SUMICRYSTALSUMICRYSTAL
M65 to M71

M
SUMIDIASUMIDIABINDERLESSSUMICRYSTAL
C

D

S

T

V

W

SUMICRYSTAL ........................................................ M66
SUMICRYSTAL PD/PDX ......................................... M67
SUMICRYSTALSUMICRYSTAL UP .................................................. M68
SUMICRYSTAL UP (Half Cut) ................................ M69
SUMICRYSTAL UPT................................................ M70
SUMICRYSTAL CD ................................................. M71

M65

Synthetic Single-crystal Diamond

SUMICRYSTALSUMICRYSTALSUMICRYSTALSUMIDIASUMIDIABINDERLESS

M

 General Features
SUMICRYSTAL is the world's first commerciallyavailable large single-crystal synthetic diamond,developed by Sumitomo.
Thorough quality control has achieved stable
quality, making SUMICRYSTAL ideal as anindustrial material.
 Production Method
The synthetic single-crystal diamond SUMICRYSTAL is
synthesised in a super high pressure chamber from 5 to 6GPaand high temperatures from 1,300 to 1,600°C. The temperature
difference between the raw carbon and the seed crystal is used
to grow the diamond on the seed crystal. Through this stringent
control of pressures and temperatures, a more stable structurewith minimal impurities can be obtained.

D Inside a super high pressure chamber
Synthetic Conditions
Pressure: 5 to 6GPa
Temperature: 1,300 to 1,600°C
Pressure
Piston

C

D

S

T

Die

 Properties
SUMICRYSTAL has 4 main advantages over natural diamond.
1) Structural advantage: Natural diamond is rounded and the
crystal orientation is difficult to determine with the naked eye.
SUMICRYSTAL, however, has a distinct crystal face whichmakes the identification much easier.
2) Uniformity: Due to the strictly controlled conditions in which the
crystals are grown, uniform quality is obtained consistently.
3) Availability: Unlike the limited supply of natural diamonds,
SUMICRYSTAL can be mass produced.
4) SUMICRYSTAL diamond type Ib, which is used for tools, hasmechanical and thermal properties equal to or even greater thannatural diamond, while containing small amounts of nitrogen
impurities.

CarbonsourceSolvent
metalHigh temperature
Temperature
difference(20 to 50°C)

Low temperature
Seed crystal
SUMICRYSTAL
PressureV

D Microfracture Strength of Synthetic DiamondW

D Orientation and Wear ResistanceCutting Conditions Metal Bond Diamond Grindstone: #800
Grinding Speed: 3,000m/min

25
Wear (mm/min)

Microfracture Strength (GPa)

30

20

15

10
Natural Diamond

SUMICRYSTAL

Orientation/Direction

M66

Dresser Blank SUMICRYSTAL PD

PD/PDX General Features
SUMICRYSTALSUMICRYSTAL PD and PDX are single-crystal synthetic
diamonds processed into thin prism shapes for use as
dresser blanks. Their stable performance and long tool life
improve dressing precision.

M Features

 Features

D Revolutionary elongated shape(1) Improves holding power and prevents falling out.
(2) Consistent cross-section prevents deterioration.
(3) Uniform crystal orientation promotes stable tool life.

D Compared to SUMICRYSTAL PD, the product has different facecrystal orientation.
(1) Crystal orientation (211) provides better tool life than PD blanks.
(2) Parallel abrasive resistant faces (111) facilitate blank setting
during manufacturing of dressers.

 Standard Cat. No. (PD) Standard Cat. No. (PDX)

ShapeCat. No.

PD
Laser cutW

TL
· Dimension L is the distance
between the centre points ofboth ends.
· Both upper and lower (111) faces
are cleaved.
PD-T
Cleaved face(111)

Laser cut face(211)
Cleaved face(111)(110) FaceT

Dimensions (mm)L
W

Single cleaved side face with predetermined abrasive resistant direction.

Stock
T
W
L
D 0.2±0.05 0.2±0.05 2.0 to 2.5
PD 0220
D 0.4±0.05 0.4±0.05 2.0 to 2.5
PD 0420
3.0 to 4.0
PD 0630K D
PD 0640K D 0.6±0.1 0.6±0.1 4.0 to 5.0
5.0 up
PD 0650K D
3.0 to 4.0
PD 0830K D
PD 0840K D 0.8±0.1 0.8±0.1 4.0 to 5.0
5.0 up
PD 0850K D
3.0
to 4.0D
PD 1130K
1.1±0.1 1.1±0.1
4.0 to 5.0
PD 1140K D
PD 0630TK D 0.6±0.1 0.6±0.1 3.0 to 4.0
4.0 to 5.0
PD 0640TK D
PD 0830TK D 0.8±0.1 0.8±0.1 3.0 to 4.0
4.0 to 5.0
PD 0840TK D
3.0 to 4.0
D
PD 1130TK
1.1±0.1 1.1±0.1
4.0 to 5.0
PD 1140TK D

ShapeCat. No.

PDX 0220
PDX 0320
W
PDX 0420
PDX 0630
T
L
PDX 0640
PDX 0830· Dimension L is the distance
PDX 0840
between the centre points of both
PDX 1130ends.
· Both upper and lower (111) faces
PDX 1140
are cleaved.
PDX

Laser cut

SUMICRYSTALSUMICRYSTAL PDX

SUMIDIASUMIDIABINDERLESSSUMICRYSTAL PD

Dimensions (mm)

Stock
T
W
L
D 0.2±0.05 0.2±0.05 2.0±0.1
D 0.3±0.05 0.3±0.05 2.0±0.1
D 0.4±0.05 0.4±0.05 2.0±0.1
3.0±0.5D
0.6±0.1 0.6±0.1
4.0±0.5D
3.0±0.5D
0.8±0.1 0.8±0.1
4.0±0.5D
3.0±0.5
D
1.1±0.1 1.1±0.1
4.0±0.5
D*1 Sizes other than those indicated above can be ordered.
*2 These products may have fine impurities within Sumitomo's prescribed range.
*3 The laser cut faces among other product areas may have chipping within Sumitomo'sprescribed range.

C

D

S

T

V

*1 Sizes other than those indicated above can be ordered.
*2 These products may have fine impurities within Sumitomo's prescribed range.
*3 The laser cut faces among other product areas may have chipping within Sumitomo'sprescribed range.

Cleaved face
(111)

55°

Laser cut face(211)(110) Face

Laser cut face
(211)

55°

PD-T

Cleaved face
(111)
e ion
asiv ect
Abr nt dir >ista 110res <(110) Face
res Abista rasn iv<11 t dire e0> ction

Cleaved face
(111)

Cleaved face(111)

· The two types above both exist in thewear-resistant direction.

W PDX Crystal OrientationA
re bradir sist sivee
<1 cti ant
10 on> PD Crystal Orientation
PD

Cleaved face (111)

Cleaved face
(111)(211) Face

Laser cut face
(211)
(110)
Face

55°

Abrasive
resistantdirection

Cleaved face(111)

Laser cut face (110)· Single cleaved side face with predetermined abrasive resistant direction.

 KK type

 K type

Apart from the standard items listed above, PD is also available in
the KK type with both end faces laser-cut.

Apart from the standard items listed above, PDX is also available in
the K type with both end faces laser-cut.

Both end faces are laser cut

Laser cut

· When ordering, please include "K"behind the standard catalogue no.
(Example: PDSSSSKK,PDSSSSTKK)· PD0220 and PD0420 are not available in the KK
Laser cut type.

Both end faces are laser cut· When ordering, please include "K"behind the standard catalogue no.
(Example: PDXSSSSK)· PDX0220, PDX0320 and PDX0420 are notavailable in the K type.

Laser cut

Laser cut

The orientation in the shape diagram is a typical value, with deviations in actual products.

M67

Ultra-precision Tooling Grade SUMICRYSTALUP

SUMICRYSTAL General Features

SUMICRYSTALSUMIDIASUMIDIABINDERLESSM

Of today's sophisticated cutting-edge technologies, ultra-precision
machining processes such as those used for optical element molds
are seeing particularly rapid development.
SUMICRYSTAL UP blanks have high performance and reliability,
making them optimally suited to these applications.
 Features(1) High quality with very low variance.
Stable wear resistance with excellent resistance to cutting edge chipping.
(2) Minimal stock removal during cutting edge formation.
Uniform shape facilitates cutting edge formation.

 Standard type

 Economy type

Rectangular parallel type with 6 (100) faces.

Peripheral growth faces and top (100) are not cut. Benefits include
large volume and low cost.

 Standard Cat. No. (Standard type)
Shape

Cat. No.

Top and Bottom
Surfaces:
Ground Surface

UP

W
C1

L

T
C2

C

UP 282512
UP 282515
UP 303015
UP 301415

Laser cut face (100)

D

S

T

The red arrows indicate
the direction for easy
grinding.
Crystal face orientations
are all (100) except thecorners.

UP 333014
UP 333017
UP 353514
UP 353517
UP 351717

Stock

L
2.8 to3.5
2.8 to3.5
3.0 to3.5
3.0 to3.5
3.3 to4.0
3.3 to4.0
3.5 to4.0
3.5 to4.0
3.5 to4.0

Dimensions (mm)W
2.5 to3.5
2.5 to3.5
3.0 to3.5
1.4 to1.7
3.0 to4.0
3.0 to4.0
3.5 to4.0
3.5 to4.0
1.7 to
2.0

C1,C2
T
up to
1.2±0.1
0.8
up to
1.5±0.1
0.8
up to
1.5±0.1
0.3
up to
1.5±0.1
0.3
up to
1.4±0.1
0.9
up to
1.7±0.1
0.9
up to
1.4±0.1
0.4
up to
1.7±0.1
0.4
up to
1.7±0.1
0.4*1 Sizes other than those indicated above can be ordered.
*2 These products may have fine impurities, chipping, etc. within Sumitomo's prescribedrange.
*3 Impurities, cracks, etc. outside the inspection range may be present at the product corner(C surface) interior.
Corner (C surface) Interior

 Standard Cat. No. (Economy type)
Shape

Cat. No.

UP Economy typeøDT

Growth Surface
Top Surface: Growth
Surface or Ground Surface
Bottom Surface: Ground
SurfaceV
The red arrows indicate
the direction for easy
grinding.

W

D Cutting Tools Using SUMICRYSTAL UP

UP 2010
UP 2012
UP 2510
UP 2512
UP 2515
UP 3010UP 3012UP 3015
UP 3510UP 3512UP 3515
UP 4010
UP 4012UP 4015
UP 4020
UP 4510UP 4512UP 4515
UP 4520
UP 5010UP 5012UP 5015
UP 5020

Dimensions (mm)øDMinimum
Stock guaranteedTdimensions-0.0
2.0 1.0+0.2+0.3
2.0
1.2 -0.0+0.2
2.5
1.0 -0.0+0.3
2.5
1.2 -0.0+0.3
2.5
1.5 -0.0+0.2
3.0
1.0 -0.0+0.3
3.0
1.2 -0.0+0.3
3.0
1.5 -0.0+0.2
3.5
1.0 -0.0+0.3
3.5
1.2 -0.0+0.3
3.5
1.5 -0.0+0.2
4.0
1.0 -0.0+0.3
4.0
1.2 -0.0+0.3
4.0
1.5 -0.0+0.3
4.0
2.0 -0.0+0.2
4.5
1.0 -0.0+0.3
4.5
1.2 -0.0+0.3
4.5
1.5 -0.0+0.3
4.5
2.0 -0.0+0.2
5.0
1.0 -0.0+0.3
5.0
1.2 -0.0+0.3
5.0
1.5 -0.0+0.3
5.0
2.0 -0.0*1 Sizes other than those indicated above can be ordered.
*2 Fine impurities, chipping, etc. within Sumitomo's prescribed range may be present in theminimum guaranteed dimensions of these products.
*3 Impurities, chipping, etc. outside the inspection range may be present outside theminimum guaranteed dimensions of these products.
*4 Some products have ground top surfaces.

Wiper Insert for High-efficiency Cutter for Aluminum Alloy RF type

SUMICRYSTAL SC10 (Wiper Insert)

H241

M51

· Utilises Sumitomo Electric Hardmetal's SUMICRYSTAL as a cutting edge.
SUMICRYSTAL is a single-crystal diamond produced using a unique superhigh-pressure technology.
· SUMICRYSTAL can maintain its edge sharpness better than sintereddiamonds, greatly reducing burr formation.

* This product was jointly developed with A.L.M.T. Corp.

M68

SUMICRYSTAL (Single-crystal Diamond)
SC10 Wiper Blade Machined Surface

The orientation in the shape diagram is a typical value, with deviations in actual products.

SUMIDIA (Sintered Diamond)
Wiper Blade Machined Surface

Ultra-precision Tooling Grade SUMICRYSTALUP (Half-Cut Product) General Features
SUMICRYSTAL UP Half Cut products are materials for holders consisting of the UP Economy typematerial cut in half along the (100) or (110) faces.
SUMICRYSTAL Features(1) Machining loss is reduced because volume removed by grinding during tool production is reduced.
(2) Similar shape to the completed tool, reducing material costs.
(3) The cut surface is a smooth laser surface.

SUMIDIASUMIDIABINDERLESS

 Type cut along (100) faceM

 Type cut along (110) face

Cutting position (100)

SUMICRYSTAL

Cutting position (110) Standard Cat. No. (Cutting Position 100 type)
Shape

Cat. No.

UP 2010 (100) 1/2
UP 2012 (100) 1/2
UP 2510 (100) 1/2
UP 2512 (100) 1/2
UP 2515 (100) 1/2
UP 3010 (100) 1/2
UP 3012 (100) 1/2
UP 3015 (100) 1/2
øD
UP 3510 (100) 1/2
UP 3512 (100) 1/2
UP 3515 (100) 1/2
T
UP 4010 (100) 1/2
Laser cut face
UP 4012 (100) 1/2
Growth Surface(100)
UP 4015 (100) 1/2
Top Surface: Growth
Surface or Ground Surface
UP 4020 (100) 1/2
Bottom Surface: GroundUP 4510 (100) 1/2
Surface
UP 4512 (100) 1/2
UP 4515 (100) 1/2
UP 4520 (100) 1/2
UP 5010 (100) 1/2
UP 5012 (100) 1/2
The red arrows indicate the UP 5015 (100) 1/2
direction for easy grinding. UP 5020 (100) 1/2
UP Half-Cut (100) type

Dimensions (mm)øDMinimum
Stock guaranteedTdimensions+0.2
2.0
1.0 -0.0+0.3

2.0

1.2 -0.0

2.5

+0.2
-0.0

1.0

2.5

1.2 -0.0

2.5

+0.3
-0.0

+0.3

1.5

+0.2
-0.0

3.0

1.0

3.0

1.2 -0.0

3.0

+0.3
-0.0

3.5

+0.3

1.5

+0.2
-0.0

1.0

+0.3
-0.0

3.5

1.2

3.5

1.5 -0.0

4.0

+0.2
-0.0

4.0

+0.3

1.0

+0.3
-0.0

1.2

+0.3
-0.0

4.0

1.5

4.0

2.0 -0.0

4.5

1.0 -0.0

4.5

1.2 -0.0

+0.3
+0.2
+0.3
+0.3

4.5

1.5 -0.0

4.5

2.0 -0.0

5.0

+0.2
-0.0

5.0
5.0
5.0

+0.3

1.0

+0.3
-0.0

1.2

+0.3
-0.0

1.5

+0.3
-0.0

2.0

*1 Sizes other than those indicated above can be ordered.
*2 Fine impurities, chipping, etc. within Sumitomo's prescribed range may be present in theminimum guaranteed dimensions of these products.
*3 Impurities, chipping, etc. outside the inspection range may be present outside theminimum guaranteed dimensions of these products.

 Standard Cat. No. (Cutting Position 110 type)
Shape

Cat. No.

UP 2010 (110) 1/2
UP 2012 (110) 1/2
UP 2510 (110) 1/2
UP 2512 (110) 1/2
UP 2515 (110) 1/2
UP 3010 (110) 1/2
UP 3012 (110) 1/2
UP 3015 (110) 1/2
øD
UP 3510 (110) 1/2
UP 3512 (110) 1/2
UP 3515 (110) 1/2
T
UP 4010 (110) 1/2
UP 4012 (110) 1/2
Laser cut face (110)
UP 4015 (110) 1/2
Top Surface: Growth
Surface or Ground Surface
UP 4020 (110) 1/2
Bottom Surface: GroundUP 4510 (110) 1/2
Surface
UP 4512 (110) 1/2
UP 4515 (110) 1/2
UP 4520 (110) 1/2
UP 5010 (110) 1/2
UP 5012 (110) 1/2
The red arrows indicate the UP 5015 (110) 1/2
direction for easy grinding. UP 5020 (110) 1/2
UP Half-Cut (110) type

Dimensions (mm)øDMinimum
Stock guaranteedTdimensions+0.2
2.0
1.0 -0.0+0.3

2.0

1.2 -0.0

2.5

1.0 -0.0

2.5

1.2 -0.0

2.5

1.5 -0.0

3.0

1.0 -0.0

3.0

1.2 -0.0

3.0

1.5 -0.0

3.5

1.0 -0.0

3.5

1.2 -0.0

3.5

1.5 -0.0

4.0

1.0 -0.0

4.0

1.2 -0.0

4.0

1.5 -0.0

4.0

2.0 -0.0

4.5

1.0 -0.0

4.5

1.2 -0.0

4.5

+0.3
-0.0

1.5

4.5

2.0 -0.0

5.0

1.0 -0.0

5.0

1.2 -0.0

5.0

1.5 -0.0

5.0

2.0 -0.0

C

D

+0.2
+0.3
+0.3

S

+0.2
+0.3
+0.3
+0.2

T

+0.3
+0.3
+0.2
+0.3

V

+0.3
+0.3
+0.2
+0.3

W

+0.3
+0.2
+0.3
+0.3
+0.3

*1 Sizes other than those indicated above can be ordered.
*2 Fine impurities, chipping, etc. within Sumitomo's prescribed range may be present in theminimum guaranteed dimensions of these products.
*3 Impurities, chipping, etc. outside the inspection range may be present outside theminimum guaranteed dimensions of these products.

The orientation in the shape diagram is a typical value, with deviations in actual products.

M69

Ultra-precision Tooling Grade SUMICRYSTAL

UPT General Features

SUMICRYSTALSUMICRYSTAL UPT is a material for bites with a 2-point surface ((110)
surface) as the main surface.

SUMIDIASUMIDIABINDERLESS

M

 Features(1) 2-point surface ((110) face) enables use for the same applications as with bites using conventional natural diamonds.
(2) Distinctive shape minimises the volume removed to make the cutting edge, enabling efficient machining.

 Standard Items
Shape
UPT

SUMICRYSTAL

Cat. No.
Top (L/2)

L
Bottom (L/2)

Impurities

T
W

Dimensions (mm)

UPT 2510
UPT 2512
UPT 3010
UPT 3012

Stock

W UPT Crystal Orientation

LT
1.0±0.1≥ 2.5 ≥ 2.5
1.2±0.1<100> Direction><10 0

1.0±0.1≥ 3.0 ≥ 2.5
1.2±0.1*1 Sizes other than those indicated above can be ordered.
*2 Fine impurities, chipping, etc. within Sumitomo's prescribed range may be present at the
top (L/2).
*3 Impurities, chipping, etc. outside the inspection range may be present at the bottom (L/2).

Growth Surface
or Laser Cut
Surface

D

S

T

V

W

M70

Abrasive
resistantdirection
2-point Surface (110)Ground SurfaceC

The orientation in the shape diagram is a typical value, with deviations in actual products.

Dire

ction

Material for Wire-Drawing Dies SUMICRYSTALCD General Features
SUMICRYSTAL CD has optimised crystal orientation and shape
as a material for wire drawing dies. Realising excellent performancethrough high quality and stability.
SUMICRYSTALThe outside is machined by laser, achieving a consistent shape foreasy setting. Mounting pressure is applied evenly, ensuring sufficientstrength even for small volume. Ideal for applications with limited
dimensions, such as nozzles and wire guides.

 Standard Items
Cat. No.

CD 1006(111)
CD 1008(111)øDCD 1210(111)T
CD 1411(111)
Cleaved CD 1512(111)face
CD 1814(111)Growth(111)
SurfaceCD 2016(111)
Laser cut face
CD 2318(111)The laser cutting surface
orientation is undetermined. CD 2520(111)
L

L

Stock

Shape

Dimensions (mm)

D
D
D
D
D

øD
MinimumLT
guaranteed
dimensions
0.9 1.0±0.1 0.6±0.1
0.9 1.0±0.1 0.8±0.1
1.1 1.2±0.1 1.0±0.1
1.3 1.4±0.1 1.1±0.1
1.4 1.5±0.1 1.2±0.1
1.7 1.8±0.1 1.4±0.1
1.9 2.0±0.1 1.6±0.1
2.2 2.3±0.1 1.8±0.1
2.4 2.5±0.1 2.0±0.1*1 Sizes other than those indicated above can be ordered.
*2 Dimension L is guaranteed on the small side surface of the volume.
*3 Cleaved steps within Sumitomo's prescribed range may be present on the cleaved surface.
*4 Fine impurities, chipping, etc. within Sumitomo's prescribed range may be present in theminimum guaranteed dimensions of these products.
*5 Impurities, chipping, etc. outside the inspection range may be present outside theminimum guaranteed dimensions of these products.

M

SUMICRYSTAL Standard type(1) High quality with very low variance.
High-quality crystal with minimal impurities, chipping anddistortion is used to achieve high, stable wear resistance. It also
eliminates the need for inspection and selection of raw stones as
required for natural diamond.
(2) High fracture strength
Resistant to fracture and cracking during wire drawing.
(3) Accurate crystal orientation(111) is used on the top and bottom surface, limiting crystal
misorientation, which causes variance in tool life, to within 1°.
(4) No grinding needed for top and bottom surface
The top and bottom surface are cleaved to form parallel surfaces,
eliminating the need for grinding of the top and bottom surface.

SUMIDIASUMIDIABINDERLESS

 Features

C

D

S

T

V

W

The orientation in the shape diagram is a typical value, with deviations in actual products.

M71

M72