■ Oita

LSI Cluster s Concept■ OitaLSI Cluster s Vision■ Companies

Regional Map■ Companies

Technology Map

OITA LSI Cluster Concept

OITA LSI Cluster Projects

The OITA LSI Cluster concept was formulated with the aim of generating more dynamic industrial activity in Oita
Prefecture and achieving community and enterprise development and revitalization through both collaboration andcompetition. Oita LSI Cluster Promotion Council, established in April 2005, seeks to develop clusters of locally-based
enterprises and major firms that have established operations in the prefecture, and utilize their technologicalstrengths to create a 21st-century hub for semiconductor production that is internationally competitive in terms of
quality, cost and turnaround time. This task involves the development of networks bringing together partners fromindustry, academia and government, and strategic initiatives to further integrate our prefecture’s advanced manufacturing technologies.

Oita LSI Cluster Promotion Council has instituted a medium-range vision formulated primarily through its Planning
Committee in the 2008 fiscal year.

Testingtechnology
upgradingComponent
cleaning
technology
upgrading

Manufacturing
Material
equipment
information
information

Partnerships across industry,
academia and government

Advisors

Vice Chairperson

Engineer Advisors

Enterprises

Financial
institutions

WorkinggroupsGovernmentalorgansGathering and providing information on technologies and needs of customers
worldwide.

Executive Director
Trustees(Administrative Board)

Planning Committee

Expert Subcommittee

Assessment andScreening Committee

Secretariat

Technical consulting

Fostering businesspeople of global standard.

The specialist divisions for Research and Development, Human Resource Development, Market Cultivation /Information Services, and Member Interchange are each pursuing specific initiatives under the following sub-themes(strategies) developed in line with the medium-range vision.
Research and Development

Chairperson

Cultivating Human Resource of global standard.

Market Cultivation / Information Services

Market Cultivation/ Information Services

Oita LSI Cluster Promotion Council

Educational
institutions

Human Resource Development

Member Interchange

The core element of the Oita LSI Cluster concept is engagement with the testing technologies (evaluation
processes) essential to the manufacture of semiconductors. We aim to create a “semiconductor clinic” that delivers
solutions based on scientific diagnosis and systematic technology development, accumulates and disseminates
information and the results of impartial evaluation, and offers counseling as appropriate. To this end, we are implementing a range of specific initiatives around the four functional pillars of Research and Development, Human
Resource Development, Market Cultivation / Information Supplement, and Member Interchange.
The acronym “LSI” used in the concept’s title stands for the Large Scale Integrated circuits in semiconductors, butalso incorporates the idea of Large Scale Integration of semiconductor-related enterprises in Oita prefecture for the
purpose of advancing industrial activity.

Generating new world-leading technologies.

Cultivating and developing engineers with broad

1.

Realizing successful case models for businesslinkage and development of new technologies.

1. outlooks.

2.

Proposing developments in screening andevaluation systems.

2. Operating projects led by working groups.

3.

Organizing mid-term reporting sessions andperformance brieﬁngs for working groups.

4.

Market research and market development
assistance in relation to research themes.

5.

Research and development for productivity
improvements, etc.

6.

Periodical information exchange with theacademic sector.

1.

Surveys and research on Joint tendering andother business models.

2.

Formulating systems for self-diagnosis ofcommercial position.

3.

Increasing knowledge-gathering and provisionof information to member enterprises.

4.

Supporting business matching.

5.

Bolstering information dissemination functions.

Human Resource
Development

Industrial
waste
treatment
technology

Member Interchange

Members

OITA LSI Cluster Concept
Research and Development

Research and Development

Market Cultivation / Information Services

Importing global information, exporting Oitaʼs innovations!

Semiconductor clinics

Oita LSI Cluster Promotion Council
Human Resource Development

SloganAugmenting training for technical personnel

3. based on the needs of member enterprises.

4. Bolstering partnerships with universities, etc.
Engaging expert instructors from other5. organizations.

Expanding basic education and training for6. new personnel.

Supporting the maintenance of employment

7. opportunities.

Organizing meetings for interaction among

Member Interchange

OITA LSI Cluster Concept

OITA LSI Cluster Medium-Range Vision

1. top-level executives from both within and beyond
the prefecture.

Exchange and network-building with clusters in

2. other regions and beyond Japan.

Collaboration with the Kyushu Semiconductor

3. Industries and Technology Innovation Association.

Oita Prefecture
Semiconductor Affiliated Companies
Regional Map
Information current as of August 1, 201110
Bungo-takada City Kunisaki City

3
Nakatsu City

7
Kitsuki City

8
Usa City

Oita Airport

11
Hiji Town

12
Kusu Town

2
Beppu City

4
Hita City
Kokonoe Town

9
Yufu City

1
Oita City

6
Usuki City Tsukumi City
Taketa City

Bungo-ono City

3

5
Saiki City

Current as of August 1, 2011
Region No.

1

2

3

4
5
6
7
8
9
10

11

12

Region

No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
Oita City
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
Beppu City 53
54
55
NakatsuCity
56
57
Hita City
58
59
Saiki City 60
61
Usuki City 62
63
KitsukiCity
64
65
Usa City
66
67
Yufu City
68
69
Kunisaki
City
70
71
72
73
74
75
76
Hiji Town 77
78
79
80
81
82
83
84
Kusu Town
85

Company Name
Telephone
Postal Code
Address
097-558-3758 870-0138 3-2-18 Harukawa, Oita City
Agawa Mekki Inc. Industrial Park
Adachi Chemical Plants Co., Ltd.
097-521-1215 870-0274 1316-1 Tanegu Dainoue, Oita City
Advantest Corporation
097-555-9570 870-0919 3-8 Shinsakae Machi, Oita City
Aberuf Inc.
097-537-3811 870-0037 Astion Kasuga #610, 6-6 Higashi-Kasuga-machi, Oita City
Ulvac Techno Co., Oita CS Center
097-522-3803 870-0278 1-12-41 Aosaki, Oita City
Ishii Tool & Engineering Corp.
097-544-1001 870-0823 2-5-60 Higashi Omichi, Oita City
InfoWave, Inc.
097-573-7478 870-0023 Coop Nakamura, 1F, 2-11-18 Nagahama, Oita City
Willtec Kyushu Co., Oita Support Center
097-513-2488 870-0034 Oita Center Bldg., 8F, 3-1-1 Miyako-machi, Oita City
Ueki Corporation, Oita Offices
097-520-5880 870-0125 4353 Oaza Matsuoka, Oita City
SS-Avenue Co, Ltd.
097-573-3335 870-0037 Oita Sofia Plaza Bldg. 4F, 17-19 Higashi Kasuga Machi, Oita City
SMC Corporation, Oita Branch Office097-558-1807 870-0918 4-6 Hiyoshi Machi, Oita City
S-Craft Co., Ltd.
097-521-0750 870-0242 1-1-5 Tsunoko Minami, Oita CitySTK Technology Co., Ltd.
097-527-2161 870-0108 2468-10 Oaza Misa, Oita City
Espec Kyushu Corp., Oita Branch097-551-7343 870-0921 4-4-38 Hagiwara, Oita City
Eto Manufacturing Co., Ltd.
097-521-1834 870-0145 4-7 Otozu Machi, Oita CityNYS Precision Co.,. Ltd., Oita Factory
097-521-8107 870-0278 1-8-28 Aosaki, Oita City
Oita General Service Co.
097-523-1183 870-0106 2200 Oaza Tsurusaki, Oita City
Oita Device Technology Co., Ltd.
097-588-1153 870-1203 1660 Oaza Notsuharu, Oita City
Otsuka Diesel Co., Ltd.
097-558-9271 870-0901 1-1-32 Nishi Shinchi, Oita City
ODDS/Oita Device Design Support097-543-3293 870-0874 3-4-3 Nijigaoka, Oita City
Kamimaru Co., Ltd., Kyushu Offices
097-522-2540 870-0278 1-12-14 Aosaki, Oita City
Kawanodenki Corporation
097-544-3131 870-0816 8-33 Tamuro Machi, Oita City
Kansetsu Co., Oita Offices
097-524-2121 870-0263 1-7-23 Yokota, Oita City
Kyushu Yozai Co.
097-527-4031 870-0112 In the Oita Refinery Grounds, 1-1 Ichinosu, Oita City
Kuritec Service Co., Oita Offices
097-521-7925 870-0278 1-5-24 Aosaki, Oita City
Krone Co., Ltd.
097-521-2988 870-0133 686-1 Katsuragi, Oita City
Copan Co., Ltd.
097-504-3397 870-0142 1-5-5 Mitugawa Shimo, Oita City
Sard Electron Co. Ltd.
097-555-9792 870-0955 5-12-12 Shimogori Minami, Oita City
Zynas Corporation
097-540-6650 870-0036 11-22 Kotobuki Machi, Oita City
Shell Electronics Co., Ltd.
097-528-8826 870-0278 1-12-18 Aosaki, Oita City
Suzuki Co., Ltd.
097-520-1414 870-0124 818-1 Oaza Kei, Oita City
Sumika Chemical Analysis Service, Ltd. Business Headquarters, Oita Business Division 097-523-1181 870-0106 2200 Oaza Tsurusaki, Oita City
Threedyne Corporation, Oita Service Center
097-574-4115 870-0125 8205-5 Oaza Matsuoka, Oita City
Daiso Co.
097-568-5220 870-0943 2995-5 Oaza Katashima, Oita City
Takaki Tools & Materials Co., Ltd.
097-569-3115 870-0941 3113-7 Oaza Shimogori, Oita City
Tani Kogyo Co., Ltd.
097-528-8220 870-0278 1-14-23 Aosaki, Oita CityTEC Engineering Corporation
097-593-4777 870-0316 1212-150 Oaza Ichigi, Oita City
Toshiba Information Systems Technology, Inc.
097-524-6161 870-0197 Toshiba Oita Factory, 3500 Oaza Matsuoka, Oita City
Toshiba Semiconductor & Storage Products Company
097-524-6002 870-0197 3500 Oaza Matsuoka, Oita City
Tobu Kaihatsu Co., Ltd.
097-522-3111 870-0272 658-1 Oaza Sakomaru Yama, Oita City
Todaka Corp.
097-521-1379 870-0278 1-3-21 Aosaki, Oita City
Nittetsu Oita Techno Support Co., Ltd.
097-553-3119 870-0902 1 Oaza Nishinosu, Oita City
Nippon Express, Oita Airport Branch097-536-6043 870-0018 1-2-5 Toyomi, Oita City
Micronics Japan Co., Ltd., Oita Technology Laboratory
097-596-7220 870-1117 2-5-1 Takae Nishi, Oita City
Neos Company Limited, Oita Precision Workshop
097-527-3500 870-0278 1-6-10 Aosaki, Oita City
Network Co., Ltd.
097-551-8500 870-0912 Sakura Bldg. 3F, 6-15 Haru Shinmachi, Oita City
Britec Co., Ltd.
097-558-1125 870-0903 1-2-6 Mukaibaru Nishi, Oita City
Pleson LLC
090-3192-4402 870-0027 United Suehiro Bldg 3F, 1-5-16 Suehiro Machi, Oita City
Horiba Techno Service Co., Ltd., Oita Service Station
097-551-3982 870-0921 Tsuruha Bldg. 1F, 2-2-37 Hagiwara, Oita City
Mobile Create Co., Ltd.
097-514-3720 870-0804 No. 4, Miyuki Machi, Oita City
U.S.I Corp., Oita Offices
097-558-3181 870-0933 2-19 Hanazuru, Oita CityYAC Co., Ltd., Photovoltaics Division (Oita Factory)
097-588-1333 870-1204 543-3 Tsujiharu, Oita City
Kyushu Partner's Inc.
0977-21-9817 874-0839 2-1 Souen Cho, Beppu City
0979-32-5210 871-0152 512 Kaku, Nakatsu City
Shimada Electronics Works Co., Ltd.
Shinyei Technology Co., Ltd., Oita Factory
0979-84-8088 871-0101 311-10 Sanko Moriyama, Nakatsu City
T∙Plan Inc.
0979-53-8880 871-0015 362-1 Ushigami, Nakatsu City
Renesas Semiconductor Kyushu Yamaguchi Co., Ltd., Oita Factory
0979-32-7111 879-0111 4200 Itouda, Nakatsu CityTDK Corporation, Mikumagawa Factory
0973-24-1111 877-0061 3-793-1 Ishii Machi, Hita City
0972-23-7311 876-0823 10356-2 Mejima, Saiki City
Asahi Plastic Kogyo Co., Ltd.
Koutec Co., Ltd.
0972-22-5678 876-0823 10833-186 Mejima-ku, Saiki City
Nagao Seisakusho Co., Ltd.
0972-25-1200 876-1512 2134-24 Oaza Katata, Saiki City
J-Devices Corporation
03-3437-2800 875-0053 1913-2 Oaza Fukura, Usuki City
Daihen Technology Institute0978-63-4567 873-0025 1660-7 Oaza Mizoi, Kitsuki City
Takaki-Giken Co., Ltd.
0978-63-6420 873-0013 1680 Azasakai no Tsubo, Oaza Hino, Kitsuki City
Higashi Kyushu Electric Industry Co.
0978-33-3533 879-0308 2019 Oaza Shimotakei, Usa City
World Precision Tooling Inc.
0978-37-0287 879-0453 1544-2 Oaza Ueda, Usa City
AK System Co., Ltd.
097-582-3311 879-5413 1474 Otatsu, Shonai Cho, Yufu City
Denken Co., Ltd.
097-583-5535 879-5513 97-1 Oaza Takazaki, Hasama Machi, Yufu City
Sony Semiconductor Kyushu Corporation, Oita Technology Center 0978-72-5730 873-0511 3319-2 Oaza Owara, Kunisaki Machi, Kunisaki City
USC Corporation, Oita QI Center
0978-64-8121 873-0412 240 Furuichi, Musashi Machi, Kunisaki City
0977-72-9427 879-1504 9265-1 Oga, Hiji Machi, Hayami-gun
Add Technology
AK Electronics Co., Ltd.
0977-72-0042 879-1502 1237 Oaza Fujiwara, Hiji Machi, Hayami-gun
Mentor Analog Plus, Ltd
0977-73-0032 879-1502 2497-3 Oaza Fujiwara, Hiji Machi, Hayami-gun
ELIA Co., Ltd..
0977-73-2485 879-1507 799-1 Oaza Toyo-oka Oaza Iwagaki, Hiji Machi, Hayami-gun
Oita Denshi Co., Ltd.
0977-72-3477 879-1507 867 Oaza Toyo-oka, Hiji Machi, Hayami-gun
Ohkawa Mould Designs & Engineering Co., Ltd.
0977-72-2845 879-1504 32-2 Oaza Oga, Hiji Machi, Hayami-gun
Kyushu Semiconductor KAW Co., Ltd.
0977-72-1342 879-1505 15-10 Kawasaki, Hiji Machi, Hayami-gun
KSK Co., Ltd.
0977-72-8330 879-1505 4321-1 Oaza Kawasaki, Hiji Machi, Hayami-gun
CLI Co., Ltd.
0977-75-6454 879-1502 1910-21 Oaza Fujiwara, Hiji Machi, Hayami-gun
Texas Instruments Japan Limited, Hiji Plant
0977-73-1528 879-1505 4260 Oaza Kawasaki, Hiji Machi, Hayami-gun
Hiji High-Tech Co., Ltd.
0977-44-6300 879-1504 8133 Oaza Oga, Hiji Machi, Hayami-gun
Fukumiya Denshi Co., Ltd.
0977-72-1144 879-1507 1154-1 Oaza Toyo-oka, Hiji Machi, Hayami-gun
HOKS Co.
0977-72-6661 879-1504 9748-6 Oaza Oga, Hiji Machi, Hayami-gun
KCHK Spring Industry Co., Ltd.
0973-72-2465 879-4521 500-1 Oaza Ota, Kusu Machi, Kusu-gun
Fujita Chemical Industry Co., Ltd.
0973-73-8211 879-4331 6509-4 Oaza Tobata, Kusu Machi, Kusu-gun

4Oita Prefecture Semiconductor
Affiliated Company Technology Map
No. ofProcess Category Companies

Design(Device/Package)

Back-end(Overall)2

11

Manufacture

68

73

79

81

Denken(Substrate package(LGA/BGA, etc.),
plastic package(QFP, etc.))

Mentor Analog Plus
(Analog/DA circuitdesign, layout
design)

CLI (Power source
control IC planning,
circuit design,
customer support)

Hiji High-Tech(Semiconductor
circuit design)

39

80

Toshiba
Semiconductor &Storage ProductsCompany, Oita
Factory(System LSI,Image
sensor fabrication)

Texas Instruments
Japan(High-voltage, highspeed BiCMOS, SiN,
HiPOX, SOI wafer
processing, etc.)

13

18

54

57

62

STK Technology(Package Molds, TF
commissions)

Oita Device
Technology (DB/WB/MD/POprocessing, ceramic/
specialty packaging,
general-purpose IC
assembly)

Shimada Electronics
Works (Die bonding,wire bonding,molding)RenesasSemiconductor
Kyushu Yamaguchi(Full QFP,SIP linefrom dicing toshipping, highprecision loop
management)

J-Devices (Leadpackaging /BGA
assembly, taping(various))

77

68

69

75

80

KyushuSemiconductor KAW(Dicing, die bonding,wire bonding,molding)

Denken(Substrate package(LGA/BGA, etc.),
plastic package(QFP, etc.))

Sony Semiconductor
Kyushu Corporation(LSI packaging,
SiP assembly
manufacture)

Oita Denshi(logic LSI back-end
processing/assembly
processing)

Texas Instruments
Japan (Backgrinding,
dicing, die bonding,
Low-k wire bonding,molding, etc..)81

Back-end(Componentspecific)

Evaluation
Wafer Test
(Testing)

5

13
STK Technology(Logic design)

Hiji High-Tech(Dicing, die bonding,wire bonding,molding, etc.)

A

Semiconductor Manufacture

Front-end

5

Company (Technological Expertise)

5

5

13

30

64

65

72

STK Technology(Visual inspection,
taping, packing
operationscommissions)

Shell Electronics(BGA repair and ballsoldering)

Takaki-Giken(SOP, QFP,
BGA, etc. taping,packagingdehumidification,
microscope visualinspection, BGA
substrate machineassisted visualinspection)

Higashi Kyushu
Electric Industry(leadframe plating,
TF and marking
process)

AK Electronics(IC chip cutting,visual inspection for
sorting, taping)

13

39

62

77

80

STK Technology(Full-processcontracting fromproduction program
development andmanufacture toevaluation analysis,
wafer testingcommissions, test
engineering services)

Toshiba
Semiconductor &Storage ProductsCompany, Oita
Factory(LSI wafer highspeed testing)

J-Devices(Various kinds ofwafer testing)

KyushuSemiconductor KAW(Wafer electricalproperty testing)Texas Instruments
Japan(Technology
for automationof networked
production data)

No. ofProcess Category Companies

Final
Testing

Analysis

12

13

A

Semiconductor Manufacture

Evaluation(Testing)

Reliability Testing

Company (Technological Expertise)
13

18

35

STK Technology(Full-process contractingfrom production
program development
and manufacture toevaluation analysis, final
testing commissions, test
engineering services)

Oita Device Technology(marking/TF/testing/visual inspection/burn-in/taping)Takaki Tools & Materials Renesas Semiconductor(ball inspection, visual
Kyushu Yamaguchi
inspection)(High-speed multifunction measurement
technology, capacity forsmall-batch manufactureof diverse products)

57

54
Shimada Electronics
Works(Specialized
characterization testing
for light sensors, etc.)

62

77

68

74

75

J-Devices(leadpackaging /BGA/WLCSP
testing)

Kyushu Semiconductor
KAW (Electrical property
testing (packaging))

Denken(Logic testing)

ELIA(Testing specification
design, program andboard development)

Oita Denshi(Logic LSI final testing,
8-piece parallel testing)80

81

Texas Instruments Japan(Testing machinery
maintenance and repair
technology)

Hiji High-Tech(Program development,characteristics evaluation,
mass-production testing,
etc.)

13

18

32

38

39

STK Technology(Trial production, mass
production analysis, otheranalysis)

Oita Device Technology(X-ray nondestructive
inspection/SEM
examination)

Sumika Chemical Analysis
Service(Morphologicalexamination, surface
analysis, clean room
efficacy evaluation,
chemical impurity
analysis)Toshiba Information
Systems Technology(Wafer yield improvement
analysis, wafer defectlocation analysis)

Toshiba Semiconductor& Storage ProductsCompany, Oita Factory(Possesses various
evaluation and analyticaltechnologies)

42

62

68

70

73

Nittetsu Oita Techno
Support(Defect analysis,contamination analysis,
topography analysis,
particle analysis)

J-Devices(Possesses various
general purpose analyticalequipment such as a
SAM and a SEM)

Denken(X-ray, SAT, SEM, EDX,
decap, V/I, deprocessing,
EMMI, OBIRCH, Xsection,liquid crystals, laser
displacement metering,
repackaging, temperature
property evaluation, BGA
ball restoration, etc.)

USC Corporation, Oita
QI Center(package opening,chemical analysis,
examination)

Mentor Analog Plus
(Circuit design evaluation
analysis)

74

80

81

ELIA
(Testing specification
design, evaluation board
development and testing,evaluation reporting)Texas Instruments Japan Hiji High-Tech(Evaluation of the(Semiconductor
mechanical andmeasurement systems)
thermal properties of
IC packaging throughcomputer simulation)

13

18

32

39

68

STK Technology(Burn-in commissions,test program development
and evaluation)

Oita Device Technology(Temperature cycle
test(TCT)/Pressure
cooker test (PCT))

Sumika Chemical
Analysis Service(Environmental
testing, nondestructive
inspection, package
opening, electricaltesting)

Toshiba Semiconductor& Storage ProductsCompany, Oita Factory(Possesses various
reliability testing facilities)

Denken(Environmental testing,solder thermal resistanceevaluation, board
mounting evaluation,
ESD-MM/HBM/CDM
evaluation, latchup
evaluation, burn-in, etc.)

80

81

7

Texas Instruments Japan Hiji High-Tech(IC packaging(Semiconductor testing
environmental testing
systems)
technology)

Human Resources/
Contracting

8

26

27

53

56

Willtec Kyushu(Contracting ofsemiconductor
manufacture front-end,
testing, and shipping
processes)

Krone(Semiconductor
machinery assembly,
liquid crystal testingmachinery assembly,
miscellaneous machinery
assembly, piping, andwiring)Copan(Human resources
support to each factory)

Kyushu Partner's(Manufacturing anddefect analysis, quality
assurance, contracting
and dispatch for
manufacturing machinery
assembly)

T∙Plan(Introduction anddispatch of specialized
technicians)

7
68

71

Denken(Specialized dispatch(analysts, reliability
testers), contracting(analysis, reliability
evaluation), and otherservices)

Add Technology(Comprehensive
work contracting forsemiconductor electronic
circuit design, evaluation,
and analysis)6No. ofProcess Category Companies
DirectMaterials(Leadframes,
etc.)

Indirect
Material
Manufacture Materials(Gases,solutions,tape,packing,etc.)

1Company (Technological Expertise)
16
NYS Precision(Leadframe (downset
cutting, visual inspection))

9

24

35

58

59

Ueki Corporation(Gases, related
instruments, metalmaterials)

Kyushu Yozai(Petrochemical solvent
manufacture and sales)

Takaki Tools & Materials(Carrier tape molding)

TDK(Applicable films such as
clear conductive films)

Asahi Plastic Kogyo(Plastic irregular extrusion
shape forming, shippingtubes for semiconductors
packages and electronic
components, generalplastic extrusion
manufacture)

684
KCHK Spring Industry(Metal fabrication)

B Technologies Related to Semiconductor Manufacture

MachineFront-end
Manufacture

Back-end

Evaluation
Process(Testers,
probers,
handlers)2

35MachineManufacture

Misc.
Machines

10

5

12

Ulvac Techno Kyushu(Comprehensive
vacuum technology,
semiconductor
manufacturing
instruments, vacuum
device manufacture)Threedyne(Semiconductor wafer
cleaning machines)

6

35

76

Ishii Tool & Engineering(Soft pressing equipped
lead processing machines(TF), laser marking,handlers, etc.)

Takaki Tools & Materials(Taping machines, visualinspection machines,
laser marking machines,
general machinery)

Ohkawa Mould Designs& Engineering(Machines for visualinspection using 3-D
image processing)

13

30

35

41

68

STK Technology(Burn-in testers, IC
handling machines)

Shell Electronics(IC chip visual inspection
machines)

Takaki Tools & Materials(Handling machines,
semiconductor inspection
machines)

Todaka(Taping machines, visualinspection machines,
laser marking machines,
general machinery)

Denken(OS testers, IC handlers,
LD testers, DC testers,
visual inspection
machines, etc.)

30

15

23

Eto Manufacturing(Design and manufactureof mechatronics
instruments, precisioninspection instruments,
etc.)

Kansetsu
Shell Electronics(Designing semiconductor (Clean boothmanufacture machines
manufacture)(especially cleaningmachines))

36

41

Tani Kogyo
Todaka(Environmental related(Handling machine special
equipment, machineorder manufacture)development, design, andconstruction)

Tools(Probecards,
etc.)

11

33

35

Threedyne(Semiconductor
manufacture related
equipment)

Takaki Tools & Materials(Customized
development)

51

63

67

U.S.I
(Measurement systems
development andmanufacture)

Daihen Technology
Institute(Design and assembly of
automated machinery andautomatic particle freetransport machines)

AK System(Commission productionof air conditioning related
machines, automatictransport machines, laborsaving machines, etc.)

4

13

27

35

41

Aberuf(Probe cards,
performance board
design, high-reliability
sockets)

STK Technology(Burn-in board design andproduction, change kit
design and manufacture)

Copan(Tools, laborsaving instrument
semiconductors)

Takaki Tools & Materials(Burn-in boards, inserter/
extractor machines)

Todaka(Tools design anddevelopment)

44

66

68

70

74

Micronics Japan(Probe card manufacture,probe card inspection
machines, wafer prober,sockets)

World Precision Tooling(Electrode manufactureand sales)

Denken(Burn-in boards, Manual
measurement tool
development, etc.)

USC Corporation, Oita QICenter(Aging boards, metal
molds)ELIA(Development ofgeneral testing boards,
measurement sockets,and tools)

81
Hiji High-Tech(Development of
performance boards andmanual measurement
tools)

Parts/Tools
Manufacture

Machine
Parts

Metal Mold
Manufacture

7

1

2

13

21

35

Agawa Mekki(Wet electroplating, nonferrous metal surface
processing)

Adachi Chemical Plants(Welding, piping, andcan manufacturing
technologies)

STK Technology(Precision sheet metal
work, machining)

Kamimaru(Gas supply machine
design and manufacture,gas piping manufacture)

Takaki Tools & Materials(Planning, processing,and surfacing of parts,
precision sheet metal
work, machine frames,
etc.)

10

4

37

44

61

76

85

TEC Engineering(Comprehensive gas
supply equipment)

Micronics Japan(Metallic rod processing
including W, Re-W, andBe-Cu, ceramic plate thinfilm lamination, sockets)

Nagao Seisakusho(Precision sheet metal
work )

Ohkawa Mould Designs &Engineering(Plastic molded parts
manufacture forsemiconductors)

Fujita Chemical Industry(Precision plastic molding)

6

66

76

78

Ishii Tool & Engineering(Precision metal molding)World Precision Tooling(Metal molding precisionparts)

Ohkawa Mould Designs& Engineering(Metal mold design andmanufacture)

KSK(Metal mold parts
manufacture for TF
machines (Lead pitch with
precision of 0.3, ± 0.001
mm))

Analysis

Reliability

Manufacture
Machinery
Cleaning

2

3

5

Maintenance

Misc.

5

B

Technologies Related to Semiconductor Manufacture

No. ofProcess Category Companies

Misc.

C

Mounting(Board Set)

Board design andmanufacture

Mounting

Evaluation

5

4

9

4

Company (Technological Expertise)
42

32

Nittetsu Oita Techno
Support(High temperature/
low temperature tensile
testing, fatigue testing,wear testing, chemical
analysis, surface
formation measurement)

Sumika Chemical
Analysis Service(Formation examination,
surface analysis, clean
room efficacy evaluation,
chemical impurity
analysis)

32

35

70

Sumika Chemical
Analysis Service(Environmental
testing, nondestructive
inspection, package
opening, electricaltesting)

Takaki Tools & Materials(Capable of micronlevel accurate parts
management)

USC Corporation, Oita
QI Center(Reliability testing andenvironmental testing(high/low temperature,high/low humidity,
temperature cycling,etc.), mechanicalstrength testing(vibration, shock,dropping))

16

21

25

45

65

NYS Precision(Precision cleaningof semiconductor
manufacture machineparts)

Kamimaru(Cleaning ofsemiconductor
manufacture machineparts)

Kuritec Service(Precision cleaningof semiconductor
manufacture machineparts)

Neos(Precision cleaning of
manufacture machineinternal parts (dust
reduction in vacuum
chamber techniques))

Higashi Kyushu ElectricIndustry(Burn-in board andsocket cleaning, burnin board inspection andrepair, cleaning of tray
magazines, etc.)

5

17

33

46

49

Ulvac Techno Kyushu(Comprehensive
vacuum technology,
semiconductor device
manufacture machine
maintenance, vacuum
instrument maintenance)

Oita General Service(Precision cleaning ofclean suits, IC trays,etc.)

Threedyne(Contract maintenancefor automatedinstruments)

Network(Semiconductor related
machine maintenance)

Horiba Techno Service(Analytical instrument
maintenance)

16

31

35

48

60

NYS Precision(Semiconductor
manufacture materials
sales)

Suzuki(Source and indirectmaterials supply firm)

Takaki Tools & Materials(Procurement ofprocessed resin
products, specializedmaterials, etc.)

Pleson (Comprehensive
semiconductor
manufacture machine
implementation
technologies)

Koutec(Dry ice cleaning)

4

6

12

Aberuf(50 Ω impedance
matching board design
and manufacture)

Ishii Tool & Engineering S-Craft(Control board(High-speed
manufacture)transmission PCB
design)30
Shell Electronics(PCB design)

4

30

35

47

55

Aberuf(Test board assembly)

Shell Electronics(PCB mounting, leadfree compliant reflow
machines installed)

Takaki Tools & Materials(Burn-in boards,
inserter/extractor
machines)

Britec(Probe card processing,
PCB mounting)

Shinyei Technology(SMT/RA/AX mounting,various assembly)

68

69

82

83

DENKEN(Power modules,
fingerprint sensors, AC
adapters, etc.)

Sony Semiconductor
Kyushu(Semiconductor
packaging)

Fukumiya Denshi(Board mount andsemiconductor machinesassembly)

HOKS(Lead-free compliance,
SMT technology (BGA,
CSP, 0.4 pitch QFP,
0603 chips))

42

30

68

69

Nittetsu Oita Techno
Support(Joint interface analysis,
soldering evaluation,
packaging opening
and testing, destructive
analysis, heat cycle
testing)

Shell Electronics(Electrical inspection
after PCB mounting)

DENKEN(CMOS sensors, power
modules, fingerprint
sensors, etc.)

Sony Semiconductor
Kyushu(Packaging producttesting)

68

D

Software

Reliability

Integration
Systems

1

9

DENKEN(CMOS sensors, power
modules, fingerprint
sensors, etc.)

7

10

13

28

29

InfoWave(Web systems designand development,
image processing
technologies)

SS-Avenue(Evaluation programs)

STK Technology(Communications
integration systems)

Sard Electron(Machine development(Wiring design, softwaredevelopment), control
instrument development)

Zynas (Embedding
and control application
development)

50

68

74

81

Mobile Create(System design anddevelopment)

DENKEN(H8, SH, etc.
microcomputer
hardware and softwaredevelopment)

ELIA(Custom-designed
system suppont)

Hiji High-Tech(Embedded systems(hardware, software)development)

8

No. ofProcess Category Companies

Company (Technological Expertise)
32

44

68

Sumika Chemical
Analysis Service(Formation examination,
surface analysis, clean
room efficacy evaluation,
chemical impurity
analysis)

Micronics Japan(Panel probing,automated alignment,
contact technology,
panel electrode cutting,image processing
inspection technology)

DENKEN(Aging machines, FC,
etc.)

3

52

68

Solar Cell-related

2

YAC(Solar cell-related
machine development
and manufacture)

DENKEN(Solar cell inspection
machine development
and manufacture)

34

40

Recycling2

Daiso(Recycling an disposal,
from planning to
execution)

Tobu Kaihatsu(Disassembly, industrial
waste processing)E Miscellaneous

LCD Display-related

Semiconductor
Manufacturing
Machine Sales/
Representation

Misc.

3

4

3

11

14

Advantest(Memory device, SOC
test machine, and test
handler manufacture andsales)

SMC(Manufacture andsales of temperature
control products suchas Thermo-chillers andThermo-controllers,and air pressure driving
devices)

Espec Kyushu(Semiconductor
manufacture machinesales, inspection andreliability evaluation
machine sales)

19

20

22

43

Otsuka Diesel(Diesel engine anddynamo sales andmaintenance)

ODDS(Semiconductor
technology literature
writing , translation, andsoftware development)

Kawanodenki(Design and productionof power distribution
boards, panelboards,
and control boards, etc.)

Nippon Express(Logistics, liquid
crystal/semiconductor
manufacture machinetransportation andinstallation)

Manufacturing Process
Film
1 Oxidization 2 Thin
Formation

3 Photolithography 4 Dry Etching 5 Ion
implantation 6 Wiring

Wafers are placed in ahigh-temperature
furnace while exposed
to an oxidizing
atmosphere to forman oxide film on thewafer's surface.

Using the chemical
vapor deposition(CVD) method, gases
react chemically in
CVD chamber to forma polycrystalline
silicon film over theoxide film.

In photolithography, aphotomask is used toform a resist pattern
for circuits on thesurface of the wafer.

(Polycrystalline silicon film)(Photomask)(Oxide film)

Ions of reactive gases
in a plasma state areshot in pulses at thewafer using electricfield, etching along
the resist pattern foraluminum film or othermaterials.

Impurities are ionized
in a vacuum andelectromagneticallycharged to energies
of tens or hundreds ofkeV which are thenimplanted into thesurface of the wafer.

An aluminum "target"(source) is sputteredwith inert gas plasmaand deposited as athin metallic film onto
the wafer to form
circuitry wiring.

(Wiring)(Gate electrode)(Transistor switch)(Silicon substrate)

7 Wafer Testing 8 Dicing

9 Mounting

10 Bonding

11MoldingInspection
12 Product

Each chip on thewafer is tested, viablechips are sorted fromdefective chips, anddefective chips aremarked in memory
data

The chip is mounted
onto a specificlocation of board.

The chip is connectedto the board using
gold wires and othermaterials.

The chip is sealed inresin or otherpackage materials.

Tests are performed,
such as electronic
property inspection
and visual inspection,and defective
products are removed.

Each chip isseparated from thewafer using a
diamond blade.

(Chip)(Chip)(Wafer)9(Tester)(Board)(Metal wires)(Tester)Contact

Oita LSI Cluster Promotion Conference
Office Adress : 1-4361-10 Takaenishi
Oita-City,Oita,Japan(In oita Industrial Research Institute)

TEL/FAX : (+81) 97-596 -7179
http://www.oita-lsi.jp/
E-mail:oita-lsi@columbus.or.jp