Application Note

Assembly Precautions
for the Nichia 144 Series LEDs
Table of contents
1. LED Outline Dimensions/Tape Dimensions ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 2

2. Handling Precautions

・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 3

3. Design Recommendations for Optimal Amount of Solder・ ・ ・ ・ 4

4. Precautions for Setting Up a Pick-and-Place Machine/Nozzle
5. Precautions When Reflow Soldering・ ・ 5-8・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 8

6. Evaluation of the Effect of Solder Volume ・ ・ ・ ・ ・ ・ ・ ・ ・ 9-10
7. Evaluation of Self-Alignment Performance・ ・ ・ ・ ・ ・ ・ ・ 10-11

The part number NV4L144AR,NV4W144AR,NV4L144AM,NV4W144AM in this document are the part number of our
products, and do not have any relevance or similarity to other companies' products that may have trademark rights.
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 144 Series LEDs

1. LED Outline Dimensions/Tape Dimensions
Table 1. Product Specifications

Part Number

NV4L144AR, NV4W144AR, NV4L144AM, NV4W144AM
4.65

Cathode Mark

5

4.65

0.5

LED

CathodeCathode Mark

1

Anode

3.15

4.6
5

(0.02 クロスバー凹部)(0.02 Crossbar Recess)

Reel Size: 1,500 LEDs

(7)
(5.86)

5.35±0.1

Embossed
CarrierTapeΦ1.5 +0.2-0(7)Cathode Mark0.35±0.05(5.86)

2±0.1 4±0.1

7.5 ±0.1

12 ±0.1

16 +0.3-0.1

Φ1.5 +0.1-01.75±0.1[unit: mm, Tolerance: ±0.2mm]

3.5 ±0.1

5.35±0.1[unit: mm]
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Assembly Precautions for the Nichia 144 Series LEDs

2. Handling Precautions

Incorrect

Handling with bare hands
Do not handle the LEDs with bare hands:- this may contaminate the LED surface and have an effect on the optical characteristics,- this may cause the LED to deform and/or the wire to break causing a catastrophic failure (i.e. the LED
not to illuminate),- the lead frame may cause injuries when the LED is handled with bare hands.
Handling with tweezers
Ensure that when handling the LEDs with tweezers, excessive force is not applied to the LED. Otherwise, it
may cause damage to the resin (e.g. cut, scratch, chip, crack, delamination and deformation) and theinternal connection to fail causing a catastrophic failure (i.e. the LED not to illuminate).
ESD Precautions
LEDs are sensitive to transient excessive voltages (e.g. ESD, lightning surge). If this excessive voltage
occurs in the circuit, it may cause the LED to be damaged causing issues (e.g. the LED to have a reductionin the radiant flux or not to illuminate [i.e. catastrophic failure]). When handling the LEDs, ensure thatnecessary measures have been taken to protect them from transient excess voltages. Refer to theapplicable specification for more details.

Caution: Do not grab/hold the LEDs
with tweezers around theencapsulating resin.

Figure 1. Example of an Improper
Holding Position

Incorrect
Caution: Do not stack assembled
PCBs on top of each other.

Stacking assembled PCBs together
Do not stack assembled PCBs together. Otherwise, it may cause damage to the resin (e.g. cut, scratch,chip, crack, delamination and deformation) and the internal connection to fail causing a catastrophic
failure (i.e. the LED not to illuminate).
Storage
The storage/packaging requirements for the Nichia 144 Series LEDs are comparable to JEDEC MoistureSensitivity Level (MSL) 3 or equivalent. Nichia used IPC/JEDEC STD-020 as a reference to rate the MSL ofthis LED. If the “After Opening” storage time has been exceeded or any pink silica gel beads are found,ensure that the LED are baked before use. Baking should only be done once.

Figure 2. Example of Improper
Stacking

Table 2. Storage/Baking Conditions
Storage

Conditions
Before Opening Aluminum Bag

Temperature≤ 30°C

Humidity≤ 90% RH

Time
Within 1 Year from Delivery Date

After Opening Aluminum Bag≤ 30°C≤ 70% RH

≤ 168 hours-≥24 hours

Baking65±5°CThis document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 144 Series LEDs

3. Design Recommendations for Optimal Amount of Solder
Soldering Pad Pattern/Metal Solder Stencil Aperture

Table 3. Recommended Soldering Pad Pattern/Metal Solder Stencil Aperture

Soldering Pad Pattern

Stencil Aperture[unit：mm][unit：mm]⋯ LED outline■ Soldering Pad Pattern■ Stencil Aperture

Table 4. Recommended Solder/Metal Solder Stencil Conditions

Item

Recommended
Condition

Solder Stencil Thickness

120 [μm]

Solder Paste

Sn-3.0Ag-0.5Cu

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Assembly Precautions for the Nichia 144 Series LEDs

4. Precautions for Setting Up a Pick-and-Place Machine/Nozzle
Table 5. Cautions/Suggestions for setting up equipment

Item

Recommended Conditions/Specifications

Cautions/Suggestions

Pick-and-place machine1

Modular mounter

Pick-and-place nozzle

Specially designed nozzle(see Figure 3)

See “Pick-and-Place Nozzle” on
Page 6 for the details.

Tape-and-reel feeder

Electrical (motorized) feeder
Tape width: 16mm
Feed length: 12mm

See “Tape-and-Reel Feeder” onPage 6 for the details.

Nozzle height for pick-up
operations

The contact surface of the nozzle head for pick
operations should be adjusted to 1.7mm below the edgeof the embossed carrier tape pocket.

See “Recommended Nozzle Heightfor Pick-up Operations” on Page 7
for the details.

Nozzle height for placement
operations (i.e. placement depth)

0.2mm for placement depth

See “Recommended Nozzle Heightfor Placement Operations(Placement Depth)” on Page 7 forthe details.

Imaging-based Automatic
Inspection

Using the electrode as a reference is recommended tolocate the center of the LED.

See "Imaging-based Automatic
Inspection" on Page 8 for thedetails.

Note:
1 The recommended conditions/specifications above have been determined under the following verification conditions:
Pick-and-place machine (modular mounter):- YS100 High-Speed General-Purpose Modular (manufactured by Yamaha Motor Co., Ltd.)This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 144 Series LEDs
4-1. Pick-and-Place Nozzle• The nozzle must not have any direct contact withthe encapsulating resin.
1.0mm

Figure 3. Recommended Nozzle
Dimensions[Unit: mm]• The nozzle touches on the top of LED substrate.
(see Fig. 4)
Therefore input value of the Part Height shouldbe 1.0mm.

Figure 4. part Height

4-2. Tape-and-Reel Feeder
Tape Removal Position• Tape width:16mm / Feed length:12mm

Correct• The chosen tape feeder should be one that has aslower feeding speed (e.g. electrical feeders).

Slower feeding speed = Less vibration
LED position stays stable.

• The recommended tape removal position is rightnext to where the pick-and-place nozzle picks up
the LEDs to prevent the LEDs from tilting within thetape pocket and becoming damaged by the feeder
shutter and/or nozzle.

Incorrect
Faster feeding speed = More vibration
LED tilts within the tape pocket.

Figure 5. Examples of Correct/Incorrect Top Cover Tape Removal Positions

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Assembly Precautions for the Nichia 144 Series LEDs
4-3. Recommended Nozzle Height for
Pick-up Operations• Pick-and-place nozzle should be 1.7mm inside from the top ofcarrier tape to pick up the LED. (see Fig. 6)

Pick-and-Place
Nozzle• Some LED mounters may not be stabilize the operation. In
that case, adjusting the height for LED pickup is needed until
the operation is stabilized.
☞ If the pickup point is higher than the recommended
point, the LED may tilt, and poor suction may occur
which will cause a suction error.(e.g. diagonal
positioning within the nozzle)

Pickup Point
1.7mm fromthe top of thecarrier tape

☞ If the pickup point is lower than the recommended
point, poor suction may occur due to carrier tapedeformation.

Carrier Tape

Figure 6. Recommended Nozzle Height for Pick-up Operations

4-4. Recommended Nozzle Height for Placement
Operations (Placement Depth)• After the LED is mounted onto solder paste on the PCB,
the nozzle should further press the LED 0.2mm into the
PCB.

Pick-and-Place
Nozzle☞ If the press force is too weak, assembly failure may
occur since the LED may float on top of the PCB or it
may not separate from the nozzle.

Press
0.2[mm]☞ If press force is too strong, LED may receive
excessive stress which may cause the LED to bedamaged.

PCB

Figure 7. Recommended Nozzle Height for Placement (Placement Depth)
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Assembly Precautions for the Nichia 144 Series LEDs
4-5. Imaging-based Automatic Inspection• Using image recognition and adjusting the pickup
position for each LED should be implemented tomaintain assembly accuracy. It is recommended tohave the adjustment based on the position of theelectrical pads for higher assembly accuracy.
Figure 8. Electrical Pads
(Recommended)

Figure 9. Outline

5. Precautions When Reflow
Soldering
1 to 5°C per sec
Pre-heat
180 to 200°C

260°CMax
10sec Max

60sec Max
Above 220°C
120sec Max

Figure 10. Recommended Reflow Soldering
Condition (Lead-free Solder)• Reflow soldering must not be performed more than twice.
• Using the recommended reflow soldering conditions (See Figure 10 tothe left) as a reference, modify if necessary, the recommended reflow
conditions specified by the manufacturer of the solder paste being used.
Note:
To ensure that these reflow conditions have no negative effect on theLEDs, perform sufficient verification prior to use.
• When cooling the LEDs from the peak temperature a gradual coolingslope is recommended; do not cool the LEDs rapidly.
• During reflow soldering, the heat and atmosphere in the reflow oven may
cause the optical characteristics to degrade. In particular, reflow soldering
performed with an air atmosphere may have a greater negative effect on
the optical characteristics than if a nitrogen atmosphere is used; Nichia
recommends using a nitrogen reflow atmosphere.
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Assembly Precautions for the Nichia 144 Series LEDs

6. Evaluation of the Effect of Solder Volume
The amount of solder paste was evaluated and compared with the recommended solder stencil conditions (section3).
Lighting, wettability, solder ball and floating were inspected after the reflow process.
Table 6. Evaluation Result（Lighting Check, Solder Wettability, Solder Ball）

30%

50% (Recommend)

70%

Lighting check

Lighting check

Lighting check

OK

OK

OK

Solder Ball

Solder Ball

Solder Ball

0/24 pcs

0/24 pcs

0/24 pcs

Lighting check

Lighting check

Lighting check

OK

OK

OK

Solder Ball

Solder Ball

Solder Ball

0/24 pcs

0/24 pcs

2/24 pcs

Lighting check

Lighting check

Lighting check

OK

OK

OK

Solder Ball

Solder Ball

Solder Ball

0/24 pcs

2/24 pcs

6/24 pcs

Stencil
Aperture Rate
※Stencil Aperture Area
/Electrode Area

Stencil Thickness

100μm

120μm
(Recommend)

150μm• Solder wettability performance was good enough to light the LED in all conditions. However,solder ball occurrence was increased if solder paste volume (area, thickness) is increased.
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Assembly Precautions for the Nichia 144 Series LEDs

Amount of Floating [μm]

140
120

Aperture Rate:

100

30%

Max.

Aperture Rate:

80

60

Aperture Rate:

40

70%

Figure 12. How to Measure the Amount of LED Tilt

Average20• Amount of tilt (avg.): 60μm
Angle of incline: around 0.7 degree
Solder volume does not affect to the amount oftilt and angle of incline.

0
100μm

120μm

Amount of LED Tilt (mm) = max. – min.

Min.

50%

150μm

Stencil Thickness

Figure 11. Evaluation Result (LED Lifting)※n=24pcs/each condition

7. Evaluation of SelfAlignment Performance
Self-alignment was evaluated under the condition
shown in table 7 with the solder conditions shownin section 6.

Table 7. Evaluate Conditions① x：+0.2mm
y：+0.2mm② θ：+10°Amount of self-alignment was confirmed from
center of the land pattern.

＋ Pad pattern Position＋ Mounted Position
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Assembly Precautions for the Nichia 144 Series LEDs
Stencil Thickness：100μm

0.2Aperture Rate:30%

Aperture Rate:50%

Aperture Rate:50%

0.2

Mount Position

0

Aperture Rate:30%

Mount Position

0

-0.2

-0.2

-0.2
-0.3

-0.3
-0.1

0
0.1
⊿x [mm]0.2

0.3

Mount Position

0
-0.1

-0.2

Aperture Rate:70%

0.1

-0.1

-0.3

Aperture Rate:50%

0.2

-0.1

-0.3

Stencil Thickness：150μm

0.3Aperture Rate:70%

0.1⊿y [mm]⊿y [mm]Aperture Rate:30%
Aperture Rate:70%

0.1

Stencil Thickness：120μm

0.3⊿y [mm]

0.3

-0.3

-0.2

-0.1

0
0.1
⊿x [mm]

0.2

0.3

-0.3

-0.2

-0.1

0
0.1
⊿x [mm]0.2

0.3

Figure 13. Evaluation Result (① x:+0.2mm,y:+0.2mm)※n=24pcs/condition

Mount Angle:10°

2.0Angle[°]

1.6
1.2

Aperture Rate:30%

0.8Aperture Rate:50%
Aperture Rate:70%

0.4

Average

0.0
-0.4
-0.8

100μm

120μm

150μm

Stencil Thickness• Aperture ratio: 50%, stencil thickness: 120μm(Recommended conditions)• No abnormality in the self-alignment• Self-alignment could be acceptable if the mounting
accuracy are x,y <200μm and θ<10o.
• Aperture ratio: 30%, stencil thickness: 100μm• Some LEDs have issue for the self-alignment.
• If the solder volume is poor, LED may not be mounted
to the proper position that causes misalignment ofLED.

Figure 14. Evaluation Result (② θ:+10°)※n=24pcs/each condition
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Assembly Precautions for the Nichia 144 Series LEDs
Disclaimer
This application note is a controlled document of Nichia Corporation (Nichia) published to provide technical information/data forreference purposes only. By using this application note, the user agrees to the following:• This application note has been prepared solely for reference on the subject matters incorporated within it and Nichia makes noguarantee that customers will see the same results for their chosen application.
• The information/data contained herein are only typical examples of performances and/or applications for the product. Nichia
does not provide any guarantees or grant any license under or immunity from any intellectual property rights or other rights
held by Nichia or third parties.
• Nichia makes no representation or warranty, express or implied, as to the accuracy, completeness or usefulness of any
information contained herein. In addition, Nichia shall not be liable for any damages or losses arising out of exploiting, using,or downloading or otherwise this document, or any other acts associated with this document.
• The content of this application note may be changed without any prior or subsequent notice.
• Copyrights and all other rights regarding the content of this document are reserved by Nichia or the right holders who havepermitted Nichia to use the content. Without prior written consent of Nichia, republication, reproduction, and/or redistributionof the content of this document in any form or by any means, whether in whole or in part, including modifications or derivative
works hereof, is strictly prohibited.

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TOKUSHIMA 774-8601, JAPAN
Phone: +81-884-22-2311 Fax: +81-884-21-0148

NICHIA CORPORATION
http://www.nichia.co.jp

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