Application Report
SLVA927A – November 2017 – Revised April 2019

Basics of Power Switches
Arthur Huang, Emily Roth
ABSTRACTA Power Switch provides an electrical connection from a voltage source or ground to a load. It saves
power across multiple voltage rails and protects subsystems from damage. It also provides enhanced
component protection, inrush current protection, and minimizes printed-circuit board (PCB) size.
There are several power switch topologies with different functions that address different applications. Load
Switches establish the power switch foundation by providing safe and reliable distribution of power.
Applications typically using load switches include power distribution, power sequencing, inrush current
control, and reduced current leakage. Integrated Power MUX devices are similar to load switches butallow for multiple input sources. This set of electronic switches is used to select and transition between
two or more input power paths to a single output while also providing input power protection.
eFuses and Hot Swap controllers provide additional input power path protection functions such as current
sense monitoring, current limiting, undervoltage and overvoltage protection, and thermal shutdown. This
makes these devices ideal for hot-plug and transient events that would otherwise damage systemcomponents. These benefits help reduce system maintenance costs and maximize equipment uptime.
Ideal diode, ORing controllers provide protection against reverse-polarity conditions by monitoring an
external FET, significantly reducing power loss, and blocking reverse current. Whenever a transient event
occurs, the controller monitors and adjusts the external FET to prevent damage to upstream components.
Smart high-side switches are for off-board load protection. They provide additional diagnostic telemetrythat monitors the output load current and detects short-circuit and open-load events. Smart high-side
switches have adjustable current limits, allowing for more reliable integration into applications with either
large inrush current startup profiles or low peak currents. Adding a smart high-side switch to a design
leads to a smarter and more robust solution for driving capacitive, inductive, and LED loads.
Low-side switches connect the load to ground instead of providing a connection between a power supply
and the load. By including an integrated flyback diode, low-side switches help eliminate inductive loadtransients by dissipating current in a circular loop. This allows them to drive inductive loads such assolenoids, relays, and motors.
This application report highlights the different topologies within the power switch portfolio, and provides
suggestions in choosing the correct solution for a faster design time.

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Basics of Power Switches1www.ti.com

Table 1. Power Switch Topology Table
POWER DISTRIBUTION

POWER PATH PROTECTION

Load Switch

Power MUX
(2 input, 1
output)eFuse(Internal FET)Hot Swap(External FET)

Ideal Diode
ORing
Controller

Smart HighSide Switch

Low-Side
SwitchVoltage Range

0 V to 18 V

2.8 V to 22 V

2.7 V to 60 V

±80 V

±75 V

6 V to 40 V

0 V to 100 V

Max Operating Current

15 A

4.5 A

15 A

N/A

N/A

12 A

1A

✓

✓

✓

✓

✓

✓

✓

✓

✓

✓

✓

✓

✓

✓

✓ (1)

✓

✓

✓

✓

✓

✓

✓

✓

✓

✓

✓

✓

✓

✓

✓

✓

Functions
Inrush Current Control
Adjustable Current Limit
Reverse Current Blocking
Current Sense Monitoring
Short-Circuit Protection
Overvoltage Protection
Reverse Polarity Protection✓

Power Good Signal

✓
✓
✓

✓

✓

Inductive Load Compatibility
Load-Dump Compatibility✓

Thermal Shutdown
(1)

✓

✓

✓

✓

✓

✓

✓

Self protected load switch

Input Protection

Power Distribution

Hot Swap
Controller

Ideal Diode

Load Switch

DC/DC
Ideal Diode

Load
Load

Hot Swap
Controller

eFuse
eFuse
Load Switch

Power
Mux

Load

Output Power
Protection

VDS Clamp

LoadHigh Side Switch

Power Distribution
Figure 1. Typical Power Switch Use Cases

1
2
3
4
5
6
7
8

Contents
Load Switches ................................................................................................................ 3
Power Multiplexing........................................................................................................... 4
eFuses ........................................................................................................................ 5
Hot Swap...................................................................................................................... 6
Ideal Diode, ORing Controllers............................................................................................. 7
Smart High-Side Switches .................................................................................................. 8
Low-Side Switches ......................................................................................................... 10
References .................................................................................................................. 10

Trademarks

2

Basics of Power Switches

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Load Switches

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1

Load Switches
VIN

VOUT

ON

Control
Logic

QOD

CT

GND

Copyright © 2017, Texas Instruments Incorporated

Figure 2. Load Switch Block Diagram
Integrated load switches are electronic switches that turn power rails on and off. When the internal FETturns on, current flows from the input to output and passes power to the downstream circuitry. When thedevice is enabled, the rise time of the output voltage (VOUT) can be controlled by adjusting the capacitanceon an external pin (CT pin). When the device is disabled, the fall time of VOUT is controlled through thequick output discharge (QOD). QOD pulls the output to ground whenever the device is turned off,
preventing the output from floating or entering an undetermined state.
Some common functions of load switches include power savings, power sequencing, and inrush current
control. Power savings is important in applications looking to minimize current dissipation and maximize
power efficiency. By disconnecting the supply from a load or subsystem, the switch minimizes powerdrawn from inactive loads. Power sequencing is important in applications where individual voltage rails
need to be turned on and off in a specific order. By configuring the CT and QOD pins, the ramp-up andpower-down timing can be adjusted. Inrush current control protects systems that contain large bulk
capacitors near the load. When power is initially applied to the system, charging these capacitors canresult in a large inrush current that exceeds the nominal load current. If left unaddressed, this can cause
voltage rails to fall out of regulation due to the drop, resulting in the system entering an undesired state.
Load switches can mitigate the inrush current by using the CT pin to manage the rise time of the power
rail. This leads to a linear output slew rate with no voltage dips or external regulators required.
Table 2. Load Switch Examples (1)VOLTAGERANGEMAXCURRENTTYPICAL Ron

PACKAGETPS22918

1 V to 5.5 V

2A

52 mΩ

SOT

TPS22810

2.7 V to 18 V

2A

79 mΩ

SOT

TPS22915

1.05 V to 5.5 V

2A

37 mΩ

CSP

TPS22916

1 V to 5.5 V

2A

60 mΩ

CSP

Self protected with controlled rise time

TPS22919

1.6 V to 5.5 V

1.5 A

90 mΩ

SOT

Lowest ON-resistance, power good indication

TPS22990

1 V to 5.5 V

10 A

3.9 mΩ

SON

Fast turn-on time (≤ 65 µs), Power Good indication,
QOD, thermal shutdown

TPS22971

0.65 V to 3.6 V

3A

6.7 mΩDSBGA

DESCRIPTIONDEVICES

Adjustable rise time, adjustable QODSpace-constrained applications(1)

TI.com/LoadSwitches for more information about load switches.

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Basics of Power Switches3Power Multiplexing2

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Power Multiplexing
BFET1

IN1

HFET1

SS

Temp
SNS

CSS

Control Logic+ Gate Drivers

OUT

Protecion

Temp
SNS

IN2
BFET2

HFET2

Figure 3. Power MUX Block Diagram
Integrated Power MUX devices allow a system to transition between different power sources seamlessly.
If the main power supply fails, power multiplexing allows the system to switch to a backup power supply,
such as a battery, to preserve operating conditions. Power multiplexing can also provide switching
between two different voltage levels for subsystems that operate at two different voltages. In this scenario,
to prevent reverse current flow from VOUT into one of the VIN channels, reverse current protection (RCP)
blocks current from flowing back through the body diode. Power multiplexing also contains adjustablecurrent limits. If the current exceeds the threshold set by the switch, the switch clamps the channel andprevent current from exceeding the limit. Furthermore, if the current limit forces the device to reach higher
temperatures, thermal shutdown turns off the switch until it can operate at safe conditions again. Similar toload switches, power MUX switches also contain inrush current control to prevent large transient current
events.
Power MUX devices can switch between different power rails in three general ways: manually,
automatically, or both. Manual switchovers occur with an external GPIO. Whenever you want to switch
between power rails, the enable pin is toggled and the output is powered by the other power rail.
Automatic switchover occurs whenever the primary power supply fails or is disconnected. When thedevice detects the voltage drop, it automatically switches to the backup power rail. There are some PowerMUX solutions which offer the flexibility to be used in an automatic configuration and to be controlled by amanual control signal. This method can have a default (automatic) priority, but can then be overridden by
an external microcontroller if needed.
Table 3. Integrated Power MUX Examples (1)DEVICE

RECOMMENDED
VOLTAGE RANGEMAX CURRENTTYPICALRon

PACKAGE

Automatic priority and manual override, adjustablecurrent limit

TPS2120

2.8 V to 22 V

3 A, each channel

62 mΩ

CSP

Automatic priority and manual override, fast output
switchover, adjustable current limit

TPS2121

2.8 V to 22 V

4.5 A, each channel

56 mΩ

QFN

DESCRIPTION(1)

4

TI.com/PowerMux for more information about power multiplexing.

Basics of Power Switches

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eFuseswww.ti.com

3

eFuses
VIN

VOUT

OVP

EN/UVLO

Control
Logic
dVdT

GND

ILIM

Current
Limit

Copyright © 2017, Texas Instruments Incorporated

Figure 4. eFuse Block Diagram
eFuses are integrated power protection switches that provide voltage and current protection during fault
events. These include short-circuit, overcurrent, overvoltage, undervoltage, and temperature events thatmight otherwise damage downstream loads. During a short-circuit transient event, the current through theeFuse increases very rapidly. The eFuse enables a fast-trip current threshold that terminates this rapid
increase in less than 200 ns, protecting the supply. If an overvoltage event occurs on the input (VIN), theeFuse monitors the voltage across the internal FET and clamps the output voltage until the input falls
below the overvoltage threshold. eFuses also come with built-in overtemperature protection that shuts
down the FET if the junction temperature exceeds 150°C (typical). The eFuse either remains off (latch-off
version) or attempts to restart (auto retry version) the device after the junction temperature decreases.
eFuses offer many additional features similar to load switches including adjustable inrush current control
and reverse current protection.
Managing current flow from an active power bus to a subsidiary system can be a challenging task. As adevice is inserted or removed from a live supply, it is possible to see a very large spike in current during
the initial capacitor charging. An eFuse or Section 4 controller ensures the safe insertion and operation ofthese systems. Unlike hot swap controllers, eFuses contain an integrated FET which minimizes totalsolution size. This allows eFuses to be used in applications such as power multiplexing. By using two
eFuses, each eFuse can control a power rail while providing reverse current protection for its respective
supply. eFuses are also UL 2367 certified, cutting down on system testing time.
Table 4. eFuse Examples (1)DEVICE

RECOMMENDED
VOLTAGE
RANGE

MAX
CURRE
NT

TYPICA
L Ron

PACKAGE

Overvoltage or undervoltage clamp, QOD using FLT pin,adjustable current limit

TPS2595

2.7 V to 18 V

4A

34 mΩ

SON

Lowest Ron circuit-breaker device, accurate load monitoring,
adjustable transient fault management

TPS25982

2.5 V to 24 V

15 A

3 mΩ

QFN

Back to back FETs, status monitoring, thermal shutdown, internal
reverse current blocking

TPS25942A

2.7 V to 18 V

5A

42 mΩ

QFN

Reverse polarity protection, current sense output, adjustablecurrent limit

TPS2660

4.2 V to 55 V

2A

150 mΩ

SOP and
QFN

4.5 V to 60 V

6A

31 mΩ

SOP and
QFN

4.5 V to 60 V

6A

31 mΩ

SOP andQFN

DESCRIPTIONPower limiting, overvoltage cut-off or voltage clamping functionality
Power limiting, reverse current blocking, reverse polarity protection(1)

TPS1663
TPS2663

Visit www.ti.com/efuses for more information about eFuses.

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Basics of Power Switches5Hot Swap

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Hot Swap
Rsns

VIN

VOUT
GATE

Telemetry
Control

OVP

Isns

PG

Gate Logic

Rpg

Control Logic
UVLO
TIMER

PWR

GND

Copyright © 2017, Texas Instruments Incorporated

Figure 5. Hot Swap Block Diagram
Hot Swap controllers drive an external MOSFET that protects the system against hot swap events. Hot
Swap controllers do not integrate a MOSFET as eFuses do. The external MOSFET allows hot swap
controllers to operate at higher voltages and currents than eFuse devices. The controller monitors the gate
voltage of the external FET and adjusts the voltage depending on the situation. When the device isinserted into a live power system, the controller measures the inrush current across RSNS. If the value
exceeds the programable current limit, the gate voltage is lowered and limits the current passing
downstream. If the power dissipated across the FET exceeds the programmable power limit, then the gate
voltage is reduced to lower the current flowing through RSNS. The overvoltage and undervoltage pins also
clamp the voltage whenever the input voltage is not within specified thresholds.
To ensure that the external MOSFET remains within safe operating area (SOA), the hot swap controller
regulates the current limit at higher VDS voltages. The device also includes an assortment of telemetry thatmonitors the operating conditions. The Power Good (PG) signal turns on whenever the power rail reaches
regulation, and some hot swap controllers contain PMBus monitoring that allows real-time feedback on thedevice status.
Since hot swap controllers operate by controlling an external RSNS and MOSFET, they do not contain an
innate current limit. The external components allow you to customize the solution size and power
requirements to fit their application.
Table 5. Hot Swap Examples (1)DESCRIPTIONDEVICE

RECOMMENDED VOLTAGE RANGEPACKAGETPS247xx

2.5 V to 18 V

SOP or QFNMeets 240-V requirements for high-end applications, similar to TPS247xx

TPS2477x

2.5 V to 18 V

QFN

PMBus and I2C communication, balance between efficiency and accuracy

LM25066A,
LM25066I

2.9 V to 17 V

QFNHigher voltage applications, PMBus and I2C communication, external FET
temperature and failure sensing

LM5066

10 V to 80 V

PWP

Higher voltage applications, SOA protection, current limit

LM50699 V to 80 V

SOP

Negative voltage support, SOA protection, PMBus and I2C communication

LM5064–10 V to –80 V

SOP

Negative voltage support with dual current limit, soft-start disconnect,
ORing support, –200 V maximum rating

TPS2352x–10 V to –80 V

SOP

Circuit breaker function for severe current events, programmable fault
timer, PG output

LM5067–9 V to –80 V

SOP

18-V analog devices, small footprint, easy-to-use(1)6Visit www.ti.com/hotswap for more information about Hot Swap controllers.

Basics of Power Switches

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Ideal Diode, ORing Controllers

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Ideal Diode, ORing Controllers
VOUT

VIN

Cathode

Anode
GATE

Current
Pulldown

Control Logic
Copyright © 2017, Texas Instruments Incorporated

Figure 6. Ideal Diode Block Diagram
Ideal diode controllers control an external FET and, similar to a regular diode, can block reverse current
whenever a reverse voltage event occurs. Whenever one of these events occur, the controller shuts off
the FET and uses the body diode to prevent any transients from damaging upstream components. The
controller can also prevent against ground shorts at the input (VIN) by using the same method.
Ideal diode controllers can also protect against reverse polarity conditions, commonly caused byconnecting a battery incorrectly or mis-wiring a power supply. If you accidentally switch the polarity on
VIN, an additional diode from the controller to GND can be included to prevent damage to the IC or the
power source. The controller also significantly lowers power dissipation normally found across diodes. By
driving the external FET instead of a diode, the voltage drop typically found across diode solutions can be
minimized.
Ideal diodes can also act as ORing controllers. Basic power redundancy architecture contains two or more
power supplies connected to a single load. ORing solutions allow the system to switch between powersources if one were to fail, and can even connect power sources in parallel. This allows for uninterrupted
power and saves on redundant power supply costs.
Table 6. Ideal Diode Controller Examples (1)DESCRIPTION
Fast turnoff, voltage sensing

DEVICE

RECOMMENDED
VOLTAGERANGETYPICALQUIESCENTCURRENTFORWARDVOLTAGETHRESHOLD

PACKAGESOP and SOICTPS241x3 V to 16.5 V

N/A

10 mV

Automotive qualified, low Iq, high efficiency

LM74700-Q1

3.2 V to 65 V

80 µA

20 mV

SOT

Low side ORing controller, FET diagnostics

LM5051–6 V to –100 V

69 µA

45 mV

SOIC

Low Iq, reverse current protection, integrated FET

LM66100

1.5 V to 5.5 V

0.2 µA

79 mV (2)

SC-70

(1)
(2)

Visit www.ti.com/idealdiode for more information about Ideal diode controllers.
Typical forward voltage at Iout = 1 A.

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Basics of Power Switches7

Smart High-Side Switches

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Smart High-Side Switches
Drain (VS)VDS Clamp

VIN

Diagnostics
andProtection

Diagnostics

Current Sense

Gate Logic

Current
Limit/Sense

VOUT

CL

Copyright © 2017, Texas Instruments Incorporated

Figure 7. Smart High-side Switch Block Diagram
Smart high-side switches reliably drive off-board loads. These switches contain highly-adjustable andselectable current limits that enable a system to be optimally designed for specific loads. By connecting an
external resistor to set the current-limit threshold, the switch protects the load and power supply fromoverstressing during short-circuits to GND events or power-up conditions. This enables more reliable
designs by minimizing transient currents and supply droops. When the threshold is reached, a closed loop
activates and clamps the output current to the set value. A fault is then reported on the CS pin.
These switches also offer highly-accurate current sensing to provide real-time diagnostics to the system. A
current mirror sources current from VIN, reflecting this as voltage on the Current Sense (CS) pin. The CS
pin does not need to be calibrated, and can serve as a diagnostics report pin. Whenever an open load or
short happens, the voltage on the CS pin falls to 0 V. Whenever a current limit, thermal event, or an open
load or short in the off state occurs, the voltage is pulled up to its maximum threshold. High-accuracy
current monitoring and adjustable current limit are ideal for industrial applications like programmable logic
controllers, motor valves, servo drives, and control units.
Another functionality of smart high-side switches is load-dump compatibility, which allows these devices toconnect directly to a 12-V battery without concerns about typical voltage and current transients. Additional
protection includes mitigation of large inrush current events that would otherwise damage downstream
components.
Smart high-side switches can be AEC-Q100 certified, allowing full integration into many automotive
applications that require a low on-resistance and high voltage tolerances to accommodate voltage spikes
and inrush current events. Some of these applications include front and rear lighting, seat heating,infotainment, cluster, powertrain, and ADAS.
Table 7. Smart High-Side Examples (1) (2)DESCRIPTIONDEVICE

RECOMMENDED
VOLTAGERANGE

CURRENTSENSE
ACCURACYCONTINUOUS LOAD
CURRENTTYPICA
L Ron

PACKA
GE

Selectable current limit for design flexibility, low RON,
small footprint, thermal sensing

TPS1HA08-Q1

3 V to 40 V

±5% at 1 A

0 A to 12 A

8 mΩ

SOP

TPS1H100-Q1

3.5 V to 40 V

±3% at 1 A

0 A to 4 A

100 mΩSOP

TPS27S100

3.5 V to 40 V

±3% at 1 A

0 A to 4 A

80 mΩ

SOP

TPSxH160-Q1

3.4 V to 40 V

±3% at 1 A

0 A to 1.8 A per channel

160 mΩ

SOP

Low standby current, highly accurate current sense,
thermal shutdown
Multi-channel support, fast hardware interrupts, low
standby current, loss of GND diagnostics

(1)
(2)

8

Additional devices in various typical RON values are available.
Visit ti.com/smarthighsideswitch for more information about smart high-side switches.
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Smart High-Side Switches

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Table 7. Smart High-Side Examples (1) (2) (continued)
DESCRIPTIONDEVICETPS2HB08-Q1

Dual-channel, programmable current limit
Inductive load negative clamp with optimized slew rate,
global fault report

TPSxH000-Q1

Highly accurate current limit, supports full diagnostics
with the digital status output

TPS1H200-Q1

RECOMMENDED
VOLTAGERANGE

CURRENTSENSE
ACCURACYCONTINUOUS LOAD
CURRENTTYPICA
L Ron

PACKA
GE

3 V to 28 V

+3/-8% at
1A

0 A to 8 A per channel

8 mΩ

SOP

3.4 V to 40 V-

0 A to 1A1Ω

SOP

3.4 V to 40 V-

0 A to 2.5 A

200 mΩSOP

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9Low-Side Switches

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Low-Side Switches
Vcc

Vcc

Load 1
IN1Load 2IN2

Load 7IN7Copyright © 2017, Texas Instruments Incorporated

Figure 8. Low-Side Switch Block Diagram
Low-side switches are used to connect and disconnect ground from a load, unlike the rest of the powerswitch topologies. This configuration allows low-side switches to drive inductive loads; an internal flyback
diode prevents inductive transients from damaging the circuit and components. Whenever the switch is
opened, the inductive transients flow through the flyback diode and dissipate throughout the load. This
makes these devices ideal for motors, solenoids, and relays.
Low-side switches consists of two designs: Darlington pair arrays and low-side MOSFET solutions.
Darlington pair solutions can support higher voltage applications due to the higher voltage ratings of theintegrated BJTs, while the MOSFET solutions have lower on-resistances and lower leakage currents. Mostof the low-side switches contain seven channels, which can be tied in parallel to support higher current
operation.
Table 8. Low-side Switch Examples
DEVICE

RECOMMENDED
VOLTAGE RANGEMAX
CURRENTNUMBER OF
CHANNELSPACKAGE

Darlington pair BJTs, higher voltage support

ULN2003A

0 V to 50 V

500 mA per
channel7

SOIC, SOP,
and DIP
Packages

Darlington pair BJTs, 8-channel support

ULN2803A

0 V to 50 V

500 mA per
channel8

SOIC

Low-side MOSFET solutions, low on-resistance and current
leakage, power efficient

TPL7407LA

0 V to 30 V

600 mA per
channel7

SOIC or SOPDESCRIPTION

8

References
1. Texas Instruments, Basics of Load Switches Application Report
2. Texas Instruments, What is an eFuse? Application Report
3. Texas Instruments, Robust Hot Swap Design Application Report
4. Texas Instruments, Adjustable Current Limit of Smart High Side Switch Application Report10

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Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
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Changed content in abstract. ............................................................................................................
Edited application report for clarity. .....................................................................................................
Changed headings, row 3, and row 7 in table 1. ......................................................................................
Added table notes to table 1. ............................................................................................................
Changed the caption for the Typical Power Switch Use Cases figure. ............................................................
Changed row 3 in table 2. ...............................................................................................................
Changed content in section 2. ...........................................................................................................
Changed row 1 and 2 in table 3. ........................................................................................................
Changed rows 2, 5, and 6 in table 4. ...................................................................................................
Changed title and row 1, 2, and 4 in table 6. ..........................................................................................
Changed content in section 6. ...........................................................................................................
Changed rows 4, 5, and 6 in table 7. ...................................................................................................

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