EPO-TEK® T7109-19
Technical Data Sheet
For Reference OnlyFlexible Thermally Conductive Epoxy

Date:
Rev:
No. of Components:
Mix Ratio by Weight:
Specific Gravity:
Pot Life:
Shelf Life- Bulk:
Shelf Life- Syringe:

Recommended Cure: 80°C / 2 Hours

July 2019
VIIITwo
100 : 15
Part A: 1.36
Part B: 1.01
2 Hours
One year at room temperature
Six months at -40°C

Minimum Alternative Cure(s):May not achieve performance properties listed below
23°C / 2 DaysNOTES:● Container(s) should be kept closed when not in use.
● Filled systems should be stirred thoroughly before mixing and prior to use.
● Performance properties (rheology, conductivity, others) of the product may vary from those stated on the data sheet when bi-pak/syringe packaging or
post-processing of any kind is performed. Epoxy’s warranties shall not apply to any products that have been reprocessed or repackaged from Epoxy’sdelivered status/container into any other containers of any kind, including but not limited to syringes, bi-paks, cartridges, pouches, tubes, capsules, films
or other packages.
● Syringe packaging will impact initial viscosity and effective pot life, potentially beyond stated parameters.

Product Description: EPO-TEK® T7109-19 is a two component, flexible, thermally conductive, electrically insulating epoxy paste
designed for low stress and heat dissipation applications. It is a lower outgassing version of EPO-TEK® T7109-17 with similar thermalmanagement.
Typical Properties: Cure condition: 80°C / 2 Hours
Different batches, conditions & applications yield differing results.
Data below is not guaranteed. To be used as a guide only, not as a specification. * denotes test on lot acceptance basis
PHYSICAL PROPERTIES:* Color (before cure):* Consistency:* Viscosity (23°C) @ 5 rpm:
Thixotropic Index:* Glass Transition Temp:
Coefficient of Thermal Expansion (CTE):
Below Tg:
Above Tg:
Shore D Hardness:
Lap Shear @ 23°C:
Die Shear @ 23°C:
Degradation Temp:
Weight Loss:@ 200°C:@ 250°C:@ 300°C:
Suggested Operating Temperature:
Storage Modulus:* Particle Size:

Part A: Grey
Part B: Clear/Colorless
Smooth paste
40,000-70,000 cPs
2.7≤ 40 °C (Dynamic Cure: 20-200°C/ISO 25 Min; Ramp -10-200°C @20°C/Min)

ELECTRICAL AND THERMAL PROPERTIES:
Thermal Conductivity:
Volume Resistivity @ 23°C:
Dielectric Constant (1KHz):
Dissipation Factor (1KHz):

59
216
41
1,434
≥5338

x 10-6 in/in°C
x 10-6 in/in°C

0.41
0.68
1.44
< 250
29,931≤ 20%%%°C (Intermittent)psimicrons

1.3≥ 5 x 1012
3.42
0.030

psi
Kg
°C

1,778 psi

W/mK
Ohm-cmEpoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com

EPO-TEK® T7109-19
Technical Data Sheet
For Reference OnlyFlexible Thermally Conductive Epoxy

EPO-TEK® T7109-19 Advantages & Suggested Application Notes:● Power devices:o Potting in semiconductor lithograph engine for ultra-high resolution wafer printing
and low-stress bonding of ferrites; laminating Cu foils to substrates.
●Hybrids:
o Bonding thermo-electric coolers (TECs).

● Optics:
o Die-attaching μ-LCDs to PCB/substrate.
o Flexible potting of kapton flex PCB containing μ-LCD into the frame.
o Adhesive for OEM optics including profilometry .
● Semiconductor:o Glob top over IC and wire bonds.
● General adhesive for Al, Cu, Kovar, ceramic, glass, PCBs, and most plastics.
● Rheology allows deposition by hand, dispensers or screen printers.

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com