EMA-400
Desk Top Mask Aligner

Brief Summary
Mask size; 5-inch max.
Wafer size; 4-inch max.
Integrator lens for exposure
Soft contact method
Hard contract method (option)
Resolution; 3μm L/S at soft contact
2μm L/S at hard contact）
Application: Ink-jet printer head, pressure
sensor, acceleration sensor, gyroscope, flow
path module, HDD head, optical switch,
DNA analysis chip,
active catheter

Desk top Mask Aligner
EMA-400

Desk top Mask Aligner
EMA-400Features
Easy alignment with Split-Field Microscope(split-field image alignment scope)
Microscope is used to make an alignment (positionadjustment) between mask & wafer
Confirming alignment marks in the double visual field
can avoid discrepancy between mask & wafer, and it
competes with large size mask aligner in alignment
accuracy.

1)

Low-end machine, but having Split-Field
Microscope*Making alignment accuracy improved*Alignment accuracy is less than ±3μm2) Objective lens separation 15 to 75mm variable
to meet small amorphous size of waferDesk top Mask Aligner
EMA-400Features
Integrated lens for exposureThis is differential,competitive, high-quality
lens to expose evenly
without unevenness.

1) Light beam directions are parallel
2)Parallel angle is within 1 degree3)The more all the light beams run parallel onto mask, the more
illumination system becomes effective for exposure4)Lens surface looks like honeycomb structureDesk top Mask Aligner
EMA-400

Features
Unevenness in illumination
intensity of integrated lensmeasuring points mentioned right, thenfiguring out illumination intensity = (MAXMIN)/(MAX+MIN) → within ±5%※Even exposure in an area of 4-inch can beachieved

Red LED 630nm is adopted as anillumination for alignment
Advantages of adopting LED as compared with normallighting;* No exposure is done during alignment, because of
monochromatic light (red).
* Life span is longer than normal lighting; accordingly
frequency of light source exchange is less.

Features

Desk top Mask Aligner
EMA-400

Pursuing better operability with mask sliding
method and 4-axis (X,Y,theta & Z) wafer stage
unit
Multi-wafer chuck is adopted to meet fromsmall amorphous size of wafer to 4-inch wafer
Multi-wafer chuck(Stage to put a wafer on)1) Sliding a stage unit and optical tube unit to right side, then put a
specimen onto wafer chuck2) Sliding the optical unit back to confirm alignment, then put down
a cover to expose

Micrometers are adopted for stage
to be moved it from side to side andup and down.

Desk top Mask Aligner
EMA-400

Features

Resolution less than 2μm L/S can be realized with an optional
function: hard contact method (N2 blowing up)
N2 Blowing Up Method: Blowing up a wafer by N2 (or dry air) from beneath tocontact it to a mask (hard contact)

Hand contact method
can realize clear edge
on exposure
Blowing up or absorbing by N2
from holes on multi-wafer chuck

Resolution as per various gap / SEM photo

Desk top Mask Aligner
EMA-400

Hard contact

Gap 0 μm

Gap 10 μm

Gap 20 μm

Gap 30 μm

Gap 40 μm

Gap 50 μm

Gap 60 μm

Gap 70 μm

Gap 80 μm

Gap 90 μm

Gap 100 μm

Resolution as per various photoresist / SEM photo

PMER / Gap 0 μm

SU8 / Gap 20 μm

PMER / Gap 20 μm

Desk top Mask Aligner
EMA-400

SU8 / Gap 0 μmusing Toppan Chart