PEMH17; PUMH17
NPN/NPN resistor-equipped transistors;
R1 = 47 kΩ, R2 = 22 kΩ
Rev. 03 — 15 November 2009

Product data sheet

1. Product profile
1.1 General description
NPN/NPN Resistor-Equipped Transistors (RET).
Table 1.

Product overview

Type numberPackage
NXP

JEITA

NPN/PNP
complement

PNP/PNP
complement

PEMH17

SOT666-

PEMD17

PEMB17

PUMH17

SOT363

SC-88

PUMD17

PUMB17

1.2 Features
Built-in bias resistors
Simplifies circuit design
Reduces component count
Reduces pick and place costs

1.3 Applications
 Low current peripheral driver Control of IC inputs
 Replaces general-purpose transistors in digital applications

1.4 Quick reference data
Table 2.

Quick reference data

SymbolParameterConditions

MinTypMax

UnitVCEOcollector-emitter voltage

open base--50

VIO

output current (DC)

--

100mA

R1

bias resistor 1 (input)

334761kΩ

R2/R1

bias resistor ratio

0.37

0.47

0.57

PEMH17; PUMH17

NXP Semiconductors

NPN/NPN resistor-equipped transistors; R1 = 47 kΩ, R2 = 22 kΩ

2. Pinning information
Table 3.

Pinning

PinDescription

Simplified outline

1GND (emitter) TR1

2input (base) TR1

3output (collector) TR2

4GND (emitter) TR2

5input (base) TR2

6output (collector) TR1

654Symbol
65

R14R2TR2

123TR1001aab555

R21R123
sym063

3. Ordering information
Table 4.

Ordering information

Type numberPackage
NameDescription

Version

PEMH17-plastic surface mounted package; 6 leads

SOT666

PUMH17SC-88

plastic surface mounted package; 6 leads

SOT363

Table 5.

Marking codes

4. Marking
Type number

Marking code[1]PEMH175T

PUMH17H4*[1]* = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia* = W: made in China

PEMH17_PUMH17_3

Product data sheet© NXP B.V. 2009. All rights reserved.

Rev. 03 — 15 November 2009

2 of 9

PEMH17; PUMH17

NXP Semiconductors

NPN/NPN resistor-equipped transistors; R1 = 47 kΩ, R2 = 22 kΩ

5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
SymbolParameter

Conditions

MinMax

UnitPer transistor
VCBO

collector-base voltage

open emitter-50VVCEO

collector-emitter voltageopen base-50VVEBO

emitter-base voltage

open collector

-10V

VI

input voltage
positive-+40V

negative-

−10V-

100mA

-

100mA

IO

output current (DC)ICM

peak collector current

Ptot

total power dissipation

Tamb ≤ 25 °C

SOT363

[1]

-

200mW

SOT666[1][2]

-

200mW

Tstg

storage temperature−65+150°C

Tj

junction temperature

-

150°C

Tamb

ambient temperature−65+150°C

Per device
Ptot

total power dissipation

Tamb ≤ 25 °C

SOT363[1]-300mW

SOT666[1][2]-300mW[1]

Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.

[2]

Reflow soldering is the only recommended soldering method.

PEMH17_PUMH17_3

Product data sheet© NXP B.V. 2009. All rights reserved.

Rev. 03 — 15 November 2009

3 of 9

PEMH17; PUMH17

NXP Semiconductors

NPN/NPN resistor-equipped transistors; R1 = 47 kΩ, R2 = 22 kΩ

6. Thermal characteristics
Table 7.

Thermal characteristics

SymbolParameterConditions

MinTypMax

UnitPer transistor
thermal resistance fromjunction to ambientRth(j-a)

in free air

SOT363

[1]--

625

K/W

SOT666[1][2]--

625

K/W

SOT363

[1]--

416

K/W

SOT666[1][2]

--

416

K/W

Per device
Rth(j-a)thermal resistance fromjunction to ambientin free air[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]

Reflow soldering is the only recommended soldering method.

7. Characteristics
Table 8.
Characteristics
Tamb = 25 °C unless otherwise specified.
SymbolParameter

Conditions

MinTypMax

Unit

Per transistor
ICBO

collector-base cut-offcurrent

VCB = 50 V; IE = 0 A--100nAICEO

collector-emitter
cut-off current

VCE = 30 V; IB = 0 A--1μA

VCE = 30 V; IB = 0 A;
Tj = 150 °C--50μAμA

IEBO

emitter-base cut-offcurrent

VEB = 5 V; IC = 0 A--110hFE

DC current gain

VCE = 5 V; IC = 5 mA60--VCEsat

collector-emittersaturation voltage

IC = 10 mA; IB = 0.5 mA--150mV

VI(off)off-state input voltage

VCE = 5 V; IC = 100 μA-1.7

1.2VVI(on)on-state input voltage

VCE = 0.3 V; IC = 2 mA

42.7-V

R1

bias resistor 1 (input)

334761kΩ

0.37

0.47

0.57

--2.5

R2/R1

bias resistor ratio

Cccollector capacitance

VCB = 10 V; IE = ie = 0 A;
f = 1 MHzPEMH17_PUMH17_3

Product data sheet

pF© NXP B.V. 2009. All rights reserved.

Rev. 03 — 15 November 2009

4 of 9

PEMH17; PUMH17

NXP Semiconductors

NPN/NPN resistor-equipped transistors; R1 = 47 kΩ, R2 = 22 kΩ

006aaa184

103(2)

hFE006aaa185

102(1)

VCEsat(mV)

(3)

(1)

102(2)(3)

10110−1

11010−1102101

I C (mA)

VCE = 5 V

IC/IB = 20

(1) Tamb = 100 °C(1) Tamb = 100 °C(2) Tamb = 25 °C(2) Tamb = 25 °C(3) Tamb = −40 °C

Fig 1.

102

10I C (mA)(3) Tamb = −40 °C

DC current gain as a function of collectorcurrent; typical values

Fig 2.

006aaa186

102VI(on)(V)

Collector-emitter saturation voltage as afunction of collector current; typical values
006aaa187

10VI(off)
(V)

10(2)

(1)

(1)
(2)
(3)

1(3)

110−110−1

11021010−110−210−1

IC (mA)

VCE = 5 V

(1) Tamb = −40 °C(1) Tamb = −40 °C(2) Tamb = 25 °C(2) Tamb = 25 °C(3) Tamb = 100 °C(3) Tamb = 100 °C

On-state input voltage as a function ofcollector current; typical values

Fig 4.

Off-state input voltage as a function ofcollector current; typical values

PEMH17_PUMH17_3

Product data sheet

10I C (mA)

VCE = 0.3 VFig 3.

1© NXP B.V. 2009. All rights reserved.

Rev. 03 — 15 November 2009

5 of 9

PEMH17; PUMH17

NXP Semiconductors

NPN/NPN resistor-equipped transistors; R1 = 47 kΩ, R2 = 22 kΩ

8. Package outline
2.2
1.8
6

1.1
0.8
5

1.7
1.5

0.45
0.15

46

0.6
0.5
54
0.3
0.1

2.2 1.35
2.0 1.15

1.7
1.5

pin 1index

1.3
1.1
pin 1 index

123

1
0.25
0.10

0.3
0.2

0.65

3
0.18
0.08

0.27
0.17

0.5

1.3

1Dimensions in mmFig 5.

206-03-16

Package outline SOT363 (SC-88)

Dimensions in mmFig 6.

04-11-08

Package outline SOT666

9. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]Type number Package

Description

Packing quantity
3000 4000 8000 10000

PEMH17SOT666

2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel

PUMH17[1]SOT363--315---115--

4 mm pitch, 8 mm tape and reel; T1[2]-115---135

4 mm pitch, 8 mm tape and reel; T2[3]-125---165

For further information and the availability of packing methods, see Section 12.

[2]

T1: normal taping[3]

T2: reverse taping

PEMH17_PUMH17_3

Product data sheet-© NXP B.V. 2009. All rights reserved.

Rev. 03 — 15 November 2009

6 of 9

PEMH17; PUMH17

NXP Semiconductors

NPN/NPN resistor-equipped transistors; R1 = 47 kΩ, R2 = 22 kΩ

10. Revision history
Table 10.

Revision history

Document ID

Release date

Data sheet status

Change notice

Supersedes

PEMH17_PUMH17_3

20091115

Product data sheet-PEMH17_PUMH17_2

Modifications:• This data sheet was changed to reflect the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technicalcontent.

• Figure 5 “Package outline SOT363 (SC-88)”: updated
PEMH17_PUMH17_2

20050503

Product data sheet-PUMH17_1

PUMH17_1

20031009

Product specification--

PEMH17_PUMH17_3

Product data sheet© NXP B.V. 2009. All rights reserved.

Rev. 03 — 15 November 2009

7 of 9

PEMH17; PUMH17

NXP Semiconductors

NPN/NPN resistor-equipped transistors; R1 = 47 kΩ, R2 = 22 kΩ

11. Legal information
11.1

Data sheet status

Document status[1][2]Product status[3]Objective [short] data sheet

Development

This document contains data from the objective specification for product development.

Preliminary [short] data sheet

Qualification

This document contains data from the preliminary specification.

Product [short] data sheet

Production

This document contains the product specification.

Definition[1]

Please consult the most recently issued document before initiating or completing a design.

[2]

The term ‘short data sheet’ is explained in section “Definitions”.

[3]

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.

11.2

Definitions

Draft — The document is a draft version only. The content is still underinternal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness ofinformation included herein and shall have no liability for the consequences ofuse of such information.
Short data sheet — A short data sheet is an extract from a full data sheetwith the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed andfull information. For detailed and full information see the relevant full datasheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, thefull data sheet shall prevail.

11.3

Disclaimers

General — Information in this document is believed to be accurate andreliable. However, NXP Semiconductors does not give any representations orwarranties, expressed or implied, as to the accuracy or completeness of suchinformation and shall have no liability for the consequences of use of suchinformation.
Right to make changes — NXP Semiconductors reserves the right to makechanges to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use ofNXP Semiconductors products in such equipment or applications andtherefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of theseproducts are for illustrative purposes only. NXP Semiconductors makes norepresentation or warranty that such applications will be suitable for thespecified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are soldsubject to the general terms and conditions of commercial sale, as publishedat http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unlessexplicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and suchterms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted orconstrued as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents orother industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a priorauthorization from national authorities.
Quick reference data — The Quick reference data is an extract of theproduct data given in the Limiting values and Characteristics sections of thisdocument, and as such is not complete, exhaustive or legally binding.

11.4

Trademarks

Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.

12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com

PEMH17_PUMH17_3

Product data sheet© NXP B.V. 2009. All rights reserved.

Rev. 03 — 15 November 20098 of 9

PEMH17; PUMH17

NXP Semiconductors

NPN/NPN resistor-equipped transistors; R1 = 47 kΩ, R2 = 22 kΩ

13. Contents11.11.21.3
1.4
234567891011
11.1
11.2
11.3
11.4
1213

Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
Packing information . . . . . . . . . . . . . . . . . . . . . 6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Contact information. . . . . . . . . . . . . . . . . . . . . . 8Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Please be aware that important notices concerning this document and the product(s)described herein, have been included in section ‘Legal information’.

© NXP B.V. 2009.

All rights reserved.

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 15 November 2009
Document identifier: PEMH17_PUMH17_3