電子部品用高分子材料の最新動向Ⅴ― 半導体用および電子基板用材料の技術・開発・市場の実態 ―2011年9月発行
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第２章 半導体封止用有機高分子材料の最新動向 ······························································· 3
２.１ 半導体用樹脂封止技術の開発動向 ··············································································· 3２.１.１

樹脂封止材料の必要特性 ·································································································· 3

２.１.２

半導体の樹脂封止方法 ······································································································ 4

２.２

半導体封止樹脂関連材料の開発動向 ··········································································· 5２.２.１

固形封止材料 ······················································································································· 5１固形封止材料の組成と変遷 ······························································································ 5（１）封止材料の基本組成 ··································································································· 5（２）特性改良の変遷 ··········································································································· 7２固形封止材料組成物の特性の改良 ··············································································· 11（１）溶融粘度の低減 ········································································································· 11（２）硬化性の向上 ············································································································· 13（３）保存安定性の向上 ····································································································· 13
３固形封止材料の用途別開発状況 ···················································································· 15（１）耐半田対応封止材料 ································································································· 17（２）環境対応封止材料 ····································································································· 18（３）先端パッケージ用封止材料 ···················································································· 20（４）圧縮成形用封止材料 ································································································· 22
２.２.２

液状封止材料 ····················································································································· 24

１

液状封止材料の応用分野と材料組成 ··········································································· 24（１）液状封止材料の特徴 ································································································· 24（２）液状封止材料の組成 ································································································· 24（３）液状封止材料の開発課題 ························································································ 25２液状封止材料の用途別開発状況 ···················································································· 28（１）TAB 型パッケージ用液状封止材料 ······································································· 28（２）WB 型パッケージ用液状封止材料 ········································································· 29（３）WL-CSP 用液状封止材料 ························································································· 30
２.２.３

アンダーフィル用液状樹脂 ···························································································· 31

１

アンダーフィル材料の技術課題 ···················································································· 31（１）アンダーフィル材料の必要性 ················································································ 31（２）アンダーフィル材料の課題 ···················································································· 32（３）アンダーフィル実装プロセスの課題 ··································································· 33（４）三次元実装を支えるアンダーフィル材料 ··························································· 33（５）液状封止材料の各社代表グレード ······································································· 35
２アンダーフィル材料の特性改良 ···················································································· 35（１）流動性の向上 ············································································································· 36（２）ボイドの低減 ············································································································· 37（３）硬化性の向上 ············································································································· 38

－i－

３

対応部材別アンダーフィル材料の開発状況 ······························································· 39（１）Ｌｏｗ-ｋ膜対応材料 ······························································································· 39（２）鉛フリー半田対応材料 ···························································································· 39（３）ＷＬ-ＣＳＰ対応材料 ······························································································· 41（４）2 次実装対応材料 ······································································································ 41（５）ＣＯＦ対応材料 ········································································································· 42４

タイプ別アンダーフィル材料の開発状況 ··································································· 42（１）キャピラリーフロータイプ材料 ············································································ 42（２）プリアプライドタイプ材料 ···················································································· 43（３）リペア可能タイプ材料 ···························································································· 45
２.２.４

封止シート（接着フィルム） ························································································ 46

１

封止シートシステム ········································································································· 46

２

封止シートの各社開発状況 ···························································································· 48（１）日立化成工業の研究 ································································································· 48（２）京セラケミカルの研究 ···························································································· 50（３）日東電工の研究 ········································································································· 51（４）その他の会社の研究 ································································································· 51

２.３

エポキシ樹脂封止材料の特性改良に関する研究開発動向 ······························ 53

２.３.１

熱的特性の改良 ················································································································· 53

１高耐熱化 ······························································································································ 53（１）高耐熱ナフタレン骨格エポキシ樹脂 ··································································· 53（２）高耐熱アダマンタン骨格エポキシ樹脂 ······························································· 54（３）高耐熱性エポキシ樹脂配合材料 ············································································ 54２低熱膨張化 ························································································································· 57（１）多環芳香族骨格樹脂による低熱膨張化 ······························································· 57（２）充填材による低熱膨張化 ························································································ 59３高熱伝導化（高放熱化） ································································································ 59（１）エポキシ樹脂による高熱伝導化 ············································································ 60（２）フィラーによる高熱伝導化 ···················································································· 61
４

耐半田リフロー材料の開発 ···························································································· 63（１）パナソニック電工の研究 ························································································ 63（２）日東電工の研究 ········································································································· 66（３）住友ベークライトの研究 ························································································ 67（４）日立化成工業の研究 ································································································· 67（５）京セラケミカルの研究 ···························································································· 68
５半田代替用高熱伝導ペーストの開発 ··········································································· 68

２.３.２

力学的特性の改良 ············································································································· 68

１

高強靱化 ······························································································································ 68（１）ソフトセグメントの導入による強靱化 ······························································· 69（２）エラストマー変性による強靱化 ············································································ 70２低応力化 ······························································································································ 72（１）低応力剤による内部応力の低減 ············································································ 73－ii－

（２）シリコーン化合物による内部応力の低減 ··························································· 74（３）樹脂による内部応力の低減 ···················································································· 77（４）硬化剤による内部応力の低減 ················································································ 77（５）フィラーによる内部応力の低減 ············································································ 78
３低反り化 ······························································································································ 79（１）半導体パッケージの反り発生機構 ······································································· 79（２）半導体封止材料の反り低減方法 ············································································ 80（３）各社の反り低減材料 ································································································· 81（４）樹脂による低反り化 ································································································· 82（５）硬化剤による低反り化 ···························································································· 84（６）添加剤による低反り化 ···························································································· 86
２.３.３

電気的特性の改良 ············································································································· 89

１耐湿性の改良 ····················································································································· 89（１）エポキシ樹脂による改良 ························································································ 89（２）硬化剤による改良 ····································································································· 91（３）フィラーによる改良 ································································································· 91（４）イオン捕捉剤による改良 ························································································ 91２電気絶縁性の改良 ············································································································· 92（１）耐マイグレーション性の改良 ················································································ 92（２）電気トリーの改良 ····································································································· 93（３）金属フリー化 ············································································································· 94（４）耐トラッキング性 ····································································································· 96（５）銅ワイヤの腐食防止 ································································································· 96（６）銀ワイヤの腐食防止 ································································································· 97
２.３.４

難燃性の改良 ····················································································································· 98

１ハロゲンフリー難燃剤の開発 ························································································ 98（１）難燃エポキシ樹脂 ····································································································· 98（２）難燃エポキシ樹脂用硬化剤 ·················································································· 100（３）その他難燃用添加剤 ······························································································· 102２

自己消火性難燃封止材料の開発 ·················································································· 104

３

環境対応型封止材料の各社開発状況 ········································································· 108（１）住友ベークライトの研究 ······················································································ 108（２）日立化成工業の研究 ······························································································· 110（３）パナソニック電工の研究 ······················································································ 111（４）日本化薬の研究 ······································································································· 112
２.３.５

密着性の改良 ··················································································································· 112（１）住友ベークライトの研究 ······················································································ 112（２）日立化成工業の研究 ······························································································· 114（３）パナソニック電工の研究 ······················································································ 115（４）日東電工の研究 ······································································································· 116（５）京セラケミカルの研究 ·························································································· 117（６）その他の会社の研究 ······························································································· 118－iii－

第３章 光半導体封止用透明高分子材料の最新動向 ······················································ 120
３.１ 光半導体用透明封止材料の開発動向 ······································································· 120
３.１.１

光半導体用透明封止材料の必要特性 ········································································· 120

３.１.２

代表的な光半導体用透明封止材料 ············································································· 121

１

エポキシ樹脂とシリコーン樹脂 ·················································································· 121

２

エポキシ・シリコーンハイブリッド樹脂 ································································· 122３

無機・有機ハイブリッド樹脂 ······················································································ 123

３.２

光半導体封止用エポキシ樹脂の開発動向 ····························································· 124

３.２.１

光半導体封止用エポキシ樹脂の特徴 ········································································· 124

３.２.２

光半導体封止用エポキシ樹脂の改良 ········································································· 125１

耐光(耐熱)性の改良 ······································································································· 125２

耐光(耐紫外線)性の改良 ······························································································ 127

３

耐衝撃(耐クラック)性の改良 ······················································································ 129

４耐湿性の改良 ··················································································································· 132

３.３

光半導体封止用シリコーン樹脂の開発動向 ························································ 134

３.３.１

光半導体封止用シリコーン樹脂の特徴 ····································································· 134

３.３.２

光半導体封止用シリコーン樹脂の改良 ····································································· 135１

屈折率の改良 ··················································································································· 135

２

耐衝撃(耐クラック)性の改良 ······················································································ 137

３

耐光(耐熱)性の改良 ······································································································· 138

４

耐光(耐紫外線)性の改良 ······························································································ 140

５接着性の改良 ··················································································································· 141

６

耐腐食性の改良 ··············································································································· 142

７

成形性の改良 ··················································································································· 143

３.４

光半導体封止用エポキシ・シリコーンハイブリッド樹脂の開発動向 ···· 144

３.４.１

光半導体封止用エポキシ・シリコーンハイブリッド樹脂の特徴 ······················· 144

３.４.２

光半導体封止用エポキシ・シリコーンハイブリッド樹脂の改良 ······················· 145

１

接着(密着)性の改良 ······································································································· 145

２

耐衝撃(耐クラック)性の改良 ······················································································ 147

３

耐光(耐熱)性の改良 ······································································································· 148

４

耐光(耐紫外線)性の改良 ······························································································ 150５屈折率の改良 ··················································································································· 151

６

べたつき性の改良 ··········································································································· 152７

保存安定性の改良 ··········································································································· 153

３.５

その他の光半導体封止用樹脂の開発動向 ····························································· 154

３.５.１

光半導体封止用無機・有機ハイブリッド樹脂 ························································ 154

１

メタロセン結合を有するハイブリッド樹脂組成物 ················································ 154

２

シロキサン結合を有するハイブリッド樹脂組成物 ················································ 155

３

金属アルコキシドを有するハイブリッド樹脂組成物 ············································ 155

３.５.２

その他の光半導体封止用樹脂 ······················································································ 157１

光半導体封止用ポリイミド ·························································································· 157

２

光半導体封止用アクリル樹脂 ······················································································ 157

－iv－

３

光半導体封止用フッ素樹脂 ·························································································· 159

４

その他の光半導体封止用樹脂および材料 ································································· 160

第４章 半導体チップコーティング用高分子材料の最新動向 ·································· 163
４.１ 半導体チップ表面コーティング材料 ······································································· 163
４.１.１

半導体チップ表面コーティング技術 ········································································· 163

１

表面コーティング材料の必要性 ·················································································· 163

２

表面コーティング材料の使用方法 ············································································· 164

３

表面コーティング用樹脂の種類とその特徴 ····························································· 165

４.１.２

半導体チップ表面コーティング用ネガ型感光性樹脂の開発 ······························· 165

１

ネガ型感光性ポリイミドの開発 ·················································································· 165（１）ネガ型感光性樹脂の合成方法 ·············································································· 166（２）ネガ型感光性樹脂の諸特性 ·················································································· 166
２

ネガ型感光性樹脂の改良 ······························································································ 167（１）超厚膜ネガ型感光性ポリイミド ·········································································· 167（２）低応力ネガ型感光性ポリイミド ·········································································· 168（３）低温硬化ネガ型感光性ポリイミド ····································································· 169（４）アルカリ水溶液現像ネガ型感光性ポリイミド ················································ 169（５）高感度ネガ型感光性ポリイミド ·········································································· 170（６）高解像度ネガ型感光性ポリベンゾオキサゾール ············································ 170（７）無腐食性ネガ型感光性ポリベンゾオキサゾール ············································ 171
４.１.３

半導体チップ表面コーティング用ポジ型感光性樹脂の開発 ······························· 171１

ポジ型感光性樹脂の特徴 ······························································································ 171２

ポジ型感光性ポリイミドの開発 ·················································································· 172

３

ポジ型感光性ポリイミドの改良 ·················································································· 172（１）低熱膨張性ポジ型感光性ポリイミド ································································· 172（２）低誘電率ポジ型感光性ポリイミド ····································································· 173（３）高感度ポジ型感光性ポリイミド ·········································································· 174
４

ポジ型感光性ポリベンゾオキサゾールの開発 ························································ 175

５

ポジ型感光性ポリベンゾオキサゾールの改良 ························································ 175（１）高感度ポジ型感光性ポリベンゾオキサゾール ················································ 175（２）高感度、高解像度ポジ型感光性ポリベンゾオキサゾール ··························· 177（３）i 線透過性ポジ型感光性ポリベンゾオキサゾール ········································· 179（４）高接着性ポジ型感光性ポリベンゾオキサゾール ············································ 180（５）低温硬化ポジ型感光性ポリベンゾオキサゾール ············································ 181
６４.２

ポジ型感光性ポリベンゾオキサゾールの製品 ························································ 183

半導体用層間絶縁膜材料 ······························································································· 184４.２.１

低誘電率層間絶縁膜材料の開発 ·················································································· 184１

低誘電率層間絶縁膜材料の必要性 ············································································· 184２

低誘電率層間絶縁膜材料の開発方法 ········································································· 184４.２.２

低誘電率層間絶縁膜材料用樹脂の開発状況 ····························································· 186

１

ポリイミド系低誘電率層間絶縁膜材料の開発 ························································ 186－v－

（１）ポーラス化による低誘電率化 ·············································································· 187（２）脂環式構造の導入による低誘電率化 ································································· 189（３）嵩高い構造の導入による低誘電率化 ································································· 191（４）低極性化による低誘電率化 ·················································································· 192（５）シリコーンの導入による低誘電率化 ································································· 193（６）低誘電率材料の混合による低誘電率化 ····························································· 193
２

ポリベンゾオキサゾール系低誘電率層間絶縁膜材料の開発 ······························· 194（１）ポーラス化による低誘電率化 ·············································································· 194（２）フッ素変性による低誘電率化 ·············································································· 195（３）脂環式構造の導入による低誘電率化 ································································· 195３その他樹脂系低誘電率層間絶縁膜材料の開発 ························································ 196（１）ポリベンゾシクロブテン ······················································································ 196（２）ポリシラザン ··········································································································· 197（３）ポリフェニレンエーテル ······················································································ 198（４）ナフタリン ··············································································································· 198（５）ノルボルネン ··········································································································· 199（６）シリコーン ··············································································································· 199（７）ポリアリールエーテルケトン ·············································································· 200（８）アダマンタン ··········································································································· 201
４４.３

低誘電率層間絶縁膜材料の企業別開発状況 ····························································· 202

半導体用再配置配線材料 ······························································································· 208

４.３.１

半導体用再配置配線材料の開発 ·················································································· 208

１

半導体用再配置配線材料の必要性 ············································································· 208

２

半導体用再配置配線材料の開発方法 ········································································· 209

４.３.２

半導体用再配置配線材料用樹脂の開発状況 ····························································· 210

１

半導体用再配置配線材料の樹脂別開発状況 ····························································· 210（１）ネガ型感光性エポキシ樹脂 ·················································································· 210（２）ポジ型感光性ポリベンゾオキサゾール ····························································· 212（３）ネガ型感光性ポリイミド ······················································································ 214（４）感光性フッ素樹脂 ··································································································· 215
２

半導体用再配置配線材料の企業別開発状況 ····························································· 215

第５章 その他半導体用高分子材料の最新動向 ································································ 218
５.１ チップマウンティング用ペースト ··········································································· 218
５.１.１

エポキシ樹脂系ペーストの開発 ·················································································· 219

１

ペーストの組成と作製方法 ·························································································· 219（１）ペーストの配合組成 ······························································································· 219（２）ペーストの作製方法 ······························································································· 220
２

新規ペーストの開発 ······································································································· 220（１）高温半田リフロー対応ペースト ·········································································· 221（２）高熱伝導ペースト ··································································································· 222（３）低応力ペースト ······································································································· 222－vi－

（４）印刷法用ペースト ··································································································· 223（５）リフロークラック対応ペースト ·········································································· 224
５.１.２

ポリイミド系ペーストの開発 ······················································································ 225

１

新規ペーストの開発 ······································································································· 225（１）低弾性・低反りペースト ······················································································ 225（２）高接着・低応力ペースト ······················································································ 225（３）高接着・低弾性ペースト ······················································································ 226
２

LOC 用ペーストの開発 ································································································· 226（１）高接着ペースト ······································································································· 226（２）高耐熱ペースト ······································································································· 226（３）感光性ペースト ······································································································· 227
５.１.３

アクリル樹脂系ペーストの開発 ·················································································· 227（１）速硬化で低応力なペースト ·················································································· 227（２）高熱伝導半田代替可能ペースト ·········································································· 228（３）鉛フリー半田リフロー対応ペースト ································································· 228（４）BGA／CSP 用ペースト ··························································································· 229
５.１.４

シリコーン樹脂系ペーストの開発 ············································································· 230（１）低応力化ペースト ··································································································· 230（２）速硬化性ペースト ··································································································· 230

５.２

チップマウンティング用フィルム ··········································································· 231

５.２.１

DAF フィルムの開発 ······································································································ 232１エポキシ／ポリイミド系 DAF フィルム ··········································································· 233

２エポキシ／アクリル系 DAF フィルム ··············································································· 233

５.２.２

LOC テープの開発 ·········································································································· 236５.２.３

その他の接着テープの開発 ·························································································· 238

５.３

ダイシング用テープ ········································································································ 239

５.３.１

ダイシングテープ(DC)の開発 ···················································································· 239

５.３.２

ダイシング・ダイボンディング一体型フィルム(DDF)の開発 ··························· 241

５.４

バックグラインド用テープ(BG)の開発 ································································ 246

第６章 電子回路用基板材料の最新動向 ··············································································· 248
６.１ 電子回路用基板の種類 ··································································································· 248（１）リジッド基板 ··········································································································· 248（２）フレキシブル基板 ··································································································· 249（３）高熱伝導・高放熱基板 ·························································································· 250（４）高周波通信用基板 ··································································································· 251（５）光・電気コンポジット基板 ·················································································· 251（６）モジュール基板 ······································································································· 252（７）特殊銅張積層板 ······································································································· 252

６.２

リジッド基板用材料 ········································································································ 253

６.２.１

リジッド基板用材料の種類とその特徴 ····································································· 253（１）フェノール樹脂基板 ······························································································· 253－vii－

（２）エポキシ樹脂基板 ··································································································· 253（３）ポリイミド基板 ······································································································· 253（４）シアネート樹脂基板 ······························································································· 254（５）ポリフェニレンエーテル基板 ·············································································· 255（６）フッ素樹脂基板 ······································································································· 256（７）ベンゾシクロブテン樹脂基板 ·············································································· 256（８）液晶ポリマー基板 ··································································································· 257
６.２.２

リジッド基板用材料の特性の改良 ············································································· 257１

低誘電率、低誘電正接材料の開発 ············································································· 257２

高耐熱性材料の開発 ······································································································· 258（１）ナフタレン骨格エポキシ樹脂 ·············································································· 258（２）ビフェニル骨格エポキシ樹脂 ·············································································· 260（３）テトラキスフェノールエタン骨格エポキシ樹脂 ············································ 261（４）アダマンタン骨格エポキシ樹脂 ·········································································· 261（５）マレイミド化合物配合エポキシ樹脂組成物 ····················································· 263（６）ビスマレイミドトリアジン樹脂 ·········································································· 263（７）アミノトリアジンノボラック樹脂 ····································································· 264（８）シアネート樹脂 ······································································································· 264（９）シリコーン樹脂 ······································································································· 265３低熱膨張性材料の開発 ·································································································· 266（１）低熱膨張基板の必要性 ·························································································· 266（２）住友ベークライトの研究 ······················································································ 267（３）パナソニック電工の研究 ······················································································ 268（４）ADEKA の研究 ········································································································· 269（５）利昌工業の研究 ······································································································· 270（６）新神戸電機の研究 ··································································································· 271（７）日立化成工業の研究 ······························································································· 272
４ハロゲンフリー難燃材料の開発 ·················································································· 272（１）環境対応難燃剤の必要性とその現状 ································································· 272（２）ハロゲンフリー難燃エポキシ樹脂 ····································································· 273（３）ハロゲンフリー難燃エポキシ樹脂用硬化剤 ····················································· 275（４）自己消火性難燃材料 ······························································································· 278（５）環境対応型プリント配線板の開発状況 ····························································· 280
５回路微細化用材料の開発 ······························································································ 282

６耐衝撃性基板材料の開発 ······························································································ 283

６.２.３

ビルドアップ多層電子基板 ·························································································· 283

１

ビルドアップ多層電子基板の特徴 ············································································· 283（１）ビルドアップ方式による多層電子基板の製造 ················································ 283（２）ビルドアップ多層電子基板の特徴 ····································································· 284
２

コア付きビルドアップ基板の作製方法 ····································································· 285（１）感光性樹脂・フォトプロセス ·············································································· 285（２）熱硬化性樹脂・レーザープロセス ····································································· 286－viii－

３

コアレスビルドアップ基板の作製方法 ····································································· 288（１）ALIVH ························································································································ 289（２）B ２ it ··························································································································· 292
４

ビルドアップ多層電子基板材料の開発 ····································································· 294（１）感光性樹脂材料 ······································································································· 294（２）非感光性樹脂材料 ··································································································· 295（３）樹脂付き銅箔 ··········································································································· 296（４）樹脂フィルム(樹脂シート) ·················································································· 298（５）ビルドアップ多層電子基板の各社製品 ····························································· 302

６.３

フレキシブル基板用材料 ······························································································· 304

６.３.１

フレキシブル基板用フィルム材料 ············································································· 304

１ポリイミド(PI)フィルム ······························································································ 305

２

液晶ポリマー(LCP)フィルム ······················································································ 306

３

ポリエチレンナフタレート(PEN)フィルム ····························································· 308

４

ポリエチレンテレフタレート(PET)フィルム ························································· 309

５ポリアミドイミドフィルム ·························································································· 309

６

ポリアミドフィルム ······································································································· 309

６.３.２

二層(接着剤レス)フレキシブル基板の開発 ····························································· 310

１

二層フレキシブル銅張板の製造方法 ········································································· 310（１）キャスティング法 ··································································································· 310（２）ラミネート法 ··········································································································· 311（３）メタライジング法 ··································································································· 317
２

二層フレキシブル回路基板の作製方法 ····································································· 320（１）化学的表面処理後のダイレクトパターニング ················································ 320（２）導電性インクによる微細配線の形成 ································································· 323（３）銀ナノパーティクルからなる導電性インク ····················································· 323（４）銅ナノパーティクルからなる導電性インク ····················································· 326（５）金ナノパーティクルからなる導電性インク ····················································· 328（６）その他の導電性インク ·························································································· 329（７）その他の方法による微細配線の形成 ································································· 330
３

TAB 用フレキと COF 用フレキの開発 ······································································ 332（１）TAB 用と COF 用のフレキシブル銅張積層板 ·················································· 332（２）TAB 用フィルム ······································································································· 333（３）COF 用フィルム ······································································································ 333
６.３.３

その他のフレキシブル基板の開発 ············································································· 335

１

多層フレキシブル基板 ·································································································· 335（１）オールポリイミド多層 IC パッケージ基板 ······················································· 335（２）全層ポリイミド一括積層 IVH フレキシブル多層基板 ··································· 336（３）新規層間接続技術を用いた多層フレキシブル基板“S B i c ” ······················ 337（４）高密度薄型多層フレキシブル基板 ····································································· 338（５）極薄多層フレキシブル基板 ·················································································· 339（６）液晶ポリマー製高密度多層フレキシブル基板 ················································ 339

－ix－

２

その他のフレキシブルプリント配線板 ····································································· 340（１）リジッドフレキシブルプリント配線板 ····························································· 340（２）キャパシター内蔵フレキシブルプリント配線板 ············································ 340（３）全透明フレキシブルプリント配線板 ································································· 341（４）立体形状フレキシブルプリント配線板 ····························································· 341（５）長尺フレキシブルプリント配線板 ····································································· 343（６）大電流用厚銅フレキシブルプリント配線板 ····················································· 343
６.３.４

フレキシブル基板の特性の改良 ·················································································· 343

１

高密着化 ···························································································································· 343（１）セットメーカーからの要求特性 ·········································································· 343（２）改良研究 ···················································································································· 344２

寸法安定化 ······················································································································· 344３

高位置精度化 ··················································································································· 345

４高精細化 ···························································································································· 346（１）日本メクトロンの研究 ·························································································· 346（２）その他の会社の研究 ······························································································· 348
５高耐折化 ···························································································································· 349

６

耐マイグレーション化 ·································································································· 351

７

耐ブリスター化 ··············································································································· 353

８難燃化 ································································································································ 354

９高速伝送化 ······················································································································· 35510高熱伝導化 ······················································································································· 356

11

易走行性(易滑性) ··········································································································· 356

６.３.５

フレキシブル基板用カバーレイの開発 ····································································· 356

１

カバーレイ用フィルム ·································································································· 356（１）日立化成工業の研究 ······························································································· 357（２）三井化学の研究 ······································································································· 359（３）カネカの研究 ··········································································································· 360（４）東レ・デュポンの研究 ·························································································· 363（５）住友ベークライトの研究 ······················································································ 363（６）ナミックスの研究 ··································································································· 365（７）京セラケミカルの研究 ·························································································· 365（８）信越化学工業の研究 ······························································································· 366（９）東洋紡績の研究 ······································································································· 367（10）新日鐵化学の研究 ··································································································· 367
２

カバーレイ用ワニス ······································································································· 368（１）ソニーCID の研究 ··································································································· 368（２）DIC の研究 ················································································································ 369（３）双日の研究 ··············································································································· 369（４）カネカの研究 ··········································································································· 369（５）太陽インキ製造の研究 ·························································································· 373（６）住友電気工業の研究 ······························································································· 374－x－

（７）日立化成工業の研究 ······························································································· 374
６.３.６

フレキシブル基板用接着剤／接着テープの開発 ····························································· 375（１）新日鐵化学の研究 ··································································································· 375（２）日東電工の研究 ······································································································· 376（３）リンテックの研究 ··································································································· 377（４）利昌工業の研究 ······································································································· 377（５）D I C の研究 ·············································································································· 377（６）三井化学の研究 ······································································································· 378（７）荒川化学工業の研究 ······························································································· 378（８）J S R の研究 ··············································································································· 378（９）東亞合成の研究 ······································································································· 379（10）味の素の研究 ··········································································································· 379（11）東洋インキ製造の研究 ·························································································· 380（12）日立化成工業の研究 ······························································································· 381

６.３.７

フレキシブル基板の新規な用途 ·························································································· 381
１

太陽電池 ···························································································································· 381

２

ハードディスクドライブ用サスペンション ····························································· 382

３

宇宙ヨットのソーラーセール ······················································································ 382

４

車載用配線基板 ··············································································································· 382

第７章 高放熱基板材料の最新動向 ························································································· 383
７.１ 高熱伝導化(高放熱化) ··································································································· 383
７.１.１

高熱伝導化(高放熱化)の必要性とその対策 ····························································· 383１高熱伝導化(高放熱化)の必要性 ·················································································· 383２高熱伝導化(高放熱化)の理論 ······················································································ 383（１）熱伝導 ························································································································ 384（２）熱伝達(対流熱伝達) ······························································································· 385（３）放熱熱伝達 ··············································································································· 385３高熱伝導化(高放熱化)の対策 ······················································································ 385

７.１.２

高熱伝導化(高放熱化)の方法 ······················································································ 386

１

フィラー高充填による高熱伝導化(高放熱化) ························································ 386（１）無機フィラーによる高熱伝導化 ·········································································· 386（２）銀ナノ粒子担持フィラーによる高熱伝導化 ····················································· 387（３）微小球状 A l N 粒子による高熱伝導化 ································································ 387（４）リン片状 B N フィラーによる高熱伝導化 ························································· 388（５）微小アルミナ粒子高充填による高熱伝導化 ····················································· 388（６）無機フィラーの電場配向による高熱伝導化 ····················································· 389（７）界面活性剤処理充填材による高熱伝導化 ························································· 389２

樹脂による高熱伝導化(高放熱化) ············································································· 390（１）エポキシ樹脂の熱伝導の原理 ·············································································· 390（２）モノメソゲン型樹脂による高熱伝導化 ····························································· 390（３）ツインメソゲン型樹脂による高熱伝導化 ························································· 392－xi－

（４）メソゲン型樹脂のコンポジット化による高熱伝導化 ···································· 393（５）液晶性エポキシ樹脂の磁場配向による高熱伝導化 ········································ 394（６）液晶ポリマーによる高熱伝導化 ·········································································· 395
３

メタルベース・メタルコアによる高熱伝導化(高放熱化) ··································· 395（１）放熱基板のビアホールの改良 ·············································································· 395（２）放熱基板の耐クラック性の向上 ·········································································· 396（３）放熱基板に金属ブロックを積層しさらに高放熱化 ········································ 397（４）銅ベースに直結したバンプによる高放熱化 ····················································· 398（５）放熱基板の回路の剥離防止方法 ·········································································· 398（６）ポリアリーレンスルフィドからなる放熱基板 ················································ 399（７）放熱基板の熱応力による歪みの改良 ································································· 399（８）放熱基板の耐マイグレーション性の向上 ························································· 400（９）安価な構造の放熱基板 ·························································································· 400
４カーボン／グラファイト系材料による高熱伝導化(高放熱化) ··························· 401（１）カーボン繊維コアによる高放熱基板 ································································· 401（２）カーボングラファイトシー卜による高放熱基板 ············································ 401（３）ピツチ系炭素繊維による高放熱化 ····································································· 401（４）黒鉛と金属の複合化による高放熱化 ································································· 402（５）シート状黒鉛層による高放熱化 ·········································································· 402
７.１.３

回路基板材料の高熱伝導化(高放熱化) ····································································· 403１

半導体実装用高熱伝導化(高放熱化)基板 ································································· 403（１）高熱伝導化(高放熱化)方法の課題 ····································································· 403（２）各社の高熱伝導化(高放熱化)基板の開発 ························································· 404２

その他の回路基板用高熱伝導化(高放熱化)材料 ···················································· 407（１）回路基板用高熱伝導ペースト ·············································································· 407（２）回路基板用高熱伝導性塗料 ·················································································· 409（３）回路基板用高熱伝導性シート ·············································································· 409

７.２光半導体実装用回路基板材料の最新動向 ·································································· 411
７.２.１

光半導体実装用回路基板材料の開発動向 ································································· 411

１

光半導体実装用回路基板材料の必要特性 ································································· 411

２

代表的な光半導体実装用回路基板 ············································································· 412（１）エポキシ樹脂系基板 ······························································································· 412（２）シリコーン樹脂系基板 ·························································································· 412（３）トリアジン樹脂系基板 ·························································································· 413（４）液晶ポリマー系基板 ······························································································· 413（５）ポリイミド系基板 ··································································································· 414
３

代表的な光半導体実装用高放熱性基板 ····································································· 414

７.２.２

光半導体実装用回路基板材料の改良研究 ································································· 415１

光半導体実装用メタルベース基板材料の改良研究 ················································ 415（１）放熱性の改良 ··········································································································· 415（２）光反射性の改良 ······································································································· 420（３）その他の特性の改良 ······························································································· 422

－xii－

２

光半導体実装用リジッド基板材料の改良研究 ························································ 422（１）熱伝導性の改良 ······································································································· 422（２）光反射率の改良 ······································································································· 426
３

光半導体実装用フレキシブル基板材料の改良研究 ················································ 431（１）耐熱性、耐光性の改良 ·························································································· 431（２）放熱性、絶縁性の改良 ·························································································· 432（３）反射率の改良 ··········································································································· 433
４

光半導体実装基板用ソルダーレジスト材料の改良研究 ········································ 433（１）HAST 耐性の改良 ···································································································· 433（２）光反射率の改良 ······································································································· 435（３）放熱性の改良 ··········································································································· 436５

その他の光半導体実装用材料の改良研究 ································································· 436（１）LED チップ搭載用バインダー材料 ····································································· 436（２）LED チップ放熱用塗布液材料 ············································································· 437（３）LED チップ被覆用フィルム材料 ········································································· 437（４）LED 放熱基板製作用接着シート材料 ································································· 438（５）LED 照明用の光反射材料 ······················································································ 439

７.３車載用回路基板材料の最新動向 ····················································································· 440
７.３.１

車載用回路基板材料の開発動向 ·················································································· 440

１

自動車のエレクトロニクス化の進歩 ········································································· 440２

車載用回路基板材料の必要特性 ·················································································· 441

７.３.２

車載用回路基板材料の改良研究 ·················································································· 442

１大電流対応基板の開発 ·································································································· 442２

低熱膨張基板の開発 ······································································································· 443

３

セラミック代替基板の開発 ·························································································· 444

第８章 高周波通信用基板材料の最新動向 ·········································································· 446
８.１ 低誘電率材料 ······················································································································· 446８.１.１

低誘電率基板材料の必要性 ·························································································· 446

１

電気信号の伝播速度の向上 ·························································································· 446２

伝送損失の低減 ··············································································································· 447

３

特性インピーダンスの制御 ·························································································· 448８.１.２

低誘電率基板材料の開発方法 ······················································································ 449

１

分極率の小さな原子(団)の導入 ·················································································· 449２

屈折率の小さな基の導入 ······························································································ 450３低極性化または非極性化 ······························································································ 451４嵩高い構造の導入 ··········································································································· 452

５

整列しにくい構造の導入 ······························································································ 452

６

分極し易い不純物の低減 ······························································································ 453

７吸水率の低減 ··················································································································· 453８.１.３

低誘電率基板用材料の開発 ·························································································· 454１

低誘電率基板用材料の開発目標値 ············································································· 454－xiii－

２８.２

低誘電性基板用材料として期待されるポリマー ···················································· 456

ポリマー別低誘電性材料の開発の現状 ·································································· 458

８.２.１

エポキシ樹脂の低誘電化の研究 ·················································································· 458１

低極性化(水酸基低減)による低誘電化 ····································································· 458２

低分極化(嵩高構造)による低誘電化 ········································································· 460

３

ポリフェニレンエーテル変性による低誘電化 ························································ 461

４

シアネート変性系による低誘電化 ············································································· 462５その他の低誘電性樹脂変性による低誘電化 ····························································· 462

６

硬化剤による低誘電化 ·································································································· 465

７

充填材および基材による低誘電化 ············································································· 468８

高速通信用基板の開発状況 ·························································································· 469

８.２.２

ポリイミドの低誘電化の研究 ······················································································ 473

１

ポーラス化による低誘電化 ·························································································· 473２脂環式構造による低誘電化 ·························································································· 474３嵩高い構造による低誘電化 ·························································································· 475４低極性化による低誘電化 ······························································································ 476５フッ素変性による低誘電化 ·························································································· 477

６

シロキサン基の導入による低誘電化 ········································································· 478

７

シアネート基の導入による低誘電化 ········································································· 479

８

ブタジエン変性による低誘電化 ·················································································· 480

９無機との複合による低誘電化 ······················································································ 480

８.２.３

ポリベンゾオキサゾールの低誘電化の研究 ····························································· 481

１

ポーラス化による低誘電化 ·························································································· 481２フッ素変性による低誘電化 ·························································································· 481３脂環式構造による低誘電化 ·························································································· 482

８.２.４

ポリエステルの低誘電化の研究 ·················································································· 482

１

液晶ポリマー ··················································································································· 482

２

その他のポリエステル ·································································································· 484

８.２.５

ポリオレフィンの低誘電化の研究 ············································································· 485

１

シクロオレフィンポリマー(ノルボルネン関連ポリマー) ··································· 485

２α-オレフィン共重合体 ································································································· 487

８.２.６

その他のポリマーの低誘電化の研究 ········································································· 488

１

ポリベンゾシクロブテン ······························································································ 488

２

ポリアリーレンエーテル ······························································································ 489

３

フッ素樹脂 ······················································································································· 489

４

ポリキノリン ··················································································································· 490

５シアネート樹脂 ··············································································································· 491

６

ポリフェニレンエーテル ······························································································ 492

７

ポリスチレン ··················································································································· 494

８ポリビニルベンジルエーテル ······················································································ 496

９

アセナフチレンポリマー ······························································································ 496

10

その他の芳香族ポリマー ······························································································ 497－xiv－

第９章 光・電気コンポジット基板材料の最新動向 ······················································ 500
９.１ 光・電気コンポジット基板の必要性 ······································································· 500
９.１.１

光・電気コンポジット基板の必要性 ········································································· 500

９.１.２

光・電気コンポジット基板の構造 ············································································· 501

９.１.３

光・電気コンポジット基板の作製方法 ····································································· 502

１

光導波路の各種作製方法 ······························································································ 502

２

POF と接続可能な大口径高分子光導波路の作製方法 ··········································· 502

３

自己形成光導波路の作製方法 ······················································································ 503

９.２

光・電気コンポジット基板の材料 ··········································································· 506

９.２.１

光導波路用材料 ··············································································································· 506

１

代表的な光導波路材料 ·································································································· 506

２

アクリル樹脂系光導波路材料 ······················································································ 507

３エポキシ樹脂系光導波路材料 ······················································································ 508

４ポリイミド系光導波路材料 ·························································································· 510（１）ＮＴＴの研究 ··········································································································· 510（２）新日本理化の研究 ··································································································· 512
５

ノルボルネン樹脂系光導波路材料 ············································································· 512

６

有機・無機ナノハイブリッド材料 ············································································· 514

９.２.２

光・電気コンポジット基板材料 ·················································································· 516

１

基板材料の種類 ··············································································································· 516

２

シングルモード低熱膨張ポリイミド光導波路フィルム ········································ 517

３

配線板レベル光伝送用ポリイミド光導波路フィルム ············································ 518

４

3 波長分割多重伝送用ポリイミド光導波路基板 ····················································· 520

５エポキシ樹脂系フレキシブル光導波路基板 ····························································· 520

６エポキシ樹脂系リジッド光導波路基板 ····································································· 521

７

O/E(光/電気)基板用光導波路フィルム ····································································· 521

９.３

光・電気コンポジット基板の実装 ··········································································· 522

９.３.１

実装製品 ···························································································································· 522

１

O/E リジッド基板と O/E フレキシブル基板 ···························································· 522２

光素子保護機構付き光電気混載基板 ········································································· 523

３

光入出力 BGA パッケージ ···························································································· 524

４

光送受信モジュール ······································································································· 525５ポリマー光導波路用コネクター ·················································································· 526

６

90 度光路変換素子 ········································································································· 526７多層光導波路基板 ··········································································································· 527

９.３.２

実装用材料の改良・開発 ······························································································ 527１

屈折率の改良 ··················································································································· 527

２

耐熱性の改良 ··················································································································· 529

３大型光配線材の開発 ······································································································· 530

４

高速、大容量伝送光導波路の開発 ············································································· 531

５大屈折率差(コア/クラッド)光導波路の開発 ··························································· 531

６

光損失が少ない光電気複合基板の製造方法 ····························································· 531

－xv－

７

薄くかつ耐屈曲性に優れた光電複合フレキシブル配線板 ··································· 532

９.３.３

関連製品 ···························································································································· 533

１

光導波路型波長合分波器 ······························································································ 533

２

波長合分波器フィルタ ·································································································· 534

３

光電気混載基板と光素子との光結合器 ····································································· 535

４

一軸延伸含フッ素ポリイミド薄膜偏光子 ································································· 535５銀ナノ粒子を用いたフレキシブル偏光板 ································································· 536

６カーボンナノチューブを分散した非線形光学素子 ················································ 537７

光部品用接着剤 ··············································································································· 538

第 10 章 モジュール基板材料の最新動向 ············································································ 540
10.１ 半導体パッケージ基板(インターポーザー) ······················································ 540
10.１.１

半導体パッケージの動向 ······························································································ 540

１

半導体パッケージの進歩 ······························································································ 540

２

ウェハレベルパッケージ(WLP)への進歩 ································································ 541

３

スタックド CSP から SiP への進歩 ··········································································· 541

４

シリコン貫通孔(TSV)技術の進歩 ·············································································· 542

10.１.２

半導体パッケージ基板の動向 ······················································································ 543

１

半導体パッケージ基板の必要性 ·················································································· 543

２

日本実装技術ロードマップ(JJTR)の予測 ································································ 544

３

パッケージ基板の生産の現況 ······················································································ 544

10.１.３

インターポーザー用基板材料の開発 ········································································· 544

１

日立化成工業の研究 ······································································································· 545

２住友ベークライトの研究 ······························································································ 549

３

パナソニック電工の研究 ······························································································ 550

４三菱ガス化学の研究 ······································································································· 552

５三井化学の研究 ··············································································································· 553

６

荒川化学工業の研究 ······································································································· 553

７

産業技術総合研究所の研究 ·························································································· 553

８東洋紡績の研究 ··············································································································· 554

９古河電気工業の研究 ······································································································· 554

10.１.４

インターポーザー用基板製品の開発 ········································································· 555１

日本電気の研究 ··············································································································· 555

２

凸版印刷の研究 ··············································································································· 556

３

産業技術総合研究所の研究 ·························································································· 556

４

デンソーの研究 ··············································································································· 558

５

富士通インターコネクトテクノロジーズの研究 ···················································· 558

６

イビデンの研究 ··············································································································· 559

７

新藤電子工業の研究 ······································································································· 559

８

日本シイエムケイの研究 ······························································································ 559

９

新光電気工業の研究 ······································································································· 560

10

利昌工業の研究 ··············································································································· 560

－xvi－

10.２

部品内蔵基板 ···················································································································· 561

10.２.１

部品内蔵基板の特徴とその課題 ·················································································· 561

１

部品内蔵基板の特徴 ······································································································· 562２

部品内蔵基板の課題 ······································································································· 562

10.２.２

部品内蔵基板の開発動向 ······························································································ 563

１

コンソーシアム ··············································································································· 563

２特許出願動向 ··················································································································· 563

10.２.３

部品内蔵基板メーカーの開発動向 ············································································· 564

１

日本シイエムケイの研究 ······························································································ 564

２

大日本印刷(DNP)の研究 ······························································································ 565

３

TNCSi の研究 ··················································································································· 566

４

太陽誘電の研究 ··············································································································· 567

５

フジクラの研究 ··············································································································· 567

６

沖プリンテッドサーキットの研究 ············································································· 568

７沖電気の研究 ··················································································································· 569

８TDK の研究 ······················································································································· 569

９デンソーの研究 ··············································································································· 570

10

新光電気工業の研究 ······································································································· 571

11

日立化成工業の研究 ······································································································· 572

12

パナソニック電工の研究 ······························································································ 572

13

パナソニックエレクトロニックデバイスの研究 ···················································· 573

14

ルネサスエレクトロニクスの研究 ············································································· 574

15村田製作所の研究 ··········································································································· 576

16

東芝の研究 ······················································································································· 577

17

ウェイスティ社の研究 ·································································································· 577

18

日東電工の研究 ··············································································································· 578

19

三井金属鉱業の研究 ······································································································· 578

20

日本特殊陶業の研究 ······································································································· 579

21

ソニーの研究 ··················································································································· 580

10.２.４

部品内蔵基板用部品の開発動向 ·················································································· 580

１

キャパシター ··················································································································· 580（１）無機系キャパシター ······························································································· 580（２）有機系キャパシター ······························································································· 581（３）その他のキャパシター ·························································································· 582
２

抵抗体 ································································································································ 583（１）フィルム状抵抗体 ··································································································· 583（２）抵抗ペースト ··········································································································· 584（３）その他抵抗体 ··········································································································· 584
３

インダクター ··················································································································· 584

４

封止用シート材料 ··········································································································· 585－xvii－

第 11 章 結語 ········································································································································ 587
11.１ 半導体封止材料関連分野の動向 ·············································································· 587
11.１.１

市場動向 ···························································································································· 587

11.１.２

開発動向のまとめ ··········································································································· 58811.２

電子回路基板関連分野の動向 ··················································································· 589

11.２.１

市場動向 ···························································································································· 589

１

回路基板 ···························································································································· 589

２積層基板 ···························································································································· 590

11.２.２

開発動向のまとめ ··········································································································· 591

11.３

おわりに ······························································································································ 592

略 語 表 ···················································································································································· 593
参考文献 ···················································································································································· 596－xviii－