TABLE 6.3 (UPDATED)INFORMATION SOURCES NECESSARY FOR COMPLETING THE TIERED EMISSIONS ESTIMATING METHODS FOR GASEOUS FCS FOR
ELECTRONICS MANUFACTURING

Production

Note: The names of the variables have been simplified for the purpose of Table 6.3; please refer to the equations in each tiered methodology forthe complete definitions of the variables and their units.
Legend: (Me) = measured; (Mo) = modelled (calculated but no equation specified in this chapter); (D) = default factors from guidance; (C) =calculated using an equation in this chapter.
* These variables are applicable to both sampling period and total year.

Variables

Tier 1

Annual production

P (Me/Mo)

Fraction of PV manufacturethat uses FC gases
δ = 1 when applied to PV
industry and zero when applied
to either semiconductor or
TFT-Display industries,
dimensionless
Total number of tools that use
gas i to run process type p (e.g.,chamber cleaning processes)
Number of tools that use gas ito run process type p and thatare equipped with suitableemissions control technologies
Total number of tools that use
gas i to run reference process
type q (e.g., etch and/or wafer
cleaning (EWC) processes)
Number of tools that use gas i
to run reference process type q
and that are equipped withsuitable emissions control
technologies

FPV(Me/Mo)

Tier 32a2b2c3a3bni,p, nk,i,p (Me)ni,p, nk,i,p (Me)ni,p, nk,i,p (Me)ni,p, nk,i,p (Me)ni,p, nk,i,p (Me)ni,p,a, nk,i,p,a(Me)

ni,p,a, nk,i,p,a(Me)

ni,p,a, nk,i,p,a(Me)ni,p,a, nk,i,p,a(Me)ni,p,a, nk,i,p,a (Me)mi,q, mk,i,q(Me)mi,q, mk,i,q(Me)mi,q, mk,i,q (Me)mi,q,a, mk,i,q,a(Me)mi,q,a, mk,i,q,a(Me)mi,q,a, mk,i,q,a (Me)Ci(C)

Ci (C)

Ci,p (C)Ci,p (C)Ci,f (Me/Mo)

IBi (Me)IBi (Me)IBi (Me)IBi (Me)IBi (Me)IEi (Me)IEi (Me)IEi (Me)IEi (Me)IEi (Me)Ai (Me)Ai (Me)Ai (Me)Ai (Me)Ai (Me)Ti (C)Ti (C)Ti (C)Ti (C)Ti (C)

Heel factor

hi,c (D/Me)

hi,c (D/Me)

hi,c (D/Me)

hi,c (D/Me)

hi,c (D/Me)

Number of containers

Ni,c (Me)Ni,c (Me)Ni,c (Me)Ni,c (Me)Ni,c (Me)Full capacity of containers
Total number of container
types

Fi,c (Me)Fi,c (Me)Fi,c (Me)Fi,c (Me)Fi,c (Me)M (Me)M (Me)M (Me)M (Me)M (Me)

Φi,p (Me/Mo)

Φi,p (Me/Mo)

Φi,p (Me/Mo)

Φi,p (Me/Mo)

Annual consumption of gas

Process Gas Entering Tool

Tier 2Inventory of input gas stored incontainers at the beginning of
the reporting year
Inventory of input gas stored incontainers at the end of thereporting year
Acquisitions of input gas
during the year
Transfers of input gas

Apportioning factor

δ (D)TABLE 6.3 (UPDATED) (CONTINUED)INFORMATION SOURCES NECESSARY FOR COMPLETING THE TIERED EMISSIONS ESTIMATING METHODS FOR GASEOUS FCS FOR
ELECTRONICS MANUFACTURING

Process

Note: The names of the variables have been simplified for the purpose of Table 6.3; please refer to the equations in each tiered methodology forthe complete definitions of the variables and their units.
Legend: (Me) = measured; (Mo) = modelled (calculated but no equation specified in this chapter); (D) = default factors from guidance; (C) =calculated using an equation in this chapter.
* These variables are applicable to both sampling period and total year.

Variables

Tier 1

Emission Factor

EFi (D)

Tier 32a2b2c3a

Use rate of gas

Ui (D)Ui (D)

Ui,p (D)Ui,p (Me)Byproduct emission factor

Bk,i (D)Bk,i (D)Bk,i,p (D)Bk,i,p (Me)di, dk (D)di, dk (D)di, dk (D)di, dk (D/Me)Di, Dk,i (C)Di, Dk,i (C)Di,p, Dk,i,p (C)Di,p, Dk,i,p (C)ABi,CF4 (D)ABi,CF4 (D)ABi,CF4 (D)ABi,CF4 (D)η (Me)

η (Me)

ηp (Me)ηp (Me)γi,p, γk,i,p (D)γi,p, γk,i,p (D)ai, ak,i (C)ai, ak,i (C)ai,p, ak,i,p (C)ai,p, ak,i,p (C)ai,f, ak,i,f (C)UT (C)UT (C)

UTp (C)

UTp (C)

UTf (C)*Tdn (Me)Tdn (Me)Tdn,p (Me)Tdn,p (Me)Tdn,f (Me)*TTn (Me)TTn (Me)TTn,p (Me)TTn,p (Me)TTn,f (Me)*

Destruction Removal
Efficiency (DRE)
Overall reduction of emissions

Downstream Emissions Control

Tier 2Mass fraction of F2 in process
exhaust gas that is converted
into CF4 by direct reaction withhydrocarbon fuel in a
combustion emissions control
system.
Ratio of emissions control
systems certified not to form
CF4 within emissions control
systems to the total number ofemissions control systems in
the facility
Ratio of uncontrolled emissions
per-tool from tools runningweighted process types p (e.g.,chamber cleaning processes) touncontrolled emissions per-toolfrom process tools runningreference process types q (e.g.,EWC processes)
Estimate of the fraction of gas
exhausted from process tools
equipped with suitableemissions control technologies
Uptime factor of emissions
control systems
Total time that emissions
control system connected toprocess tool(s) in the plant is
not in operational mode whenat least one of the
manufacturing tools connected
to emissions control system isin operation
Total time during whichemissions control system has atleast one associatedmanufacturing tool in operation

3bdi , dk (D/Me)

γi,p, γk,i,p (D)TABLE 6.3 (UPDATED) (CONTINUED)INFORMATION SOURCES NECESSARY FOR COMPLETING THE TIERED EMISSIONS ESTIMATING METHODS FOR GASEOUS FCS FOR
ELECTRONICS MANUFACTURING
Note: The names of the variables have been simplified for the purpose of Table 6.3; please refer to the equations in each tiered methodology forthe complete definitions of the variables and their units.
Legend: (Me) = measured; (Mo) = modelled (calculated but no equation specified in this chapter); (D) = default factors from guidance; (C) =calculated using an equation in this chapter.
* These variables are applicable to both sampling period and total year.

Emissions

Stack Test SpecificVariables

Tier 1

Tier 22a2bTier 32c3a3bFlow rate of stack system
during the sampling period
Molecular weight of gas

MWi, MWk (D)Standard molar volume of gas

SV (D)

Average concentration of input
gas in stack system during
sampling
Length of time interval m in theFTIR sampling period
Total number of time intervals
m in sampling period
Consumption of input gas
during the sampling period
Facility-specific emission
factorEmissions of FC gases or N2O
Emissions of unreacted input
gas
Emissions of by-products
Emissions of CF4 fromhydrocarbon-fuel-based
combustion emissions control
systemsQs (Me)Xi,s,m, Xk,s,m (Me)Δtm (Me)N (C)Activityi,f (Me)EFi,f, EFk,f (C){Ei}n (C)Ei (C)Ei (C)Ei (C)Ei (C)

BPEk (C)BPEk (C)BPEk (C)BPEk (C)

EABi,CF4 (C)EABi,CF4 (C)EABi,CF4 (C)EABi,CF4 (C)EAi,f, ESi,s (C)EAk,f, ESk,s (C)