Bosch Sensortec | BME680 Datasheet

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BME680
Low power gas, pressure, temperature & humidity
sensor

BME680 – Datasheet
Document revision

1.0

Document release dateJuly 2017

Document number

BST-BME680-DS001-00

Technical reference code(s)1 277 340 511

Notes

Data and descriptions in this document are subject to change without
notice. Product photos and pictures are for illustration purposes only andmay differ from the real product appearance.

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BME680
Low power gas, pressure, temperature & humidity sensor
The BME680 is a digital 4-in-1 sensor with gas, humidity, pressure and temperature measurement based on
proven sensing principles. The sensor module is housed in an extremely compact metal-lid LGA package with afootprint of only 3.0 × 3.0 mm² with a maximum height of 1.00 mm (0.93 ± 0.07 mm). Its small dimensions and its
low power consumption enable the integration in battery-powered or frequency-coupled devices, such as
handsets or wearables.

Typical applications
 Indoor air quality
 Home automation and control
 Internet of things Weather forecast GPS enhancement (e.g. time-to-first-fix improvement, dead reckoning, slope detection)
 Indoor navigation (change of floor detection, elevator detection)
 Outdoor navigation, leisure and sports applications
 Vertical velocity indication (rise/sink speed)

Target Devices
 Handsets such as mobile phones, tablet PCs, GPS devices
 Wearables Home weather stations
 Smart watches Navigation systems
 Gaming, e.g. flying toys IOT devices

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Key features
 Package
 Digital interface
 Supply voltage






3.0 mm x 3.0 mm x 0.93 mm metal lid LGA
I²C (up to 3.4 MHz) and SPI (3 and 4 wire, up to 10 MHz)VDD main supply voltage range: 1.71 V to 3.6 V
VDDIO interface voltage range: 1.2 V to 3.6 V
Current consumption
2.1 µA at 1 Hz humidity and temperature
3.1 µA at 1 Hz pressure and temperature
3.7 µA at 1 Hz humidity, pressure and temperature
0.09‒12 mA for p/h/T/gas depending on operation mode
0.15 µA in sleep mode
Operating range-40‒+85 °C, 0‒100% r.H., 300‒1100 hPa
Individual humidity, pressure and gas sensors can be independently enabled/disabled
The product is RoHS compliant, halogen-free, MSL1

Key parameters for gas sensor
 Response time (𝜏33−63% ) Power consumption
 Output data processing< 1 s (for new sensors)< 0.1 mA in ultra-low power mode
direct indoor air quality (IAQ) index output

Key parameters for humidity sensor
 Response time (𝜏0−63% ) Accuracy tolerance Hysteresis~8 s±3% r.H.
±1.5% r.H.

Key parameters for pressure sensor
 RMS Noise Offset temperature coefficient

0.12 Pa, equiv. to 1.7 cm±1.3 Pa/K, equiv. to ±10.9 cm at 1 °C temperature change

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Table of contents
1. Specification

7

1.1 General Electrical Specification ............................................................................................................................ 7
1.2 Gas sensor specification ....................................................................................................................................... 8
1.3 Humidity sensor specification .............................................................................................................................. 10
1.4 Pressure sensor specification ............................................................................................................................. 11
1.5 Temperature sensor specification ....................................................................................................................... 12

2. Absolute maximum ratings

13

3. Sensor usage

14

3.1 Sensor modes ..................................................................................................................................................... 14
3.2 Sensor configuration ........................................................................................................................................... 15
3.2.1 Quick start ........................................................................................................................................................ 15
3.2.2 Sensor configuration flow ................................................................................................................................. 16
3.3 Measurement flow ............................................................................................................................................... 17
3.3.1 Temperature measurement .............................................................................................................................. 17
3.3.2 Pressure measurement .................................................................................................................................... 17
3.3.3 Humidity measurement .................................................................................................................................... 17
3.3.4 IIR filter ............................................................................................................................................................. 18
3.3.5 Gas sensor heating and measurement ............................................................................................................ 18
3.4 Data readout........................................................................................................................................................ 19
3.4.1 Gas resistance readout .................................................................................................................................... 19
3.5 Output compensation .......................................................................................................................................... 19

4. Software and use cases

21

4.1 BSEC software .................................................................................................................................................... 21
4.2 Indoor-air-quality ................................................................................................................................................. 23
5. Global memory map and register description

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5 | 505.1 General remarks ................................................................................................................................................. 24
5.2 Memory map ....................................................................................................................................................... 25
5.3 Register description ............................................................................................................................................ 26
5.3.1 General control registers .................................................................................................................................. 26
5.3.2 TEMPERATURE, PRESSURE AND RELATIVE HUMIDITY CONTROL REGISTERS
5.3.4 DATA REGISTERS
5.3.5 STATUS REGISTERS
6. Digital interfaces

27
32
33
35

6.1 Interface selection ............................................................................................................................................... 35
6.2 I²C Interface......................................................................................................................................................... 35
6.2.1 I²C WRITE
6.2.2 I²C READ

36
36

6.3 SPI interface ........................................................................................................................................................ 37
6.3.1 SPI WRITE
6.3.2 SPI READ

37
38

6.4 Interface parameter specification ........................................................................................................................ 38
6.4.1 General interface parameters .......................................................................................................................... 38
6.4.2 I²C timings ........................................................................................................................................................ 39
6.4.3 SPI TIMINGS
7. Pin-out and connection diagram

40
41

7.1 Pin-out ................................................................................................................................................................. 41
7.2 Connection diagrams .......................................................................................................................................... 42
7.3 Package dimensions ........................................................................................................................................... 43
7.4 Landing pattern recommendation ....................................................................................................................... 44
7.5 Marking ................................................................................................................................................................ 45
7.5.1 Mass production devices.................................................................................................................................. 45
7.5.2 Engineering samples ........................................................................................................................................ 45
7.6 Soldering guidelines and reconditioning recommendations ............................................................................... 46
7.7 Mounting and assembly recommendations ........................................................................................................ 46
7.8 Environmental safety ........................................................................................................................................... 47
7.8.1 RoHS ................................................................................................................................................................ 47
7.8.2 Halogen content ............................................................................................................................................... 47

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6 | 507.8.3 Internal package structure ................................................................................................................................ 47

8. Legal disclaimer ............................................................................................................................................48
8.1 Engineering samples ........................................................................................................................................... 48
8.2 Product use ......................................................................................................................................................... 48
8.3 Application examples and hints ........................................................................................................................... 48

9. Document history and modifications ..................................................................................................49

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7 | 501. Specification
If not stated otherwise,







all values are valid over the full voltage range,
all minimum/maximum values are given for the full accuracy temperature range
minimum/maximum values of drifts, offsets and temperature coefficients are ±3 values over lifetime,
typical values of currents and state machine timings are determined at 25 °C,
minimum/maximum values of currents are determined using corner lots over complete temperature range, andminimum/maximum values of state-machine timings are determined using corner lots over 0‒+65 °C temperature
range.

Besides the general electrical specifications, the following tables are separated for the gas, pressure, humidity andtemperature functions of the BME680.

1.1 General Electrical Specification
Table 1: Electrical parameter specification
OPERATING CONDITIONS BME680

1

Parameter

SymbolCondition

Min

Typ

Max

Unit

Supply Voltage
Internal Domains1

VDD

ripple max. 50 mVpp

1.71

1.8

3.6

V

Supply Voltage
I/O Domain

VDDIO

1.2

1.6

3.6

V

Sleep current

IDDSL

0.15

1

µA

Standby current(inactive period of
normal mode)

IDDSB

0.29

0.8

µA

Current duringhumidity
measurement

IDDH

Max value at 85 °C

340

450

µA

Current during
pressuremeasurement

IDDP

Max value at -40 °C

714

849

µA

Current during
temperature
measurement

IDDT

Max value at 85 °C

350

Start-up time

tstartupTime to first communication
after both VDD > 1.58 V andVDDIO > 0.65 V

2ms

Power supply
rejection ratio (DC)

PSRR

full VDD range

±0.01
±5

%r.H./V
Pa/V

Standby time
accuracy

Δtstandby

±25

%

±5

µA

The power efficiency, performance and heat dissipation scales with the applied supply voltage. The BME680 is optimized for 1.8 V.

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8 | 501.2 Gas sensor specification
Table 2 lists the gas sensor specification. All the parameters are deduced from lab measurements under controlledenvironmental conditions, which are compliant to the ISO16000-29 standard “Test methods for VOC detectors”. Detailed
procedure to measure the gas sensor is available in the Application Note: Measurement Instructions for Lab Environment.
Referring to Chapter 4, a software solution (BSEC: Bosch Software Environmental Cluster) is available for the BME680. The
software is carefully engineered to seamlessly work with the 4-in-1 integrated sensors inside the BME680. Based on an
intelligent algorithm, the BSEC provides an indoor air quality (IAQ) output. In principle, this output is in an index that can havevalues between 0 and 500 with a resolution of 1 to indicate or quantify the quality of the air available in the surrounding. Table
4 lists the IAQ system specification. The detailed classification and color coding of the IAQ index is described in Table 4.
Furthermore, the BSEC solution supports different operation modes for the gas sensor to address the necessary powerbudget and update rate requirements of the end-application.
Unless mentioned otherwise, the specifications are deduced from new sensors that have been operated for at least five days
mainly in ambient air and consequently have the same history (i.e. same power mode and exposed to the same environment).
Besides ethanol (EtOH) as a target test gas, the sensors are also tested with breath-VOC (b-VOC). The b-VOC mixture, as
listed in Table 5, represents the most important compounds in an exhaled breath of healthy humans. The values are derived
from several publications on breath analysis studies. The composition does not contain species which would chemically react
to ensure that the mixture is stable for at least 6 months. Furthermore, the composition is also limited to species which canbe manufactured in one mixture.

Table 2: Gas sensor parameter specification
Parameter

SymbolCondition

Operational range1

Supply Current during
heater operation
Peak Supply Current
Average Supply
Current(VDD ≤ 1.8 V, 25°C)

Response time2(brand-new sensors)

Typ

Max

Unit

-40

85

°C

10

95

% r.H.

IDD

Heater target temperature
320 °C, constant operation(VDD ≤ 1.8 V, 25°C)

9

12

13

mA

IPeak

Occurs within first ms ofswitching on the hotplate

15

17

18

mA

Ultra-low power mode

0.09

mA

Low power mode

0.9

mA

Continuous mode

12mA

τ33-63%Ultra-low power mode92s

τ33-63%Low power mode

1.4

s

τ33-63%

Continuous mode

0.75

s

IDD,IAQ

Resolution of gas
sensor resistancemeasurement
Noise in gas sensor
resistance (RMS)

Min

0.05

NR

0.08

1.5

0.11

%

%

1

The sensors are electrically operable within this range. Actual performance may vary
Response time of unsoldered, brand-new sensors extracted from the sensors’ resistance change in response to a 0.6–60 ppm step of EtOH and a 0.5–15 ppm step of b-VOC at 20 °C, 50%
r.H. and atmospheric pressure.
2

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Table 3: IAQ system parameter specification3
Parameter

SymbolCondition

Min

Typ

Accuracy status4

AXIAQ

Android compatible0

IAQ Resolution

IAQrs

IAQ Range

IAQrg

Sensor-to-sensor
deviation5

IAQS2S

All operation modes

±15%
±15

IAQS2S

Sensor-to-sensor deviation

±15%
±15

IAQdrift

Drift at low & highconcentrations

±1%
±4

Max

Unit

3
1

0

Durability tosiloxanes6,7,8

500

Table 4: Indoor air quality (IAQ) classification and color-coding9
IAQ Index

Air Quality

0 – 50

good1051 – 100

average

101 – 150

little bad

151 – 200bad

201 – 300

worse2

301 – 500

very bad

Table 5: bVOC mixture with Nitrogen as carrier gas
Molar fraction

Compound

Production tolerance

Certified accuracy

5 ppm

Ethane20 %5%

10 ppmIsoprene /2-methyl-1,3 Butadiene

20 %

5%

10 ppmEthanol

20 %5%

50 ppmAcetone20 %5%

15 ppmCarbon Monoxide

10 %

2%

3

IAQ parameters only apply for the combination of BME680 together with the Bosch Software Environmental Cluster (BSEC) solution (available separately, see Chapter 4)
The accuracy status is equal to zero during the power-on stabilization times of the sensor and is equal to 3 when the sensor achieves best performance
5
Tested with 0.6–90 ppm of EtOH at 5–40 °C, 20–80% r.H. and atmospheric pressure. Condition is valid after the calibration period of the BSEC algorithm.
6
Siloxanes are present in a typical indoor environment and can in principle perturb the metal-oxide-based gas sensor performance.
7
220 hours of 700 mg/m3 of octamethylcyclotetrasiloxane (D4) in ambient conditions (i.e. 20 °C and 50% r.H.) simulates the amount of siloxanes in a typical indoor environment over morethan 10 years.
8
Tested with 0.5–15 ppm of b-VOC at 20 °C and 50% r.H. using continuous operation mode for 220 hours of 700 mg/m 3 of octamethylcyclotetrasiloxane (D4).
9
According to the guidelines issued by the German Federal Environmental Agency, exceeding 25 mg/m3 of total VOC leads to headaches and further neurotoxic impact on health.
10
The BSEC software auto-calibrates the low and high concentrations applied during testing to IAQ of 25 and 250, respectively.
4

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1.3 Humidity sensor specification
Table 6: Humidity parameter specification
Parameter

SymbolCondition

Operating Range11

Full accuracy range
1 Hz forced mode,temperature and humidity
measurement

Min

Typ

Max

Unit

-40

25

85

°C

0

100

% r.H.

0

65

°C

10

90

% r.H.

2.8

µA

2.1

Supply Current

IDD,HAbsolute Accuracy

AH

20‒80 % r.H., 25 °C,
including hysteresis±3% r.H.

Hysteresis12

HH

10→90→10 % r.H., 25°C

±1.5

% r.H.

Nonlinearity13

NLH

10→90 % r.H., 25°C

1.7

% r.H.

Response time tocomplete 63% of step14

τ0-63%N2 (dry) → 90 % r.H., 25°C

8sResolution

RH

0.008

% r.H.

Noise in humidity
(RMS)

NH

Highest oversampling

0.01% r.H.

Long-term stability∆Hstab10‒90 % r.H., 25°C

0.5

% r.H./
year

11

When exceeding the operating range (e.g. for soldering), humidity sensing performance is temporarily degraded and reconditioning is recommended as described in Section 7.7. Operating
range only for non-condensing environment.
12
For hysteresis measurement the sequence 0103050709070503010 % r.H. is used. The hysteresis is defined as the maximum difference between measurements at of
the same humidity up / down branch and the averaged curve of both branches.
13
Non-linear contributions to the sensor data are corrected during the calculation of the relative humidity by the compensation formulas described in Section 3.5.
14
The air-flow in direction to the vent-hole of the device has to be dimensioned in a way that a sufficient air exchange inside to outside will be possible. To observe effects on the response
time-scale of the device an air-flow velocity of approximately 1 m/s is needed.

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1.4 Pressure sensor specification
Table 7: Pressure parameter specification
Parameter

SymbolCondition

Min

Typ

Max

Operating temperature
range

TA

Operating pressure
range

operational

-40

25

85

full accuracy

0

65

P

full accuracy

300

1100

hPa

Supply current

IDD,LP

1 Hz forced mode,pressure andtemperature, lowest
power

4.2

µA

Temperature coefficientof offset15

TCOP

25‒40 °C, 900 hPa

Ap, full

300‒1100 hPa
0‒65°C

Absolute accuracypressure

3.1

Unit
°C

±1.3

Pa/K

±10.9

cm/K

±0.6

hPa

±0.12

hPa

700‒900hPa,
Arel
Relative accuracypressure

Resolution ofpressure output data

Noise in pressure

900‒1100hPa
Arel

25‒40 °C, at constanthumidity

±0.12

hPa

RP

Highest oversampling

0.18

Pa

Full bandwidth, highest
oversampling

1.4

Pa

11

cm

Reduced bandwidth, highest
oversampling

0.2

Pa

1.7

cm

NP,fullBW

Solder drift151625‒40 °C, at constanthumidity

Minimum solder height 50µm

Long-term stability16

Pstab

per year

Possible sampling rate

fsample_P

Lowest oversampling,see chapter 3.3.2

-0.5

157

1.2

+2.0

hPa

±1.0

hPa

182

Hz

When changing temperature from 25 °C to 40 °C at constant pressure / altitude, the measured pressure / altitude will change by (15×TCOP).
Long-term stability is specified in the full accuracy operating pressure range 0‒65 °C

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1.5 Temperature sensor specification
Table 8: Temperature parameter specification
Parameter

SymbolCondition

Min

Typ

Max

Unit

Operating temperature
range

TA

operational

-40

25

85

°C

IDD,T

1 Hz forced mode,temperature measurement
only

1.0

µA

AT,25

25 °C

±0.5

°C

AT,full0‒65 °C±1.0°COutput resolution

RT

API output resolution

0.01

°C

RMS noiseNT

Lowest oversampling

0.005

°C

Supply current

Absolute accuracy
temperature17

17

Temperature measured by the internal temperature sensor. This temperature value depends on the PCB temperature, sensor element self-heating and ambient temperature and is typicallyabove ambient temperature.

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2. Absolute maximum ratings
The absolute maximum ratings are determined over the complete temperature range using corner lots. The values areprovided in Table 9.

Table 9: Absolute maximum ratings
Parameter

Condition

Min

Max

Unit

Voltage at any supply pin

VDD and VDDIO pin

-0.3

4.25

V

-0.3

VDDIO + 0.3

V

-45

+85

°C

0

20 000hPa

HBM, at any pin±2kV

Machine model

±200

V

Voltage at any interface pin
Storage temperature≤ 65% r.H.

Pressure

ESD

Condensation

No power supplied

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3. Sensor usage
3.1 Sensor modes
The sensor supports low-level power modes: sleep and forced mode. These modes can be selected using the mode<1:0>
control register (see Section 5.3.1.3). The key differences between the modes are summarized in Table 10.
After a power-up sequence, the sensor automatically starts in sleep mode. If the device is currently performing ameasurement, execution of mode switching commands is delayed until the end of the currently running measurement period.
It is important to note that, further mode change commands or other write commands to the control registers are ignored until
the mode change command has been executed. All control registers should be set to the desired values before writing to themode register.

Table 10: Low-level operation modes
Operation mode

mode<1:0>

Key features

Sleep

00




No measurements are performed
Minimal power consumption

Forced mode

01





Single TPHG cycle is performed
Sensor automatically returns to sleep mode afterwards
Gas sensor heater only operates during gas measurement

In forced mode, temperature, pressure, humidity and gas conversion are performed sequentially. Such a measurement cycle
is abbreviated as TPHG (Temperature, Pressure, Humidity and Gas) in the following descriptions. Up to 10 temperature setpoints and heating durations for the gas sensor hot plate can be stored in the sensor registers. In the following, these setpoints and the corresponding measurements are identified as G 0 – G9.Figure 1 illustrates the handling of these measurement
sequences and the gas sensor hot plate is heated for the forced mode.

Figure 1: Sequence of ADC and gas sensor heater operation

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3.2 Sensor configuration
3.2.1 Quick start
The sensor is configured by writing to a set of control registers (see Chapter 5 for a detailed list of all available registers andtheir descriptions). This section illustrates, with the help of a basic step-by-step example, how to configure the sensor for
simple forced mode measurements with a single heater set-point. For a more detailed description of the measurement flow,
please refer to Section 3.3.
In this example, the sensor will be configured to use 2x oversampling for its temperature measurements, 16x oversampling
for the pressure signal, and 1x oversampling for humidity. Moreover, the gas sensor hot plate will be configured to be heatedfor 100 ms at 300 °C before the gas measurement is performed.
First, the user must configure the oversampling settings for temperature, pressure and humidity by setting the control
registers osrs_t<2:0> and osrs_h<2:0>, respectively. Supported settings range from 16x oversampling down to 0x, which isequivalent to skipping the corresponding sub-measurement. See Section 5.3.2 for further details.
1. Set humidity oversampling to 1x by writing 0b001 to osrs_h<2:0>
2. Set temperature oversampling to 2x by writing 0b010 to osrs_t<2:0>
3. Set pressure oversampling to 16x by writing 0b101 to osrs_p<2:0>
It is highly recommended to set first osrs_h<2:0> followed by osrs_t<2:0> and osrs_p<2:0> in one write command (seeSection 3.3).
Next, the user shall set at least one gas sensor hot plate temperature set-point and heating duration. Up to 10 heating
duration can be configured through the control registers gas_wait_x<7:0>, where x ranges from 0 to 9. See Section 5.3.3 fordefinition of register content. The corresponding heater set-points are stored in the registers res_heat_x<7:0>. Section 3.3.5
explains how to convert the target heater temperature, e.g. 300 °C, into a register code. For forced mode operation, the usedheater set point is selected by setting the control register nb_conv<3:0> to the heater profile to be used, e.g. to use
gas_wait_0<7:0> and res_heat_0<7:0>, nb_conv<3:0> shall be set to 0x0. Finally, gas functionality shall be enabled by
setting the run_gas_l bit to 1.
4.
5.
6.
7.

Set gas_wait_0<7:0> to 0x59 to select 100 ms heat up duration
Set the corresponding heater set-point by writing the target heater resistance to res_heat_0<7:0>
Set nb_conv<3:0> to 0x0 to select the previously defined heater settings
Set run_gas_l to 1 to enable gas measurements

Now, a single forced mode measurement with the above settings can be triggered by writing 0b01 to mode<1:0>. For moredetails on data readout, please see Section 5.3.1.3.
8. Set mode<1:0> to 0b01 to trigger a single measurement.

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3.2.2 Sensor configuration flow
Picture 2 illustrates which control registers must be set. For details on the individual control registers, please refer to
Chapter 5. Moreover, details on the measurement flow for the individual modes can be found in Section 3.3.

Forced Mode

Select oversampling for T, P and H• Set osrs_x<2:0>

Select IIR filter for temperature sensor• Set filter<2:0>

Enable gas coversion• Set run_gas to 1

Select index of heater set-point• Set nb_conv <3:0> (indexing is zero-based)

Define heater-on time
• Convert duration to register code
• Set gas_wait_x<7:0> (time base unit is ms)

Set heater temperature• Convert temperature to register code
• Set res_heat_x<7:0>

Set mode to forced mode
• Set mode<1:0> to 0b01

Picture 2: Sensor configuration flow

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3.3 Measurement flow
Referring to Figure 1, the BME680 measurement period consists of a temperature, pressure and humidity measurementwith selectable oversampling. Moreover, it contains a heating phase for the gas sensor hot plate as well as a measurementof the gas sensor resistance.
After the measurement period, the pressure and temperature data can be passed through an optional IIR filter, which removes
short-term fluctuations. For humidity and gas, such a filter is not needed and has not been implemented.

3.3.1 Temperature measurement
Temperature measurement can be enabled or skipped. Skipping the measurement is typically not recommended sincetemperature information is used to compensate temperature influences in the other parameters. When enabled, several
oversampling options exist. The temperature measurement is controlled by the osrs_t<2:0> setting which is detailed in
Section 5.3.2.2. For the temperature measurement, oversampling is possible to reduce the noise. The resolution of thetemperature data depends on the IIR filter (see Section 5.3.2.4) and the oversampling setting:When the IIR filter is enabled, the temperature resolution is 20 bitWhen the IIR filter is disabled, the temperature resolution is 16 + (osrs_t – 1) bit, e.g. 18 bit when osrs_t is set to ‘3’

3.3.2 Pressure measurement
Pressure measurement can be enabled or skipped. When enabled, several oversampling options exist. The pressure
measurement is controlled by the osrs_p<2:0> setting which is detailed in Section 5.3.2. For the pressure measurement,
oversampling is possible to reduce noise. The resolution of the pressure data depends on the IIR filter (see Section 5.3.2.4)
and the oversampling setting:When the IIR filter is enabled, the pressure resolution is 20 bitWhen the IIR filter is disabled, the pressure resolution is 16 + (osrs_p – 1) bit, e.g. 18 bit when osrs_p is set to ‘3’

3.3.3 Humidity measurement
The humidity measurement can be enabled or skipped. When enabled, several oversampling options exist. The humidity
measurement is controlled by the osrs_h<2:0> setting, which is described in detail in Section 5.3.2.1. For the humidity
measurement, oversampling is possible to reduce noise. The resolution of the humidity measurement is fixed at 16 bit ADC
output.

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3.3.4 IIR filter
The environmental pressure is subject to many short-term changes, caused external disturbances. To suppress disturbances(e.g. slamming of door or wind blowing into the sensor) in the output data without causing additional interface traffic andprocessor work load, the BME680 features an internal IIR filter (see Section 5.3.2.4). It effectively reduces the bandwidth of
the temperature and pressure output signals and increases the resolution of the output data to 20 bit, noting that the humidity
and gas values inside the sensor does not fluctuate rapidly and does not require low pass filtering. The output of a next
measurement step is filtered using the following formula:
𝑥𝑓𝑖𝑙𝑡 [𝑛] =𝑥𝑓𝑖𝑙𝑡 [𝑛 − 1] ∙ (𝑐 − 1) + 𝑥𝐴𝐷𝐶𝑐

𝑥𝑓𝑖𝑙𝑡 [𝑛 − 1] is the data coming from the current filter memory, and 𝑥𝐴𝐷𝐶 is the data coming from current ADC acquisition.
𝑥𝑓𝑖𝑙𝑡 [𝑛] denotes the new value of filter memory and the value that will be sent to the output registers.
The IIR filter can be configured to different filter coefficients, which slows down the response to the sensor inputs. Note thatthe response time with enabled IIR filter depends on the number of samples generated, which means that the data output
rate must be known to calculate the actual response time.
When writing to the register filter, the filter is reset. The next ADC values will pass through the filter unchanged and become
the initial memory values for the filter. If temperature or pressure measurements are skipped, the corresponding filter memory
will be kept unchanged even though the output registers are set to 0x80000. When the previously skipped measurement isre-enabled, the output will be filtered using the filter memory from the last time when the measurement was not skipped. If
this is not desired, please write to the filter register in order to re-initialize the filter.

3.3.5 Gas sensor heating and measurement
The operation of the gas sensing part of BME680 involves two steps:
1. Heating the gas sensor hot plate to a target temperature (typically between 200 °C and 400 °C) and keep thattemperature for a certain duration of time.
2. Measuring the resistance of the gas sensitive layer.
Up to 10 different hot plate temperature set points can be configured by setting the registers res_heat_x<7:0>, where x =0…9 .The internal heater control loop operates on the resistance of the heater structure. Hence, the user first needs toconvert the target temperature into a device specific target resistance before writing the resulting register code into the sensor
memory map.
The following code will calculate register code that to be written to res_heat_x<7:0>. Nevertheless, it is recommended to use
the sensor API available on github (Chapter 4) for a friendlier user experience.
var1 = ((double)par_g1 / 16.0) + 49.0;
var2 = (((double)par_g2 / 32768.0) * 0.0005) + 0.00235;
var3 = (double)par_g3 / 1024.0;
var4 = var1 * (1.0 + (var2 * (double) target_temp));var5 = var4 + (var3 * (double)amb_temp);
res_heat_x = (uint8_t)(3.4 * ((var5 * (4.0 / (4.0 + (double)res_heat_range)) * (1.0/(1.0 +((double)res_heat_val * 0.002)))) - 25));

where








par_g1, par_g2, and par_g3 are calibration parameters,
target_temp is the target heater temperature in degree Celsius,
amb_temp is the ambient temperature (hardcoded or read from temperature sensor),
var5 is the target heater resistance in Ohm,
res_heat_x is the decimal value that needs to be stored in register, where ‘x’ corresponds to the temperature profile
number between 0 and 9,
res_heat_range is the heater range stored in register address 0x02 <5:4>, and
res_heat_val is the heater resistance correction factor stored in register address 0x00 (signed, value from -128 to127).

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Table 11: Variable names and register addresses for res_heat_x calculation
Variable nameRegister address (LSB / MSB)

par_g1

0xED

par_g20xEB/0xEC

par_g30xEE

res_heat_range

0x02 <5:4>

res_heat_val

0x00

For each of the 10 temperature set-points, the heating duration must be specified. Referring to Figure 1, the heating phasestarts after the temperature, pressure and humidity measurements are complete. This means there is no heating in parallelto these measurements, which is desirable to minimize undesired cross-influences between the various sensor components.
The heating duration is specified by writing to the corresponding gas_wait_x<7:0> control register. Heating durations
between 1 ms and 4032 ms can be configured. In practice, approximately 20–30 ms are necessary for the heater to reachthe intended target temperature.

3.4 Data readout
The procedure goes as follows, the new_data_x bit (see Section 5.3.5.1) can be checked to see if a new data is generated.
If gas measurements are performed the gas_valid_r (see Section 5.3.5.5) and heat_stab_r (see Section 5.3.5.6) status bitsof the respectively field should be checked to ensure that the gas measurement was successful. If heat_stab_r is zero, it
indicates that either the heating time was not sufficient to allow the sensor to reach to configured target temperature or thatthe target temperature was too high for the sensor to reach.
After the uncompensated values of temperature, pressure and humidity have been read, the actual humidity, pressure andtemperature need to be calculated using the compensation parameters stored in the device. Please refer to the BME6xy API
for more details.

3.4.1 Gas resistance readout
Readout of gas resistance ADC value and calculation of gas resistance consists of 3 steps
1. Read gas ADC value (gas_r) and gas ADC range (gas_range_r) (see Section 5.3.4)
2. Read range switching error from register address 0x04 <7:4> (signed 4 bit)
3. Convert ADC value into gas resistance in ohm
The conversion is done as follows:
var1 = (1340.0 + 5.0 * range_switching_error) * const_array1[gas_range];
gas_res = var1 * const_array2[gas_range] / (gas_r - 512.0 + var1);

3.5 Output compensation
The BME680 output consists of the ADC output values. However, each sensing element behaves differently. Therefore, theactual humidity, pressure and temperature must be calculated using a set of calibration parameters. This is implemented in
the BME6xy API.

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Table 12: List of gas ranges and corresponding constants used for the resistance calculation
gas_range

Constants (to be integrated in the driver)const_array1

const_array2018000000

1

14000000

2

12000000

3

1

1000000

4

1499500.4995

5

0.99

248262.1648

611250007

0.992

63004.03226

8

131281.28128

9

1

15625

10

0.998

7812.511

0.995

3906.2512

1

1953.12513

0.99

976.5625

141

488.28125

151

244.140625

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4. Software and use cases
4.1 BSEC software
BME680 sensor is intended to be used together with Bosch Software Environmental Cluster (BSEC) solution and BME6xy
sensor API to unlock its full potential. The BSEC software features intelligent algorithms which enable use cases such asindoor-air-quality monitoring using the BME680.
Bosch Sensortec BSEC software is available as a closed source binary which will be made available via a Software License
Agreement (SLA) on the Bosch Sensortec website (https://www.bosch-sensortec.com/bst/products/all_products/BSEC).
Sensor API covers basic sensor communication and data compensation functions and is available as open-source code from
Github (https://github.com/BoschSensortec/BME680_driver).
The key features of the hardware-software system are:

Calculation of ambient air temperature outside of the device (e.g. phone)
Calculation of ambient relative humidity outside of the device
Calculation of indoor air quality (IAQ) level outside of the device

Moreover, the software algorithms handle humidity compensation, baseline as well as long-term drift correction of the gas
sensor signal.
Different power modes for the gas sensor and corresponding data rates are supported by the software solution:Ultra low power (ULP) mode that is designed for battery-powered and/or frequency-coupled devices over extended
periods of time. This mode features an update rate of 300 seconds and an average current consumption of <0.1 mA
Low power (LP) mode that is designed for interactive applications where the indoor-air-quality is tracked andobserved at a higher update rate of 3 seconds with a current consumption of <1 mA
Continuous (CONT) mode provides an update rate of 1 Hz and shall only be used for use cases that incorporate
very fast events or stimulus

Table 13: BSEC gas sensor power-modes
BSEC power mode

Update rate

Average current consumption

Ultra-low power mode (ULP)

3.3 mHz0.09 mA

Low power mode (LP)0.33 Hz

0.9 mA

Continuous mode (for testing purposes
only)

1 Hz

12 mA

BSEC is available in two main variants called solutions: IAQ and ALL solution.
IAQ solution is intended for customers wishing to measure indoor-air-quality, temperature, humidity, and pressure in
embedded devices. IAQ solution can be downloaded from the Bosch Sensortec website (https://www.boschsensortec.com/bst/products/all_products/BSEC).
ALL solution contains the same features as IAQ solution but also includes more complex ambient temperature and humidity
estimation algorithms that will improve temperature and humidity performance in devices that contain many dynamic heatsources in their design. Such devices are, for example, smartphones containing displays, flashlights, large batteries andpowerful microprocessors. As these advanced algorithms require tailoring to optimize them to a given customer design,please contact your local Bosch Sensortec representative for support.
The following table describes the available outputs of BSEC. Full descriptions of the outputs and the available interfaces areavailable in the integration guide shipped together with the BSEC software.

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Table 14: BSEC outputs
OutputIncluded insolution

Description

IAQ

ALL

Raw pressure✔

✔

Raw data from sensor API bypassed to BSEC output

Raw temperature✔

✔

Raw data from sensor API bypassed to BSEC output

Raw relative humidity✔

✔

Raw data from sensor API bypassed to BSEC output

Raw gas resistance✔

✔

Raw data from sensor API bypassed to BSEC output

Sensor-compensatedtemperature✔

✔

Temperature which is compensated for internal crossinfluences caused by the BME sensor

Sensor-compensated relative
humidity✔

✔

Relative humidity which is compensated for internal crossinfluences caused by the BME sensor

Ambient temperature✔

Ambient temperature after compensating the influence ofdevice (where BME680 is integrated in) heatsources

Ambient relative humidity✔

Ambient relative humidity after compensating influence ofdevice (where BME680 is integrated in) heatsources

IAQ (0-500)✔

✔

Indoor-air-quality

Accuracy status✔

✔

Accuracy status of IAQ, ambient termpature/humidity

Stabilization time status✔

✔

Indicates if the sensor is undergoing initial stabilization during
its first use after production

Run in status✔

✔

Indicates when the sensor is ready after after switch-on

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4.2 Indoor-air-quality
BME680 is a metal oxide-based sensor that detects VOCs by adsorption (and subsequent oxidation/reduction) on its
sensitive layer. Thus, BME680 reacts to most volatile compounds polluting indoor air (one exception is for instance CO 2). In
contrast to sensors selective for one specific component, BME680 is capable of measuring the sum of VOCs/contaminantsin the surrounding air. This enables BME680 to detect e.g. outgassing from paint, furniture and/or garbage, high VOC levels
due to cooking, food consumption, exhaled breath and/or sweating.
As a raw signal, BME680 will output resistance values and its changes due to varying VOC concentrations (the higher theconcentration of reducing VOCs, the lower the resistance and vice versa). Since this raw signal is influenced by parameters
other than VOC concentration (e.g. humidity level), the raw values are transformed to an indoor air quality (IAQ) index bysmart algorithms inside BSEC.
The IAQ scale ranges from 0 (clean air) to 500 (heavily polluted air). During operation, the algorithms automatically calibrate
and adapt themselves to the typical environments where the sensor is operated (e.g., home, workplace, inside a car, etc.).
This automatic background calibration ensures that users experience consistent IAQ performance. The calibration process
considers the recent measurement history (typ. up to four days) to ensure that IAQ ~ 25 corresponds to “typical good” airand IAQ ~ 250 indicates “typical polluted” air.

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5. Global memory map and register description
5.1 General remarks
Communication with the device is performed by reading from and writing to registers. Registers have a width of 8 bits. If I2C
is used, 8-bit addressing is utilized. If SPI is used, 7-bit address is only available for register access. For details on theinterface, consult Chapter 6.
In SPI mode complete memory map is accessed using page 0 and page 1. Register spi_mem_page is used for page selection.
After power-on, spi_mem_page is in its reset state and page 0 (0x80 to 0xFF) will be active. Page 1 (0x00 to 0x7F) will be
active on setting spi_mem_page to 1.
Global memory map consists of calibration registers, control registers, data registers, status registers and reserved registers.
There are, however, several registers which are reserved. Accordingly, they should not be written to and no specific value isguaranteed when they are read.

Table 15: Memory map page selection
Digital Interface

Register address range

Register spi_mem_page

Memory Page

I2C

0x00 to 0xFF

Not Applicable

Not Applicable

SPI

0x80 to 0xFF

0 (default; power on state)

Page 0SPI

0x00 to 0x7F

1

Page 1

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5.2 Memory map
The memory map is given in Table 16: Memory mapTable 16, noting that not all reserved registers are depicted.

Table 16: Memory map
I2C

SPI

Register name

Bit 7
Adr

Adr

Bit 6

Bit 5

Bit 4

Bit 3

Bit2

Bit 1

Bit 0

Reset statePgstatus

73h

73h

1

Reset

E0h

60h

0

reset<7:0>

00h

Id

D0h

50h

0

chip_id<7:0>

61h

Config

75h

75h

1

Ctrl_meas

74h

74h

1

osrs_t<2:0>

Ctrl_hum

72h

72h

1

spi_3w_int_en

Ctrl_gas_1

71h

71h

1

Ctrl_gas_0

70h

70h

1

Gas_wait_x

6Dh…64h

6Dh…64h1

gas_wait_9<7:0> downto gas_wait_0<7:0>00h

Res_heat_x

63h…5Ah63h…5Ah1

res_heat_9<7:0> downto res_heat_0<7:0>00h

Idac_heat_x59h…50h59h…50h1

idac_heat_9<7:0> downto idac_heat_0<7:0>00h

gas_r_lsb

2Bh

2Bh

1

gas_r_msb

2Ah

2Ah

1

gas_r<9:2>00hhum_lsb

26h

26h

1

hum_lsb<7:0>00hhum_msb

25h

25h

1

hum_msb<7:0>80h

temp_xlsb

24h

24h

1

temp_lsb

23h

23h

1

temp_lsb<7:0>00h

temp_msb

22h

22h

1

temp_msb<7:0>80hpress_xlsb

21h

21h

1

press_lsb

20h

20h

1

press_lsb<7:0>00hpress_msb

1Fh

1Fh

1

press_msb<7:0>80h

eas_status_0

1Dh

1Dh

1

spi_mem_page01hfilter<2:0>

spi_3w_en

osrs_p<2:0>

mode<1:0>00h

osrs_h<2:0>

run_gas00h

nb_conv<3:0>00hheat_off

gas_r<1:0>

gas_valid_r

measuring

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gas_range_r0

press_xlsb<7:4>

new_data_0 gas_measuring00h

heat_stab_r

temp_xlsb<7:4>

0

00h

0

0

00h

0

0

0

0

gas_meas_index_0<3:0>

00h

00h

00h

Registers

Color/Type

Reserved

Do not change

Status register

Read only

Data register

Read only

Control register

Read/write

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5.3 Register description
5.3.1 General control registers
5.3.1.1 SPI 3 wire interrupt enable – spi_3w_int_en
Register Name

Address

Content<bit position>

Description

ctrl_hum0x72

spi_3w_int_en <6>

New data interrupt can be enabled if the device is in
SPI 3 wire mode and pi_3w_int_en=1.
The new data interrupt is then indicated on the SDO
pad.

Description

5.3.1.2 SPI 3 wire enable – spi_3w_en
Register Name

Address

Content<bit position>

config0x75

spi_3w_en<0>

Enable SPI 3 wire mode

5.3.1.3 Mode Selection – mode
The operation modes of the sensor can be controlled by the register mode as specified below.
Register Name
Address
Content<bit position>
Description
ctrl_meas

0x74

mode<1:0>

mode<1:0>

Mode

00

Sleep mode

01

Forced mode

Select sensor power mode as shown in the following
table

5.3.1.4 SPI memory map page selection – spi_mem_page
In SPI mode complete memory page is accessed using page 0 & page 1. Register spi_mem_page is used for page selection.
After power-on, spi_mem_page is in its reset state and page 0(0x00 to 0x7F) will be active. Page1 (0x7F to 0xFF) will be
active on setting spi_mem_page. Please refer Table 15 for better understanding.
Register Name

Address

Content<bit position>

Description

status0x73(Page 0/1)

spi_mem_page <4>Selects memory map page in SPI mode

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5.3.1.5 Reset – reset
Writing 0xB6 to this register initiates a soft-reset procedure, which has the same effect like power-on reset. The default
value stored in this register is 0x00.
Register Name
Address
Content<bit position>
Description
reset

0x60 (Page 0 in SPI mode)
0xE0 in I2C

reset<7:0>

Resets the device

Register Name

Address

Content<bit position>

DescriptionId

0x50(Page 0 in SPI mode)
0xD0 in I2C

chip_id<7:0>

Chip id of the device

5.3.1.6 Chip id – chip_id

5.3.2 Temperature, pressure and relative humidity control registers
5.3.2.1 Humidity sensor over sampling control – osrs_h
Register Name

Address

Content<bit position>

Description

ctrl_hum0x72

osrs_h<2:0>

Controls over sampling setting of humidity
sensor as described in the following table

osrs_h<2:0>

Humidity oversampling000

Skipped (output set to 0x8000)

001

oversampling ×1

010

oversampling ×2

011

oversampling ×4

100

oversampling ×8101, Others

oversampling ×16

5.3.2.2 Over sampling setting – Temperature data – osrs_t
Register Name

Address

Content<bit position>

Description

ctrl_meas

0x74

osrs_t<7:5>

Temperature oversampling settings as shownin the following table

osrs_t<2:0>

Temperature oversampling000

Skipped (output set to 0x8000)

001

oversampling ×1

010

oversampling ×2

011

oversampling ×4

100

oversampling ×8101, Others

oversampling ×16

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5.3.2.3 Over sampling setting – Pressure data – osrs_p
Register Name

Address

Content<bit position>

Description

ctrl_meas

0x74

osrs_p<4:2>

Pressure oversampling settings as shown in
the following table

osrs_p<2:0>

Pressure oversampling000

Skipped (output set to 0x8000)

001

oversampling ×1

010

oversampling ×2

011

oversampling ×4

100

oversampling ×8101, Others

oversampling ×16

5.3.2.4 IIR filter control – filter
IIR filter applies to temperature and pressure data but not to humidity and gas data. The data coming from the ADC are
filtered and then loaded into the data registers. The temperature and pressure result registers are updated together at thesame time at the end of the measurement. IIR filter output resolution is 20 bits. The result registers are reset to value 0x80000
when the temperature and/or pressure measurements have been skipped (osrs_x=”000‟). The appropriate filter memory is
kept unchanged (the value from the last measurement is kept). When the appropriate OSRS register is set back to nonzero,then the first value stored to the result registers are filtered.
Register Name

Address

Content<bit position>

Description

config

0x75

filter<4:2>

IIR filter settings as shown in the following
table

filter<2:0>

Filter coefficient

000

0

001

1

010

3

011

7

100

15

101

31

110

63

111

127

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5.3.3 Gas control registers
The sensor can have 10 programmable gas sensor heater set-points. A set-point consists of a target heater resistance,heater-on time and optionally an initial heater current.
5.3.3.1 Heater current - idac_heat_x
BME680 contains a heater control block that will inject enough current into the heater resistance to achieve the requested
heater temperature. There is a control loop which periodically measures heater resistance value and adapts the value ofcurrent injected from a DAC.
The heater operation could be speeded up by setting an initial heater current for a target heater temperature by using
register idac_heat_x<7:0>. This step is optional since the control loop will find the current after a few iterations anyway. The
current injected to the heater in mA can be calculated by: (idac_heat_7_1 + 1) / 8, where idac_heat_7_1 is the decimalvalue stored in idac_heat<7:1> (unsigned, value from 0 to 127).
Heater setpoint
0...9

Register nameidac_heat_x
x is from 0 to 9

Address

Content

0x50…0x59

idac_heat_x<7:0>
x is from 0 to 9

Description
idac_heat of particular heaterset point

5.3.3.2 Target heater resistance - res_heat_x
Target heater resistance is programmed by user through res_heat_x<7:0> registers. The definition of res_heat_x is given in
Section 3.3.5.
Heater set-point
0...9

Register nameres_wait_x
x is from 0 to 9

Address
0x5A…0x63

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Content
res_heat_x<7:0>
x is from 0 to 9

Description
Decimal value that needs to be
stored for achieving target
heater resistance

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5.3.3.3 Gas Sensor wait time - gas_wait_x
Referring to Figure 1, the time between the beginning of the heat phase and the start of gas sensor resistance conversion
depends on gas_wait_x setting as mentioned below.
Heater set-point

Register name

Address

Content

Description

0...9

gas_wait_x
x is from 0 to 9

0x64…0x6D

gas_wait_x<5:0>
x is from 0 to 9

64 timer values with
1 ms step sizes, all zeros
means no wait

0...9

gas_wait_x
x is from 0 to 9

0x64…0x6D

gas_wait_x<7:6>
x is from 0 to 9

Please refer to the table below
for settings

gas_wait_x<7:6>

Gas sensor wait time multiplication factor

00

1

01

4

10

16

11

64

5.3.3.4 Heater off - heat_off
Register Name
ctrl_gas_0

Address
0x70

Content<bit
position>
heat_off <3>

Modifications reserved |Data subject not change without notice | Printed in Germany

Description
Turn off current injected to heater by setting bit toone

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5.3.3.5 Heater profile selection - nb_conv
nb_conv is used to select heater set-points of the sensor. The different heater set-points are described in the sections above.
Register Name
Address
Content<bit position>
Description
ctrl_gas_1

0x71

nb_conv<3:0>

Indicates index of heater set point that will be
used in forced mode as describe in below table

nb_conv<3:0>

Heater profile set-point

0000

0

0001

1

0010

2

0011

3

0100

4

0101

5

0110

6

0111

7

1000

8

1001

9

5.3.3.6 Run Gas - run_gas
Register Name
ctrl_gas_1

Address
0x71

Content<bit position>
run_gas<4>

Modifications reserved |Data subject not change without notice | Printed in Germany

Description
The gas conversions are started only inappropriate mode if run_gas = ‘1’

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5.3.4 Data registers
In this section, the data registers for the temperature, pressure, humidity and gas sensors are explained. Shadowing
registers are utilized to buffer the data and to ensure stable data in case an update of the data registers occurs
simultaneously with the serial interface reading out.
5.3.4.1 Pressure data
Register Name

Address

Content<bit position>

Description

press_msb

0x1F

press_msb<7:0>

Contains the MSB part [19:12] of the raw
pressure measurement output data.

press_lsb

0x20

press_lsb<7:0>

Contains the LSB part [11:4] of the raw pressure
measurement output datapress_xlsb

0x21

press_xlsb<7:4>

Contains the XLSB part [3:0] of the raw pressure
measurement output data. Contents depend onpressure resolution controlled by oversamplingsetting.

Content<bit position>

Description

5.3.4.2 Temp data
Register Name

Address

temp_msb

0x22

temp_msb<7:0>

Contains the MSB part [19:12] of the raw
temperature measurement output data.

temp_lsb

0x23

temp_lsb<7:0>

Contains the LSB part [11:4] of the raw
temperature measurement output data.

temp_xlsb

0x24

temp_xlsb<7:4>

Contains the XLSB part [3:0] of the raw
temperature measurement output data. Contents
depend on temperature resolution controlled byoversampling setting.

Content<bit position>

Description

5.3.4.3 Humidity data
Register Name

Address

hum_msb

0x25

hum_msb<7:0>

Contains the MSB part [15:8] of the raw humidity
measurement output data.

hum_lsb

0x26

hum_lsb<7:0>

Contains the LSB part [7:0] of the raw humidity
measurement output data.

5.3.4.4 Gas resistance data
Register Name

Address

Content<bit position>

Description

gas_r_msb

0x2A

gas_r<7:0>

Contains the MSB part gas resistance [9:2] of the
raw gas resistance.

gas_r_lsb

0x2B

gas_r<7:6>

Contains the LSB part gas resistance [1:0] of the
raw gas resistance.

5.3.4.5 Gas resistance range
Register Name
gas_r_lsb

Address
0x2B

Content<bit position>
gas_range_r<3:0>

Modifications reserved |Data subject not change without notice | Printed in Germany

Description
Contains ADC range of measured gas resistance.

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5.3.5 Status registers
5.3.5.1 New data status
The measured data are stored into the output data registers at the end of each TPHG conversion phase along with status
flags and index of measurement.
Register Name
Address
Content<bit position>
Description
meas_status_0

0x1D

new_data_0<7>

New data flag

5.3.5.2 Gas measuring status
Measuring bit is set to “1‟ only during gas measurements, goes to “0‟ as soon as measurement is completed and datatransferred to data registers. The registers storing the configuration values for the measurement (gas_wait_shared,
gas_wait_x, res_heat_x, idac_heat_x, image registers) should not be changed when the device is measuring.
Register Name
meas_status_0

Address
0x1D

Content<bit position>
gas_measuring<6>

Description
Gas measuring status flag

5.3.5.3 Measuring status
Measuring status will be set to ‘1’ whenever a conversion (temperature, pressure, humidity and gas) is running and back to‘0’ when the results have been transferred to the data registers.
Register Name
meas_status_0

Address
0x1D

Content<bit position>measuring<5>

Description
Measuring status flag

5.3.5.4 Gas Measurement Index
User can program a sequence of up to 10 conversions by setting nb_conv<3:0>. Each conversion has its own heater
resistance target but 3 field registers to store conversion results. The actual gas conversion number in the measurement
sequence (up to 10 conversions numbered from 0 to 9) is stored in gas_meas_index register.
Register Name
meas_status_0

Address
0x1D

Content<bit position>
gas_meas_index_0<3:0>

Modifications reserved |Data subject not change without notice | Printed in Germany

Description
Gas measurement index

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5.3.5.5 Gas valid status
In each TPHG sequence contains a gas measurement slot, either a real one which result is used or a dummy one to keepa constant sampling rate and predictable device timing. A real gas conversion (i.e., not a dummy one) is indicated by thegas_valid_r status register.
Register Name
gas_r_lsb

Address
0x2B

Content<bit position>
gas_valid_r<5>

Description
Gas valid bit

5.3.5.6 Heater Stability Status
Heater temperature stability for target heater resistance is indicated heat_stab_x status bits.
Register Name
gas_r_lsb

Address
0x2B

Content<bit position>
heat_stab_r<4>

Modifications reserved |Data subject not change without notice | Printed in Germany

Description
Heater stability bit

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6. Digital interfaces
The sensor supports the I²C and SPI digital interfaces, where it acts as a slave for both protocols. The I²C interface supports
the Standard, Fast and High Speed modes. The SPI interface supports both SPI mode ‘00’ (CPOL = CPHA = ‘0’) and mode
‘11’ (CPOL = CPHA = ‘1’) in 4-wire and 3-wire configuration.
The following transactions are supported:Single byte write
multiple byte write (using pairs of register addresses and register data)
single byte readmultiple byte read (using a single register address which is auto-incremented)

6.1 Interface selection
Interface selection is done automatically based on CSB (chip select) status. If CSB is connected to V DDIO, the I²C interface isactive. If CSB is pulled down, the SPI interface is activated. After CSB has been pulled down once (regardless of whether
any clock cycle occurred), the I²C interface is disabled until the next power-on-reset. This is done in order to avoid
inadvertently decoding SPI traffic to another slave as I²C data. Since the device startup is deferred until both VDD and VDDIO
are established, there is no risk of incorrect protocol detection because of the power-up sequence used. However, if I²C is to
be used and CSB is not directly connected to VDDIO but is instead connected to a programmable pin, it must be ensured that
this pin already outputs the VDDIO level during power-on-reset of the device. If this is not the case, the device will be locked
in SPI mode and not respond to I²C commands.

6.2 I²C Interface
For detailed timings, please review Table 18 . All modes (standard, fast, high speed) are supported. SDA and SCL are notpure open-drain. Both pads contain ESD protection diodes to VDDIO and GND. As the devices does not perform clock
stretching, the SCL structure is a high-Z input without drain capability.

Picture 3: SDI/SCK ESD schematic
The 7-bit device address is 111011x. The 6 MSB bits are fixed. The last bit is changeable by SDO value and can be changed
during operation. Connecting SDO to GND results in slave address 1110110 (0x76); connection it to V DDIO results in slave
address 1110111 (0x77), which is the same as BMP280’s I²C address. The SDO pin cannot be left floating; if left floating, theI²C address will be undefined.

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The I²C interface uses the following pins:




SCK:
SDI:
SDO:

serial clock (SCL)
data (SDA)
Slave address LSB (GND = ‘0’, VDDIO = ‘1’)

CSB must be connected to VDDIO to select I²C interface. SDI is bi-directional with open drain to GND: it must be externallyconnected to VDDIO via a pull up resistor. Refer to Chapter 7 for connection instructions.
The following abbreviations will be used in the I²C protocol figures:






S
P
ACKS
ACKM
NACKM

Start
Stop
Acknowledge by slave
Acknowledge by masterNot acknowledge by master6.2.1 I²C write
Writing is done by sending the slave address in write mode (RW = ‘0’), resulting in slave address 111011X0 (‘X’ is determinedby state of SDO pin. Then the master sends pairs of register addresses and register data. The transaction is ended by a stop
condition. This is depicted in Picture 4.
Control byte
Slave Address

Start

S

1

1

1

0

1

Register address (A0h)

RW ACKS

1

X

0

Data byte

1

0

1

0

0

0

0

Register data - address A0h

ACKS

0

bit7

bit6

bit5

Control byte

1

0

1

0

0

bit3

bit2

…

bit1 bit0

Data byte

Register address (A1h)

…

bit4

ACKS

0

0

Register data - address A1h

ACKS

1

bit7

bit6

bit5

bit4

bit3

bit2

ACKS Stop

bit1 bit0

P

Picture 4: I²C multiple byte write (not auto-incremented)

6.2.2 I²C read
To be able to read registers, first the register address must be sent in write mode (slave address 111011X0). Then either astop or a repeated start condition must be generated. After this the slave is addressed in read mode (RW = ‘1’) at address
111011X1, after which the slave sends out data from auto-incremented register addresses until a NOACKM and stop
condition occurs. This is depicted in Picture 5, where register 0xF6 and 0xF7 are read.
Control byte
Slave Address

Start

S

1

1

1

0

1

Register address (F6h)

RW ACKS

1

X

0

1

1

1

1

0

1

ACKS

1

0

Data byte
Slave Address

Start

S

1

1

1

0

1

Register data - address F6h

RW ACKS

1

X

1

Data byte

bit7

bit6

bit5

bit4

bit3

bit2 bit1 bit0

Register data - address F7h

ACKM

bit7

bit6 bit5 bit4 bit3 bit2 bit1 bit0

NOACKM StopP

Picture 5: I²C multiple byte read

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6.3 SPI interface
The SPI interface is compatible with SPI mode ‘00’ (CPOL = CPHA = ‘0’) and mode ‘11’ (CPOL = CPHA = ‘1’). The automatic
selection between mode ‘00’ and ‘11’ is determined by the value of SCK after the CSB falling edge.
The SPI interface has two modes, namely 4-wire and 3-wire mode. However, the protocol is the same for both. The 3-wiremode is selected by setting ‘1’ to the register spi3w_en. The pad SDI is used as a data pad in 3-wire mode.
The SPI interface uses the following pins:





CSB:
SCK:
SDI:
SDO:

chip select, active low
serial clock
serial data input; data input/output in 3-wire mode
serial data output; hi-Z in 3-wire mode

For more connection instructions, please refer to Chapter 7.
CSB is active low and has an integrated pull-up resistor. Data on SDI is latched by the device at SCK rising edge and SDO
is changed at SCK falling edge. Communication starts when CSB goes to low and stops when CSB goes to high; during
these transitions on CSB, SCK must be stable. The SPI protocol is shown in It is important to note that Picture 6. For timing
details, please review Table 19.

CSB

SCK

SDI
RW

AD6

AD5

AD4

AD3

AD2

AD1

AD0

DI7

DI6

DI5

DI4

DI3

DI2

DI1

DI0

DO7

DO6

DO5

DO4

DO3

DO2

DO1

DO0 tri-state

SDO

Picture 6: SPI protocol (shown for mode ‘11’ in 4-wire configuration)

It is important to note that in the SPI mode, only 7 bits of the register addresses are used; the MSB of register address is not
used and replaced by a read/write bit (RW = ‘0’ for write and RW = ‘1’ for read). For example, address 0xF7 is accessed byusing SPI register address 0x77. On the one hand, the byte 0x77 is transferred for write access, and on the other hand, thebyte 0xF7 is transferred for read access.

6.3.1 SPI write
Writing is done by lowering CSB and sending pairs control bytes and register data. The control bytes consist of the SPI
register address (= full register address without bit 7) and the write command (bit7 = RW = ‘0’). Several pairs can be written
without raising CSB. The transaction is ended by a raising CSB. The SPI write protocol is depicted in Picture 7.
Control byte
Start

RW

CSB
=
0

0

Data byte

Register address (F4h)

1

1

1

0

1

0

Control byte

Data register - address F4h

0

bit7

bit6

bit5

bit4

bit3

bit2

bit1

bit0

0

Data byte

Register address (F5h)

RW
1

1

1

0

1

0

Data register - adress F5h

1

bit7

bit6

bit5

bit4

bit3

bit2

Stop
bit1

bit0

CSB
=
1

Picture 7: SPI multiple byte write (not auto-incremented)

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6.3.2 SPI read
Reading is done by lowering CSB and first sending one control byte. The control bytes consist of the SPI register
address (= full register address without bit 7) and the read command (bit 7 = RW = ‘1’). After writing the control
byte, data is sent out of the SDO pin (SDI in 3-wire mode); the register address is automatically incremented. The
SPI read protocol is depicted in Picture 8.
Control byte
Register address (F6h)

Start RW
CSB
=
0

1

1

1

1

0

1

1

0

Data byte

Data byte

Data register - address F6h

Data register - address F7h

bit15 bit14 bit13 bit12 bit11 bit10 bit9

bit8

bit7

bit6

bit5

bit4

bit3

Stop

bit2 bit1 bit0

CSB
=
1

Picture 8: SPI multiple byte read

6.4 Interface parameter specification
6.4.1 General interface parameters
Table 17: Interface parameters
Parameter

SymbolCondition

Input low level

Vil_si

VDDIO=1.2 V to 3. 6V

Input high level

Vih_si

VDDIO=1.2 V to 3.6 V

Output low level I2C

Vol_SDIVDDIO=1.62 V, Iol=3 mA

20%VDDIO

Output low level I2C

Vol_SDI_1.2

VDDIO=1.20 V, Iol=3 mA

23%VDDIO

Output low level SPI

Vol_SDO

VDDIO=1.62 V, Iol=1 mA

20%VDDIO

Output low level SPI

Vol_SDO_1.2

VDDIO=1.20 V, Iol=1 mA

23%VDDIO

Output high level

Voh

VDDIO=1.62 V, Ioh=1 mA (SDO, SDI)

80

%VDDIO

Output high level

Voh_1.2

VDDIO=1.20 V, Ioh=1 mA (SDO, SDI)

60

%VDDIO

Pull-up resistor

Rpull

Internal CSB pull-up resistor to VDDIO

70

I2C bus load capacitor Cb

On SDI and SCK

Modifications reserved |Data subject not change without notice | Printed in Germany

Min

Typ

Max Unit
20

80%VDDIO%VDDIO

120

190

kΩ

400

pF

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6.4.2 I²C timings
For I²C timings, the following abbreviations are used:“S&F mode” = standard and fast mode
“HS mode” = high speed mode
Cb = bus capacitance on SDA line

All other naming refers to I²C specification 2.1 (January 2000).
The I²C timing diagram is in Picture 9. The corresponding values are given in Table 18

SDI
tBUF
tf

tLOW
SCK

tHIGH
tHDSTAtrtHDDATtSUDAT

SDItSUSTAtSUSTO

Picture 9: I2C timing diagram
Table 18: I2C timings
Parameter

Symbol

SDI setup time

tSU;DATSDI hold time

tHD;DATSCK low pulsetLOW

SCK low pulse

tLOW

ConditionMin

S&F Mode160

ns

HS mode30

ns

S&F Mode, Cb≤100 pF
S&F Mode, Cb≤400 pF
HS mode, Cb≤100 pF
HS mode, Cb≤400 pF

80
90
18
24

ns
ns
ns
ns

HS mode, Cb≤100 pF
VDDIO = 1.62 V
HS mode, Cb≤100 pF
VDDIO = 1.2 V

Typ

Max

115
150

Unit

160

ns

210

ns

The above-mentioned I2C specific timings correspond to the following internal added delays:

Input delay between SDI and SCK inputs: SDI is more delayed than SCK by typically 100 ns in Standard and Fast
Modes and by typically 20 ns in High Speed Mode.
Output delay from SCK falling edge to SDI output propagation is typically 140 ns in Standard and Fast Modes andtypically 70 ns in High Speed Mode.

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6.4.3 SPI timings
The SPI timing diagram is in Picture 10, while the corresponding values are given in Table 19. All timings apply both to 4and 3-wire SPI.
T_hold_csb

T_setup_csb

CSB

T_low_sck

T_high_sck

SCK

SDI

T_setup_sdi

T_hold_sdi

SDO

T_delay_sdo

Picture 10: SPI timing diagram
Table 19: SPI timings
Parameter

SymbolSPI clock i/p frequency

F_spi

0

SCK low pulse

T_low_sck20

ns

SCK high pulse

T_high_sck

20ns

SDI setup time

T_setup_sdi

20ns

SDI hold time

T_hold_sdi

20ns

SDO output delay

T_delay_sdo

25 pF load, VDDIO=1.6 V min

30ns

SDO output delay

T_delay_sdo

25 pF load, VDDIO=1.2 V min

40ns

CSB setup time

T_setup_csb

20ns

CSB hold time

T_hold_csb

20ns

SPI clock input
frequency

F_spi

0

Condition

Modifications reserved |Data subject not change without notice | Printed in Germany

Min

Typ

Max

Unit

10

MHz

10

MHz

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7. Pin-out and connection diagram
7.1 Pin-out
The pin numbering of BME680 is performed in the untypical clockwise direction when seen in top view and counter-clockwise
when seen in bottom view. Picture 11 and Table 20 give a detailed description and illustration of the input/output pins.

Picture 11: Top (left) and bottom (right) views of the chip with input/output pins

Table 20: Pin description
Pin

Connection
Name

I/O type

Description
SPI 4W

SPI 3W

I2C

1

GND

SupplyGround

GND

2

CSB

In

Chip select

CSB

CSB

VDDIO

3

SDI

In/OutSerial data input

SDI

SDI/SDO

SDA

4

SCK

In

Serial clock input

SCK

SCK

SCL

DNC

GND fordefault
address

5

SDO

In/OutSerial data output

SDO

6

VDDIO

SupplyDigital / Interface supply

VDDIO

7

GND

SupplyGround

GND

8

VDD

SupplyAnalog supply

VDD

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7.2 Connection diagrams
For the I2C connection, it is recommended to use 100 nF for C1 and C2. Moreover, the value for the pull-up resistors R1 andR2 should be based on the interface timing and the bus load; a normal value is 4.7 kΩ. Finally, a direct connection between
CSB and VDDIO is required. Similarly for the 4- and 3-wire SPI connections, it is suggested to use 100 nF for C 1 and C2.

(a)

(b)

(c)

Picture 12: Connection diagrams for (a) I2C, (b) 4-wire SPI, and (c) 3-wire SPI

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7.3 Package dimensions

Picture 13: Package dimensions for top, bottom and side view

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7.4 Landing pattern recommendation
For the design of the landing pattern, the dimensions shown in Picture 14: Recommended landing pattern (top view;
dimensions are in milli-meters) are recommended. It is important to note that areas marked in red are exposed PCB metalpads.


In case of a solder mask defined (SMD) PCB process, the land dimensions should be defined by solder mask
openings. The underlying metal pads are larger than these openings.



In case of a non-solder mask defined (NSMD) PCB process, the land dimensions should be defined in the metal
layer. The mask openings are larger than these metal pads.

0.60
0.40

1

0.10

8

2

6

3

0.60

5

0.40

0.20

1.50

3.00

7

4

Soldier stop
Landing pattern

1.50
3.00

Picture 14: Recommended landing pattern (top view; dimensions are in milli-meters)

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7.5 Marking
7.5.1 Mass production devices
Table 21: Marking of mass production parts
Marking

SymbolDescription

CCC

Lot counter: 3 alphanumeric digits, variable
to generate mass production trace-codeT

Product number: 1 alphanumeric digit, fixed
to identify product type, T = “S”“S” is associated with the product BME680(part number 1 277 340 511)

L

Sub-contractor ID: 1 alphanumeric digit,
variable to identify sub-contractor (L = “P”)

7.5.2 Engineering samples
Table 22: Marking of engineering samples
Marking

SymbolDescription

XX

Sample ID: 2 alphanumeric digits,
variable to generate trace-code

NEng. Sample ID: 1 alphanumeric digit, fixed
to identify engineering sample,
N = “ * ” or “e” or “E”

CC

Counter ID: 2 alphanumeric digits,
variable to generate trace-code

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7.6 Soldering guidelines and reconditioning recommendations
The moisture sensitivity level of the BME680 sensors corresponds to JEDEC Level 1, see also:

IPC/JEDEC J-STD-020C “Joint Industry Standard: Moisture/Reflow Sensitivity Classification for non-hermetic Solid
State Surface Mount Devices”



IPC/JEDEC J-STD-033A “Joint Industry Standard: Handling, Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices”

The sensor fulfils the lead-free soldering requirements of the above-mentioned IPC/JEDEC standard, i.e. reflow solderingwith a peak temperature up to 260°C. The minimum height of the solder after reflow shall be at least 50 µm. This is requiredfor good mechanical decoupling between the sensor device and the printed circuit board (PCB).

Picture 15: Soldering profile

7.7 Mounting and assembly recommendations
This HSMI-document provides all the necessary instructions to handle, solder and mount the environmental sensor BME680.
Following the reported guidelines is very important to prevent the damage of the sensor and the resultant loss of warranty.

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7.8 Environmental safety
7.8.1 RoHS
The BME680 sensor meets the requirements of the EC restriction of hazardous substances (RoHS) directive, see also:
Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain
hazardous substances in electrical and electronic equipment.

7.8.2 Halogen content
The BME680 is halogen-free. For more details on the analysis results please contact your Bosch Sensortec representative.

7.8.3 Internal package structure
Within the scope of Bosch Sensortec’s ambition to improve its products and secure the mass product supply, Bosch
Sensortec qualifies additional sources (e.g. 2nd source) for the packaging and processing of the BME680.
While Bosch Sensortec took care that all of the technical packages parameters are described above are 100% identical forall sources, there can be differences in the chemical content and the internal structural between the different package sources.
However, as secured by the extensive product qualification process of Bosch Sensortec, this has no impact to the usage orto the quality of the BME680 product.

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8. Legal disclaimer
8.1 Engineering samples
Engineering Samples are marked with an asterisk (*) or (e) or (E). Samples may vary from the valid technicalspecifications of the product series contained in this data sheet. They are therefore not intended or fit for resale
to third parties or for use in end products. Their sole purpose is internal client testing. The testing of an engineering
sample may in no way replace the testing of a product series. Bosch Sensortec assumes no liability for the useof engineering samples. The Purchaser shall indemnify Bosch Sensortec from all claims arising from the use ofengineering samples.

8.2 Product use
Bosch Sensortec products are developed for the consumer goods industry. They may only be used within theparameters of this product data sheet. They are not fit for use in life-sustaining or security sensitive systems.
Security sensitive systems are those for which a malfunction is expected to lead to bodily harm or significant
property damage. In addition, they are not fit for use in products which interact with motor vehicle systems.
The resale and/or use of products are at the purchaser’s own risk and his own responsibility. The examination of
fitness for the intended use is the sole responsibility of the Purchaser.
The purchaser shall indemnify Bosch Sensortec from all third party claims arising from any product use notcovered by the parameters of this product data sheet or not approved by Bosch Sensortec and reimburse Bosch
Sensortec for all costs in connection with such claims.
The purchaser must monitor the market for the purchased products, particularly with regard to product safety, andinform Bosch Sensortec without delay of all security relevant incidents.

8.3 Application examples and hints
With respect to any examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Bosch Sensortec hereby disclaims any and all warranties and liabilities ofany kind, including without limitation warranties of non-infringement of intellectual property rights or copyrights ofany third party. The information given in this document shall in no event be regarded as a guarantee of conditions
or characteristics. They are provided for illustrative purposes only and no evaluation regarding infringement ofintellectual property rights or copyrights or regarding functionality, performance or error has been made.

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9. Document history and modifications
Rev.
1.0

Chapter

Description of modifications

Date

Initial release

July 2017

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Bosch Sensortec GmbHGerhard-Kindler-Straße 972770 Reutlingen / Germany
www.bosch-sensortec.com
Modifications reserved | Printed in Germany
Preliminary - specifications subject to change without notice
Document number: BST-BME680-DS001-00
Revision_1.0_072017

Modifications reserved |Data subject not change without notice | Printed in Germany

Document number: BST-BME680-DS001-00 Revision_1.0_072017