MCP960X/L0X/RL0X
Thermocouple EMF to Temperature Converter,±1.5°C Maximum Accuracy
Features

Description• Thermocouple Electromotive Force (EMF) to °C
Converter:- Integrated cold-junction compensation- Integrated thermocouple open-circuit andshort-circuit detection (MCP9601/L01/RL01)• Supported Types (designated by NIST ITS-90):- Type K, J, T, N, S, E, B and R• Sensor Accuracy for Thermocouple Hot-Junction:- MCP9600/01 ±0.5°C/±1.5°C (typ./max.)- MCP96L00/L01 ±2.0°C/±4.0°C (typ./max.)- MCP96RL00/RL01 ±4.0°C/±8.0°C (typ./max.)• Measurement Resolution:- Hot and cold-junctions: +0.0625°C (typical)• Four Programmable Temperature Alert Outputs:- Monitor hot or cold-junction temperatures- Detect rising or falling temperatures- Up to 255°C of programmable hysteresis• Programmable Digital Filter for Temperature• Low Power:- Shutdown mode
- Burst mode: 1 to 128 temperature samples• Two-Wire Interface: I2C Compatible, 100 kHz:- Supports eight devices per I2C Bus• Operating Voltage Range: 2.7V to 5.5V
• Operating Current: 300 µA (typical)• Shutdown Current: 2 µA (typical)• Package: 20-Lead MQFN

The Microchip Technology Inc. MCP960X/L0X/RL0X
converts thermocouple EMF to degree Celsius withintegrated
cold-junction
compensation.
The
temperature correction coefficients are derived fromthe National Institute of Standards and Technology(NIST) ITS-90 Thermocouple Database. The
MCP9600/01 corrects the thermocouple nonlinear
error characteristics of eight thermocouple types andoutputs ±0.5°C/±1.5°C (Typ./Max.).

Typical Applications• Petrochemical Thermal Management• Hand-Held Measurement Equipment• Industrial Equipment Thermal Management• Commercial and Industrial Ovens• Industrial Engine Thermal Monitor• Temperature Detection Racks

The MCP960X/L0X/RL0X digital Thermocouple
temperature converter comes with user-programmableregisters which provide design flexibility for various
temperature sensing applications. The registers allow
user-selectable settings, such as Low-Power modes
for battery powered applications, adjustable digital filter
for fast transient temperatures and four individuallyprogrammable temperature alert outputs which can beused to detect multiple temperature zones.
In addition, the MCP9601/L01/RL01 family provides
integrated thermocouple open-circuit and short-circuit
detection features. An alert signal is asserted when thethermocouple wire is broken or disconnected. Similarly,
alert signal is asserted when the thermocouple isshorted to ground or power.
The temperature alert limits have multiple
user-programmable configurations, such as alert
polarity as either an active-low or active-high push-pull
output, and output function as a Comparator mode
(useful for thermostat-type operation) or Interrupt mode
for microprocessor-based systems. In addition, thealerts can detect either a rising or a falling temperature
with up to +255°C hysteresis.
This sensor uses an industry standard two-wire, I2C
compatible serial interface and supports up to eightdevices per bus by setting the device address using the
ADDR pin.
VDD

VIN+

2

I C
MCU

4
Alert

MCP9600/L00/RL00

ADDR

GND

TC+
TC-

VIN-

Types K, J, T,
N, E, B, S, R

 2015-2021 Microchip Technology Inc.

DS20005426G-page 1

MCP960X/L0X/RL0X

20 19 18 17 16
15 Alert 4

GND 1

VIN+ 214 Alert 3

VIN+ 2

EP
21

ADDR

GND

GND

20 19 18 17 16

GND 1
GND 3

SCL

5 mm × 5 mm MQFN*

SDA

MCP9601/L01/RL01

ADDR

GND

GND

5 mm × 5 mm MQFN*

SCL

MCP9600/L00/RL00

SDA

Package Types

15 Alert 4
14 Alert 3EP
21

11 Alert 1

GND 5

11 Alert 1
7

8

9 10
OC Alert

GND

6

VDD

9 10

VSENSE8

13 GNDSC Alert

7

GND

6

GND

12 Alert 2

GND 5
VDD

VIN- 4GND

GND 3

12 Alert 2

GND

13 GND

VIN- 4* Includes Exposed Thermal Pad (EP); see Table 3-1.

MCP960X/L0X/RL0X Block Diagram
ADC Core+

User Registers

VIN+
Del Sig

Thermocouple Hot-Junction TH

VINError Correction

Junctions Delta Temperature T'

Thermocouple Cold-Junction TC
Digital Filter
Thermocouple
Type Selection

Sensor 6WDWXV
Sensor Configuration
Resolution & Power Modes

VSENSE
Alert Configuration
Open-Circuit &Short-Circuit
Detection

Alert Limits

Alert 1 Output
Alert 2 Output
Alert 3 Output

Hysteresis

Alert 4 Output

Open-Circuit Alert
Device ID

Short-Circuit Alert
MCP9601/L01/RL01
Only

SCL
I2C Module

SDA
ADDR

 2015-2021 Microchip Technology Inc.

DS20005426G-page 2

MCP960X/L0X/RL0X
1.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings †VDD............................................................................................................................................................................ 6.0V
Voltage at All Input/Output Pins ........................................................................................................ GND – 0.3V to 6.0V
Storage Temperature ..............................................................................................................................-65°C to +150°C
Ambient Temperature with Power Applied ..............................................................................................-40°C to +125°C
Junction Temperature (TJ)..................................................................................................................................... +150°C
ESD Protection on All Pins (HBM:MM) .......................................................................................................... (4 kV:300V)
Latch-up Current at Each Pin............................................................................................................................. ±100 mA† Notice: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This isa stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.

DC CHARACTERISTICSElectrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA = -40°C to +125°C(where: TA = TC, defined as Device Ambient Temperature).
Parameters

Sym.

Min.

Typ.

Max.

Unit

Conditions

Thermocouple Sensor Measurement Accuracy – MCP9600/01
TH Hot-Junction Accuracy (VDD = 3.3V)
TH = TC + TΔ (Note 1)

TH_ACYTC Cold-Junction Accuracy (VDD = 3.3V)

TC_ACY

-1.5

±0.5

+1.5

-3.0

±1

+3.0

-1.0

±0.5

+1.0

-2.0

±1

+2.0

±0.25

+0.5

°C
°C

TA = 0°C to +85°C
TA = -40°C to +125°C
TA = 0°C to +85°C
TA = -40°C to +125°C

TΔ Junctions Temperature Delta Accuracy – MCP9600/01
Type K: TΔ = -200°C to +1372°C
VEMF Range: -5.907 mV to 54.886 mV

TΔ_ACY-0.5°C

TA = 0°C to +85°C,
VDD = 3.3V (Note 2)

Type J: TΔ = -150°C to +1200°C
VEMF Range: -3.336 mV to 47.476 mV
Type T: TΔ = -200°C to +400°C
VEMF Range: -5.603 mV to 20.81 mV
Type N: TΔ = -150°C to +1300°C
VEMF Range: -3.336 mV to 47.476 mV
Type E: TΔ = -200°C to +1000°C
VEMF Range: -8.825 mV to 76.298 mVType S: TΔ = 250°C to +1664°C
VEMF Range: -1.875 mV to 17.529 mV
Type B: TΔ = 1000°C to +1800°C
VEMF Range: -4.834 mV to 13.591 mV

TA = 0°C to +85°C,
VDD = 3.3V
(Notes 2, 3)

Type R: TΔ = 250°C to +1664°C
VEMF Range: -1.923 mV to 19.732 mV
Note 1:
2:
3:

4:
5:

The TC and T summation is implemented in milli-volt (mV) domain. The result, TH (mV), is converted to
Degree Celsius using the NIST ITS-90 Conversion database.
The T_ACY temperature accuracy specification is defined as the device accuracy to the NIST ITS-90
Thermocouple EMF to Degree Celsius Conversion Database with TC = 0°C.
The device measures temperature below the specified range, however, the sensitivity to changes intemperature reduces exponentially. Type R and S measure down to -50°C, or -0.226 mVEMF and-0.235 mVEMF, respectively. Type B measures down to 500°C or 1.242 mVEMF (seeFigures 2-7, 2-8, 2-10, 2-11, 2-14 and 2-17).
Exceeding the VIN_CM input range may cause leakage current through the ESD protection diodes at thethermocouple input pins. This parameter is characterized but not production tested.
The Minimum and Maximum %VDD thresholds are characterized but not production tested.

 2015-2021 Microchip Technology Inc.

DS20005426G-page 3

MCP960X/L0X/RL0X
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA = -40°C to +125°C(where: TA = TC, defined as Device Ambient Temperature).
Parameters

Sym.

Min.

Typ.

Max.

Unit

Conditions

Thermocouple Sensor Measurement Accuracy – MCP96L00/L01
TH Hot-Junction Accuracy (VDD = 3.3V)
TH = TC + TΔ (Note 1)

TH_ACYTC Cold-Junction Accuracy (VDD = 3.3V)

TC_ACY

-4.0

±2

+4.0

-6.0

±4

+6.0

-1.0

±0.5

+1.0

-2.0

±1

+2.0

±1.5

+3.0

°C
°C

TA = 0°C to +85°C
TA = -40°C to +125°C
TA = 0°C to +85°C
TA = -40°C to +125°C

TΔ Junctions Temperature Delta Accuracy – MCP96L00/L01
Type K: TΔ = -200°C to +1372°C
VEMF Range: -5.907 mV to 54.886 mV

TΔ_ACY-3.0°C

TA = 0°C to +85°C,
VDD = 3.3V (Note 2)

Type J: TΔ = -150°C to +1200°C
VEMF Range: -3.336 mV to 47.476 mV
Type T: TΔ = -200°C to +400°C
VEMF Range: -5.603 mV to 20.81 mV
Type N: TΔ = -150°C to +1300°C
VEMF Range: -3.336 mV to 47.476 mV
Type E: TΔ = -200°C to +1000°C
VEMF Range: -8.825 mV to 76.298 mVType S: TΔ = 250°C to +1664°C
VEMF Range: -1.875 mV to 17.529 mV
Type B: TΔ = 1000°C to +1800°C
VEMF Range: -4.834 mV to 13.591 mV

TA = 0°C to +85°C
VDD = 3.3V
(Notes 2, 3)

Type R: TΔ = 250°C to +1664°C
VEMF Range: -1.923 mV to 19.732 mV
Note 1:
2:
3:

4:
5:

The TC and T summation is implemented in milli-volt (mV) domain. The result, TH (mV), is converted to
Degree Celsius using the NIST ITS-90 Conversion database.
The T_ACY temperature accuracy specification is defined as the device accuracy to the NIST ITS-90
Thermocouple EMF to Degree Celsius Conversion Database with TC = 0°C.
The device measures temperature below the specified range, however, the sensitivity to changes intemperature reduces exponentially. Type R and S measure down to -50°C, or -0.226 mVEMF and-0.235 mVEMF, respectively. Type B measures down to 500°C or 1.242 mVEMF (seeFigures 2-7, 2-8, 2-10, 2-11, 2-14 and 2-17).
Exceeding the VIN_CM input range may cause leakage current through the ESD protection diodes at thethermocouple input pins. This parameter is characterized but not production tested.
The Minimum and Maximum %VDD thresholds are characterized but not production tested.

 2015-2021 Microchip Technology Inc.

DS20005426G-page 4

MCP960X/L0X/RL0X
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA = -40°C to +125°C(where: TA = TC, defined as Device Ambient Temperature).
Parameters

Sym.

Min.

Typ.

Max.

Unit

Conditions

Thermocouple Sensor Measurement Accuracy – MCP96RL00/01
TH Hot-Junction Accuracy (VDD = 3.3V)
TH = TC + TΔ (Note 1)

TH_ACYTC Cold-Junction Accuracy (VDD = 3.3V)

TC_ACY

-8.0

±4

+8.0

-10.0

±6

+10.0

-2.0

±1

+2.0

°C

TA = -40°C to +125°C

±3.0

+6.0

°C

TA = 0°C to +85°C,
VDD = 3.3V (Note 2)°C

TA = 0°C to +85°C
TA = -40°C to +125°C

TΔ Junctions Temperature Delta Accuracy – MCP96RL00/01
Type K: TΔ = -200°C to +1372°C
VEMF Range: -5.907 mV to 54.886 mV

TΔ_ACY-6.0

Type J: TΔ = -150°C to +1200°C
VEMF Range: -3.336 mV to 47.476 mV
Type T: TΔ = -200°C to +400°C
VEMF Range: -5.603 mV to 20.81 mV
Type N: TΔ = -150°C to +1300°C
VEMF Range: -3.336 mV to 47.476 mV
Type E: TΔ = -200°C to +1000°C
VEMF Range: -8.825 mV to 76.298 mVType S: TΔ = 250°C to +1664°C
VEMF Range: -1.875 mV to 17.529 mV
Type B: TΔ = 1000°C to +1800°C
VEMF Range: -4.834 mV to 13.591 mV

TA = 0°C to +85°C,
VDD = 3.3V
(Notes 2, 3)

Type R: TΔ = 250°C to +1664°C
VEMF Range: -1.923 mV to 19.732 mV
Note 1:
2:
3:

4:
5:

The TC and T summation is implemented in milli-volt (mV) domain. The result, TH (mV), is converted to
Degree Celsius using the NIST ITS-90 Conversion database.
The T_ACY temperature accuracy specification is defined as the device accuracy to the NIST ITS-90
Thermocouple EMF to Degree Celsius Conversion Database with TC = 0°C.
The device measures temperature below the specified range, however, the sensitivity to changes intemperature reduces exponentially. Type R and S measure down to -50°C, or -0.226 mVEMF and-0.235 mVEMF, respectively. Type B measures down to 500°C or 1.242 mVEMF (seeFigures 2-7, 2-8, 2-10, 2-11, 2-14 and 2-17).
Exceeding the VIN_CM input range may cause leakage current through the ESD protection diodes at thethermocouple input pins. This parameter is characterized but not production tested.
The Minimum and Maximum %VDD thresholds are characterized but not production tested.

 2015-2021 Microchip Technology Inc.

DS20005426G-page 5

MCP960X/L0X/RL0X
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA = -40°C to +125°C(where: TA = TC, defined as Device Ambient Temperature).
Parameters

Sym.

Min.

Typ.

Max.

Unit

Conditions

TC and TH Temperature Resolution

TRES

—

±0.0625—°C

With max. resolution

Sampling Rate (TA = +25°C)

tCONV

—

320

—

—

80

—

—

20

—

—

5

—

tCALC

—

12

—

ms

Offset Error

VOERR

—

±2

—

µV

Offset Error Drift

VOE_DR

—

50

—

nV/°C

Full-Scale Gain Error — MCP9600/01

GERR

Sensor Characteristics

Temperature Calculation Time

18-bit resolution
ms

16-bit resolution
14-bit resolution
12-bit resolution
TA = +25°C

Thermocouple Input

Full-Scale Gain Error — MCP96L00/L01
Full-Scale Gain Error —MCP96RL00/RL01
Full-Scale Gain Error Drift

GER_DR

—

—

±0.04

—

±0.12

—

TA = 0°C to +85°C

—

±0.24

—

—

±0.01

—

%FS

%FS TA = -40°C to +125°C

Full-Scale Integral Nonlinearity

INL

—

10

—

ppm

Voltage Resolution

VRES

—

2

—

µV

18-bit resolution
ADC input range

Differential Mode Range

VIN_DF

-250

—

+250

mV

Differential Mode Impedance

ZIN_DF

—

300

—

k

Common-Mode Range

VIN_CM VDD – 0.3—

VDD + 0.3

V

Common-Mode Impedance

ZIN_CM

—

25

—

M

Common-Mode Rejection Ratio

CMRR

—

105

—

dB

Power Supply Rejection Ratio

PSRR

—

60

—

dB

Line Regulation

VLine_R

—

0.2

—

°C/V

Note 4

Voltage Sense Input (VSENSE) for Thermocouple Open and Short-Circuit Detection (MCP9601/L01/RL01)
VSENSE Input Range (Note 5)

VSiRNG

0—100- Short Circuit to VDD

VSiSC

90

—

100

0

—

10

- Short Circuit to GND(see Figure 1-1)
SC Alert Asserts%VDD- Open-Circuit

VSiOC

19

—

50

OC Alert Asserts- Normal Operation

VSiNOR

10—

19

OC Alert Deasserts

VSENSE Input Leakage

ISiLEAK—

0.1

1

Note 1:
2:
3:

4:
5:

µA

The TC and T summation is implemented in milli-volt (mV) domain. The result, TH (mV), is converted to
Degree Celsius using the NIST ITS-90 Conversion database.
The T_ACY temperature accuracy specification is defined as the device accuracy to the NIST ITS-90
Thermocouple EMF to Degree Celsius Conversion Database with TC = 0°C.
The device measures temperature below the specified range, however, the sensitivity to changes intemperature reduces exponentially. Type R and S measure down to -50°C, or -0.226 mVEMF and-0.235 mVEMF, respectively. Type B measures down to 500°C or 1.242 mVEMF (seeFigures 2-7, 2-8, 2-10, 2-11, 2-14 and 2-17).
Exceeding the VIN_CM input range may cause leakage current through the ESD protection diodes at thethermocouple input pins. This parameter is characterized but not production tested.
The Minimum and Maximum %VDD thresholds are characterized but not production tested.

 2015-2021 Microchip Technology Inc.

DS20005426G-page 6

MCP960X/L0X/RL0X
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA = -40°C to +125°C(where: TA = TC, defined as Device Ambient Temperature).
Parameters

Sym.

Min.

Typ.

Max.

Unit

Conditions

Alert 1, 2, 3, 4 Outputs, SC Alert and OC Alert Outputs (MCP9601/L01/RL01)
Low-Level Voltage

VOL

—

—

0.4

V

IOL= 3 mA

VOH

VDD – 0.5——

V

IOH= 3 mA

Operating Voltage

VDD

2.7

—

5.5

V

I2C Inactive Current

IDD

—

0.3

0.5

mA

High-Level Voltage
Operating Voltage and Current

I2

C Active Current or During tCALC

VDD = 3.3V,
TA = +85°C

—

1.5

2.5

mA

Shutdown Current

ISHDN

—

2

5

µA

I2C inactive,
TA = +85°C

Power-on Reset (POR) Thresholds

VPOR

1.0

2.1

2.6

V

Rising/Falling VDDPower-up Time

tPOR

—

20

—

ms

tRSP

—

3

—

s

Thermal Response
Package Thermal Response(Time to 63% of Final Temperature)

2:
3:

4:
5:

The TC and T summation is implemented in milli-volt (mV) domain. The result, TH (mV), is converted to
Degree Celsius using the NIST ITS-90 Conversion database.
The T_ACY temperature accuracy specification is defined as the device accuracy to the NIST ITS-90
Thermocouple EMF to Degree Celsius Conversion Database with TC = 0°C.
The device measures temperature below the specified range, however, the sensitivity to changes intemperature reduces exponentially. Type R and S measure down to -50°C, or -0.226 mVEMF and-0.235 mVEMF, respectively. Type B measures down to 500°C or 1.242 mVEMF (seeFigures 2-7, 2-8, 2-10, 2-11, 2-14 and 2-17).
Exceeding the VIN_CM input range may cause leakage current through the ESD protection diodes at thethermocouple input pins. This parameter is characterized but not production tested.
The Minimum and Maximum %VDD thresholds are characterized but not production tested.

VDD

RA

RB

VSENSE+

VIN+
Del SigC
VIN-

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Thermocouple
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Detection Range, VSENSE /VDD (%)

Note 1:+25°C (air) to +125°C(oil bath), 2x2” PCB

100%
90%

Range for Thermocouple Short-to-VDD Detection

80%
70%

Dead Zone

60%
50%
40%
30%

Range for Thermocouple Open Circuit Detection

20%
10%
0%

Range for Normal Operation
Range for Thermocouple Short-to-GND Detection

VSENSE (V)Open and Short-Circuit Detection Configuration.

 2015-2021 Microchip Technology Inc.

DS20005426G-page 7

MCP960X/L0X/RL0X
INPUT/OUTPUT PIN DC CHARACTERISTICSElectrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA = -40°C to +125°C(where: TA = TC, defined as Device Ambient Temperature).
Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

VIH

0.7 × VDD——

V

Low-Level Voltage

VIL

—

—

0.3 × VDD

V

Input Current

ILEAK

—

—

±2

µA

Hysteresis

VHYST

—

0.05 × VDD—

V

Spike Suppression

TSP

—

50

—

ns

Low-Level Voltage

VOL

—

—

0.4

V

IOL= 3 mA

High-Level Current (leakage)

IOH

—

—

1

µA

VOH = VDD

Low-Level Current

IOL

6

—

—

mA

VOL = 0.6V

Capacitance

CIN

—

5

—

pF
V

2

Serial Input/Output and I C Address Input (ADDR)
Input (SCL, SDA, ADDR)
High-Level Voltage

VDD > 2V

Output (SDA)I2C Address Selection Levels (Note 1)
Command Byte [1100 000x]

GND

—

—

VADDR_LVADDR_TYPVADDR_H(Note 2)

(Note 2)

(Note 2)VADDR

Command Byte [1100 001x]
Command Byte [1100 010x]
Command Byte [1100 011x]

Address = 0
Address = 1
Address = 2
Address = 3

Command Byte [1100 100x]

Address = 4

Command Byte [1100 101x]

Address = 5

Command Byte [1100 110x]

Address = 6

Command Byte [1100 111x]
Note 1

2——

Address = 7

VDD

The ADDR pin can be tied to VDD or VSS. For additional addresses, a resistive divider network can beused to set voltage levels that are rationed to VDD. The device supports up to eight levels (seeSection 6.3.1 “I2C Addressing” for recommended resistor values).
VADDR_TYP = Address * VDD/8 + VDD/16,
VADDR_L = VADDR_TYP – VDD/32 andVADDR_H = VADDR_TYP + VDD/32 (where: Address = 1, 2, 3, 4, 5, 6).

TEMPERATURE CHARACTERISTICSElectrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground.
Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges
Specified Temperature Range

TA

-40

—

+125

°C

Operating Temperature Range

TA

-40

—

+125

°C

Storage Temperature Range

TA

-65

—

+150

°C

JA

—

38.8

—

°C/W

Note 1

Thermal Package Resistances
Thermal Resistance, MQFN
Note 1

Operation in this range must not cause TJ to exceed the Maximum Junction Temperature (+150°C).

 2015-2021 Microchip Technology Inc.

DS20005426G-page 8

MCP960X/L0X/RL0X
SENSOR SERIAL INTERFACE TIMING SPECIFICATIONSElectrical Specifications: Unless otherwise indicated, GND = Ground, TA = -40°C to +125°C, VDD = 2.7V to 5.5V
and CL = 80 pF (Note 1).
Parameters

Sym.

Min.

Max.

Units

2

Two-Wire I C Interface
Serial Port Frequency

fSCL

10

100

kHz

Low Clock (Note 2)

tLOW

4700

—

ns

High Clock

tHIGH

4000

—

ns

tR

—

1000

ns

Rise Time (Note 3)
Fall Time (Note 3)

tF

20

300

ns

Data in Setup Time (Note 2)

tSU:DAT

250

—

ns

Data in Hold TimetHD:DAT0—ns

Start Condition Setup TimetSU:STA

4700

—

ns

Start Condition Hold TimetHD:STA

4000

—

ns

Stop Condition Setup TimetSU:STO

4000

—

ns

Bus Idle/FreetB-FREE

10

—

µs

Cb

—

400

pf

tSTRETCH

60

—

µs

Bus Capacitive Load
Clock Stretching (Note 4)

EE

P
TO

-F
R

-S
U

tB

tL

tS

IG
H

tH

ET

I
-D
D

tH

tS

U
-D
AT
A

tR

,t

F

SD
A

SC
L

tS

TR

O
W

H
C

AC
K

D
-S

tH

tS

US

TA
RT

3
4

All values referred to VIL MAX and VIH MIN levels.
This device can be used in a Standard mode I2C bus system, but the requirement, tSU:DAT  250 ns, must
be met.
Characterized, but not production tested.
Host controllers without features to detect clock stretching by device should increase the tLOW period for
Read Commands to a minimum of tSTRETCH (60 us) for a proper I2C communication. See Figure 2-29 for atypical tSTRETCH performance.
TA
RT

Note 1
2

Start Condition

FIGURE 1-2:

Data Transmission

Stop Condition

Timing Diagram.

 2015-2021 Microchip Technology Inc.

DS20005426G-page 9

MCP960X/L0X/RL0X
NOTES:

 2015-2021 Microchip Technology Inc.

DS20005426G-page 10

MCP960X/L0X/RL0X
2.0

TYPICAL PERFORMANCE CURVESNote:

The graphs and tables provided following this note are a statistical summary based on a limited number ofsamples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore, outside the warranted range.

Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, SDA/SCL pulled-up to VDD and
TA = -40°C to +125°C.
0.500

Type K
MCP9600

Type K
MCP9600/L00/RL00

0.25

Sensitivity (''°C/LSb)

Temperature Accuracy (°C)

0.50

0.00

-0.25

-0.50
-200

300

800

1300

0.250

0.000
-200

1800

300

TA (°C)FIGURE 2-1:
Typical Temperature
Accuracy from NIST ITS-90 Database, Type K.

Sensitivity (''°C/LSb)

7HPSHUDWXUH$FFXUDF\ &













Type J
MCP9600/L00/RL00

0.250

0.000
-200



300

7$ &

FIGURE 2-2:
Typical Temperature
Accuracy from NIST ITS-90 Database, Type J.

800
TA (°C)

1300

1800

FIGURE 2-5:
Temperature Sensitivity with
18-Bit Resolution, Type J.



0.500

7\SH1
0&3



Sensitivity (''°C/LSb)

7HPSHUDWXUH$FFXUDF\ &

1800

0.500

7\SH0&3








1300

FIGURE 2-4:
Temperature Sensitivity with
18-Bit Resolution, Type K.






800
TA (°C)









7$ &

FIGURE 2-3:
Typical Temperature
Accuracy from NIST ITS-90 Database, Type N.

 2015-2021 Microchip Technology Inc.

Type N
MCP9600/L00/RL00

0.250

0.000
-200

300

800

1300

1800

TA (°C)FIGURE 2-6:
Temperature Sensitivity with
18-Bit Resolution, Type N.

DS20005426G-page 11

MCP960X/L0X/RL0X
Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, SDA/SCL pulled-up to VDD and
TA = -40°C to +125°C.
0.500

7\SH60&3



Sensitivity (''°C/LSb)

7HPSHUDWXUH$FFXUDF\ &

6SHFLILHG5DQJH














Type S
MCP9600/L00/RL00
Specified Range

0.250

0.000
-200



300

7$ &

FIGURE 2-7:
Typical Temperature
Accuracy from NIST ITS-90 Database, Type S.

Sensitivity (''°C/LSb)

7HPSHUDWXUH$FFXUDF\ &

6SHFLILHG5DQJH











Type RMCP9600/L00/RL00
Specified Range

0.250

0.000
-200



300

7$ &

FIGURE 2-8:
Typical Temperature
Accuracy from NIST ITS-90 Database, Type R.

1300

1800

0.500

Type EMCP9600

Type EMCP9600/L00/RL00

0.25

Sensitivity (''°C/LSb)

Temperature Accuracy (°C)

800
TA (°C)FIGURE 2-11:
Temperature Sensitivity with
18-Bit Resolution, Type R.

0.50

0.00

-0.25

-0.50
-200

1800

0.500

7\SH50&3




1300

FIGURE 2-10:
Temperature Sensitivity with
18-Bit Resolution, Type S.





800
TA (°C)

300

800

1300

1800

TA (°C)FIGURE 2-9:
Typical Temperature
Accuracy from NIST ITS-90 Database, Type E.

 2015-2021 Microchip Technology Inc.

0.250

0.000
-200

300

800
TA (°C)

1300

1800

FIGURE 2-12:
Temperature Sensitivity with
18-Bit Resolution, Type E.

DS20005426G-page 12

MCP960X/L0X/RL0X
Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, SDA/SCL pulled-up to VDD and
TA = -40°C to +125°C.
0.500

Type T
MCP9600

0.25

Sensitivity (''°C/LSb)

Temperature Accuracy (°C)

0.50

0.00

-0.25

-0.50
-200

300

800

1300

Type T
MCP9600/L00/RL00

0.250

0.000
-200

1800

300

800
TA (°C)TA (°C)FIGURE 2-13:
Typical Temperature
Accuracy from NIST ITS-90 Database, Type T.

Sensitivity (''°C/LSb)

Temperature Accuracy (°C)

0.500Type B
MCP9600
Specified Range

0.00

-0.25

-0.50
-200

300

800

1300

Type B
MCP9600/L00/RL00

Specified Range

0.250

0.000
-200

1800

300

TA (°C)FIGURE 2-14:
Typical Temperature
Accuracy from NIST ITS-90 Database, Type B.

800
TA (°C)

1300

1800

FIGURE 2-17:
Temperature Sensitivity with
18-Bit Resolution, Type B.
0.4

10Gain Error (% of FSR)

MCP9600

Offset Error (μV)

1800

FIGURE 2-16:
Temperature Sensitivity with
18-Bit Resolution, Type T.

0.50

0.25

1300

5

0

-5

-10

VDD = 3.3V
MCP9600

0.3
0.2
0.1
0
-0.1
-0.2
-0.3
-0.4

-40

-20

0

20

40

60

80

100

120

-40

-20

Temperature (°C)

FIGURE 2-15:(VIN+, VIN-).

Input Offset Error Voltage

 2015-2021 Microchip Technology Inc.

0

20

40

60

80

100 120

Temperature (°C)

FIGURE 2-18:

Full-Scale Gain Error.

DS20005426G-page 13

MCP960X/L0X/RL0X
Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, SDA/SCL pulled-up to VDD and
TA = -40°C to +125°C.
0.005
Integral Nonlinearity (% of FSR)

10.0
TA = +25°C

5.0

2.5

0.0
-100

-75

-50 -2502550Input Voltage (% of Full-Scale)

FIGURE 2-19:75

Input Noise,% of Full Scale.

0.001
0.000




2FFXUUHQFHV


9
$YHUDJH

3.0

FIGURE 2-22:
VDD.

9'' 9
XQLWVDW&&&XQLWVDWRWKHUWHPSHUDWXUHV6SHF /LPLW

3.5
4.0
VDD (V)

4.5

5.0

5.5

Integral Nonlinearity Across

7$ &WR&9'' 9XQLWV

0&3



6WG'HY
6WGHY

6WGHY
6WG'HY

FIGURE 2-20:
Cold-Junction Sensor
Temperature Accuracy.
400

300













7HPSHUDWXUH$FFXUDF\ &

FIGURE 2-23:
Cold-Junction Sensor
Temperature Accuracy Distribution.

T-40C
A = -40°C
35C
TA = +35°C
85C
TA = +85°C
125C
TA = +125°C

SDA, and Alert 1, 2, 3, 4 outputs










  7ǻ 7HPSHUDWXUH,76'DWDEDVH &

200

500

T-40C
A = -40°C
35C
TA = +35°C
85C
TA = +85°C
125C
TA = +125°C

Alert 1, 2, 3, 4 outputs

400
VDD - VOH (μA)











7ǻB$&< &

0.002

2.5



VOL (μA)

0.003

100


0&3

0.004



Noise (μV, rms)

7.5

300

200

100

100

0
2.5

3.0

FIGURE 2-21:
Across VDD.

3.5

4.0
VDD (V)

4.5

5.0

5.5

SDA and Alert Outputs, VOL 2015-2021 Microchip Technology Inc.

2.5

3.0

FIGURE 2-24:
VDD.

3.5
4.0
VDD (V)

4.5

5.0

5.5

Alert Outputs, VOH AcrossDS20005426G-page 14

MCP960X/L0X/RL0X
Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, SDA/SCL pulled-up to VDD and
TA = -40°C to +125°C.
500

2.0

400

85C
TA = +85°C

300

TA = +125°C
125C

1.0

TA = -40°C-40C
35C
TA = +35°C
85C
TA = + 85°C
125C
TA = +125°C

200

100
2.5

3.0

3.5

4.0
VDD (V)

4.5

5.0

0.0
2.5

5.5

I2C Inactive, IDD Across VDD.

FIGURE 2-25:-40C
TA = -40°C
35C
TA = +35°C
85C
TA = + 85°C
125C
TA = +125°C

1500

1000

3.5

4.0
VDD (V)

4.5

5.0

5.5

T-40C
A = -40°C
TA = +35°C
35C
85C
TA = +85°C
125C
TA = +125°C

40.0
tSTRETCH (μs)

2000

3.0

FIGURE 2-28:
SDA, SCL and ADDR Input
Pins Leakage Current, ILEAK Across VDD.
60.0

2500

I2C Active, IDD (μA)

T-40C
A = -40°C
35C
TA = +35°C

ILEAK (μA)

I2C Inactive, IDD (μA)

ADDR/SDA/SCL pins

20.0

0.0

500
2.5

3.0

FIGURE 2-26:



3.5
4.0
VDD (V)

4.5

5.0

2.5

5.5

I2C Active, IDD Across VDD.

2.0%

ΔtCALC (%)

1.0%,6+'1 $




3.5
4.0
VDD (V)

4.5

5.5

Conditions:tCALC = 12 ms (typical)
VDD = 3.3V
TA = Room Temperature

0.0%
-40C
TA = -40°C
35C
TA = +35°C
85C
TA = + 85°C
125C
TA = +125°C

-1.0%



5.0

FIGURE 2-29:
I2C Interface Clock Stretch
Duration, tSTRETCH Across VDD.

&
7$ &&
7$ &&
7$ &&
7$ &



3.0

-2.0%






FIGURE 2-27:
Across VDD.




9'' 9







Shutdown Current, ISHDN 2015-2021 Microchip Technology Inc.

2.5

3.0

3.5
4.0
VDD (V)

4.5

5.0

5.5

FIGURE 2-30:
Temperature Calculation
Duration, tCALC Change Across VDD.

DS20005426G-page 15

MCP960X/L0X/RL0X
NOTES:

 2015-2021 Microchip Technology Inc.

DS20005426G-page 16

MCP960X/L0X/RL0X
3.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1:

PIN FUNCTION TABLE

MCP9600/L00/RL00 MCP9601/L01/RL01
1, 3, 5,13, 17

3.1

Symbol1, 3, 5, 13, 17

GND

Electrical Ground

2

2

VIN+

Thermocouple Positive Terminal Input

4

4

VIN-

Thermocouple Negative Terminal Input

6, 7, 9, 10, 18

10, 18GND

Not Electrical Ground; must be tied to Ground—

6

VSENSE

Thermocouple Open and Short-Circuit detection input—

7

SC Alert

8

8

VDD

Thermocouple Short-Circuit Alert Output
Power

—

9

OC Alert

Thermocouple Open-Circuit Alert Output

11

11

Alert 1

Alert Output 1

12

12Alert 2

Alert Output 2

14

14

Alert 3

Alert Output 3

15

15

Alert 4

Alert Output 4

16

16

ADDR

I2C Device Address Selection Voltage Input

19

19

SCL

I2C Clock Input

20

20

SDA

I2C Data Input

21

21

EP

Exposed Thermal Pad (EP); must be connected to GND

Ground Pin (GND)

The GND pin is the system ground pin. Pins 1, 3, 5, 13
and 17 are system ground pins and they are at thesame potential. However, pins 6, 7, 9, 10 and 18 must
be connected to ground for normal operation.

3.2

Pin Function

The Open-Circuit (OC) Alert and the Short-Circuit (SC)
Alert output are also active-high push-pull outputs(MCP9601/L01/RL01). These outputs are asserted
when Open-Circuit and Short-Circuit conditions aredetected on the VSENSE pin.

Thermocouple Input (VIN+, VIN-)

The thermocouple wires are directly connected tothese inputs. The positive node is connected to the
VIN+ pin, while the negative node connects to the VINnode. The thermocouple voltage is converted to degree
Celsius.

3.3Power Pin (VDD)

VDD is the power pin. The operating voltage range, as
specified in the DC Characteristics table, is applied on
this pin.

3.4

Push-Pull Alert Outputs(Alert 1, 2, 3, 4 and OC/SC Alert)

The Alert pins are user-programmable push-pull outputs
which can be used to detect rising or falling
temperatures. The device outputs signal when theambient temperature exceeds the user-programmed
temperature alert limit.

 2015-2021 Microchip Technology Inc.

DS20005426G-page 17

MCP960X/L0X/RL0X
3.5

I2C Address Pin (ADDR)This pin is used to set the I2C address. This pin can betied to VDD, GND, or a ratio of VDD can be selected to
set up to eight address levels using a resistive voltage
divider network.

3.6

Serial Clock Line (SCL)The SCL is a clock input pin. All communication andtiming is relative to the signal on this pin. The clock isgenerated by the host controller on the bus (seeSection 4.0 “Serial Communication”).

3.7

Serial Data Line (SDA)

SDA is a bidirectional input/output pin used to seriallytransmit data to/from the host controller. This pin
requires a pull-up resistor (see Section 4.0 “Serial
Communication”).

3.8

Thermocouple Open/Short
Detection Input (VSENSE)

The VSENSE pin is a thermocouple detection input pin(MCP9601/L01/RL01) and the voltage level on this pin
is used to determine whether the thermocouple is operating normally, shorted to VDD/VSS, or it is disconnected from the VIN+ and VIN- pins (see Figure 1-1).

 2015-2021 Microchip Technology Inc.

DS20005426G-page 18

MCP960X/L0X/RL0X
NOTES:

 2015-2021 Microchip Technology Inc.

DS20005426G-page 19

MCP960X/L0X/RL0X
4.0

SERIAL COMMUNICATION

4.1

Two-Wire Standard Mode I2C
Protocol-Compatible Interface

The MCP960X/L0X/RL0X Serial Clock Input (SCL) andthe bidirectional Serial Data Line (SDA) form a two-wirebidirectional data communication line (refer to the
Input/Output Pin DC Characteristics table andSensor Serial Interface Timing Specifications
table).
The following bus protocol has been defined:

TABLE 4-1:

MCP960X/L0X/RL0X
SERIAL BUS PROTOCOLDESCRIPTIONS

Term

Description

Host

The device that controls the serial bus,
typically a microcontroller

DeviceThe device addressed by the host,such as the MCP960X/L0X/RL0X

Transmitter Device sending data to the bus
ReceiverDevice receiving data from the bus

START

A unique signal from host to initiate
serial interface with a device

STOP

A unique signal from the host to
terminate serial interface from a device

Read/Write A read or write to the
MCP960X/L0X/RL0X registers
ACK

A receiver Acknowledges (ACK) thereception of each byte by polling the
bus

NAK

A receiver Not Acknowledges (NAK) or
releases the bus to show End-of-Data
(EOD)

Busy

Communication is not possible
because the bus is in use

Not Busy

The bus is in the Idle state, both SDA
and SCL remain highData Valid

SDA must remain stable before SCL
becomes high in order for a data bit tobe considered valid. During normal
data transfers, SDA only changes state
while SCL is low.

4.1.1

DATA TRANSFER

Data transfers are initiated by a Start condition(START), followed by a 7-bit device address and aread/write bit. An Acknowledge (ACK) from the device
confirms the reception of each byte. Each access must
be terminated by a Stop condition (STOP).

This device supports the Receive Protocol. The
register can be specified using the pointer for the initial
read. Each repeated read or receive begins with a Start
condition and address byte. The MCP960X/L0X/RL0X
retains the previously selected register. Therefore, it
outputs data from the previously-specified register(repeated pointer specification is not necessary).

4.1.2

HOST/DEVICE

The bus is controlled by a host device (typically amicrocontroller) that controls the bus access, andgenerates the Start and Stop conditions. The
MCP960X/L0X/RL0X is a device and does not control
other devices in the bus. Both host and device canoperate as either transmitter or receiver. However, thehost device determines which mode is activated.

4.1.3

START/STOP CONDITION

A high-to-low transition of the SDA line (while SCL ishigh) is the Start condition. All data transfers must be
preceded by a Start condition from the host. A
low-to-high transition of the SDA line (while SCL ishigh) signifies a Stop condition.
If a Start or Stop condition is introduced during datatransmission, the MCP960X/L0X/RL0X releases thebus. All data transfers are ended by a Stop condition
from the host.

4.1.4

ADDRESS BYTE

Following the Start condition, the host must transmit an
8-bit address byte to the MCP960X/L0X/RL0X. The
address for the MCP960X/L0X/RL0X temperature sensor
is ‘11,0,0,A2,A1,A0’ in binary, where the A2, A1 andA0 bits are set externally by connecting the corresponding
VADDR voltage levels on the ADDR pin (see the“Input/Output Pin DC Characteristics” section). The
7-bit address transmitted in the serial bit stream mustmatch the selected address for the MCP960X/L0X/RL0X
to respond with an ACK. Bit 8 in the address byte is aread/write bit. Setting this bit to ‘1’ commands a read operation, while ‘0’ commands a write operation (seeFigure 4-1).
Command Byte
SCL

1

2

3

4

SDA

1 1

0

0 A2 A1 A0

Start

5

6

7

Address

8

9
A
C
K

R/W

MCP960X/L0X/RL0X Response

FIGURE 4-1:

Device Addressing.

Repeated communication is initiated after tB-FREE.

 2015-2021 Microchip Technology Inc.

DS20005426G-page 20

MCP960X/L0X/RL0X
4.1.5

DATA VALID

After the Start condition, each bit of data intransmission needs to be settled for a time specified bytSU-DATA before SCL toggles from low-to-high (see the“Sensor Serial Interface Timing Specifications”
section).

4.1.6

ACKNOWLEDGE (ACK/NAK)

Each receiving device, when addressed, is expected togenerate an ACK bit after the reception of each byte.
The host device must generate an extra clock pulse for
ACK to be recognized.
The Acknowledging device pulls down the SDA line fortSU-DATA before the low-to-high transition of SCL fromthe host. SDA also needs to remain pulled down for
tHD-DAT after a high-to-low transition of SCL.
During read, the host must signal an End-of-Data(EOD) to the device by not generating an ACK bit(NAK) once the last bit has been clocked out of thedevice. In this case, the device will leave the data line
released to enable the host to generate the Stop condition.

4.1.7

CLOCK STRETCHING
2

During the I C read operation, this device will hold theI2C clock line low for tSTRECH after the falling edge of
the ACK signal. In order to prevent bus contention, thehost controller must release or hold the SCL line low
during this period.
Note:

If the host controller does not provide theadequate delay as specified by tSTRECH,
then the device will output the previouslytransmitted data.

In addition, the host controller must provide eight consecutive clock cycles after generating the ACK bit froma read command. This allows the device to push out
data from the SDA Output Shift registers. Missing clock
cycles could result in bus contention. At the end of one
or more data transmission, the host controller must provide the NAK bit, followed by a Stop Condition toterminate communication (see Figure 4-3).
MCP960X/L0X/RL0X Clock Stretching – tSTRETCH
7

8

A
0

R

A
C
K

1

2

3

4

5

6

7

8

x

x

x

x

x

x

x

x

A
C
K

TH MSB Data

Host

MCP960X/L0X/RL0X

FIGURE 4-2:
4.1.8

Clock Stretching.

SEQUENTIAL READ

During a sequential read, the device transmits databytes starting from the previously set Register Pointer.
The MCP960X/L0X/RL0X increments an internal
address pointer each time a byte transmission is successfully completed with an ACK bit from the host controller. Therefore, the device can sequentially output
the entire register values shown in Table 5-1 (seeFigure 4-6). A Stop Condition terminates the sequential
read.
Note:

 2015-2021 Microchip Technology Inc.

The MCP960X/L0X/RL0X does
support Sequential Write function.

not

DS20005426G-page 21

MCP960X/L0X/RL0X
1

2

3

4

5

6

7

8

1

1

0

0

A
2

A
1

A
0

W C

1

2

3

4

5

6

7

8

0

0

0

0

0

0

0

0

SCL

SDA

S

Address Byte

A
K

Pointer(Table 4-2)

Device*A
C P
KDevice*

MCP960X/L0X/RL0X Clock Stretching, tSTRETCH
1

2

3

4

5

6

7

8

1

1

0

0

A
2

A
1

A
0

R C

1

2

3

4

5

6

7

8

0

0

0

0

0

0

0

1

1

2

3

4

5

6

7

8

1

0

0

1

0

1

0

0

SCL

SDA

S

Address Byte

A
K

Device*MSB DataACK

LSB Data

Host

N
A
K

P

Host

*MCP960X/L0X/RL0X

TABLE 4-2:

POINTERS

Read-Only
Registers

Pointer

TH0000 0000

TΔ

0000 0001

TC

0000 0010

Note: this is an example pseudo routine:i2c_start();// send START commandi2c_write(b’1100 0000’);// WRITE Command// also, make sure bit 0 is cleared ‘0’i2c_write(b’0000 00XX’);// Write TH, TΔ, or TC registers

i2c_stop();// send STOP commandi2c_start();// send START commandi2c_write(b’1100 0001’);// READ Command// also, make sure bit 0 is set ‘1’
UpperByte = i2c_read(ACK);// READ 8 bits (with tSTRETCH delay)// and Send ACK bit
LowerByte = i2c_read(NAK);// READ 8 bits (with tSTRETCH delay)// and Send NAK bit
i2c_stop();// send STOP command//Convert the temperature dataif ((UpperByte & 0x80) == 0x80){//Temperature  0°C

Temperature = (UpperByte x 16 + LowerByte / 16) - 4096;}else//Temperature  0°C

Temperature = (UpperByte x 16 + LowerByte / 16);//TH, TD, or TC Temperature (°C) depending on the register pointer value shown in Table 4-2.

FIGURE 4-3:

Timing Diagram to Set a Register Pointer and Read a Two-Byte Data.

 2015-2021 Microchip Technology Inc.

DS20005426G-page 22

MCP960X/L0X/RL0X
1

2

3

4

5

6

7

8

1

1

0

0

A
2

A
1

A W
0

1

2

3

4

5

6

7

8

0

0

0

0

0

1

0

1

1

2

3

4

5

6

7

8

x

x

x

x

x

x

x

x

SCL

SDA

S

A
C
K

Configuration(Table 4-3)

Device*Address Byte

A
CK

Device*A
C
KPRegister Data

MCP960X/L0X/RL0X Clock Stretching, tSTRETCH
1

2

3

4

5

6

7

8

1

1

1

0

A
0 A A A R C
2 1 0
K

2

3

4

5

6

7

8

x x

x

x

x

x

x

N
x A P
K

SCL

SDA

S

Address Byte

TABLE 4-3:

Device*POINTERS

Read/Write
Registers

Pointer

STATUS

0000 0100

Configuration

Host

LSB Data*MCP960X/L0X/RL0X

0000 0101
0000 0110

Note: this is an example pseudo routine:i2c_start();// send START commandi2c_write(b’1100 0000’);// WRITE Command// also, make sure bit 0 is cleared ‘0’i2c_write(b’0000 0101’);// Write Status or Configuration registers

i2c_write(b’XXXX XXXX’);// Write register data

i2c_stop();// send STOP commandi2c_start();// send START commandi2c_write(b’1100 0001’);// READ Command// also, make sure bit 0 is set ‘1’
Data = i2c_read(NAK);// READ 8 bits (with tSTRETCH delay)// and Send NAK bit
i2c_stop();

FIGURE 4-4:// send STOP command

Timing Diagram to Set a Register Pointer, Write One Byte, and Read the Data.

 2015-2021 Microchip Technology Inc.

DS20005426G-page 23

MCP960X/L0X/RL0X
1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

1

1

0

0

A
2

A
1

A
A W C
0
K

0

0

0

1

0

0

0

0

1

2

3

4

5

6

7

8

x

x

x

x

x

x

x

x

SCL

SDA

S

Device*Address Byte

A
CK

Device*Alert 1 MSB

Device*Alert Limit 1(Table 4-4)

A
C
K

1

2

3

4

5

6

7

8

x

x

x

x

x

x

x

x

A
C P
K

Device*Alert 1 LSB
MCP960X/L0X/RL0X Clock Stretching, tSTRETCH
1

2

3

4

5

6

7

8

1

1

0

0

A
2

A
1

A
0

R C

1

2

3

4

5

6

7

8

x

x

x

x

x

x

x

x

1

2

3

4

5

6

7

8

x

x

x

x

x

x

x

x

SCL

SDA

S

Address Byte

TABLE 4-4:

AK

Device*Alert 1 MSB

ACKPointer

Alert 10001 0000

Alert 20001 0001

Alert 30001 0010

Alert 40001 0011

P

Host*MCP960X/L0X/RL0X

POINTERS

Alert Limit
Registers

Alert 1 LSB

Host

N
A
K

Note: this is an example pseudo routine:i2c_start();// send START commandi2c_write(b’1100 0000’);//WRITE Command//also, make sure bit 0 is cleared ‘0’i2c_write(b’0001 00XX’);// Write Alert registers

i2c_write(b’XXXX XXXX’);// Write register Upper Byte

i2c_write(b’XXXX XXXX’);// Write register Lower Byte

i2c_stop();// send STOP commandi2c_start();// send START commandi2c_write(b’1100 0001’);//READ Command//also, make sure bit 0 is set ‘1’
UpperByte = i2c_read(ACK);// READ 8 bits (with tSTRETCH delay)//and Send ACK bit
LowerByte = i2c_read(NAK);// READ 8 bits (with tSTRETCH delay)//and Send NAK bit
i2c_stop();

FIGURE 4-5:// send STOP command

Timing Diagram to Set a Register Pointer, Write Two Bytes, and Read the Data.

 2015-2021 Microchip Technology Inc.

DS20005426G-page 24

MCP960X/L0X/RL0X
1

2

3

4

5

6

7

8

1

1

0

0

A
2

A
1

A
0

W C

1

2

3

4

5

6

7

8

0

0

0

0

0

0

0

0

SCL

SDA

S

A
K

Address Byte

Pointer to
TH Register

Device*A
C P
KDevice*

MCP960X/L0X/RL0X Clock Stretching, tSTRETCH
1

2

3

4

5

6

7

8

1

1

0

0

A
2

A
1

A
0

R C

1

2

3

4

5

6

7

8

x

x

x

x

x

x

x

x

1

2

3

4

5

6

7

8

x

x

x

x

x

x

x

x

SCL

SDA

S

A
K

Device*Address Byte

TH MSB DataACK

TH LSB Data

Host

A
C
K

Host

MCP960X/L0X/RL0X Clock Stretching, tSTRETCH
1

2

3

4

5

6

7

8

x

x

x

x

x

x

x

x

TC MSB Data

A
C
K

1

2

3

4

5

6

7

8

x

x

x

x

x

x

x

x

Host

TC LSB Data

A
C
K

Host

x

x

x

x

T MSB Data

x

x

N
A
K

P

Host

Device ID LSB
Note: this is an example pseudo routine:i2c_start();// send START commandi2c_write(b’1100 0000’);// WRITE Command*MCP960X/L0X/RL0X// also, make sure bit 0 is cleared ‘0’i2c_write(b’0000 0000’);// Write TH register to set the starting register for sequential readi2c_stop();// send STOP commandi2c_start();// send START commandi2c_write(b’1100 0001’);// READ Command// also, make sure bit 0 is set ‘1’for (i=0; i<29, i++){
Data_Buffer[i] = i2c_read(ACK);// READ 8 bits (with tSTRETCH delay)// and Send ACK bit}
Data_Buffer[i] = i2c_read(NAK);// READ 8 bits (with tSTRETCH delay)// and Send NAK bit
i2c_stop();

FIGURE 4-6:// send STOP command

Timing Diagram to Sequential Read All Registers Starting from TH Register.

 2015-2021 Microchip Technology Inc.

DS20005426G-page 25

MCP960X/L0X/RL0X
5.0

FUNCTIONAL DESCRIPTION

The MCP960X/L0X/RL0X Thermocouple temperature
converter consists of an 18-bit Delta-Sigma
Analog-to-Digital Converter (ADC), which is used tomeasure the thermocouple voltage or EMF, a digital

+

VIN+

temperature sensor used to measure cold-junction orambient temperature and a processor core which is used
to compute the EMF to degree Celsius conversion using
coefficients derived from the NIST ITS-90 coefficients.
Figure 5-1 shows a block diagram of how these functions
are structured in the device.

ADC Core
Del Sig

Thermocouple

VIN-

User Registers:
Thermocouple Hot-Junction, TH
Error Correction

Thermocouple Junctions Delta, TΔ

Thermocouple Cold-Junction, TC
DigitalFilter
Thermocouple
Type
Selection

Sensor Status
Sensor Configuration
Device Resolution and Power Modes
Configuration

MCP9601/L01/RL01 Only

VSENSE

Alert 1 Output

Alert 2 Limit

Alert 2 Output

Alert 3 Limit

Alert 3 Output

Alert 4 Limit

Alert 4 Output

Hysteresis
Configuration

Open-Circuit andShort-Circuit
Detection

Alert 1 Limit

Hysteresis
Configuration
Hysteresis

OC Alert

Configuration

SC Alert

Hysteresis
Device ID

I2C Module

SCL
SDA
ADDR

FIGURE 5-1:

Functional Block Diagram.

 2015-2021 Microchip Technology Inc.

DS20005426G-page 26

MCP960X/L0X/RL0X
The MCP960X/L0X/RL0X device has several registers
that are user-accessible. These registers include theThermocouple Temperature (cold-junction compensated), Hot-Junction Temperature, Cold-Junction Temperature, Raw ADC Data, user-programmable Alert
Limit registers, and STATUS and Configuration registers.

The MCP960X/L0X/RL0X also provides STATUS and
Configuration registers, which allow users to detectdevice statuses. The Configuration registers provide
various features, such as adjustable temperature
measurement resolution and Shutdown modes. The
thermocouple types can also be selected using theConfiguration registers.

The Temperature and the Raw ADC Data registers are
read-only registers, used to access the thermocouple
and the ambient temperature data. In addition, the four
Alert Temperature registers are individually controlled,
and can be used to detect a rising and/or a falling
temperature change. If the ambient temperature drifts
beyondtheuser-specified
limits,the
MCP960X/L0X/RL0X device outputs an alert flag at thecorresponding pin (refer to Section 5.3.3 “Alert Configuration Registers”). The alert limits can also be
used to detect critical temperature events.

The registers are accessed by sending a Register
Pointer to the MCP960X/L0X/RL0X using the serialinterface. This is an 8-bit write-only pointer.
Register 5-1 describes the pointer definitions.

REGISTER 5-1:

REGISTER POINTER

U-0

U-0

—

—

W-0

W-0

W-0

W-0

W-0

W-0

P[5:0]

bit 7

bit 0

Legend:R = Readable bit

W = Writable bit

U = Unimplemented bit, read as ‘0’-n = Value at POR‘1’ = Bit is set‘0’ = Bit is cleared

bit 7-6

Unimplemented: Read as ‘0’

bit 5-0

P[5:0]: Pointer bits
0000 0000 = Thermocouple Hot-Junction register, TH
0000 0001 = Junctions Temperature Delta register, TΔ
0000 0010 = Cold-Junction Temperature register, TC
0000 0011 = Raw ADC Data register
0000 0100 = STATUS register
0000 0101 = Thermocouple Sensor Configuration register
0000 0110 = Device Configuration register
0000 1000 = Alert 1 Configuration register
0000 1001 = Alert 2 Configuration register
0000 1010 = Alert 3 Configuration register
0000 1011 = Alert 4 Configuration register
0000 1100 = Alert 1 Hysteresis register, THYST10000 1101 = Alert 2 Hysteresis register, THYST20000 1110 = Alert 3 Hysteresis register, THYST30000 1111 = Alert 4 Hysteresis register, THYST40001 0000 = Temperature Alert 1 Limit register, TALERT1
0001 0001 = Temperature Alert 2 Limit register, TALERT20001 0010 = Temperature Alert 3 Limit register, TALERT30001 0011 = Temperature Alert 4 Limit register, TALERT40010 0000 = Device ID/Revision register 2015-2021 Microchip Technology Inc.

x = Bit is unknown

DS20005426G-page 27

MCP960X/L0X/RL0X
TABLE 5-1:

SUMMARY OF REGISTERS AND BIT ASSIGNMENTS

RegisterPointer

bit 7

bit 6

bit 5

bit 4

bit 3

Hot-Junction
Temperature – TH

00000000

SIGN

1024°C

512°C

256°C

128°C

64°C

32°C

16°C

8°C

4°C

2°C

1°C

0.5°C

0.25°C

0.125°C

0.0625°C

Junctions Temperature
Delta – TΔ

00000001

SIGN

1024°C

512°C

256°C

128°C

64°C

32°C

16°C

8°C

4°C

2°C

1°C

0.5°C

0.25°C

0.125°C

0.0625°C

Cold-Junction
Temperature – TC

00000010

128°C

64°C

32°C

16°C

8°C

4°C

2°C

1°C

0.5°C

0.25°C

0.125°C

0.0625°C

Raw Data ADC

00000011

bit 17

bit 16bit 15

—

—

—

—

—

—

bit 8

bit 7

—

—

—

—

—

—

bit 0

Burst
CompleteTH
Update—Input Range

Alert 4
StatusAlert 3
StatusAlert 2
StatusAlert 1
StatusShort-Circuit(SC)

Open-Circuit(OC)/Input
Range

STATUS
MCP9600/L00/RL00

00000100

SIGN

bit 2

bit 1

SIGN

STATUS
MCP9601/L01/RL01
Thermocouple
Sensor Configuration

00000101—

Thermocouple Type SelectType K, J, T, N, S, E, B, R—

DeviceConfiguration

00000110Cold-Junc.
Resolution

ADC Resolution

Alert 1 Configuration

00001000——

Alert 2 Configuration

00001001

Interrupt
Clear

Monitor TH
or TC

Alert 3 Configuration

00001010

Alert 4 Configuration

00001011

Alert 1 Hysteresis

00001100

128°C

64°C

32°C

16°C

8°C

Alert 2 Hysteresis

00001101

Alert 3 Hysteresis

00001110

Alert 4 Hysteresis

00001111

Alert 1 Limit

00010000

SIGN

1024°C

512°C

256°C

8°C

4°C

2°C

1°C

1024°C

512°C

256°C

bit 0

Filter Coefficients

Burst Mode Temperature Samples

Shutdown Modes

Unimplemented bits, Read as '0'
Detect Ris- Active- Highing or Fallor
ing Temps Active-Low
OutputComparator
orInterrupt
Mode

EnableAlert
Output

4°C

2°C

1°C

128°C

64°C

32°C

16°C

0.5°C

0.25°C

—

—

128°C

64°C

32°C

16°C

Alert 2 Limit

00010001

SIGN
8°C

4°C

2°C

1°C

0.5°C

0.25°C——

Alert 3 Limit

00010010

SIGN

1024°C

512°C

256°C

128°C

64°C

32°C

16°C

8°C

4°C

2°C

1°C

0.5°C

0.25°C——

Alert 4 Limit

00010011

SIGN

1024°C

512°C

256°C

128°C

64°C

32°C

16°C

8°C

4°C

2°C

1°C

0.5°C

0.25°C——

Device ID/Revision
MCP9600/L00/RL00

00100000

0

1

0

0

0

0

0

0

Device ID/Revision
MCP9601/L01/RL01

Revision-Major0 2015-2021 Microchip Technology Inc.

1

0
Revision-Major

Revision-Minor
0

0

0

0

1

Revision-Minor

DS20005426G-page 28

MCP960X/L0X/RL0X
5.1

Thermocouple Temperature
Sensor Registers

This device integrates three Temperature registers thatare used to read the cold and hot-junction temperatures,and the sum of the two junctions to output the absolute
thermocouple temperature. In addition, the Raw ADC
Data register, which is used to derive the thermocouple
temperature, is available. The following sections
describe each register in detail.

5.1.1

The temperature bits are in two’s complement format;
therefore, positive temperature data and negative
temperaturedata
arecomputed
differently.
Equation 5-1 shows how to convert the binary data totemperature in degree Celsius.

Temperature
Sensor Core

THERMOCOUPLE TEMPERATURE
REGISTER (TH)This register contains the cold-junction compensated anderror-corrected thermocouple temperature in degree
Celsius. The temperature data from this register is theabsolute Thermocouple Hot-Junction temperature, TH, tothe specified accuracy (see Section 1.0 “Electrical
Characteristics”. TH is the sum of the values in the TΔ
and TC registers, as shown in Figure 5-2.

EQUATION 5-1:

TC

Thermocouple
Temperature


VIN+
VIN-

TH

ADC Core

TΔ

Delta-Sigma
18-BitError Corrected
Temperature
ADC

FIGURE 5-2:
Thermocouple Temperature
Register Block Diagram.

TEMPERATURECONVERSION

Temperature  0°C
TH = (UpperByte x 16 + LowerByte/16)
Temperature  0°C
TH = (UpperByte x 16 + LowerByte/16) – 4096

REGISTER 5-2:

THERMOCOUPLE TEMPERATURE REGISTER - TH (READ-ONLY)

R-0

R-0

R-0

R-0

R-0

R-0

R-0

R-0

SIGN

1024°C

512°C

256°C

128°C

64°C

32°C

16°C

bit 15

bit 8

R-0

R-0

R-0

R-0

R-0

R-0

R-0

R-0

8°C

4°C

2°C

1°C

0.5°C

0.25°C

0.125°C

0.0625°C

bit 7

bit 0

Legend:R = Readable bit

W = Writable bit

U = Unimplemented bit, read as ‘0’-n = Value at POR‘1’ = Bit is set‘0’ = Bit is cleared

bit 15-0

x = Bit is unknown

TH: Data in Two’s Complement Format. Bit 15 is the sign bit and it is set when the temperature data isless than 0°C.
This register contains the error corrected and cold-junction compensated thermocouple temperature.

 2015-2021 Microchip Technology Inc.

DS20005426G-page 29

MCP960X/L0X/RL0X
5.1.2

THERMOCOUPLE JUNCTIONSDELTA TEMPERATURE
REGISTER (TΔ)

This register contains the error corrected
Thermocouple Hot-Junction temperature without theCold-Junction compensation. The error correction
methodology uses several coefficients to convert thedigitized Thermocouple EMF voltage to degree
Celsius. Each Thermocouple type has a unique set of
coefficients as specified by NIST, and thesecoefficients are available in the configuration registerfor user selection as shown in Figure 5-3.

EQUATION 5-2:

The temperature bits are in two’s complement format,
therefore, positive temperature data and negative
temperature data are computed differently, as shownin Equation 5-2.

ADC Core
VIN+
VIN-

ADC

Delta-Sigma
18-BitCheck if the ADC
code is within range
for the selected
thermocouple typeUser-Selectable,
Thermocouple Types:- Type K- Type J- Type T- Type N- Type S- Type E- Type B- Type R(see Register 5-6)

TEMPERATURECONVERSION

Temperature  0°C
TΔ = (UpperByte x 16 + LowerByte / 16)
Temperature  0°C
TΔ = (UpperByte x 16 + LowerByte / 16) - 4096

ADC code todegree Celsius
conversion using
coefficients derived
from NIST look-up
table database
TΔ
Thermocouple
Junctions Delta
Temperature – TΔ

FIGURE 5-3:
Thermocouple Hot-Junction
Register (TΔ) Block Diagram.
REGISTER 5-3:

HOT-JUNCTION TEMPERATURE REGISTER -TΔ (READ-ONLY)

R-0

R-0

R-0

R-0

R-0

R-0

R-0

R-0

SIGN

1024°C

512°C

256°C

128°C

64°C

32°C

16°C

bit 15

bit 8

R-0

R-0

R-0

R-0

R-0

R-0

R-0

R-0

8°C

4°C

2°C

1°C

0.5°C

0.25°C

0.125°C

0.0625°C

bit 7

bit 0

Legend:R = Readable bit

W = Writable bit

U = Unimplemented bit, read as ‘0’-n = Value at POR‘1’ = Bit is set‘0’ = Bit is cleared

bit 15-0

x = Bit is unknown

TΔ: Data in Two’s Complement Format. Bit 15 is the sign bit and it is set when the temperature data isless than 0°C.
This register contains Thermocouple Hot-Junction temperature data without the cold-junction
compensation.

 2015-2021 Microchip Technology Inc.

DS20005426G-page 30

MCP960X/L0X/RL0X
5.1.3

COLD-JUNCTION/AMBIENTTEMPERATURE REGISTER (TC)TABLE 5-2:

The MCP960X/L0X/RL0X integrates an ambient
temperature sensor which can be used to measure thethermocouple cold-junction temperature. For accurate
measurement, the device will have to be placed at close
proximity to the thermocouple cold-junction to detect thejunction ambient temperature. This is a 16-bit
double-buffered, read-only register. The temperature
resolution is user-selectable to 0.0625°C/LSb or
0.25°C/LSb resolutions and setting the resolution
determines the temperature update rate, as shown in
Table 5-2.

EQUATION 5-3:

Resolution

Conversion
Time(typical)

Register Bits
(Note 1)

0.0625°C

250 msssss xxxx xxxx xxxx

63 ms

ssss xxxx xxxx xx00

0.25°C
Note 1:‘s’ is Sign and ‘x’ is unknown bit.

TC

Ambient Temperature
Sensor CoreTEMPERATURECONVERSION

Temperature  0°C

RESOLUTION vs.
CONVERSION TIME

Thermocouple
Cold-Junction
Temperature –TC

Selectable Resolution:- 0.0625°C- 0.25°C(see Register 5-8)

TC = (UpperByte x 16 + LowerByte/16)
Temperature  0°C
TC = (UpperByte x 16 + LowerByte/16) – 4096
The temperature bits are in two’s complement format;
therefore, positive temperature data and negative
temperature data are computed differently, as shownin Equation 5-3.

REGISTER 5-4:
R-0

FIGURE 5-4:
Thermocouple
Cold-Junction Register (TC) Block Diagram.

COLD-JUNCTION TEMPERATURE REGISTER - TC (READ ONLY)
R-0

R-0

R-0

SIGN

R-0

R-0

R-0

R-0

128°C

64°C

32°C

16°C

bit 15

bit 8

R-0

R-0

R-0

R-0

R-0

R-0

R-0

R-0

8°C

4°C

2°C

1°C

0.5°C

0.25°C

0.125°C

0.0625°C

bit 7

bit 0

Legend:R = Readable bit

W = Writable bit

U = Unimplemented bit, read as ‘0’-n = Value at POR‘1’ = Bit is set‘0’ = Bit is cleared

bit 15-0

x = Bit is unknown

TC: Data in Two’s Complement Format. Bits 15-12 are sign bits and the bits are set when thetemperature data is less than 0°C.
This register contains the thermocouple cold-junction temperature or the device ambient temperaturedata. Bits 1 and 0 may remain clear (‘0’) depending on the status of the Resolution setting, bit 7 ofRegister 5-8.

 2015-2021 Microchip Technology Inc.

DS20005426G-page 31

MCP960X/L0X/RL0X
5.1.4

ANALOG-TO-DIGITALCONVERTER (ADC)ADC Core

The MCP960X/L0X/RL0X uses an 18-bit Delta-Sigma
Analog-to-Digital Converter to digitize the Thermocouple
EMF voltage and the data is available in the ADC register.
The ADC measurement resolution is selectable, whichenables the user to choose faster conversion times with
reduced resolution. This feature is useful to detect fasttransient temperatures.

Conversion
Time(typical)Raw ADC Register
Bit Format(Note 1)18-bit/2 µV

320 msssss sssx xxxx xxxx
xxxx xxxx

16-bit/8 µV

80 ms

ssss sssx xxxx xxxx
xxxx xx00

14-bit/32 µV

20 ms

ssss sssx xxxx xxxx
xxxx 0000

12-bit/128 µV

5 ms

ssss sssx xxxx xxxx
xx00 0000

Note 1:
2:

VIN-

Delta-Sigma

Raw ADC
Code Register

ADC

Selectable Resolutions:- 18-bit- 16-bit- 14-bit- 12-bit(see Register 5-7)

ADC RESOLUTION(32)TABLE 5-3:
Resolution/
Sensitivity(typical)VIN+

FIGURE 5-5:
Delta-Sigma
Analog-to-Digital Converter, ADC Core Block
Diagram.

‘s’ is the Sign bit and ‘x’ is the ADC data bit.
See Section 6.2.2 “Conversion Time vs.
Self-Heat”.

REGISTER 5-5:R-0

24-BIT ADC REGISTER (READ-ONLY)
R-0

R-0

R-0

R-0

R-0

R-0

SIGN

R-0
ADC Data

bit 23

bit 16

R-0

R-0

R-0

R-0

R-0

R-0

R-0

R-0

ADC Data
bit 15

bit 8

R-0

R-0

R-0

R-0

R-0

R-0

R-0

R-0

ADC Data
bit 7

bit 0

Legend:R = Readable bit

W = Writable bit

U = Unimplemented bit, read as ‘0’-n = Value at POR‘1’ = Bit is set‘0’ = Bit is cleared

bit 23-0

x = Bit is unknown

ADC Data: Raw ADC Raw ADC data in Two's Compliment Format. Bits 23-18 are sign bits and thebits are set when the ADC data is less than 0 micro-volt.

 2015-2021 Microchip Technology Inc.

DS20005426G-page 32

MCP960X/L0X/RL0X
5.2

Sensor STATUS and Configuration
Registers

This device provides various temperature andmeasurement Status bits which can be monitored
regularly by the host controller. In addition, this device
integrates various user-programmable features which
can be useful to develop complex thermal
management applications. The following sections
describe each feature in detail.

5.2.1

STATUS REGISTERThe STATUS register contains several flag bits thatindicate statuses, such as temperature alert, the ADC
input range status for the selected thermocouple type
and the Temperature register update status for both
single conversion or Burst mode conversions.

REGISTER 5-6:

STATUS REGISTER

R/W-0

R/W-0

Burst Complete

TH Update

U-0
—

R-0

R-0

R-0

R-0

R-0

Input Range Alert 4 Status Alert 3 Status Alert 2 Status Alert 1 Status

Short-Circuit Open-Circuit(OC)/Input(SC) (1)Range (1)
bit 7

bit 0

Legend:R = Readable bit

W = Writable bit

U = Unimplemented bit, read as ‘0’-n = Value at POR‘1’ = Bit is set‘0’ = Bit is clearedx = Bit is unknown

bit 7

Burst Complete: Burst Mode Conversions Status Flag bit
1 = TΔ register Burst mode conversions complete
0 = Writing ‘0’ has no effectOnce Burst mode is enabled, this bit is normally set after the first burst is complete. User can clear it andpoll the bit periodically until the next burst of temperature conversions is complete (see Register 5-8).

bit 6

TH Update: Temperature Update Flag bit
1 = Temperature conversion complete
0 = Writing ‘0’ has no effectThis bit is normally set. User can clear it and poll the bit until the next temperature conversion is complete.

bit 5

Unimplemented: Read as ‘0’ for the MCP9600/L00/RL00 only.
Short-Circuit (SC): Short-Circuit Detection bit for the MCP9601/L01/RL01 only (read-only)
1 = Thermocouple Shorted to VDD or VSS
0 = Normal operation
The VSENSE pin must be connected to the Thermocouple as indicated in Figure 1-1, using RA and RB
resistors.

Note 1:

MCP9601/L01/RL01 only.

 2015-2021 Microchip Technology Inc.

DS20005426G-page 33

MCP960X/L0X/RL0X
REGISTER 5-6:
bit 4

STATUS REGISTER (CONTINUED)

Input Range: Temperature Range Detection bit (read-only)
1 = The ADC input Voltage (EMF) or the temperature data from the TH register exceeds the measurement range for the selected thermocouple type
0 = The ADC input Voltage (EMF) or the temperature data from the TH register is within the measurement range for the selected thermocouple type
If this bit is set, then the MCP9600/L00/RL00 input voltage (EMF) to Degree Celsius conversion may be bypassed
under these conditions:- If the thermocouple EMF exceeds the specified range, then the TH and T registers are not
updated, but the TC register is updated with valid temperature data at the specified interval,
or tCONV.
- If the thermocouple EMF is within the specified range, but the sum with the Cold-Junction
EMF exceeds the specified range, then the TH register is not updated, but the T and TC
registers are updated with valid temperature data at the specified interval, or tCONV. In thiscase, the value of the T and TC registers can be used to calculate valid Hot-Junction
Temperature data using the NIST ITS-90 conversion look-up table or polynomial equation.
- To identify date code for devices with this feature, refer to “MCP9600 Rev. A Silicon Errata
and Data Sheet Clarification”, DS80000741.
For the MCP9601/L01/RL01, this bit indicates whether the Thermocouple is disconnected from the
inputs. The VSENSE pin must be connected to the Thermocouple as indicated in Figure 1-1, using RA andRB resistors. When the Thermocouple is disconnected, the voltage at the inputs exceeds the voltage
range for the selected Thermocouple due to the RA and RB resistors.
bit 3

Alert 4: Status bit (read-only)
1 = TX TALERT4
0 = TX ≤TALERT4
Where: TX is either TH or TC (user-selectable, see Register 5-10).

bit 2

Alert 3: Status bit (read-only)
1 = TX TALERT3
0 = TX ≤TALERT3
Where: TX is either TH or TC (user-selectable, see Register 5-10).

bit 1

Alert 2: Status bit (read-only)
1 = TX TALERT2
0 = TX ≤TALERT2
Where: TX is either TH or TC (user-selectable, see Register 5-10).

bit 0

Alert 1: Status bit (read-only)
1 = TX TALERT1
0 = TX ≤TALERT1
Where: TX is either TH or TC (user-selectable, see Register 5-10).

Note 1:

MCP9601/L01/RL01 only.

 2015-2021 Microchip Technology Inc.

DS20005426G-page 34

MCP960X/L0X/RL0X
5.2.2

THERMOCOUPLE SENSORCONFIGURATION REGISTEREQUATION 5-4:

Y = k  X +  1 – k   Y –1nk = 2  2 + 1

The MCP960X/L0X/RL0X Sensor Configuration
register is used to select the thermocouple sensor
types and to select the digital filter options. This device
supports eight thermocouple types. Each type has aunique set of error correction coefficients that arederived from the NIST Thermocouple EMF Voltage
Conversion database.

Where:
Y = New filtered temperature in TΔ
X = Current, unfiltered hot-junction
temperatures
Y-1 = Previous filtered temperature

In addition, this device integrates a first order. recursive
Infinite Impulse Response (IIR) filter, also known as
Exponential Moving Average (EMA). The filter uses thecurrent new temperature sample and the previous filter
output to calculate the next filter output. It also adds moreweight to the current temperature data, allowing a faster
filter response to the immediate change in temperature.
This feature can be used to filter out fast thermaltransients or thermal instability at the thermocouple
hot-junction temperature. Writing this register resets thefilter.

n = User-selectable filter coefficient

Filter Output (°C)

1.0

The filter equation is shown in Equation 5-4 and theFilter Coefficient n is user-selectable, from Level 0 to 7.
A coefficient of 0 disables the filter function and a 7
coefficient provides a maximum digital filter. Figure 5-6
shows the filter response to a step function, which canbe used to extrapolate the filter performance to various
temperature changes.

REGISTER 5-7:
U-0—

DIGITAL FILTER

n=0
n=1
n=2
n=3
n=4
n=5
n=6
n=7

0.5

0.0
0.0

32.0
64.0
96.0
Number of Temperature Samples

FIGURE 5-6:

128.0

Filter Step Response.

SENSOR CONFIGURATION REGISTER
R/W-0

R/W-0

R/W-0

U-0

Thermocouple Type Select, Type K, J, T, N, S, E, B, R

R/W-0

—

R/W-0

R/W-0

Filter Coefficients

bit 7

bit 0

Legend:R = Readable bit

W = Writable bit

U = Unimplemented bit, read as ‘0’-n = Value at POR‘1’ = Bit is set‘0’ = Bit is cleared

bit 7

Unimplemented: Read as ‘0’

bit 6-4

Thermocouple Type: Thermocouple Type Select bits
000 = Type K
001 = Type J
010 = Type T
011 = Type N
100 = Type S
101 = Type E
110 = Type B
111 = Type R

bit 3

Unimplemented: Read as ‘0’

bit 2-0

Filter Coefficient – n: Filter Coefficient bits
000 = n = 0: Filter off
001 = n = 1: Minimum filter
010 = n = 2
011 = n = 3
100 = n = 4: Mid filter
101 = n = 5
110 = n = 6
111 = n = 7: Maximum filter 2015-2021 Microchip Technology Inc.

x = Bit is unknown

DS20005426G-page 35

MCP960X/L0X/RL0X
5.2.3

DEVICE CONFIGURATIONREGISTER

The Burst mode enables users to execute a given
number of temperature samples (defined by bits[4-2])
before entering Shutdown mode. Each temperaturesample is compared to the user-settable alert
temperature limits, and if the alert conditions are true,
then the device asserts the corresponding alert output.
In addition, if the filter option is enabled, then the filter
engine is applied to each temperature sample. The alertthresholds are also compared to the filtered temperaturedata. This feature is useful for battery power
applications, where temperature is sampled uponrequest from the host controller.

The device Configuration register allows the user toconfigure various functions, such as sensor
measurement resolutions and Power modes. The
Resolution register is used to select the sensor
resolution for the desired temperature conversion time.
When resolutions are changed, the change takes effectwhen the next measurement cycle begins.
This device integrates two Low-Power Operating
modes: Shutdown mode and Burst mode, which can beselected using bit 0 and bit 1. When the Shutdown
mode is executed, all power consuming activities are
disabled and the operating current remains at ISHDN.
During the Shutdown mode, all registers areaccessible; however, I2C activity on the bus increases
the current.

Burst Mode Command
Shutdown Mode

Shutdown Mode

Normal Operation

1←Samples→128

FIGURE 5-7:
REGISTER 5-8:
R/W-0
Cold-Junction
Resolution

Burst Mode Operation.

DEVICE CONFIGURATION REGISTER
R/W-0

R/W-0

ADC Measurement Resolution

R/W-0

R/W-0

R/W-0

R/W-0

Burst Mode Temperature Samples

R/W-0

Shutdown Modes

bit 7

bit 0

Legend:R = Readable bit

W = Writable bit

U = Unimplemented bit, read as ‘0’-n = Value at POR‘1’ = Bit is set‘0’ = Bit is clearedx = Bit is unknown

bit 7

Cold-Junction/Ambient Sensor Resolution: Cold-Junction Resolution bit (see Table 5-2):
0 = 0.0625°C
1 = 0.25°C

bit 6-5

ADC Measurement Resolution: ADC Resolution bits (see Table 5-3):
00 =18-bit Resolution
01 =16-bit Resolution
10 =14-bit Resolution
11 =12-bit Resolution

bit 4-2

Burst Mode Temperature Samples: Number of Temperature Samples bits
000 = 1 sample
001 = 2 samples
010 = 4 samples
011 = 8 samples
100 = 16 samples
101 = 32 samples
110 = 64 samples
111 = 128 samples

bit 1-0

Shutdown Modes: Shutdown Mode bits
00 = Normal operation
01 = Shutdown mode
10 = Burst mode
11 = Unimplemented: this setting has no effect 2015-2021 Microchip Technology Inc.

DS20005426G-page 36

MCP960X/L0X/RL0X
5.3

Temperature Alert Registers

TABLE 5-4:

This device provides four Temperature Alert registers
that are individually configured, which allow users tomonitor multiple temperature zones with a single
device. The following sections describe each alertfeature in detail.

5.3.1

ALERT LIMIT REGISTERS

Register

ALERT LIMIT REGISTERS

Register PointerAlert 1 Limit – TALERT1

0001 0000

Alert 2 Limit – TALERT20001 0001

Alert 3 Limit – TALERT30001 0010

Alert 4 Limit – TALERT40001 0011

This device integrates four individually controlled
Temperature Alert Limit registers. Each alert limit isindividually set to detect a rising or falling temperature,or either the Thermocouple Temperature (TH) registeror the Cold-Junction (TC) register. The corresponding
alert limit outputs can also be enabled for temperature
status indicators. All alert functions are configured using
the Alert Limit Configuration registers (Register 5-11)
and the alert output hysteresis function is set using theAlert Hysteresis registers (Register 5-10).

REGISTER 5-9:

ALERT LIMITS 1, 2, 3 AND 4 REGISTERS

R/W-0

R/W-0

R/W-0

R/W-0

R/W-0

R/W-0

R/W-0

R/W-0

SIGN

1024°C

512°C

255°C

128°C

64°C

32°C

16°C

bit 15

bit 8

R/W-0

R/W-0

R/W-0

R/W-0

R/W-0

R/W-0

U-0

U-0

8°C

4°C

2°C

1°C

0.5°C

0.25°C

—

—

bit 7

bit 0

Legend:R = Readable bit

W = Writable bit

U = Unimplemented bit, read as ‘0’-n = Value at POR‘1’ = Bit is set‘0’ = Bit is cleared

bit 15-0

x = Bit is unknown

Alert 1, 2, 3 and 4: Data in Two’s Complement Format. Bit 15 is the sign bit and it is set when thetemperature data is less than 0°C. Bits 1 and 0 are unimplemented, therefore, writing these bits has
no effect.

TH

0

TC

1

Output Mode Control
Comparator

00Interrupt

1

1

Digital Comparator

TH/TC

Alert Output

Alert Limit+/–
Alert Hysteresis
Rise/Fall

FIGURE 5-8:

Int. Clear

Active High/Low

Comparator/Interrupt Mode

Alert Limits Set to Detect TH and TC.

 2015-2021 Microchip Technology Inc.

DS20005426G-page 37

MCP960X/L0X/RL0X
 TALERT1TALERT1

 TALERT1 – THYST1

 TALERT2TALERT2

 TALERT3 + THYST3
TH

 TALERT2 – THYST2TALERT3

 TALERT3 TALERT4

Comparator

Interrupt Clear
Comparator
Interrupt
Interrupt Clear

Comparator
Interrupt
Interrupt Clear

Alert 3 Output(Active-Low)

Alert 2 Output(Active-Low)

 TALERT4 + THYST4Interrupt

Alert 4 Output(Active-Low)

Alert 1 Output(Active-Low)

TALERT4

FIGURE 5-9:Comparator
Interrupt
Interrupt Clear

Alert Limits Boundary Conditions and Output Characteristics when Set to Detect TH.

 2015-2021 Microchip Technology Inc.

DS20005426G-page 38

MCP960X/L0X/RL0X
5.3.2

ALERT HYSTERESIS REGISTERTABLE 5-5:This device integrates four individually controlledtemperature Alert Hysteresis registers for each alert
output, with a range of 0°C to +255°C.
The alert hysteresis directions are set using bit 3 ofthe corresponding Alert Configuration registers(Register 5-10) to detect rising or falling temperatures.
For rising temperatures, the hysteresis range is below
the alert limit where, as for falling temperatures, thehysteresis range is above the alert limit, as shown in
Figure 5-10.

REGISTER 5-10:

ALERT HYSTERESISREGISTERSRegister

Register PointerAlert 1 Hysteresis – THYST10000 1100

Alert 2 Hysteresis – THYST20000 1101

Alert 3 Hysteresis – THYST30000 1110

Alert 4 Hysteresis – THYST40000 1111

THYSTx: ALERT 1, 2, 3 AND 4 HYSTERESIS REGISTERS

R/W-0

R/W-0

R/W-0

R/W-0

R/W-0

R/W-0

R/W-0

R/W-0

128°C

64°C

32°C

16°C

8°C

4°C

2°C

1°C

bit 7

bit 0

Legend:R = Readable bit

W = Writable bit

U = Unimplemented bit, read as ‘0’-n = Value at POR‘1’ = Bit is set‘0’ = Bit is cleared

bit 7-0

Alert Hysteresis: Alert Hysteresis Range 0x00 to 0xFF bits (which represents +1°C to +255°C)

sis
ere
t
s
Hy

Alert Output

res
ste
y
H

is

Active-Low

Active-Low

Alert Output

THYST

Cold

TALERTTALERTHot

Rising Temperature

s
ere
t
s
Hy

THYST

Cold

Hot

Falling Temperatureis

Alert Output

is
es
ter
s
Hy

Active-High

Active-High

Alert Output

THYST

Cold

TALERTHot

Rising Temperature

FIGURE 5-10:

x = Bit is unknown

TALERT

THYST

Cold

Hot

Falling Temperature

Graphical Description of Alert Output Hysteresis Direction.

 2015-2021 Microchip Technology Inc.

DS20005426G-page 39

MCP960X/L0X/RL0X
5.3.3

ALERT CONFIGURATIONREGISTERS

The microcontroller will have Acknowledged theinterrupt signal from the corresponding alert output by
clearing the interrupt using bit 7 of the corresponding
Configuration register.

This device integrates four individually controlledtemperature alert outputs. Each output is configured forthe corresponding alert output using the Alert Output
Configuration registers.

The Rise/Fall bit (bit 3) and the Monitor TH/TC bit (bit 4)
can be used to detect and maintain the thermocouple
temperature or the cold-junction temperature to thedesired temperature window.

The Configuration registers are used to enable each
output, select the Alert Function mode as Comparator
or Interrupt mode, active-high or active-low output,
detect rising or falling temperatures and detect TH or
TC Temperature registers.

TABLE 5-6:

Register

The Comparator mode is useful for thermostat-typeapplications, such as on/off switches for fan controllers,buzzer or LED indicators. The alert output asserts anddeasserts when the temperature exceeds theuser-specified limit, and the user-specified hysteresis
limit. The Interrupt mode is useful for interrupt driven
microcontroller-based systems. The alert outputs areasserted each time the temperature exceeds theuser-specified alert limit and hysteresis limits.

REGISTER 5-11:

ALERT CONFIGURATIONREGISTERSRegister PointerAlert 1 Configuration

0000 1000

Alert 2 Configuration

0000 1001

Alert 3 Configuration

0000 1010

Alert 4 Configuration

0000 1011

ALERT 1, 2, 3 AND 4 CONFIGURATION REGISTER

R/W-0

U-0

U-0

R/W-0

R/W-0

Interrupt Clear——

Monitor TH/TC

Rise/Fall

R/W-0

R/W-0

R/W-0

Active-High/Low Comp/Int. Alert Enable

bit 7

bit 0

Legend:R = Readable bit

W = Writable bit

U = Unimplemented bit, read as ‘0’-n = Value at POR‘1’ = Bit is set‘0’ = Bit is clearedx = Bit is unknown

bit 7

Interrupt Clear: Interrupt Clear bit
1 = Clears Interrupt flag (forced ‘0’ by device)
0 = Normal state or cleared state

bit 6-5

Unimplemented: Read as ‘0’

bit 4

Monitor TH or TC: Temperature Maintain/Detect bit
1 = Alert monitor for TC cold-junction sensor
0 = Alert monitor for TH thermocouple temperature

bit 3

Rise/Fall: Alert Temperature Direction bit
1 = Alert limit for falling or cooling temperatures
0 = Alert limit for rising or heating temperatures

bit 2

Active-High/Low: Alert State bit
1 = Active-high
0 = Active-low

bit 1Comp./Int.: Alert Mode bit
1 = Interrupt mode: Interrupt clears bit (bit 7) – must be set to deassert the alert output
0 = Comparator mode

bit 0

Alert Enable: Alert Output Enable bit
1 = Alert output is enabled
0 = Alert output is disabled 2015-2021 Microchip Technology Inc.

DS20005426G-page 40

MCP960X/L0X/RL0X
5.3.4

DEVICE ID AND REVISION ID
REGISTERThe Device ID (Identification) and Revision ID register
is a 16-bit read-only register, which can be used to
identify this device among other devices on the I2C
bus. The upper 8 bits indicate the Device ID of 0x40 for
the MCP9600/L00/RL00 and 0x41 for the
MCP9601/L01/RL01 respectively, while the lower 8 bits
indicate the device revision. The device revision byte is

REGISTER 5-12:
R-0

divided into nibbles, where the upper nibble indicatesthe major revision and the lower nibble indicates minor
revisions. The initial release is indicated by a majorrevision of ‘1’ and a minor revision of ‘0’ or 0x4010 for
the MCP9600/L00/RL00 and 0x4110 for the
MCP9601/L01/RL01. (Refer to “MCP9600 Silicon
Errata and Data Sheet Clarification”, DS80000741, forchanges and revision IDs).

MCP9600/L00/RL00 DEVICE ID AND REVISION ID REGISTER
R-1

R-0

R-0

R-0

R-0

R-0

R-0

Device ID
bit 15

bit 8

R-0

R-0

R-0

R-1

R-0

Revision-Major

R-0

R-0

R-0

Revision-Minor

bit 7

bit 0

Legend:R = Readable bit

W = Writable bit

U = Unimplemented bit, read as ‘0’-n = Value at POR‘1’ = Bit is set‘0’ = Bit is clearedx = Bit is unknown

bit 15-8

Device ID: Device ID bits (0x40)

bit 7-0

Revision: Major/Minor Revision ID bits (0x10) for the initial Release, or Revision 1.0 (Refer to the
Silicon Errata, DS80000741, for change date codes and revision IDs).

REGISTER 5-13:
R-0

MCP9601/L01/RL01 DEVICE ID AND REVISION ID REGISTER
R-1

R-0

R-0

R-0

R-0

R-0

R-1

Device ID
bit 15

bit 8

R-0

R-0

R-0

R-1

R-0

Revision-Major

R-0

R-0

R-0

Revision-Minor

bit 7

bit 0

Legend:R = Readable bit

W = Writable bit

U = Unimplemented bit, read as ‘0’-n = Value at POR‘1’ = Bit is set‘0’ = Bit is clearedx = Bit is unknown

bit 15-8

Device ID: Device ID bits (0x41)

bit 7-0

Revision: Major/Minor Revision ID bits (0x10) for the initial Release, or Revision 1.0 (Refer to the
Silicon Errata, DS80000741, for change date codes and revision IDs).

 2015-2021 Microchip Technology Inc.

DS20005426G-page 41

MCP960X/L0X/RL0X
6.0

APPLICATION INFORMATION

6.1

Layout Considerations

The MCP960X/L0X/RL0X does not require any
additional components to digitize thermocouples.
However, it is recommended that a decoupling
capacitor of 0.1 µF to 1 µF be used between the VDD
and GND pins. A high-frequency ceramic capacitor isrecommended. It is necessary for the capacitor to belocated as close as possible to the VDD and groundpins of the device in order to provide effective noise
protection.
In addition, good PCB layout is key for better thermal
conduction from the PCB temperature to the sensor
die. The PCB provides thermal conduction from the dieto the thermocouple cold-junction; therefore, thecomponent placement positioning and the copper
layout techniques are key for optimum cold-junction
compensation. The recommended implementation for
optimum temperature sensitivity is to extend a copper
ground pad around the device pins, as shown in
Figure 6-1.
Thermal Pad

6.1.1

6.2

Recommended PCB Layout.

COLD-JUNCTION COMPENSATION

Copper provides better thermal conductivity than PCB
FR4 to the ambient temperature. It also provides better
thermal conduction than the 5 mm x 5 mm MQFN plastic
package, which houses the temperature sensor die.
Therefore, when connecting the thermocouple wire to
the PCB, it is recommended to place the ground copper
between the thermocouple connector footprint, where
dissimilar conductive material is attached to the PCB
and the MCP960X/L0X/RL0X exposed pad. This allows
temperature to stabilize to the local ambient temperature(between the thermocouple connector junction and the
PCB copper) and the copper trace conducts thetemperature to the package exposed pad where thetemperature sensor die is placed. The placement of thesensor exposed pad to the thermocouple connector
junction greatly determines the temperature sensor’s
sensitivity to the local junction temperature changes.
Figure 6-2 demonstrates the recommended techniques.

 2015-2021 Microchip Technology Inc.

Recommended Component

Thermal Considerations

The potential for self-heating errors exist if the
MCP960X/L0X/RL0X SDA, SCL and alert outputs areheavily loaded (high current) with pull-up resistors andcircuits, such as high-current LEDs or buzzer loads.
The temperature rise due to self-heat increases theambient temperature sensor output, resulting in an
increased temperature offset error compared to thethermocouple cold-junction ambient temperature.

6.2.1

VIN+/VIN-

FIGURE 6-1:

FIGURE 6-2:
Placement.

SELF-HEAT DURING OPERATION

During normal operation, the typical self-heating error
is negligible due to the relatively small current
consumption of the MCP960X/L0X/RL0X. However,this device integrates a processor to compute theequations necessary to convert the thermocouple EMF
voltage to degrees Celsius. The processor also
maintains the I2C bus. During I2C communication, thedevice operating current increases to IDD = 1.5 mA(typical), I2C Active specification. If the bus iscontinually polled for data at frequent intervals, then theprocessor power dissipates heat to the temperature
sensor and the effect of self-heat can be detected.
Therefore, the recommended implementation is tomaintain polling to no more than three times pertemperature conversion period of 320 ms or use the
Burst mode feature to manage self-heat (refer to
Section 6.2.3 “Using Burst Mode to Manage
Self-Heat”). Equation 6-1 can also be used todetermine the effect of self-heat.

DS20005426G-page 42

MCP960X/L0X/RL0X
EQUATION 6-1:

EFFECT OF
SELF-HEATING

6.2.3

The Burst mode feature is useful to manage power
dissipation while maintaining the device sensitivity tochanges in temperature (see Section 5.2.3 “Device
Configuration Register”). While the device is in
Low-Power or Shutdown mode, the host controller executes Burst mode to sample temperature. The numberof temperature samples and the measurement resolution settings are selected while executing the command.
While in Burst mode, if the temperature data exceeds
the alert limits, the device asserts the corresponding
alert output. The alert outputs are used so the host controller does not need to continually poll the latest
temperature data and potentially increase thetemperature error.

T  =  JA  VDD  I DD 
T  =  JC  V DD  I DD T = TJ – T A
Where:
TJ = Junction Temperature
TA = Ambient Temperature
JA = Package Thermal Resistance:- Junction to AmbientJC = Package Thermal Resistance:
Junction to CaseAt room temperature (TA = +25°C) with IDD = 2.5 mA(maximum) and VDD = 3.3V, the self-heating due topower dissipation, T, is 0.32°C for the MQFN package.

6.2.2

CONVERSION TIME vs. SELF-HEAT

Once the ADC completes digitization, the processor
initiates the data computation routine for tCALC, which
also increases IDD. During the 18-bit ADC conversion
time (3 SPS, Samples per Second), the increased
current lasts for approximately 5% of the one-second
period. The effect of self-heat for the total power
consumed per second, including the 5% tCALC period, isnegligible. However, as the ADC resolution is reduced
from 18-bit to 16-bit, the power consuming tCALC period
increases to 20% per second. This change in resolution
adds approximately 0.04°C (typical) temperature error
due to self-heat. Table 6-1 provides an estimate forself-heat for all resolutions using Equation 6-1.
In order to reduce the effects of self-heat for lower
resolution settings, the Burst mode feature isrecommended to manage the effects of self-heat.

TABLE 6-1:
Resolution

ADC RESOLUTION vs.
SELF-HEAT
SPS(typ.)

tCALC Duration
per SecondT

18-bit3

5%0.0096°C

16-bit15

20%0.0384°C

14-bit60

80%0.1536°C

12-bit240

100%

0.1920°C

Note:

USING BURST MODE TO MANAGESELF-HEATIn addition, with some applications monitoring several
hundred degrees of temperature changes, 18-bit
resolution may not be necessary. In this case, a fewer
number of burst samples reducing the resolution
enables the user to monitor fast transient temperaturesat the burst intervals. The 12-bit ADC resolution
provides approximately 3°C resolution (for Type K) anda new sample of temperature data is computed at
approximately 20 ms intervals. Therefore, the numberof Burst mode Samples per Second can be selected to
manage the effects of self-heat using these estimates.
The temperature conversion status during Burst mode
can also be momentarily polled (using bit 7 ofRegister 5-6) to detect whether the on-going sample
bursts are completed. The host controller may
terminate an on-going burst by executing a shutdown
command or resetting the Burst mode by sending
another burst command.

6.2.4

ALERT OUTPUTS

The alert outputs are intended to drive high-impedanceloads. Typically, the outputs are connected to a
microcontroller input pin. However, if the outputs areused to drive indicators, such as LEDs or buzzers, thena buffer circuit is recommended in order to minimize theeffects of self-heat due to the applied load (seeFigure 6-3).
VDD

VDD = 3.3V and IDD = 1.5 mA (typical).
Active-High

NPN

Alert Output

FIGURE 6-3:
Indicator.

 2015-2021 Microchip Technology Inc.

Alert Output Buffer for LED

DS20005426G-page 43

MCP960X/L0X/RL0X
6.3

Device Features

6.3.2

I2C ADDRESSING

6.3.1

The MCP960X/L0X/RL0X supports up to eight deviceson the I2C bus. Applications, such as large thermal
management racks with several thermocouple sensor
interfaces, are able to monitor various temperaturezones with minimal pin count microcontrollers. This
reduces the total solution cost, while providing a highly
accurate thermal management solution using the
MCP960X/L0X/RL0X.
VDD
PIC®
Microcontroller

VIN+

MCP960X/L0X/RL0X

Unit 2/8
VIN-

GND

The MCP960X/L0X/RL0X uses a switched capacitor
amplifier input stage to gain the input signal to a
maximum resolution of 2 µV/LSb at an 18-bit ADC
setting. An internal input capacitor is used for chargestorage. The differential input impedance, ZIN_DF, isdominated by the sampling capacitor and the switchedcapacitor amplifier sampling frequency. During asampling period, the charging and discharging of thesampling capacitor creates dynamic input currents at the
input pins. Adding a 10-100 nF capacitor between the
inputs can improve stability.
Since the sampling capacitor is only switching to the
input pins during a conversion process, the input
impedance is only valid during conversion periods.
During Low-Power or Shutdown mode, the input
amplifier stage is disabled; therefore, the input
impedance is ZIN_CM, which is due to the leakage
current from ESD protection diodes, as shown in
Figure 6-5.

R2B
ADDR

Alert
4

R2A

Types K, J, T, N,
E, B, S, R

Up to Eight Deviceson the I2C Bus

I2C
VDD

INPUT IMPEDANCE

RSS

VIN+,VIN-R7A R7B

V
ADDR

Sampling
SwitchSS RSCSAMPLE(3.2 pF)

VIN+
MCP960X/L0X/RL0X

4
Alert

TABLE 6-2:

Unit 7/8
GND

FIGURE 6-5:

VINTypes K, J, T, N,
E, B, S, R

RECOMMENDEDRESISTOR VALUES FOR
I2C ADDRESSING
ValuesDevice #CommandByte

11100 000x

ADDR Pin Tied to GND

21100 001x

R2A = 10R2B = 2.2

31100 010x

R3A = 10

R3B = 4.3

41100 011x

R4A = 10

R4B = 7.551100 100x

R5A = 10R5B = 1361100 101xR6A = 10R6B = 2271100 110x

R7A = 10R7B = 4381100 111x

ADDR Pin Tied to VDD

Note:

Thermocouple Input Stage.

RXA (k)RXB (k)Standard 5% tolerance resistors are used in
the table; however, 1% tolerance resistors
provide better ratio matching.

FIGURE 6-4:
Implementation.

I2C Address Selection

 2015-2021 Microchip Technology Inc.

DS20005426G-page 44

MCP960X/L0X/RL0X
6.3.3

OPEN AND SHORT DETECTION
CIRCUITS

For the MCP9600/L00/RL00, external circuits can be
added to detect the thermocouple status as open
(physically disconnected) or as short (thermocouple
wire in contact with the system ground or VDD). If apassive circuit is added to the input stage, then thecircuit loading effect to the MCP9600/L00/RL00 ADC
inputs must be considered. System calibration is also
required to ensure proper accuracy. In addition,
external loads can degrade the device performance,such as input offset, gain and Integral Nonlinearity(INL) errors. If a low-impedance active circuit is added,
then both offset and gain errors must be calibrated.
The MCP9601/L01/RL01 has a Thermocouple open
and short-circuit detection mechanism, which is implemented using a Sense-Input pin (VSENSE), as shown in
Figure 1-1. The VSENSE pin and RA and RB resistors
must be connected as indicated in Figure 1-1. For
proper operation, the resistor values must also be
within the specified tolerance range. When open-circuitor short-circuit conditions are detected, the OC Alertand SC Alert Active-High Push-Pull outputs areasserted, respectively.

6.3.3.1

Open-Circuit Detection Technique

For MCP9600/L00/RL00 open-circuit detection, theInput Range bit (bit 4) of the STATUS register(Register 5-6), can be used to detect open-circuit
conditions. This would require a few external resistors,
as shown in Figure 6-6. The passive circuit does notaffect the MCP9600/L00/RL00 accuracy. When thethermocouple is connected, the input Common-mode
voltage is 50% of VDD. When the thermocouple isdisconnected, the voltage at the VIN+ input is 66% of
VDD and the voltage at the VIN- input is pulled low to
VSS. This change forces the Input Range bit to be set.

RB

R$

VDD
MCP9600/L00/RL00

+

VIN+

Thermocouple

VIN-

Del SigRB

5$ 0ȍ7ROHUDQFH 0D[ 
5% 0ȍ7ROHUDQFH

FIGURE 6-6:
Adding Open-Circuit
Detection Resistors (MCP9600/L00/RL00).
RB

RA

VDD
VSENSE+

VIN+

Thermocouple

VIN-

Del Sig

R&

MCP9601/L01/RL01

5$ 07ROHUDQFH 0D[ 
5% 07ROHUDQFH
5& .7ROHUDQFH

FIGURE 6-7:
Adding Open-Circuit
Detection Resistors (MCP9601/L01/RL01).

The MCP9601/L01/RL01 open-circuit detection
mechanism operates similarly (see Figure 6-7), andthe detection thresholds are specified as VSiOC andVSiNOR (see DC Characteristics).
The host controller can momentarily poll the Status bit
to detect the Open-Circuit condition. For the
MCP9601/L01/RL01, the OC Alert pin can are used as
hardware indicator.

 2015-2021 Microchip Technology Inc.

DS20005426G-page 45

MCP960X/L0X/RL0X
6.3.4

ALIASING AND ANTI-ALIASINGFILTER

Aliasing occurs when the input signal contains timevarying signals with frequency greater than half thesample rate. In the aliasing conditions, the ADC canoutput unexpected codes. The ADC integrates a firstorder sync filter; however, an external anti-aliasing filter
can provide an added filter for high noise applications.
This can be done with a simple RC low-pass filter at the
inputs, as shown in Figure 6-8. Open-circuit detection
resistors can also be added, as shown in Figure 6-9.

6.3.5

ESD PROTECTION USING FERRITE
BEADSFerrite beads and Transient Voltage Suppression(TVS) Diodes are highly recommended to protect the
MCP960X/L0X/RL0X and other devices from a highfrequency noise and ESD discharge through thethermocouple wire. These additional components canbe added to the input channel as shown in Figure 6-11
and Figure 6-12.
R$ VDDRB

MCP9600/L00/RL00
RA

+

VIN+
C

Thermocouple

ADC Core+

L

Thermocouple

L

D
R'

VIN+

R'

VIN-

Del Sig

VIN-

RA

D

R%

5$ & ȝ)RB

D

5$ 07ROHUDQFH 0D[ 
5% 07ROHUDQFH
5' & ȝ)/ )HUULWH%HDG' 796'LRGH

Adding a Low-Pass Filter.
R$

VDD
D

FIGURE 6-8:

Del SigC

VDD
MCP9600/L00/RL00

R'

+

VIN+
C

Thermocouple

R'

Del Sig

FIGURE 6-11:
Adding Ferrite Beads(MCP9600/L00/RL00).

VIN-

5$ 07ROHUDQFH 0D[ 
5% 07ROHUDQFH
5' & ȝ)

FIGURE 6-9:
Adding Open-Circuit
Detection Resistors with an Input Low-Pass
Filter (MCP9600/L00/RL00, see Section 6.3.3“Open and Short Detection Circuits”).

RB

RA

VDD
VSENSE

R'

+

VIN+
C

Thermocouple

R'
R&

RA

RB

R%

Del Sig

VIN-

D

VDD
VSENSE

D

+

L

R'

VIN+

Thermocouple

L

R'

VIN-

C

R&

Del Sig

VDD MCP9601/L01/RL01
D

D

5$ 07ROHUDQFH 0D[ 
5% 07ROHUDQFH
5& .7ROHUDQFH
5' & ȝ)/ )HUULWH%HDG' 796'LRGH

FIGURE 6-12:
Adding Ferrite Beads(MCP9601/L01/RL01).

MCP9601/L01/RL01

5$ 07ROHUDQFH 0D[ 
5% 07ROHUDQFH
5& .7ROHUDQFH
5' & ȝ)

FIGURE 6-10:
Adding Open-Circuit
Detection Resistors with an Input Low-Pass
Filter (MCP9601/L01/RL01).

 2015-2021 Microchip Technology Inc.

DS20005426G-page 46

MCP960X/L0X/RL0X
NOTES:

 2015-2021 Microchip Technology Inc.

DS20005426G-page 47

MCP960X/L0X/RL0X
7.0

PACKAGING INFORMATION

7.1

Package Marking Information

20-Lead MQFN (5 × (5 × 1.0 mm)

Examples

PIN 1

PIN 1

(

MCP9600
E/MX e3
1932256

(

PIN 1

9601
1932256

(

PIN 1

(

PIN 1

96L00
1932256

96L01
1932256(

PIN 1

Legend: XX...X
Y
YY
WW
NNN

e3

*
Note:

96RL00
1932256(

PIN 1

96RL01
1932256

Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability codePb-free JEDEC® designator for Matte Tin (Sn)This package is Pb-free. The Pb-free JEDEC designator ( e3 )can be found on the outer packaging for this package.

In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.

 2015-2021 Microchip Technology Inc.

DS20005426G-page 48

MCP960X/L0X/RL0X
20-Lead More Thin Plastic Quad Flat, No Lead Package (NU) - 5x5x1.0 mm Body
[MQFN] - (Also called VQFN)Note:

For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

D
NOTE 1

A

B

N

1
2

E
(DATUM B)(DATUM A)
2X
0.10 C2X

TOP VIEW

0.10 C

0.10 CCSEATING
PLANE

A1

A
20X
(A3)

0.08 CSIDE VIEW
D2

E2
2

K

1

NOTE 1
N

20X b
0.10
0.05

L
e

C A B
C

BOTTOM VIEW
Microchip Technology Drawing C04-186B Sheet 1 of 2

 2015-2021 Microchip Technology Inc.

DS20005426G-page 49

MCP960X/L0X/RL0X
20-Lead More Thin Plastic Quad Flat, No Lead Package (NU) - 5x5x1.0 mm Body
[MQFN] - (Also called VQFN)Note:

For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

Units
Dimension Limits
N
Number of Pinse
Pitch
Overall HeightA
Standoff
A1
A3
Terminal Thickness
Overall Length
D
Exposed Pad Length
D2E
Overall Width
E2
Exposed Pad Width
Terminal Widthb
L
Terminal Length
Terminal-to-Exposed-Pad
K

MIN

0.90
0.00

3.15
3.15
0.25
0.35
0.20

MILLIMETERS
NOM
20
0.65 BSC
0.95
0.02
0.20 REF
5.00 BSC
3.25
5.00 BSC
3.25
0.30
0.40
-

MAX

1.00
0.05

3.35
3.35
0.35
0.45
-

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-186B Sheet 2 of 2

 2015-2021 Microchip Technology Inc.

DS20005426G-page 50

MCP960X/L0X/RL0X
20-Lead More Thin Plastic Quad Flat, No Lead Package (NU) - 5x5x1.0 mm Body
[MQFN] - (Also called VQFN)Note:

For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

C1
X2
EV
20

1

C2

ØV

2

Y2

G

EV
Y1

E
X1

SILK SCREEN

RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Optional Center Pad Width
X2
Optional Center Pad Length
Y2
Contact Pad Spacing
C1
Contact Pad Spacing
C2
Contact Pad Width (X20)
X1
Contact Pad Length (X20)
Y1
Distance Between Pads
G
Thermal Via Diameter
V
Thermal Via PitchEVMIN

MILLIMETERS
NOM
0.65 BSC

MAX
3.35
3.35

4.50
4.50
0.40
0.55
0.20
0.30
1.00

Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-186B

 2015-2021 Microchip Technology Inc.

DS20005426G-page 51

MCP960X/L0X/RL0X
APPENDIX A:REVISION HISTORY

section.

Revision G (April 2021)

Revision A (August 2015)

The following is the list of modifications:• Original release of this document.

1.
2.
3.
4.
5.
6.
7.

Updated the“MCP960X/L0X/RL0X Block
Diagram”
Updated bit 3 description of Register 5-11.
Minor typographical edits.
Changed VSENSE thresholds from the electrical
specifications table (See Errata).
Added TPOR specification.
Updated Figure 1-1.
Updated Figure 6-6, 7, 9, 10, 11, 12.

Revision F (August 2019)
The following is the list of modifications:1.

Added the MCP9601/L01/RL01 device family
and related information throughout the
document.

Revision E (January 2019)
The following is the list of modifications:1.

Added the MCP96RL00/RL01 device andrelated information throughout the document.

Revision D (August 2018)
The following is the list of modifications:1.

Added the MCP96L00 device and related
information throughout the document.

Revision C (September 2017)
The following is the list of modifications:
1.
2.
3.

Updated Figure 4-3, Equation 5-1,
Equation 5-2 and Equation 5-3.
Updated Section 6.3.3.1 “Open-Circuit
Detection Technique”.
Various typographical edits.

Revision B (June 2016)
The following is the list of modifications:
1.
2.
3.

4.

Corrected the pin description error for pins 19
and 20 on page 1.
Added the MCP9600 Evaluation Board picture
on page 2.
Added
Section 6.3.3.1“Open-Circuit
Detection
Technique”
andupdatedSection 6.3.4 “Aliasing and Anti-Aliasing
Filter” and Section 6.3.5 “ESD Protection
Using Ferrite Beads”.
Updated the Product Identification System 2015-2021 Microchip Technology Inc.

DS20005426G-page 52

MCP960X/L0X/RL0X
NOTES:

 2015-2021 Microchip Technology Inc.

DS20005426G-page 53

MCP960X/L0X/RL0X
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.(1)[X](2)X/XX

DeviceTape and Reel
OptionTemperature
Range

Package

Device:

MCP9600:
MCP9600T:
MCP96L00:
MCP96L00T:
MCP96RL00:
MCP96RL00T:
MCP9601:
MCP9601T:
MCP96L01:
MCP96L01T:
MCP96RL01:
MCP96RL01T:

Signal Conditioning IC(1)Signal Conditioning IC(1) (Tape and Reel)
Signal Conditioning IC(1)Signal Conditioning IC(1) (Tape and Reel)
Signal Conditioning IC(1)Signal Conditioning IC(1) (Tape and Reel)
Signal Conditioning IC(1)Signal Conditioning IC(1) (Tape and Reel)
Signal Conditioning IC(1)Signal Conditioning IC(1) (Tape and Reel)
Signal Conditioning IC(1)Signal Conditioning IC(1) (Tape and Reel)

Tape and Reel
Option:T= Tape and Reel(2)Temperature Range:E= -40°C to +125°C

Package:

MX = More Thin Plastic Quad Flat, MQFN, 20-Lead

Examples:a)

MCP9600-E/MX:

Extended temperature,
20-lead MQFN packageb)

MCP9600T-E/MX:

Tape and Reel,
Extended temperature,
20-lead MQFN packagec)

MCP96L00-E/MX:

Extended Temperature,
20-lead MQFN packaged)

MCP96L00T-E/MX:

Tape and Reel,
Extended temperature,
20-lead MQFN packagee)

MCP96RL00-E/MX: Extended temperature,
20-lead MQFN packagef)

MCP96RL00T-E/MX: Tape and Reel,
Extended temperature,
20-lead MQFN package
MCP9601-E/MX:
Extended temperature,
20-lead MQFN package
MCP9601T-E/MX:
Tape and Reel,
Extended temperature,
20-lead MQFN package
MCP96L01-E/MX:
Extended Temperature,
20-lead MQFN package

g)
h)
i)
j)

MCP96L01T-E/MX:k)

MCP96RL01-E/MX: Extended temperature,
20-lead MQFN packagel)

MCP96RL01T-E/MX: Tape and Reel,
Extended temperature,
20-lead MQFN package

Note 1:2:

 2015-2021 Microchip Technology Inc.

Tape and Reel,
Extended temperature,
20-lead MQFN package

For custom thermocouple types or custom
features, please contact your local Microchip
sales office. Minimum purchase volumes are
required.
Tape and Reel identifier only appears in the
catalog part number description. This identifier
is used for ordering purposes and is notprinted on the device package. Check withyour Microchip Sales Office for package
availability with the Tape and Reel option.

DS20005426G-page 54

MCP960X/L0X/RL0X
NOTES:

 2015-2021 Microchip Technology Inc.

DS20005426G-page 55

Note the following details of the code protection feature on Microchip devices:•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in theintended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to ourknowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

•

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does notmean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device
applications and the like is provided only for your convenienceand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely atthe buyer’s risk, and the buyer agrees to defend, indemnify andhold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses areconveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.

Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT,
chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex,
flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck,
LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi,
Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer,
PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire,
Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST,
SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon,
TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA
are registered trademarks of Microchip Technology Incorporated in
the U.S.A. and other countries.
APT, ClockWorks, The Embedded Control Solutions Company,
EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load,IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision
Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire,
SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, Vite, WinPath, and ZL are registeredtrademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, and Symmcom are registered trademarks of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., inother countries.
All other trademarks mentioned herein are property of theirrespective companies.
© 2019, Microchip Technology Incorporated, All Rights Reserved.

For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.

 2015-2021 Microchip Technology Inc.

ISBN: 978-1-5224-8109-6

DS20005426G-page 56

Worldwide Sales and Service
AMERICAS

ASIA/PACIFIC

ASIA/PACIFICEUROPE

Corporate Office2355 West Chandler Blvd.
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DS20005426G-page 57

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Tel: 44-118-921-5800
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 2015-2021 Microchip Technology Inc.
02/28/20