Call for Papers
6th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference2022

6th IEEE Electron Devices Technology andManufacturing (EDTM) Conference 2022
Oita, Japan, March 6th- 9th, 2022
http://ewh.ieee.org/conf/edtm/2022
Conference Theme: “Semiconductor Devices and Manufacturing Innovations
for a More Sustainable World”

Three-page camera-ready paper submission deadline: October 18th, 2021, 23:59(JST)
Notification for Acceptance: End of December, 2021
Conference format: Please visit website for details.

IEEE Electron Devices Technology and Manufacturing (EDTM)

General Chair:

Technical Areas

EDTM 2022 solicits papers in all areas of electron devices, including materials,processes, devices, packaging, modeling, reliability, manufacturing and yield, tools,testing, and any emerging device technologies. Authors should select a technicalcategory based on the detailed descriptions in this flyer during online submission ofpapers.

Samar Saha (Prospicient Devices)
Shuji Ikeda (tei Solutions)
Hitoshi Wakabayashi (Tokyo Tech.)
Geok Ing Ng (NTU)
Albert Wang (UC Riverside)
M.K. Radharkrishnan (NanoRel)
Bin Zhao (Iotelligent)

Oral and Poster Sessions

Executive Committee:

6th EDTM (Electron Devices Technology and Manufacturing) conference is a full four- Kazunari Ishimaru (Kioxia)
day meeting to be held at Oita, Japan from March 6 to 9th, 2022, fully sponsored by the TPC Chair:
IEEE Electron Devices Society (EDS). As semiconductor technology scaling challenges Masumi Saitoh (Kioxia)
continues to grow, so should the industries collaborative efforts to overcome them must Steering Committee:
increase. EDTM is intended to serve as a forum for the electron devices community to Kazunari Ishimaru (Chair, Kioxia)
collaborate on topics ranging from devices, materials, and tools, to create new and Ravi Todi (Western Digital))innovative technologies. EDTM will provide the following new formats.
Fernando Guarin (Globalfoundries)

EDTM 2022 will include parallel technical sessions of oral and poster presentations. Kazu Ishimaru (Kioxia)
Best Paper Award, Best Student Paper Awards and Best Poster Awards will be selected. Masumi Saitoh (Kioxia)
Partial travel supports may be requested by students from the IEEE recognized Navakanta Bhat (IISc)
P. Susthitha Menon (UKM)
financially challenged countries to present their accepted papers at the conference.

PublicationsEDTM 2022 papers will be subjected to IEEE standard review processes and publishingguidelines. The accepted and presented papers will be published in the EDTM 2022
Proceedings included in IEEE Xplore. The authors of a selected number of high-impact
papers will be invited to submit extended versions for publication in the IEEE Journal of
Electron Devices Society (J-EDS), subjected to J-EDS review and publication policy.

Short Courses and Tutorials
EDTM 2022 will start with a set of short courses and tutorials on March 6th, 2022.
Tutorials teach selected topics from the basics to the state-of-the-arts, allowing theattendees to catch up a topic quickly. Short Courses discuss the latest research andchallenges on hot and advanced topics encompassing the EDTM 2022 Theme.

Exhibition
EDTM 2022 offers vendors to showcase their newest products and technologies,
allowing attendees to learn about new tools and techniques that can help them tosucceed at work.

Hitoshi Wakabayashi (Tokyo Tech.)
Masaharu Kobayashi (Univ. Tokyo)
Pei-Wen Li (NYCU)
Kensuke Ota (Kioxia)
Jhon Dallessase (UIUC)
Huaqiang Wu (Tsinghua Univ.)Iriya Muneta (Tokyo Tech.)
Bin Zhao (Iotelligent)Shuji Ikeda (tei Solutions)
Aabid Husain (Atomera)
T. J. King Liu (UC. Berkeley)
Meikei Ieong (HSMC)
Mukta Farooq (IBM)
Murty Polavarapu (BAE)
Merlyne de Souza (Univ. Sheffield)
Benjamin Iniguez (URV)
Edmundo A. Gutierrez-D (INAOE)
Secretariat:
JTB Communication Design, Inc.
Email: edtm@jtbcom.co.jp

Call forfor Papers
CallPapers
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6 IEEE Electron Devices Technology and2022

Original papers solicited in the following, but not limited to, technical areas:
Materials: All device-related materials, including semiconductors, magnetics, ferroelectrics, insulators, metals, liquid
crystals, photoresist, organic films, etching gas, filaments, and phase-changing materials. Materials engineering for
reducing costs, and improving reliability/yield/manufacturability. Smart materials enabling intelligent devices are highly
welcome.

Process, Tools, Yield, and Manufacturing: Semiconductor processes and equipment, including process modules(deposition, dry/wet etch, cleaning, planarization, isolation, dielectrics, metals, silicides, lithography, self-assemblytechniques), process integration, process control, equipment impact on devices/reliability, process sensing, processenhancement by AI/ML, etc. Topics on semiconductor manufacturing technologies and yield enhancement are highlywelcome, including clean-room management, wafer handling, uniformity of process, repeatability of tool, design-formanufacturability (DFM), design-for-test (DFT), defect density, yield management using sensing, connectivity, AI/ML andbig data techniques.
Semiconductor Devices: All semiconductor devices including Si/Ge CMOS, interconnects, compound semiconductors,oxide semiconductor, low-dimensional nanomaterials (van der Waals heterostructures, nanowires, nanotubes,nanosheets, quantum dots), ferroelectric, spintronics, 3D devices, RF/THz devices, etc. Emerging device concepts for futurecomputing are encouraged, such as tunnel FET, negative capacitance FET, topological insulators, phase transitions,
Qubit devices, etc.
Memory Technologies: All memories, including embedded/standalone memories, volatile/nonvolatile memories, inmemory/neuromorphic computing. Topics on charge-based memories, RRAM, MRAM, PCM, FeRAM, crosspoint/selectors, bio-inspired memory, regarding: scaling, processing, characterization, reliability, modeling, 3D integration,
read/write/erase, novel hierarchies/architectures for memory-centric computing.
Photonics, Imaging and Display: Topics on photonics, photonics for energy, optoelectronics, microwave photonics,
nano-photonics, optical sensor, optical communications/networking, optical switch, bio-photonics, lasers, optical systems,
imagers, display, and other emerging technologies in photonics, imaging and display.
Power and Energy Devices: Device technologies related to high-voltage devices, power/RF devices, energy harvesting
devices, photovoltaics, energy storage devices, discrete/integrated power devices, power modules/systems. Powerdevice structures such as diodes, BJTs, FETs, IGBTs. Power device materials such as wide bandgap and ultra-widebandgap materials (SiC, GaN, GaAs, AlN, GaO, etc.). Power device fabrication processes, modeling and simulation.
Modeling and Simulation: Advances in modeling/simulation of devices, packages, and processes, including numerical,
analytical, and statistical modeling/simulation of electronic, optical or hybrid devices, interconnects, heterogeneous
integration, parasitic elements, fabrication processes, physical phenomena, mechanical systems, electro-thermal effects,
test structures and methodologies.
Reliability: Advances in reliability of materials, processes, devices, modules and systems including interconnects, ESD,latch-up, soft errors, radiation, noises/mismatch, hot-carrier effects, self-heating, biasing/thermal instabilities, test
structures, methodologies, defect monitoring/control, electromagnetic robustness, and design-for-reliability.
Packaging and Heterogeneous Integration: Advances in packaging and heterogeneous integration technologies,
including 2.1D, 2.5D and 3D integrations. Topics on advanced packaging and manufacturing technologies, such as waferlevel packaging, chiplets, ultra-fine-pitch interconnection, sub-micron package-level wiring, optical/wireless interconnect,
power/sensor device packaging, controlling thermal-expansion coefficient, thermal management.

Sensor, MEMS, Bio-Electronics: Advances in sensors, transducers, actuators, MEMS/NEMS, resonators, micro/nanofluidic devices, bio-sensors, implantable biomedical devices, biomolecular-based memories, bio-transistors,
semiconductor synthetic biological devices/systems, semiconductor synaptic/neural devices, brain-inspired computing,brain-interface devices, and heterogeneous integration with CMOS, etc.
Flexible and Wearable Electronics: Topics on flexible and wearable electronics including flexible sensors, RFID, thinfilm transistors, lighting and display, energy harvesting/storage devices, materials for flexible electronics, etc.
Nanotechnologies: Advances in nanotechnologies including nanomaterials, nanoelectronics, low-dimensional systemsincluding 2D materials and devices, nanophotonics, nanofabrication, nanoenergy, nanobiomedicine, nanosensors, andrelated nano characterization/modelling techniques.

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Disruptive Technologies - IoT, AI/ML, Neuromorphic & Quantum Computing: Topics on disruptive technologies
including quantum computing, neuromorphic and bio-inspired computing, AI/ML, IoET, cloud/edge computing, etc.

Three-page camera-ready paper submission deadline: October 18th (Mon), 2021
Notification for Acceptance: End of December, 2021