®
OPA

OPA2604

260

OPA

4

260

4

www.burr-brown.com/databook/OPA2604.html

Dual FET-Input, Low Distortion
OPERATIONAL AMPLIFIERFEATURESAPPLICATIONS● LOW DISTORTION: 0.0003% at 1kHz
● LOW NOISE: 10nV/√Hz● HIGH SLEW RATE: 25V/µs● PROFESSIONAL AUDIO EQUIPMENT● PCM DAC I/V CONVERTER● SPECTRAL ANALYSIS EQUIPMENT● WIDE GAIN-BANDWIDTH: 20MHz● UNITY-GAIN STABLE● ACTIVE FILTERS● TRANSDUCER AMPLIFIER● WIDE SUPPLY RANGE: VS = ±4.5 to ±24V
● DRIVES 600Ω LOADS● DATA ACQUISITION(8)V+

DESCRIPTIONThe OPA2604 is a dual, FET-input operational amplifier designed for enhanced AC performance. Very low
distortion, low noise and wide bandwidth provide
superior performance in high quality audio and otherapplications requiring excellent dynamic performance.
New circuit techniques and special laser trimming ofdynamic circuit performance yield very low harmonic
distortion. The result is an op amp with exceptionalsound quality. The low-noise FET input of the
OPA2604 provides wide dynamic range, even with highsource impedance. Offset voltage is laser-trimmed tominimize the need for interstage coupling capacitors.

(+)(3, 5)(–)(2, 6)

Distortion
Rejection
Circuitry*(1, 7)
VO

OutputStage*The OPA2604 is available in 8-pin plastic mini-DIP
and SO-8 surface-mount packages, specified for the–25°C to +85°C temperature range.

(4)
V–* Patents Granted:#5053718, 5019789

International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 • Twx: 910-952-1111
Internet: http://www.burr-brown.com/ • FAXLine: (800) 548-6133 (US/Canada Only) • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132®

© 1991 Burr-Brown Corporation

SBOS0061
PDS-1069E

OPA2604

Printed in U.S.A. October, 1997

SPECIFICATIONSELECTRICALAt TA = +25°C, VS = ±15V, unless otherwise noted.
OPA2604AP, AU
PARAMETERCONDITIONOFFSET VOLTAGE
Input Offset Voltage
Average Drift
Power Supply Rejection

VS = ±5 to ±24V

INPUT BIAS CURRENT(1)Input Bias Current
Input Offset Current

VCM = 0V
VCM = 0V

MIN

TYP

MAX

UNITS

±5

70

±1
±8
80

mV
µV/°C
dB

NOISE
Input Voltage Noise
Noise Density: f = 10Hz
f = 100Hz
f = 1kHzf = 10kHz
Voltage Noise, BW = 20Hz to 20kHz
Input Bias Current Noise
Current Noise Density, f = 0.1Hz to 20kHz
INPUT VOLTAGE RANGE
Common-Mode Input Range
Common-Mode Rejection

VCM = ±12V

±1280

INPUT IMPEDANCE
Differential
Common-Mode
OPEN-LOOP GAIN
Open-Loop Voltage Gain
FREQUENCY RESPONSE
Gain-Bandwidth ProductSlew Rate
Settling Time: 0.01%
0.1%
Total Harmonic Distortion + Noise (THD+N)
Channel Separation
OUTPUT
Voltage Output
Current Output
Short Circuit Current
Output Resistance, Open-Loop
POWER SUPPLYSpecified Operating Voltage
Operating Voltage Range
Current, Total Both Amplifiers

VO = ±10V, RL = 1kΩ

80

G = 100
20Vp-p, RL = 1kΩ
G = –1, 10V Step15

G = 1, f = 1kHz
VO = 3.5Vrms, RL = 1kΩ
f = 1kHz, RL = 1kΩ
RL = 600Ω
VO = ±12V

±11

±4.5
IO = 0TEMPERATURE RANGE
Specification
Storage
Thermal Resistance(2), θJA

100
±4

pA
pA

25
15
11
10
1.5

nV/√HznV/√HznV/√HznV/√HzµVp-p

6

fA/√Hz

±13
100

V
dB

1012 || 81012 || 10Ω || pFΩ || pF

100

dB

20
25
1.5
1
0.0003

MHz
V/µs
µs
µs
%

142

dB

±12
±35
±40
25

V
mA
mA
Ω

±15
±10.5

–25
–40

±24
±12
+85
+125

90

V
V
mA
°C
°C
°C/W

NOTES: (1) Typical performance, measured fully warmed-up. (2) Soldered to circuit board—see text.

The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
®

OPA2604

2

PIN CONFIGURATIONABSOLUTE MAXIMUM RATINGS(1)Top View

Power Supply Voltage ....................................................................... ±25V
Input Voltage ............................................................. (V–)–1V to (V+)+1V
Output Short Circuit to Ground ............................................... Continuous
Operating Temperature ................................................. –40°C to +100°C
Storage Temperature ..................................................... –40°C to +125°C
Junction Temperature .................................................................... +150°C
Lead Temperature (soldering, 10s) AP ......................................... +300°C
Lead Temperature (soldering, 3s) AU .......................................... +260°C

DIP/SOIC

Output A

1

8

V+

–In A

2

7

Output B

+In A

3

6

–In B

V–

4

5

+In B

NOTE: (1) Stresses above these ratings may cause permanent damage.

ORDERING INFORMATIONELECTROSTATICDISCHARGE SENSITIVITYPRODUCT

PACKAGE

TEMP. RANGEOPA2604AP
OPA2604AU

8-Pin Plastic DIP
SO-8 Surface-Mount–25°C to +85°C–25°C to +85°C

PACKAGING INFORMATION

Any integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling andinstallation procedures can cause damage.

PACKAGE DRAWINGESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametricchanges could cause the device not to meet published specifications.

PRODUCT

PACKAGENUMBER(1)OPA2604AP
OPA2604AU

8-Pin Plastic DIP
SO-8 Surface-Mount

006
182

NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.

®

3

OPA2604

TYPICAL PERFORMANCE CURVESAt TA = +25°C, VS = ±15V, unless otherwise noted.

TOTAL HARMONIC DISTORTION + NOISE
vs OUTPUT VOLTAGE

TOTAL HARMONIC DISTORTION + NOISE
vs FREQUENCY
1

THD + N (%)

VO

G = 100V/V

0.01

See “Distortion Measurements”
for description of test method.
1kΩ

0.01

THD + N (%)

VO =3.5Vrms
1kΩ

0.1

0.1

Measurement BW = 80kHz
See “Distortion Measurements” for description oftest method.

f = 1kHzMeasurement BW = 80kHz
0.001

G = 10V/V
0.001
G = 1V/V
0.0001
20

100

1k

10k

0.0001
0.1

20k

1

10

100

Frequency (Hz)Output Voltage (Vp-p)

OPEN-LOOP GAIN/PHASE vs FREQUENCYINPUT VOLTAGE AND CURRENT NOISE
SPECTRAL DENSITY vs FREQUENCY
1k

1k

0

120

–90

60
40

–135

G
20

100

10

10

–180

0

Current Noise
1

–20
10

100

1k

10k

100k

1M

1

10M

10

100

100

1nA

10

100
Input
Offset Current

1

10

0

25

50

75

100

Input
Bias Current

1nA

100

10

100
Input
Offset Current
10
–15

0.1
125

–10

–5

0

5

Common-Mode Voltage (V)Ambient Temperature (°C)®

OPA2604

Input Bias Current (pA)

1nA

Input Offset Current (pA)

Input
Bias Current

–25

1
1M

1nA

10nA

10nA

100nA

–50

100k

INPUT BIAS AND INPUT OFFSET CURRENTvs INPUT COMMON-MODE VOLTAGE

INPUT BIAS AND INPUT OFFSET CURRENTvs TEMPERATURE

1
–75

10k

Frequency (Hz)Frequency (Hz)

10nA

1k

4

10

1
15

Input Offset Current (pA)

1

Input Bias Current (pA)

100

Voltage Noise

Current Noise (fA/ Hz)φ

Voltage Noise (nV/ Hz)

Voltage Gain (dB)–4580

Phase Shift (Degrees)

100

TYPICAL PERFORMANCE CURVES (CONT)At TA = +25°C, VS = ±15V, unless otherwise noted.

COMMON-MODE REJECTION
vs COMMON-MODE VOLTAGE

INPUT BIAS CURRENT
vs TIME FROM POWER TURN-ON

120

1nA

Common-Mode Rejection (dB)

Input Bias Current (pA)

VS = ±24VDC
VS = ±15VDC

100

VS = ±5VDC

10

1

2

3

4

100

90

80
–15

1
0

110

5

–10

POWER SUPPLY AND COMMON-MODE
REJECTION vs FREQUENCY

0

5

10

15

AOL, PSR, AND CMR vs SUPPLY VOLTAGE
120

120
CMR

100

110

AOL, PSR, CMR (dB)

PSR, CMR (dB)–5Common-Mode Voltage (V)Time After Power Turn-On (min)

80
–PSR

+PSR

60
40

CMR
100
AOL

90

80

20

PSR
0
10

70
100

1k

10k

100k

1M

10M

5

10

15

20

Frequency (Hz)Supply Voltage (±VS)

GAIN-BANDWIDTH AND SLEW RATEvs SUPPLY VOLTAGE

GAIN-BANDWIDTH AND SLEW RATEvs TEMPERATURE

28

25

28

33

30

29

Slew Rate

20

25

16

21

12
5

10

15

20

24

25

20

20
Gain-Bandwidth
G = +100

16

15

12

17
25

–75

–50

–25

0

Slew Rate (V/µs)

Gain-Bandwidth
G = +100

Gain-Bandwidth (MHz)24

Slew Rate (V/µs)

Gain-Bandwidth (MHz)Slew Rate

25

50

75

100

10
125

Temperature (°C)

Supply Voltage (±VS)®

5

OPA2604

TYPICAL PERFORMANCE CURVES (CONT)At TA = +25°C, VS = ±15V, unless otherwise noted.

SETTLING TIME vs CLOSED-LOOP GAIN

CHANNEL SEPARATION vs FREQUENCY

5160
VO = 10V Step
RL = 1kΩ
CL = 50pF

RL = ∞
Channel Separation (dB)

Settling Time (µs)

4

3
0.01%
2
0.1%
1

140
RL = 1kΩ
120

100

0

VO =
20Vp-p
RL

A

B

Measured
Output

80
–1

–10

–100

–1000

10

100

1k

Closed-Loop Gain (V/V)

MAXIMUM OUTPUT VOLTAGE SWING vs FREQUENCY
14

Total for Both Op Amps
Supply Current (mA)

Output Voltage (Vp-p)

VS = ±15V
20

10

0

VS = ±15VDC

12VS = ±24VDC
10

VS = ±5VDC

8

6
10k

100k

1M

10M

–75

Frequency (Hz)Output Voltage (mV)

Output Voltage (V)

+10

FPO
Bleed to edge

0

5

0

25

50

75

+100

–100

0

10

Time (µs)

1µsTime (µs)

15

10
25
®

OPA2604–25

SMALL-SIGNAL TRANSIENT RESPONSE–10Slew Rate (V/µs)

20

–50

Ambient Temperature (°C)

LARGE-SIGNAL TRANSIENT RESPONSE

25

100k

SUPPLY CURRENT vs TEMPERATURE

30

30

10k

Frequency (Hz)

6

2µs

100

125

TYPICAL PERFORMANCE CURVES (CONT)At TA = +25°C, VS = ±15V, unless otherwise noted.

POWER DISSIPATION vs SUPPLY VOLTAGE

SHORT-CIRCUIT CURRENT vs TEMPERATURE

1
Worst case sine
wave RL = 600Ω
(both channels)

0.9Power Dissipation (W)

ISC+ and ISC–
50

40

30

0.8
Typical high-levelmusic RL = 600Ω
(both channels)

0.7
0.6
0.5
0.4

No signal
or no load

0.3
0.2

20

0.1
–75

–50

–25

0

25

50

75

100

125

6

8

10

Ambient Temperature (°C)

12

14

16

18

20

22

24

Supply Voltage, ±VS (V)MAXIMUM POWER DISSIPATION vs TEMPERATURE
1.4

Total Power Dissipation (W)Short-Circuit Current (mA)60

θJ-A = 90°C/W
Soldered to
Circuit Board(see text)

1.2
1.0
0.8
0.6
Maximum
Specified Operating
Temperature
85°C

0.4
0.2
0
0

25

50

75

100

125

150

Ambient Temperature (°C)®

7

OPA2604

APPLICATIONS INFORMATIONThe OPA2604 is unity-gain stable, making it easy to use in awide range of circuitry. Applications with noisy or highimpedance power supply lines may require decoupling capacitors close to the device pins. In most cases 1µF tantalum
capacitors are adequate.

and capacitive load will decrease the phase margin and maylead to gain peaking or oscillations. Load capacitance reacts
with the op amp’s open-loop output resistance to form an
additional pole in the feedback loop. Figure 2 shows various
circuits which preserve phase margin with capacitive load.
Request Application Bulletin AB-028 for details of analysis
techniques and applications circuits.

DISTORTION MEASUREMENTS
The distortion produced by the OPA2604 is below the measurement limit of virtually all commercially available equipment. A special test circuit, however, can be used to extend themeasurement capabilities.

For the unity-gain buffer, Figure 2a, stability is preserved byadding a phase-lead network, RC and CC. Voltage drop across
RC will reduce output voltage swing with heavy loads. An
alternate circuit, Figure 2b, does not limit the output with low
load impedance. It provides a small amount of positive feedback to reduce the net feedback factor. Input impedance of thiscircuit falls at high frequency as op amp gain rolloff reduces
the bootstrap action on the compensation network.

Op amp distortion can be considered an internal error source
which can be referred to the input. Figure 1 shows a circuit
which causes the op amp distortion to be 101 times greaterthan normally produced by the op amp. The addition of R3 to
the otherwise standard non-inverting amplifier configuration
alters the feedback factor or noise gain of the circuit. The
closed-loop gain is unchanged, but the feedback available forerror correction is reduced by a factor of 101. This extends themeasurement limit, including the effects of the signal-source
purity, by a factor of 101. Note that the input signal and load
applied to the op amp are the same as with conventional
feedback without R3.

Figures 2c and 2d show compensation techniques fornoninverting amplifiers. Like the follower circuits, the circuitin Figure 2d eliminates voltage drop due to load current, but
at the penalty of somewhat reduced input impedance at highfrequency.
Figures 2e and 2f show input lead compensation networks forinverting and difference amplifier configurations.
NOISE PERFORMANCEOp amp noise is described by two parameters—noise voltage
and noise current. The voltage noise determines the noise
performance with low source impedance. Low noise bipolarinput op amps such as the OPA27 and OPA37 provide very
low voltage noise. But if source impedance is greater than a
few thousand ohms, the current noise of bipolar-input op amps
react with the source impedance and will dominate. At a few
thousand ohms source impedance and above, the OPA2604
will generally provide lower noise.

Validity of this technique can be verified by duplicating
measurements at high gain and/or high frequency where thedistortion is within the measurement capability of the test
equipment. Measurements for this data sheet were made with
the Audio Precision System One which greatly simplifies
such repetitive measurements. The measurement techniquecan, however, be performed with manual distortion measurement instruments.
CAPACITIVE LOADSThe dynamic characteristics of the OPA2604 have been
optimized for commonly encountered gains, loads and operating conditions. The combination of low closed-loop gain

R1

R2

1

R3

2

VO = 10Vp-p(3.5Vrms)

R2

R3

∞

5kΩ

50Ω

10

101

500Ω

5kΩ

500Ω

100

101

50Ω

5kΩ

∞

Analyzer
Input

Audio Precision
System One
Analyzer*

RL
1kΩ* Measurement BW = 80kHz

FIGURE 1. Distortion Test Circuit.
®

OPA2604

R1

101

1

OPA2604

Generator
OutputSIG. DIST.
GAIN GAIN

8IBM PCorCompatible

(a)

(b)

CC

1

820pF

1

RC

OPA26042

eo

eo

OPA2604
ei

750Ω

CL
5000pFCC
0.47µFCL
5000pF
CC =

2

R2

RC

2kΩ

10Ω

ei

120 X 10–12 CL

RC =
CC =

R2
4CL X 1010 – 1
CL X 103
RC

(c)

(d)

R1

R2

R1

R2

10kΩ

10kΩ
CC

2kΩ

2kΩ

RC
20Ω

24pF
1

CC
0.22µFRC

2

eo

OPA2604
ei

2

eo

ei

25Ω
CL
5000pF

50
CL
R2

CC =

1

OPA2604

RC =

CC =

CL
5000pFR2
2CL X 1010 – (1 + R2/R1)
C L X 103
RC

(e)

(f)
R2

R1

R2

2kΩ

2kΩ

e1
2kΩ
R1
ei

1

2kΩ

RC
20Ω

2

1

eo

OPA2604CC
0.22µFRC
20Ω

CL
5000pFCC
0.22µF

2

eo

OPA2604

R3

R4

2kΩ

2kΩ

CL
5000pFe2
RC =R2
2CL X 1010 – (1 + R2/R1)

RC =
CC =

CL X 103
RC

CC =

R2
2C L X 1010 – (1 + R2/R1)
C L X 103RC

NOTE: Design equations and component values are approximate. User adjustment is required for optimum performance.

FIGURE 2. Driving Large Capacitive Loads.
®

9

OPA2604

Copper leadframe construction used in the OPA2604 improves heat dissipation compared to conventional plastic
packages. To achieve best heat dissipation, solder the device
directly to the circuit board and use wide circuit board traces.

POWER DISSIPATIONThe OPA2604 is capable of driving 600Ω loads with power
supply voltages up to ±24V. Internal power dissipation isincreased when operating at high power supply voltage. The
typical performance curve, Power Dissipation vs Power Supply Voltage, shows quiescent dissipation (no signal or noload) as well as dissipation with a worst case continuous sine
wave. Continuous high-level music signals typically produce
dissipation significantly less than worst case sine waves.

OUTPUT CURRENT LIMIT
Output current is limited by internal circuitry to approximately ±40mA at 25°C. The limit current decreases withincreasing temperature as shown in the typical curves.

R4
22kΩ
C3
R1

R2

100pF

R3

VIN

1

2.7kΩ

22kΩ

10kΩ

C1
3000pF

C2
2000pF

2

VO

OPA2604

fp = 20kHz

FIGURE 3. Three-Pole Low-Pass Filter.

1

R1

R5

2

OPA2604

VIN
6.04kΩ

2kΩ
R2
4.02kΩ

C3
1000pFR2
4.02kΩ

1

Low-pass
3-pole Butterworth
f–3dB = 40kHz

2

OPA2604
1

2

OPA2604

C1
1000pFR4
5.36kΩ
See Application Bulletin AB-026
for information on GIC filters.

C2
1000pF

FIGURE 4. Three-Pole Generalized Immittance Converter (GIC) Low-Pass Filter.

®

OPA2604

10

VO

C1*
I-Out DAC

R1
C2
2200pF

2kΩ
1

R2

R3

2.94kΩ

21kΩ

2

1

2

VO

OPA2604

OPA2604

COUT

C3
470pF
~
* C1 =

COUT

Low-pass
2-pole Butterworth
f–3dB = 20kHz

2π R1 fc

R1 = Feedback resistance = 2kΩ
fc = Crossover frequency = 8MHz

FIGURE 5. DAC I/V Amplifier and Low-Pass Filter.

1

7.87kΩ

10kΩ

2

10kΩ

OPA2604

–
1

VIN

100pF

2

OPA2604

VO
G=1

+
1

7.87kΩ
100kHz Input Filter

2

OPA260410kΩ

10kΩ

FIGURE 6. Differential Amplifier with Low-Pass Filter.

®

11

OPA2604

100Ω

1

COUT

* C1 ≈

10kΩ

Rf = Internal feedback resistance = 1.5kΩ
fc = Crossover frequency = 8MHz

G = 101(40dB)

2

2π Rf fc

10

OPA2604

5
PCM63
20-bit6
D/A
9
Converter

PiezoelectricTransducer
1MΩ*

C1*
1

2

OPA2604* Provides input bias
current return path.

FIGURE 7. High Impedance Amplifier.

FIGURE 8. Digital Audio DAC I-V Amplifier.
1/2 OPA2604

A2
I2
R4

1/2 OPA2604
R3

51Ω

51Ω
A1
VIN

IL = I1 + I2
i1

R2

VOUT

Load

R1
VOUT = VIN (1 + R2/R1)

FIGURE 9. Using the Dual OPA2604 Op Amp to Double the Output Current to a Load.

®

OPA2604

VO = ±3Vp
To low-passfilter.

12

PACKAGE OPTION ADDENDUM
www.ti.com

16-Feb-2009

PACKAGING INFORMATION
Orderable Device

Status (1)Package
Type

Package
Drawing

Pins Package Eco Plan (2)Qty

OPA2604AP

ACTIVE

PDIP

P

8

50

Green (RoHS &no Sb/Br)CU NIPDAU

N / A for Pkg TypeOPA2604APG4ACTIVE

PDIP

P

8

50

Green (RoHS &no Sb/Br)CU NIPDAU

N / A for Pkg TypeOPA2604AU

ACTIVE

SOIC

D

8

75

Green (RoHS &no Sb/Br)CU NIPDAU

Level-3-260C-168 HR

OPA2604AU/2K5

ACTIVE

SOIC

D

82500 Green (RoHS &no Sb/Br)CU NIPDAU

Level-3-260C-168 HR

OPA2604AU/2K5E4ACTIVE

SOIC

D

82500 Green (RoHS &no Sb/Br)CU NIPDAU

Level-3-260C-168 HR

OPA2604AUE4

ACTIVE

SOIC

D

8

75

Green (RoHS &no Sb/Br)CU NIPDAU

Level-3-260C-168 HR

OPA2604AUG4ACTIVE

SOIC

D

8

75

Green (RoHS &no Sb/Br)CU NIPDAU

Level-3-260C-168 HR

Lead/Ball Finish

MSL Peak Temp (3)(1)

The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be solderedat high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die andpackage, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHScompatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it isprovided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to theaccuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to takereasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF OPA2604 :• Automotive: OPA2604-Q1
NOTE: Qualified Version Definitions:• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

Addendum-Page 1

PACKAGE MATERIALS INFORMATION
www.ti.com

11-Mar-2008

TAPE AND REEL INFORMATION*All dimensions are nominal

Device

OPA2604AU/2K5

Package Package Pins
Type Drawing
SOIC

D

8

SPQ

Reel
Reel
Diameter Width(mm) W1 (mm)

2500

330.0

12.4

Pack Materials-Page 1

A0 (mm)

B0 (mm)

K0 (mm)

P1
(mm)

W
Pin1
(mm) Quadrant

6.4

5.2

2.1

8.0

12.0

Q1

PACKAGE MATERIALS INFORMATION
www.ti.com

11-Mar-2008*All dimensions are nominal

DevicePackage Type

Package Drawing

Pins

SPQ

Length (mm)Width (mm)Height (mm)OPA2604AU/2K5

SOIC

D

8

2500

346.0

346.0

29.0

Pack Materials-Page 2

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