Single-phase
Immersion Cooling
One Stop Solution
Data centers must be reimagined if they are to sustain thecompute performance required to continue quantum
leaps in discoveries and provide timely insights. To keeppace, GIGABYTE has researched and developed a newapproach that goes beyond air cooled infrastructure, andinto a method that dissipates heat better, Single-phase
Immersion Cooling. This has proven to be more energy
eﬃcient and scalable for deployments across the globe,
while being environmentally friendly and safe. For thisnew approach, GIGABYTE has created a one stop solution.GIGABYTE Single-phase Immersion Cooling Solution
Dandy Yeh, Founder and Chairperson of GIGABYTE, stated, “GIGABYTE has always been focused on improving server performance. Today, in the face of cooling issues for CPUs and GPUs with higher and higher computing performance, we are not
only working with industry-leading partners to help companies care for their operations and sustainable development, wehave also developed single-phase immersion cooling products, allowing users to deploy green computing quickly.”
The eﬀects of the pandemic have brought many changes to traditional business models. Large-scale remote work and a shift toonline activities is widespread. Coupled with mainstream e-commerce and ﬁnancial technologies, the need for big data andcloud computing has greatly increased, leading to “resilience challenges” for data centers of large companies. At the same time,
Taiwan aims to realize the goal of net-zero emissions by 2050. Therefore, while attempting to reduce the power consumption ofdata centers, improving energy eﬃciency has become an urgent matter for all IT infrastructures. To remedy this, GIGABYTE has
launched a one-stop solution for single-phase immersion cooling by leveraging expertise in high-performance computing andcooling designs.
“Net-zero emissions cannot be delayed. Our single-phase immersion cooling products are not only compact in size and comprehensive, allowing for fast deployment, but also able to reduce the total cost of ownership (TCO) for our customers. We
are able to overcome the traditional high costs associated with new data centers and become an accelerator for corporate
net-zero emissions,” said Dandy Yeh.
In 2022, GIGABYTE dipped its toes into immersion cooling, and has since gone all in. For its eﬀorts, GIGABYTE has received therecognition of academia, scientiﬁc research institutes, government agencies, and corporate customers, including the adoption of
GIGABYTE's immersion computing products by internationally renowned foundries and telecommunication giants.
GIGABYTE possesses a complete server product line and a wealth of manufacturing experience, and it has directly translated
into the success of new immersion cooling solutions as customers’ demand for green computing continues to grow.

2A1P0-EB0 Tank

A1O3-CC0 TankOverhead view of A1P0-EB0 Tank

4U POC Tank & IT Lift

Charting a New Path with Advanced Cooling
Reliability, availability, and serviceability are all traits found in the best data centers of today and tomorrow. As IT hardware andtechnology continue to improve, they are also making it tough for current data centers to be sustainable with the traditionalfans, HVAC, and hot/cold aisles.
Why? A major reason - increase in rack power density. For each new generation of chips, the die size is shrunk while the numberof transistors has increased, and this translates to higher performance, but also more heat. For instance, a GPU dense server
can support CPUs and GPUS up to 300W TDP each component, but new generations of hardware are increasing the TDP by 25%
or more, which is unsustainable in the same footprint. Consequently, servers are reaching thermal limitations. To maintain thesame hardware density, a more eﬃcient cooling approach is needed.
Data center architects realize this and quantify this eﬃciency using power usage eﬀectiveness (PUE). PUE is a ratio that compares
how much power enters the data center to the power delivered to IT equipment. Ideally, the PUE value would be 1.0; however,traditional air-cooled data centers achieve a PUE of ~1.65, which isn’ t horrible, but it shows room for improvement. Single-phase
immersion cooling can achieve a PUE in the ballpark of 1.02-1.03.

How it Works
Single-phase immersion cooling redeﬁnes the data center from how IT equipment is cooled to the reduction in the amount andcomplexity of the data center infrastructure. By submerging IT equipment into a dielectric liquid bath, heat is removed fasterthan air while no damage or degrading occurs to all components. The liquid coolant with a higher speciﬁc heat capacity than air
can quickly remove the heat. The heat given oﬀ by CPUs, GPUs, and other components is transferred directly to the liquid or via
a heatsink. The warm liquid is then pumped out by a coolant distribution unit (CDU) or dry cooler. In the CDU cases, a second
transfer occurs as the heat is then transferred to facility water. The resulting cooled coolant is pumped back into the immersion
tank while the warmed water continues on to a heat exchanger to be expelled. And the cycle continues. Also, as the nameimplies, the ﬂuid in the immersion tank does not change state, so there is no evaporation or condensation occurring, which
ensures operator safety and allows for easy servicing of the tank and IT equipment.
Server Racks in Single-phase Coolant BathCoolant Distribution Unit

Final Heat Rejection Options

Coolant-to-water
heat exchange

Evaporative
Cooling Tower
Dry Cooler

Coolant Pump

Existing Chilled
Water Loop

Heated coolant exits top of rack. Coolant returns to rack cooled at user-speciﬁed temperature.

The GIGABYTE One Stop Immersion Solution
Immersion Tank + Immersion Ready Server + Coolant + Service
GIGABYTE aims to give customers a hub to design and acquire all the necessary technology to deploy a single-phase immersion
cooling data center. As a leader in enterprise technology, GIGABYTE has the ability to leverage current server designs to accommodate
new specialized servers for immersion cooling deployments in tanks provided by GIGABYTE or its other global immersion
partners. The ﬁrst wave of immersion ready servers came as a result of customers’ requests so it’s best to contact a GIGABYTE
sales representative to start the path to joining the immersion era.

Compatibility

Scalability

High Performance

Power Eﬃciency

Lower TCOHigh Availability
3Immersion Cooling Server
G293-Z42-IAP1

Workloads

HPC, AI, ML, Data analytics

HPC, AI, ML, Data analytics

HPC, AI, ML, Data analytics

Form Factor

2U2U

2U

Processor

Dual AMD EPYC 9004 Series

Dual 5th/4th Gen Intel® Xeon® Scalable
Dual Intel® Xeon® CPU Max Series

Dual 3rd Gen Intel® Xeon® Scalable

Memory24 x DDR5 RDIMM slots

16 x DDR5 RDIMM slots

24 x DDR4 RDIMM/LRDIMM

Networking

2 x 10GbE LAN, 1 x MLAN

2 x 10GbE LAN, 1 x MLAN

2 x 10GbE LAN, 1 x MLAN

4 x 2.5" Gen5 NVMe/SATA/SAS
4 x 2.5" SATA/SAS

8 x 2.5" SATA/SAS*NVMe support requires additional NVMe cables

4 x 2.5" Gen4 NVMe/SATA/SAS
4 x 2.5" SATA/SAS

8 x Dual slot Gen5 GPUs
2 x LP PCIe Gen5 x16 slots

8 x Dual slot Gen5 GPUs
2 x LP PCIe Gen5 x16 slots

8 x Dual slot Gen4 GPUs
2 x LP PCIe Gen4 x16 slots

Dual 3000W Titanium

Dual 3000W Titanium[IAY1] Dual 3200W Platinum[IAP1] Dual 3000W Titanium

StorageExpansion Slots

Power Supply

G292-Z45-ICU1/ICM1

G152-Z12-200/400

G292-Z43-ICU1/ICM1Workloads

HPC, AI, ML, Data analytics

HPC, AI, ML, Data analytics

HPC, AI, ML, Data analytics

Form Factor

2U2U

1UProcessor

Dual AMD EPYC™ 7003/7002 Series

Dual AMD EPYC™ 7003/7002 Series

Single AMD EPYC™ 7003/7002 Series

Memory16 x DDR4 RDIMM/LRDIMM

16 x DDR4 RDIMM/LRDIMM

8 x DDR4 RDIMM/LRDIMM

2 x 1GbE LAN, 1 x MLAN

2 x 10GbE LAN, 1 x MLAN

2 x 10GbE LAN, 1 x MLAN

8 x 2.5" SATA/SAS

4 x 2.5" Gen4 NVMe/SATA/SAS
4 x 2.5" SATA/SAS

4 x 2.5" Gen4 NVMe (internal)

8 x Dual slot Gen4 GPUs
2 x LP PCIe Gen4 x16 slots

16 x Single slot Gen4 GPUs
2 x LP PCIe Gen4 x16 slots[200] 2 x Dual slot Gen4 GPUs

[ICU1] Dual 2200W Platinum[ICM1] Dual 2200W Titanium[ICU1] Dual 2200W Platinum[ICM1] Dual 2200W Titanium

Networking
StorageExpansion Slots

Power Supply

4G292-280-IAY1/IAP1

G293-S45-IAP1[400] 4 x Single slot Gen4 GPUs
2 x LP PCIe Gen4 x16 slots
Dual 2000W Platinum

Immersion Cooling Server
H263-S64-IAW1

H262-Z6B-ICU1/ICP1

H273-Z82-IAW1

Workloads

HPC, HCI, Hybrid/private cloud

HPC, HCI, Hybrid/private cloud

HPC, HCI, Hybrid/private cloud

Form Factor

2U 4-Node2U 4-Node2U 4-Node

Processor

Dual 5th/4th Gen Intel® Xeon®
Scalable per node

Dual AMD EPYC™ 9004 Series
per node

Dual AMD EPYC™ 7003 Series
per node

Memory64 x DDR5 RDIMM

96 x DDR5 RDIMM

64 x DDR4 RDIMM/LRDIMM

Networking

4 x MLAN, 1 x CMC

8 x 1GbE LAN, 4 x MLAN

8 x 1GbE, 4 x MLAN, 1 x CMC

8 x 2.5" Gen4 NVMe/SATA/SAS
Optional 4 x M.2 slots (PCIe Gen4 x4)

8 x 2.5" Gen4 NVMe/SATA/SAS
Optional 4 x M.2 slots (PCIe Gen4 x4)

8 x 2.5" Gen4 NVMe/SATA/SAS
4 x M.2 slots (PCIe Gen4 x4)Expansion Slots

4 x LP PCIe Gen5 x16 slots
4 x OCP 3.0 Gen5 x16 slots

4 x LP PCIe Gen5 x16 slots
4 x OCP 3.0 Gen5 x16 slots

8 x LP PCIe Gen4 x16 slots
4 x OCP 3.0 Gen4 x16 slots

Power Supply

Dual 3000W Titanium
Optional 2+1 redundant PSU

Dual 3000W Titanium[ICU1] Dual 2200W Platinum[ICP1] Dual 3000W Titanium

Storage

S251-3O0-IBC1/IBH1

R283-SF0-IAL1

R283-ZF0-IAL1Workloads

Storage

HPC, AI, ML, Data analytics

HPC, AI, ML, Data analytics

Form Factor

2U2U

2U

Single 2nd Gen Intel® Xeon® Scalable
Single Intel® Xeon® W-3200

Dual 5th/4th Gen Intel® Xeon® Scalable
Dual Intel® Xeon® CPU Max Series

Dual AMD EPYC™ 9004 Series

8 x DDR4 RDIMM/LRDIMM

32 x DDR5 RDIMM

24 x DDR5 RDIMM

2 x 1GbE LAN, 1 x MLAN

1 x MLAN

1 x MLAN

24 x 3.5" SATA/SAS + 2 x 2.5" SATA
1 x M.2 slot (PCIe Gen3 x4)

12 x 3.5"/2.5" Gen5 NVMe/SATA/SAS4

8 x 3.5"/2.5" Gen5 NVMe/SATA/SAS4
4 x 3.5"/2.5" SATA/SAS4Expansion Slots

3 x LP PCIe Gen3 x16 slots
3 x LP PCIe Gen3 x8 slots
1 x LP PCIe Gen3 x4 slots

4 x Dual slot Gen5 GPUs
1 x FHHL PCIe Gen5 x16 slot
1 x OCP 3.0 Gen5 x16 slot

4 x Dual slot Gen5 GPUs
1 x FHHL PCIe Gen5 x16 slot
1 x OCP 3.0 Gen5 x16 slot

Power Supply[IBC1] Dual 1300W Platinum[IBH1] Dual 1300W Titanium

Dual 2700W Titanium

Dual 2700W Titanium

Processor

MemoryNetworkingStorage(with AMD 3D V-Cache™ Technology)

5Immersion Cooling Server
R183-ZF2-IAL1

R183-SF2-IAL1

Workloads

HPC, AI, ML, Networking

HPC, AI, ML, Networking

HPC, AI, ML, data analytics

Form Factor

1U

1U

1OU

Dual 5th/4th Gen Intel® Xeon® Scalable
Dual Intel® Xeon® CPU Max Series

Dual AMD EPYC™ 9004 Series

Single AMD EPYC™ 9004 Series(with AMD 3D V-Cache™ Technology)(with AMD 3D V-Cache™ Technology)32 x DDR5 RDIMM

24 x DDR5 RDIMM

12 x DDR5 RDIMM

1 x MLAN

1 x MLAN2 x 10GbE LAN, 1 x MLAN

Storage2 x 2.5" Gen5 NVMe/SATA/SAS-4

2 x 2.5" Gen5 NVMe/SATA/SAS4
2 x M.2 slots (PCIe Gen3 x4)

4 x 15mm E1.S NVMe
2 x M.2 slots (PCIe Gen5 x4)
Optional 2 x M.2 slots (SATA)

Expansion Slots

4 x Dual slot Gen5 GPUs
1 x FHFL PCIe Gen5 x16 slot
1 x FHHL PCIe Gen5 x16 slot
1 x Internal LP PCIe Gen4 x8 slot
1 x OCP 3.0 Gen5 x16 slot

4 x Dual slot Gen5 GPUs
1 x FHHL PCIe Gen5 x16 slot
1 x Internal LP PCIe Gen5 x16 slot
1 x OCP 3.0 Gen5 x16 slot

4 x Dual slot Gen5 GPUs
2 x LP PCIe Gen5 x16 slots

Dual 2700W Titanium

Dual 2700W Titanium

From 48V DC single busbar

Processor

MemoryNetworking

Power Supply

TO15-S40-IA01

TO15-S41-IA01

TO15-Z40-IA01

Workloads

HPC, AI, ML, data analytics

HPC, AI, ML, data analytics

HPC, AI, ML, data analytics

Form Factor

1OU

1OU

1OU

Dual 5th/4th Gen Intel® Xeon® Scalable
Dual Intel® Xeon® CPU Max Series

Dual 5th/4th Gen Intel® Xeon® Scalable
Dual Intel® Xeon® CPU Max Series

Single AMD EPYC™ 9004 Series

24 x DDR5 RDIMM

16 x DDR5 RDIMM

24 x DDR5 RDIMM

2 x 10GbE LAN, 1 x MLAN

2 x 10GbE LAN, 1 x MLAN

2 x 10GbE LAN, 1 x MLAN

4 x 15mm E1.S NVMe
Optional 2 x M.2 slots (SATA)

4 x 15mm E1.S NVMe
Optional 2 x M.2 slots (SATA)

4 x 15mm E1.S NVMe
Optional 2 x M.2 slots (SATA)

Expansion Slots

4 x Dual slot Gen5 GPUs
2 x LP PCIe Gen5 x16 slots

8 x Single slot Gen5 GPUs
2 x LP PCIe Gen5 x16 slots

4 x Dual slot Gen5 GPUs
2 x LP PCIe Gen5 x16 slots

Power Supply

From 48V DC single busbar

From 48V DC single busbar

From 48V DC single busbar

Processor

MemoryNetworkingStorage

6TO15-Z20-IA01(with AMD 3D V-Cache™ Technology)

Immersion Cooling Tank
A1P0-EB0

A1O3-CC0

A1P0-EA0

2OU (power shelf)

18OU

21U
2U

Hardware Capacity

1U

18OU + 2OU (power shelf)

21U + 2U x 2 (EIA)
80 KW

40 KW

Tank: W1.16 x D0.91 x H1.49 m
CDU: W0.48 x D0.86 x H1.62 m

W0.87 x D1.2 x H1.56 m

Tank: 450 kg (w/o coolant), CDU: 325 kg

300 kg (w/o coolant)

750 Liter (615 kg)

400 Liter (320 kg)

Unit Size

Coolant VolumePower Plug

PDU: IEC 60309 63A – 3P+N+E, 6H,
plug x2
CDU: IEC 60320 C19

Input Power Spec

12U (EIA)+ 1U x 2 (EIA)

Cooling Power

Unit Weight

12U

3P+N+E 63A, 380-415VAC, 50/60Hz x2
1P+N+E 15A, 220-240VAC, 50/60Hz x1

PDU: IEC 60309 32A – 3P+N+E, 6H
Power shelf: : IEC 60309 63A – 3P+N+E, 6HCDU: IEC 60320 C19

PDU: IEC 60309 32A –3P+N+E, 6H, plug x2

3P+N+E 32A, 380-415VAC, 50/60Hz x1
3P+N+E 63A, 380-415VAC, 50/60Hz x1
1P+N+E 15A, 220-240VAC, 50/60Hz x1

3P+N+E 32A,380-415VAC, 50/60Hz x2

Depth Supported

900 mm

900 mmCooling Pipe Size

2" clamp ﬁtting(Tube OD 50.8 mm / Flange OD 63.9 mm)

PT 1-1/4" Male Adaptor(Pipe OD 42.7 mm)

Cooling Water Inlet

20-35°C

20-35°C

Cooling Water Flow

240 LPM

100 LPM

A1P0-EB0 / A1O3-CC0 Tank

A1P0-EA0 Tank

7Immersion Cooling POC Tank
4U POC Tank
Hardware Capacity

4UCooling Power

7 KW

Unit Size

W1.0 x D1.2 x H1.35 m

Unit Weight

400 kg (w/o coolant)

Coolant Tank Volume185 Liter (151 kg)

Power PlugIEC 60309 32A – 3P+N+E, 6H, plug x1

Input Power Spec

3P+N+E 32A; 380-415VAC; 50/60Hz

Depth Supported

950 mmCooling Typedry cooler

Accessories and Coolants

www.gigacomputing.com

IT Lift

IT Dry Rack

Dimension: W1.15 x D0.85 x H1.53 m

Dimension: W 1.23 x D 0.63 x H 1.25 mUnit weight: 200 kg

Unit weight: 75 kg

Lifting load: 70 kg

Server depth supported: 900 mm

Input AC: 100-240V~/ 3.5A, 50/60Hz

Support space: 20 U or 20 OU

Power Plug: US ,10A, 125V

Load capacity: 800 kg

Coolants
Shell: Immersion Cooling Fluid S3 X,Immersion Cooling Fluid S5 X
Exxon Mobil: SpectraSyn™ 6
Chevron: SynFluid® PAO 4 cST

Learn more at https://www.GIGABYTE.com/enterprise

Designed by* All speciﬁcations are subject to change without notice. Please visit our website for the latest information.
* The entire materials provided herein are for reference only. Giga Computing reserves the right to modify
or revise the content at anytime without prior notice.
* All other brands, logos and names are property of their respective owners.

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2024/08 V5.2