PRESS RELEASE
Lasertec Corporation
2-10-1 Shin-yokohama, Kohoku-ku, Yokohama(Code 6920 / Tokyo Stock Exchange 1st Section)

Lasertec to deliver 10th “SICA88 Series” SiC wafer
inspection/review system in one year since its market release
Yokohama, Japan, November 7, 2016 – Lasertec Corporation announced today that it is
now scheduled to ship the 10th unit of SICA88 Series (volume production tool) SiC wafer
inspection/review system released in September 2015. SICA88 Series has reached thismilestone in merely one year since its official release.
Demand for the next generation power devices is booming as the need for higher energy
efficiency is growing rapidly. Among them, SiC devices play an important role in powerelectronics market. Automobile makers are actively pursuing the use of SiC devices in cars
because they offer such merits as downsizing and small power loss. Seeing this as a trigger
to large market growth, SiC substrate manufacturers and SiC device manufacturers in Japan,
Europe and elsewhere worldwide are accelerating development efforts in order to start thefull-fledged volume production in around 2020.
A major challenge for these manufacturers is to make SiC devices less expensive and moreefficient. In supporting their efforts, SICA88 Series has earned a high reputation as a tool thatenables dramatic increase in SiC wafer quality. As a result, it has achieved an order for the10th delivery in just one year since its market release. SICA88 Series has both wafer surface
inspection and photoluminescence inspection in one platform enabling the detection ofsurface defects and defects buried inside. It is also capable of performing a high precision
automatic defect classification (ADC) while capturing high resolution review images at thesame time. SICA88 Series is making contributions in such areas as quality control andproduct rating by SiC wafer manufacturers and production technology development andincoming wafer inspection by SiC device manufacturers.
“Major SiC related manufacturers in Japan including ROHM Co., Ltd. and Showa Denko K.K.
have adopted SICA88 Series,” said Hirokazu Seki, General Manager of Technology
Department 1 at Lasertec. “Multiple industry leaders in Europe and the United States havealso taken the delivery of SICA88 Series. We are receiving many more inquiries about thesystem. The number of customers who introduce a second or third unit is also increasing.
The fact that many customers have adopted SICA88 in such a short period is a testamentthat SICA brings great benefits to them. With SiC devices entering into volume production, a
rapid market growth is forecast. Lasertec will contribute to the improvement of SiC device
quality by providing SICA88.”
About Lasertec
As a leader in metrology and inspection tooling, Lasertec Corporation has been serving the needsof semiconductor, compound semiconductor, renewable energy, FPD and other high technology
industries for many years. Since its beginning in 1960, Lasertec has been evolving and growing
to keep pace with the world’s rapidly expanding and changing high technology manufacturing
requirements. In addition to the innovative technologies, Lasertec’s global support infrastructure
assures customers full satisfaction through high tool availability that maximizes the capital
investment and device yield. For more information, go to www.lasertec.co.jp/en.
Contact:
Genichiro Kamiyama
Manager, Solution Sales Department 1
Lasertec Corporation
Phone: +81-45-478-7337
Fax: +81-45-478-7333
E-mail: sales@Lasertec.co.jp-1-