Application Note

Assembly Precautions
for the Nichia E11 Series LEDs
Table of contents
1. LED Outline Dimensions/Tape Dimensions ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 2
2. Handling Precautions

・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 3

3. Design Recommendations for Optimal Amount of Solder ・ ・ ・ ・ ・ 4
4. Precautions for solder joint

・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 5

5. Precautions for Setting Up a Pick-and-Place Machine/Nozzle ・ ・ ・ 6-9
6. Precautions When Reflow Soldering ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 9
7. Evaluation of the Effect of Solder Volume

・ ・ ・ ・ ・ ・ ・ ・ ・ 10-11

8. Evaluation of Self-Alignment Performance ・ ・ ・ ・ ・ ・ ・ ・ ・ 12-13
The part number NFSWE11A in this document is the part number of our product, and does not have any relevanceor similarity to other companies' products that may have trademark rights.
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia E11 Series LEDs

1. LED Outline Dimensions/Tape Dimensions
Table 1. Product Specifications

Part Number

NFSWE11A
0.9

1.1

0.25

0.9

1.1

光学的中心位置
Location of the optical center(0.09)

LED

Color Rank

CRI rank

H

R8000

0.3

R9050

0.35

R8000

0.27

R9050

0.3

2700K-4000K

Cathode

Anode

H

sm50x

Cathode2±0.05(0.02 クロスバー凹部)(0.02 Crossbar Recess)

Reel Size: 14,000 LEDs

0.2±0.05

1.26 ±0.1

2±0.058±0.1

Embossed
Carrier
Tape

4±0.1

3.5±0.05

Φ1.5+0.1-01.75 ±0.1[unit: mm, Tolerance: ±0.1mm]

0.46±0.1
Φ0.5±0.05

1.26 ±0.1[unit: mm]

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia E11 Series LEDs

2. Handling Precautions
Handling with bare hands
Do not handle the LEDs with bare hands:- this may contaminate the LED surface and have an effect on the optical characteristics,- this may cause the LED to deform and/or the wire to break causing a catastrophic failure (i.e. the LED
not to illuminate),- the lead frame may cause injuries when the LED is handled with bare hands.

Incorrect

Handling with tweezers
Do not handle the LEDs with tweezers.
- this may cause the LED to deform and/or the wire to break causing a catastrophic failure (i.e. the LED
not to illuminate),
ESD Precautions
LEDs are sensitive to transient excessive voltages (e.g. ESD, lightning surge). If this excessive voltage
occurs in the circuit, it may cause the LED to be damaged causing issues (e.g. the LED to have a reductionin the radiant flux or not to illuminate [i.e. catastrophic failure]). When handling the LEDs, ensure thatnecessary measures have been taken to protect them from transient excess voltages. Refer to theapplicable specification for more details.
Stacking assembled PCBs together
Do not stack assembled PCBs together. Otherwise, it may cause damage to the resin (e.g. cut, scratch,chip, crack, delamination and deformation) and the internal connection to fail causing a catastrophic
failure (i.e. the LED not to illuminate).
Baking
The storage/packaging requirements for the Nichia E11 Series LEDs are comparable to JEDEC MoistureSensitivity Level (MSL) 2a or equivalent. Nichia used IPC/JEDEC STD-020 as a reference to rate the MSL ofthis LED. Since baking is not guaranteed for the Nichia E11 Series LEDs, once the moisture-proof
aluminum bag is opened ensure that soldering is completed within the storage times detailed in theapplicable specification.

Incorrect

Figure 1. Example of Improper
handling

Table 2. Storage/Baking Conditions
Conditions
Storage

Temperature

HumidityTime

Before Opening Aluminum Bag≤ 30°C≤ 90% RH

Within 1 Year from Delivery Date

After Opening Aluminum Bag≤ 30°C≤ 70% RH

≤ 4 weeksThis document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia E11 Series LEDs

3. Design Recommendations for Optimal Amount of Solder
Soldering Pad Pattern/Metal Solder Stencil Aperture

Table 3. Recommended Soldering Pad Pattern/Metal Solder Stencil Aperture
Soldering Pad Pattern

Item

Recommended
Condition

Solder Stencil
Thickness

100 [μm]

Solder Paste

Sn-3.0Ag-0.5Cu

Stencil Aperture

1

0.65

0.81

0.9
CathodeTable 4. Recommended Solder/Metal Solder Stencil Conditions

0.25

Cathode[unit：mm]⋯ LED outline■ Soldering Pad Pattern■ Stencil Aperture

0.35[unit：mm]NG

NG• When considering a pad pattern other than the recommended one
above, do not change the pad pattern gap distance of 0.25 mm.
Poor solder joints may affect reliability and performance.
>0.25

<0.25

Figure 2. Non-recommended Pad PatternThis document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia E11 Series LEDs

4. Precautions for solder joint
4-1. Electrode and Heat-dissipation

The electrodes are expanded for the purpose of improving mounting performance.
The electrodes need to be securely soldered to the copper pattern. Poor solder joint on the electrodes may negative impact
reliability. Make sure the considerable area of electrodes are soldered to the copper pattern for best performance.

✔ Correct

Electrode

Incorrect：heat-dissipating path

LED chipElectrode
SolderCopper pattern
PCB

Figure 3. Electrode appearance

Figure 4. Heat dissipation by soldering

4-2. Solder Joint Ratio
Solder joint area of 75% or more of the electrode area is recommended.
Soldering conditions is evaluated by X-ray inspection.
Solder Joint Ratio [%] = Solder Joint Area1 / Electrode Area
No soldering defects that affect performance and reliability were detected under Nichia’s
recommended conditions.
Although, make sure the soldering area is sufficient under the customer’s mounting conditions.

：Electrodes：Soldering Area
：Solder Voids

Figure 5. Example X-ray image

Note:
1 Solder joint area does not include solder void area.

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia E11 Series LEDs

5. Precautions for Setting Up a Pick-and-Place Machine/Nozzle
Table 5. Cautions/Suggestions for setting up equipment

Item

Recommended Conditions/Specifications

Cautions/Suggestions

Pick-and-place machine2

Modular mounter

Pick-and-place nozzle

Smaller than the LED(1.1mm×1.1mm)

See “Pick-and-Place Nozzle” on
Page 7 for the details.

Tape-and-reel feeder

Electrical (motorized) feeder
Tape width: 8mm
Feed length: 2mm

See “Tape-and-Reel Feeder” onPage 7 for the details.

Nozzle height for pick-up
operations

Edge of the embossed carrier tape pocket.

See “Recommended Nozzle Heightfor Pick-up Operations” on Page 8
for the details.

Nozzle height for placement
operations (i.e. placement depth)

0.2mm for placement depth

See “Recommended Nozzle Heightfor Placement Operations(Placement Depth)” on Page 8 forthe details.

Imaging-based Automatic
Inspection

Using the electrode as a reference is recommended tolocate the center of the LED.

See "Imaging-based Automatic
Inspection" on Page 9 for thedetails.

Note:
2 The recommended conditions/specifications above have been determined under the following verification conditions:
Pick-and-place machine (modular mounter):- YS100 High-Speed General-Purpose Modular (manufactured by Yamaha Motor Co., Ltd.)This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia E11 Series LEDs
5-1. Pick-and-Place Nozzle
Correct

Incorrect

Incorrect• Use a nozzle that is smaller than the product's outline dimensions(1.1 mm x 1.1 mm) and pick it up via the top surface.
• When using the nozzle that is larger than the outline dimensions
or if the pick-up position is displaced, the product may bechipped or tilted during pick-up.

Figure 6. Example of Nozzle Dimensions

5-2. Tape-and-Reel Feeder
Top cover tape

Pick-and-place nozzle

Feeder cover• Recommended setting for the tape-and-reel feeder.
Tape width: 8mm
Feed length: 2mm• Use a tape-and-reel feeder that ensures it does not create
excessive vibrations causing assembly issues. Example: Electrical(motorized) feeder• If the LED position within the tape pocket is not stable when the
pick-up occurs, slow down the tape-and-reel feeder speed.

Correct
Tape removal
position

Incorrect
Feed direction of the Carrier tape ⇒Figure 7. Examples of Top Cover Tape Removal Positions• The recommended top cover tape removal position is one LED
away from the target LED. (See the Figure 7)- If the top cover tape is removed just before suction occurs,
the operation may not be stable due to the vibration resulting
from the tape removal However, depending on the machine,
it may be more stable to remove just before suction occurs,
this should be checked and the proper removal position
verified prior to beginning production.
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Assembly Precautions for the Nichia E11 Series LEDs
5-3. Recommended Nozzle Height for
Pick-up Operations•

Ensure that the nozzle only goes down to the top edge of the tape pocket
and does not directly come into contact with the LED.
Note: The reference level for the nozzle setting is at the top edge of thetape pocket.

•
NozzleNozzle position

The recommended nozzle height for pick-up operations has been
determined by Nichia under the verification conditions and may not
function as expected with some other pick-and-place machines. If the pickup operations are unstable even with using the recommended nozzle
height, adjust the nozzle height appropriate for the pick-and-place machine
being used.
If the pick point of the nozzle is too high,-it may cause insufficient suction power leading to picking errors (e.g. thenozzle’s failure to pick/lift the LED into the air, incorrect picking causing
the LED to tilt when in the air).

Embossed carrier tape

If the pick point of the nozzle is too low,

Figure 8. Recommended Nozzle Height for Pick-up Operations-it may cause issues (e.g. causing the embossed carrier tape to shake,causing the tape pocket to deform) leading to picking failure and/or
damage to the LED.

5-4. Recommended Nozzle Height forPlacement Operations (Placement Depth)•
NozzleAfter the LED is mounted onto solder paste on the PCB, the nozzle should
further press the LED 0.2mm into the PCB.
If the release point of the nozzle is too high,-it may cause placement issues (e.g. the LED to stick to the nozzle after
placement, the LED to become soldered to the PCB in a tilted position,etc.).

Press
0.2 mm

If the release point of the nozzle is too low,
-excessive forces may be applied to the LED during placement and it may
cause the LED to become damaged.

Board

Figure 9. Recommended Nozzle Height for Placement (Placement Depth)
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia E11 Series LEDs
5-5. Imaging-based Automatic Inspection
Electrode Location
Detection/
Recognition Points

OutlineRecognition
Area

Polarity Detection/
Recognition Point

Figure 10. Recommended reference points to detect, recognize,
or locate the polarity/electrodes

6. Precautions When Reflow
Soldering
1 to 5°C per sec
Pre-heat
180 to 200°C

120sec Max

Figure 11. Recommended Reflow Soldering
Condition (Lead-free Solder)

Nichia recommends using the electrodes as a reference to locate the center ofthe LED.

•

If the imaging device has trouble detecting/recognizing the electrodes due tothe uniqueness of the electrode pattern, adjust it to detect/recognize the outerportions of the electrodes (i.e. the areas circled in red in Figure 10 to the left).

•If an automatic polarity detector is used for the LEDs, set up the imaging device
to detect the empty space between the anode and cathode electrodes (i.e.
Polarity Detection/Recognition Point in Figure 10 to the left). In the example in
Figure 5, the equipment measures the brightness of the empty space against
the threshold to locate the electrodes and/or determine the polarity.

•

If it is still difficult to recognize the electrodes, it is possible to instead use theoutline of the product (i.e. the area noted in yellow Figure 10 to the left) as thedetection/recognition area. The issue with using this option is that it may not
be possible to determine the polarity.

•

Reflow soldering must not be performed more than twice.

•

Using the recommended reflow soldering conditions (See Figure 11 to the left) as areference, modify if necessary, the recommended reflow conditions specified by the
manufacturer of the solder paste being used.

260°CMax
10sec Max

60sec Max
Above 220°C

•

Note:
To ensure that these reflow conditions have no negative effect on the LEDs, perform
sufficient verification prior to use.
•

When cooling the LEDs from the peak temperature a gradual cooling slope isrecommended; do not cool the LEDs rapidly.

•

During reflow soldering, the heat and atmosphere in the reflow oven may cause theoptical characteristics to degrade. In particular, reflow soldering performed with an air
atmosphere may have a greater negative effect on the optical characteristics than if anitrogen atmosphere is used; Nichia recommends using a nitrogen reflow atmosphere.

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia E11 Series LEDs

7. Evaluation of the Effect of Solder Volume
7-1. Evaluation Method/Conditions
The effect of solder volume on the workmanship of the reflow-soldered LEDs was evaluated using nine different
evaluation configurations (i.e. three aperture ratios, three thicknesses) to control the amount of solder paste.
Table 6. Evaluation stencil configurations
Aperture
ratio

52％

43％

0.61

100μm

0.81

(Nichia’s
Recommendation)

0.82

120μm

0.36

-

⊿x

+

[unit: mm]

Sample size: 160 LEDs for each condition

0.1

0.1

0.05

0.05
⊿y [mm]⊿x [mm]-0.32[unit: mm]

7-2. Evaluation Results (x,y direction)⊿yAperture Ratio＝Stencil Aperture Area/Electrode Area

0.35

[unit: mm]

+

0
-0.05

(Reference position)● Average－Average±3σ

0
-0.05

-0.1

-0.1

＋：Center of the pad pattern--- LED Outline and Electrodes■ Soldering Pad Pattern■ Solder Stencil Aperture

0.72

0.78

80μm

62％

(Nichia’s Recommendation)

0.65

Thickness

43%

52%
80μm

62%

43%

52%
100μm

62%

43%

52%

62%

120μm

43%

52%

80μm

62%

43%

52%

100μm

62%

43%

52%

62%

120μm

Stencil Configurations (Aperture, thickness)

Stencil Configurations (Aperture, thickness)

Figure 12. Evaluation Result (Δx,y)•

The variation from the reference position increased as the amount of solder paste increased.
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Assembly Precautions for the Nichia E11 Series LEDs
7-3. Evaluation Results (Rotation)
4.0
2.0⊿θ [°]+⊿θ-● Average

0.0－Average±3σ

-2.0
-4.0

＋：Center of the pad pattern

43%(Reference position)

52%

62%

80μm

43%

52%

62%

43%

100μm

52%

62%

120μm

Stencil Configurations (Aperture, thickness)

Figure 13. Evaluation Result (Δθ)
The variation from the reference angle decreased as the amount of solder paste increased.

•

7-4. Evaluation Results (z direction)
0.15

0.15
0.1
[mm]
Δz⊿z(y方向)(y direction)[mm][mm]Δz ⊿z(x方向)(x direction)[mm]

0.1
0.05

0
-0.05
-0.1

0.05
0

● Average－Average±3σ

-0.05
-0.1

-0.15

-0.15

43%

52%
80μm

62%

43%

52%

62%

43%

100μm

52%

62%

43%

120μm

52%

62%

80μm

Stencil Configurations (Aperture, thickness)

43%

52%

62%

43%

52%

100μm

62%

120μm

Stencil Configurations (Aperture, thickness)

Figure 14. Evaluation Result (Δz)•

x direction: There is almost no difference depending on the amount of solder paste.

•

y direction: The amount of LED tilt increased as the amount of solder paste increased.

y direction⊿z

x direction

View in the x direction

Figure 15. Evaluation direction
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia E11 Series LEDs

8. Evaluation of Self-Alignment Performance
8-1. Evaluation Method/Conditions
The self-alignment performance of the reflow-soldered LEDs was evaluated using the evaluation conditions shown in Table 6.
Sample size: 16 LEDs for each condition

8-2. Evaluation Results (Parallel misalignment)
Parallel Deviation Condition
Δx,y =0.1mm

0.1

80μm

0.1

Aperture
43%開口
〇 43%
52%開口
〇 52%
〇
62%
62%開口

0.05

100μm

0.1

Aperture
43%開口
〇 43%
52%開口
〇 52%
〇
62%
62%開口

0.05

120μm

Aperture
43%開口
〇 43%
52%開口
〇 52%
〇
62%
62%開口

0.05

-0.1mm-0.1-0.1＋：Center of the pad pattern

-0.05

0

0.05

80μm

y[mm]

0.1

0

-0.1
-0.1

100μm

-0.1
-0.1

0.1

-0.05

0

0.05

0.1

x[mm]

0.1

Aperture
43%開口
〇 43%
52%開口
〇 52%
〇
62%
62%開口

0.05

-0.05

(Reference position)

0.05

x[mm]

Aperture
43%開口
〇 43%
52%開口
〇 52%
〇
62%
62%開口

0.05

＋：Center of the pad pattern

0

0

-0.05

-0.05

0

0.05

0.1

-0.1
-0.1

120μm

Aperture
43%開口
〇 43%
52%開口
〇 52%
〇
62%
62%開口

0.05
y[mm]

0.1

-0.2mmK-0.05

Figure 16. Evaluation Result (Δx,y=0.1mm)

Parallel Deviation Condition
Δx,y =0.2mm

A

-0.1
-0.1

0.1

0

-0.05

x[mm]

(Reference position)-0.2mm

0

-0.05

-0.05

K

y[mm]

0

y[mm]

A

y[mm]

y[mm]

-0.1mm

0

-0.05

-0.05

x[mm]

0
x[mm]

0.05

0.1

-0.1
-0.1

-0.05

0

0.05

0.1

x[mm]

Figure 17. Evaluation Result (Δx,y=0.2mm)• Almost all the LEDs moved back to the reference position by themselves during soldering, there are no issues
with the self-alignment performance.
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8-3. Evaluation Results (Angular misalignment)

θ=+5°

θ[°]

Angular Deviation ConditionΔθ =5°＋：Center of the pad pattern

5
4
3
2
1
0
-1
-2
-3
-4
-5

θ[°]

5
4
3
2
1
0
-1
-2
-3
-4
-5

＋：Center of the pad pattern•

Aperture
〇 43%
〇 52%
〇 62%

80μm

100μm

120μm

Figure 19. Evaluation Result (Δθ=10°)θ[°]Angular Deviation ConditionΔθ =30°(Reference position)

120μm

Thickness
マスク厚(Reference position)＋：Center of the pad pattern

100μm

Figure 18. Evaluation Result (Δθ=5°)

Angular Deviation ConditionΔθ =10°θ=+30°

80μm

Thickness
マスク厚(Reference position)θ=+10°

Aperture
〇 43%
〇 52%
〇 62%

5
4
3
2
1
0
-1
-2
-3
-4
-5

Aperture
〇 43%
〇 52%
〇 62%

80μm

100μm

120μm

Thickness
マスク厚

Figure 20. Evaluation Result (Δθ=30°)

Almost all the LEDs moved back to the reference angle by themselves during soldering, there are no issues
with the self-alignment performance.

This document contains tentative information, Nichia may change the contents without notice.

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Disclaimer
This application note is a controlled document of Nichia Corporation (Nichia) published to provide technical information/data forreference purposes only. By using this application note, the user agrees to the following:• This application note has been prepared solely for reference on the subject matters incorporated within it and Nichia makes noguarantee that customers will see the same results for their chosen application.
• The information/data contained herein are only typical examples of performances and/or applications for the product. Nichia
does not provide any guarantees or grant any license under or immunity from any intellectual property rights or other rights
held by Nichia or third parties.
• Nichia makes no representation or warranty, express or implied, as to the accuracy, completeness or usefulness of any
information contained herein. In addition, Nichia shall not be liable for any damages or losses arising out of exploiting, using,or downloading or otherwise this document, or any other acts associated with this document.
• The content of this application note may be changed without any prior or subsequent notice.
• Copyrights and all other rights regarding the content of this document are reserved by Nichia or the right holders who havepermitted Nichia to use the content. Without prior written consent of Nichia, republication, reproduction, and/or redistributionof the content of this document in any form or by any means, whether in whole or in part, including modifications or derivative
works hereof, is strictly prohibited.

491 Oka, Kaminaka-Cho, Anan-Shi,
TOKUSHIMA 774-8601, JAPAN
Phone: +81-884-22-2311 Fax: +81-884-21-0148

NICHIA CORPORATION
http://www.nichia.co.jp

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