半導体用およびプリント配線板用の高分子材料― 各社の技術・製品動向 ―2008年8月発行
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言 ··················································································································································· 1

第１章

市 場 動 向 ···························································································································· 2

１.１

電子産業の市場動向 ·················································································································· 2

１.１.１

情報通信産業の推移 ················································································································ 2

１.１.２

主要電子機器の動向 ················································································································ 2

１.１.３

電子部品動向···························································································································· 3１.２

関連主要製品の市場動向 ·········································································································· 4

１.２.１

自動車産業の動向 ···················································································································· 4

１.２.２

携帯電話の市場および技術動向 ···························································································· 5

１.２.３

パソコン···································································································································· 6

１.２.４

薄型テレビ································································································································ 7

１.３

半導体の市場動向 ······················································································································ 8

１.３.１

半導体生産動向························································································································ 8

１.３.２

半導体製造関係の動向 ············································································································ 9

１.４電子基板の市場動向 ················································································································ 11

１.４.１

日本市場·································································································································· 11

１.４.２

世界市場·································································································································· 13

第２章

半導体、プリント配線板の技術動向 ··········································································· 14

２.１

半導体の技術動向 ···················································································································· 14

２.１.１

微細化技術の動向 ·················································································································· 14(1)

ITRSの微細化のロードマップ ······························································································ 14(2)業界の開発動向 ······················································································································ 14(3)

国を挙げての半導体開発体制······························································································· 15

２.１.２

将来の半導体技術 ·················································································································· 16(1)

ハフニウムベースのトランジスタ······················································································· 16(2)カーボンナノチューブ ·········································································································· 16(3)折り曲げ、伸縮が可能なIC··································································································· 17(4)ルテニウム被膜による銅配線······························································································· 17２.１.３300mmウエハと450mmウエハ···························································································· 17２.２半導体実装技術の動向 ············································································································ 18

２.２.１

パッケージ動向······················································································································ 18(1)高密度化のロードマップ ······································································································ 18(2)

SOP/QFP/QFN ························································································································· 19(3)

BGA/CSP ································································································································· 19(4)

ウエハレベルパッケージの動向··························································································· 19－i－２.２.２３次元実装技術の動向 ·········································································································· 20(1)

スタックドCSPからSiPへ······································································································ 20(2)技術開発動向 ·························································································································· 22(3)シリコン貫通孔技術 ·············································································································· 23

２.３

材料技術と課題 ························································································································· 24２.３.１

小型化・薄型化への対応 ······································································································ 24２.３.２

耐熱性と膨張係数の課題 ······································································································ 25

２.４

プリント配線板の技術動向 ··································································································· 26

２.４.１

概要 ········································································································································· 26

２.４.２

技術ロードマップ ·················································································································· 27

２.４.３

実装技術動向および課題 ······································································································ 28(1)基板の熱膨張率と曲げ弾性係数··························································································· 28(2)基板材料の課題・要求特性··································································································· 28(3)

材料技術動向 ·························································································································· 29(4)フレキシブル基板の技術動向······························································································· 29

第３章

半導体封止用高分子材料の動向····················································································· 30

３.１

エポキシ樹脂およびその他の樹脂 ······················································································ 30

３.１.１

半導体パッケージの構成とエポキシ樹脂··········································································· 30

３.１.２

主なエポキシ樹脂 ·················································································································· 30

３.１.３

市場業界動向·························································································································· 32

３.１.４

耐熱性の向上·························································································································· 36

３.１.５

強靭性の向上·························································································································· 38

３.１.６

高熱伝導化······························································································································ 42３.１.７

低収縮化の検討······················································································································ 44

３.１.８

低粘度化·································································································································· 45

３.１.９

硬化性、密着性などの特性向上 ·························································································· 47

３.１.10

LED用エポキシ樹脂 ·············································································································· 48

３.１.11ポリイミド、シリコーン樹脂、熱可塑性樹脂 ··································································· 51

３.２

エポキシ樹脂封止材料 ············································································································ 54

３.２.１

封止材料の市場動向と技術課題 ·························································································· 54

３.２.２

封止の目的と材料構成 ·········································································································· 54

３.２.３

技術開発の歴史と現状 ·········································································································· 57

３.２.４

技術課題·································································································································· 59

３.２.５

耐はんだ対応材料の動向 ······································································································ 62

３.２.６

環境対応材料の開発動向 ······································································································ 65

３.２.７

先端パッケージ用封止材料 ·································································································· 69

３.２.８

高熱伝導封止材······················································································································ 75

３.２.９

透明エポキシ封止材料 ·········································································································· 77

－ii－

３.３

半導体成形技術の動向 ············································································································ 78

３.３.１

トランスファー成形 ·············································································································· 78

３.３.２

圧縮成形·································································································································· 79

３.３.３

射出成形·································································································································· 81

３.４

エポキシ樹脂用硬化剤と硬化促進剤の動向 ····································································· 82

３.４.１

フェノール系硬化剤 ·············································································································· 82(1)

最近の代表的組み合わせ ······································································································ 82(2)分子量分布集約ノボラック··································································································· 83(3)耐はんだ性に難燃性付与の硬化剤······················································································· 84

３.４.２

酸無水物系硬化剤 ·················································································································· 85(1)

種類と用途······························································································································ 85(2)

開発動向·································································································································· 85

３.４.３

アミン硬化剤·························································································································· 86(1)

種類と特性、用途 ·················································································································· 86(2)

開発動向·································································································································· 86

３.４.４

硬化促進剤······························································································································ 87(1)アミン化合物 ·························································································································· 87(2)

イミダゾール化合物 ·············································································································· 87(3)リン系化合物 ·························································································································· 88

３.４.５

潜在性促進剤·························································································································· 89(1)マイクロカプセル化および包接技術 ··················································································· 89(2)

開発動向·································································································································· 90

３.４.６硬化触媒によるTgレス化······································································································ 92

第４章

液状封止材の動向 ················································································································· 93

４.１

パッケージの変遷と液状封止材 ··························································································· 93

４.２

液状封止材の概要と動向 ········································································································ 94

４.２.１

種類 ········································································································································· 94

４.２.２

材料の基本構成······················································································································ 94

４.３

グラブトップ材料 ···················································································································· 94

４.３.１

要求特性·································································································································· 94

４.３.２

手法および技術動向 ·············································································································· 94(1)

貯蔵安定性の改善 ·················································································································· 94(2)耐湿性······································································································································ 95(3)

チキソトロピー性 ·················································································································· 95(4)低弾性率と低熱膨張化 ·········································································································· 95

４.４

アンダーフィル材料の動向 ··································································································· 96

４.４.１

アンダーフィル技術の特徴 ·································································································· 96４.４.２

要求特性·································································································································· 97－iii－

４.４.３

キャピラリーアンダーフィル材料の構成と動向 ······························································· 99(1)

材料構成·································································································································· 99(2)流動特性とボイド ·················································································································· 99(3)硬化性の向上 ························································································································ 100(4)低応力化································································································································ 100(5)高熱伝導化···························································································································· 102４.４.４

鉛フリーはんだおよびLow-k膜対応 ·················································································· 103

４.４.５

プリアプライドタイプ ········································································································ 104

４.４.６

WL-CSP用 ···························································································································· 106

４.４.７

リペアラブル・アンダーフィル材····················································································· 106

４.５

液状封止材の各社代表グレード ························································································· 108

第５章

半導体チップコーティング材料の動向 ···································································· 109５.１

表面保護コーティング材料 ································································································· 109

５.１.１

ポリイミドとポリベンズオキサゾールの概要 ································································· 109

５.１.２

ネガ型感光性ポリイミドの動向 ························································································ 111(1)

特徴········································································································································ 111(2)

PAA／光酸発生剤／架橋剤による改良 ············································································· 111(3)

ポリアミド酸／光塩基発生剤系と低温イミド化 ····························································· 112(4)

耐熱性と機械特性に優れたネガ型ポリイミド ································································· 112

５.１.３

ポジ型感光性ポリイミドの動向 ························································································ 113(1)

特徴········································································································································ 113(2)

ポリアミド酸／溶解抑止剤系····························································································· 113(3)

オルソニトロベンジルエステル系····················································································· 114(4)フェノール水酸基含有ポリアミド酸系 ············································································· 114(5)

ポリエステルイミド ············································································································ 115

５.１.４

ポリベンズオキサゾール ···································································································· 115(1)

特徴········································································································································ 115(2)

ポリベンズオキサゾールの実用化····················································································· 117(3)

半脂環式感光性PBO ············································································································ 118(4)

工程簡略化および新規溶解抑止剤····················································································· 118(5)低温環化PBO ························································································································ 119

５.１.５

低温硬化タイプの開発動向 ································································································ 120(1)

住友ベークライト ················································································································ 120(2)

東レ········································································································································ 121(3)

日立化成工業 ························································································································ 121(4)

京セラケミカル ···················································································································· 121(5)

旭化成エレクトロニクス ···································································································· 122

５.１.６

各社の代表グレード ············································································································ 122

－iv－

５.２

反応現像画像形成による感光性化技術 ············································································ 122

５.２.１

エンジニアリングプラスチックによるRDP····································································· 122

５.２.２

ポリ乳酸によるRDP············································································································ 124

５.３

ウエハレベルパッケージ再配線用樹脂 ············································································ 124５.３.１

構造および技術動向 ············································································································ 124(1)カシオ計算機とルネサステクノロジ ················································································· 125(2)

古河電気工業 ························································································································ 126(3)

富士通···································································································································· 126(4)

米Tessera Technologies社 ······································································································ 126(5)

ザイキューブ ························································································································ 127

５.３.２

再配線用樹脂························································································································ 127(1)

日本電気と住友ベークライト····························································································· 127(2)

京セラケミカル ···················································································································· 127(3)旭硝子···································································································································· 127(4)

旭化成···································································································································· 127(5)

東レ········································································································································ 128(6)

ローム・アンド・ハース電子材料····················································································· 128

５.３.３

ウエハレベルパッケージの新技術····················································································· 128(1)

ウエハレベルMEMSパッケージ ························································································· 128(2)印刷工法によるウエハレベルパッケージ ········································································· 129

第６章

半導体用ペースト、フィルム ······················································································· 130

６.１

ダイボンディングの技術動向 ····························································································· 130

６.１.１

ダイボンディング接続法の種類と特徴············································································· 130

６.１.２

パッケージ動向と樹脂接合材料への要求········································································· 130

６.２

ダイボンディングペースト ································································································· 131６.２.１

概要および課題···················································································································· 131(1)

概要········································································································································ 131(2)

技術課題································································································································ 132

６.２.２

耐はんだリフロー性ペーストの開発················································································· 132(1)

技術手法································································································································ 132(2)

技術開発動向 ························································································································ 133

６.２.３

高熱伝導ペーストの開発 ···································································································· 134(1)

技術手法································································································································ 134(2)

技術開発動向 ························································································································ 134

６.２.４

印刷ダイボンドペーストの開発 ························································································ 135(1)

技術要求································································································································ 135(2)

開発動向································································································································ 135

６.２.５

各社代表グレード ················································································································ 137

－v－

６.３

ダイボンディングフィルム ································································································· 138

６.３.１

概要 ······································································································································· 138(1)構造と市場···························································································································· 138(2)要求特性································································································································ 138

６.３.２

ポリイミド系の動向 ············································································································ 139(1)

日立化成工業 ························································································································ 139(2)三井化学································································································································ 140６.３.３

エポキシ系の動向 ················································································································ 140(1)

山形大学································································································································ 140(2)

日立化成工業 ························································································································ 141(3)

リンテック···························································································································· 141(4)住友ベークライト ················································································································ 142

６.３.４

ダイシング・ダイボンディング一体型フィルム ····························································· 142(1)

信頼性向上と工数低減 ········································································································ 142(2)

技術開発動向 ························································································································ 142

６.４

バックグラインドテープとダイシングテープ ······························································· 146

６.４.１

BGテープ······························································································································ 146(1)

概要と市場···························································································································· 146(2)

メーカーの開発動向 ············································································································ 146

６.４.２

DCテープ······························································································································ 147(1)

DCテープの概要と市場······································································································· 147(2)

メーカーの開発動向 ············································································································ 148

６.５

実装用フィルム ······················································································································· 149

６.５.１

LOCテープ ··························································································································· 149(1)

LOCテープの概要 ················································································································ 149(2)

メーカーの開発動向 ············································································································ 149

６.５.２

TABおよびCOFテープ ········································································································ 150(1)構造と市場···························································································································· 150(2)

フィルム素材の動向 ············································································································ 152(3)

フィルムメーカーの動向 ···································································································· 153(4)

技術開発動向 ························································································································ 155

第７章

層間絶縁膜の動向 ··············································································································· 157

７.１

LSI多層配線技術と層間絶縁膜 ··························································································· 157

７.１.１

伝送の遅延問題···················································································································· 157

７.１.２

層間絶縁膜の低誘電率化 ···································································································· 157

７.２

Low-k膜の開発経緯 ················································································································ 157

７.３

半導体メーカーの適用動向 ································································································· 159(1)

NEC、NECエレクトロニクス································································································· 159(2)

ソニー········································································································································ 159(3)

富士通········································································································································ 159

－vi－

(4)

ルネサステクノロジ ················································································································ 160(5)AMD、IBM ······························································································································· 160(6)TSMC(台)································································································································· 160(7)

UMC(台)··································································································································· 160(8)その他········································································································································ 160

７.４材料の開発動向 ······················································································································· 161

７.４.１

有機ポリマー························································································································ 161(1)

架橋ポリフェニレン系 ········································································································ 161(2)ポリイミド系 ························································································································ 162(3)

ポリアリルエーテルによるLow-k化 ·················································································· 163(4)ベンゾオキサゾール ············································································································ 164(5)フッ素系ポリマー ················································································································ 164(6)

その他の有機ポリマー ········································································································ 165

７.４.２

シリカガラス系···················································································································· 166

７.４.３

ボラジン系高分子 ················································································································ 166

７.４.４

ポーラスシリカ系 ················································································································ 168

７.４.５

メチルシルセスキオキサン系 ···························································································· 170

第８章

異方導電性材料、等方導電材料··················································································· 173

８.１

異方導電フィルム ·················································································································· 173

８.１.１

ACFの市場と技術動向 ········································································································ 173(1)

ACFの市場 ···························································································································· 173(2)接合の原理···························································································································· 173(3)

材料の構成および要求特性································································································· 174

８.１.２

技術開発動向························································································································ 175(1)

日立化成工業 ························································································································ 175(2)

ソニーケミカル＆インフォメーションズ ········································································· 176

８.１.３

その他の開発動向 ················································································································ 178

８.２

異方導電接着剤 ······················································································································· 182

８.２.１

特徴 ······································································································································· 182

８.２.２

技術開発動向························································································································ 182

８.３

等方性導電接着剤 ·················································································································· 184

８.３.１

市場と要求特性···················································································································· 184(1)

目標は｢はんだ代替｣ ············································································································ 184(2)導電性接着剤の構成 ············································································································ 185８.３.２

特性向上検討の動向 ············································································································ 186(1)

バインダー樹脂 ···················································································································· 186(2)

ナノ金属粒子 ························································································································ 186

８.３.３

各社開発動向························································································································ 187

８.３.４

NEDO｢高温はんだ代替技術開発｣プロジェクト······························································ 190

－vii－

第９章

車載用電子材料の動向 ····································································································· 191

９.１

自動車産業とカーエレクトロニクス ················································································ 191

９.１.１

カーエレクトロニクスの動向 ···························································································· 191

９.１.２

車載半導体市場が伸びる ···································································································· 192

９.２

半導体への要求特性と開発動向 ························································································· 193

９.２.１

車載用半導体への要求特性 ································································································ 193

９.２.２

エポキシ封止材の開発動向 ································································································ 195

９.３

車載用基板の要求特性と開発動向 ···················································································· 195

９.３.１

車載用基板への要求動向 ···································································································· 195

９.３.２

車載用基板の技術開発動向 ································································································ 196

第１０章

環境対応対策材料 ············································································································· 200

１０.１

地球環境問題の現状と対応状況 ······················································································· 200

１０.１.１

環境問題の歴史と現状······································································································· 200

１０.１.２

環境規制と対応状況··········································································································· 201

１０.２

難燃系エポキシ樹脂 ············································································································· 204

１０.２.１

リン含有型 ·························································································································· 204

１０.２.２ビフェニルアラルキル型··································································································· 204

１０.２.３

その他の難燃対応エポキシ······························································································· 205

１０.３

難燃対応樹脂·························································································································· 207

１０.３.１

ポリベンゾオキサジン······································································································· 207

１０.３.２アミノトリアジンノボラック樹脂 ··················································································· 207

１０.３.３

ホスファゼン誘導体··········································································································· 208

１０.４

環境対応封止材料 ················································································································· 209

１０.４.１

自己消火性エポキシ樹脂組成物 ······················································································· 209

１０.４.２

封止材メーカーの開発動向······························································································· 211

１０.５

環境対応型プリント配線板 ································································································ 214

１０.５.１

概要 ······································································································································ 214

１０.５.２

配線板用環境対応エポキシ樹脂の開発 ··········································································· 214

１０.５.３

難燃剤・難燃化技術の動向······························································································· 215

１０.５.４基板メーカーのハロゲンフリー代表的グレード···························································· 217

１０.５.５

FPCのハロゲンフリー化··································································································· 217

１０.６

リサイクル・リワーク技術およびバイオ由来素材 ····················································· 218

１０.６.１

リワーク可能な光架橋硬化樹脂 ······················································································· 218

１０.６.２エポキシ樹脂のリサイクル······························································································· 218

１０.６.３

熱可塑プリント基板のリサイクル ··················································································· 219

１０.６.４

植物由来のエポキシ樹脂··································································································· 219

１０.６.５

３官能アクリレートの分解······························································································· 220

１０.６.６

バイオマス由来熱硬化性樹脂 ··························································································· 220

１０.６.７

亜臨界水によるFRPの分解 ······························································································· 221－viii－

第１１章

低誘電損失材料の動向···································································································· 222

１１.１

低誘電率、低誘電正接の必要性 ······················································································· 222

１１.１.１

プリント配線板における伝送損失の理論 ······································································· 222

１１.１.２材料の対応技術 ·················································································································· 223

１１.２

低誘電化の開発歴史と現状 ································································································ 224

１１.３

エポキシ樹脂の低誘電率化 ································································································ 224

１１.３.１

低誘電率化の理論 ·············································································································· 224

１１.３.２

技術開発動向 ······················································································································ 225(1)

新規高芳香族性ビフェノール／エポキシ ········································································· 225(2)

芳香族オレフィンオリゴマーによる改質 ········································································· 225(3)

チタニアハイブリッドによる低誘電化 ············································································· 225(4)β-メチル基置換型エポキシ樹脂······················································································· 226(5)

ポリフェニレン骨格の導入································································································· 226

１１.４

ポリイミドの低誘電化 ········································································································ 227

１１.４.１

低誘電率化の理論 ·············································································································· 227

１１.４.２

技術開発動向 ······················································································································ 227(1)フッ素化ポリイミド ············································································································ 227(2)

フルオレン骨格による低誘電化························································································· 228(3)

アダマンタン骨格による低誘電化····················································································· 228(4)

多孔質ポリイミドによる低誘電化····················································································· 229

１１.５

ポリフェニレンエーテルによる低誘電化 ······································································ 230

１１.５.１変性PPE ································································································································ 230

１１.５.２

熱硬化型PPE ························································································································ 232

１１.６

ポリオレフィンによる低誘電化 ······················································································· 233

１１.６.１

ポリオレフィン共重合体··································································································· 233

１１.６.２環状オレフィン ·················································································································· 233

１１.７

液晶ポリマーによる低誘電化 ··························································································· 234

１１.８

空気内包、粒子などによる低誘電化··············································································· 235

１１.８.１

空気内包メタセン ·············································································································· 235

１１.８.２

中空粒子 ······························································································································ 236

１１.８.３

有機ウイスカー ·················································································································· 236

１１.８.４

シリカ多孔体 ······················································································································ 236

１１.９

マレイミドスチリル樹脂 ···································································································· 237

１１.10

多官能芳香族ビニル ············································································································· 237

１１.11

ベンゾシクロブテン ············································································································· 238

１１.12

各社の代表的な低誘電基板特性 ······················································································· 238

第１２章

プリント配線板の動向···································································································· 239

１２.１

プリント配線板の種類 ········································································································ 239

１２.１.１絶縁体の種別と構造による分類 ······················································································· 239

１２.１.２

主な基板製造技術 ·············································································································· 239

－ix－

１２.２

市場動向と技術動向 ············································································································· 239

１２.２.１

市場動向と基板メーカー··································································································· 239

１２.２.２

技術動向と要求特性··········································································································· 241

１２.３

基材の動向 ······························································································································ 243

１２.３.１

ガラスクロスの技術動向··································································································· 243

１２.３.２超極薄ガラスクロスの動向······························································································· 244

１２.３.３極薄プリプレグの開発······································································································· 246

１２.４

フィルム基材の動向 ············································································································· 247

１２.４.１耐熱性フィルム ·················································································································· 247

１２.４.２芳香族アラミド繊維··········································································································· 247

１２.４.３

液晶ポリマー ······················································································································ 248

１２.４.４フッ素繊維シート ·············································································································· 250

１２.４.５

PBO繊維シート ·················································································································· 251

１２.５

マトリックスレジンの動向 ································································································ 251

１２.５.１

プリント配線板への要求特性とマトリックスレジン ···················································· 251

１２.５.２フェノール樹脂基板··········································································································· 252

１２.５.３エポキシ樹脂基板 ·············································································································· 253

１２.５.４ポリイミド、ビスマレイミドトリアジン樹脂基板························································ 255

１２.５.５ベンゾシクロブテン樹脂··································································································· 259

１２.５.６

シアネート樹脂 ·················································································································· 259

１２.５.７フッ素系樹脂 ······················································································································ 260

１２.５.８

ポリフェニレンエーテル樹脂 ··························································································· 261

１２.５.９

その他の樹脂 ······················································································································ 262

１２.６

低熱膨張基板の開発動向 ···································································································· 264

１２.６.１

低熱膨張の目的 ·················································································································· 264

１２.６.２

開発動向 ······························································································································ 264

１２.７

耐熱性基板の技術動向 ········································································································ 266

１２.７.１耐熱性基板の必要性··········································································································· 266

１２.７.２

開発動向 ······························································································································ 266

１２.８

高熱伝導基板·························································································································· 267

１２.８.１

高熱伝導の必要性 ·············································································································· 267

１２.８.２

開発動向 ······························································································································ 267１２.９

超極薄多層基板 ····················································································································· 269

１２.10

環境対応配線板 ····················································································································· 269

第１３章

ビルドアップ基板、インターポーザ基板他の動向 ··········································· 270

１３.１

ビルドアップ多層プリント配線板 ··················································································· 270

１３.１.１

概要および市場動向··········································································································· 270

１３.１.２

ビルドアップ多層プリント配線板の種類と特徴···························································· 271(1)

導体パターンの形成方法 ···································································································· 271

－x－

(2)

プロセスの種類と特徴 ········································································································ 272(3)

コア材料の動向 ···················································································································· 274

１３.１.３

ビルドアップ多層材料の要求動向 ··················································································· 274(1)

ガラス転移点(Tg)················································································································ 274(2)

誘電率···································································································································· 274(3)誘電正接································································································································ 274(4)熱膨張係数(CTE)················································································································· 275(5)はんだ耐熱性 ························································································································ 275(6)銅箔引き剥がし強さ ············································································································ 275

１３.１.４

代表的ビルドアップ基板の技術動向 ··············································································· 275(1)

熱硬化性樹脂法 ···················································································································· 275(2)

樹脂付き銅箔による方法 ···································································································· 277(3)

めっき法によるその他の方法····························································································· 277(4)導電性ペーストを用いる方法····························································································· 278(5)組み合わせによる方法 ········································································································ 280(6)

全層一括積層方法 ················································································································ 281(7)

その他ビルドアップ基板メーカー····················································································· 283

１３.１.５

ビルドアップ基板用樹脂の動向 ······················································································· 283(1)

味の素｢ABFシリーズ｣········································································································· 283(2)

ポリエーテルエーテルケトン····························································································· 284(3)ポリイミド···························································································································· 285(4)

樹脂付き銅箔 ························································································································ 287(5)絶縁樹脂の低誘電化 ············································································································ 288

１３.２

インターポーザ用パッケージ基板の技術動向 ····························································· 289

１３.２.１

概要 ······································································································································ 289

１３.２.２

インターポーザの動向······································································································· 289(1)

市場動向································································································································ 290(2)テープ構造インターポーザの技術動向 ············································································· 290(3)

リジッド構造インターポーザと要求特性 ········································································· 291

１３.２.３

インターポーザの開発動向······························································································· 293(1)

NEC········································································································································ 293(2)

凸版印刷································································································································ 294(3)

産業技術総合研究所 ············································································································ 294(4)

デンソーとNECエレクトロニクス····················································································· 295(5)

富士通インターコネクトテクノロジーズ ········································································· 296(6)沖電気工業···························································································································· 296(7)

松下電子部品 ························································································································ 296

１３.２.４

インターポーザ用基板材料······························································································· 296(1)

ビスマレイミドトリアジン································································································· 296(2)三井化学································································································································ 297

－xi－

(3)

タムラ化研···························································································································· 297(4)東洋紡績································································································································ 298

１３.２.５

インターポーザ用積層板の動向 ······················································································· 298(1)

住友ベークライト ················································································································ 298(2)

日立化成工業 ························································································································ 299(3)

松下電工································································································································ 300(4)インターポーザメーカー ···································································································· 300

１３.３

部品内蔵基板の動向 ············································································································· 301

１３.３.１

概要 ······································································································································ 301

１３.３.２

開発動向 ······························································································································ 303

１３.３.３

開発実用化動向 ·················································································································· 303

１３.３.４内蔵基板用材料の開発動向······························································································· 308

１３.４

放熱性基板の動向 ················································································································· 309

１３.４.１

高発熱化する電子デバイス······························································································· 309

１３.４.２放熱基板、材料の開発動向······························································································· 310(1)

高熱伝導樹脂の開発 ············································································································ 310(2)

各社放熱基板の開発動向 ···································································································· 311(3)放熱シート、基材などの開発····························································································· 314

第１４章

フレキシブル基板の動向 ······························································································· 317

１４.１

概要 ··········································································································································· 317

１４.１.１

市場動向 ······························································································································ 317

１４.１.２

分類と参入メーカー··········································································································· 318

１４.２

FPCの構造と最近の動向 ···································································································· 319

１４.３

FPCの課題と要求特性 ········································································································ 320

１４.３.１

FPCの課題 ·························································································································· 320

１４.３.２

FPCの要求特性 ·················································································································· 321

１４.４

ベースフィルムの技術動向 ································································································ 322

１４.４.１

フィルムの種類と特性······································································································· 322

１４.４.２ポリイミドフィルム··········································································································· 322(1)

東レ・デュポン｢カプトン｣································································································· 323(2)

カネカ｢アピカル｣ ················································································································ 324(3)

宇部興産｢ユーピレックス｣································································································· 324

１４.４.３

液晶ポリマー ······················································································································ 324(1)

ジャパンゴアテックス ········································································································ 324(2)

クラレ···································································································································· 325(3)(旧)帝人アバンストフィルム····························································································· 325

１４.４.４

ポリエチレンナフタレート······························································································· 326

１４.４.５ポリイミドフィルム··········································································································· 326(1)

東邦大学································································································································ 326

－xii－

(2)

東洋紡績································································································································ 326(3)

東レ・デュポン ···················································································································· 327

１４.５

２層FPCの動向 ····················································································································· 327(1)

新日鐵化学································································································································ 328(2)

東洋紡績···································································································································· 328(3)

東レ ··········································································································································· 329(4)三井化学···································································································································· 329(5)東海ゴム工業···························································································································· 329(6)

米デュポン社···························································································································· 329(7)

信越化学工業···························································································································· 329

１４.６

３層FPCの動向 ····················································································································· 330(1)

京セラケミカル ························································································································ 330(2)

日本メクトロン ························································································································ 330(3)

ニッカン工業···························································································································· 330

１４.７

FPC基板の動向 ····················································································································· 331(1)

住友ベークライト ···················································································································· 331(2)

ソニーケミカル ························································································································ 331(3)

松下電工···································································································································· 332(4)

フジクラ···································································································································· 332

１４.８

新技術FPCの動向 ················································································································· 332

１４.９

FPC基材の動向 ····················································································································· 333

１４.10

カバーコート材の動向 ········································································································ 335

１４.10.１

カバーコート材料の概要··································································································· 335

１４.10.２

感光性カバーレイの開発動向 ··························································································· 335

１４.11

リジッドフレックス基板の動向 ······················································································· 337

１４.12

極薄プリント配線板の動向 ································································································ 338

１４.13

光・電気複合フレキシブル配線板 ··················································································· 339

結語 ··············································································································································· 341

参 考 文 献 ··············································································································································· 343－xiii－