lxiC[ksi-see: or sai-see:]• USB 3.1 camera series

Technical Manual
Version 2.02, January, 2024

1. Introduction
1.1.

About This Manual

Dear customer,
Thank you for purchasing a product from XIMEA.
We hope that this manual can answer your questions, but should you have any further questions or if you wish to claim aservice or warranty case, please contact your local dealer or refer to the XIMEA Support on our website:www.ximea.com/support
The purpose of this document is to provide a description of the XIMEA xiC-Series cameras and to describe the correct way to
install related software and drivers and run it successfully. Please read this manual thoroughly before operating your new
camera for the first time. Please follow all instructions and observe the warnings.
This document is subject to change without notice.

1.2.

About XIMEA

We develop, manufacture and market innovative camera solutions and imaging systems for integrators, OEMs, and the global
markets in general. Our history in research, development, and production dates back to 1992. From our locations in Slovakia,
Germany, and the US, and with a global distributor network, we offer our solutions to all types of companies and institutions
across every imaginable application field.
Industrial cameras, scientific cameras, custom engineering, imaging ecosystems as well as software and tools form theportfolio.
A 50/50 mix of custom projects and series production guarantees innovative, technology-driven developments, as well as
reliable supply and support.
We utilize the latest CMOS and sCMOS sensors combined with the fastest and highly efficient interfaces such as USB3,
Thunderbolt, and PCIe.
The robust camera packages are the smallest and lightest in class. The mechanical and electrical design aims for a highdegree of flexibility that facilitates all sorts of integrations.
Innovative cooling concepts and deep knowledge in sensor tuning, elevate the imaging performance.
The extensive software support spans across various platforms, operating systems, and programming environments. In
addition, we support generic camera interfaces and a multitude of vision libraries.
Technology-driven and always seeking innovative solutions, our creations are already solving future problems today.
We don‘t just make imaging systems - we invent them.

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1.2.1. Contact XIMEAXIMEA is a worldwide operating company

Headquarters
Sales worldwide

Sales America

R&D, Production

XIMEA GmbHAm Mittelhafen 1648155 Münster
Germany

XIMEA Corp.
12600 W Colfax Ave., Suite A-130
Lakewood, CO 80215
USA

XIMEA s.r.o.
Lesna 52
900 33 Marianka
Slovakia

Tel: +49 (251) 202 408-0
Fax: +49 (251) 202 408-99

Tel: +1 (303) 389-9838
Fax: +1 (303) 202-6350

Internet

www.ximea.com

General inquiries

info@ximea.com

Sales

sales@ximea.com

Supporthttps://www.ximea.com/support/wiki/allprod/Contact_Support

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1.3.

Standard Conformity

The xiC cameras have been tested using the following equipment:
Model option –UB (micro-B USB 3.1 connector)•

A shielded USB 3.0 cable ref. CBL-U3-3M0 (3m)•A shielded I/O Sync cable ref. CBL-702-8P-SYNC-5M0 (5m)Model option – TC (Type C connector in USB 3.1 Gen 1 mode)•

A shielded USB 3.1 Type-C to A cable (1m)•A shielded I/O Sync cable ref. CBL-702-8P-SYNC-5M0 (5m)Model option –FV and – FL•

Camera is connected to Tegra TX1 processor board via TX1CB-PHOXI-BRD and CBL-MQ-FL-0M1. Whole setup is housedin AW16918ESS enclosure, with modified end panels to hold camera and provide access to power connector and Ethernet
connector. System is Linux operating system controlled over Ethernet from remote computer. For more information, pleasecontact our support: https://www.ximea.com/support/wiki/allprod/Contact_Support

Warning: Changes or modifications to the product or the environment may render it ineligible for operation under CE, FCC orother jurisdictions. XIMEA recommends using the above configuration to ensure compliance with the following standards.
Please refer also to chapter 1.3.8.

1.3.1. CE Conformity

The xiC cameras described in this manual comply with the requirements of the•

EC EMC Directive 2014/30/EU electromagnetic compatibility of equipment

1.3.2. For customers in the US: FCC Conformity

The xiC cameras described in this manual have been tested and found to comply with Part 15 of the FCC rules, which states
that:
Operation is subject to the following two conditions:•This device may not cause harmful interference, and•This device must accept any interference received, including interference that may cause undesired operation.

This equipment has been tested and found to comply with the limits for Class A digital device, pursuant to part 15 of the FCC
rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated
in a commercial environment. This equipment generates, uses and can radiate radio frequency energy and, if not installed andused in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of thisequipment in a residential area is likely to cause harmful interference in which case the users will be required to correct theinterference at their own expense.
You are cautioned that any changes or modifications not expressly approved in this manual could void your authority to operate
this equipment under above jurisdictions. The shielded interface cable recommended in this manual must be used with thisequipment to comply with the limits for a computing device pursuant to Subpart J of Part 15 of FCC Rules.
Please refer also to chapter 1.3.8 Camera Sub-Assemblies.

1.3.3. For customers in Canada
The xiC cameras comply with the Class A limits for radio noise emissions set out in Radio Interference Regulations.
Please refer also to chapter 1.3.8 Camera Sub-Assemblies.

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1.3.4. RoHS Conformity
The xiC cameras comply with the requirements of the RoHS (Restriction of Hazardous Substances) Directive
2011/65/EU.

1.3.5. WEEE Conformity
The xiC cameras comply with the requirements of the WEEE (waste electrical and electronic equipment) Directive
2012/19/EU.

1.3.6. AIA standard USB3 Vision
The xiC cameras are compliant with the USB 3.0 SuperSpeed specification and are designed to becompliant with the AIA USB3 Vision standard.

1.3.7. GenICam GenTL API

GenICam standard transport layer interface, grabbing images. GenICam/GenTL provides an agnostic transport layer interface
to acquire images or other data and to communicate with a device. Each XIMEA camera can be GenTL Producer.

1.3.8. Camera Sub-Assemblies
The FL and FV camera models are "semi" housed with flex ribbon cable interfaces. As such, these devices do not comply with
CE/FCC/Class A limits (Canada) regulations. The system integrator (customer) is liable for compliance with CE/FCC/ Class A
limits (Canada) regulations.

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1.4.

Helpful Links•XIMEA Homepage

http://www.ximea.com/•

XIMEA Software Package

https://www.ximea.com/support/wiki/apis/APIs#Software-packages•

Frequently Asked Questions

http://www.ximea.com/support/wiki/allprod/Frequently_Asked_Questions•

Knowledge Base

http://www.ximea.com/support/wiki/allprod/Knowledge_Base•

Vision Libraries

http://www.ximea.com/support/projects/vision-libraries/wiki•

XIMEA Registration

http://www.ximea.com/en/products/register•

XIMEA Support

https://www.ximea.com/support/wiki/allprod/Contact_Support•

XIMEA General Terms &Conditions

http://www.ximea.com/en/corporate/generaltc

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1.5.
1.

Table of Contents
Introduction ................................................................................................................................................................ 2
1.1.

About This Manual ............................................................................................................................................. 2

1.2.

About XIMEA ..................................................................................................................................................... 2

1.2.1.
1.3.

2.

3.

Contact XIMEA .......................................................................................................................................... 3

Standard Conformity .......................................................................................................................................... 4

1.3.1.

CE Conformity ........................................................................................................................................... 4

1.3.2.

For customers in the US: FCC Conformity ................................................................................................... 4

1.3.3.

For customers in Canada ........................................................................................................................... 4

1.3.4.

RoHS Conformity ....................................................................................................................................... 5

1.3.5.

WEEE Conformity ...................................................................................................................................... 5

1.3.6.

AIA standard USB3 Vision .......................................................................................................................... 5

1.3.7.

GenICam GenTL API .................................................................................................................................. 5

1.3.8.

Camera Sub-Assemblies ........................................................................................................................... 5

1.4.

Helpful Links ..................................................................................................................................................... 6

1.5.

Table of Contents............................................................................................................................................... 7

xiC Camera Series .................................................................................................................................................... 14
2.1.

What is xiC ...................................................................................................................................................... 14

2.2.

Advantages ..................................................................................................................................................... 14

2.3.

USB3 Vision Camera Applications ..................................................................................................................... 15

2.4.

Common features ............................................................................................................................................ 15

2.5.

Model Nomenclature ........................................................................................................................................ 16

2.6.

Models Overview ............................................................................................................................................. 17

2.7.

Accessories ..................................................................................................................................................... 18

Hardware Specification ............................................................................................................................................. 19
3.1.

Power Supply .................................................................................................................................................. 19

3.2.

General Specification ....................................................................................................................................... 19

3.2.1.

Environment ........................................................................................................................................... 19

3.2.2.

Firmware / Host driver / API features ........................................................................................................ 19

3.3.

Lens Mount ..................................................................................................................................................... 20

3.3.1.
3.4.

Screws ................................................................................................................................................... 20

Optical path ..................................................................................................................................................... 21

3.4.1.

Filter glasses .......................................................................................................................................... 21

3.4.2.

Monochrome and near infrared extended camera models .......................................................................... 21

3.4.3.

Color camera models .............................................................................................................................. 22

3.5.

Model Specific Characteristics .......................................................................................................................... 23

3.5.1.

MC023xG-SY ......................................................................................................................................... 23

3.5.1.1.

Sensor and camera parameters ...................................................................................................... 23

3.5.1.2.

Quantum efficiency curves [%] ........................................................................................................ 24

3.5.1.3.

Drawings MC023xG-SY-TC (C-mount [with C/CS mount module B]) .................................................. 24

3.5.1.4.

Drawings MC023xG-SY-UB (C-mount [with C/CS mount module B]) .................................................. 25

3.5.1.5.

Drawings MC023xG-SY-FL (C-mount [with C/CS mount module B]) .................................................. 26

3.5.1.6.

Drawings MC023xG-SY-FV (C-mount [with C/CS mount module B]) .................................................. 27

3.5.1.7.

Referenced documents ................................................................................................................... 27

3.5.1.8.

Sensor features.............................................................................................................................. 27

3.5.2.

MC031xG-SY ......................................................................................................................................... 28

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3.5.2.1.

Sensor and camera parameters ...................................................................................................... 28

3.5.2.2.

Quantum efficiency curves [%] ........................................................................................................ 29

3.5.2.3.

Drawings MC031xG-SY-TC (C-mount [with C/CS mount module B]) .................................................. 30

3.5.2.4.

Drawings MC031xG-SY-UB (C-mount [with C/CS mount module B]) .................................................. 30

3.5.2.5.

Drawings MC031xG-SY-FL (C-mount [with C/CS mount module B]) .................................................. 31

3.5.2.6.

Drawings MC031xG-SY-FV (C-mount [with C/CS mount module B]) .................................................. 32

3.5.2.7.

Referenced documents ................................................................................................................... 32

3.5.2.8.

Sensor features.............................................................................................................................. 32

3.5.3.

MC050xG-SY ......................................................................................................................................... 33

3.5.3.1.

Sensor and camera parameters ...................................................................................................... 33

3.5.3.2.

Quantum efficiency curves [%] ........................................................................................................ 34

3.5.3.3.

Drawings MC050xG-SY-TC (C-mount [with C/CS mount module B]) .................................................. 35

3.5.3.4.

Drawings MC050xG-SY-UB (C-mount [with C/CS mount module B]) .................................................. 35

3.5.3.5.

Drawings MC050xG-SY-FL (C-mount [with C/CS mount module B]) .................................................. 36

3.5.3.6.

Drawings MC050xG-SY-FV (C-mount [with C/CS mount module B]) .................................................. 37

3.5.3.7.

Referenced documents ................................................................................................................... 37

3.5.3.8.

Sensor features.............................................................................................................................. 37

3.5.4.

MC089xG-SY ......................................................................................................................................... 38

3.5.4.1.

Sensor and camera parameters ...................................................................................................... 38

3.5.4.2.

Quantum efficiency curves [%] ........................................................................................................ 39

3.5.4.3.

Drawings MC089xG-SY-TC (C-mount [with C/CS mount module B]) .................................................. 40

3.5.4.4.

Drawings MC089xG-SY-UB (C-mount [with C/CS mount module B]) .................................................. 40

3.5.4.5.

Drawings MC089xG-SY-FL (C-mount [with C/CS mount module B]) .................................................. 41

3.5.4.6.

Drawings MC089xG-SY-FV (C-mount [with C/CS mount module B]) .................................................. 42

3.5.4.7.

Referenced documents ................................................................................................................... 42

3.5.4.8.

Sensor features.............................................................................................................................. 42

3.5.5.

MC124xG-SY ......................................................................................................................................... 43

3.5.5.1.

Sensor and camera parameters ...................................................................................................... 43

3.5.5.2.

Quantum efficiency curves [%] ........................................................................................................ 44

3.5.5.3.

Drawings MC124xG-SY-TC (C-mount [with C mount module B]) ....................................................... 45

3.5.5.4.

Drawings MC124xG-SY-UB (C-mount [with C mount module B]) ....................................................... 45

3.5.5.5.

Drawings MC124xG-SY-FL (C-mount [with C/CS mount module B]) .................................................. 46

3.5.5.6.

Drawings MC124xG-SY-FV (C-mount [with C mount module B])........................................................ 47

3.5.5.7.

Referenced documents ................................................................................................................... 47

3.5.5.8.

Sensor features.............................................................................................................................. 47

3.5.6.

MC161xG-SY ......................................................................................................................................... 48

3.5.6.1.

Sensor and camera parameters ...................................................................................................... 48

3.5.6.2.

Quantum efficiency curves [%] ........................................................................................................ 49

3.5.6.3.

Drawings MC161xG-SY-TC (C-mount [with C mount module B]) ....................................................... 50

3.5.6.4.

Drawings MC161xG-SY-UB (C-mount [with C mount module B]) ....................................................... 50

3.5.6.5.

Drawings MC161xG-SY-FL (C-mount [with C/CS mount module B]) .................................................. 51

3.5.6.6.

Drawings MC161xG-SY-FV (C-mount [with C mount module B])........................................................ 51

3.5.6.7.

Referenced documents ................................................................................................................... 52

3.5.6.8.

Sensor features.............................................................................................................................. 52

3.5.7.

MC161xG-SY-HDR.................................................................................................................................. 53

3.5.7.1.

Sensor and camera parameters ...................................................................................................... 53

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3.5.7.2.

Quantum efficiency curves [%] ........................................................................................................ 55

3.5.7.3.

Drawings MC161xG-SY-TC-HDR (C-mount [with C mount module B]) ............................................... 55

3.5.7.4.

Drawings MC161xG-SY-UB-HDR (C-mount [with C mount module B]) ............................................... 55

3.5.7.5.

Drawings MC161xG-SY-FL-HDR (C-mount [with C/CS mount module B]) .......................................... 55

3.5.7.6.

Drawings MC161xG-SY-FV-HDR (C-mount [with C mount module B]) ................................................ 55

3.5.7.7.

Referenced documents ................................................................................................................... 55

3.5.7.8.

Sensor features.............................................................................................................................. 55

3.5.8.

MC203xG-SY ......................................................................................................................................... 56

3.5.8.1.

Sensor and camera parameters ...................................................................................................... 56

3.5.8.2.

Quantum efficiency curves [%] ........................................................................................................ 57

3.5.8.3.

Drawings MC203xG-SY-TC (C-mount [with C mount module B]) ....................................................... 57

3.5.8.4.

Drawings MC203xG-SY-UB (C-mount [with C mount module B]) ....................................................... 57

3.5.8.5.

Drawings MC203xG-SY-FL (C-mount [with C/CS mount module B]) .................................................. 57

3.5.8.6.

Drawings MC203xG-SY-FV (C-mount [with C mount module B])........................................................ 57

3.5.8.7.

Referenced documents ................................................................................................................... 57

3.5.8.8.

Sensor features.............................................................................................................................. 58

3.5.9.

MC203xG-SY-HDR.................................................................................................................................. 59

3.5.9.1.

Sensor and camera parameters ...................................................................................................... 59

3.5.9.2.

Quantum efficiency curves [%] ........................................................................................................ 61

3.5.9.3.

Drawings MC203xG-SY-TC-HDR (C-mount [with C mount module B]) ............................................... 61

3.5.9.4.

Drawings MC203xG-SY-UB-HDR (C-mount [with C mount module B]) ............................................... 61

3.5.9.5.

Drawings MC203xG-SY-FL-HDR (C-mount [with C/CS mount module B]) .......................................... 61

3.5.9.6.

Drawings MC203xG-SY-FV-HDR (C-mount [with C mount module B]) ................................................ 61

3.5.9.7.

Referenced documents ................................................................................................................... 61

3.5.9.8.

Sensor features.............................................................................................................................. 61

3.5.10. MC245xG-SY ......................................................................................................................................... 62
3.5.10.1. Sensor and camera parameters ...................................................................................................... 62
3.5.10.2. Quantum efficiency curves [%] ........................................................................................................ 63
3.5.10.3. Drawings MC245xG-SY-TC (C-mount [with C mount module B]) ....................................................... 63
3.5.10.4. Drawings MC245xG-SY-UB (C-mount [with C mount module B]) ....................................................... 63
3.5.10.5. Drawings MC245xG-SY-FL (C-mount [with C/CS mount module B]) .................................................. 63
3.5.10.6. Drawings MC245xG-SY-FV (C-mount [with C mount module B])........................................................ 63
3.5.10.7. Referenced documents ................................................................................................................... 63
3.5.10.8. Sensor features.............................................................................................................................. 64
3.5.11. MC245xG-SY-HDR.................................................................................................................................. 65
3.5.11.1. Sensor and camera parameters ...................................................................................................... 65
3.5.11.2. Quantum efficiency curves [%] ........................................................................................................ 67
3.5.11.3. Drawings MC245xG-SY-TC-HDR (C-mount [with C mount module B]) ............................................... 67
3.5.11.4. Drawings MC245xG-SY-UB-HDR (C-mount [with C mount module B]) ............................................... 67
3.5.11.5. Drawings MC245xG-SY-FL-HDR (C-mount [with C/CS mount module B]) .......................................... 67
3.5.11.6. Drawings MC245xG-SY-FV-HDR (C-mount [with C mount module B]) ................................................ 67
3.5.11.7. Referenced documents ................................................................................................................... 67
3.5.11.8. Sensor features.............................................................................................................................. 67
3.6.

User interface – LEDs ...................................................................................................................................... 68

3.7.

xiC USB 3.1 Gen1 Type-C Interface .................................................................................................................. 69

3.7.1.

Type-C connector location ....................................................................................................................... 69

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3.7.2.
3.8.

Pinning................................................................................................................................................... 69

xiC USB 3.1 Gen1 micro-B Interface ................................................................................................................. 69

3.8.1.

USB 3.1 micro-B Location ....................................................................................................................... 70

3.8.2.

Pinning................................................................................................................................................... 70

3.9.

xiC Flex cable interface .................................................................................................................................... 71

3.9.1.

Flex Connection Location ......................................................................................................................... 71

3.9.2.

Pinning................................................................................................................................................... 71

3.9.3.

Inserting / detaching FPC cable................................................................................................................ 72

3.10. xiC Digital Input / Output (GPIO) Interface .......................................................................................................... 75
3.10.1. Location ................................................................................................................................................. 75
3.10.2. IO Connector Pinning .............................................................................................................................. 75
3.10.3. Optically isolated Digital Input .................................................................................................................. 75
3.10.3.1. Optically isolated Digital Input - General info .................................................................................... 75
3.10.3.2. Digital Input – signal levels ............................................................................................................. 76
3.10.3.3. Digital Input – Internal Schematic .................................................................................................... 77
3.10.3.4. Digital Input – Wiring ...................................................................................................................... 77
3.10.3.5. Digital Input – Timing ..................................................................................................................... 77
3.10.4. Optically isolated Digital Output ................................................................................................................ 78
3.10.4.1. Optically isolated Digital Output - General info .................................................................................. 78
3.10.4.2. Optically isolated Digital Output Delay .............................................................................................. 78
3.10.4.3. Optically isolated Digital Output – Internal schematic ........................................................................ 79
3.10.4.4. Digital Output – Wiring ................................................................................................................... 79
3.10.4.5. Digital Output – Timing ................................................................................................................... 84
3.10.5. Non-isolated Digital Lines (-UB and -TC only) ............................................................................................ 85
3.10.5.1. Non-isolated Digital Input/Output (INOUT) General info ...................................................................... 85
3.11. External power supply input (AUX) ..................................................................................................................... 85
3.12. Heat Dissipation ............................................................................................................................................... 86
3.13. CBL-U3-1M0 / CBL-U3-3M0 / CBL-U3-5M0 ..................................................................................................... 87
3.14. CBL-U3-3M0-ANG ........................................................................................................................................... 88
3.15. CBL-MQ-FL-0M1/CBL-MQ-FL-0M25 ................................................................................................................ 89
3.16. CBL-USB3FLEX-0M10 / CBL-USB3FLEX-0M25 / CBL-USB3FLEX-0M50............................................................. 89
3.17. BOB-MQ-FL .................................................................................................................................................... 90
3.18. CBL-702-8P-SYNC-5M0 .................................................................................................................................. 91
3.19. Tripod Adapter – MECH-MC-BRACKET-KIT........................................................................................................ 92
3.19.1. Dimensional drawings ............................................................................................................................. 92
3.20. USB 3 host adapters ........................................................................................................................................ 93
4.

Operation ................................................................................................................................................................. 94
4.1.

System Requirements ...................................................................................................................................... 94

4.1.1.

Software Requirements ........................................................................................................................... 94

4.1.2.

Hardware Requirements .......................................................................................................................... 94

4.2.

4.1.2.1.

System Configuration ..................................................................................................................... 94

4.1.2.2.

USB 3.1 Host Adapter .................................................................................................................... 95

4.1.2.3.

Cables ........................................................................................................................................... 95

Video Formats ................................................................................................................................................. 96

4.2.1.

Full Resolution ........................................................................................................................................ 96

4.2.2.

ROIs – Region of Interest ......................................................................................................................... 96

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4.2.3.

4.2.3.1.

Binning .......................................................................................................................................... 96

4.2.3.2.

Decimation .................................................................................................................................... 96

4.2.4.

Image Data Output Formats ..................................................................................................................... 97

4.2.5.

Digitization bit depth................................................................................................................................ 98

4.3.

Acquisition modes ........................................................................................................................................... 99

4.3.1.

Free-Run ................................................................................................................................................ 99

4.3.2.

Trigger controlled Acquisition/Exposure .................................................................................................... 99

4.4.

4.3.2.1.

Triggered acquisition - single frame ................................................................................................ 99

4.3.2.2.

Triggered acquisition - burst of frames .......................................................................................... 101

4.3.2.3.

Exposure defined by trigger pulse length ....................................................................................... 101

4.3.2.4.

Multiple exposures in one frame ................................................................................................... 102

Camera Parameters and Features ................................................................................................................... 103

4.4.1.

Short Interval Shutter Mode ................................................................................................................... 103

4.4.2.

Dual ADC modes................................................................................................................................... 104

4.5.

5.

Downsampling Modes ............................................................................................................................. 96

4.4.2.1.

Non-combined mode .................................................................................................................... 105

4.4.2.2.

Combined mode........................................................................................................................... 106

Host-Assisted Image Processing Parameters Available in xiAPI. ........................................................................ 107

4.5.1.

Auto Exposure – Auto Gain .................................................................................................................... 107

4.5.2.

White Balance ...................................................................................................................................... 107

4.5.2.1.

Assisted Manual White Balance .................................................................................................... 107

4.5.2.2.

Auto White Balance ...................................................................................................................... 107

4.5.3.

Gamma ................................................................................................................................................ 107

4.5.4.

Sharpness ............................................................................................................................................ 107

4.5.5.

Color Correction Matrix .......................................................................................................................... 107

4.5.6.

Sensor Defect Correction ....................................................................................................................... 107

Software ................................................................................................................................................................ 108
5.1.

Accessing the Camera ................................................................................................................................... 108

5.1.1.

Proprietary API ...................................................................................................................................... 108

5.1.2.

Standard Interface ................................................................................................................................ 108

5.1.2.1.

GenICam ..................................................................................................................................... 108

5.1.2.2.

USB3 Vision ................................................................................................................................. 108

5.1.3.

Vision Library Integration ....................................................................................................................... 108

5.2.

XIMEA CamTool ............................................................................................................................................. 109

5.3.

Supported Vision Libraries .............................................................................................................................. 111

5.3.1.

5.4.

Libraries maintained by XIMEA ............................................................................................................... 111

5.3.1.1.

MathWorks MATLAB .................................................................................................................... 111

5.3.1.2.

MVTec HALCON ........................................................................................................................... 111

5.3.1.3.

National Instruments LabVIEW Vision Library .................................................................................. 111

5.3.1.4.

OpenCV ....................................................................................................................................... 111

XIMEA Windows Software Package ................................................................................................................. 112

5.4.1.

Contents .............................................................................................................................................. 112

5.4.2.

Installation ............................................................................................................................................ 112

5.5.

XIMEA Linux Software Package....................................................................................................................... 115

5.5.1.

Contents .............................................................................................................................................. 115

5.5.2.

Installation ............................................................................................................................................ 115

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5.6.

5.6.1.

Contents .............................................................................................................................................. 117

5.6.2.

Installation ............................................................................................................................................ 117

5.6.3.

Start XIMEA CamTool ............................................................................................................................ 118

5.7.

Programming ................................................................................................................................................ 119

5.7.1.

XIMEA APIs........................................................................................................................................... 119

5.7.2.

xiAPI Overview ...................................................................................................................................... 119

5.7.3.

xiAPI Functions Description .................................................................................................................... 119

5.7.4.

xiAPI Parameters Description ................................................................................................................. 120

5.7.5.

xiAPI Examples ..................................................................................................................................... 120

5.7.5.1.

Connect Device ............................................................................................................................ 120

5.7.5.2.

Parameterize Device..................................................................................................................... 120

5.7.5.3.

Acquire Images ............................................................................................................................ 121

5.7.5.4.

Control Digital Input / Output (GPIO) .............................................................................................. 121

5.7.6.

xiAPI Auto Bandwidth Calculation ........................................................................................................... 122

5.7.7.

USB3 Vision .......................................................................................................................................... 122

5.7.8.

GenICam .............................................................................................................................................. 122

5.8.
6.

XIMEA macOS Software Package .................................................................................................................... 117

XIMEA Control Panel ...................................................................................................................................... 123

Appendix ................................................................................................................................................................ 124
6.1.

Troubleshooting and Support .......................................................................................................................... 124

6.1.1.

Worldwide Support ................................................................................................................................ 124

6.1.2.

Before Contacting Technical Support ...................................................................................................... 124

6.1.3.

Frequently Asked Questions................................................................................................................... 124

6.2.

6.1.3.1.

What is USB 3.1 Gen 1 SuperSpeed? ............................................................................................ 124

6.1.3.2.

What is the real transfer speed?.................................................................................................... 125

6.1.3.3.

Why can I not achieve maximum transfer speed? ........................................................................... 125

6.1.3.4.

What voltage should be applied to Digital Input of xiC to turn it on/off? ............................................ 125

6.1.3.5.

What is the implementation of Digital Output (VDO) of xiC? ............................................................. 125

Product service request (PSR) ......................................................................................................................... 126

6.2.1.

Step 1 - Contact Support ....................................................................................................................... 126

6.2.2.

Step 2 - Create Product Service Request (PSR) ....................................................................................... 126

6.2.3.

Step 3 - Wait for PSR Approval .............................................................................................................. 126

6.2.4.

Step 4 - Sending the camera to XIMEA ................................................................................................... 126

6.2.5.

Step 5 - Waiting for Service Conclusion .................................................................................................. 126

6.2.6.

Step 6 - Waiting for return delivery ......................................................................................................... 126

6.3.

Safety instructions and precautions ................................................................................................................. 127

6.3.1.

Disassembling ...................................................................................................................................... 127

6.3.2.

Mounting / Screwing ............................................................................................................................. 127

6.3.3.

Connections ......................................................................................................................................... 127

6.3.4.

Power supply ........................................................................................................................................ 127

6.3.5.

Environment / protect against water ....................................................................................................... 127

6.3.6.

Recommended light conditions. ............................................................................................................. 127

6.3.7.

Protect the optical components .............................................................................................................. 128

6.3.8.

Mechanical loads .................................................................................................................................. 128

6.3.9.

Camera / lens cleaning.......................................................................................................................... 128

6.3.10. Protect against static discharge (ESD) .................................................................................................... 128

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6.4.

Warranty ....................................................................................................................................................... 128

6.5.

Disclaimer of Warranty ................................................................................................................................... 129

6.6.

List of Trademarks ......................................................................................................................................... 129

6.7.

Standard Terms & Conditions of XIMEA GmbH ................................................................................................. 129

6.8.

Copyright ...................................................................................................................................................... 129

6.9.

Revision History ............................................................................................................................................. 136

7.

Glossary ................................................................................................................................................................. 137

8.

List of figures ......................................................................................................................................................... 138

9.

List of tables .......................................................................................................................................................... 141

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2. xiC Camera Series

2.1.

What is xiCxiC [ksi-see: or sai-see:] is an ultra-compact USB 3.1 (gen 1) Industrial camera family with outstanding features:•

Extremely small footprint, very light, robust full-alloy housings•

Low power consumption•

USB3 Vision Standard compatible•

Utilizing Sony Pregius and Pregius S global shutter sensors from 2.3 MP to 24.5 MP•

frame rates: 2.3 MP @ 165 fps to 24.5 MP @ 15.5 fps

2.2.

Advantages
Industry standard interface
AIA standard compatibility
Small
Low power consumption
Powerful
Fast
RobustLightweight
Connectivity
Compatibility
Software interfaces
Economicaltable 2-1, advantages

xiC - Technical Manual Version 2.02

USB 3.1 Gen1
USB3 Vision standard
Fits into places where no other camera can fit
2.2-3.5 W
5Gb/s interface up to 450Mbyte/s data throughput for USB3.1 gen1
High speed, high frame rate: >650fps at VGA and 30fps at 12Mpix resolutions
Full metal housing, no sheet metal covers
Facilitates increased performance of robotic arms and gimbals
Programmable opto-isolated I/O, and non-isolated digital input and output. 4 status LEDs
Support for Windows, Linux and MacOS, ARM, various Image Processing Libraries
GenICam / GenTL and highly optimized xiAPI SDK
Excellent value and price, low TCO and fast ROI

14

2.3.

USB3 Vision Camera Applications•

Automation•

Ultra-fast 3D scanning•

Miniature and fast robotic arms•

Mobile devices•

In-situ optical inspection camera•

Material and life science microscopy•

Ophthalmology and retinal imaging•

Broadcasting•

Fast process capture, e.g., golf club swings•

Intelligent Transportations Systems (ITS) and traffic monitoring

2.4.

Common features
Sensor Technology
Acquisition Modes
Partial Image Readout
Image data formats
Color image processing
Hot/blemish pixels correction
Auto adjustments
Flat field corrections

Image Data and Control Interface

General Purpose I/O
Signal conditioning
Synchronization
Housing and lens mountPower requirements
Environment
Operating systems
Software support
Firmware updates
table 2-2, common featuresxiC - Technical Manual Version 2.02

CMOS, Global shutter
Continuous, software and hardware trigger, fps limiting, triggered exposure,and burst
ROI, Decimation and Binning modes supported (model specific)
8, 10 or 12 bit RAW pixel data
Host based de-bayering, sharpening, Gamma, color matrix, true color CMS
On camera storage of up to 5000 pixel coordinates, host assisted correction
Auto white balance, auto gain, auto exposure
Host assisted pixel level shading and lens corrections
USB 3.1 standard Micro-B and standard Type-C with screw lock threads
compliant to USB3 Vision standard. Alternative flat ribbon cable interface for
embedded integrations
At the time of writing, the USB cameras utilize USB 3.1 gen1 definitions andyield a bandwidth of about 450 Mbyte/s. The cameras are backward
compatible with USB 3.0 and 2.0 (with concomitant reduction in pixel
throughput).
1x opto-isolated input, 1x opto-isolated output, and 2 non-isolatedbidirectional I/O, 4X user configurable LEDs
Programmable debouncing time
Hardware trigger input, software trigger, exposure strobe output, busy output
Standard C-mount convertible to CS mount, and “semi-housed”
2.2-3.5W, supplied via USB 3.1 interface
Operating 0°C to 50°C on housing, RH 80% non-condensing, -30°C to 70°C
storage
Ingress Protection: IP40
Windows 10 (x86 and x64), Windows 7 SP1 (x86 and x64), Linux Ubuntu,
MacOS 10.8 and newer
xiAPI SDK, adapters and drivers for various image processing packages
Field firmware updatable

15

2.5.

Model NomenclaturePart number convention for different models:
MCxxxyG-zz[-OPT][-DR]MC

xiC family name

xxx:

Resolution in 0.1 MPixel. E.g., 2.3 MPixel Resolution: xxx = 023

y:y=C: color model
y=M: black & white modelG:

Global shutter (all xiC cameras are global shutter)zz:

Vendor of the sensor
zz = SY: Sony[-OPT]: Connector options
OPT = TC: connector Type-C
OPT = UB: connector micro-B
OPT = FL: flex line variant, connector parallel to board, semi-housed
OPT = FV: flex line variant, connector perpendicular to board, semi-housed[-DR]: Dynamic range
OPT = ‘’: camera without HDR (Dual ADC) functionality
OPT = HDR: camera with HDR (Dual ADC) functionality

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2.6.

Models Overview

Resolution

Pixel
size

ADC [bit]

DR2

Opticalsize

Sensordiagonal

FPS3

1936 x 1216

5.86
µm

10/12

71.7 dB

1/1.2”

13.4 mm1652064 x 1544

3.45
µm

8/10/1270.9 dB

1/1.8”

8.9 mm122

2464 x 2056

3.45
µm

8/10/1270.8 dB

2/3”

11.1 mm764112 x 2176

3.45
µm

8/10/1270.5 dB1”

16.1 mm434112 x 3008

3.45
µm

8/10/1270.4 dB

1.1”

17.6 mm

315328 x 3040

2.74
µm

8/10/122.74µm

8/10/12Model1
MC023MG-SY
b/w
MC023CG-SY
Color
MC031MG-SY
b/w
MC031CG-SY
Color
MC050MG-SY
b/w
MC050CG-SY
Color
MC089MG-SY
b/w
MC089CG-SY
Color
MC124MG-SY
b/w
MC124CG-SY
Color
MC161MG-SY
b/w
MC161CG-SY
Color
MC161MG-SY-HDR
b/w
MC161CG-SY-HDR
ColorMC203MG-SY
b/w
MC203CG-SY
Color
MC203MG-SY-HDR
b/w
MC203CG-SY-HDR
Color
MC245MG-SY
b/w
MC245CG-SY
Color
MC245MG-SY-HDR
b/w
MC245CG-SY-HDR
Colortable 2-3, models overview

4512 x 4512

5328 x 4608

2.74
µm

70.2 dB

23.2
1.1”

16.78 mm72.1 dB

23.1

TBD dB

18.7
1.1”

17.45 mm72.1 dB

18.6

TBD dB

15.5

8/10/12

1.1”
TBD dB

19.27 mm15.5

Note: 1) In the model’s name please add-TC for USB 3.1 Gen1 Type C-UB for USB 3.1 Gen1 Micro-B-FL for flat-flex cable connecting from the bottom of the camera-FV for flat-flex cable connecting perpendicular to the sensor
2) The highest possible dynamic range
3) Full resolution, 8-bit RAW

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2.7.

Accessories

The following accessories are available (short list):
Item P/N
CBL-U3-1M0
CBL-U3-3M0
CBL-U3-3M0-ANG
CBL-U3-5M0
CBL-U31TC-3M0
CBL-U31TC-5M0
MECH-MC-BRACKET-KIT
CBL-MQ-FL-0M1
CBL-MQ-FL-0M25
CBL-USB3FLEX-0M10
CBL-USB3FLEX-0M25
CBL-USB3FLEX-0M50
BOB-MQ-FL
U31PE1G3-V1-X21
U3PE-FL1100-X41
CBL-702-8P-SYNC-5M0
table 2-4, accessories

Description
1.0m USB 3.0 cable, micro-B connector on camera side
3.0m USB 3.0 cable, micro-B connector on camera side
3.0m USB 3.0 cable, angled micro-B USB3 connector
5.0m USB 3.0 cable, micro-B connector on camera side
3.0m USB 3.1 Gen 1 Type-C cable (Type-A - Type-C)
5.0m USB 3.1 Gen 1 Type-C cable (Type-A - Type-C)
xiC series tripod mounting bracket with Screws Kit
Cable FPC MQ/MC Flex-Line, 0.1m (gold color)
Cable FPC MQ/MC Flex-Line, 0.25m (gold color)
Cable FPC MQ/MC Flex-Line, 0.1m (white color)
Cable FPC MQ/MC Flex-Line, 0.25m (white color)
Cable FPC MQ/MC Flex-Line, 0.5m (white color)
Break Out Board, Flex-Line, Simple Board Level Micro-B USB3.0
PCI express adapter, 2x USB 3.1 ports ASMedia ASM1142, xHCI
PCI express adapter, 4x USB 3.0 ports, PCIe x4 slot
5.0m Trigger/Sync I/O cable

Note: 1) For more information please visit:https://www.ximea.com/support/projects/usb3/wiki/USB_3_Host_Adapters

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3. Hardware Specification
3.1.

Power Supply

The xiC cameras are powered via the USB Micro-B, type C or flex line connector. The input voltage is 5 V DC. The power
consumption is 2.2 - 3.5W depending on the xiC model.
Power supply, via USB system connector:•

5 V (nominal)•

4.45 V to 5.5 V (at the camera connector)

Additionally, the models with Micro-B (-UB) and Type-C (-TC) connector can use external power supply, with same requirements
as power supply defined above. For information about connection please see chapter: 3.10 xiC Digital Input / Output (GPIO)
Interface and 3.11 External power supply input (AUX).
Power supply, via Digital Input / Output (GPIO) Interface connector:•

5 V (nominal)•

4.45 V to 5.5 V (at the camera connector)

3.2.

General Specification

3.2.1. Environment
Description
Optimal ambient temperature operation

SymbolTopt

Value+10 to +25 °C

Ambient temperature operationTmax+0 to +50 °C

Ambient temperature for storage and transportation

Tstorage
RH-30 to +70 °C

Relative Humidity, non-condensing
table 3-1, environment

80 %Housing temperature must not exceed +65°C. It is recommended to mount the camera on heat conductive structure to
improve heat dissipation. The following parameters are not guaranteed if the camera is operated outside the optimum range:•

Dark current•

Dynamic Range•

Linearity•

Acquisition•

Readout noise•

S/N ratio•

Durability

Please refer to chapter 3.12 Heat Dissipation.

3.2.2. Firmware / Host driver / API features
Description
Interpolation methods
White balance coefficients ranges
Sharpness filter
Gamma
Full color correction matrix (3+1)x3 coefficients ranges
table 3-2, firmware / API features

Value
Proprietary
0.0 to 3.9-400 to 400 %0.3 to 1.0-3.9 to 3.9

More details on API/SDK features are available at XIMEA support pages: https://www.ximea.com/support/wiki/apis/APIs

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3.3.

Lens Mount

The xiC cameras are compatible with C-mount and CS-mount lenses.

C/CS-Mount module B

figure 3-1, position C/CS-Mount module B
The cameras are delivered with C-mount back focal length. By removing the “C/CS-Mount module B” (see the figure above)the camera can be rebuilt to CS-mount compatibility. Effectively reducing the back focal distance and overall length of camera
by 5mm. The required M2x8mm special screws are part of the camera delivery. The length of the lens thread is 6.5 mm.
Please read the chapter 3.4 Optical path carefully. Conversion between those two options is described:

https://www.ximea.com/support/projects/usb3/wiki/Convert_C_to_CS_Mount
Note: The distance between the threaded flange and the surface of the filter glass is 11.9 mm in case of C-Mount and 6.9mm in case of CS-Mount. To avoid damaging of the filter glass, nothing may extend deeper into the housing.
Lens mount adapter configuration:•

C-Mount (with C/CS Mount module B)•

CS-Mount (without C/CS Mount module B)

3.3.1. Screws
All mounting screws are customized M2 screws with different lengths.
Technical details:
Material
SurfaceThreadSteelBlack zinc
M2
table 3-3, custom screws, technical details

DriverPH 00

Avail. Lengths
3mm – 24 mm

Drawings, e.g., with 10mm length:

figure 3-2, xiC mounting screws
Note: Never exceed a maximum torque of 0.3Nm when fastening the M2 mounting screws.

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3.4.

Optical path

3.4.1. Filter glasses
A filter glass is part of the optical path of the camera. This glass is placed on a layer of silicone, to keep dust out of the camera,but not glued. The conversion of C-mount to CS-mount (see section 3.3 Lens Mount) must be carried out carefully. Operating
the camera without a lens mount is not intended and can lead to dropping out of the filter glass and the entry of dust. Do notuse compressed air to clean the camera as this could push dust into the camera. Distance from the flange to sensor is designed
so the optical distance is 17.526mm - 0.2mm (tolerance).
filter glass
sensor cover glass
sensor die

figure 3-3, Optical path section

3.4.2. Monochrome and near infrared extended camera models
Used filter brandThickness
Coating
BK7 AR2x
1.0±0.1 mm
Anti-reflex both sides
table 3-4, monochrome camera - filter glass parameter

BK7 AR2x - Transmission Curve
100
90

Transmittance (%)

80
70
60
50
40
30
20
10
0
350 400 450 500 550 600 650 700 750 800 850 900 950 1000 1050

Wavelength (nm)figure 3-4, monochrome camera - filter glass transmission curve

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3.4.3. Color camera models
Used filter brandThickness
ICR6501.0±0.1 mm
table 3-5, color camera - filter glass parameter

Coating
Anti-reflex both sides

ICR650 - Transmission Curve
100
90

Transmittance (%)

80

70
60
50
40
30
20
10
0
350 400 450 500 550 600 650 700 750 800 850 900 950 1000 1050

Wavelength (nm)figure 3-5, color camera - filter glass transmission curve

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3.5.

Model Specific Characteristics

3.5.1. MC023xG-SY
3.5.1.1.

Sensor and camera parametersxiC model
Sensor parameters
Model name
Color filter
Technology
Shutter type
Pixel Resolution (H × V)
[pixel]Active area size (H × V)
[mm]
Sensor diagonal[mm]
Optical format[inch]
Pixel Size (H × V)[µm]
Image quality parameters (EMVA 1288)
ADC resolution[bit]
Saturation capacity[ke-]
Dynamic range[dB]
SNRmax[dB]
Conversion gain[e-/LSB12]
Dark noise[e-]Dark current[e-/s]
DSNU
[e-]
PRNU
[%]
Linearity[%]
Camera parameters
Digitization[bit]
Supported bit resolutions[bit/pixel]
Exposure time (EXP)
Variable Gain Range (VGA)[dB]
Refresh rate (MRR)[fps]
Power consumption
Typical / Maximum
Dimensions/Massheightwidth
depth (-TC/-UB/-FL/-FV)

MC023CG-SY
IMX174LQJ-C
RGB Bayer mosaic[W]

MC023MG-SY
IMX174LLJ-C
Nonest
1 Gen Pregius
Global1936 x 1216
11.314 x 7.12
13.39
1/1.2
5.86 x 5.86
10, 12
30.5
71.7
45
8.1
7.36
3
1.1
0.4
0.5
10, 128, 10, 1219µs to 30sec, in steps of 4.96µs 1
0-24
165
2.2 / 2.5

[mm]
[mm]
[mm]

26.4
26.4
42.3/42.0/28.9/29.4(with C/CS Mount module B)
37.3/37.0/23.9/24.4 (without C/CS Mount module B)
mass (-TC/-UB/-FL/-FV)[g]38.3/37.5/28.3/28.3 (with C/CS Mount module B)
34.1/33.3/24.1/24.1 (without C/CS Mount module B)
table 3-6, MC023xG-SY, sensor and camera parameters
Notes:
1)

Defined for maximal bandwidth. Minimal Exposure and exposure step (Line Period) could be calculated in:Camera performance calculator:
https://www.ximea.com/support/wiki/allprod/Industrial-scientific-camera-sensor-fps-frames-speedcalculator#/camera/MC023CG-SY

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Binning/Decimation
pixelsfps
1x1
1936 x 1216
165
1x11936 x 1216
129
1x1
1936 x 1216
108
table 3-7, MC023xG-SY, supported standard readout modes

3.5.1.2.

Bit/px81012Quantum efficiency curves [%]IMX174 - Spectral Response

Quantum Efficiency (%)

90%
80%

Monochrome

70%

Red Bayer

60%

Green Bayer
Blue Bayer

50%
40%
30%
20%
10%
0%
350

400

450

500

550

600

650

700

750

800

850

900

950

1000 1050

Wavelength (nm)figure 3-6, IMX174-mono, quantum efficiency curve, ©SONY

Drawings MC023xG-SY-TC (C-mount [with C/CS mount module B])

1
2
3
4

xiC
MC023CG-SY-TC
CACAC1623001

xiC
USB 3.1
Gen 1

USB3VISION

IO
AUX
power

USB 3.1 Gen 1

Made in SK

3.5.1.3.

Type C

C/CS-Mount module B

C/CS-Mount module A

Remove this module for CS mount backfocal distance

5 x M2 max. depth 2 mm
mod.: 25.0 x 18 mm (12.1 x 9 mm) C-mount20.0 x 18 mm (7.1 x 9 mm) CS-mountfigure 3-7, dimensional drawing MC023xG-SY-TC, C-Mount housing

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3.5.1.4.

Drawings MC023xG-SY-UB (C-mount [with C/CS mount module B])

1
2
3
4

xiC

xiC

MC023CG-SY-UBCACAU1623001

USB 3.1
Gen1

USB3VISION

IO
AUX
power
Made in SK

USB 3.1 Gen 1

For use with XIMEAapproved connection cables only.

C/CS-Mount module B

C/CS-Mount module A

Remove this modulefor CS mount backfocal distance

5 x M2 max. depth 2 mm
mod.: 25.1(24.1) x 18 mm (12.1 x 9 mm) C-mount
20.1(19.1) x 18 mm (7.1 x 9 mm) CS-mountfigure 3-8, dimensional drawing MC023xG-SY-UB, C-Mount housing

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Drawings MC023xG-SY-FL (C-mount [with C/CS mount module B])

MC023CG-SY-FL
CACAF1623001

xiC

Made in SK

1
2
3
4

xiC
USB 3.1
Gen 1

USB3VISION

USB 3.1 Gen 1

3.5.1.5.

C/CS-Mount module B

C/CS-Mount module A

Remove this modulefor CS mount backfocal distance

5 x M2 max. depth 2 mm
mod.: 21.4 x 18 mm (12.1 x 9 mm) C-mount
16.4 x 18 mm (7.1 x 9 mm) CS-mountfigure 3-9 dimensional drawing MC023xG-SY-FL, C-Mount housing

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3.5.1.6.

Drawings MC023xG-SY-FV (C-mount [with C/CS mount module B])

xiC

MC023CG-SY-FV

1CACAV1623001
2
3
4

USB 3.1 Gen 1

Made in SK

xiC

USB 3.1
Gen 1

USB3VISION

C/CS-Mount module B

C/CS-Mount module A

Remove this modulefor CS mount backfocal distance

5 x M2 max. depth 2 mm
mod.: 21.4 x 18 mm (12.1 x 9 mm) C-mount
16.4 x 18 mm (7.1 x 9 mm) CS-mountfigure 3-10 dimensional drawing MC023xG-SY-FV, C-Mount housing

3.5.1.7.

Referenced documents

Sony Datasheet IMX174LQJ-C_E_TechnicalDatasheet_REv0.3 (01/06/14)
Sony Datasheet IMX174LLJ-C_E_data_sheet_E14315 (01/06/14)

3.5.1.8.

Sensor featuresfeatureBinning
Decimation
ROI
HW Trigger

NoteNo
Not supported
Vertical cropping results in increased read speed, horizontal reduces data transfer
Trigger with overlap (see 4.3.2.1 Triggered acquisition - single frame)

Overlap mode
Exposure of next frame can start during the readout of the previous frame
table 3-8, sensor features available

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3.5.2. MC031xG-SY
3.5.2.1.

Sensor and camera parametersxiC model
Sensor parameters
Model name
Color filter
Technology
Shutter type
Pixel Resolution (H × V)
[pixel]Active area size (H × V)
[mm]
Sensor diagonal[mm]
Optical format[inch]
Pixel Size (H × V)[µm]
Image quality parameters (EMVA 1288)
ADC resolution[bit]
Saturation capacity[ke-]
Dynamic range[dB]
SNRmax[dB]
Conversion gain[e-/LSB12]
Dark noise[e-]Dark current[e-/s]
DSNU
[e-]
PRNU
[%]
Linearity[%]
Camera parameters
Digitization[bit]
Supported bit resolutions[bit/pixel]
Exposure time (EXP)
Variable Gain Range (VGA)[dB]
Refresh rate (MRR)[fps]
Power consumption
Typical / Maximum
Dimensions/Massheightwidth
depth (-TC/-UB/-FL/-FV)

MC031CG-SY
IMX252LQR-C
RGB Bayer mosaic[W]

MC031MG-SY
IMX252LLR-C
None
2nd Gen Pregius
Global2064 x 1544
7.12 x 5.33
8.89
1/1.8
3.45 × 3.45
8, 10, 12
9.9
70.9
40.3
2.67
2.32
2.1
0.7
0.65
0.5
83, 10, 12
8, 10, 12
1µs2 to 30sec, in steps of 5.29µs 10-241222.75 / 2.85

[mm]
[mm]
[mm]

26.4
26.4
42.2/41.9/28.8/29.3(with C/CS Mount module B)
37.3/36.9/23.8/24.3 (without C/CS Mount module B)
mass (-TC/-UB/-FL/-FV)[g]38.3/37.5/28.3/28.3 (with C/CS Mount module B)
34.1/33.3/24.1/24.1 (without C/CS Mount module B)
table 3-9, MC031xG-SY, sensor and camera parameters
Notes:
1)

Defined for maximal bandwidth. Minimal Exposure and exposure step (Line Period) could be calculated in:Camera performance calculator:
https://www.ximea.com/support/wiki/allprod/Industrial-scientific-camera-sensor-fps-frames-speedcalculator#/camera/MC031CG-SY
2)

From 1 µs to 14 µs the step is 1µs and the sensor is operating in special mode. This exposure times are notachievable for exposure controlled by trigger pulse length.

3)

Saturation capacity in 8-bit digitization is only ¼ of 10-bit and 12-bit mode (see 4.2.5 Digitization bit depth)

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Binning/Decimation
pixelsfps
Bit/px
1x1 / 1x1
2064 x 1544122
8
1x1 / 1x1
2064 x 154496
10
1x1 / 1x1
2064 x 154480
12
1x1 / 1x2
2064 x 772
241
8
1x1 / 2x1
1032 x 1544
218
8
1x1 / 2x21032 x 772
426
8
1x2 1 / 1x1
2064 x 772
241
8
1
1x2 / 2x1
1032 x 772
426
8
1x1 / 2x21032 x 772
377
10
1x1 / 2x21032 x 772
233
12table 3-10, MC031xG-SY, supported standard readout modes
Notes:
1)

Available only for mono camera model

3.5.2.2.

Quantum efficiency curves [%]IMX252- Spectral Response
70%
Monochrome

Quantum Efficiency (%)

60%

Red Bayer

50%Green Bayer
Blue Bayer

40%
30%
20%
10%
0%
350

400

450

500

550

600

650

700

750

800

850

900

950

1000 1050

Wavelength (nm)figure 3-11, IMX252-mono and color, quantum efficiency curves, ©SONY

xiC - Technical Manual Version 2.02

29

Drawings MC031xG-SY-TC (C-mount [with C/CS mount module B])

1
2
3
4

xiC

xiC

USB 3.1
Gen 1

USB3VISION

MC031CG-SY-TC
CECAC1623001

IO
AUX
power
Made in SK

3.5.2.3.

USB 3.1 Gen 1

Type C

C/CS-Mount module B

Remove this modulefor CS mount backfocal distance

C/CS-Mount module A

5 x M2 max. depth 2 mm
mod.: 25.0 x 18 mm (12.1 x 9 mm) C-mount20.0 x 18 mm (7.1 x 9 mm) CS-mountfigure 3-12, dimensional drawing MC031xG-SY-TC, C-Mount housing

3.5.2.4.

Drawings MC031xG-SY-UB (C-mount [with C/CS mount module B])

1
2
3
4

xiC

xiC

MC031CG-SY-UBCECAU1623001

USB 3.1
Gen 1

USB3VISION

IO
AUX
power
Made in SK

USB 3.1 Gen 1

For use with XIMEAapproved connection cables only.

C/CS-Mount module B

C/CS-Mount module A

Remove this modulefor CS mount backfocal distance

5 x M2 max. depth 2 mm
mod.: 25.0(24.0) x 18 mm (12.1 x 9 mm) C-mount
20.0(19.0) x 18 mm (7.1 x 9 mm) CS-mountfigure 3-13, dimensional drawing MC031xG-SY-UB, C-mount housing

xiC - Technical Manual Version 2.02

30

3.5.2.5.

Drawings MC031xG-SY-FL (C-mount [with C/CS mount module B])

MC031CG-SY-FL

xiC

1
CECAF1623001
2
3
4

USB 3.1 Gen 1

Made in SK

xiC

USB 3.1
Gen 1

USB3VISION

C/CS-Mount module B

C/CS-Mount module A

Remove this modulefor CS mount backfocal distance

5 x M2 max. depth 2 mm
mod.: 21.3 x 18 mm (12.1 x 9 mm) C-mount16.3 x 18 mm (7.1 x 9 mm) CS-mountfigure 3-14, dimensional drawing MC031xG-SY-FL, C-mount housing

xiC - Technical Manual Version 2.02

31

3.5.2.6.

Drawings MC031xG-SY-FV (C-mount [with C/CS mount module B])

MC031CG-SY-FV

xiC

1
CECAV1623001
2
3
4

USB 3.1 Gen 1

Made in SK

xiC

USB 3.1
Gen 1

USB3VISION

C/CS-Mount module B

C/CS-Mount module A

Remove this modulefor CS mount backfocal distance

5 x M2 max. depth 2 mm
mod.: 21.3 x 18 mm (12.1 x 9 mm) C-mount16.3 x 18 mm (7.1 x 9 mm) CS-mountfigure 3-15, dimensional drawing MC031xG-SY-FV, C-mount housing

3.5.2.7.

Referenced documents

Sony Datasheet IMX252LLR-C_Data_Sheet(E)_E15903 (03/09/15)
Sony Datasheet IMX252LQR-C_Data_Sheet(E)_E15911 (11/09/15)

3.5.2.8.

Sensor featuresfeatureBinning
Decimation
ROI
HW Trigger

Note
Yes, 1x2 (H x V) binning supported on monochrome only.
Yes, 2x2
Vertical cropping results in increased read speed, horizontal reduces data transfer
Trigger with overlap (see 4.3.2.1 Triggered acquisition - single frame)

Overlap mode
Exposure of next frame can start during the readout of the previous frame
table 3-11, sensor features available

xiC - Technical Manual Version 2.02

32

3.5.3. MC050xG-SY
3.5.3.1.

Sensor and camera parametersxiC model
Sensor parameters
Model name
Color filter
Technology
Shutter type
Pixel Resolution (H × V)
[pixel]Active area size (H × V)
[mm]
Sensor diagonal[mm]
Optical format[inch]
Pixel Size (H × V)[µm]
Image quality parameters (EMVA 1288)
ADC resolution[bit]
Saturation capacity[ke-]
Dynamic range[dB]
SNRmax[dB]
Conversion gain[e-/LSB12]
Dark noise[e-]Dark current[e-/s]
DSNU
[e-]
PRNU
[%]
Linearity[%]
Camera parameters
Digitization[bit]
Supported bit resolutions[bit/pixel]
Exposure time (EXP)
Variable Gain Range (VGA)[dB]
Refresh rate (MRR)[fps]
Power consumption
Typical / Maximum
Dimensions/Massheightwidth
depth (-TC/-UB/-FL/-FV)

MC050CG-SY
IMX250LQR-C
RGB Bayer mosaic[W]

MC050MG-SY
IMX250LLR-C
None
2nd Gen Pregius
Global2464 x 2056
8.5 x 7.09
11.1
2/3
3.45 x 3.45
8, 10, 12
9.8
70.8
40.3
2.66
2.32
3.9
0.75
0.61
0.5
83, 10, 12
8, 10, 12
1µs2 to 30sec, in steps of 6.32µs 10-24762.85 / 3.0

[mm]
[mm]
[mm]

26.4
26.4
42.2/41.9/28.8/29.3(with C/CS Mount module B)
37.3/36.9/23.8/24.3 (without C/CS Mount module B)
mass (-TC/-UB/-FL/-FV)[g]38.3/37.5/28.3/28.3 (with C/CS Mount module B)
34.1/33.3/24.1/24.1 (without C/CS Mount module B)
table 3-12, MC050xG-SY, sensor and camera parameters
Notes:

1)

Defined for maximal bandwidth. Minimal Exposure and exposure step (Line Period) could be calculated in:Camera performance calculator:
https://www.ximea.com/support/wiki/allprod/Industrial-scientific-camera-sensor-fps-frames-speedcalculator#/camera/MC050CG-SY
2)

From 1 µs to 14 µs the step is 1µs and the sensor is operating in special mode. This exposure times are notachievable for exposure controlled by trigger pulse length.

3)

Saturation capacity in 8-bit digitization is only ¼ of 10-bit and 12-bit mode (see 4.2.5 Digitization bit depth)

xiC - Technical Manual Version 2.02

33

Binning/Decimation
pixelsfps
Bit/px
1x1 / 1x1
2464 x 2056
76
8
1x1 / 1x1
2464 x 2056
60
10
1x1 / 1x1
2464 x 2056
50
12
1x1 / 1x2
2464 x 10281528
1x1 / 2x1
1232 x 20561528
1x1 / 2x2
1232 x 1028304
8
1x2 1 / 1x1
2464 x 10281528
1
1x2 / 2x1
1232 x 1028304
8
1x1 / 2x2
1232 x 1028243
10
1x1 / 2x2
1232 x 1028
177
12table 3-13, MC050xG-SY, supported standard readout modes
Notes:
1)

Available only for mono camera model

3.5.3.2.

Quantum efficiency curves [%]IMX250- Spectral Response
70%
Monochrome

Quantum Efficiency (%)

60%

Red Bayer

50%Green Bayer
Blue Bayer

40%
30%
20%
10%
0%
350

400

450

500

550

600

650

700

750

800

850

900

950

1000 1050

Wavelength (nm)figure 3-16 IMX250 mono and color, quantum efficiency curves, ©SONY

xiC - Technical Manual Version 2.02

34

Drawings MC050xG-SY-TC (C-mount [with C/CS mount module B])

1
2
3
4

xiC
MC050CG-SY-TC
CICAC1623001

xiC
USB 3.1
Gen 1

USB3VISION

IO
AUX
power

USB 3.1 Gen 1

Made in SK

3.5.3.3.

Type C

C/CS-Mount module B

Remove this module for CS mount backfocal distance

C/CS-Mount module A

5 x M2 max. depth 2 mm
mod.: 25.0 x 18 mm (12.1 x 9 mm) C-mount20.0 x 18 mm (7.1 x 9 mm) CS-mountfigure 3-17, dimensional drawing MC050xG-SY-TC, C-Mount housing

3.5.3.4.

Drawings MC050xG-SY-UB (C-mount [with C/CS mount module B])

1
2
3
4

xiC

MC050CG-SY-UB
CICAU1623001 Made in SK

xiC
USB 3.1
Gen 1

USB3VISION

IO
AUX
power

USB 3.1 Gen 1

For use with XIMEAapproved connection cables only.

C/CS-Mount module B

C/CS-Mount module A

Remove this modulefor CS mount backfocal distance

5 x M2 max. depth 2 mm
mod.: 25.0(24.0) x 18 mm (12.1 x 9 mm) C-mount
20.0(19.0) x 18 mm (7.1 x 9 mm) CS-mountfigure 3-18, dimensional drawing MC050xG-SY-UB, C-Mount housing

xiC - Technical Manual Version 2.02

35

Drawings MC050xG-SY-FL (C-mount [with C/CS mount module B])

MC050CG-SY-FL
CICAF1623001

xiC

Made in SK

1
2
3
4

xiC
USB 3.1
Gen 1

USB3VISION

USB 3.1 Gen 1

3.5.3.5.

C/CS-Mount module B

C/CS-Mount module A

Remove this modulefor CS mount backfocal distance

5 x M2 max. depth 2 mm
mod.: 21.3 x 18 mm (12.1 x 9 mm) C-mount16.3 x 18 mm (7.1 x 9 mm) CS-mountfigure 3-19, dimensional drawing MC050xG-SY-FL, C-Mount housing

xiC - Technical Manual Version 2.02

36

Drawings MC050xG-SY-FV (C-mount [with C/CS mount module B])

MC050CG-SY-FV
CICAV1623001

xiC

Made in SK

1
2
3
4

xiC
USB 3.1
Gen 1

USB3VISION

USB 3.1 Gen 1

3.5.3.6.

C/CS-Mount module B

C/CS-Mount module A

Remove this modulefor CS mount backfocal distance

5 x M2 max. depth 2 mm
mod.: 21.3 x 18 mm (12.1 x 9 mm) C-mount16.3 x 18 mm (7.1 x 9 mm) CS-mountfigure 3-20, dimensional drawing MC050xG-SY-FV, C-Mount housing

3.5.3.7.

Referenced documents

Sony Datasheet IMX250LLR-C_Data_Sheet(E)_E15902 (02/09/15)
Sony Datasheet IMX250LQR-C_Data_Sheet(E)_E15910 (10/09/15)

3.5.3.8.

Sensor featuresfeatureBinning
Decimation
ROI
HW Trigger

Note
Yes, 1x2 (H x V) binning supported on monochrome only.
Yes, 2x2
Vertical cropping results in increased read speed, horizontal reduces data transfer
Trigger with overlap (see 4.3.2.1 Triggered acquisition - single frame)

Overlap mode
Exposure of next frame can start during the readout of the previous frame
table 3-14, sensor features available

xiC - Technical Manual Version 2.02

37

3.5.4. MC089xG-SY
3.5.4.1.

Sensor and camera parametersxiC model
Sensor parameters
Model name
Color filter
Technology
Shutter type
Pixel Resolution (H × V)
[pixel]Active area size (H × V)
[mm]
Sensor diagonal[mm]
Optical format[inch]
Pixel Size (H × V)[µm]
Image quality parameters (EMVA 1288)
ADC resolution[bit]
Saturation capacity[ke-]
Dynamic range[dB]
SNRmax[dB]
Conversion gain[e-/LSB12]
Dark noise[e-]Dark current[e-/s]
DSNU
[e-]
PRNU
[%]
Linearity[%]
Camera parameters
Digitization[bit]
Supported bit resolutions[bit/pixel]
Exposure time (EXP)
Variable Gain Range (VGA)[dB]
Refresh rate (MRR)[fps]
Power consumption
Typical / Maximum
Dimensions/Massheightwidth
depth (-TC/-UB/-FL/-FV)

MC089CG-SY
IMX255LQR-C
RGB Bayer mosaic[W]

MC089MG-SY
IMX255LLR-C
None
2nd Gen Pregius
Global4112 x 2176
14.2 x 7.5
161”
3.45 x 3.45
8, 10, 12
9.8
70.5
40.3
2.67
2.4
3.9
0.75
0.61
0.5
83, 10, 12
8, 10, 12
1µs2 to 30sec, in steps of 10.54µs 10-24433.3 / 3.5

[mm]
[mm]
[mm]

26.4
26.4
42.3/42.0/28.9/29.4(with C/CS Mount module B)
37.3/37.0/23.9/24.4 (without C/CS Mount module B)
mass (-TC/-UB/-FL/-FV)[g]38.3/37.5/28.5/28.5 (with C/CS Mount module B)
34.1/33.3/24.3/24.3 (without C/CS Mount module B)
table 3-15, MC089xG-SY, sensor and camera parameters
Notes:
1)

Defined for maximal bandwidth. Minimal Exposure and exposure step (Line Period) could be calculated in:Camera performance calculator:
https://www.ximea.com/support/wiki/allprod/Industrial-scientific-camera-sensor-fps-frames-speedcalculator#/camera/MC089CG-SY
2)

From 1 µs to 14 µs the step is 1µs and the sensor is operating in special mode. This exposure times are notachievable for exposure controlled by trigger pulse length.

3)

Saturation capacity in 8-bit digitization is only ¼ of 10-bit and 12-bit mode (see 4.2.5 Digitization bit depth)

xiC - Technical Manual Version 2.02

38

Binning/Decimation
pixelsfps
Bit/px
1x1 / 1x1
4112 x 2176
438
1x1 / 1x1
4112 x 2176
34
10
1x1 / 1x1
4112 x 2176
28
12
1x1 / 1x2
4112 x 108886
8
1x1 / 2x1
2056 x 2176
86
8
1x1 / 2x2
2056 x 1088172
8
1x2 1 / 1x1
4112 x 10888681
2x2 / 1x1
2056 x 1088172
8
1
2x2 / 1x1
2056 x 1088137
10
2x2 1 / 1x1
2056 x 1088114
12
1x1 / 2x2
2056 x 1088137
10
1x1 / 2x2
2056 x 1088
114
12table 3-16, MC089xG-SY, supported standard readout modes
Notes:
1)

Available only for mono camera model

3.5.4.2.

Quantum efficiency curves [%]IMX255- Spectral Response
70%
Monochrome

Quantum Efficiency (%)

60%

Red Bayer

50%Green Bayer
Blue Bayer

40%
30%
20%
10%
0%
350

400

450

500

550

600

650

700

750

800

850

900

950

1000 1050

Wavelength (nm)figure 3-21, IMX255 mono and color, quantum efficiency curve, ©SONY

xiC - Technical Manual Version 2.02

39

Drawings MC089xG-SY-TC (C-mount [with C/CS mount module B])

1
2
3
4

xiC
MC089CG-SY-TC
COCAC1623001

xiC
USB 3.1
Gen 1

USB3VISION

IO
AUX
power
Made in SK

3.5.4.3.

USB 3.1 Gen 1

Type C

C/CS-Mount module B

Remove this modulefor CS mount backfocal distance

C/CS-Mount module A

4 x M2 max. depth 2 mm
mod.: 25.1 x 18 mm C-mount20.1 x 18 mm CS-mountfigure 3-22, dimensional drawing MC089xG-SY-TC, C-Mount housing

3.5.4.4.

Drawings MC089xG-SY-UB (C-mount [with C/CS mount module B])

1
2
3
4

xiC

xiC
USB 3.1
Gen 1

USB3VISIONIO
AUX

MC089CG-SY-UB
power
COCAU1623001 Made in SK
USB 3.1 Gen 1

For use with XIMEAapproved connection cables only.

C/CS-Mount module B

C/CS-Mount module A

Remove this modulefor CS mount backfocal distance

4 x M2 max. depth 2 mm
mod.: 25.1(24.1) x 18 mm C-mount20.1 x 18 mm CS-mountfigure 3-23, dimensional drawing MC089xG-SY-UB, C-Mount housing

xiC - Technical Manual Version 2.02

40

3.5.4.5.

Drawings MC089xG-SY-FL (C-mount [with C/CS mount module B])

xiC

MC089CG-SY-FL

1
COCAF1623001
2
3
4

USB 3.1 Gen 1d

Made in SK

xiC

USB 3.1
Gen 1

USB3VISION

C/CS-Mount module B

Remove this modulefor CS mount backfocal distance

4 x M2 max. depth 2 mm
mod.: 21.4 x 18 mm C-mount
16.4 x 18 mm CS-mount

C/CS-Mount module A

figure 3-24, dimensional drawing MC089xG-SY-FL, C-Mount housing

xiC - Technical Manual Version 2.02

41

Drawings MC089xG-SY-FV (C-mount [with C/CS mount module B])

MC089CG-SY-FV
COCAV1623001

xiC

Made in SK

1
2
3
4

xiC
USB 3.1
Gen 1

USB3VISION

USB 3.1 Gen 1

3.5.4.6.

C/CS-Mount module B

Remove this modulefor CS mount backfocal distance

4 x M2 max. depth 2 mm
mod.: 21.4 x 18 mm C-mount
16.4 x 18 mm CS-mount

C/CS-Mount module A

figure 3-25, dimensional drawing MC089xG-SY-FV, C-Mount housing

3.5.4.7.

Referenced documents

Sony Datasheet IMX255LLR-C_TechnicalDatasheet_E_Rev0.1 (29/01/16)
Sony Datasheet IMX255LQR-C_TechnicalDatasheet_E_Rev0.1 (29/01/16)

3.5.4.8.

Sensor featuresfeatureBinning
Decimation
ROI
HW Trigger

Note
Yes, up to 2x2 binning supported on monochrome only.
Yes, up to 1x2
Vertical cropping results in increased read speed, horizontal reduces data transfer
Trigger with overlap (see 4.3.2.1 Triggered acquisition - single frame)

Overlap mode
Exposure of next frame can start during the readout of the previous frame
table 3-17, sensor features available

xiC - Technical Manual Version 2.02

42

3.5.5. MC124xG-SY
3.5.5.1.

Sensor and camera parametersxiC model
Sensor parameters
Model name
Color filter
Technology
Shutter type
Pixel Resolution (H × V)
[pixel]Active area size (H × V)
[mm]
Sensor diagonal[mm]
Optical format[inch]
Pixel Size (H × V)[µm]
Image quality parameters (EMVA 1288)
ADC resolution[bit]
Saturation capacity[ke-]
Dynamic range[dB]
SNRmax[dB]
Conversion gain[e-/LSB12]
Dark noise[e-]Dark current[e-/s]
DSNU
[e-]
PRNU
%
Linearity[%]
Camera parameters
Digitization[bit]
Supported bit resolutions[bit/pixel]
Exposure time (EXP)
Variable Gain Range (VGA)[dB]
Refresh rate (MRR)[fps]
Power consumption
Typical / Maximum
Dimensions/Massheightwidth
depth (-TC/-UB/-FL/-FV)

MC124CG-SY
IMX253LQR-C
RGB Bayer mosaic[W]

MC124MG-SY
IMX253LLR-C
None
2nd Gen Pregius
Global4112 x 3008
14.2 x 10.4
17.6
1.1”
3.45 x 3.45
8, 10, 12
9.9
70.4
40.45
2.67
2.4
3.9
0.75
0.61
0.5
83, 10, 12
8, 10, 12
1µs2 to 30sec, in steps of 10.54µs 1
0-2431
3.3 / 3.5

[mm]
[mm]
[mm]

26.4
26.4
42.3/42.0/28.9/29.4(with C/CS Mount module B)
37.3/37.0/23.9/24.4 (without C/CS Mount module B)
mass (-TC/-UB/-FL/-FV)[g]38.3/37.5/28.5/28.5 (with C/CS Mount module B)
34.1/33.3/24.3/24.3 (without C/CS Mount module B)
table 3-18, MC124xG-SY, sensor and camera parameters
Notes:
1)

Defined for maximal bandwidth. Minimal Exposure and exposure step (Line Period) could be calculated in:Camera performance calculator:
https://www.ximea.com/support/wiki/allprod/Industrial-scientific-camera-sensor-fps-frames-speedcalculator#/camera/MC124CG-SY
2)

From 1 µs to 14 µs the step is 1µs and the sensor is operating in special mode. This exposure times are notachievable for exposure controlled by trigger pulse length.

3)

Saturation capacity in 8-bit digitization is only ¼ of 10-bit and 12-bit mode (see 4.2.5 Digitization bit depth)

xiC - Technical Manual Version 2.02

43

Binning/Decimation
pixelsfps
Bit/px
1x1 / 1x1
4112 x 3008
318
1x1 / 1x1
4112 x 3008
24
10
1x1 / 1x1
4112 x 30082012
1x1 / 1x2
4112 x 1504
628
1x1 / 2x1
2056 x 3008
628
1x1 / 2x2
2056 x 1504124
8
1x2 1 / 1x1
4112 x 1504628
1
2x2 / 1x1
2056 x 1504124
81
2x2 / 1x1
2056 x 1504
99
10
2x2 1 / 1x1
2056 x 150483
12
1x1 / 2x2
2056 x 1504
99
10
1x1 / 2x2
2056 x 150483
12table 3-19, MC124xG-SY, supported standard readout modes
Notes:
1)

Available only for mono camera model

3.5.5.2.

Quantum efficiency curves [%]IMX253- Spectral Response
70%
Monochrome

Quantum Efficiency (%)

60%

Red Bayer

50%Green Bayer
Blue Bayer

40%
30%
20%
10%
0%
350

400

450

500

550

600

650

700

750

800

850

900

950

1000 1050

Wavelength (nm)figure 3-26, IMX253 mono and color, quantum efficiency curve, ©SONY

xiC - Technical Manual Version 2.02

44

Drawings MC124xG-SY-TC (C-mount [with C mount module B])

1
2
3
4

xiC
MC124CG-SY-TC
CUCAC1623001

xiC
USB 3.1
Gen 1

USB3VISION

IO
AUX
power
Made in SK

3.5.5.3.

USB 3.1 Gen 1

Type C

C/CS-Mount module B

Remove this modulefor CS mount backfocal distance

C/CS-Mount module A

4 x M2 max. depth 2 mm
mod.: 25.1 x 18 mm C-mount20.1 x 18 mm CS-mountfigure 3-27, dimensional drawing MC124xG-SY-TC C-Mount housing

3.5.5.4.

Drawings MC124xG-SY-UB (C-mount [with C mount module B])

1
2
3
4

xiC

xiC
USB 3.1
Gen 1

USB3VISIONIOAUXMC124CG-SY-UB
power
CUCAU1623001 Made in SK
USB 3.1 Gen 1

For use with XIMEAapproved connection cables only.

C/CS-Mount module B

C/CS-Mount module A

Remove this modulefor CS mount backfocal distance

4 x M2 max. depth 2 mm
mod.: 25.1(24.1) x 18 mm C-mount20.1 x 18 mm CS-mountfigure 3-28, dimensional drawing MC124xG-SY-UB, C-Mount housing

xiC - Technical Manual Version 2.0245

Drawings MC124xG-SY-FL (C-mount [with C/CS mount module B])

xiC

MC124CG-SY-FL
CUCAF1623001

xiC

Made in SK

1
2
3
4

USB 3.1
Gen 1

USB3VISION

USB 3.1 Gen 1

3.5.5.5.

C/CS-Mount module B

Remove this modulefor CS mount backfocal distance

4 x M2 max. depth 2 mm
mod.: 21.4 x 18 mm C-mount
16.4 x 18 mm CS-mount

C/CS-Mount module A

figure 3-29, dimensional drawing MC124xG-SY-FL, C-Mount housing

xiC - Technical Manual Version 2.02

46

3.5.5.6.

Drawings MC124xG-SY-FV (C-mount [with C mount module B])

MC124CG-SY-FV

xiC

1
CUCAV1623001
2
3
4

USB 3.1 Gen 1

Made in SK

xiC

USB 3.1
Gen 1

USB3VISION

C/CS-Mount module B

Remove this modulefor CS mount backfocal distance

4 x M2 max. depth 2 mm
mod.: 21.4 x 18 mm C-mount
16.4 x 18 mm CS-mount

C/CS-Mount module A

figure 3-30, dimensional drawing MC124xG-SY-FV, C-Mount housing

3.5.5.7.

Referenced documents

Sony Datasheet IMX253LLR-C_TechnicalDatasheet_E_Rev0.3 (29/01/16)
Sony Datasheet IMX253LQR-C_TechnicalDatasheet_E_Rev0.1 (29/01/16)

3.5.5.8.

Sensor featuresfeatureBinning
Decimation
ROI
HW Trigger

Note
Yes, up to 2x2 binning supported on monochrome only.
Yes, up to 2x2
Vertical cropping results in increased read speed, horizontal reduces data transfer
Trigger with overlap (see 4.3.2.1 Triggered acquisition - single frame)

Overlap mode
Exposure of next frame can start during the readout of the previous frame
table 3-20, sensor features available

xiC - Technical Manual Version 2.02

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3.5.6. MC161xG-SY
3.5.6.1.

Sensor and camera parametersxiC model
Sensor parameters
Model name
Color filter
Technology
Shutter type
Pixel Resolution (H × V)
[pixel]Active area size (H × V)
[mm]
Sensor diagonal[mm]
Optical format[inch]
Pixel Size (H × V)[µm]
Image quality parameters (EMVA 1288)
ADC resolution[bit]
Saturation capacity[ke-]
Dynamic range[dB]
SNRmax[dB]
System gain 1/K[e-/DN]2
Dark noise[e-]Dark current @ 60°C
[e-/s]
Absolute sensitivity threshold
[e-]
DSNU
[e-]
PRNU
[%]
Linearity error[%]
Camera parameters
Exposure time (EXP)
Variable Gain Range (VGA)[dB]
ADC resolution[bit/pixel]
Maximal framerate (MRR)[fps]
Power consumption
Typical / Maximum
Dimensions/Massheightwidth
depth (-TC/-UB/-FL/-FV)

MC161CG-SY
IMX542AAQJ-C
RGB Bayer mosaic

MC161MG-SY
IMX542AAMJ-C
None
4th Gen Pregius S
Global5328 x 3040
14.58 x 8.314
16.78
1.1”
2.74 x 2.74

81
2.47
52.73
33.88
10.24
5.2
20.47
5.7
2.28
1.47
0.46

10
10.19
65.47
40.34
10.24
4.93
19.07
5.43
4.31
1.42
0.24

12
9.21
70.23
39.98
2.40
2.33
21.5
2.83
4.49
1.51
0.35

81
23.2

16 µs to 30 s, in steps of 13.66 µs 3
0-24
10
18.6

12
15.5

[W]

3.2 / 3.4

[mm]
[mm]
[mm]

26.4
26.4
42.4/42.1/29/29 (with C/CS Mount module B)
37.4/37.1/24/24 (without C/CS Mount module B)
mass (-TC/-UB/-FL/-FV)[g]
38/37/28/28 (with C/CS Mount module B)
33.8/32.8/23.8/23.8 (without C/CS Mount module B)
table 3-21, MC161xG-SY, sensor and camera parameters
Notes:
1)

Saturation capacity in 8-bit digitization is only ¼ of 10-bit and 12-bit mode (see 4.2.5 Digitization bit depth)

2)

DN is LSBN where N is the ADC resolution bit depth

3)Defined for maximal bandwidth. Minimal Exposure and exposure step (Line Period) could be calculated in:Camera performance calculator:
https://www.ximea.com/support/wiki/allprod/Industrial-scientific-camera-sensor-fps-frames-speedcalculator#/camera/MC161CG-SY

xiC - Technical Manual Version 2.02

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Binning/Decimation
pixels
Bit/pxFPS
1x1 / 1x1
5328 x 3040
823.2
1x1 / 1x1
5328 x 3040
1018.6
1x1 / 1x1
5328 x 3040
1215.5
1x1 / 2x2
2664 x 1520
8
90.6
1x1 / 2x2
2664 x 1520
1072.5
1x1 / 2x2
2664 x 1520
12
60.7
1
2x2 / 1x1
2664 x 1520
8
90.6
2x2 1 / 1x1
2664 x 1520
10
72.5
1
2x2 / 1x1
2664 x 1520
1260.7
table 3-22, MC161xG-SY, supported standard readout modes
Notes:
1)

Available only for mono camera models

3.5.6.2.

Quantum efficiency curves [%]IMX542 - Spectral Response

Quantum Efficiency (%)

100%
90%

Monochrome

80%

Red Bayer

70%

Green Bayer

60%

Blue Bayer

50%
40%
30%
20%
10%
0%
350

400

450

500

550

600

650

700

750

800

850

900

950

1000 1050

Wavelength (nm)figure 3-31, IMX542 mono and color, quantum efficiency curve, ©SONY

xiC - Technical Manual Version 2.02

49

3.5.6.3.

Drawings MC161xG-SY-TC (C-mount [with C mount module B])

figure 3-32, dimensional drawing MC161xG-SY-TC C-Mount housing

3.5.6.4.

Drawings MC161xG-SY-UB (C-mount [with C mount module B])

figure 3-33, dimensional drawing MC161xG-SY-UB, C-Mount housing
xiC - Technical Manual Version 2.02

50

3.5.6.5.

Drawings MC161xG-SY-FL (C-mount [with C/CS mount module B])

figure 3-34, dimensional drawing MC161xG-SY-FL, C-Mount housing

3.5.6.6.

Drawings MC161xG-SY-FV (C-mount [with C mount module B])

figure 3-35, dimensional drawing MC161xG-SY-FV, C-Mount housing
xiC - Technical Manual Version 2.02

51

3.5.6.7.

Referenced documents

Sony Datasheet IMX542-AAMJ-C_Data_Sheet(E)_E20516B09 (23/10/20)
Sony Datasheet IMX542-AAQJ-C_Data_Sheet(E)_E20602A09 (23/09/20)

3.5.6.8.

Sensor featuresfeatureBinning
Decimation
ROI
HW Trigger

Note
Yes, up to 2x2 binning supported on monochrome only.
Yes, up to 2x2
Vertical cropping results in increased read speed, horizontal reduces data transfer
Trigger with overlap (see 4.3.2.1 Triggered acquisition - single frame)

Overlap mode
Exposure of next frame can start during the readout of the previous frame
table 3-23, sensor features available

xiC - Technical Manual Version 2.02

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3.5.7. MC161xG-SY-HDR
3.5.7.1.

Sensor and camera parametersxiC model
Sensor parameters
Model name
Color filter
Technology
Shutter type
Pixel Resolution (H × V)
[pixel]Active area size (H × V)
[mm]
Sensor diagonal[mm]
Optical format[inch]
Pixel Size (H × V)[µm]
Image quality parameters
Mode
ADC resolution[bit]
Saturation capacity[ke-]
Dynamic range[dB]
SNRmax[dB]
System gain 1/K[e-/DN]3
Dark noise[e-]Dark current @ 60 °C[e-/s]
Absolute sensitivity threshold [e-]
DSNU
[e-]
PRNU
[%]
Linearity error[%]
Camera parameters
Exposure time (EXP)
Variable Gain Range (VGA)[dB]
ADC resolution
Maximal framerate – standard [fps]Maximal framerate – Dual ADC
Non-combined 5[fps]
Combined[fps]
Power consumption
Typical / Maximum[W]
Dimensions/Massheight
[mm]
width
[mm]
depth (-TC/-UB/-FL/-FV)[mm]

MC161CG-SY-HDR

MC161MG-SY-HDR

IMX532AAQJ-C
RGB Bayer mosaic

IMX532AAMJ-C
None
4th Gen Pregius S
Global5328 x 3040
14.58 x 8.314
16.78
1.1”
2.74 x 2.74

Standard
10
9.78
65.05
40.24
10.24
4.97
27.42
5.47
2.99
0.46
0.32

82
2.44
52.95
33.85
10.24
4.99
21.14
5.49
1.46
0.57
0.54

82
2.38
61.2
33.76
0.04
1.57
10.46
2.07
2.15
0.56
1

12
9.4
70.18
40.32
2.40
2.41
22.33
2.91
2.77
0.47
0.26

Dual ADC 1
10
9.95
71.35
40.43
0.16
2.19
21.08
2.69
5.04
0.45
0.33

82
23.1

16 µs to 30 s, in steps of 13.66 µs 4
0-24
10
18.5

12
15.4

11.7
23.1 6

9.3
N/A

7.8
15.4 7

12
9.35
72.17
40.2
0.15
1.8
22.36
2.3
5.02
0.46
0.53

3.4 / 3.6

26.4
26.4
42.4/42.1/29/29 (with C/CS Mount module B)
37.4/37.1/24/24 (without C/CS Mount module B)
mass (-TC/-UB/-FL/-FV)[g]
38/37/28/28 (with C/CS Mount module B)
33.8/32.8/23.8/23.8 (without C/CS Mount module B)
table 3-24, MC161xG-SY-HDR, sensor and camera parametersxiC - Technical Manual Version 2.0253

Notes:1)

Dual ADC non-combined modes were measured with gain ratio set to the maximum value of 24 dB

2)

Saturation capacity in 8-bit digitization is only ¼ of 10-bit and 12-bit mode (see 4.2.5 Digitization bit depth)3)

For standard modes DN is LSBN where N is the ADC resolution bit depth and for dual ADC modes DN is LSB16

4)Defined for maximal bandwidth. Minimal Exposure and exposure step (Line Period) could be calculated in:Camera performance calculator:
https://www.ximea.com/support/wiki/allprod/Industrial-scientific-camera-sensor-fps-frames-speedcalculator#/camera/MC161CG-SY-HDR
5)

Possibility to combine in computer (API)6)

With Dual ADC combining in sensor - 2x12 bit with 8-bit output data

7)

With Dual ADC combining in sensor - 2x12 bit with 12-bit output data

Binning/Decimation
pixels
Bit/pxFPS
1
1x1 / 1x1
5328 x 3040
823.1
1
1x1 / 1x1
5328 x 3040
1018.5
1x1 / 1x1 15328 x 3040
12
15.5
1
1x1 / 2x2
2664 x 1520
889.3
1
1x1 / 2x2
2664 x 1520
1071.4
1x1 / 2x2 12664 x 1520
12
59.8
1, 2
2x2 / 1x1
2664 x 1520
8
89.7
2x2 1, 2 / 1x1
2664 x 1520
10
71.8
1, 2
2x2 / 1x1
2664 x 1520
12
59.8
3
1x1 / 1x1
5328 x 30408
11.7
1x1 / 1x1 35328 x 3040
109.3
3
1x1 / 1x1
5328 x 3040
127.8
41x1 / 1x1
5328 x 3040
823.2
1x1 / 1x1
5328 x 3040
12 5
15.4
table 3-25, MC161xG-SY-HDR, supported standard readout modes
1)

Standard mode2)

Available only for mono camera models

3)

Dual ADC mode without in sensor combination - possibility to combine in computer (API)4)

Dual ADC mode with combining in sensor - 2x12 bit with 8-bit output data

5)

Dual ADC mode with combining in sensor - 2x12 bit with 12-bit output dataxiC - Technical Manual Version 2.02

54

3.5.7.2.

Quantum efficiency curves [%]Spectral response for IMX532 sensor is the same as for sensor IMX542. See the page 49 figure 3-31, IMX542 mono and color,
quantum efficiency curve, ©SONY.

3.5.7.3.

Drawings MC161xG-SY-TC-HDR (C-mount [with C mount module B])

Dimensions and drawings are the same as for the camera MC161xG-SY-TC (see figure 3-32, dimensional drawing MC161xGSY-TC C-Mount housing on page 50).

3.5.7.4.

Drawings MC161xG-SY-UB-HDR (C-mount [with C mount module B])

Dimensions and drawings are the same as for the camera MC161xG-SY-UB (see figure 3-33, dimensional drawing MC161xGSY-UB, C-Mount housing 50).

3.5.7.5.

Drawings MC161xG-SY-FL-HDR (C-mount [with C/CS mount module B])

Dimensions and drawings are the same as for the camera MC161xG-SY-FL (see figure 3-34, dimensional drawing MC161xGSY-FL, C-Mount housing 51).

3.5.7.6.

Drawings MC161xG-SY-FV-HDR (C-mount [with C mount module B])

Dimensions and drawings are the same as for the camera MC161xG-SY-FV (see figure 3-35, dimensional drawing MC161xGSY-FV, C-Mount housing 51).

3.5.7.7.

Referenced documents

Sony Datasheet IMX532-AAMJ-C_Data_Sheet(E)_E20515A0X (30/10/20)
Sony Datasheet IMX532-AAQJ-C_Data_Sheet(E)_E20601A0X (30/10/20)

3.5.7.8.

Sensor featuresfeatureBinning
Decimation
ROI
HW Trigger

Note
Yes, up to 2x2 binning supported on monochrome only.
Yes, up to 2x2
Vertical cropping results in increased read speed, horizontal reduces data transfer
Trigger with overlap (see 4.3.2.1 Triggered acquisition - single frame)

DualADC
Yes, allowed via special mode
Short interval shutter mode
Yes, allowed via special mode
Overlap mode
Exposure of next frame can start during the readout of the previous frame
table 3-26, sensor features available

xiC - Technical Manual Version 2.02

55

3.5.8. MC203xG-SY
3.5.8.1.

Sensor and camera parametersxiC model
Sensor parameters
Model name
Color filter
Technology
Shutter type
Pixel Resolution (H × V)
[pixel]Active area size (H × V)
[mm]
Sensor diagonal[mm]
Optical format[inch]
Pixel Size (H × V)[µm]
Image quality parameters (EMVA 1288)
ADC resolution[bit]
Saturation capacity[ke-]
Dynamic range[dB]
SNRmax[dB]
System gain 1/K[e-/DN]2
Dark noise[e-]Dark current @ 60°C
[e-/s]
Absolute sensitivity threshold
[e-]
DSNU
[e-]
PRNU
[%]
Linearity error[%]
Camera parameters
Exposure time (EXP)
Variable Gain Range (VGA)[dB]
ADC resolution[bit/pixel]
Maximal framerate (MRR)[fps]
Power consumption
Typical / Maximum
Dimensions/Massheightwidth
depth (-TC/-UB/-FL/-FV)MC203CG-SY
IMX541AAQJ
RGB Bayer mosaic

MC203MG-SY
IMX541AAMJ
None
4th Gen Pregius S
Global4512 x 4512
12.34 x 12.34
17.45
1.1”
2.74 x 2.74

81
2.47
52.73
33.88
10.24
5.2
20.47
5.7
2.28
1.47
0.46

10
10.19
65.47
40.34
10.24
4.93
19.07
5.43
4.31
1.42
0.24

12
9.21
70.23
39.98
2.40
2.33
21.5
2.83
4.49
1.51
0.35

81
18.7

14 µs to 30 s, in steps of 11.57 µs 3
0-24
10
15

12
12.5

[W]

3.2 / 3.4

[mm]
[mm]
[mm]

26.4
26.4
42.4/42.1/29/29 (with C/CS Mount module B)
37.4/37.1/24/24 (without C/CS Mount module B)
mass (-TC/-UB/-FL/-FV)[g]
38/37/28/28 (with C/CS Mount module B)
33.8/32.8/23.8/23.8 (without C/CS Mount module B)
table 3-27, MC203xG-SY, sensor and camera parameters
Notes:
1)

Saturation capacity in 8-bit digitization is only ¼ of 10-bit and 12-bit mode (see 4.2.5 Digitization bit depth)

2)

DN is LSBN where N is the ADC resolution bit depth

3)Defined for maximal bandwidth. Minimal Exposure and exposure step (Line Period) could be calculated in:Camera performance calculator:
https://www.ximea.com/support/wiki/allprod/Industrial-scientific-camera-sensor-fps-frames-speedcalculator#/camera/MC203CG-SY

xiC - Technical Manual Version 2.02

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Binning/Decimation
pixels
Bit/pxFPS
1x1 / 1x1
4512 x 4512
8
18.7
1x1 / 1x1
4512 x 4512
1015
1x1 / 1x1
4512 x 4512
1212.5
1x1 / 2x2
2256 x 2256873.5
1x1 / 2x2
2256 x 2256
1058.9
1x1 / 2x2
2256 x 2256
12
49.3
1
2x2 / 1x1
2256 x 2256873.5
2x2 1 / 1x1
2256 x 2256
10
58.9
1
2x2 / 1x1
2256 x 2256
1249.3
table 3-28, MC203xG-SY, supported standard readout modes
Notes:
1)

3.5.8.2.

Available only for mono camera models

Quantum efficiency curves [%]Spectral response for IMX541 sensor is the same as for sensor IMX542. See the page 49 figure 3-31, IMX542 mono and color,
quantum efficiency curve, ©SONY.

3.5.8.3.

Drawings MC203xG-SY-TC (C-mount [with C mount module B])

Dimensions and drawings are the same as for the camera MC161xG-SY-TC (see figure 3-32, dimensional drawing MC161xGSY-TC C-Mount housing on page 50).

3.5.8.4.

Drawings MC203xG-SY-UB (C-mount [with C mount module B])

Dimensions and drawings are the same as for the camera MC161xG-SY-UB (see figure 3-33, dimensional drawing MC161xGSY-UB, C-Mount housing 50).

3.5.8.5.

Drawings MC203xG-SY-FL (C-mount [with C/CS mount module B])

Dimensions and drawings are the same as for the camera MC161xG-SY-FL (see figure 3-34, dimensional drawing MC161xGSY-FL, C-Mount housing 51).

3.5.8.6.

Drawings MC203xG-SY-FV (C-mount [with C mount module B])

Dimensions and drawings are the same as for the camera MC161xG-SY-FV (see figure 3-35, dimensional drawing MC161xGSY-FV, C-Mount housing 51).

3.5.8.7.

Referenced documents

Sony Datasheet IMX541-AAMJ-C_Data_Sheet(E)_E20522A09 (10/05/10)
Sony Datasheet IMX541-AAQJ-C_Data_Sheet(E)_E20603A09 (10/05/10)

xiC - Technical Manual Version 2.02

57

3.5.8.8.

Sensor featuresfeatureBinning
Decimation
ROI
HW Trigger

Note
Yes, up to 2x2 binning supported on monochrome only.
Yes, up to 2x2
Vertical cropping results in increased read speed, horizontal reduces data transfer
Trigger with overlap (see 4.3.2.1 Triggered acquisition - single frame)

Overlap mode
Exposure of next frame can start during the readout of the previous frame
table 3-29, sensor features available

xiC - Technical Manual Version 2.02

58

3.5.9. MC203xG-SY-HDR
3.5.9.1.

Sensor and camera parametersxiC model
Sensor parameters
Model name
Color filter
Technology
Shutter type
Pixel Resolution (H × V)
[pixel]Active area size (H × V)
[mm]
Sensor diagonal[mm]
Optical format[inch]
Pixel Size (H × V)[µm]
Image quality parameters
Mode
ADC resolution[bit]
Saturation capacity[ke-]
Dynamic range[dB]
SNRmax[dB]
System gain 1/K[e-/DN]3
Dark noise[e-]Dark current @ 60 °C[e-/s]
Absolute sensitivity threshold [e-]
DSNU
[e-]
PRNU
[%]
Linearity error[%]
Camera parameters
Exposure time (EXP)
Variable Gain Range (VGA)[dB]
ADC resolution
Maximal framerate – standard [fps]Maximal framerate – Dual ADC
Non-combined 5[fps]
Combined[fps]
Power consumption
Typical / Maximum[W]
Dimensions/Massheight
[mm]
width
[mm]
depth (-TC/-UB/-FL/-FV)[mm]

MC203CG-SY-HDR

MC203MG-SY-HDR

IMX531AAQJ
RGB Bayer mosaic

IMX531AAMJ
None
4th Gen Pregius S
Global4512 x 4512
12.34 x 12.34
17.45
1.1”
2.74 x 2.74

Standard
10
9.64
64.7
40.06
10.24
5.11
16.45
5.61
3.34
0.45
0.3

82
2.35
53.04
33.73
10.24
4.75
17.71
5.25
1.78
0.54
0.87

82
2.32
61.3
33.65
0.04
1.5
16.41
2
2.97
0.51
0.87

12
9.41
70.23
40.29
2.40
2.4
20.72
2.9
3.35
0.45
0.3

Dual ADC1
10
9.88
71.45
40.42
0.16
2.14
18.23
2.64
5.9
0.41
0.19

82
18.6

14 µs to 30 s, in steps of 11.57 µs 4
0-24
10
14.9

12
12.4

9.4
18.6 6

7.5
N/A

6.3
12.4 7

12
9.37
72.19
40.19
0.15
1.8
20.76
2.3
5.93
0.42
0.44

3.4 / 3.6

26.4
26.4
42.4/42.1/29/29 (with C/CS Mount module B)
37.4/37.1/24/24 (without C/CS Mount module B)
mass (-TC/-UB/-FL/-FV)[g]
38/37/28/28 (with C/CS Mount module B)
33.8/32.8/23.8/23.8 (without C/CS Mount module B)
table 3-30, MC203xG-SY-HDR, sensor and camera parametersxiC - Technical Manual Version 2.02

59

Notes:1)

Dual ADC non-combined modes were measured with gain ratio set to the maximum value of 24 dB

2)

Saturation capacity in 8-bit digitization is only ¼ of 10-bit and 12-bit mode (see 4.2.5 Digitization bit depth)3)

For standard modes DN is LSBN where N is the ADC resolution bit depth and for dual ADC modes DN is LSB16

4)Defined for maximal bandwidth. Minimal Exposure and exposure step (Line Period) could be calculated in:Camera performance calculator:
https://www.ximea.com/support/wiki/allprod/Industrial-scientific-camera-sensor-fps-frames-speedcalculator#/camera/MC203CG-SY-HDR
5)

Possibility to combine in computer (API)6)

With Dual ADC combining in sensor - 2x12 bit with 8-bit output data

7)

With Dual ADC combining in sensor - 2x12 bit with 12-bit output data

Binning/Decimation
pixels
Bit/pxFPS
1
1x1 / 1x1
4512 x 4512
818.6
1
1x1 / 1x1
4512 x 4512
1014.9
1x1 / 1x1 14512 x 4512
12
12.4
1
1x1 / 2x2
2256 x 2256872.8
1
1x1 / 2x2
2256 x 2256
1058.2
1x1 / 2x2 12256 x 2256
12
48.5
1, 2
2x2 / 1x1
2256 x 2256872.8
2x2 1, 2 / 1x1
2256 x 2256
10
58.2
1, 2
2x2 / 1x1
2256 x 2256
12
48.5
3
1x1 / 1x1
4512 x 4512
89.4
1x1 / 1x1 34512 x 4512
107.5
3
1x1 / 1x1
4512 x 4512
126.3
4
1x1 / 1x1
4512 x 4512
8
18.6
1x1 / 1x1
4512 x 4512
12 5
12.4
table 3-31, MC203xG-SY-HDR, supported standard readout modes
1)

Standard mode2)

Available only for mono camera models

3)

Dual ADC mode without in sensor combination - possibility to combine in computer (API)4)

Dual ADC mode with combining in sensor - 2x12 bit with 8-bit output data

5)

Dual ADC mode with combining in sensor - 2x12 bit with 12-bit output dataxiC - Technical Manual Version 2.02

60

3.5.9.2.

Quantum efficiency curves [%]Spectral response for IMX531 sensor is the same as for sensor IMX542. See the page 49 figure 3-31, IMX542 mono and color,
quantum efficiency curve, ©SONY.

3.5.9.3.

Drawings MC203xG-SY-TC-HDR (C-mount [with C mount module B])

Dimensions and drawings are the same as for the camera MC161xG-SY-TC (see figure 3-32, dimensional drawing MC161xGSY-TC C-Mount housing on page 50).

3.5.9.4.

Drawings MC203xG-SY-UB-HDR (C-mount [with C mount module B])

Dimensions and drawings are the same as for the camera MC161xG-SY-UB (see figure 3-33, dimensional drawing MC161xGSY-UB, C-Mount housing 50).

3.5.9.5.

Drawings MC203xG-SY-FL-HDR (C-mount [with C/CS mount module B])

Dimensions and drawings are the same as for the camera MC161xG-SY-FL (see figure 3-34, dimensional drawing MC161xGSY-FL, C-Mount housing 51).

3.5.9.6.

Drawings MC203xG-SY-FV-HDR (C-mount [with C mount module B])

Dimensions and drawings are the same as for the camera MC161xG-SY-FV (see figure 3-35, dimensional drawing MC161xGSY-FV, C-Mount housing 51).

3.5.9.7.

Referenced documents

Sony Datasheet IMX531-AAMJ-C_Data_Sheet(E)_E20521A0X (23/10/20)
Sony Datasheet IMX531-AAQJ-C_Data_Sheet(E)_E20604A0X (23/10/20)

3.5.9.8.

Sensor featuresfeatureBinning
Decimation
ROI
HW Trigger

Note
Yes, up to 2x2 binning supported on monochrome only.
Yes, up to 2x2
Vertical cropping results in increased read speed, horizontal reduces data transfer
Trigger with overlap (see 4.3.2.1 Triggered acquisition - single frame)

DualADC
Yes, allowed via special mode
Short interval shutter mode
Yes, allowed via special mode
Overlap mode
Exposure of next frame can start during the readout of the previous frame
table 3-32, sensor features available

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3.5.10. MC245xG-SY
3.5.10.1.

Sensor and camera parametersxiC model
Sensor parameters
Model name
Color filter
Technology
Shutter type
Pixel Resolution (H × V)
[pixel]Active area size (H × V)
[mm]
Sensor diagonal[mm]
Optical format[inch]
Pixel Size (H × V)[µm]
Image quality parameters (EMVA 1288)
ADC resolution[bit]
Saturation capacity[ke-]
Dynamic range[dB]
SNRmax[dB]
System gain 1/K[e-/DN]2
Dark noise[e-]Dark current @ 60°C
[e-/s]
Absolute sensitivity threshold
[e-]
DSNU
[e-]
PRNU
[%]
Linearity error[%]
Camera parameters
Exposure time (EXP)
Variable Gain Range (VGA)[dB]
ADC resolution[bit/pixel]
Maximal framerate (MRR)[fps]
Power consumption
Typical / Maximum
Dimensions/Massheightwidth
depth (-TC/-UB/-FL/-FV)

MC245CG-SY
IMX540AAQJ
RGB Bayer mosaic

MC245MG-SY
IMX540AAMJ
None
4th Gen Pregius S
Global5328 x 4608
14.58 x 12.6
19.27
1.2”
2.74 x 2.74

81
2.47
52.73
33.88
10.24
5.2
20.47
5.7
2.28
1.47
0.46

10
10.19
65.47
40.34
10.24
4.93
19.07
5.43
4.31
1.42
0.24

12
9.21
70.23
39.98
2.4
2.33
21.5
2.83
4.49
1.51
0.35

81
15.5

16 µs to 30 s, in steps of 13.66 µs 3
0-24
10
12.4

12
10.4

[W]

3.2 / 3.4

[mm]
[mm]
[mm]

26.4
26.4
42.4/42.1/29/29 (with C/CS Mount module B)
37.4/37.1/24/24 (without C/CS Mount module B)
mass (-TC/-UB/-FL/-FV)[g]
38/37/28/28 (with C/CS Mount module B)
33.8/32.8/23.8/23.8 (without C/CS Mount module B)
table 3-33, MC245xG-SY, sensor and camera parameters
Notes:
1)

Saturation capacity in 8-bit digitization is only ¼ of 10-bit and 12-bit mode (see 4.2.5 Digitization bit depth)

2)

DN is LSBN where N is the ADC resolution bit depth

3)Defined for maximal bandwidth. Minimal Exposure and exposure step (Line Period) could be calculated in:Camera performance calculator:
https://www.ximea.com/support/wiki/allprod/Industrial-scientific-camera-sensor-fps-frames-speedcalculator#/camera/MC245CG-SY

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Binning/Decimation
pixels
Bit/pxFPS
1x1 / 1x1
5328 x 46088
15.5
1x1 / 1x1
5328 x 4608
1012.4
1x1 / 1x1
5328 x 4608
1210.4
1x1 / 2x2
2664 x 23048
61.0
1x1 / 2x2
2664 x 23041048.8
1x1 / 2x2
2664 x 2304
1240.8
2x2 1 / 1x1
2664 x 2304861.0
12x2 / 1x1
2664 x 2304
10
48.8
1
2x2 / 1x1
2664 x 2304
1240.8table 3-34, MC245xG-SY, supported standard readout modes
Notes:
1)

Available only for mono camera models

3.5.10.2.

Quantum efficiency curves [%]Spectral response for IMX540 sensor is the same as for sensor IMX542. See the page 49 figure 3-31, IMX542 mono and color,
quantum efficiency curve, ©SONY.

3.5.10.3.

Drawings MC245xG-SY-TC (C-mount [with C mount module B])

Dimensions and drawings are the same as for the camera MC161xG-SY-TC (see figure 3-32, dimensional drawing MC161xGSY-TC C-Mount housing on page 50).

3.5.10.4.

Drawings MC245xG-SY-UB (C-mount [with C mount module B])

Dimensions and drawings are the same as for the camera MC161xG-SY-UB (see figure 3-33, dimensional drawing MC161xGSY-UB, C-Mount housing 50).

3.5.10.5.

Drawings MC245xG-SY-FL (C-mount [with C/CS mount module B])

Dimensions and drawings are the same as for the camera MC161xG-SY-FL (see figure 3-34, dimensional drawing MC161xGSY-FL, C-Mount housing 51).

3.5.10.6.

Drawings MC245xG-SY-FV (C-mount [with C mount module B])

Dimensions and drawings are the same as for the camera MC161xG-SY-FV (see figure 3-35, dimensional drawing MC161xGSY-FV, C-Mount housing 51).

3.5.10.7.

Referenced documents

Sony Datasheet IMX540-AAMJ-C_Data_Sheet(E)_E20505B09 (10/05/20)
Sony Datasheet IMX540-AAQJ-C_Data_Sheet(E)_E20503B09 (10/05/20)

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3.5.10.8.

Sensor featuresfeatureBinning
Decimation
ROI
HW Trigger

Note
Yes, up to 2x2 binning supported on monochrome only.
Yes, up to 2x2
Vertical cropping results in increased read speed, horizontal reduces data transfer
Trigger with overlap usable (see 4.3.2.1 Triggered acquisition - single frame)

Overlap mode
Exposure of next frame can start during the readout of the previous frame
table 3-35, sensor features available

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3.5.11. MC245xG-SY-HDR
3.5.11.1.

Sensor and camera parametersxiC model
Sensor parameters
Model name
Color filter
Technology
Shutter type
Pixel Resolution (H × V)
[pixel]Active area size (H × V)
[mm]
Sensor diagonal[mm]
Optical format[inch]
Pixel Size (H × V)[µm]
Image quality parameters
Mode
ADC resolution[bit]
Saturation capacity[ke-]
Dynamic range[dB]
SNRmax[dB]
System gain 1/K[e-/DN]3
Dark noise[e-]Dark current @ 60 °C[e-/s]
Absolute sensitivity threshold [e-]
DSNU
[e-]
PRNU
[%]
Linearity error[%]
Camera parameters
Exposure time (EXP)
Variable Gain Range (VGA)[dB]
ADC resolution
Maximal framerate – standard [fps]Maximal framerate – Dual ADC
Non-combined 5[fps]
Combined[fps]
Power consumption
Typical / Maximum[W]
Dimensions/Massheight
[mm]
width
[mm]
depth (-TC/-UB/-FL/-FV)[mm]

MC245CG-SY-HDR

MC245MG-SY-HDR

IMX530AAQJ
RGB Bayer mosaic

IMX530AAMJ
None
4th Gen Pregius S
Global5328 x 4608
14.58 x 12.6
19.27
1.2”
2.74 x 2.74

Standard
10
9.64
64.7
40.06
10.24
5.11
16.45
5.61
3.34
0.45
0.3

82
2.35
53.04
33.73
10.24
4.75
17.71
5.25
1.78
0.54
0.87

82
2.32
61.3
33.65
0.04
1.5
16.41
2
2.97
0.51
0.87

12
9.41
70.23
40.29
2.40
2.4
20.72
2.9
3.35
0.45
0.3

Dual ADC1
10
9.88
71.45
40.42
0.16
2.14
18.23
2.64
5.9
0.41
0.19

82
15.5

16 µs to 30 s, in steps of 13.66 µs 4
0-24
10
12.4

12
10.3

7.8
15.5 6

6.2
N/A

5.2
10.3 7

12
9.37
72.19
40.19
0.15
1.8
20.76
2.3
5.93
0.42
0.44

3.4 / 3.6

26.4
26.4
42.4/42.1/29/29 (with C/CS Mount module B)
37.4/37.1/24/24 (without C/CS Mount module B)
mass (-TC/-UB/-FL/-FV)[g]
38/37/28/28 (with C/CS Mount module B)
33.8/32.8/23.8/23.8 (without C/CS Mount module B)
table 3-36, MC245xG-SY-HDR, sensor and camera parametersxiC - Technical Manual Version 2.0265Notes:1)

Dual ADC non-combined modes were measured with gain ratio set to the maximum value of 24 dB

2)

Saturation capacity in 8-bit digitization is only ¼ of 10-bit and 12-bit mode (see 4.2.5 Digitization bit depth)3)

For standard modes DN is LSBN where N is the ADC resolution bit depth and for dual ADC modes DN is LSB16

4)Defined for maximal bandwidth. Minimal Exposure and exposure step (Line Period) could be calculated in:Camera performance calculator:
https://www.ximea.com/support/wiki/allprod/Industrial-scientific-camera-sensor-fps-frames-speedcalculator#/camera/MC245CG-SY-HDR
5)

Possibility to combine in computer (API)6)

With Dual ADC combining in sensor - 2x12 bit with 8-bit output data

7)

With Dual ADC combining in sensor - 2x12 bit with 12-bit output data

Binning/Decimation
pixels
Bit/pxFPS
1
1x1 / 1x1
5328 x 46088
15.5
1x1 / 1x1 15328 x 4608
10
12.4
1
1x1 / 1x1
5328 x 4608
12
10.3
1
1x1 / 2x2
2664 x 23048
60.4
1x1 / 2x2 12664 x 2304
10
48.3
1
1x1 / 2x2
2664 x 2304
12
40.4
1, 2
2x2 / 1x1
2664 x 23048
60.4
2x2 1, 2 / 1x1
2664 x 2304
10
48.3
1, 2
2x2 / 1x1
2664 x 2304
1240.4
1x1 / 1x1 35328 x 460887.8
3
1x1 / 1x1
5328 x 4608
106.2
3
1x1 / 1x1
5328 x 4608
125.2
1x1 / 1x1
5328 x 4608
84
15.5
1x1 / 1x1
5328 x 4608
12 5
10.3
table 3-37, MC245xG-SY-HDR, supported standard readout modes
1)

Standard mode2)

Available only for mono camera models

3)

Dual ADC mode without in sensor combination - possibility to combine in computer (API)4)

Dual ADC mode with combining in sensor - 2x12 bit with 8-bit output data

5)

Dual ADC mode with combining in sensor - 2x12 bit with 12-bit output dataxiC - Technical Manual Version 2.02

66

3.5.11.2.

Quantum efficiency curves [%]Spectral response for IMX530 sensor is the same as for sensor IMX542. See the page 49 figure 3-31, IMX542 mono and color,
quantum efficiency curve, ©SONY.

3.5.11.3.

Drawings MC245xG-SY-TC-HDR (C-mount [with C mount module B])

Dimensions and drawings are the same as for the camera MC161xG-SY-TC (see figure 3-32, dimensional drawing MC161xGSY-TC C-Mount housing on page 50).

3.5.11.4.

Drawings MC245xG-SY-UB-HDR (C-mount [with C mount module B])

Dimensions and drawings are the same as for the camera MC161xG-SY-UB (see figure 3-33, dimensional drawing MC161xGSY-UB, C-Mount housing 50).

3.5.11.5.

Drawings MC245xG-SY-FL-HDR (C-mount [with C/CS mount module B])

Dimensions and drawings are the same as for the camera MC161xG-SY-FL (see figure 3-34, dimensional drawing MC161xGSY-FL, C-Mount housing 51).

3.5.11.6.

Drawings MC245xG-SY-FV-HDR (C-mount [with C mount module B])

Dimensions and drawings are the same as for the camera MC161xG-SY-FV (see figure 3-35, dimensional drawing MC161xGSY-FV, C-Mount housing 51).

3.5.11.7.

Referenced documents

Sony Datasheet IMX530-AAMJ-C_Data_Sheet(E)_E20506A0X (23/10/20)
Sony Datasheet IMX530-AAQJ-C_Data_Sheet(E)_E20504A0X (23/10/20)

3.5.11.8.

Sensor featuresfeatureBinning
Decimation
ROI
HW Trigger

Note
Yes, up to 2x2 binning supported on monochrome only.
Yes, up to 2x2
Vertical cropping results in increased read speed, horizontal reduces data transfer
Trigger with overlap usable (see 4.3.2.1 Triggered acquisition - single frame)

DualADC
Yes, allowed via special mode
Short interval shutter mode
Yes, allowed via special mode
Overlap mode
Exposure of next frame can start during the readout of the previous frame
table 3-38, sensor features available

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3.6.

User interface – LEDs

Four status LEDs are located on the back of the cameras, please see below.

MC050CG-SY-FL

LED1
LED2
LED3
LED4

1
CICAF1623001
2
3
4Made in SK

USB 3.1 Gen 1

xiC

figure 3-36, position status LEDs
All LEDs can be configured similar as standard input and output lines.
Default LED function after power on
LED
Color
Power-on defaults
1
Red
On
2
Green
Exposure active
3
Blue
Frame active
4
Orange Connection status
table 3-39, LED output description

Note
User configurable
User configurable
User configurable
User configurable

LED statuses during boot sequence
Status

LED1 (Red)

LED2 (Green)

LED3 (Blue)

LED4 (Orange)

Off

Off

Off

Off

Off

Power

On

Off

Off

Off

BootingOff

flash ~2Hz

flash ~2Hz

Off

Boot up finished

On

Off

Off

On

USB init - wait for enumeration

flash ~1Hz

Off

Off

Off

Enumeration finished USB2

Off

Off

Off

flash ~2Hz

Enumeration finished USB3

Off

Off

Off

On

Device stop

flash ~2Hz

Off

Off

flash ~2Hz

Error

flash ~2Hz

Off

Off

flash async.

table 3-40, LED status during bootDefault LED function after xiOpenDevice
LED
Color
LED function
1
Red
On
2
Green
Exposure active
3
Blue
Frame active
4
Orange On
table 3-41, LED output description

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3.7.

xiC USB 3.1 Gen1 Type-C Interface
Connector
USB 3.1

Signals
Standard USB 3.1 Gen1 Type-C Connector

Mating Connectors
Standard USB 3.1 Type C Connector with thumbscrews
Screw thread M2, thread distance 15.0mm

table 3-42, USB 3.1 mating connector description
The USB 3.1 Type C connector is used for data transmission, camera control and power.

3.7.1. Type-C connector location

xiC
MC023CG-SY-TC
CACAC1623001

IO
AUX
power
Made in SK

1
2
3
4

USB 3.1 Gen 1

Type-CType C

figure 3-37, position of Type-C connector

3.7.2. Pinning
A1

A2

A3

A4

A5

A6

A7

A8

A9

A10

A11

A12

B12

B11

B10

B9

B8

B7

B6

B5

B4

B3

B2

B1

figure 3-38 pinning of Type-C connector

Pin
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12

SignalDescription
GND
Ground return
SSTXp1 SuperSpeed differential pair #1, TX, pos.
SSTXn1 SuperSpeed differential pair #1, TX, neg.
VBUS
Bus power
CC1
Configuration channel
Dp1
Non-SuperSpeed diff. pair, position 1, pos.
Dn1
Non-SuperSpeed diff. pair, position 1, neg.
SBU1
Sideband use (SBU)
VBUS
Bus power
SSRXn2 SuperSpeed differential pair #4, RX, neg.
SSRXp2 SuperSpeed differential pair #4, RX, pos.
GND
Ground returntable 3-43 USB type C connector pin assignment

3.8.

Pin
B12
B11
B10
B9
B8
B7
B6
B5
B4
B3
B2
B1

SignalGND
SSRXp1
SSRXn1
VBUS
SBU2
Dn2
Dp2
CC2
VBUS
SSTXn2
SSTXp2
GND

Description
Ground return
SuperSpeed differential pair #2, RX, pos.
SuperSpeed differential pair #2, RX, neg.
Bus power
Sideband use (SBU)
Non-SuperSpeed diff. pair, position 2, neg.
Non-SuperSpeed diff. pair, position 2, pos.
Configuration channel
Bus power
SuperSpeed differential pair #3, TX, neg.
SuperSpeed differential pair #3, TX, pos.
Ground returnxiC USB 3.1 Gen1 micro-B Interface
Connector
USB 3.1

Signals
Standard USB 3.1 Gen 1 Micro-B
Female Connector

xiC - Technical Manual Version 2.02

Mating Connectors
Standard USB 3.1 Gen1 Micro-B Connector with thumbscrews
Screw thread M2, thread distance 18.0mm
69table 3-44, USB 3.1 micro-B mating connector description
The USB 3.1 Micro-B connector is used for data transmission, camera control and power.

3.8.1. USB 3.1 micro-B Location
The micro-B connector is located on the back side of the camera:
1
2
3
4

xiC

MC023CG-SY-UBCACAU1623001

IO
AUX
power
Made in SK

micro BUSB 3.1 Gen 1

For use with XIMEAapproved connection cables only.

figure 3-39, position USB 3.1 Gen1 interface

3.8.2. Pinning12345

6 7 8 9 10

figure 3-40, pinning USB 3.1 / USB 3.0 connector

USB 3.1 Micro-B connector (powered) Pin Assignment
Pin
SignalDescription
1
VBUS
Power
2
DUSB 2.0 signal pair
3
D+
4
ID
OTG Identification
5
GND
Power Ground
6
SSTXUSB 3.0 SuperSpeed transmitter signal pair
7
SSTX+
8
GND_DRAIN
USB 3.0 signal Ground
9
SSRXUSB 3.0 SuperSpeed receiver signal pair
10
SSRX+
table 3-45, USB 3.0 connector, pin assignment
The USB 3.1 / USB 3.0 standard is backward compatible with the USB 2.0 interface.

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3.9.

xiC Flex cable interface

The flex cable interface is located on the back of the camera and comes with two different options based on the orientation thecable plugs into the camera. The (FL) version of the camera allows the cable to approach from the bottom of the camera andthe (FV) version has the cable connecting to the camera perpendicular to the sensor surface.
Camera model
Connector-FL
Molex 502244-1530
table 3-46 Connector part numbers

Camera model-FV

Connector
Molex 502231-1500

3.9.1. Flex Connection Location

figure 3-41 Flex connector location FL version

figure 3-42 Flex connector location FV version

3.9.2. Pinning
Pin
Signal
1
GND
2
SSRX3
SSRX+
4
GND
5
SSTX+
6
SSTX7
GND
8
D+
9
D10
GND
11
VBUS
12
VBUS
13
OUT1
14
IN/OUT GND
15
IN1
Ground pins
SGND
table 3-47 Pin list for flex cable

xiC - Technical Manual Version 2.02

Technical description
Ground for power return and for SuperSpeed signal return
SuperSpeed receiver dif. pair (accepts reverse polarity)
SuperSpeed receiver dif. pair (accepts reverse polarity)
Ground for power return and for SuperSpeed signal return
SuperSpeed transmitter dif. pair (accepts reverse polarity)
SuperSpeed transmitter dif. pair (accepts reverse polarity)
Ground for power return and for SuperSpeed signal return
USB 2.0 differential pairUSB 2.0 differential pairGround for power return and for SuperSpeed signal return+5V Power input+5V Power input
Trigger/sync digital Output (GPO) - Open collector NPN
Common pole (IO Ground
Trigger/sync digital Input (GPI) Current limited input
Shield of FPC cable connected to shield of host controller

713.9.3. Inserting / detaching FPC cable
When inserting or detaching cables increased caution need to be taken, to prevent connector or cable damage. MC camerasinterface connectors are equipped with locking mechanism. When locked pulling the cable may lead to damage of connector orcamera. When manipulating with cable the power supply for the camera must be turned off.
Cables PN: CBL-MQ-FL-xxx (gold) have marked ends. It is important to connect the end marked “CAM” to the cameraand end marked “BOB” to host or adapter. Swapped orientation can cause damage to camera. It is important that thepower is turned off when inserting/detaching the cable.

figure 3-43, MC FPC cable CBL-MQ-FL-xxx laser marking
Cables PN: CBL-USB3FLEX-xxx (white) are not polarized therefore the orientation of the cable between camera and host is notimportant.

figure 3-44, MC FPC cable CBL-USB3FLEX-xxx ends
Inserting FPC cable MC option -FL

Open connector lock

Insert cable (contact on cable facing down)

Close connector lockfigure 3-45, MC FPC insert procedure option -FL
xiC - Technical Manual Version 2.02

72

Detaching FPC cable MX X2G2 option –FL

Open connector lock

Pull cable gently in marked direction.
figure 3-46, MC FPC detach procedure option -FL
Inserting FPC cables MC option -FVOpen connector lock

Insert cable

Close connector lock.
figure 3-47 MC FPC insert procedure option -FV

xiC - Technical Manual Version 2.02

73

Detaching FPC cable MX X2G2 option –FVOpen connector lock

Pull gently the cable out as marked.
figure 3-48, MC FPC detach procedure option -FV

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74

3.10. xiC Digital Input / Output (GPIO) Interface
USB xiC cameras use the 8-pin connector for the GPIO interface and external power supply (AUX) connection and have multiple
options for inputs and outputs. The flex line cameras have one input and one output available through the flex line (see pin-out
above).
Connector
I/O & Sync 8-pin

Signals
Opto-isolated trigger input and non-isolated I/OMating Connectors
Binder 8-pin PN: 79 1426 15 08

Flex cable
One input and one output opto-isolated
table 3-48, GPIO mating connector description

3.10.1. Location
IO interface receptacle (for USB cameras only) is located on the back of the camera:xiC

MC023CG-SY-UBCACAU1623001

IO
AUX
power

8 pin
IO/AUX
connector

1
2
3
4

xiC

Made in SK

MC023CG-SY-TC
CACAC1623001

USB 3.1 Gen 1

USB 3.1 Gen 1

For use with XIMEAapproved connection cables only.

IO
AUX
power
Made in SK

1
2
3
4

Type C

figure 3-49, position GPIO connector

3.10.2. IO Connector Pinning
Pinning of the IO connector (camera):

4
5
6
7

3
2

8

1

figure 3-50, pinning GPIO connector
I/O connector Pin Assignment:
Pin
1
2
3
4
5
6
7
8

Name
SignalAUX PWR
Power supply input
INOUT2
Non-isolated I/O
OUT1
Opto- isolated Output 1
OUT GND
Ground for Opto-Isolated Out (OUT1)
IN1
Opto-isolated Input 1
IN GND
Ground for Opto-Isolated Input (IN1)
GND
Ground for power and non-isolated I/O
INOUT1
Non-isolated I/Otable 3-49, I/O connector Pin Assignment

Technical description
5V
LVTTL (3V, 50µA)
Open collector

GPI/GPO index API(<0.8V low; 4-24V high)

1/-

LVTTL (3V, 50µA)

2/2

3/3
-/1

3.10.3. Optically isolated Digital Input
3.10.3.1.

Optically isolated Digital Input - General info

Item
xiC - Technical Manual Version 2.02

Parameter / note75Maximal input voltage
24V
Common poleNo
Effect of incorrect input terminal connection
Reverse voltage polarity protected
Effects when withdrawing/inserting input
No damage, no lost data
module under power
Maximum recommended cable length
5m
Input level for logical 0
Voltage < 2.0V/Current 0mA to 0.3mA
Input level for logical 1
Voltage > 4.0V/Current 4mA to 6mA
Input debounce filterNo
1.7 +/-0.2µs (VINPUT=10V, TAMBIENT=25°C)
Input delay – rising edge
1
Input delay – falling edge
10.7 +/-0.2µs (VINPUT=10V, TAMBIENT=25°C)
Number of inputs
1
External trigger mapping
Yes
Input functions
Trigger, get current level (rising or falling edge are supported)
table 3-50, Optically isolated digital input, general info
Note: – 1) Propagation delay depends on voltage level, propagation jitter is significantly lower.

3.10.3.2.

Digital Input – signal levels

Input levels are not IEC 61131-2, Type 1 as the ON state has been extended to support 5V TTL
V-in-min [V]V-in-max [V]
State
-24.0
2.0
Off (0)
2.0
4.0
Transient
4.0
24.0
On (1)
table 3-51, digital info, signal levels

I-max [mA]
0.0 – 0.3 mA (0mA nominal)4
4 – 6 mA (5mA nominal)

Note:
•

Input level Vin represents amplitude of the input signal.

•

Voltage levels referenced to common ground GND

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3.10.3.3.

Digital Input – Internal Schematic

The internal scheme of Digital Input signal flow inside the camera is below.
D IG IT A L IN P U T

4 9K 9I INPUT

1 00 R

6 20 R

VCC

1 0K

FPG A _ IN P U T

G N D ( C omm on I O Gr oun d)

GND

figure 3-51, digital input, interface schematic

3.10.3.4.

Digital Input – Wiring
Power Supply

PLC Device
CommonCameraInput

OutputGND (Common IO Ground)figure 3-52, digital input, interface wiring

3.10.3.5.

Digital Input – Timing

Typical measured input delay between Digital Input to FPGA Input
Measurements of input delays:
Edge Type
Input Voltage [V]Rising5
Rising10
Falling5
Falling10
Falling
24table 3-52, digital input, timing

Typ. delay [μs]
1.6
1.7
7.8
10.7
12.7

Note:
•

Measured at: Ambient Temperature 25°C

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3.10.4. Optically isolated Digital Output
3.10.4.1.

Optically isolated Digital Output - General info

Item
Maximal open circuit voltage
Output port typeProtection
Protection circuit
Maximal sink current

Parameter / note
24V
Open collector NPN
short-circuit / over-current / Reverse voltage
PTC Resettable Fuse
25mA
50mA – self restarting when failure mode current
Trip current
disconnected
Inductive loads
No
Effect of incorrect output terminal connection
Protected against reverse voltage connection
Maximal output dropout
1.7V, sink current 25mA
Number of outputs
1
Strobe output mappingYestable 3-53, Optically isolated digital output, general info

3.10.4.2.

Optically isolated Digital Output Delay

Output current
OFF -> ON
ON -> OFF2mA
0.55 µs
41 µs
5mA
0.6 µs43 µs
10mA
0.88 µs
51 µs
25mA
1.4 µs
51 µs
table 3-54, Optically isolated digital output, delayxiC - Technical Manual Version 2.02

Note
VOUTPUT=5V, TAMBIENT=25°C
VOUTPUT=5V, TAMBIENT=25°C
VOUTPUT=11V, TAMBIENT=25°C
VOUTPUT=13V, TAMBIENT=25°C

78

3.10.4.3.

Optically isolated Digital Output – Internal schematic

Following scheme is the internal scheme of the Digital Output signal flow inside the camera.
PTC Fuse
FPGA_OUTPUT
Idrive=2mA

DIGITAL OUTPUTILOA D

10K

1K

GND

GND (Common IO Ground)figure 3-53, digital output, interface schematic
Output Transfer Characteristic
When Output is in On state - typical transfer characteristic of output is as on following figure:
2.0

VOUTPUT (V)

1.8
1.6
1.4
1.2
1.0
0.8
0.6

0.4
0.2

Output Transfer Characteristic (Receptacle)

0.0
0

5

10

15

20

25
30
IOUTPUT (mA)figure 3-54, digital output transfer characteristics

3.10.4.4.

Digital Output – Wiring

Digital output has an open collector switching transistor with common IO Ground. In most cases a power source for external
device must be provided.

3.10.4.4.1. Connecting Digital OUTPUT to an NPN-compatible PLC device input (biased)
Output stateOutput switch state
Input stateON
Sourcing current
Pull up (energized)
OFF
Relaxing
Not energizedtable 3-55, Connecting Digital OUTPUT to an NPN-compatible PLC device input (biased)xiC - Technical Manual Version 2.02

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Power Supply

CameraPLC Device
DIGITAL OUTPUT

CommonInput
GND (Common IO Ground)figure 3-55, Connecting Digital OUTPUT to a NPN-compatible PLC device input (biased)
Important note:•If using this configuration, consider that Common Ground connection may be biased by power supply for Digital Input!

3.10.4.4.2. Connecting Digital OUTPUT to an NPN-compatible PLC device inputThis type of connection is possible only when opto-isolated input is used (bidirectional in some cases) or when only one general
opto-isolated input is used.

Output stateOutput switch state
Input stateON
Sourcing current
Pull down (energized)
OFF
Relaxing
Not energizedtable 3-56, Connecting Digital OUTPUT to an NPN-compatible PLC device input

Power Supply

CameraPLC Device
DIGITAL OUTPUT

Input

CommonGND (Common IO Ground)figure 3-56, Connecting Digital OUTPUT to an NPN-compatible PLC device input - more bidirectional inputs used
Note:•

In this case a bidirectional opto-isolated input must be used

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Power Supply

CameraPLC Device
DIGITAL OUTPUT

IN-

IN+
GND (Common IO Ground)figure 3-57, Connecting Digital OUTPUT to a NPN-compatible PLC device - single input

3.10.4.4.3. Connecting Digital OUTPUT to a PNP-compatible device
Output stateON
OFF

Output switch state
Sinking current
Relaxing

Input state
Not energized
Pull up (energized)

table 3-57, Connecting Digital OUTPUT to an PNP-compatible device
Power Supply

External pull up
CameraPLC Device
DIGITAL OUTPUT

Input

CommonGND (Common IO Ground)figure 3-58, Connecting Digital OUTPUT to a PNP-compatible device

Pull up resistor can be calculated as follows:

R=

Vpsu − Vinput
I input

Where:
Vpsu

power supply voltage. Must be higher than required input amplitude

Vinput required input amplitude

I input

input driving current (corresponding to input amplitude)

Remember to use the appropriate resistor power rating P (R )  (Vpsu −Vinput ) * I input

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3.10.4.4.4. Output Wiring Example: LED Driving
LED can be driven directly by camera digital output. A series resistor must be used to limit LED current.
CameraLED

Power Supply

R

DIGITAL OUTPUT
VOUTPUTVPSU

GND (Common IO Ground)figure 3-59, LED Driving
V −V−V
LED series resistor can be calculated by the following equation: R = psu output led
I led

Where:
Vpsu

power supply voltage (5V to 24V)

Voutput voltage across digital output pins (see. 3.10.4.1 Optically isolated Digital Output - General info )Vled

LED forward voltage (see table below)

I led

LED current

Note:
•

Remember to use the appropriate resistor power rating

𝑃(𝑅𝐸𝑆) = 𝐼𝑙𝑒𝑑 2 × 𝑅 = (𝑉𝑝𝑠𝑢 − 𝑉𝑙𝑒𝑑 ) × 𝐼𝑙𝑒𝑑

Typical LED forward voltage
LED Color

Vled (typ.)Standard Red
1.7V
Super Bright Red
1.85V
Low power Red
1.7V
Orange2.0V
Yellow
2.1V
Green
1.9V
Emerald Green
2.1V
Blue
2.5V
White
2.8V
Infra-Red
1.3V
table 3-58, digital output, LED driving

xiC - Technical Manual Version 2.02

Vled (max.)
2.1V
2.5V
2.0V
2.1V
2.2V
2.5V
2.7V
3.7V
3.8V
1.8V

Note

Opto-coupler82

3.10.4.4.5. Output Wiring Example: Inductive load (Relay) Driving
Do not connect inductive load RL directly to Camera Digital Output. A transistor must be used to prevent damage of the output.
See image below for possible inductive load driving. Resistor R can be connected to Digital Outputs and power supply to provide
the necessary bias current for transistor. You should also use an external diode to protect the transistor from over voltage while
disconnecting an inductive load. Keep in mind that this connection has an inverted logic. Current will flow through the load at
the start of the camera.
Power Supply

D

RL

R

CameraDIGITAL OUTPUTT

GND (Common IO Ground)figure 3-60, Inductive load (Relay) Driving (inverted logic)

For positive logic you can use a second bipolar transistor.
Power Supply

R1

R2

RL
D

T2

CameraDIGITAL OUTPUT

T1

GND (Common IO Ground)figure 3-61, Inductive load (Relay) Driving (non-inverted logic)

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3.10.4.4.6. Output Wiring Example: Driving the trigger input of a strobe controller
The digital output can be used to drive a strobe controller according to the table below.
Driving the trigger input of a strobe controller
Trigger polarity
Positive edge
Negative edge

Opto-isolated
controller input
Yes
Yes

Output
delay
0.5µs
0.5µs

WiringDescription

figure 3-55
figure 3-57

Positive edge

No

155µs

figure 3-58

Negative edge

No

0.5µs

figure 3-58

Not recommended in cases when short delay time isrequired. Output delay is much longer than in otherwiring examples. Use external pull up in case that nopull up at controller input is used.
Note that external pull up is not used in this case.
Assume that internal pull up at the controller input isused.

table 3-59, digital output, wiring examples

3.10.4.5.

Digital Output – Timing

Typical input delay between FPGA Output to Digital Output
Edge TypeTyp. delay [μs]Off -> On
0.5
On -> Off155
table 3-60, digital output, typical timing
Note: Measured at conditions: VOUTPUT=18V, TAMBIENT=27°C

Output delay depending on output current:
Output current
OFF->ON
ON->OFF2mA
0.55μs184μs
5mA
0.55μs182μs
10mA
0.55μs133μs
25mA
0.55μs
113μs
table 3-61, digital output, current depending on timing
Note: Measured at conditions: VOUTPUT=11V, TAMBIENT=25°C

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3.10.5. Non-isolated Digital Lines (-UB and -TC only)
Non isolated Digital lines can be used as inputs or outputs compatible with TTL logic. These are high impedance pins so whenused as output high impedance slave input must be used.

100k

FPGA GPIO

1k0

10k

100R

INOUT

10p

GND

GND

GND

figure 3-62, non-isolated input/output, interface schematic

3.10.5.1.

Non-isolated Digital Input/Output (INOUT) General info

Item
Number of digital lines

Parameter/note
2, each line can be configured by application separately as input or
output24V DC
Yes, AUX power GND
Reverse voltage polarity protected
No damage, no lost data

Maximum input voltage
Common pole
Effect of incorrect input terminal connection
Effects when withdrawing/inserting input module
under powerProtection
Short-circuit/over-current/reverse voltage
Maximal output sink current
30µA, maximum advised load = 60kΩ
Inductive loads
No
Output level logical 0<0.4V, Load 100kΩ
Output level logical 1>2.5V, Load100kΩ
Output delay – rising edge
400ns, Load 100kΩ, threshold 2V
Output delay - falling edge
450ns, Load 100kΩ, threshold 0.5V
Input impedance – minimum
15kΩ
Input level for logical 0<0.7V
Input level for logical 1>3.3V
Input debounce filter
No
Input delay – rising edge
750ns, VINPUT=5V, TAMBIENT=25°C
Input delay – falling edge1
1200ns, VINPUT=5V, TAMBIENT=25°C
Input functions
Trigger, get current level; Rising or falling edge are supported for trigger
Output functions
Off, On, Exposure active, Frame active; Signal inversion supported
table 3-62, General info for non-isolated digital in/out trigger lines.
NOTE 1) Because of low input impedance of non-isolated input it is not possible to connect master slave of two cameras
directly. Signal conditioning (buffer, opamp…) is required

3.11. External power supply input (AUX)
Item
Parameter/note
Supported voltage range
4.5-5.5V
Typical input current1
0.65A, @5V while acquiring
1
Maximum input current
0.67A, @5V
Protection
Over/under voltage protection
table 3-63, External power supply input (AUX)
Note 1) Is model depended. Used values are for MC124MG-SY-TC

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3.12. Heat Dissipation
XIMEA strives to offer the smallest cameras with the highest performance. Although the cameras are first in terms of power
efficiency, the high packing density of components can lead to elevated temperatures, and an adequate dissipation of this heatmust be ensured. The cameras rely on adequate surface contact with a thermal mass (tripod, lens, heat sink) of sufficient sizefor heat dissipation and this must be provided by the user.

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3.13. CBL-U3-1M0 / CBL-U3-3M0 / CBL-U3-5M0
1.0m / 3.0m / 5.0m USB 3.0 cables
Asper Customer Requirements (max. 10M recommended)

2

10
6

1

3
4

4

5
1

figure 3-63, drawing USB3 cable
Item
Description
1
USB A 3.0 9 pin Molded Plug <BLK>
2
MCD-USB-211 [OD= 7.3mm] <BLK>
3
3 USB MicB 3.0 sl 10 pin Molded Plug with Screw Locking <BLK>
4
Cable Labeltable 3-64, USB3 cable, components

1 VBUS
2 D3 D+
4 GND
5 StdA-SSRX6 StdA-SSRX+
7 GND-DRAIN
8 StdA-SSTX9 StdA-SSTX+

Red
White
Green
Blue
Yellow

White
Green
Black

VioletOrangeBlue
Yellow
VioletOrangeShell Braid Shield

VBUS 1
D- 2
D+ 3
GND 5
MicB-SSTX6
MicB-SSTX+
7
GND-DRAIN
8
MicB-SSRX9
MicB-SSRX+
10Braid ShieldShell

figure 3-64, wiring USB3 cable
Pin
SignalDescription
1
VBUS
Power
2
DUSB 2.0 signal pair
3
D+
4
ID
OTG Identification
5
GND
Power Ground6
MicB_SSTXUSB 3.0 SuperSpeed transmitter signal pair7
MicB_SSTX+8
GND_DRAIN
USB 3.0 signal Ground9
MicB_SSRXUSB 3.0 SuperSpeed receiver signal pair10
MicB_SSRX+
table 3-65, USB3 connector, pin assignmentx x .x M X Y ZSpecified
Cable Length

Week
Year

figure 3-65, label details USB3 cable

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3.14. CBL-U3-3M0-ANG
3.0m USB 3.0 cable, angled micro USB3 connector

figure 3-66, drawing USB3 cable angled
Item
1
2
3
4

Description
USB A 3.0 9 pin Molded Plug <BLK>
A12-7143 [OD=5.9mm] <BLK> UL20726 2STP#30 + 1UTP#28 + 2C#26
USB MicB 3.0 sl 90D A1(10 pin Molded Plug) <BLK>
Cable Labeltable 3-66, USB3 cable angled, components

1 VBUS
2 D3 D+
4 GND
5 StdA-SSRX6 StdA-SSRX+
7 GND-DRAIN
8 StdA-SSTX9 StdA-SSTX+

Red
White
Green
Blue
Yellow

White
Green
Black

VioletOrangeBlue
Yellow
VioletOrangeShell Braid Shield

VBUS 1
D- 2
D+ 3
GND 5
MicB-SSTX6
MicB-SSTX+
7
GND-DRAIN
8
MicB-SSRX9
MicB-SSRX+
10Braid ShieldShell

figure 3-67, wiring USB3 cable angled
Pin
SignalDescription
1
VBUS
Power
2
DUSB 2.0 signal pair
3
D+
4
ID
OTG Identification
5
GND
Power Ground6
MicB_SSTXUSB 3.0 SuperSpeed transmitter signal pair7
MicB_SSTX+8
GND_DRAIN
USB 3.0 signal Ground9
MicB_SSRXUSB 3.0 SuperSpeed receiver signal pair10
MicB_SSRX+
table 3-67, USB3 connector, pin assignmentx x .x M X Y ZSpecified
Cable Length

Week
Year

figure 3-68, label details USB3 cable angled

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3.15. CBL-MQ-FL-0M1/CBL-MQ-FL-0M25
Cable FPC MQ Flex-Line, 0.1m/0.25m can be used for connecting xiC flex line models to carrier board or trough adapter andstandard USB 3.0 cable to the host computer. Minimal advised bending radius is 2mm. Cable thickness 0.16mm.

figure 3-69, flex cable gold color
Cable have marked ends. It is important to connect the end marked “CAM” to the camera and end marked “BOB” tohost or adapter. Swapped orientation leads to nonoperational state. Connecting camera to powered host can cause
destruction of camera. For detaching cable, the connector needs to be unlocked, otherwise connector soldering may bedamaged.

figure 3-70, flex cable ends

3.16. CBL-USB3FLEX-0M10 / CBL-USB3FLEX-0M25 / CBL-USB3FLEX-0M50
The newer generation of FFC cable with available lengths 0.1m, 0.25m and 0.5m can be used for connecting camera to carrierboard or trough adapter to the host computer. Minimal advised bending radius is 5mm. Cable thickness 0.38mm. This cable is
NOT polarized and either end can be used for the camera or the host.

figure 3-71, flex cable white color

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3.17. BOB-MQ-FL
Break Out Board, Simple Board Level. Enables access to the opto-isolated input and output. FPC cable connector pinout isexactly mirrored from camera pinout. Please refer to 3.9.2 Pinning

figure 3-72, drawing USB3 cable

PCB-BOB-MQ-FL

GPO1
GPIO
GND

GPI1
PU

figure 3-73, BOB-MQ-FL dimensions
Pin
SignalDescription
1
GPO1
Trigger/sync digital Output (GPO) - Open collector NPN – connected to pin 3 on Flex connector
2
GPIO GND
GPO1 and GPI1 common ground – connected to pin2 on Flex connector
3
GPI1
Trigger/sync digital Input (GPI) Current limited input – connected to pin1 on Flex connector
4
PU
Pull up 1kOhm to GPO1 – Connect power supply up to 25V if needed
table 3-68, IO connector (WAGO 218-104), pin assignment

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3.18. CBL-702-8P-SYNC-5M0
5.0m xiC / xiT series I/O Sync cable 8 poles

Sync cable wiring

4
3

5

2

8
1

6

7

figure 3-74, IO/AUX cable pin numbering
Pin
color
Signal1
White
AUX power supply input
2
Brown
INOUT2 - non-isolated Input/Output
3
Green
OUT1 - Opto-isolated Output
4
Yellow
OUT_GND Opto-Isolated output ground pole5Grey
IN1 - Opto-isolated Input
6
Pink
IN_GND Opto-Isolated input ground pole
7
Blue
External grounds for power supply and non-isolated I/O
8
Red
INOUT1 - non-isolated Input/Output
table 3-69, IO/AUX cable, pin assignment
3rd party cables compatible with xiCPart number
Manufacturer
79 1426 12 08
binder79 1426 15 08
binder79 1426 72 08
binder79 1426 75 08
binder79 1462 212 08
binder79 1462 215 08
binder79 1462 275 08
binder79 1462 272 08
bindertable 3-70, alternative cables

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Link
https://www.binder-usa.com/products/partsdetail/88888
https://www.binder-usa.com/products/partsdetail/88890
https://www.binder-usa.com/products/partsdetail/88889
https://www.binder-usa.com/products/partsdetail/88892
https://www.binder-usa.com/products/partsdetail/88901
https://www.binder-usa.com/products/partsdetail/88904
https://www.binder-usa.com/products/partsdetail/88905
https://www.binder-usa.com/products/partsdetail/88906

913.19. Tripod Adapter – MECH-MC-BRACKET-KIT
xiC series tripod mounting bracket

xiC
MC050CG-SY-TC
CICAC1623001
USB 3.1 Gen 1

xiC
USB3.1Gen1ION
USB3VIS

IO
AUX
power
Made in SK

1
2
3
4

Type C

figure 3-75, mounting tripod adapter
xiC series tripod mounting bracket with 1/4-20 thread.
Use 4x SROB-M2x4-CUST screws (included) for mounting. Bracket can be mounted on the bottom or top side of the camera.

3.19.1. Dimensional drawings

figure 3-76, dimensional drawing tripod adapter
Mass without screws: 11.4 g.

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3.20. USB 3 host adapters
USB 3.0 to PCI Express x1 Gen2 Host Card

figure 3-77, USB3 host adapters
Please refer to following page https://www.ximea.com/support/projects/usb3/wiki/USB_3_Host_Adapters for more
information.
System requirements
All requirements depend on selected host adapter. Please refer to host adapter specification

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4. Operation
For a proper operation of your xiC camera there are certain requirements that must be met. You can read more about theserequirement as well as about the correct usage of xiC camera in the following sections.

4.1.

System Requirements

4.1.1. Software Requirements
The xiC cameras are compatible with the following operating systems:•

Windows 10•

Windows 7 SP1•

Linux Ubuntu•

MacOS 10.8 or newer

All XIMEA cameras are compatible with the most advanced Vision and Image Processing Libraries.
See chapter 5 Software for more information about the options to access a xiC cameras, as well as a list of currently
supported libraries and frameworks supported in Windows.
For more information visit page: https://www.ximea.com/support/wiki/apis/APIs

4.1.2. Hardware Requirements
The XIMEA xiC cameras are compatible with USB 3.1, USB 3.0 and USB 2.0. Please note, that the highest performance can only
be achieved by using high performance USB 3.1 or USB 3.0 ports. Using a USB 2.0 port will lead to a limited frame rate.
Please note details and the most recent info at:

Recommended hardware

4.1.2.1.

http://www.ximea.com/support/wiki/usb3/Compatible_hardware

System Configuration

Minimum system configuration:
For a basic operation of your xiC camera with a PC the following minimum system configuration is required. Please note thatbandwidth and processing performance are tied to the hardware configuration and the minimum hardware configuration could
lead to a reduced bandwidth and limited frame rate.
CPU:Intel i3 or better

RAM:

2GB RAM or more

Disc Space:

200 MB of free disc space

Video:NVIDIA or Radeon graphics card 128MB or integrated on CPU

Ports:

Motherboard with USB 2.0 or USB 3.0 port or PCIe x1-16 Gen 2 slot for compatible USB 3.0 host
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Recommended system configuration:
For best processing performance and bandwidth, we recommend using the following system configuration. This is essential
when using the higher resolution models for achieving maximum frame rate.

4.1.2.2.

CPU:Intel i7RAM:

4GB RAM or more

Disc Space:

200 MB of free disc space

Video:NVIDIA or Radeon graphics card 128MB or integrated on CPU

Ports:

Motherboard with a USB 3.1 Gen1 port connected to a high-performance chipset (e.g., Intel QM77, Z77
or successors) and/or PCIe x1-16 Gen 2 slot for compatible USB 3.1 Gen1 host adapter. Some host
adapters may require PCIe Gen3 ports (see next chapter for more details).

USB 3.1 Host Adapter

For a stable operation of your xiC camera and achieving the maximum possible system performance with the highest frame rate
it is important to choose an appropriate USB 3.1 host adapter chipset.
Please have a look at the following link to our webpage: http://www.ximea.com/support/wiki/usb3/Compatible_hardware
XIMEA maintains a regularly updated overview of compatible USB 3.0 and USB 3.1 host adapters together with the available
bandwidth https://www.ximea.com/support/projects/usb3/wiki/USB_3_Host_Adapters
The maximum data transfer rate depends on different conditions (motherboard, chipset, driver version, operating system, etc.).
PCI Express (PCIe) bus speed requirement: To achieve maximum performance of USB3 cameras - USB 3.1 host adapter must
be connected to the PCIe slot/port/hub and running at 5GT/s in case of PCIe Gen2 host adapters. For cards requiring Gen3 thespeed needs to be 8GT/s.

4.1.2.3.

CablesThe USB 3.1 Gen1 cable that you use with the xiC camera is responsible for the power supply and the data transfer to the PC. It
is required to use an industrial USB 3.1 Gen1 cable with a proper wiring and shielding. We recommend using XIMEA industrial
USB 3.1 Gen1 cables to achieve the maximum possible performance of the camera.
XIMEA offers several passive USB 3.1 Gen1 cables and a sync cables, please see 3.13 CBL-U3-1M0 / CBL-U3-3M0 / CBL-U35M0, 3.14 CBL-U3-3M0-ANG and 3.15 CBL-MQ-FL-0M.

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4.2.

Video Formats

4.2.1. Full Resolution
By default, each camera outputs a full resolution image based on its sensor specification.

4.2.2. ROIs – Region of Interest
ROI, also called area-of-interest (AOI) or windowing, allows the user to specify a sub-area of the original sensor size for readout.
Depending on the sensor xiC cameras support the definition of one single ROI by specifying the size (width and height) as wellas the position (based on upper left corner) of the of the sub-area.
Please note 3.5 Model Specific Characteristics

4.2.3. Downsampling Modes
Downsampling describes the possibility of reducing the image resolution without affecting the sensors physical size, i.e., without
reducing the physical size of the sensing area. This feature is useful when optics are used, that are particularly fitted to a certain
sensor size and if it is necessary to maintain the full image circle on the sensor.
Downsampling can be achieved in two ways: binning and decimation.

4.2.3.1.

Binning

When binning is applied, the image is divided into cluster of k*l pixels, where all pixels in each cluster are interpolated and resultin the value of one output pixel. For example, a 2*2 binning produces 2*2-pixel clusters and results in images with ¼ of theoriginal resolution.

4.2.3.2.

Decimation

When decimation is chosen, only every n-th pixel is used to create the output image. For example, with a 2x1 verticaldecimation, every odd number line is used, and every even number line is skipped, resulting in an image with half its original
vertical resolution. Decimation is a faster downsampling mode, but also introduces more aliasing effects.

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4.2.4. Image Data Output Formats
All modes are provided by the xiAPI or standard interfaces using the xiAPI (please note 5.1 Accessing the Camera).
Each xiC cameras supports several Image Data Output Formats.
Mode
RAW8

Description
Raw sensor data, 8 Bit per pixel, single channel
Raw sensor data, 16 Bit per pixel, single channel
RAW16
10- or 12-Bit sensor output (LSB) with bit-shift up to 16 Bit
MONO8Intensity output, 8 Bit per pixel, single channel
MONO16
Intensity output, 16 Bit per pixel, single channel
RGB24
RGB filtered output, 24 Bit per pixel, 3 channels Sequence: [Blue][Green][Red]RGBA filtered output, 32 Bit per pixel, 4 channels, Alpha channel equals 0. Sequence:
RGB32[Blue][Green][Red][0]RGB_PLANAR
RGB filtered output with planar-oriented channels. Format: [R][R]...[G][G]...[B][B]...
Data from transport layer (e.g., packed). This format is optimal when an efficient storage and
FRM_TRANSPORT_DATA later (offline) processing is required.
Format is defined by XI_PRM_TRANSPORT_PIXEL_FORMAT
table 4-1, image formats,
Note1: For color modes RGB32 and RGB24 the image from sensor needs to be pre-processed (de-bayering). CPU load is higher
in these modes. Setting this parameter will reset current region of interest. RGB24 is being processed from the RGB32 byremoving the unused Alpha channel creating a slightly higher CPU load than the RGB32 format.
Note2: The color filtering (de-bayering) relies on the interpolation of adjacent pixels in order to create pixel in the target image.
Pixels on the edges of the image are missing adjacent pixels and therefore cannot be used for the interpolation process. The
result is a target image that is smaller than the source image (4 pixels on all sides).
Note3: For most formats the transport data can be packed. 12-bit pixel bit depth transfers only 12-bit per pixel compared to
16bit per pixel when the data are not packed. In case of packed format, the CPU load is higher due to unpacking of the image
data. Available bandwidth is however used optimally.

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4.2.5. Digitization bit depth
In case of most cameras, changing the sensor digitization bit depth may increase the maximum possible frame rate,
but does not affect the saturation capacity.

figure 4-1, Saturation vs Sensor output for different digitization bit depths
Cameras featuring 2nd and 4th generation of Sony Pregius sensors have special 8-bit digitization mode, which features the same
conversion gain as 10-bit mode using only ¼ of the saturation. This leads to four times brighter images compared to 10-bit and12-bit modes.

figure 4-2, Saturation vs Sensor output for different digitization bit depths 2nd generation IMX sensors

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4.3.

Acquisition modes

4.3.1. Free-Run
Also known as continuous acquisition. In this mode the sensor delivers a constant stream of image data at the maximum speed
available by the current bandwidth, without any external trigger. Each image exposure is sequentially started automatically whenpossible.
For all sensors the exposure of the next frame overlaps with the data readout of the previous frame.
This Overlap mode gives the highest number of frames per second (FPS).

figure 4-3, acquisition mode - free run
In this mode the timing depends on the Exposure Time and Data Readout Time.
In situation when the exposure time is comparable or longer than readout time, the exposure active signal might have constantactive level during acquisition. This might be caused also by different propagation delay for rising and falling edge of optoisolated outputs. (See 3.10.4 Optically isolated Digital Output) Polarity inversion might help to make visible the separated
exposure pulses.
All xiC cameras support limiting of FPS. When set the camera will limit the frame rate so it does not exceed the set value.
Please see: Frame_Rate_Control: https://www.ximea.com/support/wiki/allprod/Frame_Rate_Control
This is also applicable in case of triggered acquisition.

4.3.2. Trigger controlled Acquisition/Exposure
Unlike in the free-run, each image exposure can also be triggered with an input trigger signal. In this mode, the sensor waits
in stage until the trigger signal arrives. Only then, the exposure of first frame is started, which is followed by the data readout.
Ximea cameras supports several triggered modes along with single image exposure after one trigger. The trigger signal can beeither edge-sensitive or level-sensitive. In case of level-sensitive, it can used to control length of exposure or acquisition itself.
Generally, trigger sources can be divided in to two groups:
Software Trigger
The trigger signal can be sent to the sensor using a software command. In this case, common system related latencies andjitter apply.
Hardware Trigger
A hardware trigger can be sent to the sensor using the digital input described in 3.10.3 Optically isolated Digital Input, or nonisolated ports configured as input described in 3.10.5 Non-isolated Digital Lines (-UB and -TC only) Triggering by hardware isusually used to reduce latencies and jitter in applications that require the most accurate timing.

4.3.2.1.

Triggered acquisition - single frame

Sensors support exposure overlap with readout. When the trigger period (ttper) is longer than the exposure plus readout time,
exposure is not overlap with readout. However, when the trigger period is decreased, the sensor will expose the images in
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overlap mode. In this case, the frame active signal will be constantly active. The trigger period must be long enough, so the
exposure of next frame does not end sooner than readout of previous frame.
Sensor timing in Exposure Overlap with Data Readout Modefigure 4-4, acquisition mode – triggered with overlap
Description:

teio– Trigger (Digital Input) to Exposure Active (Digital Output)

texp– Trigger (Digital Input) to start of exposure

texps– Current Exposure Time set (XI_PRM_EXPOSURE)

tfot– Frame overhead time (FOT) – does not necessarily equal interframe timetrd

– readout time (Readout Time)trow– readout time of one row (Line period) depends on sensor settings

Conditions: Debounce on trigger input line and trigger delay are disabled.
The timing strongly depends on camera settings. Most of the times can be calculated using Camera performance calculator.
The delay between trigger input and start of exposure:𝑡𝑒𝑥𝑝 = 3 × 𝑡𝑟𝑜𝑤 + 𝑡𝑖𝑑𝑒𝑙𝑎𝑦
Where:
tidelay– Delay inside camera caused by internal electronics. This depends on input type.
Please refer to: 3.10.3 Optically isolated Digital Input or 3.10.5 Non-isolated Digital Lines (-UB and -TC only)

The output signaling is then delayed the delay introduced from the output electronic.
𝑡𝑒𝑖𝑜 = 𝑡𝑒𝑥𝑝 + 𝑡𝑜𝑑𝑒𝑙𝑎𝑦
Where:
todelay– Delay inside camera caused by internal electronics. This depends on output type.
Please refer to: 3.10.4 Optically isolated Digital Output or 3.10.5 Non-isolated Digital Lines (-UB and -TC only)

For minimum trigger period (ttper) the following applies. The next trigger after one is processed needs to be applied so the end of
the triggered exposure does not overlap with the readout of the previous frame.
𝑡𝑡𝑝𝑒𝑟 > max⁡(𝑡𝑟𝑑 , 𝑡𝑒𝑥𝑝 ) + 𝑡𝑓𝑜𝑡

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4.3.2.2.

Triggered acquisition - burst of frames

Frame Burst Start
In this mode each trigger pulse triggers defined number of exposed frames.

figure 4-5, triggered burst of frames – frame burst start, number of frames in burst set to 3

Frame Burst Active
If trigger is level-sensitive, it can be used to control image acquisition.

figure 4-6, triggered burst of frames – frame burst active
Please see: Frame Burst Modes: https://www.ximea.com/support/wiki/allprod/Frame_Burst_Modes

4.3.2.3.

Exposure defined by trigger pulse length

In this mode the exposure is defined by trigger pulse length. This can be used to achieve longer exposure than allowed by API.
Also, it can be used to trigger several images in sequence with different exposure time. Exposure time is measured and reported
in image metadata.

figure 4-7, Exposure defined by trigger pulse length
Please see: Exposure Defined by Trigger Pulse Length:

https://www.ximea.com/support/wiki/allprod/Exposure_Defined_by_Trigger_Pulse_Length

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4.3.2.4.

Multiple exposures in one frameAll xiC camera models based on 2nd gen Sony Pregius sensors (except MC023xG-SY) support defined number of exposures
exposed into a single frame.
In this mode the number of exposures need to be defined. The number of exposures can be defined using the xiApi parameter
XI_PRM_EXPOSURE_BURST_COUNT. The readout of the frame starts after the last exposure period has finished.
It can operate in two modes:
1.

Exposure defined by xiApi parameter "XI_PRM_EXPOSURE"
In this mode the trigger defines the start of the exposure, but the length of the exposure is defined by the
XI_PRM_EXPOSURE xiApi parameter. Set exposure length using XI_PRM_EXPOSURE parameterand set XI_PRM_TRG_SELECTOR to XI_TRG_SEL_EXPOSURE_START.
// Set exposure
xiSetParamInt(xiH, XI_PRM_EXPOSURE, 1000);// Set the number of times of exposure in one frame
xiSetParamInt(xiH, XI_PRM_EXPOSURE_BURST_COUNT, 5);// Set trigger selector
xiSetParamInt(xiH, XI_PRM_TRG_SELECTOR, XI_TRG_SEL_EXPOSURE_START);

figure 4-8, Multiple exposures - defined exposure time, number of exposures set to 5

2.

Exposure is defined by length of trigger pulse.
In this mode both the start of the exposure as well as the length of the exposure is defined by the trigger pulse. Set
XI_PRM_TRG_SELECTOR to XI_TRG_SEL_EXPOSURE_ACTIVE. The exposure length will be defined by trigger pulse
length.
// Set the number of times of exposure in one frame
xiSetParamInt(xiH, XI_PRM_EXPOSURE_BURST_COUNT, 5);// Set trigger selector
xiSetParamInt(xiH, XI_PRM_TRG_SELECTOR, XI_TRG_SEL_EXPOSURE_ACTIVE);

figure 4-9, Multiple exposures - exposure time defined by trigger pulse length, number of exposures set to 5
In both above modes there is a short period (FOT) after each exposure during which the next exposure cannot start. In case of
the cameras with IMX sensors this period is 11*line period (the line period depends on various other parameters, see Line
Period in the using Camera performance calculator).

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4.4.

Camera Parameters and Features

4.4.1. Short Interval Shutter Mode
Cameras based on the IMX530, IMX531, IMX532, IMX540, IMX541 and IMX542 sensors support short interval shutter mode. In
this mode a pair of consecutive frames can be grabbed with virtually no gap between the end of the exposure of the first frameand start of the exposure of the second frame. This feature is particularly desired in Particle Image Velocimetry (PIV) because it
allows positioning two laser pulses with short separation on sequential frames (frame straddling).
This feature is supported in free run as well as in triggered acquisition modes. In triggered mode a single trigger will result in apair of frames.
The lengths of the exposures of both frames are fixed and their exact values depend on the camera’s settings (e.g., sensor data
bit depth, bandwidth limit etc.). The first exposure (texp1) is in magnitude of hundreds of microseconds and the second
exposure (texp2) equals to the readout time. The time between the end of the first exposure and start of the second exposure isvery short. However, the sensor manufacturer recommends a period (Flash Prohibited Period) with a magnitude of 2 - 3
microseconds during which the flash should not be fired to ensure correct operation. This period is indicated in the exposure
active signal which can be forwarded to the camera’s digital output. Please note that it is recommended to use the non-isolated
outputs of the camera with low capacitance IO cables to ensure low distortion of the output signal.

figure 4-10, short interval shutter mode – triggered
Description:

texp– Trigger (Digital Input) to start of exposure

teio– Trigger (Digital Input) to Exposure Active (Digital Output)

texp1– Exposure Time of the first image

tfpp– Flash Prohibited Period

texp2– Exposure Time of the second image

tfot– Frame overhead time (FOT) – does not necessarily equals interframe timetrd

– readout time (Readout Time)The timing strongly depends on camera settings.
The output signaling is then delayed the delay introduced from the output electronic.
𝑡𝑒𝑖𝑜 = 𝑡𝑒𝑥𝑝 + 𝑡𝑜𝑑𝑒𝑙𝑎𝑦
Where:
todelay– Delay inside camera caused by internal electronics. This depends on output type.
Please refer to: 3.10.4 Optically isolated Digital Output or 3.10.5 Non-isolated Digital Lines (-UB and -TC only)

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4.4.2. Dual ADC modes
Cameras based on the IMX530, IMX531, IMX532 sensors support Dual ADC readout modes. In these modes a single exposed
frame can be read out twice via different readout channels resulting in two images with different analog gain settings. The highgain (HG) image has a lower readout noise and therefore offers better signal to noise ratio (SNR) in the low light regions of thescene. On the other hand, the low gain (LG) image offers higher SNR in the well illuminated regions of the scene as it utilizes thelarger (or the whole) portion of the full well capacity.

figure 4-11, Dual ADC non-combined without merging

These two images can be either read out separately from the sensor (Non-combined mode) and transported to the host PC
memory or combined in the sensor into a single HDR frame with a piecewise linear response. (Combined mode).
// Set dual ADC mode to non-combined or combined
xiSetParamInt(xiH, XI_PRM_DUAL_ADC_MODE,XI_DUAL_ADC_MODE_NON_COMBINED);// or
xiSetParamInt(xiH, XI_PRM_DUAL_ADC_MODE, XI_DUAL_ADC_MODE_COMBINED);
The gain parameter is used to define the analog gain of the low gain channel (slope A) and the dual ADC gain ratio parameter isused to adjust the offset/ratio of the analog gain of the high gain channel (slope B / slope A).
// Set gain selector to analog
xiSetParamInt(xiH, XI_PRM_GAIN_SELECTOR, XI_GAIN_SELECTOR_ANALOG_ALL);// Set gain to arbitrary value
xiSetParamFloat(xiH, XI_PRM_GAIN, 0);// Set gain ratio to arbitrary value// depending on the gain value the range can be from 0–24 dB// with 6 dB increment
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4.4.2.1.

Non-combined mode

In the non-combined mode both images are read out from the sensor and are transported to the host PC memory. Dependingon the used image data format, these images can be either passed directly to the application or can be merged into a single
linear output with extended dynamic range. The merging is performed in the xiAPI library running on the host computer's CPU
and is optimized for processor’s with x86 architecture.

figure 4-12, Dual ADC non-combined with merging

In case of RAW8X2, RAW16X2 or TRANSPORT_DATA image data format, for each pixel a sequence of LG and the HG channel
values are passed to the application ([pixel 0 LG val, pixel 0 HG val, pixel 1 LG val, pixel 1 HG val, …])// Use X2 or transport format to deliver values from HG and LG channels
xiSetParamInt(xiH, XI_PRM_IMAGE_DATA_FORMAT,XI_RAW16X2);// Set ADC bitdepth to desired value
xiSetParamInt(xiH, XI_PRM_SENSOR_DATA_BIT_DEPTH,12);// Set image data bitdepth to desired value
xiSetParamInt(xiH, XI_PRM_IMAGE_DATA_BIT_DEPTH,12);
In case of all other image data formats, the data from the LG and HG channels are merged into a single linear output withextended dynamic range.
// or use any other formats to other to deliver merged from HG and
xiSetParamInt(xiH, XI_PRM_IMAGE_DATA_FORMAT,XI_RAW16);// Set ADC bitdepth to desired value
xiSetParamInt(xiH, XI_PRM_SENSOR_DATA_BIT_DEPTH,12);// Set image data bitdepth to desired value
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4.4.2.2.

Combined mode

In the combined mode the HG and LG images are merged directly in the sensor. This mode usually gives a higher frame rate
than the non-combined mode since instead of two (8 or 12 bit) values only one (8 or 12 bit) value is read out from the sensor
and transported to the PC memory. There is also less processing overhead in the xiAPI library as the data are already merged in
the sensor. Since the output data bit depth from the sensor is limited to the set ADC bit depth, the data is compressed in thesensor using a piecewise linear function.

figure 4-13, Dual ADC combined mode
The threshold of the usable range of the HG channel can be set using the dual ADC threshold parameter.
// define the upper threshold of the usable HG data
xiSetParamInt(xiH, XI_PRM_DUAL_ADC_THRESHOLD,3071);
The starting point of the region is defined as a percentage of the maximum ADC output (can be also interpreted as a percentage
of full well capacity at the given analog gain setting). It has a logarithmic increment and can have values of 50,25,12.5 …
percent. The slope of the corresponding linear segment is defined as offset from the gain of the HG channel. The above diagram
corresponds to the below settings:// Slope B was defined earlier by setting ADC gain ratio to 12dB// Set up the start and gain (Slope C) of compression region 1
xiSetParamInt(xiH, XI_PRM_COMPRESSION_REGION_SELECTOR,1);
xiSetParamFloat(xiH, XI_PRM_COMPRESSION_REGION_START,12.5);
xiSetParamFloat(xiH, XI_PRM_COMPRESSION_REGION_GAIN,-12);// Set up the start and gain (Slope D) of compression region 2
xiSetParamInt(xiH, XI_PRM_COMPRESSION_REGION_SELECTOR,2);
xiSetParamFloat(xiH, XI_PRM_COMPRESSION_REGION_START,50);
xiSetParamFloat(xiH, XI_PRM_COMPRESSION_REGION_GAIN,-24);

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4.5.

Host-Assisted Image Processing Parameters Available in xiAPI.

4.5.1. Auto Exposure – Auto Gain
When AEAG is used, every captured image is evaluated for its mean intensity. Based on the result, the exposure and gain values
are modified with the objective to achieve a target intensity level for the following image. Further, the maximum applicable
exposure and gain values can be defined. Since both, exposure, and gain, have an influence on the intensity, the ratio between
those two parameters in their contribution to the algorithm can also be set (exposure priority).

4.5.2. White Balance
Only for color models: The white balance can be adjusted with three coefficients kR, kG and kB, one for each color channel.
These coefficients can be set individually to increase or decrease each channel’s contribution and therefore allow the user tocontrol the color tint of the image.

4.5.2.1.

Assisted Manual White BalanceThis feature measures the white balance a single time and sets the white balance coefficient to achieve a mean grey (neutral)tint.
The measurement is performed on the central rectangle of the image, with 1/8th of its width and height. The function expects awhite sheet of paper exposed to 50% of the intensity values (8 Bit RGB values should be around 128) to be visible.

4.5.2.2.

Auto White Balance

The white balance is measured across the full image for every 4th image that is acquired, and the white balance coefficients are
set to to achieve a neutral colour tint.

4.5.3. Gamma
Only for color models: As a part of the color filtering process, it is possible to adjust the gamma level of the image. The
adjustment can be set separately for the luminosity and the chromaticity.

4.5.4. Sharpness
Only for color models: As a part of the color filtering process, it is possible to adjust the sharpness of the image.

4.5.5. Color Correction Matrix
The color correction matrix is a 4x4-matrix which is applied on each pixel of an image in a host-assisted port-processing step.
This Matrix can be used for example to adjust the brightness, contrast, and saturation.

4.5.6. Sensor Defect Correction
During the manufacturing process, every camera is tested for various type of defects and a list of the measured defect pixels iscreated and stored in the camera’s non-volatile memory. This list is then used for the correction of acquired images during
operation. The correction is inactive by default but can be turned on by the user if a non-processed output is required.

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5. Software
5.1.

Accessing the Camera

Depending on the target application, the user can choose between several ways of accessing and controlling the camera. Thesecan be divided into two categories: a programmatic approach, through programming code, or an integrated approach, through a
supported, GUI based software package. The programmatic approach is generally used for the development of a custom
application or image processing pipeline. The integrated approach is favored, if the specific toolset of a certain software
package is sufficient and the camera serves as an integrated capture device.

5.1.1. Proprietary API
All XIMEA cameras are supported by the same unified APIs (application programming interface). The API is a software interface
between the camera system driver and the application. Different APIs are available for different programming environments,
e.g., xiAPI (see 5.7.1 XIMEA APIs) for C/C++ developments, xiAPI.Net for C#/.Net based developments and xiApiPython for

Pyhton based developments.

5.1.2. Standard Interface
As an alternative to the proprietary API, the camera can be accessed through a set of standard interfaces. These interfaces
decouple a specific hardware design (e.g., physical interface) of a camera from its control in software. Therefore, multiple
camera classes and types can be used in a unified way.

5.1.2.1.

GenICam

GenICam/GenTL provides a camera-agnostic transport layer interface to acquire images or other data and to communicate
with a device. Each camera serves as a GenTL Producer which can be accessed in all software packages that are compatible
with the GeniCam standard, as well as through custom developments which implement this standard interface.

5.1.2.2.

USB3 Vision

The USB3 Vision standard not only defines hardware specifications and communication protocols, but also enables a library
vendor or application developer to set up a software stack including their own drivers and the GenICam programming interface.
This allows the usage of any USB3 Vision compliant device while relying on mechanisms for device discovery and identification,
control, and image streaming which are defined by the standard.

5.1.3. Vision Library Integration
All XIMEA cameras are compatible with the most advanced vision and image processing libraries. For GUI based software
packages, the cameras can be directly accessed without the need of programming. Code libraries are generally used inconjunction with one of our APIs, to add additional functionality (e.g., image processing, communication, data storage).

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5.2.

XIMEA CamTool

The CamTool is a cross-platform application showcasing the features of all XIMEA camera families.

Short description
It runs on Windows, Linux, macOS systems offering a substantial imaging tool set, which can be further extended with custom
modules using a plugin infrastructure. CamTool is based on Qt for the UI and xiAPI for the camera control. Its camera settings
menu resembles the parameter set of the xiAPI

figure 5-1, CamTool Layout

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Functions•

to see live image from multiple XIMEA cameras connected•

control the camera parameters•

store of camera image and video•

analyze the image properties•

histogram and line profile•

image averaging, image flip/mirror•

software trigger timer, save/load camera and program settings•

LUT (Look up table)•

Lua scripting

CamTool allows to operate all connected cameras simultaneously. In this case all controls are layered for the cameras. Basic
controls are placed as tabs in upper part of the window. Image window can be detached from application if needed. Amount ofvisible camera controls depend on visibility level which can be set in EditOptions.
For more information, please refer to: https://www.ximea.com/support/wiki/allprod/XIMEA_CamTool

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5.3.

Supported Vision Libraries

For an up-to-date listing of the supported vision libraries and software packages, visit our web site

http://www.ximea.com/support/projects/vision-libraries/wiki.

5.3.1. Libraries maintained by XIMEAAll cameras listed in the section Products are supported with these libraries.
XIMEA commits to update the API within twelve months after a new major release.
XIMEA warranties backwards compatibility of these software packages for two major releases.

5.3.1.1.

MathWorks MATLAB

MathWorks® is the leading developer and supplier of software for technical computing and Model-Based Design.
More: http://www.mathworks.de/ or https://www.ximea.com/support/wiki/vision-libraries/MathWorks_Matlab

5.3.1.2.

MVTec HALCONHALCON is the comprehensive standard software for machine vision with an integrated development environment (IDE) that isused worldwide.
More: http://www.mvtec.com/halcon/ or https://www.ximea.com/support/wiki/vision-libraries/MVTec_HALCON

5.3.1.3.

National Instruments LabVIEW Vision Library

LabVIEW is a graphical programming environment.
More: http://www.ni.com/labview/https://www.ximea.com/support/wiki/vision-libraries/National_Instruments_LabVIEW

5.3.1.4.

OpenCV

OpenCV is an open-source library of programming functions mainly aimed at real time computer vision, developed by Inteland now supported by Willow Garage.
More: https://opencv.org/

https://www.ximea.com/support/wiki/vision-libraries/OpenCV
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5.4.

XIMEA Windows Software Package

XIMEA API Software Package can be installed on: Microsoft Windows 10, Microsoft Windows 8, Microsoft Windows 7 (andMicrosoft Windows 7 Embedded), Microsoft Windows Server 2008 R2.

5.4.1. Contents
The package contains:•

OS Drivers of all XIMEA camera types for OS Microsoft Windows 7 SP1 32/64 bit, Windows 8 32/64 bit,Windows Server 2008 R2 x86-64, Windows 10 32/64 bit.

•APIs (xiAPI, xiAPI.NET, xiApiPython)•

Examples•CamTool

•

xiCOP

•

GenTL Producer - for connection of GenTL Consumer applications.

•

Vision Libraries integration demonstrations:o

NI LabView interface - xiLib

5.4.2. Installation•

Download and execute the XIMEA API Software Package installer (EXE-file, approximate size 100 MB):http://www.ximea.com/downloads/recent/XIMEA_Installer.exe•

Read the License Agreement.

•

Start the installer
Be sure that you have administrator privileges or start the Installer with administrator rights (right click and select “run asadministrator):

figure 5-2, XIMEA Windows Software Package installation - 1

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•

Select the Software components you want to install. You can uncheck the components you don't want to install, but it isrecommended to leave them all checked.

figure 5-3, XIMEA Windows Software Package installation - 2•

Specify the install location - you can leave the default location or change it to your desired location.

figure 5-4, XIMEA Windows Software Package installation - 3

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•

Now the XIMEA API Software Package should start copying files, updating System Variables and installing drivers if
necessary.

figure 5-5, xiAPI installation, Windows - 4•

Installation is completed.

figure 5-6, xiAPI installation, Windows - 5•

Finish.

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5.5.

XIMEA Linux Software Package

XIMEA Linux Software Package is tarred installer with files that can be run on Linux Ubuntu 14.04 and 16.04 (32 and 64 Bit)
and newer releases.

5.5.1. Contents
The package contains:•

Driver (beta version) for XIMEA USB2 and USB3 cameras

•

xiAPI

•

XIMEA CamTool•

Examples:oxiSample - sample showing basic image acquisition in xiAPI

5.5.2. Installation•

Download XIMEA Linux Software Package
wget http://www.ximea.com/downloads/recent/XIMEA_Linux_SP.tgz

figure 5-7, XIMEA Linux Software Package installation - 1•

Untar
tar xzf XIMEA_Linux_SP.tgz
cd package•

Start installation script./install

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figure 5-8, XIMEA Linux Software Package installation - 2
1)

Note: If logged in user is not root, you will be asked for your password to get root access, because the installation runs withroot account using sudo.

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5.6.

XIMEA macOS Software Package

XIMEA macOS Software Package is native DMG installer that can be run on macOS 10.8 (Mountain Lion) or newer.

5.6.1. Contents
The package contains:•

Driver (beta version) for XIMEA USB2 and USB3 cameras

•

xiAPI

•

XIMEA CamTool•

Examples:oxiSample - sample showing basic image acquisition in xiAPI

5.6.2. Installation
Before installing XIMEA macOS Software Package it may be necessary to modify security settings on your computer. The newfeature of OS X 10.8 called GateKeeper can prevent you from using our macOS Software Package due to the fact that thecurrent version is unsigned.
Open System Preferences application and click on Security & Privacy.

figure 5-9, XIMEA macOS Software Package installation - 1

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On the General Tab select the option Anywhere under Allow applications downloaded from:figure 5-10, xiAPI installation, MacOS - 2•

Download XIMEA macOS Software. Package: http://www.ximea.com/downloads/recent/XIMEA_OSX_SP.dmg•

Mount it by double-clicking this file in Finder.

•

Run the install script to install XiAPI on your macOS system•

A window with package contents will open.

5.6.3. Start XIMEA CamTool•

Connect camera•

Start Applications / XIMEA CamTool•

Start acquisition by clicking on orange triangle at upper left corner of CamTool

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5.7.

Programming

5.7.1. XIMEA APIs•xiAPI - Streamlined API. The standard API for C/C++ based projects, see 5.7.2 xiAPI Overview.

•

xiAPI.NET - Managed .NET Common Language Runtime (CLR) API.
xiAPI.NET is designed as a wrapper around xiAPI and therefore shares most of its functionality.

•

xiApiPython – Integrated API into PYTHON.

5.7.2. xiAPI Overview
xiAPI stands for XIMEA Application Programming Interface. It is a common interface for all XIMEA cameras.
Architecture
API is a software interface between the camera system driver and application.
•

On Windows: xiAPI is compiled into xiapi32.dll or xiapi64.dll•

On Linux: xiAPI is compiled into /usr/lib/libm3api.so

InstallationxiAPI is part of all current XIMEA software packages for Windows, Linux and MacOS.
For information on the software packages, see 5 Software

5.7.3. xiAPI Functions Description
The core of xiAPI consists of the following functions, which allow controlling of the camera functionality.
// get the number of discovered devices.
XI_RETURN xiGetNumberDevices(OUT DWORD *pNumberDevices);// open interface
XI_RETURN xiOpenDevice(IN DWORD DevId, OUT PHANDLE hDevice);// get parameter
XI_RETURN xiGetParam(IN HANDLE hDevice, const char* prm, void* val,
DWORD * size, XI_PRM_TYPE * type);// set parameter
XI_RETURN xiSetParam(IN HANDLE hDevice, const char* prm, void* val,
DWORD size, XI_PRM_TYPE type);// start the data acquisition
XI_RETURN xiStartAcquisition(IN HANDLE hDevice);// acquire image and return image information
XI_RETURN xiGetImage(IN HANDLE hDevice, IN DWORD TimeOut, INOUT XI_IMG* img);// stop the data acquisition
XI_RETURN xiStopAcquisition(IN HANDLE hDevice);// close interface
XI_RETURN xiCloseDevice(IN HANDLE hDevice);

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5.7.4. xiAPI Parameters Description
For a complete list of available parameters, please visit the xiAPI online manual at

http://www.ximea.com/support/wiki/apis/XiAPI_Manual
Note: Since xiAPI is a unified programming interface for all of XIMEA‘s cameras, not all of the described parameters apply forevery camera and sensor model.
All functions in xiAPI return status values in form of the XI_RETURN structure which is defined in xiApi.h. If a parameter is notsupported by a certain camera, the return value will represent a respective error code (e.g., 106 - Parameter not supported).

5.7.5. xiAPI Examples
5.7.5.1.

Connect Device

This example shows the enumeration of available devices. If any device was found the first device (with index 0) is opened.
HANDLE xiH = NULL;// Get number of camera devices
DWORD dwNumberOfDevices = 0;xiGetNumberDevices(&dwNumberOfDevices);if (!dwNumberOfDevices){
printf("No camera found\n");}else{// Retrieving a handle to the camera device
xiOpenDevice(0, &xiH);}

5.7.5.2.

Parameterize Device

This example shows how an exposure time is set. Next, the maximum possible downsampling rate is retrieved and the result is
set as new downsampling rate.
// Setting "exposure" parameter (10ms)
int time_us = 10000;
xiSetParam(xiH, XI_PRM_EXPOSURE, &time_us, sizeof(time_us),xiTypeInteger);// Getting maxium possible downsampling rate
int dspl_max = 1;
xiGetParamInt(xiH, XI_PRM_DOWNSAMPLING XI_PRM_INFO_MAX, &dspl_max);// Setting maxium possible downsampling rate
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5.7.5.3.

Acquire Images

This example shows how the acquisition is started on the device with the handle xiH, ten images are acquired in a row and theacquisition is stopped.
xiStartAcquisition(xiH);#define EXPECTED_IMAGES 10
for (int images=0;images < EXPECTED_IMAGES;images++){// getting image from camera
xiGetImage(xiH, 5000, &image);printf("Image %d (%dx%d) received from camera\n", images,(int)image.width, (int)image.height);}
xiStopAcquisition(xiH);

5.7.5.4.

Control Digital Input / Output (GPIO)

Hardware Trigger and Exposure Active output
In this setup each image is triggered by a Digital Input Trigger. After the image is triggered, it can be transferred using
xiGetImage.
This setup ensures a low latency between the trigger signal and image Exposure start. This time should be less than 10µs.
Digital Input
Trigger

Digital Output
Exposure Active

CameraData Only
PC withapplication
figure 5-11, GPIO - schematic

HANDLE xiH;
xiOpenDevice(0, & xiH);// select trigger source
xiSetParamInt(xiH, XI_PRM_TRG_SOURCE, XI_TRG_EDGE_RISING);// select input pin 1 mode
xiSetParamInt(xiH, XI_PRM_GPI_SELECTOR, 1);
xiSetParamInt(xiH, XI_PRM_GPI_MODE, XI_GPI_TRIGGER)// set digital output 1 mode
xiSetParamInt(xiH, XI_PRM_GPO_SELECTOR, 1);
xiSetParamInt(xiH, XI_PRM_GPO_MODE, XI_GPO_EXPOSURE_ACTIVE);
xiStartAcquisition(handle1);// Trigger signal should start image exposure within timeout#define TIMEOUT_IMAGE_WAITING_MS 10000
xiGetImage(handle, TIMEOUT_IMAGE_WAITING_MS, &image);// process image here…

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5.7.6. xiAPI Auto Bandwidth CalculationxiAPI uses Auto Bandwidth Calculation (ABC) before the opening of each camera by default. After the measurement, 90% of themeasured value is used as the maximum allowed transfer speed of the camera to ensure the stability of transfer.
It is important to set this parameter to XI_OFF to ensure highest possible data transfer speed.
To disable ABC, the application should set parameter XI_PRM_AUTO_BANDWIDTH_CALCULATION to XI_OFF before the firstxiOpenDevice is used. This setting disabled ABC and the camera stream is not limited.

5.7.7. USB3 Vision
For more information on programing according the USB3 VISION standard, please visit the standard’s website at

http://www.visiononline.org/vision-standards-details.cfm?type=11

5.7.8. GenICam
For more information on programing according the GenICam standard, please visit the standard’s website at

http://www.emva.org/standards-technology/genicam/

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5.8.

XIMEA Control Panel

The XIMEA Control Panel (xiCOP), is a diagnostics and management tool for all XIMEA cameras.
xiCOP is currently only available for Windows operating system.

figure 5-12, xiCOP
Features•

Facilitates diagnostics of system performance bottlenecks.
xiCOP can retrieve the system’s hardware tree, thus problematic hardware configurations can be identified.

•Diagnosis of firmware and software compatibility.
xiCOP checks relevant firmware and software versions and warns if a component is not up to date.

•

List all currently attached XIMEA devices and their features.

•

Suggests solution for diagnosed issues.

•

One click updates to the latest XIMEA API Software Package.

•

One click updates of firmware in selected cameras.

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6. Appendix
6.1.

Troubleshooting and Support

This chapter explains how to proceed, if you have issues in getting your xiC camera to a proper operation.
At first, please make sure, that you have installed the latest version of the following XIMEA software:•

XIMEA Windows Software Package

http://www.ximea.com/downloads/recent/XIMEA_Installer.exe

Please make sure, that you have connected your xiC camera with the XIMEA USB 3.0 cable to an appropriate USB 2.0 or USB
3.0 port. Ensure that the connections are carefully locked. Follow the instructions described in chapter 5.2 XIMEA CamTool (runthe xiC camera with the XIMEA CamTool). In case that you still have issues, please read the following chapters. If this does not
at first work, please check all your connections to the camera and then try the latest 'beta' version of API with the most recent
fixes: https://www.ximea.com/downloads/recent_beta/XIMEA_Installer.exe
In case that you still have issues, please read the following chapters.

6.1.1. Worldwide Support
We offer worldwide first level support to you by our partners.
Please refer to your local dealer if you need technical support for your xiC camera.

6.1.2. Before Contacting Technical Support
There are a few steps to take before contacting your local dealer for technical support. In case you cannot display images fromyour xiC camera, please open the XIMEA xiCOP software (please see 5.8 XIMEA Control Panel). It will immediately start
searching for connected cameras. Your camera will appear in the XIMEA camera list on the upper left side of the xiCOP window
if it is connected properly and your USB interface meets the minimum system requirements described in 4.1 System
Requirements. If the camera does not appear, please proceed with the following steps:
Step no:1
2

Description
Click on the button “Troubleshoot My System” and follow the instructions that are suggested.
If step 1 does not lead to a positive result, please click the button “Save diagnostics”. Keep the
diagnostic file ready for providing it to support.
Contact your local dealer where you bought the camera either by phone or by email for first level3
support. He will decide if he can help you immediately or if more information is necessary for initiating
the next steps.
table 6-1, use xiCOP before contacting technical support

6.1.3. Frequently Asked Questions
In this manual, we can list only a few FAQ. For more and updated information, please also note:•Frequently Asked Questions
http://www.ximea.com/support/wiki/allprod/Frequently_Asked_Questions•

Knowledge Base
http://www.ximea.com/support/wiki/allprod/Knowledge_Base

6.1.3.1.

What is USB 3.1 Gen 1 SuperSpeed?

USB 3.1 Gen 1 revision of Universal Serial Bus (USB) standard boosts transfer speed of 5Gb/s and enables delivery of up to
4.5W of power to the target device. It uses communication technology similar to that of PCI Express Gen2.

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6.1.3.2.

What is the real transfer speed?

xiC camera can deliver up to 450Mbyte/sec. This requires that certain conditions are met, see 4.1 System Requirements.
Maximum transfer speeds of different interfaces:
Interface
Transfer speed
Usable bandwidth
IEEE1394A
400 Mbit/s
45 MByte/sec
CameraLink base
2.04 Gbit/s
255 MByte/sec
GigE
1024 Mbit/s
100 MByte/sec
USB 2.0
480 Mbit/s
49 MByte/sec
USB 3.0
5 Gbit/s
450 MByte/sec
USB 3.1 (gen1)
5 Gbit/s
450 MByte/sec
table 6-2, interface depending on transfer rates

6.1.3.3.

System costs
MediumHigh
MediumLow
Low
Low

Why can I not achieve maximum transfer speed?

In order to reliably achieve maximum transfer speed it is necessary to verify that you are using recommended hardware (pleasesee 4.1 System Requirements), and that all software requirements are met.
xiCOP (please see 5.8 XIMEA Control Panel) - XIMEA Control Panel free software tool, facilitates the task of verification of XIMEA
USB3 Vision camera installations.

6.1.3.4.

What voltage should be applied to Digital Input of xiC to turn it on/off?

xiC camera features two type of inputs (-UB, -TC only). First is optoisolated input only. Second is INOUT set to input function.
Following table shows different levels of Voltage on Digital Input (VDI) on xiC and their logical interpretation.
VDI (Opto-isolated) Logical level<2Vdc
Off (zero)
2-4VdcUndefined>4Vdc
On (one)table 6-3, voltage levels for optoisolated digital input
VDI (non-isolated)
Logical level<0.7Vdc
Off (zero)
0.7-3.3Vdc
Undefined>3.3Vdc
On (one)table 6-4, voltage levels for non-isolated digital input
Maximal input voltage 24Vdc

6.1.3.5.

What is the implementation of Digital Output (VDO) of xiC?

xiC cameras features two kinds of digital output:
1. Optically isolated digital output - opto-isolated NPN open collector type, max. load current 25mA, max. open voltage 24Vdc.
For more details see also: 3.10.4 Optically isolated Digital Output
2. Non isolated high impedance input/output
For more details see also: 3.10.5 Non-isolated Digital Lines (-UB and -TC only)

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6.2.

Product service request (PSR)

If you experienced any unexpected behavior of your xiC camera, please follow the steps described below:

6.2.1. Step 1 - Contact Support
If your xiC camera is not working as expected, please contact your local dealer for troubleshooting the product and determine
the eligibility of a Product Service Request (PSR).
In case you were asked to create a PSR by your local contact, please continue to STEP 2
NOTE: Your product must be UNDER WARRANTY to qualify for a free repair or replacement.

6.2.2. Step 2 - Create Product Service Request (PSR)•

Read the XIMEA General Terms & Conditions

http://www.ximea.com/en/corporate/generaltc•

Open the XIMEA Product Service Request form http://www.ximea.com/support/projects/service/issues/new•

Fill in all fields•

Confirm with the button „Create“

6.2.3. Step 3 - Wait for PSR Approval
Our support personnel will verify the PSR for validity.
If your PSR is valid, it will be approved for sending the camera to us. This is done usually within 24 business hours. After thatyou will get a PSR Approval email (sent to the email address that you have entered in the field “Contact person – email”).
The email contains:•

shipping instructions•

attached document containing the Product Service Request Number (PSRN)

When you received the PSR Approval email - please continue to Step 4.
In case your PSR was rejected – please do not send your camera to XIMEA.

6.2.4. Step 4 - Sending the camera to XIMEA
If possible, send the camera back in the original package. If not possible, please pack the camera in a way that it cannot bedamaged during shipment and send it back as described in the PSR Approval email that you have received.

6.2.5. Step 5 - Waiting for Service Conclusion
Once we have received the camera, we will send you a notification. The XIMEA Service will then check the status of the camerathat you have sent for a possible repair. Depending on warranty conditions, product status and agreement one of the following
operations will be performed:
Operation
Repair costs paid byrepaired in warranty
XIMEA
replaced in warranty
XIMEA
repaired for cost
Customer
not repaired and returned
not repaired and discarded
if requested by customer
table 6-5, service operations overview

Return delivery costs paid by
XIMEA
XIMEA
Customer
Customer-If the camera will be returned, you will receive the tracking number. In this case, please continue to step 6

6.2.6. Step 6 - Waiting for return delivery
After you have received the return shipment, please confirm it by changing the status of the PSR to “Received by customer”.
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6.3.

Safety instructions and precautions

This chapter describes safety instructions and precautions valid for xiC cameras and special considerations regarding XIMEA
board level cameras. To avoid harm or damage your xiC camera, please handle it like described in this manual, paying special
attention to the cautions shown in the following table:

6.3.1. Disassembling
Do not disassemble the camera except for conversion to CS-Mount, see 3.3 Lens Mount.
There are no switches or parts inside the cameras that requires any kind of mechanical adjustment. Please note that the
warranty is voided by opening the camera housing.

6.3.2. Mounting / Screwing
Use only the designated threaded holes for mounting the camera. Please note the camera / bracket drawings in chapter
3.5 Model Specific Characteristics and 3.19 Tripod Adapter – MECH-MC-BRACKET-KIT.
Use only the specified screws and torques when fastening, see 3.3.1 Screws.

6.3.3. Connections
Use only recommended connectors and cables. Please check the system requirements described in 4.1 System Requirements.

6.3.4. Power supply
xiC camera can be bus powered or powered from external power supply (-UB and –TC models only). The flex line models (-FL, FV) could be powered only via the flex cable. For more information see 3.1 Power Supply

6.3.5. Environment / protect against water
Use camera in acceptable environment only, please note the descriptions in 3.2.1 Environment.
Protect the camera against contact with water. Do not let camera get wet.
Damages may be caused by:•Overheating•

Contact with water•

Operation in an environment with condensing humidity•

Mechanical shock

6.3.6. Recommended light conditions.
Do not expose the camera to light sources with intense energy, e.g., laser beams or X-ray.
Light intensity or exposure time exceeding the saturation of the sensor may damage the sensor irreparably. This may occur e.g.,in the following situations:•

High-energy laser light hitting the sensor directly•

Bright light sources hitting the sensor directly (burn-in)•

Camera is exposed to X-rays

The warranty does not cover damaged cameras caused by X-ray applications or very high intensity light / laser light.

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6.3.7. Protect the optical components
Do not touch the optical components with hard or abrasive objects.
When handling the camera, avoid touching the lenses and filter glasses. Fingerprints or other impurities may affect the image
quality and may damage the surfaces.
Mount / dismount lenses and additional filters only in a dust free environment.
Do not use compressed air as this could push dust into the camera (and lenses).

6.3.8. Mechanical loads
Avoid excessive shaking, throwing, dropping or any kind of mishandling of the device.

6.3.9. Camera / lens cleaning
Please follow instructions described below.
•

Use only optical quality tissue / cloth (dry cotton) a standard camera lens cleaning kit if you must clean a lens or filter. Do
not apply excessive force.

•

Use only optics cleaner (e.g., 60% ethyl alcohol, 40% ether). Never use aggressive cleaners like gasoline or spirits. Suchcleaners may destroy the surface.

•

Do not use compressed air.

6.3.10. Protect against static discharge (ESD)
Image sensors and the PCB are easily damaged by static discharge (ESD).
•

Please use anti-static gloves, clothes, and materials. Also use conductive shoes.

•

Wear an ESD protection wrist strap.

•

Install a conductive mat on the floor and / or working table to prevent the generation of static electricity.

6.4.

Warranty

In addition to the provisions of Article VIII of the Standard Terms & Conditions of XIMEA GmbH (see 6.7 Standard Terms &Conditions of XIMEA GmbH) the following additions and specifications apply:XIMEA warrants to the Original Purchaser that the Camera provided is guaranteed to be free from material and manufacturing
defects for a period of two years. Should a unit fail during this period, XIMEA will, at its option, repair or replace the damaged
unit. Repaired or replaced Products are covered for the remainder of the original Product warranty period.
Warranty is void if any proprietary labeling is removed. This warranty does not apply to units that, after being examined by
XIMEA, have been found to have failed due to customer abuse, mishandling, alteration, improper installation or negligence. If
the original camera module is housed within a case, removing the case for any purpose voids this warranty. This warranty does
not apply to damage to any part of the optical path resulting from removal or replacement of the protective glass or filter overthe camera, such as scratched glass or sensor damage. If the camera is disassembled, reworked or repaired by anyone otherthan a recommended service person, XIMEA or its suppliers will take no responsibility for the subsequent performance or qualityof the camera.
XIMEA expressly disclaims and excludes all other warranties, express, implied and statutory, including, but without limitation,
warranty of merchantability and fitness for a particular application or purpose. In no event shall XIMEA be liable to the Original
Purchaser or any third party for direct, indirect, incidental, consequential, special or accidental damages, including without
limitation damages for business interruption, loss of profits, revenue, data or bodily injury or death except in case of willful
misconduct by XIMEA or employees of XIMEA.

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6.5.

Disclaimer of Warranty

In addition to the provisions of Article XII of the Standard Terms & Conditions of XIMEA GmbH (see 6.7 Standard Terms &Conditions of XIMEA GmbH) the following apply:
Although XIMEA has taken care to ensure the accuracy of the information contained herein it accepts no responsibility for theconsequences of any use thereof and also reserves the right to change the specification of goods without notice.
XIMEA does not assume any liability for damage that is the result of improper use of its products or failure to comply with theoperating manuals or the applicable rules and regulations.

6.6.

List of Trademarks

XIMEA, xiC xiQ, xiMU, xiB, xiB-64, xiX, xSWITCH, xPLATFORM, xEC, xEC2, xiCool, xiRAY, xiCe, xiSpec, xiFLY, xiD, xiJ, xiLAB,
xiAPI, xiCamTool, xiCOP and CURRERA are trademarks or registered trademarks of XIMEA GmbH in Germany, Slovakia, USA andother countries.
Microsoft, Windows, Windows 10, Windows 8, Windows 7, Windows Vista, and Windows XP are either registered trademarks ortrademarks of Microsoft Corporation in the United States and/or other countries. Apple, the Apple logo, Macintosh, MacOS, OS
X, Bonjour, the Bonjour logo and the Bonjour symbol are trademarks of Apple Computer, Inc. Linux is a trademark of Linus
Torvalds. The USB3 Vision is trademark owned by the AIA.
All other brands, service provision brands and logos referred to are brands, service provision brands and logos belonging to theirrespective owners.

6.7.

Standard Terms & Conditions of XIMEA GmbH

Printed here for your information is the version from May 2021. Please check the most current version at

http://www.ximea.com/en/corporate/generaltc
General Conditions
for the Supply of Products and Services of the Electrical and Electronics Industry ("Grüne Lieferbedingungen" – GL)*for commercial transactions between businesses
recommended by ZVEI-Zentralverband Elektrotechnik- und Elektronikindustrie e. V.
as of May 2021 (with 24 months warranty period), and listed below
Article I: General Provisions
1. Legal relations between Supplier and Purchaser in connection with supplies and/or services of the Supplier (hereinafterreferred to as "Supplies") shall be solely governed by the present GL. The Purchaser's general terms and conditions shall apply
only if expressly accepted by the Supplier in writing. The scope of delivery shall be determined by the congruent mutual written
declarations.
2. The Supplier herewith reserves any industrial property rights and/or copyrights and rights of use pertaining to its costestimates, drawings and other documents (hereinafter referred to as "Documents"). The Documents shall not be madeaccessible to third parties without the Supplier's prior consent and shall, upon request, be returned without undue delay to the
Supplier if the contract is not awarded to the Supplier. Sentences 1 and 2 shall apply mutatis mutandis to the Purchaser's
Documents; these may, however, be made accessible to those third parties to whom the Supplier has rightfully subcontracted
Supplies.
3. The Purchaser has the non-exclusive right to use standard software and firmware, provided that it remains unchanged, isused within the agreed performance parameters, and on the agreed equipment. Without express agreement the Purchaser may
make one back-up copy of standard software.
4. Partial deliveries are allowed, unless they are unreasonable to accept for the Purchaser.
5. The term „claim for damages" used in the present GL also includes claims for indemnification for useless expenditure.

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Article II: Prices, Terms of Payment, and Set-Off
1. Prices are ex works and excluding packaging; value added tax shall be added at the then applicable rate.
2. If the Supplier is also responsible for assembly or erection and unless otherwise agreed, the Purchaser shall pay the agreed
remuneration and any incidental costs required, e. g. for traveling and transport as well as allowances.
3. Payments shall be made free Supplier's paying office.
4. The Purchaser may set off only those claims which are undisputed or non-appealable.
Article III: Retention of Title
1. The items pertaining to the Supplies (“Retained Goods”) for which the purchase price claim is due immediately or for which apayment period of up to and including 30 days after delivery, delivery with installation/assembly or receipt of invoice has been
agreed for the due date of the purchase price claim shall remain the property of the Supplier until payment has been made in
total.
2. In all other cases, the items pertaining to the Supplies ("Retained Goods") shall remain the Supplier's property until each andevery claim the Supplier has against the Purchaser on account of the business relationship has been fulfilled. If the combined
value of the Supplier's security interests exceeds the value of all secured claims by more than 20 %, the Supplier shall release acorresponding part of the security interest if so requested by the Purchaser; the Supplier shall be entitled to choose which
security interest it wishes to release.
3. For the duration of the retention of title, the Purchaser may not pledge the Retained Goods or use them as security, andresale shall be possible only for resellers in the ordinary course of their business and only on condition that the reseller receives
payment from its customer or makes the transfer of property to the customer dependent upon the customer fulfilling its
obligation to effect payment.
4. Should Purchaser resell Retained Goods, it assigns to the Supplier, already today, all claims it will have against its customers
out of the resale, including any collateral rights and all balance claims, as security, without any subsequent declarations to thiseffect being necessary. If the Retained Goods are sold on together with other items and no individual price has been agreed withrespect to the Retained Goods, Purchaser shall assign to the Supplier such fraction of the total price claim as is attributable tothe price of the Retained Goods invoiced by Supplier.
5. (a) Purchaser may process, amalgamate or combine Retained Goods with other items. Processing is made for Supplier.
Purchaser shall store the new item thus created for Supplier, exercising the due care of a diligent business person. The newitems are considered as Retained Goods.
(b) Already today, Supplier and Purchaser agree that if Retained Goods are combined or amalgamated with other items that are
not the property of Supplier, Supplier shall acquire co-ownership in the new item in proportion of the value of the Retained
Goods combined or amalgamated to the other items at the time of combination or amalgamation. In this respect, the new items
are considered as Retained Goods.
(c) The provisions on the assignment of claims according to No. 4 above shall also apply to the new item. The assignment,
however, shall only apply to the amount corresponding to the value invoiced by Supplier for the Retained Goods that have beenprocessed, combined or amalgamated.
(d) Where Purchaser combines Retained Goods with real estate or movable goods, it shall, without any further declaration being
necessary to this effect, also assign to Supplier as security its claim to consideration for the combination, including all collateralrights for the prorate amount of the value the combined Retained Goods have on the other combined items at the time of the
combination.
6. Until further notice, Purchaser may collect assigned claims relating to the resale. Supplier is entitled to withdraw Purchaser's
permission to collect funds for good reason, including, but not limited to delayed payment, suspension of payments, start ofinsolvency proceedings, protest or justified indications for overindebtedness or pending insolvency of Purchaser. In addition,
Supplier may, upon expiry of an adequate period of notice disclose the assignment, realize the claims assigned and demandthat Purchaser informs its customer of the assignment.
7. The Purchaser shall inform the Supplier forthwith of any seizure or other act of intervention by third parties. If a reasonableinterest can be proven, Purchaser shall, without undue delay, provide Supplier with the information and/or Documents
necessary to assert the claims it has against its customers.

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8. Where the Purchaser fails to fulfill its duties, fails to make payment due, or otherwise violates its obligations the Supplier shallbe entitled to rescind the contract and take back the Retained Goods in the case of continued failure following expiry of areasonable remedy period set by the Supplier; the statutory provisions providing that a remedy period is not needed shall be
unaffected. The Purchaser shall be obliged to return the Retained Goods. The fact that the Supplier takes back Retained Goods
and/or exercises the retention of title, or has the Retained Goods seized, shall not be construed to constitute a rescission of thecontract, unless the Supplier so expressly declares.
Article IV: Time for Supplies; Delay
1. Times set for Supplies shall only be binding if all Documents to be furnished by the Purchaser, necessary permits andapprovals, especially concerning plans, are received in time and if agreed terms of payment and other obligations of thePurchaser are fulfilled. If these conditions are not fulfilled in time, times set shall be extended reasonably; this shall not apply if
the Supplier is responsible for the delay.
2. If non-observance of the times set is due to:(a) force majeure, such as mobilization, war, terror attacks, rebellion or similar events (e. g. strike or lockout);(b) virus attacks or other attacks on the Supplier’s IT systems occurring despite protective measures were in place that compliedwith the principles of proper care;(c) hindrances attributable to German, US or otherwise applicable national, EU or international rules of foreign trade law or toother circumstances for which Supplier is not responsible; or(d) the fact that Supplier does not receive its own supplies in due time or in due form such times shall be extended accordingly.
3. If the Supplier is responsible for the delay (hereinafter referred to as "Delay") and the Purchaser has demonstrably suffered aloss therefrom, the Purchaser may claim a compensation as liquidated damages of 0.5 % for every completed week of Delay,
but in no case more than a total of 5 % of the price of that part of the Supplies which due to the Delay could not be put to theintended use.
4. Purchaser's claims for damages due to delayed Supplies as well as claims for damages in lieu of performance exceeding thelimits specified in No. 3 above are excluded in all cases of delayed Supplies, even upon expiry of a time set to the Supplier toeffect the Supplies. This shall not apply in cases of liability based on intent, gross negligence, or due to loss of life, bodily injury
or damage to health. Rescission of the contract by the Purchaser based on statute is limited to cases where the Supplier is
responsible for the delay. The above provisions do not imply a change in the burden of proof to the detriment of the Purchaser.
5. At the Supplier's request, the Purchaser shall declare within a reasonable period of time whether it, due to the delayed
Supplies, rescinds the contract or insists on the delivery of the Supplies.
6. If dispatch or delivery, due to Purchaser's request, is delayed by more than one month after notification of the readiness for
dispatch was given, the Purchaser may be charged, for every additional month commenced, storage costs of 0.5 % of the priceof the items of the Supplies, but in no case more than a total of 5 %. The parties to the contract may prove that higher or, as thecase may be, lower storage costs have been incurred.
Article V: Passing of Risk
1. Even where delivery has been agreed freight free, the risk shall pass to the Purchaser as follows:(a) if the delivery does not include assembly or erection, at the time when it is shipped or picked up by the carrier. Upon thePurchaser's request, the Supplier shall insure the delivery against the usual risks of transport at the Purchaser's expense;(b) if the delivery includes assembly or erection, at the day of taking over in the Purchaser's own works or, if so agreed, after asuccessful trial run.
2. The risk shall pass to the Purchaser if dispatch, delivery, the start or performance of assembly or erection, the taking over in
the Purchaser's own works, or the trial run is delayed for reasons for which the Purchaser is responsible or if the Purchaser hasotherwise failed to accept the Supplies.
Article VI: Assembly and Erection
Unless otherwise agreed in written form, assembly and erection shall be subject to the following provisions:
1. Purchaser shall provide at its own expense and in due time:xiC - Technical Manual Version 2.02

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(a) all earth and construction work and other ancillary work outside the Supplier's scope, including the necessary skilled andunskilled labor, construction materials and tools;(b) the equipment and materials necessary for assembly and commissioning such as scaffolds, lifting equipment and otherdevices as well as fuels and lubricants;(c) energy and water at the point of use including connections, heating and lighting;(d) suitable dry and lockable rooms of sufficient size adjacent to the site for the storage of machine parts, apparatus, materials,
tools, etc. and adequate working and recreation rooms for the erection personnel, including sanitary facilities as are appropriate
in the specific circumstances; furthermore, the Purchaser shall take all measures it would take for the protection of its own
possessions to protect the possessions of the Supplier and of the erection personnel at the site;(e) protective clothing and protective devices needed due to particular conditions prevailing on the specific site.
2. Before the erection work starts, the Purchaser shall unsolicitedly make available any information required concerning thelocation of concealed electric power, gas and water lines or of similar installations as well as the necessary structural data.
3. Prior to assembly or erection, the materials and equipment necessary for the work to start must be available on the site ofassembly or erection and any preparatory work must have advanced to such a degree that assembly or erection can be started
as agreed and carried out without interruption. Access roads and the site of assembly or erection must be level and clear.
4. If assembly, erection or commissioning is delayed due to circumstances for which the Supplier is not responsible, thePurchaser shall bear the reasonable costs incurred for idle times and any additional traveling expenditure of the Supplier or theerection personnel.
5. The Purchaser shall attest to the hours worked by the erection personnel towards the Supplier at weekly intervals and thePurchaser shall immediately confirm in written form if assembly, erection or commissioning has been completed.
6. If, after completion, the Supplier demands acceptance of the Supplies, the Purchaser shall comply therewith within a periodof two weeks. The same consequences as upon acceptance arise if and when the Purchaser lets the two-week period expire or
the Supplies are put to use after completion of agreed test phases, if any.
Article VII: Receiving Supplies
The Purchaser shall not refuse to receive Supplies due to minor defects.
Article VIII: Defects as to Quality
The Supplier shall be liable for defects as to quality ("Sachmängel", hereinafter referred to as "Defects",) as follows:
1. Defective parts or defective services shall be, at the Supplier's discretion, repaired, replaced or provided again free of charge,
provided that the reason for the Defect had already existed at the time when the risk passed.
2. Claims for repair or replacement are subject to a statute of limitations of 24 months calculated from the start of the statutory
statute of limitations; the same shall apply mutatis mutandis in the case of rescission and reduction. This shall not apply:- where longer periods are prescribed by law according to Sec. 438 para. 1 No. 2 (buildings and things used for a building), andSec. 634a para. 1 No. 2 (defects of a building) German Civil Code ("Bürgerliches Gesetzbuch"),- in the case of intent,- in the case of fraudulent concealment of the Defect or- non-compliance with guaranteed characteristic (“Beschaffenheitsgarantie”).
Claims for the reimbursement of expenses on the part of the Purchaser in accordance with Sec. 445a BGB (entrepreneur’s rightof recourse) shall likewise be subject to a statute of limitations of 24 months from the start of the statutory statute of limitations,provided the last contract in the supply chain is not a sale of consumer goods. The legal provisions regarding suspension of thestatute of limitations ("Ablaufhemmung", "Hemmung") and recommencement of limitation periods shall be unaffected.
3. Notifications of Defect by the Purchaser shall be given in written form without undue delay.
4. In the case of claims for Defects, the Purchaser may withhold payments to an amount that is in a reasonable proportion to
the Defect. The Purchaser has no right to withhold payments to the extent that its claim of a Defect is time-barred. Unjustified
notifications of Defect shall entitle the Supplier to demand reimbursement of its expenses by the Purchaser.
5. The Supplier shall be given the opportunity to repair or to replace the defective good ("Nacherfüllung") within a reasonable
period of time.
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6. If repair or replacement is unsuccessful, the Purchaser is entitled to rescind the contract or reduce the remuneration; anyclaims for damages the Purchaser may have according to No. 10 shall be unaffected.
7. There shall be no claims based on Defect in cases of insignificant deviations from the agreed quality, of only minor
impairment of usability, of natural wear and tear, or damage arising after the passing of risk from faulty or negligent handling,
excessive strain, unsuitable equipment, defective civil works, inappropriate foundation soil, or claims based on particular
external influences not assumed under the contract, or from non-reproducible software errors. Claims based on defects
attributable to improper modifications, installation/ removal, or repair work carried out by the Purchaser or third parties and theconsequences thereof are likewise excluded.
8. The Purchaser shall have no claim with respect to expenses incurred in the course of supplementary performance, to theextent that expenses are increased because the subjectmatter of the Supplies has subsequently been brought to anotherlocation than the Purchaser's branch office, unless doing so complies with the normal use of the Supplies. This applies
accordingly to claims for the reimbursement of expenses on the part of the Purchaser in accordance with Sec. 445a BGB(entrepreneur’s right of recourse), provided the last contract in the supply chain is not a sale of consumer goods.
9. The Purchaser's right of recourse against the Supplier pursuant Sec. 445a BGB (entrepreneur’s right of recourse) is limited tocases where the Purchaser has not concluded an agreement with its customers exceeding the scope of the statutory provisions
governing claims based on Defects.
10. The Purchaser shall have no claim for damages based on Defects. This shall not apply to the extent that a Defect has been
fraudulently concealed, the guaranteed characteristics are not complied with, in the case of loss of life, bodily injury or damage
to health, and/or intentionally or grossly negligent breach of contract on the part of the Supplier. The above provisions do not
imply a change in the burden of proof to the detriment of the Purchaser. Any other or additional claims of the Purchaser
exceeding the claims provided for in this Article VIII, based on a Defect, are excluded.
Article IX: Industrial Property Rights and Copyrights; Defects in Title
1. Unless otherwise agreed, the Supplier shall provide the Supplies in the country of the place of delivery only, without infringing
any third-party industrial property rights and copyrights (hereinafter referred to as “IPR”). If a third party asserts a justified claim
against the Purchaser based on an infringement of an IPR by the Supplies made by the Supplier and used in conformity with thecontract, the Supplier shall be liable to the Purchaser within the time period stipulated in Article VIII No. 2 as follows:(a) The Supplier shall choose whether to acquire, at its own expense, the right to use the IPR with respect to the Supplies
concerned or whether to modify the Supplies such that they no longer infringe the IPR or replace them. If this would be
impossible for the Supplier under reasonable conditions, the Purchaser may rescind the contract or reduce the remuneration
pursuant to the applicable statutory provisions;(b) The Supplier's liability to pay damages is governed by Article XII;(c) The above obligations of the Supplier shall apply only if the Purchaser (i) immediately notifies the Supplier of any such claim
asserted by the third party in written form, (ii) does not concede the existence of an infringement and (iii) leaves any protective
measures and settlement negotiations to the Supplier's discretion. If the Purchaser stops using the Supplies in order to reducethe damage or for other good reason, it shall be obliged to point out to the third party that no acknowledgement of the alleged
infringement may be inferred from the fact that the use has been discontinued.
2. Claims of the Purchaser shall be excluded if it is responsible for the infringement of an IPR.
3. Claims of the Purchaser are also excluded if the infringement of the IPR is caused by specifications made by the Purchaser,
by a type of use not foreseeable by the Supplier or by the Supplies being modified by the Purchaser or being used together withproducts not provided by the Supplier.
4. In addition, with respect to claims by the Purchaser pursuant to No. 1 a) above, Article VIII Nos. 4, 5, 8, and 9 shall apply
mutatis mutandis in the event of an infringement of an IPR.
5. Where other defects in title occur, Article VIII shall apply mutatis mutandis.
6. Any other claims of the Purchaser against the Supplier or its agents or any such claims exceeding the claims provided for inthis Article IX, based on a defect in title, are excluded.

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133Article X: Conditional Performance
1. The performance of this contract is conditional upon that no hindrances attributable to German, US or otherwise applicablenational, EU or international rules of foreign trade law or any embargos or other sanctions exist.
2. The Purchaser shall provide any information and Documents required for export, transport and import purposes.
Article XI: Impossibility of Performance; Adaptation of Contract
1. To the extent that delivery is impossible, the Purchaser is entitled to claim damages, unless the Supplier is not responsible forthe impossibility. The Purchaser's claim for damages is, however, limited to an amount of 10 % of the value of the part of the
Supplies which, owing to the impossibility, cannot be put to the intended use. This limitation shall not apply in the case of
liability based on intent, gross negligence or loss of life, bodily injury or damage to health; this does not imply a change in theburden of proof to the detriment of the Purchaser. The Purchaser's right to rescind the contract shall be unaffected.
2. Where events within the meaning of Article IV No. 2 (a) to (c) substantially change the economic importance or the contentsof the Supplies or considerably affect the Supplier's business, the contract shall be adapted taking into account the principles ofreasonableness and good faith. To the extent this is not justifiable for economic reasons, the Supplier shall have the right torescind the contract. The same applies if required export permits are not granted or cannot be used. If the Supplier intends toexercise its right to rescind the contract, it shall notify the Purchaser thereof without undue delay after having realized therepercussions of the event; this shall also apply even where an extension of the delivery period has previously been agreed with
the Purchaser.
Article XII: Other Claims for Damages
1. Unless otherwise provided for in the present GL, the Purchaser has no claim for damages based on whatever legal reason,
including infringement of duties arising in connection with the contract or tort.
2. This does not apply if liability is based on:(a) the German Product Liability Act (“Produkthaftungsgesetz”);(b) intent;(c) gross negligence on the part of the owners, legal representatives or executives;(d) fraud;(e) failure to comply with a guarantee granted;(f) negligent injury to life, limb or health; or(g) negligent breach of a fundamental condition of contract (“wesentliche Vertragspflichten”).
However, claims for damages arising from a breach of a fundamental condition of contract shall be limited to the foreseeabledamage which is intrinsic to the contract, provided that no other of the above case applies.
3. The above provision does not imply a change in the burden of proof to the detriment of the Purchaser.
Artikel XIII: Venue and Applicable law
1. If the Purchaser is a businessman, sole venue for all disputes arising directly or indirectly out of the contract shall be theSupplier's place of business. However, the Supplier may also bring an action at the Purchaser's place of business.
2. This contract and its interpretation shall be governed by German law, to the exclusion of the United Nations Convention oncontracts for the International Sale of Goods (CISG).
Article XIV: Severability Clause
The legal invalidity of one or more provisions of this Agreement in no way affects the validity of the remaining provisions. This
shall not apply if it would be unreasonably onerous for one of the parties to be obligated to continue the contract.

6.8.

Copyright

All texts, pictures and graphics are protected by copyright and other laws protecting intellectual property. It is not permitted tocopy or modify them for trade use or transfer, nor may they be used on websites.
xiC - Technical Manual Version 2.02134

xiC - Technical Manual Version 2.02

135

6.9.

Revision History

Version
0.00
1.00
1.10
1.11
1.12
1.13
1.14
1.15
1.16
1.17
1.18
2.00
2.01
2.02

Date
10/24/2016
04/06/2017
04/12/2017
04/13/2017
07/14/2017
08/16/2017
10/19/2017
01/17/2018
08/24/2018
06/26/2019
09/09/2019
12/20/2022
02/10/2023
01/08/2024

xiC - Technical Manual Version 2.02

Notes
Initial version
First release
Acquisition modes, updated accessories description, updated conformity description.
Corrected typos and reference links
Updated performance tables
Added chapter 3.12 Heat dissipation, added LED status after xiOpenDevice
Added connector description for –FL and –FV variants
Corrected exposure time ranges, updated optical path paragraph
Added 8-bit digitization mode description, FPC insertion guideline
Added GPI/GPO index in API
Added new generation of Flex cables, corrected flex connector pin description
Added new camera models based on 4th generation Pregius S sensor
Corrected typos and updated image quality data for 4th generation Pregius S sensor
Corrected information about AR coating of IR650 filters

136

7. Glossary
Term /Abbreviation
ADC
API
AR (coating)
B/W or B&W
CCD
CDS
CMOS
DSNU
DR
EMC
ERS
FPGA
FPN
FPS
GR
GS
IR
LSB
MSB
N/A
PCB
PRNU
PWB
RGB
ROI
SDK
SNR
SW
TBD

xiC - Technical Manual Version 2.02

Definition
Analog to Digital Converter
Application Programming Interface
Anti-Reflex
Black and White
Charge-Coupled Device
Correlated double sampling
Complementary Metal Oxide Semiconductor
Dark Signal non-Uniformity
Dynamic Range
Electro Magnetic Compatibility
Electronic rolling shutter
Field programmable gate array
Fixed pattern noise
Frame per second
Global reset
Global shutter
Infra-Red
Least Significant Bit
Most significant bit
Not Available
Printed Circuit Board (same as PWB)
Photo response non-uniformity
Printed Wiring Board (same as PCB)Red Green Blue
Region of interest
Software Development Kit
Signal To Noise (ratio)
Software
To be determined – some parameters require characterization

137

8. List of figures
figure 3-1, position C/CS-Mount module B

20

figure 3-2, xiC mounting screws

20

figure 3-3, Optical path section

21

figure 3-4, monochrome camera - filter glass transmission curve

21

figure 3-5, color camera - filter glass transmission curve

22

figure 3-6, IMX174-mono, quantum efficiency curve, ©SONY

24

figure 3-7, dimensional drawing MC023xG-SY-TC, C-Mount housing

24

figure 3-8, dimensional drawing MC023xG-SY-UB, C-Mount housing

25

figure 3-9 dimensional drawing MC023xG-SY-FL, C-Mount housing

26

figure 3-10 dimensional drawing MC023xG-SY-FV, C-Mount housing

27

figure 3-11, IMX252-mono and color, quantum efficiency curves, ©SONY

29

figure 3-12, dimensional drawing MC031xG-SY-TC, C-Mount housing

30

figure 3-13, dimensional drawing MC031xG-SY-UB, C-mount housing

30

figure 3-14, dimensional drawing MC031xG-SY-FL, C-mount housing

31

figure 3-15, dimensional drawing MC031xG-SY-FV, C-mount housing

32

figure 3-16 IMX250 mono and color, quantum efficiency curves, ©SONY

34

figure 3-17, dimensional drawing MC050xG-SY-TC, C-Mount housing

35

figure 3-18, dimensional drawing MC050xG-SY-UB, C-Mount housing

35

figure 3-19, dimensional drawing MC050xG-SY-FL, C-Mount housing

36

figure 3-20, dimensional drawing MC050xG-SY-FV, C-Mount housing

37

figure 3-21, IMX255 mono and color, quantum efficiency curve, ©SONY

39

figure 3-22, dimensional drawing MC089xG-SY-TC, C-Mount housing

40

figure 3-23, dimensional drawing MC089xG-SY-UB, C-Mount housing

40

figure 3-24, dimensional drawing MC089xG-SY-FL, C-Mount housing

41

figure 3-25, dimensional drawing MC089xG-SY-FV, C-Mount housing

42

figure 3-26, IMX253 mono and color, quantum efficiency curve, ©SONY

44

figure 3-27, dimensional drawing MC124xG-SY-TC C-Mount housing45

figure 3-28, dimensional drawing MC124xG-SY-UB, C-Mount housing45

figure 3-29, dimensional drawing MC124xG-SY-FL, C-Mount housing

46

figure 3-30, dimensional drawing MC124xG-SY-FV, C-Mount housing

47

figure 3-31, IMX542 mono and color, quantum efficiency curve, ©SONY

49

figure 3-32, dimensional drawing MC161xG-SY-TC C-Mount housing

50

figure 3-33, dimensional drawing MC161xG-SY-UB, C-Mount housing

50

figure 3-34, dimensional drawing MC161xG-SY-FL, C-Mount housing

51

figure 3-35, dimensional drawing MC161xG-SY-FV, C-Mount housing

51

figure 3-36, position status LEDs

68

figure 3-37, position of Type-C connector

69

figure 3-38 pinning of Type-C connector

69

figure 3-39, position USB 3.1 Gen1 interface

70

figure 3-40, pinning USB 3.1 / USB 3.0 connector

70

figure 3-41 Flex connector location FL version

71

figure 3-42 Flex connector location FV version

71

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figure 3-43, MC FPC cable CBL-MQ-FL-xxx laser marking

72

figure 3-44, MC FPC cable CBL-USB3FLEX-xxx ends

72

figure 3-45, MC FPC insert procedure option -FL

72

figure 3-46, MC FPC detach procedure option -FL

73

figure 3-47 MC FPC insert procedure option -FV

73

figure 3-48, MC FPC detach procedure option -FV

74

figure 3-49, position GPIO connector

75

figure 3-50, pinning GPIO connector

75

figure 3-51, digital input, interface schematic77

figure 3-52, digital input, interface wiring

77

figure 3-53, digital output, interface schematic79

figure 3-54, digital output transfer characteristics

79

figure 3-55, Connecting Digital OUTPUT to a NPN-compatible PLC device input (biased)

80

figure 3-56, Connecting Digital OUTPUT to an NPN-compatible PLC device input - more bidirectional inputs used80

figure 3-57, Connecting Digital OUTPUT to a NPN-compatible PLC device - single input

81

figure 3-58, Connecting Digital OUTPUT to a PNP-compatible device

81

figure 3-59, LED Driving

82

figure 3-60, Inductive load (Relay) Driving (inverted logic)

83

figure 3-61, Inductive load (Relay) Driving (non-inverted logic)

83

figure 3-62, non-isolated input/output, interface schematic85

figure 3-63, drawing USB3 cable87

figure 3-64, wiring USB3 cable87

figure 3-65, label details USB3 cable87

figure 3-66, drawing USB3 cable angled

88

figure 3-67, wiring USB3 cable angled

88

figure 3-68, label details USB3 cable angled

88

figure 3-69, flex cable gold color

89

figure 3-70, flex cable ends

89

figure 3-71, flex cable white color

89

figure 3-72, drawing USB3 cable90

figure 3-73, BOB-MQ-FL dimensions

90

figure 3-74, IO/AUX cable pin numbering

91

figure 3-75, mounting tripod adapter

92

figure 3-76, dimensional drawing tripod adapter

92

figure 3-77, USB3 host adapters

93

figure 4-1, Saturation vs Sensor output for different digitization bit depths

98

figure 4-2, Saturation vs Sensor output for different digitization bit depths 2nd generation IMX sensors

98

figure 4-3, acquisition mode - free run

99

figure 4-4, acquisition mode – triggered with overlap

100

figure 4-5, triggered burst of frames – frame burst start, number of frames in burst set to 3

101

figure 4-6, triggered burst of frames – frame burst active

101

figure 4-7, Exposure defined by trigger pulse length101

figure 4-8, Multiple exposures - defined exposure time, number of exposures set to 5

102

figure 4-9, Multiple exposures - exposure time defined by trigger pulse length, number of exposures set to 5

102

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figure 4-10, short interval shutter mode – triggered

103

figure 4-11, Dual ADC non-combined without merging

104

figure 4-12, Dual ADC non-combined with merging

105

figure 4-13, Dual ADC combined mode

106

figure 5-1, CamTool Layout

109

figure 5-2, XIMEA Windows Software Package installation - 1

112

figure 5-3, XIMEA Windows Software Package installation - 2

113

figure 5-4, XIMEA Windows Software Package installation - 3

113

figure 5-5, xiAPI installation, Windows - 4

114

figure 5-6, xiAPI installation, Windows - 5

114

figure 5-7, XIMEA Linux Software Package installation - 1

115

figure 5-8, XIMEA Linux Software Package installation - 2

116

figure 5-9, XIMEA macOS Software Package installation - 1

117

figure 5-10, xiAPI installation, MacOS - 2

118

figure 5-11, GPIO - schematic121

figure 5-12, xiCOP

123

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9. List of tables
table 2-1, advantages

14

table 2-2, common features

15

table 2-3, models overview

17table 2-4, accessories

18

table 3-1, environment

19

table 3-2, firmware / API features

19

table 3-3, custom screws, technical details

20

table 3-4, monochrome camera - filter glass parameter

21

table 3-5, color camera - filter glass parameter

22

table 3-6, MC023xG-SY, sensor and camera parameters

23

table 3-7, MC023xG-SY, supported standard readout modes

24

table 3-8, sensor features available

27

table 3-9, MC031xG-SY, sensor and camera parameters28

table 3-10, MC031xG-SY, supported standard readout modes

29

table 3-11, sensor features available

32

table 3-12, MC050xG-SY, sensor and camera parameters33

table 3-13, MC050xG-SY, supported standard readout modes

34

table 3-14, sensor features available

37

table 3-15, MC089xG-SY, sensor and camera parameters

38

table 3-16, MC089xG-SY, supported standard readout modes

39

table 3-17, sensor features available

42table 3-18, MC124xG-SY, sensor and camera parameters43

table 3-19, MC124xG-SY, supported standard readout modes

44

table 3-20, sensor features available

47

table 3-21, MC161xG-SY, sensor and camera parameters

48

table 3-22, MC161xG-SY, supported standard readout modes

49

table 3-23, sensor features available

52

table 3-24, MC161xG-SY-HDR, sensor and camera parameters53

table 3-25, MC161xG-SY-HDR, supported standard readout modes

54

table 3-26, sensor features available

55

table 3-27, MC203xG-SY, sensor and camera parameters

56

table 3-28, MC203xG-SY, supported standard readout modes

57

table 3-29, sensor features available

58

table 3-30, MC203xG-SY-HDR, sensor and camera parameters

59

table 3-31, MC203xG-SY-HDR, supported standard readout modes

60

table 3-32, sensor features available

61

table 3-33, MC245xG-SY, sensor and camera parameters

62

table 3-34, MC245xG-SY, supported standard readout modes

63

table 3-35, sensor features available

64

table 3-36, MC245xG-SY-HDR, sensor and camera parameters

65

table 3-37, MC245xG-SY-HDR, supported standard readout modes

66

table 3-38, sensor features available

67

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table 3-39, LED output description

68

table 3-40, LED status during boot68

table 3-41, LED output description

68

table 3-42, USB 3.1 mating connector description

69

table 3-43 USB type C connector pin assignment

69

table 3-44, USB 3.1 micro-B mating connector description

70

table 3-45, USB 3.0 connector, pin assignment

70

table 3-46 Connector part numbers

71

table 3-47 Pin list for flex cable

71

table 3-48, GPIO mating connector description

75

table 3-49, I/O connector Pin Assignment

75

table 3-50, Optically isolated digital input, general info

76

table 3-51, digital info, signal levels

76

table 3-52, digital input, timing

77

table 3-53, Optically isolated digital output, general info

78

table 3-54, Optically isolated digital output, delay

78

table 3-55, Connecting Digital OUTPUT to an NPN-compatible PLC device input (biased)

79

table 3-56, Connecting Digital OUTPUT to an NPN-compatible PLC device input

80

table 3-57, Connecting Digital OUTPUT to an PNP-compatible device

81table 3-58, digital output, LED driving

82

table 3-59, digital output, wiring examples

84

table 3-60, digital output, typical timing

84

table 3-61, digital output, current depending on timing

84

table 3-62, General info for non-isolated digital in/out trigger lines.

85

table 3-63, External power supply input (AUX) Note 1) Is model depended. Used values are for MC124MG-SY-TC

85

table 3-64, USB3 cable, components

87table 3-65, USB3 connector, pin assignment

87

table 3-66, USB3 cable angled, components

88table 3-67, USB3 connector, pin assignment

88

table 3-68, IO connector (WAGO 218-104), pin assignment

90

table 3-69, IO/AUX cable, pin assignment

91

table 3-70, alternative cables

91

table 4-1, image formats,

97

table 6-1, use xiCOP before contacting technical support

124

table 6-2, interface depending on transfer rates

125

table 6-3, voltage levels for optoisolated digital input

125

table 6-4, voltage levels for non-isolated digital input

125

table 6-5, service operations overview

126

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XIMEA GmbHAm Mittelhafen 16 • 48155 Münster • Germany • www.ximea.com© Copyright, XIMEA GmbH, All rights reserved