PRESS RELEASE
Lasertec Corporation
2-10-1 Shin-yokohama, Kohoku-ku, Yokohama(Code 6920 / Tokyo Stock Exchange, 1st Section)

Lasertec announces ROHM’s decision to adopt the latest model of SICA
Yokohama, Japan, August 25, 2015 – Lasertec Corporation announced today that
ROHM Co., Ltd. (“ROHM”), a leading company in power semiconductor device
manufacturing, selected the latest model of Lasertec’s SICA, SiC wafer inspection andreview system.
ROHM provides various high-quality high-performance semiconductor devices thatfeature the state-of-the art process and design technologies for worldwide customers.
Their corporate mission is “Quality is our top priority.” ROHM is a global leader in themanufacture of power devices, especially of silicon carbide or SiC devices. ROHM has
decided to introduce the latest model of SICA as part of its efforts to further enhance SiC
device quality and production infrastructure.
Silicon carbide is a new material with properties suitable for power semiconductors andis viewed as a vitally important option for power device manufacturing. For mass
production of SiC wafers and devices, further quality enhancement is expected. Amidvarious challenges, one of the critical factors in the mass production of high quality
devices is to reduce defects that are commonly generated during grind and epitaxial
processes. In this respect, it is extremely important to have a capability to accurately
and quickly detect and categorize defects that affect device performance. Defects ofinterest (DOI) include not only scratches and epi-defects on wafer surface but also
crystal-related defects such as basal plane dislocations (BPD) and stacking faults (SF)inside epi-layers. Eliminating these killer defects early in the process ensures highdevice yield in mass production.
The latest model of SICA incorporates a photoluminescence-based technology thatenables the simultaneous detection of both surface defects and crystal defects at asignificantly higher throughput. Lasertec will continue to pursue the development andadvancement of defect inspection technologies in order to facilitate the further
enhancement of power device quality and productivity.

-1-About ROHM:
ROHM Co., Ltd. is an industry leader in system LSI, discrete components and module products
utilizing the latest in semiconductor technology. ROHM's proprietary production system, whichincludes some of the most advanced automation technology, is a major factor in keeping it at theforefront of the electronic component manufacturing industry. As a vertically integrated company,
ROHM is able to quickly and efficiently develop highly customized product in a cost effective
manner for Consumer, Automotive, and Industrial sectors. http://www.rohm.com

About Lasertec:
As a leader in metrology and inspection tooling, Lasertec Corporation has been serving the needs ofsemiconductor, compound semiconductor, renewable energy, FPD and other high technology
industries for many years. Since its beginning in 1960, Lasertec has been evolving and growing tokeep pace with the world’s rapidly expanding and changing high technology manufacturing
requirements. In addition to the innovative technologies, Lasertec’s global support infrastructure
assures customers full satisfaction through high tool availability that maximizes the capital
investment and device yield. For more information, go to: www.lasertec.co.jp/en.

Contact:
In Asia:
Genichiro Kamiyama
Leader, Solution Sales Department 1
Phone: +81-45-478-7337http://www.lasertec.co.jp
In US/Europe:Yuji Asakawa
Director, Sales & Business Development Department
Phone: +1-408-437-4065-2-