Annual Technical Report 2018
FY2018
Optoelectronics Industry and Technology Development Association

—CONTENTS—
Message from OITDA……………………………………………………………

1

Optoelectronics Industry Trends………………………………………………

2

Technological Strategy Development…………………………………………

9Standardization ………………………………………………………………… 11
Educational and Public Relations Activities ………………………………… 16
Supporting Members…………………………………………………………… 18

Message from OITDA

Yasuhisa Odani
President/Vice Chairman
Optoelectronics Industry and Technology
Development Association (OITDA)

It is my pleasure to issue “Annual Technical Report 2018” which outlines the result of our surveys and R&D activities in
FY2018.
According to the “Optoelectronics Industry Trends Survey” conducted annually by OITDA, the total shipments of theoptoelectronics industry recorded negative growth of ▲2.93％ to reach 13.6 trillion yen in FY 2018, down from +0.8% in
FY 2017. Domestic production also showed ▲4.0% decrease to finish at 7,1 trillion yen in FY 2018, better than ▲6.1% in
FY 2017. Looking at the increased segment of the growth rate, laser and optical processing: +10,0%, image sensor: + 7,4%,
optical sensing device: +6,0%, LED lighting equipment: +5,0%, security camera & in-vehicle camera: +3,5%, opticaltransmission components: +3,5%. For the segment of photovoltaic power generation, the growth rate was ▲3,9% in FY2018
which seems bottomed out, while has worsened too much in three consecutive years due to the impact of the system change
and price reduction.
For the segments which are growing, those were supported by the strong demand of material processing equipment for
the automobile industry and the overseas semiconductor industry. And because of the technology innovation such as AI,
IoT, Big Data Processing, Self-driving /Mobility Service, it is expected to expand further the market of optical transmission
components used in data centers and transmission base stations, and various sensing devices and cameras used in information
system and vehicle. In addition, LED lighting equipment will continue to grow aiming 100% replacing.
Above mentioned innovative technologies are essential for achieving the “Connected Industries” advocated by theGovernment of Japan. The key technologies are to collect, transmit and utilize the huge amount of data efficiently.
Optoelectronics technology includes many important key technologies such as sensors for data collection, high-speed andlarge-capacity optical communication systems for data transmission and high-speed & low-power optoelectronic integrated
circuits for information processing.
OITDA has been promoting the formulation of a research and development strategy and commercialization strategy
through cooperation among industry, academia and government regarding the optoelectronics technologies. At the sametime, OITDA has engaged in the following priority issues: survey and research on the optoelectronics technology andindustry, promotion of technology development, promotion of standardization, creation of new business, and developmentof human resources. In FY 2018, we directed our efforts to these issues as in previous years, and based on the results of such
efforts, also conducted dissemination and education, international exchange and cooperation, and provision of informationon the optoelectronics technology and industry.
You can find the details of our activities in this report. So, I would like to point out noteworthy events in FY 2018. First,
we have organized the committee named “Optoelectronics Technology Roadmap Formulation Committee for Next-Generation
Network for Beyond 5G”. In this committee, we have speculated the suitable optoelectronics network in the B5G era,developed the roadmaps of optical access technology and optical device technology for implementing such network. We
have announced the roadmap at the “Optoelectronics Technology Symposium” in February 2019. I hope this roadmap will
be useful in R&D activities in industry, academia and government.
With regard to standardization, we actively carried out international standardization activities at IEC, ISO, and otherforums, primarily for the standardization of in-vehicle high-speed optical Ethernet, connectors for interconnection of opticalfibers, and silicon photonics interconnect and optical switches through the governmental project.
In order to support the growth of optoelectronics industry and technology, OITDA will strengthen and enhance ouractivities in accordance with needs, under the guidance of the Ministry of Economy, Trade and Industry and other governmentalorganizations and with the understanding and cooperation of our supporting members and many other people from thebusiness world and the academic community who are our important partners. We look forward to your continued guidance,
support, and cooperation.
1

Annual Technical Report2018 OITDAOptoelectronics Industry Trends
1. Introduction● FY 2017 (actual): 14,045 billion yen, growth rate: 0.8%
In FY 2017, total shipments (actual) for the optoelectronics industry
amounted to 14,045 billion yen (growth rate: 0.8%). This breaks down
as: 9,770 billion yen for optoelectronics equipment/systems (growth
rate: 2.0%, component ratio: 69.6%) and 4,275 billion yen for opticalcomponents (growth rate: −1.9%, component ratio: 30.4%).
The shipments by field were:
502 billion yen for the optical communication field (growth rate: −3.9%,
component ratio: 3.6%),
846 billion yen for the optical storage field (growth rate:−4.0%, component ratio: 6.0%),
3,679 billion yen for the I/O field (growth rate: 4.9%, component ratio:
26.2%),
5,618 billion yen for the display and solid-state lighting field (growth
rate: 5.9%, component ratio: 40.0%),
2,334 billion yen for the photovoltaic energy field (growth rate: −17.6%,
component ratio: 16.6%),731 billion yen for the laser/optical processing field (growth rate: 13.0%,
component ratio: 5.2%), and224 billion yen for the sensing and measuring field (growth rate: 4.7%,
component ratio: 1.6%).
● FY 2018 (estimate): 13,635 billion yen, growth rate: −2.9%
Total shipments for the optoelectronics industry in FY 2018 are
estimated to remain roughly flat at 13,635 billion yen (growth rate:−2.9%). This breaks down as: 9,470 billion yen for optoelectronics
equipment/systems (growth rate: −3.1%, component ratio: 69.5%) and
4,164 billion yen for optical components (growth rate: −2.6%,
component ratio: 30.5%).
The shipments by field are estimated to be:
513 billion yen for the optical communication field (growth rate: 2.2%,
component ratio: 3.8%),781 billion yen for the optical storage field (growth rate:−7.6%, component ratio: 5.7%),
3,482 billion yen for the I/O field (growth rate: −5.4%, component
ratio: 25.5%),
5,460 billion yen for the display and solid-state lighting field (growth
rate: −2.8%, component ratio: 40.2%),
2,243 billion yen for the photovoltaic energy field (growth rate: −3.9%,
component ratio: 16.4%),
804 billion yen for the laser/optical processing field (growth rate: 10.0%,
component ratio: 5.9%), and236 billion yen for the sensing and measuring field (growth rate: 5.4%,
component ratio: 1.7%).
● FY 2019 (projections): flat
Total shipments are projected to be flat for the optoelectronics industry
overall, as well as for optoelectronics equipment/systems and opticalcomponents in FY 2019.
By field, the optical communication field, the optical storage field,
the I/O field and the photovoltaic energy field will remain steady, thedisplay and solid-state lighting field, the laser/optical processing field
and the sensing and measuring field will increase slightly.

OITDA has conducted “Survey of Trends of the Optoelectronics
Industry” annually since its foundation in 1980. The accumulated survey
data of more than 30 years are highly regarded as the basic source forproperly recognizing the trend of optoelectronics industry.
This year, we have set seven research sub-committee under the“Optoelectronic Industry Trends Investigation Committee” and haveconducted survey for getting the statistical data from FY 2017 to FY
2019, including the shipment value and domestic production value ofentire optoelectronic industry.

2.	Total Shipments and Domestic Production for the
Optoelectronics Industry
2.1 Survey Method1)We have sent the questionnaire for actual results for FY 2016, estimatedvalues for FY 2017, and qualitative projections for FY 2018 concerning
total shipments and domestic production to the Japanese companies
which produce optoelectronics-related products (optoelectronics
equipment/systems, optical components).
2)In addition to the questionnaire survey, we also referred to the dataof the Japan Photovoltaic Energy Association (JPEA), Japan Lighting
Manufacturers Association (JLMA), Japan Electronics and Information
Technology Industries Association (JEITA), Camera & Imaging
Products Association (CIPA), and Fuji Chimera Research Institute,
Inc. regarding the photovoltaic energy field, solid-state lighting field,
display field, and I/O field.
3)Based on the results of the questionnaire, each sub-committee
examined the validity of the data and analyzed industry trends. And
the validity of the data and analysis results was reconfirmed by the“Optoelectronic Industry Trend Research Committee”, and the total
shipments value and domestic production value of the Japanese
optoelectronic industry had been summarized.
In conducting the survey, we classified optoelectronics industry
into the seven fields as described below.
1. OpticalCommunication:

Optical transmission equipment/systems, opticalfiber fusion splicer, light emitting devices, photodetectors, optical passive components, opticalfiber, optical connectors, etc.

2. Optical Storage:

Optical disc equipment (read-only, recordable), opticaldisc media, laser diodes, etc.

3. Input/Output(I/O):

Optical printers, multifunction printers, digital
cameras, digital video cameras, camera mobile
phones, image sensors, etc.

4. Display and Solid-

Flat-panel

display

state Lighting:projectors,

solid-state

devicesandlighting

equipment,

devicesandequipment, LED (for lighting and displays), etc.
5. Photovoltaic
Energy:Photovoltaic

power

generation

systems,

photovoltaic cells and modules

6. Laser/Optical

Laser/Optical processing equipment, Lamp/LD

Processing:lithography, additive manufacturing (3D printers),

7. Sensing andOptical measuring instruments, optical sensing

laser oscillators
Measuring:
8. Others:

2.3 Overview of Survey Results of Domestic Production
Table 2 shows the results of FY 2017 (actual), FY 2018 (estimate)and FY 2019 (projections) of domestic production.
The blue shaded sections in Table 2 represent optoelectronics
equipment/systems, and the yellow sections represent opticalcomponents.
● FY 2017 (actual): 7,389 billion yen, growth rate: −6.1%
In FY 2017, the domestic production of the optoelectronics industry(actual) decreased slightly to 7,389 billion yen (growth rate: −6.1%).
This breaks down as: 4,153 billion yen for optoelectronics equipment/

equipment
Hybrid optical devices, etc.

2.2 Overview of Survey Results of Total Shipments
Table 1 shows the results of FY 2017 (actual), FY 2018 (estimate)and FY 2019 (projections) for total shipments. The blue shaded sectionsin Table 1 represent optoelectronics equipment/systems, and the yellow
sections represent optical components.

Annual Technical Report2018 OITDA

2

Optoelectronics Industry Trends
systems (growth rate: −7.8%, component ratio: 56.2%) and 3,236 billion
yen for optical components (growth rate: −3.8%, component ratio:
43.8%).
The domestic production by field was:403 billion yen for the optical communication field (growth rate: −8.5%,
component ratio: 5.5%),
132 billion yen for the optical storage field (growth rate:−39.5%, component ratio: 1.8%),
1,074 billion yen for the I/O field (growth rate: −5.3%, component
ratio: 14.5%),
2,986 billion yen for the display and solid-state lighting field (growth
rate: −1.1%, component ratio: 40.3%),
1,823 billion yen for the photovoltaic energy field (growth rate: −17.1%,
component ratio: 24.7%),716 billion yen for the laser/optical processing field (growth rate: 13.9%,
component ratio: 9.7%), and177 billion yen for the sensing and measuring field (growth rate: 6.1%,
component ratio: 2.4%).
● FY 2018 (estimate): 7,097 billion yen, growth rate: −4.0%
The domestic production of the optoelectronics industry in FY 2018is estimated to be 7,097 billion yen (growth rate: −4.0%).
This breaks down as: 4,180 billion yen for optoelectronics equipment/
systems (growth rate: 0.7%, component ratio: 58.9%) and 2,917 billion
yen for optical components (growth rate: −9.9%, component ratio:
41.1%).
The domestic production by field was:
415 billion yen for the optical communication field (growth rate: 2.8%,
component ratio: 5.8%),
133 billion yen for the optical storage field (growth rate: 0.4%,
component ratio: 1.9%),964 billion yen for the I/O field (growth rate: −10.3%, component
ratio: 13.6%),
2,802 billion yen for the display and solid-state lighting field (growth
rate: −6.2%, component ratio: 39.6%),
1,732 billion yen for the photovoltaic energy field (growth rate: −5.0%,
component ratio: 24.4%),
783 billion yen for the laser/optical processing field (growth rate: 9.4%,
component ratio: 11.0%), and188 billion yen for the sensing and measuring field (growth rate: 6.1%,
component ratio: 2.6%).
● FY 2019 (projections): flat
The domestic production of the optoelectronics industry in FY 2019is projected to be flat. Both optoelectronics equipment/systems andoptical components will be flat.
By field, the laser/optical processing field and the sensing andmeasuring field will increase slightly, while the optical storage field
and the I/O field will decrease slightly. The optical communication field,
the display and solid-state lighting field and the photovoltaic energy
field will remain steady.

and Great East Japan Earthquake in 2011. After that, in terms of total
shipments, growth rate turned to be positive due to the rapid growth ofthe photovoltaic energy field, but after the peak in FY 2014, this field
began to decline significantly, and the optoelectronics industry as awhole decreased for two consecutive years in FY 2015 and FY 2016.
In particular, the decrease in the display and solid-state lighting fieldand I/O field were huge in FY 2016, and both total shipments anddomestic production decreased by more than 10%.
However, the results of the survey in FY 2018 has shown that the
optoelectronics industry is estimated to be almost flat for three years
from FY 2017 to FY 2019, which were signs of stop decreasing. But
looking at each field, the laser/optical processing field and the sensing
and measuring field continue to grow. The photovoltaic energy field,
which has continued to decline significantly due to the impact of pricedeclines, is finally showing signs of recovery. Below is a summary of
the survey and analysis results of the latest survey.
(1) FY 2017 (actual)
Due to the solid investment primally in the semiconductor andautomotive industry, total shipments and domestic production had
increased in the laser/optical processing field and the sensing andmeasuring field.
In the display and solid-state lighting field, 4K TVs and LED lighting
fixtures were firm, namely total shipments increased slightly anddomestic production was almost flat.
In the I/O field, image sensors increased. I/O equipments, which
decreased significantly in the previous year, recovered as a whole andtotal shipment increased slightly. But smartphone, printer andmultifunction printer decreased drastically. As a result, total shipments
decreased slightly.
On the other hand, in the optical communication field, opticaltransmission components for trunk/metro line and subscriber line
declined. Parts such as light emitting device and photo detector, whichwere performing well until now, declined due to inventory adjustments.
As a result, both total shipments and domestic production declined
slightly.
In the optical storage field, total shipments decreased slightly due tocontinuous price and demand declines, and domestic production declined
significantly due to the overseas transfer.
In the photovoltaic energy field, total shipments declined due to thedecline in demand and lower prices.
In the optoelectronics industry as a whole, the total shipments was
14,045 billion yen (growth rate: 0.8%), and domestic production was
7,389 billion yen (−6.1%).
(2) FY 2018 (estimate)
Due to the solid investment primally in the semiconductor andautomotive industry, total shipments and domestic production are
estimated to increase steadily in the laser/optical processing field andthe sensing and measuring field.
In the optical communications field, optical transmission components
for trunk/metro line and subscriber line are estimated to increase due
to domestic capital investments for communications, and a positive
increase in total shipments and domestic production due to growing
demand for overseas optical fibers and related components.
In the optical storage field, sales of optical discs for business use are
estimated to increase, on the other hand, read-only devices continued
to decline, as a result, total shipments will decrease and domestic
production will be flat.
In the I/O field, total shipments and domestic production are expected
to decrease slightly due to a decrease in demand for consumer devices
such as smartphones and digital cameras.
In the display and solid-state lighting field, LED lighting fixtures are
growing steadily and those of display equipment are flat, but display

2.4 Trend in Optoelectronics Industry
Fig.1 and Fig.2 show changes in the total shipment value of theoptoelectronics industry and trends in each field. Fig.3 and Fig.4 showchanges in the domestic production value of the optoelectronics industry
and changes by field. Fig.1 and Fig.3 show nominal GDP and electronic
industry production in order to compare changes in the scale of theoptoelectronics industry with those of the Japanese economy and otherindustries.
The optoelectronics industry in Japan had continued to grow for morethan 20 years since 1980, which we had begun to conduct survey, eventhough there was a temporary decline due to the collapse of the IT
bubble. The situation continued to be harsh since financial crisis in 2008

3

Annual Technical Report2018 OITDA

Table 1
Product Items

Optical Equipment

Optical Communications Field
Optical Transmission Equipment

Optical Component

522,727▲ 0.4

144,701▲ 15.7

▲ 3.9
▲ 7.4

513,378
131,155

FY 2019 Shipment
Projection

2.2

flat

▲ 2.1

flat

54,204▲ 24.160,86812.3

flat

Subscriber Line38,621▲ 11.1

40,527

4.9

34,538▲ 14.8flat

Router and Switch

27,335

8.3

32,57219.2

28,395▲ 12.8 slight increase

7,295▲ 19.7

6,727

▲ 7.8

7,354

9.3 increase

Optical Fiber Amplifier
356,772

8.2

346,897▲ 2.8

359,182

3.5

flat▲ 16.7flat

Optical Transmission Link

76,919▲ 1.2

80,563

4.7

67,129Light Emitting Device

66,65820.3

54,995▲ 17.558,085Photo Detectors

25,32848.3

18,204▲ 28.1

19,697

Optical Passive Component

26,237▲ 2.3

24,269▲ 7.5

24,022▲ 1.0

Optical Circuit Component

28,74949.7

29,6703.2

35,14718.5 slight increase

Optical Fiber

98,002▲ 1.6

98,0980.1

110,110

12.2

flat

Optical Connector

23,2270.0

27,075

16.6

30,917

14.2

flat

Others（Semiconductor Amplifying
Device, etc.）

11,652

11.2

14,02320.3

14,0750.4

flat

Optical Disk

5.6 slight increase
8.2 slight increaseflat

21,254▲ 9.1

21,421

0.8

23,041

880,757▲ 6.7

845,832▲ 4.0

781,290

▲ 7.6

flat

862,777▲ 6.8

828,554▲ 4.0

765,024

▲ 7.7

flat

Equipment

7.6 slight increase

775,724▲ 7.1

732,914▲ 5.5

677,849

▲ 7.5

flat

Read-only (CD, DVD, BD)

512,050▲ 6.3

498,386▲ 2.7

442,165▲ 11.3flat

Recordable

263,674▲ 8.5

234,528▲ 11.1

235,684

0.5

Media

36,395▲ 0.3

47,77831.3

42,909▲ 10.2slight decrease

Others (Optical Head, etc.)

50,658▲ 7.1

47,862▲ 5.5

44,266▲ 7.5

slight decrease

17,980▲ 0.9

17,278▲ 3.9

16,266▲ 5.9

slight decrease

Laser Diode
Input/Output Field
Optical I/O Equipment		

Optical Equipment

502,348
134,030

FY 2018 Shipment Estimate(in million yen)
Growth Rate(%)▲ 23.9Optical Fiber Fusion Splicer▲ 16.6

3,679,198

4.9*

3,481,656

▲ 5.4

flat

2,706,794▲ 22.3

2,844,913

0.3*

2,585,448

▲ 9.1

flat
flat

720,809▲ 6.3

720,661

0.0

693,770▲ 3.7

Imaging equipment

914,593▲ 16.3

1,072,988-

993,808▲ 7.4

914,593▲ 16.3

943,8963.2

860,236▲ 8.9

Digital Camera, Digital Video Camera--

129,092-

133,572

Camera Mobile Phone

977,123▲ 35.2968,956▲ 0.8

825,702▲ 14.8Others (Barcode Reader, Image
Scanner, etc.)

94,269▲ 16.582,308▲ 12.7

72,168▲ 12.3

Security camera, Car-mounted camera *Image Sensor
Display Equipment

3.5 slight increaseflat
decrease

678,750

17.6

834,28522.9

896,208

7.4 slight increase▲ 17.2

5,618,363

5.9

5,460,469▲ 2.8 slight increase▲ 22.92,703,493

15.0

2,683,883

2,350,655▲ 0.7 slight increase

2,064,792▲ 24.2

2,392,381

15.9

2,379,422

Projector

249,341▲ 11.0274,1239.9

265,402

Others (Large-scale LED Display, OELD TV, etc.)

36,522▲ 3.9

36,9891.3

39,059

Solid-state Lighting

flatslight decrease

5,303,298

Flat Panel Display

Display Device

flat

3,385,544

Optical Printer・Multifunction Printer

Display and Solid-state Lighting Field

Optical Equipment

FY 2017 Shipment Estimate(in million yen)
Growth Rate(%)

71,450

Optical Storage Field

Optical Equipment

FY 2016 Shipment Actual(in million yen)
Growth Rate(%)

Truck Line and Metro Line

Optical Transmission Components

1,912,719▲ 18.91,870,349▲ 2.2

1,702,100

672,607

5.8

693,618

3.1

716,301▲ 0.5 slight increase

flat

▲ 3.2

5.6 slight increase▲ 9.0

slight decrease

3.3 slight increase

LED Device

598,0638.0

628,5785.1

660,141

LED Lamp

74,544▲ 9.0

65,040▲ 12.756,160▲ 13.7367,3172.7

350,903▲ 4.5

358,1852.1

flat

2,831,220▲ 24.2

▲ 3.9

flat

LED
Photovoltaic Energy Field

2,333,842▲ 17.62,242,594

5.0 slight increaseslight decrease

Photovoltaic Power System

1,983,736▲ 26.3

1,660,001▲ 16.3

1,598,068

▲ 3.7

flat

Photovoltaic Cell/Module

847,484▲ 18.6

673,841▲ 20.5644,526

▲ 4.4

flat

Laser/Optical Processing Field

646,853

16.0

13.0

731,09310.0 slight increase

804,35419.7

659,432

13.8

731,180

CO2 Laser

50,957▲ 20.954,3386.6

47,814▲ 12.0Solid State Laser

40,2098.7

44,095

9.7

47,693

8.2

Fiber Laser

57,082

37.0

63,031

10.4

75,355

19.6 slight increase
19.8 increase

Laser and Optical Processing Equipment

Optical Equipment

Shipment of Optoelectronics Industry (Summary)

579,372

10.9 slight increaseslight decrease
flat

3,145

26.5

3,536

12.4

4,236

Excimer Laser

151,13621.8

140,711▲ 6.9

169,737

20.6

flat

Lamp/LD Exposure Machine

274,57330.0

350,63027.7

383,589

9.4

flat

2,270

▲ 26.7

3,091

36.2

2,756

Semiconductor Laser Direct Processing Equipment

Additive Manufacturing (3D Printer)
Oscillator
Optical Sensing and Measurement Field

67,481▲ 8.2

257,895

2.5

71,661

6.2
4.7*

224,187

73,174▲ 10.8 increase
2.1

flat

5.4 slight increase

236,381

Optical Measuring Instrument

12,705

3.4

12,331▲ 2.9

11,735

Optical Sensing Equipment

245,190

2.5

211,856

5.3*

224,646

6.0 slight increase

110,83110.7

110,253▲ 0.5

114,646

4.0

Others Field
Product Items

FY 2016 Shipment Actual(in million yen)
Growth Rate(%)

FY 2017 Shipment Estimate(in million yen)
Growth Rate(%)▲ 4.8

FY 2018 Shipment Estimate(in million yen)
Growth Rate(%)

flat
flat
FY 2019 Shipment
Projection

Sub Total for Optoelectronics Equipment

9,579,791▲ 18.2

9,769,649

2.0

9,470,481

▲ 3.1

flat

Sub Total for Optoelectronics Components

4,359,334▲ 10.54,275,467▲ 1.9

4,164,287

▲ 2.6

flat

Total for Optoelectronics Products

13,939,125▲ 15.9 14,045,116

0.8 13,634,768

▲ 2.9

flat

Annual Technical Report2018 OITDA

4

Optoelectronics Industry Trends
Table 2
Product Items

Optical Equipment

Optical Communications Field
Optical Transmission Equipment

Optical Component
Optical Equipment

FY 2018 Shipment Estimate(in million yen)
Growth Rate(%)

FY 2019 Shipment
Projection

440,950▲ 1.1

403,380▲ 8.5

414,550

2.8

flat

132,538▲ 16.8124,187▲ 6.3

123,480

▲ 0.6

flat

▲ 23.453,599▲ 24.260,183

12.3

flat

Subscriber Line

37,300▲ 10.8

46,11423.6

40,201▲ 12.8flat

Router and Switch

18,451

3.8

19,146

3.8

17,208▲ 10.1 slight increase

6,060▲ 17.05,328▲ 12.1

Optical Fiber Amplifier

5,888

10.5 increase
4.0

flat

Optical Transmission Link

50,406

3.1

38,338▲ 23.932,546▲ 15.1flat

Light Emitting Device

43,482

17.9

31,869▲ 26.730,676▲ 3.7 slight increase

Photo Detectors

18,23065.1

11,761▲ 35.5

12,098

Optical Passive Component

23,712▲ 6.1

22,777▲ 3.9

22,489▲ 1.3

Optical Circuit Component

26,43548.5

23,815▲ 9.9

28,09018.0 increase

Optical Fiber

94,382

0.5

92,713▲ 1.8

100,460

8.4

flat

Optical Connector

19,005▲ 1.0

22,52818.5

26,63818.2

flat

Others（Semiconductor Amplifying
Device, etc.）

11,506

11.2

13,971

21.4

15,032

7.6

flat

Optical Fiber Fusion Splicer
Optical Disk

287,158

9.0

257,772▲ 10.2

268,029

2.9 slight increaseflat

21,254▲ 9.1

21,421

0.8

23,041

7.6

218,837▲ 7.1

132,320▲ 39.5

132,8810.4

slight decrease▲ 7.7

128,385▲ 40.2

128,291

flat

▲ 0.1

slight decrease

Equipment

203,408▲ 5.4

116,936▲ 42.5

117,0090.1

slight decreaseMedia

11,306▲ 36.1

11,4491.3

11,282▲ 1.5

Laser Diode

4,123

47.3

3,935

▲ 4.6

4,590

16.6

Input/Output Field
Optical I/O Equipment		

Optical Equipment

FY 2017 Shipment Actual(in million yen)
Growth Rate(%)

70,727

Optical Storage Field

214,714flat
slight decrease

1,121,434

0.9

1,074,423▲ 5.3*

963,820▲ 10.3slight decrease

534,613▲ 15.6466,204▲ 15.0*436,184▲ 6.4

slight decrease

Optical Printer・Multifunction Printer87,993▲ 24.458,469▲ 33.6

61,531

5.2

Imaging equipment

264,133▲ 6.7

273,771-

268,119▲ 2.1

264,133▲ 6.7

261,893▲ 0.8

254,707▲ 2.7

Digital Camera, Digital Video Camera

flat
flat
slight decrease--

11,878-13,412

Camera Mobile Phone

144,448▲ 24.1

109,521▲ 24.285,800▲ 21.7slight decrease

Others (Barcode Reader, Image
Scanner, etc.)

38,039▲ 13.824,443▲ 35.7

20,734▲ 15.2decrease

Security camera, Car-mounted camera *Image Sensor
Display and Solid-state Lighting Field

Optical Equipment

FY 2016 Shipment Actual(in million yen)
Growth Rate(%)

Truck Line and Metro Line

Optical Transmission Components

Display Equipment

12.9 slight increase

586,82122.7

608,219

3.6

527,636

3,017,867▲ 9.9

2,985,841▲ 1.1

2,801,579

▲ 6.2

flat

534,901▲ 1.5

524,902▲ 1.9

516,758

▲ 1.6

flat

▲ 13.2 slight increase

Flat Panel Display

476,660▲ 1.1

465,702▲ 2.3

454,977

▲ 2.3

flat

Projector

21,719▲ 7.4

22,211

2.3

22,722

2.3

flat

Others (Large-scale LED Display, OELD TV, etc.)

36,522▲ 3.9

36,9891.3

39,0595.6 slight increase

Display Device
Solid-state Lighting

1,705,267▲ 18.1

1,655,049▲ 2.9

1,435,562

429,5567.9

458,7816.8

478,642▲ 13.3slight decrease

4.3 slight increase

LED Device

418,6478.0

446,8466.7

469,284

LED Lamp

10,9095.3

11,9359.4

9,358▲ 21.6348,143

6.3

347,109▲ 0.3

370,6176.8

flat

2,198,132▲ 26.9

▲ 5.0

flat

LED
Photovoltaic Energy Field

1,822,669▲ 17.1

1,732,217

5.0 slight increaseslight decrease

Photovoltaic Power System

1,907,821▲ 26.6

1,607,320▲ 15.81,574,970

▲ 2.0

flat

Photovoltaic Cell/Module

290,311▲ 28.9215,349▲ 25.8157,247▲ 27.0flat

Laser/Optical Processing Field

628,398

15.5

13.9

715,841

9.4 slight increase

783,03619.3

644,91314.7

711,165

CO2 Laser

47,125▲ 24.852,682

11.8

46,971▲ 10.8

Solid State Laser

34,298

4.5

38,69512.8

42,303

9.3

Fiber Laser

52,82436.0

55,6795.4

62,128

11.6 slight increase

Laser and Optical Processing Equipment

Optical Equipment

Domestic Production of Optoelectronics Industry (Summary)

562,440

Semiconductor Laser Direct Processing Equipment

10.3 slight increaseslight decreaseflat

6.7 increase

3,519

59.0

3,449

▲ 2.0

3,681

Excimer Laser

147,83122.4

140,687▲ 4.8

169,737

20.6

flat

Lamp/LD Exposure Machine

274,57330.0

350,63027.7

383,589

9.4

flat

2,270

▲ 26.7

3,091

36.2

2,756

Additive Manufacturing (3D Printer)
Oscillator

Optical Sensing and Measurement Field

65,958▲ 9.0

165,725

2.4

70,9287.5
6.1*

177,049

71,871▲ 10.8 increase
1.3

flat

6.1 slight increase

187,857

Optical Measuring Instrument

11,186

9.2

10,932▲ 2.3

10,599Optical Sensing Equipment

154,5392.0

166,117

6.8*

177,258

6.7 slight increase

76,432▲ 1.0

77,9332.0

81,046

4.0

Others Field
Product Items

FY 2016 Shipment Actual(in million yen)
Growth Rate(%)

FY 2017 Shipment Actual(in million yen)
Growth Rate(%)▲ 3.0

FY 2018 Shipment Estimate(in million yen)
Growth Rate(%)

flat
flat
FY 2019 Shipment
Projection

Sub Total for Optoelectronics Equipment

4,503,562▲ 13.8 4,153,162▲ 7.8 4,180,388

0.7

flat

Sub Total for Optoelectronics Components

3,364,213▲ 9.5 3,236,294▲ 3.8 2,916,598

▲ 9.9

flat

Total for Optoelectronics Products

7,867,775▲ 11.9 7,389,456▲ 6.1 7,096,986

▲ 4.0

flat

*Security camera and car-mounted camera were moved from the sensing and measurement field to the I/O field. Growth rate of each field was calculated excluding security camera and car-mounted camera.

5

Annual Technical Report2018 OITDAdevice are decreasing due to competition with overseas manufacturers,
and total shipments and domestic production are estimated to decreaseslightly.
In the photovoltaic energy field, although the impact of continuous
price declines, the significant downward trend accompanying the change
in the FIT system has finally been put to a halt, and total shipments anddomestic production are estimated to decrease slightly.
In the optoelectronics industry as a whole, the total shipments (13,635
billion yen, growth rate: −2.9%) and domestic production (7,097 billion
yen, growth rate: −4.0%) are expected to decrease slightly.
(3) FY 2019 (projections)
In the laser/optical processing field and the sensing and measuring
field, where industrial applications such as fiber laser processing
machines and FA image sensing equipment are forecasted to be robust
both for total shipments and domestic production.
In the display and solid-state lighting fields, 4K TV and OLED TV
will increase due to the progress of new 4K/8K satellite and Tokyo
Olympics. Total shipments will increase slightly and domestic production
will be flat.
In the optical communications field, optical components will increase
due to overseas demand for optical fiber, but trunk and subscriber opticaltransmission equipment will remain flat, and the total shipments anddomestic production will remain flat.
In the photovoltaic energy field, although demand will increase, total
shipments and domestic production will remain flat due to price declines.

In the I/O field, due to lack of favorable factors, the total shipments
will be flat and domestic production will continue decreasing slightly.
In the optical storage field, there will be certain demand forcommercial use and 4K video, the total shipments will be flat, anddomestic production will decrease slightly.
In the entire optoelectronics industry, total shipments and domestic
production will be flat.

3. International Optoelectronics Association
OITDA was established in 1980 with the aim of promoting theoptoelectronics industry for the first time in the world. In the 1990s,
similar organizations had been established around the world. In July
1996, OITDA had organized the world conference on optoelectronics
industry in collaboration with OIDA (US), PIDA (Taiwan) and SOA(Scotland), which had been established already at that time, in accordancewith the international exhibition “interOpto” organized by OITDA. After
that, it was decided to be held yearly and named it the IOA (International
Optoelectronics Association). There are 9 organizations participating.
Fig.5 shows the names and locations of the member organizations.
The optoelectronics industry in the world, as a whole, showed atendency to be almost stable. Under such circumstances, M & A are
also on the rise, seeking the next move. In addition, in order to create
innovations, light-related projects have been proposed in each country
and region, and the efforts to the government have been strengthened.

60

Total Shipment (Trillion yen)

50

40

Nominal GDP#1
▲1.1

9.4
▲11.3

0.1

0.7

1.3

3.3

5.2

600.0

500.0

400.0

Domestic and Overseas Electronics Production #2
▲8.9

30

2.8

2.2

2.6

2.4

▲12.9

7.4

1.1

1.5

300.0

Numeral: Growth ratio compared tothe preceding ﬁscal year

20

5.8

▲5.7

1.5

14.9

▲6.0

200.0
▲15.9

0.8

▲2.9

100.0

Total Shipment of Domestic Optoelectronics Companies

10

0

▲0.8

2008

2009

2010

2011

2012

2013

2014

Fiscal Year

2015

2016

2017

2018

0.0
2019

Estimate Prediction#1 Cabinet Office: National Accounts for 2017/Fiscal 2019 Economic Outlook (Jan. 28, 2019 ［Cabinet Decision］)#2 JEITA: Production Forecasts for the Global Electronics and Information Technology Industries, Dec., 2018

Fig.1

Annual Technical Report2018 OITDA

Total Optoelectronics Shipment, Nominal GDP, and Domestic & Overseas Electronics Production

6

Nominal GDP (Trillion yen)

1.5

0.9

2.0

Optoelectronics Industry Trends

8.0

2.0

Display and Solid-state Lighting

Total Shipment (Trillion yen)

6.0

1.5
Optical Storage
I/O

1.0

4.0
Photovoltaic
EnergyLaser/Optical
Processing

Optical Communication

0.5

2.0

Sensing and Measuring0.0

2009 2010 2011 2012 2013 2014 2015 2016 2017 2018

Estimate

Fiscal year

Fig.2

2009 2010 2011 2012 2013 2014 2015 2016 2017 2018

Estimate

Fiscal year

Shipment by Product Field30
1.2 ▲1.8

25

9.6

20

▲18.2

0.8

▲0.8

Domestic Electronics Production #2

0.6 0.4

0.6 0.7

7.0

1.5
▲3.4

0.1
▲1.1

5

500

2.6

13.7

0.1 5.3 0.6

29.2
11.2 2.7

2.0

1.1

▲16.7

▲15.1

600

400

▲15.0

▲26.7

Domestic Optoelectronics Production

2.8

▲7.9

▲3.5

15

10

0.7

6.5 ▲0.8

2.3

▲12.0

▲4.0

2.2

2.4

300
2.6

▲10.7 ▲2.0
7.3

21.8

4.8

6.8
▲9.8

4.1

▲1.9

1.6
0.5

200

▲11.9

▲9.5 ▲10.5 ▲1.5

▲4.0
▲6.1

100

Numeral: Growth ratio compared tothe preceding ﬁscal year

80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 00 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 17 18 19
Fiscal Year
#1 Cabinet Office: National Accounts for 2017/Fiscal 2019 Economic Outlook (Jan. 28, 2019 ［Cabinet Decision］)#2 JEITA: Production Forecasts for the Global Electronics and Information Technology Industries, Dec., 2018

Fig.3

Estimate

00Prediction

Domestic Production (Trillion yen)

Nominal GDP #1

0.9

Nominal GDP (Trillion yen)

0.0

Domestic Optoelectronics Production, Nominal GDP, and Domestic Electronics Production

7

Annual Technical Report2018 OITDA

4.5
4.0
3.5

Domestic Production (Trillion yen)

Display and
Solid-state Lighting

I/O

Photovoltaic Energy

3.0
2.5
2.0
1.5
Optical Storage

1.0
0.5
0.0

Sensing and
Measuring
Laser/Optical Processing

OpticalCommunication

1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018
Fiscal year

Fig.4

■ Canada■ EU■ Korea■ Germany■ Japan■ U.S.A■ Taiwan■ Scotland■ Switzerland

Domestic Optoelectronics Production by Product Field

Canadian Photonic Industry Consortium
CPIC
EPIC
European Photonics Industry Consortium
KAPID Korean Association for Photonics Industry Development
OptecNetOITDA Optoelectronic Industry and Technology Development Association
Optoelectronic Industry Development Association
OIDA
Photonics Industry and Technology Development Association
PIDA
Scottish Optoelectronics Association
SOA
Swissphotonics
Fig.5

Annual Technical Report2018 OITDAIOA Members (as of 2018)8

Estimate

Technological Strategy Development
1. Introduction

simplified antenna site, power saving and space saving can also be
achieved. Furthermore, RoF technology is expected to be applicable asa radio signal relay. On the other hand, high linearity is required for boththe modulation and light receiving components for generating andreceiving RoF/IFoF signals. Another technical challege is how to suppress
signal quality degradation due to multiple reflections in the transmissionpath.
The PON technology is considered to achieve large transmission
capacity, low latency and high power budget. Firstly, PON can reduce
latency drastically by using fixed bandwidth allocation or latency
dynamic bandwidth allocation even though conventional TDM-PON
has issue in latency. In addition, it is likely that 100 Gbps/λ class canbe achieved by applying equivalent technologies using machine learning.
Furthermore, by using TWDM-PON, which is an extension of TDMPON, it is expected to be able to control the bandwidth dynamically andflexibly and provide various services required for B5G. On the other
hand, in the B5G era, as the number of cells increases, further expansionof the power budget is required. Coherent PON is considered to be thekey technology for achieving this. By coherently detecting the complex
amplitude of light, dispersion compensation using a DSP (Digital Signal
Processor) is possible, and a large capacity exceeding 100 Gbps/λ canbe achieved while securing a power budget of more than 29 dB.
Coherent PON is satisfactory in terms of performance, but low power
consumption and cost reduction of optical transceivers are the challenges
for actual implementation.

OITDA has been developing “Optical Technology Roadmap” since1996 with the aim of identifying the future technologies of the opticalindustry for directing the R&D. This activity has contributed widely tothe development of optical industry as one of the key factors of manynational R&D projects in the fields of information andtelecommunication, recording of information, display device, opticalenergy and optical processing. This year, we have developed the “Opticaltechnology roadmap of next generation network for Beyond 5G” basedon that the 5G mobile communication system will be already scheduled
to introduce in 2020, so we should focus on the future generation.

2. Optical technology roadmap
In developing the roadmap, firstly, we have speculated the suitable
optical network in the B5G era. And secondly, we picked up the potential
issues in the B5G era. And thirdly, conducted the trend survey of R&D
which might be capable of solving those issues.
2.1 Speculation of the network in the B5G era
In the B5G era, the number of terminals connected to the network
will increase drastically for providing the wide variety of service.
Consequently, network will be used in various situation and purpose.
Especially in the access area, small cells will be minimized: picocells/
femtocells (<100 m), and spatial multiplicity by Massive MIMO(Multiple-Input and Multiple-Output) will also increase (multiplicity>100). In addition, the mobile edge computing will be spreading widelyin order to achieve extremely low latency of applications. Due to theincrease of access traffic, the capacity of the backbone network will be
expected to accelerate (> 100 Gbps@MFH, > Tb/s@MMH/MBH, MFH:
Mobile Fronthaul, MMH: Mobile Midhaul , MBH: Mobile Backhaul).

2.4 Optical device technology for B5G
For MFH, IMDD device of 100 Gbps/λ and more is considerednecessary. As a transmission device, EML has advantage in terms ofmodulation bandwidth, but in recent years, the bandwidth of DML(Directly Modulated Laser) using photon resonance effect has been
expanding, and the bandwidth exceeding 50 GHz has been demonstrated.
On the other hand, as a receiving device, there is a trade-off between
bandwidth and sensitivity. In addition to conventional compound
semiconductors and pin PD (Photodiode) using SiGe, new materials
such as graphene has gotten attention from industry. Furthermore, theswitching speed of APD (Avalanche Photodiode) is also increasing. 100
Gbps (50 GBd PAM4, PAM4: 4-level Pulse Amplitude Modulation) or
more has been demonstrated.
For MBH, a coherent scheme is expected to be applied. In terms of
bandwidth, InP-type modulation elements have advantage and abandwidth of 60 GHz has been demonstrated. As a result, it is probablethat the optical transmitter of 800 Gps/λ and more is shown by thepolarization multiplexing 16QAM (Quadrature Amplitude Modulation)
method. On the other hand, the Si-type modulation is also accelerated,
and a band of 40 GHz has been demonstrated. In order to develop a
compact optical transceiver of 10 Tbps class for B5G, it is required thatsuch transmitter will be wavelength-multiplexed in a compact manner
as well as that III-V and Si hybrid integration technology.
For applying the RoF technology, high-speed EO/OE conversion
components is also under development. As an EO conversion component
with excellent linearity, LN (Lithium Niobate) material has advantage
to apply. Particularly, there is a report that 100 GHz has been
demonstrated by using a modulator which use a thin film LN substratethat has become available in recent years. On the other hand, modulation
components using organic EO materials, which is pointed out reliability
issue, have solved it in recent years. So, it is expected to be downsizedand highly integrated by integrating with Si photonics elements. Fromthe viewpoint of downsizing, InP-type high-speed modulator isconsidered to be high potential, but linearity will be an issue. On theother hand, as an OE conversion element, there will be huge potential
in a THz wave generation component using UTC-PD (Uni-Travelling

2.2 Technical challenges for B5G
In B5G, PON (Passive Optical Network) can be considered as one of
the key technologies to cover countless small cells most economically.
By applying N-branch PON, the number of required fibers can be
reduced to 1 / N. On the other hand, there are some challenges for
introducing full-scale deployment. Firstly, TDM (Time Division
Multiplexing)-PON requires bandwidth allocation. Therefore the capacity
should be increased to 100 Gbps/λ and more, and latency should be
reduced. Furthermore, a power budget as high as 29 dB is required toallow for the optical loss associated with the N branch. With regard tolarge capacity and low latency, it can be partially resolved by applying
WDM (Wavelength Division Multiplexing)-PON and TWDM (Timeand Wavelength Division Multiplexing)-PON, but reducing the cost of
tunable transceivers will be the challenge.
In order to develop such a network, there must have high requirementsfor optical transceivers. For the Ethernet standards which are discussed
in IEEE802.3, the Intensity Modulation Direct Detection (IMDD) system
has been used until now. But in order to achieve the Tbps-classtransmission capacity required for B5G, digital coherent technology is
expected to become mainstream even at relatively short distances. In
that case, cost reduction of the coherent optical transceiver might be themost important. The IMDD system might continue to be used in thecommunication distance below 10 km. But increasing the transmission
rate to several hundred Gbps/λ will be the challenge in future.
2.3 Optical access technology for B5G
As the technology for drastically reducing the traffic of datatransmission of the MFH, RoF (Radio Over Fiber) technology, thattransmits a radio waveform as an analog light intensity signal, is one of
the candidates. In this method, an increase of transmission band can be
avoided because waveform is not digitized. Due to the extremely

9

Annual Technical Report2018 OITDA

Carrier Photodiode).
We have gotten suitable characteristics from that element such as
wide band operation in 650 GHz band and flat response from DC to110 GHz. On the other hand, the biggest challenge of UTC-PD is highpower output. In future, integration of optical and wireless technologies
such as integrated h high-frequency amplifiers will be important.

3. Summary

Finally, our committee “Optical Technology Strategy Formulation
Committee 2018” would like to point out one thing in conjunction withenter the B5G era.
In the process of research and discussion through the developmentof this roadmap, it became clear that our R&D especially for high-speed
optical transceiver devices are leading the world.
We should accelerate R&D to strengthen international competitivenessas well as intensify the strategies for cost reduction and developing
international standard. And link them to global business through industryacademia-government collaboration.

Annual Technical Report2018 OITDA

10Standardization
1. Introduction
2.3 Fiber Optic Interconnecting Devices and Passive Components (SC 86B)
SC 86B held meetings in Milan and Busan in 2018.

Standardization has been one of OITDAʼs major activities since its
establishment and has been promoted broadly across the optoelectronics
industry. OITDAʼs standardization efforts are mainly focused on the
optical communication (IEC/TC 86), but they also include several opticalapplications (ISO/IEC JTC 1/SC 32) and lasers (IEC/TC 76 and ISO/TC 172/SC 9).
Besides, working for domestic standardization (JIS, OITDA standards
and Technical papers), OITDA is also working on international
standardization such as IEC and ISO through field-specific sub-meetingsin order to respond rapid change of industrial structure and technologies.
Outlined below are the results and trends of standardization activities
in FY 2018, as well as two international standardization projects
commissioned by the Ministry of Economy, Trade and Industry.

2.3.1 Standard Tests and Measurement Methods for Fiber Optic
Interconnecting Devices and Passive Components (WG 4)
The latest change of the IEC 61300 series was investigated and madecomparison with JIS. There is only one provision which is provided by
JIS C 5961 but not provided by JIS C 61300 series.
There are three revised standards under development. Namely, IEC
61300-3-7 (Measurements–Wavelength dependence of attenuation andreturn loss of single mode components), IEC 61300-3-21(Measurements–Switching time) and IEC 61300-3-53 (EAF measurement
method based on two-dimensional far-field data from SI multimodewaveguide).

2. Fiber Optics (IEC/TC 86)

2.3.2 Standards and Specifications for Fiber Optic Interconnecting Devices
and Related Components (WG 6)⑴ Study on individual fiber optic connector standards
In response to the newly published two IEC standards which are
replacing conventional MPO connector standard, OITDA has decided
to revise the corresponding JIS.
⑵ Study on fiber optic connector interface standards
Followed by the publishment of F13 type fiber optic connector
interface standard in IEC, OITDA has decided to establish thecorresponding JIS.

IEC/TC 86 had held its annual meeting in 2018 in conjunction withthe 81st General Meeting in Busan (Korea). Each working group held
an interim meeting.
2.1 Fiber Optic Test Equipment Calibration (WG 4)
At the Busan meeting, it was reported that CDV for IEC 62129-3
Ed.1.0 (Optical frequency meter internally referenced to a frequency
combs) had been voted and approved. This standard was proposed by
Japan at the Gwangju meeting in 2015 and Japan was in charge of the
project leader (PL).
The observations to the IEC Central Secretariat comments on thisCDV were drafted by the Optical Measuring Instrument Standardization
Meeting in OITDA and approved by the IEC/TC 86 Japan National
Committee.
At the Busan meeting, it was agreed to reflect the comments andproceed to FDIS.
The result of CDV vote for IEC 61315 Ed.3 (Calibration of fibre-optic
power meter) was reported to be approved to proceed to IS.

2.3.3 Standards and Specifications for Fiber Optic Passive Components(WG 7)
As of February 2018, there are two circulated documents, namely
IEC 61977 (Fibre optic fixed filters–Generic specification) and IEC
61753-061-2 (Fibre optic isolators for category C).
2.4 Fiber Optic Systems and Active Devices (SC 86C)
SC 86C held meetings in San Diego and Busan in 2018.

2.2 Fibers and Cables (SC 86A)
2.2.1 Fibers and Associated Measuring Methods (WG 1)
Ed.4 of IEC 60793-2-40 (Sectional specification for category A4MMF) was approved to proceed at the Busan meeting.
Japan shared the contents of MCF (Multi-core Optical Fiber connector)
measurement and interface standard proposed by SC 86B. Since it isalso related to optical fiber and cable test methods and cable productstandards, it should be discussed at SC 86A at the same time. It wasrecognized that the longitudinal uniformity of optical fibers and the
manufacturability should be focused on.

2.4.1 Fiber Optic Communications Systems and Sub-systems (WG 1)
WG 1 deals with the physical layer of optical communication systems
and establishes optical system design guidelines and test methods for
digital systems, optical cable equipment and optical links.
Members were dispatched to the meeting at San Diego and Busan.
2.4.2 Fiber Optic Sensors (WG 2)(1) Contents of deliberation at IEC meeting
Table 3 summarizes the entire documents deliberated by WG2.
Table 32.2.2 Cables (WG 3)
At the Busan meeting, regarding the IEC 60794-1-215 (Cable external
freezing test, method F15) and IEC 60794-1-23 (Cable element test
methods), there were discussions for resolving the comments on CD
and finally approved to proceed to CDV.
International Conference on Plastic Optical Fibers 2018 was held in
Seattle. There were 53 presentations including 19 poster sessions.
Regarding the optical wiring in buildings, there was an presentation on
the actual application of gigabit home networks using SI-POF in Europe.

Date /
Location
October 18,
2018 /
Busan(Korea)March 9,2019 /San Diego(USA)

2.2.3 Future Tasks- Strengthen the support to SC 86A/WG 1 for all-plastic multimodeoptical fiber. In relation to the IEC 60793-2-40, examine the test
methods to adjust to JIS C 6837.
- Strengthen the support to SC 86A / WG 3 for F15B freezing tests
in IEC 60794-1-215.

11

Deliberation documents at IEC meeting in 2018
Deliberation documents• IEC 61757-1-1 Fiber optic sensors-Part 1-1:
Strain measurement – Strain sensors based on
fibre Bragg gratings• IEC 61757-1-2 Fibre optic sensors Part 1-2:
train measurement - Distributed sensing• IEC 61757-2-1 Fibre optic sensors Part 2-1:
Temperature measurement – Temperature
sensors based on fibre Bragg gratings• IEC 61757-2-2 Fiber optic sensors-Part 2-2:
Temperature measurement – Distributed
sensing• IEC 61757-3-2 Fibre optic sensors Part 3-2:
Distributed acoustic sensing• IEC 61757-4-3 Fibre optic sensors Part 4-2:
Electric current measurement – PolarimetricmethodAnnual Technical Report2018 OITDA

transmission, Japan has been in charge of creating new technicalreports (TR).

(2) Proposal of IEC 61757-4-3 (Fibre optic sensors–Electric current
measurement–Polarimetric method)- TC 38 (instrument transformer) pointed out that the contents were
duplicated, but the problem was resolved by clarifying the scope
and appointing the liaison. Proceed to CDV was approved at the
Busan meeting.
- At the San Diego meeting, we submitted countermeasures for thecomments to the CDV.
(3) Future plans
Preparation of international standard will be accelerated because
industry will actively introduce optical fiber sensor. In response to thissituation, international standard for optical fiber current sensors had
been initiated by Japan. Other related NP had also be proposed by
European countries.
In conjunction with this movement, Fiber optic sensors submeeting
will continue to keep track of the status in IEC and join the discussion
actively.

2.4.4 Fiber Optic Active Components and Devices (WG 4)
For preparing the revision of IEC TR 62572-4:2013 (Guideline for
optical connector end-face cleaning methods for receptacle style opticaltransceivers), we had conducted manufacturer hearing of three domestic
companies who are conducting cleaning of MPO optical connector. The
result was also reflected to the related standard of OITDA/TP 12 which
was published in 2019.
Regarding the gain ripple test measurement method for semiconductor
optical amplifiers, we had drafted up the standard in collaboration with
the Japan National Committee of WG 3 and WG 4 as well as the Optical
Amplifier Standardization Meeting in OITDA, and submitted to SC
86C.
2.4.5 Dynamic Modules and Devices (WG 5)(1) Situation of International standardization- At the San Diego meeting, we deliberated the performance standardsof IEC 62343-1 (General conditions), the reliability qualificationof IEC 62343-2-1 (Test template), and the performance specification
templates of IEC 62343-3-3 (Wavelength selective swithes) and IEC
62343-3-4 (Multicast optical swithes).
- At the Busan meeting, we had deliberated IEC 62343-1 CDV, IEC
62343-2-1 CD, IEC 62343-3-3 CD and IEC TR 62343-6-11 CD.
- As of March 2019, status of each standard is
IEC 62343-1: IS
IEC 62343-2-1: CDV
IEC 62343-3-3: CDV
IEC 62343-3-4: IS
TR 62343-6-11: CD2(2) Future activities- While dynamic modules were introduced in ROADM systems
steadily, optical amplifiers which is deliberated in WG 3 (Opticalamplifier) are also introduced to the line cards.
- In order to stimulate discussions across both groups, SC 86C decided
to integrate WG 5 into WG 3 and operate as a group after the San
Diego meeting.
- In accordance with this movement, the related meetings of OITDA
will continue to provide support to the Japan National Committee.

2.4.3 Optical Amplifiers (WG 3)
R&D of erbium-doped fiber amplification technology has been
conducted rapidly since early 1990s and international standardization
activities in IEC and CCITT (currently ITU-T) started in 1991 and 1992,
respectively. In 2001, the scope of IEC deliberation has been expanded
to include Raman fiber amplifiers, semiconductor optical amplifiers
and waveguide optical amplifiers and has reached today.
(1) Study of IEC draft- Publication of IEC TR 61292-8 (High-power optical amplifiers)- Publication of IEC 61290-4-4 (Test method for gain transientparameters–Single channel optical amplifiers in output power
control)- Revision of IEC TR 61292-3 (Design guides–Classification,
characteristics and applications)- Revision of IEC TR 61292-4 (Maximum permissive optical power
for thedamage-free and safe use of optical amplifiers)- Revision of IEC 61290-1-1 (Test methods–Power and gain
parameters–Optical spectrum analyzer method)(2) Trend survey of IEC standard and cooperation for IEC activities［Status of the existing documents］(1) IEC 61290-1 Ed.1 (Test Methods–Power and gain parameters):
currently under deliberation for sub-part (IEC 61290-1-1). SD isextended for 2 years.
(2) IEC 61290-1-3 Ed.3 (Test Methods–Power and gain parameter–
Optical power meter method): Agreed to make amendments to correct
errors related to the measurement of the maximum total opticalpower.
(3) IEC 61290-4-2 Ed.1 (Test Methods–Gain transient parameters–
Broadband source method): SD extended for 2 years.
(4) IEC TR 61292-6 Ed.1 (Optical Amplifiers–Distributed Raman
amplification): SD is extended for 2 years.
(5) IEC TR 61292-9 Ed.1 (Optical Amplifiers–Semiconductor opticalamplifiers): SD extended for 2 years.

3. Optical Radiation Safety and Laser Equipment (IEC/TC 76)
TC76 meeting was held in Kista (Sweden) in 2019. An interim meeting
was also held in Orlando (USA) for WG 1 and WG 8.
3.1 Optical Radiation Safety (WG 1)
There were new proposals presented at the meeting and consideredas amendments to IEC 60825-1 Ed.3 as well as publishing as anindependent IS or TS.
- Moving platform: the position of the measurement aperture aroundthe moving body including the laser device depending on the speed- Virtual Protective Housing: sensor detects the human body into thebeam and reduces the risk of exposure- Ad hoc committee for intentional beam irradiation for the eye andface was established.
- Ad hoc meeting for laser products for distance measurement wasestablished. This meeting is aiming at deliberating the reference
value according to the ambient brightness.
- The corneal injury threshold in the infrared region were reviewed
to reflect IEC 60825-1 in Ed.4.

［Status of the new work items］- Remote Optically Pumped Amplifier (ROPA)- The new optical amplification technologies for spatial multiplexing
optical fiber communication- Broadband optical amplifier (C + L-band, O-band)- Pluggable amplifier (XFP, CFP)
- Burst mode EDFA
In particular, regarding the new optical amplification technologies
such as optical amplifiers for spatial multiplexing optical fiber
Annual Technical Report2018 OITDA

12

Standardization
3.2 Laser Radiation Mesurement (WG 3)
It was confirmed to revise TR 60825-13 Ed.2 (Measurement forclassification of laser products ). The CD will be circulated in 2019 andcomments was scrutinized at the next annual meeting.

According to IEC TR 62471-4, the basic part of the evaluation methodof lamps and lamp systems is described in IEC 62471-1, and 4CD is
prepared while making adjustment.
Similarly, IEC 62471-6 should be deliberated after discussion of IEC
62471-1. Regarding the evaluation method of the UV lamp system, there
was a discussion that the average value of the exposure dose wasimportant and the evaluation distance should be closer than 1m.

3.3 Safety of Medical Laser Equipment (WG 4)
We reviewed comments for CD of IEC TR 62471-3 (Guidelines forthe safe use of IPL source on human) which will be integrated into IEC
TR 60825-8 (Guidelines for safe use of laser beams on human) for the
next edition.
There was a proposal for IEC 60601-2-57 (Particular requirements
for the basic safety and essential performance of non-laser light source
equipment intended for therapeutic, diagnostic, monitoring and cosmetic/
aesthetic use) that the risk group equivalent to laser class 1C was needed
to be defined.
ISO TR 22463 was conducted jointly with JWG 12.

3.8 Special Joint TC for IEC 62471-1 (JTC 5)
The work to revise CIE S009/IEC 62471 (photobiological safety oflamps and lamp systems) as CIE S009/IEC 62471-1 has been conductedby CIE Div.2 and Div.6 and IEC Joint Technical Committee 5 (TC 34
and TC 76) since 2013.
At the Kista meeting, the draft was discussed, and Japanese opinions(such as the description that “Classification of GLS is not applicable”
should be deleted, the image projector sould be clearly shown as anapplication example of the classification distance of 1 m, and only RG
3 should require a label) were accepted. In addition, the assignment anddelivery date for the annex were clarified.

3.4 Safety of Fiber and Free Space Optical communication systems (WG 5)
Japan is contributing the deliberation of IEC 60825-2 and IEC 6082512 by providing the project leaders.
IEC 60825-2 (Safety of optical fiber communication systems) Ed.4
was approved to proceed to CDV after reviewing the 2CD circularcomments at Kista meeting.
IEC 60825-12 (Safety of optical wireless communication systems for
information transmission) Ed.2 was issued in 2019. WG 5 continued todeliberate on the content of the amendment for Ed.2.
Regarding the “Laser Safety in High Power Optical Communication
Systems”, JAG 10 (Joint Advisory Group 10) was established under TC
86. The kick-off meeting was held in conjunction with the SC 86C
interim WG meeting.

3.9 Safety of Lasers and Laser Equipment in an Industrial Materials
Processing Environment (JWG 10)
JWG 10 is conducting jointly with ISO/TC 172/SC 9/JWG 3 anddeliberated on ISO/IEC 11553 standards at Kista meeting.
Regarding the revision of ISO/IEC 11553-2 (Safety requirements forhandheld laser processing devices) Ed.2, project was withdrawn because
there was no PL.
3.10 Eye and Face Protection against Laser Radiation (JWG 12)
JWG 12 is conducting jointly with ISO/TC 94/SC 6/ JWG 1. ISO
19818 (Requirements for eye and face protection from laser radiation)
Ed.1 is circulated again as NP.
The 2nd DTR of ISO TR 22463 (patient and client eye protectors foruse during laser or ILS procedures-Guidance) was deliberated together
with WG 4 at the Kista meeting.

3.5 High Power Lasers (WG 7)
Regarding the IEC 60825-4 (Safety of laser products–Laser guards)
CDV of Ed.3, technical comments were remained and discussed again
at the Kista meeting.
Regarding the IEC 60825-18 (Beam Delivery System), CD draft willbe created by reflecting the comments to the NP and circulated in WG
7 in 2019.

4. Laser and Electro-Optical Systems (ISO/TC 172/SC 9)
4.1 Terms and Test Methods of Electro-optic System (WG 1)
There was progress on each standard as below.
- ISO 13696: Registered as an approved work item (AWI) and revised
without changing the scope.
- ISO 13142: Change the title and reflect the deliberations to circulate
the committee draft (CD).
- ISO 21254-1, ISO 21254-2, ISO 21254-3: Three projects werecanceled because they could not develop within the target date. So,
those were newly registered as preliminary items (PWI).
- ISO 19986: CD circulation reflecting the contents discussed.
- ISO 12005: 2003: Periodic review (SR) was approved, and it was
decided that Japan would become new PL and it was registered asa preliminary item.
- ISO 11146-1: 2005, ISO 11146-2: 2005: Revised without changing
the scope.

3.6 Develpopment and Maintenance of Basic Standards (WG 8)
Revised draft of IEC TR 60825-3 (Guidance for laser displays andshows) Ed.3 was discussed at the Kista meeting.
IEC TR 60825-5 (Manufacturerʼs checklist for IEC 60825-1) Ed.3
has been approved for publication after the DTR circulation has been
completed.
Regarding the IEC TR 60825-14 Safety of laser products–A userʼsguide) Ed.2, CD draft was deliberated at the Kista meeting, andcalculation examples and contingency plans applied to Class 3B andClass 4 were added.
European standard EN 50689 (Particular requirements for consumer
laser products) will be issued by the European Electrical Standardization
Committee (CENELEC) in connection with the European directive“Safety to which consumer laser equipment should comply” promulgatedin 2014). Progress was presented at Kista meeting and ILSC (Laser
Safety International Conference) 2019. The draft European standard
only allows Class 1, Class 2 and Class 3R that meet specific requirements
for consumer laser equipment.

4.2 Medical Applied Laser System (WG 4)- Deliberated in WG1.
- ISO 22248: CD circulation reflecting the contents discussed.
4.3 Electro-optic System Other than Laser (WG 7)- ISO 11807-1, ISO 11807-2: Proceed to DIS.
- ISO 14881: The circulation period will be extended to 48 months
and CD circulation was conducted.
- ISO 14880-1: Within 3 weeks after the meeting, PL completed the

3.7 Non Coherent Sources (WG 9)
At the Kista meeting, discussions were held on how to proceed withdeliberation of IEC TR 62471-4 (measurement method) and IEC 624716 (UV lamp system) in IEC.

13

Annual Technical Report2018 OITDA

Table 4
Section

WG

4.1

WG 1

4.2

WG 4

4.3

WG 7

List of ISO/TC 172/SC 9 deliberated standards

Standard No.

Standard nameISO 13696

Optics and Photonics--Test methods for radiation scattered by optical components

ISO/CD 13142

Optics and photonics--Lasers and laser-related equipment--Cavity ring-down method for highreflectance and transmittance measurements

ISO/AWI 21254-1,
ISO/AWI 21254-2
and
ISO/AWI 21254-3

Lasers and laser-related equipment--Test methods for laser-induced damage threshold--Part 1: Definitions and general principles--Part 2: Threshold determination--Part 3: Assurance of laser power (energy) handling capabilities

ISO/WD 19986

Lasers and laser-related equipment--Test method for angle-resolved scattering

ISO 12005:2003

Lasers and laser-related equipment – Test methods for laser beam parameters – Polarization

ISO 11146-1:2005,
ISO 11146-2:2005

Lasers and laser-related equipment--Test methods for laser beam widths, divergence angles andbeam propagation ratios--Part 1: Stigmatic and simple astigmatic beams--Part 2: General astigmatic beams

ISO/AWI 22248

Laser and laser-related equipment--Test methods for laser-induced damage threshold--Classificationof medical beam delivery systems

ISO/CD 11807-1,
ISO/CD 11807-2

Integrated optics--Vocabulary--Part 1: Basic terms and symbols--Part 2: Terms used in classification

ISO/AWI 14881

Integrated optics--Interfaces--Parameters relevant to coupling properties

ISO/DIS 14880-1

Optics and photonics--Microlens arrays--Part 1: Vocabulary and general properties

ISO 15902:2004

Optics and photonics--Diffractive optics--Vocabulary

4.4

JWG 3

ISO/DIS 11553-1

Safety of machinery--Laser processing machines--Part 1: General safety requirements

4.5

SR

ISO 11252:2013

Lasers and laser-related equipment--Laser device--Minimum requirements for documentation

document and submit it to Secretary for FDIS voting.
- ISO 15902: 2004: Decided to handle with minor modifications.
Secretary completes the document and submits it to the CS.

ISO/IEC JTC 1/SC 23 is coping with optical disc related technology.
There are two submeetings.
5.1 Media Submeeting
This meeting is responsible for all optical disks (magneto-opticaldisks, phase-change optical disks, recordable optical disks, and ROMtype optical disks).
As of March 2019, ISO/IEC JTC 1/SC 23 revision project for theinternational standard for BD discs is in progress, and Amendment was
expected to be issued in early 2019.

4.4 Safety of Laser Equipment (JWG 3)- ISO 11553-1: Revised to be the type B standard defined in ISO
12100.
4.5 Systematic Review- ISO 11252: 2013: Review after revision of ISO 11146-1: 2005 andISO 12005: 2003.

5.2 Format Submeeting
This meeting is responsible for volume and format of optical disc.

5. Digitally Recorded Media for Information Interchange andStorage (ISO/IEC JTC 1/SC 23)
Table 5Progress of international standardization

Ultimate goal(~FY2019)

Standard No.

Proposed to

ISO 21111-3

ISO/TC 22/
SC 31/WG 3

Document
publication

The description method of thestandard will be reviewed, and thedescription of the document will berevised accordingly.

Create a DIS circulation document
reflecting CD comments.

ISO 21111-4

ISO/TC 22/
SC 31/WG 10

Document
publication

Discuss comments collected by CDvoting, create DIS ballot document
and send it to ISO secretariat.

Aggregate DIS voting results andpromptly implement FDIS voting andIS.

ISO 21111-X

ISO/TC 22/
SC 32/WG 10

Committee draft
Registration
approval

Prior confirmation experimentconfirmed that multimode optical fiber
can be applied to 10 Gigabit invehicle Ethernet.

Perform NWIP proposal.

IEC/TC 47/
SC 47A/WG 9

VotingCommittee Draft
circulation

CD proposal completed after
deliberation of WD from Germany.

Reflection of Japanese opinions on
the EMC evaluation of electrical
Ethernet tranceivers, and additional
proposals for EMC evaluation of thepower souece for optical Ethernet
tranceivers.

IEC 61300-3-53

IEC/TC 86/
SC 86B/WG 4International
standard draft
Registration

Originally proposed in the revision of
61300-1, but received an instruction
from the WG4 Convenor to be
included in the 61300-3-53 revision,
the 61300-3-53 ed2 draft was
created, and the CD was circulated.

Comments on the CD circulation will
be discussed at the IEC Delftmeeting in April.

IEC 60793-2-40

IEC/TC 86/
SC 86A/WG 1

VotingCommittee Draft
circulation

Amendments including changes inthe sub-category A4a.2 NA standard
scope were approved at the SC 86A/
WG 1 Busan meeting in October, andthe CD was circulated.

The SC 86A/WG 1 meeting in April
2019 will deal with comments andproceed to CDV circulation.

IEC 62228-5

Annual Technical Report2018 OITDA

Results in FY2018

14

Future schedule

Standardization(1) Development of large file system
We are developing a large-capacity file system in collaboration with
Ecma TC31.
(2) Development of ISO 9660 Amd.2.
Regarding the ISO 9660 which defines the logical format of the CDROM, we began to deliberate for developing Amd.2.

6. Evaluation methods of EMC and related Characteristics ofHigh-Speed In-Vehicle Ethernet Physical Layer
6.1 Objective
Capacity of in-vehicle communication is expected to increase
drastically due to the development of the advanced driving support
systems and autonomous driving, but the in-vehicle Ethernet standards
that strength
en real-time performance, fail-safe function and high reliability are
required as communication backbone and sensor network.
Regarding the EMC chatacteristics, reliable in-vehicle communication
system can be achived by implementing the optical harness which isneither generate electromagnetic noise nor EMC vulnerable.
This is three-year project since 2017 aiming to propose theinternational standards related to the optical communication and EMC.
6.2 Progress of International Standardization
Table 5 summarizes this year's progress and future plan.

7. Reliability of Narrow-Pitch Multi-Fiber Optic Connectors
7.1 Objective
Optical connectors, which was originated from Japan, such as SC
connectors, MU connectors, MT connectors and MPO connectors havebeen internationally standardized and used in the global market.
In recent years, the amount of information processing andcommunication in the data center has increased due to the expansion ofcloud computing. So, the reduction of energy consumption became oneof the key issues. In order to solve this problem, this project proposes
the high-density optical interconnectors which will be applied to servers
and routers in data centers.
This project is aiming at developing the international standard ofnarrow-pitch multi-fiber optical connector which is thinner than theconventional one.
7.2 Progress- This year is the second year of the three-year plan, and we havecompiled domestic opinions on the international standardization of
narrow-pitch multi-fiber optical connectors based on the results oftechnical studies such as technical surveys and prototype
experiments. Then, we attended the IEC meeting and proposed PWI
to IEC/TC 86.
- At the IEC Busan meeting in 2018, NP draft of IEC 62496-4-XXX(Interface standards–Terminated waveguide OCB assembly using asingle-row thirty-two-channel symmetric PMT connector) was
proposed in TC 86/JWG 9 (optical wiring board), then agreed toproceed. At the next meeting in 2019, RVN will be deliberated.
- In order to show that the proposed PMT connector has suitablecharacteristics, we measured the connection characteristics of MT
ferrules with Ø80µm thin fiber and PMT connectors as well as
random connection characteristics between PMT connectors.
- In COBO (Consortium for On-Board Optics), we submitted white
paper on data center application of narrow-pitch multi-fiber opticalconnectors for enhancing the collaboration with related organizations
other than IEC.

15

Annual Technical Report2018 OITDAEducational and Public Relations Activities
1. FY 2018 Symposium on the Optoelectronics Industry andTechnology

as well as LED JAPAN 2018, Imaging Japan 2018, and MEMS Sensing& Network System 2018, in an effort to showcase all the latest
technologies and products ranging from device components to the hottest
IoT, AI, and automotive applications together, so that visitors could
gather information more efficiently and effectively, while opportunities
for collaboration between exhibitors were dramatically increased.
Covering a wide range of exhibition categories, including laser/lightsources, optical devices/modules, materials, optical equipment/
instruments, and services/software related to the optoelectronics industry,
InterOpto exhibited a broad range of technologies from optoelectronicsrelated materials to optical application systems.
InterOpto alone featured 119 booths set up by 103 exhibitors fromin and outside Japan, including optoelectronics manufacturers and trading
companies. The total number of exhibitors and booths for the four
exhibitions excluding CEATEC was 297 and 294, respectively. As tickets
for each exhibition included admission to the others, many CEATEC
visitors dropped by the other exhibitions, with the bustling exhibition

The FY 2018 Symposium on the Optoelectronics Industry andTechnology was held at the Rihga Royal Hotel Tokyo on Wednesday,
February 20, 2019. The event was jointly sponsored by OITDA and the
Photonics Electronics Technology Research Association (PETRA), withsupport from the Ministry of Economy, Trade and Industry. Under thetheme of “Photonics technology that supports the Beyond 5G society”,
six important lectures were given as shown in Table 4. with more than
300 participants.

2. InterOpto 2018
InterOpto 2018, an international exhibition of cutting-edge
optoelectronics technology, was held at Makuhari Messe for three days
from Wednesday, October 17 to Friday, October 19, with support andcooperation from the Ministry of Economy, Trade and Industry andmany other organizations.
The event this year was held concurrently with CEATEC JAPAN 2018
Table 4

FY 2018 Symposium on the Optoelectronics Industry and Technology

Opening Remarks

Mr. Yasuhisa Odani
President / Vice Chairman, OITDA

Guest Greeting

Mr. Jingo Kikukawa
Director, IT Industry Division, Commerce and Information
Policy Bureau, METI

Keynote Speech:
Creation of ʻNew Excitementʼ in 5G, Beyong 5G Society

Dr. Masashi Usami
Administrative Officer Exective Director, Technology
Planning, KDDI Corporation

In-vehicle system and Road-to-vehicle cooperation in
5G EraMr. Koichi Takayama
General Manager, Vehicle System Department, Advanced
Automotive Systems R&D Center, Sumitomo ElectricIndustries, Ltd.

Optical Access Network in Beyond 5G Era

Mr. Seiji Kozaki
Information Technology R&D Center, Mitsubishi Electric
Corporation

Photonics Technology Roadmap for Beyond 5G Network

Dr. Takuo Tanemura
Associate Professor, Department of Electrical Engineering
and Information Systems, The University of Tokyo

14:45 − 15:30

Research and Development of High Speed and Low
Power Data Transfer System Using Photonic &Electronic Hybrid Switch for Next Generation
Datacenter with Disaggregation Architecture

Dr. Takashi Saida
Photonics Electronics Technology Research Association(PETRA)

15:30 〜 16:15

Integrated Photonics-Electronics Convergence System
Technology− Optpelectronic Interposer using Polymer Waveguide−

Dr. Takeru Amano
Photonics Electronics Technology Research Association(PETRA)

16:20 − 17:00

The Award Ceremony of 34th Kenjiro Sakurai Memorial Prize

17:00 − 19:00

Get-together

10:00 − 10:05
10:05 − 10:15

10:15 − 11:15

11:15 − 12:00

13:00 − 13:45

13:45 − 14:30

Annual Technical Report2018 OITDA

16

Educational and Public Relations Activities
halls holding several times as many visitors as last year.
A “Notable Optoelectronics Technology and Special Exhibit Zone”
was set up in the Exhibition Hall. In this zone, eight companies
recommended by the working groups of OITDAʼs Optoelectronics
Technology Trend Committee exhibited their technologies and products.
A Notable Optoelectronics Technology Seminar was also held for twodays from October 18 to 19 at the seminar site in the Exhibition Hall.
In the Seminar Room of the International Conference Hall, seminars
on technological trends in seven optoelectronics technology fields were
held on October 18. On October 19, seminars on optoelectronics industry
trends in seven product fields and overview trends were presented. Theseseminars attracted large audiences and stimulated exchanges of opinions
among audience members.
The next interOpto will be held for three days from January 29 to
31st, 2020, with the venue moved to Tokyo Big Sight.

3. 34th Kenjiro Sakurai Memorial Prize
The Kenjiro Sakurai prize was established as a memorial to the late
Dr. Kenjiro Sakurai, a former director of OITDA who played a majorrole in developing the optoelectronics industry. Its purpose is to promote
the technological development of the industry. The prize has been givenout 33 times to 24 individuals and 39 groups, for a total of 154 awardees.
This year, the Kenjiro Sakurai Memorial Prize was awarded to twogroups out of 10 applications for their pioneering achievements in the
optoelectronics industry and technology since 2008.
One prize was awarded to Dr. Masamichi Yamanishi, Dr. Tadataka
Edamura, Dr.Kazuue Fujita and Mr. Naota Akikusa of Hamamatsu
Photonics K.K. for their “Research and Development of High
Performance Quantum-Cascade Lasers and their Commercialization”
The other prize was awarded to Dr. Yoshihito Hirano, Mr. Takayuki
Yanagisawa, Mr. Shuhei Yamamoto and Mr. Takeshi Sakimura of
Mitsubishi Electric Corporation for their “Development of compact highpower planar waveguide lasers and application to the wind sensing
LIDAR”
The award ceremony was held on February 20, 2019 following the
FY 2018 Symposium on the Optoelectronics Industry and Technology.
At the ceremony, Prof. Yasuhiko Arakawa (The University of Tokyo),
who is the chairperson of the Kenjiro Sakurai Memorial Prize Committee,
reported on the selection process and results. This was followed by thepresentation of certificates, medals, and extra prizes to the awardees.

Awardees of the 34th Kenjiro Sakurai Memorial Prize
Back row, from left: Mr. Sakimura, Mr. Yamamoto, Dr. Fujita, Mr.Akikusa
Front row, from left: Mr. Yanagisawa, Dr. Hirano, Dr. Yamanishi, Dr. Edamura

17

Annual Technical Report2018 OITDASupporting Members(As of March 31, 2019)[Chemistry]

Hitachi, Ltd.

[Commercial & Advertisement]

Fujifilm Corporation

HondaTsushin Kogyo Co., Ltd.

Hakuto Co., Ltd.

Mitsubishi Chemical Holdings

Huawei Technologies Japan K.K.

JTB Communication Design, Inc.

Japan Aviation Electronics

Marubun Corporation

Corporation
Nissan Chemical Corporation

Industry, Ltd.

Shin-Etsu Chemical Co., Ltd.

Kyocera Corporation

Sumitomo Bakelite Co., Ltd.

Oclaro Japan, Inc.

Yamamoto Kogaku Co., Ltd.

Mitsubishi Electric Corporation

The Optronics Co., Ltd.

[Electric Power]

Murata Mfg. Co., Ltd.

Central Research Institute ofElectric Power Industry[Glass & Ceramics]

NEC Corporation

AGC Inc.

NTT Electronics Corporation

Corning International K.K.

Oki Electric Industry Co., Ltd.

Nippon Sheet Glass Co., Ltd.

Panasonic Corporation



Sumitomo Osaka Cement Co., Ltd.

Pioneer Corporation

Dai Nippon Printing Co., Ltd.

Technical Co., Ltd.

Santec Corporation

Iwasaki Electric Co., Ltd.

Toyo Seikan Group Holdings, Ltd.

Sanwa Denki Kogyo Co., Ltd.

Optoquest Co., Ltd.

[Other Manufacturing]
Adamant Namiki Precision
Jewel Co., Ltd.

Seiwa Electric Mfg. Co., Ltd.
[Electric Wire & Cable]
Fujikura Ltd.
Fujikura Dia Cable Ltd.
Furukawa Electric Co., Ltd.
Okano Electric Wire Co., Ltd.
Sumitomo Electric Industries, Ltd.
SWCC Showa Holdings Co., Ltd.

Sharp Corporation[Others]

Sony Corporation

Granopt Ltd.

Taiyo Yuden Co., Ltd.
Toshiba Corporation

Institute for Laser Technology
Japan Optomechatronics

Ushio Inc.

Association

Yamaichi Electronics Co., Ltd.

KDDI Research, Inc.

Yamamura Photonics Co., Ltd.

Nippon Telegraph and Telephone

Yokogawa Electric Corporation

Corporation
NTT Advanced Technology Corporation[Electronics & Electronic Appliances]
Anritsu Corporation
Enplas Laboratories Inc.
Fujitsu Limited
Hamamatsu Photonics K.K.
Hirose Electric Co., Ltd.

[Precision Instrument]
Konica Minolta, Inc.



Research Association (PETRA)TOYOTA Central Research andNikon Corporation

Olympus Corporation

UL Japan, Inc.

Ricoh Company, Ltd.
Seikoh Giken Co., Ltd.
Seiko Instruments Inc.
Sigma Koki Co., Ltd.
Suruga Seiki Co., Ltd.
Topcon Corporation

Annual Technical Report2018 OITDA

Photonics Electronics Technology

18

Development Labs., Inc.

1-20-10, Sekiguchi, Bunkyo, Tokyo, Japan, 112-0014
Phone: +81 3 5225 6431
URL: http://www.oitda.or.jp