MAVR-011020-1411
Solderable GaAs Constant Gamma Flip-Chip
Varactor DiodeFeatures

Rev. V2

Flip-Chip Design

Constant Gamma for Linear Tuning
Low Parasitic CapacitanceHigh Q
Silicon Nitride Passivation
Polyimide Scratch Protection
Surface Mount Configuration
Lead Free (RoHS Compliant*)
Available in Pocket Tape and ReelCan withstand 500 Temperature Cycles (-65°C
to +150°C), mounted with Sn96.5/Pb3.5 solder
without Mechanical Degradation
 Can be Mounted with Solder or Conductive
Epoxy

Front View (Circuit Side)

Description

Back View (Operator Side)The MAVR-011020-1411 is a gallium arsenide flip
chip hyperabrupt varactor diode. This device isfabricated on OMCVD epitaxial wafers using aprocess designed for high device uniformity andextremely low parasitics. This diode is fully
passivated with silicon nitride and has an additional
layer of polyimide for scratch protection. The
protective coatings prevent damage to the junction
during automated or manual handling.

Ordering Information1,2

The flip chip configuration is suitable for pick andplace insertion.

Part NumberPackage

MAVR-011020-14110P

Pocket Tape

MAVR-011020-14110GGel Pack

1. Reference Application Note M513 for reel size information.
2. All sample boards include x loose parts.

Electrical Specifications: TA = +25°C

Breakdown Voltage @ IR = 10 µA, VB = 22 V Minimum
Reverse Leakage Current @ VR =18 V, IR = 100 nA Maximum
Forward Voltage @ 1 mA = 1.15 - 1.25 V
Parameter

Test Conditions

Units

Min.

Typ.

Max.

Total Capacitance

1 MHz, 0 V
1 MHz, 4 V
1 MHz, 15 V

pF

0.19
0.065
0.025

—

0.275
0.097
0.048

Q Factor

50 MHz, 4 V——3000—

Gamma

2 - 12 V——

0.9

1.1* Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.
1MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:https://www.macom.com/support
DC-0010595

MAVR-011020-1411
Solderable GaAs Constant Gamma Flip-Chip
Varactor DiodeParameter

Absolute Maximum

Power Dissipation

100 mW

Mounting Temperature+260°COperating Temperature-40°C to +125°C

Storage Temperature-65°C to +150°C

3. Exceeding any one or combination of these limits may cause
permanent damage to this device.
4. MACOM does not recommend sustained operation near thesesurvivability limits.

Performance Curve @ +25°C
1.00

Total Capacitance (pF)

Absolute Maximum Ratings3,4Rev. V2

0.10

0.01

1Reverse Bias Voltage (V)Schematic (equivalent circuit)
RS (V)CJ (V)

10LS

CPARASITIC

Mounting Techniques

Handling Procedures

Die attach for these devices is made simple throughthe use of surface mount die attach technology. Thischip was designed to be inserted onto hard or soft
substrates with the junction side down. This chip canbe mounted with conductive epoxy or with solder.

The following precautions should be observed to
avoid damaging these chips:

Solder Die Attach:This device can be mounted with Sn63/Pb37 or
RoHS compliant solder.
Typical reflow profiles are provided on applicationnote M538, “Surface Mounting Instructions” which
can be found @ www.macom.com

Epoxy Die Attach:This device can also be attached with conductive
epoxy. The assembly can be preheated to
125 - 150°C. Use a minimum amount of epoxy. Cureepoxy as per manufacturer’s instructions.

Cleanliness
The chips should be handled in a cleanenvironment. Do not attempt to clean die afterinstallation.

Static Sensitivity
Semiconductor devices are ESD sensitive and canbe damaged by static electricity. Proper ESD
techniques should be used when handling thesedevices.

General Handling
The protective polymer coating on the active areasof these die provides scratch protection, particularly
for the metal air bridge which contacts the anode.
Die can be handled with tweezers or vacuum
pickups and are suitable for use with automatic
pick-and-place equipment.

2
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:https://www.macom.com/support
DC-0010595

MAVR-011020-1411
Solderable GaAs Constant Gamma Flip-Chip
Varactor DiodeRev. V2

Flip Chip Outline Drawing (Case Style 1500)

3MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:https://www.macom.com/support
DC-0010595

MAVR-011020-1411
Solderable GaAs Constant Gamma Flip-Chip
Varactor DiodeRev. V2

MACOM Technology Solutions Inc. All rights reserved.
Information in this document is provided in connection with MACOM Technology Solutions Inc ("MACOM")
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MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM
customers using or selling MACOM products for use in such applications do so at their own risk and agree tofully indemnify MACOM for any damages resulting from such improper use or sale.
4MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:https://www.macom.com/support
DC-0010595