EPO-TEK® H72
Technical Data Sheet
For Reference Only
Thermally Conductive Epoxy

Date:
Rev:
No. of Components:
Mix Ratio by Weight:
Specific Gravity:
Pot Life:
Shelf Life- Bulk:
Shelf Life- Syringe:

Recommended Cure: 150°C / 1 Hour

July 2019
VIITwo100 : 4
Part A: 2.01
Part B: 1.02
2 Hours
One year at room temperature
Six months at -40°C

Minimum Alternative Cure(s):May not achieve performance properties listed below
150°C / 5 Minutes
100°C / 20 Minutes
80°C / 2 HoursNOTES:● Container(s) should be kept closed when not in use.
● Filled systems should be stirred thoroughly before mixing and prior to use.
● Performance properties (rheology, conductivity, others) of the product may vary from those stated on the data sheet when bi-pak/syringe packaging or
post-processing of any kind is performed. Epoxy’s warranties shall not apply to any products that have been reprocessed or repackaged from Epoxy’s
delivered status/container into any other containers of any kind, including but not limited to syringes, bi-paks, cartridges, pouches, tubes, capsules, films
or other packages.
● Syringe packaging will impact initial viscosity and effective pot life, potentially beyond stated parameters.
● If product crystalizes in storage, place container in warm oven until crystallization disappears. Please refer to Tech Tip #7 on website.

Product Description: EPO-TEK® H72 is a two component, high Tg, thermally conductive and electrically insulating epoxy designed forsemiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies.
Typical Properties: Cure condition: 150°C / 1 Hour
Different batches, conditions & applications yield differing results.
Data below is not guaranteed. To be used as a guide only, not as a specification. * denotes test on lot acceptance basis
PHYSICAL PROPERTIES:* Color (before cure):* Consistency:* Viscosity (23°C) @ 10 rpm:
Thixotropic Index:* Glass Transition Temp:
Coefficient of Thermal Expansion (CTE):
Below Tg:
Above Tg:
Shore D Hardness:
Lap Shear @ 23°C:
Die Shear @ 23°C:
Degradation Temp:
Weight Loss:@ 200°C:@ 250°C:@ 300°C:
Suggested Operating Temperature:
Storage Modulus:* Particle Size:

Part A: Grey
Smooth paste
20,000-27,0001.2≥ 100

Part B: Amber

2913888> 2,000≥ 20476x 10-6 in/in°C
x 10-6 in/in°C

0.18
0.28
0.43
< 350759,931≤ 50%%%°C (Intermittent)psimicrons0.6≥ 1 x 1013
5.40
0.009

W/mK
Ohm-cmELECTRICAL AND THERMAL PROPERTIES:
Thermal Conductivity:
Volume Resistivity @ 23°C:
Dielectric Constant (1KHz):
Dissipation Factor (1KHz):

cPs°C (Dynamic Cure: 20-200°C/ISO 25 Min; Ramp -10-200°C @20°C/Min)

psi
Kg°C

7,112 psi

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com

EPO-TEK® H72
Technical Data Sheet
For Reference Only
Thermally Conductive Epoxy

EPO-TEK® H72 Advantages & Suggested Application Notes:● Suggested Applications:o Semiconductor/PCB: heat sinking, adhesion to Al, Cu, Al2O3; extra mechanicalprotection for SMDs.
o Hybrids: substrate attach of ceramic circuit to package. Underfill below
SMDs; staking large tantalum caps to ceramic substrates, lid sealing.
o Opto-electronics: sensor devices, sealing ferrule or fiber optic feed through,replacement of eutectic lid seal.
● Passes NASA low outgassing standard ASTM E595 with proper cure http://outgassing.nasa.gov/.
● Paste-like rheology allows for application by syringe dispensing, screen printing, pintransfer or by hand.
● Built in color change - from grey to amber - when cured properly.
● Possible to be snap cured in less than 5 minutes, at relatively low temperature.
● Alumina filler allows a toughened epoxy formulation that is very robust and hightemperature resistant● Highly resistant to most chemicals and solvents.

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com