Passive GaAs MMIC IQ Mixer

MMIQ-1040S

1. Device Overview
1.1 General Description
MMIQ-1040S is a high linearity, passive GaAs MMIC IQ mixer. This is
an ultra-broadband mixer spanning 10 to 40 GHz on the RF and LO
ports with an IF from DC to 12 GHz. Up to 30 dBc of image rejection isavailable due to the excellent phase and amplitude balance of its on-chip
LO quadrature hybrid. Both wire bondable die and connectorized
modules are available.

1.2 Electrical SummaryDie

Module1.3 Applications

Parameter

TypicalUnit

RF/LO Frequency Range
IF Frequency Range
I+Q Conversion Loss
Image Rejection
LO-RF Isolation

10 - 40
DC - 12
9
25
44

GHz
GHz
dB
dBc
dB

▪ Single Side Band & Image Rejection
Mixing▪ IQ Modulation/Demodulation▪ Vector Amplitude Modulation▪ Band Shifting▪ 5G Band Support

1.4 Functional Block Diagram

1.5 Part Ordering Options1

1

Part
NumberDescription

PackageGreen
Status

Product
Lifecycle

ExportClassification

MMIQ-1040SCH-2

Wire bondable die

CH

RoHS

Active

EAR99

MMIQ-1040SS

Connectorized
module, die wire
bonded onto PCB

S

RoHS

Active

EAR99

Refer to our website for a list of definitions for terminology presented in this table.

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4.

Table of Contents
1.

4.2 Down-Converter ........................... 16

Device Overview ............................... 1

4.3 Up-Converter ............................... 18
4.4 Band Shifter ................................ 19

1.2 Electrical Summary ......................... 1

4.5 Vector Modulator ......................... 20

1.3 Applications ................................... 1
1.4 Functional Block Diagram ................ 1

5.

Port Configurations and Functions ...... 3

5.2 Handling Precautions .................... 21

2.1 Port Diagram ................................. 3
2.2 Port Functions ............................... 3
Specifications ................................... 4
3.1 Absolute Maximum Ratings .............. 4

Die Mounting Recommendations ....... 21
5.1 Mounting and Bonding
Recommendations .............................. 21

1.5 Part Ordering Options ..................... 1

3.

Application Information .................... 15
4.1 Detailed Description ..................... 15

1.1 General Description ........................ 1

2.

MMIQ-1040S

5.3 Bonding Diagram .......................... 22
6.

Mechanical Data ............................. 23
6.1 CH Package Outline Drawing ......... 23
6.2 S Package Outline Drawing ............ 23

3.2 Package Information ....................... 4
3.3 Recommended Operating Conditions . 4
3.4 Sequencing Requirements ............... 4
3.5 Electrical Specifications .................. 5
3.6 Typical Performance Plots ............... 6
Revision History
Revision Code-

Revision Date
November 2019

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Comment
Datasheet Initial Release

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MMIQ-1040S

2. Port Configurations and Functions
2.1 Port Diagram
A top-down view of the MMIQ-1040S’s CH package outline drawing is shown below. The mixer
may be operated as either a downconverter or an upconverter. Use of the RF or IF as the input or
output port will depend on the application. See Application Information for input and output port
configuration for common applications.

2.2 Port Functions
Port

Function

Description

Port 1

RF Input/Output

Port 1 is DC short and AC matched to50Ω over the specified RF frequency
range.

Port 2

LO Input

Port 2 is DC open and AC matched to50Ω over the specified LO frequency
range.

Port 3

I Input / Output

Port 3 is diode coupled and AC matched
to 50Ω over the specified I portfrequency range.

Port 4Q Input / Output

Port 4 is diode coupled and AC matched
to 50Ω over the specified Q portfrequency range.

GroundCH package ground path is provided
through the substrate and ground bondpads. S package ground provided
through metal housing and outer coax
conductor.

GND

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3. Specifications
3.1 Absolute Maximum Ratings
The Absolute Maximum Ratings indicate limits beyond which damage may occur to the device. If
these limits are exceeded, the device may be inoperable or have a reduced lifetime.
Parameter

Maximum Rating

Units

DC Current, at any Ports

30

mA

Power Handling, at any Port

+27

dBm

Operating Temperature-55 to +100

°C

Storage Temperature-65 to +125ºC

3.2 Package Information
Parameter

Details

RatingESD

Human Body Model (HBM), per MIL-STD-750, Method 1020

Class 1A

WeightS Package

14 g

3.3 Recommended Operating Conditions
The Recommended Operating Conditions indicate the limits, inside which the device should be
operated, to guarantee the performance given in Electrical Specifications. Operating outside theselimits may not necessarily cause damage to the device, but the performance may degrade outside
the limits of the electrical specifications. For limits, above which damage may occur, see Absolute
Maximum Ratings.
Min

Nominal

Max

Units

TA, Ambient Temperature

-55

+25

+100

°C

LO drive power

+18

+20

+25

dBm

+16

dBm

RF/IF input power

3.4 Sequencing Requirements
There is no requirement to apply power to the ports in a specific order. However, it isrecommended to provide a 50Ω termination to each port before applying power. This is a passive
diode mixer that requires no DC bias.

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3.5 Electrical Specifications
The electrical specifications apply at TA=+25°C in a 50Ω system. Typical data shown is for a down
conversion application with a +20dBm sine wave LO input.
Min and Max limits apply only to our connectorized units and are guaranteed at TA=+25°C. All bare die are 100% DC tested and visuallyinspected.

Parameter

Test Conditions

Min

TypicalMax

RF (Port 1) Frequency Range

1040

LO (Port 2) Frequency Range

1040

I (Port 3) Frequency Range012

Q (Port 4) Frequency Range

0

12

RF/LO = 10 - 38 GHz
I = DC - 0.2 GHz
RF/LO = 38 - 40 GHz
I = DC - 0.2 GHz
RF/LO = 10 - 40 GHz
I = 0.2- 12 GHz
RF/LO = 10 - 38 GHz
Q = DC - 0.2 GHz
RF/LO = 38 - 40 GHz
Q = DC - 0.2 GHz
RF/LO = 10 - 40 GHz
Q = 0.2 - 12 GHz
RF/LO = 10 - 40 GHz
I = DC - 0.2 GHz
RF/LO = 10 - 40 GHz
Q = DC - 0.2 GHz
RF/LO = 10 - 25 GHz
I+Q = DC - 0.2 GHz

Conversion Loss (CL)2

Noise Figure (NF)3

Image Rejection (IR)4

12

15

12.5

16

Units

GHz

12
dB
12

15

13

17

14
12
dB
12
25

dBc

Amplitude Balance

0.1

dB

Phase Balance

5°

Isolation

LO to RF

RF/LO = 10 - 40 GHz

44

LO to IF

IF/LO = 10 - 40 GHz

49

RF to IF

RF/IF = 10 - 40 GHz
RF/LO = 10 - 40 GHz
I = DC - 0.2 GHz

41

Input IP3 (IIP3)5

I+Q

Input 1 dB Gain
Compression
Point (P1dB)

I

16

Q

17

27

dB

dBm
dBm

2

Measured as an I/Q down converter. (i.e., I and Q powers are not combined)
Mixer Noise Figure typically measures within 0.5 dB of conversion loss for IF frequencies greaterthan 5 MHz.
4
Image Rejection and Single sideband performance plots are defined by the upper sideband (USB)or lower sideband (LSB) with respect to the LO signal. Plots are defined by which sideband isselected by the external IF quadrature hybrid.
5
Typical IIP3 is measured with I and Q ports combined with an external IF quadrature hybrid
coupler.
3

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3.6 Typical Performance Plots
The test conditions and frequency plan below apply to all following sections, unless otherwise
specified.
ParameterPort

RF Input Frequency

1

RF Input PowerLO Input Frequency

2

LO Input PowerStart

Nominal

5

Stop

Units

45

GHz

-10
5.091

dBm
45.091

GHz

+20

dBm

91
91
91

MHz

TA, Ambient Temperature

+25

°C

Z0, System Impedance50Ω

IF Output Frequency

I
Q
I+Q6

3
4
3+4

6

I+Q measurements taken with an external quadrature hybrid attached to the I and Q ports of themixer. Orientation depends on up conversion or down conversion measurement.

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MMIQ-1040S

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3.6.1 Typical Performance Plots: LO Harmonics Isolation
LO harmonic isolation plots taken with the following test conditions and based on the following
fundamental input signal frequency plan:
ParameterPort

RF Input Frequency

1

RF Input PowerLO Input Frequency

2

LO Input PowerStart

Nominal

5

Stop

Units

45

GHz

-10
5.091

dBm
45.091

GHz

+20

dBm

91
91

MHz

TA, Ambient Temperature

+25

°C

Z0, System Impedance50Ω

IF Output Frequency

I
Q

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4

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3.6.2 Typical Performance Plots: Band Shifter7
Band Shifter performance plots are taken with the following test conditions and frequency plan:
ParameterPort

IF Input Frequency
IF Input Power2
2

LO Input Frequency8

3+4

LO Input Power

3+4

RF Output Frequency

1

Start

NominalStop

See Plot
-10
0.7

GHz
dBm
15

+9
IF+0.7

Units

GHz
dBm

IF+15

GHz

TA, Ambient Temperature

+25

°C

Z0, System Impedance

50

Ω

7

Band shifter utilizes the mixer in a unique configuration with a low frequency LO signal. Refer tothe Application Information section for more details.
8
Low frequency LO quadrature hybrid used to take data is the QH-0R714.

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3.6.3 Typical Performance Plots: Vector Modulator
Vector Modulator performance plots are taken with the following test conditions and frequency
plan:
Parameter

Port

Input Frequency

2

Input PowerI/Q Input Current

I
Q

Output Frequency

Start
5

3
4
1

Nominal

Stop

Units

45

GHz

-10

dBm

+18
+18

mA

5

45

GHz

TA, Ambient Temperature

+25

°C

Z0, System Impedance50Ω

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MMIQ-1040S

3.6.4 Typical Performance Plots: Downconversion Spurious Suppression9
Typical spurious data is provided by selecting RF and LO frequencies (± m*LO ± n*RF) within the
RF/LO bands, to create a spurious output within the IF band. The mixer is swept across the fullspurious band. The data shown in the graphs below are for a -10 dBm RF input. Spurious
suppression is scaled for different RF power levels by (n-1), where “n” is the RF spur order. For
example, the 2LO x 2RF spur is 70 dBc for a -10 dBm input, so a -20 dBm RF input creates aspur that is (2-1) x (-10 dB) lower, or 80 dBc. Data is shown for the frequency plan in 3.6 Typical
Performance unless otherwise stated.

9

Measured as an I/Q mixer (not IR/SSB mixer). SSB/IR mixers experience additional spurious
suppressions.

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MMIQ-1040S

3.6.5 Typical Performance Plots: Upconversion Spurious Suppression10
Typical spurious data is provided by selecting IF and LO frequencies (± m*LO ± n*RF) within the
IF/LO bands, to create a spurious output within the RF band. The mixer is swept across the fullspurious band. The data shown in the graphs below are for a -10 dBm IF input. Spurious
suppression is scaled for different IF power levels by (n-1), where “n” is the RF spur order. For
example, the 1LO x 2IF spur is 73 dBc for a -10 dBm input, so a -20 dBm IF input creates a spurthat is (2-1) x (-10 dB) lower, or 83 dBc. Data is shown for the frequency plan in 3.6 Typical
Performance unless otherwise stated.

10

Measured as an I/Q mixer (not IR/SSB mixer). SSB/IR mixers experience additional spurious
suppressions.

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MMIQ-1040S

4. Application Information

4.1 Detailed Description
MMIQ-1040S belongs to Marki Microwave’s MMIQ family of mixers. The MMIQ product line
consists of passive GaAs MMIC mixers designed and fabricated with GaAs Schottky diodes.
MMIQ mixers offer excellent amplitude and phase balance due to its on-chip LO quadrature hybrid.
Up to 30 dB of image rejection (i.e., single sideband suppression) can be obtained by using the
MMIQ-1040 as an image rejection or single sideband mixer. The MMIQ-1037H and MMIQ-1040L
are the sister mixers of the MMIQ-1040S. The MMIQ-1040S requires a higher LO drive tooperate the mixer. In exchange, the MMIQ-1040S displays higher linearity (i.e., higher IIP3, P1dB,
Spurious Suppression) than the MMIQ-1040L or MMIQ-1037H. Marki S, H, and L diodes
correspond to different diode forward turn on voltages.
Band support for the low frequency 5G frequencies in K and Ka bands is offered by the ultrabroadband performance of the mixer’s RF and LO ports (ports 1 and 2). Direct baseband to Ka
band frequency conversions are available by using of this mixer as an up-converter. Traditional useof this mixer to do image reject or single sideband mixing is available with an external IF quadrature
hybrid. The MMIQ-1040 is also suitable for use as a Vector Modulator through DC bias of the I
and Q ports (ports 3 and 4).
Port 1, the RF port, and port 2, the LO port, supports a 10-40 GHz signal. Ports 3 and 4, the I
and Q ports, support a DC-12 GHz signal. A signal may be input into any port of the mixer which
supports that signal’s frequency. This is the basis of using the mixer as a band shifter.
For a given LO power within the recommended operating range, the RF (in the case of a down
conversion) or IF (in the case of an up conversion) input power should be below the input 1 dBcompression point to avoid signal distortion. The input 1 dB compression point will vary across themixer’s operating bandwidth and with LO input power. Careful characterization is required for
optimal performance for each application. There is no minimum small signal input power requiredfor operation. Excessive RF/IF input power increases non-desired spurious output power anddegrades the fundamental conversion loss. Excessive LO input power can also cause this effect.

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MMIQ-1040S

4.2 Down-Converter

A down converter is a mixer application which takes a high frequency small signal RF input, and ahigh frequency large signal LO input and mixes the signals together to produce a low frequency IF
output. The fundamental 1RFx1LO outputs present at the IF port are the fLO-RF and fLO+RF tones.
The desired output in a down conversion is typically the f LO-RF term. An image frequency at
fImage=f2LO-RF will also down convert to the fLO-RF frequency. The above illustration shows the relative
location of the image frequency for a highside LO, or the frequency plan for which f LO > fRF.
To use the IQ mixer as a down converter, input a high frequency small signal RF input into port 1,
a high frequency large signal LO input into port 2, and pull the low frequency IF output from ports
3 and 4. Ports 3 and 4 will output the IF signals I and Q. I and Q IF outputs will be at the same
frequency but 90° out of phase (i.e., I and Q are in quadrature). If only a single IF output isdesired, terminate either the I or Q ports with a wideband 50Ω load.
This is the input scheme was used to take I/Q down-conversion data found in the Typical
Performance Plots section.

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MMIQ-1040S

4.2.1 Image Reject Down-Converter

An image reject mixer is a mixer which rejects the down converted image frequency from the IF
output. Image reject mixers are constructed using an external quadrature hybrid attached to the I
and Q (i.e., IF) output ports of an IQ mixer. Using the external IF quadrature hybrid, one can selectwhether the upper sideband or lower sideband signal is suppressed with respect to the LO signal.
To use the IQ mixer as an image reject mixer, input the high frequency small signal RF into port 1
and a high frequency large signal LO input into port 2. Take the combined I+Q down converted
signal through the IF quadrature hybrid. Select the upper sideband (i.e., suppress the lower
sideband) by connecting the I port to the 0° port of the IF quadrature hybrid and attach the Q port
to the 90° port of the IF quadrature hybrid. Select the lower sideband (i.e., suppress the upper
sideband) by attaching the I port to the 90° port of the IF quadrature hybrid and attach the Q port
to the 0° port of the IF quadrature hybrid.
This is the input scheme was used to take image rejection down-conversion data found in the
Typical Performance Plots section.

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MMIQ-1040S

4.3 Up-Converter

An up converter is a mixer application which takes a low frequency small signal IF input, and a highfrequency large signal LO input and mixes the signal together to produce a high frequency RF
output. The fundamental 1IFx1LO outputs present at the RF port are the f LO-IF and fLO+RF tones.
An up conversion can select either the fLO-IF or the fLO+IF tones. The above illustration shows bothup converted sidebands with either an I or Q port input signal.
To use the IQ mixer as an up converter, input a low frequency small signal IF input into port 3 or4, a high frequency large signal LO input into port 2, and pull the high frequency RF output fromport 1. Input into the Q port will result in a up converted signal that is 90° out of phase with theup converted I port input signal. If only a single IF input is desired, terminate either the I or Q
ports with a wideband 50Ω load.
This is the input scheme used to take I/Q up-conversion data found in the Typical Performance
Plots section.
4.3.1 Single Sideband Up-Converter

A single sideband mixer is a mixer which suppresses the up converted image frequency from theRF output. Single sideband mixers are constructed using an external quadrature hybrid attachedto the I and Q (i.e., IF) input ports. Using an external IF quadrature hybrid, one can select whether
the upper sideband or the lower sideband signal is suppressed with respect to the LO signal.
To use the IQ mixer as a single sideband mixer, input the low frequency small signal I+Q IF signal
into the IF quadrature hybrid. The IF quadrature hybrid is attached to the I and Q ports of the IQ
mixer. Input the high frequency large signal LO input into port 2 and take the up converted highfrequency RF signal from port 1. Select the upper sideband (i.e., suppress the lower sideband) byattaching the I port to the 90° port of the IF quadrature hybrid and attach the Q port to the 0°
port of the IF quadrature hybrid. Select the lower sideband (i.e., suppress the upper sideband) byattaching the I port to the 0° port of the IF quadrature hybrid and attach the Q port to the 90°
port of the IF quadrature hybrid.
This is the input scheme used to take single sideband up-conversion data found in the Typical
Performance Plots section.

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MMIQ-1040S

4.4 Band Shifter

A band shifter is an unusual application for a mixer. Band shifters take an IF signal and shift it to adifferent band, generally to either avoid interference or for rebroadcast at a different frequency.
For cases in which the desired band shift cannot be employed by using a standard up or down
conversion scheme, an exotic input scheme is required.
A passive diode mixer is reciprocal on all ports. Port 1, the RF port, supports a 10-40GHz signal.
Port 2, the LO port, supports a 10-40GHz signal. Ports 3 and 4, the IF ports, support a DC12GHz signal. 2 signals input into any combination of the 3 ports, RF, LO, or IF, will result in an
output signal at the 3rd port. In addition, an output signal will be present at both input ports. By
using the IF port, as a large signal input port, low frequency LO applications can be supported.
The diagram above shows an IQ mixer being used as a band shifter. Using an IQ mixer as a band
shifter allows for sideband suppression. This is identical to using the IQ mixer as a single sideband
up converter. However, the large signal input port is now 3+4 versus port 2. Selection of theoutput tone is done through the orientation of the LO quadrature hybrid.
To use the mixer as a single sideband band shifter, input a low frequency large signal LO into theexternal LO quadrature hybrid. Input the high frequency small signal IF signal into port 2 and takethe high frequency RF output from port 1. Select the upper sideband (i.e., suppress the lower
sideband) by connecting the I port to the 90° port of the IF quadrature hybrid and connect the Q
port to the 0° port of the LO quadrature hybrid. Select the lower sideband (i.e., suppress theupper sideband) by connecting the I port to the 0° port of the LO quadrature hybrid and connect
the Q port to the 90° port of the LO quadrature hybrid.
This is the measurement scheme used to take vector modulator data found in the Typical
Performance Plots: Vector Modulator section.
Using this input scheme requires careful accounting of which input signal is injecting which port.
Injecting a signal into any port which does not support the correct band will lead to a degraded or
no output response. Abide by the maximum DC current input into the I and Q ports of the mixer orotherwise irreversible damage to the mixer will occur.
The limitation in use of the mixer as an image reject band shifter is in the bandwidth of the external
LO quadrature hybrid and bandwidth of the I and Q ports.

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MMIQ-1040S

4.5 Vector Modulator

A vector modulator is a device that can modulate an input signal’s amplitude and phase. Similar tousing a double balanced mixer as a phase modulator or phase shifter, an IQ mixer can be used as avector modulator. An IQ mixer can be used as a vector modulator by inputting DC current into
both the I and Q ports.
Injecting DC current into both the I and Q ports forward biases both mixer cores and causes them
to be shorted. This connects the RF and LO baluns allowing the input signal to pass from balun tobalun without a frequency conversion. Modulating the DC current into either or both I and Q
mixers causes both the phase and amplitude to modulate based on the polarity of the input current
and the magnitude of the input current. Modulating only the I or Q mixers causes the device tobehave as a biphase modulator (i.e., the device can only swing the phase from +90° to -90°).
To use the IQ mixer as a vector modulator, supply a DC current sufficient to turn on the mixer
through both the I and Q ports. Current limiting the DC source to the maximum DC current value
found in section 3.1 Absolute Maximum Ratings is recommended to prevent irreversible damage tothe vector modulator. The typical DC current required to turn on the vector modulator is <30mA.
This is the input scheme used to take vector modulator data found in the Typical Performance
Plots: Vector Modulation section.
It is recommended to sequence the vector modulator by slowly increasing the DC bias until thevector modulator is operating at the user desired condition.
Near the band edges of the vector modulator, more current than is typical for mid-band operation
may be necessary to achieve the same amplitude and phase shift. This is due to the on chip LO
quadrature hybrid operating near its band edge.

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MMIQ-1040S

5. Die Mounting Recommendations
5.1 Mounting and Bonding Recommendations
Marki MMICs should be attached directly to a ground plane with conductive epoxy. The groundplane electrical impedance should be as low as practically possible. This will prevent resonancesand permit the best possible electrical performance. Datasheet performance is only guaranteed in
an environment with a low electrical impedance ground.
Mounting
To epoxy the chip, apply a minimum amount of conductive epoxy to the mounting surface so that athin epoxy fillet is observed around the perimeter of the chip. Cure epoxy according to
manufacturer instructions.
Wire Bonding
Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding witha nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge
bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy toachieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the
package or substrate. All bonds should be as short as possible <0.31 mm (12 mils).
Circuit Considerations
50 Ω transmission lines should be used for all high frequency connections in and out of the chip.
Wirebonds should be kept as short as possible, with multiple wirebonds recommended for higher
frequency connections to reduce parasitic inductance. In circumstances where the chip more than.001” thinner than the substrate, a heat spreading spacer tab is optional to further reducebondwire length and parasitic inductance.

5.2 Handling Precautions
General Handling
Chips should be handled with care using tweezers or a vacuum collet. Users should takeprecautions to protect chips from direct human contact that can deposit contaminants, likeperspiration and skin oils on any of the chip's surfaces.
Static Sensitivity
GaAs MMIC devices are sensitive to ESD and should be handled, assembled, tested, andtransported only in static protected environments.
Cleaning and Storage
Do not attempt to clean the chip with a liquid cleaning system or expose the bare chips to liquid.
Once the ESD sensitive bags the chips are stored in are opened, chips should be stored in a dry
nitrogen atmosphere.

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MMIQ-1040S

5.3 Bonding Diagram

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MMIQ-1040S

6. Mechanical Data
6.1 CH-2 Package Outline Drawing

1.
2.
3.

CH Substrate material is 0.004 in thick GaAs.
I/O trace finish is 4.2 microns Au. Ground plane finish is 5 microns Au.
XXXX denotes circuit number.

6.2 S Package Outline Drawing

Marki Microwave reserves the right to make changes to the product(s) or information contained herein without notice.
Marki Microwave makes no warranty, representation, or guarantee regarding the suitability of its products for any
particular purpose, nor does Marki Microwave assume any liability whatsoever arising out of the use or application of any
product.

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