Safety Notice

Read the “Safety Notice” carefully before using the product, and use it properly.
The levels of the matters on which safety notice is given are classified into “Danger”
and “Caution” herein, each of which has the following meaning.

Danger :Mishandling may cause death or serious injury.

Caution :Mishandling may cause intermediate bodily injury, minor injury or damage
to property.

Note that the matter described with

Cautionmay cause serious results

depending on the circumstances.
Each of the above describes important contents, which must strictly be observed.
Matters requiring special attention are given below, which are also indicated by theabove mark in the text of this manual.

Danger•Do not touch live parts such as terminals etc. while electricity is on.
electric shock.

•

Mounting, dismantling, wiring work, maintenance and inspection must be made with electric power supply
shut off without fail.
Work while power is activated may cause electric shock, a malfunction or a fault.
Emergency stop circuit, interlock circuit etc. must be configured outside of the PC.
Failure to observe this may result in breakage in machines or accidents caused by a fault of the PC.
Batteries must not be connected with +- placed backward, charged, dismantled, pressurized or distorted,
thrown into fire, or short-circuited.
Failure to observe this may cause bursting or set the batteries on fire.

•
•

•
•

Failure to observe this may cause

If any distortion, leakage of liquid or other abnormality has been found in batteries, do not use them.
Failure to observe this may cause bursting or set the batteries on fire.
Never make the FG terminal open while short-circuiting LG - FG. (Ground the wire without fail.)
Failure to observe this may cause electric shock.

1

Safety Notice

Caution
•
•
•
•
•

•
•
•
•
•
•
•
•

•
•
•
•
•
•

•
•
•
•
•
•
•

Do not use an article damaged or distorted at the time of unpacking. Failure to observe this may cause a fire, amalfunction or a fault.
Do not give shock to the product by letting it drop or fall down. Failure to observe this may cause breakage or a fault of
the product.
The product must be installed in accordance with the contents described in the operating instructions and manuals.
Any improper installation may cause a drop, malfunction or fault of the product.
It must be used with the rated voltage and current that are indicated in the operating instructions and manuals.
Its use with values other than the rated ones may cause a fire, a malfunction or a fault.
It must be used (stored) under the environment that is indicated in the operating instructions and manuals.
Its use (storage) under environments of high temperatures, high humidity, condensation, dusts, corrosive gasses, oil,organic solvent, and in particular of great vibrations and shock may be the cause of electric shock, a fire, a malfunction
or a fault at the time of use.
Electric wires of a size fit for the voltage to be applied and the current to be input must be selected and must be
tightened with specified torque.
Any improper wiring or tightening may cause a fire or a drop, a malfunction or a fault of the product.
Construction work must be done so that no foreign matter such as trash, debris of electric wires, iron powder etc. gets
into the inside of equipment.
Failure to observe this may cause a fire, an accident, a malfunction or a fault of the product.
After wiring is over, trash prevention paper in modules/units must be removed without fail.
Operation without removing the trash prevention paper may cause a fire, an accident, a malfunction or a fault of the
product.
Grounding terminals must be grounded without fail. Failure to ground them may cause electric shock or amalfunction.
Screws for terminals and screws for installation must be checked at regular intervals to ensure that they are securely
tightened.
Their use while in a loosened state may cause a fire or a malfunction.
Unused connectors must be covered with the connector covers enclosed.
Failure to observe this may cause a malfunction or a fault.
Terminal blocks must be covered with terminal covers without fail. Failure to observe this may cause electric shock or a
fire.
Change of a program, forced output, start, stop etc. while in operation must be made after making sure that safety has
been secured.
Failure to observe this may cause breakage in machines or an accident as a result of functioning of machines by
misoperation.
Loader connectors must be inserted in the proper direction. Failure to observe this may cause a malfunction.
Before making contact with the PC, static electricity retained on the human body etc. must be discharged by touching
grounded metals etc. Excessive static electricity may cause a malfunction or a fault.
Wiring must securely be made in accordance with the contents described in the operating instructions and manuals.
Erroneous wiring may cause a fire, an accident or a fault.
When a plug is taken out from a socket, do not pull the cord.
Failure to observe this may cause a fire or a fault as a result of breakage in wires.
Do not change the system (attaching or detaching I/O modules etc.) with power turned on. Change in the system
while being activated may cause a malfunction or a fault.
Repairing of the product must never be made at the site. If repairing is needed, ask our company and request of
repair should be made.
Also, replacement of batteries must be made paying full attention not to cause erroneous connections of connectors,
etc.
Failure to observe this may cause a fire, an accident or a fault.
When cleaning, power must be turned off, and then use towels wet with warm water, etc.
Use of thinner or the like, or other organic solvent my cause a melting on the surface of equipment or change in color.
Do not modify or dismantle the product. Failure to observe this may cause a fault.
When discarding the product, it should be handled as industrial waste.
The product described in this manual is not designed or manufactured intending a use in equipment or a system that
may affect human life.
If the product described in this manual is considered to be used for special uses such as for controlling atomic energy,
for aviation and aerospace, for medicine, for transportation equipment, for vehicles for travelling, or for systems ofthese, etc., please consult it with the contact point of our sales.
If the product described in this manual is applied to equipment that is expected to affect human life or generate serious
losses as a result of a fault of the product, safety devices must be installed without fail.
External power supply (DC 24V power supply etc.) to be connected with DC I/O must use power supply having
strengthened insulation from AC-based power supply. (Use of power supply in compliance with EN60950 isrecommended.) Failure to observe this may cause an accident or a fault.

2

Revision History* Manual number is indicated at the right side of thebottom of the cover sheet of this manual.
Printed date
May, 2001* Manual number
IGJ060A

Contents of revision
Printing of the First Edition(Temporary Edition)

3

4

Table of Contents

Preface
Safety Notice
Revision History
Table of Contents
Chapter 1 Outline ..............................................................................................1-1
1-1 Model system ............................................................................................1-1
1-1-1
1-1-2
1-1-3
1-1-4
1-1-5
1-1-6
1-1-7
1-1-8
1-1-9
1-1-101-1-11

CPU module ........................................................................................... 1-1
Baseboard .............................................................................................. 1-1
Power supply module ............................................................................. 1-2
SX bus extension cable .......................................................................... 1-2
Auxiliaries and others ............................................................................. 1-2
Digital input module ................................................................................ 1-3
Digital output module .............................................................................. 1-3
Digital I/O mixed module......................................................................... 1-4
Analog module........................................................................................ 1-4
Function module ..................................................................................... 1-4
Communications module ........................................................................ 1-5

1-2 Model list ...................................................................................................1-6
1-2-1

Hardware................................................................................................ 1-6

Chapter 2 System Configuration......................................................................2-1
2-1 Outline of system configuration ..............................................................2-1
2-1-1
2-1-2
2-1-3
2-1-4
2-1-5

Placement in CIM stages ........................................................................ 2-1
Outline of the system configuration of µGPCsx....................................... 2-2
Number of units connected to each module ............................................ 2-3
Mounting each module onto the baseboard ............................................ 2-5
Connection of TDsxEditor....................................................................... 2-9

2-2 Various system configurations..............................................................2-11
2-2-1
2-2-2
2-2-3
2-2-4
2-2-5
2-2-6
2-2-7
2-2-8
2-2-9
2-2-10Individual system .................................................................................. 2-12
SX bus increasing system..................................................................... 2-13
SX bus T-branch increasing system...................................................... 2-14
SX bus optical increasing system ......................................................... 2-15
Allocation of I/O addresses ................................................................... 2-18
Multi-CPU system................................................................................. 2-19
Redundant system of CPU ................................................................... 2-20
FL-net (OPCN-2) system ...................................................................... 2-22
OPCN-1 system.................................................................................... 2-23
DeviceNet system................................................................................. 2-24

5

Table of Contents

Chapter 3 Specifications...................................................................................3-1
3-1 General Specifications .............................................................................3-1
3-2 Power Supply Module Specifications......................................................3-2
3-2-1
3-2-2

Power supply specifications.................................................................... 3-2
Name of each part and its function ......................................................... 3-3

3-3 CPU Module Specifications......................................................................3-4
3-3-1
3-3-2

Performance specifications list................................................................ 3-4
Name of each part .................................................................................. 3-5

3-4 Baseboard Specifications ........................................................................3-8
3-4-1
3-4-2

Specifications list .................................................................................... 3-8
Name of each part and its function ......................................................... 3-9

3-5 Input and Output Specifications............................................................3-10
3-5-1
3-5-2
3-5-3
3-5-4
3-5-5
3-5-6

Definition of sync, source...................................................................... 3-10
Life of relay........................................................................................... 3-12
Individual specifications of the digital input module ............................... 3-20
Individual specifications of the digital output module ............................. 3-36
Individual specifications of the digital I/O mixed module........................ 3-62
Individual specifications of the Analog I/O module ................................ 3-70

3-6 Communications Module Specifications ..............................................3-76
3-7 Positioning Module Specifications........................................................3-85
3-8 Function Module Specifications ............................................................3-91
3-9 Auxiliaries and Others ............................................................................3-93
3-10 Outer Specifications ...............................................................................3-96
Chapter 4 Installation and Wiring ....................................................................4-1
4-1 Handling Notice.........................................................................................4-1
4-2 Before Installation.....................................................................................4-2
4-2-1
4-2-2

Checking the commodities...................................................................... 4-2
Environment to install the control panel .................................................. 4-2

4-3 Installation onto the Control Panel..........................................................4-3
4-3-1
4-3-2
4-3-3
4-3-4
4-3-5

Direct installation onto the control panel ................................................. 4-3
Installation onto the DIN rail.................................................................... 4-4
Installation of each module onto the base board ..................................... 4-6
Installation height of the base board + module........................................ 4-7
Installation position of the PC.................................................................. 4-8

4-4 Wiring.........................................................................................................4-9
4-4-1

6

Matters requiring attention at the time of wiring work .............................. 4-9

Table of Contents

4-4-2
4-4-3
4-4-4
4-4-5
4-4-6
4-4-7
4-4-8

Wiring of the power supply.................................................................... 4-11
Input and output wiring ......................................................................... 4-14
Wiring of the SX bus increasing cable................................................... 4-15
Wiring of the power supply part of the SX bus optical converter............ 4-16
Countermeasures against noise in the external wiring .......................... 4-17
Emergency stop circuit and interlock circuit .......................................... 4-18
Short circuit protection of the digital output module............................... 4-19

Chapter 5 Maintenance/Inspection ..................................................................5-1
5-1 General Matters of Inspection..................................................................5-1
5-1-1
5-1-2
5-1-3

Interval of inspections ............................................................................. 5-1
Matters requiring attention at the time of using the products ................... 5-1
Inspection items...................................................................................... 5-2

5-2 Battery Replacement ................................................................................5-3

7

Chapter 1 Outline

Chapter 1 Outline

Chapter 1 Outline
1-1 Model system ............................................................................................1-1
1-1-1
1-1-2
1-1-3
1-1-4
1-1-5
1-1-6
1-1-7

CPU module ........................................................................................... 1-1
Baseboard .............................................................................................. 1-1
Power supply module ............................................................................. 1-2
SX bus extension cable .......................................................................... 1-2
Auxiliaries and others ............................................................................. 1-2
Digital input module ................................................................................ 1-3
Digital output module(Common part) ....................................................................................... 1-3
(1)
(2)
(3)

1-1-8
1-1-9
1-1-101-1-11

Ry output module(refer to above for .) ........................1-3
Tr output module(refer to above for .) ........................1-3
SSR output module(refer to above for .) ........................1-3

Digital I/O mixed module......................................................................... 1-4
Analog module........................................................................................ 1-4
Function module ..................................................................................... 1-4
Communications module ........................................................................ 1-5

1-2 Model list ...................................................................................................1-6
1-2-1

Hardware................................................................................................ 1-6

Chapter 1 Outline

Chapter 1 Outline

Table of contents

Chapter 1 Outline

Model system<Code classification according to the module type>NP

Code representing the specifications of each module (refer to each module)
SymbolSymbol12Module type codeA

Analog module

B

Baseboard

Module, unit

C

Cable

Unit to be installed
separately

F

Function module

H

Programming tool

Module mode code4

Software package

LCommunications module

8

Auxiliaries and others

PS

CPU module
Power supply module

N

Software package, extension FB

V
W

Auxiliaries and others
I/O mixed module

X

Input module

Y

Output module

TD: Power supply, CPU, base module
NP: Modules other than above

1-1-1CPU module
TD1P

SymbolSymbolS

CPU type
CPU

Number of program steps

117R
74

Capacity:
Capacity:

Built-in 117 K steps
Built-in 74 K steps

32

Capacity:

Built-in 32 K steps

1-1-2Baseboard
TD1B

Symbol*Number of slots:

6

Number of slots:

8

Number of slots:
Number of slots:

11
13

SymbolBase typeP

Processor bus extension type

11
13

S

Standard type

*

Note)

06
08

Note)

Number of slots

Processor bus extension is available inthe 13-slot product only.

Refer to “3-4 Baseboard specifications” for the positions of the slots that havethe processor bus.

1-1

Chapter 1 Outline

1-1 Model system

Chapter 1 Outline

Model system

Chapter 1 Outline

1-1-3Power supply module
TD1S-

SymbolSymbol Power supply specifications
2

AC100/200 V

4

DC 24 V9

AC 100 V (Under development)

Number of occupied slots

2

2 Slots

1

1 Slot1-1-4SX bus extension cable
NP1C-

SymbolCable length

P3
P6

Cable length: 300 mm
Cable length: 600 mm

P8

Cable length: 800 mm

02

Cable length: 2,000 mm

05
10

Cable length: 5,000 mm
Cable length: 10,000 mm

25

Cable length: 25,000 mm

1-1-5Auxiliaries and others
NP8

Symbol

1-2

Type

B-BP

SX bus loop back plug

B-TB

SX bus T-branch unit

X-SW

Trial input switch, 16 pcs.

P-BT

Battery for data backup

P-KY
V-JP1CC

Operation mode switching
key for CPU
OPCN-1 connector

V-JP1RT

OPCN-1 terminal resistor

Symbol

Type

V-CN1

External connector forconnector type module(soldering type)

B-ST

Fixing hardware for baseboard(for installation onto DIN rail)Chapter 1 Outline

Model system

-

NP1X

Detailed
specifications

SymbolInput voltage
specifications

SymbolNumber of input
pointsSymbol02

DC5-12 V
DC12-24 V
DC24 V08

Number of input points:8

16

Number of input points: 16

04
06

32

Number of input points: 32

10

AC 100 V

64

Number of input points: 64

11

AC 200 V

A
W

High-speed
input
No polarity

Chapter 1 Outline

1-1-6Digital input module

1-1-7Digital output module (Common part)-

NP1Y

Code representing the detailed specifications of each output type: inaccordance with (1) through (3).
SymbolNumber of output points

R
S

06
08

Number of output points:
Number of output points:

T

Transistor (Tr) sync output

U

Transistor (Tr) source output

16

Number of output points: 16

32

Number of output points: 32

64

Number of output points: 64

Symbol(1).)

Common specifications

04

Common for 4 points

08

Common for 8 points

Tr output module (refer to above for
NP1Y

Relay (Ry) output
Triac (SSR) output

R
Symbol(2)

6
8

Ry output module (refer to above for
NP1Y

Output classification

T/U

.)

-

SymbolSymbolSymbol09(3)

Output voltage

DC12-24 V

P1
P6

Current capacity: 0.1 A

02

Current capacity: 2 A

SSR output module (refer to above for
NP1Y

Output current
capacityA

Detailed
specifications
Built-in pulse
set output

Current capacity: 0.6 A

.)

S

1-3

Chapter 1 Outline

Model system

Chapter 1 Outline

1-1-8Digital I/O mixed module-

NP1W

SymbolSymbolSymbol16
32

Number of I/OpointsDI: 8 points+DO:
8 points
DI: 16 points+DO:
16 points

06

Input voltage
specifications

T

DC 24 VU

Sync/sourceclassification
Source input +sync output
Sync input +source output

1-1-9Analog module
NP1A

SymbolI/O - number of channels

Multi-range

X04

10-bit resolution input: 4 channels

PT

X08

10-bit resolution input: 8 channels

Temperature
measuring resistor

XH4

TC

Thermocouple

YO2

14-bit resolution high-speed input:
4 channels
10-bit resolution output: 2 channels

YH2

14-bit resolution output: 2 channels

Symbol1-1-10I/O specifications

MR

Function module• Function module related
unit

NP1F

1-4

NP2F

SymbolType

SymbolType

HC2High-speed counter: 2 channels/500 kHz

LEVSignal converter

HC8High-speed counter: 8 channels/50 kHz

MA2

Analog combination: 2 channels

MP2

Pulse set combination: 2 channels

HP2

Pulse set output: 2 channels/250 kHz

MM1Memory card interface module: 1 channel

PC2
DMY

PC card interface module: 2 channels
Dummy module

Chapter 1 Outline

Model system

Communications module

NP1L

NP2L

SymbolType

JP1

OPCN-1 master module:

RJ1

OPCN-1 interface module

RS1

Versatile communications module(RS-232C/RS-485):
1 channel
each

RS2

Versatile communications module(RS-232C):
1 channel
Versatile communications module(RS-485):
1 channel

RS4

1 channel

FL1

FL-net (OPCN-2) module:

1 channel

DN1

DeviceNet master module:

1 channel

OL1

SX bus optical link module

SymbolType

OE1

SX bus opticalconverter

1-5

Chapter 1 Outline

1-1-11

Chapter 1 Outline

Model list

Chapter 1 Outline

1-2 Model list
1-2-1Hardware
DescriptionHigh
performance
CPU module

Accessories

Model

Outlined specifications

TD1PS-32

Basic instruction: 20 ns

Operating instructions

1

Program memory: 32 K steps

Battery for data backup

1 set

Number of I/O control points: maximum
8192

SX bus loop back plug2

Basic instruction: 20 ns

CPU mode switching key

1

Program memory: 74 K steps

Screwdriver

1

Operating instructions

1

Baseboard installation
hardware1

Station number setting seal

1

TD1PS-74

Description

No.

Number of I/O control points: maximum
8192
TD1BP-13

Baseboard

Power supply
module

SX busincreasing
cable

Number of slots: 13

for 10 slots ofprocessor bus

TD1BS-06

Number of slots: 6

for 4 slots ofprocessor bus

TD1BS-08

Number of slots: 8

for 3 slots ofprocessor bus

TD1BS-11

Number of slots: 11

for 3 slots ofprocessor bus

TD1BS-13

Number of slots: 13

for 3 slots ofprocessor bus

TD1S-22

AC 100/200 V input power supply

Operating instructions

1

Output capacity 35 W (2 slots wide)

Connector for ALM contact

1 set

Short-circuiting strip forswitching power supply
Note)
voltage

1

TD1S-42

LG-FG short-circuiting strip

1

DC 24 V input power supply

Operating instructions

1

Output capacity 35 W (2 slots wide)

Connector for ALM contact

1 set

LG-FG short-circuiting strip

1

TD1S-91

AC 100 V input power supply
Output capacity 12 W (1 slot wide)

Operating instructions

1

NP1C-P3

Cable length: 300 mm

Operating instructions-

NP1C-P6

Cable length: 600 mm

NP1C-P8

Cable length: 800 mm

NP1C-02

Cable length: 2,000 mm

NP1C-05

Cable length: 5,000 mm

NP1C-10

Cable length: 10,000 mm

NP1C-25

Cable length: 25,000 mm(Continued on the next page)Note)

The short-circuiting strip for switching power supply voltage is delivered in a state of being installed
onto the module.

1-6Chapter 1 Outline

Model list

Auxiliaries and others

Description

Model

Outlined specifications

SX bus loop
back plug
SX bus T-branchunit

NP8B-BPNP8B-TBFor SX bus loop back (standard
accessory for CPU module)
For connecting SX bus T-branch

Trial input switch

NP8X-SW

16-point trial input switch

Battery for data
backup

NP8P-BT

Mode switching
key for CPU
I/O connector

NP8P-KY

Fixing hardwarefor DIN rail
Digital input module

NP8B-ST

NP8V-CN

NP1X1606-W
NP1X3206-W
NP1X6406-W
NP1X3202-W

NP1X0810

NP1X1610

NP1X0811

NP1X3206-A

Lithium primary battery(5 years at 25°C)(standard accessory for CPU module)
For switching CPU operation mode
(standard accessory for CPU module)
I/O, connector for positioning module,
soldering type socket,
connector cover (Manufactured by
Fujitsu)
For installing DIN rail (1 set consisting of
2 pcs.)DC 24 V, 16 points, 7 mA,
1 - 100 ms variable, screw terminal typeDC 24 V, 32 points, 4 mA,
1 - 100 ms variable, connector typeDC 24 V, 64 points, 4 mA,
1 - 100 ms variable, connector type
DC 5V - 12 V, 32 points,
3 mA (5 V), 9 mA (12 V),
1 - 100 ms variable, connector typeAC 100/120 V, 8 points, 10 mA,
10 ms
screw terminal typeAC 100/120 V, 16 points, 10 mA,
10 ms
screw terminal typeAC 200/240 V, 8 points, 10 mA,
10 ms
screw terminal typeDC 24V, 32 points, 4 mA, connector typehigh-speed input (with pulse catch)
port 1 - 8: 20 µs (without filter)
port 9 - 32: 100 µs (without filter)
0.1 ms - 100 ms variable

Accessories
Description

No.

-

-

Operating instructions
SX bus loop back plug
Cable for power supply
connection
Cable for power supply
interruption
Seal for indication ofeffective period

1
1
1

-

-

-

1 set

-

-

Operating instructions

1

Terminal cover1

Terminal name entry
sheet

1

1
1 set

Note 1)
Note 2)(Continued on the next page)
Note 1)

Terminal cover and terminal name entry sheet are supplied together only with the screw terminal type module.

Note 2)Connector for external connection is not supplied with the connector type module.
See “4-4-3 Input and output wiring” for applicable connectors.

1-7

Chapter 1 Outline(1-2-1 Model list, continued)

Chapter 1 Outline

Model list

Chapter 1 Outline(1-2-1 Model list, continued)
Accessories

Description

Model

Outlined specifications

Digital output
module

NP1Y08T0902

Tr sync, DC 12 - 24 V, 8 points, 2.4 A/point,
8 A/common, screw terminal typeTr sync, DC 12 - 24 V, 16 points, 0.6 A/point,
4 A/common, screw terminal typeTr sync, DC 12 - 24 V, 32 points, 0.12 A/point,
3.2 A/common, connector typeTr sync, DC 12 - 24 V, 32 points, 0.12 A/point,
3.2 A/common, connector type, pulse set output
function
Tr sync, DC 12 - 24 V, 64 points, 0.12 A/point,
3.2 A/common connector type
Tr source, DC 12 - 24 V, 8 points, 2.4 A/point,
8 A/common, screw terminal type
Tr source, DC 12 - 24 V, 16 points, 0.6 A/point,
4 A/common, screw terminal type
Tr source, DC 12 - 24 V, 32 points, 0.12 A/point,
3.2 A/common, connector type
Tr source, DC 12 - 24 V, 64 points, 0.12 A/point,
3.2 A/common, connector type
Triac, AC 100/240 V, 6 points, 2.2 A/point,
4 A/common, screw terminal type
Triac, AC 100/240 V, 8 points, 2.2 A/point,
all points independent, screw terminal type
Ry, DC 110 V, AC 240 V, 8 points,
DC 30 V/AC 264 V, 4 A/common, screw terminal type
Ry, DC 110 V, AC 240 V, 16 points,
DC 30 V/AC 264 V, 2.2A/point, 8 A/common, screw
terminal typeDC 24 V, 8 points source input,
Tr sync, DC 12 - 24 V, 8 points output, screw terminal
type
DC 24 V, 8 points source input,
Tr source, DC 12 - 24 V, 8 points output, screw
terminal typeDC 24 V, 16 points source input,
Tr sync, DC 12 - 24 V, 16 points output, connector
type
DC 24 V, 16 points sync input,
Tr source, DC 12 - 24 V, 16 points output, connector
typeHigh-speed multi-range input 4 channels, resolution
14 bits

NP1Y16T09P6
NP1Y32T09P1
NP1Y32T09P1-A

NP1Y64T09P1
NP1Y08U0902
NP1Y16U09P6
NP1Y32U09P1
NP1Y64U09P1
NP1Y06S
NP1Y08S
NP1Y08R-04
NP1Y16R-08

Digital I/O
mixed module

NP1W1606T

NP1W1606U

NP1W3206T

NP1W3206U

Analog input
moduleNP1AXH4-MR

NP1AX04-MR
NP1AX08-MR

Standard multi-range input 4 channels, resolution 10
bits
Standard multi-range input 8 channels, resolution 10
bits

NP1AXH4-PT

Platinum temperature measuring resistor input 4channels

NP1AXH4-TC

Thermocouple input 4 channels

Description

No.

Operating
instructions
Terminal cover1

Terminal nameentry sheet

11Note 1)
Note 2)

Operating
instructions

1

Terminal cover1

Terminal nameentry sheet

1Note 1)
Note 2)

Operating
instructions
Terminal cover
Terminal nameentry sheet
Operating
instructions
Terminal cover
Terminal nameentry sheet
Resistor for
current input
Operating
instructions
Terminal coverOperating
instructions
Terminal cover

1
1
1
1
1
1
8
1
1
1
1

(Continued on the next page)
Note 1)
Note 2)

Terminal cover and terminal name entry sheet are supplied together only with the screw terminal type module.
Connector for external connection is not supplied with the connector type module.
See “4-4-3 Input and output wiring” for applicable connectors.

1-8Chapter 1 Outline

Model list

Model

Outlined specifications

Analog output module

NP1AYH2-MR

Function module

Description

DescriptionNo.

High-speed multi-range output 2channels,
resolution 14 bits

Operating instructions

1

Terminal cover

1

NP1AY02-MR

Standard multi-range input 2 channels,
resolution 10 bits

Terminal name entry
sheet

1

High-speed
counter module

NP1F-HC2

500 kHz × 2 channels, 90 degrees phasedifference 2-phase signal,
pulse+direction signal, forward pulse +reverse pulse

Operating instructions

1

Analogcombination
positioning
moduleNP1F-MA22-axis analog instruction positioning
combination module
output +-10 V feedback pulse 500 kHz

1

Pulse set
combination-pos
itioning module

NP1F-MP22-axis pulse set instruction positioning
combination module
feedback pulse 500 kHz output 250 kHz(forward + reverse)

1

Pulse set
output-positioning module

NP1F-HP2

Pulse set instruction 250 kHz × 2channels
forward pulse+reverse pulse

1

PC cardinterfacemoduleNP1F-PC2

Versatile PC card,
versatile PC memory card (RAM card (5 V
product))
each 1 channel

Operating instructions

1

Hardware for fixing
card cover

1

Memory card
interfacemoduleNP1F-MM1

Versatile PC memory card (RAM card (5V product))
1 channel

Operating instructions

1

Hardware for fixing
card cover1

Dummy module

NP1F-DMY-

Operating instructions

1

NP2F-LEV

Signal level conversion
open collector (Tr) signal ⇔ RS-485

Operating instructions

1

Signal converter

Communications module

Accessories

Versatilecommunications
moduleNP1L-RS1

Versatile communications RS-232C,
RS-485X each 1 channel

NP1L-RS2

Versatile communications RS-232CX 1channelNP1L-RS4

Versatile communications RS-485X 1channelOPCN-1 mastermoduleNP1L-JP1

OPCN-1 masterX 1 channel

OPCN-1 interface
moduleNP1L-RJ1

Interface module for increasing OPCN-1

Note 1)

1

1Connector for output

1 set

Connector for input

1 set

Operating instructions

1

Operating instructions

1

OPCN-1 connector

1 set

Operating instructions

1

OPCN-1 connector

1 set

SX bus loop back plug

2 pcs

(Continued on the next page)
Note 1)Connector for external connection is not supplied with the module.
See “4-4-3 Input and output wiring” for applicable connectors.

1-9

Chapter 1 Outline(1-2-1 Model list, continued)

Chapter 1 Outline

Description

Model

Outlined specifications

Communications module/unit

Chapter 1 Outline

Model list

NP1L-FL1
FL-net (OPCN-2)
Note 2)
moduleDeviceNet
master module

NP1L-DN1

SX bus opticalconverter

NP2L-OE1

SX bus opticallink module

NP1L-OL1

DescriptionNo.

FL-net (OPCN-2) × 1 channel(10BASE5 or 10BASE-T)

Operating instructions

1

Power supply cable for10BASE5

1 set

DeviceNet master × 1 channel

Operating instructions

1

Connector

1

Operating instructions

1

SX bus optical transmissioninter-station
maximum 800 m (25°C)

SX bus loop back plug
Operating instructions

NP4H-CA2

Connection cable for TDsxEditor 2 m--

NP4H-CNV

Connection cable for TDsxEditor 2 mwith converter (ME777A-FSP)

Operating instructions

1

Converter

Note 1)

In addition, a converter of BLACK BOX made (model: ME777A-FSP) is required.

Note 2)FL-net (OPCN-2) is called FL-net for short in this manual.

1-10

1

SX bus loop back plug
Note 1)

Support toolconnection cable

Accessories

Chapter 2 System Configuration

Chapter 2
System Configuration
2-1 Outline of system configuration ..............................................................2-1
2-1-1
2-1-2
2-1-3
2-1-4

Placement in CIM stages ........................................................................ 2-1
Outline of the system configuration of µGPCsx....................................... 2-2
Number of units connected to each module ............................................ 2-3
Mounting each module onto the baseboard ............................................ 2-5
(1)
(2)
(3)
(3)
(4)
(5)

2-1-5

Power supply module ........................2-5
CPU module......................................2-6
FL-net module ...................................2-6
FL-net module ...................................2-7
I/O modules and other modules .........2-7
Number of units of mounted
modules and output current of
power supply .....................................2-8

Connection of TDsxEditor....................................................................... 2-9
(1)
(2)
(3)

How to connect to TDsxEditor
connector on a CPU module..............2-9
Connection via a versatilecommunications module ....................2-9
Remote connection using PC card
interface modules ............................2-10

2-2 Various system configurations..............................................................2-11
2-2-1

Individual system .................................................................................. 2-12
(1)
(2)

2-2-2

SX bus increasing system..................................................................... 2-13
(1)
(2)

2-2-3
2-2-4

Example of system configuration .....2-12
Allocation of the SX bus station
number............................................2-12
Example of system configuration .....2-13
Allocation of the SX bus station
number............................................2-13

SX bus T-branch increasing system...................................................... 2-14
SX bus optical increasing system ......................................................... 2-15
(1)
(2)
(3)

Example of system configuration .....2-15
Allocation of the SX bus station
number............................................2-15
Powering the SX bus opticalincreasing system on and off

Chapter 2
System Configuration

Table of contents

Chapter 2 System Configuration

Table of contents

(2)
(4)

Chapter 2
System Configuration

2-2-5
2-2-6

Allocation of I/O addresses ................................................................... 2-18
Multi-CPU system (high performance CPU only) .................................. 2-19
(1)
(2)
(3)

2-2-7

1:1 redundancy................................2-20
N:1 redundancy ...............................2-21

FL-net (OPCN-2) system ...................................................................... 2-22
(1)
(2)

2-2-9

Example of system configuration .....2-19
Allocation of CPU module numbers..2-19
Allocation of SX bus station
numbers ..........................................2-19

Redundant system of CPU ................................................................... 2-20
(1)
(2)

2-2-8

partially............................................2-16
Example of a normal degeneration
operation incapable of being made ..2-16
Restriction on the redundant
system.............................................2-17

Example of basic system
configuration....................................2-22
Allocation of SX bus station
numbers ..........................................2-22

OPCN-1 system.................................................................................... 2-23
(1)
(2)

Example of system configuration ........23
Allocation of SX bus station
numbers ..........................................2-23

2-2-10 DeviceNet system................................................................................. 2-24
(1)
(2)

Example of system configuration .....2-24
Allocation of SX bus station
numbers ..........................................2-24

Chapter 2 System Configuration

Placement in CIM

2-1 Outline of system configuration
2-1-1Placement in CIM stagesµGPCsx is a component placed in the equipment management of Level 1
through the cell management of Level 3 in the levels of 6 stages of CIM.

Level 5
Factory
management

Factory hostcomputer

Chapter 2
System Configuration

Host computer of theentire company

Level 6
Administrative
management

Management
computerTrunk line LAN
FA computer

FA personal computer

Level 4
Areamanagement
Cell net
FA personal computer

Level 3Cell management

Inter-PC network

FL-net (OPCN-2) etc.

PLC of other company

Level 2
Stationmanagement
PC low levelnetwork

OPCN-1, DeviceNet etc.
Touch panel

SensorLevel 1Equipment
management

Solenoid valve

Inverter, servo motor

2-1

Chapter 2 System Configuration

Number of connected units<Relation between CPU number and SX bus station number>
CPU modules and FL-net modules are given the SX bus station numbers
automatically by means of the input of the system configuration definition. 0 - 7 of
the CPU numbers are used for CPU modules and 8, 9 are for FL-net.

0
1
2
3
4
5
6
7

SX bus station
number
254
253
252
251
250
249
248
247

CPU number

For CPUmodules

8
9
A
B
C
D
E
F

SX bus station
number
246
245
244
243
242
241
240
239

For processor
link modules

Spare

2-1-3Number of units connected to each module
The number of units connected to each module is as follows.
(1)

Number of modules that can be connected onto the SX bus
Maximum 248 units (except the power supply module, SX bus T-branch unit
and baseboard)(2)

Number of modules/units that can be connected to 1 configuration (including
the remote I/O as well)
Maximum 254 units (except the power supply module, SX bus T-branch unit
and baseboard)(3)

Restriction on the number of units connected to 1 configuration

Module type
Power supply module
CPU module
Processor link module
Touch panel directly connected to the SX bus
Module of classification A
Module of classification B
Module of classification C

Maximum number of units connected
There is no restriction in the number of units connected to the power
supply module.
8 units
Total 2 units including FL-net modules
8 units
8 units (remote I/O master modules)
Processor link modules, POD directly connected to the SX bus
238 units including the connected modules of classifications A, B

<Classification of modules>
Module of classification A• OPCN-1 master module(NP1L-JP1)• DeviceNet master module(NP1L-DN1)

Note)

Module of classification B• FL-net module(NP1L-FL1)• Versatile communications module(NP1L-RS1/RS2/RS4)• PC card IF module
Note)(NP1F-PC2)• Memory card IF module(NP1F-MM1)• Touch panel directly connected to
the SX bus

Module of classification C• All the modules except themodules of classifications A, B

The maximum number of PC card IF modules in 1 configuration is 4 units.

2-3

Chapter 2
System Configuration

CPU numberChapter 2 System Configuration

Number of connected units<Restriction on the number of units of remote I/O master modules>

Chapter 2
System Configuration

There are restrictions as given below on the remote I/O master modules ofwhich product version number is smaller than 10** (hardware version: smaller than
10).

When using the remote I/O master modules, a system must be configured that satisfy the following formula
concerning the number of units of CPU modules in 1 configuration, number of units of remote I/O mastermodules, and number of units of I/O modules that are directly connected to the SX bus.
2043 word > (Number of units of CPU) ×{ Σ (Maximum station number of each remote I/O line + I/O size of the maximum station number + 2) +6.5 }+ Number of units of modules on the SX bus other than CPU modules × 1.5+ Total I/O size of the I/O modules that are directly connected to the SX bus
Note)
Note)

The I/O size (number of occupied words) of the I/O modules that are directly connected to the SX
bus is 2 words even in the case of I/O modules of 8 points, 16 points.

[Quick reference list]: No restriction∆: Restricted. Give notice to the data size used, referring to the calculation formula.
Remote master
1
unit

2
unit

3
unit

4
unit

5
unit

6
unit

7
unit

8
unit

∆

∆

∆

∆

∆

1 unit2 unit3 unit4 unit
CPU

∆

∆

∆

∆

∆

∆

6 unit

∆

∆

∆

∆

∆

∆

∆

7 unit

∆

∆

∆

∆

∆

∆

∆

8 unit

∆

∆

∆

∆

∆

∆

∆

5 unitTo give examples:
There is no restriction on 8 units of remote master when the number of CPU units is 3 or less.
There is no restriction on 3 units of remote master when the number of CPU units is 4 or less.

2-4Chapter 2 System Configuration

Mounting

2-1-4Mounting each module onto the baseboard(1)Power supply module
The power supply module that has the size of 2 slots can be mounted fromthe left-most side, up to a maximum of 3 modules.
<Example of multiple use>
An example of 2 power supply modules being mounted.

PowersupplyChapter 2
System Configuration

•

Power
supply<Caution against the parallel use of power supply modules >The use of multiple units (up to a maximum of 3 units) of power supply modules on
1 baseboard is called a parallel use, and even when 1 unit out of the power supply
modules of a parallel use, if there is enough room for withstanding the load, theother power supply module(s) will supply electric power. Therefore, CPU modules
cannot recognize any fault (abnormality) of power supply modules.
In order that CPUs are notified of any abnormality, ALM contacts (b-contacts) ofpower supply modules should be wired to a digital input module. Refer to “4-4Wiring” for details.

PowersupplyPowersupplyKey points•

At the left-most end of the baseboard is a slot dedicated to the power supply module. Other
modules such as CPU, I/O etc. cannot be mounted. (They will not work even when mounted.)•

As for additional power supply of a parallel use, there is no restriction on its mounting position on
the baseboard.

2-5Chapter 2 System Configuration

Mounting(2)

CPU module
Up to a maximum of 8 units can be mounted in 1 µGPCsx system (1configuration) connected to the SX bus.
Key points

Chapter 2
System Configuration••

In µGPCsx, multiple CPU modules can be mounted on 1 system, thereby enabling theconstruction of a multi-CPU system in which each function is processed by CPU (high performance
CPU only). Refer to “2-2-6 Multi-CPU system” for details.
CPU modules cannot be mounted on a slot that has no processor bus connector.

A case in which multiple units are used on 2 baseboards
Communications using the processor bus can be performed.

PowersupplySlots with processor bus connectors

PowersupplyCommunications using the SX bus

Communications using the processor bus can be
performed.

[For reference]
When total 3 units or more CPU modules or FL-net modules are used on 1
baseboard, a baseboard that has processor bus connectors for use for 10 slots(TD1BP-13) should be used.
Note, however, that the 13th slot has no processor bus connector. So a CPU
module cannot be mounted here.
13th slot

PowersupplyCommunications using the processor
bus can be performed.

2-6Communications using the SX bus

Chapter 2 System Configuration

Mounting(3)FL-net module
Up to total 2 units of FL-net modules can be mounted in a µGPCsx system(1 configuration) connected by the SX bus cable.

••

FL-net modules and CPU modules should be mounted on slots that have processor bus
connectors. They cannot be mounted on slots that do not have processor bus connectors.
FL-net modules can only be mounted on a configuration that is configured with highperformance CPU.

< Example of 2 units being used >A case of being used on 1 baseboard

Powersupply•A case of 2 units being used on 2 baseboards
Communications using the processor bus can be performedPowersupplyFL-net module
FL-net modulePowersupplyCommunications
using the SX bus

Communications using the processor bus can be performed

In the example of the above illustration, high-speed data communications can be
performed between CPU0 - FL-net modules, and between CPU1 - FL-net modules
that are on the same processor bus.

(4)

I/O modules and other modules
Digital I/O modules, analog I/O modules and other modules can be mounted
on any slots except those for power supply modules.

2-7

Chapter 2
System Configuration

Key points

Chapter 2 System Configuration

Connection of TDsxEditor

2-1-5Connection of TDsxEditor(1)

How to connect to TDsxEditor connector on a CPU modulePowersupply*Dedicated cable (NP4H-CNV: for personal computers)(2)

To be connected to the
RS-232C connector on a
personal computer

Connection via a versatile communications module
Access to a CPU module can be obtained by means of a connection to theversatile communications port of a versatile communications module that ismounted on a baseboard.

PowersupplySX busincreasing cable

To be connected via SX bus

PowersupplyRefer to the “Versatile Communications Module-User’s Manual” for the details of TDsxEditor connection bymeans of versatile communications modules.

2-9

Chapter 2
System Configuration

Converter ME777A-FSP
Manufactured by BLACK BOX

Chapter 2 System Configuration

Connection of TDsxEditor(3)

Remote connection using PC card interface modules

Chapter 2
System Configuration

Remote operations (remote programming, monitoring) can be made bymounting PC card interface modules on the baseboard and connecting an
Ethernet card.

Powersupply*Personal computer connectedto the Ethernet

Refer to the “User’s Manual-PC Card Interface Module” and “User’s Manual-TDsxEditor Operation Part” forthe details of TDsxEditor connection by means of PC card interface modules.

*

Ethernet is a registered trademark of Xerox Corporation of U.S.A.

2-10

Chapter 2 System Configuration

Various system configurations

2-2 Various system configurations

System description

OutlineIndividual system

A system configured with 1 unit of CPU module, power supply module, I/O,
function modules etc. on 1 unit of baseboard.
A system in which multiple baseboards are connected by means of an SX
bus increasing cable. Excepting power supply modules, up to a maximumof 254 stations of modules can be connected.
A system can be constructed in which the SX bus is branch connected bymeans of a branching unit.
A dispersed, increased system can be constructed in which the SX bus ismade fit for optical transmission by means of an SX bus optical converter
and an SX bus optical link module.
This is a system that uses multiple CPUs, with each CPU doing its share of
the control work divided by each function.

SX bus increasing system

SX bus T-branch increasingsystem
SX bus optical increasingsystemMulti-CPU system
Redundant system of CPU

This is a system to achieve higher reliability by preparing a CPU to work as
a backup for another operating CPU (doubling).

FL-net link system

This is an open FA network system aiming at data communications
between the SX series configurations and with a PC of other manufacturer
that supports FL-net.

Ethernet communications
systemOPCN-1 system

This is used when carrying out communications with a personal computer
placed on the upper stage of CIM or a PC of other manufacturer.
An OPCN-1 system can be constructed that is an open remote I/O networkby mounting an OPCN-1 master module on the baseboard.
A DeviceNet system can be constructed that is an open remote I/O
network by mounting a DeviceNet master module on the baseboard.

DeviceNet system

2-11

Chapter 2
System Configuration

In a µGPCsx system, various systems are constructed that are suited to thecontrolled object.

Chapter 2 System Configuration

Individual/Increase

2-2-1Individual system
This is a basic system in which 1 unit of CPU module, power supply module,
I/O module etc. are mounted on 1 unit of baseboard.

Chapter 2
System Configuration(1)

Example of system configuration

SX bus loop back
plug

Note)

(2)

Power
supplySX bus station
number

SX bus loop back plugs should be installed on both ends of the SX bus even in a system having
only 1 unit of baseboard.

Allocation of the SX bus station number
The SX bus station number on a baseboard is usually allocated from the rightof CPU0 as 1, 2, 3 ... in order automatically. Note, however, that the station
number of the CPU module (CPU0) is always “station 254” wherever it islocated.

2-12

Chapter 2 System Configuration

Individual/Increase

2-2-2SX bus increasing system
This is a system in which multiple baseboards are connected by means of an
SX bus increasing cable.
(1)

Example of system configuration

Chapter 2
System Configuration

SX bus loop back
plug
Power
supplySX bus total
length 25 m

SX busincreasing cable

SX bus loop back
plug

Note)

(2)

Power
supplyPowersupplyThe cable taken from OUT must be connected to IN without fail.
performed with a connection like OUT-OUT or IN-IN.

Communications cannot be

Allocation of the SX bus station number
The SX bus station number on a baseboard is usually allocated from the rightof CPU0 as 1, 2, 3 ... in order automatically. Note, however, that the station
number of the CPU module (CPU0) is always “station 254” wherever it islocated.

Key points•

At the left side of each baseboard, a power supply module must always be mounted and in
addition, at least 1 unit of module other than the power supply module must be mounted.

•

The number of units that can be connected to a baseboard is up to 25 units. Although thesystem works even when 26 units or more are connected, there will be an extreme decrease in thereliability of the SX bus. It should always be used with 25 units or less being connected.
The base (power supply) of 1 configuration should be powered on at one time as a general rule.
However, in such a case as an application requires a certain number of bases (power supplies) tobe turned OFF, then such number should be up to a maximum of 3 units in succession in 1
configuration.

•

2-13

Chapter 2 System Configuration

Branch increasing

2-2-3SX bus T-branch increasing system
A branch connection can be configured by connecting an SX bus T-branch
unit (NP8B-TB).
(1)

Example of system configuration

Chapter 2
System Configuration

SX bus loop
back plugPowersupplySX bus T-branch unitPowersupplySX busincreasing cable

SX bus total
length 25 m

PowersupplySX bus loop
back plug

SX bus loop
back plug

(2)

Power
supplyAllocation of the SX bus station number
The SX bus station number on a baseboard is usually allocated from the rightof CPU0 as 1, 2, 3 ... in order automatically. And the station number after
branching is allocated in order as above.

Key points
•

•

2-14

The number of SX bus T-branch units that can be connected is up to 25 units including the
baseboard. Although the system works even when 26 units or more are connected, there will be
an extreme decrease in the reliability of communications. It should always be used with 25 units
or less being connected.
The base (power supply) of 1 configuration should be powered on at one time as a general rule.
However, in such a case as an application requires a certain number of bases (power supplies) tobe turned OFF, then such number should be up to a maximum of 3 units in succession in 1
configuration.

Chapter 2 System Configuration

Optical increasing system

2-2-4SX bus optical increasing system
A dispersed long-distance system of SX bus can be constructed by converting
the SX bus into optical transmission signals by means of an SX bus optical link
module (NP1L-0L1) and an SX bus optical converter (NP2L-0E1).
(1)

Example of system configuration

SX bus opticallink module

SX busloop back plug

Optical fiber cable
Maximum 800 m
between stations
Total length: 25.6 km
Optical fiber
cable

SX busloop back plug

SX busincreasing cable

SX busincreasing cable

SX bus opticalconverter

Touch panel

Optical fiber cable
SX busloop back plug

(2)

SX station number “18”Allocation of the SX bus station number
The SX bus station number on a baseboard is usually allocated from the rightof CPU0 as 1, 2, 3 ... in order automatically. In the case of being branchedby means of an SX optical link module it is allocated in order as above.
Key points•••

The number of SX bus optical link modules and SX bus optical converters that can be connected
is up to a maximum of 64 units/1 configuration.
The transmission distance of optical fiber (PCF) is maximum 800 m between stations (25°C), andthe maximum extension of the system is 25.6 km.
Refer to “3-8 Communications modules specifications” for the specifications and handling of SX
bus optical link modules and SX bus optical converters.

2-15

Chapter 2
System Configuration

To configure the hub of SX bus

Chapter 2 System Configuration

Optical increasing system(3)Powering the SX bus optical increasing system on and off partially
The setting of degeneration must be effective to carry out the partial powering
on and off by means of µGPCsx. However, if partial powering on and off has
been performed in a system that employs SX bus optical link equipment, thesystem may not return to its normal state depending on the system
configuration, even if a “degeneration setting” is made on it.
[1]

Example of a normal degeneration operation capable of being made

Chapter 2
System Configuration< Normal operating state >< When the 3rd baseboard is powered on and off >* In the illustration at theleft, if the 3rd baseboard
is powered on and off,
then “power reset” isexecuted on the modules
mounted on the
baseboard, and if the“degeneration setting” ismade on I/O modules on
the baseboard, thesystem can return to thenormal operating state.

(2)

Example of a normal degeneration operation incapable of being made< Normal operating state >< When the 2nd baseboard is powered on and off >The module is in a state ofheavy fault due to its being
separated from CPU.

*In the above illustration, if the 2nd baseboard is powered off, then the module is separated from CPU, resulting in thestate of heavy fault. Therefore, the system will not be restarted even when the 2nd baseboard is re-powered.
In order to release the heavy fault state, the 3rd baseboard and the 2nd baseboard should be reset simultaneously,
or else the 2nd baseboard should be powered on, followed by the resetting of the baseboard on which CPU modules
are mounted.

2-16Chapter 2 System Configuration

Optical increasing system

Restriction on the redundant system
In the redundant system, “dispersive arrangements of CPU modules via an
optical link system cannot be made.”<Reason>When breakage occurs in optical fiber cables, the optical link equipment (SXbus optical converter and SX bus optical link module) bypasses SX bus
signals inside the optical link equipment. In the event that breakage occurs
in an optical fiber cable in a system that connects the operating CPU andstandby CPU by means of the optical fiber cable, since SX bus signals are
bypassed inside the optical link equipment, 2 systems of SX bus loops areformed. At this time, each CPU recognizes that the other CPU has dropped,and each operates as an “operating CPU” in each SX bus loop. Next, if thesystem is recovered from the breakage in optical fiber cables without resetting
the system, then it means that 2 units of operating CPUs exist in 1 SX bus
loop, and hence the operation of the system cannot be guaranteed.
Note)

Refer to “2-2-7 Redundant system of CPU” for the redundant system.

2-17

Chapter 2
System Configuration(4)

Chapter 2 System Configuration

Address allocation

2-2-5Allocation of I/O addresses
Explanations of allocation of I/O addresses are given herein using an example
of system configuration shown in the illustration below.

Chapter 2
System ConfigurationPowersupply16-point
input

32-point 64-point
input
input

6-point
output8-point
output16-point
output32-point 64-point
outputoutputSX bus station
numberI/O address-<Rules of the allocation of addresses>
In µGPCsx, I/O addresses are allocated following the rules as indicated below.

I: Input
O: Output

An address that is determined by a numerical boundary of the relay number
20H (32D) represented in a hexadecimal number, or of the occupied relay
number of points, whichever is smaller.

Key points•••

In the case of a representation in word or double word, no designation of bit address is required.
A double word representation cannot be used for an I/O module of 16 points or less.
When a double word representation is used for an I/O module of 64 points or less, it shall bedone as follows.
(Examples) In the case of an input module of 64 in the 3rd slot of the system in the above
illustration:
iw0004 → 32 bits of 100040 - 10005F
iw0006 → 32 bits of 100060 - 10007F

2-18

Chapter 2 System Configuration

Multi-CPU

2-2-6Multi-CPU system (high performance CPU only)
In the µGPCsx series, a system can be constructed in which multiple CPU
modules are connected to the processor bus and 1 SX bus. Up to a maximum of 8
units of CPU modules can be connected.
(1)

Example of system configuration

(2)

[3]

[1]

[2]

Chapter 2
System Configuration[2]

Versatilecommunications[1]

PositioningPowersupplyPositioning

CPU0 can control I/O [1], [2], [3] and positioning [1], and CPU1 can control
positioning [2], versatile communications and I/O [4].

[4]Allocation of CPU module numbers
The CPU numbers are set in order from 0 by means of a setting switch at thefront of the CPU module.

(3)

Allocation of SX bus station numbers
The SX bus station numbers are usually allocated from the right side of CPU0in order as 1, 2, 3...... automatically, and the CPU modules are allocated asfollows in accordance with the number of the CPU number setting switch.
<Relation between CPU numbers and SX bus station numbers>
0 - 7 of the CPU numbers are used for CPU modules and 8, 9 are for FL-net.

CPU number
0
1
2
3
4
5
6
7

SX bus station
number
254
253
252
251
250
249
248
247

CPU number

For CPUmodules

8
9
A
B
C
D
E
F

SX bus station
number
246
245
244
243
242
241
240
239

For FL-net
modulesSpare

Key points•

CPU0 (a CPU module of which CPU number is set at “0”) is essential both in a single CPU system and in a
multi-CPU system.

•

The setting of CPU numbers is also required in CPU modules, FL-net modules and standby CPU modules in
the case of a double CPU system.

2-19

Chapter 2 System Configuration

Redundant of CPU

2-2-7Redundant system of CPU
In a control system, improving the safety and reliability of a system by
doubling the equipment used is called making redundant. In the µGPCsx series, it
is possible to make power supply modules redundant and to make CPU modules
redundant.

Chapter 2
System Configuration

Explanations are given herein of making CPU modules redundant.
In µGPCsx, making CPU redundant can be subdivided into 1:1 redundancy
and N:1 redundancy.
(1)

1:1 redundancy
It is a system to achieve redundancy by means of 1 unit of standby CPU
against 1 unit of operating CPU. Each of CPU0-CPU1, CPU2-CPU3,
CPU4-CPU5 and CPU6-CPU7 makes up a operating-standby pair. The
same application program is to be used.
< Example of configuration of 1 pair of 1:1 redundancy >Operating CPU
Standby CPU• Execution of the application program• I/O data input• I/O control• Monitoring of the operating CPU• Monitoring and control of the entire• Input of equivalent data from thesystemoperating CPU Note)• Output of equivalent data to theNote)standby CPU[1] System operationNote) In the case of a cold standby
method, no take-over of
equivalent data is carried out.

SX busWhen the system is powered on, operation is started with CPU modules having even CPU numbers being
made operating CPUs, and with CPU modules having odd CPU numbers being made standby CPUs. (In thecase of the above configuration example, CPU0 operates and CPU1 is in standby.) If abnormality occurs in
the operating CPU and its operating is stopped, then the standby CPU starts operation.
Also, there are 2 methods in 1:1 redundancy, warm standby in which the standby CPU takes over the data of
the operating CPU, and cold standby in which the taking over of the data is not performed. The data takenover in the warm standby method is called equivalent data, and its range is designated in the system definition.
[2] Replacement of CPUs having faults
In the case of the above system configuration example, there are no modules other than the power supply
module on the baseboard on which each CPU is mounted, and therefore, when there is abnormality in CPU0 it
is also possible to replace CPU0 while CPU1 is operating as the operating CPU.
The procedure to be followed in the replacement is: Turn off the power supply on the CPU0 side → Replace
CPU0 → Turn on the power supply on the CPU0 side. The recovered CPU0 will become the standby CPU as
it is.
When both systems of the redundant system (operating CPU, standby CPU) have abnormality, both systems
should be powered off and then restarted.

Key points
•
•
•

2-20

The operating CPU and the standby CPU load the same application program.
In both cases of employing the warm standby method and the cold standby method, I/O data is to be taken
over.
Standby/Operation can be switched by means of a loader operation.

Chapter 2 System Configuration

Redundant of CPU(2)

N:1 redundancy
This is a system to make multiple (2 units - 7 units) operating CPUs
redundant by means of 1 unit of standby CPU. Up a maximum of 2 pairs of
N:1 redundant groups can be defined in 1 configuration. A CPU module
having the largest CPU number in the registered group becomes the standby
CPU.
Standby CPU• Monitoring of the operating CPU
and entire system

Memory card IF

Operating CPU• Execution of the application program• I/O control• Monitoring and control of the entire system

SX bus[1] System operation
When the system is powered on, a CPU module having the largest CPU number in the N:1
redundant group becomes the standby CPU, and operation is started. (In the case of the above
system configuration, CPU0 and CPU1 operate and CPU2 is in the standby state.
If there is abnormality in CPU0 or CPU1 and it is impossible to carry out operation, the standby
CPU downloads from the memory card interface module the program of CPU that has had
abnormality, and then starts operation.
There is only the cold standby method in N:1 redundancy. It is not possible to take over the dataof the operating CPU.
[2] Replacement of CPUs having faults
In the case of the above system configuration example, no modules other than the power supply
module are mounted on the baseboard on which each CPU is mounted, and therefore, when there
is abnormality in CPU1 it is possible to replace CPU while CPU2 is operating as the operatingCPU.
The procedure to be followed in the replacement is: Turn off the power supply on the CPU1 side →Replace CPU1 → Turn on the power supply on the CPU1 side. Note, however, that therecovered CPU module is in the standby state, waiting for the switching instruction to be given by
the loader, or the power reset of the entire system.
This state is not a state of N:1 redundancy.

Key points•

Application programs for use for N units (for use for operating CPUs) need to be stored in the memory
card interface module.
•
There is only the cold standby method in N:1 redundancy. It is not possible to take over the internal
data and I/O data.
•
Standby/Operation can be switched by means of a loader operation.
Also, when a CPU having a fault has been replaced, switching the operating CPU is required.
•
In an N:1 redundancy system, the use of reading/writing operation of programs by means of the switch
on the front of the memory card I/F module is prohibited. Do not use the memory card, if module forstoring application programs for N:1 redundancy at the same time for the file memory for file data
read/write access from the CPU’s application programs. A separate memory card I/F module should be
used for the file data read/write. If the memory card I/F module is used at the same time for thispurpose as well, then access conflict will occur, which may disable the switching of theoperating/standby of redundancy.

2-21

Chapter 2
System Configuration< Example of configuration of 1 pair of 2:1 redundancy >Chapter 2 System Configuration

FL-net2-2-8FL-net (OPCN-2) system(1)

The FL-net system is an open network system to connect various FA
controllers such as Programmable Controllers (PCs), Computer
Numerical
Controllers (CNCs) and personal computers made by different manufacturers,
thereby realizing the control/monitoring of the system.
Example of basic system configuration

Chapter 2
System Configuration

Coaxial cable(Maximum cable length: 500 m)

Single port
transceiver

Terminator

AUI cable(Maximum total
cable length: 50 m)

Groundingterminal
Hub
Twisted pair cable(Maximum cable length: 100 m)* FL-net
Number of nodes connected:
100 units/1 segment(256 units when repeaters are used)

Transmission rate:
10 MbpsFL-net module(2)

Allocation of SX bus station numbers
In the same way as in the case of CPU modules, CPU numbers are allocatedto FL-net modules by means of the switch on the front of the module.
Depending on the thus allocated numbers, SX bus station numbers areallocated as follows.
< Relation between CPU numbers and SX bus station numbers >0 - 7 of the CPU numbers are used for CPU modules and 8, 9 are for FL-net.

CPU number
0
1
2
3
4
5
6
7

SX bus station
number
254
253
252
251
250
249
248
247

CPU number

For CPUmodules

8
9
A
B
C
D
E
F

SX bus station
number
246
245
244
243
242
241
240
239

For FL-net
modules

Spare

Refer to the “µGPCsx Series/FL-net Modules-User’s Manual” for the detailed specifications and usage of the
FL-net system.

2-22

Chapter 2 System Configuration

OPCN-1

2-2-9OPCN-1 system
By installing an OPCN-1 master module onto the SX bus (onto thebaseboard), an OPCN-1 system can be constructed as a master station of
OPCN-1.
(1)

Example of system configurationPowersupplyOPCN-1 interface module(NP1L-RJ1) OPCN-1 station number “01”Note)

SX bus loop
back plugPowersupplyThe modules that can bemounted onto the basehaving OPCN-1 interface
modules (subsidiarystation) are digital I/O andanalog I/O only. Notethat high-speed input
modules and high-speed
output modules cannot
be mounted thereon.

(Toyo Denki) RSH64* Up to a maximum of 31 slave stations
can be connected.

equipment “30”operational
display “10”OPCN-1 station number
OPCN-1 station number(2)

Allocation of SX bus station numbers
The SX bus station numbers are usually allocated from the right of CPU0 inorder of 1, 2, 3...... automatically.

Refer to the “µGPCsx Series/OPCN-1 Master Modules-User’s Manual” for the detailed specifications andusage of the OPCN-1 system.

2-23

Chapter 2
System Configuration

OPCN-1 master module

Chapter 2 System Configuration

DeviceNet

2-2-10(1)

DeviceNet system
Example of system configuration

Maximum trunk line length: 100 m - 500 m

Chapter 2
System Configuration

Slave
node

Slave
node
Terminal resistor

Terminal resistor

Maximum 6 m
Slave
node

Slave
node
Maximum 6 m

Slave
node
NP1L-DN1 (master node)
Slave
node

Note)

(2)

The maximum distance of the trunk line depends on the transmission rate and type of cables
used.
(500 m: 125 kbps, 250 m: 250 kbps, 100 m: 500 kbps)

Allocation of SX bus station numbers
The SX bus station numbers are usually allocated from the right of CPU0 inorder of 1, 2, 3...... automatically. Note, however, that no SX bus station
numbers are allocated to the slave nodes of DeviceNet.

Refer to the “µGPCsx Series/DeviceNet Master Modules” for the detailed specifications and usage of theDeviceNet system.

2-24

Chapter 3 Specifications

Table of contents

Chapter 3 Specifications
3-1 General Specifications .............................................................................3-1
3-2 Power Supply Module Specifications......................................................3-2
Power supply specifications.................................................................... 3-2
Name of each part and its function ......................................................... 3-3

3-3 CPU Module Specifications......................................................................3-4
3-3-1
3-3-2

Performance specifications list................................................................ 3-4
Name of each part .................................................................................. 3-6

3-4 Baseboard Specifications ........................................................................3-8
3-4-1
3-4-2

Specifications list .................................................................................... 3-8
Name of each part and its function ......................................................... 3-9

3-5 Input and Output Specifications............................................................3-10
3-5-1

Definition of sync, source...................................................................... 3-10
(1)
(2)
(3)
(4)

3-5-2

Life of relay........................................................................................... 3-12
(1)
(2)
(3)
(4)

3-5-3

Sync input .......................................3-10
Source input ....................................3-10
Sync output .....................................3-11
Source output ..................................3-11
Life curve of relay ............................3-12Type of load and its rush current......3-12
Contact protection ...........................3-13
Transition phenomena of thecontact ............................................3-13

Individual specifications of the digital input module ............................... 3-20
(1)
(2)
(3)
(4)

DC 24 V input
16 points (NP1X1606-W) .................3-20
DC 24 V input
32 points (NP1X3206-W) .................3-22
DC 24 V input
64 points (NP1X6406-W) .................3-24
DC 5 - 12 V input
32 points (NP1X3202-W) .................3-26

Chapter 3
Specifications

3-2-1
3-2-2

Chapter 3 Specifications

Table of contents

(5)
(6)
(7)
(8)

3-5-4

Individual specifications of the digital output module............................. 3-36
(1)
(2)
(3)
(4)

(5)

Chapter 3
Specifications

(6)
(7)
(8)
(9)
(10)
(11)
(12)
(13)

3-5-5

Transistor sync output
8 points (NP1Y08T0902) .................3-36
Transistor sync output
16 points (NP1Y16T09P6) ...............3-38
Transistor sync output
32 points (NP1Y32T09P1) ...............3-40
Transistor sync output with a pulse
output function
32 points (NP1Y32T09P1-A)............3-42
Transistor sync output
64 points (NP1Y64T09P1) ...............3-44
Transistor source output
8 points (NP1Y08U0902) .................3-46
Transistor source output
16 points (NP1Y16U09P6)...............3-48
Transistor source output
32 points (NP1Y32U09P1)...............3-50
Transistor source output
64 points (NP1Y64U09P1)...............3-52
SSR output 6 points (NP1Y06S) ......3-54
SSR output 8 points (NP1Y08S) ......3-56
Relay output 8 points(NP1Y08R-04).................................3-58
Relay output
16 points (NP1Y16R-08)..................3-60

Individual specifications of the digital I/O mixed module........................ 3-62
(1)

(2)

(3)

(4)

3-5-6

AC 100 V input
8 points (NP1X0810) .......................3-28
AC 100 V input
16 points (NP1X1610) ...................3-30
AC 200 V input
8 points (NP1X0811) .......................3-32
DC 24 V high-speed input
32 points (NP1X3206-A) ..................3-34

DC 24 V source input
8 points/transistor sync output
8 points (NP1W1606T) ....................3-62
DC 24 V sync input
8 points/transistor source output
8 points (NP1W1606U)....................3-64
DC 24 V source input
16 points/transistor sync output
16 points (NP1W3206T) ..................3-66
DC 24 V sync input
16 points/transistor source output
16 points (NP1W3206U) ..................3-68

Individual specifications of the Analog I/O module ................................ 3-70
(1)
(2)
(3)
(4)

High-speed analog input(NP1AXH4-MR) ...............................3-70
Standard analog input(NP1AX04-MR)................................3-71
Standard analog input(NP1AX08-MR)................................3-72
High-speed analog output

Chapter 3 Specifications

Table of contents

(5)
(6)

(NP1AYH2-MR)...............................3-73
Standard analog output(NP1AY02-MR)................................3-74
Temperature measuring resistor
input (NP1AXH4-PT) .......................3-75

(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)

Versatile communications module(NP1L-RS1).....................................3-76
Versatile communications module(NP1L-RS2).....................................3-77
Versatile communications module(NP1L-RS4).....................................3-78
OPCN-1 master module(NP1L-JP1) .....................................3-79
OPCN-1 interface module(NP1L-RJ1) .....................................3-80
FL-net module .................................3-81
DeviceNet module (NP1L-DN1) .......3-82
SX bus optical link module(NP1L-0L1)/SX bus opticalconverter (NP2L-0E1)......................3-83

3-7 Positioning Module Specifications........................................................3-85
(1)
(2)
(3)
(4)
(5)
(6)

High-speed counter module(NP1F-HC2) ....................................3-85
Multi-channel high-speed countermodule (NP1F-HC8) ........................3-86
Positioning signal converter(NP2F-LEV).....................................3-87
2-axis analog instruction
positioning (NP1F-MA2)...................3-88
2-axis pulse set instruction
positioning (NP1F-MP2)...................3-89
Pulse set output positioning(NP1F-HP2).....................................3-90

3-8 Function Module Specifications ............................................................3-91(1)(2)

PC card interface module(NP1F-PC2).....................................3-91
Memory card interface module(NP1F-MM1)....................................3-92

3-9 Auxiliaries and Others ............................................................................3-93
(1)
(2)
(3)
(4)
(5)
(6)

Battery for data backup (NP8P-BT)..3-93
SX bus increasing cable(NP1C)...................................3-93
SX bus loop back plug (NP8B-BP)...3-93
SX bus T-branch unit (NP8B-TB) .....3-94
Trial input switch (NP8X-SW)...........3-95
TDsxEditor connection cable(NP4H-CA2 (without a converter),
NP4H-CNV (with a converter)).........3-95

Chapter 3
Specifications

3-6 Communications Module Specifications ..............................................3-76

Chapter 3 Specifications

Table of contents

3-10 Outer Specifications ...............................................................................3-96
(1)
(2)
(3)
(4)
(5)

Chapter 3
Specifications

(6)
(7)
(8)
(9)

Power supply module
TD1S-22/TD1S-42...........................3-96
CPU module TD1PS-32/TD1PS-74..3-96
Base board ......................................3-97
Base board installation hardware(attached to the base board) ............3-98
Fixing hardware for base board(NP8B-ST).......................................3-98
I/O module.......................................3-99
Communications module ...............3-101
Positioning module/unit..................3-104
Function module/unit .....................3-105

Chapter 3 Specifications

General Specifications

3-1 General Specifications
Specifications

Physical environment

Mechanical working
conditions

Electric working
conditions

Operating ambient
temperature

0 - 55°C

Storage temperature-25 - +70°C

Relative temperature

20 - 95% RH without any condensation.
(5 - 95% RH without any condensation during transport.)

Contamination degree

Contamination degree 2

Anti-corrosiveness

There should not be corrosive gasses.
There should not be any attachment of organic solvent.

Altitude used2000 m or less above sea level (Atmospheric pressure duringtransport should be 70 kPa or more.)

Antivibration

Half amplitude: 0.15 mm, Fixed acceleration: 19.6 m/s
Note 2)
2 hours to each direction, total 6 hours

Shock resistancePeak acceleration: 147 m/s
Note 2)
3 times for each direction

Antinoise

Noise simulator method, Startup time: 1 ns
Pulse width: 1 µs, 1.5 kV

Antistatic, discharge
resistanceContact discharge method: ± 6 kV,
Air discharge method: ± 8 kV

Antiradiation,
electromagnetic
resistance

10V/m (80MHz – 1000MHz)

Structure

Note 1)

2

2

Panel built-in type IP3

Cooling method

Natural cooling

Insulation characteristics

Dielectric strength and insulation resistance are indicated on each
moduleInternal current consumption

Indicated on each module or unit

WeightIndicated on each module or unit

Outer specifications

Indicated in Section 3-10Note 1)

Note 2)

Contamination degree 2: Usually in the state of no electrically conductive contamination. It is
specified, however, that it is a state in which in some cases electrical conductivity may be generated
temporarily due to condensation.
It is a state in which a unit is fixed onto the control panel by means of fixing screws. There should beneither vibration nor shock when installed onto a DIN rail.

3-1

Chapter 3
Specifications

ItemChapter 3 Specifications

Power supply specifications

3-2 Power Supply Module Specifications

Chapter 3
Specifications

3-2-1Power supply specifications
Item

Specifications

Model

TD1S-22

TD1S-42

Rated input voltage(Allowable range of
input voltage)

AC 100/240 V(AC 85 - 132 V)(AC 170 - 264 V)

DC 24 V(DC 19.2 - 30 V)

Rated frequency

50/60 Hz-

Allowable range of
frequency

47 - 63 Hz-

Allowable
instantaneous blackouttime

1 cycle or less10 ms or less

Waveform distortion
ratio

5% or less-

Allowable ripple ratio-

Three-phase full-wave
rectified waveform
5% or less

Leakage current

0.25 mA or less

Rush current

22.5 AO-P or less
(Ta = 25°C non-repetition)

150 AO-P or less2 ms or lessPower consumption

110 VA or less

45 W or less

Rated output voltage(Fluctuation range of
output voltage)DC 24 V(DC 22.8 - 26.4 V)

Output current

0.01 - 1.46 A

Note)

Remarks

Note that the interval of
instantaneous blackout is 1
second or more.

Between the input terminals
collected together and the FG
IEC 950 Class II equipment

Rated input voltage
Maximum load
TD1S-22, TD1S-42 arecapable of being used inparallel.

Insulation method

Insulation by means of a transformer

Dielectric strength

AC 2900 Vrms for 1 second

AC 560 V for 1 minuteBetween the power supply
input terminal collected
together and the grounding

Between the power supply
input terminal collected
together and the grounding

Insulation resistance

10 MΩ or more when measured with DC 500 V insulation
resistance tester

Number of occupyingslots

2 slots

Alarm output

Existent (monitoring of output voltage DC 24 V, 0.3 A or less)

WeightApprox. 330 g

Note)

Relay normally closed contact(b-contact) output

Approx. 360 g

The indicated value is the one when the voltage is goes down from the rated voltage to 0 V, the phaseis the full phase, and the load is within the range of rated values.

3-2Chapter 3 Specifications

Power supply

3-2-2Name of each part and its function[1][2]State display
LED

Terminal block(6-pole)Specifications
plate

ALM contact

Note)

The above illustration shows the state of the terminal cover having been removed for the
purpose of explanations.

[1]State display LED

SymbolDisplaycolor

Lighting conditions

PWR

Green

Lights on when the output voltage is within the range of rated
values. Lights off when it is outside the range of rated values.

ALM

Red

Lights on when the output voltage is outside the range of rated
values.

[2]

Terminal block (6-pole)
It is a terminal block of M4 × 6-pole.

Allocation of terminals is as follows.

(Tightening torque: 1.2 N-m, Applicable wire size: 2 mm2)
< TD1S-22 (AC power supply product) >100/200 V
switching terminal[3]< TD1S-42 (DC power supply product) >(100 V: Short-circuit)(200 V: Open)ALM contact
The ALM contact is a normally closed contact (b-contact), which is OFF (thecontact is open) when the power supply module is in the state of normal
operation (the output voltage is within the range of 19.2 - 26.4 V), and isotherwise ON (the contact is closed). The rated voltage is DC 24 V and
rated current is 0.3 A.

3-3

Chapter 3
Specifications[3]

Chapter 3 SpecificationsCPU

3-3 CPU Module Specifications
3-3-1Performance specifications list
CPU (TD1PS-32/TD1PS-74)
Item

Specifications

Model

TD1PS-32

Execution control method

Stored program cyclic scan method

I/O connection method

Directly connected I/O method (SX bus), Remote I/O method

I/O control method

On SX bus: Tact synchronous refreshingCPU

32 bit OS processor, 32 bit execution processor

Memory type

Program memory, data memory, temporary

Programming language

GPC language (data flow form)

Instruction
execution time

20 - 520 ns/instruction

Sequence instruction
Application instruction

Data memory

Program memory capacity

Chapter 3
Specifications

TD1PS-74

40 ns/instruction
Approx. 200 pages

Approx. 400 pages

Input and output memory (I/O)

512 words (maximum 8192 points) (fixed)

Global memory

6144 words

30719 words

Local memory

4 K words(0.5 K words × 8 subprograms)

16 K words(0.5 K words × 32 subprograms)

Instance memory

4 K words

16 K words

System FB memory

16 K words

65 K words

System memory

512 words (fixed)

Retain memory
Trace back memory
Total size

Number of task units

2 units

2 units

Number of subprograms

832

Diagnosis function

Self-diagnosis (memory check, ROM sum check, CPU basic operation
check), system configuration monitoring, module fault monitoring

Secrecy function

password

Calendar function

Time range: up to 23:59:59 on December 31, 2069.
Accuracy ± 27 seconds/month (25°C)
With time setting function at the time of the multi-CPU system

Backup of application programs

Range of backup by means of the CPU module built-in flash ROM:
Application programs, system definitions, ZIP files

Backup of data memory

Range of backup:

Retain memory, retain attribute memory (present valuesof the counter, etc.), calendar IC memory

Battery used:

Lithium primary battery

Backup time
Number of occupied slots

5 years(at ambient temperature: 25°C)

1.3 years(at ambient temperature: 25°C)

1 slotInternal current consumption

DC 24 V 200 mA or less

DC 24 V 200 mA or less

WeightApprox. 200 g

Approx. 200 g

3-4

Chapter 3 SpecificationsCPU

3-3-2Name of each part
(1)

CPU TD1PS-32/TD1PS-74[2] CPU mode switching switch[1] State display LED[3] CPU number setting switch[4] Connector for programming tool/versatile communications
connection

Specifications
plate

Connector cover[6] Version display[5] Battery for data backup

Battery cover

Chapter 3
Specifications

Connector forbattery connection

3-5Chapter 3 Specifications

CPU

[1]
SymbolDisplay color Explanations

ONL
ERR

Green
Red

RUN
ALM

Green
Red

BAT

Chapter 3
Specifications

State display LED

OrangeIt displays the state of its own CPU module.
< Lighting on pattern >ONLLight off

ERR
Light off

Flash
Light onLight onLight off

Light off
Light onLight onState of its own CPU module
In the state of power supply being OFF, being reset or being
initialized
In the state of establishing the SX bus
Its own CPU module is under normal operation
Its own CPU module is under operation with minor faults
Its own CPU module is stopped due to serious faults

It displays the state of the system controlled by its own CPU module.
< Lighting on pattern >RUNLight off

ALM
Light off

Light onLight onLight off

Light off
Light onLight onNote)

State of the system
In the state of power supply being OFF, or application
programs being stopped
System under normal operation
System under operation with minor faults
System stopped due to serious faults

It lights on when the voltage of the battery for data backup is decreased, or gone.

Note)

The system includes its own CPU.

[2]

Key switch
The operations of CPU modules are set by means of a key switch.

Key position Operation of CPU and communications with the loader
RUN•
When switched from the STOP position or TERM position to the RUN position, the CPU module
starts operation.
•
When in this position, monitoring and reading operations can be made from the loader.
(Operation of read/write can be made for the data.)
TERM•

To keep the previous state.
When switched from the STOP position to the TERM position, the CPU module keeps the stop
state.
When switched from the RUN position to the TERM position, the CPU module keeps the runningstate.
If the switch is in the TERM position when powering on, the CPU module will be in the runningstate (default). Also, it can be put into the previous state of operation by means of a setting of
the system definition.

•
When in this position, monitoring and read/write operations can bemade from the loader.
•
When switched from the RUN position or TERM position to the STOP
position, the CPU module stops.
•
When in this position, monitoring and reading operations can be madefrom the loader. (Operation of read/write can be made for the data.)

STOP

[3]

CPU number setting switch
It sets the CPU number. In the case of a system consisting of 1 unit of CPU
module, it must always be set to “0”.
In the case of a system consisting of multiple CPU modules (multi-CPU
system), it should be set from “0” in order.

3-6

Chapter 3 Specifications

CPU

Do not change the setting while running.
Failure to observe this may cause a stopof the system.

Chapter 3
Specifications

Note)

3-7

Chapter 3 Specifications

CPU

[4]

Connector for programming tool versatile communications connection
It connects TDsxEditor or versatile communications external equipment.

[5]

Battery for data backup
It is a battery for the backup of the retained data at the time of blackout inside
the CPU module (retain memory, calendar, etc.)[6]

Version display
It displays the version of the CPU module.
Hardware version

Chapter 3
Specifications

Software version

3-8

Chapter 3 SpecificationsBase

3-4 Baseboard Specifications
3-4-1Specifications list
Item

Specifications

Model

TD1BS-06

TD1BS-08

TD1BS-11

TD1BS-13

TD1BP-13

Number of slots

6 slots

8 slots

11 slots

13 slots

13 slots

Number of processor
bussesInternal current
consumption DC 24 V

For 4 slots

For 3 slots

For 3 slots

For 3 slots

For 10 slots

45 mA or less

50 mA or less

60 mA or less

70 mA or less

70 mA or less

WeightApprox. 420 g

Approx. 540 g

Approx. 720 g

Approx. 840 g

Approx. 840 g

Refer to “3-10 Outer Specifications” for outer dimensions.

< Processor bus connection slot >Key points• On the baseboard, a power supply module and at least 1 unit ofmodule other than the power supply module must be mounted.

• At the left-most end of the baseboard, a power supply module
must always be mounted.

• The vacant slots can be provided up to 10 slots without
extending over separate baseboards.

• The number of units that can be connected to a baseboard is
up to 25 units including the SX bus T-branch unit (NP8B-TB).

• If in a system in which multiple baseboards are connected bymeans of the SX increasing cable, a certain number of bases(power supplies) needs to be turned OFF, then such number
should be up to a maximum of 3 units. (Although operation
can be made even when 4 units or more in succession are
turned off, there will be an extreme decrease in thecommunications reliability of the SX bus.

(Processor bus extension type)The slot indicated withis a slot with a processor bus connector.

3-9

Chapter 3
Specifications

Note)Chapter 3 SpecificationsBase

3-4-2Name of each part and its function[1] Increasing SX bus
connector (IN)[2] Increasing SX bus
connector (OUT)[3] Coupler lock

[6] Hole for direct
mounting[5] SX bus connector[6] Hole for direct
mounting(Side view) (Front view)

Chapter 3
Specifications[4] Processor bus connector[7] Hardware forbaseboard installation[8] Hardware for baseboard fixation(to be purchased separately)(Front view) (Side view)

[1]
[2]

[3]
[4]

[5]
[6]
[7]
[8]

3-10

Increasing SX bus connector (IN)
Increasing SX bus connector (OUT)
It is a connector for increasing SX bus. The cable taken from OUT must always be connected
to IN.
Coupler lock
It is a coupler used to fix the module.
Processor bus connector
It is a connector for being connected to the processor bus that is used for carrying out
high-speed data communications between CPU modules, and between CPU module processor
link modules.
SX bus connector
It is a connector for connecting each module to the SX bus.
Hole for direct mounting
Hardware for baseboard installation
Hardware for baseboard fixation NP8B-ST (to be purchased separately)
It is hardware for baseboard fixation that is used for installing a baseboard to a DIN rail. Its 1
pair consists of 2 pcs.
Refer to “Chapter 4 Installation and Wiring” for its usage.

Chapter 3 Specifications

Input and Output Specifications

3-5 Input and Output Specifications
3-5-1Definition of sync, source(1)

Sync input
The input in which signal current flows in a signal terminal in the input moduleof PC is called sync input.

Chapter 3
SpecificationsµGPCsx input

Common(2)

Source input
The input in which signal current flows out from a signal terminal in the input
module of PC is called source input.
µGPCsx input

Common3-11

Chapter 3 Specifications

Input and Output Specifications(3)

Sync output
The output in which signal current flows in a signal terminal in the output
module of PC is called sync output.

µGPCsx output

Load

Chapter 3
Specifications

Load

Common(4)

Source output
The output in which signal current flows out from a signal terminal in the
output module of PC is called source output.

µGPCsx output

Load

Load

Common3-12Chapter 3 Specifications

Life of relay

3-5-2Life of relay(1)

Life curve of relay
The life of a contact in a relay depends on the voltage, current, connected load at the contact.
In the case of a use requiring frequent opening/closing operations, there will be a problem inrelay output because of its life, and therefore it is recommended to employ triac output instead.
Please study the life of a contact and time of replacement of a module in your system, referringto the figures below.
< Testing conditions >Opening/closing frequency 1,800 times/hour, activation rate 40%, in the case of inductive load,time constant L/R=15 ms
AC load life curve of relay
output device

DC load life curve of relay
output device

Chapter 3
Specifications

Opening/closing life

[× 10,000 times]

Opening/closing life

[× 10,000 times]

Interrupting current(2)Interrupting current

Type of load and its rush current
The type of load and its rush current characteristics greatly affect the contact. The rushcurrent, in particular, becomes the factor to cause deposition of the contact, and therefore rushcurrent values should also be considered in addition to the steady current.
• Motor, electromagnetic contactor, solenoid loads ...
With these loads there is a rush current equaling 3 - 10 times of steady state current. Also, inthe case of a rush current lasting for a relatively long time as with the motor load, an interruptingin the state of a rush current may cause contact deposition, and hence it must not be done.
• Lamp load ...
With the lamp load there is a rush current equaling 5 - 15 times of steady state current. Thisrush current may cause contact deposition, and therefore if opening/closing of a lamp with alarge capacity is to be made, it is recommended that verification test with an actual load should
be carried out beforehand. The figures below show an example of current waveform in relation
to time with each load. (Ip: rush current, Io: steady state current)[Current waveform of load in relation to time]•

Motor load
Ip/Io=5 - 10 times•

Halogen lamp load
Ip/Io=5 - 10 times

3-13Chapter 3 Specifications

Life of relay(3)

Contact protection
When inductive loads such as motor, clutch, solenoid etc. are interrupted, several hundred toseveral thousand volts of counter electromotive force is generated, which may substantially2
shorten the contact life. This is because when inductive loads are interrupted, 1/2Li (L is theinductance of the coil) of the energy that has been stored in the coil is consumed by the electric
discharge between the contacts, and therefore it is recommended that a contact protection
circuit should be employed to absorb the counter electromotive force.
The illustration below shows its major methods, and in each method a separate usage may berequired depending on its application to AC or DC. Also, the contact protection circuit may
somewhat prolong the time required for recovery, and these should be considered in employing
it.
[Contact protection circuit]

Example of circuit
Load

Judgment Notice on its use(1)

Chapter 3
Specifications(2)

The contact deposition tends to be caused when closing thecontact.
In the case of AC, leakage voltage is applied to the load.

Load

(1)

The contact deposition tends to be caused when closing thecontact.

Load

(1)
(2)

c = 0.1 - 1 µF, r ≈ R
When used with AC,•

If the impedance of the load (R) is larger than the impedanceof c, r: ×
• If the impedance of the load (R) is sufficiently less than the
impedance of c, r:

Load

(1)
(2)

c = 0.1 - 1 µF, r ≈ R
It can be applied both to AC and to DC.

Load

(1)
(2)

It can be used with DC (dedicated to DC).
Not to be applied to AC.

(1)

It can be applied both to AC and to DC.

Diode
Load

Varistor(4)

Transition phenomena of the contact
The transition phenomena of the contact is that one of the two contacts is melted or vaporized
as a result of the opening/closing with a direct current load, and makes a transit to the othercontact, thereby creating unevenness on the surface as the number of times of opening/closing
increases, and eventually the uneven surfaces become locked with each other, being
seemingly in the state of contact deposition. This transition phenomena of the contact may
occur even when the relay contact is working within the range of rated values. In the case of
performing the opening/closing of a contact with a load including a capacitor, these phenomena
are likely to occur, and therefore a resistor etc. should be used for controlling the rush current.

3-14Chapter 3 Specifications

Digital input

I/O Malfunctions and countermeasures

One-point advice
Examples of malfunctions in the I/O circuit and their countermeasures arepresented herein.
When digital I/O is used, some malfunctions in the I/O circuit may occur such as while external input
equipment (sensors etc.) is off, the input of PC remains ON, or even when the output of PC becomes OFF,external input equipment (lamps etc.) remains ON, etc.
Causes and countermeasures of malfunctions are given below, which should be considered at the time ofdesigning hardware.
Examples of malfunctions in the input circuit and their countermeasures

Phenomenon

Cause

Countermeasure- Example 1 -••Leakage current of external equipment(Driving by means of proximity switches etc.)

AC input

Input signal will
not becomeOFF

An appropriate resistor and capacitor should
be connected to make the voltage between
terminals of the input module less than therecovery voltage value.
(A resistor only may suffice depending on the circuit.)

Leakage current

AC input
External equipment- Example 2 Input signal will
not become
OFF(In some cases theneon lamp
remains lighted
on)- Example 3 -•Leakage current of external equipment(Driving by means of a limit switch with a neon lamp)•

AC input
Leakage current

External equipment••

Power supply

Leakage current resulting from the capacity
between the lines of the wiring cable••AC input

Input signal will
not become
OFF

Same as Example 1
Otherwise, power supply should be installed at theside of external equipment as illustrated below.
AC input•

Power supply

Power supply
External equipment

Leakage current of external equipment•(Driving by means of a switch with an LED display)

Input signal will
not becomeOFF

DC input•

An appropriate resistor should be connected as
illustrated below, so that the voltage between theterminal and the common of the input module becomes
lower than the OFF voltage.

AC input

Leakage current

External equipment- Example 5 -The CR value depends on the current value.
Recommended value
C: 0.1 - 0.47 µF
R: 47 - 120 Ω (1/2 W)
Provide a separate display circuit being
independent of the present circuit.

Leakagecurrent

External equipment- Example 4 -Power supply

Resistor

Power supply

Snake path as a result of using 2 power sources
DC input

Input signal will
not become
OFF

•
•

The 2 power sources should be replaced by 1 power source.
A snake path prevention diode should be connected.
(See illustration below.)

DC input•

A snake path is generated when E1 > E2.

3-15

Chapter 3
Specifications(1)

Chapter 3 Specifications

Digital input

I/O Malfunctions and countermeasures

One-point advice+

Continued from the previous page(2)

Examples of malfunctions in the output circuit and their countermeasures

Phenomenon

Cause

Countermeasure- Example 1 -••Chapter 3
Specifications

Excessive
voltage isapplied to theload when the
output is OFF•

The load undergoes one-half period rectificationinternally(such is the case of some solenoids.)
When the polarity of power source is like (1), C ischarged, and when the polarity is like (2), thecharged voltage and power supply voltage is added
to be then applied to both ends of D1.

A resistor of several scores of kΩ - several
hundred kΩ should be connected in parallelwith the load.

Resistor

The maximum value of voltage is about 2 2E .
Note) If it is used like this, there is no problem inthe output device, but the diode built in theload (D1) may be deteriorated, causing
burnout etc.

Load

OutputLoad- Example 2 -•The load will not
become OFF.

OutputLeakage current caused by a surge
absorption circuit that is connected in parallelwith the output device.

•

A resistor of about several scores of kΩ or C and R
that give equivalent impedance should beconnected in parallel with the load.
Note) If the wiring distance from the output card to the load
is long, caution is required not to cause leakage ofcurrent resulting from the capacity between the lines.

LoadLeakage current

Load- Example 3 -••Same as Example 2

When the load
is a C-R typetimer, the timing
is not correct.

The C-R type timer should be derived via a relay.
A device other than the C-R type timer should be
used.
Note) Caution of Example 1 should be taken because in sometimers one-half period rectification is performed in theinternal circuit.

Timer
Output- Example 4 -•Snake path as a result of using 2 power sources•

Output•

The load will not
become OFF
Load(for direct current)

•
•

3-16

Load

Relay

The 2 power sources should be replaced by 1 powersource.
A snake path prevention diode should be connected.
Note) If the load is a relay etc., a diode for absorbing thecounter electromotive voltage should be connected to
the load (See the dotted line in the illustration below.)Load
A snake path is generated when E1 < E2.
A snake path is also generated when E1 is madeOFF (E2 is ON).

Chapter 3 Specifications

Digital input

I/O Malfunctions and countermeasures

One-point advice
Continued from the previous page
Phenomenon

Cause

Countermeasure- Example 5 -••Transient current at the time of being OFF.
A large current inductive load (the one having large
time constant L/R) such as a solenoid has been
driven directly by the transistor output.

The OFF
responsetime of the load
is excessively
long.

Output diodeA mini-control relay or magnet contactor that has asmall time constant should be inserted as
illustrated below, and the load should be driven byits contact.
Output diodeCurrent at thetime of OFF

Load

•

- Example 6 -•The output
transistor getsbroken.

Load

When the transistor output is OFF, since thecurrent flows through the diode, there may be adelay of 1 second or more depending on the load.

•

Rush current of an incandescent lamp•

An output module that has no flywheel diodeshould be used, and a countermeasure against
surges should be taken for the load.
To suppress the rush current, a dark current equaling
about 1/3 - 1/5 of the rated current of the incandescentlamp should be caused to flow through the circuit.

OutputOutput(transistor output)

Dark current

In the case of a sync-shaped transistor output

OutputDark current•- Example 7 -•At the instant that it is lighted on, there may
be a rush current of 10 times or more of therush current.
An excessive voltage is applied to the output device.
Triac

The output triac
gets broken.

ForwardrotationIn the case of a source-shaped transistor output•

The load should be driven with the output device
being mediated by a relay, magnet contactor etc.

Reversible motor

Reverserotation(SSR output)

Power supply

Common•••When the output on the forward rotation coil side is ON,
a voltage is induced in the reverse rotation coil, and an
excessive voltage (induced voltage + power supply
voltage) is applied to the output on the reverse rotationcoil side. And vice versa in some cases.

•

It is desirable to provide an interlock externally.

A voltage of nearly twice the power supply voltage may
be applied.
The surge absorber may be burnt out prior to thebreakage in the triac.

3-17

Chapter 3
Specifications+

Chapter 3 Specifications

Digital input

I/O Malfunctions and countermeasures

One-point advice+

Continued from the previous page(3)

Example of calculations of a bleeder resistor
An example of calculations of a bleeder resistor is given herein as a countermeasure against an
input malfunction caused by a leakage current in an LED circuit.
[1]
Example of a malfunction
Switch with an LED
Input module

Chapter 3
Specifications

Leakagecurrent

Input resistor
3.3 kΩ

Assuming that r = 2.6 kΩ, the leakage current I becomes:

In this case, a voltage of:is applied between the input terminals of the input module, and it exceeds the OFF voltage:
5.0 V of the input module (NP1X1606-W etc.), with the result that even if the switch with an
LED is “OFF”, the input module will be in the state of “ON”.
[2]Countermeasure
Switch with an LED
Input module

A bleeder resistor R should be inserted between the input terminals of the input module,
thereby lowering the voltage applied between the input terminals to 5.0 V or less.

3-18

Chapter 3 Specifications

Digital input

I/O Malfunctions and countermeasures

One-point advice
Continued from the previous page(3)

Example of calculations•
In the illustration on the previous page, if the voltage applied between
he input terminals is assumed to be 5.0 V, then the current that flows
hrough there will be as follows.

•
Then R is to be obtained considering the shunted current of the input
esistor and bleeder resistor.

•
Assuming that the resistor value R=820 (Ω ), the power capacity P ofhe bleeder resistor is to be obtained.
Since DC 24 V is applied to the bleeder resistor when the switch with an LED is turnedON:

The resistor value usually needs room of 3 to 4 times of the steady state value, and hence
the power capacity should be set at 3 W.
Result: A bleeder resistor of 820 Ω/3 W should be connected.

3-19

Chapter 3
Specifications+

Chapter 3 Specifications

Digital input

3-5-3Individual specifications of the digital input module(1)

DC 24 V input 16 points (NP1X1606-W)

Item

Specifications

Model

NP1X1606-W

Number of input points (common configuration)

16 points (8 points/common 2 circuits)

Input signal
conditions

DC 24 V

Characteristics of
input circuit

Rated voltage
Maximum allowable voltage

DC 30 V

Allowable ripple ratio

5% or less

Input form

Used by source/sync in common

Rated current

7 mA (at DC 24 V)

Input impedance

3.3 kΩ

Standard
operating range

OFF → ON

15 - 30 V

ON → OFF

0-5V

Input delay time

OFF → ON

0.7 ms (hard filter time) + (soft filter time)

ON → OFFThe soft filter time is variable collectively depending on thesetting of parameters.

Chapter 3
Specifications(OFF → ON) - (ON → OFF):1 - 1 ms, 3 - 3 ms (Default), 3 - 10 ms, 10 - 10 ms,
30 - 30 ms, 100 - 100 ms
Connection

Input typeDC type 1

External connection

Removable terminal block M3 screw 20-pole

Applicable wire size

AWG #22-18

Input signal display

Note)

LED lights on when each point becomes ON At the logicside
ONL: when normal (green LED),
ERR: when abnormal (red LED)

Insulation method

Photocoupler insulation

Dielectric strength

AC 1500 V 1 minute Between the input terminals collected
together and the FG

Insulation resistance

10 MΩ or more when measured with DC 500 V insulation
resistance tester
Between the input terminals collected together and the FG

Dilating conditions

Simultaneous ON ratio: Maximum 100% (at DC 26.4 V/55°C)
Simultaneous ON ratio: Maximum 75% (at DC 30 V/55°C)

External supply voltage

DC 24 V: for signals

Internal current consumption

DC 24 V 35 mA or less (when all points are ON)

Number of occupied words

In the case of the SX bus being connected directly: 2 words,
In the case of being on the remote I/O link: 1 word

WeightApprox. 150 g

Note)

The applicable wire size depends on the crimp-style terminals used. Refer to “4-4-3 Input and output
wiring” for details.

3-20Chapter 3 Specifications

Digital input< Name of each part >State display LED
Removable terminal blockM3 20-pole

Chapter 3
Specifications

Specifications
plate< External connection >Signal nameNote 1) Common C0, C1(Terminal number 9, 18) areelectrically separation insulated.
Note 2) NC depicts a terminal to which aninternal circuit is not connected.
Note, however, that it should not be
used as a repeating terminal etc.

Terminal number< Circuit configuration >Internal circuit

3-21

Chapter 3 Specifications

Digital input(2)

DC 24 V input 32 points (NP1X3206-W)

Item

Specifications

Model

NP1X3206-W

Number of input points (common configuration)

32 points (32 points/common 1 circuit)

Input signal
conditions

DC 24 V

Characteristics of
input circuit

Rated voltage
Maximum allowable voltage

DC 30 V

Allowable ripple ratio

5% or less

Input form

Used by source/sync in common

Rated current

4 mA (at DC 24 V)

Input impedance

5.6 kΩ

Standard
operating range

OFF → ON

15 - 30 V

ON → OFF

0-5V

Input delay time

OFF → ON

0.7 ms (hard filter time) + (soft filter time)

ON → OFFThe soft filter time is variable collectively depending on thesetting of parameters.
(OFF → ON) - (ON → OFF):1 - 1 ms, 3 - 3 ms (Default), 3 - 10 ms, 10 - 10 ms,
30 - 30 ms, 100 - 100 ms

Chapter 3
Specifications

Input type
Connection

DC type 1

External connection

40-pole connector (FCN-365P040-AU) 1 piece

Applicable wire size

AWG #23 or less (at the time of using a soldering type
Note)connector)

Input signal display

LED lights on when each point becomes ON At the logicside
ONL: when normal (green LED), ERR: when abnormal (redLED)

Insulation method

Photocoupler insulation

Dielectric strength

AC 1500 V 1 minute Between the input terminals collected
together and the FG

Insulation resistance

10 MΩ or more when measured with DC 500 V insulation
resistance tester
Between the input terminals collected together and the FG

Dilating conditions

Simultaneous ON ratio: Maximum 100% (at DC 26.4 V/55°C)
Simultaneous ON ratio: Maximum 75% (at DC 30 V/55°C)

External supply voltage

DC 24 V: for signals

Internal current consumption

DC 24 V 50 mA or less (when all points are ON)

Number of occupied words

2 words

WeightApprox. 130 g

Note)

The applicable wire size depends on the connector used. Refer to “4-4-3 Input and output wiring” fordetails.

3-22

Chapter 3 Specifications

Digital input< Name of each part >State display LED
LED display change-overswitchState of the switch

Lighting bit

Connector 40-pole
Specifications
plate

Chapter 3
Specifications< External connection >Signal name
Connector pin number

Note) NC depicts a pin
to which aninternal circuit is
not connected.
Note, however,that it should not
be used as arepeating pin etc.

<Circuit configuration>

Internal circuit

3-23

Chapter 3 Specifications

Digital input(3)

DC 24 V input 64 points (NP1X6406-W)

Item

Specifications

Model

NP1X6406-W

Number of input points (common configuration)

64 points (32 points/common 2 circuits)

Input signal
conditions

DC 24 V

Characteristics of
input circuit

Rated voltage
Maximum allowable voltage

DC 30 V

Allowable ripple ratio

5% or less

Input form

Used by source/sync in common

Rated current

4 mA (at DC 24 V)

Input impedance

5.6 kΩ

Standard
operating range

OFF → ON

15 - 30 V

ON → OFF

0-5V

Input delay time

OFF → ON

0.7 ms (hard filter time) + (soft filter time)

ON → OFFThe soft filter time is variable collectively depending on thesetting of parameters.
(OFF → ON) - (ON → OFF):1 - 1 ms, 3 - 3 ms (Default), 3 - 10 ms, 10 - 10 ms,
30 - 30 ms, 100 - 100 ms

Chapter 3
Specifications

Input type
Connection

DC type 1

External connection

40-pole connector (FCN-365P040-AU) 2 pcs.

Applicable wire size

AWG #23 or less (at the time of using a soldering type
Note)connector)

Input signal display

LED lights on when each point becomes ON by a change-overof the switch At the logic side
ONL: when normal (green LED), ERR: when abnormal (redLED)

Insulation method

Photocoupler insulation

Dielectric strength

AC 1500 V 1 minute Between the input terminals collected
together and the FG

Insulation resistance

10 MΩ or more when measured with DC 500 V insulation
resistance tester
Between the input terminals collected together and the FG

Dilating conditions

Simultaneous ON ratio: Maximum 60% (at DC 26.4 V/55°C)
Simultaneous ON ratio: Maximum 45% (at DC 30 V/55°C)

External supply voltage

DC 24 V: for signals

Internal current consumption

DC 24 V 85 mA or less (when all points are ON)

Number of occupied words

4 words

WeightApprox. 180 g

Note)

The applicable wire size depends on the connector used. Refer to “4-4-3 Input and output wiring” fordetails.

3-24

Chapter 3 Specifications

Digital input< Name of each part >State display LED
LED display change-overswitchState of the switch

Lighting bit

Connector 40-pole

Specifications
plate< External connection >Signal name
Connector pin
numberSignal name
Connector pin
number

Note 1) Common pin C0, C1 are electrically separation insulated.
Note 2) NC depicts a pin to which an internal circuit is not connected. Note, however, that itshould not be used as a repeating pin etc.

< Circuit configuration >Internal circuit

3-25

Chapter 3
Specifications

Connector 40-poleChapter 3 Specifications

Digital input(4)

DC 5 - 12 V input 32 points (NP1X3202-W)

Item

Specifications

Model

NP1X3202-W

Number of input points (common configuration)

32 points (32 points/common 1 circuits)

Input signal
conditions

Rated voltage

DC 5 - 12 V

Maximum allowable voltage

DC 13.2 V

Allowable ripple ratio

5% or lessCharacteristics of
input circuit

Input form

Used by source/sync in common

Rated current

3 mA (at 5 V), 9 mA (at 12 V)

Input impedance

1.2 kΩ

Standard
operating range

OFF → ON

3.5 - 13.2 V

ON → OFF

0–1V

Input delay time

OFF → ON

0.7 ms (hard filter time) + (soft filter time)

ON → OFFThe soft filter time is variable collectively depending on thesetting of parameters.
(OFF → ON) - (ON → OFF):1 - 1 ms, 3 - 3 ms (Default), 3 - 10 ms, 10 - 10 ms,
30 - 30 ms, 100 - 100 ms

Chapter 3
Specifications

Input type
Connection

DC type 1

External connection

40-pole connector (FCN-365P040-AU) 1 piece

Applicable wire size

AWG #23 or less (at the time of using a soldering type
Note)connector)

Input signal display

LED lights on when each point becomes ON by a change-overof the switch At the logic side
ONL: when normal (green LED), ERR: when abnormal (redLED)

Insulation method

Photocoupler insulation

Dielectric strength

AC 1500 V 1 minute Between the input terminals collected
together and the FG

Insulation resistance

10 MΩ or more when measured with DC 500 V insulation
resistance tester
Between the input terminals collected together and the FG

Dilating conditions

Simultaneous ON ratio: Maximum 100% (at DC 13.2V/55°C)
Simultaneous ON ratio: Maximum 75% (at DC 15 V/55°C)

External supply voltage

DC 5 - 12 V: for signals

Internal current consumption

DC 24 V 50 mA or less (when all points are ON)

Number of occupied words

2 words

WeightApprox. 130 g

Note)

The applicable wire size depends on the connector used. Refer to “4-4-3 Input and output wiring” fordetails.

3-26

Chapter 3 Specifications

Digital input< Name of each part >State display LED
LED display change-overswitchState of the switch

Lighting bit

Connector 40-pole
Specifications
plate

Chapter 3
Specifications< External connection >Signal name
Connector pin number

Note) NC depicts a pin
to which aninternal circuit is
not connected.
Note, however,that it should not
be used as arepeating pin etc.

<Circuit configuration>

Internal circuit

3-27

Chapter 3 Specifications

Digital input(5)

AC 100 V input 8 points (NP1X0810)

Item

Specifications

Model

NP1X0810

Number of input points (common configuration)

8 points (8 points/common 1 circuit)

Input signal
conditions

Input form

AC input

Rated voltage

AC100 - 120 V

Maximum allowable voltage

AC 132 V

Characteristics of
input circuit

Waveform distortion ratio

5% or less

Rated frequency

50/60 Hz

Allowable range of frequency

47 - 63 Hz

Rush current

Maximum 150 mA

Rated current

10 mA

Input impedance

10 kΩ (50 Hz), 9 kΩ (60 Hz)

Standard
operating range

OFF → ON80 - 132 V

ON → OFF

0 - 20 V

Input delay time

OFF → ON

Approx. 10 ms

ON → OFFApprox. 10 ms

Chapter 3
Specifications

Input type
Connection

AC type 1

External connection

Removable terminal block M3 screw 10-pole

Applicable wire size

AWG #22-18

Input signal display

Note)

LED lights on when each point becomes ON At the logicside
ONL: when normal (green LED),
ERR: when abnormal (red LED)

Insulation method

Photocoupler insulation

Dielectric strength

AC 1500 V 1 minute Between the input terminals collected
together and the FG

Insulation resistance

10 MΩ or more when measured with DC 500 V insulation
resistance tester
Between the input terminals collected together and the FG

Dilating conditions

None

External supply voltage

AC 100 - 120 V: for signals

Internal current consumption

DC 24 V 35 mA or less (when all points are ON)

Number of occupied words

In the case of the SX bus being connected directly: 2 words,
In the case of being on the remote I/O link: 1 word

WeightApprox. 130 g

Note)

The applicable wire size depends on the crimp-style terminals used. Refer to “4-4-3 Input and output
wiring” for details.

3-28Chapter 3 Specifications

Digital input< Name of each part >State display LED
Removable terminal blockM3 10-pole< External connection >Chapter 3
Specifications

Specifications
plate

Signal nameNote 1) NC depicts a terminal to which aninternal circuit is not connected.
Note, however, that it should not
be used as a repeating terminaletc.

Terminal number< Circuit configuration >Internal circuit

3-29

Chapter 3 Specifications

Digital input(6)

AC 100 V input 16 points (NP1X1610)

Item

Specifications

Model

NP1X1610

Number of input points (common configuration)

16 points (16 points/common terminal 2 pcs)

Input signal
conditions

Input form

AC input

Rated voltage

AC100 - 120 V

Maximum allowable voltage

AC 132 V

Characteristics of
input circuit

Waveform distortion ratio

5% or less

Rated frequency

50/60 Hz

Allowable range of frequency

47 - 63 Hz

Rush current

Maximum 150 mA

Rated current

10 mA/points (AC 100/120 V)

Input impedance

10 kΩ (50 Hz), 9 kΩ (60 Hz)

Standard
operating range

OFF → ON80 - 132 V

ON → OFF

0 - 20 V

Input delay time

OFF → ON

Approx. 10 ms

ON → OFFApprox. 10 ms

Chapter 3
Specifications

Input type
Connection

AC type 1

External connection

Removable terminal block M3 screw 20-pole

Applicable wire size

AWG #22-18

Input signal display

Note)

LED lights on when each point becomes ON At the logicside
ONL: when normal (green LED),
ERR: when abnormal (red LED)

Insulation method

Photocoupler insulation

Dielectric strength

AC 1500 V 1 minute Between the input terminals collected
together and the FG

Insulation resistance

10 MΩ or more when measured with DC 500 V insulation
resistance tester
Between the input terminals collected together and the FG

Dilating conditions

Simultaneous ON ratio: Maximum 80% (at AC 100 V/55°C)
Simultaneous ON ratio: Maximum 60% (at AC 132 V/55°C)

External supply voltage

AC 100 - 120 V: for signals

Internal current consumption

DC 24 V 40 mA or less (when all points are ON)

Number of occupied words

In the case of the SX bus being connected directly: 2 words,
In the case of being on the remote I/O link: 1 word

WeightApprox. 170 g

Note)

The applicable wire size depends on the crimp-style terminals used. Refer to “4-4-3 Input and output
wiring” for details.

3-30Chapter 3 Specifications

Digital input< Name of each part >State display LED
Removable terminal blockM3 20-pole

Chapter 3
Specifications

Specifications
plate< External connection >Signal nameNote 1) Common terminals (terminal
number 9, 18) are connectedinternally.
Note 2) NC depicts a terminal to which
an internal circuit is notconnected. Note, however, thatit should not be used as arepeating terminal etc.
Terminal number< Circuit configuration >Internal circuit

3-31

Chapter 3 Specifications

Digital input(7)

AC 200 V input 8 points (NP1X0811)

Item

Specifications

Model

NP1X8011

Number of input points (common configuration)

8 points (8 points/common 1 circuit)

Input signal
conditions

Input form

AC input

Rated voltage

AC200 - 240 V

Maximum allowable voltage

AC 264 V

Characteristics of
input circuit

Waveform distortion ratio

5% or less

Rated frequency

50/60 Hz

Allowable range of frequency

47 - 63 Hz

Rush current

Maximum 300 mA

Rated current

10 mA/points (AC 200/240 V)

Input impedance

22 kΩ (50 Hz), 18 kΩ (60 Hz)

Standard
operating range

OFF → ON

160 - 264 V

ON → OFF

0 - 40 V

Input delay time

OFF → ON

Approx. 10 ms

ON → OFFApprox. 10 ms

Chapter 3
Specifications

Input type
Connection

AC type 1

External connection

Removable terminal block M3 screw 10-pole

Applicable wire size

AWG #22-18

Input signal display

Note)

LED lights on when each point becomes ON At the logicside
ONL: when normal (green LED),
ERR: when abnormal (red LED)

Insulation method

Photocoupler insulation

Dielectric strength

AC 2830 V 1 minute Between the input terminals collected
together and the FG

Insulation resistance

10 MΩ or more when measured with DC 500 V insulation
resistance tester
Between the input terminals collected together and the FG

Dilating conditions

None

External supply voltage

AC 200 - 240 V: for signals

Internal current consumption

DC 24 V 35 mA or less (when all points are ON)

Number of occupied words

In the case of the SX bus being connected directly: 2 words,
In the case of being on the remote I/O link: 1 word

WeightApprox. 130 g

Note)

The applicable wire size depends on the crimp-style terminals used. Refer to “4-4-3 Input and output
wiring” for details.

3-32Chapter 3 Specifications

Digital input< Name of each part >State display LED
Removable terminal blockM3 10-pole< External connection >Chapter 3
Specifications

Specifications
plate

Signal nameNote 1) NC depicts a terminal to which
an internal circuit is notconnected. Note, however, thatit should not be used as arepeating terminal etc.

Terminal number< Circuit configuration >Internal circuit

3-33

Chapter 3 Specifications

Digital input(8)

DC 24 V high-speed input 32 points (NP1X3206-A)

Item

Specifications

Model

NP1X3206-A

Number of input points (common configuration)

32 points (32 points/common 1 circuit)

Input signal
conditions

Rated voltage

DC 24 V

Maximum allowable voltage

DC 30 V

Characteristics of
input circuit

Allowable ripple ratio

5% or less

Input form

Source input

Rated current

4 mA (at DC 24 V)

Input impedance

5.6 kΩ

Standard
operating range

OFF → ON

15 - 30 V

ON → OFF

0-5V

Input delay time

OFF → ON

(hard filter time) + (soft filter time)

ON → OFFThe soft filter time is variable collectively depending on thesetting of parameters.

Note 1)(OFF → ON) - (ON → OFF):
None, 0.1 – 0.1ms, 1 - 1 ms, 3 - 3 ms (Default), 3 - 10 ms, 10 10 ms,
30 - 30 ms, 100 - 100 ms

Chapter 3
Specifications

Input type
Connection

DC type 1

External connection

40-pole connector (FCN-365P040-AU) 1 piece

Applicable wire size

AWG #23 or less (at the time of using a soldering type
Note 2)connector)

Input signal display

LED lights on when each point becomes ON by a change-overof the switch At the logic side
ONL: when normal (green LED),
ERR: when abnormal (red LED)

Insulation method

Photocoupler insulation

Dielectric strength

AC 1500 V 1 minute Between the input terminals collected
together and the FG

Insulation resistance

10 MΩ or more when measured with DC 500 V insulation
resistance tester
Between the input terminals collected together and the FG

Dilating conditions

Simultaneous ON ratio: Maximum 100% (at DC 26.4 V/55°C)
Simultaneous ON ratio: Maximum 75% (at DC 30 V/55°C)

External supply voltage

DC 24 V: for signals

Internal current consumption

DC 24 V 50 mA or less (when all points are ON)

Number of occupied words

14 words (input: 9 words/output: 5 words)

WeightApprox. 130 g

Note 1)

Note 2)The duration of the hard filter time depends on the port used. It is 20 µs for ports 1 through 8, and100 µs for ports 9 through 32.
The applicable wire size depends on the connector used. Refer to “4-4-3 Input and output wiring” fordetails.

3-34

Chapter 3 Specifications

Digital input< Name of each part >State display LED
LED display change-overswitchState of the switch

Lighting bit

Connector 40-pole
Specifications
plate

Chapter 3
Specifications< External connection >Signal name
Connector pin number
Port 9Port 10
Port 11
Port 12
Port 13
Port 14
Port 15
Port 16
Port 17
Port 18
Port 19
Port 20

Port 21
Port 22
Port 23
Port 24
Port 25
Port 26
Port 27
Port 28
Port 29
Port 30
Port 31
Port 32

Port 1

Port 5

Port 2
Port 3

Port 6
Port 7

Port 4

Port 8Note 1) All the common pins: C0 are connected internally.
Note 2) The figures in the parentheses: ( ) in the signal namecolumn shows the offset address and bit position.
Note 3) For the detailed specifications of this module and its
handling, refer to a manual dedicated to it (FH211).

3-35

Chapter 3 Specifications

Digital output

3-5-4Individual specifications of the digital output module(1)

Transistor sync output 8 points (NP1Y08T0902)

Item

Specifications

Model

NP1Y08T0902

Number of output points (common configuration)

8 points (8 points/common 1 circuit)
With 4 pcs. each of P, M common terminals

Output power
conditions

Rated voltage

DC 12 - 24 V

Maximum allowable voltage

DC 10.2 - 30 V

Characteristics of
output circuit

Output form

Sync output

Maximum load current

2.4 A/point, 8 A/common

Output voltage drop

2 V or less (at 2.4 A)

Output delaytime

OFF → ON

1 ms or less

ON → OFF

1 ms or less

Leakage current at the time ofOFF

Chapter 3
Specifications

Output protection
form

Maximum 0.1 mA

Output typeTransistor output

Withstand surge current

9 A 10 ms

Built-in fuse

125 V 15 A × 2(The replacement of fuses cannot be performed by users.)

Surge suppression circuit

Varistor

Other output protection

None

Maximum opening/closing frequency

1800 times/hour (This is a restriction at the time of an induced
load. There is no restriction at the time of a resistance load.)

Connection

External connection

Removable terminal block M3 screw 20-pole

Applicable wire size

AWG #22-18

Output signal display

Note)

LED lights on when each point becomes ON at the logic side
ONL: when normal (green LED), ERR: when there isabnormality or the fuse has been blown (red LED)

Insulation method

Photocoupler insulation

Dielectric strength

AC 1500 V 1 minute Between the output terminals collected
together and the FG

Insulation resistance

10 MΩ or more when measured with DC 500 V insulation
resistance tester
Between the output terminals collected together and the FG

Dilating conditions

Simultaneous ON ratio: Maximum 100% (at DC 26.4 V/55°C)
Simultaneous ON ratio: Maximum 85% (at DC 30 V/55°C)

External power supply

DC 12 - 24 V 33 mA: for driving transistors

Internal current consumption

DC 24 V 20 mA or less (when all points are ON)

Number of occupied words

In the case of the SX bus being connected directly: 2 words,
In the case of being on the remote I/O link: 1 word

WeightApprox. 150 g

Note)

The applicable wire size depends on the crimp-style terminals used. Refer to “4-4-3 Input and output
wiring” for details.

3-36Chapter 3 Specifications

Digital output< Name of each part >State display LED
Removable terminal blockM3 20-pole

Chapter 3
Specifications

Specifications
plate< External connection >Signal nameNote 1) Internal connections are made foreach of the common terminals(Terminal numbers P: 7, 9, 17,
19, M: 8, 10, 18, 20).
Note 2) NC depicts a terminal to which aninternal circuit is not connected.
Note, however, that it should not
be used as a repeating terminaletc.
Terminal number< Circuit configuration >Internal circuit

Fuse

3-37

Chapter 3 Specifications

Digital output(2)

Transistor sync output 16 points (NP1Y16T09P6)

Item

Specifications

Model

NP1Y16T09P6

Number of output points (common configuration)

16 points (8 points/common 2 circuits)

Output power
conditions

Rated voltage

DC 12 - 24 V

Maximum allowable voltage

DC 10.2 - 30 V

Characteristics of
output circuit

Output form

Sync output

Maximum load current

0.6 A/point, 4 A/common

Output voltage drop

1.5 V or less (at 0.6 A)

Output delay
time

Chapter 3
Specifications

Output protection
form

ON → OFF

1 ms or less
1 ms or less

Leakage current at the time ofOFF

Maximum 0.1 mA

Output typeTransistor output

Withstand surge current

2 A 10 ms

Built-in fuse

125 V 7 A × 2(The replacement of fuses cannot be performed by users.)

Surge suppression circuit

Varistor

Other output protection

None

Maximum opening/closing frequency
Connection

OFF → ON

1800 times/hour (This is a restriction at the time of an induced
load. There is no restriction at the time of a resistance load.)

External connection

Removable terminal block M3 screw 20-pole

Applicable wire size

AWG #22-18

Output signal display

Note)

LED lights on when each point becomes ON At the logicside
ONL: when normal (green LED), ERR: when there isabnormality or the fuse has been blown (red LED)

Insulation method

Photocoupler insulation

Dielectric strength

AC 1500 V 1 minute Between the output terminals collected
together and the FG

Insulation resistance

10 MΩ or more when measured with DC 500 V insulation
resistance tester
Between the output terminals collected together and the FG

Dilating conditions

Simultaneous ON ratio: Maximum 100% (at DC 26.4 V/55°C)
Simultaneous ON ratio: Maximum 85% (at DC 30 V/55°C)

External power supply

DC 12 - 24 V 30 mA: for driving transistors

Internal current consumption

DC 24 V 42 mA or less (when all points are ON)

Number of occupied words

In the case of the SX bus being connected directly: 2 words,
In the case of being on the remote I/O link: 1 word

WeightApprox. 160 g

Note)

The applicable wire size depends on the crimp-style terminals used. Refer to “4-4-3 Input and output
wiring” for details.

3-38

Chapter 3 Specifications

Digital output< Name of each part >State display LED
Removable terminal blockM3 20-pole

Chapter 3
Specifications

Specifications
plate< External connection >Signal name

Note)

Common terminals P0, P1(Terminal numbers 9, 19) and
M0, M1 (Terminal numbers 10,20) are electrically separation
insulated.

Terminal number< Circuit configuration >Internal circuit

Fuse

3-39

Chapter 3 Specifications

Digital output(3)

Transistor sync output 32 points (NP1Y32T09P1)

Item

Specifications

Model

NP1Y32T09P1

Number of output points (common configuration)

32 points (32 points/common 1 circuit)

Output power
conditions

Rated voltage

DC 12 - 24 V

Maximum allowable voltage

DC 10.2 - 30 V

Characteristics of
output circuit

Output form

Sync output

Maximum load current

0.12 A/point, 3.2 A/common

Output voltage drop

1.5 V or less (at 0.12 A)

Output delaytime

OFF → ON
ON → OFF

Leakage current at the time ofOFF

Chapter 3
Specifications

Output protectionform

1 ms or lessMaximum 0.1 mA

Output typeTransistor output

Withstand surge current

0.3 A 10 ms

Built-in fuse

125 V 5 A
(The replacement of fuses cannot be performed by users.)

Surge suppression circuit

Zener diode

Other output protection

None

Maximum opening/closing frequency
Connection

1 ms or less3600 times/hour (This is a restriction at the time of an induced
load. There is no restriction at the time of a resistance load.)

External connection

40-pole connector (FCN-365P040-AU) 1 piece

Applicable wire size

AWG #23 or less (at the time of using a soldering type
Note)connector)

Output signal display

LED lights on when each point becomes ON At the logicside
ONL: when normal (green LED), ERR: when there isabnormality or the fuse has been blown (red LED)

Insulation method

Photocoupler insulation

Dielectric strength

AC 1500 V 1 minute Between the output terminals collected
together and the FG

Insulation resistance

10 MΩ or more when measured with DC 500 V insulation
resistance tester
Between the output terminals collected together and the FG

Dilating conditions

None

External supply voltage

DC 12 - 24 V 52 mA: for driving transistors

Internal current consumption

DC 24 V 45 mA or less (when all points are ON)

Number of occupied words

2 words

WeightApprox. 130 g

Note)

The applicable wire size depends on the connector used. Refer to “4-4-3 Input and output wiring” fordetails.

3-40

Chapter 3 Specifications

Digital output< Name of each part >State display LED
LED display change-overswitchState of the switch

Lighting bit

Connector 40-pole
Specifications
plate

Chapter 3
Specifications< External connection >Signal name
Connector pin number

Note) NC depicts a pin
to which aninternal circuit is
not connected.
Note, however,that it should not
be used as arepeating pin etc.

Front panel(FCN-365 pin
arrangement)<Circuit configuration>

Internal circuit

Fuse

3-41

Chapter 3 Specifications

Digital output(4)

Transistor sync output with a pulse output function
32 points (NP1Y32T09P1-A)

Item

Specifications

Model

NP1Y32T09P1-A

Number of output points (common configuration)

32 points (32 points/common 1 circuit)

Output power
conditions

Rated voltage

DC 12 - 24 V

Maximum allowable voltage

DC 10.2 - 30 V

Characteristics of
output circuit

Output form

Sync output

Maximum load current

0.12 A/point, 3.2 A/common

Output voltage drop

1.5 V or less (at 0.12 A)

Output delaytime

OFF → ON
ON → OFFPorts 1 through 8:
20 µs or less (when the load current exceeds 20 mA)
25 µs (when the load current is 10 - 20 mA)
Ports 9 through 32:
1 ms or less

Chapter 3
Specifications

Leakage current at the time ofOFF

Output protection
form

Maximum 0.1 mA

Output typeTransistor output

Withstand surge current

0.3 A 10 ms

Built-in fuse

125 V 5 A
(The replacement of fuses cannot be performed by users.)

Surge suppression circuit

Zener diode

Other output protection

None

Maximum opening/closing frequency

3600 times/hour (This is a restriction at the time of an induced
load. There is no restriction at the time of a resistance load.)

Connection

External connection

40-pole connector (FCN-365P040-AU) 1 piece

Applicable wire size

AWG #23 or less (at the time of using a soldering type
Note)connector)

Output signal display

LED lights on when each point becomes ON At the logicside
ONL: when normal (green LED), ERR: when there isabnormality or the fuse has been blown (red LED)

Insulation method

Photocoupler insulation

Dielectric strength

AC 1500 V 1 minute Between the output terminals collected
together and the FG

Insulation resistance

10 MΩ or more when measured with DC 500 V insulation
resistance tester
Between the output terminals collected together and the FG

Dilating conditions

Simultaneous ON ratio: Maximum 80% (at DC 24 V/55°C)
Simultaneous ON ratio: Maximum 75% (at DC 26.4 V/55°C)
Simultaneous ON ratio: Maximum 65% (at DC 30 V/55°C)

External supply voltage

DC 12 - 24 V 40 mA: for driving transistors

Internal current consumption

DC 24 V 50 mA or less (when all points are ON)

Number of occupied words

14 words (input: 6 word/output 8 word)

WeightApprox. 200 g

Note)

The applicable wire size depends on connector used. Refer to “4-4-3 Input and output wiring” fordetails.

3-42Chapter 3 Specifications

Digital output< Name of each part >State display LED
LED display change-overswitchState of the switch

Connector 40-pole

Lighting bit

Specifications
plate

Chapter 3
Specifications< External connection >Signal name
Connector pin number
Port 9Port 10
Port 11
Port 12
Port 13
Port 14
Port 15
Port 16
Port 17
Port 18
Port 19
Port 20

Port 21
Port 22
Port 23
Port 24
Port 25
Port 26
Port 27
Port 28
Port 29
Port 30
Port 31
Port 32

Port 1

Port 5

Port 2
Port 3

Port 6
Port 7

Port 4

Port 8Note 1) The figures in the parentheses: ( ) in the signal namecolumn shows the offset address and bit position.
Note 2) Ports 1 through 8 are at the same time used for thepulse set output as well.
Note 3) For the detailed specifications of this module and its
handling, refer to a manual dedicated to it (FH212).

3-43

Chapter 3 Specifications

Digital output(5)

Transistor sync output 64 points (NP1Y64T09P1)

Item

Specifications

Model

NP1Y64T09P1

Number of output points (common configuration)

64 points (32 points/common 2 circuits)

Output power
conditions

Rated voltage

DC 12 - 24 V

Maximum allowable voltage

DC 10.2 - 30 V

Characteristics of
output circuit

Output form

Sync output

Maximum load current

0.12 A/point, 3.2 A/common

Output voltage drop

1.5 V or less (at 0.12 A)

Output delay
time

Chapter 3
Specifications

Output protection
form

ON → OFF

1 ms or less
1 ms or less

Leakage current at the time ofOFF

Maximum 0.1 mA

Output typeTransistor output

Withstand surge current

0.3 A 10 ms

Built-in fuse

125 V 5 A × 2(The replacement of fuses cannot be performed by users.)

Surge suppression circuit

Zener diode

Other output protection

None

Maximum opening/closing frequency
Connection

OFF → ON

3600 times/hour (This is a restriction at the time of an induced
load. There is no restriction at the time of a resistance load.)

External connection

40-pole connector (FCN-365P040-AU) 2 pcs

Applicable wire size

AWG #23 or less (at the time of using a soldering type
Note)connector)

Output signal display

LED lights on when each point becomes ON At the logicside
ONL: when normal (green LED), ERR: when there isabnormality or the fuse has been blown (red LED)

Insulation method

Photocoupler insulation

Dielectric strength

AC 1500 V 1 minute Between the output terminals collected
together and the FG

Insulation resistance

10 MΩ or more when measured with DC 500 V insulation
resistance tester
Between the output terminals collected together and the FG

Dilating conditions

Simultaneous ON ratio: Maximum 90% (at DC 24 V/55°C)
Simultaneous ON ratio: Maximum 85% (at DC 26.4 V/55°C)
Simultaneous ON ratio: Maximum 85% (at DC 30 V/55°C)

External supply voltage

DC 12 - 24 V 80 mA: for driving transistors

Internal current consumption

DC 24 V 90 mA or less (when all points are ON)

Number of occupied words

4 words

WeightApprox. 180 g

Note)

The applicable wire size depends on the connector used. Refer to “4-4-3 Input and output wiring” fordetails.

3-44Chapter 3 Specifications

Digital output< Name of each part >State display LED
LED display change-overswitchState of the switch

Lighting bit

Connector 40-pole

Specifications
plate< External connection >Signal name
Connector pin
numberSignal name
Connector pin
number

Note 1) Common terminals P0, P1 and M0, M1 are electrically separation insulated.
Note 2) NC depicts a pin to which an internal circuit is not connected. Note, however,that it should not be used as a repeating pin etc.

<Circuit configuration>

Internal circuit

Fuse

3-45

Chapter 3
Specifications

Connector 40-poleChapter 3 Specifications

Digital output(6)

Transistor source output 8 points (NP1Y08U0902)

Item

Specifications

Model

NP1Y08U0902

Number of output points (common configuration)

8 points (8 points/common 1 circuit)
With 4 pcs. each of P, M common terminals

Output power
conditions

Rated voltage

DC 12 - 24 V

Maximum allowable voltage

DC 10.2 - 30 V

Characteristics of
output circuit

Output form

Source output

Maximum load current

2.4 A/point, 8 A/common

Output voltage drop

2 V or less (at 2.4 A)

Output delaytime

OFF → ON

1 ms or less

ON → OFF

1 ms or less

Leakage current at the time ofOFF

Chapter 3
Specifications

Output protection
form

Maximum 0.1 mA

Output typeTransistor output

Withstand surge current

6 A 10 ms

Built-in fuse

125 V 15 A × 2(The replacement of fuses cannot be performed by users.)

Surge suppression circuit

Varistor

Other output protection

None

Maximum opening/closing frequency

1800 times/hour (This is a restriction at the time of an induced
load. There is no restriction at the time of a resistance load.)

Connection

External connection

Removable terminal block M3 screw 20-pole

Applicable wire size

AWG #22-18

Output signal display

Note)

LED lights on when each point becomes ON At the logicside
ONL: when normal (green LED), ERR: when there isabnormality or the fuse has been blown (red LED)

Insulation method

Photocoupler insulation

Dielectric strength

AC 1500 V 1 minute Between the output terminals collected
together and the FG

Insulation resistance

10 MΩ or more when measured with DC 500 V insulation
resistance tester
Between the output terminals collected together and the FG

Dilating conditions

Simultaneous ON ratio: Maximum 100% (at DC 26.4 V/55°C)
Simultaneous ON ratio: Maximum 85% (at DC 30 V/55°C)

External power supply

DC 12 - 24 V 33 mA: for driving transistors

Internal current consumption

DC 24 V 20 mA or less (when all points are ON)

Number of occupied words

In the case of the SX bus being connected directly: 2 words,
In the case of being on the remote I/O link: 1 word

WeightApprox. 150 g

Note)

The applicable wire size depends on the crimp-style terminals used. Refer to “4-4-3 Input and output
wiring” for details.

3-46Chapter 3 Specifications

Digital output< Name of each part >State display LED
Removable terminal blockM3 20-pole

Chapter 3
Specifications

Specifications
plate< External connection >Signal nameNote 1) Internal connections are made foreach of the common terminals(Terminal numbers P: 7, 9, 17,
19, M: 8, 10, 18, 20).
Note 2) NC depicts a terminal to which aninternal circuit is not connected.
Note, however, that it should not
be used as a repeating pin etc.

Terminal number< Circuit configuration >Internal circuit

Fuse

3-47

Chapter 3 Specifications

Digital output(7)

Transistor source output 16 points (NP1Y16U09P6)

Item

Specifications

Model

NP1Y16U09P6

Number of output points (common configuration)

16 points (8 points/common 2 circuits)

Output power
conditions

Rated voltage

DC 12 - 24 V

Maximum allowable voltage

DC 10.2 - 30 V

Characteristics of
output circuit

Output form

Source output

Maximum load current

0.6 A/point, 4 A/common

Output voltage drop

1.5 V or less (at 0.6 A)

Output delay
time

Chapter 3
Specifications

Output protection
form

ON → OFF

1 ms or less
1 ms or less

Leakage current at the time ofOFF

Maximum 0.1 mA

Output typeTransistor output

Withstand surge current

3 A 10 ms

Built-in fuse

125 V 7 A × 2(The replacement of fuses cannot be performed by users.)

Surge suppression circuit

Varistor

Other output protection

None

Maximum opening/closing frequency
Connection

OFF → ON

1800 times/hour (This is a restriction at the time of an induced
load. There is no restriction at the time of a resistance load.)

External connection

Removable terminal block M3 screw 20-pole

Applicable wire size

AWG #22-18

Output signal display

Note)

LED lights on when each point becomes ON At the logicside
ONL: when normal (green LED), ERR: when there isabnormality or the fuse has been blown (red LED)

Insulation method

Photocoupler insulation

Dielectric strength

AC 1500 V 1 minute Between the output terminals collected
together and the FG

Insulation resistance

10 MΩ or more when measured with DC 500 V insulation
resistance tester
Between the output terminals collected together and the FG

Dilating conditions

Simultaneous ON ratio: Maximum 100% (at DC 24 V/55°C)
Simultaneous ON ratio: Maximum 90% (at DC 26.4 V/55°C)
Simultaneous ON ratio: Maximum 75% (at DC 30 V/55°C)

External power supply

DC 12 - 24 V 43 mA: for driving transistors

Internal current consumption

DC 24 V 30 mA or less (when all points are ON)

Number of occupied words

In the case of the SX bus being connected directly: 2 words,
In the case of being on the remote I/O link: 1 word

WeightApprox. 160 g

Note)

The applicable wire size depends on the crimp-style terminals used. Refer to “4-4-3 Input and output
wiring” for details.

3-48Chapter 3 Specifications

Digital output< Name of each part >State display LED
Removable terminal blockM3 20-pole

Chapter 3
Specifications

Specifications
plate< External connection >Signal name

Note)

Common terminals P0, P1(Terminal numbers 9, 19) and
M0, M1 (Terminal numbers 10,20) are electrically separation
insulated.

Terminal number< Circuit configuration >Internal circuit

Fuse

3-49

Chapter 3 Specifications

Digital output(8)

Transistor source output 32 points (NP1Y32U09P1)

Item

Specifications

Model

NP1Y32U09P1

Number of output points (common configuration)

32 points (32 points/common 1 circuit)

Output power
conditions

Rated voltage

DC 12 - 24 V

Maximum allowable voltage

D 10.2 - 30 V

Characteristics of
output circuit

Output form

Source output

Maximum load current

0.12 A/point, 3.2 A/common

Output voltage drop

1.5 V or less (at 0.12 A)

Output delay
time

Chapter 3
Specifications

Output protection
form

ON → OFF

1 ms or less
1 ms or less

Leakage current at the time ofOFF

Maximum 0.1 mA

Output typeTransistor output

Withstand surge current

0.8 A 10 ms

Built-in fuse

125 V 2.5 A × 2(The replacement of fuses cannot be performed by users.)

Surge suppression circuit

Zener diode

Other output protection

None

Maximum opening/closing frequency
Connection

OFF → ON

3600 times/hour (This is a restriction at the time of an induced
load. There is no restriction at the time of a resistance load.)

External connection

40-pole connector (FCN-365P040-AU) 1 piece

Applicable wire size

AWG #23 or less (at the time of using a soldering type
Note)connector)

Output signal display

LED lights on when each point becomes ON At the logicside
ONL: when normal (green LED), ERR: when there isabnormality or the fuse has been blown (red LED)

Insulation method

Photocoupler insulation

Dielectric strength

AC 1500 V 1 minute Between the output terminals collected
together and the FG

Insulation resistance

10 MΩ or more when measured with DC 500 V insulation
resistance tester
Between the output terminals collected together and the FG

Dilating conditions

None

External supply voltage

DC 12 - 24 V 40 mA: for driving transistors

Internal current consumption

DC 24 V 45 mA or less (when all points are ON)

Number of occupied words

2 words

WeightApprox. 140 g

Note)

The applicable wire size depends on connector used. Refer to “4-4-3 Input and output wiring” fordetails.

3-50

Chapter 3 Specifications

Digital output< Name of each part >State display LED
LED display change-overswitchState of the switch

Lighting bit

Connector 40-pole
Specifications
plate

Chapter 3
Specifications< External connection >Signal name
Connector pin number

Note) NC depicts aterminal to which
an internal circuit
is not connected.
Note, however,that it should not
be used as arepeating pin etc.

Front panel(FCN-365 pin
arrangement)<Circuit configuration>

Internal circuit

Fuse

3-51

Chapter 3 Specifications

Digital output(9)

Transistor source output 64 points (NP1Y64U09P1)

Item

Specifications

Model

NP1Y64U09P1

Number of output points (common configuration)

64 points (32 points/common 2 circuits)

Output power
conditions

Rated voltage

DC 12 - 24 V

Maximum allowable voltage

DC 10.2 - 30 V

Characteristics of
output circuit

Output form

Source output

Maximum load current

0.12 A/point, 3.2 A/common

Output voltage drop

1.5 V or less (at 0.12 A)

Output delay
time

Chapter 3
Specifications

Output protection
form

ON → OFF

1 ms or less
1 ms or less

Leakage current at the time ofOFF

Maximum 0.1 mA

Output typeTransistor output

Withstand surge current

0.8 A 10 ms

Built-in fuse

125 V 2.5 A × 2(The replacement of fuses cannot be performed by users.)

Surge suppression circuit

Zener diode

Other output protection

None

Maximum opening/closing frequency
Connection

OFF → ON

3600 times/hour (This is a restriction at the time of an induced
load. There is no restriction at the time of a resistance load.)

External connection

40-pole connector (FCN-365P040-AU) 2 pcs

Applicable wire size

AWG #23 or less (at the time of using a soldering type
Note)connector)

Output signal display

LED lights on when each point becomes ON at the logic side
ONL: when normal (green LED), ERR: when there isabnormality or the fuse has been blown (red LED)

Insulation method

Photocoupler insulation

Dielectric strength

AC 1500 V 1 minute Between the output terminals collected
together and the FG

Insulation resistance

10 MΩ or more when measured with DC 500 V insulation
resistance tester
Between the output terminals collected together and the FG

Dilating conditions

Simultaneous ON ratio: Maximum 90% (at DC 24 V/55°C)
Simultaneous ON ratio: Maximum 85% (at DC 26.4 V/55°C)
Simultaneous ON ratio: Maximum 85% (at DC 30 V/55°C)

External supply voltage

DC 12 - 24 V 80 mA: for driving transistors

Internal current consumption

DC 24 V 90 mA or less (when all points are ON)

Number of occupied words

4 words

WeightApprox. 180 g

Note)

The applicable wire size depends on the connector used. Refer to “4-4-3 Input and output wiring” fordetails.

3-52

Chapter 3 Specifications

Digital output< Name of each part >State display LED
LED display change-overswitchState of the switch

Lighting bit

Connector 40-pole

Specifications
plate< External connection >Signal name
Connector pin
numberSignal name
Connector pin
number

Note 1) Common terminals P0, P1 and M0, M1 are electrically separation insulated.
Note 2) NC depicts a pin to which an internal circuit is not connected. Note, however,that it should not be used as a repeating terminal etc.

<Circuit configuration>

Internal circuit

Fuse

3-53

Chapter 3
Specifications

Connector 40-poleChapter 3 Specifications

Digital output(10)

SSR output 6 points (NP1Y06S)

Item

Specifications

Model

NP1Y06S

Number of output points (common configuration)

6 points (2 points/common 3 circuits)

Output power
conditions

AC 100 - 240 V

Characteristics of
output circuit

Rated voltage
Maximum allowable voltage

AC 85 - 264 V

Rated frequency

50/60 Hz

Maximum allowable frequency

47 - 63 Hz

Output form

AC output

Maximum load current

2.2 A/point, 4.4 A/common

Output voltage drop

2 V or less (at 2.2 A)

Chapter 3
Specifications

Output delaytime

Output protectionform

10 ms or less

ON → OFF10 ms or less

Leakage current at the time ofOFF

Approx. 1 mA (at AC 200 V 60 Hz)

Minimum opening/closing
current

10 mA/AC 100 V

Output type

Triac output

Withstand surge current

20 A 1 cycle

Surge suppression circuit

CR Absorber + Varistor

Other output protection

None

Maximum opening/closing frequency
Connection

OFF → ON

1800 times/hour

External connection

Removable terminal block M3 screw 10-pole

Applicable wire size

AWG #22-18

Output signal display

Note)

LED lights on when each point becomes ON At the logicside
ONL: when normal (green LED), ERR: when there isabnormality or the fuse has been blown (red LED)

Insulation method

Photocoupler insulation

Dielectric strength

AC 2830 V 1 minute Between the output terminals collected
together and the FG

Insulation resistance

10 MΩ or more when measured with DC 500 V insulation
resistance tester
Between the output terminals collected together and the FG

Dilating conditions

Simultaneous ON ratio: Maximum 33% (at AC 132 V/55°C)
Simultaneous ON ratio: Maximum 16% (at AC 264 V/55°C)

External supply voltage

AC 100 - 240 V: for signals

Internal current consumption

DC 24 V 60 mA or less (when all points are ON)

Number of occupied words

In the case of the SX bus being connected directly: 2 words,
In the case of being on the remote I/O link: 1 word

WeightApprox. 190 g

Note)

The applicable wire size depends on the crimp-style terminals used. Refer to “4-4-3 Input and output
wiring” for details.

3-54Chapter 3 Specifications

Digital output< Name of each part >State display LED
Removable terminal blockM3 10-pole

Chapter 3
Specifications

Specifications
plate< External connection >Signal nameNote 1) Common terminals (Terminal
numbers 3, 6, 9) are electricallyseparation insulated.
Note 2) NC depicts a terminal to which aninternal circuit is not connected.
Note, however, that it should not
be used as a repeating terminaletc.
Terminal number< Circuit configuration >Internal circuit

Common3-55

Chapter 3 Specifications

Digital output(11)

SSR output 8 points (NP1Y08S)

Item

Specifications

Model

NP1Y08S

Number of output points (common configuration)

8 points (independent contacts)

Output power
conditions

AC 100 - 240 V

Characteristics of
output circuit

Rated voltage
Maximum allowable voltage

AC 85 - 264 V

Rated frequency

50/60 Hz

Maximum allowable frequency

47 - 63 Hz

Output form

AC output

Maximum load current

2.2 A/point

Output voltage drop

2 V or less (at 2.2 A)

Chapter 3
Specifications

Output delaytime

Output protectionform

10 ms or less

ON → OFF10 ms or less

Leakage current at the time ofOFF

Approx. 1 mA (at AC 200 V 60 Hz)

Minimum opening/closing
current

10 mA/AC 100 V

Output type

Triac output

Withstand surge current

20 A 1 cycle

Surge suppression circuit

CR Absorber + Varistor

Other output protection

None

Maximum opening/closing frequency
Connection

OFF → ON

1800 times/hour

External connection

Removable terminal block M3 screw 20-pole

Applicable wire size

AWG #22-18

Note)

Output signal display

LED lights on when each point becomes ON At the logicside
ONL: when normal (green LED), ERR: when there isabnormality or the fuse has been blown (red LED)

Insulation method

Photocoupler insulation

Dielectric strength

AC 1500 V 1 minute Between the output terminals collected
together and the FG

Insulation resistance

10 MΩ or more when measured with DC 500 V insulation
resistance tester
Between the output terminals collected together and the FG

Dilating conditions

Simultaneous ON ratio: Maximum 25% (at AC 132 V/55°C)
Simultaneous ON ratio: Maximum 12% (at AC 264 V/55°C)

External supply voltage

AC 100 - 240 V: for signals

Internal current consumption

DC 24 V 80 mA or less (when all points are ON)

Number of occupied words

In the case of the SX bus being connected directly: 2 words,
In the case of being on the remote I/O link: 1 word

WeightApprox. 200 g

Note)

The applicable wire size depends on the crimp-style terminals used. Refer to “4-4-3 Input and output
wiring” for details.

3-56Chapter 3 Specifications

Digital output< Name of each part >State display LED
Removable terminal blockM3 20-pole

Chapter 3
Specifications

Specifications
plate< External connection >Signal nameNote)

NC depicts a terminal to which aninternal circuit is not connected.
Note, however, that it should not
be used as a repeating terminaletc.

Terminal number< Circuit configuration >Internal circuit

3-57

Chapter 3 Specifications

Digital output(12)

Relay output 8 points (NP1Y08R-04)

Item

Specifications

Model

NP1Y08R-04

Number of output points (common configuration)

8 points (4 points/common 2 circuit)

Output power
conditions

AC 240 V DC 110 V

Characteristics of
output circuit

Rated voltage
Maximum allowable voltage

AC 264 V or less, DC 140 V or less

Rated frequency-

Maximum allowable frequency-

Maximum load current

DC 30 V/AC 264 V: 2.2 A/point, 4 A/common
DC 110 V: 0.2 A/point, 0.8 A/common

Minimum opening/closing
voltage and current

DC 5 V 1 mA

Output delaytime

OFF → ON

Approx. 10 ms

ON → OFFApprox. 10 ms

Leakage current at the time ofOFF

Chapter 3
Specifications

Output protection
form

Built-in fuse

None

Output type

Relay output (used both for AC and DC)

Surge suppression circuit

Varistor

Other output protection

None

Maximum opening/closing frequency
Connection

Maximum 0.1 mA (at AC 200 V 60 Hz)

1800 times/hour

External connection

Removable terminal block M3 screw 10-pole

Applicable wire size

AWG #22-18

Note)

Output signal display

LED lights on when each point becomes ON At the logicside
ONL: when normal (green LED), ERR: when there isabnormality or the fuse has been blown (red LED)

Insulation method

Relay insulation, photocoupler insulation

Dielectric strength

AC 2830 V 1 minute Between the output terminals collected
together and the FG

Insulation resistance

10 MΩ or more when measured with DC 500 V insulation
resistance tester
Between the output terminals collected together and the FG

Dilating conditions

None

External supply voltage

AC 240 V, DC 110 V: for signals

Internal current consumption

DC 24 V 80 mA or less (when all points are ON)

Number of occupied words

In the case of the SX bus being connected directly: 2 words,
In the case of being on the remote I/O link: 1 word

WeightApprox. 150 g

Note)

The applicable wire size depends on the crimp-style terminals used. Refer to “4-4-3 Input and output
wiring” for details.

3-58Chapter 3 Specifications

Digital output< Name of each part >State display LED
Removable terminal blockM3 10-pole

Chapter 3
Specifications

Specifications
plate< External connection >Signal name

Note)

Common terminals C0, C1(Terminal numbers 5, 10) areelectrically separation insulated.

Terminal number< Circuit configuration >Internal circuit

3-59Chapter 3 Specifications

Digital output(13)

Relay output 16 points (NP1Y16R-08)

Item

Specifications

Model

NP1Y16R-08

Number of output points (common configuration)

16 points (8 points/common 2 circuit)

Output power
conditions

AC 240 V DC 110 V

Characteristics of
output circuit

Chapter 3
Specifications

Output protection
form

Rated voltage
Maximum allowable voltage

AC 264 V or less, DC 140 V or less

Rated frequency-

Maximum allowable frequency-

Output form

Relay output

Maximum load current

DC 30 V/AC 264 V: 2.2 A/point, 8 A/common
DC 110 V: 0.2 A/point, 1.6 A/common

Minimum opening/closing
voltage and current

DC 5 V 1 mA

Output delaytime

OFF → ON

Approx. 10 ms

ON → OFFApprox. 10 ms

Leakage current at the time ofOFF

Maximum 0.1 mA (at AC 200 V 60 Hz)

Built-in fuse

None

Output type

Relay output (used both for AC and DC)

Surge suppression circuit

Varistor

Other output protection

None

Maximum opening/closing frequency
Connection

1800 times/hour

External connection

Removable terminal block M3 screw 20-pole

Applicable wire size

AWG #22-18

Output signal display

Note)

LED lights on when each point becomes ON At the logicside
ONL: when normal (green LED), ERR: when there isabnormality or the fuse has been blown (red LED)

Insulation method

Relay insulation, photocoupler insulation

Dielectric strength

AC 1500 V 1 minute Between the output terminals collected
together and the FG

Insulation resistance

10 MΩ or more when measured with DC 500 V insulation
resistance tester
Between the output terminals collected together and the FG

Dilating conditions

None

External supply voltage

AC 240 V, DC 110 V: for signals

Internal current consumption

DC 24 V 176 mA or less (when all points are ON)

Number of occupied words

In the case of the SX bus being connected directly: 2 words,
In the case of being on the remote I/O link: 1 word

WeightApprox. 190 g

Note)

The applicable wire size depends on the crimp-style terminals used. Refer to “4-4-3 Input and output
wiring” for details.

3-60Chapter 3 Specifications

Digital output< Name of each part >State display LED
Removable terminal blockM3 20-pole

Specifications
plate

Chapter 3
Specifications< External connection >Signal nameNote 1) Common terminals C0, C1(Terminal numbers 9, 18) areelectrically separation insulated.
Note 2) NC depicts a terminal to which aninternal circuit is not connected.
Note, however, that it should not
be used as a repeating terminaletc.
Terminal number< Circuit configuration >Internal circuit

3-61

Chapter 3 Specifications

Digital input and output

3-5-5Individual specifications of the digital I/O mixed module(1)

DC 24 V source input 8 points/transistor sync output 8 points (NP1W1606T)

Item

Specifications

Model
Number of input points (common configuration)
Input signal
Rated voltage
conditions
Maximum allowable voltage
Allowable ripple ratio
Characteristics of
Input form
input circuit
Rated current
Input impedanceStandard
OFF → ON
operating range
ON → OFFNP1W1606T
8 points (8 points/common 1 circuit)
DC 24 VDC 30 V
5% or less
Source input
7 mA (at DC 24 V)
3.3 kΩ
15 - 30 V
0-5V
0.7 ms (hard filter time) + (soft filter time)
The soft filter time is variable collectively depending on thesetting of parameters.
(OFF → ON) - (ON → OFF):1 - 1 ms, 3 - 3 ms (Default), 3 - 10 ms, 10 - 10 ms,
30 - 30 ms, 100 - 100 ms
DC type 1
8 points (8 points/common 1 circuit)
DC 12 - 24 V
DC 10.2 - 30 V
Sync output
0.6 A/point, 4 A/common
1.5 V or less
1 ms or less
1 ms or lessMaximum 0.1 mA

Chapter 3
Specifications

Input delay time

OFF → ON
ON → OFF

Input type
Number of output points (common configuration)
Output power
Rated voltage
conditions
Maximum allowable voltage
Characteristics of
Output form
output circuit
Maximum load current
Output voltage drop
Output delay
OFF → ONtime
ON → OFF
Leakage current at the time ofOFF
Output type
Withstand surge current
Output protection
Built-in fuse
form
Surge suppression circuit
Other output protection
Maximum opening/closing frequency
Connection

External connection
Applicable wire size

I/O signal display

Insulation method
Dielectric strength
Insulation resistance

Dilating conditions
External supply voltage
Internal current consumption
Number of occupied words
WeightNote)

Transistor output
2 A 10 ms
125 V 7 A
(The replacement of fuses cannot be performed by users.)
Varistor
None
1800 times/hour (This is a restriction at the time of an induced
load. There is no restriction at the time of a resistance load.)
Removable terminal block M3 screw 20-pole
Note)
AWG #22-18
LED lights on when each point becomes ON At the logicside
ONL: when normal (green LED), ERR: when there isabnormality or the fuse has been blown (red LED)
Photocoupler insulation
AC 1500 V 1 minute Between the I/O terminals collected
together and the FG
10 MΩ or more when measured with DC 500 V insulation
resistance tester
Between the I/O terminals collected together and the FG
Simultaneous ON ratio: Maximum 100% (at DC 26.4 V/55°C)
Simultaneous ON ratio: Maximum 75% (at DC 30 V/55°C)
DC 24 V: for input signals, DC 12 - 24 V 20 mA: for driving
transistors
DC 24 V 35 mA or less (when all points are ON)
2 words
Approx. 150 g

The applicable wire size depends on the crimp-style terminals used. Refer to “4-4-3 Input and output
wiring” for details.

3-62Chapter 3 Specifications

Digital input and output< Name of each part >State display LED
Removable terminal blockM3 20-pole

Specifications
plate

Chapter 3
Specifications< External connection >Signal nameNote)

NC depicts a terminal to which aninternal circuit is not connected.
Note, however, that it should not
be used as a repeating terminaletc.

Terminal number< Circuit configuration >Output circuit

Input circuit

Internal circuit

Internal circuit

Fuse

3-63

Chapter 3 Specifications

Digital input and output(2)

DC 24 V sync input 8 points/transistor source output 8 points(NP1W1606U)

Item

Specifications

Model
Number of input points (common configuration)
Input signal
Rated voltage
conditions
Maximum allowable voltage
Allowable ripple ratio
Characteristics of
Input form
input circuit
Rated current
Input impedanceStandard
OFF → ON
operating range
ON → OFFNP1W1606U
8 points (8 points/common 1 circuit)
DC 24 VDC 30 V
5% or lessSync input
7 mA (at DC 24 V)
3.3 kΩ
15 - 30 V
0-5V
0.7 ms (hard filter time) + (soft filter time)
The soft filter time is variable collectively depending on thesetting of parameters.
(OFF → ON) - (ON → OFF):1 - 1 ms, 3 - 3 ms (Default), 3 - 10 ms, 10 - 10 ms,
30 - 30 ms, 100 - 100 ms
DC type 1
8 points (8 points/common 1 circuit)
DC 12 - 24 V
DC 10.2 - 30 V
Source output
0.6 A/point, 4 A/common
1 V or less
1 ms or less
1 ms or lessMaximum 0.1 mA

Chapter 3
Specifications

Input delay time

OFF → ON
ON → OFF

Input type
Number of output points (common configuration)
Output signal
Rated voltage
conditions
Maximum allowable voltage
Characteristics of
Output form
output circuit
Maximum load current
Output voltage drop
Output delay
OFF → ONtime
ON → OFF
Leakage current at the time ofOFF
Output type
Withstand surge current
Maximum opening/closing frequency
Output protection
form

Connection

Built-in fuse
Surge suppression circuit
Other output protection
External connection
Applicable wire size

I/O signal display

Insulation method
Dielectric strength
Insulation resistance

Dilating conditions

External supply voltage
Internal current consumption
Number of occupied words
WeightNote)

Transistor output
3 A 10 ms
1800 times/hour (This is a restriction at the time of an induced
load. There is no restriction at the time of a resistance load.)
125 V 7 A
(The replacement of fuses cannot be performed by users.)
Varistor
None
Removable terminal block M3 screw 20-pole
Note)
AWG #22-18
LED lights on when each point becomes ON At the logicside
ONL: when normal (green LED), ERR: when there isabnormality or the fuse has been blown (red LED)
Photocoupler insulation
AC 1500 V 1 minute Between the I/O terminals collected
together and the FG
10 MΩ or more when measured with DC 500 V insulation
resistance tester
Between the I/O terminals collected together and the FG
Simultaneous ON ratio: Maximum 100% (at DC 24 V/55°C)
Simultaneous ON ratio: Maximum 90% (at DC 26.4 V/55°C)
Simultaneous ON ratio: Maximum 75% (at DC 30 V/55°C)
DC 24 V: for input signals, DC 12 - 24 V 20 mA: for driving
transistors
DC 24 V 35 mA or less (when all points are ON)
2 words
Approx. 150 g

The applicable wire size depends on the crimp-style terminals used. Refer to “4-4-3 Input and output
wiring” for details.

3-64Chapter 3 Specifications

Digital input and output< Name of each part >State display LED
Removable terminal blockM3 20-pole

Specifications
plate

Chapter 3
Specifications< External connection >Signal nameNote)

NC depicts a terminal to which aninternal circuit is not connected.
Note, however, that it should not
be used as a repeating terminaletc.

Terminal number< Circuit configuration >Input circuit
Internal circuit

Output circuit
Internal circuit

Fuse

3-65

Chapter 3 Specifications

Digital input and output(3)

DC 24 V source input 16 points/transistor sync output
16 points (NP1W3206T)

Item

Specifications

Model
Number of input points (common configuration)
Input signal
Rated voltage
conditions
Maximum allowable voltage
Allowable ripple ratio
Characteristics of
Input form
input circuit
Rated current
Input impedanceStandard
OFF → ON
operating range
ON → OFFNP1W3206T
16 points (16 points/common 1 circuit)
DC 24 VDC 30 V
5% or less
Source input
4 mA (at DC 24 V)
5.6 kΩ
15 - 30 V
0-5V
0.7 ms (hard filter time) + (soft filter time)
The soft filter time is variable collectively depending on thesetting of parameters.
(OFF → ON) - (ON → OFF):1 - 1 ms, 3 - 3 ms (Default), 3 - 10 ms, 10 - 10 ms,
30 - 30 ms, 100 - 100 ms
DC type 1
16 points (16 points/common 1 circuit)
DC 12 - 24 V
DC 10.2 - 30 V
Sync output
0.12 A/point, 1.6 A/common
1.5 V or less
1 ms or less
1 ms or lessMaximum 0.1 mA

Chapter 3
Specifications

Input delay time

OFF → ON
ON → OFF

Input type
Number of output points (common configuration)
Output power
Rated voltage
conditions
Maximum allowable voltage
Characteristics of
Output form
output circuit
Maximum load current
Output voltage drop
Output delay
OFF → ONtime
ON → OFF
Leakage current at the time ofOFF
Output type
Withstand surge current
Output protection
Built-in fuse
form
Surge suppression circuit
Other output protection
Maximum opening/closing frequency
Connection

External connection
Applicable wire size

I/O signal display

Insulation method
Dielectric strength
Insulation resistance

Dilating conditions
External supply voltage
Internal current consumption
Number of occupied words
WeightNote)

Transistor output
0.3 A 10 ms
125 V 2.5 A(The replacement of fuses cannot be performed by users.)
Zener diodeNone
3600 times/hour (This is a restriction at the time of an induced
load. There is no restriction at the time of a resistance load.)
40-pole connector (FCN-365P040-AU) 1 piece
AWG #23 or lessNote)
(at the time of using a soldering type connector)
LED lights on when each point becomes ON At the logicside
ONL: when normal (green LED), ERR: when there isabnormality or the fuse has been blown (red LED)
Photocoupler insulation
AC 1500 V 1 minute Between the I/O terminals collected
together and the FG
10 MΩ or more when measured with DC 500 V insulation
resistance tester
Between the I/O terminals collected together and the FG
Simultaneous ON ratio: Maximum 100% (at DC 26.4 V/55°C)
Simultaneous ON ratio: Maximum 75% (at DC 30 V/55°C)
DC 24 V: for input signals, DC 12 - 24 V 20 mA: for driving
transistors
DC 24 V 50 mA or less (when all points are ON)
2 words
Approx. 140 g

The applicable wire size depends on the connector used. Refer to “4-4-3 Input and output wiring” fordetails.

3-66

Chapter 3 Specifications

Digital input and output< Name of each part >State display LED
LED display change-overswitchState of the switch

Lighting bit
Input
OutputConnector 40-pole
Specifications
plate

Chapter 3
Specifications< External connection >Signal name
Connector pin number

Note) NC depicts a pin
to which aninternal circuit is
not connected.
Note, however,that it should not
be used as arepeating pin etc.

<Circuit configuration>
Input circuit

Output circuit

Internal circuit

Internal circuit

Fuse

3-67

Chapter 3 Specifications

Digital input and output(4)

DC 24 V sync input 16 points/transistor source output 16 points(NP1W3206U)

Item

Specifications

Model
Number of input points (common configuration)
Input signal
Rated voltage
conditions
Maximum allowable voltage
Allowable ripple ratio
Characteristics of
Input form
input circuit
Rated current
Input impedanceStandard
OFF → ON
operating range
ON → OFFNP1W3206U
16 points (16 points/common 1 circuit)
DC 24 VDC 30 V
5% or lessSync input
4 mA (at DC 24 V)
5.6 kΩ
15 - 30 V
0-5V
0.7 ms (hard filter time) + (soft filter time)
The soft filter time is variable collectively depending on thesetting of parameters.
(OFF → ON) - (ON → OFF):1 - 1 ms, 3 - 3 ms (Default), 3 - 10 ms, 10 - 10 ms,
30 - 30 ms, 100 - 100 ms
DC type 1
16 points (16 points/common 1 circuit)
DC 12 - 24 V
DC 10.2 - 30 V
Source output
0.12 A/point, 1.6 A/common
1.5 V or less
1 ms or less
1 ms or lessMaximum 0.1 mA

Chapter 3
Specifications

Input delay time

OFF → ON
ON → OFF

Input type
Number of output points (common configuration)
Output power
Rated voltage
conditions
Maximum allowable voltage
Characteristics of
Output form
output circuit
Maximum load current
Output voltage drop
Output delay
OFF → ONtime
ON → OFF
Leakage current at the time ofOFF
Output type
Withstand surge current
Maximum opening/closing frequency
Output protection
form

Connection

Built-in fuse
Surge suppression circuit
Other output protection
External connection
Applicable wire size

I/O signal display

Insulation method
Dielectric strength
Insulation resistance

Dilating conditions
External supply voltage
Internal current consumption
Number of occupied words
WeightNote)

Transistor output
0.8 A 10 ms
3600 times/hour (This is a restriction at the time of an induced
load. There is no restriction at the time of a resistance load.)
125 V 2.5 A(The replacement of fuses cannot be performed by users.)
Zener diodeNone40-pole connector (FCN-365P040-AU) 1 piece
AWG #23 or lessNote)
(at the time of using a soldering type connector)
LED lights on when each point becomes ON At the logicside
ONL: when normal (green LED), ERR: when there isabnormality or the fuse has been blown (red LED)
Photocoupler insulation
AC 1500 V 1 minute Between the I/O terminals collected
together and the FG
10 MΩ or more when measured with DC 500 V insulation
resistance tester
Between the I/O terminals collected together and the FG
Simultaneous ON ratio: Maximum 100% (at DC 26.4 V/55°C)
Simultaneous ON ratio: Maximum 75% (at DC 30 V/55°C)
DC 24 V: for input signals, DC 12 - 24 V 20 mA: for driving
transistors
DC 24 V 50 mA or less (when all points are ON)
2 words
Approx. 140 g

The applicable wire size depends on the connector used. Refer to “4-4-3 Input and output wiring” fordetails.

3-68Chapter 3 Specifications

Digital input and output< Name of each part >State display LED
LED display change-overswitchState of the switch

Lighting bit
Input
OutputConnector 40-pole
Specifications
plate

Chapter 3
Specifications< External connection >Signal name
Connector pin number

Note) NC depicts a pin
to which aninternal circuit is
not connected.
Note, however,that it should not
be used as arepeating pin etc.

<Circuit configuration>
Input circuit

Output circuit
Internal circuit

Internal circuit

Fuse

3-69

Chapter 3 Specifications

Analog input and output

3-5-6Individual specifications of the Analog I/O module(1)

High-speed analog input (NP1AXH4-MR)

Item

Specifications

Model
Number of input channels
Input impedance
Maximum allowable input
Input conversion characteristics

NP1AXH4-MR
4 Channels
Voltage input: 1 MΩ, current input: 250 Ω
Voltage input: ± 15 V, current input: ± 30 mA

Chapter 3
Specifications

Input

Resolution
Total accuracy (against full-scale)
Form of converted digital values
Sampling time
Input filter time
Input delay times
Connection
External connection
Applicable wire size
Signal display

Insulation method
Dielectric strength
Insulation resistanceInternal current consumption
Number of occupied words
WeightNote)

Analog input range

Voltage (V)-10 -10, -5 -5, 1 - 5, 0 - 5, 0 - 10

Current (mA)

0 - 20, 4 - 20, -20 -20

Converted
digital value:-8000 - 8000
or 0 - 16000

14 bits± 0.1% or less (25°C), ± 1.0% or less (0 - 55°C)

INT form (integer form)
1 ms/4 channels
47 µs
1 ms + tact time
Removable terminal block M3 screw 20-pole
Note)
AWG #22 - 18
ONL: lights on when normal (green LED), ERR: lights on whenabnormal (red LED), SETTING: lights on or flashes at the time ofsetting (green LED)
Photocoupler insulation
Except that between channels being uninsulated
AC 500 V 1 minuteBetween the I/O terminals collected together and the FG
10 MΩ or more when measured with DC 500 V insulation resistancetester
Between the I/O terminals collected together and the FG
DC 24 V 120 mA or less (when all channels are used)
10 words (input: 8 words, output: 2 words)
Approx. 200 g

The applicable wire size depends on the crimp-style terminals used. Refer to “4-4-3 Input and output
wiring” for details.

< Name of each part >State display LED
Gain/offset channel selection switch
Gain/offset setting switch

Removable terminal blockM3 20-pole

Specifications
plate

3-70

Chapter 3 Specifications

Analog input and output

Standard analog input (NP1AX04-MR)

Item

Specifications

Model
Number of input channels
Input impedance
Maximum allowable input
Input conversion characteristics

NP1AX04-MR
4 Channels
Voltage input: 1 MΩ, current input: 250 Ω
Voltage input: ± 15 V, current input: ± 30 mA
Input

Resolution
Total accuracy (against full-scale)
Form of converted digital values
Sampling time
Input filter time
Input delay times
Connection
External connection
Applicable wire size
Signal display

Insulation method
Dielectric strength
Insulation resistanceInternal current consumption
Number of occupied words
WeightNote)

Analog input range

Voltage (V)-10 -10, -5 -5, 1 - 5, 0 - 5, 0 - 10

Current (mA)

0 - 20, 4 - 20, -20 -20

Converted
digital value:-500 - 500
or 0 - 1000

10 bits± 0.5% or less (25°C), ± 1.0% or less (0 - 55°C)

INT form (integer form)
4 ms/4 channels
47 µs
4 ms + tact time
Removable terminal block M3 screw 20-pole
Note)
AWG #22 - 18
ONL: lights on when normal (green LED), ERR: lights on whenabnormal (red LED), SETTING: lights on or flashes at the time ofsetting (green LED)
Photocoupler insulation
Except that between channels being uninsulated
AC 500 V 1 minuteBetween the I/O terminals collected together and the FG
10 MΩ or more when measured with DC 500 V insulation resistancetester
Between the I/O terminals collected together and the FG
DC 24 V 120 mA or less (when all channels are used)
10 words (input: 8 words, output: 2 words)
Approx. 200 g

The applicable wire size depends on the crimp-style terminals used. Refer to “4-4-3 Input and output
wiring” for details.

< Name of each part >State display LED
Gain/offset channel selection switch
Gain/offset setting switch

Removable terminal blockM3 20-pole

Specifications plate(Right side)

3-71

Chapter 3
Specifications(2)

Chapter 3 Specifications

Analog input and output(3)Standard analog input (NP1AX08-MR)

Item

Specifications

Model
Number of input channels
Input impedance
Maximum allowable input
Input conversion characteristics

NP1AX08-MR
8 Channels
Voltage input: 1 MΩ or more, current input: 250 Ω or less
Voltage input: ± 15 V, current input: ± 30 mA
Input

Chapter 3
Specifications

Resolution
Total accuracy (against full-scale)
Form of converted digital values
Sampling time
Input filter time
Input delay times
Connection
External connection
Applicable wire size
Signal display

Insulation method
Dielectric strength
Insulation resistanceInternal current consumption
Number of occupied words
WeightNote)

Analog input range

Voltage (V)-10 -10, -5 -5, 1 - 5, 0 - 5, 0 - 10

Current (mA)

0 - 20, 4 - 20, -20 -20

Converted
digital value:-500 - 500
or 0 - 1000

10 bits± 0.5% or less (25°C), ± 1.0% or less (0 - 55°C)

INT form (integer form)
1 ms + 0.5ms × Number of convertible channels
47 µs (hardware)
Sampling cycle + tact time
Removable terminal block M3 screw 20-pole
Note)
AWG #22 - 18
ONL: lights on when normal (green LED), ERR: lights on whenabnormal (red LED), SETTING: lights on or flashes at the time ofsetting (green LED)
Photocoupler insulation
Except that between channels being uninsulated
AC 500 V 1 minuteBetween the I/O terminals collected together and the FG
10 MΩ or more when measured with DC 500 V insulation resistancetester
Between the I/O terminals collected together and the FG
DC 24 V 120 mA or less (when all channels are used)
18 words (input: 16 words, output: 2 words)
Approx. 200 g

The applicable wire size depends on the crimp-style terminals used. Refer to “4-4-3 Input and output
wiring” for details.

< Name of each part >State display LED
Removable terminal blockM3 20-pole

Specifications
plate

3-72

Chapter 3 Specifications

Analog input and output

High-speed analog output (NP1AYH2-MR)

Item

Specifications

Model
Number of output channels
External load resistance
Output conversion characteristics

NP1AYH2-MR
2 Channels
Voltage output: 1 KΩ, current output: 600 Ω or less
OutputVoltage (V)Current (mA)

Resolution
Total accuracy (against full-scale)
Form of digital input values
Output delay time
Connection
External connection
Applicable wire size
Signal display

Insulation method
Dielectric strength
Insulation resistanceInternal current consumption
Number of occupied words
WeightNote)

Digital input
value:-8000 - 8000
or 0 – 16000

Analog output range-10 -10, -5 -5, 1 - 5, 0 - 5, 0 - 10
0 - 20, 4 - 20

14 bits± 0.1% or less (25°C), ± 1.0% or less (0 - 55°C)

INT form (integer form)
1 ms + tact time
Removable terminal block M3 screw 20-pole
Note)
AWG #22 - 18
ONL: lights on when normal (green LED), ERR: lights on whenabnormal (red LED), SETTING: lights on or flashes at the time ofsetting (green LED)
Photocoupler insulation
Except that between channels being uninsulated
AC 500 V 1 minuteBetween the I/O terminals collected together and the FG
10 MΩ or more when measured with DC 500 V insulation resistancetester
Between the I/O terminals collected together and the FG
DC 24 V 120 mA or less (when all channels are used)
6 words (input: 2 words, output: 4 words)
Approx. 200 g

The applicable wire size depends on the crimp-style terminals used. Refer to “4-4-3 Input and output
wiring” for details.

< Name of each part >State display LED
Gain/offset channel selection switch
Gain/offset setting switch

Removable terminal blockM3 20-pole

Gain/offset value adjustment switch
Specifications
plate

3-73

Chapter 3
Specifications(4)

Chapter 3 Specifications

Analog input and output(5)Standard analog output (NP1AY02-MR)

Item

Specifications

Model
Number of output channels
External load resistance
Output conversion characteristics

NP1AY02-MR
2 channels
Voltage output: 1 KΩ or more, current output: 600 Ω or less
OutputVoltage (V)Current (mA)

Resolution
Total accuracy (against full-scale)
Form of digital input values
Output delay time
Connection
External connection
Applicable wire size
Signal display

Chapter 3
Specifications

Insulation method
Dielectric strength
Insulation resistanceInternal current consumption
Number of occupied words
WeightNote)

Digital input
value:-500 - 500
or 0 – 1000

Analog output range-10 -10, -5 -5, 1 - 5, 0 - 5, 0 - 10
0 - 20, 4 - 20

10 bits± 0.5% or less (25°C), ± 1.0% or less (0 - 55°C)

INT form (integer form)
2 ms + tact time
Removable terminal block M3 screw 20-pole
Note)
AWG #22 - 18
ONL: lights on when normal (green LED), ERR: lights on whenabnormal (red LED), SETTING: lights on or flashes at the time ofsetting (green LED)
Photocoupler insulation
Except that between channels being uninsulated
AC 500 V 1 minuteBetween the I/O terminals collected together and the FG
10 MΩ or more when measured with DC 500 V insulation resistancetester
Between the I/O terminals collected together and the FG
DC 24 V 120 mA or less (when all channels are used)
6 words (input: 2 words, output: 4 words)
Approx. 200 g

The applicable wire size depends on the crimp-style terminals used. Refer to “4-4-3 Input and output
wiring” for details.

< Name of each part >State display LED
Gain/offset channel selection switch
Gain/offset setting switch

Removable terminal blockM3 20-pole

Gain/offset up-and-down switch
Specifications plate(Right side)

3-74

Chapter 3 Specifications

Analog input and output

Temperature measuring resistor input (NP1AXH4-PT)

Item

Specifications

Model
Number of input channels
Temperature measuring resistor that can beconnected
Accuracy (against full-scale)

NP1AXH4-PT
4 Channels
Platinum temperature measuring resistor (Pt 100, JPt 100)

Allowable resistance value of the input wiring
Sampling cycle
Input filter time

Connection

External connection
Applicable wire size

Signal display
Insulation method
Dielectric strength
Insulation resistanceInternal current consumption
Number of occupied words
WeightNote)± 0.3%, ± 1 Digit (Ambient temperature 18°C - 28°C)± 0.7%, ± 1 Digit (Ambient temperature 0°C - 55°C)
10 Ω or less
500 ms/4 channels
Hardware (time constant): 50 ms
Digital filter time: 1 - 100 s(setting can be made with a minimum unit of 1 s)
Removable terminal block (module protrusion type)with M3 screws 20-pole
Note)
AWG#22-18 (twisted stranded wires with shield should be used)
ONL: lights on when normal (green LED), ERR: lights on whenabnormal (red LED)
Photocoupler insulation
AC 500 V 1 minuteBetween the external terminals collected together and the FG
10 MΩ or more when measured with DC 500 V insulation resistancetesterDC 24 V 150 mA or less
16 words (input: 8 words, output: 8 words)
Approx. 240 g

The applicable wire size depends on the crimp-style terminals used. Refer to “4-4-3 Input and output
wiring” for details.

< Name of each part >State display LED
Version display

Selection switch forthe temperature
measuring resistor
type

Removable
terminal blockSpecifications
plate

Front view

Rear view

3-75

Chapter 3
Specifications(6)

Chapter 3 Specifications

Communications

3-6 Communications Module Specifications(1)

Versatile communications module (NP1L-RS1)

Item

Specifications

Model
Number of SX busses connected
Port
Transmission method

NP1L-RS1
Maximum 16 units/1 configuration (classification B)
RS-232C 1 channel
RS-485 1 channel
Half duplex serial communications method/full duplex serial
communications method (switching by means of software)
Start-stop synchronization method
1200/2400/4800/9600/19200/38400/57600 bps(The total rate of 2 channels shall be up to a maximum of 57600 bps.)
15 m or less
1 km or less(provided that the transmission
rate is 19.2 kbps or less)
1:1
1:31 (maximum)(1 external equipment can be(provided that the station number
connected)of this module is limited to 0 - F)
D-sub 9-pin connector (female)
D-sub 9-pin connector (male)
Non-procedural FB by means of the application program (FB) inside
the CPU module (attached to the TDsxEditor), FA package (to bepurchased separately)
Photocoupler insulation
AC 445 V 1 minuteBetween the I/O connectors collected together and the FG
10 MΩ or more when measured with DC 500 V insulation resistancetester
Between the I/O connectors collected together and the FG
1 slotDC 24 V 110 mA or lessApprox. 170 gSynchronization method
Transmission rate
Transmission distance

Number of units connected

Chapter 3
Specifications

Connection method
Transmission protocol

Insulation method
Dielectric strength
Insulation resistance

Number of occupied slots
Internal current consumption
Weight< Name of each part >State display LED
RS-485 station numbers
setting switch
RS-232C port
(D-sub 9-pin female)

Mode setting switch

Specifications
plate
RS-485 terminal resistor ON-OFF
switchRS-485 port
(D-sub 9-pin male)

3-76Chapter 3 Specifications

Communications

Versatile communications module (NP1L-RS2)

Item

Specifications

Model
Number of SX busses connected
Port
Transmission method

NP1L-RS2
Maximum 16 units/1 configuration (classification B)
RS-232C 1 channel
Half duplex serial communications method/full duplex serial
communications method (switching by means of software)
Start-stop synchronization method
1200/2400/4800/9600/19200/38400/57600 bps
15 m or less
1:1 (1 external equipment can be connected)
D-sub 9-pin connector (female)
Non-procedural FB by means of the application program (FB) inside
the CPU module (attached to the TDsxEditor), FA package (to bepurchased separately)
Photocoupler insulation
AC 445 V 1 minuteBetween the I/O connectors collected together and the FG
10 MΩ or more when measured with DC 500 V insulation resistancetester
Between the I/O connectors collected together and the FG
1 slotDC 24 V 90 mA or lessApprox. 160 g

Synchronization method
Transmission rate
Transmission distance
Number of units connected
Connection method
Transmission protocol

Insulation method
Dielectric strength
Insulation resistance

Number of occupied slots
Internal current consumption
Weight< Name of each part >State display LED
Mode setting switch

RS-232C port
(D-sub 9-pin female)Specifications
plate

3-77

Chapter 3
Specifications(2)

Chapter 3 Specifications

Communications(3)

Versatile communications module (NP1L-RS4)

Item

Specifications

Model
Number of SX busses connected
Port
Transmission method

NP1L-RS4
Maximum 16 units/1 configuration (classification B)
RS-485 1 channel
Half duplex serial communications method/full duplex serial
communications method (switching by means of software)
Start-stop synchronization method
1200/2400/4800/9600/19200/38400/57600 bps
1 km or less (provided that the transmission rate is 19.2 kbps or less)
1:31 (maximum)(provided that the station number of this module is limited to 0 - F)
D-sub 9-pin connector (male)
Non-procedural FB by means of the application program (FB) inside
the CPU module (attached to the TDsxEditor), FA package (to bepurchased separately)
Photocoupler insulation
AC 445 V 1 minuteBetween the I/O connectors collected together and the FG
10 MΩ or more when measured with DC 500 V insulation resistancetester
Between the I/O connectors collected together and the FG
1 slotDC 24 V 80 mA or lessApprox. 160 g

Synchronization method
Transmission rate
Transmission distance
Number of units connected
Connection method
Transmission protocol

Insulation method
Dielectric strength

Chapter 3
Specifications

Insulation resistance

Number of occupied slots
Internal current consumption
Weight< Name of each part >State display LED
RS-485 station numbers
setting switch

Mode setting switch

Specifications
plate
RS-485 terminal resistor ON-OFF
switchRS-485 port
(D-sub 9-pin male)

3-78Chapter 3 Specifications

Communications(4)

OPCN-1 master module (NP1L-JP1)

Item

Specifications

Model
Number of SX busses connected
Number of slave stations connected
Connection method
Transmission line mode
Transmission line

NP1L-JP1
Note)
Maximum 8 units/1 configuration (classification A)
31 units/1 master module
Removable dedicated connector (M3.5)
Bus configuration (multi-drop)
Electric power transmission line: twisted pair cable
Its total length depends on the baud rate.
Half duplex serial transmission, in compliance with EIA RS-485
125 kbps (1000 m), 250 kbps (800 m), 500 kbps (480 m), 1 Mbps (240m)
NRZI (Non Return to Zero Inverted) method
FCS (Frame Check Sequence CRC-16)
Maximum 2032 points (127 words)
Photocoupler insulation
AC 445 V 1 minuteBetween the connectors collected together and the FG
10 MΩ or more when measured with DC 500 V insulation resistancetester
Between the connectors collected together and the FG
1 slotDC 24 V 130 mA or lessApprox. 200 g (single module), approx. 40 g (OPCN-1 connector)

Transmission method
Transmission rate (maximum total length)
Encoding method
Error check
Number of I/O points
Insulation method
Dielectric strength
Insulation resistance

Number of occupied slots
Internal current consumption
WeightNote)

If other remote I/O master modules are connected to the SX bus, the total number of remote I/O mastermodules that can be connected is up to 8 units.
(Number of units of OPCN-1 master modules) + (Other remote I/O master modules) ≤ 8 units< Name of each part >State display LED
OPCN-1 station number setting switch(fixed at 00)
Function setting switch

Connecting hole of the
OPCN-1 connector

Specifications
plate

3-79

Chapter 3
Specifications

This is a remote I/O master module that can construct one OPCN-1 1 systemby itself alone.

Chapter 3 Specifications

Communications(5)

OPCN-1 interface module (NP1L-RJ1)
This is an interface module used when the I/O module of µGPCsx is used on
the OPCN-1.

Item

Specifications

Model
Connection method
Base board used

Number of occupied slots
Internal current consumption

NP1L-RJ1
Removable dedicated connector (M3.5)
TD1BS-06 (6-slot base), TD1BS-08 (8-slot base),
TD1BS-11 (11-slot base), TD1BS-13 (13-slot base)
Photocoupler insulation
AC 445 V 1 minuteBetween the connectors collected together and the FG
10 MΩ or more when measured with DC 500 V insulation resistancetester
Between the connectors collected together and the FG
1 slotDC 24 V 130 mA or less

WeightApprox. 200 g (single module), approx. 40 g (OPCN-1 connector)

Insulation method
Dielectric strength

Chapter 3
Specifications

Insulation resistance< Name of each part >State display LED
OPCN-1 station number
setting switch
Function setting
switchConnecting hole of the
OPCN-1 connector

3-80Specifications
plateChapter 3 Specifications

Communications(6)

FL-net module

Item

Specifications

Model
Number of SX busses connected
Number of FL-net connected

NP1L-FL1
Note)
Maximum 2 units/1 configuration
100 nodes/segment(up to a maximum of 256 units by means of repeaters)
AUI connector (10BASE5) or UTP connector (10BASE-T)
Bus configuration (multi-drop)
Baseband (Manchester code)

Connection method
Transmission line mode
Transmission method (code)
Data exchange method•

Cycling transmission method using the common memory area•

Data size: maximum 8704 words (512 words+8192 words)

Transmission rate

10 MbpsError check

CRC (SUTODIN II)
Pulse transformer insulation

Dielectric strength

AC 1500 V 1 minuteBetween the connectors collected together and the FG

Insulation resistance

2 MΩ or more when measured with DC 500 V insulation resistancetester
Between the connectors collected together and the FG

Number of occupied slots

1 slotInternal current consumption

DC 24 V 105 mA or less

External power supply

DC 12 V 500 mA or less(required only when 10BASE5 is used)

WeightApprox. 210 g

Note)

Chapter 3
Specifications

Insulation method

Up to 2 units of FL-net modules in total can be connected.

< Name of each part >State display LED

AUI/10BASE-T change-over switch

CPU number setting switch

FL-net node number setting switch
Connector for 10BASE-T
Specifications plate(on the right side plane)
AUI connector (for 10BASE5)
DC 12 V power supply connector
for 10BASE5

3-81

Chapter 3 Specifications

Communications(7)

DeviceNet module (NP1L-DN1)

ItemSpecifications

Model
Number of SX busses connected
Number of slave nodes connected
Connection method
Transmission line mode
Transmission line
Transmission rate (maximum total length)
Number of I/O points
Insulation method

NP1L-DN1
Note)
Maximum 8 units/1 configuration (classification A)
Maximum of 63 units
Open type screw connector
Bus configuration (multi-drop)
Trunk line, branch line (drop line)
125 kbps (500 m), 250 kbps (250 m), 500 kbps (100 m)
Maximum 2032 points (127 words)
Photocoupler insulation

Dielectric strength

AC 445 V 1 minuteBetween the connectors collected together and the FG

Insulation resistance

10 MΩ or more when measured with DC 500 V insulation resistancetester
Between the connectors collected together and the FG

Internal current consumption

DC 24 V 90 mA or less

Network current consumption

DC 24 V 45 mA or less

WeightApprox. 170 g

Chapter 3
Specifications

Note)

If other remote I/O master modules are connected to the SX bus, the total number of remote I/O mastermodules that can be connected is up to 8 units.
(Number of units of DeviceNet master modules) + (Other remote I/O master modules) ≤ 8 units< Name of each part >State display LED

MAC ID setting switch
Transmission ratesetting switch
Specifications
plate
DeviceNet connector(0 V) BlackBlue
Version No.

Signal lineWhite(+24 V) Red
Signal display seal

3-82

Chapter 3 Specifications

Communications(8)

SX bus optical link module (NP1L-0L1)/SX bus optical converter(NP2L-0E1)

ItemSpecifications

NP1L-0L1
NP2L-0E1
Maximum 64 units/1 configuration
Number of units connected(total number of units of NP1L-0L1 and NP2L-0E1)
Type
PCF (Polymer Clad Fiber)
Core/clad diameters
200 µm/230 µm
Optical fiber
Note 1)Minimum bending radius
50 mm
Optical connector
F07 type
Maximum 800 m between stations (total extended distance:
Transmission distance
Note 2)25.6 km)
Note 2)
Allowable attenuation of the amount of light
7 dB or lessNumber of occupied slots
1 slotInternal current consumption
DC 24 V 54 mA or less
DC 24 V 70 mA or less3-pole M3 (tightening torque 0.5 Terminal shape
0.7 N· m)
Power supply
Note 3)
terminal
Rated input voltage
DC 24 V (DC 22.8 - 26.4 V)
Applicable wire size
AWG#16165 mA or less: at the time ofusing switching power supply
Rush current
50 Ao-p - 70 µs: DC 24 V when
directly powered on
WeightApprox. 135 g
Approx. 155 g
Note 1)
The minimum bending radius may depend on the model of optical fiber used. The specifications given in the abovetable is the value of the HG-20/08 manufactured by Sumitomo Electric Industries, Ltd.
Note 2)The transmission distance of optical fiber is determined by the attenuation of optical fiber. The attenuation increases
as the ambient temperature of the optical fiber used decreases (the use in low temperatures) or when there isbending stress and the grinding of connectors, resulting in a decrease in the transmission distance. The
specifications given in the above table is the value of a product having ground connectors at both ends under anenvironment of the temperature range used being 25 ° C and no bending stress. Also, attention should also paid tothe attenuation resulting from long-term deterioration.

[For reference]Calculation formula and transmission distance under the ambient temperature used in thecase of using the HG-20/08 manufactured by Sumitomo Electric Industries, Ltd.

< Calculation formula in the case of a cable of 100 m or less >Attenuation [dB] = 1.4 dB+loss at low temperatures+loss when without grinding
1.4 dB is the cable transmission loss of a cable of 100 m or less. (Fixed value.)
For the loss at low temperatures, the value of the 100 m cable in the table below shall apply.

< Calculation formula in the case of a cable of 100 m or more >Attenuation [dB] = (8 - 6 × log(cable length)) × cable length + loss at low temperatures + loss when
without grinding•
Unit of cable length is [km].
*The loss when without grinding is 0.75 dB per connector unground. In the case of a connector
with both ends unground, the loss will be 1.5 dB.

< List of loss at low temperatures of the HG-20/08 >Temperature [ C]
25
10
0
-5
-10
-15

Loss [dB]
1 km cable
0
0.40
0.80
1.05
1.30
1.55

100 m cable
0
0.25
0.35
0.6
0.8
1.03

3-83

Chapter 3
Specifications

ModelChapter 3 Specifications

Communications

Chapter 3
Specifications

-20

3-84

1.80

1.25

Chapter 3 Specifications

Communications< Transmission distance in relation to the ambient temperature of the HG-20/08 >Ambient temperature [ C]
25
20
15
10
5
0
-5
-10
-15
-20

With both ends ground
800 m
800 m
700 m
700 m
700 m
600 m
600 m
600 m
500 m
500 m

With both ends unground
500 m
500 m
500 m
500 m
500 m
400 m
400 m
400 m
300 m
300 m

Note 3)The external power supply used per unit should be a switching power supply of DC 24 V 1 A or more that has beenprocessed by the “strengthened insulation.” For its wiring method, refer to “4-4-5 Wiring of the power supply part of
the SX bus optical converter.”

Note 4)

Transmission delay time at the time of the optical link system
At the time of the optical link system, a transmission delay given by the following formula occurs. The SX bus tacttime should be considered at the time of the system designing.
(Transmission delay time) = (Number of units of the optical link equipment) × 1 µs + (Total length of the optical fiber
cable (km)) × 4.97 µs [µs]Chapter 3
Specifications< Name of each part >State display LED
State display LED
Connector for connecting
optical fiber

SX bus connector

Power supply
terminal blockSpecifications

Specifications
plate

plate
Connector for connecting
optical fiber
Hole for installing theunit 6

Model

Model

Screws used:
M4
Tightening torque: 1.8 N-m* Recommended products
Optical fiber: HG-20/08 manufactured by Sumitomo Electric Industries, Ltd. (type: H-PCF)
Optical connector: CF-2071 manufactured by Sumitomo Electric Industries, Ltd.
Crimping tool: CAK-0057 manufactured by Sumitomo Electric Industries, Ltd.

3-85

Chapter 3 Specifications

Positioning

3-7 Positioning Module Specifications(1)

High-speed counter module (NP1F-HC2)

Item

Specifications

Model

NP1F-HC2
90° phase difference 2-phase signal, forward-reverse signal, code
pulse ...... switching by means of software
Square wave open collector signal or differential signal
Capable of carrying out the ring counter operation, reset operation,gate operation, comparing detection operation and Z-phase detection
operation
2 channels (independent)
500 kHz-2,147,483,648 - 2,147,483,647 (DINT type)Count input
signalInput mode
Level
Type

CounterNumber of channels
Counting speed
Counting range
Gradual multiplication
function
Reset operation
Gate operation
Comparing detection
operation

Chapter 3
Specifications

Z-phase detection operation

Comparison

Number of output points
Comparing range
Comparing content
Comparing output

Insulation method
Dielectric strength
Insulation resistance
Number of occupied words
Number of occupied slots
Internal current consumption
External supply voltage
Weight× 4 (2-phase signal only)

By means of instruction given by software
By means of instruction given by external input signals and software
By means of instruction given by software
By means of instruction given by external input signals and software
The external input signal can be selected at the rise/fall edges.
1 point/channel
Same as the counting range(Counting value) ≥ (Comparing value) → Output ON
Open collector output (in the form of sync) DC 24 V Maximum rated
load: 100 mA
Photocoupler insulation
AC 1500 V 1 minuteBetween the I/O connectors collected together and the FG
10 MΩ or more when measured with DC 500 V insulation resistancetester
Between the I/O connectors collected together and the FG
16 words
1 slotDC 24 V 85 mA or less
DC 24 V supplied from external power supply
Approx. 140 g< Name of each part >State display LED

Connector for external I/O signals
Note) The connector for external connection is to bepurchased separately. For applicableconnectors, refer to “4-4-3 Input and output
wiring” for details.

Specifications
plate
These are pin numbers as seen fromthe wiring side of the connector for
external connection.

3-86

Chapter 3 Specifications

Positioning

Multi-channel high-speed counter module (NP1F-HC8)

Item

Specifications

Model

NP1F-HC8
90° phase difference 2-phase signal, forward-reverse signal, code
pulse ...... switching by means of software
Square wave open collector signal or differential signal
Capable of carrying out the ring counter operation, reset operation,gate operation
8 channels (independent)
50 kHz-32768 - 32767 (INT type)Count input
signalInput mode
Level
Type

CounterNumber of channels
Counting speed
Counting range
Gradual multiplication
function
Reset operation
Gate operation

Insulation method
Dielectric strength
Insulation resistance
Number of occupied words
Number of occupied slots
Internal current consumption
External supply voltage
Weight× 4 (2-phase signal only)

By means of instruction given by software
By means of instruction given by external input signals and software
Photocoupler insulation
AC 1500 V 1 minuteBetween the I/O connectors collected together and the FG
10 MΩ or more when measured with DC 500 V insulation resistancetester
Between the I/O connectors collected together and the FG
12 words
1 slotDC 24 V 100 mA or less
DC 24 V supplied from external power supply
Approx. 195 g< Name of each part >State display LED
Connector for external I/O signals
Note) The connector for external connection is to bepurchased separately. For applicable connectors,
refer to “4-4-3 Input and output wiring” for details.

Specifications
plate

3-87

Chapter 3
Specifications(2)

Chapter 3 Specifications

Positioning(3)

Positioning signal converter (NP2F-LEV)

Item

Specifications

Model
Number of converted axes

NP2F-LEVFor use for 4 axes (for use for 4 channels)
Maximum 1 MHz
Open collector input

Input frequency
Input mode
Output frequency
Output mode

Input signal
Output signal
Insulation method
External power supply
WeightMaximum 1 MHz
Differential signal
Uninsulated (between input-output signals),
The external power supply is insulated.
DC 24 V 40 mA to be supplied from the external power supply
Approx. 130 g< Name of each part >Hole for installing the unit 6

State display LED

Output signal
connector

Chapter 3
Specifications

Specifications
plate

Output signal connector

Hole for installing the unit 6

3-88Chapter 3 Specifications

Positioning

2-axis analog instruction positioning (NP1F-MA2)

Item

Specifications

Model
Number of controlled axes
Positioning control

NP1F-MA22 axesSemi-closed loop control
Trapezoidal acceleration/deceleration(at the time of pulse generation mode)
32
Instruction of 2 - 1 pulses/time
Analog speed instruction (0 - ± 10.24 V)
Analog voltage instruction
500 kHz
Open collector input or differential signal(90° phase difference phase A, phase B and phase Z signals)
500 kHz
Open collector input or differential signal(90° phase difference phase A, phase B or forward pulse+reverse
pulse)
3 types (pulse generation mode, position instruction mode, position
control mode)
Servo system equipped with analog speed instruction input function
Uninsulated (interface between amplifiers and interface between
manual pulses)
Photocoupler insulation (digital I/O) *External connection equipment
needs strengthened insulation.
I/O area (input: 14 words/output: 8 words, total 22 words)
1 slotDC 24 V 150 mA or lessApprox. 200 g

Acceleration/deceleration characteristics
Maximum position data
Speed instruction
Feedback pulse

Instruction voltage
Signal mode
Input frequency
Input mode
Input frequency

Manual pulser

Input mode

Control function
Combined actuator
Insulation method
Number of occupied words
Number of occupied slots
Internal current consumption
Weight< Name of each part >State display LED
Analog volume for gain
adjustment
Connector for external I/O signals

Specifications
plateNote) The connector for
external connection is tobe purchased separately.
For applicableconnectors, refer to“4-4-3 Input and output
wiring” for details.

These are pin numbers as seenfrom the wiring side of the connector
for external connection.

3-89

Chapter 3
Specifications(4)

Chapter 3 Specifications

Positioning(5)

2-axis pulse set instruction positioning (NP1F-MP2)

Item

Specifications

Model
Number of controlled axes
Positioning control

NP1F-MP22 axesOpen loop control
Trapezoidal acceleration/deceleration(at the time of pulse generation mode)
32
Instruction of 2 - 1 pulse/time
250 kHz

Acceleration/deceleration characteristics
Maximum position data
Pulse frequency
Pulse frequency
resolution
Output mode
Input frequency

Instruction pulse

Feedback pulse

Input mode
Input frequency

Manual pulser

Input mode

Chapter 3
Specifications

Control function
Combined actuator
Insulation method
Dielectric strength
Insulation resistance
Number of occupied words
Number of occupied slots
Internal current consumption
External power supply
Weight16 bit/20 bit
Open collector output (forward pulse+reverse pulse)
500 kHz
Open collector input or differential signal(90° phase difference phase A, phase B and phase Z signals)
500 kHz
Open collector input or differential signal(90° phase difference phase A, phase B or forward pulse+reverse
pulse)
2 types (pulse generation mode, position instruction mode)
Servo system or stepping motor equipped with pulse set input function
Photocoupler insulation
AC 1500 V 1 minuteBetween the I/O connectors collected together and the FG
10 MΩ or more when measured with DC 500 V insulation resistancetester
Between the I/O connectors collected together and the FG
I/O area (input: 14 words/output: 8 words, total 22 words)
1 slotDC 24 V 95 mA or less
DC 24 V 35 mA supplied from external power supply
Approx. 200 g< Name of each part >State display LED

Connector for external I/O signals

Specifications
plate

These are pin numbers as seenfrom the wiring side of the connector
for external connection.

3-90

Note)
The connector for
external connection is to bepurchased separately. For
applicable connectors, refer
to “4-4-3 Input and output
wiring” for details.

Chapter 3 Specifications

Positioning

Pulse set output positioning (NP1F-HP2)

Item

Specifications

Model
Number of controlled axes
Positioning control

NP1F-HP22 axesOpen loop control
Trapezoidal acceleration/deceleration(at the time of pulse generation mode)
32
Instruction of 2 - 1 pulse/time
250 kHz

Acceleration/deceleration characteristics
Maximum position data
Pulse frequency
Pulse frequency
resolution
Output mode

Instruction pulse
Control function
Combined actuator
Insulation method
Dielectric strength
Insulation resistance

Number of occupied words
Number of occupied slots
Internal current consumption
External power supply
Weight16 bit/200 bit
Open collector output (forward pulse+reverse pulse)
1 type (pulse generation mode)
Servo system or stepping motor equipped with pulse set input function
Photocoupler insulation
AC 1500 V 1 minuteBetween the I/O connectors collected together and the FG
10 MΩ or more when measured with DC 500 V insulation resistancetester
Between the I/O connectors collected together and the FG
I/O area (input: 8 words/output: 8 words, total 16 words)
1 slotDC 24 V 95 mA or less
DC 24 V 35 mA supplied from external power supply
Approx. 180 g< Name of each part >State display LED

Connector for external I/O signals

Specifications
plateNote) The connector for external
connection is to bepurchased separately. For
applicable connectors,
refer to “4-4-3 Input andoutput wiring” for details.

These are pin numbers as seenfrom the wiring side of the connector
for external connection.

3-91

Chapter 3
Specifications(6)

Chapter 3 Specifications

Function

3-8 Function Module Specifications(1)

PC card interface module (NP1F-PC2)

Item

Specifications

Model
Number of SX busses connected

NP1F-PC2
Maximum 4 units
In compliance with JEIDA Ver. 4.1/PCMCIA 2.01
Type I, II × 2 slots 5 V specifications• Restrictions: Either LAN card or modem card can be installed.
LAN card, modem card, memory card (SRAM card, flash memory
card)
TCP/IP protocol, UDP/IP protocol, communication protocol with
Mitsubishi Ethernet interface and loader command via the network aresupported.
Read/write of data from and onto the CPU
None (uninsulated within the module)
1 slot
120 mA or lessApprox. 200 g

PC card interface part
Card used

Function

LAN card

Memory card
Insulation method
Number of occupied slots
Internal current consumption
WeightChapter 3
Specifications

Note)

Environmentally resistant specifications are restricted by the specifications of the PC card used.

< Name of each part >State display LED

Specifications
plate

Fixing hardware for
PC card

Holding hardware for
cable

3-92

Chapter 3 Specifications

Function(2)

Memory card interface module (NP1F-MM1)

Item

Specifications

Model
Number of SX busses connected

NP1F-MM1
Classification B
In compliance with JEIDA Ver. 4.1/PCMCIA 2.01
Type I, II × 1 slot 5 V specifications
Memory card (SRAM card)
Program read/write, data read/write etc.
Uninsulated
1 slot
120 mA or lessApprox. 200 g

Memory card interface part
Card used
Function
Insulation method
Number of occupied slots
Internal current consumption
Weight< Name of each part >Chapter 3
Specifications

State display LED

Specifications
plate
Memory card read/write switch
Fixing hardware formemory card
CPU number setting
switchFile number setting switch

Note)

3-93

Chapter 3 Specifications

Outer Specifications

3-9 Auxiliaries and Others(1)

Battery for data backup (NP8P-BT)

Item

Specifications

Model
Battery classification
Nominal voltage
Battery guarantee period
Outer dimensions

NP8P-BT
Lithium primary battery (charging prohibited)
DC 3.6 VNote)
5 years (at ambient temperature: 25°C)
14.5 × 24.5 cable length: 50 mm
Approx. 10 g

Weight
Note)

This guarantee period is the guarantee period for a single battery and the guarantee period is also 5
years at the ambient temperature of 25°C even when the battery is stored as an auxiliary.
The backup time for memory depends on the equipment and ambient temperature in which the battery
is installed. Note that the backup time is shortened to about a half as the ambient temperature rises by
10°C.

< Name of each part >Chapter 3
Specifications

Connector for battery connection(2)

SX bus increasing cable (NP1CModel

Cable length (L)NP1C-P3
NP1C-P6

300 mm
600 mm

NP1C-P8

800 mm

NP1C-022,000 mm

NP1C-05
NP1C-105,000 mm10,000 mm

NP1C-25

25,000 mm

OUT side (orange)(3)

Battery main body)IN side (white)

SX bus loop back plug (NP8B-BP)
This is a plug to configure the SX bus to be connected to the end of the SX
bus into a loop-like form.

3-94

Chapter 3 Specifications

Outer Specifications(4)

SX bus T-branch unit (NP8B-TB)
This is a unit to make a branching connection of the SX bus

Item

Specifications

Model
SX bus total extended distance
Number of units connected, number of branches
WeightNP8B-TB
25 m
Maximum 25 units inclusive of the base board
Approx. 160 g

Note)

For the SX bus T-branch increasing system, refer to “2-2-3 SX bus T-branch increasing system.”< Name of each part >Hole for installing the unit 6

Connector for SX bus
connection

Chapter 3
Specifications

Specifications
plate

Hole for installing theunit 6Screw used:
M4
Tightening torque: 1.8 N-m

3-95

Chapter 3 Specifications

Outer Specifications(5)

Trial input switch (NP8X-SW)
This is a trial input switch dedicated to the digital input module(NP1X1606-W.)

Note)

(6)

This product is dedicated to the desktop debugging.
It must not be used being installed within the panel.

TDsxEditor connection cable(NP4H-CA2 (without a converter), NP4H-CNV (with a converter))Connector for
converter connection

Chapter 3
Specifications

Connector for CPU connection

To RS-232C
port of thepersonalcomputer loader
Converter
Manufactured by BLACK BOX
Model: ME777A-FSP< Setting of the BLACK BOX made converter >The conversion case should be opened to set the switches on the printed circuit board asshown in the figure below.

Switch 1

Switch 2

3-96< Switch setting table >The setting should be made as in theshaded areas.
Function
Switch 1-1 Terminal resistor
Switch 1-2
2/4-wire system
Switch 1-3
Switch 1-4 Echo Mode
Switch 2-1 Carry control
Switch 2-2 RS/CS delay
Switch 2-3 Not used
Switch 2-4 Not usedONOFF
120 Ω 16 kΩ
4-wire2-wiresystem system
ON
OFF
RTS
“H” at all times
8 ms
None

Chapter 3 Specifications

Outer Specifications

3-10 Outer Specifications
Outer dimensions of each of the µGPCsx products are given below.
(unit: mm)
Power supply module TD1S-22/TD1S-42(2)CPU module TD1PS-32/TD1PS-74

Chapter 3
Specifications(1)

Battery folder
Note)

Note) In the case of the standard CPU, the user ROM card cannot be attached/detached unless the battery folder is opened at an angle of 180°.

3-97Chapter 3 Specifications

Outer Specifications(3)

Base board
TD1BP-13/NP1BS-13[2]

TD1BS-11[3]

TD1BS-08

Chapter 3
Specifications[1]Note) The dimensions in the parentheses: ( ) are those when the rail (TH35-15AL) is used.

3-98

Chapter 3 Specifications

Outer Specifications[4]

TD1BS-06Note) The dimensions in the parentheses: ( ) are those when the rail (TH35-15AL) is used.

Base board installation hardware (attached to the base board)
Chapter 3
Specifications(4)

Classification
For TD1BP-13/TD1BS-13
For TD1BS-11
For TD1BS-08
For TD1BS-06

2- 6 hole(5)

Fixing hardware for base board

3-99Chapter 3 Specifications

Outer Specifications(6)

I/O module
6-point/8-point modules[2]16-point module/analog input module/analog output module[3]32-point module

Chapter 3
Specifications

[1]

3-100

Chapter 3 Specifications

Outer Specifications

64-point module[5]

Terminal block projecting module (temperature measuring resistor input
module NP1AXH4-PT, thermocouple input module NP1AXH4-TC)
Chapter 3
Specifications

[4]

3-101

Chapter 3 Specifications

Outer Specifications(7)

Communications module[1]

Versatile communications module NP1L-RS1/2/4

Note)

Chapter 3
SpecificationsNote) With or without connectors, switches depends on the model,
but the outer dimensions are the same.

[2]

OPCN-1 master module NP1L-JP1/OPCN-1 slave module NP1L-RJ1

Note) With or without connectors, switches depends on the model, but the outer dimensions
are the same.

3-102

Chapter 3 Specifications

Outer Specifications[3]

FL-net module NP1L-FL1[4]

DeviceNet master module NP1L-DN1[5]

SX bus optical link module NP1L-0L1

Chapter 3
SpecificationsNote) For the AUI cable or UTP cable, the connector size and bending of the cableshould be considered. (For the bending size, check the specifications of the cableused.)

3-103

Chapter 3 Specifications

Outer Specifications[6]

SX bus optical link converter NP2L-0E1

6

Chapter 3
Specifications(fixed with M4 screw)

3-104

Chapter 3 Specifications

Outer Specifications(8)

Positioning module/unit
High-speed counter module NP1F-HC2/multi-channel high-speed countermodule NP1F-HC8[2]Signal converter NP2F-LEV[3]

Positioning module NP1F-MA2/NP1F-MP2/NP1F-HP2

Chapter 3
Specifications

[1]

3-105

Chapter 3 Specifications

Outer Specifications(9)

Function module/unit[1]

PC card interface module NP1F-PC2

Chapter 3
Specifications

Memory card interface module NP1F-MM1

[2]

3-106

SX bus T-branch unit NP8B-TB

Chapter 4 Installation and Wiring

Table of contents

Chapter 4
Installation and Wiring
4-1 Handling Notice.........................................................................................4-1
4-2 Before Installation.....................................................................................4-2
4-2-1
4-2-2

Checking the commodities...................................................................... 4-2
Environment to install the control panel .................................................. 4-2

4-3 Installation onto the Control Panel..........................................................4-3
Direct installation onto the control panel ................................................. 4-3
(1)
(2)

4-3-2

Installation onto the DIN rail.................................................................... 4-4
(1)
(2)
(3)

4-3-3
4-3-4
4-3-5

Installation dimensions.......................4-3
Installation procedure of the baseboard.................................................4-4
Fixation hardware (NB8B-ST) ............4-4
DIN rail ..............................................4-4
Installation procedure of the baseboard.................................................4-5

Installation of each module onto the base board ..................................... 4-6
Installation height of the base board + module........................................ 4-7
Installation position of the PC.................................................................. 4-8

4-4 Wiring.........................................................................................................4-9
4-4-1

Matters requiring attention at the time of wiring work .............................. 4-9
(1)
(2)
(3)
(4)
(5)

4-4-2

Dangerous matters at the time of
installation/wiring work.......................4-9
Matters requiring attention at thetime of installation/wiring work............4-9
Matters requiring attention at thetime of checking the wiring.................4-9
Matters requiring attention after thewiring is over .....................................4-9
Other matters requiring attention......4-10

Wiring of the power supply.................................................................... 4-11
(1)
(2)
(3)
(4)

Wiring of the power supply...............4-11
Switching of power supply voltage(AC power supply only)....................4-12
Grounding .......................................4-12
Wiring of the ALM contacts ..............4-13

Chapter 4
Installationand Wiring

4-3-1

Chapter 4 Installation and Wiring

Table of contents

4-4-3

Input and output wiring ......................................................................... 4-14
(1)
(2)

4-4-4
4-4-5
4-4-6
4-4-7

Wiring of the SX bus increasing cable................................................... 4-15
Wiring of the power supply part of the SX bus optical converter............ 4-16
Countermeasures against noise in the external wiring .......................... 4-17
Emergency stop circuit and interlock circuit .......................................... 4-18
(1)(2)

Chapter 4
Installationand Wiring

4-4-8

Wiring of terminal block type
modules...........................................4-14
Wiring of the connector type
modules...........................................4-15

Emergency stop circuit.....................4-18
Interlock circuit ................................4-18

Short circuit protection of the digital output module............................... 4-19

Chapter 4 Installation and Wiring

Handling Notice

4-1 Handling Notice

•
•

[1]

Cau

•
Avoid the following when installing and using a product. Failure to do so may
ause breakage, a malfunction or a fault of the product.

Do not drop it or let it fall down.

•[4]
Do not install it in the same panel as thatfor equipment of high voltage (3000 V, 6000 V or
more.)•[5]th t f

Do not use it with the same power supply
it th t
t
t i

•

•

•

[2]
Do not install it particularly in a place where
there is great vibration.

•Highvoltage

Equipment that[6]
Do not use it in an environment of hightemperatures, high humidity or of low temperatures.
(It should not be used in a place where there is a rapidchange in temperature and there is condensation.)•
Ambient temperature used 0 - 55°C
Ambient humidity used 20 - 95% RH•

Chapter 4
Installationand Wiring(no condensation)[3]
Do not install it in a place around which
there are corrosive gasses.

4-1

Chapter 4 Installation and Wiring

Installation

4-2 Before Installation
4-2-1Checking the commodities
First of all, check the following at the time of unpacking the commodities youpurchased.
[1]

Whether the commodities are what you ordered.

[2]

Whether there is no breakage etc. in the commodities.

[3]

Whether all accessories are in order. (The accessories are described in “1-2Model list.”)Caution

Do not use those that were found to be damaged or distorted at the time of unpacking. Failure to observe
this may cause a fire, a malfunction or a fault.

4-2-2Environment to install the control panel
CautionUse it in an environment that is described in instructions and manuals.
The use in an environment of high temperatures, high humidity, condensation, dusts, corrosive gasses
and, in particular, of great vibrations and shock, may cause electric shock, a fire, a malfunction or a fault.

Chapter 4
Installationand Wiring

Attention should be paid to the following items to ensure high reliability andsafety as a system.
Item

Specifications

Remarks

Operating ambient
temperature

The panel should be within the range of 0 55°C due to the specified ambient
temperature of this equipment.
Do not install the panel in a place where it is
exposed to direct sunlight.
The relative humidity should be within therange of 20% - 95%.
Do not let condensation occur by causing a
rapid change in temperature.

If the ambient temperature is high, install fans
and air conditioners, and if it is low heaters
inside the panel should be provided, toattain the specified range.

Relative humidity

Antivibration
performance
Shock resistanceHalf amplitude: 0.15 mm, Fixed acceleration:
2 Note)19.6 m/s
2 Note)Peak acceleration: 147 m/s

Dusts

It should be used in an environment having no
conductive dusts.
It should be used in an environment having nocorrosive gasses.

Corrosive gasses
Note)

In wintertime in particular, when the heater isturned on or off, there may be condensation
resulting from a change in temperature. If
there is the possibility, countermeasures
should be taken such as keeping the panel
powered on, etc.
If the vibrations are great, countermeasures
should be taken such as:
Fixing the panel with antivibration rubber,
preventing the vibration of the structure of
the building and the floor, etc.
In a place where there are a lot of gasses or
dusts, an air purge (purification of air) of thepanel should be carried out.

Antivibration performance and shock resistance decrease when the DIN rail is installed. Use the panel
in an environment where there is no vibration or shock.
(Check the contents described in “3-1 General Specifications.”) Also, do not use it in an environment
where vibrations or shock occur continually even when the unit is fixed in the panel with screws.

4-2

Chapter 4 Installation and Wiring

Installation

4-3 Installation onto the Control Panel
In installing the µGPCsx onto the control panel, the base board can directly
be installed onto the control panel, or alternatively onto the DIN rail.

4-3-1Direct installation onto the control panel
If the base board is installed directly onto the control panel, the hardware for
installing the base board in the accessories (NP8B- ) should be used.
(1)

Installation dimensions

Outward form of thebase board
Outward form of the
hardware for installingthe base board

6 holes (4 places)

The hole size set forth in the above figure is the size of the hole made on the base board and the
hardware for installation.

Base board model

Size of the hole for
installation
A (mm)

Base board width
W (mm)

TD1BS-06

220

238

TD1BS-08

290

308

TD1BS-11395

413

TD1BS-13

465

483

TD1BP-13465

483

Chapter 4
Installationand Wiring

Note)

Note)

4-3

Chapter 4 Installation and Wiring

Installation(2)

Installation procedure of the base board
[1]

[2]

[3]

[4]

Hardware for
installing the baseboard
Control panel

[1]
[2]
[3]
[4]

Install the hardware for installing the base board (accessory). M5 screws should be used.
Hang the base board onto the hardware for installing the base.
Put screws through the holes for direct fixation and fix the base board.
Now the installation of the base board is over. After the base board is installed, each of themodules such as power supply modules, CPU modules etc. should be installed.

4-3-2Installation onto the DIN rail
If the base board is installed onto the panel using the DIN rail, the fixation
hardware (NB8B-ST) to be purchased separately should be used.
Fixation hardware (NP8B-ST)

Chapter 4
Installationand Wiring(1)

The fixation hardware to be purchased separately should be put onto
both ends of the base board and should then be fixed onto the DIN rail.

(2)

DIN rail
The DIN rail listed below should be used.

Model

Height (mm)Rail length (mm)Material

TH35-7.5

7.5

900

Steel

TH35-7.5 AL

7.5

900

Aluminum

TH35-15 AL

15

900

Aluminum

4-4Chapter 4 Installation and Wiring

Installation(3)

Installation procedure of the base board

[1]

[2]

[3]

DIN rail

Control panel

[3]
Note)

Install the DIN rail onto the control panel and hang the base board onto the DIN rail.
Put the fixation hardware through the DIN rail from both sides of the base board and insert the
hardware into the nail insertion parts of the base board.
Tighten the screws of the fixation hardware with a screwdriver. (Tightening torque: 1.0 - 1.3 N· m)
When fixing the base board, the fixation hardware must be installed onto both sides of 1 unit
without fail.

Chapter 4
Installationand Wiring

[1]
[2]

80 mm or more

4-5

Chapter 4 Installation and Wiring

Installation

4-3-3Installation of each module onto the base board
Coupler lock[1]

Erect the coupler locks of the slot in
which a module is mounted.
Put the nails at the back of the module
onto the bottom of the base board(aluminum part).

Nail

[2]

Install the upper part of the back of themodule onto the base board.
* At this time, make sure that the nails at
the upper back of the module are
securely hooked onto the bottom of
the base board (aluminum part) so thatthe module will not slide toward the leftor right. If the module is pushed inwhile it is slid toward the left or right,
the connector may be broken.

Chapter 4
Installationand Wiring

Bottom of the base board (aluminum part)[3]

Make sure that the coupler lock ishooked in the holes at the upper back of
the module. If it is loosened, push thecoupler lock toward the direction as
indicated with the arrow.

*

To remove the module, lay down the coupler lock to this side and follow the procedure in
reverse order.

Note 1)

Note 2)

4-6

Live wires must never be attached/detached. Also, modules must be removed only
after making sure that the ALM LED (red) of the power supply module has completely
been turned off.
In the event that the module has been mounted by mistake with the nails at the back of
the module are not hooked to the bottom of the base board, then lay down the coupler
lock to this side and remove it by pushing it onto the bottom of the base board.
Removing it by force may cause breakage.

Chapter 4 Installation and Wiring

Installation

4-3-4Installation height of the base board + module
The height of major modules mounted on the base board is shown in theillustration below.

Mounting
surface

Terminal block type module

PC card interface module

Chapter 4
Installationand Wiring

Connector type module

•

Note)

Make up a structure of the control panel in which ventilation, easeof operation and ease of maintenance are taken into consideration,
making reference to the dimensions in the above illustration.

4-7

Chapter 4 Installation and Wiring

Installation

4-3-5Installation position of the PC
CautionSecure the space for installation as described below and at the same time make sure that good ventilationis secured.
If ventilation is not enough, it may cause abnormal heating, resulting in a fault of the PC.
Required space is as follows.
[1]

For between the units and the remote I/Os space of 110 mm is required in the vertical direction, and spaceof 10 mm is needed in the horizontal direction.

Note)

If the base board is installed onto the DIN rail, space of 80 mm or more is required in view of the size ofthe fixation hardware and ease of installation work.

[2]

Space of 50 mm or more should be provided between the units, remote I/Os and other equipment or
structures to secure good ventilation.

[3]

Do not install heating elements (such as a heater, transformer, resistor or others) beneath the PC.

[4]

The PC should be separated (shielded) from high voltage equipment, high voltage lines and power-driven
machinery as farther as possible, and the I/O lines of the PC must not be wired in parallel with suchmachines.

[5]

The surface on which the PC is installed should be perpendicular to the floor surface of the panel, and it
must not be installed horizontally.

[6]

The angle of installing the PC should be 0° (vertical installation) and no other angle should be employed.

•

•

Fro

•

80 mm

•

•

Unit

Sid

Unit

•

O

•

•
50 mm

•

4-8

Unit

ther

•

•

•

Installation

[3]

•

0

•

•

•

0

4]
High
voltage

Remote I/O

110

Remote I/O••

Remote I/O

Chapter 4
Installationand Wiring

•
•

110

•

•

1]
10 mm or

0

•
•

0

•
0

•

•
•

0

Chapter 4 Installation and Wiring

Wiring

4-4 Wiring
4-4-1Matters requiring attention at the time of wiring work
When wiring work is carried out, safety notice must be observed without fail.
(1)

Dangerous matters at the time of installation/wiring work
DangerDo not touch live parts such as terminals etc. while electricity is on. Failure to observe this may cause
electric shock.
Mounting, dismantling, wiring work, maintenance and inspection must be made with electric power supply
shut off without fail.
Work while power is activated may cause electric shock, a malfunction or a fault.
Emergency stop circuit, interlock circuit etc. must be configured outside of the PC.
Failure to observe this may result in breakage in machines or accidents caused by a fault of the PC.
Never make the FG terminal open while short-circuiting LG - FG. (Ground the wire without fail.)
Failure to observe this may cause electric shock.

(2)

Matters requiring attention at the time of installation/wiring work

Electric wires of a size fit for the voltage to be applied and the current to be input must be selected andmust be tightened with specified torque. Any improper wiring or tightening may cause a fire or a drop,a malfunction or a fault of the product.
Screws for terminals and screws for installation must be checked at regular intervals to ensure that they
are securely tightened.
Their use while in a loosened state may cause a fire or a malfunction.
Construction work must be done so that no foreign matter such as trash, debris of electric wires, ironpowder etc. gets into the inside of equipment.
Failure to observe this may cause a fire, an accident, a malfunction or a fault of the product.
When performing the installation/wiring work of the PC, antistatic measures should be taken such as
wearing a band to remove static electricity, etc. to discharge static electricity with which human bodies
etc. are charged.
Also, do not touch directly the terminals of an IC or pins of a connector etc. on the printed circuit board.
Excessive amount of static electricity may cause a malfunction or a fault.

(3)

Matters requiring attention at the time of checking the wiring
CautionChange of a program, forced output, start-up, stop etc. while in operation must be made after making surethat safety has been secured.
Failure to observe this may cause breakage in machines or an accident as a result of functioning ofmachines by misoperation.
Loader connectors must be inserted in the proper direction. Failure to observe this may cause a
malfunction.

(4)

Matters requiring attention after the wiring is overCaution

After wiring is over, trash prevention paper in modules/units must be removed without fail.
Operation without removing the trash prevention paper may cause a fire, an accident, a malfunction ora fault of the product.

4-9

Chapter 4
Installationand Wiring

CautionChapter 4 Installation and Wiring

Wiring(5)

Other matters requiring attention
When wiring is made onto the terminal block type module, attention
must be paid to the following:•

Crimp-style terminals should be used in wiring, paying attention to theinclination of the crimp-style terminals, and an electrical spacing
between the wires adjacent to each other (3.2 mm or more) must be
secured.

•The crimp-style terminal should also be provided with an insulation
covering.
Crimp-style terminal

Terminal block

Insulation coveringWire

3.2 mmor moreCrimp-style terminal

Chapter 4
Installationand Wiring

•

4-10

When wiring, the length of the bent part of the wire should be 1.5 times
as long as the covering or more. If it is excessively short, breakage inwires may occur.

Chapter 4 Installation and Wiring

Wiring of the power supply

4-4-2Wiring of the power supply
The distance between an insulation transformer
or noise filter and the power supply module
should be made as short as possible, and theelectric wires must be twisted densely.

AC power
supplyCircuit breaker for wiring

M4 screw[1]
Insulation transformer

AC power
supplyNoise filter

Do not bundle these together ormake them come close to each other.

Note)

When connecting wires onto terminals,
crimp-style terminals must be used without fail.
(Tightening torque: 1.2 N-m)

DC power
supplyCircuit breaker for
wiring[3]
GroundingClass D grounding(Class 3 grounding)(100 Ω or less)

The distance between the DC power
supply and the power supply
module should be made as short as
possible, and the electric wires mustbe twisted densely.

[2]
Switching the power
supply voltage
Short-circuit: AC 100 V
Open: AC 200 V[4]M4 screw[1]

DC power
supply

[3]

(1)

[4]

Wiring of the power supply•

In the case of an AC power supply
2
Wires of 2 mm should be twisted densely and wired onto the power supply of AC 100 - 120
V or AC 200 - 240 V.

•

In the case of a DC power supply
2
Wires of 2 mm should be twisted densely and wired onto the power supply of DC 24 V (DC
22.8 - 26.4 V).
[For reference]

While the allowable range of the AC power supply of the µGPCsx is AC 100 V: AC 85 - 132 V,
AC 200 V: AC 170 - 264 V, it is recommended that a range should be employed that is as close
as possible to the rated values (AC 100 - 110 V, AC 200 - 220 V).
If the voltage is too low, a small amount of drop in voltage may cause a power outage, and if
the voltage is too high, the heating value of the power supply module becomes great, which
may result in the shortened service life. When the fluctuations in voltage are great, measures
should be taken such as connecting a constant voltage transformer, etc.
One of the countermeasures against the noise that comes from the power supply is to install an
insulation transformer or noise filter between the circuit breaker for wiring and the power supply
module. If this method is employed, attention should be paid to the following.
•

Do not bundle the wire of the insulation transformer or noise filter at the primary side andthat at the secondary side together or make them come close to each other. Failure toobserve this may eliminate the noise removal effect.

•

The distance between the insulation transformer or noise filter and the power supply
2
module should be made as short as possible, and wires of 2 mm must be twisted densely
when wiring.

4-11

Chapter 4
Installationand Wiring

GroundingClass D grounding(Class 3 grounding)(100 Ω or less)Chapter 4 Installation and Wiring

Wiring of the power supply(2)

Switching of power supply voltage (AC power supply only)
When short-circuiting: AC 100 V (a short-circuiting strip that is an accessoryof the power supply module should be used.)
When open:(3)

AC 200 V

Grounding
When grounding, the following should be carried out.
•

The FG terminal should be connected in the form of the branch of a tree, with the grounding
converging part of each panel, namely, with the FG bus, or with the FG converging terminal
2
block, or else with the stud. The diameter of the grounding wire should be 2 mm .
The grounding point should be as close to each unit as possible, and the length of thegrounding wire should be as short as possible.

•

The grounding converging part of each panel should be connected in the form of the branchof a tree, with a grounding converging plate that is provided for each dispersed area unit,2
and the diameter of the grounding wire should be 5.5 mm or more.

Chapter 4
Installationand Wiring

The grounding wire should be separated as farther as possible from the wires of the strong
electricity circuit and the main circuit, and at the same time it should be laid so that the
distance in which it is in parallel with such wires will be made as short as possible.
•

The grounding should be configured with dedicated grounding poles and grounding wires
that are separated from the grounding system of other strong electricity equipment.

•

The grounding should be used for the grounding only as much as possible, and thegrounding work should be of the Class D grounding (Class 3 grounding). The dedicatedgrounding poles should be separated from the grounding poles of other equipment with adistance of 10 m or more.

•

If dedicated grounding is not possible, then the shared grounding as illustrated below
should be employed.

•

If installation is made in an area having an especially unfavorable lightning surge
environment, then all of the base board, remote I/O units etc. should be electricallyinsulated from the panel board of the control panel, and besides the grounding of each unit
should be made independently, connecting it with a ground.

Other
equipment

Class D grounding(Class 3 grounding)

Dedicated grounding (best)Otherequipment

Otherequipment

Class D grounding(Class 3 grounding)Shared grounding (good)

Common grounding (no good)

DangerNever make the FG terminal open while short-circuiting LG - FG.
Failure to observe this may cause electric shock.

4-12(Ground the wire without fail.)Chapter 4 Installation and Wiring

Wiring< Example of grounding wiring >SX busControl panelPowersupplyOPCN-1 master

Operation panelPowersupplyRemoteFG busFG busGroundingconverging part

(Grounding converging part)2

5.5 mm (φ 2.6) or more

Grounding converging plate
Class D grounding(Class 3 grounding) (100 Ω or less)(4)

Wiring of the ALM contacts
If multiple power supply modules (2 units or 3 units) are mounted on 1 base board and used in
the case of power supply modules with redundancy, etc., ALM contacts are used to detect
faults of the power supply modules.
The ALM contacts should be used being wired with input modules as shown in the illustration
below, or being wired to external alarm lamps etc.
The ALM contact is a normally closed contact (b-contact), which is OFF when the power supply
module is in the state of normal operation (when the output voltage is within the range of 22.8 26.4 V), and is otherwise ON.
<Example of connection>
An example of connection by means of a DC input module (NP1X1606-W) is given in theillustration below.
The power supply in which abnormality occurred can be identified.
To ALM connectors in power supply modules

4-13

Chapter 4
Installationand Wiring[For reference]
The µGPCsx has been given sufficient countermeasures against noise, and hence can be usedwithout grounding except that the noise is especially great. If grounding of good quality
cannot be obtained in such cases as the grounding wire is used in common with otherequipment, or it is connected to the beam of a building (steel frame part), or else it is wired to
the grounding wire intended to prevent electric shock, then it is better not to make a grounding
connection.
However, even in such a case of not making a grounding connection, the control panel should
securely be grounded.

Chapter 4 Installation and Wiring

Input and output wiring

4-4-3Input and output wiring
The input and output wiring may be varied depending on the model of themodule used, external equipment being connected, electrical specifications, and an
environment in the surrounding area. Explanations of contents in general are
given herein.
(1)

Wiring of terminal block type modules< Size of wires and crimp-style terminals that can be used >The terminal block type module is of M3_10-pole, or alternatively of
M3_20-pole. When wiring, appropriate wires should be used, employing
crimp-style terminals without fail. The sizes of the terminals and wires thatcan be used in terminal block type modules are as follows.

Manufacturer

AMP

Shape

Round

Round

Chapter 4
Installationand Wiring

Nichifu

Open-end

JST Mfg.

Round
Round

NTK
Open-end
Note)

Model
36467
34104
34105
0.3-3
0.3-3N
1.25-3
1.25-3N
1.25-3S
1.25-3.5N
1.25-3.5S
2-3N
0.3Y-3
1.25Y-3
1.25Y-3N
1.25Y-3S
1.25Y-3.5
2Y-3
2Y-3.5S
AT1-10AT2-10
SRA-20-3.2
SRA-20T-3.2
0.4-3
1.25-3
VR1.25-3
VD1.25-3
VD2-3S

Wire size
2

AWG

mm

22-18

0.3 - 0.8

24-20

0.2 - 0.5

22-16

0.3 - 1.3

16-14
24-20

1.3 - 2.0
0.2 - 0.5

22-16

0.3 - 1.3

16-14

1.3 - 2.0

22-16
16-14

0.3 - 1.3
1.3 - 2.022-18

0.3 - 0.8

26-22

0.2 - 0.3

22-16

0.3 - 1.3

16-14

1.3 - 2.0

Terminal size2

If wires of 2.0 mm are used as signal wires, in some cases the terminal cover of a module may not beable to be closed.

< Tightening torque >The tightening torque for the crimp-style terminals is 0.5 - 0.7 N - m.

4-14

Chapter 4 Installation and Wiring

Input and output wiring(2)

Wiring of the connector type modules< Connectors used and the size of wires >The connector to be used is the 40-pin connector manufactured by Fujitsu as
shown below.

Type
Soldering type

Crimping type

Insulation displacement
type

Model (manufactured by Fujitsu)

Wire size

Socket:FCN-361J040-AU
Housing:
FCN-363J040
Contact:
FCN-363J-AU

AWG23 or less2
(0.26 mm or less)Standard terminal:
2
AWG24-28 (0.2 - 0.08 mm )Terminal for wires of a large size:
2
AWG22-28 (0.32 - 0.08 mm )Flat cable 1.27 mm pitch2
Stranded wire: AWG 28 (0.08 mm )2
Single wire: AWG 30 (0.05 mm )Connector cover:
FCN-360C040-B
Connector cover:
FCN-360C040-B

FCN-367J040-AU/F (cover not required)

Note)

Soldering type
Crimping type
Note)

Insulation displacement type

For the soldering type, a model manufactured by Fuji Electric (NP8V-CN1) is employed.

In the µGPCsx, connection between base boards is made by means of a
dedicated SX bus increasing cable.
Connection should be made from OUT to IN on the base board. If the wiring
is made like OUT-OUT or IN-IN, then because communication cannot beestablished, the system will not work. Also, SX bus loop back plugs must beconnected to the end terminals.
Loop back plugNote) Wiring should bemade so that thebending radius of the
SX bus increasing
cable will be 50 mm
or more.

Loop back plug

4-15

Chapter 4
Installationand Wiring

4-4-4Wiring of the SX bus increasing cableChapter 4 Installation and Wiring

Wiring4-4-5Wiring of the power supply part of the SX bus optical converter
Power to the SX bus optical converter (NP2L-0E1) is supplied by the SX bus
cable or an external power supply.
If it is powered by an external power supply, a switching power supply of DC
24 V 1 A or more that has been processed by the strengthened insulation should be
used.
Also, even if it is not powered by an external power supply, Class D grounding
must be made to the FG terminal without fail.

Power is supplied to the SX bus optical converter
and thereafter further to the SX bus interface partof the equipment having an SX bus interface.

Power being
supplied via
the SX bus

SX busSX busTouch panel(manufactured by Fuji Electric)

Chapter 4
Installationand Wiring

Class Dgrounding

Optical fiber cable

Power supply should be turnedon and off at the AC side.

Class D grounding

Power supply wires should be
densely twisted.

Power supply of strengthened
insulation
Note)

SX bus cable

In the terminal block of the optical converter unit, there
occurs ripple current fluctuations of 150 kHz, 50 mAp-p.
If the power supply line is long, it may have bad
influences on the surrounding environment, such as
noise, leakage of radio wave etc., and therefore noise
filters such as line filters etc. should be inserted near the
optical converter.
Class D groundingNote) Power that is supplied to this power supply terminal block is also supplied to the POD that is connected with the SXbus optical converter and SX bus cable and to the power supply of the interface part of the servo amplifier (maximum
0.7 A). If a lot of such SX bus equipment is connected and the power supply capacity from the SX bus exceeds 0.7
A, then the monitoring circuit inside the SX bus optical converter works and stops the power supply. To recover this,remove the causes of excessive current first, and then charge the power of the system again.

4-16

Chapter 4 Installation and Wiring

Countermeasures against noise

4-4-6Countermeasures against noise in the external wiring
As a general rule, countermeasures against noise in electronic equipment are
taken to suppress noise at its source of generation, whereas it is also important totake measures so that the equipment will not be subjected to noise. The reliabilityof the system can be improved by implementing as many items as possible out of
the countermeasures given below.
(1)

Cables provided with shield should be used for signals of a TTL level, analog
I/O signals etc., and they should be grounded at the PC side. Note, however,that the grounding at the side of the equipment connected with the PC may
give a better result depending on the condition of external noise.

Input

(2)

OutputWhen wiring, signal wires and power wires should be wired separately.
Signal wires

Power wires

Signal wires Power wires

Signal wires

Power wires

Piping type
Ceiling duct type

If these wires are put in the same duct, then the following countermeasures should betaken.
Communications
cables

Chapter 4
Installationand Wiring

Note)

Floor duct type

Note)

Communications cables such as SX
bus increasing cables, OPCN-1,
OPCN-2 etc.

300 mmor moreWeak electricity
cablesPower supply cables of DC 24 V, I/O signal
lines

300 mmor moreGeneral control
cablesAC power supply cables, general control
circuit wires

300 mmor morePower cables

Power cables

Metal plate

General control
cablesWeak electricity
cablesCommunications
cables200 mmor moreClass D grounding(Class 3 grounding)Class D grounding(Class 3 grounding)

Metal plateNote) For the wiring of OPCN-1, OPCN-2 cables, refer to the manual of each cable.

4-17Chapter 4 Installation and Wiring

Emergency stop and interlock

4-4-7Emergency stop circuit and interlock circuit
The PC has sufficient reliability and there is no possibility of a decline insafety as a result of using the PC.
However, like other electronic equipment and control equipment, its fault
cannot be eliminated completely, and therefore in order to improve its safety further,emergency stop circuit needs to be set up that enables the system to be stopped incase of emergency or when any abnormality occurs.
Note that this emergency stop circuit is realized by means of an external
circuit of the PC.
(1)

Emergency stop circuit
It needs to be configured by an external circuit and the emergency stop
switch should be installed in a place where an operator can easily operate it.
This emergency stop circuit is usually incorporated into an interlock
circuit that separates the I/O control power supply when any abnormality
occurs, which is described in (2) below.

(2)

Interlock circuit
The InterLock Relay (ILR) is to open in order to break the output power
supply in case of emergency or when any abnormality occurs.
In this interlock circuit, the contact of IXL, a relay that operates only
while the PC is in normal operation, is inserted in the lock up circuit. The
application software of the PC should be so programmed that the output of
the relay, IXL is shut off when any abnormality is detected by means of theself-diagnosis of the PC.

Chapter 4
Installationand Wiring

While the emergency stop circuit may vary depending on the PC used
and its configuration as well as the object of control, an example of the circuit
is given hereunder.

Preparing
operation

Using theoutputmodule ofthe PC

Control
circuit

Emergency
stop

Relay

4-18

Chapter 4 Installation and Wiring

Short circuit protection

4-4-8Short circuit protection of the digital output module
The type of protection of the digital output module is “output without
protection”. If short circuit protection is carried out, the fuses designated below
should externally be connected to each point.
Maximum load current/
point

Fuse model

NP1Y08T0902

2.4 A

GP40 (4A)

NP1Y08U0902

2.4 A

GP40 (4A)

NP1Y16T09P6

0.6 A

GP10 (1A)

NP1Y16U09P6

0.6 A

GP10 (1A)

NP1Y32T09P1

0.12 A

GP032 (0.32A)

NP1Y64T09P1

0.12 A

GP032 (0.32A)

NP1Y32U09P1

0.12 A

GP032 (0.32A)

NP1Y64U09P1

0.12 A

GP032 (0.32A)

NP1Y32T09P1-A

0.12A

GP032 (0.32A)

NP1Y06S

2.2 A

GP50 (5A)

NP1Y08S
NP1Y08R-04

2.2 A
2.2 A (at the time of AC)

GP50 (5A)
GP50 (5A)

NP1Y16R-08

2.2 A (at the time of AC)

GP50 (5A)

NP1W1606T

0.6 A

GP10 (1A)

NP1W1606U
NP1W3206T

0.6 A
0.12 A

GP10 (1A)
GP032 (0.32A)

NP1W3206U

0.12 A

GP032 (0.32A)

Fuse manufacturer

Daito Communication
Apparatus Co., Ltd.

Chapter 4
Installationand Wiring

Module model

4-19

Chapter 5 Maintenance/Inspection

Chapter 5
Maintenance/Inspection
5-1 General Matters of Inspection..................................................................5-1
5-1-1
5-1-2
5-1-3

Interval of inspections ............................................................................. 5-1
Matters requiring attention at the time of using the products ................... 5-1
Inspection items...................................................................................... 5-2

Chapter 5
Maintenance/
Inspection

5-2 Battery Replacement ................................................................................5-3

Chapter 5 Maintenance/Inspection

Chapter 5
Maintenance/
Inspection

Table of Contents

Chapter 5 Maintenance/Inspection

General Matters of Inspection

5-1 General Matters of Inspection
To ensure that the µGPCsx is used under the best conditions, inspections
should be carried out at regular intervals.

5-1-1Interval of inspections
The µGPCsx is chiefly made up of semiconductor devices, and hence it is a
PC of high reliability. However, the deterioration of a device may occur dependingon the surrounding environment, and therefore it is advisable that inspection should
be carried out at regular intervals. Although the standard number of times ofinspection is 1 - 2 times/year, it is recommended that the interval of inspections
should be shortened depending on the surrounding environment. If inspection
results are out of the scope of judgment criteria, improvements must be made sothat they are within the scope.

5-1-2Matters requiring attention at the time of using the products
Caution

Chapter 5
Maintenance/
Inspection

Make sure that it is used with the rated voltage and current that are indicated in the operating
instructions and manuals.
Its use with values other than the rated ones may cause a fire, a malfunction or a fault.
Make sure that it is used under the environment that is indicated in the operating instructions
and manuals.
Its use under environments of high temperatures, high humidity, condensation, dusts,
corrosive gasses, oil, organic solvent, and in particular of great vibrations and shock may be
the cause of electric shock, a fire, a malfunction or a fault.
Make sure that no foreign matters such as trash, debris of electric wires, iron powder etc. hasgotten into the inside of equipment. Also, make sure that construction work is done so thatno such matters get in there. Failure to observe this may cause a malfunction or a fault.
Screws for terminals and screws for installation must be checked at regular intervals to ensurethat they are securely tightened.
Their use while in a loosened state may cause a fire or a malfunction.

5-1

Chapter 5 Maintenance/Inspection

Inspection items

5-1-3Inspection items
When inspecting equipment, carry it out by checking the following items.
Inspection items

Contents of inspection

Judgment criteria

Inspection
methodCPU
ERR/ALM LED
Power
Voltage
supplymoduleTo check the ERR & ALM LEDs

Not lighted on

Visual inspection

Whether the measurement is within thecriteria values when measured at theterminal blockAC:
100 V: 85 V - 132 V
240 V: 170 W - 264 V
DC:
24 V: 19.2 V - 30 V
The fluctuations involtage should bewithin the above range
AC:
100 V: 85 V - 132 V
240 V: 170V - 264 V
DC:
24V: 19.2V - 30V
110 V: 90 V - 140 V
The fluctuations involtage should bewithin the above range
0°C - +55°C

TesterFluctuations

Remote I/O
power
supplyVoltage

Fluctuations

Ambient
environment

Temperature

Humidity

Vibration
Dust
State of installation

Whether there is frequent instantaneous
stops or a rapid increase or decrease involtage
Whether the measurement is within thecriteria values when measured at theterminal block

Whether there is frequent instantaneous
stops or a rapid increase or decrease involtage
Whether it is within the range of
specifications (in case of equipment inside
the panel, the temperature inside the panel
shall apply)
Whether there is any condensation.
Whether there is any conspicuous
discoloration or rust
Whether there is any vibration
Whether there is any attachment of trash or
foreign matters
Whether each card is securely fixed
Whether there is any loosening in thescrews of terminals in external wiring
Whether the connectors of connecting
cables are inserted securely

Chapter 5
Maintenance/
Inspection

Whether external wiring cables are nearlybroken apart
Battery

Whether the time of replacement has
arrivedMaintenance parts

Whether the predetermined number ofpieces are ready for use
Whether the storage condition is good
Whether there is no abnormality uponcollation
Whether the storage condition of thesource programs is good

Program

Note 1)

Note 2)

Note 3)

20% - 95% RH

There should be none
There should be none
There should be noloosening
There should be noloosening
There should be noloosening or excessive
play
There should be noabnormality inappearance
Indication on the labelof effective period

Oscilloscope

TesterOscilloscope

Maximum/
minimum
thermometer
Visualinspection,
Hygrometer
Feel
Visual inspection
Visual inspection
Screwdriver
Visualinspection,
Screwdriver
Visual inspection

Visualinspection, refer
to “5-2 Battery
Replacement”.

Inspection records

There should be noabnormality

Collation ofprograms

If a fault has occurred, one full module should be replaced. For this purpose, it is recommended thatat least a minimum quantity of spare parts should be ready for use.
The voltage of a battery decreases during storage due to self discharge. Replace it with a new one
before the replacement time arrives.
Out of the maintenance parts that are stored, the power supply module should be powered once about
every 6 months.
(for the purpose of preventing the loss of capacity of the aluminum electrolytic capacitor used in the
power supply module)

5-2Chapter 5 Maintenance/Inspection

Battery Replacement

5-2 Battery Replacement
The battery should be replaced with a new one when the replacement time
arrives, even if there is no indication of abnormality in batteries.
Also, if upon checking the “BAT” LED of the CPU module is lighted on, thenthe battery must be replaced with a new one promptly.
This is because, even if an alarm of abnormality in batteries has been
displayed, the battery can stand a power outage for a certain period of time (about
1 week at 25°C), but the alarm may possibly be overlooked.
•

Replacement time: The year and month is indicated on the battery(guarantee period).
The replacement time indicated on the battery is the year and monthafter 5 years from the date of manufacturing (at 25°C).

•

Model of the battery for replacement: NP8P-BT•

Nominal voltage:

3.6 V

Matters requiring attention•

Do not short-circuit the two poles.

•

Do not put it into fire.

•Not rechargeable.

•

Do not disassemble it.

•Upon its disposal, follow the provisions of ordinances as established by
the local administrative authorities.

(1)

Shut off the power supplied to the system. (Replacement of batteries
can be made with the system being powered.)(2)

Open the cover at the front bottom of the CPU module.

(3)

Remove the battery connector, replace the battery with a new one, andfix it.
Replacement should be made quickly (within about 5 minutes). If thesystem is put into the state of being without a battery for a long period oftime, then the contents of the power outage retaining data will beerased.

(4)

Close the battery cover.

(5)

Repower the system.

5-3

Chapter 5
Maintenance/
Inspection

Procedure of battery replacement