Technology to Enhanceyour ZEISS 3D X-ray
Microscope
ZEISS Advanced Reconstruction Toolbox

To obtain useful 3D volumetric dataResolution

from X-ray microscopy, 2D projections
first need to be interpreted and combined

Contrast

using tomographic image reconstruction
algorithms. Such reconstruction technol-

Image quality (e.g. CNR)

ogies typically have certain requirements,
Throughput

assumptions, advantages, and drawbacks
that make them specifically well-suited

Sample size/types

to particular applications. Many different
techniques are available that enable
incremental performance to be extractedfrom datasets but may not be universallyapplicable across all sample classes, applications, or usage modes. The Advanced

ART forZEISS X-ray Microscopes

Ease-of-use
Unique workflows (e.g. In situ)

ART Benefits over Traditional FDK

Reconstruction Toolbox (ART) from ZEISS
is aimed at making these techniques
available to increase the performance

sequentially and image processing andTo reconstruct a 3D volume from aof 3D X-ray microscopes in their specificanalysis workflows are well understood),

series of sequentially acquired 2D

applications and use cases. The perfor-the slowest step is image acquisition

X-ray projections, traditionally FDK

mance improvements that can be achieved

and subsequent reconstruction. Even in(Feldkamp-Davis-Kress algorithm) filteredwith ART can be in terms of throughput,

academic environments where ROI is lessback projection in cone beam CT geometry

image quality, field of view, and ease ofof a concern, but where optimization ofreconstruction is used. This techniqueuse. This toolbox acts as a platform tosystem usage should be considered, in situ

works well with many views, however,launch the next series of ground-breaking

analyses can require very high absolute

relies on the assumption that theinnovations from ZEISS X-ray Microscopy.

temporal resolutions when performing

data is “well sampled” and does not

4D (time-resolved) scanning. Beyond thiscontain significant noise.

Optimize each step in the production

requirement, the analysis of subtle chem-of actionable information

ical or compositional differences, which

For 3D X-ray microtomography, these

may only exhibit very slight greyscale or

steps typically consist of sample mounting,textural contrasts, requires extremely low

scan setup, 2D-projection image acqui-noise levels for accurate segmentation

sition, 2D to 3D image reconstruction,and classification. This means that evenimage post-processing and segmentation,

when acquisition time is less of a concern,and final analysis. In repetitive workflows

image quality may require the use of(where many similar samples are run

advanced reconstruction technologies.

These assumptions are frequently broken
in the interests of improving throughput
by reducing total tomography acquisition
time or for difficult-to-image samples orwhen pushing the boundaries of systemcapabilities, leading to excessive noise in
the reconstructed image. This, in turn,leads to errors in segmentation and any
resulting analysis of the data.
Unique ZEISS ART offerings leverage AI

1 mmStandard resolution – 10 µm/voxel

FDK (Np = 720)

DeepScout recovered resolution – 2.1 μm/voxel

FDK (Np = 360)

DeepRecon (Np = 360)

and a deep understanding of both X-ray
physics and customer applications to solve
some of the hardest imaging challenges
in new and innovative ways.
DeepScout: resolution recovery at full fieldof view for access to both fine details and
DeepRecon Pro (aluminum casting) – superior image quality with less noise in half the number of projections

DeepRecon Pro: submicron resolution
with resolution at a distance that is 10X
faster or shows significantly improved
image quality across diverse sample types
PhaseEvolve: enhanced image contrast
for low-medium (low-Z) density samples
with improved segmentation

100 µmBerea sandstone without PhaseEvolve

Berea sandstone with PhaseEvolve

Without MARS – metal implant in boneWith MARS – metal implant in boneMaterials Aware Reconstruction
Solution (MARS): artifact reduction forimproved image quality, especially for
dense, high-Z materials next to lightmaterials, e.g., metal implants in bone
OptiRecon: statistical iterative reconstruction enabling reduced sampling artifacts
for 4X faster throughput or better image
quality
These technologies significantly improve
the performance of X-ray microscopes
and CT platforms for materials science,biosciences, geoscience, semiconductor
and electronics, industrial quality andcontrol, metals, additive manufacturing,and other fields.

500 µmStandard reconstruction – 18650 battery,
6000 projections
microscopy@zeiss.com
www.zeiss.com

OptiRecon – 18650 battery, 1500 projections
4X throughput improvement with good image quality

Not for therapeutic use, treatment or medical diagnostic evidence. Not all products are available in every country. Contact your local ZEISS representative for more information.
EN_44_012_105 | CZ 03-2023 | Design, scope of delivery and technical progress subject to change without notice. | © Carl Zeiss Microscopy GmbH

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