Semiconductor Solutions

It’sAllAll
About
theContact
It’s
About
theContact
Burn-In andTest
Sockets
ProductFeatures
ProductFeatures
ProductFeatures
Boyd'sInterconnection
burn-insockets
are aredesignedfor best
performanceandandBoyd'sInterconnection
burn-insocketsdesignedfor best
performance
Boyd’s burn-in sockets are designed for best performance and flexibility to accommodate several sizes.
burn-insocketelements:keyburn-insocketOurkeycompetitive
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ContactTechnology
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SocketDesign> SmallOutline
Contact
Technology> >>Platform
SocketDesign> SocketSocket
OutlineContact
Technology
Platform
SocketDesign>Small
SmallSocket
OutlineContact Technology

Contact
Technology:
Contact
Technology:

Three primary BGA contact designs have been developed to satisfy customer requirements for reliable
Three
primary
BGA BGA
contact
designshavehave
beenbeendeveloped
to satisfy
requirements
for reliable
Three
primary
contact
designs
developed
to satisfy
customerrequirements
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electricalandmechanicalinterconnect.
These
contacts
leavesmallcustomer“witnessmarks”
on thesolderball and do
electricaland mechanicalinterconnect.
These
contacts
leaveleavesmallsmall“witnessmarks”
on theball andelectricaland mechanicalinterconnect.
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contacts“witnessmarks”
on solder
the solderball doand do
not touch the bottom of the ball. These contacts are available for Pb/Sn and Pb-free.
not touchthe bottomof the
Thesecontacts
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for Pb/Sn
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not touchthe bottomof ball.
the ball.
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henclosed.
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henclosed.
equator when closed. These contacts are
These
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typically used for 0.5 mm pitch and above.
above.
above.

Dual
Pinch
Contact
Boyd
DualPinch
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Boyd
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Offset Contact
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used for BGA
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for BGA Pitches
for BGA Pitches
for BGA Pitches
minimalballdamage
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0.5 mm –1.0 mm
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used
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for
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0.8mm-1.27mm 0.5mm-1.0mm

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Ada Adapter

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For finer pitch packages, 0.5 mm and below,

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hole holeand compression
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Buckling Beamused for BGA
pitches 0.5mm
and below

Buckling Buckling
Beam used
for BGA
Beam
used for BGA
pitches 0.5mm andpitches
0.5 below
mm and below

Platform
DesignPlatform
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Boyd'sInterconnection
burn-insockets
are designed
Boyd'sInterconnection
burn-insockets
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in withmind.
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Latch Latch

Platform
Benefits
Platform
Beneﬁts:
Platform
Beneﬁts:

Latch- Changing
thepackage
adapter
providesa fast,lowtime
cost
methodsupplying
foreachnew package
size without
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new sockets for each new package size without the expense and time oftoworkwithcustomers
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availabilityof through-put.
different bases within a socket family allows theInterconnection team to work with our customers to select the smallest
and confidence
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theofsocket.
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footprint,
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capacity and oven through-put.
- The socket uses the same proven, qualified contact technology –improving reliability and confidence in the performance of the socket

BC 0X.20XX

0.5mm Buckling Beam
Boyd internal photoshowing consistent alignment of witness mark0.5 mm Buckling
Beam Boydinternal
0.5 mm Buckling
BeamBoyd internal
SEM photoshowingconsistentconsistent
SEM
photo showingalignmentalignmentof witnessofmark
witness markwww.boydcorp.com

Adapter
Adapter Adapter

Cover
Cover Cover
Cover Cover
CoverSprings Springs

Springs

Slider Slider
BaseSlider

Base

Base
ContactsContacts
StopperContacts
Stopper
Lead Lead
Guide Guide

Stopper
Lead
Guide

1

Industry/Application/ProductBurn-In and Test Sockets
Featured Product 1.0mm AND 0.8 BGA Burn-In Sockets
Providing customers with solutions, Boyd creates burn-in sockets for the semiconductor electronics industry toensure the quality and reliability of thepackaged device. Our engineers work with customers to provide a burnin socket which maximizes the customers’ burn-in system capacity for the lowest overall cost of ownership.
Specific features of a Boyd socket are described below:

Design Features- Open top, auto-load, cover actuated socket.
- Contact protrusions pierce oxide to give
reliable contact.
- Dual beam contacts touch each solder ball

1.0 mm Pitch BGA

individually and independently.
- Socket latches ensure proper seating of IC

Product Availibility:
Max Package Size
27 x 27 mm
19 x 19 mm
22 x 14 mm

Socket Dimension
46 x 46 mm
31 x 31 mm
31 x 23 mm

package during loading.
- Low actuation force: Contacts minimize damage tothe solder ball.

Mechanical Characteristics
Contact System: Normally closed
Contact Force: Between 10 to 20 g/pin
Actuation Force: 3 to 5 kg (I/O independent)
Temperature Range: -55 C to 150 C
Package Insertion Force: Zero insertion force
Contact Point: Side of solder ball
Durability: 10,000 cycles min.

Electrical Characteristics

0.8 mm Pitch BGA

Current Rating: 1 A/pin

Product Availibility:

Inductance: 6nH (approx.) at 50 MHz

Max Package Size
27 x 27 mm
23 x 23 mm
19 x 19 mm
13 x 13 mm

Socket Dimension
41 x 41 mm
36 x 36 mm
32 x 32 mm
25 x 25 mm

Contact Resistance: 50 mΩ max. initial,
1 Ω max. after 10,000 cycles
Insulation Resistance: 1000 mΩ at 500 VDC Dielectric
Withstanding Voltage: For 1 minute at 700 VAC

NOTICE: The information included in this data sheet is believed to be accurate and reliable. Boyd assumes noresponsibility for end use applications and no performance warranty is expressed or implied.

Boyd 2023

www.boydcorp.com

2Featured Product 0.5 mm AND 0.4 mm Burn-In Sockets

Industry/Application/ProductBurn-In and Test Sockets

Accommodating package sizes from 15 x 15 to 4 x 4 mm, Boyd’s burn-in
socket portfolio for 0.5 mm and 0.4 mm pitch BGA packages is available in bothcompression mount and through-hole.
- Assembled in controlled environment- Available for range of package thicknesses- Through-hole and compression mount- Proven contact- Small socket outline
This image shows an array ofsolder balls on a 0.5 mm BGA
package after burn-in at 140C.
Note the uniformity of the alignment of the contact witness
marks illustrating the accurate alignment features of theBoyd socket.

- Interchangeable adapter

Buckling Beam Contact
Boyd’s Interconnection 0.5 mm and 0.4 mm pitch
burn-in sockets employ a vertically actuated“compression” style contact that interfaces withindividual solder balls. The contact-to-ball, interface
at two locations per ball, gives minimum sphericaldeformation while providing a reliable electricalconnection. The contact systems used accommodate
both Pb and Pb-free balls.

- Open top auto-load actuated socket- Small socket outlines available from26 mm x 19.5 mm to 40 mm x 40 mm- Low Actuation Force: From 1.2 kg

0.5 mm Pitch
Product Availibility:

depending on pin count- Contact Life exceeds 10,000 actuations

Max Package Size Socket Dimension
15 x 15 mm
40 x 40 mm
14 x 14 mm
30 x 25 mm
10 x 10 mm
30 x 30 mm
11 x 10 mm
26 x 20 mm- No contact on bottom of ball

Mechanical Characteristics
Contact System: Dual buckling beam and dual pinch
Package Insertion Force: Zero insertion force
Contact Force: 10-14 g/pin range

0.4 mm Pitch
Product Availibility:

Temperature Range: -55ºC to 150ºC
Contact Point: Side of solder ball

Max Package Size Socket Dimension
14 x 14 mm40 x 25 mm

Electrical Characteristics
Current Rating: 0.25 A/pin @ 125ºC

Pinch Style Contact

Insulation Resistance: 1000 mΩ at 500 VDC

Boyd’s Interconnection 0.5 mm and 0.4 mm pitch

Dielectric Withstanding Voltage: For 60 seconds at

also offers a small 26 × 19.5 mm outline throughhole socket for smaller 0.5 mm packages. This socket
can accept packages up to 11 × 17 mm and utilizes
a dual pinch style contact, eliminating any witness
marks on the bottom of the ball.

Design Features

500 VDC
Inductance: 6nH (approx.) at 50 MHz
Contact Resistance: 150 mΩ max initially; 1 Ω max
after 10K cycles.

NOTICE: The information included in this data sheet is believed to be accurate and reliable. Boyd assumes noresponsibility for end use applications and no performance warranty is expressed or implied.

Boyd 2023

www.boydcorp.com

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