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Ka band MMIC
Frequency MultiplierKa-x2M-3046 Previously named LE-Ka1340316
GaAs MMIC x2 Frequency Multplier 30-46GHz

OverviewFeatures

Ka-x2M-3046 is a wideband passive Schottky diode frequency multiplier MMIC that•15 –23GHz input.

transforms frequencies from the 15GHz to 23GHz band into the 30GHz to 46GHz•

30 – 46GHz output.

frequency band. This MMIC provides 7dBm output power with <±1dB conversion loss•

11dB conversion loss.

variation at an input drive level of 18dBm.

•7dBm output power.

With all bond pads and the backside of the MMIC gold plated, the MMIC is compatible
with precision die attach methods, as well as thermo-compression and thermosonic
wire bonding, making it ideal for MCM and hybrid microcircuit applications. All dataApplications

shown is measured with the chip in a 50 Ohm environment and contacted using RF•

High speed data communications.

probes.

•Space communications.

•IOT.

•Security.

•Frequency transformer.

Ka-x2M-3046 is designed to be used in conjunction with the Arralis ‘E-x2M-6085’
passive multiplier to provide a simple frequency transformation of signals from K-Band
to E-Band.

Ka band Datasheet

Ka-x2M-3046

Issue date: 30 April 21

DOC REV 3

Page 1 of 7

No licence is granted under any patent or any patent rights of Arralis. Information furnished by Arralis is believed to be accurate. No responsibility is assumed by Arralis for its use,
nor for any infringements on the rights of other parties that may result for the use of the information herein. All specification are subject to change without notice.

GaAs MMIC x2 Frequency Multiplier 30-46GHz

www.arralis.com

product datasheet

Specification Overview

Parameter		Min.

Input Frequency

Typ.

Max.

Units

15		23GHz

Output Frequency

30		46GHz

Conversion Loss

914dB11

Gain Flatness		 ±1		dB

Input PowerdBm

101618Notes
All tests are carried out at 25°C.

Absolute Maximum Ratings

Parameter			Rating
RF Input Power		

22dBm

Storage Temperature			−65°C to +150°C

Channel Temperature			+150°COperating Temperature			−40°C to +85°C

Ka band Datasheet

Ka-x2M-3046

Issue date: 30 April 21

ESD (electrostatic discharge)
sensitive device. Charged devices
and circuit boards can discharge
without detection. Although thisproduct features proprietary
protection circuitry, damage may
occur on devices subjected to ESD.
Proper ESD precautions should
be taken to avoid performancedegradation or loss of functionality.

DOC REV 3

Page 2 of 7

No licence is granted under any patent or any patent rights of Arralis. Information furnished by Arralis is believed to be accurate. No responsibility is assumed by Arralis for its use,
nor for any infringements on the rights of other parties that may result for the use of the information herein. All specification are subject to change without notice.

GaAs MMIC x2 Frequency Multiplier 30-46GHz

www.arralis.com

product datasheet

Measured Performance Data
10Figure 1
Output Power

8Output Power (dBm)

6420-2IP=10dBm
IP=12dBm-4

IP=14dBm-6-8

IP=16dBm
IP=18dBm
28

30

32

34

36

38

40

42

44

46

48

RF Output Frequency (GHz)

0.000

Figure 2
Conversion Gain

-2.000

28GHz

30GHz

32GHz

34GHz

36GHz

38GHz

40GHz

42GHz

44GHz

46GHz

48GHz

49GHz

-4.000Conversion Gain (dB)

-6.000-8.000-10.000-12.000-14.000-16.000-18.000-20.000

10111213

1415

161718Input Power (dBm)

Ka band Datasheet

Ka-x2M-3046

Issue date: 30 April 21

DOC REV 3Page 3 of 7

No licence is granted under any patent or any patent rights of Arralis. Information furnished by Arralis is believed to be accurate. No responsibility is assumed by Arralis for its use,
nor for any infringements on the rights of other parties that may result for the use of the information herein. All specification are subject to change without notice.

GaAs MMIC x2 Frequency Multiplier 30-46GHz

www.arralis.com

product datasheet

Outline Drawing
2620

65

65
105

1570

54548286476.5

82187Notes
1.

All dimensions are in um.

2.

RF bond pads are 86 x 105um.

3.

All pads have gold metalisation.

4.

Gold backside metalisation.

5.

Backside metal is ground.

6.

Die thickness is 100um

Die Packing Information
All die are delivered using gel-paks unless otherwise requested.

Ka band Datasheet

Ka-x2M-3046

Issue date: 30 April 21

DOC REV 3

Page 4 of 7

No licence is granted under any patent or any patent rights of Arralis. Information furnished by Arralis is believed to be accurate. No responsibility is assumed by Arralis for its use,
nor for any infringements on the rights of other parties that may result for the use of the information herein. All specification are subject to change without notice.

GaAs MMIC x2 Frequency Multiplier 30-46GHz

www.arralis.com

product datasheet

Pad Descriptions

Name

Description

RFIN

Input RF pad. This pad is AC coupled.

RFOUT

Output RF pad. This pad is AC coupled.

BOTTOM

The die backside must be connected to RF/DC ground.

Connection Configurations

Ka band Datasheet

Ka-x2M-3046

Issue date: 30 April 21

DOC REV 3

Page 5 of 7

No licence is granted under any patent or any patent rights of Arralis. Information furnished by Arralis is believed to be accurate. No responsibility is assumed by Arralis for its use,
nor for any infringements on the rights of other parties that may result for the use of the information herein. All specification are subject to change without notice.

GaAs MMIC x2 Frequency Multiplier 30-46GHz

www.arralis.com

product datasheet

General Notes on Assembly

Die should be mounted on conductive material such as gold-plated metal to provide agood ground and suitable heat sink, if necessary.
1.

Attaching the die using Au/Sn preforms is preferable. The Eutectic melt for Au/
Sn occurs at approximately 280oC so the die (plus mount and preform) is initiallyheated up to 180oC and then it is heated for approximately 10 seconds to 280oC
using a nitrogen heat gun. The device will survive 10 seconds at this temperature.
The static breakdown for GaAs devices is approximately 330oC.

2.

Pure, dry nitrogen should be used as the heat source.

3.

If the devices cannot be lifted/ placed by a vacuum device, then ESD die-lifting
tweezers are preferable.

4.

Aluminium wire must not be used.

Ka band Datasheet

Ka-x2M-3046

Issue date: 30 April 21

DOC REV 3

Page 6 of 7

No licence is granted under any patent or any patent rights of Arralis. Information furnished by Arralis is believed to be accurate. No responsibility is assumed by Arralis for its use,
nor for any infringements on the rights of other parties that may result for the use of the information herein. All specification are subject to change without notice.

Disclaimer
The information contained herein is believed to be reliable; however, Arralis makes no warranties regarding
the information and assumes no responsibility or liability whatsoever for the use of the information contained
herein. All information is subject to change without notice, therefore customers should obtain the latest
relevant information before placing orders for Arralis products. The information contained herein does notgrant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights.
This information does not constitute a warranty with respect to the product described, and Arralis disclaims
any and all warranties either expressed or implied, relating to sale and/or use of Arralis products including
liability or warranties relating to fitness for a particular purpose, consequential or incidental damages,
merchantability, or infringement of any patent, copyright or other intellectual property right.
Without limiting the generality of the foregoing, Arralis products are not warranted or authorised for use as
critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure
would reasonably be expected to cause severe personal injury or death.
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Ka band Datasheetarralis.com
Ka-x2M-3046

e: emilie.wren@arralis.com

Issue date: 30 April 21

DOC REV 3

Page 7 of 7

No licence is granted under any patent or any patent rights of Arralis. Information furnished by Arralis is believed to be accurate. No responsibility is assumed by Arralis for its use,
nor for any infringements on the rights of other parties that may result for the use of the information herein. All specification are subject to change without notice.