600 V High Voltage 3-phase Motor Drivers

SCM1270MF Series

Data Sheet

Description

Package

The SCM1270MF series are high voltage 3-phasemotor drivers in which transistors, pre-drive circuits, andbootstrap circuits (diodes and resistors) are highly
integrated.
These products can run on a 3-shunt current detection
system and optimally control the inverter systems of
medium-capacity motors that require universal input
standards.

DIP33
Pin Pitch: 1.27 mm
Mold Dimensions: 47 mm × 19 mm × 4.4 mm

Features● Temperature Sensing Function● In Case of Abnormal Operaion, All Outputs Shut
Down via the FO1, FO3, and SD Pins Connected
Together● Built-in Bootstrap Diodes with Current Limiting
Resistors (22 Ω)● CMOS-compatible Input (3.3 V or 5 V)
● Pb-free (RoHS Compliant)● Isolation Voltage: 2500 V (for 1 min)
UL-recognized Component (File No.: E118037)● Fault Signal Output at Protection Activation● Protections Include:
Undervoltage Lockout for Power Supply
High-side (UVLO_VB): Auto-restartLow-side (UVLO_VCC): Auto-restart
Overcurrent Protection (OCP): Auto-restart
Simultaneous On-state Prevention: Auto-restart

Typical Application
VCC

VFO

U1

SCM1270MF Series

RFO
1

INT

LS1 33

FO1

Not to scale

Selection Guide● Power Device: IGBT + FRD (600 V)
IO

Part Number

15 A

SCM1272MF

20 A

SCM1274MF

30 A

SCM1276MF

Applications
For motor drives such as:● Refrigerator Compressor Motor● Air Conditioner Compressor Motor● Washing Machine Main Motor● Fan Motor● Pump Motor

2 OCP1CFO

3 LIN1LIN14 COM1MIC1U 32

5 HIN1HIN1

6 VCC1

31

Controller
power
supply7

CBOOT1

DZVT

VB1

8 HS1

LS2
9

SD

10 VT
11 LIN2
12 COM2
13 HIN2

Thermal
LIN2

RVT
HIN2

30

V

MIC2

29

M

Controller

14 VCC2

28
15

CBOOT2VB2

16 HS2
17

LS3

FO3

27

18 OCP3
19 LIN3LIN320 COM3

MIC3

W

26

21 HIN3HIN3

22 VCC3

VDC

VBB
25

VB3
24 HS323

CBOOT3

RO

A/D

CO

DRS

RS

COM

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 2017

1

SCM1270MF Series
Contents
Description ------------------------------------------------------------------------------------------------------ 1
Contents --------------------------------------------------------------------------------------------------------- 2
1. Absolute Maximum Ratings----------------------------------------------------------------------------- 4
2. Recommended Operating Conditions ----------------------------------------------------------------- 5
3. Electrical Characteristics -------------------------------------------------------------------------------- 6
3.1. Characteristics of Control Parts------------------------------------------------------------------ 6
3.2. Bootstrap Diode Characteristics ----------------------------------------------------------------- 7
3.3. Thermal Resistance Characteristics ------------------------------------------------------------- 7
3.4. Transistor Characteristics ------------------------------------------------------------------------- 8
3.4.1. SCM1272MF ----------------------------------------------------------------------------------- 8
3.4.2. SCM1274MF ----------------------------------------------------------------------------------- 9
3.4.3. SCM1276MF ----------------------------------------------------------------------------------- 9
4. Mechanical Characteristics --------------------------------------------------------------------------- 10
5. Insulation Distance -------------------------------------------------------------------------------------- 10
6. Truth Table ----------------------------------------------------------------------------------------------- 11
7. Block Diagram ------------------------------------------------------------------------------------------- 12
8. Pin Configuration Definitions ------------------------------------------------------------------------- 13
9. Typical Applications ------------------------------------------------------------------------------------ 14
10. Physical Dimensions ------------------------------------------------------------------------------------ 16
10.1. Leadform 2552 ------------------------------------------------------------------------------------- 16
10.2. Leadform 2557 (Long Lead Type) ------------------------------------------------------------- 17
10.3. Reference PCB Hole Sizes ----------------------------------------------------------------------- 18
11. Marking Diagram --------------------------------------------------------------------------------------- 18
12. Functional Descriptions -------------------------------------------------------------------------------- 19
12.1. Turning On and Off the IC ---------------------------------------------------------------------- 19
12.2. Pin Descriptions ----------------------------------------------------------------------------------- 19
12.2.1. U, V, and W----------------------------------------------------------------------------------- 19
12.2.2. VB1, VB2, and VB3 ------------------------------------------------------------------------- 19
12.2.3. HS1, HS2, and HS3 ------------------------------------------------------------------------- 20
12.2.4. VCC1, VCC2, and VCC3 ------------------------------------------------------------------ 20
12.2.5. COM1, COM2, and COM3---------------------------------------------------------------- 20
12.2.6. HIN1, HIN2, and HIN3; LIN1, LIN2, and LIN3 -------------------------------------- 20
12.2.7. VBB -------------------------------------------------------------------------------------------- 21
12.2.8. LS1, LS2, and LS3 -------------------------------------------------------------------------- 21
12.2.9. OCP1 and OCP3----------------------------------------------------------------------------- 22
12.2.10. FO1 (U-phase) and FO3 (W-phase) ------------------------------------------------------ 22
12.2.11. SD (V-phase) --------------------------------------------------------------------------------- 23
12.2.12. VT ---------------------------------------------------------------------------------------------- 23
12.3. Temperature Sensing Function ----------------------------------------------------------------- 23
12.4. Protection Functions ------------------------------------------------------------------------------ 24
12.4.1. Fault Signal Output ------------------------------------------------------------------------- 24
12.4.2. Shutdown Signal Input --------------------------------------------------------------------- 24
12.4.3. Undervoltage Lockout for Power Supply (UVLO) ----------------------------------- 24
12.4.4. Overcurrent Protection (OCP) ----------------------------------------------------------- 25
12.4.5. Simultaneous On-state Prevention ------------------------------------------------------- 27
13. Design Notes ---------------------------------------------------------------------------------------------- 28
13.1. PCB Pattern Layout ------------------------------------------------------------------------------ 28
13.2. Considerations in Heatsink Mounting -------------------------------------------------------- 28

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 20172

SCM1270MF Series
13.3. Considerations in IC Characteristics Measurement --------------------------------------- 28
14. Calculating Power Losses and Estimating Junction Temperature ---------------------------- 29
14.1. IGBT Steady-state Loss, PON -------------------------------------------------------------------- 29
14.2. IGBT Switching Loss, PSW ----------------------------------------------------------------------- 30
14.3. Estimating Junction Temperature of IGBT -------------------------------------------------- 30
15. Performance Curves ------------------------------------------------------------------------------------ 31
15.1. Transient Thermal Resistance Curves -------------------------------------------------------- 31
15.2. Performance Curves of Control Parts--------------------------------------------------------- 32
15.3. Performance Curves of Output Parts --------------------------------------------------------- 37
15.3.1. Output Transistor Performance Curves ------------------------------------------------ 37
15.3.2. Switching Loss Curves --------------------------------------------------------------------- 39
15.4. Allowable Effective Current Curves ----------------------------------------------------------- 42
15.4.1. SCM1272MF --------------------------------------------------------------------------------- 42
15.4.2. SCM1274MF --------------------------------------------------------------------------------- 43
15.4.3. SCM1276MF --------------------------------------------------------------------------------- 44
15.5. Short Circuit SOAs (Safe Operating Areas) ------------------------------------------------- 45
15.5.1. SCM1272MF --------------------------------------------------------------------------------- 45
15.5.2. SCM1274MF --------------------------------------------------------------------------------- 45
15.5.3. SCM1276MF --------------------------------------------------------------------------------- 46
16. Pattern Layout Example ------------------------------------------------------------------------------- 47
17. Typical Motor Driver Application ------------------------------------------------------------------- 49
Important Notes ---------------------------------------------------------------------------------------------- 50

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 20173

SCM1270MF Series
1.

Absolute Maximum Ratings

Current polarities are defined as follows: current going into the IC (sinking) is positive current (+); current coming
out of the IC (sourcing) is negative current (−).
Unless specifically noted, TA = 25 °C.
Parameter
SymbolConditions
Rating
Unit
Remarks
Main Supply Voltage
VBB–LSx
VDC
450
V
(DC)
Main Supply Voltage
VDC(SURGE) VBB–LSx
500
V(Surge)IGBT Breakdown
VCC = 15 V, IC = 1 mA,
VCES
600
V
VIN = 0 V
Voltage
VCCx–COMx
VCC
20
Logic Supply Voltage
V
VBx–HSx
VBS
20
15
SCM1272MF
TC = 25 °C, TJ < 150 °C
Output Current(1)IO
20A
SCM1274MF
30
SCM1276MF
SCM1272MF
TC = 25 °C,
30
SCM1274MF
pulse width ≤ 1ms,
Output Current (Pulse)
IOP
A
single pulse
45
SCM1276MF
V−0.5 to 7

V−0.5 to 7V−10 to 5

V

TC(OP)−30 to 100

°C

TJ
TSTG

150
−40 to 150

°C
°C

2500

V

VIN

FOx Pin Voltage

VFO

SD Pin Voltage

VSD

OCPx Pin Voltage

VOCP

Operating Case
Temperature(2)Junction Temperature(3)Storage Temperature
Isolation Voltage(4)HINx–COMx,
LINx–COMx
FO1–COM1,
FO3–COM3
SD–COM2
OCP1–COM1,
OCP3–COM3−0.5 to 7

Input Voltage

VISO(RMS)

Between surface ofheatsink side and eachpin; AC, 60 Hz, 1 min(1)Should be derated depending on an actual case temperature. See Section 15.4.
Refers to a case temperature measured during IC operation.
(3)
Refers to the junction temperature of each chip built in the IC, including the control MIC, transistors, andfreewheeling diodes.
(4)
Refers to voltage conditions to be applied between all of the pins and the case. All the pins have to be shorted.
(2)

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 20174

SCM1270MF Series
2.

Recommended Operating Conditions
Parameter

SymbolConditions

Min.

Typ.

Max.

Unit

VDC

COM1 = COM2 = COM3,VBB–COM

—

300

400

V

VCC

VCCx–COMx

13.5

—

16.5

V

VBS

VBx–HSx

13.5

—

16.5

V

VIN

0

—

5.5

V

tIN(MIN)ON

0.5

—

—

μs

tIN(MIN)OFF

0.5

—

—

μs

Dead Time of Input Signal

tDEAD

1.5

—

—

μs

FOx Pin Pull-up Resistor

RFO

1

—

22

kΩ

FOx Pin Pull-up Voltage
FOx Pin Noise Filter
Capacitor
VT Pin Pull-down
Resistor
Bootstrap Capacitor

VFO

3.0

—

5.5

V

CFO

—

—

1000

pF

RVT

10

—

—

kΩ

10

—

220

μF

12

—

—

Main Supply Voltage
Logic Supply Voltage
Input Voltage(HINx, LINx, FOx, and SD)

Minimum Input Pulse
Width

CBOOT
IOP ≤ 45 A

Shunt Resistor(1)RS

RC Filter ResistormΩ

IOP ≤ 30 A

18

—

—

RO

(2)

—

—

100

Ω

RC Filter Capacitor

CO

(2)

—

—

8200

pF

PWM Carrier Frequency

fC

—

—

20

kHz

(1)
(2)

Remarks

SCM1276MF
SCM1272MF
SCM1274MF

Should be a low-inductance resistor.
Requires the time constants that satisfy the following equation (see also Section 12.4.4): R O × CO < 0.82 μs.

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 2017

5

SCM1270MF Series
3.

Electrical Characteristics

Current polarities are defined as follows: current going into the IC (sinking) is positive current (+); current coming
out of the IC (sourcing) is negative current (−).
Unless otherwise specified, TA = 25 °C, VCC = 15 V.

3.1.

Characteristics of Control Parts
Parameter

SymbolConditions

Min.

Typ.

Max.

Unit

Remarks

Power Supply Operation
Logic Operation Start
Voltage

VCC(ON)

VCCx–COMx

10.5

11.5

12.5

V

VBS(ON)VBx–HSx

10.5

11.5

12.5

V

Logic Operation Stop
Voltage

VCC(OFF)

VCCx–COMx

10.0

11.0

12.0

V

VBS(OFF)VBx–HSxVCC1 = VCC2 = VCC3,
COM1 = COM2 = COM3,
VCC pin current in 3-phase
operation
VBx–HSx = 15 V,
HINx = 5 V; VBx pin current
in 1-phase operation

10.0

11.0

12.0

V

—

3

—

mA

—

140

—

μA

VIH

1.5

2.0

2.5

V

VIL

1.0

1.5

2.0

V

ICC
Logic Supply Current
IBS
Input Signal
High Level Input Threshold
Voltage(HINx, LINx, FOx, and SD)
Low Level Input Threshold
Voltage(HINx, LINx, FOx, and SD)
High Level Input Current(HINx and LINx)
Low Level Input Current(HINx and LINx)

IIH

VIN = 5 V

—

230

500

μA

IIL

VIN = 0 V

—

—

2

μA

VFOL

VFO = 5 V, RFO = 10 kΩ

—

—

0.5

V

VFOH

VFO = 5 V, RFO = 10 kΩ

4.8

—

—

V

VTRIP

0.46

0.50

0.54

V

OCP Hold Time

tP

20

26

—

μs

OCP Blanking Time

tBK

—

370

—

ns

SD Pin Filtering Time
Temperature Sensing
Voltage*tFIL(SD)

135

300

—

ns

2.69

2.75

2.81

V

Fault Signal Output
FOx Pin Voltage at Fault
Signal Output
FOx Pin Voltage in Normal
Operation
Protection
OCP Threshold Voltage

VT

VTRIP = 1 V
TJ(MIC) = 125 °C,

VRT = 10 kΩ

* Determined by the junction temperature of the control parts, not of the output transistors.

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 2017

6

SCM1270MF Series
3.2.

Bootstrap Diode Characteristics
Parameter

SymbolBootstrap Diode Leakage Current
Bootstrap Diode Forward
Voltage
Bootstrap Diode Series Resistor

ILBD
VFB

3.3.

Conditions

Min.

Typ.

Max.

Unit

VR = 600 V

—

—

10

μA

IFB = 0.15 A

—

1.1

1.3

V

17.6

22.0

26.4

Ω

Min.

Typ.

Max.

Unit

—

—

3

°C/W

—

—

4

°C/W

RBOOT

Remarks

Thermal Resistance Characteristics
Parameter

SymbolR(J-C)Q(2)Junction-to-Case Thermal
Resistance(1)R(J-C)F(3)Conditions
1 element operating(IGBT)
1 element operating(freewheeling diode)

Remarks(1)

Refers to a case temperature at the measurement point described in Figure 3-1, below.
Refers to steady-state thermal resistance between the junction of the built-in transistors and the case. For transient
thermal characteristics, see Section 15.1.
(3)
Refers to steady-state thermal resistance between the junction of the built-in freewheeling diodes and the case.
(2)

24

1

25

33
Measurement point

Figure 3-1.

Case Temperature Measurement PointSCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 20177

SCM1270MF Series
3.4.

Transistor Characteristics
HINx/
LINx
0

trr
ton
td(on) tr

ID/
IC

toff
td(off) tf
90%

10%

0

VDS/
VCE

0

Figure 3-2.

Switching Characteristics Definitions

3.4.1. SCM1272MF
Parameter
Collector-to-Emitter Leakage
Current
Collector-to-Emitter Saturation
Voltage
Diode Forward Voltage

SymbolConditions

Min.

Typ.

Max.

Unit

ICES

VCE = 600 V, VIN = 0 V

—

—

1

mA

VCE(SAT)IC = 15 A, VIN = 5 V

—

1.7

2.2

V

VF

IF = 15 A, VIN = 0 V

—

1.75

2.2

V

—

100

—

ns

—

700

—

ns

—

110

—

ns

—

1200

—

ns

High-side Switching
Diode Reverse Recovery Timetrr

Turn-on Delay Timetd(on)

Rise Timetr

Turn-off Delay Timetd(off)Fall Time

tf

—

100

—

ns

Diode Reverse Recovery Time

trr

—

100

—

ns

Turn-on Delay Timetd(on)

—

800

—

ns

Rise Time

tr

—

120

—

ns

Turn-off Delay Timetd(off)

—

1200

—

ns

Fall Time

tf

—

100

—

ns

VDC = 300 V, IC = 15 A,
VIN = 0→5 V or 5→0 V,
TJ = 25 °C,
inductive load

Low-side Switching

VDC = 300 V, IC = 15 A,
VIN = 0→5 V or 5→0 V,
TJ = 25 °C,
inductive load

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 20178

SCM1270MF Series
3.4.2. SCM1274MF
Parameter
Collector-to-Emitter Leakage
Current
Collector-to-Emitter Saturation
Voltage
Diode Forward Voltage

SymbolConditions

Min.

Typ.

Max.

Unit

ICES

VCE = 600 V, VIN = 0 V

—

—

1

mA

VCE(SAT)IC = 20 A, VIN = 5 V

—

1.7

2.2

V

VF

IF = 20 A, VIN = 0 V

—

1.9

2.4

V

—

100

—

ns

—

900

—

ns

—

160

—

ns

—

1300

—

ns

High-side Switching
Diode Reverse Recovery Timetrr

Turn-on Delay Timetd(on)

Rise Timetr

Turn-off Delay Timetd(off)Fall Time

tf

—

120

—

ns

Diode Reverse Recovery Time

trr

—

100

—

ns

Turn-on Delay Timetd(on)

—

900

—

ns

Rise Time

tr

—

190

—

ns

Turn-off Delay Timetd(off)

—

1300

—

ns

Fall Time

tf

—

120

—

ns

VDC = 300 V, IC = 20 A,
VIN = 0→5 V or 5→0 V,
TJ = 25 °C,
inductive load

Low-side Switching

VDC = 300 V, IC = 20 A,
VIN = 0→5 V or 5→0 V,
TJ = 25 °C,
inductive load

3.4.3. SCM1276MF
Parameter
Collector-to-Emitter Leakage
Current
Collector-to-Emitter Saturation
Voltage
Diode Forward Voltage

SymbolConditions

Min.

Typ.

Max.

Unit

ICES

VCE = 600 V, VIN = 0 V

—

—

1

mA

VCE(SAT)IC = 30 A, VIN = 5 V

—

1.7

2.2

V

VF

IF = 30 A, VIN = 0 V

—

1.9

2.4

V

—

100

—

ns

—

800

—

ns

—

150

—

ns

—

1200

—

ns

High-side Switching
Diode Reverse Recovery Timetrr

Turn-on Delay Timetd(on)

Rise Timetr

Turn-off Delay Timetd(off)Fall Time

tf

—

170

—

ns

Diode Reverse Recovery Time

trr

—

100

—

ns

Turn-on Delay Timetd(on)

—

800

—

ns

Rise Time

tr

—

180

—

ns

Turn-off Delay Timetd(off)

—

1200

—

ns

Fall Time

tf

—

190

—

ns

VDC = 300 V, IC = 30 A,
VIN = 0→5 V or 5→0 V,
TJ = 25 °C,
inductive load

Low-side Switching

VDC = 300 V, IC = 30 A,
VIN = 0→5 V or 5→0 V,
TJ = 25 °C,
inductive load

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 20179

SCM1270MF Series
4.

Mechanical Characteristics

Parameter
Conditions
Min.
Typ.
Max.
Unit
Heatsink Mounting
*
0.588
—
0.784
N∙m
Screw Torque
Flatness of Heatsink
See Figure 4-1.
0
—
200
μm
Attachment Area
Package Weight
—
11.8
—
g
* Requires using a metric screw of M3 and a plain washer of 7.0 mm (φ). For more on screw tightening, see Section
13.2.

Heatsink

Measurement position

-+

-

+

Heatsink

Figure 4-1.

5.

Flatness Measurement Position

Insulation DistanceParameter

Clearance

Conditions

Min.

Typ.

Max.

Unit

Between heatsink* and leads.
See Figure 5-1.

2.0

—

2.5

mm

Creepage
3.86
—
4.26
mm
* Refers to when a heatsink to be mounted is flat. If your application requires a clearance exceeding the maximum
distance given above, use an alternative (e.g., a convex heatsink) that will meet the target requirement.

Creepage

Clearance
Heatsink

Figure 5-1.

Insulation Distance Definitions

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201710

SCM1270MF Series
6.

Truth Table

Table 6-1 is a truth table that provides the logic level definitions of operation modes.
In the case where HINx and LINx pin signals in each phase are high at the same time, the simultaneous on-stateprevention sets both the high- and low-side transistors off.
After the IC recovers from a UVLO_VCC condition, the high- and low-side transistors resume switching, according
to the input logic levels of the HINx and LINx signals (level-triggered).
After the IC recovers from a UVLO_VB condition, the high-side transistors resume switching at the next rising edgeof an HINx signal (edge-triggered).
Table 6-1. Truth Table for Operation Modes
Mode

Normal Operation

Shutdown Signal Input
FO1/FO3/SD = L

Undervoltage Lockout for
High-side Power Supply(UVLO_VB)

Undervoltage Lockout for
Low-side Power Supply(UVLO_VCC)

Overcurrent Protection (OCP)

HINx

LINx

High-side Transistor

Low-side Transistor

L

L

OFF

OFF

H

L

ON

OFF

L

H

OFF

ON

H

H

OFF

OFF

L

L

OFF

OFF

H

L

OFF

OFF

L

H

OFF

OFF

H

H

OFF

OFF

L

L

OFF

OFF

H

L

OFF

OFF

L

H

OFF

ON

H

H

OFF

OFF

L

L

OFF

OFF

H

L

OFF

OFF

L

H

OFF

OFF

H

H

OFF

OFF

L

L

OFF

OFF

H

L

OFF

OFF

L

H

OFF

OFF

H

H

OFF

OFF

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201711

SCM1270MF Series
7.

Block Diagram

MIC1
1

FO1

UVLO_VCC

Filter
3 µs

2 OCP1

3 LIN1
4 COM1
5 HIN1

6 VCC1LS1 33

UVLO_VB

Level shift

Drive
circuit

HO1

Input logic

U 32

Simultaneous
on-stateprevention

OCP

Drive
circuit

Filter
370 ns

LO1

31

VB1
8 HS1
7

MIC2
9
10

SD
VT

11 LIN2

12 COM2
13 HIN2
14 VCC2LS2UVLO_VB

Filter
300 nsLevel shift

Drive
circuit30

HO2

Input logic

V
29

Simultaneous
on-stateprevention

DrivecircuitTemperaturesensing

LO2

28

VB2
16 HS2
15

MIC3
17

FO3

UVLO_VCC

Filter
3 µs

18 OCP3

19 LIN3
20 COM3
21 HIN3

22 VCC3LS3UVLO_VB

Level shift

Drive
circuit

HO3

Input logic

W

Simultaneous
on-stateprevention

OCP

Filter
370 nsDrive
circuit

27

26

LO3

VBB
25

VB3
24 HS323

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201712

SCM1270MF Series
8.

Pin Configuration Definitions
Top view

1

24

1

33
24
25
Pin Number
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33

Pin Name
FO1
OCP1
LIN1
COM1
HIN1
VCC1
VB1
HS1
SD
VT
LIN2
COM2
HIN2
VCC2
VB2
HS2
FO3
OCP3
LIN3
COM3
HIN3
VCC3
VB3
HS3
VBB
W
LS3
VBB
V
LS2
VBB
U
LS1

25
Description
U-phase fault signal output and shutdown signal input
Input for U-phase overcurrent protection
Logic input for U-phase low-side gate driver
U-phase logic ground
Logic input for U-phase high-side gate driver
U-phase logic supply voltage input
U-phase high-side floating supply voltage input
U-phase high-side floating supply groundV-phase shutdown signal input
Temperature sensing voltage output
Logic input for V-phase low-side gate driver
V-phase logic ground
Logic input for V-phase high-side gate driver
V-phase logic supply voltage input
V-phase high-side floating supply voltage input
V-phase high-side floating supply groundW-phase fault signal output and shutdown signal input
Input for W-phase overcurrent protection
Logic input for W-phase low-side gate driver
W-phase logic ground
Logic input for W-phase high-side gate driver
W-phase logic supply voltage input
W-phase high-side floating supply voltage input
W-phase high-side floating supply ground
Positive DC bus supply voltage
W-phase output
W-phase IGBT emitter(Pin trimmed) positive DC bus supply voltage
V-phase output
V-phase IGBT emitter(Pin trimmed) positive DC bus supply voltage
U-phase output
U-phase IGBT emitter

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 2017

33

13

SCM1270MF Series
9.

Typical Applications

CR filters and Zener diodes should be added to your application as needed. This is to protect each pin against surge
voltages causing malfunctions, and to avoid the IC being used under the conditions exceeding the absolute maximum
ratings where critical damage is inevitable. Then, check all the pins thoroughly under actual operating conditions toensure that your application works flawlessly.
VCC

VFO

U1

SCM1270MF Series

RFO
1

INT

LS1 33FO1

2 OCP1CFO

3 LIN1LIN14 COM1MIC1U 32

5 HIN1HIN1

6 VCC1

31

Controller
power
supplyCBOOT1

DZVT

VB1
7
8 HS1

LS2
9

SD

Thermal

10 VT

LIN2

11 LIN2
12 COM2

RVT

30

V

MIC2

29

M

13 HIN2

HIN2

Controller

14 VCC228

VB216 HS2
15

CBOOT2

17

LS3

FO3

27

18 OCP3
19 LIN3LIN320 COM3

MIC3

W

26

21 HIN3HIN3

22 VCC3

VDC

VBB
25

VB3
24 HS323

CBOOT3

RO

A/D

CO

DRS

RS

COM

Figure 9-1.

Typical Application Using a Single Shunt Resistor

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201714

SCM1270MF Series

VCC

VFO

U1

SCM1270MF Series

RFO
1

INT

LS1 33FO1

2 OCP1CFO

3 LIN1LIN14 COM1MIC1U 32

5 HIN1HIN1

6 VCC1

31

Controller
power
supplyCBOOT1

DZVT

VB1
7
8 HS1

LS2
9

SD

30

10 VT

Thermal11 LIN2LIN212 COM2

RVT

V

MIC2

29

M

13 HIN2

HIN2

Controller

14 VCC228

CBOOT2VB2
15
16 HS2
17

LS3

FO3

27

18 OCP3
19 LIN3LIN320 COM3

MIC3

W

26

21 HIN3HIN3

22 VCC3

VDC

VBB
25

VB3
24 HS323

CBOOT3

RO3

CO3

A/D

CO2

RO2

CO1 RO1RS3

COM

DRS3 DRS2 DRS1

Figure 9-2.

RS1
RS2

Typical Application Using Three Shunt Resistors

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201715

SCM1270MF Series
10. Physical Dimensions
10.1. Leadform 2552
0.5

C

0.5

C

(2.6)

8xP5.1=40.8

4.4± 0.3
1.2± 0.2+0.5

47±0.3

2 0

A

MAX1.2（Root of pin）(5ﾟ)

φ3.2± 0.15

15.95± 0.5

11.45±0.5

19±0.312.25± 0.5

17.25± 0.5

A

(5ﾟ)

B
43.3± 0.3B

2.08±0.2

11.2± 0.5
5xP1.27=6.35
1.27
3.7

3.24

1.27
3.7
D
D

+0.2

(2.6)

3.7

0.5 -0.1

2.57
1.27

5xP1.27=6.35

+0.2
2
-0.1

+0.2

0.5 -0.1+0.2

0.5 -0.1(11.6)

0.6 -0.1

B-B

C-C(38.6)+0.2+0.2
0.5 -0.1

5xP1.27=6.35+0.2

0.7 -0.1

A-A

1.2

+0.2
-0.1

D-D

Unit : mm

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201716

SCM1270MF Series
10.2. Leadform 2557 (Long Lead Type)(0.65)

0.6

(2.6)

C

0.6

C

8xP5.1=40.8

4.4±0.3
1.2± 0.2+0.2

47±0.3MAX1.2※

2 0（ Root of pin）

A

)
( 11°

0 to 0.5

Φ 3.2±0.15

15.95± 0.6

11.45±0.6

19± 0.3

12.25±0.617.25± 0.6※

AB
2.08±0.2

5xP1.27=6.35

5xP1.27=6.35
2.57

1.27

3.7

1.27
3.7

3.24

0 to 0.543.3± 0.3
5xP1.27=6.35

(12°)

B

14 to 14.8

1.27
3.7
D

+0.2

D

0.5 -0.1

(2.6)

+0.2

0.5 -0.1

+0.2

2

+0.2
-0.1

B-B

+0.2

+0.2

0.5 -0.1(11.5)+0.2

0.7 -0.1

A-A

0.5 -0.1

C-C(38.5)

0.6 -0.1

1.2

+0.2
-0.1

D-D

Unit : mm

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201717

SCM1270MF Series
10.3. Reference PCB Hole Sizes

φ1.1

φ1.4

Pins 1 to 24

Pins 25 to 33

11. Marking Diagram25

33

Branding Side
24
1

25

33

JAPAN

24

SCM127xMF

Control Number

YMDD

1

Lot Number:
Y is the last digit of the year of manufacture (0 to 9)
M is the month of the year (1 to 9, O, N, or D)
DD is the day of the month (01 to 31)

Part Number

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201718

SCM1270MF Series
12. Functional Descriptions
All the characteristic values given in this section are
typical values, unless they are specified as minimum or
maximum.
For pin descriptions, this section employs a notation
system that denotes a pin name with the arbitrary letter“x”, depending on context. The U-, V-, and W-phases
are represented as the pin numbers 1, 2, and 3,
respectively. Thus, “the VBx pin” is used when referring
to any or all of the VB1, VB2, and VB3 pins. Also,
when different pin names are mentioned as a pair (e.g.,“the VBx and HSx pins”), they are meant to be the pinsin the same phase.

12.1. Turning On and Off the IC
The procedures listed below provide recommended
startup and shutdown sequences. To turn on the IC
properly, do not apply any voltage on the VBB, HINx,
and LINx pins until the VCCx pin voltage has reached astable state (VCC(ON) ≥ 12.5 V).
It is required to fully charge bootstrap capacitors,
CBOOTx, at startup (see Section 12.2.2).
To turn off the IC, set the HINx and LINx pins tologic low (or “L”), and then decrease the VCCx pin
voltage.

12.2. Pin Descriptions

CBOOTx (μF) > 800 × t L(OFF) (s)(1)

10 μF ≤ CBOOTx ≤ 220 μF(2)

In Equation (1), let tL(OFF) be the maximum off-time of
the low-side transistor (i.e., the non-charging time of
CBOOTx), measured in seconds.
Even while the high-side transistor is off, voltage
across the bootstrap capacitor keeps decreasing due topower dissipation in the IC. When the VBx pin voltage
decreases to VBS(OFF) or less, the high-side undervoltage
lockout (UVLO_VB) starts operating (see Section
12.4.3.1).
Therefore, actual board checking should be done
thoroughly to validate that voltage across the VBx pin
maintains over 12.0 V (VBS > VBS(OFF)) during a
low-frequency operation such as a startup period.
As Figure 12-1 shows, a bootstrap diode, DBOOTx, anda current-limiting resistor, RBOOTx, are internally placed
in series between the VCCx and VBx pins. Time
constant for the charging time of CBOOTx, τ, can becomputed by Equation (3):τ = CBOOTx × R BOOTx ,where CBOOTx is the optimized capacitance of thebootstrap capacitor, and RBOOTx is the resistance of thecurrent-limiting resistor (22 Ω ± 20%).
U1

VB1

7

CP1

12.2.1. U, V, and W
These pins are the outputs of the three phases, andserve as the connection terminals to the 3-phase motor.
The U, V, and W pins are internally connected to theHS1, HS2, and HS3 pins, respectively.

HS1

DBOOT1 RBOOT1

CBOOT1

8

31

VCC

VBB
HO

6

VCC1
4

MIC1

U
COM1

32

Motor

LO

12.2.2. VB1, VB2, and VB3
These are the inputs of the high-side floating power
supplies for the individual phases. Voltages across the
VBx and HSx pins should be maintained within therecommended range (i.e., the Logic Supply Voltage,
VBS) given in Section 2.
In each phase, a bootstrap capacitor, CBOOTx, should
be connected between the VBx and HSx pins. For proper
startup, turn on the low-side transistor first, then fully
charge the bootstrap capacitor, CBOOTx. For thecapacitance of the bootstrap capacitors, CBOOTx, choose
the values that satisfy Equations (1) and (2). Note thatcapacitance tolerance and DC bias characteristics must
be taken into account when you choose appropriate
values for CBOOTx.

(3)

CDC VDC
LS1

Figure 12-1.

33

RS1

Bootstrap Circuit

Figure 12-2 shows an internal level-shifting circuit. A
high-side output signal, HOx, is generated according toan input signal on the HINx pin. When an input signal
on the HINx pin transits from low to high (rising edge),a “Set” signal is generated. When the HINx input signaltransits from high to low (falling edge), a “Reset” signal
is generated. These two signals are then transmitted tothe high-side by the level-shifting circuit and are input tothe SR flip-flop circuit. Finally, the SR flip-flop circuit
feeds an output signal, Q (i.e., HOx).
Figure 12-3 is a timing diagram describing how noiseor other detrimental effects will improperly influence theSCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201719

SCM1270MF Series
level-shifting process. When a noise-induced rapid
voltage drop between the VBx and HSx pins(“VBx–HSx”) occurs after the Set signal generation, thenext Reset signal cannot be sent to the SR flip-flop
circuit. And the state of an HOx signal stays logic high(or “H”) because the SR flip-flop does not respond. With
the HOx state being held high (i.e., the high-side
transistor is in an on-state), the next LINx signal turnsonthe low-side
transistor
and causesasimultaneously-on condition, which may result incritical damage to the IC. To protect the VBx pin against
such a noise effect, add a bootstrap capacitor, CBOOTx, ineach phase. CBOOTx must be placed near the IC and beconnected between the VBx and HSx pins with aminimal length of traces.
To use an electrolytic capacitor, add a 0.01 μF to 0.1
μF bypass capacitor, CPx, in parallel near these pins used
for the same phase.
U1

VBx

S

Input
logic

HINx

Q

HOx

R

Set
Pulse
generator Reset

HSx

COMx

Figure 12-2.

12.2.4. VCC1, VCC2, and VCC3
These are the logic supply pins for the built-in control
MICs. The VCC1, VCC2, and VCC3 pins must be
externally connected on a PCB because they are notinternally connected. To prevent malfunction induced bysupply ripples or other factors, put a 0.01 μF to 0.1 μF
ceramic capacitor, CVCCx, near these pins. To prevent
damage caused by surge voltages, put an 18 V to 20 V
Zener diode, DZ, between the VCCx and COMx pins.
Voltages to be applied between the VCCx and COMx
pins should be regulated within the recommended
operational range of VCC, given in Section 2.

12.2.5. COM1, COM2, and COM3
These are the logic ground pins for the built-in control
MICs. For proper control, the control parts in each phasemust be connected to the corresponding ground pin. The
COM1, COM2, and COM3 pins should be connected
externally on a PCB because they are not internallyconnected. Varying electric potential of the logic groundcan be a cause of improper operations. Therefore,
connect the logic ground as close and short as possible
to a shunt resistor, RS, at a single-point ground (or star
ground) which is separated from the power ground (seeFigure 12-4). Moreover, extreme care should be taken indesigning a PCB so that currents from the power ground
do not affect the COMx pin.

Internal Level-shifting Circuit
U1

VDC

VBB 25CS

HINx

4 COM1CDC

012 COM2

Set
0

20 COM3Reset

LS1 33LS2 30RSLS3 270

VBx-HSx

VBS(ON)VBS(OFF)
OCP1, OCP30

Stays logic highQ

Connect the COM1, COM2,
and COM3 pins on a PCB.

Create a single-point ground(a star ground) near RS, but
keep it separated from thepower ground.

0

Figure 12-3.

Waveforms at VBx–HSx Voltage Drop

12.2.3. HS1, HS2, and HS3
These pins are the grounds of the high-side floating
power supplies for each phase, and are connected to thenegative nodes of bootstrap capacitors, CBOOTx. The HS1,
HS2, and HS3 pins are internally connected to the U, V,
and W pins, respectively.

Figure 12-4.

Connections to Logic Ground12.2.6. HIN1, HIN2, and HIN3;
LIN1, LIN2, and LIN3
These are the input pins of the internal motor drivers
for each phase. The HINx pin acts as a high-side
controller; the LINx pin acts as a low-side controller.
Figure 12-5 shows an internal circuit diagram of the
HINx or LINx pin. This is a CMOS Schmitt trigger

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201720

SCM1270MF Series
circuit with a built-in 22 kΩ pull-down resistor, and its
input logic is active high.
Input signals across the HINx–COMx and the
LINx–COMx pins in each phase should be set within theranges provided in Table 12-1, below. Note that deadtime setting must be done for HINx and LINx pin
signals because the IC does not have a dead time
generator.
The higher PWM carrier frequency rises, the more
switching loss increases. Hence, the PWM carrier
frequency must be set so that operational casetemperatures and junction temperatures have sufficientmargins against the absolute maximum ranges, specified
in Section 1.
If the signals from the microcontroller become
unstable, the IC may result in malfunctions. To avoid
such malfunctions, set the microcontroller output line
not to have high-impedance outputs. Also, if the tracesfrom the microcontroller to the HINx or LINx pin (orboth) are too long, the traces may be interfered by noise.
Therefore, it is recommended to add an additional filter
or a pull-down resistor near the HINx or LINx pin as
needed (see Figure 12-6).
Here are filter circuit constants for reference:
RIN1x: 33 Ω to 100 Ω
RIN2x: 1 kΩ to 10 kΩ
CINx: 100 pF to 1000 pF
Care should be taken in adding RIN1x and RIN2x to thetraces. When they are connected to each other, the input
voltage of the HINx and LINx pins becomes slightly
lower than the output voltage of the microcontroller.
Table 12-1. Input Signals for HINx and LINx Pins
Parameter

High Level Signal

Low Level Signal

Input Voltage
Input Pulse
Width
PWM Carrier
Frequency
Dead Time

3 V < VIN < 5.5 V

0 V < VIN < 0.5 V≥0.5 μs≥0.5 μs

U1

RIN1

Input
signal

HINx(LINx)

RIN2

SCM1270MF

Controller

Figure 12-6.

Filter Circuit for HINx or LINx Pin

12.2.7. VBB
This is the input pin for the main supply voltage, i.e.,
the positive DC bus. All of the IGBT collectors of thehigh-side are connected to this pin. Voltages between
the VBB and COMx pins should be set within therecommended range of the main supply voltage, V DC,
given in Section 2. To suppress surge voltages, put a0.01 μF to 0.1 μF bypass capacitor, CS, near the VBB
pin and an electrolytic capacitor, CDC, with a minimal
length of PCB traces to the VBB pin.

12.2.8. LS1, LS2, and LS3
These are the emitter pins of the low-side IGBTs. For
current detection, the LS1, LS2, and LS3 pins should beexternally connected to a shunt resistor, RS. Whenconnecting a shunt resistor, use a resistor with low
inductance (required), and place it as near as possible tothe IC with a minimum length of traces to the LSx andCOMx pins. Otherwise, malfunction may occur because
a longer circuit trace increases its inductance and thusincreases its susceptibility to improper operations. In
applications where long PCB traces are required, add afast recovery diode, DRS, between the LSx and COMx
pins in order to prevent the IC from malfunctioning.
U1≤20 kHzVBB 25

VDC

CS≥1.5 μs
4 COM1

U1

CIN

CDC

LS1 335V
12 COM2RS

LS2 30

HINx(LINx)

2 kΩ

20 COM3DRS
LS3 27

22 kΩ

OCP1,
OCP3

COMx
Add a fast recovery
diode to a long trace.

Figure 12-5.

Internal Circuit Diagram of HINx or
LINx Pin

Figure 12-7.

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 2017

Put a shunt resistor near
the IC with a minimum
length to the LSx pin.

Connections to LSx Pin

21

SCM1270MF Series
VFO

12.2.9. OCP1 and OCP3
These pins serve as the inputs of the overcurrent
protection (OCP) for monitoring the currents going
through the output transistors. Section 12.4.4 provides
further information about the OCP circuit configurationand its mechanism.

U1

5V

RFO

1 MΩ

2 kΩ

FOx

3.0 µs (typ.)Blanking
filterINT
50 Ω

Output transistors
turn-off

CFO
QFO

COMx

Internal Circuit Diagram of FOx Pin and
Its Peripheral Circuit
QFOON

FOx Pin
VoltagetD(FO)

VIL

0

Figure 12-9.

FOx Pin Delay Time, tD(FO)
TJ = 25°C

0.5

Fault Signal Voltage (V)Each pin operates as the fault signal output andshutdown signal input for the corresponding phase, theU- or W-phase. Sections 12.4.1 and 12.4.2 explain thetwo functions in detail, respectively.
Figure 12-8 illustrates an internal circuit diagram of
the FOx pin and its peripheral circuit. Because of its
open-drain nature, each of the FOx pins should be tied
by a pull-up resistor, RFO, to the external power supply.
The external power supply voltage (i.e., the FOx Pin
Pull-up Voltage, VFO) should range from 3.0 V to 5.5 V.
Figure 12-10 shows a relation between the FOx pin
voltage and the pull-up resistor, RFO. When the pull-up
resistor, RFO, has a too small resistance, the FOx pin
voltage at fault signal output becomes high due to theon-resistance of a built-in MOSFET, QFO (Figure 12-8).
Therefore, it is recommended to use a 1 kΩ to 22 kΩ
pull-up resistor when the Low Level Input Threshold
Voltage of the microcontroller, VIL, is set to 1.0 V.
To suppress noise, add a filter capacitor, CFO, near the
IC with minimizing a trace length between the FOx andCOMx pins.
Note that, however, this additional filtering allows adelay time, tD(FO), to occur, as seen in Figure 12-9. The
delay time, tD(FO), is a period of time which starts whenthe IC receives a fault flag turning on the internal
MOSFET, QFO, and continues until when the FOx pin
reaches its threshold voltage (VIL) of 1.0 V or below (putsimply, until the time when the IC detects a low state,“L”). Figure 12-11 shows how the delay time, tD(FO), andthe noise filter capacitor, CFO, are related. For avoiding
repeated OCP activations, the external microcontroller
must shut off any input signals to the IC within an OCP
hold time, tP, after the internal MOSFET (QFO) turn-on.
tP is 15 μs where minimum values of thermal
characteristics are taken into account (for more details,
see Section 12.4.4). When the Low Level Input
Threshold Voltage of the microcontroller, VIL, is set to
1.0 V, CFO must be set to ≤1000 pF. This is because theV-phase delay time, tD(SD), at OCP activation is to betaken into account (see Section 12.2.11).
Motor operations must be controlled by the external
microcontroller so that it can immediately stop the motor
when fault signals are detected. To resume the motor
operation thereafter, set the motor to be resumed after alapse of ≥2 seconds.

Figure 12-8.

Max.
0.4 Typ.
0.3

Min.

0.2
0.1
0
0

2

4

6

8

10

RFO (kΩ)

Figure 12-10.

Fault Signal Voltage vs. Pull-up Resistor,
RFO
TJ = 25°C

0.20

Delay Time, tD(FO) (µs)

12.2.10. FO1 (U-phase) andFO3 (W-phase)

Max.

0.15
Typ.
0.10

Min.

0.05
0.00
0

200

400

600

800

1000

CFO (pF)

Figure 12-11.

Delay Time, tD(FO) vs. Filter Capacitor,
CFO

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201722

SCM1270MF Series
12.2.11. SD (V-phase)

12.2.12. VT

This is the shutdown signal input for the V-phase.
Figure 12-12 illustrates an internal circuit diagram of theSD pin and its peripheral circuit. The SD pin isconnected to the FO1 and FO3 pins, allowing theV-phase output transistors to be shut down by a fault
signal transmitted when one or more of the protections
in either the U- or W-phase is activated. When the SD
pin voltage decreases to the Low Level Input Threshold
Voltage (VIL = 1.5 V) or less, and remains in thiscondition for a period of the SD Pin Filtering Time(tFIL(SD) = 300 ns) or longer, the V-phase transistors turnoff.
Figure 12-14 shows a relation between tD(SD) and thecapacitance of CFO. As defined in Figure 12-13, tD(SD) isa period of time from when the internal MOSFET (QFOx)
is turned on by activated protections until the V-phase
output (HO2) turns off.
If, after the U- or W-phase OCP activation, an FOx
signal detection by the SD pin takes too long, permanent
damage to the V-phase output transistors may occur.
Thus, the value of CFO must be set to ≤1000 pF.

This pin outputs temperature sensing voltages. The
external microcontroller can monitor the junction
temperature of the internal control IC, not of the output
transistors, with the VT pin. For more details, see
Section 12.3.

VFO

5V
500 kΩ

RFO

FO1
FO3

300 ns (typ.)

9

2 kΩ

SD

Blanking
filter

CFO

12.3. Temperature Sensing Function
The microcontroller can monitor the junction
temperature of the internal control IC, throughtemperature sensing voltages that the VT pin outputs.
The SCM1270MF series does not include any
protections against overtemperature, such as an IC
shutdown or a fault flag. Therefore, the IC must be set tostop its operation as it detects an abnormal heating statewith temperature sensing voltages. A typical example isturning off input signals from the microcontroller.
Figure 12-15 shows a relation between the VT pin
voltage and temperature. Table 12-2 and Table 12-3
provide the details of variations found in Figure 12-15.
Temperature sensing voltages may exceed 3.0 V,
causing permanent damage to the IC in the worst case.
To protect the parts connected to the VT pin such as the
microcontroller, add a clamp diode, DZVT, between the
microcontroller power supply and the VT pin.
3.5

Output transistors
turn-off

COM2

Max.
Typ.
Min.

Figure 12-12.

Internal Circuit Diagram of SD Pin and
Its Peripheral Circuit

QFO1, QFO3

ON

tD(FO)VT Pin Voltage (V)

12

3.0
2.5
2.0
1.5

FO1, FO3, SD

25

50

75

100

125

150

Junction Temperature ,TJ(MIC) (°C)

VIL
tFIL(SD)

Figure 12-15. VT Pin Voltage vs. Internal Control IC
Junction Temperature, TJ(MIC)

HO2 (V-phase)OFFtD(SD)

Figure 12-13.

Table 12-2. TJ(MIC) Variation on VT Pin Voltage

V-phase Shutdown Period, tD(SD)
TJ = 25°C

0.6

Max.

tD(SD) (µs)

0.5
Typ.

0.4

Min.

0.3
0.2

VT Pin Voltage
(V)
1.95
2.75

TJ(MIC)(°C)
50 ± 8125 ± 5

Table 12-3. VT Pin Voltage Variation on TJ(MIC)

0.1
0
0

200

400

600

800

1000

CFO (pF)

Figure 12-14.

Delay Time, tD(SD) vs. Filter Capacitor, CFO

TJ(MIC)
(°C)
50
125

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 2017

VT Pin Voltage(V)1.95 ± 0.09
2.75 ± 0.06

23

SCM1270MF Series
12.4.2. Shutdown Signal Input

Controller power supply
DZVT
Controller

10

VT

The FO1, FO3, and SD pins can be the input pins of
shutdown signals. When the FOx and SD pins become
logic low, the high- and low-side transistors of eachphase turn off. The voltages and pulse widths of
shutdown signals should be set as listed in Table 12-4.

CVT
12Figure 12-16.

Table 12-4. Shutdown Signals

COM2

VT Pin Peripheral Circuit

12.4. Protection Functions
This section describes the various protection circuits
provided in the SCM1270MF series. The protection
circuits include the undervoltage lockout for power
supplies (UVLO), the simultaneous on-state prevention,and the overcurrent protection (OCP). In case one ormore of these protection circuits are activated, the FOx
pin outputs a fault signal; as a result, the external
microcontroller can stop the operations of the threephases by receiving the fault signal. The external
microcontroller can also shut down IC operations by
inputting a fault signal to the FOx pin. In the following
functional descriptions, “HOx” denotes a gate input
signal on the high-side transistor, whereas “LOx”
denotes a gate input signal on the low-side transistor(see also the diagram in Section 7). “VBx–HSx” refers
to the voltages between the VBx and HSx pins.

Parameter
Input
Voltage
Input Pulse
WidthHigh Level Signal

Low Level Signal

3 V < VIN < 5.5 V

0 V < VIN < 0.5 V≥3.0 μs≥3.0 μs

The FO1, FO3, and SD pins must be all connected, as
shown in Figure 12-17. If an abnormal condition isdetected by either the U- or W-phase MIC, the high- andlow-side transistors of all phases turn off.
1 FO1

INT

U1

9 SD
17 FO3

RFO
CFO
VFO

Figure 12-17.

4 COM112 COM2
20 COM3

All-phase Shutdown Circuit

12.4.1. Fault Signal Output
In case one or more of the following protections are
actuated, an internal transistor, QFOx, turns on, then the
FOx pin becomes logic low (≤0.5 V). The FO1, FO3,
and SD pins must be all connected by external traces.
1) Low-side undervoltage lockout (UVLO_VCC)
2) Overcurrent protection (OCP)
3) Simultaneous on-state prevention
While the FOx pin is in the low state, the high- andlow-side transistors of each phase turn off. In normal
operation, the FOx pin outputs a high signal of about
5 V. The fault signal output time of the FOx pin at OCP
activation is the OCP hold time, tP = 26 μs (typ.), fixed
by a built-in feature of the IC itself (see Section 12.4.4).
The external microcontroller receives the fault signals
with its interrupt pin (INT), and must be programmed to
put the HINx and LINx pins to logic low within thepredetermined OCP hold time, tP. If you need to resume
the motor operation thereafter, set the motor to beresumed after a lapse of ≥2 seconds.

12.4.3. Undervoltage Lockout forPower Supply (UVLO)
In case the gate-driving voltages of the output
transistors decrease, their steady-state power dissipations
increase. This overheating condition may cause
permanent damage to the IC in the worst case. To
prevent this event, the SCM1270MF series has theundervoltage lockout (UVLO) circuits for both of thehigh- and low-side power supplies.

12.4.3.1. Undervoltage Lockout for High-side
Power Supply (UVLO_VB)
Figure 12-18 shows operational waveforms of theundervoltage lockout for high-side power supply (i.e.,
UVLO_VB).
When the voltage between the VBx and HSx pins
(VBx–HSx) decreases to the Logic Operation Stop
Voltage (VBS(OFF) = 11.0 V) or less, the UVLO_VB
circuit in the corresponding phase gets activated and sets

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201724

SCM1270MF Series
an HOx signal to logic low. When the voltage between
the VBx and HSx pins increases to the Logic Operation
Start Voltage (VBS(ON) = 11.5 V) or more, the IC releases
the UVLO_VB condition. Then, the HOx signal
becomes logic high at the rising edge of the first input
command after the UVLO_VB release. Any fault signals
are not output from the FOx pin during the UVLO_VB
operation. In addition, the VBx pin has an internal
UVLO_VB filter of about 3 μs, in order to prevent
noise-induced malfunctions.

HIN1/
HIN3
0

LIN1/
LIN3
0

About 3 µs

VCCx

UVLO_VCC
operation

VCC(ON)VCC(OFF)
0

FO1/
FO3

HINx

0

0

HO1/
HO3

LINx

0

0
UVLO_VB
operation

VBx-HSx
VBS(OFF)

LO1/3 responds to input signal.

LO1/
LO3

VBS(ON)0UVLO release0

No FOx output at
UVLO_VB

FOx

Figure 12-19.

UVLO_VCC Operational Waveforms(U- or W-phase)0
About 3 µs

HOx

HOx restarts at
positive edge after
UVLO_VB release.

HIN2
0

LIN2

0

LOx

0

0

Figure 12-18.

UVLO_VCC
operation

VCCx

VCC(ON)VCC(OFF)UVLO_VB Operational Waveforms
0

About 3 µs

12.4.3.2. Undervoltage Lockout for Low-side
Power Supply (UVLO_VCC)
Figure 12-19 shows operational waveforms of theundervoltage lockout for low-side power supply (i.e.,
UVLO_VCC). The VCC1, VCC2, and VCC3 pins mustbe all connected by external traces on a PCB. When the
VCCx pin voltage decreases to the Logic Operation Stop
Voltage (VCC(OFF) = 11.0 V) or less, the UVLO_VCC
circuit in the corresponding phase gets activated and sets
both of HOx and LOx signals to logic low. When the
VCCx pin voltage increases to the Logic Operation Start
Voltage (VCC(ON) = 11.5 V) or more, the IC releases the
UVLO_VCC operation. Then it resumes transmitting the
HOx and LOx signals according to input commands on
the HINx and LINx pins. During the UVLO_VCC
operation, the FOx pin becomes logic low and sends
fault signals. In addition, the VCCx pin has an internal
UVLO_VCC filter of about 3 μs, in order to prevent
noise-induced malfunctions.

FO1/
FO3
0

SD
0

HO2
0
tFIL(SD)tFIL(SD)LO2 responds to input signal.

LO2
0

Figure 12-20.

UVLO_VCC Operational Waveforms(V-phase)

12.4.4. Overcurrent Protection (OCP)
The control ICs for the U- and W-phases have theovercurrent protection (OCP) circuit each. Figure 12-21
is an internal circuit diagram describing the OCPx pin
and its peripheral circuit. The OCPx pin detects
overcurrents with voltage across an external shunt
resistor, RS. Because the OCPx pin is internally pulled

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201725

SCM1270MF Series
down, the OCPx pin voltage increases proportionally toa rise in the current running through the shunt resistor,
RS.
Figure 12-22 shows the OCP operational waveforms
when the OCP1 pin (U-phase) or the OCP3 pin(W-phase) detects an overcurrent. When the OCPx pin
voltage increases to the OCP Threshold Voltage(VTRIP = 0.50 V) or more, and remains in this condition
for a period of the OCP Blanking Time (tBK = 370 ns) or
longer, the OCPx circuit is activated. When an internaldelay time (tDELAY) of 0.3 µs has elapsed after the OCP
activation, the enabled OCPx circuit shuts off thecorresponding output transistors and puts the FOx pin
into a low state. Then, output current decreases as aresult of the output transistor turn-offs. Even if the
OCPx pin voltage falls below VTRIP, the IC holds theFOx pin in the low state for a fixed OCP hold time,
tP = 26 μs (typ.). Then, the output transistors operateaccording to input signals.
The V-phase control circuit being built without OCP,
an overcurrent signal from the V-phase must be input tothe OCPx pin that detects a U- or W-phase OCP signal.
The V-phase SD pin is connected to the U- and W-phaseFOx pins for this V-phase OCP alternative. When the
OCPx pin detects overcurrents, the SD pin, as well as
the FOx pin, goes into logic low, and then the V-phase
output transistors turn off after a lapse of the SD Pin
Filtering Time (tFIL(SD), 300 ns), as in Figure 12-23.
A turn-off delay time of the V-phase output transistors
depends on the capacitance of the FOx pin capacitor,
CFO. If the delay time is too long, the output transistors
may be destroyed due to overcurrent. Thus, the value of
CFO must be set to ≤1000 pF.
The OCP is used for detecting abnormal conditions,such as an output transistor shorted. In case short-circuit
conditions occur repeatedly, the output transistors can be
destroyed. For this reason, motor operations must be
controlled by the external microcontroller so that it can
immediately stop the motor when fault signals aredetected.
The external microcontroller receives the fault signals
with its interrupt pin (INT), and must be programmed to
put the HINx and LINx pins to logic low within thepredetermined OCP hold time, tP. If you need to resume
the motor operation thereafter, set the motor to beresumed after a lapse of ≥2 seconds.
For proper shunt resistor setting, your applicationmust meet the following:● Use the shunt resistor that has a recommended
resistance, RS (see Section 2).
● Set the OCPx pin input voltage to vary within the
rated OCPx pin voltages, VOCP (see Section 1).
● Keep the current through the output transistors below
the rated output current (pulse), IOP (see Section 1).
It is required to use a resistor with low internal
inductance because high-frequency switching current
will flow through the shunt resistor, RS. In addition,choose a resistor with allowable power dissipationaccording to your application.
When you connect a CR filter (i.e., a pair of a filter
resistor, RO, and a filter capacitor, CO) to the OCPx pin,care should be taken in setting the time constants of RO
and CO. The larger the time constant, the longer the timethat the OCPx pin voltage rises to VTRIP. And this may
cause permanent damage to the transistors.
Consequently, a propagation delay of the IC must be
taken into account when you determine the time
constants. For RO and CO, their time constants must be
set to ≤0.82 µs. The filter capacitor, CO, should also beplaced near the IC, between the OCPx and COMx pinswith a minimal length of traces.
Note that overcurrents are undetectable when one ormore of the U, V, and W pins or their traces are shorted
to ground (ground fault). In case any of these pins falls
into a state of ground fault, the output transistors may bedestroyed.
U1

VTRIP
2 kΩ

OCPx

VBB

2 kΩ

+

100 kΩ

Blanking
filter
370 ns (typ.)CO
Output transistors
turn-off and QFOturn-on

COMx

LSx
A/D

RO

DRS

RS

COM

Figure 12-21.

Internal Circuit Diagram of OCPx Pin
and Its Peripheral Circuit

HIN1/
HIN3
0

LIN1/
LIN3
0

tDELAY 0.3 µs (typ.)t
OCP1/ BK
OCP3

tBK

tBK

VTRIP

0

FOx restarts
automatically after tP.

FO1/
FO3
tP
0

HO1/
HO3

HO1/3 responds to input signal.

0

LO1/
LO3
0

Figure 12-22.

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 2017

OCP Operational Waveforms (U- or
W-phase)26

SCM1270MF Series
Simultaneous on-stateprevention enabled

HIN2

HINx

0

LIN2
0
0

LINx

tDELAY 0.3 µs (typ.)
tBK

tBK

tBK

OCP2

0

HOx

VTRIP

About 0.8 µs

0
0

FO1/
FO3

FOx restarts
automatically after tP.

LOx

About 0.8 µs

tP
0

0

FOx
SD

0

0

tFIL(SD)HO2 responds to
input signal.

HO2
0

LO2

Figure 12-24. Operational Waveforms of
Simultaneous On-state PreventiontFIL(SD)

0

Figure 12-23.

OCP Operational Waveforms (V-phase)

12.4.5. Simultaneous On-state Prevention
In case both of the HINx and LINx pins receive logic
high signals at once, the high- and low-side transistors
turn on at the same time, causing overcurrents to passthrough. As a result, the switching transistors will be
destroyed. To prevent this event, the IC has thesimultaneous on-state prevention circuit in each of the
MICs. Note that incorrect command input and noiseinterference are also largely responsible for such asimultaneous-on condition. Figure 12-24 shows
operational waveforms of the simultaneous on-stateprevention.
When logic high signals are asserted on the HINx and
LINx pins at once, as in Figure 12-24, this function gets
activated and turns the high- and low-side transistors off.
Then, during the function is being enabled, the FOx pin
becomes logic low and sends fault signals. After the IC
comes out of the simultaneous on-state condition, “HOx”
and “LOx” start responding in accordance with HINx
and LINx input commands again.
To prevent noise-induced malfunctions, thesimultaneous on-state prevention circuit has a filter ofabout 0.8 μs.
Note that this function does not have any of dead-time
programming circuits. Therefore, input signals to the
HINx and LINx pins must have proper dead times as
defined in Section 12.2.6.

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201727

SCM1270MF Series
13. Design Notes
This section also employs the notation systemdescribed in the beginning of the previous section.

13.1. PCB Pattern Layout
Figure 13-1 shows a schematic diagram of a motor
drive circuit.
U1
VBB

MIC3

W

LS3

VDC
25

26

27

Ground traces should
be wide and short.

range of screw torque defined in Section 4.
● When mounting a heatsink, it is recommended to use
silicone greases. If a thermally conductive sheet or anelectrically insulating sheet is used, package cracks
may be occurred due to creases at screw tightening.
Therefore, you should conduct thorough evaluations
before using these materials.
● When applying a silicone grease, make sure that there
are no foreign substances between the IC and aheatsink. Extreme care should be taken not to apply asilicone grease onto any device pins as much as
possible. The following requirements must be met for
proper grease application:− Grease thickness: 100 μm− Heatsink flatness: ±100 μm− Apply a silicone grease within the area indicated in
Figure 13-2, below.
Screw hole

MIC2

29

V
LS2

Screw hole

M
5.8

5.8

30

M3

Thermal silicone
grease application area

M3

Heatsink
MIC1

U

3.1

32

Figure 13-2.
LS1

Figure 13-1.

33
High-frequency, high-voltage
current loops should be as small
and wide as possible.

High-frequency, High-voltage Current
Paths

The circuit consists of current paths having highfrequencies and high voltages, which also bring about
negative influences on IC operation, noise interference,and power dissipation. Therefore, PCB trace layouts andcomponent placements play an important role in circuitdesigning. Current loops, which have high frequencies
and high voltages, should be as small and wide as
possible, in order to maintain a low-impedance state. In
addition, ground traces should be as wide and short as
possible so that radiated EMI levels can be reduced.

13.2. Considerations in Heatsink Mounting
The following are the key considerations and theguidelines for mounting a heatsink:● Be sure to use a metric screw of M3 and a plain
washer of 7.0 mm (φ). To tighten the screws, use atorque screwdriver. Tighten the two screws firstly up
to about 30% of the maximum screw torque, thenfinally up to 100% of the prescribed maximum screw
torque. Perform appropriate tightening within the

37.1

3.1

Unit: mm

Reference Application Area for Thermal
Silicone Grease

13.3. Considerations in IC Characteristics
Measurement
When measuring the breakdown voltage or leakage
current of the transistors incorporated in the IC, note thatthe gate and emitter of each transistor should have thesame potential. Moreover, care should be taken during
the measurement because the collectors of the high-side
transistors are all internally connected to the VBB pin.
The output (U, V, and W) pins are connected to theemitters of the corresponding high-side transistors,
whereas the LSx pins are connected to the emitters of
the low-side transistors. The gates of the high-side
transistors are pulled down to the corresponding output(U, V, and W) pins; similarly, the gates of the low-side
transistors are pulled down to the COMx pins. Whenmeasuring the breakdown voltage or leakage current of
the transistors incorporated in the IC, note that all of theoutput (U, V, and W), LSx, and COMx pins must be
appropriately connected. Otherwise, the switchingtransistors may result in permanent damage.
The following are circuit diagrams representing
typical measurement circuits for breakdown voltage:
Figure 13-3 shows the high-side transistor (Q1H) in the
U-phase; Figure 13-4 shows the low-side transistor (Q1L)
in the U-phase. And all the pins that are not represented

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201728

SCM1270MF Series
in these figures are open. Before conducting ameasurement, be sure to isolate the ground of the
to-be-measured phase from those of other two phases
not to be measured. Then, in each of the two phases,
which are separated not to be measured, connect the LSx
and COMx pins each other at the same potential, andleave them unused and floated.
U1
VBB

25

Q1H
4 COM1

MIC1

U 32

V

Q1L

14. Calculating Power Losses andEstimating Junction TemperatureThis section describes the procedures to calculate
power losses in a switching transistor, and to estimate ajunction temperature. Note that the descriptions listed
here are applicable to the SCM1270MF series, which iscontrolled by a 3-phase sine-wave PWM driving
strategy. Total power loss in an IGBT can be obtainedby taking the sum of steady-state loss, PON, andswitching loss, PSW. The following subsections containthe mathematical procedures to calculate the power
losses in an IGBT and its junction temperature. For
quick and easy references, we offer calculation support
tools online. Please visit our website to find out more.
● DT0051: SCM1200MF Series Calculation Tool
http://www.semicon.sanken-ele.co.jp/en/calc-tool/igbt
1_caltool_en.html

LS1
33
31

Q2H
V
12 COM2

29

MIC2

Q2L

14.1. IGBT Steady-state Loss, PON

LS2

30

Steady-state loss in an IGBT can be computed byusing the VCE(SAT) vs. IC curves, listed in Section 15.3.1.
As expressed by the curves in Figure 14-1, a linear
approximation at a range the IC is actually used is
obtained by: VCE(SAT) = α × IC + β. The values gained by
the above calculation are then applied as parameters inEquation (4), below. Hence, the equation to obtain the
IGBT steady-state loss, PON, is:Q3H
20 COM3

MIC3

W

26

Q3L
LS3

27

Figure 13-3. Typical Measurement Circuit for
High-side Transistor (Q1H) in U-phase

PON =

1 π
(φ) × IC (φ) × DT × dφ
∫ V
2π 0 CE(SAT)

U1
VBB

25

Q1H
4 COM1

U 32

MIC1

V

Q1L

1 1
4
= α( +
M × cos θ) IM 2
2 2 3π√2 1 π+β ( + M × cos θ) IM .
π
2 8

(4)

LS1
33
31

Q2H
12 COM2

V
29

MIC2

Q2L
LS2

Where:VCE(SAT) is the collector-to-emitter
voltage of the IGBT (V),IC is the collector current of the IGBT (A),DT is the duty cycle, which is given by

saturation

30

Q3H
20 COM3

MIC3

DT =
W

26

Q3L
LS3

27

Figure 13-4. Typical Measurement Circuit for
Low-side Transistor (Q1L) in U-phase

1 + M × sin(φ + θ),
2

M is the modulation index (0 to 1),cosθ is the motor power factor (0 to 1),
IM is the effective motor current (A),α is the slope of the linear approximation in the
VCE(SAT) vs. IC curve, andβ is the intercept of the linear approximation in the
VCE(SAT) vs. IC curve.

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201729

SCM1270MF Series
VCC = 15 V

2.5
25 °C

VCE(SAT) (V)

2.0
1.5
1.0

75 °C

0.5

125 °Cy = 0.108x + 0.831

0.0
0Figure 14-1.

1

2

3

4 5
IC (A)

6

7

8

9

10

Linear Approximate Equation of VCE(SAT)vs. IC

14.2. IGBT Switching Loss, PSW
Switching loss in an IGBT, PSW, can be calculated by
Equation (5), letting IM be the effective current value ofthe motor:
PSW =

VDC
√2
× fC × αE × IM ×
.
π
300

(5)

Where:
fC is the PWM carrier frequency (Hz),VDC is the main power supply voltage (V), i.e., the
VBB pin input voltage, andαE is the slope of the switching loss curve(see Section 15.3.2).

14.3. Estimating Junction Temperature of
IGBT
The junction temperature of an IGBT, TJ, can be
estimated with Equation (6):
TJ = R (j−C)Q × (PON + PSW ) + TC .

(6)

Where:
R(J-C)Q is the junction-to-case thermal resistance per
IGBT (°C/W), andTC is the case temperature (°C), measured at the point
defined in Figure 3-1.

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201730

SCM1270MF Series
15. Performance Curves
15.1. Transient Thermal Resistance Curves
The following graph represents transient thermal resistance (the ratios of transient thermal resistance), withsteady-state thermal resistance = 1.

Ratio of Transient Thermal Resistance

1.00

0.10

0.01
1

10

100

1000

10000

Time (ms)

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201731

SCM1270MF Series
15.2. Performance Curves of Control Parts
Figure 15-1 to Figure 15-23 provide performance curves of the control parts integrated in the SCM1200MF series,
including variety-dependent characteristics and thermal characteristics. TJ represents the junction temperature of thecontrol parts.
Table 15-1. Typical Characteristics of Control Parts
Figure Number
Figure 15-1
Figure 15-2
Figure 15-3
Figure 15-4
Figure 15-5
Figure 15-6
Figure 15-7
Figure 15-8
Figure 15-9
Figure 15-10
Figure 15-11
Figure 15-12
Figure 15-13
Figure 15-14
Figure 15-15
Figure 15-16
Figure 15-17
Figure 15-18
Figure 15-19
Figure 15-20
Figure 15-21
Figure 15-22
Figure 15-23

Figure Caption
Logic Supply Current in 3-phase Operation, ICC vs. TC
Logic Supply Current in 3-phase Operation, ICC vs. VCCx Pin Voltage, VCC
Logic Supply Current in 1-phase Operation (HINx = 0 V), IBS vs. TC
Logic Supply Current in 1-phase Operation (HINx = 5 V), IBS vs. TC
Logic Supply Current in 1-phase Operation (HINx = 0 V), IBS vs. VBx Pin Voltage, VB
Logic Operation Start Voltage, VBS(ON) vs. TC
Logic Operation Stop Voltage, VBS(OFF) vs. TC
Logic Operation Start Voltage, VCC(ON) vs. TC
Logic Operation Stop Voltage, VCC(OFF) vs. TC
UVLO_VB Filtering Time vs. TC
UVLO_VCC Filtering Time vs. TC
Input Current at High Level (HINx or LINx), IIN vs. TC
High Level Input Signal Threshold Voltage, VIH vs. TC
Low Level Input Signal Threshold Voltage, VIL vs. TC
Minimum Transmittable Pulse Width for High-side Switching, tHIN(MIN) vs. TC
Minimum Transmittable Pulse Width for Low-side Switching, tLIN(MIN) vs. TC
FOx Pin Voltage in Normal Operation, VFOL vs. TC
OCP Threshold Voltage, VTRIP vs. TC
Blanking Time, tBK + Propagation Delay, tDELAY vs. TC
OCP Hold Time, tP vs. TC
Filtering Time of Simultaneous On-state Prevention vs. TC
SD Pin Filtering Time, tFIL(SD) vs. TC
V-phase Shutdown Period, tD(SD) vs. TC

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201732

VCC x= 15 V, HINx = 0 V, LINx = 0 V

5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0

HIN x= 0 V, LINx = 0 V

4.0

Max.

3.5
3.0

Typ.
Min.

ICC (mA)

ICC (mA)

SCM1270MF Series

125 °C

2.5

25 °C

2.0

−30 °C

1.5
1.0
0.5
0.0

-30

0

30

60

90

120

150

12

13

14

15

TC (°C)

Figure 15-1.

Logic Supply Current in 3-phase Operation,
ICC vs. TC

Figure 15-2.

VBx = 15 V, HINx = 0 V

250

16

17

18

19

20

VCC (V)

Logic Supply Current in 3-phase Operation,
ICC vs. VCCx Pin Voltage, VCC

VBx = 15 V, HINx = 5 V

250
Max.

200

150

Typ.

150

Min.
100

Typ.

IBS (µA)

IBS (µA)

Max.
200

50

Min.
100
50

0
-30

0

30

60

90

120

0

150

-30

0

30

TC (°C)

90

120

150

Figure 15-4. Logic Supply Current in 1-phase
Operation (HINx = 5 V), IBS vs. TC

12.50

VBx = 15 V

12.25
12.00

125 °C
25 °C−30 °CVBS(ON) (V)IBS (µA)

Figure 15-3. Logic Supply Current in 1-phase
Operation (HINx = 0 V), IBS vs. TC

180
160
140
120
100
80
60
40
20
0

60

TC (°C)

11.75

Max.

11.50
Typ.

11.25

Min.

11.00
10.75
10.50

12

13

14

15

16

17

18

19

20

-30

0

Figure 15-5. Logic Supply Current in 1-phase
Operation (HINx = 0 V), IBS vs. VBx Pin Voltage, VB

30

60

90

120

150

TC (°C)VB (V)

Figure 15-6.

Logic Operation Start Voltage, VBS(ON) vs.
TC

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201733

12.50

12.0
11.8
11.6
11.4
11.2
11.0
10.8
10.6
10.4
10.2
10.0

12.25
12.00
Max.
Typ.
Min.

VCC(ON) (V)VBS(OFF) (V)SCM1270MF Series

11.75
Max.

11.50

Typ.

11.25

Min.

11.00
10.75
10.50

-30

0

30

60

90

120

150

-30

0

30

TC (°C)

Logic Operation Stop Voltage, VBS(OFF) vs.
TC

12.0
11.8
11.6
11.4
11.2
11.0
10.8
10.6
10.4
10.2
10.0

Max.
Typ.
Min.

-30

0

30

60

90

120

150

Figure 15-8.

UVLO_VB Filtering Time (µs)

VCC(OFF) (V)

Figure 15-7.

120

150

5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0

Max.
Typ.
Min.

-30

0

30

60

90

120

150

TC (°C)

Logic Operation Stop Voltage, VCC(OFF) vs.
TC

4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0

Figure 15-10.

UVLO_VB Filtering Time vs. TC

INHx or INLx = 5 V

400
Max.
Typ.
Min.

IIN (µA)UVLO_VCC Filtering Time
(µs)

90

Logic Operation Start Voltage, VCC(ON) vs.
TC

TC (°C)

Figure 15-9.

60TC (°C)

350

Max.

300

Typ.

250
Min.

200
150
100
50
0

-30

0

30

60

90

120

150

-30

TC (°C)

Figure 15-11.

UVLO_VCC Filtering Time vs. TC

0

30

60

90

120

150

TC (°C)

Figure 15-12.

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 2017

Input Current at High Level (HINx or
LINx), IIN vs. TC

34

SCM1270MF Series

2.6

2.0

2.4

1.8

2.0

Max.

1.8
Typ.

1.6

1.6

VIL (V)VIH (V)

2.2

Min.

1.4

Max.

1.4

Typ.

1.2

Min.

1.0

1.2
1.0

0.8
-30

0

30

60

90

120

150

-30

0

30

TC (°C)High Level Input Signal Threshold
Voltage, VIH vs. TC

500
450
400
350
300
250
200
150
100
50
0

Max.
Typ.
Min.

-30

0

30

60

90

120

Figure 15-14.

tLIN(MIN) (ns)tHIN(MIN) (ns)Figure 15-13.

90

120

150

150

Low Level Input Signal Threshold
Voltage, VIL vs. TC

500
450
400
350
300
250
200
150
100
50
0

Max.
Typ.
Min.

-30

0

30

TC (°C)

60

90

120

150

TC (°C)

Figure 15-15. Minimum Transmittable Pulse Width for
High-side Switching, tHIN(MIN) vs. TC

Figure 15-16. Minimum Transmittable Pulse Width for
Low-side Switching, tLIN(MIN) vs. TC

FOx pull-up voltage = 5 V, RFO = 3.3 kΩ, FOx in logic low

300

60

TC (°C)

540
530

250

VFOL (mV)

Max.
Typ.
Min.

150
100

VTRIP (mV)

520

200

Max.

510
Typ.

500
490

Min.

480
50

470

0

460
-30

0

30

60

90

120

150

-30

TC (°C)

Figure 15-17.

FOx Pin Voltage in Normal Operation,
VFOL vs. TC

0

30

60

90

120

150

TC (°C)

Figure 15-18.

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 2017

OCP Threshold Voltage, VTRIP vs. TC

35

1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0

Max.
Typ.

tP (µs)tBK + tDELAY (µs)

SCM1270MF Series

Min.

-30

0

30

60

90

120

50
45
40
35
30
25
20
15
10
5
0

Max.
Typ.
Min.

-30

150

0

30

TC (°C)

Blanking Time, tBK + Propagation Delay,tDELAY vs. TC

Figure 15-20.

1.4
1.2
Max.

1.0
0.8

Typ.

0.6

Min.

0.4
0.2
0.0
-30

0

30

60

90

150

120

150

OCP Hold Time, tP vs. TC

Max.
Typ.
Min.

-30

0

30

60

90

120

150

TC (°C)

Filtering Time of Simultaneous On-state
Prevention vs. TC

Figure 15-22.

SD Pin Filtering Time, tFIL(SD) vs. TC

CFO = 1000 pF

0.7

tD(SD) (µs)

120

0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00

TC (°C)

Figure 15-21.

90TC (°C)tFIL(SD) (µs)

Filtering Time of Simultaneous
On-state Prevention (µs)

Figure 15-19.

60

0.6

Max.

0.5

Typ.

0.4

Min.

0.3
0.2
0.1
0.0
-30

0

30

60

90

120

150

TC (°C)

Figure 15-23.

V-phase Shutdown Period, tD(SD) vs. TC

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201736

SCM1270MF Series
15.3. Performance Curves of Output Parts
15.3.1. Output Transistor Performance Curves
15.3.1.1. SCM1272MF
VCCx = 15 V

2.5

2.5
2.0
25 °C

25 °C

VF (V)VCE(SAT) (V)

2.0
1.5
1.0
0.5

75 °C

1.5
1.0
75 °C

0.5
125 °C

125 °C
0.0

0.0
0

1

2

3

4

5

6

7

8

9 10 11 12 13 14 15

0

1

2

3

4

5

Figure 15-24.

6

7

8

9 10 11 12 13 14 15

IF (A)IC (A)IGBT VCE(SAT) vs. IC

Figure 15-25.

Freewheeling Diode VF vs. IF

15.3.1.2. SCM1274MF
VCCx = 15 V

2.5

2.5
2.0

25 °C

1.0
0.5

125 °C

75 °C
125 °C

0.0

0.0
2

1.0
0.5

75 °C

0

25 °C

1.5

1.5

VF (V)VCE(SAT) (V)

2.0

4

6

8

10

12

14

16

18

20

0

2

4

IGBT VCE(SAT) vs. IC

8

10

12

14

16

18

20

IF (A)IC (A)

Figure 15-26.

6Figure 15-27.

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 2017

Freewheeling Diode VF vs. IF

37

SCM1270MF Series
15.3.1.3. SCM1276MF
VCCx = 15 V

2.5

2.5

2.0

2.0
25 °C

1.5

VF (V)VCE(SAT) (V)

25 °C

1.0
75 °C

0.5

1.5
1.0
75 °C
125 °C0.5

125 °C
0.0

0.0
0

2

4

6

8 10 12 14 16 18 20 22 24 26 28 30

0

2

4

6

IC (A)

Figure 15-28.

IGBT VCE(SAT) vs. IC

8 10 12 14 16 18 20 22 24 26 28 30

IF (A)

Figure 15-29.

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 2017

Freewheeling Diode VF vs. IF

38

SCM1270MF Series
15.3.2. Switching Loss Curves
Conditions: VBB pin voltage = 300 V, half-bridge circuit with inductive load.

15.3.2.1. SCM1272MF
VBx = 15 V

700

600

600

Turn-off

500

Turn-on

500
400

400
300
200

Turn-onE (µJ)E (µJ)

VCCx = 15 V

700

100

300
200

Turn-off

100

0

0
0

1

2

3

4

5

6

7

8

9 10 11 12 13 14 15

0

1

2

3

4

5

IC (A)

Figure 15-30.

High-side Switching Loss (TJ = 25 °C)

Figure 15-31.

VBx = 15 V

700
600

7

8

9 10 11 12 13 14 15

500

500

400

400

Turn-on200

VCCx = 15 V

600

Turn-off

300

Low-side Switching Loss (TJ = 25 °C)

700

E (µJ)E (µJ)

6

IC (A)

Turn-on300

Turn-off

200
100

100

0

0
0

1

2

3

4

5

6

7

8

9 10 11 12 13 14 15

0

1

2

IC (A)

Figure 15-32.

High-side Switching Loss (TJ = 125 °C)

3

4

5

6

7

8

9 10 11 12 13 14 15

IC (A)

Figure 15-33.

Low-side Switching Loss (TJ = 125 °C)

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201739

SCM1270MF Series
15.3.2.2. SCM1274MF
VBx = 15 V

1200

1000

1000
800
600
400

Turn-off

200

Turn-on800

Turn-onE (µJ)E (µJ)

VCCx = 15 V

1200

600
400

Turn-off

200

0

0
0

2

4

6

8

10

12

14

16

18

20

0

2

4

6

IC (A)

Figure 15-34.

High-side Switching Loss (TJ = 25 °C)

10

12

14

16

18

20

1000

1000

800

800

600

Turn-onLow-side Switching Loss (TJ = 25 °C)

VCCx = 15 V

1200

E (µJ)E (µJ)

Figure 15-35.

VBx = 15 V

1200

400

8

IC (A)

Turn-on600
400

Turn-off

200

200

Turn-off
0

0
0

2

4

6

8

10

12

14

16

18

20

0

2

IC (A)

Figure 15-36.

High-side Switching Loss (TJ = 125 °C)

4

6

8

10

12

14

16

18

20

IC (A)

Figure 15-37.

Low-side Switching Loss (TJ = 125 °C)

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201740

SCM1270MF Series
15.3.2.3. SCM1276MF
VBx = 15 V

1400

Turn-off

1200

1200

Turn-off

1000

1000
800

800

E (µJ)E (µJ)

VCCx = 15 V

1400

600
400

Turn-on200

600

Turn-on

400
200

0

0
0

5

10

15

20

25

30

0

5

10

IC (A)

Figure 15-38.

High-side Switching Loss (TJ = 25 °C)

Figure 15-39.

VBx = 15 V

1400
1200

Turn-off

800

E (µJ)E (µJ)

1000

600

Turn-on

400
200
0
0

5

10

15

20

25

30

20

25

30

High-side Switching Loss (TJ = 125 °C)

Low-side Switching Loss (TJ = 25 °C)

VCCx = 15 V

1800
1600
1400
1200
1000
800
600
400
200
0

Turn-off

Turn-on0

IC (A)

Figure 15-40.

15

IC (A)

5

10

15

20

25

30

IC (A)

Figure 15-41.

Low-side Switching Loss (TJ = 125 °C)

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201741

SCM1270MF Series
15.4. Allowable Effective Current Curves
The following curves represent allowable effective currents in 3-phase sine-wave PWM driving with parameters suchas typical VCE(SAT) and typical switching losses.
Operating conditions: VBB pin input voltage, VDC = 300 V; VCC pin input voltage, VCC = 15 V; modulation index,
M = 0.9; motor power factor, cosθ = 0.8; junction temperature, T J = 150 °C.

15.4.1. SCM1272MF
fC = 2 kHz

Allowable Effective Current Curves (Arms)

15

10

5

0
25

50

75

100

125

150

TC (°C)
Figure 15-42.

Allowable Effective Current (fC = 2 kHz): SCM1272MF
fC = 16 kHz

Allowable Effective Current Curves (Arms)

15

10

5

0
25

50

75

100

125

150

TC (°C)
Figure 15-43.

Allowable Effective Current (fC = 16 kHz): SCM1272MF

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201742

SCM1270MF Series
15.4.2. SCM1274MF
fC = 2 kHz

Allowable Effective Current Curves (Arms)

20

15

10

5

0
25

50

75

100

125

150

TC (°C)

Allowable Effective Current Curves (Arms)

Figure 15-44.

Allowable Effective Current (fC = 2 kHz): SCM1274MF
fC = 16 kHz

20

15

10

5

0
25

50

75

100

125

150

TC (°C)
Figure 15-45.

Allowable Effective Current (fC = 16 kHz): SCM1274MF

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201743

SCM1270MF Series
15.4.3. SCM1276MF
fC = 2 kHz

Allowable Effective Current Curves (Arms)

30
25
20
15
10
5
0
25

50

75

100

125

150

TC (°C)
Figure 15-46.

Allowable Effective Current (fC = 2 kHz): SCM1276MF
fC = 16 kHz

Allowable Effective Current Curves (Arms)

30
25
20
15
10
5
0
25

50

75

100

125

150

TC (°C)
Figure 15-47.

Allowable Effective Current (fC = 16 kHz): SCM1276MF

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201744

SCM1270MF Series
15.5. Short Circuit SOAs (Safe Operating Areas)
Conditions: VDC ≤ 400 V, 13.5 V ≤ VCC ≤ 16.5 V, TJ = 125°C, 1 pulse.

15.5.1. SCM1272MF
250

Collector Current, IC(PEAK) (A)

200

150

100
Short Circuit SOA
50

0
0

1

2

3

4

5

3

4

5

Pulse Width (µs)

15.5.2. SCM1274MF
300

Collector Current, IC(PEAK) (A)

250
200
150
100

Short Circuit SOA

50
0
0

1

2
Pulse Width (µs)

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201745

SCM1270MF Series
15.5.3. SCM1276MF
400

Collector Current, IC(PEAK) (A)

350
300
250
200
150
Short Circuit SOA
100
50
0
0

1

2

3

4

5

Pulse Width (µs)

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201746

SCM1270MF Series
16. Pattern Layout Example
This section contains the schematic diagrams of a PCB pattern layout example using an SCM1270MF series
device. For reference terminal hole sizes, see Section 10.3.

IPM1

SV3

SV1

SV2

Figure 16-1.

Top View

Figure 16-2.

Bottom View

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201747

SCM1270MF Series

LS1
1

R4

33

FO1

2 OCP1C20

3 LIN1

4 COM1U 32

5 HIN1
6 VCC1

C17
C14

31

VB1
8 HS1
7

C1
9

SD

LS230

10 VT
11 LIN2

12 COM2

1 U
2 V
3 W

V
29

13 HIN2
14 VCC2

SV4

C18
C15
FO 1
5V 2
LIN1 3
HIN1 4
LIN2 5
HIN2 6
LIN3 7
HIN3 8VCC 9COM 10

R5
R6
R7
R8
R9
R10

C2
17

LS3

27

FO3

18 OCP3
19 LIN3

20 COM3

W26

21 HIN3
22 VCC3

C19

VBB

C5
C6
C7
C8
C9
C10

C16

D5

25

1 VBB

VB3
24 HS323

2 PGND

C3

SV3

1

C4
D4

Figure16-3.

D1
C23
R14
R1

SV1

C11
C12/RT
C13

4

D2
C24
R15
R2

3

C21

R13
R12
R11

2

D3
C25
R16
R3

SV2

NC
OCP1
VT
OCP3

28

VB2
16 HS215

Circuit Diagram of PCB Pattern Layout Example

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201748

SCM1270MF Series
17. Typical Motor Driver Application
This section contains the information on the typical motor driver application listed in the previous section, including
a circuit diagram, specifications, and the bill of the materials used.
● Motor Driver Specifications
IC
Main Supply Voltage, VDC
Rated Output PowerSCM1272MF
300 VDC (typ.)1.35 kW● Circuit Diagram
See Figure16-3.
● Bill of Materials
SymbolPart Type
C1Electrolytic
C2Electrolytic
C3Electrolytic
C4Electrolytic
C5
Ceramic
C6
Ceramic
C7
Ceramic
C8
Ceramic
C9
Ceramic
C10
Ceramic
C11
Ceramic
C12/RT Ceramic
C13
Ceramic
C14
Ceramic
C15
Ceramic
C16
Ceramic
C17
Ceramic
C18
Ceramic
C19
Ceramic
C20
Ceramic
C21
Film
C23*
Ceramic
C24*
Ceramic
C25*
Ceramic

Ratings
47 μF, 50 V
47 μF, 50 V
47 μF, 50 V
100 μF, 50 V
100 pF, 50 V
100 pF, 50 V
100 pF, 50 V
100 pF, 50 V
100 pF, 50 V
100 pF, 50 V
2200 pF, 50 V
2200 pF, 50 V
2200 pF, 50 V
0.1 μF, 50 V
0.1 μF, 50 V
0.1 μF, 50 V
0.1 μF, 50 V
0.1 μF, 50 V
0.1 μF, 50 V
1000 pF, 50 V
0.1 μF, 630 V
0.1 μF, 50 V
0.1 μF, 50 V
0.1 μF, 50 V

SymbolPart Type
Ratings
R1*
Metal plate
27 mΩ, 2 W
R2*Metal plate
27 mΩ, 2 W
R3*Metal plate
27 mΩ, 2 W
R4General
4.7 kΩ, 1/8 W
R5General
100 Ω, 1/8 W
R6General
100 Ω, 1/8 W
R7General
100 Ω, 1/8 W
R8General
100 Ω, 1/8 W
R9General
100 Ω, 1/8 W
R10General
100 Ω, 1/8 W
R11General
100 Ω, 1/8 W
R12GeneralOpen
R13
General
100 Ω, 1/8 W
R14*GeneralOpen
R15*
GeneralOpen
R16*
GeneralOpen
D1
General
1 A, 50 V
D2General
1 A, 50 V
D3General
1 A, 50 V
D4
Zener
VZ = 20 V, 0.5 W
D5GeneralOpen
SV1
Pin header
Equiv. to MA04-1
SV2
Pin header
Equiv. to MA10-1
SV3
Connector
Equiv. to B2P3-VH
SV4Connector
Equiv. to B3P5-VH
IPM1IC
SCM1272MF* Refers to a part that requires adjustment based on operation performance in an actual application.

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201749

SCM1270MF Series
Important Notes● All data, illustrations, graphs, tables and any other information included in this document (the “Information”) as to Sanken’s
products listed herein (the “Sanken Products”) are current as of the date this document is issued. The Information is subject to any
change without notice due to improvement of the Sanken Products, etc. Please make sure to confirm with a Sanken sales
representative that the contents set forth in this document reflect the latest revisions before use.
● The Sanken Products are intended for use as components of general purpose electronic equipment or apparatus (such as home
appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Prior to use of the Sanken Products,
please put your signature, or affix your name and seal, on the specification documents of the Sanken Products and return them toSanken. When considering use of the Sanken Products for any applications that require higher reliability (such as transportationequipment and its control systems, traffic signal control systems or equipment, disaster/crime alarm systems, various safety
devices, etc.), you must contact a Sanken sales representative to discuss the suitability of such use and put your signature, or affix
your name and seal, on the specification documents of the Sanken Products and return them to Sanken, prior to the use of theSanken Products. The Sanken Products are not intended for use in any applications that require extremely high reliability such as:
aerospace equipment; nuclear power control systems; and medical equipment or systems, whose failure or malfunction may result
in death or serious injury to people, i.e., medical devices in Class III or a higher class as defined by relevant laws of Japan(collectively, the “Specific Applications”). Sanken assumes no liability or responsibility whatsoever for any and all damages andlosses that may be suffered by you, users or any third party, resulting from the use of the Sanken Products in the Specific
Applications or in manner not in compliance with the instructions set forth herein.
● In the event of using the Sanken Products by either (i) combining other products or materials or both therewith or (ii) physically,
chemically or otherwise processing or treating or both the same, you must duly consider all possible risks that may result from all
such uses in advance and proceed therewith at your own responsibility.
● Although Sanken is making efforts to enhance the quality and reliability of its products, it is impossible to completely avoid theoccurrence of any failure or defect or both in semiconductor products at a certain rate. You must take, at your own responsibility,
preventative measures including using a sufficient safety design and confirming safety of any equipment or systems in/for which
the Sanken Products are used, upon due consideration of a failure occurrence rate and derating, etc., in order not to cause any
human injury or death, fire accident or social harm which may result from any failure or malfunction of the Sanken Products.
Please refer to the relevant specification documents and Sanken’s official website in relation to derating.
● No anti-radioactive ray design has been adopted for the Sanken Products.
● The circuit constant, operation examples, circuit examples, pattern layout examples, design examples, recommended examples, allinformation and evaluation results based thereon, etc., described in this document are presented for the sole purpose of reference ofuse of the Sanken Products.
● Sanken assumes no responsibility whatsoever for any and all damages and losses that may be suffered by you, users or any third
party, or any possible infringement of any and all property rights including intellectual property rights and any other rights of you,users or any third party, resulting from the Information.
● No information in this document can be transcribed or copied or both without Sanken’s prior written consent.
● Regarding the Information, no license, express, implied or otherwise, is granted hereby under any intellectual property rights andany other rights of Sanken.
● Unless otherwise agreed in writing between Sanken and you, Sanken makes no warranty of any kind, whether express or implied,
including, without limitation, any warranty (i) as to the quality or performance of the Sanken Products (such as implied warrantyof merchantability, and implied warranty of fitness for a particular purpose or special environment), (ii) that any Sanken Product isdelivered free of claims of third parties by way of infringement or the like, (iii) that may arise from course of performance, courseof dealing or usage of trade, and (iv) as to the Information (including its accuracy, usefulness, and reliability).
● In the event of using the Sanken Products, you must use the same after carefully examining all applicable environmental laws andregulations that regulate the inclusion or use or both of any particular controlled substances, including, but not limited to, the EU
RoHS Directive, so as to be in strict compliance with such applicable laws and regulations.
● You must not use the Sanken Products or the Information for the purpose of any military applications or use, including but notlimited to the development of weapons of mass destruction. In the event of exporting the Sanken Products or the Information, or
providing them for non-residents, you must comply with all applicable export control laws and regulations in each country
including the U.S. Export Administration Regulations (EAR) and the Foreign Exchange and Foreign Trade Act of Japan, andfollow the procedures required by such applicable laws and regulations.
● Sanken assumes no responsibility for any troubles, which may occur during the transportation of the Sanken Products including
the falling thereof, out of Sanken’s distribution network.
● Although Sanken has prepared this document with its due care to pursue the accuracy thereof, Sanken does not warrant that it iserror free and Sanken assumes no liability whatsoever for any and all damages and losses which may be suffered by you resulting
from any possible errors or omissions in connection with the Information.
● Please refer to our official website in relation to general instructions and directions for using the Sanken Products, and refer to therelevant specification documents in relation to particular precautions when using the Sanken Products.
● All rights and title in and to any specific trademark or tradename belong to Sanken and such original right holder(s).

DSGN-CEZ-16003

SCM1270MF-DSE Rev.2.3
SANKEN ELECTRIC CO., LTD.
Sep. 29, 2023
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 201750