EV GROUP® | Technologies

Solutions for MEMS

www.EVGroup.com

EV GROUP® | Technologies//Solutions for MEMS

Introduction
Today, micro-electro-mechanical systems (MEMS) devices are present in almost every
technology of daily life. Smartphones are a prominent example of consumer devices thatincorporate multiple MEMS devices, such as accelerometers and gyroscopes for motion
sensing and MEMS-based filters for wireless communication.
MEMS are also a key technology for the automotive industry, ranging from pressure sensors inengine management or tire pressure monitoring systems to accelerometers in airbag releasesystems. In particular, MEMS devices for automotive and industrial applications must meetthe highest standards of performance and reliability, which also place the highest demands
on manufacturing technologies.
EVG has a long history as a leading supplier of wafer processing equipment for the MEMS
market. Today, excellent process know-how, continuous innovation and a broad productportfolio in the areas of lithography and wafer bonding ensure that MEMS customers aresupported in developing leading-edge solutions for their next-generation devices.

Lithography
Most MEMS devices consist of 3D structures with high topography and small fragile moving
parts. Manufacturing processes therefore require thick resist processing, conformal coatingover topographies combined with excellent exposure and alignment capabilities. In addition
to standard UV lithography, nanoimprint lithography (NIL) even offers nanostructuring for
emerging MEMS applications. Furthermore, maskless exposure (MLE™) technology enables
dynamic patterning of photoresist, including the possibility of individual die annotation - animportant feature for critical automotive and industrial MEMS applications.

O Optical Elements

TN Nanostructured
SurfaceHigh TopographyStructuring
B

Bond Frames

AHigh Alignment
Accuracy

D Die Annotation

C Cavity / Sidewall
Structuring

Advancedresist processing

■
■
■
■

BCTSpin and spray coating capabilities
Multilayer processing
Specialty resist processing
Spray, puddle, stream andultrasonically assisted development

High accuracy
mask alignment

■
■
■
■

A B

CT

Lithography for etching andmetallization
Latest UV-LED technology
High depth-of-focus exposure
Bond alignment

B

Digital Manufacturing
D A B C T
with Maskless
Exposure Technology (MLE™)■

Dynamic photoresist patterning with< 2 µm line / space resolution■Individual patterns from dieannotation to multi-project wafers■■

Mask-free digital infrastructure
Smart & agile from fast prototyping tomass-manufacturing

Nanoimprint Lithography (NIL)
for highest resolution

O N■

Volume-proven wafer-level imprinting
technology■■

Proprietary SmartNIL® technology■

Innovative processing for Bio-MEMS

Leading-edge wafer-level-optics
capabilities

MEMS Devices

Gyroscopes
Environmental Sensors
Ultrasonic Sensors
Microphones

EMERGING MARKETSBIO MEMS

RF MEMSCONSUMER

Accelerometers

Inkjet Printheads
Magnetometers

Gas Sensors

Inertial Measurement Units
Pressure Sensors

AUTOMOTIVE / INDUSTRIAL

Optical MEMS

Process Results
Lithography

100 µmMEMS Structures patterned in 20 µm thickresist
Source: EVG

100 µm

MLE™ exposure in 50 µm thick layer JSR THB
151N negative tone resist
Source: EVG

100 nmHigh-Q-3D solenoid inductors for RF ICs.
Metal structures created using spray coating
Courtesy of SIMIT

20 µm thick black resist spin-coated double
layer on 8” substrate exposed on
EVG®6200 NT
Source: EVG

BondingSiSi

Amorphouslayer

5 nm

100 µmGlass-frit bond interface
Courtesy of ST Microelectronics

Cross section of a Cu:Sn bonding layer
Courtesy of Siemens

SEM image of a MEMS device bonded to an
ASIC using Al-Ge eutectic bonding system
Courtesy of Chipworks

Oxide-free silicon-silicon interface
Source: EVGSiSiWafer Bonding
Many MEMS devices need to be protected from the external environment or operate only
under controlled atmosphere or vacuum. Today’s high levels of integration with CMOS
chips also require advanced wafer-level packaging solutions for MEMS devices. In addition,
many MEMS are based on technical substrates such as SOI wafers. Therefore, wafer-levelbonding processes play a crucial role in the manufacture of MEMS device.

EElectricalConductanceVVacuum Encapsulation
O OxideManagement

N Narrow bond lines

T

H HermeticSealing

TopographyTolerance

NN

N

Metal bonding for
E V H N
hermetic sealing andvacuum encapsulation(Solder, Eutectic, Transient Liquid Phase(TLP), Metal Diffusion)

■
■
■
■

Defined pressure encapsulation
Good mechanical strength■■■■High post-bond alignment accuracy
Versatile interface properties

Anodic bonding for reliablesilicon-glass interfaces

■
■
■
■

Fusion bonding forengineered substrates

VMEMS-SOI substrates
Hybrid bonding
Collective die transfer
Heterogeneous integration foradvanced semiconductor packages

NVNH

Topography tolerance withglass-frit bonding

■
■
■
■

Highly stable and strong bond
Optical transparency
Triple-stack bonding (Si-glass-Si)
High post-bond temperature
tolerance

VT

H

Intermediate glass layer
Wide process window
Planar electrical feedthroughs
Production proven for decades
NB

Adhesive bonding forsimplified integration

HT■■

Temporary bonding / debonding■

Ultra-thin adhesive layer transferbonding■

Compatible with a wide range ofsubstrate materialsRoom-temperature bonding with
UV-curing adhesives

HNHigh-end
O E V H N
packaging withComBond® technology■

High-vacuum handling andprocessing (<7E-8 mbar)■

Vacuum encapsulation withoutgetters■■

Low-temperature Al-Al bonding
Wafer surface activation

Process Services and Competence CenterWith state-of-the-art application labs and cleanrooms at its headquarters in Austria, as wellas in the U.S. and Japan, EVG is focused on delivering superior process expertise to ourglobal R&D and production customer and partner base. Services range from equipment
demonstrations and feasibility studies to small-to-medium-scale pilot-line production
to shorten time to market. EVG has also established the Heterogeneous Integration
Competence CenterTM, which is designed to assist customers in leveraging EVG’s processsolutions and expertise to enable new and enhanced products and applications driven byadvances in system integration and packaging.

www.EVGroup.com

EV GROUP® | Technologies//Solutions for MEMS

MEMS Devices

Gyroscopes
Environmental Sensors
Ultrasonic Sensors
Microphones

EMERGING MARKETSBIO MEMS

Accelerometers

RF MEMSCONSUMER

Inkjet Printheads
Magnetometers

Gas Sensors

Inertial Measurement Units
Pressure Sensors

AUTOMOTIVE / INDUSTRIAL

Optical MEMS

Product Range Excerpt
Lithography

EVG®610
Mask Alignment System
up to 200 mm

EVG®7300 Automated
SmartNIL® UV-NIL System
up to 300 mm

LITHOSCALE® Maskless Exposure
Lithography System
up to 300 mm

HERCULES®
Lithography Track System
up to 300 mm

GEMINI® Automated Production
Wafer Bonding System
up to 300 mm

ComBond® Automated High-Vacuum
Wafer Bonding System
up to 200 mm

EVG®850 TB AutomatedTemporary Bonding System
up to 300 mm

Bonding

EVG®501 / EVG®510
Wafer Bonding System
up to 200 mm

www.EVGroup.com

HeadquartersEV Group Europe & Asia/Pacific GmbHDI Erich Thallner Strasse 14782 St. Florian am Inn
Austria+43 7712 5311 0
Sales@EVGroup.com
TechSupportEurope@EVGroup.com

EVG Subsidiaries
North America
EV Group Inc.
+1 480 305 2400
SalesNorthAmerica@EVGroup.com
TechSupportNorthAmerica@EVGroup.com

China
EV Group China Ltd.
+86 21 3899 4888
Sales@EVGroup.cn
TechSupportChina@EVGroup.com

Japan
EV Group Japan KK+81 45 348 0665
Sales@EVGroup.jp
TechSupportJapan@EVGroup.com

TaiwanEVG-JOINTECH CORP.
+886 3 516 3389
Sales@EVG-Jointech.com.tw
TechSupportTaiwan@EVGroup.com

Korea
EV Group Korea Ltd.
+82 2 3218 4400
Sales@EVGroup.co.kr
TechSupportKorea@EVGroup.com

Get in touch:Contact@EVGroup.com

www.EVGroup.com/technologies

The information contained in this document is provided “as is” and without warranty of any kind, express or implied. Any express or implied warranties including, but not limited to, any implied warranty ofmerchantability, fitness for a particular purpose, and patent infringement or other violation of any intellectual property rights are hereby expressly disclaimed.
EVG makes no representation that the use or implementation of the information contained in this document will not infringe or violate any copyright, patent, trademark, trade secret or other right.
In no event shall EVG be liable for any claim, damages or other liability, including any general, special, indirect, incidental, or consequential damages, whether in an action of contract, tort infringement,
misappropriation or otherwise, arising from, out of or relating to the use or inability to use the information.
Acceptance and/or any use of the information contained in this document shall be deemed consent to, and acceptance of, this disclaimer.
Data, design and specifications may not simultaneously apply; or may depend on individual equipment configuration, process conditions and materials and vary accordingly. EVG reserves the right to change data,
design and specifications without prior notice.
All logos, company names and acronyms or any combinations thereof, including, but not limited to, EV Group®, EVG® and the Triple i logo, equipment and technology names and acronyms such as GEMINI®,HERCULES®, BONDSCALE®, SmartView®, SmartNIL® and many others, as well as website addresses, are registered trademarks and/or the property of EV Group. For a complete list of EVG trademarks visit
www.EVGroup.com/Imprint. Other product and company names may be trademarks of their respective owners.
Printed on paper from sustainable sources© EV Group (EVG). All rights reserved. V22/01

www.EVGroup.com