Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

NO.
ETAD-E3242-00

IX series
Design Guideline

IX series Design guideline
Page - 2 - of 41

Contents
1 Introduction ........................................................................................................................... - 3 1.1

Purpose ....................................................................................................... - 3 -Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

2 Product Information ............................................................................................................. - 4 2.1

Basic Specification ......................................................................................... - 4 -2.2

Product Number Structure .............................................................................. - 5 -2.3

Connector Mating Combination Diagram ........................................................... - 7 -2.4

Component Designation ................................................................................. - 8 -2.5

Keycode variation ........................................................................................ - 10 -2.6

Pin Assignment ........................................................................................... - 11 -2.7

Accessories ................................................................................................. - 13 -2.8

Fluke Adapter ............................................................................................. - 14 -2.9

Diagonal dimensions of Plug and In-line jack ................................................... - 15 -3 Applicable cables ................................................................................................................. - 16 3.1

Applicable cables list .................................................................................... - 16 -3.2

Methods for evaluating transmission characteristics in compliant cables. .............. - 16 -3.3

Channel and permanent link connections. ....................................................... - 17 -3.4

Requests for cable evaluation ........................................................................ - 17 -4 Mounting/Soldering ............................................................................................................ - 18 4.1

Recommended reflow profile temperature ....................................................... - 18 -4.2

Resistance to soldering heat .......................................................................... - 19 -4.3

Reference PCB Layout .................................................................................. - 21 -4.4

Metal Mask - Reference Layout ...................................................................... - 24 -4.5

SMT leads - Dimensions ............................................................................... - 26 -4.6

Solder filling characteristics ........................................................................... - 27 -4.7

Picking area ................................................................................................ - 28 -4.8

Panel Cutout - Reference dimensions .............................................................. - 29 -5 Using Precautions ................................................................................................................ - 31 5.1

Mounting .................................................................................................... - 31 -5.2

Plug........................................................................................................... - 35 -5.3

IP grade ..................................................................................................... - 37 -5.4

In-line jack How to remove it from the panel .................................................. - 38 -5.5

Vibration test .............................................................................................. - 39 -6 Compatibility ....................................................................................................................... - 40 -p. - 2 -IX series Design guideline
Page - 3 - of 41

1 Introduction
1.1 Purpose

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

This guideline describes the precautions on equipment design and work to be taken inaccount, when using the IX series.
Please read this guideline before using the IX series.
Please be aware that the images on this document are a general representation of the
product and they may differ from the specific product in use.
The guideline information is subject to change without prior notice.

p. - 3 -IX series Design guideline
Page - 4 - of 41

2 Product Information
2.1 Basic Specification〇Applicable standard：IEC 61076-3-124〇UL/cUL certification：Receptacle and Plug

〇Current：1.5A/pin（all pin）

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3A/pin（pin No.1,2,6,7）〇Voltage：AC 50V / DC 60V〇Voltage proof：500V DC（1min.）(altitude of 2000m or less.)〇Mechanical operation(mating/unmating)：5000times〇Insertion and Withdrawal Forces：25N Max.

〇Vibration, sinusoidal：10-500Hz 0.35mm 50m/s2 , No electrical discontinuity of 1 μs.

〇Dry heat：+85℃ 500h（mated state）〇Operating Temperature range：-40~+85℃〇Storage Temperature range：-30~+60℃

For more information, please refer to the specification sheet for each product.。

p. - 4 -IX series Design guideline
Page - 5 - of 41

2.2 Product Number Structure〇Receptacle
IX

61G

＃

①

②

③

①Series Name

-

A

-

10

P

(＃＃)

⑤

⑥

⑩

④
IX Series④Mating Key/

A：Type A/Ethernet Communication

Application

B：Type B/Non-Ethernet Communication
C：Type C/Ethernet Communication

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②Mounting/

61G：Upright Right Angle SMT⑤Maximum Number 10：10 pos.

Assembly Method 60G：Horizontal Right Angle SMT③Versionof Usable Positions

80G：Vertical SMT⑥Contact Gender

P：Male Contact

Blank：Ver.1⑩Plating

Blank：Gold Plated

2：Ver.2

Specification(01)：Palladium-Nickel Plated＋ Gold Plated〇Plug
IX 40G ＃①②③①Series Name

②Mounting/

-

A

- 10

④

S

- CV (7.0) (＃＃)

⑤ ⑥

⑦

⑨

IX Series⑩⑤Maximum Number 10：10 pos.
of Usable Positions

8*：8 pos.

⑥Contact Gender

S：Female Contact

Blank：Ver.1⑦Plug Cover

CV：Straight

2：Ver.2

Cabling Direction

CVL1：Downward Cabling

40G：Hand Solder

Assembly Method 30G：IDC(26 to 28 AWG, Insulator Outer Diameterø0.95 to 1.05mm)
31：IDC(24 to 25 AWG, Insulator Outer Diameterø1.1 to 1.25mm)
32：IDC (22 AWG, Insulator Outer
Diameter ø1.4 to 1.6mm)③Version

CVL2：Upward Cabling④Mating Key/

A：Type A/Ethernet Communication⑨Applicable Cable(7.0)：Sheath Outer Diameter ø6.3 toApplication

B：Type B/Non-Ethernet Communication

Diameter

7.2mm

C：Type C/Ethernet Communication⑩Plating

Blank：Gold Plated

Specification(01)：Palladium-Nickel Plated＋ Gold Plated* Contacts No.3 and 8 do not have a hole to pass the wire through the IDC guide.

p. - 5 -IX series Design guideline
Page - 6 - of 41〇In-line JackIX 40G -

A

①

④

②

①Series Name

- 10

P

- JC (7.0)

⑤ ⑥

⑧

⑨

IX Series⑤Maximum Number 10：10 pos.
of Usable Positions②Mounting/

40G：Hand Solder⑥Contact Gender

P：Male Contact④Mating Key/

A：Type A/Ethernet Communication⑨Applicable Cable(7.0)：Sheath Outer Diameter ø6.3 toApplication

B：Type B/Non-Ethernet

Diameter

7.2mm

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Assembly Method

Communicationp. - 6 -IX series Design guideline
Page - 7 - of 41

2.3 Connector Mating Combination Diagram〇Receptacle〇Plug

Upright Right Angle

Straight
IX30G#-#-10S-CV(7.0)(##)
IX31G#-#-10S-CV(7.0)(##)
IX32G#-#- 8S-CV(7.0)(##)

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IX61G#-#-10P(##)

IX40G#-#-10S-CV(7.0)(##)

Horizontal Right Angle
Downward Cabling

IX30G#-#-10S-CVL1(7.0)(##)
IX60G#-#-10P(##)

IX31G#-#-10S-CVL1(7.0)(##)

Vertical

IX32G#-#- 8S-CVL1(7.0)(##)
IX40G#-#-10S-CVL1(7.0)(##)

IX80G#-#-10P(##)
Upward Cabling〇In-line Jack
IX30G#-#-10S-CVL2(7.0)(##)
IX31G#-#-10S-CVL2(7.0)(##)
IX32G#-#- 8S-CVL2(7.0)(##)
IX40G#-#-10S-CVL2(7.0)(##)

IX40G#-#-10P-JC(##)(00)：Gold Plated 0.2μm(01)：Palladium-Nickel Plated 0.75μm + Gold Plated 0.05μm※Use of Gold Plated and Palladium-Nickel + Gold Plated
Palladium-Nickel + Gold Plating is lined up as an alternative to Gold Platingand has no difference in terms of basic performance.
Palladium-Nickel + Gold Plating shall be selected, in case thick Gold Plating is required.
The use of different plating types in combination, is not recommended.
If a combination of different plating types is used, the maximum number ofmating cycles will be 750 times.

p. - 7 -IX series Design guideline
Page - 8 - of 41

2.4 Component Designation〇Component Designation - Plug
Straight plug

Right-angle plug
Cover case

Cover case (without button）

Shield shell

Cable guide
Cable guideSep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

IDC unit
Shield case
Shield case
Cable guide
Shield shell

Cover case

IDC unit

Cable guide

Cover case (with button）

IDC Unit
IX30G

IX31G

IX32G*

Applicable cable：26 to 28 AWG
Outer Diameter ⌀0.95 to 1.05mm

Applicable cable：24 to 25 AWG
Outer Diameter ⌀1.1 to 1.25mm

Applicable cable：22 AWG
Outer Diameter ⌀1.4 to 1.6mm

Cable guide(Clear）
Lot marking*¹

Cable guide(Clear yellow）
Lot marking*¹

Lot marking*¹

Shield plate（Inside）

Shield plate（Inside）

Insert mold（black）

Insert mold（grey）*Contacts No.3 and 8 do not have a hole to pass the wire through the IDC guide.
Solder Unit
IX40G
Applicable cable：22 to 28 AWG
Outer diameter ⌀1.55mm Max.*
Female contact

Cable guide（Clear blue）

Shield plate（inside）

Lot marking
Insert mold

Housing case
* In case of all terminal connections

p. - 8 -Shield plate(Inside)
Insert mold (grey)IX series Design guideline
Page - 9 - of 41〇Component Designation - In-line jackJack unit

Cover caseApplicable cable：22 to 28 AWG
Outer diameter ⌀1.55mm Max.*

Shield case
Rear insert

Male contact

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Jack unit

Housing

Shield caseLot marking*¹
Cover case

Shell

* For all terminal connections〇Component designation - Receptacle
Upright Right Angle

Lot Marking*¹
Shield plate(Inside)

Horizontal Right Angle

Shell

Lot Marking*¹

Male Contact

Insert mold

Shell
Male contact

Insert moldShield plate(Inside)

VerticalShield plate(Inside)
Housing

Male contact
Shell

Lot marking*¹*¹Please refer to the technical specification ATAD-E2360 about Lot marking.

p. - 9 -IX series Design guideline
Page - 10 - of 41

2.5 Keycode variation

Plug

Receptacle

Type A

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Ethernet Communication

Type B
Non-Ethernet Communication

Type C
Ethernet Communication

Please be aware that the orientation of the mating key in relation to the PCB depends on
the receptacle variant.
Please refer to the part 2D drawing or 3D model for further details.

p. - 10 -IX series Design guideline
Page - 11 - of 41

2.6 Pin Assignment
When using A or C keys, the terminal arrangement on the table below shall be applied.
For the B key, any terminal arrangement can be implemented.
Receptacle

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Contact No.

Signal10/100 Mbit/s

1/10 Gbit/s

1

TX+

BI_DA+2

TX-

BI_DA-

3

N.C

GND

4

N.C

BI_DC+

5

N.C

BI_DC-

6

RX+

BI_DB+

7

RX-

BI_DB-

8

N.C

GND

9

N.C

BI_DD+

10

N.C

BI_DD-※When the terminal is used as 0 V or signal ground, it should be isolated fromthe shield (frame ground).

Plug

Contact No.

Signal10/100 Mbit/s

1/10 Gbit/s

1

TX+

BI_DA+2

TX-

BI_DA-

3

N.C

N.C

4

N.C

BI_DC+

5

N.C

BI_DC-

6

RX+

BI_DB+

7

RX-

BI_DB-

8

N.C

N.C

9

N.C

BI_DD+

10

N.C

BI_DD-

p. - 11 -IX series Design guideline
Page - 12 - of 41
In case of change from RJ45/M12 to IX, please refer to the pin assignment correspondanceon the table below.

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1/10 Gbit/s

10/100 Mbit/sp. - 12 -IX series Design guideline
Page - 13 - of 41

2.7 Accessories〇Receptacle Cap

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If enclosure panels are to be installed on mating surfaces, please refer to Note 3 of
EDC-395373-00-00 and consider the panel thickness and layout.
The cap can be easily removed by hooking the cap end with a fingernail orflat-blade screwdriver.

p. - 13 -IX series Design guideline
Page - 14 - of 41

2.8 Fluke Adapter
A dedicated adaptor is available to perform wiring system certification testing using IX Industrial.

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To use this adapter, the DSX Cable Analyzer™ series from Fluke Networks is required.

In the IX, the A key is specific for Ethernet communication and the B key isfor non-Ethernet communication.
Therefore, only the A key is used as an adaptor.
There is no adaptor for the C key.
The adaptors are manufactured by Fluke Networks and can be provided by us andour distributors. These are sold in sets of two.
※For further information on adaptors and measurements, please contact Fluke Networks.

p. - 14 -IX series Design guideline
Page - 15 - of 41

2.9 Diagonal dimensions of Plug and In-line jackThe diagram below shows the reference dimensions for three patterns of
diagonal dimensions when viewed from the plug/relay jack mating surface.
Please use these dimensions as a reference when inserting the jack intoa narrow space such as inside of a robot arm.
〇Plug
①Only IDC/Solder Unit

②After shield shell assembled③After cover case assembled

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(Assembly completed)(13.9)(18.8)(11.3)〇In-line jack
①Only jack unit

②After shield case assembled③After cover case assembled(Assembly completed)(13.6)(12.4)

p. - 15 -(19.1)

IX series Design guideline
Page - 16 - of 41

3 Applicable cables
3.1 Applicable cables list
We carry out conformity assessments of cables with IX Industrial and publish a list ofconformity cables on our website.
(https://www.hirose.com/product/jp/pr/ix_industrial/applicable_cable_list/)
Please contact the respective cable manufacturers for information on the production
status of their cables.

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

※The cable size of the compatible plug is the recommended size.
※In consideration of actual use, compliance tests are carried out on harness products with
1 m and 5 m between the connectors.
All connectors used for evaluation are straight type A plugs.
The values are measured with IX plugs at both ends of the harnesses and do not represent the
specific characteristics of the cables.
Test results are confirmed values, not guaranteed values.

3.2 Methods for evaluating transmission characteristics in compliant cables.
Fluke testers are used to evaluate transmission characteristics, as shown in the diagram below.
〇In case of Plug

Fluke tester

Channel adaptor

Applicable cableix Industrial connector

Channel adaptor Fluke testerix Industrial connector〇In case of In-line jackFluke tester

Permanent linkix Industrial

ix Industrial

Permanent link

adaptorconnector

In-line jackadaptorOutletApplicable cablep. - 16 -OutletFluke tester

IX series Design guideline
Page - 17 - of 41

3.3 Channel and permanent link connections.
Horizontal wiring subsystems consist of floor wiring panels to communication outlets.
The performance of the horizontal wiring subsystem is specified for:
①Channel②Permanent link

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③CP link（similar to the performance standard values for ②Permanent link）

The physical length of the channel is supposed to be less than 100 m and the physicallength of the permanent link is supposed to be less than 90 m.
Channels do not include connections at both ends, while permanent links include connections
at both ends.

3.4 Requests for cable evaluation
Please contact our sales representatives through the cable purchasing channels.

p. - 17 -IX series Design guideline
Page - 18 - of 41

4 Mounting/Soldering
4.1 Recommended reflow profile temperatureThis temperature profile is for reference under the following conditions.
Please check the mounting conditions thoroughly before use, as they may vary depending on

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the type of solder paste, manufacturer, board size and other conditions such as mounting materials.

＜Applicable conditions＞
Temperature measurement point ： Connector lead
Test PCB dimensions： 35×35×1.6 mm

Material： FR4

Solder compositions： Sn96.5/Ag3.0/Cu0.5

Flux content： 10.5～12.5 wt％

Metal mask thickness： 0.15 mm

Reflow cycles： 2 times Max

Reflow conditions： 230 ℃ Min、30 sec Max

Preheat conditions： 150～180 ℃、60 sec

p. - 18 -IX series Design guideline
Page - 19 - of 41

4.2 Resistance to soldering heat
This temperature profile is for reference under the following conditions.
Please check the mounting conditions thoroughly before use, as they may vary depending on

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the type of solder paste, manufacturer, board size and other conditions such as mounting materials.

＜Applicable conditions＞
Temperature measurement point : Connector surface
Reflow cycles: 2 times Max

Reflow conditions: 230 ℃Max, 30 to 60 sec

Preheat conditions: 150 to 180 ℃, 90 to 120 sec

Peak temperature: 260℃, 0 to 10 sec

p. - 19 -IX series Design guideline
Page - 20 - of 41〇Reference reflow temperature profile IPC/JEDEC J-STD-020F conformity
Mounting is also possible at the following temperature profiles in accordancewith IPC/JEDEC J-STD-020F.
Please note that conditions may vary depending on the type of solder paste, manufacturer,
board size and other mounting materials, etc. Please check the mounting conditions

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

thoroughly before use.

＜Applicable conditions＞
Temperature measurement point : Connector lead
Test PCB dimensions: 35×35×1.6 mm

Material: FR4

Solder compositions: Sn96.5/Ag3.0/Cu0.5

Flux content: 10.5～12.5 wt％

Metal mask thickness: 0.15 mm

Reflow cycles: 2 times Max

Reflow conditions: 217℃ Min, 60 to 150 sec

Preheat conditions: 150 to 200℃, 60 to 120 sec

Peak conditions: 255℃ Min, 30 sec Max, 260℃ Max 10sec Max

p. - 20 -IX series Design guideline
Page - 21 - of 41

4.3 Reference PCB Layout
The recommended board thickness is t=1.6 mm.
When changing the board thickness, refer to section 4-5 "Solder filling characteristics" andconsider the amount of solder in the dip.
Dimensional tolerances when not stated, is ±0.05.
When installing a signal ground, make sure that it is not connected to the frame ground.

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IX61G-#-10P(##)

Contact No.1

Contac No.10

PCB endConnector end※1

No conductive trace ※２

In some situations and according to the board design, the locking feature of the plug
may protrude from the bottom of the receptacle when mated.
In this case, a hole in the PCB is provided to prevent the locking feature from scratching
the board.
It is also acceptable to use a notch shape as shown below.

PCB endp. - 21 -IX series Design guideline
Page - 22 - of 41
IX60G-#-10P(##)

Contact No.1

Contact No.6

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Contact No.5

Contact No.10

PCB endConnector end
No conductive trace ※２

IX80G-#-10P(##)

Contact No.1

Contact No.5

No conductive trace ※２Connector mounting area
Contact No.6

Contact No.10

p. - 22 -IX series Design guideline
Page - 23 - of 41※2 Pattern prohibited areas are defined for the following two reasons.
・When a signal pattern is drawn, if there is an insulation breakdown or scraping of thecoating, it will cause a short-circuit with the connector shell.
However, this does not apply to the IX80G, which has no shell on the bottom.
・In this case, if a pattern is placed, it may tilt the connector or cause mounting faults.
If a ground pattern is placed in a prohibited area, the connector will float by the amountof the pattern thickness and cause mounting faults.

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However, as this relates to the connector mounting surface, there will be no problem if a patternis placed as an inner layer of a multi-layer board.

p. - 23 -IX series Design guideline
Page - 24 - of 41

4.4 Metal Mask - Reference Layout
The recommended metal mask thickness is t=0.15 mm.
This layout is based on the following solder paste.
The amount of solder varies depending on the flux content of the solder paste.
In case other solder pastes are used, please adjust the layout based on the criteria describedin section 4.5.
Dimensional tolerance when not mentioned shall be ±0.02mm.

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◆ Used solder paste・Manufacturer： Senju Metal Industry Co., Ltd.

・Product name

： M705-GRN360-K2-V

・Solder component
・Flux content： Sn96.5/Ag3.0/Cu0.5： 10.5～12.5wt%

IX61G-#-10P(##)

PCB end

When mounting with a pitch of less than 14.5 mm in the IX61G, refer to ETAD-E3170-00.

p. - 24 -IX series Design guideline
Page - 25 - of 41

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IX60G-#-10P(##)

PCB end

IX80G-#-10P(##)

p. - 25 -IX series Design guideline
Page - 26 - of 41

4.5 SMT leads - Dimensions(0.2)(0.55)(0.5)(0.97)(0.94)(1.08)(1.0)(1.31)(1.25)

(0.2)

(0.2)

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Please refer to the lead dimensions below, for each type receptacle.
All dimensions are for reference only.

(0.95)(1.4)(1.65)

IX60G

IX61G

IX80G

Straight area

Straight area

Straight area

0.55mm

0.5mm

0.95mmp. - 26 -IX series Design guideline
Page - 27 - of 41

4.6 Solder filling characteristics
Our reference dimensional drawings for PCB and metal masks are designed to ensure that the solder
fill in the dip area, is at least 75% of the board thickness, as described below.

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Dip

Solder

PCB

0％

25％

50％

75％

100％

p. - 27 -IX series Design guideline
Page - 28 - of 41

4.7 Picking area
The picking area is set as follows for automatic mounting.
Only the IX80G comes with an attached picking cap on the mating side.

(6.65)(ø3)
Picking area

IX60G-#-10P(##)(ø3)(6.85)
Picking area

IX80G-#-10P(##)

(7.1)

(5.7)

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IX61G-#-10P(##)

Picking areap. - 28 -IX series Design guideline
Page - 29 - of 41

4.8 Panel Cutout - Reference dimensions
Refer to the diagrams below when drilling holes on the panel or creating the enclosure for receptacles
or relay jacks.
In this case, please make sure that the receptacle opening and the panel surface are on the same side.
For right-angled types, check if the panel and board do not interfere with each other.

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IX61G-#-10P(##)

Top of PCB

IX60G-#-10P(##)

Top of PCB

IX80G-#-10P(##)

p. - 29 -IX series Design guideline
Page - 30 - of 41

IX40G-#-10P-JC(##)

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Panel Cutout 1.5mm

Panel Cutout 2.0mm※When using a cap (IXG-10P-DC), the panel cut dimensions of the receptacle are as follows.

p. - 30 -IX series Design guideline
Page - 31 - of 41

5 Using Precautions
5.1 Mounting〇Flux adhesion
Please take precautions to avoid flux from adhering to the terminal contacts, as this may cause contact
failure. Particularly when flux is sprayed onto the DIP pins with a fluxer, it may infiltrate the connector
through its mating cavity or lock area.

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Mating face

Flow productHole for lock part

〇Cleaning
Cleaning such as flux removal is not recommended, as flux and other residues fromcleaning may cause contact defects.
〇Acceptability of backside reflow
For IX61G* and IX60G*, there is a risk of connector drop when backside reflow is carriedout without assistance.
When mounting on the backside, please consider the mounting order or use adhesives orjigs to prevent dropping.
※Verification results with our recommended board, recommended metal mask and solder paste.
Please note that different results may be obtained depending on the customer's mounting environment.
Receptacle

Backside reflow possible/not possible

IX61G*

Not possible

IX60G*

Not possible

IX80G*

Possiblep. - 31 -IX series Design guideline
Page - 32 - of 41〇About moisture-proof insulating coatings
When using a moisture-proof coating agent, adjust the amount applied, e.g. apply it
only to the terminal mounting area, and check if it does not infiltrate into the mating area.

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■IX61G*

Coatable area

Un-Coatable area

Coatable area

From the SMT tip upwards is
Un-Coatable area

■IX60G*

Coatable area

Un-Coatable area

Coatable area
From the SMT tip upwards is
Un-Coatable areap. - 32 -IX series Design guideline
Page - 33 - of 41■IX80G*

Coatable area

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Above theinsulating seatnear the shell
is Un-coatable
area.

Coatable area
Coatable area

Caution：If the insulation coating material adheres to the shell,
it may enter into the mating opening and cause
continuity failures.
Caution： Excessive coating agent or soaking of the bottom of
the connector, may cause it to infiltrate the matingarea by capillary action.

p. - 33 -IX series Design guideline
Page - 34 - of 41〇Resistance to hand soldering heat
Soldering iron temperature: 350 ℃ Max

Soldering time

: 3 sec Max

These temperature conditions are for reference under the following application conditions.
Please check the mounting conditions thoroughly before use as they may vary depending on

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

the type of solder, manufacturer, board size and other mounting materials.

＜Applicable conditions＞
Test PCB dimensions： 35×35×1.6 mm

Material： FR4

Solder compositions： Sn-3.0Ag-0.5Cu

Soldering area

： SMT, Dip※Hand soldering heat resistance in the state of reflow mounting on the board.

p. - 34 -IX series Design guideline
Page - 35 - of 41

5.2 Plug〇Use without cover case
The use of the cover case attached to the plug is recommended.
However, in case of not using the cover case or overmolding, please ensure that it will notinterfere with the locking spring and its function.
Without the cover case, the shielding case's fixing force may be reduced, and the shell edges may
cause injury. Please consider these points carefully before use.
Without cover case

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With cover caseock armShield case

〇Solder type wiring
High soldering height may cause a short circuit with the shield case or shield shell.
Please confirm the soldering range described in the wiring instructions or protect
the soldered area with insulation tape.
If the outer diameter of the insulator exceeds ⌀1.55, soldering between adjacent terminals will
become difficult.

Shield shell
Insulation
tapeContact
SolderConductor)both side(Lp. - 35 -IX series Design guideline
Page - 36 - of 41〇Notes on assembly
To improve the transmission characteristics (NEXT), connect the twisted pairwith as much twisted pair strands left as possible.
However, in the case of soldering types, depending on the material of the insulation coating,the twisted pairs may melt due to heat, resulting in a short circuit between twisted pairs.

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

(Except in the case of twisted pair shields).

〇Notes on pry insertion and extraction

Note that if the Plug is inserted or removed
with the plug pried against an IX series
Receptacle or In-line jack, the edge of thecentral plastic part may be damaged.

p. - 36 -IX series Design guideline
Page - 37 - of 41

5.3 IP grade
The IP grade of the IX series is equivalent to IP2X on Un-mating conditions
and IP4X on mating conditions.

Equivalent to IP4X：Mating conditions

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Equivalent to IP2X：Un-mating conditions

p. - 37 -IX series Design guideline
Page - 38 - of 41

5.4 In-line jack How to remove it from the panel

The IX relay jack has a locking spring on bothsides of the cover case for fixing onto the panel.
With this lock pressed down, the relay jack can

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

be pulled out of the panel or pushed in for removal.

①PUSH
Panel

②PUSH Step ①Push in the locking springs on bothsides of the cover case with a generalpurpose tool or similar to unlock them.
Step ② Push in or pull out the In-line jackbody while holding the locking spring.

①PUSH

Completep. - 38 -IX series Design guideline
Page - 39 - of 41

5.5 Vibration test
During our vibration tests, the cables are fixed at a distance of 50mm from the connector’s coverSep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

25 mm

end.

p. - 39 -IX series Design guideline
Page - 40 - of 41

6 Compatibility
IX Series connectors comply with IEC 61076-3-124.
Connectors from other manufacturers that comply with IEC 61076-3-124 can beinterchanged without any problems.
Performance other than interlocking compatibility are not guaranteed, even if

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

other manufacturers' products comply with IEC 61076-3-124.

p. - 40 -IX series Design guideline
Page - 41 - of 41

WrittenMT.YASUDA

20240610

ChargedMT.YASUDA

20240610

CheckedKI.KAGOTANI

20240612

Approved

TU.TANIGUCHI

20240612

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

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