EV GROUP®

Heterogeneous Integration
Competence Center™

www.EVGroup.com

EVG Heterogeneous Integration Competence Center™
at a Glance

Direct Bonding

Metal Bonding

Temporary Bonding

HeterogeneousIntegration / C2W

EVG’s Heterogeneous Integration Competence Center isdesigned to assist customers in leveraging EVG’s processsolutions and expertise to enable new and enhanced products
and applications driven by advances in system integration andpackaging. These include solutions and applications for highperformance computing and data centers, the Internet of Things(IoT), autonomous vehicles, medical and wearable devices,
photonics and advanced sensors.

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Process Integration■

Metrology

EVG has an extensive background in heterogeneous integration,
providing solutions for this key technology trend for more than
20 years. Among these are: permanent wafer bonding—including
direct fusion and hybrid bonding for 3D packaging and metalbonding—and die-to-wafer bonding with and without collective
carriers for integration of III-V compound semiconductors
and silicon as well as high-density 3D packaging; temporary
bonding and debonding, including mechanical, slide-off/liftoff, and UV laser assisted; thin-wafer handling; and innovative
lithography technologies, including mask aligners, coaters anddevelopers, and maskless exposure / digital lithography.
EVG’s new HI Competence Center provides an open accessinnovation incubator for our customers and partners acrossthe microelectronics supply chain to collaborate while pooling
our solutions and process technology resources to shorten
development cycles and time to market for innovative devices
and applications enabled by heterogeneous integration.

Cleanroom at EVG headquarters■■■

Plasma ActivatedBonding
Anodic Bonding
ComBond®
Hybrid Bonding<100 nm overlay■Eutectic Bonding
Solder Bonding
Transient Liquid FaceBonding■■

Metal Thermo
Compression Bonding■

Adhesives,Tapes Waxes
Slide Off
Mechanical Debonding(ZoneBond®)

Wafer Level
Die Transfer

Laser Debonding

EVG Heterogeneous Integration Competence Center™
Open Access Innovation Incubator
Resist Processing

LithographyDeveloping■■■

Spin Coating■■■

Maskless Exposure■■

Thick Film

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Bumping

Spray CoatingThin Film(down to 40 nm)
Edge Coating

Proximity Mask Aligner
Fine Pitch
Redistribution
Customized Exposure
Processes for Novel
Device Requirements■

DI rinse, Solvents
SprayPuddle
Temperature
Enhanced
Megasonic
Enhanced

Advanced Resist
Coating■■■■■

NanoFill™
NanoSpray™
Cover Spin
Black Resists
Quantum Dots
Plasma Dicing

www.EVGroup.com

EV Group

EV Group Global Locations Application Laboratories

EVG’s equipment solutions and manufacturing processexpertise are critical to supporting many applications within
the semiconductor industry, with proven success in a variety
of key markets, including:Headquarters
EV Group
E. Thallner GmbHDI Erich Thallner Strasse 14782 St. Florian am Inn+43 7712 5311 0
ProcessTechnologySD@EVGroup.com

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Advanced Packaging, 3D Interconnect■

Nanotechnology

MEMS (MicroElectroMechanical Systems)
SOI (Silicon-On-Insulator)
Compound Semiconductor andSilicon-based Power Devices

EVG’s recent developments in maskless lithography, fusion
and hybrid wafer bonding as well as other processes offer
new capabilities to develop next generation heterogeneousand 3D integrated device solutions.
EV Group (EVG) offers equipment solutions for:

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Wafer Bonding
Mask Aligner

Japan
EV Group Japan KK
Yokohama Business Park East Tower 1F134, Godo-cho, Hodogaya-ku,
Yokohama-shi, Kanagawa, 240-0005+81 45 348 0665
Technology@EVGroup.jp
North America
EV Group Inc.
7700 South River ParkwayTempe, AZ 85284+1 480 305 2400
ProcessUS@EVGroup.com

Coating and Development
Temporary Bonding & Debonding
CleaningMetrology
Maskless Exposure / Digital Lithography

Contact
Companies and other parties interested in partnering with
the Heterogeneous Integration Competence Center™ cancontact EV Group by phone at +43 7712 5311 0 or e-mail.
Get in touch:
HeterogeneousIntegration@EVGroup.com

GEMINI® FB XTAutomated Production
Wafer Bonding System
up to 300 mm

MLE™ Maskless Exposure
Technology Moving beyond
traditional mask-based lithoghraphy
toward digital lithography technology

www.EVGroup.com

Printed on paper from sustainable sources. Data, design and specifications may not simultaneouslyapply; or depend on individual equipment configuration, process conditions and materials and mayvary accordingly. EVG reserves the right to change data, design and specifications without priornotice. All trademarks, logos, website addresses or equipment names are registered trademarks
and/or the property of EV Group or their respective owners.
Printed on paper from sustainable sources© EV Group (EVG). All rights reserved. V22/01

www.EVGroup.com