EV GROUP®

Product Range

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About EVG
EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture ofsemiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices.
A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology,
EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment,
photoresist coaters, as well as cleaning and inspection/metrology systems.
With state-of-the-art application labs and cleanrooms at its headquarters in Austria, as well as in North America and Asia, EVG
is focused on delivering superior process expertise to its global R&D and production customer and partner base – from theinitial development through to the final integration at the customer’s site.
Founded in 1980, EVG services and supports an elaborate network of global customers and partners all over the world, withmore than 1300 employees worldwide and fully owned subsidiaries in the U.S., Japan, South Korea, China and Taiwan.

Vision/Mission
invent – innovate – implement
Our Triple-i philosophy is reflected in the enthusiasm for technology, innovative
strength and internationality of the entire company. Our vison of “being the first in
exploring new techniques and serving next-generation applications of micro- andnanofabrication technologies” enables our customers to successfully commercialize
their new product ideas.

Core Technologies
True to our Triple-i philosophy of“Invent”, “Innovate” and “Implement”,
our core lithography, wafer bonding
and metrology technologies enable
manufacturers to develop the latest
micro- and nanotechnology device
breakthroughs, and then bring theminto high-volume production, costeffectively and at high process yields.

MLE™ Maskless Exposure
Technology

Nanoimprint Lithography (NIL) SmartNIL®

Moving beyond traditional maskbased lithoghraphy toward digital
lithography technology

A large-area soft UV-nanoimprint
lithography process for high-volume
manufacturing

Wafer-Level Optics (WLO)

Optical Lithography

Resist Processing

Market-leading WLO manufacturing
portfolio, including step-and-repeat
mastering, lens molding, nanoimprint
lithography and stacking

Most complete technology portfolio,
supporting a maximum range ofrequirements in optical lithography

Resistprocessing
technology
together with patterning are the most
repeated steps in semiconductor
manufacturingTemporary Bonding & Debonding

Eutectic Bonding

Temporary bonding and debonding
enabling backside processing for
3D integration

Eutectic wafer bonding for reliable
hermetic sealing

Transient Liquid Phase (TLP)
Bonding

Anodic Bonding

Metal Diffusion Bonding

Fusion and Hybrid Bonding

Anodic bonding for interlayer-freeSi-glass bonding

Metal diffusion bonding for precise
interfaces and alignment

For engineered substrates and 3D
device integration

Die-to-Wafer Fusion and Hybrid
Bonding

ComBond®

Metrology

High vacuum wafer bonding
technology

Process control and optimization for
lithography and bonding

Collective and direct-placement
die-to-wafer bonding

Low-temperature
metal
wafer
bonding by Transient Liquid Phase

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Wafer Bonding
With extensive experience in designing and manufacturing precision wafer bonding
equipment, EVG is well recognized for setting industry standards in wafer bonding.
EVG wafer bonding systems can be configured for R&D, pilot-line or high-volume
production, and for any direct or interlayer-based bonding process, including
sophisticated low-temperature covalent bonding. With this portfolio of technologies
and equipment, EVG addresses markets for advanced packaging and 3D integration,
MEMS, as well as advanced compound semiconductor and SOI substrates, holding
the leading position and dominant market share.
Permanent Bonding Systems
The introduction of EVG’s wafer-bonding approach, which separates the bond alignment
from the bonding step, immediately revolutionized the market. Utilizing high-contact forces
under elevated temperatures and a controlled atmosphere, this approach is today’s process
standard, with EVG holding the dominant market share for both semi- and fully automatedwafer bonders and an installed base of more than 1500 chambers. EVG’s wafer bonders offer
optimal total cost of ownership and bonding yield. Industry-leading alignment accuraciesof less than 100 nm and a high-volume-proven modular platform enable the combinationof EVG’s wafer bonding technologies for MEMS, 3D integration and advanced packaging
applications.
Temporary Bonding and Debonding Systems
Temporary bonding is an essential process to offer mechanical support for thin or to-be-thinned
wafers, important for 3D ICs, power devices and FoWLP wafers, as well as for handling fragile
substrates like compound semiconductors. A device wafer is bonded to a carrier wafer withthe help of an intermediate temporary bonding adhesive, allowing the typically fragile device
wafer to be processed with additional mechanical support. After the critical processes, thewafer stack is debonded. EVG’s outstanding bonding know-how is reflected in its temporary
bonding equipment, which has been provided by the company since 2001.
Bond Alignment Systems
With the invention of the world’s first double-sided alignment system in 1985, EV Grouprevolutionized MEMS technology and set worldwide industry standards in aligned wafer
bonding by separating the alignment and bonding process. This separation results in higher
flexibility and universal application of the wafer bonding equipment. EVG’s bond alignment
systems offer the highest precision, flexibility and ease of use, and modular upgrade capability,and have been qualified in numerous high-throughput production environments. The precisionof EVG bond aligners accommodates the most demanding alignment processes.
Fusion and Hybrid Bonding Systems
Fusion or direct wafer bonding enables permanent connection via dielectric layers on eachwafer surface used for engineered substrates or layer transfer applications such as backside
illuminated CMOS image sensors. Hybrid bonding extends fusion bonding with embedded
metal pads in the bond interface, allowing face-to-face connection of wafers. The main
application for wafer-to-wafer (W2W) and die-to-wafer fusion and hybrid bonding is advanced
3D device stacking and heterogeneous integration.

Metrology
Metrology is essential to control, optimize and ensure the highest yield in semiconductor
manufacturing processes. By implementing feedback loops, both process control andprocess parameter correction are enabled, which allow compliance to tighter process
requirements.
EVG’s metrology solutions are optimized for lithography and all types of bonding applications,and use non-destructive measurement methods. Customers can choose between integrationof the metrology technology within fully automated process equipment, or stand-alone
metrology systems serving multiple process steps.

Lithography
EVG’s key competencies in lithographic technology lie in the high-throughput contact
and proximity exposure capabilities of its mask aligners and its newly developed,
revolutionary and highly versatile LITHOSCALE® maskless exposure lithographysystems. These capabilities are complemented by its resist coating and resist
development systems with advanced in-house process competences and hands-on
development skills. Most of EVG’s lithography equipment platforms are 300-mm ready,can be fully integrated into EVG’s HERCULES® lithography track systems, and arecomplemented by its metrology tools for top-to-bottom-side alignment verification.
EVG constantly looks ahead to future market trends and thus provides applicationspecific solutions, particularly in advanced packaging, MEMS, compound
semiconductors, photonics and biomedical markets where EVG’s process andmaterials expertise – derived from extensive research with a wide range of resist
materials – is unsurpassed. Understanding customer needs and providing efficientworldwide support are important ingredients in the success of EVG’s lithography
solutions.
Mask Alignment Systems
Accommodating wafers and substrates up to 300 mm, varying in size, shape and thickness,
EVG’s mask alignment systems aim to provide sophisticated solutions with a high grade ofautomation for advanced applications and full flexibility for research and development.
Maskless Exposure Lithography Systems
Maskless exposure lithography systems represent an entirely new platform of EVG lithographyequipment. The world’s first highly scalable maskless lithography technology for high-volume
manufacturing, MLE delivers unsurpassed flexibility to enable extremely short development
cycles for new devices.
Resist Processing Systems
The EVG100 series resist processing systems establish new standards in quality and flexibility
for photoresist coating and developing.
Integrated Lithography Track Systems
Lithography track systems complete the EVG lithography product family with a fully integrated
production system and high grade of automation combining mask alignment and exposure
with integrated pre- and post-processing.

Nanoimprint Lithography (NIL)
EVG is the market-leading supplier of nanoimprint lithography (NIL) equipment andintegration processes. EVG pioneered and mastered NIL from a research approach
more than 15 years ago, to implementation in volume production on various substrate
sizes from 2 inch compound semiconductor wafers to 300 mm wafers and even on
large-area panels. NIL is the most promising and cost-effective process for generating
nanometer-scale-resolution patterns for a variety of commercial applications inbioMEMS, microfluidics, electronics and, most recently, various diffractive opticalelements.
UV-NIL / SmartNIL® Systems
EV Group provides a complete product line for UV-based nanoimprint lithography (UV-NIL),
including different single-step imprinting systems, large-area imprinters as well as step-andrepeat systems for efficient master fabrication.
Hot Embossing Systems
EV Group’s series of high-precision hot embossing systems are based on the company’smarket-leading wafer bonding technology. Hot embossing is a cost-effective and flexible
fabrication technology with very high replication accuracy.

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LITHOGRAPHY

Mask Alignment Systems

EVG®610
Mask Alignment System
up to 200 mm

MLE™ Systems

EVG®620 NT Mask Alignment System(semi-automated / automated)
up to 150 mm

EVG®6200 NT Mask Alignment System(semi-automated / automated)
up to 200 mm

IQ Aligner® NT AutomatedMask Alignment System
up to 300 mm

LITHOSCALE® Maskless Exposure
Lithography System
up to 300 mm

Resist Processing Systems

EVG®101 Advanced
Resist Processing System
up to 300 mm

Lithography Track Systems

EVG®105
Bake Module
up to 300 mm

EVG®120 AutomatedResist Processing System
up to 200 mm

EVG®150 AutomatedResist Processing System
up to 300 mm

HERCULES®
Lithography Track System
up to 300 mm

UV Nanoimprint Lithography / SmartNIL® Systems

LITHOGRAPHY

HOGRAPHY
OGRAPHY
LITHOGRAPHY
APHY
EVG®610
UV-NIL System
up to 150 mm

EVG®620 NT
SmartNIL® UV-NIL System
up to 150 mm

EVG®6200 NT
SmartNIL® UV-NIL System
up to 200 mm

UV Nanoimprint Lithography / SmartNIL® Systems

HOGRAPHY
LITHOGRAPHY

OGRAPHYHERCULES® NIL Fully Integrated
SmartNIL® UV-NIL System
up to 200 mm

HERCULES® NIL Fully Modular andIntegrated SmartNIL® UV-NIL System
up to 300 mm

EVG®770 NT Step-and-Repeat
NIL System
up to 370 mm x 470 mm (Gen 2)

EVG®720 / EVG®7200 Automated
SmartNIL® UV-NIL System
up to 200 mm

EVG®7300 Automated
SmartNIL® UV-NIL System
up to 300 mm

EVG®7200 LA Large-Area
SmartNIL® UV-NIL System
up to 550 mm x 650 mm (Gen 3)

Permanent Bonding Systems

EVG®520 IS
Wafer Bonding System
up to 200 mm

EVG®540 AutomatedWafer Bonding System
up to 300 mm

Temporary Bonding and Debonding Systems

EVG®805
Debonding System
up to 300 mm

EVG®850 TB / DB AutomatedTemporary Bonding / Debonding
System up to 300 mm

EVG®560 AutomatedWafer Bonding System
up to 300 mm

ComBond® Automated High-Vacuum
Wafer Bonding System
up to 200 mm

GEMINI® Automated Production
Wafer Bonding System
up to 300 mm

EVG®620 BA / EVG®6200∞ BA
Automated Bond Alignment System
up to 200 mm

SmartView® NT Automated Bond
Alignment System for Universal
Alignment up to 300 mm

Bond Alignment Systems

EVG®880 LayerRelease™
Automated Layer Release Systemfor 300 mm

EVG®610 BA
Bond Alignment System
up to 200 mm

BONDING

EVG®501 / EVG®510
Wafer Bonding System
up to 200 mm

BONDINGBONDING

Fusion and Hybrid Bonding Systems

EVG®301
Single Wafer Cleaning System
up to 300 mm

EVG®320 AutomatedSingle Wafer Cleaning System
up to 300 mm

EVG®810 LT LowTemp™ Plasma
Activation System
up to 300 mm

Fusion Bonding Systems

Die-to-Wafer Bonding Systems

EVG®850 LT Automated Production
Bonding System for SOI and Direct
Wafer Bonding up to 300 mm

Metrology Systems

BON
BONDINGBONDINGBONDIN
EVG®850 Automated
Production Bonding System for SOI
up to 300 mm

GEMINI® FB Automated
Production Wafer Bonding System
up to 300 mm

BONDINGBONDSCALE® Automated
Production Fusion Bonding System
up to 300 mm

EVG®320 D2W AutomatedDie Preparation and Activation System
up to 300 mm

GEMINI® FB D2W AutomatedCollective Die-to-Wafer Bonding
System up to 300 mm

EVG®20IR Inspection Station
up to 300 mm

EVG®40 NT / EVG®40 NT2
Automated Measurement System
up to 300 mm

EVG®50Automated Metrology System
up to 300 mm

BONDIN

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Process Development Services
EV Group’s comprehensive process knowledge is a result of our decades of experience. This knowledge creates
benefits and advantages for our customers from the early stages of process development to the final goal of highvolume production. With state-of-the-art application labs and cleanrooms at our headquarters in Austria, alongwith North America and Asia, EV Group is focused on delivering superior process expertise to our growing global
customer base every step of the way. We can provide support for initial development through final integration at thecustomer’s site. Process know-how is key to achieving the shortest time to market for your product.

EVG® NILPhotonics® Competence Center
Development and Manufacturing of Innovative Photonic
Device Solutions
EVG’s NILPhotonics Competence Center is a flexible cooperation
model that leverages EVG’s equipment and process knowhow
gained through many years of experience to support the diversified
needs of the photonics market.

EVG® Heterogeneous Integration Competence Center™
Innovation Incubator for Heterogeneous Device Integration
EVG’s Heterogeneous Integration Competence Center is designed
to assist customers in leveraging EVG’s process solutions andexpertise to enable new and enhanced products and applications
driven by advances in system integration and packaging.

Process Technology
EVG is focused on delivering superior process expertise to our global R&D and production customer and partner base.
Our process development teams work hand-in-hand with customers, from the initial process development through to thefinal integration at their production sites. Services range from equipment demonstrations and feasibility studies to small-tomedium-scale pilot-line production to shorten time to market.
Last but not least, EVG’s process technology business unit performs independent research work to explore and develop
baseline processes that will open up new market opportunities for us and our customers.
This includes working with partners such as materials suppliers to develop and optimize new processes and capabilities.

EVG Process Expertise...etc.
CVD,
LPCVD,
PVD,...

ResistCoating
Spin/Spray

Wafer &
Template
Fabrication
Substrate
Cleaning
Substrate
Bondingfor SOI

Maskless
Exposure

RIE,
DRIE
Nanoimprint
Lithography

ResistDeveloping

Metallization

Wafer
DicingThinning,
CMP

Wafer
Bonding
Metrology

ResistLift-Off

PlasmaActivation

EVG Processes

Electroplating
Wet
Etching

Proximity
Lithography
Alignment
Verification

Bond
Alignment

Temporary
Bonding/
DebondingStressReliefEtching

Chip-toWafer
Bonding

Oxidation
Wafer
Bumping &Redistribution

Customer Support
Customersatisfactioniscritically important for EVG.
Our
worldwide
customer
support centers and spareparts supply network deliveron our commitment to provide
on-demand, quality service
that our local customers andpartners have come to expectfrom EVG. With outstanding
experience and knowledge,
our team is ready to provide
you with immediate assistancethrough remote diagnostics
and on-site service withextremely short response
times around the globe.

EVG Academy
The EVG Academy, located at EVG’s headquarters in Austria provides technical training on all classes of EVG equipment aswell as on EVG’s CIM Framework software platform in an optimized, purpose-built, 800-square-meter environment. The worldclass facility sets new standards for knowledge transfer in our industry and includes eight individual training areas – one foreach major class of EVG equipment – as well as four classrooms and a dedicated workshop area for electrical and mechanicaltraining.
Thanks to the extensive floorspace, the EVG Academy offers a great number and type of tools available for training, including
EVG’s fully automated HVM platforms, such as the GEMINI FB automated production wafer bonding system with SmartView NT3bond aligner and the BONDSCALE automated production fusion bonding system.
By attending in-depth, tiered training classes at the EVG Academy in a greatly enhanced learning experience, customers canbe qualified to perform basic repairs as well as preventative maintenance on EVG equipment without the need to contact EVG
customer support—providing customers with greater flexibility for tool maintenance.

www.EVGroup.com

Headquarters
EV Group Europe & Asia/Pacific GmbHDI Erich Thallner Strasse 14782 St. Florian am Inn
Austria+43 7712 5311 0
Sales@EVGroup.com
TechSupportEurope@EVGroup.com

EVG Subsidiaries
North America
EV Group Inc.
+1 480 305 2400
SalesNorthAmerica@EVGroup.com
TechSupportNorthAmerica@EVGroup.com

China
EV Group China Ltd.
+86 21 3899 4888
Sales@EVGroup.cn
TechSupportChina@EVGroup.com

Japan
EV Group Japan KK+81 45 348 0665
Sales@EVGroup.jp
TechSupportJapan@EVGroup.com

TaiwanEVG-JOINTECH CORP.
+886 3 516 3389
Sales@EVG-Jointech.com.tw
TechSupportTaiwan@EVGroup.com

Korea
EV Group Korea Ltd.
+82 2 3218 4400
Sales@EVGroup.co.kr
TechSupportKorea@EVGroup.com

Get in touch:Contact@EVGroup.com

The information contained in this document is provided “as is” and without warranty of any kind, express or implied. Any express or implied warranties including, but not limited to, any implied warranty ofmerchantability, fitness for a particular purpose, and patent infringement or other violation of any intellectual property rights are hereby expressly disclaimed.
EVG makes no representation that the use or implementation of the information contained in this document will not infringe or violate any copyright, patent, trademark, trade secret or other right.
In no event shall EVG be liable for any claim, damages or other liability, including any general, special, indirect, incidental, or consequential damages, whether in an action of contract, tort infringement,
misappropriation or otherwise, arising from, out of or relating to the use or inability to use the information.
Acceptance and/or any use of the information contained in this document shall be deemed consent to, and acceptance of, this disclaimer.
Data, design and specifications may not simultaneously apply; or may depend on individual equipment configuration, process conditions and materials and vary accordingly. EVG reserves the right to change data,
design and specifications without prior notice.
All logos, company names and acronyms or any combinations thereof, including, but not limited to, EV Group®, EVG® and the Triple i logo, equipment and technology names and acronyms such as GEMINI®,HERCULES®, BONDSCALE®, SmartView®, SmartNIL® and many others, as well as website addresses, are registered trademarks and/or the property of EV Group. For a complete list of EVG trademarks visit
www.EVGroup.com/imprint. Other product and company names may be trademarks of their respective owners.
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