Multilayer Metal Power Inductors MCOILTM LCCN series
for Automotive Body & Chassis and Infotainment
Multilayer Metal Power Inductors MCOILTM LBCN series
for Telecommunications Infrastructure and Industrial Equipment
Multilayer Metal Power Inductors MCOILTM LMCN series
for Medical Devices classified as GHTF Class C (Japan Class III)
■PRECAUTIONS
1. Circuit DesignPrecautions◆Verification of operating environment, electrical rating and performance
1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe socialramifications. As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations andshould be clearly differentiated from components used in general purpose applications.
2. When inductors are used in places where dew condensation develops and/or where corrosive gas such as hydrogen sulfide, sulfurousacid, or chlorine exists in the air, characteristic deterioration may occur. Please do not use inductors under such environmentalconditions.
◆Operating Current（Verification of Rated current）
1. The operating current including inrush current for inductors must always be lower than their rated values.
2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect.
◆Temperature rise
Temperature rise of power choke coil depends on the installation condition in end products.
Make sure that temperature rise of power choke coils in actual end products is within the specified temperature range.

2. PCB DesignPrecautions◆Pattern configurations（Design of Land-patterns）
When inductors are mounted on a PCB, the size of land patterns and the amount of solder used（size of fillet）can directly affect inductor
performance. Therefore, the following items must be carefully considered in the design of solder land patterns:（1） The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking.
Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads
which in turn determines the amount of solder necessary to form the fillets.
（2） When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's
soldering point is separated by solder-resist.
◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards）
After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing
processes （PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow solderedboards etc.）For this reason, planning pattern configurations and the position of SMD inductors should be carefully performed to minimize
stress.
◆Pattern configurations（Design of Land-patterns）
The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts. Examples ofimproper pattern designs are also shown.
（1） Recommended land dimensions for a typical chip inductor land patterns for PCBs
（Unit：mm）
B
A
A
Type
1608
2012
A
0.70.95B
0.90.8CC
1.01.4

Technicalconsiderations（２）Examples of good and bad solder application
Item

Not recommended

Recommended

Mixed mounting of SMD andleaded components

Component placement closeto the chassis▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_MC_C_B_M_prec_e-E10R01

Hand-soldering of leaded
components near mounted
components

Horizontal component
placement◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards）
1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanicalstresses from board warp or deflection.
Item
Not recommended
Recommended

Deflection of the board

Position the component at aright angle to the direction of
the mechanical stresses thatare anticipated.

2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary depending
on inductor layout.
An example below should be counted for better design.

3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the methodused. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation.
Thus, any ideal SMD inductor layout must also consider the PCB splitting procedure.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_MC_C_B_M_prec_e-E10R01

3. Considerations for automatic placement
Precautions◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the inductors when mounting onto the PC boards.
2. The maintenance and inspection of the mounter should be conducted periodically.
◆Adjustment of mounting machine
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. To avoid this, thefollowing points should be considered before lowering the pick-up nozzle:（1） The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of theboard.
（2） The pick-up pressure should be adjusted between 1 and 3N static loads.
（3） To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should
be used under the PC board. The following diagrams show some typical examples of good pick-up nozzle placement:
Item
Improper method
Proper method

Technical
considerations

Single-sided mounting

Double-sided mounting

2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanicalimpact on the inductors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance,inspection and replacement of the pin should be conducted periodically.
4. Soldering

Precautions◆Reflow soldering・ Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.
・ The product shall be used reflow soldering only.
・ Please do not add any stress to a product until it returns in normal temperature after reflow soldering.
◆Lead free soldering
・ When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering
heat, soldering etc sufficiently.
◆The conditions for Reworking with soldering irons
・Put the soldering iron on the land-pattern and don’t touch it to the inductor directly.
Soldering iron's temperature below 350 ℃ , Duration 3 seconds or less
◆Reflow soldering
・ If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequentlydegrade the reliability of the products.
Recommended reflow condition (Pb free solder)

Technical
considerations

The allowable number of reflow soldering is 3 times.
5. CleaningPrecautions◆Cleaning conditions
・ Washing by supersonic waves shall be avoided.

Technical
considerations◆Cleaning conditions
・ If washed by supersonic waves, the products might be broken.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_MC_C_B_M_prec_e-E10R01

6. Resin coating and mold
1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period orwhile left under normal storage conditions resulting in the deterioration of the inductor's performance.
2. Thermal expansion and thermal shrinkage characteristics of resins may lead to the deterioration of inductors’ performance.
3. When a resin hardening temperature is higher than inductor operating temperature, the stresses generated by the excessive heat may
lead to damage in inductors.
4. In prior to use, please make the reliability evaluation with the product mounted in your application set.

Precautions

7. HandlingPrecautions◆Breakaway PC boards（splitting along perforations）
1. When splitting the PC board after mounting inductors and other components, care is required so as not to give any stresses of deflection
or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆General handling precautions
・Always wear static control bands to protect against ESD.
・ Keep the inductors away from all magnets and magnetic objects.
・ Use non-magnetic tweezers when handling inductors.
・ Any devices used with the inductors（ soldering irons, measuring instruments） should be properly grounded.
・ Keep bare hands and metal products（i.e., metal desk）away from inductor electrodes or conductive areas that lead to chip electrodes.
・ Keep inductors away from items that generate magnetic fields such as speakers or coils.
◆Mechanical considerations
Be careful not to subject the inductors to excessive mechanical shocks.
（1） If inductors are dropped on the floor or a hard surface they should not be used.
（2） When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against otherboards or components.

8. Storage conditions

Precautions◆Storage
To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control
temperature and humidity in the storage area. Humidity should especially be kept as low as possible.
・Recommended conditions
Ambient temperature: 30℃ or below
Humidity: 30% to 70%
The ambient temperature must be kept -5℃ to +40℃. Even under ideal storage conditions, solderability of inductor is deteriorated astime passes, so inductors should be used within 6 months from the time of delivery.
・Inductor should be kept where no chlorine or sulfur exists in the air.

Technicalconsiderations◆Storage
If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation ofterminal electrodes and deterioration of taping/packaging materials may take place. For this reason, components should be used within 6months from the time of delivery. If exceeding the above period, please check solderability before using the inductors.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_MC_C_B_M_prec_e-E10R01