High Power 40GHz Limiter

HLM-401. Device Overview
1.1 General Description
DieThe HLM-40 is a high-power GaAs Schottky diode signal limiterfeaturing high IP3 and high power handling. It offers low insertion
loss and low return loss from DC through Ka band and has atypical 1dB compression point of 15dBm. Its high power handlingmakes it ideal for protecting sensitive components and for
applications requiring high linearity. It is available as a wire
bondable die and as a connectorized module.

Module1.2 Features
▪
▪
▪
▪
▪

DC to 40 GHz limiter
20W Peak Power (pulsed), 4W CW
18dBm Flat Leakage @ 1W CW
Typical P1dB of 15dBm
Small signal S2P data: HLM-40U.zip, HLM-40CH.zip

1.3 Functional Block Diagram

1.4 Part Ordering Options1
PartNumber

Description

Package

HLM-40CH

Wire bondable dieCH

HLM-40U

Connectorized
moduleGreen Status

ProductLifecycle

ExportClassification

Active

EAR99

Active

EAR99

RoHS

1U

Refer to our website for a list of definitions for terminology presented in this table.

Copyright © 2019 Marki Microwave, Inc.

Page 1|Rev.-www.markimicrowave.com

HLM-40

3.3 Linear Regime Electrical Specifications.......................................................... 4

Table of Contents

3.4 Typical Performance Plots ............... 5
1.

Device Overview ............................... 1
1.1 General Description ........................ 1

3.5 Input Power at Observed Failure ...... 7
4.

1.2 Features ....................................... 1

2.

1.3 Functional Block Diagram ................ 1

4.1 Mounting and Bonding
Recommendations ................................ 8

1.4 Part Ordering Options ..................... 1

4.2 Handling Precautions ...................... 8Port Configurations and Functions ...... 3

4.3 Bonding Diagram ............................ 9

2.1 Port Diagram ................................. 33.

Die Mounting Recommendations ......... 85.

Mechanical Data ............................... 92.2 Port Functions ............................... 3

5.1 CH Package Outline Drawing ........... 9Specifications ................................... 4

5.2 U Package Outline Drawing ............ 10

3.1 Absolute Maximum Ratings .............. 4
3.2 Package Information ....................... 4

Revision History
Revision Code-

Revision Date
September 2019

Copyright © 2019 Marki Microwave, Inc.

Comment
Initial Release

Page 2|Rev.-

www.markimicrowave.com

HLM-402. Port Configurations and Functions
2.1 Port Diagram
A top-down view of the HLM-40’s CH package outline drawing is shown below. The HLM40 has the input and output ports given in Port Functions.

2.2 Port Functions
PortFunction

Description

INInput

The input port is diode connected for theCH and U package.

OUT

OutputThe output port is diode connected for
the CH and U package.

GroundCH package ground path is provided
through the substrate and ground bondpads. U package ground provided throughmetal housing and outer coax conductor.

GNDCopyright © 2019 Marki Microwave, Inc.

Equivalent Circuitfor Package

Page 3|Rev.-HLM-40www.markimicrowave.com

3. Specifications
3.1 Absolute Maximum Ratings
The Absolute Maximum Ratings indicate limits beyond which damage may occur to thedevice. If these limits are exceeded, the device may be inoperable or have a reduced
lifetime.
Parameter

Maximum Rating

Units

Average Power Handling at input port2,34

W

Peak Power Handling at input port320

W

Operating Temperature-55 to +100°C

Storage Temperature-65 to +125ºC

3.2 Package Information
Parameter

Details

RatingESD

Human Body Model (HBM), per MIL-STD-750, Method 1020

1A

WeightU Package

10 g

3.3 Linear Regime Electrical Specifications
The electrical specifications apply at TA=+25°C in a 50Ω system. Typical data shown isfor the connectorized U-package limiter unless otherwise specified. Linear Specifications
valid for input power up to the 0.1dB compression point. See page 5 for P0.1dB graph.
Min and Max limits are guaranteed at TA=+25°C.

Parameter

Test Conditions

Min

TypicalMax

Insertion Loss, bare die

0.5

1.5

Insertion Loss, U package

13

Return Loss, bare die

26

Return Loss, U package

14UnitsdBdB
Flat Leakage at 1W

DC – 40GHz

18dBm

Input IP3 (IIP3)

SeegraphdBm

Input 1dB Gain Compression Point (P1dB)

15dBm

Recovery Time4

10ps

2

Average power handling derated linearly to +35dBm at 85°C. Power handling spec based onobserved power handling at 800MHz. Actual power handling is frequency specific.
3See section 3.7 for basis of power handling specs.
4
Calculated based on equivalent capacitance and resistance.

Copyright © 2019 Marki Microwave, Inc.

Page 4|Rev.-www.markimicrowave.com

HLM-40

3.4 Typical Performance Plots

Copyright © 2019 Marki Microwave, Inc.

Page 5|Rev.-

www.markimicrowave.com

Copyright © 2019 Marki Microwave, Inc.

HLM-40Page 6|Rev.-HLM-40

www.markimicrowave.com

3.5 Input Power at Observed Failure
Power handling specification is based on tests performed at different combinations oftemperature and frequency. Input power was increased until catastrophic failure wasobserved. Results are shown in the following table. The power handling specification listed
in section 3.6 is based on the worst observed power handling derated by 3dB.
Frequency

Maximum Average Power Handlingat 25°Cat 85°C

0.8 GHz
2.5 GHz
6 GHzFrequency
2 GHz5394240

384139Unit

dBm

Maximum Peak Power Handling5Unit

35W

Tested using a 1µs pulse, 1% duty cycle at 25°C

Copyright © 2019 Marki Microwave, Inc.

Page 7|Rev.-

www.markimicrowave.com

HLM-404. Die Mounting Recommendations
4.1 Mounting and Bonding Recommendations
Marki MMICs should be attached directly to a ground plane with conductive epoxy. Theground plane electrical impedance should be as low as practically possible. This will
prevent resonances and permit the best possible electrical performance. Datasheet
performance is only guaranteed in an environment with a low electrical impedance ground.
Mounting - To epoxy the chip, apply a minimum amount of conductive epoxy to themounting surface so that a thin epoxy fillet is observed around the perimeter of the chip.
Cure epoxy according to manufacturer instructions.
Wire Bonding - Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire.
Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding
force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use
the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should bestarted on the chip and terminated on the package or substrate. All bonds should be as
short as possible <0.31 mm (12 mils).
Circuit Considerations – 50 Ω transmission lines should be used for all high frequency
connections in and out of the chip. Wirebonds should be kept as short as possible, withmultiple wirebonds recommended for higher frequency connections to reduce parasitic
inductance. In circumstances where the chip more than .001” thinner than thesubstrate, a heat spreading spacer tab is optional to further reduce bondwire length andparasitic inductance.

4.2 Handling Precautions
General Handling
Chips should be handled with care using tweezers or a vacuum collet. Users should takeprecautions to protect chips from direct human contact that can deposit contaminants,
like perspiration and skin oils on any of the chip's surfaces.
Static Sensitivity
GaAs MMIC devices are sensitive to ESD and should be handled, assembled, tested, andtransported only in static protected environments.
Cleaning and Storage: Do not attempt to clean the chip with a liquid cleaning system or
expose the bare chips to liquid. Once the ESD sensitive bags the chips are stored in are
opened, chips should be stored in a dry nitrogen atmosphere.

Copyright © 2019 Marki Microwave, Inc.

Page 8|Rev.-HLM-40

www.markimicrowave.com

4.3 Bonding Diagram

5. Mechanical Data
5.1 CH Package Outline Drawing

1.
2.
3.

CH Substrate material is 0.004 in thick GaAs.
I/O trace finish is 4.2 microns Au. Ground plane finish is 5 microns Au.
Tolerance for X, Y dimensions is ±0.002 in. Tolerance of metallization is ±0.0001 in.

Copyright © 2019 Marki Microwave, Inc.

Page 9|Rev.-

www.markimicrowave.com

HLM-405.2 U Package Outline Drawing

Unless otherwise specified, dimensions are in inches. Tolerances are:.XX± .02.XXX±.005

Marki Microwave reserves the right to make changes to the product(s) or information contained herein without notice.
Marki Microwave makes no warranty, representation, or guarantee regarding the suitability of its products for any
particular purpose, nor does Marki Microwave assume any liability whatsoever arising out of the use or application of any
product.

© Marki Microwave, Inc.