General Catalog

Published in July 2024

Automotive Applications
Denkaʼs high reliability and high thermal
conductivity technologies are used in cars
for our daily use.
P5,P6

Communicate Applications
Due to the increase in speed, Denka's technology
is also being utilized in the communication ﬁeld,
which is becoming more important in our lives.
P11,12

Consumer Applications
Denkaʼs original technologies are usedin adhesives for camera lens, phosphorsfor LED/LCD monitors and back light ofsmartphones and TVs.
P9,P10Industrial Applications

Denka Technologies in Electric Trains
DENKA BLACK

SpecialConductiveMaterials“Denka Black” is a carbon black manufactured via
thermal decomposition of acetylene. By virtue of its
high purity, as well as outstanding electrical andthermal conductivities, Denka black is used in diverse
applications such as electrical cables, silicone products,
IC packaging where its electrical conductivity andanti-static functionalities are leveraged upon.

Denkaʼs highly trusted technologies are supporting peopleʼs living.
By utilizing our technologies for high-temperature calcination/sintering and high thermal conductivity, we make ceramic products andhigh thermal conductive products with long- term reliability to meet industrial application needs.

DENKA AN PLATE / SN PLATE

Silicon Nitride
Powder

ALSINK

Nitridization /Particle Size ControllingTechnology

Technologies for Sintering,
Bonding, Processing(High Thermal Conductivity,
High Reliability)

DENKA BLACK

If train or elevator
stops suddenly,
many people will
have trouble to
go to offices or schools.

DENKA AN PLATE / SN PLATE
theliving ofpeoplerequireslong-term
reliability.

Denka‛s superior
technologies forhigh-temperature
calcination / sintering,

HARDLOCPower Module

DENKA AN PLATE is made of aluminum nitride
which has 7 times higher thermal conductivity thanalumina. DENKA SN PLATE is the ceramics circuitboard with high thermal conductivity which is madeof silicon nitride. We are proud of both products fortheir high reliability. These substrates are used forhigh power IGBT modules which are key-parts ofelectric trains and elevators.

The
infrastructurewhich
supports

ALSINK

Ceramic Balls

Polymer Mixture Technology(Low-Odor, Rough Mixture Adhesion,
Solventless Hardening,
Short Time Hardening in Room Temperature)

Electronic Products

The composite material which is made of aluminumand ceramics. The feature is low thermal expansion,high thermal conductivity, and light weight, It is
used for IGBT power modules for electric train andindustrial applications which require high reliability.

DENKA THERMALLY CONDUCTIVE SHEET/ SPACER

Electronic Products

The silicon-based insulating materials with highthermal conductivity which are ﬁlled with ceramics
ﬁlter. These are used for various thermal designs
with electronic materials such as street lights,
power conditioner for photovoltanics and power
supply.

Base Station for Cellphones

HARDLOC（SGA）

and high thermal
conductivity aresupporting them.

Shinkansen

Large Crane

You canrely on anduse for along time.

High Functional
Adhesive Materials

The HARDLOC series (SGA) are room temperature
curing 2 liquid mixture type acrylate-based
adhesives that Denka developed ﬁrst in the world.
It is the most suitable for the adhesion of metal andthe magnet, and shows excellent durability.

Adhesion for Elevator Unit
In otherwords, they
are not
brokeneasily!

Silicon Nitride

Bearing Balls forWind Power Generator
Here, there, andeverywhere, Denka
supports to create
the affluent society

Functional Ceramics

The raw material powder of non-oxide ceramics
which is superior for heat resistance, corrosion
resistance, and abrasion resistance. It has
possibilities for use of automotive engine parts,
electronics parts, and industrial machine parts,
various composite materials, etc.

VINI -TAPE

Submarine Cable

3

Electronic ProductsHigh Functional
Adhesive Materials

This is the ﬁrst vinyl tape in Japan that has beensuccessf u lly indust r ia li zed. Using a nenvironmentally friendly low VOC adhesive, it isused in more than 60 countries around the world
for a wide range of applications from industrial tohousehold, centering on the binding of electric
wires for electrical products.

4

Automotive Applications

Denka Technologies in Cars
DENKA HITTPLATE
Denka‛ stechnologies
are also incars that weuseeveryday.

Our technologies for high thermal conductivity and high reliability help toprogress the electric equipment of cars.
The electric equipment of cars is in progress to improve operability, amenity, and mileage. Denka makes various products with highreliability and high thermal conductivity to meet demands of the electric equipment of cars.

DENKA AN PLATESN PLATE

Technologies for
Sintering,
Bonding, Processing

DENKA BLACK
Resin Mixture
Technology
for Filler,
Processing
Technology

HARDLOC(High Thermal Conductivity,
High Reliability)

Polymer Mixture Technology(Low-odor, Rough Mixture Adhesion,
Solventless Hardening, Short TIme
Hardening in Room Temperature)

DCDC
Converter

In electricvehicles,there is apart calleda driveinverterthat has notbeen found inconventional
enginevehicles.

Drive inverter

Power
Steering
Drive Inverter

The aluminum base circuit board HITTPLATE has many products with various
types of insulating layers, and they are used for
power steering, DCDC converter, LED
head l ig ht , etc. i n va r ious automot ive
applications which require high reliability, highthermal conductivity, and high insulation
characteristic.

Denka Heat
Dissipation Sheet

DENKA HITTPLATE

Wire Harness
Vinyl Tape

Motor

Carbon Black
Synthesis Technology,
Structural Control
Technology,
High Purity Technology

The drive
inverter is an
importantcomponentthat controls
the number of
revolutions of
the motor.

Our ANP /SNP is used
for this part
because thethermalcharacteristics

andreliability
areparticularly
important.

DENKA AN PLATE / SN PLATE

DENKA THERMALLY CONDUCTIVE SHEET/SPACER

Electric Vehicle (EV)
DCDC Converter

Drive Inverter

5Electronic Products

The siricon-based insulating materials withhigh thermal conductivity which are ﬁlled withceramics ﬁller. These are used for various
thermal designs with electronic materials suchas power steering, inverter of Hybrid cars, carnavigation system, automobile camera and LiB
battery.

HARDLOC ( SGA )High Functional
Adhesive Materials

The room temperture curing 2 liquid mixture
type acrylate-based adhesive which is used forbonding magnets of speakers and motors ofcar. We are aiming to expand automotive
applications by developing new grade.

Special Conductive Materials

Specialized for lithium-ion batteries, “Denka
Black Li” maintains the standard properties ofDenka Black while having minimally low
metallic impurity content.
In addition to high electrical conductivity andelectrolyte liquid retention properties requiredin lithium-ion secondary batteries, battery
failure caused by short circuit as a result of
metallic impurities can be mitigated.

Even if the engine
turns into a motor,
it does not changethat automotive
parts require
high reliability.

LED Headlights

Electronic Products

The power module for Hybrid carsʼ inverter
which controls motor and it requires highreliability. We have variety of products such as
DENKA AN PLATE with which we are proudof itsʼ high thermal conductivity, and DENKA
AN PLATE with high strength and highreliability. Denka supplies the most suitableproducts for customerʼs requirements.

DENKA BLACK
Hybrid Vehicle (HV)Electronic Products

Because of
its reliability,
Denka
products areused forautomobiles

Lithium-ion Secondary Batteries

Wire Harness Vinyl TapeHigh Functional
Adhesive Materials

This tape is used for binding wire harnesses.
We are contributing to the weight reduction /electriﬁcation of automobiles with a lineup thatmeets needs, such as the industry's thinnest 70μm
and heat-resistant tape for high-voltage cables.

6

Semiconductor Applications
Denkaʼs products are playing great roles in every process such as manufacturing
equipment for semiconductor, machining, packing, and shipping.

Denka Technologies in Precision Instruments
Emitter (Electron source)

Semiconductors
sustains every
instruments
everywherein the world.

The emitter is essential for manufacturing andtesting of semiconductors and electronic materials.
It has superior electronic emission properties andused for electron source of electron microscope,manufacturing semiconductors, and testing
devices, etc.

Our various technologies such as polymer, multilayer, electrostatic control, pressure sensitive adhesive, spheroidizing(fusion), baking,grain body particle size combination, are used in the process of manufacturing semiconductors.

ELEGRIP

Denka Spherical Silica

Functional Film

Boron Nitride Shapes Emitter
Denka‛s technologies
are protecting
such important
semiconductors.

High Adhesion,
High Accuracy,
Easy Detachment
Technology

Spheroidizing, Particle Size
Combination Technology

Materials,
Multilayer,
Electrostatic
Control Technology

Nitridization,
Sintering Technology,
Processing Technology

For example,
tools to protect
for shipping
semiconductors.

Denka Thermofilm and Thermosheet
have transparency which allows to checkthe contents visually and protectingfrom dust and electrostatics.

Semiconductor
Manufacture

which supports
delivering
semiconductors
to the world.

Denka‛s
products andtechnologies
are playing
great roles invarious scenes.

7

Denka Boron Nitride (Shapes)

It mayseem simple
but it isa veryimportanttechnology

Functional Ceramics

It is sintered hexagonal crystal boron nitride
powder (h-BN) which has superior thermal
conductivity, heat resistance, lubricity, corrosion
resistance, and electric insulation. It can be molded
to any shape that customer wants.

Precision
Assembling
Technology

Semiconductor
Manufacturing

Electronic Products

Denka Spherical Silica

Advanced Specialty Materials

Itʼs coefﬁcient of thermal expansion is the smallest
in industrial materials, and accumulation of thetechnologies for many years has developed acharacteristic with high sphericity and variety ofparticle size distribution to meet the customersʼ
demands. As ﬁller for semiconductor sealingmaterial, it has No.1 share in the global market.

ELEGRIPHigh Functional
Adhesive Materials

ELEGRIP is the protecting and temporary ﬁxing
purpose tape for materials during polishing or
cutting process of wafer and electronic materials.
Varieties of grades are available for various needs
such as high accuracy and diversiﬁcation of materials.

Denka Thermoﬁlm ALS

High Functional Films

Denka Thermoﬁlm ALS is a heat-seal type coverﬁlm for emboss carrier and it shows good
detachment characteristic for bottom carrier tapematerials such as polystyrene, polycarbonate,polyester.

Denka Thermosheet EC

High Functional Films

Denka Thermosheet EC is a sheet for emboss
carrier tape, and addition to general type; it hasvarieties of grades for various needs such as
electric conductivity, antistatic. It has superior
formability and dimensional accuracy, and it canbe shaped by various forming methods.

8Consumer Applications

Denka Technologies in Smartphones
As digital signage,
LCD TV,

Denka technologies such as baking, polymer mixture,and pressure sensitive adhesive are useful for opt electronics related applications.

Denka Boron Nitride ( Powder )It is the hexagonal crystal boron nitride powder(h-BN) which has superior thermal conductivity,
heat resistance, lubricity, corrosion resistance, andelectric insulation. It is widely used for moldreleasing agent, lubricant, and high thermal
conductive insulating ﬁller.

The baking technology is used for phosphor as light source of LED, and the pressure sensitive adhesive technology is used for adhesive
to assemble optical pick-up or camera lens. These technologies are playing active parts.
Denka Boron Nitride(Powder)

Phosphor

Denka
Spherical Alumina
and LCD displayof smartphones,
Denka‛sphosphors areused in many LED
backlights forthese products.

Nitride, Sintering,
Particle Size
Control Technology

TV

Nitridization,
SinteringTechnology

PC/ Monitor

Smartphone

Denka Spherical Alumina

Nitride, Particle Size
Control Technology

LED Light

Phosphor

The LEDbacklight iscomposedby Red andGreenphosphorsand Blue
light LED.

Digital Signage

Functional Ceramics

The ALONBRIGHT Phosphor is produced upon
our ceramics technologies which have beencultivated for many years. It has varieties of
selectable colors from green to red, and by using it
for backlight of LCD display or LED for lighting; it
can implement vivid light as well as higher
brightness characteristic and higher reliability
compare to conventional products.

HARDLOC ( OP/UV )High Functional
Adhesive Materials

HARDLOC (OP/UV) series are ultraviolet-curing
type adhesives. The visibility can be improved byadjusting refractive index by full-ﬁlling airspace infront cover glass, touch panel, and LCD module. It
is also used for organic light-emitting diode(OLED)of the next generation display panels.

TV
Denka developed highperformance phosphor byusing original baking
technology.

Smartphone

9

Advanced Specialty Materials

High sphericity high thermal conductive ﬁller
which is developed by Denkaʼs original hightemperature fusing technology. It makes highﬁlling easier than grinding form ﬁller and it cancontrol abrasion of mixer and mold. Same as
spherical silica, it has various particle size
distribution, and we can adjust depending on a
purpose (particle size : 100μm 〜 submicron size).

Let‛slook atthereasonwhy.

LED Light

Functional Ceramics

Computer

Caralyan OPP TapeThat‛s why wecan provide
clearer picturewith energy
conservation.

High Functional
Adhesive Materials

Packing tape using a polypropylene ﬁlm basematerial with excellent tensile strength, oil
resistance, and water resistance. Not only forcorrugated cardboard sealing, but also for printing
with original name and tape that can be cut straightand cleanly by hand, it contributes to image
enhancement and work efﬁciency.

10Communicate Applications

Denka's technology is also available for 5G
From now on,
it ‛ s the age of 5G.

Various technologies such as ﬁring technology and spheroidizing technology for silica and alumina, ﬁlm forming technology for LCP,
and polymerization technology for LDM are utilized in Denka's products.

LCP ﬁlm

SNECTON

Fused Silica（low dielectric loss tangent type）

SNECTON（LDM:Low dielectoric organic insulating material）

Denka's
proprietaryproducts
are used tocreate acomfortableinternetenvironment.

Thermal interface
materials formobile basestations

Developed ProductA thermoplastic ﬁlm with excellent electricalcharacteristics(low dielectric constant, lowdielectric loss tangent), low hygroscopicity, andhigh heat resistance. It is ﬂexible and has excellent
copper foil adhesion, so it can be used for ﬂexible
circuit board applications for 5G.

Denka's technology supports the evolution of high-speed communication.

DENKA THERMALLYCONDUCTIVE SHEET
Denka
DENKA THERMALLY
Spherical Alumina CONDUCTIVE SPACER

LCP ﬁlm

Material of the ﬂexible
circuit board to
be used insmart phones, etc.

By using materials
that reduce transmission loss

For high frequency
substrates andvarious interlayer
insulating materials

smartphones

data centers

Fused silica（low dielectric loss tangent type） Advanced Specialty Materials

Denka Spherical Alumina

Materials that easily release heat
are used for high-frequency
mobile base stations.

Mobile base stations

A new resin material with excellent electricalcharacteristics(low dielectric constant, lowdielectric loss tangent), low hygroscopicity, andhigh heat resistance. Although it is soft, it has
crosslinkability, hardness can be easily adjusted byblending with other thermosetting resins, and it
has excellent adhesion to copper foil. For thesereasons, it is used for high-frequency circuitboards and various interlayer insulating materials.

A ceramic powder with excellent electricalcharacteristics. It is expected to be applied to rigid
boards used in 5G communication equipment. It
can be used w it h t he same workabilit y as
conventional fused silica, and is expected to have a
low dielectric loss tangent. In addition, we have alineup of particle sizes from submicron to 5
micron.
It leads to theprovision of acomfortable 5G
environment by
maximizing thecharacteristics ofhigh-frequency
communication.

in-vehicle radars

AdvancedSpecialty
Materials

Materials that are not easily
affected by changes inhumidity and temperature areused for in-vehicle radar.

5G base stations

Denka's technology ishidden right next to you.

Advanced Specialty Materials

A heat dissipation ﬁller that is mixed with materials
such as thermal paste in 5G communication
mobile base stations. Since it is highly spherical, it
can be ﬁlled more than amorphous ﬁllers, andbecause it can be designed with a wide range ofparticle sizes, it is possible to cover all directions in
the medium and high heat dissipation zones.
Spherical alumina will contribute to a wide heatdissipation band in order to suppress performance
deterioration due to heat generated by increasing
the frequency of communication.

DENKA THERMALLY CONDUCTIVE SHEETDENKA THERMALLY CONDUCTIVE SPACER Electronic Products
A silicone-based insulating material that is highly
ﬁlled with a ceramic ﬁller with high thermal
conductivity.
The amount of heat generated increases with thehigher performance of the elements of theelectronic control unit for 5G base stations. Denka
thermal interface materials is used to solve theheat control problem.

List of Electronic Materials

13

Denka Thermosheet EC

Denka Thermoﬁlm ALS

ELEGRIP

DENKA HITTPLATE

DENKA THERMALLYCONDUCTIVE SHEET/SPACER

The bottom part emboss carrier tapematerial for carrying electronic partsand semiconductors.

The covering tape for carrying electronicparts and semiconductors.

Semiconductor wafer grinding / dicing/surface protection / temporary ﬁxing
tape

The metal base circuit board with highthermal conductivity.

The high heat dissipation electric
insulation material.

The electron/ion source for microscope,
testing device, and manufacturing
semiconductors.

P8

P8

P8

P6

P4,P6

P8

DENKA AN PLATE
DENKA SN PLATEHARDLOC (SGA)

The composite material with low
thermal expansion and high thermal
conductivity.

The ceramic circuit board with highthermal conductivity.

The 2 liquid mixture type acrylate-based
adhesive (room temperature curing).

P4

P4,P6

P4,P6

ALONBRIGHT

Denka Spherical Silica

Denka Spherical Alumina

ALSINKThe high performance phosphor for LED.

The spherical silica with electric
insulation and low thermal expansion
characteristics.

The spherical alumina with highthermal conductivity.

P10

P8

P10,P12

Denka Boron Nitride(Boron Nitride) : Powder

Denka Boron Nitride(Nitrogen Boron) : Shapes

The boron nitride powder used as
lubricant, releasing agents and highthermally conductive ﬁller.

P10

Emitter (Electron source)

Silison Nitride Powder

HARDLOC (OP/UV )DENKA BLACK

The boron nitride shapes can easily bemachined into custom shapes.

The ceramic raw material powder withhigh heat resistance, corrosion resistance,
and abrasion resistance.

The ultraviolet-curing type adhesive.

Outstanding electrical conductivity,
thermal conductivity, ultra-high purity
carbon black

P8

P4

P10

P4,P6

14

List of Electronic Materials
VINI-TAPE

Wire Harness Vinyl Tape

Caralyan OPP Tape

Polyvinyl chloride adhesive tape forelectrical insulation.

Polyvinyl chloride adhesive tape for
automobile wirin.

Polypropylene packing tape

P4

P6

Fused Silica

SNECTON(low dielectric loss tangent type)(LDM:Low dielectoric organic insulating material)

Low dielectric loss tangent sphericalsilica ﬁller for high frequency boards.

Soft insulation material for highfrequency.

Domestic Office in JapanP10

LCP ﬁlm
Liquid crystal resin ﬁlm for highfrequency boards

Osaka Umeda Twin Towers, North 25F
P12

15

P12

P12

16

Subsidiaries and OfficeDenka Chemicals G.m.b.H

Kaiserswerther Straße 183, 40474
Düsseldorf, Germany
TEL : +49-211-130990 FAX : +49-211-329942
E-mail : info@denkagermany.de

Denka Advantech Pte. Ltd.

Ofﬁce

Factory

Denka Chemicals Shanghai Co., Ltd.
SHENZHEN BRANCH

8 Jurong Town Hall Road #07-01 The JTC
Summit Singapore 609434
TEL : +65-6321-9530 FAX : +65-6224-3840
E-mail : denkasingapore@denka.com.sg

Room 1205, CITIC Building, 1093 Shennan Middle
Road, Futian District, Shenzhen
TEL : +86-755-2599-1766

Denka Chemicals Shanghai Co., Ltd.

1802A, Gubei Fortune Center Phase II,
No.1438 Hongqiao Rd., Changning District,
Shanghai, China 200336
TEL : +86-21-6236-9090 FAX : +86-21-6236-8770
E-mail : shanghai@denka.com.cn

Denka Taiwan Corporation

Described on P15

4F-2, No.76, Nanjing W Rd. Datong District, Taipei
103-52 Taiwan R.O.C
TEL : +886-2-2558-2026 FAX : +886-2-2558-2606
E-mail : denka-taiwan@denka.com.tw

Denka Corporation ‒N.Y.

780 Third Avenue, 8th Floor New York,
NY10017,U.S.A.
TEL : +1-212-688-8700 FAX : +1-212-688-8727 Email : info@denka.us.com

Denka Corporation ‒ California Oﬃce2540 North 1st Street. #290 San Jose,CA 95131,USA
TEL : +1-408-371-8826 FAX : +1-408-371-8986

Denka Advantech Pte.Ltd. Tuas Plant

11A Tuas Avenue 20, Singapore 638823
TEL : +65 - 6861- 0004 FAX : +65 - 6861- 4139

Denka Singapore Pte.Ltd. Merbau Plant
300 Ayer Merbau Road, Singapore 628282
TEL : +65 - 6867- 8496 FAX : +65 - 6867- 8595

Denka Advanced Materials Vietnam Co.,Ltd.
Plot D-5, Thang Long Industrial Park II Yen My
District, Hung Yen Province, Vietnam
TEL：+84 -221- 397- 4805 FAX：+84 -221- 397- 4806

Denka Advanced Materials (Suzhou) Co.,Ltd.

Unit 9B, Modern Industrial Square, No.333 Xingpu Road, Suzhou
Industrial Park, Suzhou Jiangsu, China 215126
TEL : +86 - 512- 6287-1088 FAX : +86 - 512- 6287-1066

Denka Chemicals Development (Suzhou) Co.,Ltd.

Unit 1D, Modern Industrial Square, No.333 Xingpu Road,
Suzhou Industrial Park, Suzhou, Jiangsu, China 215126
TEL : +86 - 512- 6280 - 6808 FAX : +86 - 512- 6280 - 6809

Denka Electronic Materials (Dalian) Co.,Ltd.

No.41-10 Wanda Road Dalian Economic & Technological
Development Zone, Dalian, Liaoning Province 116600, China
TEL : +86 - 411- 6263 - 4377 FAX : +86 - 411- 6263 - 4378

17

Denka Korea Co., Ltd.

Rm 1615-1617, Hansin intervalley 24west bldg,
Yeoksam-dong Teheran-Ro 322 Gangnam-gu,
Seoul, Korea 06211
TEL : +82 -2-2183-1025 FAX : +82 -2-2183-1019