JMR-010A(E)General

CONTAMINATION CONTROL STANDARD

This standard is a revision of the JAXA program management
requirements document JMR-010 provisional version (establishedin 2004) based on the former NASDA-STD-26, while maintaining
consistency with ISO-15388.

Mar 31, 2020

Japan Aerospace Exploration Agency

JMR-010A(E)This is an English translation of JMR-010A, “CONTAMINATION CONTROL STANDARD”, and does
not constitute itself.
Whenever this document conflicts with the original document in Japanese, the original document
takes precedence.

Disclaimer
The information contained herein is for general informational purposes only. JAXA makes no warranty,
express or implied, including as to the accuracy, usefulness or timeliness of any information herein.
JAXA will not be liable for any losses relating to the use of the information.

Published by
Japan Aerospace Exploration Agency
Safety and Mission Assurance Department
2-1-1 Sengen Tsukuba-shi,Ibaraki 305-8505, JapanJMR-010A(E)Contents
Disclaimer ........................................................................................................................................ ii
1 GENERAL ..................................................................................................................................... 1
1.1 Purpose ...................................................................................................................................... 1
1.2 Scope ......................................................................................................................................... 1
1.2.1 Scope ...................................................................................................................................... 1
1.2.2 Tailoring................................................................................................................................... 1
2 RELATED DOCUMENTS .............................................................................................................. 2
2.1 Applicable documents ............................................................................................................ 2
2.2 Referenced documents .......................................................................................................... 2
2.3 Referenced data base ........................................................................................................... 3
3 DEFINITION OF TERMS .......................................................................................................... 4
3.1 Definition of terms.................................................................................................................. 4
3.2 Abbreviation ......................................................................................................................... 11
4 GENERAL REQUIREMENTS ...................................................................................................... 12
4.1 Control ................................................................................................................................. 12
4.1.1 Organization ..................................................................................................................... 12
4.1.1.1 Clarification of implementing organization and responsibilities, and implementation ..... 12
4.1.1.2 Requirement to suppliers ............................................................................................... 12
4.1.2 Cleanliness requirement specification .............................................................................. 12
4.1.3 Contamination control plan ............................................................................................... 12
4.1.4 Interface control document ............................................................................................... 14
4.1.5 Examination and performance confirmation of contamination control program ................. 14
4.2 Management at design phase .............................................................................................. 14
4.2.1 Identification of sensitive hardware ................................................................................... 14
4.2.2 Identification of process control parameters by process FMEA......................................... 14
4.2.3 Properties, impacts and profiles of contaminants.............................................................. 15
4.2.3.1 Typical contamination source ......................................................................................... 15
4.2.3.2 Contamination profile ..................................................................................................... 16
4.2.3.3 Impact of contamination on performance ....................................................................... 16
4.2.4 Contamination prediction .................................................................................................. 16
4.2.5 Contamination budget ....................................................................................................... 17
4.2.6 Design considering cleanliness ......................................................................................... 17
4.2.6.1 Configuration ................................................................................................................. 18

JMR-010A(E)

4.2.6.2 Contamination prevention .............................................................................................. 18
4.2.6.3 Decontamination ............................................................................................................ 18
4.2.6.4 Design confirmation ....................................................................................................... 18
4.2.7 Material and process selection ......................................................................................... 18
4.2.7.1 Outgassing .................................................................................................................... 19
4.2.7.2 Total mass loss ratio of moisturized material ................................................................. 20
4.2.7.3 Metal material ................................................................................................................ 20
4.2.7.4 Non-metal material ........................................................................................................ 20
4.2.7.5 Fluid............................................................................................................................... 20
4.2.7.6 Process.......................................................................................................................... 20
4.2.7.7 Quality control................................................................................................................ 21
4.3 Biocontamination ................................................................................................................. 21
4.3.1 Overview........................................................................................................................... 21
4.3.2 Hardware contamination by micro-organisms ................................................................... 21
4.3.3 Handling of sterilized hardware......................................................................................... 21
4.3.4 Planetary protection .......................................................................................................... 22
4.4 Contamination control during ground works ......................................................................... 22
4.4.1 Education and training of personnel ................................................................................. 22
4.4.2 Clean room selection and cleanliness control ................................................................... 22
4.4.3 Garments (clothing for clean room) .................................................................................. 23
4.4.3.1 General .......................................................................................................................... 23
4.4.3.2 Selection of garments .................................................................................................... 23
4.4.3.3 Other ............................................................................................................................. 23
4.4.4 Management of facility, ground support equipment, materials and auxiliary materials ...... 24
4.4.4.1 Management of equipment, ground support equipment, tools, etc. ................................ 24
4.4.4.2 Gas contro ..................................................................................................................... 24
4.4.4.3 Liquid control ................................................................................................................. 25
4.4.5 Cleanliness monitor for flight hardware and its vicinity ..................................................... 25
4.4.5.1 Measurement of surface cleanliness .............................................................................. 25
4.4.5.2 Air quality measurement ................................................................................................ 25
4.4.5.3 Gas cleanliness measurement ....................................................................................... 26
4.4.5.4 Liquid cleanliness measurement .................................................................................... 26
4.4.5.5 Evaluation of data error and accuracy ........................................................................... 26
4.4.5.6 Statistical analysis of data ............................................................................................. 26
4.4.6 Flight hardware control ..................................................................................................... 26

JMR-010A(E)

4.4.6.1 Contamination prevention for each phase...................................................................... 28
4.4.7Packing, transportation and storage .................................................................................. 29
4.4.7.1 Packing .......................................................................................................................... 29
4.4.7.2 Storage .......................................................................................................................... 29
4.4.7.3 Transportation ................................................................................................................ 29
4.5 Launch and operational phase ............................................................................................. 29
4.6 Product assurance ............................................................................................................... 30
5 DETAILED REQUIREMENTS ...................................................................................................... 30

JMR-010A(E)

1 GENERAL
1.1 Purpose
This contamination control standard (hereinafter referred to as "this Standard") specifies therequirements for contamination control applied to the development, launch and orbital operationof the spacecraft to prevent the deterioration of spacecraft performance due to contaminationand to achieve the purpose of the mission. And this Standard provides guidelines for setting up
a contamination control program.
The purpose of contamination control is to prevent the deterioration of the performance of thespace system due to particle contamination and molecular contamination (including
biocontamination), and to ensure that the mission objectives are achieved.

1.2 Scope
1.2.1 Scope
When this Standard is called into technical specification, procurement specification, etc., itapplies to the Japan Aerospace Exploration Agency (hereinafter referred to as "JAXA") and/or thecontractor to the following extent.
This Standard is applied when contamination control is deemed necessary in each phase of the
project such as design, manufacturing, assembly, integration, testing, transportation, storage forspacecraft system, components and parts including pre-launch work, launch, in-orbit operation andpost-mission work.
However, the following items are not covered by this Standard.
a. Measures against radioactive contamination
b. Measures to prevent debris (Specified by JMR-003 Space Debris Mitigation Standard)c. Planetary protection (Specified by JMR-014 Planetary Protection Program Standard (inJapanese))

1.2.2 Tailoring(1) The requirements of this Standard can be tailored for each project according to the purpose,function, importance, scale, etc. of the spacecraft.
(2) When there are any items that are difficult to comply with among the requirements of thisStandard for existing facilities and ground support equipments used for ground works such as
manufacturing, assembly, and testing, the requirements can be tailored in consultation with therequester of this Standard application after clarifying the reason.

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JMR-010A(E)
2 RELATED DOCUMENTS
2.1 Applicable documents
The following documents shall be part of this Standard within the scope specified in this Standard,
and the latest version at the time of the contract shall be applied unless otherwise specified.
In case of a conflict between this Standard and the following documents, this Standard shall takeprecedence.
(1) JMR-004 Reliability Program Standard(2) JMR-005 Quality Assurance Program Standard(3) JMR-013 Quality Assurance Program Standard (Basic Requirements: JIS Q 9100)(4) ISO 14624-3 Space systems -Material Flammability, odor, offgassing and compatibility–Part 3:
Test Method for Determination of Offgassed Products from Materials and Assembled Articles(5) ISO 14644-1 Cleanrooms and associated controlled environments - Part 1: Classification of air
cleanliness(6) ISO 15859-1 Space systems - Fluid characteristics Part 1: Oxygen(7) ISO 15859-2 Space systems - Fluid characteristics Part 2: Hydrogen propellant(8) ISO 15859-3 Space systems - Fluid characteristics Part 3: Nitrogen(9) ISO 15859-4 Space systems - Fluid characteristics Part 4: Helium(10) ISO 15859-5 Space systems - Fluid characteristics Part 5: Nitrogen tetroxide propellant(11) ISO 15859-6 Space systems - Fluid characteristics Part 6: Monomethyl hydrazine propellant(12) ISO 15859-7 Space systems - Fluid characteristics Part 7: Hydrazine propellant(13) ISO 15859-8 Space systems - Fluid characteristics Part 8: Kerosene propellant(14) ISO 15859-9 Space systems - Fluid characteristics Part 9: Argon(15) ISO 15859-10 Space systems - Fluid characteristics Part 10: Water(16) ISO 15859-11 Space systems - Fluid characteristics Part 11: Ammonia(17) ISO 15859-12 Space systems - Fluid characteristics Part 12: Carbon dioxide(18) ISO 15859-13 Space systems - Fluid characteristics Part 13: Breathing air(19) ISO 14952-2 Space systems - Surface cleanliness of fluid systems- Part 2: Cleanliness levels(20) MIL-STD-889 Dissimilar Metals(21) ASTM E 595 Standard Test Methods for Total Mass Loss and Collected Volatile Condensable
Materials from Outgassing in a Vacuum Environment(22) ASTM E 1559 Standard Test Method for Contamination Outgassing Characteristics ofSpacecraft Materials

2.2 Referenced documents
The following documents are for reference only to supplement the content of this Standard.
2

JMR-010A(E)(1) JMR-003 Space Debris Mitigation Standard(2) N/A(3) SR70-04 H-IIA Rocket Range Launch Maintenance Work Request Form (in Japanese)(4) ISO 14625 Space systems - Ground support equipment for use at launch, landing, or retrieval
sites - General requirements.
(5) ISO 14644-2 Cleanrooms and associated controlled environments - Part 2: Specifications fortesting and monitoring to prove continued compliance with ISO14644-1.
(6) ISO 14644-4 Cleanrooms and associated controlled environments - Part 4: Design, construction
and start up of cleanroom facilities(7) ISO 14644-5 Cleanrooms and associated controlled environments - Part 5: Design, Operations(8) ISO 14698-1 Cleanrooms and associated controlled environments – Cleanroom technology Biocontamination control: General principles(9) ISO 14698-2 Cleanrooms and associated controlled environments – Cleanroom technology Biocontamination control: Evaluation and interpretation of biocontamination data
(10) ISO 14698-3 Cleanrooms and associated controlled environments - Cleanroom technology –Biocontamination control: Methodology for measuring the efficiency of processes of cleaning and(or) disinfection of inert surface bearing biocontaminated wet soiling or biofilms(11) JSC SN-C-0005 Contamination Control Requirements for the Space Shuttle Program(12) NASA-CR-4740 Contamination Control Engineering Design Guidelines for the Aerospace
Community(13) SSP 30426 Space Station External Contamination Control Requirements(14) JMR-014 Planetary Protection Program Standard (in Japanese)

2.3 Referenced data baseThe database below is for reference only to supplement the content of this Standard.
(1) Material database http://matdb.jaxa.jp/main_j.html

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JMR-010A(E)

3 DEFINITION OF TERMS
3.1 Definition of terms(1) Air quality
Concentration of suspended particles in the air as defined by ISO 14644-1 (or FED-STD-209).
Refer to ISO 14644-1.
(2) Baking
The act of raising the temperature of the hardware to accelerate the outgassing rate with theintention of reducing the content of molecular contaminants in the hardware. Baking is usually donein a vacuum environment, but it can also be done in a controlled atmosphere.
(3) Beginning of life (BOL)
Beginning of the operation life (mission life) of the system.
(4) Bioaerosol
Scattering of organisms (ex. growing particles, allergens, toxins, or biological action mixtures ofpathogens) in a gas atmosphere. Refer to ISO 14698-1.
(5) Biocontamination
Contamination of materials, devices, solids, surfaces, liquids, gases, or air with live particles(molds, fungi, etc.). Refer to ISO / CD 14698-1.
(6) Classification of airborne particle concentration
The level of particle cleanliness suspended in the air (or the process of clarifying, or thedetermination of the level) is expressed as the maximum permissible concentration of the estimatedparticle size (number of particles / m3). Refer to ISO 14644-1.
(7) Clean area
Areas where spacecraft are manufactured, assembled, tested, etc. are divided as follows. The
area other than the "a. conventional industrial area" is called a clean area.
a. Conventional industrial area
b. Managed work area (equivalent to ISO 14644-1 CLASS 9)
c. Normal clean room (equivalent to ISO 14644-1 CLASS 8)
d. Laminar flow clean room (equivalent to ISO 14644-1 CLASS 5, 6, 7)(8) Cleanliness

4

JMR-010A(E)The amount of contaminants predicted or measured within a given area or volume, or on acomponent.
(9) Cleanliness Requirement Specification (CRS)
A document that defines and identifies the spacecraft items and the environmental areas which
are sensitive to contamination, the acceptable contamination levels at BOL and at EOL and theapplicable contamination environment.
(10) Clean room
A room that is controlled the concentration of particles suspended in the air, constructed bymeans that minimizes the intrusion, generation, and retention of particles in the room, and controlledtemperature, humidity, pressure as required. Refer to ISO 14644-1.
(11) Cleanroom garments
Clothes that are specially designed, made and worn so that personnel working in a clean room
do not contaminate the hardware.
(12) Collected volatile condensable material (CVCM)
The mass ratio of the gaseous substance released from the specimen condensed on the collector
while the specimen and collector are held at the specified temperature for a certain period of time.
For CVCM, the amount of condensate is calculated from the mass difference of the collector plate
before and after the test

and expressed as a percentage of the initial specimen mass. Refer to

ASTM E-595.
(13) Contaminant
Undesirable molecular or particulate material that may deteriorate or affect performance or life.
(14) Contaminate
Act of adhering contaminants.
(15) Contamination
Adhesion or contamination of materials, fluids, or surfaces.
(16) Contamination budget
Allowable level of cleanliness allocated to each hardware in each phase of ground and in-orbit
operation.
(17) Contamination and Cleanliness Control Plan（CCCP）
5

JMR-010A(E)A document that describes how the contamination control program should be run. Described ina separate document or in a comprehensive project plan.
(18) Contamination control program
Organizational activities for contamination control according to this Standard.
(19) Contamination profile
State related to contamination in each phase of ground and orbital operation. The contamination
profile includes the cleanliness class of suspended particles, pressure, humidity, temperature,
personnel engaged in operation, cleaning activities, facility outline, etc., and forms part of thecontamination control plan.
(20) Conventional industrial area
Areas where contamination control is not performed.
(21) Electrostatic discharge (ESD)
Transfer of static charge between objects with different potentials. This occurs when relatively
close or due to direct contact.
(22) End of life (EOL)
End of the operation life (mission life) of the system.
(23) Gas cleanliness
The amount of particles and impurities per unit volume of gas. These quantities are expressed in
number, mass or volume. Refer to ISO 14951-1 to -13, SR70-04.
(24) Ground Support Equipment (GSE)
Non-flight systems, equipment, or equipment required to assist spacecraft transport, receipt,
handling, assembly, inspection, testing, checkout, service, launch and recovery operations at launch,
re-entry and recovery sites. Refer to ISO 14625.
(25) Interface control document (ICD)
A document that describes the characteristics that must be managed at the boundaries between
systems, subsystems and other equipment.
(26) Laminar flow
A uniform flow of air from the air inlet to the outlet without turbulence that winds up contaminants.

6

JMR-010A(E)(27) Liquid cleanliness
The amount of particles and impurities per unit volume of liquid. These quantities are expressedin number, mass or volume. Refer to ISO 14951-1 to -13, SR70-04.
(28) Micro-organism
A microscopical individual with a life-supporting function. Organisms, including bacteria,
unicellular animals, yeasts, viruses and algae, etc.
(29) Molecular Contamination
A state in which unintended molecules are deposited on the surface. Or a state in which
unintended molecules are present in a gas or liquid. Adhesion or contamination of materials, fluids,
or surfaces with molecular contaminants. Most of them are generated from outgassing released fromequipment in a vacuum, and often originate from adhesives, lubricants, other organic materials andhuman fat.
(30) Non volatile residue (NVR)
Solid phase or liquid phase remaining after volatilizing the filtered volatile solvent. NVR is usually
expressed in terms of mass per unit volume of liquid, but when a volatile solvent-soluble contaminant
is removed from a particular region of a solid surface, NVR is expressed in terms of mass per unit
area.
(31) Occupancy states of cleanrooms
At-rest: A state where the equipment is installed and can be operated by the method agreed
between the JAXA and the contractor, but there are no personnel.
Operational: A state in which it is functioning according to the specified procedure, has a specified
number of personnel, and is operating in an agreed manner.
(32) Offgassing
Emission of gas from liquid or solid materials in a pressurized environment. It causes healthhazards when a person inhales the released gas component. It is managed from the perspective ofinterpersonal toxicity.
(33) Outgassing
The release of gas from the material, which usually occurs in vacuum. It causes deterioration of
the material that is the release source and pollution due to the released gas component adheringto the sensitive surface. It is managed from the viewpoint of contamination prevention.
(34) Particle
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JMR-010A(E)A mass of material that has an observable length, width, and thickness.
(35) Particle concentration (surface)
Number of particles per unit area.
(36) Particle concentration (volume)
Number of particles per unit volume of fluid.
(37) Particle Size
The maximum length of a particle that can be clearly identified on the monitoring surface whenobserved with a measuring instrument such as an optical microscope or an electron microscope, ora considerable diameter of the particle detected by an automatic measuring instrument. The
equivalent diameter is the diameter of the particles that show the same reaction as a matchingsphere with known characteristics by a measuring instrument that can measure particles.
(38) Particulate contamination
Adhesion or contamination of materials, fluids, or surfaces with particulate contaminants. It often
originates from dust in the air, human hair or small pieces of coating.
(39) Purge
The act of pushing out and removing the fluid (gas or liquid) remaining in the container withanother clean fluid. In addition, it can be used for the purpose of preventing the invasion ofcontaminants from the outside.
(40) Recovered mass loss (RML)
The value obtained by subtracting the adsorbed water from the mass loss ratio of the specimen(RML=TML–WVR). For some spacecraft, RML is defined because water is not a significant
contaminant.
(41) Responsible organization
An organization delegated the resources and authority needed to achieve the goals of acontamination control program.
(42) Sensitive hardware
Hardware whose quality may deteriorate due to contamination.
(43) Sensitive surface
The surface of an article or structure that may lead to quality degradation due to contamination.
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JMR-010A(E)(44) Significant surface
The surface of hardware that requires the specified cleanliness.
(45) Supplier
When applying this Standard to the JAXA , it is the counterparty to the contract with the departmentthat receives the request within the JAXA. In addition, when applying this Standard to the contractor,
they are individuals, companies or business establishments that directly or indirectly supply goods,
etc. including the other business divisions within the same company and the cooperating companies.
(46) Surface Cleanliness
Significant surface cleanliness. Particulate contamination is categorized by the size and numberof particles per unit area of a significant surface and is defined by the maximum particle size.
Molecular contamination is defined by the mass per unit area of a significant surface. Refer to ISO
14952-2.
(47) Total mass loss (TML)
The mass ratio of gaseous substances released from a specimen held for a specified period oftime at a specified constant temperature and pressure. TML is calculated from the mass of thespecimen weighed before and after the test and is expressed as a percentage of the initial specimen
mass. Refer to ASTM E-595.
(48) View factor
In the field of contamination control, the view factor when the polluted object is viewed directlyfrom the contamination source.
(49) Visibly clean (VC)
No surface contamination when inspected with specified light source and incident angle, viewing
distance and angle and standard visual equipment or magnifying glass. Refer to ISO 14952-2. (46)(50) Volatile condensable materials (VCM)
Of the gaseous substances released from a material exposed to vacuum, substances thatcondense on other materials at temperatures lower than that material.
(51) Water vapor regained (WVR)
Mass ratio of water vapor reabsorbed in the specimen to the initial specimen calculated fromthe difference between the total mass loss ratio (TML) and collected volatile condensable material(CVCM) test specimen mass and the specimen mass weighed again after exposure to air at a9

JMR-010A(E)relative humidity of 50% and 23 ° C for 24 hours. WVR is expressed as a percentage of the initial
specimen mass. Refer to ASTM E-595.
。

10

JMR-010A(E)

3.2 Abbreviation

(1)

ASTM

American Society for Testing and Materials

(2)

CVCM

Collected Volatile Condensable Material

(3)

FMEA

Failure Mode and Effect analysis

(4)

GSE

Ground Support Equipment

(5)

IPA

Iso Propyl Alcohol

(6)

ISO

International Organization for Standardization

(7)

MLI

Multi-Layer Insulation

(8)

NASA

National Aeronautics and Space Administration

(9)

NVR

Non-Volatile Residue

(10)

QCM

Quartz Crystal Microbalance

(11)

TML

Total Mass Loss

(12)

VC

Visibly Clean

(13)

VCM

Volatile Condensable Material

(14)

BOL

Beginning of Life

(15)

EOL

End of Life11

JMR-010A(E)

4 GENERAL REQUIREMENTS
4.1 Control
4.1.1 Organization
4.1.1.1

Clarificationofimplementing

organization

andresponsibilities,

andimplementation
In order to plan and execute a contamination control program, a contamination control
organization shall be established at the start of the project according to the configuration andlevel identified in the project. At the time of establishment, a person in charge of contamination
control shall be appointed. The contamination control organization may utilize the existingorganization.
In addition, the content of the contamination control program will be decided based on mutual
agreement between the requesting party and the receiving party to apply this Standard.
Contamination control organizations shall comply with the requirements of this Standard.

4.1.1.2 Requirement to suppliers
Contamination control requirements for the work shall be established and performed by the
supplier. The cleanliness of the product required to the supplier shall be considered to meet theperformance requirements of the product.

4.1.2 Cleanliness requirement specification
The hardware that requires contamination control shall be identified and the cleanliness to beachieved shall be defined quantitatively. The identified hardware shall include all items from thecomponent level to the system level. Hardware cleanliness shall be defined at the beginning of life(BOL) and the end of life (EOL) based on feasible requirements. Cleanliness requirement
specifications shall be established independently or included in project management documents(development specifications, management plans, design specifications, etc.). The hardware
cleanliness requirements for interfaces with systems, subsystems and other equipment shall beclarified early in the program and specified in the interface control document in Section 4.1.4 or anequivalent document.

4.1.3 Contamination control plan
The supplier shall formulate an activity plan for contamination control from design to operation.
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JMR-010A(E)Also, the supplier shall allocate contamination budgets in all phases of the project and clarify how toachieve the required cleanliness.
(1) When individually requested, the supplier shall create a contamination control plan that
describes how to achieve and maintain the specified cleanliness of the hardware throughout allphases of ground and in-orbit operations. When sensitive hardware is not included, it may be
included in the project management document such as the program implementation plan insteadof the independent document.
(2) The contamination control plan shall be presented in the preliminary design reviews at thelatest and shall be reviewed for conformity with this Standard and technical specifications. In
addition, the subsequent maintenance and management shall be carried out appropriately, andthe design review of each phase shall be done.
(3) The scope of application and the level of requirements of the contamination control plan shallbe determined by the contamination control organization, taking into account the importance ofhardware to contamination. In addition, additional work may be required in response to therequirements of this Standard.
(4) The contamination control plan shall include the following.
a. List of applicable documents, etc.
b. Contamination control organizationc. Review method and timing of contamination control activities
d. Record of contamination control activities
e. Procedure for contamination control activities
f. How to do design management activities related to contamination (design review, design /process FMEA, programs related to parts / devices / materials / processes, etc.)
g. Definition of a single failure mode that includes equipment failures and human error that
affects cleanlinessh. Contamination budget in all phases of ground and orbital operations
i. Procedures for qualification of parts, devices, materials and processes
j. Procedure of manufacturing process review related to contamination
k. Measurement, monitoring requirements, procedures and methodsl. Procedure for confirming the effectiveness of materials and equipmentm. How to achieve and maintain the required cleanlinessn. Measures when it is predicted that it will be difficult to achieve the required cleanlinesso. Prescriptions in case of deviation from required cleanlinessp. Non-conforming product treatment procedure
13

JMR-010A(E)q. Personnel education / training and methods
r. Important management items to be reflected in the procedure manuals. Definition of the risk of mutual contamination between hardware elements(5) The contamination control plan shall be reviewed by the requester for application of thisStandard.

4.1.4 Interface control document(1) Cleanliness of interfaces with different systems, subsystems and other equipment shall becontrolled by the interface control documents or the equivalent documents.
(2) The interface control document may include the following information.
a. Particle, gas, vapor and dust limits between interfaces.
b. Restrictions on particle, gas, vapor and dust in the hardware's field of view to control.
c. Limitation of energy factors (ultraviolet and ionizing radiation, atomic oxygen, etc.) that affectcontaminant deposition and reduce performance.

4.1.5 Examination and performance confirmation of contamination control program
In order to prove that the status is recorded, appropriate activities are planned and performed,
and achieved as required, the contamination control program shall be reported to the project review
board for confirmation of implementation. A comprehensive project management plan, or
contamination control plan, shall describe when and how contamination control activities arereviewed. The scope of review by the requester of the application of this Standard shall be
determined through consultation.

4.2 Management at design phase
4.2.1 Identification of sensitive hardware
Sensitive hardware that should be adequately protected shall be identified among thecontaminants, their sources and the contaminated targets affected by them throughout the entire
period from spacecraft manufacturing to the end of the mission.
4.2.2 Identification of process control parameters by process FMEA
By performing FMEA in the manufacturing process, parameters that affect the cleanliness of
sensitive hardware shall be identified as process control items.

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JMR-010A(E)
4.2.3 Properties, impacts and profiles of contaminants
The following for contaminants shall be identified.
(1) Properties of contaminants that can degrade performance due to particle, molecular, or
biocontamination throughout all phases of ground and in-orbit operations for sensitive hardware.
(2) Impact of contaminants on sensitive hardware through similar spacecraft and similar
operational experience and data obtained in field trials. These should be confirmed in the earlyphase of the project.

4.2.3.1 Typical contamination source
Typical contamination sources (including the re-emission of condensed contaminants) include thefollowings.
(1) Contamination source on the grounda. Molecular contamination(i) Atmospheric component gas, water vapor(ii) Gas generated from organic materials (monomers, plastics, adhesive paints, solvents, etc.)(iii) Steam from test equipment (vacuum pump oil mist, etc.)(iv) Detergent and masking tape residues(v) Machine oil and lubricant for moving parts of machines(vi) Flux at solder joint(vii) Human body of personnel (cosmetics, sebum, etc.)(viii) Leakage from pressurized units(ix) Packing materialb. Particulate contamination(i) Atmospheric dust, sand, exhaust fumes, micro-organisms(ii) Human body of personnel (dandruff, red, etc.)(iii) Chips and burrs on machined surfaces(iv) Solder droplets, solder balls, wire chips, welding spatter(v) Powder remaining in the process of removing the oxide film due to defective shield gas
during welding(vi) Foreign matter mixed in when releasing vacuum such as EBW (electron beam welding)(vii) Coating piece peeled off from the coated surface(viii) Residual foreign matter due to poor cleaning(ix) Disperses from packaging materials during transportation(x) Grains generated in the test equipment(xi) Grains from tools and fixtures during work
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JMR-010A(E)(2) Contamination source at launch and in orbit
a. Molecular contamination(i) Sublimation and outgassing from spacecraft (including adhesives), reaction products ofspacecraft surface materials with atomic oxygen(ii) Plume from propulsion system(iii) Leakage fluid during fluid QD (quick disconnector) operation(iv) Leakage and dump of liquids and gases (refrigerant, propellant, experimental exhaust,
airlock exhaust, exhaust from life maintenance system, etc.)(v) Leakage from pressurized units(vi) Outgassing from vent holes on MLI, components, honeycomb panels, etc.
b. Particulate contamination(i) Fine particle nozzle material caused by the injection of propulsion system(ii) Solid propellant combustion slag(iii) Fine particles from a spacecraft generated by the influence of the space environment(reaction products of spacecraft surface materials and atomic oxygen, ejectors, etc.)(iv) Plume from propulsion system(v) What is generated from the unfolded object at the time of unfolding(vi) Products generated from moving parts such as mechanisms and motors

4.2.3.2 Contamination profile
In the contamination control plan, the conditions related to contamination in each phase of ground,launch and in-orbit operations (this includes cleanliness, pressure, humidity, temperature, cleaning
work, equipment outline, etc.) shall be proposed as a contamination profile and maintained
throughout development.

4.2.3.3 Impact of contamination on performance
By clarifying the correlation between contamination and performance degradation, the limit valueof contaminants allowed for sensitive hardware shall be determined. The value of cleanliness
requirements shall be estimated early and further refined through performance analysis.

4.2.4 Contamination prediction
Analysis of the movement and deposition of contaminants in all phases of ground and orbital
operations shall be done. When the cleanliness exceeds the specifications requirements, protective
measures shall be taken. The parameters required for predictive analysis are view factor, outgassing
16

JMR-010A(E)behavior of suitable materials, condensation behavior and significant surface temperature,outgassing temperature, surface reflection, scattering interaction in neutral atmosphere, electricalinteractions with surrounding space plasmas, surface interactions with space radiation, especially
incident ultraviolet photons, etc.

4.2.5 Contamination budget
Contamination budgets for both particulate and molecular forms shall be determined based oncontamination profiles and cleanliness requirement specification of the hardware. Contaminationbudgets shall take into account not only the results of predictive analysis, exposure time and use ofprotective covers but also the possibility of restoring cleanliness between ground and orbital
operations. Cleaning methods and methods for maintaining cleanliness shall be consideredthroughout all phases of the project. The budget shall include BOL and EOL cleanliness.

4.2.6 Design considering cleanliness
By establishing methods for maintaining the cleanliness of sensitive hardware, reducing sensitivity
to contamination, and facilitating cleaning, outline of the design considering cleanliness shall be
described in the contamination control plan. Also, that process shall be included in the contamination
control plan.
The following items shall be discussed, and necessary measures shall be taken based on thecleanliness requirement specifications and contamination budget.
(1) Orientation and location of sensitive hardware(2) Reduction of outgassing materials use(3) Application of exhaust vents, baffles and shields(4) Temperature control of outgassing generating hardware(5) Cleaning process design(6) Sealing of contamination sources(7) Baking(8) Human metabolism, waste treatment(9) Other methods to prevent contaminants from being generated, left behind, or brought in
Ground support equipment located at a close distance or in contact with a spacecraft in the room
shall not contaminate the spacecraft. For the cleanliness of the part that directly interfaces with thespacecraft, the cleanliness specified for the spacecraft shall be considered. Contamination control
during ground work is described in Section 4.4.

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JMR-010A(E)
4.2.6.1 Configuration
When designing a spacecraft, the layout such as configuration and onboard performance, etc.
shall be designed by considering the following items.
a. Minimization of view factor (identified target to be contaminated, solar paddle, etc.)
b. Component that is susceptible to particulate contamination and component that may cause
particulate contamination.
c. Potential sources of molecular contaminationd. Workability for cleaning, inspection, etc.

4.2.6.2 Contamination prevention
When sensitive hardware contamination by thruster plumes, etc. is unavoidable in orbit, it shallbe protected with plume shields, covers, etc.
In addition, if sensitive hardware contamination is predicted in the ground environment, thesensitive hardware shall be protected by a protective cover, purging with dry clean gas, or either.
4.2.6.3 Decontamination
Sensitive hardware shall be as decontaminated (cleaned or baked) as possible by just before
launch. In addition, component, etc. shall have a function that can bake in order to remove
contamination by condensable volatile substances (especially moisture) of sensitive hardware thatis maintained at a low temperature in orbit. In addition, sufficient operating time shall be secured forthis purpose.

4.2.6.4 Design confirmation
If required, a design that takes cleanliness into consideration shall be included in the normal
design review.
In addition, the review results related to the application of this Standard at the design reviews,
etc. shall be reflected in related documents such as specifications, procedure manuals, and control
criteria.

4.2.7 Material and process selection
Materials and processes shall be selected to meet other functional requirements and minimize
contamination. The basic screening items for materials are outgassing, offgassing, particle
generation, fungal growth, hygroscopicity, brittleness, etc.
For areas where contamination control is required, materials that do not generate dust or peel off
and materials that do not generate particles must be used.
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JMR-010A(E)For materials with questionable properties, it shall be confirmed by testing.

4.2.7.1 Outgassing
Material selection shall be referred to 2.2 in this document. The test method shall be conductedby the test approved by ASTM E 595, ECSS-Q-ST-70-02C or JAXA authorized standard. Materials
with a TML of less than 1.0%, an RML of less than 1.0%, and a CVCM of less than 0.1% aregenerally considered low outgassing materials. These values do not give acceptance criteria formaterial selection. In general, even materials that are considered low outgassing can cause
deterioration of contamination sensitive surfaces. Material selection guidelines based on more
stringent conditions may be required to meet mission and performance requirements. The material
should be selected in consideration of the operating temperature, mass and surface area.
[Conditions that increase the risk of contamination]
When used under the following conditions, even materials with low outgassing can cause
contamination.
- Close to or in sight of contamination sensitive surfaces- Used near the cold surface or is in the field of view from the cold surface.
- The amount used is larger.
- Operated at a higher temperature than the surrounding surface.
[Conditions that reduce the risk of contamination]
When used under the following conditions, the effects of contamination will be small even formaterials with a large amount of outgassing.
- Far from or out of sight of contamination sensitive surfaces- Far from the cold surface or out of sight- The amount used is small.
- Operated at a lower temperature than the surrounding surface.
WVR may be subtracted from TML in consideration of the performance requirements of the spacesystem, the application of materials, and the functional requirements of the spacecraft (refer to4.2.7.4). The validity of material selection is verified by contamination analysis (refer to 4.2.5).
Materials that do not meet the material selection guidelines can also be used as long as thepredicted contamination level meets the contamination budget. (refer to 4.2.4, 4.2.5)
Note: Long-term total outgassing emissions based on ASTM E 1559 (Applicable Document (21))
or equivalent outgassing rate testing can be applied to material selection guidelines.

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JMR-010A(E)
4.2.7.2 Total mass loss ratio of moisturized material
Some materials may contain a large amount of adsorbed water that contributes to the total massloss ratio (TML). When the water vapor emitted as outgassing is not critical to sensitive hardware,
the recovered mass loss (RML), which is the total mass loss (TML) minus the outgassing moisture,
is used instead of the total mass loss (TML). The recovered mass loss (RML) is given by thefollowing equation. The WVR in the formula represents the "water vapor regained".
RML = TML - WVR

4.2.7.3 Metal material
Since metal material becomes a source of outgassing and particles due to corrosion, corrosionresistant material shall be used, or appropriate surface treatment and anticorrosion treatment bycoating shall be done. In addition, since the combination of dissimilar metals is also involved in
the occurrence of corrosion, in principle, appropriate combination according to MIL-STD-889 shallbe made. Of the metal materials, osmium and silver react with atomic oxygen and oxidize. Since
silver oxide may peel off and cause particulate contamination, it shall be applied appropriate
surface treatment, anticorrosion treatment such as coating, etc. and not exposed to the surface.

4.2.7.4 Non-metal material
Non-metallic materials shall be listed without omission. The list shall include the total mass loss
(TML), collected volatile condensable material (CVCM), amount used, place of use, etc. However,when there is a request of each project regarding the scope and contents of the list, it shall befollowed the request. For non-metal materials, materials with as little outgassing and offgassing
as possible shall be selected. Using organic materials that induce the growth of bacteria and moldshall be avoided as much as possible.

4.2.7.5 Fluid
For the fluid used for the propulsion system, cooling system, hydraulic/pneumatic system, etc. ofthe spacecraft, fluid whose cleanliness is controlled by official standards such as ISO 15859 shallbe selected.

4.2.7.6 Process
All processes and control methods that affect cleanliness shall be identified. For criticalprocesses, it shall be based on individual project management requirements. For parts used for
assembly, they shall be removed particulate contamination to the level of visibly clean in advance.
20

JMR-010A(E)In addition, parts and materials used for systems or components where outgassing is critical shallbe baked according to the contamination control plan. These cleanliness by inspection shall bechecked before assembling or bringing them into a clean area.

4.2.7.7 Quality control
Appropriate quality control processes shall be maintained to verify the properties of the material.
The processes and compositions of commercial materials may not be well controlled to meet therequirements of space systems. The specifications of the quality control process shall be
determined on a case-by-case basis. ASTM E 595 or ECSS-Q-70-02 can be used as a quality
control test for the outgassing properties of a material.

4.3 Biocontamination
4.3.1 Overview
The organisms that cause biocontamination are fungi, yeast, viruses and bacteria. They breed
both on the ground and in flight, producing contaminants. They also enter on the ground during
manufacturing, integration and testing, as well as during transportation and operation. Human
excrement and metabolites accelerate the growth of micro-organisms through the intervention ofwater or nutrient sources. Hardware cleanliness requirements can be applied to dead organisms,
by-products as chemicals and particles, and living organisms as well as metabolites from theorganisms. In addition, it is necessary to take measures in the clean room of the range because
there is a possibility of invasion of birds and insects.

4.3.2 Hardware contamination by micro-organisms(1) Micro-organisms produce substances through metabolic and/or biological activity. These
substances cause hardware contamination or corrosion.
(2) Preventative measure against micro-organism contamination is to eliminate water and nutrient
sources. It is difficult to prevent the growth of micro-organisms, especially in a room with an air
circulation device, but countermeasures include installing a high-performance filter and efficientcleaning. Also, designing hardware that can be easily cleaned is an important countermeasure.

4.3.3 Handling of sterilized hardware(1) The sterilization procedure shall include the following procedures in a way that meets thecleanliness requirements of the hardware.
a. Procedures to avoid contact with contaminated material
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JMR-010A(E)b. Procedures for avoiding contact between air and biological aerosols in purge gas
c. Procedures to avoid contact with personnel(2) The ground handling process shall be planned to meet the sterilization requirements of the
hardware. This shall include maintaining a sterilized environment such as sterilized packaging,sterilized isolation and sterile rooms. Refer to ISO 14698-1 for details. In addition, the procedure thatmeets the hardware requirements shall be included in the contamination control plan or referred.
(3) In ground operations, it shall be monitored to ensure that the cleanliness of the hardware and theenvironment meet the requirements. Refer to ISO 14698-2 for explanation and evaluation of
biocontamination data and ISO 14698-3 for measuring efficiency of cleaning and sterilization
processes.
(4) Personnel clothing shall be considered to protect personnel from dangerous contaminants andprevent personnel from contaminating hardware.

4.3.4 Planetary protection
Refer to Chapter 4, Management Requirements, Chapter 5, Technical Requirements, andAppendix A. (Applicable) Project Planetary Protection Requirements of, "Planetary Protection
Program Standards (JMR-014) ".

4.4 Contamination control during ground works
4.4.1 Education and training of personnel
Personnel who handle sensitive hardware shall be educated and trained according to theprocedures confirmed in advance for each contamination control plan. Refer to Section 4.3
Personnel and Annex C Personnel of ISO 14644-5: 2004 for additional information on personnel.

4.4.2 Clean room selection and cleanliness control(1) Appropriate environment for manufacturing, assembling, integrating and testing the hardware
shall be selected based on the contamination budget in Section 4.2.5.
a. Clean rooms shall be selected based on hardware cleanliness requirements, operatingprocedures and exposure time.
b. The permissible concentration of particles suspended in the air shall be specified in the air
quality class in accordance with ISO 14644-1.
c. Operation and hibernate procedures shall be specified to meet hardware cleanliness
requirements.
d. In order to meet the cleanliness requirements of the hardware, a clean booth or the like speciallycontrolled for cleanliness should be provided in the clean room as needed.
22

JMR-010A(E)e. Monitoring of contaminants floating in the air and on the surface while the clean room is inoperation shall be defined in consideration of spacecraft performance requirements and risks /costs.
f. Materials, parts, hardware and test equipment brought into the clean room shall meet thecleanliness requirements of spacecraft hardware.
(2) In the contamination control plan, taking into account facility failures such as clean room power
down, cooling water and component damage, appropriate operating procedures to prevent
spacecraft damage shall be clarified with considering risks/costs. Also, single failure mechanisms
including human error shall be analyzed and eliminated.
(3) Clean room facility shall be operated according to procedures including cleaning, clean room
management, cleanliness monitoring, and equipment maintenance. The clean room shall be cleaned
to meet the cleanliness requirements of the spacecraft.
(4) ISO 14644-4 shall be referred to for the design, construction and start-up of the clean room, andISO 14644-5 shall be referred to for the operation as supplementary information.

4.4.3 Garments (clothing for clean room)
4.4.3.1 General
The main purpose of wearing garments is to prevent contaminants produced by personnel fromreaching the product and to protect personnel from harmful substances.

4.4.3.2 Selection of garments(1) Based on hardware cleanliness requirements, clean room airflow schemes and staffing for the
hardware, a frock coat type usually with a cover-all type with a hood and high-top shoe cover (boots),or with a partial head cover and shoe cover shall be selected. However, the frock coat type has anopen lower part, and there is a higher risk of causing particle accumulation on the floor and hardware
surface and deterioration of air quality than the coverall type, it shall be not recommended whenworking on hardware or when hardware cleanliness requirements are strict.
(2) Good antistatic properties, breathability, moisture permeability, dust resistance, abrasion
characteristics and low dust generation properties shall be had. It also shall have high resistance towashing and dry cleaning.

4.4.3.3 Other(1) Clean the garments regularly or when it gets dirty. It is desirable to set the cleaning frequency inthe contamination control plan for each project.

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JMR-010A(E)(2) Additional Information
Refer to Section 4.2 of ISO14644-5: 2004 and Appendix B for additional information on theselection and use of garments.

4.4.4 Management of facility, ground support equipment, materials and auxiliary materials
4.4.4.1 Management of facility, ground support equipment, tools, etc.
Facility equipment, ground support equipment, tools, etc. used for work in the clean area shallnot contaminate the environment of the clean area and sensitive hardware. The management offacility equipment, ground support equipment, tools, etc. is basically the management ofcontamination sources.
When using facility equipment, ground support equipment, tools, etc., necessary maintenanceshall be performed before use and cleaning shall be performed if there is dirt so that the work
environment and the object to be contaminated are not contaminated.
The connection surface that comes into direct contact with the contaminated object shall becleaned in advance and protective measures shall be taken to prevent the contaminated object frombecoming contaminated.
If the outer surface cannot be kept clean, cover or seal the entire surface with a sheet that does
not generate contaminants as much as possible, and take protective measures so as not to
contaminate the work environment in the clean room. Facilities used to handle sensitive hardware
will be managed so that the hardware can be maintained at the specified cleanliness by taking
necessary measures including prevention of contamination by contaminants scattered by the airflow
from the fan. In facilities where sensitive hardware is tested, install a witness plate, etc. as necessary
to monitor the cleanliness of the environment in which the equipment is exposed.

4.4.4.2 Gas control
The cleanliness of gas is expressed by the amount of impurities. The purge gas used for rocket
fairing, vacuum equipment, containers, etc. shall be confirmed in advance that the vapor of particles
and organic substances is equivalent to that of clean air. And so as not to reduce the cleanliness ofthe product, gas shall be controlled by analyzing it as necessary before filling the machine at thetime of acceptance that it satisfies the specified purity and impurities (particles, moisture, etc.)
requirements.

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JMR-010A(E)
4.4.4.3 Liquid control
Liquids used in spacecraft include propellants (oxygen, hydrogen, dinitrogen tetroxide,
monomethylhydrazine, hydrazine, kerosine, etc.), pseudo-propellants, hydraulic oils, drinking waterin manned systems, sanitary water, cooling water, etc. So as not to reduce the cleanliness of the
product, they shall be controlled to meet the specified purity and impurity (particles, hydrocarbons,
moisture, etc.) requirements at the time of acceptance, transfer to the storage tank, and before filling
into the spacecraft, by analysis as necessary.
So as not to reduce the cleanliness of the product, the cleaning agent used for the final cleaning
shall be controlled by analysis to satisfy the specified requirements of particles and non-volatile
residue (NVR) at the time of receiving the cleaning agent l and during use at an appropriate
frequency.

4.4.5 Cleanliness monitor for flight hardware and its vicinity
Cleanliness shall be measured and recorded at the methods and intervals determined inaccordance with the contamination control plan. Requirements for monitoring suspended particle
concentrations in clean rooms are contained in ISO 14644-2. Additional measurement methods aredescribed in ISO 14644-3.

4.4.5.1 Measurement of surface cleanliness(1) Measurement of molecular contamination
Methods for measuring molecular contamination include mass method, quartz crystal
microbalance (QCM), calorie method, photoelectron spectroscopy, infrared spectroscopy, and thelike. When applying, the one that suits the purpose shall be selected based on the characteristics ofeach method.
(2) Measurement of particulate contamination
Methods for measuring particulate contamination include visual inspection, optical measurement(for example, microscope, light scattering method) and the like. When applying, the one that suits
the purpose shall be selected based on the characteristics of each method.

4.4.5.2 Air quality measurement
Methods for measuring air quality include a film filter sampling method, a light scattering method,a dark field photography method, and the like. When applying, the one that suits the purpose shallbe selected based on the characteristics of each method.
25

JMR-010A(E)

4.4.5.3 Gas cleanliness measurement
A film filter sampling, a light scattering method, or the like is used for measuring the particles,
and a moisture meter or a dew point meter is used for measuring the water concentration. Whenmeasuring impurity gas and organic vapor, infrared spectrophotometer, gas chromatograph, mass
spectrometer, or a combination thereof shall be used as necessary. The purity of the gas shall be
confirmed by the manufacturer's inspection report at the time of purchase and regularly inspected.

4.4.5.4 Liquid cleanliness measurement
Measurementof

propulsion

agents(oxygen,hydrogen,dinitrogentetroxide,

monomethylhydrazine, hydrazine, kerosine, etc.), pseudo-propellants, hydraulic oils, drinking water,
sanitary water and cooling water in manned systems, and particles of cleaning agents (IPA,
deionized water, etc.), are conducted by membrane filter sampling, light scattering method, or the
like. The non-volatile residue is measured by the mass method. Free water is visually inspected.
The resistivity, dissolved oxygen and other dissolved gases, total organic carbon, water, pH andviscosity shall be analyzed using dedicated analyzers.

4.4.5.5 Evaluation of data error and accuracy
Since the measurement of cleanliness deals with a very small amount of physical quantity,
sufficient evaluation shall be made for measurement error and analysis accuracy.

4.4.5.6 Statistical analysis of data
For measurement data of particle number, when the cleanliness is near the borderline of therequired value, it shall be analyzed by a statistical method. This is not the case when it is significantly
better than the requirement.

4.4.6 Flight hardware control
Contamination control shall be conducted to meet hardware cleanliness requirements andcontamination budgets. ISO 14952, especially ISO 14952-3, which determines cleanliness, isapplied to fluids. The following items shall be specified in the contamination control plan.
(1) Check that the cleanliness of the surrounding environment is within the permissible range bymonitoring.
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JMR-010A(E)(2) Procedures for dealing with sensitive hardware in uncontrolled areas.

(3) Contamination prevention measures for sensitive hardware such as thermal control surfaces,
optical system equipment, solar cell panels and subsystems composed of them (implementationof whole or partial nitrogen gas purging, installation of dustproof covers, etc.).
(4) Washing/cleaning procedure
Clarify the cleaning / cleaning procedure, method, frequency, and cleaning agent, including theskills, precautions, cloth, equipment, equipment specifications, and timing of use, which arenecessary to satisfy the cleanliness requirements.
For cleanliness and cleanliness inspection after cleaning, the requirements of ISO 14952-2 shallapply. Cleaning and cleaning procedures when sensitive hardware is contaminated.
(5) Baking
Baking of flight hardware is effective in reducing outgassing rates and potential contaminants.
Bakeout is performed in a vacuum or in a flow controlled gas environment such as clean and dry
gaseous nitrogen. Not all baking procedures are equivalent in terms of results. Engineering analysis
and judgment shall be used to select a bakeout procedure that is cost effective and meets system
performance requirements. Baking can be performed component-by-component at all levels of
hardware assembly, depending on analysis and system performance requirements. When there isa hardware that is sensitive to the bakeout object, special care should be taken to prevent crosscontamination.
Assigning conditions such as the level of vacuum, pressure of fluidized gas, temperature, time,
monitoring method, etc., the baking procedure is specified in the contamination control plan asnecessary.
(6) Purge
Clean gas can be used to purge flight hardware to keep contaminants out of critical components.
Clean nitrogen, helium, argon and air are used. Consider safety. ISO 15859-3, 15859-4 and ISO
15859-9 can be applied. Additional filtration may be required during use to meet cleanliness
requirements. The purge gas requirement, purge time and permissible non-purge time should be
included in the applicable CCCP.
(7) Clarify the range of systems that require contamination management.
For equipment that handles fluids such as propulsion systems that require cleanliness of theinternal area, it is stipulated that the cleanliness of the filled fluid should be inspected at the27

JMR-010A(E)connection port as necessary before and after the fluid filling work.
Procedures for confirming that the cleanliness requirements are met, guaranteeing the cleanlinessof the equipment used during filling work, and filter specifications.

4.4.6.1 Contamination prevention for each phase(1) Parts manufacturing phase
Unless otherwise specified, parts shall be manufactured in a conventional industrial area or acontrolled work area. When there are provisions that require cleaning during manufacturing, it shallbe complied with the regulations. It shall be made sure that the parts to be sealed are in a visibly
clean before the sealing process.
After completing the parts and before transferring them to the storage or assembly area, it shallbe checked that they are clean after removing particulate contamination such as solder aids, oil,grease and work debris. When storing parts, they shall be sealed and protected with approved
packaging.
(2) Component assembly/testing phase
Unless otherwise specified, component assembly and testing shall be performed in anenvironment that meets the requirements of Section 4.4.2. However, this does not apply when target
range of contamination control is a sealed device.
Care shall be taken during the thermal vacuum test as there is a high risk of molecular
contamination.
The outside of the packaging shall be cleaned before bringing it into the front room of a cleanroom. For sealed packaging, the packaging (double packaging is only on the outside) shall be
removed in the anterior chamber before carrying in.
Equipment shall be covered and protected when not assembled or tested.
(3) Subsystem/system assembly/testing phase
Subsystem/system assembly and testing shall be performed in a clean area controlled by the
specified air quality.
Areas that are susceptible to contamination shall be protected with a cover, etc.
Care shall be taken during the thermal vacuum test as there is a high risk of molecular
contamination.
Also, any work that generates contaminants, such as cutting or using lubricating oil shall not be
performed. When implementing it, it shall be made sure that it does not affect others. Particles, oils
and fats that have adhered during assembly shall be made sure to remove.
The outer surface of harnesses, equipment, etc. mounted inside the spacecraft shall beinspected and cleaned before the spacecraft is closed out.
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JMR-010A(E)(4) Launch range phase
The following items shall be specified in the contamination control request.
a. Air conditioning requirements in the fairing when storing the spacecraft in the fairing and moving
it.
b. Regulations on when to remove the dust cover and/or when to stop the nitrogen gas purge
before launch.
c. For flight hardware with sensitive surfaces such as thermal control surfaces, optical system,and solar cell panels, cleaning regulations of final visual inspection before launch and whencontamination is found.

4.4.7Packing, transportation and storage
Regarding packaging, transportation, and storage, it shall be stipulated in the contamination
control plan and included at least the following items.
。

4.4.7.1 Packing
Packaging is used to protect the hardware during storage and transportation. Packaging materials
shall not increase hardware contamination and contain volatile or mobile contaminants. The
packaging material is desirable as an antistatic material because it prevents the adhesion ofparticulate contamination due to charging.

4.4.7.2 Storage
Proper contamination protection of packages and products shall be done during the intended
storage period at the storage location.

4.4.7.3 Transportation
Containers shall be used during transportation. The material of the container shall be selected inconsideration of volatility, contaminants of concern, transportation method and transportation
environment.

4.5 Launch and operational phase
In the contamination control plan, after identifying the spacecraft operations that lead to theoccurrence of contamination in launch and on-orbit, appropriate management such as temperature
29

JMR-010A(E)control and baking shall be specified.

4.6 Product assurance
Complying with the contamination control plan, quality assurance activities to maintain andguarantee the cleanliness required for systems and components shall be performed. For this quality
assurance activity, JMR-005 (Quality Assurance Program Standard) or JMR-013 (Quality Program
Standard (Basic Requirement JIS Q 9100)) is applied.
5 DETAILED REQUIREMENTS
Not applicable.

30