05/25/2005

RELIABILITY REPORTFORDS1922T, Rev A4Dallas Semiconductor

4401 South Beltwood Parkway
Dallas, TX 75244-3292

Prepared by:

Ken Wendel
Reliability Engineering Manager
Dallas Semiconductor
4401 South Beltwood Pkwy.
Dallas, TX 75244-3292
Email : ken.wendel@dalsemi.com
ph: 972-371-3726
fax: 972-371-6016
mbl: 214-435-6610

Conclusion:
The following qualification successfully meets the quality and reliability standards required of all Dallas
Semiconductor products and processes:
DS1922T, Rev A4
In addition, Dallas Semiconductor's continuous reliability monitor program ensures that all outgoingproduct will continue to meet Maxim's quality and reliability standards. The current status of thereliability monitor program can be viewed at http://www.maxim-ic.com/TechSupport /dsreliability.html.*
Module Description
A description of this Module can be found in the product data sheet. You can find the product datasheet at http://dbserv.maxim-ic.com/l_datasheet3.cfm.*
Reliability Derating:
A module device consists of one or more IC's in a single, upward integrated, package. This
package is assembled to include batteries, crystals, and other piece parts that make up theconfiguration of the Module. Because of either the complexity of the package or the included pieceparts, standard high temperature reliability testing is not possible. Therefore, in order to determine
the reliability of module products, the reliability of each of the piece parts is individually determined,
then summed to determine the reliability of the integrated module product. If there are "n"significant components in the module then:Fr (module) = Fr (1) + Fr (2) + Fr (3) + ..... + Fr (n)Fr (module) = Failure rate of moduleFr(n) = Failure rate of the nth component
Failure Rates are reported in FITs (Failures in Time) or MTTF (Mean Time To Failure). The FIT
rate is related to MTTF by:
MTTF = 1/Fr
NOTE: MTTF is frequently used interchangeably with MTBF.
The calculated failure rate for this module/assembly is:
Module Device:

Module Units:

Quantity:

Fails:Ea:

MTTF (Yrs):

FITs:

BR1225
CRYSTAL

1
1100
100

10

1.0
0.7

175984
12463

0.6
9.2

DS2422

1231

00.7

19833

5.8

DS9503

1152

00.7

17861

6.4

5199

22.0

Totals:The parameters used to calculate the module failure rate are as follows:
Cf: 60%

Tu: 25°C

The reliability data follows. A the start of this data is the module assembly information. This is a
description of the module. The next section is the detailed reliability data for each stress found in thequalification / monitor. If there are additional processes or assemblies used as part of this report, adescription of each will follow which includes the respective reliability data for that process/assembly. The reliability data section includes the latest data available. Some of this data may begeneric with other packages or products.
* Some proprietary products may be excepted from this requirement.
Assembly Information:
Assembly Site:
Pin Count:
Package Type:
Body Size:
Mold Compound:
Lead Frame:
Lead Finsh:
Die Attach:
Bond Wire / Size:
Flammability:
Moisture Sensitivity(JEDEC J-STD20A)
Date Code Range:

Dallas2
Puk Can F50 Insert Mold w/Bump/Battery
17.35
BCB
PCB; FR4High Pb Ball
Underfill FP4527, Dexter Hysol/
UL 94-V00343

to 0514

ELECTRICAL CHARACTERIZATIONDESCRIPTIONDATE CD CONDITIONREADPOINTQTY FAILSESD SENSITIVITY0343

IEC 61000-4-2 CONTACT 2000 VOLTS

10PUL'S30

ESD SENSITIVITY

0343

IEC 61000-4-2 CONTACT 4000 VOLTS

10PUL'S30

ESD SENSITIVITY

0343

IEC 61000-4-2 CONTACT 6000 VOLTS

10PUL'S30

ESD SENSITIVITY

0343

IEC 61000-4-2 CONTACT 8000 VOLTS

10PUL'S30

ESD SENSITIVITY

0343

IEC 61000-4-2 AIR 2000 VOLTS

10PUL'S30

ESD SENSITIVITY

0343

IEC 61000-4-2 AIR 4000 VOLTS

10PUL'S30

ESD SENSITIVITY

0343

IEC 61000-4-2 AIR 8000 VOLTS

10PUL'S30

ESD SENSITIVITY

0343

IEC 61000-4-2 AIR 15000 VOLTS

10PUL'S30

ESD SENSITIVITY

0343

IEC 61000-4-2 AIR 20000 VOLTS

10PUL'S

3Total:

FA#00

STORAGE LIFEDESCRIPTIONDATE CD CONDITIONREADPOINT

STORAGE LIFE

0441

1000 HRS

125C

QTY FAILS
77Total:

FA#00

TEMPERATURE CYCLEDESCRIPTIONDATE CD CONDITIONREADPOINTTEMP CYCLE

0514

1500 CYS

0C TO +125C

Total:QTY FAILS
7700

FA#

UNBIASED MOISTURE RESISTANCEDESCRIPTIONDATE CD CONDITIONREADPOINT

MOISTURE SOAK

0343

85 C/85% R.H.

1000 HRS

750MOISTURE SOAK

0441

60C/90% R.H.

1000 HRS

770Total:QTY FAILS

0FA#