Semiconductor andAdvanced Assembly Materials

Semiconductor and Advanced Assembly Materials
Wafer Bumping Fluxes:
Indium Corporation’s Semiconductor-Grade Wafer Bumping Fluxes are applied by jetting ordispense, followed by spin-coating to optimize film thicknesses. Reflowed in very low (<10ppm)
oxygen/nitrogen atmosphere, these fluxes convert rough, non-spherical plated or wafer
probe-dented solder bumps into shiny spheres. Proven applications include both copper pillar
microbumps and standard bumps from plated, reflowed solder paste or ball drop processes.
Flux
TypeFlux
TypeFlux Application
MethodDescription

TargetApplication

Cleaning
MethodHalogenfree?

Material

Roadmap orreleased product?

Wafer Bumping
SCFluxSpin coating

Liquid flux for reflow ofsolder bumps on UBMHigh Pb; Eutectic(63Sn/37Pb); SnAg

Solvent or aqueousbased chemistry

YES: NIA

Wafer Flux SC-5R

Released Q3, 2011

Wafer Bumping
WS
Flux

Spin coating

Liquid flux for reflow ofsolder bumps on UBM

SnAg solder bumps

Cleanable with warm
DI water only (nochemistry)

YES: NIA

Wafer Flux WS3401,
WS3543

Released Q2, 2009

Copper Pillar
Wafer Bumping WSFluxSpin coating

Liquid flux for reflow ofsolder micro bumps on
top of copper pillars

40micron pitch copperpillars (micro bumps)

Cleanable with warm
DI water only (nochemistry)

YES: NIA

Wafer Flux WS3401,
or combinationof WS3401 andWS3401A

Released Q1, 2011

Flip-Chip Fluxes:
Indium Corporation’s Semiconductor-Grade Flip-Chip Fluxes are applied by dipping or spraying
and reflowed in low-oxygen atmospheres – typically less than 25ppm oxygen/nitrogen. They
are designed for use in different applications, from 40micron pitch copper pillar 2.5D and 3Dchip-stack applications to standard solder bump/solder-on-pad (SOP) or solder bump/substratemetallization applications.

Standard Flip-Chip Fluxes
Flux
Type

Flux Type

Flux Application
MethodDescription

Target Application

Cleaning Method

Halogenfree?

180micron pitch SnAg
onto SOP

No-clean

YES: NIA

Flip-Chip
NC-NZR
Flux

Spraying

Flux sprayed onto substrate
for flip-chip attach

Flip-ChipWS
Flux

Spraying

Flux sprayed onto substrate
for flip-chip attach

Flip-Chip
WS
Flux

Dipping

Flip-Chip
WS
Flux

Dipping

Flip-Chip
NC-ULR
Flux

Dipping

Flip-Chip
NC-ULR
Flux

Dipping

Flux applied to the solder
bumps on a flip-chip bydipping
Flux applied to the solder
bumps on a flip-chip bydipping
Flux applied to the solder
bumps on a flip-chip bydipping
Flux applied to the solder
bumps on a flip-chip bydipping

165micron pitch SnAg onto
SOP for multicore logic
flip-chip die
Eliminates voiding fromprobe-test indents in flipchip bumps
Eliminates voiding fromprobe-test indents in flipchip bumps
General purpose flux:
compatible with underfill/overmolding compounds
Improved wetting onto
copper/OSP: compatible
with underfill/ overmolding
compounds

Cleanable withwarm DI water only
YES: NIA(no chemistry)
Cleanable with aqueous
surface-tension
Halogenatedlowering chemistry
Cleanable with aqueous
surface-tension
YES: NIA
lowering chemistry

Material

Roadmap orreleased product?

Flip-Chip Flux
FC-NC-HT-A1

Released Q3, 2009

Flip-Chip Flux
WS575-SP

Released Q2, 2011

Flip-Chip Flux
WS446

Released Q2, 2007

Flip-Chip Flux
WS688

To be released
Q1, 2012

No-clean

YES: NIA

Flip-Chip Flux
NC510

Released Q2, 2009

No-clean

YES: NIA

Flip-Chip Flux 26A

To be released
Q1, 2012

Cleaning Method

Halogenfree?

Material

Copper Pillar (Micro Bump) Flip-Chip Fluxes:
FluxTypeFlux Type

Flux Application
MethodDescription

CopperPillar
WS
Flip-Chip
Flux

Dipping

Flux for flip-chip attachof micro bumps+ onto
interposers

CopperPillar
NC-NZR
Flip-Chip
Flux

Dipping

Dippable liquid flux for flipchip attach of
microbumps onto
interposers

CopperPillar
NC-NZR
Flip-Chip
Flux

Spraying

Sprayable liquid flux for flipchip attach of
microbumps onto
interposers

Target Application
40micron pitch copper
pillars attachedto substrate using
thermocompression
bonding
40micron pitch copperpillars attachedto substrate using
thermocompression
bonding
40micron pitch copper
pillars

Roadmap or
released product?

Cleanable with aqueous
surface-tension
YES: NIA
lowering chemistry

Copper Pillar
Flip-Chip Flux
WS641

Released Q2, 2011

No-clean flux
compatible withthermocompression
bonding

YES: NIA

Developmentalflux 699-34-1

Roadmap: Q2, 2012

No-clean flux
compatible withthermocompression
bonding

YES: NIA

Experimental
product

Roadmap: Q3, 2012

Wafer Level Chip Scale Package (WLCSP) Fluxes:
Indium Corporation’s Semiconductor-Grade Wafer-Level Chip Scale Package Fluxes areapplied by screen or stencil printing. They are usually reflowed in atmospheres at less than
100ppm oxygen/nitrogen.
Flux Type
Wafer-Level
CSP BallMount Flux
Wafer-Level
CSP BallMount Flux
Wafer-Level
CSP BallMount Flux

Flux
Type

Flux Application
MethodDescription

WS

Printing

NC-ULR

Printing

EP

Printing

Water-soluble flux for
printing onto wafers
before balldrop
Ultra-low residue flux
for printing onto wafers
before balldrop
Epoxy flux for printing ontowafers before balldrop for
WL-CSP

Halogenfree?

MaterialRoadmap orreleased product?

Target Application

Cleaning Method0.5, 0.4, 0.3mm pitch
WL-CSP

Cleanable with warm DI
YES: NIA
water only (no chemistry)Ball-Attach Flux
WS575-A

Released Q3, 2011

0.1mm pitch and smaller
applications

No-clean

YES: NIA

Flip-Chip Flux 26A

Released Q4, 2011

0.5, 0.4, 0.3mm pitch
WL-CSP. Cured epoxy
compatible with underfill

No-clean

YES: NIA

Developmental
flux 669-56A

Roadmap: Q3, 2012

Epoxy Fluxes:
Non-filled epoxy fluxes are applied by jetting or dipping processes for WLCSP attach tosubstrates over prolonged timeframes. They allow “one process” reflow in tandem with solder
paste without subsequent underfill and curing. Epoxy fluxes are designed for air-reflow, but may
benefit from the use of nitrogen.
Flux TypeWL-CSP
Attach Flux
WL-CSP
Attach Flux
WL-CSP
Attach Flux

Flux
Type

Flux Application
MethodDescriptionEP

Jetting or dippingEP

Jetting or dippingEP

Jetting

Cleaning HalogenMethod free?
Material

Target Application

Jettable flux for 0.4-0.8mm
pitch WL-CSP
Jettable colored flux (blue) for
0.4-0.8mm pitch WL-CSP
Jettable colored flux for 0.3mm
pitch WL-CSP

Replaces solder paste and underfillfor SMT attach of WL-CSPs
Replaces solder paste and underfill
for SMT attach of WL-CSPs
Replaces solder paste and underfill
for SMT attach of WL-CSPs

No-clean

YES: NIA

No-clean

YES: NIA

No-clean

YES: NIA

Developmental
product 650-48
Developmental
product 669-64A
Experimental
product

Roadmap or
released product?
Roadmap: Q2, 2012
Roadmap: Q3, 2012
Roadmap: Q4, 2012

Package-on-Package (PoP) Fluxes:
No-clean PoP fluxes are applied by dipping, and can be used in both two-stage andone-stage reflow processes. They are almost always reflowed in air.
Flux Type

Flux Application
Flux Type Method

PoP Flux

NCDipping

PoP Flux

NCDipping

PoP Flux

NCDipping

Description
Dipping (PoP) flux fordown to 0.3mm pitch
Dipping (PoP) flux fordown to 0.3mm pitch
Dipping (PoP) flux fordown to 0.3mm pitch

Target Application
Flux for top (memory) packages
in flanged or TMV-type. Pb-freealloys only
Flux for top (memory) packages inflanged or TMV-type
High SIR flux for high reliability
PoP packages

Cleaning
MethodHalogenfree?

Material

Roadmap or
released product?

No-clean

Halogenated

PoP Flux 89-LV

Released Q4, 2009

No-clean

YES: NIAPoP Flux 89-HF-LV

Released Q4, 2009

YES: NIA

Experimental
product

Roadmap: Q3, 2012

No-cleanBall-Attach Fluxes:
Indium Corporation’s Semiconductor-Grade Ball-Attach Fluxes are applied by pin-transfer
or printing. They are usually reflowed in air, but are also suitable for use in reduced oxygen
atmospheres – typically less than 100ppm oxygen/nitrogen.
FluxType

Flux Application
MethodDescription

Ball-Attach
FluxWS

Pin-transfer

Pin-transfer flux for down
to 0.5mm pitch BGA

Ball-AttachFluxWS

Pin-transfer

Pin-transfer flux for down
to 0.5mm pitch BGA

Ball-AttachFluxNC

Pin-transfer

Ball-Attach
FluxNC

Pin-transfer

Flux Type

Pin-transfer flux for down
to 0.5mm pitch BGA. Wets
onto bare nickel
Pin-transfer flux for down
to 0.5mm pitch BGA. Wets
onto bare nickel

Halogenfree?

Cleaning Method

General purpose

Cleanable with warm DI
water only (no chemistry)

HalogenatedBall-Attach Flux
WS446-AL

Released Q3, 2008

Cleanable with warm DI
water only (no chemistry)

YES: Halogen
compliantBall-Attach Flux
WS676

To be released
Q1, 2012

No-clean

HalogenatedBall-Attach Flux
NC506

Released Q1, 2007

No-clean

YES: Halogen
compliantBall-Attach Flux
NC585

Released Q4, 2008

General purpose: nonstaining on low-cost BGA
substrate soldermask
Cost down BGA (no Agor Au plating needed on
CuNi substrate pads)
Cost down BGA (no Ag
or Au plating needed on
CuNi substrate pads)

Material

Roadmap orreleased product?

Target Application