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K band MMIC
Sub-Harmonic Mixer

K-SHM-2225

Previously named LE-Ka1340309

GaAs MMIC Sub-Harmonic Mixer 22.5 - 25 GHz

OverviewFeatures

K-SHM-2225 is a GaAs MMIC sub-harmonic mixer, covering frequencies from•

22.5 – 25GHz.

22.5GHz to 25GHz with LO signals in the range of 10.8GHz to 13.6GHz. This MMIC•

<16dB conversion loss.

MMIC incorporates an anti-parallel diode pair and is useable for LO drive levels of•

Low LO drive level requirement.

<10dBm at the first sub-harmonic frequency, with conversion losses <16dB achieved
with an LO power of 8dBm.
The MMIC is fully passivated for additional protection and has all bond pads andApplications

backside gold plated. The MMIC is compatible with precision die attach methods, as•Phase-locked loops.

well as thermo-compression and thermosonic wire bonding, making it ideal for MCM•

High speed data communications.

and hybrid microcircuit applications. All data shown is measured with the chip in a 50•

Space communications.

Ohm environment and contacted with RF probes.

•IOT.

•Security.

K band Datasheet

K-SHM-2225

Issue date: 30 April 21

DOC REV 3

Page 1 of 7

No licence is granted under any patent or any patent rights of Arralis. Information furnished by Arralis is believed to be accurate. No responsibility is assumed by Arralis for its use,
nor for any infringements on the rights of other parties that may result for the use of the information herein. All specification are subject to change without notice.

GaAs MMIC Sub-Harmonic Mixer 22.5 - 25GHz

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product datasheet

Specification Overview

ParameterMin.

RF Frequency

Notes
All tests are carried out at 25°C.

Max.

Units

22.5		25GHzLO Frequency

10.8

13.6

GHz

Fixed RF = 24GHzIF Frequency

0		3.2GHz

Fixed RF = 24GHz

Conversion Loss		Typ.

1215.5		CommentsdB

Absolute Maximum Ratings

Parameter			Rating
RF Drive Level (OUT, 24, 12REF)			

25dBm

Storage Temperature			−65°C to +150°C

Channel Temperature			+150°COperating Temperature			−40°C to +85°C

K band Datasheet

K-SHM-2225

Issue date: 30 April 21

ESD (electrostatic discharge)
sensitive device. Charged devices
and circuit boards can discharge
without detection. Although thisproduct features proprietary
protection circuitry, damage mayoccur on devices subjected to ESD.
Proper ESD precautions should
be taken to avoid performancedegradation or loss of functionality.

DOC REV 3

Page 2 of 7

No licence is granted under any patent or any patent rights of Arralis. Information furnished by Arralis is believed to be accurate. No responsibility is assumed by Arralis for its use,
nor for any infringements on the rights of other parties that may result for the use of the information herein. All specification are subject to change without notice.

GaAs MMIC Sub-Harmonic Mixer 22.5 - 25GHz

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product datasheet

Measured Performance Data
(LO=12GHz, 8dBm; RF=-6dBm)
2000

Figure 1
Output Frequency

1800
1600

Output Frequency (MHz)

1400
1200
1000
800
600
400
200
0

22.50

23.00

23.50

24.00

24.50

25.00

RF Frequency (GHz)(LO=12GHz, 8dBm; RF=-6dBm)
20

Figure 2
Conversion Loss

19
18

Conversion Loss (dB)

17
16
15
14
13
12
1110

22.50

23.00

23.50

24.00

24.50

25.00

RF Frequency (GHz)K band Datasheet

K-SHM-2225

Issue date: 30 April 21

DOC REV 3Page 3 of 7

No licence is granted under any patent or any patent rights of Arralis. Information furnished by Arralis is believed to be accurate. No responsibility is assumed by Arralis for its use,
nor for any infringements on the rights of other parties that may result for the use of the information herein. All specification are subject to change without notice.

GaAs MMIC Sub-Harmonic Mixer 22.5 - 25GHz

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product datasheet

Outline Drawing

4380

105
82
86
82

1051

198

86
82

24

65
1191

105
82

334

556

65

1470

86

915

82

82

65

105
1258
1394
1534

Notes
1.

All dimensions are in um.

2.

RF bond pads are 105 x 80um.

3.

All pads have gold metalisation.

4.

Gold backside metalisation.

5.

Backside metal is ground.

6.

Die thickness is 100um

Die Packing Information
All die are delivered using gel-paks unless otherwise requested.

K band Datasheet

K-SHM-2225

Issue date: 30 April 21

DOC REV 3

Page 4 of 7

No licence is granted under any patent or any patent rights of Arralis. Information furnished by Arralis is believed to be accurate. No responsibility is assumed by Arralis for its use,
nor for any infringements on the rights of other parties that may result for the use of the information herein. All specification are subject to change without notice.

GaAs MMIC Sub-Harmonic Mixer 22.5 - 25GHz

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product datasheet

Pad Descriptions

NameDescription

OUT		

Output IF frequency pad

12REF

Input pad for sub-harmonic LO signal

24		

Input pad for RF signal

BOTTOM

The die backside must be connected to RF/DC ground

Connection Configurations

K band Datasheet

K-SHM-2225

Issue date: 30 April 21

DOC REV 3

Page 5 of 7

No licence is granted under any patent or any patent rights of Arralis. Information furnished by Arralis is believed to be accurate. No responsibility is assumed by Arralis for its use,
nor for any infringements on the rights of other parties that may result for the use of the information herein. All specification are subject to change without notice.

GaAs MMIC Sub-Harmonic Mixer 22.5 - 25GHz

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product datasheet

General Notes on Assembly

Die should be mounted on conductive material such as gold-plated metal to provide agood ground and suitable heat sink, if necessary.
1.

Attaching the die using Au/Sn preforms is preferable. The Eutectic melt for Au/
Sn occurs at approximately 280oC so the die (plus mount and preform) is initiallyheated up to 180oC and then it is heated for approximately 10 seconds to 280oC
using a nitrogen heat gun. The device will survive 10 seconds at this temperature.
The static breakdown for GaAs devices is approximately 330oC.

2.

Pure, dry nitrogen should be used as the heat source.

3.

If the devices cannot be lifted/ placed by a vacuum device, then ESD die-lifting
tweezers are preferable.

4.

Aluminium wire must not be used.

Disclaimer
The information contained herein is believed to be reliable; however, Arralis makes no warranties
regarding the information and assumes no responsibility or liability whatsoever for the use of theinformation contained herein. All information is subject to change without notice, therefore customers
should obtain the latest relevant information before placing orders for Arralis products. The information
contained herein does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any
other intellectual property rights.
This information does not constitute a warranty with respect to the product described, and Arralisdisclaims any and all warranties either expressed or implied, relating to sale and/or use of Arralis products
including liability or warranties relating to fitness for a particular purpose, consequential or incidental
damages, merchantability, or infringement of any patent, copyright or other intellectual property right.
Without limiting the generality of the foregoing, Arralis products are not warranted or authorised for use
as critical components in medical, life-saving, or life-sustaining applications, or other applications wherea failure would reasonably be expected to cause severe personal injury or death.
Copyright 2021 © Arralis

K band Datasheet

K-SHM-2225

Issue date: 30 April 21

DOC REV 3

Page 6 of 7

No licence is granted under any patent or any patent rights of Arralis. Information furnished by Arralis is believed to be accurate. No responsibility is assumed by Arralis for its use,
nor for any infringements on the rights of other parties that may result for the use of the information herein. All specification are subject to change without notice.

©2021 Arralis Ltd. All rights reserved. Trademarks and registered trademarks are the property of their respective owners.

Arralis USA OfficeArralis European Offices+(1) 386 301 3249 (USA)t: +(44) 1793 239670 (UK)e: sales@arralis.com

K band Datasheetarralis.com
K-SHM-2225

e: emilie.wren@arralis.com

Issue date: 30 April 21

DOC REV 3

Page 7 of 7

No licence is granted under any patent or any patent rights of Arralis. Information furnished by Arralis is believed to be accurate. No responsibility is assumed by Arralis for its use,
nor for any infringements on the rights of other parties that may result for the use of the information herein. All specification are subject to change without notice.