Annual Report 2023 / 2024

Crossing Frontiersin Microelectronics

Annual Report 2023 / 2024

Crossing Frontiersin Microelectronics

Fraunhofer IZM | Annual Report 2023 / 2024»

Fraunhofer IZM‘shigh-end performance
packaging not only
enables solutions for
future industries, butalso makes a vital­contribution to European technologicalsovereignty.«
Prof. Martin Schneider-Ramelow
Director of Fraunhofer IZM

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Content

Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Fraunhofer IZMCore Competencies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Department System Integration & Interconnection Technologies . . . . . . . . . . . . . 8
Department Wafer Level System Integration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Department Environmental & Reliability Engineering . . . . . . . . . . . . . . . . . . . . . 10
Department RF & Smart Sensor Systems. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Fraunhofer IZM online . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
In the Spotlight . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Fraunhofer – A Strong Network . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Business Units & Industry Sectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Laboratories & Services . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Events & Promoting Young Talents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Facts & Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Fraunhofer IZM in Facts and Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Awards, Dissertations, Editorials. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lectures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Cooperation with Universities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Cooperation with Industry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memberships . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Publications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Patents & Inventions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Advisory Board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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Contact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Imprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

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Fraunhofer IZM | Annual Report 2023 / 2024

Preface

Dear readers!
The aftershocks of a global pandemic, the ongoing Russian war on Ukraine,
and a volatile energy market: The last year has been challenging, not least for
sectors of industry as dependent on resources as microelectronics.
This makes it even more satisfying for me to be able to report that Fraunhofer
IZM can look back to a very successful year indeed despite all of the ­headwindin the economy. The technologies developed at the Institute are in great demandin the industry and will have a major impact on our society and way of life.
Chiplet assembly, hybrid bonding, Si-interposer technologies, fan-out
wafer-level packaging, cryo-packaging, integration of high-bandwidth memory(HBMs), RF characterization, or packaging for 5G / 6G applications: This is only
a selection of the many fundamental technologies that are needed for the
microelectronics of tomorrow. Taking just one example: Cryogenic packaging
is paving the way for ultrafast quantum computing, which will be essential for
handling the unimaginable immense datasets used by AI systems. Or think of
the Zn-H2 project, where Fraunhofer IZM is researching novel forms of energy
storage using zinc-hydrogen technology.
The increasingly vocal call for more sustainable design and production processes for electronics is finding its echo in the more and more ambitious carbon
reduction goals that many companies are committing to.

4Preface

These are just some of the many highlights of the last twelve
months:The »Green ICT @ FMD« project funded by the Federal
Ministry of Education and Research has passed some key
milestones on its way towards creating a center of competence for greener and more resource-conscious IT andcommunication technology.
The »FANOPa« project (funded by the Senate of Berlin) has
produced a fan-out wafer-level packaging platform for RF
applications, with a pilot production line for prototypes andmulti-project wafers established for the purpose.
Within the European Chips Act, Fraunhofer IZM is part ofseveral initiatives designed to strengthen the continent’s
semiconductor industry. As a contribution to the EU Chips
Act, a European consortium under the leadership of the
Research Fab Microelectronics Germany (FMD) plans toestablish the most comprehensive and advanced pilot linefor »Advanced Heterogeneous System Integration andAdvanced Packaging« in the coming years.

One cornerstone of the innovative research done at Fraunhofer
IZM is our close cooperation with partner universities, which
we were able to intensive last year:
At the Technical University of Berlin’s Research Center for
Microperipheric Technologies, new DFG-funded projects werelaunched that will bring about an even closer connection
between fundamental and applied research. Our partnershipwith Fraunhofer IPMS on the development of the Center for
Advanced CMOS & Heterointegration Saxony is continuing
apace and will contribute substantially to strengthening what
has come to be called »Silicon Saxony«. We also need tomention the close partnership with the Technical University
of Dresden: Working with Professor Julia Pancheko, honorary
professor for »Nanomaterials for Electronic Packaging«, weare creating optimized miniature interconnects on the basis ofinnovative nano-materials and nano-structured surfaces.
Our cooperation with BTU Cottbus-Senftenberg is goingstrong as part of the iCampus, and our dedicated IZM site for»High-Frequency Sensors & High-Speed Systems« is being
expanded. It has been a year now that Professor Ivan Ndip,
department head at Fraunhofer IZM, has held the chair there.
Bioelectronics is also attracting increasing interest, and theInstitute is cooperating with the Technical University of Delfton the successful development of a neuronal interface forcontrolling smart and tactile prosthetics.

Frontiers in Microelectronics« was our motto when we welcomed many representatives from academia, industry, andpolitics. We thank everyone who attended or sent us their best
wishes for our Institute’s birthday!
Alongside research and our close partnerships with the industry, we placed particular emphasis on training and young talentlast year. Our ten apprentices in technical and non-technicalfunctions were able to acquire invaluable know-how and skills
to prepare them for one of the industries of the future. The
Institute is also supporting students completing their master’s
degrees or doctorates, becoming a hothouse for scientifictalent. Supporting this talent is one of our express ambitions
at the Institute. We also offered young men and women thegreat opportunity to experience the work of Fraunhofer IZM
at first hand by welcoming 24 school interns and four young
people completing their voluntary environmental service year
at the Institute.
We can see our positive track record of the last year reflectedin our hard facts and figures as well. Roughly 450 people areworking at our three sites and helped raise our commercial
results to 33.9 million euros last year. Our operating budget
also increased, specifically to 42.3 million euros.
A result this positive in a market this troubled is only possible
thanks to the highly motivated people of Fraunhofer IZM who
deserve my particular thanks for this achievement. Without
your passion and commitment, we would certainly never get
the innovative and groundbreaking research we do at Fraunhofer IZM.
We also need to thank our partners in science and industry
for the invaluable impulses and hands-on expertise help make
Fraunhofer IUM one of the premier research institutions for
system integration and reliable microelectronics.
I wish our readers an enjoyable time with our annual reportand hope they can share out optimism about the future whatever crises and uncertainties it may hold!
Yours,

Martin Schneider-Ramelow
Director

We like to keep our eyes fixed on the future at the Institute.
But this year, we also had occasion to look back at 30 years
of Fraunhofer IZM history and to mark our anniversary witha dedicated conference and a gala celebration. »Crossing5Fraunhofer IZM | Annual Report 2023 / 2024

High-End Performance Packaging
High-performance systems at lower costs - that is thepromise of hetero-integration and technologies likechiplet architectures. The QR code links to an interactive illustration of high-end performance packaging
that shows where the technology is heading and whichnovel capabilities Fraunhofer IZM already has in store inits technology portfolio.
6Core Competencies

Core Competencies
From Wafer to System

Intelligent electronic systems – available everywhere and to everyone! In order to make thispossible, components need to have exceptional properties. Depending on the application, they need to function reliably at hightemperatures, be extremely miniaturized andmoldable to individual build spaces or evenflexible, and have outstanding lifetime.
The Fraunhofer Institute for Reliability andMicrointegration IZM helps companies aroundthe world develop and assemble robust andreliable electronics to the very cutting edge
and then integrate them into the required
application. With 450 employees, the institutedevelops adapted system integration technologies on wafer, chip and board level. Research
at Fraunhofer IZM means designing more reliable electronics and making reliable lifetime
predictions.

Working together with
Fraunhofer IZM
Fraunhofer IZM’s research results are highly
relevant to industries such as the automotive industry, medical engineering, industrial
electronics and even lighting and textiles.
Semiconductor manufacturers and suppliersof related materials, machines and equipment, but also small companies and startups
can choose the approach that best suits
their needs – from easily accessible standard
technologies through to high-end disruptive
innovation. As partners, our customers profit
from the advantages of contract research,by selecting between exclusive release of a
product innovation, improving a workflow or
qualifying and certifying a process.

Contract research
Often a successful cooperation project begins
with a preliminary consultation phase that is
usually free of charge. Fraunhofer only begins
billing for its research and development
services once the parameters of the cooperation have been defined. Customers retain
ownership of the material project outcomesdeveloped within their contract, as well as theapplicable usage rights to the produced inventions, property rights and the know-how.

Project funding
Some development challenges requirepre-competitive research. In these cases,
teaming up with companies and research
institutes and public funding support is more
effective than operating solo. The institutecooperates closely with numerous universities,
including the Technical Universities of Berlinand Dresden and the BTU Cottbus-Senftenberg, to ensure that the preparation for futurecooperation with industry is optimal.

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Fraunhofer IZM | Annual Report 2023 / 2024

System Integration &Interconnection Technologies

Highly miniaturized edge
IOT module

The »System Integration and Interconnection
Technologies« (SIIT) department is the largest
in the institute. Its work focuses on heterogeneous system integration. The combination ofvarious materials, devices, and technologies
opens up a wide range of application areas
such as medical engineering, automobile
production, aviation, industrial electronics, orcommunication technology. Highly integrated
electronic and photonic systems, modules,
and packages are developed and manufactured for specific individual requirements. The
complete value creation chain of the individual
products from conception, design, and technology development to industrializable production is covered. The department f­ ocuseson the design, implementation and analysis ofpower electronic and photonic systems.
Our scope of services includes, for example:

Contact

Dr. Tanja Braun
tanja.braun@izm.fraunhofer.de
Dr. Andreas Ostmann
andreas.ostmann@izm.fraunhofer.de8Electronic and photonic circuit carriers:
multilayer conventional, rigid, and flexible
printed circuit boards, partly with integrated components; mold packages withrewiring; integration of optical waveguides
in printed circuit boards
Conformables: stretchable, thermoplastic,
and textile assemblies
Assembly: high-precision chip placement;
automated SMD assembly; flip-chip technology; automated optical fiber coupling,
and micro-optics assemblyInterconnection technologies: soldering;
sintering; transient liquid phase bonding (TLPB) and bonding of components;
micro-optics and chips; wire and ribbon

bonding; galvanic metal deposition andsputtering; screen printing, stencil printing,and contactless material dosing by jets;
application of polymer lenses; integrated
optical waveguides in thin glass; development of new interconnection technologies
Encapsulation: embedding in printed circuitboards; transfer and compression molding;potting and protective lacquering; under­
filling and glob-top
Processed materials and techniques: fiber
composites; encapsulation compounds;
soft solders; sintered materials; glass
structuring; mechanical and chemical
metalworking
Our employees’ many years of experience in
combination with state-of-the-art equipment
for processing large-format manufacturing in the entire production process (610 x
457 mm²; 18” x 24”) is unique worldwide.
­Approximately 2,500 m² of laboratory space
are available, 600 m² of which are cleanroomsof ISO classes 5 – 7. Here, the production ofcomplex electrical or photonic circuit carriers,
the assembly of components on and embedding in circuit carriers or housings, as well as
the bonding and encapsulation of the components, is carried out.
The finished systems are electrically andmechanically tested and evaluated. For­documentation and analysis purposes, we
use imaging techniques for structure resolution down to the nm range, optical function­measurement techniques, and chemical­analysis down to the sub-ppm range.

Departments

Wafer Level
System Integration

The department »Wafer Level System Integration« (WLSI) focuses its research activities
on the development of advanced packaging and system integration technologies
and offers customer-specific solutions for
microelectronic products used in smart
systems. Around 80 scientists at two sites –­Fraunhofer IZM in Berlin and the institutebranch ASSID – A­ ll S­ ilicon System Integration­Dresden (IZM-ASSID) – conduct research in
the f­ ollowing key areas:
3D integration including Cu-TSV andwafer tacking
Thin wafer processing andintegrationtechnology
Heterogeneous Integration
Wafer-level packaging, fine-pitch bumping
and interconnect technologies
Hermetic MEMS and sensor packaging
High density flip-chip assembly
Sensor development and integration
Hybrid photonic integration
Photonic and plasmonic systemdevelopment

At both sites, the department operates
leading-edge process lines that permit a highdegree of processing flexibility, particularly for
200 – 300 mm wafers. The lines are characterized by a high adaptability and compatibility
between the individual sub-processes and areparticularly equipped for production-related
and industry-compatible development andprocessing. Both sites have a completely ISO
9001:2015-certified management system
to guarantee highest quality standards inproject and process work. The department’s
already outstanding technological expertiseis continuously extended within numerous
research projects and the gained know-how
can be transferred at development stage to
SME partners. WLSI has established a broadcooperation network with manufacturers andusers of microelectronic products, as well as
tool suppliers and material developers in thechemical industry.
The department’s technological know-how isfocused on the following areas:
Heterogeneous wafer-level system
integration
3D wafer-level system in package(WL-SiP, CSP, WSI)
Application-specific Cu-TSV integration:
via middle, via last, backside TSV
Cu-TSV interposer with multi-layer RDL
and micro cavities
Glass interposer with TGV
High-density interconnect formation:
micro / nano interconnect and pillar bumps
with solder cap (Cu, SnAg, CuSn, Au,
AuSn, In, InSn, nano-porous Au)
Pre-assembly (thinning, thin wafer­handling, laser grooving, laser dicing,plate dicing)
3D assembly (D2D, D2W, W2W)
3D wafer-level stacking
Wafer bonding, direct bond interconnects(DBI) - W2W (12”), (adhesive, soldering)
Micro sensor development and integration
MEMS packaging (hermetic)
Simulation and characterization of photonic
and plasmonic components & systems
Photonic system integration(incl. e.  g. ­polymer waveguides)
The service portfolio for industrial partners
comprises process development, material
evaluation and qualification, prototyping,low- and middle-volume manufacturing andprocess transfer. Newly developed technologies can be adapted to customer-specificrequirements.

A micro RFID tag fromthe company Microsensys
embedded in the chip
rewiring layer helps identify
components and forge atrustworthy supply chain

Contact

Dr. Michael Schiffer
michael.schiffer@izm.fraunhofer.de
Dr. Manuela Junghähnel
manuela.junghaehnel@
assid.izm.fraunhofer.de9Fraunhofer IZM | Annual Report 2023 / 2024

Environmental &Reliability Engineering

Standardized power

Reconciling progress in microelectronics with
the needs of our environment has become akey priority in the industry. Fraunhofer IZM
is a pioneer in this field. The »Environmental
and Reliability Engineering« department has
been supporting new technical developments and the innovation of more sustainable, durable, and greener electronics forover two decades. With its unique combination of environmental performance andreliability checks, the department can offer
services in the areas:­connectors and modular
designs help en route to acircular economy

Environmental assessments and eco-design
Resource efficiency, circular economy, andobsolescence research
Reliability standards and testing and statemonitoring procedures
Failure mechanisms, lifetime models, andmaterials data
Simulations for reliability analyses andoptimization

Our interdisciplinary team develops processes
and models and supports our partners in integrating environmental and reliability criteria
in the design and development process. We
can help identify weak points and untapped
potential at an early stage in the introductionof new technologies, materials, processes,
components, and applications and find suitable solutions for our partners.

Contact

Dr. Nils F. Nissen
nils.nissen@
izm.fraunhofer.de

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Stemming the tide of electrical and electronics waste and reining in the resource hungerof the industry is one of the key challenges faced by all of society. Modern life has
become unthinkable without electronics. A
boon and a bane alike, electronics contributeto making climate change worse, but they
can also be the key to saving resources andreducing our carbon footprint.

The environmental footprint of actual products and of the fundamental technologies
that make them possible has gained considerable salience in the industry. We are also
assisting suppliers and smaller enterprises indefining and meeting specific climate andresource efficiency targets.
Legislators and consumers alike are increasing pressure on manufacturers in the formof toughened standards and specifications
for products that are easier to tear down,
to repair, and to keep in working order fora longer overall product lifespan. Methods
for application-specific reliability checks areplaying an important role in these efforts toextend the lives of particularly resource-intensive electronic components.
The reliability of technologies is benefittingfrom constant progress and refinement intesting methods and simulation models. A
lot of attention is currently aimed at warpageand corrosion, but depending on their use
case, the reliability of electronic components
is understood and analyzed in terms of allimportant fatigue mechanisms or otherforces affecting the components, including
mechanical vibration, heat, humidity, changes
in temperature, or voltage and power loads.
These tests and simulations, tailored specifically to the given use case, offer new pointersfor optimization for the relevant parameters (such as the materials, geometries, andprocess design) to achieve the new reliability
standards expected in the supply chain and in
actual use.

Departments

RF & Smart Sensor Systems

The department »RF & Smart Sensor Systems«
is concerned with the research, development
and industrial application of wireless sensor
and communication systems. The focus of ourwork is on 5G and 6G communication systems, radar sensor technology and as well as
wireless sensor nodes. The greatest challenge
in terms of research and development and thedefining criteria are large bandwidths highrobustness and a commitment to maximum
energy efficiency. Other features such as
controllable antennas, beamforming, and­protections against signal deterioration are
also attracting increasing attention.
Meeting these exacting standards needs thetight integration of circuit design and technology development (hardware / package
codesign) just as much as genuine cooperation

Our activities focus on:
RF design and characterization of materials,
packages, antennas, and components(up to 220 GHz)
RF system integration and module designwith particular attention to signal andpower integrity
Development of highly integrated radar
sensor systems
Design and construction of autonomous
wireless sensor systems for industrial use
Development of microbatteries and power
supply and power management systems forautonomous devices
Tools for the optimized design of­micro­systems and server-client software­architectures for IOT applications

Compression-molded 3D radar
antennas in a MIMO array cancover 180 ° of the surrounding
space

between software and hardware developers(hardware / software co-design). With thisin mind, the department RF & Smart Sensor
Systems combines the intensive ­technologicalknow-how of Fraunhofer IZM with ourin-depth expertise in firmware and hardware
development.

Contact

Prof. Dr. Ivan Ndip
ivan.ndip@
izm.fraunhofer.de
Harald Pötter
harald.poetter@izm.fraunhofer.de11Fraunhofer IZM | Annual Report 2023 / 2024

2024
Get Smarter with
Fraunhofer IZM
Tutorials – Training – Expert Sessions – Blog

LinkedIn and Instagram allow
a glimpse into everyday lifeat the Institute and make thework of our colleagues visible
Three of the seven »GreenICT@FMD« training videos
produced to date for a
specialist audience in scienceand industry

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Fraunhofer IZM is now represented on all majorsocial media channels and is continuously expanding its online presence. We offer further training
opportunities on YouTube with online courses,
while valuable contacts with industry experts
are maintained on LinkedIn. We also reach both
new and existing target groups on X, Facebook
and Instagram with insights into our day-to-day
work. Thanks to our rapidly growing number offollowers, our reach is constantly expanding. You
will find some examples of our work on the nextpage.

Fraunhofer IZM online

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Video tutorials for green electronics
As part of the BMBF-funded »Green ICT @ FMD« project, IZM’senvironmental experts in electronics and ICT products havecreated training videos that impart knowledge and skills forevaluating »green« ICT systems. This includes topics such as
life cycle assessments, environmental legislation and current
developments.
Fraunhofer IZM is responsible for the entire production of the
training videos: conceptualization, script, creation of graphics,
technical recording in the video studio and post-production. The
videos are aimed at a specialist audience from the fields of science, industry and politics. The speakers in the videos are IZM colleagues, which strengthens visibility and networking in research.
https://izm.fraunhofer.de/greenICT-online

The only way is up: Four years of the RealIZM blog
With a mix of interviews, reports and videos, RealIZM, Fraunhofer IZM’s science blog for microelectronics has establisheditself over the past four years as an online communication

platform through which the Institute shares its latest researchfindings with the packaging community. Almost 500 peopleinterested in microelectronics have subscribed to the blog
newsletter so as not to miss an episode and 7,000 visitors visited our website in 2023 alone. Come and visit us too!
https://blog.izm.fraunhofer.deFree and online:
IZM Expert Sessions are very well received»Heterogeneous integration - What’s next?« was the nameof the first workshop that IZM researchers held online in July
2020. Since then, the IZM Expert Sessions have been very popular with our customers. Around 30 seminars have been held
in recent years, often with several sessions on an overarching
topic such as new optical connection technologies, low-powersystems, innovative substrate materials or miniaturized sensor
systems.
https://izm.fraunhofer.de/workshops

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Fraunhofer IZM | Annual Report 2023 / 2024

In the Spotlight
Embeddingfor Power Electronics
Eckart Hoene

Power electronics will play a key role in decarbonizing our economic
system. Their task is to convert the largely electrical energy several
times on its way to the end consumer with as little loss as possible.
Fraunhofer IZM has been researching for decades how this conversion can be realized as cost-effectively and efficiently as possible.
As the volume of power electronics is primarily determined by the size of thepassive components, our research efforts have long focused on the sharpest
sword for volume reduction: higher switching frequencies. The introductionof power semiconductors made of silicon carbide and gallium nitride quickly
showed that these semiconductors are no longer limited in speed by themselves, but by the packaging of the power semiconductors. Parasitic electromagnetic effects lead to oscillations and overvoltages, which prevented the fullpotential of the semiconductors from being utilized.
With this in mind, Fraunhofer IZM presented power semiconductors embedded
in printed circuit boards in combination with ceramic substrates to experts forthe first time in 2013. The technology has created degrees of freedom for agood electromagnetic design with more wiring layers, as well as enabling thehighly concentrated power loss of these semiconductors to be dissipated in aspace-saving manner.

Contact

Prof. Dr. Eckart Hoene
eckart.hoene@izm.fraunhofer.de

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The major advantage of this compared to conventional modules is the reduction in switching losses. If you consider that, in an electric car with a SiC
inverter, around 70 % of the inverter losses in the standardized driving cycle
are switching losses, there is great potential here for a longer range. Over morethan ten generations of power modules, IZM scientists have continued to optimize their properties so that switching losses have been reduced by a factor offour compared to the state of the art. This was achieved primarily by reducing
the DC link inductance, a perfectly symmetrical current flow with 1D current
flow direction and a damped primary DC link.

In the Spotlight

Layup of PCB corematerial and AMB or
Copper Inlay

Embedding byvacuum lamination

Assembly of SiC by Ag
sintering on large
substrate

Layup of prepreg

Embedding of SiC byvacuum lamination

Laser via formation
to SiC, metallization
and rounting

The process flow for e­ mbedding SiC power­semiconductors in circuit boards

The basic structure of the assembly technology is shown in the
figure above. The structure begins with the ceramic substrates,
which can spread the waste heat of the semiconductors withthick copper, and the ceramic, which produces insulation
with low thermal resistance. They are joined together in alamination process to form a printed circuit board panel. The
semiconductors are applied to the ceramic substrates using asilver sintering process. In the next step, the semiconductors
are laminated in and the electrical contact to their top side
is made possible by laser drilling. The electrical contacts arethen produced in the electroplating process. Another layer isalmost always laminated on top, then the module is finished. It
can then be fitted with SMD components like a printed circuitboard or soldered onto a heat sink. The electrical connections
can be produced in a variety of ways, including the use of lasers
to mount copper sheets onto the modules at Fraunhofer IZM.

Interest in the use of this technology in industry has increased
significantly in the last two years and has led to a large numberof projects at the Institute. Other suppliers now also offer thistechnology, meaning that Fraunhofer IZM is no longer the only
partner for such projects. The duration and hurdles that a technology has to overcome before it can be implemented in series
production are exciting. After initially having to solve production challenges in our company, which were mainly related tothe combination of very different materials and their expansion
coefficients, it is the proof of service life that now takes up
a lot of time and resources. The lively research landscape inGermany is helpful for this, although a little more willingness
to take risks in industry would be desirable.

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Fraunhofer IZM | Annual Report 2023 / 2024

In the Spotlight
Trusted Electronics
Jan Hefer, Karl-Friedrich Becker, Olaf Wittler, Markus Wöhrmann

With increasing globalization and more complex supply chains,electronic hardware is susceptible to tampering

1 Sensor module for in-line
data capture, produced in atrustworthy manufacturing
environment

A chain is only as strong as its weakest link. This wisdom also applies
to the Industrial Internet of Things (IIoT), autonomous and connected vehicles and important infrastructures, as high investments
in software security alone do not guarantee a holistically securesystem. Complete security for a wide range of applications based onelectronic systems can only be achieved if the trustworthiness of the
hardware is guaranteed.

2 Miniature crypto RFID chipfrom the company Microsensys, embedded by wafer-levelthin-film technology

While software vulnerabilities can often be remedied by patches or updates,
correcting hardware – especially if a large number of affected devices havebeen placed on the market – is much more difficult, as redesigns or recalls canbe very costly. The extent of damage is therefore generally greater if the hardware has been attacked or tampered with.

Contact

Jan Heferjan.hefer@izm.fraunhofer.de
Karl-Friedrich Becker

A risk assessment for the system or application under consideration forms thebasis for deciding which measures are best suited to protect potential points
of attack and minimize risks. For hardware-based critical infrastructures, forexample, cost-intensive, multi-level security concepts would make sense,
whereas simpler and therefore inexpensive solutions are required for consumer
electronics. A cost-benefit analysis also plays an important role in the selectionof protective measures.

karl-friedrich.becker@
izm.fraunhofer.de

Hardware-implemented protection mechanisms
Olaf Wittler
olaf.wittler@
izm.fraunhofer.deMarkus Wöhrmann
markus.woehrmann@izm.fraunhofer.de

16

Fraunhofer IZM’s packaging technologies offer a wide range of options forhelping to protect semiconductor components from physical attacks andtampering attempts. For example, shielding or concealing layers or structures
can be applied to make it more difficult for attackers to access and tamper withinternal elements of a component to be protected. However, such structures
can also have sensory properties, so that intrusion detection is possible with
their help or by embedding sensor functions in wiring or substrate levels. Integrated ID elements also serve to ensure the uniqueness of components.

In the Spotlight1

By using technology-based protection concepts, companies
can therefore increase the trustworthiness of their products
and arm themselves against physical attacks and tampering
attempts.

Trusted production as the basis for trusted
electronics
The basis of Industry 4.0-oriented manufacturing is the
networking of production facilities and the use of data to digitalize business processes. In addition to the data that production systems already supply, further process information anddata directly from the workpiece and the production environment are required in order to achieve a holistic system view asa basis for production monitoring and optimization.
Current research into trusted manufacturing focuses onprocess digitalization for a manufacturing scenario in which
high-value electronic goods are produced in a distributed manufacturing environment. The most important research topics
are the implementation of a Chain of Trust (CoT) for trusted
distributed manufacturing and the application of artificial
intelligence and machine learning to analyze and optimize
manufacturing processes.

2

Evaluation of trustworthiness through a­combination of analysis methods
The trustworthiness of all sub-components forms the decisive
basis for the safety and reliability of a product. If components
other than those originally approved for the product are
installed, this results in incalculable risks.
Fraunhofer IZM has pooled its resources and expertise in orderto reduce the risks posed by irregularly marketed components,
counterfeits or tampering, so that suspected cases can be thoroughly investigated. IZM’s specific knowledge in the design,
process technology, analysis and testing of electronic components, assemblies and systems comes into play here.
This allows design and production differences to be identified
and evaluated with the company concerned, so that conclusions can be drawn about production processes or production
locations. Electrical characterization, in turn, helps to describe
system behavior and detect malfunctions. All of the information obtained can provide a valuable insight into the reliabilityof the tested component or assembly.

The experimental evaluation of these concepts in two assemblylines – including data acquisition, data processing and AI processing – has already been achieved with the aim of optimizing
production in terms of higher production yield and productquality.

17

Fraunhofer IZM | Annual Report 2023 / 2024

Handling thinned chips

18

Fraunhofer

World Leader inApplied Research
A Strong Network

The Fraunhofer-Gesellschaft
The Fraunhofer-Gesellschaft, based in Germany, is the world’s leading applied researchorganization. Prioritizing key future-relevant
technologies and commercializing its findings
in business and industry, it plays a major rolein the innovation process. A trailblazer andtrendsetter in innovative developments andresearch excellence, it is helping shape oursociety and our future. Founded in 1949, theFraunhofer-Gesellschaft currently operates
76 institutes and research units throughout­Germany. Almost 32,000 employees, predominantly scientists and engineers, work with anannual research budget of approx. 3.4 ­billion
euros. Fraunhofer generates about 3.0 billion
euros of this from contract research.

Research Fab Microelectronics
Germany
In 2017, Fraunhofer IZM became part of the
Research Fab Microelectronics Germany,
also known as the FMD or ­Forschungsfabrik
Mikroelektronik Deutschland. The FMD is acooperation venture of the Fraunhofer Groupfor Microelectronics and the Leibniz Institutes
FBH and IHP. It is the go-to place for all issues­concerning microelectronics and nanoelectronics in Germany and across Europe. The
FMD offers technologial solutions in numerous areas, such as sensor systems, powerelectronics, MEMS actuators, ­microwave
und Terahertz, extended CMOS, chip- andchiplet design, optoelectronic systems as wellas multi-project technologies. Furthermore,
the FMD facilitates research cooperations on
topics like resource efficiency, next generation
computing, security, mobility, production andcommunication.

Along with the range of technological solutions and the coordination of large collaborative projects, the FMD also runs special
formats for start-ups, SMEs and researchgroups, like the funding programs »Green ICTSpace« and »QNC Space«.
Over the coming years, the FMD intends tobuild the most comprehensive and advanced
pilot line dedicated to chip integration for
innovative, robust and trustworthy heterogeneous systems as a contribution to the
EU Chips Act. This pilot line for Advanced
Heterogeneous System Integration will enable
state-of-the-art system design, interconnection and assembly technologies, and promote
the innovative potential of the whole industrial
spectrum in Europe.

High-performance Centers
The High-Performance Center »Functional
Integration of Micro- / Nanoelectronics«
supports SMEs in Saxony with know-how in
sensor and actuator technology, measurement
technology, and mechanical engineering andconstruction by rapidly transferring research
results into innovative products.
The Fraunhofer Institutes ENAS, IIS, IPMS,
and IZM-ASSID, as well as the Technical­Universities Dresden and Chemnitz and theHTW Dresden are members of the Center.
The »Berlin Center for Digital ­Transformation«
is a collaborative venture involving the four
Berlin-based Fraunhofer institutes FOKUS,
HHI, IPK und IZM. Its work focuses on­technologies and solutions that advanceincreasing digitalization and networking in allareas of life.

19

Fraunhofer IZM | Annual Report 2023 / 2024

Complex project initiatives move across theboundaries of disciplines and competencies. They
benefit from the business expertise of Fraunhofer
IZM’s dedicated Business Development Team that
represents the industry’s specific needs in allfunctional areas of the institute and coordinates thework on innovative solutions. We are here to assist
you in the strategic development of innovative areas
with complex and ground-breaking technologies.

20

Business Units & Industry Sectors

Business Units &Industry Sectors
Automotive and Transportation ..........................................................22
Medical Engineering .............................................................................24
Semiconductors .....................................................................................26
Industrial Electronics .............................................................................28
Information and Communication .........................................................30

21

Fraunhofer IZM | Annual Report 2023 / 2024

Automotive and Transportation

Innovative 22 kW on-board
charger developed at­Fraunhofer IZM

22Modern traffic systems have to be safe, environmentallyfriendly and cost-efficient. High-performance, reliable and,in some cases, highly miniaturized systems are key goals fordevelopers creating innovative forms of transport and trafficsystems for road, rail, sea and air. Transportation has beena key priority and competence area across Fraunhofer IZM
departments since the institute’s very beginning. The institutehelps OEMs, Tier1 companies and particularly their suppliers
integrate the latest electronics into vehicles quickly and­efficiently. We develop future-proof, reliable solutions,­including prototypes, which improve the safety and comfort
of conventional, hybrid and electric engines and systems.

Business Units & Industry Sectors

Fraunhofer IZM develops cost-­
efficient bidirectional charging unit
for electric vehicles

Development of a ­dynamically­adaptable radar front end for­monitoring and controlling air traffic

On-board chargers (OBC) are indispensable inmodern electric vehicles. To minimize production costs, Fraunhofer IZM is developing an
innovative bidirectional 22 kW system basedon planar transformers and coupled inductors. The inductive components built using
established PCB technology are optimized
with regard to the uniform current distribution
in the windings as well as the flux density distribution and the macroscopic eddy currents inthe magnetic core using 3D field simulations.
The OBC works worldwide in 3-phase and1-phase networks in a very wide input voltage
range and can be used for both 400 V and800 V batteries. This achieves an efficiency ofover 97 % with a volume of three liters.

Studies see the use of airspace by UAS(unmanned aircraft systems) as the future of
regional passenger and goods transportation. The resulting intensive use of airspace,particularly in conurbations, requires efficientmonitoring and control of traffic flows. In the
AKIRA-UTM project, Fraunhofer IZM is working with Fraunhofer FHR to develop scalable
ground-based radar systems for locating andpositioning the UAS and for communication
between the UAS and between the UAS andthe UAS traffic management system (UTM).
The radar systems are distributed over a wide
area. The networking of the individual groundradar systems ensures interference-free radarand communication functionality. Fraunhofer
IZM is developing an adaptable MIMO radar
front end with a detection range of 180 °,whose angular resolution can also be adaptedhorizontally and vertically during operation.
The project is funded by the Bavarian State
Ministry of Economic Affairs, Regional Development and Energy.

Radar-based 3D environment­detection for safe collaboration­between man and machine
In a factory, man, machine and the connecting intralogistics system must work together
safely. The PLATON project is developing
an integrated sensor and data processing
platform that evaluates 3D radar data both on
different time scales and spatially distributed
using AI. The functionality is to be tested
through the interaction of several automatedguided vehicles (AGVs). A MIMO radar is combined with a SAR radar for safety-­compliant
detection of the environment. Fraunhofer
IZM is developing the integrated front-end
modules and also the signal processing for the
MIMO radar. By merging the data from thetwo radar systems as well as the data fromthe various AGVs, the environment can berecorded with the required level of certainty.
Fraunhofer IZM developed the hardware forthis. The project is funded by the Federal­Ministry of Education and Research.

A coupled RadCom sensor
network for monitoring theairspace

23Fraunhofer IZM | Annual Report 2023 / 2024

Medical Engineering

The REMEDIA sensor
bracelet keeps track of
40 environment factors
to see which affectrespiratory diseases

24Over the past years, the innovation potential of microelectronics
has led to considerable progress in medical technology.
Fraunhofer IZM has been front and center in this development
process for 20 years. Our know-how in microtechnology andinnovative integration processes helps manufacturers realize
innovative new medical engineering products that meet alllegal requirements. Of course, Fraunhofer IZM also performs­customized reliability analyses, bio-compatibility assessments, aswell as the risk assessment according to ISO 14971 standards,
which is required for the development of new products.

Business Units & Industry Sectors

Non-contact patient monitoring –ECG by radar
Rural areas suffer from a lack of medical care,particularly when it comes to high-quality
diagnostics. The situation is to be improved byadapting sensor concepts from the context ofIndustry 4.0 to medical diagnostics. Example
ECG: By using radar technology, monitoring
can be carried out contact-free and from a
distance, and the data can be made available
to the attending physician or telemedicine
service providers via a secure data interface.
The developed radar sensor can detect heartand respiration values through clothing,comforters and even mattresses and transmit
them to the monitoring devices. The sensors
emit electromagnetic waves that are reflectedby the body. In practice, it works something
like this: The blood ejected by the heartruns along the vessels in the form of a pulse
wave, which appears as a vibration on thesurface of the body. This is measured using
the sensors. The project is a joint project aspart of the Innovation Campus Electronics and­Microsensor Technology Cottbus.

Wafer-level technologies
enable novel brain implants
The MINIGRAPH project focuses on developinga groundbreaking neuroelectronic therapeutic
method that uses a new generation of brain
implants with closed-loop capabilities. This is
made possible with a flexible electronics unit
and high-density arrays of graphene microelectrodes implanted in the patient’s head.
The highly miniaturized system features highspatial resolution and optimal biocompatibility
with brain tissue. Wafer-level technology allows
the production of entire implant systems withe. g. electrodes, sensors, and signal processing
capabilities on a single wafer substrate. The
wafer-level approach that embeds thin dies inredistribution layers boosts functionality, while
minimizing size and keeping power consumption and manufacturing costs down. Moreover,the inherent repeatability of wafer-level processes ensures consistency and reliability acrossdevices, which is crucial for medical applications. Hermetic sealing is achieved by e. g.
thin-film encapsulation using biocompatible
coatings. Such sealing is crucial for the device’s

performance and biocompatibility. It protects
the delicate electronic components from external forces like fluctuating temperatures or the
corrosive effects of bodily fluids and lowers therisk of infection.

REMEDIA - wearable multi-sensor
system bracelet
From birth, people are exposed to a variety of
external environmental influences, such as finedust and toxic gases. These external factors,
known as the exposome, have long-term
effects on human health. Within the EU-Projekt REMEDIA, the impact of the exposome
on the progression of lung diseases is being
investigated. IZM researchers have developed
a wearable multi-sensor system in the formof a bracelet that can digitally record anddocument over 40 different harmful substances, even in the lowest concentrations. These
devices are used by subjects in their everyday
living environments for research studies.

Simultaneous energy and data
­transmission for deep implants bymeans of ultrasound
The Technologies for Bioelectronics groupat Fraunhofer IZM, together with partners
from the EU-wide consortium Moore4Medical were the first to demonstrate ultrasonicdelivery of instantaneous mW-range DC
power to deep implants. This was achieved
using micromachined ultrasound transducers
and a dedicated microchip which are part ofan open platform developed as part of the
project. The scientists also developed a robust
scheme for ultrasound communication fromdeep implants based on backscattering andfrequency-shift-keying and demonstrated its
superior performance over the conventional
on-off-keying during movement.

25

Fraunhofer IZM | Annual Report 2023 / 2024

Semiconductors

Hybrid pixel detector
module with siliconsensor for use in X-ray
exams

26

This business unit specializes in the integration of semiconductor elements and the production of sensors for the assemblyof complex heterogeneous system-in-package (SiP) ­solutions.
Fraunhofer IZM offers its clients holistic services – from­developing the original concepts and designing the processes to characterizing and testing the reliability of the finished­systems. The institute‘s facilities cover all relevant processes for
manufacturing sensors and wafer-level packages, allowing the­production of hermetically sealed sensor packages and evenentire 3D systems.

Business Units & Industry Sectors

Environmental improvement insemiconductor production throughwafer recycling
The »GreenICT@FMD« project investigatesand promotes sustainable processes in thecontext of microelectronics and assesses theirpotential for reducing greenhouse gases.
Fraunhofer IZM has developed a process forrecycling monitor wafers. Monitor wafers are
test wafers that go through the same steps as»real« wafers. These can be recycled using aprocess at the institute and reused as interposers. During recycling, existing photoresist
and several metal layers are removed in three
process steps (stripping, copper etching and
TiW etching). The SiO2 layer remains on thewafer for the next application. Such recyclingmeans that new production and the associated environmental impact of a wafer can
be avoided. This was demonstrated by theecological assessment of the processes basedon chemical and water consumption.

Packaging of high-performance­computing modules
Fraunhofer IZM has levelled up its advanced
packaging portfolio with a special focus on
wafer-level packaging (WLP) for high-performance computing (HPC) modules. Siliconinterposers using through-silicon vias andultra-fine pitch multi-layer wiring for connecting chips and routing signals has proven itself
as the major platform for chiplet integration.
The well-established multi-layer copper redistribution technology has been scaled down
to enable routing schemes at 4 µm line / space(8 µm pitch) and less. Wafer-level packagingof HPC modules also uses flip chip assembly,
underfilling, compression molding, ball soldering for second level IO formation.

and data transfer security solutions in thefield. This is meant to allow photonic components to be flexibly connected to open
processor systems via optical and electricalinterfaces. The focus is on converting sensitive electrical into tap-proof optical signals
using photonic encryption hardware to enablesecure communication.
Fraunhofer IZM’s key contribution to the­project lies in developing the conceptual
design and processing technology and subsequently manufacturing the electro-opticalinterposer and assembly of optical and photonic components, with particular attention
to the precise alignment of electro-opticalinterfaces. With a diameter of less than one
micrometer, waveguides on optical integrated
circuits are extremely small. Fraunhofer IZM isdeveloping a passive alignment system basedon solder-supported self-alignment with integrated mechanical stops

20 µm

Etched cavity on a photonic ICwith silicon stops and flip-chipsolder bumps for passive laseralignment

Know-how protection for ­trustworthy,
heterogeneous electronic systems
with chiplets
For the BMBF-funded VE-REWAL project, aplatform for trusted electronics is being developed and demonstrated in action in the formof a 77 GHz radar MIMO system using a chiplet design. Fraunhofer IZM’s work happens on
the »RDL-1st for Trusted Chiplet Packaging«
sub-project, where the essential process
blocks for the RDL-1st FOWLP technology arebeing refined and the functional demonstrator is constructed. The new work addresses
novel materials, wiring densities, and failure
mechanics, and thermomechanical simulation
models are created and verified. Technology
demonstrator packages with five chiplets havealready been successfully manufactured andelectrically tested.

Development of aphotonic ­electronics platform
The BMBF-funded »Silhouette« project (Silicon
Photonics for Trusted Electronic Systems) aims
to develop a heterogeneous, standardized,
and modular electro-optical platform for open
processor systems for use in communication

27

Fraunhofer IZM | Annual Report 2023 / 2024

Industrial Electronics

Highly miniaturizededge IOT module

In recent years Fraunhofer IZM’s industrial electronics specialists
have concentrated on the visionary concept of Industry 4.0.
Particular emphasis was placed on the work on cyber physicalsystems (CPS) and autonomous, specifically high-reliability
radio sensors that record and process the relevant monitoringand / or video data on site and distribute it via standard interfaces when and where the user needs it. Industry 4.0 means
much more than CPS integration: Flexible access to monitoringdata is particularly vital both for location-bound controlling andmanagement processes and ERP systems and for on-demand
access via mobile devices in inspection, maintenance, or repair
scenarios.

28

Business Units & Industry Sectors

New condition monitoring concept
for humidity stress

AI at the Edge – condition monitoringfor construction machinery

In the internal Fraunhofer project »power4re«(reliable converters for regenerative energy
supply), a new type of condition monitoring
concept was developed for monitoring assemblies exposed to moisture. For this purpose,a circuit was implemented that monitors specially designed status indicators. The results ofthis monitoring enable targeted maintenanceactivities to reliably maintain the operational
capability of applications in environments
exposed to moisture.

Fraunhofer IZM is working together withcolleagues from BTU Cottbus-Senftenberg
and Fraunhofer IPMS to record the current
machine condition of construction machinery.
A particular challenge is the early detectionof wear conditions under harsh operating
conditions. In some cases, the use signals
are orders of magnitude lower than thesignal levels resulting from normal operation.
Multi-parameter measurements provide thebasis for detecting changes in system ­behavior
at an early stage. The signals are merged andpre-evaluated in an energy-efficient dataprocessing system. In the event of anomalies,
high-performance AI-based data processing
is activated. The results are transmitted to theoperator.

Plug & play radar –Fraunhofer IZM radar platform
The increasing availability and large selectionof commercially available radar sensors makes
non-contact radar technology interesting formany applications. The radar platform offers asolution-oriented introduction to this technology. Unlike evaluation boards, the radar
platform, consisting of a smaller radar sensor
board with minimal circuitry, a mainboard andsoftware libraries, allows users to either use
the sensor unchanged in their project or use it
as a starting point for their own development.
The ISM bands (industrial, scientific and medical) are available at 24 GHz (0.25 GHz BW)
and 61 GHz (0.5 GHz BW) as well as theautomotive short-range radar (SRR) at 79 GHz(4 GHz BW).

EBSD analyses on the successful­completion of the »AlCuBo« projectThe »AlCuBo« project (»aluminum copper
bonding wires for power electronic modules«)was successfully completed with intensive
and informative EBSD (electron backscatter
diffraction) analyses. These analyses makeit possible to visualize the changes in the
microstructure of the wire materials as well as
the change in the average grain size and theintermetallic phases after different heat treatments. In addition, the combination with EDX(energy-dispersive X-ray spectroscopy) made it
possible to distinguish the face-centered cubic
materials, which are difficult to differentiate
by EBSD, very well.

EBSD image of the heat-treated wire lengths (annealing
temperature and time on the
X and Y axes), each showing aquarter of a 500 µ AlCu wire.
The black ring represents theintermetallic phase29

Fraunhofer IZM | Annual Report 2023 / 2024

Information and Communication

Glass-based package
for semiconductor
lasers coupled to a
photonic chip (PIC)30

The new era of increasing connectivity and digitalization
creates new challenges for the design and assembly of ICT
systems: The efficient sharing and storing of data needs everlarger data centers and the means to transmit electric andoptical signals. Digitalization itself brings its own challenges:
There is increasing demand for highly dynamic networks that
can transport, process, and analyze data. Fraunhofer IZM offers
comprehensive solutions for these challenges with more than
two decades of experience in the field of system integration.

Business Units & Industry Sectors

Environmental forecast for
5G ­networks in Germany
The study »Environmental Technology Impacts
Assessment for Mobile Communications inGermany« (UTAMO) was carried out by Fraunhofer IZM on behalf of the Federal Environment Agency and includes a rough ecologicalassessment of the German mobile networks
for the baseline year 2019 as well as forecastsof developments up to 2030. To this end, alife-cycle-oriented inventory model was developed that quantifies the carbon footprint ofdevice manufacturing and the electrical power
requirements of radio access and aggregation
networks. To minimize the future environmental impact of mobile networks, the study also
developed packages of measures that specify,
for example, network and site planning, aspectsof system modernization and options for active
load and energy management.

Packaging for cryogenic quantum
computing
The technological realization of quantum computing depends on the number of available
quantum bits or qubits. Integrating the control
electronics into a cryogenic environmentis a promising avenue towards this goal. It
needs high-density superconducting lines andconnections between the quantum processing
unit (QPU) and the control electronics (QCI)
and a thermal decoupling at the same time.
For this purpose, IZM-ASSID is developinga scalable packaging solution based on arigid-flex interposer. The integration technologies used for the purpose include superconducting TiN lines (sc RDL) and in-bump bonds(sc bump bonds).

Ecological assessment of a modular
laptopModular end devices offer the possibility ofeasier repair and more precise fitting and haveexperienced a small revival in recent years in
the context of »right to repair«, among otherthings. As part of a life-cycle assessment,
Framework’s modular laptop was examined
and its carbon footprint and abiotic resource
consumption evaluated. The greenhousegas potential is mainly driven by the display
module and the resource consumption by thegold contacts, especially on the RAM module.

Quantum system packaging
At Fraunhofer IZM, innovative quantum chips
were embedded in laser-structured thin glass
packages and optically/electrically coupled usinglarge-format structuring and assembly systems
procured as part of the ERDF project »QPLa«.
The starting material for this are large-format
thin glass panels, which can be laser-etchedwith a precise structure or metallized. The
individual packages, which are almost freely
scalable in terms of size and quantity, can also
be operated at low temperatures and in a
vacuum for applications in quantum computing and quantum sensor technology thanks tohermetization.

A modular laptop made by
Framework with a lifecycle
assessment produced by
Fraunhofer IZM

6GKom research for the mobile­communications of tomorrow
While the fifth generation of mobile communications (5G) is currently being launched on
the market, Fraunhofer IZM is working on the
hardware basis for the next 6G mobile communications standard in the »6GKom« projectwith partners from TU Berlin, TU Dresden, Ulm
University and the IHP in Frankfurt / Oder. The
central element is a »massive MIMO antenna
module« for the frequency range from 110 to
170 GHz, which allows active control of theantenna beam. This allows data rates of several
Tbit / s to be achieved and enables very precise
localization applications. Based on an innovative system integration platform, a new type of
co-design approach is being implemented thatencompasses the chip, package and antennas
together. In addition, new baseband architectures and test procedures for the metrologicalverification of the 6G application are being
researched, taking into account the parasitic
THz effects.

Bare thin-film circuit carriers
on different thin glas formats,laser structured and ready forfs laser etching to accommodate photonic components
with micrometer precision31Fraunhofer IZM | Annual Report 2023 / 2024

Labs & Services

System Integration
Wafer-Level Packaging Line
Fraunhofer IZM operates two process lines (cleanroom class10 – 1000) in Berlin (975 m²) and Dresden (ASSID, 1000 m²),that offer our customers various wafer-level packaging
services from development stage to prototyping and small
volume production. Different substrate materials (e.g. silicon,
III/V, ceramic and glass) and wafer sizes (4”–12”) can beprocessed. Project and process work on both lines is executedin compliance with ISO 9001:2015 management standards.

Substrate LineIn the substrate area panel-size substrates (460 x 610 mm²)
can be prepared for resist and PCB lamination, solder resist
and cover lays can be applied and developed after exposure.
New equipment in the 480 m² cleanroom allows surface preparation for assembly at reduced bonding temperatures. Trackgeometries with down to 2 μm width are under development.
Our services include:
Embedding of passive and active components
Multilayer lamination of PCB substrates
Realization of smallest vias, mechanically as well as witha laser
Quality assessment and x-ray microscopical analysis

Process Modules (up to 12”)
Cu-TSV integration (via-middle and via-last-processes)
Silicon and SiC plasma etching – DRIE (TSV, cavities)
Multilayer thin-film deposition (PVD, CVD, ECD, lithography(resolution up to 0.5 μm), mask aligner, reactive ion beametcher)
PECVD process chamber (200 / 300 mm) for the deposition of
TEOS oxide, Silane oxide and Silane nitride
High-density thin-film multilayer (Cu / polymer RDL,
Cu-Demascene)
Wafer-level bumping (Cu-Pillar, SnAg, Ni, Au, In, UnSn,
AuSn, Cu-nano interconnects, nanoporous Au)
Wafer thinning und thin wafer dicing (blade, laser grooving
and stealth dicing)
Wafer bonding – permanent and temporary
Wafer-level assembly up to 300 mm (D2W)
Automatic inline wafer metrology for layer thickness,­topographies, roughness as well as TTV / warpage / bow
Fully automated electric wafer measurement system(8” / 12”)Clean Room for highly precise assembly (ISO 5)
for single assembly up to 300mm wafer Die-to-Wafer
Accuracy down to 1µm and below, large range of bonding
forcesFlip Chip and Die Attach Bonders:Semi-automatic – full automatic
Reflow ovens – Stud Bumping – Plasma surface treatment
for Bonding
Thermocompression bonding, thermode bonding,pick-and-place and reflow

Mold Encapsulation Lab
The lab offers various encapsulation processes, related material
and package analysis and reliability characterization tools as a
one-stop-shop. The focus is on FO-WLP / PLP, on sensor packages with freely accessible surface and on power SiPs.
Precision assembly and compression molding on waferand panel-level (610 x 460 mm2)
Redistribution in 2D (PCB-based and thin film) and3D (TMV)
Transfer molding of SiPs for sensors and power
Process simulation and analysis of material models

32Labs & Services

Soldering and Sintering Lab
Vapor phase soldering with vacuum enables manufacturingof voidless large-area solder joints for power electronics
Hermeticity test
Fluxless soldering of printed circuit assemblies using active
gas in oxygen free nitrogen or vapor phase atmosphere
Leak testing including helium bombing up to a pressure of 10 bar
Stencil printer, dispenser and pick & place
Laboratory pressing for reliable Ag and Cu sinter connections

Photonics Lab
Laser structuring of glass layers with optical waveguides
for electro-optical boards (EOCB)
Shack-Hartmann-characterization of micro lenses andmicrolense arrays
Optical and thermal characterization of LEDs and LDs
Research and development of optical packaging processes
with an accuracy of up to 0.5 μm

Quantum Lab
3D glass structuring with selective fs laser etching
2PP printing of microoptical interconnects / lenses
Laser sealing for hermetic cavities (vacuum / gas)
Automated coupling for quantum chips / PICs
Characterization of optical fields (SNOM)

Material Analysis

Power Lab
Testing of hetero highly integrated power modules
Active cycling of power modules for lifetime assessment
Calorimetric measurement of the effectiveness of highly
efficient devices

DesignHigh Frequency Lab
Free-space measuring station up to 170 GHz, Fabry-Pérot
resonators up to 140 GHz and THz system for HF material
characterization
Semi-automatic sample station with thermal chamber(-60 °C to 300 °C)
EMC and test environment for wireless communication
systems in the multi-gigabit and terabit-range
Antenna measuring system for up to 330 GHz
Test lab for mm wave modules for radar and communication, signal source (AWG) and spectrum analyzer up to
325 GHzTime range measuring station (sample oscilloscope up to
70 GHz / BERT up to 64 Gbit/s)

Microelectronics Lab
Development and qualification of mechatronics systems
and energy-efficient wireless sensor systems
PXA for range calculation, conformity checks, and failure­analyses; allows the recording of very fast signals(from 162 μs)

Moisture Lab
Comprehensive simulation-based reliability assessmentof humidity-induced phenomena in microelectronic­components and systems
Surface analysis through atomic force microscopy
Analysis methods for sorption, permeation and diffusionof water in materials

Long-term Testing and Reliability Lab
Fast temperature cycling tests in the range from-65 °C to 300 °C
Temperature storage up to 350 °C
Component and assembly qualification in acc.
with AEC, IPC, JEDEC

Further laboratories include:
Micro Battery Lab with 10-meter battery development
and assembly line
Laboratory for Textile-integrated Electronics (TexLab)
Photoelectron spectroscopy and electron spectroscopy
for chemical analysis (ESCA)
Corrosion Lab
Electronics Condition Monitoring Lab (ECM) for functional
tests of electronic systems under environmental stress, salt
spray, shaker
Qualification and Test Center for Electronic Components (QPZ)
Thermo-mechanical Reliability Lab
Thermal & Environmental Analysis Lab
den33

Fraunhofer IZM | Annual Report 2023 / 2024

The speakers at the gala celebrating 30 years of Fraunhofer IZM(left to right): Dr. Axel Kaschner (Robert Bosch GmbH), Dr. Roland
Krüppel (BMBF), Professor Martin Schneider-Ramelow (Fraunhofer IZM),
Secretary of State Dr. Henry Marx (State of Berlin), Professor ­Geraldine
Rauch (TU Berlin) and Professor Axel Müller-Groeling (Fraunhofer
Society)34

Events & Promoting
Young Talents

Happy Birthday, Fraunhofer IZM!
Fraunhofer IZM turned 30 this year! From the firstgroundbreaking invention, electroless nickel bumping,to current research into chiplets and autonomous functions, we look back on three decades of pioneeringresearch in the field of microelectronic packaging. We
celebrated the milestone birthday in September withmany guests.
There were also many other IZM activities at trade fairs,
conferences and workshops. 2023 will be remembered as
the year in which our event activities returned to »businessas usual«. Colleagues once again presented their researchfindings at conferences around the world and the Institutepresented itself at trade fairs in Germany and abroad. But eventhough the majority of all the events were able to take place
live again, online formats have maintained their firm place inFraunhofer IZM‘s event repertoire even after the pandemic.
This year there were two online session series, that were very
well received and drew over 450 interested parties to theirscreens in a total of seven sessions.
On the following pages you will find a selection of events that
Fraunhofer IZM organized itself in the past year or in which
IZM colleagues were involved. In 2023, as in the previous year,
this included a particularly large number of events aimed specifically at young people.

35

Fraunhofer IZM | Annual Report 2023 / 2024

Events

30 years of Fraunhofer IZM -30 years of Fraunhofer IZMAround 200 guests attended
the symposium and gala eventon 28 September 2023

Fraunhofer IZM celebrated its 30th anniversary
in 2023. To celebrate this milestone in style, a
specialist symposium was held at the main site
in Berlin on September 28, 2023. Under thetitle »Crossing Frontiers in Microelectronics«,
the researchers showed how they intend to
tackle the major challenges of our time suchas chip shortages, increasing data rates, andthe energy crisis in the coming decades. The
presentation topics ranged from high-performance computing and sensor technology tomobility and sustainability. The symposium,
which was attended by renowned industry
partners, was followed by a ceremony withhigh-ranking representatives from politics andresearch.
Fraunhofer IZM was founded three decades
ago by a visionary group of German scientists.
Today, the Institute employs over 400 people
at three locations and has made a significant

36

contribution to the future viability of microelectronics with 6,000 publications and 350
patents over the last 30 years.

Network meeting »Women at­Fraunhofer IZM«
Last year, Fraunhofer IZM held four events,
each with 30 to 50 female participants fromall three Institute locations, to specifically promote networking among female employees
and train them on overarching topics such associal media, networking, presentation techniques, and further training opportunities.
The feedback on the events was extremely
positive and was mostly associated with thedesire to extend the format. The participants particularly praised the opportunity forexchanging ideas and the growing support
among the participants – even after the eventsin everyday business. The successful initiative

Events

is already being adapted by other Fraunhofer
Institutes, which underlines the relevance andadded value of these events.

Lab Week 2023
Lab Week takes place annually and enables
interested IZM employees to becomeacquainted with the diversity of research attheir own Institute in all four departments.
Everyone should have the opportunity to
expand their horizons and get a taste of thelab! Various laboratories open their doors
and dedicated colleagues show and explain
clearly what is being investigated, researchedand developed there. Lab Week 2023 wasparticularly impressive: A total of 33 guided
tours took place over five days, conducted by
24 lab guides and co-organizers and attended
by 172 colleagues.

Learning from Fraunhofer experts

The IZM birthday bash went
on long into the night

Last year, we were once again able to reacha large number of interested parties with our
free Online Expert Sessions. Two free lecture
series looked at different areas of microelectronics. In the spring, the »Low Power
Systems« series offered an introduction to thecomplex world of particularly energy-efficientsystems, such as those required for outdoor
devices where the battery cannot be replaced
regularly. Our experts recorded over 130 registrations in three compact sessions. In returnfor the great interest in this important fieldof research, our experts offered a thoroughintroduction to the topic and an outlook on
Fraunhofer research in this area.
The »Materials for Electronic Innovations«series was launched in the fall, focusing on
innovative base materials for semiconductor
production and their environmentally friendly
use. Research into new substrate materials forstate-of-the-art packaging processes is one ofFraunhofer IZM‘s core competencies, which

Events organized by Fraunhofer IZM (Selection)
Session Series »Low-Power Systems«

March 2023

Fachsymposium »Crossing Frontiers in Microelectronics«

September 2023, Berlin

Expert Talks »Materials for Electronic Innovations«

October – December 2023

Radar Signal Processing Based on TI-Ecosystem

November 2023

Materials for RF Applications –November 2023

Understanding Requirements and Material Characterisation
Neuro-Technology Symposium

December 2023

37

Fraunhofer IZM | Annual Report 2023 / 2024

was reflected in the large number of registrations: More than 320 registered interested
parties wanted to be convinced by the collective expertise of our researchers.

Kick-off meeting for the»­AGRARSENSE« project at
Fraunhofer IZM

Neurotechnology Symposium at
Fraunhofer IZMAt the kick-off meeting in early 2023, the various representatives of the European »AGRARSENSE« project gathered at Fraunhofer IZM in
Berlin to jointly define the work packages forthe first project phase and set goals for thecollaboration.

Multidisciplinary collaboration is one of thecornerstones of successful research. For thisreason, the »Bioelectronic Technologies«group organized a neurotechnology symposium at Fraunhofer IZM in Berlin in December
2023.

The project is driving forward urgently needed
digital innovations for sustainable management in agriculture and forestry. It supports
the implementation of aspects of Industry 4.0
and »Smart Farming« as well as sustainability aspects through the targeted use ofenergy and resources for healthy, sustainableproduction.

Laboratory tours, networking and specialist
presentations were on the agenda. IZM colleagues Vasiliki Giagka, Andreas Ostmann andChristine Kallmayer as well as Wouter Serdijn
and Achilleas Savva from the Bioelectronics Group at Delft University of Technology
presented their current research findings in
the fields of bioelectronics, neural interfaces, miniaturization, and system integration
technologies.

The »AGRARSENSE« project initiative is coordinated by the Swedish partner KOMATSU
and the Fraunhofer Institutes EMFT and IZM.
As part of the project, the corresponding

Events with Fraunhofer IZM participation(Selection)
SPIE Photonics West 2023

January, San Francisco (USA)embedded world 2023

March, Nuremberg (D)

IMAPS Seminar

March, Illmenau (D)PCIM Europe 2023

May, Nuremberg (D)SMTconnect 2023

May, Nuremberg (D)SENSOR+TEST 2023

May, Nuremberg (D)ECTC 2023

May, Orlando, Florida (USA)EMPC 2023

September, Hinxton (UK)

FMD.iDays 2023

September, Berlin (D)MikroSystemTechnik Kongress 2023

October, Dresden (D)Compamed 2023

November, Düsseldorf (D)SEMICON Europa 2023

November, Munich (D)38

ICT and the data management level arebeing developed. The project is funded aspart of the EU Key Digital Technologies Joint
Undertaking (KDT JU) and brings together 52
partners from 15 EU countries.

From Berlin to Australia for the
climateLast year, numerous colleagues again took
part in the City Cycling campaign with great
success and were able to set a new record.
City Cycling is a nationwide initiative to promote cycling, in which small teams compete
against each other within or across Institutes:
The aim is to cover as many kilometers as
possible on the saddle in 21 days, either alone
or on shared bike tours, and thus promote
cycling and climate-friendly mobility. The
Fraunhofer IZM team topped last year‘s goodresult once again: 75 colleagues from all
locations cycled over 20,000 kilometers. They
could have easily made it to Australia and evena little further. Congratulations on this great
success!

Events

The Long Night of the­Sciences had something instore for old and young alike

Hands-on research –Long Night of the Sciences 2023

IZM researchers at IMAPS 2023
in the USA

On June 17, 2023, Berlin‘s research institutions
opened their doors to the Long Night of theSciences for the 21st time and, for the first timesince 2015, Fraunhofer IZM was once again
represented with various hands-on highlights.
Some of the activities were aimed specifically at very young visitors. They were able todecorate a bag with fabric flowers and LEDs
in the textile lab, for instance. Once they’d got
warmed up, they were allowed to pick up a
soldering iron in the Start-a-Factory laboratory
and make a mini metal detector.

The 56th International Symposium on Microelectronics (IMAPS 2023) took place from
October 2-5, 2023, in San Diego, California,
and attracted nearly 800 participants fromaround the world. A highlight of the symposium were the 14 Professional Development
courses, which looked at the latest researchfindings in microelectronics. In these courses, two of which were led by IZM researcher
Prof. Dr. Ivan Ndip, participants had theopportunity to take a deep dive into areas
such as design, manufacturing optimization,
and wafer-level and panel-level technologies. In addition, IZM colleagues gave several
presentations on wafer-level and panel-levelpackaging topics at the symposium.

Young and old alike were very determinedwhen it came to generating energy on a bicycle. Depending on how hard the pedals were
pushed, the energy generated could be used
to keep a coffee warm or power a blender, forexample.
Our colleagues from the environmental­department taught the visitors how toextend the service life of high-tech devices
and ­minimize their environmental impact.
Under the heading of »modular design«, it
was shown how smartphones could be maderepairable and recyclable and how recyclable
high-tech d­ evices could be manufactured
locally.
With around 400 interested guests, the Long
Night of the Sciences was a complete successfor Fraunhofer IZM.

39

Fraunhofer IZM | Annual Report 2023 / 2024

Fraunhofer IZM at trade fairs
Fraunhofer IZM on the road... the Institutetraveled to trade fairs and congresses in San
Francisco, Cambridge and Dresden in 2023. It
all started in February with Photonics West in
San Francisco, where IZM researchers presented the latest developments in the field ofphotonic packaging.
This was followed in May by the trade fairtrio of Sensor + Test, PCIM and SMTconnect
in Nuremberg – a logistical challenge foreveryone involved every year. The undisputed
highlight of the SMT for many years has
been the Future Packaging production line,
supervised and masterfully staged by IZM
colleague Ulf Oestermann. This year, IZM had
another crowd-puller in store – a ten-meter-wide graphic on high-end performance
packaging illustrated new integration solutionsin advanced packaging and attracted many
curious visitors to the stand. You can also findthe graphic on page 6 of this annual report.
The IZM trade fair year was rounded off inautumn with the MST Congress in Dresden,
where the Institute not only had a stand,but also contributed several papers to thecongress program. The focus here was on
meeting and exchanging ideas with customers
and project partners.

High-end performance­packaging exhibited at
SMTconnect in Nuremberg

40

PromotingYoung Talent at
Fraunhofer IZM
The future of science lies in the hands ofyoung people. For this reason, Fraunhofer
IZM has made it its mission for many years topromote young talent and introduce young
people to scientific careers.
The Institute promotes its numerous offers byparticipating in Girls‘ Day, but also events suchas the TalentTakeOff with 30 STEM students
or a tour of the research institute with Jugendforscht alumni. (School) internships, apprenticeships or places for a Voluntary EcologicalYear – promoting young talent is a top priority
for us, for which Fraunhofer IZM was recently
awarded the IHK seal for »Excellent Training
Quality« by the Berlin Chamber of Industry
and Commerce. Fortunately, the advertisingmeasures were very well received: The Institute welcomed numerous new apprentices
and interns in 2023.

Promoting Young Talents

Supervision of interns andapprentices

Voluntary Ecological Yearin the field of sustainability

Ten apprentices in the fields of microtechnology, surface coating, and office communication as well as one external group
apprentice learned at Fraunhofer IZM in 2023.
Dual training programs enable young people
to work in a practical and interdisciplinary
way. After the collaboration with the Gabriele-von-Bülow-Gymnasium, Fraunhofer IZM’spartner school, was strengthened in 2023
and the cooperation agreement extended, 24
student interns were hosted by twelve different working groups at the Institute’s locationsin Berlin and Dresden. The students had theopportunity to get to know various professional fields and laboratories at the Institute,learn about the world of microelectronics, andget an idea of scientific research.

Whether smartphones, laptops or airbag
sensors – microelectronics have become an
integral part of our lives. The increased use oftechnology also has an impact on the environment. The »Environmental and Reliability
Engineering« department, in which a Voluntary Ecological Year (FÖJ) can be completed
at the Institute, looks at precisely this topic. In
2023, two FÖJ students had the opportunity
to play an active role in developing concepts
to increase the environmental compatibility
and energy efficiency of electronic devices.

In addition, Fraunhofer IZM once again took
part in the Berlin project EnterTechnik. As only
10.7 % of apprentices in the STEM sector in
Germany are female, the cooperation withEnterTechnik is particularly important to theInstitute. As part of the one-year program,
girls can get a taste of up to four different
technical professions. After the technical year,
75 % of participants decide to enter the STEM
field. Around half of the apprentices at Fraunhofer IZM are female.

Girls‘ Day 2023
Twelve schoolgirls from Gabriele-­von-BülowGymnasium learned more about microelectronics and the components of smartphones
on Girls’ Day 2023. Together with researchers
from Fraunhofer IZM, they learned how smartphones manage to function reliably in highly
fluctuating temperatures, what microelectronics actually means, and where they areused. Of course, there was also a tour of thecleanroom – a highlight of every Girls’ Day.

A perennial highlightof the Girls’ Day – Atour of the cleanroom

41

Fraunhofer IZM | Annual Report 2023 / 2024

Facts & Figures42

Facts & Figures

Fraunhofer IZM in
Facts and Figures

Financial situation
In 2023, Fraunhofer IZM was able to buildon the success of previous years, but was
not spared the general effects of inflation,
particularly in terms of energy costs. Turnover increased significantly by 6.9 percent to42.3 million euros. In 2023, Fraunhofer IZM
was able to cover 80 percent of its operating budget with external income. In total,
the volume of externally financed projects
increased to 33.9 million euros. Income from
German and international industrial companies and trade associations remained stable
at 13.5 million euros in 2023. Fraunhofer IZM
covered 31.9 percent of its costs throughdirect orders from industry.

Equipment investments
More than 2 million euros of equity capitalwere used for ongoing replacement andrenewal investments in 2023. The equipment
at Fraunhofer IZM has been improved througha number of targeted individual measures andthe efficiency of existing systems has been
increased. A further 1.1 million euros wereused for various smaller construction measures
to boost Fraunhofer IZM‘s efficiency.
The Institute is participating in the establishment of the Research Fab Microelectronics
Germany – Module Quantum and Neuromorphic Computing (FMD-QNC). The aim of
this consortium is to build a bridge between
basic research and the industrial production
and application of QC / NC technologies in
the future. Services ranging from preliminary
research and technology development to pilot
production will be offered. Fraunhofer IZM
will procure equipment and systems for a totalof 11 million euros; investments of 2.5 million
euros have already been realized in 2023. The

establishment of the Laboratory for Bioelectronic Systems was continued with the supportof the State of Berlin. A further 0.6 million
euros were invested here in 2023. The aim ofthe laboratory is to develop and establish auniversal technology platform and laboratory
infrastructure for the production of bioelectronic systems. With support from the Fraunhofer
Strategy Fund, a high-precision system forassembly in heterogeneous system integration
worth 0.8 million euros was put into operation. Also together with the Fraunhofer Strategy
Fund, 1.0 million euros were invested in theestablishment of a laboratory for the development of architecture and operating concepts
for robust, energy-efficient electronics witha focus on industrial electronics and sensor
technology.

Personnel development
The number of employees at the IZM sites
in Berlin, Cottbus and Dresden / Moritzburg
remains stable at around 450 at the end of2023. This figure also includes 136 interns,
bachelor‘s and master‘s students and student assistants who received comprehensive
support at Fraunhofer IZM. The Institute offers
students the opportunity to combine theirstudies with practical scientific work in theInstitute‘s offices and laboratories. In addition,
ten apprentices were trained at the Institutein 2023 as microtechnologists, surface coaters
and office management assistants.

Fraunhofer IZM in 2023
Budget42.3 million euros

External revenue

33.9 million euros(80 percent of total turnover)

Sites

Berlin, Cottbus und Dresden / Moritzburg

Laboratories>  8,000 m2

Staff

450 (including 136 student a­ ssistants,­master students, i­nterns and 10
apprentices)43

Fraunhofer IZM | Annual Report 2023 / 2024

Awards, Dissertations,
Editorials

AwardsDissertations»Elektronik« magazine picks Fraunhofer innovation
as its Product of the Year
Simply pop a pill to identify a fault - researchers at Fraunhofer
IZM, in cooperation with Micro Systems Technologies (MST),
Sensry GmbH and TU Berlin, have made this a reality. The
waterproof IoT sensor is as small as a piece of candy and canreliably measure the properties of liquids even in places that are
difficult to access. This can not only help with the identificationof ­diseases, but also significantly simplify the maintenance ofindustrial machinery.

Franieck, Erik
Development of Inlinecure Characterization Methods of­Epoxy-based Packaging Materials for Electronic Packages via
Dielectric Analysis

In this method, a frequency spectrum is sent from one electrodethrough a medium to a second electrode. A spectrum, i. e. a
specific fingerprint of this medium, can be derived from this. Ifchanges in material or fluid properties become apparent, thiscan be an indication of both the progressive corrosion of a component and the presence of a specific clinical picture. Until now,
impedance analyzers have not been small and mobile enoughto be used for these purposes. Researchers at Fraunhofer IZM
in Berlin, with the support of MST and Sensry, have therefore
developed a compact and modular IoT sensor for these applications that can measure impedances and transmit them ­wirelessly.
As a result, it is not only waterproof, but also biomedicallycompatible.
Readers of the trade journal »Elektronik« voted the impedance
spectroscopy capsule developed at Fraunhofer IZM one of thethree best products of the year out of over 2,500 innovations.
The world’s smallest component of its kind was awarded one of
the coveted audience prizes in the »Medical« category by the
Elektronik readers, which TU project manager and research associate Basel Adams accepted at the award ceremony in Munich.

44

Martins da Ponte, Ronaldo
IC-MEMS Co-fabrication; Enabling Smart-seamless M­ icrosystem
Integration for Emerging Biomedical Technologies
Proske, Marina
Ecodesign Concepts and Environmental Assessments­Addressing Product Obsolescence
Rickert, Wilhelm
An Investigation of the Electromagnetic Coupling Problem by
Means of a Rational Framework and Selected Experiments
Vermeer, Wiljan
Integration of Energy Storage in Solar-power Electric Vehicle
Smart Charging System

Editorials
Bioelectronic Medicine Journal
Giagka, V. (Associate Editor)
International Journal of Microelectronics and Electronic
PackagingNdip, I. (Associate Editor)

Facts & Figures

Lectures

BTU Cottbus-Senftenberg
Prof. Dr. M. Jaeger-Erben
BTU4Future – Climate Protection and Sustainable
Development
Colloquium »Transdisciplinary Sustainability Research«
Introduction to Technology and Environmental Sociology
Sociology
MOOC Global Studies
Summer School »Circular Economy«
Transdisciplinary Sustainability Research

Dr. N. F. Nissen, Dr. A. Middendorf
Ecodesign for Electronic Systems
Prof. Dr. M. Schneider-Ramelow
System Integration Technologies
System Integration Materials
Dr. O. Wittler, Dr. J. Jaeschke
Reliability of Integrated Electronics Systems

Universität Aalborg
Prof. Dr. Ivan Ndip
Antennas
Internship Antenna Design

Prof. Dr. E. Hoene
Design of Modern Power Semiconductor Devices
EMC in Power Electronics

Delft University of Technology
Prof. Dr. V. Giagka
Active Implantable Biomedical Microsystems
Bioelectricity
Neurostimulation

University of Applied Sciences for Engineeringand Economics in Berlin
M. Bäuscher, M. Hubl
BioMEMS

Dresden University of Technology

S. Rotzler
Industrial Laundering, Textile LabelingProf. Dr. J. Panchenko
3D System Integration and 3D Technologies
Micro- / Nanomaterials and Reliability Aspects

Dr. H. Walter
Materials in Microsystem Technology 1
Materials in Microsystem Technology 2

Technical University of Berlin

weißensee kunsthochschule berlin

Dr. P. Mackowiak, Dr. M. Schiffer
Technologies and Materials for Microsystems Technology

S. Rotzler
Soft Hard Smart –an Interactive Introduction into Textile Electronics

Prof. Dr. W. H. Müller
Hands-on Project to Finite Element Analysis (Project)
Structural Engineering and Basic Strength of Materials

45

Fraunhofer IZM | Annual Report 2023 / 2024

Cooperation with Universities(Selection)

Some of Fraunhofer IZM‘s university partners
Aalborg University, Denmark
Aalto University, Finland
AGH University of Science and Technology, Poland
Binghampton University, USA
Delft University of Technology, Netherlands

To effectively implement its research goals, Fraunhofer IZM has
established strategic networks with universities in Germany
and abroad. Close cooperation with universities is an important pillar of Fraunhofer‘s success model. While the universities
bring their innovative ability and competence in basic research
to the table, Fraunhofer contributes excellence in appliedresearch as well as outstanding technical infrastructure.

Eindhoven University of Technology, Netherlands
KU Leuven, Belgium
Michigan State University, USA

Cooperation with the Technical University of Berlin

Tohoku University, Japan
University College London, UK
University of Quebec in Trois-Rivières, Canada
University of Tokyo, Japan
University of Utah, USA
University of Zurich, Switzerland
Berlin University of the Arts
Bielefeld University

Ever since its foundation in 1993, Fraunhofer IZM has drawn alot from its productive cooperation with the Research Center
for Microperipheric Technologies at the Technical Universityof Berlin, forming one of the world’s first research institutions
for packaging and interconnection technologies in the 1990s.
Since 2021, Professor Martin Schneider-Ramelow has beenheading not just Fraunhofer IZM, but also the Research Center
for Microperipheric Technologies.

Bundeswehr University Munich
Chemnitz University of Technology
Heidelberg University

Fraunhofer IZM-ASSID cooperates with TU Dresden

Humboldt University of Berlin
Otto-von-Guericke University Magdeburg
Rhenish Friedrich Wilhelm University of Bonn
Technische Hochschule Ingolstadt
University of Erlangen-Nuremburg
University of Freiburg

Within the joint junior professorship »Nanomaterials for Electronic Packaging« of Fraunhofer IZM-ASSID and TU Dresden,
Honorary Professor Juliana Panchenko and her team are working on new materials and technologies for fine-pitch interconnects in 3D / 2.5D Si structures.

University of Mainz
University of Münster
University of Rostock

Cooperation with BTU Cottbus-Senftenberg

Weißensee Academy of Art Berlin

Fraunhofer IZM intensifies its cooperation with BTU in the
branch office for high-frequency sensor systems in Cottbus.
Since February 2023 IZM department head Prof. Ivan Ndip has
held the chair for for Antennas and Radio Frequency Systems
Integration. The research activities within the Innovation
Campus (iCampμs) Cottbus focus on design, test procedures
and characterization of integrated antennas, on co-design ofchip-package antennas as well as system integration solutions forthe realization of miniaturized radio frequency sensor systems.

46

Facts & Figures

Cooperation with Industry(Selection)

AEMtec GmbH

Berlin (D)LTB GmbH

Radebeul (D)Ajinomoto GroupJP, USA

Malvern PANalytical B.V.

Almelo (NL)

Allegro MicroSystems

Manchester, NH (USA)MENNEKES Elektrotechnik GmbH &Kirchhunden (D)Amkor Technology, Inc.

Tempe, AZ (USA)Co. KGAMO GmbH

St. Peter am Hart (AT)

Micro Systems Engineering GmbH

Berg (D)ams AG­Premstätten (AT)

Mitteldeutsche Netzgesellschaft

Halle (D)Amsterdam Scientific Instruments B.V.

Amsterdam (NL)

Strom mbH

AnSem NV

Leuven (BE)Multi Channel Systems MCS GmbH

Reutlingen (D)AT&S Austria Technologie &Leoben (AT)Nagase ChemteX Corporation

Osaka (JP)Nexperia

Nijmegen (NL)

Systemtechnik AG
AUDI AG

Ingolstadt (D)NEXT FUEL R&D LTD

Neve Yamin (IL)

Baker Hughes Inteq GmbH

Celle (D)NKG

Nogoya (JP)BASF SE

Ludwigshafen am

OSYPKA AG

DE

Rhein (D)Philips

NL

Berliner Nanotest und Design GmbH

Berlin (D)Picosun Oy

Masala (FI)BMW AG

Munich (D)Pilz GmbH & Co. KG

Ostfildern (D)Bosch Semiconductor Manufacturing

Dresden (D)PlathOstfildern (D)Brewer Science, Inc.

Rolla, Missouri (USA)POSIC S.A.

Colombier (CH)Carl Zeiss SMT GmbH

Jena (D)RENA Technologies GmbH

Gütenbach (D)CERN

Meyrin (CH)Resonac

Tokio (JP)Contag GmbH

Berlin (D)Robert Bosch GmbH Zentrum für

Renningen (D)Corning Inc.

Corning, NY (USA)Forschung und Vorausentwicklung

Delo GmbH

Windach (D)Rolls-Royce Deutschland Ltd & Co KG

Cottbus (D)DeltaHeat GmbH

Berlin (D)Saltec GmbH

Salzhausen (D)DISCO Corporation

Munich (D), Tokio (JP)Schaeffler AG

Herzogenaurach (D)DResearch

Berlin (D)Schlumberger

Paris (FR)DuPont de Nemours, Inc.

Wilmington, DE (USA)

Schmoll Maschinen GmbH

Rödermark (D)DuPont Electronics & Imaging

Marlborough, MA (USA)Semsysco GmbHSalzburg (AT)DustPhotonics

Modi‘in-­Maccabim-sensiBel AS

Oslo (NO)Re‘ut (IL)

Siemens AG

Berlin, Erlangen,

Evatec AG

Trübbach (CH)FACEBOOK TECHNOLOGIES, LLC

Menlo Park, CA (USA)SLAC National Accelerator

FIRST SENSOR

Berlin (D)Laboratory

Fujifilm Electronic Materials

EU, USA

Süss MicroTec SE

Garching, München (D)GEFRAN S.p.A.

Provaglio d‘Iseo (IT)Swissbit Germany AG

Berlin, Broschhofen (CH)GLOBALFOUNFRIES INC.

Dresden (D)TEN Thüringer Energienetze

Erfurt (D)Heraeus

Hanau (D)GmbH & Co. KG

IMASENIC Advanced Imaging S.L.

Barcelona (ES)Texas Instruments

München, London (GB)InnoSenT GmbH

Donnersdorf (D)Thales Group

Paris (FR)Intel Corporation

Santa Clara, CA (USA)The Chemours Company

Wilmington, DE (USA)KSG GmbH

Görnsdorf (D)United Monolithic Semiconductors (UMS

Villebon-sur-Yvette (FR)

­München (D)Menlo Park, CA (USA)47

Fraunhofer IZM | Annual Report 2023 / 2024

Memberships (Selection)

3D & Systems Summit (SEMI)

Dr. M. Junghähnel

Member Program Committee

3DInCites

Dr. M. Junghähnel

Member Advisory BoardAMA Fachverband Sensorik, Wissenschaftsrat

H. Pötter

MemberCluster Optik BB, Photonik für Kommunikation und Sensorik

Dr. H. Schröder

Spokesman

Deutscher Verband für Schweißtechnik DVS

Prof. Dr. M. Schneider-Ramelow

Representative of Fraunhofer IZM

Deutscher Verband für Schweißtechnik DVS

Prof. Dr. M. Schneider-Ramelow

Chairman

ECPE Competence Centre

Prof. Dr. M. Schneider-Ramelow

MemberEFDS – Europäische Forschungsgesellschaft Dünne Schichten e. V.

Dr. M. Junghähnel

MemberFachausschuss »Beschichtungstechnologien für optische und

Dr. M. Junghähnel

MemberWissenschaftlicher Beirat des EFDS

Dr. M. Junghähnel

Elected Member

European Photonic Industrial Consortium (EPIC)

Dr. H. Schröder

Representative of Fraunhofer IZMEuropean Technology Platform on Smart Systems Integration

H. Pötter

Member Executive Committee,

Arbeitsgruppe »Bonden«

elektronische Funktionalisierung – FABF«(EPoSS)

Board Member

FED Fachverband Elektronik-Design e. V.

Dr. N. F. Nissen

MemberHeterogeneous Integration Roadmap (HIR)

R. Aschenbrenner

Chair Technical Working Group SiPIEEE Electronics Packaging Society

R. Aschenbrenner

Fellow

IEEE EPS Board of Governors

Dr. T. Braun

VP of Conferences

IEEE TC RF High-Speed Components of Systems

Prof. Dr. I. Ndip

Senior Member

IMAPS International Microelectronics Assembly andProf. Dr. M. Schneider-­­Packaging Society

Ramelow, Prof. Dr. I. Ndip

Fellows

IMAPS Deutschland

Prof. Dr. M. Schneider-Ramelow

President

IMAPS Europe ELC

Prof. Dr. M. Schneider-Ramelow

MemberIMAPS Signal / Power Integrity Committee

Prof. Dr. I. Ndip

Chair

International Conference on Coatings on Glass andDr. M. Junghähnel

Board Member

IVAM Fachgruppe Wearables

E. Jung

Technical Chair

OPTICA

Dr. Gunnar Böttger

Representative of Fraunhofer IZM

Organic Electronics Saxony (OES)

E. Jung

Representative of Fraunhofer IZM

Photonics 21

Dr. R. Jordan

Board of Stakeholders

Photonics West Optical Interconnects Conference

Dr. H. Schröder

Chair

PLASMA GERMANY

Dr. M. Junghähnel

Elected Expert

SEMI ESiPAT Group

Dr. T. Braun

MemberSilicon Saxony e. V.

Dr. M. Junghähnel

MemberStrategischer Arbeitskreis Silicon Germany

Prof. Dr. M. Schneider-Ramelow

MemberWissenschaftlich-technischer Rat derDr. M. Hampicke

Representative of Fraunhofer IZM

Plastics (ICCG)

Fraunhofer-Gesellschaft48

Facts & Figures

Publications (Selection)

Baeuscher, M.; Henke, M.; Hoeppner, K.; Ngo, H.; Mackowiak,
P.; Schiffer, M.; Schneider-Ramelow, M.
Evaluation of Upscaling the Selective Electrophoretic
Deposition of Reduced Graphene Oxide on Miniaturized
Au Interdigital Electrodes from Chip-to Wafer-level
Proceedings of the 56th IMAPS International Symposiumon Microelectronics (IMAPS 2023), San Diego, USA,
DOI: 10.4071/001c.94305.
Becker, K.-F.; Voges, S.; Fruehauf, P.; Heimann, M.; Nerreter,S.; Blank, R; Erdmann, M.; Gottwald, S.; Hofmeister, A.; Hesse,
M.; Thies, M.; Mehrafsun, S.; Fust, R.; Beck, E.; Becicka, M.;
Pawlikowski, J.; Schröder, J.; Voigt, C.; Braun, T.; Schneider-­Ramelow, M.
Trusted Data Acquisition in Microelectronics­Manufacturing as a Basis for ML-optimized Processing
Proceedings of the 56th IMAPS International Symposiumon Microelectronics (IMAPS 2023), San Diego, USA,
DOI: 10.4071/001c.94507.
Bernabé, S.; Tekin, T.; Sirbu, B.; Charbonnier, J.; Grosse, P.;
Seyfried, M.
Packaging and Test of Photonic Integrated Circuits (PICs)
Integrated Nanophotonics: Platforms, Devices, and ­Applications,2023, Wiley-VCH, DOI:10.1002/9783527833030.ch1, pp. 1-52.
Billaud, M.; Clemm, C.; Sánchez, D.; Proske, M.; Jügel, M.;
Stobbe, L.; Nissen, N.; Schneider-Ramelow, M.
ICs as Drivers of ICT Carbon Footprint: An Approach toMore Accurate Die Size Assessment
Proceedings of Going Green CARE INNOVATION 2023,
Vienna, Austria.
Böttcher, L.; Ostmann, A.; Löher, T.; Seckel, M.
Concepts for Realizing High-voltage Power Modules byEmbedding of SiC Semiconductors
Proceedings of EMPC 2023, Hinxton, United Kingdom.

Braun, T.; Thomas, T.; Becker, K.-F.; Huyen Le, T.; Tschoban, C.;
Aschenbrenner, R.; Dreissigacker, M.; Schneider-Ramelow, M.
3D Freeform Antenna-in-package Approach for FOWLP
Proceedings of ECTC 2023, Orlando, USA.
Chen, T.; André, P.; Bezerra, M.; He, Z.; Li, G.; Hoene, E.
Systematic Derivation and Experimental Verification of aCompact Loss Model for Soft-switching Half-bridges
Proceedings of EPE 2023 ECCE Europe, Aalborg, Denmark.
Dijk, M. v.; Wittler, O.; Wagner S.; Schneider-Ramelow, M.
Modification of Prony Series Coefficients to Accountfor Thermo-oxidative Ageing Effects Within Numerical
Simulations
Proceedings of EuroSimE 2023, Graz, Austria
DOI: 10.1109/EuroSimE56861.2023.10100845, pp. 1-5.
Dilek, S.; Tschoban, C.
Performance Evaluation of E-band Transmit-receive
Front-ends Based on Characterization of Joint Effects of
IQ Imbalance and Carrier Phase/Frequency Offset
IEEE Transactions on Microwave Theory and Techniques,Vol. 71, No. 5, 2023, DOI: 10.1109/TMTT.2022.3223946,
pp. 2069-2081.
Elsotohy, M.; Jaeschke, J.; Sehr, F.; Schneider-Ramelow, M.
Mission Profile-based Digital Twin Framework Using
Functional Mockup Interfaces for Assessing System’s
Degradation Behaviour
Microelectronics Reliability, Vol. 150, 2023,
DOI: 10.1016/j.microrel.2023.115086.
Erbacher, K.; Alves Marquez, J.; Mackowiak, P.
Wafer Level Chip Size Package Integration of an­Aero-acoustic MEMS Microphone into a Thin and F­ lexible
Substrate
Proceedings of the 56th IMAPS International Symposium on Microelectronics (IMAPS 2023), San Diego, USA,
DOI:10.4071/001c.94495.

49

Fraunhofer IZM | Annual Report 2023 / 2024

Erbacher, K.; Bourquard, C.; Lokesh, O.; Wu, L.; Mackowiak, P.;
Schneider-Ramelow, M.; Ngo, H.
Characterization of a Piezo-resistive MEMS Microphone
for Aero-acoustic Measurements
Proceedings of SMSI 2023, Nürnberg, Germany,
DOI: 10.5162/SMSI2023/C4.4.

Kilian, B.; Gleichauf, J.; Maniar, Y.; Wittler O.; Schneider-­Ramelow, M.
Finite Element-based Monitoring of Solder Degradationin Discrete SiC MOSFETs
Proceedings of EuroSimE 2023, Graz, Austria,
DOI: 10.1109/EuroSimE56861.2023.10100794, pp. 1-8.

Henke, M.; Baeuscher, M.; Zoschke, K.; Ali-Röder, J.; Keller, A.;
Mukhopadhyay, B.; Mackowiak, P.; Schneider-Ramelow, M.
Simulation and Fabrication of SU-8 Microfluidics Mixers
Capped by Wafer-level Bonding
Proceedings of IEEE BioSensors 2023, London, United­Kingdom, DOI: 10.1109/BioSensors58001.2023.10281100.

Köszegi, J.-M.; Mackowiak, P.; Ndip, I.; Schiffer, M.;­Schneider-Ramelow, M.
RF Models for Through SiC Vias for Highly Integrated
Interposer Technology
Proceedings of SSI 2023, Brügge, Belgium,
DOI: 10.1109/SSI58917.2023.10387952.

Hoffmann, S.; Hoene, E.
Coupled PFC Inductor for 22 kW On-board Charger Using
PCB Technology
Proceedings of EPE 2023 ECCE Europe, Aalborg, Denmark.

Le, T. H.; Kaiser, M.; Ndip, I.; Koeszegi, J.; Thomas, T.;­Nallaweg, O.; Dreissigacker, M.; Tschoban, C.
3D Mold Embedded PCB-based MIMO Antenna Arraysfor 79 GHz Automotive RADAR
Proceedings of EuRAD 2023, Berlin, Germany,
DOI: 10.23919/EuRAD58043.2023.10289146, pp. 2-5.

Holzapfel, L.; Giagka, V.
Ultrasound for Data Transfers from Deep Implants: An
Experimental Comparison Between Binary-­frequencyshift-keying and On-off-keying with Backscatter­Modulation
Proceedings of IUS 2023, Montreal, Canada,
DOI: 10.1109/IUS51837.2023.10308264, pp. 1-4.

Mackowiak, P.; Köszegi, J.-M.; Schiffer, M.; Schneider-­Ramelow, M.
RF Modelling of for Through SiC Vias and Fabrication of
SiC Based Interposer
Proceedings of EPTC 2023, Singapore, Singapore,
DOI: 10.1109/EPTC59621.2023.10457732.

Huber, S.; Stegmaier, A.; Dijk, M. v.; Nguyen, N.; Hölck, O.;
Wittler, O.; Schneider-Ramelow, M.
Improving Warpage Characterization of Large Wafers in
Fan-out Packaging Technology
Proceedings of ECTC 2023, Orlando, USA,
DOI: 10.1109/ECTC51909.2023.00227, pp. 1332-1338.

Mackowiak, P.; Köszegi, J.-M.; Schiffer, M.; Schneider-­Ramelow, M.
TSiCV Based Silicon Carbide Interposer Technology
Proceedings of SSI 2023, Brügge, Belgium,
DOI: 10.1109/SSI58917.2023.10387967.

Jaeger-Erben, M.; Wieser, H.; Marwede, M.; Hofmann, F.
Durable Economies: Organizing the Material­Foundations of Society
Labor and Organization, Vol. 10, transcript Verlag, Bielefeld,
Germany, 2023, DOI: 10.14361/9783839463963.

Manier, C.-A.; Zoschke, K.; Oppermann, H.
Technische Machbarkeitsstudie zur Massiv-Parallelen
Montage und Verbindung von Mikro-LEDs
Proceedings of MikroSystemTechnik Kongress 2023, Dresden,
Germany, ISBN: 978-3-8007-6203-3, pp. 490-498.

Khurana, G.; Panchenko, J.
Improvement in Wafer-to-wafer Hybrid Bonding Using
Optimized Chemical Mechanical Planarization Process
for Cu Dishing
Proceedings of EPTC 2023, Singapore, Singapore.

Marwede, M.; Smolander, M.; Hakola, L.
Design of E-textile and Printed Electronics Applications
for Their Life Cycle
Proceedings of PLATE 2023, Espoo, Finland.

Khurana, G.; Panchenko, J.
Intermetallic Growth Study of Ultra-thin Copper and Tin
Bilayer for Hybrid Bonding Applications
Proceedings of the ECTC 2023, Orlando, USA,
DOI: 10.1109/ECTC51909.2023.00149.

50

Ndip, I.; Le, T. H.; Schneider-Ramelow, M.
Wideband THz Yagi-Uda Bond Wire Antennas
Proceedings of IEEE AP-S/URSI 2023, Portland, USA,
DOI: 10.1109/USNC-URSI52151.2023.10237409,
pp. 1909-1910.

Facts & Figures

Nissen, N. F.; Stobbe, L.; Schulz, A.; Chisolm, C.; Proske, M.;
Billaud, M.; Druschke, J.; Schneider-Ramelow, M.
Energy Demand and Carbon Footprint of ICT in Germany
until 2033
Proceedings of Going Green-EcoDesign 2023, Nara, Japan.

Schröder, H.; Kirsch, O.; Weber, D.; Thiem, H.
Photonic System Integration by Applying Micro­electronic
Packaging Approaches Using Glass Substrate
Proceedings of ECTC 2023, Orlando, USA,
DOI: 10.1109/ECTC51909.2023.00045.

Obst, M.; Schwartz, R.; Miller, M.; Becker, K.-F.; Shangguan, D.; Hoelck, O.; Gross, M.; Braun, T.; Frederickson, C.;­Schneider-Ramelow, M.
Quality Assurance for Advanced Packaging Prototyping –Solder Paste Behavior as Key Monitoring Parameter
Proceedings of IPC APEX Expo 2023, San Diego, USA.

Sirbu, B.; Zoschke, K.; Bernabé, S.; Wilmart, Q.; Tekin, T.
3D Silicon Interposer for Terabit/s Transceivers Based on
High-speed TSVs
Proceedings of ECTC 2023, Orlando, USA,
DOI:10.1109/ECTC51909.2023.00230.

Panskus, R.; Holzapfel, L.; Serdijn, W. A.; Giagka, V.
On the Stimulation Artifact Reduction During­Electrophysiological Recording of Compound Nerve
Action Potentials
Proceedings of EMBC 2023, Sydney, Australia.
Perlwitz, P.; Tschoban, C.; Ndip, I.; Pötter, H.;
Schneider-­Ramelow, M.
Analysis and Characterization of Castellated Holes as
RF Interconnects for Modular Millimeter-wave Devices
Proceedings of EMPC 2023, Hinxton, United Kingdom.
Pitilakis, A.; Tyrovolas, D.; Mekikis, P.-V.; Tegos, S. A.;­Papadopoulos, A.; Tsioliaridou, A.; Tsilipakos, O.; Manessis, D.;
Ioannidis, S.; Kantartzis, N.; Akyildiz, I. F.; Liaskos, C.
On the Mobility Effect in UAV-mounted Absorbing
Metasurfaces: A Theoretical and Experimental StudyIEEE Access, Vol. 11, 2023, Electronic ISSN: 2169-3536,
DOI: 10.1109/ACCESS.2023.3299379, pp. 79777-79792.
Rämer, O.; Weber, C.; Hutter, M.; Spanier, M.; Ostmann, A.;
Schneider-Ramelow, M.
Challenges in Realizing Silver Sintered Flip-chip­Interconnects for High Temperature Sensor Systems
Proceedings of MikroSystemTechnik Kongress 2023, Dresden,
Germany.
Salo, T.; Werft, L.; Adams, B.; Vito, D.; Halme, A.; Scenev, V.;
Walter, H.; Löher, T.; Vanhala, J.
Mechanical Properties of Structured Copper and Printed
Silver Hybrid Stretchable Electronic Systems
Flexible and Printed Electronics, Vol. 8, No. 2, 2023.
Schischke, K.; Rückschloss, J.; Schlegel, M.-C.; Zollinger, J.;
Nissen, N. F.; Schneider-Ramelow, M.
The European Union‘s Energy Label for Smartphones:
Does it Guide Consumers to Make Environmentally­Sustainable Choices?
Proceedings of ICCE 2023, Berlin, Germany,
DOI: 10.1109/ICCE-Berlin58801.2023.10375619.

Stobbe, L.; Richter, N.; Quaeck, M.; Knüfermann, K.; Druschke,J.; Fahland, M.; Höller, V. W.; Wahry, N.; Zedel, H.; Kaiser, M.;
Hoffmann, S.; Töpper, M.; Nissen, N. F.
Umweltbezogene Technikfolgenabschätzung Mobilfunkin Deutschland (Projekt UTAMO)
Umweltbundesamt, Texte 26/2023, Dessau-Roßlau, Germany,
ISSN 1862-4804.
Tschoban, C.; Pötter, H.; Becker, L.; Perlwitz, P.; Brockmann, C.;
Groß, M.; Ndip, I.; Schneider-Ramelow, M.
Analysis of the Influences of PCB Process Tolerances andAssembly Tolerances on 60 GHz Radar Sensor for Radar
Toolkit
Proceedings of EPTC 2023, Singapore, Singapore,
DOI: 10.1109/EPTC59621.2023.10457917, pp. 266-272.
Tschoban, C.; Pötter, H.; Dilek, S.; Ndip, I.; Schneider-Ramelow,  M.
Integratable Antenna Concepts Based on Conformal
Antennas for 3D Radar Systems
Proceedings of iWAT 2023, Aalborg, Denmark,
DOI: 10.1109/iWAT57058.2023.10171730, pp. 1-6.
Velea, A. I.; Wilson, J.; Gollhardt, A.; Karuthedath, C. B.;­Thanniyil, A. S.; Giagka, V.
Non-monolithic Fabrication of Thin-film MicroelectrodeArrays on PMUT Transducers as a Bimodal Neuroscientific
Investigation Tool
Proceedings of EMBC 2023, Sydney, Australia.
Weyers, D.; Catuneanu, M.-T.; Lapteva, M.; Vibhuti, V.; He, M.;
Bonhardt, S.; Landwehr, M.; Fell, J.; Nieweglowski, K.; Jamshidi,K.; Bock, K.
Electro-optical Co-integration Platform for High-density
Hybrid Systems – SILHOUETTE
Proceedings of MikroSystemTechnik Kongress 2023, Dresden,
Germany.

51

Fraunhofer IZM | Annual Report 2023 / 2024

52

Facts & Figures

Woehrmann, M.; Dreissigacker, M.; Braun, T.; Schiffer, M.;
Schneider-Ramelow, M.
A Novel FOWLP Method to Integrate Delicate MEMS
Components
Proceedings of ECTC 2023, Orlando, USA,
DOI: 10.1109/ECTC51909.2023.00218.
Yamaguchi, T.; Suto, Y.; Araki, N.; Eto, M.; Fischer, F.; Groth, A.
Investigation of Failure Mechanism of Aluminum-­scandium Wire Bond Contact Under Active Power Cycle
Test
Microelectronics Reliability, Vol. 144, 2023,
DOI:10.1016/j.microrel.2023.114956.
Zoschke, K.; Manier, C.-A.; Oppermann, H.; Meier, D.; Malik, N.;
Zakizade, E.; Michel, M.; Roy, A.; Nguyen, H.-V.; Nguyen, T.-P.
Wafer Level Capping Technology for Vacuum Packaging
of Microbolometers
Proceedings of ECTC 2023, Orlando, USA,
DOI: 10.1109/ECTC51909.2023.00267.

Micro assembly tool:
High flexibility for rapid prototyping
and small batch processing

53

Fraunhofer IZM | Annual Report 2023 / 2024

Patents & Inventions

Böttcher, Lars; Kosmider, Stefan; Löher, Thomas; Ostmann,
AndreasAn electronic module and a method for its manufacture
DE 10 2016 214 607 A1

Oppermann, Hermann; Manier, Charles-Alix
Method for manufacturing a semiconductor­arrangement
DE 10 2021 206 898

Ehrhardt, Christian; Höfer, Jan; Schneider-Ramelow, Martin
Method of manufacturing an electronic component andelectronic component
DE 10 2017 211 058 A1

Oppermann, Hermann; Tekin, Tolga; Manier, Charles-Alix
Optical system, optical components, and method for
manufacturing an optical system
DE 10 2019 210 747 A1

Ndip, Ivan
Antenna device, antenna array, electrical circuit with anantenna device and ribbon bond antenna
EP 401 6729

Oppermann, Hermann; Tekin, Tolga; Stockmeyer, Jörg; ­Fröhlich, Juliane
Assembly comprising a substrate and two components
including optical waveguides, as well as method for
production
DE 10 2019 210 750 A1

Ndip, Ivan; Kallmayer, Christine; Lang, Klaus-Dieter
Three-dimensional antenna device
DE 10 2018 218 894 A1
Ndip, Ivan; Kallmayer, Christine; Lang, Klaus-Dieter
Three-dimensional loop antenna device
DE 10 2018 218 891 A1
Ndip, Ivan; Ostmann, Andreas
Module arrangement comprising an integrated
antenna and embedded components and methodfor m­ anufacturing a module arrangement
US 15.862,833

54Facts & Figures

Advisory Board

ChairmanDr. Franz Richter

Members
Ministerialrätin Dr. Annerose Beck
Saxon State Ministry of Science and Art, Dresden
Paradiso Coskina
VDI / VDE Innovation + Technik GmbH, Berlin
Robert Giertz
AEMtec GmbH, Berlin
Gabi Grützner
Micro resist technology GmbH, Berlin
Dr. Michael Hosemann
Siemens Healthcare GmbH, Erlangen
Prof. Dr. Gerhard Kahmen
IHP GmbH, Leibniz-Institut für innovative
Mikroelektronik, Frankfurt (Oder)
Ministerialrat Bernd Lietzau
The Governing Mayor of Berlin, Senate Chancellery for Scienceand Research
Prof. Dr. Regine Mallwitz
TU Braunschweig, Braunschweig
Jörg Muchametow
eagleyard Photonics GmbH, Berlin

Prof. Dr. Geraldine Rauch
Technical University of Berlin
Johannes Stahr (until end of 2023)
AT&S AG, Leoben (AT)Dr. Markus Ulm
Robert Bosch GmbH
Prof. Dr. Stephan Völker
Technical University of Berlin
Christian Wiebus
NXP Semiconductors Germany GmbH, Hamburg
Marcel Wieland
GlobalFoundries, Dresden
Ministerialrat Christoph Zimmer-Conrad
Saxon State Ministry of Economy, Labour and T­ ransport,
Department Industry, Dresden
Dr. Tina Züchner
Federal Ministry of Education and Research, Department
Electronics and Autonomous Driving, Bonn

55

Fraunhofer IZM | Annual Report 2023 / 2024

Contact

FRAUNHOFER INSTITUTE FOR RELIABILITY
AND MICROINTEGRATION IZM

Gustav-Meyer-Allee 25 | 13355 Berlin, Germany
Phone +49 30 46403 -100
info@izm.fraunhofer.de

Director
Prof. Dr. Ulrike Ganesh (as of August 1, 2024)
Phone +49 30 46403 -153
ulrike.ganesh@izm.fraunhofer.de

Director
Prof. Dr. Martin Schneider-Ramelow
Phone +49 30 46403 -172
martin.schneider-ramelow@izm.fraunhofer.de

Deputy Director
Rolf AschenbrennerPhone +49 30 46403 -164
rolf.aschenbrenner@izm.fraunhofer.de

Director’s Assistant
Dr. Maik Hampicke
Phone +49 30 46403 -683
maik.hampicke@izm.fraunhofer.de

Head of Administration
Jürgen Rahn
Phone +49 30 46403 -105
juergen.rahn@izm.fraunhofer.de

Head of Administration
Carsten Wohlgemuth
Phone +49 30 46403 -114
carsten.wohlgemuth@izm.fraunhofer.de

56

DEPARTMENTS

Wafer Level System Integration
Head: Dr. Michael Schiffer
Phone +49 30 46403 -234
michael.schiffer@izm.fraunhofer.de

Head: Dr. Manuela Junghähnel
Phone +49 0351 795572 -0
manuela.junghähnel@izm.fraunhofer.de

System Integration andInterconnection Technologies
Head: Dr. Tanja Braun
Phone +49 30 46403 -244
tanja.braun@izm.fraunhofer.de
Head: Dr. Andreas Ostmann
Phone +49 30 46403 -187
andreas.ostmann@izm.fraunhofer.de

Environmental and Reliability Engineering
Head: Dr. Nils F. Nissen
Phone +49 30 46403 -132
nils.nissen@izm.fraunhofer.de

RF & Smart Sensor Systems
Head: Prof. Dr. Ivan Ndip
Phone +49 30 46403 -679
ivan.ndip@izm.fraunhofer.de

Head: Harald Pötter
Phone +49 30 46403 -742
harald.poetter@izm.fraunhofer.deKontakt

DRESDEN ASSID BRANCH OF THE INSTITUTEAll Silicon System Integration Dresden (ASSID)
Ringstraße 12, 01468 Moritzburg

Head: Dr. Manuela Junghähnel
Phone +49 0351 795572 -0
manuela.junghähnel@izm.fraunhofer.de

BUSINESS DEVELOPMENT / MARKETING & PR

Business Development Team
Erik Jung
Phone +49 30 46403-230
bdt@izm.fraunhofer.de
Tekfouy Lim
Phone +49 30 46403-8110
tekfouy.lim@izm.fraunhofer.de

Head: Dr. Michael Schiffer
Phone +49 30 46403 -234
michael.schiffer@izm.fraunhofer.de
PR & Marketing
Georg Weigelt
Phone +49 30 46403 -279
georg.weigelt@izm.fraunhofer.de

COTTBUS BRANCH OF THE INSTITUTE
Branch Lab for High-Frequency Sensor Systems
Karl-Marx-Straße 69, 03044 Cottbus

RF & Smart Sensor Systems
Head: Prof. Dr. Ivan Ndip
Phone +49 30 46403 -679
ivan.ndip@izm.fraunhofer.de

Start-A-Factory
Alexandra Rydz
Phone +49 30 46403 -203
alexandra.rydz@izm.fraunhofer.de57

Fraunhofer IZM | Annual Report 2023 / 2024

Notes-----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------

58

Notes-----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------

59

Fraunhofer IZM | Annual Report 2023 / 2024

Imprint

EditorProf. Dr. Martin Schneider-Ramelow
Fraunhofer IZM
www.izm.fraunhofer.de

Editorial Office
mcc Agentur für Kommunikation GmbH
Georg Weigelt, Fraunhofer IZM

Layout / Design
mcc Agentur für Kommunikation GmbHwww.mcc-events.de© Fraunhofer IZM 2024

Photography
AdobeStock/Martin Hempel (23).
All image rights Fraunhofer IZM or Fraunhofer IZM together with:
Volker Mai (Titel, 8, 9, 11, 17, 18, 20, 22, 24, 26, 28, 30, 31, 42, 52); MIKA Berlin (56, 57);
Erik Müller (56), www.robertkeithphoto.com (39)

Title
World’s smallest impedance spectroscopy system in the form of a pill

60

Member ofContact
Fraunhofer Institute for
Reliability und Microintegration IZM
Gustav-Meyer-Allee 25, 13355 Berlinwww.izm.fraunhofer.de© Fraunhofer IZM 2024