FOR IMMEDIATE RELEASEEV GROUP DOUBLES THROUGHPUT OF INNOVATIVE SEMICONDUCTOR LAYER TRANSFERTECHNOLOGY WITH NEW EVG®880 LayerRelease™ SYSTEM
Dedicated HVM equipment platform boosts productivity and lowers cost-of-ownership of novel infraredlaser release technology through silicon carrier wafers for 3D integration applications
ST. FLORIAN, Austria, May 28, 2024—EV Group (EVG), a leading supplier of wafer bonding andlithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced theEVG®880 LayerRelease™ system, a dedicated high-volume manufacturing (HVM) equipment platform
incorporating EVG’s innovative infrared (IR) LayerRelease™ technology. Providing a two-fold increase inthroughput compared to the previous-generation platform, the EVG880 LayerRelease system enables
nanometer-precision release of bonded, deposited or grown layers from silicon carrier substrates using anIR laser coupled with specially formulated inorganic release materials. As a result, the EVG880
LayerRelease system eliminates the need for glass carriers—enabling ultra-thin chiplet stacking foradvanced packaging, as well as ultra-thin 3D layer stacking for front-end processing, including advanced
logic, memory and power device formation, to support future 3D integration roadmaps.
Moving Beyond Glass Carriers for 3D Stacking
In 3D integration, glass substrates have become an established method for building up device layers
through temporary bonding with organic adhesives, using an ultraviolet (UV) wavelength laser to dissolve
the adhesives and release the device layers, which are subsequently permanently bonded onto the final
product wafer. However, glass substrates are difficult to process with semiconductor fab equipment thathave been designed primarily around silicon, and that require costly upgrades to enable glass substrate
processing. In addition, organic adhesives are generally limited to processing temperatures below 300°C,
limiting their use to back-end processing.
EVG’s LayerRelease technology utilizes an IR laser and inorganic release materials to enable laser
debonding on silicon carriers with nanometer precision in production environments, thereby avoiding
these temperature and glass carrier compatibility issues. The innovative process eliminates the need forglass substrates and organic adhesives, enabling front-end process compatibility for ultra-thin-layertransfer and downstream processes. The nanometer precision of the LayerRelease process allows forprocessing extremely thin device wafers without changing processes of record. Subsequent stacking ofsuch thin device layers enables higher-bandwidth interconnects and new opportunities to design andsegment dies for next-generation, high-performance devices.
The most demanding front-end processing is supported by the LayerRelease technology’s hightemperature compatibility (up to 1000°C) while the room-temperature IR cleaving step ensures device
layer and carrier substrate integrity. The layer transfer process also eliminates the need for expensive
solvents associated with carrier wafer grinding, polishing and etching.
The new EVG880 platform upon which the LayerRelease technology has been integrated into is wholly
designed and dedicated for the LayerRelease process. It is a fully automated, front-end-compatible, HVM
platform with integrated laser exposure, wafer cleaving and wafer cleaning all in one tool. The EVG880
features a low-maintenance laser source and complete process control with laser metrology at point ofuse.

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“3D integration is increasingly important in optimizing the Power, Performance, Area and Cost (PPAC)
metric in semiconductor design and manufacturing, as well as enabling roadmap continuation,” statedPaul Lindner, executive technology director at EV Group. “With 3D integration, there is no way aroundwafer bonding or layer transfer. EVG’s LayerRelease technology is a truly unique and universal layertransfer technology that has been adopted by industry-leading research institutes and device
manufacturers to support a wide range of applications, from advanced packaging to 3D integration tofuture front-end-of-line scaling. As early adopters of our LayerRelease technology are expected to movequickly from industrial research to manufacturing, EVG has increased its focus on improving thetechnology’s productivity and cost of ownership. We are excited to now be able to offer this innovativetechnology on our new EVG880 HVM equipment platform, enabling customers to rapidly deploy theLayerRelease process for their current and next-generation product designs.”
EVG is now accepting orders for the EVG880 LayerRelease system, and is offering productdemonstrations at EVG’s headquarters. For more information, visit
https://www.evgroup.com/products/bonding/temporary-bonding-and-debonding-systems/evgr880layerreleasetm.
See EVG at ECTC
EVG is participating in the 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
being held this week at The Gaylord Rockies Resort & Convention Center in Denver, Colo. ECTC
attendees interested in learning more about the EVG880 LayerRelease system, as well as other EVG
wafer bonding, lithography and metrology solutions for heterogeneous integration, are invited to visit EVG
at Booth 522 during exhibition hours on May 29-30.
About EV Group (EVG)
EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture ofsemiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices
and nanotechnology devices. Key products include wafer bonding, thin-wafer processing,lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters,
cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate
network of global customers and partners all over the world. More information about EVG is available atwww.EVGroup.com.
Contacts:
Clemens Schütte
Director, Marketing and Communications
EV Group
Tel: +43 7712 5311 0
E-mail: Marketing@EVGroup.com

David Moreno
Principal
Open Sky Communications
Tel: +1.415.519.3915
E-mail: dmoreno@openskypr.com###