PESD5V0S2BQA

Protection against high surge currents in ultra small
DFN1010D-3 package

1 June 2016

Product data sheet

1. General description
Two bidirectional ElectroStatic Discharge (ESD) protection diodes designed to protect two signallines from the damage caused by ESD and other transients.
The device is housed in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device(SMD) plastic package with visible and solderable side pads.

2. Features and benefits
•
•
•
•
•
•
•

Bidirectional ESD protection of two lines
Ultra small SMD plastic package
ESD protection up to 30 kV
AEC-Q101 qualified
IEC 61000-4-5 (surge): IPPM = 14 A
IEC 61000-4-5 (surge): IPPM = 28 A combined lines
Ultra low leakage current: IRM = 1 nA

3. Applications
•
•
•
•
•

Computers and peripherals
Audio and video equipment
Cellular handsets and accessories
Communication systems
Portable electronics

4. Quick reference data
Table 1. Quick reference data
SymbolParameter

Conditions

Min

Typ

Max

Unit

VRWM

reverse standoff
voltage

Tamb = 25 °C

-

-

5

V

Cd

diode capacitancef = 1 MHz; VR = 0 V; Tamb = 25 °C;
single line

-

35

45

pF

[1]

Measured from pin 1 or 2 to pin 3.

[1]

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Nexperia

Protection against high surge currents in ultra small DFN1010D-3 package

5. Pinning information
Table 2. Pinning information
Pin

Symbol Description

1

K1

cathode2

K2

cathode3

CCcommon cathode

4

CC

common cathode

Simplified outline

Graphic symbol
K1

1

CC

K2

4

3

aaa-023266

2
Transparent top view

DFN1010D-3 (SOT1215)

6. Ordering information
Table 3. Ordering information
Type number

Package

PESD5V0S2BQA

Name

Description

Version

DFN1010D-3

DFN1010D-3: plastic thermal enhanced ultra thin small outline
package; no leads; 3 terminals; body 1.1 x 1.0 x 0.37 mm

SOT1215

7. Marking
Table 4. Marking codes
Type number

Marking code

PESD5V0S2BQA

00 01 10

MARKING CODE
(EXAMPLE)

READINGDIRECTION

YEAR DATECODEVENDOR CODEPIN 1
INDICATION MARK

MARK-FREE AREAREADING EXAMPLE:
11
01
10

aaa-008041

Fig. 1. DFN1010D-3 (SOT1215) binary marking code description

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Product data sheet

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8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
SymbolParameter

Conditions

Min

Max

Unit

IPPM

peak pulse current

tp = 8/20 µs; single line

[1][2]-

14A

tp = 8/20 µs; combined lines[1][3]-

28

A

tp = 8/20 µs; average measured; single
line[1][2]-

17.5

A

tp = 8/20 µs; average measured; combined [1][3]
lines

-

35

A

Tj

junction temperature

-

150

°C

Tamb

ambient temperature

-55

125

°C

Tstg

storage temperature

-65

150

°C

ESD maximum ratings
VESD

electrostatic discharge
voltagecontact discharge[4][2]-

30kV

air discharge[4][2]

-

30

kV

-

10

kV

human body model (MIL-STD-883)
[1]
[2]
[3]
[4]

Device stressed with non-repetitive current pulses (8/20 µs exponential decay waveform according to IEC 61000-4-5).
Measured from pin 1 or 2 to pin 3.
Measured from pin 1 and 2 to pin 3.
Device stressed with ten non-repetitive ESD pulses.
001aaa631

001aaa630

120

IPP
100 %

100 % IPP; 8 µs

IPP
(%)
80

90 %

e-t
50 % IPP; 20 µs

40

10 %
0

0

10

20

30

tp (µs)Fig. 2. 8/20 µs pulse waveform according toIEC 61000-4-5

PESD5V0S2BQA

Product data sheet

tr = 0.6 ns to 1 ns

40

t

30 ns
60 ns

Fig. 3. ESD pulse waveform according to IEC 61000-4-2

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Protection against high surge currents in ultra small DFN1010D-3 package

9. Characteristics
Table 6. Characteristics
SymbolParameter

Conditions

Min

Typ

Max

Unit

VRWM

reverse standoff
voltage

Tamb = 25 °C

-

-

5

V

VBR

breakdown voltage

IR = 5 mA; Tamb = 25 °C

5.5

7

9.5

V

IRM

reverse leakage
current

VR = 5 V; Tamb = 25 °C

[1]

-

1

50

nA

Cd

diode capacitancef = 1 MHz; VR = 0 V; Tamb = 25 °C;
single line

[1]

-

35

45

pF

f = 1 MHz; VR = 0 V; Tamb = 25 °C;
combined lines

[2]

-

70

90

pF

IPP = 1 A; Tamb = 25 °C; tp = 8/20 µs;
single line

[3][1]

-

6.5

8.5

V

IPPM = 14 A; Tamb = 25 °C; tp = 8/20 µs;
single line

[3][1]

-

-

11.5

V

IPPM = 28 A; Tamb = 25 °C; tp = 8/20 µs;
combined lines[4][2]

-

11.5

-

V

IPPM = 16 A; Tamb = 25 °C; tp = TLP;
single line

[4][1]

-

8.5

-

V

IPPM = 16 A; Tamb = 25 °C; tp = TLP;
combined lines[4][2]

-

7.6

-

V

IR = 10 A; Tamb = 25 °C; single line

[4][1]

-

0.12

-

Ω

IR = 10 A; Tamb = 25 °C; combined lines [4][2]

-

0.07

-

Ω

VCL

clamping voltage

Rdyn

[1]
[2]
[3]
[4]

dynamic resistance

Measured from pin 1 or 2 to pin 3.
Measured from pin 1 and 2 to pin 3.
Device stressed with 8/20 μs exponential decay waveform according to IEC 61000-4-5.
Non-repetitive current pulse, Transmission Line Pulse (TLP) tp = 100 ns; square pulse; ANSI / ESD STM5.5.1-2008.

PESD5V0S2BQA

Product data sheet

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Protection against high surge currents in ultra small DFN1010D-3 package

IPP

aaa-023194

102
IR
(nA)
10

1

IR
IRM

- VCL - VBR - VRWM

- IRM
- IR

VRWM VBR VCL
10-1

-

+

10-2

- IPP

10-3
-75

006aaa676

Fig. 4. V-I characteristics for a bidirectional ESD
protection diode

25

75

125

Tj (°C)175

VRWM = 5 V
Fig. 5. Relative variation of reverse leakage current as afunction of ambient temperature; typical values

aaa-023195

35
Cd
(pF)
30

-25

aaa-023196

90
IPP
(A)

combined lines;
Rdyn = 0.07 Ω

70

25
50

20
15

single line;
Rdyn = 0.11 Ω

30

10
10

5
0

-5

-3

-1

1

3

VR (V)

Single line;f = 1 MHz; VGS = 0 V; Tamb = 25 °C
Fig. 6. Diode capacitance as a function of reverse
voltage; typical values

PESD5V0S2BQA

Product data sheet

-10

5

0

6

12

VCL (V)18

tp = 100 ns; Transmission Line Pulse (TLP)
Fig. 7. Dynamic resistance with positive clamping
voltage; typical values

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Protection against high surge currents in ultra small DFN1010D-3 package

aaa-023197

10

aaa-023198

12

IPP
(A)

VCL
(V)

-10

single line
8-30
single line;
Rdyn = 0.12 Ω

combined lines

combined lines;
Rdyn = 0.05 Ω

-50
4
-70

-90
-18

-12

-6

VCL (V)00

tp = 100 ns; Transmission Line Pulse (TLP)
Fig. 8. Dynamic resistance with negative clamping
voltage; typical values

0

10

20

30

IPP (A)40

tp = 8/20 µs; according to IEC 61000-4-5
Fig. 9. Dynamic resistance with positive clamping
voltage; typical values
aaa-023199

0
VCL
(V)
-4

-8

combined lines
single line

-12
-40

-30

-20

-10

IPP (A)0

tp = 8/20 µs; according to IEC 61000-4-5
Fig. 10. Dynamic resistance with negative clamping voltage; typical values

PESD5V0S2BQA

Product data sheet

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ESD TESTER

4 GHz DIGITALOSCILLOSCOPE

RG 223/U
50 Ω coax

Rd

40 dB
ATTENUATOR

Cs

50 Ω

DUT
(DEVICE
UNDER
TEST)

IEC 61000-4-2 ed.2
Cs = 150 pF; Rd = 330 Ω

10

2

V
(kV) 8V(kV) 0

6

-2

4

-4

2

-6

0

-8

-2
-10

0

10

20

30

40

50
t (ns)

60

-10
-10

70

unclamped +8 kV ESD pulse waveform(IEC 61000-4-2 network)

0

10

20

30

40

50
t (ns)

60

70

unclamped -8 kV ESD pulse waveform(IEC 61000-4-2 network)
aaa-003952

Fig. 11. ESD clamping test setup and waveforms
aaa-023263

60
VCL
(V)

aaa-023264

60
VCL
(V)

20

20

VCL at 30 ns = 6.7 V
-20

-60
-10

VCL at 30 ns = -6 V

-20

0

10

20

30

40

50

60
t (ns)

Fig. 12. Clamped +8 kV pulse waveform(IEC 61000-4-2 network)PESD5V0S2BQA

Product data sheet

-60
-10

70

0

10

20

30

40

50

60
t (ns)

70

Fig. 13. Clamped -8 kV pulse waveform(IEC 61000-4-2 network)

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Protection against high surge currents in ultra small DFN1010D-3 package

10. Application information
The device is designed for the protection of up to two bidirectional data lines from surge pulses and
ESD damage.
lines to be protected

ESD protection diodeGND
006aab332

Fig. 14. Application diagram
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surgetransients. The following guidelines are recommended:
1.
2.
3.
4.
5.
6.
7.
8.

Place the device as close to the input terminal or connector as possible.
Minimize the path length between the device and the protected line.
Keep parallel signal paths to a minimum.
Avoid running protected conductors in parallel with unprotected conductors.
Minimize all Printed-Circuit Board (PCB) conductive loops including power and ground loops.
Minimize the length of the transient return path to ground.
Avoid using shared transient return paths to a common ground point.
Use ground planes whenever possible. For multilayer PCBs, use ground vias.

11. Test information
Quality information
This product has been qualified in accordance with the Automotive Electronics Council (AEC)
standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use inautomotive applications.

PESD5V0S2BQA

Product data sheet

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12. Package outline
0.87
0.95
0.75

1
0.95
1.05

0.22
0.30
2

0.16
0.24

0.1
3

0.04
max

0.34
0.40
Dimensions in mm

0.17
0.25

0.245
0.325

1.05
1.15

0.195
0.275

13-03-05

Fig. 15. Package outline DFN1010D-3 (SOT1215)

PESD5V0S2BQA

Product data sheet

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13. Soldering
Footprint information for reflow soldering of DFN1010D-3 package

SOT12151.2
0.45 (2x)0.3
1.1

0.35 (2x)0.40.25 (2x)

0.75

0.3

0.5

1.5

1.4

0.4

0.5

0.4

0.3

0.5

1.3

0.4

0.3
0.4
0.5
1.3

solder landsolder land plus solder paste

occupied area

solder resist

Dimensions in mm
Issue date

12-11-23
13-03-06

sot1215_fr

Fig. 16. Reflow soldering footprint for DFN1010D-3 (SOT1215)

PESD5V0S2BQA

Product data sheet

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14. Revision history
Table 7. Revision history
Data sheet ID

Release date

Data sheet status

Change notice

Supersedes

PESD5V0S2BQA v.1

20160601

Product data sheet--

PESD5V0S2BQA

Product data sheet

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Notwithstanding any damages that customer might incur for any reason
whatsoever, Nexperia’s aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordancewith the Terms and conditions of commercial sale of Nexperia.

15. Legal information

Right to make changes — Nexperia reserves the right tomake changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.

Data sheet status
Document
status [1][2]Product
status [3]Objective[short] data
sheet

Development This document contains data fromthe objective specification for productdevelopment.

Preliminary[short] data
sheet

Qualification

This document contains data from thepreliminary specification.

Product[short] data
sheet

Production

This document contains the productspecification.

[1]
[2]
[3]

Definition

Suitability for use in automotive applications — This Nexperia
product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical orsafety-critical systems or equipment, nor in applications where failure or
malfunction of a Nexperia product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. Nexperia and its suppliers accept no liability forinclusion and/or use of Nexperia products in such equipment orapplications and therefore such inclusion and/or use is at the customer's own
risk.

Please consult the most recently issued document before initiating orcompleting a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may havechanged since this document was published and may differ in case ofmultiple devices. The latest product status information is available on
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Preview — The document is a preview version only. The document is still
subject to formal approval, which may result in modifications or additions.
Nexperia does not give any representations or warranties as tothe accuracy or completeness of information included herein and shall haveno liability for the consequences of use of such information.
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Short data sheet — A short data sheet is an extract from a full data sheetwith the same product type number(s) and title. A short data sheet isintended for quick reference only and should not be relied upon to containdetailed and full information. For detailed and full information see therelevant full data sheet, which is available on request via the local Nexperia
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Product data sheet.

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PESD5V0S2BQA

Product data sheet

Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of thisdocument, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of theseproducts are for illustrative purposes only. Nexperia makes
no representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of theirapplications and products using Nexperia products, and Nexperia
accepts no liability for any assistance with applications or
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whether the Nexperia product is suitable and fit for thecustomer’s applications and products planned, as well as for the planned
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associated with their applications and products.
Nexperia does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default
in the customer’s applications or products, or the application or use bycustomer’s third party customer(s). Customer is responsible for doing allnecessary testing for the customer’s applications and products using Nexperia
products in order to avoid a default of the applications
and the products or of the application or use by customer’s third party
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Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above thosegiven in the Recommended operating conditions section (if present) or theCharacteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
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Trademarks
Notice: All referenced brands, product names, service names andtrademarks are the property of their respective owners.

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16. Contents
1. General description......................................................1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Quick reference data....................................................1
5. Pinning information......................................................2
6. Ordering information....................................................2
7. Marking.......................................................................... 2
8. Limiting values............................................................. 3
9. Characteristics..............................................................4
10. Application information............................................. 8
11. Test information......................................................... 8
12. Package outline.......................................................... 9
13. Soldering................................................................... 10
14. Revision history........................................................11
15. Legal information..................................................... 12© Nexperia B.V. 2017. All rights reserved

For more information, please visit: http://www.nexperia.com
For sales office addresses, please send an email to: salesaddresses@nexperia.com
Date of release: 01 June 2016

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