swiss world connects

PGA / BGA / PLCC
SOCKETSPGA / BGA / PLCC SOCKETSQUICK SELECTOR CHART
PGA / BGA / PLCC
WWW.PRECIDIP.COM

TEL +41 32 421 04 00

SALES@PRECIDIP.COM

PGA
GRID

2.54 mm

INTERSTITIAL

SOCKETS
Solder tailBGA
1.27 mm

1.27 mm

PLCC
1 mm

SEE PAGE
156

161

165

173

Surface mount

156

161

165

166

169

172

Solderless compliant
press-fit

157

161

Carrier

158

162

Interconnect pin

158

162

165

167

Interconnect pin
surface mount

167

169

BGA pin-adapter

166

169

154

Due to technical progress, all information provided is subject to change without prior notice.

PGA / BGA / PLCC
GENERAL SPECIFICATIONS
WWW.PRECIDIP.COM

TEL +41 32 421 04 00

SALES@PRECIDIP.COM

The values listed below are general specs applying for PRECI-DIP PGA, BGA and PLCC sockets. Please see individual catalog page for additional
and product specific technical data.
OPERATING TEMPERATURE RANGE
CLIMATIC CATEGORY (IEC)
OPERATING HUMIDIT Y RANGE
MA X. WORKING VOLTAGE-55 ... +125 °C
55/125/21
Annual mean 75%
100 VRMS /150 VDC (2.54 mm grid)

PRECI-DIP connectors designated « Series Preci-Dip Connector » are recognized by UL LLC and listed under « Connectors for Use
in Data, Signal, Control and Power Applications », File Nr. E174442.

MECHANICAL CHARACTERISTICS
Min. 40 N (no displacement under axial force applied)
Min. 3.3 N acc. to MIL-DTL-83734, pt 4.6.4.2

CLIP RETENTIONCONTACT RETENTIONELECTRICAL CHARACTERISTICS
INSUL ATION RESISTANCE BETWEEN ANY TWO ADJACENT CONTACTSCAPACITANCE BETWEEN ANY TWO ADJACENT CONTACTS
SELF INDUCTANCE PER CONTACT

Min. 10’000 M: at 500 VAC
Max. 1 pF (PLCC max. 2 pF)
Max. 2 nH

ENVIRONMENTAL CHARACTERISTICS

PGA / BGA / PLCC SOCKETS

The sockets withstand the following environmental tests without mechanicaland electrical defects:• Dry heat steady state IEC 60512-11-9.11i / 60068-2-2.Bb: 125 °C, 16 h
• Damp heat cyclic IEC 60512-11-12.11m / 60068-2-30.Db: 25/55 °C, 90 – 100 %rH,
1 cycle of 24 h
• Cold steady state IEC 60512-11-10.11j / 60068-2-1.A: -55 °C, 2 h• Thermal shock IEC 60512-11-4.11d / 60068-2-14.Na: -55/125 °C, 5 cycles 30 min.
• Sinusoidal vibrations IEC 60512-6-4.6d / 60068-2-6.Fc: 10 to 500 Hz, 10 g,
1 octave/min., 10 cycles for each axis
• Shock IEC 60512-6-3.6c / 60068-2-27.Ea: 50 g, 11 ms, 3 shocks in three axis
During the above two tests, no contact interruption >50 ns does appear.
• Solderability J-STD-002A, Test A, 245 °C, 5 s, solder alloy SnAg3.8Cu0.7• Resistance to soldering heat J-STD-020C, 260 °C, 20 s
• Moisture sensitivity J-STD-020C level 1

SOLDERLESS COMPLIANT PRESS-FIT CHARACTERISTICSPRESS-FIT CHARACTERISTICS MEASURED ACC. TO IEC 60352-5• Press-in force:• Push-out force:• Push-out 3rd cycle:

90 N max. (at min. hole dia.) / 65 N typ.
30 N min. (at max. hole dia.) / 50 N typ.
20 N min. (at max. hole dia.)

PCB HOLE DIMENSIONS• 2.54 mm grid
• Interstitial grid

Finished hole Ø: 1 + 0.09/-0.06 mm
Drilled hole Ø: 1.15 ± 0.025 mm
Finished hole Ø: 0.7 + 0.09/-0.06 mm
Drilled hole Ø: 0.8 ± 0.02 mm

PCB HOLE PL ATINGPCB surface finish• Tin• Copper• Gold over nickel

Hole plating
5-15 μm tin over min. 25 μm copper
min. 25 μm copper
0.05-0.2 μm gold over 2.5-5 μm nickel
over min. 25 μm copper

Due to technical progress, all information provided is subject to change without prior notice.

155

PIN GRID ARRAY SOCKETSSOLDER TAIL / SURFACE MOUNTWWW.PRECIDIP.COM

TEL +41 32 421 04 00

SALES@PRECIDIP.COM

Pin grid array sockets, standard solder version and surface mount with floating contacts.

TECHNICAL SPECIFICATIONS (FOR GENERAL SPECS, SEE PAGE 155)
INSUL ATORFL AMMABILIT YSLEEVECONTACT CLIP (6 FINGER)ACCEPTED PIN ØFORCESMECHANICAL LIFERATED CURRENTCONTACT RESISTANCEDIELECTRIC STRENGTH

Black glass filled polyester PCT-GF30-FR
UL 94V-O
Brass CuZn36Pb3 (C36000)
Beryllium copper (C17200)
0.40 to 0.56 mm
0.7 N typ. insertion
0.4 N typ. withdrawal(polished steel gauge Ø 0.46 mm)
Min. 100 cycles
1A
Max. 10 m:
Min. 1’000 VRMS

ORDERING INFORMATION ROHS COMPLIANT PARTS
PP PL ATING CODESLEEVE

CLIP

87
83

Tin
Tin

Flash gold
0.75 μm gold

DIMENSIONS
Calculate with n1 = number of contacts in one line and n2 =characteristic size of the window
A = n1x2.54
B = (n1-1)x2.54
C = (n2x2.54)-0.40

Other plating on request (see page 178 for plating specs).
Replace NNN with the number of poles and XX-XXX with body sizeand layout numbers as indicated on pages 159 to 160.
For example a 17x17 pin configuration with window and 168 contacts
as shown on page 160 becomes 510-83-168-17-101101.
Options: please consult for availability- PGA sockets with optional standoffs- PGA sockets with solder tails, length 4.2 mm- PGA sockets with low profile contacts and solder tails of 2.8 mm length- PGA interconnect sockets with other contact lengths.

510-PP-NNN-XX-XXX101
PGA sockets with standard solder tails, length 3.17 mm.

514-PP-NNN-XX-XXX117
PGA sockets with self-aligning SMD floating contacts.
Contact diameter of soldering end 0.98 mm, allowing PCB pads
as small as 1.1 mm.

156

Due to technical progress, all information provided is subject to change without prior notice.

PIN GRID ARRAY SOCKETS
PRESS-FIT TERMINATIONS
WWW.PRECIDIP.COM

TEL +41 32 421 04 00

SALES@PRECIDIP.COM

Pin grid array sockets with compliant press-fit terminations.

TECHNICAL SPECIFICATIONS (FOR GENERAL SPECS, SEE PAGE 155)
INSUL ATORFL AMMABILIT YSLEEVECONTACT CLIP (6 FINGER)ACCEPTED PIN ØFORCESMECHANICAL LIFERATED CURRENTCONTACT RESISTANCEDIELECTRIC STRENGTH

Black glass filled polyester PCT-GF30-FR
UL 94V-O
Bronze CuSn4Pb4Zn4 (C54400)
Beryllium copper (C17200)
0.40 to 0.56 mm
0.7 N typ. insertion
0.4 N typ. withdrawal(polished steel gauge Ø 0.46 mm)
Min. 100 cycles
1A
Max. 10 m:
Min. 1’000 VRMS

ORDERING INFORMATION ROHS COMPLIANT PARTS
PP PL ATING CODESLEEVE

CLIP

87
83

Tin
Tin

Flash gold
0.75 μm gold

Other plating on request (see page 178 for plating specs).
Replace NNN with the number of poles and XX-XXX with body sizeand layout numbers as indicated on pages 159 to 160.
For example a 17x17 pin configuration with window and 168 contacts
as shown on page 160 becomes 546-83-168-17-101136.

DIMENSIONS
Calculate with n1 = number of contacts in one line and n2 =characteristic size of the window
A = n1x2.54
B = (n1-1)x2.54
C = (n2x2.54)-0.40

PGA / BGA / PLCC SOCKETS

546-PP-NNN-XX-XXX136
PGA sockets with solderless compliant press-fit terminationsfor 1.5 to 2.0 mm PCB thickness.
Hole diameter 1 (+0.09/-0.06) mm after metallization(Drill diameter 1.15±0.025 mm).

546-PP-NNN-XX-XXX135
PGA sockets with solderless compliant press-fit terminationsfor 2.1 to 3.2 mm PCB thickness.
Hole diameter 1 (+0.09/-0.06) mm after metallization(Drill diameter 1.15±0.025 mm).

Due to technical progress, all information provided is subject to change without prior notice.

157

PIN GRID ARRAY SOCKETS
INTERCONNECT PIN AND CARRIERS
WWW.PRECIDIP.COM

TEL +41 32 421 04 00

SALES@PRECIDIP.COM

Pin grid array sockets, interconnect pin and carriers with disposable plastic body.

TECHNICAL SPECIFICATIONS (FOR GENERAL SPECS, SEE PAGE 155)
INSUL ATORFL AMMABILIT YSLEEVECONTACT CLIP (3 FINGER)ACCEPTED PIN ØFORCESMECHANICAL LIFERATED CURRENTCONTACT RESISTANCEDIELECTRIC STRENGTH

Black glass filled polyester PCT-GF30-FR
UL 94V-O
Brass CuZn36Pb3 (C36000)
Beryllium copper (C17200)
0.40 to 0.56 mm
0.8 N typ. insertion
0.4 N typ. withdrawal(polished steel gauge Ø 0.46 mm)
Min. 100 cycles
1A
Max. 10 m:
Min. 1’000 VRMS

ORDERING INFORMATION ROHS COMPLIANT PARTS
PP PL ATING CODETERMINATIONCONNECTING PIN

10 (Serie 550)
80 (Serie 550)0.25 μm gold
Tin

0.25 μm gold
Tin

PP PL ATING CODESLEEVE

CLIP

87 (Serie 614)
83 (Serie 614)

Tin
Tin

Flash gold
0.75 μm gold

DIMENSIONS
Calculate with n1 = number of contacts in one line and n2 =characteristic size of the window

Other plating on request (see page 178 for plating specs).
Replace NNN with the number of poles and XX-XXX with body sizeand layout numbers as indicated on pages 159 to 160.
For example a 17x17 pin configuration with window and 168 contacts
as shown on page 160 becomes 550-10-168-17-101101.
Options: please consult for availability- PGA interconnect sockets with other contact lengths- PGA carrier sockets with other contacts.

A = n1x2.54
B = (n1-1)x2.54
C = (n2x2.54)-0.40

550-PP-NNN-XX-XXX101
PGA interconnect sockets with through hole solder tails
and connecting pin Ø 0.47 mm.

614-PP-NNN-XX-XXX112
PGA carrier sockets with disposable plastic body.
Low profile ultra thin contacts with solder termination Ø 0.95 mm
that requires Ø 1 mm holes in PCB.

158

Due to technical progress, all information provided is subject to change without prior notice.

PIN GRID ARRAY SOCKETS
2.54 mm GRID / FOOTPRINTS / TOP VIEW
TEL +41 32 421 04 00

SALES@PRECIDIP.COM

5x5…-012-05-001…

10x10…-064-10-051…

10x10…-068-10-061…

10x10…-084-10-031…

11x11…-068-11-061…

11x11…-073-11-061…

11x11…-084-11-042…

11x11…-085-11-041…

13x13…-088-13-081…

13x13…-100-13-062…

13x13…-100-13-063…

13x13…-101-13-061…

13x13…-114-13-061…

13x13…-121-13-061…

13x13…-124-13-041…

13x13…-128-13-041…

13x13…-132-13-041…

13x13…-144-13-041…

14x14…-132-14-071…

14x14…-133-14-071…

15x15…-145-15-081…

15x15…-149-15-063…

15x15…-177-15-061…

15x15…-181-15-051…

16x16…-175-16-072…

Due to technical progress, all information provided is subject to change without prior notice.

13x13…-114-13-062…

PGA / BGA / PLCC SOCKETS

WWW.PRECIDIP.COM

15x15…-176-15-061…

159

PIN GRID ARRAY SOCKETS
2.54 mm GRID / FOOTPRINTS / TOP VIEW
WWW.PRECIDIP.COM

TEL +41 32 421 04 00

SALES@PRECIDIP.COM

17x17…-168-17-101…

17x17…-169-17-101…

17x17…-192-17-081…

17x17…-207-17-081…

17x17…-208-17-081…

17x17…-209-17-081…

18x18…-179-18-111…

18x18…-179-18-112…

18x18…-191-18-091…

18x18…-223-18-091…

18x18…-224-18-091…

18x18…-225-18-091…

19x19…-238-19-101…

19x19…-280-19-081…

19x19…-281-19-081…

20x20…-257-20-111…

20x20…-299-20-091…

18x18…-241-18-071…

21x21…-273-21-121…

160

Due to technical progress, all information provided is subject to change without prior notice.

PIN GRID ARRAY SOCKETS
INTERSTITIAL / SOLDER TAIL / SURFACE MOUNTPRESS-FIT TERMINATIONS
WWW.PRECIDIP.COM

TEL +41 32 421 04 00

SALES@PRECIDIP.COM

Pin grid array sockets with interstitial contact rows, solder tails, surface mount floating contacts and solderless compliant.

TECHNICAL SPECIFICATIONS (FOR GENERAL SPECS, SEE PAGE 155)
INSUL ATORFL AMMABILIT YSLEEVECONTACT CLIP (6 FINGER)ACCEPTED PIN ØFORCESMECHANICAL LIFERATED CURRENTCONTACT RESISTANCEDIELECTRIC STRENGTH

Black glass filled polyester PCT-GF30-FR
UL 94V-O
Brass CuZn36Pb3 (C36000)(Bronze CuSn4Pb4Zn4 (C54400)
for press-fit contacts)
Beryllium copper (C17200)
0.40 to 0.56 mm
0.4 N typ. insertion
0.2 N typ. withdrawal(polished steel gauge Ø 0.46 mm)
Min. 100 cycles
1A
Max. 10 m:
Min. 700 VRMS

ORDERING INFORMATION ROHS COMPLIANT PARTS
PP PL ATING CODESLEEVE

CLIP

87
83

Tin
Tin

Flash gold
0.75 μm gold

DIMENSIONS
Calculate with n1 = number of contacts on the external row and n2 =characteristic size of the window

Other plating on request (see page 178 for plating specs).
Replace NNN with the number of poles and XX-XXX with body sizeand layout numbers as indicated on pages 163 to 164.
For example a 19x19 pin configuration with window and 296 contacts
as shown on page 163 becomes 517-83-296-19-131111.
Options: please consult for availability- PGA sockets with optional standoffs.

A = (n1x2.54)+1.30
B = (n1-1)x2.54
C = (n2x2.54)-0.40

PGA / BGA / PLCC SOCKETS

517-PP-NNN-XX-XXX111
Interstitial PGA sockets with through hole solder tails,
length 3.17 mm.

514-PP-NNN-XX-XXX154
Interstitial PGA sockets with self-aligning SMD floating contacts.
Contact diameter of soldering end 0.8 mm allowing PCB pads
with 0.9 mm diameter.

546-PP-NNN-XX-XXX147
Interstitial PGA sockets with solderless compliant press-fit
terminations for 1.2 to 2.5 mm PCB thickness.
Hole diameter 0.7 (+0.07/-0.05) mm after metallization(Drill diameter 0.85±0.025 mm).

Due to technical progress, all information provided is subject to change without prior notice.

161

PIN GRID ARRAY SOCKETS
INTERSTITIAL / INTERCONNECT PIN AND CARRIER
WWW.PRECIDIP.COM

TEL +41 32 421 04 00

SALES@PRECIDIP.COM

Pin grid array sockets with intersitial contact rows, interconnect pin and carriers with disposable plastic body.

TECHNICAL SPECIFICATIONS (FOR GENERAL SPECS, SEE PAGE 155)
INSUL ATORFL AMMABILIT YSLEEVE / PIN
CONTACT CLIP (3 FINGER)ACCEPTED PIN ØFORCESMECHANICAL LIFERATED CURRENTCONTACT RESISTANCEDIELECTRIC STRENGTH

Black glass filled polyester PCT-GF30-FR
UL 94V-O
Brass CuZn36Pb3 (C36000)
Beryllium copper (C17200)
0.40 to 0.56 mm
0.3 N typ. insertion
0.15 N typ. withdrawal(polished steel gauge Ø 0.46 mm)
Min. 100 cycles
1A
Max. 10 m:
Min. 700 VRMS

ORDERING INFORMATION ROHS COMPLIANT PARTS
PP PL ATING CODETERMINATIONCONNECTING PIN

10 (Serie 550)
80 (Serie 550)0.25 μm gold
Tin

0.25 μm gold
Tin

PP PL ATING CODESLEEVE

CLIP

87 (Serie 614)
83 (Serie 614)

Tin
Tin

Flash gold
0.75 μm gold

DIMENSIONS
Calculate with n1 = number of contacts on the external row and n2 =characteristic size of the window

Other plating on request (see page 178 for plating specs).
Replace NNN with the number of poles and XX-XXX with body sizeand layout numbers as indicated on pages 163 to 164.
For example a 19x19 pin configuration with window and 296 contacts
as shown on page 163 becomes 550-10-296-19-131135.
Options: please consult for availability- PGA pin header interconnect sockets with other contact lengths- PGA carrier sockets with other contacts.

A = (n1x2.54)+1.30
B = (n1-1)x2.54
C = (n2x2.54)-0.40

550-PP-NNN-XX-XXX135
Interstitial PGA interconnect sockets with through hole solder tails
and connecting pin Ø 0.44 mm.

614-PP-NNN-XX-XXX144
Interstitial PGA carrier sockets with disposable plastic bodyand low profile, ultra-thin contacts with Ø 0.84 mm
that requires Ø min 0.9 mm PCB holes.

162

Due to technical progress, all information provided is subject to change without prior notice.

PIN GRID ARRAY SOCKETS
INTERSTITIAL / FOOTPRINTS / TOP VIEW
WWW.PRECIDIP.COM

14x14…-183-14-091…

TEL +41 32 421 04 00

SALES@PRECIDIP.COM

14x14…-304-14-051…

14x14…-365-14-000…

17x17…-321-17-101…

17x17…-364-17-091…

17x17…-365-17-091…

17x17…-545-17-000…

18x18…-280-18-101…

18x18…-293-18-101…

18x18…-305-18-101…

18x18…-325-18-111…

18x18…-361-18-101…

18x18…-369-18-091…

18x18…-391-18-101…

18x18…-431-18-091…

19x19…-296-19-131…

19x19…-320-19-131…

19x19…-321-19-121…

19x19…-370-19-121…

19x19…-372-19-111…

19x19…-401-19-111…

Due to technical progress, all information provided is subject to change without prior notice.

163

PGA / BGA / PLCC SOCKETS

16x16…-299-16-091…

PIN GRID ARRAY SOCKETS
INTERSTITIAL / FOOTPRINTS / TOP VIEW
WWW.PRECIDIP.COM

TEL +41 32 421 04 00

SALES@PRECIDIP.COM

19x19…-403-19-111…

19x19…-419-19-111…

19x19…-420-19-111…

19x19…-428-19-101…

20x20…-411-20-111…

20x20…-447-20-121…

20x20…-539-20-101…

20x20…-557-20-091…

21x21…-475-21-121…

21x21…-528-21-121…

21x21…-529-21-121…

21x21…-565-21-111…

22x22…-503-22-131…

22x22…-559-22-131…

19x19…-429-19-101…

19x19…-463-19-101…

24x24…-599-54-131…

164

Due to technical progress, all information provided is subject to change without prior notice.

MICRO PIN GRID ARRAY
SOCKETS
WWW.PRECIDIP.COM

TEL +41 32 421 04 00

SALES@PRECIDIP.COM

1.27 mm GRID / SOLDER TAIL / SURFACE MOUNT / INTERCONNECT PIN

Micro pin grid array sockets (μPGA) with contacts placed on 1.27 mm grid, solder tail, surface mount and interconnect pin.

TECHNICAL SPECIFICATIONS (FOR GENERAL SPECS, SEE PAGE 155)
INSUL ATORFL AMMABILIT YSLEEVE / PIN
CONTACT CLIP (6 FINGER)ACCEPTED PIN ØFORCESMECHANICAL LIFERATED CURRENTCONTACT RESISTANCEDIELECTRIC STRENGTH

Glass-epoxy laminate FR4
UL 94V-O
Brass CuZn36Pb3 (C36000)
Beryllium copper (C17200)
0.30 to 0.35 mm
0.2 N typ. insertion
0.15 N typ. withdrawal(polished steel gauge Ø 0.3 mm)
Min. 100 cycles
1A
Max. 10 m:
Min. 500 VRMS

ORDERING INFORMATION ROHS COMPLIANT PARTS
PP PL ATING CODESLEEVE

CLIP

77 (Serie 518)

Flash gold

Flash gold

PP PL ATING CODETERMINATIONCONNECTING PIN

10 (Serie 558)

0.25 μm gold

0.25 μm gold

DIMENSIONS
Calculate with n1 = number of contacts in one line and n2 =characteristic size of the window

Other plating on request (see page 178 for plating specs).
Replace NNN with the number of poles and XX-XXX with body sizeand layout numbers as indicated on page 168.
For example a 26x26 pin configuration with window and 478 contacts
as shown on page 168 becomes 518-77-478M26-131105.
Options: please consult for availability- μPGA interconnect headers for SMD mount.

A = (n1x1.27)+1.27
B = (n1-1)x1.27
C = (n2x1.27)-0.40

PGA / BGA / PLCC SOCKETS

518-77-NNNMXX-XXX105
PGA sockets 1.27 mm grid with through hole solder tails length 2.79 mm.

518-77-NNNMXX-XXX106
PGA sockets 1.27 mm grid, surface mount.
Contact diameter of soldering end 0.31 mm allowing PCB pads with
0.4 mm diameter.

558-10-NNNMXX-XXX101
PGA 1.27 mm grid, interconnect sockets with through hole solder tail andconnecting pin Ø 0.31 mm.

Due to technical progress, all information provided is subject to change without prior notice.

165

BALL GRID ARRAY SOCKETS
1.27 mm GRID / SURFACE MOUNT / SOCKET AND ADAPTER
WWW.PRECIDIP.COM

TEL +41 32 421 04 00

SALES@PRECIDIP.COM

Ball grid array sockets and adapters, surface mount.

TECHNICAL SPECIFICATIONS (FOR GENERAL SPECS, SEE PAGE 155)
INSUL ATORFL AMMABILIT YSLEEVE / PIN
CONTACT CLIP (4 FINGER)ACCEPTED PIN ØFORCESMECHANICAL LIFERATED CURRENTCONTACT RESISTANCEDIELECTRIC STRENGTH

Glass-epoxy laminate FR4
UL 94V-O
Brass CuZn36Pb3 (C36000)
Beryllium copper (C17200)
0.36 to 0.46 mm
0.3 N typ. insertion
0.15 N typ. withdrawal(polished steel gauge Ø 0.43 mm)
Min. 100 cycles
1A
Max. 10 m:
Min. 500 VRMS

ORDERING INFORMATION ROHS COMPLIANT PARTS
PP PL ATING CODESLEEVE

CLIP

87 (Serie 514)
83 (Serie 514)

Tin
Tin

Flash gold
0.75 μm gold

PP PL ATING CODETERMINATIONCONNECTING PIN

10 (Serie 550)
80 (Serie 550)0.25 μm gold
Tin

0.25 μm gold
Tin

Other plating on request (see page 178 for plating specs).
Replace NNN with the number of poles and XX-XXX with body sizeand layout numbers as indicated on page 168.
For example a 20x20 pin configuration with 256 contacts as shownon page 168 becomes 514-83-256M20-001148.

DIMENSIONS
Calculate with n1 = number of contacts in one line
for sockets
A = (n1x1.27)+1.27
B = (n1-1)x1.27
for adapters
A = (n1x1.27)+3.27
B = (n1-1)x1.27

514-PP-NNNMXX-XXX148
BGA sockets 1.27 mm grid with self-aligning surface mount floating contacts.
Same foot print as the BGA device, to mate with the corresponding adapter.

550-10-NNNMXX-XXX166
BGA adapter 1.27 mm grid pluggable into the corresponding socket.
Connecting pin Ø 0.42 mm.
BGA device is SMD soldered on the solder pads.

➂

BGA socket and adapter systems are the reliable solution to make BGAs pluggable:- the BGA socket Series 514 ➀ is soldered to the PCB in place of the BGA device
and using the same footprint- the BGA device ➂ is soldered to the adapter Series 550 ➁- the BGA + adapter sub-assembly is plugged into the socket

➁

166

➀

Due to technical progress, all information provided is subject to change without prior notice.

BALL GRID ARRAY SOCKETS
1.27 mm GRID / INTERCONNECT PIN / SOLDER TAIL / SURFACE MOUNTWWW.PRECIDIP.COM

TEL +41 32 421 04 00

SALES@PRECIDIP.COM

Ball grid array interconnect pin, through hole solder tail and surface mount.

TECHNICAL SPECIFICATIONS (FOR GENERAL SPECS, SEE PAGE 155)
INSUL ATORFL AMMABILIT Y
CONTACTMECHANICAL LIFERATED CURRENTCONTACT RESISTANCEDIELECTRIC STRENGTH

Glass-epoxy laminate FR4
UL 94V-O
Brass CuZn36Pb3 (C36000)
Min. 100 cycles
1A
Max. 10 m:
Min. 500 VRMS

ORDERING INFORMATION ROHS COMPLIANT PARTS
PP PL ATING CODETERMINATIONCONNECTING PIN

100.25 μm gold

0.25 μm gold

Other plating on request (see page 178 for plating specs).
Replace NNN with the number of poles and XX-XXX with body sizeand layout numbers as indicated on page 168.
For example a 20x20 pin configuration with 256 contacts as shownon page 168 becomes 550-10-256M20-001152.

DIMENSIONS
Calculate with n1 = number of contacts in one line

A = (n1x1.27)+3.27
B = (n1-1)x1.27

PGA / BGA / PLCC SOCKETS

550-10-NNNMXX-XXX152
BGA interconnect sockets 1.27 mm grid, through hole solder tails
and connecting pin Ø 0.40 mm.

558-10-NNNMXX-XXX104
BGA interconnect sockets 1.27 mm grid, with surface mount terminations
and connecting pin Ø 0.41 mm.

Due to technical progress, all information provided is subject to change without prior notice.

167

BALL/PIN GRID ARRAY
SOCKETS
WWW.PRECIDIP.COM

TEL +41 32 421 04 00

16x16…-192M16-001…

16x16…-255M16-001…

19x19…-357M19-001…

19x19…-360M19-001…

20x20…-400M20-000…

26x26…-352M26-001…

26x26…-356M26-001…

29x29…-480M29-001…

29x29…-504M29-001…

31x31…-432M31-001…

31x31…-520M31-001…

168

1.27 mm GRID / FOOTPRINTS / TOP VIEW

SALES@PRECIDIP.COM

16x16…-256M16-000…

20x20…-256M20-001…

17x17…-120M17-001…

17x17…-233M17-001…

20x20…-272M20-001…

20x20…-292M20-001…

23x23…-304M23-001…

23x23…-385M23-001…

26x26…-388M26-001…

26x26…-420M26-001…

26x26…-456M26-001…

30x30…-500M30-001…

30x30…-576M30-001…

33x33…-560M33-001…

35x35…-600M35-001…

31x31…-956M31-001…

24x24…-575M24-001…

26x26…-478M26-131…

35x35…-652M35-001…

Due to technical progress, all information provided is subject to change without prior notice.

BALL GRID ARRAY SOCKETS
1 mm GRID / SURFACE MOUNT SOCKET, ADAPTER / INTERCONNECT PIN
WWW.PRECIDIP.COM

TEL +41 32 421 04 00

SALES@PRECIDIP.COM

Ball grid array sockets and adapter surface mount.

TECHNICAL SPECIFICATIONS (FOR GENERAL SPECS, SEE PAGE 155)
INSUL ATORFL AMMABILIT YSLEEVE / PIN
CONTACT CLIP (3 FINGER)ACCEPTED PIN ØFORCESMECHANICAL LIFERATED CURRENTCONTACT RESISTANCEDIELECTRIC STRENGTH

Glass-epoxy laminate FR4
UL 94V-O
Brass CuZn36Pb3 (C36000)
Beryllium copper (C17200)
0.20 to 0.30 mm
0.4 N typ. insertion
0.2 N typ. withdrawal(polished steel gauge Ø 0.25 mm)
Min. 100 cycles
1A
Max. 10 m:
Min. 500 VRMS

ORDERING INFORMATION ROHS COMPLIANT PARTS
PP PL ATING CODESLEEVE

CLIP

11 (Serie 514)

0.25 μm gold

0.25 μm gold

PP PL ATING CODETERMINATIONCONNECTING PIN

10 (Serie 558)

0.25 μm gold

0.25 μm gold

Other plating on request (see page 178 for plating specs).
Please consult for complete part number and available footprints.
Options: please consult for availability- Through hole adapter.

DIMENSIONS
Calculate with n1 = number of contacts in one line

A = n1+2.81
B = n1-1

PGA / BGA / PLCC SOCKETS

514-11-NNNPXX-XXX159
BGA sockets 1 mm grid, surface mount.
Same foot print as the BGA device to mate with the corresponding
adapter.

558-10-NNNPXX-XXX102
BGA adapter 1 mm grid, pluggable into the corresponding socket.
Connecting pin Ø 0.25 mm.
BGA device is SMD soldered on the solder pads.

558-10-NNNPXX-XXX103
BGA interconnect sockets 1 mm grid with surface mount terminations
and connecting pin Ø 0.25 mm.

Due to technical progress, all information provided is subject to change without prior notice.

169

BALL/PIN GRID ARRAY
SOCKETS
WWW.PRECIDIP.COM

TEL +41 32 421 04 00

PART NUMBER IDENTIFICATIONSALES@PRECIDIP.COM

TYPE OF SOCKET

Standard PGA, Interstitial PGA and μPGA

PAGE

510-...01
514-...34
514-...54
517-...11518-...05
518-...06
546-...35
546-...36
546-...47
550-...01
550-...35
558-...01
614-...12614-...44

Solder pin 2.54 mm grid
SMD 2.54 mm grid
SMD interstitial
Solder pin interstitial
Solder pin 1.27 mm grid
SMD 1.27 mm grid
Press-fit 2.54 mm, PCB 2.1-3.2 mm
Press-fit 2.54 mm, PCB 1.5-2.0 mm
Press-fit interstitial
Interconnect, solder pin, 2.54 mm gridInterconnect, solder pin, interstitial
Interconnect, solder pin, 1.27 mm grid
Carrier 2.54 mm grid
Carrier interstitial

156
156
161
161
165
165
157
157
161
158
162
165
158
162

Socket SMD, 1.27 mm grid
Socket SMD, 1 mm grid
Adapter, 1.27 mm gridInterconnect, solder pin, 1.27 mm grid
Adapter, 1 mm gridInterconnect SMD, 1 mm gridInterconnect SMD, 1.27 mm grid

166
169
166
167
169
169
167

BGA
514-...48
514-...59
550-...66
550-...52
558-...02
558-...03
558-...04

XXX – PP – NNN X XX – XXX 1 XX

PLATING CODE ROHS COMPLIANT
PARTS
CODE

SLEEVE

CLIP

77
83
87

Flash gold
Tin
Tin

Flash gold
0.75 μm gold
Flash gold

10
80

170

TERMINATIONCONNECTING PIN

0.25 μm gold
Tin

0.25 μm gold
Tin

TOTAL
NUMBER
OF PINS

Grid:

SIZE OFBODY

SIZE OF WINDOW AND FOOTPRINT– 2.54 mm or interstitial
M 1.27 mm gridP 1 mm gridSee pages 159, 160, 163, 164 and 168 for most popular footprints.

Due to technical progress, all information provided is subject to change without prior notice.

BALL/PIN GRID ARRAY
SOCKETS
WWW.PRECIDIP.COM

TEL +41 32 421 04 00

SALES@PRECIDIP.COM

If the desired footprint does not exist in this catalogue,
please photocopy this page, complete it and send it to yourlocal PRECI-DIP distributor.

CUSTOM GRID DESIGNYour address

ORDERING INFORMATION

Type of socket (see opposite page)

Plating code PP (see opposite page)

Grid
Standard 2.54 mm
Interstitial
1.27 mm
1 mm

Size of body

TOP VIEW

PGA / BGA / PLCC SOCKETS

x
Semiconductor device used

Quantity

EXAMPLE

Fill in the positionof pins

Mark of thewindow

Due to technical progress, all information provided is subject to change without prior notice.

171

SOCKETS FOR PLASTIC LEADEDCHIP CARRIERS (PLCC)
WWW.PRECIDIP.COM

TEL +41 32 421 04 00

SMT TERMINATIONSSALES@PRECIDIP.COM

Series 540 PLCC sockets with SMT terminations come with square sizes for IC-packages according to JEDEC MO-047 and rectangular size (32) according
to JEDEC MO-052, low profile.

TECHNICAL SPECIFICATIONS (FOR GENERAL SPECS, SEE PAGE 155)

CAPACITANCE

Glass filled thermoplastic PPS-GF30-FR
UL 94V-O
Phosphor bronze
Min. 1.5 N per contact
Min. 50 cycles
1A
Max. 20 m:
Min. 600 VRMS
Min. 5’000 M:
Max. 2 pF

COPL ANARIT Y
SMD TERMINATIONS

Max. 0.1 mm

INSUL ATORFL AMMABILIT Y
CONTACT
CONTACT PRESSUREMECHANICAL LIFERATED CURRENTCONTACT RESISTANCEDIELECTRIC STRENGTHINSUL ATION RESISTANCE

ORDERING INFORMATION ROHS COMPLIANT PARTS
PP PL ATING CODETERMINATIONCONTACT

88

Tin

Tin

Option: parts with positioning pegs add suffix -2 to part number (onlyavailable for No. of poles 32 and 68).
Tape & Reel packaging:
add suffix -TR to part number (except for 540-88-084-17-400).
Please consult www.precidip.com for availability size of tape, size of
reel, number of components per reel and packing units.
NO. OF POLES

A1/A2

20
28

14.86 7.02 9.20 4.60
17.34 9.50 11.76 4.60
16.95 / 9.40 / 11.60 /
3.80
19.50 11.90 14.20
22.42 14.50 16.70 4.60
25.40 17.24 19.46 4.60
30.54 22.26 24.40 4.60
35.56 27.34 29.58 4.60

32*

* RECTANGUL AR

44
52
68
84

B1/B2

C1/C2

D

E

ORDER CODES

16.20
19.70

540-88-020-17-400
540-88-028-17-400

22.00

540-88-032-17-400

27.00
30.80
37.65
45.10

540-88-044-17-400
540-88-052-17-400
540-88-068-17-400
540-88-084-17-400

PCB LAYOUT SERIES 540, SMD TYPES

172

Due to technical progress, all information provided is subject to change without prior notice.

SOCKETS FOR PLASTIC LEADEDCHIP CARRIERS (PLCC)
WWW.PRECIDIP.COM

TEL +41 32 421 04 00

SOLDER TAIL

SALES@PRECIDIP.COM

Series 540 PLCC sockets, solder tail, with precision stamped contacts providing component retention thanks to positive spring action.

TECHNICAL SPECIFICATIONS (FOR GENERAL SPECS, SEE PAGE 155)
INSUL ATORFL AMMABILIT Y
CONTACTMECHANICAL LIFERATED CURRENTCONTACT RESISTANCEDIELECTRIC STRENGTHINSUL ATION RESISTANCECAPACITANCE

Glass filled thermoplastic PPS-GF40-FR
UL 94V-O
Phosphor bronze
Min. 25 cycles
1A
Max. 30 m:
Min. 500 VRMS
Min. 1’000 M:
Max. 1 pF

ORDERING INFORMATION ROHS COMPLIANT PARTS
PP PL ATING CODETERMINATIONCONTACT

88

Tin

Tin

* RECTANGUL AR

NO. OF
POLES

A1

28
32*
44
52
68
84

18.20 18.20 7.62 7.62 11.91 11.91 22.11 540-88-028-24-008
18.20 20.74 7.62 10.16 11.91 14.45 23.90 540-88-032-24-008
23.28 23.28 12.70 12.70 16.99 16.99 29.23 540-88-044-24-008
25.82 25.82 15.24 15.24 19.53 19.53 32.85 540-88-052-24-008
30.90 30.90 20.32 20.32 24.61 24.61 40.03 540-88-068-24-008
35.98 35.98 25.40 25.40 29.69 29.69 47.21 540-88-084-24-008

A2

B1

B2

C1

C2

D

ORDER CODES

Due to technical progress, all information provided is subject to change without prior notice.

PGA / BGA / PLCC SOCKETSPCB HOLE PATTERNS SERIES 540, THRU-HOLE TYPES

173

www.precidip.com
PRECI-DIP SA
PHONE

Rue Saint-Henri 11 P.O.Box 834 CH-2800 Delémont / Switzerland+41 (0)32 421 04 00

FA X+41 (0)32 421 04 01

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