Call for Papers

ADMETAPlus

2017

Advanced Metallization Conference 2017: 27th Asian Session
Oct. 18–20, 2017
The University of Tokyo, Yayoi Auditorium, Ichijo Hall (Hongo Campus), Tokyo
Sponsorship by ADMETA Committee
Co-sponsorship by the Japan Society of Applied Physics
The ADMETAPlus is heading for its 27th historical meeting and has a long record of important
contributions to practical progress for advanced MPU and various memory devices. In recent years, theimportance of interconnect technology for realizing low resistance, large integration, rich functionality,
low cost, and high reliability has increased in various device application fields beyond silicon electronics.
This conference will focus on interconnect technology and science related to materials, processes, device
design, assembly, equipment, cost performance, and characterization. We will host comprehensive
discussions on a wide range of topics, from basics to applications, with researchers and engineers fromindustry, government, and academia. We are looking forward to new developments in interconnect
technology fields and contributing to the growth of the semiconductor industry in the Asian area.
ADMETAPlus 2017 General Chair: Osamu Nakatsuka (Nagoya University)＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊
Conference Topics of Interest
Integration: Interconnection Structure and Performance, Parasitic Capacitance, Reliability Technology, Testing and Analysis
Reliability Science and Failure Analysis: EM, SIV, TDDB, Defect Detection and Analysis, Failure Mechanism and Modeling
Metallization: PVD, CVD, ALD, Plating, Barrier Metal, Seed and Nucleation Layer, Supercritical Fluid, Reflow
Low-k Dielectric: CVD, ALD, SOD, Film Properties, Interface Control, New Materials, Dielectric Structures (Air Gap), Metrology, etc.
CMP: Planarization Technology, Slurry, Pad, Dress, End Point Detection, Cleaning, Anti-corrosive Technology, etc.
Contact: Silicide, Interface, Solid Phase Reaction, Shallow Junction, Crystal Properties, Electron Properties, Carrier Transport, Parasitic
Resistance, etc.
MEMS/RF: Interconnection Structure and Materials, Packaging, Fabrication Process Technology, Device Design, etc.
Emerging Technology: Active Wiring, Power Electronics, Silicon Photonics, Flexible Electronics, Energy Harvesting, etc.
Backend Device Technology: Technology for Embedding Devices (MRAM, PCRAM, ReRAM, DRAM, etc.), Materials and Processingof Magnetics, Phase-Change and Resistive-Change Devices, Electrodes, Metallization, etc.
Nanocarbon: Graphene, Carbon Nanotube, Deposition, Integration, Electrical Characteristics, Reliability, Evaluation, Analysis, etc.
3D and Packaging: TSV, TMV, Stacking Method (CoW, WoW), Thinning, Planarization, Bonding, Bump, Stress and Thermal Analysis,
Sealing, Cooling, Reliability*************************************************★ To Apply: Prepare an abstract per the directions below and submit it to the ADMETAPlus 2017
Secretariat
A4 format, 2 pages, Oral [15 min. talk & 5 min. QA] or Poster [90 min.] (temporary)★ Abstract Preparation and Submission: Abstracts are due: June 30, 2017 >> July 13, 2017

QR code to URL

http://www.admeta.org/

Prospective authors must submit a two-page PDF file with all figures and tables. Send the PDF file of the manuscript,
the subject of your paper (please choose from the Conference Topics of Interest), and desired presentation style (Oral orPoster) to the secretariat office via e-mail. On the abstract, please indicate the author to whom correspondence should beaddressed, and include mailing and e-mail addresses. A template for your abstract can be downloaded from theADMETAPlus 2017 website. Notification of acceptance will be made to the authors by August 14, 2017. Upon
notification, authors will be requested to confirm their participation in the conference．
The accepted abstracts will be included in the conference proceedings (paper and/or CD-ROM), which theparticipants will receive on site at the registration desk of ADMETAPlus 2017. Pre-registered participants will also be able
to download the accepted abstracts from the ADMETAPlus 2017 webpage after Oct. 16, 2016.
Authors with papers presented at ADMETAPlus 2017 are encouraged to submit their original manuscripts to a Special
Issue of the Japanese Journal of Applied Physics (JJAP) dedicated to the ADMETAPlus 2017. The deadline forsubmission to the Special Issue is November 20, 2017. The manuscripts will be reviewed based on the JJAP standard foran original paper. The JJAP Special Issue will accept regular papers (RP), brief notes (BN), and reviews (RV) and will be
published in July, 2018.
※Reminder: As the papers of the Special Issue will be original papers, please be careful not to post the same contents
to any other journals.

★ Contact: ADMETAPlus 2017 Secretariat#502 Omiyadaini Bldg., 4-1-7 Hongo, Bunkyo-ku, Tokyo 113-0033, Japan.
TEL: +81-3-6801-5685, FAX: +81-3-6801-5686, E-mail: jimukyoku@admeta.org