QF
N20HV

SOT917-4

plastic thermal enhanced very thin quad flat package; noleads; 20 terminals; body 4 mm x 4 mm x 0.85 mm
3 April 2017

Package information

1. Package summary
Terminal position code

Q (quad)Package type descriptive code

HVQFN

Package type industry code

HVQFN20

Package style descriptive code

HVQFN (thermal enhanced very thin quadflatpack; no leads)

Package body material typeP (plastic)

Mounting method typeS (surface mount)

Issue date

7-11-2014

Manufacturer package code

SOT917

Table 1. Package summarySymbol

Parameter

MinTypNomMax

UnitDpackage length

3.9-44.1mmEpackage width

3.9-44.1mmA

seated height

0.8-

0.851mmenominal pitch--

0.5-mmn2

actual quantity of termination

--

20-

SOT917-4

NXP Semiconductors

plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 4 mm x 4 mm x 0.85mm

2. Package outline
HVQFN20: plastic thermal enhanced very thin quad flat package; no leads;
20 terminals; body 4 x 4 x 0.85 mm

BDSOT917-4Aterminal 1
index area
AE

A1

c

detail X

e1ev
w

b610

CC A BCy1 CyL511eEh1

e2

15

terminal 1
index area

20

X16

Dh05 mmscale

Dimensions
bc

D(1)

DhE(1)

Ehee1

e2

Lv

w

max 1.00 0.05 0.30
nom 0.85
0.25
min 0.80
0.20

0.2

4.1
4.0
3.9

3.0
2.9
2.8

4.1
4.0
3.9

3.0
2.9
2.8

0.5

22

0.35
0.30
0.25

0.1

0.05 0.08

UnitmmAA1

yy10.1

Note1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
Outlineversion
SOT917-4

Fig. 1.

References
IECJEDEC

JEITA

MO-220---sot917-4_po

Europeanprojection

Issue date
14-10-27
14-11-07

Package outline HVQFN20 (SOT917-4)

SOT917-4

Package information

All information provided in this document is subject to legal disclaimers.

3 April 2017

© NXP Semiconductors N.V. 2017. All rights reserved

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SOT917-4

NXP Semiconductors

plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 4 mm x 4 mm x 0.85
mm3. Soldering
Footprint information for reflow soldering of HVQFN20 package

SOT917-4

HxGx
DP

0.105

0.125

CnSPx

SPxHy

SPy totSPyGynSPy
SLyByAy

SPx totXSLx

0.22

Bx

0.27

Ax
Recommended stencil thickness: 0.1 mm
0.85 0.9

solder landsolder land plus solder paste

solder paste deposit

solder resist

occupied area

Dimensions in mm

detail X

Dimensions (mm are the original dimensions)
PAx

0.5

5.1

Issue dateFig. 2.

AyBx

ByCDSLx

SLy SPx tot SPy tot SPx

SPyGxGyHxHynSPx

nSPy

5.1

3.4

3.4

0.85

0.27

2.8

2.8

0.7

4.3

4.3

5.35

5.35

22

1.8

1.8

0.7

15-01-26
16-07-18

sot917-4_fr

Reflow soldering footprint for HVQFN20 (SOT917-4)

SOT917-4

Package information

All information provided in this document is subject to legal disclaimers.

3 April 2017

© NXP Semiconductors N.V. 2017. All rights reserved

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SOT917-4

NXP Semiconductors

plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 4 mm x 4 mm x 0.85mm4. Legal information
Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for theconsequences of use of such information. NXP Semiconductors takes noresponsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removalor replacement of any products or rework charges) whether or not suchdamages are based on tort (including negligence), warranty, breach ofcontract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordancewith the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right tomake changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.

SOT917-4

Package information

All information provided in this document is subject to legal disclaimers.

3 April 2017

© NXP Semiconductors N.V. 2017. All rights reserved

4/5

SOT917-4

NXP Semiconductors

plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 4 mm x 4 mm x 0.85mm

5. Contents
1. Package summary........................................................ 1
2. Package outline............................................................ 2
3. Soldering....................................................................... 3
4. Legal information......................................................... 4© NXP Semiconductors N.V. 2017. All rights reserved

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 3 April 2017

SOT917-4

Package information

All information provided in this document is subject to legal disclaimers.

3 April 2017

© NXP Semiconductors N.V. 2017. All rights reserved

5/5