3M™ CMP Pad Conditioner Product Selection Guide

Redefining CMPRedefining chemical mechanicalplanarization (CMP)In the world of semiconductor fabrication, consistency,
reliability and yield are critical at every part of the process.
For over 25 years, 3M™ CMP Pad Conditioners haveprovided innovative pad conditioning solutions to some of
the world’s leading semiconductor fabricators.
From the exclusive sintered abrasive diamond technology
behind 3M™ Diamond Pad Conditioners to theprecisely microreplicated patterns in 3M™ Trizact™ Pad
Conditioners, our global technical team is committed tocontinually redefining the cutting edge of pad conditioner
technology. Multiple geographically independent
research and manufacturing facilities around the worldprovide convenient product support and product supplies.

Selecting a pad conditioner for yourapplication or process
Selecting a pad conditioner requires compatibility testing
to ensure that your pad, wafer and slurry combination will
perform optimally. Our technical team has data packages
for many common processes — tungsten to copper,
poly to STI, and many more — that have been provencompatible with our products over years of operation.
We can also test custom combinations at our labs aroundthe world.

Newest releases: 2023

Explore 3M CMP pad conditioning solutions

3M™ Trizact Pad Conditioner

3M™ Diamond Pad Conditioner

3M™ Pad Conditioner Brush

Precisely engineered, microreplicated,diamond-coated ceramic CMP disks for someof the most demanding processes.

Effective, reliable diamond pad conditioning
for consistent long-term performance.

Durable, cost-effective pad conditioning for
CMP buff and pad cleaning on soft pads.

3M™ Trizact Pad Conditioner
T Series

3M™ Diamond Pad Conditioner
C Series

Enhances the conventional 3M™ Trizact™ pad
conditioner platform with a surface topography
optimized for stronger pad activation, slower
pad wear rate decay and even more consistentwafer-to-wafer performance.

Offers extra-precise diamond placement at the
micrometer scale to further help control coplanarity and flatness for even more consistent
performance in CMP pad conditioning.

View conditioners

2Matching your pador slurry
3M offers a broad range of CMP
pad conditioners tailored across key
attributes such as pad wear rate andpad roughness.
Plus, our high-tech pad conditioners
are designed to be compatible with
CMP pads with industry-standard
combinations of shore hardness andspecific gravity. Data packages areavailable with additional productcompatibility details.
This information is based on tests performed at 3M laboratory facilities, and may be based on a limited sample size or a subset of 3M CMP materials. Many factors beyond
3M’s control and uniquely within the user’s control can affect the use and performance of 3M CMP materials in a particular semiconductor manufacturing application. To
learn more about the specific properties and benefits of a given 3M CMP pad or 3M CMP pad conditioner, or to arrange a technical evaluation of the product, contact 3M to
speak with an expert.

Matching your technical needs
Across the industry, semiconductor manufacturers are facing a range of technical challenges depending on
product, application and market position. Whatever your technical priority, 3M has a CMP pad conditioner for you.

Scratch and defectimprovement••

3M™ Trizact™ Pad Conditioners offer provenreductions in scratching and defectivity over legacy
diamond pad conditioners, as well as providing a
metal-free cutting surface for both advanced andmature nodes.

Disk-to-disk
consistency•

3M™ Diamond Pad Conditioner C Series features
precision diamond placement technology and enables
improved disk-to-disk consistency.

•

3M™ Trizact™ Pad Conditioners have highly controlled
tip shape and height. They deliver consistency andreliability with a proven record in both advanced andmature node processes.

3M™ CMP Pad Conditioner Coatings technology
enables metal leaching and defectivity improvements,
and can be applied to most 3M pad conditioner
products.

Cost of ownership•

3M™ Trizact™ Pad Conditioner T Series include further
improved pad wear rate decay compared withlegacy pad conditioners, which helps enable cost-ofownership improvement through longer disk life.

•

3M™ Diamond Pad Conditioner C Series features
highly controlled co-planarity and flatness comparedwith legacy diamond pad conditioners, helping enable
cost-of-ownership improvement through longer disk
and pad life.

SiC and advanced
packaging•

3M pad conditioner products have been used for
emerging CMP applications in SiC and advanced
packaging, where large volumes of layer removal
is required. 3M products help deliver long disk life
with good performance to slurry corrosion, while
also delivering a high removal rate through highaggressiveness.

3

Get product details

3M Trizact Pad Conditioners™

™

Pad conditioners for CMP processes where precision, reliability and consistency are vital. Using
3M proprietary microreplication technology, virtually every aspect from overall shape to tip
shape to height dispersion can be specified at microscale and manufactured out of diamondcoated ceramic.

Semiconductor manufacturers choose them for:Tunable performance

Yield improvement

Advanced node processes

Maintain tight control of yourpreferred height dispersion, tip shapeand pattern throughout the lifespanof the pad conditioner.

Virtually eliminates scratching
defects associated with somediamond grit conditioners.
Controlled coefficient of variation
provides optimized consistency.

No metals allowed? No problem.
Ideal for processes sensitive tocontamination.

Precise microreplicatedpatterns help give you
complete process control

Frequently compatible slurry
chemistries1•

Copper

•

ILD

•

Poly
silicon•Self-aligned
contact (SAC)

•

SiGe

•

STI

Explore our 3M™ Trizact™ Pad Conditioners range
View information on a few popular 3M™ Trizact™ Pad Conditioner products covering a range of roughness and pad wear
rate combinations, or contact our team to explore our full library of high-performance pad conditioners.
Product Number

Carrier

Carrier Size (in.)

Abrasive Material

Feature Size,
Nominal (μm)

Active Tip (% of Total) andNormalized Pad Wear Rate

A5

304 or 410
Stainless Steel

4 in. or 4.25 in.

CVD CoatedCeramic

250 μmAvailable upon request

B5

304 or 410
Stainless Steel

4 in. or 4.25 in.

CVD CoatedCeramic

180 μmAvailable upon request

B6

304 or 410
Stainless Steel

4 in. or 4.25 in.

CVD CoatedCeramic

180 μmAvailable upon request

B25

304 or 410
Stainless Steel

4 in. or 4.25 in.

CVD CoatedCeramic

180 μmAvailable upon request

B75

304 or 410
Stainless Steel

4 in. or 4.25 in.

CVD CoatedCeramic

180 μmAvailable upon request
4

Get product details

3M Trizact Pad Conditioner T Series™

™

The epitome of our commitment to consistent, long-lifespan, metal-free pads. Launched in 2023,
3M™ Trizact™ Pad Conditioner T Series products optimize the surface topography for stronger
pad activation, much slower wear and consistent performance throughout their lifetime.

Semiconductor manufacturers choose them for:

Strong, tunable pad activation

Reduced pad wear rate

Optimized consistency

3M™ Trizact™ Pad Conditioner T
Series maintains the tunable surface
topography of 3M™ Trizact™ Pad
Conditioners and combines it withincreased diamond grain size tostrengthen pad activation.

As pad conditioners wear down, thecoefficient of friction (CoF) decreases,
leading to pad wear rate decay. The
rougher diamond coating on 3M™
Trizact™ Pad Conditioner T Series has ahigher CoF that can reduce pad wear
rate decay by up to 80%.

3M™ Trizact™ Pad Conditioner T
Series demonstrates a coefficient ofvariation between pads of less than
2% — a more than 4X improvement
over legacy sintered abrasive pad
conditioners.

Optimized, rougher CVD diamond surface over microreplicated asperities
Frequently compatible slurry
chemistries1

3M Trizact Pad
Conditioner T Series™

™

•

Copper

•

ILD

•

Poly
silicon•Self-aligned
contact (SAC)

•

SiGe

•

STI

3M Trizact Pad
Conditioner™

™

Explore our 3M™ Trizact™ Pad Conditioner T Series range
View information on a few popular 3M™ Trizact™ Pad Conditioner T Series products covering a range of roughness andpad wear rate combinations or contact our team to explore our full library of high-performance pad conditioners.
Product Number

Carrier

Carrier Size (in.)

Abrasive Material

Feature Size,
Nominal (μm)

Active Tip (% of Total) andNormalized Pad Wear Rate

B5T

304 or 410
Stainless Steel

4 in. or 4.25 in.

CVD CoatedCeramic

180 μmAvailable upon request

B6T

304 or 410
Stainless Steel

4 in. or 4.25 in.

CVD CoatedCeramic

180 μmAvailable upon request

B25T

304 or 410
Stainless Steel

4 in. or 4.25 in.

CVD CoatedCeramic

180 μmAvailable upon request
5

Get product details

3M Diamond Pad Conditioners™

3M™ Diamond Pad Conditioner products feature a diamond grid firmly attached through 3M
proprietary sintered abrasive technology. These reliable pad conditioners can help refresh
your CMP pad surfaces, minimize wear, and maintain consistent asperities and consistent pad
performance, for wafer after wafer.

Semiconductor manufacturers choose them for:Controlled performance

Increased life

Diamond spacing and protrusion
results in excellent pad planarity.

Diamonds are firmly secured with
3M proprietary sintered abrasive
technology and protected by anedge exclusion zone to minimize
scratching and uneven wear.

Responsive support andsupplyFour geographically independent 3M
manufacturing and research facilities
around the world provide prompt,
local technical support and supply.

3M™ CMP Pad Conditioner Coatings reduce
metal leaching

3M™ CMP Pad
Conditioner Coating

3M™ CMP Pad Conditioner Coatings put a durable layerover the pad conditioner, helping substantially reduce
metal leaching. Plus, they further minimize micro andmacro scratching defects. 3M coatings can be factoryapplied to any 3M™ Diamond Pad Conditioner.

Metal ion

Explore our 3M™ Diamond Pad Conditioners range

See next page for details.

View details on selected 3M™ Diamond Pad Conditioners covering a range of roughness and pad wear rate combinations
or contact our team to explore our full library of more than 70 high-performance pad conditioners.

Frequently compatible
slurry chemistries1

•
•
•

BPSG
CobaltCopper•••

ILD
Metal gate
Poly silicon

•
•

STI
Tungsten6Explore our 3M™ Diamond Pad Conditioners range
Product Number

Carrier

Carrier Size (in.)

Diamond Size (μm)

Diamond Type*

Flatness (μm)

AggressivenessValue (BL)A63

304 Stainless Steel

4.25 in.

63 μm

20-35.5 μm

1-3

A82

304 Stainless Steel

4.25 in.

74 μm

20-60 μm

6-14

A98

304 Stainless Steel

4.25 in.

90 μm

31-70 μm

8-14

A122

304 Stainless Steel

4.25 in.

150 μm3

43-96 μm

9-16

A153L

304 Stainless Steel

4.25 in.

150 μm4

1-100 μm

6-9

A160

304 Stainless Steel

4.25 in.

250 μm4

1-100 μm

15-19

A165

304 Stainless Steel

4.25 in.

250 μm4

1-100 μm

15-19

A188

Polycarbonate

4.25 in.

250 μm4

1-100 μm

15-19

A188H

Polycarbonate

4.25 in.

250 μm4

10-90 μm

20-26

A188J

Polycarbonate

4.25 in.

250 μm4

1-100 μm

15-19

A189H

304 Stainless Steel

4.25 in.

250 μm30-75 μm

22-28

A189L

304 Stainless Steel

4.25 in.

250 μm30-75 μm

14-16

A2813

304 Stainless Steel

4.25 in.

180 μm30-75 μm

20-27

A3700

Polycarbonate

4.25 in.

150 μm91-100 μm

25-35

B138L

410 Stainless Steel4 in.

180 μm1

25-60 μm

18-25

H70 (Double sided)

304 Stainless Steel

3.74 in.

63 μm

21-100 μm
(on both sides)

N/A

L130

410 Stainless Steel4 in.

150 μm3

20-57 μm

9-12

S60

410 Stainless Steel4 in.

250 μm4

50-100 μm

15-19

S82

410 Stainless Steel

4 in.

74 μm

2

20-71 μm

9-10

S122

410 Stainless Steel4 in.

150 μm3

21-69 μm

9-16

S122H

410 Stainless Steel4 in.

150 μm3

21-69 μm

13-16

S122L

410 Stainless Steel4 in.

150 μm3

21-69 μm

9-12

S188J

410 Stainless Steel4 in.

250 μm4

20-60 μm

15-19*Higher numbered diamond types are sharper (e.g. Type 2: Blocky, Type 3: Semi-Blocky, Type 4: Semi-Sharp)

7Get product details

3M Diamond Pad Conditioner C Series™

3M™ Diamond Pad Conditioner C Series products take the next step in consistency and control
for diamond pad conditioners. Building on our tested and reliable sintered abrasive technology for
diamond attachment, 3M™ Diamond Pad Conditioner C Series positions each diamond in a grid
pattern at the micrometer scale. Plus, we’ve further controlled co-planarity and flatness so that you
can have confidence in your activated pad roughness over dozens or hundreds of wafers.

Exceptionally controlled performance

Highly controlled co-planarity

3M manufacturing processes emphasize consistency
and precision. We can orient the diamonds on 3M™
Diamond Pad Conditioner C Series with a more than
80% tip-up ratio.

Choose your grid density. Precision diamond placement
improves your control of pad wear rate and enables
improved disk-to-disk consistency.

3M™ CMP Pad
Conditioner Coating

Metal ion

3M™ CMP Pad
Conditioner
Coatings
reduce metalleaching

Frequently compatible slurry
chemistries1
•
•
•
•

BPSG
CobaltCopper
ILD

•
•
•
•

Metal gate
Poly silicon
STI
Tungsten

Explore our 3M™ Diamond Pad Conditioner C Series range
View details on select 3M™ Diamond Pad Conditioner C Series products, or contact our team to explore our full libraryof products.
Product Number

Carrier Type and Size (in.)

Diamond Size (μm)

Pitch (μm)

C250

304 Stainless Steel 4.25 in.,
410 Stainless Steel 4 in.

250 μm510 μmC260

304 Stainless Steel 4.25 in.,
410 Stainless Steel 4 in.

250 μm625 μmC280

304 Stainless Steel 4.25 in.,
410 Stainless Steel 4 in.

250 μm

884 μm

C2120

304 Stainless Steel 4.25 in.,
410 Stainless Steel 4 in.

250 μm

1250 μm

C2160

304 Stainless Steel 4.25 in.,
410 Stainless Steel 4 in.

250 μm1667 μm
8Get product details

3M CMP Pad Conditioner Brush™

Featuring a metal-free construction and low cost of ownership, 3M™ CMP Pad Conditioner Brush
products are used for CMP buff and pad cleaning applications.

Semiconductor manufacturers choose them for:

Great for soft CMP pads

Metal-free durability

Low cost of ownership

Strong bristles to remove pad debris
from porometric and felt-based pads.

Bristles are independently anchoredand evenly distributed across thebrush surface using 3M proprietarybrush-making technology.

Efficient pad cleaning and slurry
distribution.

Pad cleaning and gentle
conditioning of soft
CMP pads

Frequently compatible pads1

Conventional tufted
bristle brush•Felt-based pads•

Porometric pads

3M™ CMP Pad
Conditioner Brush

Explore our 3M™ CMP Pad Conditioner Brush range
View information on select popular 3M™ CMP Pad Conditioner Brush products covering a range of fiber lengths,
densities and diameters, or contact our team to explore our full library of products.
Product Number

CarrierBrush Material

Carrier Size (in.)

Fiber Length (in.)

Nominal Fiber
Density (mg/cm2)

Fiber
Diameter (in.)

PB32A

Polycarbonate

Nylon

4.25 in.

0.21 in.

82

0.005 in.

PB33A

Polycarbonate

Nylon

4.25 in.

0.21 in.

82

0.005 in.

PB33R

Polycarbonate

Nylon

3.15 in.

0.21 in.

82

0.005 in.

PB42A

Polycarbonate

Nylon

4.25 in.

0.15in.

68

0.005 in.

PB52A

Polycarbonate

Nylon

4.25 in.

0.34 in.

200

0.012 in.
9

Global supply andsupportAs of 2023, 3M is the only known
supplier of CMP materials withsources of supply and labs in multiple
countries around the world.
Our global laboratory andmanufacturing capabilities provide
you with access to local sampling,
product iterations and 3M technicalexpertise to support your global
business goals.

Technical Support

Manufacturing

Choose a chemical mechanical planarization partner to help
you create what’s next in semiconductor manufacturing.

Get in touch with us at: 3M.com/CMP
1-800-251-8634

1
These selected chemistries are commonly compatible, but many others are compatible as well. The 3M CMP technical team has data packages for a broad range ofcommon chemistries, and can test custom combinations for you as well.

Safety Data Sheet: Consult Safety Data Sheet before use.
Regulatory: For regulatory information about this product, contact your 3M representative.
Technical Information: The technical information, recommendations and other statements contained in this document are based upon tests or experience that 3M
believes are reliable, but the accuracy or completeness of such information is not guaranteed.
Product Use: Many factors beyond 3M’s control and uniquely within user’s knowledge and control can affect the use and performance of a 3M product in a particularapplication. Given the variety of factors that can affect the use and performance of a 3M product, user is solely responsible for evaluating the 3M product and determining
whether it is fit for a particular purpose and suitable for user’s method of application.
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BUT NOT LIMITED TO, ANY IMPLIED WARRANTY OR CONDITION OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR ANY IMPLIEDWARRANTY OR CONDITION ARISING OUT OF A COURSE OF DEALING, CUSTOM, OR USAGE OF TRADE. If a 3M product does not conform to this warranty, thenthe sole and exclusive remedy is, at 3M’s option, replacement or repair of the 3M product or refund of the purchase price.
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