DXR S100 ProDigital Detector
Waygate Technologies next generation industrial
flat panel detector for 2D radiography inspection
and 3D-CT- Superior Image Quality- High Efficiency

Waygate Technologies DXR S100 Pro

Powering the next generation of X-ray inspection and 3D-CT
The DXR S100 Pro is the latest in WaygateTechnologies next generation industrial X-ray
flat panel detector platform.

The DXR S100 Pro detector combines superior image
quality with improved detection capability at 100 µm
pixel size and 300 x 250 mm² detection area.
High contrast-to-noise-ratio and extremely fast
readout leading in increased inspection speed atoutstanding image quality.
Based on industrial leading X-ray detector
technology, Waygate Technologies expands its
100 µm detector solutions offerings with its new
7.5 M pixels detector for precise industrial X-ray
and CT applications.

Key features & benefits• Large size X-ray detector of 12” x 10’’ active areawith 3008 x 2512 pixel matrix to enable incredible
inspection productivity with 7.5 M pixels• Superior 100 µm resolution for easy detection ofsubtle details. Frame rates up to 20 fps leading
to brilliant live imaging performance• Improved CsI scintillator technology support
outstanding inspection efficiency with ultrahighsensitivity and contrast for a wide range of X-rayenergies• Fast and reliable system integration isaccomplished via Gigabit Ethernet data
communication

Applications – Increased industrial inspection qualityand productivity• Aerospace and Automotive castings• Batteries inspection• Additive manufacturing• Electronics• Composite parts• 3D Metrology• Plastics & Connectors• Production & Scientific application

Waygate Technologies DXR S100 Pro
100 µm imaging: See more to know more

Waygate Technologies offers a variety of 100 and 200 µm pixel pitch detectors
to provide the best solution to fulfill your individual inspection tasks.
Depending on your detection needs and budget, our application experts will
recommend the best solution for you. In this example it is demonstrated that
inspecting solder joints in assembled devices, which are not directly accessible for maximum magnification, will gain much better results when using
a 100 µm detector compared to standard 200 µm. To visualize the pixels, theimages have been digitally zoomed.

DXR S100 Pro

Dynamic41|020m)
oo(ZDXR 250oo(Zro0Pm)

DX10RSoom)(ZRTGeneral specifications
DXR S100 Pro
Pixel Size

100 µm; 200 µm with 2 x 2 binning / 400 µm with 4 x 4 binning

Active Area (approx.)

300 x 250 mm (12" x 10")

Pixel Matrix

3008 x 2512 (7.5 MP)

Max. Frame Rate

Full FOV: 5.5 fps
11 fps (2x2)
20 fps (4x4)Dynamic Range

7000 : 1Low Ghosting

To take images in quick succession

ASTM E2597

CompliantHigh Sensitivity

Shorter exposures for high efficiency

Phoenix DXR S100 Pro – Your advantages• 100 µm resolution to reveal even smallest details• Large active area to cover wide range of applications• Reduce inspection times due to competent detector efficiency
and adaptive imaging modes

WaygateTechnologies
Niels-Bohr-Str. 731515 Wunstorf
Germany
Tel.: +49 5031 172 100
Fax: +49 5031 172 299
E-mail: phoenix-info@bakerhughes.com

Copyright 2022 Baker Hughes Company. All rights reserved.

BHFF-31364_EN (02/2022)

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