EV GROUP® | Products//

Lithography

EVG®100 Series//

Resist Processing Systems

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EV GROUP® |Products//

Resist Processing Systems //EVG®100 Series

Introduction
The EVG100 series of resist processing systems establishes new standards in quality andflexibility for photoresist coating and developing. Designed to support a wide range of processparameters and customer requirements, the EVG100 series includes Spin and Spray Coat,
Develop, Bake and Chill modules to suit individual production requirements. An extensive
range of materials - such as positive and negative resists, polyimides, double-sided coatingof thin-resist layers, high-viscosity resists, and edge protection coatings - can be processedon the EVG100 series. EVG resist processing systems provide a high degree of versatility. Thesystems can handle and process wafers from two inches to 300 mm in diameter, as well asrectangle, square or even irregular shaped substrate sizes with no or very minimal toolingtime. Additional features such as wafer-edge handling or thin-wafer handling are available.
EVG also offers systems for larger substrate sizes (e.g., for display manufacturing). As with
all EVG processing systems, the equipment can be configured for R&D environments or for
high-volume production.

Resist Processing Solutions for R&D
Successful and fast progress in research and development is closely related to a strong
infrastructure, including high-quality process equipment. Over many years, EVG has
established itself as a strong partner for universities and research organizations. Dedicatedequipment developments and process support prove this commitment on a daily basis.
The EVG100 series is designed to support a wide variety of requirements while providing
optimal process control. This allows the development of new devices or processes on anindustrial level, which not only requires high flexibility but also controlled and repeatableprocessing. While the importance of resist processing to enable certain process flows isoften underestimated and just considered a commodity for standard lithography processes,
in many cases it is key to enabling downstream processes. For example, patterning on
high-topography wafers, LIGA (lithography, electroforming, molding), temporary bonding,nanoimprint lithography (NIL) and adhesive bonding rely on advanced coating capabilities
and process know-how. EVG has built up many years of spin and spray coating experience fordemanding applications and incorporates these learnings into the EVG100 series, where ourprocess know-how can be leveraged to support our R&D customers.
User-friendly processing
Critical to semi-automated process equipment is the need for user-friendly operation andmulti-user interfaces. As a result, EVG’s coaters and developers are highly professional
systems with the ease of use that enables even a beginner to operate them while fulfilling themost demanding process needs. The user interface software provides user guidance throughclear instructions and animation, security queries, multi-language support and individual user
account settings. In addition, an industry standard PC with implemented web interface can beused to allow remote access for easy and fast support, including log file analysis.

All-in-one or optimized to your needs - spin, spray and additional featuresin a single system
EVG has built up many years of spin and spray coating experience for demanding applications
and incorporates these learnings into the EVG100 series. Proprietary resist coating
technologies, such as OmniSpray, revolutionary NanoSpray and NanoFill are implemented inthe EVG100 series of resist processing systems and establish new standards in quality andflexibility for photoresist coating and developing. Designed to support a wide range of processparameters and customer requirements, an extensive range of materials – such as positive
and negative resists, polyimides, double-sided coating of thin-resist layers, high-viscosityresists, and edge-protection coatings – can be processed on the EVG100 series.
Customized solutions
EVG’s customer-focused approach includes customized solutions for dedicated processneeds. Understanding special requirements and having the flexibility to adapt our systems
accordingly are among the unique core competencies that EVG brings to the marketplace.

EVG®101 Advanced Resist Processing System

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Flexible single chamber design for R&D and small-scale production■■■

Spin and spray coating in one chamber

Semi-automated from two inches up to 300 mm
No or very short tooling time when changing substrate size or shape
Recipe-based automated coating and developing for best repeatability
Reliable system design with minimized footprint
Easy process transfer from research to production utilizing proven modular
designRecipe-controlled syringe system for R&D and sensitive resists (e.g. BCB)
Optional ISO 3 (according to ISO 14644) mini-environment

EVG®120 Automated Resist Processing System■
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Fully automated two-chamber resist processing system from two inches up to200 mm
Up to 10 additional plates, such as hot plates, chill plates and vapor prime
Versatile combination of multi-functional modules for spin and spray coating,developing, bake and chill
Compact design for highest productivity with minimal footprint
Hot swapping robot handling for highest throughput
Smart scheduling software optimizes handling times in linear or parallel
processing mode
Recipe-controlled syringe system for R&D and sensitive resists (e.g. BCB)
Optional ISO 3 (according to ISO 14644) mini-environment andfab-automation integration (SECS/GEM)

EVG®150 Automated Resist Processing System

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Fully automated resist processing system for up to 300 mm substrates■■

Ergo load cassette stations, SMIF loadports, FOUP load ports■

Up to 6 process modules including bake, chill, vapor prime modules
XT version for up to 8 modules available
Hot swapping robot handling for high-volume manufacturing
Fully customizable modular design of spin and spray coating, developing,bake and chill modules
Smart scheduling software optimizes handling times in linear or parallel
processing mode
Optional ISO 3 (according to ISO 14644) mini-environment andfab-automation integration (SECS/GEM)

HERCULES® Lithography Track System■
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Fully automated lithography track system based on modular design formask alignment and exposure with integrated pre- and post-processing
Hot swapping robot handling for high throughput
Up to 8 wet-processing modules plus up to 24 additional bake, chill andvapor prime plates
Mask alignment and exposure based on EVG IQ Aligner or EVG6200
Exposure with lamp houses up to 5 kW
Ergo load cassette stations, SMIF loadports, FOUP load ports
Chemistry handling in separate cabinet

Options
Spin / Spray Coat Module
Simulation-based low-turbulence coat module design effectively supports resist-saving
high-uniformity results. Up to eight dispense lines allow versatile process set-up withdifferent resists and solvents. Additional functions such as solvent-based pre-wetting,edge-bead removal and sealed park position with nozzle wash function support advanced
resist coating and production requirements. Optional CoverSpin technology improves
coating uniformity and avoids edge effects independent of the substrate shape. Proprietary
OmniSpray technology provides excellent uniformity results on challenging topographies.
The ultrasonic atomization nozzle guarantees controlled and narrow droplet size distribution
independent of N2 flow. Fully recipe-controlled spray nozzle parameters available in rotation
or x-y spray system provide high flexibility and repeatability. The optionally available heatedchuck system can further extend the application range. The spin and spray module option
reinforces the combination of spin and spray coating.
NanoSpray™ / NanoFill™ Coat Module
EVG’s patented NanoSpray is a unique coating technique under vacuum conditions. This
multi-step process enables uniform resist coverage of sidewalls and via-bottom for highaspect TSVs of up to 1:20. NanoFill technology allows complete, void-free filling of vias
with flat surfaces. These novel coating processes enable applications like in-via lithography,
fast and cost-efficient deposition of organic low-k dielectrics, and easy-to-remove in-via
protective coatings.
Develop Module
All resist developing processes can be combined into one module with up to six different
fluid lines. For optimized developing on topography, the use of up to two spray nozzles
can be added. The megasonic-enhanced development option provides excellent results for
thick-resist applications, such as high aspect ratio structures.
Bake / Chill Module
Each bake / chill module can be configured with up to five hot or chill plates. The module
can handle temperature ranges of 0 - 250°C with uniformity of < ± 0.5 % at 100°C.
N2 purge and water-cooled chill plates enhance the process control capabilities together
with high-solvent hot plates, which are optionally available for thick resist applications.

Software and Support
The Windows-based, graphical user interface is designed with a strong focus on userfriendliness, and easily navigates the operator through each process step. Multi-language
support, individual user account settings and integrated error logging / reporting andrecovery can simplify the user’s daily operation. All EVG systems can also communicate
remotely. Thus, our service includes field-proven, real-time remote diagnostics andtroubleshooting via secured connection, phone or email. EVG’s experienced processengineers are readyEVG
to support Process
you anytime thanks toour de-centralized worldwide support
Expertise
structure, including cleanroom space on three different continents:
Europe (HQ), Asia (Japan) andNorth America (USA).
...etc.
CVD,
LPCVD,
PVD,...

ResistCoating
Spin/Spray

Wafer &Template
Fabrication
Substrate
Cleaning
Substrate
Bondingfor SOI

Maskless
Exposure

RIE,
DRIE
Nanoimprint
Lithography

ResistDeveloping

Metallization

Wafer
DicingThinning,
CMP

Wafer
Bonding
Metrology

ResistLift-Off

PlasmaActivationEVG Processes

Electroplating
WetEtching

Proximity
Lithography
Alignment
Verification

BondAlignment

Temporary
Bonding/
DebondingStressReliefEtching

Chip-toWafer
Bonding

Oxidation
Wafer
Bumping &Redistribution

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EV GROUP® |Products//

Resist Processing Systems //EVG®100 Series

Application Range and Process Results
The EVG100 series is designed to provide flexibility of process variations covering an extensive range of materials. At the same time,these systems are establishing new benchmarks in advanced coating processes to meet emerging market requirements. All EVG
lithography equipment platforms are 300-mm ready, can be fully integrated into its HERCULES lithography track systems and arecomplemented by its metrology tools for top-to-bottom side alignment verification.
High-uniformity coating for lithography or temporary bonding

11.0 µm22.4 µm

AZ 9260
Positive tone photoresist

31.7 µm

TOK PMER P-LA900PM
Positive tone photoresist

JSR THB 126N
Negative tone photoresist

Superior thick-resist processing for deep etching, passivation, electroplating, lens molding and adhesive bonding

100 µmMicro-patterned gears for LIGA processing
Source: EVG

1 µm

Negative sidewall with a metal-compatible lift-off resist
coating; metal pad in the middle of the structure
Source: EVG

100 µmHigh-resolution thick film processing showing a Siemens
star pattern
Source: EVG

Coating for high-precision thin-layer processing, including nanoparticles, colored, e-beam and nanoimprint resists

10 µm

Fully populated 6” Si substrate imprinted on EVG®720
Source: EVG

20 µm thick black resist spin-coated double layer on 8“substrate exposed on EVG®6200 NT
Source: EVG

High-precision 1 µm thin-layer processing with 0.8 µm
L/S structures
Source: EVG

Spray coating for excellent coating uniformity on high-topography, fragile and irregularly shaped substrates

500 nmPatterned, spray-coated resist layer in anisotropicallyetched cavity
Courtesy of TU-Delft DIMES

100 nmHigh-Q-3D solenoid inductors for RF ICs. Metal structures
created by utilizing spray coating
Courtesy of SIMIT

100 µm

SEM cross
Source: EVG

sectionofspraycoatedcavity

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+1 480 305 2400
SalesNorthAmerica@EVGroup.com
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China
EV Group China Ltd.
+86 21 3899 4888
Sales@EVGroup.cn
TechSupportChina@EVGroup.com

Japan
EV Group Japan KK+81 45 348 0665
Sales@EVGroup.jp
TechSupportJapan@EVGroup.com

TaiwanEVG-JOINTECH CORP.
+886 3 516 3389
Sales@EVG-Jointech.com.tw
TechSupportTaiwan@EVGroup.com

Korea
EV Group Korea Ltd.
+82 2 3218 4400
Sales@EVGroup.co.kr
TechSupportKorea@EVGroup.com

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EVG makes no representation that the use or implementation of the information contained in this document will not infringe or violate any copyright, patent, trademark, trade secret or other right.
In no event shall EVG be liable for any claim, damages or other liability, including any general, special, indirect, incidental, or consequential damages, whether in an action of contract, tort infringement,
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Acceptance and/or any use of the information contained in this document shall be deemed consent to, and acceptance of, this disclaimer.
Data, design and specifications may not simultaneously apply; or may depend on individual equipment configuration, process conditions and materials and vary accordingly. EVG reserves the right to change data,
design and specifications without prior notice.
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