3DIC 2024 Program Schedule
September 25-27, 2024
Conference Venue:
September 25, 2024 at Hotel Metroloplitan Sendai
September 26-27, 2024 at Sendai Kakusai Hotel
SessionLocation
SessionDate
HotelOpening Remark
25-Sep-24
Metropolitan Keynote Talk I
25-Sep-24
SendaiKeynote Talk II
25-Sep-24

as of August 23, 2024

13:00-13:10

Presentationtime
13:00-13:10

T. Tanaka

Tohoku University

13:10-13:50

13:10-13:50

KeynoteBor-Sung LiangMediaTeck

13:50-14:30

13:50-14:30

KeynoteIBM NorthPole: Brain-Inspired Neural Inference Architecture Takanori Ueda
Intertwining Compute with MemoryIBM Research Tokyo

Development of Hybrid Bonding: Perspectives on Material
Kuan-Neng Chen
Selection, Structural Design, and Applications (Tentative)
Advanced packaging process technologies for heterogeneous Noriaki Matsunaga
integration
TBD
Superconducting TSVs for quantum computers (Tentative)
Alexandra Shevsky

National Yang Ming Chiao Tung University

Session time

paper_ Category paper_title
idAuthorsAffiliations

25-Sep-24
25-Sep-24

Coffee BreakInvited Talk I

14:30-14:45
14:45-15:15

14:30-14:45
14:45-15:15

Invited25-Sep-24

Invited Talk II

15:15-15:45

15:15-15:45

Invited25-Sep-24
25-Sep-24

15:45-16:15
16:15-16:45

15:45-16:15
16:15-16:45

InvitedInvited25-Sep-24

Invited Talk III
Session 1: Quantum Technology
Invited Talk IV
Session 1: Quantum Technology

16:45-17:05

16:45-17:05

4036

LectureElectrochemical Deposition of Indium Thin-Films for Scalable Jowesh Avisheik Goundar, La Thi Ngoc Mai, Yugi Otake,
3D Quantum Chiplets
Yuki Mori, Hideo Kosaka, Fumihiro Inoue

Yokohama National University

25-Sep-24

Session 1: Quantum Technology

17:05-17:25

17:05-17:25

4008

Lecture3D Stacked Spin Qubit and TCAD Simulations

Tetsufumi Tanamoto

Teikyo University

25-Sep-24

Banquet18:00-20:00

18:00-20:00

Keynote Talk III

08:50-09:30

08:50-09:30

KeynoteCHIPS -NAPMP: Overview and Next StepsGeorge OrijSession 2: Process Technology for
Hybrid Bonding
Invited Talk V
Session 2: Process Technology for
Hybrid Bonding
Invited Talk VI
Coffee BreakSession 2: Process Technology for
Hybrid Bonding

09:30-10:00

09:30-10:00

InvitedTBD

National Advanced Packaging Manufacturing Program(NAPMP)

10:00-10:30

10:00-10:30

Invited

TBD

10:30-10:45
10:45-11:05

10:30-10:45
10:45-11:05

4016

LectureA Temporary Bonding De-Bonding Tape with High ThermalResistance, Easy Peeling and Excellent TTV for 3DIC

Moeki Nakano, Shigenori Nagahama, Toshio Takahashi, and SEKISUI CHEMICAL CO., LTD ,Takuya Yamamoto

26-Sep-24

Session 2: Process Technology forHybrid Bonding

11:05-11:25

11:05-11:25

4009

LectureA Novel Transfer Bonding Process with Particle Less Tapes
for Die to Wafer Integration

Tomoka Kirihata (1), Masanori Yamagishi (1), Ichiro Sano(2) Haruka Morita (2), Yusuke Fumita, Shinya Takyu{1} LINTEC Corporation{2} TAZMO CO.,LTD.

26-Sep-24

11:25-11:45

11:25-11:454003

LectureAdvanced Technology Development of Squeeze Effect NonContact Handling Tool for Semiconductor Chips

Hayato HISHINUMA (1), Masaaki MIYATAKE (2), Hiroshi
KIKUCHI (1), Yuta TOBARI (1)(1) Yamaha Robotics Holdings Co., Ltd. (2) (2) Tokyo
University of Science

26-Sep-24
26-Sep-24

Session 2: Process Technology for
Hybrid Bonding
Lunch
Poster Session Core time*

11:45-13:00
13:00-14:30

11:45-13:00
13:00-14:30

4010

PosterAntioxidative Cu Electrodeposition for 3D Interconnects with Ryo Aizawa (1), Masahiro Sawa (1), Jinta Nampo (1),Hybrid Bonding
Murugesan Mariappan (2), Takafumi Fukushima (2)(1) JCU Corporation(2) Tohoku University

26-Sep-24

Poster Session Core time*

13:00-14:30

13:00-14:30

4031

PosterTohoku University

26-Sep-24

Poster Session Core time*

13:00-14:30

13:00-14:30

4037

Poster

26-Sep-24

Poster Session Core time*

13:00-14:30

13:00-14:30

4019

PosterRoom-Temperature and Compressive Force-Free Metal-Metal Jiayi Shen, Chang Liu, Tetsu Tanaka, and Takafumi
Direct Bonding for Heterogeneous Integration of Micro-LED Fukushima
Array on 3D-IC
Plasma Hydrophilic Treatment for Improved Wafer Bonding Daiki Nemoto, Kai Takeuchi, Eiji Higurashi
Strength via Polysilazane
Cost-Effective Low-Temperature Hybrid Bonding Using Layer Yu-Lun Liu, Chun-Ta Li, Tzu-Han Sun, Chien-Kang Hsiung,
Transfer Technology
and Kuan-Neng Chen

26-Sep-24

Poster Session Core time*

13:00-14:30

13:00-14:30

4018

PosterCharacteristics of Ozone-Ethylene Radical Pretreatment forHybrid Bonding Without Water Rinsing Processes(1) Tohoku University(2) MEIDEN NANOPROCESS INNOVATIONS

26-Sep-24

Poster Session Core time*

13:00-14:30

13:00-14:30

4007

Poster

Detectability of Resistive Open Defects with Analog
Relaxation Oscillators Under Unit-to-Unit Variations of Dies

26-Sep-24

Poster Session Core time*

13:00-14:30

13:00-14:30

4022

Poster

26-Sep-24

Poster Session Core time*

13:00-14:30

13:00-14:30

4034

Poster

26-Sep-24

Poster Session Core time*

13:00-14:30

13:00-14:30

4025

Poster

3D SRAM Design & Optimization with Open Source Memory
Compiler

26-Sep-24

Poster Session Core time*

13:00-14:30

13:00-14:30

4021

PosterMachine Learning-Based Diagnosis of Defects in Chiplet
Interconnects

26-Sep-24

Poster Session Core time*

13:00-14:30

13:00-14:30

4027

Poster

26-Sep-24

Poster Session Core time*

13:00-14:30

13:00-14:30

4014

PosterCreep Behavior of Low-Temperature Sn-in Solder Using
Nanoindentation Test
16-Layer 3D Stacking Based on Self-Assembly Technology
for HBM Application

26-Sep-24

Poster Session Core time*

13:00-14:30

13:00-14:30

4029

Poster

26-Sep-24

Poster Session Core time*

13:00-14:30

13:00-14:30

4038

Poster

26-Sep-24
26-Sep-24

26-Sep-24

26-Sep-24
26-Sep-24

Sendai
Kokusai
Hotel

Poster Session is scheduled on September 24. Poster session core time is 13:00-14:30, September 24.

B. Tanaka (1), T. Shino (2), M. Murugesan (1), T. Tanaka(1), T. Fukushima (1)AMAT

Fraunhofer EMFTTohoku University
National Yang Ming Chiao Tung University

Yuya Yamahashi (1), Yuto Ohtera (1), Hiroyuki Yotsuyanagi (1) Tokushima University(1), Shyue-Kung Lu (2), Masaki Hashizume (1)(2) National Taiwan University of Science andTechnology
Gate Driver IC for GaN Power Devices Suitable for 3D Power Yusuke Ohgush (1) and Satoshi Matsumoto (1) (2)(1) Kyushu Institute of TechnologyIC(2) Tokyo Metropolitan University
Design Enablement of Heterogenous Integration for 3DIC
Ahmed Hossam-ELdeen, Sudipta Das, Giuliano Sisto
imec
Sunan Chen (1), Chao Wu (2), Yuan Guan (2), Yuanqing
Cheng (1)(1) Beihang University(2) Beijing Smartchip Microelectronics Technology Co.,Ltd.
Junming Li , Huaguo Liang, Xianrui Dou, Le Yu , Zhengfeng Hefei University of Technology
Huang, Yi ngchun Lu, Cuiyun Jiang
Shunya Nitta, Hiroaki Tatsumi, Hiroshi Nishikawa

Osaka University

ZEHUA DU (1), Hiroshi Kikuchi (2), Hayato Hishinuma (2),Tetsu Tanaka (1), Takafumi Fukushima (1)(1) Tohoku University(2) Yamaha Robotics Holdings Co. Ltd.

Temporary Adhesive Effect on Multichip Thinning for Rapid
Akihiro Tominaga, Jiayi Shen, Chang Liu, Tetsu Tanaka and Tohoku University
Prototyping of 3D-IC from 2D-IC Fabricated in Foundry
Takafumi Fukushima
Shuttle Services
Activation of Copper Surfaces by VUV-Redox Method Using a S. Endo, A. Shimizu
Ushio Inc.,
Xenon Excimer lamp

1

3DIC 2024 Program Schedule
September 25-27, 2024
Conference Venue:
September 25, 2024 at Hotel Metroloplitan Sendai
September 26-27, 2024 at Sendai Kakusai HotelSession
Location
Session
Date
Poster Session Core time*
26-Sep-24

26-Sep-24

as of August 23, 2024

13:00-14:30

Presentationtime
13:00-14:30

paper_ Category paper_title
id4012
Clean Dicing: an Alternative Blade Dicing Technique for
Poster
Minimising Particles in 3D Heterogeneous Integration

Poster Session Core time*

13:00-14:30

13:00-14:30

4006

PosterImpact of 2-Dimensional Materials for 3D Power IC

26-Sep-24

Poster Session Core time*

13:00-14:30

13:00-14:30

4035

Poster

Thermal Flow Simulation and Measurements of 3D Si Chip
Stacks with TSVs

Shuhei Yokota , Rikuu Hasegawa , Kazuki Monta, TakaakiOkidono, Takuji Miki , Makoto Nagata

26-Sep-24

Poster Session Core time*

13:00-14:30

13:00-14:30

4033

Poster

26-Sep-24

Poster Session Core time*

13:00-14:30

13:00-14:30

4030

PosterPanel Session

14:30-15:15

14:30-15:15

PanelHisashi Kino (1), Takafumi Fukushima (2), Tetsu Tanaka(2)
Y. ISHII, T HAMAMURA, T. S HIMIZU T. ITO , and S.
SHINGUBARAPaul D. Franzon(1) Kyushu University(2) Tohoku University
Kansai University

26-Sep-24

Suppression of TSV-Induced Stress by Using Negative
Thermal Expansion Material
TSV Formation Using a Direct Cu Electroplating on
Electroless Plated Barrier Layer with a Low Resistivity
CAD tools for 3DIC

15:15-15:30
15:30-16:00

15:15-15:30
15:30-16:00

InvitedFO-PLP Technology for HPC (Tentative)

Ole Hölck

Fraunhofer IZM

26-Sep-24

Coffee BreakSession 3: Advanced Interposers
Invited Talk VII
Session 3: Advanced Interposers

16:00-16:20

16:00-16:20

4011

LectureProcess Development for a Novel low-Loss Photo Imageable
Dielectric in an RF Silicon Interposer Platform

imec

26-Sep-24

Session 3: Advanced Interposers

16:20-16:40

16:20-16:40

4015

LectureUltra-High Density Deep Trench Capacitor (DTC) for 3DICIntegration

Hamideh Jafarpoorchekab, Xiao Sun, Angel Uruena,Siddhartha Sinha, Nelson Pinho, Andy Miller, Nadine
Collaert
H.L. Cheng, J.Y. Lin, T.C. Hsu, C.Y. Peng, Felix Tsui andS.F. Huang

26-Sep-24

Session 3: Advanced Interposers

16:40-17:00

16:40-17:00

4013

LectureAkihiro Shimizu (1), Kazuhiro Fukada (2), Shinichi Endo(1), Mitsunori Abe (3), Akiko Matsui (3)Coffee BreakSession 4: Application
Invited Talk VIII
Session 5 Thermal Management
Invited Talk X
Session 5: Thermal Management

17:00-17:10
17:10-17:40

17:00-17:10
17:10-17:40

Direct Sputtering Copper Seed Layer Formation Method on
Low Dielectric Resin That Achieves Low Transmission Loss
Up to 100 GHz in high-Frequency Transmission Circuit(1) Ushio Inc.
(2) Shibaura Machine Co.
(3) NTT Devices Cross Technologies Corporation

Invited08:50-09:20

08:50-09:20

Invited

09:20-09:40

09:20-09:40

4032

Lecture27-Sep-24

Session 5: Thermal Management

09:40-10:00

09:40-10:00

4026

Lecture27-Sep-24

Coffee BreakSession 6: Bumpless and Hybrid
Bonding Technology

10:00-10:15
10:15-10:35

10:00-10:15
10:15-10:35

4002

LectureFace-Down and Heterogeneous Chip Bonding Technology on Yoshiaki Satake (1)(2), Tatsuya Funaki (1)(2), Wataru Doi
Waffle Wafer for Bumpless Chip-on-Wafer (COW) Package(1)(2), Hajim e Kato (2)(3), S hogo Okita (2)(3), Takayuki
Ohba (2)(1) Murat a Manufacturing Co., Ltd.
(2) Tokyo Institute of Technology(3) Panasonic Connect Co., Ltd.

27-Sep-24

Session 6: Bumpless and Hybrid
Bonding Technology

10:35-10:55

10:35-10:55

4020

LectureLow-Temperature Adhesive Hybrid Bonding Technology with Tzu-Han Sun, Yu-Lun Liu, Chun-Ta Li, Wen-Tzu Tsai, MuNovel Aera-Selective Passivation Layer
Ping Hsu, and Kuan-Neng Chen

National Yang Ming Chiao Tung University

27-Sep-24

Session 6: Bumpless and Hybrid
Bonding Technology

10:55-11:15

10:55-11:15

4017

LectureDie-to-Wafer Hybrid Bonding Impact at mm-Wave
Frequencies

Mohammad Alsukour (1) (2), Olivier Valorge (1), Margot
Faure (1), Loïc Vincent (3), Victor Milon (4), Pascal
Chevalier (4) Jean Daniel Arnould (2), Emmanuel Pistono(2), Christophe Dubarry (1)(1) CEA LETI, Univ. Grenoble Alpes(2) TIMA(3) CIME, Univ. Grenoble Alpes, CNRS
(4) STMicroelectronics

27-Sep-24

Session 6: Bumpless and Hybrid
Bonding Technology

11:15-11:35

11:15-11:35

4028

LectureImpact of Cu Pad Density on Cu-CMP and Bonding Yield for
Chip-to-Wafer Hybrid Bonding

M. Murugesan (1), H. Hashimoto (1), K. Mihara (2), F.
Inoue (3), A. Uedono (4), T. Hare (2), T. Fukushima (1)27-Sep-24

11:35-11:55

11:35-11:55

4024

Lecture11:55-12:10

11:55-12:10

Cost-Effective Low-Temperature Hybrid Bonding Using Layer Wei Ting Chen Chih Hsien Chiu, and Jenn Ming Song
Transfer Technology

27-Sep-24

Session 6: Bumpless and Hybrid
Bonding Technology
Award Ceremony and Closing
RemarkNanoTerasu Visit in Japanese(1) Tohoku University(2) Toray Engineering Co. Ltd.
(3) Yokohama National University(4) The University of Tsukuba
National Chung Hsing University

14:00-15:00

14:00-15:00

27-Sep-24

NanoTerasu Visit in English

15:00-16:00

15:00-16:00

26-Sep-24

26-Sep-24
27-Sep-24
27-Sep-24

27-Sep-24

Sendai
Kokusai
HotelSession time

Poster Session is scheduled on September 24. Poster session core time is 13:00-14:30, September 24.

Authors

AffiliationsAkito Hiro, Damien Jon Leech, Geert Schoofs, JohnSlabbekoorn, Alain Phommahaxay, Koen Kennes, GeraldBeyer, Eric Beyne
Ayano Furue (1), Masataka Hasegawa (2), and Satoshi
Matsumoto (1) (3)imec(1) Kyushu Institute of Technology(2) AirMembrane Corporation(3) Tokyo Metropolitan University
Kobe Unversity

North Carolina State University

TSMC

TBD
Power, Thermal and Noise Characterization of Stacked
Processors for Ai Systems (Tentative)
A Novel Multi-Chip Cooling System Using Direct On-Chip Jet
Impingement for High-Performance Interposer Packages
Thermal Analysis of Reflow Process for PIC-EmbeddedPackage Substrate with 2.3D RDL Interposer for CoPackaged Optics

Eren Kursun

Columbia University

Akshat Patel, Tiwei Wei

Purdue University

A. Noriki (1), H. Uemura (2), H. Kuwatsuka (1), N. Matsui (1) National Institute of Advanced Industrial Science and(2), R. Motoji (2), D. Maeda (2), T. Sugita (2), F. Nakamura Technology (AIST)(1), T. Amano (1)(2) Kyocera Corporation2