Cover Page

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SQC-310™
Deposition Controller
PN 074-550-P1E

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Trademarks
The trademarks of the products mentioned in this manual are held by the companies that
produce them.
SQC-310™ and INFICON® are trademarks of INFICON GmbH.
Visual Basic®, Windows®, and Microsoft® are registered trademarks of Microsoft Corporation.
Java® is a registered trademark of Oracle and/or its affiliates.
Inconel® is a registered trademark of Inco Alloys International, Huntington, WV.
All other brand and product names are trademarks or registered trademarks of their respective companies.

Disclaimer
The information contained in this manual is believed to be accurate and reliable. However, INFICON assumes
no responsibility for its use and shall not be liable for any special, incidental, or consequential damages related
to the use of this product.
Due to our continuing program of product improvements, specifications are subject to change without notice.

Copyright©2016 All rights reserved.
Reproduction or adaptation of any part of this document without permission is unlawful.

Declaration Of Conformity
Page 1

Warranty
WARRANTY AND LIABILITY - LIMITATION: Seller warrants the products
manufactured by it, or by an affiliated company and sold by it, and described on
the reverse hereof, to be, for the period of warranty coverage specified below, freefrom defects of materials or workmanship under normal proper use and service.
The period of warranty coverage is specified for the respective products in therespective Seller instruction manuals for those products but shall not be less thantwo (2) years from the date of shipment thereof by Seller. Seller's liability under
this warranty is limited to such of the above products or parts thereof as are
returned, transportation prepaid, to Seller's plant, not later than thirty (30) days
after the expiration of the period of warranty coverage in respect thereof and arefound by Seller's examination to have failed to function properly because of
defective workmanship or materials and not because of improper installation or
misuse and is limited to, at Seller's election, either (a) repairing and returning the
product or part thereof, or (b) furnishing a replacement product or part thereof,transportation prepaid by Seller in either case. In the event Buyer discovers or
learns that a product does not conform to warranty, Buyer shall immediately notify
Seller in writing of such non-conformity, specifying in reasonable detail the natureof such non-conformity. If Seller is not provided with such written notification,
Seller shall not be liable for any further damages which could have been avoided if
Seller had been provided with immediate written notification.
THIS WARRANTY IS MADE AND ACCEPTED IN LIEU OF ALL OTHERWARRANTIES, EXPRESS OR IMPLIED, WHETHER OF MERCHANTABILITY OR
OF FITNESS FOR A PARTICULAR PURPOSE OR OTHERWISE, AS BUYER'S
EXCLUSIVE REMEDY FOR ANY DEFECTS IN THE PRODUCTS TO BE SOLDHEREUNDER. All other obligations and liabilities of Seller, whether in contract or
tort (including negligence) or otherwise, are expressly EXCLUDED. In no event
shall Seller be liable for any costs, expenses or damages, whether direct orindirect, special, incidental, consequential, or other, on any claim of any defective
product, in excess of the price paid by Buyer for the product plus returntransportation charges prepaid.
No warranty is made by Seller of any Seller product which has been installed,
used or operated contrary to Seller's written instruction manual or which has been
subjected to misuse, negligence or accident or has been repaired or altered byanyone other than Seller or which has been used in a manner or for a purpose forwhich the Seller product was not designed nor against any defects due to plans or
instructions supplied to Seller by or for Buyer.
This manual is intended for private use by INFICON ® Inc. and its customers.
Contact INFICON before reproducing its contents.
NOTE: These instructions do not provide for every contingency that may arise inconnection with the installation, operation or maintenance of this equipment.
Should you require further assistance, please contact INFICON.

www.inficon.com

reachus@inficon.com

SQC-310 Operating Manual

Table Of Contents
Cover Page
Trademarks
Disclaimer
Copyright
Declaration Of Conformity

Chapter 1

PN 074-550-P1E

Introduction
1.1
1.1.1
1.2
1.2.1
1.2.2
1.2.3
1.3
1.3.1
1.4
1.4.1
1.4.2
1.4.3
1.4.4
1.4.5
1.4.6
1.4.7
1.4.8
1.4.9
1.4.101.4.11
1.4.12
1.5
1.6
1.6.1
1.6.2
1.6.2.1

Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
Related Operating Manuals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
SQC-310 Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Definition of Notes, Cautions and Warnings. . . . . . . . . . . . . . . . . . . . . . . . . 1-2
General Safety Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
Earth Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
How to Contact INFICON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
Returning SQC-310 to INFICON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
SQC-310 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
Digital I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7
Operating Environment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7
Dimensions & Weight . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7
Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7
Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8
Process Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8
Layer Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8
Film Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-9
Unpacking and Inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
Configurations and Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
SQC-310 Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11
Cables and Oscillator Kits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11

1.6.2.2

Handheld Remote Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12

1.6.2.3

Rack Mount Kits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12

1–1

SQC-310 Operating Manual

1.6.2.4

Crystal Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12

1.7

Initial Power-On Verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-13

Chapter 2
Installation
2.1
2.2
2.3
2.4
2.5
2.5.1
2.6
2.7
2.7.1
2.7.1.1

Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Front Panel. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
Rear Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
System Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
Ground Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
Establishing Earth Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
Handheld Remote Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
Rack Mount . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-8
Full Rack Extender . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-8
Inventory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-8

2.7.1.2

Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9

2.7.2
2.7.2.1

Rack Adapter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10
Inventory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10

2.7.2.2

Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11

2.8
2.9
2.9.1
2.9.2
2.10

I/O Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11
Interfacing SQC-310 to CI-100 Crucible Indexer . . . . . . . . . . . . . . . . . . . . 2-12
BCD I/O Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-12
Individual (Binary - as defined by CI-100) I/O Setup . . . . . . . . . . . . . . . . . 2-14
Interfacing SQC-310 to INFICON EBS-530 Electron Beam
Sweep Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-15

Operation
3.1
3.1.1
3.1.2
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10

1–2

Thin Film Deposition Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Thin Film Deposition Phases . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
SQC-310 Menu Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
Main Screen, Menu 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
Main Screen, Menu 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
Main Screen, Menu 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7
Quick Edit Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8
Process Menus. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10
Process Menu - Edit Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12
Layer Copy, Insert, and Delete Menus. . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-15
Film Menus. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-17

PN 074-550-P1E

Chapter 3

SQC-310 Operating Manual

3.11
3.11.1
3.11.2
3.11.33.12
3.12.1
3.12.2
3.12.2.1

Film Edit Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18
Film Conditioning Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-21
Film Deposit Controls Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-22
Film Configure Sensor Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-24
System Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-25
Input and Relay Menus. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-27
Logic Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-30
Creating a Logic Statement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-31

3.12.2.2

Logic Statement Conditions (IF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-32

3.12.2.3

Logic Statement Actions (THEN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-35

3.12.33.12.3.1

Sensors and Sources Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-36
Sensor Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-36

3.12.3.2

Source Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-39

Chapter 4

PN 074-550-P1E

Communications
4.1
4.1.1
4.1.2
4.1.3
4.1.3.1

Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
RS-232 Serial Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
USB Port. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
Ethernet (TCP/IP) Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
Ethernet Network Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2

4.1.3.1.1

Accessing Network Settings in Windows XP . . . . . . . . . . . . . . . . . . . . . . . . 4-3

4.1.3.1.2

Accessing Network Settings in Windows 7 and Windows 8 . . . . . . . . . . . . . 4-5

4.1.3.2

How to change the SQC-310 IP address . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7

4.2
4.2.1
4.2.2
4.2.3
4.3
4.3.1
4.3.1.1

SQC-310 Communications Protocol. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8
Command Packet (Host to SQC-310 Message). . . . . . . . . . . . . . . . . . . . . . 4-9
Response Packet (SQC-310 to Host Message) . . . . . . . . . . . . . . . . . . . . . 4-10
Calculating the CRC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-11
SQC-310 Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-12
@ Command: Hello Message. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-12
Hello Message Example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-12

4.3.2
4.3.2.1

A Commands: Get/Set Film Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . 4-12
Get/Set Film Parameter Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-14

4.3.3
4.3.3.1

B Commands: Get/Set System Parameters . . . . . . . . . . . . . . . . . . . . . . . . 4-14
Get/Set System Parameter Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-15

4.3.4
4.3.4.1

C Commands: Get/Set Process Parameters . . . . . . . . . . . . . . . . . . . . . . . 4-16
Get/Set Process Parameter Examples. . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-17

4.3.5
4.3.5.1

D Commands and E Command: Get/Set Layer Parameters . . . . . . . . . . . 4-17
Get/Set Layer Parameter Examples. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-19

1–3

1–4

4.3.6
4.3.6.1

F Command: Get/Set Material Parameters . . . . . . . . . . . . . . . . . . . . . . . . 4-20
Get/Set Material Parameter Examples. . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-20

4.3.7
4.3.7.1

G Commands: Get/Set Input and Relay Parameters . . . . . . . . . . . . . . . . . 4-21
Get/Set Input and Relay Parameter Examples . . . . . . . . . . . . . . . . . . . . . 4-22

4.3.8
4.3.8.1

H Commands: Get/Set Sensor and Source Parameters . . . . . . . . . . . . . . 4-23
Get/Set Sensor and Source Parameter Examples. . . . . . . . . . . . . . . . . . . 4-24

4.3.9
4.3.9.1

I Commands: Get/Set Logic Statement Parameters . . . . . . . . . . . . . . . . . 4-25
Get/Set Logic Statement Parameter Examples . . . . . . . . . . . . . . . . . . . . . 4-25

4.3.104.3.10.1

J Command: Get Num Channels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-26
Get Num Channels Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-26

4.3.11
4.3.11.1

K Command: Get Readings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-26
Get Readings Examples. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-27

4.3.124.3.12.1

L Command: Get Sensor Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-27
Get Sensor Rate Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-27

4.3.134.3.13.1

M Command: Get Output Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-27
Get Output Rate Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-28

4.3.144.3.14.1

N Command: Get Sensor Thickness . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-28
Get Sensor Thickness Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-28

4.3.154.3.15.1

O Command: Get Output Thickness . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-28
Get Output Thickness Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-28

4.3.164.3.16.1

P Commands: Get Sensor Frequency/Crystal Life . . . . . . . . . . . . . . . . . . 4-29
Get Sensor Frequency/Crystal Life Example . . . . . . . . . . . . . . . . . . . . . . . 4-29

4.3.174.3.17.1

Q Command: Get Output Deviation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-29
Get Output Deviation Example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-29

4.3.184.3.18.1

S Command: Get/Set Output Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-30
Get/Set Output Power Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-30

4.3.194.3.19.1

T Command: Set Active Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-31
Set Active Process Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-31

4.3.204.3.20.1

U Commands: Set Run State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-31
Set Run State Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-31

4.3.21
4.3.21.1

V Commands: Get Run State. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-32
Get Run State Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-33

4.3.224.3.22.1

XSTART / XSTOP Command: Download/Upload Session . . . . . . . . . . . . 4-34
Start/Stop Download/Upload Session Example . . . . . . . . . . . . . . . . . . . . . 4-34

4.4
4.4.1
4.4.2
4.4.3

CRC Examples. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-34
Visual Basic® 5/6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-35
Java® . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-37
C++. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-38

PN 074-550-P1E

SQC-310 Operating Manual

SQC-310 Operating Manual

Chapter 5
SQC-310 Comm Software
5.1
5.2
5.3
5.4
5.5
5.5.1
5.5.2
5.5.3
5.5.4
5.5.5
5.5.6
5.5.7
5.5.7.1

Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
Main Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2
Data Log Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4
Instrument Window. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-6
Process Tree . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8
Film Menu. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-9
Materials Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10
Sensor Setup Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-11
Source Setup Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-12
Digital I/O Setup Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-13
Logic Statements Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-16
Creating Logic Statements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-18

5.5.8
5.6
5.7
5.8
5.9

System Setup Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-18
Graph Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-19
Communications Setup Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-20
View Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-22
Help Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-23

Chapter 6

PN 074-550-P1E

Troubleshooting and Maintenance
6.1
6.1.1
6.2
6.3
6.4
6.5

Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1
Using the OSC-100A Oscillator Test Function . . . . . . . . . . . . . . . . . . . . . . 6-14
Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-15
Upgrading Firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-15
Clearing the Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-15
Spare Parts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-17

Chapter 7
Calibration Procedures
7.1
7.2
7.3
7.4
7.5
7.5.1
7.6

Importance of Density, Tooling and Z-Ratio . . . . . . . . . . . . . . . . . . . . . . . . . 7-1
Determining Density . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1
Determining Tooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-2
Laboratory Determination of Z-Ratio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-3
Control Loop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-5
Identifying a Fast or Slow Source. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-7
Control Loop Tuning Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-8

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SQC-310 Operating Manual

Chapter 8
Measurement Theory
8.1
8.1.1
8.1.2
8.1.3

Basics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1
Monitor Crystals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-2
Period Measurement Technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-4
Z-Match Technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-5

Appendix A
Material Table
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .A-1

PN 074-550-P1E

A.1

1–6

SQC-310 Operating Manual

Chapter 1
Introduction
1.1 Introduction
INFICON SQC-310 and SQC-310C are quartz crystal microbalance technology
based deposition controllers, providing a unique combination of accuracy andpowerful features in a compact, low-cost controller.

PN 074-550-P1E

Figure 1-1 SQC-310

The standard SQC-310 is a sequential layer thin film deposition controller that canmonitor two quartz crystal sensors and control one of two evaporation sources at
a time. Eight process control relays and eight digital inputs are included to support
a broad range of external devices. The number of sensors, outputs, and digital I/O
can be doubled with an optional expansion card. SQC-310C is a thin film controllerthat is capable of codeposition by monitoring four quartz crystal sensors andcontrolling four sources simultaneously. Sixteen process control relays and sixteen
digital inputs are included. Both controllers come standard with RS-232 and USB
communications with an option to replace USB with Ethernet communications.
NOTE: SQC-310 and SQC-310C are both referred to as SQC-310 in this manual.
If there is a reason to distinguish between the two models, the SQC-310 or
SQC-310C model number will be called out.
Please review the entire manual for detailed operational, programming, andsafety information.

1–1

SQC-310 Operating Manual

1.1.1 Related Operating Manuals
PN 074-154 . . . . . . . . . . . . . . . . . . . UHV Bakeable Sensor
PN 074-155 . . . . . . . . . . . . . . . . . . . CrystalSix Sensor
PN 074-398 . . . . . . . . . . . . . . . . . . . Crystal 12 Sensor
PN 074-156 . . . . . . . . . . . . . . . . . . . Front Load Single and Dual Sensors
PN 074-157 . . . . . . . . . . . . . . . . . . . Sputtering Crystal Sensor
PN 074-609 . . . . . . . . . . . . . . . . . . . Cool Drawer Single and Dual Sensors
PN 074-643 . . . . . . . . . . . . . . . . . . . ALD Sensor
PN 153800 . . . . . . . . . . . . . . . . . . . . RSH-600 Sensor
Sensor operating manuals are available on the Thin Film Instruments and Sensors
Manuals CD included with the SQC-310 ship kit. Other related documentation canbe downloaded from www.inficon.com.

1.2 SQC-310 Safety
1.2.1 Definition of Notes, Cautions and Warnings
When using this manual, please pay attention to the NOTES, HINTS, CAUTIONS,
and WARNINGS found throughout. For the purposes of this manual they aredefined as follows:
NOTE: Pertinent information that is useful in achieving maximum SQC-310
efficiency when followed.
HINT: Hints provide insight into SQC-310 usage.

Failure to heed these messages could result in damage
to SQC-310 or loss of data.

WARNING
Failure to heed these messages could result in personal
injury.

WARNING - Risk Of Electric Shock
Dangerous voltages are present which could result inpersonal injury.

1–2

PN 074-550-P1E

CAUTIONSQC-310 Operating Manual

1.2.2 General Safety Information
WARNING - Risk Of Electric Shock
SQC-310 does not have any user-serviceable
components.

WARNING - Risk Of Electric Shock
Dangerous voltages may be present whenever SQC-310
is turned on or external connections are present.

WARNING - Risk Of Electric Shock
SQC-310 must be connected to earth ground through asealed three-conductor power cable plugged into asocket outlet with protective ground terminal.
Extension cables must have three conductors including
a protective earth ground.

WARNING

PN 074-550-P1E

Failure to operate SQC-310 in the manner intended by
INFICON can circumvent the safety protection provided
by SQC-310 and may result in personal injury.

CAUTION - Static Sensitive Device
SQC-310 contains delicate circuitry, susceptible totransient power line voltages or static.

1.2.3 Earth Ground
SQC-310 is connected to earth ground through a sealed three-core(three-conductor) power cable, which must be plugged into a socket outlet with aprotective earth terminal. Extension cables must always have three conductors
including a protective earth terminal.

1–3

SQC-310 Operating Manual

WARNING
Never interrupt the protective earth circuit.
This symbol indicates where the protective earth groundis connected inside SQC-310.

Never unscrew or loosen this connection.

PN 074-550-P1E

Disconnecting the protective earth terminal orinterrupting the protective earth circuit, whether inside oroutside of SQC-310, may render SQC-310 dangerous.

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SQC-310 Operating Manual

1.3 How to Contact INFICONWorldwide customer support information is available under Support >> Support
Worldwide at www.inficon.com:
Sales and Customer ServiceTechnical Support

Repair Service

If experiencing a problem with SQC-310, please have the following information
readily available:
The Sales Order or PO number for the SQC-310 purchase.

The software version, if the issue is regarding the SQC-310 Comm software.



The firmware version of the SQC-310.



A description of the problem.

An explanation of any corrective action already attempted.

The exact wording of any error messages received.

1.3.1 Returning SQC-310 to INFICON
Do not return any component of SQC-310 to INFICON without first speaking witha Customer Support Representative and obtaining a Return Material Authorization(RMA) number.

PN 074-550-P1E

Packages delivered to INFICON without an RMA number will be held until thecustomer is contacted. This will result in delays in servicing SQC-310.
If returning a SQC-310 with a crystal sensor, or other component potentially
exposed to process materials, prior to being given an RMA number a completed
Declaration Of Contamination (DOC) form will be required. DOC forms must be
approved by INFICON before an RMA number is issued. INFICON may requirethat the component be sent to a designated decontamination facility, not to thefactory.

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SQC-310 Operating Manual

1.4 SQC-310 Specifications
1.4.1 Measurement
Crystal Frequency Range. . . . . . . . . 6.5 to 1.0 MHz (adjustable)
Frequency Resolution . . . . . . . . . . . .±0.012 Hz over 0.25 s measurement intervalFrequency Accuracy . . . . . . . . . . . . .0.001%
Measurement Rate. . . . . . . . . . . . . . 0.10 to 1.0 s (adjustable)
Thickness and Rate Resolution . . . . .±0.015 Å @ tooling/density/z-ratio =100/1/1, fundamental frequency = 6 MHz,
0.25 s measurement interval
Thickness Accuracy . . . . . . . . . . . . . 0.5% typical
Rate Accuracy . . . . . . . . . . . . . . . . . 0.5% typical

1.4.2 Sensor
Sensor Inputs . . . . . . . . . . . . . . . . . . 2 (+2 optional), 4 (SQC-310C)
Measurement Technique . . . . . . . . . Conventional (Active) Oscillation
Sensor Type . . . . . . . . . . . . . . . . . . . Single, Dual, Rotary

1.4.3 Source
Number of Sources . . . . . . . . . . . . . 2 (+2 optional), 4 (SQC-310C)
Control Voltage. . . . . . . . . . . . . . . . . 0 to ±10 V into 2 k load

1.4.4 Digital I/O
Digital Inputs. . . . . . . . . . . . . . . . . . . 8 (+8 optional), 16 (SQC-310C)
Functions . . . . . . . . . . . . . . . . . . User-selected (see Chapter 3, Operation)
Input Rating . . . . . . . . . . . . . . . . 5 V (dc), non-isolated, programmable activelow (0 volts) or active high (5 volts).
Relay Outputs. . . . . . . . . . . . . . . . . . 8 (+8 optional), 16 (SQC-310C)
Functions . . . . . . . . . . . . . . . . . . User-selected (see Chapter 3, Operation)
Relay Rating. . . . . . . . . . . . . . . . 30 V (rms) or 30 V (dc), 2 A maximum

1–6

PN 074-550-P1E

Resolution . . . . . . . . . . . . . . . . . . . . 15 bits over 10 V full scale span

SQC-310 Operating Manual

1.4.5 Power
Mains Power Supply . . . . . . . . . . . . 100 to 120/200 to 240V (ac), ±10% nominal,
50/60 Hz, auto detect
Power Consumption . . . . . . . . . . . . . 20 W
Fuse . . . . . . . . . . . . . . . . . . . . . . . . . 250 V, 500 mA, Type T, 5 x 20 mm, time lag
Installation (Overvoltage) . . . . . . . . . Class 1 Equipment (grounded type).
Category II for Transient Overvoltages per
IEC 60664
Temporary Overvoltages . . . . . . . . . Short Term: 1440 V, <5 sLong Term: 490 V, >5 s

1.4.6 Operating Environment
Usage . . . . . . . . . . . . . . . . . . . . . . . Indoor Only
Operating Temperature . . . . . . . . . . 0 to 50C (32 to 122F)
Humidity . . . . . . . . . . . . . . . . . . . . . . 0 to 80% RH non-condensing. Ordinary
protection (not protected against harmful
ingress of moisture).
Altitude . . . . . . . . . . . . . . . . . . . . . . 0 to 2000 m (6562 ft.)
Pollution Degree . . . . . . . . . . . . . . . 2 per EN 61010
Storage Temperature . . . . . . . . . -10to 70C (14 to 158F)

PN 074-550-P1E

Warm Up Period . . . . . . . . . . . . . . . None required. For maximum stability allow 5
minutes.

1.4.7 Dimensions & Weight
Rack Dimensions H x W x D . . . . . . 13.28 x 21.34 x 25.40 cm(5.23 x 8.4 x 10.0 in.)
Front Clearance . . . . . . . . . . . . . . . . 2.5 cm (1.0 in.) minimum
Rear Clearance . . . . . . . . . . . . . . . . 10 cm (4.0 in.) minimum
Weight . . . . . . . . . . . . . . . . . . . . . . . 1.8 kg (4 lb.)

1.4.8 Cleaning
Mild, nonabrasive cleaner or detergent. Prevent cleaner from entering SQC-310 orcontacting connectors.

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SQC-310 Operating Manual

1.4.9 Display
Type . . . . . . . . . . . . . . . . . . . . . . . . . LCD/Color/TFT/14.5 cm (5.7 in.) Diagonal
Format . . . . . . . . . . . . . . . . . . . . . . . QVGAResolution . . . . . . . . . . . . . . . . . . . . 320 x 240 pixels
Backlighting . . . . . . . . . . . . . . . . . . . LED
Thickness Display Resolution . . . . . 0.001 kÅ
Rate Display Resolution. . . . . . . . . . 0.01 or 0.1 Å/sPower Display Resolution . . . . . . . . 0.1%
Data Display Rate . . . . . . . . . . . . . . 1 Hz
Graphic Display Functions . . . . . . . . Rate, Deviation, Power
Readouts . . . . . . . . . . . . . . . . . . . . . Thickness, Rate, Power

1.4.10 Process Parameters
NOTE: A Process is a sequence of layers.
# Processes . . . . . . . . . . . . . . . . . . . 100# Films . . . . . . . . . . . . . . . . . . . . . . . 50
# Layers (total all processes) . . . . . . 1000

1.4.11 Layer Parameters
NOTE: Layers are the basic building blocks of a process.

Final Thickness . . . . . . . . . . . . . . . . 0.0 to 999.990 kÅTime Setpoint . . . . . . . . . . . . . . . . . . 0 to 5999 s
Thickness Limit . . . . . . . . . . . . . . . . 0.0 to 999.99 kÅStart Mode . . . . . . . . . . . . . . . . . . . . Auto/Manual
Output Select . . . . . . . . . . . . . . . . . . Src1/Src2/Src3/Src4
Max Power . . . . . . . . . . . . . . . . . . . . 0.0 to 99.9%
Min Power . . . . . . . . . . . . . . . . . . . . 0.0 to 99.9%
Slew Rate. . . . . . . . . . . . . . . . . . . . . 0.0 to 99.9%/s
Sensor Select (1 to 4) . . . . . . . . . . . On/Off
Rate Dev. Attention . . . . . . . . . . . . . 0.0 to 99.9%
Rate Dev. Alert . . . . . . . . . . . . . . . . . 0.0 to 99.9%

1–8

PN 074-550-P1E

Initial Rate . . . . . . . . . . . . . . . . . . . . 0.0 to 999.9 Å/s

SQC-310 Operating Manual

Rate Dev. Alarm . . . . . . . . . . . . . . . . 0.0 to 99.9%
Rate Ramp Start . . . . . . . . . . . . . . . . 0.000 to 999.990 kÅRate Ramp Time . . . . . . . . . . . . . . . 0 to 5999 s
New Rate . . . . . . . . . . . . . . . . . . . . . 0.0 to 999.9 Å/s

1.4.12 Film Parameters
NOTE: A film describes in detail how a material will be deposited.
Material. . . . . . . . . . . . . . . . . . . . . . . 100 stored
Density . . . . . . . . . . . . . . . . . . . . . . . 0.50 to 99.99 g/cm3
Z-Factor . . . . . . . . . . . . . . . . . . . . . . 0.100 to 9.999
P Term . . . . . . . . . . . . . . . . . . . . . . . 1 to 9999
I Term . . . . . . . . . . . . . . . . . . . . . . . . 0.0 to 99.9 s
D Term . . . . . . . . . . . . . . . . . . . . . . . 0.0 to 99.9 s
Tooling . . . . . . . . . . . . . . . . . . . . . . . 10 to 399%
Pocket . . . . . . . . . . . . . . . . . . . . . . . 1 to 8
XTAL Quality, Rate Dev . . . . . . . . . . Disabled, 1 to 99%
XTAL Quality, Counts . . . . . . . . . . . . Disabled, 1 to 99%
XTAL Stability, Single . . . . . . . . . . . . Disabled, 25 to 9999 Hz
XTAL Stability, Total . . . . . . . . . . . . . Disabled, 25 to 9999 Hz

PN 074-550-P1E

Crystal Fail Mode . . . . . . . . . . . . . . . Halt/Halt Last/Timed Power/Next Crystal/
Switch to Backup/Backup
Ramp 1/ Ramp 2/ Feed/
Idle Power . . . . . . . . . . . . . . . . . . . . 0 to 99.9%
Ramp 1/ Soak 1/ Ramp 2/
Soak 2/ Feed Ramp/ Feed/
Idle Ramp Time . . . . . . . . . . . . . . . . 0 to 5999 s
Shutter Delay Time. . . . . . . . . . . . . . 0 to 5999 s
Capture. . . . . . . . . . . . . . . . . . . . . . . 0.0 to 100%Control Error . . . . . . . . . . . . . . . . Ignore/Stop/HoldError% . . . . . . . . . . . . . . . . . . . . 0 to 100%Rate Sampling . . . . . . . . . . . . . . . . . Continuous/Time/Accuracy
Sample Time. . . . . . . . . . . . . . . . 0 to 5999 s
Hold Time . . . . . . . . . . . . . . . . . . 0 to 5999 s
Accuracy. . . . . . . . . . . . . . . . . . . 100%

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SQC-310 Operating Manual

1.5 Unpacking and Inspection
1 If SQC-310 has not been removed from its packaging, do so now.
NOTE: Do not discard the packing materials until an inventory has been taken
and the installation has been performed successfully. To install
SQC-310 see Chapter 2, Installation for details.

2 Take an inventory of your order by referring to the order invoice and theinformation contained in section 1.6.

3 Carefully examine the contents for damage that may have occurred during
shipping. This is especially important if obvious rough handling is noticed on theoutside of the container. Immediately report any damage to the carrier and to
INFICON. To report damage or receive technical assistance, refer to section
1.3, How to Contact INFICON, on page 1-5.

1.6 Configurations and Accessories
1.6.1 SQC-310 Configuration

PN 074-550-P1E

Figure 1-2 SQC-310 and SQC-310C configuration guide1 – 10SQC-310 Operating Manual

SQC-310 configuration includes:
Thin Film Instrument and Sensor Manuals CD containing SQC-310 software,
SQC-310 Operating Manual, and sensor operating manuals.

25-pin female high-density solder cup D-sub connector (PN 051-1846) andconnector housing (PN 051-1794). One of each included for a 2 channel
standard configuration. Two of each included if 4 channel option is selected or
the unit is a SQC-310C.

Power Cord - Based on origin of order (universal power supply)Power Cord North American (PN 068-0433)

Power Cord European (PN 068-0434)

Power Cord UK (PN 803301)



RS-232 Cable (PN 068-0464)



USB Cable (PN 068-0472), if USB option is chosen

Ethernet Cable (PN 068-0478), if Ethernet option is chosen

1.6.2 Accessories
1.6.2.1 Cables and Oscillator Kits
Oscillator Kit (3.0 m (10 ft.) cable) . . . . . . . . . . . . . . PN 783-500-109-10
Oscillator Kit (7.6 m (25 ft.) cable) . . . . . . . . . . . . . . PN 783-500-109-25
Oscillator Kit (15.2 m (50 ft.) cable) . . . . . . . . . . . . . PN 783-500-109-50
Oscillator Kit (22.8 m (75 ft.) cable) . . . . . . . . . . . . . PN 783-500-109-75

PN 074-550-P1E

NOTE: One oscillator kit is required for each crystal sensor that will be connectedto the SQC-310. Each oscillator kit includes:15.2 cm (6 in.) BNC cable (PN 782-902-011) - Cable from the oscillator to
the feedthrough

OSC-100A Oscillator (PN 783-500-013)



BNC Interconnect Cable (PN 782-902-012-XX) - Cable from the oscillator
to SQC-310.

CAUTION
The electrical distance from the oscillator to the crystal
must not exceed 102 cm (40 in.)

1 – 11SQC-310 Operating Manual

1.6.2.2 Handheld Remote Controller
Handheld Remote Controller, 3 m (10 ft.) cable . . . . PN 782-900-017
1.6.2.3 Rack Mount Kits
3U Rack Extender - mounts one
SQC-310 controller in a
48.3 cm (19 in.) rack . . . . . . . . . . . . PN 782-900-007
3U Rack Adapter- mounts two
SQC-310 controllers in a
48.3 cm (19 in.) rack . . . . . . . . . . . . PN 782-900-016
1.6.2.4 Crystal Sensors
NOTE: X represents feature selections particular to that sensor. For help
identifying a sensor, contact INFICON. (Refer to section 1.3, How toContact INFICON, on page 1-5.)
Front Load Single Sensor . . . . . . . . . . . . . . . . . . . . PN SL-XXXXX
Front Load Dual Sensor . . . . . . . . . . . . . . . . . . . . . . PN DL-AXXXUHV Bakeable Sensor . . . . . . . . . . . . . . . . . . . . . . . PN BK-AXF
Cool Drawer Single Sensor . . . . . . . . . . . . . . . . . . . PN CDS-XXFXX
Cool Drawer Dual Sensor . . . . . . . . . . . . . . . . . . . . PN CDD-XFXX
Sputtering Sensor. . . . . . . . . . . . . . . . . . . . . . . . . . . PN 750-618-G1
ALD Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PN 750-71X-GX
CrystalSix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PN 750-446-G1

Crystal 12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PN XL12-1XXXXXNOTE: Shuttered sensors, CrystalSix, and Crystal 12 require a solenoid valve(PN 750-420-G1).
NOTE: CrystalSix and Crystal12 crystal position detection feature cannot be usedwith the SQC-310.
NOTE: CrystalTwo switch is not compatible with SQC-310.

1 – 12

PN 074-550-P1E

RSH-600 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PN 15320X-XX

SQC-310 Operating Manual

1.7 Initial Power-On Verification
A preliminary functional check of SQC-310 can be made before formal installation.
It is not necessary to have sensors, source controls, inputs, or relays connected to
do this. For more complete installation information, see Chapter 2, Installation.

1 Confirm that the proper AC line mains voltage is supplied to SQC-310.
2 Confirm that the rear panel (main) AC switch is in the ON Position.
3 After the initial boot-up screen, SQC-310 will display the main menu and thepower graph. This screen will be similar to the screen displayed in Figure 1-3.

PN 074-550-P1E

Figure 1-3 Main screen

1 – 13

SQC-310 Operating Manual

Chapter 2
Installation
2.1 Introduction
This chapter provides information for the necessary connections and userinterfaces for SQC-310. (See Table 2-1 for connection and installation
requirements.)

CAUTION
Care should be exercised to route SQC-310 cables as
far as is practical from other cables that carry highvoltages or generate noise. This includes other line
voltage cables, wires to heaters that are SCR-controlled,
and cables to source power supplies that may conduct
high transient currents during arc down conditions.

CAUTIONPN 074-550-P1E

To maintain proper SQC-310 performance, use only the15.2 cm (6 in.) BNC cable, included in the oscillator kit, toconnect the oscillator to the crystal sensor. The
in-vacuum cable or electrical conduit tube should notexceed 78.1 cm (30.75 in.).

2–1

SQC-310 Operating Manual

Table 2-1 Installation requirements

Rack
Installation

Rack mounting hardware is not included. Optional 3U rack adapter
and 3U rack extender kits are available to mount either one or two
SQC-310 controllers in a standard 48.3 cm (19 in.) rack (seesection 2.7 on page 2-8).

Power
Connection

The SQC-310 automatically detects mains voltages of 100 to 120
and 200 to 240 V (ac), 50/60Hz.

WARNING - Risk Of Electric ShockPN 074-550-P1E

Verify that the power cable provided isconnected to a properly grounded mains
receptacle.
Sensor Input
Connections

Connect the BNC cables and oscillators from the vacuum
chamber feedthrough to the desired SQC-310 sensor inputs (seesection 2.4 on page 2-5).

Source Output
Connections

Connect user-supplied BNC cables from the SQC-310 output
connectors to the source power supply control input. Refer to thesource power supply operating manual for control input wiring
instructions.

Digital I/O
Connections

See section 2.8, I/O Connections, on page 2-11 for details on wiring
digital I/O to the SQC-310 I/O connectors.

ComputerConnection

To collect data or program SQC-310 remotely, attach astraight-through RS-232 cable from the RS-232 connector to acomputer serial port.
SQC-310 can also communicate via USB using a standard USB
cable. If the Ethernet option is chosen, the USB connection is
replaced with an RJ-45 Ethernet connector (see Chapter 4,
Communications for details).

Ground Connection Connect a grounded wire or strap to the ground terminal on the
SQC-310 rear panel (see section 2.3, Rear Panel, on page 2-4 andsection 2.5, Ground Requirements, on page 2-6).

2–2

SQC-310 Operating Manual

2.2 Front Panel
Figure 2-1 Front panel controls

Buttons

Control Knob

Remote Jack

2–3

Buttons

Provide access to operation and setup menus.
The functions of the buttons change to adapt to different operations
and are displayed on the left of the screen.

Control Knob

Used to adjust values and select menu items. Press the control
knob to store the current setting and move to the next parameter.

Remote Jack

Connection jack for the optional handheld remote controller used
for manual power operation. To manually control the source using
the Handheld Remote Controller, see section 2.6 on page 2-7 for
installation details.

PN 074-550-P1E

Table 2-2 Front panel controls

SQC-310 Operating Manual

2.3 Rear Panel
Figure 2-2 Rear panel

PN 074-550-P1E

Table 2-3 Rear panel connections

Sensor 1 and 2

BNC connection to the oscillators for sensor 1 and 2 (see section
2.4 on page 2-5).

Output 1 and 2

BNC connection to the source power supply control voltage input.

I/O 1-8

25 Pin D-sub connection for 8 relays (outputs) and 8 digital inputs.
For use with external equipment (see section 2.8 on page 2-11).

RS-232USB or Ethernet

Connection to a computer for programming and data acquisition.
RS-232 and USB are standard. Ethernet option replaces USB.

Sensor 3 and 4

These Sensor, Output, and I/O Ports are optional with SQC-310
and standard with SQC-310C.

Output 3 and 4
I/O 9-16

Ground terminal for common system and cable grounding.
Power Input andFuseConnects to mains power. SQC-310 automatically detects mains
voltages of 100 to 120 and 200 to 240 V (ac), 50/60 Hz.

WARNING
Only use a power cable and fuse of thespecified rating (refer to section 1.4.5,
Power, on page 1-7).

2–4

SQC-310 Operating Manual

2.4 System Connections
Figure 2-3 System connections

Sensor-310

In-Vacuum
Cable
SourceShutter
Feedthrough
BNC
Cables15.2 cm (6 in.)
BNC Cable

Source Power Supply
OutputOscillator

Control Input

Ground Wire/Strap

2–5

SensorHolds the quartz crystal used to measure rate and thickness.
Crystals must be replaced regularly.

In-Vacuum Cable

A coaxial cable that connects the sensor to the feedthrough.

FeedthroughProvides isolation between vacuum and atmosphere for electricalconnections, water, air, and/or purge gas tubes.

15.2 cm (6 in.)
BNC Cable

Provides a flexible connection from the feedthrough to theoscillator.

Oscillator

Contains the electronics to oscillate the quartz crystal.
Total cable length to the crystal should be under 102 cm (40 in.).

Sensor Input
BNC Cable

Connects the oscillator to the SQC-310 sensor input.
Lengths up to 22.8 m (75 ft.) are acceptable.

Control Output
BNC Cable

Connects the SQC-310 output to the source power supply control
voltage input.

Ground Wire/Strap

A wire or strap that connects the vacuum system to
the SQC-310 ground terminal. The wire or strap is important fornoise rejection (see section 2.5).

PN 074-550-P1E

Table 2-4 System components

SQC-310 Operating Manual

2.5 Ground Requirements
Low impedance wires or straps must be used to connect the chassis of all control
components to a common ground point connected to earth ground (see section
2.5.1 for the earth ground requirement).
Solid copper straps at least 12.7 mm (0.5 in.) wide and approximately 0.56 mm(0.022 in.) thick (as short as possible) are recommended where RF is present. Thisis particularly important in high-noise e-beam systems (see Figure 2-4 for therecommended grounding method).
The oscillator is grounded through the BNC cables, and the crystal sensor istypically grounded to the wall of the vacuum system. If the sensor feedthrough is
not properly grounded to the vacuum system, connect a copper strap between thesensor feedthrough and the common ground point for the system components.
Figure 2-4 System grounding diagram

SensorFeedthroughSQC-3103-Conductor
Power Cable

Oscillator
and Cables

PN 074-550-P1E

Copper Straps toCommon Ground

Earth
GroundVacuum System

2–6

SQC-310 Operating Manual

2.5.1 Establishing Earth Ground
WARNING - Risk Of Electric Shock
Follow local electrical regulations and codes.

1 Install two 3 m (10 ft.) long copper-clad steel ground rods into the soil, spaced
at least 1.9 m (6.2 ft.) apart. The ideal distance between the rods is twice therod length.

2 Pour a solution of magnesium sulfate or copper sulfate around each rod to
reduce resistance to earth ground.

3 Test the ground rods using a ground resistance tester specifically designed forthat purpose.
NOTE: Do not use a common ohmmeter.

4 After verifying that a good earth ground has been achieved, connect the rods
together using solid copper straps at least 76 mm (3 in.) wide andapproximately 0.9 to 1.3 mm (0.05 in.) thick, keeping the strap as short as
possible.
NOTE: Do not use braided wire. Use a solid copper strap.

2.6 Handheld Remote Controller
The Handheld Remote Controller (PN 782-900-017) provides the capability ofadjusting output power remotely when SQC-310 is in Manual mode.

PN 074-550-P1E

Figure 2-5 Handheld Remote Controller

To install the Handheld Remote Controller, attach the cable from the Handheld
Remote Controller to the Remote Jack on the SQC-310 front panel.
The front panel control knob or the Handheld Remote Controller can be used toincrease (↑) or decrease (↓) output power. Pressing Abort on the Handheld
Remote Controller stops the layer and returns output power to 0%.

2–7

SQC-310 Operating Manual

2.7 Rack Mount
The procedure below provides instructions for installing the SQC-310 rack mountkit. SQC-310 is designed to mount in a standard 48.3 cm (19 in.) rack, using
optional rack mount kits, or can be used on a benchtop.
2 rack mount kits are available:

Full Rack Extender (PN 782-900-007)

Rack Adapter (PN 782-900-016)

2.7.1 Full Rack Extender
The optional Full Rack Extender (PN 782-900-007) mounts a single SQC-310 intoa full-width 48.3 cm (19 in.) rack space.
2.7.1.1 Inventory
2 - rack mount ears



2 - large black aluminum panels

2 - small black aluminum panels2 - hex shoulder screws



8 - small flat head screws

4 - large flat head screws

PN 074-550-P1E



2–8

SQC-310 Operating Manual

2.7.1.2 Installation

1 Assemble the extender. Use the 8 small flat head screws to connect the two
small black aluminum panels and two large black aluminum panels (see Figure
2-6).
Figure 2-6 Assembly of extender

Small flat head screws

2 Install hex shoulder screws. From inside the extender, thread two hex shoulder
screws on one side, closest to the front of SQC-310. Continue to thread thescrews until the threads are completely exposed (see Figure 2-7 and Figure
2-8).

PN 074-550-P1E

Figure 2-7 Installing hex shoulder screws - inside view

2–9

SQC-310 Operating Manual

Figure 2-8 Installing hex should screw - overall view

3 Attach the extender. Align the extender with SQC-310 to fit the rack. The hex
shoulder screws installed in step 2 should align with the two large threadedholes in SQC-310. Tighten the hex shoulder screws to secure the extender to
SQC-310.

4 Install the rack mount ears. Using the 4 large flat head screws provided, install
the rack mount ears on the outer ends of the controller assembly. Install one
rack mount ear to SQC-310, and the other to the extender.

5 Mount SQC-310. Slide the entire assembly into an empty 2U rack-mount space(8.9 cm [3.5 in.] H x 48.3 cm [19 in.] W). Secure the assembly with four rackscrews (not provided).

2.7.2 Rack Adapter

PN 074-550-P1E

The optional Rack Adapter (PN 782-900-016) mounts two SQC-310 controllers
side-by-side in a full-width 48.3 cm (19 in.) rack space.
2.7.2.1 Inventory

2 - rack mount ears



1 - rear mount coupler

4 - 4-40 pan head screws with washers

4 - 10-32 flat head screws

2 – 10SQC-310 Operating Manual

2.7.2.2 Installation

1 Align the two controllers side by side, as though installed in the rack. Remove
the two adjacent screws on the rear panel of each SQC-310.
NOTE: These screws are no longer needed and may be discarded.

2 Install the rear mount couplers. Using the 4 pan head screws and washers
provided, install one side of the rear mount coupler to each SQC-310. Do not
fully tighten the screws until all screws are installed.

3 Install the rack mount ears. Using the 4 flat head screws provided, install therack mount ears on the outer ends of the controller assembly. One rack mountear should be installed on each SQC-310.

4 Mount the SQC-310 assembly. Slide the assembly into an empty 2U
rack-mount space (8.9 cm [3.5 in.] H x48.3 cm [19 in.] W). Secure the assemblywith four rack screws (not provided).

2.8 I/O Connections
A 25-pin, D-sub connector, located on the SQC-310 rear panel, provides
Input/Output connections.
Inputs can be activated by connecting to a switch and shorting to ground, or they
can be driven by a TTL compatible signal. TTL signals can be programmed to beeither active high or active low, as needed.

CAUTIONWARNING
Output relays are rated for 30 V (rms) or 30 V (dc), 2 A
maximum.

2 – 11PN 074-550-P1E

These are not isolated inputs. The voltage level appliedmust be limited to between 0 and +5 V with respect
to ground.

SQC-310 Operating Manual

The pin assignments for the rear panel mounted I/O connector are displayedin Figure 2-9 and Table 2-5
Figure 2-9 Rear panel I/O pin assignments
1

13

14

25

Table 2-5 I/O connector wiring

Relay

Pins

Input

Pins

Relay 1

14,15

Input 1

16

Relay 2

1,2

Input 2

17

Relay 33,4

Input 318

Relay 45,6

Input 419

Relay 57,8

Input 520

Relay 6

9,10

Input 621

Relay 7

11,12

Input 722

Relay 813,25

Input 823

Ground24

PN 074-550-P1E

NOTE: Relays 9 to 16 and inputs 9 to 16 use the same connector pins as foundon the second rear panel I/O connector (if available) in the same
sequential order.

2 – 12

SQC-310 Operating Manual

2.9 Interfacing SQC-310 to CI-100 Crucible Indexer
This section assumes an understanding of the setup and operations for SQC-310
and CI-100 Crucible Indexer. See Chapter 3, Operation for more SQC-310
operations information.

2.9.1 BCD I/O Setup
BCD wiring is suggested over Individual I/O wiring because it uses fewer relays.
The wiring below interfaces the SQC-310 I/O connector to the CI-100 BCD I/O
connector for controlling an 8 pocket source.
SQC-310
CI-100 BCD I/O
Pin 14------------->-------------- Pin 1
Pin 1 -------------->-------------- Pin 2
Pin 3 -------------->-------------- Pin 7
Pin 16 ------------<-------------- Pin 5
Pin 15,2,4------------------------ Pin 6

OutX Pocket Bit1
OutX Pocket Bit2
OutX Pocket Bit3
OutX Pocket Ready
CommonShort Pin 3 to Pin 9Interlock

Short Pin 4 to Pin 8

Pocket Ready A

On the CI-100 rear panel: set Select Switch #5 up and #7 down.

PN 074-550-P1E

On the SQC-310 System Menu >> Sensors & Sources (see section 3.12.3 on
page 3-36) set up the source with:
 Number of Positions: 8
 Control Type: BCD
 Feedback Type: In Position
 Indexer Delay: 5 seconds

2 – 13

SQC-310 Operating Manual

2.9.2 Individual (Binary - as defined by CI-100) I/O Setup
To use Individual wiring between CI-100 and SQC-310 for a four pocket crucible:
CI-100 Binary I/O
SQC-310
Pin 1,3,5,14,24 ---------------- Pin 1, 2
Pin 16 ------------<-------------- Pin 3
Pin 15 ------------>-------------- Pin 4
Pin 2 -------------->-------------- Pin 6
Pin 4 -------------->-------------- Pin 8
Pin 6 -------------->-------------- Pin 10

CommonOutX Pocket Ready
OutX Pocket 1
OutX Pocket 2
OutX Pocket 3
OutX Pocket 4

On the CI-100 rear panel, set Select Switch #5 down.

PN 074-550-P1E

On the SQC-310 System Menu >> Sensors & Sources (see section 3.12.3 on
page 3-36) set up the source with:
 Number of Positions: 4
 Control Type: Individual Feedback Type: In Position
 Indexer Delay: 5 seconds

2 – 14

SQC-310 Operating Manual

2.10 Interfacing SQC-310 to INFICON EBS-530 Electron Beam
Sweep Controller
This procedure describes how to use the SQC-310 Source Indexer function, tocontrol EBS-530 pattern selection (refer to section 3.12.3, Sensors and Sources
Menu, on page 3-36).
NOTE: EBS-530 allows up to 32 patterns; however, SQC-310 cannot selectpatterns numbered above 16.

1 In the SQC-310 System Menu >> Sensors & Sources, select a Source (1 to4) and then select the following Source parameters and values:
Number of Positions . . . . . . . . . . 2 to 16
Control Type . . . . . . . . . . . . . . . . BCD
Feedback Type. . . . . . . . . . . . . . None
Indexer Delay . . . . . . . . . . . . . . . 1 seconds



Number of Positions should equal the desired number of EBS-530 sweep
patterns to be selected by SQC-310.

Two sweep patterns will require one SQC-310 relay.

Three or four sweep patterns will require two SQC-310 relays.

Five to eight sweep patterns will require three SQC-310 relays.

Nine to 16 sweep patterns will require four SQC-310 relays.

SQC-310 will assign up to four relays named Sourcen_BCD_Bitn, displayedin the Relay Menu (refer to section 3.12.1 on page 3-27). These relays will beconnected to the corresponding PSEL pattern select inputs of the EBS-530(see Table 2-6), SQC-310 to EBS-530 wiring chart.
NOTE: Sourcen_BCD_Bitn indicates the number of the Source selected for
EBS-530 sweep control and the BCD bit (0, 1, 2, or 3) that the relay
corresponds to.

2 For each Film, set the Pocket parameter value to the desired sweep patternnumber (refer to section 3.11 on page 3-18).

3 In the SQC-310 Logic Menu (refer to section 3.12.2 on page 3-30) create thefollowing two logic statements:

2 – 15



IF Source n Enabled AND NOT Rotate Pocket AND NOT Crystal Verify
AND NOT Stopped AND Inputn THEN Relayn

IF NOT Inputn THEN Sound (Attention/ Alert/ Alarm) Alarm

PN 074-550-P1E

NOTE:SQC-310 Operating Manual

NOTE:


Source n is the SQC-310 Source previously selected for EBS-530 sweep
control.

Inputn is any available SQC-310 input. The same input is used in both logic
statements. This input will be connected to the EBS-530 relay named
OUT_SWP_READY(see Table 2-6) SQC-310 to EBS-530 wiring chart.



Relayn is any available SQC-310 relay. This relay will be connected to the
EBS-530 input named SWP_ON_OFF (see Table 2-6) SQC-310 to
EBS-530 wiring chart.

The sweep for the selected sweep pattern will be turned on if the first logic
statement is true. If the first logic statement is not true and the second logic
statement is true, sweep will be off and an Alarm message will be displayed by
SQC-310 to indicate that EBS-530 is either not in I/O mode or an EBS-530 error
has occurred.

CAUTION
Sweep will be off during the following conditions: Idle at non-zero power (sweep is on during Idle ramp)
 Manual mode with Process/Layer Stopped

4 Construct a wiring harness to interface SQC-310 with EBS-530 (see Table 2-6,
SQC-310 to EBS-530 wiring chart).
Table 2-6

SQC-310 to EBS-530 wiring chart

PN 074-550-P1E

SQC-310
Function

EBS-530 Function

SQC-310 I/O Connector(Refer to section 2.8 on
page 2-11 for pinout)

EBS-530
Digital I/O
Connector

Relay: BCD Bit 0

Input PSEL-0: Pattern Select Bit 0

Either pin of relay named
Sourcen_BCD_Bit0

Pin 7

Relay: BCD Bit 1

Input PSEL-1: Pattern Select Bit 1

Either pin of relay named

Pin 2

Sourcen_BCD_Bit1
Relay: BCD Bit 2

Input PSEL-2: Pattern Select Bit 2

Either pin of relay named

Pin 14

Sourcen_BCD_Bit2
Relay: BCD Bit 3

Input PSEL-3: Pattern Select Bit 3

Either pin of relay named

Pin 12

Sourcen_BCD_Bit3
Relay: Used in
Logic Statement

Input SWP_ON_OFF: Sweep is turnedon if I/O mode and Interlock inputs areactive and logic statement is true.

Either pin of relay used inlogic statement

Pin 6

2 – 16

SQC-310 Operating Manual

Table 2-6

SQC-310 to EBS-530 wiring chart

SQC-310
Function

EBS-530 Function

SQC-310 I/O Connector(Refer to section 2.8 on
page 2-11 for pinout)

EBS-530
Digital I/O
Connector

Input Common IN_COM

Remaining pins ofSourcen_BCD relays.
Remaining pin of relay
used in logic statement

Pin 1

N/A

Input REM_LOC: Required I/O mode isactivated by continuity between pins 3
and 1. Front panel pattern selection isdisabled when I/O control mode isactive.

N/A

Pin 3

N/A

Input IL OK: Required Interlock is
activated by continuity between pins 8
and 1. To protect e-beam coils, use
cooling water on signal to activate this
input.

N/A

Pin 8

Input: Used in
Logic Statements

Relay OUT_SWP_READY: Indicates
I/O mode is active and no errors arepresent.

Input used in logic
statements

Pin 9

Input Common

Relay Common OUT_COM

Pin 24

Pin 5

PN 074-550-P1E

Relay Common

2 – 17

SQC-310 Operating Manual

Chapter 3
Operation
3.1 Thin Film Deposition Overview
This section provides general background information of the steps involved in athin film deposition process and the operation of SQC-310.

3.1.1 Definitions
Several key terms will be used repeatedly throughout this manual. It is important tounderstand each of these terms.
Material: A physical material to be deposited. A database of 100 materials is stored
in SQC-310. Three parameters completely define a material: Name, Density, and
Z-Ratio (also called Z-Factor). Common materials, densities, and Z-Ratios arelisted in Appendix A.
Film: A film describes in detail how a material will be deposited. It includes thematerial definition and all of the preconditioning, deposition, and postconditioning
variables necessary to accurately deposit the material. Because the film definition
does not include rate and thickness information, a single film can be used in several
different layers and processes. SQC-310 stores up to 50 films.

PN 074-550-P1E

Layer: Layers are the basic building blocks of processes. A layer consists of a film
and the thickness and rate setpoints for that stage of the process. Layers also
define which outputs and sensors will be used at that point in the process.
Codeposition of multiple films occurs when more than one output is active during alayer. SQC-310 stores up to 1000 layers.
Process: A process is a sequence of layers to be deposited. SQC-310 stores up
to 100 processes.
Phase: A phase is a step or stage in the deposition cycle. Preconditioning phases
include Ramp 1, Soak 1, Ramp 2, and Soak 2. Deposit phases include Indexer
Rotate, Shutter Delay, Deposition, and Deposition Rate Ramps. Postconditioning
phases include Feed Ramp, Feed, and Idle Power.
SQC-310 stores the recipes and provides the operating functions required
to control thin film deposition processes. A typical thin film deposition cycle isdisplayed in Figure 3-1.

3–1

SQC-310 Operating Manual

3.1.2 Thin Film Deposition Phases
Figure 3-1 Typical thin film deposition cycle

The cycle can be broken into three distinct phases:Preconditioning (ramp/soak)Deposition

Postconditioning (feed/idle)

During preconditioning, power is supplied in steps to prepare the evaporation
source for deposition. Once the material is near the desired deposition rate,material deposition begins.
During deposition, the PID loop adjusts the evaporation source power as required
to maintain the desired rate. In codeposition, multiple films can be deposited
simultaneously.

PN 074-550-P1E

When the desired thickness is reached, the evaporation source is set toidle power. At this point the process may be complete, or deposition of anotherlayer may begin.

3–2

SQC-310 Operating Manual

3.2 SQC-310 Menu Overview
When turned on, SQC-310 briefly displays the model number (SQC-310 or
SQC-310C) and firmware version information, then the Main screen is displayed(see Figure 3-2).
Three menus on the Main Screen control SQC-310 operation. The buttons
associated with each of these menus provides access to sub menus (see Figure3-3). This chapter describes the function of each setting in each menu. It isarranged by Main Screen menus, then by major sub menus.
NOTE: If prompted for a password, use the buttons along the left of the screen toenter the password. The top button is 1, the bottom button is 6. Pressing
the control knob is 7.

PN 074-550-P1E

Figure 3-2 Main screen

The first line of the Main screen displays the name of the currently selected
process. After the process name is the layer that will run when Start Layer ispressed, and the total number of layers in the process. Run # displays the numberof times this process has been run.
The second line of the Main screen is a status line. It displays the current phaseof the deposition cycle and other status or error messages. When the process isrunning, the right side of this line displays the process elapsed time.
Three graphs are available for display: rate, rate deviation, or output power. The
graphs scale the vertical axis and scroll the horizontal axis based on the data
displayed.
Below the graph are two lines that display deposition readings (four lines for
SQC-310 equipped with option card or for SQC-310C). This section displays
current rate, rate deviation, thickness, and output power. Alternatively, the section
can display current rate, rate setpoint, thickness, and thickness setpoint.

3–3

SQC-310 Operating Manual

The functions of the buttons change to adapt to different operations and are
displayed on the left of the screen. Press Next Menu to display alternate Main
screen menus (see Figure 3-3).
Figure 3-3 Alternate Main screen menus
Main Menu 1

Main Menu 2

Next
Menu

Next
Menu

Main Menu 3

Third m enu available only
when process is stopped.

Next
Menu

Quick
Edit

Access the mostcommonly edited
settings.

Next
Graph

Switch graph between
rate, deviation, andpower.

Auto /
ManualSwitch between PID
and Manual power
control.

Next
Display

Switch the readout
below the graph.

Film
Menu

Create or edit film s to
be used as layers.

Zero

Zero the thickness
reading on all
channels.

SensorInfo

Display detailed
sensor inform ation.

SystemMenu

Modify instrument
related settings.

Next
Layer

Select the next layer
in the process.

Next
Layer

Select the next layer
in the process.

Start
Layer

Start or Stop theselected layer.

Start

Start or Abort theprocess.

Start

Start the selected
layer.

Main Menu 1

Main Menu 2

Process Create or edit processlayers.
Menu

Main Menu 3

Main Menu 3 provides access to functions that can redefine a process and isavailable only when the process is stopped.

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Spend some time now moving between the three menus. Pay particular attention
to the effects that the Main Menu 2 selections have on the display.

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SQC-310 Operating Manual

3.3 Main Screen, Menu 1
Table 3-1 describes the function of each button on Main screen, Menu 1.
Table 3-1 Main screen, Menu 1 buttons

Next
Menu

Sequences through each of the three Main screen menus.

Quick
Edit

Displays the Quick Edit menu of commonly changed process
values. If this function is not displayed, the active process has nolayers defined.

Auto /
ManualToggles between Auto and Manual power control. When
Auto/Manual is displayed, output power is set by SQC-310 toachieve the programmed deposition rate. When Manual/Auto isdisplayed, the control knob or optional Handheld Remote Controller
sets the output power.

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NOTE: For optimal performance in manual power control use theHandheld Remote Controller. Controlling quick
responding sources (for example, e-beam sources) may
be difficult using the control knob.
Zero

Clears the thickness reading. Useful for resetting or extending thecurrent deposition layer.

Next
Layer

Sequences through each process layer. Press this button to start or
restart the process at any layer. Only displayed when the process
is stopped.

Start
Layer

Each layer in a process can be defined as Auto Start or ManualStart. Auto Start layers begin immediately on completion of theprevious layer. Manual Start layers require Start Layer to bepressed. Only displayed when waiting to start a Manual Start layer.

Start/Stop Layer

Starts or halts the current process. Sets all outputs to zero.

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SQC-310 Operating Manual

3.4 Main Screen, Menu 2
Table 3-2 describes the function of each button on Main screen, Menu 2.

3–6

Next
Menu

Sequences through each of the three Main screen menus.

Next
Graph

Sequences through the graph options for the Main screen. Choose
between rate, rate deviation, or output power graphs. The Y-axisof the rate deviation graph can be scaled in the System Parameters
menu. A fourth display screen displays rate, thickness, and power
in large text format for easy viewing.

Next
Display

Toggles between data display options at the bottom of the Main
screen. The first display option displays rate, rate deviation,
thickness, and power readings. The second display option displays
rate, rate setpoint, thickness and thickness setpoint.

Sensor Info

Replaces the Main screen with the Sensor screen.

Next
Layer

Sequences through each process layer. Press Next Layer to startor restart the process at any layer.

Start
Layer

Each layer in a process can be defined as Auto Start or ManualStart. Auto Start layers begin immediately on completion of theprevious layer. Manual Start layers require Start Layer to bepressed. Only displayed when waiting to start a Manual Start layer.

Start/Reset

Starts or halts the current process. Sets all outputs to zero.

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Table 3-2 Main screen, Menu 2 buttons

SQC-310 Operating Manual

3.5 Main Screen, Menu 3
Menu 3 can be accessed only while the process is stopped. This menu displays
process, film, and system setup parameters that cannot be altered while a process
is running.
To display and edit these parameters:

1 Stop the process.
2 Edit the parameters values.
3 Restart the process at the desired layer.
Table 3-3 describes the function of each button on Main screen, Menu 3.

PN 074-550-P1E

Table 3-3 Main screen, Menu 3 buttons

Next
Menu

Sequences through each of the three Main screen menus.

Process
Menu

A process is a sequence of layers of deposited film(s). The Process
Menu allows process layers to be created and edited.

Film
Menu

A film consists of a material plus the setup information necessary todeposit that material. Settings on the Film menu include
pre/postconditioning, deposition error controls, and the physicalchamber setup for that material.

SystemMenu

System parameters control the overall operation of SQC-310.
Tooling, crystal frequency, and operating modes are found on the
System Parameters menu.

Start/Reset

Starts or halts the current process. When halted, all outputs are set
to zeroView Logic

View Logic is a read-only screen while a process is running. This
displays logic statements as true (shown in green text) or false(shown in red text) at any point in the process.

The remainder of this chapter provides a detailed explanation of each sub menu
and its settings.

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SQC-310 Operating Manual

3.6 Quick Edit Menu
The Quick Edit menu is found on the Main Screen under Main Menu 1.
It provides access to the most commonly adjusted parameters for the current
process and layer (see Figure 3-4).
Figure 3-4 Quick Edit menu

3–8

To
Main

Returns to the Main screen Menu 1.

Edit

Opens the selected parameter for edit. Button functions
change to:
Next: Store parameter and move to next for editing.
Cancel: Stop editing and undo changes to selected parameter.
Enter: Stop editing and save values for selected parameter.
Control Knob: Rotate to adjust value. Press to store value andmove to next parameter.

Prev Layer

Displays the parameters for the previous layer in the process.

Next Layer

Displays the parameters for the next layer in the process.

Reset

Displayed only when a layer is in process. Stops the layer andresets the process.

Control Knob

Rotate the control knob counterclockwise or clockwise to change
the selected parameter. Press the control knob button to select aparameter value to edit. With the parameter selected, rotate thecontrol knob counterclockwise or clockwise to change the value.
Once the desired change is made, press the control knob to savethe change for the selected parameter and to automatically scroll
down to the next parameter value for editing.

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Table 3-4 Quick Edit menu buttons

SQC-310 Operating Manual

Quick Edit parameters are described below:
Initial Rate: The beginning rate of deposition for this layer. This is the target ratethat the control loop tries to maintain throughout the deposition (assuming no rate
ramps are used).
Final Thickness: The desired final thickness of this layer. The deposition phase ofthis layer will end when this thickness is reached.
P Term: The proportional term sets the gain of the control loop. High gains yield
more responsive (but potentially unstable) loops. Try a value of 25, then gradually
increase/decrease the value to respond to step changes in rate setpoint.
I Term: The integral term controls the time constant of the loop response. Try 0.5
to 1 seconds for e-beam systems, 5 to 10 s for thermal systems.
D Term: The differential term causes the loop to respond quickly to changes.
Use 0 or a very small value to avoid oscillations.
NOTE: See section 7.5, Control Loop, on page 7-5 for details on adjusting the
PID control loop terms.
Max Power: The maximum output power allowed for the selected source.
Power is limited to this value and a power alarm occurs if the power remains at
the maximum for the time set for Power Alarm Delay.
Slew Rate: The maximum power change allowed on an output, in % of Full Scale
per second. If power or rate ramps exceed this value, an error will occur.
Material: Assigns a material to the film. As materials change, their density and
Z-Ratio (Z-Factor) are updated.

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Density: Sets the density for this material. Material density has a significant impact
on deposition calculations.
Z-Factor: Sets the Z-Ratio, which is the acoustic impedance of the quartz crystal
to that of the deposited material. It is an empirically determined measure of theeffect a material has on quartz crystal frequency change.
Film Tooling: Compensates for sensor sensitivity to the selected material.
Use Crystal Tooling in the System menu to compensate for each sensor
individually.
Rate Filter Alpha: Selects the amount of filtering used to display rate data.
An Alpha of 1 is no filtering. An Alpha of 0.1 is heavy filtering.
NOTE: Low alpha values give a very stable display, but will lag actual rate
readings and can hide noise problems.

3–9

SQC-310 Operating ManualRamp 1: During the deposition of a layer, it may be desirable to change thedeposition rate. For example, a process may require the deposition to occur at aslow rate first and then increase the rate once an initial thickness is reached.
Enabling rate ramps provides that capability. Once enabled, these parameters
become available:
Start Thickness: The deposited thickness at which the new rate will begin.
Ramp Time: Time allowed for the rate to change from initial rate to new rate.
New Rate: The rate of deposition, which is reached at the end of Ramp 1.
Ramp 2 / Ramp 3: Three rate ramps are available for each layer. Ramps 2 and 3
both have Start Thickness, Ramp Time, and New Rate parameters similar to thosedescribed above for Ramp 1. The Start Thickness for Ramp 2 should be greaterthan the Start Thickness for Ramp 1. Likewise, the Start Thickness for Ramp 3
should be greater than the Start Thickness for Ramp 2.

3.7 Process Menus
There are several tiers of Process menus. The first tier (see Figure 3-5) displays allprocesses and enables processes to be selected for editing or to be set as theactive process. Scrolling and selecting a process is done by rotating the control
knob.

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Figure 3-5 Process Select menu

Table 3-5 Process Select menu buttons

3 – 10Main Screen

Returns to the Main screen, Menu 3.

Edit

Edit displays the Layer Select menu for the selected process.

Edit Name

Displays the character entry screen to edit the selected
process name.

SQC-310 Operating Manual

Table 3-5 Process Select menu buttons (continued)

DeleteDeletes the selected process and all of its layers. A prompt
will follow if delete is selected to safeguard against accidental
process deletion.

Copy/Paste

Copies the selected process and all of its layers. Scroll to an Empty
process and press Paste to paste the copied process andcorresponding film name. The Paste button will be displayed after
the Copy button is pressed.

CreateWhen an empty process is selected, creates a new process.

Control Knob

Rotate the control knob counterclockwise or clockwise to change
the selected process. Press the control knob button to select a
process for editing.

Selecting Edit on the Process Select menu displays the sequence of layers thatwill be deposited in the selected process (see Figure 3-6). Scrolling and selecting
a layer is done by rotating the control knob.

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Figure 3-6 Layer Select menu

Table 3-6 Layer Select menu buttons

Main Screen

Returns to the Main screen Menu 3.

Prev
Menu

Returns to the Process Select menu.

Edit...

Displays the Layer Edit menu for the selected layer (see Figure
3-7).

3 – 11SQC-310 Operating Manual

Table 3-6 Layer Select menu buttons (continued)

Insert New . . .

Displays the list of 50 films. Select a film, then press Insert Normal
or Insert CoDep to insert the film as a new layer.

Copy.../Paste...

Used to develop the sequence of layers in a process.
Copies the selected layer, which can then be pasted or inserted.
Pasting overwrites the selected layer. After copying, Insert isdisplayed. Insert pastes the layer above the selected layer (seesection 3.9 on page 3-15).

Control Knob

Rotate the control knob counterclockwise or clockwise to change
the selected layer. Press the control knob button to select a layer
for editing.

3.8 Process Menu - Edit Layer
The Layer Edit menu is a button option on the Main screen. Each layer consists ofa film, the rate, thickness, and a few other parameters needed to setup the layer.
The Layer Edit menu provides access to these layer parameters (see Figure 3-7).
The control knob scrolls through the list of layer parameters. When a parameterhas been selected for editing, rotate the control knob to adjust value. Press thecontrol knob to store value and move to next parameter.

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Figure 3-7 Edit Layer menu

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SQC-310 Operating Manual

Table 3-7 Layer Edit Menu buttons

To Main

Returns to the Main menu.

Prev Menu

Returns to the Layer Select menu.

Edit

Opens the selected parameter for edit. Button functions change to:
Next: Store parameter and move to next for editing.
Cancel: Stop editing and undo changes to selected parameter.
Enter: Stop editing and save values for selected parameter.
Control Knob: Rotate to change value. Press the control knob tostore the value and move to the next parameter.

Control Knob

Rotate the control knob counterclockwise or clockwise to change
the selected parameter. Press the control knob to select aparameter value to edit. With the parameter selected, rotate thecontrol knob counterclockwise or clockwise to change the value.
Once the desired change is made, press the control knob to savethe change for the selected parameter and to automatically scroll
down to the next parameter value for editing.

A description of each parameter on the Layer Edit menu follows:
Initial Rate: The beginning rate of deposition for this layer. This is the target ratethat the control loop tries to maintain throughout the deposition (assuming no rate
ramps are used).
Final Thickness: The desired final thickness of this layer. The deposition phase ofthis layer will end when this thickness is reached.
Time Setpoint: Sets a time, after deposition begins, when the Time Setpoint logic
event becomes true.

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Thickness Setpoint: Sets a thickness when the Thickness Setpoint logic event
becomes true.
Start Mode: Determines whether a layer begins automatically upon completionof the previous layer. If Manual Start is selected, the previous layer ends at its idle
power and waits for the operator to press the Start button.
Sensor 1-4: Activates/Deactivates each quartz crystal sensor to be used for theselected film. If multiple sensors are assigned to a film, their readings areaveraged. If multiple sensors are assigned to a film, and one fails, it is excluded
from measurements. Sensors 3 and 4 will not be displayed unless the optional
sensor board is installed in SQC-310 or SQC-310C is used.
Source: Selects the source output that is active for the selected layer.
Max. Power: The maximum output power allowed for the selected source. Poweris limited to this value and a power alarm occurs if the power remains at the
maximum for Power Alarm Delay seconds.

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SQC-310 Operating Manual

Min. Power: The minimum output power desired for the selected output. An alarm
occurs if power remains below this value for Power Alarm Delay seconds.
Power Alarm Delay: The time that source power must remain outside the Min/Max
Power settings to trigger an alarm.
Slew Rate: The maximum power change allowed on an output, in % of Full Scale
per second. If power or rate ramps exceed this value, an error will occur.
Rate Dev. Attention: The % rate deviation that triggers an attention alarm.
The default value of 0% disables this function.
Rate Dev. Alert: The % rate deviation that triggers an alert alarm. The default
value of 0% disables this function.
Rate Dev. Alarm: The % rate deviation that triggers an alarm. The default value of
0% disables this function.
Ramp 1: During the deposition of a layer, it may be desirable to change thedeposition rate. For example, a process may require a slow deposition rate for an
initial thickness and then an increased rate once the initial thickness is reached.
Enabling rate ramps provides that capability. Once enabled, the following
parameters become available:
Start Thickness: The deposited thickness at which the new rate will begin.
Ramp Time: Time allowed for the rate to change from initial rate to new rate.
New Rate: The rate of deposition, which is reached at the end of Ramp 1.

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Ramp 2 / Ramp 3: Three rate ramps are available for each layer. Ramps 2 and 3
both have Start Thickness, Ramp Time, and New Rate parameters similar to thosedescribed above for Ramp 1. The Start Thickness for Ramp 2 should be greaterthan the Start Thickness for Ramp 1. Likewise, the Start Thickness for Ramp 3
should be greater than the Start Thickness for Ramp 2.

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SQC-310 Operating Manual

3.9 Layer Copy, Insert, and Delete Menus
From the process menu, the Copy, Delete, and Insert buttons are used to build andedit a sequence of process layers.
The Layer Select menu, displays a process consisting of four layers (see Figure3-8). The first three layers will be codeposited with Layer 1 (note the indentation ofLayers 2 and 3). The fourth layer will be deposited after Layers 1 to 3 arecodeposited.
Figure 3-8 Layer Select menu

To insert a new layer, select the layer below the desired position of the new layer
and press Insert New. The Film Select menu allows for the selection of a film to be
used for this layer.

PN 074-550-P1E

NOTE: Insert CoDep is only available on the codeposition model (SQC-310C).
Figure 3-9 Film Select menu

3 – 15SQC-310 Operating ManualOnce a film is selected, press Paste Normal or Paste CoDep. The Paste CoDep
button only appears when a valid layer has been selected for inserting using
SQC-310C. After the paste, the screen returns to the Layer Select menu (seeFigure 3-10).
Figure 3-10 Layer Select menu

Select a layer and press Copy to store a copy of the layer in memory.

PN 074-550-P1E

Figure 3-11 Copy Layer menu

The display changes to the Copy Layer menu. The Paste, Insert Normal, or Insert
CoDep button may not be visible if the operation is not allowed for the selected
layer.
Paste replaces the selected layer with the layer stored in memory.

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SQC-310 Operating Manual

Insert Normal or Insert CoDep inserts layers above the selected layer. That is, theinserted layer will have the same number as the selected layer, and the selected
layer will move down one layer.
HINT: When building a process it is easiest to add a test layer and insert newlayers above that layer. When the process is complete, delete the test layer.
NOTE: Each CoDep layer (SQC-310C only) must be assigned to a different output
and sensor.
A warning message is displayed if there is a conflict. Select each CoDep
layer, press Edit, and assign unique sensors and outputs.

3.10 Film Menus
The Film menus allows for the entering and editing of the parameters that regulate
the deposition of each film. These parameters apply any time this film is used (inany process). Rotate the control knob to scroll through and select films.

PN 074-550-P1E

Figure 3-12 Film Select menu

Table 3-8 Film Select menu buttons

Main Screen

Returns to the Main menu.

Edit...

Displays the Film Edit menu for the selected film.

Edit Name...

Displays the Character Entry screen to edit the selected film name.

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SQC-310 Operating Manual

Table 3-8 Film Select menu buttons (continued)

DeleteDeletes the selected film.
NOTE: Films cannot be deleted if they are used in any process.

Copy/Paste

Copies the selected film. Scroll to a film labeled as <Empty> andpress the Paste button to paste the copied film. The Paste button
appears after the Copy button is selected.

CreateAvailable only when an undefined film (labeled as <Empty>) is
selected. This button defines the empty slot as a film and assigns it
a film number, allowing it to be used in a process.

Press Edit to display the setup parameters for the selected film.

3.11 Film Edit Menu
Rotate the control knob to scroll through parameters. Press the control knob toselect a parameter value to edit. While parameter value is highlighted, rotate thecontrol knob counterclockwise or clockwise to change the value. Press the control
knob to save the desired change for the selected parameter.

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Figure 3-13 Film Edit menu

3 – 18SQC-310 Operating Manual

Table 3-9 Film Edit menu buttons

To Main

Returns to the Main menu.

Prev Menu

Returns to the Film Select menu.

Edit

Opens the selected parameter for edit. Button functions changeto:
Next: Store parameter and move to next for editing.
Cancel: Stop editing and undo changes to selected parameter.
Enter: Stop editing and save values for selected parameter.
Control Knob: Rotate to change value. Press the control knob tostore the value and move to the next parameter.

Film Conds...

Displays pre/postconditioning settings (see section 3.11.1 on
page 3-21).

Deposit Controls...

Displays deposition control settings (see section 3.11.2 on page3-22).

Configure Sensors... Displays crystal fail mode control settings (see section 3.11.3 on
page 3-24).

A description of each film parameter follows:
P Term: The proportional term sets the gain of the control loop. High gains yield
more responsive (but potentially unstable) loops. Try a value of 25, then gradually
increase/decrease the value to respond to step changes in rate setpoint.
I Term: The integral term controls the time constant of the loop response.
Try 0.5 to 1 second for e-beam systems, 5 to 10 s for thermal systems.

PN 074-550-P1E

D Term: The differential term causes the loop to respond quickly to changes.
Use 0 or a very small value to avoid oscillations.
NOTE: See section 7.5, Control Loop, on page 7-5 for details on adjusting the
PID control loop terms.
Film Tooling: Compensates for sensor sensitivity to the selected material.
Use Crystal Tooling in the System menu to compensate for each sensor
individually.
Pocket: Indicates which pocket of a multi-material indexer should be used.
The source in the Sources and Sensors screen of the System Menu must be
configured first (see section 3.12.3 on page 3-36).
Crystal Quality, Rate Deviation: The maximum allowed rate deviation, from therolling average of the previous 16 rate readings. Each time the rate deviation
exceeds the selected percent value, a counter is incremented. Each time thedeviation is within the selected value, the counter decrements (to 1 minimum). Zerodisables the function. If the counter reaches Crystal Quality, Counts during a layer,
the process is aborted. Setting this value to zero disables the Crystal Quality alarm.

3 – 19SQC-310 Operating Manual

Crystal Quality, Counts: A counter is incremented each time Crystal Quality, Rate
Deviation is exceeded, then decremented each time a reading is within the rate
deviation. If the counter reaches Crystal Quality, Counts during a layer, the process
is aborted. Setting this value to zero disables the Crystal Quality alarm.
NOTE: The Crystal Quality settings are very sensitive to PID loop tuning. It isbest to leave Crystal Quality disabled until the stability of the process
and PID settings are confirmed.
Crystal Stability, Single: As material is deposited on the crystal, the frequency
normally decreases. However, arcing, mode hopping, or external stresses may
cause the crystal frequency to increase. If a single large positive frequency shiftexceeds this value (in Hz) during a process, a crystal fail condition is indicated.
Crystal Stability, Total: As material is deposited on the crystal, the frequency
normally decreases. However, arcing, mode hopping, or external stresses may
cause the crystal frequency to increase. If the accumulated value of these positivefrequency shifts exceeds this value (in Hz) during a process, a crystal fail condition
is indicated.
Material: Selects a material assigned to this film. As materials change, theirdensity and Z-Ratio is updated.
Density: Sets the density for this material. Material density has a significant impact
on deposition calculations. Common materials, densities, and Z-Ratios are listed inAppendix A.

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Z-Factor: Sets the Z-Ratio, an empirically determined measure of the effect amaterial has on quartz crystal frequency change. Common materials, densities,
and Z-Ratios are listed in Appendix A.

3 – 20SQC-310 Operating Manual

3.11.1 Film Conditioning Menu
The Film Conditioning menu contains the power settings used for preconditioning
and postconditioning.
Figure 3-14 Film Conditioning menu

Ramp1 Power: Sets the power level (% of full scale) desired at the end of Ramp 1.
Ramp1 Time: Sets the time to ramp linearly from the initial power to Ramp 1
power.
Soak1 Time: Sets the time the output remains at the Ramp 1 power level.
Ramp2 Power, Ramp2 Time, Soak2 Time: Functions are the same as Ramp 1
and Soak 1. Typically, Ramp 2 power is set near the power level required toachieve the desired initial deposition rate.
PN 074-550-P1E

Feed Power: The feed phase output power level in the postconditioning phase.
Feed Time: The time required to wire feed new material and the time for which thefeed power will be held.
Idle Power: Idle power ramps output power back to zero, or holds the material ata state that is ready for deposition (usually the same as Ramp 2 power). The idle
phase occurs in the postconditioning phase.
(Idle) Ramp Time: The time required for the power to return idle power level.

3 – 21SQC-310 Operating Manual

3.11.2 Film Deposit Controls Menu
The Deposit Controls menu contains the settings used to control shutters andcontroller response during error conditions (see Figure 3-15).
Figure 3-15 Deposit Controls menu

NOTE: Shutter Delay requires the QCM sensor to be exposed to thedeposition source while the substrate shutter is closed.
Capture: A percentage of Init Rate (refer to section 3.8 on page 3-12) that must be
reached to end the shutter delay. If the capture accuracy is not reached within the
shutter delay time, the process halts.
Control Delay: It is common to see a negative rate spike at the beginning of the
Deposit state when using a source or sensor with a shutter. This is due to thesudden change in temperature that the crystal is exposed to when the shutter
opens. When the Control Delay function is used, the control loop will ignore the rate
for a set amount of time at the beginning of the Deposit state. This helps toeliminate overcompensation by the control loop due to rate spikes when the sensor
or source shutter opens. The Control Delay setting is the amount of time SQC-310
will wait before the control loop takes over.

3 – 22

PN 074-550-P1E

Shutter Delay: Used to stabilize rate control before the substrate shutter opens.
Enabling shutter delay requires that the system reach a specific capture accuracy
before the shutter opens. Capture is set as a percent of the Init Rate setting on theLayer Edit menu (refer to section 3.8 on page 3-12). If the rate is maintained within
the Capture threshold for 5 seconds, the substrate shutter will open, thickness iscleared, and deposition will continue normally. If the rate is unable to be maintained
within the threshold for 5 seconds within the Shutter Delay time, the process will
halt.

SQC-310 Operating ManualControl Error: If the control loop cannot maintain the desired deposition rate due
to loss of source material, excess rate ramps, equipment malfunction, or a control
error occurs, the Control Error will respond accordingly with the programmed
response.


Ignore: The error condition is ignored.



Stop: All source outputs return to 0% power.



Hold: The output power is held at the same level as when the error occurred.
The process will continue to be monitored until Final Thickness is reached.



Error %: Specifies the rate threshold for Control Error. Only available when
Stop or Hold are selected for Control Error.

PN 074-550-P1E

Rate Sampling: Rate sampling can extend the life of crystals. With rate sampling,
the deposition rate is sampled for a period of time, then the sensor shutter isclosed. Power is held at the same level as the final power setting during the sample
period.
Continuous: Disables Rate Sampling. Sensor shutter remains open during
deposition.



Accuracy: The sampling phase ends when the rate is maintained within the
Accuracy setting percent of the Init Rate setting. The hold phase is then active
for a specific time.

Time Based: The sampling phase ends after a set amount of time (SampleTime). The hold phase is then active for a specific time.



Accuracy: The threshold, in percent of Init Rate (refer to section 3.8 on page3-12), which must be maintained in or order to move to the hold phase. Only
available if Rate Sampling is set to Accuracy.

Sample Time: The amount of time before the sampling phase ends. Only
available if Rate Sampling is set to Time Based.

Hold Time: The amount of time to maintain the hold phase. Used if Rate
Sampling is set for either Accuracy and Time Based.

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SQC-310 Operating Manual

3.11.3 Film Configure Sensor Menu
The Configure Sensors menu contains the settings used to control crystal failmodes during error conditions (see Figure 3-16).
Figure 3-16 Configure Sensors menu

Crystal Fail Mode: The action that is executed if the sensor crystal fails.
Halt: The process will be halted in the event of a sensor failure.
Halt Last: The process will be halted if the last sensor of multiple assigned
sensors fails.
Timed Power: The current layer is completed using the last power andrate readings.

Backup: This sensor is selected solely for use as a backup sensor. It may
not be used or selected as a sensor for a film but may be used in the eventof a sensor failure. Timed Power mode will be enabled if this is the last sensor
to fail.
Crystal Position: The desired crystal position in a multi-crystal sensor head.
Backup Sensor: The designated sensor is to be used as a backup in the eventof the main sensor failing. If a value of 2 is entered, under Sensor 1, Sensor 2 will
be used as a backup when Sensor 1 fails. This will automatically set Sensor 2
Crystal Fail Mode to Backup.
Backup Crystal Position: The position on the backup sensor where the backup
crystal is located.

3 – 24

PN 074-550-P1E

Switch to Backup: The sensor is switched to the backup sensor in the eventof a sensor failure.

SQC-310 Operating Manual

3.12 System Menu
The System menu contains settings that affect the basic operation of SQC-310(see Figure 3-17). System parameters generally pertain to the physical setup of thevacuum system equipment.
Figure 3-17 System Parameter menu

PN 074-550-P1E

Table 3-10 System menu buttons

To Main

Returns to the Main menu.

Edit

Opens the selected parameter for edit. Button functions change to:
Next: Store parameter and move to next for editing.
Cancel: Stop editing and undo changes to selected parameter.
Enter: Stop editing and save values for selected parameter.
Control Knob: Rotate to adjust value. Press to store value andmove to next parameter.

Input & Relays

Displays menu for assigning inputs and relays.

Logic Menu

Displays menu for building logic statements.

Sensors & Sources

Displays menu for identifying sensor and source types.

3 – 25SQC-310 Operating Manual

Period: Sets the measurement interval between 0.1 second (10 readings per
second) and 1 second. A longer period gives higher reading accuracy, especiallyin low rate and low density applications.
Period(seconds)

Frequency
Resolution (Hz)

0.10

0.03

0.25

0.01

0.50

0.005

0.75

0.004

1.00

0.003

Simulate Mode: Normal mode uses quartz crystal sensors as inputs to SQC-310
for rate and thickness readings. Simulate mode simulates the quartz crystal sensor
based on the crystal frequency min/max. Simulate mode is useful for debugging
process recipes but does not accurately mimic actual process control performance.
NOTE: Source output power must typically be 50% or more to simulate a non-zero
deposition rate.
System Tooling: Adjusts for global deposition rates that differ from the measured
substrate deposition rate (see section 7.3 on page 7-2).
Min/Max Frequency: The frequency values for the quartz crystal sensors used as
inputs to SQC-310. The maximum frequency should be set to the frequency of a
new crystal, typically 6 MHz. Sensor readings outside the minimum and maximum
frequency values cause a crystal failure.

Rate Filter Alpha: Selects the amount of filtering used to display rate data. An
Alpha of 1 is no filtering. An Alpha of 0.1 is heavy filtering (10 measurement rolling
average).
RS-232 Comm: Baud rate used for RS-232 communications.
Password Enable: If Password is enabled, the Quick Start, Film, and System
menus require a password. The Process menu can be used to select a process,but a password is required to make any changes on the Process menu.

3 – 26

PN 074-550-P1E

Dev Graph Limit: Sets the upper limit for the Rate Deviation graph Y-axis.

SQC-310 Operating Manual

Password: If Password is enabled, this parameter sets the sequence of buttons topress to enter menus. Press the desired sequence to set the password (see Figure
3-18 for an illustration of the password number designations).
Figure 3-18 Password number designations

NOTE: Holding down buttons 1 and 6 while powering up SQC-310 sets the
password to 1111.

CAUTION
Holding down 1, 6, and 7 (control knob) will default
memory for the entire system to the factory settings. All
setting will be lost.
Alarm Sounds: Enables/disables the audio alarm associated with alarm
conditions (most severe).

PN 074-550-P1E

Alert Sounds: Enables/disables the audio alarm associated with alert conditions(less severe).
Attention Sounds: Enables/disables the audio alarm associated with attention
conditions (least severe).

3.12.1 Input and Relay Menus
The Input and Relay menus of the System Parameters menu allow the operator todisplay and edit relays and inputs.
Inputs and relays already assigned are indicated in the Use column by Snsr
(Sensor), Src (Source), or LS (Logic Statement).
This menu also displays the current state of each input or relay. Items in green are
currently active. Those in red are inactive.
The Relay selections have an additional button (Turn On Relay) that allows eachrelay to be toggled manually for testing purposes (see Figure 3-19). Relays are
returned to their proper defined state on exit from this screen.

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SQC-310 Operating Manual

CAUTIONIf changes have been made to the Input or Relay menu, besure to exit to the System menu or Main Screen before
powering SQC-310 down. Otherwise, the changes may
not be saved.
Figure 3-19 Relay menu

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Figure 3-20 Input menu

To edit an Input or Relay, select it and press Select.

3 – 28SQC-310 Operating Manual

Editable Input parameters are:Name: A logical name for this input. The system-defined default name can be
returned by pressing the Set to Default button.
Active Level: The level, high (5 V) or low (0 V) that triggers the input.
Input Number: The physical input assigned to this logical input function.
Allows for reassignment of inputs without physically rewiring any inputs
or connectors.
Editable Relay parameters are:Name: A logical name for this relay. The system-defined default name can be
returned by pressing the Set to Default button.
Type: Normally Open (NO) contacts or Normally Closed (NC) contacts.
SQC-310 uses software to implement the NO/NC function. All relays arenormally open and will open when SQC-310 is turned off.
Pulses: Number of pulses required for activation. Setting Pulses to One Pulse
will cause the relay to turn on for the Pulse Width amount of time, then turn off.
Selecting None causes the relay to activate when the logical relay function istrue, and deactivate when it is not. If a multi-crystal sensor is used and Control
Type is set to Direct (see section 3.12.3.1 on page 3-36), this setting isread-only for any sensor drive relays.
Pulse Width: The time (in seconds) that the relay activates if One Pulse or Two
Pulses is selected.
Relay Number: The physical output assigned to this logical relay function.
This allows for reassignment of relays without physically rewiring any relays orconnectors. Connector pins for these assignments are displayed in Table 3-11.

PN 074-550-P1E

Table 3-11 Relay and Input connector pin assignments

Relay
NumberConnector
Pins

Input
NumberConnector
Pin

Relay 1

14,15

Input 1

16

Relay 2

1,2

Input 2

17

Relay 33,4

Input 318

Relay 45,6

Input 419

Relay 57,8

Input 520

Relay 6

9,10

Input 621

Relay 7

11,12

Input 722

Relay 813,25

Input 823

Ground24

NOTE: Relays 9 to 16 and inputs 9 to 16 use the same connector pins as foundon the second rear panel I/O connector (if available) in the same
sequential order.

3 – 29SQC-310 Operating Manual

3.12.2 Logic Menu
Logic statements allow the programming of SQC-310 to respond to inputs andactivate relays, using a variety of process conditions.
To create logic statements select System Menu, then Logic Menu. The Logic
menu also displays the current state of each logic statement. Statements in green
are currently true. Those is red are false.
From the list of 32 logic statement, rotate the control knob to select a statement andpress Edit to display the Edit Logic screen (see Figure 3-21).

CAUTIONIf changes have been made to the Logic menu, be sure toexit to the System menu or Main Screen before powering
SQC-310 down. Otherwise, the changes may not besaved.

PN 074-550-P1E

Figure 3-21 Edit Logic screen

3 – 30SQC-310 Operating Manual

Table 3-12 Edit Logic screen buttons

Go to Then

Moves the cursor to the THEN (action) part of the logic statement(see section 3.12.2.1 for details on creating a logic statement). Thisbutton becomes the Go to Name button after it is pressed.

Go to Name

Moves cursor to the name field. Press Edit Name to display theCharacter Input screen. This button becomes the Go to If button
after it is pressed.

Go to If

Moves the cursor to the IF (condition) part of the logic statement(see section 3.12.2.1 for details on creating a logic statement). Thisbutton becomes the Go to Then button after it is pressed.

DeleteRemoves last condition in the logic statement.

SelectOpens the selected condition for edit. Button functions change to:
Done: Returns to regular logic menu selections.
Delete: Removes last condition in selected logic statement.
Insert: Adds the selected condition for current logic statement.
Control Knob: Rotate to adjust value. Press to store value andmove to next parameter.

3.12.2.1 Creating a Logic Statement
A logic statement consists of two parts. The first part of the statement (IF) indicatesthe condition that must be satisfied for the statement to become true. The second
part (THEN) indicates the action that takes place once the statement becomes true.

PN 074-550-P1E

To create a logic statement, follow the rules below. For the IF portion of thestatement:

There must be an equal number of closed and open parentheses.

All conditions must be separated by an AND, OR, or NOT operator.



The condition part of the logic statement cannot end in an operator.

Enter Logic Condition: To enter a logic condition, press Go to If when the IF partof the statement is not already selected. Rotate the control knob to display thecondition categories, and press Select to display the specific conditions for thatcategory. Select an item from the list of conditions and press Insert to add thecondition to the IF portion of the logic statement. Press Done to continue building
the logic statement.
To add another condition, a logic operator such as AND, OR, or NOT will benecessary. Parentheses can be used between multiple conditions but are notalways necessary. Rotate the control knob to select the Operators category andpress Select. Rotate the control knob until desired operator is selected and press
Insert. Enter another logic condition as described above. Continue these
operations until the desired IF condition is built. Up to 5 conditions can be added inthis manner.

3 – 31SQC-310 Operating Manual

If a mistake is made, press Delete to delete the last entry in the IF statement.
Enter Logic Action: To enter a logic action, press Go to Then if the THEN part ofthe statement is not already selected. Rotate the control knob to display the action
categories and press Select to display the specific actions for that category. Selectan item from the list of actions and press Insert to add the action to the THEN
portion of the logic statement. Press Done to complete the action portion of thelogic statement. Only one action is possible per logic statement.
When exiting the Edit Logic Statement screen, the statement is tested for proper
syntax. If there is an error, the operator is prompted to correct the error.
If the error is not corrected, the logic statement will always evaluate as false.
In addition to listing the 32 logic statements, the Logic menu displays the current
state of each statement. Statements in green are currently true. Those in red arefalse. This can be an aid for troubleshooting logic statement and digital I/O
problems.
3.12.2.2 Logic Statement Conditions (IF)Operators: For more complex logic statements, logical operators such as AND,OR, NOT, parentheses ( ), greater than >, and less than < can be added.
Parentheses are used to group logic conditions, for example, IF (Input1 AND
Input2) OR Input3. Every open parenthesis must have a matching closed
parenthesis. The less than (<) and greater than (>) operators are used only with
Timer conditions.
Numeric Values: Any integer between 1 and 64133. Numeric values are used withtimer conditions, for example, IF Timer 1 < 100 THEN Relay1.

Relays: Choose the logic state (active state) of one of the SQC-310 relays as acondition. If the specified relay becomes active, the logic statement will becometrue (choose relay 1 to 16).
SoftNodes: SoftNodes allow the building of logic statements that are based onother logic statements. There are 8 SoftNodes available for use.
For example:
IF (Input1 AND Input2) OR Input3 THEN SoftNode1
The SoftNode can then be used as a condition in another logic statement.
If (SoftNode1 AND CrystalFail) THEN Stop Layer
Timers: The timer condition is evaluated true whenever the timer value is greaterthan the value entered in the timer condition. There are 8 timers available for use.

3 – 32

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Inputs: Choose the logic state (active state) of one of the SQC-310 digital inputs
as a condition. If the specified input becomes active, the logic statement will
become true (choose input 1 to 16.)

SQC-310 Operating Manual

Sensors: Allows the operator to choose between various sensor conditions.
Available sensor conditions include:
Sensor Enabled (choose sensor 1 to 4)
Sensor Shutter (choose sensor 1 to 4)
Sensor Fail (choose sensor 1 to 4)
All Crystals FailAll Crystals Good
Dual Crystal Shutter (choose dual sensor 1 or 2)
Sensor Timeout (choose sensor 1 to 4)
Sources: Allows the operator to choose between various source conditions.
Available source conditions include:
Source Enabled (choose source 1 to 4)
Source Shutter (choose source 1 to 4)
Source Timeout (choose source 1 to 4)
Internal States: Allows the operator to choose an internal state as a condition.
Available states include:
Stopped
Crystal Verify
Initialized Layer
Manual Start Layer

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Rotate Crystal
Rotate Pocket
Preconditioning
Soak Hold
Shutter Delay
Deposit
Timed Power Recovery
Crystal Switch
Next Crystal
Feed Ramp
Idle Ramp
Start Next Layer

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SQC-310 Operating Manual

Crystal Fail
Stop Layer
Sensor Feedback Timeout
Source Feedback Timeout
Sensor Feedback Error
Source Feedback Error
Invalid Crystal Position
Invalid Pocket Position
Internal Events: Allows the operator to select an internal event as a condition.
Available events include:
Simulate
Manual Mode
Interlock
Last Layer
Process Hold
Process Active
Process Stopped
Shutter Delay Error
Thickness Setpoint
Final Thickness

Soak Hold
Rate Dev Alarm
Max Power Alert
Min Power Alert
Crystal Index: Allows the user to select a specific crystal on a multi-crystal sensor
as a condition. Choose sensor 1 to 4 and crystal 1 to 16.
Pocket Index: Allows the user to select a specific pocket on a multi-pocket source
as a condition. Choose source 1 to 4 and pocket 1 to 16.
Processes: The process condition is evaluated true whenever the selected
process is the current process. Choose process 1 to 100.
Layers: The layer condition is evaluated true whenever the current layer number
equals the specified layer number. Choose layer 1 to 1000.

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PN 074-550-P1E

Time Setpoint

SQC-310 Operating ManualFilms: The film condition is evaluated true whenever the current film number
equals the specified film number. Choose film 1 to 50.
NOTE: References to sensor 1 to 4, source 1 to 4, relay 1 to 16, or input 1 to 16
assume SQC-310C or SQC-310 is equipped with the 4-channel option
card. Units not equipped with the option card will have sensor 1 to 2,
source 1 to 2, relay 1 to 8, and input 1 to 8.
3.12.2.3 Logic Statement Actions (THEN)
General Actions: A selection of actions that do not fit into another category.
Available actions include:
No Action
ManualHold in State
Step From State
InterlockSensor & Sources: Actions related to moving multi-crystal sensors andmulti-pocket sources. Available actions include:
Switch Crystal (choose sensor 1 to 4)
Move Snsr to Next Position (choose sensor 1 to 4)
Move Src to Next Pocket (choose source 1 to 4)
Relays: Activate one of the SQC-310 relays (choose relay 1 to 16).
SoftNodes: Sets a SoftNode to true (choose SoftNode 1 to 8).
Timers: Start a timer (choose timer 1 to 8).

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Alarms: Activate one of the SQC-310 alarms. Alarm options include:
Attention (least severe)
Alert (more severe)
Alarm (most severe)
Process Actions: Start or Reset current process, or select process 1 to 100.
Layer Actions: Perform an action on the current layer. Available actions include:
Start Layer
Start Next Layer
Stop Layer
Force Final Thickness
Zero Thickness
Zero Time
Soak Hold3 – 35SQC-310 Operating Manual

3.12.3 Sensors and Sources Menu
The Sensors and Sources menu allows the types of sensors and sources in thesystem to be configured, particularly multi-crystal sensors and multi-pocket
sources (see Figure 3-22).
Figure 3-22 Sensor 1 Edit

3.12.3.1 Sensor Setup
Crystal Tooling: Adjusts for the difference in measured deposition rate between
the sensor and the substrate being coated.

PN 074-550-P1E

Figure 3-23 Crystal tooling

In Figure 3-23(a), the sensor will measure less rate or thickness than is actuallydeposited on the substrate due to the positioning of the sensor above thesubstrate. In Figure 3-23(b), the sensor will measure more rate of thickness than is
actually deposited on the substrate due to the positioning of the sensor below thesubstrate.

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SQC-310 Operating Manual

Tooling is the ratio of the actual substrate deposition rate or thickness, to thatmeasured by the sensor. If the rate/thickness reading is low, increase the toolingvalue. If the rate or thickness reading is high, decrease the tooling value.
Shutter: If the sensor has no shutter, select none to disable sensor shutter
features. If the sensor is a typical dual sensor, with a shutter that is only activatedwhen the primary sensor fails, select Dual. For other sensor shutters that activate
when the sensor is used, select Yes.
Shutter Delay: If the Yes option is selected for shutter, enter the time required
for the shutter to open and stabilize.
Number of Positions: This parameter defines the number of crystals available forthat sensor input. For single head sensors, set to one. For a typical dual sensor
head with separate oscillators and sensor connections, set to one because there
is only one crystal for each sensor input. For a rotary type multi-crystal head, set to
the number of crystals available.
Current Position: If a multi-crystal sensor has position feedback, thisparameter is not needed. For sensors with only In Position or no position
feedback, enter the current crystal position.
Control Type: Defines the type of crystal or pocket position control required fora multi-crystal sensor.
Manual: Not under control of SQC-310. With manual control, SQC-310 willstop the process upon the completion of the current layer. If the next layer
requires a different crystal position, a message is displayed requesting thenumber of the crystals required. Once the position has been changed,
press the Continue button.

PN 074-550-P1E

Direct: Used when the actuating device is driven directly. In this case thecontroller creates one or two outputs, one for each available direction, todrive a motor or solenoid.
Drive Type: Defines the drive method or direction for Direct control.
Up, Down, Fast, and Inline: Select Up to create a single relay output
used to increment the sensor to the next crystal position. Down works
identically, except the relay output is labeled Sensor Drive Down.
Select Fast to create both up and down outputs. SQC-310 will thendetermine the fastest direction to the target crystal position by activating
the appropriate output. The Inline drive type informs SQC-310 that
continuous travel in one direction is not possible. Therefore to get fromposition 6 to 1, the direction must be down until 1 is reached.
Single Step and Double Step: Used when multi-crystal sensor heads
are actuated by pulsing a pneumatic value. CrystalSix rotary sensor
uses Double Step. Crystal 12 and RSH-600 rotary sensors use Single
Step.

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SQC-310 Operating Manual

BCD: Select when position control is through an external rotation controller
which accepts Binary Coded Decimal (BCD) inputs for position selection.
BCD inputs are common because they require only a few signal lines toselect several positions. SQC-310 automatically creates the number ofrelay outputs required to interface with the external controller.
Individual (discrete): Select when position control requires a uniquesignal line for each position. SQC-310 automatically creates the number ofrelay outputs required to interface with the external controller.
Feedback Type: Defines the type of feedback for a multi-crystal sensor head.
This is how the SQC-310 identifies the current crystal position.
None: No crystal feedback is provided. SQC-310 tracks crystal position fromthe current position setting (above). This setting is used for the CrystalSix andCrystal 12 rotary sensors.
Individual (discrete): Uses one input for each pocket position in the source.
All inputs are normally false (open circuit) unless the respective pocket is in
position when that input is true (closed to ground). This setting is used for theRSH-600 rotary sensor.
BCD: Uses binary coding to indicate the pocket position. For example, aneight-pocket source would use three inputs. With pocket one in position, all
inputs would be false. With pocket four in position, inputs one and two would betrue and input three would be false.
Single Home: This feedback indicates there is a single feedback signal thatindicates when pocket one is in position.

Indexer Delay: This parameter has two different functions. If the Feedback Typeis selected as None, SQC-310 waits the designated time on the assumption thatthe pocket will get into position by the end of the delay. If there is position feedback,
SQC-310 will wait this time for the pocket to reach the target position. If it does notreceive the feedback signal, a Pocket Wait Timeout error is issued.
Table 3-13 INFICON rotary sensor settings

3 – 38Sensor Type

Number of
PositionsControl Type

Drive Type

Feedback Type

CrystalSix

6

DirectDouble Step

None

Crystal 12

12

DirectSingle Step

None

RSH-600

6

DirectSingle Step

Individual

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In Position: The input is normally false (open circuit) and goes true (closed to
ground) when any pocket is in position.

SQC-310 Operating Manual

3.12.3.2 Source Setup
Source setup parameters are identical to the sensor setup parameters (refer tosection 3.12.3.1) with one exception, Voltage Scale.
Voltage Scale: Sets the maximum output voltage for the source power supply
input. Voltages from –10 to +10 V are possible. Refer to the source power supply
manual for the required control input voltage, typically 10 V, 5 V, -10 V, or -5 V.

CAUTIONPN 074-550-P1E

If changes have been made to the Logic menu, be sure toexit to the System menu or Main Screen before powering
SQC-310 down. Otherwise, the changes may not besaved.

3 – 39SQC-310 Operating Manual

Chapter 4
Communications
4.1 Introduction
SQC-310 offers the following types of data communications hardware ports:


RS-232: 19200 to 115200 bps baud rate, 8 data bits, and no parity (standard)

Ethernet: Port 2101, address 192.168.1.200 (optional)USB: PID 8292 (optional)

The RS-232 and Ethernet ports can be used simultaneously.
Both the host and server must have the same form of communications equipment
and complementary setup. For serial communications, the baud rates and data
word format must match.
The word format for bit serial lines (RS-232) is comprised of ten signal bits:
eight data bits, one start bit, one stop bit, and no parity. The eight data bits containa byte of information or character whose ASCII value ranges from 0 to 255.

4.1.1 RS-232 Serial Port

For successful communications, the baud rate of the host computer and SQC-310
must match. Available baud rate options are: 19200, 38400, 57600, and115200 bps.
SQC-310 is configured as DCE (Data Communication Equipment).
NOTE: Unpredictable RS-232 hardware/software combinations may occasionallycause a command to not be recognized by SQC-310. Consequently, allcommunications should include an automatic retry procedure. If acommand sent using RS-232 does not produce a response from SQC-310
within three seconds, it should be sent again.

4–1

PN 074-550-P1E

RS-232 serial communications are accomplished through an industry standard
9-pin female connector found on the SQC-310 rear panel (refer to Figure 2-2 onpage 2-4). A mating male connector is required to attach a host interface. The hostand SQC-310 can be separated by up to 15.2 m (50 ft.) using a multiconductor
shielded data cable.

SQC-310 Operating Manual

4.1.2 USB PortUSB drivers are provided with installation of the SQC-310 Comm software.
Windows will find and install the SQC-310 USB device driver when SQC-310 isconnected to a USB port.
In the event that an unsigned driver window displays during installation, click
Continue anyway. Successful communication can be confirmed using the
SQC-310 Comm software.

4.1.3 Ethernet (TCP/IP) PortFor Ethernet communications, SQC-310 uses the static Internet Protocol (IP)address 192.168.1.200. The optional TCP/IP interface supports only the Standard
Ethernet TCP/IP protocol. SQC-310 will communicate using TCP/IP on TCP port
number 2101.
The interface supports static addressing. DHCP is not supported. Ethernet
parameters allow the IP address and the net mask to be set. A standard Ethernet
cable is required to connect SQC-310 through a network or hub connection.
4.1.3.1 Ethernet Network Protocol
An IP address defines the computer on the Internet. Most computers are
configured to automatically obtain the IP address from a server. Most computerswill auto-configure and work with either a straight or crossover Ethernet cable.

PN 074-550-P1E

To communicate directly with SQC-310, the IP address must be manuallyconfigured on the computer, and the computer and SQC-310 must be connectedusing an Ethernet cable. To manually configure the IP address:
Follow section 4.1.3.1.1 for instructions to access network settings in Windows XP.
Follow section 4.1.3.1.2 on page 4-5 for instructions to access network settings in
Windows 7 and Windows 8.
NOTE: The above instructions will set two values—the IP address and the Subnet
mask—which may prohibit access to the Internet. If these values alreadycontain information, make a record of the information for use in restoring
the Internet connection.
NOTE: If the computer only has one Ethernet port (one network connection),setting the computer for direct communications will prohibit it fromaccessing the Internet until the setting is reversed.
SQC-310 ships with a pre-assigned address of 192.168.1.200. To communicate
directly with SQC-310 from a computer, the computer must also be assigned a
192.168.1.xxx address, but cannot be set to 192.168.1.200. The examples in
section 4.1.3.1.1 and section 4.1.3.1.2 use the address 192.168.1.201 for thecomputer. The Subnet mask 255.255.0.0 is sufficient.

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SQC-310 Operating Manual

4.1.3.1.1 Accessing Network Settings in Windows XP

1 Select Network Connections from either the Windows Start menu or fromthe Control Panel (see Figure 4-1).
Figure 4-1 Accessing network connections

2 Select the Local Area Connection to be changed, right click and selectProperties (see Figure 4-2).

PN 074-550-P1E

Figure 4-2 Local Area Connection properties

4–3

SQC-310 Operating Manual

3 On the General tab, select Internet Protocol (TCP/IP) and click theProperties button (see Figure 4-3).
Figure 4-3 Internet Protocol (TCP/IP) Properties

4 Select Use the following IP address, enter the IP address and Subnet mask
displayed in Figure 4-4, and click OK. With this selection, the computer isassigned an IP address for communicating with SQC-310.

PN 074-550-P1E

Figure 4-4 Entering the IP address and Subnet mask

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SQC-310 Operating Manual

5 Click OK in all open dialog boxes to close the Internet Protocol setup for the
Local Area Connection. Open the SQC-310 software and confirm
communications (see section 5.7, Communications Setup Menu, on page5-20).
4.1.3.1.2 Accessing Network Settings in Windows 7 and Windows 8

1 Open the Control Panel (Start >> Control Panel) and Select Network andSharing Center.

2 Click Change adapter settings on the left side pane (see Figure 4-5). This will
open the Network Connections window.

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Figure 4-5 Network and Sharing Center

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SQC-310 Operating Manual

3 In the Network Connections window, right click on the appropriate Local Area
Connection, and select Properties (see Figure 4-6).
Figure 4-6 Network Connections window

4 In the Local Area Connection Properties, select Internet Protocol Version
4 (TCP/IPv4), and click Properties (see Figure 4-7).

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Figure 4-7 Local Area Connection properties

4–6

SQC-310 Operating Manual

5 Select Use the following IP address, then enter the IP address and Subnet
mask displayed in Figure 4-8, and click OK. With this selection, the computer
is assigned an IP address to use when communicating with SQC-310.
Figure 4-8 Entering the IP address and Subnet mask

6 Click OK in all open dialog boxes to close the Internet Protocol setup for the Local
Area Connection. Open the SQC-310 Comm software and confirm
communications (see section 5.7, Communications Setup Menu, on page 5-20).

The IP address can be changed using the Digi Device Discovery software(digdscvr.exe) placed in the SQC-310 directory (typically C:/Program
Files/INFICON/SQC-310 Comm) during SQC-310 Comm installation. Digi Device
Discovery software can be accessed from SQC-310 Comm software by selecting
Ethernet and clicking Setup in the SQC-310 Comm Setup window (see section 5.7).
To change the IP address:

1 Run dgdiscvr.exe and find SQC-310.
2 Double-click on SQC-310.
3 Enter User Name: root and Password: dbps.
4 Click Login.
5 Click Configuration, Network and Set.
6 Change IP=192.168.1.200 to the new IP address.
7 Click Apply, then Log Out. The new IP address is now configured.
4–7

PN 074-550-P1E

4.1.3.2 How to change the SQC-310 IP address

SQC-310 Operating Manual

4.2 SQC-310 Communications Protocol
SQC-310 communicates with a host computer using an ASCII based protocol.
SQC-310 defaults to 19200 bps baud rate, 8 data bits, and no parity. The baud rate
can be changed in the SQC-310 System menu, but is always 8 data bits with noparity.
SQC-310 only responds to commands received. It never initiates communications.
When powering up SQC-310, "abc" will be sent by the SQC-310 to the Host at the
fixed baud rate of 115200. This message will not have a sync character, a lengthcharacter, a status response character, or any CRC characters.
The command protocol sent to SQC-310 is:<Sync character><Length character><1 to n Message characters><CRC1><CRC2>
The sync character is always an exclamation point (!). Following the sync
character is the length character. This is the number of characters in the packet(not counting the sync, length, and CRC characters). The length character has adecimal 34 added to it so there cannot accidentally be a sync character (!)
embedded in the packet.
Following the length character are the message characters as detailed in section
4.3 on page 4-12. After the data are two CRC characters.

PN 074-550-P1E

NOTE: Decimal points in numerical values must be removed before being sent by
remote communications. For example, 12.34 would be expressed as 1234
and 45.6 would be expressed as 456.
NOTE: The number of parameters included in one command/response and theorder of the parameters is not significant for either Set or Get messages.
The format of the return string is a series of parameter numbers andcommas followed by their respective values. Each set is separated by aspace.

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SQC-310 Operating Manual

4.2.1 Command Packet (Host to SQC-310 Message)<Sync character><Length character><Message><CRC1><CRC2>
Sync. . . . . . . . . . . . . . . . . . . . . . . . . The sync character is an exclamation point(!). Any time this character is received, thecommunications for that packet is reset. The
sync character is not included in the CRC
calculation.
Length . . . . . . . . . . . . . . . . . . . . . . . This is the decimal number of characters in
the packet (excluding the sync, length, and
CRC characters). This character has adecimal 34 added to it so there cannot
accidentally be a sync character (!)
embedded in the packet.
Message . . . . . . . . . . . . . . . . . . . . . Command as detailed in section 4.3 on page
4-12.
CRC . . . . . . . . . . . . . . . . . . . . . . . . . Cyclic Redundancy Check (CRC) is amethod to verify there are no errors in thepacket (see section 4.2.3 on page 4-11 fordetailed instructions to calculate the CRC
and section 4.4 on page 4-34 for code
examples).

PN 074-550-P1E

NOTE: If CRC checking in the application is not necessary, send two Nullcharacters (CHR$0) for the CRC. SQC-310 will ignore the CRC. SQC-310
will still return a CRC in its response, but it can be ignored.

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SQC-310 Operating Manual

4.2.2 Response Packet (SQC-310 to Host Message)<Sync character><Length character><Response Status character><Response
Message><CRC1><CRC2>
Sync. . . . . . . . . . . . . . . . . . . . . . . . . The sync character is an exclamation point(!). Any time this character is received, thecommunications for that packet is reset. The
sync character is not included in the CRC
calculation.
Length . . . . . . . . . . . . . . . . . . . . . . . This is the decimal number of charactersin the packet (excluding the sync, length,
and CRC characters). The response lengthcharacter has a decimal 35 added to it todifferentiate a response from a command.
Response Status . . . . . . . . . . . . . . This character tells the status of the sent
message and is coded as displayed in Table
4-1.
Response Message . . . . . . . . . . . . Command Response as displayed in section
4.3 on page 4-12.
CRC . . . . . . . . . . . . . . . . . . . . . . . . . Cyclic Redundancy Check (CRC) is amethod to verify there are no errors in thepacket (see section 4.2.3 for detailed
instructions to calculate the CRC and section
4.4 on page 4-34 for code examples).

PN 074-550-P1E

Table 4-1 Response status
Response Status

MeaningA

Command understood, normal response

C

Invalid command

D

Problem with data in command

E

SQC-310 in wrong mode for this command

F

Invalid CRC

G

Response length exceeds 221 characters

NOTE: If CRC checking in the application is not necessary, send two Nullcharacters (CHR$0) for the CRC. SQC-310 will ignore the CRC. SQC-310
will still return a CRC in its response, but it can be ignored.

4 – 10SQC-310 Operating Manual

4.2.3 Calculating the CRC
The following algorithm is used to calculate the Cyclic Redundancy Check (CRC):
NOTE: The sync character and CRC are not included in the CRC calculation. Allother characters should be included.

1 The CRC is initialized to hexadecimal 0x3FFF.
2 Each character in the packet is examined, bit by bit, and added to the CRC in
the following manner:


The character is exclusive OR’d with the CRC.

The CRC shifts one bit position to the right.



If bit position 0 has a value of 1 before each shift, the CRC is exclusive OR’dwith 0x2001. This is done a total of 8 times per message character.

3 Step 2 is repeated for each character in the message (excluding the sync
character).

4 Mask the contents of the CRC by logical AND with 0x3FFF.
5 The CRC contains 14 significant bits. This is split into two pieces of 7 bits each.
A decimal 34 (0x22) is added to each CRC in order to avoid there being anembedded sync character.
Extract bits 0 to 6 of the CRC and add a decimal 34 (0x22). This is CRC1.



Extract bits 7 to 13 of the CRC and add a decimal 34 (0x22). This is CRC2.

PN 074-550-P1E

CRC code examples can be found in section 4.4, CRC Examples, on page 4-34.

4 – 11SQC-310 Operating Manual

4.3 SQC-310 Commands
4.3.1 @ Command: Hello Message
NOTE: Some CRC values are non-printable characters. The examples below
display all CRC values as decimal values surrounded by parentheses.
Make sure to convert the decimal value in parentheses to the correct ASCII
value and to remove the parentheses.
Hello Message = <CommandID>
Response Message = <String/Value>
Table 4-2 Get/Set process parameters

Cmd ID

Description

Parameters@

Returns the model number and software
version number.

None

4.3.1.1 Hello Message Example
Command: !#@(79)(55)
Response: !8ASQC310D 2MB Ver 6.58(135)(124)orResponse: !8ASQC310C 2MB Ver 6.58(154)(131)4.3.2 A Commands: Get/Set Film Parameters
Get Film Command Message = <CommandID><Space><Film Number><?><Space><Parameter>

PN 074-550-P1E

Get Film Response Message= <A><Parameter><Comma><String|Value>{ additional param groups} .
Set Film Message = <CommandID><Space><Film Number><Space><Parameter><Comma><String|Value>
Set Film Response = <A>

4 – 12

SQC-310 Operating Manual

Table 4-3 Get/Set film parameters
Description

Parameters

A1

Sets/Gets the film name.

None

Film Name (16 character maximum)

A2

Sets/Gets the main film edit screen
parameters.

1
2
3
4
5
6
7
8
10
11

P TermI Term1
D Term1
Material #Pocket (0=Pocket 1)
Tooling
Crystal Quality, Rate Dev %Crystal Stability, Single Freq Shift2
Crystal Quality, Max Count
Crystal Stability, Total +Freq Shift2

A3

Sets/Gets the film conditioning
parameters.

1
2
3
4
5
6
7
8
9
10
11

Ramp1 Power1
Ramp1 Time (sec.)
Soak1 Time (sec.)
Ramp2 Power1
Ramp2 Time (sec.)
Soak2 Time (sec.)
Idle Power1
Idle Ramp (sec.)
Feed Power1
Feed Ramp (sec.)
Feed Time

A4

Sets/Gets the deposit controls
parameters.

1
2
3

6
7
8
9

Shutter Delay (sec.)
CaptureControl Error (0=Ignore, 1=Stop,
2=Hold)Control Percent
Rate Sampling (0=Continuous,
1=Accuracy, 2=TimeBased)
Sample Accuracy
Sample Hold
Sample Time
Control Delay

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16

Snsr 1 Crystal Fail Mode
Snsr 1 Crystal Position
Snsr 1 Backup Sensor
Snsr 2 BackupXtalPosition
Snsr 2 Crystal Fail Mode
Snsr 2 Crystal Position
Snsr 2 Backup Sensor
Snsr 2 BackupXtalPosition
Snsr 3 Crystal Fail Mode
Snsr 3 Crystal Position
Snsr 3 Backup Sensor
Snsr 3 BackupXtalPosition
Snsr 4 Crystal Fail Mode
Snsr 4 Crystal Position
Snsr 4 Backup Sensor
Snsr 4 BackupXtalPosition

4
5

A5

Sets/Gets the sensor controls
parameters.

1 Decimal point must be removed before sending the command. The response will not include the decimal point.
2

4 – 13

Values 25 to 9999 are acceptable. Sending a 0 disables this feature.

PN 074-550-P1E

Cmd IDSQC-310 Operating Manual

4.3.2.1 Get/Set Film Parameter Examples
Get the Film Name of Film Number 1:
Command: !'A1 1?(59)(75)
Response: !*A Film1(152)(62)
Set the Film name of Film Number 1 to Film1:
Command: !,A1 1 Film1(45)(134)
Response: !$A5(53)(151)
Get the PID parameters of Film Number 1:
Command: !-A2 1? 1 2 3(143)(117)
Response: !1A1,50 2,7 3,0 (83)(161)
Set the PID parameters of Film Number 1:
Command: !3A2 1 1,50 2,5 3,0(60)(96)
Response: !$A(53)(151)
Invalid parameters in an A command will not trigger an error response. A goodparameters before the invalid parameter will be in the response. The invalid
parameter, and every parameter that follows, will be excluded from the response.
For example, a command message of “A2 1? 1 X 3” will give the response
message “A1,50”, skipping parameters X and 3.

4.3.3 B Commands: Get/Set System Parameters
Get Command Message = <CommandID><?><Space> <Parameter>

PN 074-550-P1E

Get Response Message = <A><Parameter><Comma> <String|Value>
Set Command Message = <CommandID><Space><Parameter><Comma><String|Value>
Set Response Message= <A>

4 – 14

SQC-310 Operating Manual

Table 4-4 Get/Set system parameters
Cmd ID

Description

B

Gets/Sets the system parameters
screen values.

Parameters

20

Period (centiseconds)2
System Tooling
Simulate Mode
Min. Frequency (Hz)(1000000 to
6500000 in increments of 100000)
Max. Frequency (Hz)(1000000 to
6500000 in increments of 100000)
Alarm Sounds
Alert Sounds
Attention Sounds
Rate Dev. Graph Limit1
Password Enabled
Password (XXXX containing values of
1 to 7)
Rate Filter Alpha Value (sec.)1

BA

Switch the graphs/displays on the main 1
2
screen.
3
Message format changes to:4
BA[Space][Parameter]

Display Rate vs. Time Graph
Display Rate Deviation vs. Time Graph
Display Power vs. Time Graph
Display Large Format ScreenBB1
Turns the remote mode on or off.
Remote mode ignores all local user 2
input such as the pressing of buttons.
Message format changes to:
BB[Space][Parameter]

Turn Remote Mode: OFF
Turn Remote Mode: ON

1
2
5
6
7
14
15
16
17
18
19

1 Decimal point must be removed before sending the command. The response will not include thedecimal point.
2 The Period can only be 0.10, 0.15, 0.20, 0.25, 0.30, 0.40, 0.50, 0.75, or 1.00 second(s). All invalid

values round up to the next valid value. Excluding values greater than 1.00.

Get the Period and System Tooling:
Command: !(B? 1 2(65)(117)
Response: !/A1,25 2,100 (81)(73)
Set the Period and System Tooling:
Command: !.B 1,25 2,100(84)(133)
Response: !$A(53)(151)
Set the Display Rate vs. Time Graph:Command: !&BA 1(81)(35)
Response: !$A(53)(151)
Turn Remote Mode ON:
Command: !&BB 1(128)(160)
Response: !$A(53)(151)

4 – 15

PN 074-550-P1E

4.3.3.1 Get/Set System Parameter Examples

SQC-310 Operating Manual

4.3.4 C Commands: Get/Set Process Parameters
Get Command Message = <CommandID><Process Number><?><Space><Parameter>
Get Response Message = <A><Parameter><Comma><String|Value>
Set Command Message = <CommandID><Process Number><Space><Parameter> <Comma><String|Value>
Set Response Message = <A>
The number of Layer Positions is the number of layer sequences in a process. The
actual Layers is the total number of layers in the process. For example, a processwith one CoDep layer (using two films) would have Number Layers = 1 and Actual
Layers = 2.
Using the C command, the First Layer is the layer number of the first layer in theprocess. The next layer number in the process can be found by reading the Next
Layer parameter (see section 4.3.5). If Next Layer= -1, there is no next layer.
Table 4-5 Get/Set process parameters
Description

C

Gets/Sets the Process Name.

1

Process Name (16 characters)

C

Gets the process parameters.

2
3
4

Number of Layer PositionsFirst Layer Number in the process
Actual Layers

CA

Performs a process specificcommand.
Message format changes to:
CA[Process#]?[Space][Parameter]

1
2
3
4

Create a New Process
Delete a Process
Delete All Layers in this process
Check this Process (1 is process is OK)

CB

Performs a process & layer location 1
specific command.
Message format changes to:
CB[Process#][Space][LayerPosition#]?[Space][Parameter]

CC

Insert a NonCoDep layer in this process
Performs a process, layer location 1
2
Insert a CoDep layer in this process
and film specific command.
Message format changes to:
CC[Process#][Space][LayerPosition NOTE: Insert CoDep layer 2 parameter only valid for#][Space][Film#]?[Space][Parameter] CoDep capable unit. For 'D' non-codep unit, will
return a 2,0 code indicating insert did not work.

PN 074-550-P1E

Cmd ID

Parameters

Cut this layer from this process

4 – 16

SQC-310 Operating Manual

4.3.4.1 Get/Set Process Parameter Examples
Get Process 1 name:Command: !'C1? 1(58)(90)
Response: !4AProcess1(90)(42)

Set Process 1 name:Command: !.C1 1,AnyName(135)(34)
Response: !$A(53)(151)
Create a new process:Command: !(CA1? 1(115)(124)
Response: !(A1,1 (58)(116)
Cut a layer from a process:Command: !*CB1 2? 1(151)(79)
Response: !(A1,1 (58)(116)
Insert a NonCodepositon layer into a process:Command: !,CC1 2 1? 1(84)(159)
Response: !(A1,1 (58)(116)
An A1,1 means the command was successful.
An A1,0 means the command failed.

4.3.5 D Commands and E Command: Get/Set Layer Parameters
Get Response = <A><Parameter><Comma><String|Value>
Set Command = <CommandID><Layer Number><Space><Parameter><Comma><String|Value>
Set Response = <A>

4 – 17

PN 074-550-P1E

Get Command = <CommandID><Layer Number><?><Space><Parameter>

SQC-310 Operating Manual

Table 4-6 Get/Set layer parameters
Cmd ID

Description

Parameters

Gets/Sets the layer parameters for a layer Same as DA Commands
number. Layer number is not the layer
position number.
NOTE: The DA command is therecommended command to Get/Set layer
parameters

DA

Gets/Sets the parameters for a given layer 1
as specified by the given process, layer in 2
the process, and the assigned source. 3
Message format changes to:
4
DA[Process#][Space][LayerPosition#] 5[Space][Source#]?[Parameter]
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33

Init Rate1
Final Thickness1
Time Setpoint (sec.)
Thickness Limit
Start Mode
Source Output Number
Max. Power1
Slew Rate1
Sensor 1
Sensor 2
Sensor 3
Sensor 4
Ramp1 EnableRamp1 Start (thickness)1
Ramp1 Rate1
Ramp1 Time (sec.)
Ramp2 Enable
Ramp2 Start (thickness)1
Ramp2 Rate1
Ramp2 Time (sec.)
Film Number
Next Layer Number
Next Codep Layer Number
Layer Available
Min. Power1
Power Alarm Dev. (sec.)
Rate Dev. Attention
Rate Dev. Alert
Rate Dev. Alarm
Ramp 2 Enable
Ramp 3 Start (thickness)1
Ramp 3 Rate1
Ramp 3 Time (sec.)

DB

Gets the layer that is currently running or
set to run next if not currently running alayer.
Message format changes to:
DB?[Space][Parameter]

Current layer - Layer number
Current layer - NonCoDep Position
Current layer - NonCoDep
Position(s) with Source Number
Current layer - CoDep Positions

E

Deletes all 1000 layers. Most often used to None
clear SQC-310 in preparation for
downloading a new list.

PN 074-550-P1E

D

1
2
3
4

1 Decimal point must be removed before sending the command. The response will not include thedecimal point.

4 – 18SQC-310 Operating Manual

4.3.5.1 Get/Set Layer Parameter Examples
NOTE: The recommended command to Get/Set layer parameters is the DA
command. The D command relies on the layer number, which may not besequential in a process. The DA command Gets/Sets layer parameters forthe layer in a unique process, position, and source.
Get Process 1, Layer 1, Source 1 initial rate and final thickness:
Command: !.DA1 1 1? 1 2(90)(89)
Response: !,A1,0 2,0 (86)(133)
Get layer status information:
Command: !-DB? 1 2 3 4(40)(67)
Response: !FA1,4:4:4 2,1 3,1.1:1.1:1.1 4,1:1:1 (154)(60)
Delete all layers:
Command: !#E(143)(54)

PN 074-550-P1E

Response: !$A(53)(151)

4 – 19SQC-310 Operating Manual

4.3.6 F Command: Get/Set Material Parameters
Only one material may be Get/Set at a time.
Get Command = <CommandID><Material Number><?><Space><Parameter>
Get Response = <A><String|Value>
Set Command = <CommandID><Material Number><Space><Parameter><Comma><String|Value>
Set Response = <A>
Table 4-7 Get/Set material parameters
Cmd ID

Description

F

Gets/Sets the parameters of the
100 stored materials.

Parameters
12
3

Material Name (16 character maximum)
Density1
Z-Factor (Z-Ratio)1

1 Decimal point must be removed before sending the command. The response will not include thedecimal point.

4.3.6.1 Get/Set Material Parameter Examples
Get Material 1 name:Command: !'F1? 1(135)(105)
Response: !,AAluminum(57)(152)
Set Material 1 name:Command: !/F1 1,Aluminum(99)(39)

PN 074-550-P1E

Response: !$A(53)(151)

4 – 20SQC-310 Operating Manual

4.3.7 G Commands: Get/Set Input and Relay Parameters
Get Command = <CommandID><Input#|Relay#><?><Space> <Parameter>
Get Response = <A><Parameter><Comma> <String|Value>
Set Command = <CommandID><Input#|Relay#><Space><Parameter><Comma> <String|Value>
Set Response = <A>
Table 4-8 Get/Set input and relay parameters
Description

GA

Gets/Sets the parameters of each of 1
2
the 8 or 16 digital inputs.
3
When changing the name(parameter 1), the Name Mode4command (parameter 5) must be set to 5
1 as the next parameter.

Name (16 character maximum)1
Active Level (0= Low, 1= High)Pin Number
Input in Use (get only)(1=True, 0=False)
Name Mode (0= Default, 1= User)

GB

Gets/Sets the parameters of each of 1
2
the 8 or 16 digital relays.
3
When changing the name4(parameter 1), the Name Modecommand (parameter 5) must be sent 5
to 1 as the next parameter.
6
7

Name
Type (0=N.O, 1=N.C)
Pulses (0 to 2)
Pulse Width (ms)2
Pin Number
Relay in Use (get only)(1=True, 0= False)
Name Mode (0= Default, 1= User)

GC

Gets the current state of each of the 8 1
2
or 16 digital inputs and/or relays.

Current Relay State (off=0, on=1)
Current Input State (off=0, on=1)

GD

Permanently override the relay state 1
for one of the 8 or 16 digital relays. 2
Overriding the relay is only available
while in the stopped state. The
override is removed at the start of aprocess.
Message format changes to:
GD[Relay#][Space][Parameter]

Override Relay: Turn On
Override Relay: Turn Off

GE

1
Allows an unused relay to be set
remotely. Relays set remotely aren't
effected by logic statement actions, 2sensors, sources, or the GD
command. Be sure to unlock the relay 3
after it is no longer needed, doing so
will also turn the relay off.
Message format changes to:
GE[Relay#][Space][Parameter]

Turn Relay On (locks Relay for remoteuse only)
Turn Relay Off (locks Relay for remoteuse only)
Unlock Relay (Releases the relay back to
SQC-310 control)

1

Do not exceed 16 characters for the name. Doing so may yield negative results.

2 Values from 500 to 3000 in increments of 100.

4 – 21

Parameters

PN 074-550-P1E

Cmd IDSQC-310 Operating Manual

4.3.7.1 Get/Set Input and Relay Parameter Examples
Get the active level and pin number for input 1:
Command: !*GA1? 2 3(112)(143)
Response: !,A2,0 3,1 (90)(108)
Get the type and pin number for relay 1:
Command: !*GB1? 2 5(121)(129)
Response: !,A2,0 5,1 (105)(135)
Get the current input 1and relay 1 state:
Command: !)GC1?1 2(58)(97)
Response: !(A2,0 (58)(124)Override relay 1:
Command: !'GD1 1(107)(46)
Response: !$A(53)(151)
Lock relay 1 in the on position:
Command: !'GE1 1(132)(99)
Response: !$A(53)(151)

PN 074-550-P1E

Once locked in either the on or off position, the relay can only be controlled using
remote communications.

4 – 22

SQC-310 Operating Manual

4.3.8 H Commands: Get/Set Sensor and Source Parameters
Get Command = <CommandID><Sensor|Source><?><Space><Parameter>
Get Response = <A><String|Value>
Set Command = <CommandID><Sensor|Source><Space><Parameter><Comma><String|Value>
Set Response = <A>
Table 4-9 Get/Set sensor and source parameters

HA

Description
Gets/Sets the parameters of eachof the 2 or 4 sensors.

Parameters
1
2
3
4
5
6
7
8
9

HB

Gets/Sets the parameters of eachof the 2 or 4 sources.

1
2
3
4
5
6
7
8
9

HC

4 – 23

Gets the status flags for each of the 12
2 or 4 sensors.
3
4
5
6
7
8
9

Crystal ToolingNumber of Positions
Shutter (0=No, 1=Dual, 2=Yes)
Shutter Delay (ms)(0 to 9900 in incrementsof 100)Control Type (0=Manual, 1=Direct,
2=BCD, 4=Individual)
Drive Type (0=Up, 1=Down, 2=Fast,
3=Inline, 4=Single Step, 5=Double Step)
Feedback Type (0=None, 1=Individual,
2=BCD, 3=Single Home, 5=In Position)
Indexer Delay (sec.)
Current Crystal Position
Voltage Scale1
Number of Positions
Shutter (0=No, 2=Yes)
Shutter Delay (ms)(0 to 9900 in incrementsof 100)Control Type (0=Manual, 1=Direct,
2=BCD, 4=Individual)
Drive Type (0=Up, 1=Down, 2=Fast,
3=Inline, 4=Single Step, 5=Double Step)
Feedback Type (0=None, 1=Individual,
2=BCD, 3=Single Home, 4=In Position)
Indexer Delay (sec.)
Current Pocket Position
Dual crystal has switched
Backup crystal switch has begun
Backup crystal switch is done
Sensor is disabled
Original crystal has failed
Sensor is currently in use
Next crystal move complete
Sensor initiated time power
Sensor initiate halted

PN 074-550-P1E

Cmd IDSQC-310 Operating Manual

Table 4-9 Get/Set sensor and source parameters (continued)
Cmd ID

Description

Parameters

HD

Gets the status flags for each of the 1
2 or 4 sources.

Source is currently in use(0= not in use, 1= in use)HE

Gets/Sets the I/O mappings of each 1
2of the 2 or 4 sensors.

Input Map
Relay Map

HF

Gets/Sets the I/O mappings of each 1
2of the 2 or 4 sources.

Input Map
Relay Map

1 Decimal point must be removed before sending the command. The response will not include thedecimal point.

4.3.8.1 Get/Set Sensor and Source Parameter Examples
Get sensor 1 number of positions, control type, and current crystal position:
Command: !,HA1? 2 5 9(153)(140)
Response: !0A2,1 5,1 9,1 (67)(113)
Get source 1 number of positions, control type, and current pocket position:
Command: !,HB1? 2 5 9(77)(83)
Response: !0A2,1 5,3 9,1 (142)(52)
Get status flags (original crystal fail and in use) for sensor 1:
Command: !*HC1? 5 6(50)(112)
Response: !,A5,0 6,0 (101)(149)
Get status flags (in use) for source 1:

PN 074-550-P1E

Command: !(HD1? 1(86)(130)
Response: !(A1,1 (58)(116)
Get I/O mapping of sensor 1:
Command: !*HE1? 1 2(63)(37)
Response:!hA1,0:0:0:0:0:0:0:0:0:0:0:0:0:0:0:0 2,0:0:0:0:0:0:0:0:0:0:0:0:0:0:0:0 (91)(147)
Get I/O mapping of source 1:
Command: !*HF1? 1 2(38)(82)
Response:!iA1,0:0:0:0:0:0:0:0:0:0:0:0:0:0:0:0 2,21:1:0:0:0:0:0:0:0:0:0:0:0:0:0:0 (155)(98)

4 – 24

SQC-310 Operating Manual

4.3.9 I Commands: Get/Set Logic Statement Parameters
Get Command = <CommandID><Logic Statement#><?><Space> <Parameter>
Get Response = <A><String|Value>
Set Command = <CommandID><Logic Statement#><Space><Parameter><Comma><String|Value>
Set Response = <A>
Table 4-10 Get/Set logic statement parameters
Cmd ID

Description

I

Gets/Sets the parameters of each 1
2of the 32 logic statements.
3
4
5
6

IA

Copy and Pastes a Logic Statement Nonefrom one index to another.
Message format changes to:
IA[Space][Statement# toCopy][Space][Statement# to Paste]

IB

Parameters

Deletes a Logic Statement.
Message format changes to:
IB[Statement# to Delete]

Name (16 characters)
If Conditions (up to 16 conditions)
Then Action
If Condition Syntax Valid (get only)
If Condition Current State (get only)
LS Defined (0= not defined, 1= defined)

None

4.3.9.1 Get/Set Logic Statement Parameter Examples
Get Statement 1 name, If condition, and Then action:

Response: !?A1,<Empty>

2,0 3,0 (161)(135)Set Statement 1 name, If condition, and Then action:
Command: !II1 1,LS_1

2,202:3:201 3,302(59)(155)

Response: !$A(53)(151)
Copy and paste a logic statement:
Command: !(IA 1 5(83)(100)Response: !$A(53)(151)
Delete a logic statement:
Command: !%IB1(40)(93)
Response: !$A(53)(151)

4 – 25

PN 074-550-P1E

Command: !+I1? 1 2 3(43)(78)

SQC-310 Operating Manual

4.3.10 J Command: Get Num Channels
Get Command Message = <CommandID>
Get Response Message = <A><String|Value>
Table 4-11 Get Num channels parameters
Cmd IDJ

Description

Parameters

Returns the number sensor/output None
channels installed.

4.3.10.1 Get Num Channels Examples
Get the number of sensors/sources:
Command: !#J(79)(56)
Response: !%A4(119)(61)
4 sensors/sources channels are installed.

4.3.11 K Command: Get Readings
Get Command Message = <CommandID><Parameter>
Get Response Message = <A><String|Value>

PN 074-550-P1E

Table 4-12 Get readings parameters
Cmd ID

Description

K

Returns the phase time and sensor 1
or output readings for all installed 2channels.

K3

Same as K2 but will respond with Nonean error if there are no new sensor
readings since the last time thecommand was sent. Used primarily
for the testing SQC-310.

Parameters
Output Readings
Sensor Readings

4 – 26

SQC-310 Operating Manual

4.3.11.1 Get Readings Examples
Get Output readings:
Command: !$K1(93)(49)
Response: !cA0.00 0.00 100.00 0.000 0.00 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1 -1(44)(90)
The return string is of the form: Time, Rate 1, Deviation 1, Thickness 1, Power 1,
Rate 2, Deviation 2, Thickness 2, etc.
Get Sensor readings:
Command: !$K2(157)(49)
Response: ! 80A0.00 0.00 0.000 5950000.00 0.00 0.000 5950000.00 0.00 0.000
5950000.00 0.00 0.000 5950000.00(80)(85)
The return string is of the form: Time, Rate 1, Thickness 1, Frequency 1, Rate 2,
Thickness 2, etc.

4.3.12 L Command: Get Sensor Rate
Get Command Message = <CommandID><Sensor Number>
Get Response Message = <A><String|Value>
Table 4-13 Get sensor rate parameters
Cmd IDL

Description

Parameters

Returns the sensor rate for the Sensor Number (1 to 4)
requested sensor. Uses the density
and z-ratio of the last material used
if no active layer is currently
assigned.

PN 074-550-P1E

4.3.12.1 Get Sensor Rate Example
Get sensor 1 rate:
Command: !$L1(102)(50)
Response: !)A 0.00(87)(100)4.3.13 M Command: Get Output Rate
Get Command Message = <CommandID><Output Number>
Get Response Message = <A><String|Value>
Table 4-14 Get output rate parameters
Cmd IDM

4 – 27

Description

Parameters

Output Number (1 to 4)
Returns the average rate of all
sensors assigned to the requested
output.

SQC-310 Operating Manual

4.3.13.1 Get Output Rate Example
Get output 1 rate:
Command: !$M1(92)(113)
Response: !)A 0.00(87)(100)4.3.14 N Command: Get Sensor Thickness
Get Command Message = <CommandID><Sensor Number>
Get Response Message = <A><String|Value>
Table 4-15 Get sensor thickness parameters
Cmd IDN

Description

Parameters

Returns the thickness reading for the Sensor Number (1 to 4)
requested sensor. Uses the density
and z-ratio of the last material used if
no active layer is currently assigned.

4.3.14.1 Get Sensor Thickness Example
Get Sensor 1 thickness:
Command: !$N1(93)(81)
Response: !*A 0.000(90)(92)

4.3.15 O Command: Get Output Thickness
Command Message = <CommandID><Output Number>
Response Message = <A><String|Value>
PN 074-550-P1E

Table 4-16 Get output thickness parameters
Cmd ID

Description

O

Returns the average thickness of all
sensors assigned to the requested
output.

Parameters
Output Number (1 to 4)

4.3.15.1 Get Output Thickness Example
Get Output 1 thickness:
Command: !$O1(103)(146)
Response: !*A 0.000(90)(92)

4 – 28SQC-310 Operating Manual

4.3.16 P Commands: Get Sensor Frequency/Crystal Life
Get Command Message = <CommandID><Sensor Number>
Get Response Message = <A><String|Value>
Table 4-17 Get sensor frequency/crystal life parameters
Cmd ID

Description

P

Returns the frequency of therequested sensor.

PA

Parameters
Sensor Number (1 to 4)

Returns the status, frequency, and Sensor Number (1 to 4)
crystal life of the requested sensor.

4.3.16.1 Get Sensor Frequency/Crystal Life Example
Get Sensor 1 frequency:
Command: !$P1(90)(145)
Response: !.A5950000.00(93)(84)
Get Sensor 1 information:
Command: !%PA1(74)(147)
Response: !6A0 5950000.00 95.00(70)(99)
The return string is of the form: Status (where status 0=inactive, 1=active),
Frequency, and Crystal Life4.3.17 Q Command: Get Output Deviation
Get Command Message = <CommandID><Output Number>Table 4-18 Get output deviation parameters
Cmd ID

Description

Q

Returns the % deviation of therequested output.

4.3.17.1 Get Output Deviation Example
Get Output 1 deviation:
Command: !$Q1(104)(82)
Response: !+A100.00(67)(127)

4 – 29Parameters
Output Number (1 to 4)

PN 074-550-P1E

Get Response Message = <A><String|Value>SQC-310 Operating Manual

4.3.18 S Command: Get/Set Output Power
Get Command Message = <CommandID><?><Space><Output Number>
Get Response Message = <A><String|Value>
Set Command Message = <CommandID><Output Number><Space><String|Value>
Set Response Message = <A>
Table 4-19 Get/Set output power parameters
Cmd ID

Description

S

Gets the output power for output 1 0
to 4. Sets outputs to PID loop mode 1
2(parameter 0). Sets to Manualmode (parameters 1 to 4) and sets 3
the output power for the specified 4
output. All other outputs lock into
their last used PID loop power
when set to Manual mode.

Parameters
PID loop mode all outputs(set only)
Output 11
Output 21
Output 31
Output 41

1 Decimal point must be dropped before sending the command. The response will not include thedecimal point.

4.3.18.1 Get/Set Output Power Examples
Get Output 2 power:
Command: !&S? 2(48)(135))
Response: !)A0.00 (97)(136)
Set Manual mode and set Output 2 to 50.0% of full scale:

PN 074-550-P1E

Command: !(S2 500(54)(63)
Response: !$A(53)(151)This command places other outputs in Manual mode at their current power as well.
Set PID loop mode:
Command: !$S0(154)(146)
Response: !$A(53)(151)

4 – 30SQC-310 Operating Manual

4.3.19 T Command: Set Active Process
Set Command Message = <CommandID><Process Number>
Get Response Message = <A><String|Value>
Table 4-20 Set active process parameters
Cmd ID
T

Description

Parameters

Gets/sets the currently selected Process Number (1 to 100)
process. If a process is running, it is
not changed and a D response
status is returned.

4.3.19.1 Set Active Process Example
Set the active process to Process 1:
Command: !$T1(104)(50)
Response: !$A(53)(151)

4.3.20 U Commands: Set Run State
Set Command Message = <CommandID><Parameter>
Set Response Message = <A>
Table 4-21 Set run state parameters
Description

U

Sets SQC-310 operating state

4.3.20.1 Set Run State Example
Start the Active process:Command: !$U0(155)(82)
Response: !$A(53)(151)

4 – 31

Parameters
0
1
2
3
4
5
32
33
38
39

Start Process
Stop/Reset Process
Start Layer
Stop Layer
Next Layer
Force Final Thickness
Zero Thickness
Zero Time
Soak Hold Enable
Soak Hold Disable

PN 074-550-P1E

Cmd IDSQC-310 Operating Manual

4.3.21 V Commands: Get Run State
Get Command Message = <CommandID><?><Parameter>
Get Response Message = <A><Parameter><Comma><String|Value>
Table 4-22 Get run state parameters
Description

V

Returns the Phase #, Process
Elapsed Time in seconds(displayed on SQC-310 main
screen as H:MM:SS), Process #,Active Layer number of the active
process, and Manual/Automatic
control (0=Manual, 1=Automatic).

Phase #
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
16
17
18
19
20
21
22
24
25
26
27
28

Stopped
Crystal Verify
Initialize Layer
Manual Start Layer
Crystal Rotate
Pocket Rotate
PreCond (CoDep only)
Ramp 1
Soak 1
Ramp 2
Soak 2
Soak Hold
Shutter Delay
Deposit
Rate Ramp
Timed Power
Rate Sample Thermal Delay
Rate Sample
Crystal Switch
Feed Ramp
Feed Soak
Idle Ramp
Crystal Fail
Stop Layer
Manual Power
Snsr Feedback Timeout
Src Feedback Timeout

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Cmd ID

4 – 32

SQC-310 Operating Manual

Table 4-22 Get run state parameters (continued)
Cmd ID

Description

VA

Gets the on/off status of eachpossible alarm (0=Off, 1=On).

Phase #
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27

Alarm: Min. Rate and Max. Power
Alarm: Max. Rate and Min. Power
Alarm: Shutter Delay Error
Alarm: Crystal Failure
Alarm: Source Timeout
Alarm: Sensor Timeout
Alarm: No Sensors Enabled
Alarm: In Time Power
Alarm: Rate Deviation
Alarm: Invalid Pocket
Alarm: Invalid Crystal
Alarm: Logic Statement Action
Alert: Rate Deviation
Alert: Max. Power
Alert: Rate Deviation
Alert: Max. Power
Alert: Min. Power
Alert: Logic Statement Action
Attention: Crystal Failure
Attention: Crystal Failed and Switched
Attention: Rate Deviation
Attention: Max. Power
Attention: Min. Power
Attention: Manually Move Source toPosition
Attention: Manually Move Sensor to
Position
Attention: Interlock via Logic Statement
ActionAttention: Logic Statement Action

Get Run State:
Command: !#V(78)(142)
Response: !-A0 0 1 1 1(95)(138)
The return string for the Deposit Phase, Elapsed Time =15 seconds, Active
Process #1, Layer #2, Automatic Control is: 13 15 1 2 1
Get Alarm/Alert/Attention State:
Command: !+VA? 1 2 3(79)(145)
Response: !0A1,0 2,0 3,0 (130)(77)

4 – 33

PN 074-550-P1E

4.3.21.1 Get Run State Examples

SQC-310 Operating Manual

4.3.22 XSTART / XSTOP Command: Download/Upload Session
Command Message = <CommandID>
Response Message = <A>
The recommended command instead of XSTART or XSTOP is BB1 or BB2
respectively.
Table 4-23 Start/Stop download/upload session parameters
Cmd ID

Description

XSTART

Starts a upload/download session Noneand places in SQC-310 in remotemode. Prevents the CA, CB, CC,
and U commands from being
accepted by SQC-310 (error E).
SQC-310 must be Stopped in orderto start an upload/download
session.

XSTOP

Stops an upload/download session Noneand exits remote mode.

Parameters

4.3.22.1 Start/Stop Download/Upload Session Example
Start a download/upload session:Command: !(XSTART(127)(46)
Response: !$A(53)(151)
Stop a download/upload session:Command: !’XSTOP(35)(38)

PN 074-550-P1E

Response: !$A(53)(151)

4.4 CRC Examples
This section includes examples of code for calculating the CRC in Visual Basic,
Java, and C++. Instructions for calculating the CRC are located in section 4.2.3 on
page 4-11.

4 – 34

SQC-310 Operating Manual

4.4.1 Visual Basic® 5/6
Public Sub CalcChkSumByte(ByRef ByData() As Byte, ByRef byCRC() As Byte)
Dim CRC As Integer
Dim TmpCRC As Integer
Dim LastIndex As Long
Dim i As Integer
Dim j As Integer' Avoid on length messages
If ByData(1) > 0 Then
' Set 14 bit CRC to all ones
CRC = &H3FFF
For j = 1 To LastIndex - 2' XOR current character with CRC
CRC = CRC Xor ByData(j)' Go thru lower 8 bits of CRC
For i = 1 To 8
' Save CRC before shift
TmpCRC = CRC' Shift right one bit
CRC = Shri(CRC, 1)
If (TmpCRC And 1) = 1 Then
' If LSB is 0 (before shift), XOR with hex 2001
CRC = CRC Xor &H2001
End IfNext iNext j' Be sure we still have 14 bits
CRC = CRC And &H3FFF
byCRC(0) = (LoByte(CRC) And &H7F) + 34
byCRC(1) = (LoByte(Shri(CRC, 7)) And &H7F) + 34
Else
' Empty message
byCRC(0) = 0
byCRC(1) = 0
End IfEnd Sub
Public Function LoByte(ByVal intNumber As Integer) As Byte
' Comments : Returns the low byte of the passed integer' Parameters: intNumber - integer value for which to return the low byte
' Returns : byte
' Source : Total VB SourceBook 6

4 – 35

PN 074-550-P1E

LastIndex = UBound(ByData())

SQC-310 Operating Manual'
On Error GoTo PROC_ERR
LoByte = intNumber And &HFF&
PROC_EXIT:
Exit Function
PROC_ERR:
MsgBox "Error: " & Err.Number & ". " & Err.Description, , _"LoByte"Resume PROC_EXITEnd Function
Public Function Shri( _ByVal lngValue As Long, _ByVal bytPlaces As Byte) _As Integer' Comments : Shifts a long Value right the selected number of places' Parameters: lngValue - integer Value to shift'
bytPlaces - number of places to shift' Returns : Shifted value' Source : Total VB SourceBook 6'
Dim lngDivisor As LongPN 074-550-P1E

On Error GoTo PROC_ERR' if we are shifting 16 or more bits, then the result is always zero
If bytPlaces >= 16 Then
Shri = 0
Else
lngDivisor = 2 ^ bytPlaces
Shri = Int(IntToLong(lngValue) / lngDivisor)
End If
PROC_EXIT:
Exit Function
PROC_ERR:
MsgBox "Error: " & Err.Number & ". " & Err.Description, , _"Shri"
Resume PROC_EXITEnd Function

4 – 36

SQC-310 Operating Manual

4.4.2 Java®
private short calcCRC(byte[] str) {short crc = 0;
short tmpCRC;
int length = 1 + str[1] - 34;
if (length > 0) {crc = (short) 0x3fff;
for (int jx = 1; jx <= length; jx++) {crc = (short) (crc ^ (short) str[jx]);for (int ix = 0; ix < 8; ix++) {tmpCRC = crc;
crc = (short) (crc >> 1);
if ((tmpCRC & 0x1) == 1) {crc = (short) (crc ^ 0x2001);}}
crc = (short) (crc & 0x3fff);}}
return crc;}

private byte crcLow(short crc) {byte val = (byte) ((crc & 0x7f) + 34);
return val;}

4 – 37

PN 074-550-P1E

private byte crcHigh(short crc) {byte val = (byte) (((crc >> 7) & 0x7f) + 34);
return val;}

SQC-310 Operating Manual

4.4.3 C++class CRC14{
public:
CRC14(void) { crc = 0x0;};
public:short crc;
public:short calcCRC( unsigned char * str){
int length = (str != NULL) ? 1 + str[1] - 34 : 0;if (length > 0) {crc = (short) 0x3fff;
for (int jx = 1; jx <= length; jx++) {crc = (short) (crc ^ (short) str[jx]);for (int ix = 0; ix < 8; ix++) {short tmpCRC = crc;
crc = (short) (crc >> 1);
if ((tmpCRC & 0x1) == 1) {crc = (short) (crc ^ 0x2001);}}
crc = (short) (crc & 0x3fff);

PN 074-550-P1E}}
return crc;}
unsigned char crc2() {unsigned char val = (unsigned char) (((crc >> 7) & 0x7f) + 34);
return val;}
unsigned char crc1() {unsigned char val = (unsigned char) ((crc & 0x7f) + 34);
return val;}};

4 – 38SQC-310 Operating Manual

Chapter 5
SQC-310 Comm Software
5.1 Introduction
SQC-310 Comm software provides real-time control and process data logging. It
also allows process, layer, film, and material parameters to be programmed anddownloaded to SQC-310 or saved as a *.mdb file.
SQC-310 controllers with firmware Version 5.01 and earlier are not compatible with
SQC-310 Comm software. For these older units, use SQC-300 Comm software(Version 4.xx). This manual may not be compatible with older software versions.
Contact INFICON for more information (refer to section 1.3 on page 1-5).
SQC-310 Comm software offers the ability to:Operate the process remotely.

Display SQC-310 readings in both numerical and graphical format.

Data log and store SQC-310 readings to a text file on a drive.



Create and store an unlimited number of processes, layers, and films.

Download and upload configuration files to SQC-310.

Refer to Chapter 4, Communications for information on connecting to SQC-310
and to view communications commands.

5.2 Installation
1 Insert the Thin Film Instrument and Sensor Manuals CD (PN 074-5000-G1).
NOTE: If installation does not start automatically, click Start, then Run, then type<d>:UtilityDisk (where <d> is the drive in use). The Program Disk menu
should appear. On the Program Disk menu, click SQC310 and SQC310C
Deposition Controller, then click SQC-310 Comm Software. Follow thedirections given.

2 When installation is complete, restart the computer (if prompted to do so).
3 To start SQC-310 Comm software, click the SQC-310 Comm desktop icon, or
click Start >> Programs >> INFICON, then SQC-310 Comm. The SQC-310
Comm software Main window will be displayed.

5–1

PN 074-550-P1E

To install SQC-310 Comm software:

SQC-310 Operating Manual

5.3 Main Window
Figure 5-1 SQC-310 Comm Main window

The Main window allows for operation and displays live readings and process
information. Its appearance and uses are identical to that of the Main screen on
SQC-310.

PN 074-550-P1E

On SQC-310 Comm software startup, it may take a few seconds to display theMain window and read SQC-310 setup information. Once the setup information isread, the screen will change to match the current setup on SQC-310.
If the Communications Setup window is displayed, no SQC-310 was found on the
expected communications port. Follow the instructions in Chapter 4,
Communications to establish communications. The top tool bar and SQC-310
firmware version number are only visible if communications has been establishedwith a connected SQC-310. Otherwise, an SQC-310 Offline status message isdisplayed in the window title bar.
The Main window menus allow for the configuration of the SQC-310 Commsoftware and the connected SQC-310. Some menu selections are not available
during data acquisition or if SQC-310 communications are not established. The
Main window control functions are listed below.
Run Process . . . . . . . . . . . . . . . . . . Selects the active process on SQC-310.
Defaults on SQC-310 Comm software
startup to the first SQC-310 process.
Layer . . . . . . . . . . . . . . . . . . . . . . . . Displays the active layer and total number oflayers in the active process.

5–2

SQC-310 Operating Manual

Phase. . . . . . . . . . . . . . . . . . . . . . . . Displays the phase of the process that iscurrently running. A typical sequence ofphases is: Ramp 1, Soak 1, Ramp 2,Soak 2,
Shutter Delay, Deposit, and Idle power.
Time . . . . . . . . . . . . . . . . . . . . . . . . . Displays the elapsed time since the process
was started.
Start/Reset Process . . . . . . . . . . . . Start/Stop the active process. Graphing anddata logging will begin/end when this button
is clicked. This button will also reset theprocess time.
Start/Stop Layer . . . . . . . . . . . . . . . Start/Stop the active layer. Graphing anddata logging will begin/end when this button
is clicked. This button will also reset theprocess time.
Next Layer . . . . . . . . . . . . . . . . . . . . .Moves to the next layer of the process. If thecurrent layer is the last layer, wraps to layer 1.
Start Man Layer . . . . . . . . . . . . . . . Manually starts the active layer.
Zero Thickness. . . . . . . . . . . . . . . . Zeroes the average and sensor thickness
reading on SQC-310.

Graph. . . . . . . . . . . . . . . . . . . . . . . . Displays readings from SQC-310. A graph of
the average rate, rate deviation, or output
power can be selected on the Main screen
View menu.
Below the graph are readings from each of the SQC-310 deposition control loops.
The readings are arranged by outputs. If multiple sensors are assigned to a single
output, the readings will be the average of the assigned sensors.
Rate . . . . . . . . . . . . . . . . . . . . . . . . . The current rate of deposition (Å/s), based on
the average of all sensors assigned to the
output.
Deviation . . . . . . . . . . . . . . . . . . . . . The deviation of the output rate from the rate
setpoint (%).

5–3

PN 074-550-P1E

Auto->Manual . . . . . . . . . . . . . . . . . Allows for the power outputs to be controlled
manually or automatically using a PID loop.
Can be set before the Start button is pressedor during the process. A slider bar will appear
next to each output and the power can be
adjusted for any active outputs. The
maximum power setting will determine themaximum range of the scale for the sliderbar.

SQC-310 Operating Manual

Thickness . . . . . . . . . . . . . . . . . . . . The current film thickness, based on the
average of all sensors assigned to the
output (kÅ).
Power. . . . . . . . . . . . . . . . . . . . . . . . The current film thickness, based on the
average of all sensors assigned to the
output (%).

5.4 Data Log Menu
On the Main window toolbar, click File >> Data Log to display the Data Log menu
which configures the data logging functions (see Figure 5-2).
Figure 5-2 Data log menu

Data is saved in a comma delimited format for easy viewing or importing into a
spreadsheet. For example:
Start: Date: 6/27/2014 Time: 8:32:27
Time,Phase,Out1Rate,Out1Dev,Out1Thk.....Sens1Rate,Sens1Thk,Sens1Freq.....
0.1, Shutter Delay, 0.00,100.0,0.000.....Sensors:, 0.00,0.000,5950000.000.....

PN 074-550-P1E

0.5, Deposit, 0.00,100.0,0.000.....Sensors:, 0.00,0.000,5950000.000.....
0.8, Deposit, 0.00,-100.0,0.000.....Sensors:, 0.00,0.000,5950000.000.....
1.4, Deposit, 0.00,-100.0,0.000.....Sensors:, 0.00,0.000,5950000.000.....
2.0, Deposit, 0.00,-100.0,0.000.....Sensors:, 0.00,0.000,5950000.000.....
2.7, Deposit, 0.00,-100.0,0.000.....Sensors:, 0.00,0.000,5950000.000.....
3.3, Deposit, 0.00,-100.0,0.000.....Sensors:, 0.00,0.000,5950000.000.....
3.9, Deposit, 0.00,-100.0,0.000.....Sensors:, 0.00,0.000,5950000.000.....
4.5, Deposit, 0.00,-100.0,0.000.....Sensors:, 0.00,0.000,5950000.000.....
5.2, Deposit, 0.00,-100.0,0.000.....Sensors:, 0.00,0.000,5950000.000.....
End:

Date: 6/27/2014 Time: 8:32:32

5–4

SQC-310 Operating ManualControls on the Data Log window are:None . . . . . . . . . . . . . . . . . . . . . . . . Data is not logged.
Overwrite. . . . . . . . . . . . . . . . . . . . . The log file will be overwritten each time data
logging is started with the Start Process orStart Layer button on the Main window.
Append . . . . . . . . . . . . . . . . . . . . . . Data is added to the end of the log file eachtime data logging is started with the Start
Process or Start Layer button on the Main
window.
New . . . . . . . . . . . . . . . . . . . . . . . . . Displays a file open dialog box, to allow
selection or creation of a new log file.
View . . . . . . . . . . . . . . . . . . . . . . . . . Displays the current log file using the default
Windows text file viewer.
Start Time . . . . . . . . . . . . . . . . . . . . The elapsed time when data logging begins.
The right value is seconds and the left value
is minutes.
End Time . . . . . . . . . . . . . . . . . . . . . The elapsed time when data logging ends.
The right value is seconds and the left value
is minutes.
Log Interval. . . . . . . . . . . . . . . . . . . The elapsed time between data log entries,
in seconds. Data will be logged as quickly as
possible when an interval value of zero isentered. This time will vary with system
configuration.

1 Select the desired process/layer from the list of SQC-310 processes/layers.
2 Press Zero to zero the thickness reading (optional).
3 With the log file option set to append or overwrite, Press Start Process or Start
Layer to start data acquisition.

5–5

PN 074-550-P1E

Once communications have been established, follow these steps to start dataacquisition:

SQC-310 Operating Manual

5.5 Instrument Window
The Instrument window is used to edit processes, films, materials, and other
SQC-310 setup data. In the Main window toolbar, click Edit >> Instrument... todisplay the Instrument window. When Edit >> Instrument is selected in the Main
window toolbar, the configuration from SQC-310 is downloaded if communications
have been successfully established (refer to Chapter 4, Communications). The
Read Instrument window will be displayed with a status bar for the upload progress.
Figure 5-3 Read Instrument window

Once the configuration is loaded or an existing database is opened, the Instrument
window will be displayed and the name of the configuration will replace [Instrument
Upload] in the window title bar.

PN 074-550-P1E

Figure 5-4 Instrument window

NOTE: It is important to keep in mind that data edited here is only held in memory,
it is not automatically saved or downloaded. Click File >> Save Databaseor Save As Database to save the data in memory to a *.mdb file or Selectthe ALL checkbox and click Download-> to send any configuration(database) changes to SQC-310.

5–6

SQC-310 Operating Manual

On the Instrument window toolbar, click File to display the options to open an
existing database, save the current database file, or save the current database witha different name.
Interface options between SQC-310 and SQC-310 Comm software are shown inthis window.
OK . . . . . . . . . . . . . . . . . . . . . . . . . . Closes the SQC-310 Instrument window. If
data is still in memory, but it has not beensaved to a disk, a prompt warning thatchanges have not been saved will be
displayed.
Download->. . . . . . . . . . . . . . . . . . . Click to download data from the SQC-310
Comm software to SQC-310. The existing
SQC-310 data will be overwritten.
<-Upload . . . . . . . . . . . . . . . . . . . . . Click to upload data from SQC-310 to the
SQC-310 Comm software. The existing
SQC-310 Comm software data will beoverwritten.
All. . . . . . . . . . . . . . . . . . . . . . . . . . . Select to download/upload processes,
layers, films, materials, and the additional
system setups (Sensors, Sources, Logic,
Inputs, and Relays). Clear to unlock
individual download/upload options.

Films . . . . . . . . . . . . . . . . . . . . . . . . Select to download/upload all films. Click
Edit >> Films... to display or edit films. The
processes and materials will remain as
defined on SQC-310 (for downloads) or inmemory (for uploads).
Materials . . . . . . . . . . . . . . . . . . . . . Select to download/upload all materials.
Click Edit >> Materials... to display or edit
materials. The processes and films willremain as defined on SQC-310 (fordownloads) or in memory (for uploads).

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PN 074-550-P1E

Processes . . . . . . . . . . . . . . . . . . . . Select to download/upload only processes
and layers. The films and materials willremain as defined on SQC-310 (fordownloads) or in memory (for uploads).

SQC-310 Operating Manual

5.5.1 Process Tree
The Process Tree is displayed in the Instrument window. It can be used to build
processes, add, delete, and edit layers. It is an indented outline (tree view) of theprocesses in the current configuration. To name a process, click on an <Empty>
process to open the process name editing window. Processes can be renamed but
they cannot be deleted. Process names can be 16 characters long. SQC-310
always holds a list of 100 processes, even if some are empty. After naming theprocess, the buttons on the Instrument window can be used to add layers to theprocess. If a process with layers requires editing click the + symbol beside theprocess to display the individual layers and films that comprise the process (seeFigure 5-5).

PN 074-550-P1E

Figure 5-5 Process Tree - adding layers

The three buttons used to interface with the Process Tree are:Insert Layer . . . . . . . . . . . . . . . . . . . To insert a layer, click Insert Layer button,then select the process to which the layer will
be added.
Insert CoDep . . . . . . . . . . . . . . . . . . To insert a Codeposition layer, click Insert
CoDep button, then select the layer inprocess with which the new layer will besimultaneously deposited. Codeposition
processes will only run on SQC-310C.
Delete Layer . . . . . . . . . . . . . . . . . . Click Delete Layer first, then click an existinglayer to delete it.
NOTE: This action cannot be undone.

5–8

SQC-310 Operating Manual

5.5.2 Film Menu
In the Instrument window toolbar, click Edit >> Films... to display the Film Edit
window to assign materials stored in the database to films (50 films maximum)
which are used to define process layers (see Figure 5-6). Alternatively, on theProcess Tree, click the + next to a process name to display the layers for thatprocess. Click the + next to a layer name to display the film for that layer.
Double-click the film to open the Film menu.
NOTE: Any changes to a film will apply to every layer, in every process where thatfilm is used.

Film . . . . . . . . . . . . . . . . . . . . . . . . . Selects the film to be edited. Click on the film
dropdown box to edit the film name.
Material . . . . . . . . . . . . . . . . . . . . . . List of available database materials. The
material displayed/selected is designated forthe film currently displayed.
For complete list of parameters, definitions, usage, and the range of acceptablevalues for each parameter refer to section 3.11, Film Edit Menu, on page 3-18.
OK . . . . . . . . . . . . . . . . . . . . . . . . . . Closes the Film menu and saves the data tomemory. Be sure to select File >> Save
Database or Save As Database to save anychanges to the database (.mdb) file.

5–9

PN 074-550-P1E

Figure 5-6 Film menu

SQC-310 Operating Manual

Download-> . . . . . . . . . . . . . . . . . . . Click to download materials from the
SQC-310 Comm software to SQC-310. The
existing SQC-310 data will be overwritten.
<-Upload . . . . . . . . . . . . . . . . . . . . . Click to upload materials from SQC-310 to
the SQC-310 Comm software. The existing
SQC-310 Comm software data will beoverwritten.
Click the All Films button to download/upload all films or the Film # button to
download/upload a specific film.

5.5.3 Materials Menu
In the Instrument window toolbar, click Edit >> Materials... to edit the 100 materials
stored in the database (see Figure 5-7).
Figure 5-7 Materials menu

OK . . . . . . . . . . . . . . . . . . . . . . . . . . Closes the Materials menu and saves thedata to memory.

PN 074-550-P1E

Material . . . . . . . . . . . . . . . . . . . . . . Lists the existing materials in the database.
Selecting another material will change thecurrent material and allow editing of material
parameters.
Density . . . . . . . . . . . . . . . . . . . . . . Density of the selected material. Values from0.50 to 99.99 g/cm³ are valid.
Z-Factor . . . . . . . . . . . . . . . . . . . . . . Z-Ratio of the selected material. Values from0.100 to 9.999 are valid.
Rename . . . . . . . . . . . . . . . . . . . . . . Changes the name of a database material.
To add a material, select one of the materials
that is not being used and rename it to thedesired material. Change the Density and
Z-Ratio accordingly.
See Material Table on page A-1 for known density and Z-Ratio (Z-Factor) values.
NOTE: Any changes to a material will apply to every layer, in every process wherethat film/material is used.

5 – 10SQC-310 Operating Manual

5.5.4 Sensor Setup Menu
In the Instrument window toolbar, click Edit >> Sensors... to display the Sensors
Setup menu and edit the parameters of sensors that are connected to each
SQC-310 sensor input. Four sensors are displayed but SQC-310 may only have
two sensor inputs (see Figure 5-8).
NOTE: Sensor setup is closely linked to Digital I/O definitions. Changing a sensor
may cause SQC-310 to alter its internal I/O definitions. For this reason, thesoftware must be connected to SQC-310. Click Download to verify andmodify SQC-310 configuration before selecting OK to close the Sensor
Setup menu and save the data to memory.

OK . . . . . . . . . . . . . . . . . . . . . . . . . . Closes the Sensor Setup menu and saves
the data to memory. Be sure to select File >>Save Database or Save As Database tosave any changes to the database (.mdb)
file.
Cancel . . . . . . . . . . . . . . . . . . . . . . . Closes the Sensor Setup menu and cancels
any changes.
Download->. . . . . . . . . . . . . . . . . . . Click to download sensor data from the
SQC-310 Comm software to SQC-310. The
existing SQC-310 data will be overwritten.
<-Upload . . . . . . . . . . . . . . . . . . . . . Click to upload sensor data from SQC-310 to
the SQC-310 Comm software. The existing
SQC-310 Comm software data will beoverwritten.
Sensor 1 to 4. . . . . . . . . . . . . . . . . . Checks all sensors for which data will be
uploaded/downloaded when thecorresponding button is pressed.

5 – 11PN 074-550-P1E

Figure 5-8 Sensor Setup menu

SQC-310 Operating Manual

Sensor parameter inputs become available automatically when multi-pocket
sensors are requested in the # of positions parameter. For a complete list ofparameters, definitions, usage, and the range of acceptable values for eachparameter, refer to section 3.12.3, Sensors and Sources Menu, on page 3-36.

5.5.5 Source Setup Menu
In the Instrument window toolbar, click Edit >> Sources... to display the Source
Setup menu and edit the parameters of sources that are connected to each
SQC-310 source output. Four sources are displayed but SQC-310 may only have
two source outputs (see Figure 5-9).
NOTE: Source setup is closely linked to Digital I/O definitions. Changing a source
may cause SQC-310 to alter its internal I/O definitions. For this reason, thesoftware must be connected to SQC-310. Click Download to verify andmodify SQC-310 configuration before selecting OK to close the Source
Setup menu and save the data to memory.

PN 074-550-P1E

Figure 5-9 Source Setup menu

OK . . . . . . . . . . . . . . . . . . . . . . . . . . Closes the Source setup menu and saves
the data to memory. Be sure to select File >>Save Database or Save As Database tosave any changes to the database (.mdb)
file.
Cancel . . . . . . . . . . . . . . . . . . . . . . . Closes the Source Setup menu and cancels
any changes.
Download-> . . . . . . . . . . . . . . . . . . . Click to download source data from the
SQC-310 Comm software to SQC-310. The
existing SQC-310 data will be overwritten.

5 – 12

SQC-310 Operating Manual<-Upload . . . . . . . . . . . . . . . . . . . . . Click to upload source data from SQC-310 to
the SQC-310 Comm software. The existing
SQC-310 Comm software data will beoverwritten.
Sources 1 to 4. . . . . . . . . . . . . . . . . Checks all sources for which data will be
uploaded/downloaded when thecorresponding button is pressed.
Source parameter inputs become available automatically when multi-pocket
sources are request in the # of positions parameter. For a complete list ofparameters, definitions, usage, and the range of acceptable values for eachparameter, refer to section 3.12.3, Sensors and Sources Menu, on page 3-36.

5.5.6 Digital I/O Setup Menu
In the Instrument window toolbar, click Edit >> Digital I/O... to display the Digital
I/O Setup menu that allows the mapping of named digital input and relay functions
to physical inputs and relays.
NOTE: I/O setup is closely linked to sensor and source definitions. Changing a
Sensor or Source may cause SQC-310 to alter its internal I/O definitions.
For this reason, SQC-310 must be connected. Click Download to verify
and modify SQC-310 configuration before selecting OK to close the Digital
I/O Setup menu and save the data to memory.

PN 074-550-P1E

Figure 5-10 Digital I/O Setup menu - Show Relays

5 – 13

SQC-310 Operating Manual

OK . . . . . . . . . . . . . . . . . . . . . . . . . . Closes the Digital I/O Setup menu and saves
the data to memory. Be sure to select File >>Save Database or Save As Database tosave any changes to the database (*.mdb)
file.
Cancel . . . . . . . . . . . . . . . . . . . . . . . Closes the Digital I/O Setup menu andcancels any changes.
Download-> . . . . . . . . . . . . . . . . . . . Click to download sensor data from the
SQC-310 Comm software to SQC-310. The
existing SQC-310 data will be overwritten.
<-Upload . . . . . . . . . . . . . . . . . . . . . Click to upload sensor data from SQC-310 to
the SQC-310 Comm software. The existing
SQC-310 Comm software data will beoverwritten.
If the Show Relays button is selected, All relays and pertinent information will be
displayed in columns that can be edited (refer to Figure 5-10).

PN 074-550-P1E

Name . . . . . . . . . . . . . . . . . . . . . . . . A descriptive name for the relay. For relays
that have been assigned by SQC-310, thiswill overwrite the SQC-310 assigned default
name. However, the function of the relay
remains as originally defined in SQC-310.
The relay name can be returned to default byselecting the relay on the SQC-310
System/Relays menu and pressing Set to
Default (refer to section 3.12.1 on page3-27).
Type . . . . . . . . . . . . . . . . . . . . . . . . . Normally Open (NO) contacts or Normally
Closed (NC) contacts. SQC-310 implements
the NO/NC function using firmware. All relays
are normally open and will open when the
SQC-310 is turned off.
Pulses . . . . . . . . . . . . . . . . . . . . . . . Selecting None causes the relay to activate
when the logical relay function is true, anddeactivate when it is false. Some
multi-crystal sensors require one or two
pulses for activation.
Time . . . . . . . . . . . . . . . . . . . . . . . . . The time (in seconds) that the relay activates
if one or two pulses are selected.
Relay # . . . . . . . . . . . . . . . . . . . . . . . The physical relay assigned to this logicalrelay function.

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SQC-310 Operating Manual

Used By. . . . . . . . . . . . . . . . . . . . . . Indicates if a relay function is defined by asensor, source, or logic statement. A relay
can be controlled by only a single function.
Function is automatically designated by
SQC-310 and cannot be edited.
If the Show Inputs button is selected, All inputs and pertinent information will be
displayed in columns that can be edited (see Figure 5-11).

Name . . . . . . . . . . . . . . . . . . . . . . . . A descriptive name for the input. For inputs
that have been assigned in SQC-310, thiswill overwrite the SQC-310 assigned default
name. However, the function of the input
remains as originally defined by SQC-310.
The input name can be returned to its default
by selecting the relay on the SQC-310
System/Inputs menu and pressing Set to
Default (refer to section 3.12.1 on page3-27).
Active Level . . . . . . . . . . . . . . . . . . The level, high (5 V) or low (0 V) that triggers
the input.
Input # . . . . . . . . . . . . . . . . . . . . . . . The physical input assigned to this logicalinput function.

5 – 15

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Figure 5-11 Digital I/O Setup menu - Show Inputs

SQC-310 Operating Manual

Used By . . . . . . . . . . . . . . . . . . . . . . Indicates if an input function is defined by asensor, source, or logic statement. Since
multiple logic statements may use an input in
the IF condition, only the first use is listed.
Function is automatically designated by
SQC-310 and cannot be edited.
When either the Show Relays or Show Inputs button is clicked, the View Status
may be selected. View Status monitors the state of the SQC-310 inputs and relays.
Similar to the SQC-310 display, relays and inputs whose state is currently true aredisplayed in green. False is displayed in red.

5.5.7 Logic Statements Menu
In the Instrument window toolbar, click Edit >> Logic... to display the Logic
Statements menu. Logic statements allow the programming of SQC-310 torespond to inputs and activate relays, based on a variety of process conditions (seeFigure 5-12).
NOTE: Logic statements are closely linked to digital I/O definitions. Changing astatement may cause SQC-310 to alter internal I/O definitions. SQC-310
must be connected and any changes made must be downloaded to verify
and modify the SQC-310 configuration before OK can be selected to closethe Logic Statements menu and save the data to memory.

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Figure 5-12 Logic Statements menu

5 – 16

SQC-310 Operating Manual

OK . . . . . . . . . . . . . . . . . . . . . . . . . . Closes the Logic Statements menu andsaves the data to memory. Be sure to selectFile >> Save Database or Save As
Database to save any changes to the
database (*.mdb) file.
Cancel . . . . . . . . . . . . . . . . . . . . . . . Closes the Logic Statements menu andcancels any changes.
Logic Statement . . . . . . . . . . . . . . . List all 32 possible logic statements. The
logic statement number displayed is the logic
statement that will be edited.
Copy . . . . . . . . . . . . . . . . . . . . . . . . Copies the displayed logic statement andstores it.
Paste . . . . . . . . . . . . . . . . . . . . . . . . Displayed after the copy button is pressed.
Replaces the displayed logic statement withthe stored logic statement.
Clear . . . . . . . . . . . . . . . . . . . . . . . . Clears the current logic statement.
Clear All. . . . . . . . . . . . . . . . . . . . . . Clears all logic statements.
DnLoad->. . . . . . . . . . . . . . . . . . . . . Click to download the displayed logic
statement from the SQC-310 Commsoftware to SQC-310. The existing SQC-310
data will be overwritten. Ideal for testing thestatements.

DnLoad All-> . . . . . . . . . . . . . . . . . . Click to download all logic statements fromthe SQC-310 Comm software to SQC-310.
The existing SQC-310 data will beoverwritten.
<-UpLoad All . . . . . . . . . . . . . . . . . . Click to upload all logic statements from
SQC-310 to the SQC-310 Comm software.
The existing SQC-310 Comm software data
will be overwritten.

5 – 17

PN 074-550-P1E<-UpLoad. . . . . . . . . . . . . . . . . . . . . Click to upload the displayed logic statementfrom SQC-310 to the SQC-310 Commsoftware. The existing SQC-310 Commsoftware data will be overwritten.

SQC-310 Operating Manual

5.5.7.1 Creating Logic Statements
A logic statement consists of two parts. The first part of the string (IF) indicates thecondition that must be satisfied. The second part (THEN) indicates the action thattakes place once the condition has been satisfied.

1 Select a logic statement.
2 Click on the statement name to edit the name.
3 To create the IF condition, select a category and a specific condition for thatcategory. Click Add to add the condition to the IF string. To add more conditions
to the IF statement, add an operator such as AND, OR, or NOT and selectanother condition. If a mistake is made, click Back to delete the last entry in the
IF statement. If SQC-310 is connected, click Check to verify the logic statement
is correct.

4 To create the THEN action, select a category and a specific action for thatcategory. Only one action is allowed per logic statement. However, a SoftNodecan be selected as an action and used as an input to another logic statement(refer to section 3.12.2, Logic Menu, on page 3-30 for more details).
For more complex logic statements, logical operators such as AND, OR, NOT,
parentheses ( ), greater than >, and less than < can be added. Parenthesis areused to group logic conditions, for example, IF (Input1 AND Input2) OR Input3.
Every open parenthesis "(" must have a matching closed parentheses ")." The lessthan (<) and greater than (>) operators are used only with timer conditions.
For a complete list of parameters, definitions, usage, and the range of acceptablevalues for each parameter (refer to section 3.12.2, Logic Menu, on page 3-30).

PN 074-550-P1E

5.5.8 System Setup Menu
In the Instrument window, click Edit >> Systems... to display the System Setup
menu and edit general system parameters (see Figure 5-13).
Figure 5-13 System Setup menu

5 – 18SQC-310 Operating Manual

OK . . . . . . . . . . . . . . . . . . . . . . . . . . Closes the System Setup menu and saves
the data to memory. Be sure to select File >>Save Database or Save As Database tosave any changes to the database (.mdb)
file.
Cancel . . . . . . . . . . . . . . . . . . . . . . . Closes the System Setup menu and cancels
any changes.
Download->. . . . . . . . . . . . . . . . . . . Click to download the current Systemsettings from the SQC-310 Comm software
to SQC-310. The existing SQC-310 data will
be overwritten.
<-Upload . . . . . . . . . . . . . . . . . . . . . Click to upload the current System settingsfrom SQC-310 to the SQC-310 Commsoftware. The existing SQC-310 Commsoftware data will be overwritten.
For a complete list of parameters, definitions, usage, and the range of acceptablevalues for each parameter (refer to System Menu on page 3-25).

5.6 Graph Menu
On the Main window toolbar, click Edit >> Graphs... to display the Graphs menu
and edit the Main window graph axis and grid settings (see Figure 5-14).

PN 074-550-P1E

Figure 5-14 Graph menu

5 – 19SQC-310 Operating Manual

OK . . . . . . . . . . . . . . . . . . . . . . . . . . Closes the Graph menu. Saves all changes.
Cancel . . . . . . . . . . . . . . . . . . . . . . . Closes the Graph menu. Does not savechanges.
Rate - Y-Axis . . . . . . . . . . . . . . . . . . Sets the maximum and minimum value forrate displayed on the Y-axis, in Å/s. Grid
spacing can be also be set or disabled forrate.
Deviation - Y-Axis . . . . . . . . . . . . . . Sets the maximum and minimum value fordeviation displayed on the Y-axis, in %. Grid
spacing can be also be set or disabled for
deviation.
Power - Y-Axis . . . . . . . . . . . . . . . . Sets the maximum and minimum value forpower displayed on the Y-axis, in %. Grid
spacing can be also be set or disabled for
power.
Senor Rates - Y-Axis . . . . . . . . . . . Sets the maximum and minimum value forsensor rates displayed on the Y-axis, in %.
Grid spacing can be also be set or disabled
for sensor rates.
All Graphs - X-Axis . . . . . . . . . . . . . Sets the maximum and minimum time value
displayed on the X-axis. Grid spacing can bealso be set or disabled for time.

5.7 Communications Setup Menu

PN 074-550-P1E

On the Main window toolbar, click Edit >> Communications... to display thecommunications setup menu. This menu allows for setup and troubleshooting of
the SQC-310 communications (see Figure 5-15).
Figure 5-15 Comm Setup menu

5 – 20SQC-310 Operating Manual

For initial setup follow these steps:

1 Verify SQC-310 power switch is in the on position and connected to thecomputer with the proper cable (USB cable, straight-through RS-232 cable, orEthernet cable) (refer to Chapter 4.1, Communications for setup details).

2 Select the proper communications method and set the required parameters.
RS-232 . . . . . . . . . . . . . . . . . . . . . . . Select for RS-232 communications. Selectthe proper communications port for thecomputer. If a USB to RS-232 adapter isused, verify the communication port
assignment in the Windows device manager.
Set the Baud rate in the drop down menu tomatch the SQC-310 System menu RS-232
Comm. baud setting (refer to section 3.12 on
page 3-25 for details).
USB . . . . . . . . . . . . . . . . . . . . . . . . . Select for USB communications. SQC-310
units currently connected to a computer via
USB will be recognized and added to thedisplayed on the list. Select the desired
SQC-310.
Ethernet. . . . . . . . . . . . . . . . . . . . . . Select for Ethernet communications. Enterthe proper SQC-310 Ethernet port (typically2101) and TCP/IP address. TCP/IP address
is typically 192.168.1.200. If unknown, Clickthe Setup button to search for the IP
address.

Close . . . . . . . . . . . . . . . . . . . . . . . . Exits the Communications Setup menu.
Saves any changes.
Find . . . . . . . . . . . . . . . . . . . . . . . . . Used for testing communications. Sends the
Hello command (@) over the selected
communications port. SQC-310 should
respond with version information in the
response dialog box. Ignore the extra
characters that begin and end the version
information. If the communications type ischanged, and Find does not find theconnected SQC-310, try exiting andrestarting SQC-310 Comm software. This willreinitialize the desired communications port.

5 – 21PN 074-550-P1E

Other options available on this window are:

SQC-310 Operating Manual

Search at Start . . . . . . . . . . . . . . . . Automatically sends the Hello command (@)
over the last selected communications
method when the SQC-310 Comm softwareis launched. This checkbox option is saved
when the Close button is clicked. If the
SQC-310 Comm software is used often
without being connected to SQC-310, clear
this option.
Use Checksum . . . . . . . . . . . . . . . . Communications between the SQC-310
Comm software and SQC-310 include achecksum to verify data integrity. This option
should remained selected unless instructed
to do otherwise by support personnel.
Send(Command). . . . . . . . . . . . . . . Sends the command entered into thecommand box via communications to
SQC-310. Message length and checksum (ifused) are automatically calculated and sent.
Type commands in ASCII format (refer tosection 4.2, SQC-310 Communications
Protocol, on page 4-8 for details).
Response . . . . . . . . . . . . . . . . . . . . The response from SQC-310 is displayed inthis dialog box. Responses will be displayedin ASCII format (refer to section 4.2,
SQC-310 Communications Protocol, on
page 4-8 for details).

PN 074-550-P1E

5.8 View Menu
On the Main window toolbar, click View to display a series of options for different
Main window graphs available. Selecting a graph will replace the current Main
window graph. An option for a Sensor Readings window is also available.
Output Rate Graph . . . . . . . . . . . . . On the Main window, displays the output rateover time.
Output Deviation Graph . . . . . . . . . On the Main window, displays the output
deviation over time.
Output Power Graph . . . . . . . . . . . On the Main window, displays the output
power over time.
Sensor Rate Graph . . . . . . . . . . . . . On the Main window, displays the individual
sensor rates over time.

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SQC-310 Operating Manual

Sensor Readings . . . . . . . . . . . . . . Displays the Sensor Reading window that
displays live sensor readings for Rate (Å/s),
Thick(ness) (kÅ) and Freq(uency) (Hz) (seeFigure 5-16).
Figure 5-16 Sensor Readings window

5.9 Help Menu
On the Main window toolbar, click Help to display a Help option and an About
option. The Help option contains the information presented in this chapter.
NOTE: The Help option is not available on Windows 7/8 operating systems.
The About window displays the SQC-310 Comm software revision and technicalsupport information (see Figure 5-17).

On the About window, click system information to display detailed information
about the computer and operating system.
NOTE: This feature may not be available on all Windows operating systems.

5 – 23

PN 074-550-P1E

Figure 5-17 About window

SQC-310 Operating Manual

Chapter 6
Troubleshooting and Maintenance
6.1 Troubleshooting
If SQC-310 does not function as expected, or appears to have diminishedperformance, the following Symptom/Cause/Remedy chart may be helpful (seeTable 6-1). Additional troubleshooting information can be found in the operating
manuals for sensors, located on the Thin Film Instrument and Sensor Manuals CD.
If the problem cannot be resolved, contact INFICON (refer to section 1.3 on page
1-5).

WARNING
The SQC-310 has no user-serviceable components.
Refer all maintenance to qualified INFICON personnel.

Table 6-1 Symptom/Cause/Remedy Chart

SYMPTOMCAUSE

REMEDYPN 074-550-P1E

SQC-310 does not turn on. Line cord is not plugged into Connect line cord.
SQC-310 or rear panel
power switch is not on.
Set the rear panel powerswitch to position 1 (ON).
Incorrect line voltage.

Line voltage must be within
SQC-310 line voltage
specification (refer to section
1.4.5 on page 1-7).

Fuse open.

Remove the fuse drawer
from the power inlet andexamine both fuses, or use
an ohmmeter to check thefuses. Replace open fuseswith the specified fuse (seesection 6.5 on page 6-17).

SQC-310 is malfunctioning.

Contact INFICON service
department (refer to section
1.3 on page 1-5).

6–1

SQC-310 Operating Manual

Table 6-1 Symptom/Cause/Remedy Chart (continued)

SYMPTOM
SQC-310 “locks up.”CAUSE

REMEDY

Covers / panels not installed Install / securely fasten all
or not secured.
covers and panels.
Electrical noise is being
picked up by cables
connected to SQC-310.

Locate the sensor, oscillator
cables, source output cables,
I/O cables, and line cord atleast 30.5 cm (1 ft.) awayfrom high voltage / highpower cables and othersources of electrical noise.

Inadequate system
grounding.

Ground wires or straps
should be short with large
surface area to minimize
impedance to ground.
Ground wires or straps must
connect to an appropriate
earth ground (refer to section
1.2.3 on page 1-3).
Contact INFICON service
department (refer to section
1.3 on page 1-5).

SQC-310 is malfunctioning.

Contact INFICON service
department (refer to section
1.3 on page 1-5).

PN 074-550-P1E

Stored parameter values
are lost when SQC-310 isturned on.

SQC-310 is malfunctioning.

6–2

SQC-310 Operating Manual

Table 6-1 Symptom/Cause/Remedy Chart (continued)

SYMPTOMCAUSE

REMEDY

Temperature of the crystal is Control the vacuum chamber
Frequency reading in
Sensor Information screen unstable (an AT-cut crystal temperature.
is unstable or drifting (not may drift as much asMove the crystal farther away
10 Hz/°C).
a normal frequency
from the source (at least
decrease associated with
25.4 cm (10 in.) from source).
material being depositedon the crystal).
Check sensor water coolingfor correct flow andtemperature. Refer to thesensor operating manual.
Clean or replace the crystal
holder. Refer to the sensor
operating manual forcleaning instructions.

PN 074-550-P1E

Use SPC-1157-G10 thermal
shock crystals designed tominimize frequency shifts
due to heat load.

6–3

SQC-310 Operating Manual

Table 6-1 Symptom/Cause/Remedy Chart (continued)

SYMPTOMCAUSE

REMEDY

Humidity level on the crystal Avoid condensation by
Frequency reading in
Sensor Information screen is changing. Moisture being turning off cooling water tois unstable or drifting (not absorbed or exuded from the sensor before opening thevacuum chamber to air, andcrystal surface.
a normal frequency
then flow heated water above
decrease associated withthe dew point of the roommaterial being deposited
through the sensor when theon the crystal).
chamber is open.
Crystal or crystal holder
crystal seating surface
scratched or dirty.

Replace crystal.
Clean the crystal seating
surface inside the crystal
holder or replace crystal
holder. Refer to sensor
operating manual forcleaning instructions.

Bad in-vacuum cable or bad Use an ohmmeter to check
oscillator cables.
electrical continuity andisolation of cables.
SQC-310 or oscillator ismalfunctioning.

Test the SQC-310 andoscillator using the oscillator
test mode (see section on
page 6-17).

Substitute a known good
oscillator.
Substitute a PN 760-601-G2
Sensor Emulator or a known
good sensor for the sensor.
In-vacuum cable length
Excessive cable length
Frequency reading inshould not exceed 78.1 cm
Sensor Information screen between oscillator and(30.75 in.).
crystal is causing a
is an incorrect value.
self-oscillation at a frequency
Use the 15.2 cm (6 in.) cabledifferent than the crystal
between oscillator andfrequency.
feedthrough.

6–4

PN 074-550-P1E

Substitute a known good
SQC-310 (or other QCM).

SQC-310 Operating Manual

Table 6-1 Symptom/Cause/Remedy Chart (continued)

SYMPTOM

CAUSE

SQC-310 or oscillator is
Frequency reading in
Sensor Information screen malfunctioning.
is an incorrect value.

REMEDY
Test the SQC-310 andoscillator using the oscillator
test mode (see section on
page 6-17).
Substitute a known good
SQC-310 (or other QCM).
Substitute a known good
oscillator.
Substitute a PN 760-601-G2
Sensor Emulator or a known
good sensor for the sensor.

Crystal Fail is displayed.

Failed crystal, or no crystal in Install a new crystal.
sensor.
Two crystals were installed or Remove extra crystal.
crystal is upside down.
Reverse crystal orientation.
Inspect crystal for scratches;
if scratched, replace withnew crystal.

PN 074-550-P1E

Built-up material at crystal
holder aperture is touching
the crystal.

Clean or replace the crystal
holder. Refer to the sensor
operating manual forcleaning instructions.

Crystal frequency is not
Use a crystal with starting
within the frequency range of frequency appropriate for
SQC-310.
SQC-310 frequency range.
Change the Min / Max
Frequency settings in the
System Menu screen.
Oscillator and sensor notconnected to the Sensor
channel(s) set to On in the
Edit Layer screen.

Connect oscillator andsensor to all active Sensor
channel(s).

6–5

SQC-310 Operating Manual

Table 6-1 Symptom/Cause/Remedy Chart (continued)

SYMPTOM
Crystal Fail is displayed.

CAUSE
Excessive cable length
between oscillator andcrystal.

REMEDYIn-vacuum cable length
should not exceed 78.1 cm(30.75 in.).
Use the 15.2 cm (6 in.) cablebetween oscillator andfeedthrough.

Bad sensor/feedthrough, or Use an ohmmeter to checkbad in-vacuum cable, or bad electrical continuity andisolation of sensor head,
BNC cable.
feedthrough, in-vacuum
cable, and both BNC cables.
SQC-310 or oscillator is
Refer to the sensor operating
malfunctioning.
manual for detailed
troubleshooting information.
Substitute known good BNC
cables.
Substitute a known goodin-vacuum cable.
Substitute a known good
sensor/feedthrough.

Test the SQC-310 andoscillator using the oscillator
test mode (see section 6.1.1
on page 6-14).
Substitute a known good
SQC-310 (or other QCM).
Substitute a known good
oscillator.

6–6

PN 074-550-P1E

Substitute a PN 760-601-G2
Sensor Emulator for thesensor.

SQC-310 Operating Manual

Table 6-1 Symptom/Cause/Remedy Chart (continued)

SYMPTOM
Crystal Fail is displayed
during deposition before“normal” life of crystal isexceeded.

CAUSE

REMEDY

Crystal is being hit by small Use a shutter to shield thedroplets of molten material sensor during sourcefrom the evaporation source. conditioning.
Move the crystal farther away
(at least 25.4 cm (10 in.))from the source.
Damaged crystal or
Replace the crystal.
deposited material is causing
stress to crystal.
Use an Alloy crystal if
appropriate for depositedmaterial.
Material build-up on crystal
holder is partially masking
the crystal surface.

Clean or replace the crystal
holder. Refer to the sensor
operating manual forcleaning instructions.

Visually check crystal for an
Shutter is partiallyobstructing deposition flux or uneven coating, and if
sensor is poorly positioned, present, correct shutter or
causing uneven distribution sensor positioning problem.
of material on crystal.

PN 074-550-P1E

Xtal Quality or Xtal Stability Poor Rate control isare enabled and triggering a triggering Xtal Quality (seeCrystal Fail.
section 7.5 on page 7-5).
Unstable/noisy crystal is
triggering Xtal Stability.
Replace crystal.
External condition (e-beamarcing, thermal changes,etc.) is triggering Xtal
Stability. Correct the external
condition.
Xtal Quality and/or Xtal
Stability settings are too
sensitive for the application.
Change the values, ordisable Xtal Quality and/or
Xtal Stability (refer to section
3.11 on page 3-18).

6–7

SQC-310 Operating Manual

Table 6-1 Symptom/Cause/Remedy Chart (continued)

SYMPTOMCAUSE

REMEDY

Crystal Fail is displayed
during deposition before“normal” life of crystal isexceeded.

In-vacuum cable length
Crystal oscillation is weakshould not exceed 78.1 cm
due to excessive cable
length between oscillator and (30.75 in.).
crystal.
Use the 15.2 cm (6 in.) cablebetween oscillator andfeedthrough.

Crystal Fail is displayedwhen vacuum chamber isopened to air.

Crystal was near the end of Replace the crystal.
its life; opening to air causes
film oxidation, which
increases film stress.

PN 074-550-P1E

Avoid condensation by
Excessive moistureaccumulation on the crystal. turning off cooling water tosensor before opening thevacuum chamber to air, andthen flow heated water above
the dew point of the room
through the sensor when thechamber is open.

6–8

SQC-310 Operating Manual

Table 6-1 Symptom/Cause/Remedy Chart (continued)

SYMPTOM
Rate, Thickness, andFrequency readings arenoisy.

CAUSE
Excessive cable length
between oscillator andcrystal.

REMEDYIn-vacuum cable length
should not exceed 78.1 cm(30.75 in.).
Use the 15.2 cm (6 in.) cablebetween oscillator andfeedthrough.

Electrical noise is being
picked up by cables
connected to SQC-310.

Locate the sensor, oscillator
cables, source output cables,
I/O cables, communications
cable, and line cord at least
30.5 cm (1 ft.) away from highvoltage / high power cables
and other sources ofelectrical noise.

Inadequate system
grounding.

Ground wires or straps
should be short with large
surface area to minimize
impedance to ground.

PN 074-550-P1E

Ground wires or straps
should connect to an
appropriate earth ground(refer to section 1.2.3 on
page 1-3).

6–9

SQC-310 Operating Manual

Table 6-1 Symptom/Cause/Remedy Chart (continued)

SYMPTOM
Thickness reading haslarge excursions during
deposition.

CAUSE
Mode hopping due todamaged crystal.

REMEDY
Replace the crystal.

Crystal is near the end of its Replace the crystal.
life.
Scratches or foreign particles Clean the crystal seatingon the crystal holder crystal surface inside the crystal
holder or replace crystal
seating surface.
holder. Refer to sensor
operating manual forcleaning instructions.
Uneven coating onto crystal. A straight line from center ofsource to center of crystal
should be perpendicular to
face of crystal.
Particles on crystal.

Replace crystal.
Remove source of particles.
Use an ohmmeter to check
electrical continuity / isolationof sensor head, feedthrough,in-vacuum cable, and BNC
cables. Refer to the sensor
operating manual for detailed
troubleshooting information.

Inadequate cooling of crystal. Check water flow rate andtemperature for sensor
cooling.
Crystal not properly seated
Thickness reading has
or crystal holder crystal
large excursions during
source warm-up or when seating surface is dirty.
source shutter is opened(usually causes Thickness
reading to decrease) andafter the termination ofdeposition (usually causes
Thickness reading toincrease).

6 – 10

Check crystal installation.
Clean the crystal seating
surface inside the crystal
holder or replace crystal
holder. Refer to sensor
operating manual forcleaning instructions.

PN 074-550-P1E

Intermittent cables orconnections.

SQC-310 Operating Manual

Table 6-1 Symptom/Cause/Remedy Chart (continued)

SYMPTOM

CAUSE

Excessive heat input to theThickness reading has
crystal.
large excursions during
source warm-up or whensource shutter is opened(usually causes Thickness
reading to decrease) andafter the termination ofdeposition (usually causes
Thickness reading toincrease).

REMEDYIf heat is due to radiationfrom the evaporation source,
move sensor farther away (atleast 25.4 cm (10 in.)) fromsource.
Use SPC-1157-G10 thermal
shock crystals designed tominimize frequency shifts
due to heat load.

Inadequate cooling of crystal. Check water flow rate andtemperature for sensor
cooling.
Crystal is being heated byelectron flux.

Use a sputtering sensor for
non-magnetron sputtering.

Crystal is being hit by small Use a shutter to shield thedroplets of molten material sensor during sourcefrom the evaporation source. conditioning.
Move the crystal farther away
(at least 25.4 cm (10 in.))from the source.

PN 074-550-P1E

Intermittent connection
occurring in sensor or
feedthrough with thermalvariation.

Use an ohmmeter to check
electrical continuity / isolationof sensor head, feedthrough,and in-vacuum cable. Referto the sensor operating
manual for detailed
troubleshooting information.

6 – 11SQC-310 Operating Manual

Table 6-1 Symptom/Cause/Remedy Chart (continued)

SYMPTOM
Thickness reproducibility
is poor.

CAUSE
Erratic evaporation flux
characteristics.

REMEDY
Move sensor to a different
location.
Check the evaporation
source for proper operating
conditions.
Ensure relatively constantpool height and avoid
tunneling into the melt.
Assign multiple sensors to
the source.

Material does not adhere well Check for contamination on
to the crystal.
the crystal surface.
Evaporate an intermediate
layer of appropriate material
onto the crystal to improveadhesion.
Use gold, silver, or alloy
crystals, as appropriate.
PID control loop parameters Test in Manual mode to
are not optimized.
ensure a stable rate ispossible.
Change PID control loop
parameters (see section 7.5
on page 7-5).

6 – 12

Period and/or Rate Filter
Alpha parameters are not
optimized.

Change Period and/or Rate
Filter Alpha values (refer tosection 3.12 on page 3-25).

Electron beam sweep
frequency “beating” with the
SQC-310 measurement
frequency.

Adjust the sweep frequency
so it is not in phase with the
SQC-310 measurement
frequency.

PN 074-550-P1E

Rate control is poor.

SQC-310 Operating Manual

Table 6-1 Symptom/Cause/Remedy Chart (continued)

SYMPTOMCAUSE

REMEDY

Source output of SQC-310 A voltage is being applied to Remove the cause of theis not functioning properly. the source output cable by applied voltage.
the source power supply orother equipment.
Source output voltage range Check the required input
or polarity is not appropriate polarity and input voltage offor the source power supply. the source power supply. In
the Sensors & Sources Menu
screen, set Voltage Scale tothe appropriate polarity andvoltage range.
Source output cable wiring is Check source output cable
incorrect.
wiring (refer to section 2.4 on
page 2-5).

PN 074-550-P1E

SQC-310 Comm software
does not install correctlyor does not function
correctly.

SQC-310 is malfunctioning.

Substitute a known good
SQC-310 (or other QCM).

Host computer has
incompatible operating
system or incompatible
version of operating system.

Check that operating system
and version are compatible
with SQC-310 Commsoftware (refer to Chapter 5).

Communication cannot be Communications cable is not Check cable connections.
connected properly toestablished between the
SQC-310 or host computer.
host computer and
SQC-310.
Communication settings in Refer to section 3.12 on page
3-25 and section 5.7 on page
SQC-310 or SQC- 310
5-20.
Comm software areincorrect.
Contact INFICON technical
SQC- 310 Comm software
version is not compatible with support (refer to section 1.3
SQC-310 firmware version. on page 1-5).
RS-232 communication
issue.

RS-232 cable is not thecorrect type.

USB communication issue. USB device driver is notinstalled correctly.

Use straight-through RS-232
cable (refer to section 4.1.1
on page 4-1).
Refer to section 4.1.2 on
page 4-2.

6 – 13

SQC-310 Operating Manual

Table 6-1 Symptom/Cause/Remedy Chart (continued)

SYMPTOM
Ethernet communication
issue.

CAUSE

REMEDY

Ethernet network settings in Refer to section 4.1.3 onhost computer are incorrect. page 4-2.
Ethernet IP address setting Change Ethernet module IP
in SQC-310 Comm software address or SQC-310 Comm
does not match IP address of software IP address
SQC-310 Ethernet module. (refer to section 4.1.3.2 on
page 4-7).
Straight-through Ethernet
Use a cross-over Ethernet
cable is not auto-detected by cable for a direct connection
an older host computer.
to a host computer that does
not auto-detect cable type.

6.1.1 Using the OSC-100A Oscillator Test Function

If the Sensor Information screen displays a Frequency of approximately 5.5 MHz
while the Push To Test button is depressed, the problem has been isolated to bein the path between the oscillator and the sensor head. If the Sensor Information
screen continues to display Frequency of zero while the Push To Test button isdepressed, the problem is either the programming of the sensor selection, in theelectronics of the oscillator, or SQC-310.
Figure 6-1 OSC-100A oscillator

6 – 14

PN 074-550-P1E

OSC-100A oscillators have a test feature to help isolate persistent crystal failproblems (see Figure 6-1). To activate the test feature, press the Push to Test
button using a small, pointed object, such as a pen or small screwdriver. Thisconnects the internal test crystal to the circuit instead of the normal Sensor
connector. If SQC-310 and the oscillator are functioning correctly, the Sensor
Information will display a Frequency of approximately 5.5 MHz while this button isdepressed. Once the Push to Test button is released, the oscillator returns tonormal operation and the internal test crystal is no longer in use.

SQC-310 Operating Manual

6.2 Cleaning
Use a damp cloth, wetted with water or a mild detergent, to clean theouter surfaces.

6.3 Upgrading Firmware
The SQC-310 firmware can be upgraded through the RS-232 port. Some
restrictions apply. Contact INFICON for instructions and availability of firmware
upgrades (section 1.3 on page 1-5). Please record and have the firmware version(displayed at power up as Ver x.xx) and hardware version (displayed at power up
as Hw x) available when contacting INFICON for upgrades.

6.4 Clearing the Memory
SQC-310 has two ways to clear system memory. Both involve pressing and holding
a combination of buttons and the control knob. Figure 6-2 displays the number
designations given to each button and the control knob. These are the same
number designations used for entering system passwords (refer to section 3.12 formore information on passwords).

CAUTION
Memory clearing procedures cannot be reversed. Be sure
to back up the configuration file using SQC-310 Commsoftware, if possible, before attempting to clear systemmemory.

PN 074-550-P1E

Figure 6-2 Button number designations

6 – 15SQC-310 Operating Manual

To clear all memory including the material index, press and hold the 1 and 6 buttons
along with the control knob (7) during startup. On the bootup screen, the following
should be displayed:
Loading Materials . . . . . . . . . . . . Failed!
Loading Films . . . . . . . . . . . . . . . Failed!
Loading System . . . . . . . . . . . . . Failed!
Loading Processes. . . . . . . . . . . Failed!
Once SQC-310 boots up, turn the power off and back on again. SQC-310 loads
normally and displays:
Loading Materials . . . . . . . . . . . . Done
Loading Films . . . . . . . . . . . . . . . Done
Loading System . . . . . . . . . . . . . Done
Loading Processes. . . . . . . . . . . Done
If any Failed! messages still appear during loading, turn the power off and back onagain. Only Done messages should appear after memory clearing is complete.

PN 074-550-P1E

To clear all memory except the material index and set SQC-310 to factory default,press and hold the 2 and 5 buttons along with the control knob (7) during startup.
All loading messages will now display Failed!, except Materials. Repeat therebooting procedure described above until all loading messages display Done.

6 – 16

SQC-310 Operating Manual

6.5 Spare Parts
Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PN 783-500-013
BNC Cable (15.2 cm (6 in.)) . . . . . . . . . . . . . . . . . . . . . . . . .PN 782-902-011
BNC Cable (3.0 m (10 ft.)) . . . . . . . . . . . . . . . . . . . . . . . . . .PN 782-902-012-10
BNC Cable (7.6 m (25 ft.)) . . . . . . . . . . . . . . . . . . . . . . . . . .PN 782-902-012-25
BNC Cable (15.2 m (50 ft.)) . . . . . . . . . . . . . . . . . . . . . . . . .PN 782-902-012-50
BNC Cable (22.8 m (75 ft.)) . . . . . . . . . . . . . . . . . . . . . . . . .PN 782-902-012-75
Fuse (500 mA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PN 062-0105
Fuse Drawer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PN 051-1510
Power Cord North American (1.8 m (6 ft.)). . . . . . . . . . . . . .PN 068-0433
Power Cord European (2.5 m (8.2 ft.)) . . . . . . . . . . . . . . . . .PN 068-0434
Power Cord UK (2.5 m (8.2 ft.)) . . . . . . . . . . . . . . . . . . . . . .PN 803301
RS-232 straight-through Cable (3 m (10 ft.)) . . . . . . . . . . . .PN 068-0464
USB 2.0 A-B Cable (3 m (10 ft.)) . . . . . . . . . . . . . . . . . . . . .PN 068-0472

PN 074-550-P1E

Ethernet Cat5e Cable (2.1 m (7 ft.)) . . . . . . . . . . . . . . . . . . .PN 068-0478

6 – 17

SQC-310 Operating Manual

Chapter 7
Calibration Procedures
7.1 Importance of Density, Tooling and Z-Ratio
The quartz crystal microbalance is capable of precisely measuring the mass added
to the face of the oscillating quartz crystal sensor. The density of this added
material allows conversion of the mass information into thickness. In someinstances, where highest accuracy is required, it is necessary to make a density
calibration as outlined in section 7.2.
Because the flow of material from a deposition is not uniform, it is necessary to
account for the different amount of material flow onto the sensor compared to thesubstrates. This factor is accounted for in the tooling factor. The tooling factor canbe experimentally established by following the guidelines in section 7.3 on page
7-2.
If the Z-Ratio is not known, it could be estimated from the procedures outlined in
section 7.4 on page 7-3.

7.2 Determining Density
NOTE: The bulk density values retrieved from Table A-1 are sufficiently accurate
for most applications.
Follow the steps below to determine density value.
adjacent to the sensor, so that the same thickness will be accumulated on the
crystal and substrate.

2 Set density to the bulk value of the film material or to an approximate value.
3 Set Z-Ratio to 1.000 and tooling to 100%.
4 Place a new crystal in the sensor and make a short deposition(1000 to 5000 Å).

5 After deposition, remove the test substrate and measure the film thickness witheither a multiple beam interferometer or a stylus-type profilometer.

7–1

PN 074-550-P1E

1 Place a substrate (with proper masking for film thickness measurement)

SQC-310 Operating Manual

6 Determine the new density value with equation [1]:

 Tx 
3
Density  g  cm  = D 1  ------- T m

[1]

where:
D1 =Initial density setting

Tx =Thickness reading on SQC-310

Tm =Measured thickness

7 A quick check of the calculated density may be made by programming
SQC-310 with the new density value and observing that the displayed
thickness is equal to the measured thickness, provided that the thickness
displayed on SQC-310 has not been zeroed between the test deposition andentering the calculated density.
NOTE: Slight adjustment of density may be necessary in order to achieve Tx = Tm.

7.3 Determining Tooling
1 Place a test substrate in the system substrate holder.
2 Make a short deposition and determine actual thickness.
3 Calculate tooling from the relationship shown in equation [2]:PN 074-550-P1E

 T m
Tooling (%) = TF i  ------- Tx 

[2]

whereTm = Actual thickness at substrate holder
Tx = Thickness reading on SQC-310
TFi = Initial tooling factor

4 Round off percent tooling to the nearest 0.1%.
5 When entering this new value for tooling, Tm will equal Tx if calculations aredone properly.

NOTE: It is recommended that a minimum of three separate evaporations be
made when calibrating tooling. Variations in source distribution and othersystem factors will contribute to slight thickness variations. An averagevalue tooling factor should be used for final calibrations.

7–2

SQC-310 Operating Manual

7.4 Laboratory Determination of Z-Ratio
A list of Z-Ratios for materials commonly used are available in Table A-1. For othermaterials, Z can be calculated from the following formula:1-- d q  q 2

Z =  ------------ df f [3]

5

Z = 9.378  10  d f  f 

1
- --2

[4]

where:
df =Density (g/cm3) of deposited film



µf =

Shear modulus (dynes/cm2) of deposited film



dq =

Density of quartz (crystal) (2.649 g/cm3)



µq =

Shear modulus of quartz (crystal) (3.32 x 1011 dynes/cm2)

The densities and shear moduli of many materials can be found in a number ofhandbooks.
Laboratory results indicate that Z-Ratios of materials in thin-film form are very close
to the bulk values. However, for high stress producing materials, Z-Ratios of thinfilms are slightly smaller than those of the bulk materials. For applications that
require more precise calibration, the following direct method is suggested:

1 Establish the correct density value as described in section 7.2 on page 7-1.
frequency will be displayed on the SQC-310 Main screen.

3 Make a deposition on a test substrate such that the percent crystal life display
will read approximately 50%, or near the end of crystal life for the particularmaterial, whichever is smaller.

4 Stop the deposition and record the ending crystal frequency, Fc.
5 Remove the test substrate and measure the film thickness with either a multiple
beam interferometer or a stylus-type profilometer.

7–3

PN 074-550-P1E

2 Install a new crystal and record its starting frequency, Fco. The startingSQC-310 Operating Manual

6 Using the density value from step 1 and the recorded values for Fco and Fc,

adjust the Z-Ratio value in thickness equation [5] to bring the calculated
thickness value into agreement with the actual thickness. If the calculated valueof thickness is greater than the actual thickness, increase the Z-Ratio value. If
the calculated value of thickness is less than the actual thickness, decrease the
Z-Ratio value.
4

Z q  10  1
F co
F c 
1
T f = --------------------   -------- ATan  zTan  -----------  –  ----- ATan  zTan  ---------   F q    F c
 Fq  
2zp   F co[5]where:Tf =Thickness of deposited film (kÅ)



Fco =

Starting frequency of the sensor crystal (Hz)



Fc =

Final frequency of the sensor crystal (Hz)



Fq =

Nominal blank frequency = 6045000 (Hz)z

Z-Ratio of deposited film material



Zq =

Specific acoustic impedance of quartz = 8765000 (kg/(m2s)pDensity of deposited film (g/cm³)==

PN 074-550-P1E

For multiple layer deposition (for example, two layers), the Z-Ratio used for thesecond layer is determined by the relative thickness of the two layers. For mostapplications the following three rules will provide reasonable accuracies:


If the thickness of layer 1 is large compared to layer 2, use material 1 Z-Ratiofor both layers.



If the thickness of layer 1 is thin compared to layer 2, use material 2 Z-Ratio forboth layers.



If the thickness of both layers is similar, use a value for Z-Ratio which is theweighted average of the two Z-Ratios for deposition of layer 2 and subsequent
layers.

7–4

SQC-310 Operating Manual

7.5 Control Loop
The function of the control loop parameters is to match the SQC-310 reaction to anerror (between the measured deposition rate and the desired rate) to the time
related characteristics of the deposition source and its power supply. There arethree adjustable parameters; P(proportional), I(integral) and D(derivative) used toaccomplish this. It is convenient to think of sources as falling into two categories"fast" or "slow" (see section 7.5.1). The tuning parameters are affected by source
level, rate, sweep range or beam density, tooling and source condition.
The proportional gain (P-Term) parameter sets the rate at which the control voltagechanges in response to an error signal (see Figure 7-1). Any error in the ratecauses the source control voltage to ramp to a new value. When the source control
voltage increases or decreases to the correct value, the value required to achieve
the desired rate, the error goes to zero and the output remains constant. A higher
value for this term would be a more responsive (but potentially unstable) control
loop.

PN 074-550-P1E

Figure 7-1 Proportional Gain

7–5

SQC-310 Operating Manual

The integral time constant (I-Term) parameter is defined as the time difference
between the actual start of a change in rate and the time at which approximately
66% of the rate step is achieved. It can be estimated as twice the time for the rate
to go from 1/3 to 2/3 of the desired rate (see Figure 7-2.) A small value for this termcauses more error correction. A large value ignores any past errors unless the error
lasts for a long time.
Figure 7-2 Integral Time ConstantPN 074-550-P1E

The derivative time constant (D-Term) parameter is utilized to compensate for slow
responding sources such as boats and induction heated sources. This value isdefined as the time difference between a change in % power and the start of an
actual change in rate (see Figure 7-3.) The derivative time constant is used tomonitor the rate of change of an error. A value of zero for this term ignores the rateof change of the error. A large value is used for a slow source which will take longer
to develop a rate increase and longer to stop a rate increase.
Figure 7-3 Derivative Time Constant (Dead Time)

7–6

SQC-310 Operating Manual

7.5.1 Identifying a Fast or Slow Source
Classifying a source as being fast or slow is based on the time it takes for the rate
to change from a change in power (delay). It is straight forward to measure thedelay. Using manual power, establish a rate and allow it to become steady (refer to
Chapter 3, Operation for details). Increase the source power a few percent (~5% if
possible). Allow the source to again stabilize. If the delay time is greater than 1
second, the source is characterized as slow. Thermal sources, for example, areslow responding and typically free of noise transients. To avoid overshooting andconstantly seeking setpoint (see Figure 7-4) , slow sources may require
adjustments to the PID parameters of the control loop that anticipate their longdead time and slow response to changes.
All other sources are considered fast. In general, electron beam (e-beam) sources(unless a hearth liner is used), some very small filament sources, and sputtering
sources are considered fast sources. E-beam sources in particular, are often fast
responding and noisy. They are also subject to arcing, which can create large
electrical noise spikes which can make tuning the PID loop difficult. Fast sources
may only require adjustments to the P and I parameters of the control loop.

PN 074-550-P1E

Figure 7-4 Rate Control Behavior

7–7

SQC-310 Operating Manual

7.6 Control Loop Tuning Procedure
This section will help in adjusting SQC-310 PID control loop settings to achieve astable deposition process. Control loop tuning is a trial and error process and there
is no "best" procedure to accomplish this task. It may take several adjustments toachieve the desired tune. This section, assumes an understanding of Chapter 3,
Operation and proper setup of SQC-310 as described in Chapter 2, Installation.

1 Set System Parameters
In the System Menu:


Set Measurement Period to 0.25.



Set Rate Filter Alpha to 1 (no filtering) to see the noise of the system.



Set System Tooling to 100%.

Confirm Simulate Mode is Off.

2 Create a One-Layer Test Process
In the Film Menu:

Create a new film.

Enter the Zfactor (Z-Ratio) and the material Density.



Set Film Tooling to 100%.

PN 074-550-P1E

In the Process Menu:

Create a new process that has the new film as its only layer.



Set Init Rate to the desired rate.



Set Final Thickness to a large value to prevent the layer from completing.



Select the proper Sensor(s) and Source.



Leave the other layer parameters at the default values.

3 Test the Setup
In the Sensor Info. Menu:


Verify the Sensor Status is On and a stable frequency is displayed.

4 Using the SQC-310 Comm software, Activate data Logging.
NOTE: This step is optional. It is helpful for troubleshooting if there are any
issues while tuning the control loop.

5 Exit to the main screen and press Next Menu until the Auto/Manual button isdisplayed. Press Auto/Manual to enter Manual mode, then press Start Layer.

7–8

SQC-310 Operating Manual

6 Slowly rotate the control knob to a power of 10%, and verify that the power
supply output is about 10% of full scale. Continue to slowly rotate the control
knob until a rate near the desired setpoint is achieved.


Verify that the power supply output agrees with the SQC-310 Power (%)
reading. If the readings are not the same, check the wiring and verify thesource setup in the System menu. Confirm the Voltage Scale agrees with
the input specifications of the power supply.

7 With the power set so the rate is near the desired rate (Init Rate in the Quick
Edit menu), Press Next Menu then Next Graph until the Rate Deviation graphis displayed, and observe the noise.


If the system has significant short term noise at fixed power (approximately>10%), the control loop will be very difficult to adjust, especially at low rates.
It is better to eliminate the source of the noise before attempting to set the
PID values ( see section 6.1, Troubleshooting, on page 6-1.)

8 Select a new Filter Alpha
On the Quick Edit Menu:

Slowly decrease the filter Alpha from 1 to a lower value until the rate display
noise is minimized. If the Filter Alpha is set too low, the display will lag thetrue system response and may hide significant problems. A value of 0.5
equally weights the current reading and the previous filtered readings.

9 Determine Max PowerWith the desired rate at a stable reading, record the power (%) (PWRDR )value. Set the Max Power (%) to a value 20% higher than this value.

With the power (%) at the desired rate (PWRDR) recorded, slowly lower the
power(%) until the Rate (Å/s) reading is just at (or near) zero. Record thezero rate Power reading (PWR0R) or P-Term parameter.

11 Determine Open Loop Response Time

Calculate 1/3 of the desired rate (RATE1/3), and 2/3 of the desired rate
(RATE2/3) for this film.



Slowly increase the power (%) until Rate (Å/s) matches RATE1/3.



Quickly adjust Power (%) to PWRDR. Measure the time for the Rate (Å/s)
reading to reach RATE2/3.

NOTE: This may need to be done several times to get an average response
time. Displaying the Rate graph will also help.


7–9

Twice the measured time is the step response time (TIMESR) or the I-Termparameter.

PN 074-550-P1E

10 Determine Open Loop GainSQC-310 Operating Manual

NOTE: TIMESR is typically 0.2 to 1 seconds for e-beam evaporation, 5 to 20
seconds for thermal evaporation.
When finished, slowly decrease power until there is no rate.

12 Determine the Dead Time

Slowly increase the power (%) until the desired Rate (Å/s) is achieved.



Quickly adjust Power by 1 to 2% and measure the time between when the
power is changed and when a change in rate is observed.



The time between the change in power and when the rate starts to change
is the Dead time or D-Term parameter.

NOTE: It is common for the Dead Time of a fast source, such as an e-beam tobe very small and possibly immeasurable. In this case, the Dead Timecan be considered to be zero.
When finished, slowly decrease power to 0%.

13 Finalize Adjustments to PID Values according to control response

PN 074-550-P1E

Set source control from Manual to Auto to activate PID control and observe
the power. The power should rise from 0% and stabilize near PWRDR.


If there is more than 10% overshoot in power or if the curve appears
under damped, lower the P-Term. If the time to reach PWRDR isvery slow (over damped), increase the P-Term (see Figure 7-5.)



A lower I-Term will increase response for over damped sources. A
higher value may reduce ringing and rate deviations seen with
under damped sources (see Figure 7-5.)

The D-Term should not need much adjustment, but if under damped
behavior is observed, increase the value. If it appears over damped,
decrease the value (see Figure 7-5.)

7 – 10SQC-310 Operating Manual

Figure 7-5 Over/Under damped control curve (from a positive/negative step)Continue to adjust P and I Terms alternating between 0% power in Manualmode and Auto mode until the steady-state response is well controlled.
Ringing does not need to be completely removed during this step if thesteady-state response is smooth; preconditioning will minimize stepchanges.

When finished, slowly decrease power to 0%, and then press the Stop
button.



The power level recorded as PWR0R is the power where deposition justbegins. Use this value for Ramp 1 power in the Film Conds menu. Use aramp 1 time appropriate for conditioning the source type. For Ramp 2Power, use a power value that is slightly less than PWRDR. This will preventa large step change when entering the deposition phase.

Once PID terms are established for a material, they will typically be similar for othermaterials given the same system. Only the P-Term and preconditioning power
levels may need adjustment. For best results, repeat the control loop tuning foreach new material.
If adjustment to the P-Term is not sufficient for limiting response, Slew Rate canfurther limit aggressive power changes. Slew rate is Power (%) of full scale persecond. At rates below 10 Å/s, a slew rate of 1-2% per second is common for
e-beam systems. Decreasing the Filter Alpha will also limit the PID control loop
response to occasional large noise spikes, such as those seen from arcing.

7 – 11PN 074-550-P1E

14 Determining Preconditioning Settings

SQC-310 Operating Manual

Chapter 8
Measurement Theory
8.1 Basics
The quartz crystal deposition monitor, or QCM, utilizes the piezoelectric sensitivityof a quartz monitor crystal to added mass. The QCM uses this mass sensitivity tocontrol the deposition rate and final thickness of a vacuum deposition.
When a voltage is applied across the faces of a properly shaped piezoelectric
crystal, the crystal is distorted and changes shape in proportion to the applied
voltage. At certain discrete frequencies of applied voltage, a condition of very sharp
electro-mechanical resonance is encountered.
When mass is added to the face of a resonating quartz crystal, the frequency ofthese resonances is reduced. This change in frequency is very repeatable and isprecisely understood for specific oscillating modes of quartz. This heuristicallyeasy-to-understand phenomenon is the basis of an indispensable measurement
and process control tool that can easily detect the addition of less than an atomic
layer of an adhered foreign material.
In the late 1950s it was noted by Sauerbrey1,2 and Lostis3 that the change infrequency, F = Fq-Fc, of a quartz crystal with coated (or composite) and uncoatedfrequencies, Fc and Fq respectively, is related to the change in mass from theadded material, Mf , as follows:

PN 074-550-P1E

MF -------f = ----------Mq
Fq[1]

where Mq is the mass of the uncoated quartz crystal. Simple substitutions
lead to the equation that was used with the first frequency measurement
instruments: F -
Tf = K--------------df[2]

where the film thickness, Tf, is proportional (through K) to the frequency change,
F, and inversely proportional to the density of the film, df. The constant,
K = Natdq/Fq2; where dq (= 2.649 g/cm3) is the density of single crystal quartz andNat (=166100 Hz cm) is the frequency constant of AT cut quartz. A crystal with astarting frequency of 6.0 MHz will display a reduction of its frequency by 2.27 Hz
when 1 angstrom of Aluminum (density of 2.77 g/cm3) is added to its surface. In
1. G. Z. Sauerbrey, Phys. Verhand .8, 193 (1957)
2. G. Z. Sauerbrey, Z. Phys. 155,206 (1959)
3. P. Lostis, Rev. Opt. 38,1 (1959)

8–1

SQC-310 Operating Manual

this manner the thickness of a rigid adlayer is inferred from the precise
measurement of the crystal frequency shift. The quantitative knowledge of thiseffect provides a means of determining how much material is being deposited on asubstrate in a vacuum system, a measurement that was not convenient or practicalprior to this understanding.

8.1.1 Monitor Crystals
No matter how sophisticated the electronics surrounding it, the essential device ofthe deposition monitor is the quartz crystal. The quartz resonator displayed in
Figure 8-1 has a frequency response spectrum that is schematically displayed in
Figure 8-2. The ordinate represents the magnitude of response, or current flow of
the crystal, at the specified frequency.
Figure 8-1 Quartz resonator

1.4 cm (0.55 in.)R+

The responses located slightly higher in frequency are called anharmonics; they
are a combination of the thickness shear and thickness twist modes. The responseat about three times the frequency of the fundamental is called the third
quasiharmonic. There is also a series of anharmonics slightly higher in frequency
associated with the quasiharmonic.
The monitor crystal design depicted in Figure 8-1 is the result of several significant
improvements from the square crystals with fully electroded plane parallel facesthat were first used.
The first improvement was to use circular crystals. This increased symmetry
greatly reduced the number of allowed vibrational modes. The second set of
improvements was to contour one face of the crystal and to reduce the size of theexciting electrode. These improvements have the effect of trapping the acoustic
energy. Reducing the electrode diameter limits the excitation to the central area.

8–2

PN 074-550-P1E

The lowest frequency response is primarily a thickness shear mode that is called
the fundamental. The characteristic movement of the thickness shear mode is fordisplacement to take place parallel to the major monitor crystal faces. In otherwords, the faces are displacement antinodes as displayed in Figure 8-3.

SQC-310 Operating Manual

Contouring dissipates the energy of the traveling acoustic wave before it
reaches the edge of the crystal. Energy is not reflected back to the center where it
can interfere with other newly launched waves, essentially making a small crystal
appear to behave as though it is infinite in extent. With the crystal vibrations
restricted to the center, it is practical to clamp the outer edges of the crystal toa holder and not produce any undesirable effects.
Contouring also reduces the intensity of response of the generally unwanted
anharmonic modes; hence, the potential for an oscillator to sustain an unwanted
oscillation is substantially reduced.

1
10

6

7

17

18.133 MHz 350 ohm

17.957 MHz 311 ohm

17.792 MHz 278 ohm

6.419 MHz 350 ohm

6.333 MHz 142 ohm
6.337 MHz 105 ohm
6.348 MHz 322 ohm

11000

6.153 MHz 50 ohm
6.194 MHz 40 ohm

1100

5.981 MHz 15 ohm

Log of relative intensity (Admittance)

Figure 8-2 Frequency response spectrum

18

PN 074-550-P1E

Frequency (in MHz)The use of an adhesion layer has improved the electrode-to-quartz bonding,
reducing rate spikes caused by micro-tears between the electrode and thequartz as film stress rises. These micro-tears leave portions of the deposited film
unattached and therefore unable to participate in the oscillation. These free
portions are no longer detected and the wrong thickness consequently inferred.
The AT resonator is usually chosen for deposition monitoring because at room
temperature it can be made to exhibit a very small frequency change due totemperature changes. Since there is presently no way to separate the frequencychange caused by added mass (which is negative) or even the frequency changes
caused by temperature gradients across the crystal or film induced stresses, it isessential to minimize these temperature-induced changes. It is only in this way that
small changes in mass can be measured accurately.

8–3

SQC-310 Operating Manual

Figure 8-3 Thickness shear displacement

E

X2

Displacement node

X
1
X
3

8.1.2 Period Measurement Technique
Although instruments using equation [2] were very useful, it was soon noted they
had a very limited range of accuracy, typically holding accuracy for F less than
0.02 Fq. In 1961, it was recognized by Behrndt4 that:M Tc – Tq  F 
-------f = ---------------------= ----------Tq
Mq
Fc

[3]

The period measurement technique was the outgrowth of two factors; first, thedigital implementation of time measurement, and second, the recognition of themathematically rigorous formulation of the proportionality between the crystal
thickness, Iq, and the period of oscillation, Tq = 1/Fq.
Electronically, the period measurement technique uses a second crystal oscillator,
or reference oscillator, not affected by the deposition and usually much higher infrequency than the monitor crystal. This reference oscillator is used to generatesmall precision time intervals which are used to determine the oscillation period of
the monitor crystal. This is done by using two pulse accumulators. The first is used
to accumulate a fixed number of cycles, m, of the monitor crystal. The second isturned on at the same time and accumulates cycles from the reference oscillator
until m counts are accumulated in the first.

4. K. H. Behrndt, J. Vac. Sci. Technol. 8, 622 (1961)

8–4

PN 074-550-P1E

where Tc and Tq are the periods of oscillation of the crystal with film (composite)
and the bare crystal respectively.

SQC-310 Operating Manual

Since the frequency of the reference is stable and known, the time to accumulate
the m counts is known to an accuracy equal to ± 2/Fr where Fr is the reference
oscillator frequency. The monitor crystal period is (n/Fr)/m where n is the numberof counts in the second accumulator. The precision of the measurement isdetermined by the speed of the reference clock and the length of the gate time
(which is set by the size of m). Increasing one or both of these leads to improved
measurement precision. Having a high frequency reference oscillator is important
for rapid measurements (which require short gating times), low deposition rates
and low density materials.

8.1.3 Z-Match Technique
After learning of fundamental work by Miller and Bolef 5, which rigorously treatedthe resonating quartz and deposited film system as a one-dimensional continuous
acoustic resonator, Lu and Lewis6 developed the simplifying Z-Match™ equationin 1972. Advances in electronics taking place at the same time, namely the
micro-processor, made it practical to solve the Z-Match equation in “real-time.”
Most deposition process controllers sold today use this sophisticated equation thattakes into account the acoustic properties of the resonating quartz and film system
as shown in equation [4].

PN 074-550-P1E

N at d q  Fq – Fc 
T f =  ------------------ arctan  Z tan ------------------------- Fqd f F c Z[4]

where Z=(dquq/dfuf)1/2 is the acoustic impedance ratio and uq and uf are the shear
moduli of the quartz and film, respectively. Finally, there was a fundamental
understanding of the frequency-to-thickness conversion that could yieldtheoretically correct results in a time frame that was practical for process control.
To achieve this new level of accuracy requires only that the user enter an additional
material parameter, Z, for the film being deposited. This equation has been tested
for a number of materials, and has been found to be valid for frequency shifts
equivalent to Ff = 0.4Fq. Keep in mind that equation [2] was valid to only 0.02Fq
and equation [3] was valid only to ~0.05Fq.

5. J. G. Miller and D. I. Bolef, J. Appl. Phys. 39, 5815, 4589 (1968)
6. C. Lu and O. Lewis, J Appl. Phys. 43, 4385 (1972)

8–5

SQC-310 Operating Manual

Appendix A
Material Table
A.1 Introduction
The following Table A-1 represents the density and Z-Ratio for various materials.
The list is alphabetical by chemical formula.

CAUTION
Some of these materials are toxic. Please consult
the material safety data sheet and safety instructions
before use.
An * is used to indicate that a Z-Ratio has not been established for a certain
material. A value of 1.000 is defaulted in these situations.

A–1

FormulaDensity

Z-Ratio

Material Name

Ag

10.5000.529

silver

AgBr

6.470

1.180

silver bromide

AgCl

5.560

1.320

silver chloride

Al

2.700

1.080

aluminum

Al2O3

3.970

0.336

aluminum oxide

Al4C3

2.360

*1.000aluminum carbide

AIF3

3.070

*1.000aluminum fluoride

AIN

3.260

*1.000aluminum nitride

AlSb

4.360

0.743

aluminum antimonide

As

5.730

0.966

arsenic

As2Se34.750*1.000arsenic selenideAu

19.300

0.381

gold

B

2.370

0.389

boron

B 20 31.820*1.000boron oxide

B 4C

2.370

*1.000boron carbide

BN

1.860

*1.000boron nitride

Ba

3.500

2.100

barium

BaF2

4.886

0.793

barium fluoride

PN 074-550-P1E

Table A-1 Material TableSQC-310 Operating Manual

PN 074-550-P1E

Table A-1 Material Table (continued)

FormulaDensity

Z-Ratio

Material NameBaN2O6

3.244

1.261

barium nitrate

BaO

5.720

*1.000barium oxide

BaTiO3

5.999

0.464

barium titanate (tetr)

BaTiO3

6.035

0.412

barium titanate (cubic)

Be

1.850

0.543

beryllium

BeF2

1.990

*1.000beryllium fluoride

BeO

3.010

*1.000beryllium oxide

Bi

9.800

0.790

bismuth

Bi2O3

8.900

*1.000

bismuth oxide

Bi2S3

7.390

*1.000

bismuth trisulfide

Bi2Se36.820*1.000

bismuth selenide

Bi2Te37.700*1.000

bismuth telluride

BiF3

5.320

*1.000

bismuth fluoride

C

2.250

3.260

carbon (graphite)

C

3.520

0.220

carbon (diamond)C 8H 81.100*1.000parlyene (union carbide)

Ca

1.550

2.620

calcium

CaF2

3.180

0.775

calcium fluoride

CaO

3.350

*1.000calcium oxide

CaO-SiO2

2.900*1.000calcium silicate (3)

CaSO4

2.962

0.955

calcium sulfate

CaTiO34.100*1.000calcium titanate

CaWO4

6.060

*1.000calcium tungstate

Cd

8.640

0.682

cadmium

CdF2

6.640

*1.000

cadmium fluoride

CdO

8.150

*1.000

cadmium oxide

CdS

4.830

1.020

cadmium sulfide

CdSe

5.810

*1.000

cadmium selenide,

CdTe

6.200

0.980

cadmium telluride

Ce

6.780

*1.000cerium

CeF3

6.160

*1.000cerium (iii) fluoride

CeO2

7.130

*1.000cerium (iv) dioxide

Co

8.900

0.343

cobaltA–2

SQC-310 Operating Manual

A–3

FormulaDensity

Z-Ratio

Material Name

CoO

6.440

0.412

cobalt oxide

Cr

7.200

0.305

chromium

Cr2O3

5.210

*1.000chromium (iii) oxide

Cr3C2

6.680

*1.000chromium carbide

CrB

6.170

*1.000chromium boride

Cs

1.870

*1.000cesium

Cs2SO4

4.243

1.212

cesium sulfate

CsBr

4.456

1.410

cesium bromide

CsCI

3.988

1.399

cesium chloride

CsI

4.516

1.542

cesium iodide

Cu

8.930

0.437

copper

Cu2O

6.000

*1.000copper oxide

Cu2S

5.600

0.690

copper (i) sulfide (alpha)

Cu2S

5.800

0.670

copper (i) sulfide (beta)

CuS

4.600

0.820

copper (ii) sulfide

Dy

8.550

0.600

dysprosium

DY2O3

7.810

*1.000dysprosium oxide

Er

9.050

0.740

erbium

Er2O3

8.640

*1.000erbium oxide

Eu

5.260

*1.000europium

EuF2

6.500

*1.000europium fluoride

Fe

7.860

0.349

iron

Fe2O3

5.240

*1.000iron oxide

FeO

5.700

*1.000iron oxide

FeS

4.840

*1.000iron sulfide

Ga

5.930

0.593

gallium

Ga2O3

5.880

*1.000gallium oxide (b)

GaAs

5.310

1.590

gallium arsenide

GaN

6.100

*1.000gallium nitride

GaP

4.100

*1.000gallium phosphide

GaSb

5.600

*1.000gallium antimonide

Gd

7.890

0.670

gadolinium

Gd2O3

7.410

*1.000gadolinium oxide

PN 074-550-P1E

Table A-1 Material Table (continued)

SQC-310 Operating Manual

PN 074-550-P1E

Table A-1 Material Table (continued)

FormulaDensity

Z-Ratio

Material Name

Ge

5.350

0.516

germanium

Ge3N2

5.200

*1.000germanium nitride

GeO2

6.240

*1.000germanium oxide

GeTe

6.200

*1.000germanium tellurideHf

13.0900.360

hafnium

HfB2

10.500*1.000hafnium boride

HfC

12.200*1.000hafnium carbide

HfN

13.800*1.000hafnium nitride

HfO2

9.680

*1.000hafnium oxide

HfSi2

7.200

*1.000hafnium silicideHg

13.4600.740

mercury

Ho

8.800

0.580

holmium

Ho2O3

8.410

*1.000holmium oxide

In

7.300

0.841

indium

In2O3

7.180

*1.000

indium sesquioxide

In2Se35.700*1.000

indium selenide

In2Te35.800*1.000

indium telluride

InAs

5.700

*1.000

indium arsenide

InP

4.800

*1.000

indium phosphide

InSb

5.760

0.769

indium antimonide

Ir

22.4000.129

iridiumK

0.860

10.189potassium

KBr

2.750

1.893

potassium bromide

KCI

1.980

2.050

potassium chloride

KF

2.480

*1.000potassium fluoride

KI

3.128

2.077

potassium iodide

La

6.170

0.920

lanthanum

La2O3

6.510

*1.000lanthanum oxide

LaB6

2.610

*1.000lanthanum boride

LaF3

5.940

*1.000lanthanum fluoride

Li

0.530

5.900

lithium

LiBr

3.470

1.230

lithium bromide

LiF

2.638

0.778

lithium fluoride

A–4

SQC-310 Operating Manual

A–5

FormulaDensity

Z-Ratio

Material Name

LiNbO3

4.700

0.463

lithium niobate

Lu

9.840

*1.000lutetium

Mg

1.740

1.610

magnesium

MgAl2O4

3.600*1.000magnesium aluminate

MgAl2O6

8.000*1.000spinel

MgF2

3.180

0.637

magnesium fluoride

MgO

3.580

0.411

magnesium oxide

Mn

7.200

0.377

manganese

MnO

5.390

0.467

manganese oxide

MnS

3.990

0.940

manganese (ii) sulfide

Mo

10.2000.257

molybdenum

Mo2C

9.180

*1.000molybdenum carbide

MoB2

7.120

*1.000molybdenum boride

MoO3

4.700

*1.000molybdenum trioxide

MoS2

4.800

*1.000molybdenum disulfide

Na

0.970

4.800

sodiumNa3AIF6

2.900*1.000cryolite

Na5Al3F14

2.900*1.000chiolite

NaBr

3.200

*1.000sodium bromide

NaCl

2.170

1.570

sodium chloride

NaCIO3

2.164

1.565

sodium chlorate

NaF

2.558

1.645

sodium fluoride

NaNO3

2.270

1.194

sodium nitrate

Nb

8.578

0.492

niobium (columbium)

Nb2O3

7.500

*1.000niobium trioxide

Nb2O5

4.470

*1.000niobium (v) oxide

NbB2

6.970

*1.000niobium boride

NbC

7.820

*1.000niobium carbide

NbN

8.400

*1.000niobium nitride

Nd

7.000

*1.000neodymium

Nd2O3

7.240

*1.000neodymium oxide

NdF3

6.506

*1.000neodymium fluoride

Ni

8.910

0.331

nickel

PN 074-550-P1E

Table A-1 Material Table (continued)

SQC-310 Operating Manual

PN 074-550-P1E

Table A-1 Material Table (continued)

FormulaDensity

Z-Ratio

Material Name

NiCr

8.500

*1.000nichrome

NiCrFe8.500*1.000

Inconel

NiFe

8.700

*1.000permalloy

NiFeMo8.900*1.000supermalloy

NiO

7.450

*1.000nickel oxide

P 3N 52.510*1.000phosphorus nitridePb

11.300

1.130

lead

PbCl2

5.850

*1.000lead chloride

PbF2

8.240

0.661

lead fluoride

PbO

9.530

*1.000lead oxide

PbS

7.500

0.566

lead sulfide

PbSe

8.100

*1.000lead selenide

PbSnO38.100*1.000lead stannate

PbTe

8.160

0.651

lead telluridePd

12.0380.357

palladium

PdO

8.310

*1.000palladium oxide

Po

9.400

*1.000polonium

Pr

6.780

*1.000praseodymium

Pr2O3

6.880

*1.000praseodymium oxidePt21.4000.245

platinum

PtO2

10.200*1.000

platinum oxide

Ra

5.000

*1.000radium

Rb

1.530

2.540

rubidium

RbI

3.550

*1.000rubidium iodide

Re

21.0400.150

rheniumRh

12.4100.210

rhodiumRu

12.362

0.182

ruthenium

S8

2.070

2.290

sulfur

Sb

6.620

0.768

antimony

Sb2O3

5.200

*1.000antimony trioxide

Sb2S3

4.640

*1.000antimony trisulfide

Sc

3.000

0.910

scandium

Sc2O3

3.860

*1.000scandium oxide

A–6

SQC-310 Operating Manual

A–7

FormulaDensity

Z-Ratio

Material Name

Se

4.810

0.864

selenium

Si

2.320

0.712

silicon

Si3N4

3.440

*1.000silicon nitride

SiC

3.220

*1.000silicon carbide

SiO

2.130

0.870

silicon (ii) oxide

SiO2

2.648

1.000

silicon dioxide

Sm

7.540

0.890

samarium

Sm2O3

7.430

*1.000samarium oxide

Sn

7.300

0.724

tin

SnO2

6.950

*1.000tin oxide

SnS

5.080

*1.000tin sulfide

SnSe

6.180

*1.000tin selenide

SnTe

6.440

*1.000tin telluride

Sr

2.600

*1.000strontium

SrF2

4.277

0.727

strontium fluoride

SrO

4.990

0.517

strontium oxide

Ta16.6000.262

tantalum

Ta2O5

8.200

0.300

tantalum (v) oxide

TaB2

11.150*1.000tantalum boride

TaC

13.900*1.000tantalum carbide

TaN

16.300*1.000tantalum nitride

Tb

8.270

0.660

terbiumTc

11.500*1.000technetium

Te

6.250

0.900

tellurium

TeO2

5.990

0.862

tellurium oxideTh

11.694

0.484

thorium

ThF4

6.320

*1.000thorium (iv) fluoride

ThO2

9.860

0.284

thorium dioxide

ThOF2

9.100

*1.000thorium oxyfluoride

Ti

4.500

0.628

titanium

Ti203

4.600

*1.000titanium sesquioxide

TiB2

4.500

*1.000titanium boride

TiC

4.930

*1.000titanium carbide

PN 074-550-P1E

Table A-1 Material Table (continued)

SQC-310 Operating Manual

PN 074-550-P1E

Table A-1 Material Table (continued)

FormulaDensity

Z-Ratio

Material Name

TiN

5.430

*1.000titanium nitride

TiO

4.900

*1.000titanium oxide

TiO2

4.260

0.400

titanium (iv) oxide

TI

11.8501.550

thallium

TIBr

7.560

*1.000thallium bromide

TICI

7.000

*1.000thallium chloride

TII

7.090

*1.000thallium iodide (b)U

19.0500.238

uranium

U 3O 88.300*1.000

tri uranium octoxide

U 4O 910.9690.348

uranium oxide

UO2

10.970

0.286

uranium dioxide

V

5.960

0.530

vanadium

V 2O 53.360*1.000

vanadium pentoxide

VB2

5.100

*1.000

vanadium boride

VC

5.770

*1.000

vanadium carbide

VN

6.130

*1.000

vanadium nitride

VO2

4.340

*1.000

vanadium dioxide

W19.3000.163

tungsten

WB2

10.770*1.000tungsten borideWC

15.6000.151

tungsten carbide

WO3

7.160

*1.000tungsten trioxide

WS2

7.500

*1.000tungsten disulfide

WSi2

9.400

*1.000tungsten silicide

Y

4.340

0.835

yttrium

Y 20 35.010*1.000yttrium oxide

Yb

6.980

1.130

ytterbium

Yb2O3

9.170

*1.000ytterbium oxide

Zn

7.040

0.514

zinc

Zn3Sb26.300*1.000zinc antimonide

ZnF2

4.950

*1.000zinc fluoride

ZnO

5.610

0.556

zinc oxide

ZnS

4.090

0.775

zinc sulfide

ZnSe

5.260

0.722

zinc selenide

A–8

SQC-310 Operating Manual

Table A-1 Material Table (continued)

Density

Z-Ratio

Material Name

ZnTe

6.340

0.770

zinc telluride

Zr

6.490

0.600

zirconium

ZrB2

6.080

*1.000zirconium boride

ZrC

6.730

0.264

zirconium carbide

ZrN

7.090

*1.000zirconium nitride

ZrO2

5.600

*1.000zirconium oxide

PN 074-550-P1E

Formula

A–9

PN 074-550-P1E

SQC-310 Operating Manual®
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