EPO-TEK® H20E-175
Technical Data Sheet
For Reference Only
Electrically Conductive, Silver Epoxy

Date:
Rev:
No. of Components:
Mix Ratio by Weight:
Specific Gravity:
Pot Life:
Shelf Life- Bulk:

Recommended Cure: 180°C / 1 Hour

November 2019
VIITwo1:1Part A: 2.44
Part B: 3.07
3.5 Days
One year at room temperature

Minimum Alternative Cure(s):May not achieve performance properties listed below
150°C / 2 HoursNOTES:● Container(s) should be kept closed when not in use.
● Filled systems should be stirred thoroughly before mixing and prior to use.
● Performance properties (rheology, conductivity, others) of the product may vary from those stated on the data sheet when bi-pak/syringe packaging or
post-processing of any kind is performed. Epoxy’s warranties shall not apply to any products that have been reprocessed or repackaged from Epoxy’s
delivered status/container into any other containers of any kind, including but not limited to syringes, bi-paks, cartridges, pouches, tubes, capsules, films
or other packages.

Product Description: EPO-TEK® H20E-175 is a two component epoxy designed for semiconductor die-attach. It is a higher Tg
version of EPO-TEK® H20E. It was designed to be used in semiconductor / JEDEC packaging, microelectronic packaging of hybrids,
as well as high temperature devices and assembly.
Typical Properties: Cure condition: 180°C / 1 Hour
Different batches, conditions & applications yield differing results.
Data below is not guaranteed. To be used as a guide only, not as a specification. * denotes test on lot acceptance basis
PHYSICAL PROPERTIES:* Color (before cure):* Consistency:* Viscosity (23°C) @ 100 rpm:
Thixotropic Index:* Glass Transition Temp:
Coefficient of Thermal Expansion (CTE):
Below Tg:
Above Tg:
Shore D Hardness:
Lap Shear @ 23°C:
Die Shear @ 23°C:
Degradation Temp:
Weight Loss:@ 200°C:@ 250°C:@ 300°C:
Suggested Operating Temperature:
Storage Modulus:* Particle Size:

Part A: Silver
Part B: Silver
Smooth thixotropic paste
2,800 - 3,800 cPs
3.1≥ 85 °C (Dynamic Cure: 20-250°C/ISO 25 Min; Ramp -10-250°C @20°C/Min)

ELECTRICAL AND THERMAL PROPERTIES:
Thermal Conductivity:* Volume Resistivity @ 23°C:

2088701,292≥ 10450x 10-6 in/in°C
x 10-6 in/in°C
psi
Kg
°C

3,556 psi

0.05
0.110.25< 350628,212≤ 45%%%°C (Intermittent)psimicrons2.0≤ 0.0004

W/mK
Ohm-cmEpoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com

EPO-TEK® H20E-175
Technical Data Sheet
For Reference Only
Electrically Conductive, Silver Epoxy

EPO-TEK® H20E-175 Advantages & Suggested Application Notes:● Thixotropic paste-like rheology allows for high speed dispensing and screen printing
operations. It can also be applied by hand techniques using spatula, toothpick, orstamping chuck.
● Suggested for Rf/Microwave device packaging found in military, commercial, aerospaceand cockpit, and industrial (down-hole petrochemical) circuits.
● > 3 day pot-life allows for mass production yielding low waste.

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com