EPO-TEK® T7110
Technical Data Sheet
For Reference Only
Thermally Conductive, Room-Temperature Cure Epoxy

Date:
Rev:
No. of Components:
Mix Ratio by Weight:
Specific Gravity:
Pot Life:
Shelf Life- Bulk:

Recommended Cure: 80°C / 2 Hours

November 2019
VITwo
10 : 1
Part A: 2.28
Part B: 0.92
3.5 Hours
One year at room temperature

Minimum Alternative Cure(s):May not achieve performance properties listed below
150°C / 10 Minutes
100°C / 1 Hour
23°C / 3 DaysNOTES:● Container(s) should be kept closed when not in use.
● Filled systems should be stirred thoroughly before mixing and prior to use.
● Performance properties (rheology, conductivity, others) of the product may vary from those stated on the data sheet when bi-pak/syringe packaging or
post-processing of any kind is performed. Epoxy’s warranties shall not apply to any products that have been reprocessed or repackaged from Epoxy’s
delivered status/container into any other containers of any kind, including but not limited to syringes, bi-paks, cartridges, pouches, tubes, capsules, films
or other packages.
● Syringe packaging will impact initial viscosity and effective pot life, potentially beyond stated parameters.

Product Description: EPO-TEK® T7110 is a two component, thermally conductive, electrically insulating epoxy designed for heatsinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as
consumer, medical or optics.
Typical Properties: Cure condition: 80°C / 2 Hours
Different batches, conditions & applications yield differing results.
Data below is not guaranteed. To be used as a guide only, not as a specification. * denotes test on lot acceptance basis
PHYSICAL PROPERTIES:* Color (before cure):* Consistency:* Viscosity (23°C) @ 100 rpm:
Thixotropic Index:* Glass Transition Temp:
Coefficient of Thermal Expansion (CTE):
Below Tg:
Above Tg:
Shore D Hardness:
Lap Shear @ 23°C:
Die Shear @ 23°C:
Degradation Temp:
Weight Loss:@ 200°C:@ 250°C:@ 300°C:
Suggested Operating Temperature:
Storage Modulus:* Particle Size:

Part A: Grey
Part B: Clear/Colorless
Pourable paste
1,400 - 2,200 cPs
2.2≥ 40 °C (Dynamic Cure: 20-200°C/ISO 25 Min; Ramp -10-200°C @20°C/Min)
31142
91
1,932
≥ 10
314
0.40
0.66
1.78
< 250789,250≤ 50

ELECTRICAL AND THERMAL PROPERTIES:
Thermal Conductivity:
1.0
Volume Resistivity @ 23°C:≥ 2 x 1013
Dielectric Constant (1KHz):
5.69
Dissipation Factor (1KHz):
0.009

x 10-6 in/in°C
x 10-6 in/in°C
psi
Kg
°C

3,556 psi%%%°C (Intermittent)psimicrons
W/mK
Ohm-cmEpoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com

EPO-TEK® T7110
Technical Data Sheet
For Reference Only
Thermally Conductive, Room-Temperature Cure Epoxy

EPO-TEK® T7110 Advantages & Suggested Application Notes:● Low viscosity allows for bubble-free potting and encapsulation.
● Room temperature or low temperature cure (< 100°C) permits use in temperaturesensitive devices.
● Suggested Applications:o Semiconductor: capillary flow underfill for flip chip mounted die; possible glob top“fill” encapsulant.
o Electronics: heat sinking; thermally conductive potting and general protection of
PCB and SMDs; potting thermistors into cavities; potting and protection of resistor
coils or Peltier devices.
o Hybrids: potting power modules found in electronics such as cockpit, aerospaceand Rf/Microwave devices.
o Optical: encapsulation around copper coils found in nuclear, x-ray, and magnetic
imaging; heat sinking outdoor LCD / touch panels exposed to sunlight.
● Low exothermic chemistry during polymerization. This allows up to one liter to be cast or
potted in volumes. Contact techserv@epotek.com for the best cure schedule andsample preparation.

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com