EPO-TEK® H74
Technical Data Sheet
For Reference Only
Thermally Conductive Epoxy

Date:
Rev:
No. of Components:
Mix Ratio by Weight:
Specific Gravity:
Pot Life:
Shelf Life- Bulk:

Recommended Cure: 150°C / 1 Hour

September 2017
VIITwo100 : 3
Part A: 2.11
Part B: 1.02
2 Hours
One year at room temperature

Minimum Alternative Cure(s):May not achieve performance properties listed below
150°C / 5 Minutes
100°C / 20 Minutes

NOTES:● Container(s) should be kept closed when not in use.
● Filled systems should be stirred thoroughly before mixing and prior to use.
● Performance properties (rheology, conductivity, others) of the product may vary from those stated on the data sheet when bi-pak/syringe packaging or
post-processing of any kind is performed. Epoxy’s warranties shall not apply to any products that have been reprocessed or repackaged from Epoxy’s
delivered status/container into any other containers of any kind, including but not limited to syringes, bi-paks, cartridges, pouches, tubes, capsules, films
or other packages.
● Syringe packaging will impact initial viscosity and effective pot life, potentially beyond stated parameters.
● If product crystalizes in storage, place container in warm oven until crystallization disappears. Please refer to Tech Tip #7 on website.

Product Description: EPO-TEK® H74 is a two component, thermally conductive epoxy designed for hybrid circuit assembly including
die attach, substrate attach, lid-seal, heat dissipation, and hermetic sealing in general.
Typical Properties: Cure condition: 150°C / 1 Hour
Different batches, conditions & applications yield differing results.
Data below is not guaranteed. To be used as a guide only, not as a specification. * denotes test on lot acceptance basis
PHYSICAL PROPERTIES:* Color (before cure):* Consistency:* Viscosity (23°C) @ 5 rpm:
Thixotropic Index:* Glass Transition Temp:
Coefficient of Thermal Expansion (CTE):
Below Tg:
Above Tg:
Shore D Hardness:
Lap Shear @ 23°C:
Die Shear @ 23°C:
Degradation Temp:
Weight Loss:@ 200°C:@ 250°C:@ 300°C:
Suggested Operating Temperature:
Storage Modulus:* Particle Size:

Part A: Grey
Part B: Amber
Thixotropic paste
45,000-65,000 cPs
2.1≥ 100 °C (Dynamic Cure: 20-200°C/ISO 25 Min; Ramp -10-200°C @20°C/Min)

ELECTRICAL AND THERMAL PROPERTIES:
Thermal Conductivity:
Volume Resistivity @ 23°C:
Dielectric Constant (1KHz):
Dissipation Factor (1KHz):

2195901,656≥ 15425x 10-6 in/in°C
x 10-6 in/in°C
psi
Kg
°C

5,334 psi

0.29
0.50
0.80
< 350860,430≤ 50%%%°C (Intermittent)psimicrons

1.3≥ 4 x 1012
4.95
0.007

W/mK
Ohm-cmEpoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com

EPO-TEK® H74
Technical Data Sheet
For Reference Only
Thermally Conductive Epoxy

EPO-TEK® H74 Advantages & Suggested Application Notes:● Thixotropic paste allows for good handling characteristics - it can be dispensed, screen
printed or manually applied by toothpick or spatula.
● Outstanding high temperature properties and excellent solvent, chemical and moistureresistance.
● Reasonable working life with fast curing at relatively low temperatures.
● Capable of providing near-hermetic seal.
● Passes NASA low outgassing standard ASTM E595 with proper cure http://outgassing.nasa.gov/● Built-in color indicator when the product is cured. This color change varies from a tan tobrown, depending upon the curing conditions. It is normal for the epoxy to turn a very
dark red when subjected to wire bonding temperatures.
● Used in opto-packaging for sealing 1) fiber into the snout; 2) a ferrule seal to thepackage; or 3) a boot to the package. Commonly used with DIP or Butterfly packages orTO-cans.

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com