BM55 Series

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

0.3mm Pitch, 0.5mm Stacking Height,
Ultra Compact Hybrid FPC-to-Board Connector Supporting 5A

This productwas selected as aCES
Innovation
AwardsHonoree

The CES Innovation Awards are based upon descriptive materials submitted to the judges.
CTA did not verify the accuracy of any submission or of any claims made and did not test the item to which the award was given.

Dec. 2022

BM55 Series/0.3mm Pitch, 0.5mm Stacking Height, Ultra Compact Hybrid FPC-to-Board Connector Supporting 5AFeatures
1. Low- profile, Space- savingand High- strength Design

A lower-profile design with H=0.5mm than the conventional product.

Conventional Product(H=0.6mm)

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

While height decreases from 0. 6mm to 0. 5mm,
the strength increases by increasing the metal
surface and mounting area on the mating surface
side compared to Ultra small conventional
product.

BM55(H=0.5mm)

0.1mm
Lower-Profile

1.5mm

1.5mm

High-strength design by increasing mounting area andmetal surface.
Conventional Product(H=0.6mm)

BM55(H=0.5mm)

Increased Metal
Increased
SurfaceMounting Area

2. Small, High Extraction Forceand Clear Tactile Click

Hight extraction force and clear tactile clickby increasing simple lock area.

Small and high extraction force by increasing
metal surface in spite of decreasing the height.

Conventional Product(H=0.6mm)

BM55(H=0.5mm)

Increasing Simple Lock Ratio

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BM55 Series/0.3mm Pitch, 0.5mm Stacking Height, Ultra Compact Hybrid FPC-to-Board Connector Supporting 5A

3. Halogen- freeNo chlorine or bromine exceeding the standard
value is used in the connector.
* In accordance with IEC 61249- 2- 21
Br : 900ppm max. , Cl : 900ppm max. , Br+ Cl : 1500ppm max.

Applications
Devices that require low- profile, compact design such as wearable terminals ( Smartphones, Smartwatches, TWS) .

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

FPC-to-Board Connection

TWS

Used for the internal connection of small mobile devices such asTWS, Smartwatches and Smartphones.

Product Specifications
Rated Current

Power Contact : 5A
Signal Contact : 0.3A

Operating Temperature (Note 1)-55 to ＋ 85℃

Rated Voltage

30V AC/DC

Operating Humidity Range (Note 2)

90%RH Max.

Storage Temperature (Note 3)-10 to ＋ 60℃

Storage Humidity Range (Note 2)(Note 3)

90%RH Max.

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BM55 Series/0.3mm Pitch, 0.5mm Stacking Height, Ultra Compact Hybrid FPC-to-Board Connector Supporting 5A

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

Item

Specifications

Conditions

Contact Resistance

Signal Contact : 50m Ω Max.
Power Contact : 30m Ω Max.

Measured at 20mV AC, 1kHz, 1mA

Insulation Resistance

50M Ω Min.

Measured at 100V DC

Withstand Voltage

No Flashover or Breakdown

150V AC for 1 min.

Mating Durability

Contact Resistance : Signal Contact 50m Ω Max.
Power Contact 30m Ω Max.

10 timesVibration ResistanceNo electrical discontinuity for more than 1μ s.

Frequency 10 to 55Hz
single amplitude of 0.75mm
10 cycles in each of 3 axis directions for 5 minutes/
cycle

Moisture ResistanceContact Resistance : Signal Contact 50m Ω Max.
Power Contact 30m Ω Max.
Insulation Resistance : 25M Ω Min.

96 hours at temperature of 40 ± 2℃ andhumidity range from 90 to 95%RH

Temperature Cycles

Contact Resistance : Signal Contact 50m Ω Max.
Power Contact 30m Ω Max.
Insulation Resistance : 50M Ω Min.

-55℃ for 30min. → +85℃ for 30 min. for 5 Cycles(Tank transfer time: within 2 to 3 min.)

Solder Heat Resistance

No dissolution or resin meltingthat will affect performance.

Reflow : At recommended temperature profile
Hand Soldering : 350℃ within 3 sec.

Note 1 : Includes the temperature rise due to current flow.
Note 2 : Use without condensation.
Note 3 : Storage refers to long-term storage of unused items before they are mounted on the PCB.
Operating temperature and humidity range apply when the product is not powered after PCB
mounting and when temporarily stored during transportation.
Note 4 : Information contained in this catalog represents general requirements for this Series.
Contact us for the drawings and specifications for a specific part number shown.

Material / Finish
ProductComponent

HeaderReceptacle

Material

Finish

HousingLCP

Black

Signal Contact

Copper Alloy

Gold Plated

Power Contact

Copper Alloy

Gold Plated

Product Number Structure
Refer to the chart below when determining the product specifications from the product number.
Please select from the product numbers listed in this catalog when placing orders.
● Header/Receptacle

BM55 R 0.5 - 2 DS / 2 - 0.3 V（51)❶❷❸❹❶ Series NameBM55❷ Series No.
❸ Stacking Height

❺

❻❼❽

❾
❻ No. of Power2pos.

R❼ Contact Pitch

0.3mm

0.5 : 0.5mm❽ Terminal Design

V : Straight ＳＭＴ❹ Number of Signal

2❾ Plating(51)：Gold Plate Thickness 0.05μ m
Embossed Tape Packaging(30,000pcs per reel）❺ Connector TypeDP : Header
DS : Receptacle

Contacts

Contacts

Specifications
and Packaging

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BM55 Series/0.3mm Pitch, 0.5mm Stacking Height, Ultra Compact Hybrid FPC-to-Board Connector Supporting 5AHeader

0.41±0.1（1.22）
0.1±0.02

0.56±0.05

0.5±0.08

1.64±0.02

0.16±0.02

0.78±0.02● Recommended PCB Layout

0.64±0.02
0.44±0.02● Recommended Metal Mask Dimensions

0.16±0.01

1.64±0.01(Mask Thickness : 0.08mm)
0.78±0.01

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

1.44±0.1

2.02±0.1

0.64±0.01
0.44±0.01

Unit : mm

Part No.

HRS No.

BM55R0.5-2DP/2-0.3V(##)

CL0673-7801-0-##

Note 1 : Please order embossed tape packaged items by the reel.
Note 2 : This connector has no polarity.

5No. of Pos.

Purchase Unit

Signal Contact 2
Power Contact 2

30,000pcs
per reelBM55 Series/0.3mm Pitch, 0.5mm Stacking Height, Ultra Compact Hybrid FPC-to-Board Connector Supporting 5A

Receptacle

0.41±0.1（1.46）
0.38±0.05

0.1±0.02
0.2±0.05

0.46±0.05
0.54±0.08
1.42±0.08

0.3±0.02

1.7±0.02

0.36±0.02

0.16±0.02

0.24±0.02

1.2±0.02● Recommended PCB Layout

0.26±0.02

0.44±0.02

0.48±0.02
1.36±0.02
2.96±0.02● Recommended Metal Mask Dimensions

1.32±0.01

1.7±0.01

0.16±0.01

0.24±0.01

0.36±0.01(Mask Thickness : 0.08mm)

0.3±0.01

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

1.5±0.1

2.76±0.1

0.26±0.01

0.44±0.01

0.48±0.02
1.36±0.02
2.96±0.02

60.2±0.05

BM55 Series/0.3mm Pitch, 0.5mm Stacking Height, Ultra Compact Hybrid FPC-to-Board Connector Supporting 5A

Unit : mmPart No.

HRS No.

BM55R0.5-2DS/2-0.3V(##)

CL0673-7800-0-##

No. of Pos.

Purchase Unit

Signal Contact 2Power Contact 2

30,000pcs
per reel

Note 1 : Please order embossed tape packaged items by the reel.
Note 2 : This connector has no polarity.

Packaging Specification
IEC 60286- 3, JIS C 0806 CompliantHeader

4±0.1

B+00.2±0.15（2.15）

5.5±0.1.1

12±0.301.5

1.75±0.1

B-B （5：1）
2±0.1

4±0.1
φA

（0.1）

BA

0.51±0.15

A-A （5：1）（1.6）● Reel Dimensions

φ80±1

φ1.5 SPROCKET
HOLE FAR SIDE

φ380±2

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

● Embossed Tape Dimensions±13φ0.2

13.4±117.4±17

BM55 Series/0.3mm Pitch, 0.5mm Stacking Height, Ultra Compact Hybrid FPC-to-Board Connector Supporting 5AReceptacle● Embossed Tape Dimensions

B（0.13）A

0.54±0.15

BA
A-A （5：1）（1.62）● Reel Dimensions

φ80±1

φ380±2

φ1.5 SPROCKET
HOLE FAR SIDE

φ±130.2

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

（2.88）

5.5±0.1.1

0.2±0.15

12±0.34±0.1+001.5

φ2±0.11.75±0.1

B-B （5：1）
4±0.1

13.4±117.4±18

BM55 Series/0.3mm Pitch, 0.5mm Stacking Height, Ultra Compact Hybrid FPC-to-Board Connector Supporting 5A

Precautions

TEMPERATURE(℃)

250

Recommended
Temperature
Profile250℃
220℃

20060sec. Max.
180℃

150

【Conditions】
1. Peak Temperature : 250℃
2. Heating : 220℃ Min. for 60sec. Max.
3. Preheating : 150 to 180℃, 90 to 120sec.
4. Number of Reflow Cycles : 2 cycles Max.

150℃

90-120sec.

10050(Note １) Temperature referes to the surface temperature ofthe board near the connector lead.

NormalTemperatureSep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

050100150200250300
HEATING TIME (sec.)

Recommended
ManualSoldering
Conditions

Soldering iron temperature : 340 ± 10℃ , Soldering Time : Within 3sec.

Recommended
Metal Mask
Thickness andOpen Area to
PCB Pattern (AreaRatio)

Thickness : 0.08mm
Aperture Ratio : Header Side 100%, Receptacle Side

Cleaning

Cleaning is not recommended.
If you clean this product, please evaluate its performance before using it.
(Cleaning may impair the mating/unmating properties and lower resistance to environmental factors.)

Precautions

・Be careful when mating/unmating the connector when it is not mounted on thePCB as it may cause damage/deformation to contacts.
・Avoid supporting the PCB only with the connectors.
Support it by other means such as bolts, screws, posts, etc.
・Excessive prying during unmating/mating may result in damage.
・In the case of hand soldering, please do not apply any flux which could cause flux wicking.
・This product may have slight color differences due to production lot variability,
but this does not affect the performance.
・Please refer to the following page for handling precautions when inserting and removing.
・Because the product can disengage if dropped(or other impact), or by FPC routing, it is advised to secure the mated connectors tothe board with housings and cushioning materials.
・Do not use the connector in non-recommended conditions(i.e., rated current, rated voltage, PCB design and operating environment, etc.).
Such usage could lead to material outgassing, ignition, or short-circuit, etc.
Refer to the specifications and guidelines for board pattern dimensions,board cautions, and connector treatment.
Please contact Hirose if connector usage in conditions other than those described in thespecifications and the guidelines is being considered.

9Signal/Power Part 80%, Longitudinal PCB Side 100％

BM55 Series/0.3mm Pitch, 0.5mm Stacking Height, Ultra Compact Hybrid FPC-to-Board Connector Supporting 5A

Connector Handling Precautions【 Handling Warning When Mating the Connector】
Mating Disengagement Prevention
Please use cushioning.
The connector may come off due to impact such as dropping.
Cushioning should be large enough to cover the entire connector.

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

Cushioning【 Mating Method】
1. Locate the guide port and align.
This product has a guide rib on the header side to ensure proper engagement.
Align the connector so that it is in this position.

2. Once aligned, the connector engages.
You can feel the mated height of the connector lower.
Move the connector forward and backward,
left and right to find the guide port.
Move Slightly

The mated height lowers to theperfect mated condition.

3. In the engaged state, the connectors are parallel to each other,and the connectors cannot move forward, backward, left, or right. Complete mating from this state.
Move Slightly

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BM55 Series/0.3mm Pitch, 0.5mm Stacking Height, Ultra Compact Hybrid FPC-to-Board Connector Supporting 5A

4. Check that mating is completed.
If one side is floating, or if it is mated diagonally, remove and re- mate.

【 Handling When Removing Connector】

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

1. When removing the connector, it is preferable to pull it out in the upward direction
from the connector mounting surface. However, when removing the FPC from thecircuit board it becomes more difficult to remove it vertically with higher pin counts and thin FPCs.

OKOK

2. If difficult to remove, extract the connector diagonally in the direction of the pitch.
Note that removal from the widthwise side will apply a large load to the contacts.
When removing from the width direction, pull the end of the FPC in the upward direction.
( When a force is applied in the horizontal direction, a large load is applied to the contact. )

OKOK

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BM55 Series/0.3mm Pitch, 0.5mm Stacking Height, Ultra Compact Hybrid FPC-to-Board Connector Supporting 5A

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

3. If the FPC does not have sufficient rigidity, solder stripping or connector breakage may occur.
Please use it after checking the repetitive operation with a flexible board in advance,such as during a trial manufacture run ( Left diagram) .
Refrain from holding the corner of the flexible board and removing it diagonally as it will resultin a large load to the contacts ( Right diagram) .

While Taking into Consideration
Specifications mentioned in this catalog are reference values.
When considering to order or use this product, please confirm the Drawing and Product Specifications sheets.
Use an appropriate cable when using the connector in combination with cables.
If considering usage of a non- specified cable, please contact your sales representative.
If assembly process is done by jigs & tools which are not identified by Hirose, assurance will not be given.
If considering usage for below mentioned applications, please contact your sales representative.
In cases where the application will demand a high level of reliability, such as automotive, medical instruments, public
infrastructure, aerospace/ defense etc. Hirose must review before assurance of reliability can be given.

2-6-3,Nakagawa Chuoh,Tsuzuki-Ku,Yokohama-Shi 224-8540,JAPANhttps://www.hirose.com※ The contents of this catalog are current as of date of 9/ 2022. Contents are subject to change without notice for the purpose of improvements.

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