Featured Products

0.3mm ball pitch achieves maximum space savings

Ultra-Compact WLCSP*Low Input Offset Voltage
High Accuracy Op Amp*Wafer Level Chip Size Package

TLR377GYZ© 2024 ROHM Co., Ltd.

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Overview: Ultra-Compact WLCSP Low Input Offset Voltage High Accuracy Op Amp
The TLR377GYZ is a WLCSP* Op Amp that achieves maximum space savings in sets requiring greater miniaturization.
Providing high accuracy in a compact size while including a shutdown function to reduce power consumption makes it ideal for*Wafer Level Chip Size Package
battery-powered sensing applications.

Features・ Ultra-compact WLCSP contributes to device miniaturization
Achieves external dimensions of 0.88×0.58×0.33 (Max) mm

・ Suitable for compact sensing applications by achieving a balance between size and accuracy
Delivers low offset voltage with low noise: 1mV (Max) offset voltage, 12nV/√Hz (Typ) input equivalent noise voltage density

・ Built-in shutdown function reduces device power consumption

Limiting Op Amp operation to sensing-only periods significantly reduces standby current to just 1.5µA (Max)YCSP30L1
0.88×0.58×0.33 (Max) mm© 2024 ROHM Co., Ltd.

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Ultra-Compact WLCSP Contributes to Device Miniaturization
Size Comparison vs Conventional Products
Wa
DConventional Product A
W: 1.565mm, D: 1.057mm
Ball Pitch a: 0.5mm
aConventional Product B
W: 1.308mm, D: 0.727mm
Ball Pitch a: 0.35mm

Mounting Area

reduced approx. 69%
New Product (TLR377GYZ)a

W: 0.88mm, D: 0.58mm

reducedBall Pitch a: 0.3mm
approx.
46%
Ball Pitch narrowed to 0.3mm

Achieves the ultimate in space savings© 2024 ROHM Co., Ltd.

P. 3Suitable for Compact Sensing Applications by Achieving a Balance
Between Size and Accuracy
Guaranteed by Actual
Measurements

Achieves an Ideal Balance between
Smaller Chip Size and High Accuracy

Input Equivalent Noise Voltage Density[nV/√Hz]

Process Technology
Reduces flicker noise in the low
frequency range through process
selection and device optimization

Circuit Design Technology
IN－Flicker
noise

αI2

Frequency [Hz]Achieves ultra-low noise

Low Temperature
Measurement

Offset Voltage
Compensation
Circuit

I1＋ αThermalnoise

Recording the positional information of all chips duringwafer measurement makes it possible to link theresults of low and high temperature measurements

Q2

Q1
I1IN＋

Measurement Technology

I2[e.g.]I1＜I2↓
I1+α=I2

The offset correction circuit compensates forthe discrepancy between I1 and I2 by adjustingfor the variation in transistors Q1 and Q2Contributes to lower offset

High Temperature
Measurement+Same Wafer(X,Y) = (a,b) ⇒ Same chip at the same coordinates

Guarantees the maximum value of input
offset voltage temperature drift

Provides worry-free operation through actual measurements while achieving highaccuracy by leveraging process and circuit design technologies© 2024 ROHM Co., Ltd.

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Built-in Shutdown Function Reduces Device Power Consumption
Application Circuit

Shutdown Function Operation

SensorElement－Op Amp

MCU+Circuit Current

Sensing Period
Operating Circuit Current

Ave. Circuit Current
Standby Circuit Current

Time
Shutdown Period

Shutdown signal
controls Op Amp
operation/standby

Setting the circuit to standby mode during non-sensing
periods suppresses circuit current to nearly 0µA

Limiting Op Amp operation to sensing-only periods results inexceedingly low average circuit current© 2024 ROHM Co., Ltd.

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Supporting Information
High Accuracy SPICE Models: ROHM Real Models

CSP ⇒ SSOP Conversion Board

ROHM’s high accuracy SPICE models succeed in achieving a perfectmatch between measured and simulated IC values by faithfully
reproducing the electrical and temperature characteristics of the IC using
original model-based technology

Optional conversion board (with premounted TLR377GYZ) allows for
immediate evaluation by mounting it on
an SSOP6 board

Example of Characteristics Verification due to Temperature
Changes for the New Product [TLR377GYZ] (VDD = 5V)TLR377GYZ

Spice Model (ROHM Real Model) vs Actual IC
3.09002.58002.01.51.0
Actual IC
SPICE Model

0.50-40-2002040

Temperature [°C]

CSP

Circuit Current
Circuit Current [μA]

Slew Rate [V/μs]

Slew Rate

60

80

100

Sides of theboard plated
for solder

700

Conversion
Board

600
500
400300200

Actual IC
SPICE Model

100-40-200204060

Temperature [°C]

Completely reproduces temperature
characteristics

80100

Available on
ROHM’s website© 2024 ROHM Co., Ltd.

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Ultra-Compact WLCSP Op Amp Characteristics
Part No.

chSupplyVoltage [V]TLR377GYZ

11.8 to 5.5

CircuitCurrent(Typ) [μA]

Shutdown
Circuit Current(Max) [µA]

Input
Offset Voltage(Max) [mV]

Input Offset
Voltage
Temperature Drift(Max)[μV/°C]

Input Equivalent
Noise Voltage
Density(Typ)[nV/√Hz]

OperatingTemperature[°C]

Package

585

1.5

1.0

612−20 to +85

YCSP30L1 (6Pin)

Click on theicon to access the product page and theicon to view the datasheet on ROHM’s website.

Application Examples• Smartphones• IoT devices• Wearables• Small drones, etc.

Optimized for sensing applications in battery-powered devices© 2024 ROHM Co., Ltd.

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Notice The information contained in this document is intended to introduce ROHM Group (hereafter referred to as ROHM)
products. When using ROHM products, please verify the latest specifications or datasheets before use.
 ROHM does not warrant that the information contained herein is error-free. ROHM shall not be in any way responsible
or liable for any damages, expenses, or losses incurred by you or third parties resulting from errors contained in thisdocument.
 The information and data described in this document, including typical application circuits, are examples only and are
not intended to guarantee to be free from infringement of third parties intellectual property or other rights. ROHM does
not grant any license, express or implied, to implement, use, or exploit any intellectual property or other rights owned
or controlled by ROHM or any third parties with respect to the information and data contained herein.
 When exporting ROHM products or technologies described in this document to other countries, you must abide by theprocedures and provisions stipulated in all applicable export laws and regulations, such as the Foreign Exchange andForeign Trade Act and the US Export Administration Regulations, and follow the necessary procedures in accordancewith these provisions.
 No part of this document may be reprinted or reproduced in any form by any means without the prior written consent ofROHM.
 The information contained in this document is current as of May 2024 and is subject to change without notice.

【O_192】Catalog No.67OP7386E 05.2024 PDF© 2024 ROHM Co., Ltd.