Call for Papers
Abstract Due

June 11, 2021

2021 7th International Workshop on Low Temperature Bondingfor 3D Integration(LTB-3D 2021, WaferBond 2021 East)
Oct. 5-7, 2021 in Nara-city, Japan
Sponsored byGeneral Incorporated Non-profit Association - Institute for Advanced Micro-System Integration (IMSI)Technically Co-sponsored by

The Electrochemical Society (to be confirmed)
IEEE Electronics Packaging Society Japan Chapter (to be confirmed)
Endorsed by

The Japan Society of Applied Physics (JSAP)2021 7th International Workshop on Low Temperature
Bonding for 3D Integration (LTB-3D 2021) will be held from
5-7, Oct. 2021 in Nara-city, Japan.

l Venue
Nara Kasugano International Forum “IRAKA.”The LTB-3D is a premier conference series sponsored byGeneral Incorporated Non-profit Association - Institute forAdvanced Micro-System Integration (IMSI), technically cosponsored by The Electrochemical Society and The IEEE
EPS Japan Chapter. Preceding LTB-3D workshop was heldin Tokyo, Japan in its 1st (2007), 2nd (2010), 3rd (2012), 4th(2014), and 5th (2017) versions and in Kanazawa in 6th(2019) version. LTB-3D 2021 moves to Nara, an ancientcapital of Japan as WaferBond 2021 EAST in conjunction
with WaferBond conferences which are held in Europe
every two years: 2009 (Grenoble), 2011 (Chemnitz), 2013(Stockholm), 2015 (Braunschweig), 2017 (Leuven), and2019 (Halle/Saale).
This workshop is focusing on the promotion of advanced
research areas related to low-temperature bonding
technologies, including surface activated bonding (SAB),
which realize novel device structure by heterogeneousmaterial and device integration and lead to entirely new
manufacturing approaches to 3D and module integration ofsemiconductor devices, photonics systems, and powerelectronic systems. These bonding technologies have been
already used for the volume production and have potential
applications in wide range of manufacturing industries.
This workshop will be held as a single-track seminar toprovide a compact forum for close and deep discussion of all
aspects of low temperature bonding technologies ¾ thelatest technologies and applications, as well as business
opportunities.
Professor Dr. Naoteru Shigekawa
Osaka City University
Steering Committee Chair
Professor Dr. Tadatomo Suga
Meisei University / The University of Tokyo
IMSIIEEE EPS Japan Chapter
Lead Organizer, International Organizing Committeel Access to Naral Scope•••••••••

Roles of Low-temperature Bonding in 3D and HeteroIntegration
Surface Activated Bonding (SAB) and its Extensions
Hydrophilic and Plasma-assisted Bonding
Metal and Hybrid Bonding
New process for Low-temperature Bonding
Power, RF, Photonic, and MEMS device Applications
New Applications of Low-temperature Bonding
Fundamentals and characterization
Equipment and Quality Assessmentsl Important Date
Abstract submission deadline
June 11th, 2021
Acceptance/Rejection notification
July 16th, 2021
Final manuscript and presentation material deadline
Aug. 13th, 2021
ConferenceOct. 5th–7th, 2021

l Satellite Workshop
Satellite Workshop composed of invited seminars will also
be arranged online after LTB-3D 2021 so as to discuss hottopics and current trends in low temperature bonding.

l JJAP Special Issue
Special Issue of Japanese Journal of Applied Physics will
be published as journal related to LTB-3D 2021 andSatellite Workshop.
l For further information, get in touch withhttps://imsi.jp/ltb3d/ltb3d-2021/index.html