Power Amplifier
MMIC

ReliaSat

17-21 GHz

Product Datasheet

K-PA-1721

Power Amplifier MMIC for K-band.

Overview

The K-PA-1721 is a 3-stage MMIC power amplifierthat covers frequencies from 17 GHz to 21 GHz.
This MMIC provides 22 dBm of saturated powerand > 29% PAE, with 5 dBm input power, from a
3 V supply voltage and 220 mA current. The small
signal gain is > 21 dB with 0.5 dB flatness, andboth input and output are well matched to 50ohm.
The MMIC is fully passivated for additional
protection and has all bond pads and backside
gold plated. It is compatible with precision die
attach methods, as well as thermo-compression
and thermosonic wire bonding, making it ideal
for MCM and hybrid microcircuit applications.
All data shown is measured with the chip in a
50 Ohm environment, with 100 pF decoupling
capacitors on all DC connections and is contactedusing RF probes.

K-PA-1721

Issue Date: 20/04//2023

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Features17 – 21 GHz> 22 dBm saturated output power> 29% PAE
> 21 dB small signal gain
< 0.5 dB gain flatness
Unconditionally stableApplications•••••

Satellite communications
RadarMobile communications
5GSecurity

DOC REV 5

Page 1 of 9

Information furnished by ReliaSat is believed to be accurate. No responsibility is assumed by ReliaSat for its use, nor for any infringements on the rights of other parties that may result for the useof the information herein. All specifications are subject to change without notice.

Power Amplifier
MMIC

ReliaSat

17-21 GHz

Product Datasheet

Specification Overview
Parameter

Min

Frequency Range

17TypMax

Unit

21(GHz)Gain202122(dB)

Input Return Loss

1014(dB)

Output Return Loss

815(dB)

Pout2222.5

23(dBm)Drain Voltage

3(V)Current

220(mA)

Absolute Maximum Ratings
ParameterRating

Drain Voltage

6V

Drain Current

400 mA

RF Input Power

10 dBmStorage Temperature-65 to +150 OC

Channel Temperature+150OCOperating Temperature-40OC to + 85 OC

Exceeding any one or combination of these limits may cause
permanent damage to this device. Sustained operation near thesesurvivability limits is not recommended.

K-PA-1721

Issue Date: 20/04//2023

DOC REV 5Page 2 of 9

Information furnished by ReliaSat is believed to be accurate. No responsibility is assumed by ReliaSat for its use, nor for any infringements on the rights of other parties that may result for the useof the information herein. All specifications are subject to change without notice.

Power Amplifier
MMIC

ReliaSat

17-21 GHz

Product Datasheet

Measured Performance DataGain

Input Return Loss

K-PA-1721

Issue Date: 20/04//2023

DOC REV 5Page 3 of 9

Information furnished by ReliaSat is believed to be accurate. No responsibility is assumed by ReliaSat for its use, nor for any infringements on the rights of other parties that may result for the useof the information herein. All specifications are subject to change without notice.

Power Amplifier
MMIC

ReliaSat

17-21 GHz

Product Datasheet

Output Return Loss

Saturated Output Power

K-PA-1721

Issue Date: 20/04//2023

DOC REV 5

Page 4 of 9

Information furnished by ReliaSat is believed to be accurate. No responsibility is assumed by ReliaSat for its use, nor for any infringements on the rights of other parties that may result for the useof the information herein. All specifications are subject to change without notice.

Power Amplifier
MMICReliaSat

17-21 GHz

Product Datasheet

PAE

Power Gain

K-PA-1721

Issue Date: 20/04//2023

DOC REV 5

Page 5 of 9

Information furnished by ReliaSat is believed to be accurate. No responsibility is assumed by ReliaSat for its use, nor for any infringements on the rights of other parties that may result for the useof the information herein. All specifications are subject to change without notice.

Power Amplifier
MMIC

ReliaSat

17-21 GHz

Product Datasheet

Output PowerPAE

K-PA-1721

Issue Date: 20/04//2023

DOC REV 5

Page 6 of 9

Information furnished by ReliaSat is believed to be accurate. No responsibility is assumed by ReliaSat for its use, nor for any infringements on the rights of other parties that may result for the useof the information herein. All specifications are subject to change without notice.

Power Amplifier
MMIC

ReliaSat

17-21 GHz

Product Datasheet

Outline Drawing

Notes
1.
2.
3.
4.
5.
6.
7.
8.

All dimensions are in um.
Typical DC bond pads are 80um square.
RF bond pads are 105 x 120um square.
All pads have gold metalisation.
Gold backside metalisation.
Backside metal is ground.
Connections are not required for unlabelled bond pads.
Die thickness is 100um

Die Packaging Information

All die are delivered using gel-paks unless otherwise requested.

K-PA-1721

Issue Date: 20/04//2023

DOC REV 5

Page 7 of 9

Information furnished by ReliaSat is believed to be accurate. No responsibility is assumed by ReliaSat for its use, nor for any infringements on the rights of other parties that may result for the useof the information herein. All specifications are subject to change without notice.

Power Amplifier
MMIC

ReliaSat

17-21 GHz

Product Datasheet

Pad Descriptions
NameDescription

RF InInput RF pad. This Pad is AC coupled

RF OutOutput RF pad. This pad is AC coupled

VD

Drain bias pad

VG

Gate bias pad
The die backside must be connected toRF/DC ground

BottomConnection Configurations

These electronic devices are sensitive toelectrostatic discharge (ESD) and can be damaged
by static electricity. Proper ESD control techniquesshould be used when handling these devices.

K-PA-1721

Issue Date: 20/04//2023

DOC REV 5Page 8 of 9

Information furnished by ReliaSat is believed to be accurate. No responsibility is assumed by ReliaSat for its use, nor for any infringements on the rights of other parties that may result for the useof the information herein. All specifications are subject to change without notice.

Power Amplifier
MMICReliaSat

17-21 GHz

Product Datasheet

General Notes On Assembly

Die should be mounted on conductive material such as gold-plated metal to provide
a good ground and suitable heat sink, if necessary.
1. Attaching the die using Au/Sn preforms is preferable. The Eutectic melt forAu/ Sn occurs at approximately 280 oC so the die (plus mount and preform) isinitially heated up to 180 oC and then it is heated for approximately 10 seconds
to 280 oC using a nitrogen heat gun. The device will survive 10 seconds at thistemperature. The static breakdown for GaAs devices is approximately 330 oC.
2. Pure, dry nitrogen should be used as the heat source.
3. If the devices cannot be lifted/ placed by a vacuum device, then ESD die-lifting
tweezers are preferable.
4. Supply lines should be decoupled with 100 pF capacitors. Larger planar
capacitors could be used if available.
5. Aluminium wire must not be used.

Application CircuitContact InformationReliaSat Offices
e: sales@reliasat.com
www.reliasat.com
K-PA-1721

Issue Date: 20/04//2023

DOC REV 5

Page 9 of 9

Information furnished by ReliaSat is believed to be accurate. No responsibility is assumed by ReliaSat for its use, nor for any infringements on the rights of other parties that may result for the useof the information herein. All specifications are subject to change without notice.