㻢◒⢏ຍᕤᏛ఍ㄅ㻌䕻 ≉㞟㻌 ◒⢏ຍᕤᏛ఍ᢏ⾡㈹䛾䛭䛾ᚋ㻌 䕻㻌 㻌໬ྜ≀༙ᑟయ㻔㻿㼕㻯㻕䜴䜵䝝䛾㧗⬟⋡䠈㧗ရ఩ษ᩿ຍᕤ䝥䝻䝉䝇㻌䛚䜘䜃ᑓ⏝ᕤල䛾㛤Ⓨ䛾䛭䛾ᚋ㻌Progress in compound semiconductor cutting after publication of the awarded paper㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌㻌໭ᕷ㻌 ඘䠆䠈ὸ஭⩏அ䠆䠈⚟す฼ኵ䠆㻌
Mitsuru KITAICHI㸪Yoshiyuki ASAI and Toshio FUKUNISHIKey words : scribe, break, cutting method, single crystal wafer, SiC, compound semiconductor, brittle materials㻌㻌㻌䠎䠊㛤Ⓨ䛾ቨ䠍䠊㛤Ⓨ⤒⦋㻌 㻌ᘢ♫䛿 1935 ᖺ๰ᴗ䠈䜺䝷䝇ษ᩿⏝ᕤල䛾〇㐀㈍኎䜢㛤ጞᙜ᫬䛾䜺䝷䝇ᇶᯈ⏝ศ᩿⿦⨨䛸䝇䜽䝷䜲䝡䞁䜾䝩䜲䞊䝹䜢౑䛧䛯䠊1977 ᖺ䛻䛿ୡ⏺ึ䛸䛺䜛 LCD(Liquid Crystal Display)⏝䛧䛶 SiC 䜴䜵䝝䛾ษ᩿䜢ヨ䛧䛯䛸䛣䜝䠈ᐜ᫆䛷䛿䛺䛔䛣䛸䛜ᇶᯈ⏝ศ᩿⿦⨨䛾㈍኎䜢㛤ጞ䛧䛶௨᮶䠈䜺䝷䝇ᇶᯈ䛾ษ᩿䛩䛠䛻ุ᫂䛧䛯䠊ᚑ᮶䛾䝇䜽䝷䜲䝡䞁䜾䝩䜲䞊䝹䛷䛿ᦶ⪖䛜⃭䛻䛿ᘢ♫䛾䝇䜽䝷䜲䝡䞁䜾䝩䜲䞊䝹䜔⿦⨨䛜ᗈ䛟᥇⏝䛥䜜䛶䛝䛧䛟䠈䛸䛶䜒ᐇ⏝䛻⪏䛘䜙䜜䛺䛔≧ែ䛰䛳䛯䛾䛰䠊SiC 䛻ᑐ䛩䛯䠊䜺䝷䝇䛾ཌ䜏䜔✀㢮䠈ษ᩿䛩䜛ᙧ≧䛺䛹䛻䜘䛳䛶ษ᩿᮲䜛䝇䜽䝷䜲䝡䞁䜾䝩䜲䞊䝹䛾⪏ᦶ⪖䛜㊊䜚䛺䛔䛣䛸䛿䛩䛠䛻ุ௳䜔䝇䜽䝷䜲䝡䞁䜾䝩䜲䞊䝹䛾ရ✀䜢ኚ䛘䜛ᚲせ䛜䛒䜚䠈᪂䛯᫂䛧䛯䠊ᙜ᫬䠈䜺䝷䝇ษ᩿⏝䛸䛧䛶ᘢ♫䛾ᡤᣢ䛧䛶䛔䜛ᮦᩱ䛷䛺ᇶᯈ䛾Ⓩሙ䛻ྜ䜟䛫䛶ษ᩿᪉ἲ䜢㛤Ⓨ䛧䛶䛝䛯䠊䛣䜜䜎䛷䛿ᑐᛂ䛷䛝䛺䛔䛣䛸䛜䜟䛛䛳䛯䠊䛭䛣䛷䝇䜽䝷䜲䝡䞁䜾䝩䜲䞊䝹䝇䜽䝷䜲䝡䞁䜾䝩䜲䞊䝹䛾䝷䜲䞁䝘䝑䝥䜢ቑ䜔䛧䠈ᢏ⾡ຊ䜢ྥ䛾ᮦᩱ㑅ᐃ䜢㛤ጞ䛧䠈㧗◳ᗘ䛾ᮦᩱೃ⿵䜢ぢฟ䛧䛯䛜䠈ᙜ᫬ୖ䛥䛫䠈㢳ᐈ䛾ཝ䛧䛔せồ䜢ᐇ⌧䛧䛶䛝䛯䠊䝇䜽䝷䜲䝡䞁䜾䝩䜲䛾ຍᕤᢏ⾡䛷䛿䝇䜽䝷䜲䝡䞁䜾䝩䜲䞊䝹ᙧ≧䛻䛩䜛䛣䛸䛜ᴟ䜑䞊䝹䛾୍౛䜢ᅗ  䛻♧䛩 1)䠊

䛶ᅔ㞴䛷䛒䛳䛯䠊ᮦᩱ㑅ᐃ䛾ḟ䛿䝇䜽䝷䜲䝡䞁䜾䝩䜲䞊䝹䛻䛩䜛䛯䜑䛾ຍᕤᢏ⾡䛾㛤Ⓨ䛻╔ᡭ䛧䛯䠊ᙜ᫬䛾ᢏ⾡䛷䛿ᚑ᮶ᮦᩱ䛾 100 ಸ㏆䛔ຍᕤ᫬㛫䛜䛛䛛䛳䛯䛖䛘䠈Ṍ␃䜎䜚䜒ᝏ䛔≧ἣ䛰䛳䛯䠊ຍᕤ᫬㛫䛿䛛䛛䛳䛯䛜ヨస䛧䛶䜏䜛䛸 SiC 䜴䜵䝝ษ᩿᫬䛾⪏ᦶ⪖ᛶ䛻ぢ㎸䜏䛜䛒䛳䛯䠊䛣䛣䛛䜙䛿᫬㛫䜢䛛䛡䛶ษ᩿䝔䝇䝖⏝䛾䝇䜽䝷䜲䝡䞁䜾䝩䜲䞊䝹䜢ヨస䛧䛺䛜䜙ຍᕤᢏ⾡䛾㛤Ⓨ䜢㐍䜑䜛䛣䛸䛸䛺䛳䛯䠊䜎䛯ヨసရ䛷 SiC 䜴䜵䝝ษ᩿䝔䝇䝖䜢㐍䜑䜛䛺䛛䛷䠈ᙜ᫬䛾ᐃᶵ䜔ほᐹᶵჾ䛷䛿ᚲせ䛸䛩䜛ᚤᑠ㡿ᇦ䛾ᦶ⪖≧ែ䜔㧗⢭ᗘษ᩿䛻ᚲせ䛺䝇䜽䝷䜲䝡䞁䜾䝩䜲䞊䝹䛾ຍᕤ⢭ᗘ䛜ホ౯䛧䛝䜜䛺䛔䛣䛸䜒ุ᫂䛧䠈ᅗ 1㻌 䝇䜽䝷䜲䝡䞁䜾䝩䜲䞊䝹䛾୍౛⊂⮬䛾ᐃᶵ䜔ほᐹᶵჾ䛾ᑟධ䛰䛡䛷䛺䛟䠈ᐃᢏ⾡䜔ほᐹᢏ⾡䛾ྥୖ䛻䜒ດ䜑䛯䠊ຍᕤᢏ⾡䠈ほᐹᢏ⾡䠈ᐃᢏ⾡䠈ศᯒᢏ⾡䜢᪥䚻ྥୖ䛥୍᪉䠈䜺䝷䝇䛾ษ᩿௨እ䛻᪂䛯䛺䝡䝆䝛䝇䛾㍈䜢స䜛䛣䛸䛫䜛䛣䛸䛷䜘䛖䜔䛟 SiC 䜴䜵䝝ษ᩿⏝䛾᪂䛧䛔䝇䜽䝷䜲䝡䞁䜾䝩䛜䛷䛝䛺䛔䛛䠈♫఍䛻㈉⊩䛷䛝䜛ศ㔝䛜௚䛻䛺䛔䛛䜢ᶍ⣴䛩䜲䞊䝹䛾〇స䛻䜑䛹䛜❧䛳䛯䠊⤖ᯝ䛸䛧䛶ᑍἲ䠈ᙧ≧䛿ᚑ๓䜛䛺䛛䛷䠈༙ᑟయศ㔝䛷䛿䠈ᶵ⬟ᛶྥୖ䛾䛯䜑䠈ᇶᯈᮦᩱ䛜䛾䝇䜽䝷䜲䝡䞁䜾䝩䜲䞊䝹䛻㏆䛔䛜䠈ຍᕤ᪉ἲ䛿඲䛟㐪䛖䜒䛾Si 䛛䜙 SiC 䜈䛾኱䛝䛺ኚ໬䛜㉳䛝䛴䛴䛒䛳䛯䠊Si 䛻ẚ䜉䛶㧗䛸䛺䛳䛯䠊◳ᗘᮦᩱ䛷䛒䜛 SiC 䛻ኚ䜟䜜䜀䠈䝎䜲䝅䞁䜾ᕤ⛬䛻䛚䛔䛶ᚑ᮶ᢏ⾡䛾䝤䝺䞊䝗䝎䜲䝅䞁䜾䛷䛿䠈ษ᩿ຍᕤ䛜኱䛝䛺ㄢ㢟䛸䛺䜛䛣䛸䛜ண᝿䛥䜜䠈䝎䜲䝅䞁䜾ᕤ⛬䛷䛾኱䛝䛺ᨵၿ䛜ᚲせ䛷䠏䠊ษ᩿䝔䝇䝖䝇䜽䝷䜲䝡䞁䜾䝩䜲䞊䝹䜢Ṍ␃䜎䜚䜘䛟Ᏻᐃ䛧䛶〇స䛷䛝䜛䜘䛖䛻䛺䜚㢳ᐈ䛛䜙䛾 SiC 䜴䜵䝝ษ᩿䝔䝇䝖䛻౑⏝䛥䜜䜛䜘䛖䛻䛺䛒䜛䛣䛸䛿᫂䜙䛛䛷䛒䛳䛯䠊䛭䛾ㄢ㢟ゎỴ䛻ᘢ♫䛷ᇵ䛳䛯䜺䝷䝇ษ᩿ᢏ⾡䛜ᛂ⏝䛷䛝䛳䛯䠊䝔䝇䝖䛾㝿䛻ฟ䛶䛟䜛ㄢ㢟䜢⥅⥆ⓗ䛻ゎỴ䠈ᨵၿ䛧䛺䛜䜙ษ᩿⿦⨨䛾㛤Ⓨ䜒㐍䜑䛯䠊䜴䜵䝝䛾ษ᩿䛿䜺䝷䝇䛾ษ᩿䛸䛺䛔䛛䛸⪃䛘䛯䛾䛜㛤Ⓨ䛾Ⓨ➃䛷䛒䜛䠊䛿㐪䛳䛯ᶵᵓ䛜ᚲせ䛰䛳䛯䛛䜙䛷䛒䜛䠊䜎䛯䠈ᅗ  䛾䜘䛖䛺ษ᩿⿦⨨䛻䝇䜽䝷䜲䝡䞁䜾䝩䜲䞊䝹䜢ྲྀ䜚௜䛡䜛㝿䛻ᚲせ䛸䛺䜛ᑓ⏝ᕤල䝩䝹䝎䞊䜒᪂䛯䛻㛤Ⓨ䛧䛯 2)䠊
* ୕ᫍ䝎䜲䝲䝰䞁䝗ᕤᴗᰴᘧ఍♫䠖䛈566-0034 ኱㜰ᗓᦤὠᕷ㤶㟢ᅬ32-12䚾Ꮫ఍ཷ௜᪥䠖2023ᖺ10᭶㻌 5᪥䚿㻢㻌 䝇䜽䝷䜲䝡䞁䜾䝩䜲䞊䝹䠈ᑓ⏝ᕤල䝩䝹䝎䞊䠈ษ᩿⿦⨨䠈඲䛶㻶㼛㼡㼞㼚㼍㼘㻌㼛㼒㻌㼠㼔㼑㻌㻶㼍㼜㼍㼚㻌㻿㼛㼏㼕㼑㼠㼥㻌㼒㼛㼞㻌㻭㼎㼞㼍㼟㼕㼢㼑㻌㼀㼑㼏㼔㼚㼛㼘㼛㼓㼥㻌㻌㼂㼛㼘㻚㻢㻤㻌㻌㻺㼛㻚㻝㻌㻌㻞㻜㻞㻠㻌㻌㻶㻭㻺㻚㻌㻌㻢㻙㻣◒⢏ຍᕤᏛ఍ㄅ㻣䠐䠊᪂䛯䛺ㄢ㢟㻌䜺䝷䝇䛾䜘䛖䛺䜰䝰䝹䝣䜯䝇ᮦᩱ䛾ษ᩿䛻㛵䛧䛶䛿㇏ᐩ䛺▱ぢ䛜䛒䜛䛜䠈୍᪉䛷 SiC 䛾䜘䛖䛺⤖ᬗᮦᩱ䛾ษ᩿䛻䛴䛔䛶䛿䜎䛰ᢕᥱ䛧䛝䜜䛶䛔䛺䛔Ⅼ䛜䛒䜛䠊ษ᩿ရ㉁ᢕᥱ䛾䛯䜑䛻ศᯒᢏ⾡䜢ྥୖ䛥䛫䛶䛝䛯䛜䠈㢳ᐈ䛛䜙ຮᙉ䛥䛫䛶䛔䛯䛰䛟䛣䛸䜒ከ䚻䛒䜛䠊༙ᑟయศ㔝䛻䛚䛡䜛♫఍ᐇ⿦䛻䛿䛥䜙䛺䜛ᢏᑓ⏝ᕤල䝩䝹䝎䞊⾡䛾ྥୖ䛜ᚲ㡲䛷䛒䜛䠊䜎䛯ษ᩿䛾䝯䜹䝙䝈䝮䛾䝅䝭䝳䝺䞊䝅䝵䞁ゎᯒ䜒㐍䜑䛶䛚䜚䠈㢳ᐈ䛭䜜䛮䜜䛾䜴䜵䝝䛻᭱㐺䛺ษ᩿

ᅗ 2㻌 ᑓ⏝ᕤල䝩䝹䝎䞊䛾እほᅗ䛸ᣑ኱ᅗ᪉ἲ䛾㑅ᐃ䜔䝇䜽䝷䜲䝡䞁䜾䝩䜲䞊䝹䛾䝷䜲䞁䝘䝑䝥ᣑ඘䛻཯ᫎ䛥䛫䛶䛔䛟䛣䛸䜢⪃䛘䛶䛔䜛䠊㻌䜢୍᪂䛩䜛䛣䛸䛷 SiC 䜴䜵䝝䛾ษ᩿䛜ྍ⬟䛸䛺䛳䛯䠊SiC 䜴䜵㻌 䜎䛯䠈䝇䜽䝷䜲䝡䞁䜾䝩䜲䞊䝹䛾⏕⏘䛾䛯䜑䛻ᑟධ䛧䛯ຍᕤ䝝䛾ษ᩿⤖ᯝ䜢ᅗ  䛻♧䛩䠊䜺䝷䝇ษ᩿⿦⨨䛸䛿␗䛺䜛䠈᪂ᶵ䜔᳨ᰝᶵ䛿ከ䛟䠈ຍᕤ᫬㛫䛾▷⦰䛺䛹⏕⏘䝷䜲䞁䛻䛿ᨵၿ

䛯䛻㛤Ⓨ䛧䛯༙ᑟయ䜴䜵䝝⢭ᐦษ᩿⿦⨨ 3)䜢ᅗ  䛻♧䛩䠊䛧䛺䛡䜜䜀䛺䜙䛺䛔ㄢ㢟䛜ṧ䛥䜜䛶䛔䜛䠊᪥䚻ᨵၿ䛻ྲྀ䜚⤌䜎䛯䠈SiC 䜴䜵䝝䜢ษ᩿ྍ⬟䛺䛰䛡䛷䛺䛟䠈᭱㐺໬䛥䜜䛯䝇䜏䛺䛜䜙㔞⏘యไ䛾ᵓ⠏䛻ົ䜑䛶䛔䛝䛯䛔䠊㻌㻌䜽䝷䜲䝡䞁䜾䝩䜲䞊䝹䠈ᑓ⏝ᕤල䝩䝹䝎䞊䠈ษ᩿⿦⨨䜢⤌䜏ྜ䜟䛫䜛䛣䛸䛷㢳ᐈ䛾せồ䛩䜛㧗⢭ᗘ䛺ษ᩿䜢㐩ᡂ䛩䜛䛣䛸䠑䠊௒ᚋ䛾ᒎ㛤㻌
SiC ௨እ䛾໬ྜ≀༙ᑟయ䜈䛾ᒎ㛤䛸䛧䛶䠈GaN䠈GaAs 䛺䛹䛜䛷䛝䛯䠊㧗࿘Ἴ䝕䝞䜲䝇⏝ᮦᩱ䜈䛾ᛂ⏝䜒ど㔝䛻ධ䜜䛶䛔䜛䠊๓㏙䛧䛯ᮦᩱ௨እ䛻䜒䠈ᘬ䛝⥆䛝䝇䜽䝷䜲䝤㻒䝤䝺䜲䜽䛾㐺ྜ䛩䜛ศ㔝䛾ᶍ⣴䛸䠈㛤Ⓨ䛷ᇵ䛳䛯ຍᕤᢏ⾡䠈ศᯒᢏ⾡䜢ά䛛䛫䜛ሙ䛾᥈⣴䜢⥆䛡䛶䛔䛝䛯䛔䠊⮬♫䛰䛡䛷ゎỴ䛷䛝䛺䛔ㄢ㢟䛺䛹䛻䛴䛔䛶䛿䠈኱Ꮫ䜔௻ᴗ䛸✚ᴟⓗ䛻༠ᴗ䛧䛶䛔䛟䛣䛸䜒᳨ウ䛧䛶䛔䜛䠊㻌㻌䠒䠊᭱ᚋ䛻㻌◒⢏ຍᕤᏛ఍ᢏ⾡㈹䜢䛔䛯䛰䛔䛯䛣䛸䛷䠈㢳ᐈ䛸䛾ᡴ䛱ྜ䜟䛫䜔ၟㄯ᫬䛻ᢏ⾡䜢䜰䝢䞊䝹䛧䜔䛩䛟䛺䜚䠈䜎䛯䠈ಙ⏝䜢ᚓ䜛䛣䛸䛻䛴䛺䛜䛳䛶䛔䜛䠊㢳ᐈ䛾ኌ䛸䛧䛶䠈䛂䛧䛳䛛䜚◊✲䛥䜜
ᅗ 3㻌 4 䜲䞁䝏 SiC 䜴䜵䝝ษ᩿⤖ᯝ

䛶㈹䜢ྲྀ䜙䜜䛯䛸䛔䛖䛣䛸䛿ᢏ⾡ⓗ䛻䜒ಙ⏝ᗘ䛜㧗䛟䛺䜛䛖䛘䠈♫ෆ䛾⿦⨨ᑟධ䛾ㄝᚓᮦᩱ䛻౑⏝䛷䛝䜛䛃䠈䛂䛣䛾䜘䛖䛺Ⓨ⾲䜢䛥䜜䛶䛔䜛䛸䛔䛖䛣䛸䛷䛒䜜䜀䠈ᢏ⾡☜❧䛥䜜䛶䛔䜛䛣䛸䛜ఛ䛘䜛䛃䠈䛸䛔䛳䛯ホ౯䜢ᚓ䛶䛔䜛䠊㻌㻌 㛤Ⓨ䛻ᦠ䜟䛳䛯⪅䛻䛸䛳䛶䛿ᢏ⾡䜢ホ౯䛔䛯䛰䛡䛯䛣䛸䛷䝰䝏䝧䞊䝅䝵䞁䛜ྥୖ䛧䠈䛥䜙䛺䜛㛤Ⓨ䛻ບ䜐䛣䛸䛜䛷䛝䛶䛔䜛䛸ឤ䛨䜛䠊㢳ᐈ䛸┤䛻᥋䛩䜛Ⴀᴗᢸᙜ⪅䜔ᢏ⾡⪅䛻䛸䛳䛶䛿䜘䜚୍ᒙ⮬ಙ䜢䜒䛳䛶⿦⨨䜔䝒䞊䝹䜢䛤⤂௓䛷䛝䜛䜘䛖䛻䛺䛳䛯䠊㻌㻌 ◒⢏ຍᕤᏛ఍ᢏ⾡㈹䛾ᑂᰝ㛵ಀ⪅䛾᪉䚻䠈௒ᅇཷ㈹ᚋ䛾ືྥ䛻䛴䛔䛶ᨵ䜑䛶ᢞ✏䛾ᶵ఍䜢୚䛘䛶䛟䛰䛥䛳䛯᪉䚻䠈䜎㻌(a) ⿦⨨እほ䛯᭱ᚋ䜎䛷┠䜢㏻䛧䛶䛟䛰䛥䛳䛯᪉䚻䛻䛚♩⏦䛧ୖ䛢䜛䠊㻌㻌㻌㻌䠓䠊ཧ⪃ᩥ⊩㻌㻌1) ὸ஭⩏அ䠈໭ᕷ඘䠖䝇䜽䝷䜲䝡䞁䜾䝩䜲䞊䝹䜢⏝䛔䛯ⷧᯈ䜺䝷䝇䛾๭᩿ຍᕤ䠈2021 ᖺᗘ◒⢏ຍᕤᏛ఍Ꮫ⾡ㅮ₇఍ㄽᩥ㞟䠈(2021)䠈108.
2) ໭ᕷ඘䠈ὸ஭⩏அ䠈⚟す฼ኵ䠈䠖໬ྜ≀༙ᑟయ(SiC)䜴䜵䝝䛾㧗⬟⋡䠈㧗ရ఩ษ᩿ຍᕤ䝥䝻䝉䝇䛚䜘䜃ᑓ⏝ᕤල䛾㛤Ⓨ䠈◒⢏ຍᕤᏛ఍ㄅ, 66䠈
2(2022)䠈58.
3) ୕ᫍ䝎䜲䝲䝰䞁䝗ᕤᴗ䞞䠈༙ᑟయ䜴䜵䝝⢭ᐦษ᩿⿦⨨ DIALOGIC® 䠖
https://www.mitsuboshidiamond.com/product/equipment/dialogic/㻌㻌㻌㻌㻌㻌㻌(b) ษ᩿᫬እほ㻌ᅗ 4㻌 ༙ᑟయ䜴䜵䝝⢭ᐦษ᩿⿦⨨㻶㼛㼡㼞㼚㼍㼘㻌㼛㼒㻌㼠㼔㼑㻌㻶㼍㼜㼍㼚㻌㻿㼛㼏㼕㼑㼠㼥㻌㼒㼛㼞㻌㻭㼎㼞㼍㼟㼕㼢㼑㻌㼀㼑㼏㼔㼚㼛㼘㼛㼓㼥㻌㻌㼂㼛㼘㻚㻢㻤㻌㻌㻺㼛㻚㻝㻌㻌㻞㻜㻞㻠㻌㻌㻶㻭㻺㻚㻌㻌㻢㻙㻣㻣