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Executive Summary

Table of Contents
Executive Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
What's New with Supermicro X14 Products . . . . . . . . . . . 3
Supermicro System Advantages . . . . . . . . . . . . . . . . . . . . . . 8Intel Xeon 6 Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Generation to Generation Comparison . . . . . . . . . . . . . . . . 9
Summary and Further Information . . . . . . . . . . . . . . . . . . . 10

© 2024 Copyright Super Micro Computer, Inc. All rights reserved

Supermicro, a Total IT Solution Provider for AI, HPC, Cloud,Storage, and 5G/Edge, delivers a wide range of servers that areworkload-optimized. The Supermicro product portfolio
includes multi-node servers that share power supplies andcooling technology, the highest performing rack mountservers, GPU optimized servers, and specifically designed
systems for use at the edge. Within each product family, there
are a number of options, such as the number of storage
devices, memory, CPUs, and network capacities. Supermicro
designs and manufactures a wide range of servers that are built
on the latest technologies. Typically, Supermicro is first to
market with CPU and GPU servers, storage servers, andworkstations built with the newest technologies.

June 2024

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Supermicro Plug-and-Play Deployment at Scale

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Supermicro, with worldwide manufacturing facilities, is a leader in supplying enterprises and cloud service providers with thelatest server technology. Racks and clusters are delivered ready to operate with a Plug-and-Play design, requiring the user tosimply uncrate and plug into power and networking infrastructures. This concept consists of a number of integration services:•

Consultation – once a project has been identified, a dedicated project manager is assigned to work with the customer
through delivery and beyond.

•

Design – expert product managers work with the customer to identify the most optimized systems, storage, software,and networking to ensure a reduced TCO once installed in a data center.

•

Assembly – the entire cluster is assembled in one of Supermicro's worldwide facilities, including liquid-cooling if
needed.

•Testing – the entire cluster is tested at the L12 level, according to industry standards, with additional testing as
specified by the customer.

•

Deployment – dedicated and experienced Supermicro and partner employees can assist with the deployment of theclusters at the customer site, including networking and complete application testing.

•Support – Ongoing maintenance and support are offered to ensure the entire data center operates smoothly and as
specified, with agreed upon SLAs.

With the new Intel Xeon 6 Processors, further optimization is now possible, incorporating specially architected CPUs for different
workloads.
There are two main product lines for the Intel Xeon 6 processors. Briefly, this includes:•

Intel Xeon 6 processors with E-cores –Efficient Cores: These CPUs are designed with significant performance per watt
improvement over previous generations of Intel Xeon processors. The primary workloads for this processor can be
categorized as cloud-native and scale-out workloads, where the high core count and low energy usage are critical.
Performance per watt is the primary goal of these CPUs.

•

Intel Xeon 6 processors with P-cores – Performance Cores: The P-core products refers to CPUs with performance percore as the primary goal of the CPU. P-cores are designed for the highest performance in a core and excel when an
application is required to perform very well. HPC, AI, and Analytics will excel with the Intel Xeon 6 processors with PCores.

© 2024 Copyright Super Micro Computer, Inc. All rights reserved

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What's New with Supermicro X14 Products?

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Supermicro X14 systems are designed for a range of workloads and take advantage of the latest system level technologies.
Supermicro's X14 portfolio with Intel Xeon 6 processors with E-cores are applications optimized for different workloads. Usinga building block architecture, Supermicro is able to offer a wide range of servers designed for various applications. Included in
the Supermicro X14 server portfolio with Intel Xeon 6 processors are:Multi-Node Servers
Multi-Node servers from Supermicro give customers several benefits, including a very high core density per rack and up to34,560 cores of Intel Xeon 6 processors with E-Cores. Shared power and cooling fans which can help to reduce the PUE in adata center. These product families are available with increased storage performance and density using the latest E1.S and
E3.S NVMe storage devices.
SuperBlade® – 8U: Future-proof, Resource-saving Architecture
Supermicro's high-performance, density-optimized, and energy-efficient SuperBlade® can significantly reduce initial capitaland operational expenses for enterprises and data centers. SuperBlade® utilizes shared, redundant components, including
power supplies, cooling fans, chassis management modules (CMMs), integrated switches, or pass-thru modules to deliver themost cost-effective, green computing solutions. The X14 8U SuperBlade® architecture maximizes rack density, with up to 120
dual-processor servers in a 48U rack. The number of cables are reduced by up to
95% when compared to rackmount servers. Optional direct liquid cooling (DLC)
can support the highest Intel Xeon 6 TDP CPU SKUs to achieve the lowest PUEwith the best TCO in the data center.

Key Applications: AI Inferencing / Hybrid andPrivate Cloud / Cloud Computing / Big Data
Analytics / Financial Services / HPC / CDN / vSAN

© 2024 Copyright Super Micro Computer, Inc. All rights reserved

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SuperBlade – 6U: Future-proof, Resource-saving Architecture

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Supermicro's X14 6U high-performance, density and memory-optimized, and energy-efficient SuperBlade® can significantly
reduce customers' initial capital and operational expenses. SuperBlade® utilizes shared, redundant components, including
power supplies, cooling fans, chassis management modules (CMMs), switches, or pass-thru modules to deliver the most costeffective, green computing solutions. The X14 6U SuperBlade® architecture maximizes rack density, with up to 100 servers per
rack. Optional direct liquid cooling (DLC) can support servers with the highest power CPUs to achieve the lowest Power Usage
Effectiveness (PUE) with the best TCO. Supermicro's X14 6U SuperBlade® architecture is optimized for performance withmaximum memory capacity (32 DIMMs – DP, 16 DIMMs - UP). Up to 20 GPUs can be installed in 6U enclosures for AI/ML,
acceleration, graphics, and 3D rendering. It has the ability to house up to 10 NVMe SSDs per server, which can be ideal for vSAN,
EDA, big data analytics, and financial services applications.
Key Applications: AI/ML/ Hybrid and Private Cloud / Cloud Computing / Big Data Analytics / Financial Services / HPC / CDN /vSAN / EDA

BigTwin®: Highly Modular Multi-Node Systems with Tool-Less Design
Supermicro X14 BigTwin® systems provide superior performance and serviceability with dual Intel® Xeon® 6 processors per nodeand hot-swappable tool-less design. Optimized for density (2U4N) or storage (2U2N), BigTwin® architectures can be more costeffective than standard 1U servers thanks to shared power and cooling while also
increasing compute density and reducing overall TCO. The modular mid-plane
design provides NVMe Gen 5 storage controller options with support for E3.S devices,
and a new riser card design can support up to 4 M.2 drives for boot/OS or
metadata/caching.
Key Applications: HCI / HPC / CDN / Hybrid Cloud Container-as-a-Service / Cloud
Computing / Big Data Analytics / Back-up and Recovery / Scale-Out Storage

GrandTwin®: Highly Configurable Single Processor Systems with Front orRear I/O
The GrandTwin® architecture is purpose-built for single-processor
performance. The design maximizes compute, memory and efficiency todeliver maximum density. Powered by Intel Xeon 6 processors, GrandTwin's
flexible modular design can be easily adapted for a wide range of© 2024 Copyright Super Micro Computer, Inc. All rights reserved

June 20244

applications, with the ability to add or remove components as required, reducing cost. For front configurations,
all I/O and node5
trays are fully accessible from the cold aisle, simplifying installation and servicing in space-constrained environments. Flexible
storage with up to eight E1.S storage devices, a significant density increase over Supermicro X13 systems, and networking
options are available via front AIOM modules, allowing countless custom configurations.
Key Applications: MEC (Multi-Access Edge Computing) / HPC / Cloud Gaming / Multi-Purpose CDN / High-Availability Cache
Cluster / Telco Edge Cloud / EDA (Electronic Design Automation) / Mission-Critical Web Applications
Rackmount Optimized Servers
Supermicro's X14 Rackmount servers offer customers several choices, including single or dual processor configurations, asignificant amount of memory capacity, and PCIe expansion slots. In addition, the new DC-MHS (Data Center Modular
Hardware System) servers are designed to be installed when designing and implementing a multi-vendor rack scale facility.

Hyper: Flagship Performance and Flexibility for Enterprise Data Centers
The new X14 Hyper series brings next-generation performance to
Supermicro's range of rackmount servers, built to take on the mostdemanding workloads in the most proven 1U and 2U form factors.
Supermicro's modular design allows customization of storage, expansion
slots, network, and power supplies to meet the application requirements. The
Supermicro Hyper server balances compute, storage, and expansion in a toolless rackmount design for optimization, flexibility, and serviceability. The X14
Hyper lineup includes the best-selling dual-socket configurations designed for
maximum power and compute density and new single-socket architectures toprovide balanced performance with only one processor.

Key Applications: Enterprise Server / Cloud Computing / Big Data Analytics / Hyperconverged Storage / AI Inference and Machine
Learning / Network Function / Virtualization© 2024 Copyright Super Micro Computer, Inc. All rights reserved

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CloudDC with DC-MHS: High-density, Tool-less Mechanical Design for Rapid Cloud Deployment and6 Easy Maintenance
The new Supermicro X14 CloudDC with DC-MHS delivers ultimate flexibility on I/O and storage to support a range of cloud anddata center workloads. The systems are designed to meet OCP DC-MHS specifications, improving modularity and flexibility forlarge-scale enterprises and cloud service providers to simplify data center management with DC-SCM modules. X14 CloudDC
also features tool-less brackets, hot-swap drive trays, and redundant power
supplies that ensure rapid deployment and more efficient maintenance in data
centers. High-efficiency Titanium Level, redundant power supplies provide
resiliency and a low carbon footprint. Rich security features include Intel® SGX, TPM
2.0, signed firmware, Silicon Root of Trust, Secure Boot, System Erase, Runtime FW
protection, FIPS Compliance, and Trusted Execution Environment.
Key Applications: Private, Public, Hybrid Cloud / Big Data Analytics / AI Inferencing /Machine Learning / Network Appliance / Virtualization / Open BMC
WIO (UP): Wide-Ranging Flexibility for any Enterprise Workload
Supermicro WIO systems offer a wide range of I/O options to deliver truly
optimized systems for specific requirements. Users can optimize the storageand networking alternatives to accelerate performance, increase efficiency,
and find the perfect fit for their applications. In addition to enablingcustomizable configurations and optimization for multiple application
requirements, Supermicro WIO SuperServers also provide attractive costadvantages and investment protection.
Key Applications: Enterprise / Firewall / Security Appliances / Cloud / Network
Appliance / General Purpose Computing
Storage Servers
Supermicro's Petascale storage systems are ideal for deployments where storage throughput and latency are paramount,
including generative AI, mission-critical databases, virtualization, next-gen big data, HPC, media & entertainment, and hot-tiercaching. Supermicro's open architectures are designed to work with the broadest
range of software partners to create a solution to drive every application. The
symmetrical dual-CPU architecture balances resources and reduces latency byminimizing the length of data paths and maximizing airflow over criticalcomponents for optimal thermal performance.
With the latest industry-standard EDSFF E3.S form factors explicitly designed forhigh-performance solid-state media, these storage drives facilitate maximum
performance from PCIe 5.0 interconnects, which ensures compatibility with future
iterations of the PCIe protocol. These storage systems support the new Gen 5
drives from all major vendors, allowing customers to choose the best components
for their specific applications. Supermicro Petascale systems also support the industry's first CXL expansion modules, adding
up to 1TB of DDR memory to the already powerful 32-DIMM solution. This emerging CXL technology is now available to add
capacity and bandwidth for memory-bound applications© 2024 Copyright Super Micro Computer, Inc. All rights reserved

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Key Applications: Data Intensive HPC and AI / Private & Hybrid Cloud / Software-Defined Storage / NVMe7 Over Fabrics Solution/ In-Memory Computing / Composable Infrastructure Platform
Edge/Telco
These systems are designed to be installed outside of a traditional data center. These compact systems can accommodate up
to 3 GPUs and, with the new Intel Xeon 6 processors with E-Cores, have 2.2X more cores and improved performance per watt,ideal for edge locations where power may be limited. Additionally, these systems feature DC power NEBS compliance and areavailable in rack mount and wall mounting options.
Hyper-E: Data Center Performance at the Edge
Hyper-E delivers the performance and flexibility of Supermicro's flagshiprackmount server family in a compact form factor optimized for telco andmicro data center deployments. A mid-depth chassis and front I/O makeincorporating Hyper-E into existing edge and telco infrastructure easier, while
carrier grade (NEBS Level 3) design and optional DC power options further
enhance flexibility in non-traditional data center environments. Storage andexpansion configurations can be adjusted depending on the application,
while maintenance-friendly design innovations eliminate the need for tools
when servicing the system to simplify rollout and installation.
Key Applications: 5G Core and Edge / Telco Micro Data Center

Telco/Edge: Optimized Designs for 5G, Edge Computing and Emerging IoT Systems
Supermicro provides innovative and first-to-market technologies that are the building blocks for today's computing platforms.
Rapid growth in embedded markets and open standards are driving the need for higher levels of product integration andoptimization through virtualization, AI inferencing, network connectivity, remote management, mobile communication,
expanded I/O, and device-to-device communications using space and power-efficient configurations. Supermicro's family ofhigh-performance embedded products is optimized for a wide
range of applications and solutions. Supermicro offers many
flexible and customized solutions for critical OEM projects, as wellas advanced designs for stringent environments, firmware
customization, BOM enhancements, and a wide range of legacy IO
support.
Key Applications: Multi-Access Edge Computing / Flex-RAN / OpenRAN / Edge AI Outdoor 5G

Supermicro System Advantages
Supermicro works closely with Intel to bring the latest Intel CPUs and GPUs to market. Supermicro delivers rack and clusterlevel solutions to many industries with a range of server products and configurations. In addition, Supermicro offers a range ofservices and solutions to address the requirements of CSPs, Enterprise, and SMB customers.

© 2024 Copyright Super Micro Computer, Inc. All rights reserved

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Supermicro Total IT Solutions
8• Industry's broadest portfolio of systems based on Intel® Xeon® 6 processors• Rack Scale plug-and-play service to deliver complete, validated solutions within weeks, not months• Production capacity of up to 5,000 racks per month worldwide• Made in the USA program with manufacturing in San Jose headquarters• Industry standard compliance for hardware and silicon Root of Trust (RoT) and cryptographical attestation ofcomponents throughout the entire supply chain• Supermicro liquid cooling, including CPU/GPU cold plate, Cooling Distribution Unit, and Cooling Distribution
Manifolds for a complete integrated solution
Optimized, Open Architectures• More than 15 families of systems optimized for AI, Cloud, 5G Edge, and more
• Modular Building Block architecture enables customization for specific workloads and configurations.
• Resource saving architecture to reduce materials and energy usage• Enhanced thermal capacity to support next-gen CPUs, GPUs, and other components• Flexible networking with Advanced I/O Modules (AIOM) up to 400G per card
• High ambient temperature operation up to 40°C with liquid cooling options• Support for open and industry standards, including OCP 3.0, DC-MHS, OAM, ORV2, OSF, Open BMC, and EDSFFIntel Xeon 6 Processor Details
The latest Intel Xeon family of CPUs, the Intel Xeon 6 processors with E-Cores, is designed to bring maximum performance perwatt to the market for cloud-native and scale-out applications. The high core counts enable large numbers of applications orexisting multi-core applications to run on a single CPU and even more in dual processor systems. Intel Xeon 6 processors aredesigned to be socket compatible within the same platform.
Intel Xeon 6 processors with E-cores: Technical Details• Up to 8 channels of DDR5 support per CPU• Up to 24 GT/s and 6 links of UPI (1.8x gen-over-gen increase in future products)• Support for secure UPI/PCIe/CXL link encryption• Support for CXL 2.0 for all device types with Intel® Flat Memory Mode (FMM)• Support for Intel® Accelerator Engines including Intel® AMX (future products), Intel® DLB, Intel® QAT, Intel® DSA andIntel® IAA• Maximum performance-per-watt and core density for cloud, networking, analytics, and scale-out workloads• Future CPUs with up to 288 cores• Up to 2.7x better 5G core performance per rack vs 2nd Gen Intel® Xeon® processors (Intel internal measurements)• 1S-2S scalability• TDP starting at 205W
Intel® Xeon® 6 processors with P-cores: Technical Details (available Q3, CY2024)• Maximum performance-per-core for AI, HPC, storage, and Edge workloads• Up to 2.9x better throughput on AI workloads vs 4th Gen Intel® Xeon® processors (Intel internal measurements)• Up to 2-3x better performance for AI workloads vs 4th Gen Intel® Xeon® processors (Intel internal measurements)• Up to 2.8x better memory bandwidth 4th Gen Intel® Xeon® processors (Intel internal measurements)• 1S-8S scalability• New FP16 support added to Intel® AMX accelerator• Support for MCR DIMMs© 2024 Copyright Super Micro Computer, Inc. All rights reserved

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Generation to Generation Comparisons9

Each generation of CPUs from Intel improves a number of essential features. The improvement over multiple generations ofCPUs is quite impressive and can be viewed below.

Over many generations, progress has been made when looking at the amount of work per watt. The significant improvement
over several generations of Intel processors demonstrates how leading-edge technology can significantly improve server
performance and enable new types of computing at lower costs.

Image Courtesy of Intel© 2024 Copyright Super Micro Computer, Inc. All rights reserved

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Intel Xeon 6 CPUs with P-cores

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Looking forward, Intel will enhance its family of Intel Xeon 6 CPUs with the addition of P-cores or performance cores. These
CPUs will have up to 128 cores per CPU, with a top TDP of 500W and up to 12 channels of memory. These CPUs are designed forone or two socket servers and will have 12 memory channels, with up to DDR5-6400 and MCR DIMMs at up to 8800 MT/s. In
addition, each CPU will be able to support up to 96 PCIE 5.0 lanes.

Summary
The new Supermicro X14 product lines are designed for a range of workloads. With the new Intel Xeon 6 processors, specificworkloads will show increased performance per core and a better performance/watt compared to previous generations. The
Supermicro X14 products are positioned to take advantage of the latest CPU and GPU technologies.

For More Information:
Supermicro X14 Summary: www.supermicro.com/x14
SuperBlade: https://www.supermicro.com/en/products/superblade?pro=generation_new%3DX14
Hyper: https://www.supermicro.com/en/products/hyper?pro=generation_new%3DX14
Hyper-E: https://www.supermicro.com/en/products/embedded/5g-telecom-systems
BigTwin: https://www.supermicro.com/en/products/bigtwin?pro=generation_new%3DX14
GrandTwin: v https://www.supermicro.com/en/products/grandtwin?pro=generation_new%3DX14
WIO: https://www.supermicro.com/en/products/wio?pro=generation_new%3DX14
CloudDC with DC-MHS: https://www.supermicro.com/en/products/clouddc?pro=generation_new%3DX14
Telco/Edge: https://www.supermicro.com/en/products/embedded/5g-telecom-systems© 2024 Copyright Super Micro Computer, Inc. All rights reserved

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