Application Note

Light Emitting Diode

Assembly and Handling Precautions for
the Nichia NLSW03A04A LED Modules

Table of Contents
1. Overview ........................................................................ 2
2. Applicable Part Numbers ............................................... 2
3. Storage ............................................................................ 2
4. Directions for Use .......................................................... 3
5. Handling Precautions ..................................................... 4
6. Assembly Precautions .................................................... 6
7. Cautions for Volatile Organic Compounds andCorrosive Gases ............................................................ 12
8. Thermal Design ............................................................ 13
9. Electrostatic Discharge (ESD)...................................... 16
10. Eye Safety .................................................................... 17
11. Summary....................................................................... 17

The Nichia part numbers NLSW03A04A and NV3W470A within this document are merely Nichia’spart numbers for those Nichia products and are not related nor bear resemblance to any othercompany’s product that might bear a trademark.

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Application Note
1. Overview
This LED module (i.e. P/N: NLSW03A04A) is intended for use in digital micromirror device(DMD) systems1. This LED module contains a discrete NV3W470A LED component; the emission
area is optimal in size and shape for DMDs allowing for simple optical designs.
This application note provides the assembly and handling precautions for this LED module.

2. Applicable Part Numbers
This application note applies to the LED module shown in Table 1.

Light Emitting Diode

Table 1. Applicable LED Module
NLSW03A04A

Part Number

NV3W470A LED component
Bonding ribbon

Appearance(Structure)

Copper-core PCB
Connector
Thermistor

Size (mm)36×22×(5.32)
Note: The value in parentheses is for reference purposes only.

3. Storage
3.1 Storage Conditions
Table 2 provides the required storage conditions before opening the moisture-proof bag.
Table 2. Storage Conditions

1

Conditions

Temperature

HumidityTime

Before Opening the Moisture-proof Bag≤30ºC≤90%RHWithin 1 Year from Delivery Date

A DMD is a display device comprised of several hundred thousand to several millions of rotating microscopic
mirrors (i.e. micromirrors) that are arranged in a rectangular array on an integrated circuit substrate. Eachmicromirror, whose size is approximately 10μm or more per side, corresponds a pixel of the display device. They
rotate individually to switch the state to on/off. In a DMD system, a DMD receives the light emitted from a lightsource and then on-state micromirrors reflect the light. The light is projected through a lens to display images.
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Application Note
This LED module has metal parts (e.g. electrodes, plating, silver bonding material, bonding ribbons,solder joints, etc.). If those metal parts are exposed to a corrosive environment, it may cause themto tarnish causing issues. Once the moisture-proof bag is opened, the remaining unused LED
modules must be stored in a hermetically sealed container. Nichia recommends placing them backto the original moisture-proof bag and reseal it.
3.2 Storage Environment

Light Emitting DiodeTo avoid condensation, the LED modules must not be stored in areas where temperature andhumidity fluctuate greatly. Also, ensure that the LED modules are not exposed to direct sunlightand/or an environment over a long period of time where the temperature is higher than normal room
temperature and are not stored in a dusty environment.

4. Directions for Use
4.1 Absolute Maximum Ratings
Absolute maximum ratings of the LED module are the maximum values that must not be exceeded
even for a short period of time. It must be ensured that the absolute maximum ratings are taken into
consideration when designing a system/application using the LED module and will not be exceededin the conditions/environments in which the LED module will actually be used even for a shortperiod of time.
Table 3. Absolute Maximum Ratings for the NLSW03A04A LED Module
Item

Absolute Maximum Rating

Forward Current (IF)

5500 mA

Surge Forward Current (IFS)

7000 mA

Allowable Reverse Current (IR)85 mA

Power Dissipation (PD)71 W

Operating Temperature (Topr)-40～125 ℃

Storage Temperature (Tstg)-40～125 ℃

Junction Temperature (TJ)

150 ℃

• Characteristics at TJ = 25ºC
• IFS conditions with pulse with ≤0.01ms and duty cycle ≤0.5%.

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Application Note
4.2 Operating Current
The LED component used within this LED module is designed to be operated at a forward current.
The sorting current for this LED module is 5000mA; to stabilize the LED module characteristics
while in use, Nichia recommends that the LED modules are operated at currents ≥10% of the sorting
current.

Light Emitting Diode

4.3 Other Directions
Ensure that no voltage is applied to the LED module in the forward/reverse direction while the LED
module is off. If the LED modules are used in an environment where reverse voltages are applied to
the LED modules continuously, it may cause electrochemical migration to occur causing the LED
modules to be damaged. When not in use for a long period of time, the system’s power should beturned off to ensure that there are no issues/damage.
If the LED modules are used for outdoor applications, ensure that necessary measures are taken (e.g.
protecting the LED modules from water/salt damage and high humidity).

5. Handling Precautions
When handling the LED module, wear ESD gloves or use tweezers, etc. Do not handle the LED
module with bare hands:- this may contaminate the surface and have an effect on the optical characteristics,- this may cause static electricity to build up leading to a malfunction (e.g. causing the LED
module not to illuminate).
Do not touch the prohibited area shown in Figure 1 (i.e. the LED component, other components, andthe black resin). This may cause the LED module malfunction (e.g. the LED module not toilluminate).

Prohibited area

Figure 1. Prohibited Area
Grab/hold the LED module by the sides of the connector.
Do not apply an external force of ≥10.45N to the connector. This may cause the LED module to bedamaged.
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Application Note

Incorrect

Correct

Light Emitting Diode

Recommended handling

Handling with bare hands

Incorrect

Touching the prohibited area

Figure 2. Correct/Incorrect Examples of Handling the LED Module
Do not drop the LED module; this may cause issues (e.g. causing the LED component to be damaged[e.g. scratch, chip, and/or delamination], the bonding ribbon to deform, and/or the electric
connection to fail, etc.) resulting in adverse effect on the optical characteristics, a catastrophic failure(i.e. the LED module not to illuminate), etc.
Do not stack the LED modules; this may cause issues (e.g. causing the LED component to bedamaged [e.g. scratch, chip, and/or delamination], the bonding ribbon to deform, and/or the electric
connection to fail, etc.) resulting in adverse effect on the optical characteristics, a catastrophic failure(i.e. the LED module not to illuminate), etc.

Incorrect

Figure 3. Do not drop the LED module

Incorrect

Figure 4. Do not stack the LED modules

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Application Note
6. Assembly Precautions
6.1 How to Attach the LED module to a Heatsink/Housing
6.1.1 Positioning

If the base of the boss is corner rounded with an R edge, ensure that the R edge does not prevent theboss and the guide hole from properly fitting causing the PCB to tilt and/or a gap to be made between
the PCB and heatsink/housing; see Figure 6.
Round
hole

Incorrect

Elongated
hole

Boss

PCB

Gap
Heatsink/Housing

Figure 6. Example of an Incorrect Attachment due tothe Edge of the Base of the Boss

Figure 5. Guide Holes(3)
1.5±0.2
Φ2 +0.06
022±0.316.25±0.1
8±0.2
2.5±0.2(Unit: mm)(2.75)
Cavity (□9.3)(R1)

Guide hole
center point

(9)

+0.06

3.14±0.3
2.88±0.1

Size of the emission area

B

36±0.39±0.2
7±0.2

3.5±0.05×1.4±0.05

A

2 0// 0.06 A

6-R1.5―〇 Φ0.1 A B―

Light Emitting Diode

This LED module has two guide holes for positioning (i.e. a round hole and an elongated hole) on
the sides of the emission area; see Figure 5. Ensure that the contact surface of the heatsink/housing(i.e. the plane that the LED module is attached to) has bosses of proper size in the proper places; see
Figure 7 for the outline dimensions for the LED module. Nichia recommends that the tips of thebosses are chamfered (i.e. C edge) or corner rounded (i.e. R edge) to facilitate the attachment of the
LED module to the heatsink/housing.

Centerline of the emission
area (Target value)

Center of the emission
area (Target value)

19±0.24-R1(1.84)(5.32)

Figure 7. Outline Dimensions for the LED moduleThis document contains tentative information, Nichia may change the contents without notice.
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Application Note
Figure 8 shows a reference image of an appropriate attachment of the bosses on the heatsink/housing
to the guide holes of the LED module.
(Unit: mm)

16.25±0.1

Guide hole
center point

Φ2 +0.060

2.5±0.2

2 +0.06
0
Guide hole
PCB

Heatsink/Housing

Figure 8. Reference Image of Properly Designed Bosses
6.1.2 Precautions for Attaching the LED module to a Heatsink/Housing
Attach the LED module to a heatsink/housing with two screws inserted in the places indicated in
Figure 9. Ensure that appropriate screws (e.g. specifications, shape, and size) are selected taking
into consideration the material for the contact surface, thickness of the heatsink/housing, etc.; refer
to Table 4 and the outline dimensions provided in this application note. Select screws with a flatbearing surface (e.g. screws with a pan head, truss head, binding head, etc.); do not select screws
with a tapered bearing surface (e.g. screws with a flat head, oval head, etc.).
Screw holes

Table 4. How to Attach the LED module
to a Heatsink/Housing

16.25±0.1
8±0.2
3±0.2

1.5±0.2

7±0.2Light Emitting Diode

Boss

Screw

19±0.222±0.3Figure 9. Where to Insert the Screws(2-R3.75)

Attachment
methodRecommended
thermal interface
material
Recommended
size for thescrew thread
Reference sizefor the screw
head

Two screws
Thermal grease(see 6.3)
M2.6
Φ4.5～6.5mm

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Application Note
When securing the LED module to a heatsink/housing, Nichia recommends that both of the screws
are partially tightened, then fully tightened. Use an appropriate torque as per the recommended
conditions for the screws being used. If an excessive torque is used, it may cause the LED module
to deform, etc. leading to a malfunction (e.g. causing the LED module not to illuminate). Do not
perform this securing process more than once.
Do not touch the LED component and other components when attaching the LED module to aheatsink/housing with screws.
6.2 Considerations for the Contact Surface and Thermal Interface Materials (TIMs)

Light Emitting DiodeThe surface of the heatsink/housing to attach the LED module should be smooth and even (i.e. nohole/recess, burr/flash, etc.); ensure that the surface is leveled by machining and cleaned to remove
any liquid, grease, contamination, etc. just before attaching the LED module to the heatsink/housing.
To increase the heat dissipation performance, use a thermal interface material (TIM) (i.e. a heat
conductive material such as thermal grease, thermal sheets, etc.) between the LED module andheatsink/housing. Nichia recommends using thermal grease for better heat dissipation; Nichia does
not recommend using a thermal sheet since it may cause the thermal resistance of the LED module
to be significantly greater.
If the heatsink/housing has holes/recesses, screw holes, foreign materials, burrs/flashes, etc. on thecontact surface with the LED module, it may cause the heat from the LED module not to sufficiently
transfer to the heatsink/housing. Figure 10 shows correct/incorrect examples of attaching the LED
module to a heatsink/housing.

Correct

LED component

Connector
PCB

Thermal grease

Heatsink

Heatsink with an even contact surface and proper amount of thermal grease

Incorrect

Insufficient thermal grease

Incorrect

Heatsink with insufficient flatness
for the contact surface

Incorrect

Incorrect

Excessively thick TIM

Heatsink with an unevencontact surface

Incorrect

Incorrect

Heatsink with a hole/recesson the contact surface

Heatsink with a curved
contact surface

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Application Note
Incorrect

Incorrect

Incorrect

Foreignmaterial
Heatsink with a screw holeon the contact surface

Burr/flash

Heatsink with a foreign materialon the contact surface causing
the LED module to tilt

Heatsink with a burr/flash on
the contact surface causing
the LED module to tilt

Figure 10. Correct/Incorrect Examples of Attaching the LED module to a Heatsink

Light Emitting Diode6.3 Thermal Grease
When selecting thermal grease, consider its characteristics (i.e. thermal conductivity, operating
temperature range, etc.) and the components it is made of to ensure that the chosen thermal greaseis suitable for the chosen application. Nichia recommends the thermal grease manufactured by ShinEtsu Chemical Co., Ltd. with the part number G-779 (thermal conductivity: 3.0W/m・K).
Ensure that thermal grease is applied to the proper area evenly and in an adequate amount (see Figure11). The heat dissipation performance will be worse if the amount of thermal grease is insufficient.
The heat dissipation performance will become significantly worse especially if no thermal grease isapplied to the area on the back of the LED module where the LED component is located. Perform asufficient verification with the chosen application to ensure that there are no issues with how thethermal grease is applied to the LED module.
If thermal grease has been applied incorrectly, the amount of change in the resistance value of thethermistor may become greater than it should be compared to the amount of the change in the input
current; ensure that the relationship between the input current and thermistor’s resistance is as
designed.
If the chosen design uses multiple LED modules on a heatsink/housing, ensure that there is no
significant difference in temperature between the LED modules.

Incorrect

Correct

Where the LED component is.
Thermal grease
is applied.

Where the thermistor is.
Thermal grease used:
P/N: G-779, manufactured by
Shin-Etsu Chemical Co., Ltd.

Correct example(i.e. applied evenly and in an adequate amount)

Incorrect example(i.e. insufficient amount)

Figure 11. Correct/Incorrect Example of Applying Thermal Grease
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Application Note
6.4 How to Attach the Connectors
This LED module has a connector (manufactured by TE Connectivity [i.e. ERNI Electronics], partnumber: 474811) mounted on the PCB.
Connector (Plug)

Table 5. Part Numbers and Appearance for the Connectors
Connectors manufactured by TE Connectivity (i.e. ERNI Electronics)
Type

Plug

Receptacle

P/N

474811

484083

Light Emitting Diode

Appearance

Figure 12. Connector of the
LED module
During and after attaching a connector (i.e. receptacle) to the connector on the LED module (i.e. theplug), ensure that excessive external force is not applied to the plug; it may cause the plug to bedamaged and/or removed from the PCB.
Protection
deviceC TH

R C①②③④⑤⑥⑦⑧
CN

C: Chip capacitor, TH: Thermistor

① ② ③

TH

R

C

C

④
CN

⑤ ⑥ ⑦ ⑧

R: Chip resistor, CN: Connector

Figure 13. Pin Identification Numbers and Drive Circuit
When attaching the connectors (i.e. inserting a receptacle into the plug), keep the LED module stable(e.g. this attachment process is carried out on a table); hold the receptacle close to the insertion area
(i.e. do not hold it by the cable at a distance away from the insertion area) and insert the receptacle
straight and horizontally into the plug.

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Application Note

Incorrect

Correct

Light Emitting Diode

The LED module is stable on a table.
The receptacle is held at the insertion
area and inserted into the plug
horizontally.

Incorrect

The hands/LED module are notstable.

The receptacle is held by the cable
at a distance away from theinsertion area.

Figure 14. Correct/Incorrect Examples of Attaching the Connectors
After inserting a receptacle into the plug, check that the connectors are properly attached by ensuringthat the stopper of the receptacle can be seen through the window on the top surface of the plug andthat there is no gap between the connectors at the attached area.

Incorrect

Correct

No gapAble to completely see thestopper.

Incorrect

Gap

Gap

Cannot see the stopper at all.

Only able to partially see thestopper.

Figure 15. Correct/Incorrect Examples of How the Connectors are Attached6.5 Securing the Cable of the Receptacle
After attaching the connectors, ensure that external force is not applied to the connectors; Nichia
recommends securing the cable of the receptacle to the heatsink/housing. If excessive external force
is applied to the connectors, the plug may be damaged and/or removed from the PCB.

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Application Note

Incorrect

Correct
Connector

The cable is secured.

The cable is not secured.

Heatsink/Housing

Heatsink/Housing

Force will not be applied to the connectors
when the cable is pulled.

Force will be applied to the connectors
when the cable is pulled.

Light Emitting Diode

Figure 16. Correct/Incorrect Example of Managing the Cable after Attaching the Connectors
6.6 Detaching the connectors
Once the connectors are attached, they are secured to each other with a snap-fit. If the connectors
are detached without disengaging the snap-fit correctly, it may damage the connectors; use a
specially designed tool2 to disengage the snap-fit and ensure that the connectors are not damaged.

7. Cautions for Volatile Organic Compounds and Corrosive Gases
7.1 Volatile Organic Compounds (VOCs)
Materials present around the LED modules (e.g. housing, gasket/seal, adhesive, secondary lens, lenscover, grease, etc.) may contain volatile organic compounds (VOCs); the VOCs that have beenreleased from them may penetrate the encapsulating resin of the LED module. If the LED modules
are being used in a hermetically/near-hermetically sealed environment, VOCs can discolor after
being exposed to heat and/or photon energy and it may greatly reduce the LED module light output
and/or cause a color shift. Perform a light-up test of the chosen application for optical evaluation toensure that there are no issues before use.
Ventilating the environment may improve the reduction in light output and/or color shift that may
occur due to VOCs.

2

For detailed information regarding the tool to detach the connectors, consult the manufacturer of the connectors(i.e. TE Connectivity).

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Application Note
7.2 Corrosive Gases

Light Emitting DiodeTo prevent substances/gases from affecting the plated surfaces, adhesive, etc. of the LED modules,
ensure that the parts/materials used with the LED modules (e.g. gasket/seal, adhesive, etc.) in thesame assembly/system do not release corrosive gases (i.e. the parts/materials do not contain sulfur,
halogens, etc.). If the plated surfaces, adhesive, etc. becomes corroded, it may cause issues (e.g.
electrical connection failures).
If a gasket/seal is used, silicone rubber gaskets/seals are recommended; ensure that this use ofsilicone does not result in issues (e.g. electrical connection failures) caused by low molecular weightvolatile siloxane.

8. Thermal Design
8.1 Thermal Design Considerations
When using the LED modules, ensure that proper thermal management is provided to efficiently
dissipate the heat from the chip of the LED component; the Absolute Maximum Rating Junction
Temperature (TJ) must not be exceeded. The increase in the temperature of the chip while inoperation may vary depending on the material of the heatsink being used, with/without a coolingfan, the type of thermal grease being used, how the thermal grease is applied, etc. Ensure that whenusing the LED modules for the chosen application, heat is not concentrated in an area and theAbsolute Maximum Rating TJ is not exceeded under any circumstances. The operating current
should be determined by considering the temperature conditions surrounding the LED module (TA).
Ensure that when operating the LED modules, proper measures are taken to dissipate the heat.
8.2 How to Estimate the Junction Temperature (TJ)
The following equations can be used to calculate the LED component temperature (TJ) once thesaturation temperature at the junction has been reached.
TJ = TTH + RθJTH × W
TJ:
LED Component Junction Temperature (ºC)
TTH: Thermistor Temperature (ºC)
RθJTH: Thermal Resistance from Junction to TTH Measurement Point (i.e. thermistor) (ºC/W)
Note: The RθJTH will vary depending on the LED module operating current (see Table 6).
W:
Input Power when the saturation temperature at the junction has been reached (IF×VF) (W)IF = Forward Current (A), VF = Forward Voltage (V)This document contains tentative information, Nichia may change the contents without notice.
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Application Note

Light Emitting Diode

Table 6. LED Module Operating Current
and Thermal Resistance
LED Module Operating Current,
IF (A)

Thermal Resistance,
RθJTH (ºC/W)

5.0

1.64

4.5

1.68

4.0

1.71

3.5

1.74

3.0

1.77

2.5

1.78

Thermistor

Figure 17. Thermistor
8.3 How to Determine the Thermistor Temperature (TTH)
In this section, Nichia describes the procedures for obtaining the thermistor temperature (TTH) byapplying a very low pulse current to the thermistor and measuring the voltage drop across thethermistor to convert it to the resistance of the thermistor (RTH).
1. Apply a very low pulse current to the thermistor.
If the current is too large, the self-heating of the thermistor may become large causing thethermistor not to detect the ambient temperature properly; the recommended current is 0.1mA.
2. Measure the voltage drop across the thermistor and calculate the RTH (Ω) using Ohm’s law.
Ohm’s law: RTH (Ω) = V (V)/I (A)3. Using Table 8 in section 8.4, choose the TTH (ºC) for the calculated RTH (Ω) value.
8.4 Thermistor Used within the LED Module
The thermistor used within this LED module is an NTC thermistor manufactured by Panasonic
Corporation (P/N: ERTJ1VG103FM).

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Application Note
Table 7. Thermistor Used within the LED Module
Manufacturer

Part Number

Resistance (at 25ºC)

B Constant3

Panasonic Corporation

ERTJ1VG103FM

10KΩ ± 1%

3435K ± 1%

TTH (℃)
0

RTH (Ω)28704

TTH (℃)28

RTH (Ω)8916

TTH (℃)
56

RTH (Ω)3379

TTH (℃)
71

RTH (Ω)2144

TTH (℃)
86

RTH (Ω)
1413

1

27417

29

8585

57

3274

72

2083

87

1376

2
3

26197
25039

30
31

8269
7967

58
59

3172
3075

73
74

2024
1967

88
89

1340
1305

4

23940

32

7678

60

2981

75

1912

90

1272

5

22897

33

7400

61

2890

76

1858

91

1239

6

21906

34

7135

62

2803

77

1807

92

1208

7

20964

35

6881

63

2719

78

1757

93

1177

8
9

20070
19219

36
37

6637
6403

64
65

2638
2559

79
80

1709
1662

94
95

1147
1118

10

18410

38

6179

66

2484

81

1617

96

1091

11

17641

39

5965

67

2411

82

1574

97

1063

12

16909

40

5759

68

2341

83

1532

98

1037

13

16212

41

5561

69

2273

84

1491

99

1012

14

15548

42

5372

70

2207

85

1451

100

987

15

14916

43

5189

16

14313

44

5015

17

13739

45

4847

18
19

13192
12669

46
47

4686
4531

20

12171

48

4382

21

11696

49

4239

22

11242

50

4101

23

10809

51

3969

24

10395

52

3842

25
26

10000
9622

53
54

3719
3601

27

9261

55

3488

25

50
TTH (℃)

75

20000
18000
16000

14000
12000

RTH (Ω)Light Emitting Diode

Table 8. Thermistor’s Resistance vs. Temperature Characteristics

10000
8000

6000
4000
2000
0
0

100

Figure 18. Thermistor’s Resistance vs. Temperature

3

A physical property that shows the degree of the thermistor’s sensitivity to temperature changes.

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Application Note
9. Electrostatic Discharge (ESD)
9.1 Measures against ESD

Light Emitting Diode

The LED component used within this LED module is sensitive to transient excessive voltages (e.g.
ESD, lightning surge). If this excessive voltage occurs in the circuit, it may cause the LED module
to be damaged causing issues (e.g. the LED module to become dimmer or not to illuminate [i.e.
catastrophic failure]). Ensure that when handling the LED modules, necessary measures are taken
to protect them from an ESD discharge. The following examples are recommended measures toeliminate the charge:- Grounded wrist strap, ESD footwear, clothes, and floors- Grounded workstation equipment and tools- ESD table/shelf mat made of conductive materials
Ensure that all necessary measures are taken to prevent the LED modules from being exposed totransient excessive voltages (e.g. ESD, lightning surge):- tools, jigs, and machines that are used are properly grounded- appropriate ESD materials/equipment are used in the work area
- the system/assembly is designed to provide ESD protection for the LED modules
9.2 Measures for when the Tool/Equipment Used is an Insulator
If the tool/equipment used is an insulator (e.g. glass cover, plastic, etc.), ensure that necessary
measures have been taken to protect the LED modules from transient excessive voltages (e.g. ESD).
The following examples are recommended measures to eliminate the charge:- Dissipating static charge with conductive materials- Preventing charge generation with moisture- Neutralizing the charge with ionizers
9.3 How to Detect LED Modules that have been Damaged by ESD
To detect if an LED module was damaged by transient excess voltages (i.e. an ESD event during thesystem’s assembly process), perform a characteristics inspection (e.g. forward voltage measurement,
light-up test) at low current (≤1mA). If the LED module is damaged by transient excess voltages(e.g. ESD), it will cause:- the Forward Voltage (VF) to decrease- the LED module not to illuminate at a low current
Table 9 shows the failure criteria for this LED module.
Table 9. Failure Criteria
IF

Failure criteria for VF

0.5mA< 6.0VThis document contains tentative information, Nichia may change the contents without notice.
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Application Note
10. Eye Safety

Light Emitting DiodeIn 2006, the International Electrical Commission (IEC) published IEC 62471:2006 Photobiologicalsafety of lamps and lamp systems, which added LEDs in its scope. On the other hand, the IEC
60825-1:2007 laser safety standard removed LEDs from its scope. However, be advised that somecountries and regions have adopted standards based on the IEC laser safety standard IEC 608251:20112001, which still includes LEDs in its scope. Most of Nichia's LEDs can be classified as
belonging into either the Exempt Group or Risk Group 1. High-power LEDs, that emit light
containing blue wavelengths, may be classified as Risk Group 2. Proceed with caution when viewing
directly any LEDs driven at high current or viewing LEDs with optical instruments which may
greatly increase the damage to human eyes.
Viewing a flashing light may cause eye discomfort. When incorporating the LED module into
chosen application, be careful to avoid adverse effects on the human body caused by lightstimulation.

11. Summary
This LED module needs to be handled and assembled in a proper manner to obtain the required
characteristics and the reliability. Follow the cautions/suggestions detailed in this application noteto ensure that the LED module is used properly.
In addition, perform sufficient verification with the conditions/environments in which the chosen
application containing the LED module will actually be used to ensure that the characteristics and/or
the reliability for the LED module are not adversely affected before selecting other components to
be used with the LED module.

This document contains tentative information, Nichia may change the contents without notice.
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Application Note
Disclaimer
This application note is a controlled document of Nichia Corporation (Nichia) published to provide
technical information/data for reference purposes only. By using this application note, the user
agrees to the following:・ This application note has been prepared solely for reference on the subject matters incorporated
within it and Nichia makes no guarantee that customers will see the same results for their chosen
application.

Light Emitting Diode・ The information/data contained herein are only typical examples of performances and/or
applications for the product. Nichia does not provide any guarantees or grant any license underor immunity from any intellectual property rights or other rights held by Nichia or third parties.
・ Nichia makes no representation or warranty, express or implied, as to the accuracy, completenessor usefulness of any information contained herein. In addition, Nichia shall not be liable for any
damages or losses arising out of exploiting, using, or downloading or otherwise this document,or any other acts associated with this document.
・ The content of this application note may be changed without any prior or subsequent notice.
・ Copyrights and all other rights regarding the content of this document are reserved by Nichia or
the right holders who have permitted Nichia to use the content. Without prior written consent of
Nichia, republication, reproduction, and/or redistribution of the content of this document in any
form or by any means, whether in whole or in part, including modifications or derivative works
hereof, is strictly prohibited.

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NICHIA CORPORATION
http://www.nichia.co.jp

This document contains tentative information, Nichia may change the contents without notice.
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