NNT'08 (October 13-15, 2008 Kyoto International Conference Center, Kyoto ) Program
October 13, 2008
Reception (Swan, 1F)
Reception (18:00-20:00)

October 14, 2008
Chairpersons: Y. Hirai (Osaka Pref. Univ.), S.Y. Chou (Princeton Univ.)
Opening
Session No.

Start

End

Paper Title

Speakers

9:00 9:05 Opening
9:05 9:10 Opening Remarks
14A-1: Application I

Affiliation

M. Komuro

NNT'08 Chair, NEDO, Japan

Y. Hirai

NNT'08 Program Chair, Osaka Pref. Univ., Japan

Patterned Media Fabrication with Nanoimprint Process B.-K. Lee, D. Lee, E. Cho, H.-S. Kim, M.-B. Lee, J.-S.
Sohn
H. Yoshida 1, Y. Tada 1, S. Akasaka 2, R. Ruiz 3, E.
Chemically Directed Block Copolymer Self-assembly
Dobisz 3, D. Kercher 3, M. Takenaka 2, H. Hasegawa 2,
10:00 for 10nm Scale Nano-Lithography (Invited)
T.R. Albrecht 3

14A-1-1

9:10

14A-1-2

9:40

14A-1-3

10:00 10:20 Structures Utilized Blu-ray Disc Technology (Invited)

S. Endoh and K. HayashibeSony, Japan

14A-1-4

10:20 10:40 3D Visualization of Molding Filling Stages in Thermal

H. Schift 1, G. Kim 2, J.J. Lee 2, K. Vogelsang 1 and J.
Gobrecht 1

1 Paul Scherrer Inst., Switzerland and 2 Korea Inst.
of Machinery & Materials, Korea

9:40 (Plenary)

Nanomold Fabrication and Nanoimprint Anti-reflection

Nanoimprint (Invited)

Samsung Advanced Inst. of Technol., Korea
1 Hitachi, 2 Kyoto Univ., Japan and 3 Hitachi Global
Storage Technologies, USA

Chairpersons: K. Asakawa (Toshiba), H. Kurz ( Aschen Univ./AMO GmbH)
14A-2: Thermal Nanoimprint
10:40 11:00 Quantitative Strategies to Handle Stamp Bending in

14A-2-1

NIL

14A-2-2

11:00 11:20 The Imprint Software: Quantitative Prediction of

14A-2-3
14A-2-4

11:20
11:40

Process Parameters for Successful Nanoimprint
11:40 A Novel Analytical Model for Thermoplastic
Deformation of Resist in Thermal
12:00 Nanoimprint of Metallic Glasses

R.H. Pedersen 1, L.H. Thamdrup 1, A.V. Larsen 1, A.
Kristensen 1 and D.-A. Mendels 2

1 Tech. Univ. of Denmark, Denmark and 2
Cognoscens, France

N. Kehagias 1,2, V. Reboud 1,2, C.M. Sotomayor Torres
1,3
S. Choi, I. Park and A.P. Pisano

1 Campus de Bellaterra, Spain, 2 Univ. College Cork,
Ireland and 3 ICREA, Spain
UCLA, Berkeley, USA

Y. Saotome, K. Amiya, Y. Shibata, A. Makino and A. Inoue Tohoku Univ., Japan

Lunch (12:00-13:10)
Chairpersons: M. Komuro (NEDO), J. Guo (Univ. of Michigan)
14A-3: Production
Considerlation of Nanoimprinting for Production
14A-3-1 13:10 13:30 (Invited)
Industrial Imprint Lithography for High Volume
13:30
13:50
14A-3-2

J. Ahopelto
B. Heidari

VTT Micro & Nanoelectron., Finland
Obducat, Sweden

D. Morihara 1, H. Hiroshima 2 and Y. Hirai 1

1 Osaka. Pref. Univ. and 2 AIST, Japan

Manufacturing Optoelectronic (Invited)

Chairpersons: H. Hiroshima (AIST), C.G. Willson (Univ. of Texas)
14A-4: UV Nanoimprint
Numerical Study on Bubble Trapping in UV
14A-4-1 13:50 14:10

14A-4-2
14A-4-3
14A-4-4

14:10
14:30

Nanoimprint Lithography
14:30 Nanoimprint Lithography for Sub-10 nm Complex
Patterns
14:50 Duplication of Mold for Nanoimprint Lithography using
reworkable UV Curing Resin

14:50 15:10 Fabrication of Thin Film Pua Stamps with Micro andW. Wu 1, Q. Xia 1, D. Morecroft 2, J. Yang 2, K.K.
1 Hewlett-Packard, 2 MIT, USA and 3 Nanking Univ.,
Berggren 2, H. Ge 3, X. Li 1, S.-Y. Wang 1 and R.S.
China
H. Wakayama, K. Mitsukura, H. Okamura, K. Suyama, Y. Osaka Pref. Univ., Japan
Hirai and M. Shirai
S.Y. Park, Y.J. Kim, H.S. Jang and J.J. Lee

Korea Inst. of Machinery & Materials, Korea

Nano Patterns by the UV-Nanoimprint Lithography

Coffee Break (15:10-15:30)

POSTER SESSION (15:30-17:30)
Room B-1: Thermal Imprint / Process

14B1-5-1 Impact of Ultrasonic Vibration on Room-Temperature Imprinting
Short-Cycle Thermal Nanoimprint using Smart Stamps
14B1-5-2
14B1-5-3 Theoretical Study of Ultimate Resolution in Glass Nanoimprint
14B1-5-4 Fabrication of Partition Wall for Solar Cell by Hot Embossing
14B1-5-5 Profiling of a Poly(Styrene) Residual Layer in Hot Emboss using a mm14B1-5-6 Fracture Mechanism of Glass Forming using Imprinting Process
14B1-5-7 Gold Nanowires Imprinted by Hot-Embossing on Parylene-C/Polyimide
14B1-5-8 Contact Angles in Thermal Imprint
14B1-5-9 Importance of Mold Pattern Profile and Resist Thickness for Demording
Process Time in Glass Nanoimprint
14B1-5-10
Impact of Process Conditions Temperature on Adhesion and Friction

14B1-5-11 Forces in Thermal NIL
14B1-5-12 Process and Polymer Design for Rapid Thermal NIL

H. Mekaru and M. Takahashi
AIST, Japan
R.H. Pedersen 1, K.H. Rasmussen 1, L.V. Lorenzen 1,
Tech. Univ. of Denmark, Denmark
C.J. Lüscher 1, O. Hansen 1,2 and A. Kristensen 1
K. Tada, Y. Kimoto, M. Yasuda, H. Kawata and Y. Hirai
Osaka Pref. Univ., Japan
J.S. Kim, S.K. Hong, J.D. Kim, J.J. Kang and C.J. Hwang Korea Inst. of Industr. Technol., Korea
K. Nagase and M. Nakagawa
Tokyo Inst. of Technol., Japan
Y.M. Hung and C.K. Sung
Natl. Tsing Hua Univ., Taiwan
C.-C. Hsu, L.-W. Cheng and F.-S. Huang
Natl. Tsing Hua Univ., Taiwan
N. Bogdanski, S. Möllenbeck and H.-C. Scheer
Univ. of Wuppertal, Germany
M. Matsue, K. Kubo, H. Kawata, M. Yasuda and Y. Hirai Osaka Pref. Univ., Japan
Y. Kimoto 1, M. Shibata 1, T. Mori 2, H. Kasa 3, J. Nishii 3 1 Osaka Pref. Univ., 2 Konica Minolta Opto and 3
and Y. Hirai 1
AIST, Japan
T. Tanabe 1, D. Jarzabek 2, M. Matsue 1, H. Kawata 1, Z. 1 Osaka Pref. Univ., Japan and 2 Warsaw Univ. of
Rymuza 2 and Y. Hirai 1
Technol., Poland
M. Shibata, T. Tanabe, H. Kawata and Y. Hirai
Osaka Pref. Univ., Japan

Room B-1: Thermal Imprint / Material
Imprint and Pattern Transfer of Silica Sol-Gel Resist: A Powerful

14B1-5-14 Nanofabrication Approach

Gas Phase Deposition of Anti-Sticking Layers for NIL

14B1-5-15
14B1-5-16 Rheological Characterisation And Tuning of Polymers for Nanoimprint
14B1-5-17 Low Temperature Imprinting of Polyimide and Carbon Nanotube
14B1-5-18 Photo-Induced Chemisorption of Poly(Styrene) Resist Suppressing

C. Peroz 1,2, A. Chang 2, B. Harteneck 2, S. Dhuey 2, D.
Olynick 2 and S. Cabrini 2
H.-C. Scheer, A. Fidler, W. Häfner, S. Möllenbeck and N.
Bogdanski
I.G. Romero, F. Reuther, M. Fink and G. Gruetzner
E. Itoh, S. Tamura, K. Ishiyama, Y. Sano and K. Miyairi
H. Oda 1, T. Ohtake 2, T. Takaoka 2 and M. Nakagawa 1

1 Abeam Technol. and 2 The Molecular Foundry,USA
Univ. of Wuppertal, Germany

A. Sekiguchi 1, Y. Kono 1 and Y. Hirai 2
H. Fujita 1,2, M. Nagae 1,2, T. Takahashi 2, H. Mogi 1,3,
H. Ushijima 4 and K. Yase 4

1 Litho Tech Japan Corp. and 2 Osaka Pref. Univ.,
1 Japan Chemical Innovation Inst., 2 Dai Nippon
Printing and 3 Shin-Etsu Chemical and 4 AIST,

Micro Resist Technol., Germany
Shinshu Univ., Japan
1 Tokyo Inst. of Technol. and 2 NOF, Japan

Room B-1: Tools

14B1-5-19 Examination of a Floor Cushion Process which Improves Residual Film
Development of a Microcontact Printer for A4-sized Sheets
14B1-5-20
Room B-1: Application Strage & Electronics

14B1-5-21 NIL Mold for Bit Patterned Media Fabricated by Block Copolymer
Template Replication using a Tone-Reversal Imprint Process for
14B1-5-22 Patterned Magnetic Recording Media
14B1-5-23 Control of Location, Diameter, Length, and Orientation of Si Nanowire
14B1-5-24 Resistance Random Access Memory Fabricated by Nanoimprint
14B1-5-25 Fabrication of a-Si Nano-Wires using UV Nano-Imprint Lithography and
One Step Printing of Multiple Biomolecules using a Nanostructured

14B1-5-26 Macrostamp

Nanoimprint Lithography: A General Tool for the Fabrication of

14B1-5-27 (Bio)Functional Assemblies: Study Case Light Harvesting Antenna
14B1-5-28

Complexes
Roll-to-Roll Processing of Fluidics Channels on Plastic Web

H. Hieda, N. Kihara and K. Naito
Toshiba, Japan
H. Wang, Z. Yu, M. Feldbaum, N. Kurataka, Y. Hsu, G.
Recording Media Operations, USA
Gauzner, D. Weller, D. Kuo and K. Lee
C. Wang, P. Murphy and S.Y. Chou
Princeton Univ., USA
H. Jung, H. Choi, J. Yoon, H. Hwang and G-Y. Jung
Gwangju Inst. of Sci. and Technol., Korea
G. Nakagawa and T. Asano
Kyushu Univ., Japan
Jean-Christophe Cau 1, Franck Carcenac 1, Nathalie
1 Toulouse Univ. and 2 Genopole Toulouse, France
Marsaud 2, Hélène Lalo 1, Véronique Leberre 2, JeanPierre Peyrade 1, Jean-Marie Francois 2 and Christophe
M. Escalante 1, Y. Zhao 1, M.J.W. Ludden 1, R. Vermeij 1, 1 Univ. of Twente, The Netherlands and 2 Univ. of
J.D. Olsen 1
2, E. Berenschot 1, C.N. Hunter 2, J. Huskens Sheffield, UK
1, V. Subramaniam 1 and C. Otto 1
T. Mäkelä 1,2, T. Haatainen 1, P. Majander 1 and J.
1 VTT Micro & Nanoelectron. and 2 Åbo Akademi
Ahopelto 1
Univ., Finland

Room B-1: Soft Lithography
PDMS Molding for High-Aspect-Ratio Subwavelength Microstructures

14B1-5-29
14B1-5-30 Local Work Function Control of Indium Tin Oxide by Micro Contact
14B1-5-31 Molecular Patterns Produced by Soft Lithography using PDMS Stamps
Fabrication of 3D Structures by Micro Contact Printing on Topography
14B1-5-32
14B1-5-33

Printing of Catalytic Nano-Particles for CNT-Growth

14B1-5-34 The Direct Nano-Patterning Method of ZnO using Nanoimprint
Replication of Dot-like Arrowhead Structures
14B1-5-35

Y.-Y. Su 1, S.-J. Lin 1, M.-K. Wei 1, W.-L. Lai 2, H.-Y. Lin2, J.-H. Tsai 2 and T.-C. Wu 2
T. Watanabe and M. Fujihira
H. Lalo 1,2 and C. Vieu 1
I. Bergmair 1,2, M. Mühlberger 1, W. Schwinger 1, K.
Hingerl 2, R. Schöftner 1
W. Schwinger 1, I. Bergmair 1, M. Mühlberger 1, M.
Bodnarchuk 2,3, M. Kovalenko 2,3, R. Haubner 4, E.
Lausecker 1,5, W. Heiss 3 and R. Schöftner 1
K.-Y. Yang, K.-M. Yoon and H. Lee
S. Möllenbeck 1, N. Bogdanski 1, H.-C. Scheer 1, J.
Zajadacz 2 and K. Zimmer 2

1 Natl. Dong Hwa Univ. and Industr. Technol. Res.
Inst., Taiwan
Tokyo Inst. of Technol., Japan
1Toulouse Univ. and 2 Parc d’acticité Activestre,
1 Profactor and 2 CD Lab. of Surface Optics, Austria
1 Profactor, Austria, 2 Univ. of Chicago, USA, 3
Johannes Kepler Univ., Austria, 4 Tech. Univ.
Vienna, Austria and 5 Princeton Univ., USA
Korea Univ., Korea
1 Univ. of Wuppertal and 2 Leibniz Inst. for Surface
Modification, Germany

Room B-1: Mold

14B1-5-36 Large Area Seamless Quarts Mold by Scanner Lithography

T. Isano, Y. Kaneda, K. Asano and T. Hoshi
Canon, Japan
Ni-Nanostructured Mold with Atmosphere Plasma Surface Treatment for F.-Y. Chang 1,2, T.-L. Chang 1, W.-L. Lai 1, Y.-J. Huang 1 Industr. Technol. Res. Inst. and 2 Natl. Taiwan
1, T.-H. Chou 1, H.-P. Yang 1, C.-W. Chen 1, C.-J. Wu 1, Univ. of Sci. & Technol., Taiwan
14B1-5-37 Roller Nanoimprint
H.-Y. Lin 1 and J.-H. Tsai 1
Imprint Mask Infrastructure for the 32nm Node and Beyond
K. Selinidis, E. Thompson, G. Schmid, J. Maltabes, I.
Molecular Imprints, USA
14B1-5-38
McMackin, N. Stacey, S.V. Sreenivasan and D.J. Resnick,H. Kawata, K. Kubo, M. Matsue, M. Yasuda and Y. Hirai Osaka Pref. Univ., Japan
14B1-5-39 Si Mold Fabrication with Extremely High Aspect Pattern by theLarge Area Mold Fabrication by Electron-Beam Stepper
M. Okada 1, T. Kishiro 2, K. Yanagihara 2, M. Ataka 2, N. 1 Univ. of Hyogo and 2 Holon, Japan
14B1-5-40
Anazawa 2 and S. Matsui 1
Antisticking Layer Formed by CHF3 Plasma Irradiation for Nanoimprint
M. Okada 1, K. Nakamatsu 1,2, Y. Kang 1, K. Kanda 1, Y. 1 Univ. of Hyogo and 2 JSPS, Japan
14B1-5-41 Molds
Haruyama 1 and S. Matsui 1
Room Temperature Nanoimprinting on a Release Agent Coated
M. Okada 1, M. Iwasa 2, K. Nakamatsu 1, 3, Y. Kang 1, K. 1 Univ. of Hyogo, 2 SII NanoTechnol. and 3 JSPS,
14B1-5-42 Hydrogen Silsesquioxane
Kanda 1, Y. Haruyama 1 and S. Matsui 1
Japan
Fabrication of Wavy Grating Microstructures
S.-J. Lin 1, Y.-Y. Su 1, M.-K. Wei 1, W.-L. Lai 2, H.-Y. Lin 1 Natl. Dong Hwa Univ. and 2 Industr. Technol. Res.
14B1-5-43
2, J.-H. Tsai 2 and T.-C. Wu 2
Inst., Taiwan
On the Degradation of Anti-Sticking Layers during Nanoimprint
R. Galand 1, D. Boutry 1, A. Beaurain 1, A. Francone 1, B. 1 LTM-CNRS and 2 LEMOH, France
Pelissier 1, M. Zelsmann 1, B. Pepin-Donat 2 and J.
14B1-5-44 Lithography
Boussey 1
K. Tsunozaki and Y. Kawaguchi
Asahi Glass, Japan
14B1-5-45 Preparation Methods and Characteristics of Fluorinated Polymers for
Stitching Free High Resolution Stamps for Molding Techniques with EUV M. Bednarzik 1, M. Saidani 1, B. Keusch 2, H. Solak 3, H. 1 Paul Scherrer Inst., 2 INKA Inst. of Polymer
14B1-5-46 Interference Lithography
Schift 1, C. Spreu 1 and J. Gobrecht 1
Nanotechnology and 3 EULITHA AG, Switzerland
Fabrication of Nanopatterned Conducting Polymer on Flexible Substrate J. Lee, D.-G. Choi, A. O. Altun, K.-D. Kim, J.-H. Choi, S.- Korea Inst. of Machinery & Materials, Korea
14B1-5-47 by Reversal NanoimprintW.

Room B-2: Nanoimprint General

14B2-5-48 Quantized-Patterning Using Nanoimprinted-Blanks (QUN)
The Analysis of Residual Layer Thickness in Roll Pressing Imprint
14B2-5-49 Lithography
14B2-5-50 Direct Nanoimprinting of Gold Film for Fabricating Metallic Gratings
14B2-5-51 Fabrication of High Aspect Si Structures by Deep Reactive Ion Etching
Fabrication of Silver Nanoparticle Arrays based on the Combination of
14B2-5-52 NIL and Electrochemical Deposition
Controlled Growth of Metal Oxide Nanowires via Nanoimprinting-based

14B2-5-53 Patterning of Nanoparticle Seeds

Nanofabrication of ITO Film by Room-Temperature Nanoimprint

14B2-5-54
14B2-5-55 Nanolithography Using Photocatalytic Decomposition of Organic Films

W.-D. Li, X. Liang and S.Y. Chou
Y.T. Cho, J.G. Kim, J.W. Cho, J.W. Seo, S. Kwon, Y.S.
Sim, S.W. Lee and H. Kim
J.‐N. AohK. Nakamatsu 1,2 and S. Matsui 1
B. Yang 1, N. Lu 1, D. Qi 1, H. Xu 1 and L. Chi 1,2

Princeton Univ., USA
Samsung Electro., Korea
Natl. Chung Cheng Univ., Taiwan
1 Univ. of Hyogo and 2 JSPS, Japan
1 Jilin Univ., China, and 2 Westfälische WilhelmsUniv. Münster, Germany
UCLA, Berkeley, USA

I. Park, S.H. Ko, S. Choi. Costas, P. Grigoropoulos and
A.P. Pisano
Y. Kang 1, M. Okada 1, K. Nakamatsu 1,2, K. Kanda 1, Y. 1 Univ. of Hyogo and 2 JSPS, Japan
Haruyama 1 and S. Matsui 1
K. Kobayashi, Y. Tomita, Y. Maeda and Y. Khono
Shizuoka Univ., Japan

Room B-2: UV Imprint / Process
Theoretical and Experimental Evaluation of Flowing Behaviour of Spin

A. Francone 1, C. Iojoiu 2, P. Voisin 1, C. Gourgon 1, D.

1 MINATEC and 2 Physicochimie des Matériaux etdes Interfaces, France
Kornic Systems, Korea
1 EVGroup and 2 EVGroup Inc., USA

Realization of Nanoholes by Soft UV Nanoimprint Lithography for the

F. Hamouda, E. Laille, G. Barbillon, G. Agnus, P. Gogol,
D. Bouville, T. Maroutian, and B. Bartenlian

Univ. Paris-Sud, France

UV Step and Stamp Imprint Lithography using Transparent Polymer

T. Haatainen 1, P. Majander 2, T. Mäkelä 3, J. Ahopelto 1, 1 VTT Micro & Nanoelectron., Finland, 2 Asahi Glass,
Y. Kawaguchi 2 and G. Lecarpentier 3
Japan and 3 Smart Equipment Technol. SAS, France
H. Shinohara, Jun M. and S. Shoji
Waseda Univ., Japan

14B2-5-56 Coated UV–NIL Materials
Boutry 1, M. Zelsmann 1 and J. Boussey 1
14B2-5-57 Multi-Layer Alignment by UV-Imprint Process using Water Soluble Resist D.-I. Lee, S.-U. Jung and S.-U. Kwak
Soft UV-NIL Enables Industrial Applications
T. Glinsner 1, G. Kreindl 1, A. Malzer 1, R. Födisch 1, P.
14B2-5-58
Lindner 1, M. Wimplinger 1 and R. Miller 2
14B2-5-59 Study of Membrane Proteins
14B2-5-60 Stamp

High-Thorghput Nano-Metal Patterning Process using UV Nanoimprint

14B2-5-61 Lithography and Electrodeposition

A 3D Micropatterning for Cylindrical Microcirruits based on UV Imprinting D.K. Lee, S.W. Youn, I. Terada, T. Itoh, M. Takahashi and AIST, Japan
R. Maeda

14B2-5-62 Combined with PDMS Molding Process
Room B-2: UV Imprint / Material

14B2-5-63 Photocurable Silsesquioxane Resists for Nanoimprint Lithography
14B2-5-64
14B2-5-65

UV-NIL using Working Stamps made from Ormostamp
Plasma Etching Behaviour of Photocured Nanoimprint Resists
Functionality and Etch Selectivity of Direct UV Imprinted Patterns onto

14B2-5-66 Nanosilver Colloid-Dispersed Resists

C. Pinaa 1, L. J. Guo 1 and P.-F. Fu 2
1 Univ. of Michigan and 2 Dow Corning, USA
M. Mühlberger 1, I. Bergmair 1, A. Klukowska 2, A.
1 Profactor, Austria, 2 Micro Resist Technol. and 3
Kolander 2, H. Leichtfried 1, E. Platzgummer 3, H.
IMS Nanofabrication, Germany
Loeschner 3, Ch. Ebm 3, G. Grützner 2 and R. Schöftner
D. Boutry, J. De Girolamo, X. Mellhaoui, M. Zelsmann and LTM-CNRS, France
J. Boussey
J.-H. Choi, S.-W. Lee, J.-H. Jeong, D.-G. Choi, K.-D. Kim Korea Inst. of Machinery & Materials, Korea
and E.-S. Lee

Room B-2: Application / Optics
N. Chaix 1, C. Gourgon 1, C. Perret 1, S. Landis 2, V.
1 LTM-CNRS, 2 Minatec, France and 3 FIAT, Italy
Lambertini 3, N.L. Pira 3
Optical Nanoimprint using Plastic Template and Visible Light-Curable
N. Fujii 1, S. Moriyama 2, H. Kawata 1, M. Komai 2 and Y. 1 Osaka Pref. Univ. and 2 Kyowa Hakko Chemical,
14B2-5-68 Photopolymer
Hirai 1Japan
FabricationofArtificial
Butterfly
Wings
Nanostructures:
Iridescence
andT.S. Kustandi, H.Y. Low, J.H. Teng, I. Rodriguez and R.
A*STAR, Singapore
14B2-5-69
Resolution of Subwavelength Diffraction for Critical Dimension Metrology T. Kehoe 1,2, V. Reboud 1, B. McCarthy 2 and C.M.
1 Campus Univ. Autonoma de Barcelona, Spain, 2
14B2-5-70
Sotomayor Torres 1,3
Univ. College Cork, Ireland and ICREA, Spain
T.N. Oo 1, M. Yoneya 2, Y. Mitsuhashi 1 and H.
1 Japan Sci. & Technol. Agency and 2 AIST, Japan
14B2-5-71 Alignment of Liquid Crystals at Functional Patterns Prepared by
Effect of Dual Side Patterning and Imprint Materials in the Fabrication of D.-G. Choi, K.-J. Lee, K.-D. Kim, J. Lee, J.-H. Choi, E.-S. Korea Inst. of Machinery & Materials, Korea
14B2-5-72 Antireflective Structure using Nanoimprint
Lee and J.-H. Jeong
Y.-W. Lim, W. Lee and S.-D. Lee
Seoul Natl. Univ., Korea
14B2-5-73 Imprinted Optical Elements with High Efficiency for Liquid Crystal
Analysis
Simulation
for
Black
MatrixCorrectionofDeformities
Process
J.-S. An , S.-U. Jung and S.-U. Kwak
Kornic Systems, Korea
14B2-5-74
Fabrication of Anti-Reflection Film by Imprinting Processes with AAO
H.M. Chen 1, M.H. Hon 1, and I.C. Leu 2
1 Natl. Cheng-Kung Univ. and 2 Natl. United Univ.,
14B2-5-75 Template
TaiwanAntireflection Structures by Nanoimprinting using Anodic Porous Alumina T. Yanagishita 1,2, T. Endo 1, K. Nishio 1,2 and H.
1 Tokyo Metropol. Univ. and 2 Kanagawa Academy
14B2-5-76 Molds
Masuda 1,2of Sci. & Technol., Japan
Fabrication and Characterization of Metallic Nanocavities by Nanoimprint J. Shi 1, J. Chen 1, D. Decanini 1, Y. Chen 2 and A.-M.
1 Lab. de Photonique et de Nanostructures and 2
14B2-5-77 Lithography
Haghiri-Gosnet 1
Ecole Normale Supérieure de Paris, France
14B2-5-78 Fabrication of Artificial Compound Eyes with Combined Microscale and J.-H. Chang, C.-S. Jao, Y.-P. Chen, S.-J. Chiu and L.A. Natl. Taiwan Univ., Taiwan
Materials and Patterns Shape Selection Processes by NIL on

14B2-5-67 Transparent Substrates for Optical Application

Banquet (Sakura, 1F)
Banquet (18:00-20:00)

2

October 15, 2008
Chairpersons: M. Komuro (NEDO), B.-K. Lee (Samsung Advanced Inst. of Technol.)
15A-6: Application II

15A-6-1
15A-6-2
15A-6-3

9:00
9:30
10:00

9:30 Nanoimprint Applications on CMOS Devices (Plenary) T. Nakasugi

Toshiba, Japan

Large Area UV Nanoimprint Lithography for TFT-LCD
10:00 Devices (Plenary)
A Nanogap Detector Inside Nanofluidic Channel for
10:20 Fast Real-Time Label-Free DNA Analysis Using
Multiple Nanoimprint Lithography (Invited)

J. Bae, B. Kim, J. Chang and S. Lim

Samsung Electronics, Korea

X. Liang and S.Y. Chou

Princeton Univ., USA

Chairpersons: A. Yokoo (NTT), L.A. Wang (National Taiwan Univ.)
15A-7: Application III

15A-7-1

10:20 10:40 Self-Aligned Multilevel Molds for Top-Gate Fet

15A-7-2

10:40

15A-7-3
15A-7-4

11:00
11:20
11:40

15A-7-5
15A-7-6

12:00

E. Lausecker 1,2, Y. Huang 1, S. Wagner 1 and J. C.
1 Princeton Univ., USA and 2 Univ. of Linz, Austria
Fabrication using Imprint Lithography
Sturm 1
1 Natl. Tsing Hua Univ. and 2 Natl. Chi Nan Univ.,
11:00 GHz Band Surface Acoustic Wave Filter Fabrication by N.-H. Chen 1, C.-L. Liao 1, H.J.H. Chen 2 and F.-S.
UV-Nanoimprint
Huang 1
TaiwanD.J. Resnick 1, M. Miller 1, G. Schmid 1, C. Brooks 1, N. 1 Molecular Imprints and 2 Seagate Technol., USA
11:20 Patterned Media using Step and Flash Imprint
Lithography
Khusnatdinov 1, D. LaBrake 1, S.V. Sreenivasan 1, G.
Gauzner 2, K. Lee 2, D. Kuo 2 and D. Weller 2
K.-J. Byeon 1, E.-J. Hong 1, S.-H. Hong 1, S.-Y. Hwang 1, 1 Korea Univ. and 2 Chonbuk Natl. Univ., Korea
11:40 Imprinting Process for a Large Area Pattern
C.-H. Hong 2 and H. Lee 1
Transferring on Light-Emitting Diodes Structure to
Improve Light Extraction
V. Reboud 1,6, N. Kehagias 1,6, M. Striccoli 3, T. Placido 1 Catalan Inst. of Nanotechnol., Spain, 2 LTM-CNRS,
12:00 Metallic Nanoparticules Enhanced the SpontaneousFrance, 3 Sezione Bari, Italy, 5 Nanogune-Consolider
Emission of Semiconductor Nanocrystals Embedded in 3, A. Panniello 4, M.L. Curri 3, M. Zelsmann 2, J.A.
Nanoimprinted Photonic Crystals
Alducin 5, D. Mecerreyes 5, S. Newcomb 7, H. Doyle 6, G. & CIDETEC-Centre for Electrochemical Technol.,
Spain, 6 Univ. College Cork, Ireland, 7 Newport,
Redmond 6 and C.M. Sotomayor Torres 1,7
Ireland and 8 ICREA, Spain
A.V. Larsen 1, T. Mäkelä 2, P. Majander 2, J. Ahopelto 2 1 Tech. Univ. of Denmark, Denmark and 2 VTT Micro
12:20 Roll-to-Roll Thermal Nanoimprinted Microfluidic
Sdparation Devices
and A. Kristensen 1& Nanoelectron., Finland

Lunch (12:20-13:20)
Chairpersons: M. Houga (DNP), D.J. Resnick (Molecular Imprints)
15A-8: Mold Technology

15A-8-1

13:20 13:40 Capacity-Equalized Mold for Nanoimprint Lithography H. Hiroshima

AIST, Japan

15A-8-2

13:40 14:00 Si-Mold Fabrication Process by using High-Resolution M. Ishikawa, T. Chiba, M. Fukuda, M. Kurihara, H. Sano

Dai Nippon Printing, Japan

15A-8-3

14:00

IBM, USA

15A-8-4

14:20

15A-8-5
15A-8-6

14:40
15:00

Chemically Amplified Resist
14:20 Characterization of UV-Cured Nanoimprint Resist –Metallic Release Layer Systems
14:40 Nanoimprint-Soft Lithography combined Mold with
Ultra-Thin Rigid Patterning Layer on Elastic Support
15:00 Nanoscale Releas Effect Measurement of Antisticking
Layer for Nanoimprint Resin by Scanning Probe
Microscope
15:20 Template Release in Step and Flash Imprint

and M. Hoga
F.A. Houle, D.L. Casher, D.C. Miller, S. Raoux and E.
Simonyia
Z. Li 1, H. Ge 1, W. Wu 2, Q. Xia 2, C. Yuan 1 and Y.
Chen 1M. Okada 1, M. Iwasa 2, K. Nakamatsu 1,3, Y. Kang 1, K.
Kanda 1, Y. Haruyama 1 and S. Matsui 1

1 Nanjing Univ., China and 2 Hewlett-Packard Lab.,USA
1 Univ. of Hyogo, 2 SII Nanotechnol. and 3 JSPS,Japan

C.G. Willson

Univ. of Texas, USA

Coffee Break (15:20-15:40)
Chairpersons: S. Matsui (Univ. of Hyogo), J. Ahopelto(VTT Micro & Nanoelectron)
15A-9: Process & Tools

15A-9-1

Imprinting Fine Structures on Non-planar Surfaces and

15A-9-2

15:40 16:00 their Applications (Invited)
Applications of Non-Conventional Nanoimprint
16:00 16:20 Lithography (Invited)

15A-9-3

16:20 16:40

1 Profactor and 2 CD Lab. of Surface Optics, Austria

15A-9-4

16:40

Molecular Imprints, USA

15A-9-5

17:00

L.A. Wang

National Taiwan Univ., Taiwan

K-Y Yang, S-H Hong, K-J Byeon, K-S Han and H. Lee

Korea Univ., Korea

Reversal μCp using Hard Stamps for the Fabrication of I. Bergmair 1,2, M. Mühlberger 1, W. Schwinger 1, K.
Negative Index Materials
Hingerl 2, R. Schöftner 1
Can Sub-5nm Full-Field Overlay be Achieved using
P.D. Schumaker, A. Cherala, B. Mokaberi-Nezhad, M.
17:00
Imprint Lithography?
Meissl, B.J. Choi and S.V. Sreenivasan
Large-Area Continuous Roll-to-Roll and Roll-to-Plate
S.H. Ahn and L.J. Guo
17:20
Nanoimprinting on Flexible and Rigid Substrates

Univ. of Michigan, USA

Closing
17:20 17:25 Closing

S. Matsui

NNT'08 Co-Chair, Univ. of Hyogo, Japan

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