Application Note

Light Emitting Diode

Assembly Precautions for LEDs
with an Integrated Lens

Table of Contents
1. Overview ............................................................ 2
2. Applicable Part Numbers ...................................2
3. Potential placement issues for lensed LEDs ...... 3
4. Countermeasures ................................................ 4
5. Other Cautions/Suggestions............................. 11
6. Summary .......................................................... 12

The part number NVSWx19Fx, NVSWx19D, NVSxx19C, NxSxx19Bx, NVSW3x9B, NVSW3x9A,
NVSW519A, NV4x144Ax, NV9W149AM, NF2W385ARx, and NFxW585ARx in this document are
the part number of our product, and do not have any relevance or similarity to other companies’
products that may have trademark rights.

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Application Note
1. Overview
The industry has been making efforts to improve the performance of LEDs; miniaturization and highfunctionality of LEDs are two examples of these efforts; Surface Mount Device (SMD) LEDs
acquired integrated lenses, which in combination with a compact package, made it more difficult topick and place these high-performance LEDs due to the smaller pick-up area surface. As a result, theimportance of pick-and-place technology is increasing year after year. Proper assembly of the LED
is very important as its quality also affects the function and reliability of the end product (i.e. lamps,
luminaires, and other types of fixtures/equipment).

Light Emitting Diode

This application note covers techniques on how to handle issues with picking and placing with
automated systems for high power LEDs with lenses based on placement issues that have been
identified in the past.

2. Applicable Part Numbers
The contents described in this application note apply to the LEDs shown in Table 1, Nichia's LEDs
for general lighting.
Table 1. Applicable LED Part/Series Numbers
Category

NICHIA x19 SeriesPart Number1 NVSWx19Fx

NVSWx19DNICHIA 3x9 Series

NVSxx19C

NxSxx19Bx

NVSW3x9B

NVSW3x9A

3.5×3.5×2.35

3.5×3.5×2.1

Package
Appearance(One example)
Package Size
[Unit : mm]

Category
Part Number1

3.5×3.5×2.3

3.5×3.5×2

NICHIA
519 Series
NVSW519ANICHIA
144 Series
NV4x144Ax

NICHIA
149 Series
NV9W149AM

3.5×3.5×2.35

5×5×3.15

7×7×3.1

NICHIA
385 Series
NF2W385ARx

NICHIA585 Series
NFxW585ARx

Package
Appearance(One example)
Package Size
[Unit : mm]

4×3.6×2.05

Note:
1
The x represents a letter that follows the alphanumeric code of the same LED type.
(Ex: NVSWx19Fx → NVSW119F, NVSW219F, NVSW119F-V1, NVSW219F-V1, etc.)

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Application Note
3. Potential placement issues for lensed LEDs
Since the integrated lenses for SMD LEDs are often made of resin materials, some are easily
damaged by external pressure. Additionally, some of those LEDs have a wire inside the lens. As aresult, it is necessary to avoid applying external stress to the lens, especially when the pick-and-placenozzle picks the LED.
The location of the lens also limits the points at which the nozzle can contact the LED during thepick-and-place process, this can sometimes cause an air leak to occur between the nozzle and theLED, and the LED may not be picked up properly out of the embossed carrier tape pocket (i.e. mispick). To prevent this type of mis-pick, it is necessary to be careful about the suction force of thenozzle.

Light Emitting Diode

Issue 1: Damage to the LED lens during the pick-and-place process
Issue 2: Mis-picks due to the suction force of the nozzle
The resin LED lenses can be tacky and stick to the embossed carrier top cover tape. If the LED lensis stuck to the top cover tape when the tape is pulled, it may cause the LED to be lifted up from thebottom of the embossed carrier tape pocket and become flipped/tilted and/or misaligned when it
peels off and then return to a position inside the pocket.
Additionally, adding a lens onto a SMD LED increases its center of gravity; if a large vibration isapplied to the embossed carrier tape, this may also lead to the LED being flipped/tilted and/or
misaligned in the embossed carrier tape.
Issue 3: Flipping/tilting of the LED due to sticking to the top cover tapeIssue 4: Flipping/tilting of the LED due to vibration of the embossed carrier tape
The following sections will explain specific countermeasures for the four issues mentioned above.

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Application Note
4. Countermeasures
4.1 Damage to the LED lens during the pick-and-place process (Issue 1)
For lensed LEDs, Nichia determines the ideal nozzle design and pick-up method according to thedesign (e.g. shape, weight, etc.) of each LED, and takes this into consideration when designing theembossed carrier tape.

Light Emitting Diode

There are two major methods for LED pick-up during placement:
One method is to stop the pick-and-place nozzle on the top surface or the middle surface of theembossed carrier tape and pull air in from the top/middle surface to grab the LED in the air (i.e.
aerial position pick-up). The other is a method in which a pick-and-place nozzle is inserted into theembossed carrier tape to apply suction at the closest possible point to the LED (i.e. typical position
pick-up).
Method 1:
Aerial position pick-up: By suctioning air from the height at which the nozzle does not contact theLED, the only load that will be applied to the lens is the suction force at the time of suction.
Method 2:
Typical position pick-up: Where aerial position pick-up is not possible or difficult, stable suction
is made possible by bringing the nozzle closer to the LED and then applying suction.
NozzleLED

Embossedcarrier tape

Pulling air in from the topof the embossed carrier tapeto pick up the LED

Pull air in from the middleof the embossed carrier tapeto pick up the LED

Figure 1. Aerial position pick-up

Insert the nozzle inside of theembossed carrier tape and thenapply suction to pick up the LED

Figure 2. Typical position pick-up

When designing a nozzle for a lensed LED, it is necessary to provide a clearance that takes into
consideration the tolerances of the dimensions for both the lens and the nozzle in order to completely
avoid contact between the lens and the nozzle. When designing or choosing the nozzle shape, having
the inner surfaces with C or R corners enables the nozzle to hold the LED flat to the nozzle leading
to a reduction in mis-pick rates and a smoother operation for the pick-up.
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Application Note
Refer to Table 2 below and on the following page for the recommended nozzle dimensions, pick-up
method, and nozzle insertion amount for each lensed LED. Be careful not to insert the nozzle
excessively.
Table 2. Examples of nozzle shape and pick-up method
Unit: mm
LED

Pick-up Method (Pick-up Position)

Recommended Nozzle

Part No. NVSWx19Fx Part No. NVSWx19D

0.03g (TYP)

0.03g (TYP)

Part No. NVSxx19CPart No. NxSxx19Bx

1 .9

3.5×3.5×2.3mm

0 .4

3.5×3.5×2.3mm

0 .5

At the top surface
φ3 .5

0 .15

Embossed Carrier Tape

4 .5
3.5×3.5×2mm

3.5×3.5×2mm

0.03g (TYP)

0.03g (TYP)

LED

Aerial Position Pick-up

Part No. NVSW3x9B Part No. NVSW3x9A

3.5×3.5×2.35mm

3.5×3.5×2.1mm

0.04g (TYP)

0.03g (TYP)

1 .9

0 .4

Nozzle0 .5

At the top surface
Part No. NVSW519A

φ3 .5

0 .15

Embossed Carrier Tape

4 .5
3.5×3.5×2.35mm

LED

0.04g (TYP)

Aerial Position Pick-up

Part No. NV4x144Ax

Nozzle5×5×3.15mm
0.09g (TYP)

2 .65

0 .5

Light Emitting Diode

Nozzle

φ5 .2
φ6 .2

From the top
insert 1.7mm

0 .15
LED

Embossed Carrier Tape
Aerial Position Pick-up

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Application Note
Unit: mm
LED

Pick-up Method (Pick-up Position)

Recommended Nozzle

Part No. NV9W149AM

0 .5

3 .75

Nozzle7×7×3.1mm

φ7 .2

0.19g (TYP)

φ8 .2

0 .15
LED
Typical Position Pick-up

Part No.
NFxW585ARx

R0 .154×3.6×2.05mm

4×3.6×2.05mm

0.04g (TYP)

0.04g (TYP)

Embossed Carrier TapeNozzle2

Light Emitting Diode

Part No.
NF2W385ARx

From the top
insert 1.8mm

φ3 .8
4 .4

From the top
insert 1.7mm

LED
Embossed Carrier Tape
Typical Position Pick-up

Supplemental Note: Adjusting the pick-up position
Ensure that the pick-up position is corrected before operating the pick-and-place machine (also called"mounter") using the hole in the center of the embossed carrier tape.
Example: The screen of the Yamaha YS mounter for adjusting the pick-up position is shown forreference in Figure 3. The setting screen for fine positioning of the pickup nozzle displays the pocket
hole on the top left side.

Figure 3. Yamaha YS mounter’s pick-up nozzle positioning screen (Reference)
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Application Note
4.2 Mis-picks due to the suction force of the nozzle (Issue 2)
Since the lensed LEDs have limited contact points with the nozzle during the pick-and-place process,air leaks may occur between the nozzle and the LED, which may cause the LED to not be picked up
properly. If this occurs, adjust the nozzle to a more appropriate suction by increasing the nozzle
suction force and/or reducing the nozzle inner diameter to reduce the potential for air leaks. When
reducing the inner diameter of the nozzle, ensure that the clearance takes into consideration thetolerances for the dimensions to ensure the nozzle does not touch the LED lens.

Light Emitting Diode

NozzleWhere air leaks occur(The gap between thenozzle tip and the LED)

NozzleLED

Air LeakLED

Figure 4. Air leak at the time of LED pick-up (example: part number NV9W149AM)

4.3 Flipping/tilting of the LED due to sticking to the top cover tape (Issue 3)
The resin LED lenses can be tacky and stick to the embossed carrier top cover tape. If the LED lensis stuck to the top cover tape when the tape is pulled, it may cause the LED to be lifted up from thebottom of the embossed carrier tape pocket and become flipped/tilted and/or misaligned when it
peels off and then return to a position inside the pocket. If the LED becomes misaligned within the
pocket, it may cause a mis-pick. Since it is not possible to completely reduce the tackiness, thissection covers some examples of countermeasures by adjusting the tape feeder unit settings when
LED sticking occurs.
4.3.1 Slow down the feed speed of the tape feeder
If the feed speed of the tape feeder is too fast, the nozzle tries to pick up the LED before the LED
peels off from the top cover tape and returns to a position inside the embossed carrier tape.

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Application Note
NozzleLED

カバーテープTop Cover Tape

エンボス
Embossed Carrier Tape

Mis-pick occurs

Light Emitting Diode

Figure 5. Tape feeder feed rate (fast)

Even when the LED sticks to the top cover tape, if the feed speed is slower, it allows for more time
for the LED to return to the proper position and the mis-pick rate is reduced.
When the feed speed is slow...

NozzleTop Cover Tape
LED

Embossed
Carrier Tape

LED peels off

Lower mis-pick rate

Figure 6. Tape feeder feed rate (slow)

Example: The screen of the Yamaha YS mounter for adjusting the feed rate is shown for referencein Figure 7 (in the red box). This pick-and-place machine has several options for the feed rate (e.g.
“Normal”, “90%”, “80%”, “70%”, etc.).

Figure 7. Yamaha YS mounter screen (Reference)
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Application Note
4.3.2 Adjust the peel angle of the top cover tapeThis is another countermeasure for when the lensed LED is sticking to the top cover tape. As shownin the figure below, by making the peeling angle of the top cover tape acute, the LED lens peels offfrom the top cover tape in a lower position than when the top cover tape is removed at a higher angle,
right after lifting from the pocket. This adjustment can reduce the chance of the LED flipping/tilting,and/or that the LED becomes misaligned within the pocket. Depending on the structure of the tapefeeder, some are pre-adjusted in the factory to the optimum peeling angle.
LED
カバーテープLight Emitting DiodeTop Cover Tape

エンボス

Embossed Carrier Tape

Figure 8. Peeling off the top cover tape at
an obtuse angle

Figure 9. Removing the top cover tapeat an acute angle

4.4 Flipping/tilting of the LED due to vibration of the embossed carrier tape (Issue 4)
During the pick-and-place process, when the embossed carrier tape is subjected to a large vibration,
LEDs can flip/tilt and/or become misaligned in the embossed carrier tape. Since the lensed LEDs
have a higher center of gravity than other LEDs, the vibration is more likely to cause LED
flipping/tilting and/or misalignment.
4.4.1 Slow down the feed speed of the tape feeder
The higher the feed speed of the tape feeder, the greater the vibration of the embossed carrier tape.
If the LED is flipping/tilting and/or misaligned, it is necessary to reduce the feed speed to reduce thevibration.
Additionally, pneumatic tape feeders have greater feed vibration than motorized tape feeders.
Selecting a tape feeder suitable for the parts is also important for stable placement.

LED

Embossed
Carrier
Tape
エンボス
エンボス

Figure 10. When the speed is fast

Figure 11. When the speed is slow

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Application Note
4.4.2 Change the peeling position of the top cover tape
Once the top cover tape peels off, more clearance is created above the top of the LED that may allow
the LED to move up and down due to vibration from the tape feeder. If the tape removal position is
too far away from the pick-up position and there are multiple pockets in the queue without the top
cover tape sealing them, as shown in Figure 12 below, it may lead to the LEDs in those pockets being
flipped/tilted and/or misaligned.
As a countermeasure, make adjustments so the top cover tape is peeled off immediately before pickup. This regulates the vertical movement of the LED and reduces the occurrence of LED
flipping/tilting and/or misalignment.

Light Emitting Diode

NozzleLED

Top Cover Tape

Embossed Carrier TapeThe
vertical clearance (i.e. between the top of the
吸着までの間、上下方向のクリアランスが大きい
LED and the guide rail cover) is large between thetape removal position and the pick-up position

Figure 12. Removing the top cover tape at the typical position

NozzleLED

Top Cover Tape

Embossed Carrier TapeThe
vertical clearance (i.e. between the top of the
吸着の直前まで上下方向のクリアランスは小さい
LED and the top cover tape) is small between thetape removal position and the pick-up position

Figure 13. Removing the top cover tape just before pick-up

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Application Note
Example: The top cover tape removal position of the Yamaha YS mounter is shown for reference inFigure 14.

Light Emitting Diode

Tape removal
position justbefore pick-up

Typical taperemoval position

Yamaha YS Mounter (Reference)

Figure 14. Top cover tape removal position

Cautions/Suggestions: Tape feeders with a shutter
There are tape feeders that are designed so that the tape is peeled at the typical tape removal position
and the shutter is provided to prevent the LED from being ejected from the pocket in the pick-up
position. Depending on the tape feeder, it is impossible to remove the shutter and change the taperemoval position to be adjacent to the pick-up position.

5. Other Cautions/Suggestions
Splicing (tape joint) work is not recommended.
The work of cutting and connecting the tape of the front reel and the new reel is called splicing (tapejoint). This is done during assembly using an automated pick-and-place machine when replacing thereels without shutting down the pick-and place machine and removing the tape feeder from themachine in order to improve the machine utilization by eliminating the machine downtime due tocomponent shortage.
If two pieces of embossed carrier tape are joined to make one long piece by splicing, it may cause
them to be deformed or distorted leading to LED flipping/tilting and/or misalignment and resulting
in a placement failure. Therefore, Nichia does not recommend splicing.

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Application Note
6. Summary
To pick up lensed LEDs without damage and reduce the mis-pick rate, it is very important to ensurethat the pick-up method of the LED, the design and suction force of the nozzle, the feed speed of thetape feeder, the tape removal angle, and the tape removal position are appropriate.

Light Emitting DiodeIn this application note, examples of how to handle placement issues for lensed LEDs are mentioned;
however, the handling methods described here may not be the best for all situations, and the handling
method will vary depending on the chosen application and the pick-and-place equipment used.
Nichia hopes to collect data on LED placement technology from multiples sources, including
customer feedback, to provide useful information. Contact Nichia if something that is not describedin this application note that is noticed while picking and placing the LEDs with automated systems.

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Application Note
Disclaimer
This application note is a controlled document of Nichia Corporation (Nichia) published to provide
technical information/data for reference purposes only. By using this application note, the user agrees
to the following:・ This application note has been prepared solely for reference on the subject matters incorporated
within it and Nichia makes no guarantee that customers will see the same results for their chosen
application.

Light Emitting Diode・ The information/data contained herein are only typical examples of performances and/or
applications for the product. Nichia does not provide any guarantees or grant any license underor immunity from any intellectual property rights or other rights held by Nichia or third parties.
・ Nichia makes no representation or warranty, express or implied, as to the accuracy, completenessor usefulness of any information contained herein. In addition, Nichia shall not be liable for any
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