STSPIN220
Low voltage stepper motor driver
Datasheet - production data

Applications
Battery-powered stepper motor applications such
as:





Toys
Portable printers
Robotics
Point of sale (POS) devices

Description
The STSPIN220 is a stepper motor driver which
integrates, in a small QFN 3 x 3 mm package,
both control logic and a low RDS(on) power stage.
The integrated controller implements PWM
current control with fixed OFF time and a
microstepping resolution up to 1/256th of a step.

Features









Operating voltage: from 1.8 to 10 V
Maximum output current: 1.3 Arms
RDS(on) HS + LS = 0.4 Ω typ.
Microstepping up to 1/256th of a step
Current control with programmable off-time
Full protection set

Non-dissipative overcurrent protection
Short-circuit protection

Thermal shutdown
Energy saving and long battery life withstandby consumption less than 80 nA

November 2016

The device is designed to operate in batterypowered scenarios and can be forced into a zeroconsumption state, allowing a significant increasein battery life.
The device offers a complete set of protection
features including overcurrent, overtemperatureand short-circuit protection.

DocID029296 Rev 3

This is information on a product in full production.

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www.st.com

Contents

STSPIN220

Contents
1

Block diagram.................................................................................. 5

2

Electrical data .................................................................................. 6
2.1

Absolute maximum ratings ................................................................ 6

2.2

Recommended operating conditions ................................................. 6

2.3

Thermal data ..................................................................................... 7

2.4

ESD protection .................................................................................. 7

3

Electrical characteristics ................................................................ 84

Pin description .............................................................................. 10

5

Typical application ........................................................................ 12

6

Functional description .................................................................. 13
6.1

Standby and power-up .................................................................... 13

6.2

Microstepping sequencer ................................................................ 13

6.3

PWM current control ....................................................................... 17
6.3.1

OFF time adjustment ........................................................................ 19

6.4

Overcurrent and short-circuit protection .......................................... 20

6.5

Thermal shutdown ........................................................................... 23

7

Graphs............................................................................................ 24

8

Package information ..................................................................... 26
8.1

VFQFPN 3x3x1.0 16L package information .................................... 26

9Ordering information..................................................................... 28

10

Revision history ............................................................................ 29

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STSPIN220

List of tables

List of tables
Table 1: Absolute maximum ratings ........................................................................................................... 6
Table 2: Recommended operating conditions ............................................................................................ 6
Table 3: Thermal data ................................................................................................................................. 7
Table 4: ESD protection ratings .................................................................................................................. 7
Table 5: Electrical characteristics ............................................................................................................... 8
Table 6: Pin description ............................................................................................................................ 10
Table 7: Typical application values ........................................................................................................... 12
Table 8: Step mode selection through MODEx inputs .............................................................................. 13
Table 9: Target reference and current direction according to sequencer value (full-step mode) ............. 15
Table 10: Target reference and current direction according to sequencer value (not full-step mode) ..... 16
Table 11: Example .................................................................................................................................... 16
Table 12: ON, slow decay and fast decay states ..................................................................................... 18
Table 13: Recommended RRCOFF and CRCOFF values according to ROFF ................................................... 20
Table 14: VFQFPN 3x3x1.0 16L package mechanical data..................................................................... 27
Table 15: Ordering information ................................................................................................................. 28
Table 16: Document revision history ........................................................................................................ 29

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List of figures

STSPIN220

List of figures
Figure 1: Block diagram .............................................................................................................................. 5
Figure 2: Pin connection (top view) .......................................................................................................... 10
Figure 3: Typical application schematic .................................................................................................... 12
Figure 4: STCK and DIR timing ................................................................................................................ 14
Figure 5: Mode selection example ............................................................................................................ 15
Figure 6: PWM current control sequence ................................................................................................. 19
Figure 7: OFF time regulation circuit ........................................................................................................ 19
Figure 8: OFF time vs. ROFF value .......................................................................................................... 20
Figure 9: Overcurrent and short-circuit protection management .............................................................. 21
Figure 10: Disable time versus REN and CEN values (VDD = 3.3 V) ...................................................... 22
Figure 11: Disable time versus REN and CEN values (VDD = 1.8 V) ...................................................... 22
Figure 12: Thermal shutdown management ............................................................................................. 23
Figure 13: Power stage resistance versus supply voltage ....................................................................... 24
Figure 14: Power stage resistance versus temperature ........................................................................... 24
Figure 15: Overcurrent threshold versus supply voltage .......................................................................... 25
Figure 16: VFQFPN 3x3x1.0 16L package outline ................................................................................... 26
Figure 17: VFQFPN 3x3x1.0 16L recommended footprint ....................................................................... 27

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DocID029296 Rev 3

STSPIN220

1

Block diagram

Block diagram
Figure 1: Block diagram

DocID029296 Rev 3

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Electrical data

STSPIN220

2

Electrical data

2.1

Absolute maximum ratings
Table 1: Absolute maximum ratings
Symbol

2.2

Testcondition

Parameter

Value

Unit

VS

Supply voltage-0.3 to 11

V

VIN

Logic input voltage-0.3 to
5.5

V

VOUT VSENSE

Output-to-sense voltage drop

Up to 12V

VS - VOUT

Supply-to-output voltage drop

Up to 12V

VSENSE

Sense pin voltage-1 to 1V

VREF

Reference voltage input-0.3 to 1

V

IOUT,RMS

Continuous power stage output current (eachbridge)

1.3

Arms

Tj,OP

Operative junction temperature-40 to150°C

Tj,STG

Storage junction temperature-55 to150°C

Recommended operating conditions
Table 2: Recommended operating conditions
Symbol

6/30

Parameter

Test condition

Min

Typ

Max

Unit

VS

Supply voltage

1.8

10

V

VIN

Logic input voltage

0

5

V

VREF

Reference voltage input

0.1

0.5

V

tINw

Logic inputs positive/negative pulse width

300

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STSPIN220

2.3

Electrical data

Thermal data
Table 3: Thermal data
SymbolParameter

Conditions

Value

Unit

Rth(JA)

Junction to ambient thermal
resistanceNatural convection, according to
JESD51-2a(1)

57.1

°C/W

RthJCtop

Junction to case thermal resistance(top side)

Simulation with cold plate on
package top

67.3

°C/W

RthJCbot

Junction to case thermal resistance(bottom side)

Simulation with cold plate on
exposed pad

9.1

°C/W

RthJB

Junction to board thermal resistanceAccording to JESD51-8(1)

23.3

°C/W

Junction to top characterization

According to JESD51-2a(1)

3.3

°C/W

Junction to board characterization

According to JESD51-2a(1)

22.6

°C/W

ψJT
ψJB
Notes:(1)Simulated on a 21.2x21.2 mm board, 2s2p 1 Oz copper and four 300 µm vias below exposed pad.

2.4

ESD protection
Table 4: ESD protection ratings
SymbolParameter

Test condition

Class

Value

Unit

HBM

Human body model

Conforming to ANSI/ESDA/JEDEC JS-0012014

H2

2

kV

CDM

Charge device
model

Conforming to ANSI/ESDA/JEDEC JS-0022014

C2a

500

V

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Electrical characteristics

3

STSPIN220

Electrical characteristics
Test conditions: VS = 5 V, Tj = 25 °C unless otherwise specified.
Table 5: Electrical characteristics
SymbolParameter

Test condition

Min

Typ

Max

Unit

VSth(ON)

VS turn-on voltage

VS rising from 0 V

1.45

1.65

1.79

V

VSth(OFF)VS turn-off voltage

VS falling from 5 V

1.3

1.45

1.65

V

VSth(HYS)

VS hysteresis voltage

Supply

IS

180

mV

No commutations
EN = ‘0’
ROFF = 160 kΩ

960

1300

μA

No commutations
EN = ‘1’
ROFF = 160 kΩ

1500

1950

μA

STBY = 0 V

10

80

nA

0.9

V

VS supply current

IS,STBY

VS standby current

VSTBYL

Standby low logic level
input voltage

VSTBYH

Standby high logic level
input voltage

1.48

V

Power stage

RDS(on)HS+LS

Total ON resistance HS+ LS

VS = 10 V,
IOUT = 1.3 A

0.4

0.65

VS = 10 V,
IOUT = 1.3 A,
Tj = 125 °C(1)

0.53

0.87

VS = 3 V,
IOUT = 0.4 A

0.53

0.8

OUTx = VS
IDSS

Ω

1

Leakage currentµA
OUTx = GND

-1

VDF

Freewheeling diodeforward voltage

ID = 1.3 A

0.9

V

trise

Rise time

VS = 10 V;
unloaded outputs

10

ns

tfall

Fall time

VS = 10 V;
unloaded outputs

10

ns

tDT

Dead time

50

ns

Current control
VSNS,OFFSET

8/30

Sensing offset

VREF = 0.5 V;Internal reference 20%
VREF

DocID029296 Rev 3

-15

+15

mV

STSPIN220

Electrical characteristics
SymboltOFF

Parameter

Test condition

Total OFF time

Min

Typ

Max

Unit

ROFF = 10 kΩ

9µs

ROFF = 160 kΩ

125

µs

ΔfOSC

Internal oscillator
precision (fOSC/fOSC,ID)

ROFF = 20 kΩ

20%tOFF,jitter

Total OFF time jittering

ROFF = 10 kΩ

tOFF,SLOW

Slow decay time

5/8 ×
tOFF

µs

tOFF,FAST

Fast decay time

3/8 ×
tOFF

µs

+20%
2%

Logic IOs
VIH

High logic level input
voltage

VIL

Low logic level input
voltage

0.6

V

VRELEASE

FAULT open drain
release voltage

0.4

V

VOL

EN Low logic level
output voltage

0.4

V

RSTBY

STBY pull-downresistance

36

kΩ

IPDEN

EN pull-down current

10.5

µA

tENd

EN input propagation
delay

From EN falling edge to
OUT high impedance

55

ns

tMODEho

MODEx input hold time

From STBY edge(2)

100

µs

tMODEsu

MODEx input setup
time

From STBY edge(2)

1

µs

tDIRh

DIR input hold time

From STCK rising edge(3)

100

ns

tDIRsuDIR input setup time

From STCK rising edge(3)

100

ns

STCK high time

(3)

100

ns

STCK low time

(3)

100

ns

STCK inputs frequency(3)

tSTCKHtSTCKL
fSTCK

1.6

V

IEN = 4 mA

1

MHz

Protections
TjSD

Thermal shutdown
threshold

160°C

TjSD,Hyst

Thermal shutdown
hysteresis

40

°C

IOC

Overcurrent threshold

2

A

See Figure 15

Notes:(1)Based on characterization data on a limited number of samples, not tested during production.
(2)See Figure 5.
(3)See Figure 4.

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Pin description

4

STSPIN220

Pin description
Figure 2: Pin connection (top view)

Note: The exposed pad must be connected to ground.
Table 6: Pin description

10/30

N.

Name

Type

Function1

DIR\MODE4

Logic input

Direction input, Step mode selection input 4.

2

STCK\MODE3

Logic input

Step clock input, Step mode selection input 3.

3

OUTA1

Power output

Power bridge output side A1.

4

SENSEA

Power output

Sense output of the bridge A.

5

OUTA2

Power output

Power bridge output side A2.

6

VS

SupplyDevice supply voltage.

7,
EPAD

GND

GroundDevice ground.

8

OUTB2

Power output

Power bridge output side B2.

9

SENSEB

Power output

Sense output of the bridge B.

10

OUTB1

Power output

Power bridge output side B1.

11

REF

Analog input

Reference voltage for the PWM current control
circuitry.

12

TOFF

Analog inputInternal oscillator frequency adjustment.

13

EN\FAULT

Logic
input\Opendrain output

Logic input 5 V compliant with open drain output.
This is the power stage enable (when low, the powerstage is turned off) and is forced low through the
integrated open-drain MOSFET when a failure occurs.

14

STBY\RESET

Logic input

Logic input 5 V compliant.
When forced low, the device is forced into low
consumption mode.

15

MODE2

Logic input

Step mode selection input 2.

DocID029296 Rev 3

STSPIN220

Pin description
N.

Name

Type

16

MODE1

Logic input

Function
Step mode selection input 1.

DocID029296 Rev 3

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Typical application

5

STSPIN220

Typical application
Table 7: Typical application values
Name

Value

CS

2.2 µF / 16V

CSPOL

22 µF / 16V

RSNSA, RSNSB

330 mΩ / 1W

CEN

10 nF / 6V3

REN

18 kΩ

CSTBY

1 nF / 6V3

RSTBY

18 kΩ

COFF

22 nF

RCOFF

1 kΩ

ROFF

47 kΩ (tOFF ≅ 37 µs)

Figure 3: Typical application schematic

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STSPIN220

6Functional description

Functional description
The STSPIN220 is a stepper motor driver integrating a microstepping sequencer (up to
1/256th of a step), two PWM current controllers and a power stage composed of two fullyprotected full-bridges.

6.1

Standby and power-up
The device provides a low consumption mode forcing the STBY\RESET input below the
VSTBYL threshold.
When the device is in standby status, the power stage is disabled (outputs are in highimpedance) and the supply to the integrated control circuitry is cut off. When the device
exits the standby status, all of the control circuitry is reset to power-up condition.

6.2

Microstepping sequencer
The value of the MODEx inputs is latched at power-up and when the device exits the STBY
condition. After this, the input value is unimportant and the MODE3 and MODE4 inputs
start operating as step-clock and direction input.
The only exception is the MODE1 = MODE2 = LOW condition; in this case the system isforced into full-step mode. The previous condition is restored as soon as the MODE1 and
MODE2 inputs switch to a different combination.
An example of mode selection is shown in Figure 5.
At each STCK rising edge, the sequencer of the device is increased (DIR input high) or
decreased (DIR input low) of a module selected through the MODEx inputs as listed inTable 8.
The sequencer is a 10-bit counter that sets the reference value of the PWM current
controller and the direction of the current for both of the H bridges.
Table 8: Step mode selection through MODEx inputs
MODE3(STCK)

MODE4
(DIR)

MODE1

MODE2

Step mode

0

0

0

0

Full-step

0

0

0

1

1/32nd step

0

0

1

0

1/128th step

0

0

1

1

1/256th step

0

1

0

0

Full-step - 1/32nd step(1)

0

1

0

1

1/4th step

0

1

1

0

1/256th step

0

1

1

1

1/64th step

1

0

0

0

Full-step - 1/128nd step(1)

1

0

0

1

1/256th step

1

0

1

0

1/2 step

1

0

1

1

1/8th step

1

1

0

0

Full-step - 1/256th step(1)DocID029296 Rev 3

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Functional description

STSPIN220

MODE3(STCK)

MODE4
(DIR)

MODE1

MODE2

Step mode

1

1

0

1

1/64th step

1

1

1

0

1/8th step

1

1

1

1

1/16th step

Notes:(1)This driving mode is automatically bypassed by the MODE1 = MODE2 = 0 if it is kept after the device quit thestandby condition.

Figure 4: STCK and DIR timing

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STSPIN220

Functional description
Figure 5: Mode selection example

When the full-step mode is set, the reference value of the PWM current controller and the
direction of the current for both H bridges as listed in Table 9.
Table 9: Target reference and current direction according to sequencer value (full-step mode)
Phase A
Sequencer value

Phase B

Referencevoltage

Current
direction

Referencevoltage

Current
direction

0

0

X

X

X

X

X

X

X

X

100% × VREF

A1 → A2

100% × VREF

B1 → B2

0

1

X

X

X

X

X

X

X

X

100% × VREF

A1 → A2

100% × VREF

B1 ← B2

1

0

X

X

X

X

X

X

X

X

100% × VREF

A1 ← A2

100% × VREF

B1 ← B2

1

1

X

X

X

X

X

X

X

X

100% × VREF

A1 ← A2

100% × VREF

B1 → B2

When the step mode is different from the full-step mode the values listed in Table 10 are
used.

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Functional description

STSPIN220

Table 10: Target reference and current direction according to sequencer value (not full-step
mode)
Phase A
Sequencer value

0

0

0

0

0

1

0

1

1

0

1

0

1

1

1

1

0

0

0

0

0

0

0

0

N

0

0

0

0

0

0

0

0

N

0

0

0

0

0

0

0

0

N

0

0

0

0

0

0

0

N

0

Phase B

Referencevoltage

Current
direction

Referencevoltage

Current
directionZero(power bridge
disabled)-

100% × VREF

B1 → B2Sin(N/256 ×π/2) × VREF

A1 → A2

Cos(N/256 ×π/2) × VREF

B1 → B2

100% × VREF

A1 → A2

Zero(power bridge
disabled)-

Sin(π/2 +N/256 × π/2) ×
VREF

A1 → A2

Cos(π/2 +N/256 × π/2) ×
VREF

B1 ← B2

Zero(power bridge
disabled)-

100% × VREF

B1 ← B2Sin(N/256 ×π/2) × VREF

A1 ← A2

Cos(N/256 ×π/2) × VREF

B1 ← B2

100% × VREF

A1 ← A2

Zero(power bridge
disabled)-

Sin(π/2 +N/256 × π/2) ×
VREF

A1 ← A2

Cos(π/2 +N/256 × π/2) ×
VREF

B1 → B2

The following table shows the target reference and sequencer values for 1/2-, 1/4- and 1/8step operation. Higher microstepping resolutions follow the same pattern. The reset state(home state) for all stepping mode is entered at power-up or when the device exits thestandby status.
Table 11: Example
1/2 step

1/4 step

1/8 step

VREF phase A

VREF phase B

1

1

1

0%

100%

Sequencer value
0000000000
home state

2

2

3

4

3

16/30

5

2

19.509%98.079%0000100000

338.268%92.388%0001000000

455.557%83.147%0001100000

570.711%70.711%0010000000

683.147%55.557%0010100000

792.388%19.509%0011100000

898.079%19.509%0011100000

9

100%

0%

0100000000

DocID029296 Rev 3

STSPIN220

Functional description
1/2 step

1/4 step

6

4

7

8

5

9

10

6

11

12

7

13

14

8

15

16

1/8 step

VREF phase A

VREF phase B

Sequencer value

10

98.079%-19.509%

0100100000

1192.388%-38.268%0101000000

12

83.147%-55.557%

0101100000

1370.711%-70.711%0110000000

1455.557%-83.147%

0110100000

1538.268%-92.388%0111000000

1619.509%-98.079%

1000100000

17

0%

100%

1000000000

18-19.509%-98.079%

1000100000

19-38.268%-92.388%

1001000000

20-55.557%-83.147%

1001100000

21-70.711%-70.711%1010000000

22-83.147%-55.557%

1010100000

23-92.388%-38.268%

1011000000

24-98.079%-19.509%

1011100000

25

-100%

0%

1100000000

26-98.079%

19.509%1100100000

27-92.388%

38.268%1101000000

28-83.147%

55.557%1101100000

29-70.711%70.711%1110000000

30-55.557%

83.147%1110100000

31-38.268%

92.388%1111000000

32-19.509%

98.079%1111100000

The positive number means that the output current is flowing from OUTx1 toOUTx2, vice versa for a negative value.

6.3

PWM current control
The device implements two independent PWM current controllers, one for each full bridge.
The voltage of the sense pins (VSENSEA and VSENSEB) is compared to the respective internalreference generated based on the sequencer value (see Table 9 and Table 10).
When VSENSEX > VREFX, the integrated comparator is triggered, the OFF time counter isstarted and the decay sequence is performed.
The decay sequence starts turning on both the low sides of the full bridge. When 5/8 ths ofthe programmed OFF time (tOFF,SLOW ) has expired, the decay sequence performs a quasisynchronous fast decay.

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Functional description

STSPIN220
Table 12: ON, slow decay and fast decay states

Current direction(1)ON

Slow decay

Fast decay (quasi-synch)

Zero (power bridge disabled)

HSX1 = OFF
LSX1 = OFF
HSX2 = OFF
LSX2 = OFF

HSX1 = OFF
LSX1 = OFF
HSX2 = OFF
LSX2 = OFF

HSX1 = OFF
LSX1 = OFF
HSX2 = OFF
LSX2 = OFF

HSX1 = ON

HSX1 = OFF
LSX1 = ON

HSX1 = OFF
LSX1 = ON

HSX2 = OFF
LSX2 = ON

HSX2 = OFF
LSX2 = OFF

HSX1 = OFF
LSX1 = ON

HSX1 = OFF
LSX1 = OFF
HSX2 = OFF
LSX2 = ON

X1 → X2

X1 ← X2

LSX1 = OFF
HSX2 = OFF
LSX2 = ON
HSX1 = OFF
LSX1 = ON
HSX2 = ON
LSX2 = OFF

HSX2 = OFF
LSX2 = ON

Notes:(1)The current direction is set according to Table 9 and Table 10 .

The reference voltage value, VREF, must be selected according to the load current target
value (peak value) and sense resistor value.
Equation 1

In choosing the sense resistor value, two main issues must be taken into account:




18/30

The sense resistor dissipates energy and provides dangerous negative voltages on
the SENSE pins during current recirculation. For this reason the resistance of thiscomponent should be kept low (using multiple resistors in parallel will help to obtain
the required power rating with standard resistors).
The lower the RSNSx value, the higher the peak current error due to noise on the V REF
pin and the input offset of the current sense comparator. Values of R SNSx that are too
low must be avoided.

DocID029296 Rev 3

STSPIN220

Functional description
Figure 6: PWM current control sequence

6.3.1

OFF time adjustment
The total OFF time (slow decay + fast decay) is adjusted through an external resistor
connected between the TOFF pin and ground, as shown in Figure 7. A small RC series
must be inserted in parallel with the regulator resistor in order to increase the stability of theregulation circuit according to Table 12 indications.
Figure 7: OFF time regulation circuit

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Functional description
STSPIN220
The relationship between the OFF time and the external resistor value is shown in Figure 8.
The value typically ranges from 10 µs to 150 µs.
Table 13: Recommended RRCOFF and CRCOFF values according to ROFFROFFRRCOFF

CRCOFF

10 kΩ ≤ ROFF < 82 kΩ

1 kΩ

22 nF

82 kΩ ≤ ROFF ≤ 160 kΩ

2.2 kΩ

22 nF

Figure 8: OFF time vs. ROFF value

6.4

Overcurrent and short-circuit protection
The device embeds circuitry protecting each power output against overload and shortcircuit conditions (short to ground, short to VS and short between outputs).
When the overcurrent or short-circuit protection is triggered, the power stage is disabled
and the EN\FAULT input is forced low through the integrated open-drain MOSFET
discharging the external CEN capacitor (refer to Figure 9).
The power stage is kept disabled and the open-drain MOSFET is kept ON until the
EN\FAULT input falls below the VRELEASE threshold, then the CEN capacitor is charged
through the external REN resistor.

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STSPIN220

Functional description
Figure 9: Overcurrent and short-circuit protection management

The total disable time after an overcurrent event can be set by properly sizing the external
network connected to the EN\FAULT pin (refer to Figure 9):
Equation 2

But tcharge is normally much higher than tdischarge, thus we can consider the following:
Equation 3

where VDD is the pull-up voltage of the REN resistor.

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Functional description

STSPIN220
Figure 10: Disable time versus REN and CEN values (VDD = 3.3 V)

Figure 11: Disable time versus REN and CEN values (VDD = 1.8 V)

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STSPIN220

6.5

Functional description

Thermal shutdown
The device embeds circuitry protecting it from overtemperature conditions.
When the thermal shutdown temperature is reached, the power stage is disabled and the
EN\FAULT input is forced low through the integrated open-drain MOSFET (refer to Figure
12).
The protection and the EN\FAULT output are released when the IC temperature returns toa safe operating value (TjSD - TjSD,Hyst).
Figure 12: Thermal shutdown management

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Graphs

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GraphsFigure 13: Power stage resistance versus supply voltage

Figure 14: Power stage resistance versus temperature

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GraphsFigure 15: Overcurrent threshold versus supply voltage

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Package information

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Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.

8.1

VFQFPN 3x3x1.0 16L package information
Figure 16: VFQFPN 3x3x1.0 16L package outline

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Package information
Table 14: VFQFPN 3x3x1.0 16L package mechanical data
Dimensions(mm)Symbol

A

Min.

Typ.

Max.

Notes

0.80

0.90

1.00

(1)

A1

0.02

A3

0.20

b

0.18

0.25

0.30

D

2.85

3.00

3.15

D2

1.70

1.80

1.90

E

2.85

3.00

3.15

E2

1.70

1.80

1.90

e
L

0.50
0.45

0.50

0.55

Notes:(1)VFQFPN stands for "thermally-enhanced very thin fine pitch quad package, no lead". Very thin: 0.80 < A ≤ 1.00

mm / Fine pitch: e < 1.00 mm. The pin 1 identifier must be present on the top surface of the package as anindentation mark or other feature of the package body.

Figure 17: VFQFPN 3x3x1.0 16L recommended footprint

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Ordering information

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Ordering information
Table 15: Ordering information

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Order code

Package

Packaging

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VFQFPN 3x3x1.0 16L

Tape & reel

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Revision history

Revision history
Table 16: Document revision history
Date

Version

06-May2016

1

Initial release.

30-Jun2016

2- Updated document status to Datasheet - production data on page 1.
- Updated Table 1 (changed Max. value of VS from 12 to 11) and Table 7(changed tOFF value from ≅47 µs to ≅37 µs).

3

- Updated Figure 1 in Section 1: "Block diagram" (replaced by new figure).
- Updated Table 2 in Section 2.2: "Recommended operating conditions"(added tINw symbol).
- Updated Table 3 in Section 2.3: "Thermal data"(replaced by new table).
- Updated Table 8 in Section 6.2: "Microstepping sequencer" [removed"Sequencer module (binary)" column].
- Added Table 11 in Section 6.2: "Microstepping sequencer".
- Updated Table 13 in Section 6.3.1: "OFF time adjustment" (updated title).
- Updated Figure 13 in Section 7: "Graphs" (replaced by new figure).
- Minor modifications throughout document.

29-Nov2016

Changes

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STSPIN220
IMPORTANT NOTICE – PLEASE READ CAREFULLYSTMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, andimprovements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST
products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of orderacknowledgement.

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or thedesign of Purchasers’ products.

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Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.

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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.

© 2016 STMicroelectronics – All rights reserved

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