Security Level:

HiSilicon Wireless Chipset Presentation
Tokyo, 25th Jun., 2012

HISILICON TECHNOLOGIES CO., LTD.

www.hisilicon.com

Contents• HiSilicon Overview• Strategy & Roadmap• Balong Cases Sharing

HISILICON TECHNOLOGIES CO., LTD.

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HiSilicon Profile• Founded in 2004

• 4000+ staffs• IC fables company

Chipset Portfolio

Worldwide R&D Centers
Shenzhen, China• ABB/PMU/SOC platform• IP/Backend design/Package
Shanghai, China• G/U chipset solution• RFIC/RF subsystem• Application processor
Beijing, China• GUL chipset solutionUSA• RF technology• RFICSweden• Wireless algorithm• Advanced wireless technology

Cellular Modem
Balong…
USB Dongle

Mobile WiFi

Wireless Dongle* Balong is the family name of Modem

App Processor
K3…
Smart Phone

TabletDPF* K3 is the family name of application processor

Multimedia
Video Surveillance

Infrastructure

TV

IPTV STB

Page 3…

…

2G/3G/LTE
OpticalHISILICON TECHNOLOGIES CO., LTD.

CPE

Datacom

AccessHiSilicon Solution Serving Customers all over the World

Portfolio GSM/GPRS/EDGE
 HSDPA / HSUPA HSPA+ LTE

HISILICON TECHNOLOGIES CO., LTD.

Device Type

100+ countries, 200+ OperatorsPage 4

 USB Dongle
 Mobile WiFi
 CPEContents• HiSilicon Overview• Strategy & Roadmap• Balong Cases Sharing

HISILICON TECHNOLOGIES CO., LTD.

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Challenges Wireless Chipset Platform is Facing• Wireless technology evolution• Multimode for legacy
technology• Smaller and thinner terminals<8mm

20*20 mm2

• Powerful CPU/GPU• Lower Power consumption and lower
eBOM

65*24.5 mm2

HISILICON TECHNOLOGIES CO., LTD.

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HiSilicon Wireless Chipset Strategy
Key Technologies

Variety of Devices
Wireless Terminal Chipset SolutionAdvanced wireless technology

Processor technology andarchitecture(DSP, GPU, SDR, etc）

TabletSmart Phone

Application
Processor

RFIC&RF Subsystem technology

Connectivity（WIFI, GPS/BT, FM、NFC）

High performance ADC/DAC

Low power circuit and system designSemiconductor process and package

USB Dongle

Smart Phone
Solution

Mobile WiFi

MBB MODEM
CPE

technology

ModuleHISILICON TECHNOLOGIES CO., LTD.

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HiSilicon Wireless Chipset Roadmap
TD-LTE/LTE FDD/TD-SCDMA/WCDMA/EDGE/GPRS/GSMSolution

TD-LTE/LTE FDD

 USB Dongle

Smartphone

 CPE

 MiFiTablet USB dongle

 CPE

PC Module TD-LTE 1.9G/2.3G/2.6G/3.5G
 LTE FDD 2.6G/1.8G/900/800/700/AWS
 GSM 850/900/1800/1900
 UMTS 2.1G/1.9G/900M/1.7G/1.5G
TD-SCDMA 1.9G/2.1G/2.3G

 LTE TDD 1.9G/2.3G/2.6G/3.5G

RFIC

 LTE FDD 800M/2.6G/1.8G

Balong 700

Modem TD-LTE/LTE FDD R8
 65nmCS: 2010Q42010

HISILICON TECHNOLOGIES CO., LTD.

 TD-LTE/LTE FDD R9
 TD-SCDMA UMTS/DC-HSPA+MIMO
GSM/GPRS/EDGE

Balong 710

2011 40nmCS :2012Q22012

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The Fastest Chipset Solution released in MWC 2012

Multi-Mode

LTE FDD/LTE TDD/WCDMA/TD-SCDMA/GSM

High Performance

K3V2160

Cat4(150M/50M)
 DC+MIMO(84M/23M)
 4 Core @1.5GHz
 16 Core Super GPU/64-bit Memory System
Balong 710
15014012011210084DL(Mbps)

8050604030Low Power Consumption

UL(Mbps)
23Global Band

200

TD-LTE Cat4@20MHz

LTE FDD Cat4@2*20MHz DC+MIMO@2*10MHz

200M~6GHz

LTE Cat4/3G DC+MIMO
HISILICON TECHNOLOGIES CO., LTD.

Page 9Balong 710-1st Platform to Support LTE Cat4 and 3G DC+MIMO

DC+MIMO Downlink demonstration
Downlink 82Mbps at Shanghai withHuawei network

ModeBalong 710LTE FDD@2*20MHz

150/50M

LTE FDD@2*10MHz

75/25M

LTE TDD(2:2)@20MHz

82/20M

LTE TDD(3:1)@20MHz

112/10M

HISILICON TECHNOLOGIES CO., LTD.

LTE FDD: Downlink 148Mbps with

LTE TDD: Downlink 109Mbps with Uplink

Uplink 45Mbps simultaneously with
Band 7@20MHz

8Mbps simultaneously with BandPage 1038@20MHz

View of VoLTE Market Window

VoIMS/SRVCC Commercial

Target LTE mobile voice
LTE VoIMS Handset• IMS based VoLTE• Single Radio Voice continuity(SRVCC) support handover to 2G/3G

LTE Data with CS Voice, 2011H2Initial LTE voice Solution
Early LTE Handset• Simultaneous Voice and LTE• CS Fallback (CSFB )Data Only Devices, 2011H1Initial LTE Solution
LTE CPE/USB Dongle• No Voice or VoIP
2011

HISILICON TECHNOLOGIES CO., LTD.

201220132014

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LTE Voice Solution
CSFB

Dual Radio

SRVCC

VoCS

VoCS

VoLTE

CSFB
UE

2G/3G
CS

2G/3G
CS

2G/3G
CS
2G/3G

2G/3G

2G/3GUESvSGs
Dual Radio UE

HOVoIP
LTE
EPC

LTE
EPC

CSFB
UE

LTEPS

LTE
EPC
VoLTE
UE

LTE

LTE

Balong 710 can support CSFB, SRVCC and Dual Radio with different software release
HISILICON TECHNOLOGIES CO., LTD.

Page 12IMSCoreContents• HiSilicon Overview• Strategy & Roadmap• Balong Cases Sharing

HISILICON TECHNOLOGIES CO., LTD.

Page 13

TD-LTE demonstration in EXPO Shanghai
Expo Area Covered by TD-LTE

Applications demonstrated in EXPOVideo Broadcast

Video Surveillance

Conference
A
Video Conference

The First TD-LTE CPE Solution
HISILICON TECHNOLOGIES CO., LTD.

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ConferenceBE398s: World’s 1st LTE TDD Device Certified by GCF

Fukuoka FT, 12th – 26th Sep.
E398s
4 moths TestingE398sOct., 2011

Jul., 2011

•E398s, powered by Balong 700, was the 1st TD-LTE
device certified by GCF

HISILICON TECHNOLOGIES CO., LTD.

•Softbank uses E398s to do both driver test
and stationary test before launching their
LTE network commercially.

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Balong LTE Solution Accelerated German DD800 MarketShanghai
Expo CPE

B1000

Balong LTE B700
HUAWEI
Another Vendor• LTE 800MHz / GSM modernization• 1st LTE deployment on DD800

B390s

•

For LTE FDD, Balong-based LTE devices have been commercially launched in German TOP3 operators.

•Shipped more than 120K units since 2011.

HISILICON TECHNOLOGIES CO., LTD.

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HISILICON TECHNOLOGIES CO., LTD.

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