SDカー ド 512MB-2GB(ET1268+KIOXIA[Toshiba] 24/32nm SLC)

データシート

株式会社アドテック

SD 512MB-2GB

REVISION HISTORY
Revision

Description

Date

V1.1

First released

August 2015

V1.2

Updated Humidity information

April 2017

V1.3

Added Product Feature information

July 2017

V1.4

Added 512MB Capacity

August 2017

V1.5

Added ESD ability and humidity information

November 2017

V1.6

Added water proof information

April 2018

V1.7

Added 1.2 Product Features, 1.3 TBW and 3.8 Dust proof

July 2020

V1.8

Added 4.3 Bus Timing (Append Default Speed Mode)

September 2021

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SD 512MB-2GB

1. Product Introduction
1.1. Overview
The Industrial SD Card is designed for demanding industrial applications especiallyfor portable devices.

The SD Card is compatible with SD 2.0 and provides excellent

performance. The built-in auto ECC function can also detect and correct errors during datatransfer. Moreover, Industrial SD Card provides high write/read speed and high IOPS, it
was designed to meet the security, high performance, and environmental requirements.
1.2. Product Features
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Interface: 9 pins SD standard interfaceCompliant SD Card Specification 2.0
Capacity: 512MB, 1GB, 2GB
Variable Clock Rate
◼ Default Mode: 0-25 MHz, up to 12.5MB/s Interface Speed◼ High-Speed Mode: 0-50 MHz, up to 25MB/s Interface Speed
Operating at -40°C to 85°C
Flash: SLC NAND Flash (512MB: TC58NVG2S0HTAI0 ,1GB/2GB:
TC58NVG3S0FTAI0)
Controller: ET1268
Program/Erase Cycle: 60,000 Cycles
Built-in ECC corrects up to 30 bits/1 KB
Read disturbance management (Auto-Refresh)
Adaptive wear levelingManagement of sudden power-fails
SMART Function support (Dedicated software support)
Support CPRM (Content Protection for Recordable Media) of SD Card
Support Water & Dust proof IEC 60529 IP58

1.3. TBW (Tera Bytes Written)
Capacity

512MB

1GB2GBSLC

25.2TB

50.4TB

98.2TB*The endurance of disk could be varying based on user behavior, NAND endurance cycles, and write amplification factor.
It is not guaranteed by flash vendor.
*Client workload by JESD-219A

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SD 512MB-2GB
2 . SD Card Interface Description
2.1 SD Pin Assignment
Table 1: SD Bus Mode Pin Definition
Pin #Name

TypeSD Description

1CD/DAT3I/O

Card Detect / Data Line[Bit3]

2CMD

PP

Command / Response

3VSS

Supply Voltage Ground

4VDD

S

Supply Voltage

5CLKIClock6VSS

Supply Voltage Ground

7DAT0I/O

Data Line [Bit 0]

8DAT1I/O

Data Line [Bit 1]

9DAT2I/O

Data Line [Bit 2]

Notes:
1) S: power supply; I: input; O: output using push-pull drivers; PP: I/O using push-pulldrivers;
2) The extended DAT Lines (DAT1-DAT3) are input on power up. They start to operate as
DAT lines after SET_BUS_WIDTH command. The Host shall keep its own
DAT1-DAT3 lines in input mode, as well, while they are not used. It is defined so, inorder to keep compatibility to Multi-media Cards.
3) After power up this line (Pin1) is input with 50Kohm pull-up (can be used for card
detection or SPI mode selection). The pull-up should be disconnected by user,
during regular data transfer, with SET_CLR_CARD_DETECT (ACMD42) command.
Table 2: SPI Bus Mode Pin Definition
Pin #Name

TypeSD Description

1CS

I

Chip Select (neg true)

2

DII

Data In3VSSS

Supply Voltage Ground

4VDD

S

Supply Voltage

5SCLKIClock6VSSS

Supply Voltage Ground

7DOO

Data Out

8RSVReserved

9RSVReserved

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SD 512MB-2GB

Figure 1: Functional Diagram

2.2 SD Bus Topology
The SD bus has six communication lines and three supply lines:⚫ CMD: Command is bi-directional signal. (Host and card drivers are operating in pushpull mode.)⚫ DAT0-3: Data lines are bi-directional signals. (Host and card drivers are operating inpush pull mode.)⚫ CLK: Clock is a host to cards signal. (CLK operates in push pull mode.)⚫ VDD: VDD is the power supply line for all cards.
⚫ VSS: VSS is the power ground line.
During the initialization process, commands are sent to each card individually, allowing theapplication to detect the cards and assign logical addresses to the physical slots.
Data is always sent to each card individually. However, to simplify the handling of the card
stack, after initialization, all commands may be sent concurrently to all cards.
Addressing information is provided in the command packet.

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SD 512MB-2GB

The following figure shows the bus topology of several cards with one host in SD Bus mode.

Figure 2: Memory Card System Bus Topology

2.3 SPI Bus Topology
The memory Card SPI interface is compatible with SPI hosts available on the market. As anyother SPI device, the SD Memory Card SPI channel consists of the following 4 signals:⚫
⚫
⚫
⚫

CS: Host to card Chip Select signal.
CLK: Host to card clock signal.
Data In: Host to card data signal.
Data Out: Card to host data signal.

Another SPI common characteristic, which is implemented in the Memory Card as well, is byte
transfers. All data tokens are multiples of 8-bit bytes and always byte aligned to the CS signal.
The card identification and addressing methods are replaced by a hardware Chip Select (CS)signal. There are no broadcast commands, a card (slave) is selected by asserting (active low)
the CS signal. The CS signal shall be continuously active for the duration of the SPI
transaction (command, response and data). The only exception occurs during card
programming, when the host can de-assert the CS signal without affecting the programming
process.
The SPI interface uses the 7 out of the SD 9 signals (DAT1 and DAT2 are not used, DAT3 isthe CS signal) of the SD bus.

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SD 512MB-2GBFigure 3: SPI mode SD Memory Card Bus System

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SD 512MB-2GB

3 . Specifications
3.1. Performance
Max. Data Transfer Rate
◼ Read: 23MB/s; Write: 16MB/s
3.2. NAND Flash Memory
Industrial SD Card uses Single Level Cell (SLC) NAND Flash memory, which isnon-volatility, high reliability, and high-speed memory storage. There are only two statuses
0 or 1 of one cell.
3.3. Power Requirement
3.3.1. DC Input Voltage◼ 2.7V to 3.6V
3.4. Temperature Range◼ -40°C to +85°C
3.5. Humidity
Relative Humidity: 5-95%, non-condensing
3.6. Water proof
Water proof level: IEC 60529 IPX8.
Test Condition

Referred standard

Depth of water 1.5m for 30 mins.

IEC 60529 IPX8

3.7. ESD Ability
Test Condition

Referred standard⚫ Contact discharge: ± 2KV, ± 4KV

SD Spec. Appendix D.1⚫ Air discharge: ± 4KV, ± 8KV, ± 15KVSD Spec. Appendix D.2

3.8. Dust proof
Dust proof level: IEC 60529 IP5X.
Test Condition

Referred standard

Depression of 2 KPa, Talcum powder 2kg/m³, 8 hrs. IEC 60529 IP5X

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SD 512MB-2GB

4 . Electrical Specifications
4.1. General DC Characteristic
Table 3: Absolute Maximum Ratings
SymbolParameter

Min.

Max.

Unit

Note

Tstorage

Storage Temperature-5095°C-Ta

Ambient Operating Temperature-4085°C-

VI

3.3V External Input Voltage

-0.3

3.6

V-

Table 4: Power Consumption
Symbol

Min.

Typ.

Max.

Unit

Read Current at 3.3V

-62200mA

IWriteWrite Current at 3.3V

-73200mA

ISTBYStandby Current

-0.2

15mA

IRead

Parameter

4.2. Bus Signal Line Loading
Table 5: Bus Signal Line Loading
SymbolParameter

MinMax

Unit

Remark

RCMD

Pull-up resistance for SD_CMD Line

25100KΩTo prevent bus floating

RDAT

Pull-up resistance for SD_DATA Line

25100KΩTo prevent bus floating

CCARD

Card capacitance for each signal pin-10pF

For single card

LL

Signal Line Inductance-16nH

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SD 512MB-2GB

Table 6: DC Characteristics of I/O Interface
SymbolParameter

Min.

Max.

Unit

VIH

Input High Voltage

0.625 x VI

VI +0.3VVIL

Input Low Voltage-0.3

0.25 x VI

V

VOH

Output High Voltage

0.75 x VI-VVOL

Output Low Voltage-0.125 x VI

V

IOH

Output High Current-16-mA

IOL

Output Low Current-16mA

Figure 4: Bus Signal Level

4.3. Bus Timing
4.3.1 Bus Timing (Default Speed Mode)

Figure 5: Card input Timing (Default Speed Card)10

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SD 512MB-2GB

Figure 6: Card Output Timing (Default Speed Mode)
Table 7: Bus Timing-Parameters Values (Default Speed)
Parameter

Symbol

Min.

Max

Unit

RemarkClock CLK （All values are referred to min（VIH）and max（VIL）
Clock frequency data transfer

fpp025MHzCCARD ≤ 10pF (1 card)

Clock frequency Identification

fOD0(1)/100400KHz

CCARD ≤ 10pF (1 card)

Clock low time

tWL

10ns

CCARD ≤ 10pF (1 card)

Clock high time

tWH

10ns

CCARD ≤ 10pF (1 card)

Clock rise time

tTLH

10ns

CCARD ≤ 10pF (1 card)

Clock fall time

tTHL

10ns

CCARD ≤ 10pF (1 card)

Inputs CMD, DAT (referenced to CLK)
Input set-up time

tISU

5nsCCARD≤

10pF (1 card)

Input hold timetTH5ns

CCARD≤

10pF (1 card)

Outputs CMD, DAT (referenced to CLK)
Output Delay time during Data
Transfer Mode

tODLY

014ns

CL ≤40pF (1 card)

Output Hold time

tOH

050nsCL ≤40pF (1 card)(1) 0 Hz means to stop the clock. The given minimum frequency range is for cases were continues clock isrequired.

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SD 512MB-2GB

4.3.2 Bus Timing (High-Speed Mode)

Figure 7: Card Input Timing (High Speed Card)

Figure8: Card Output Timing (High Speed Mode)
Table 8 : Bus Timing – Parameters Values(High Speed)
Parameter

SymbolMin.

Max

Unit

RemarkClock CLK （All values are referred to min（VIH）and max（VIL）
Clock frequency data transfer
Clock low time
Clock high time
Clock rise time
Clock fall time
Inputs CMD, DAT (referenced to CLK)
Input set-up time
Input hold time
Outputs CMD, DAT (referenced to CLK)

MHznsns
ns
ns

CCARD ≤CCARD ≤CCARD ≤CCARD ≤CCARD ≤

6

ns

CCARD ≤ 10pF (1 card)

2ns

CCARD ≤ 10pF (1 card)

nsCL ≤ 40pF (1 card)

nspF

CL ≥ 15pF (1 card)
1 cardfpptWL
tWH
tTLH
tTHL

077tISUtTH

50

33tODLY
14Output Delay time during Data Transfer Mode
Output Hold time
2.5tOH
40CLTotal System capacitance for each line11) In order to satisfy sever timing, host shall drive only one card.

12

10pF (1 card)
10pF (1 card)
10pF (1 card)
10pF (1 card)
10pF (1 card)

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SD 512MB-2GB

5. Mechanical Dimensions
The mechanical dimensions of industrial SD card were basically followed themechanical form factor definitions on SD-Memory card specifications which constructed by
SD card association.

Figure 9: Top View

Figure 11: Side View
Figure 10: Bottom View

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SD 512MB-2GB6. Ordering Information
Part Number
ESD512SITCCEBF
ESD01GSITDBEBB
ESD02GSITDBEBBCapacity
512MB
1GB
2GB

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