InvenSense Inc.
1197 Borregas Ave, Sunnyvale, CA 94089 U.S.A.
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104
Website: www.invensense.com

Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

MPU-3300
Product Specification
Revision 1.0

1 of 46

MPU-3300 Product Specification

Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

CONTENTS
1REVISION HISTORY ...................................................................................................................................42

PURPOSE AND SCOPE .............................................................................................................................5

3

PRODUCT OVERVIEW ...............................................................................................................................6
3.1

MPU-3300 OVERVIEW ........................................................................................................................64

APPLICATIONS...........................................................................................................................................7

5

FEATURES ..................................................................................................................................................8

6

7

5.1

GYROSCOPE FEATURES .......................................................................................................................8

5.2

ADDITIONAL FEATURES ........................................................................................................................8

5.3

CLOCKING ...........................................................................................................................................8

ELECTRICAL CHARACTERISTICS ...........................................................................................................96.1

GYROSCOPE SPECIFICATIONS ..............................................................................................................9

6.2

ELECTRICAL AND OTHER COMMON SPECIFICATIONS............................................................................10

6.3

ELECTRICAL SPECIFICATIONS, CONTINUED .........................................................................................11

6.4

ELECTRICAL SPECIFICATIONS, CONTINUED .........................................................................................12

6.5

ELECTRICAL SPECIFICATIONS, CONTINUED .........................................................................................13

6.6

I C TIMING CHARACTERIZATION..........................................................................................................14

6.7

SPI TIMING CHARACTERIZATION.........................................................................................................15

6.8

ABSOLUTE MAXIMUM RATINGS ...........................................................................................................16

2

APPLICATIONS INFORMATION ..............................................................................................................17
7.1

PIN OUT AND SIGNAL DESCRIPTION ....................................................................................................17

7.2

TYPICAL OPERATING CIRCUIT.............................................................................................................18

7.3

BILL OF MATERIALS FOR EXTERNAL COMPONENTS ..............................................................................18

7.4

BLOCK DIAGRAM ...............................................................................................................................19

7.5

OVERVIEW ........................................................................................................................................19

7.6

THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING................................19

7.7

PRIMARY I C AND SPI SERIAL COMMUNICATIONS INTERFACES ............................................................20

7.8

AUXILIARY I C SERIAL INTERFACE ......................................................................................................21

7.9

SELF-TEST ........................................................................................................................................22

7.10

BIAS INSTABILITY ...............................................................................................................................22

2

2

Z-AXIS GYROSCOPE – EXAMPLE ALLAN VARIANCE PLOT ..................................................................................23
7.11

MPU-3300 USING SPI INTERFACE .....................................................................................................23

7.12

INTERNAL CLOCK GENERATION ..........................................................................................................24

7.13

SENSOR DATA REGISTERS .................................................................................................................25

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MPU-3300 Product Specification

Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

7.14

FIFO ................................................................................................................................................25

7.15

INTERRUPTS ......................................................................................................................................26

7.16

DIGITAL-OUTPUT TEMPERATURE SENSOR ..........................................................................................26

7.17

BIAS AND LDO ..................................................................................................................................26

7.18

CHARGE PUMP ..................................................................................................................................26

8

PROGRAMMABLE INTERRUPTS............................................................................................................27

9

DIGITAL INTERFACE ...............................................................................................................................282

9.1

I C AND SPI SERIAL INTERFACES .......................................................................................................28

9.2

I C INTERFACE ..................................................................................................................................28

9.3

I C COMMUNICATIONS PROTOCOL ......................................................................................................28

9.4

I C TERMS ........................................................................................................................................31

9.5

SPI INTERFACE .................................................................................................................................32

2
2
2

10 ASSEMBLY ...............................................................................................................................................33
10.1

ORIENTATION OF AXES ......................................................................................................................33

10.2

PACKAGE DIMENSIONS ......................................................................................................................34

10.3

PCB DESIGN GUIDELINES ..................................................................................................................35

10.4

ASSEMBLY PRECAUTIONS ..................................................................................................................36

10.5

STORAGE SPECIFICATIONS.................................................................................................................40

10.6

PACKAGE MARKING SPECIFICATION ....................................................................................................40

10.7

TAPE & REEL SPECIFICATION .............................................................................................................41

10.8

LABEL ...............................................................................................................................................42

10.9

PACKAGING .......................................................................................................................................43

10.10

REPRESENTATIVE SHIPPING CARTON LABEL ...................................................................................44

11 RELIABILITY .............................................................................................................................................45
11.1

QUALIFICATION TEST POLICY .............................................................................................................45

11.2

QUALIFICATION TEST PLAN ................................................................................................................45

12 ENVIRONMENTAL COMPLIANCE...........................................................................................................46

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MPU-3300 Product Specification

1

Revision History

Revision
Date

Revision

Description

3/30/2012

1.0

Initial Release

4 of 46

Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

MPU-3300 Product Specification

2

Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

Purpose and Scope

This product specification provides advanced information regarding the electrical specification and design
related information for the MPU-3300™ MotionTracking™ devices.
Electrical characteristics are based upon design analysis and simulation results only. Specifications are
subject to change without notice. Final specifications will be updated based upon characterization of
production silicon. For references to register map and descriptions of individual registers, please refer to the
MPU-3300 Register Map and Register Descriptions document.

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MPU-3300 Product Specification

3

Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

Product Overview

3.1 MPU-3300 Overview
The MPU-3300 is the world’s first integrated 3-axis gyroscope for Industrial applications. The MPU-3300
features three 16-bit analog-to-digital converters (ADCs) for digitizing the gyroscope outputs. For precision
tracking of motion, the parts feature a user-programmable gyroscope full-scale range of ±225 and ±450°/sec(dps).
An on-chip 1024 Byte FIFO buffer helps lower system power consumption by allowing the system processor
to read the sensor data in bursts and then enter a low-power mode as the MPU collects more data.
2
Communication with all registers of the device is performed using either I C at 400kHz or SPI at 1MHz. For
applications requiring faster communications, the sensor and interrupt registers may be read using SPI at
20MHz. Additional features include an embedded temperature sensor and an on-chip oscillator with ±1%
variation over the operating temperature range.
By leveraging its patented and volume-proven Nasiri-Fabrication platform, which integrates MEMS wafers
with companion CMOS electronics through wafer-level bonding, InvenSense has driven the MPU-3300
package size down to a revolutionary footprint of 4x4x0.9mm (QFN), while providing the highest
performance, lowest noise, and the lowest cost semiconductor packaging required for industrial electronic
devices. The part features a robust 10,000g shock tolerance, and has programmable low-pass filters for thegyroscopes, and the on-chip temperature sensor.
For power supply flexibility, the MPU-3300 operates from VDD power supply voltage range of 2.375V-3.46V.

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MPU-3300 Product Specification

4

Applications•

Attitude Heading Reference Systems (AHRS)oo•Navigation Systems
o
o
o

•
•
•
•
•
•
•
•
•
•

Aerospace
Robotics
Industrial vehicles
Aircraft
Ships

Platform and Antenna Stabilization
Precision Robotics
Inventory Control Systems
Survey Instruments
Factory Equipment
Industrial Power Tools
Unmanned Aerial Vehicles (UAVs)
Precision Agriculture Machinery
Guidance and Steering Applications
Construction Equipment

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Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

MPU-3300 Product Specification

5

Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

Features

5.1 Gyroscope Features
The triple-axis MEMS gyroscope in the MPU-3300 includes a wide range of features:
•
•
•
•
•
•
•
•
•
•

Digital-output X-, Y-, and Z-Axis angular rate sensors (gyroscopes) with a user-programmable fullscale range of ±225, and ±450°/sec
Integrated 16-bit ADCs enable simultaneous sampling of gyros
Enhanced bias and sensitivity temperature stability reduces the need for user calibration
Improved low-frequency noise performance
Digitally-programmable low-pass filter
Bias Instability: 15°/hour on each axis
Gyroscope operating current: 3.6mAStandby current: 10µA
Factory calibrated sensitivity scale factor
User self-test

5.2 Additional Features
The MPU-3300 includes the following additional features:
•
•
•
•
•
•
•
•
•
•
•
5.3
•
•

VDD supply voltage range of 2.375V-3.46V
Smallest and thinnest QFN package for industrial applications: 4x4x0.9mm
1024 byte FIFO buffer reduces power consumption by allowing host processor to read the data inbursts and then go into a low-power mode as the MPU collects more data
Digital-output temperature sensor
User-programmable digital filters for gyroscope and temp sensor
10,000 g shock tolerant
2
400kHz Fast Mode I C for communicating with all registers
1MHz SPI serial interface for communicating with all registers
20MHz SPI serial interface for reading sensor and interrupt registers
MEMS structure hermetically sealed and bonded at wafer level
RoHS and Green compliant
Clocking
On-chip timing generator ±1% frequency variation over full temperature range
Optional external clock inputs of 32.768kHz or 19.2MHz

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Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

MPU-3300 Product Specification

6

Electrical Characteristics

6.1 Gyroscope Specifications
Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.46V, TA = 25°C
PARAMETERGYROSCOPE SENSITIVITY
Full-Scale Range
Gyroscope ADC Word Length
Sensitivity Scale Factor
Sensitivity Scale Factor Tolerance
Sensitivity Scale Factor Variation Over
Temperature
Nonlinearity
Cross-Axis Sensitivity
GYROSCOPE ZERO-RATE OUTPUT (ZRO)
Initial ZRO Tolerance
ZRO Variation Over TemperaturePower-Supply Sensitivity (1 – 10Hz)
Power-Supply Sensitivity (10 – 250Hz)
Power-Supply Sensitivity (250Hz – 100kHz)
Linear Acceleration Sensitivity
SELF-TEST RESPONSE

CONDITIONSMIN

FS_SEL=0
FS_SEL=1

MAX

±225
±450
16
145.6
72.8

UNITS

±2

º/s
º/s
bits
LSB/(º/s)
LSB/(º/s)%%

Best fit straight line; 25°C

0.2
±2

%
%

25°C
-40°C to +105°C
Sine wave, 100mVpp; VDD=2.5V
Sine wave, 100mVpp; VDD=2.5V
Sine wave, 100mVpp; VDD=2.5V
Static

±20
±20
0.2
0.2
4
0.1

º/s
º/s
º/s
º/s
º/s
º/s/g

FS_SEL=0
FS_SEL=1
25°C-40°C to +105°C-3

Change from factory trim
GYROSCOPE NOISE PERFORMANCE
Total RMS Noise
Low-frequency RMS noise
Rate Noise Spectral Density

TYP

-14

FS_SEL=0
DLPFCFG=2 (100Hz)
Bandwidth 1Hz to10Hz
At 10HzGYROSCOPE MECHANICALFREQUENCIES
X-AxisY-AxisZ-AxisLOW PASS FILTER RESPONSE

+3

14
0.05
0.033
0.005

30
27
24

33
30
27

%
º/s-rmsº/s-rmsº/s/ Hz

√

36
33
30

Programmable Range

5256

Programmable
DLPFCFG=0
to ±1º/s of Final

4

8,000

kHz
kHz
kHz
Hz

OUTPUT DATA RATEGYROSCOPE START-UP TIMEZRO Settling30

9 of 46

Hz
ms

NOTES

MPU-3300 Product Specification

Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

6.2 Electrical and Other Common Specifications
Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.46V, TA = 25°C
PARAMETERTEMPERATURE SENSOR
Range
Sensitivity
Temperature Offset
Linearity
VDD POWER SUPPLY
Operating Voltages
Normal Operating Current
Full-Chip Idle Mode Supply Current
Power Supply Ramp Rate
START-UP TIME FOR REGISTER
READ/WRITETEMPERATURE RANGE
Specified Temperature Range

CONDITIONS

MIN

Untrimmed
35oC
Best fit straight line (-40°C to+105°C)TYP°C
LSB/ºC
LSB

±1

°C
3.46

V
mA
µA

100

ms

100

ms

+105

°C

3.6
10

Monotonic ramp. Ramp rate is 10%
to 90% of the final value
20
Performance parameters are notapplicable beyond Specified
Temperature Range

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-40

Units

-40 to +105
340
-521

2.375
Gyroscope

MAX

Notes

MPU-3300 Product Specification

Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

6.3 Electrical Specifications, Continued
Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.46V, TA = 25°C
PARAMETERSERIAL INTERFACESPI Operating Frequency, All
Registers Read/Write

CONDITIONSMIN

Low Speed Characterization
High Speed CharacterizationSPI Operating Frequency, Sensor
and Interrupt Registers Read OnlyI2C Operating Frequency
I2C ADDRESSAll registers, Fast-mode
All registers, Standard-mode
AD0 = 0AD0 = 1

TYP

MAX

Units

100 ±10%kHz

1 ±10%

MHz

20 ±10%

MHz
400
100

kHz
kHz

0.3*VDDV
V

1101000
1101001

DIGITAL INPUTS (SDI/SDA, AD0,SCLK/SCL, FSYNC, /CS, CLKIN)
VIH, High Level Input Voltage
VIL, Low Level Input Voltage

0.7*VDD

CI, Input Capacitance<5

pF

DIGITAL OUTPUT (SDO, INT)
VOH, High Level Output Voltage

RLOAD=1MΩ

VOL1, LOW-Level Output Voltage

RLOAD=1MΩ

VOL.INT1, INT Low-Level Output
Voltage
Output Leakage Current

OPEN=1, 0.3mA sink
Current
OPEN=1

100

nA

tINT, INT Pulse Width

LATCH_INT_EN=050µs

DIGITAL OUTPUT (CLKOUT)
VOH, High Level Output Voltage
VOL1, LOW-Level Output Voltage

RLOAD=1MΩ
RLOAD=1MΩ

0.9*VDDV
0.1*VDD

V

0.1

V

0.9*VDD
0.1*VDD

11 of 46

V
V

Notes

Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

MPU-3300 Product Specification

6.4 Electrical Specifications, Continued
Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.46V, TA = 25°C
Parameters
Primary I2C I/O (SCL, SDA)
VIL, LOW Level Input Voltage
VIH, HIGH-Level Input Voltage
Vhys, Hysteresis
VOL1, LOW-Level Output Voltage
IOL, LOW-Level Output Current
Output Leakage Current
tof, Output Fall Time from VIHmax to VILmax
CI, Capacitance for Each I/O pin
Auxiliary I2C I/O (AUX_CL, AUX_DA)
VIL, LOW-Level Input Voltage
VIH, HIGH-Level Input Voltage
Vhys, Hysteresis
VOL1, LOW-Level Output Voltage
IOL, LOW-Level Output Current
Output Leakage Current
tof, Output Fall Time from VIHmax to VILmax
CI, Capacitance for Each I/O pin

Conditions

3mA sink current
VOL = 0.4V
VOL = 0.6V
Cb bus capacitance in pF

1mA sink current
VOL = 0.4V
VOL = 0.6V
Cb bus cap. in pF

12 of 46

TypicalUnits-0.5V to 0.3*VDD
0.7*VDD to VDD + 0.5V
0.1*VDD
0 to 0.4
35
100
20+0.1Cb to 250
< 10

V
V
V
V
mA
mA
nA
ns
pF

-0.5 to 0.3*VDD
0.7*VDD to VDD+0.5V
0.1*VDD
0 to 0.4
1
1
100
20+0.1Cb to 250
< 10

V
V
V
V
mA
mA
nA
ns
pF

Notes

Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

MPU-3300 Product Specification

6.5 Electrical Specifications, Continued
Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.46V, TA = 25°C
Parameters

Conditions

INTERNAL CLOCK SOURCE
Gyroscope Sample Rate, Fast

CLK_SEL=0,1,2,3
DLPFCFG=0
SAMPLERATEDIV = 0

Gyroscope Sample Rate, Slow

DLPFCFG=1,2,3,4,5, or 6
SAMPLERATEDIV = 0

Reference Clock Output
Clock Frequency Initial Tolerance

CLKOUTEN = 1
CLK_SEL=0, 25°C
CLK_SEL=1,2,3; 25°C
CLK_SEL=0
CLK_SEL=1,2,3
CLK_SEL=1,2,3

Frequency Variation over Temperature
PLL Settling Time
EXTERNAL 32.768kHz CLOCK
External Clock Frequency
External Clock Allowable Jitter
Gyroscope Sample Rate, Fast

CLK_SEL=4

Gyroscope Sample Rate, SlowMin

Typical

Max

Units

8

kHz

1

kHz

1.024
-5
-1

+5
+1
-15 to +10
±1
1

10

MHz
%
%
%
%
ms

32.7681 to 2
8.192

kHz
µs
kHz

DLPFCFG=1,2,3,4,5, or 6
SAMPLERATEDIV = 0

1.024

kHz

Reference Clock Output
PLL Settling Time

CLKOUTEN = 1

1.0486
1

EXTERNAL 19.2MHz CLOCK
External Clock Frequency
Gyroscope Sample Rate
Gyroscope Sample Rate, Fast Mode

CLK_SEL=5

Cycle-to-cycle rms
DLPFCFG=0
SAMPLERATEDIV = 0

10

19.2
Full programmable range
DLPFCFG=0
SAMPLERATEDIV = 0

Gyroscope Sample Rate, Slow Mode

DLPFCFG=1,2,3,4,5, or 6
SAMPLERATEDIV = 0

Reference Clock Output
PLL Settling Time

CLKOUTEN = 1

8

MHz
Hz
kHz

1

kHz

3.9

8000

1.024
1

13 of 46

MHz
ms

10

MHz
ms

Notes

Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

MPU-3300 Product Specification

2

6.6 I C Timing Characterization
Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.46V, TA = 25°C
Parameters

Conditions

I2C TIMINGfSCL, SCL Clock Frequency
tHD.STA, (Repeated) START Condition HoldTime
tLOW, SCL Low PeriodtHIGH, SCL High PeriodtSU.STA, Repeated START Condition Setup
Time
tHD.DAT, SDA Data Hold TimetSU.DAT, SDA Data Setup Timetr, SDA and SCL Rise Timetf, SDA and SCL Fall Time
tSU.STO, STOP Condition Setup Time

I2C FAST-MODEMin

Cb bus cap. from 10 to 400pF
Cb bus cap. from 10 to 400pF

tBUF, Bus Free Time Between STOP and
START Condition
Cb, Capacitive Load for each Bus LinetVD.DAT, Data Valid Time
tVD.ACK, Data Valid Acknowledge Time

Typical

Max

Units

400
0.6

kHz
µs

1.3
0.6
0.6

µs
µs
µs

0
100
20+0.1Cb
20+0.1Cb
0.6

µs
ns
ns
ns
µs

300
300

1.3

µs
< 400
0.9
0.9

2

Note: Timing Characteristics apply to both Primary and Auxiliary I C Bus

2I C Bus Timing Diagram

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pF
µs
µs

Notes

MPU-3300 Product Specification

Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

6.7 SPI Timing Characterization
Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.46V, TA = 25°C, unless otherwise noted.
Parameters

Conditions

Min

Typical

Max

Units

1

MHz

SPI TIMINGfSCLK, SCLK Clock FrequencytLOW, SCLK Low Period

400

ns

tHIGH, SCLK High Period

400

ns

tSU.CS, CS Setup Time

8ns

tHD.CS, CS Hold Time

500

ns

tSU.SDI, SDI Setup Time

11

nstHD.SDI, SDI Hold Time

7

nstVD.SDO, SDO Valid Time

Cload = 20pF

tHD.SDO, SDO Hold Time

Cload = 20pF

100
4

tDIS.SDO, SDO Output Disable Time

10

SPI Bus Timing Diagram

15 of 46

ns
ns
ns

Notes

MPU-3300 Product Specification

Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

6.8 Absolute Maximum Ratings
Stress above those listed as “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only and functional operation of the device at these conditions is not implied.
Exposure to the absolute maximum ratings conditions for extended periods may affect device reliability.

Parameter

RatingSupply Voltage, VDD-0.5V to +6V

REGOUT-0.5V to 2V

Input Voltage Level (CLKIN, AUX_DA, AD0, FSYNC, INT,
SCL, SDA)CPOUT (2.5V ≤ VDD ≤ 3.6V )-0.5V to VDD + 0.5V
-0.5V to 30V

Acceleration (Any Axis, unpowered)

10,000g for 0.2ms

Operating Temperature Range-40°C to +125°C

Storage Temperature Range-65°C to +150°C
2kV (HBM);
200V (MM)Electrostatic Discharge (ESD) Protection

JEDEC Class II (2),125°C±60mA

Latch-up

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Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

MPU-3300 Product Specification

7

Applications Information

7.1

Pin Out and Signal Description
Pin Number

Pin Name

Pin Description

1

CLKIN

Optional external reference clock input. Connect to GND if unused.

6

AUX_DAI2C master serial data, for connecting to external sensors

7

AUX_CLI2C master serial clock, for connecting to external sensors

8

/CS

9

AD0 / SDO

SPI chip select (0=SPI mode)I2C Slave Address LSB (AD0); SPI serial data output (SDO)

10

REGOUT

Regulator filter capacitor connection

11

FSYNC

Frame synchronization digital input. Connect to GND if unused.

12

INT

Interrupt digital output (totem pole or open-drain)

13

VDD

Power supply voltage and Digital I/O supply voltage

18

GND

Power supply ground19, 21RESVReserved. Do not connect.

20

CPOUT

Charge pump capacitor connection

22

CLKOUT

System clock output

23

SCL / SCLKI2C serial clock (SCL); SPI serial clock (SCLK)24

SDA / SDII2C serial data (SDA); SPI serial data input (SDI)

2, 3, 4, 5, 14,
15, 16, 17

NC

Not internally connected. May be used for PCB trace routing.

Top View

SDA/SDI

SCL/SCLK

CLKOUT

RESV

CPOUT

RESV

24

23

22

21

20

19

+Z

CLKIN

1

18

GND

NC

2

17

NC

NC

3

16

NC

NC

4

15

NC

NC

5

14

NC

AUX_DA

613

VDD

MPU-3300

7

8

9

10

11

12

+Y

+Z

MP
U33
00

+Y

+X

AUX_CL/CS

AD0/SDOREGOUT

FSYNC

INT

QFN Package
24-pin, 4mm x 4mm x 0.9mm+X

Orientation of Axes of Sensitivity
and Polarity of Rotation

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Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

MPU-3300 Product Specification

7.2

Typical Operating Circuit

CLKOUTSCL / SCLKSDA / SDI

GND

C3
2.2nF

24 23 22 21 20 19
CLKIN

1

18

2

17

3
4

GND

16

MPU-3300

15VDD

5AUX_DA

14

6

13
7

8

9

10 11 12C2
0.1µF

AUX_CL
GND

C1
0.1µF

INT

FSYNC

AD0 / SDO

/CS

GND

Typical Operating Circuit

7.3

Bill of Materials for External Components
Component

LabelSpecification

Quantity

Regulator Filter Capacitor (Pin 10)

C1

Ceramic, X7R, 0.1µF ±10%, 2V

1

VDD Bypass Capacitor (Pin 13)

C2

Ceramic, X7R, 0.1µF ±10%, 4V

1Charge Pump Capacitor (Pin 20)

C3

Ceramic, X7R, 2.2nF ±10%, 50V1

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Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

MPU-3300 Product Specification

7.4

Block Diagram

MPU-3300
CLKIN
CLKOUT

1
CLOCK

22

FIFO

Self
test

X Gyro12Interrupt
StatusRegister

Clock

8
9

Slave I2C and
SPI SerialInterface

23
24

ADC
ConfigRegisters

Y GyroSelf
test

Z GyroTemp Sensor

ADC

ADC

Signal Conditioning

Self
test

SensorRegisters

SerialInterface
Bypass
Mux

Master I2C
SerialInterface

7
6

11

INT

/CS
AD0 / SDO
SCL / SCLKSDA / SDIAUX_CL
AUX_DA

FSYNC

Factory
Calibration

ADC

ChargePump

Bias & LDO
20

13

CPOUT

VDD

18

10

GND

REGOUT

7.5 Overview
The MPU-3300 is comprised of the following key blocks and functions:
•
•
•
•
•
•
•
•
•
•
•

Three-axis MEMS rate gyroscope sensor with 16-bit ADCs and signal conditioning
2
Primary I C and SPI serial communications interfaces
2
Auxiliary I C serial interface for external accelerometer & other sensors
Clocking
Sensor Data Registers
FIFO
Interrupts
Digital-Output Temperature Sensor
Gyroscope & Self-test
Bias and LDO
Charge Pump

7.6 Three-Axis MEMS Gyroscope with 16-bit ADCs and Signal Conditioning
The MPU-3300 consists of three independent vibratory MEMS rate gyroscopes, which detect rotation about
the X-, Y-, and Z- Axes. When the gyros are rotated about any of the sense axes, the Coriolis Effect causes
a vibration that is detected by a capacitive pickoff. The resulting signal is amplified, demodulated, and filteredto produce a voltage that is proportional to the angular rate. This voltage is digitized using individual on-chip
16-bit Analog-to-Digital Converters (ADCs) to sample each axis. The full-scale range of the gyro sensors
may be digitally programmed to ±225, or ±450 degrees per second (dps). The ADC sample rate is

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programmable from 8,000 samples per second, down to 3.9 samples per second, and user-selectable lowpass filters enable a wide range of cut-off frequencies.
2

7.7 Primary I C and SPI Serial Communications Interfaces
2
The MPU-3300 communicates to a system processor using either a SPI or an I C serial interface. The MPU2
3300 always acts as a slave when communicating to the system processor. The LSB of the of the I C slave
address is set by pin 9 (AD0).
The logic levels for communications between the MPU-3300 and its master is set by the voltage on VDD.

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Revision: 1.0
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2

7.8 Auxiliary I C Serial Interface
2
The MPU-3300 has an auxiliary I C bus for communicating to an off-chip accelerometer, magnetometer orother sensors. This bus has two operating modes:••

2

I C Master Mode: The MPU-3300 acts as a master to any external sensors connected to the2
auxiliary I C bus
2
Pass-Through Mode: The MPU-3300 directly connects the primary and auxiliary I C buses together,allowing the system processor to directly communicate with any external sensors.
2

Auxiliary I C Bus Modes of Operation:•

2

I C Master Mode: Allows the MPU-3300 to directly access the data registers of external digitalsensors, such as a magnetometer. In this mode, the MPU-3300 directly obtains data from auxiliary
sensors, without intervention from the system applications processor.
2

For example, in I C Master mode, the MPU-3300 can be configured to perform burst reads, returning
the following data from an accelerometer:•

X accelerometer data (2 bytes)
Y accelerometer data (2 bytes)
Z accelerometer data (2 bytes)

Pass-Through Mode: Allows an external system processor to act as master and directly
2
communicate to the external sensors connected to the auxiliary I C bus pins (AUX_DA and2rd
AUX_CL). In this mode, the auxiliary I C bus control logic (3 party sensor interface block) of the2
MPU-3300 is disabled, and the auxiliary I C pins AUX_DA and AUX_CL (Pins 6 and 7) are2
connected to the main I C bus (Pins 23 and 24) through analog switches.
Pass-Through Mode is useful for configuring the external sensors, or for keeping the MPU-3300 in a
low-power mode when only the external sensors are used.
2

In Pass-Through Mode the system processor can still access MPU-3300 data through the I C
interface.
2

Auxiliary I C Bus IO Logic Levels
2

The logic level of the auxiliary I C bus is VDD

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7.9 Self-Test
Self-test allows for the testing of the mechanical and electrical portions of the sensors. The self-test for eachmeasurement axis can be activated by the bits of the gyroscope control register (register 27,
GYRO_CONFIG). Please refer to the register map document for more details on self-test.
When self-test is activated, the electronics cause the sensors to be actuated and produce an output signal.
The output signal is used to observe the self-test response.
The self-test response is defined as follows:
Self-test response = Sensor output with self-test enabled – Sensor output without self-test enabled
The self-test response for each gyroscope axis is defined in the gyroscope specification table (Section 6.1).
When the value of the self-test response is within the min/max limits of the product specification, the part has
passed self-test. When the self-test response exceeds the min/max values, the part is deemed to havefailed self-test.
7.10 Bias Instability
Bias Instability is a critical performance parameter for gyroscopes. The MPU-3300 provides typical bias
instability of 15°/hour on each axis, measured using the Allan Variance method. The figures below show
example Allan Variance plots for representative MPU-3300 devices.

X-Axis Gyroscope – Example Allan Variance Plot

Y-Axis Gyroscope – Example Allan Variance Plot

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Z-Axis Gyroscope – Example Allan Variance Plot
7.11 MPU-3300 Using SPI Interface
In the figure below, the system processor is an SPI master to the MPU-3300. Pins 8, 9, 23, and 24 are used
to support the /CS, SDO, SCLK, and SDI signals for SPI communications. Because these SPI pins are
22
shared with the I C slave pins (9, 23 and 24), the system processor cannot access the auxiliary I C bus
2
2
through the interface bypass multiplexer, which connects the processor I C interface pins to the sensor I C
interface pins.
2

Since the MPU-3300 has limited capabilities as an I C Master, and depends on the system processor to
manage the initial configuration of any auxiliary sensors, another method must be used for programming the2
sensors on the auxiliary sensor I C bus pins 6 and 7 (AUX_DA and AUX_CL).
When using SPI communications between the MPU-3300 and the system processor, configuration of22
devices on the auxiliary I C sensor bus can be achieved by using I C Slaves 0-4 to perform read and write22transactions on any device and register on the auxiliary I C bus. The I C Slave 4 interface can be used toperform only single byte read and write transactions.
Once the external sensors have been configured, the MPU-3300 can perform single or multi-byte reads
2
using the sensor I C bus. The read results from the Slave 0-3 controllers can be written to the FIFO buffer aswell as to the external sensor registers.
2

For further information regarding the control of the MPU-3300’s auxiliary I C interface, please refer to the
MPU-3300 Register Map and Register Descriptions document.

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MPU-3300 Product Specification

Processor SPI Bus : for reading alldata from MPU and for configuring
MPU and external sensors
Interrupt
StatusRegister

12

MPU-3300

/CS

8

/CS

9

AD0/SDO

SDI

23

SCL/SCLKSCLK

24

SDA/SDISDO

2Slave I C
or SPI
SerialInterface

INT

SystemProcessor

FIFO
2

Sensor I C Bus: forconfiguring andreading data fromexternal sensors

ConfigRegister

Optional
SensorMaster I 2C
SerialInterface

SensorRegisterInterface
BypassMux

7

AUX_CLSCL

6

AUX_DA

SDA

Compass

Factory
Calibration

2

I C Master performs
read and write
transactions on
2
Sensor I C bus.

Bias & LDO
13

18

10

VDD

GND

REGOUT7.12 Internal Clock Generation
The MPU-3300 has a flexible clocking scheme, allowing a variety of internal or external clock sources to be
used for the internal synchronous circuitry. This synchronous circuitry includes the signal conditioning and
ADCs, and various control circuits and registers. An on-chip PLL provides flexibility in the allowable inputs
for generating this clock.
Allowable internal sources for generating the internal clock are:••An internal relaxation oscillator
Any of the X, Y, or Z gyros (MEMS oscillators with a variation of ±1% over temperature)

Allowable external clocking sources are:••32.768kHz square wave
19.2MHz square wave

Selection of the source for generating the internal synchronous clock depends on the availability of externalsources and the requirements for power consumption and clock accuracy. These requirements will most
likely vary by mode of operation.
Clock accuracy is important, since timing errors directly affect the distance and angle calculations performedby the Digital Motion Processor (and by extension, by any processor).

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There are also start-up conditions to consider. When the MPU-3300 first starts up, the device uses its
internal clock until programmed to operate from another source. This allows the user, for example, to wait
for the MEMS oscillators to stabilize before they are selected as the clock source.

7.13 Sensor Data Registers
The sensor data registers contain the latest gyro, auxiliary sensor, and temperature measurement data.
They are read-only registers, and are accessed via the serial interface. Data from these registers may beread anytime. However, the interrupt function may be used to determine when new data is available.
For a table of interrupt sources please refer to Section 8.

7.14 FIFOThe MPU-3300 contains a 1024-byte FIFO register that is accessible via the Serial Interface. The FIFO
configuration register determines which data is written into the FIFO. Possible choices include gyro data,
temperature readings, auxiliary sensor readings, and FSYNC input. A FIFO counter keeps track of how
many bytes of valid data are contained in the FIFO. The FIFO register supports burst reads. The interrupt
function may be used to determine when new data is available.
For further information regarding the FIFO, please refer to the MPU-3300 Register Map and Register
Descriptions document.

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7.15 Interrupts
Interrupt functionality is configured via the Interrupt Configuration register. Items that are configurable include
the INT pin configuration, the interrupt latching and clearing method, and triggers for the interrupt. Items that
can trigger an interrupt are (1) Clock generator locked to new reference oscillator (used when switching clock
sources); (2) new data is available to be read (from the FIFO and Data registers); and (3) the MPU-3300 did
2
not receive an acknowledge from an auxiliary sensor on the secondary I C bus. The interrupt status can beread from the Interrupt Status register.
For further information regarding interrupts, please refer to the MPU-3300 Register Map and Register
Descriptions document.

7.16 Digital-Output Temperature Sensor
An on-chip temperature sensor and ADC are used to measure the MPU-3300 die temperature. The readings
from the ADC can be read from the FIFO or the Sensor Data registers.

7.17 Bias and LDO
The bias and LDO section generates the internal supply and the reference voltages and currents required by
the MPU-3300. Its input is an unregulated VDD of 2.375 to 3.46V. The LDO output is bypassed by acapacitor at REGOUT. For further details on the capacitor, please refer to the Bill of Materials for External
Components (Section 7.3).

7.18 Charge Pump
An on-board charge pump generates the high voltage required for the MEMS oscillators. Its output is
bypassed by a capacitor at CPOUT. For further details on the capacitor, please refer to the Bill of Materials
for External Components (Section 7.3).

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MPU-3300 Product Specification

8

Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

Programmable Interrupts

The MPU-3300 has a programmable interrupt system which can generate an interrupt signal on the INT pin.
Status flags indicate the source of an interrupt. Interrupt sources may be enabled and disabled individually.

Table of Interrupt Sources
Interrupt Name

ModuleFIFO Overflow

FIFO

Data ReadySensor Registers

I2C Master errors: Lost Arbitration, NACKs

I2C MasterI2C Slave 4

I2C Master

For information regarding the interrupt enable/disable registers and flag registers, please refer to the MPU3300 Register Map and Register Descriptions document.

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MPU-3300 Product Specification

9

Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

Digital Interface2

9.1 I C and SPI Serial Interfaces
2
The internal registers and memory of the MPU-3300 can be accessed using either I C at 400 kHz or SPI at
1MHz. SPI operates in four-wire mode.

Serial Interface
Pin Number

Pin Name

8/CS

Pin Description

9

AD0 / SDO

I2C Slave Address LSB (AD0); SPI serial data output (SDO)

23

SCL / SCLKI2C serial clock (SCL); SPI serial clock (SCLK)24

SDA / SDII2C serial data (SDA); SPI serial data input (SDI)

SPI chip select (0=SPI enable)

Note:
2

2

To prevent switching into I C mode when using SPI, the I C interface should be disabled by setting the
I2C_IF_DIS configuration bit. Setting this bit should be performed immediately after waiting for the time
specified by the “Start-Up Time for Register Read/Write” in Section 6.2.
For further information regarding the I2C_IF_DIS bit, please refer to the MPU-3300 Register Map andRegister Descriptions document.
2

9.2 I C Interface
2
I C is a two-wire interface comprised of the signals serial data (SDA) and serial clock (SCL). In general, the2lines are open-drain and bi-directional. In a generalized I C interface implementation, attached devices canbe a master or a slave. The master device puts the slave address on the bus, and the slave device with thematching address acknowledges the master.
The MPU-3300 always operates as a slave device when communicating to the system processor, which thus
acts as the master. SDA and SCL lines typically need pull-up resistors to VDD. The maximum bus speed is
400 kHz.
The slave address of the MPU-3300 is b110100X which is 7 bits long. The LSB bit of the 7 bit address is2
determined by the logic level on pin AD0. This allows two MPU-3300s to be connected to the same I C bus.
When used in this configuration, the address of the one of the devices should be b1101000 (pin AD0 is logiclow) and the address of the other should be b1101001 (pin AD0 is logic high).
2

9.3 I C Communications Protocol
START (S) and STOP (P) Conditions
2

Communication on the I C bus starts when the master puts the START condition (S) on the bus, which isdefined as a HIGH-to-LOW transition of the SDA line while SCL line is HIGH (see figure below). The bus isconsidered to be busy until the master puts a STOP condition (P) on the bus, which is defined as a LOW to
HIGH transition on the SDA line while SCL is HIGH (see figure below).
Additionally, the bus remains busy if a repeated START (Sr) is generated instead of a STOP condition.

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SDA

SCL
S

P

START condition

STOP condition

START and STOP Conditions

Data Format / Acknowledge
2

I C data bytes are defined to be 8-bits long. There is no restriction to the number of bytes transmitted per
data transfer. Each byte transferred must be followed by an acknowledge (ACK) signal. The clock for the
acknowledge signal is generated by the master, while the receiver generates the actual acknowledge signal
by pulling down SDA and holding it low during the HIGH portion of the acknowledge clock pulse.
If a slave is busy and cannot transmit or receive another byte of data until some other task has been
performed, it can hold SCL LOW, thus forcing the master into a wait state. Normal data transfer resumes
when the slave is ready, and releases the clock line (refer to the following figure).

DATA OUTPUT BY
TRANSMITTER (SDA)
not acknowledge
DATA OUTPUT BYRECEIVER (SDA)
acknowledge
SCL FROM
MASTER

1

2

8

9
clock pulse for
acknowledgement

START
condition
2

Acknowledge on the I C Bus

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Document Number: PS-MPU-3300A-00
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MPU-3300 Product Specification

Communications
After beginning communications with the START condition (S), the master sends a 7-bit slave addressthfollowed by an 8 bit, the read/write bit. The read/write bit indicates whether the master is receiving data fromor is writing to the slave device. Then, the master releases the SDA line and waits for the acknowledge
signal (ACK) from the slave device. Each byte transferred must be followed by an acknowledge bit. To
acknowledge, the slave device pulls the SDA line LOW and keeps it LOW for the high period of the SCL line.
Data transmission is always terminated by the master with a STOP condition (P), thus freeing thecommunications line. However, the master can generate a repeated START condition (Sr), and address
another slave without first generating a STOP condition (P). A LOW to HIGH transition on the SDA line while
SCL is HIGH defines the stop condition. All SDA changes should take place when SCL is low, with the
exception of start and stop conditions.

SDA

SCL

1 –7

8

9

1–7

8

9

1–7

8

9

S

P

START ADDRESS
condition

R/W

ACK

DATA

ACK

DATA

ACK

STOP
condition

2

Complete I C Data Transfer
2

To write the internal MPU-3300 registers, the master transmits the start condition (S), followed by the I C
thaddress and the write bit (0). At the 9 clock cycle (when the clock is high), the MPU-3300 acknowledges thetransfer. Then the master puts the register address (RA) on the bus. After the MPU-3300 acknowledges thereception of the register address, the master puts the register data onto the bus. This is followed by the ACK
signal, and data transfer may be concluded by the stop condition (P). To write multiple bytes after the last
ACK signal, the master can continue outputting data rather than transmitting a stop signal. In this case, theMPU-3300 automatically increments the register address and loads the data to the appropriate register. The
following figures show single and two-byte write sequences.

Single-Byte Write Sequence
Master

S

AD+W

Slave

RA
ACK

DATA
ACK

P
ACK

Burst Write Sequence
Master
Slave

S

AD+W

RA
ACK

DATA
ACK

DATA
ACK

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ACK

MPU-3300 Product Specification

Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

2

To read the internal MPU-3300 registers, the master sends a start condition, followed by the I C address anda write bit, and then the register address that is going to be read. Upon receiving the ACK signal from the
MPU-3300, the master transmits a start signal followed by the slave address and read bit. As a result, theMPU-3300 sends an ACK signal and the data. The communication ends with a not acknowledge (NACK)
signal and a stop bit from master. The NACK condition is defined such that the SDA line remains high at theth
9 clock cycle. The following figures show single and two-byte read sequences.

Single-Byte Read Sequence
Master

S

AD+W

Slave

RA
ACK

S

AD+R

ACK

NACK
ACK

P

DATA

Burst Read Sequence
Master
Slave

S

AD+W

RA
ACK

S
ACK

AD+R

ACK
ACK

2

DATA

9.4 I C Terms
Signal Description
S
Start Condition: SDA goes from high to low while SCL is high2
AD
Slave I C addressW
Write bit (0)R
Read bit (1)ACK
Acknowledge: SDA line is low while the SCL line is high at theth
9 clock cycleth
NACK Not-Acknowledge: SDA line stays high at the 9 clock cycle
RA
MPU-3300 internal register address
DATA
Transmit or received dataP
Stop condition: SDA going from low to high while SCL is high

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NACK
DATA

P

Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

MPU-3300 Product Specification

9.5 SPI Interface
SPI is a 4-wire synchronous serial interface that uses two control lines and two data lines. The MPU-3300
always operates as a Slave device during standard Master-Slave SPI operation.
With respect to the Master, the Serial Clock output (SCLK), the Serial Data Output (SDO) and the Serial
Data Input (SDI) are shared among the Slave devices. Each SPI slave device requires its own Chip Select(/CS) line from the master.
/CS goes low (active) at the start of transmission and goes back high (inactive) at the end. Only one /CS line
is active at a time, ensuring that only one slave is selected at any given time. The /CS lines of the nonselected slave devices are held high, causing their SDO lines to remain in a high-impedance (high-z) state
so that they do not interfere with any active devices.
SPI Operational Features
1.
2.
3.
4.
5.

Data is delivered MSB first and LSB last
Data is latched on the rising edge of SCLK
Data should be transitioned on the falling edge of SCLK
The maximum frequency of SCLK is 1MHz
SPI read and write operations are completed in 16 or more clock cycles (two or more bytes). The
first byte contains the SPI Address, and the following byte(s) contain(s) the SPI data. The first
bit of the first byte contains the Read/Write bit and indicates the Read (1) or Write (0) operation.
The following 7 bits contain the Register Address. In cases of multiple-byte Read/Writes, data is
two or more bytes:
SPI Address format
MSB
R/W A6 A5 A4

A3

A2

A1

LSB
A0

SPI Data format
MSB
D7
D6 D5

D3

D2

D1

LSB
D0

D4

6. Supports Single or Burst Read/Writes.

SCLK

SPI Master
/CS1
/CS2

SDI
SDO
/CS

SPI Slave 1

SCLK
SDI
SDO
/CS

SPI Slave 2

Typical SPI Master / Slave Configuration

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Document Number: PS-MPU-3300A-00
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MPU-3300 Product Specification

10 AssemblyThis section provides general guidelines for assembling InvenSense Micro Electro-Mechanical Systems(MEMS) gyros packaged in Quad Flat No leads package (QFN) surface mount integrated circuits.

10.1 Orientation of Axes
The diagram below shows the orientation of the axes of sensitivity and the polarity of rotation. Note the pin 1
identifier (•) in the figure.

+Y

+Z
MP
U-3
30
0

+Y

+X

+X

Orientation of Axes of Sensitivity andPolarity of Rotation

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Document Number: PS-MPU-3300A-00
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MPU-3300 Product Specification

10.2 Package Dimensions
24 Lead QFN (4x4x0.9) mm NiPdAu Lead-frame finish
24
1

L

c

19
18
PIN 1 IDENTIFIER IS A LASERMARKED FEATURE ON TOP

CO.3
f
E

E2
e
b

13

6
7

D

L1
A1

12

D2

A

s

On 4 corners lead dimensionss

SYMBOLS
A
A1
b
c
D
D2
E
E2
e
f (e-b)K
L
L1
s

DIMENSIONS IN MILLIMETERS
MIN
NOM
MAX
0.85
0.90
0.95
0.00
0.02
0.05
0.18
0.25
0.30
--0.20 REF--3.90
4.00
4.10
2.65
2.70
2.75
3.90
4.00
4.10
2.55
2.60
2.65
--0.50----0.25--0.25
0.30
0.35
0.30
0.35
0.40
0.35
0.40
0.45
0.05
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Document Number: PS-MPU-3300A-00
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MPU-3300 Product Specification

10.3 PCB Design Guidelines
The Pad Diagram using a JEDEC type extension with solder rising on the outer edge is shown below. The
Pad Dimensions Table shows pad sizing (mean dimensions) recommended for the MPU-3300 product.

JEDEC type extension with solder rising on outer edge
D3
D
D2

PIN 1
IDENTIFIER
24

19

1

e

b

18

E2 E E3

c

6

13
7

L3 L1

12

L2
Tout
L

Tout

Tin

PCB Layout Diagram
SYMBOLS
e
b
L
L1
D
E
D2
E2
D3
E3
c
Tout
Tin
L2
L3

DIMENSIONS IN MILLIMETERS
Nominal Package I/O Pad Dimensions

NOM

Pad Pitch
Pad Width
Pad Length
Pad Length
Package Width
Package Length
Exposed Pad Width
Exposed Pad Length
I/O Land Design Dimensions (Guidelines )I/O Pad Extent Width
I/O Pad Extent Length
Land Width
Outward Extension
Inward Extension
Land Length
Land Length

0.50
0.25
0.35
0.40
4.00
4.00
2.70
2.60
4.80
4.80
0.35
0.40
0.05
0.80
0.85

PCB Dimensions Table (for PCB Lay-out Diagram)

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10.4 Assembly Precautions
10.4.1 Gyroscope Surface Mount Guidelines
InvenSense MEMS Gyros sense rate of rotation. In addition, gyroscopes sense mechanical stress comingfrom the printed circuit board (PCB). This PCB stress can be minimized by adhering to certain design rules:
When using MEMS gyroscope components in plastic packages, PCB mounting and assembly can cause
package stress. This package stress in turn can affect the output offset and its value over a wide range oftemperatures. This stress is caused by the mismatch between the Coefficient of Linear Thermal Expansion(CTE) of the package material and the PCB. Care must be taken to avoid package stress due to mounting.
Traces connected to pads should be as symmetric as possible. Maximizing symmetry and balance for pad
connection will help component self alignment and will lead to better control of solder paste reduction after
reflow.
Any material used in the surface mount assembly process of the MEMS gyroscope should be free ofrestricted RoHS elements or compounds. Pb-free solders should be used for assembly.

10.4.2 Exposed Die Pad Precautions
The MPU-3300 has very low active and standby current consumption. The exposed die pad is not requiredfor heat sinking, and should not be soldered to the PCB. Under-fill should also not be used. Failure to adhere
to this rule can induce performance changes due to package thermo-mechanical stress. There is noelectrical connection between the pad and the CMOS.

10.4.3 Trace Routing
Routing traces or vias under the gyro package such that they run under the exposed die pad is prohibited.
Routed active signals may harmonically couple with the gyro MEMS devices, compromising gyro response.
These devices are designed with the drive frequencies as follows: X=33±3Khz, Y=30±3Khz, and Z=27±3Khz.
To avoid harmonic coupling don’t route active signals in non-shielded signal planes directly below, or above
the gyro package. Note: For best performance, design a ground plane under the e-pad to reduce PCB signal
noise from the board on which the gyro device is mounted. If the gyro device is stacked under an adjacent
PCB board, design a ground plane directly above the gyro device to shield active signals from the adjacent
PCB board.

10.4.4 Component Placement
Do not place large insertion components such as keyboard or similar buttons, connectors, or shielding boxes
at a distance of less than 6 mm from the MEMS gyro. Maintain generally accepted industry design practices
for component placement near the MPU-3300 to prevent noise coupling and thermo-mechanical stress.

10.4.5 PCB Mounting and Cross-Axis Sensitivity
Orientation errors of the gyroscope and accelerometer mounted to the printed circuit board can cause crossaxis sensitivity in which one gyro or accel responds to rotation or acceleration about another axis,
respectively. For example, the X-axis gyroscope may respond to rotation about the Y or Z axes. The
orientation mounting errors are illustrated in the figure below.

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Revision: 1.0
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Z

Φ
Y
MP
U330
0

Θ

Package Gyro Axes () Relative to PCB Axes (X) with Orientation Errors (Θ and Φ)

The table below shows the cross-axis sensitivity as a percentage of the gyroscope sensitivity for a given
orientation error, respectively.
Cross-Axis Sensitivity vs. Orientation Error
Orientation Error
Cross-Axis Sensitivity(θ or Φ)(sinθ or sinΦ)
0º
0%
0.5º
0.87%
1º
1.75%
The specifications for cross-axis sensitivity in Section 6.1 include the effect of the die orientation error withrespect to the package.

10.4.6 MEMS Handling Instructions
MEMS (Micro Electro-Mechanical Systems) are a time-proven, robust technology used in hundreds ofmillions of consumer, automotive and industrial products. MEMS devices consist of microscopic moving
mechanical structures. They differ from conventional IC products, even though they can be found in similar
packages. Therefore, MEMS devices require different handling precautions than conventional ICs prior tomounting onto printed circuit boards (PCBs).
MPU-3300 has been qualified to a shock tolerance of 10,000g. InvenSense packages its gyroscopes as
it deems proper for protection against normal handling and shipping. It recommends the following handlingprecautions to prevent potential damage.

The•

Do not drop individually packaged gyroscopes, or trays of gyroscopes onto hard surfaces. Components
placed in trays could be subject to g-forces in excess of 10,000g if dropped.

•

Printed circuit boards that incorporate mounted gyroscopes should not be separated by manuallysnapping apart. This could also create g-forces in excess of 10,000g.

•

Do not clean MEMS gyroscopes in ultrasonic baths. Ultrasonic baths can induce MEMS damage if thebath energy causes excessive drive motion through resonant frequency coupling.

10.4.7 ESD Considerations
Establish and use ESD-safe handling precautions when unpacking and handling ESD-sensitive devices.

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Document Number: PS-MPU-3300A-00
Revision: 1.0
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Store ESD sensitive devices in ESD safe containers until ready for use. The Tape-and-Reel moisturesealed bag is an ESD approved barrier. The best practice is to keep the units in the original moisturesealed bags until ready for assembly.

Restrict all device handling to ESD protected work areas that measure less than 200V static charge. Ensurethat all workstations and personnel are properly grounded to prevent ESD.
10.4.8 Reflow Specification
Qualification Reflow: The MPU-3300 was qualified in accordance with IPC/JEDEC J-STD-020D.01. This
standard classifies proper packaging, storage and handling in order to avoid subsequent thermal andmechanical damage during the solder reflow attachment phase of assembly. The classification specifies asequence consisting of a bake cycle, a moisture soak cycle in a temperature humidity oven, followed bythree solder reflow cycles and functional testing for qualification. All temperatures refer to the topside of the
QFN package, as measured on the package body surface. The peak solder reflow classification temperature
requirement is (260 +5/-0°C) for lead-free soldering of components measuring less than 1.6 mm in thickness.
Production Reflow: Check the recommendations of your solder manufacturer. For optimum results,
production solder reflow processes should reduce exposure to high temperatures, and use lower ramp-up
and ramp-down rates than those used in the component qualification profile shown for reference below.
Production reflow should never exceed the maximum constraints listed in the table and shown in the figure
below that were used for the qualification profile, as these represent the maximum tolerable ratings for thedevice.

Approved IR/Convection Solder Reflow Curve

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Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

MPU-3300 Product Specification

Temperature Set Points for IR / Convection Reflow Corresponding to Figure Above
CONSTRAINTS

Step

Setting

A
B
C
D
E
F
G

Troom
TSmin
TSmax
TLiquidus
TPmin [255°C, 260°C]
TPmax [ 260°C, 265°C]
TPmin [255°C, 260°C]

Temp (°C)
25
150
200
217
255
260
255

H
I

TLiquidus
Troom

217
25

Time (sec)Rate (°C/sec)

60 < tBC < 120

tAF < 480
10< tEG < 30r(TLiquidus-TPmax) < 3r(TLiquidus-TPmax) < 3r(TLiquidus-TPmax) < 3r(TPmax-TLiquidus) < 4

60 < tDH < 120

Notes:••For users TPmax must not exceed the Classification temperature (260°C).
For suppliers TPmax must equal or exceed the classification temperature.

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MPU-3300 Product Specification

Document Number: PS-MPU-3300A-00
Revision: 1.0
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10.5 Storage Specifications
The storage specification of the MPU-3300 conforms to IPC/JEDEC J-STD-020D.01 Moisture Sensitivity
Level (MSL) 3.
Calculated shelf-life in moisture-sealed bag

12 months -- Storage conditions: <40°C and <90% RH

After opening moisture-sealed bag

168 hours -- Storage conditions: ambient ≤30°C at 60%RH

10.6 Package Marking Specification

TOP VIEWINVENSENSE
Part number
Lot traceability code

MPU3300

X X X X X X-X X
XX YYWW X

Foundry code

Rev Code
Y Y = Year CodeW W = Work Week

Package Vendor CodePackage Marking Specification

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MPU-3300 Product Specification

10.7 Tape & Reel Specification

Tape Dimensions

Reel Outline Drawing

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Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

MPU-3300 Product Specification

Reel Dimensions and Package Size
PACKAGEREEL (mm)

SIZE

L

V

W

Z

4x4

330

100

13.2

2.2

Package Orientation

User Directionof FeedPin 1
INVENSENSE

Cover Tape
(Anti-Static)

INVENSENSE

Carrier Tape
(Anti-Static)
Reel
Pb

-f r

ca te
RE

Inve
DE

VIC

nS
E (1P

LO

T1

en se

):

(1 T

L OT

): Q

2 (1T

Re

-60

2R7

el D

:H

D/C
84 -F

ate

go

ry
QT

(D ):

D/C

: 18

111

1

V21

5 -G

/05

( e4

(D)

QT

8

: 110

7

HF

)

Y (Q

Y (Q

): 500): 300

UB

50

): Q3

ee

EL

QT
PO

M PU

Y (Q

QC

Terminal Tape00): 200

0

ST AM

P:

1

/1 1

Label
Tape and Reel Specification

Reel Specifications
Quantity Per Reel

5,000

Reels per Box

1

Boxes Per Carton (max)5

Pcs/Carton (max)

25,00010.8 Label

Barcode Label

Location of Label on Reel

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MPU-3300 Product Specification

Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

10.9 Packaging

REEL – with Barcode &Vacuum-Sealed Moisture

Caution labels

Barrier Bag with ESD, MSL3,

MSL3 Label

Caution, and Barcode Labels

Caution Label

Pizza Box

ESD Label

Inner Bubble Wrap

Pizza Boxes Placed in FoamLined Shipper Box

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Outer Shipper LabelMPU-3300 Product Specification

10.10 Representative Shipping Carton Label

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Document Number: PS-MPU-3300A-00
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MPU-3300 Product Specification

Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

11 Reliability
11.1 Qualification Test Policy
InvenSense’s products complete a Qualification Test Plan before being released to production. The
Qualification Test Plan for the MPU-3300 followed the JESD 47H.01 Standards, “Stress-Test-Driven
Qualification of Integrated Circuits,” with the individual tests described below.
11.2 Qualification Test Plan
Accelerated Life Tests
TEST

Method/Condition

Lot
Quantity

Sample /Lot

Acc /RejectCriteria(HTOL/LFR)High Temperature Operating LifeJEDEC JESD22-A108D, Dynamic, 3.63V
Tj>125°C [read-points 168, 500, 1000 hours]

biased,

3

77

(0/1)

(HAST)
Highly Accelerated Stress Test (1)JEDEC JESD22-A118
Condition A, 130°C, 85%RH, 33.3 psia., unbiased, [readpoint 96 hours]

3

77

(0/1)

(HTS)
High Temperature Storage LifeJEDEC JESD22-A103D, Cond. A, 125°C Non-Bias Bake
[read-points 168, 500, 1000 hours]

3

77

(0/1)

Lot
Quantity

Sample /Lot

Acc /RejectCriteria

Device Component Level Tests
TEST

Method/Condition(ESD-HBM)
ESD-Human Body ModelJEDEC JS-001-2010, (1.5KV)

1

3

(0/1)

(ESD-MM)ESD-Machine ModelJEDEC JESD22-A115C, (200V)

1

3

(0/1)

(LU)
Latch UpJEDEC JESD-78D Class II (2), 125°C; ±60mA

1

6

(0/1)

(MS)
Mechanical ShockJEDEC JESD22-B104C, Mil-Std-883,
Method 2002.5, Cond. E, 10,000g’s, 0.2ms,±X, Y, Z – 6 directions, 5 times/direction

3

5

(0/1)

(VIB)
Vibration

JEDEC JESD22-B103B, Variable Frequency (random),Cond. B, 5-500Hz,
X, Y, Z – 4 times/direction

3

5

(0/1)

(TC)
Temperature Cycling (1)

JEDEC JESD22-A104D
Condition N [-40°C to +85°C],
Soak Mode 2 [5’], 100 cycles

3

77

(0/1)

Lot
Quantity

Sample /Lot

Acc /RejectCriteria

1

5

(0/1)

1

40

(0/1)

Board Level Tests
TEST

Method/Condition(BMS)
Board Mechanical ShockJEDEC JESD22-B104C,Mil-Std-883,
Method 2002.5, Cond. E, 10000g’s, 0.2ms,+-X, Y, Z – 6 directions, 5 times/direction(BTC)
JEDEC JESD22-A104D
Board
Condition N [ -40°C to +85°C],
Temperature Cycling (1)Soak mode 2 [5’], 100 cycles(1) Tests are preceded by MSL3 Preconditioning in accordance with JEDEC JESD22-A113F

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Document Number: PS-MPU-3300A-00
Revision: 1.0
Release Date: 5/31/2012

12 Environmental Compliance
The MPU-3300 is RoHS and Green compliant.
The MPU-3300 is in full environmental compliance as evidenced in report HS-ITG-6000, Materials
Declaration Data Sheet.
Environmental Declaration Disclaimer:
InvenSense believes this environmental information to be correct but cannot guarantee accuracy or completeness. Conformity
documents for the above component constitutes are on file. InvenSense subcontracts manufacturing and the information contained
herein is based on data received from vendors and suppliers, which has not been validated by InvenSense.

This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense
for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject tochange without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order toimprove its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding
the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arisingfrom information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited
to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.

Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for
any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
InvenSense® is a registered trademark of InvenSense, Inc. MPUTM, MPU-3300TM, Digital Motion Processor™, DMP ™, Motion Processing
Unit™, MotionFusion™, and MotionApps™ are trademarks of InvenSense, Inc.

©2011 InvenSense, Inc. All rights reserved.

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