Submitting MMC Technical Reports
on Terminology to the IEC
October 4 on whether or not to adopt this proposal. If
the proposal is adopted at this time, then the issue will
be offered up for a discussion on international
standards. However, the proposal has many hurdles toovercome before it can finally be standardized.

While the Micromachine Center was carrying out
R&D on Micromachine Technology under METI's
Industrial Science and Technology Frontier Program
over a ten-year period, it also stressed thestandardization of terminology and measurement
evaluation, even at the research stage. Accordingly,
the Center organized working groups for measurement
evaluation and terminology under the Committee on
Micromachine Standardization (chairman: Hisayoshi
Sato, Professor of Chuo University) and conductedstudies on these topics. The results were compiled intechnical reports that have been published. For
terminology, definitions were confirmed in English andJapanese for 220 terms. The Micromachine Center led
discussions on this glossary at an online International
Standardization Forum, while publishing the glossary
on its home page and collecting comments regarding
its contents.

Through these achievements, however, thestandardization activities of the Center have enteredan international phase, thereby achieving one
milestone. In keeping with this, tensile testing
methods for thin films conducted under commission ofNEDO have entered a stage this fiscal year in which astandardization proposal will be created with thesupport of the Japanese Standards Association.
The following is the list of the committee members(at the time of the committee activities) who
contributed to developing the terminology.

After it was determined that nearly all opinions hadbeen collected, the Center received approval from theWG for terminology to submit the glossary formally tothe IEC. The Center also formally submitted theglossary to the IEC/TC47/WG4 after receiving approval
from a domestic committee (JEITA) on TC47
(semiconductor devices).

ChairmanNobuyuki Moronuki (Tokyo Metropolitan
University Graduate School)

Members

Nobuyuki Kabei (Saitama Cardiovascularand Respiratory Center)
Masaaki Ikeda (OMRON CORP.)
Koichi Suzumori (TOSHIBA CORP.)
Hiromu Narumiya (MITSUBISHIELECRIC CORP.)
Takefumi Kabashima (YASKAWA
ELECTRIC CORPORATION)

The copy below shows a letter from the IEC
notifying all countries on July 5 of Japan's proposal
regarding terminology and definitions. As shown by
the notifications, P- members are urged to vote by

47/1644/N P
NEW WORK ITEM PROPOSALClassification according to IEC Directives Supplement,
Table 1

A3

Proposer

Date of proposalJapan

2002-07

TC/SC

Secretariat

47

Korea

Date of circulation

Closing date for voting

2002-07-05

2002-10-04

A proposal for a new work item within the scope of an existing technical committee or subcommittee shall be submitted to theCentral Office. The proposal will be distributed to the P-members of the technical committee or subcommittee for voting, and to theO-members for information. The proposer may be a National Committee of the IEC, the secretariat itself, another technicalcommittee or subcommittee, an organization in liaison, the Standardization Management Board or one of the advisor ycommittees, or the General Secretary. Guidelines for proposing and justifying a new work item are given in ISO/IEC Directives,
Part 1, Annex C (see extract overleaf). This form is not to be used for amendments or revisions to existing publications.
The proposal (to be completed by the proposer)
Title of proposal

IEC 60747 : Semiconductor devices ---- Par t XX-1 : Micro electromechanical devices ---Terms and definitions
Standard

Technical Specification

Scope (as defined in ISO/IEC Directives, Part2, 6.2.1)

To provide

terms and definitions of microelectronic mechanical devices.

Purpose and justification, including the market relevance and relationship to Safety(Guide 104), EMC(Guide 107),
Environmental aspects(Guide 109) and Quality assurance(Guide 102).(attach a separate page as annex, if necessary)In the field of micro electro-mechanical devices, many technology areas are included such as,
electronics, mechanical engineering, chemistry and biology. it is desirable to construct glossary for
micro electromechanical devices for convenience of end-users of the devices.

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