WAFER-TGL
3.5" SBC with 10nm 11th Gen. Intel® Tiger LakeUP3 Core™ i7/i5/i3 and Celeron® on-board SoC withHDMI, DP, iDPM, triple 2.5 GbE LAN , USB 3.2 Gen 2,M.2, SATA 6Gb/s, COM, iAUDIO, 0°C ~60°C and RoHS

260-pin 3200 MHz DDR4 SO-DIMMs
support up to 32 GB

M.2 B key (3052/2042) +12V DC

2 x RS-232/422/485
1 x RS-232

4 x USB 3.2 Gen 2

2 x USB 2.0

iAUDIOiDPM Support eDP to eDP/ SATA 6Gb/s
LVDS/VGA Module

M.2 A key (2230)

DDR43200

IEI has developed a highly efficient thermal solution for the 3.5"
motherboard - IEI Heat Conduction Casing (IHCC). With its welldesign structure, the IHCC can effectively improve heat transfer
performance and cut time-to-market.
Completely joint with CPU for better heat transfer in 0ºC~60ºC
operating temperature with the active cooling (PN:CM-WAFERWF-R10), and in 0°C~45°C operating temperature with the passivecooling (PN:CM-WAFER-WOF-R10).

iDPM

3 x 2.5GbE LAN

M.2

2 x HDMI

2.5GbELANDP

SATA 6Gb/s

Support Intel® Tiger Lake-UP3 Processors
Equipped with 11th Gen. Intel® Core™ i7/i5/i3,Celeron® UP3 processor, the KINO-TGL features highController
Two Gigabit RJ45 network ports are provided via Intel®
I225V 2.5GbE network controller to achieve up to 2.5GbE
network transmission rate.

IEI Heat Conduction
Casing (IHCC)

The DRPC-W-TGL-R10 is a compact embedded system anddesigned for 3.5" single board computers . With the two-dimensional
heat conduction and low wind resistance design on the surfaced
which means you don’t need extra thermal solution to form the heat
reduced production cost resulting from shortening manufacturingtime .Furthermore, the height of aluminum extrusion can therefore be
downsized to make the product light weight.

WAFER-TGL-2022-V11

The design of the motherboard is based on USB 3.2
protocol. Four USB 3.2 Gen 2 (10Gb/s) are provided
WAFER-TGL also supports two internal USB 2.0 ports
for additional wiring options.

IEI uniquely designs a iDPM interface that can connect
to display modules, enabling users to add LVDS/eDP/
VGA display interface upon requirements.

10-103SOC
11th Gen. Intel® mobile Tiger Lake-UP3 SoCIntel® Core™ i7-1185G7E (up to 4.8GHz, quad-core, 12M Cache, TDP=28/15/12W)
Intel® Core™ i5-1145G7E (up to 4.4GHz, quad-core, 8M Cache, TDP=28/15/12W)
Intel® Core™ i3-1115G4E (up to 4.1GHz, quad-core, 6M Cache, TDP=28/15/12W)
Intel® Celeron® 6305 (up to 1.8GHz, dual-core, 4M Cache, TDP=15W)
BIOS
AMI UEFI BIOS
Memory1 x 260-pin 3200 MHz DDR4 SO-DIMMs support up to 32 GB
Graphics Engine
Intel® Gen11 UHD Graphics
Display Output
Four Independent Displays
2 x HDMI 1.4 (up to 4096 x 2160@30Hz)
1 x DP 1.4 (up to 4096 x 2160 @60Hz)
1 x IEI iDPM 3040 slot (only for IEI eDP/LVDS/VGA module)
Ethernet
LAN1: Intel® I225V 2.5GbE
LAN2: Intel® I225V 2.5GbE
LAN3: Intel® I225V 2.5GbE
External I/O
4 x USB 3.2 Gen 2 (10Gb/s)
Internal I/O
1 x SATA 6Gb/s
2 x USB 2.0 pin header (P=2.0)
2 x RS-232/422/485 (2x5 pin, P=2.0)
1 x RS-232 (2x5 pin, P=2.0)
I²C
1 x I²C (1x4 pin)
Audio
1 x iAUDIO (2x5 pin) supporting IEI AC-KIT-888S kit
Front Panel
1 x Power LED & HDD LED (1x6 pin P=2.0)
1 x Power button (1x2 pin P=2.0)
1 x Reset button (1x2 pin P=2.0)
LAN LED
3 x LAN LED (1x2 pin)
Expansion
1 x M.2 A key for Wi-Fi & BT (2230) (PCIe Gen3 x1/USB 2.0 signal)
1 x M.2 B key (3052/2042) w/ SIM holder (PCIe Gen3 x2/USB 2.0 signal)
Digital I/O
1 x 12-bit digital I/O (2x7pin)
TPMIntel® PTT (TPM 2.0)
Fan Connector
1 x System fan connector (1x4 pin)Power Supply+12V DC input power (AT/ATX mode)
Watchdog TimerSoftware Programmable support 1~255 sec. System reset
Power Consumption
TBD
Operating Temperature
0°C ~ 60°C
Storage Temperature: -20°C ~ 70°C
Operating Humidity: 5% ~95%, non-condensing
Dimension: 146mm x 102mm
Weight: GW: 850g / NW: 350g

Part No.

10-104110

1 x WAFER-TGL-U single board computer

1 x SATA with power cable kit

1 x Power cable for P4

1 x QIG

Description

CB-USB02A-RS

Dual port USB cable with bracket, 300mm, P=2.00

AC-KIT-888S-R10

Realtek ALC888S 7.1 Channel HD Audio peripheral board, RoHS

32205-002700-200-RS

RS-232/422/485, 200mm, P=2.0

CM-WAFER-WF-R10Cooler Module (W/FAN); Mechanical; for 3.5” WAFER series;
RoHS

CM-WAFER-WOF-R10Cooler Module (W/O FAN); Mechanical; for 3.5” WAFER series;
RoHS

iDPM-eDP

eDP to eDP DisplayPort converter board (for IEI iDPM connector)

iDPM-LVD

eDP to LVDS DisplayPort converter board(for IEI iDPM connector)

iDPM-VGAeDP to eDP VGA DisplayPort converter board(for IEI iDP connector)

Part No.

Description

WAFER-TGL-U-C-R103.5" SBC with Intel® Tiger Lake-UP3 Celeron® 6305Proccessor, DDR4 SO-DIMM, 12V DC input, quad display, tripleIntel® 2.5 GbE, SATA, USB 3.2, M.2, SoC, RoHSWAFER-TGL-U-i3-R10

3.5" SBC with Intel® Tiger Lake-UP3 Core™ i3-1115G4E
Proccessor, DDR4 SO-DIMM, 12V DC input, quad display, triple
M.2 A/B key, triple Intel® 2.5 GbE, SATA, USB 3.2, SoC, RoHSWAFER-TGL-U-i5-R10

3.5" SBC with Intel® Tiger Lake-UP3 Core™ i5-1145G7E
Proccessor, DDR4 SO-DIMM, 12V DC input, quad display, triple
M.2 A/B key, triple Intel® 2.5 GbE, SATA, USB 3.2, SoC, RoHSWAFER-TGL-U-i7-R103.5" SBC with Intel® Tiger Lake-UP3 Core™ i7-1185G7E
Proccessor, DDR4 SO-DIMM, 12V DC input, quad display, triple
M.2 A/B key, triple Intel® 2.5 GbE, SATA, USB 3.2, SoC, RoHS

CB-USB02A-RS

AC-KIT-888S-R1032205-002700-200-RS

CM-WAFER-WF-R10

CM-WAFER-WOF-R10iDPM-eDP

iDPM-LVD

iDPM-VGAWAFER-TGL-2022-V11