計測技術受託サービス

Electronics Assembly and Interconnect Engineering Service
特長 Features● プリント配線板の設計・製造・実装で培った技術でお客様の原理検証・先行開発をサポートしますTo Support Customerʼs POC Development with Meikoʼs Technology Experienced in PCBʼs design, manufacturing and Assembly● 100GHz帯までの材料誘電特性と伝送線路の計測、電磁界解析、熱解析、応力解析、測定基板製造を提供します

Measurement of Material Dk/Df & PCB S-Parameter, Simulation of SI/PI & Electronics Cooling & Thermal Stress, DUT/PCB Manufacturing

お客様Customer

材料メーカー
Material
Supplier

基板メーカー
Competitor

セットメーカーOEM
Supplier

設計
解析

御依頼内容実績Offering Services

基板製造

DesignSimulation

PCBManufacturing✔
✔
✔
✔

✔

部品実装

誘電特性Device
Ass'y

Dk/DfMeasure

✔
✔
✔
✔

比誘電率／誘電正接 測定
Dk/Df Measurement

材料開発支援Material Development Support

基板伝送特性 評価

PCB High-Speed Line Measurement

高速デジタル伝送基板 評価支援
High-speed PCB Evaluate Support

実機実装基板 製造開発
PCB Assembly Manufacturing

✔
✔

設計／解析

基板
分析

熱応力解析

Electronics Cooling

信頼性試験

S-ParaMeasureProcessCondition

PCB
Analysis

Reliability
Test

✔
✔
✔

✔

✔

✔

✔
✔

✔

Performance
Evaluation✔

S-parameter Measure

セミオートプローバー

ベクトルネットワークアナライザ

Thermal Stress

特性評価

伝送線路特性測定

Dk/Df & Interface Conductivity

熱流体解析High Speed Line S-Parameter

✔

加工条件

比誘電率／誘電正接・界面導電率PCB Design/Simulation

伝送線路Sパラメータ解析

伝送特性

Semi-Auto Probe Station

Vector Network Analyzer

FETFETPCB

Cu-InlayHeat-Sink

Circuit Simulation

PCB

Cu-Inlay

FullStacked
Via

Heat-Sink

Cu-Inlay PCB

12Layer AnyLayer PCB

RFプローブ

平衡型円板共振器

RF Probe

BCDR Fixture

機能集積配線板 製造

加工条件

Integrated Printed Subsystem Boards Manufacturing

高周波材料基板
High-Speed Material PCB

FC-BGA基板
FC-BGA Substrate

めっき接続部品内蔵基板

Laser-Attachment Embedding PCB

Pre Solder
LVH

1005R
0603C

LCP

IVH

8Layer HDI PCB

8Layer PTH PCB

はんだ接続部品内蔵基板

Core
0603C
HDI Layer
8Layer HDI PCB

4Layer HDI PCB

0603C

LVH

アイ・ダイヤグラム

Stack-up: 8Layer HDI（3-2-3）
Design：Layer to Layer 50μm
Material: FR-4Pre-condition: Baking 130℃ x 3H
Test condition: 85℃/85%/DC50V

電源インピーダンス

Eye Diagram

Without Back-Drill
PTH

Back-Drill

Temperature Humidity Bias Test

EDX元素分析
EDX Analysis

FT-IR分析

FT-IR Analysis

Embedding PCB

特性評価

With Back-Drill

イオンマイグレーション試験

Memory Package

X-section
Analysis

0603R

Performance Evaluation

PTH
RT 12ps/32Gbps/PRBS7

S21 Insertion Loss

GND-Impedance<X-ray> <X-section>

Stack-up: 12Layer AnyLayer
Material: Low-k FR-4
Pre-condition: 260℃ Reflow x 6pass
Test condition: -55℃ ⇔ 150℃

X-ray

断面解析

0603R

Reliability Test

冷熱衝撃試験

X線分析

Via Formation

PTH

信頼性試験
Temperature Cycling Test

PCB Analysis

ビア形成

Solder-Attachment Embedding PCB
IVH
LVH

MOSFET Bare Chip
PTFE

基板分析

Process Condition

FET表面温度（内蔵基板）FET Temperature（FET Embedding）

Source/Gate SideFET Bare Die

MLCC

FET表面温度（銅インレイ基板）
FET Temperature（Cu-Inlay）

CCL
Drain SideFET

FET Embedding Substrate
Source

MLCC
Grease６Layer HDI PCB
MLCC Embedding

６Layer HDI PCB
Normal SubstrateGate

FET Bare Die

Drain

Heat sink

Z11 ImpedancePower Device Structure

Drain: Micro Via

Parameter

ViaCavity

Applied Curt./Volt

20A / 4V

Cu Layer

Thickness 105μm

Grease Layer

Thickness 500μm
Thermal Cond. 16W/m・K

Drain Via Type

Micro Via Cavity Via

Drain Via Area

7%

93%

Cu Surface Temp.

109.8℃

99.5℃

PTH

FET on Substrate
FET

CuInlay
Cu-Inlay

FET Surface Temperature
ー CCL
ー PTH
ー Cu-Inlay φ6mm

Drain: Cavity Via

Temperature Distribution

PCB

FET Assʼy Area Assembly Structure