Innovative DC/DC Power Modules
Overview
TI’s broad portfolio of DC/DC power modules is designed specifically to help engineers get to market faster with validated, highperformance solutions. These power modules integrate inductors, FETs, compensation, and other passive components in asingle package to reduce time spent on layout and verification, and speed up time to market with proven reliability.
To browse the entire portfolio and learn more on the latest products, visit: ti.com/powermodules
Featured products
TPSM82821/2/3• 2.4-V to 5.5-V input• 1-A, 2-A, 3-A pin-compatible
family• 1% accuracy over temperature,high efficiency up to 95%• 2 mm × 2.5 mm × 1 mm package

TPSM8A29• 2.7-V to 16-V input• 15-A IOUT
• Reduced external component countwith ultra-fast transient response• 6.5 mm × 7.5 mm × 4.0 mm package

TPSM828664A/6A• 2.4-V to 5.5-V input• 4-A, 6-A pin-compatible family• Selectable low-ripple-forced-PWM
mode, 13 selectable fixed oradjustable VOUT options• 3.5 mm × 4 mm × 1.4 mm package

TPSM265R1• 3-V to 65-V input• 100-mA IOUT
• High light-load efficiency, fixed
3.3 V / 5 V or adjustable VOUT options• 2.8 mm × 3.7 mm × 1.9 mm package

TPSM5D1806• 4.5-V to 15-V input• Dual-channel 6-A or single
12-A IOUT• Selectable software frequency withsync to external clock capability

TLVM13630• 3-V to 36-V input• 3-A IOUT
• FPWM operation, high efficiency up
to 95%, 1% accuracy overtemperature• 4 mm × 6 mm × 1.8 mm package• 5.5 mm × 8.0 mm × 1.8 mm
packageWhy power modules?
Smaller size

Simple solutions

Low EMITPS82740

TPSM265R1
VIN

100

LCIN

VOUT
GND
EN

LOAD

VSEL1

Radiated emissions

90

VOUTSW

VIN

COUT

TPSM63603SRDH
24 VDC, RBoot to CBoot “Open”
5.0 VDC, 3 A, 1 MHz, spread spectrum w/ ferrite
Red: Horizontal; Teal: Vertical80

dB (µVolts/meter)

LM5165

DC/DC
converter

70
60504030

CISPR Class A 10 m
CISPR Class B 10 m

20

VSEL210CTRL

VSEL3120 mm²3060 mm²GND

100Frequency (MHz)1000

Low V IN (<7 V)
22.52.75

6A

VIN (V)4355.5

66.5

TPSM82866A: 6 A, 2.4 to 5.5 V, 4 µA IQ, QFN (3.5×4×1.4)

4A
TPSM82810: 4 A, 2.75 to 6 V, sync-to-clock, µSiP (3×4)
TPSM82864A: 4 A, 2.4 to 5.5 V, 4 µA IQ, QFN (3.5×4×1.4)
3A
TPSM82823: 3 A, 2.4 to 5.5 V, 4 µA IQ, µSiP (2×2.5)
TPSM82813: 3 A, 2.75 to 6 V, sync-to-clock, µSiP (3×4)
2A
TPSM82822: 2 A, 2.4 to 5.5 V, 4 µA IQ, µSiP (2×2.5)
1.6 ATPS8268180: 1.6 A, 2.5 to 5.5 V, µSiP (2.3×2.9)
1A
TPS62827/
TPS62827A:
to 5.5V,
QFN
TPSM82821:
1 A, 4A,
2.4 2.4
to 5.5V, 4 µA
IQ, (1.5x1.5)µSiP (2×2.5)

Embedded<1 A

Overmolded

TPS82740A/B: 0.2 A, 2.2 to 5.5 V, 360 nA IQ, DVS, µSiP (2.3×2.9)Open frame

TPS82671: 0.6 A, 2.3 to 4.8 V, µSiP (2.3×2.9)
21.8

2.5

2.75

34VIN (V)55.566.5Mid V IN (7 V to 30 V)
VIN (V)2344.56791012131415161718202127282970 A
TPSM8D6C24: 35 A dual/ 70 A, 4 to 16 V, PMBus (16×20)
Embedded

25 A

Overmolded

TPSM41625: 25 A, 4 to 16 V, stackable 2× (11×16)

15 A

Open frame

TPSM8A29: 15 A, 2.7 to 16 V, QFN (6.5×7.5)

12 A
TPSM5D1806: 4.5 to 15 V, 6 A dual / single 12 A,
sync-to-clock, QFN (5.5×8)

8A
TPSM84824: 8 A, 4.5 to 17 V, sync-to-clock, QFN (7×7.5)

4A
TPSM84424: 4 A, 4.5 to 17 V, sync-to-clock, QFN (7×7.5)

2.5 A
TPSM84209: 2.5 A, 4.5 to 28 V, QFN (4×4.5)

2ATPS82130: 3 A, 3 to 17 V, 20 µA IQ, µSiP (2.8×3)
TPS82140: 2 A, 3 to 17 V, 20 µA IQ, µSiP (2.8×3)

1ATPS82150: 1 A , 3 to 17 V, 20 µA IQ, µSiP (2.8×3)

2344.5679101213
VIN (V)14151617182021272829

Wide V IN (>30 V)
VIN (V)
233.8

44.23236405060

65706ATPSM63606: 6 A, 3 to 36 V, sync-to-clock, QFN (5×5.5)

4A

Embedded

TPSM53604: 4 A, 3.8 to 36 V, 24 µA IQ, QFN (5×5.5)

Overmolded

3AOpen frame

TPSM63603: 3 A, 3 to 36 V, sync-to-clock, QFN (4×6)
TLVM13630: 3 A, 3 to 36 V, QFN (4×6)

2A
TPSM53602: 2 A, 3.8 to 36 V, 24 µA IQ, QFN (5×5.5)

1.5 A
TPSM5601R5H: 1.5 A, 4.2 to 60 V, QFN (5×5.5)

1A
LMZM23601: 1 A, 4 to 36 V, sync-to-clock, µSIP (3×3.8)<1 ALMZM23600: 0.5 A, 4 to 36 V, sync-to-clock, µSIP (3×3.8)
TPSM265R1: 0.1 A, 3 to 65 V, 10.5 µA IQ, µSIP (2.8×3.7)

233.8

44.2

32

VIN (V)

3640

50

60

65

70

TI module packages

PackageoutlineEmbedded

QFN

LeadedBGA / LGA (QFN-like)

QFN styleTO-style

PowerManagementDescription• LGA QFN pinless package• Embedded die in FR laminate(LGA or BGA pads)• MSL2/3• Highest-density package

•••
•
•

QFN-style pinless package
Single copper leadframe
MSL3Size-optimized package
Excellent thermals••••••

TO-style pinned package
Dual copper leadframe
7- and 11-pin versions
MSL3
Large single-thermal padEasy to use

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