SOT1289

plastic, thermal enhanced ultra thin SMD package; 3terminals; 5.8 x 4.3 x 0.78 mm body
28 May 2022

Package information

1. Package summary
Terminal position code

B (bottom)

Package type descriptive code

CFP15

Package type industry code

CFP15

Package style descriptive code

SOT (small outline transistor)

Package body material typeP (plastic)

IEC package outline code---

JEDEC package outline code---

JEITA package outline code---

Mounting method typeS (surface mount)

Number of package outline detail graphic
references

0Issue date

29-4-2014Manufacturer package code

SOT1289

Footprint dimensions (mm)7.5 x 4.6

Footprint area (mm²)

34.5Table 1. Package summary
SymbolParameter

MinTypNomMax

Unit

D

package length

6.4-

6.5

6.6mm

Epackage width

4.2-

4.3

4.4mm

A

seated height--

0.78-

mm

enominal pitch--

2.13-

mm

n2

actual quantity of termination

-

-

3-

SOT1289

Nexperia

plastic, thermal enhanced ultra thin SMD package; 3 terminals; 5.8 x 4.3 x 0.78 mm body

2. Package outline
CFP15: plastic, thermal enhanced ultra thin SMD package; 3 leads; body: 5.8 x 4.3 x 0.78 mm

SOT1289bb2(2x)

b1

3

L2eL1
L21 (2x)b3(2x)

b3
D1EC
A
D

1

3
20

2.5

5 mm

scale
Dimensions (mm are the original dimensions)
Unit
mm

AC

D

D1

E

ebb1

b2

b3

L

L1

L2

max 0.82 0.24
nom 0.78 0.20
min 0.74 0.16

6.6
6.5
6.4

5.9
5.8
5.7

4.4
4.3
4.2

2.13

4.8
4.6
4.4

4.2
4.0
3.8

1.3
1.1
0.9

0.45
0.35
0.25

3.5
3.3
3.12.15
2.05
1.95

1.3
1.2
1.1

OutlineversionReferences
IECJEDECJEITAEuropeanprojection

Issue date
14-07-23
14-09-01

SOT1289

Fig. 1.

sot1289_po

Package outline CFP15 (SOT1289)

SOT1289

Package information

All information provided in this document is subject to legal disclaimers.

28 May 2022

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2/5

SOT1289

Nexperia

plastic, thermal enhanced ultra thin SMD package; 3 terminals; 5.8 x 4.3 x 0.78 mm body

3. Soldering
Footprint information for reflow soldering of CFP15 package

SOT1289
4.63.73
1.4 (2×)

1.8 (2×)

1.6 (2×)2.13

1.64 1.44 1.34
0.6 0.4
0.11

1.9

7.5

1.02

5.16 4.96

0.2

1.9

occupied area

solder resist

solder lands

solder paste

Issue dateFig. 2.

13-08-28
14-03-12

0.2
0.05

0.6
1.7 (4×)2.4
3.8
4Dimensions in mm

0.2

sot1289_fr

Reflow soldering footprint for CFP15 (SOT1289)

SOT1289

Package information

All information provided in this document is subject to legal disclaimers.

28 May 2022

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SOT1289Nexperia

plastic, thermal enhanced ultra thin SMD package; 3 terminals; 5.8 x 4.3 x 0.78 mm body

4. Legal information
Definitions
Draft — The document is a draft version only. The content is still underinternal review and subject to formal approval, which may result inmodifications or additions. Nexperia does not give any representations orwarranties as to the accuracy or completeness of information included hereinand shall have no liability for the consequences of use of such information.

Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, Nexperia does not give any
representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for theconsequences of use of such information. Nexperia takes no responsibility
for the content in this document if provided by an information source outsideof Nexperia.
In no event shall Nexperia be liable for any indirect, incidental, punitive,
special or consequential damages (including - without limitation - lostprofits, lost savings, business interruption, costs related to the removalor replacement of any products or rework charges) whether or not suchdamages are based on tort (including negligence), warranty, breach ofcontract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, Nexperia’s aggregate and cumulative liability towards customer
for the products described herein shall be limited in accordance with theTerms and conditions of commercial sale of Nexperia.
Right to make changes — Nexperia reserves the right to make changes
to information published in this document, including without limitation
specifications and product descriptions, at any time and without notice. This
document supersedes and replaces all information supplied prior to thepublication hereof.
Suitability for use — Nexperia products are not designed, authorized or
warranted to be suitable for use in life support, life-critical or safety-criticalsystems or equipment, nor in applications where failure or malfunctionof an Nexperia product can reasonably be expected to result in personal
injury, death or severe property or environmental damage. Nexperia and its
suppliers accept no liability for inclusion and/or use of Nexperia products insuch equipment or applications and therefore such inclusion and/or use is at
the customer’s own risk.
Applications — Applications that are described herein for any of theseproducts are for illustrative purposes only. Nexperia makes no representation
or warranty that such applications will be suitable for the specified use
without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using Nexperia products, and Nexperia accepts no liability forany assistance with applications or customer product design. It is customer’ssole responsibility to determine whether the Nexperia product is suitableand fit for the customer’s applications and products planned, as well as
for the planned application and use of customer’s third party customer(s).
Customers should provide appropriate design and operating safeguards tominimize the risks associated with their applications and products.
Nexperia does not accept any liability related to any default, damage, costs
or problem which is based on any weakness or default in the customer’s
applications or products, or the application or use by customer’s third party
customer(s). Customer is responsible for doing all necessary testing for thecustomer’s applications and products using Nexperia products in order toavoid a default of the applications and the products or of the application or
use by customer’s third party customer(s). Nexperia does not accept any
liability in this respect.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a priorauthorization from competent authorities.
Translations — A non-English (translated) version of a document is forreference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.

Trademarks
Notice: All referenced brands, product names, service names andtrademarks are the property of their respective owners.

SOT1289

Package information

All information provided in this document is subject to legal disclaimers.

28 May 2022

© Nexperia B.V. 2022. All rights reserved

4/5

SOT1289

Nexperia

plastic, thermal enhanced ultra thin SMD package; 3 terminals; 5.8 x 4.3 x 0.78 mm bodyContents
1. Package summary........................................................ 1
2. Package outline............................................................ 2
3. Soldering....................................................................... 3
4. Legal information......................................................... 4© Nexperia B.V. 2022. All rights reserved

For more information, please visit: http://www.nexperia.com
For sales office addresses, please send an email to: salesaddresses@nexperia.com
Date of release: 28 May 2022

SOT1289

Package information

All information provided in this document is subject to legal disclaimers.

28 May 2022

© Nexperia B.V. 2022. All rights reserved

5/5