SOLUTION SHEET

ThermechDIC System

Digital Image Correlation (DIC) system for warpage, CTE, andstrain measurement testing of electronic components

Warpage Semiconductor - 2D
overlay visualization of displacement (Z) in micrometers at atemperature level with four linegauges.

Accurate, full-field, warpage, CTE, and strain measurement ofelectronic components
The ThermechDIC is a complete DIC and warpage measurement system used for
optical, non-contact, thermal testing of electronic components, including but notlimited to; ball grid arrays (BGAs) packaging, flip-chip-packaging, printed circuitboards (PCBs), and solid-state drives (SSDs).
The system allows for accurate (sub-micron), full-field, 3D- contour (shape), displacement, and strain measurement for the determination of the Coefficient of Thermal
Expansion (CTE), warpage, and strain measured under a thermal (or cooling)load. The ThermechDIC is applicable measurement technology for the following
standards;•JESD22-B112B (Package Warpage Measurement of Surface-Mount Integrated
Circuits at Elevated Temperature)•JEITA ED-7306 (Measurement methods of package warpage at elevated 		temperature and the maximum permissible warpage

Key benefits•
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3D-measurement (X, Y & Z) of both contour (shape) and displacement forwarpage analysis
3D-measurement of strain & CTE determination
1 µm in-plane and out-of-plane resolution, respectively
Robust measurement technique, non-critical to rigid body motion (RBM)
i.e. from noise & vibration
Free-of-charge, plugin into AnsysTM for FEA Validation
Compatability with a stereoscopic microscope for FoV smaller than 15 x 15 mmWarpage Semiconductor – Graphsof the contour (shape) and displacement in Z-direction at eachtemperature level for Line 1 (-45°diagonal) with respect to positionof line gauge (micrometers).

One system, maximum versatility
The ThermechDIC system consists of a 3-camera Digital Image Correlation (DIC)
system, together with mounting with a; hot/cold stage, temperature controller,
liquid N2 cooling system, and dewar (Liquid N2 tank). Standardized componentsof the system include; cameras & lenses, DAQ Controller, Illumination System,
Calibration Targets, and Laptop PC.
The ThermechDIC can be mounted on either a; vertical mounting frame forsample sizes from 10x10 mm up to 40x40 cm, or a stereoscopic microscopefor sample sizes from 100x100 µm up to 15x15 mm. All hardware components
are otherwise identical between both setup configurations and as such, can beswapped and exchanged depending on application.

BGA solder ball inspected using aThermechDIC system with astereoscopic microscope 2D overlay
visualization of displacement (Z) in
micrometers at a temperature levelwith one line and one circle gauge.

Overview of the different components, timing, and data flow

A ThermechDIC system with a stereoscopic microscope (µDIC)

Measure with micron accuracy, in all 3-Dimensions
One of the many advantages of DIC, compared to using other techniques isthat DIC can measure full-shape contour & displacement in X, Y & Z, not justin the Z-direction, as with shadow moiré, digital fringe projection (DFP), andwhite light interferometry (profilometry). Additionally, DIC can measure 3D
strain, required for the determination of CTE.
The technique can also compensate for any Rigid Body Motion (RBM) that may
occur due to environmental noise/vibration. The resolution of DIC is dependent
on the working Field-of-View (Fov) and camera resolution. Assuming a 100 mmFoV, the in-plane and out-of-plane resolution can go down to +/-0.5 µm and +/1.0 µm, respectively.

Stereoscopic Microscope Setup forthe measurement of the CTE of aBGA.

Field-of-View (FoV) of a BGA showing the measured size of the balls
at 500 µm in size.

Page 2Easy-to-Use Software for Automated Measurement
Temperature loading profiles can be defined in the temperature controller
software as block function steps with temperature state conditions (suchas, ramp, hold & wait).
A profile can also be looped (i.e. repeated) for cyclic thermal loading.
Using analogue inputs provided by the temperature controller to the DAQ
controller, users can define a recording procedure in Istra4D that executes
camera acquisition triggers at each stable temperature state.
This can all be programmed in Istra4D to run in parallel/sync with thetemperature controller software, allowing automatic thermal cyclic loading
measurements to be acquired.

ThermechDIC being used to measure multiple components (at once)

A temperature loading profile
example showing the acquisition
step process of images at various
temperature states.

CTE & Warpage Measurement with the Thermal Chip
Application Scripting Modules
Dantec Dynamics has free application modules that give users the possibility
to analyse the Coefficient of Thermal Expansion (CTE) and warpage.
•The CTE Calculation Module allows users to determine the CTE basedon two or multiple different stable temperature stages with an automatic
temperature stage finder.

•The CTE Distribution Module allows users to analyze the coefficientof thermal expansion (CTE) for each single facet or use a combinationof multiple facets as a Virtual Strain Gauge (VSG) to provide a CTE
distribution map.

•The Warpage Application Module plots the Z-Contour & Z-Displacementof a chip at different temperature stages.

•IR-Camera Analysis Module v1 allows users to compare common points
between a DIC measurement and temperature measurement from anIR-camera.

Hot/cold stage, temperature controller, LiN2 controller, and LiN2tank (dewar)

Examples of the Thermal ChipAnalysis PackagePage 3

Technical specifications
ThermechDIC
Number of Cameras

2 or 3Sensor, Frame Rate &Interface

24.4 Mpx (5312 x 4600 px)@ 15 Hz USB3 CMOS

12.3 Mpx (4096 x 3000 px)@ 30 Hz USB3 CMOS

Std. Lens Focal Length

18 mm

Camera Setup Configuration

50 mm with Distance Rings

Std. Field-of-View (FoV)

200 mm (H) x 170 mm (V)Std. Distance-to-Object (DtO)

250 mm - 300 mm

Measurement PerformanceStd. Spatial
Resolution

2 cameras

49 µm/px

38 µm/px

3 cameras

275 µm/px

21 µm/px

Std. In-Plane
Resolution

2 cameras<1 µm<1 µm

3 cameras<1 µm<1 µm

1 µm – 5 µm

1 µm – 4 µm

1 µm – 3 µm

<1 µm – 2 µm

2 cameras
Std. Out-ofPlane Resolution 3 cameras

10 µstrain

Strain Resolution

Order information
ThermchDIC
Field-of-View

10x10 mm up to 40x40 cm

System Mounting &illumination

1x DSM 61020: ThermechDIC Mount System 1x DSM 61030: Stereoscopic Microscope
1x DSM 47100: XR-LED Illum Sys. (Red)(Opt. 1x DSM 47180: XR/XG-LED Polfilter)

Cameras2x or 3x100x100 µm up to 15x15 mm

2xDSM 15460: 12.3 Mpx USB3
Lenses & Optics

2 or 3DSM 192500: f=50mm Lens
DSM 50500: C-mount Dist. Rings(Opt. 1x DSM 50540: Lens Polar Filter)

1x DSM 61050:
1.0x Microscope Planapochromatic Lens

Heating Stages(Choose one)

1x DSM 61005: 10x10 cm ThermechDIC Hot/Cold Stage
1x DSM 61010: 20x20 cm ThermechDIC Hot/Cold Stage
1x DSM 61015: 30x30 cm ThermechDIC Hot/Cold Stage

Hardware

1x DM 24200: Laptop PC
1x DSM 25022: DAQ & Triggering Controller

Software1x DSM 32000: Istra4D Software Platform
1x DSM 32021: Istra4D Camera Acquisition Module
1x DSM 32050: Istra4D Advanced DAQ Triggering Module
1x DSM 32010: Istra4D 3D & 2D Correlation Evaluation Module
1x DSM 32060: Istra4D Graphical Visualization Module

Calibration Targets

1x DSM 50120: Gimbal Mount / 1x KL 50101: 10 mm / 1x KL 501015: 15 mm

1x KL 50102: 20 mm / 1x KL 50103: 30 mm /1x KL 50104: 40 mm / 1x KL 50106: 60 mm /1x KL 50210: 100 mm / 1x KL 50215:
150 mm / 1x KL 50220: 200 mm /1x KL 50230: 300 mm / 1x KL 50240: 400 mm

1x DSM 32090: Istra4D Microscope Cal. Module
1x KL 501001: 1 mm /1x KL 501002: 2 mm /1x KL 501003: 3 mm /1x KL 501005: 5 mm

Solution Sheet SS_0830_v3. Subject to change without notice. Copyright © 2024.
Dantec Dynamics. All Rights Reserved. www.dantecdynamics.com