Technical Datasheet

Memory Burn-in Sockets

Innovators in Socket Technology
We provide proven solutions to our customers, worldwide.
Boyd delivered more than 8 million memory sockets in 2004.
The Interconnection team works on next generation sockets to meet the newest requirements of ourcustomers’ rapidly growing markets.

BC 01.2024

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Industry/Application/Product
Memory Burn-in Sockets
Product Roadmap
Future is clear - More I/O at smaller sizes• Using the latest 3D design tools such as SolidWorks and non-linear FEA, the Interconnection engineers createnew designs to meet your schedule.
• The availability of on-site model shops and rapid prototyping facilities allows the creation of prototypes socustomers can evaluate new designs and concepts in days instead of weeks.
• A comprehensive technical service laboratory with advanced thermal analysis capabilities and wind tunnels
allows Sensata to evaluate the thermal characteristics of of the sockets.
Moore’s Law continues to be validated as
semiconductor companies drive more function
in smaller form factors. The back-end packaging
and assembly teams support this drive with thedevelopment of new package formats for SIP,stacked die and stacked packages. Suppliersof burn-in sockets are challenged to develop
sockets for these new packages with higher I/O.
Boyd Interconnection team eliminates the burnin socket selection process by partnering withour customers to understand their needs andprovide the optimal solution.

Product Features
Three primary contact designs have been developed to satisfy cus-tomer requirements for reliable electricaland mechanical interconnect. These contacts leave small “witness marks” on the solder ball and are available
for Pb/Sn and Pb-free solder balls. The contacts, which open to allow package insertion, touch the solder ballabove the equator when closed.

• Various contact designs• Lower resistance contacts•Customized plating options

Witness mark left by Boyd contact

BC 01.2024

www.boydcorp.com

2

Industry/Application/Product
Memory Burn-in Sockets
Delivering World Class Solutions
Providing customers with solutions, Boyd Interconnection creates burn-in sockets for the semiconductor
electronics industry to ensure the quality and reliability of the packaged device. Boyd engineers work withcustomers to provide a burn-in socket which maximizes the customers’ burn-in system capacity for the lowest
overall cost of ownership. Boyd offers a portfolio of sockets to serve memory manufacturers.

Design Features• Open-top, auto-load actuated socket• Small socket outline maximizes burn-in board
density and process throughput• Multiple package outlines and heights• Custom options: adapter-less, coverless, lead
lengths, plating options, color options

BGA Memory Socket Platforms (Series)
Memory Portfolio

Socket Attributes• Numerous pitches available• Small socket outline• Extensive product offering• Socket outlines maximize boad density• Proven contact• Numerous socket platforms• Removable adapter

NOTICE: The information included in this data sheet is believed to be accurate and reliable. Boyd assumes noresponsibility for end use applications and no performance warranty is expressed or implied.
BC 01.2024

www.boydcorp.com

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