STM32
Nucleo)​• P-NUCLEO-53L4A2 (L53L4CX STM32 Nucleo pack with X-NUCLEO-53L4A2 expansion board and NUCLEO-F401RE
development board)• P-NUCLEO-53L3A2 (ranging sensor Nucleo pack based on VL53L3CX for STM32 Nucleo)​• P-NUCLEO-53L5A1 (expansion pack for VL53L5CX)​• X-NUCLEO-53L3A2 (ranging sensor expansion board based on VL53L3CX for STM32 Nucleo)​• X-NUCLEO-53L5A1 (expansion board for VL53L5CX)​• X-NUCLEO-53L4A2 (Time-of-Flight sensor with extended range measurement expansion board based on the VL53L4CX for
STM32 Nucleo)​• VL53L3CX-SATEL (breakout board with VL53L3CX detection ToF ranging sensor for easy integration in customer devices)​• VL53L5CX-SATEL (breakout boards for VL53L5CX)​FW BASKET• X-CUBE-ALS + STSW-IMG301 (ambient light sensor software for STM32Cube and GUI)
Note: Contact your sales representative to access to our latest solutions optimized for wireless applications

24

Display
Subsystem
The main STMicroelectronics devices in the display domain are AMOLED PMIC and touch
controllers.
The fully integrated power-management ICs (PMICs) for AMOLED displays combine a low quiescenta low quiescent current and enhanced flexibility to extend the battery runtime of portable devices.
The trademark FingerTip touch controllers for both small and large screens provide an optimal mixof ultralow power, small size, and low external part count.
The proprietary ST low-noise capacitive analog front-end ensures very low intrinsic noise, ensuring
the high sensitivity required in new AMOLED displays. The innovative node compensation hardware
provides consistent touch performance across the display panel, including curved and trench areas.

AMBIENT LIGHT SENSOR BLOCK DIAGRAM
ALS are used to dim the display backlight (photopic lux level), but also to adapt the display tone based on corelated color
temperature (CCT) measurement. Light flicker detection is also available for the smartphone corner camera.

LD0
Vbat

ALS

AMOLED
display driver

Protection
EEPROMAMOLED
DC-DC
Vbat
Touch
controller
Haptic driver

Display domain

25

DISPLAY SUBSYSTEM BILL OF MATERIALEEPROM

Touch controller
Fingertip(available in BGA84,
BGA87, BGA 117)

Protection

AMOLED driver

STMP30QR

M24C64X-FCU
M24128X-FCU
M24256X-F
M24512X-FCU (*)

Ambient light sensor

LDO

VD6283

LDLN025
LD59030
LD57100
LD56100
LD39130S
LD56050

ECMF2-40A100N6
ECMF4-40A100N10

Note *: Product not released yet. Please contact the the local sales representative

AMOLED PMICWith a 2.9V to 4.8V input-voltage range, the STMP30 PMIC contains three integrated DC-DC converters to provide all thepower rails needed for AMOLED displays in smartphones and other portable devices. The voltage can be set between 4.6V
and 5.0V to optimize the display brightness for lowest power consumption and best visibility under any conditions. The 5.0V
maximum setting allows high-brightness mode (HBM) for best viewing in bright outdoor lighting.
The remaining two programmable voltages (-0.8V to -6.6V, and 5.5V to 7.9V) are programmed using single-wire (S-Wire)
protocol through external pins. The PMIC also receives S-Wire messages to operate the AMOLED in always-on display (AOD)
mode, which improves user convenience by showing information on-screen continuously at very low power.
The PMIC has a true shutdown mode that helps maximize power savings, as well as safety features such as thermal
protection, input undervoltage lockout, and soft-start with inrush current limiting. In addition, the high- voltage outputs feature
fast-discharge circuitry and short-circuit protection.
Parameter
Vin range

2.9V – 4.8V

Vout1 range

4.6V – 5V

Vout2 range-6.6V to -0.8V

Current capability Vout1-Vout2
Vout3 range
Current capability Vout3
Accuracy including temp condition
Package
Note *: Product not released on st.com. Please contact the marketing owner

26

STMP30QR*

550mA
5.5V to 7.9V
150mA
Vout1: +/-0.8%
Vout2: +/- 60mV
Vout3: +/- 1%
WCSP25 2.1 x 2.1mm

TOUCH CONTROLLER
The industry-proven ST FingerTip touchscreen controller technology enables advanced multitouch user interfaces in a singlechip solution with high and uniform sensitivity on all panels, including curved screen areas and new AMOLED displays, making
it perfectly suited for the latest designs.
FingerTip supports advanced features thanks to multimode sensing technology. The water rejection algorithm can detect wateron the top of the screen and the device can still track one finger moving in the water without false touching or line breaking.
The device supports multifinger glove operation and small passive stylus.
The device also supports all types of HSYNC and VSYNC modes, which enables touch sampling to be synchronized with thedisplay SYNC signal. This ensures it can even work with quad high-definition displays.
The controller embeds a powerful 32-bit ARM M3 core with flash that is capable of providing a high level of overall touch
performance in terms of noise rejection, response time, and power consumption.

Thin bezel
and foldable smartphone

High display
rate / resolution

Hovering and gesturerecognition

Flexible for foldable phones

Low latency touch.
240 / 288 Hz report rate

Rotate, scale, pan, swipe,
and more…

Proximity sensing

Work with glove and water

Active stylus

IR-Less proximity detection

Support water rejection &glove sensing

Support both USI & WGP
active pen protocol

KEY FEATURE• True 10-finger multi touch• High SNR, hign noise
immunity• Low latency, high reportrate• Support water and glovemode• Wake up gesture• Mutual, self & proximity
scanning• Support active pen• Ultra-low power• I2C SPI I3C communication27

Memory/SIM
Subsystem
ST provides a full range of NFC-, eSEand GSMA-certified eSIM products
and solutions to address secure mobiletransactions applications. Previously
offered separately, they are now available
as fully integrated solutions combining an
NFC controller, eSE, and eSIM, thereby
enabling new design opportunities.
• ST33 SIM, eSIM, and eSE
ST33 for eSIM and eSE applications
ST33 secure microcontrollers meet theadvanced security and performancerequirements for secure applications,
including embedded SIM and embedded
NFC secure elements with a large user
flash memory capability.
An eSIM is a surface-mounted device soldered directly on the PCB,
which enables OEMs to design smaller and thinner mobile devices andend-users to subscribe to the mobile network operator of their choice.
Remote provisioning of the SIM application inside the eSIM device
is ensured by subscription management systems compliant with the
GSMA Remote SIM Provisioning specification.

MEMORY/SIM SUBSYSTEM BILL OF MATERIALeSIM

SIM Protection

ST33

USBULC6-2M6*
ESDAVLC5-4BX4Note *: Full production 2023

MEMORY/SIM SUBSYSTEM BLOCK DIAGRAM
Flash memory

SIM

eSIM

Protection

Memory/Sim Domain
28

KEY FEATURES ST33
• Up to 2 Mbytes Flash• Delivered in multiple
packages (WLCSP, MFF2,
DFN8)• GSMA SAS-UP certified
flow• EMVCo, CC EAL5+, MTPS
certifiedAudioSubsystem
Audio functions are predominately
integrated into main host processor.
The ST offering is devoted to protection
devices for connecting external cabledearphones and microphones.

AUDIO SUBSYSTEM BLOCK DIAGRAM
PMIC

Vbat
Protection

Audio codec

PA

Protection

PA

Protection

Audio Domain

MEMORY/SIM BILL OF MATERIAL
Protection
ESDZV5-1BF4
ESDZV5-1BV2

29

LDO and protections
in Smartphones
In smartphone applications, LDO andprotection devices are widely used inseveral subsystems.
ST offers a complete portfolio of highperformance low-dropout regulators withstate-of-the-art figures on the key meritparameters, all fitting into the smallest
packages available. The ultrasmall,high-performance LDOs are particularly
suitable for the latest generation of
portable devices, such as smartphones.

Portable devices are small integrated devices using ESD-sensitive ICs with thin lithography
technologies, in close contact with electrostatic charges that can develop on a human in low relative
humidity. The risk of ESD damage is therefore very high.
The complete ST protection and filtering range with integrated or standalone solutions offers design
flexibility while allowing space saving and high system immunity.
The one-stop-shop LDO’s supplier addressing high mega pixels cameras
LD39130S
LD56050
DFN6 – 1.2 x 1.2

Sensor
Front camera

LD57100
Flip-Chip6 – 0.8 x 1.2

LD56100
DFN8 – 1.2 x 1.6

Rear camera
SD memory
Wi-Fi, GPS,
bluetooth
Noice sensitive loads
e.g. Audio Hi-Fi

30

LDO

Benefits

Flip-Chip4
DFN6 – 1.2 x 1.3

LDLN025• Ultra Low Noise• Very High PSRR LDOs for camera AVDD and RF

LD56020

LD59030• 300mA LDO ultra low VDROP• Good cost-performance trade-off

LD57100• 1A Ultra low dropout LDO with Bias for camera DVDD

DFN4 – 1 x 1

LD56100• 1 A very low dropout fast transient ultra-low noise

LDLN025

LD39130S• 300 mA with very low quiescent• Auto green mode function allows ultra low

Flip-Chip4

LD59030

DFN4 – 1 x 1
Flip-Chip4

regulator

consumption at light load

LD56050• 500 mA ultra low VDROP with bias supply input

LD56020• 200mA, low input voltage, low Iq, High PSRRRPROTECTION AND FILTERING DEVICES IN SMARTPHONERFESDZX051-1BF4

CameraBattery
ESDA25P35-1U1M

ESDARF02-1BU2CKECMF2-40A100N6​
ECMF4-2450A60N10

Microphone

UI/Side key

ESDZV5-1BF4
ESDZV5-1BV2

USB3
Vbus: ESDA25P35-1U1M
Data: ESDZX051-2BU3
CC: ESDA17P20-1F2

ESDZV5-1BF4
ESDZV5-1BV2

USB3 (integrated solution)
TCPP01-M12

SIM
USBULC6-2M6ESDAVLC5-4BX4ESDARF02-1BU2CK

Display
ECMF2-40A100N6​
ECMF4-40A100N10

31

For more information on ST products and solutions, visit www.st.com

Order code: BR2301SPPLATFORM© STMicroelectronics - January 2023 - Printed in the United Kingdom - All rights reserved
ST and the ST logo are registered and/or unregistered trademarks of STMicroelectronics International NV or
its affiliates in the EU and/or elsewhere. In particular, ST and the ST logo are Registered in the US Patent andTrademark Office. For additional information about ST trademarks, please refer to www.st.com/trademarks.
All other product or service names are the property of their respective owners.