Characteristics of Crystal Units and Oscillation Circuit

1. Characteristics of crystal units
The thickness of crystal vibrator of the AT cut crystal unit as described in the previous page differs depending on the overtone mode.

(1) Relationship between thickness of crystal blank and oscillation frequency
Cut angle/ mode
overtone

Frequency range(MHz)

Formula of thicknessof crystal blank

AT / Fundamental mode

3.5 to 33

1.67/ f

AT/ 3rd O. T

33 to 100

5.01/ f

AT/ 5th O. T

100 to 150

8.35/ f

AT/ 7th O. T

150 to 200

11.69/ ff: Series resonance frequency (MHz)In case of calculating the thickness of AT-cut 16MHz
t=1.67/ 16=0.104 (mm)(2) Examples of speciﬁcations for frequency-temperature characteristics
The frequency-temperature characteristics of the AT cut crystal unit are tertiary curves.
The diagram below shows examples of the tertiary curves that pass temperature range and frequency deviation speciﬁcations.
The range enclosed by the smaller rectangular satisﬁes the following speciﬁcation:±10×10 -6 ( -10 to 60: 25o C)
The range enclosed by the larger rectangular satisﬁes the following speciﬁcation:±50×10 -6 ( -20 to 70: 25o C)-----(3) Equivalent electric circuit and equivalent constant of crystal unit
The following equivalent constants are used near the resonance frequency.
L1 : Motional inductance in the equivalent electric circuit
C1 : Motional capacitance in the equivalent electric circuit
R1 : Motional resistance in the equivalent electric circuit
C0 : Parallel capacitance in the equivalent electric circuit

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G - G T −The equation fL shows that fL varies as load capacitance CL connected to the crystal unit changes and that fL becomes larger as CLbecomes smaller.
The equation RL shows the change in impedance with a load capacitance connected. The impedance of crystal unit becomes larger as CLbecomes smaller.

2. Oscillation circuit and crystal unit
(1) Equivalent circuit of oscillation circuit and oscillation conditions
A simplified equivalent circuit is shown below.

#RYSTAL UNIT

/SCILLATION CIRCUIT#RYSTAL UNIT

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9 -  2EACTANCE OF CRYSTAL UNIT
9 $  2EACTANCE OF OSCILLATION CIRCUIT

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The oscillation start-up conditions are described as
RL ≤ | -R |and in order to oscillate the crystal unit accurately, it must be designed such that the negative resistance of the oscillation circuit becomesbigger comparing with the resonance resistance value at the time of loading. This ratio is called oscillation margin degree MOSC and it is
one of critical factors when designing the oscillation circuit and is described as below.
For oscillation circuit designing conditions, it is recommended that an oscillation circuit be designed using a negative resistance of a value
five to ten times or more larger than RL calculated from the resonance resistance specification value.
MOSC = | -R | / RL ≥ 5
In a steady oscillation state, the load resonance resistance is given as follows:
RL = | -R |The mutual conductance of the oscillation circuit decreases after the oscillation has started to continuously compensate for the power loss
due to the load resonance resistance of the crystal unit, which continues oscillation.
The frequency condition is given as follows:
XL = XC, XL - XC = 0
As shown in the following figure, the reactance of the crystal unit varies to a value matching the load capacitance of the oscillation
circuit CL = XC. Thus an oscillation frequency is determined.

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As shown above, the series resonance frequency of the crystal
unit changes with load capacitance CL of the oscillation circuit.
In the actual oscillation circuit, however, fine adjustments ofoscillation frequencies are carried out by varying CL by thetrimmer capacitor or the like. The following figure shows anexample of load capacitance characteristics. The slope of thecharacteristics varies depending on the frequency, shape, thenumber of overtone mode, etc.

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3. Crystal oscillation circuit(1) CMOS fundamental crystal oscillation circuit

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$ -P&#-/3 FUNDAMENTAL CRYSTAL OSCILLATION CIRCUITAs shown above, the series resonance frequency of the crystal
The figure on the right shows a standard CMOS inverter crystaloscillation circuit for oscillating crystal unit with fundamental mode.

3 G  -7"UFFER*Rx is an element to reduce excitation current of the crystal unit
preventing frequency fluctuation, but Rx is not used in somecases.

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Characteristics of the circuit when load capacitances C1 andC2 are changed under the condition of C1= C2 are shown in thefigure on the right.
It is not desirable that the excessive increase of the value ofcondenser leads to a decrease of the negative resistanceresulting in increasing the possibility of oscillation failure.

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6ARIATION OF NEGATIVE RESISTANCE WITH CONDENSER CAPACITY#ONDENSER CAPASITY$ $  $  P&.EGATIVE RESISTANCE

7+-(Z-(Z+-(Z++Rd mainly adjusts frequency characteristics of the negative
resistance and is used to prevent oscillating by third Overtone
mode. In case of a bigger circuit of the negative resistance,
there is a case it is used to prevent the abnormal oscillation.

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Selection of ICs and circuit constants by frequency bands
Frequency

3 to 4.9 (MHz)

5 to 6.9 (MHz)

7 to 9.9 (MHz)

10 to 19.9 (MHz)

20 to 30 (MHz)TC74HCU04A
TC7SUD4F
TC7WU04FU

TC74VHCU04
TC7SHU04F
TC7WHU04FU

0 (Ω)

0 (Ω)

6 to 15 (pF)

6 to 15 (pF)

TC4069UB
TC4SU69F

ICRf1MΩRd*1Rx*2C1, C2*31500 (Ω)

470 (Ω)

0 (Ω)
0 to 1500Ω

6 to 22 (pF)

*1: Necessary for preventing overtone oscillation and must be changed depending on the frequency band or the C1 and C2 values.
*2: Used to reduce excitation current of the crystal unit. Necessary for stable operation of small-sized crystal units.
*3: The optimum value differs with the values of load capacitance and Rd.

(2) CMOS overtone crystal oscillation circuit
This figure shows a standard CMOS inverter crystal oscillation circuit to oscillate a crystal unit using the overtone mode.
#-/3 OVERTONE CRYSTAL OSCILLATION CIRCUIT
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There are same cases when L1 and R1 are matched to the value of load capacitance.

(3) Selection of ICs and circuit constants by frequency bands
Frequency range

20 to 60 (MHz)IC

TC74VHCU04
TC7SHU04F
TC7WHU04FU

C1

3 to 10pF

C2

10 to 22pF

(4) Method of selecting circuit constants and functions of elements
C1: Forms load capacitance of the circuit together with C2, L1 and L2. A value of approx. 5pF is used.
C2: Forms load capacitance of the circuit together with C1, L1 and L2. Prevents fundamental wave oscillation. Shall be selected so that C2
comes between the third overtone frequency at which resonance frequency with L2 is to make oscillation and 1/ 3 of the third overtone
frequency. A value of 10 to 22pF is used.
C3: A bypath capacitor
L1: A coil to adjust load capacitance of the oscillation circuit to a value near the series. A value of several µH is used.
L2: Forms load capacitance of the circuit together with C1, C2 and L1. Prevents fundamental wave oscillation. Shall be selected so that L2
comes between the third overtone frequency at which resonance frequency with C2 is to make oscillation and 1/ 3 of the third overtone
frequency. A value of 10 to 22pF is used.
R1: A Q dump resistor for L1. As an element for preventing self-excited oscillation, a value of several kΩ to several tens of kW is used.
* L1 and R1 might not be used.

&KDUDFWHULVWLFVRI&U\VWDO8QLWVDQG2VFLOODWLRQ&LUFXLW(5) Method of checking oscillation circuit① Some ICs have a low upper-limit value of usable frequency, so refer to individual IC catalog to make sure that the IC can oscillate acrystal unit with an adequate negative resistance.

② The following figure shows an example of a CMOS oscillation circuit. Check resistance Rsup is connected in series with the crystal unit tocheck the negative resistance. Use 3 to 22pF for C1 and C2, and see the table below for values of check resistance.

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Values of check resistance

3.5 to 4.5MHz

1.5kΩ

4.6 to 6.0MHz

1.0kΩ

6.1 to 10.0MHz

800Ω

10.1 to 14.0MHz

500Ω

14.1 to 20.0MHz400Ω③ Using a spectrum analyzer or oscilloscope, check that every oscillation is normally activated while turning the power on and off several
times. For oscillation circuits with no power regulator ICs, carefully check changes in the negative resistance against supply voltage andin frequencies.

④ When oscillation is normal, remove the check resistance before using the crystal circuit.
⑤ If oscillation is unstable or is not generated, gradually decrease the values of C1 and C2 until normal oscillation is obtained.
⑥ If normal oscillation cannot be generated near 10MHz or near 20MHz, replace the IC with a new one suitable for higher frequencies.

(6) Load capacitance and oscillation frequency of transistor/ fundamental crystal oscillation circuit
Viewed from the connection terminals of a crystal unit, the load capacitance CL of an oscillation circuit is generally comprised of C1, Ct,
C2, and C3 if stray capacitance of the circuit and the capacitance between base and emitter of the transistor are ignored. Since trimmer
capacitor is adjusted to CT = Min. to Max. for zero adjustment of the oscillation frequency, the value of CL at this time can be obtained fromthe following equation.

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TO $--AX=++$  +$ 5$
$−When these calculation results are substituted for the following equation for load resonance frequency, the oscillation frequency can beobtained.

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Select each circuit constant so that the adjustment ranges of upper and lower frequencies of this circuit are even on the basis of thefrequency of a single crystal unit measured using a specified load capacity, and that the margin of ±8 to 10 ×10-6 of the room temperaturedeviation of the crystal unit can be reserved.
To prevent the decrease in the negative resistance, always connect the crystal unit to the base of the transistor. For transistors used foroscillation circuits, hfe and fT are important.
To obtain the large negative resistance with small current consumption, select a transistor for high frequency amplification with hfe of over
250 and fT of 1GHz or more.

(7) Transistor third overtone oscillation circuit① The resonance circuit comprised of L2 and C3 is required on the emitter side for preventing fundamental mode crystal oscillation. Set
the resonance frequency to a value higher than the intermediate between fundamental wave frequency and third overtone frequency.

② Use L1, referred to as an elongation coil, to connect the load capacitance of the oscillation circuit in series. R1 prevents self-excitedoscillation by L1. Since it is difficult in general to design the oscillation circuit having adequate negative resistance in the overtone
oscillation frequency band, there are no other effective means of obtaining adequate oscillation margin except for preventing theincrease of load resonance resistance RL of the crystal unit.

RL in the equation of load resonance resistance can be made equal to RS by connecting CL in series, or making it infinite, which prevents
increase in the load resonance resistance.

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Characteristics of Crystal Units and Oscillation Circuit

To prevent decrease in the negative resistance, connect the crystal unit to the base of the transistor as in the fundamental mode crystal
oscillation circuit. To use the crystal circuit for both oscillation and multiplication, connect a parallel resonance circuit having multiplication
frequency as resonance frequency to the collector of the transistor.
When selecting circuit constants for zero adjustment range by trimmer capacitor, set the constants to values obtained by adding approx.
±12 to 15×10-6 to the room temperature deviation of the crystal unit, centering the value obtained by measuring the crystal unit with load
capacitances in series. (When the room temperature deviation specification of the crystal unit is ±10×10-6)(8) Excitation power of oscillation circuit
Normal operation of crystal units is not assured when excitation power is raised. The allowable excitation power varies depending on theshape of the crystal unit or the stability of targeted frequency. When highly accurate oscillation is required, however, it is recommended
to use an oscillation circuit with an excitation power of 5 to 50µW or less. For other cases, refer to individual relevant crystal units on thepages of the catalog.

(9) Precautions for designing printed circuit board
Be sure to design printed circuit board patterns that connect a crystal unit with other oscillation elements so that the lengths of such
patterns become shortest possible to prevent deterioration of characteristics due to stray capacitances and wiring inductance. For multilayer circuit boards, it is important not to wire the ground and other signal patterns right beneath the oscillation circuit.