Comelec general presentation
Comelec field of expertise and certifications

Comelec SA, rue de la Paix 129, 2301 La Chaux de Fonds, Switzerland

key requirements for aneffective advanced packaging
General requirements :••
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Conformability even for micro/nanosystems
Physical and chemical barrier
Low water vapor permeability
Adhesion to numerous substrates
Higher operating temperature
Low outgassing
Transparency (for optical devices)
low CTE
Low permittivity
High dielectric strength
Low friction coefficient
Biocompatibility
Biostable
Sterilization compliant
Industrial and government compliance (USP, FDA, …)Comelec SA, rue de la Paix 129, 2301 La Chaux de Fonds, Switzerland

Parylene technology understanding••

Parylene refer to a general family : polyparaxylylene
The starting material is the paracyclophane and its derivatives

Paracylophane derivatives and corresponding Parylene :USP Class VI

N
USP Class VI

CDF VT4Comelec SA, rue de la Paix 129, 2301 La Chaux de Fonds, Switzerland

F AF4

Parylene technology understanding•Vacuum process (Vapor Deposition Polymerization)
assimilated as CVD

Comelec SA, rue de la Paix 129, 2301 La Chaux de Fonds, Switzerland

Parylene technology understanding
Process key features :•••••••••••

Conversion rate is close to 100%
By product are trapped by liquidnitrogen
Green polymer (free of additives,plastisizer, catalyst)
Pin hole free (50 nm)
Free residual stress
Thickness range from 10 nm to 100 µm
Fully conformal
Room temperature deposition
High power of penetration
Smooth surface
Transparent coating

Liquid conformal coating :Parylene:

Comelec SA, rue de la Paix 129, 2301 La Chaux de Fonds, Switzerland

Parylene as an advanced packaging :key properties
Optical properties : Transparency

Indice de refraction + spectre UV visible

Properties
Density
Refractive index@ 589 nmstandardUnit

D1505

g/cm3

PARYLENE TypeNCD

1.10

1.289

1.418

1.661

1.639

1.669

- Good candidate for thin smart lenses as protective layer

Comelec SA, rue de la Paix 129, 2301 La Chaux de Fonds, Switzerland

Parylene as an advanced packaging :key properties
Thermal properties≈ 11.4 years

Time (hour) before mechanicalproperties divided per 2105104≈ 1 year103≈ 1 month102≈ 4 days

10Parylene N
Parylene C

17284

2.8

97

111

2.6

127

144

2.4

162

181

2.2

203

226

10-1
2.0

Comelec SA, rue de la Paix 129, 2301 La Chaux de Fonds, Switzerland

3.0103/T (K)60

Parylene D(°C)

Parylene as an advanced packaging :key properties
Barrier properties

Best compromise between oxygen permeability and WTR
Comelec SA, rue de la Paix 129, 2301 La Chaux de Fonds, Switzerland

Parylene as an advanced packaging :key properties
Chemical resistance : Swelling in %Comelec SA, rue de la Paix 129, 2301 La Chaux de Fonds, Switzerland

Parylene as an advanced packaging :key properties
Dielectric properties :Superior dielectric properties compared to liquid coating (Epoxy, silicone, PU)

Comelec SA, rue de la Paix 129, 2301 La Chaux de Fonds, Switzerland

Parylene as an advanced packaging :key properties
Dielectric properties : thickness vs breakdown voltage

Comelec SA, rue de la Paix 129, 2301 La Chaux de Fonds, Switzerland