3rd Call for paper
Asian Session ofADVANCED METALLIZATION CONFERENCEADMETA plus 2015
Abstract Submission Due
July 418
Abstract
Due:: July

16-18 September 2015
Global Convention Plaza, Seoul National UniversitySeoul, Korea

The 25th Asian Session of Advanced Metallization Conference (ADMETA)
will be held at the Global Convention Plaza, Seoul National University, Seoul, Korea during

September 16–18, 2015.
ADMETA is devoted to leading-edge research in the field of advanced interconnect and electronic packaging inmaterials, processing, design, simulation, and reliability. This premier conference will also provide an excellent
opportunity for researchers, engineers, and students to discuss recent advances and new research directions.
The conference will feature several technical sessions (oral presentations and posters), five tutorial sessions, plenary
sessions (keynote speeches), and exhibitions. The tutorials offer introductory overview and state-of-the-art
technology reviews in a condensed format. Special posters presented at the ADMETA will be awarded the Best
Poster Awards.
The conference seeks papers on all aspects of interconnects for device, circuit board and system-level applications.
The deadline for submission of abstracts is June 20, 2015. The organizing committee eagerly awaits yourparticipation in ADMETA plus 2015 and looks forward to welcoming you in Seoul, Korea.

Topics of Interest
The ADMETA conference will include all fundamental and applied sciences and technologies in the field of
traditional interconnects, emerging interconnects, 3D interconnects, and their related materials and processes.
Topics may include from, but are not limited to, the following area:

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Advanced Interconnects – Components to Systems
Materials and unit Processes (Metal, dielectric, barrier, Wet, CMP, PVD, CVD, ALD, ECD, SAM, etc)
3D Integration & Packaging
Interconnect technologies for Display
Emerging Interconnect Technology – Flexible, Stretchable, Ultra-Thin PCB, etc
Design for Reliability and Failure Analysis
Modeling and Simulation of Advanced Metallization and IC thermal Management

Keynote Speakers• Dr. Seok-Hee Lee (Co-Chair, SK Hynix Inc.)• Dr. Satoshi Tanimoto (Nissan Arc.)

Tutorial Program
The 2015 ADMET will feature 5 tutorials covering a variety of topics to complement the technical sessions. Thefollowing tutorials will be offered on Wednesday Sep. 16, 2015.

•••••Electroplating Fundamentals and Applications (Prof. Oh Joong Kwon, Incheon National University)
Atomic Layer Deposition (Prof. Han-Bo-Ram Lee, Incheon National University)
Chemical Mechanical Polishing (Prof. Jin-Goo Park, Hanyang University)
3D Integration & Packaging (Prof. Sarah Eunkyung Kim, Seoul National University of Sci. & Tech.)Interconnect Reliability (Dr. Young-Joon Park, Texas Instruments Inc.)

http://www.admeta.org/index_2015.html

Invited Speakers• Dr. Young-Joon Park (Texas Instruments Inc.) – Intrinsic Reliability of Interconnects and MOSFETs• Dr. Tae-Kyu Lee (Cisco Systems Inc.) – Link Between Degradation Mechanisms and Microstructure
Signatures in Solder Joint Interconnects• Prof. Xin-Ping Qu (Fudan University) - Novel Alloy Diffusion Barrier for Advanced Copper Interconnect• Prof. Chee Lip Gan (Nanyang Technological University) - Copper Nanoparticles Enabled Low
Temperature Bonded Interconnections• Dr. Manabu Tsujimura (CTO, Ebara Corporation) - The Way to Zero’s –The future of Semiconductor
Device and CMP Technologies• Dr. Sintaro Sato (Fujitsu Laboratories Ltd.) - Nanocarbon Interconnects with Resistivity and Reliability
Better than Cu• Prof. Hyungjun Kim (Yonsei University) – Atomic Layer Deposition of Transition Metals forInterconnect Technology

Important Dates• Abstract submission by: July 18, 2015
• Authors submit abstracts to: E-mail: admeta2015@gmail.com• Pre-registration by: August 20, 2015
• SCI journal submission by: Immediately after the conference (Selected papers will be published in JJAP special issue)

Local Organizing Committee

International Committee

Young-Chang Joo, Seoul National University
Seok-Hee Lee, SK Hynix
Jun-Yeob Song, Korea Institute of Machinery & Materials
Gil-Hyeon Choi, Samsung Electronics
Hoo-Jeong Lee, Sungkyunkwan UniversityYoung-Bae Park, Andong National University
Han-Bo-Ram Lee, Incheon National University
Sarah Eunkyung Kim, Seoul National Univ. of Sci. & Tech.
Oh Joong Kwon, Incheon National University
Jin-Goo Park, Hanyang University
Jae Jeong Kim, Seoul National University
Hyungjun Kim, Yonsei University
Jae-Hak Lee, Korea Institute of Machinery & Materials
Hyun-Joong Kim, Seoul National University
Hyun-Chul Sohn, Yonsei University
Yong Tae Kim, Korea Institute of Science and Technology
Nicky Kim, SK Hynix
Tae-je Cho, Samsung Electronics
Sang-Hoon Ahn, Samsung Electronics
Won-Jun Lee, Sejong University

T. Nemoto, Tokyo Electron
O. Nakatsuka, Nagoya UniversityM. B. Takeyama, Kitami Institute of Technology
A. Tsukune, Taiyo Nippon Sanso
H. Machida Gas-Phase Growth
N. Hata, AIST
E. Kondoh, Yamanashi University
F. Ito, Toshiba
T. Owada, Socionext
T. Saito, Osaka Prefecture University
A. Kajita, Toshiba
M. Tada, NECK. Maekawa, Renesas Electronics
Y. Yamada, SanDisk
S. Yokogawa, Polytechnic University
S. Hizume, Lam Research
T. Nakada, Ebara
H. Sakurai, Hitachi Chemical
D. Ishikawa, ASM Japan
K. Shimizu, Sony
Y. Higuchi, ULVAC
S. Nomura, Hitachi Chemical
T. Nogami, IBMC.-C. Liu, United Microelectronics Corp.
L. J. Chen, National Tsing Hua University
T. K. Ku, ITRI (Industrial Technology Research Institute)
C. S. Tan, Nanyang Technological University
X. Gu, SMIC(Semiconductor Manufacturing Int. Cop.)

Advisory Board
Y. Horiike, NIMS
H. Komiyama, Mitsubishi Research Institute
K. Tsubouchi, Tohoku University
M. Murakami, Ritsumeikan
N. Kobayashi, ASM JapanY. Yasuda, Tohoku University
T. Kikkawa, Hiroshima University
T. Ohba, Tokyo Institute of Technology
S. Zaima, Nagoya University
T. Ohta, The University of Tokyo
K. Masu, Tokyo Institute of Technology
M. Tsujimura, Ebara
A. Ohsaki, Shin-Etsu ChemicalS. Shingubara, Kansai University
T. Yoda, NuFlare Technology
Y. Shimogaki, The University of Tokyo
S. Kondo, Hitachi Chemical
K. Ueno, Shibaura Institute of Technology
H. Kawasaki, Quantum Biosystems
J. Koike, Tohoku University

http://www.admeta.org/index_2015.html