Color Filters

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TFT LCDs ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 2
Surface Treatment Films ・・・・・・・・・・・・・・・・・・・・・・・・・・ 3(Toppan TOMOEGAWA Optical Films Co., Ltd.)Light Control Film “LC MAGIC ” ・・・・・・・・・ 4
TMWe develop and manufacture color filter that is an essential partthat defines image quality on displays, surface treatment filmthat is an optical film for displays, metal masks for OLED display,light control film that can instantly switch between transparent
and opaque by turning the power on / off, TF T LCDs with highdefinition and low power consumption, and provide sensor film
for touch panels that enables light touch operation.

Color Filter Arrays

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(On-chip Color Filters)

Photomasks/Nanoimprint Molds ・・・・・・ 6 - 7(Toppan Photomask Co., Ltd.)

FC-BGA Substrates

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Etched Products ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 9

We develop and manufacture photomasks (circuit master plates),
which are essential to frontend processes in semiconductor
manufacturing, provide L SI design services and wafer
processing services including color filter arrays for image
sensors, nanoimprinti solutions that provides total services frommold creation to prototyping and mass production, develop andmanufacture semiconductor packaging components used inbackend processes, and various types of etched products.

LSI Design / LSI Turnkey Service ・・・・・・・・・ 1 0(Toppan Technical Design Center Co., Ltd.)

Device Development & Solutions ・・・・・・・・・ 1 1

Color Filters
A wide range of applications
from large televisions to smartphones
A color filter is a critical component that
determines color display image quality. In 1971,
Toppan developed color stripe filters for image
pick-up tubes by applying microfabrication
technology based on plate making in printing.
Since then, Toppan’s color filters are applied tovarious products ranging from large televisions totablets and smartphones.

Structure of Color LCD panel

Color filter manufacturing process

The color image is created by light passing through a color filter.

While there are a number of color filter manufacturing methods
used, the photolithography method (in which pigment-based color
resists are coated over a glass substrate, and exposure anddevelopment are carried out) is now mainstream.

Anti-reflection film
Polarizer
Glass substrate
Color filter
Liquid crystal
Glass substrate
Polarizer
Prism sheet
Diffusing plate
Light guiding plate
Reflector
Case
LED

1 Formation of black matrix (low reflection chrome and resin)
In order to prevent any backlightleakage and mixture of RGB, a
black matrix is formed first.

Black matrix
Glass substrate

2 Color resist coating
Color resist is coated on theentire glass substrate.

Color resist layer

Color filter

Enlarged view

3 Exposure

To make the pattern insoluble, it
i s U V- c u r e d b y e x p o s u r ethrough a photomask.

Structure of Color filter

PhotomaskLight

4 Development & baking

As the basic structure of the color filter, red (R), green (G) and blue(B) color resist patterns that allow transmission of light are formed
on a thin glass substrate first, together with a black matrix thatprevents defects such as light leakage while displaying black color
as well as any color mixture with an adjacent color resist. Then, an
ITO (Indium Tin Oxide) layer (transparent conductive layer), whichbecomes the common electrode for an array substrate, is formed
over it.

After removal of unnecessary
portions on the color resist bya d eve l o p i n g s o l u ti o n, th epattern is cured by baking.
Repeat of steps 2 to 4

The color resist coating,
exposure and development/
baking processes are repeated
for the other two colors.

5 Formation of ITO layer

ITO layer (transparent
conductive layer) is formed by
the sputtering method.

RGB pattern

R

Glass substrate

G

Black matrix

ITO (transparent conductive) layer

ITO (transparent conductive) layer

B

6 PS process
Photo spacers (PS) are formed
to improve image quality by
precisely controlling the valueof the cell gap between twopieces of glass (color filter andthin film transistor array).

PS (photo spacer)

TOPPAN Electronics

1

TFT LCDs
Provide LCDs for various applications,especially for industrial equipment
The high value-added TFT LCD panel of the"OR TUS" brand realizes high pixel count, highdefinition and low power consumption while
enhancing outdoor visibility by using HASTⓇ（HyperAmorphous Silicon TFT）as its core technology, andis adopted for various equipment such as industrial
equipment.
We will continue to develop products for further
improvement of outdoor visibility and low power
consumption in the future and will provide better
products to customers.

Ultra high definition and image quality amorphous silicon TFT

Excellent features of "Blanview"
Blanview is original TFT-LCD technology to realize high-quality

Hyper Amorphous Silicon TFT
Conventional
a-Si TFT

display performance in any brightness circumstances (indoor /outdoor) with overwhelming low power consumption.

ORTUSTECH
a-Si TFT(HAST)

Unique High Reflection Panel Design
Superior Outdoor Visibility
Ultra Low Power Consumption

・Ultra-high-definition TFT array
・Low-resistance fine wiring

30% increase aperture ratio!!

technology

・Super-narrow pitch COG(2.4”QVGA conversion)

30%Brighter

bonding technology

・High-image-quality optics
design technology

30%Backlight power
Reduceable

Outdoor(Under Sunlight)

Indoor"Blanview-2" realizing ultimate low power consumption and outdoor visibility
Transflective TFT-LCD

Transmissive TFT-LCD
Crispy and bright display createdby a backlight.

Display performance deteriorates
by a sunlight reflection at LCD
surface.

Reflection area works to improve
outdoor display quality but leads tolarge power consumption in indoor
usage.

High light reflection panel design alongwith low power consumption functionality;
Good display performance in any
surrounding situations.

IndoorOutdoor

Outdoor

OutdoorTFT-LCD2(other-companies products)

TOPPAN Electronics

Reflective
electrode

Reflective
electrodeSurface Treatment Films
Improvement of display image
visibility
Surface treatment film is an optical film applied to thefront sur face of a display in order to minimize
reflection of external light. Various types of surface
treatment film can be provided for dif ferent
applications, examples of which include low reflection(LR) film that has excellent anti-reflection properties,
anti-static performance and high contrast; and antiglare (AG) film that controls reflection with excellent
anti-glare proper ties. In addition, such films
ef fectively protect the display by preventing theaccumulation of dust and enhancing strength anddurability.
Toppan Tomoegawa Optical Films Co., Ltd. manufactures and sells Toppan’s surface treatment films.

Product TypeLR
（Low Reflection）

CHC（Clear Hard Coat）

AG（Anti Glare）

0.1%〜1.0%

4.0%—

Hard coat

Hard coat (CHC)

Hard coat (AG)Base film

Base film

Base film

ReflectanceLR layer
Antistatic layer

Structure・High contrast (color reproducibility)
・Low reflectivity
・High antistatic performance・High dirt resistanceFeatures･ Reflection prevention･ Product lineup according to the application.
(high haze - low haze)・Highly uniform interference・High strengthMainapplications●TV, monitor, notebook PC, etc.

Principle of preventing the reflection of light (LR)

Structure of surface treatment film

Surface treatment film

With film

Without film

The film structure is designed so that the light reflected at theboundary between the anti-reflection layer and the base film has thesame amplitude as, but the opposite phase to the light reflected on
the surface of the anti-reflection layer. Reflection is reduced as the twodifferent lights cancel each other out due to interference.
Outside light

Surface reflected light

Boundary reflected light (anti-phase)

Base film
Hard coat layer
Anti-reflection layer

Anti-reflection layer

Principle of reducing glare of external light (AG)Base film

Negation by interference
Surface reflected light

Outside light
Scattered light
Microparticles
Hard coat layer(anti-glare)

Boundaryreflected light(anti-phase)

Base film

TOPPAN Electronics

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Light Control Film
Create a new space with the magic oflight. The liquid cr ystal light control
film allows to “show”, “not to show” or“project” depending on the situation
LC MAGIC is an ultra-thin liquid cr ystal film
developed using liquid cr ystal technology on our
long-established display related businesses. Thechange between power-on and power-off switches thefilm type between transparent and opaqueaccordingly. LC MAGIC is in the spotlight as agroundbreaking product for the possibilities used not
only as alternative to the window shade or curtain but
also as a projection screen of digital signages.
SEM image of the polymer network* LC MAGIC and the LC MAGIC logo are trademarks of TOPPAN Holdings Inc.

Features of light control film “LC MAGICTM”
Satisfy both high transparency and securing privacy
The highest level of transparency ensures clear viewing from not
only front direction but also oblique direction.

Free-form capability (design flexibility)

Stable supply of high quality products

In addition to the high quality control with years of experiences in ourelectronics business, well experienced coating and lamination
technologies using class-100 level cleanroom ensure high quality
products.

LC MAGIC is freely processable into your ideal shape with theappropriate electric design before modularizing.

Easy process even onto carved design or post
lamination
Thin film makes it easier to be applied to curved surface or post
lamination.

Usage of projection screen

OPACITY

Optically developed, LC MAGIC in opaque state could be used asa projection screen for high resolution digital images, such as 4K.
It enables to project advertisement or promotion videos.

Roll-to-roll processing
Our production line is produced by roll-to-roll process, it enable touse a variety of applications.
*Maximum dimensions are 1,450mm x 3,000mm.

As the liquid crystal molecules are aligned
differently, incident light is scattered, which
in turn, other side cannot be seen. Light is
not completely shielded, as some light istransmitted.

IncidentLight
Light
Incident

Polymer
Polymer
LiquidLiquidCrystalCrystalIncident
Incident
Light
Light

*Only normal type is possible.

LightTransmission
Transmission
Light

Transparency level is smoothly controlled by a controller.

IncidentLight
Light
Incident

Light control function

LightScattering
Scattering
Light

Wide viewing angle
LC MAGIC has a 160° wide-viewing angle in each direction.

TRANSPARENCY
Transparent
Transparent
Conductive
Conductive
Membrane
Membrane
PET Film
PET Film

When alternating voltage is applied, theliquid crystal molecules are aligned in a
uniform direction where incident light is not
scattered and the system will appear
transparent.

Products Line-up
Normal mode
OFF / Opaque

Reverse mode
ON / Transparent

Exhibition Room / TOPPAN Shibaura bldg.

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TOPPAN Electronics

OFF / Transparent

ON / Opaque“Reverse mode” is transparent when the power is off.
This is the world’s first.

Color Filter Arrays (On-chip Color Filters)
Contributing to higher image quality
for digital images such as
smartphones and security cameras
On-chip color filters (color fiilter arrays and microlens array) are essential for colorizing image input
devices such as CMOS image sensors and small
display devices such as OLEDoS, and are used in awide range of applications including cameras for
smartphone, automotive, securit y, and medical
applications, as well as head mounted displays.
Because a color filter for red, green and blue (RGB)
as the three primary colors of light is formed oneach photodiode generated on a silicon wafer, it iscalled an “on-chip color filter.” Such filters are
essential components to input color images. In
addition, microlenses are formed on the color filter
for the purposes of enhancing light converging
capabilities and sensitivity.

What is an image sensor?
An image sensor consists of a large number of small elements called pixels. Each pixel further consists of a photodiode and light transfer
unit. Although the photodiode generates electric signals once it receives light, it does not produce any color images since the element
reacts only to light and dark. Accordingly, a color filter is formed on the photodiode, enabling detection of light strength received andperception of the image as a color image.
Chip
CCD / CMOS
image sensor

Color Filter Array

Micro-lens Array

Sillicon Wafer on whichcolor filter is formed

Effect of microlens
By changing the light direction through the effect of the lens, a higher volume of light can be converged onto the photodiode.
TOPPAN offers a lineup of microlens process technologies that are ideal for various applications.
Example of microlens pattern
Double Lens

Without microlens array

With micro-lens array
Micro-lens array

Light

Etch Back Lens

Gray

Large MLSEM

Planarization
layer
Color filter
Light shielding
layerElectrode
Phototransistor
Siliconsubstrate

Top-view(Image)Crosssection(Image)World’s leading color filter array supplier
TOPPAN provides high-quality color filter arrays to image sensor
manufacturers.
By fully utilizing color filter technologies, highly semiconductor-related
technologies and other leading- edge technologies that Toppan has
accumulated, we provide highly reliable products to satisfy each customer’s
needs.
Our development center is located in Tamana City, Kumamoto Prefecture,and our manufacturing center is in Shanghai.

TOPPAN ELECTRONICS PRODUCTS
CO.,LTD.
Kumamoto Plant

TOPPAN SENSING ELECTRONICS(SHANGHAI) CO., LTD.

TOPPAN Electronics

5

Photomasks / Nanoimprint Molds
https://www.photomask.co.jp/english/

On April 2022, Toppan Photomask Co., Ltd. took over the photomask
business from Toppan Inc. and started operations as a new company.

Contributing to the semiconductor
industry with cutting edge
lithography technology
A photomask is an essential device used as themaster plate in the manufact ur ing process forsemiconductor chips such as LSI. Circuit patterns
drawn by electron beams or laser beams are etched
onto composite quartz glass on which a metal (suchas chrome) light shielding film is formed.
Toppan has photomask manufacturing bases in sevencountries around the world and offers high quality
photomasks to customers all over the world.

How is a photomask used?

Type of Photomasks

Using ultraviolet light, the semiconductor circuit pattern formed on
the surface of a photomask is transferred onto the photo resist(photosensitive resin) that is coated over the surface of a siliconwafer. The pattern is usually reduced to a quarter size throughreduction lenses on the stepper (exposure device).

Binary Masks

Structure of binary mask is simple; it is a photomask blankcovered with patterned layer of opaque material.
Its transmission characteristics are either transparent or nontransparent. Binar y mask is used for building a pattern inwhich line width being larger than the exposure wave length.

Phase Shift Masks
Enlarged image of photomask surface

Phase-shif ting mask (PSM) has achieved improved wafer
printability with higher resolution and increased DOF (Depth of
Focus), by controlling the phase shift and the transmission
rate.
This is a standard technology for lithography in which line
width being smaller than the exposure wave length.

EUV Masks

Enlarged image ofphotomask surface

E U V i s n e x t g e n e r a t i o n l i t h o g r a p h y t e c h n o l o g y. E U V
lithography uses EUV light shorter wave length than existing
DUV, and requires reflective optics exposure system.

Exposure process
Ultraviolet
rays

A
A

Stencil Masks
Photomask

Reduction lenses
Silicon wafer

A

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TOPPAN Electronics

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Sili c on ste ncil mask is a photomask for El e ctron B e a m
Lithography, with nanometer size aper tures to fabricate
nanometer scale patterns.

Various photomask types
Toppan provides high-definition and reliable photomasks for a wide
range of applications, such as for various industrial and R&D purposesetc.
3D Photo masks (Gray-tone masks)

TEST CHART

By using a pattern smaller than the resolutionl i m i t, h a l f to n e s a re ex p re s s e d w i th o u t
resolving the pattern on an object such as awafer. High quality 3D structure can beformed.

Test chart is the photomask which formed
the basic-shaped pattern on the glass
substrate. It is available in the uses such as
accuracy management of equipment, aresolution check, and a valuation basis at
photo-resist selection.photo-resist selection.

Example of pattern

positive type

Examples of Photomasks

negative type・ Masks for MEMS

・ Masks for LED

・ Masks for IC (bump)・ Masks for Micro Lens Array

・ Masks for Thermal Head ・ Test Chart
・ Masks for various R&D etc.
・ Mask for Device Accuracy control
・ Master masks for High-resolution Printing
・ Masks for Semiconductor Packaging Substratesetc.

Nanoimprint Molds
Nanoimprint lithography is a microfabrication technology used totransfer patterns that measure a few dozen nanometers by placing
resin between a mold and a substrate and hardening the resin. Its
process is so simple that it is expected to enable inexpensive andhighly repeatable mass volume manufacturing of microstructures.
To p p a n d eve l o p s a n d p ro d u c e s h i g h-p re c i s i o n m o l d s fo r
nanoimprint lithography, applying lithography technologies that havebeen developed in the company’s semiconductor photomask
business.
Mold

Substrate

Resin

Quartz Molds
Quartz molds are mainly used in the UV nanoimprint method.
Quartz is used as the material for semiconductor photomasks. It
is characterized by high rigidity and flatness.
The manufacturing process, same as that of semiconductor
photomasks, allows to fabricate fine level patterns that measure a
few dozen manometers. Toppan also develops and manufactures
multistage structure molds.

Silicon Molds
Silicon molds are mainly used in the thermal nanoimprint method.
Patterns are drawn with an electron beam on a silicon substratethat has been coated with photosensitive resin. Dry etching isthen used to make the patterns deeper.
The manufacturing process, same as that of Quartz molds,
allows to form fine precision patterns. Silicon molds with highaspect ratio patterns are under development.

Multi-stage structure
pattern example

High-definition pattern examples

Dot pattern(height : 50nm)

1:1 Line ＆ Space(depth : 50nm)

50nm

Opening pattern(height : 50nm)
45nm

55nm

Substrate size：6025 (152×152×6.35mm(t))

Multi-stage
structure■ Pillar□ HoleHigh-aspectratio patterns

Wafer Mold

1μm

0.5mm block(Includes 4 patterns)

Substrate size：200mm wafer

10µm

2µm

5µm

1µm

Each of Dimensions：3µm

3μm

TOPPAN Electronics

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FC-BGA Substrates (High Density Semiconductor Package Boards)
Satisfying diversified requirements withbuild-up wiring board technology
An FC-BGA (Flip Chip-Ball Grid Array) substrate isa high density semiconductor package board thatenables higher speed LSI chips with more functions.
We have developed ult ra high densit y w ir ing
substrates with our original microfabrication andbuild-up wiring technologies, offering products
supporting current semiconductor microfabrication.
I n t he a reas of m icroprocessors a nd g raphic
processors for PCs, servers and game devices, aswell as L SIs for digital home appliances, Toppan
comprehensively supports customer's needs fromsubstrate design to manufacture. Solutions for leadfree and halogen-free products are also available.

Structure of FC-BGA package

Technologies that support higher density
Hyper Build-up
In terms of power strengthening andsignal quality, high-end products suchas highly functional processors requirebuild-up technology with a higher layercount specification. Using the filled via
ho le te chno log y that e na ble d th e
optimization of manufacturing
c o n d i t i o n s , To p p a n g u a r a n t e e sreliability of interlayer connections.

IC Chip (Die)FC-BGA substrate

Under ﬁll

FC bump

Solder ball

Higher Pin Count / Ultra Fine Wiring

Structure of FC-BGA substrate
FC-BGA SubstrateThis type of substrate is excellent in terms of its narrow pitch, electriccharacteristics and heat radiation due to a structure that combines IC
chip connecting FC bumps with ball pads on the substrate side.
FC-BGA Cross section
Solder resist

FC-BGA
Cross
sectionBall padCoreless FC-BGA Substrate
Since there is no core layer, it makes possible to ultra-high density
and ultra-thin, and has excellent electrical characteristics, enablinghigh speed and multi-function of LSI chips. In addition, the freedomof design is greatly improved because the through hole of the corematerial is unnecessary as one of the features.
Coreless
FC-BGA
Cross
sectionCoreless FC-BGA Cross section
FC bump
Build-up layer
Solder resist

It is high-precision patterningtechnology that suppor ts theincreasing demand for higher density
wiring. Based on Toppan’s copperpl atin g te c h n o l o g y th at ha s b e e ncultivated through the manufacture of
substrates for super computers thatneed strict impedance control, thethickness of conductors has beensuccessfully made uniform, allowing
super-fine wiring with little fluctuation.

Line/space = 10/10 μm
Pitch = 120μm

FC bump
Build-up layerCore layer
Build-up layer

Via fill resin

Line/space = 12/12 μm
Land/Via = 85/55μm

Ball padNarrow Pitch FC Bumps
With a trend toward smaller bumps
w i t h n a r rowe r p i tc h, To p p a n h a s
adopted various advanced productionm e th o d s i n a d d i ti o n to th e h i g h resolution silkscreen printing process
and successfully developed a pres o l d e r i n g m eth o d th at m i n i m i ze s
fluctuation. Through a stable supply ofsuch solder, we support customer's
high yield component mounting.

Pitch = 120μm

Development of New Substrates
Demands for higher speed devices
and smaller packages are driving
needs for new substrate technologies.
To respond to such needs, Toppan is
actively tackling the development of
substrates with new structures such as
substrates for 2.1D packaging.

Line-up of products

FC-BGA
FC-BGA

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TOPPAN Electronics

FC-LGA
FC-LGA

コアレスFC-BGA
Coreless
FC-BGA

マルチチップFC-BGA
Multi-chip
FC-BGA

2.3/2.5DFC-BGA
FC-BGA
2.3/2.5D

Etched Products
Etching is a type of method that chemically corrodesa metal surface to remove a portion of the material.
Toppan develops, manufactures, and sells a wide
variety of etching-applied products, such as micro
flow channels, metal masks, copper touch sensors,and other components for var ious electronics
products, using the advanced etching technology
cultivated over many years in manufacturing.
In addition, we also produce logo plates and metal
bookmarks, etc. Based on our photofabrication
technology, we provide microfabricated products tomeet our customers' applications.

High definition metal masks
Ultra-high definition metal mask for sputtering. The etching process is controlled with highprecision to form a cross-sectional shape suitable for sputtering applications. It is possible toform films with high-precision sputter pattern deposition.

Light shielding plate for camera module

Copper Touch Sensors

T he etching method solved the
problem of the press construction
method, where the cross section isflat and at right angles, causing
diffuse reflection of light.
Black oxide coating (black oxidefilm) treatment is also available forlow reflectivity.

By using copper as the electrodematerial, this touch sensor has
greatly reduced resistance,
improved operational
per formance, and enabled alarger and lighter touch sensors.
Toppan’s Copper Touch Sensors
are manufactured and sold by
VTS- Touchsensor Co., Ltd.

Micro Channel
By combining through-etching andhalf-etching to stack thin sheetswith different patterns, complex flow
channels can be formed.
Applications include components
for heat dissipation and coolingdevices and ink channels.

Filter Cross Section Structure by Application

Contamination removal / separation,
camouﬂaging of external appearance

Flow rate control

Flow rate control

Flow rate control

TOPPAN Electronics

9

LSI Design / LSI Turnkey Service
Toppan Technical Design Center develops and designs LSIs basedon various technologies related to LSIs such as digital, analog andmemory etc.

http://www.toptdc.com/en/

LSI Design Service
As an LSI design partner of various semiconductor manufacturers, the company has
been providing LSI development and design services for about 50 years. Development
performed in the past encompasses a wide variety of fields, including analog, memory,
LCD, LED drivers, and microcomputer logic. For development of RF and analog mixed
signal in particular, a wealth of technologies including power circuit, amplifier circuit, highfrequency LSI, and system LSI digital mixed macro have been accumulated. TOPPAN
prides itself on industry-leading technical know-how.
Analog mixed signal development achievements● High-speed data interface（SerDes/LVDS）● Power management / DC-DC converter● CMOS image sensor● Silicon tuner● PLL/VCO● ADC/DAC● Sensor● LED Driver● LCD Driver● Wireless● RF : LNA/MIXLSI Turnkey Service● High-speed transmission system device

Products（LSI）● Wireless communication RF front end● AFE for sensors

RTL Design
Logic Synthesis
Layout Design
Photomask

Trial mfr.

● Response from design to production● Flexible interface● Correspondence of small quantity lot● Production and quality control● Prototype service compliant

System Design

LSI Design

Specialties

Total Quality Assurance

Features

Turnkey Service

Customer

Product Delivery

This is a solution-based business aiming to provide a total range of services, fromcircuit design to LSI prototype and mass production based on each customer’s
requirements and specifications. Its strengths in the analog field include wirelesscommunication technologies, high-speed transmission technologies, sensor circuits,
and power circuits.
In the digital field, the company has expertise in low power consumption technologies.
Through collaborations with partners with their own particular strengths, we respond toclients’ requests for custom LSIs.

Wafer Process
Wafer Test
Packaging
Final Test

● Power supply IC

Device Solutions
This service develops and mass-produces original electronic devices that meet the needs of customers.
Toppan provide one-stop support from planning to manufacturing on behalf of customers. We can handle a wide range of products, fromsmall-scale prototypes at the PoC (proof-of-concept) stage where ideas are put into shape, to mass production of products.

Planning

Circuit design
Board design

Material
selection

Trial /
Evaluation

Certifications

Reliability
test

Mass
production

Own Products
TDS601I/O Expander IC

Toppan Original ASSP

10TOPPAN Electronics

ZETA BOXZETA / LPWA network gateway

TDS902ZETA LPWA Communication Module

Device Development & Solutions
Aerial Touch Display "La+ touchTM "This is an " Aerial Touch Display " that enables non-contact operation bytouching the image floating in the air.
It can be used for operation equipment in factories where cleaning istime-consuming due to contamination during handling, or where gloves
must be on and off during operation.
It can also be used for operation panels of equipment in food factories
and medical facilities, where a high level of hygiene is required, as well
as for reception areas, access control systems, elevators, signage, etc.,
where many unspecified people come into contact with the equipment,
to create a safe, secure, non-contact environment.

Smart Inspection Support Services for Plants and Facilities "e-PlatchTM "e-Platch is a system that remotely monitors measuring instruments
scattered throughout factories/facilities which reduces the burden of
inspection work.
It is capable of automatically collecting data from existing measuring
instruments and providing integrated monitoring services, including
environmental data analysis and report generation, by constructing a"wireless communication network without blind spots" using the LPWA
standard ZETA.
The system reduces and streamlines the burden of environmental
conservation and inspection work at factories/facilities, and enables theactive allocation of human resources.

ToF Sensors
ToF is an abbreviation for "Time of Flight" and refers to the time of flightof light, or the time it takes for light to hit an object and return. ToF
sensors are used in applications that recognize the shape andmovement of objects in three dimensions by measuring the very shorttime of flight of light.
We provide high-speed, high-precision ToF sensors that are required fora wide range of applications such as gesture recognition, robot vision,
logistics transportation, gaming, and security.

Micro Channel Chip
These Micro channel Chips are made using microfabrication technology
based on the photolithography method cultivated in the manufacture ofcolor filters for displays.
The micro channel is formed on a photoresist coated on a glass
substrate with a width of 10 µm to several millimeters and a depth of 1
to 50 µm, and is expected to be used in the field of liquid biopsy using
blood and other body fluids for cancer screening and clinical testing,and also in the field of in vitro diagnostic reagents.

TOPPAN Electronics

11

Toppan Technical Design Center Hokkaido Dc

Toppan Electronics Products Niigata Plant

Toppan Photomask Asaka Plant
Toppan Technical Design Center Asaka Dc

Toppan Electronics Products Shiga Plant
Toppan Photomask Shiga Plant
Toppan Tomoegawa Optical Films Shiga Plant

Electronics Division Hino OfficeToppan Photomask

Electronics Division Nishinihon OfficeToppan Technical Design Center Fukuoka Dc

Electronics Division
Toppan Tomoegawa Optical Films Shizuoka Plant
Toppan Electronics Products Mie Plant

Electronics Division Chikushino OfficeElectronics Division Kyoto OfficeToppan Technical Design Center Kyoto Dc

Electronics Division Hirokawa Plant

Toppan Electronics Products Kumamoto Plant

Planning, development and sales of electronics products

Manufacturing and development of electronics products

TOPPAN INC. ELECTRONICS DIVISIONTOPPAN ELECTRONICS PRODUCTS CO., LTD.

Toppan Shibaura Bldg., 3-19-26 Shibaura Minato-ku,
Tokyo, 108-8539 Japan
TEL +81-3-5418-3900

Niigata Plant●

Hino Office

2-8-7 Asahigaoka, Hino, Tokyo, 191-0065 Japan
TEL +81-42-514-0700

Mie Plant●

Kyoto Office

Yomiuri Kyoto Bldg., 630 Shichikannon-cho,Karasuma-dori Rokkaku-sagaru, Nakagyo-ku, Kyoto,
Kyoto, 604-8162 Japan
TEL +81-75-257-7231

Shiga Plant●

Nishinihon Office

Shimazu Hakata Bldg. 7F, 4-20 Reisen-machi, Hakata-ku,
Fukuoka, Fukuoka, 812-0039 Japan
TEL +81-092-261-2070

Chikushino
Office511-1 Ritsumeiji, Chikushino, Fukuoka, 818-0042 Japan
TEL +81-92-405-0290

Hirokawa
Plant

1425-58 Fujita, Hirokawa-cho, Yame-gun, Fukuoka,
834-0123 Japan
TEL +81-943-24-8058

LSI design, system development and LSI turnkey service
TOPPAN TECHNICAL DESIGN CENTER CO., LTD.

12

Toppan Electronics Products Kochi Plant

Kochi Plant

Kumamoto
Plant

●

●

Color filters, FC-BGA substrates
5270 Yamazaki, Ijimino, Shibata, Niigata, 957-0028 Japan
TEL +81-254-22-8911
Color filters646-3 Shiraki-isshiki, Seki-machi, Kameyama, Mie, 519-1104 Japan
TEL +81-0595-84-6701
Light Control Film
1101-20 Myohoji-cho, Higashi-ohmi, Shiga, 527-0046 Japan
TEL +81-748-24-3501
TFT LCDs
2420 Kureda, Nankoku, Kochi, 783-0062 Japan
TEL +81-88-862-1000
Color Filter Arrays (On-chip Color Filters), Photo etched Parts
800 Ikura Kitakata, Tamana, Kumamoto, 865-0041 Japan
TEL +81-968-73-2191

Manufacturing, development and sales of photomasks
TOPPAN PHOTOMASK CO., LTD.

Shiodome City Center, 1-5-2 Higashi Shimbashi,Minato-ku,
Tokyo, 105-7133 Japan
TEL +81-3-5418-3905

Asaka Plant

7-21-33 Nobitome, Niiza, Saitama, 352-0011 Japan
TEL +81-48-482-4701
1101-20 Myohoji-cho, Higashi-ohmi, Shiga, 527-0046 Japan
TEL +81-748-24-3432

Shibaura
OfficeToppan Shibaura Bldg., 3-19-26 Shibaura Minato-ku,
Tokyo, 108-8539 Japan
TEL +81-3-5418-3915

Shiga Plant

Asaka
Design Center

7-21-33 Nobitome, Niiza, Saitama, 352-0011 Japan
TEL +81-48-482-4428

Manufacturing and sales of surface treatment (anti-reflection) films

Hokkaido
Design Center

1-1-30 Nijuyonken Shijou, Nishi-ku, Sapporo, Hokkaido,063-0804 Japan
TEL +81-11-616-6111

Kyoto
Design Center

Yomiuri Kyoto Bldg., 630 Shichikannon-cho,Karasuma-dori Rokkaku-sagaru, Nakagyo-ku, Kyoto,
Kyoto, 604-8162 Japan
TEL +81-75-257-7181

Fukuoka
Design Center

Shimazu Hakata Bldg. 7F, 4-20 Reisen-machi, Hakata-ku,
Fukuoka, Fukuoka, 812-0039 Japan
TEL +81-92-282-6280

TOPPAN Electronics

TOPPAN TOMOEGAWA OPTICAL FILMS CO., LTD.
Kyoto Office

Yomiuri Kyoto Bldg., 630 Shichikannon-cho,Karasuma-dori Rokkaku-sagaru, Nakagyo-ku, Kyoto,
Kyoto, 604-8162 Japan
TEL +81-75-257-7233

Shiga Plant

1101-20 Myohoji-cho, Higashi-ohmi, Shiga, 527-0046 Japan
TEL +81-748-24-3501

Shizuoka Plant

3-1 Mochimunetomoe-cho, Suruga-ku, Shizuoka,
Shizuoka, 421-0192 Japan
TEL +81-54-256-4111

EUROPENORTH AMERICADRESDEN TOPPAN PHOTOMASKS GERMANY(GERMANY) ADVANCED MASK TECHNOLOGY CENTERSAN JOSE (U.S.A.) TOPPAN AMERICAROUND TOPPAN PHOTOMASKSROCKTOPPAN PHOTOMASKS ROUND ROCK
(U.S.A.) TOPPAN PRINTING CO. (AMERICA)
DUSSELDORF (GERMANY) TOPPAN EUROPE

AUSTIN (U.S.A.) TOPPAN AMERICA

CORBEIL (FRANCE) TOPPAN PHOTOMASKS FRANCEASIA PACIFICSEONGNAM (KOREA) TOPPAN ELECTRONICS KOREAICHEON (KOREA) TOPPAN PHOTOMASKS KOREAKUNSHAN (CHINA)KUNSHAN GIANTPLUS OPTRONICS DISPLAY TECHNOLOGYSHANGHAI (CHINA) TOPPAN SENSING ELECTRONICS (SHANGHAI)
TOPPAN PHOTOMASKS SHANGHAITOPPAN (SHANGHAI) MANAGEMENTTAIPEI (TAIWAN)

TOPPAN ELECTRONICS TAIWANTAOYUAN (TAIWAN) TOPPAN CHUNGHWA ELECTRONICS
GIANTPLUS TECHNOLOGY TAOYUAN PLANT
HSINCHU (TAIWAN) TOPPAN CHUNGHWA ELECTRONICS HSINCHU BRANCHTOPPAN ELECTRONICS TAIWAN HSINCHU BRANCHGIANTPLUS TECHNOLOGY HSINCHU PLANT
TOUFEN (TAIWAN)

GIANTPLUS TECHNOLOGYMALAYSIA ORTUSTECH (MALAYSIA)SINGAPORE TOPPAN SEMICONDUCTOR SINGAPORE

U.S.A.

KOREA● Manufacturing and sales of photomasks for semiconductors● Manufacturing and sales of photomasks● Manufacturing and sales of photomasks for semiconductors● Sales of electronics products

TOPPAN PHOTOMASKS, INC.

TOPPAN PHOTOMASKS ROUND ROCK, INC.

● Sales of electronics products

TOPPAN PHOTOMASKS KOREA LTD.
TOPPAN ELECTRONICS KOREA INC.
CHINATOPPAN AMERICA INC.

● Manufacturing and sales of color filter arrays (on-chip color filters)

GERMANYTOPPAN SENSING ELECTRONICS (SHANGHAI) CO., LTD.

● Manufacturing and sales of photomasks for semiconductors● Manufacturing and sales of photomasks for semiconductors● Development and manufacturing of photomasks for semiconductors● Manufacturing of TFT LCDs

● Sales of electronics products● Sales of electronics products

TOPPAN PHOTOMASKS GERMANY GmbHv
ADVANCED MASK TECHNOLOGY CENTER GmbH & CO. KG

TOPPAN PHOTOMASKS COMPANY LIMITED, SHANGHAIKUNSHAN GIANTPLUS OPTRONICS DISPLAY TECHNOLOGY CO., LTD.
TOPPAN (SHANGHAI) MANAGEMENT CO., LTD.

TOPPAN EUROPE GmbHFRANCESINGAPORE● Manufacturing and sales of photomasks for semiconductors

TOPPAN PHOTOMASKS FRANCE S.A.S.

● Sales of photomasks for semiconductors

TOPPAN SEMICONDUCTOR SINGAPORE PTE. LIMITED.

TAIWANMALAYSIA● Manufacturing and sales of photomasks for semiconductors● Manufacturing of TFT LCDs

TOPPAN CHUNGHWA ELECTRONICS CO., LTD.

ORTUSTECH (MALAYSIA) SDN. BHD.

● Sales of electronics products

TOPPAN ELECTRONICS TAIWAN INC.

● Manufacturing and sales of TFT LCDs

GIANTPLUS TECHNOLOGY CO., LTD.

Please refer to our website for further informationsuch as addresses and contact details.

https://www.toppan.com /en/electronics/profile/On this page, the term “sales” is used as a general term covering all sales activities (including market research, customer service, and sales support, etc.)

TOPPAN Electronics

13©TOPPAN 2024.04 K I