Second Call for Papers
13th US-Japan Conference on Composite Materials
June 6-7, 2008, Surugadai Campus, Nihon University, Tokyo, Japan
Sponsored by Japan Society for Composite Materials (JSCM)
Co-sponsored by American Society for Composites (ASC)The collaboration between US and Japan in composite materials and structures has been very successful bothacademically as well as commercially, including recent Boeing-Japan partnership in the 787 development.
Following a long tradition of US-Japan Conference, we are now emphasizing the present cutting edge
technology topics to promote more lively discussion. The following Special Sessions are being planned:(1) Nanocomposites: Modeling and Reality(2) Multiscale Modeling(3) Multifunctional Composites(4) Increased Fidelity in Composites Analysis and Design(5) Composite Affordability and Certification(6) Composite Durability(7) Structural Health Monitoring and Nondestructive Evaluation
Carbon nanotube
General sessions are also planned on the following topics of interest:
Materials: Resin, Reinforcements and Preform, Textile Composites, Interface
50µmand Interphase, Metal Matrix Composites, Ceramic Matrix Composites,
Thermoplastic Matrix Composites, Bio-composites
Manufacturing: RTM, VaRTM, Filament Winding, Prepreg, Pultrusion,Compression Molding, Curing Studies, Forming
Property: Test Methods, Impact, Energy Absorption, Fatigue, Creep,Embedded optical fiber in composites
Vibration & Damping
Mechanics: Micromechanics, Modeling, Damage Mechanics, Design and Optimization, Joints
Application: Aircraft, Space, Automobile, Marine, Sports, Infrastructure, Energy, Electronics
Life Cycle Assessment: Environmental Impact, Life Cycle Costing, Recycling

Conference Chairpersons
Prof. Nobuo Takeda, University of Tokyo, Tokyo, Japan
Prof. R. Byron Pipes, Purdue University, West Lafayette, IN, USA
Abstract Submission
Abstracts (500-800 words) should be submitted electronically at usjapan2008@smart.k.u-tokyo.ac.jp.

Important Dates
 January 10, 2008
 February 1, 2008
 March 10, 2008

(Extended) Deadline for abstract submission(Extended) Notification of abstract acceptance(Extended) Deadline for manuscript submission

Registration Fees
Regular Fees: 30,000 Japanese Yen
Student Fees: 20,000 Japanese Yen
The registration fee covers the symposium participation, a program, a CD-ROM Proceeding, coffee breaks, anda banquet ticket (on June 6 evening). Payment of the registration fee can be made by Credit Card. Please see
our website for the details.
Location
The conference is held at Surugadai campus of College of Science and Technology, Nihon University.
(http://www.cst.nihon-u.ac.jp/english/life/c_map.html) The conference venue is just three minutes’ walk from
JR Ochanomizu station, which is close to JR Tokyo station. List of recommended accommodation will
provided in the website.
List of travel agents
http://travel.rakuten.co.jp/en/
http://www.nta.co.jp/english/
http://www.knt.co.jp/kokusai/index.html
Conference website www.smart.k.u-tokyo.ac.jp/usjapan2008
Contact e-mail address: takeda@smart.k.u-tokyo.ac.jp (Prof. Nobuo Takeda)（日本複合材料学会会員の皆様）
申し込み締め切りは、１月１０日とさせていただいておりますが、発表をご希望の方は是非、武田（takeda@smart.k.u-tokyo.ac.jp）までお問い合わせください。日米の発表論文のバランスを考慮し、１月末日までは追加論文も受け付ける予定です。
登録料は予め、郵便振込みしていただく（詳細は website 参照）予定です。なお、２００８年６月５日（木）に東京大学山上会館にて開催される、日本複合材料学会２００８年度研究発表講演会にもご出席の方が、本会議にもご参加いただき、かつ、４月３０日までに振込みを行っていただいた場合には、登録料を割り引かせていただき、Regular Fees: 27,000 Japanese Yen、StudentFees: 18,000 Japanese Yen とさせていただきます。