EV GROUP® | Products//

Temporary Bonding and Debonding Systems

Solutions for TemporaryBonding and Debonding

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EV GROUP® | Products//Bonding//

Temporary Bonding and Debonding SystemsIntroduction
Temporary bonding is an essential process that offers mechanical support for thin or to-bethinned wafers, which is important for 3D ICs, power devices and FoWLP wafers as well as
for handling fragile substrates, like compound semiconductors. EVG’s outstanding bondingknow-how is also evident in its temporary bonding and debonding equipment, which it hasprovided since 2001.

Temporary Bonding and Debonding Benefits
Adaptiveness■■■Open adhesive platform
Modular tool layout – throughput optimized depending on specific process
Product range from manual to fully automated tools

Handling■■

Bridge capability for different substrate sizes
Available with multiple load port options and combinations

Control■■

Integrated metrology enables feedback loop for high-yield processes in automated tools■

Fully integrated SECS/GEM interface in automated tools

Integrated software for real-time monitoring and recording of all relevant processparametersTemporary Bonding Principle

Debonding Principle

Carrier wafer coatedwith release layer

Mount wafer stack
onto film frame

Flip wafer

Alignment

Bond process

Wafer thinning & Backside processing

Front side processed device wafer

Debond process

Clean process

Thin wafer on film frame

EVG®850 TB Automated Temporary Bonding System■
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Open adhesive platform
Various carriers possible (silicon, glass, sapphire, etc.)
Software monitoring of processes parameters
Bridge tool capability for different substrate sizes
Substrate ID reader and SECS/GEM integration
Integrated inline metrology module for automated feedback loop
Modular tool layout – throughput-optimized depending on specific process

EVG®850 DB Automated Debonding System■
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Reliable handling of thinned, bowed and warped wafers with and without
topography
Automated cleaning of debonded wafer
Available with multiple load port options and combinations
Software monitoring of processes parameters
Bridge tool capability for different substrate sizes
Substrate ID reader and SECS/GEM integration
Modular tool layout – throughput-optimized depending on specific process

EVG®880 LayerRelease™

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Fully automated, front end compatible HVM equipment
Substrate size up to 300 mm (SEMI M1)
Substrate ID reader and SECS/GEM integration
OHT, AGV, PGV compatible
Complete process control including laser metrology at point of use
Integrated Separation Module for lift off of exposed substrates

EVG®805 Debonding System

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Thermal slide off or thermal lift off debond configuration
Recipe-controlled system
Real time monitoring and recording of process parameters
Automated thickness control
Unique features for thin-wafer handling
Various chuck designs to support thinned, bowed and warped wafers with andwithout sensitive topography

EVG Debonding Capabilities
Slide-Off and Lift-Off
Debonding■ Thermal debonding■ Temperature triggered

UV Laser Debonding

IR Laser Debonding■ EVG LowTempTM■ EVG LowTempTM

softening or outgassingof adhesive■ UV laser release■ IR laser release

thermoplastic adhesivesystems■ Single- or dual-layer■ Inorganic release layer■ Single-layer■ Invariant to device

wafer topography andmaterial

debondingdebondingenabling force-freecarrier lift-off

enabling force-freecarrier lift-off

adhesive system(thermo-plast,thermoset, photosetand b-stage adhesives)■ Invariant to carrier■ Independent of device■ Debonding temperature■ UV transparent carrier

HEAT

UV LIGHT

wafer material

wafer type and surface

linked to thermalstability(nanometer scalethickness)■ Temperature stable for
BEOL & FEOL

■ Carrier has to be silicon■ Front-end-of-line
compatible

IR LIGHT

Software and Support
The customized machine software EVG CIMFramework offers a variety of features that
optimize your production processes and increase efficiency. The user-friendly interface
allows for quick familiarization. Specifically, the intuitive recipe functionality simplifies
the configuration of machine operations and process steps. The software is Microsoft®
Windows based and seamlessly communicates via SECS/GEM with the factory hosts. It
enables smooth and secure data exchange and integration into the existing infrastructure.
Our experienced support team is here to assist you with any questions or issues including
field-proven, real-time remote diagnostics via secured connection. Cleanroom space on
three different continents (Europe – HQ, Asia – Japan, North America – USA) and a decentralized worldwide support structure underline this.
In addition, our new innovative data analysis platform EVG Analytics enables you tointelligently analyze your machine data and gain valuable insights. Whether you want toperform time seriesEVG
analyses, process
quality assessments
or application-specific analyses
Process
Expertise- our product provides you with the tools to use your machine data efficiently.
...etc.
CVD,
LPCVD,
PVD,...

ResistCoating
Spin/Spray

Wafer &Template
Fabrication
Substrate
Cleaning
Substrate
Bondingfor SOI

MasklessExposure

RIE,DRIENanoimprint
Lithography

ResistDeveloping

Metallization

Wafer
DicingThinning,
CMP

Wafer
Bonding
Metrology

ResistLift-Off

PlasmaActivation

EVG Processes

Electroplating
Wet
Etching

Proximity
Lithography
Alignment
Verification

Bond
Alignment

Temporary
Bonding/
DebondingStressReliefEtching

Chip-toWafer
Bonding

Oxidation
Wafer
Bumping &Redistribution

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EV GROUP® | Products//

Bonding//

Temporary Bonding and Debonding Systems

Modules for temporary bonding
Spin Coat Module■■

With up to two free configurable dispense arms per module.
Automated nozzle wash, EBR and BSR.

Stacked Bake Modules■■

With fixed proximity pins, recipe controlled temperature and time.
Optional solvent bakes with double-side heating and hightemperature bakes up to 350 °C.

Bond Module​■■

With automatic, low-force wedge error compensation andintegrated alignment within bond chamber.
Dedicated bond module for UV initiated adhesive bond available.

Inline Metrology Module■■

Contactless and non-destructive 100% production inspection.
Metrology Capabilities: Thickness and TTV of IR transparent
layer and stacks, topography, bow and warp.

Modules for debonding
UV Laser Debond Module■■High-throughput, room-temperature debonding through glass
carrier.
Complete process monitoring and control.

IR Laser Release Module■■■

High-throughput, room temperature exposure through siliconcarrier.
Front-end-of-line compatible.
Complete process monitoring and control.

Separation Module■

Force controlled lift off of carrier wafer after IR Laser release.

Slide off Debond Module■■

Fully supported thin wafer during thermal initiated horizontal
slide off process.
Complete process monitoring and control.

Clean Module■

Capable of handling film frame mounted, thin or high-topographywafers.

Detape Module■

Removing temporary bonding adhesives by peeling it with anadhesive tape.

Film Frame Mount Module■

Lamination of thin wafers or wafer stacks on film frames using
pre-cutted tapes.

www.EVGroup.com

Headquarters
EV Group Europe & Asia/Pacific GmbHDI Erich Thallner Strasse 14782 St. Florian am Inn
Austria+43 7712 5311 0
Sales@EVGroup.com
TechSupportEurope@EVGroup.com

EVG Subsidiaries
North America
EV Group Inc.
+1 480 305 2400
SalesNorthAmerica@EVGroup.com
TechSupportNorthAmerica@EVGroup.com

China
EV Group China Ltd.
+86 21 3899 4888
Sales@EVGroup.cnTechSupportChina@EVGroup.com

Japan
EV Group Japan KK+81 45 348 0665
Sales@EVGroup.jp
TechSupportJapan@EVGroup.com

TaiwanEVG-JOINTECH CORP.
+886 3 516 3389
Sales@EVG-Jointech.com.tw
TechSupportTaiwan@EVGroup.com

Korea
EV Group Korea Ltd.
+82 2 3218 4400
Sales@EVGroup.co.kr
TechSupportKorea@EVGroup.com

Get in touch:Contact@EVGroup.com

www.EVGroup.com/products/bonding/temporary-bonding-and-debonding-systems

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EVG makes no representation that the use or implementation of the information contained in this document will not infringe or violate any copyright, patent, trademark, trade secret or other right.
In no event shall EVG be liable for any claim, damages or other liability, including any general, special, indirect, incidental, or consequential damages, whether in an action of contract, tort infringement,
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design and specifications without prior notice.
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