H263-S62-LAW1
DP 2U 4-Node Liquid Cooling SolutionFeatures• Liquid cooling solution / 2U 4-node rear access server system• 4th Gen Intel ® Xeon ® Scalable Processors• Intel ® Xeon ® CPU Max Series• Dual processors, LGA4677• 8-Channel RDIMM DDR5 per processor, 16 x DIMMs per node
• Supports Intel ® Optane™ Persistent Memory 300 series• Dual ROM Architecture supported• 4 x Dedicated management ports• 1 x CMC global management port
• 24 x 2.5" Gen4 NVMe/SATA hot-swappable bays
• 4 x M.2 with PCIe Gen4 x4 interface (optional)• 4 x Low-profile PCIe Gen5 x16 expansion slots• 4 x OCP 3.0 Gen5 x16 mezzanine slots• Dual 3000W 80 PLUS Titanium redundant power supply

Specification
Dimensions

2U 4-Node - Rear access (W448 x H87.5 x D840 mm)

Rear I/O

Total: 8 x USB 3.2 Gen1, 4 x VGA, 4 x MLAN, 1 x CMC MLAN

Motherboard

MS63-HD1

Backplane I/O

PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

CPU

4th Generation Intel Xeon Scalable Processors
Intel® Xeon® CPU Max SeriesIntel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor,Intel® Xeon® Silver Processor
CPU TDP up to 225W

TPM

1 x TPM header with SPI interface (Optional TPM2.0 kit: CTM010)

Power Supply

Dual 3000W 80 PLUS Titanium redundant power supply
Available for 2+1 redundant power supply configuration (optional)
AC Input: 100-240V

Socket2 x LGA 4677 (Socket E) per nodeChipset

Intel® C741 Chipset

SystemManagementAspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X)

MemoryTotal 64 x DIMM slots (16 x DIMM slots per node)
RDIMM modules up to 128GB supported
3DS RDIMM modules up to 256GB supported
Memory speed: Up to 4800 MHz

OSCompatibility

Windows Server 2019 / 2011
RHEL 8.4 / 8.5 / 8.6 / 8.7 / 9.0 / 9.1 ( x64)
SLES 15 SP3 / 15 SP4 ( x64)
Ubuntu 22.04 LTS / 22.04.1 LTS (x64)
VMware ESXi 7.0 Update 3i / 8.0

LANTotal: 4 x Dedicated management ports
1 x 10/100/1000 CMC global management port

System Fans

4 x 80x80x38mm (18,300rpm)

Video

Integrated in Aspeed AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

OperatingProperties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)Management chip on CMC board:
Integrated in Aspeed AST2520A2-GP

PackagingContent

1 x H263-S62, 1 x Liquid cooling solution kit ,1 x Rail kit
Packaging Dimensions: 1185 x 705 x 409 mm

Total: 24 x 2.5" Gen4 NVMe/ SATA/ SAS hot-swap SSD bays
SAS card is required for SAS devices support

Reference
Numbers

Storage®

®

RAIDIntel® SATA RAID 0/1/10/5

Expansion
Slots

Total:
4 x PCIe Gen5 x16 low-profile slots
4 x OCP 3.0 Gen5 x16 mezzanine slots*4 x M.2 slots (M-key, PCIe Gen4 x4, NGFF-2280/22110)*Optional kit for M.2 extension riser card

Barebone package: 6NH263S62DR000LAW1*- Motherboard: 9MS63HD1UR-000- Rail kit: 25HB2-A66125-K0R- Liquid cooling kit: 25ST7-100006-C4R (cpu)- M.2 extension riser card: 9CMTP061NR-00 (optional)- Ring topology kit: 6NH263S62S1000AAN11 (optional, QPA:1)- Leak sensor board: 6NH263S62S1000LAN11 (optional, QPA:4)- Power Supply: 25EP0-230009-L0S- C19 power cord 125V/15A (US): 25CP1-018000-Q0R (optional)- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional)

Learn more about GIGABYTE server solutions, visit www.gigabyte.com/Enterprise* All specifications are subject to change without notice. Please visit our website for the latest information.
* Intel, the Intel logo, Xeon, and other Intel marks are trademarks of Intel Corporation or its subsidiaries.
* All other brands, logos and names are property of their respective owners.
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