ギガヘルツ対応

モバイル通信機器用材料― 次世代移動体通信システムへの応用の実態 ―2004年10月発行
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住ベリサーチの調査研究レポート
住ベリサーチ株式会社
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目

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頁
第１章 緒

言 ···················································································· 1

第２章 高周波材料技術の最新動向 ·································································· 2
第３章 高周波用半導体及びその実装技術 ·························································· 6３．１． 高周波半導体デバイス ······································································· 8
３．１．１． 化合物半導体デバイス ·································································· 8
３．１．２． ポリイミド系キャリアテープを用いた携帯電話用半導体パッケージ ··················· 9３．１．３． 異方導電性複層フィルムを用いた携帯電話用半導体パッケージ ······················· 11
３．１．４． 異方導電性フィルムを用いるフリップチップ実装技術 ································ 12
３．１．５． 極薄型半導体パッケージのフィルムアシスト樹脂封止成形···························· 13

３．２． 高周波半導体実装技術に用いる有機・無機材料··········································· 14
３．２．１． マイクロ波集積回路に用いられる各種の伝送線路 ····································· 14
３．２．２． 液状エポキシ埋め込み樹脂を用いる高周波 MCM 実装技術 ···························· 15
３．２．３． セラミック／ポリイミド多層基板を用いる 3 次元 MCM 実装技術 ····················· 17
３．２．４． ベンゾシクロブテン樹脂を用いるフリップチップ実装技術···························· 18
３．２．５． テープインタポーザを用いる半導体パッケージ 3 次元実装技術 ······················· 19

３．３． モノリシックマイクロ波集積回路(MMIC)材料············································ 20
３．３．１． エポキシ樹脂封止技術を適用した高周波用半導体 MMIC ······························ 20
３．３．２． テフロン基板への直接フリップチップ実装を適用した MMIC·························· 21
３．３．３． STO 誘電体薄膜キャパシタを搭載した MMIC ········································· 22
３．３．４． 積層ポリイミド薄膜を用いた 3 次元 MMIC ············································ 22
３．３．５． 感光性ベンゾシクロブテン樹脂薄膜を用いた 3 次元 MMIC ダウンコンバータ ········ 23
３．３．６． ベンゾシクロブテン樹脂薄膜を用いた低損失フィルタ内臓 MMIC ···················· 24
３．３．７． 感光性ポリベンゾオキサゾールを用いたスパイラルインダクタ内臓 MMIC ··········· 24

３．４． ポリベンゾオキサゾール層間絶縁膜を積層したミリ波コプレーナ伝送線路 ············· 26
３．５． まとめ ······················································································ 27
３．６． 関連特許····················································································· 28
参考文献 ····························································································· 30－i－第４章 高周波用受動部品及びその実装技術 ······················································· 31
４．１． セラミック及び高分子材料を用いた小型高周波アンテナ ································· 32
４．１．１． 高誘電率セラミックを用いた携帯電話用小型アンテナ ································ 32
４．１．２． 表面実装に対応した ETC 用小型セラミックアンテナ·································· 33
４．１．３． 高誘電率セラミックを用いたブルートゥース用フィルタ内蔵アンテナ ················ 34
４．１．４． 多層セラミック／ポリイミド基板を用いたアクティブアンテナ ······················· 35
４．１．５． テフロン／セラミック／ポリイミド多層基板を用いた
2 周波数共用アンテナアレー ·························································· 36
４．１．６． アルミナ／テフロン積層スラブガイドを用いた漏れ波アンテナ ······················· 37

４．２． 高周波共振器に用いる高誘電率セラミックス ············································· 38
４．２．１． 誘電体共振器材料のマイクロ波誘電特性 ·············································· 38
４．２．２． 誘電体セラミックスを用いたアンテナ共用器·········································· 38

４．３． 低温同時焼成セラミック(LTCC)を用いた高周波モジュール実装技術 ··················· 39
４．３．１． 高周波モジュール用 LTCC に要求される基板特性 ····································· 39
４．３．２． 異なるセラミックスを組み込んだ 3 次元多層 LTCC モジュール ······················· 40
４．３．３． セラミック多層基板を用いた小型 RF ダイオードスイッチ ···························· 41
４．３．４． LTCC 基板を用いた通信用マルチチップモジュール ··································· 42
４．３．５． 高誘電率 LTCC 基板を用いたブルートゥースモジュール ······························ 43
４．３．６． LTCC 多層デバイスの製造プロセス ···················································· 43
４．３．７． LTCC 基板を用いた携帯電話用多層デバイス ·········································· 44
４．３．７．１． 低誘電率セラミックスを用いた積層アンテナスイッチフィルタ················· 44
４．３．７．２． セラミック多層アンテナスイッチデュプレクサ ································· 44
４．３．７．３． 誘電体積層アンテナスイッチモジュール ········································ 45
４．３．７．４． セラミック多層基板を用いた受信フロントエンドデバイス ····················· 46
４．３．７．５． セラミック積層型帯域阻止フィルタ ············································· 46

４．４． 無機圧電材料を用いた高周波用フィルタ及びデュプレクサ ······························ 47
４．４．１． 表面弾性波(SAW)フィルタの原理 ····················································· 48
４．４．２． 酸化亜鉛薄膜を用いた高周波 SAW フィルタ ·········································· 48
４．４．３． 強誘電性単結晶を用いた RF 帯 SAW フィルタ········································· 49
４．４．４． 新材料を用いた SAW フィルタ ························································ 49
４．４．５． Al-Cu/Cu/Al-Cu 多層電極膜を用いた SAW アンテナデュプレクサ ······················ 50
４．４．６． 金属／窒化アルミ／金属積層膜を用いた FBAR 共振器 ································ 51
４．４．７． PbTiO3 圧電薄膜を用いたバルク超音波フィルタ ······································· 52－ii－

４．５． セラミックスを用いた携帯電話用発振器 ····················································· 53
４．６． フォトニック結晶のミリ波アンテナ等への応用 ·············································· 53
４．６．１． フォトニック結晶による電磁波制御の原理 ············································ 53
４．６．２． 光造形法によるフォトニック結晶の作製 ·············································· 54
４．６．３． チタニア系粒子／エポキシ樹脂複合材料を用いた 3 次元フォトニック結晶 ··········· 54
４．６．４． フォトニック結晶を応用した電磁波デバイス·········································· 56

４．７． 高周波コンデンサ・キャパシタ材料 ·························································· 57
４．７．１． 高誘電率セラミックを用いた小型高容量積層コンデンサ ······························ 57
４．７．２． BST 薄膜を用いたデカップリングコンデンサ ········································· 58
４．７．３． 誘電体セラミックス／ニッケル電極積層デカップリングコンデンサ ·················· 59

４．８． 高周波インダクタへの有機・無機材料の応用 ················································ 60
４．８．１． ベンゾシクロブテン樹脂を用いた薄膜インダクタ ····································· 60
４．８．２． フェライト／低誘電率セラミックを用いた積層チップインダクタ ···················· 61
４．８．３． 強磁性薄膜を用いた高周波集積化インダクタ·········································· 62
４．８．４． アモルファス軟磁性薄膜を用いた高周波インダクタ··································· 63
４．８．5． 低温焼成セラミックの高周波多層チップインダクタへの応用·························· 65

４．９． 磁性体と誘電体とを組み合わせた高周波伝送線路デバイス·································· 66
４．９．１． フェライト粒子／ポリイミド複合材料膜を用いた伝送線路···························· 66
４．９．２． 金属磁性膜／ポリイミド膜積層ハイブリッド伝送線路 ································ 67
４．９．３． アモルファス軟磁性膜／ポリイミド膜積層ハイブリッド伝送線路 ···················· 67

４．10． まとめ·························································································· 69
４．11． 関連特許 ······················································································· 71
参考文献 ····························································································· 77

第５章 高周波配線基板材料 ········································································· 79
５．１． 受動部品内蔵基板技術 ······································································ 79
５．１．１． 無機フィラー／樹脂コンポジットを用いた高密度部品内蔵基板技術 ·················· 79
５．１．２． セラミック／樹脂ハイブリッドを用いた積層パワーアンプモジュール ················ 80
５．１．３． 樹脂基板を用いた受動部品内蔵技術 ··················································· 81
５．１．４． 焼成タイプ厚膜抵抗ペーストを用いた受動部品内蔵基板 ······························ 81
５．１．５． 受動部品内蔵基板に用いる低温硬化タイプ厚膜高分子材料···························· 82－iii－

５．１．６． スパッタ法を用いた受動部品内蔵基板用抵抗層付き銅箔 ······························ 83
５．１．７． CCVD プロセスを用いた受動部品内蔵基板用抵抗層付き銅箔 ························· 84
５．１．８． 高誘電率フィラー充填エポキシ樹脂を用いたキャパシタ内蔵基板 ···················· 85
５．１．９． レジスト材料／エポキシ樹脂を用いたインダクタ内蔵基板···························· 85
５．１．10． 耐熱性 PETG フィルムを用いた部品内蔵フレキモジュール ··························· 86

５．２． 高周波対応ビルトアップ配線基板材料 ···················································· 88
５．２．１． 熱硬化性樹脂アロイ材料 ······························································· 89
５．２．２． ハロゲンフリーエポキシ樹脂絶縁材料················································· 90
５．２．３． 低誘電率樹脂付き銅箔を用いたビルドアップ配線板の製造方法 ······················· 91
５．２．４． エポキシ樹脂層間絶縁材料 ···························································· 91
５．２．５． 導電性ビアプラグペースト ···························································· 92
５．２．６． アラミド繊維／エポキシ樹脂基材 ····················································· 92
５．２．７． ベンゾシクロブテン樹脂付き銅箔 ····················································· 93
５．２．８． 熱硬化型 PPE 樹脂付き銅箔 ··························································· 95
５．２．９． 不織布基材 BT 樹脂プリプレグ ························································ 96
５．２．10． レーザ加工性の優れたビルトアップ配線用ガラス布基材エポキシ樹脂基板材料······· 96

５．３． 高周波用プリント配線板材料 ······························································ 98
５．３．１． 熱硬化性多官能スチレン系樹脂絶縁材料 ·············································· 98
５．３．２． バルーン／ジシクロペンタジエン樹脂複合材料 ······································· 99
５．３．３． 熱硬化性ポリフェニレンエーテル銅張積層板········································· 100
５．３．４． 変性熱硬化性樹脂基板材料 ··························································· 100
５．３．５． 芳香族ポリエステル系液晶ポリマー ·················································· 101

５．４． 高周波用多層プリント配線板の製造技術 ················································· 102
５．４．１． 樹脂基板の一括プレス多層化プロセス················································ 102
５．４．２． 任意の層間にビアホールを形成できる基板技術 ······································ 103

５．５． 高周波対応フレキシブルプリント配線板材料 ············································ 104
５．５．１． フレキシブル／リジッド多層プリント配線板········································· 104
５．５．２． 無接着剤型ポリイミドフレキシブル板を用いたフリップチップ実装 ················· 104
５．５．３． 芳香族ポリエステル系液晶ポリマーフィルム········································· 105
５．５．４． フレキシブルプリント配線に用いる感光性カバーレイフィルム ······················ 108

５．６． 高周波プリント基板に用いる極薄銅箔 ··················································· 110
５．６．１． 高周波対応の銅箔技術 ································································ 110
５．６．２． 極薄銅箔を使った新しい工法 ························································· 110－iv－

５．７． まとめ ····················································································· 112
５．８． 関連特許···················································································· 114
参考文献 ···························································································· 116

第６章 高周波電磁波シールド・吸収材料 ························································ 118
６．１． 電磁波シールド技術の基礎 ································································ 118
６．２． 電磁干渉抑制に用いる樹脂複合材料 ······················································ 120
６．２．１． カーボン／シリコーンゴム複合材料を用いた電波吸収体 ····························· 120
６．２．２． カーボンマイクロコイル／シリコーンゴム複合材料を用いた電波吸収体 ············ 121
６．２．３． 電磁波ノイズ対策に用いる酸化亜鉛／炭素繊維／熱可塑性樹脂複合成形材料 ········ 121
６．２．４． 電磁波ノイズ対策に用いるフェライト／エポキシ樹脂複合成形材料 ················· 122
６．２．５． サマリウム－鉄系化合物／エポキシ樹脂複合材料を用いた電波吸収体 ··············· 123
６．２．６． 希土類磁石化合物／エポキシ樹脂複合材料を用いた電波吸収体 ······················ 124
６．２．７． アルミ粉末／エポキシ樹脂複合材料を用いた電波吸収体 ····························· 125

６．３． 電磁干渉抑制に用いる高分子複合材料シート ············································ 126
６．３．１． カルボニル鉄／溶融シリカ／
アクリル系樹脂複合材料を用いた電波吸収体シート ································· 126
６．３．２． カルボニル鉄粒子／ポリシロキサン複合材料を用いた電波吸収体シート ············ 127
６．３．３． 電磁干渉抑制に用いる偏平状 Fe-Si-Al 合金粉末／高分子複合シート ················· 127
６．３．４． 熱伝導性を向上させた電磁干渉抑制体シート ········································ 129
６．３．５． 偏平化磁性金属粉／ゴム複合材料を用いた柔軟性の高い電波吸収シート ············ 130
６．３．６． SiC 系繊維／熱可塑性ポリイミド複合材料を用いた電磁干渉抑制体シート ·········· 131

６．４． 建物の電磁波シールド対策に用いる炭素繊維織物 ······································· 132
６．５． 透明性電磁波シールド材料 ································································ 132
６．５．１． アンテナパターン付きポリエステルフィルムを用いた電磁波シールド材料 ·········· 132
６．５．２． 電磁波シールド対策に用いる透明導電性プラスチックシート ························ 133
６．５．３． ITO 抵抗被膜を用いた透明電波吸収体 ················································ 134

６．６． リサイクル材料を利用した電波吸収体 ··················································· 136
６．６．１． 研削スラッジ／クロロプレンゴム複合材料を用いた電波吸収体 ······················ 136
６．６．２． ポリエステル繊維多孔質体を用いた電波吸収ボード ································· 136

６．７． 携帯電話に用いる電磁干渉抑制材料 ······················································ 138
６．７．１． 電磁ノイズ抑制に用いる磁性体粉末／熱硬化性樹脂弾性体シート ··················· 138－v－

６．７．２． 半導体素子内部でのノイズ抑制に用いるナノグラニュラ磁性体薄膜 ················· 139
６．７．３． 偏平磁性粉／エラストマ複合材料を用いた電磁ノイズ抑制体シート ················· 140
６．７．４． 軟磁性フェライト／アクリル樹脂系磁性塗料による漏洩電磁波の抑制 ··············· 140
６．７．５． 偏平磁性粒子／塩素化ポリエチレン複合材料を用いた電波吸収体シート ············ 142

６．８． ミリ波電波吸収体 ·········································································· 143
６．８．１． ミリ波電波吸収体の技術動向 ························································· 143
６．８．２． カーボンブラック／ポリエチレン複合材料を用いたミリ波電波吸収体 ··············· 143
６．８．３． ITO 抵抗被膜を用いたミリ波透明電波吸収体 ········································· 144

６．９． 高度道路交通システムに用いる電波吸収体··············································· 145
６．９．１． 炭素粒子／エポキシ変成ウレタンゴム複合材料を用いた電波吸収体 ················· 145
６．９．２． 酸化チタン／炭素粒子／エポキシ樹脂複合材料による塗布型電波吸収体 ············ 146
６．９．３． 道路標識からの乱反射防止に用いる λ／4 型透明電波吸収体 ························· 147
６．９．４． 磁性損失材／プラスチック複合材料を用いた電波吸収体シート ······················ 148
６．９．５． フェライト／ポリオレフィン複合材料を用いた電波吸収体シート ··················· 149
６．９．６． カーボン含有発泡ポリエチレンを用いた電波吸収パネル ···························· 150
６．９．７． フェライト／シラスバルーン複合材料を用いた不燃性電波吸収体 ··················· 150
６．９．８． フェライト／エポキシ樹脂モルタルを用いた電磁波吸収薄層舗装 ··················· 151

６．10． まとめ ····················································································· 152
６．11． 関連特許 ··················································································· 154
参考文献 ···························································································· 158

第７章 高周波用材料の評価技術 ··································································· 160
７．１． マイクロ波・ミリ波帯における誘電特性の評価技術····································· 160
７．１．１． 空胴共振器摂動法による熱可塑性樹脂材料の複素誘電率測定 ························ 161
７．１．２． 空胴共振器摂動法によるポリエチレンの複素誘電率測定 ····························· 162
７．１．３． WG モード誘電体共振器法による低誘電率高分子材料の複素誘電率測定············· 164
７．１．４． WG モード誘電体共振器法による高誘電率セラミック材料の複素誘電率測定 ········ 166
７．１．５． トリプレート線路共振器法による GHz 帯域における材料定数の測定 ················ 166
７．１．６． マイクロ波・ミリ波帯域における高分子材料の複素誘電率・複素透磁率測定 ········ 167
７．１．７． 同軸線路法による液晶材料のマイクロ波帯域複素誘電率測定 ························ 168
７．１．８． 遮断円筒導波管法によるミリ波複素誘電率の測定 ···································· 169
７．１．９． 自由空間透過法による石膏ボードの複素比誘電率の測定 ····························· 170
７．１．10． 自由空間法によるカーボン含有ポリエチレンの複素比誘電率測定···················· 171－vi－

７．２． マイクロ波帯・ミリ波帯における電磁波シールド特性の評価技術 ······················ 172
７．２．１． 同軸管法による材料の電磁波吸収特性の測定········································· 172
７．２．２． ホーンアンテナと導波管によるカーボンナノチューブ複合材料の電波遮蔽特性測定·································· 173
７．２．３． 箱型自由空間法によるマイクロ波帯電磁波反射損失の測定··························· 174

７．３． 広帯域電波暗箱による携帯機器端末から放射される輻射電力の測定 ··················· 176
７．４． 電波暗室用電波吸収体 ····································································· 177
７．４．１． 炭素繊維強化ポリマーセメントモルタルを用いた電波吸収体 ························ 177
７．４．２． フェライト／ポリプロピレン複合材料を用いたピラミッド型電波吸収体 ············ 178

７．５． まとめ ····················································································· 179
参考文献 ···························································································· 180

第８章 携帯電話部品材料··········································································· 181
８．１． 携帯電話用コンデンサ材料 ································································ 181
８．１．１． 導電性高分子を用いた電解コンデンサ················································ 181
８．１．２． ポリピロールを用いたチップ型アルミ電解コンデンサ ······························· 182
８．１．３． ポリエチレンジオキシチオフェンを用いたアルミ電解コンデンサ ··················· 183
８．１．４． ポリピロールを用いたチップ型タンタル電解コンデンサ ····························· 184
８．１．５． 導電性高分子を用いた電気二重層コンデンサ········································· 185
８．１．６． 電気二重層コンデンサに用いる活性炭／カーボン／PTFE 複合材料シート ··········· 186

８．２． 携帯電話用リチウム系二次電池材料 ······················································ 187
８．２．１． 円筒型リチウムイオン二次電池に用いられる材料 ···································· 187
８．２．２． 新電解質を用いた薄型リチウムイオン二次電池 ······································ 188
８．２．３． 多孔質高分子ゲルセパレータを用いたリチウムイオンポリマー電池 ················· 188
８．２．４． 内部抵抗を低減した高性能リチウムイオンポリマー電池 ····························· 189
８．２．５． 電池内重合方式による完全ゲル型リチウムポリマー電池 ····························· 190
８．２．６． ジチアゾリウム環ベンゼン環共重合体を用いた高容量リチウムポリマー電池 ········ 191
８．２．７． アクリル樹脂／オキセタン系化合物共重合体を用いたゲル型リチウムポリマー電池 ·························································· 191
８．２．８． 円盤状ナノカーボンを用いたリチウムイオン二次電池 ································ 192
８．２．９． リチウムイオン二次電池用セパレータに用いるポリエチレン微多孔性フィルム ······ 192
８．２．10． リチウムポリマー電池の今後の課題 ··················································· 193－vii－

８．３． 小型燃料電池に用いられる材料 ··························································· 194
８．３．１． 新電極材料を用いた高性能直接メタノール型燃料電池 ······························· 195
８．３．２． 固体高分子電解質を用いた直接メタノール型燃料電池 ······························· 195
８．３．３． カーボンナノホーンを用いた直接メタノール型燃料電池 ····························· 197
８．３．４． マイクロ燃料電池用メタノール不透過性電解質 ······································ 198

８．４． 携帯電話用音響振動部品材料 ····························································· 199
８．４．１． エレクトレットコンデンサを用いた超小型マイクロホン ····························· 199
８．４．２． スピーカとバイブレータの機能を一体化したバイブサウンダ ························ 200

８．５． 携帯電話筺体用材料 ······································································· 201
８．５．１． 携帯電話筺体用材料の開発状況 ······················································· 201
８．５．２． チクソ成形法を応用した携帯電話用マグネシウム筺体 ······························· 201
８．５．３． 携帯電話筺体に用いる室温加工性の優れたマグネシウム合金 ························ 202
８．５．４． 携帯電話用両面粘着テープ ··························································· 202

８．６． まとめ ····················································································· 204
８．７． 関連特許···················································································· 206
参考文献 ···························································································· 210

第９章 移動体通信システムで用いるその他の高周波材料 ······································ 211
９．１． 衛星通信用アンテナ材料 ·································································· 211
９．１．１． フッ素樹脂を用いた誘電体ラジアルラインアンテナ·································· 211
９．１．２． FRP／発泡プラスチック積層体を用いたマイクロ波・ミリ波共用レードーム板······ 211
９．１．３． メッシュ状 KFRP シートを用いた衛星搭載用展張方式超軽量アンテナ··············· 212
９．１．４． 三軸織物を用いた衛星搭載用パラボラアンテナリフレクタ··························· 213

９．２． マイクロ波・ミリ波用高温超伝導フィルタ材料·········································· 214
９．２．１． マイクロ波・ミリ波高温超電導デバイス ············································· 214
９．２．２． YBCO 薄膜を用いた超伝導フィルタ ·················································· 215
９．２．３． TFA-MOD 法による高温超電導フィルタ用 YBCO 薄膜································ 215
９．２．４． YBCO 薄膜を用いた高温超伝導フィルタサブシステム ······························· 216
９．２．５． 酸化物高温超伝導体フィルタを用いた 2GHz 帯受信増幅装置 ························ 217
９．２．６． 酸素プラズマイオンビームスパッタ法による
YBCO 薄膜／強磁性体薄膜の作成 ···················································· 218

９．３． まとめ ····················································································· 219－viii－

９．４． 関連特許···················································································· 220
参考文献 ···························································································· 221

結略

び ···························································································· 222
語表 ···························································································· 224－ix－