Technical Whitepaper

MIL-STD-810 Testingfor HP Business PCs
July 2024

Commitment to quality
A product is only as great as its quality. And quality built into the overall product design requires more than just a mixof technologies, best practices, and high standards; it requires a mindset that understands that each design detail is
as important as the next, each potentially a spark of quality innovation.
At HP, we make a quality commitment and stand by it. We follow through with our promises. We believe that we canalways do it better—and then we do. And that belief pushes our quality standards ever higher.
Quality delivers a higher return on investment to our customers. We want them to be happy with their productthroughout its lifecycle.

We care about quality — it’s in our DNA
At HP, we believe quality matters. Quality is core to HP’s legacy. HP’s strong focus on quality design and engineering
innovations dates back to its early beginnings with Bill Hewlett and Dave Packard.
Quality is foremost at every stage of HP’s product development process. From the earliest design stage throughproduct testing, manufacturing, service and support, and eventual end-of-life, we remain alert for new opportunities
to improve our products, services, and customer relationships.

Striking a perfect balance
Our goal is to make our products the highest possible quality with the lowest total cost of ownership. We arefocused on enhancing our customers’ experience with products that deliver the best price, features set, and value
proposition. The HP Business PC portfolio gives customers that perfect balance of cost efficiency, reliability,
durability, and innovative design.
Quality is built into every product as a design requirement. HP Business PCs are designed to meet the demands ofleading businesses. Built from high-quality materials and backed by legendary HP reliability, these stylish and sturdy
devices are powerful yet simple to use.

Performance you can trust
As part of the design process, all HP Elite, HP Pro, Z by HP, HP Chromebooks and select HP Thin Clients undergo the
HP Total Test Process (TTP)1 — an exhaustive series of rigorous tests and validation procedures that demonstratesuperior quality and reliability in a wide range of applications and operating environments. To help make ourbusiness PCs more robust and a more dependable tool for our customers’ evolving business needs, our testingprocess is constantly reviewed and enhanced.

02

The HP Total Test Process is an outgrowth of the longstanding HP commitment to quality. That’s why we go to
extreme measures to build high reliability into every HP Business PC.
Our comprehensive and proven testing program consists of a minimum of 120,000 hours of rigorous multi-tiered
testing and validation procedures per computing platform. The program, driven by rigid quality specifications andstandards, includes 50,000 test steps, with 240 industry-standard hardware and software products tested forcompatibility.
Pre-launch HP Business PCs are exposed to rigorous conditions including harsh drops and vibration, hightemperatures, and enduring mechanical and functional tests that simulate rough handling over the life of the
product. Strong reliability can mean less downtime and a lower cost of ownership.
Knowledge gained through the HP Total Test Process leads to many innovations that allow HP Business PCs todeliver an enhanced computing experience. Customers can rely on HP Business PCs to help them perform at theirvery best when their most demanding work is on the line.

World-class designFirst impressions are important, as they set the expectations for the rest of the user experience. HP design
engineers excel at designing that very important first experience. Clean implementation of innovative PC
technologies starts with a holistic design approach to quality. Design engineers work in conjunction with the
manufacturing engineers to optimize the design for production in a way that upholds extremely high quality.
Any given HP Business PC design will go through multiple small builds to fine-tune the design for optimal quality andmanufacturability before the design is finalized. HP Business PCs are subject to multiple design enhancements
prior to our first-production build, resulting in a final design that is as elegantly built as was originally envisioned by
the design engineer.
HP’s attractive enterprise-class industrial designs, which combine innovation with style, use high-quality materials
and flawless finishes. HP’s leading-edge chassis construction, component accessibility, electrical and air flow
designs elevate the customer experience with product quality and reliability.

Going above and beyond
After careful material selection and precision-engineered construction, HP Business PCs are put to the test.
Our MIL-STD-810 testing2 procedures go above and beyond what a PC may endure on a typical day in business andenterprise environments. This testing helps to demonstrate overall HP product quality and reliability.

03

HP Business PC models tested
All HP Elite, HP Pro, HP Chromebooks, and Z by HP notebooks, convertibles and detachables, as well as selectdesktop PCs and Thin Clients, undergo multiple MIL-STD-810 test procedures as a way to help demonstrate
product quality and reliability. This standard, though created specifically for the U.S. Department of Defense(DoD), is widely used as a benchmark for quality for commercial products in multiple industries. It outlines abroad range of tests that can be tailored to measure the reliability of specific pieces of equipment and includes
multitiered climatic and environmental test methods. 2
The products identified below have all undergone multiple MIL-STD-810 testing procedures.
Click on each category to see test results.

HP ZBook Mobile Workstation

HP EliteOne All-in-one Desktop PC

Tested under 810H:

Tested under 810H:• HP ZBook Fury G10, G11• HP ZBook Power G10 & G10A, G11 & G11A
• HP Zbook Firefly 14 G10 & G10A, G11 & G11A
• HP Zbook Firefly 16 G10, G11• HP ZBook Studio G10, G11• HP EliteOne 840/870 G9 All-in-One

HP Z Desktop Workstation
Tested under 810H:• HP Z1 Tower G9• HP Z2 Tower G9 Workstation• HP Z2 Small Form Factor G9 Workstation• HP Z2 Mini G9 Workstation• HP Z4/Z6/Z8/Z8 Fury G5 Workstation• HP Z6 A G5 Workstation

HP Pro and ProOne All-in-One Desktop PC
Tested under 810H:• HP Pro Mini/SFF 400 G9• HP Pro Tower 400/480 G9• HP ProOne 440 G9 All-in-One

HP Dragonfly Notebook PC
Tested under 810H:• HP Dragonfly G2• HP Elite Dragonfly 13.5 inch G4

HP EliteDesk Desktop PC
Tested under 810H:• HP EliteDesk 805 G8 DM• HP Elite Mini/SFF 600/800 G9• HP Elite Tower 600/680/800/880 G9Technical Whitepaper04

HP Elite Convertible Notebook PC
Tested under 810H:• HP Elite x2 G8• HP EliteBook x360 830 G9, G10, G11• HP Elite x360 1040 G9,G10, G11 2-in-1

HP EliteBook Notebook PC
Tested under 810H:• HP EliteBook 630/640/645/650 G9• HP EliteBook 630/640/645/650/655 G10• HP EliteBook 630/635 Aero 640/645/660/665, G11• HP EliteBook 830/840/860 G9, G10, G11• HP EliteBook 835/845/865 G9, G10, G11• HP EliteBook 1040 G9, G10, G11• HP EliteBook Ultra G1q AI PC

HP ProBook & Fortis Convertible PC

HP Chromebook Convertible
Tested under 810H:• HP Chromebook x360 11 G4 EE• HP Chromebook Enterprise x360 11 G4• HP Fortis x360 11” G3 J Chromebook• HP Fortis x360 11” G5 Chromebook• HP Fortis x360 11” G5 Chromebook Enterprise

HP Fortis, Chromebook & Chromebook
Enterprise
Tested under 810H:• HP Chromebook 14 G7• HP Chromebook Enterprise 14 G7• HP Fortis 14” G10, G11 Chromebook• HP Fortis 14” G10, G11 Chromebook Enterprise• HP Fortis 11” G9 Q Chromebook• HP Fortis 11” G9 Q Chromebook Enterprise

Tested under 810G:• HP Fortis 11” G10 Chromebook• HP ProBook x360 440 G1• HP ProBook x360 11 G1, G2 EE• HP ProBook x360 11 G3, G4 EE• HP Elite Dragonfly 13.5 inch Chromebook Enterprise

Tested under 810H:• HP ProBook x360 11 G5 EE• HP ProBook x360 435 G8, G9, G10• HP Pro x360 Fortis 11” G10, G11

HP ProBook Notebook PC
Tested under 810H:• HP ProBook Fortis 14” G9, G10• HP ProBook 440/445/450/455 G9, G10• HP ProBook 440/445/460/465 G9, G11

HP Thin Client
Tested under 810H:• HP Fortis 11” G10 Chromebook Enterprise• HP Elite Dragonfly 13.5 inch Chromebook• HP Elite c640 G3 Chromebook Enterprise• HP Elite c640 G3 Chromebook• HP Elite c645 G2 Chromebook Enterprise• HP Elite c645 G2 Chromebook• HP Chromebook 11 G9 EE• HP Chromebook Enterprise 11 G9

HP Retail & Industry Solutions (HP Engage)
Tested under 810G:• HP Engage One All-in-One• HP Engage Flex Pro Retail System• HP Engage Flex Pro-C Retail System• HP Engage One Pro All-in-One• HP Elite mt645 G7, G8 Mobile Thin Client

Tested under 810H:• HP Pro mt440 G3 Mobile Thin Client• HP Engage Go 10 Convertible/Mobile System• HP Elite t655/t755 & HP Pro t550 Thin Client;• HP Engage Go 10 Mobile Dock

HP tz655 Trusted Zero Client• HP Engage Flex Mini Retail System• HP Engage Go 13.5” Mobile System

HP Notebook PC
Tested under 810H:• HP Engage Go 13.5” Convertible System• HP Engage Flex Pro G2 & Pro-C G2 Retail Systems• HP 240/240R/245/246 14 inch G9; 240/245 14 inch G10
Notebook PC• HP 250/250R/255/256 15.6 inch G9; 250/255 15.6 inch G10
Notebook PC• HP ZHAN 14 inch G7 Notebook PC

Technical Whitepaper05

Test results
The following tables summarize the independent third-party MIL-STD-810 test methods2 that HP products passed.
Note: A dash (-) in the Test Results tables indicates that the test was not conducted on the PC model.

HP ZBook Mobile Workstation
HP ZBook
Studio G10; G11

Test
Tested Under
Drop

Back to product listing
HP ZBookFirefly G10 & G10A; G11 & G11AHP ZBook
Fury G10’ G11

HP ZBook Power
G10 & G10A; G11 & G11A

810H

810GH

810H

810H

PassedPassedPassedPassedFunctional Shock

PassedPassedPassedPassedVibration (Category 4)

PassedPassedPassedPassedVibration (Category 5)

PassedPassedPassedPassedVibration (Category 24)

PassedPassedPassedPassed

Dust

PassedPassedPassedPassedHumidity

PassedPassedPassedPassedAltitude (Procedure I)

PassedPassedPassedPassedAltitude (Procedure II)

PassedPassedPassedPassedHigh Temperature (Procedure I)

PassedPassedPassedPassedHigh Temperature (Procedure II)

PassedPassedPassedPassedLow Temperature (Procedure I)

PassedPassedPassedPassedLow Temperature (Procedure II)

PassedPassedPassedPassedTemperature Shock

PassedPassedPassedPassedSand

PassedPassedPassedPassedExplosive Atmosphere

Passed-Passed-Freeze/Thaw

PassedPassedPassedPassedBench Handling Shock

PassedPassedPassedPassedCrash Hazard Shock

PassedPassedPassedPassedTransportation Shock

PassedPassedPassedPassedSolar Radiation

Passed-Passed-HP Z Desktop Workstation
Test

Tested Under

Back to product listing

HP Z4/Z6 G5Workstation

HP Z8/Z8 Fury G5Workstation

HP Z2 Tower G9Workstation

HP Z2 Small Form Factor
G9 Workstation

810H

810H

810H

810H

HP Z1 Tower G9, HP Z2
Mini G9, HP Z6 A G5
Workstation

Drop

PassedPassedPassedPassedFunctional Shock

PassedPassedPassedPassedPassedVibration (Category 4)

PassedPassedPassedPassedPassedPassedPassedPassedPassed

Dust

PassedPassedPassedPassedPassedHumidity

PassedPassedPassedPassedPassedAltitude (Procedure I)

PassedPassedPassedPassedPassedAltitude (Procedure II)

PassedPassedPassedPassedPassedHigh Temperature (Procedure I)

PassedPassedPassedPassedPassedHigh Temperature (Procedure II)

PassedPassedPassedPassedPassedLow Temperature (Procedure I)

PassedPassedPassedPassedPassedLow Temperature (Procedure II)

PassedPassedPassedPassedPassedTemperature Shock

PassedPassed-PassedPassedVibration (Category 24)

Technical Whitepaper06

HP EliteDesk Desktop PC

Back to product listing

Test

HP EliteDesk
DM 805 G8Tested Under
Drop
Functional ShockVibration (Category 4)
Vibration (Category 24)
Dust
Humidity
Altitude (Procedure I)
Altitude (Procedure II)High Temperature (Procedure I)
High Temperature (Procedure II)
Low Temperature (Procedure I)
Low Temperature (Procedure II)
Temperature ShockHP Elite Mini/SFF
600/800 G9

HP Elite Tower
600/680 800/880 G9

810H

810H

810H

PassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedHP EliteOne All-In-One Desktop PC

Back to product listing

Test

HP EliteOne
840/870 G9 All-in-One
810H

Tested Under
Drop
Functional ShockVibration (Category 4)
Vibration (Category 24)
Dust
Humidity
Altitude (Procedure I)
Altitude (Procedure II)High Temperature (Procedure I)
High Temperature (Procedure II)
Low Temperature (Procedure I)
Low Temperature (Procedure II)
Temperature Shock

PassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedPassedHP Pro and ProOne All-in-One Desktop PC
Test
Tested Under

Back to product listing

HP Pro Mini/SFF
400 G9; HP Pro Tower 400/480 G9

HP ProOne 440
G9 All-in-One

810H

810H

Drop

Passed-Functional Shock

PassedPassedVibration (Category 4)

PassedPassedVibration (Category 24)

PassedPassed

Dust

PassedPassedHumidity

PassedPassedAltitude (Procedure I)

PassedPassedAltitude (Procedure II)

PassedPassedHigh Temperature (Procedure I)

PassedPassedHigh Temperature (Procedure II)

PassedPassedLow Temperature (Procedure I)

PassedPassedLow Temperature (Procedure II)

PassedPassedTemperature Shock

PassedPassedTechnical Whitepaper07

HP Dragonfly Notebook PC

Back to product listing

Test

HP Dragonfly G2

HP Elite Dragonfly 13.5 inch G4

810H

810H

Drop

PassedPassedFunctional Shock

PassedPassedVibration (Category 4)

PassedPassedVibration (Category 5)

PassedPassedVibration (Category 24)

PassedPassed

Dust

PassedPassedHumidity

PassedPassedAltitude (Procedure I)

PassedPassedAltitude (Procedure II)

PassedPassedHigh Temperature (Procedure I)

PassedPassedHigh Temperature (Procedure II)

PassedPassedLow Temperature (Procedure I)

PassedPassedLow Temperature (Procedure II)

PassedPassedTemperature Shock

PassedPassedSand

PassedPassedFreeze/Thaw

PassedPassedBench Handling Shock

PassedPassedCrash Hazard shock

PassedPassedTransportation Shock

PassedPassedTested Under

HP Elite Convertible Notebook PC
Test

HP Elite x2
G8Back to product listing
HP EliteBook x360 830
G9, G10, G11

HP Elite x360 1040
G9/G10/G11 2-in-1

810H

810H

810H

Drop

PassedPassedPassedFunctional Shock

PassedPassedPassedVibration (Category 4)

PassedPassedPassedVibration (Category 24)

PassedPassedPassed

Dust

PassedPassedPassedHumidity

PassedPassedPassedAltitude (Procedure I)

PassedPassedPassedAltitude (Procedure II)

PassedPassedPassedHigh Temperature (Procedure I)

PassedPassedPassedHigh Temperature (Procedure II)

PassedPassedPassedLow Temperature (Procedure I)

PassedPassedPassedLow Temperature (Procedure II)

PassedPassedPassedTemperature Shock

PassedPassedPassedSand

PassedPassedPassedFreeze/Thaw

PassedPassedPassedBench Handling Shock

PassedPassedPassedCrash Hazard Shock

PassedPassedPassedTransportation Shock

PassedPassedPassedTested Under

Technical Whitepaper08

HP EliteBook Notebook PC
Test

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HP EliteBook
630/640/645/650 G9/G10;655 G10;
630/635 Aero/640/645/660/665 G11

EliteBook Ultra G1q;
830/840/860/835/845/865 G9/G10/G11;
1040 G9/G10/G11

810H

810H

Drop

PassedPassedFunctional Shock

PassedPassedVibration (Category 4)

PassedPassedVibration (Category 5)

PassedPassedVibration (Category 24)

PassedPassed

Dust

PassedPassedHumidity

PassedPassedAltitude (Procedure I)

PassedPassedAltitude (Procedure II)

PassedPassedHigh Temperature (Procedure I)

PassedPassedHigh Temperature (Procedure II)

PassedPassedLow Temperature (Procedure I)

PassedPassedLow Temperature (Procedure II)

PassedPassedTested Under

Temperature Shock

PassedPassedSand

PassedPassedFreeze/Thaw

PassedPassedBench Handling Shock

PassedPassedCrash Hazard Shock

PassedPassedTransportation Shock

PassedPassedHP ProBook & Fortis Convertible PC
Test

HP ProBook
x360 440 G1

Tested Under

Back to product listing
HP ProBook
x360 11 G1/G2 EE

HP ProBook x360
11 G3/G4 EE

810G

810G

810G

Drop

PassedPassedPassedFunctional Shock

PassedPassedPassedVibration (Category 4)

PassedPassedPassedVibration (Category 5)

-

-

-

Vibration (Category 24)

PassedPassedPassed

Dust

PassedPassedPassedHumidity

PassedPassedPassedAltitude (Procedure I)

PassedPassedPassedAltitude (Procedure II)

PassedPassedPassedHigh Temperature (Procedure I)

PassedPassedPassedHigh Temperature (Procedure II)

PassedPassedPassedLow Temperature (Procedure I)

PassedPassedPassedLow Temperature (Procedure II)

PassedPassedPassedTemperature Shock

PassedPassedPassed-Passed-SandFreeze/Thaw-

Passed-Bench Handling Shock

-

-

-

Crash Hazard Shock

-

-

-

Transportation Shock

-

-

-

Technical Whitepaper09

HP ProBook & Fortis Convertible PC Continued
Test

HP ProBook
x360 11 G5 EE

Tested Under

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HP ProBook
x360 435 G8/G9/G10

HP Pro x360 Fortis 11
G10/G11

810H

810H

810H

Drop

PassedPassedPassedFunctional Shock

PassedPassedPassedVibration (Category 4)

PassedPassedPassedVibration (Category 5)-

PassedPassedVibration (Category 24)

PassedPassedPassed

Dust

PassedPassedPassedHumidity

PassedPassedPassedAltitude (Procedure I)

PassedPassedPassedAltitude (Procedure II)

PassedPassedPassedHigh Temperature (Procedure I)

PassedPassedPassedHigh Temperature (Procedure II)

PassedPassedPassedLow Temperature (Procedure I)

PassedPassedPassedLow Temperature (Procedure II)

PassedPassedPassedTemperature Shock

PassedPassedPassedSand-

PassedPassedFreeze/Thaw-

PassedPassedBench Handling Shock-

PassedPassedCrash Hazard Shock-

PassedPassedTransportation Shock-

PassedPassedHP ProBook Notebook PC
Test

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HP ProBook
Fortis 14 G9/G10

Tested Under

HP ProBook 440/445/450 455 G9; G10;
440/445/460/465 G11

810H

810H

Drop

PassedPassedFunctional Shock

PassedPassedVibration (Category 4)

PassedPassedVibration (Category 5)

PassedPassedVibration (Category 24)

PassedPassed

Dust

PassedPassedHumidity

PassedPassedAltitude (Procedure I)

PassedPassedAltitude (Procedure II)

PassedPassedHigh Temperature (Procedure I)

PassedPassedHigh Temperature (Procedure II)

PassedPassedLow Temperature (Procedure I)

PassedPassedLow Temperature (Procedure II)

PassedPassedTemperature Shock

PassedPassedSand

PassedPassedFreeze/Thaw

PassedPassedBench Handling Shock

PassedPassedCrash Hazard Shock

PassedPassedTransportation Shock

PassedPassedTechnical Whitepaper

10

HP Notebook PC

Back to product listing

Test

HP 240/240R/245/246 14 inch G9; 240/245 14 inch
G10 Notebook PC; HP ZHAN 14 inch G7 Notebook PC

Tested Under

HP 250/250R/255/256 15.6 inch G9;
HP 250/255 15.6 inch G10 Notebook PC

810H

810H

Drop

PassedPassedFunctional Shock

PassedPassedVibration (Category 4)

PassedPassedVibration (Category 5)--

Vibration (Category 24)

PassedPassed

Dust

PassedPassedHumidity

PassedPassedAltitude (Procedure I)

PassedPassedAltitude (Procedure II)

PassedPassedHigh Temperature (Procedure I)

PassedPassedHigh Temperature (Procedure II)

PassedPassedLow Temperature (Procedure I)

PassedPassedLow Temperature (Procedure II)

PassedPassedTemperature Shock

PassedPassedSand--Freeze/Thaw--

Bench Handling Shock--

Crash Hazard Shock--Transportation Shock--

HP Thin Client
Test

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HP Pro mt440 G3, Elite
mt645 G7, G8 Mobile Thin Client

HP Elite t655; tz655
Trusted Zero Client

HP Pro t550
Thin Client

Tested Under

HP Elite t755
Thin Client

810H

810H

810H

810H

Drop

Passed--PassedFunctional Shock

PassedPassedPassedPassedVibration (Category 4)

PassedPassedPassedPassedVibration (Category 5)

Passed---Vibration (Category 24)

PassedPassed-Passed

Dust

PassedPassedPassedPassedHumidity

PassedPassedPassedPassedAltitude (Procedure I)

PassedPassedPassedPassedAltitude (Procedure II)

PassedPassedPassedPassedHigh Temperature (Procedure I)

PassedPassedPassedPassedHigh Temperature (Procedure II)

PassedPassedPassedPassedLow Temperature (Procedure I)

PassedPassedPassedPassedLow Temperature (Procedure II)

PassedPassedPassedPassedTemperature Shock

PassedPassedPassedPassedSand

Passed---Freeze/Thaw

Passed---Bench Handling Shock

Passed---Crash Hazard shock

Passed---Transportation Shock

Passed---Technical Whitepaper

11

HP Chromebook Convertible
Test

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HP Chromebook x360 11
G4 EE

HP Chromebook Enterprisex360 11 G4

HP Fortis x360 11” G3 J
Chromebook

HP Fortis x360 11” G5Chromebook HP Fortis x360 11” G5Chromebook Enterprise

810H

810H

810H

810H

Drop

PassedPassedPassedPassedFunctional Shock

PassedPassedPassedPassedVibration (Category 4)

PassedPassedPassedPassedVibration (Category 5)

PassedPassedPassedPassedVibration (Category 24)

PassedPassedPassedPassed

Dust

PassedPassedPassedPassedHumidity

PassedPassedPassedPassedAltitude (Procedure I)

PassedPassedPassedPassedAltitude (Procedure II)

PassedPassedPassedPassedHigh Temperature (Procedure I)

PassedPassedPassedPassedHigh Temperature (Procedure II)

PassedPassedPassedPassedLow Temperature (Procedure I)

PassedPassedPassedPassedLow Temperature (Procedure II)

PassedPassedPassedPassedTemperature Shock

PassedPassedPassedPassedSand

PassedPassedPassedPassedFreeze/Thaw

PassedPassedPassedPassedBench Handling Shock

PassedPassedPassedPassedCrash Hazard Shock

PassedPassedPassedPassedTransportation Shock

PassedPassedPassedPassedTested Under

SEE NEXT PAGE FOR
HP CHROMEBOOK
PCs...

Technical Whitepaper

12HP Fortis, Chromebook, & Chromebook Enterprise
Test

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HP Elite c640 G3, c645 G2
Chromebook;
HP Elite c640 G3, c645 G2
Chromebook Enterprise

HP Elite Dragonfly
13.5 inch Chromebook& Chromebook
Enterprise

HP Fortis 11” G9 Q
Chromebook;
HP Fortis 11” G9 Q
Chromebook Enterprise

HP Chromebook 14 G7, HP
Chromebook Enterprise
14 G7

810H

810H

810H

810H

Drop

PassedPassedPassedPassedFunctional Shock

PassedPassedPassedPassedVibration (Category 4)

PassedPassedPassedPassedVibration (Category 5)

PassedPassedPassedPassedVibration (Category 24)

PassedPassedPassedPassed

Dust

PassedPassedPassedPassedHumidity

PassedPassedPassedPassedAltitude (Procedure I)

PassedPassedPassedPassedAltitude (Procedure II)

PassedPassedPassedPassedHigh Temperature (Procedure I)

PassedPassedPassedPassedHigh Temperature (Procedure II)

PassedPassedPassedPassedLow Temperature (Procedure I)

PassedPassedPassedPassedLow Temperature (Procedure II)

PassedPassedPassedPassedTemperature Shock

PassedPassedPassedPassedSand

PassedPassedPassedPassedFreeze/Thaw

PassedPassedPassedPassedBench Handling Shock

PassedPassedPassedPassedCrash Hazard Shock

PassedPassedPassedPassedTransportation Shock

PassedPassedPassedPassedTested Under

HP Fortis, Chromebook, & Chromebook Enterprise
Test

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HP Fortis 14” G10, G11 Chromebook;
HP Fortis 14” G10, G11 Chromebook
Enterprise

HP Chromebook 11 G9 EE;
HP Chromebook Enterprise
11 G9

HP Fortis 11” G10 Chromebook;
HP Fortis 11” G10 Chromebook
Enterprise

810H

810H

810H

Drop

PassedPassedPassedFunctional Shock

PassedPassedPassedVibration (Category 4)

PassedPassedPassedVibration (Category 5)

PassedPassedPassedVibration (Category 24)

PassedPassedPassed

Dust

PassedPassedPassedHumidity

PassedPassedPassedAltitude (Procedure I)

PassedPassedPassedAltitude (Procedure II)

PassedPassedPassedHigh Temperature (Procedure I)

PassedPassedPassedHigh Temperature (Procedure II)

PassedPassedPassedLow Temperature (Procedure I)

PassedPassedPassedLow Temperature (Procedure II)

PassedPassedPassedTemperature Shock

PassedPassedPassedSand

PassedPassedPassedFreeze/Thaw

PassedPassedPassedBench Handling Shock

PassedPassedPassedCrash Hazard Shock

PassedPassedPassedTransportation Shock

PassedPassedPassedTested Under

Technical Whitepaper

13

HP Retail & Industry Solutions (HP Engage)
Test

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HP Engage One
All-in-One

HP Engage One Pro
All-in-One

HP Engage Flex Pro
Retail System

HP Engage Flex Pro-C
Retail System

HP Engage Flex Mini
Retail System

810G

810G

810G

810G

810H

-

-

PassedPassedPassedFunctional Shock

PassedPassed---Vibration (Category 4)

PassedPassedPassedPassedPassedVibration (Category 24)

-

-

-

-

-

PassedPassedPassedPassedPassed-PassedPassedPassedPassedAltitude (Procedure I)

PassedPassedPassedPassedPassedAltitude (Procedure II)

PassedPassedPassedPassedPassedHigh Temperature (Procedure I)

PassedPassedPassedPassedPassedHigh Temperature (Procedure II)

PassedPassedPassedPassedPassedLow Temperature (Procedure I)

PassedPassedPassedPassedPassedLow Temperature (Procedure II)

PassedPassedPassedPassedPassedTemperature Shock

-

-

-

-

-

Sand

-

-

-

-

-

Freeze/Thaw

-

-

-

-

-

Tested Under
Drop

Dust
Humidity

HP Retail & Industry Solutions (HP Engage)

Back to product listing

HP Engage Go 10
Convertible System

HP Engage
Go 10 Mobile System

HP Engage Go 10
Mobile Dock

HP Engage Go
13.5” Convertible/
Mobile System

HP Engage Flex
Pro G2 & Pro-C G2Retail Systems

810H

810H

810H

810H

810H

PassedPassed-PassedPassed----PassedVibration (Category 4)

PassedPassed-PassedPassedVibration (Category 24)-

Passed--Passed

Dust-

Passed--PassedPassedPassedPassedPassedPassedAltitude (Procedure I)

-

-

-

-

PassedAltitude (Procedure II)

PassedPassedPassedPassedPassedHigh Temperature (Procedure I)

PassedPassedPassedPassedPassedHigh Temperature (Procedure II)

PassedPassedPassedPassedPassedLow Temperature (Procedure I)

PassedPassedPassedPassedPassedLow Temperature (Procedure II)

PassedPassedPassedPassedPassedTemperature Shock-

Passed--Passed

Sand

-

-

-

-

-

Freeze/Thaw

-

-

-

-

-

Test

Tested Under
Drop
Functional Shock

Humidity

14

MIL-STD-810 test background
Created by the U.S. government, the MIL-STD-810 test method standard is intended to help organizations
prepare environmental tests to evaluate how well a particular piece of equipment can perform in the field.
The standard outlines dozens of test methods, each associated with a source of environment stress, suchas vibration, moisture, dust, extreme temperatures, or humidity; for example, Method 500.5 describes Low
Pressure (Altitude) testing, while Method 501.5 describes High Temperature testing. While there is not arecommended or required list of tests for device categories, most major PC vendors generally perform
between 5 and 8 test methods.
Each test method outlines multiple test procedures; for example, Method 501.5 describes Procedure
I (Storage) and Procedure II (Operation). Thus, Procedure I can be used to evaluate the effects of hightemperature storage on the subsequent performance of a business PC; Procedure II evaluates the effects
of high temperature while the PC is running.

Test scenarios
A third-party facility tested the durability of the HP Business PC models using procedures tailored from
MIL-STD-810. HP used the MIL-STD-810 test menu to select tests that most closely reflect the challenges
faced by today’s professionals.

Drop test²
The Drop test was performed in accordance with MIL-STD-810G, Method 516.6 or 516.7, or MIL-STD-810H,
Method 516.8 Procedure IV. The objective of this test was to determine whether the unit could be safely
operated after being dropped from desk height. For this test, 26 drops were performed from 30 inch onto
every side, angle and edge onto 2 inch of plywood over steel over concrete. Unit is powered down andchecked for operation.

Functional Shock test²
The Shock test was performed in accordance with MIL-STD-810G, Method 516.6 or 516.7, or MIL-STD-810H,
Method 516.8 Procedure I. The objective of this test was to determine whether the unit could be safely
operated after being exposed to sudden physical shock events while operational. For this test, 3 shocks
were performed across each axis and direction for a total of 18 shocks.

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15Vibration test²
The Vibration Resistance tests were performed in accordance with MIL-STD-810G Test Method 514.6 or
514.7, or MIL-STD-810H, Method 514.8 Procedure I, Cat 24, Cat 4, and Cat 5.
Non- operational test with box. Test parameters were set to simulate the following:
Operate the unit during a 1000-mile simulation of vibrations created by a truck driving on a U.S. highway
Operate the unit after it has been subjected to higher levels of vibration while in storage
Terrain, road and surface discontinuities, vehicle speed, loading, structural characteristics, and suspension
system are all reflected in this simulation.
See Key Parameters below for test specifications.

Dust Draft test²
The Dust Resistance test was performed in accordance with MIL-STD-810G, Method 510.5 or 510.6, or MIL-STD-810H,
Method 510.7 Procedure I (Dust). Test parameters were set so that the unit was dusted with Arizona Road Dust for six
hours while being operated.

Humidity test²
The Humidity test was performed in accordance with MIL-STD-810G, Method 507.5 or 507.6, or MIL-STD-810H, Method507.6 Procedure II with the aggravated temperature-humidity cycle. Each cycle was one day (24 hours); ten cycles withthe temperature being cycled between 30°C (86°F) and 60°C (140°F); and relative humidity was a constant 95%.

Altitude test²
The Altitude test was performed in accordance with MIL-STD-810G, Method 500.5 or 500.6, or MIL-STD-810H, Method500.6 Procedure I (Storage) and II (Operation). The altitude level simulated for both procedures was 15,000 feet(the highest equivalent altitude given within MIL-STD-810 for cargo pressures within military aircraft).

High Temperature test²
The High Temperature test was performed in accordance with MIL-STD-810G, Method 501.5 or 501.6,or MIL-STD-810H,
Method 501.7 Procedure I (Storage) and II (Operation). This test evaluated the unit’s performance while it was being
exposed to high temperature conditions: 60°C (140°F) operational and 71°C (160°F) non-operational.

Low Temperature test²
The Low Temperature test was performed in accordance with MIL-STD-810G, Method 502.5 or 502.6, or MIL-STD-810H,
Method 502.7 Procedure I (Storage) and II (Operation). This test evaluated the unit’s performance while it was being
exposed to low temperature conditions: -29°C (-20°F) operational and -51°C (-60°F) non-operational.

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16Temperature Shock test²
The Thermal Shock test was performed in accordance with MIL-STD-810G, Method 503.5 or 503.6, or MIL-STD-810H,
Method 503.7 Procedure I. The objective of this test was to determine whether the unit’s could be safely operated
after being exposed to sudden changes in ambient temperature while non-operational. The high temperature was set
to be 60°C (140°F) and the low temperature to be -51°C (-60°F); three high-to-low cycles were performed.

Sand test²
The Sand test was performed in accordance with MIL-STD-810G, Method 510.5 or 510.6, or MIL-STD-810H, Method
510.7 Procedure II. The objective of this test was to determine whether the unit could be safely operated after being
exposed to blowing sand of up to 20M/S at a temperature of 60°C (140°F) for 4.5 hours (every 90 minutes, the unit
is rotated 90°).

Explosive Atmosphere test²
The Explosive Atmosphere test was performed in accordance with MIL-STD-810G, Method 511.5 or 511.6, or MIL-STD810H, Method 511.7 Procedure I. The objective of this test was to determine whether the notebook could be safely
operated in fuel-air explosive atmospheres without causing ignition.

Freeze/Thaw test²
The Freeze/Thaw test was performed in accordance with MIL-STD-810G, Method 524.1, or MIL-STD-810H,
Method 524.1 Procedure III. The objective of this test was to determine whether the unit could be safely operated
after being exposed to a temperature drop of -10°C (14°F) for two hours. Unit is removed and checked for operation.

Bench Handling Shock test²
The Bench Handling test was performed in accordance to the MIL-STD-810G, Method 516.6 or 516.7,
or MIL-STD-810H, Method 516.8 Procedure VI. This test was designed to test whether the unit can withstand levelsof shock resulting from bench handling, bench maintenance, and/or packaging.

Crash Hazard Shock test²
The Crash Hazard test was performed in accordance to the MIL-STD-810G, Method 516.6 or 516.7,
or MIL-STD-810H, Method 516.8 Procedure V. The purpose of this test was to ensure that the unit does not eject
sub-elements and that its restraining devices will not fail during crash situations.

Transportation Shock test²
The Transportation Shock test was performed in accordance with MIL-STD-810G Test Method 516.7, or MIL-STD-810H,
Method 516.8 Procedure II. Simulation of this environment requires use of a package tester (Annex C, Figure 514.7C-5)
that imparts a 25.4 mm (1.0 inch) peak-to-peak, circular synchronous motion to the table at a frequency of 5 Hz. This
motion takes place in a vertical plane.

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17

Solar Radiation Shock test²
The Solar Radiation Shock test was performed in accordance with MIL-STD-810G Test Method 505.6, or
MIL-STD-810H, Method 505.7 Procedure II. Use Procedure II to investigate the effects on materiel of long periods of
exposure to sunshine. The approach is to use an accelerated test that is designed to reduce the time to reproduce
cumulative effects of long periods of exposure. The 4-hour “lights-off” period of each 24-hour cycle allows for test item
conditions (physical and chemical) to return toward “normal” and provide some degree of thermal stress exercising.

ESD (Electrostatic Discharge) test²
The ESD test was performed in accordance with IEC 61000-4-2. The objective of this test was to determine whether
the unit could be safely operated after being exposed to sudden electrostatic discharge events of up to 8,000 volts.
Electrostatic discharge points were performed at horizontal and vertical ground planes, chassis screw, serial
port ground, screen, finger pad, power cable, power button, keyboard, speaker button, and trackball for a total of
11 discharge points.

Pass/fail criterion
The third-party verified that the tested unit was operational after each environmental exposure by booting
the Microsoft® Windows® operating environment.

Test descriptions
The following table includes the tests performed with specific MIL-STD-810 method references andkey test parameters.

Test

MIL-STD-810G Reference

Procedures
Procedure I, Category 24(Minimum Integrity Test)

Vibration

MIL-STD-810G Test Method 514.6 or
514.7 or MIL-STD-810H, Method 514.8

Procedure I, Category
4 (Ground Vehicle)
Procedure II, Category
5 (Loose Cargo)

Key Test Parameters
Non-operational 0.04 g2/Hz at 20-1000 Hz, -6 dB/octave at
1000-2000 Hz; One hour/axis duration
Operational U.S. highway truck exposure 1000 mile Simulation;
One hour/axis duration
Non-operational test with box. Simulation of this environment
requires use of a package tester that imparts a 25.4 mm(1.0 inch) peak-to-peak, circular synchronous motion to the table
at a frequency of 5 Hz. This motion takes place in a vertical plane.

Dust Resistance

MIL-STD-810G, Method 510.5 or 510.6
or MIL-STD-810H, Method 510.7

Procedure I (Blowing dust)

Particles of Arizona Road Dust, 10.6 +/-7 grams per cubic footSand

MIL-STD-810G, Method 510.5 or 510.6
or MIL-STD-810H, Method 510.7

Procedure II (Blowing
sand)

Blowing sand of up to 20M/S at a temperature of 60°C (140°F)
for 4.5 hours. Every 90 minutes, the unit is rotated 90°.

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18

Test

MIL-STD-810G Reference

Humidity

MIL-STD-810G, Method 507.5 or 507.6
or MIL-STD-810H, Method 507.6

AltitudeMIL-STD-810G, Method 500.5 or 500.6,
or MIL-STD-810H, Method 500.6

High Temperature

MIL-STD-810G, Method 501.5 or 501.6,
or MIL-STD-810H, Method 501.7

Low Temperature

MIL-STD-810G, Method 502.5 or 502.6,
or MIL-STD-810H, Method 502.7

Procedures
Procedure II
Procedure I (Storage/airtransport)
Procedure II (Operation/
air carriage)
Procedure I (Storage)
Procedure II (Operation)
Procedure I (Storage)
Procedure II (Operation)

Key Test Parameters
Relative humidity 95%; Temperature cycled between
30°C and 60°C (86°F and 140°F); Test cycle 24 hours; test
consisted of ten cycles
Non-operational 15,000 feet at 57 kPa
One hour duration
Operational 15,000 feet at 57 kPa
One hour duration
Non-operational Temperature cycled between 35°C and
71°C (95°F and 160°F)
Test cycle 24 hours; test consisted of seven cycles
Operational 60°C (140°F)
Four hours duration
Non-operational -51°C (-60°F)
Four hours duration
Operational -29°C (-20°F)
Four hours duration
Non-operational
High temperature 60°C (140°F)
Low temperature -51°C (-60°F); Three cycles (a cycle consistsof a dwell low, low to high, dwell high, high to low)
One hour dwell time

Temperature ShockMIL-STD-810G, Method 503.5 or 503.6
or MIL-STD-810H, Method 503.7

Procedure I

Functional ShockMIL-STD-810G, Method 516.6 or 516.7 or
MIL-STD-810H, Method 516.8

Procedure I

Operational 3 shocks/axis/direction for a total of 18 shocks;
40 Gs peak, 11 ms

Drop

MIL-STD-810G, Method 516.6 or 516.7,
or MIL-STD-810H, Method 516.8

Procedure IV

26 drops from 30 in. onto every side, angle and edge onto 2
in. of plywood over steel over concrete. Unit is powered down
and checked for operation.

Explosive Atmosphere

MIL-STD-810G, Method 511.5 or 511.6 or
MIL-STD-810H, Method 511.7

Procedure I

Unit could be safely operated in fuel-air explosive
atmospheres without causing ignition.

Freeze/Thaw

MIL-STD-810G, Method 524.1 or 524.5
or MIL-STD-810H, Method 524.1

Procedure III

Non-operational Exposed to a temperature drop of -10⁰C(14°F) for two hours Unit is removed and checked for
operation

Crash Hazard
Shock

MIL-STD-810G, Method 516.6 or 516.7 or
MIL-STD-810H, Method 516.8

Procedure V

Non Operational 2 shocks in each axis/direction for

Bench Handling ShockMIL-STD-810G, Method 516.6 or 516.7 or
MIL-STD-810H, Method 516.8

Procedure VI

16 drops from 4 inches on a wooden bench top on all sides,
edges and corners that could be impacted during normal
handling or during maintenance.

Solar Radiation

Method 505.6

Procedure II
Sample condition:
Non-Operation
Radiation source: Metal
halide lamp
Irradiance: Spectral
irradiance of (1120+/-47
W/m2 at (300-3000) nm
Chamber temperature:
49 degree
Exposing duration: 20
hours irradiation and 4
hours darkness per a
24-hour cycle
Test duration: 1 Cycle Twounits: 1 for lid close, 1 forlid open.

The purpose is to investigate the effects on material of long
periods of exposure to sunshine. The approach is to usean accelerated test that is designed to reduce the time toreproduce cumulative effects of long periods of exposure.
The 4-hour “lights-off” period of each 24-hour cycle allows
for test item conditions (physical and chemical) to returntoward “normal” and provide some degree of thermal
stress exercising.

Transporation ShockMIL-STD-810G Test Method 516.7 or
MIL-STD-810H, Method 516.8

Procedure II

The purpose is used to evaluate the response of the system
to transportation environments that create a repetitive
shock load.

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19

ESD Test Descriptions
The following table includes the specific test parameters for the Electrostatic Discharge test.
Test
ESD (Electrostatic Discharge)

Reference

Key Test ParameterIEC 6100-42

Temperature: 23°C (73°F)
Humidity 39%
Between 6 to 8,000 Volts applied to:• Horizontal Ground Plane• Vertical Ground Plane• Chassis Screw• Serial Port Ground• Screen• Fingerprint• Power Cable• Power Button• Keyboard• Speaker B

The MIL-STD-810 test specifications can be accessed at iest.org/Standards-RPs/MIL-STD-810.
Learn more about HP business notebooks, tablets, and desktops at hp.com or contact your local HP sales representative.
1HP’s Total Test Process is not a guarantee of future performance under these test conditions. Accidental Damage or damage under these test conditions requires an optional
HP Accidental Damage Protection Care Pack.
2MIL - STD - 810 testing is conducted on select HP products. Testing is not intended to demonstrate fitness for U.S. Department of Defense (DoD) contract requirements or for
military use. Test results are not a guarantee of future performance under these test conditions. Accidental damage or damage under these test conditions requires an optional
HP Accidental Damage Protection Care Pack.

© Copyright 2024 HP Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express
warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors oromissions contained herein.
Microsoft and Windows are trademarks of the Microsoft group of companies. All other trademarks are the property of their respective owners.
4AA6-0823ENW, 3-July, 2024

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20