Sponsorship
Guideline

A-SSCC 2024
Nov. 18-21, 2024
Hiroshima, Japan

Sponsors Opportunities
The IEEE A-SSCC (Asian Solid-State Circuits Conference) is an international
forum for presenting the most updated and advanced chips and circuit designs insolid-state and semiconductor fields. The conference is supported by the IEEE
Solid-State Circuits Society.
IEEE A-SSCC 2024 will be held in Hiroshima, Japan on November 18-21, 2024
The conference will start with a one-day tutorial session on November 18 andplenary talks is scheduled at the start of the main program, November 19
through 21. The main program includes contributed presentations, panel
discussion, Student Design Contest exhibition and FPGA demo sessions.
We hope that you will support the purpose of the conference and joins us assponsors.
A-SSCC History

Conference Scope2005 Taiwan
2006 China
2007 Korea
2008 Fukuoka, Japan
2009 Taiwan
2010 China
2011 Korea
2012 Kobe, Japan
2013 Singapore
2014 Taiwan
2015 China
2016 Toyama, Japan2017 Korea
2018 Taiwan
2019 Macao2020 Japan (Online)
2021 Korea
2022 China
2023 China
2024 Hiroshima, Japan

1.Analog Circuits & Systems: Amplifiers, comparators, switched capacitor circuits,
continuous-time & discrete-time filters, voltage/current references; DC-DC converters, powercontrol circuits; IF/baseband analog circuits, AGC/VGA; non-linear analog circuits.
2.Data Converters: Nyquist-rate and oversampling A/D, D/A converters, time-to-digitalconverters, and capacitance-to-digital converters; sub-circuits for data converters including
sample-and-hold circuits, calibration circuits, etc.
3.Digital Circuits & Systems: Design, fabrication, and test of digital VLSI systems; highspeed low-power digital circuits, power-reduction and management methods for digital VLSI,
ultra-low-voltage and sub-threshold logic design; leakage reduction techniques; clock
distribution, I/O circuits, reconfigurable logic-array circuits; supply/substrate noise
measurement and cancellation for digital VLSI, variation and fault-tolerant circuits.
4.SoC & Signal Processing Systems: System-on-chip(including 3D integration),
microprocessors, network processors, baseband communication processing system &architectures, system-level power management; multimedia and recognition processing
systems; cryptographic, security, machine learning, deep-learning, and neuromorphic circuits
and systems; bio-medical/neural-network processors and sensor network systems.
5.Wireless: Receivers/transmitters/transceivers for wireless systems; narrowband RF, ultrawideband and millimeter-wave circuits; circuits and building-blocks including RF front-end, LNA,
mixer, power amplifiers, VCOs, frequency synthesizers, RF filters, RF switches, power detectors,
active antennas.
6.Wireline: Receivers/transmitters/transceivers for wireline systems; optical/electrical data
links and backplane transceivers; power-line communi-cation; clock generation circuits, PLL,DLL, spread-spectrum clock generation; building blocks for high-speed wireline
communication; analog-digital mixed-mode circuits.
7.Emerging Technologies and Applications: Advanced system designs and circuit solutions
for technologies and applications including state-of-the-art devices and packaging
technologies; flexible and printable electronics; silicon photonics; smart sensors andtransducers; MEMS for analog, RF, and sensor applications; image sensors and displays;energy harvesting systems; transceiver systems; medical/bio-electronics/bio-inspired chip
design, artificial intelligent system, and cryogenic circuits and systems.
8.Memory: Volatile and Non-volatile memory; new memory designs for 3D/2D architectures,
emerging devices such as resistive-/phase change-/magnetic- /ferro-electric- memory devices;
data storage and multi-bit-cell memory design; cache-memory system, multi-port memory,
memory subsystem, processing in memory, and CAM design; yield-enhancing and ECCtechniques; memory testing and built-in self-test.
9.FPGA: Novel algorithm and/or architecture for integrated circuits validated by FPGA
implementation. The authors of accepted papers are required to participate in demo sessions.

Sponsorship
Guideline

A-SSCC 2024Nov. 18-21, 2024
Hiroshima, Japan

About A-SSCC 2024
-Conference Name:IEEE Asian Solid-State Circuits Conference 2024 (A-SSCC 2024)
Sponsored by：IEEE SSCS（Solid-State Circuits Society）
Date：Monday, November 18 – 21, 2024 (four days)
Venue：International Conference Center Hiroshima, Hiroshima, Japan
Participants (Est.) :400
Proceedings：Online proceedings at D/L site

AccessIMPORTANT DATES- Paper submission due: June 10, 2024, 20:00 (GMT)- Paper selection meeting: July 26, 2024
- Acceptance notification: August 9, 2024
- Final paper submission: September 12, 2024
SCHEDULE FOR SPONSORS- Sponsorship application due: June 30, 2024
A-SSCC 2024 Committee
Steering Committee
Chair
Hoi-Jun Yoo, KAIST, Korea
Members
Tzi-Dar Chiueh, National Taiwan University, Taiwan
Lawrence Loh, MediaTek, USA
Hidetoshi Onodera, Keio University, Japan
SeongHwan Cho, KAIST, Korea
Nicky Lu, Etron Technology Inc., Taiwan
Stefan Rusu, TSMC, USA
Makoto Ikeda, The University of Tokyo, Japan
Seng-Pan U, University of Macau, China
Deog-Kyoon Jeong, Seoul National University, Korea
Eun-Seung Jeong, Samsung Electronics, Korea
Zhihua Wang, Tsinghua University, China
Woogeun Rhee, Tsinghua University, ChinaMasaitsu Nakajima, SOCIONEXT, Japan
Advisors
Tadahiro Kuroda, The University of Tokyo, Japan
Takayasu Sakurai, The University of Tokyo, Japan
Chorng-kuang Wang, National Taiwan University, Taiwan
Liaison Members Anantha Chandrakasan, Massachusetts Institute of Technology, USA
Bram Nauta, Twente University, Holland
Organizing Committee
Chair
Hideshi Miyajima, Kioxia, Japan
Co-Chairs
Sugako Otani, Renesas, Japan
Ryuichi Fujimoto, Kioxia, Japan
Vice Co-Chairs Kazuko Nishimura, Panasonic, Japan
Osamu Watanabe, Toshiba Electronic Devices & Storage, Japan
Secretary
Shinya Furusawa, Renesas, Japan
Treasurer
Yuta Tsubouchi, Kioxia, Japan
Publication & Publicity
Ngo Huy Cu, Kioxia, Japan
Local Arrangement
Minoru Fujishima, Hiroshima University, JapanSC Liaison
Makoto Ikeda, The University Tokyo, Japan
Technical Program Committee
Chair
Pei-Yun Tsai, National Central University, Taiwan
Co-ChairBaoyong Chi, Tsinghua University, China
Vice-Chair
Tsung-Heng Tsai, National Yang-Ming Chiao-Tung University, Taiwan

2

A-SSCC 2024

Sponsorship
Guideline

Nov. 18-21, 2024
Hiroshima, Japan

A-SSCC 2024 provides a variety of options for sponsor packages.
The benefits of each package are summarized below.

Complimentary
registrationPlatinumGoldSilver

５31¥1,000,000¥500,000¥300,000

Logo on conference
we b s i t e / m a t e r i a l s
1 page Ad included in theconference program
Logo on screen saver insession rooms
Logo on vertical bannerin the conference venue
Sponsored Session**
1-min PR movie prior to
one plenary speech* All rates are shown exclusive of tax.
About Sponsored Session:
Date: 50 minutes (1 slot) in 16:00-18:00 on November 19 and 20, 2024.
16:00-16:50, 17:00-17:50, November 19 and 20, 2024.
Location: Hiroshima International Conference Center, B1FRoom capacity: Theater style, 60 people
Room (screen, projector, 2 microphones and speakers included) will beprovided.
Program schedule planning, promotion, and operation are the responsibility ofthe sponsors.
Requests for
additional equipment can be accommodated at an additional cost.
（上記の協賛にプラスすることもできます）

個別協賛

Contact:
A-SSCC 2024 Secretariat
a-sscc_2024@semiconportal.com
https://a-sscc2024.org/

3