PESD30VF1BLS-Q

Ultra-low capacitance bidirectional ESD protection diode2 March 2023

Product data sheet

1. General description
Ultra-low capacitance bidirectional ElectroStatic Discharge (ESD) protection diode in a
DFN1006BD-2 (SOD882BD) leadless ultra small Surface-Mounted Device (SMD) plastic package,designed to protect one signal line from the damage caused by ESD and other transients.

2. Features and benefits•••••

Ultra low diode capacitance Cd = 0.28 pF
High reverse standoff voltage VRWM = 30 V
Very small voltage dependency of the capacitanceESD protection up to ±10 kV according to IEC 61000-4-2, level 4
Qualified according to AEC-Q101 and recommended for use in automotive applications

3. Applications••

NFC antenna protection
Protection of high-speed data lines

4. Quick reference data
Table 1. Quick reference data
SymbolParameter

Conditions

MinTypMax

Unit

VRWM

reverse standoff
voltage

Tamb = 25 °C

--30

VCd

diode capacitancef = 1 MHz; VR = 0 V; Tamb = 25 °C

-0.28

0.4pF

PESD30VF1BLS-Q

Nexperia

Ultra-low capacitance bidirectional ESD protection diode5. Pinning information
Table 2. Pinning information
PinSymbol
Description
1

K1

cathode (diode 1)

2

K2

cathode (diode 2)

Simplified outline
1

Graphic symbol

2

K1
Transparent
top view

K2
sym045

DFN1006BD-2 (SOD882BD)

6. Ordering information
Table 3. Ordering information
Type numberPackageName
PESD30VF1BLS-Q

Description

Version

DFN1006BD-2 Leadless ultra small plastic package with side-wettableflanks (SWF); 2 terminals; 0.65 mm pitch; 1 mm x 0.6 mm
x 0.47 mm body

SOD882BD

7. Marking
Table 4. Marking codes
Type number

Marking code

PESD30VF1BLS-Q

ZSZPESD30VF1BLS-Q

Product data sheet

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Nexperia

Ultra-low capacitance bidirectional ESD protection diode8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
SymbolParameter

TjConditions

MinMaxUnitjunction temperature-150°C

Tambambient temperature

-55

150°C

Tstg

storage temperature

-65

150°C

ESD maximum ratings
VESD[1][2]electrostatic discharge
voltage

IEC 61000-4-2; contact discharge[1] [2]-10kV

IEC 61000-4-2; air discharge[1] [2]-15kV

Measured from pin 1 to pin 2.
Device stressed with ten non-repetitive ESD pulses.
IPP
100 %
90 %

10 %t

tr = 0.6 ns to 1 ns
30 ns
60 nsFig. 1.

001aaa631

ESD pulse waveform according to IEC 61000-4-2

PESD30VF1BLS-Q

Product data sheet

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Nexperia

Ultra-low capacitance bidirectional ESD protection diode9. Characteristics
Table 6. Characteristics
SymbolParameterConditions

MinTypMax

Unit

VRWM

reverse standoff
voltage

Tamb = 25 °C

--30V

VBR

breakdown voltage

IR = 10 mA; Tamb = 25 °C

3135-

VIRM

reverse leakage current VR = 30 V; Tamb = 25 °C-130nA

Cddiode capacitancef = 1 MHz; VR = 0 V; Tamb = 25 °C

-0.28

0.4pF

VCL

clamping voltage

ITLP = 8 A; tp = 100 ns; Tamb = 25 °C[1] [2]-18.5-V

ITLP = 16 A; tp = 100 ns; Tamb = 25 °C[1] [2]-21-V

IR = 7.5 A; tp = 100 ns; Tamb = 25 °C[1] [2]-0.8-ΩRdyn[1][2]

dynamic resistance

Measured from pin 1 to pin 2.
Non-repetitive current pulse, Transmission Line Pulse (TLP); square pulse; ANSI / ESD STM5.5.1-2008.
I

aaa-035742

0.4

reverseCd(pF)

I

0.3

VV

0.2

0.1
-40

Vh020VR (V)40
aaa-030568

Capacitance as a function of reverse voltage;
typical values

PESD30VF1BLS-Q

Product data sheet

Vt1forward-20

f = 1 MHz; Tamb = 25 °CFig. 2.

Rdyn = V/ I

Fig. 3.

V-I characteristics for a bidirectional ESDprotection diodeAll information provided in this document is subject to legal disclaimers.

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Nexperia

Ultra-low capacitance bidirectional ESD protection diodeaaa-035769

25IPP(A)2015105002040VCL (V)60Transmission Line Pulse (TLP)
tp = 100 ns; tr = 1 nsFig. 4.

Dynamic resistance with positive clamping; typical values

PESD30VF1BLS-Q

Product data sheet

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Nexperia

Ultra-low capacitance bidirectional ESD protection diode10. Application information
The device is designed for the protection of one bidirectional data line from surge pulses and ESD
damage. The device is suitable on lines where the signal polarities are both positive and negativewith respect to ground.
The device uses an advanced clamping structure showing a negative dynamic resistance.
This snap-back behavior strongly reduces the clamping voltage to the system behind the ESD
protection during an ESD event. Do not connect unlimited DC current sources to the data lines toavoid keeping the ESD protection device in snap-back state after exceeding breakdown voltage(due to an ESD pulse for instance).
line to be protected

ESD protection diodeGND
aaa-002737

Fig. 5.

Application diagram
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surgetransients. The following guidelines are recommended:
1.
2.
3.
4.
5.
6.
7.
8.

Place the device as close to the input terminal or connector as possible.
Minimize the path length between the device and the protected line.
Keep parallel signal paths to a minimum.
Avoid running protected conductors in parallel with unprotected conductors.
Minimize all Printed-Circuit Board (PCB) conductive loops including power and ground loops.
Minimize the length of the transient return path to ground.
Avoid using shared transient return paths to a common ground point.
Use ground planes whenever possible. For multilayer PCBs, use ground vias.

11. Test information
Quality information
This product has been qualified in accordance with the Automotive Electronics Council (AEC)
standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use inautomotive applications.

PESD30VF1BLS-Q

Product data sheet

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6 / 11PESD30VF1BLS-Q

Nexperia

Ultra-low capacitance bidirectional ESD protection diode12. Package outline
DFN1006BD-2 Leadless ultra small plastic package with side-wettable flanks (SWF); 2 terminals;
0.65 mm pitch; 1 mm x 0.6 mm x 0.47 mm body
L(2x)SOD882BDT

12 b(2x)bf(2x)

v
w

e

C A B
C

y1 CA
A1

CSEATING PLANE
y CE

A

u C

D
(3)

(3)

(2)

u C

B
00.5

DimensionsA(1)A1bf(1)

0.50
0.47
0.44

0.04

0.55
0.30 0.22
0.50 0.60 1.00 0.65 0.25 0.16
0.20 0.45
0.22 0.10Unitmmmaxnommin

1 mm

scalebDEeLT(1)uv0.05 0.10

wyy1

0.05 0.05 0.05

Note
1. Dimension including plating thickness.
2. The marking bar indicates the cathode.
3. Solderable lead end, protrusion max. 0.02 mm.
Outlineversion
SOD882BD

Fig. 6.

sod882bd_po

References
IEC

JEDEC

JEITA

Europeanprojection

Issue date
20-06-22
20-06-23

MO-343AA

Package outline DFN1006BD-2 (SOD882BD)PESD30VF1BLS-Q

Product data sheet

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Nexperia

Ultra-low capacitance bidirectional ESD protection diode13. Soldering
Footprint information for reflow soldering of DFN1006BD-2 package

SOD882BD

1.4
0.2

0.8
(2×)

0.6
(2×)

0.7
(2×)

0.3
0.4
1.0
1.3

solder resist

solder paste

solder lands
Dimensions in mmIssue dateFig. 7.

20-05-01
20-12-15

sod882bd_fr

Reflow soldering footprint for DFN1006BD-2 (SOD882BD)PESD30VF1BLS-Q

Product data sheet

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Nexperia

Ultra-low capacitance bidirectional ESD protection diode14. Revision history
Table 7. Revision history
Data sheet ID
Release date

Data sheet status

Change notice

Supersedes

PESD30VF1BLS-Q v.1 20230302

Product data sheet--

PESD30VF1BLS-Q

Product data sheet

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Nexperia

Ultra-low capacitance bidirectional ESD protection diodeequipment, nor in applications where failure or malfunction of an Nexperia
product can reasonably be expected to result in personal injury, death orsevere property or environmental damage. Nexperia and its suppliers accept
no liability for inclusion and/or use of Nexperia products in such equipment orapplications and therefore such inclusion and/or use is at the customer's own
risk.

15. Legal information
Data sheet status
Document status[1][2]

Productstatus [3]Definition

Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of thisdocument, and as such is not complete, exhaustive or legally binding.

Objective [short]data sheet

Development

This document contains data fromthe objective specification for
product development.

Preliminary [short]data sheet

Qualification

This document contains data fromthe preliminary specification.

Applications — Applications that are described herein for any of theseproducts are for illustrative purposes only. Nexperia makes no representation
or warranty that such applications will be suitable for the specified use
without further testing or modification.

Product [short]data sheet

Production

This document contains the productspecification.

[1]
[2]
[3]

Please consult the most recently issued document before initiating orcompleting a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may havechanged since this document was published and may differ in case ofmultiple devices. The latest product status information is available on
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Limiting values — Stress above one or more limiting values (as defined inthe Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above thosegiven in the Recommended operating conditions section (if present) or theCharacteristics sections of this document is not warranted. Constant orrepeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
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Suitability for use in automotive applications — This Nexperia producthas been qualified for use in automotive applications. Unless otherwise
agreed in writing, the product is not designed, authorized or warranted tobe suitable for use in life support, life-critical or safety-critical systems orPESD30VF1BLS-Q

Product data sheet

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PESD30VF1BLS-Q

Nexperia

Ultra-low capacitance bidirectional ESD protection diodeContents
1. General description...................................................... 1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Quick reference data....................................................15. Pinning information......................................................26. Ordering information....................................................27. Marking.......................................................................... 28. Limiting values............................................................. 3
9. Characteristics.............................................................. 4
10. Application information............................................. 6
11. Test information.......................................................... 612. Package outline.......................................................... 713. Soldering..................................................................... 814. Revision history..........................................................915. Legal information......................................................10© Nexperia B.V. 2023. All rights reserved

For more information, please visit: http://www.nexperia.com
For sales office addresses, please send an email to: salesaddresses@nexperia.com
Date of release: 2 March 2023

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Product data sheet

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