電子部品用高分子材料の最新動向Ⅳ― 半導体用および電子基板用の超高周波対応低誘電性材料 ―2005年6月発行
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目
第１章

緒

次

言 ····································································································································· 1

第２章 電子部品産業の市場動向 ··································································································3
２.１ 日本の電子産業の動向 ········································································································3
２.２

半導体産業分野の動向 ········································································································4２.２.１

半導体市場の動向 ················································································································ 4２.２.２半導体メーカーの動向 ······································································································· 5１

世界半導体市場ランキング ······························································································· 5２日本半導体市場ランキング ······························································································· 5２.２.３

半導体用材料の市場動向 ··································································································· 6１半導体装置作製用化学材料 ······························································································· 6２半導体パッケージング用材料 ··························································································· 7

２.３電子基板産業分野の動向 ································································································ 10

２.３.１

電子基板市場の動向 ········································································································ 10

１世界の電子基板市場 ········································································································ 10２日本の電子基板市場 ········································································································ 10

３

プリント配線板の市場動向 ····························································································· 11４モジュール基板の市場動向 ···························································································· 12５ビルドアップ基板の市場動向 ························································································ 12６海外生産の展開 ················································································································· 13２.３.２

回路板メーカーの動向 ···································································································· 13

２.３.３

積層板メーカーの動向 ···································································································· 15

１

リジッド積層板の動向 ···································································································· 15２フレキシブル積層板の動向 ···························································································· 16

第３章 実用的な誘電理論 ·············································································································· 17
３.１ 低誘電率材料の必要性 ····································································································· 17
３.２

誘電分極の原因 ···················································································································· 20

３.３

誘電率の計算 ························································································································ 23３.４低誘電率材料の開発方法 ································································································ 24

第４章 半導体用高耐熱性・低誘電率材料の開発 ···························································· 32
４.１ LSI の技術開発の動向 ······································································································ 32
４.１.１

LSI の多層配線技術分野の特許出願動向 ···································································· 32

４.１.２

LSI の多層配線技術分野における技術目標と課題 ··················································· 33

４.１.３

LSI 用の Cu 配線技術の開発 ·························································································· 34

４.１.４

LSI 用の低誘電率材料の開発 ························································································· 35

－i－

４.２

Low-k 材料の開発の状況 ································································································· 36

４.２.１

Low-k 材料の開発の変遷 ································································································ 36

１2000 年以前に開発された Low-k 材料 ········································································ 36２2000 年以降に開発された Low-k 材料 ········································································ 42［１］フッ素変性 Low-k 材料の後退 ············································································ 42［２］ポーラス Low-k 材料の台頭 ················································································· 42［３］ノンポーラス Low-k 材料の研究開発の開始 ··················································· 42

４.２.２

Low-k 材料の開発のポイント ························································································ 42

１プラズマ CVD とスピン SOG の長所、短所 ····························································· 42

２有機 Low-k 材料と無機 Low-k 材料の長所、短所 ····················································· 43

４.２.３

2004 年時点での代表的な Low-k 材料 ········································································ 44

１

Dow Chemical(米)の｢SiLK｣と｢SiLK Y｣ ···································································· 45２日立化成工業の｢HSG-255 シリーズ｣ ········································································· 46

３

Honeywell(米)の｢GX シリーズ｣と｢Nanoglass E｣ ·················································· 46

４

アルバックの｢ISM シリーズ｣ ························································································ 47

５JSR の｢JSR LKD｣ ············································································································ 47

６東京応化工業の｢T12｣と｢T9｣ ························································································ 47

７

旭化成の｢ALCAP5100S｣ ································································································ 48

８岸本産業と第三化成の｢diX F｣ ······················································································ 48

９Applied Materials(米)の｢Black Diamond｣ ································································· 48

10その他メーカーの低誘電率材料 ··················································································· 48

４.３

Cu/Low-k ポーラス膜の技術課題 ················································································ 48

４.３.１

機械的強度の問題 ············································································································· 48

４.３.２

その他の技術課題 ············································································································· 49

４.３.３

ポーラス膜の限界 ············································································································· 51

４.４

ノンポーラス膜の出現 ····································································································· 52

４.４.１

フルオロカーボン膜 ········································································································ 52

４.４.２

フッ化パリレン膜 ············································································································· 52

４.４.３

ボラジン膜 ························································································································· 53

４.４.４

Air-Gap 構造による改良 ································································································· 54

第５章 電子基板用低誘電率・低誘電正接材料の開発 ··················································· 55
５.１ 高周波用電子基板に要求される誘電特性の開発目標値 ·································· 55
５.２ 2004 年に発表された低誘電性電子基板 ·································································· 57
１住友ベークライトの低誘電性電子基板 ··············································································· 59２日立化成工業の低誘電性電子基板 ······················································································· 62

３

松下電工の低誘電性電子基板 ································································································ 63

４

京セラケミカルの低誘電性電子基板 ··················································································· 67

５

利昌工業の低誘電性電子基板 ································································································ 67

６三菱ガス化学の低誘電性電子基板 ······················································································· 69

－ii－

７

クラレの低誘電性電子基板用材料 ······················································································· 72

８新日鐵化学の低誘電性電子基板 ··························································································· 73９三井化学の低誘電性電子基板 ································································································ 74

10宇部興産の低誘電性電子基板 ································································································ 76

11

太陽インキ製造の低誘電性電子基板用材料 ······································································ 77

５.３

低誘電性電子基板を開発するための新規ポリマー ············································ 79１

低誘電率エポキシ樹脂(EP) ··································································································· 79

２

ビスマレイミド・トリアジン樹脂(BT レジン) ································································ 80

３ポリフェニレンエーテル(PPE) ···························································································· 81

４液晶ポリマー(LCP) ················································································································· 81

５ポリイミド(PI) ························································································································· 82

６シクロオレフィン樹脂(COP) ······························································································· 84

７ベンゾシクロブテン樹脂(BCB) ··························································································· 85８フッ素樹脂(PTFE) ·················································································································· 87

５.４

既存ポリマーのアロイ化による低誘電性電子基板の開発 ······························ 88

第６章 ポリマー別低誘電性材料の開発の現状 ································································· 92
６.１ ポリイミド(PI)の低誘電化の研究 ·············································································· 92
６.１.１

ポーラス化による低誘電率化 ························································································ 92

１

ナノポーラスポリイミドの開発方法 ··········································································· 92２超臨界二酸化炭素を使用した低誘電率ポーラスポリイミド ································· 93

３

発泡体をイオン結合で導入した低誘電率ポーラスポリイミド ····························· 93

４特殊発泡剤を用いた微小独立気泡からなる低誘電率ポーラスポリイミド ········ 94

５中間層がポーラスなポリイミドフィルム ··································································· 95

６.１.２

フッ素変性による低誘電率化 ························································································ 95

１

架橋によって耐熱性、耐溶剤性を改良した低誘電率ポリイミド ························· 95２フッ素含有ビニル系単量体を共重合した耐熱性の良い低誘電率ポリイミド ···· 96３

誘電率の等方性に優れる低誘電率ポリイミド ·························································· 97

４高透明性で高屈折率の低誘電率ポリイミド ······························································ 97

５耐熱性、溶剤溶解性に優れる低誘電率ポリイミド ·················································· 98

６その他の低誘電率・フッ素変性ポリイミド ······························································ 99

６.１.３

脂環式構造による低誘電率化 ························································································ 99

１シクロヘキサンジアミンとシクロブタンテトラカルボン酸からなるポリイミド ············································ 100

２シクロヘキサンジアミンからなるポリイミド ························································ 100

３シクロブタンテトラカルボン酸からなるポリイミド ············································ 101

４

ビシクロヘプタンジアミンからなるポリイミド ···················································· 103

５シクロヘキサンテトラカルボン酸からなるポリイミド ······································· 103６.１.４

嵩高い構造の導入による低誘電率化 ········································································· 104

１

アダマンタン基を有する低誘電率ポリイミド ························································ 104

－iii－

２

ノルボルネン骨格を有する低誘電率ポリイミド ···················································· 104

３

ジエチルビニルエーテルで架橋した低誘電率ポジ型感光性ポリイミド ·········· 105

４ジメチルインダン骨格を有する低誘電率ポリイミド ············································ 106

５

キサンテン骨格を有する低誘電率ポリイミド ························································ 106６.１.５

低極性化による低誘電率化 ·························································································· 106

１

アルキル基を導入した低誘電率ポリイミド ···························································· 107

２

ポリベンゾオキサゾールを共重合した低誘電率ポリイミド ······························· 107

３極性基のない低誘電率ポリカルボジイミド ···························································· 108

６.１.６

シリコーンの導入による低誘電率化 ········································································· 108１

架橋できる低誘電率シリコーン変性ポリイミド ···················································· 108

２ビスイミド系化合物で変性した低誘電率シリコーン変性ポリイミド ·············· 109

３

シアン酸エステル化合物で変性した低誘電率シリコーン変性ポリイミド ······· 110

６.１.７

シアネート基の導入による低誘電率化 ······································································110

６.１.８

低誘電率材料の混合による低誘電率化 ······································································ 111

１

シリコーン微粒子を混合した低誘電率ポリイミド ················································· 111２

フッ素樹脂微粒子を混合した低誘電率ポリイミド ·················································112３

多孔質フッ素樹脂粒子を混合した低誘電率ポリイミド ········································ 112

４

シアネート樹脂、またはベンゾシクロブテンを混合してなる
低誘電率ポリイミド ·······································································································113

６.２

ポリベンゾオキサゾール(PBO)の低誘電化の研究 ··········································114

６.２.１
１

ポーラス化による低誘電率化 ·······················································································114
架橋によって、耐熱性、機械的特性を改良した
低誘電率ポリベンゾオキサゾール ··············································································114

２

外れ易いイオン結合などで、発泡体を導入した
低誘電率ポリベンゾオキサゾール ··············································································115

３均一で微細な気泡を有する感光性低誘電率ポリベンゾオキサゾール ··············· 116

６.２.２

フッ素変性による低誘電率化 ·······················································································116１高耐熱性で低吸水性の低誘電率ポリベンゾオキサゾール ···································· 116

２ポリイミドを共重合した低誘電率ポリベンゾオキサゾール ································ 117

３

マレイミドを混合した低誘電率ポリベンゾオキサゾール ···································· 117６.２.３

脂環式構造による低誘電率化 ·······················································································118

１シクロアルカン結合を有するジカルボン酸からなる
低誘電率ポリベンゾオキサゾール ··············································································118２シクロアルカン結合を有するジアミノジヒドロ化合物からなる
低誘電率ポリベンゾオキサゾール ··············································································119

６.３

ポリフェニレン(ポリアリーレン) ············································································119

６.３.１

Dow Chemical の｢SiLK｣ ·······························································································119１

架橋ポリフェニレン｢SiLK｣の合成とその構造 ························································ 120

２

ポーラスな｢p-SiLK｣の合成とその構造 ····································································· 121

３｢SiLK｣の特性 ··················································································································· 123－iv－

［１］｢SiLK｣の特性 ········································································································ 123［２］｢p-SiLK｣の特性 ···································································································· 124［３］他の材料との特性の比較 ··················································································· 124
４｢SiLK｣開発の歴史 ·········································································································· 125

６.３.２

他社のポリフェニレン ·································································································· 128

１

JSR のポリフェニレン ·································································································· 128［１］アセチレン結合で架橋し耐熱性を改良したポリフェニレン ···················· 128［２］フラーレンおよび／またはカーボンナノチューブによる更なる低誘電化ポリフェニレン ······································································· 129２６.４

住友化学工業のポリフェニレン ················································································· 130

ポリベンゾシクロブテン ······························································································ 131

６.４.１

半導体分野への適用 ······································································································ 131

１

Dow Chemical の｢Cyclotene｣ ····················································································· 131［１］｢Cyclotene (DVS-bis BCB)｣樹脂の合成と硬化反応 ····································· 131［２］｢Cyclotene (DVS-bis BCB)｣樹脂の特性 ·························································· 133［３］｢Cyclotene (DVS-bis BCB)｣樹脂の用途 ·························································· 134

２

MIRAI プロジェクトの研究開発状況 ········································································· 135［１］プラズマ共重合技術によるスケーラブル有機 Low-k 材料の開発 ··········· 135［２］新しいプラズマ共重合技術で成膜速度と機械強度を向上 ························· 136［３］300mm ウェハー上でのプラズマ共重合有機 Low-k 膜のダマシン配線形成 ····································· 136

３

NEC の研究開発状況 ····································································································· 137［１］プラズマ重合 BCB 膜の成膜技術 ····································································· 137［２］プラズマ重合 BCB 膜の特性 ············································································· 138［３］プラズマ重合 BCB 膜の構造 ············································································· 139

６.４.２

電子基板分野への適用 ·································································································· 141１

住友グループの共同研究開発状況 ············································································· 141２住友ベークライトの研究開発状況 ············································································· 142［１］銅張積層板の開発 ································································································ 142［２］樹脂付銅箔の開発 ································································································ 143

６.４.３

６.５

接着剤・接着フィルム分野への適用 ········································································· 145

ポリアリーレンエーテル ······························································································ 146

６.５.１

Honeywell の｢GX｣ (元 Allied Signal の｢FLARE｣) ················································ 146１

熱硬化ポリアリーレンエーテル ················································································· 146

２電子ビーム硬化ポリアリーレンエーテル ································································· 147

６.５.２

他社のポリアリーレンエーテル ················································································· 148

１

エアプロダクツ アンド ケミカルズのオレフィン変性ポリアリーレンエーテル ································································· 148

２

６.６

東レのフッ素変性ポリアリーレンエーテル ···························································· 149

ポリシロキサン(PSiO) ·································································································· 150－v－

６.６.１

極性の高い未反応シラノール基を低減した低誘電率ポリシロキサン ·············· 150

６.６.２

アクリル樹脂で多孔質化した低誘電率ポリシロキサン ······································· 152６.６.３

350℃以下で熱分解する側鎖を有する低誘電率ポリシロキサン ························ 153

６.６.４

多面体構造からなる高強度・高耐熱・低誘電ポリシロキサン ··························· 154

６.６.５

環状および／またはケージ状シロキサン化合物からなる
低誘電率ポリシロキサン ······························································································ 155

６.６.６

６.７

Applied Materials の｢Black Diamond｣ ······································································ 156

ポリボラジン ······················································································································ 158

６.７.１

三菱電機のボラジン ······································································································ 158

１

高強度で高耐熱性のポリボラジン ············································································· 158

２

耐水性を改良したポリボラジン ················································································· 159

３

スピンコート法によるボラジン膜の作製 ································································· 160

４プラズマ CVD 法によるボラジン膜の作製 ······························································ 161

６.７.２

ASET/AIST のボラジン・ケイ素ポリマー ······························································· 162

１

ボラジン・ケイ素ポリマーの創出 ············································································· 162

２

ボラジン・ケイ素ポリマーの合成 ············································································· 162

３

ボラジン・ケイ素ポリマーの特性 ············································································· 163

４

ボラジン・ケイ素ポリマーの応用 ············································································· 165

６.８

ポリ-p-キシリレン ············································································································ 166

６.８.１

ポリ-p-キシリレンの低誘電特性 ················································································ 166

１

ポリ-p-キシリレンの特性 ····························································································· 166

２岸本産業と第三化成の｢diX｣ ························································································ 167

３

Dielectric Systems 社の｢FAR2.2｣ ············································································· 168

６.８.２

ポリ-p-キシリレンのアニーリングによる熱特性の改良 ······································ 169

６.８.３

ポリ-p-キシリレンのシロキサンとの共重合による接着性の改良 ······················ 170

６.９

フルオロカーボン膜 ········································································································ 171６.９.１

低誘電率フルオロカーボン膜 ······················································································ 171

６.９.２

マイクロ波励起高密度プラズマ技術 ········································································· 173

６.９.３

CVD と SOD の特徴とその将来性 ·············································································· 174

６.10

エポキシ樹脂の低誘電化の研究 ················································································ 175

６.10.１低極性化(水酸基低減)による低誘電化 ····································································· 175１水酸基を低減して低誘電化する方法 ········································································· 175［１］大日本インキ化学工業の水酸基濃度を低減する方法 ································· 175［２］日東電工の水酸基濃度を低減する方法 ·························································· 177

２水酸基を生成しないように硬化させて低誘電化する方法 ··································· 179［１］住友ベークライトのシアネートエステルを用いる方法 ····························· 179［２］大日本インキ化学工業の活性エステル化合物を用いる方法 ···················· 179［３］日立製作所の光酸発生剤を用いる方法 ·························································· 180

６.10.２

低分極化(嵩高構造)による低誘電化 ········································································· 181

１

ジシクロペンタジエン基を導入して低誘電化する方法 ······································· 181

－vi－

２

トリフェニル基を導入して低誘電化する方法 ························································ 181

３

トリアジン環を導入して低誘電化する方法 ···························································· 182

４

アセトフェノン及びフルオレノン構造を導入して低誘電化する方法 ·············· 183

６.10.３

低誘電樹脂変性による低誘電化 ················································································· 184

１

ポリフェニレンエーテル変性による方法 ································································· 184［１］三菱ガス化学の半導体封止用樹脂組成物 ······················································ 184［２］松下電工の積層板用樹脂組成物 ······································································· 185

２

ポリブタジエン変性による方法 ················································································· 185［１］住友ベークライトの積層板用硬化剤 ······························································ 185［２］サンユレックの積層板用硬化剤 ······································································· 186

３ポリベンゾオキサゾール変性による方法 ································································· 187

４

シアヌレート変性による方法 ······················································································ 187

５ヒドロキシ樹脂変性による方法 ················································································· 188

６ベンゾオキサジン変性による方法 ············································································· 189

７

インデン変性による方法 ······························································································ 189

８シラン変性による方法 ·································································································· 190［１］シラン変性エポキシ樹脂を使うエポキシ樹脂－シリカハイブリッド ···· 190［２］ビスフェノール A 型エポキシ樹脂－シリカハイブリッドの物性 ··········· 191［３］ノボラック型エポキシ樹脂－シリカハイブリッドの物性 ························· 191

６.10.４

充填材および基材による低誘電化 ············································································· 192

１

中空フィラーにより低誘電化する方法 ····································································· 192［１］京セラケミカルの多孔質シリカゲルを充填する方法 ································· 192［２］積水化学工業のプラスチック粒子を充填する方法 ····································· 193

２

フラーレンにより低誘電化する方法 ········································································· 193

３有機繊維基材により低誘電化する方法 ····································································· 194［１］東洋紡績のポリベンザゾール繊維による方法 ·············································· 194［２］東レのポリフェニレンスルフィド繊維による方法 ····································· 194

４

６.11

無機ガラス繊維基材により低誘電化する方法 ························································ 195

ポリエステル ······················································································································ 196

６.11.１

液晶ポリマー ··················································································································· 196

１

液晶ポリマーの構造とその特性 ················································································· 197［１］液晶ポリマーの種類 ···························································································· 197［２］液晶ポリマーの特徴 ···························································································· 198２

液晶ポリマーの特性の向上 ·························································································· 199［１］低誘電特性の更なる向上 ··················································································· 199［２］液晶ポリマーの耐熱性の改良 ··········································································· 200［３］低吸水性の更なる向上 ························································································ 201

３

クラレの液晶ポリマーフィルム｢Vecstar｣ ······························································· 201［１］クラレの液晶ポリマー(LCP)フィルムの特徴 ·············································· 201［２］LCP フィルム｢Vecstar｣の微細構造 ·································································· 202－vii－

［３］LCP フィルム｢Vecstar｣の異方性と等方性 ······················································ 203［４］耐熱性 ····················································································································· 203［５］熱溶融性 ················································································································· 203［６］熱膨張係数 ············································································································· 203［７］高周波特性 ············································································································· 204［８］吸水性と吸湿寸法安定性 ··················································································· 205
４

ジャパンゴアテックスの液晶フィルム｢BIAC｣ ······················································· 205［１］ジャパンゴアテックスの液晶ポリマー(LCP)フィルムの特徴 ················· 205［２］電気特性 ················································································································· 206［３］寸法安定性 ············································································································· 207［４］吸水特性 ················································································································· 207［５］熱特性 ····················································································································· 207［６］機械特性 ················································································································· 208

５

液晶フィルムを使用したフレキシブル基板 ···························································· 208［１］液晶ポリマー製フレキシブル基板の特徴 ······················································ 208［２］液晶ポリマー製フレキシブル基板の高周波電気特性 ································· 209［３］液晶ポリマー製フレキシブル基板の吸湿特性 ·············································· 210

６液晶ポリマーとエポキシ樹脂からなるビルドアップ基板 ··································· 210

７液晶ポリマー不織布を用いたリジッド基板 ·····························································211［１］液晶ポリマー不織布の開発 ················································································211［２］液晶ポリマー不織布を用いた BT 樹脂基板 ····················································211

６.11.２

その他のポリエステル ·································································································· 213

１ビフェニル構造を有する低誘電率ポリアリレート ················································ 213２

イオン性不純物を除去した低誘電正接ポリアリレート ······································· 213

３多孔質構造を有する低誘電率ポリアリレート ························································ 214

４

架橋ポリエステル ··········································································································· 215

６.12

フッ素樹脂 ··························································································································· 216

６.12.１

ポリシロキサン変性フッ素樹脂 ················································································· 216［１］超 LSI 用低誘電率層間膜形成材料｢ST-F2000｣の開発の経緯 ····················· 216［２］パーフルオロ樹脂とポリシロキサンの複合化によるパターン変形の改善 ···························································································· 217［３］｢ST-F2000｣の諸特性 ···························································································· 217

６.12.２

熱硬化性フッ素樹脂 ······································································································ 218

６.12.３

多孔質真球状シリカゲル配合フッ素樹脂 ································································· 219

６.13

ポリキノリン ······················································································································ 220

６.13.１

低誘電率ポリキノリン ·································································································· 220［１］ポリキノリンの誘電特性 ··················································································· 220［２］ポリキノリンの熱に対する化学的安定性 ······················································ 220［３］ポリキノリンの熱に対する物理的安定性 ······················································ 221［４］ポリキノリンの吸湿安定性 ··············································································· 221－viii－

［５］ポリキノリンの接着性の改良 ··········································································· 221
６.13.２

ポリキノリンの耐熱性の向上 ······················································································ 222

６.13.３

ポリキノリンの誘電正接の低減 ················································································· 222

６.14

ポリオレフィン ·················································································································· 223

６.14.１

シクロオレフィンポリマー(ノルボルネン関連ポリマー) ··································· 223

１

無極性のシクロオレフィンポリマー ········································································· 224［１］日本ゼオンの｢ZEONEX｣と｢ZEONOR｣の特徴 ·············································· 224［２］日本ゼオンのシクロオレフィンポリマーの改良研究 ································· 226

２エポキシ変性シクロオレフィンポリマー ································································· 227［１］JSR のエポキシ変性ノルボルネン樹脂 ··························································· 227［２］(台湾)工業技術研究院のエポキシ変性ノルボルネン樹脂 ························· 229

３

イミド基含有シクロオレフィンポリマー ································································· 230

４多孔質シクロオレフィンポリマー ············································································· 231

５スチレン変性シクロオレフィンポリマー ································································· 232

６.14.２α-オレフィン共重合体 ································································································· 233

１α-オレフィンとビニルからなるグラフト共重合体 ·············································· 233

２α-オレフィン／ビニル共重合体からなる高周波回路基板 ·································· 234３α-オレフィン／ビニル共重合体からなる高周波帯域通過フィルター ············· 235

６.15

シアネート樹脂 ·················································································································· 235

６.15.１

低誘電性シアネート樹脂の開発 ················································································· 235

６.15.２

ポリフェニレンエーテル変性シアネート樹脂 ························································ 236

６.15.３

シロキサン変性シアネート樹脂 ················································································· 238

６.15.４

アラルキルエポキシ変性シアネート樹脂 ································································· 238

６.15.５リン酸エステル変性シアネート樹脂 ········································································· 239

６.16

ポリフェニレンエーテル(PPE) ················································································ 240

６.16.１低分子量化ポリフェニレンエーテルにイソシアヌレートを混合した熱硬化性樹脂 ·································································································· 240

６.16.２2 官能型ポリフェニレンエーテルオリゴマーをシアネート体にした熱硬化性樹脂 ············································································· 242

６.16.３

シアネートエステルとエポキシを配合してなる
熱硬化性ポリフェニレンエーテル ············································································· 243

６.16.４

光酸発生剤を配合してなるポジ型感光性ポリフェニレンエーテル ·················· 243

６.16.５

アクリレート変性してなるネガ型感光性ポリフェニレンエーテル ·················· 244

６.16.６エチレン-エポキシ共重合体でアロイ化したポリフェニレンエーテル ············· 245

６.17

ポリスチレン ······················································································································ 245

６.17.１

多官能ポリスチレン硬化体 ·························································································· 245

６.17.２

熱可塑性シンジオタクチックポリスチレン ···························································· 248

６.17.３低誘電正接ポリスチレンからなるアンテナ装置 ···················································· 249

６.18

ポリビニルベンジルエーテル ····················································································· 251

６.18.１低誘電正接化ポリビニルベンジルエーテル ···························································· 251－ix－

６.18.２

６.19

溶剤処理で更に低誘電正接化したポリビニルベンジルエーテル ······················· 252

アセナフチレンポリマー ······························································································ 253

６.19.１ヒドロキシスチレン変性アセナフチレンポリマー ················································ 253

６.19.２スチレン変性アセナフチレンポリマー ····································································· 254

６.20

その他の低誘電性材料 ··································································································· 255

６.20.１

特殊な枝分かれポリマー ······························································································ 255

６.20.２エチニル基を持つ芳香族ポリマー ············································································· 255

６.20.３

インデン含有ポリマー ·································································································· 256

６.20.４ブタジエン(共)重合体含有熱光硬化性ポリマー ···················································· 257

６.20.５

ポリシラザン ··················································································································· 257

６.20.６

ポリアダマンタンエーテル ·························································································· 258

６.20.７

フッ素変性ポリエーテルケトン ················································································· 259

６.20.８芳香族ビニル共重合ポリマー ······················································································ 261

６.20.９低誘電率感光性芳香族ホルムアルデヒド樹脂 ························································ 261

６.20.10

ポリエチレン ··················································································································· 262

第７章

結語 ··························································································································· 264

略 語 表 ···················································································································································· 267
参考文献 ···················································································································································· 269－x－