Product information

FEATURES:· Easy to install anduse· Fast treatment
times

RotoVAC - Vacuum Plasma TreaterStandard and Customized Vacuum
Plasma Treaters· Standard orcustomizedchambers· Vacuum level· Process gas· Process control· Cost efficientsurface treatment· Vacuum pressureplasmaHead OfficeTantec A/SIndustrivej 6
DK-6640 Lunderskov(+45) 7558 5822
USA:(+1) 630-351-1320
USA/California:(+1) 714-729-3499
Mail:sales@tantec.com
Web:
www.tantec.com

Tantec RotoVAC plasma treater is designed for plasma treatment of small
injection moulded plastic parts, without the need to place them in a jig oruse complicated handling systems. With the RotoVAC drum design, simply
fill the drum and place it in the vacuum chamber. The rotation will ensurethat all parts are treated.
In the treating chamber a vacuum builds up to between 0,1 and 4,0 mbar before an electricaldischarge is created through the integrated plasma electrode. Treatment cycle times are often short,between 20 - 180 seconds depending on the material and its formulation.
The RotoVAC plasma treater is appreciated for its simplicity of operation, reliability in production andfast process speed. Treating gasses such as argon and oxygen can be applied, but in most cases thisis not necessary due to the high power exposed by the plasma discharge.
RotoVAC uses the advanced Tantec power generator HV-X series as power supply, and speciallydesigned plasma transformers to provide voltage to the plasma electrodes.
The rotating drum ensures that all parts are equally treated. The concept includes an extra drum
which can be loaded during treatment and simply exchanged with the one in use when the batch iscompleted.

Technical Data

Fast treatment times
High power impact enables treatment times from
20-180 seconds, depending on material.
Standard or customized chambers
Chamber and drum size can be designed tomost applications. Many available as standard.
Vacuum level
The plasma discharge is active from 0,1 - 4,0mbar depending on application.
Process gas
Process gasses such as oxygen and argon canbe used, but in most cases it is not necessary.

Process control
The entire plasma process is controlled by theHV-X generator and PLC unit. All parameters aredisplayed through the touch panel.
(Standard – Proface).
Cost efficient surface treatment
Due to low power and no need of special
treatment gasses the unit is a very cost efficientsolution for improving surface wettability andadhesion.
Vacuum pressure Plasma
Enables treatment of both conductive andnon-conductive surfaces.

Technical Specifications

RotoVAC Vacuum Plasma Treater

Mains Voltage and Frequency

230 VAC or 480 VAC 3Ph.

Plasma power

Max. 400 Vp/max. 2000 Watt

Power supply

HV-X plasma generator seriesCompressed air inlet

5-6 bar dry and clean

Process gas

Standard: air, oxygen, argon, nitrogen on request

Vacuum pump capacity in m3/min.

15 to 240 m3/min., depending on size of vacuum chamber

Vacuum level0,1 - 4,0 mbar

Evacuation time, typical

20 - 120 seconds, depending on chamber size and pump capacity

Plasma treatment time, typical

20 - 180 seconds, depending on material

Control and connectivity

Complete with touch panel. (Standard – Proface)

Regulation compliance

CE - RoHS - WEEE

www.tantec.com

190917-PLA

Easy to install and use
Connects to main power and compressed air.