KP27F Series

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

0.5mm Pitch, 21mm Stacking Height,
125℃ Heat Resistant, Floating Board-to-Board Connector

Product Page
https://www.hirose.com/en/product/series/KP27F

Feb. 2024

KP27F Series / 0.5mm Pitch, 21mm Stacking Height, 125℃ Heat Resistant, Floating Board-to-Board Connector

Features
1. W
 ide ±0.8mm floating range
in the X and Y directions

Stacking Connection

Y Direction± 0.8mm

The floating part on the header side moves toabsorb misalignment. This design allows multiple
connectors to be mounted on a single board.

X Direction± 0.8mm

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

ReceptacleHeader

2. High‌
speed transmission(8Gbps)Floating Design

3. Shield‌and grounding provide
EMI protection

EMI Prevention

Reliable grounding by connecting the Shieldwith retention tab.

Retention Tab
Shield*e. g. 170pos. : Contact sequence during mating is : shield,
power supply contact, then signal contact.

Retention Tab*ImageShield Grounding Design

4. Wide‌
self-alignment range :±1.2mm in X and Y directions

Guide Post

The self-alignment guide posts on both ends ofthe connector ensure easy and smooth mating.

5. P ower contacts on each sideof the connector(3A/Contact × 4 Contacts)*

Header

The power contacts on the guide posts arespace-efficient and support up to 12A.

Power Contact

Receptacle

Hybrid Power & Signal Design with Large Guide
Posts on Both Ends

*Only 170pos. are available with power contacts.
60pos. may be considered upon request.

2KP27F Series / 0.5mm Pitch, 21mm Stacking Height, 125℃ Heat Resistant, Floating Board-to-Board Connector

Product Specifications
Rated Current(Note 1)
Rated Voltage

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

ItemsSignal

Power (Note 2)

Operating Temperature (Note 3)-55 to +125℃

SignalPower (Note 2)

Storage Temperature (Note 5)-10 to +60℃

0.5A

50V AC

3.0A

200V ACOperating Humidity Range (Note 4)
Storage Humidity Range (Note 4)(Note 5)

Relative Humidity 85% Max.

Specifications

Contact Resistance

Signal Contact : 50mΩ Max.
Power Contact : 30mΩ Max.

Insulation Resistance

Signal Contact : 100MΩ Min.
Power Contact : 1000MΩ Min.

Withstanding Voltage

No insulation breakdown.

Conditions
Measured at 100mA
Measured atSignal Contact : 100V DC
Power Contact : 250V DC
150V AC for 1 min.

Mating Durability

Contact Resistance : S ignal Contact : 70mΩ Max.
Power Contact : 40mΩ Max.

Vibration ResistanceNo electrical discontinuity of 1µs or more

Shock ResistanceNo electrical discontinuity of 1µs or more

Humidity ResistanceContact Resistance : Signal‌Contact : 70mΩ Max.
Power Contact : 40mΩ Max.
Insulation Resistance : Signal Contact : 100MΩ Min.
Power Contact : 1000MΩ Min.

Temperature CycleRelative Humidity 85% Max.

100 times
Frequency 10 to 55Hz, half amplitude 0.75mm,
10 cycles in each of the 3-axis directions
each for 5 minutes per cycle

Contact Resistance : Signal‌Contact : 70mΩ Max.
Power Contact : 40mΩ Max.
Insulation Resistance : Signal Contact : 100MΩ Min.
Power Contact : 1000MΩ Min.

Acceleration of 490m/s2, 11ms duration,
3times for 3 both axial directions

Left for 96 hours at temperature of 40℃ andhumidity range from 90 to 95%
Temperature : -55 → +125℃
Time : 30 → 30 minutesfor 5 cycles(Relocation time to chamber : within 2 to 3 minutes)

Note 1 : When passing the current through all of the contacts, use 70% of the current rating.
Note 2 : Only 170pos. are available with power contacts. 60pos. may be considered upon request.
Note 3 : Includes the temperature rise due to current flow.
Note 4 : Use without condensation.
Note 5 : ‌Storage refers to the long-term storage condition of unused products prior to PCB mounting.
The operating temperature and humidity range are applicable to the non-energized state after PCB mounting.

3KP27F Series / 0.5mm Pitch, 21mm Stacking Height, 125℃ Heat Resistant, Floating Board-to-Board Connector

Materials / Finish
ProductComponent

Materials

Color / Finish

UL Standard

ShieldCopper Alloy

Nickel Plated-Signal Contact

Copper Alloy

Power Contact (Note 2)

Copper Alloy

Retention Tab

Copper Alloy

Insulator

HeaderReceptacle

LCP (Note 1)

Black

Contact Area / Lead Area :Gold Plated over Nickel Underplating
Contact Area/Lead Area :Gold Plated over Nickel Underplating

Tin Plated over Nickel Underplating

UL94V-0--Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

Note 1 : This product satisfies halogen free requirements defined as 900ppm maximum chlorine,900ppm maximum bromine, and 1500ppm maximum total of chlorine and bromine.
Note 2 : Only 170pos. are available with power contacts. 60pos. may be considered upon request.

Product Number Structure

Refer to the chart below when determining the product specifications from the product number.
Please select from the product numbers listed in this catalog when placing orders.

Header / Receptacle

KP27F - 170 P / 4112Series Name

2 No. of Pos. :Signal Contact

3 Connector Type
4No. of Pos. :Power Contact (Note)

34- 0.5 SV 21 (800)5678KP27F

5Contact Pitch

0.5mm

60, 170pos.

6Product TypeSV : SMT Straight Mounting TypeP : Header
S : Receptacle

7Stacking Height

21mm

Blank : None
4 : 4pos.

8Specification

Tray Packaging,
Compatible with Molded Caps

Note : Only 170pos. are available with power contacts. 60pos. may be considered upon request.

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KP27F Series / 0.5mm Pitch, 21mm Stacking Height, 125℃ Heat Resistant, Floating Board-to-Board Connector

High Speed Transmission (KP27F : h=21mm)● Pin Assignment

The following pin arrangement is recommended to match the 100Ω differential impedance and to contain cross-talk.
●Signal pin●Ground pin

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

●●● ‌Differential Impedance 87.5ps Rise Time
(20 to 80%)

Diff pair● ‌Insertion Loss

Meets the criterion of 100±15Ω at the rise timeof 87.5ps (20 to 80%).

● Return Loss

● Near End Cross-Talk (NEXT)

5KP27F Series / 0.5mm Pitch, 21mm Stacking Height, 125℃ Heat Resistant, Floating Board-to-Board Connector

Connector Dimensions

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

60pos. Header

Recommended Land Pattern(PCB Thickness : t=1.6mm)

Part No.
KP27F-60P-0.5SV21(800)

No. of Pos.

HRS No.

Signal Contact

Power Contact

60-CL0480-0780-0-00

Note : Only 170pos. are available with power contacts. 60pos. may be considered upon request.

6Purchase Unit
400pcs per tray

KP27F Series / 0.5mm Pitch, 21mm Stacking Height, 125℃ Heat Resistant, Floating Board-to-Board Connector

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

60pos. Receptacle

Recommended Land Pattern(PCB Thickness : t=1.6mm)

Part No.
KP27F-60S-0.5SV(800)

No. of Pos.

HRS No.

Signal Contact

Power Contact

60-CL0480-0781-0-00

Note : Only 170pos. are available with power contacts. 60pos. may be considered upon request.

7Purchase Unit
750pcs per tray

KP27F Series / 0.5mm Pitch, 21mm Stacking Height, 125℃ Heat Resistant, Floating Board-to-Board Connector

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

170pos. Header

Recommended Land Pattern(PCB Thickness : t=1.6mm)

Part No.
KP27F-170P/4-0.5SV21(800)

No. of Pos.

HRS No.
CL0480-0782-0-00

8Signal Contact

Power Contact

1704Purchase Unit
240pcs per tray

KP27F Series / 0.5mm Pitch, 21mm Stacking Height, 125℃ Heat Resistant, Floating Board-to-Board Connector

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

170pos. Receptacle

Recommended Land Pattern(PCB Thickness : t=1.6mm)

Part No.
KP27F-170S/4-0.5SV(800)

No. of Pos.

HRS No.
CL0480-0783-0-00

9Signal Contact

Power Contact

170

4Purchase Unit
450pcs per tray

KP27F Series / 0.5mm Pitch, 21mm Stacking Height, 125℃ Heat Resistant, Floating Board-to-Board Connector

Tray Packaging Specifications*Compatible with molded caps. Please remove the suction cap after mounting.

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

60pos. Header : KP27F-60P-0.5SV21(800)

60pos. Receptacle : KP27F-60S-0.5SV(800)10KP27F Series / 0.5mm Pitch, 21mm Stacking Height, 125℃ Heat Resistant, Floating Board-to-Board Connector*Compatible with molded caps. Please remove the suction cap after mounting.

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

170pos. Header : KP27F-170P/4-0.5SV21(800)170pos. Receptacle : KP27F-170S/4-0.5SV(800)11KP27F Series / 0.5mm Pitch, 21mm Stacking Height, 125℃ Heat Resistant, Floating Board-to-Board Connector

Storing KP27F Series

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

There are two types of trays (A and B) for the KP27F Series.
These have been designed to stack in alternating order (A-B-A-B. . .) for shipping and storage.

If tray A is stacked on top of another tray A, or if tray B is stacked on top of another tray B,
the trays will put a load on the connectors, potentially causing connector breakage or deformation.

Tray B

Tray A

Tray A

Tray A

When stacked correctly, the outer structure of the trays will
prevent any load from being placed on the connectors below.

When stacked incorrectly, the outer structure of the trays will
not function, resulting in a load added to the connector.

When storing the KP27F Series, please ensure that the trays are stacked in alternating order.

Recommended Temperature Profile＜Applicable Conditions＞
Material
Solder Composition
Flux Content
Metal Mask Thickness
Number of Reflow Time: Glass epoxy: Sn-3Ag-0.5Cu: 11wt%: 0.12mm, 0.15ｍｍ: 1 time Max.

*The temperature profile is for the above conditions.
The temperature profile may vary depending on the type ofcream solder, the manufacturer, the board size and otherconditions such as mounting materials.
Please check the mounting status before use.

12KP27F Series / 0.5mm Pitch, 21mm Stacking Height, 125℃ Heat Resistant, Floating Board-to-Board Connector

Usage Precautions● About the Specified Dimension Between PCBs

Use within the specified dimensions between PCBs below.

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

21 ± 0.3mmReceptacle● Securing PCBs

HeaderPlease take measures to secure the PCB other than using connectors.
Using only the connectors to support the board may result in a load to the connector that results in damage
or contact failure.
● Cautions in Mating Operations

This connector is designed to prevent reverse insertion.
The connector could be damaged if excessive force is exerted when mating.
Avoid excessive force when mating. Mate only after confirming the following connector properties.
(chamfer of the external face).

Chamfer

HeaderChamfer

Receptacle

Chamfer

The self-alignment range is ±1.2mm in both the X and Y directions.
After beginning to mate the connectors within the misalignment range, proceed by mating in a straight line
without forcing the connector.

± 1.2mm

X Direction (Longitudinal Direction)± 1.2mm

Y Direction (Transverse Direction)

Note : If misalignment axis is inevitable in all directions from the beginning to the end of the mating operation,please use within the tolerable range. ( ± 0.8mm in both the X and Y directions.)

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KP27F Series / 0.5mm Pitch, 21mm Stacking Height, 125℃ Heat Resistant, Floating Board-to-Board Connector

When mating/un-mating, it is strongly recommended to insert or remove in a straight line.
If not possible due to board layout, insertion and removal should be carried out within the following
inclination angle.
Moreover, during the mating operation, be sure to proceed without forcibly applying a load to the connector.
Allow the connector to be placed straight when the mating operation is completed.
X Direction (Longitudinal Direction) ⇒ for 60pos. : within 2°, for 170pos. : within 10°
Y Direction (Transverse Direction) ⇒ within 0.5°

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

±2° , ±±0.5°

10°

X Direction (Longitudinal Direction)

Note : Rotating insert/extract operations are not recommended. Damage to the connector could occur.

Y Direction (Transverse Direction)● Permissible Misalignment in the Mated State (Floating Amount)

This connector is designed to float when mated.
The permissible misalignment between PCBs in the mated state is ±0.8mm in both the X and Y directions.
However, this connector is not suitable for misalignment absorption when the misalignment amount isconstantly changing due to vibration, etc. Be sure to secure PCBs after mating.
Additionally, the number of repetitive floating operations shall be according to the number of connector
insertion/withdrawal cycles. (100 times Max.)± 0.8mm± 0.8mm

Floating SideX Direction (Longitudinal Direction)

Y Direction (Transverse Direction)

While Taking into ConsiderationSpecifications mentioned in this catalog are reference values.
When considering to order or use this product, please review the Drawing and Product Specifications sheets.
Use an appropriate cable when using the connector in combination with cables.
If considering usage of a non- specified cable, please contact your sales representative.
If assembly process is done by jigs & tools which are not identified by Hirose, the warranty of the product may be affected.
If considering usage for below mentioned applications, please contact your sales representative.
In cases where the application will demand a high level of reliability, such as automotive, medical instruments, publicinfrastructure, aerospace/ defense etc. Hirose must review before assurance of reliability can be given.

2-6-3,Nakagawa Chuoh,Tsuzuki-Ku,Yokohama-Shi 224-8540,JAPANhttps://www.hirose.com/※ The contents of this catalog are current as of date of 02/ 2024. Contents are subject to change without notice for the purpose of improvements.
※ The HRS logo and " HIROSE" are trademarks of HIROSE ELECTRIC CO. , LTD.

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