EPO-TEK® H70E-175
Technical Data Sheet
For Reference Only
Thermally Conductive Epoxy

Date:
Rev:
No. of Components:
Mix Ratio by Weight:
Specific Gravity:
Pot Life:
Shelf Life- Bulk:

Recommended Cure: 180°C / 1 Hour

November 2019
VIIITwo
1:1
Part A: 1.36
Part B: 1.92
2 Days
One year at room temperature

Minimum Alternative Cure(s):May not achieve performance properties listed below
150°C / 90 Minutes

NOTES:● Container(s) should be kept closed when not in use.
● Filled systems should be stirred thoroughly before mixing and prior to use.
● Performance properties (rheology, conductivity, others) of the product may vary from those stated on the data sheet when bi-pak/syringe packaging or
post-processing of any kind is performed. Epoxy’s warranties shall not apply to any products that have been reprocessed or repackaged from Epoxy’s
delivered status/container into any other containers of any kind, including but not limited to syringes, bi-paks, cartridges, pouches, tubes, capsules, films
or other packages.

Product Description: EPO-TEK® H70E-175 is a two component, thermally conductive, electrically insulating epoxy adhesive forsemiconductor, microelectronic and opto-electronic packaging. It may be used in aluminum heat sinking power devices in the form ofhybrid circuits or at the SMD/PCB level.
Typical Properties: Cure condition: 180°C / 1 Hour
Different batches, conditions & applications yield differing results.
Data below is not guaranteed. To be used as a guide only, not as a specification. * denotes test on lot acceptance basis
PHYSICAL PROPERTIES:* Color (before cure):* Consistency:* Viscosity (23°C) @ 20 rpm:
Thixotropic Index:* Glass Transition Temp:
Coefficient of Thermal Expansion (CTE):
Below Tg:
Above Tg:
Shore D Hardness:
Lap Shear @ 23°C:
Die Shear @ 23°C:
Degradation Temp:
Weight Loss:@ 200°C:@ 250°C:@ 300°C:
Suggested Operating Temperature:
Storage Modulus:* Particle Size:

Part A: Dark grey
Smooth paste
5,000 - 11,000
2.6
≥ 70

ELECTRICAL AND THERMAL PROPERTIES:
Thermal Conductivity:
Volume Resistivity @ 23°C:
Dielectric Constant (1KHz):
Dissipation Factor (1KHz):

Part B: Dark grey
cPs°C (Dynamic Cure: 20-200°C/ISO 25 Min; Ramp -10-200°C @20°C/Min)

2684
88> 2,000≥4392

x 10-6 in/in°C
x 10-6 in/in°C

0.59
1.38
3.28
< 300756,581≤ 20%%%°C (Intermittent)psimicrons0.3≥ 2 x 1013
4.72
0.012

W/mK
Ohm-cmpsi
Kg°C

1,422 psi

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com

EPO-TEK® H70E-175
Technical Data Sheet
For Reference Only
Thermally Conductive Epoxy

EPO-TEK® H70E-175 Advantages & Suggested Application Notes:● Semiconductor: die attaching chips to lead-frames or ceramic microcircuit substrates.
● Hybrid packaging: dielectric and thermal adhesive for microwave and military circuits;
reinforcing capacitor and resistor SMD attach.
● PCB: bonding aluminum heat sinks; die-attaching IC’s via COB format.
● Optical: heat sinking laser diodes and fiber optic components; adhesive for the opticalbench.

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com