Call for Papers

ICEP-IAAC 2025
2025 International Conference on Electronics Packaging
and iMAPS All Asia Conference

Date: April 15 - 19, 2025 “On-site Only”
Venue: Wakasato Municipal Cultural Hall, Nagano, Japan
Sponsor: The Japan Institute of Electronics Packaging (JIEP)Technical Co-Sponsors: IEEE EPS, IEEE EPS Japan Chapter,iMAPS, SMTA

Major Topics
Advanced Packaging-2.xD/3D, TSV/TGV-Substrates/interposers/RDL-Fan-out/in packaging-Wafer/panel level packaging-Automotive and IoT applications-High-performance computing-Heterogeneous integration technologies-Chiplet packaging-Hybrid bonding-Other related technologies
Emerging Technologies-Health/medical care and cosmetics devices-Stretchable/flexible electronics-Sensor and MEMS/NEMS/MOEMS packaging-Batteries and eco-friendly devices-Advanced MEMS/NEMS/MOEMS technologies-Packaging for quantum computing-Other related technologies
High-Speed, Wireless & Components-3D-printed components-Antennas, RFs, and sensor modules-Highspeed applications (5G, LTE etc.)-Automotive and IoT applications-Other related technologies
Power Electronics-Power device and module fabrication (HEMT, diode, IPM etc.)-Advanced Inverter & converter-Super capacitor-Harsh environment tolerant device & module-Si-based MOSFET, BJT, IGBT
-Other relating technologies
Thermal Management-Advanced cooling technologies-Thermal management structures (heat sinks, pipes, etc.)-Simulation, measurement, and evaluation methods-Other related technologies

Interconnections-Interconnection methods (flip-chip, wire-bonding etc.)-2.xD/3D, TSV/TGV, fan-out/in interconnections-Embedded systems-Power electronics interconnections-Bio/medical and eco-friendly devices-Hybrid bonding-Other related technologies
Materials and Processes-Homo/heterogeneous bonding/assembly-Substrates, interposers and panels-Metallic materials & processes (plating, soldering etc.)-Organic semiconductors (OLED, OFET, OPV etc.)-Power electronic/battery materials & processes-Optoelectronic materials & processes-Additive manufacturing (compound, paste, 3D printing etc.)-Die to Wafer, Wafer to Wafer, Debonding-Other related technologies
Design, Modeling, and Reliability-2.xD/3D, TSV/TGV, WLCSP, Fan-out/in-Advanced reliability evaluation (PDfR etc.)-High performance board design-Novel test methods and life models (LCA, TCAD etc.)-Other related technologies
Optoelectronics-3D/silicon photonics technologies-Optical connectors, waveguides, & transceivers-Device fabrication (LED, laser, sensor, etc.)-Mid/on-board module fabrication-Optical wafer/chip-scale packaging-Co-packaged optics-Other related technologies
Other Upcoming Technologies-New system concept & design-Any other topics related to ICEP scope

Please turn over.

Abstract and Paper Submission Deadline
Abstract Deadline and Paper Submission

Important dates
Abstract submission open: September 1, 2024
Abstract deadline: October 31, 2024
Notification of acceptance: December 15, 2024
Final manuscript deadline: January 31,2025• Please submit your abstract using the template available at the conference website.
https://www.jiep.or.jp/icep/ You must include the novel, original, and unpublishedcontents and state the purposes, methods, results, and conclusions clearly in theabstract.
• Once an abstract has been accepted, a final 2 pages paper in double column format
will be requested by the due date.
• Accepted papers will be submitted for inclusion into IEEE Xplore as well as other
Abstracting and Indexing (A&I) databases (EI Compendex and INSPEC).
• The authors are required to release the copyright of all submitted contents in their
final manuscripts. For details, visit: https://ux.nu/o27ui• Authors of presented papers are strongly encouraged to submit their full paper (4-10pages) to the Transactions of The Japan Institute of Electronics Packaging (a peerreviewed international journal, https://www.jstage.jst.go.jp/browse/jiepeng/-char/en).
• IEEE reserves the right to exclude a paper from distribution after the conference,
including IEEE Xplore® Digital Library, if the paper is not presented by the author atthe conference.

About ICEPICEP is the largest international conference on electronic packaging in Japan, attracting
more than 600 attendees and hosting about 35 technical sessions. ICEP provides astrong platform to demonstrate your technologies and products as well as expand yourcustomer network. It is jointly sponsored by JIEP, IEEE EPS, IEEE EPS Japan Chapter,iMAPS, and SMTA. The conference has technical sessions covering a wide range oftopics including advanced packaging, design, modeling and reliability, emerging
technologies, high-speed, wireless & components, interconnections, materials andprocesses, optoelectronics, power electronics integration, and thermal management.
Since its inauguration in 2001, ICEP has developed into a highly reputed electronics
packaging conference in Japan, attended by world-renowned experts in all aspects
related to packaging technologies from all over the world. In 2025, International
Conference on Electronics Packaging joined with iMAPS All Asia Conference (ICEPIAAC 2025).

Registration Fees
Member of JIEP / IEEE / IMAPS: 45,000 JPY
Non-Member: 60,000 JPY
Students: 20,000 JPY
Registration Fees include Reception and Proceedings.

Sponsorship Opportunities

Outstanding Technical Paper Award

We invite you to be a sponsor, which entitles your company to be exposed to theattendees in and outside the conference rooms. The sponsorship for ICEP 2025 ranges
Description: This award recognizes the outstanding papers on electronics packaging
from 500,000 yen to 50,000 yen. As a sponsor, your company’s name and logo will bepresented at ICEP. The award will be given to the presenting author and co-authors of
published in the conference’s official program and will appear on the ICEP website as
the outstanding papers.
well as various conference banners. Furthermore, a tabletop exhibition booth is available
Funding: The award is sponsored by JIEP.
for the diamond, platinum, and gold sponsors to demonstrate and promote yourEligibility: The presenter must be listed as one of the paper's authors. Conference
papers must be submitted on or before the due date.
products/services. Please contact the conference secretary for details.
Basis for Judging: Papers are judged based on technical merit, originality, relevanceand potential impact on the field, quality of the written paper, and qualityof theOrganizing
Committee
Agendaconference presentation.

IEEE EPS Japan Chapter Young Award
Description:
award must
recognizes
theasexcellent
on electronics
packaging
Eligibility: TheThis
presenterbe listed
an author.papers
Conference
papers must
bepresentedby or
young
scientists
submitted on
beforethe dueand
date.engineers at ICEP. This award will be given to thepresenting author of the excellent papers.
Funding: The award is sponsored by IEEE EPS Japan Chapter.
Eligibility: The presenter must be listed as the paper’s first author. The presenter mustbe younger than 35 on December 31 of the presentation year. Previous winners of thisaward are not eligible. Conference papers must be submitted on or before the due date.
The award recipient must be a member of IEEE and EPS at the time the award isreceived.
Basis for Judging: Papers are judged based on technical merit, originality, relevanceand potential impact on the field, quality of the written paper, and quality of theconference presentation.

JIEP Poster Award
Description: This award recognizes the excellent work by poster presenters at ICEP.
The award will be given to the presenting author and co-authors of the excellent
papers.
Funding: The award is sponsored by JIEP.
Eligibility: The presenter must be listed as one of their paper's authors. Conference
papers must be submitted on or before the due date.
Basis for Judging: Papers are judged based on technical merit, originality, relevanceand potential impact on the field, quality of the written paper, and quality of theconference presentation.

April 15th (afternoon): IAAC special session
April 16th: Keynote lectures, Award ceremony, Welcome reception
April 17th: Technical sessions, Sponsor exhibition’s party
April 18th: Technical sessions
April 19th: Excursion

Organizing Committee
General Chair:T. Sakai, FICTGeneral Vice Chairs: Y. Morikawa, ULVAC
R. Endo, Rapidus
T. Ishigure, Keio University

Contact
Secretariat of ICEP 2025
The Japan Institute of Electronics Packaging (JIEP)
E-mail: icep2025@jiep.or.jp
URL: https://www.jiep.or.jp/icep/© TCVB