Photovoltaics

iKon-M PV Inspector

NIR optimized CCD for high throughput In-line
Electro- and Photoluminescence Inspection of PV Cells
Key Specifications

Key Applications

9

Active pixels: 1024 x 1024

9Electroluminescence Inspection

9Sensor size: 13.3 x 13.3 mm

9Photoluminescence Inspection

9Pixel size (W x H): 13 µm x 13 µm

9In-line Solar Cell Inspection

9

Read noise: 9 e- @ 3 MHz

9Machine Vision

9Maximum cooling: -70°C

9Up to 4.4 fps (full frame)

9

Active area pixel well depth (typical)
100,000 e-andor.oxinst.com

Introducing iKon-M PV Inspector
Andor’s iKon-M PV Inspector is designed to offer ultimate
speed and sensitivity performance for in-line Electro- andPhotoluminescence Inspection, delivering > 90% QE beyond 800
nm. In standard back-illuminated CCD and EMCCD cameras,
NIR light is reflected within the sensor causing interference
patterns (etaloning) which significantly reduce the MTF andthus the resolution of the image. The PV Inspector is equippedwith a deep depleted sensor incorporating Fringe Suppression
Technology™ which almost completely eliminates etaloning.
The 1024 x 1024 array boasts high resolution 13 μm pixels, and benefits from negligible
dark current with thermoelectric cooling down to -70°C. PV Inspector offers industry highest
throughput via rapid readout speeds up to 5 MHz, combined with a unique ‘Dual Exposure
Ring Mode’ that allows fast exposure switching, without re-programming time overhead.
A lockable USB 2.0 port ensures secure industry safe, vibration resistant connectivity. PVInspector is ideally suited for very fast running PV inspection systems as found in Stringers
and Cell Sorters.

Features and Benefits
FeatureQE > 90% beyond 800 nm

Very high detector sensitivity in near infra-red

5 MHz and 3 MHz readout speeds

Rapid frame rates for high throughput cell inspection

Dual Exposure Ring Mode

Unique acquisition mode for exposure time switching

Fringe Suppression Technology™
UltraVac™ •1

Minimizes etaloning effects in the NIR, optimizes optical resolution
Critical for sustained vacuum integrity and to maintain unequalled cooling and QE
performance, year after year

Single AR-coated window design

NIR optimized anti-reflection coating

Thermoelectric cooling to -70°C(air cooled)Critical for elimination of dark current detection limit

Lockable USB connection
Cooling on power-up
Enhanced Baseline Clamp
13 x 13 µm pixel size

Ensures secure, vibration resistant connectivity
PV Inspector does not require PC connectivity to maintain stable thermoelectriccooling
Essential for quantitative accuracy of dynamic measurements
Optimal balance of dynamic range and resolution

Integrated shutter (optional)

High dynamic range and 16-bit digitization available

Andor Solis software / SDK(Linux SDK available)

Friendly Windows user interface offers intuitive acquisition optimization, system integration,
automation and advanced data manipulation facilities

Integrated in EPICS

2Benefit

Platform is fully integrated into the EPICS control softwareSystem Specifications•2Sensor option

BEX2-DD: Back Illuminated CCD, Deep Depletion with fringe suppression.
Optimum sensor for Near IR applications.

Active pixels

1024 x 1024

Pixel size

13 x 13 μm

Image area

13.3 x 13.3 mm with 100% fill factor

Minimum temperature air cooled (25°Cambient)-70ºC

Digitization

16 bitBlemish specifications

Grade 1 sensor from supplier. Camera blemishes as defined by Andor Grade A
andor.oxinst.com/learning/view/article/ccd-blemishes-and-non-uniformities

System window type

Single AR-coated UV-grade fused silica (NIR optimised)Interface

Lockable USB 2.0Lens mountC-mount (other mounts available on request)

Advanced Performance Specifications•20.14

Dark current, e-/pixel/sec @ -70°C •3
Pixel readout rates

5, 3 MHz

Pixel well depth

100,000 e-

Read noise (e-) •43 MHz
5 MHz

9.0
14.0
Better than 99%

Linearity •54.25 to 64.25 µs (software selectable)

Vertical clock speed
Dual exposure cycle time •6500 ms

Exposure switching timeNegligible

Array size compatibility

Full image only

Frame Rates•73 MHz

35 MHzBinning

Full Frame

512 x 512

256 x 256128 x 128

Binning

Full Frame

512 x 512

256 x 256128 x 128

1x1

2.6

5.2

10.0

18.6

1x1

4.4

8.5

16.0

28.8

2x2

6.3

10.9

19.3

33.2

2x2

8.4

15.9

28.5

47.6

4x4

13.4

20.9

34.2

53.5

4x4

15.6

28.1

47.0

70.8

8x8

25.1

36.3

54.4

76.5

8x8

27.3

45.8

69.4

93.5

16 x 16

41.5

56.1

76.5

97.1

16 x 16

43.6

66.9

91.2

111.5

Quantum Efficiency Curve•8

Application Image

An Electro-luminescence image of a multi-crystalline photovoltaic celltaken with the PV Inspector camera.
Exposure time 100 ms, read-out rate 5 MHz, total imaging-cycle timeless than 350 ms.

4Creating The Optimum Product for You
DU934PC S V-BEX2-DD
example shown

Step 1.

Shutter
Step 2.

Accessories &Adapters

Step 3.

Software

Choose the shutter option
Description

Code

Integrated shutter

SNo Shutter

0

Select the required accessories and adapters
Description

Order CodeC-mount to Nikon AF adapter

OA-CNAFC-mount to Olympus F-mount adapterOA-COFM

C-mount to T-mount adapter

OA-CTOT

Auto extension tubes (set of 3) for Canon AF

OA-ECAF

Auto extension tubes (set of 3) for C-mountOA-ECMT

Auto extension tubes (set of 3) for Nikon AF

OA-ENAFUSB Extender: Icron USB 2.0 Ranger 2201 (supports up to 100 m) - EU/UK/USACC-USBX-EU
ACC-USBX-UK
ACC-USBX-US

30 m Ethernet cable (for use with the above ACC-USBX-** USB extenders)

ACC-ELC-13295

Select the required software
The iKon-M PV requires at least one of the following software options:
Solis for Imaging A 32-bit and fully 64-bit enabled application for Windows (8.1 and 10) Linux and LabVIEW, offeringrich functionality for data acquisition and processing. AndorBasic provides macro language control of data acquisition,processing, display and export.
Andor SDK A software development kit that allows you to control the Andor range of cameras from your own
application. Available as 32/64-bit libraries for Windows (8.1 and 10), compatible with C/C++, C#, Delphi, VB.NET,LabVIEW, MATLAB and Python. Linux SDK compatible with C/C++.

Have you found what you are looking for?
Need a multi-megapixel solution? Loaded with FPGA intelligence, the Zyla and vacuum cooled Neo sCMOS are designed
to drive optimal performance from this exciting and innovative new technology development. Unlike any CMOS or CCD
technology to come before it, sCMOS sets radical new benchmarks in its unique ability to simultaneously deliver highest
specifications in sensitivity, resolution, speed, dynamic range and field-of-view: high-end imaging with ultimate sensitivity.
Best suited for module inspection in Laminators and Flashers.
Need a customised version? Please contact us to discuss our Customer Special Request options.

5

Product Drawings
Dimensions in mm [inches]
Third-angle projection

64.0 [2.52]

208.4 [8.2]

M4 x 5 deepn52.0 [2.04]

Focal Planeof Detector

52.0 [2.04]

62.0 [2.44]

107.5 [4.23]

4 off mountings
to clear 6-32 UNC

90.0 [3.54]

17.5 [0.69] ±0.4 [0.16]

105.0 [4.13]= position of pixel 1,1

25.4 [1.0]Weight: 2.2 kg [4 lb 13 oz]

13.0 [0.51]

n25.4 [1.0]13.0 [0.51]

25.4 [1.0]

2 off M6
x 10 deep

3 off 1/4-20 UNC
x 1/2" deep

Connecting to the iKon-M PV
Camera ControlConnector type: USB 2.0 with optional lockable connector
TTL / LogicConnector type: SMB, provided with SMB - BNC cable
Fire (Output), External Trigger (Input), Shutter (Output)
Mounting hole locations

I2C connector
Compatible with Fischer SC102A054-130
Shutter (TTL), I2C Clock, I2C Data, +5 Vdc, Ground
Minimum cable clearance required at rear of camera 90 mm
3 x SMB

PowerI²C

Lockable USB
connector

Rear connector panel

6Our Cameras for High Energy Detection
Andor’s portfolio of CCD, sCMOS and EMCCD cameras provide a wide range of high sensitivity, high dynamic
range and fast detection solutions for table-top laboratory and beamline experiments. These detectors benefit
especially applications in the field of EUV, X-ray, neutron or electron detection for material science, plasmastudies, bio-samples analysis or beam/source characterisation.

Open fronted direct X-ray detection
cameras333
33

 Long exposure Deep cooling Direct detection
 Large pixel well depths
 Imaging and spectroscopy

iKon & Newton CCD & Marana-X SO ranges

Fibre-optic coupling hard X-raydetection cameras

3333

 Fast Low noise High throughput
 Modular scintillator options

Zyla-HF sCMOS & iKon-L-HF CCD cameras

Beryllium windowed direct
soft X-ray detection cameras

3333

 Long exposure Direct detection
 Permanent vacuum Imaging and spectroscopy

iKon CCD, Newton CCD & iVac CCD SY ranges

Windowed lens coupled hard X-ray& neutron detection cameras

3333

 Fast Low noise Large area Deep cooled

iKon CCDs, Balor sCMOS, Zyla sCMOS, NeosCMOS, Marana sCMOS, iXon EMCCDs

Learn more about our detector range here.

7OrderToday
Order Today
Need more information? At Andor we are committed to finding the correct solution
for you. With a dedicated team of technical advisors, we are able to offer you oneto-one guidance and technical support on all Andor products.
For a full listing of our local sales offices, please see: andor.oxinst.com/contact
Our regional headquarters are:Europe					Japan
Belfast, Northern Ireland 			Tokyo
Phone +44 (28) 9023 7126			
Phone +81 (3) 6732 8968
Fax +44 (28) 9031 0792			
Fax +81 (3) 6732 8939
North America				China
Concord, MA, USA 				Beijing
Phone +1 (860) 290 9211			
Phone +86 (10) 5884 7900
Fax +1 (860) 290 9566			
Fax +86 (10) 5884 7901

Items shipped with your camera

Footnotes: Specifications are subject to change without notice

2x 5 m BNC - SMB connection cable
1x 5 m Lockable USB 2.0 cable Type A to Type B
1x Power supply with mains cable
1x electronic copy of Andor user guides
1x Individual system performance booklet

1. Assembled in a state-of-the-art cleanroom facility, Andor’s UltraVac™ vacuum process combinesa permanent hermetic vacuum seal (no o-rings), with a stringent protocol to minimize outgassing,including use of proprietary material.

Minimum Computer Requirements:

4. Readout noise is for the entire system. It is a combination of sensor readout noise and A/D noise.
Measurement is for Single Pixel readout with the sensor at a temperature of -70°C and minimum
exposure time under dark conditions.

• 3.0 GHz single core or 2.4 GHz multi core
processor• 2 GB RAM• 100 MB free hard disc to install software (atleast 1 GB recommended for data spooling)• USB 2.0 High Speed Host Controller capableof sustained rate of 40MB/s• Windows (8.1 and 10) or Linux

Operating & Storage Conditions• Operating Temperature: 0°C to 30°C ambient• Relative Humidity: < 70% (non-condensing)• Storage Temperature: -25°C to 50°C

2. Figures are typical unless otherwise stated.
3. The dark current measurement is averaged over the sensor area excluding any regions of blemishes.

5. Linearity is measured from a plot of counts vs exposure time under constant photon flux up to thesaturation point of the system.
6. The cycle time associated with Dual Exposure Ring Mode describes the time to read out twoconsecutive images of same or different exposure time in this mode. It assumes exposure times of 10 µs,
5 MHz horizontal readout and 4.25 µs vertical shift time. The cycle time would increase accordingly withuse of longer exposure times, which may be of different durations. Note, this mode is only compatible
with external trigger.
7. The frame rates shown are for a range of binning or array size combinations. All measurements aremade with 4.25 μs vertical shift speed. It also assumes internal trigger mode of operation and minimum
exposure time.
8. Quantum efficiency of the sensor at 25°C and -70°C as measured by the sensor manufacturer.

Power Requirements• 100 - 240 VAC, 50 - 60 Hz

FM40523

EMS91062

Windows is a registered trademark of Microsoft Corporation.
LPVInspectorSS 0523 R1