EV GROUP® | Products//

Bonding//

GEMINI® Series

Permanent Bonding

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EV GROUP® | Products//

Bonding//

Permanent Bonding//

GEMINI® Series

Introduction
Aligned wafer bonding is an enabling technology for wafer level capping, wafer levelpackaging, the manufacture of engineered substrates, 3D integration at the wafer level andwafer thinning. In turn, these processes have enabled the amazing growth of MEMS devices,
RF filters, and BSI (back side illuminated) CIS (CMOS Image Sensors). Also these processes
have enabled the manufacture of engineered substrates such as SOI (Silicon on Insulator).
The mainstream bonding processes are: adhesive, anodic, direct / fusion, glass frit, solder(including eutectic and transient liquid phase) and metal diffusion / thermocompression.
Which bonding process is appropriate will depend on the application.
EVG has over 25 years of experience building wafers bonders, has a combined 2,000 man
years of wafer bonding experience, and the GEMINI is the industry standard for HVM using
wafer bonding.
GEMINI FB (Fusion Bond) performs aligned direct bonding at room temperature and ambientpressure conditions. Because the initial bond is formed when the wafers are brought into
contact in the aligner, there is no need for bond chambers. High throughput, best alignment
accuracy and small footprint, combined with multiple pre-processing chambers, ensures bestperformance.

Unique Features■■■■

SmartView® Face-to-Face alignment (Patent No.: US 6.214.692)■■■

Temporary bonding capability for wafer thinning■■■

Transparent, backside and IR alignment capability
Center-to-Center alignment option
Dedicated high throughput configurations for SiO2 fusion, Cu-Cu metal diffusion
bonding and polymer bonding
Modular design with swap-in modules
Flexible development configuration for all Wafer-to-Wafer (W2W) and Chip-to-Wafer(C2W) bonding technologies
Up to 100 kN bond force available
Easy cleaning and maintenance through fast access to bond chambers
ISO 3 (according to ISO 14644) mini-environment,
separate pre- and post-bond handling systems

Bond chucks
Bond chucks are used to safely and securely transport aligned wafer pairs to the bondchamber and to remove the bonded wafer pair from the bond chamber. Highly flexible bondchuck designs and materials enable optimization for the chosen bonding process or system
customization for special applications.

Software■■■Multi-recipe bonding allows the definition of individual wafer paths through the system(recipes, bond chamber, pre-bonding processing steps, bondchucks etc.).
Multiple module functionality allows the installation of modules with different
functionality and specifications for maximum flexibility.
The GEMINI system is capable of tracking every processing variable for all wafers.
For example: which wafer was bonded to which wafer and what bond tool and bondchamber were used.

GEMINI is operated with Windows® based intuitive software. Different login levels withpassword control access for different users (operator, engineer, development engineer,administrator) are provided. The process of wafer loading, alignment, bonding and unloadingof bonded wafers is fully programmable. Bond process control is assured by real time
monitoring and data acquisition as well as easy drag and drop recipe editing. Images can be
stored, together with the wafer IDs, for later reference.

GEMINI® Automated Production Wafer Bonding System■■

Wafer sizes up to 300 mm

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Configuration options for bottom-side or SmartView alignment■■

Minimized footprint compared to stand-alone systems

Fully automated and integrated platform for wafer-to-waferalignment and wafer bonding
Multiple bonding chambers
Wafer handling system is separated from bond chuck handling system
Modular design with swap-in modules
Combines all benefits from EVG’s precision aligners and EVG®500 seriessystems
Optional process modules:- LowTemp™ plasma activation- Wafer cleaning- Coat module- UV bond module- Bake/chill modules- Alignment verification module

GEMINI® FB Automated Production Wafer Bonding System■■

Wafer sizes up to 300 mm■

Up to six pre-processing modules like
- Clean module- LowTemp™ plasma activation module- Alignment verification module- Debond module■

Optional features:- Debond module- Thermocompression bond module

New SmartView® NT3 face-to-face bond aligner withsub 50 nm wafer-to-wafer alignment accuracy

GEMINI® FB XT Automated Production Wafer Bonding System■

EVG`s GEMINI FB XT integrated fusion bonding system extends current
standards and combines higher productivity with improved alignment andoverlay accuracy for applications such as memory stacking, 3D systems
on chip (SoC), backside illuminated CMOS image sensor stacking, and diepartitioning. The system features the new SmartView NT3 bond aligner,
developed specifically for fusion and hybrid wafer bonding alignment
requirements of < 50 nm.

ModulesSpin Coat Module
available for GEMINI and GEMINI FB
For application of adhesive layers prior to wafer bonding.
Bake/Chill Module
available for GEMINI
For processing adhesive layers after coating and before bonding.
LowTemp™ Plasma Activation Module
available for GEMINI and GEMINI FB
Plasma activation for PAWB (Plasma Activated Wafer Bonding).
Cleaning Module
available for GEMINI and GEMINI FBParticle removal with DI water and mild chemical cleans.
SmartView® NT
available for GEMINI and GEMINI FB
Wafer to wafer aligning prior to wafer bonding.
EVG®500 Series UV-Bond Module
available for GEMINI
Supports UV initiated adhesive bonding.
EVG®500 Series Bond Module
available for GEMINI
Supports all mainstream bonding processes other than UV cured adhesive.
Alignment Verification Module
available for GEMINI, GEMINI FB and EVG560
For verification of correct wafer alignment before and/or after a permanent
bond in a bond chamber or equivalent modules (fusion bonding).

Software and Support
The Windows-based, graphical user interface is designed with a strong focus on userfriendliness, and easily navigates the operator through each process step. Multi-language
support, individual user account settings and integrated error logging / reporting andrecovery can simplify the user’s daily operation. All EVG systems can also communicate
remotely. Thus, our service includes field-proven, real-time remote diagnostics andtroubleshooting via secured connection, phone or email. EVG’s experienced processengineers are readyEVG
to support Process
you anytime thanks toour de-centralized worldwide support
Expertise
structure, including cleanroom space on three different continents:
Europe (HQ), Asia (Japan) andNorth America (USA).
...etc.
CVD,
LPCVD,
PVD,...

ResistCoating
Spin/Spray

Wafer &Template
Fabrication
Substrate
Cleaning
Substrate
Bondingfor SOI

Maskless
Exposure

RIE,
DRIE
Nanoimprint
Lithography

ResistDeveloping

Metallization

Wafer
DicingThinning,
CMP

Wafer
Bonding
Metrology

ResistLift-Off

PlasmaActivation

EVG Processes

Electroplating
Wet
Etching

Proximity
Lithography
Alignment
Verification

Bond
Alignment

Temporary
Bonding/Debonding

StressRelief
Etching

Chip-toWafer
Bonding

Oxidation
Wafer
Bumping &Redistribution

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EV GROUP® | Products//

Bonding

Permanent Bonding////GEMINI® Series

Process Results
EVG offers fully integrated and highly automated production systems for wafer bonding processes. A maximum level of automationand process integration opens the door to large-scale manufacturing and guarantees a proven transition of processes from R&D
stage to production.

10 mm

Cross section of a Cu:Sn bonding layer.
Courtesy of Siemens

Ziptronix direct bond interface
Courtesy of Ziptronix

Copper-to-copper thermo-compression bonding
Courtesy of Tezzaron

Metal/Adhesive via-first 3D bonding interface
Courtesy of RPI

nmScanning Acoustic Microscope image of a patterned
wafer pair.
Source: Cooperation between EVG and Fraunhofer ENAS

wafer

Alignment results from marathon tests on EVG
SmartView® NT2 aligner demonstrates
all wafers aligned at < 100 nm accuracy.

Modular Design
The huge variety of bond alignment system configurations provide multiple advantages for various MEMS and IC applications.
A large number of different alignment techniques can be supported by either using direct (live) or indirect alignment methods.

Wafer to Wafer Bond Alignment
Industry Standard EVG SmartView® Aligner

OpticalFace-to-Face(Front-to-front)
Transparent

Transparent

MechanicalBackside(Front-to-back)Different
substrate size

Same
substrate size

SmartView®

Opaquewww.EVGroup.com

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EVG Subsidiaries
North America
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+1 480 305 2400
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+86 21 3899 4888
Sales@EVGroup.cn
TechSupportChina@EVGroup.com

Japan
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Sales@EVGroup.jp
TechSupportJapan@EVGroup.com

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+886 3 516 3389
Sales@EVG-Jointech.com.tw
TechSupportTaiwan@EVGroup.com

Korea
EV Group Korea Ltd.
+82 2 3218 4400
Sales@EVGroup.co.kr
TechSupportKorea@EVGroup.com

Get in touch:Contact@EVGroup.com

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The information contained in this document is provided “as is” and without warranty of any kind, express or implied. Any express or implied warranties including, but not limited to, any implied warranty ofmerchantability, fitness for a particular purpose, and patent infringement or other violation of any intellectual property rights are hereby expressly disclaimed.
EVG makes no representation that the use or implementation of the information contained in this document will not infringe or violate any copyright, patent, trademark, trade secret or other right.
In no event shall EVG be liable for any claim, damages or other liability, including any general, special, indirect, incidental, or consequential damages, whether in an action of contract, tort infringement,
misappropriation or otherwise, arising from, out of or relating to the use or inability to use the information.
Acceptance and/or any use of the information contained in this document shall be deemed consent to, and acceptance of, this disclaimer.
Data, design and specifications may not simultaneously apply; or may depend on individual equipment configuration, process conditions and materials and vary accordingly. EVG reserves the right to change data,design and specifications without prior notice.
All logos, company names and acronyms or any combinations thereof, including, but not limited to, EV Group®, EVG® and the Triple i logo, equipment and technology names and acronyms such as GEMINI®,HERCULES®, BONDSCALE®, SmartView®, SmartNIL® and many others, as well as website addresses, are registered trademarks and/or the property of EV Group. For a complete list of EVG trademarks visit
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