Wednesday, April 17
Room A
9:30

11:10

WA1: Chiplet-1
Chairs: K. Hasegawa, JSR, K. Okamoto,
Nippon Institute of Technology

Room B
WB1: DPS Session
Chair: Y. Morikawa, ULVAC

Room D

Room E

WD1: Emerging Technology
Chairs: Y.Y. Lim, AIST, K. Takeuchi, Tohoku
University

WE1: Power Electronics-1
Chairs: Y. Ikeda, Fuji Electric, H. Sakamoto,
Huawei Technologies Japan

WD2: DMR-E
Chairs: M. Aoyagi, Kumamoto University, N.
Fukazawa, DIC

WE2: Power Electronics-2
Chairs: H. Sakamoto, Huawei Technologies
Japan, K. Takeuchi, Tohoku University

WB1-1 <Session Invited> Challenges of Dry
WA1-1 <Session Invited> Advanced System Etching for Logic Devices
WC1-1 The Plating Technology for Press-Fit WD1-1 Manufacturing of PEEK-PDMS
WE1-1 Solder Joint Lifetime Characterization
Masaru Izawa, Hitachi High-Tech / Japan
Integration and Packaging (ASIP) at Purdue
Pins Using Heat-Resistant IMC Joint Material
Composite Materials for Intervertebral Discof a SiC Power MOSFET Module Under Power
University and the US CHIPS Act
Implants
Cycling
WB1-2 <Session Invited> Development of Hiroaki Ikeda, Shigenobu Sekine, Napra / Japan
Ganesh Subbarayan, Atalla Institute for Advanced the Wafﬂe Wafer for Bumpless Via-Last Chip- WC1-2 Quantitative Elemental
Heng-ching Mie, Yu-chen Liu, Jun Mizuno,
He-Hong Wang1, Hsien-Chie Cheng1, YanSystem Integration and Packaging (ASIP) / USA. On-Wafer(COW) Integration
National Cheng Kung University / Taiwan
Cheng Liu2, Ji-Yuan Syu2, Kuo-Shu Kao2, TaoCharacterization for Electroless Cu Plating
2 1
2
1,2
1,2
1
Shogo Okita , Hajime Kato , Tadashi Fukuda , Interface of Micro-via by ToF-SIMS
WA1-2 <Session Invited> Development
WD1-2 HAZ-free Direct Laser Machining on Chih Chang , Feng Chia University, Industrial
Technology Research Institute / Taiwan
Tatsuya Funaki1,3, Takayuki Ohba1, 1Tokyo Institute Masahiko Nishijima1, Ming-Chun Hsieh1, Zhang Silicone-Based Flexible Hybrid Electronics
of Next-Generation Distortion Correction
2
3
1
1
1
Technologies for High-Precision Wafer-to-Wafer of Technology, Panasonic, Murata Manufacturing Zheng , Rieko Okumuara , Aiji Suetake , Hiroyoshi M. H. Chen, C. I Cheng, Y. C. Lin, J. C. Kao,
WE1-2 Joint Strength of Transient Liquid/ Japan
Yoshida1, Chuantong Chen1, Hiroaki Seto2, Yuhei Advanced Semiconductor Engineering / Taiwan
BondingPhase Bonding Using Cu–SAC Molded Sheet
Hajime Mitsuishi, Hiroshi Mori, Hidehiro Maeda, WB1-3 <Session Invited> Possible Solutions Kitahara2, Kei Hashizume2, Katsuaki Suganuma1, WD1-3 Proposal of Indoor Spatial Coordinate Ichizo Sakamoto1, Doojin Jeong1,2, Hiroaki
1
Mikio Ushijima, Atsushi Kamashita, Masashi
Tatsumi1, Hiroshi Nishikawa1, 1Osaka University /Osaka University, 2Okuno Chemical Industries / Deﬁnition Method and Compact Detection
to Challenges of Wafer Bonding Technologies
Okada, Masanori Aramata, Takashi Shiomi, Shinya for Future Electronic Devices
Japan
Japan, 2Inha University / Korea
Module Using Fifth-Generation Mobile
Sakamoto, Kishou Takahata, Tomohiro Chiba,
Bumki Moon, Seungho Hahn, Wooyoung Kim,
Communication System and Sensors
WC1-3 Microstructure and Intermetallic
WE1-3 Large Area Powermodule Sintering
Minoru Fukuda, Masahiro Kanbayashi, Toshimasa Sujie Kang, Minsoo Han, Wonyoung Choi,
Maho Terashima, Nobuaki Hashimoto, Suwa
Growth Characteristics of Sn-Bi-In-xGa
Using Porous Copper
Shimoda, Isao Sugaya, NIKON / Japan
Donggap Shin, Nungpyo Hong, Yongin Lee,
University of Science / Japan
Thomas Blank1, Felix Steiner1, Dai Ishikawa2,
Quaternary Low Melting Point Solders
2 1
Siwoong Woo, Jungshin Lee, Kyeongbin Lim,
Jingyu Qiao, Xingchao Mao, King-Ning Tu,, Karlsruhe Institute of Technology
WA1-3 In-Depth Analysis of Bonding
WD1-4 Application of Battery Less Ear Tag Hideo Nakako
Minwoo Rhee, Samsung Electronics / Korea
Yingxia Liu, City University of Hong Kong / Hong Sensor for Goat Breeding Management/ Germany, 2Resonac / Japan
Interface at Die Level Hybrid Bonding
1
1
1
1
2
Kong
Yuki Yoshihara , Junya Fuse , Tomoya Iwata ,Riku
Yasumura,
Osamu
Takiguchi,
WakakoWB1-4<Session
Invited>High
AspectRatio
WE1-4
Advancing
Reliability in SiC Modules
Shunsuke Teranishi2, Naoko Yamamoto2, Akihito Plasma Etching -Nano to Micron
Takagi1, Syo Taira1, Kyota Fusho1, Haruichi
via Copper Sintering
WC1-4 Extremely Narrow Pitch Gravure
3 1
Kawai2, Shimpei Aoki3, Takashi Hare3, Marie
KanayaTomihito
Ohba,
Lam
Research/Japan,
Okinawa
Prefectural
Livestock
and
J-Y
Syu,
Y-M
Hsieh,
Y-C
Liu, S-F Hsu, C-W
OffsetPrinting
Technology
Using
Fine
SolderSano1,4, Fumihiro Inoue1, 1YOKOHAMA National
Grassland Research Center, 2ALSENS, 3Kyushu
Chang, K-S Kao, T-C Chang, Industrial Technology
Paste
University, 2Disco, 3Toray Engineering, 4Kanagawa
Research Institute / Taiwan
University / Japan
Shunichi Haraguchi1, Chisato Oyama1, Kotarou
Institute of Industrial Science and Technology /Usuda2, Yoshihiro Ohyama1, Hideki Ikeda1,
1
Japan
KOMORI, 2SERIA ENGINEERING / Japan
WA1-4 Aproach to Process Design andPrediction of CMP Process for Dielectric
Organic Material and Cu Layer Assisted by
Deep Learning
T. Tanaka1,6, K. Okada1,6, H. Nishizawa2,6,
K. Tsukamoto2,6, T. Doi2,6, M. Ozono3,6, H.
Kimuro3,6, H. Hirai3,6, S. Yamamoto2,4,6, K.
Suzuki4, S. Takahashi5,6, Y. Minami5,6, M.
Yasuda1,6, M. Sasago1,6, T. Saito1,6, Y. Hirai1,6,
1Osaka Metropolitan Univ., 2Doi Laboratory,
3
AIST Kyushu, 4Kyushu Institute of Technology,
5
Lithotech Japan, 6RCS consortium / Japan

11:10
11:20
11:20

Room C
WC1: Processing
Chairs: A. Shigetou,NIMS, J. Wang, Meisei
University

Break
WB2: ISMP Session
WA2: Chiplet-2
Chairs: K. Hasegawa, JSR, T. Nonaka, Rapidus Chair: T.S. Kim, KAIST

WC2: Soldering
Chairs: H. Nishikawa, Osaka University, S.
Uegaki, Crane Research

WA2-1 <Session Invited> High Current
WB2-1 <Session Invited> MultiscaleDensity Power Supply With Substrate
Thermal Challenges in Semiconductors: From WC2-1 Reliability Evaluations of Bonding
WD2-1 Dendrite Formation in Power
WE2-1 Development of Thermal
Embedding Technology for Chiplet Application Device to Packaging
Characteristics of Combined Pb-free Solder
Electronics Packages During HV-H3TRB Testing Characteristics Evaluation System for Multi-Chip
Wang Qidong, Institute of Microelectronics of the Eunju Jeong, Woosung Park, Sogang University / Joints With Sn-Bi-Ag and Sn-Ag-Cu
Due to Flux Residue
SiC Power Modules
Chinese Academy of Sciences / China
Korea
Jahyeon Kim1,2, Youngran Choi1, Taeyoon Im1,
Felix Steiner1, Thomas Blank1, Dai Ishikawa2,
Fupeng Huo1, Chuantong Chen1, Zheng Zhang1,
2
1
1,3 1
2 1
Won
Bin
Im
Hideo
NakakoAiji
Suetake1, Kazutaka Takeshita2, Yoshiji,
Min-SuKim,
Yong-Ho
Ko
,
Korea
,
Karlsruhe
InstituteofTechnology
WA2-2 <Session Invited> A Game-Changer WB2-2 <Session Invited> Wafer and Die
2
2
Institute of Industrial Technology, Hanyang/ Germany, Resonac / Japan
Yamaguchi2, Yashima Momose2, Katsuaki
for AI and HPC Substrates: A Novel Interconnect Warpage Measurement for the Advanced3
1 1
University,
Suganuma
Universityof
ScienceandTechnology, Osaka University, 2Yamato ScientificTechnology
Package Processing
WD2-2 Delamination of Metallized AlN/ KoreaRozalia Beica, Averatek / USA
Joonho You, Nexensor / Korea
Substrate under Thermal Cycling Test Monitored / Japan
WE2-2 Super-High Thermal Conductive
WA2-3 Photosensitive Polyimides
WB2-3 <Session Invited> Implementation WC2-2 Dissolution Behavior of Cu-0.1wt.% by Acoustic Emission and Digital Image
Correlation Methods
Fe C19210 in Molten Sn & SAC305 Solders
Resin Sheet and Insulated Metal Baseplate
Compositions with Good Flexibility and Low
of High Purity Cu to Cu Direct Bonding With
A. D Laksono, J. T. Chou, Y. W. Yen, National
Minh Chu Ngo, Hiroyuki Miyazaki, Kiyoshi
Achieved by Card-house Structured BN Filler
Dielectric Property for Heterogeneous Chiplet Reﬁll Friction Stir Spot Welding for Busbar
TaiwanUniversityof
ScienceandTechnology/
Hirao,
TatsukiOhji,
ManabuFukushima,
National
Ayano Imai, Katsuhiko Hidaka, Toshiyuki
Integration Technologies
Applications
TaiwanInstitute of Advanced Industrial Science andSawamura, Yuya Koga, Mitsubishi Chemical /Takashi Tasaki, Takashi Yamaguchi, Taiyou
Sangmin Lee1, Seungyeop Baek2, Chuantong
1
3
1
Japan
Nakamura, Madoka Yamashita, ARAKAWA
Chen , Seung-Joon Lee , Hiroshi Utsunomiya ,WC2-3 Solid/Solid Interfacial Reactions in the Technology / JapanCHEMICAL INDUSTRIES / Japan
Katsuaki Suganuma1, Dongjin Kim4, 1Osaka
Sn/C7025 and Sn-3.0 wt%Ag-0.5wt%Cu/C7025 WD2-3 A Novel High Electric Field EMS
WE2-3 Low Thermal Resistance Joint Using
University / Japan, 2Korea Automotive Technology Couples
Probe for Automotive and Consumer System
Lotus-Type Cu/Solder Composite
34Institute, Tech University of Korea, Korea
J. T. Chou, A. D. Laksono, Y. W. Yen, National
Hiroaki Tatsumi1, Hiroshi Isono2, Kana Hirase1,
LevelsInstitute of Industrial Technology / Korea
Taiwan University of Science and Technology /Hsing-Chuan Peng1, Sung-Mao Wu1, Ming-Cheng Takuya Ide3, Hiroshi Nishikawa1, 1Osaka
2
2 1
TaiwanChang , Jen-Chieh Liu , National University of
University, 2Shiima Electronics, 3Lotus Thermal
WB2-4 <Session Invited> Pulse Current
Kaohsiung, 2Himax Technologies / Taiwan
Solution / Japan
Electrodeposition of Fe-Ni Alloy for Ultra Thin
Fine Metal Mask Fabrication
WD2-4 AI Based Layer Assignment for Probe WE2-4 Effects of the Nanoporous Cu
Na Young Kang, Jae-Ho Lee, Hongik University /Card Design
Interlayer on the Bonding Area and Strength
Korea
Hirohiko Matsuzawa1, Katsuyoshi Ikuta1, Yutaka for Applications in Packaging of High Power
Iinaga2, Katsuyuki Takayama2, 1ZUKEN, 2OKI
DevicesCircuit Technology / Japan
Wan-Hsin Lu, Chih Chen, National Yang Ming
Chiao Tung University / Taiwan
13:00
13:00
13:50

Lunch

13:50
14:40

Award Ceremony

14:40
14:50

Break

14:50

Keynote Lecture I: RUMS – A New Business Scheme to Accelerate Innovation
Through Integration of Front-End and Back-End of Semiconductor Technologies

15:50

Chairs: Y. Morikawa, ULVAC, K. Takeuchi, Tohoku University

Atsuyoshi Koike, Rapidus

15:50
16:50

Break / Poster Session

16:50

Keynote Lecture II: The Chiplet Challenge

17:50

Chairs: F. Inoue, YOKOHAMA National University, Y. Orii, Rapidus

18:20
20:20

Welcome Reception

Beth Keser, Zero ASIC

−6−

Thursday, April 18
8:30
9:30
9:30
9:40
9:40

11:20
11:20
11:30
11:30

Room A

Room B

Room CRoom D

Keynote Lecture III: Glass packaging for Emerging Applications in Advanced Communications and AI

Room E

Madhavan Swaminathan, The Pennsylvania State University
Chairs:T. Sakai, FICT, O. Suzuki, Rapidus

BreakTA1: iNEMI Session
Chairs: Y. Tomita, Intel, S. Uegaki, Crane
Research

TB1: Advanced Packaging-1
TC1: Sintering & Diffusion
TD1: Process-1
Chairs: T. Nonaka, Rapidus, K. Yasuda, Osaka Chairs: M. Inoue, Gunma University, J. Wang, Chairs: T. Aoki, IBM Japan, F. Inoue,
University
Meisei University
YOKOHAMA National University

TA1-1
Comparing Electromigration in TinTB1-1
Large-Scale Cu Interconnection of
TC1-1
Ag Sintered Joints on ENIG Cu
TD1-1
Formation of SiO2 Bonding
Bismuth Alloys Using Planar Geometry Solder Organic Substrate Materials through Electroless Substrates by an Ag-based Complex
Interface using Perhydropolysilazane at RoomChuncheng Wang, Hiroaki Tatsumi, Hiroshi
JointsPlating Technology
Temperature
Prabjit Singh1, L. Palmer1, T. Wassick1, M Hamid1, M. L. Shih1, P. S. Shih1, J. H. Huang1, I. A. Chen1, Nishikawa, Osaka University / JapanKai Takeuchi1, Daiki Nemoto1, Tadatomo Suga2,
1 1
2Eric Campbell1, R. F. Aspandiar2, B. Franco2, H.
J. S. Wang2, C. T. Ko2, B. R. Lin2, K. M. Yang2, C. TC1-2
Interface Analysis of Direct Bonded Eiji Higurashi , Tohoku University, Meisei
3
4
5
6
2
2
1 1
Fu, , Richard Coyle , V. Vasudevan , A. Allen , K. H. Lin , A. S. Lee , C. R. Kao , National Taiwan Oxide Layers by Neutron Reﬂectometry
University / Japan
Howell7, K. Murayama8, H. Zhang9, A. Lifton10, T. University, 2Unimicron Technology / Taiwan
Masahisa Fujino1, Kenji Takahashi1, Katsuya
TD1-2
Surface Modiﬁcation by Wet
Munson11, S. Middleton11, M. Sarangapani12, 1IBM, TB1-2
Kikuchi1, Noboru Miyata2, 1National Institute ofTreatment for Low-Temperature Cu/SiO2 Hybrid
Large Panel Fan-Out Process
2Intel / USA, 3iNEMI / China, 5Dell Technologies, for High Performance Computing Device
Advanced Industrial Science and Technology,
Bonding6782
HP / USA, Nihon Superior, Shinko Electric
Comprehensive Research Organization for Science Yu-An Chen1, Jia-Juen Ong1, Wei-Lan Chiu2,
Application With Micro Ball Mount Process
Industries / Japan, 9Indium, 10MacDermid Alphaand Society / Japan
Hsiang-Hung Chang2, Chih Chen1, 1National
Powei Lu, Jia Sang Weng, F. S. Yang, Jeffrey
11
122
Electronics Solutions, Foresite / USA, Heraeus Yang, Jen-Kuang Fang, Advanced Semiconductor TC1-3
Lead-Free Diffusion Bonding for High Yang Ming Chiao Tung University, Industrial
Materials Singapore / Singapore
Engineering / Taiwan
Technology Research Institute / Taiwan
Temperature Using ZnAl Eutectic Alloy11
TA1-2 <Session Invited> Adhesion
TB1-3
TGV Drilling by Ultrafast Laser With Toru Ikeda , Tomoki Kurakazu , Masaaki
TD1-3
Optimization of Ag Thin Film
Characterization of Redistribution Layer
Koganemaru1, Tetsuro Nishimura2, 1Kagoshima
Hollow Beam Optics
Thickness With a Capping Layer for Ag-Ag
Kor Oon Lee1, Steven R. Martell2, Tzu-Hsuan
University, 2Nihon Superior / Japan
Hsiang-Chen Hsu1, Shih-Jeh Wu1, Wei-Yu Lu1,
Surface Activated Bonding
3
4
5 1
Wang , Yangchun Deng , Masahiro Tsuriya , Intel Schiang-Jing Hon2, 1I-Shou University, 2E&R
TC1-4
Direct Observation of Void Nucleation Yuanhao Cai, Kai Takeuchi, Miyuki Uomoto,/ Malaysia, 2Nordson T&I / USA, 3Unimicron
Engineering / Taiwan
and Growth in a 2-μm-Wide Cu Redistribution Takehito Shimatsu, Eiji Higurashi, Tohoku
Technology / Taiwan, 4AT&S (Chongqing) / China, TB1-4
University / Japan
Addressing Advanced IC Substrate Line During in Situ Electromigration
5
iNEMI / Japan
Chien-Lung Liang1, Yung-Sheng Lin2, Min-Yan
Deformation and Pattern Distortion Using an
TD1-4
Direct Bonding of Germanium andTA1-3 <Session Invited> High Temperature Extremely Large Exposure Field Fine-Resolution Tsai2, Meng-Chun Chiu1, Shan-Bo Wang2, Chih- Diamond Substrates by Reduction Process
Hygroscopic Swelling of Polymers in Electronic Lithography System
Pin Hung2, Kwang-Lung Lin3, 1National Taiwan
Yuki Minowa1,2, Takashi Matsumae2, Masanori
Packaging
University of Science and Technology, 2Advanced Hayase1, Yuichi Kurashima2, Hideki Takagi2,
John Chang, Corey Shay, James Webb, Timothy
1
Ian Chin1, Wei Keat Loh1, Seow Chien Kee1, Yi
Chang, Onto Innovation / USA
Semiconductor Engineering Group, 3National
Tokyo University of Science, 2National Institute2
3
4
He , Mohd Zulkifly Abdullah , Masahiro Tsuriya ,Cheng Kung University / Taiwanof Advanced Industrial Science and Technology /1Intel Microelectronics / Malaysia, 2Intel / USA,Japan
3
Universiti Sains Malaysia / Malaysia, 4iNEMI /
Japan
TA1-4
Low Temperature Material Discovery
and Readiness for 1st Level Interconnect in
Semiconductor Packaging
Sze PeiLim1, Masahiro Tsuriya2, Shripad Gokhale3,
Russell Kastberg4, 1Indium / Malaysia, 2iNEMI /Japan, 3Intel, 4IBM / USA

TE1: Power Electronics-3
Chairs: C. Chen, Osaka University, Y. Ikeda,
Fuji ElectricTE1-1
Bonding Parameter-Dependent
Microstructural and Mechanical Capabilities of
Ag Porous Sheet Bonding
YehRi Kim1,2, Eunjin Jo1,3, Byeong Kwon Ju2,
Yoongul Lee4, Jaeup Kim4, Kijoon Ahn4, Dongjin
Kim1, 1Korea Institute of Industrial Technology,
2
Korea University, 3Andong National University,
4
SP Semiconductor / Korea
TE1-2
Solid-State Bonding With SAC305
Sheets for Direct Cooling
Eunjin Jo1,2, YehRi Kim1,3, Young-Bae Park2,
Dongjin Kim1, 1Korea Institute of Industrial
Technology, 2Andong National University, 3Korea
University / Korea
TE1-3
Thermo-Mechanical Reliability of Ag
Porous Sheet Bonding Structures
Dongjin Kim1, YehRi Kim1,2, Eunjin Jo1,3, Seoah
Kim1,4, Jiyong Park1, Yong-Ho Ko1, 1Korea Instituteof Industrial Technology, 2Korea University,
3
Andong National University, 4Kyonggi University/ Korea

Break
TA2: IMPACT Session
Chairs: Y. Liu, National Cheng Kung
University, J. Mizuno, National Cheng Kung
University

TB2: Advanced Packaging-2
Chairs: O. Suzuki, Rapidus, S. Uegaki, Crane
Research

TC2: Cu-related
TD2: Process-2
Chairs: M. Fujino, AIST, H. Nishikawa, Osaka Chairs: Y.Y. Lim, AIST, M. Nakazawa, Sony
University
Semiconductor Solutions

TE2: DMR-M-1
Chairs: N. Tanaka, Resonac, H. Sakamoto,
Huawei Technologies Japan

TB2-1
Polymer Hybrid Bonding using
TC2-1
The Enhancement in the Reliability
TD2-1
Veriﬁcation of Resolution Considering TE2-1
Investigation of Wafer Warpage
Copper-Copper Bonding Materials andof Nanotwinned Cu Redistribution Lines
Process Margins for the 10μM Pitch Patterning Evolution Baesd on Fan-out Chip-ﬁrst Process
TA2-1 <Session Invited> Advanced IC
Hung-Chun Yang, Wei-Hong Lai, Chin-Li Kao,
Thermosetting Resins for Copper-Copper
Passivated With Immersion Sn and Ag
of Organic Substrates
Substrates in the Next DecadeChen-Chao Wang, Chih-Pin Hung, Advanced
Yu-Hua Chen, Unimicron / Taiwan
Yu-Wen Hung, Yi-Quan Lin, Chih Chen, National Naoya Sohara, Yu Abe, Ryotaro Takahashi,
Bonding at 200-250℃
Semiconductor Engineering / Taiwan
Yang Ming Chiao Tung University / Taiwan
Hirosuke Takamatsu, Ushio / Japan
TA2-2 <Session Invited> Improvement of Hirokatsu Sakamoto, Tadashi Teranishi, Rumi
Nagai, Ryo Itaya, Akihiko Happoya, Daicel / Japan TC2-2
Microelectronic Joint Reliability Through theWafer Backside Fine 0.4 μm Pitch
TD2-2
Control of the Surface Modiﬁcation
TE2-2
Solder Joint Reliability Comparison
Optimization of IMC Nanomechanical Properties TB2-2
Copper Interconnects For Multi Stacked Device of Epoxy Resin by VUV-Reduction and VUVUnder JEDEC Drop and System-like Drop Test
Carbon/Nitrogen Dual-Doped in
Jenn-Ming Song, National Chung Hsing University <100> P-type Silicon Hard Mask for Wafer
Integration
Redox Method using Vacuum Ultraviolet Light Conditions/ Taiwan
S. Endo1,2, A. Shimizu.1, K. Fukada3, 1Ushio,
Meng-Kai Shih1, Zih-Jun Ke1, Chun-Yu Yen2,
Thinning and Dishing Less for Hybrid Bonding Takuhiro Miyawaki, Masaki Haneda, Yukari
2
Fukumizu, Akihisa Sakamoto, Kan Shimizu,
Yen-Shuo Chen1, Tzu Wei Chiu2, Hua-Tai Fan1,
Osaka Prefecture University, 3Shibaura Machine / Wei-Hong Lai2, Chin-Li Kao2, 1National Formosa
TA2-3 <Session Invited> From Big Data
1
3
1
Yoshihisa Kagawa, Hayato Iwamoto, Sony
Yu-Chien Ko , Chu Chi Chen , Fu-Hsiang Ko ,Japan
University, 2Advanced Semiconductor Engineering
to Smart, Robust and Reliable Simulation
1
Semiconductor Solutions / Japan
National Yang Ming Chiao Tung University,
Technology
TD2-3
Adhesion Characteristics of Sputtered / Taiwan
2
3
Seriphy Technology, Taiwan Semiconductor
K.N. Chiang, National Tsing Hua University /Cu Seed Layer on Cyclooleﬁn Polymer
TC2-3
Cu Nanoparticle Sintering by
TE2-3
The Effect of Electromigration andResearch Institute / Taiwan
TaiwanA. Shimizu1,2, K. Fukada3, S. Endo1,4, 1Ushio, 2Gifu Stress Migration on NT-Cu RDLs PassivatedElectrical Current
1
1
1
3
4
University, Shibaura Machine, Osaka Prefecture With Titanium Dioxide
Characterization of Surface Activation Albert T. Wu , Tzu-Hao Sheng , Jui-Lin Chao ,TA2-4 <Session Invited> High Performance TB2-3
University / Japan
Yi-Quan Lin, Ching-Yu Tang, Yu-Wen Hung, Youon Nanotwinned Copper and SiCN by using Ar Chang-Meng Wang2, Watson Tseng2, 1National
3D Heterogeneous Integration Package
Central University, 2Shenmao Technology / Taiwan TD2-4
and N2 Plasma
YuPo Wang, Siliconware Precision Industries /Investigating Laser Direct Structuring Yi Lin, Chih Chen, National Yang Ming Chiao
112Tung University / Taiwan
Rou-Jun Lee , Pin-Syuan He , Wei-Lan Chiu ,Taiwanand Aerosol-Jet for Additively Manufactured
TC2-4
Low-Temperature Cu-Cu Bonding
Hsiang-Hung Chang2, Wei-You Hsu1, Chih Chen1, Using Nanocrystalline Grains
Helix Antennas
112National Yang Ming Chiao Tung University,
Chen-Ning Li , Wei-Lan Chiu , Hsiang-Hung
Markus Ankenbrand, David Panusch, Niklas
2
Industrial Technology Research Institute / Taiwan Chang2, Chih Chen1, 1National Yang Ming Chiao Piechulek, Gerald Gold, Klaus Helmreich, Jorg
Tung University, 2Industrial Technology Research Franke, Friedrich-Alexander-Universitat ErlangenNurnberg / Germany
Institute / Taiwan
13:10
13:10
Lunch
Time
14:00
14:00 TA3: ADMETA/BEOL Session
TB3: Advanced Packaging-3
TC3: Pan Paciﬁc Session
TD3: Process-3
TE3: DMR-M-2
Chair: F. Inoue, YOKOHAMA National
Chairs: N. Fujimori, Olympus, Y. Tomita, Intel Chairs: K. Hasegawa, JSR, O. Suzuki, Rapidus Chairs: M. Inoue, Gunma University, M.
Chairs: N. Tanaka, Resonac, H. Sakamoto,
University
Nakazawa, Sony Semiconductor Solutions
Huawei Technologies Japan
TB3-1
Bare Cu Bonding by Cu-Ag
TC3-1 <Session Invited> Technical
Composite Paste in Low Temperature Low
Implementation of DNA Data-StorageTA3-1 <Session Invited> The Growing
TD3-1
Template Stripping Process
TE3-1
Temperature Dependence
Kirsten Weide-Zaage, Leibniz Universität
Pressure Air Sintering
Importance of Wet Processing in 3D
Combined With Polyimide and SiO2/Si
Mechanical Characteristics of Ag Alloy Wire
Hannover / Germany
Chuantong Chen1, Takuya Sekiguchi2, Katsuaki
Semiconductor Fabrication
and Corresponding Inﬂuence in Wire Bonding
Templates for Obtaining Smooth Au Surfaces
Tomohisa Sato, SCREEN Semiconductor Solutions Suganuma1, 1Osaka University, 2TOPPAN Holdings TC3-2 <Session Invited> Chiplets Turn 65! Shogo Koseki1, Mika Ogino1, Kai Takeuchi1, Le
Procedure/ Japan/ JapanHac Huong Thu2, Takashi Matsumae2, Hideki
D.-S. Liu1, P.-C. Wen1, Z.-W. Zhuang1, Y. C. Chao2,
Charles E. Bauer, TechLead / USA2
2
3
TakagiP.-C. Huang1, 1National Chung Cheng University,,
Yuichi
Kurashima,
TakahiroTsuda,
TA3-2 <Session Invited> Superconducting TB3-2
Thermal Stability of Bi in Sn-Cu
TC3-3 <Session Invited> IC Package Board
3
3
2
Tomoaki Tokuhisa , Toshikazu Shimizu , Eiji
National Chiayi University / Taiwan
Nb Interconnects for Cryo-CMOS Application
Based High Strength Pb-Free Solder Alloys
Level Vibration Test for Electronic Industry
1 1
2
1
1
1
1,2
1
Hideaki Numata , Noriyuki Iguchi , Masamitsu
Jiye Zhou , Xin F. Tan , Stuart D. McDonald ,Simulation Study of Pore Structure
Jeffrey Lee, iST-Integrated Service Technology / Higurashi , Tohoku University, National Institute TE3-2
of
Advanced
Industrial
ScienceandTechnology,
Tanaka2, Koichiro Okamoto1, Sadahiko Miura1, Ken Keith Sweatman1,3, Tetsuya Akaiwa3, Kazuhiro
Evolutionand its Inﬂuences on the Properties of
Taiwan3
Kanto Chemical / Japan
Uchida3, Hiroki Ishikuro4, Toshitsugu Sakamoto1, Nogita1, 1The University of Queensland / Australia,
Sintered Silver
2
Munehiro Tada1, 1NanoBridge Semiconductor,
Kyushu University, 3Nihon Superior / JapanHan Jiang1, Shuibao Liang2, Changqing Liu3,
TD3-2
Photonic Curing and Soldering to2
1
Nagoya University, 3The University of Tokyo,
Anhui University, 2Hefei University of Technology
Printed Silver for Enhanced Attachment and
TB3-3
Selective Cu Surface Activation for4/ China, 3Loughborough University / UK
Keio University / Japan
Joint Quality
Cu-Sn Thermocompression Microbump Bonding
1
1
1
John Ukwuoma , Harry Chou , Ara Parsekian ,TA3-3 <Session Invited> Development of Without Flux DepositionTE3-3
Effect of Phase Evolution on
Ian Rawson1, Dave Pope2, Vahid Akhavan1,
Large-Scale Connections of Wafer-Level Face- Ryo Negishi, Satoshi Saito, Itsuro Tomatsu, MEC /Inhomogeneous Deformation and Fracture1
2
PulseForge,
NovaCentrix
/
USA
Japan
to-Back Structure with Cu-Cu Hybrid Bonding
Behavior in Sn-Bi Solder Alloys
Yukako Ikegami, Masaki Haneda, Kengo Kotoo, TB3-4
Shuibao Liang1, Wangyun Li2,3, Han Jiang4,5,
TD3-3
Improvement of the Bonding
Cu/SnAg Pillar Bump Joints on NiKan Shimizu, Yoshihisa Kagawa, Hayato Iwamoto, less Surface Finish in Laser Assisted Bonding
Reliability of Electroless Thin-ﬁlm Ni/Au Plating Zhihao Guo1, Zhihong Zhong1, 1Hefei University
Sony Semiconductor Solutions / Japanof Technology, 2Guilin University of Electronic
Using Co Activation(LAB)
Technology / China, 3Osaka University / Japan,
Kana Kawasaki, Ryuji Saito, Toshimitsu Nagao,
Sang Eun Han1,2, Seonghui Han1,3, Tae-Young Lee4,
4
Kenji Hara, Okuno Chemical Industries / Japan
Anhui University / China, 5Loughborough
Hoo-Jeong Lee2, Sehoon Yoo1, 1Korea Institute of2
University / UK
Industrial Technology, Sungkyunkwan University,
TD3-4
An Investigation of Cu/Ni/Ga
3
4
Andong National University, Tech University ofInterfacial Reaction With Different Ni/Ga Ratio
Korea / Korea
Tzu-hsuan Huang, Jian-wei Huang, Zhih-feng Lin,
Shih-kang Lin, National Cheng Kung University /Taiwan
15:40
15:40
Break
16:00

−7−

Room A

Room B

Room CRoom D

Room E

16:00 TA4: Advances in Chiplet Packaging hosted TB4: Advanced Packaging-4
TC4: Debonding
TD4: Process-4
TE4: DMR-M-3
Chairs: S. Uegaki, Crane Research, K. Yasuda, Chair: A. Shigetou, NIMS
Chairs: M. Nakazawa, Sony Semiconductor
Chairs: K. Takeuchi, Tohoku University, H.
by IMAPS
Solutions, K. Okamoto, Nippon Institute of
Sakamoto, Huawei Technologies Japan
Chairs: B. Kaser, Zero ASIC, Y. Orii, Rapidus Osaka University
Technology
TC4-1 <Session Invited> Feasibility ofTA4-1 <Session Invited> Advancements in TB4-1
Reliability Investigation of Cobalt and Solid-State Debonding of Cu-Cu Interface by
TE4-1
Prediction of High-Speed Oscillator
Die-to-Wafer Hybrid Bonding for 3D Chiplets
Copper Damascene Interconnects with Capped Cooling
Frequency Drift Under Package Level Reliability
TD4-1
Cathodoluminescence
Chris Scanlan, Besi / Switzerland
Akitsu Shigetou, National Institute for Materials Characterization of Diamond Polished by Gas Tests
Graphene1
Science / Japan, J. Z. Huang2, H. H. Chang1, K. P.
Ming-Han Wang1, Christine Xiao2, Chien Liu1,
Cluster Ion Beam
TA4-2 <Session Invited> Opportunities and Y. T. Hung1
H. Lee1, H. C. Chien1, C. H. Wang1,
Junsha Wang, Tadatomo Suga, Meisei University / Hassan Hashemi2, 1Synaptics / Taiwan, 2Synaptics /Challenges in Building the Chiplet Ecosystem Huang , O.
TC4-2 <Session Invited> Temporary
1
1,2
1,3 1
USA
, Industrial
E. Jan Vardaman, TechSearch International / USA W. C. Lo , C. I. Wu , K. N. Chen
Bonding Method: Use an Inorganic Film as an Japan
Technology Research Institute, 2National Taiwan Intermediate Layer for Ultrasonic Vibration De- TD4-2
Development Status of Laser-Induced TE4-2
Correction Factors to Biaxial Bending
TA4-3 <Session Invited> A Holistic
University, 3National Yang Ming Chiao Tungbonding
Peel-off Transfer Technology for Advanced
Strength of Thin Silicon Die in the Ball-on-Ring
Approach for Chiplet Assembly
University / Taiwan
Yoshie Matsumoto, Lantechnical Service / Japan Semiconductors
Test Due to Contact Nonlinearity Effect
Tanja Braun, Fraunhofer IZM / Germany
Satoshi Enzaki, Koichi Kazama, Yuichiro Tsuda, P. J. Hsieh, T. C. Kuo, M. Y. Tsai, Chang Gung
TB4-2
Laser Applications in Power
TC4-3 <Session Invited> Biomimetic
TA4-4 <Session Invited> Packaging
Tatsuya Okada, Yoshiyuki Arai, Toray Engineering University / Taiwan
Management IC Packaging
Bonding and Debonding Technology
Advancements for Heterogeneous and 3D11/ JapanWei-YuLu,
Shih-Jeh
Wu,
Hsiang-Chen
Naoe Hosoda, National Institute for Materials
TE4-3
Mold Flow Strategy Improvement for
Integration
Hsu1, Wen-Fei Lin2, 1I-Shou University, 2E&R
Science / Japan
Power Module
TD4-3
Investigation of Blind MicroVias
Vikas Gupta, ASE Group / USA
Engineering / Taiwan
Bing-Yuan Huang, Ying-Xu Lu, Hung-Hsien
bonding force: A Field Study
Hung-Kun Chen, Shun-Jen Chan, Yu-Cheng Pai, Huang, Chen-Chao Wang, Chih-Pin Hung,
TB4-3
Warpage Control Technology Using
Advanced Semiconductor Engineering / Taiwan
Carl Chen, Yu-Po Wang, Siliconware Precision
300 mm Wafﬂe Wafer Evaluated by HighIndustries / Taiwan
Precision FEM Analysis
TE4-4Power Device Structure Optimization
Wataru Doi1,2, Tatsuya Funaki1,2, Kyosuke
by Sequential Approximation Optimization
TD4-4
Study
of
Galvanic
EffectFactorandKobinata2,3, Koji Miyamoto2,4, Hajime Kato2,5,MethodMechanism for Ni/Au Plated Substrate
2,5
2 1
Shogo Okita , Takayuki Ohba , Murata
MJ He, Rick Ye, Yu Cheng Pai, Yu-Po Wang,
Tomoki Takao, Yoshiharu Iwata, Hidefumi
Manufacturing, 2Tokyo Institute of Technology,
Siliconware Precision Industries / Taiwan
Wakamatsu, Osaka University / Japan
3
DISCO, 4NAGASE, 5Panasonic Connect / Japan
TB4-4
Formation of 10 μm Pitch Sharp
Micro-bump by Fusion Process of Imprint andPhotolithography
Kiyokazu Itoi, Yusuke Takeuchi, Daisuke Sakurai,
17:40
Panasonic Holdings / Japan
17:40
Poster & Sponsors Exhibition Party
19:10

−8−

Friday, April 19
8:30
9:30
9:30
9:40
9:40

11:20
11:20
11:30
11:30

Room A

Room B

Room CRoom D

Keynote IV: Inﬂection Point on Next Package Solution

Room E

Sa-Yoon Kang, President of KMEPS

Chairs: T. Aoki, IBM Japan, T. Hatakeyama, Toyama Prefectural University

Break
FB1: Advanced Packaging-5
FA1: Glass PKG-1
Chairs: J. Mizuno, National Cheng Kung
Chairs: M. Fujino, AIST, O. Suzuki, Rapidus
University, T. Onishi, Grand Joint Technology
FB1-1
Approach With Large Panel Fan-Out
Technology
FA1-1 <Session Invited> Markets,
Ping-Ching Shen1, Sheng-Feng Huang1, PingOpportunities, and Challenges with Glass
Feng Yang1, Jen-Kuang Fang1, 1Advanced
Package Applications: Today +10
E Jan Vardaman, TechSearch International, / USA Semiconductor Engineering / Taiwan
FA1-2 <Session Invited> Glass Material
FB1-2
Approach for Advanced Packaging
and TGV Formation Technologies
for 2.5D/3D Chiplets
Yoichiro Sato, AGC / JapanT. Kubota, H. Oshida, S. Hayashiguchi, Y.
Kajikawa, TOWA / Japan
FA1-3 <Session Invited> The Role of
Structured Glass Substrates for Heterogeneous FB1-3
Semiconductor Fan-Out Polymer
Integration of Electronics
Adhesion on Physical Vapor Deposited Copper
Martin Letz, Schott / Germany
Coupling Temperature & Humidity Effects
Nien-Chun Lin, Hsin-Chih Shih, Ching-I Tsai,
FA1-4 <Session Invited> High VolumeChin-Li Kao, Chen-Chao Wang, C.P. Hung,
Glass Microhole Formation by LIDE
Hiroyuki Kamidate, LPKF Laser & Electronics / Advanced Semiconductor Engineering / Taiwan
Japan, Richard Noack, LPKF Laser & Electronics / FB1-4
Advanced Fan-Out Embedded Chip
Germany
Process Integration for 3D Application
Chih-Cheng Hsiao, Chao-Kai Hsu, Ching-Iang Li,
Yung-Sheng Chang, Ming-Ji Dai, Feng-Hsiang
Lo, Chin-Hung Wang, Wei-Chung Lo, Industrial
Technology Research Institute / Taiwan

FC1: Intermetallic Compounds-1
Chairs: M. Inoue, Gunma University, K.
Shibayama, Sekisui Chemical

FD1: Thermal Management-1
Chairs: R. Miyazawa, IBM Japan, H.
Sakamoto, Huawei Technologies Japan

FE1: Optoelectronics-1
Chairs: E. Higurashi, Tohoku University, Y.Y.
Lim, AIST

FC1-1
Study of Wetting and Interfacial
FD1-1
Issues of Using Unsaturated Heating FE1-1
Alignment and Transfer of Silver
Reactivity in Au/Liquid in System for Photonic Time for Transient Thermal Measurement Part 2 Nanowire Arrays onto Unconventional
Tomoaki Hara1, Shuhei Fukunaga2, Tsuyoshi
Packaging
Substrates for Optoelectronic Devices via
Funaki2, 1Siemens, 2Osaka University / Japan
O. Belhaddad1,2, O. Mailliart1, F. Hodaj2, 1CEA,
Dielectrophoresis Force
LETI, 2Univ. Grenoble Alpes / France
Yen-Shuo Chen1, Shun-Yu Liu1, Ching-Chang Lin2,
FD1-2
Inﬂuence of Heat Losses on
1
Ko1, Chun-Chi Chen3,
FC1-2
Investigation of Additional Elements Measurement of Thermal Contact Resistance Hua-Tai Fan , 1Yu-Chien
Fu-Hsiang
Ko , 1National Yang Ming Chiao Tung
U. Akram, T. Hatakeyama, R. Kibushi, Toyama
in Sn-Bi Based Low-Temperature Solder
2
University / Taiwan, The University of Tokyo /F. L. Chang, Y. C. Chen, Y. H. Lin, P. K. Wu, M. C. Prefectural University / Japan
3
Chuang, C. R. Kao, National Taiwan University / FD1-3
Non-destructive Orientation Mapping Japan, Taiwan Semiconductor Research Institute /Taiwanwith X-ray Diffraction for Electronic Packaging Taiwan
FE1-2
Development of Optical Pin Formation
Applications
FC1-3
A Thermodynamic Modeling
Y. Hayashi, J. Kim, M. Yabashi, RIKEN SPring-8 Process for Low-Proﬁle Optical Modules
Approach for the Design and Development of
Shuhei Sudo, Osamu Hirata, Kazuhiro Shiba,
Center / Japan
Low-Temperature Solder Alloys
Michiyo Kubo, Shigeru Kobayashi, Keizo
Y. C. Chen, F. L. Chang, M. C. Chuang, Y. C. Su, C.
Kinoshita, Takahiro Nakamura, Koichi Takemura,
R. Kao, National Taiwan University / Taiwan
Kazuhiko Kurata, AIO Core / Japan
FC1-4
Temperature-Dependent ElectricalFE1-3
Stability Study of Quantum Dot Color
Resistivity in Sn-Bi Alloys
Converted Mini/Micro-LED Displays
Xin F. Tan1,2, Qichao Hao1, Jiye Zhou1, Stuart D.
Yuanjie Cheng, Jeffery C. C. Lo, Xing Qiu, Hua
McDonald1, Keith Sweatman1,3, Kazuhiro Nogita1,
1
Xu, Mian Tao, S. W. Ricky Lee, Hong Kong
The University of Queensland / Australia, 2Kyushu
University of Science & Technology / Hong Kong
University, 3Nihon Superior / Japan& China
FE1-4
Design and Evaluation of On-Chip
Terahertz Wave Power Combiner for Beyond
5G/6G
Y. Kamiura, H. Ssali, H. Agemori, R. Doi, M. Che,
Y. Mikami, K. Kato, Kyushu University / JapanBreak
FB2: Advanced Packaging-6
FA2: Glass PKG-2
Chairs: Y. Sato, AGC, J. Vardaman, TechSearch Chairs: M. Fujino, AIST, Y. Morikawa,International
ULVAC

FC2: Intermetallic Compounds-2
Chairs: T. Aoki, IBM Japan, F. Inoue,
YOKOHAMA National University

FD2: Thermal Management-2
Chairs: H. Sakamoto, Huawei Technologies
Japan, J. Wang, Meisei University

FE2: Optoelectronics-2
Chairs: T. Amano, AIST, K. Takemura, AIO
Core

FA2-1 <Session Invited> Challenge of
FB2-1 <Session Invited> Design
FC2-1
Surface Manipulation of Ag
FD2-1
Thermal Transient Evaluation of
FE2-1 <Session Invited> Dinuclear Eu (III)Metallization on Glass Core and Through-Glass Considerations for 2.5D Interposer Technologies Metallization to Improve the Adhesion Strength MOSFETs Heating Current Applied from Source b-Diketonates With Tetraphosphine Tetraoxide
Gu-Sung Kim, Kangnam University / Korea
Vias
for Soldering Applications on LTCC
to Drain
Ligand and Their LED Applications
Tomoki Shinohara, Toshio Honda, Toshiya
C. Kleinholz1, B. Muller1, M. Fischer1, C.
Wasanthamala Badalawa, Tomoaki Hara, Siemens Hiroki Iwanaga1, Chingchun Huang1, Takeshi
FB2-2
The Strategy on Artiﬁcial Neural2
2
2
2
Fujiwara, Atotech Japan / Japan
Tschoban/Japan
Hongo1, Atsushi Okuno2, 1Toshiba, 2Green Planets,
J.-M.
Koszegi,
H.
Potter,I.
Ndip,
Networks for Prediction Advanced Packaging
M. Schneider-Ramelow2, J. Muller1, 1Technische FD2-2/ JapanReliability Under Small Dataset
FA2-2
Development of the Integrated
Examination of Evaluation Method2121Universitat
Ilmenau,Fraunhofer
Institutefor
Qinghua Su , Cadmus Yuan , K.N. Chiang ,Passive Device for Sub6 Band Using 100 μm
for In-plane Effective Thermal Conductivity of
FE2-2 <Session Invited> Light-Reﬂection1
Reliability and Microintegration / Germany
National Tsing Hua University, 2Feng Chia
Thickness Glass Substrate
Printed Circuit Board
Type High-Power Distar Engine Capable Easy
University / Taiwan
Tomoyuki Ishii, Masashi Sawadaishi, Noriko
FC2-2
Fabrication of InP-on-Insulator Wafers R. Hasegawa, T. Hatakeyama, R. Kibushi, Toyama Heat Dissipation
Kano, Masao Ishibashi, Takashi Kizu, TOPPAN
Prefectural
University/
Japan
KenshoOkamoto, Kyoto University / Japan
ThroughRoom
Temperature
Wafer
Bonding
FB2-3
Hybrid Numerical Simulation for
Holdings / Japan
Capillary Underﬁll Flow Over a Fine Pitch HBM Using Activated Si Atomic Layer
FD2-3
Metal Sinter Material Technology for FE2-3 <Session Invited> Superior
Gufei
Zhang,
Seigo
Murakami,
Ryo
Takigawa,
Power Module Packaging
Characteristics of 405nm-Based High-CRI
FA2-3
Physical and Thermal Characteristics Packaging
Kyushu University / Japan
Chien-Ting Wu, Leo Shen, CoreTech System
Chen-Chun Chao, Yi-Chi Yang, Jyh-Long Jeng,
White LEDsof the Advanced Package with Glass Core
(Moldex3D) / Taiwan
Industrial Technology Research Institute / Taiwan Atsushi Okuno1, Jang Uk An2, 1Green Planets /Substrate
FC2-3
Interfacial Reactions in the Sn-3.02
Japan,
S. Mitarai, K. Adachi, T. Igarashi, K. Seki, N.
ALLIX / Korea
wt.%Ag-0.5
wt.%
Cu(SAC)/Cu-Ni-Si-Mg
Alloy
FB2-4
RDL Embedded Coreless Substrate
FD2-4
Cooling Performance Evaluation of
Kakoiyama, Y. Tanaka, S. Oka, M. Nakazawa, H. for Hetelogenious Integlation(C7025) Couples
Microprocessor Package and Heat Sink
Iwamoto, Sony Semiconductor Solutions / Japan Fusao Takagi, Takashi Fujita, Masahiro Kosugi,
M. Ramadhani, A. D. Laksono, Y.C. Liou, Y. W.
K. Nishi, C. Shibata, Ashikaga University / Japan
Hiroyuki Ishida, Akane Kobayashi, Shuji Kiuchi, Yen, National Taiwan University of Science andFA2-4 <Session Invited> Glass Package
Technology / Taiwan
TOPPAN Holdings / Japan
Trends & Core Technologies
Tetsuya Onishi, Grand Joint Technology / Hong
FC2-4
In-Situ Observations of Cu6Sn5
KongMorphological Changes at the Liquid SAC305/
Solid OSP-Cu Interface
Kazuhiro Nogita1, Xin F. Tan1,2, Flora Somidin3,
Stuart D. McDonald1, Hiroshi Maeno2, Syo
Matsumura1,2, 1The University of Queensland /Australia, 2Kyushu University / Japan, 3Universiti
13:10
Malaysia Perlis / Malaysia
13:10
Lunch Time
14:00
14:00 FA3: Nano-imprint
FB3: High-Speed, Wireless & Components-1
FC3: Organic and Polymer Material
FD3: Thermal Management-3
FE3: Optoelectronics-3
Chairs: N. Fujimori, Olympus, J. Mizuno,
Chairs: N. Fukazawa, DIC, Y.Y. Lim, AIST
Chairs: G. Hamasaka, Tokuyama, K.
Chairs: H. Sakamoto, Huawei Technologies
Chairs: E. Higurashi, Tohoku University, K.
National Cheng Kung University
Shibayama, Sekisui Chemical
Japan, K. Takeuchi, Tohoku University
Takemura, AIO Core
FB3-1
A Compact AiP with a Dual-PolarizedFA3-1 <Session Invited> Synchronization 1x4 Antenna Array for 5G Smartphone
FC3-1
Sintering Behavior of Silver-Filled
FD3-1
Effectiveness of Thermal Bottleneck FE3-1 <Session Invited> New Developmentof Process and Material to Achieve Best Results Applications
Anhydride-cured Electrically Conductivein Topology Optimization for Thermalof Eu-Doped Gan Red LEDs for Small MicroSheng-Chi Hsieh1, Hong-Sheng Huang1, Wen-Chun Adhesives for Enhancing Interfacial Conductivity Conduction Designin Nano-Imprinting Lithography
LED Displays With Ultrahigh Deﬁnition
Hsiao1, Cheng-Yu Ho1, Tai-Jung Lee2, Chen-Chao Takanori Fukushima, Masahiro Inoue, Gunma
Patrick Schuster, EV Group / Austria
Haruki Takei, Siemens / Japan
Yasufumi Fujiwara1,2, 1Ritsumeikan University,
1
1 1
2
Wang , Hsu-Yang Lee , Advanced Semiconductor University / Japan
Osaka University / Japan
FA3-2 <Session Invited> Advanced
FD3-2
Investigation
into
theImpactof
Layout2
Manufacturing Techniques for Freeform Micro- Engineering, National Chi Nan University /FC3-2
Dvelopment of Novel Low Dielectric Design on Thermal Performance in Embedded- FE3-2 <Session Invited> How can MicroTaiwan
Optics Elements
Die Packages
Epoxy Resin
LEDs for Next Generation Displays Leverage
Anna Dudus, EV Group / Austria
Kentaro Tanaka, Masanari Nishimura, Noriyuki
Tang-Yuan Chen, Dao-Long Chen, Frank Chiu,
The Learnings of Electronics Assembly /FB3-2
High Performance Antenna-InChen-Chao Wang, Chin-Pin Hung, Advanced
Packaging Industry?
Package With Test Socket for Millimeter-Wave Kida, Takaaki Watanabe, Mitsubishi Chemical /FA3-3 <Session Invited> Advanced
Japan
Semiconductor Engineering / Taiwan
Makaren Hussein, LuxNour Technology / USA
SystemTechnologies for Large FOV Waveguide
Cheng-Yu Ho, Wen-Chun Hsiao, Sheng-Chi Hsieh, FC3-3
Satoshi Shiraga, Cellid / Japan
Kinetics on Dynamic Percolation of
FD3-3
Assessment of Thermal Dissipation
Chen-Chao
Wang,
Hsu-Yang
Lee,
Advanced
Carbon-Nanotube-Filled Electrically Conductive Ability of Assembled Modules Bonded by
FA3-4 <Session Invited> Wearable Devices
Semiconductor Engineering / Taiwan
Pastes Depending on Binder Chemistry
Metallic Pastes, Pb-free Solder, and Thermally
Using Microfabrication and Nanoimprinting of
FB3-3
Microwave Patch Antenna Placement Masahiro Inoue, Subaru Tsujimura, Jinseok Won, Conductive Sheet
Conductive Polymers
Gunma University / Japan
Ming-chun Hsieh1, Aiji Suetake1, Zheng Zhang1,
on 6U CubeSat
Seiichi Takamatsu, The University of Tokyo /Rieko Okumura1, Kei Anai2, Takashi Hattori2,
Daisuke Nakayama, Kei Sano, Tohlu Matsushima, FC3-4
Japan
Ultra-sensitive Visualization andYuki Fukumoto, Kyushu Institute of Technology / Identiﬁcation of Defects in Microelectronics
Katsuaki Suganuma1, 1Osaka University, 2Mitsui
Japan
Mining & Smelting / Japan
Packaging
Michael K. F. Lo, Eoghan P. Dillon, Jay Anderson, FD3-4
FB3-4
Matching Circuit to Improve
Heat Transfer Performance of
Photothermal Spectroscopy / USA
Transmission Characteristic of Antenna for
Aluminum-Ammonia Heat Pipe at Low
Undersea Communication
Temperature under Various Heating/Cooling
Soma Miki, Kensei Kuwahara, Kazuhiro Eguchi,
Conditions
Daisuke Nakayama, Tohlu Matsushima, Yuki
Chien-Cheng Wang, Chieh Lung, Mu-Ting Hsieh,
Fukumoto, Kyushu Institute of Technology / Japan
Chien-Yuh Yang, National Central University /Taiwan
15:40
15:40
Break
16:00

−9−

Room A

Room B

Room C

FB4: High-Speed, Wireless & Components-2 FC4: Advanced Packaging Materials andChairs: N. Fukazawa, DIC, Y.Y. Lim, AIST
Related Technologies
Chairs: G. Hamasaka, Tokuyama, H. Yamada,Toshiba
FB4-1
Development of Cast Iron Manhole
Steel Covers With Improved Radio Wave
FA4-1 <Session Invited> (10min.)Reminiscence of Dr. Seiichi Denda- "Japanese Permeability
FC4-1
Surface Topography Control for
Eiichi Tateishi1,2, Yuantong Yi1, Nobuhiro Kai2,
Session" in ISHM/IMAPS Conference
Polymer/Cu Hybrid Bonding
Fumio Miyashiro, Yokohama Jisso Consortium / Takaya Kumagae2, Tatsuya Yamaguchi3, Haruichi Yuzo Nakamura1,2, Yusuke Kondo1, Kenta
Japan
Kanaya1, 1Kyushu University, 2HINODE Holdings, Hayama1, Fabiana Lie Tanaka1, Fumihiro Inoue1,
3
1
HINODE / Japan
Yokohama National University, 2Mitsui Chemicals
FA4-2 <Session Invited> (30min.)/ Japan
TSV and Bosch Process / The Bosch Process, FB4-2
High-Speed Signal Transmission
Enabling the Practical Application and Mass
Rigid Substrate Fabricated by Silver-Seed
FC4-2
Development of Fast Filling Acid
Production of TSV
Copper Plating Technique
Copper Plating for Through Silicon Via
Hiroshi Tanaka, Sumitomo Precision Products /Wataru Fujikawa, Rei Tamura, Tadashi Matsumoto, Nobuaki Nagano, Shota Suzuki, Reito Kobayashi,
Japan
Norimasa Fukazawa, DIC / Japan
JCU / Japan
FA4-3 <Session Invited> (30min.)
FC4-3
Advanced TIM Material Analysis for
Toward Glass Core Substrate From Si
High Performance Package Applications
Jyun-De Jhan, Wen-Yu Teng, Liang-Yih Hung,Interposer for the Future Advanced Packaging
Carl Chen, Yu-Po Wang, Siliconware Precision
Satoru Kuramochi, Dai Nippon Printing / Japan
Industries / Taiwan
FA4-4 <Session Invited> (30min.)Multilayer Glass Core Substrate Technology
FC4-4
A Special Holding System for Large
with Using Conductive Paste
Package in 3D X-ray Inspection
Taiji Sakai, FICT / Japan
Chia-Ju Huang1, Yu-Hsiang Hsiao1, Yi-Sheng
Lin1, Cheng-Hsin Liu1, 1Advanced Semiconductor
17:40
Engineering / Taiwan
16:00 FA4: Professor S. Denda Memorial Session
Chairs: F. Miyashiro, YJC, K. Hashimoto,
C-NET

Room D

Room E■Poster Session

Poster sessions will be held from 15:50-16:50 on April 17 and from 17:40-18:40 on April 18.
P01 Plasma Cleaning and Thermal Compression
Bonding of Indium Bumps as Superconducting
Interconnects for Cryogenic and Quantum
Computing Applications
Kumin Kang1, Jaber Derakhshandeh2, ChristianWendeln3, Ralf Schmidt3, Hao-Yu2, Ehsan Shafahian2,
Zaid El-Mekki2, Tom Cochet2, Masataka Maehara2,
Eric Beyne2, 1Hanyang University / Korea, 2imec /Belgium, 3Atotech Deutschland / Germany
P02 High Speed D2D Interface Applied on Advanced
Package
Chen Chao Wang, Chih Yi Huang, Hung Chun Kuo,
Ming Fong Jhong, Fu Chen Chu, Hsu Yang Lee,
Advanced Semiconductor Engineering / Taiwan
P03 Research of Impedance Optimization with Mesh
Reference GroundShu-Yu Lin, Shin-Shian Wu, Yu-Ming Su, Tsai-Feng
Wu, Sung-Mao Wu, National University of Kaohsiung/ Taiwan
P04 Design of Panel Level Package and Power and
Signal Integrity Analysis
Yu-zhi Ma, Qian Lee, Sung-Mao Wu, National
University of Kaohsiung / Taiwan
P05 High Speed Signal Design on Fan-Out RDL
Interposer for Artiﬁcial Intelligence (AI) and Deep
Neural Network (DNN) Chiplet Accelerators
Application
Ming-Han Zhuang, Chih-Yuan Shih, Ho-Chuan Lin,
Andrew Kang, Yu-Po Wang, Siliconware Precision
Industries / Taiwan
P06 Eutectic Bonding in Sequential Bi and Sn Layers for
Low-Temperature Interconnections
Sri Harini Rajendran, Jae Pil Jung, Chul Hwa Jung,
Seong Min Seo, University of Seoul / Korea
P07 Low Dielectric Materials for High Frequency
Semiconductor Packaging Application
Meei-Yu Hsu, Chih-Hao Lin, Kai-Chi Chen, Industrial
Technology Research Institute / Taiwan
P08 Reliability Study of Ag Through via Interconnects for
Integrated Horn Antennas in LTCC Substrates
C. Kleinholz, M. Fischer, J. Muller, Technische
Universitat Ilmenau / Germany
P09 Excitation Technology for Substrate-Integrated
Waveguide Magnetic ModeYu Hsien Wu, National University of Kaohsiung /TaiwanP10 Fracture Properties Characterization of MultiLayer Ceramic Capacitors for Device Longevity
Assessment
Po-Yi Lee, Kuo-Shen Chen, Tz-Cheng Chiu, TianShiang Yang, Ching-Jenq Ho, Lien-Wen Chen,
National Cheng-Kung University / Taiwan

P20 Evaluation of PVD SiCN for Cu/SiCN Hybrid
Bonding
Junyoung Choi, Sangmin Lee, Sangwoo Park, Sarah
Eunkyung Kim, Seoul National University of Scienceand Technology / Korea

P11 Thermal Cycle Reliability of BGA Package With
Board-Level Underﬁll Materials
Jiyeon Park1, Dajung Kim1, Hyunseung Yang1,
Myeonghyeon Jeon1, Chulmin Oh1, 1Korea Electronics
Technology Institute / Korea
P12 Investigation of Plasma Gases for Polysilazane
Conversion into SiO2 for Wafer Bonding
Daiki Nemoto, Kai Takeuchi, Eiji Higurashi, Tohoku
University / Japan
P13 Observation of Liquid Crystal Fiber Structure in
Nematic and Smectic A phases
D. Sato1,2, Y. Sumino1,2, T. Yamamoto2, I. Muševič3, Y.
Takenaka2, 1Tokyo University of Science, 2National
Institute of Advanced Industrial Science andTechnology / Japan, 3Jožef Stefan Institute / Slovenia
P14 Development of Laminate Materials With Low DfUsing Novel Functionalized PPE
H. Yamamoto1, K. Iwase1, H. Fukuoka1, S. Otani1, M.
Harada2, 1Asahi Kasei, 2Kansai University / Japan
P15 Optimal Impedance Design for Meshed Ground
Application at High-speed Circuit
Shin-Yi Hung, Sung-Mao Wu, National University ofKaohsiung / Taiwan
P16 Electromagnetic Susceptibility of System Circuit
Based on Near-Field Measurement Techniques
Chin-Yi Chou1, Jing-Wei Zhang1, Yu-Ming Su1, SungMao Wu1,2, 1National University of Kaohsiung, 2MicroElectronic Packaging Laboratory / Taiwan
P17 Effect of Evaporated and Sputtered Au Nanolayers
on Cu Surface for Low-Temperature Cu-To-Cu
Bonding
Sangmin Lee, Sangwoo Park, Junyoung Choi, Sarah
Eunkyung Kim, Seoul National University of Scienceand Technology / Korea
P18 Bi Segregation in the Solid/Liquid Cu-0.1wt.% Fe(C19210)/Sn-58Bi Solder
A. D. Laksono, J. T. Chou, Y. W. Yen, National Taiwan
University of Science and Technology / Taiwan
P19 Optimization of O2 Plasma Treatment on Cu Surface
for Hybrid Cu Bonding
Sangwoo Park, Sangmin Lee, Junyoung Choi, Sarah
Eunkyung Kim, Seoul National University of Scienceand Technology / Korea

P21 Fly Cutting for Polymer Planarization in Hybrid Cu
Bonding
Suin Jang, Sangmin Lee, Sangwoo Park, Sarah
Eunkyung Kim, Seoul National University of Scienceand Technology / Korea
P22 Microstructure and Mechanical Properties of Type
8 Solder Paste for Mini-Led Assembly Using LaserAssisted Bonding
Jun Ho Ku, Sri Harini Rajendran, Jae Pil Jung,
University of Seoul / Korea
P23 Low-Temperature and Low-Pressure Fine-Pitch
Micro Cu Bump Bonding Using Stress Migration ofa Sputtering Ag Layer
Zheng Zhang, Aiji Suetake, Ran Liu, Hiroshi
Yoshida, Rieko Okumura, Chuantong Chen, Katsuaki
Suganuma, Osaka University / Japan
P24 Comparion of Mechanical Property and Thermal
Cycling Lifetime of Sintered Cu and Sintered Ag
Dai Ishikawa1, Hideo Nakako1, Thomas Blank2, Felix
Steiner2, 1Resonac / Japan, 2Karlsruhe Institute ofTechnology / Germany
P25 Effect of the Ratio of Na, K and Li on the PL
Performance, Color and Composition of UCr4C4
PhosphorJ. Y. Shih, C. L. Chung, J. D. Lin, I-SHOU University /TaiwanP26 Preparation of Metal Salt-Doped Silicon/Silicon
Titanium Nanoﬁbers by Electrospinning and Heat
Treatment
C. S. Yu, Y.J. Zhu, C. L. Chung, I-SHOU University /Taiwan
P27 Characterization of Chitin or Chitosan/PEO
Nanoﬁbers Prepared by Electrospinning
K. H. Wu, C. Y. Wu, C. L. Chung, I-SHOU University/ Taiwan
P28 Infulence of Bi Content on Strain Rate Sensitivity of
Sn-Bi Alloys
Akira Yamauchi, Masashi Kurose, National Institute ofTechnology, Gunma College / Japan
P29 Study on Electro-Optical Customizability
Improvement Using Modular Design with DescreteControllable External ElectrodeTitinai Chinggungval1, Daichi Nagai1, Chikara
Shirahama1, Hideki Yokoi1,2, 1Shibaura Institute ofTechnology, 2International Research Center for Green
Electronics / Japan− 10 −

P30 Long-Term Reliability of Sintering Paste Using Ag
Coated Cu Particles
Dajung Kim1, Mi So Won1, Hyunseung Yang1,
Junghwan Bang2, Chulmin Oh1, 1Electronics
Technology Institute, 2Korea Institute of Industrial
Technology / Korea
P31 Development of a Sintering Paste Using Cu@Ag
Powder for Power Package
Mi So Won, Dajung Kim, Hyunseung Yang, Chulmin
Oh, Korea Electronics Technology Institute / Korea
P32 Silver Paste Transferability in the Imprinting Process
H. Komatsu, D. Sakai, N. Shimoishizaka,
CONNECTEC JAPAN / JapanP33 Inﬂuence of Various Plasma and UV/O3 Treatments
on Au Surfaces for Au-Au Surface ActivatedBondingMika Ogino, Kai Takeuchi, Eiji Higurashi, Tohoku
University / Japan
P34 Preparation and Characterization of Expanded
Graphite/Polymer Composites With Enhanced
Thermal Conductivity
Chih-Feng Wang1, Pei-Rung Hung2, Ping-Feng Yang3,
1
National Sun Yat-sen University, 2I-Shou University,
3
Advanced Semiconductor Engineering / Taiwan
P35 Aluminum Nitride Filler For Thermally Conductive
Resin Materials
Koki Tsuchida, Suzu Tanaka, Hisamori Inagawa,Yoshitaka Inaki, Tokuyama / Japan
P36 Heat Dissipation Characteristics of Cu-MWNT
Nanocomposites Coated by Plasma Spray Process
on Al Substrates
Geon-Joo Jeong1,2, Tae-Yoo Kim2, Seung-Boo Jung1,
Kwang-Seok Kim2, 1Sungkyunkwan University, 2Korea
Institute of Industrial Technology / Korea
P37 Novel Lightweight, Highly Thermally Conductive
Graphene-Enhanced Heat Pipes for Electronics
Cooling and Thermal Management Applications
Zhiyang Shen1, Jiajia Chen1, Sihua Guo1, Amos
Nkansah2, Hongfeng Zhang2, Johan Moller2, Johan
Liu3, 1Shanghai University / China, 2SHT Smart HighTech, 3Chalmers University of Technology / Sweden
P38 Effectiveness of the Inhibitor EDTA on Cooling
Performance of Long Life Coolant Under Flow
Boiling Conditions
Kazuhisa Yuki1, Hitoshi Yoshimura2, Naoya Sakamoto1,
Kohei Yuki1, Hitoshi Asano1, Takuro Nakaoka2,
Mutsuaki Goto2, 1Sanyou-Onoda City University,
2
DENSO / Japan