ADMETA Plus 2015 - Poster Presentation list
#Name

Affilication

Title

E-mailA Study on Mechanical Structure of a MEMS Accelerometer

1

Daisuke Yamane

Tokyo Institute of Technology

yamane.d.aa@m.titech.ac.jp

2

Yoriko Mizushima

Tokyo Institute of Technology

mizushima.y.aa@m.titech.ac.jp

3

Kotaro Sato

Tohoku University

Grain growth and resistivity reduction of reflowed Cu -Mn in
koutarou.satou.p5@dc.tohoku.ac.jp
SiOC trench lines

4

Zuopeng He

5

Md. Rasadujjaman

University of Yamanashi

rasadphy@duet.ac.bd

6

Eungmin Lee

Tohoku University

b4tm5304@s.tohoku.ac.jp

7Daisaku YANOORGANO Corporation

yano-d@organo.co.jp

8

Soichiro Suzuki

Osaka Prefecture University

Palladium Catalyst
Thermal stability of titanium carbide/nitride wiring resistancessuzuki@chemeng.osakafu-u.ac.jp
for p-type diamond contact material

9

Mitsuhiro Watanabe

University of Yamanashi

mitsuhirow@yamanashi.ac.jp

10

Naoto Noda

Air Liquide Laboratories

naoto.noda@airliquide.com

11

Osamu Nakatsuka

Nagoya University

Crystalline Structure and Chemical Reaction of Ti
nakatuka@alice.xtal.nagoya-u.ac.jp
Thin Layer

12

Yoko Takada

Osaka Prefecture University

Ferroelectric properties of (Pb,La)(Zr,Ti)O3 capacitors using
ytakada@chemeng.osakafu-u.ac.jp
Al:ZnO top electrodes pulsed lase deposited with different

13

Panart KhajornrungruangKyushu Institute of Technology

panart@mse.kyutech.ac.jp

14

Dong-Yurl Yu

KITECH

Cwlee@kitech.re.kr

15

Changhong Hyun

SNUPrecision Co., Ltd.

mltrh09@snuprecision.com

16

Sunho Kim

Sungkyunkwan Univ.

sunhofy@skku.edu

17

Sekwon Na

Sungkyunkwan Univ.

nase@skku.edu

18

Ho yong

Sungkyunkwan Univ.

snrntldh@skku.edu

19

Jeong-Gyu Song

Yonsei University

mussmi@yonsei.ac.kr20So-Yeon Lee

KIST

so_yeon_e@naver.com

21

Daekyun Jeong

Kookmin University

tnstory@kookmin.ac.kr

22

Jae-Hak LeeKIMM

jaehak76@kimm.re.kr

23

Byoung-Jun ChoHanyang University

bjcho303@nate.com

Semiconductor manufacturing
International Corporation

Zuopeng_he@smics.com

Fabricated by Multi-layer Metal TechnologyBehavior of Copper Contamination for Ultra-Thinning of 300
nm Silicon Wafer down to <5um

Low temperature dielectric oxide process study for TSV WLP
application
Copper Thin Film Growth using Cu(I) Amidinate Precursor inSupercritical Carbon Dioxide: Deposition Kinetics andNarrow-Gap-Filling
Electrical Contact Property and Interfacial Reaction of Mo on
surface-treatedn-InGaAs
Inhibition of Copper Corrosion by Removal of Hydrogen
Peroxide and Dissolved Oxygen from Rinse Water using aVersatility of ZnO as a room-temperature adhesion
promoter for Cu/glass stacks
The study of precursor effect on low temperature PEALD SiN

oxygen pressure
Determination of Individual Sub 100 nm Nano-Particle Size inan Evanescent Field using Scattering Light Intensity
Joint Reliability of Sn-Cu-Cr for Automotive Electronics
Modules
Critical dimension measurement of TSVs using WLSIPerformance enhancement for Ag nanowire-based trasparent
conductor using TiO2:Cs sol-gel
The Mo alloying effects on microstructures and electricalproperties for Yb silicidation
Contact resistance between thermoelectric material andelectrodes
Low temperature silicon oxide process study for TSV WLP
application
Fabrication of Mechanically-robust Cu films on Flexible
Substrates Using Electron beam Irradiation
Reduction on Sidewall Stress of Cu TSV with LbL Multilayers
Micro Insert Bump Thermo-Compression Bonding for MultiChip Package
Effect of pH and Polisher’s Conditions on Cu-BTA Complex
Formation during Cu CMP Application
The Applications of the Patterend Ag-nanowire Networks to24

Jin-Woo Park

Yonsei University

jwpark09@yonsei.ac.kr

25

Jongwan Jung

Sejong University

26

Kukjoo Kim

UNIST, KIMM

zcartom@unist.ac.kr

27

Chon-Hsin Lin

Asia-Pacific Institute of Creativity

cslin@ms.apic.edu.tw

28

Myungwoo Son

GISTmwson@gist.ac.kr

29

Yonghyun Won

Seoul National Univ. Sci. and Tech.

eunkyung@seoultech.ac.kr

30

Jae-Oh Bang

Sungkyunkwan Univ.

bjaeoh@skku.edu

31

Min Young Lee

Yeungnam University

tmvlr77@naver.com

32

Byeonghyeon Jang

Yeungnam University

jangbh131@naver.com

33

Younhwan ShinSeoul National Univ. Sci. and Tech.

sdkim@seoultech.ac.kr

34

Youngju Nam

Seoul National Univ. Sci. and Tech.

sdkim@seoultech.ac.kr

35

Gyu-Tae Park

Andong National University

36

Hyeonchul Lee

Andong National University

meerkat718@gmail.com

37

Jae-Chan Lee

Seoul National Univ.

odysseii@gmail.com

38

Seung-Min Lim

Seoul National Univ.

smsophia@snu.ac.kr

39

Kyung-Tae Jang

Seoul National Univ.

meetjjang@snu.ac.kr

40

Min-Woo Jeong

Seoul National Univ.

zzdhkdn91@snu.ac.kr

41

Se-Hoon Park

KETIpsh104@keti.re.kr

42

Won Jae YEO

YEST

wjyeo@yest.co.kr

43

JongHa Choi

Seoul Techno Parkjhchoi@seoultp.or.kr

44

Ji Hwan Kim

Seoul National Univ. Sci. and Tech.

malla2004@seoultech.ac.kr

45

Taewook Nam

Yonsei University

twnam@yonsei.ac.kr

46

Jun Yeob SongKIMM

sjy658@kimm.re.kr

47

Y. Nagendra Prasad

Micro Chemical Korea Co. Ltd

nagmck@gmail.com

48

정소현

SK Hynix49

최정열SK Hynix

50

김시한SK Hynix

51

Junbeom Kim

Yeungnam University

Transparent Thin Film Heaters and Electrodes for Organic
Light Emitting Diodes.
Growth of multilayer graphene by CVD and doping forgraphene interconnect
Fabrication of High-resoultion Bridge-like 3D Interconnects
using Electrohydrodynamic Inkjet Printing
New copper-alloy film for industrial applications
Cu/graphene heterostructures for advanced interconnects:
direct growth of graphene on Cu interconnects
On-Chip Liquid Cooling Solution for High PowerIC Devices
Thermo-mechanical Behavior of Die Attach Film on PCB
Substrates for Multi-chip Packages
Atomic layer deposition of Ru thin films using new zero
valent Ru precursors and molecular O2 and Application tothe seed layer for Cu Electroplating
A Study on the Characteristics of Al2O3 Films Deposited byAtomic Layer Deposition using a New Metallorganic
Precursor
Experiment and Thermal Simulation of Cu Through Silicon
Via in 3D IC
Effects of Forming Gas􀀁Plasma Treatment on Low
Temperature Cu-Cu Direct Bonding
Ni Barrier Effect on Electromigration Failure Mechanism ofCu/SnAg Microbump
Effects of Post-Annealing and Temperature/Humidity
Treatments on the Interfacial Adhesion Energy of Cu/SiNx
Interface
Enhancement of Electron mobility in Solution-Processed
Indium Oxide Thin Films through W DopingModulation of Oxygen Vacancy and Stoichiometry inAmorphous Metal Oxides at Metal/Oxide Interfaces forEnhancement of Rectifying Property
Structural effects on electromigration reliability under DC
stressing for memory Devices
Composition Effects on Electrical Properties of Sputtered BiTe
Via interface modification of embedded chip resistor
packages and its effect on drop shock reliability
Development of wedge error compensation tool for chip towafer package
A Study on electrical properties of PDMS fine-pitch socketfor testing BGA
Microstructural Investigation on Oxidation of Cu in Agcoated Cu Film Using FIB-TEM Technique
Atomic Layer Deposition of Cobalt-based bifunctional Layeror Cu Interconnect
Step-covered Interconnection on Flexible Electronic Devices
by Using Electrohydrodynamic Jet Printing System
Material Removal Mechanism by Slurry Free Lapping Pad
Via Filling 공법에 따른 TC 신뢰성 연구DRAM Package 구조 및 재료에 따른warpage 거동에 관한 연구Thin Solar Cell Package의 휨 거동 연구

dembi@ynu.ac.kr

Atomic Layer Deposition of F-free tungsten nitride thin films using
NH3 plasma and N2/H2 mixture plasma