EPO-TEK® H62
Technical Data Sheet
For Reference Only
Thermally Conductive Epoxy

Date:
Rev:
No. of Components:
Mix Ratio by Weight:
Specific Gravity:
Pot Life:
Shelf Life- Bulk:

Recommended Cure: 150°C / 1 Hour

September 2017
VIISingle
N/A
1.78
15 DaysSix months at -40°C

Minimum Alternative Cure(s):May not achieve performance properties listed below
150°C / 30 Minutes
120°C / 1 HourNOTES:● Container(s) should be kept closed when not in use.
● Filled systems should be stirred thoroughly before mixing and prior to use.
● Performance properties (rheology, conductivity, others) of the product may vary from those stated on the data sheet when bi-pak/syringe packaging or
post-processing of any kind is performed. Epoxy’s warranties shall not apply to any products that have been reprocessed or repackaged from Epoxy’s
delivered status/container into any other containers of any kind, including but not limited to syringes, bi-paks, cartridges, pouches, tubes, capsules, films
or other packages.
● Failure to ship frozen may result in viscosity growth beyond the range of values herein; customer assumes all risk.

Product Description: EPO-TEK® H62 is a single component, electrically insulating, and thermally conductive epoxy adhesive. It may
be used for heat-sinking semiconductor, hybrids, or electronic circuits.
Typical Properties: Cure condition: 150°C / 1 Hour
Different batches, conditions & applications yield differing results.
Data below is not guaranteed. To be used as a guide only, not as a specification. * denotes test on lot acceptance basis
PHYSICAL PROPERTIES:* Color (before cure):* Consistency:* Viscosity (23°C) @ 10 rpm:
Thixotropic Index:* Glass Transition Temp:
Coefficient of Thermal Expansion (CTE):
Below Tg:
Above Tg:
Shore D Hardness:
Lap Shear @ 23°C:
Die Shear @ 23°C:
Degradation Temp:
Weight Loss:@ 200°C:@ 250°C:@ 300°C:
Suggested Operating Temperature:
Storage Modulus:
Ion Content:

Black, opaque
Smooth thixotropic paste
17,000-27,000 cPs
1.9≥ 110 °C (Dynamic Cure: 20-200°C/ISO 25 Min; Ramp -10-200°C @20°C/Min)
48
11980600≥ 15436

x 10-6 in/in°C
x 10-6 in/in°C
psiKg°C

5,334 psi

* Particle Size:

0.310.420.62< 375656,630
55 ppm96 ppm≤ 50%%%°C (Intermittent)psiNa+:
136 ppm
K+:
28 ppmmicrons

ELECTRICAL AND THERMAL PROPERTIES:
Thermal Conductivity:
Volume Resistivity @ 23°C:
Dielectric Constant (1KHz):
Dissipation Factor (1KHz):

0.5≥ 2 x 1013
4.65
0.011

W/mK
Ohm-cmOPTICAL PROPERTIES @ 23°C:
Spectral Transmission:
Refractive Index:

Cl-:
NH4+:

< 1% @ 300-2500
N/A

nm

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com

EPO-TEK® H62
Technical Data Sheet
For Reference Only
Thermally Conductive Epoxy

EPO-TEK® H62 Advantages & Suggested Application Notes:● Black and opaque appearance; it can block out light in opto-electronic devices.
● Semiconductor encapsulant for COB packaged die. It may be used as a glob top DAMaround the chip.
● SMD “staking” material or Surface Mount Adhesive (SMA). The SMA may be used for
double-sided PCB bonding of components; staking caps and resistors to ceramic or
hybrid circuits. High viscosity adhesive paste has enough wet “green strength” to hold
SMD’s to the PCB prior to cure.
● Alternatives are available in different viscosity ranges and colors; contact
techserv@epotek.com for your best recommendation.
● Excellent adhesion to ferrous and non-ferrous metals, glass, ceramics, PCB, and mostplastics.
● Thixotropic paste appearance makes it capable of syringe dispensing techniques, stencil
or screen printing, or hand applications by brush or spatula

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com