EV GROUP® | Products//Bonding//EVG®500 Series

Permanent Bonding Systems

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EV GROUP® | Products // Bonding // Permanent Bonding Systems // EVG®500 Series

Introduction
Aligned wafer bonding is an enabling technology for wafer level capping, wafer levelpackaging, the manufacture of engineered substrates, 3D integration at the wafer level andwafer thinning. In turn, these processes have enabled the amazing growth of MEMS devices,
RF filters, and BSI (back side illuminated) CIS (CMOS Image Sensors). Also these processes
have enabled the manufacture of engineered substrates such as SOI (Silicon on Insulator).
The mainstream bonding processes are: adhesive, anodic, direct / fusion, glass frit, solder(including eutectic and transient liquid phase) and metal diffusion / thermocompression.
Which bonding process is appropriate will depend on the application. The EVG500 series canbe configured to perform all of these processes.
EVG has over 25 years of experience building wafers bonders, has a combined 2,000 man
years of wafer bonding experience, and the GEMINI is the industry standard for HVM usingwafer bonding.
The EVG500 series can be tooled for single die and wafers from 50 mm to 300 mm dependingon the model and heater size. The flexibility of these tools is ideal for R&D through medium
volume production, with a simple path to high volume production, due to bonding recipes
wich can be transferred to an EVG GEMINI high-volume production system.

Bond Chamber
The bond chamber is equipped with a universal bond cover that allows fast evacuation andrapid heating and cooling. Control of temperature, force, time and atmosphere allow mostbonding processes to be performed. Anodic bonding can be performed with the additionof a power supply. For UV cured adhesives an optional bond chamber lid has a UV source.
Bonding can be performed under vacuum or controlled atmosphere conditions. Independent
temperature control of the top and bottom wafer compensates for different thermal expansion
coefficients, resulting in stress-free bonding and excellent temperature uniformity. SOI/SDB
pre-bonding under vacuum can be performed without hardware reconfiguration.

Bond Chucks
The bond chucks carry the aligned wafer stacks from the aligner to perform the subsequentbonding procedure. Various wafer sizes and bond applications can be handled with adedicated chuck that fits into each universal bond chamber.

Bonding
EVG®501 / EVG®510 / EVG®520 IS Bonders for R&D
Wafer Bonding

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AnodicAdhesiveEutectic
Transient liquid phase
Thermo-compression

Features

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Substrates up to 200 mm
Forces up to 100 kN
Temperatures up to 550°C
Vacuum down to 1·10-6 mbar
Other options: anodic, UV curing, 650°C heaters

Process Services
Wafer processing services on any EVG equipment, including special processes such as

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Plasma activated direct bondingComBond® - conductive bonding of Si and compound semiconductors
High-vacuum aligned bonding
Temporary bonding and thermal, mechanical or laser debonding
Hybrid bonding
Adhesive bonding
Collective D2W bondingEVG®501 Wafer Bonding System■■■■■

Optimum total cost of ownership (TCO) for R&D and pilot line production■■■

Open chamber design for fast conversion and maintenanceReal and low-force wafer wedge compensation system for highest yield
Unmatched pressure and temperature uniformity
Automated bond process execution and data logging
High-vacuum capable bond chamber(down to 10-5 mbar with turbo molecular pump)
Windows® based control software and operation interface
Smallest footprint for a 200 mm bonding system: 0.88 m2

EVG®510 Wafer Bonding System

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All of the features of the EVG®501
Single chamber system for up to 150 mm and 200 mm wafers
Lowest cost-of-ownership for R&D and pilot-line production
Unmatched pressure and temperature uniformity
High yield through automatic wedge compensation
Recipe compatible to EVG HVM bonding systems
High throughput with fast heating and pumping specifications

EVG®520 IS Wafer Bonding System

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All of the features of the EVG®501 and EVG®510
Single or double chamber automated system up to 200 mm
Automated bond process execution and bond cover movements
Integrated cooling station for high throughput

EVG®540 Automated Wafer Bonding System■■■■

Single chamber bonder up to 300 mm
Automatic handling of up to four bond chucks
Modular bond chamber design
Active bottom side cooling

EVG®560 Automated Wafer Bonding System■■■■

Up to four bond chambers for various bonding processes■

Station layout accepts a wide range of equipment configurations
for all bonding processes

Automatic loading and unloading of bond chambers and cooling station
Remote online diagnostics
Automated robotic handling system for automated cassette-to-cassette wafer
bonding with mechanical alignment

EVG® GEMINI® Automated Production Wafer Bonding System
Leveraging highest-accuracy EVG SmartView NT technology, the top of the line
GEMINI high-volume production system combines automated optical alignmentand bonding operations at a minimum footprint area.
Please refer to our GEMINI brochure for further details.

Wafer Bonding Processes on EVG Wafer Bonders
The complete support of the full range of wafer bonding processes is essential for today’s
and tomorrow’s device manufacturing requirements. A general classification of bonding
processes is done in terms of bonding with or without interlayer. While for interlayer freebonding the material and surface properties facilitate bonding, for bonding with interlayer
the deposition and composition of the bond material determine the properties of the bondline.
Plasma ActivatedBonding
Molecular Bonding
ComBond®
Covalent Bonding

Direct Bonding
Anodic Bonding

Wafer Bonding

Metal Bonding

Metal
Thermocompression
Bonding
Eutectic / SolderBonding
Transient Liquid
Phase Bonding

Bonding withInterlayers

Glass Frit Bonding
UV-CuredPolymerAdhesive Bonding

Thermally Cured
Polymer

Software and Support
The Windows-based, graphical user interface is designed with a strong focus on userfriendliness, and easily navigates the operator through each process step. Multi-language
support, individual user account settings and integrated error logging / reporting andrecovery can simplify the user’s daily operation. All EVG systems can also communicate
remotely. Thus, our service includes field-proven, real-time remote diagnostics andtroubleshooting via secured connection, phone or email. EVG’s experienced processengineers are readyEVG
to support Process
you anytime thanks toour de-centralized worldwide support
Expertise
structure, including cleanroom space on three different continents:
Europe (HQ), Asia (Japan) andNorth America (USA).
...etc.
CVD,
LPCVD,
PVD,...

ResistCoating
Spin/Spray

Wafer &Template
Fabrication
Substrate
Cleaning
Substrate
Bondingfor SOI

Maskless
Exposure

RIE,
DRIE
Nanoimprint
Lithography

ResistDeveloping

Metallization

Wafer
DicingThinning,
CMP

Wafer
Bonding
Metrology

ResistLift-Off

PlasmaActivation

EVG Processes

Electroplating
Wet
Etching

Proximity
Lithography
Alignment
Verification

BondAlignment

Temporary
Bonding/Debonding

StressRelief
Etching

Chip-toWafer
Bonding

Oxidation
Wafer
Bumping &Redistribution

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EV GROUP® | Products//

Bonding//

Permanent Bonding Systems//

EVG®500 Series

Process Results
Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding
systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications bybonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods
including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bondchamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.

1 mm

Coriolis effect sensor combining MEMS and microfluidics
Courtesy of ISSYSMEMS gyroscope
Courtesy of Robert Bosch GmbH

1 µm thick resist with a resolution below 5 µm
with a large proximity gap of 50 µm exposed onEVG® IQ Aligner®, REO setup Source: EVG

100 µmZiptronix direct bond interface
Courtesy of Ziptronix

Metal/Adhesive via-first 3D bonding interface
Courtesy of RPI

Glass-frit bond interface
Courtesy of ST Microelectronics

Modular DesignThe huge variety of bond alignment system configurations provide multiple advantages for various MEMS and IC applications.
A large number of different alignment techniques can be supported by either using direct (live) or indirect alignment methods.

Wafer to Wafer Bond Alignment
OpticalMechanicalFace-to-Face(Front-to-front)
Transparent

Transparent

InfraredOpaqueBackside(Front-to-back)Different
substrate size

Samesubstrate size

SmartView®

Opaque-IR

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EVG makes no representation that the use or implementation of the information contained in this document will not infringe or violate any copyright, patent, trademark, trade secret or other right.
In no event shall EVG be liable for any claim, damages or other liability, including any general, special, indirect, incidental, or consequential damages, whether in an action of contract, tort infringement,
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Acceptance and/or any use of the information contained in this document shall be deemed consent to, and acceptance of, this disclaimer.
Data, design and specifications may not simultaneously apply; or may depend on individual equipment configuration, process conditions and materials and vary accordingly. EVG reserves the right to change data,
design and specifications without prior notice.
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