Preamplifier Electronics for CCD Arrays
in UV/VIS Spectroscopy

The preamplifier electronics interfaces directly to theCCD chip. It provides all required digital signals for
managing the readout process of the array. In addition it generates all necessary supply voltages from asingle 12V DC input.
The preamplifier electronics connects to an Operating Electronics (Front End Electronics and InterfaceElectronics), where further data processing like AD
conversion, buffering and data transfer to the computer is performed.

Advantages for Applications
The series S703x of Hamamatsu back thinned/ backilluminated CCD arrays combines a high sensitivity
over the whole spectral range from deep UV to NIR
with the high dynamic range of a classical photodiode detector array. The series S701x fromHamamatsu are more cost-efficient front-illuminatedtypes for applications not requiring UV-sensitivity.
Both series are available with up to 1044 columns.
Using these devices, all types of UV-VIS-NIR spectroscopy can be covered. The CCD’s are especiallysuitable for low light level detection like fluorescenceor diffuse reflection measurements. Due to the capability to detect even smallest amounts of light, short
exposure times can be achieved in applications likehigh speed process control.
The preamplifier electronics provides an easy integration into the existing tec5 family of detector array
Operating Electronics. This gives the user the benefit
to extend the own product line by a CCD based device.
An optional temperature control board is available forthe cooled CCD types.

DZA-S703x electronics boards, shown with optional coolingcontroller

For Hamamatsu CCD series S703x and S701x
16 Bit Resolution

Operation Modes

The preamplifier electronics supports a variety ofbinning modes, including line-binning, as well as thearea readout mode.
Mode 'Line-binning'

Various binning modes supported
Easy to integrate and use
Optional Cooling Controller available
Compatible to tec5 Operating Electronics

Supported Sensors / Detector Arrays
Supported CCDs:
Hamamatsu back thinned / back illuminated
FFT-CCDs series S-7030, S-7033and S7170 (uncooled) and S-7031, S7034 and S7171 (one stage TE-cooled)
Hamamatsu front-illuminated FFT-CCDsseries S-7010 (uncooled) and S-7011 (onestage TE-cooled)

In this operating mode, the information of all pixels ina column is combined. It imitates a classical 1D arrayfor spectroscopy with a large pixel height, providing
all the advantages of a large pixel area. The arraydata is compressed to a one dimensional format sothat fast readout is possible due to the lower numberof pixels.
Mode 'Imaging'
The imaging mode allows to access the informationfrom each individual pixel. Various partial binningmodes are possible.
Notice: Currently, the imaging mode is not supportedby the subsequent Operating Electronics. Suitableelectronics is in preparation.

株式会社 スペクトラ・コープ〒164‑0011 東京都中野区中央4‑4‑5第一小林ビル
Tel:03‑5328‑2858 Fax:03‑5328‑2859
URL http://www.spectra.co.jp

Board Arrangement

to FEE
0.5 m max.

Supply+ 12V DCDigital control

The preamplifier electronics is of modular design
and, therefore, consists of several boards or functional units, respectively.
Sensor board:
small board for carrying the sensor chip. It has a big
opening for access to the chip backplane. This allows
to attach heat conducting devices for proper
temperature control to the TE-cooled CCD types. Thecompact size allows easy integration in all opticalsetups, e.g. the distance of the chip to a spectrometer input can be very short, which ends up in a small
split-off angle between optical input and output of theimaging spectrometer device.
Logic board:
provides digital management of the sensor array(clocking and control / status functions)Power supply board:generates all necessary supply voltages for the unit
out of +12 VDC.
Cooling controller board:contains the temperature controller electronics tostabilize a set temperature of the sensor chip. The
optional board can be slipped on to the power supplyboard.

Videoplugged
or 0.2 mtyp.
Cooling PCB
100mm x 60mm
(optional, plug-on)

0.2 m
typ.
pluggedor 0.2 m
typ.

Logic PCB
100mm x 75 mm

34mm x 19mm

Sensor PCB
68mm x 45 mm
Power PCB
100mm x 60 mm
Peltier current, thermistor
0.5 m max.

Configuration of the CCD preamplifier electronics

Technical Data / Performance
Configuration:line-binning mode
readout time of a detector array with 1044 columns: less than 10 ms
minimum integration time equivalent to readout
time
intensity resolution: 16 Bit
dynamics: up to 15 bits with CCD
operating mode selection by software via I2C orsolder gaps
modular board configuration
supply: + 12 VDC, up to 3A (with temperaturecontroller, depending on CCD type)All boards are interconnected by flat-ribbon cables.
For operation, a tec5 Operating Electronics with aFront End Electronics of type FEE-CCD is required.

tec5 AGIn der Au 25
61440 Oberursel
Germany
Phone: +49 6171/9758-0
Fax: +49 6171/9758-50
e-mail: Info@tec5.com
Internet: www.tec5.com

Products■ DZA-S7030-4-SLP■ DZA-S7030-4-SLPC■ DZA-S7010-1-SLP■ DZA-S7010-1-SLPC■ FEE-CCD■ BE-PCI CCD/DZA

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