Product Information Sheet
EPO-TEK® OG159-2
Date: June 2017
Material Description:

Rev: V
EPO-TEK® OG159-2 is a single component, high viscosity, UV curable epoxy adhesive designed forsealing glass plates together in the LCD/OLED/display industry. It contains 1mil glass beads for bond linecontrol. Common applications include semiconductor, electro-optics, fiber optic, and scientific/OEM. It
can be applied by screen printing or dispensing techniques. It is capable of coating, adhering, sealing,and encapsulating devices.

Number of Components: Single
Mix Ratio by Weight:
N/A
Specific Gravity:
1.18
Pot Life:
N/A
Shelf Life- Bulk:
One year at room temperature
Shelf Life- Syringe:
One year at room temperature
NOTES:

Recommended CureIron-Doped Mercury Flood Lamp > 30 sec.
2100 mW/cm @ 240-365 nm

Alternative Cures*
Iron-Doped Mercury Spot Lamp
365nm LED Flood Lamp
Pulsed Mercury Lamp

UV Cure is complete after 24 hours
from UV Exposure● Container(s) should be kept closed when not in use.
● Filled systems should be stirred thoroughly before mixing and prior to use.

> 90 sec.
> 90 sec.
> 90 sec.

* Contact Technical Services forapplication-specific variations● Performance properties (rheology, conductivity, others) of the Products may vary from those stated on the data sheet when bi-pak/syringe
packaging or post-processing of any kind is performed. Epoxy’s warranties shall not apply to any products that have been reprocessed orrepackaged from Epoxy’s delivered status/container into any other containers of any kind, including but not limited to syringes, bi-paks, cartridges,
pouches, tubes, capsules, films or other packages..
● Thermal post-cure beneficial - contact techserv@epotek.com for recommendations.

MATERIAL CHARACTERISTICS: Cure condition: varies as required *Testing on lot acceptance basis Data below is not guaranteed.
To be used as a guide only, not as a specification. Different batches, conditions and applications yield differing results.

PHYSICAL PROPERTIES:White* Color (before cure):
Thixotropic paste* Consistency:
100,000 - 140,000 cPs* Viscosity (23°C) @ 2.5 rpm:
N/A
Thixotropic Index:≥ 30 °C (Dynamic Cure:20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min)* Glass Transition Temp:
Coefficient of Thermal Expansion (CTE):
58 x 10-6 in/in°C
Below Tg:
244 x 10-6 in/in°C
Above Tg:
69
Shore D Hardness:
N/A
Lap Shear @ 23°C:
Die Shear:≥ 5 Kg 1,778 psi
UV Cure:23.4 Kg 8,321.0 psi
UV Cure + 23°C/24 Hours:
23.5 Kg 8,356.6 psi
UV Cure + 80°C/1 Hour:
23.0 Kg 8,178.8 psi
UV Cure + 120°C/1 Hour:
25.2 Kg 8,961.1 psi
UV Cure + 150°C/1 Hour:
443 °C
Degradation Temp:
0.13 %
Weight Loss:@ 200°C
0.44 %@ 250°C
0.97 %@ 300°C< 300 °C (Intermittent)
Suggested Operating Temperature:
341,084 psi
Storage Modulus:≤ 30 microns* Particle Size:
OPTICAL PROPERTIES @ 23°C:

Spectral Transmission:
Refractive index (uncured):
Refractive Index (cured):≥ 98% @ 580 - 2,000 nm
1.5684 @ 589 nm
1.5715 @ 589 nm

This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as to its
accuracy and assumes no liability in connection with any use of this product.

EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782

www.epotek.com