NUP1301U-Q

Ultra low capacitance ESD protection array
6 May 2022

Product data sheet

1. General description
Ultra low capacitance ElectroStatic Discharge (ESD) protection array in a small SOT323 (SC-70)
Surface-Mounted Device (SMD) plastic package designed to protect one signal line in rail-to-rail
configuration from the damage caused by ESD and other transients.

2. Features and benefits
•
•
•
•
•
•

ESD protection of one signal line (rail-to-rail configuration)
Ultra low diode capacitance: Cd = 0.6 pF
ESD protection up to 30 kV
IEC 61000-4-2; level 4 (ESD)
IEC 61000-4-5 (surge); IPP = 11 A
Qualified according to AEC-Q101 and recommended for use in automotive applications

3. Applications
•
•
•
•
•
•
•

Telecommunication networks
Video line protection
Microcontroller protection
I²C-bus protection
Antenna power supply
Analog audio
Class-D amplifier

4. Quick reference data
Table 1. Quick reference data
SymbolParameter

Conditions

Min

Typ

Max

Unit

-

-

80

V

VRRM

repetitive peak reverse
voltage

Cd

diode capacitancef = 1 MHz; VR = 0 V; Tamb = 25 °C

-

0.6

0.75

pF

IR

reverse current

VR = 80 V; Tamb = 25 °C

-

-

100

nA

NUP1301U-Q

Nexperia

Ultra low capacitance ESD protection array

5. Pinning information
Table 2. Pinning information
Pin
SymbolDescription
1

GND

ground2

VCC

supply voltage

3

I/O

input/output

Simplified outline

Graphic symbol

3

1

K1, A2

2SC-70 (SOT323)

A1

K2
006aaa763

6. Ordering information
Table 3. Ordering information
Type number
Package
NUP1301U-Q

Name

Description

VersionSC-70

plastic, surface-mounted package; 3 leads; 1.3 mm pitch; 2 SOT323
mm x 1.25 mm x 0.95 mm body

7. Marking
Table 4. Marking codes
Type number

Marking code[1]

NUP1301U-Q

%VU

[1]

% = placeholder for manufacturing site code

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Product data sheet

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Ultra low capacitance ESD protection array

8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
SymbolParameter

Conditions

Min

Max

Unit

VRRM

repetitive peak reverse
voltage

-

80

V

VR

reverse voltage

IF

forward current

-

80

V

-

215

mA

IFRM

repetitive peak forward
current

tp ≤ 1 ms; δ ≤ 0.25

-

500

mA

PPPM

rated peak pulse power

tp = 8/20 μs

IPPM

rated peak pulse current[2] [3]-220

W[2] [3]

-

11

A

IFSM

non-repetitive peak
forward current

square wave; tp = 1 µs

[4]

-

4

A

square wave; tp = 1 ms

[4]

-

1

A

square wave; tp = 1 s

[4]

-

0.5

A

Tamb ≤ 25 °C[5] [6][1]

Ptot

total power dissipation

-

200

mW

Tj

junction temperature

-

150

°C

Tamb

ambient temperature

-55

150

°C

Tstg

storage temperature

-65

150

°C

ESD maximum ratings
VESD

[1]
[2]
[3]
[4]
[5]
[6]
[7]

electrostatic discharge
voltage

IEC 61000-4-2 (contact discharge)

-

30

kV

machine model[3] [7]-400

V

MIL-STD-883 (human body model)

-

10

kV

Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
Non-repetitive current pulse 8/20 μs exponential decay waveform according to IEC 61000-4-5.
Measured from pin 3 to pins 1 and 2 (pins 1 and 2 are connected).
Tj = 25 °C prior to surge.
Single diode loaded.
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
Device stressed with ten non-repetitive ESD pulses.
001aaa630

120

IPP
100 %

100 % IPP; 8 µs

IPP
(%)
80

90 %

e-t
50 % IPP; 20 µs

40

10 %
0

Fig. 1.

0

10

20

30

t (µs)

8/20 µs pulse waveform according toIEC 61000-4-5

NUP1301U-Q

Product data sheett

tr = 0.6 ns to 1 ns

40

30 ns
60 ns

Fig. 2.

ESD pulse waveform according toIEC 61000-4-2

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Ultra low capacitance ESD protection array

9. Thermal characteristics
Table 6. Thermal characteristics
SymbolParameter

Conditions

Rth(j-a)thermal resistance from in free air
junction to ambient

Rth(j-sp)

thermal resistance fromjunction to solder point

[1]
[2]

[1] [2]

Min

Typ

Max

Unit

-

-

625

K/W

-

-

300

K/W

Min

Typ

Max

Unit

Single diode loaded.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

10. Characteristics
Table 7. Characteristics
SymbolParameter

Conditions

VF

IF = 1 mA; Tamb = 25 °C

[1]

-

-

715

mV

IF = 10 mA; Tamb = 25 °C

[1]

-

-

855

mV

IF = 50 mA; Tamb = 25 °C

[1]

-

-

1

V

IF = 150 mA; Tamb = 25 °C

[1]

-

-

1.25

V

forward voltage

VBR

breakdown voltage

IR = 100 µA; Tamb = 25 °C

100

-

-

V

IR

reverse current

VR = 25 V; Tamb = 25 °C

-

-

30

nA

VR = 80 V; Tamb = 25 °C

-

-

100

nA

VR = 25 V; Tj = 150 °C

-

-

25

µA

VR = 80 V; Tj = 150 °C

-

-

35

µA

-

0.6

0.75

pF

Cd

diode capacitancef = 1 MHz; VR = 0 V; Tamb = 25 °C

VCL

clamping voltage

IPP = 1 A; Tamb = 25 °C[2] [3]

-

-

3

V

IPPM = 11 A; Tamb = 25 °C[2] [3]

-

-

20

V

[1]
[2]
[3]

Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
Non-repetitive current pulse 8/20 μs exponential decay waveform according to IEC 61000-4-5.
Measured from pin 3 to pins 1 and 2 (pins 1 and 2 are connected).

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Nexperia

Ultra low capacitance ESD protection array006aab132

103
IF
(mA)

mbg704

102
IFSM
(A)

102

10
10

1

10-1

0

0.2

(1)

(2)

0.4

0.6

(3)

1

(4)

0.8

1.0

(1) Tamb = 150 °C(2) Tamb = 85 °C(3) Tamb = 25 °C(4) Tamb = -40 °C
Fig. 3.

10-1

1.2
1.4
VF (V)

1

10

102

103

tp (µs)104

Based on square wave currents.
Tj(init) = 25 °C
Fig. 4.

Non-repetitive peak forward current as afunction of pulse duration; typical values

Forward current as a function of forward
voltage; typical values
006aab133

102
IR
(µA)
10

(1)

1

(2)

mbg446

0.8
Cd
(pF)
0.6

10-1

0.4

(3)

10-2
10-3

0.2

10-4
10-5

(4)

0

20

40

60

80

VR (V)

0

4

8

12

VR (V)

16

f = 1 MHz; Tamb = 25 °C(1) Tamb = 150 °C(2) Tamb = 85 °C(3) Tamb = 25 °C(4) Tamb = -40 °C
Fig. 5.

0100

Fig. 6.

Diode capacitance as a function of reverse
voltage; typical values

Reverse current as a function of reverse
voltage; typical values

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Product data sheet

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NUP1301U-Q

Nexperia

Ultra low capacitance ESD protection array
ESD TESTER
acc. to IEC 61000-4-2
CZ = 150 pF; RZ = 330 Ω

4 GHz DIGITALOSCILLOSCOPE
RG 223/U
50 Ω coax

RZ

40 dB
ATTENUATOR

CZ

50 Ω

DUT
(DEVICE
UNDER
TEST)

vertical scale = 10 V/div
horizontal scale = 15 ns/div

vertical scale = 10 A/div
horizontal scale = 15 ns/div

GND

GND

clamped +8 kV ESD pulse waveform(IEC 61000-4-2 network), pin 3 to 1 and 2

unclamped +8 kV ESD pulse waveform(IEC 61000-4-2 network)

vertical scale = 10 V/div
horizontal scale = 15 ns/div

vertical scale = 10 A/div
horizontal scale = 15 ns/div
GND

GND

clamped -8 kV ESD pulse waveform(IEC 61000-4-2 network), pin 3 to 1 and 2

unclamped -8 kV ESD pulse waveform(IEC 61000-4-2 network)

Fig. 7.

006aab567

ESD clamping test setup and waveforms

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Product data sheet

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Ultra low capacitance ESD protection array

11. Application information
Protection of a single (high-speed) data line in rail-to-rail configuration. The protected data line isconnected to pin 3. Pin 1 is connected to ground (GND) and pin 2 is connected to the supply rail
(supply voltage VCC). When the transient voltage exceeds the forward voltage drop of one diode,the transient is directed either to the supply rail or to GND.
The advantages of these solutions are: low line capacitance (0.6 pF typically), fast response time,and low clamping voltage.
VCC

VCC

D1
ESD protection array

Audio
interface
D2
ESD protection array006aac518

Fig. 8.

Application diagram
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surgetransients. The following guidelines are recommended:
1.
2.
3.
4.
5.
6.
7.
8.

Place the device as close to the input terminal or connector as possible.
Minimize the path length between the device and the protected line.
Keep parallel signal paths to a minimum.
Avoid running protected conductors in parallel with unprotected conductors.
Minimize all Printed-Circuit Board (PCB) conductive loops including power and ground loops.
Minimize the length of the transient return path to ground.
Avoid using shared transient return paths to a common ground point.
Use ground planes whenever possible. For multilayer PCBs, use ground vias.

12. Test information
Quality information
This product has been qualified in accordance with the Automotive Electronics Council (AEC)
standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use inautomotive applications.

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Product data sheet

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Ultra low capacitance ESD protection array

13. Package outline
Plastic surface-mounted package; 3 leads

SOT323

D

B

E

A

X

HE

y

v M A

3
Q

A
A1

1

c

2
e1

bp

Lp

w M B

e

detail X

0

1

2 mm

scale

DIMENSIONS (mm are the original dimensions)
UNIT

A

A1
max

bp

c

D

E

e

e1

HE

Lp

Q

v

w

mm

1.1
0.8

0.1

0.4
0.3

0.25
0.10

2.2
1.8

1.35
1.15

1.3

0.65

2.2
2.0

0.45
0.15

0.23
0.13

0.2

0.2

OUTLINE
VERSION

REFERENCES
IEC

JEDEC

SOT323Fig. 9.

JEITA
SC-70

EUROPEAN
PROJECTION

ISSUE DATE
04-11-04
06-03-16

Package outline SC-70 (SOT323)

NUP1301U-Q

Product data sheet

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Ultra low capacitance ESD protection array

14. Soldering
2.65
1.85
1.325
solder lands
solder resist

2

2.35

0.6
(3×)

3

solder paste

1.3

occupied area

0.5
(3×)

1

Dimensions in mm
0.55
(3×)

sot323_fr

Fig. 10. Reflow soldering footprint for SC-70 (SOT323)
4.6
2.575
1.425
(3×)
solder lands
solder resist
occupied area
1.8

3.65 2.1
09(2×)

Dimensions in mm
preferred transport
direction during soldering

sot323_fw

Fig. 11. Wave soldering footprint for SC-70 (SOT323)

NUP1301U-Q

Product data sheet

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Ultra low capacitance ESD protection array

15. Revision history
Table 8. Revision history
Data sheet ID
Release date

Data sheet status

Change notice

Supersedes

NUP1301U-Q v.1

Product data sheet--

NUP1301U-Q

Product data sheet

20220506

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Nexperia

Ultra low capacitance ESD protection arrayequipment, nor in applications where failure or malfunction of an Nexperia
product can reasonably be expected to result in personal injury, death orsevere property or environmental damage. Nexperia and its suppliers accept
no liability for inclusion and/or use of Nexperia products in such equipment orapplications and therefore such inclusion and/or use is at the customer's own
risk.

16. Legal information
Data sheet status
Document status[1][2]

Product
status [3]Definition

Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of thisdocument, and as such is not complete, exhaustive or legally binding.

Objective [short]data sheet

Development

This document contains data fromthe objective specification for
product development.

Preliminary [short]data sheet

Qualification

This document contains data fromthe preliminary specification.

Applications — Applications that are described herein for any of theseproducts are for illustrative purposes only. Nexperia makes no representation
or warranty that such applications will be suitable for the specified use
without further testing or modification.

Product [short]data sheet

Production

This document contains the productspecification.

[1]
[2]
[3]

Please consult the most recently issued document before initiating orcompleting a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may havechanged since this document was published and may differ in case ofmultiple devices. The latest product status information is available on
the internet at https://www.nexperia.com.

Definitions
Draft — The document is a draft version only. The content is still underinternal review and subject to formal approval, which may result in
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full data sheet, which is available on request via the local Nexperia sales
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beyond those described in the Product data sheet.

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to be accurate and reliable. However, Nexperia does not give any
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or completeness of such information and shall have no liability for theconsequences of use of such information. Nexperia takes no responsibility
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In no event shall Nexperia be liable for any indirect, incidental, punitive,
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Customers are responsible for the design and operation of their applications
and products using Nexperia products, and Nexperia accepts no liability forany assistance with applications or customer product design. It is customer’ssole responsibility to determine whether the Nexperia product is suitableand fit for the customer’s applications and products planned, as well as
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Customers should provide appropriate design and operating safeguards tominimize the risks associated with their applications and products.
Nexperia does not accept any liability related to any default, damage, costs
or problem which is based on any weakness or default in the customer’s
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liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above thosegiven in the Recommended operating conditions section (if present) or theCharacteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
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sold subject to the general terms and conditions of commercial sale, as
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agreed in writing, the product is not designed, authorized or warranted tobe suitable for use in life support, life-critical or safety-critical systems or

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Ultra low capacitance ESD protection array

Contents
1. General description...................................................... 1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Quick reference data....................................................1
5. Pinning information......................................................2
6. Ordering information....................................................2
7. Marking.......................................................................... 2
8. Limiting values............................................................. 3
9. Thermal characteristics............................................... 4
10. Characteristics............................................................ 4
11. Application information..............................................7
12. Test information..........................................................7
13. Package outline.......................................................... 8
14. Soldering..................................................................... 9
15. Revision history........................................................10
16. Legal information......................................................11© Nexperia B.V. 2022. All rights reserved

For more information, please visit: http://www.nexperia.com
For sales office addresses, please send an email to: salesaddresses@nexperia.com
Date of release: 6 May 2022

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