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Aug.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

HIROSE ELECTRIC CO.,LTD

DF40 Series Guideline for
Designing and Handling
DF40 SERIES CONNECTOR BOARD TO FPC,
0.4mm PITCH, 1.5 to 4.0mm MATED HEIGHT SMD

DATE: Aug.7 2014

Version 7

PAGE 1 of 16

DF40 Series Guideline for Designing and Handling

Version

7.0

AuthorT.Yasui

ApproverK.IkedaChange History

VersionDate

Handled byCommentsst

1.0

12/13/2007

Y. Hasegawa

1

Draft

2.0

12/18/2007

T.Suzuki

3.0

1/19/2008

T.Suzuki

Added Recommended Record

4.0

11/1/2011

T.Yunoki

Added H:2.5mm – 4.0mm

5.012/21/2012

Y.Michida1.1.6 0.3mm→0.2mm

6.0

1/27/2014

T.Yasui

7.0

8/7/2014

T.Yasui

Added Recommended Board Washing and Methodof Storing Connector

Added operation to avoid half mating to 3.1
Connector mating operation
Revised recommended stiffner thickness 0.5mm for
60 position

Copyright© 2007 Hirose Electric Co., Ltd. All rights reserved.

TITLEHIROSE ELECTRIC CO.,LTD

OBJECTPRODUCT

DF40 Series Guideline for
Designing and Handling
DF40 SERIES CONNECTOR BOARD TO FPC,
0.4mm PITCH, 1.5 to 4.0mm MATED HEIGHT SMD

DATE: Aug.7 2014

Version 7

PAGE 2 of 16

TABLE OF CONTENTS
PAGE NUMBER
1 Design requirements ..............................................................................................................................................3
1.1 Mechanical requirements.................................................................................................................................3
1.1.1 FPC mounting ...........................................................................................................................................3
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1.1.2 Unexpected disengaging prevention ........................................................................................................3
1.1.3 FPC fixing..................................................................................................................................................4
1.1.4 Allocation of other components around the connector .............................................................................4
1.1.5 FPC alignment marking for mating ...........................................................................................................5
1.1.6 Precautions for PWB to PWB connection.................................................................................................5
1.1.7 Selection of connector mounting machine and notice for mounting.........................................................5
1.2 PWB requirements...........................................................................................................................................6
1.2.1 Recommended PWB pattern ....................................................................................................................6
1.2.2 PWB pad layout and connector location...................................................................................................7
1.2.3 PWB designing..........................................................................................................................................7
1.2.4 FPC designing...........................................................................................................................................7
2 Mounting requirements...........................................................................................................................................8
2.1 Metal mask.......................................................................................................................................................8
2.2 Fillet forming ....................................................................................................................................................9
2.3 Reflow profile .................................................................................................................................................10
2.4 Rework process (hand soldering)..................................................................................................................11
3 Connector handling requirements ........................................................................................................................12
3.1 Connector mating operation ..........................................................................................................................12
3.2 Connector unmating operation ......................................................................................................................13
4 PWB and solder paste applied for evaluation test ...............................................................................................14
4.1 PWB applied for evaluation test ....................................................................................................................14
4.2 Solder paste applied for evaluation test ........................................................................................................15
5 Additional information ...........................................................................................................................................16
5.1 PWB cleaning ................................................................................................................................................16
5.2 PWB handling ................................................................................................................................................16
5.3 Connector storage .........................................................................................................................................16

Copyright© 2007 Hirose Electric Co., Ltd. All rights reserved.

TITLEHIROSE ELECTRIC CO.,LTD

1

OBJECTPRODUCT

DF40 Series Guideline for
Designing and Handling
DF40 SERIES CONNECTOR BOARD TO FPC,
0.4mm PITCH, 1.5 to 4.0mm MATED HEIGHT SMD

DATE: Aug.7 2014

Version 7

PAGE 3 of 16

Design requirements
1.1 Mechanical requirements
1.1.1 FPC mounting

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Attachment of a stiffener larger than the connector outline is recommended to the reverse face of theconnector mounted area. Solder crack and contact looseness could occur due to the possible
mechanical stress applied to contacts during unmating process when this product is mounted onto
low-rigidity or thin FPC. Under the circumstances, mount plug connector of which retention force ishigher than the other to the FPC. 0.3 mm or thicker glass epoxy stiffener (up to 50 pin), and 0.5mm or
thicker glass epoxy stiffener (over 60 pin) is recommended.

1.1.2 Unexpected disengaging prevention
Connector could be disengaged if momentary impact, caused by dropping etc., is applied to theconnectors in use. In order to prevent connectors from disengaging, make sure to place a buffermaterial such as sponge to press down the connectors in mating direction.

Copyright© 2007 Hirose Electric Co., Ltd. All rights reserved.

DF40 Series Guideline for
Designing and HandlingTITLE

HIROSE ELECTRIC CO.,LTD

OBJECTPRODUCT

DF40 SERIES CONNECTOR BOARD TO FPC,
0.4mm PITCH, 1.5 to 4.0mm MATED HEIGHT SMD

DATE: Aug.7 2014

Version 7

PAGE 4 of 16

1.1.3 FPC fixing
For FPC alignment by guide posts, do not disturb FPC flexibility. Design without flexibility of FPC

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could apply direct stress to the connector by drop impact etc.

EX) Inflexible FPC positioning with guide posts on chassis as shown above disturbs flexibility to thedirections indicated by arrows.
1.1.4 Allocation of other components around the connector
Do not locate any other components which may affect on connector mating around the connectors.

Not recommended

Copyright© 2007 Hirose Electric Co., Ltd. All rights reserved.

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Designing and HandlingTITLE

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OBJECTPRODUCTDATE: Aug.7 2014

Version 7

DF40 SERIES CONNECTOR BOARD TO FPC,
0.4mm PITCH, 1.5 to 4.0mm MATED HEIGHT SMD

PAGE 5 of 16

1.1.5 FPC alignment marking for mating
Marking onto the opposite PWB from the FPC side for indicating the exact mating position isrecommended to support mating without misalignment during mating operation of FPC side to theAug.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

PWB side.

Recommended
1.1.6 Precautions for PWB to PWB connection
In order to connect PWB to PWB, precision of necessary components and mounter or screw fitting isrequired, and direct stress to the connector is avoidable. Avoid fixing PWBs with connecters only, andstabilize them with other tools.
Keep connector warpage within 0.02 mm in connector longitudinal direction.
1.1.7 Selection of connector mounting machine and notice for mounting
Pay attention to the vacuum pick up area and position precision. For chucking pick and place, priorconfirmation is necessary to avoid connector deformation caused by excessive chucking force.
Confirmation prior to your manufacturing is necessary.

Copyright© 2007 Hirose Electric Co., Ltd. All rights reserved.

DF40 Series Guideline for
Designing and HandlingTITLE

OBJECTPRODUCTHIROSE ELECTRIC CO.,LTD

DATE: Aug.7 2014

Version 7

DF40 SERIES CONNECTOR BOARD TO FPC,
0.4mm PITCH, 1.5 to 4.0mm MATED HEIGHT SMD

PAGE 6 of 16

1.2 PWB requirements
1.2.1 Recommended PWB pattern

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Recommended PWB pad layout for receptacle (ex. 40 pos.)

Y dimension
H=1.5, 2.0mm: 1.5mmMAX
H=2.5~4.0mm: 0.92mmMAX

Patterning of different signals is unacceptable on the area indicated by “Recommended PWB pad layout for plug (ex. 40 pos.)

Copyright© 2007 Hirose Electric Co., Ltd. All rights reserved.

“.

TITLEHIROSE ELECTRIC CO.,LTD

OBJECTPRODUCT

DF40 Series Guideline for
Designing and Handling
DF40 SERIES CONNECTOR BOARD TO FPC,
0.4mm PITCH, 1.5 to 4.0mm MATED HEIGHT SMD

DATE: Aug.7 2014

Version 7

PAGE 7 of 16

1.2.2 PWB pad layout and connector location

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Pad layout and connector position for receptacle

Pad layout and connector position for plug

1.2.3 PWB designing
Design PWB layout properly so that front, back and side fillets are formed.
By applying the recommended PWB layout, optimum retention force can be obtained between
connector and PWB.

Solder wicking and flux penetration could occur by applying different PWB layout from therecommended. Please contact us for the different PWB pattern from the recommended PWB layout.

Although standoff is provided, interference to the connector body by pattern, via hole and solder
resist beneath the connector may cause solder defects and poor fillet formation.
1.2.4 FPC designing
Diversity of coefficient thermal expansion in FPC and stiffener materials may cause FPC warpage andmounting failure. Confirmation prior to your manufacturing is necessary.
Copyright© 2007 Hirose Electric Co., Ltd. All rights reserved.

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Designing and HandlingTITLE

HIROSE ELECTRIC CO.,LTD

2

OBJECTPRODUCT

DF40 SERIES CONNECTOR BOARD TO FPC,
0.4mm PITCH, 1.5 to 4.0mm MATED HEIGHT SMD

DATE: Aug.7 2014

Version 7

PAGE 8 of 16

Mounting requirements
2.1 Metal mask design

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Recommended metal mask dimensions for receptacle (ex. 40 pos.)

Recommended soldering paste amount: 0.0135 mm 3 (Per 1 Pad)
Recommended metal mask dimensions for plug (ex. 40 pos.)

Recommended soldering paste amount: 0.0121 mm 3 (Per 1 Pad)
Recommended metal mask thickness and open ratio
Open ratio: 80 % (of the recommended PWB layout)
Metal mask thickness: 0.12 mm
NOTE: Solder paste amount beyond the recommendation may cause solder wicking and flux
penetration. Please contact us when the soldering condition needs to be different from therecommended condition.

Copyright© 2007 Hirose Electric Co., Ltd. All rights reserved.

DF40 Series Guideline for
Designing and HandlingTITLE

HIROSE ELECTRIC CO.,LTD

OBJECTPRODUCT

DF40 SERIES CONNECTOR BOARD TO FPC,
0.4mm PITCH, 1.5 to 4.0mm MATED HEIGHT SMD

DATE: Aug.7 2014

Version 7

PAGE 9 of 16

2.2 Fillet forming
For the judgment of fillet forming quality, check side fillet forming as an indication.

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Fillet forming on receptacle

Recommended condition is that fillet thickness is one third of contact thickness (0.13 mm) or more,
and solder is wetted completely.
Fillet forming on plug

Recommended condition is that fillet thickness is one third of contact thickness (0.13 mm) or more,
and solder is wetted completely.

Copyright© 2007 Hirose Electric Co., Ltd. All rights reserved.

DF40 Series Guideline for
Designing and HandlingTITLE

HIROSE ELECTRIC CO.,LTD

OBJECTPRODUCT

DF40 SERIES CONNECTOR BOARD TO FPC,
0.4mm PITCH, 1.5 to 4.0mm MATED HEIGHT SMD

DATE: Aug.7 2014

Version 7

PAGE 10 of 16

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2.3 Reflow profile

1) Temperature measuring point
The temperature indicates the PWB surface temperature at the connector lead area.
2) Reflow cycles
Up to 2 cycles of reflow soldering are acceptable under the recommended reflow profile of DF40
Series.
3) Reflow heating method and condition
Far-infrared heater and hot convective blowers used in combination, normal atmosphere, or
nitrogen atmosphere.
Please contact us for oxygen density in nitrogen atmosphere reflow.
4)

For the printing of soldering paste, screen printing method is recommended.
Copyright© 2007 Hirose Electric Co., Ltd. All rights reserved.

DF40 Series Guideline for
Designing and HandlingTITLE

HIROSE ELECTRIC CO.,LTD

OBJECTPRODUCT

DF40 SERIES CONNECTOR BOARD TO FPC,
0.4mm PITCH, 1.5 to 4.0mm MATED HEIGHT SMD

DATE: Aug.7 2014

Version 7

PAGE 11 of 16

2.4 Repairing (hand soldering)
Receptacle

Plug
Repairing condition:

Repairing condition:
Soldering iron 350 C, 3 seconds MAX.

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Soldering iron 350 C, 3 seconds MAX.

Do not apply stress to the terminals.

Do not apply stress to the terminals.

Avoid touching housing with a soldering iron.

Avoid touching housing with a soldering iron.

Raise of solder paste

It may affect on mating that thesoldering paste height is 0.17 mmof more from the upper surface ofthe plug contact.

Excessive solder paste or wire solder for repairing may cause raise of solder paste on the plug
contact lead. The raise of solder paste may affect on distance of PWBs or performance of springcontact of the receptacle.

Copyright© 2007 Hirose Electric Co., Ltd. All rights reserved.

DF40 Series Guideline for
Designing and HandlingTITLE

HIROSE ELECTRIC CO.,LTD

3

OBJECTPRODUCT

DF40 SERIES CONNECTOR BOARD TO FPC,
0.4mm PITCH, 1.5 to 4.0mm MATED HEIGHT SMD

DATE: Aug.7 2014

Version 7

PAGE 12 of 16

Connector handling requirements
3.1 Connector mating operation
Make sure to mate DF40 Series connectors by hands.
Mating procedures

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1) Feel for the mating guide with hands to locate the connectors in the appropriate mating position.

2) When positioned, the connector is led into the mating pair by self alignment function.

3) Once aligned, the connector pair does not move back and forth and around as they are located ina parallel position. Mate the connectors completely by applying force in this condition.
We recommend to push the connector with two fingers for 50 pins or more to press down thewhole connector evenly. One end might not be inserted enough to result in half mating for high pin
counts.

4) Make sure that the connectors are mated completely. When the PWBs are not parallel, unmate
the connector, and then mate them again according to the above procedures from the beginning.
Copyright© 2007 Hirose Electric Co., Ltd. All rights reserved.

DF40 Series Guideline for
Designing and HandlingTITLE

HIROSE ELECTRIC CO.,LTD

OBJECTPRODUCT

DF40 SERIES CONNECTOR BOARD TO FPC,
0.4mm PITCH, 1.5 to 4.0mm MATED HEIGHT SMD

DATE: Aug.7 2014

Version 7

PAGE 13 of 16

3.2 Connector unmating operation
1) It is desirable to unmate the connector vertically to the mounted surface. However, in the PWB to
FPC connection, the higher the pin counts, and the thinner the FPC is, the more difficult to unmate

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the connector in vertical direction.

2) When vertical removal is difficult, lift up either side of longitudinal, contact pitch direction. Do not
unmate the connector in connector width direction otherwise the contacts could receive greatstress.

3) Check the rigidity of the FPC for unmating operation prior to your production, otherwise solder
breakage and/or connector breakage may occur during unmating process. Lift up the corner of the
FPC could apply over stress to the contacts.

Copyright© 2007 Hirose Electric Co., Ltd. All rights reserved.

DF40 Series Guideline for
Designing and HandlingTITLE

HIROSE ELECTRIC CO.,LTD

4

OBJECTPRODUCT

DF40 SERIES CONNECTOR BOARD TO FPC,
0.4mm PITCH, 1.5 to 4.0mm MATED HEIGHT SMD

PWB and solder paste applied for evaluation test
4.1 PWB applied for evaluation test

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Glass epoxy board for receptacle

FPC for plug

Copyright© 2007 Hirose Electric Co., Ltd. All rights reserved.

DATE: Aug.7 2014

Version 7

PAGE 14 of 16

DF40 Series Guideline for
Designing and HandlingTITLE

HIROSE ELECTRIC CO.,LTD

OBJECTPRODUCT

DF40 SERIES CONNECTOR BOARD TO FPC,
0.4mm PITCH, 1.5 to 4.0mm MATED HEIGHT SMD

Aug.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

Glass epoxy board for plug

FPC for receptacle

4.2 Solder paste applied for evaluation test
Lead-free solder paste manufactured by Senju Metal Industry Co., Ltd.
M705-GRN360-K2-V

Copyright© 2007 Hirose Electric Co., Ltd. All rights reserved.

DATE: Aug.7 2014

Version 7

PAGE 15 of 16

DF40 Series Guideline for
Designing and HandlingTITLE

HIROSE ELECTRIC CO.,LTD

5

OBJECTPRODUCT

DF40 SERIES CONNECTOR BOARD TO FPC,
0.4mm PITCH, 1.5 to 4.0mm MATED HEIGHT SMD

DATE: Aug.7 2014

Version 7

PAGE 16 of 16

Additional information
5.1 PWB cleaning
1) Control the cleaning liquid in order not to contaminate the connector contact area by cleaning
liquid.

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2) Some cleaning liquid is too strong and may dissolve connectors. Cleaning liquid made from purewater is recommended. Before using other cleaning liquid, please contact us.
3) Alcohol cleaning could make the connector housing white.
5.2 PWB handlingIn the operation which could give stress to the mounted connector, including cutting or bending PWB,
keep soldering area from mechanical stress.
5.3 Connector storage
1) Void could be occurred on the housing surface due to high heat during reflow. In order to prevent
this problem, avoid storing connectors under humid condition. For long term storage, keep themat humidity manageable place.
2) Depending on the production LOT of the connector, its housing color could be varied, or ultraviolet
during storage changes connector surface color. However, these color differences do not affectthe connector performance.
3) During PWB assembly and module assembly, make sure not to apply excessive stress to thestored connectors.
4) Avoid storing connectors in dusty area, or it could cause contact failure.

Copyright© 2007 Hirose Electric Co., Ltd. All rights reserved.