DEFENSE LOGISTICS AGENCY
LAND AND MARITIMEPOST OFFICE BOX 3990
COLUMBUS, OH 43218-3990

Mark Wasilewski
VP Quality
onsemi
2300 Buckskin Road
Pocatello, ID 83201-2734

August 20, 2021

Dear Mr. Wasilewski:
Re: Full Certification Class Q and N for MIL-PRF-38535; FSC 5962; VQC-21-035654; Yu.
CN: 077528.
onsemi has demonstrated to the DLA Land and Maritime compliance with MIL-PRF-38535,
the QML specification used by the Department of Defense (DoD) for integrated circuits that operate insevere environments.
This DLA Land and Maritime - VQC-21-035654 letter reflects the current certification statusof onsemi as documented in the Quality Management Plan (QMP) #12MQM97077A, Rev. BY, dated
16 July 2019.
In addition, the parts that are manufactured using the certified technology flows are being listedon the QML-38535. This will allow onsemi to mark parts with “QML” or “Q”. These designators
have been authorized by the DoD for parts that have been produced to a QML specification (i.e., one
which allows less government oversight), the use of world-wide commercial production lines, reduced
finished product testing based on statistical process control (SPC), and other cost advantages.
Testing must be performed using the facilities and methods listed in the Laboratory Suitability
letter VQC-21-035655 or at facilities approved by the onsemi Technical Review Board or BU-CAB
using its MIL-PRF-38535 QML Processing Program.
This certification is subject to the conditions in DoD 4120.24-M, Defense Standardization
Program and SD-6.
Any and all of the facilities mentioned on the enclosure are subject to an audit by the Qualifying
Activity at any time. Offshore facilities are subject to the conditions of MIL-PRF-38535. The QML
manufacturer is responsible to arrange for the qualifying activity to gain access to all applicablemanufacturing facilities to preform site assessments to MIL-PRF-38535 requirements.
QPL/QML manufacturers shall notify the qualifying activity immediately after learning of apotential issuance of a GIDEP alert, problem advisory or major quality/reliability problem on their
QPL/QML products. Failure to provide prior notification may be grounds for removal from QML38535.

In addition, it is requested that the following activities be reported promptly to DLA Land andMaritime:
1. Changes to certified facilities, process flows, or approved testing subcontractors
2. Problem evaluation and a corrective action when:a. A Technology Conformance Inspection (TCI) failure has been validatedb. The reliability of shipped parts is questionable.
3. Test optimization, including:a. Implementation - paragraph J.3.12, Appendix J, MIL-PRF-38535
b. Changing, suspending or canceling a prior test optimization
4. Additions or deletions of parts in the QML-38535
5. Change of company QML contact or other key QML personnel
This certification is valid until terminated by written notice from DLA Land and Maritime, and,if warranted, may be withdrawn at any time.
If you have any questions, please contact Mr. Shing Yu at (614) 692-0588.
Sincerely,

MICHAEL S. ADAMS
Chief
Custom Devices Branch
ENCLOSURE
Visit us on the web at: https://landandmaritimeapps.dla.mil/Offices/Sourcing_and_Qualification/default.aspx

Enclosure to DLA Land and Maritime- VQC-21-035654
OPERATIONFACILITY

LOCATIONTECHNOLOGY

Wafer Fabonsemi Gresham
onsemi Pocatello

Gresham, OR
Pocatello, ID

Designonsemi Pocatelloonsemi Richardson
onsemi Lindon
onsemi Lower Gwynedd
Controlled by Wafer FabAmkor/Anam (P1)

Pocatello, ID
Richardson, TX
Lindon, UT
Lower Gwynedd, PA
Gresham, OR
Pocatello, ID
Manila, Philippines

180 nm CMOS
0.35, 0.5, 0.6, 0.8, 1.0,
1.25, 1.5um CMOS
Custom ASICs
Custom ASICs
Custom ASICs
Custom ASICs
Custom ASICs

Amkor/Anam (P3)

Laguna, Philippines

Crtieria LabsAustin, TX

Integra Technologies
Silicon Valley
Kyocera America, Inc.
Pantronix

Milpitas, CAMicross Components AITAmkor/Anam (P1)

Research Triangle
Park, NC
Manila, Philippines

Amkor/Anam (P1)

Manila, Philippines

Amkor/Anam (P3)

Laguna, Philippines

Amkor (K4)

Gwangju, Korea

Advanced Semiconductor
Engineering, Inc.
Crtieria Labs

Kaohsiung, Taiwan

Mask Fab
Hermetic
Assembly

Plastic
Assembly

Die Attach
Materials

Wire Type andWire Size

LINE /FLOW #

12MID7019030
12MID7019030
12MQE00004A
12MQE00004A
12MQE00004A
12MQE00004A
12MID7619107

Ceramic Packages(Residual Inventory)
Ceramic Packages(Residual Inventory)
Hot Solder Dip
Ceramic Packages
Ceramic Packages

12MID7020040DBGA Ceramic
Ceramic Packages(Residual Inventory)
CCGA

12MID7020040
12MID7020040

LQFP

12MID7020037
12MID7020037

Austin, TX

PLCC & PQFP(Residual Inventory)
PBGA & chip carrier(Residual Inventory)
PBGA and FCBGA(Residual Inventory)
PBGA, FCBGA,PQFP and LQFP
Eutectic and JM7000

Integra Technologies
Silicon Valley
Kyocera America, Inc.
Silicon Turnkey
Solutions (Micross)Amkor/Anam

Milpitas, CA

Eutectic and JM7000

12MID7050040

San Diego, CA
Milpitas, CA

Eutectic and JM7000
JM7000

12MID7050040
12MID7050040

Manila, Philippines

Gold: 1 mil

12MID7050040Crtieria Labs
Integra Technologies
Silicon Valley
Kyocera America, Inc.

Austin, TX

12MID7050040
12MID7050040

Silicon Turnkey
Solutions (Micross)

Milpitas, CA

Aluminum: 1.25 mil
Aluminum: 1.25 mil
Gold: 1 mil
Aluminum: 1.25 mil
Gold: 1 mil
Gold: 1 mil

San Diego, CA
Fremont, CA

Milpitas, CA
San Diego, CA

12MID7020040
12MID7050013
12MID7020040
12MID7050040

CCGA-01

12MID7020062
12MID7020037
12MID7020062
12MID7020037
12MID7020037
12MID7050040

12MID7050040
12MID7050040

Lid Seal

Lead Finish
Electrical Test

Amkor/Anam
Crtieria Labs
Integra Technologies
Silicon Valley
Kyocera America, Inc.
Silicon Turnkey
Solutions (Micross)Integra Technologies
Wichitaonsemi Carmona
onsemi Pocatello

Test/Screen/TCI
Hermetic Package
Technology

Plastic Package
Technology

Manila, Philippines
Austin, TX

Milpitas, CA

Solder Furnace Seal
Solder Furnace Seal
Solder Furnace Seal

12MID7050040
12MID7050040
12MID7050040

San Diego, CA
Milpitas, CA

Solder Furnace Seal
Seam Seal

12MID7050040
12MID7050040
12MID7050013

Wichita, KS

Hot Solder, Gold
Plate, Tin-Lead Plate,Gold Flash Palladium
Custom ASICs

Carmona Cavite,
Philippines
Pocatello, ID

Custom ASICs
Custom ASICs

12MID7020037
12MID7050013
12MID7050026
12MID7050013
12MID7050026
12MID7050013
12MID7050026

See DLA Land and Maritime-VQC-21-035655 QML Laboratory Suitability letter

Chip Carrier (pre-J up to 84 leaded)
Chip Carrier (leadless up to 84 terminals)
Flat Pack (100-352 leads)
Side-braze (28-48 leads)
Pin Grid Array (69-181 pins)
DBGA (228-277 balls)
CLGA (564-624 pads)
CCGA (564-624 columns)
Flat Pack (44-240 leads)
Chip Carrier (28-84 leads)
LFPBGA (84 balls max)
BGA (564 balls max)
SBGA (560 balls max)