Low Power, 3.3 V, RS-232
Line Drivers/Receivers
ADM3202/ADM3222/ADM1385
FEATURESFUNCTIONAL BLOCK DIAGRAMS+3.3V INPUT

0.1µF +
10V

C2+ +6.6V TO –6.6V
VOLTAGEC2–
INVERTER
T1

T2IN

T1OUT
T2

T2OUT
R1

R1OUT

R1IN
R2

R2OUT
GND

C4
0.1µF
10V

V–

C5
0.1µF

EIA/TIA-232
OUTPUTS

EIA/TIA-232
INPUTS*

R2IN

ADM3202

APPLICATIONS*INTERNAL 5kΩ PULL-DOWN RESISTORON EACH RS-232 INPUT

General-purpose RS-232 data link
Portable instruments
Printers, palmtop computers, PDAs

Figure 1.
+3.3V INPUT

C2+ +6.6V TO –6.6V
VOLTAGEC2–
INVERTER
T1

T1IN
T2IN

T1OUT
T2

R2

R2OUT

R2IN

EN

EIA/TIA-232
INPUTS*SD

ADM3222GND*INTERNAL 5kΩ PULL-DOWN RESISTORON EACH RS-232 INPUT

Figure 2.
+3.3V INPUT

0.1µF +
10V

C2+ +6.6V TO –6.6V
VOLTAGEC2–
INVERTER

T1IN

V–

C4
0.1µF
10V

T1

T1OUT
T2

T2IN

T2OUT
R1

R1OUT

R1IN
R2

R2OUT
DD
GND

ADM1385

R2IN

C3
0.1µF
6.3V

C5
0.1µF

EIA/TIA-232
OUTPUTS

EIA/TIA-232
INPUTS*SD*INTERNAL 5kΩ PULL-DOWN RESISTORON EACH RS-232 INPUT

00071-003

CMOS
OUTPUTS

C1+ +3.3V TO +6.6V VCC
VOLTAGEC1–V+
DOUBLER+

CMOS
INPUTS

0.1µF +
10V+

The ADM3202 is available in a 16-lead PDIP, SOIC_W, and
SOIC_N, as well as a space-saving 16-lead TSSOP. The ADM3222
is available in 18-lead PDIP and SOIC_W and in 20-lead SSOP
and TSSOP. The ADM1385 is available in a 20-lead SSOP,
which is pin-compatible with the LTC1385 CG.

R1IN

EIA/TIA-232
OUTPUTS+

The ADM1385 contains a driver disable mode and a complete
shutdown mode.

T2OUT
R1

R1OUT

Four external 0.1 μF charge pump capacitors are used for thevoltage doubler/inverter, permitting operation from a single
3.3 V supply.
The ADM3222 contains additional enable and shutdown
circuitry. The EN input can be used to three-state the receiver
outputs. The SD input is used to power down the charge pumpand transmitter outputs, reducing the quiescent current to lessthan 0.5 μA. The receivers remain enabled during shutdown
unless disabled using EN.

C4
0.1µF
10V

V–

C5
0.1µF

00071-002

The ADM3202/ADM3222/ADM1385 parts conform to theEIA-232E and CCITT V.28 specifications and operate at data
rates up to 460 kbps.

0.1µF +
10V

C3
0.1µF
6.3V

+

CMOS
OUTPUTS

C1+ +3.3V TO +6.6V VCC
VOLTAGEC1–V+
DOUBLER+

CMOS
INPUTS

0.1µF +
10V+

GENERAL DESCRIPTION
The ADM3202/ADM3222/ADM1385 transceivers are highspeed, 2-channel RS-232/V.28 interface devices that operatefrom a single 3.3 V power supply. Low power consumption anda shutdown facility (ADM3222/ADM1385) make them ideal forbattery-powered portable instruments.

00071-001

T1IN

C3
0.1µF
6.3V

+

CMOS
OUTPUTS

C1+ +3.3V TO +6.6V VCC
VOLTAGEC1–V+
DOUBLER+

CMOS
INPUTS

0.1µF +
10V+

460 kbps data rate
Specified at 3.3 V
Meets EIA-232E specifications
0.1 μF charge pump capacitors
Low power shutdown (ADM3222 and ADM1385)
PDIP, SOIC_N, SOIC_W, SSOP, and TSSOP options
Upgrade for MAX3222/MAX3232 and LTC1385
ESD protection to IEC 1000-4-2 (801.2)
on RS-232 pins (ADM3202 only)±8 kV: contact discharge±15 kV: air gap discharge

Figure 3.

Rev. D
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or otherrights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113©2006 Analog Devices, Inc. All rights reserved.

ADM3202/ADM3222/ADM1385
TABLE OF CONTENTS
Features .............................................................................................. 1

Pin Configurations (N, RN, RU, and RW Packages)................5Applications....................................................................................... 1

Pin Configurations (RS and RU Packages)................................5

General Description ......................................................................... 1

Typical Performance Characteristics ..............................................6

Functional Block Diagrams............................................................. 1

General Description..........................................................................8

Revision History ............................................................................... 2

Circuit Description .......................................................................8

Specifications..................................................................................... 3

High Baud Rate..............................................................................9

Absolute Maximum Ratings............................................................ 4

Outline Dimensions ....................................................................... 10

ESD Caution.................................................................................. 4

Ordering Guide .......................................................................... 12

Pin Configurations and Function Descriptions ........................... 5

REVISION HISTORY
8/06—Rev. C to Rev. D
Changes to Table 1............................................................................ 3
Updated Outline Dimensions ....................................................... 10
Changes to Ordering Guide .......................................................... 12

12/01—Rev. A to Rev. B
Changes to Specifications Page........................................................2

9/05—Rev. B to Rev. C
Updated Outline Dimensions ....................................................... 10
Changes to Ordering Guide .......................................................... 12

Rev. D | Page 2 of 12

ADM3202/ADM3222/ADM1385
SPECIFICATIONSVCC = 3.3 V ± 0.3 V, C1 to C4 = 0.1 μF. All specifications TMIN to TMAX, unless otherwise noted.
Table 1.
Parameter
DC CHARACTERISTICS
Operating Voltage Range
VCC Power Supply Current
Shutdown Supply Current
LOGIC
Input Logic Threshold Low, VINL
Input Logic Threshold High, VINH
CMOS Output Voltage Low, VOL
CMOS Output Voltage High, VOH
Logic Pull-Up Current
Output Leakage Current
RS-232 RECEIVER
EIA-232 Input Voltage Range
EIA-232 Input Threshold Low
EIA-232 Input Threshold HighEIA-232 Input Hysteresis
EIA-232 Input Resistance
RS-232 TRANSMITTER
Output Voltage Swing (RS-232)
Output Voltage Swing (RS-562)
Transmitter Output Resistance
RS-232 Output Short-Circuit Current
Output Leakage Current
TIMING CHARACTERISTICS
Maximum Data Rate
Receiver Propagation Delay
TPHL
TPLH
Transmitter Propagation Delay
Receiver Output Enable Time
Receiver Output Disable Time
Transmitter Skew
Receiver Skew
Transition Region Slew Rate
1

Min

Typ

Max

Unit

Test Conditions/Comments

3.0

3.3
1.3
8
0.01

5.5
3
12
0.5

V
mA
mA
μA

No load
RL = 3 kΩ to GND

0.8

V
V
V
V
μA
μA

TIN
TIN
IOUT = 1.6 mA
IOUT = −1 mA
TIN = GND to VCC 1
Receivers disabled

2.0
0.4
VCC − 0.6
5

−30
0.6

3
±5.0
±3.7
300

10
±10
+30

1.2
1.6
0.4
5

7

V
V
V
V
kΩ

±25

V
V
Ω
mA
μA

2.4

±5.2

±15

460

5.5

kbps

0.4
0.4
0.3
200
200
30
300
10

1
1
1.2

30

μs
μs
μs
ns
ns
ns
ns
V/μs

VCC = 3.3 V, all transmitter outputs loaded with 3 kΩ to ground
VCC = 3.0 V
VCC = 0 V, VOUT = ±2 V
SD = low, VOUT = 12 V
VCC = 3.3 V, RL = 3 kΩ to 7 kΩ, CL = 50 pF to 1000 pF, one
Tx switching

RL = 3 kΩ, CL = 1000 pF

Measured from +3 V to −3 V or −3 V to +3 V, VCC = +3.3 V;
RL = 3 kΩ, CL = 1000 pF, TA = 25°C

ADM1385: Input leakage current typically −10 μA when TIN = GND.

Rev. D | Page 3 of 12

ADM3202/ADM3222/ADM1385
ABSOLUTE MAXIMUM RATINGSTA = 25°C, unless otherwise noted.
Table 2.
Parameter
VCC
V+
V−
Input Voltages
TIN
RIN
Output Voltages
TOUT
ROUT
Short-Circuit Duration
TOUT
Power Dissipation N-16/N-18(Derate 6 mW/°C above 50°C)
θJA, Thermal ImpedancePower Dissipation RW-16/RN-16(Derate 6 mW/°C above 50°C)
θJA, Thermal ImpedancePower Dissipation RU-16(Derate 6 mW/°C above 50°C)
θJA, Thermal ImpedancePower Dissipation RW-18(Derate 6 mW/°C above 50°C)
θJA, Thermal ImpedancePower Dissipation RS-20(Derate 6 mW/°C above 50°C)
θJA, Thermal ImpedancePower Dissipation RU-20(Derate 6 mW/°C above 50°C)
θJA, Thermal Impedance
Operating Temperature Range
Industrial (A Version)
Storage Temperature Range
Lead Temperature(Soldering, 10 sec)

Rating−0.3 V to +6 V
(VCC − 0.3 V) to +14 V+0.3 V to –14 V

Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stressrating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affectdevice reliability.

−0.3 V to (V+, +0.3 V)
±30 V
±15 V
−0.3 V to (VCC + 0.3 V)
Continuous
450 mW
117°C/W
450 mW
158°C/W
500 mW
158°C/W
450 mW
158°C/W
450 mW
158°C/W
450 mW
158°C/W−40°C to +85°C−65°C to +150°C
JEDEC industry standard
J-STD-020

ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performancedegradation or loss of functionality.

Rev. D | Page 4 of 12

ADM3202/ADM3222/ADM1385
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
C1+
V+

1

16

2

15

3

ADM3202

C2+

4

TOP VIEW(Not to Scale)

C2–

C1–

14

VCC
GND
T1OUT

EN

1

18

SD

C1+

2

17

VCC

V+

3

ADM3222

16

GND

C1–

4

15

T1OUT

C2+

5

TOP VIEW(Not to Scale)

14

R1IN

R1IN

5

12

R1OUT

C2–

6

13

V–

11

T1IN

R1OUT

6

V–

7

12

T1IN

T2OUT

7

10

T2IN

T2OUT

8

11

T2IN

R2IN

8

9

R2OUT

R2IN

9

10

R2OUT

00071-004

1300071-005

PIN CONFIGURATIONS (N, RN, RU, AND RW PACKAGES)

Figure 5. N and RW Packages Pin Configuration

Figure 4. N, RN, RU, and RW Packages Pin Configuration

PIN CONFIGURATIONS (RS AND RU PACKAGES)
20

SD

C1+ 2

19

VCC

V+ 3

18

GND

(SSOP/TSSOP)
TOP VIEW(Not to Scale)

17

T1OUT

16

DD 1

19 VCCV+ 3

18 GND

R1IN

C1– 4

15

R1OUT

C2+ 5

V– 7

14

NC

T2OUT 813

T1IN

R2IN 912

R2OUT 10

11

NC = NO CONNECT

20 SD

C1+ 2

6

C2+ 5
C2–

ADM3222

C2– 6

ADM1385(SSOP)TOP VIEW(Not to Scale)

V– 7

17 T1OUT
16 R1IN
15 R1OUT
14 T1IN

T2OUT 8T2IN

13 T2IN

R2IN 912 R2OUT

NC

NC 10

00071-006

C1–

4

11 NC

NC = NO CONNECT

00071-007

EN 1

Figure 7. RS Package Pin Configuration

Figure 6. RS and RU Packages Pin Configuration

Table 3. Pin Function Descriptions
Mnemonic
VCC
V+
V–
GND
C1+, C1–
C2+, C2–
TxIN
TxOUT
RxIN
RxOUT
EN
SD
SD
DD
NC

Description
Power Supply Input (3.3 V ± 0.3 V).
Internally Generated Positive Supply (+6 V nominal).
Internally Generated Negative Supply (−6 V nominal).
Ground Pin. Must be connected to 0 V.
External Capacitor 1 is connected between these pins. A 0.1 μF capacitor is recommended but larger capacitors up to 47 μF
can be used.
External Capacitor 2 is connected between these pins. A 0.1 μF capacitor is recommended but larger capacitors up to 47 μF
can be used.
Transmitter (Driver) Inputs. These inputs accept TTL/CMOS levels.
Transmitter (Driver) Outputs. These are RS-232 signal levels (typically ±9 V).
Receiver Inputs. These inputs accept RS-232 signal levels. An internal 5 kΩ pull-down resistor to GND is connected on each input.
Receiver Outputs. These are CMOS output logic levels.
(ADM3222 only) Receiver Enable. Active low. When low, the receiver outputs are enabled. When high, they are three-stated.
(ADM3222 only) Shutdown Control. Active low. When low, the charge pump is shut down and the transmitter outputs
are disabled.
(ADM1385 only) Shutdown Control. When low, the charge pump is shut down and all transmitters and receivers are disabled.
(ADM1385 only) Driver Disable. When low, the charge pump is turned off and the transmitters are disabled. The receivers
remain active.
No Connect.

Rev. D | Page 5 of 12

ADM3202/ADM3222/ADM1385
TYPICAL PERFORMANCE CHARACTERISTICS
88
TOUT (HIGH)

6

6
4

2

2
V+, V– (V)

0
–2

–2

–4

–4
V–

0

200

–6

00071-008

TOUT (LOW)

–6
–8

0

400
600
800
LOAD CAPACITANCE (pF)

1000

–8

1200

00071-011

Tx O/P VOLTAGE (V)

V+
4

0

Figure 8. Transmitter Output Voltage High/Low vs.
Load Capacitance @ 460 kbps

2

10

4
6
8
LOAD CURRENT (mA)

12

Figure 11. Charge Pump V+, V− vs. Load Current
350

8
Tx O/P HIGH

6300
V+ (IMPEDANCE)

4
IMPEDANCE (Ω)

250

0
–2

200
V– (IMPEDANCE)
150
100

–4

Tx O/P LOW
5000071-009

–6
–8
2.7

2.9

3.1
VCC (V)

3.3

0
2.7

3.5

00071-012

Tx O/P (V)

2

2.9

3.1
VCC (V)

3.3

3.5

Figure 12. Charge Pump Impedance vs. VCC

Figure 9. Transmitter Output Voltage vs. VCC
20

8

18

6

Tx O/P HIGH

ICC @ 460kbps

16

4
14

ICC (mA)

Tx O/P (V)

2
0
–2

12
ICC @ 230kbps

10
8
6

–4
00071-010

–8

0

2

4
6
8
LOAD CURRENT (mA)

1000071-013

4

Tx O/P LOW
–6

2
0

12

Figure 10. Transmitter Output Voltage Low/High vs. Load Current

0

1000
2000
LOAD CAPACITANCE (pF)

Figure 13. Power Supply Current vs. Load CapacitanceRev. D | Page 6 of 12

3000

ADM3202/ADM3222/ADM1385

1

T

T

CH 1 5.00V

CH 2

5.00V

M1.00µs

CH1

0V

00071-014

2

Figure 14. 460 kbps Data Transmission

Rev. D | Page 7 of 12

ADM3202/ADM3222/ADM1385
GENERAL DESCRIPTION+3.3V INPUT

0.1µF +
10V

C2+ +6.6V TO –6.6V
VOLTAGEC2–
INVERTER

T2IN+3.3V INPUT
C1+ +3.3V TO +6.6V VCC
VOLTAGEC1–V+
DOUBLER

0.1µF +
10V

C2+ +6.6V TO –6.6V
VOLTAGEC2–
INVERTER

+
+

T2
R1

R1IN
R2

R2OUT

R2IN

R1IN
R2

R2OUT

SD

ADM1385

GND

EIA/TIA-232
INPUTS*

R2IN*INTERNAL 5kΩ PULL-DOWN RESISTORON EACH RS-232 INPUT

Figure 17. ADM1385 Typical Operating Circuit
S1

VCC

S3
C1

S2

+

C3

S4

V+ = 2VCC+

VCC
00071-018

GND
INTERNAL
OSCILLATOR

S1

C5
0.1µF

FROM
VOLTAGEDOUBLER

C4
0.1µF
10V

T2OUT

R1

R1OUT

EIA/TIA-232
OUTPUTS

S3

V+

GND
S2

C2

+
S4

C4

+
V– = –(V+)

GND
EIA/TIA-232
OUTPUTS

INTERNAL
OSCILLATOR

Figure 19. Charge Pump Voltage Inverter
EIA/TIA-232
INPUTS**INTERNAL 5kΩ PULL-DOWN RESISTORON EACH RS-232 INPUT

00071-015

ADM3202

Figure 15. ADM3202 Typical Operating Circuit

Rev. D | Page 8 of 12

00071-019

C3
0.1µF
6.3V

T1OUT

T2OUT

C5
0.1µF

Figure 18. Charge Pump Voltage Doubler
+

T1

T2

T2IN

+3.3V INPUT

V–

T1OUT

DD

If desired, larger capacitors (up to 10 μF) can be used for
Capacitors C1 to C4.

C2+ +6.6V TO –6.6V
VOLTAGEC2–
INVERTER

C4
0.1µF
10V

T1

T1IN

CMOS
OUTPUTS

V–

C3
0.1µF
6.3V

00071-017

0.1µF +10V

CMOS
INPUTSCapacitors C3 and C4 are used to reduce the output ripple.
Their values are not critical and can be increased, if desired.
Capacitor C3 is shown connected between V+ and VCC. It isalso acceptable to connect this capacitor between V+ and GND.

C1+ +3.3V TO +6.6V VCC
VOLTAGEC1–V+
DOUBLER

00071-016

Figure 16. ADM3222 Typical Operating Circuit

The charge pump voltage converter consists of a 200 kHz
oscillator and a switching matrix. The converter generates a±6.6 V supply from the input 3.3 V level. This is done in twostages by using a switched capacitor technique as illustrated in
Figure 18 and Figure 19. First, the 3.3 V input supply is doubled
to 6.6 V by using Capacitor C1 as the charge storage element.
The +6.6 V level is then inverted to generate −6.6 V using C2
as the storage element. C3 is shown connected between V+ and
VCC but is equally effective if connected between V+ and GND.

GND

SD

ADM3222

GND

Charge Pump DC to DC Voltage Converter

R1OUT

EIA/TIA-232
INPUTS*R2IN+

EIA-232 to 5 V logic receivers

CMOS
OUTPUTS

R2

+

•

T2IN

R1IN

EIA/TIA-232
OUTPUTS+

3.3 V logic to EIA-232 transmitters

CMOS
INPUTS

R1

C5
0.1µF

*INTERNAL 5kΩ PULL-DOWN RESISTORON EACH RS-232 INPUT

•

T1IN

T2OUT

EN

The internal circuitry consists of these main sections:• A charge pump voltage converter

0.1µF +
10V

T2

R2OUT

CIRCUIT DESCRIPTION

0.1µF +
10V

T1OUT

R1OUT

CMOS
OUTPUTS

C4
0.1µF
10V

V–

T1

T1IN

CMOS
INPUTS

C3
0.1µF
6.3V

+

The ADM3202/ADM3222/ADM1385 are modifications,enhancements, and improvements of the AD230 to AD241
family and derivatives. They are essentially plug-in compatible
and do not have any materially different applications.

C1+ +3.3V TO +6.6V VCC
VOLTAGEC1–V+
DOUBLER+CMOS technology is used to keep the power dissipation to an
absolute minimum, allowing maximum battery life in portableapplications.

0.1µF +
10V+

The ADM3202/ADM3222/ADM1385 are RS-232 line drivers/
receivers. Step-up voltage converters coupled with level-shifting
transmitters and receivers allow RS-232 levels to be developed
while operating from a single 3.3 V supply.

ADM3202/ADM3222/ADM1385
Transmitter (Driver) Section

HIGH BAUD RATE

The drivers convert 3.3 V logic input levels into RS-232 output
levels. With VCC = 3.3 V and driving an RS-232 load, the output
voltage swing is typically ±6 V.

The ADM3202/ADM3222 feature high slew rates permitting
data transmission at rates well in excess of the EIA/RS-232E
specifications. RS-232 voltage levels are maintained at data rates
up to 460 kbps even under worst-case loading conditions. This
allows high speed data links between two terminals and issuitable for the new generation ISDN modem standards that
require data rates of 230 kbps. The slew rate is internallycontrolled to less than 30 V/μs to minimize EMI interference.

Receiver Section
The receivers are inverting level-shifters that accept RS-232
input levels and translate them into 3 V logic output levels. The
inputs have internal 5 kΩ, pull-down resistors to ground and areprotected against overvoltages up to ±30 V. Unconnected inputs
are pulled to 0 V by the internal 5 kΩ, pull-down resistor. This
results in a Logic 1 output level for unconnected inputs or for
inputs connected to GND.
The receivers have Schmitt-trigger inputs with a hysteresis levelof 0.4 V. This ensures error-free reception for both noisy inputs
and for inputs with slow transition times.

Rev. D | Page 9 of 12

ADM3202/ADM3222/ADM1385
OUTLINE DIMENSIONS
0.800 (20.32)
0.790 (20.07)
0.780 (19.81)
0.280 (7.11)
0.250 (6.35)
0.240 (6.10)

80.100 (2.54)
BSC

0.060 (1.52)
MAX

0.210 (5.33)
MAX

0.015
(0.38)
MIN

0.150 (3.81)
0.130 (3.30)
0.115 (2.92)

4.00 (0.1575)
3.80 (0.1496)

0.195 (4.95)
0.130 (3.30)
0.115 (2.92)

0.015 (0.38)
GAUGE
PLANE

SEATING
PLANE

0.022 (0.56)
0.018 (0.46)
0.014 (0.36)

10.00 (0.3937)
9.80 (0.3858)

0.325 (8.26)
0.310 (7.87)
0.300 (7.62)

0.430 (10.92)
MAX

0.005 (0.13)
MIN

9

16
1

8

1.27 (0.0500)
BSC

0.014 (0.36)
0.010 (0.25)
0.008 (0.20)

COPLANARITY
0.10

SEATING
PLANE

0.51 (0.0201)
0.31 (0.0122)

8°0°0.25 (0.0098)
0.17 (0.0067)

1.27 (0.0500)
0.40 (0.0157)

COMPLIANT TO JEDEC STANDARDS MS-012-AC
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FORREFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

070706-A

COMPLIANT TO JEDEC STANDARDS MS-001
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FORREFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
CORNER LEADS MAY BE CONFIGURED AS WHOLE OR HALF LEADS.

Figure 22. 16-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(RN-16)
Dimensions shown in millimeters and (inches)

Figure 20. 16-Lead Plastic Dual In-Line Package [PDIP]
Narrow Body
(N-16)
Dimensions shown in inches and (millimeters)

10.50 (0.4134)
10.10 (0.3976)

5.10
5.00
4.90

9

16

16

7.60 (0.2992)
7.40 (0.2913)

9

4.50
4.40
4.30

1

6.40
BSC
1

8

1.20
MAX

0.15
0.05
0.30
0.19
COPLANARITY
0.10

81.27 (0.0500)
BSC

PIN 1

0.65
BSC

0.50 (0.0197)⋅ 45°
0.25 (0.0098)

1.75 (0.0689)
1.35 (0.0531)

0.25 (0.0098)
0.10 (0.0039)

0.070 (1.78)
0.060 (1.52)
0.045 (1.14)

6.20 (0.2441)
5.80 (0.2283)

072506-B

910.30 (0.0118)
0.10 (0.0039)

0.20
0.09

SEATING
PLANE

8°
0°

0.75
0.60
0.45

COPLANARITY
0.10

0.51 (0.0201)
0.31 (0.0122)

10.65 (0.4193)
10.00 (0.3937)

2.65 (0.1043)
2.35 (0.0925)

SEATING
PLANE

0.50 (0.0197)
0.25 (0.0098)

45°

8°
0°
0.33 (0.0130)
0.20 (0.0079)

1.27 (0.0500)
0.40 (0.0157)

COMPLIANT TO JEDEC STANDARDS MS-013- AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FORREFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MO-153-AB

Figure 21. 16-Lead Thin Shrink Small Outline Package [TSSOP](RU-16)
Dimensions shown in millimeters

Figure 23. 16-Lead Standard Small Outline Package [SOIC_W]
Wide Body(RW-16)
Dimensions shown in millimeters and (inches)

Rev. D | Page 10 of 12

060606-A

16

ADM3202/ADM3222/ADM1385
0.920 (23.37)
0.900 (22.86)
0.880 (22.35)
18

6.60
6.50
6.40
10

1

0.280 (7.11)
0.250 (6.35)
0.240 (6.10)

920

0.100 (2.54)
BSC

0.060 (1.52)
MAX

0.210 (5.33)
MAX

0.015
(0.38)
MIN

0.150 (3.81)
0.130 (3.30)
0.115 (2.92)

4.50
4.40
4.30

0.195 (4.95)
0.130 (3.30)
0.115 (2.92)

0.015 (0.38)
GAUGE
PLANE

6.40 BSC
1

10

PIN 1

SEATING
PLANE

0.430 (10.92)
MAX

0.005 (0.13)
MIN

0.014 (0.36)
0.010 (0.25)
0.008 (0.20)

0.65
BSC
1.20 MAX

0.15
0.05

0.070 (1.78)
0.060 (1.52)
0.045 (1.14)

0.30
0.19

COPLANARITY
0.10

COMPLIANT TO JEDEC STANDARDS MS-001
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FORREFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
CORNER LEADS MAY BE CONFIGURED AS WHOLE OR HALF LEADS.

SEATING
PLANE

070706-A

Figure 26. 20-Lead Thin Shrink Small Outline Package [TSSOP](RU-20)Dimensions shown in millimeters
7.50
7.20
6.90

11.75 (0.4626)
11.35 (0.4469)

107.60 (0.2992)
7.40 (0.2913)
1

9

20

11

5.60
5.30
5.00

10.65 (0.4193)
10.00 (0.3937)
1

1.27(0.0500)
BSC

0.51 (0.0201)
0.31 (0.0122)

SEATING
PLANE

0.75 (0.0295)
0.25 (0.0098)
8°0°0.33 (0.0130)
0.20 (0.0079)

0.05 MIN
COPLANARITY
0.10

0.25
0.09

1.85
1.75
1.65

2.00 MAX

1.27 (0.0500)
0.40 (0.0157)

COMPLIANT TO JEDEC STANDARDS MS-013-AB
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FORREFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

8.20
7.80
7.40

10

45°

060706-A

2.65 (0.1043)
2.35 (0.0925)

0.30 (0.0118)
0.10 (0.0039)
COPLANARITY
0.10

0.75
0.60
0.45

8°
0°

COMPLIANT TO JEDEC STANDARDS MO-153-AC

Figure 24. 18-Lead Plastic Dual In-Line Package [PDIP]
Narrow Body
(N-18)
Dimensions shown in inches and (millimeters)

18

0.20
0.09

0.65 BSC

0.38
0.22

SEATING
PLANE

8°
4°
0°

0.95
0.75
0.55

COMPLIANT TO JEDEC STANDARDS MO-150-AE

Figure 27. 20-Lead Shrink Small Outline Package [SSOP](RS-20)Dimensions shown in millimeters

Figure 25. 18-Lead Standard Small Outline Package [SOIC_W]
Wide Body(RW-18)Dimensions shown in millimeters and (inches)

Rev. D | Page 11 of 12

060106-A

0.022 (0.56)
0.018 (0.46)
0.014 (0.36)

11

0.325 (8.26)
0.310 (7.87)
0.300 (7.62)

ADM3202/ADM3222/ADM1385
ORDERING GUIDEModel
ADM3202AN
ADM3202ANZ 1
ADM3202ARN
ADM3202ARN-REEL
ADM3202ARN-REEL7
ADM3202ARNZ1
ADM3202ARNZ-REEL1
ADM3202ARNZ-REEL71
ADM3202ARU
ADM3202ARU-REEL
ADM3202ARU-REEL7
ADM3202ARUZ1
ADM3202ARUZ-REEL1
ADM3202ARUZ-REEL71
ADM3202ARW
ADM3202ARW-REEL
ADM3202ARW-REEL7
ADM3202ARWZ1
ADM3202ARWZ-REEL1
ADM3202ARWZ-REEL71
ADM3222AN
ADM3222ANZ1
ADM3222ARSADM3222ARS-REEL
ADM3222ARS-REEL7
ADM3222ARSZ1
ADM3222ARSZ-REEL1
ADM3222ARSZ-REEL71
ADM3222ARU
ADM3222ARU-REEL
ADM3222ARU-REEL7
ADM3222ARUZ1
ADM3222ARUZ-REEL1
ADM3222ARUZ-REEL71
ADM3222ARW
ADM3222ARW-REEL
ADM3222ARW-REEL7
ADM3222ARWZ1
ADM3222ARWZ-REEL1
ADM3222ARWZ-REEL71
ADM1385ARS
ADM1385ARS-REEL
ADM1385ARS-REEL7
ADM1385ARSZ1
ADM1385ARSZ-REEL1
ADM1385ARSZ-REEL71
1

Temperature Range–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C–40°C to +85°C

Package Description
16-Lead Plastic Dual In-Line Package [PDIP]
16-Lead Plastic Dual In-Line Package [PDIP]
16-Lead Standard Small Outline Package [SOIC_N]
16-Lead Standard Small Outline Package [SOIC_N]
16-Lead Standard Small Outline Package [SOIC_N]
16-Lead Standard Small Outline Package [SOIC_N]
16-Lead Standard Small Outline Package [SOIC_N]
16-Lead Standard Small Outline Package [SOIC_N]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Standard Small Outline Package [SOIC_W]
16-Lead Standard Small Outline Package [SOIC_W]
16-Lead Standard Small Outline Package [SOIC_W]
16-Lead Standard Small Outline Package [SOIC_W]
16-Lead Standard Small Outline Package [SOIC_W]
16-Lead Standard Small Outline Package [SOIC_W]
18-Lead Plastic Dual In-Line Package [PDIP]
18-Lead Plastic Dual In-Line Package [PDIP]
20-Lead Shrink Small Outline Package [SSOP]
20-Lead Shrink Small Outline Package [SSOP]
20-Lead Shrink Small Outline Package [SSOP]
20-Lead Shrink Small Outline Package [SSOP]
20-Lead Shrink Small Outline Package [SSOP]
20-Lead Shrink Small Outline Package [SSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
18-Lead Standard Small Outline Package [SOIC_W]
18-Lead Standard Small Outline Package [SOIC_W]
18-Lead Standard Small Outline Package [SOIC_W]
18-Lead Standard Small Outline Package [SOIC_W]
18-Lead Standard Small Outline Package [SOIC_W]
18-Lead Standard Small Outline Package [SOIC_W]
20-Lead Shrink Small Outline Package [SSOP]
20-Lead Shrink Small Outline Package [SSOP]
20-Lead Shrink Small Outline Package [SSOP]
20-Lead Shrink Small Outline Package [SSOP]
20-Lead Shrink Small Outline Package [SSOP]
20-Lead Shrink Small Outline Package [SSOP]

Package Option
N-16
N-16
RN-16
RN-16
RN-16
RN-16
RN-16
RN-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RW-16
RW-16
RW-16
RW-16
RW-16
RW-16
N-18
N-18
RS-20
RS-20
RS-20
RS-20
RS-20
RS-20
RU-20
RU-20
RU-20
RU-20
RU-20
RU-20
RW-18
RW-18
RW-18
RW-18
RW-18
RW-18
RS-20
RS-20
RS-20
RS-20
RS-20
RS-20

Z = Pb-free part.

©2006 Analog Devices, Inc. All rights reserved. Trademarks andregistered trademarks are the property of their respective owners.
C00071-0-8/06(D)T

T

Rev. D | Page 12 of 12