TA8210AH / ALTOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic

TA8210AH,TA8210AL
20W BTL × 2ch Audio Power Amplifier

The thermal resistance θj−T of TA8210AH, TA8210AL package
designed for low thermal resistance, has a high efficiency of heatradiation.
The temperature rise of chip can be reduced, and the influence
from the degradation of the features due to the temperature riseat the high output can also be reduced.
This stereo audio power IC, designed for car audio use, has twobuilt−in channels to reduce the characteristic difference between
L and R channels.
In addition, the functions of stand−by and muting, and a variety
of protection circuits are involved.

Features·Low thermal resistance·High power: θj−T = 1.5°C / W (infinite heat sink): POUT (1) = 22W (typ.) / channel
WeightHZIP17−P−2.00: 9.8g (typ.)HSIP17−P−2.00: 9.8g (typ.)(VCC = 14.4V, f = 1kHz, THD = 10%, RL = 4Ω)
POUT (2) = 19W (typ.) / channel(VCC = 13.2V, f = 1kHz, THD = 10%, RL = 4Ω)·Low distortion ratio: THD = 0.04% (typ.) (VCC = 13.2V, f = 1kHz, POUT = 1W, RL = 4Ω, GV = 50dB)·Low noise: VNO = 0.30mVrms (typ.) (VCC = 13.2V, RL = 4Ω, GV 50dB, Rg = 0Ω, BW = 20Hz~20kHz)·

Built−in stand−by function (with pin(4) set at low, power is turned off.): ISB = 1µA (typ.)·

Built−in muting function (with pin(1) set at low, power is turned off.): V (mute) = 1V (typ.)·

Built−in various protection circuits
Protection circuits: Thermal shut down, Over voltage, Out→VCC short, Out→GND short and Out−Out short.

·Operating supply voltage: VCC = 9~18V

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Block Diagram
TA8210AH, TA8210AL (GV = 50dB)

Cautions And Application Method(description is made only on the single channel.)
1. Voltage gain adjustment

This IC has the amplifier construction as shown in Fig.1. The pre-amp (amp 1) is provided to the primary stage,
and the input voltage is amplified by the flat amps, amp 3 and amp 4 of each channel through the phase amp.
(Amp 2).
Since the input offset is prevented by pre-amp when VCC is set to on, this circuit can remarkably reduce the popnoise.

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The total closed loop gain GV of this IC can be obtained by expression below when the closed loop voltage gain ofamp 1 is GV1.
G V1 = 20log

R1 + (R f + R2)(dB)
R f + R2.....

(1)

The closed loop voltage gain of power amp, amp 3
and amp 4 is fixed at GV3≒GV4 = 20dB.
Therefore, the total closed circuit voltage gain GV isobtained through BTL connection by the expression
below.
GV = GV1 + GV3 + 6 (dB) ............... (2)For example, when Rf = 0Ω, GV is obtained by theexpressions (1) and (2) as shown below.
GV≒24 + 20 + 6 = 50dB
The voltage gain is reduced when Rf is increased. (Fig.2)
With the voltage gain reduced, since (1) the oscillation
stability is reduced, and (2) the pop noise changes whenVCC is set to on, refer to the items 3 and 4.
Fig.2

2. Stand-by SW function
By means of controlling pin(4) (stand-by terminal) to highand low, the power supply can be set to on and off.
The threshold voltage of pin(4) is set at 2.1V (3VBE.),and the power supply current is about 1µA (typ.) at thestand-by state.
Pin(4) control voltage : V (SB)Stand-byPowerV (SB) (V)OnOff

0~2OffOn

3~VCC
Fig.3 With pin(4) set to high, power is on.

Advantage of stand-by SW(1) Since VCC can directly be controlled to on / off by the microcomputer, the switching relay can be omitted.
(2) Since the control current is microscopic, the switching relay of small current capacity is satisfactory forswitching.

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3. Preventive measure against oscillation
For preventing the oscillation, it is advisable to use C4, the condenser of polyester film having small
characteristic fluctuation of the temperature and the frequency.
The resistance R to be series applied to C4 is effective for phase correction of high frequency, and improves theoscillation allowance.
Since the oscillation allowance is varied according to the causes described below, perform the temperature test to
check the oscillation allowance.
(1) Voltage gain to be used (GV setting)(2) Capacity value of condenser(3) Kind of condenser(4) Layout of printed board
In case of its use with the voltage gain GV reduced or with the feedback amount increased, care must be taken
because the phase-inversion is caused by the high frequency resulting in making the oscillation viablygenerated.
4. Input offset prevention circuit at VCC→on
Having Pre-Amp (Amp 1) mounted on the primary stage, this IC contains the circuit for making the Amp 1 input
voltage and the NF terminal voltage equipotential.
Therefore, the offset voltage produced at the input stage is suppressed to prevent the pop noise at VCC→on. The
capacity values of the input and NF condenser (C1 and C2) shall be set according to the gain to be used.
(Reference) (A) At GV = 50dB (Rf = 0Ω)
C1 = 4.7µF, C2 = 47µF
(B) At GV = 40dB (Rf = 470Ω)
C1 = 3.3µF, C2 = 33µF

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5. Muting function
Through setting pin(1) (mute terminal) at about 1V or less, muting becomes possible.
The interval circuit of IC is shown in Fig.4.
When pin(1) is set to low, Q1 and Q2 are turned to on, the charge of the ripple condenser is discharged and thebias is cut. The mute amount of 60dB or over can be obtained.
Since this muting function rapidly discharge the charge of the ripple filter capacitor of pin(8), the pop noise isgenerated by the DC fluctuation of the bias section.
Therefore, this muting function is not appropriate to the audio muting but it is effective in muting at VCC→on.

6. External part list and description
Influence

SymbolRecommendedValueFeature

C14.7µF

DC blocking

Smaller Than
Recommended Value

Larger Than
Recommended Value

Related to pop noise at VCC→on.

Remarks
Related to gain.
Refer to item 4.

Related to pop noise at VCC→on.
Determination of low cut-off frequency.
C247µF

Feedback
condenser
C2 =12F・fL・R f

C3220µF

Ripplereduction

Time constant is small
at VCC→on or off.

Time constant is large
at VCC→on or off.

C40.12µF

Oscillation
prevention

Made liable tooscillate.

Oscillation allowance.

C51000µF

Ripple filter

For filtering power supply hum and ripple.
Large at using AC rectified power supply.
Small at using DC power supply.

C61000PF

Oscillation
prevention

Oscillation allowance improved.
Noise reduction

5

Refer to item 3.

Refer to item 3.

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Maximum Ratings (Ta = 25°C)
Characteristic

SymbolRatingUnit

Peak supply voltage (0.2s)

VCC (surge)

50

V

DC supply voltage

VCC (DC)

25V

Operating supply voltage

VCC (opr)

18

V

Output current (peak)

IO (peak)

9APower dissipation

PD50W

Operating temperatureTopr-30~85°C

Storage temperature

Tstg-55~150°C

Electrical Characteristics(unless otherwise specified, VCC = 13.2V, RL = 4Ω, f = 1kHz, Ta = 25°C)
CharacteristicSymbol

Test
Circuit

Quiescent supply current

ICCQ

―

POUT (1)
POUT (2)Output power

Min.

Typ.

Max.

Unit

VIN = 0―120250mA―

VCC = 14.4V, THD = 10%―22――

THD = 10%1619―

POUT = 1W

Total harmonic distortion

THD―

Voltage gain

GV―

Output noise voltage

VNO―

Ripple rejection ratioR.R.

Input resistance

Test Condition

W―

0.04

0.4%

485052dB

Rg = 0Ω,
BW = 20Hz~20kHz

―

0.30

0.70

mVrms

―

fripple = 100Hz,
Rg = 600Ω

4054―

dB

RIN―

―

―

30―

kΩ

Output offset voltage

Voffset

―

-0.3

00.3

mV

Current at stand−by state

ISB―

―

110µA

Cross talk

C.T.

―

Rg = 600Ω,
VOUT = 0.775Vrms (0dBm)

―

60

―

dBPni(4) control voltage

VSB―

Stand-by→off(power→on)

2.5―

VCC

VPin(1) control voltage

V (mute)―Mute→on(power→off)

―1.0

2.0V

―

VIN = 0―6

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Test Circuit
TA8210AH, TA8210AL (GV = 50dB)

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Package Dimensions

Weight: 9.8g (typ.)102002-10-30

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Package Dimensions

Weight: 9.8g (typ.)11

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RESTRICTIONS ON PRODUCT USE

000707EBA· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physicalstress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards ofsafety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure ofsuch TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions andconditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
· The TOSHIBA products listed in this document are intended for usage in general electronics applications(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life orbodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane orspaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in thisdocument shall be made at the customer’s own risk.
· The products described in this document are subject to the foreign exchange and foreign trade laws.
· The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or otherrights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
· The information contained herein is subject to change without notice.

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