October 22, 2014
Room B (2F)
17:00-19:00

Welcome Party

October 23, 2014
Room A (2F)
23A-1: Plenary Session (9:00-10:30)
Chairs:S. Matsui (Univ. of Hyogo, Japan)
Y. Hirai (Osaka Pref. Univ., Japan)
9:00

Opening
Conference Chair : S. Matsui (Univ. of Hyogo, Japan) and Program Chair : Y. Hirai (Osaka Pref. Univ., Japan)
F.R. Pease (Univ. of Stanford, USA)

23A-1-1
9:20

Japan's Manufacturing Industry (Plenary)
K. Sawaki, METI, Japan

23A-1-2
9:50

Status and Future of Nanoimprint (Plenary)
S.Y. Chou, Princeton Univ., USA

10:30-10:40

Coffee BreakRoom P (2F)
Room A (2F)
23A-2: Application I (10:40-12:30)
E.-S. Lee (KIMM, Korea)
Chairs:R. Maeda (AIST, Japan)
23A-2-1
10:40

Jet and Flash Imprint Lithography for the High Volume Manufacturing of Semiconductor Devices(Invited)
D. Resnick, Canon Nanotechnologies, USA

23A-2-2
11:05

A Direct Imprinting for Fine Metal Oxide Patterns and Devices (Invited)
T. Shimoda 1,2, T. Kaneda 1, D. Hirose 2, T. Miyasako 1, P.T. Tue 1,2, Y. Murakami 2, S. Kohara 3, J. Li 1,2, T.
Mitani 1,2, E. Tokumitsu 1,2 and S. Nobukawa 2, 1 JST-ERATO, 2 JAIST and 3 JASRI, Japan

23A-2-3
11:30

Parallel Fabrication of Graphene-Based Devices by UV-NIL
L. Häusler 1, B. Einwögerer 1, W. Hackl 1, T. Fromherz 2, M. Losurdo 3, G. Bruno 3, N. Rupesinghe 4, S. Schuler5, M. Furchi 5, T. Müller 5, B. Kley 6, W. Rockstroh 6, M. Mühlberger 1 and I. Bergmair 1
1 Profactor, 2 Univ. of Linz, Austria, 3 Inst. of Inorganic Methodologies and of Plasmas-CNR, Italy, 4 Aixtron, UK,
5 TU Vienna Univ. of Technol., Austria and 6 Friedrich-Schiller-Univ., Germany

23A-2-4
11:50

Highly Transparent and Embedded Ag Electrodes Structures for OPV Applications Fabricated by Reverse
UV Light Assisted Imprint Transfer Lithography
N. Kehagias1, I. Burgués-Ceballos 2,3, M. Campoy-Quiles 3, P.D. Lacharmoise 2 and C.S.M. Torres 4, 1 CatalanInst. of Nanoscience and Nanotechnology, 2 Cetemmsa Technological Ctr., 3 ICMAB-CSIC and 4 ICREA, Spain

23A-2-5
12:10

Large Area Fabrication of Plasmonic Color Filters Using UV-SCIL
M. Rumler 1,3, R. Fader 1,3, A. Haas 1, M. Rommel 1, A.J. Bauer 1,3 and L. Frey 1,2,3, 1 IISB, 2 Univ. ErlangenNuremberg and 3 SAOT, Germany

12:30-13:40

LUNCH

23A-3: Roll to Roll (13:40-15:50)
Chairs:A. Miyauchi (Hitachi, Japan)
F.-Y. Chang (Natl. Taiwan Univ. of Sci. and Technol., Taiwan)
23A-3-1
13:40

Soft Photo-Mask Lithography and Its Industrial Application on Patterned Sapphire Substrate (PSS) of
Light-Emitting Diode (LED) (Invited)
Y.-C. Lee, Natl. Cheng Kung Univ., Taiwan

23A-3-2
14:05

The Prospects of Design for Roll to Roll Lithography: Layout Refinement Utilizing Process Simulation(Invited)
S. Kobayashi, M. Shimizu, S. Tanaka, Y. Furutono, M. Hatano, K. Matsuki, R. Inanami and S. Mimotogi, Toshiba,Japan

23A-3-3
14:30

Large Area Residual Layer Free Roll-to-Roll-UV-Imprint-Lithography
D. Nees, M. Belegratis, S. Ruttloff, U. Palfinger and B. Stadlober, Inst. for Surface Technologies and Photonics,
Austria

23A-3-4
14:50

Fabrication of Anti-Reflection Film with Sub-Wavelength Structures Based on Roll-to-Roll Nanoimprinting
C.-H. Chuang, D.-M. Lu, P.-H. Wang, W.-Y. Lee, Southern Taiwan Univ. of Sci. and Technol., Taiwan

23A-3-5
15:10

Fabrication of Nano- and Microstructures on Polymer Foils by Extrusion Coating
M. Matschuk 1, G. Kofod 1, S. Westad 3, P. Johansen 3, H. Pranov 1 and R. Taboryski 2, 1 Inmold Biosystems,
2 DTU Nanotech and 3 Danapak Flexibles, Denmark-1-

23A-3-6
15:30

Thermal Roller Nanoimprinting - Mulilayered Structures, Laser-Assisted Replication K. Nagato 1,2, K. Takahashi 1 and M. Nakao 1, 1 Univ. of Tokyo and 2 JST-PRESTO, Japan

23A-3-7
15:50

Extraordinary Optical Transmission of Metallic Hole Arrays for Color Display Applications by Nanoimprint
B.-R. Lu, C. Xu and Y. Chen, Fudan Univ., China
Room P (2F)

Poster Session (16:20-18:20)
Process
23P-4-1

Investigation of The Minimum UV-Exposure Period for High-Throughput UV Nanoimprinting
Y. Ishito and M. Nakagawa, Tohoku Univ., Japan

23P-4-2

Study on Deterioration Mechanism of Antisticking Layer in Repeated UV Nanoimprint
S. Iyoshi 1, M. Okada 1, Y. Haruyama 1, M. Nakagawa 2, H. Hiroshima 3 and S. Matsui 1, 1 Univ. of Hyogo, 2
Tohoku Univ. and 3 AIST, Japan

23P-4-3

Computational Study on Molecular Behavior in The Resist During De-Molding Process in Nanoimprint
Lithography
N. Iwata, R. Takai, M. Yasuda, H. Kawata and Y. Hirai, Osaka Pref. Univ., Japan

23P-4-4

Consideration of Resin Peeling In UV Nanoimprint Without Antisticking Layer
T. Oyama 1, T. Yamashita 2, M. Okada 1, S. Iyoshi 1, Y. Haruyama 1 and S. Matsui 1, 1 Univ. of Hyogo and 2
Daikin Industries, Japan

23P-4-5

Computational Study of Impact of Resist Shrinkage on Resist Separation and De-Molding Processes
T. Tochino, K. Uemura, M. Yasuda, H. Kawata and Y. Hirai, Osaka Pref. Univ., Japan

23P-4-6

Impact of Resist Shrinkage on Squeezed Residual Layer in Nanoimprint Lithography
T. Tochino, M. Yasuda, H. Kawata and Y. Hirai, Osaka Pref. Univ., Japan

23P-4-7

Impact of Tribological Characteristics on De-Molding Process
K. Uemura 1, T. Tochino 1, M. Michalowski 2, T. Shiotsu 1, M. Yasuda 1, H. Kawata 1, Z. Rymuza 2 and Y. Hirai
1, 1 Osaka Pref. Univ., Japan and 2 Warsaw Univ. of Technology, Poland

23P-4-8

The Influence of Surface Energies on The Working Stamp Fabrication for UV-Based Nanoimprint
Lithography
M. Haslinger, L. Häusler, K. Bretterbauer, I. Bergmair and M. Mühlberger, Profactor, Austria

23P-4-9

Photoelectron Spectroscopy Study of The Fluorinated Antisticking Layers for Nanoimprint Lithography
Y. Haruyama 1, M. Okada 1, Y. Nakai 1, T. Ishida 2 and S. Matsui 1, 1 Univ. of Hyogo and 2 AIST, Japan

23P-4-10

Pressure Dependence of Fine Structure formation on Glass Surface by Electrical Nanoimprint
T. Misawa 1, N. Ikutame 1, T. Abe 1, H. Kaiju 1, J. Nishii 1, D. Sakai 2 and K. Harada 2, 1 Hokkaido Univ. and 2
Kitami Inst. of Thechnol., Japan

23P-4-11

Selective SiO2 Deposition Using Corona Discharge CVD on Electrically Imprinted Soda-Lime Glass
D. Sakai 1, Y. Hara 1, K. Harada 1, H. Ikeda 2, T. Misawa 3, N. Ikutame 3, K. Kawaguchi 3, H. Kaiju 3 and J. Nishii
3, 1 Kitami Inst. of Technol., 2 Kyushu Univ. and 3 Hokkaido Univ., Japan

23P-4-12

Uniform Residual Layer Thickness in UV-NIL Achieved by Screen Printing with High-Viscosity Resins
T. Uehara 1, K. Nagase 2, A. Tanabe 1, H. Ikedo 2 and M. Nakagawa 1, 1 Tohoku Univ. and 2 MINO, Japan

23P-4-13Fabrication of Periodic Metal Diffraction Grating with Micro-Scale Mold by Direct Imprint
W.-C. Kao 1, F.-Y. Chang 1 and C.-C. Wu 2, 1 Natl. Taiwan Univ. of Sci. and Technol. and 2 Tamkang Univ.,
Taiwan23P-4-14

Reversal Room-Temperature Nanoimprinting for 3D HSQ Structure
N. Sugano, M. Okada, Y. Haruyama and S. Matsui, Univ. of Hyogo, Japan

23P-4-15

Amorphous LaRuO Nano-Patterning Using Rheology Printing Method
K. Nagahara, J. Li, D. Hirose, E. Tokumitsu and T. Shimoda, JAIST, Japan

23P-4-16

A Pattern Formation Method by Nanoelectrode Lithography
H. Uchida 1, A. Yokoo 2, M. Fukuda 1 and Y. Iwatani 1, 1 Hirosaki Univ. and 2 NTT, Japan

23P-4-17

Replication of Atomically Smooth Surface Shape onto Electroplated Au Patterns by Lift-Off Process
Y. Kurashima, A. Maeda and H. Takagi, AIST, Japan

23P-4-18

Nanopatterned Surfaces for Studying Cell Interactions
N. Gopalakrishnan, . B. Strøm and Ø. Halaas, Norwegian Univ. of Sci. and Technol., Norway

23P-4-19

Preparation and Characterization of Superhydrophobic Micropillars Assembly with Bumps on Their
Surface
Y. Shimazaki and A. Miyauchi, Hitachi, Japan

23P-4-20

Adaptive Alignment for Nanoimprinting and for Other Applications
E.E. Moon 1 and R.F. Pease 2, 1 MIT and 2 Stanford Univ., USA-2-

23P-4-21

Large Area Fabrication of Hybrid Polymer Waveguides for Planar Bragg Grating Sensors Using UVEnhanced Substrate Conformal Imprint Lithography (UV-SCIL)
M. Foerthner 1, R. Fader 2, M. Rumler 2, M. Rommel 2, L. Frey 1,2 M. Girschikofsky 3, S. Belle 3, R. Hellmann 3
and J. Klein 4, 1 Univ. Erlangen-Nuremberg, 2 IISB, 3 Univ. of Applied Sci. Aschaffenburg and 4 micro resist
technol., Germany

23P-4-22

Fabrication of 2D and 3D Shaped Micro- and Nanoparticles via Substrate Conformal Imprint Lithography
S. Reuter, A. Istock, M.A. Smolarczyk, U.-M. Ha, O. Schneider, L. Gomer and H.H. Hillmer, Univ. of Kassel,
Germany

23P-4-23

Large-Area Fabrication of Orthogonally-Arranged Nano-Bowtie Arrays Using A Grating Mold
L. Feng, S. Shi, L. Liu, F. Wu and N. Lu, Jilin Univ., China

23P-4-24

Fabrication of Metal Nanodome Structure Using UV Nano-Imprinting Process for Enhanced Fluorescence
Substrate
H. Jang and S.-M. Kim, Chung-Ang Univ., Korea

23P-4-25

Investigation of Continuous Solution Dispensing Technology for Printed Charge Storage Capacitors
Y. Ge, M. Plötner, L. Teng, W.-J. Fischer, Technische Univ. Dresden, Germany

23P-4-26

Structure Placement Accuracy of Wafer Level Stamps for Substrate Conformal Imprint Lithography
R. Fader 1, M. Förthner 1, M. Rommel 1, A.J. Bauer 1, L. Frey 1, M.A. Verschuuren 2, J. Butschke 3, M. Irmscher
3, E. Storace 4, R. Ji 4 and U. Schömbs 4, 1 Fraunhofer Inst. for Integrated Systems and Device Technol.,Germany, 2 Philips Corporate Technologies, The Netherlands, 3 IMS Chips and 4 SUSS MicroTec Lithography,
Germany

23P-4-27

Selective Placement of DNA Origami Nanotubes on Nanoimprinted Surfaces
L. Teng 1, A. Heerwig 1, M. Lakotos 1, S. Ramakrishnan 1, W.-J. Fischer 1 and M. Mertig 1,2, TU Dresden and 2
Kurt-Schwabe-Inst. Fur Mess und Sensortech., Germany

23P-4-28

Utilization of Residual Layer In Reflow Process for Sidewall Inclination
H. Mekaru, AIST, Japan
Template / Material
23P-4-29

Evaluation of The New Vistec SB4050 VSB E-Beam Writer for Template Making
M. Irmscher, J. Butschke, S. Martens and H. Sailer, Inst. for Microelectronics Stuttgart, Germany

23P-4-30

Fabrication Process for Quartz Mold with High-Contrast Embedded Alignment Marks
K. Suzuki, S.-W. Youn and H. Hiroshima, AIST, Japan

23P-4-31

Nanoelectrode Lithography Using A Flexible Conductive Mold
Y. Li 1,2, H. Toshiyoshi 1 and H. Fujita 1, 1 Univ. of Tokyo and 2 Toshiba, Japan

23P-4-32

From Step and Repeat to Wafer Level Replication
M. Altana, S. Westenhöfer, M. Cesana and M. Rossi, Heptagon Advanced Micro Optics, Switzerland

23P-4-33

Metal Nano-Imprinting Using Vitreous Carbon Mold for Enhanced Boiling Heat Transfer
M.A. Badshah, J. Ju, Y.-K. Kim, H.-Y. Jang, H. Jang and S.-M. Kim, Chung-Ang Univ., Korea

23P-4-34

Development of Large-Area Nanoimprinting Molds by Step & Repeat Method With Using Film Molds
M. Yamanaka, Y. Miyazawa, T. Takahashi, Y. Mizukami and T. Mizawa, Soken Chemical & Eng., Japan

23P-4-35

Full Area Nanoimprinting onto Large Wafer Using Film Mold: Application for Nano-Patterned Devices
R. Kojima, Y. Mizukami and T. Mizawa, Soken Chemical & Eng., Japan

23P-4-36

Influencing Factors for The Fabrication of Square Working Stamps for UV-Based Nanoimprint
Lithography
J. Danzberger, M. Haslinger, T. Fischinger, L. Häusler, M. Lindner, B. Einwögerer, K. Bretterbauer, T. Faury, W.
Hackl, O. Lorret, I. Bergmair and M. Mühlberger, Profactor, Austria

23P-4-37

Bio-Inspired Inlays for Injection Molding Fabricated by UV-NIL to Influence The Friction Behaviour ofCeramic Surfaces
J. Danzberger 1, M. Rohn 1, A. Rank 1, B. Einwögerer 1, I. Bergmair 1, M. Mühlberger 1 E. Sonntag 2, R. Kirchner
3, H. Schift 3, C. Forsich 4, D. Heim 4 and E. Trappl 5, 1 Profactor, 2 BROELL, Austria, 3 Paul Scherrer Inst.
Switzerland, 4 Upper Austrian Univ. of Applied Sci. and 5 Kolibri Werkzeugbau GmbH, Austria

23P-4-38

New Dimensions for NIL: 2.5D Imprinting
M.A. Verschuuren and R.v. Brakel, Philips, The Netherlands

23P-4-39

Nanoimprint Molds of Carbon-Coated Anodic Aluminum Oxide Films with Sub-20 nm Hole Structures
A. Nakaya 1, Y. Hoshikawa 1, H. Kasa 2, J. Nishii 2, T. Kyotani 1 and M. Nakagawa 1, 1 Tohoku Univ. and 2
Hokkaido Univ., Japan

23P-4-40

Fabrication of Sub 50 nm Guide Line Wall for Graphoepitaxy of Block Copolymer Using Nanoimprint
Lithography with TiO2 Sol and Thermal Annealing Process
J.-H. Huh, J.-Y. Cho, P.-H. Jung, S. Hyun, B.-N. Go, C. Kim and H. Lee, Korea Univ., Korea-3-

23P-4-41

Mold Duplication by Hybrid Polymer Material
K. Uemura 1, K. Simomukai 1, H. Noma 1, S. Wang 2, M. Yasuda 1, H. Kawata 1, H.-C. Scheer 2 and Y. Hirai 1,
1 Osaka Pref. Univ., Japan and 2 Univ. of Wuppertal, Germany

23P-4-42

Fabrication of Flexible SU-8 Moulds by A New Direct 3D Patterning Approach for Nanoimprint Lithography
Applications
N. Worapattrakul, V. Viereck and H.H. Hillmer, Univ. of Kassel, Germany

23P-4-43

towards Nanoimprint Lithography on Free-form Surfaces: A Global/Local Modelling Approach for
Predicting The Deformation of The Flexible Stamp
M.R. Sonne 1, K. Smistrup 2 and J.H. Hattel 1, 1 Technical Univ. of Denmark and 2 NIL Technology ApS, Denmark

23P-4-44

100 nm Pattern Fabrication by Using De-Molding-Free Roller Type Nanoimprint and Water-Dissolvable
Soft Mold
Y. Zhong and M.M.F. Yuen, Hong Kong Univ. of Sci. and Technol., Hong Kong

23P-4-45

Fabrication of Si Molds with High Aspect Pattern for Various Pattern Sizes
H. Kawata, M. Mamuro, K. Shimomukai, M. Yasuda and Y. Hirai, Osaka Pref. Univ., Japan

23P-4-46

Fabrication of Nano-Patterned Injection Moulding Steel tool Inserts by Nanoimprint Lithography
M. Zalkovskij 1, L.H. Thamdrup 1, K. Smistrup 1, T. Andén 1, A.C. Johansson 1, N.J. Mikkelsen 2, M.H. Madsen
3, T.T. Kristiansen 4, M. Diemer 4, M. Døssing 5, P.T. Tang 6, D. Minzari 6, A. Kristensen 7, R. Taboryski 7, B.
Bilenberg 1 and T. Nielsen 1, 1 NILT, 2 CemeCon Scandinavia, 3 DFM, 4 LEGO System, 5 TOOL partners, 6 IPU
and 7 DTU Nanotech, Denmark

23P-4-47

Fluorinated Polymer (FROMPTM) Made by ROMP for Use In Nanoimprint Technology
T. Oda and T. Sunaga, Mitsui Chemicals, Japan

23P-4-48

Development of Silicon-Containing Additives for UV Nanoimprint Lithography to Improve Durability ofResist Material to O2 Reactive Ion Etching
S. Ito 1, H. Sato 2, Y. Tasaki 2, Y. Honda 2, N. Nemoto 2 and M. Nakagawa 1, 1 Tohoku Univ. and 2 Nihon Univ.,
Japan

23P-4-49

Quantitative Evaluation and Defect Elimination in Template Releasing Process by Use of FluorinatedSegregation Agents Into Resist Polymer
N. Nakamura 1, T. Yamashita 2, T. Kitagawa 1, H. Kawata 1, M. Shirai 1 and Y. Hirai 1, 1 Osaka Pref. Univ. and 2
Daikin, Japan

23P-4-50

UV-Curable Hybrid Polymers with High Refractive Index and Improved PDMS-Compatibility for Advanced
Micro- and Nano-Optics
J.J. Klein, M.-M. Russew, M. Vogler, A. Schleunitz, G. Grützner, micro resist technol., Germany

23P-4-51

Effect of UV Curing Conditions on Adhesion Characteristics between Resist and Mold Surface
M. Shirai, K. Uemura, H. Kawata and Y. Hirai, Osaka Pref. Univ., Japan

23P-4-52

Novel Fluorinated Compounds That Improve Durability of Antisticking Layer for Quartz Mold
T. Yamashita 1, S. Iyoshi 2, M. Okada 2 and S. Matsui 2, 1 Daikin Industries and 2 Univ. of Hyogo, Japan

23P-4-53

Optical Polymers with Tunable Refractive Index for Nanoimprint Technologies
R. Fader 1, J. Landwehr 1, M. Rumler 1, M. Rommel 1, A.J. Bauer 1, L. Frey 1, B. Simon 2, B. Fodor 2, P. Petrik
2, A. Schiener 3, B. Winter 3, E. Spiecker 3, 1 IISB, Germany, 2 Res. Inst. for Technical Physics and Materials
Sci., Hungary and 3 Univ. of Erlangen-Nuremberg, Germany

Roll to Roll
23P-4-54

Systematic Study of Replication Fidelity of Nanostructures in Polymer Down to 40nm by Roll-to-Roll
Extrusion Coating
S. Murthy 1, H. Pranov 1, M. Matschuk 1, R. Taboryski 2 and H.C. Pedersen 1, 1 InMold Biosystems and 2
Technical Univ. of Denmark, Denmark

23P-4-55

Fabrication of Nano-Patterned Roll Mold Using Pattern Transfer Process
H.J. Kang, C.-S. Kim and M.Y. Jeonga, Pusan Natl., Univ., Korea

23P-4-56

High Resolution and Seamless R2R Imprinting Using Large Area Seamless Roller Mold
K. Sasaki , S. Matsubara , T. Tanaka and K. Komatsu, Asahi Kasei, Japan

23P-4-57

Large Area Seamless Roller Mold Using Fast EB Lithography for High-Resolution R2R Process
N. Ito 1, M. Abe 1, T. Kitada 1, T. Tanaka 1, M. Ataka 2, T. Kishiro 2 and S. Matsui 3, 1 Asahi Kasei, 2 Holon and3 Univ. of Hyogo, Japan

23P-4-58

Applying UV Roll-to-Roll Processes to Produce The Concentrated Films of A Solar Energy System
C.-H. Wu and W.-T. Chen, Natl. Kaohsiung Univ. of Applied Sci., Taiwan

23P-4-59

Micro and Nanoscale Roll-to-Roll Hot Embossing for The Fabrication of Plastic Devices
G. Kreindl 1, M. Chouiki 1, M. Thorsten 1, J. Dumond 2 and O.K. Soo 2, 1 EV Group, Austria and Inst. of Materials
Res. & Eng., Singapore-4-Application
23P-4-60

Large-Area UV-Based Nanoimprint Lithography to Investigate The Silicon-Germanium Island Growth on
Pit-Patterned Silicon Substrates
J. Danzberger 1, L. Häusler 1, I. Bergmair 1, M. Mühlberger 1, E. Lausecker 2, M. Glaser 2, F. Schäffler 2 and T.
Fromherz 2, 1 Profactor and 2 Univ. of Linz, Austria

23P-4-61

UV-Imprinting and Inkjet Printing - A Technology Synergy for Microlens Manufacturing
L. Jacot-Descombes 1, V.J. Cadarso 2, A. Schleunitz 1, S. Grützner 1, J. Brugger 3, H. Schift 2 and G. Grützner
1, 1 micro resist technol, Germany, 2 Paul Scherrer Inst. and 3 EPFL, Switzerland

23P-4-62

Enhancing Light Extraction Efficiency of OLED with Photonic Quasi-Crystal Structures by UVNanoimprint Lithography Process
K.-Y. Cheng 1, C.-W. Hsieh 1, C.-K. Huang 2, M.-Y. Chang 2 and T.-H. Chou 1, 1 ITRI and 2 Natl. Sun Yat-Sen
Univ., Taiwan

23P-4-63

Development of Biodegradable Polylactide Graft Stent Manufacturing by Circular Imprint
P.-T. Teng and F.-Y. Chang, Natl. Taiwan Univ. of Sci. and Technol., Taiwan

23P-4-64
Withdrawn

Step-and-Repeat Nanoimprinting on Pre-Spin Coated Film: From Sub-15 Nm Metal Patterning to The
Fabrication of A on-Chip Spectrometer
G. Calafiore 1, S. Dhuey 2, S. Sassolini 2, M. Vogler 3, C. Shawawreh 2, M. Messerschmidt 3, D. Olynick 2, S.
Cabrini 2 and C. Peroz 1, 1 aBeam Technologies, 2 The Molecular Foundry, USA and 3 micro resist technol.,Germany

23P-4-65

Fabrication of Three-Dimensional Epitaxial Spinel Ferrite Nanowall Wire Structures by 3D-Nanotemplate
PlD Technique
A.N. Hattori, Y. Fujiwara, K. Fujiwara and H. Tanaka, Osaka Univ., Japan

23P-4-66

Self-Assembly of Single-Crystalline Tio2-Nanorods to Hierarchical Microspheres as High Performance
Photoanode Materials in Dye-Sensitized Solar Cells
Z. He, J. Liu and T.T.Y. Tan, Nanyang Technological Univ., Singapore

23P-4-67
Withdrawn

Nanopyramids Fabricated Using UV-Curing Nanoimprint Lithography and Their Applications on
Pedot:Pss/Si Hybrid Solar Cells
P-.J. Ku, J.-Y. Chen and K.W. Sun, National Chiao Tung Univ., Taiwan

23P-4-68

Nanoscale Patterning of Proteins for Understanding Molecular Interactions of Membrane Proteins In
Living T-Cells
M. Lindner 1, J. Kastner 1, O. Lorret 1, E. Sevcsik 2, M. Fölser 2, G. Schütz 2, I. Bergmair 1, 1 Profactor and 2
TU Vienna, Austria

23P-4-69

Impact of Morphology on T-NIL with Semi-Crystalline P3Ht
S. Wang, K. Dhima, C. Steinberg, M. Papenheim and H.-C. Scheer, Univ. of Wuppertal, Germany

23P-4-70

Simple and Fast Guiding of Ps-B-Pmma Diblock Copolymers with A Flexible Stamp
C. Steinberg 1, M. Papenheim 1, K. Dhima 1, S. Wang 1, J. Zajadacz 2, K. Zimmer 2 and H.-C. Scheer 1, 1 Univ.
of Wuppertal and 2 Leibniz-Institut für Oberflächenmodifizierung, Germany

23P-4-71

3D Silicon Nanostructure for Highly Efficient Organic/Inorganic Hybrid Solar Cell
P.-H. Jung, H.-J. Choi, Y.-D. Kim, C. Kim, J.-H. Huh, S. Hyun, B.-N. Go and H. Lee, Korea Univ., Korea

23P-4-72

Improvement in Conversion Efficiency of Amorphous Si Solar Cell Using Zno-Nanoparticles-Based
Structures
B.-N. Go, C. Kim, J.-h. Huh, S. Hyun, P.-h. Jung and H. Lee, Korea Univ., Korea

23P-4-73

High Performance Anode With Micro-Nano Structure for Lithium Ion Batteries
S. Hyun, J.-H. Shin, G. Kim, J.-H. Huh, P.-H. Jung, B.-N. Go, Y.-H. Sung, C.H. Kim and H. Lee, Korea Univ., Korea

23P-4-74

Electrospinning of Gelatin Nanofibers for Human Pluripotent Stem Cell Applications
L. Liu 1, M. Yoshioka 1, K. Kamei 1 and Y. Chen 1,2, 1 Kyoto Univ., Japan and 2 Ecole Normale Supérieure,France23P-4-75

Chemical Guide Pattern Fabricated by Thermal Nanoimprinting for Alignment of PS-b-PMMA
Microdomains
H. Wakaba, M. Okada, S. Iyoshi, Y. Haruyama and S. Matsui, Univ. of Hyogo, Japan

23P-4-76

Demanding High Aspect Ratio Nanostructures Fabricated Applying A Novel Inkjet Dispensable NIL Resist
M.W. Thesen 1, M. Rumler 2, M. Rommel 2, M. Messerschmidt 1, M. Vogler 1 and G. Grützner 1, 1 micro resist
technol. and 2 IISB, Germany

23P-4-77

Evaluation of Molecular Orientation in Liquid Crystalline Polymer Structure Fabricated by Nanoimprinting
M. Okada 1, R. Hosoda 1, M. Kondo 1, Y. Haruyama 1, T. Sasaki 2, H. Ono 2, N. Kawatsuki 1 and S. Matsui 1, 1
Univ. of Hyogo and 2 Nagaoka Univ. of Technol., Japan

23P-4-78

Hydrophilicity Enhancement in Plastic-Pipette by Nano-Textured Surface
K. Kurihara, N. Takada, H. Takagi and R. Maeda, AIST, Japan-5-

23P-4-79

Investigations on The Growth Mechanism and Photovoltaic Application of Porous Anodic Alumina withThe Help of Nanoimprinting
D. Li, Chinese Academy of Sci., China

23P-4-81

Monolayer-Assisted Nanoimprint Lithography to Fabricate Visible Frequency Metamaterials
S. Kubo, T. Uehara and M. Nakagawa, Tohoku Univ., Japan

23P-4-82

A Study on The Residual Layer Control for Imprinted PLC Devices
J. H. Kim, S.U. Cho, T.H. Lee and M.Y. Jeong, Pusan Natl. Univ., Korea

23P-4-83

GaN/InGaN-Based Light-Emitting Diode with Patterned Top Metal Electrode and Broad Spectrum
Emission
J. Kholopova 1, E. Polushkin 1, S. Larkin 1, S. Shapoval 1, V. Zemlyakov 2, V. Egorkin 2, N. Antonova 3, A.
Tsatsul’nikov 4 and I. Khmyrova 5, 1 IMT RAS, 2 NRUET, 3 NRNU MEPhI, 4 A.F. Ioffe Physico-Technical Inst.
RAS, Russia and 5 Univ. of Aizu, Japan

23P-4-84

Comparison with The Imprinting Transfer and The Material Viscoelasticity
K. Monden and Y. Akiyama, Denki Kagaku Kogyo, Japan

23P-4-85

The Refractive Index Sensor Based on Plasmonic Absorber Using Nanoimprint Lithography
J.-Y. Jung, J.-H. Jeong and E.S. Lee, KIMM, Korea

23P-4-86

Fabrication of Ag Pyramidal Arrays As Highly-Reproducible Sers Substrates
Y. Wang, W. Wang, L. Liu, L. Feng and N. Lu, Jilin Univ., China

23P-4-87

Characterization of Binary Random Phase Array Fabricated by Nanoimprint Lithography
Y. Nakamura, Y. Inada, A. Hashiya and T. Hirasawa, Panasonic, Japan

23P-4-88

Multicolor Pattern Generation of Nobel Metal Nanodisk Arrays
S.-C. Yang, TU Dresden, Germany

23P-4-89

Fabrication of Solution-Processed Source/Drain Electrodes by Thermal Nanoimprint Assisted Ink-Jet
Printing
A. Kumar, M. Plötner, L. Teng, S.C. Yang and W.-J. Fischer, TU Dresden, Germany
Room A (2F)
Banquet18:30-20:30-6-

October 24, 2014
Room A (2F)
24A-5: Process Modeling (9:00-10:30)
Chairs:Y. Hirai (Osaka Pref. Univ., Japan)
H. Schift (Paul Scherrer Inst., Switzerland)
24A-5-1
9:00

Size Effects in Nanoimprinted Structures and Manufacturing Flows (Invited )G.L.W. Cross, Trinity College Dublin, Ireland

24A-5-2
9:25

Material Characterization Issue for NIL Simulation (Invited)
S. Landis 1, E. Rognin 1,2, L. Davoust 2 and H. Teyssedre 1, 1 CEA LETI and 2 CNRS SIMAP/EPM, France

24A-5-3
9:50

Effect of Residual Stress on Replication Fidelity With Nanoimprint
M. Papenheim 1, K. Dhima 1, S. Wang 1, C. Steinberg 1, H.-C. Scheer 1, J. Saupe 2, M. Schönfeld 2 and J.
Grimm 2, 1 Univ. of Wuppertal and 2 Univ. of Zwickau, Germany

24A-5-4
10:10

Nanosculpting with Imprint Lithography
M.J. Chopra, A. Cherala, S.V. Sreenivasan and R.T. Bonnecaze, Univ. of Texas at Austin, USA

10:30-10:45

Coffee BreakRoom P (2F)
Room A (2F)
24A-6: Template / Material (10:45-11:50)
Chairs:M. Nakagawa (Tohoku Univ., Japan)
D. Resnick (CANON Nanotechnologies, USA)
24A-6-1
10:45

Nanoimprint Fabrication and Application of Subnano-Scale Surface-Patterned Glassy Substrates (Invited)
G. Tan 1, Y. Nozawa 1, T. Funabasama 1, S. Kaneko 2,1, A. Matsuda 1 and M. Yoshimoto 1, 1 Tokyo Inst. ofTechnol. and 2 Kanagawa Industries Technol. Ctr., Japan

24A-6-2
11:10

Fabrication of Glass Microlens Array by Glass Imprinting Using Vitreous Carbon Stamp
J. Ju and S.-m. Kim, Chung-Ang Univ., Korea

24A-6-3
11:30

Development of Multistep Micro-Nano Mixed Structure Using Conventional Nanoimprinting Molds
Y. Suto, Y. Miyazawa, Y. Mizukami and T. Mizawa, Soken Chemical & Eng., Japan

11:50-13:00

LUNCH

24A-7: Process II (13:00-14:45, October 24, 2014)
Chairs:A. Yokoo (NTT, Japan)
H.-C. Scheer (Univ. of Wuppertal, Germany)
24A-7-1
13:00

Ultrafast Nanoimprint Lithography on Full Wafers (Invited)
M. Tormen 1,2, E. Sovernigo 1,2, A. Pozzato 1,2, M. Pianigiania 2,3, M. Tormen 1,4, 1 ThunderNIL, 2 IOMCNR, 3 Univ. of Trieste, Italy and 4 Ctr. Suisse d'Electronique et de Microtechnique SA, Switzerland

24A-7-2
13:25

Controlled Nanoimprint Transfer for Tunable Plasmonic Metal Structure
Y.-H. Jung, S.-K. Sung, J.-H. Jeong, E.-S. Lee and J.-H. Choi, Univ. of Sci. and Technol. & KIMM, Korea

24A-7-3
13:45

Additive Nano Manufacturing Utilized by Reverse Nanoimprint Lithography Processes
A. Fernández 1, J. Medina 1, C. Benkel 3, M. Guttmann 3, B. Bilenberg 4, L.H. Thamdrup 4, T. Nielsen 4, C.
Sotomayor Torres 1,2 and N. Kehagias 1, 1 ICN, 2 ICREA, Spain, 3 KIT and 4 NILT, Denmark

24A-7-4
14:05

Implementation of A Novel Self-Aligned NanoShaping (SANS) Technology to Fabricate 3D Nanoparticles
M.A. Smolarczyk, S. Reuter, L. Jablonka and H. Hillmer, Univ. of Kassel, Germany

24A-7-5
14:25

Fabrication of Bio-Inspired Replication Masters and Mobility Based Full 3D Reflow Simulation
R. Kirchner 1, H. Schift 1 E.Sonntag 2, M. Rohn 3, I. Bergmair 3 and M. Munlberger 3, 1 Paul Scherrer Inst.,
Switzerland, 2 BROELL and 3 Profactor, Austria

14:45-15:00

Coffee BreakRoom P (2F)
Room A (2F)
24A-8: Application II (15:00-16:55)
Chairs:H. Hiroshima (AIST, Japan)
S. Landis (CEA LETI, France）
24A-8-1
15:00

Enhanced Performance of Organic Devices by Optical-functional Pattern (Invited)
H. Lee, Korea Univ., Korea

24A-8-2
15:25

UV-NIL Applied Fabrication of High Quality 2-Inch GaN Template Using Nanometer-Size SiO2 Lattice Mask
Structure
A. Okada 1, J. Mizuno 1, H. Shinohara 2, H. Goto 2, T. Matsueda 3, H. Sunakawa 3, H. Goto 3, T. Nakagawa 3,
A.A. Yamaguchi 4, S. Shoji 1 and A. Usui 3, 1 Waseda Univ., 2 Toshiba Machine, 3 Furukawa and 4 Kanazawa
Inst. of Technol., Japan-7-

24A-8-3
15:45

Fabrication of Nano Wire Grid Polarizer Film by Magnetic Soft Mold
S.U. Cho 1, S. Chang 2, D.-C. Choi 2, C.-S. Kim 1, M.Y. Jeong 1, 1 Pusan Natl. Univ. and 2 KIMM, Korea

24A-8-4
16:05

UV Nano Imprint Process for Making The Wire Grid Polarizing Film (WGFtm)
T. Namatame, Y. Tanaka and H. Yokoyama, Asahi Kasei E-materials, Japan

24A-8-5
16:25
Withdrawn

Direct Nanoimprinting of High Refractive Index Optical Films
C. Pina-Hernandez 1, C. Mejia Prada 1, F. Salvadori 2, Q. Fillot 2, S. Dhuey 2, G. Calafiore1, S. Sasolini 2, S.
Babin 1, S. Cabrini 2 and C. Peroz 1, 1 aBeam Technologies and 2 Lawrence Berkeley Natl. Lab., USA

24A-8-6
16:25

Nanostructured Antireflective Surface with Antimicrobial Characteristics
S. Kim 1, U.T. Jung 1, K.N. Kim 2, S.K. Lim 2, H. S. Choi 3, M.Y. Jeong 1, 1 Pusan Natl. Univ., 2 Natl. Nanofab
Ctr. and 3 Beth Israel Deaconess Medical Ctr. and Harvard Medical School, USA

16:45-16:55

Closing
S. Matsui (Univ. of Hyogo, Japan)
Y. Hirai (Osaka Pref. Univ., Japan)
S.Y. Chou (Princeton Univ., USA)

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