Call for Papers
Abstract Due

June 21, 2024

2024 8th International Workshop on Low Temperature Bondingfor 3D Integration(LTB-3D 2024, WaferBond 2024 East)
Oct. 30-Nov. 1, 2024, Nara-city, Japan
Sponsored byGeneral Incorporated Non-profit Association - Institute for Advanced Micro-System Integration (IMSI)Technically Co-sponsored by
The Electrochemical Society (to be confirmed)
IEEE Electronics Packaging Society Japan Chapter (to be confirmed)
Endorsed by
The Japan Society of Applied Physics (JSAP) (to be confirmed)

2024 8th International Workshop on Low Temperature
Bonding for 3D Integration (LTB-3D 2024) will be held inOct. 30-Nov. 1, 2024, in Nara-city, Japan.

 Venue

Nara Kasugano International Forum “IRAKA”

The LTB-3D is a premier conference series sponsored byGeneral Incorporated Non-profit Association - Institute forAdvanced Micro-System Integration (IMSI), technically cosponsored by The Electrochemical Society and The IEEE
EPS Japan Chapter. Preceding LTB-3D workshop was heldin Tokyo, Japan in its 1st (2007), 2nd (2010), 3rd (2012), 4th(2014), and 5th (2017) versions and in Kanazawa in 6th(2019) version. Its 7th version, LTB-3D 2021, was heldonline. LTB-3D 2024 is given in Nara, an ancient capital ofJapan as WaferBond 2024 EAST in conjunction withWaferBond conferences which are held in Europe: 2009(Grenoble), 2011 (Chemnitz), 2013 (Stockholm), 2015(Braunschweig), 2017 (Leuven), 2019 (Halle/Saale), and2021 (Schmalkalden).
This workshop is focusing on the promotion of advanced
research areas related to low-temperaturebondingtechnologies, including surface activated bonding (SAB)
and atomic diffusion bonding (ADB), which realize novel
device structure by heterogeneous material and device
integration and lead to entirely new manufacturing
approaches to 3D and module integration of semiconductor
devices, photonics systems, and power electronic systems.
These bonding technologies have been already used for thevolume production and have potential applications in wide
range of manufacturing industries. This workshop will beheld as a single-track seminar to provide a compact forum
for close and deep discussion of all aspects of low
temperature bonding technologies  the latest technologies
and applications, as well as business opportunities.

 Access to Nara

 Scope•
•
•••
•
••
•

Roles of Low-temperature Bonding in 3D and HeteroIntegration
Surface Activated Bonding (SAB) and its Extensions
Hydrophilic and Plasma-assisted Bonding
Metal and Hybrid Bonding
New process for Low-temperature Bonding
Power, RF, Photonic, and MEMS device Applications
New Applications of Low-temperature Bonding
Fundamentals and characterization
Equipment and Quality Assessments

 Important Date

Abstract submission deadline
June 21, 2024
Acceptance/Rejection notification
July 26, 2024
Final manuscript and presentation material deadline
Aug. 30, 2024
Conference
Oct. 30–Nov. 1, 2024

 JJAP Special Issue

Special Issue of Japanese Journal of Applied Physics will
be published as journal related to LTB-3D 2024.

 For further information, get in touch withhttps://imsi.jp/ltb3d/ltb3d-2024/index.html(under preparation)
Professor Dr. Naoteru Shigekawa
Osaka Metropolitan University
Steering Committee Chair and Contact Point
shigekawa@omu.ac.jp
Professor Dr. Tadatomo Suga
Meisei University / The University of Tokyo / IMSIIEEE EPS Japan Chapter
General Conference Chair and Lead Organizer
suga@pe.t.u-tokyo.ac.jp, suga@imsi.jp