EPO-TEK® H70E-2
Technical Data Sheet
For Reference Only
Thermally Conductive, Electrically Insulating Epoxy

Date:
Rev:
No. of Components:
Mix Ratio by Weight:
Specific Gravity:
Pot Life:
Shelf Life- Bulk:
Shelf Life- Syringe:

Recommended Cure: 150°C / 1 Hour

July 2019
VIITwo1:1Part A: 1.50
Part B: 2.30
2 Days
One year at room temperature
Six months at -40°C

Minimum Alternative Cure(s):May not achieve performance properties listed below
175°C / 1 Minute
150°C / 5 Minutes
120°C / 15 Minutes
80°C / 90 Minutes

NOTES:● Container(s) should be kept closed when not in use.
● Filled systems should be stirred thoroughly before mixing and prior to use.
● Performance properties (rheology, conductivity, others) of the product may vary from those stated on the data sheet when bi-pak/syringe packaging or
post-processing of any kind is performed. Epoxy’s warranties shall not apply to any products that have been reprocessed or repackaged from Epoxy’s
delivered status/container into any other containers of any kind, including but not limited to syringes, bi-paks, cartridges, pouches, tubes, capsules, filmsor other packages.

Product Description: EPO TEK® H70E-2 is a two component, thermally conductive electrically insulating epoxy designed for glob-topchip protection in TAB and COB die-attach technologies. It is used to prevent chips from being mechanically damaged during micropackage assembly and handling.
Typical Properties: Cure condition: 150°C / 1 Hour
Different batches, conditions & applications yield differing results.
Data below is not guaranteed. To be used as a guide only, not as a specification. * denotes test on lot acceptance basis
PHYSICAL PROPERTIES:* Color (before cure):* Consistency:* Viscosity (23°C) @ 20 rpm:
Thixotropic Index:* Glass Transition Temp:
Coefficient of Thermal Expansion (CTE):
Below Tg:
Above Tg:
Shore D Hardness:
Lap Shear @ 23°C:
Die Shear @ 23°C:
Degradation Temp:
Weight Loss:@ 200°C:@ 250°C:@ 300°C:
Suggested Operating Temperature:
Storage Modulus:
Ion Content:* Particle Size:

Part A: Black
Part B: Cream
Smooth thixotropic paste
9,000 - 15,000 cPs
1.7≥ 80 °C (Dynamic Cure: 20-200°C/ISO 25 Min; Ramp -10-200°C @20°C/Min)
2011265> 2,000≥5447Cl-:ELECTRICAL AND THERMAL PROPERTIES:
Thermal Conductivity:
Volume Resistivity @ 23°C:
Dielectric Constant (1KHz):
Dissipation Factor (1KHz):

x 10-6 in/in°C
x 10-6 in/in°C
psi
Kg
°C

1,778 psi

0.10
0.30
0.70
< 300
1,214,415
267 ppm≤ 50%%%°C (Intermittent)
psi

1.0≥ 8 x 1012
5.19
0.007

W/mKOhm-cm

microns

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com

EPO-TEK® H70E-2
Technical Data Sheet
For Reference Only
Thermally Conductive, Electrically Insulating Epoxy

EPO-TEK® H70E-2 Advantages & Suggested Application Notes:● The epoxy exhibits resistance against moisture, contamination and solvents which makeit an ideal glob top. See Technical Paper #24 in our library for process flow in TAB
packaging and reliability study – http://www.epotek.com/technical-papers.asp.
● A slightly thixotropic paste with excellent handling characteristics, pot life and short curingcycles. The rheology provides a dot-shape or dome configuration over wire-bonded die.
Capable of glob-top DAM-and-FILL, or single-dot glob-top.
● Suitable for mass production as semiconductor encapsulant; low temp cure 80°C
capable, controlled viscosity. Capable of many packages including TAB, COB, CSPs,
BGAs, DIP and TO-cans.
● Excellent adhesion to PCB, ferrous and non-ferrous metals, glass, ceramic, epoxy
package shells and semiconductor materials.
● Recommended for chip bonding, circuit repair, reinforce lead-frames, LSI chip packaging
and good heat dissipation.

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com