Technical-ReportInnovation with the New Plasma Source HSTC-M™:
Introduction of ICP Etching System for SiC/GaN Power Devices up to 8 Inches
Samco Inc.

▪ Introduction
Since the introduction of ICP etching systems in 1996, Samco has consistently
delivered innovative process technology and reliable systems to the compound
semiconductor market. Our proprietary Tornado ICP® coil, much like Hideo
Nomo 1, the first Japanese Major League Baseball player, has pioneered newprocesses for compound semiconductors. To date, Samco’s sales recordfor ICP etching systems exceeds 600 units. This time, we are pleased topresent a newly developed ICP etching mechanism featuring the HSTC-M™
(Hyper Symmetrical Tornado Coil - Modified). This mechanism offers a highly
uniform and stable process tailored for the compound semiconductor market,including the expanding production of SiC power devices and GaN power/RFdevices. Leveraging our extensive experience and expertise, this advanced
solution is designed for wafer sizes up to 8 inches.
▪ Hardware Features
1. New Plasma Source HSTC-M™ (Hyper Symmetrical Tornado Coil Modified):
The HSTC-M™ is an innovative upgrade of the traditional Tornado
ICP®, significantly enhancing etching uniformity across the surface.
It also enables the stable and efficient application of 2 kW RF power.
2. High Gas Flow Exhaust Structure:
The direct connection of the TMP to the reaction chamber enables ahigh-flow process of up to 1,000 sccm in the usual pressure range.
This excellent exhaust performance minimizes the re-adhesion of byproducts during the process.
3. Lower Electrode Gap Control:
The adjustable height of the lower electrode allows for recipe-dependent
adjustment of the gap between the substrate and plasma, enabling
precise tuning of the etching process.
In addition to the plasma source, exhaust structure, and lower electrodegap control, improvements to the electrostatic chuck (ESC) enhance coolingefficiency and thermal uniformity, allowing for uniform and stable etching up
to the edge of 8-inch wafers.

New Plasma Source HSTC-M RF 13.56 MHz
Uniform high-density plasma
generated by high RF Power

Direct TMP Connection
High conductance and highgas ﬂow at low pressure

electrodeelevation

TMP

Figure 1.
Reaction chamber diagram

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Electrode Gap Control
Adjustable spacing between
substrate and plasma

RF 13.56 MHz

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Technical-Report▪ System Lineup
Our new etching mechanism is integrated into a range of systems toaccommodate both research and production needs. These include the loadlock system RIE-800iP, the vacuum cassette system RIE-800iPC, and thecluster tool system Cluster H™, which can connect up to three chambers.
The RIE-800iP has been redesigned for easier maintenance around thereaction chamber. Additionally, the Cluster H™ system allows the connectionof up to three process modules equipped with the new etching mechanism,offering high productivity.
▪ Conclusion
Samco has successfully introduced numerous ICP etching systems to theresearch and development sector. In recent years, the sales of production
equipment, such as the Cluster Tool System to electronic device factories,
have witnessed a substantial increase. The newly introduced etchingmechanism with HSTC-M™ excels in in-plane controllability and process
stability for substrates up to 8 inches, significantly contributing to enhanced
yield in research, development, and production sites that demand highreproducibility. Like the impact made by Shohei Ohtani 2 as a two-way player inMajor League Baseball, we persist as a two-way player in the semiconductor
industry, catering to both research and production; developing devices andprocess technology specialized for SiC power devices and GaN power/RFdevices.

Photo 1. RIE-800iP ICP Etching System(Load-Lock Type)1 Hideo Nomo, born on August 31, 1968, is a former professional baseball player from Osaka,
Japan. He joined Nippon Professional Baseball's (NPB) Kintetsu Buffaloes in 1990 as the top
amateur pitcher. In 1995, he moved to Major League Baseball (MLB) with the Los AngelesDodgers, gaining attention for his unique tornado pitching style and earning him the Rookie ofthe Year award in his debut season. After playing for multiple MLB teams, he retired in 2008
and has since been actively involved as a coach and baseball commentator.
2 Shohei Ohtani, born on July 5, 1994, is a professional baseball player from Iwate, Japan. He
emerged as a professional baseball talent when he joined the Hokkaido Nippon-Ham Fightersin 2013. Known for playing both as a pitcher and a batter throughout the season, a style known
as "two-way play," he transferred to MLB's Los Angeles Angels in 2018. He was selected as
the Season MVP in 2021 and 2023, gaining international attention and making a significant
impact on the baseball world.

Photo 2. Cluster H™ Cluster Tool System

Samco Inc.
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