Sure-Form Gap Filling Gel
Product Code: 52057

TECHNICAL DATA SHEET
Developmental Product Description
AOS Sure-Form Gap Filling Gel 52057 is a one part, non-silicone, synthetic-based thermal grease that is twice as conductive as our52022. This gray product is very tacky, resists vibration and shock, will stay in place and not run, even under elevated use
temperatures. This product is very viscous. The initial yield point is very high. The material will flow under higher shear, will
increase in viscosity slightly over time and will cure at the air exposed edges while remaining compliant in the interface providing
excellent long term stability. This solid is able to withstand temperatures in excess of 180 oC for short periods of time. 52057 wasdeveloped by AOS in response for a moderately priced product that adheres very well initially and stays put in place while still
providing increased thermal transfer efficiency. The material appears compatible with most electronic materials. The material does
not phase separate.
Product Features & Benefits• AOS 52057 retains all the unique advantages of AOS Heat Sink Compound (Product Code: 52038) with the added benefit of hightemperature use. The non-silicone, “no creep” feature extends OEM service life. It is compatible with most metal and plasticcomponents. It has a five year minimum shelf life in its unopened container. Additional benefits include excellent thermal
conductivity and thermal resistance over a wide operating temperature range.
•AOS 52057 is a much more cost effective gap filling solution compared to pre-formed gap pads. The product has considerably
greater thermal conductivity than our standard non-silicone thermal grease, and can be modified by customer request.

Typical Properties
ValueProperty
Specific Gravity, @ 25°C
Bleed, @ 200°C, 24 Hrs., %/Wt
Evaporation, @ 200°C, 24 Hrs., %/Wt.
Thermal Conductivity, @ 36°C
W/m-K
Thermal Resistance, @ 50 oCoC/W
Anticipated Minimum Bond Line (mils)
Based on filler Dimensions
Electrical Properties
Dielectric Strength, 0.05” gap, V/mil
Dielectric Strength after exposure to85°C/85% R.H. for 48 hours
Dielectric Constant, 25°C @ 1,000 Hz
Dissipation Factor, 25°C @ 1,000 Hz
Volume Resistivity, ohm-cm
Operating Temperature Range
Flow Rate grams/min (2 mm orifice @ 50
psi/min. @ 74 ± 2°°F). Newtonian Flow
Appearance

Test Method

2.500

ASTM D-70
FTM-321 MODIFIED
FTM-321 MODIFIED

1.7

ASTM D-5470-06 @ (1, 2, 5,and 20 mils)
Oracle TTV model
270-7806-01

0.1740
5 mil
318
212

ASTM D-149

5.00.0027
2.15 x 1015
-40°C to 180°C
3-6

ASTM D-150
ASTM D-150
ASTM D-257
AOS METHOD

Gray Paste

22 Meridian Road, Suite 6, Eatontown, New Jersey 07724
732-389-5514 • fax 732-389-6380 • e-mail sales@aosco.com • web http://www.aosco.com
Please know that customers are responsible for testing AOS Thermal Compounds materials for their proposed use. Any information furnished by AOS Thermal Compounds and its agents is believed to bereliable, but AOS Thermal Compounds does not guarantee the results to be accurate and makes no warranties as to the fitness, merchantability, or suitability of any AOS material or product for any specificor general use and shall not be held liable for incidental or consequential damages of any kind.
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