Study, Research and Dissemination Activities

Recent Trends in MEMS Standardization
MEMS international standardization will be essential to accelerate design and development, ensure compatibility and quality
and enable mass production. In Japan, the Micromachine Center is playing a leading role in promoting MEMS standardization.
Three international standards proposed by Japan have been published, and one more is currently under consideration. Recently
South Korea has also become actively involved in international standardization activities; so far, one standard proposed bySouth Korea has been published, four are currently under consideration and two have been submitted as proposals.
International standards in the MEMS field have been prepared by Working Group 4 (WG4) of Technical Committee
Meeting No. 47 (TC 47) (semiconductor devices) of the International Electrotechnical Commission (IEC). In October 2007,
Japan proposed that this working group be upgraded to a subcommittee (SC) and offered to serve as secretariat. The statusof activities of WG4 and Japan’s achievements and contributions up to now were evaluated by the other countries, and inMay 2008 the proposal was approved. Nine nations participated as regular members: China, Germany, France, Italy, Japan,South Korea, the Netherlands, Russia and the United States. The Micromachine Center became the domestic consideration
organization for the new subcommittee, SC47F, and assumed the secretary.
The first international conference for SC47F was held October 28 - 30 at the Mita Kaigisho in Tokyo to coincide with theTC47 conference. The following table shows the status of individual documents, focusing on the content of the discussions
at this conference.
Document

Proposed Proposed By Level

IEC 62047-1;
Terms and definitions

StatusJuly 2002JapanISPublished as an International Standard (IS) in September 2005.
Published as a Japanese Industrial Standard (JIS C 5630-1) in March 2008.

IEC 62047-2;
July 2003
Tensile test method of thin film materials

JapanIS

Published as an International Standard (IS) in August 2006.
Submitted as a draft Japanese Industrial Standard (JIS) to the Japan Standards Association in July 2008.

IEC 62047-3;
July 2003
Standard test piece for tensile tests

Japan

IS

Published as an International Standard (IS) in August 2006.
Submitted as a draft Japanese Industrial Standard (JIS) to the Japan Standards Association in July 2008.

IEC 62047-4;
Generic specification

July 2004

SouthKoreaIS

Published as an International Standard (IS) in August 2008.

IEC 62047-5;
RF MEMS switches

December South
2005
Korea

CD

Following comment and review of the second Committee Draft (CD) by individualcountries, it was decided to prepare a third CD.

IEC 62047-6;
Thin film material fatigue test
methods

May 2006

JapanCDV

The Committee Draft for Vote (CDV) was approved, and a Final Draft Industrial Standard(FDIS) reflecting the results of comment and review by individual countries wassubmitted. Expected to be published as an International Standard in FY 2008.

IEC 62047-7;
FBAR filterMarch2007

SouthKorea

CDA review of the comments from individual countries regarding the Committee Draft (CD)was conducted, and it was decided to prepare a second CD.

IEC 62047-8;
Thin film bending test methods

March2007

SouthKorea

CD

A review of the comments from individual countries regarding the Committee Draft (CD)was conducted, and it was decided to prepare a second CD.

IEC 62047-9;
March
Wafer-to-wafer bonding strength 2007
measuverentSouthKorea

CD

A proposal from Japan to add a 3-point bending test method and a die shear test method to thetest methods in the South Korean proposal was approved, and Japan prepared a draft. At South
Korea's request, it was decided that Japan should also prepare the draft for the blister test.

IEC 62047-10;
Micropillar compression test

August2008

SouthKorea

NP

Currently on the ballot as a "New Work Item Proposal" (NP). Japan voted in favor of theproposal, attaching a comment regarding the purpose, scope and content of the standard
based on the results of the domestic committee review.

IEC 62047-11;
August
Test methods for MEMS material 2008
coefficient of thermal expansion

SouthKorea

NP

Currently on the ballot as a "New Work Item Proposal" (NP). During the committee meeting, Japan expressedthe view that consideration should be given to including other test methods for the coefficient of thermal
expansion in the draft, but the South Korean side wanted these to be proposed separately. Accordingly,
Japan voted in favor of the proposal on the condition that the document be given a narrowly focused title.

In addition, the draft international standards currently being prepared in Japan are shown in the table below. These will
be proposed as “New Work Item Proposals” (NPs) around the end of the development period.
TopicNotes

Development Period

Thin film material life
acceleration test methods

FY 2006 - FY 2008 Establishes methods for life tests using resonant oscillation that are conducted for tiny mechanicalstructures used for micromachinesStandard materials forcalibration

FY 2006 - FY 2008 Establishes the standard materials used for calibrating weight displacement for the material testers
used to test microstructure materials

MEMS mechanism material
FY 2007 - FY 2008 Establishes methods for testing the strength of bonds between thin films and substrates between thebonding strength test methods
microstructures that will become constituent members
MEMS gyro and electroniccompass

FY 2008 - FY 2010 Defines (in matrix form) the passive and active sensitivity of tiny multi-axial gyros, and defines parameters for
performance requirements and standardizes the methods to represent and measure these parameters. Also
standardizes the properties and user interface (including coordinate system) for hexaxial electronic compasses.

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