PRODUCT BRIEF

Western Digital® IX SN530 NVMe™
Industrial-Grade SSD
Empowering a new generation of data-rich industrial andautonomous driving designs
Western Digital IX SN530 NVMe industrial-grade SSD (IX SN530) offers a highperformance, wide–temperature range storage solution designed for the demanding
requirements of industrial and autonomous driving applications. With flexibility
through high-capacity TLC and high-endurance SLC options, the IX SN530 offers twoM.2 form factors and up to 2TB2 of storage space.

Product Highlights• High performance at industrial-grade
temperatures -40˚C to +85˚C• Up to 2TB in M.2 2280 and up to 1TB in M.2 2230
• Available in TLC and SLC configurations

Applications
•••
•
•
•

Industrial PCs
Factory automation
Robotics
Fanless designs
Digital signage
Data logging and boot device forautonomous driving systems

Built for Extreme Conditions
The IX SN530 supports a wide range of environmental conditions, including operating
temperatures and shock and vibration, which allow it to be used in systems placedin various physical locations in a vehicle or other equipment, enabling placement
flexibility for system designers.

Robust and Reliable Design
A fully vertically integrated solid state drive, the IX SN530 is built with Western Digital’s
96-layer 3D NAND technology, in-house controller and firmware development, internal
validation and qualification, and extensive testing; making it ideal for handling a wide
variety of industrial and automotive use cases. In addition, Western Digital supports
five-year longevity with controlled bill-of-material and provides product change
notifications, for customers’ peace of mind.
Further, by offering SLC configurations, the IX SN530 supports write-intensive
applications, such as data recorder and data set management, saving the need to use
multiple high-capacity TLC devices by delivering 9 times the TLC endurance and up to5 times the TLC sustained write performance.

Gearing Up with NVMe SSDs
The IX SN530 is available in two M.2 form factors­­—a compact M.2 2230 and M.2 2280—
addressing a variety of system designs and mechanical constraints. This compact
solution helps to reduce maintenance costs and enhance serviceability, making thetransition to industrial-grade PCIe NVMe SSDs easier.

PRODUCT BRIEF

Specifications
Generic Specifications
Interface1PCIe Gen3 x4 NVMe v1.4

Form factors

M.2 2280-S3-M / M.2 2230-S3-M

3D NAND flash

M.2 2280-S3-M

SLC 96-layer

Capacity 2TLC 96-layer

85GB

170GB

340GB

256GB

512GB

1TB

2TB

Sequential Read up to (MB/s)3

2,400

2,400

2,400

2,400

2,400

2,400

2,500

Burst Sequential Write up to(MB/s)4900

1,750

1,950

900

1,750

1,950

1,800

Sustained Sequential Write upto (MB/s)3900

1,750

1,950

140

280

540

525

Performance3

Random Read up to (IOPS)

160K

310K

410K

160K

310K

410K

370K

Random Write up to (IOPS)3180K

330K

350K

85K

150K

350K

300K

Power (projected)
Average Power (W)5

3.3

3.3

3.5

3.5

3.5

3.5

3.9

Peak Power (W)6

5.5

5.5

5.5

5.5

5.5

5.5

5.5

6,000

12,00024,000

650

1,300

2,600

5,200

Reliability
Endurance (TBW)7 (projected)
Mean Time To Failure (MTTF)8(Hours) (projected)

3,000,000

Unrecoverable Bit Error Rate (UBER)

1 error per 1016 bits read

Data Retention (EOL)

1 year at +55°C

Environmental
Operating Temperature9-40°C to +85°C

Non-Operating Temperature-40°C to +95°C

Operating Vibration20GRMS, 7 to 2,000Hz, 30min/axis on 3 axes

Shock1,500G, 0.5ms Half Sine pulse duration

Altitude-1500ft (-457m) to 40,000ft (12,192m)

Certifications

FCC, CE, UL, TUV, BSMI, KCC, RCM, Morocco, VCCI and CAN ICES-3(B)/NMB-3(B)Advanced Features
Functional• DRAMless architecture with Host
Memory Buffer (HMB) support.
• nCache 3.0 SLC tiered
caching technology.

Reliability• End-to-end data path protection.
• 3-gear LDPC engine with advanced
DSP capabilities in hardware.
• NAND XOR protection for
multi-page recovery.
• Automatic Data Refresh.
• NVMe S.M.A.R.T.

Flash management• Dynamic and static wear-leveling,
bad block management andbackground garbage collection.

Security• TCG Pyrite security support for
password protection (ATA-like).
• Secure Boot including RSA
authentication and secure field
firmware upgrade.

Physical Dimensions
Weight typical (gr)2230: 3.2 ± 0.5 / 2280: 7.5 ± 1.0

2280: 7.5 ± 1.0

Width (mm)102230: 22 ± 0.15 / 2280: 22 ± 0.15

2280: 22 ± 0.15

Length (mm)102230: 30 ± 0.15 / 2280: 80 ± 0.15

2280: 80 ± 0.15

Thickness maximum (mm)10

Ordering Information

2.38
85GB

170GB

340GB

256GB

512GB

1TB

2TB

M.2 2230-S3-M

SDBPTPZ-085G-XI

SDBPTPZ-170G-XI

SDBPTPZ-340G-XI

SDBPTPZ-256G-XI

SDBPTPZ-512G-XI

SDBPTPZ-1T00-XI

N/A

M.2 2280-S3-M

SDBPNPZ-085G-XI

SDBPNPZ-170G-XI

SDBPNPZ-340G-XI

SDBPNPZ-256G-XI

SDBPNPZ-512G-XI

SDBPNPZ-1T00-XI

SDBPNPZ-2T00-XI

PCI Express 3.0 up to four lanes, and a bit rate of 2.5Gbps or 5Gbps or 8Gbps. Configurable lane width: x1,x2 and x4. NVM Express version 1.4
The capacities are based on IDEMA Standard LBA 1-03. One megabyte is equal to one billion bytes, onegigabyte (GB) is equal to one billion bytes and one terabyte (TB) is equal to one trillion bytes. Actual user
capacity may be less due to operating environment. 2TB is supported by M.2 2280 form factor only.
3
Test Conditions: burst performance is measured by CrystalDiskMark 6.0.0, using 1000MB LBA range asa secondary drive in desktop with Intel® Core™ i7 7700 CPU, 8GB RAM. OS: Windows 10 Pro 64-bit 20H1
19041.208 with Microsoft StorNVMe driver. Sequential read performance refers for both burst and sustainedspecifications.
4Test Conditions: sustained sequential performance is measured by FIO 1.97, using 100% LBA range as asecondary drive in Dell Precision 7820, with Intel® Xeon® Silver 4208 CPU, 16GB RAM. OS: Cent OS 8, Kernel
4.18.0-193.6.3.el8_2.x86_64.
1

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San Jose, CA 95119, USA
www.westerndigital.com

Average maximum power is measured while the SSD is continuously processing sequential read and write
commands for at least 10 seconds, with a transfer size of 128KB per command, QD= 32 and 1 thread. Samplinginterval is 1 second. Measured at 25°C and can vary due to input voltage and ambient temperature variation.
6
Peak power is the maximum instantaneous power consumption measured while the SSD is continuously
processing commands for at least 10 seconds, with a transfer size of 128KB per command, QD=32 and 1thread. The sampling interval is 10μs. Measured at 25°C and can vary due to input voltage and ambient
temperature variation.
7
TBW = Terabytes Written. Projected endurance is calculated based on sustained sequential write operation
without frequent idle.
8Based on Western Digital’s internal calculation, using a prediction methodology in accordance withthe Telcordia Special Report SR-332. The prediction is based on a Parts Stress Analysis, performed at atemperature of 40°C in a GB (ground, benign) environment with duty cycle of 12 hours per day.
9Operational temperature is defined such as -40°C refers to ambient temperature. +85°C refers to NAND
BGA case temperature. When SMART composite temperature reported by the drive exceeds 85°C, thermal
throttling will be initiated.
10The form factor complies with PCI Express M.2 Specification, rev. 4.0. Components Z height above PCB<=1.5mm (S3)5©2020 Western Digital Corporation or its affiliates. All rights reserved. Western Digital and the Western Digital logo are registered trademarks or trademarks ofWestern Digital Corporation or its affiliates in the US and/or other countries. All other marks are the property of their respective owners. References in this publication
to products do not imply that they will be made available in all countries. Product specifications provided are sample specifications and do not constitute a warranty.
Actual specifications for unique part numbers may vary. Pictures shown may vary from actual products.

November 2020