EPO-TEK® H20E-LC
Technical Data Sheet
For Reference Only
Electrically Conductive, Silver Epoxy

Date:
Rev:
No. of Components:
Mix Ratio by Weight:
Specific Gravity:
Pot Life:
Shelf Life- Bulk:

November 2019
VIITwo1:1
Part A: 2.42
Part B: 3.07
4 Days
One year at room temperature

Recommended Cure: 150°C / 1 Hour
Minimum Alternative Cure(s):May not achieve performance properties listed below
175°C / 45 Seconds
150°C / 5 Minutes
120°C / 15 Minutes
80°C / 3 HoursNOTES:● Container(s) should be kept closed when not in use.
● Filled systems should be stirred thoroughly before mixing and prior to use.
● Performance properties (rheology, conductivity, others) of the product may vary from those stated on the data sheet when bi-pak/syringe packaging or
post-processing of any kind is performed. Epoxy’s warranties shall not apply to any products that have been reprocessed or repackaged from Epoxy’s
delivered status/container into any other containers of any kind, including but not limited to syringes, bi-paks, cartridges, pouches, tubes, capsules, films
or other packages.

Product Description: EPO-TEK® H20E-LC is a two component, silver-filled epoxy system designed specifically for chip bonding in
microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal
conductivity. It has proven itself to be extremely reliable over many years of service and is the conductive adhesive of choice for low
chloride applications.
Typical Properties: Cure condition: 150°C / 1 Hour
Different batches, conditions & applications yield differing results.
Data below is not guaranteed. To be used as a guide only, not as a specification. * denotes test on lot acceptance basis
PHYSICAL PROPERTIES:* Color (before cure):* Consistency:* Viscosity (23°C) @ 100 rpm:
Thixotropic Index:* Glass Transition Temp:
Coefficient of Thermal Expansion (CTE):
Below Tg:
Above Tg:
Shore D Hardness:
Lap Shear @ 23°C:
Die Shear @ 23°C:
Degradation Temp:
Weight Loss:@ 200°C:@ 250°C:@ 300°C:
Suggested Operating Temperature:
Storage Modulus:
Ion Content:

Part A: Silver
Part B: Silver
Smooth paste
2,200 - 3,200 cPs
4.6≥ 80 °C (Dynamic Cure: 20-200°C/ISO 25 Min; Ramp -10-200°C @20°C/Min)
44174
60
1,672
≥5451

x 10-6 in/in°C
x 10-6 in/in°C
psiKg°C

1,778 psi

* Particle Size:

0.42
1.03
1.96
< 300939,871
11 ppm259 ppm≤ 45%%%°C (Intermittent)
psi
Na+:
6 ppm
K+:
2 ppm
microns

ELECTRICAL AND THERMAL PROPERTIES:
Thermal Conductivity:* Volume Resistivity @ 23°C:

2.0≤ 0.0004

W/mK
Ohm-cmCl-:
NH4+:Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com

EPO-TEK® H20E-LC
Technical Data Sheet
For Reference Only
Electrically Conductive, Silver Epoxy

EPO-TEK® H20E-LC Advantages & Suggested Application Notes:● Especially recommended for use in high speed epoxy chip bonding systems where very
fast cures are desired.
● Suggested for JEDEC Level III and II for plastic IC packaging.
● Capable of resisting TC wire bonding temperatures in the range of 300°C to 400°C.
● Ease of use: apply by dispensing, screen printing, die-stamping, or by hand.
● Especially suited for high power devices and high current flow; high power LEDs.
● Opto-electronic packaging material: LED, LCDs, and fiber optic components.

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com