EPO-TEK® 730
Technical Data Sheet
For Reference Only
General Purpose Epoxy
Date:
Rev:
No. of Components:
Mix Ratio by Weight:
Specific Gravity:
Pot Life:
Shelf Life- Bulk:

Recommended Cure: 80°C / 2 Hours

February 2021
VITwo1:1
Part A: 1.12
Part B: 0.94
1 Hour
One year at room temperature

Minimum Alternative Cure(s):May not achieve performance properties listed below
100°C / 30 Minutes
23°C / 24 HoursNOTES:● Container(s) should be kept closed when not in use.
● Filled systems should be stirred thoroughly before mixing and prior to use.
● Performance properties (rheology, conductivity, others) of the product may vary from those stated on the data sheet when bi-pak/syringe packaging or
post-processing of any kind is performed. Epoxy’s warranties shall not apply to any products that have been reprocessed or repackaged from Epoxy’s
delivered status/container into any other containers of any kind, including but not limited to syringes, bi-paks, cartridges, pouches, tubes, capsules, films
or other packages.
● Syringe packaging will impact initial viscosity and effective pot life, potentially beyond stated parameters.

Product Description: EPO-TEK® 730 is a two component, thixotropic, room temperature-curing epoxy adhesive.
Typical Properties: Cure condition: 80°C / 2 Hours
Different batches, conditions & applications yield differing results.
Data below is not guaranteed. To be used as a guide only, not as a specification. * denotes test on lot acceptance basis
PHYSICAL PROPERTIES:* Color (before cure):* Consistency:* Viscosity (23°C) @ 2.5 rpm:
Thixotropic Index:* Glass Transition Temp:
Coefficient of Thermal Expansion (CTE):
Below Tg:
Above Tg:
Shore D Hardness:
Lap Shear @ 23°C:
Die Shear @ 23°C:
Degradation Temp:
Weight Loss:@ 200°C:@ 250°C:@ 300°C:
Suggested Operating Temperature:
Storage Modulus:* Particle Size:

Part A: Tan
Part B: Tan
Smooth paste
80,000-120,000 cPs
2.1≥ 55 °C (Dynamic Cure: 20-200°C/ISO 25 Min; Ramp -10-200°C @20°C/Min)

ELECTRICAL AND THERMAL PROPERTIES:
Thermal Conductivity:
Volume Resistivity @ 23°C:
Dielectric Constant (1KHz):
Dissipation Factor (1KHz):

x 10-6 in/in°C
x 10-6 in/in°C

66248
64> 2,000≥ 10364psi
Kg°C

1.41
2.22
4.16
< 250123,527≤ 20%%%°C (Intermittent)psimicrons

N/A≥ 3 x 1013
3.17
0.021

3,556 psi

Ohm-cmEpoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com
A Meridian Adhesives Group Company

EPO-TEK® 730
Technical Data Sheet
For Reference Only
General Purpose Epoxy

EPO-TEK® 730 Advantages & Suggested Application Notes:● Excellent “all-purpose adhesive”. Many uses in job shop and repair businesses, home orhousehold, outdoor, recreation, camping, automotive, boating; and industrial use such as
filtration and metal working.
● Designed for those applications where a limited amount of flow is desirable. Capillary
forces do not pull the epoxy out of alignment.
● The paste-like appearance allows it to be spread by hand using a spatula or blade, bydispensing equipment, or specialty packaging.
● The 1:1 mix ratio allows it to be easily mixed by volume or by weight.
● Used in the fabrication of X-ray sensors. Adheres to metal foils and substrates, especiallylead.
● Available in black and in different viscosities. Contact techserv@epotek.com for your best
recommendation.
● Excellent adhesion to foam/plastics; especially those used in filtration applications.
● Suggested for LCD plug-seal or end-seal, due to its high viscosity nature and room
temperature cure.
● Can be used for joining SMDs to PCB, for staking applications, or double sided PCB. It
has wet, “green strength” before cure. In many cases, the thixotropic nature of theadhesive will hold parts in place without special fixtures while the hardening process istaking place.
● Very popular epoxy for wood-working applications.
● Versatility in curing options between 23°C and 100°C.

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com
A Meridian Adhesives Group Company