MILITARY | INDUSTRIAL | COMMERCIAL

M1U-20

1U HIGHPERFORMANCECOMPUTER

1U COMPUTER
Our M1U-20 computing platform is a high-powered system
in a small form factor, appropriate for computationallyintense military applications. It has exceptional strengthand built-in redundancy, is low weight, and contains ourproprietary SysCool® thermal management system.
SysCool® extends the life of the computing system,
reduces power consumption, and lowers overall system
noise levels. The M1U-20 system is ideal for those seeking
a rugged rackmount 1U system designed to perform in
confined spaces. Uniquely offered with an attached front
door with integrated air (or optional EMI) filter serves toprotect the drive bays and other components from dustand dirt, as well as shielding that is compliant for
MIL-STD-461 EMI.

APPLICATIONS
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Airborne Operations
Land-based Operations
Seaborne Operations
Telemetry
Diagnostics
Simulation
C4ISR
Communications
Imaging
Persistent Surveillance
UAVs
Automation
Severe Environment Operations

Who We Are

Assembled in the USA
ISO 9001:2015 Certified
ITAR Registered

CP Technologies designs, fabricates and integrates standard and customized
high-performance computing platforms and LCD monitors for military, industry,
and commercial applications.
Using COTS components, CP Technologies provides solutions for customers
who need reliable systems that will operate in a variety of harsh conditions andwho require revision control and hardware consistency for multi-year programs.
CP Technologies is an ITAR Registered and SBA-certified small business that has
been operating in Southern California for over a twenty years.

CP Technologies
10840 Thornmint RoadSan Diego, CA 92127
cp-techusa.com
858.571.4330

MILITARY | INDUSTRIAL | COMMERCIALTECH SPECSCOMPUTER SPECIFICATIONSEXPANSION CAPACITYCPU

Single or Dual Intel® Xeon® Processor
E5-2658 (20M, 2.10 GHz, 8.0 GT/s Intel®
QPI)
Single or Dual Intel® Xeon® Processor
E5-2648L (20M, 1.80 GHz, 8.0 GT/s Intel®
QPI)•3(x) 2.5” Drive Bays, Shock-Isolated•

1(x) Slim Slot-Fed Optical Drive•

1(x) Flash Card Reader Bay (optional)•2(x) PCIe x 16 (3.0) Card Slots

CHIPSETIntel® C606, QPI up to 8.0 GT/s

FRONT DOOR FEATURESMEMORY CAPACITY(16x) 240-pin DDR3, Max. 512GB

STORAGEUp to (3x) shock-isolated 2.5” removabledrives, standard 500GB, 7200 RPM, 64GB
cache. Other rotating media and solidstate storage sizes available

RAID OPTIONJBOD, RAID 0, 1, 5

OPTICAL DRIVE

Slim Slot-Fed 8x DVDRW

EXPANSION SLOTS(2x) PCIe x16 (Gen 3.0), 1(x) 6.7”1(x) 10.0” Max Length

REAR I/O(1x) DB-9 RS232 serial port,(2x) RJ45 GbE LAN ports,(4x) USB 2.0 ports,(1x) RJ45
dedicated IPMI,
DB-15 VGA port(1x) UID switch

ONBOARD GRAPHICS

G200 (Renesas SH7757 BMC)

AUDIO

N/ALAN

Dual Intel® i350 Gigabit Ethernet ports(1x) Realtek® RTL8211E PHY (DedicatedIPMI)FRONT USB PORTS(2x) ports USB 2.0

SYSTEM COOLING(5x) 40mm, 18.4 CFM, 100K hour MTBF
cooling fans Proprietary SysCool™
intelligent adaptive fan controller andtemperature alarm circuit board

MOTHERBOARD CAPACITY

Designed for EATX-sized motherboard(12” X 13”)

POWER SUPPLYRedundant 600W 110/220 Volt AC
Other power options available

cp-techusa.com
858.571.4330

Milled aluminum with four captive closure fasteners
Milled channel with RF/EMI/environmental gasket
Attenuating EMI honeycomb fi lter with 45 PPI(washable) air filter rated to UL 94 HF-1

CP Technologies
10840 Thornmint RoadSan Diego, CA 92127

MILITARY | INDUSTRIAL | COMMERCIALTECH SPECS
CHASSIS SPECIFICATIONSDIMENSIONS

19” X 1.75” X 20” (482.6mm X 44.5mm X 508mm)

WEIGHT

19.6 lbs (approximate weight. Varies with configuration)

CONSTRUCTION

Front Panel: 0.187” milled 5052-H32 aircraft-grade aluminum
Enclosure Body: 0.062” 5052-H32 aircraft-grade aluminum
Rear Slot Panel: 18 gauge CRS, zinc plated

POWDERCOATING

Black per MIL-PRF-24712, Type IV, Class 3, Cardinal C214-BK110
polyester semi-gloss, fine texture

PLATING

Chem-Film per MIL-C-5541F, Class 1A

HARSH ENVIRONMENTS
Designed to meet or exceed MIL-STD-810G to the below specifications.
ALTITUDE

12,000 ft Operational, 40,000 ft Storage
MIL-STD-810, Method 500.6

HIGH TEMPERATURE

60°C Operational, 70°C Storage
MIL-STD-810, Method 501.6

LOW TEMPERATURE-10°C Operational, -40°C Storage
MIL-STD-810, Method 502.6

HUMIDITY

5-95%, Non-condensingMIL-STD-810, Method 507.6

BLOWING SAND
AND DUSTMIL-STD-810, Method 510.6

TRANSPORT VIBRATIONMIL-STD-810, Method 514.7

BENCH HANDLING SHOCK

MIL-STD-810, Method 516.7 Procedure VI

ENGINEERED TO YOUR SPECIFICATIONS• In-house engineering department• Design and build of rapid prototypes. Experience withsolving difficult customer application problems throughknowledge of the industry and custom system design andmanufacturing capability• Our Engineers use Solid Works 3D CAD modelingsoftware for mechanical design and thermal simulation• Design experience with MIL-STD-167, MIL-STD-461,
MIL-STD-810, and MIL-S-901, in addition to FCC, UL,CE, and country specific agency requirements

REVISION CONTROL &CONFIGURATION MANAGEMENT• Our Program Managers will assure your products are revisioncontrolled for the life of the program• Configuration Management to assure TAA Compliance andsystem compatibility• One part number for life of the program• Counterfeit and obsolescence management

FACILITY AND TEST
• All integration work is performed in a state-of-the-art,
ESD-controlled facility• Our facility has 23,000 sqft and has dedicated 12,000 sqft tomanufacturing and 3,000 sqft to engineering• Operate to anti-static standard ANSI/ESD S20.20-2007 andelectronics assembly standard IPC-A-610, Revision E-2010

QUALITY COUNTS• ISO 9001:2015 Certified• 100% system inspection before shipment• All integrated systems undergo a minimum 24-hour systemtest and burn-in before shipment to the customer• Assistance with 3rd party verification of system
specifications• 5-year warranty on all servers and 3-year warranty on LCD
monitor products• TAA compliant• Built in the USA

CP Technologies
10840 Thornmint RoadSan Diego, CA 92127