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by MPX4115A/D

SEMICONDUCTOR TECHNICAL DATA

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!#$ "$Motorola’s MPX4115A/MPXA4115A series sensor integrates on–chip, bipolar op amp
circuitry and thin film resistor networks to provide a high output signal and temperaturecompensation. The small form factor and high reliability of on–chip integration make theMotorola pressure sensor a logical and economical choice for the system designer.
The MPX4115A/MPXA4115A series piezoresistive transducer is a state–of–the–art,monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced
micromachining techniques, thin film metallization, and bipolar semiconductor processing toprovide an accurate, high level analog output signal that is proportional to applied pressure.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure
sensor chip.

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INTEGRATEDPRESSURE SENSOR
15 to 115 kPa (2.2 to 16.7 psi)
0.2 to 4.8 Volts Output

UNIBODY PACKAGE

Features• 1.5% Maximum Error over 0° to 85°C

MPX4115A
CASE 867• Ideally suited for Microprocessor or Microcontroller–
Based Systems• Temperature Compensated from –40° to +125°C• Durable Epoxy Unibody Element or Thermoplastic(PPS) Surface Mount Package
Application Examples

SMALL OUTLINE PACKAGE• Aviation Altimeters• Industrial Controls• Engine Control• Weather Stations and Weather Reporting Devices*'("  !
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Figure 1. Fully Integrated Pressure Sensor
Schematic

REV 4

Motorola Sensor Device Data Motorola, Inc. 2001

MPX4115AP
CASE 867B

MPXA4115A6U
CASE 482

MPX4115AS
CASE 867E

PIN NUMBER
1

PIN NUMBER

N/C

5

N/C

1

Vout

4

N/C

2

VS

6

N/C

2

Gnd

5

N/C

3

Gnd

7

N/C

3

VS

6

N/C

4

Vout

8

N/C

NOTE: Pins 1, 5, 6, 7, and 8 areinternal device connections. Do notconnect to external circuitry or
ground. Pin 1 is noted by the notch in
the lead.

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NOTE: Pins 4, 5, and 6 are internal
device connections. Do not connect
to external circuitry or ground. Pin 1
is noted by the notch in the lead.

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MAXIMUM RATINGS(NOTE)Parametrics

Units

Maximum Pressure (P1  P2)

Pmax

400

kPa

Storage Temperature

Tstg–40° to +125°°C

Operating TemperatureTA–40° to +125°°C

NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device.

OPERATING CHARACTERISTICS (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1  P2. Decoupling circuit shown in Figure 3
required to meet Electrical Specifications.)

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Characteristic

Symbol

Min

Typ

Max

Unit

Pressure Range

POP

15

—

115

kPa

Supply Voltage(1)

VS

4.85

5.1

5.35

Vdc

Supply Current

Io

—

7.0

10

mAdc

Minimum Pressure Offset(2)@ VS = 5.1 Volts(0 to 85°C)

Voff

0.135

0.204

0.273

Vdc

Full Scale Output(3)@ VS = 5.1 Volts(0 to 85°C)

VFSO

4.725

4.794

4.863

Vdc

Full Scale Span(4)@ VS = 5.1 Volts(0 to 85°C)

VFSS

4.521

4.590

4.659

Vdc

Accuracy(5)(0 to 85°C)

—

—

—

±1.5

%VFSS

Sensitivity

V/P

—

45.9

—

mV/kPaResponse Time(6)

tR

—

1.0

—

ms

Output Source Current at Full Scale Output

Io+

—

0.1

—

mAdc

Warm–Up Time(7)

—

—

20

—

ms

Offset Stability(8)

—

—

±0.5

—

%VFSS

NOTES:
1. Device is ratiometric within this specified excitation range.
2. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at theminimum rated pressure.
5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of spanat 25°C due to all sources of error including the following:• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature iscycled to and from the minimum or maximum operating temperature points, with zero differential
pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and fromminimum or maximum rated pressure at 25°C.
• TcSpan:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
• TcOffset:
Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative
to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected toa specified step change in pressure.
7. Warm–up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
8. Offset Stability is the product’s output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.

MECHANICAL CHARACTERISTICS
Characteristics

Typ

Unit

Weight, Basic Element (Case 867)

4.0

grams

Weight, Small Outline Package (Case 482)

1.5

grams

2

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Figure 2. Cross Sectional Diagram SOP(not to scale)Figure 3. Recommended power supply decoupling
and output filtering.
For additional output filtering, please refer toApplication Note AN1646.

Figure 2 illustrates the absolute sensing chip in the basic
chip carrier (Case 482).

Figure 3 shows the recommended decoupling circuit forinterfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended.

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Figure 4. Output versus Absolute Pressure
Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves
are shown for operation over 0 to 85°C temperature range.
The output will saturate outside of the rated pressure range.
A fluorosilicone gel isolates the die surface and wirebonds from the environment, while allowing the pressure
signal to be transmitted to the silicon diaphragm. The

Motorola Sensor Device Data

MPX4115A/MPXA4115A series pressure sensor operating
characteristics, internal reliability and qualification tests are
based on use of dry air as the pressure media. Media otherthan dry air may have adverse effects on sensor performance and long–term reliability. Contact the factory for
information regarding media compatibility in your application.

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ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005
Transfer Function (MPX4115A, MPXA4115A)

Nominal Transfer Value: Vout = VS x (0.009 x P – 0.095)± (Pressure Error x Temp. Factor x 0.009 x VS)
VS = 5.1 ± 0.25 Vdc

Temperature Error Band

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ORDERING INFORMATION — UNIBODY PACKAGE
Device Type

Options

Case No.

MPX Series Order No.

Marking

Basic Element

Absolute, Element Only

867

MPX4115A

MPX4115A

Ported Elements

Absolute, Ported

867B

MPX4115AP

MPX4115AP

Absolute, Stove Pipe Port

867E

MPX4115AS

MPX4115A

ORDERING INFORMATION — SMALL OUTLINE PACKAGE
Device Type

Options

Case No.

Basic Element

Absolute, Element Only

Ported Element

4

MPX Series Order No.

Packing Options

482

MPXA4115A6U

Rails

MPXA4115A

Absolute, Element Only

482

MPXA4115A6T1

Tape and Reel

MPXA4115A

Absolute, Axial Port

482A

MPXA4115AC6U

Rails

MPXA4115A

Absolute, Axial Port

482A

MPXA4115AC6T1

Tape and Reel

MPXA4115A

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Marking

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

INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must
be the correct size to ensure proper solder connection interface between the board and the package. With the correct

fottprint, the packages will self–align when subjected to asolder reflow process. It is always recommended to designboards with a solder mask layer to avoid bridging and shorting between solder pads.

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Motorola Sensor Device Data

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ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005
SMALL OUTLINE PACKAGE DIMENSIONS–A–

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6

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UNIBODY PACKAGE DIMENSIONS

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PRESSURE SIDE PORTED (AP, GP)

Motorola Sensor Device Data

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UNIBODY PACKAGE DIMENSIONS—CONTINUED

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CASE 867E–03
ISSUE DPRESSURE SIDE PORTED (AS, GS)

8

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guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of theapplication or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental
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MPX4115A/D