高密度化を担う

電子部品埋め込み基板の最新動向

2007年1月発行
定価104,500円（消費税込み）
住ベリサーチの調査研究レポート
住ベリサーチ株式会社
技術調査部〒140-0002 品川区東品川2-5-8
天王洲パークサイドビル16F
TEL 03-5462-7036
FAX 03-5462-7040

目

次
頁

第１章

は じ め に ································································································································· 1

第２章

受動部品・能動部品埋め込みプリント回路基板の概要(要約) ·························· 3

第３章

キャパシタ埋め込み回路基板 ························································································· 10

３.１

埋め込みキャパシタの必要特性 ··························································································· 10

３.２

埋め込みキャパシタ用誘電体材料 ······················································································ 14

３.２.１

薄膜キャパシタ用材料 ·········································································································· 18

３.２.１Ａ

誘電体薄膜·························································································································· 18(1)

酸化タンタル(Ta2O3)············································································································· 19(2)

BST(BaSrTiO3) ······················································································································· 20(3)チタン酸ストロンチウムSrTiO3(STO) ················································································ 21(4)チタン酸ジルコン酸ランタン鉛PbLa(Zr, Ti)O3(PLZT) ···················································· 21

３.２.１Ｂ

誘電体薄膜の改良 ·············································································································· 22(1)

温度係数の改善 ······················································································································ 22(2)リーク電流及び電圧制御性(tunability)の改善 ···································································· 24(3)薄膜形成の低温化 ·················································································································· 27(4)

経時変化の改善 ······················································································································ 28(5)電極の影響······························································································································ 29

３.２.２

セラミック厚膜キャパシタ ·································································································· 31

３.２.２Ａ

強誘電性厚膜を用いた埋め込みキャパシタ ··································································· 32(1)

デユポンの“InterraTM”Ceramic··························································································· 32(2)エアロゾルデポジション法(AD法) ····················································································· 33

３.２.２Ｂ

セラミックチップキャパシタ ·························································································· 36(1)誘電体材料の改良 ·················································································································· 36(2)

サイズ効果(Size Effect)········································································································· 41(3)

BaTiO3の物理的特性 ·············································································································· 43(4)多層セラミックキャパシタ(MLCC)における残留応力 ···················································· 44

３.２.３

ポリマーフィルムまたはシート(フィラーなしフィルム) ··············································· 46

３.２.３Ａ

エポキシ樹脂(FR-4、FR-5)····························································································· 47(1)

サンミナ社の製品 ·················································································································· 47(2)オーク三井テクノロジーズ··································································································· 49(3)シーメンス社における検討··································································································· 52(4)ヒューレットパッカードにおける検討 ··············································································· 54(5)耐熱性エポキシ樹脂(FR-5) ·································································································· 55－i－３.２.３Ｂ

ポリイミド樹脂 ·················································································································· 56

３.２.４

セラミック－ポリマーナノコンポジット(フィラー充填フィルム)································ 57

３.２.４Ａ

ナノコンポジットの設計理論式······················································································· 58(1)

Nielsenの複合則······················································································································ 58(2)

Jayasundere and Smithの式······································································································ 58(3)対数混合則······························································································································ 59(4)

パーコレーション理論 ·········································································································· 59

３.２.４Ｂ

ナノコンポジット製品の研究開発··················································································· 59(1)オーク三井テクノロジーズの製品······················································································· 59(2)3Mにおける開発····················································································································· 61(3)

ヴァンチコ社、モトローラ社の開発 ··················································································· 63(4)ポリクラッド社の製品 ·········································································································· 65(5)デュポンにおける開発 ·········································································································· 65(6)日立化成工業 ·························································································································· 66(7)Isola社 ······································································································································ 69

３.２.４Ｃ

その他のメーカー及び研究機関における開発研究 ······················································· 70(1)松下電工·································································································································· 70(2)住友金属エレクトロデバイスの開発研究 ··········································································· 72(3)

東レにおける開発 ·················································································································· 72(4)日本ペイント ·························································································································· 74(5)TDKのハイブリットプロセス ······························································································ 75(6)KAISTにおける開発研究······································································································· 76(7)東京工業大学と日立製作所の研究開発 ··············································································· 78

３.２.４Ｄ

セラミック－ポリマーコンポジット材料の改良研究 ··················································· 78(1)

マトリックス樹脂に関する研究··························································································· 78(2)硬化触媒の検討 ······················································································································ 80(3)母材樹脂による誘電特性の相違··························································································· 82(4)分散剤の検討 ·························································································································· 82(5)フィラー混合法の検討 ·········································································································· 84

３.２.４Ｅ

導体・半導体－ポリマーコンポジット··········································································· 85

３.２.４Ｆ

セラミック－ポリマーコンポジットキャパシタに関する特許···································· 89

３.３

キャパシタ埋め込みプリント回路基板の製法と特性評価············································ 92

３.３.１

チップキャパシタ埋め込み回路基板の製法 ······································································· 92(1)SIMPACT方式(松下) ············································································································· 93(2)B2it方式···································································································································· 94

３.３.２

薄膜キャパシタ埋め込み回路基板の製法··········································································· 96(1)

陽極酸化Taを用いた半導体パッケージ(新光電気工業)···················································· 96

－ii－

(2)

部品内蔵多層シートデバイス(松下電気産業) ··································································· 98

３.３.３

厚膜キャパシタ埋め込みプリント回路基板の製法 ··························································· 99(1)デュポンのペースト焼成法··································································································· 99(2)エアロゾル蒸着による埋め込み法····················································································· 101(3)

B2it工法による誘電体ペーストキャパシタの埋め込み法 ··············································· 102(4)モトローラ社における製法································································································· 102

３.３.４

フィルムキャパシタ埋め込み回路基板の製法 ································································· 102(1)

サンミナ社、オーク三井テクノロジーズの方法 ····························································· 102(2)三菱電機のキャパシタ埋め込み法····················································································· 105

３.３.５

セラミック樹脂コンポジットキャパシタ埋め込み回路基板の製法······························ 107(1)

日立化成工業の製造法 ········································································································ 107(2)

松下電工の製法 ···················································································································· 108(3)デュポンの製造技術 ············································································································ 109(4)オーク三井テクノロジーズの製法····················································································· 110(5)日本ペイントの製法 ············································································································ 111(6)住友金属エレクトロデバイスの製法(評価用基板) ························································· 111(7)

メザニンキャパシタ(モトローラ)····················································································· 112(8)

B2itTMによる製造プロセス ·································································································· 113

第４章

抵抗体埋め込みプリント回路基板 ·············································································· 114

４.１

埋め込み抵抗体の必要性 ······································································································ 114

４.２

埋め込み抵抗体材料 ·············································································································· 115(1)

抵抗値の設計···························································································································· 115(2)

抵抗温度係数(TCR) ················································································································ 116４.２.１

薄膜抵抗································································································································ 116(1)

Ohmega-ply® ························································································································· 116(2)

Mac Dermid M-PassTM ··········································································································· 117(3)

Shipley InsiteTM ······················································································································ 118(4)

Gould TCR®・TCR+TM ·········································································································· 119４.２.２

厚膜抵抗································································································································ 120(1)

デュポンInterraTM Ceramic ··································································································· 120(2)

アサヒ化学研究所の材料 ···································································································· 122(3)武蔵工業大学の材料 ············································································································ 123

４.２.３

埋め込み抵抗体に関する特許 ···························································································· 124

４.３

プリント回路基板への抵抗体の埋め込みプロセス ······················································ 126

４.３.１

チップ抵抗埋め込みプロセス ···························································································· 126

－iii－

(1)

B2it構成·································································································································· 126(2)

SIMPACTによる埋め込み···································································································· 126

４.３.２

薄膜抵抗部品の埋め込みプロセス····················································································· 126(1)

グールドエレクトロニクスのプロセス ············································································· 126(2)

オメガプライテクノロジーズのプロセス ········································································· 128(3)

シプレーのInsiteプロセス···································································································· 129４.３.３

厚膜抵抗体埋め込みプロセス ···························································································· 130(1)デュポンのプロセス(厚膜焼成抵抗)················································································· 130(2)

モトローラのプロセス(ポリマー抵抗プロセス) ····························································· 132(3)

B2it法 ····································································································································· 134

４.３.４

トリミング技術···················································································································· 135

第５章

インダクタ埋め込みプリント回路基板 ···································································· 137

５.１

埋め込みインダクタの必要特性 ························································································· 137

５.１.１

埋め込みインダクタの種類及び性能················································································· 137(1)

インダクタの種類 ················································································································ 137(2)

Qファクター ························································································································· 138

５.２

インダクタ材料 ······················································································································· 140５.２.１

導体材料································································································································ 140(1)

銅箔········································································································································ 140(2)導電性インク材料 ················································································································ 142

５.２.２

平面インダクタ用基板及び封止材料················································································· 144(1)

低ロス基板···························································································································· 144(2)インダクタ封止材料 ············································································································ 144

５.２.３

埋め込みインダクタに関する特許····················································································· 146

５.３

インダクタ埋め込み回路基板の製法 ················································································ 149

５.３.１

Cu回路を用いた方法 ··········································································································· 149(1)

日立化成工業の方法 ············································································································ 149(2)三菱電機の方法 ···················································································································· 149(3)

TDKの方法···························································································································· 150(4)カシオ計算機の方法 ············································································································ 150

５.３.２

導電性ペーストを用いた方法 ···························································································· 151(1)

B2it法 ····································································································································· 151(2)

モトローラの適用例 ············································································································ 151

－iv－

第６章

受動部品埋め込みプリント回路基板の設計(熱システム及びコスト) ········ 152

６.１

受動部品埋め込み基板の熱設計 ························································································· 152

６.１.１

熱設計におけるデザインルール ························································································ 152

６.１.２

熱機械疲労の検討 ················································································································ 155

６.２

受動部品埋め込み基板のシステム設計 ············································································ 158

６.２.１

日本CMKのシステム ··········································································································· 158

６.２.２

ITRI(台湾)のシステム········································································································· 160

６.３

コスト設計 ······························································································································· 163

６.３.１

コストモデル例···················································································································· 163

６.３.２

オメガプライテクノロジーにおけるコスト分析 ····························································· 165

６.３.３

グールドにおけるコスト分析 ···························································································· 166

６.３.４

ライフサイクルコスト ········································································································ 166(1)

デザインコスト ···················································································································· 166(2)

設備投資など ························································································································ 167(3)

納期関連コスト ···················································································································· 167(4)

認定費用など ························································································································ 167(5)

製造責任関連コスト ············································································································ 167

第７章

受動部品埋め込みプリント回路基板の応用例 ······················································ 168

７.１

デカップリングキャパシタ ································································································· 168(1)

ヒューレットパッカード社の検討例····················································································· 169(2)松下電器産業の検討例 ············································································································ 170(3)電源ノイズ低減へのスルーホールの影響(IMEC-Chent大学)············································· 172

７.２

携帯電話機 ······························································································································· 174(1)

モトローラにおける適用例 ···································································································· 174

７.３

RF(Radio Frequency)フィルタ ························································································· 176(1)

東芝における検討例 ················································································································ 176

７.４

ターミネーション(インピーダンスマッチング) ··························································· 178(1)

反応性ターミネーション ········································································································ 178(2)

LANにおけるクロストークの低減························································································· 180

７.５

その他の応用検討 ·················································································································· 182(1)

指紋認識モジュール ················································································································ 182

－v－

(2)

その他WLANモジュールなど································································································· 182

７.６

埋め込み受動部品応用製品に関する特許········································································ 183(1)

チップ部品埋め込みプリント回路基板関係 ········································································· 183(2)

フィルム状・膜状キャパシタ埋め込みプリント配線基板関係·········································· 188

第８章

能動素子埋め込みプリント回路基板 ········································································· 196

８.１

能動素子埋め込み回路基板の必要性 ················································································ 196

８.２

各社の能動部品基板埋め込み方式 ···················································································· 198(1)

STD-V方式(GE-東芝)·············································································································· 198(2)

SIMPACTTM(松下電器産業)···································································································· 199(3)

B2itTM、BossB2itTM実装技術(DTCT)(ウエイスティー) ······················································· 202(4)極薄チップ内蔵技術(新光電気工業)····················································································· 202(5)

JSP(Jet Pointing System)によるチップ埋め込み(デンソー)················································ 204(6)

EWLP(Embedded Wafer Level CSP)(カシオ計算機、日本シイエムケイ) ························· 206(7)

Fraunhofer IZM(ドイツ)の技術 ······························································································ 208(8)

AIST法(ソニー) ······················································································································· 209(9)

FSBC法(Satakunta Polytechnic) ······························································································· 211

８.３

能動素子(ICチップ)埋め込みプリント回路基板関係特許 ········································· 213(1)

ICチップ埋め込みプリント回路基板····················································································· 213(2)モジュール埋め込みプリント回路基板関係 ········································································· 217

第９章

市場関係 ································································································································· 220

９.１

受動部品埋め込み基板の市場 ····························································································· 220

９.２

能動部品埋め込み基板(AED)の市場 ················································································ 224

第１０章

今後の課題と展望 ············································································································· 225

略

表 ··············································································································································· 228語

参 考 文 献 ··············································································································································· 230－vi－