- preliminary product information -Preamplifier Electronics for Hamamatsuback thinned / back illuminated CCD Arrays

Key Features
Supports Hamamatsu CCD series S703x
Digital control

Line-binning and 2D readout modes supported
Easy to integrate and use

to FEE
0.5 m max.

Supply+ 12V DC

Dynamic range of up to 16 bit

Video

0.2 m
typ.
Cooling PCB
100mm x 60mm
(optional, plug-on)

0.2 m
typ.

Compatible to tec5 Operating Electronics

0.2 m
typ.

Logic PCB
100mm x 80 mm

34mm x 19mm
Sensor PCB
68mm x 45 mm

Power PCB
100mm x 60 mm

Advantages for ApplicationsThe series S703x of Hamamatsu back thinned/ backilluminated CCD arrays combines a high sensitivity
over the whole spectral range from deep UV to NIR
with the high dynamic range of a classical photodiode detector array. In addition these arrays areavailable with up to 1044 pixel. This makes it asuperior device for all types of UV-VIS-NIR
spectroscopy especially for low light level detection
like fluorescence or diffuse reflection measurements.
Due to the capability to detect even smallest amountsof light it allows short exposure times. Therefore, it isa perfect tool for high speed process control.
The preamplifier electronics provides an easy
integration in the existing family of detector array
Operating Electronics. This gives the user the benefit
to extend the own product line by a CCD based
device.

Working Principle
The preamplifier electronics interfaces directly theCCD chip. It provides all required digital signals for
managing the readout process of the array. In
addition it generates all necessary supply voltages
from a 12V DC input.
An optional temperature control board is available forcooled CCD types.

Peltier current, thermistor
0.5 m max.

Configuration of the DZA-S7030-4 system

Operation Modes
The preamplifier electronics supports both the socalled line-binning mode as well as the 2 dimensional
readout mode.
Mode 'Line-binning'
In this operating mode, the information of all pixels ofa column is combined. It imitates a classical 1D arrayfor spectroscopy with a large pixel height, providing
all the advantages of a large pixel area. The arraydata is compressed to a one dimensional format sothat there is no disadvantage of long readout times
due to high number of pixels.
Mode 'Imaging'
The imaging mode allows to access the informationfrom each individual pixel. Various “submodes” arepossible.
Currently, the imaging mode is not supported by thesubsequent Operating Electronics.
Suitable electronics are in preparation.

The preamplifier electronics connects to a special
Operating Electronics (Front End Electronics andInterface Electronics), where further data processing
like AD conversion, buffering and data transfer to thecomputer is performed.

株式会社

スペクトラ・コープ〒164‑0011 東京都中野区中央4‑4‑5第一小林ビル
Tel:03‑5328‑2858 Fax:03‑5328‑2859
URL http://www.spectra.co.jp

Supported Sensors / Detector Arrays
Supported CCDs: Hamamatsu back thinned / backilluminated CCDs series S7030, S7031, S7033,
S7034, 7170 and 7171 (see table below)
TypeCooling

Pixel countS7030-0906
S7031-0906
S7030-0907
S7031-0907
S7033-0907
S7034-0907
S7030-0908
S7031-0908
S7170-0909
S7171-0909
S7030-1006
S7031-1006
S7030-1007
S7031-1007
S7033-1007
S7034-1007
S7030-1008
S7031-1008

Non-cooled
One-stage TE-cooled
Non-cooled
One-stage TE-cooled
Non-cooled
One-stage TE-cooled
Non-cooled
One-stage TE-cooled
Non-cooled
One-stage TE-cooled
Non-cooled
One-stage TE-cooled
Non-cooled
One-stage TE-cooled
Non-cooled
One-stage TE-cooled
Non-cooled
One-stage TE-cooled

532 × 64
532 × 64
532 × 128
532 × 128
532 × 128
532 × 128
532 × 256532 × 256532 × 520
532 × 520
1044 × 64
1044 × 64
1044 × 128
1044 × 128
1044 × 128
1044 × 128
1044 × 256
1044 × 256

Table 1: List of supported CCD’s

Board Arrangement
The preamplifier electronics is of modular design
and, therefore, consists of several boards orfunctional units, respectively.
Sensor board: small board for carrying the sensor
chip. It has a big opening for access to the chip
backplane. This allows to attach heat conducting
devices for proper temperature control. The compact
size allows easy integration in all optical setups, e.g.
the distance of the chip to a spectrometer input canbe very short, which ends up in a small split-off angle
between optical input and output of the imaging
spectrometer device.

tec5 AGIn der Au 25
61440 Oberursel
Germany
Phone: +49 6171/9758-0
Fax: +49 6171/9758-50
e-mail: Info@tec5.comInternet: www.tec5.com

Logic board: provides digital management of thesensor array (clocking and control / status functions)Power supply board: generates all necessary supply
voltages for the unit out of +12 VDC.
Cooling controller board: contains the temperature
controller chip to stabilize a set temperature of thesensor chip. The optional board (not all supported
CCDs contain / require cooling) can be slipped on tothe power supply board.
All boards are interconnected by flat-ribbon cables.
For operation, a tec5 Operating Electronics with aFront End Electronics of type FEE-CCD is required.

Technical Data / Performance
Configuration: line-binning mode
readout time of a detector array with 1044 lines
less than 10 ms
minimum integration time equivalent to readout
time
intensity resolution: 16 Bit
operating mode selection by software and or
solder gaps
modular board configuration
required power: + 12 VDC, 3A (with temperaturecontroller)
dimensions:sensor PCB: 68 mm x 45 mm
logic PCB: 100 mm x 75 mm- power supply PCB: 100 mm x 60 mm- cooling controller PCB: 100 mm x 60mm