NUMBER

TYPE

GS-12-1895

GENERAL
PRODUCT SPECIFICATION

TITLE

PAGE

REVISION

1 of 13

PwrBlade® ULTRA HD+ BTB Connector

AUTHORIZED BY

ZJ HE

A
DATE

7/18/2024

CLASSIFICATIONUNRESTRICTED

1.0

Objective
This specification defines the performance, test, quality, and reliability requirements of the PwrBlade®
ULTRA HD+ product.

2.0

Scope
This specification is applicable to the termination characteristics of the PwrBlade® ULTRA HD+ family of
products which provides separable right angle headers that mate to right angle receptacles.

3.0

Ratings
3.1

Operating Voltage Rating = Refer to section 6.6

3.2

Operating Current Rating = Refer to section 6.5

3.3

Operating Temperature Range = -40oC ~ 125oC 1
Operating temperature is tested in accordance with EIA-364-17 Method A for 504 hours at 125°C per
EIA-364-1000 Table 8 to meet field temperature of 95°C for 10 years field life (95°C field temperature
is based on the assumption that the contact spends 1/3 of its field life at that temperature and its
remaining life at 40°C or less).
Note 1: includes the terminal temperature rise when powered

4.0

Applicable Documents
4.1

AFCI Specifications
4.1.1 Engineering drawings: 10169891 & 10169892
4.1.2 Application specification: GS-20-0849

4.2 National or International Standards
4.2.1 Flammability: UL94V-0 or similar applicable specification
4.2.2 EIA 364: Electrical Connector/Socket Test Procedures Including Environmental Classifications.
4.2.3 J-STD-002: Solderability Tests for Component Leads, Terminations, Lugs, Terminals andWires.
4.3 AFCI Laboratory Reports - Supporting Data
DG-2024-02-005-CR© 2022 Amphenol Corporation
Form E-3701 – Revision F

GS-01-029

PDS: Rev :A

STATUS:ReleasedPrinted: Jul 25, 2024

NUMBER

TYPE

GS-12-1895

GENERAL
PRODUCT SPECIFICATION

TITLE

PAGE

REVISION

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4.4 Safety Agency Approvals
UL/CSA File #: E66906-Vol1-Sec222
5.0

Requirements
5.1 Qualification
Connectors furnished under this specification shall be capable of meeting the qualification test
requirements specified herein.
5.2 Material
The material for each component shall be as specified herein or equivalent.
High/Low Power Contacts – High Conductivity Copper Alloy
Signal Contacts – Copper Alloy
Housing Resin – Glass filled, halogen free polyamide or other high performance resin rated flame
retardant 94V-0 in accordance with UL-94.
Retention clip – Copper Alloy
5.3

FinishThe finish for applicable components shall be as specified herein or equivalent.
Standard PwrBlade® ULTRA HD+ contact plating refer to AFCI 10135186.

5.4

Design and Construction
Connectors shall be of the design, construction, and physical dimensions specified on the applicableproduct drawing. There shall be no cracks, burrs, or other physical defects that may impair
performance.

Figure 1: Header connector
Configuration shown: 10LP+36S+10HP© 2022 Amphenol Corporation
Form E-3701 – Revision F

GS-01-029

PDS: Rev :A

STATUS:ReleasedPrinted: Jul 25, 2024

NUMBER

TYPE

GS-12-1895

GENERAL
PRODUCT SPECIFICATION

TITLE

PAGE

REVISION

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Figure 1: Header connector
Configuration shown: 10LP+36S+10HP
5.5

WorkmanshipThis includes freedom from blistering, cracks, discoloration, etc.

5.6

Examination
Visual and dimensional inspection per product drawings, must meet requirements of product drawing
in accordance with EIA-364-18.

6.0

Electrical Characteristics
6.1 Contact Resistance, Low Level (LLCR)
The low level Signal Contact resistance shall not exceed 20 milliohms initially. The low level Signal
Contact resistance shall also not exceed 10 milliohms increase in resistance (from the initial
measurement) after any treatment and/or environmental exposure.
The low level High Power Contact resistance shall not exceed 0.3 milliohms initially. The low level
High power Contact resistance shall also not exceed 0.6 milliohms after any treatment and/or
environmental exposure.
The low level Low Power Contact resistance shall not exceed 0.6 milliohms initially. The low level Highpower Contact resistance shall also not exceed 1.2 milliohms after any treatment and/or environmental
exposure.
Measurements shall be in accordance with EIA 364-23.
The following details shall apply:
a. Test Voltage - 20 milli-volts DC max open circuit.
b. Test Current - Not to exceed 100 milli-amperes.
6.2

Contact Resistance, Specified Current
The High Power Contact resistance at a specified current shall not exceed 0.3 milliohms initially.
The High Power Contact resistance at a specified current shall also not exceed 0.6 milliohms after any
treatment and/or environmental exposure.
The Low Power Contact resistance at a specified current shall not exceed 0.6 milliohms initially.
The Low Power Contact resistance at a specified current shall also not exceed 1.2 milliohms after any
treatment and/or environmental exposure.
Measurements shall be in accordance with EIA 364-06.

© 2022 Amphenol Corporation
Form E-3701 – Revision F

GS-01-029

PDS: Rev :A

STATUS:ReleasedPrinted: Jul 25, 2024

NUMBER

TYPE

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PRODUCT SPECIFICATION

GS-12-1895
TITLE

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The following details shall apply:
a. Test Current – Shown in table 1a.
6.3

Insulation Resistance
The Power Contacts insulation resistance of mated connectors shall not be less than 1,000 megohms
initially and 1,000 megohms after environmental exposure.
The Signal Contacts insulation resistance of mated connectors shall not be less than 500 megohms
initially and 500 megohms after environmental exposure.
Measurements shall be in accordance with EIA 364-21.
The following details shall apply:
a. Test Voltage - 500 volts DC.
b. Electrification Time - 2 minutes, unless otherwise specified.
c. Points of Measurement - Between adjacent Contacts.

6.4

Dielectric Withstanding Voltage
There shall be no evidence of arc-over, insulation breakdown, or excessive leakage current > 1
milliamperes when mated connectors are tested in accordance with EIA 364-20.
The following details shall apply:
a. Test Voltage – 1000 volts DC for Signal Contacts.
b. Test Voltage – 2500 volts DC for High/Low Power Contacts.
b. Test Duration - 60 seconds.
c. Test Condition – 1（760 Torr - sea level）.
d. Points of Measurement - Between adjacent Contacts.

6.5 Current Rating
The temperature rise above ambient shall not exceed 30 deg C at any point in the system when allcontacts are powered at specified amperes in Table 1a.
The following details shall apply:
a. Ambient Conditions – Still air at 25oC
b. Stabilize at a single current level until 3 readings at 5 minute intervals are within 1oC.
c. Reference - EIA 364-70, method 1.
Table 1a: Rated current table (amperes)
Type
High
Power
Low
Contact
Power
Contact

Pitch
(mm)
5.00
3.50

SingleContact
140
90

2 adjacentContacts
110
75

4 adjacentContacts
100
65

6 adjacentContacts
90
60

8 adjacentContacts
85
55

10 adjacentContacts
80
50© 2022 Amphenol Corporation
Form E-3701 – Revision F

GS-01-029

PDS: Rev :A

STATUS:ReleasedPrinted: Jul 25, 2024

NUMBER

TYPE

GENERAL
PRODUCT SPECIFICATION

GS-12-1895
TITLE

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Types
Signal Contact

Pitch
(mm)
2.00

SingleContact
3

36 adjacentContacts
1

Note：Connectors are applied to test boards with 10 layers x 2 ounces copper for power contact
and 2 layers x 2 ounces copper for signal contact.
The 2layers x 2 ounces copper for signal contact is mixed with Top & Bottom layers of Power
contact
6.6 Voltage Rating
The voltage ratings are based on the Minimum Creepage Distances when the connector is installed in
the pc board. It’s related to the real application.
Table 2a for Press-fit or wave soldering application, MCD for power contacts determined usingØ1.02mm finished hole with 0.24mm annular ring (nominal). Resulting in a Ø1.50mm Pad (nominal).
MCD for signal contacts determined using Ø0.75mm finished hole with 0.25mm annular ring (nominal).
Resulting in a Ø1.25mm Pad (nominal).
Table 2a: Voltage rating table
Table 2

PwrBlade® ULTRA HD+ Maximum Working Voltage Vs. Minimum Creep Distance(Reference UL 60950-1 Second Edition Table 2N)

Type

Contact
Pitch(mm / inch)

Signal
High
Power
Low
Power
Signal
High
Power
Low
Power

MCD Of
PCB(mm)

Maximum
Working
Voltage(AC RMS)

0.75
1.74
1.92

38
242
271

Maximum
Working
Voltage(DC/AC
Peak)
54
342
383

3.50 [.138’’]

1.92

271

383

2.00 [.079’’]
5.00 [.197’’]
7.00 [.276’’]

0.75
1.74
1.92

35
174
192

49
246
271

1.92

192

271

2.00 [.079’’]
5.00 [.197’’]
7.00 [.276’’]

3.50 [.138’’]

Pollution
Degree(office
Environment)22Material
Group (Baseon UL
Rating)II

IIIb© 2022 Amphenol Corporation
Form E-3701 – Revision F

GS-01-029

PDS: Rev :A

STATUS:ReleasedPrinted: Jul 25, 2024

NUMBER

TYPE

GENERAL
PRODUCT SPECIFICATION

GS-12-1895
TITLE

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Table 3a for PIP application, MCD for power contacts determined using Ø1.15mm finished hole with
0.25mm annular ring (nominal). Resulting in a Ø1.65mm Pad (nominal). MCD for signal contacts
determined using Ø1.0mm finished hole with 0.25mm annular ring (nominal). Resulting in a Ø1.50mm
Pad (nominal).
Table 3a: Voltage rating table
Table 2

PwrBlade® ULTRA HD+ Maximum Working Voltage Vs. Minimum Creep Distance(Reference UL 60950-1 Second Edition Table 2N)

Type

Contact
Pitch(mm / inch)

Signal
High
Power
Low
Power
Signal
High
Power
Low
Power
7.0

MCD Of
PCB(mm)

Maximum
Working
Voltage(AC RMS)

0.50
1.59
1.77

25
223
246

Maximum
Working
Voltage(DC/AC
Peak)
35
315
347

3.50 [.138’’]

1.77

246

347

2.00 [.079’’]
5.00 [.197’’]
7.00 [.276’’]

0.50
1.59
1.77

25
156
177

35
220
250

1.77

177

250

Pollution
Degree(office
Environment)

2.00 [.079’’]
5.00 [.197’’]
7.00 [.276’’]2

2

Material
Group (Baseon UL
Rating)II

IIIb

3.50 [.138’’]

Mechanical Characteristics
7.1

Mating/Unmating Force
The force to mate a receptacle connector and compatible header.
Contact types
Per High Power Contacts
Per Low Power Contacts
Per Signal Contacts

Mating force (Maximum)
12N
6N
1N

Un-mating Force (Minimum)
2.2N
1.1N
0.2N

The following details shall apply:
a. Cross Head Speed – 12.7mm [0.5in.] per minute.
b. Utilize free floating fixtures.
c. Reference – EIA 364-13.
7.2

Compliant Pin Insertion
The force necessary to correctly apply a specimen to a printed circuit board.
Contact types
Plug/Receptacle Power Contacts
Plug Signal Contacts
Receptacle Signal Contacts

Insertion force per compliant EON
90N[20.2lbs] maximum
67N[15.0lbs] maximum
30N[6.7lbs] maximum© 2022 Amphenol Corporation
Form E-3701 – Revision F

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PDS: Rev :A

STATUS:ReleasedPrinted: Jul 25, 2024

NUMBER

TYPE

GS-12-1895

GENERAL
PRODUCT SPECIFICATION

TITLE

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a. Cross Head Speed – 12.7mm [0.5 in.] per minute max.
b. Reference – EIA 364-5.
7.3

Retention force per compliant pin
The force necessary to remove a specimen from a printed circuit board.
Contact types
Plug/Receptacle Power Contacts
Plug Signal Contacts
Receptacle Signal Contacts

Retention force per compliant EON
10N[2.25lbs] minimum
6.7N[1.5lbs] minimum
6.7N[1.5lbs] minimum

a. Cross Head Speed – 12.7mm [0.5 in.] per minute max.
b. Reference – EIA 364-5.
7.4

Contact Retention
The force necessary to remove a power or signal contact from the connector housing.
Contact types
Plug Power Contacts
Plug IMLA
Receptacle Power Contacts
Receptacle IMLA

Retention force per contact
13.4N[3.0lbs] minimum
13.4N[3.0lbs] minimum
13.4N[3.0lbs] minimum
13.4N[3.0lbs] minimum

The following details shall apply:
a. Reference – EIA 364-05.
7.5

PCB Hole Deformation Radius and Remaining Cu Plating Thickness (compliant pin)
Use PCB’s with minimum diameter holes, tin/OSP plating, and 1.57mm overall thickness.
Metallographic cross-sections shall be prepared parallel to the PCB surface (transverse section) tofacilitate radial hole deformation measurement, photographs, and remaining Cu plating measurement.
Prior to cross-section preparation, perform 3 compliant pin insertions and 3 compliant pin withdrawals.
The measurements and photographs shall be performed at 0.3 mm, [+0.2 mm,–0.1 mm] (0.012”,[+0.008”,-0.004”]) from the connector side PCB laminate (not copper) surface and at the center of thecompliant pin section on a minimum of 10 holes. The average (of 10 holes) hole deformation radius
shall be no greater than 37.5 µm (0.0015”) when measured from the drilled hole. The absolute
maximum deformation radius shall not exceed 50 µm (0.002”). The minimum average (of 10 holes)
copper thickness remaining between the compliant pin and the printed wiring board laminate shall not
be less than 7.5 µm (300 µ”). Reference IEC 60352-5 or EIA-364-96The force necessary to remove a
power or signal contact from the connector housing.

7.6

PCB Hole Wall Damage© 2022 Amphenol Corporation
Form E-3701 – Revision F

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STATUS:ReleasedPrinted: Jul 25, 2024

NUMBER

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CLASSIFICATIONUNRESTRICTED

Use PCB’s with minimum diameter holes, tin/OSP plating, and 1.57mm overall thickness.
Metallographic cross-sections shall be prepared perpendicular to the PCB surface (longitudinal
section) and through the compliant section wear track to facilitate examination of the PTH.
Prior to cross-section preparation, perform 3 compliant pin insertions and 3 compliant pin withdrawals.
There shall be no copper cracks, separations between conductive interfaces, or laminate-to-copper
separations. Test 10 pins/holes. Reference IEC 60352-5 or EIA-364-96.
8.0

Environmental Conditions
After exposure to the following environmental conditions in accordance with the specified test procedure
and/or details, the product shall show no physical damage and shall meet the electrical and mechanicalrequirements per paragraphs 6.0 and 7.0 as specified in the Table 1 test sequences. Unless specified
otherwise, assemblies shall be mated during exposure.
8.1 Thermal Shock – EIA 364-32
a. Number of Cycles – 10 cycles.
b. Temperature Range - Between -40°C and 125°C
c. Time at Each Temperature - 30 minutes minimum
d. Transfer Time - 5 minutes, maximum
8.2 Humidity – EIA 364-31 method IV (cyclic temperature)a. Relative Humidity - 94%
b. Temperature – 25°C ~ 65°C
c. Duration – 10 cycles (24 hours each), 10 days
d. With step 7a
e. Step 7a – -10°C
8.3 High Temperature Life – EIA 364-17
a. Test Temperature – 125°C
b. Test Duration - 504 hours
8.4 Mixed Flowing Gas corrosion (MFG) – EIA 364-65
a. Class - IIA
b. Duration - 20 daysc. 1st 10days unmated (both halves), 2nd 10days mated.
8.5 Vibration (Random) – EIA 364-28
a. Test Condition – VII, test condition E.
b. Subject mated specimens to 4.90G’s rms between 20~500Hz.
c. Mounting – To eliminate relative motion, both mating halves should be rigidly fixed.

© 2022 Amphenol Corporation
Form E-3701 – Revision F

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PDS: Rev :A

STATUS:ReleasedPrinted: Jul 25, 2024

NUMBER

TYPE

GS-12-1895

GENERAL
PRODUCT SPECIFICATION

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REVISION

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d. Duration – 15 minutes in each of 3 mutually perpendicular planes.
e. No evidence of physical damage.
f. No discontinuities greater than 1microsecond.
8.6 Mechanical Shock – EIA 364-27
a. Condition – A (50G, 11 millisecond, half-sine wave)
b. Shocks - 3 shocks in both directions along each of three orthogonal axes (18 shocks total)c. Mounting - Rigidly mount assemblies.
d. No discontinuities greater than 1.0 microseconds.
8.7 Durability - EIA 364-09
a. Number Cycles - 200 cycles
b. Cycling Rate – 500 cycles/hour Max.
c. Latches disabled (If applicable)
d. Use free floating fixtures
8.8 Solderability – J-STD-002
a. Test Condition A1
b. Minimum solder coverage: 95 %8.9 Resistance to Solder Heat – EIA 364-56
a. Test Condition – H, Procedure 3
b. There shall be no evidence of physical or mechanical damage
8.10 Disturb (thermal) - EIA 364-110
a. Test Condition A
b. Test Specimens – Mated connectors mounted to PCBsc. 10 Temperature Cycles between 15±3°C and 85±3°C
d. Ramp Time – >2°C per minute
e. Dwell Time – 5 minutes min.
f. Humidity not controlled
8.11 Dust - EIA 364-91
a. Dust Composition - #1 (benign)b. Duration – 1hour (±15 minutes)
c. Both halves to be placed in the chamberd. Specify connector orientation in the chamber.
© 2022 Amphenol Corporation
Form E-3701 – Revision F

GS-01-029

PDS: Rev :A

STATUS:ReleasedPrinted: Jul 25, 2024

NUMBER

TYPE

GS-12-1895

GENERAL
PRODUCT SPECIFICATION

TITLE

PAGE

REVISION

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8.12 Re-Seating - Manually unplug and plug the connector for 3 cycles
9.0QUALITY ASSURANCE PROVISIONS
9.1 Equipment Calibration
All test equipment and inspection facilities used in the performance of any test shall be maintained in acalibration system in accordance with ANSI Z-540 and ISO 9000.
9.2 Inspection Conditions
Unless otherwise specified herein, all inspections shall be performed under the following
ambient conditions:a. Temperature: 25 +/- 5 deg C
b. Relative Humidity: 30% to 60%
c. Barometric Pressure: Local ambient
9.3 Sample Quantity And Description
3 mated pair of test samples mounted on test PCBs are needed for test groups 1, 2, 4, 5, 7.
3 mated pair of test samples not mounted on test PCBs are needed for test groups 3 and 8.
A minimum of 10 loose piece contacts with a minimum of 60 Press-Fit EONS are needed for test
group 6.
9.4 Acceptance
9.4.1 Electrical and mechanical requirements placed on test samples as indicated in paragraphs 6.0
and 7.0 shall be established from test data using appropriate statistical techniques or shallotherwise be customer specified, and all samples tested in accordance with this productspecification shall meet the stated requirements.
9.4.2 Failures attributed to equipment, test setup, or operator error shall not disqualify the product. If
product failure occurs, corrective action shall be taken, and samples resubmitted for
qualification.
9.5 Qualification Testing
Qualification testing shall be performed on sample units produced with equipment and procedures
normally used in production. The test sequences shall be as shown in the qualification test table. Data
shall be provided with the samples noting production history: production lot codes for components
and assemblies, components and assemblies produced to print revision __, verification of plating
composition and thickness, etc.
9.6 Re-Qualification Testing
If any of the following conditions occur, the responsible product engineer shall initiate requalification
testing consisting of all applicable parts of the qualification test matrix.

© 2022 Amphenol Corporation
Form E-3701 – Revision F

GS-01-029

PDS: Rev :A

STATUS:ReleasedPrinted: Jul 25, 2024

NUMBER

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GENERAL
PRODUCT SPECIFICATION

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TITLE

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CLASSIFICATIONUNRESTRICTEDa.

A significant design change is made to the existing product which impacts the product form, fit
or function. Examples of significant changes shall include, but not be limited to, changes in theplating material composition or thickness, contact force, contact surface geometry, insulator
design, contact base material, or contact lubrication requirements.

b.

A significant change is made to the manufacturing process which impacts the product form, fit
or function.

c.

A significant event occurs during production or end use requiring corrective action to be taken
relative to the product design or manufacturing process.

9.7 Qualification Test Table

TEST

PARA

Test Group
5
6a

1

2

3

4

Temp.
Life

ThermalShock/
Humidity

Dielectric

Vibrati
on &
Mech.
Shock

1,11
2,6,
8,10

1,15
2,6,8,12
,14

1,10

1,15
2,4,8,
10,12,
14

MFG

Compliant
Pin
Repair
(a)

6b

7

8

Compliant
Pin
Repair(a)Current
RatingContact
Retention &Solderability

1,9

1,4

1

Test Sequence (b)Examination of ProductLow level contact
resistance,

5.6
6.1

Contact Resist.at rated
current,
High/Low Power Contacts
only
Insulation resistanceDielectric Withstanding
Voltage
Current Rating
Mating/Un-Mating Force
Compliant Pin Insertion
Compliant pin retention
Contact Retention
PCB Hole Deformation
PCB Hole Wall Damage
Thermal Shock
HumidityHigh Temperature Life
Mixed Flowing Gas (MFG)
Vibration
Mechanical ShockDurability
Solderability
Resistance to Solder HeatDisturb (Thermal)
Dust
Re-Seating

6.2

1,10

3

6.3
6.4
6.5
7.1
7.2
7.3
7.4
7.5
7.6
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
8.10
8.11
8.12

1,17
2,6,8,
10,12,
14,16

2,5,8
3,6,9
2
3,5

3,5

5,7

3,5
2,4,6
3,5,7

2,4,6
3,5
2
7
8

7
11

4
7

7

3(c)

4(d)

11
13
6

4(d)

7(c)
9,11

4(d)
3
4
13

9

9
13

9
15

NOTE:
(a) See paragraph 9.4.
(b) Numbers indicate sequence in which tests are performed.
(c) Precondition (Temp. Life) specimens per EIA-364-17. Refer to EIA-364-1000 Table 9 for test parameters.
© 2022 Amphenol Corporation
Form E-3701 – Revision F

GS-01-029

PDS: Rev :A

STATUS:ReleasedPrinted: Jul 25, 2024

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GS-12-1895

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CLASSIFICATIONUNRESTRICTED(d) Precondition (Durability) specimens with 25 durability cycles per EIA-364-09.
(e) Perform remaining durability cycles to meet the paragraph 8.7 requirement.
(f) Test Groups:
Group 1 – Temp. LifeGroup 2 – Thermal Shock/Humidity
Group 3 – DielectricGroup 4 – Vibration and Mechanical ShockGroup 5 – MFG
Group 6 – Compliant Pin Repair
Group 7 – Current RatingGroup 8 – Contact Retention and Solderability(g) Samples quantity: Each test group with 3 sets of samples

REVISION RECORD

Rev

Page

Description

EC#

Date

© 2022 Amphenol Corporation
Form E-3701 – Revision F

GS-01-029

PDS: Rev :A

STATUS:ReleasedPrinted: Jul 25, 2024

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GS-12-1895

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New releasedNA2024/7/18© 2022 Amphenol Corporation
Form E-3701 – Revision F

GS-01-029

PDS: Rev :A

STATUS:ReleasedPrinted: Jul 25, 2024