International Journal of Heat and Mass Transfer 106 (2017) 655–656

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International Journal of Heat and Mass Transfer
journal homepage: www.elsevier.com/locate/ijhmt

In Celebration

Dr. Prof. Wataru Nakayama on his 80th birthday

We are pleased to honor Doctor Professor Wataru Nakayama.
on the occasion of his 80th birthday. He was born on 7 January
1936 in Kamakura, Japan. He attended the National Defense Academy, where he received his B.S. degree in Mechanical Engineeringin 1958. After serving three years as an aircraft maintenance officer
at the Air Self-Defense Force, Japan, he started his heat transfer
studies when he enrolled in the graduate school of Tokyo Instituteof Technology (Tokyo Tech) in 1961, and received the doctoral
degree in 1966. His thesis supervisor was Professor Yasuo Mori,
one of the founders of the heat transfer research community inJapan. A series of doctoral studies on forced convective heat transfer in a pipe with secondary flows was published in Int. J. Heat andMass Transfer during 1965–1971, and some correlations derived in
the studies are known as the ‘‘Mori-Nakayama formulas.”After finishing an additional one-year assignment as an engineering officer in the Defence Agency after receiving the doctoral
degree, and gaining three years of experience as a researcher anda lecturer in universities in Canada, he joined Hitachi, Ltd. in
1970. At Hitachi he conducted and supervised heat transfer
research for a wide range of products including electrical machines, heat exchangers, and computers. In 1989, he became the Hitachi Chair Professor at Tokyo Tech, a position he held until his
retirement in 1996. At Tokyo Tech he taught and conducted
research on microelectronic packaging with a focus on power

http://dx.doi.org/10.1016/j.ijheatmasstransfer.2016.09.049

and thermal management of computers. After his retirement fromTokyo Tech, he served as a visiting professor at University ofMaryland until 2001, where he supervised research on thermalmanagement supported by DARPA’s HERETIC (Heat Removal by
Thermal Integrated Circuits) program. During his years at theUniversity of Maryland, he welcomed and hosted many Japanese
researchers, with his wife Michiko, and devoted considerable effort
to collaborating with one of the authors (Y. Joshi) on studies ofenergy management in data centers. Since returning to Japan in2001, he has been working on ‘‘the reliability design of electronicequipment, in an industry/academia consortium” under theauspices of Japan Society of Mechanical Engineers and on ‘‘verylong micro channel cooling for computers of future generations”
organized by the Heat Transfer Society of Japan.
Throughout his career Dr. Nakayama has successfully used theprinciples of heat transfer science and engineering to overcome
various technological barriers facing the industry. He has also
made significant contributions to the understanding of heat transfer processes in industrial equipment through the fundamental
studies he conducted with his colleagues. He has been particularly
active in thermal management of electrical and electronic equipment and in the enhancement of boiling and forced convection
heat transfer. His first assignment at Hitachi was developing acooling design for a large-capacity electric generator, in which heapplied the analytical technique he developed during his doctoral
thesis work at Tokyo Tech. The oil crisis in the early 1970 s motivated his team of researchers at Hitachi to improve the design ofevaporators and condensers used in refrigeration machines andled to the development of ‘‘THERMOEXCELs;” famous products
for high heat-flux boiling and condensing surfaces. He developed
analytical models to explain the mechanisms of enhanced boilingand condensing heat transfer on the structured surfaces of evaporator and condenser tubes and used the results of the analyses tooptimize the surface structures. Since the 1980 s and until today,
the focus of his research has been on thermal management of electronic equipment. He participated in the research and development of cooling devices and systems for the mainframe
computers of the 1980 s. In recent years he has been advancingthe methodology of thermal design analysis to aid designers ofcompact electronic equipment. His current research topics include
hot spot occurrence in many-core processor chips, heat conduction
in complex structures, and modeling of electrical-thermal coupledsystems.
While working in industry, Dr. Nakayama was active in sharing
the industrial needs for research with the heat transfer community

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In Celebration / International Journal of Heat and Mass Transfer 106 (2017) 655–656

through publications, seminars, and lectures. Some of his review
articles on thermal management technology published in ASMEApplied Mechanics Reviews and elsewhere have served as tutorial
materials for graduate students and engineers in the industry. A
few of the authors of this article still remember vividly the overwhelming impact of his keynote lectures given in some international conferences, particularly, the lecture on ‘Enhancement ofHeat Transfer’ at the 7th International Heat Transfer Conferencein Munich (1982), which defined new directions in advanced heattransfer research. After he joined the academia, he continued hiscommitment to the development of the thermal management
community through organization of conferences, editorial workon journal issues, and work in various committee. He co-organized
the Japan-US Joint Seminar on ‘Computers in Heat Transfer Scienceand Engineering’ with Professor Kwang-tzu Yang in 1991. He
co-chaired the InterPACK with one of the authors (A. Bar-Cohen)
in 1995, and has participated in the evolution and growth of thisconference series.
Dr. Nakayama served on the editorial board of various journals
such as Heat Transfer Engineering, International Journal of Heat andMass Transfer, Journal of Enhanced Heat Transfer, and Experimental
Thermal and Fluid Science. The list of his administrative activitiesin the professional societies includes; President of the Heat Transfer Society of Japan (1994), Chair of the JSME Thermal Engineering
Division (1990), Chair of ASME Japan Chapter (1990–1992), andexecutive committee member of the International Centre for Heatand Mass Transfer (1994–2002).
Dr. Nakayama has received many awards for his contributions
to the advancement of heat transfer science and engineering aswell as the development of the thermal management community,including:the best paper awards from ASME Heat Transfer Division(1981) and JSME (1965, 1980), the ASME Heat Transfer MemorialAward (1992), the ICHMT Fellowship Award (1996), the ASMEElectrical and Electronic Packaging Division Outstanding Contribution (Thermal) Award (1996, now Allan Kraus Medal), the JSMEAward for Longstanding Contributions to Mechanical Engineering(1997), the ITHERM Achievement Award (2000), the InterPACKAchievement Award (2001), the Thermi Award (IEEE Semi-Therm,2006), the JSME Funai Special Award (2007), the Max Jakob Memorial Award (2013). Dr. Nakayama is a Life Fellow of ASME, a Life
Fellow of IEEE, a Life Member of JSME, and an Honorary Memberof the Heat Transfer Society of Japan.
On behalf of Dr. Prof. Nakayama’s colleagues and friends all over
the world, we would like to wish him many years of continued
success, good health, and happiness.

Avram Bar-Cohen
University of Maryland, United States
Takahiro Daikoku
Hitachi, Ltd., Japan
Nobuhiro Himeno
Shinshu University, Japan
Shigeki Hirasawa
Kobe University, Japan
Takayoshi Inoue
Tokyo Institute of Technology, Japan
Hiroshi Ishiguro
Kyushu Institute of Technology, Japan
Masaru Ishizuka
Toyama Prefectural University, Japan
Yogendra Joshi
Georgia Institute of Technology, United States
Toshio Miyauchi
Takao Nagasaki
Tokyo Institute of Technology, Japan
Masafumi Nakagawa
Toyohashi University of Technology, JapanKen Okazaki
Tokyo Institute of Technology, Japan
Kazuo Onda
Toyohashi University of Technology, JapanOsamu Suzuki
Hitachi, Ltd., Japan
Akira Yabe
New Energy and Industrial Technology Development Organization,
JapanYukio Yamada
The University of Electro-Communications, Japan⇑

Hideo Yoshida
Kyoto University, Japan⇑ Corresponding author.
E-mail address: sakura@hideoyoshida.com
Available online 24 September 2016