TA8201AKTOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic

TA8201AKBTL Audio Power Amplifier
The TA8201AK is a audio power amplifier for consumer
application.
This IC is applying BTL system in which output coupling
condenser and bootstrap condenser are not necessary and output
17W (VCC = 14.4V, BL =4Ω, THD = 10%) can be obtained.
Since the package is a 7 pin SIP, (signal inline package), it
greatly simplifies construction of a power amplifier both in designand assembly.
It also contains various kind of protector.
It is suitable for car−audio power amplifier with highperformance.

Features·Weight: 2.19g (typ.)High power: POUT (1) = 17W (typ.)(VCC = 14.4V, f = 1kHz, THD = 10%, RL = 4Ω): POUT (2) = 14W (typ.)(VCC = 13.2V, f = 1kHz, THD = 10%, RL = 4Ω)·Very few external parts·

Built in protector circuit
Thermal shut down, over voltage protector (typ. VCC = 24V)
ASO protector (RL short, Out to GND, Out to VCC)

·7 pin small package·Operating supply voltage range: VCC = 9~18V12002-10-30

TA8201AK
Block Diagram＋－Directions For Use And Application Method
1. Voltage gain adjustment

This IC has the amplifier construction as shown in Fig.1. The pre-amp. Amp 1 is provided to the primary stage,
and the input voltage is amplified by the flat amps, amp 3 and amp 4 of each channel through the phase amp.
Amp 2.
Since the input offset is prevented by pre-amp when VCC is set to on, this circuit can remarkable reduce the pop
noise.
The total closed loop gain GV of this IC can be obtained by expression below when the closed loop voltage gain ofamp 1 is GV1.
G V1 = 20log

R1 + (R f + R2)(dB) ..... (1)R f + R2

The closed loop voltage gain of power amp, amp 3 and amp 4 is fixed at GV3≒GV4 = 20dB.
Therefore, the total closed circuit voltage gain GV is obtained through BTL connection by the expression below.

GV = GV1+GV3+6 (dB) .............

(2)

2

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For example, when Rf = 0Ω, GV is obtained bythe expression below.
GV≒28+20+6 = 54 (dB)The voltage gain is reduced when Rf isincreased. (Fig.2)
With the voltage gain reduced, since (1) theoscillation stability is reduced, and (2) the pop
noise changes when VCC is set to on, refer tothe items 2 and 4.

2. Capacitive value of input and NF capacitor
This IC has the built-in circuit which makes the input voltage of amp. 1 and the voltage of NF terminal equal at
VCC → on by means of providing the pre-amp (amp 1) at the first stage.
Therefore, the off-set voltage produced at the first stage is suppressed, and the pop noise is prevented.
Set the capacitive value of input and NF capacitor according to the gain to be used.
[Reference] (A) At GV = 54dB (Rf = 0) CIN = 4.7µF, CNF = 47µF
(B) At GV = 40dB (Rf = 560Ω) CIN = 3.3µF, CNF = 33µF
3. Capacitance of ripple filter capacitor
The capacitance of the ripple filter capacitor of (3) pin determines the time constant at VCC → on and VCC → off.
Since the pop noise varies according to the capacitance of the ripple filter capacitor, C3 =220µF recommended.
Having the built-in rapid discharging circuit of ripple and NF voltage at the time when VCC → off, this IC iseffective for preventing the pop noise of VCC continuous on / off.

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4. Preventive measure against oscillation
For preventing the oscillation, it is advisable to use C4, the condenser of polyester film having small
characteristic fluctuation of the temperature and the frequency.
The resistance R to be series applied to C4 is effective for phase correction of high frequency, and improves theoscillation allowance.
Since the oscillation allowance is varied according to the causes described below, perform the temperature test tocheck the oscillation allowance.
(1) Voltage gain to be used (GV setting)(2) Capacity value condenser(3) Kind of condenser(4) layout of printed board
By increasing Rf, decrease of GV is possible.
However, care must be taken since the feedback increase is liable to produce oscillation.

5 External part list and description
SymbolRecommended
Value

C1

4.7µF

Influence
FeatureDC blocking

Smaller Than
Recommended
Value

Larger ThanRecommended
Value

Related to popping noise at VCC → on
Related to popping noise at VCC → on

Remarks

Related to gain.
Refer to item2.

Determination of low cut-off frequency.
1C2 =2pfL × R f

C247µF

Feedback
condenser

C3

220µF

Ripplereduction

Time constant issmall at VCC → onor off.

Time constant islarge at VCC → on or off.

Refer to item3.

C40.15µF

Oscillation
prevention

Made liable tooscillate.

Oscillation allowance
improved.

Refer to item4.

C51000µF

RipplefilterFor filtering power supply hum and ripple.
Large at using AC rectified power supply.
Small at using DC power supply.

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TA8201AK
Maximum Ratings (Ta = 25°C)
Characteristic

SymbolRatingUnit

Peak supply voltage (0.2 sec)

VCC (surge)

50

V

DC supply voltage

VCC (DC)

25

V

Operating supply voltage

VCC (opr)

18

V

Output current (peak)

IO (peak)

4.5

APower dissipation

PD15

W

Operating temperatureTopr-30~85°C

Storage temperature

Tstg-55~150°C

Electrical Characteristics(unless otherwise specified, VCC = 13.2V, RL = 4Ω, f = 1kHz, Ta = 25°C)
SymbolTestCircuit

ICCQ

―

POUT (1)CharacteristicMin.

Typ.

Max.

Unit

VIN = 0―

60

95µA―

VCC = 14.4V, THD = 10%―

17―

POUT (2)―

THD = 10%1014―

Total harmonic
distortion

THD―

POUT = 1W

―

0.05

0.4%

Voltage gain

GV―

Rf = 0Ω

525456dB

Output noise voltage

VNO―

Rg = 10kΩ, BW = 20Hz~20kHz―

0.9

2.0mVrms

Ripple rejection ratio

R.R.

―

Fripple = 100Hz, Rg= 600Ω

4050―

dB

Input resistanceRIN―

f = 1kHz―30―kΩOutput offset voltage

Voffset―VIN = 0-0.3

00.3

V

Quiescent current
Output power

Test Condition

W

Typical DC Voltage Of Each Terminal (VCC = 13.2V, VIN = 0V, Ta = 25°C)
Terminal No.

123

4

56

7

Terminal

In

NF

R.F

GND

Out

VCC

Out

DC voltage (V)

4.55

4.55

4.55

0

5.6

13.2

5.6

Test Circuit / Applecation Circuit

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7

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Package Dimensions

Weight: 2.19g (typ.)82002-10-30

TA8201AKRESTRICTIONS ON PRODUCT USE

000707EBF· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physicalstress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards ofsafety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure ofsuch TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions andconditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
· The TOSHIBA products listed in this document are intended for usage in general electronics applications(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life orbodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane orspaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in thisdocument shall be made at the customer’s own risk.
· This product generates heat during normal operation. However, substandard performance or malfunction may
cause the product and its peripherals to reach abnormally high temperatures.
The product is often the final stage (the external output stage) of a circuit. Substandard performance ormalfunction of the destination device to which the circuit supplies output may cause damage to the circuit or to theproduct.
· The products described in this document are subject to the foreign exchange and foreign trade laws.
· The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or otherrights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
· The information contained herein is subject to change without notice.

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