TN00070

88W8987 Wi-Fi and Bluetooth Feature Lists
Rev. 1 — 3 December 2020

Revision history
Rev
Date
v.1
20201203

Description
Initial version

Product release notes

TN00070

NXP Semiconductors

88W8987 Wi-Fi and Bluetooth Feature Lists

1

Wi-Fi features
1.1 Wireless Client features
1.1.1 802.11ac - Very high throughput• 5 GHz band operation• 5 GHz band supported channel bandwidths: 20 MHz, 40 MHz, and 80 MHz• 802.11ac data rates – Up to 433.3 Mbit/s (MCS 0 to MCS 9)• SU-AMPDU aggregation• MU-MIMO beamformee (explicit and implicit)• RTS/CTS with BW signaling• CCA on secondary channel• Operation mode notification• Backward compatibility with non-VHT devices• Tx VHT MCS rate adaptation

1.1.2 802.11n - High throughput• 2.4 GHz and 5 GHz band operation• 5 GHz band supported channel bandwidths: 20 MHz, 40 MHz• 2.4 GHz band supported channel bandwidths: 20 MHz• Short/long guard interval (400 ns/800 ns)• 1 spatial stream (1x1)• 11n data rates – Up to 150 Mbit/s (MCS 0 to MCS 7)• Aggregated MAC Protocol Data Unit (AMPDU) Rx support• Aggregated MAC Service Data Unit (AMSDU) 4k Rx support• HT protection mechanisms• Tx MCS rate adaptation (BGN)• Rx LDPC

1.1.3 802.11a/b/g features• 802.11g data rates up to 54 Mbit/s• Tx rate adaptation (BG)
• Fragmentation/defragmentation• ERP protection, slot time, preamble

1.1.4 802.11d and 802.11h• 802.11d - Regulatory Domain/Operating Class/Country Info
• 802.11h – Dynamic Frequency Selection(DFS)• DFS Radar Detection in Slave Mode(Follow AP)

1.1.5 802.11e - QoS• EDCA[Enhanced Distributed Channel Access] / WMM (Wireless Multi-Media)
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1.1.6 802.11i - Security• Open and Shared Authentication• WPA-PSK, WPA2-PSK Security (AES-CCMP Encryption)• WPA + WPA2 mixed mode
• WEP Security (64/128 bit)• Opensource WPA supplicant• WPA2 Enterprise Security

1.1.7 WPA3 security• Simultaneous Authentication of Equals (SAE)• SAE Connectivity and PMK Caching• Anti-Clogging• SAE Finite Cyclic Group - Group-19, Group 20, Goup-21• Reflection Attack• WPA2 Personal Compatibility• Commercial National Security Algorithm Suite (CSNA)• Suite B - 192-bit Security ECC p384
• Suite B - 192-bit Security RSA 3K

1.1.8 802.11r – Fast BSS transition (FT)• FT over Air and over DS (Distribution System)

1.1.9 WPS/WSC2.0 functionality• PIN Config Method - 8 Digit/4 Digit• PIN Config Method - Static/Dynamic PIN• PBC - Virtual Push Button Config Method• PBC Session Overlap Detection• STA as Enrollee• Backward Compatibility with WPS1.0 Devices• Opensource WPA supplicant

1.1.10 802.11w - Protected management frames (PMF)• PMF require and capable• Unicast management frames - Encryption/decryption - using CCMP
• Broadcast management frames - Encryption/decryption - using BIP• SA query request/response• PMF Support using Opensource WPA

1.1.11 Power save mode
• Deep sleep• IEEE power save

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1.1.12 General features• Host-based MLME
• EU adaptivity support• Extended channel switch announcement (ECSA)• Wake on Wireless (WoW)• Auto Tx or Keep Alive• MAC Address randomization (in Scan)

1.2 Mobile AP features
1.2.1 802.11ac - Very high throughput• 5 GHz band operation• 5 GHz band supported channel bandwidths: 20 MHz, 40 MHz, and 80 MHz• Short/Long Guard Interval (GI) (400 ns/800 ns)• 802.11ac data rates – Up to 433.3 Mbit/s (MCS 0 to MCS 9)• SU-AMPDU aggregation• RTS/CTS with BW signaling• CCA on secondary channel• Backward compatibility with non-VHT devices• Tx VHT MCS rate adaptation• Operation mode notification

1.2.2 802.11n - High throughput• 2.4 GHz and 5 GHz band operation• 2.4 GHz band supported channel bandwiths: 20 MHz• 5 GHz band supported channel bandwiths: 20 MHz, 40 MHz• Short/long guard interval (400 ns/800 ns)• 1 spatial stream (1x1)• 802.11n data rates – Up to 150 Mbit/s (MCS0 to MCS7)• Tx MCS rate adaptation (BGN)• Aggregated MAC Protocol Data Unit (AMPDU) Tx and Rx support• Aggregated MAC Service Data Unit (AMSDU) – 4k Rx support• Max client support (up to 8 clients)• HT protection mechanisms• Rx Low Density Parity Check (LDPC)

1.2.3 802.11b/g features• Data rates (up to 54 Mbit/s)• Tx rate adaptation (BG)
• ERP protection, slot time, preamble• Handling of associated STAs with IEEE PS - PS-poll and null data

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1.2.4 802.11d and 802.11h features• 802.11d - Regulatory Domain/Operating Class/Country Info
• 802.11h – Dynamic Frequency Selection(DFS)

1.2.5 802.11e - QoS• Enhanced Distributed Channel Access (EDCA) / Wireless Multi-Media (WMM)

1.2.6 802.11i - Security• Open security• WPA-PSK ,WPA2-PSK security (AES-CCMP encryption)• WPA + WPA2 mixed mode
• WEP Security (64/128 bit)• Opensource Hostapd

1.2.7 WPA3 Security• Simultaneous Authentication of Equals (SAE)• SAE Connectivity and PMK Caching• Anti-clogging• SAE finite cyclic group - Group-19, Group 20, Goup-21• Reflection attack• WPA2 personal compatibility• Commercial National Security Algorithm Suite (CSNA)

1.2.8 802.11w - Protected management frames (PMF)• PMF require and capable• Unicast management frames - Encryption/decryption - using CCMP
• Broadcast management frames - Encryption/decryption - using BIP• SA query request/response• Support using Hostapd

1.2.9 WPS/WSC2.0 functionality• PIN config method - 8 digit/4 digit• PIN config method - Static/dynamic PIN• PBC - Virtual push button config method• PBC session overlap detection• AP setup locked state - PIN method• MMH as wireless registrar• MMH as enrollee• Opensource Hostapd

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1.2.10 General features• Deep sleep• Host-based MLME
• EU adaptivity support• Automatic channel selection (ACS)• Extended channel switch announcement (ECSA)• Wake on wireless (WoW)

1.3 Wi-Fi direct/P2P features• P2P support using WPA supplicant

1.3.1 P2P basic functionality• Autonomous GO mode
• WFD client mode
• P2P device mode

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2

Simultaneous AP-STA operation (same channel)• AP-STA functionality

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Bluetooth features
3.1 Bluetooth Classic features
3.1.1 General features• Bluetooth Class 1.5 and Class 2 support• Scatternet support• Maximum of seven simultaneous ACL connections• Automatic packet type selection• Bluetooth - 2.1 to 5.0 specification support• Low power sniff

3.1.2 Bluetooth packet types supported• ACL (DM1, DH1, DM3, DH3, DM5, DH5, 2-DH1, 2-DH3, 2-DH5, 3-DH1, 3-DH3, 3-DH5)• SCO (HV1, HV3)
• eSCO (EV3, EV4, EV5, 2EV3, 3EV3, 2EV5, 3EV5)

3.1.3 Bluetooth profiles supported• Bluetooth A2DP source/sink• Bluetooth AVRCP controller• Bluetooth HFP• Bluetooth OPP server/client• Bluetooth SPP• Bluetooth HID

3.1.4 Bluetooth audio features• PCM NBS slave• PCM WBS slaveTN00070

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3.2 Bluetooth LE features
3.2.1 Generic features• Maximum 16 Bluetooth LE connections (Master role)

3.2.2 Bluetooth LE profile support• Bluetooth LE GATT
• Bluetooth LE GAP• Bluetooth LE HOGP

3.2.3 Bluetooth LE 4.0 support• Low Energy physical layer• Low Energy link layer• Enhancements to HCI for Low Energy• Low Energy direct test mode
• Bluetooth LE - 1 Mbit/s support

3.2.4 Bluetooth LE 4.1 support• Low duty cycle directed advertising• Bluetooth LE dual mode topology• Bluetooth LE privacy v1.1
• Bluetooth LE link layer topology

3.2.5 Bluetooth LE 4.2 support• Bluetooth LE secure connection• Bluetooth LE link layer privacy v1.2
• Bluetooth LE data length extension• Link layer extended scanner filter policies

3.2.6 Bluetooth LE 5.0 support• Bluetooth LE 2 Mbit/s support• High duty cycle directed advertising

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Bluetooth and Wi-Fi coexistence
4.1 Timeshare Coex mode
• STA + Bluetooth Coex
• STA + Bluetooth LE Coex
• STA + Bluetooth + Bluetooth LE Coex
• MMH + Bluetooth Coex
• MMH + Bluetooth LE Coex
• MMH + Bluetooth + Bluetooth LE Coex
• P2P + Bluetooth Coex
• P2P + Bluetooth LE Coex
• P2P + Bluetooth + Bluetooth LE Coex
Note: Timeshare Coex mode is not applicable when Wi-Fi operating frequency is 5 GHz.

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Notes
None.

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Legal information

6.1 Definitions
Draft — A draft status on a document indicates that the content is still
under internal review and subject to formal approval, which may resultin modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included in a draft version of a document and shall have noliability for the consequences of use of such information.

6.2 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does notgive any representations or warranties, expressed or implied, as to theaccuracy or completeness of such information and shall have no liability
for the consequences of use of such information. NXP Semiconductors
takes no responsibility for the content in this document if provided by an
information source outside of NXP Semiconductors. In no event shall NXP
Semiconductors be liable for any indirect, incidental, punitive, special orconsequential damages (including - without limitation - lost profits, lostsavings, business interruption, costs related to the removal or replacementof any products or rework charges) whether or not such damages are based
on tort (including negligence), warranty, breach of contract or any otherlegal theory. Notwithstanding any damages that customer might incur for
any reason whatsoever, NXP Semiconductors’ aggregate and cumulative
liability towards customer for the products described herein shall be limitedin accordance with the Terms and conditions of commercial sale of NXP
Semiconductors.
Right to make changes — NXP Semiconductors reserves the right tomake changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical orsafety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability forinclusion and/or use of NXP Semiconductors products in such equipment orapplications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of theseproducts are for illustrative purposes only. NXP Semiconductors makes
no representation or warranty that such applications will be suitable
for the specified use without further testing or modification. Customers
are responsible for the design and operation of their applications andTN00070

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products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer productdesign. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications
and products planned, as well as for the planned application and use ofcustomer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with
their applications and products. NXP Semiconductors does not accept any
liability related to any default, damage, costs or problem which is basedon any weakness or default in the customer’s applications or products, orthe application or use by customer’s third party customer(s). Customer is
responsible for doing all necessary testing for the customer’s applications
and products using NXP Semiconductors products in order to avoid adefault of the applications and the products or of the application or use bycustomer’s third party customer(s). NXP does not accept any liability in thisrespect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above thosegiven in the Recommended operating conditions section (if present) or theCharacteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects toapplying the customer’s general terms and conditions with regard to thepurchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or
the grant, conveyance or implication of any license under any copyrights,
patents or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a priorauthorization from competent authorities.
Translations — A non-English (translated) version of a document is forreference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.

6.3 Trademarks
Notice: All referenced brands, product names, service names andtrademarks are the property of their respective owners.

All information provided in this document is subject to legal disclaimers.

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Contents
1
Wi-Fi features ...................................................... 2
1.1
Wireless Client features .....................................2
1.1.1
802.11ac - Very high throughput ........................2
1.1.2
802.11n - High throughput ................................. 2
1.1.3
802.11a/b/g features .......................................... 2
1.1.4
802.11d and 802.11h ......................................... 2
1.1.5
802.11e - QoS ................................................... 2
1.1.6
802.11i - Security ...............................................3
1.1.7
WPA3 security ................................................... 3
1.1.8
802.11r – Fast BSS transition (FT) .................... 3
1.1.9
WPS/WSC2.0 functionality ................................ 3
1.1.10802.11w - Protected management frames(PMF) ................................................................. 3
1.1.11
Power save mode ..............................................3
1.1.12
General features ................................................ 4
1.2
Mobile AP features ............................................ 4
1.2.1
802.11ac - Very high throughput ........................4
1.2.2
802.11n - High throughput ................................. 4
1.2.3
802.11b/g features ............................................. 4
1.2.4
802.11d and 802.11h features ........................... 5
1.2.5
802.11e - QoS ................................................... 5
1.2.6
802.11i - Security ...............................................5
1.2.7
WPA3 Security ...................................................5
1.2.8
802.11w - Protected management frames(PMF) ................................................................. 5
1.2.9
WPS/WSC2.0 functionality ................................ 5
1.2.10General features ................................................ 6
1.3
Wi-Fi direct/P2P features ...................................6
1.3.1
P2P basic functionality ...................................... 6
2
Simultaneous AP-STA operation (samechannel) ................................................................73
Bluetooth features .............................................. 8
3.1
Bluetooth Classic features .................................8
3.1.1
General features ................................................ 8
3.1.2
Bluetooth packet types supported ..................... 8
3.1.3
Bluetooth profiles supported .............................. 8
3.1.4
Bluetooth audio features ....................................8
3.2
Bluetooth LE features ........................................ 9
3.2.1
Generic features ................................................ 9
3.2.2
Bluetooth LE profile support .............................. 9
3.2.3
Bluetooth LE 4.0 support ...................................93.2.4
Bluetooth LE 4.1 support ...................................93.2.5
Bluetooth LE 4.2 support ...................................93.2.6
Bluetooth LE 5.0 support ...................................94
Bluetooth and Wi-Fi coexistence .....................10
4.1
Timeshare Coex mode .................................... 10
5Notes .................................................................. 11
6
Legal information .............................................. 12

Please be aware that important notices concerning this document and the product(s)described herein, have been included in section 'Legal information'.

© NXP B.V. 2020.

All rights reserved.

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 3 December 2020
Document identifier: TN00070