New Product Introduction
Guide 2019

New products and portfolio extensions offering
technology improvements and package innovations
for Automotive, Portable Devices, Computing,Industrial and Consumer.

Portfolio extension and focused segments 2019

MOSFETs

Diodes & Bipolar
Transistors

New Product Introduction 2019

Automotive

Portable Devices

Logic

Consumer

Page

X

X

4

X

Recovery Rectifier in CFP packages

X

X

5

SiGe Rectifier in CFP packages

X

X

6

BJTs in DPAK

X

X

X

7

Zener in SOT323

X

X

X

X

8

P-channel MOSFETs in LFPAK

X

X

X

X

10

Small signal low RDSon MOSFETs

X

X

X

X

11

MOSFETs in DFN0606

X

X

12

MOSFETs in WLCSP

X

X

13

Trench 9 Automotive MOSFETs in LFPAK

X

14

Trench 6 Automotive MOSFETs in LFPAK33

X

15
X

X

X

16

NextPower 100V

X

17

NextPowerS3 40V LFPAK88

X

18

X

74AXPnT245 - tranceiver

ESD & TVS

Industrial

Trench Schottkys in CFP packages

NextPowerS3 low RDSon 25V & 30V

2

Computing

X

X

20

GX4 MicroPak

X

21

74AVC1T8xxx Qualcomm

X

22
X

X

X

23

X

X

X

X

24

TrEOS 1 & 2 High-Speed ESD Protection in µCSP

X

X

X

27

Super-Speed Common Mode Filter in WLCSP

X

X

X

28

Mobile Surge Protection in ultra compact packages

X

X

X

29

LV-A logic Family
Autosense translators NXB/NXS(X)MicroPak packages AEC-Q100 qualified

X

In-Vehicle Network (IVN) protection

Nexperia NPI Guide 2019

X

25

30

Diodes &Bipolar Transistors

Trench Schottkys in CFP packages
Well balanced Schottky rectifier with respect to forward voltage (VF) versus reverse current (IR)Design benefit••••

Functions & applications

Smallest form factor, PCB space saving
Highest efficency by electrical peformance
Improved thermal robustness - reduced risk of thermal
runaway
Best balance between forward voltage and reverse current

Key technical features & portfolio
•
•
•
•

4

Voltage

Current

Package

PMEG40Txx

40 V

Up to 5 A

CFP3, CFP5

PMEG045T0xx

45 V

Up to 15 A

CFP15

PMEG60Txx
PMEG060Txx

60 V

Up to 5 A

CFP3, CFP5,
CFP15B

Nexperia NPI Guide 2019

•
•
•
•

Rectification in power supply(e.g. USB/PD)
DCDC conversion
Reverse battery protection
Or-ing (several supply sources)
Free wheeling diodeApplication diagram

New portfolio with 60V & 100V Trench Schottkys
AEC-Q101 qualified (175°C Tj)
Existing portfolio offers up to 15 A forward current
SOD123W (CFP3), SOD128 (CFP5) and SOT1289B(CFP15B)
Portfolio•e.g. Power Supply - AC/DC conversion rectification

Available packages (W x L x H in mm)
CFP3(SOD123W)

CFP5(SOD128)

CFP15B(SOT1289B)

2.6 x 1.7 x 1.0

3.8 x 2.5 x 1.8

6.5 x 4.3 x 0.95

Diodes & Bipolar
Transistors

Automotive
qualifiedRecovery Rectifier in CFP packages
Standard, ultrafast and hyperfast Recovery Rectifier in state-of-the-art CFP packages

Design benefit
•
•
•
•
•
•
•
•

Functions & applications

High speed switching capability
Low voltage drop (VF @ IF max ~ 1V)
Low leakage current, also at high temperature
High power density/high efficiency planar technology
Flat package design (package height typ 1mm)
Minimized occupation area for shrinked design
High current pulse capability due to clip-bond technology
Low magnetic inductance for optimum switching behavior

Key technical features & portfolio
•
•
•
•

5

Voltage

Current

Package

PNE200x0ER

200 V

Up to 2 A

CFP3

PNE200x0EP

200 V

Up to 3 A

CFP5Nexperia NPI Guide 2019

Polarity protection
DC/DC conversion
AC/DC conversion
Freewheeling of inductive load
Standard switching application
High-speed switching application

Application diagram
e.g. Power Supply - AC/DC conversion rectification

Hyperfast recovery rectifiers available
CFP packages offering optimized performance
Further portfolio under development
AEC-Q101 qualified
Portfolio

•
•
•
•
•
•

Available packages (W x L x H in mm)
CFP3(SOD123W)

CFP5(SOD128)

2.6 x 1.7 x 1.0

3.8 x 2.5 x 1.8

Diodes & Bipolar
Transistors

Automotive
qualifiedSiGe Rectifier in CFP packages
Silicon Germanium Schottky rectifier with superior thermal stability and well balanced efficiency

Design benefit
•
•
•
•
•
•
•
•

Functions & applications

Thermal stability up to 175°C junction temperature
No thermal runaway up to 175°C with full load
Extended safe operating area
Forward voltage <0.8V (@ 25°C) and reverse current <1nA
Fast and soft recovery behavior
CFP packages with optimized performance
Reduced IR compared to silicon based Schottky diodes
Reduced VF compared to Recovery Rectifiers

Key technical features & portfolio
•
•
•
•

•
•
•
•
•

Available packages (W x L x H in mm)

High efficiency applications
High temperature applications
Freewheeling diode (buck/boost
converter)
Reverse polarity protection
OR-ingApplication diagram
e.g. Freewheeling diode in buck/boost
converter

New SiGe technology with benchmark performance
Further portfolio roll out planned
Reverse voltages up to 200V
AEC-Q101 qualified

60-80V

40-60V
Portfolio

6

Voltage

Current

Package

PMEGxx0Gx0ELR

120 – 200 V

Up to 2 A

CFP3PMEGxx0Gx0ELP

120 – 200 V

Up to 3 A

CFP5Nexperia NPI Guide 2019

CFP3
(SOD123W)

CFP5(SOD128)

2.6 x 1.7 x 1.0

3.8 x 2.5 x 1.8

Diodes & Bipolar
Transistors

Automotive
qualifiedBJTs in DPAK
Introducing DPAK to Nexperia‘s power BJT portfolio as complementary solution to the advanced LFPAKDesign benefit
•
•
•
•
•
•

Functions & applications

Complementary market standard DPAK portfolio
Compatible to well known MJD seriesHigh power dissipation (Ptot)
Suitable for high temperature applications (175°C)
High reliability & mechanical ruggedness through gull wingleads
Advanced thermal behavior due to heatsink

Linear operation
Robust bipolar technology
175°C junction temperature
Addition to clip-bonded LFPAK BJT family
LFPAK portfolio ranging up to 15 A and 100 V
Standard qualified version and AEC-Q101 qualified
Portfolio

7

Voltage

Current

Polarity

MJD3xCx

100 V

3A

NPN & PNP

MJD4xH11x

80 V

8A

NPN & PNP

MJD3xCx-A

100 V

3A

NPN & PNP

MJD4xH11x-A

80 V

8A

NPN & PNP

Nexperia NPI Guide 2019

LED automotive lighting
Backlight dimming in LCD displays
Linear voltage regulator
Relay replacement
Cost efficient motor drive
Laser PrinterMOSFET driver

Application diagram

Key technical features & portfolio
•
•
•
•
•
•

•
•
•
•
•
•
•

e.g. Voltage stabilization for vehicle
dashboard
12V

Controller

Dashboard

Available packages (W x L x H in mm)
DPAK(SOT428)

6.6 x 6.1 x 2.3

Diodes & Bipolar
Transistors

Automotive
qualifiedZener in SOT323
Portfolio extension at the one-stop-shop for discretes

Design benefit
•
•
•
•
•

Functions & applications

Complete series of Zener diodes
Industrial standard E24 voltage range
Expanding widely used Zener series to an additional
package
Suitable for wave soldering and reflow soldering
reduce footprint & height compared to SOT23 solution•••

General voltage regulation
Voltage reference
Voltage stabilization

Available packages (W x L x H in mm)
SOT323

1.25 x 2 x 0.95

Key technical features & portfolio
•
•
•
•
•

Reverse voltage range VZ: 2.4V – 75V
Forward current IF max 200 mA
Reverse power dissipation PZSM max 40W
1 series with European spec with B- & C- selection
AEC-Q101 qualified

•

#
types

VZ
tolerance

VZ
nom.
[V]

IF max
[mA]

PZSM
[W]

Ptot
[mW]

C-series(BZX84WCxx)

37

±5%

2.4
75

200

40

275

B-series(BZX84WBxx)

37

±2%

2.4
75

200

40

275

Series8

Application diagram

Nexperia NPI Guide 2019

Voltage stabilization

Diodes & Bipolar
Transistors

Automotive
qualifiedMOSFETsAutomotive
qualifiedP-channel MOSFETs in LFPAKThis program includes a series of P-channel MOSFETs in the popular LFPAK56 package

•
•
•
•
•

Functions & applications

For high side drive no charge pump required
Simple interface drive circuit
Proven package technology LFPAK56 (SOT669)
100% footprint compatible to Power-SO8
Superior reliability and quality•••

Key technical features & portfolio••••

Application diagram

Suitable for high temperature application - 175 °C Tj max
Automotive quality grade (AEC-Q101) available
Low RDSon version available
Portfolio expansion planned
RDSon max (mΩ) @ VGS
=

VDS

VGS

(V)

(V)

20

12

~6.5

-

20

12

~11

BUK6Y12-30P

PSMP012-30YE

30

20

12

BUK6Y20-30P

PSMP020-30YE

30

20

20

BUK6Y15-40P

PSMP015-40YE

40

20

15

BUK6Y25-40P

PSMP025-40YE

40

20

25

BUK6Y32-60P

PSMP032-60YE

60

20

32

BUK6Y57-60P

PSMP057-60YE

60

20

57

Automotive

Industrial

BUK4YxRx-20P-

BUK4Yxx-20P

10 Nexperia NPI Guide 2019

Reverse battery protection
Load switch: high-side switch in low
frequency, EMC sensitive applications
Buck converter for low power nonisolated point of loads

10 V

4.5 V

•
•

Reverse battery protection
Power switch

Available packages (W x L x H in mm)
LFPAK56(SOT669)

4.7 x 5.3 x 1.05

MOSFETs

Design benefit

Automotive
qualified

Small signal low RDSon MOSFETs

This program includes a comprehensive portfolio of automotive small signal low RDSon MOSFETs (<1 Ohm)

•
•
•
•

Functions & applications

Largest portfolio of automotive small signal low RDSon
MOSFETs on the market
Full automotive complience (AEC-Q101)
growing portfolio in leaded and DFN packages
Products available with 175 °C Tj max

Key technical features & portfolio•••

Application diagram

Most parts with ESD robustness of 2kV
RDSon down to 15 mΩ and up to 6 A max drain current
Available VDS voltages of 20, 30, 40, 60, 70, 80 Volt
part number

packagepolarity

PMNxxx(x)EN(E)ASOT457N

PMNxxxP(E)ASOT457P

PMVxx(x)xN(E)A

SOT23

N

PMVxx(x)xP(E)A

SOT23

P

PMPBxxxN(E)ASOT1220N

PMPBxxxP(E)ASOT1220PBUKxDxx-x0E

SOT1220NBUK6Dxx(x)-x0P

SOT1220

P

PMTxxxENEA

SOT223N

11 Nexperia NPI Guide 2019

Load switches in power management
functions of:• Body control units like doors, window
lift, seat control …
• Entertainment systems• Safety and control systems like air bag,
LED lighting …

•

Automotive LED lighting with
PMPB215ENEA in DFN2020MD-6(NXP_reference design)

M
CU

Available packages (W x L x H in mm)
Package

SOT223

SOT457

SOT323

DFN2020MD-6(SC-73)(SC-74)(SC-70)(SOT1220)

Size (mm)6.5 x 3.5 x
1.65

2.9 x 1.5 x
1.0

2.0 x 1.25 x
0.95

2.0 x 2.0 x
0.65

Ptot (mW)

1700

600

200

1250

MOSFETs

Design benefit

MOSFETs in DFN0606
Smallest package with 0.35 mm pitch

•
•
•
•

Functions & applications

Same performance as larger package on smallest
footprint.
Ideal for mobile and space-constraint application
Broad portfolio in N-channel and P-channel
2N7002 functionality in DFN0606

•
•
•
•

Mobile phone
Wearable, portable devices
Cell phone accessories
E-cigarrete

Available packages (W x L x H in mm)
DFN0606

0.62 x 0.62 x 0.37

Key technical features & portfolio••••

Application diagram

Leadless ultra small package DFN0606-3
Lowest RDSon in the market (in development) down to 170mΩ
Low voltage drive (VGS(th) = 0.7 V typ)
Voltage range of 20 V to 60 V
polpart
number

PMH600UNE

VDS

VGS

VGSth

VGSth

ESD

@ VGS: 4.5 V (V)

(V)

min
(V)

max
(V)

robustness
(kV)

470

20

8

0.45

0.95

1

PMH550UNE

550

30

8

0.45

0.95

2

NX7002BKH

2500

60

20

1.10

1.20

2

1020

20

8

0.45

0.95

1

1200

30

10

0.45

0.95

2

PMH950UPE
PMH1200UPE

N

RDSon typ(mΩ)

P

12 Nexperia NPI Guide 2019

MOSFETs

Design benefit

MOSFETs in WLCSP
Optimal RDSon to space ratio

Functions & applications•

Ultra small package, PCB space saving•

Load switching for mobile devices•

Highest efficency by electrical peformance•

Battery switch•

Higher performance compared to leadless DFN packages•

LED driver•

High-speed line driver

Key technical features & portfolio
Application diagram•

N-channel and P-channel version available•

Lowest RDSon per mm²•

WLCSP 4 balls with low RDSon and smallest footprint•WLCSP 6 balls with lowest RDSon and small footprint•

ESD protection above 2kV HBM

Portfolio

PackagePol

PMCM440xxxE

WLCSP4N-channel and P-channel

PMCM6501xxEWLCSP6N-channel and P-channel

13 Nexperia NPI Guide 2019•

Control FET•

Battery MOSFET: very low RDSon required in
DFN or WLCSP packages (RDSon < 20 mΩ)•

protection: 20..30V common drain CSP
MOSFETs, very low RDSon (2-5 mΩ RSSon)

Available packages (W x L x H in mm)
WLCSP4WLCSP60.78 x 0.78 x 0.345

1.48 x 0.98 x 0.345

MOSFETs

Design benefit

Trench 9 Automotive MOSFETs in LFPAK

Automotive
qualifiedHigh performance Automotive grade MOSFETS in clip bonded packages

Design benefit••••

Functions & applications

Beyond automotive AEC-Q101 qualified to 175°C
Combining the clip bond LFPAK package and the low RDSon
Trench 9 technology to enable improved power density
Trench 9 superjunction technology for improved avalanche
robustness to enable easier designs and improved reliability.
Improved VGS(th) for better paralleling of MOSFETs in
increased power requirement applications.

Key technical features & portfolio•••

Voltage

RDSon mΩPackage

BUK7J1R0-40H

40 V

1.0 mΩLFPAK56E

BUK7Y1R4-40H

40 V

1.4 mΩLFPAK56

BUK9Y1R6-40H

40 V

1.6 mΩLFPAK56

BUK7S1R0-40H

40 V

1.0 mΩLFPAK88

BUK7S0R9-40H

40 V

0.9 mΩLFPAK88

BUK7S0R7-40H

40 V

0.7 mΩLFPAK88

BUK7M3R3-40H

40 V

3.3 mΩLFPAK33

BUK7M6R0-40H

40 V

6.0 mΩLFPAK33

14 Nexperia NPI Guide 2019

Motor control (BLDC, braking, steering)
DCDC
Reverse battery protection
Engine fans and pumps
Engine management

Application diagram

New portfolio of 40V Trench 9 MOSFETS
Low RDSon from 0.7 – 6.0 mΩ in various LFPAK packages
SOT1023 (LFPAK56E), SOT669 (LFPAK56), SOT1235(LFPAK88) and SOT1210 (LFPAK33)
Portfolio

•
•
•
•
•

LFPAK56E(SOT1023)

LFPAK56(SOT669)

LFPAK88(SOT1235)

5.0 x 6.0 x 1.0

5.0 x 6.0 x 1.0

8.0 x 8.0 x 1.6

LFPAK33(SOT1210)e.g. BLDC Motor
3.3 x 3.3 x 0.85

MOSFETs

Available packages (W x L x H in mm)

Automotive
qualified

Trench 6 Automotive MOSFETs in LFPAK33
High performance copper clip MOSFETs for engine control systems

•
•
•
•
•

Functions & applications

Fully automotive AEC-Q101 qualified to 175°C
Combination of Trench 6 silicon technology in clip bonded
LFPAK33 package
Products offers low switching losses and low Rth
performance
Benchmark Rth for thermally demanding applications
Strong fault condition tolerance due to technology features

Broad portfolio offering 30V – 100V Trench 6 MOSFETS
Logic Level and Standard Level gate
Strong focus at 60V 9.9 – 85mW
Clip bond LFPAK33 Package
Portfolio

Voltage

RDSon mΩPackage

BUK9M12-60E

60V

12 mΩ

LFPAK33

BUK9M15-60E

60V

15 mΩ

LFPAK33

BUK9M19-60E

60V

16 mΩ

LFPAK33

BUK9M24-60E

60V

24 mΩ

LFPAK33

BUK9M42-60E

60V

42 mΩ

LFPAK33

BUK9M53-60E

60V

53 mΩ

LFPAK33

BUK9M85-60E

60V

73 mΩ

LFPAK33

15 Nexperia NPI Guide 2019

Engine control systems
Solenoid Control
Reverse battery protection
Engine fans and pumps
Auxiliary loads & motor control

LFPAK33(SOT1210)

3.3 x 3.3 x 0.85

Application diagram

Key technical features & portfolio
•
•
•
•

•
•
•
•
•

Available packages (W x L x H in mm)
MOSFETs

Design benefit

e.g. Engine Management

NextPowerS3 low RDSon 25V & 30V
Market leading RDSon performance

•
•
•
•
•
•

Functions & applications

Optimized for low RDSon
Max current up to 380A
Best-in-class Safe Operating Area (SOA)
Copper-clip for excellent thermal performanceHigh reliability LFPAK package, qualified to 175 °C
Wave solderable; exposed leads for optimal solder
coverage and visual solder inspection

Key technical features & portfolio••

Available in 25V and 30V
Three package variants; LFPAK33 (SOT1210), LFPAK56(SOT669) and LFPAK56E (SOT1023)
Portfolio

Voltage

RDSon (max)@ VGS = 10 V

Package

PSMN1R5-25MLH

25 V

1.55 mΩ*LFPAK33

PSMNR60-25YLH

25 V

0.64 mΩ*LFPAK56

PSMNR51-25YLH

25 V

0.61 mΩ*LFPAK56E

PSMN1R6-30MLH

30 V

1.9 mΩLFPAK33

PSMNR70-30YLH

30 V

0.82 mΩLFPAK56

PSMNR58-30YLH

30 V

0.67 mΩ*LFPAK56E* Preliminary data

16 Nexperia NPI Guide 2019

•
•
•
•
•
•
•

Power OR-ing
Battery protection
Hot-swap
e-FuseDC switch / Load switch
Brushed and brushless motor control
Synchronous rectification in AC-DC and
DC-DC applications

Application diagram
e.g. Power OR-ing allows redundant power
supllies to be coupled in high reliability
applications

Available packages (W x L x H in mm)
LFPAK33(SOD1210)

LFPAK56(SOD669)

LFPAK56E(SOT1023)

3.3 x 3.3 x 0.9

5.0 x 6.0 x 1.0

5.0 x 6.0 x 1.0

MOSFETs

Design benefit

NextPower 100V
Market leading Qrr performance

•
•
•
•
•
•

Functions & applications

Low Qrr for higher efficiency and lower spiking
Low QG × RDSon FOM for high efficiency switching
applications
Strong avalanche energy rating (Eas)
Avalanche rated and 100% tested
Ha-free and RoHS compliant LFPAK56 package
Wave-solderable LFPAK56 package

Key technical features & portfolio••

Portfolio

Voltage

RDSon (max)@ VGS = 10 V

Package

PSMN3R9-100YSF

100 V

4.3 mΩ*LFPAK56E

PSMN5R6-100YSF

100 V

5.6 mΩ*LFPAK56E

PSMN6R9-100YSF

100 V

7 mΩ

LFPAK56

PSMN8R7-100YSF

100 V

9 mΩ

LFPAK56

PSMN011-100YSF

100 V

10.9 mΩ*LFPAK56

17 Nexperia NPI Guide 2019

•
•
•
•
•

Synchronous rectifier in AC:DC &DC:DCPrimary side switch – 48 V DC:DC
BLDC motor control
USB-PD adapters
Full-bridge and half-bridge applications
Flyback and resonant topologies

Application performance

New 100V portfolio
packages: LFPAK56 (SOT669) and LFPAK56E (SOT1023)* Preliminary data•

Available packages (W x L x H in mm)
LFPAK56(SOD669)

LFPAK56E(SOT1023)

5.0 x 6.0 x 1.0

5.0 x 6.0 x 1.0

Simulations show that choosing a MOSFET
with 2x Qrr increases voltage spiking by
8% and reduces efficiency by 5%

Additional information•

Benefits of Low Qrr MOSFETs in switching
applications (Quick Learning video)•

Benefits of low Qrr MOSFETs in motor control
applications (Quick Learning video)•

Qrr: overlooked and underappreciated inefficiency battle (Blog post)

MOSFETs

Design benefit

NextPowerS3 40V LFPAK88
Driving power-density to the next level•

60% footprint
reduction•

65% height reduction•

86% space reduction•

Gate-compatible with
D2PAK

Functions & applications
•
•
•
•
•

BLDC motor control
Battery protection
e-FusePower OR-ing
Synchronous rectification

Application diagram
e.g. BLDC Motor

Portfolio

Voltage

RDSon (max)@ VGS = 10 V

Package

PSMNR70-40SSH

40 V

0.7 mΩLFPAK88

PSMNR90-40SSH

40 V

0.9 mΩLFPAK88

PSMN1R0-40SSH

40 V

1.0 mΩLFPAK88

18 Nexperia NPI Guide 2019

Package details (W x L x H in mm)
LFPAK88 (SOT1235)

MOSFETsSpace saving footprint - D2PAK Vs LFPAK88

8.0 x 8.8 x 1.6

Logic74AXPnT245 – transceiver
Quad dual supply translating transceiver; 3-state

•
•
•
•

Functions & applications

Translating transceiver for wide voltage ranges.
Low static and dynamic power consumption for portableapplications.
Ioff circuitry provides power-down mode operation
Specified from -40 °C to 125 °C

Key technical features & portfolio•••

VCC(A) & VCC(B)

ICC

Package

74AXP4T245PW

0.9V – 5.5V

24μA

TSSOP16

74AXP4T245BQ

0.9V – 5.5V

24μA

DHVQFN16

74AXP8T245PW

0.9V – 5.5V

35μA

TSSOP24

74AXP8T245BQ

0.9V – 5.5V

35μA

DHVQFN24

20 Nexperia NPI Guide 2019

Industrial applications
General portable consumer applications
Enterprise and Telecom applications

Application diagram

New portfolio with 4-bit & 8-bit dual supply transceivers
Wide supply voltage offers from 0.9V to 5.5V
Small footprint packages for both TSSOP and DHVQFNPortfolio•••

SPI interface application

Available packages (W x L x H in mm)
PW(SOD403-1)

BQ(SOD763-1)

5 x 4.4 x 1.1

3.5 x 2.5 x 1.0

PW(SOD355-1)

BQ(SOD815-1)

7.8 x 4.4 x 2.0

5.5 x 3.5 x 1.0

Logic

Design benefit

GX4 MicroPak
4 pad, low power gates

Design benefit•••

X2SON4 MicroPak provide the industry’s smallest footprint
for logic plastic packages
with a pad spacing ≥0.4mm no step-down stencil required- enables low cost board manufacturing
RoHS and dark-green compliant with NiPdAu lead finish
Low profile height of 0.35mm••

AUP and LVC families offer• 1G34GX4: Buffer• 1G17GX4: Buffer Schmitt-trigger• 1G07GX4: Buffer with open-drain• 1G04GX4: Inverter• 1G14GX4: Inverter Schmitt-trigger
Propagation delay• AUP1G: tpd 4.0ns (Vcc 1.8V, CL 15pF)• LVC1G: tpd 2.0ns (Vcc 2.5V, CL 50pF)
Static current 0.01µA for LVC1G and 0.1µA for AUP1G
Portfolio

VoltageMax. Output

Temperature Range

LVC1G

1.65-5.5V± 32mA−40 to +125 °C

AUP1G

0.8-3.6V± 4mA−40 to +125 °C

21 Nexperia NPI Guide 2019•Space constrained applications such as
smartphones, tablets and portables
Communication and industrial
applications

GX4(SOT1296-2)

0.6 x 0.6 x 0.32

Key technical features & portfolio••

Available packages (W x L x H in mm)

Package advantage
Logic

•

Functions & applications

74AVC1T8xxx Qualcomm
Single dual-supply translating 2-input OR or NOR with strobe

•
•
•
•

Functions & applications

Low cost alternative solution for Qualcomm's referenceboard design.
Wide supply voltage range
 VCC(A): 0.8 V to 3.6 V
 VCC(B): 0.8 V to 3.6 V
Supports mixed-mode voltage operations
Maximum data rates: 500 Mbit/s(1.8V to 3.3V translation)
 320 Mbit/s(translate to 2.5V or 1.8V)

Key technical features & portfolio
•
•
•
•
•

Portfolio

VCC(A) &VCC(B)

OutputCurrent

Prop del
(tPD)

Tamb

74AVC1T8832GS

0.8 – 3.6V+/-12mA

2.4ns-40~125°C

74AVC1T8128GS

0.8 – 3.6V+/-12mA

2.4ns-40~125°C

Wireless module
Mobile / Portable applications
Industrial applications

Application diagram•

Over-voltage tolerant inputs, accepts voltages up to 3.6V
IOFF circuitry provides partial power down operation
Inputs with Schmitt trigger action
Suspend mode
High noise immunity

22 Nexperia NPI Guide 2019•••

Example of voltage translation
between the MCU and a WIFI
chipset on different voltage rails

Available packages (W x L x H in mm)
Package nameXSON8

pin count8

version

SOT833-1

suffixGT

Pitch (mm)0.50

WxL xH(mm)

1.0 x 1.95 x 0.50

Logic

Design benefit

LV-A logic Family
Low leakage family for partial power down by IOFF circuit

•
•
•
•
•
•
•

Functions & applications

IOFF circuitry supports partial power-down
Low noise operation: VOL(p) < 0.8 V
Fully specified at 3.3 V and 5.0 V supply nodes
overvoltage tolerant inputs support mixed-mode voltage
Schmitt-trigger inputs for slowly transitioning input signals
Latch-up performance exceeds 250 mA
ESD - HBM exceeds 3 kV (ANSI/ESDA/JEDEC JS-001, Class 2)

Key technical features & portfolio••••

IOFF power down
Low noise
3.3V and 5V supply voltage support
Translater function

Part number

Portfolio sizefeatures

74LVxxxAxx

8 parts

Inverter, buffer, transceiver, OVT,CMOS inputs

74LVxxxATxx

5 parts

Inverter, buffer, transceiver, OVT, TTL
inputs

74AHCVxxxAxx

6 parts

Inverter, buffer, transceiver, OVT,
Schmitt trigger inputs

74AHCTxxxAxx

7 parts

Inverter, buffer, transceiver, OVT, TTL
inputs23 Nexperia NPI Guide 2019

•

•
•
•

The LV-A family is designed to support
applications where in different modes
e.g. stand-by mode a part of the PCB isshut down. Applications:
Printer
TV sets
Desktop and notebook computer

Application diagram•

Example of voltage translation between
MCU and system rail at different
voltage

Available packages
Package name

TSSOP

TSSOP

Pin count

14

20

version

SOT402-1

SOT360-1

suffixPW

PW

Pitch (mm)

0.65

0.65

W x L x H (mm)6.4 x 5.0 x 1.1

6.4 x 6.5 x 1.1

Logic

Design benefitOn roadmap

Autosense translators NXB/NXS
A family of 1-8 bit bidirectional level shifter and voltage translator with auto direction sensing

•
•
•
•
•
•

Functions & applications

Two completely separate power lines may be usedtranslates logic voltage levels with auto direction sensing
versions for open-drain (NXB) and push-pull CMOS logic(NXS) output
Pb-free, RoHS and dark green compliant
specified for partial power-down applications using IOFF
Automotive version on roadmap

Key technical features & portfolio••••

voltages: VCC(A)= 1.65 V to 3.6 V; VCC(B)= 2.3 V to 5.5 V
Maximum data rates: 26 Mbps (Push-pull)
Inputs accept voltages up to 5.5 V
Latch-up performance <100 mA per JESD 78B Class II

Part number

Portfolio
size

packages

NXx0101xx

1 bit

6

GM= XSON6 (SOT886), GS= XSON6(SOT1202), GW= TSSOP6 (SOT363-1)

NXx0102xx

2 bit

4

GT= XSON8 (SOT833-1)
DC= VSSOP8 (SOT765-1)

NXx0104xx

4 bit

6

GU12= XQFN12 (SOT1174-1)
BQ= DQFN14 (SOT762-1)
PW= TSSOP14 (SOT402-1)

NXx0108xx

8 bit

4

BQ= DQFN20 (SOT764-1)
PW= TSSOP20 (SOT360-1)

24 Nexperia NPI Guide 2019

•
•
•
•

Mobile application like smartphone,
wearables
Computing application like notebook,tablet, desktop PC
Industrial application
Automotive applications (on roadmap)

Application diagram•

Example of voltage translation between
1.8V MCU and 3.3V system rail

Available packages (selection)
Package
name

XSON6

XSON8

XQFN12pin count

6

8

12

Version

SOT1202

SOT833-1

SOT1174-1

Suffix

GS

GT

GU12

Pitch (mm)

0.35

0.50

0.40

WxL xH(mm)

1.0 x 1.0 x
0.35

1.0 x 1.95 x
0.50

2.0 x 1.7 x
0.50

Logic

Design benefit

Automotive
qualified

MicroPak packages AEC-Q100 qualified
Automotive qualified Mini logic in leadless packages

•
•
•
•
•

Functions & applications

Optimized for speed and power
Low propagation delay
Low dynamic power dissipation
Pb-free, RoHS and dark green compliant
specified for partial power-down applications using IOFF

Key technical features & portfolio
•
•
•
•
•

Very small footprint - up to 65% space saving overtraditional leaded packages
pin pitch options: 0.5, 0.35 mm
Low profile height: 0.5 or 0.35 mm
Leadless - no bent leads, no co-planarity issues
Pb-free, RoHS and dark green compliant

Part number

Types

Features

74AUPxxxxxGx-Q100

7

Gates, Inverter, buffer, voltage translator,
multiplexer, OVT, CMOS or Schmitt trigger inputs

74AVC1T45GS-Q100

1single bit, dual supply transceiver, bidirectional
level translation

74LVCxxxxxGx-Q100

14

Gates, Inverter, buffer, voltage translator,
multiplexer, OVT, CMOS or Schmitt trigger inputs

25 Nexperia NPI Guide 2019

•
•
•
•

space constraint automotive
applications e.g.:
Infotainment
ADAS
BMS

Application diagram•

Example of uni-directional logic levelshifting translation

Available packages (selection)
Package
name

XSON6

XSON6

XSON8

pin count6

68

version

SOT1202

SOT886

SOT833-1

suffixGS

GM

GT

Pitch (mm)

0.35

0.50

0.50

WxL xH(mm)

1.0 x 1.0 x
0.35

1.0 x 1.45 x 0.50

1.0 x 1.95 x 0.50

Logic

Design benefit

ESD & TVSTrEOS 1 & 2 High-Speed ESD Protection in µCSP
Ideal combination of low capacitance, low clamping voltage and high surge robustness to protect sensitive high-speed interfaces

Design benefit

Functions & applications

Maximizing the three pillars of ESD protection

Suitable for data-lines up to ~20Gbps

 Low capacitance for highest signal integrity•

USB Type-C (USB 3.2), MicroUSB

 Low clamping for enhanced system protection•

Thunderbolt

 High ESD & Surge robustness against transients•

HDMI 2.1•

Snap-back technology allows for lowest clamping voltage•

SD-Card protection•

Designed to fulfill IEC 61000 standard in final application•

All other sensitive I/Os

Key technical features & portfolio
Extremely low capacitance down to 0.1 pF•

Extremely low clamping down to 0.1 Ω (Rdyn)•

High ESD and surge robustness up to 20 A at 8/20 μs•

Extremely fast switching time under 1 ns

TrEOS 1
TrEOS 2

Clamping

Surge

PESD3V3Z1BSF

0.28 pF

5.7 V

9.5 A

SOD962

PESD3V3Z1BCSF

0.45 pF

4.6 V

15 A

SOD962

PESD3V3W1BCSF

0.55 pF

3.8 V

20 A

SOD962

PESD9V0C1BSF

0.20 pF

5.8 V

9A

SOD962

PESD2V0Y1BSF

0.69 pF

4.6 V

6A

SOD962

PESD2V5Y1BSF

0.25 pF

6.1 V

4A

SOD962

PESD4V0Y1BSF

0.24 pF

6.5 V

4A

SOD96227 Nexperia NPI Guide 2019

0.6 x 0.3 x 0.3

USB3.2 Rx/Tx Protection

Capacitance@ 16 A TLP

Small-footprint package with
low-inductance & extremerobustness

Application diagram•

Portfolio (Excerpt)

SOD962-2(DSN0603-2)

Package

ESD & TVS•

Available packages (W x L x H in mm)

Super-Speed Common Mode Filter in WLCSP
2 in 1 solution combining common-mode (CM) suppression with Nexperia’s best-in-class TrEOS ESD protection

Functions & applications

Available packages (W x L x H in mm)

Common-Mode Filter & ESD protection on one footprint•

Ultra-high-speed data-lines incl. USB 3.2

 Best CM suppression at all GHz data-line signal fundamentals•

HDMI 2.1

 Widest differential passband to keep signal integrity•

MIPI CSI camera interface

 Uncompromising TrEOS High-Speed ESD protection•

MIPI DSI display interface•

Reduces part count and accelerates PCB placement•

Thunderbolt•

Portfolio of ESD-only devices with identical footprint allows
system level EMI characterization with or without CMF•

Key technical features & portfolio•

Leading common-mode suppression up to -38 dB•

Extremely wide differential pass-band up to 10 GHz•

High ESD ruggedness 15-20 kV, exceeding IEC 61000-4-2•

TrEOS ESD protection up to 15 kV contact discharge

Portfolio (Excerpt)

Passband1)

Rejection

VESD

Package

PCMFxUSB3S

6 GHz-38 dB

15 kV

WLCSP5/10/15

PCMFxUSB3B/C

8 GHz-36 dB

20 kV

WLCSP5/10/15

PCMFxUSB3BA/C

10 GHz-35 dB

15 kV

WLCSP5/10/15

PESDxUSB3B/C

16.1 GHz-

20 kV

WLCSP5/10/15

PESDxUSB3S

17 GHz-

15 kV

WLCSP5/10/15

1) S21dd f3dB

28 Nexperia NPI Guide 2019

Application diagram
USB Type-C Dongle

WLCSP5WLCSP10WLCSP15

0.8 x 1.2 x 0.6

1.6 x 1.2 x 0.6

2.4 x 1.2 x 0.6•

Smallest footprint & lowest inductive path toground due to wafer level chip scale package•

Package design allows for optimal RF routing

Tx/Rx
CommonMode Filter

ESD & TVS

Design benefit

Mobile Surge Protection in compact packages
Superior Protection against transient over-voltage with leading edge performance-to-space ratio

Design benefit

Functions & applications•

High surge robustness devices for single-line protection•

USB – PD (Power Delivery)•

Ultra-low clamping to safeguard sensitive ICs•

USB Type-C (CC-/SBU-line)•

Wide-ranging product portfolio for various design needs•

Supply line•

All products in ultra flat & compact leadless packages•

Battery line•

Optimized design to avoid latch-up effect•

Audio interface

Key technical features & portfolio

DSN1006-2(SOD993)

DSN1608-2(SOD964)

1.0 x 0.6 x 0.5

1.0 x 0.6 x 0.27

1.6 x 0.8 x 0.29

Range of reverse standoff voltages from 3.3 V to 26 V•

Low dynamical resistance down to 0.1 Ω (TLP)•

Protection against electrostatic discharge up to 30 kV
Voltage

Current

Clamping

Package

PTVS5V5D1BL

5.5 V

35 A

10.3 VDFN1006-2

PTVS3V3Z1BSC

3.3 V

70 A

11.0 VDSN1006-2

PTVS5V0Z1BSC

5.0 V

60 A

12.0 VDSN1006-2

PTVS5V0Z1USKP

5.0 V

100 A

17.2 VDSN1608-2

PTVS26VZ1USK

26.0 V

32 A

47.9 VDSN1608-2

VBus & VBAT protection

VBUS
protection

VBAT
protection

ESD & TVSHigh surge robustness up to 100 A at 8/20 µs pulse•

29 Nexperia NPI Guide 2019

DFN1006-2(SOD882)

Application diagram•

Portfolio (Excerpt)

Available packages (W x L x H in mm)

Automotive
qualified

In-Vehicle Network (IVN) protection
Family of ESD Protection diodes for automotive In-Vehicle-Network (IVN) lines

Functions & applications•

New generation of protection technology, optimized forthe latest generation of transceiver•

Protection of transceiver devices at invehicle networks (IVN)•

Drop in replacement for existing PESD1CAN and PESD1LIN– 2nd source in-house•

Family of products for CAN, CAN-FD
LIN, FlexRay, et.al. interfaces•

Approved by major automotive OEM

PackageW x L x H (mm)Key technical features & portfolio•

Handles higher surge current than predecessor•

Higher ESD robustness - withstands higher failure voltages•

Lower (=better) ESD clamping voltage offers improved
system level protection•

8 new products for CAN-FD – DFN package in 2H‘19

Portfolio (Excerpt)

VRWM

lines

CD maxPackage

PESD1IVN2x-A

24/ 271

17 pF

SOD323

PESD1IVN27-U

27

1

17 pF

SOT323

PESD2IVN2x-T

24/ 27

2

17 pF

SOT23

PESD2IVN2x-U

24/ 272

17 pF

SOT323

PESD2CANFDVx-x

24/ 272

6 pF

SOT23/ SOT323

PESD2CANFDUx-x

24/ 272

3.5 pF

SOT23/ SOT323

30 Nexperia NPI Guide 2019

Available packages (W x L x H in mm)

Application diagram

Ptot (mW)SOT23

2.9 x 1.3 x 1.0

250

SOT323(SC70)SOD323(SC76)

2.0 x 1.25 x 0.95 1.7 x 1.25 x 0.95

200

400

ESD protection for CAN bus

ESD & TVS

Design benefit