InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A.
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104
Website: w w w .invensense.com

Document Number: PS- MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

MPU-9250
Product Specification
Revision 1.0

MPU-9250 Product Specification

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

CONTENTS
1

2

3

4

DOCUMENT INFORMATION ............................................................................................................ 4
1.1

R EVISION HISTORY .................................................................................................................... 4

1.2

PURPOSE AND S COPE ................................................................................................................ 5

1.3

PRODUCT OVERVIEW ................................................................................................................. 5

1.4

APPLICATIONS .......................................................................................................................... 5

FEATURES ...................................................................................................................................... 6
2.1

GYROSCOPE F EATURES ............................................................................................................. 6

2.2

ACCELEROMETER F EATURES ...................................................................................................... 6

2.3

MAGNETOMETER F EATURES ....................................................................................................... 6

2.4

ADDITIONAL FEATURES .............................................................................................................. 6

2.5

MOTIONP ROCESSING ................................................................................................................. 7

ELECTRI CAL CHARACTERISTICS .................................................................................................. 8
3.1

GYROSCOPE S PECIFICATIONS ..................................................................................................... 8

3.2

ACCELEROMETER S PECIFICATIONS .............................................................................................. 93.3

MAGNETOMETER S PECIFICATIONS ............................................................................................. 10

3.4

ELECTRICAL SPECIFICATIONS .................................................................................................... 11

3.5

I2C TIMING C HARACTERIZATION ................................................................................................ 15

3.6

SPI TIMING C HARACTERIZATION ................................................................................................ 16

3.7

ABSOLUTE MAXIMUM RATINGS .................................................................................................. 18

APPLICATIONS INFORMATION ..................................................................................................... 19
4.1

PIN O UT AND SIGNAL D ESCRIPTION............................................................................................ 19

4.2

TYPICAL O PERATING C IRCUIT.................................................................................................... 20

4.3

BILL OF MATERIALS FOR EXTERNAL COMPONENTS ....................................................................... 20

4.4

BLOCK D IAGRAM ..................................................................................................................... 21

4.5

OVERVIEW ............................................................................................................................. 22

4.6

THREE-AXIS MEMS GYROSCOPE WITH 16-BIT A DCS AND S IGNAL CONDITIONING ............................. 22

4.7

THREE-AXIS MEMS A CCELEROMETER WITH 16-BIT A DCS AND S IGNAL CONDITIONING ...................... 22

4.8

THREE-AXIS MEMS MAGNETOMETER WITH 16-BIT ADCS AND SIGNAL CONDITIONING ....................... 224.9

D IGITAL MOTION P ROCESSOR ................................................................................................... 22

4.10

PRIMARY I2C AND SPI S ERIAL COMMUNICATIONS INTERFACES ...................................................... 23

4.11

AUXILIARY I2C S ERIAL INTERFACE ............................................................................................. 23

4.12

SELF-TEST............................................................................................................................. 24

4.13

MPU-9250 SOLUTION USING I2C INTERFACE.............................................................................. 25

Page 2 of 42

MPU-9250 Product Specification

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

4.14

MPU-9250 SOLUTION USING SPI INTERFACE.............................................................................. 26

4.15

CLOCKING .............................................................................................................................. 26

4.16

SENSOR DATA R EGISTERS ....................................................................................................... 27

4.17

FIFO..................................................................................................................................... 27

4.18

INTERRUPTS ........................................................................................................................... 27

4.19

D IGITAL-O UTPUT TEMPERATURE S ENSOR ................................................................................... 27

4.20

BIAS AND LDO........................................................................................................................ 28

4.21

CHARGE PUMP ....................................................................................................................... 28

4.22

STANDARD P OWER MODE ........................................................................................................ 28

4.23

POWER S EQUENCING R EQUIREMENTS AND POWER ON R ESET ....................................................... 285

ADV ANCED HARDWARE FEATURES ............................................................................................ 29

6

PROGRAMMABLE INTERRUPTS ................................................................................................... 30
6.1

7

8

DIGITAL INTERFACE ..................................................................................................................... 32
7.1

I2C AND SP I S ERIAL INTERFACES .............................................................................................. 32

7.2

I2C INTERFACE ....................................................................................................................... 32

7.3

I2C C OMMUNICATIONS P ROTOCOL ............................................................................................. 32

7.4

I2C TERMS ............................................................................................................................ 35

7.5

SPI INTERFACE....................................................................................................................... 36

SERI AL INTERFACE CONSI DERATIONS ....................................................................................... 37
8.1

9W AKE-ON-MOTION INTERRUPT .................................................................................................. 30

MPU-9250 SUPPORTED INTERFACES ......................................................................................... 37

ASSEMBLY.................................................................................................................................... 38
9.1

ORIENTATION OF AXES ............................................................................................................. 38

9.2

PACKAGE D IMENSIONS ............................................................................................................. 38

10 PART NUMBER PACKAGE MARKING ........................................................................................... 40
11 RELIABILITY.................................................................................................................................. 41
11.1

QUALIFICATION TEST POLICY .................................................................................................... 41

11.2

QUALIFICATION TEST PLAN ....................................................................................................... 41

12 REFERENCE.................................................................................................................................. 42

Page 3 of 42

MPU-9250 Product Specification

1 Document Information
1.1

Revision History

Revision
Date

Revision

Description

01/17/14

1.0

Initial Release

Page 4 of 42

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

MPU-9250 Product Specification

1.2 Purpose and Scope
This document is a preliminary product specification, providing a description, specifications, and design
related information on the MPU-9250™ MotionTracking device. The device is housed in a small 3x3x1mm
QFN package.
Specifications are subject to change without notice. Final specifications will be updated based uponcharacterization of production silicon. For references to register map and descriptions of individual registers,
please refer to the MPU-9250 Register Map and Register Descriptions document.

1.3 Product Overview
MPU-9250 is a multi-chip module (MCM) consisting of two dies integrated into a single QFN package. One
die houses the 3-Axis gyroscope and the 3-Axis accelerometer. The other die houses the AK8963 3-Axis
magnetomet er from Asahi Kasei Microdevices Corporation. Hence, the MPU-9250 is a 9-axis
MotionTracking device that combines a 3-axis gyroscope, 3-axis accelerometer, 3-axis magnetometer and a
Digital Motion Proc essor™ (DMP) all in a small 3x3x1mm package available as a pin-compatible upgrade
2from the MPU-6515. With its dedicated I C sens or bus, the MPU-9250 directly provides complete 9-axis
MotionFusion™ output. The MPU-9250 MotionTracking device, with its 9-axis integration, on-chip
MotionFusion™, and run-time calibration firmware, enables manufacturers to eliminat e the costly andcomplex selection, qualification, and system level integration of discrete devices, guaranteeing optimal
motion performance for consumers. MPU-9250 is also designed to interface with multiple non-inertial digit al2
sensors, such as pressure sensors, on its auxiliary I C port.
MPU-9250 features three 16-bit analog-to-digital converters (ADCs) for digitizing the gy roscope outputs,
three 16-bit ADCs for digitizing the accelerometer outputs, and three 16-bit ADCs for digitizing themagnetomet er out puts. For precision tracking of both fast and slow motions, the parts feature a userprogrammable gyroscope full-scale range of ±250, ±500, ±1000, and ±2000°/sec (dps), a userprogrammable accelerometer full-scale range of ±2g, ±4g, ±8g, and ±16g, and a magnetometer full-scale
range of ±4800µT.
Other industry-leading features include programmable digital filters, a precision clock with 1% drift from 2
40°C to 85°C, an embedded temperature sensor, and programmable interrupts. The devic e features I C and
SPI serial interfac es, a VDD operating range of 2.4V to 3.6V, and a separate digital IO supply, VDDIO from
1.71V to VDD.
2

Communication with all registers of the device is performed using either I C at 400kHz or SPI at 1MHz. For
applications requiring faster communications, the sensor and interrupt registers may be read using SPI at
20MHz.
By leveraging its patented and volume-proven CMOS-MEMS fabrication plat form, which integrates MEMS
wafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the package
size down to a footprint and thickness of 3x3x1mm, to provide a very small yet high performance low costpackage. The device provides high robustness by supporting 10,000g shock reliability.

1.4

Applications• TouchAnywhere™ technology (for “no touch” UI Application Control/Navigation)• MotionCommand™ technology (for Gesture Short-cuts)• Motion-enabled game and application framework• Location based services, points of interest, and dead reckoning• Handset and portable gaming• Motion-based game controllers• 3D remote controls for Internet connected DTVs and set top boxes, 3D mice
• Wearable sensors for health, fitness and sports
Page 5 of 42

MPU-9250 Product Specification

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

2 Features
2.1 Gyroscope Features
The triple-axis MEMS gyroscope in the MPU-9250 includes a wide range of features:
•
•
•
•
•
•

Digital-output X-, Y-, and Z-Axis angular rate sensors (gy roscopes) wit h a user-programmable fullscale range of ±250, ±500, ±1000, and ±2000°/sec and integrated 16-bit ADCs
Digitally-programmable low-pass filter
Gyroscope operating current: 3.2mA
Sleep mode current: 8µA
Factory calibrated sensitivity scale factor
Self-test

2.2 Accelerometer Features
The triple-axis MEMS accelerometer in MPU-9250 includes a wide range of features:
•
•
•
•
•
•
•

Digital-output triple-axis accelerometer with a programmable full scale range of ±2g, ±4g, ±8g and±16g and integrated 16-bit ADCs
Accelerometer normal operating current: 450µA
Low power accelerometer mode current: 8.4µA at 0.98Hz, 19.8µA at 31.25Hz
Sleep mode current: 8µA
User-programmable interrupts
Wake-on-motion interrupt for low power operation of applications processor
Self-test

2.3 Magnetometer Features
The triple-axis MEMS magnetometer in MPU-9250 includes a wide range of features:
•
•
•
•
•
•

3-axis silicon monolithic Hall-effect magnetic sensor with magnetic concentrator
Wide dynamic measurement range and high resolution with lower current consumption.
Output data resolution of 14 bit (0.6µT/LSB) or 16 bit (15µT/LSB)
Full scale measurement range is ±4800µT
Magnetometer normal operating current: 280µA at 8Hz repetition rate
Self-t est function with internal magnetic source to confirm magnetic sensor operation on end
products

2.4 Additional Features
The MPU-9250 includes the following additional features:
•
•
•
•
•
•
•
•
•
•
•
•

2

Auxiliary master I C bus for reading data from external sensors (e.g. pressure sensor)
3.5mA operating current when all 9 motion sensing axes and the DMP are enabled
VDD supply voltage range of 2.4 – 3.6V
2
VDDIO reference voltage for auxiliary I C devices
Smallest and thinnest QFN package for portable devices: 3x3x1mm
Minimal cross-axis sensitivity between the accelerometer, gyroscope and magnetometer axes
512 byte FIFO buffer enables the applications processor to read the data in bursts
Digital-output temperature sensor
User-programmable digital filters for gyroscope, accelerometer, and temp sensor
10,000 g shock tolerant
2
400kHz Fast Mode I C for communicating with all registers
1MHz SPI serial interface for communicating with all registers
Page 6 of 42

MPU-9250 Product Specification

•
•
•
2.5

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

20MHz SPI serial interface for reading sensor and interrupt registers
MEMS structure hermetically sealed and bonded at wafer level
RoHS and Green compliant

MotionProcessing
Internal Digital Motion Processing™ (DMP™) engine supports advanced MotionP rocessing and low
power functions such as gesture recognition using programmable interrupts• Low-power pedometer functionality allows the host processor to sleep while the DMP maintains thestep count.

•

Page 7 of 42

MPU-9250 Product Specification

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

3 Electrical Characteristics
3.1 Gyroscope Specifications
Typical Operating Circuit of section 4.2, VDD = 2.5V, VDDIO = 2.5V, TA=25°C, unless otherwise noted.
PARAMETERCONDITIONS

Full-Scale Range

FS_SEL=0
FS_SEL=1
FS_SEL=2
FS_SEL=3

Gyroscope ADC Word Length
Sensitivity Scale Factor

Sensitivity Scale Factor Tolerance
Sensitivity Scale Factor Variation Over
Temperature
Nonlinearity
Cross-Axis Sensitivity
Initial ZRO Tolerance
ZRO Variation Over Temperature
Total RMS Noise
Rate Noise Spectral Density
Gyroscope Mechanical Frequencies
Low Pass Filter Response

MIN

FS_SEL=0
FS_SEL=1
FS_SEL=2
FS_SEL=3
25°C-40°C to +85°C
Best fit straight line; 25°C
25°C
-40°C to +85°C
DLPFCFG=2 (92 Hz)

Programmable Range

Gyroscope Startup Time

From Sleep mode

Output Data Rate

Programmable, Normal mode

Table 1 Gyroscope Specifications

Page 8 of 42

25
5

TYP

MAX

º/s
º/s
º/s
º/s
bits
LSB/(º/s)
LSB/(º/s)
LSB/(º/s)
LSB/(º/s)
%
%

±0.1
±2
±5
±30
0.1
0.01
27

29
250

%
%
º/s
º/s
º/s-rmsº/s/√Hz
KHz
Hz

8000

Hz

35
4

UNITS

±250
±500
±1000
±2000
16
131
65.5
32.8
16.4
±3
±4

ms

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

MPU-9250 Product Specification

3.2 Accelerometer Specifications
Typical Operating Circuit of section 4.2, VDD = 2.5V, VDDIO = 2.5V, TA=25°C, unless otherwise noted.
PARAMETER

Full-Scale Range

ADC Word Length

Sensitivity Scale Factor

Initial Tolerance
Sensitivity Change vs. Temperature
Nonlinearity
Cross-Axis Sensitivity
Zero-G Initial Calibration Tolerance
Zero-G Level Change vs. Temperature
Noise Pow er Spectral Density
Total RMS Noise
Low Pass Filter ResponseIntelligence Function Increment
Accelerometer Startup Time

CONDITIONSMIN

AFS_SEL=0
AFS_SEL=1
AFS_SEL=2
AFS_SEL=3
Output in tw o’s complement format
AFS_SEL=0
AFS_SEL=1
AFS_SEL=2
AFS_SEL=3
Component-Level-40°C to +85°C AFS_SEL=0
Component-level
Best Fit Straight Line
Component-level, X,Y
Component-level, Z-40°C to +85°C
Low noise mode
DLPFCFG=2 (94Hz)
Programmable Range

Output Data Rate

±0.026

%/°C

±0.5
±2
±60
±80
±1.5
300

%
%
mg
mg
mg/°C
µg/√Hzmg-rmsHz
mg/LSB
ms
ms

8
260

500

0.24

Low noise (active)

Table 2 Accelerometer Specifications

±15
4

UNITS
g
g
g
g
bits
LSB/g
LSB/g
LSB/g
LSB/g
%

4
20
30

Duty-cycled, over temp

Page 9 of 42

MAX

±2
±4
±8
±16
16
16,384
8,192
4,096
2,048
±3

5

From Sleep mode
From Cold Start, 1ms V DD ramp
Low power (duty-cycled)

TYP

Hz
%

4000

Hz

MPU-9250 Product Specification

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

3.3 Magnetometer Specifications
Typical Operating Circuit of section 4.2, VDD = 2.5V, VDDIO = 2.5V, TA=25°C, unless otherwise noted.
PARAMETERCONDITIONSMINMAGNETOMETER SENSITIVITY
Full-Scale Range
ADC Word Length
Sensitivity Scale Factor
ZERO-FIELD OUTPUT
Initial Calibration Tolerance

Page 10 of 42

TYP

MAX

UNITS

±4800
14
0.6

µT
bits
µT / LSB

±500

LSB

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

MPU-9250 Product Specification

3.4

Electrical Specifications

3.4.1

D.C. Electrical Characteristics

Typical Operating Circuit of section 4.2, VDD = 2.5V, VDDIO = 2.5V, TA=25°C, unless otherwise noted.
PARAMETERCONDITIONS

MIN

TYP

MAX

Units

VDD

2.4

VDDIO

1.71

2.5

3.6

V

1.8

VDD

V

Notes

SUPPLY VOLTAGESSUPPLY CURRENTS
Normal Mode

Accelerometer Low Pow er Mode
(DMP, Gyroscope, Magnetometer
disabled)
Full Chip Idle Mode Supply Current

9-axis (no DMP), 1 kHz gyro ODR, 4 kHz
accel ODR, 8 Hz mag. repetition rate

3.7

mA

6-axis (accel + gyro, no DMP), 1 kHz gyro
ODR, 4 kHz accel ODR

3.4

mA

3-axis Gyroscope only (no DMP), 1 kHz ODR

3.2

mA

6-axis (accel + magnetometer, no DMP), 4
kHz accel ODR, mag. repetition rate = 8 Hz

730

µA

3-Axis Accelerometer, 4kHz ODR (no DMP)

450

µA

3-axis Magnetometer only (no DMP), 8 Hz
repetition rate

280

µA

0.98 Hz update rate

8.4

µA

1

31.25 Hz update rate

19.8

µA

1

8

µA

TEMPERATURE RANGE
Specified Temperature Range

Performance parameters are not applicablebeyond Specified Temperature Range

-40

+85

°C

Table 3 D.C. Electrical Characteristics
Notes:
1.

Acceleromet er Low Power Mode supports the following output data rates (ODRs ): 0.24, 0.49, 0.98,
1.95, 3.91, 7.81, 15.63, 31.25, 62.50, 125, 250, 500Hz. Supply current for any update rat e can becalculated as:
Supply Current in µA = Sleep Current + Update Rate * 0.376

Page 11 of 42

MPU-9250 Product Specification

3.4.2

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

A.C. Electrical Characteristics

Typical Operating Circuit of section 4.2, VDD = 2.5V, VDDIO = 2.5V, TA=25°C, unless otherwise noted.
Param eter
Supply Ramp Time

Conditions
Monotonic ramp. Ramp rate
is 10% to 90% of the final
value

Operating Range

Ambient

Sensitivity

Untrimmed

Room Temp Offset

21°C

Supply Ramp Time (TRAMP )Valid pow er-on RESET

Start-up time for register read/write

From pow er-up

2

I C ADDRESSV IH, High Level Input Voltage
V IL, Low Level Input Voltage
CI, Input Capacitance
V OH, High Level Output Voltage
V OL1, LOW-Level Output Voltage
V OL.INT 1, INT Low -Level Output Voltage
Output Leakage Current
tINT , INT Pulse Width
VIL, LOW Level Input Voltage
VIH, HIGH-Level Input Voltage
Vhys, Hysteresis
VOL, LOW-Level Output Voltage
I OL, LOW-Level Output Current
Output Leakage Current
t of, Output Fall Time from VIHmax to VILmax
V IL, LOW-Level Input Voltage
V IH, HIGH-Level Input Voltage
V hys , Hysteresis
V OL1, LOW-Level Output Voltage
V OL3, LOW-Level Output Voltage
IOL, LOW-Level Output Current
Output Leakage Current
tof, Output Fall Time from V IHmax to V ILmax

Sample Rate

Clock Frequency Initial Tolerance

MIN

TYP

MAX

Units

0.1

100

ms

-40

85

°C

333.87

LSB/°C00.01

AD0 = 0AD0 = 1

LSB

20

100

ms

11

100

ms

1101000
1101001
0.7*VDDIO
0.3*VDDIO< 10

RLOAD=1MΩ;
RLOAD=1MΩ;

0.9*VDDIO
0.1*VDDIO
0.1

OPEN=1, 0.3mA sink
Current
OPEN=1LATCH_INT_EN=0

100
50
-0.5V
0.7*VDDIO

0.3*VDDIOVDDIO +
0.5V
0.1*VDDIO

3mA sink current
VOL=0.4V
VOL=0.6V
Cb bus capacitance in pf

0

0.4
3
6
100

20+0.1Cb-0.5V
0.7* VDDIO

250
0.3*VDDIOVDDIO +
0.5V
0.1* VDDIOVDDIO > 2V; 1mA sinkcurrent
VDDIO < 2V; 1mA sinkcurrent
V OL=
0.4V
V OL = 0.6V
Cb bus capacitance in pF
Fchoice=0,1,2
SMPLRT_DIV=0
Fchoice=3;
DLPFCFG=0 or 7
SMPLRT_DIV=0
Fchoice=3;
DLPFCFG=1,2,3,4,5,6;
SMPLRT_DIV=0
CLK_SEL=0, 6; 25°C

Page 12 of 42

V
V
pF
V
V
V
nA
µs
V
V
V
V
mA
mA
nA
ns
V
V

0

0.4

V
V

0

0.2* VDDIO

V

250

mA
mA
nA
ns

3
6
100
20+0.1Cb

-2

32

kHz

8

kHz

1

kHz
+2

%

MPU-9250 Product Specification

Frequency Variation over Temperature

CLK_SEL=1,2,3,4,5; 25°C
CLK_SEL=0,6
CLK_SEL=1,2,3,4,5-1-10

Table 4 A.C. Electrical Characteristics

Page 13 of 42

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

+1
+10
±1

%
%
%

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

MPU-9250 Product Specification

3.4.3

Other Electrical Specifications

Typical Operating Circuit of section 4.2, VDD = 2.5V, VDDIO = 2.5V, TA=25°C, unless otherwise noted.
PARAMETERCONDITIONSSPI Operating Frequency, All
Registers Read/Write

Low Speed Characterization

MIN

High Speed CharacterizationSPI Operating Frequency, Sensor
and Interrupt Registers Read OnlyI2C Operating Frequency

TYP
100
±10%
1 ±10%

MAX

kHz
MHz

20 ±10%
All registers, Fast-mode
All registers, Standard-mode

Table 5 Other Electrical Specifications

Page 14 of 42

Units

MHz
400
100

kHz
kHz

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

MPU-9250 Product Specification

3.5 I2C Timing Characterization
Typical Operating Circuit of section 4.2, VDD = 2.4V to 3.6V, VDDIO = 1.71 to VDD, TA=25°C, unlessotherwise noted.
Param eters
I2C TIMING
f SCL, SCL Clock Frequency
tHD.ST A , (Repeated) START Condition HoldTime
tLOW , SCL Low PeriodtHIGH, SCL High PeriodtSU.ST A , Repeated START Condition Setup
Time
tHD.DAT , SDA Data Hold TimetSU.DAT , SDA Data Setup Timetr, SDA and SCL Rise Timetf, SDA and SCL Fall Time
tSU.ST O, STOP Condition Setup Time

Conditions
I2C FAST-MODE

Cb bus cap. from 10 to 400pF
Cb bus cap. from 10 to 400pF

tBUF, Bus Free Time Betw een STOP and
START Condition
Cb, Capacitive Load for each Bus LinetVD.DAT , Data Valid Time
tVD.ACK , Data Valid Acknowledge TimeMin

Typical

Max

Units

400
0.6

kHz
µs

1.3
0.6
0.6

µs
µs
µs

0
100
20+0.1Cb
20+0.1Cb
0.6

µs
ns
ns
ns
µs

300
300

1.3

Notes

µs
< 400
0.9
0.9

pF
µs
µs

2

Table 6 I C Timing Characteristics
Notes:••

Timing Characteristics apply to both Primary and Auxiliary I2C Bus
Based on characterizat ion of 5 parts over temperature and voltage as mounted on evaluation board or insockets2

I C Bus Timing Diagram

Page 15 of 42

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

MPU-9250 Product Specification

3.6 SPI Timing Characterization
Typical Operating Circuit of section 4.2, VDD = 2.4V to 3.6V, VDDIO = 1.71V to VDD, TA=25°C, unlessotherwise noted.
Param eters

Conditions

Min

Typical

Max

Units

1

MHz

Notes

SPI TIMING
f SCLK , SCLK Clock Frequency
tLOW , SCLK Low Period

400

ns

tHIGH, SCLK High Period

400

ns

tSU.CS , CS Setup Time

8ns

tHD.CS , CS Hold Time

500

ns

tSU.SDI, SDI Setup Time

11

nstHD.SDI, SDI Hold Time

7

tVD.SDO, SDO Valid Time

Cload = 20pF

tHD.SDO, SDO Hold Time

Cload = 20pF

ns
100

4

ns
ns

tDIS.SDO, SDO Output Disable Time

50

ns

Table 7 SPI Timing Characteristics
Notes:
1.

Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets

SPI Bus Timing Diagram

3.6.1

fSCLK = 20MHz

Param eters

Conditions

Min

Typical

Max

Units

20

MHz

SPI TIMING
f SCLK , SCLK Clock Frequency

0.9

tLOW , SCLK Low Period

-

-

ns

tHIGH, SCLK High Period

-

-

ns

tSU.CS , CS Setup Time

1ns

tHD.CS , CS Hold Time1ns

Page 16 of 42

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

MPU-9250 Product SpecificationtSU.SDI, SDI Setup Time

0ns

tHD.SDI, SDI Hold Time

1ns

tVD.SDO, SDO Valid Time

Cload = 20pF

25

tDIS.SDO, SDO Output Disable Time

ns
25

ns

Table 8 fCLK = 20MHz
Note:
1.

Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets

Page 17 of 42

Document Number: PS-MPU-9250A-01
Revision: 1.0
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MPU-9250 Product Specification

3.7 Absolute Maximum Ratings
Stress above those listed as “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only and functional operation of the device at these conditions is not implied.
Exposure to the absolute maximum ratings conditions for extended periods may affect device reliability.

Specification

Sym bol

Supply Voltage

Acceleration

Conditions

MIN

MAX

Units

V DD

-0.5

4.0

V

V DDIO

-0.5

4.0

V

10,000g

Any axis, unpow ered,
0.2ms duration

Temperature

ESD Tolerance

Operating

-40

105

°C

Storage

-40

125

°C

HBM

2

KV

MM

250

V

Page 18 of 42

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

MPU-9250 Product Specification

4 Applications Information
Pin Out and Signal Description
Pin Num ber
1

Pin Nam e
RESVPin Description
Reserved. Connect to VDDIO.

7
8

AUX_CLVDDIO

I2C Master serial clock, for connecting to external sensors
Digital I/O supply voltage

910AD0 / SDOREGOUTI2C Slave Address LSB (AD0); SPI serial data output (SDO)
Regulator filter capacitor connection

11
12

FSYNC
INT

Frame synchronization digital input. Connect to GND if unused.
Interrupt digital output (totem pole or open-drain)

13
18

VDD
GND

Pow er supply voltage and Digital I/O supply voltage
Pow er supply ground

19
20

RESV
RESV

Reserved. Do not connect.
Reserved. Connect to GND.

21
22

AUX_DAnCS

I2C master serial data, for connecting to external sensors
Chip select (SPI mode only)

23

SCL / SCLKI2C serial clock (SCL); SPI serial clock (SCLK)24

SDA / SDII2C serial data (SDA); SPI serial data input (SDI)

2 – 6, 14 - 17

NC

Not internally connected. May be used for PCB trace routing.

SDA / SDISCL / SCLKnCS

AUX_DA

RESV

RESV

24

23

22

21

20

19

Table 9 Signal Descriptions

RESV

1

18 GND

NC

2

17 NC

NC

3

NC

4

15 NC

NC

5

14 NC

NC

6

13 VDD

16 NC

8

9

10

11

12

VDDIO

AD0/SDOREGOUT

FSYNC

INT

7

MPU-9250

AUX_CL

4.1

Figure 1 Pin Out Diagram for MPU-9250 3.0x3.0x1.0mm QFNPage 19 of 42

Document Number: PS-MPU-9250A-01
Revision: 1.0
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MPU-9250 Product Specification

Typical Operating Circuit

RESV

1

18

NC

2

NC

3

NC

GND

RESV

RESV

20

19

21

AUX_DASDA / SDI

nCS
22

23

RESV
19

24

RESV
20

21

nCS

SCL / SCLKAUX_DA

22

23

SDA / SDI
24

SCLK
SDI

SCL / SCLK

nCS

VDDIO
SCL
SDA

GND

RESV

1

18

17 NC

NC

2

17 NC

16 NC

NC

3

4

15 NC

NC

4

NC

5

14 NC

NC

5

14 NC

NC

6

13 VDDNC

6

13 VDDC3, 10 nF

AD0

11

12

FSYNC

INT

REGOUT 10

9
AD0/SDO

1.8 – 3.3VDC

8

C2, 0.1 µF

C1, 0.1 µF

C3, 10 nF

15 NC

7

12
INT

2.4 – 3.3VDC

16 NC

MPU-9250

AUX_CL

11
FSYNC

9

REGOUT 10

8

AD0/SDO

7
AUX_CL
1.8 – 3.3VDC

VDDIO

MPU-9250

VDDIO

4.2

2.4 – 3.3VDC
C2, 0.1 µF

C1, 0.1 µF

SD0

(a)

(b)

Figure 2 MPU-9250 QFN Application Schematic: (a) I2C operation, (b) SPI operation
Note that the INT pin should be connected to a GPIO pin on the system processor that is capable of waking
the system processor from suspend mode.

4.3

Bill of Materials for External Components
Component
LabelSpecification

Quantity

Regulator Filter Capacitor

C1

Ceramic, X7R, 0.1µF ±10%, 2V

1

VDD Bypass Capacitor

C2

Ceramic, X7R, 0.1µF ±10%, 4V

1

VDDIO Bypass Capacitor

C3

Ceramic, X7R, 10nF ±10%, 4V

1

Table 10 Bill of Materials

Page 20 of 42

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

MPU-9250 Product Specification

4.4

Block Diagram

MPU-9250
Self
test

X Accel

ADC

Self
test

Y AccelADC

INTInterrupt
StatusRegisternCS
Slave I2C and
SPI SerialInterface

FIFO

AD0 / SDO
SCL / SCLKSDA / SDI

Z Accel

ADC

Self
test

X Gyro

ADC

Self
test

Y GyroSelf
test

Signal Conditioning

Self
test

User & Config
Registers
SerialInterface
Bypass
Mux

Master I2C
SerialInterface

SensorRegisters

ADC

Temp Sensor

ADC

AUX_DAFSYNCADC

Z GyroAUX_CL

Digital Motion
Processor(DMP)

Signal Conditioning

ADC

ADC

ADC

X
CompassY
CompassZ
Compass

Bias & LDOs

ChargePump
VDD

Page 21 of 42

GND

REGOUT

VDDIO

MPU-9250 Product Specification

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

4.5 Overview
The MPU-9250 is comprised of the following key blocks and functions:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
4.6

Three-axis MEMS rate gyroscope sensor with 16-bit ADCs and signal conditioning
Three-axis MEMS accelerometer sensor with 16-bit ADCs and signal conditioning
Three-axis MEMS magnetometer sensor with 16-bit ADCs and signal conditioning
Digital Motion Processor (DMP) engine
2
Primary I C and SPI serial communications interfaces
2rd
Auxiliary I C serial interface for 3 party sensors
Clocking
Sensor Data Registers
FIFO
Interrupts
Digital-Output Temperature Sensor
Gyroscope, Accelerometer and Magnetometer Self-test
Bias and LDO
Charge Pump
Three-Axis MEMS Gyroscope with 16-bit ADCs and Signal Conditioning

The MPU-9250 consists of three independent vibratory MEMS rate gyroscopes, which detect rotation about
the X-, Y-, and Z- Axes. When the gyros are rotated about any of the sense axes, the Coriolis Effect causes
a vibration that is detected by a capacitive pickoff. The resulting signal is amplified, demodulated, and filteredto produce a voltage that is proportional to t he angular rat e. This voltage is digitized using individual on-chip
16-bit Analog-to-Digital Converters (ADCs) to sample each axis. The full-scale range of the gyro sensors
may be digitally programmed to ±250, ±500, ±1000, or ±2000 degrees per second (dps). The ADC sample
rate is programmable from 8,000 s amples per second, down to 3.9 samples per second, and us er-s electablelow-pass filters enable a wide range of cut-off frequencies.

4.7

Three-Axis MEMS Accelerometer with 16-bit ADCs and Signal Conditioning

The MPU-9250’s 3-Axis accelerometer uses separate proof masses for each axis. Acceleration along aparticular axis induces displacement on the corresponding proof mass, and capacitive sensors detect thedisplacement differentially. The MPU-9250’s architecture reduces the acceleromet ers’ susceptibility tofabrication variations as well as to thermal drift. When the device is placed on a flat surface, it will measure
0g on the X- and Y-axes and +1g on the Z-axis. The accelerometers’ scale factor is calibrated at the factoryand is nominally independent of supply voltage. Each sensor has a dedicated sigma-delta A DC for providing
digital outputs. The full scale range of the digital output can be adjusted to ±2g, ±4g, ±8g, or ±16g.

4.8Three-Axis MEMS Magnetometer with 16-bit ADCs and Signal Conditioning

The 3-axis magnetometer uses highly sensitive Hall sensor technology. The magnetometer portion of the IC
incorporates magnetic sensors for detecting terrestrial magnetism in the X-, Y-, and Z- Axes, a sensor driving
circuit, a signal amplifier chain, and an arithmetic circuit for processing the signal from each sensor. Each
ADC has a 16-bit resolution and a full scale range of ±4800 µT.

4.9

Digital Motion Processor

The embedded Digital Motion Processor (DMP) is located within the MPU-9250 and offloads comput ation of
motion processing algorithms from the host processor. The DMP ac quires data from accelerometers,
Page 22 of 42

MPU-9250 Product Specification

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014rdgyroscopes, magnet ometers and additional 3 party sensors, and processes the data. The resulting data canbe read from the DMP’s registers, or can be buffered in a FIFO. The DMP has access to one of the MPU’s
external pins, which can be used for generating interrupts. This pin (pin 12) should be connected t o a pin on
the host processor that can wake the host from suspend mode.
The purpose of the DMP is to offload both timing requirements and processing power from the hostprocessor. Typically, motion processing algorithms should be run at a high rate, oft en around 200Hz, in orderto provide accurat e results with low latency. This is required even if the application updates at a much lower
rate; for example, a low power user interface may update as slowly as 5Hz, but the motion processing shouldstill run at 200Hz. The DMP can be used as a tool in order t o minimize power, simplify timing, simplify thesoftware architecture, and save valuable MIPS on the host processor for use in the application.

4.10 Primary I2C and SPI Serial Communications Interfaces
2
The MP U-9250 communicates to a system processor using either a SP I or an I C serial interface. The MPU29250 always acts as a slave when communicating to the system processor. The LSB of the of the I C slave
address is set by pin 9 (AD0).

4.11 Auxiliary I2C Serial Interface
2
The MPU-9250 has an auxiliary I C bus for communicating to off-chip sensors. This bus has two operating
modes:•••2I C Master Mode: The MPU-9250 acts as a master to any external sens ors connected to the2
auxiliary I C bus
2
Pass-Through Mode: The MPU-9250 directly connects the primary and auxiliary I C buses together,allowing the system processor to directly communicate with any external sensors.
2
Note: AUX_DA and AUX_CL should be left unconnected if the Auxiliary I C mode is not used.
2

Auxiliary I C Bus Modes of Operation:•

2

I C Master Mode: Allows the MPU-9250 to directly access the data registers of external digit alsensors, such as a magnetometer. In this mode, the MPU-9250 directly obtains data from auxiliary
sensors without intervention from the system applications processor.
2

For example, In I C Master mode, the MPU-9250 can be configured to perform burst reads, returning
the following data from a magnetometer:

X magnetometer data (2 bytes)
Y magnetometer data (2 bytes)
Z magnetometer data (2 bytes)

2

The I C Master can be configured to read up to 24 bytes from up to 4 auxiliary sensors. A fifth sensor
can be configured to work single byte read/write mode.
•

Pass-Through Mode: Allows an external system processor to act as master and directly
2
communicate to the external sensors connected to the auxiliary I C bus pins (AUX_DA and2rd
AUX_CL). In this mode, the auxiliary I C bus control logic (3 party sensor interface block) of the2
MPU-9250 is disabled, and the auxiliary I C pins AUX_DA and A UX_CL are connected to the main2
I C bus through analog switches internally.

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MPU-9250 Product Specification

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

Pass-Through mode is useful for c onfiguring the external sensors, or for keeping the MPU-9250 in a
low-power mode when only the external sensors are used. In this mode, the system processor can2still access MPU-9250 data through the I C interface.
Pass-Through mode is also used to access the AK8963 magnetometer directly from the host. In thisconfiguration the slave address for the AK8963 is 0X0C or 12 decimal.
2

Auxiliary I C Bus IO Logic Levels
2

For MPU-9250, the logic level of the auxiliary I C bus is VDDIO. For further information regarding the MPU9250 logic levels, please refer to Section 10.2.

4.12 Self-Test
Please refer to the register map document for more details on self-test.
Self-t est allows for the testing of the mechanical and electrical portions of the sensors. The self-test for eac hmeasurement axis can be activated by means of the gy roscope and accelerometer self-test registers(registers 13 to 16).
When the self-test is activated, the electronics cause the sensors to be actuated and produce an output
signal. The output signal is used to observe the self-test response.
The self-test response is defined as follows:
Self-test response = Sensor output with self-test enabled – Sensor output without self-test enabled
When the value of the self-test res ponse is within the appropriate limits, the part has passed self-t est. Whenthe self-t est response exceeds the appropriate values, the part is deemed to have failed self-test. It is
recommended to use InvenSense MotionA pps software for executing self-test. Further det ails, including theself-test limits are included in the MPU-9250 Self-Test applications note available from InvenSense.

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Document Number: PS-MPU-9250A-01
Revision: 1.0
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MPU-9250 Product Specification

4.13 MPU-9250 Solution Using I2C Interface
2
In the figure below, the system processor is an I C master to the MPU-9250. In addition, the MPU-9250 is an2rd2
I C master to the optional external 3 party sensor. The MP U-9250 has limited capabilities as an I C Master,and depends on the system processor to manage the initial configuration of any auxiliary sensors. The MPU29250 has an interface bypass multiplexer, which connects the system processor I C bus (S DA and S CL)
2
directly to the auxiliary sensor I C bus (AUX_DA and AUX_CL).
Once the auxiliary sensors have been configured by the system processor, the interface bypass multiplexer
2
2should be disabled so that the MPU-9250 auxiliary I C master can take control of the sensor I C bus andgather dat a from the auxiliary sensors. The INT pin should be connected to a GP IO on the system processor
that can wake the system from suspend mode.

Interrupt
StatusRegister

INT
I2C Processor Bus: for reading all
sensor data from MPU and for
configuring external sensors (i.e.
compass in this example)

MPU-9250

AD0
Slave I2C
or SPI
SerialInterface

VDD or GND

SCL

SCL

SDA/SDI

SDA

FIFO
Sensor I2C Bus: forconfiguring and readingfrom external sensors

User & Config
Registers

Optional
SensorMaster I2C
SerialInterface

SensorRegisterInterface
BypassMux

AUX_CLSCL

AUX_DA

SDA

3rd party
sensor

Factory
Calibration
DigitalMotionProcessor(DMP)
Interface bypass mux allows
direct configuration ofcompass by system processor

Bias & LDOs

VDD

GND

REGOUT

VDDIOPage 25 of 42

SystemProcessor

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

MPU-9250 Product Specification

4.14 MPU-9250 Solution Using SPI Interface
In the figure below, the system processor is a SPI master to the MPU-9250. The CS, SDO, SCLK, and SDI
2signals are used for SPI communications. Because thes e SPI pins are s hared with the I C slave pins, the2system processor cannot access the auxiliary I C bus through the interface bypass multiplexer, whic h22connects the processor I C interface pins to the sensor I C interface pins.
2

Since the MPU-9250 has limited capabilities as an I C Master, and depends on the system processor to
manage t he initial configuration of any auxiliary sensors, another method must be used for programming the2
sensors on the auxiliary sensor I C bus (AUX_DA and AUX_CL).
When using SPI communications between the MP U-9250 and the system proc essor, configuration of22
devic es on the auxiliary I C sensor bus can be achieved by using I C Slaves 0-4 to perform read and writ e22transactions on any device and register on the auxiliary I C bus. The I C Slave 4 int erface can be used t operform only single byte read and write transactions.
Once the external s ensors have been configured, the MP U-9250 can perform single or multi-byte reads
2
using the sensor I C bus. The read res ults from the Slave 0-3 controllers can be written to the FIFO buffer aswell as to the external sensor registers.
The INT pin should be connected to a GPIO on the system processor capable of waking the processor fromsuspend2

For further information regarding the cont rol of the MPU-9250’s auxiliary I C interface, please refer to the
MPU-9250 Register Map and Register Descriptions document.

Interrupt
StatusRegisterProcessor SPI Bus: for reading alldata from MPU and for configuring
MPU and external sensors

INT

nCS

nCS

MPU-9250
Slave I2C
or SPI
SerialInterface

SDO

SDI

SCLK

SCLK

SystemProcessor

SDO

SDI

FIFO
2

Sensor I C Bus: forconfiguring andreading data fromexternal sensors

ConfigRegister

Optional
SensorMaster I2C
SerialInterface

SensorRegisterInterface
BypassMux

AUX_CLSCL

AUX_DA

SDA

3rd party
sensor

Factory
Calibration
DigitalMotionProcessor(DMP)

I2C Master performs
read and write
transactions on
Sensor I2C bus.

Bias & LDOs

VDD

GND

REGOUT

VDDIO

4.15 Clocking
The MP U-9250 has a flexible clocking scheme, allowing a variety of internal clock sources to be used for theinternal synchronous circuitry. This synchronous circuitry includes the signal conditioning and ADCs, the
DMP, and various control circuits and registers. An on-chip PLL provides flexibility in the allowable inputs forgenerating this clock.

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MPU-9250 Product Specification

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

Allowable internal sources for generating the internal clock are:••An internal relaxation oscillator
Any of the X, Y, or Z gyros (MEMS oscillators with a variation of ±1% over temperature)

Selection of the source for generating the internal synchronous clock depends on the requirements for power
consumption and clock accuracy. These requirements will most likely vary by mode of operation. For
example, in one mode, where the biggest concern is power consumption, the user may wish to operate theDigital Motion Processor of the MP U-9250 to process acceleromet er data, while keeping t he gyros off. In thiscase, the internal relaxation oscillator is a good clock choice. However, in anot her mode, where the gyros
are active, selecting the gyros as the clock source provides for a more accurate clock source.
Clock accuracy is important, since timing errors directly affect the distance and angle calculations performedby the Digital Motion Processor (and by extension, by any processor).
There are also start-up conditions to consider. When the MPU-9250 first starts up, the device uses its
internal clock until programmed to operate from anot her source. This allows the user, for example, to wait
for the MEMS oscillators to stabilize before they are selected as the clock source.

4.16 Sensor Data Registers
The sensor dat a registers contain the latest gyroscope, accelerometer, magnetometer, auxiliary sensor, andtemperature measurement data. They are read-only registers, and are accessed via the serial interface.
Data from these registers may be read anytime.

4.17 FIFOThe MPU-9250 contains a 512-byte FIFO register that is accessible via the Serial Interface. The FIFO
configuration register determines which data is written into the FIFO. Possible choices include gyro data,
accelerometer data, temperature readings, auxiliary sensor readings, and FSY NC input. A FIFO counter
keeps track of how many bytes of valid dat a are contained in the FIFO. The FIFO register supports burst
reads. The interrupt function may be used to determine when new data is available.
For further information regarding the FIFO, please refer to the MPU-9250 Register Map and Register
Descriptions document.

4.18 Interrupts
Interrupt functionality is configured via the Interrupt Configuration register. Items that are configurable include
the INT pin configuration, the int errupt latching and clearing method, and triggers for the interrupt. It ems that
can trigger an interrupt are (1) Clock generator locked to new reference oscillator (us ed when switching clock
sources); (2) new data is available to be read (from the FIFO and Data registers ); (3) acceleromet er event
interrupts; and (4) the MP U-9250 did not receive an acknowledge from an auxiliary sensor on the secondary
2
I C bus. The interrupt status can be read from the Interrupt Status register.
The INT pin should be connected to a pin on the host processor capable of waking that processor fromsuspend.
For further information regarding interrupts, please refer to the MPU-9250 Register Map and Register
Descriptions document.

4.19 Digital-Output Temperature Sensor
An on-chip temperat ure sensor and A DC are used to meas ure the MPU-9250 die temperat ure. The readings
from the ADC can be read from the FIFO or the Sensor Data registers.
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MPU-9250 Product Specification

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

4.20 Bias and LDO
The bias and LDO section generates the int ernal supply and the reference voltages and currents required by
the MPU-9250. Its two inputs are an unregulated VDD and a V DDIO logic reference supply voltage. The
LDO output is bypassed by a capacitor at REGOUT. For further details on the capacitor, please refer to theBill of Materials for External Components.

4.21 Charge Pump
An on-chip charge pump generates the high voltage required for the MEMS oscillators.

4.22 Standard Power Mode
The following table lists the user-accessible power modes for MPU-9250.

Mode

Name

Gyro

Accel

Magnetometer

DMP

1

Sleep Mode

Off

Off

Off

Off

2

Standby Mode

Drive On

Off

Off

Off

3

Low-Power Accelerometer Mode

Off

Duty-Cycled

Off

On or Off4

Low-Noise Accelerometer Mode

Off

On

Off

On or Off

5

Gyroscope Mode

On

Off

Off

On or Off6

Magnetometer Mode

Off

Off

On

On or Off7

Accel + Gyro Mode

On

On

Off

On or Off8

Accel + Magnetometer Mode

Off

On

On

On or Off99-Axis Mode

On

On

On

On or Off

Notes:
1. Power consumption for individual modes can be found in Electrical Characteristics section.
4.23 Power Sequencing Requirements and Power on Reset
During power up and in normal operation, V DDIO must not exceed V DD. During power up, VDD and V DDIO
must be monotonic ramps. As stated in Table 4, the minimum VDD rise time is 0.1ms and the maximum ris etime is 100 ms. Valid gyroscope data is available 35 ms (typical) aft er VDD has risen to its final voltage froma cold start and valid accelerometer data is available 30 ms (typical) aft er VDD has risen to its final voltage
assuming a 1ms VDD ramp from cold start. Magnetometer data is valid 7.3ms (typical) after VDD has risen
to its final voltage value from a cold start.

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MPU-9250 Product Specification

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

5 Advanced Hardware Features
The MPU-9250 includes advanced hardware features that can be enabled and disabled through simple
hardware register settings. The advanced hardware features are not initially enabled after device power up.
These features must be individually enabled and configured. These advanced hardware features enable thefollowing motion-based functions without using an external microprocessor:
•
•
•
•
•

Low Power Quaternion (3-Axis Gyro & 6-Axis Gyro + Accel)
Android Orientation (A low-power implementation of Android’s screen rotation algorithm)
Tap (detects the tap gesture)
Pedometer
Significant Motion Detection

To ensure significant motion detection can operate properly, the INT pin should be connected to a GPIO pin
on the host processor that can wake that processor from suspend mode.
Note: Android Orientation is compliant to the Ice Cream Sandwich definition of the function.
For further details on advanced hardware features please refer to the MPU-9250 Register Map.

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MPU-9250 Product Specification

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

6 Programmable Interrupts
The MPU-9250 has a programmable interrupt system which can generate an interrupt signal on the INT pin.
Status flags indicate the source of an interrupt. Interrupt sources may be enabled and disabled individually.

Table of Interrupt Sources
Interrupt Nam e

ModuleMotion Detection

Motion

FIFO Overflow

FIFO

Data ReadySensor Registers

I2C Master errors: Lost Arbitration, NACKs

I2C MasterI2C Slave 4

I2C Master

For information regarding the interrupt enable/disable registers and flag registers, please refer to the MPU9250 Register Map and Register Descriptions document. Some interrupt sources are explained below.

6.1 Wake-on-Motion Interrupt
The MPU-9250 provides motion det ection capability. A qualifying motion sample is one where the highpassed sample from any axis has an absolute value exceeding a us er-programmable threshold. The
following flowchart explains how to configure the Wake-on-Motion Interrupt. For further details on individual
registers, please refer to the MPU-9250 Registers Map and Registers Description document.
In order to properly enable motion interrupts, the INT pin should be connected to a GP IO on the systemprocessor that is capable of waking up the system processor.

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MPU-9250 Product Specification

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

Configuration Wake-on-Motion Interrupt using low power Accel mode

Make Sure Accel is running:• In PWR_MGMT_1 (0x6B) make CYCLE =0, SLEEP = 0 and STANDBY = 0• In PWR_MGMT_2 (0x6C) set DIS_XA, DIS_YA, DIS_ZA = 0 and DIS_XG, DIS_YG, DIS_ZG = 1

SetAccelAccelLPF
LPFsetting
settingto
to184
184 HzHz Bandwidth:
Bandwidth:
Set• InACCEL_CONFIG
2(0x1D)set
ACCEL_FCHOICE_B=
0 and=A_DLPFCFG[2:0]=1(b001)
In ACCEL_CONFIG 2 (0x1D) set ACCEL_FCHOICE_B
1 and A_DLPFCFG[2:]=1(b001)

Enable Motion Interrupt:• In INT_ENABLE (0x38), set the whole register to 0x40 to enable motion interrupt only.

Enable Accel Hardware Intelligence:• In MOT_DETECT_CTRL (0x69), set ACCEL_INTEL_EN = 1 and ACCEL_INTEL_MODE = 1

Set Motion Threshold:• In WOM_THR (0x1F), set the WOM_Threshold [7:0] to 1~255 LSBs (0~1020mg)

Set Frequency of Wake-up:• In LP_ACCEL_ODR (0x1E), set Lposc_clksel [3:0] = 0.24Hz ~ 500Hz

Enable Cycle Mode (Accel Low Power Mode):• In PWR_MGMT_1 (0x6B) make CYCLE =1

Motion Interrupt Configuration CompletedFigure 3. Wake-on-Motion Interrupt Configuration

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MPU-9250 Product Specification

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

7 Digital Interface
7.1 I2C and SPI Serial Interfaces
2
The internal registers and memory of the MPU-9250 can be accessed using either I C at 400 kHz or SPI at
1MHz. SPI operates in four-wire mode.

Serial Interface
Pin Num ber

Pin Nam e

8

VDDIO

Pin Description

9

AD0 / SDO

I2C Slave Address LSB (AD0); SPI serial data output (SDO)

23

SCL / SCLKI2C serial clock (SCL); SPI serial clock (SCLK)24

SDA / SDII2C serial data (SDA); SPI serial data input (SDI)

Digital I/O supply voltage.

Note:
2

2

To prevent switching int o I C mode when using SP I, the I C interface s hould be disabled by setting the
I2C_IF_DIS configuration bit. Setting this bit should be performed immediately after waiting for the time
specified by the “Start-Up Time for Register Read/Write” in Section 6.3.
For further information regarding the I2C_IF_DIS bit, pleas e refer to the MPU-9250 Register Map andRegister Descriptions document.

7.2 I2C Interface
2
I C is a two-wire interface comprised of the signals serial data (SDA ) and serial clock (SCL). In general, the2lines are open-drain and bi-directional. In a generalized I C int erface implementation, attached devic es canbe a master or a slave. The master device puts the slave address on the bus, and the slave device with thematching address acknowledges the master.
The MPU-9250 always operates as a slave device when communicating to the system proc essor, which thus
acts as the master. SDA and SCL lines typically need pull-up resistors to VDD. The maximum bus speed is
400 kHz.
The slave address of the MPU-9250 is b110100X which is 7 bits long. The LSB bit of the 7 bit address is2
determined by the logic level on pin AD0. This allows two MPU-9250s to be connected to the same I C bus.
When used in this configuration, the address of the one of the devices should be b1101000 (pin A D0 is logiclow) and the address of the other should be b1101001 (pin AD0 is logic high).

7.3 I2C Communications Protocol
START (S) and STOP (P) Conditions
2

Communication on the I C bus starts when t he master puts the S TA RT condition (S) on the bus, which isdefined as a HIGH-to-LOW transition of the SDA line while SCL line is HIGH (see figure below). The bus isconsidered to be busy until the master puts a STOP condition (P) on the bus, which is defined as a LOW to
HIGH transition on the SDA line while SCL is HIGH (see figure below).
Additionally, the bus remains busy if a repeated START (Sr) is generated instead of a STOP condition.

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MPU-9250 Product Specification

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

SDA

SCL
S

P

START condition

STOP condition

START and STOP Conditions

Data Format / Ack nowledge
2

I C data bytes are defined to be 8-bits long. There is no restriction to the number of bytes transmitted per
data transfer. Each byte transferred must be followed by an acknowledge (ACK ) signal. The clock for the
acknowledge signal is generated by the master, while the receiver generates the actual acknowledge signal
by pulling down SDA and holding it low during the HIGH portion of the acknowledge clock pulse.
If a slave is busy and cannot transmit or receive another byte of data until some other task has been
performed, it can hold S CL LOW, thus forcing the master into a wait state. Normal data transfer resumes
when the slave is ready, and releases the clock line (refer to the following figure).

DATA OUTPUT BY
TRANSMITTER (SDA)
not acknowledge
DATA OUTPUT BYRECEIVER (SDA)
acknowledge
SCL FROM
MASTER

1

2

8

9

clock pulse for
acknowledgement

START
condition
2

Acknowledge on the I C Bus

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Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

MPU-9250 Product Specification

Communications
After beginning communications with the S TA RT condition (S), the master sends a 7-bit slave addressthfollowed by an 8 bit, the read/write bit. The read/writ e bit indicates whether the master is receiving data fromor is writing to the slave device. Then, the master releases the SDA line and waits for the acknowledge
signal (ACK ) from the slave device. Each byte transferred must be followed by an acknowledge bit. To
acknowledge, the slave device pulls the S DA line LOW and keeps it LOW for the high period of the S CL line.
Data transmission is always terminated by the master with a S TOP condition (P), thus freeing thecommunications line. However, the master can generate a repeated S TART condition (Sr), and address
another slave without first generating a STOP condition (P). A LOW to HIGH transition on the SDA line while
SCL is HIGH defines the stop condition. All SDA changes should take place when SCL is low, with the
exception of start and stop conditions.

SDA

SCL

1–7

8

9

1–7

8

9

1–7

8

9

S

P

START ADDRESS
condition

R/W

ACK

DATA

ACK

DATA

ACK

STOP
condition

2

Complete I C Data Transfer
2

To write the internal MPU-9250 registers, the master transmits the start condition (S), followed by the I C
thaddress and the write bit (0). At the 9 clock cycle (when the clock is high), the MP U-9250 acknowledges thetransfer. Then the master puts the register address (RA ) on the bus. After the MPU-9250 acknowledges thereception of the register address, the master puts the register data ont o the bus. This is followed by the A CK
signal, and data transfer may be concluded by the stop condition (P). To writ e multiple bytes after the last
ACK signal, the master can continue outputting data rather than transmitting a stop signal. In this case, theMPU-9250 automatically increments the register address and loads the data to the appropriate register. The
following figures show single and two-byte write sequences.

Single-Byte Write Sequence
Master

S

AD+W

Slave

RA
ACK

DATA
ACK

P
ACK

Burst Write Sequence
Master
Slave

S

AD+W

RA
ACK

DATA
ACK

DATA
ACK

Page 34 of 42P
ACKMPU-9250 Product Specification

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

2

To read the internal MP U-9250 registers, the master sends a start condition, followed by the I C address anda writ e bit, and then t he register address that is going to be read. Upon receiving the A CK signal from the
MPU-9250, the master transmits a start signal followed by the slave address and read bit. As a result, theMPU-9250 sends an ACK signal and the data. The communication ends with a not acknowledge (NACK )signal and a stop bit from master. The NA CK condition is defined such t hat the S DA line remains high at theth
9 clock cycle. The following figures show single and two-byte read sequences.

Single-Byte Read Sequence
Master

S

AD+W

Slave

RA
ACK

S

AD+R

ACK

NACK
ACK

P

DATA

Burst Read Sequence
Master
Slave

S

AD+W

RA
ACK

S
ACK

AD+R

ACK
ACK

DATA

7.4 I2C Terms
Signal Description
S
Start Condition: SDA goes from high to low while SCL is high2
AD
Slave I C addressW
Write bit (0)R
Read bit (1)ACK
Acknowledge: S DA line is low while the S CL line is high at theth
9 clock cycleth
NACK
Not-Acknowledge: SDA line stays high at the 9 clock cycle
RA
MPU-9250 internal register address
DATA
Transmit or received dataP
Stop condition: SDA going from low to high while SCL is highPage 35 of 42

NACK
DATA

P

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

MPU-9250 Product Specification

7.5 SPI Interface
SPI is a 4-wire synchronous serial interface that uses two control lines and two data lines. The MPU-9250
always operates as a Slave device during standard Master-Slave SPI operation.
With respect to the Master, the Serial Clock output (SCLK ), the Serial Data Output (SDO) and the Serial
Data Input (SDI) are shared among the Slave devices. Each SPI slave device requires its own Chip Select(CS) line from the master.
CS goes low (active) at the start of transmission and goes back high (inactive) at the end. Only one CS line
is active at a time, ensuring that only one slave is selected at any given time. The CS lines of the nonselected slave devices are held high, causing their SDO lines to remain in a high-impedance (high-z) state
so that they do not interfere with any active devices.
SPI Operational Features
1.
2.
3.
4.
5.

Data is delivered MSB first and LSB last
Data is latched on the rising edge of SCLK
Data should be transitioned on the falling edge of SCLK
The maximum frequency of SCLK is 1MHz
SPI read and write operations are completed in 16 or more clock cycles (two or more bytes). The
first byte contains the SPI A ddress, and the following byte(s) contain(s) the SPI data. The first
bit of the first byte contains the Read/Write bit and indicates the Read (1) or Write (0) operation.
The following 7 bits contain the Register Address. In cases of multiple-byte Read/Writes, data is
two or more bytes:
SPI Address format
MSB
R/W

A6

A5

A4

A3

A2

A1

LSB
A0

D4

D3

D2

D1

LSB
D0

SPI Data format
MSB
D7
6.

D6

D5

Supports Single or Burst Read/Writes.

SCLK
SDI
SDO

SPI Master/CS1

SPI Slave 1

/CS

/CS2

SCLK
SDI
SDO
/CS

SPI Slave 2

Typical SPI Master / Slave Configuration

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MPU-9250 Product Specification

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

8 Serial Interface Considerations
8.1 MPU-9250 Supported Interfaces
2
The MPU-9250 supports I C communications on both its primary (microprocessor) serial interface and its
auxiliary interface.
The MPU-9250’s I/O logic levels are set to be VDDIO.
2

The figure below depicts a sample circuit of MP U-9250 with a third party sensor attached to the auxiliary I Cbus. It shows the relevant logic levels and voltage connections.
Note: Actual configuration will depend on the auxiliary sensors used.

I/O Levels and Connections

Page 37 of 42

MPU-9250 Product Specification

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

9 AssemblyThis section provides general guidelines for assembling InvenS ense Micro Electro-Mechanical Systems(MEMS) devices packaged in quad flat no-lead package (QFN) surface mount integrated circuits.

9.1 Orientation of Axes
The diagram below shows the orientation of the axes of sensitivity and the polarity of rotation. Not e the pin 1
identifier (•) in the figure.

+Z

+Y

+Z

MP

+Y

U-

92

50

+X

+X

Figure 4. Orientation of Axes of Sensitivity and Polarity of Rotation for Accelerometer and Gyroscope

+X

MP

U-

92

50

+Y
+Z

Figure 5. Orientation of Axes of Sensitivity for Compass

9.2

Package Dimensions

24 Lead QFN (3x3x1) mm NiPdAu Lead-frame finish

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Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

MPU-9250 Product Specification

SYMBOLS
A
A1
b
c
D
D2
E
E2
e
f (e-b)K
L
R
sy

DIMENSIONS INMILLIMETERS
MIN
NOM
MAX

DESCRIPTION
Package thickness
Lead finger (pad) seating height
Lead finger (pad) width
Lead frame (pad) height
Package width

Exposed pad width
Package length

Exposed pad length
Lead finger-finger (pad-pad) pitch
Lead-lead (Pad-Pad) space
Lead (pad) to Exposed Pad Space
Lead (pad) length
Lead (pad) corner radiusCorner lead (pad) outer radius to corner
lead outer radius

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0.95
0.00
0.15
--2.90
1.65
2.90
1.49
--0.15--0.25
0.075

1.00
0.02
0.20
0.15 REF
3.00
1.70
3.00
1.54
0.40
0.20
0.35 REF
0.30
REF

1.05
0.05
0.25
--3.10
1.75
3.10
1.59
--0.25--0.35-----0.000.25 REF-----0.075

MPU-9250 Product Specification

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

10 Part Number Package Marking
The part number package marking for MPU-9250 devices is summarized below:
Part Number

Part Number Package Marking

MPU-9250

MP92

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MPU-9250 Product Specification

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

11 Reliability
11.1 Qualification Test Policy
InvenSense’s products complete a Qualification Test Plan before being released to production. The
Qualification Test Plan for the MPU-9250 followed the JEDE C JESD 47I Standard, “Stress-Test-Driven
Qualification of Integrated Circuits,” with the individual tests described below.
11.2 Qualification Test Plan
Accelerated Life Tests
TEST

Method/Condition(HTOL/LFR)High Temperature Operating LifeJEDEC JESD22-A108D
Dynamic, 3.63V biased, Tj>125°C[read-points: 168, 500, 1000 hours]
JEDEC JESD22-A118A
Condition A, 130°C, 85%RH, 33.3 psia., unbiased[read-point: 96 hours]
JEDEC JESD22-A103D
Condition A, 125°C Non-Bias Bake
[read-points: 168, 500, 1000 hours](HAST)
Highly Accelerated Stress Test (1)(HTS)
High Temperature Storage Life

Lot
SampleQuantity
/ Lot

Acc /
RejectCriteria

3

77

(0/1)

3

77

(0/1)

3

77

(0/1)

Device Component Level Tests
TEST

Method/Condition(ESD-HBM)
ESD-Human Body ModelJEDEC JS-001-2012
(2KV)

1

3

(0/1)

(ESD-MM)ESD-Machine ModelJEDEC JESD22-A115C(250V)

1

3

(0/1)

(ESD-CDM)
ESD-Charged Device ModelJEDEC JESD22-C101E(500V)

1

3

(0/1)

(LU)
Latch UpJEDEC JESD-78DClass II (2), 125°C; ±100mA
1.5X Vdd Over-voltage

1

6

(0/1)

(MS)
Mechanical ShockJEDEC JESD22-B104C, Mil-Std-883, Method
2002.5 Cond. E, 10,000g’s, 0.2ms,±X, Y, Z – 6 directions, 5 times/direction
JEDEC JESD22-B103B
Variable Frequency (random), Cond. B, 5-500Hz,
X, Y, Z – 4 times/direction
JEDEC JESD22-A104D
Condition G [-40°C to +125°C], Soak Mode 2 [5’][read-Point: 1000 cycles]

3

5

(0/1)

1

5

(0/1)

3

77

(0/1)

(VIB)
Vibration(TC)
Temperature Cycling (1)(1) Tests are preceded by MSL3 Preconditioning in accordance with JEDEC JESD22-A113F

Page 41 of 42

Lot
SampleQuantity
/ Lot

Acc /
RejectCriteria

MPU-9250 Product Specification

Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014

12 Reference
Please refer to “InvenSense MEMS Handling Application Note (A N-IVS-0002A-00)” for the following
information:• Manufacturing Recommendationso Assembly Guidelines and Recommendationso PCB Design Guidelines and Recommendationso MEMS Handling Instructionso ESD Considerations
o Reflow Specificationo Storage Specificationso Package Marking Specificationo Tape & Reel Specificationo Reel & Pizza Box Labelo Packaging
o Representative Shipping Carton Label• Complianceo Environmental Complianceo DRC Complianceo Compliance Declaration Disclaimer

This information furnis hed by InvenSense is believed to be accurate and reliable. How ever, no responsibility is assumed by InvenSense
for its use, or for any infringements of patents or other rights of thir d parties that may result from its use. Specific ations are subject tochange without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order toimprove its design and/or performance, w ithout prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding
the information and specif ications contained in this document. InvenSense assumes no responsibility for any claims or damages arisingfrom information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited
to, claims or damages based on the infringement of patents, copyrights, mask w ork and/or other intellectual property rights.

Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwis e under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for
any other weapons or lif e threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.

©2014 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion,
MotionApps, DMP, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be
trademarks of the respective companies w ith which they are associated.

©2014 InvenSense, Inc. All rights reserved.

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