Yamagata University Flexible Electronics Japan-Germany
International Collaborative Practical Utilization Consortium(YU-FIC)

Innovation Center for Organic Electronics (INOEL)
Yamagata University
Contact person:
Tadahiro Furukawa Prof.
R&D, Project Leader
ta-furukawa@yz.yamagata-u.ac.jp
1-808-48 Arcadia, Yonezawa, Yamagata 992-0119, Japan
TEL +81-238-29-0575
Related program⚫ JST: OPERA Program Grant Number JPMOP1614 [FY2016～FY2020].
⚫ MEXT: Construction Program of Open Innovation Organization [FY2018～FY2022].

Web pages⚫ Home page： https://inoel.yz.yamagata-u.ac.jp/yu-fic-en/

Related sectionResearch Group for Flexible Technologies (Nakada/Furukawa/Yuki/Koden Group)1

Yamagata University Flexible Electronics Japan-Germany
International Collaborative Practical Utilization Consortium (YU-FIC)
Yamagata University Flexible Electronics Japan-Germany International Collaborative
Practical Utilization Consortium (YU-FIC) collaborates with companies and institutes inGermany, aiming at novel flexible electronics products.

Subjects➢ Development of large area OLED lighting on flexible substrates➢ Product development for signage using OLED➢ Free Form Electronics - Freedom in design by thermo-formed printed electronics

Collaboration with German activity
YU-FIC collaborates with German companies and institutes which are organized by Organic
Electronics Saxony (OES), having twice visits a every year, respectively.

Activity

LOPEC/Germany (Mar. 2019)Japan (Jan. 2020)

Flex Japan 2019 (May 2019)

Germany (Sep. 2019)

JFlex (Jan. 2020)

The 9th Germany-Japan Joint Workshop“Flexible, Printed Electronics and Sensors”
February 26th 2021
German time 08:30-11:30, Japanese time 16:30-19:30 (online)2

Roll-to-roll (R2R) and Printing
Technologies
We provide roll-to-roll (R2R) and printing technologies, aiming at an innovation of
productions in flexible organic electronics.

Roll-to-roll (R2R)
Unique roll-to-roll (R2R) equipment are utilized for fabrications of electrodes, barrier layers,organic layers, etc.
・Substrate width：30cm
・Substrate: ultra-thin glass, stainless steel foil, flexible film

R2R screen
printing and slitcoating (SERIA)

R2R
sputtering&CVD(KOBELCO)R2R wetcleaning(FEBACS)
Process technologies

Printing / Coating

Various equipment for process technologies can beused.

Various printing andcoating equipment
can be utilized forprinting tests anddevice fabrications.
Spin-coating

Cutting Machinefor Ultra-thinGlass
Screen printing

3D Forming
MachineFlexography andgravure offset
printing

Evaluation
Various evaluation equipment are used for R&D of printing and roll-to-roll (R2R) technologies.

Viscoelasticity
measurement

Hybridconfocalmicroscopy

Precise position
detector

Evaluation equipmentof Ca corrosion

Evaluation equipmentof WVTR

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Flexible OLEDs
on Ultra-Thin Glass
We develop flexible OLED devices on ultra-thin glass G-Leaf® (Nippon Electric Glass).

Technological features◼ Advantages of ultra-thin glass G-Leaf® of Nippon Electric Glass・Flexible and roll shape due to thin thickness such as 50μm
・Intrinsic advantages of glass (gas barrier, surface smoothness, temperature stability,chemical stability, size stability, etc.)

Developed technologies◼ Flexible OLED devices on ultra-thin glass with the thickness of 50μm
・Roll-to-roll (R2R) fabrication of transparent electrodes and assistant electrode on ultra-thin glass
without photolithography
・Handling and cutting technologies for ultra-thin glass
・Application of ultra-thin glass to OLED substrate and encapsulating substrate.

Collaboration

Fraunhofer FEP, Nippon Electric Glass, SERIA ENGINEERING, FEBACS,
Mitsuboshi Diamond Industrial, NIPPON STEEL Chemical & Material Co., Ltd.
FUJIKURA KASEI, TaicaCorporation, tesaPublication⚫ T. Nakagaki, T. Kawabata, H. Takimoto, T. Furukawa, IDW’19, FLXp1-9L (2019). “Scribing Tool and Cutting Method for
Ultra-thin Glass”⚫ T. Furukawa, N. Kawamura, T. Noda, Y. Hasegawa, D. Kobayashi, M. Koden, IDW’17, FLX6-2 (2017).
“Novel Roll-to-Roll Fabrication Processes of Transparent Electrodes on Ultra-Thin Glass”⚫ T. Furukawa, M. Koden, IEICE Trans. Electron, E100-C, 949-954 (2017).
“Novel roll-to-roll deposition and patterning of ITO on ultra-thin glass for flexible OLEDs”⚫ T. Furukawa, K. Mitsugi, S, Akiyama, H, Itoh, D, Kobayashi, T. Suzuki, H,kuroiwa, M, Sakakibara, K,Tanaka, M,Kawamura, and M, Koden, IDW’14, FLX3-4 (2014). “Patterned ITO Film by Roll-to-Roll Process on Ultra-thin Glass”

4Stainless Steel Foils and Barrier Film
We develop flexible OLED devices using stainless steel foil and barrier film.

Technological features◼ Advantages of stainless steel foils of NIPPON STEEL Chemical & Material Co., Ltd.
・Thickness: 50μm or 30μm
・Excellent temperature and process resistances
・High gas barrier ability◼ Barrier Film・High barrier ability with WVTR (Water Vapor Transmission Rate) of the order of 10 -6g/m2/day
・High gas barrier films with transparent electrode

Developed technologies◼ Stainless steel foil・Electrode (reflective anode) is fabricated on stainless steel foil by roll-to-roll (R2R) photolithographyfree processes
・Development of flexible OLED devices on stainless steel foil・Improved mechanical durability of OLED devices by using stainless steel foil as anencapsulation substrate◼ Barrier Film・Roll-to-roll (R2R) photolithography-free fabrication of barrier layer(PE-CVD） and transparent
electrode（spattering and printing) on Plastic film

Collaboration

Teijin, NIPPON STEEL Chemical & Material, Nippon Electric Glass,
Mitsuboshi Diamond Industrial, FUJIKURA KASEI, tasa

Publication⚫ Y. Hagiwara, T. Furukawa, T. Yuki, S. Yamaguchi, N. Yamada, J. Nakatsuka, M. Koden, H. Nakada, IDW’17, FLXp1-9L(2017).
“Roll-to-Roll Patterning of Reflective Electrode on Planarized Stainless Steel Foil”⚫ M. Koden, T. Furukawa, T. Yuki, H. Kobayashi, H. Nakada, IDW/AD’16, FLX3-1 (2016).
“Substrates and Non-ITO Electrodes for Flexible OLEDs”⚫ Y. Hagiwara, H. Itoh, T. Furukawa, H. Kobayashi, S. Yamaguchi, N. Yamada, J. Nakatsuka, M. Koden, H. Nakada, IDW/AD’16,
FLXp1-5 (2016). ”Roll-to-Roll Processing of Silver/ITO Continuous Deposition on Planarized Stainless Steel Foil”⚫ K. Taira, Taiga Suzuki, W. Konno, H Chiba, H. Itoh, M. Koden, T. Takahashi, T. Furukawa, IDW’18, FLX2-4L (2019).
“Development of High Gas Barrier Film Using Novel Precursor by Roll to Roll PECVD”⚫ T. Suzuki, W. Konno, K. Taira, H Chiba, H. Itoh, M. Koden, T. Takahashi, T. Furukawa, IDW’18, FLXp1-10L (2019).
“High Gas Barrier Films with Heterogeneous Multilayer”⚫ K. Taira, T. Furukawa, N. Kawamura, M. Koden, T. Takahashi, IDW’17, FLXp1-8L (2018). “High gas barrier film for OLED”⚫ T. Furukawa, N. Kawamura, M. Koden, H. Itoh, H. Kuroiwa, K. Nagai, LOPEC (2017). “Gas barrier film for OLED devices”

5Roll-to-Roll (R2R) Fabrication of Barrier Filmand Evaluation of Barrier Properties
We develop fabrication technologies of gas barrier layer and transparent electrode on flexible
film, using roll-to-roll (R2R) PE-CVD (Plasma Enhanced Chemical Vapor Deposition)

Technological features◼ Roll-to-roll (R2R) PE-CVD deposition of gas barrier layer on flexible films◼ High barrier ability with WVTR (Water Vapor Transmission Rate) of the order of 10 -6g/m2/day◼ High gas barrier films with transparent electrode◼ Evaluation for gas barrier film

Developed technologies◼ Roll-to-roll (R2R) photolithography-free fabrication of barrier layer and transparent electrodeon flexible films
Wax

R2R processes of barrier layer and transparent electrode◼ High gas barrier property(WVTR: 6.3×10-6g/m2/day)

Al (1mm)（Teijin）

R2R
PEN film

R2R vacuum deposition
Equipment （KOBELCO）
Wetcleaning

CVD of SiOxbarrier layer

R2R screen printing equipment（SERIA ENGINEERING）

IZO
sputtering

Printing ofetching paste

R2R wet-cleaning equipment（FEBACS）

Wetcleaning

Ca testCutting

OLEDCa (100nm)
IZO
SiOx barrier layer
Flexible substrate

Flexible film
Barrier layer
Barrier resin
CathodeOrganic layers(plural layers)

IZO
SiOx barrier layer
PEN film

Ca corrosion device after 616
hours under 40℃/90%RH(Thickness of barrier layer:720nm)

International standard◼ We contributed to the establishment of standards for high gas barrier film
SEMI D78 - Test Method of Water Vapor Barrier Property for Plastic Films with High Barrier forElectronic Devices⚫ Gas barrier properties due to changes
in area ratio and number of defects
over time

1.2 × 10-4 g/m2/day 1.3 × 10-4 g/m2/day 7.3 × 10-5 g/m2/day 1.4 × 10-4 g/m2/day

IDW’18, FLXp1-10L (2019).

SEMI D80 - Test Method for Measurement of Water Vapor Transmission Rate for High Gas Barrier
Plastic Film in a Short Time⚫ Measurement of WVTR using Quadrupole mass spectrometer
Collaboration

TEIJIN LIMITED, Tosoh Corporation, MORESCO

Related program⚫ JST: OPERA Program Grant Number JPMOP1614 [FY2016～FY2020].
⚫ MEXT: Construction Program of Open Innovation Organization [FY2018～FY2022].

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3D-molding technologies
We develop 3D-molding technologies with electrodes for developing fabrication
processes of 3D-circuit board and their applications.

Technological features◼ 3D-molding technologies with electrodes◼ Process simplification in fabrication of circuit board by printing technologies

Application areas◼ Automotive interiors (lighting, controller, etc. of instrument panels and consoles)◼ Thin IoT devices

Collaboration scheme
Process for 3D PCB / Inter-company collaboration

Sensors for agriculture

Developed technologies

3D-shaped prototype with touch screen and LEDs

Collaboration
Aiwa Lite Corporation, The Japan Steel Works, LTD. , TEIJIN LIMITED ,FUJIKURA KASEI CO., LTD. , Nishimu Electronics Industries Co., Ltd.
Related program⚫ JST: OPERA Program Grant Number JPMOP1614 [FY2016～FY2020].
⚫ MEXT: Construction Program of Open Innovation Organization [FY2018～FY2022].

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Unique application with OLEDs
Technological features◼ Unique application to packages etc.

Developed technologies

Medicine caseBookmark

Mouse shield
Collaboration

Nameplate with wood pattern

Traditional Japanese helmet

Pencil caseKOMORI Corporation , TAKEDA PRINTING CO. LTD., Taica Corporation

International Conference➢ Y. Kawamura, T. Takahashi, T. Furukawa, ICFPE2021 (2021), “Improvement of printed electrodes
disconnection after 3D thermoforming by optimizing print process on PC film”➢ Y. Kawamura, T. Takahashi, K. Wakabayashi, H. Hirose, Y. Azakami, H. Itoh, T. Furukawa, IDW’20, FLX304L (2020). “Effect of Pressure Forming Conditions on PC Sheet integrating Electric Wiring for 3D Electronics
Technology”➢ T. Nakagaki, T. Kawabata, H. Takimoto, T. Furukawa, IDW’19, FLXp1-9L (2019).
“Scribing Tool and Cutting Method for Ultra-thin Glass”➢ T. Furukawa, M. Koden, ICDT2019 (2019). “Novel R2R and Printing Technologies for Electrodes of Flexible
OLED Lighting”➢ K. Taira, Taiga Suzuki, W. Konno, H Chiba, H. Itoh, M. Koden, T. Takahashi, T. Furukawa, IDW’18, FLX2-4L(2018). “Development of High Gas Barrier Film Using Novel Precursor by Roll to Roll PECVD”➢ T. Furukawa, Advanced Materials-2018（WCAM2018） (2018). [Invited]“Substrates for Organic Electronics - Ultra-thin Glass, Stainless Steel Foil and High Gas Barrier Plastic Film”➢ M. Koden, T. Furukawa, T. Yuki, H. Nakada, LS16 (2018). [Invited]“Roll-to-roll and printing technologies for electrodes of flexible OLED lighting”➢ T. Furukawa, N. Kawamura, T. Noda, Y. Hasegawa, D. Kobayashi, M. Koden, IDW’17, FLX6-2 (2017).
“Novel Roll-to-Roll Fabrication Processes of Transparent Electrodes on Ultra-Thin Glass”➢ T. Furukawa, N. Kawamura, M. Koden, H. Itoh, H. Kuroiwa, K. Nagai, LOPEC (2017).
“Gas barrier film for OLED devices”➢ M. Koden, T. Furukawa, T. Yuki, H. Kobayashi, H. Nakada, IDW/AD’16, FLX3-1 (2016). [Invited]“Substrates and Non-ITO Electrodes for Flexible OLEDs”➢ T. Furukawa, IWFPE2016 (2016). [Invited]“Flexible Substrates and Printed Transparent Electrode for OLED Lighting”➢ T. Furukawa, N. Kawamura, H. Nakada, M. Koden, The International Conference on Flexible and Printed
Electronics (ICFPE 2016), O15-6 (2016). ”Novel ITO fabrication processes on ultra-thin glass”

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