FOR IMMEDIATE RELEASE
EV Group and Fraunhofer IZM-ASSID Expand Partnership in Wafer Bondingfor Quantum Computing Applications
Strategic partnership kicks off with installation of EVG850 automated laser debonding system at thenewly launched Center for Advanced CMOS and Heterointegration Saxony (CEASAX)
ST. FLORIAN, Austria and MORITZBURG, Germany, June 13, 2024—EV Group (EVG), a leading
supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor
markets, and Fraunhofer IZM-ASSID (All Silicon System Integration Dresden), a division of Fraunhofer
IZM that provides world-leading applied research in semiconductor 3D wafer-level system integration,
jointly announced today that they have entered into a strategic partnership to develop and optimize
alternative bonding and debonding technologies for advanced CMOS and heterogeneous integration
applications, including quantum computing.
Kicking off this expanded collaboration, Fraunhofer IZM-ASSID has purchased and installed an EVG®850
DB fully automated UV laser debonding and cleaning system at Fraunhofer’s newly established Centerfor Advanced CMOS and Heterointegration Saxony (CEASAX), located in Dresden, Germany. CEASAX
combines core competencies from Fraunhofer IZM-ASSID and the Fraunhofer Institute for PhotonicMicrosystems (IPMS) to further research into 300-mm, 3D heterogeneous wafer-level system integrationand front-end semiconductor integration processes for high-performance neuromorphic computing, cryoand quantum technology.
The EVG850 DB is the first system to be installed at CEASAX, and will help enable Fraunhofer IZMASSID to close critical process gaps and offer technology modules for the manufacturing of quantum
systems and their wafer-scale hardware environment based on a 300-mm cleanroom environment. The
system’s installation also marks the start of Fraunhofer’s Bond-Hub, which will additionally comprise a
multitude of leading-edge temporary as well as permanent wafer-to-wafer and die-to-wafer bonding
systems.
Temporary Bonding Essential for Heterogeneous Integration Applications
Temporary wafer bonding is a widely used method to ensure the processing of thin wafers (under
100-micron silicon thickness), which are important for 3D ICs, power devices and fan-out wafer-levelpackaging (FOWLP), as well as for handling fragile substrates like compound semiconductors. The
debonding of the carrier wafer is an essential step to prepare the device wafer for the final process steps
toward singulation and integration of the dies into the end device or application. By acquiring theEVG850 DB system, Fraunhofer can perform these debonding processes entirely in house, enabling
significantly shorter development times for optimal process flows with various bonding adhesive systems.
This in turn will allow Fraunhofer to ideally tailor its processes to the unique and specific needs of its
many customers.

-more-EVG AND FRAUNHOFER IZM-ASSID EXPAND PARTNERSHIP IN WAFER BONDING FOR
QUANTUM COMPUTING ………………………………………………………………………………Page 2 of 3
“Fraunhofer and EV Group have enjoyed a long and successful collaboration in developing newprocesses that have helped enable critical, emerging micro-electronics applications – including multidevice integration of analog and digital devices such as ASICs, RF devices, sensors and transceivers into
an optimized system-in-package or functional smart microelectronic systems,” stated Manuela
Junghähnel, site manager, Fraunhofer IZM-ASSID. “We are excited to be expanding and reinforcing thispartnership through the purchase of the EVG850 DB laser debonding and cleaning system, which will be
the first of several key product installations at CEASAX, our new advanced semiconductor researchcenter. Through this expanded relationship, Fraunhofer will receive state-of-the-art technology in-houseand have a strong partner in EV Group for developing new technologies for 3D device integration, whichin turn will offer our customers a more complete process chain for 3D/heterogeneous integration from asingle source.”
According to Markus Wimplinger, corporate technology development and IP director at EV Group, “Weare excited to be building upon our long-term partnership with Fraunhofer into quantum computing
applications and beyond through this latest strategic development. Our expanded collaboration allows
EVG to stay at the forefront of technology advancements and enable us to contribute to the developmentof new manufacturing processes for quantum systems.”
EVG Heterogeneous Integration Solutions
EVG’s wafer bonding, lithography and metrology solutions enable the development and high-volume
manufacturing of technology innovations in advanced packaging—including backside illuminated CMOS
image sensors and other 3D-IC stacked devices—as well as in MEMS and compound semiconductors.
Recent breakthroughs in hybrid bonding to address the needs for 3D device integration, wafer bondalignment technology to address future 3D-IC packaging requirements, IR laser release technology toeliminate glass substrates for advanced packaging and enable thin-layer 3D stacking, maskless exposurefor fan-out wafer level packaging (FOWLP), and NIL and resist processing to support wafer-level optics(WLO) manufacturing, are just a few examples of EVG’s technology leadership in heterogeneous
integration and wafer-level packaging.
About the EVG850 DBThe EVG850 DB fully automated UV laser debonding and cleaning system enables high-throughput, lowcost-of-ownership room-temperature debonding for ultra-thin and stacked fan-out packages. It
incorporates a solid-state UV laser and proprietary beam-shaping optics to enable optimized, force-freecarrier lift-off. For more information on the EVG850 DB UV laser debonding and cleaning system, visit
https://www.evgroup.com/products/bonding/temporary-bonding-and-debonding-systems/evg850-db.
About Fraunhofer IZM-ASSID
Fraunhofer IZM-ASSID is a leading R&D partner in the field of heterogeneous 3D wafer-level system
integration to enable smart systems in 3D. It has a fully equipped 300-mm wafer process line foradvanced wafer-level packaging, is ISO-certified and offers industry-compatible process equipment forprocessing 200- and 300-mm wafers. On this basis, the Dresden site of the Fraunhofer IZM offers its
customers process and technology development through prototype production and small volume series.

-more-EVG AND FRAUNHOFER IZM-ASSID EXPAND PARTNERSHIP IN WAFER BONDING FOR
QUANTUM COMPUTING ………………………………………………………………………………Page 3 of 3
About EV Group (EVG)
EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture ofsemiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices
and nanotechnology devices. Key products include wafer bonding, thin-wafer processing,lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters,cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate
network of global customers and partners all over the world. More information about EVG is available atwww.EVGroup.com.
EV Group Contacts:
Clemens Schütte
Director, Marketing and Communications
EV Group
Tel: +43 7712 5311 0
E-mail: Marketing@EVGroup.com

David Moreno
Principal
Open Sky Communications
Tel: +1.415.519.3915
E-mail: dmoreno@openskypr.com

Fraunhofer Contacts:
Georg Weigelt
Marketing & PR
Fraunhofer IZM
Tel: +49 30 46403-279
E-mail: georg.weigelt@izm.fraunhofer.deDr. Manuela Junghähnel
Site Manager
Fraunhofer IZM-ASSID
Tel.: +49 0351 795572-0
E-mail: manuela.junghaehnel@assid.izm.fraunhofer.de###EV Group and Fraunhofer IZM-ASSID personnel next to an EVG®850 DB fully automated UV laser debonding andcleaning system installed in Fraunhofer’s newly established Center for Advanced CMOS and Heterointegration Saxony(CEASAX) in Dresden, Germany. From left to right: Gerald Silberer, Regional Sales Director Europe (EV Group);
Dr. Andreas Gang, Group Leader Pre-Assembly / Wafer Bonding (Fraunhofer IZM-ASSID); Dr. Manuela Junghähnel,Site Manager (Fraunhofer IZM-ASSID); Markus Wimplinger, Corporate Technology Development & IP Director(EV Group); Andreas Pichler, Regional Sales Manager Europe (EV Group); Robert Wendling, Technical AssistantWafer Bonding (Fraunhofer IZM-ASSID); and Dr. Frank Windrich, Deputy Site Manager (Fraunhofer IZM-ASSID).
© Fraunhofer IZM / Silvia Wolf. Print quality: https://www.evgroup.com/company/news.