Application Note

Assembly Precautions
for the Nichia 193F Series LEDs
Table of Contents
1. LED Outline Dimensions/Tape Dimensions
2. Handling Precautions

・ ・ ・ ・ ・ ・ ・ ・ ・ 2-6

・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 7

3. Design Recommendations for Optimal Amount of Solder
4. Precautions for Setting Up a Pick-and-Place Machine/Nozzle
5. Precautions When Reflow Soldering

・ ・ ・ ・ ・ 8
・ ・ 9-12・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 13

NCSW193F, NC2W193F, NC3W193F, NC4W193F, and NC5W193F refer to Nichia part numbers. These Nichia part numbers within thisdocument are merely Nichia’s part numbers for those Nichia products and are not related nor bear resemblance to any other company’s
product that might bear a trademark.
This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

1/14

SP-QR-C2-220184-1
Jun. 8, 2022

Assembly Precautions for the Nichia 193F Series LEDs

1. LED Outline Dimensions/Tape Dimensions
Table 1. NCSW193F Product Specifications
Part
Part No.
No.NCSW193F
NCSW193F
No.
No. STS-DA7-17892
STS-DA7-17892

2

Φ2.05

±0.05

12

±0.1

4

11.5±0.1

1.8
1.8Max
Max

±0.1

±0.1

1
1.15±0.05
1.15±0.05

0.2
0.2 AA

(2.8)
(2.8)

0.5
0.5
0.9
0.9
1.27
1.27

2

(0.5 クロスバー凹部)(0.5
クロスバー凹部)(0.5Crossbar
Crossbar
Recess)(0.5
Recess)±0.1

項目Item
Item
項目
6.8
6.8

0.9
0.9

0.9
0.9

アノード
Anode
Anode
Anode

蛍光体セラミックス
蛍光体セラミックス
Phosphor Ceramics
Ceramics
Phosphor

封止樹脂材質
封止樹脂材質EncapsulatingResin
Resin
Encapsulating
Materials
Materials

シリコーン樹脂
シリコーン樹脂
Silicone Resin
Resin
Silicone

電極材質
電極材質
ElectrodesMaterials
Materials
Electrodes

銅合金+金メッキ
銅合金+金メッキ
Au-platedCopper
Copper Alloy
Alloy
Au-plated

ダイヒートシンク材質
ダイヒートシンク材質
DieHeatHeatSink
Sink
Die
Materials
Materials

銅合金+金メッキ
銅合金+金メッキ
Au-platedCopper
Copper Alloy
Alloy
Au-plated

1.95±0.1

エンボスキャ
Embossed

8.25±0.1(Unit: mm)

トップ
Top

0.35g(TYP)

Direction of the LED in the embossed carrier tape pocket: thecathode faces the feeding direction of the tape as shown in the
figure above.

1 The centerline of the emitting area in the lateral direction is parallel to B; the引き出し部最小100mm（空部）
LED装着部 and B is within
トレーラ部最小160mm（空部）
deviationin distance between the centerline±0.1mm.

Trailer 160mm MIN(Empty Pockets)

Loaded Pockets

Leader with Top Cover Tape
100mm MIN(Empty Pocket)

2 The deviation of the centerline of the emitting area in the longitudinal

リーダ部最小400mm

Leader without direction
Top Cover Tape
direction from the centerline of the die heatsink in the longitudinal
is 400mm M
製品には以下のようなリボン形状が含まれます。
**製品には以下のようなリボン形状が含まれます。
リール部 Reel(Unit:
mm,
Tolerance:±0.1mm)within ±0.1mm.
maycontaincontainthe
theproducts
productshaving
having thethe following
following ribbon
ribbon shapes.
shapes.
ItItmay
330±2AALight Emitting Diode

Weight: typ.
0.35g
0.35g(TYP)

バリは寸法に含まないものとします。
**バリは寸法に含まないものとします。
Dimensions do
do notnotinclude
includemold
mold flash
flash oror metal
metalburr.
burr.
Dimensions

形状1
形状1
Shape1
Shape1KK

黒色耐熱性ポリマー
黒色耐熱性ポリマー
Black Heat-resistantHeat-resistant Polymer
PolymerBlack

蛍光体板材質
蛍光体板材質Phosphorsheet
sheet
Phosphor
Materials
Materials

質量
質量
WeightWeight1±0.1

内容Description
Description
内容

パッケージ材質
ダイヒートシンクパッケージ材質
ダイヒートシンク
ダイヒートシンク
Die
Heatsink
PackageMaterials
Materials
Die
Heat
Sink Package
Die
Heat
Sink

2.2
2.2
1.4
1.4

カソード
CathodeCathodeCathode2

Direction

5.8
5.8

7.1
7.1
5.7
5.7

BB

±0.1

2

Feeding
トレーラ部/リーダ部 Trailer
and Leader
AA

0.25±0.05

2±0.1(2.65)(2.65)

0.2
0.2 BBPa
No.

1.75±0.1

Φ1.5+0.1
-0

2.5
2.5

1.15±0.05
1.15±0.05(1.95)(1.95)

11.8
11.8
9.8
9.8
(9)
(9)

テーピング部 Tape

12.05±0.1

88
(7.2)
(7.2)
0.5
0.5

カソードマーク
CathodeMark
CathodeMark
CathodeMark

Embossed Carrier Tape

(単位
mm)
(単位
(単位 Unit:
Unit:±0.1)mm)(単位Unit:
Unit: mm,mm, 公差公差Tolerance:
Tolerance:
±0.1)

2±0.1

LED

24+0.3-0.1

本製品はRoHS指令に適合しております。
**本製品はRoHS指令に適合しております。
This
Thisproductproductcomplies
complieswith
withRoHS
RoHSDirective.
Directive.
括弧で囲まれた寸法は参考値です。
**括弧で囲まれた寸法は参考値です。
The
Thedimension(s)dimension(s)ininparentheses
parenthesesare
areforforreference
referencepurposes.
purposes.

形状2
形状2Shape2
Shape2* 数量は1リールにつき1800個入りです。
This document contains tentative information, Nichia may
change the contents
without notice.

2/14

25.5±1

Reel Size: 1800pcs
SP-QR-C2-220184-1* 実装作業の中断などでエンボスキャリアテープをリールに巻
エンボスキャリアテープを強く(10N以上)締めないで下さい
Jun. 8, 2022
LEDがカバーテープに貼り付く可能性があります。

Assembly Precautions for the Nichia 193F Series LEDs

1. LED Outline Dimensions/Tape Dimensions
Table 2. NC2W193F Product Specifications
PartNo.
No.NC2W193F
NC2W193FPart
No. STS-DA7-17856A
STS-DA7-17856A
No.

2.5
2.5

1.15±0.05

11.5±0.1

1.8 MaxMax
1.8

2±0.1 4±0.1

Pa
No. S

0.25±0.05

(2.2)
(2.2)

2±0.1

(2.4)

11.8
9.8
(9)

12±0.1

Φ1.5+0.1-01.75±0.1

テーピング部 Tape

12.05±0.1

88
(7.2)
(7.2)
0.5
0.5

カソードマーク
CathodeMark
CathodeMark
CathodeMark

Embossed Carrier Tape

(単位Unit:
Unit:±0.1)
mm)
(単位
mm)
(単位Unit:
Unit: mm,mm, 公差公差Tolerance:
Tolerance:
±0.1)
(単位

2±0.1

LED

24+0.3-0.1

本製品はRoHS指令に適合しております。
* 本製品はRoHS指令に適合しております。
*
This productproduct complies
complies with
with RoHS
RoHS Directive.
Directive.
This
括弧で囲まれた寸法は参考値です。
* 括弧で囲まれた寸法は参考値です。
*
The dimension(s)dimension(s) inin parentheses
parentheses areare forfor reference
reference purposes.
purposes.
The

2.3±0.05
2.3±0.05

0.2 B
B
0.2

0.2 AA
0.2

(3.2)
(3.2)

1

2

(0.5 クロスバー凹部)(0.5Crossbar
Crossbar
Recess)(0.5
Recess)(0.5
クロスバー凹部)

0.5
0.5
0.9
0.9
1.27
1.27

Φ2.05±0.05

Feeding
Direction

±0.1

±0.1

2

2

A
A

6.8
6.8

2.2
1.4

0.9

7.1
5.7

B
B

ダイヒートシンク
ダイヒートシンク
Die
Heatsink
ダイヒートシンク
Die
Heat
Sink
Die
Heat
Sink

カソード
CathodeCathodeCathode

0.9
0.9

アノード
Anode
Anode
Anode

項目 Item
Item
項目

内容Description
Description
内容

パッケージ材質
パッケージ材質
Package Materials
Materials
Package

黒色耐熱性ポリマー
黒色耐熱性ポリマー
Black Heat-resistantHeat-resistantPolymer
PolymerBlack

蛍光体板材質
蛍光体板材質Phosphor sheet
sheet
Phosphor
Materials
Materials

蛍光体セラミックス
蛍光体セラミックス
PhosphorCeramics
Ceramics
Phosphor

封止樹脂材質
封止樹脂材質Encapsulating
Encapsulating Resin
Resin
Materials
Materials

シリコーン樹脂
シリコーン樹脂
Silicone
SiliconeResin
Resin

電極材質
電極材質
Electrodes
Electrodes Materials
Materials

銅合金+金メッキ
銅合金+金メッキ
Au-plated
Au-platedCopper
Copper Alloy
Alloy

ダイヒートシンク材質
ダイヒートシンク材質
Die
Die Heat
Heat Sink
Sink
Materials
Materials

銅合金+金メッキ
銅合金+金メッキ
Au-plated
Au-platedCopper
Copper Alloy
Alloy

質量
質量
WeightWeight0.36g(TYP)
0.36g(TYP)(Unit: mm, Tolerance: ±0.1mm)

Light Emitting Diode

AA

形状2
形状2
Shape2
Shape2

エンボスキャ
Embosse(Unit: mm)

トップ
Top

Direction of the LED in the embossed carrier tape pocket: thecathode faces the feeding direction of the tape as shown in the
figure above.

1 The centerline of the emitting area in the lateral direction is parallel to B; thedeviationin distance between the centerline±0.1mm.
引き出し部最小100mm（空部）
LED装着部 and B is within
トレーラ部最小160mm（空部）
Leader with Top Cover Tape
Trailer 160mm MIN(Empty Pockets)
Loaded Pockets
100mm
MIN(Empty Pocket)
2

The deviation of the centerline of the emitting area in the longitudinal
リーダ部最小400mm
direction from the centerline of the die heatsink in the longitudinal
is 400mm M
Leader without direction
Top Cover Tape
within ±0.1mm. ±2

バリは寸法に含まないものとします。
** バリは寸法に含まないものとします。
Dimensions
Dimensions do
do notnot include
include mold
mold flash
flash orormetalmetalburr.
burr.
製品には以下のようなリボン形状が含まれます。
製品には以下のようなリボン形状が含まれます。
**
It
shapes.
It maymay containcontain thethe products
productshaving
having thethefollowing
followingribbon
ribbonリール部
shapes. Reel

形状1形状1
Shape1
Shape1K
K

Weight: typ. 0.36g

1.95±0.1

8.25±0.1

トレーラ部/リーダ部 Trailer and Leader
5.8
5.8

1±0.1

330

This document contains tentative information, Nichia may*change
the contents
without notice.
数量は1リールにつき1800個入りです。

3/14

25.5

±1

Reel Size: 1800pcs
SP-QR-C2-220184-1* 実装作業の中断などでエンボスキャリアテープをリールに
エンボスキャリアテープを強く(10N以上)締めないで下さJun. 8, 2022

Assembly Precautions for the Nichia 193F Series LEDs

1. LED Outline Dimensions/Tape Dimensions
Table 3. NC3W193F Product Specifications
PartNo.
No.NC3W193F
NC3W193F
Part
Part
No.
NC3W193F
No.STS-DA7-17846A
STS-DA7-17846A
No.
No.
STS-DA7-17846A

2±0.1 4±0.1

11.5±0.1

1.8Max
Max
1.8
1.8
Max

1

0.2
0.2 A
0.2
AA

2±0.1
(0.5 クロスバー凹部)

0.5
0.5
0.5
0.9
0.9
0.9
1.27
1.27
1.27

2

(0.5Crossbar
Crossbar
Recess)(0.5
Recess)(0.5
クロスバー凹部)

Φ2.05

±0.05

2±0.1

2±0.1

6.8
6.8
6.8

7.1
7.1
7.1
5.7
5.7
5.7

B
BB

項目
項目ItemItem
項目
Item
パッケージ材質
ダイヒートシンクパッケージ材質
ダイヒートシンクパッケージ材質
ダイヒートシンク
PackageMaterials
Materials
Die
Heat
Sink
Die
Heat
Sink Package
Die
Heatsink
ダイヒートシンク
Package
Materials
Die
Heat
Sink

0.9
0.9
0.9
2.2
2.2
2.2
1.4
1.4
1.4

CathodeCathodeカソード
CathodeCathode蛍光体セラミックス
蛍光体セラミックス
蛍光体セラミックス
Phosphor
PhosphorCeramics
Ceramics
Phosphor
Ceramics

封止樹脂材質
封止樹脂材質
封止樹脂材質Encapsulating
EncapsulatingResin
Resin
Encapsulating
Resin
Materials
Materials
Materials

シリコーン樹脂
シリコーン樹脂
シリコーン樹脂
Silicone
SiliconeResin
Resin
Silicone
Resin

質量
質量
質量
WeightWeightWeight

0.9
0.9
0.9

Anode
Anode
アノード
Anode
Anode

K
KK

Light Emitting Diode

A
AA

銅合金+金メッキ
銅合金+金メッキ
銅合金+金メッキ
Au-plated
Au-platedCopper
Copper Alloy
Alloy
Au-plated
CopperAlloy

銅合金+金メッキ
銅合金+金メッキ
銅合金+金メッキ
Au-plated
Au-platedCopper
Copper Alloy
Alloy
Au-plated
CopperAlloy

Weight: typ.
0.37g
0.37g(TYP)
0.37g(TYP)
0.37g(TYP)(Unit: mm, Tolerance: ±0.1mm)

形状2
形状2
形状2
Shape2
Shape2
Shape2

トップTop

Direction of the LED in the embossed carrier tape pocket: thecathode faces the feeding direction of the tape as shown in the
figure above.

1 The centerline of the emitting area in the lateral direction is parallel to B; the引き出し部最小100mm（空部）
LED装着部 and B is within
トレーラ部最小160mm（空部）
deviationin distance between theLoaded
centerline±0.1mm.
Leaderwith Top Cover Tape
Trailer 160mm MIN(Empty Pockets)
Pockets
100mm MIN(Empty Pocket)
2 The deviation of the centerline of the emitting area in the longitudinal

リーダ部最小400mm

バリは寸法に含まないものとします。
バリは寸法に含まないものとします。
***バリは寸法に含まないものとします。
Dimensions
Dimensions do
do notnotinclude
includemold
moldflashflashorormetalmetalburr.
burr.
Dimensions
donotinclude
mold
flash
or
metal
burr.
製品には以下のようなリボン形状が含まれます。
製品には以下のようなリボン形状が含まれます。
*
リール部
Reel
**製品には以下のようなリボン形状が含まれます。
It
may
containthe
products
havingthefollowingItmaycontainthe
products
havingthefollowingribbonshapes.
shapes.
It may contain the products having the following ribbon
ribbonshapes.
形状1形状1形状1Shape1
Shape1
Shape1

エンボスキャ
Embossed

内容
内容Description
Description
内容
Description
黒色耐熱性ポリマー
黒色耐熱性ポリマー
黒色耐熱性ポリマー
Black
BlackHeat-resistantHeat-resistantPolymer
PolymerBlack
Heat-resistant
Polymer

蛍光体板材質
蛍光体板材質
蛍光体板材質Phosphor
Phosphorsheet
sheet
Phosphor
sheet
Materials
Materials
Materials

電極材質
電極材質
電極材質
Electrodes
ElectrodesMaterials
Materials
Electrodes
Materials
ダイヒートシンク材質
ダイヒートシンク材質
ダイヒートシンク材質
Die
DieHeatHeatSink
Sink
Die
Heat
Sink
Materials
Materials
Materials

1.95±0.1(Unit: mm)

Direction

5.8
5.8
5.8

1±0.1

8.25±0.1

Feeding
トレーラ部/リーダ部 Trailer
and Leader
AAA

0.25±0.05

2.5
2.5
2.5

3.45±0.05
3.45±0.05
3.45±0.05
(4)
(4)
(4)

0.2
0.2 B
0.2
BB

Pa
No. S

1.75±0.1

12±0.1

Φ1.5+0.1
-0

(2.2)
(2.2)
(2.2)

(2.4)
(2.4)
(2.4)

11.8
11.8
11.8
9.8
9.8
9.8
(9)
(9)
(9)

1.15±0.05
1.15±0.05
1.15±0.05

Cathode Mark

テーピング部 Tape

12.05±0.1

8
88
(7.2)
(7.2)
(7.2)
0.5
0.5
0.5

カソードマーク
CathodeMark
CathodeMark
CathodeMark

Embossed Carrier Tape

(単位Unit:
Unit:
mm)
(単位
mm)
(単位Unit:
Unit:mm,mm, 公差公差Tolerance:
Tolerance:
±0.1)
(単位
±0.1)
(単位
Unit:
mm)
(単位
Unit:
mm,
公差
Tolerance:
±0.1)

2±0.1

LED

24+0.3-0.1

本製品はRoHS指令に適合しております。
本製品はRoHS指令に適合しております。
**本製品はRoHS指令に適合しております。
*
This productproductcomplies
complies with
withRoHS
RoHSDirective.
Directive.
This
product
Thiscomplies
with
RoHS
Directive.
括弧で囲まれた寸法は参考値です。
括弧で囲まれた寸法は参考値です。
*** 括弧で囲まれた寸法は参考値です。
Thedimension(s)dimension(s)inin parentheses
parenthesesare
areforforreference
referencepurposes.
purposes.
The
dimension(s)Theinparentheses
areforreference
purposes.

Leader without Top Cover Tape 400mm M
direction from the centerline of the die heatsink in the longitudinal
direction iswithin ±0.1mm.
330±2* 数量は1リールにつき 1800個入りです。

This document contains tentative information, Nichia may Reelchangethe contents without notice.
Size: 1800pcs

4/14

25.5±1* 実装作業の中断などでエンボスキャリアテープをリールに巻
SP-QR-C2-220184-1
エンボスキャリアテープを強く(10N以上)締めないで下さい
Jun. 8, 2022
LEDがカバーテープに貼り付く可能性があります。

Assembly Precautions for the Nichia 193F Series LEDs

1. LED Outline Dimensions/Tape Dimensions
Table 4. NC4W193F Product Specifications
Part No.
No.NC4W193F
NC4W193FPart
No. STS-DA7-17901
STS-DA7-17901
No.

2±0.1 4±0.1

2.5
2.5

1.15±0.05
1.15±0.05

11.5±0.1

1.8MaxMax
1.8

12±0.1PaNo.

1.75±0.1

Φ1.5+0.1
-0

0.25

(2.2)
(2.2)

2±0.1

(2.4)
(2.4)

11.8
11.8
9.8
9.8
(9)
(9)

テーピング部 Tape

4.6±0.05
4.6±0.05
(5.1)
(5.1)

0.2 BB
0.2

1

0.2 AA0.2

2(0.5 クロスバー凹部)

0.5
0.5
0.9
0.9
1.27
1.27

(0.5Crossbar
Crossbar
Recess)(0.5
Recess)(0.5
クロスバー凹部)

Φ2.05

±0.05

Feeding
トレーラ部/リーダ部 Trailer
and Leader
AA

5.8
5.8
ダイヒートシンク
ダイヒートシンク
DieHeatHeatsink
ダイヒートシンク
Die
Heat
Sink
Die
Sink

6.8
6.8

0.9
0.9
2.2
2.2
1.4
1.4

カソード
CathodeCathodeCathode項目Item
Item
項目

内容Description
Description
内容

パッケージ材質
パッケージ材質
PackageMaterials
Materials
Package

黒色耐熱性ポリマー
黒色耐熱性ポリマー
BlackHeat-resistantHeat-resistant Polymer
PolymerBlack

蛍光体板材質
蛍光体板材質Phosphorsheet
sheet
Phosphor
Materials
Materials

蛍光体セラミックス
蛍光体セラミックス
PhosphorCeramics
Ceramics
Phosphor

封止樹脂材質
封止樹脂材質EncapsulatingResin
Resin
Encapsulating
Materials
Materials

シリコーン樹脂
シリコーン樹脂
SiliconeResin
Resin
Silicone

電極材質
電極材質
ElectrodesMaterials
Materials
Electrodes

銅合金+金メッキ
銅合金+金メッキ
Au-platedCopper
Copper Alloy
Alloy
Au-plated

ダイヒートシンク材質
ダイヒートシンク材質
DieHeatHeat Sink
Sink
Die
Materials
Materials

銅合金+金メッキ
銅合金+金メッキ
Au-platedCopper
Copper Alloy
Alloy
Au-plated

質量
質量
WeightWeight

2

2

0.9
0.9

アノード
Anode
Anode
Anode

Light Emitting Diode

Weight: typ.
0.38g
0.38g(TYP)
0.38g(TYP)

1±0.1
1.95±0.1

エンボスキ
Embosse8.25±0.1(Unit: mm)トッTo

Direction of the LED in the embossed carrier tape pocket: thecathode faces the feeding direction of the tape as shown in the
figure above.

1 The centerline of the emitting area in the lateral direction is parallel to B; the引き出し部最小100mm（空部）
LED装着部 and B is within
トレーラ部最小160mm（空部）
deviationin distance between the centerline±0.1mm.
Leader with Top Cover Tape
Trailer 160mm MIN(Empty Pockets)
Loaded Pockets
100mm MIN(Empty Pocket)
2 The deviation of the centerline of the emitting area in the longitudinal

バリは寸法に含まないものとします。
リーダ部最小400mm**バリは寸法に含まないものとします。
Dimensions do
do notnot include
includemold
mold flash
flash orormetalmetalburr.
burr. direction from the centerline of the die heatsink in the longitudinal
Dimensions
Leader withoutdirection
Top Cover Tapeis 400mm
製品には以下のようなリボン形状が含まれます。
**製品には以下のようなリボン形状が含まれます。
リール部
Reel
mm,
±0.1mm)may containcontaintheTolerance:
productshaving
havingthefollowing
followingribbon
ribbonshapes.±0.1mm.
ItIt (Unit:maytheproducts
theshapes.
within形状1形状1Shape1
Shape1

KK±0.1

Direction

7.1
7.1
5.7
5.7

BB

±0.1

±0.05

12.05±0.1

88
(7.2)
(7.2)
0.5
0.5

カソードマーク
CathodeCathodeMark
Mark
CathodeMark

Embossed Carrier Tape

(単位Unit:
Unit:±0.1)
mm)
(単位
mm)
(単位Unit:
Unit: mm,mm, 公差公差Tolerance:
Tolerance:
±0.1)
(単位

2±0.1

LED

24+0.3-0.1

本製品はRoHS指令に適合しております。
** 本製品はRoHS指令に適合しております。
This productproduct complies
complies with
withRoHS
RoHS Directive.
Directive.
This
括弧で囲まれた寸法は参考値です。
** 括弧で囲まれた寸法は参考値です。
The dimension(s)dimension(s)inin parentheses
parenthesesare
are forforreference
reference purposes.
purposes.
The

AA
形状2
形状2
Shape2
Shape2330±2

数量は1リールにつき1800個入りです。
This document contains tentative information, Nichia may*change
the contents
without notice.

5/14

25.5

±1

Reel Size: 1800pcs
SP-QR-C2-220184-1* 実装作業の中断などでエンボスキャリアテープをリールに
エンボスキャリアテープを強く(10N以上)締めないで下さJun. 8, 2022
LEDがカバーテープに貼り付く可能性があります。

Assembly Precautions for the Nichia 193F Series LEDs

1. LED Outline Dimensions/Tape Dimensions
Table 5. NC5W193F Product Specifications
Part
No.
NC5W193F
Part
No.
NC5W193F
No.
STS-DA7-17872
No.
STS-DA7-17872

2±0.1 4±0.1

11.5±0.1

1.8
Max
1.8
Max

12±0.1PaNo.

1.75±0.1

Φ1.5+0.1
-0

0.25

(2.2)
(2.2)

2±0.1

(2.4)
(2.4)

2.5
2.5

1.15±0.05
1.15±0.05

11.8
11.8
9.8
9.8
(9)
(9)

テーピング部 Tape

5.75±0.05
5.75±0.05
(6.1)
(6.1)

0.2
0.2B B

1

0.5
0.5
0.9
0.9
1.27
1.27

0.2
0.2A A2(0.5 クロスバー凹部)(0.5Crossbar
Crossbar
Recess)(0.5
Recess)(0.5
クロスバー凹部)

Φ2.05

±0.05

Feeding
トレーラ部/リーダ部 Trailer
and Leader
AA

6.8
6.8

ダイヒートシンク
ダイヒートシンク
Die
Heatsink
ダイヒートシンク
Die
Heat
Sink
Die
Heat
Sink

0.9
0.9
2.2
2.2
1.4
1.4

カソード
CathodeCathodeCathode

0.9
0.9

項目
Item
項目
Item

内容
Description
内容
Description

パッケージ材質
パッケージ材質
Package
Materials
Package
Materials

黒色耐熱性ポリマー
黒色耐熱性ポリマー
Black
Heat-resistant
PolymerBlack
Heat-resistant
Polymer

蛍光体板材質
蛍光体板材質Phosphorsheet
Phosphor
sheet
Materials
Materials

蛍光体セラミックス
蛍光体セラミックス
Phosphor
Ceramics
Phosphor
Ceramics

封止樹脂材質
封止樹脂材質Encapsulating
Resin
Encapsulating
Resin
Materials
Materials

シリコーン樹脂
シリコーン樹脂
Silicone
Resin
Silicone
Resin

電極材質
電極材質
Electrodes
Materials
Electrodes
Materials

銅合金+金メッキ
銅合金+金メッキ
Au-plated
CopperAlloy
Au-plated
CopperAlloy

ダイヒートシンク材質
ダイヒートシンク材質
Die
Heat
Sink
Die
Heat
Sink
Materials
Materials

銅合金+金メッキ
銅合金+金メッキ
Au-plated
CopperAlloy
Au-plated
CopperAlloy

質量
質量
WeightWeight0.38g(TYP)

2

2

アノード
Anode
Anode
Anode

Light Emitting Diode

形状2形状2Shape2
Shape21.95±0.1

エンボスキ
Embosse8.25±0.1(Unit: mm)

トップ
Top

cathode faces the feeding direction of the tape as shown in the
figure above.

1 The centerline of the emitting area in the lateral direction is parallel to B; theWeight: typ.
0.38g
0.38g(TYP)(Unit: mm, Tolerance: ±0.1mm)

AA

1±0.1

Direction of the LED in the embossed carrier tape pocket: the引き出し部最小100mm（空部）
LED装着部 and B is within
トレーラ部最小160mm（空部）
deviationin distance between the centerline±0.1mm.
Leader with Top Cover Tape
Trailer 160mm MIN(Empty Pockets)
Loaded Pockets
100mm MIN(Empty Pocket)
2 The deviation of the centerline of the emitting area in the longitudinal* バリは寸法に含まないものとします。
* バリは寸法に含まないものとします。
Dimensions
dodo
notinclude
mold
flash
oror
metal
burr.
Dimensions
notinclude
mold
flash
metal
burr.
* 製品には以下のようなリボン形状が含まれます。
* 製品には以下のようなリボン形状が含まれます。
リール部
Reel
It It
may
containthe
products
havingthefollowingribbonshapes.
maycontainthe
products
havingthefollowingribbonshapes.
形状1形状1Shape1
Shape1

KK±0.1

Direction

5.8
5.8

7.1
5.77.1
5.7

BB

±0.1

±0.05

12.05±0.1

88
(7.2)
(7.2)
0.5
0.5

カソードマーク
CathodeMark
CathodeMark
CathodeMark

Embossed Carrier Tape

(単位
Unit:
mm)
(単位
Unit:
mm)
(単位
Unit:
mm,公差
公差
Tolerance:
±0.1)
(単位
Unit:
mm,
Tolerance:
±0.1)

2±0.1

LED

24+0.3-0.1

本製品はRoHS指令に適合しております。
本製品はRoHS指令に適合しております。
**
This
product
complies
with
RoHS
Directive.
This
product
complies
with
RoHS
Directive.
括弧で囲まれた寸法は参考値です。
括弧で囲まれた寸法は参考値です。
**
The
dimension(s)in inparentheses
areforforreference
purposes.
The
dimension(s)parenthesesarereference
purposes.

リーダ部最小400mm

Leader without direction
Top Cover Tape
direction from the centerline of the die heatsink in the longitudinal
is 400mm M
within ±0.1mm. ±2
330

数量は1リールにつき1800個入りです。
This document contains tentative information, Nichia may* change
the contents
without notice.

6/14

25.5

±1

Reel Size: 1800pcs
SP-QR-C2-220184-1* 実装作業の中断などでエンボスキャリアテープをリールに
エンボスキャリアテープを強く(10N以上)締めないで下さい

Jun. 8, 2022

Assembly Precautions for the Nichia 193F Series LEDs

2. Handling Precautions
2.1 Prohibited area
Do not touch the prohibited area shown in Figure 1. This may cause the LED malfunction (e.g. the LED not toilluminate).
2.2 Handling with bare hands
Do not handle the LEDs with bare hands:- this may contaminate the LED surface and have an effect on the optical characteristics,- this may cause the LED to deform or to be damaged causing a catastrophic failure (i.e. the LED not toilluminate),- the electrodes and/or the die heatsink may cause injuries when the LED is handled with bare hands.
2.3 Handling with tweezers
Ensure that when handling the LEDs with tweezers, grab/hold the LEDs by the package (i.e. the black part) andensure that excessive force is not applied to the LED. Otherwise, it may cause damage to the LED (e.g. cut,scratch, chip, crack, etc.) and have an effect on the optical characteristics and/or the reliability. See Figure 2.

Prohibitedarea

Figure 1. Prohibited area

Correct

2.4 ESD Precautions
The LEDs are sensitive to transient excessive voltages (e.g. ESD, lightning surge). If this excessive voltage
occurs in the circuit, it may cause the LED to be damaged causing issues (e.g. the LED to become dimmer or
not to illuminate [i.e. catastrophic failure]). When handling the LEDs, ensure that necessary measures havebeen taken to protect them from transient excess voltages.
2.5 Stacking assembled PCBs together
Do not stack assembled PCBs together. Otherwise, it may cause damage to the LED (e.g. cut, scratch, chip,
crack, etc.) and have an effect on the optical characteristics and/or the reliability.
2.6 Storage
The storage/packaging requirements for the Nichia 193F Series LEDs are comparable to JEDEC MoistureSensitivity Level (MSL) 2 or equivalent. Nichia used IPC/JEDEC STD-020 as a reference to rate the MSL of theLEDs. Table 6 shows the required storage conditions for the LEDs.

Suggestion: Grab/hold the LEDs withtweezers by the package.

Incorrect

Table 6. Storage Conditions
Conditions
Storage

Temperature

HumidityTime

Before Opening Aluminum Bag≤30℃≤90%RHWithin 1 Year from Delivery Date

After Opening Aluminum Bag≤30℃≤70%RHWithin 1 Year

Caution: Do not touch theprohibited area.

Figure 2. Correct/Incorrect Examplesof Handling with Tweezers

This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

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Assembly Precautions for the Nichia 193F Series LEDs

3. Design Recommendations for Optimal Amount of Solder
Soldering Pad Pattern/Metal Solder Stencil Aperture

Table 7. Recommended Soldering Pad Pattern/Metal Solder Stencil Aperture3

Package Outline

Center of the Soldering Pad
Pattern
Soldering Pad Pattern

Electrodes and Die Heatsink

Metal Solder Stencil Aperture

Recommended Metal Solder Stencil Aperture
Recommended Soldering Pad Pattern
Pattern Recommended in the Specification

Modified Pattern4

6 .8(Unit: mm)Table 8. Recommended Solder/Metal Solder Stencil Conditions3
Recommended Conditions

0 .3
6

0 .15

3

3 .3

3 .15

12 .3

6 .55

5

0 .4
2 .3

3 .55 2 .6

7 .35

1 .2

12 .3

2 -C0 .5
4-C0 .5
0 .5
1 .5

0 .5

Item

0 .3

2 -C0 .8

4 .05

12 .3

2 .1

5 .2

5 .8
6 .8

0 .5
6 .8
(Unit: mm)(Unit: mm)

3 The recommended soldering pad pattern, metal solder stencil aperture, and thicknessof the metal solder stencil provided in Tables 7 and 8 have been determined under
Nichia’s conditions: ensure that there are no issues with the chosen assembly conditions
prior to use.
4 If the aperture is large, the solder paste may not be applied evenly (i.e. thinner for the

Metal Solder Stencil(Thickness)

120μm

Solder Paste(Composition)

Sn-3.0Ag-0.5Cu

middle area of the aperture) in the solder printing process causing the amount of thesolder paste applied to the soldering pad pattern to vary for each operation. This
modified pattern has four small apertures for the die heatsink instead of one large
aperture while the total area of the aperture is almost the same as that for the pattern
recommended in the specification.

This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

8/14

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Jun. 8, 2022

Assembly Precautions for the Nichia 193F Series LEDs

4. Precautions for Setting up a Pick-and-Place Machine/Nozzle
Table 9. Cautions/Suggestions for Setting up the Equipment
Item

Recommended Conditions/Specifications

Cautions/Suggestions

Pick-and-place machine

Modular mounter

YS100 High-Speed General-Purpose Modular(manufactured by Yamaha Motor Co., Ltd.)

Pick-and-place nozzle

Nozzle specifically designed for the LEDs (see Figure 3)

See “4.1 Pick-and-Place Nozzle” on Page 10 for details.

Tape-and-reel feeder

Electrical (motorized) feeder

Tape width: 24mm
Feeder pitch: 12mm

Top cover tape removal
position

Immediately before pick-up

See “4.2 Tape-and-Reel Feeder” on Page 11 for details.

Nozzle height for pick-up
operations

The contact surface of the nozzle head for pick
operations should be adjusted to 1.05mm below theedge of the embossed carrier tape pocket.

See “4.3 Recommended Nozzle Height for Pick-up
Operations” on Page 11 for details.

Nozzle height for placement
operations (i.e. placement
depth)

0.2mm for the placement depth

See “4.4 Recommended Nozzle Height for Placement
Operations (Placement Depth)” on Page 12 for details.

Imaging-based automatic
inspection

To locate the center of the LED, using the electrodes
and die heatsink as a reference is recommended.

See “4.5 Imaging-based Automatic Inspection" on Page
12 for details.

This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

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Assembly Precautions for the Nichia 193F Series LEDs
4.1 Pick-and-Place Nozzle
R0 .751 .1

2. When setting the LED pick-up position, ensure that the center of the nozzle and thecenter of the LED are aligned and that the nozzle is oriented correctly (see Figure 4).
If the nozzle does not pick up the LED at the center of the LED, and/or if the orientationof the nozzle is incorrect, this may damage the LED (i.e. scratch, chip, crack, deformation,etc.), affecting the optical characteristics and/or the reliability, or causing the LED not toilluminate. This may also lead to an incorrect pick up (i.e. the LED is picked up in a tilted
position).

2 .2

5 .1

9 .5

10 .2

R0 .25

1. Use a pick-and-place nozzle that does not come in contact with the bonding ribbons of
the LED. Figure 3 shows the recommended dimensions for the pick-and-place nozzle.
Ensure that the size and shape of the nozzle tip are appropriate for the LEDs. Otherwise,
this may damage the LED (i.e. scratch, chip, crack, deformation, etc.), affecting the opticalcharacteristics and/or the reliability, or causing the LED not to illuminate. This may also
lead to an incorrect pick up (i.e. the LED is picked up in a tilted position).

0 .5
4

A

7 .5
8

Bonding Ribbons(Unit: mm)

Figure 3. Recommended Nozzle Dimensions

B

A’

B’
Cross-sectional
View along A-Aʼ
Pick-and-Place Nozzle

0.9mm

5
5 The height of the LED is the same for all the LEDs in

the 193F series.

Cross-sectional View along B-Bʼ
Figure 4. LED Pick-up Position (the NC5W193F LED is shown as an example.)
This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

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Assembly Precautions for the Nichia 193F Series LEDs
4.2 Tape-and-Reel Feeder
Feeder Cover

Top Cover Tape

Recommended
Top Cover Tape
Removal Position

Pick-and-Place Nozzle

1. For the tape-and-reel feeder, the tape width is set to24mm and the feeder pitch is set to 12mm.
2. Use a tape-and-reel feeder that ensures it does notcreate excessive vibrations causing assembly issues.
Example: Electric (motorized) feeder
3. It is recommended to remove the top cover tape atthe recommended position shown in Figure 5 (i.e.
immediately before LED pick-up).

LED Pick up
position

Feeding Direction of the Embossed Carrier Tape

Figure 5. Recommended Top Cover Tape Removal Position

4. When handling the reel of the LEDs, ensure that
excessive force is not applied to the bonding ribbonsof the LEDs. Otherwise, this may cause the ribbons to
deform causing the LED to be damaged or not toilluminate.

4.3 Recommended Nozzle Height for Pick-up Operations
Pick-and-Place
Nozzle1. Ensure that the nozzle goes down onto the LED in the tape pocket until the tip
touches the package (i.e. the black part).
Pick-up depth: 1.05mm
Note: If the reference level for the nozzle setting is at the edge of the tape pocket.
2. The recommended nozzle height for pick-up operations has been determined by
Nichia under specific verification conditions (see Table 9) and may not function as
expected with some other pick-and-place machines. If the pick-up operations are
unstable even with using the recommended nozzle height, adjust the nozzle heightappropriately for the pick-and-place machine being used.

LED

1.05mm below the edgeof the tape pocket (i.e.
Pick-up depth)
Embossed Carrier Tape (Pocket)

Figure 6. Recommended Nozzle Height for Pick-up Operations

If the pick point of the nozzle is too high,- it may cause insufficient suction power leading to picking errors (e.g. thenozzle’s failure to pick/lift the LED into the air, incorrect picking causing the
LED to tilt when in the air).
If the pick point of the nozzle is too low,
- it may cause issues (e.g. causing the embossed carrier tape to shake, causing
the tape pocket to deform) leading to picking failure.
This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

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Jun. 8, 2022

Assembly Precautions for the Nichia 193F Series LEDs
4.4 Recommended Nozzle Height for Placement Operations (Placement Depth)
1. The nozzle should further press the LED 0.2mm onto the PCB from theheight where the LED first touches solder paste.

Pick-and-Place Nozzle

If the release point of the nozzle is too high,- it may cause placement issues (e.g. the LED to stick to the nozzle
after placement, the LED to be mounted in an incorrect
place/rotated position, the LED to become soldered to the PCB ina tilted position, etc.).

LED

0.9mm
Placement
Depth
0.2mm

If the release point of the nozzle is too low,
- excessive forces may be applied to the LED during placement andit may cause the LED to become damaged.

PCB

Figure 7. Recommended Nozzle Height for Placement (Placement Depth)

4.5 Imaging-based Automatic Inspection
1. Nichia recommends using the electrodes and die heatsink as a reference
to locate the center of the LED.
Electrode/Die Heatsink Location
Detection/Recognition Points

2. If the imaging device has trouble detecting/recognizing theelectrodes/die heatsink, adjust the settings (i.e. the brightness of thelight, etc.) of the pick-and-place machine.

Polarity Detection/Recognition
Point

3. If an automatic polarity detector is used for the LEDs, set up the imaging
device to detect the empty space between the die heatsink andelectrodes (i.e. Polarity Detection/Recognition Point in Figure 8 to theleft). In the example in Figure 8, the equipment measures the brightnessof the empty space against the threshold to locate the electrodes
and/or determine the polarity.

Figure 8. Example of Reference Point to Detect, Recognize, or Locate
the Electrodes/Die Heatsink

Light Emitting Diode

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 193F Series LEDs

5. Precautions When Reflow Soldering
1. Reflow soldering must not be performed more than twice.
1~5℃/sec

Pre-heat180~200℃

260℃ Max
10sec Max

220℃ Max
60sec Max

120sec Max

Figure 9. Recommended Reflow Soldering Condition(Lead-free Solder)

2. Nichia recommends using the reflow soldering conditions detailed in Figure 9
to the left; use the recommended reflow conditions specified by the
manufacturer of the solder paste being used if it works better for the chosen
application.
Note: To ensure that these reflow conditions have no negative effect on theLEDs, perform sufficient verification prior to use.
3. When cooling the LEDs from the peak temperature a gradual cooling slope isrecommended; do not cool the LEDs rapidly.
4. During reflow soldering, the heat and atmosphere in the reflow oven may cause
the optical characteristics to degrade. In particular, reflow soldering performed
with an air atmosphere may have a greater negative effect on the opticalcharacteristics than if a nitrogen atmosphere is used; Nichia recommends using
a nitrogen reflow atmosphere.

This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

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Assembly Precautions for the Nichia 193F Series LEDs

Disclaimer
This application note is a controlled document of Nichia Corporation (Nichia) published to provide technical information/data forreference purposes only. By using this application note, the user agrees to the following:• This application note has been prepared solely for reference on the subject matters incorporated within it and Nichia makes noguarantee that customers will see the same results for their chosen application.
• The information/data contained herein are only typical examples of performances and/or applications for the product. Nichia
does not provide any guarantees or grant any license under or immunity from any intellectual property rights or other rights
held by Nichia or third parties.
• Nichia makes no representation or warranty, express or implied, as to the accuracy, completeness or usefulness of any
information contained herein. In addition, Nichia shall not be liable for any damages or losses arising out of exploiting, using,or downloading or otherwise this document, or any other acts associated with this document.
• The content of this application note may be changed without any prior or subsequent notice.
• Copyrights and all other rights regarding the content of this document are reserved by Nichia or the right holders who havepermitted Nichia to use the content. Without prior written consent of Nichia, republication, reproduction, and/or redistributionof the content of this document in any form or by any means, whether in whole or in part, including modifications or derivative
works hereof, is strictly prohibited.

491 Oka, Kaminaka-Cho, Anan-Shi,
TOKUSHIMA 774-8601, JAPAN
Phone: +81-884-22-2311 Fax: +81-884-21-0148

NICHIA CORPORATION
http://www.nichia.co.jp

This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

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