EPO-TEK® 302-3M
Technical Data Sheet
For Reference Only
Optically Transparent Epoxy

Date:
Rev:
No. of Components:
Mix Ratio by Weight:
Specific Gravity:
Pot Life:
Shelf Life- Bulk:

Recommended Cure: 65°C / 3 Hours

November 2018
XTwo
100 : 45
Part A: 1.20
Part B: 0.96
1 Hour
One year at room temperature

Minimum Alternative Cure(s):May not achieve performance properties listed below
23°C / 24 HoursNOTES:● Container(s) should be kept closed when not in use.
● Filled systems should be stirred thoroughly before mixing and prior to use.
● Performance properties (rheology, conductivity, others) of the product may vary from those stated on the data sheet when bi-pak/syringe packaging orpost-processing of any kind is performed. Epoxy’s warranties shall not apply to any products that have been reprocessed or repackaged from Epoxy’s
delivered status/container into any other containers of any kind, including but not limited to syringes, bi-paks, cartridges, pouches, tubes, capsules, films
or other packages.
● Syringe packaging will impact initial viscosity and effective pot life, potentially beyond stated parameters.
● TOTAL MASS SHOULD NOT EXCEED 25 GRAMS● Contact techserv@epotek.com for alternatives designed to meet European regulatory requirements.

Product Description: EPO-TEK® 302-3M is a two component epoxy used for optical, fiber optic, and semiconductor applications. Theepoxy is good for adhesive joining, sealing, potting, or as a coating.
Typical Properties: Cure condition: Varies as required
Different batches, conditions & applications yield differing results.
Data below is not guaranteed. To be used as a guide only, not as a specification. * denotes test on lot acceptance basis
PHYSICAL PROPERTIES:* Color (before cure):* Consistency:* Viscosity (23°C) @ 100 rpm:
Thixotropic Index:* Glass Transition Temp:
Below Tg:
Above Tg:
Shore D Hardness:
Lap Shear @ 23°C:
Die Shear @ 23°C:
Degradation Temp:
Weight Loss:@ 250°C:@ 300°C:
Suggested Operating Temperature:
Storage Modulus:
Ion Content:

Part A: Clear/Colorless
Part B: Clear/Colorless
Pourable liquid
800 - 1,600 cPs
N/A≥ 55 °C (Dynamic Cure: 20-200°C/ISO 25 Min; Ramp -10-200°C @20°C/Min)
56 x 10-6 in/in°C
193 x 10-6 in/in°C
80> 2,000 psi≥ 10 Kg
3,556 psi
351 °C* Particle Size:

0.77
1.22
< 250456,443
42 ppm
1 ppm
N/A

ELECTRICAL AND THERMAL PROPERTIES:
Thermal Conductivity:
Volume Resistivity @ 23°C:
Dielectric Constant (1KHz):
Dissipation Factor (1KHz):

N/A≥ 1 x 1013
3.39
0.006

OPTICAL PROPERTIES @ 23°C:
Spectral Transmission:
Refractive Index (uncured):

Cl-:
NH4+:

> 95% @ 460-1620
1.5446 @589%%°C (Intermittent)psiNa+:
10 ppmK+:
4 ppm

Ohm-cmnm
nm

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com

EPO-TEK® 302-3M
Technical Data Sheet
For Reference Only
Optically Transparent Epoxy

EPO-TEK® 302-3M Advantages & Suggested Application Notes:● Low viscosity, clear and colorless epoxy is well suited for potting applications, and fortransmitting VIS or NIR light in opto-circuits● Excellent water, chemical, and solvent resistant properties including 10% nitric acid,acetone, hexane, and dicholormethane.
● Suggested Applications:o Fiber Optic/Optical:
 Potting and encapsulation; lens and prism bonding for Scientific /OEM instruments; LED encapsulant.
 Transmission in the VIS/NIR range from 350 – 1550 nm. Can be used in theoptical pathway Potting or sealing the fiber into the snout of the opto-package.
 Adhesive for V-groove, fiber arrays or lens arrays.
 Bonding optical fibers into ferrules. Fibers of glass or plastic. Ferrules ofglass, quartz, stainless steel, kovar, or ceramic.
o Semiconductor:
 Recommended for underfilling of flip chips or SMDs on PCB; can also be
used for COB glob top process using a DAM/FILL method; can resist 85/85
moisture soaks, as well as Tcycles and Tshocks● Passes NASA low outgassing standard ASTM E595 with proper cure http://outgassing.nasa.gov/

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com