Recent developments regarding
Optical MEMS and their applications
Dr. Michael Scholles
Director “Business Development & Strategy”

Fraunhofer Institute for
Photonic Microsystems
Maria-Reiche-Strasse 201109 Dresden / Germany
www.ipms.fraunhofer.descholles@ipms.fraunhofer.de© Fraunhofer IPMS

HISTORY
Fraunhofer IPMS
1992 Fraunhofer IPMS started as branch of theFraunhofer Institute of Microelectronic Circuits andSystems
2003 Fraunhofer Institute for Photonic Microsystems(Fraunhofer IPMS) became an independent institutein Dresden2005 Fraunhofer Center NanoelectronicTechnologies (Fraunhofer CNT) founded as PublicPrivate Partnership with AMD & Infineon

IPMS building

2007 Modernization of the institute and opening ofa new MEMS clean room2013 Fraunhofer CNT became a department ofFraunhofer IPMS as business field IPMS-CNT© Fraunhofer IPMS

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IPMS-CNT buildingFraunhofer IPMS clean rooms

150 mm MOMS/MEMS clean room1500 m², class 10

150 mm (6”) Wafer line

3 shift preparation for R&D
and pilot fabrication

Technological parametersupervising systemPPS based planning anddocumentation

ISO 9001 certification© Fraunhofer IPMS300 mm CNT clean room

800 m² clean room, class 1000 &200 m² laboratory area

40 Tools for Wafer Processing,Patterning, Metrology & Analytics

Qualification of processes & materials on
300 mm industrial standard equipment

Sub-nm characterization and verification



Full integration into customer process
flow in 28 nm technology and beyond

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Fraunhofer IPMS Location in the „Silicon Saxony“DRESDEN

2 km
Sources: Google / Bing / Infineon / Globalfoundries© Fraunhofer IPMS

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Spatial Light Modulators16 μm pitch
2048 x 512 pixel(1Mega-Pixel)
2 kHz framerate
Operatingwavelength
248nm

row line n-1
row line ncolumn lines© Fraunhofer IPMS

mm+1m+2

Michael Scholles I 23.4.2014 I slide 5m+3

Custom-built SLM by Fraunhofer IPMS: Applications
Laser Direct Imaging

Mask Writing

Microscopy

Adaptive Optics© Fraunhofer IPMS

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MICRONIC MYDATA‘s SIGMA 7700 Mask Writer
Application
 Quick turn-around and costeffective production of reticles.
 Prints entire mask set at the90nm technology node, andnon-critical photomasks down
to the 22nm node
 3h per reticle (4-pass writing),~1.5h (2-pass-writing) ideal solution for 2nd layer
patterning of advanced PSM
and well-suited for advanced
image sensors
Status: Several systems in field© Fraunhofer IPMS

150 nm denseon mask

150 nm spaceon mask

http://www.micronicmydata.com/www/elements.nsf/(read)/CF594C5483A7D029C12
578C4002781F2/$file/ab05547_sigma7700_product_sheet_b.pdf

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Custom-built SLM by Fraunhofer IPMS: Applications
Laser Direct Imaging

Mask Writing

Microscopy

Adaptive Optics© Fraunhofer IPMS

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Introduction: Laser direct imaging in substrate industry
 In semiconductor packages, interposers and substrates interface chips to theoutside world. Advanced packages require a LS resolution down to 10 μm.
 Cost-effective substrates are produced from organic (plastic film) material.
They are processed in form of large panels (e.g. 51cm x 51.5cm).

Source: Micronic Mydata annual report 2011
http://www.micronic-mydata.com© Fraunhofer IPMS

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Introduction: Laser direct imaging in substrate industry

 Micronic Mydata‘s new LDI5sp system acounts for shape changes: highresolution and pattern overlay without loss of productivity.

 Fraunhofer IPMS contributed spatial light modulator (SLM) to the system.

Micronic Mydatas LDI5sp exposure system© Fraunhofer IPMS

Fast one-dimensional analog SLM, 8192 Pixel

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SLMfeaturesLDI SLM Parameter

Value

Chip dimensions [mm]15 x 88

Dimensions of pixel area [mm]4 x 82Fill grade of active area [%]> 90

Number of optical pixels

8192

Mirrors per optical pixel

268

Mirror materialAl-alloy

Operating wavelength [nm]355

Mirror reflectance at 355nm [%]> 85

Pixel resonance frequency [MHz]> 1.3

Achieved contrast

Up to 10001cm© Fraunhofer IPMS

Michael Scholles I 23.4.2014 I slide 11Assembly of SLM chip

 SLM electrodes are hard wired to external data path.
 This enables a high-rate parallel update of all pixels.

© Fraunhofer IPMS

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SLM performance in exposure system: Exposure results 15 um DFR on Cuseed layer,
patterned with amicro-VIA
interconnect test
pattern. Minimum
line/space featuresize is 6 um.

CopperResist© Fraunhofer IPMS

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Micro Scanning Mirrors

 Technology Bulk micromachining
 1D-Scanner Frequency: 250 Hz
 Diameter: 1.5 mm
 Deflection angle: up to +/- 34°(136° optical scan range)© Fraunhofer IPMS

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Micro Scanning Mirror Variants and Applications© Fraunhofer IPMS

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Application: Biometry
MARS: Mobile Authentification by Retina Scanning© Fraunhofer IPMS

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Application: 3D Camera© Fraunhofer IPMS

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Application: Biomedical Imaging
ZEISS light sheet fluorescence microscope system Lightsheet Z.1© Fraunhofer IPMS

© all other images: CARL ZEISS© Fraunhofer IPMS

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Technology Toolset at Fraunhofer IPMS

MEMS/ MOEMS
Bulk MEMSCMOS & „active“ SiliconSurface MEMS 3- dim. Structures inSilicon Thin film surface MEMS

 High Voltage CMOS MEMS on CMOS

 Photodiodes

 Applications: Applications: pH- Sensor

 MEMS Scanner Spatial Light Modulator

 Pressure Sensor

 CMUTs© Fraunhofer IPMS

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PILOT / LOW-VOLUME FABRICATION
Barcode reading systems
based on micro scanningmirrors

PIN-Diodes for high precision
optical measurement andpositioning
N.N.
Piezo resistive pressure
sensors for automotive
applications© Fraunhofer IPMS

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THANK YOU FOR YOUR ATTENTION!

Michael Scholles; phone: +49-351-8823-201; email: scholles@ipms.fraunhofer.de© Fraunhofer IPMS

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