Call for Papers
3 Steps to Contribute a Presentation
Join JSAP

SubmitRegister

Regular Membership
Admission Fee: 10,000 JPY
Annual Due: 10,000 JPY

Submission Deadline:

Early-bird Registration(until August 30, 2024)
Non-student (JSAP Member/Partner Society Member*):
12,000 JPY
JSAP Senior Member:
4,000 JPY
Non-student (Non-member) : 23,000 JPY
Student(Speaker/Onsite Audience):

Graduate Student/
Student Membership
Admission Fee: 3,000 JPY
Annual Due: 3,000 JPY

June 18 (Tue.),
2024 (17:00, JST)No late submission is
accepted after thedeadline.

Annual due will be waivedfor the first year.

Submission will open onMay 27(Mon.), 2024v

3,000 JPY
Student (Online Audience *excluding speaker):
0 JPY
Late Registration(from March 8, 2024)
Non-student (JSAP Member /Partner Society Member*):
JSAP Senior Member:
Non-student (Non-member) :Student(Speaker/Audience):

18,000 JPY
7,000 JPY
30,000 JPY
5,000 JPY

Registration will open on May 27 (Mon.),2024.
(*) JSAP’s Partner Societies: APS(American Physical Society), CSOE(Chinese Society for Optical Engineering), EOS(EuropeanOptical Society), EPS(European Physical Society), IOP(Institute of Physics), JIEP(Japan Institute of Electronics Packaging),KPS(Korean Physical Society), OPTICA(formerly OSA, The Optical Society), OSJ(Optical Society of Japan), OSK(Optical Societyof Korea), PESJ(Physics Education Society of Japan), PSROC(The Physical Society of Republic of China), SPIE(InternationalSociety for Optical Engineering ), Physics Society of the Philippines(SPP), TPS(Taiwan Photonics Society)

Submission Deadline

June 18 (Tue.), 2024 (5:00pm, JST)*No late submission is accepted.

Call for Papers
Papers are solicited for the following sessions and symposia.
The date and section of your presentation will be determined by our program committee and informed
you in late January. Your papers may be forwarded from a regular session to a symposium and vice versa.
Regular Sessions
Category
Focused Session "AI Electronics"

KS Sessions organized by JSAP's Professional Group

1. Interdisciplinary Physics and Related Areas of Science andTechnology

2. Ionizing Radiation

Section

31.1(Keywords)
brain-inspired computer, neuromorphic, neural network, synapse device,memory, Computation-In-Memory (CIM), Processing-In-Memory (PIM),
combinational optimization, annealing, quantum machine learning, quantum
AI, optical computing, reservoir computing, physical reservoir, integration ofsensors and AI, AI processing in sensor, emerging computing technologies:
materials/devices

KS.1

Solid State Quantum Sensor Group

KS.2

Quantum Information Engineering Group

KS.3

Green Transition of Fabrication Group

1.1
1.2
1.3
1.4
1.5
1.6
2.1

Interdisciplinary and General Physics
Education
Novel technologies and interdisciplinary engineering
Energy conversion, storage, resources and environment
Instrumentation, measurement and Metrology
Ultrasonics
Detection Devices
Radiation physics fundamentals & applications, radiation generators, newtechnology
Accelerator Mass Spectrometry, Accelerator Beam Analysis
Medical application
Radiation-induced phosphorsBasic optics and frontier of optics (merged with formerly 3.2 Equipment optics
and materials)
Information photonics and image engineering (formerly 3.3)
Biomedical optics (formerly 3.4)
Laser system and materials (formerly 3.5)
Ultrashort-pulse and high-intensity lasers (formerly 3.6)
Laser processing (formerly 3.7)
Optical measurement, instrumentation, and sensor (formerly 3.8)
Terahertz technologies (formerly 3.9)
Optical quantum physics and technologies (formerly 3.10)
Photonic structures and phenomena (formerly 3.11)
Nanoscale optical science and near-field optics (formerly 3.12)
Semiconductor optical devices (formerly 3.13)
Optical control devices and optical fibers (formerly 3.14)
Silicon photonics and integrated photonics (formerly 3.15)
Optics and Photonics English Session (formerly 3.16)
Plasmonics and Nanophotonics
Photonics Devices, Photonic Integrated Circuit and Silicon Photonics
Laser sources and Laser applications
Information Photonics
Nanocarbon and 2D Materials
Terahertz Photonics
Quantum Optics and Nonlinear Optics
Ferroelectric thin films
Carbon-based thin films
Oxide electronics
Thin films and New materials
Surface Physics, VacuumProbe Microscopy
X-ray technologies
Applications and technologies of electron beams
Micro/Nano patterning and fabrication
Ion beams
Atomic/molecular beams and beam-related new technologies
Plasma production and diagnostics
Plasma deposition of thin film, plasma etching and surface treatment
Plasma nanotechnology
Plasma life sciences
Plasma phenomena, emerging area of plasmas and their new applications
Plasma Electronics English Session
Plasma Electronics Invited Talk
Plasma Electronics Division Award Speech

2.2
2.3
2.4
2.5
3. Optics and Photonics

4 JSAP-OSA Joint Symposia*English Session

6. Thin Films and Surfaces

7. Beam Technology and Nanofabrication

8. Plasma Electronics*All-English session is scheduled in the section 8.6.

3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
3.13
3.14
3.15
4.1
4.2
4.3
4.4
4.5
4.6
4.7
6.1
6.2
6.3
6.4
6.5
6.6
7.1
7.2
7.3
7.4
7.5
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8

Regular Sessions (continued)
Category
9. Applied Materials Science

10. Spintronics and Magnetics*English presentation are welcomed in this category. Outstanding
presentations by student speakers will be awarded.

11. Superconductivity

Section
9.1
9.2
9.3
9.4
9.5
10.1
10.2
10.3
10.4
10.5
11.1
11.2

12. Organic Molecules and Bioelectronics

13. Semiconductors

15. Crystal Engineering

16. Amorphous and Microcrystalline Materials

17. Nanocarbon and Two-Dimensional Materials

Joint Session K "Wide bandgap oxide semiconductor materials anddevices"

Joint Session M

Joint Session N

11.3
11.4
11.5
12.1
12.2
12.3
12.4
12.5
12.6
12.7
13.1
13.2
13.3
13.4
13.5
13.6
13.7
13.8
13.9
15.1
15.2
15.315.4
15.5
15.6
15.7
16.1
16.2
16.3
17.1
17.2
17.3

Dielectrics, ferroelectrics
Nanoparticles, Nanowires and Nanosheets
Nanoelectronics
Thermoelectric conversion
New functional materials and new phenomena
Emerging materials in spintronics and magnetics (including fabrication andcharacterization methodologies)
Fundamental and exploratory device technologies for spin
Spin devices, magnetic memories and storages
Semiconductor spintronics, superconductor, multiferroics
Application of magnetic field
Fundamental properties
Thin and thick superconducting films, coated conductors and film crystal
growthCritical Current, Superconducting Power Applications
Analog applications and their related technologies
Junction and circuit fabrication process, digital applications
Fabrications and Structure Controls
Characterization and Materials Physics
Functional Materials and Novel Devices
Organic light-emitting devices and organic transistors
Organic and hybrid solar cells
Nanobiotechnology
Biomedical Engineering and Biochips
Fundamental properties, surface and interface, and simulations of Si relatedmaterials
Exploratory Materials, Physical Properties, Devices
Insulator technology
Si processing /Si based thin film / MEMS / Equipment technology
Semiconductor devices/ Interconnect/ Integration technologies
Nanostructures, quantum phenomena, and nano quantum devices
Compound and power devices, process technology and characterization
Optical properties and light-emitting devices
Compound solar cells
Bulk crystal growth
II-VI and related compounds
III-V-group epitaxial crystals, Fundamentals of epitaxy
III-V-group nitride crystals
Group IV crystals and alloys
Group IV Compound Semiconductors (SiC)
Crystal characterization, impurities and crystal defects
Fundamental properties, evaluation, process and devices in disorderedmaterials
Energy Harvesting
Bulk, thin-film and other silicon-based solar cells
Carbon nanotubes & other nanocarbon materials
Graphene
Layered materials

21.1(Keywords)
thin film growth, characterization of physical properties, transparent
conductive oxide film, electronic devices, optical devices, novel functional
materials & development of novel technologies

22.1(Keywords)
material development and material properties, measurement methods, theory
and simulation, thermal conduction and phonon transport, nanoscale and low
dimensional system, band engineering, coherent control, phonon polariton,
magnon, thermal management and design technology, device application,thermoelectrics, thermal storage, thermal insulation, micro/nanomechanics,
heat dissipation, thermal conversion, nano-structure/device fabrication
technology

23.1(Keywords)
materials informatics, process informatics, measurement informatics, database,data mining, machine learning, deep learning, sparse modeling, statisticalanalysis, causal analysis, optimization, data assimilation, high-throughput,
automation, robotics"Phonon Engineering""Informatincs"

Symposium
See https://meeting.jsap.or.jp/english/symposiumSubmission Guidelines (for contributed papers)
1 Qualification

Speakers of contributed presentation (oral and poster presentations) should be JSAP Regular Members, JSAPStudent Members and JSAP’s Partner Societies* Members.
*JSAP’s partner societies: American Physical Society (APS), CSOE(Chinese Society for Optical Engineering),
European Optical Society (EOS), European Physical Society (EPS), Institute of Physics (IOP), JIEP (Japan
Institute of Electronics Packaging), Korean Physical Society (KPS), OPTICA (formerly OSA), Optical Society ofJapan (OSJ), Optical Society of Korea (OSK), Physics Education Society of Japan (PESJ), Physical Society ofRepublic of China (PSROC), International Society for Optical Engineering (SPIE), Physics Society of thePhilippines(SPP) and Taiwan Photonics Society (TPS).

2. Handling of abstract (PDF)

1) Our program committee draws up a program according to speakers’ requests. However, the programcommittee may forward your abstract to another category for the benefit of the overall program.
2) JSAP holds the copyright on the submitted abstracts, and all the submitted abstracts will be
published on the online conference program, extended abstracts DVD and J-STAGE.
3) The abstracts submitted to the JSAP-OPTICA Joint Symposia (held only in JSAP Autumn Meeting) willbe also published in OPTICA Publishing Group Digital Library. JSAP grants to OPTICA a perpetual,non-exclusive, royalty-free license to use them in any type of media including print or electronic.
4) The maximum number of submission per person is 3.

3. JSAP Young Scientist Presentation Award

JSAP Young Scientist Presentation Award will be presented to young JSAP members (under 34 years ofage as of April 1, 2024) who have presented outstanding papers.
A poster presentation is not eligible for the award.
To apply for the award, please select “apply” upon online submission. Applicants for the award will beindicated as such in the program.
The applicants for the JSAP Young Scientist Presentation Award are required to present in person. If theapplicants make a presentation online, they become unqualified for the award.

4. Poster Award

Poster Award will be presented to JSAP members who give the most outstanding poster presentationof research that represents a valuable contribution to the field of applied physics. The nominees for
Poster Award will be selected by the Program Committee based on the content of the extended
abstract . No entry is required.

5. Substitute Speaker
If a registered speaker is unavailable on the day due to unavoidable circumstance, the speaker shall beable to appoint a substitute to speak on their behalf. A substitute speaker must be the member
mentioned in the preceding 1 and the co‐author of the submitted paper. The substitute speaker mustregister for the conference and complete the payment of the registration fee.
6. No-Show policy(Oral Session)
If a speaker doesn’t show up within 5 minutes of their scheduled presentation time, the presentation
will be deemed as “No-Show”.
(Poster Session)
If a poster is not put up by 5 minutes after the starting time of the session, the presentation will bedeemed as “No-Show”.
No-show presentations will be indicated as such on the conference web program.
If any circumstances arise where the registered speaker is unable to present the paper at the meeting,please make sure to inform the secretariat (meeting@jsap.or.jp) in advance.
The absence with prior notification will be indicated as “Absence” on the conference web program.