日本金属学会九州支部・日本鉄鋼協会九州支部

第 3 2 6 回材 料科学 談話会
九州大学超顕微解析研究センター、微細構造解析プラットフォーム「ナノマテリアル開発のための超顕微解析共用拠点」、九州大学超顕微科学リサーチコア 共催

第 21 0 回Ｈ ＶＥＭ 研究会のお知らせ
平成２８年１１月２８日

英国 Imperial College London の Christopher Gourlay 博士、ならびにマレーシア Universiti
Malaysia Perlis の Mohd Arif Anuar Mohd Salleh 博士をお招きし、下記のように講演会を開催致します。皆様奮ってご参加ください。

【日時】平成２８年１２月９日（金）【会場】九州大学 伊都キャンパス 超顕微解析研究センター（CE21）セミナー室（〒810-0395 福岡県福岡市西区元岡７４４番地）【講演１】

１４時００分 ～ １６時３０分

Dr. Christopher Gourlay,
Department of Materials, Imperial College London『Intermetallic Crystal Growth Mechanisms: Application to Cu6Sn5 in
Solder Joints』【講演２】

Dr. Mohd Arif Anuar Mohd Salleh,
The Center of Excellence Geopolymer and Green Technology,
Universiti Malaysia Perlis (UniMAP)『Microstructure Formation in Reinforced Sn-Cu Lead-free
Solder Alloys』*********************************************************************
交通手段の詳細や当研究会についてのお問い合わせは、下記の連絡先にお願いいたします。
各講演の概要と会場へのアクセスを次ページ以降に示します。
材料科学談話会世話人：波多 聰
ＨＶＥＭ研究会世話人：安田和弘・佐藤幸生・波多 聰連絡先 ：安田和弘（九州大学 工学研究院 エネルギー量子工学部門）
Tel & Fax: 092-802-3487 E-mail: yasudak@nucl.kyushu-u.ac.jp

Abstract【講演１】

Intermetallic Crystal Growth Mechanisms: Application to Cu6Sn5 in Solder Joints
Most alloys produced by solidification processing contain intermetallic compounds(IMCs), which can range from impurity phases to strengthening phases or reaction
phases in the joining of dissimilar metals. If these IMCs are large, they are usually
detrimental to mechanical properties and, therefore, it is important to be able to control
their nucleation and growth to control their size. This talk will overview thesolidification of Cu6Sn5, an important IMC in electronic interconnections, with a focus
on nucleation and growth mechanisms.
The solidification of primary Cu6Sn5 is studied in Sn-Cu alloys and solder joints bycombining EBSD, FIB-tomography and synchrotron radiography. It is shown that thecomposition and process parameters can lead to a rich variety of growth forms
including faceted hexagonal rods growing along [0001] bounded by {1010} facets,
in-plane branched faceted crystals and nonfaceted dendrites which branch along <405>
in the {1010} planes. This range of growth morphologies is then rationalised into akinetic microstructure map and the faceted to nonfaceted growth transition is discussed
in terms of changing atomic attachment mechanisms. Finally, it is shown that the fullrange of Cu6Sn5 morphologies that grew for different composition and cooling rate
combinations in bulk alloys can be engineered to grow in solder joints made with asingle composition (Sn-0.7wt%Cu/Cu) by altering the peak temperature and the cooling
rate.

【講演２】

Microstructure Formation in Reinforced Sn-Cu Lead-free Solder AlloysElectronics manufacturers are pushing the limits in reducing the physical size ofcircuitry while simultaneously increasing the number of transistors to satisfy Moore’sLaw. This includes investing in new materials in electronic packages with a focus onhigh reliability. A viable method to enhance the properties and performance of solder
joints is the incorporation of reinforcement particles to the solder matrix, either byintrinsic or extrinsic methods. In this study, a series of Sn-Cu Pb-free solder alloys weremanufactured with a variety of reinforcing phases and the microstructure and soldering
behavior were investigated in detail using advance characterisation techniques such as
in-situ synchrotron X-ray radiography imaging. Shear strength of the reinforced solder
joints was also evaluated. The collective results of this study demonstrate a detailed
understanding of the manufacture of reinforced Sn-Cu Pb-free solder alloys and themechanisms of microstructure development.

九州大学へのアクセスマップ。会場は伊都キャンパスにあります。

伊都キャンパスマップ。会場の建物は㊵(CE20)です。