ThreeBond Technical News
Issued July 1, 201790

Techniques for Adding Solution
Functionality via Application Equipment
Introduction
At Threebond, we manufacture and supply highly functional, industrial-use adhesives andsealants, as well as develop and supply the equipment used for applying them at our customers’
manufacturing sites. We utilize materials and mechanisms appropriate for each adhesive orsealant’s particular characteristics in our application equipment, offering a massive product lineup
to suit each customer’s application needs.
As the automobile industry expands, we have been developing application equipment andtechnologies with particular focus on those for linear application of FIPG (formed in place gasket)
sealants. Recent years have seen improving safety performance as well as rapid progress incomprehensive control technology for automatic driving and as well as hybrid and electric drive
technology to handle emissions regulations and CO2 reduction within the automobile industry.
Outside of automobiles, the range of requirements for adhesives and sealants continues to growwith the spread of smartphones and development of wearable devices and other technologies. We
are also working on developing unique linear application technologies in order to keep up withthese market changes and provide optimal solutions for any situation.
Here we will introduce new application technology with added functionality for patterns that weredifficult to implement implement in conventional technologies.

Table of Contents

Introduction.................................................1
1. Background.............................................2
1-1 Conventional Application
Technology.......................................2
1-2 Technological Innovation inAutomobiles.....................................2
1-3 Requirements for Size Reduction,
Weight Reduction and Water-Proof
Functionality.....................................2

1-4 The ThreeBond Approach...............3
2. Planar Solution Application Technology.3
3. Micro-Point Solution Application
Technology..............................................4
4. Foam Solution Application Technology..6Closing........................................................81

1.

Background

1-1 Conventional Application Technology
Adhesive and sealant application is comprised of twotechnologies: pressure transfer of the solution and drive tocontrol the end applying solution pressure via a robot, etc.
FIPG sealant is applied to joints in automobile engines andtransmissions to prevent oil and coolant from leaking. Thesesealants are discharged from a moving nozzle in lines that
follow the shape of the adherend (Photo 1).

Table 1 HV, EV, FCV Units (Japan)(units)7,000,000
6,040,943

6,000,000
4,947,080

5,000,000
3,983,243

4,000,000
2,964,081

3,000,000
2,000,000

2,081,797

1,000,000
0

2011

2012

2013

2014

2015 (year)

With automobile improvement progressing as we havementioned above, so too have the requirements foradhesives and sealants. For example, while combustion
engines required sealing performance for lubricating oil,performance for electrical systems is required in nextgeneration automobile power sources. This means that bothcomposition and shape vary, requiring coating methods thatdiffer from the simple linear application used before.

Photo 1 FIPG Linear Application

The mechanism that discharges sealant at a constant speed
and that which keeps the nozzle following a set and directed
pattern and speed are vital here. FIPG sealant has becomea market standard due to various characteristics in linewith a variety of requirements, as well as its corresponding
application technologies.
We have independently developed coating technologies
since the initial stages of FIPG, creating technologies known
for their accurate application of highly viscous solution onflange surfaces that are currently in use at manufacturing
sites across the globe.

1-2 Technological Innovation in Automobiles
We have been developing and moving toward further
practical application in HV/EV that improves fuel economy
in line with global conservation and energy-saving trends.
There has also been higher and higher demand for fuel cellvehicles that do not emit air-polluting hydrogen gas andother harmful substances. These next-generation vehicles
are developed and sold by manufacturers world-wide, withthe number of vehicles registered continuing to steadily
grow (Table 1).

21-3 Requirements for Size Reduction, WeightReduction and Water-Proof Functionality
With the rapid spread of smartphones with higher andhigher functionality, smaller and lighter mounting parts arerequired (Table 2). These requirements are also applicableto the technical aspects of future developments, such aswearable devices and drones, where various parts requirewater or dust-proofing. To implement these changes, it
has become more and more necessary to create coating
applications for precisely small amounts in small parts andin shapes suited to the particular application.
Table 2 Smartphone Sale Trends (Worldwide)(millions)
1,400

1,303
1,165

1,200
1,012

1,000
841

800
655

600
472

400
20002011

2012

2013

2014

2015

2016 (year)1-4 The ThreeBond Approach
In keeping with market needs in these times of massive
turnaround, ThreeBond is developing a variety of new
application technologies that correspond with our highly
functional adhesives and sealants as an alternative toconventional application. In the next section, we will
introduce three kinds of solution application technologies
that add functionality to the solutions to which they areapplied.

2.

Planar Solution Application Technology

coverage in a short amount of time. The advantage of thisequipment is that it applies even fluid pressure for the full
width of the slit when discharge begins, so a nearly perfect
rectangle can be applied even if discharge is turned on or off
at certain positions (Fig. 1).
Similar slot die structures can also produce a uniform thinfilm but can only discharge continuously. This is appropriate
for film lamination processes, but because it is common
to reapply adhesive in certain areas, this arbitrary on/off
control is important for accurate application.

The RV-SN Series (Photo 2) equipment applies adhesiveand sealant in planes. It dispenses solution in a wide bandfrom a nozzle with a slit opening. Moving the nozzle or theworkpiece as solution is being dispensed enables wide-plane

Screen printing is another form of planar application,
but this kind of application can generally only form film
thicknesses of around 20μm. The RV-SN Series is designed
for film thicknesses from 100 μm to 1 mm.

Photo 2 RV-SN Planar Application EquipmentFig. 1 RV-SN Coating Application

Table 3 PV-SN Series Specifications
Features

PV-SN Series

Model

RV05-SN50

RV10-SN100

RV15-SN150

Coating width

20 - 50 (mm)51 - 100 (mm)101 - 150 (mm)Film thickness

0.1 - 1.0 (mm) *May be usable outside this range

Viscosity

0.5 - 700 (Pa·s) *May be usable outside this range

Durable pressure

0.7 (MPa) or lessMaterials

ThreeBond 1200 and 1500 Series moisture curing sealants and adhesives
ThreeBond 2200 Series two-component epoxy resin
ThreeBond 3000, 3100 Series UV curing resin

Drive source

Clean dry air 0.3 to 0.6 (MPa)

Operational system

Air cylinder controlled valve switch

OtherNozzle sizes (application width) available in 1 mm gradations3

3.

Micro-Point Solution Application
Technology

PiT-16 equipment (Photo 3) applies solutions in micropoint diameters of 100 μm or less. Unlike application with aconventional nozzle, even solutions with a large particle size
can be applied without the potential of clogging.

The principle behind this application is that the pin islowered from the discharge hole. Once it protrudes from thetank the appropriate amount of solution adheres to the pinthen is transferred to the adherend (Fig. 2).

Transfer pin

Tank
Solution
Pin protrusion
holeFig. 2 Principle of Pin Transfer

Compatible solutions are heat curing electrical conductive
adhesive, one-component epoxy resins and UV-curingresins (Photo 4).
Liquid properties must be suitable for actual use, so a trial
in advance of actual application is advised. Not compatible
with moisture curing resin, instant adhesive, anaerobic
adhesive and the like materials due to the materials used tomake the equipment.

80µm

Photo 3 PiT-16 Micro-Point Solution Application
EquipmentThis device features a special pin transfer system. Utilizing
this enables micro-point application without clogging
the nozzle. The pin drive is a linear motor that speeds up
transfer operations while ensuring high durability.
Hight of the transfer target can cause deviation indimensional accuracy during transfer of minute amounts ofcoating. This is alleviated by taking a preliminary heightmeasurement and having the machine feed that data backduring the transfer process to follow, correcting operations
as is suitable for the height. This enables highly accurate
reproduction of micro-point application.

4Photo 4 Conductive Adhesive Application

Table 4 is a distribution map for coating diameter during 900 repeated point applications of electrical conductive adhesive. Table 5shows point coating height and flatness ratio (outer coating dimensions vs coating height) for 200 of the 900 points shown above.
Table 4 Outer Diameter Application Distribution
250

Conductive adhesive (in development)
application distribution
200150

NumberofPoints

100

50051525354555

6575

85

95105 115125

135 145 155 165 175

185 195

Diameter (µm)

Table 5 Coating Height and Flatness Ratio
26100

Coating Height Measurements
90
24

Coating height80

Flatness ratio
227060Height 20(µm)

5018Flatness
ratio(%)

4030

1620
1495

100105110115120125130135140

10Diameter (µm)

Table 6 PiT-16 SpecificationFeatures

Micro-Point Application Equipment

External dimensions (W x D x H)

84.5 × 68 × 242 (mm)Weight1.6 (kg)

Drive source

Head: Clean dry air 0.1 to 0.2 (MPa)Motor amplifier: 100 VAC

Compatible solutions:

Conductive adhesive, one-component epoxy resins, light curing resins

Application dimensions

100 (μm) or less *Depending on solution conditions

Operating environment

Temperature: 0 to 55°C

Humidity: 20 to 85% RH (no condensation)

5

4.

Foam Solution Application Technology

The MFD-10 compact mechanical foaming system mixes
gasses into a single-component liquid and applies themas a foam. Unlike conventional chemical foaming (twocomponent reaction foaming) where foam is generated
through the reaction caused by mixing two liquids, here gas
is physically mixed into a single-component liquid to create
foam in a stable liquid formation (Photo 5).

Before foaming
C hardness: 36

1.4x foaming
C hardness: 23

Foam expansion is easily controlled within 1.3 to 3.0 times,
making it possible to create cured items with properties
that vary with the foaming ratio, even when using thesame solution. Because foam is formed independently, it
is excellent for applications requiring sealing performance(Photo 6).

1.6x foaming
C hardness: 19

For example, you can increase the foaming ratio and lower
foam firmness in order to apply sealant without undue stresson typical casing, which has low rigidity.
Additional features include:
1. Performance not affected by heat and humidity.

1.8x foaming
C hardness: 18

2. Compact for space conservation.
3. Wetted parts are easily separated for simple maintenance.
4. Stable low amount discharge range (0.01 to 1.50 g/sec.).
Useable for applications such as soundproofing andsound absorption, vibration protection and suppression,
dust and drip-proofing, insulation, weight reduction andshock absorption. We have been highly praised for ourcontributions to performance, quality and work efficiency
in a variety of fields requiring foaming materials.

2.0x foaming
C hardness: 16

Photo 6 Cross Section and Hardness of Item
Cured with ThreeBond 1234B

Photo 5 MFD-10 Mechanical Foaming Dispenser

6

Table 7 shows the changes in discharged amount during 300 applications of heat curing silicone resin using the MFD-10.
Table 8 shows changes to foaming ratio in the same way. Both are within a range of ±5%.
Table 7 Discharge Amount Stability

(g)
1.300

USL10%

1.250

USL5%

1.200

Discharge amount
Spec

1.150

1.100

LSL5%

1.050

LSL10%

281(times)

291

271

261

241

251

231

211

221

201

191

171

181

151

161

141

121

131

111

91

101

71

81

61

4151

31

1121

11.000

Table 8 Foaming Ratio Stability(x)2.300

USL+10%2.200

USL+5%

2.100

Foaming ratio
2.000Spec

1.900

LSL-5%

1.800

LSL-10%281(times)

291

271

261

251

241

231

221211

201191

171181

151

161

141

121

131

111

91

101

8171

6151

4131

112111.700

Table 9 MFD-10 Specifications
Features

MFD-10Model

Foaming Pump

Mixing HeadController

External dimensions (W x D x H)

200 × 140 × 350 (mm)130 × 145 × 250 (mm)430 × 450 × 230 (mm)Weight10 (kg)

4 (kg)

8 (kg)

Drive source

Clean dry air 0.3 to 0.6 (MPa), Power supply: 200VAC, 30A

Discharge speed0.05 to 2 (cc/sec) *1

Foaming ratio

1.3 to 3x *2

Viscosity

50 to 400 (Pa·s) *3*1: Maximum discharge amount restricted by viscosity of solution used. As a guide, when viscosity is 100 Pa·s, discharge speed is 1 cc/sec*2: Foaming ratio restricted by solution used.
*3: May be usable with solutions other than the indicated viscosity.

7

Closing

At ThreeBond we develop adhesives and sealants as well as coating application technology to maximize their performance.
Our strength is our deep understanding of product components and compositions that enables us to offer our customers suitableapplication equipment designed with those characteristics.
Moving forward, we will continue to ensure the usefulness of our sealants and adhesives, as well as their application equipment
to support innovation within the manufacturing industry. You can be certain that we will continue to develop further techniques
for adding solution functionality via application equipment.
<References>
1) Next Generation Vehicle Promotion Center, Statistical Data
2) Ministry of Internal Affairs and Communications Website<Regarding numerical data in this document>
Values indicating dimensions and characteristics are as measured but are not guaranteed.

ThreeBond Co., Ltd. R&D Headquarters
Energy Conservation Development Division, Energy Conservation Equipment Department
Hajime Kibe

ThreeBond Co., Ltd.
84-3-3 Minamiosawa, Hachioji,
Tokyo 192-0398
Tel: +81-42-670-5333