ICP-10111
High Accuracy, Low Power, Barometric Pressure
and Temperature Sensor IC
GENERAL INFORMATIONFEATURES••

The ICP-10111 pressure sensor family is based on MEMS
capacitive technology which provides ultra-low noise at thelowest power, enabling industry leading relative accuracy,
sensor throughput, and temperature stability. The pressure
sensor can measure pressure differences with an accuracy of±1 Pa, enabling altitude measurement differentials as small as
8.5 cm, less than the height of a single stair step.

••

Consuming only 1.3 µA @1 Hz, available in footprint of 2 mm
x 2.5 mm x 0.92 mm, the ICP-10111 is ideally suited formobile phones, wearable fitness monitoring, drones, andbattery powered IoT.

•
•
•
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The ICP-10111 offers an industry leading temperature
coefficient offset of ±0.5 Pa/C. The combination of highaccuracy, low power, temperature stability, waterproofing ina small footprint enables higher performance barometricpressure sensing for sports activity identification, mobile
indoor/outdoor navigation, and altitude-hold in drones.

Pressure operating range: 30 to 110 kPa
Noise and current consumption
o 0.4 Pa @ 10.4 µA (ULN mode)o 0.8 Pa @ 5.2 µA (LN mode)o 3.2 Pa @ 1.3 µA (LP mode)
Pressure Sensor Relative Accuracy: ±1 Pa for any
10 hPa change over 950 hPa-1050 hPa at 25C
Pressure Sensor Absolute Accuracy: ±1 hPa over
950 hPa-1050 hPa, 0C to 65C
Pressure Sensor Temperature Coefficient Offset:±0.5 Pa/C over 25C to 45C at 100 kPa
Temperature Sensor Absolute Accuracy: ±0.4C
Temperature operating range: -40 °C to 85 °C
Host Interface: I2C at up to 400 kHz
Single Supply voltage: 1.8V ±5%
RoHS and Green compliant

DEVICE INFORMATION
1-Hole Lid OpeningPART
NUMBER

PACKAGE

LID OPENING

MSL**

ICP-10111*

2x2.5x0.92mm
LGA-8L

1-Hole1

ICP-10111

BLOCK DIAGRAM* Denotes RoHS and Green-Compliant Package** Moisture Sensitivity Level of the package

APPLICATIONS
•
•
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•
•
•
•

VDD

Altitude Control of Drones and Flying Toys
Mobile Phones
Virtual Reality and Gaming Equipment
Indoor/Outdoor Navigation (dead-reckoning,
floor/elevator/step detection)
Vertical velocity monitoring
Leisure, Sports, and Fitness Activity Identification
Weather Forecasting

VDD

VDD

SCL

ICP-10111
100nf

I2C
SDA

GND
GND
GND
VDD

InvenSense reserves the right to change the detailspecifications as may be required to permit
improvements in the design of its products.

InvenSense, a TDK Group Company
1745 Technology Drive, San Jose, CA 95110 U.S.A+1(408) 988–7339
invensense.tdk.com

Document Number: DS-000177
Revision: 1.3
Release Date: 05/03/2021

MCU/HUB/APICP-10111
TABLE OF CONTENTS
GENERAL INFORMATION............................................................................................................................................................................... 1
DEVICE INFORMATION ................................................................................................................................................................................. 1
APPLICATIONS ............................................................................................................................................................................................ 1
FEATURES .................................................................................................................................................................................................. 1
BLOCK DIAGRAM ........................................................................................................................................................................................ 1
1

INTRODUCTION .........................................................................................................................................................................5
1.1
1.2

2

PRESSURE AND TEMPERATURE SENSOR SPECIFICATIONS ..........................................................................................................6
2.1
2.2
2.3
2.4
2.5

3

OPERATION RANGES ........................................................................................................................................................................ 6
OPERATION MODES ........................................................................................................................................................................ 6
PRESSURE SENSOR SPECIFICATIONS .................................................................................................................................................... 7
TEMPERATURE SENSOR SPECIFICATIONS .............................................................................................................................................. 7
RECOMMENDED OPERATION CONDITIONS ........................................................................................................................................... 7

ELECTRICAL SPECIFICATIONS ......................................................................................................................................................8
3.1
3.2
3.3
3.4

4

PURPOSE AND SCOPE ....................................................................................................................................................................... 5
PRODUCT OVERVIEW ....................................................................................................................................................................... 5

ELECTRICAL CHARACTERISTICS ........................................................................................................................................................... 8
ABSOLUTE MAXIMUM RATINGS ......................................................................................................................................................... 9
SENSOR SYSTEM TIMING .................................................................................................................................................................. 9
I2C TIMING CHARACTERIZATION....................................................................................................................................................... 10

APPLICATIONS INFORMATION ................................................................................................................................................. 11
4.1
INTERFACE SPECIFICATIONS ............................................................................................................................................................. 11
4.2
PIN OUT DIAGRAM AND SIGNAL DESCRIPTION .................................................................................................................................... 11
ICP-10111: 2x2.5x0.92 mm 8-pin LGA .............................................................................................................................................. 11
4.3
TYPICAL OPERATING CIRCUIT........................................................................................................................................................... 12
4.4
BILL OF MATERIALS FOR EXTERNAL COMPONENTS ............................................................................................................................... 13

5

OPERATION AND COMMUNICATION ....................................................................................................................................... 14
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.10
5.11
5.12
5.13
5.14

6

POWER-UP AND COMMUNICATION START ......................................................................................................................................... 14
MEASUREMENT COMMANDS .......................................................................................................................................................... 14
STARTING A MEASUREMENT ........................................................................................................................................................... 14
SENSOR BEHAVIOR DURING MEASUREMENT ...................................................................................................................................... 14
READOUT OF MEASUREMENT RESULTS.............................................................................................................................................. 14
SOFT RESET ................................................................................................................................................................................. 15
READ-OUT OF ID REGISTER ............................................................................................................................................................. 15
CHECKSUM CALCULATION ............................................................................................................................................................... 15
CONVERSION OF SIGNAL OUTPUT..................................................................................................................................................... 16
READ-OUT OF CALIBRATION PARAMETERS ......................................................................................................................................... 17
SAMPLE CODE: EXAMPLE C SYNTAX.................................................................................................................................................. 17
SAMPLE CODE: CONVERSION FORMULA (EXAMPLE PYTHON SYNTAX) ...................................................................................................... 19
SAMPLE CODE: USING CONVERSION FORMULA (EXAMPLE PYTHON SYNTAX) ............................................................................................. 20
COMMUNICATION DATA SEQUENCES ................................................................................................................................................ 20

ASSEMBLY................................................................................................................................................................................ 22
6.1
IMPLEMENTATION AND USAGE RECOMMENDATIONS ........................................................................................................................... 22
Soldering .......................................................................................................................................................................................... 22
Chemical Exposure and Sensor Protection ....................................................................................................................................... 22

7

PACKAGE DIMENSIONS ............................................................................................................................................................ 23

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ICP-10111
8PART NUMBER PART MARKINGS ............................................................................................................................................. 26

9

TAPE & REEL SPECIFICATION .................................................................................................................................................... 27

10

ORDERING GUIDE................................................................................................................................................................. 28

11

REFERENCES ......................................................................................................................................................................... 29

12

REVISION HISTORY ............................................................................................................................................................... 30

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ICP-10111
LIST OF FIGURES
Figure 1. Digital I/O Pads Timing .......................................................................................................................................... 10
Figure 2. Pin Out Diagram for ICP-10111 2 mm x 2.5 mm x 0.92 mm LGA ......................................................................... 11
Figure 3. ICP-10111 Application Schematic ......................................................................................................................... 12
Figure 4. Example: Typical Application Circuit ...................................................................................................................... 12
Figure 5. Communication Data Sequences .......................................................................................................................... 21
Figure 6. ICP-10111 Package Diagrams .............................................................................................................................. 23
Figure 7. ICP-10111 recommended PCB land pattern ......................................................................................................... 24
Figure 8. Part Number Part Markings for 2x2.5mm (ICP-10111) ......................................................................................... 26
Figure 9. ICP-10111 Tape Dimensions ............................................................................................................................. 27
Figure 10. ICP-10111 Tape and Reel Drawing ..................................................................................................................... 27

LIST OF TABLES
Table 1. Operation Ranges ..................................................................................................................................................... 6
Table 2. Operation Modes ....................................................................................................................................................... 6
Table 3. Pressure Sensor Specifications ................................................................................................................................ 7
Table 4. Temperature Sensor Specifications .......................................................................................................................... 7
Table 5. Electrical Specifications ............................................................................................................................................ 8
Table 6. Absolute Maximum Ratings ...................................................................................................................................... 9
Table 7. System Timing Specifications ................................................................................................................................... 9
Table 8. I2C Parameters Specification .................................................................................................................................. 10
Table 9. Signal Descriptions ................................................................................................................................................. 11
Table 10. Bill of Materials ...................................................................................................................................................... 13
Table 11. ICP-10111 I2C Device Address ............................................................................................................................. 14
Table 12. Measurement Commands ..................................................................................................................................... 14
Table 13. Soft Reset Command ............................................................................................................................................ 15
Table 14. Read-Out Command of ID Register ...................................................................................................................... 15
Table 15. 16-bit ID Structure ................................................................................................................................................. 15
Table 16. ICP-10111 I2C CRC Properties ............................................................................................................................. 16
Table 17. ICP-10111 Package Dimensions .......................................................................................................................... 24
Table 18. Part Number Part Markings .................................................................................................................................. 26

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ICP-10111
1 INTRODUCTION
1.1 PURPOSE AND SCOPE
This document is a preliminary product specification, providing a description, specifications, and design related information for the
ICP-10111 Pressure Sensor.
Specifications are subject to change without notice. Final specifications will be updated based upon characterization of production
silicon.

1.2 PRODUCT OVERVIEWThe ICP-10111 is an ultra-low power, low noise, digital output barometric pressure and temperature sensor IC. It is based on an
innovative MEMS capacitive pressure sensor technology that can measure pressure differences with an accuracy of ±1 Pa at theindustry’s lowest power. The high accuracy MEMS capacitive pressure sensor is capable of measuring altitude differentials down to
8.5 cm without the penalty of increased power consumption or reduced sensor throughput.
The capacitive pressure sensor has a ±1 hPa absolute accuracy over its full range of 300 hPa -1100 hPa. The pressure sensor has anembedded temperature sensor and 400 kHz I2C bus for communication. For power-critical applications, the ICP-10111 features a low
power mode of 1.3 µA at a noise of 3.2 Pa or for high performance applications, it features a low noise mode of 0.8 Pa while only
consuming 5.2 µA.
The ICP-10111 also offers industry leading temperature stability of the pressure sensor with a temperature coefficient offset of±0.5 Pa/C. The high accuracy, temperature stability, and market leading low power consumption of 1.3 µA @1 Hz offered by ICP10111 makes it ideally suited for applications such as mobile phones, drone flight control and stabilization, indoor/outdoor
navigation (elevator, floor, and stair step detection), sports and fitness activity monitoring, and battery-powered IoT.

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ICP-10111
2 PRESSURE AND TEMPERATURE SENSOR SPECIFICATIONS
2.1 OPERATION RANGESThe sensor shows best performance when operated within the recommended temperature and pressure range (hereafter called
normal conditions) of 0°C – 45°C and 95 kPa – 105 kPa, respectively. The following ranges are defined for the device:
OPERATION RANGEPRESSURE (KPA)TEMPERATURE (C)

Normal95 to 105

0 to 45

Extended

30 to 110

-20 to 65

Maximum

25 to 115

-40 to 85

Table 1. Operation Ranges

2.2 OPERATION MODES
The sensor can be operated in up to four different measurement modes to satisfy different requirements for power consumption vs.
noise, accuracy and measurement frequency. An overview of the operation modes is given in Table 2.
PARAMETERCONDITIONSConversion TimeTime between sending last bit ofmeasurement command, andsensor data ready formeasurement

Current
Consumption

Pressure RMS Noise

1 Hz ODR

Valid for P = 100 kPa, T = 25°C,
and U = 1.8V

SENSOR MODE
Low Power (LP)
Normal (N)

TYP
1.6
5.6

MAX
1.8
6.3

UNITS

NOTES
1
1

Low Noise (LN)
Ultra Low Noise(ULN)
Low Power (LP)
Normal (N)Low Noise (LN)
Ultra Low Noise(ULN)
Low Power (LP)
NormalLow Noise (LN)
Ultra Low Noise
(ULN)

20.8

23.8

ms

1

83.2

94.5

1.3
2.6
5.2

1

µA

10.4
3.2
1.6
0.8

Pa

0.4

Table 2. Operation Modes
Notes:
1.

Guaranteed by design.

Low Power modes supports ODR greater than 500 Hz while the Low Noise mode provides industry leading RMS noise at a fast 40 Hz
ODR. Further decrease in noise may be achieved by software oversampling and filtering through customer’s software
implementation or custom TDK-InvenSense operation modes available upon request.

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ICP-10111
2.3 PRESSURE SENSOR SPECIFICATIONS
Pressure sensor specifications are given in Table 3. Default conditions of 25 °C and 1.8V supply voltage apply, unless otherwise stated.
PARAMETER
Absolute Accuracy
Relative Accuracy

CONDITIONSNormal range
Extended range
Any step ≤ 1 kPa, 25 °C
Any step ≤ 10 kPa, 25 °C

TYP
±1
±1.5
±1
±3

UNITS

NOTES

hPa

1, 3

Pa

3

Normal Range
Extended Range

±35
±40
0.5

Pa/y
Pa/y
hPa

1, 2, 4

±0.5

Pa/°C

3

0.01

Pa

Long-term drift
During 1 year
Solder drift

P = 100 kPa
25°C … 45°C
Maximum range

Temperature coefficient offset
Resolution

Table 3. Pressure Sensor Specifications
Notes:
1.
2.
3.
4.

Absolute accuracy may be improved through One Point Calibration.
Sensor accuracy post Solder reflow may be improved through One Point Calibration.
Parameter specifications shown are component-level. They may be different at the board-level and may depend on PCB characteristics
including but not limited to PCB material, number of layers, PCB thickness. They may also depend on usage conditions.
Specification value is based on PCBs with no solder mask under the device. Specification value may depend on PCB characteristics
including but not limited to PCB material, number of layers, PCB thickness. It may also depend on usage conditions.

2.4 TEMPERATURE SENSOR SPECIFICATIONSSpecifications of the temperature sensor are shown in Table 4.
PARAMETER
Absolute Accuracy
Repeatability
Resolution
Long-term drift

CONDITIONSExtended range
Extended range
Maximum range
Normal range

TYP
±0.4
±0.1
0.01
<0.04

UNITS
°C
°C
°C
°C/y

Table 4. Temperature Sensor Specifications

2.5 RECOMMENDED OPERATION CONDITIONS
The pressure sensor exhibits best performance when operated within the normal pressure and temperature range 0°C < T < 45°C
and 95 kPa < P < 105 kPa.
Injected photo current due to strong light sources can influence the sensor performance and should be avoided to guarantee best
operation.
The sensor should not be exposed to high mechanical stress, the resulting deformation of the package can alter internal dimensions
and therefore falsify the sensor signal. Solder reflow may affect device performance. One-point calibration can improve the sensor
accuracy post solder reflow.

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ICP-10111
3 ELECTRICAL SPECIFICATIONS
3.1 ELECTRICAL CHARACTERISTICS
Default conditions of 25 °C and 1.8V supply voltage apply to values in Table 5, unless otherwise stated.
PARAMETERSYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

1.71

1.8

1.89

V

1.25

1.5

V

100

ms

COMMENTS

Supply voltage

VDD

Power-up/down level

VPOR

Static power supply

1.0

Supply Ramp Time

TRAMP

Monotonic ramp. Ramp rate
is 10% to 90% of the final
value

0.01

Idle state

-

1.0

2.5

µA

Measurement

-

210

300

µA

Current consumption while
sensor is measuring.

-

1.3

-

µA

Current consumption incontinuous operation @ 1 Hz
ODR in LP Mode

-

5.2

-

µA

Current consumption incontinuous operation @1 Hz
ODR in LN Mode

Supply current

IDD
AverageLow level input voltage

VIL

0

-

0.3 VDD

V

High level input voltage

VIH

0.7 VDD-

VDD

V

Low level output voltage

VOL

0 < IOL < 3 mA--

0.2 VDDV

VOL = 0.4V

3.1

4.1

-

mA

Output Sink Current

IOL
VOL = 0.6V

3.5

4.5

-

mA

Table 5. Electrical Specifications

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ICP-10111
3.2 ABSOLUTE MAXIMUM RATINGS
Stress levels beyond those listed in Table 6 may cause permanent damage to the device. These are stress ratings only and functional
operation of the device at these conditions cannot be guaranteed. Exposure to the absolute maximum rating conditions forextended periods may affect the reliability of the device.
PARAMETERRATING

Supply voltage, VDD-0.3V to 2.16V

Supply Voltage, SCL & SDA-0.3V to VDD 0.3V

Operating temperature range-40°C to 85°C

Storage temperature range-40°C to 125°C

ESD HBM

2.0 kVESD CDM

250V

Latch up, JESD78 Class II, 85°C

100 mA

Overpressure>600kPa
Table 6. Absolute Maximum Ratings

3.3 SENSOR SYSTEM TIMING
Default conditions of 25°C and 1.8V supply voltage apply to typ. values listed in Table 7, unless otherwise stated. Max. values apply
over the specified operating range of VDD and over the operating temperature range.
PARAMETERSYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

COMMENTSPower-up timetPU

After hard reset, VDD ≥ VPOR

-

170

-

µs

Time between VDD reaching VPU
and sensor entering idle stateSoft reset timetSR

After soft reset

-

170

-

µs

Time between ACK of soft reset
command and sensor entering
idle state

Measurement durationtMEAS

LN Mode

-

20.8

23.8

ms

Duration for a pressure andtemperature measurement

Table 7. System Timing Specifications

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ICP-10111
3.4 I2C TIMING CHARACTERIZATION
Default conditions of 25°C and 1.8V supply voltage apply to values in Table 8, unless otherwise stated.
PARAMETERSYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

0

-

400

kHz

0.6

-

-

µs

SCL clock frequency

fSCL

Hold time (repeated) START condition

tHD;STALOW period of the SCL clock

tLOW

1.3

-

-

µs

HIGH period of the SCL clock

tHIGH

0.6

-

-

µs

Set-up time for a repeated START conditiontSU;STA

0.6

-

-

µs

SDA hold time

tHD;DAT

0

-

-

µs

SDA set-up time

tSU;DAT

100

-

-

ns

SCL/SDA rise time

tR

20

-

300

ns

SCL/SDA fall time

tF

-

-

300

ns

SDA valid timetVD;DAT

-

-

0.9

µs

Set-up time for STOP conditiontSU;STO

0.6

-

-

µs

CB

-

-

400

pF

Capacitive load on bus line

After this period, the first clock
pulse is generated

Table 8. I2C Parameters Specification
1/fSC
tHIGH

L

tLOW

tR

tF
70
%
30
%

SCL
tHD;DAtSU;D
DATA IN

T

AT

70
%
30
%

SDA
tVD;DATtF

tR

DATA OUT

SDA
Figure 1. Digital I/O Pads Timing

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70
%
30
%

ICP-10111
4 APPLICATIONS INFORMATION
4.1 INTERFACE SPECIFICATIONSThe ICP-10111 supports I2C fast mode, SCL clock frequency from 0 to 400 kHz.

4.2 PIN OUT DIAGRAM AND SIGNAL DESCRIPTION
ICP-10111: 2x2.5x0.92 mm 8-pin LGAPIN NUMBERPIN NAME

DESCRIPTION

1
2
3
4
5
6
7
8

GND
RESV
SDA
SCL
RESV
RESV
GND
VDD

Connect to Ground
No Internal Connection: Can connect to VDD/VDDIO/GND/NC
I2C Serial Data
I2C Serial ClockConnect to Ground
No Internal Connection: Can connect to VDD/VDDIO/GND/NC
Connect to Ground
Power Supply VDD
Table 9. Signal Descriptions

1

8

GND

VDD

2

7

RESV

GND

BOTTOM VIEW

3

6

SDA

RESV

4

5

SCL

RESV

Figure 2. Pin Out Diagram for ICP-10111 2 mm x 2.5 mm x 0.92 mm LGA

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ICP-10111
4.3 TYPICAL OPERATING CIRCUIT

VDD
1.71-1.89V

8

1

VDD

GND

GND

C1, 100nF

GND

GND

No Internal Connection
Can connect to: VDD/VDDIO/GND/NC

GND

No Internal Connection

7

2

GND

RESV

Can connect to: VDD/VDDIO/GND/NC

3

SDA

6

TOP
VIEW

RESV

SDA

5

4

RESV

SCL

SCL

Figure 3. ICP-10111 Application SchematicPower supply pins supply voltage (Vdd) and ground (Vss) must be decoupled with a 100 nF capacitor that shall be placed as close to
the sensor as possible (see Figure 4).

Figure 4. Example: Typical Application Circuit

SCL is used to synchronize the communication between the microcontroller and the sensor. The master must keep the clock frequency
within 0 to 400 kHz as specified in Table 8.
The SDA pin is used to transfer data in and out of the sensor. For safe communication, the timing specifications defined in the I2C
manual must be met.
To avoid signal contention, the microcontroller must only drive SDA and SCL low. External pull-up resistors (i.e. 10 kΩ) are required topull the signal high. For dimensioning resistor sizes, user should also consider bus capacity requirements. It should be noted that pullup resistors may be included in I/O circuits of microcontrollers.
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ICP-10111
User should refer to AN-000140 “TDK-InvenSense Pressure Sensor PCB Design Guidelines” for PCB guidelines and sensor integration.

4.4 BILL OF MATERIALS FOR EXTERNAL COMPONENTSCOMPONENTVDD Bypass Capacitor

LABEL

SPECIFICATIONQUANTITY

C1

Ceramic, X7R, 100 nF ±10%

1Table 10. Bill of Materials

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ICP-10111
5 OPERATION AND COMMUNICATION
All commands and memory locations of the ICP-10111 are mapped to a 16-bit address space which can be accessed via the I2C protocol.
ICP-10111

BINARYDECIMALHEXADECIMAL

I2C address

110’0011

99

0x63

Table 11. ICP-10111 I2C Device Address

5.1 POWER-UP AND COMMUNICATION START
Upon VDD reaching the power-up voltage level VPOR, the ICP-10111 enters idle state after a duration of tPU. In idle state, the ICP10111 is ready to receive commands from the master (microcontroller).
Each transmission sequence begins with START condition (S) and ends with an (optional) STOP condition (P) as described in the
I2C-bus specification. Whenever the sensor is powered up, but not performing a measurement or communicating, it automaticallyenters idle state for energy saving.

5.2 MEASUREMENT COMMANDSThe ICP-10111 provides the possibility to define the sensor behavior during measurement as well as the transmission sequence ofmeasurement results. These characteristics are defined by the appropriate measurement command.
Each measurement command triggers both a temperature and a pressure measurement.
OPERATION MODE
Low Power (LP)
Normal (N)Low Noise (LN)
Ultra-Low Noise (ULN)

TRANSMIT T FIRST
0x609C0x68250x70DF0x7866

TRANSMIT P FIRST
0x401A
0x48A30x50590x58E0

Table 12. Measurement Commands

5.3 STARTING A MEASUREMENT
A measurement communication sequence consists of a START condition followed by the I2C header with the 7-bit I2C device address
and a write bit (write W: ‘0’, 8-bit word including I2C header: 0xC6). The sensor indicates the proper reception of a byte by pulling
the SDA pin low (ACK bit) after the falling edge of the 8th SCL clock. Then the sensor is ready to receive a 16-bit measurement
command. Again, the ICP-10111 acknowledges the proper reception of each byte with ACK condition. A complete measurement
cycle is presented in Figure 5.
With the acknowledgement of the measurement command, the ICP-10111 starts measuring pressure and temperature.

5.4 SENSOR BEHAVIOR DURING MEASUREMENT
In general, the sensor does not respond to any I 2C activity during measurement, i.e. I2C read and write headers are notacknowledged (NACK).

5.5 READOUT OF MEASUREMENT RESULTS
After a measurement command has been issued and the sensor has completed the measurement, the master can read themeasurement results by sending a START condition followed by an I2C read header (8-bit word including I2C header: 0xC7). The
sensor will acknowledge the reception of the read header and send the measured data in the specified order to the master. The MSBof the corresponding data is always transmitted first. Temperature data is transmitted in two 8-bit words and pressure data istransmitted in four 8-bit words. Regarding the pressure data, only the first three words MMSB, MLSB and LMSB contain information
about the ADC pressure value p_dout. Therefore, for retrieving the ADC pressure value, LLSB must be disregarded:
p_dout = MMSB ≪ 16 | MLSB ≪ 8| LMSB.

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ICP-10111
Two bytes of data are always followed by one byte CRC checksum, for calculation see section 5.8. Each byte must be acknowledgedby the microcontroller with an ACK condition for the sensor to continue sending data. If the ICP-10111 does not receive an ACK fromthe master after any byte of data, it will not continue sending data.
Whether the sensor sends out pressure or temperature data first depends on the measurement command that was sent to thesensor to initiate the measurement (see Table 12).
The I2C master can abort the read transfer with a NACK condition after any data byte if it is not interested in subsequent data, e.g.
the CRC byte or the second measurement result, to save time.

5.6 SOFT RESETThe ICP-10111 provides a soft reset mechanism that forces the system into a well-defined state without removing the power supply.
If the system is in idle state (i.e. if no measurement is in progress) the soft reset command will be accepted by ICP-10111. This
triggers the sensor to reset all internal state machines and reload calibration data from the memory.
COMMANDHEXADECIMAL CODE

BINARY CODE

Soft reset

0x805D

1000’0000’0101’1101

Table 13. Soft Reset Command

5.7 READ-OUT OF ID REGISTERThe ICP-10111 has an ID register which contains a specific product code. The read-out of the ID register can be used to verify thepresence of the sensor and proper communication. The command to read the ID register is shown in Table 14.
COMMANDHEXADECIMAL CODE

BINARY CODE

Read ID register

0xEFC81110’1111’1100’1000

Table 14. Read-Out Command of ID Register

It needs to be sent to the ICP-10111 after an I2C write header. After the ICP-10111 has acknowledged the proper reception of thecommand, the master can send an I2C read header and the ICP-10111 will submit the 16-bit ID followed by 8 bits of CRC. The
structure of the ID is described in Table 15. Bits 15:6 of the ID contain unspecified information (marked as “x”), which may vary fromsensor to sensor, while bits 5:0 contain the ICP-10111 specific product code.
16-bit ID
xxxx'xxxx’xx 00’1000

bits 5 to 0: ICP-10111-specific product code
bits 15 to 6: unspecified information
Table 15. 16-bit ID Structure

5.8 CHECKSUM CALCULATION
The 8-bit CRC checksum transmitted after each data word is generated by a CRC algorithm with the properties displayed in Table 16.
The CRC covers the contents of the two previously transmitted data bytes.

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ICP-10111
PROPERTY

VALUE

Name

CRC-8

Width

8 bitsPolynomial

0x31 (x8 + x5 + x4 + 1)

Initialization

0xFF

Reflect input

false

Reflect output

false

Final XOR

0x00

ExamplesCRC(0x00) = 0xAC
CRC(0xBEEF) = 0x92
Table 16. ICP-10111 I2C CRC Properties

5.9 CONVERSION OF SIGNAL OUTPUT
Pressure measurement data is always transferred as 4 8-bit words; temperature measurement data is always transferred as two 8bit words. Please see section 5.5 for more details.
Temperature measurement values t_dout are linearized by the ICP-10111 and must be calculated to °C by the user via the following
formula:T = - 45°C +175°C
× t_dout.
216

For retrieving physical pressure values in Pa the following conversion formula has to be used:

P=A+

B
,
C + pdout

where p_dout is the sensor’s raw pressure output. The converted output is compensated for temperature effects via thetemperature dependent functions A, B and C. Besides the raw temperature output t_dout, the calculation of A, B and C requires toaccess calibration parameters OTP0, OTP1, OTP2, OTP3 stored in the OTP of the sensor. Read-out of OTP parameters is described in
section 5.10.
Full sample code for calculating physical pressure values is given in section 5.11. The general workflow of the conversion is done by:1) Import class Invensense_pressure_conversion
2)

Read out values OTP0, …, OTP3 and save to c1, …, c43) Create object name for an individual sensor with parameter values c1, …, c4
name = Invensense_pressure_conversion([c1,c2,c3,c4])

4)

Get raw pressure p_dout and temperature t_dout data from the sensor as described in chapter 5.5.

5) Call function get_pressure:name.get_pressure(p_dout, t_dout)

The sample code from section 5.13 gives an example of this workflow.

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ICP-10111
5.10 READ-OUT OF CALIBRATION PARAMETERS
For converting raw pressure data to physical values, four calibration parameters have to be retrieved from the OTP of the sensor.
Set up of OTP read:1)

Send I2C write header 0xC6

2)

Send command 0xC595 (move pointer in address register)3)

Send address parameter together with its CRC 0x00669C

Steps 1) – 3) can be executed on many platforms by a single I2C write of the value 0xC59500669C.
Read out parameters:
Repeat the following procedure 4 times:
Send I2C write header 0xC6a)b) Send command 0xC7F7 (incremental read-out of OTP)
Send I2C read header 0xC7c)d) Read 3B (2B of data and 1B of CRC)e)

Decode data as 16bit big endian signed integer and store result into n-th calibration parameter cn.

Steps a) to d) can be executed on many platforms by a single write 0xC7F7 to the chip address followed by a single read of 3 B fromthe chip address.

5.11 SAMPLE CODE: EXAMPLE C SYNTAX/* data structure to hold pressure sensor related parameters */typedef struct inv_invpres{
struct inv_invpres_serif serif;
uint32_t min_delay_us;
uint8_t pressure_en;
uint8_t temperature_en;
float sensor_constants[4]; // OTP values
float p_Pa_calib[3];float LUT_lower;
float LUT_upper;
float quadr_factor;
float offst_factor;} inv_invpres_t;

int inv_invpres_init(struct inv_invpres * s){short otp[4];read_otp_from_i2c(s, otp);
init_base(s, otp);
return 0;}
int read_otp_from_i2c(struct inv_invpres * s, short *out){
unsigned char data_write[10];unsigned char data_read[10] = {0};int status;
int i;// OTP Read mode
data_write[0] = 0xC5;
data_write[1] = 0x95;
data_write[2] = 0x00;
data_write[3] = 0x66;
data_write[4] = 0x9C;
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ICP-10111
status = inv_invpres_serif_write_reg(&s->serif, ICC_ADDR_PRS, data_write, 5);
if (status)
return status;// Read OTP valuesfor (i = 0; i < 4; i++) {data_write[0] = 0xC7;
data_write[1] = 0xF7;
status = inv_invpres_serif_write_reg(&s->serif, ICC_ADDR_PRS, data_write, 2);
if (status)
return status;
status = inv_invpres_serif_read_reg(&s->serif, ICC_ADDR_PRS, data_read, 3);
if (status)
return status;
out[i] = data_read[0]<<8 | data_read[1];}return 0;}
void init_base(struct inv_invpres * s, short *otp){
int i;
for(i = 0; i < 4; i++)s->sensor_constants[i] = (float)otp[i];s->p_Pa_calib[0] = 45000.0;
s->p_Pa_calib[1] = 80000.0;
s->p_Pa_calib[2] = 105000.0;
s->LUT_lower = 3.5 * (1<<20);s->LUT_upper = 11.5 * (1<<20);s->quadr_factor = 1 / 16777216.0;
s->offst_factor = 2048.0;}// p_LSB -- Raw pressure data from sensor// T_LSB -- Raw temperature data from sensor
int inv_invpres_process_data(struct inv_invpres * s, int p_LSB, int T_LSB,
float * pressure, float * temperature){
float t;float s1,s2,s3;
float in[3];float out[3];float A,B,C;t = (float)(T_LSB - 32768);
s1 = s->LUT_lower + (float)(s->sensor_constants[0] * t * t) * s->quadr_factor;
s2 = s->offst_factor * s->sensor_constants[3] + (float)(s->sensor_constants[1] * t * t) * s->quadr_factor;
s3 = s->LUT_upper + (float)(s->sensor_constants[2] * t * t) * s->quadr_factor;
in[0] = s1;
in[1] = s2;
in[2] = s3;
calculate_conversion_constants(s, s->p_Pa_calib, in, out);
A = out[0];B = out[1];C = out[2];*pressure = A + B / (C + p_LSB);*temperature = -45.f + 175.f/65536.f * T_LSB;
return 0;}// p_Pa -- List of 3 values corresponding to applied pressure in Pa// p_LUT -- List of 3 values corresponding to the measured p_LUT values at the applied pressures.
void calculate_conversion_constants(struct inv_invpres * s, float *p_Pa,
float *p_LUT, float *out){
float A,B,C;
C = (p_LUT[0] * p_LUT[1] * (p_Pa[0] - p_Pa[1]) +p_LUT[1] * p_LUT[2] * (p_Pa[1] - p_Pa[2]) +p_LUT[2] * p_LUT[0] * (p_Pa[2] - p_Pa[0])) /Document Number: DS-000177
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ICP-10111(p_LUT[2] * (p_Pa[0] - p_Pa[1]) +p_LUT[0] * (p_Pa[1] - p_Pa[2]) +p_LUT[1] * (p_Pa[2] - p_Pa[0]));A = (p_Pa[0] * p_LUT[0] - p_Pa[1] * p_LUT[1] - (p_Pa[1] - p_Pa[0]) * C) / (p_LUT[0] - p_LUT[1]);B = (p_Pa[0] - A) * (p_LUT[0] + C);
out[0] = A;out[1] = B;out[2] = C;}

5.12 SAMPLE CODE: CONVERSION FORMULA (EXAMPLE PYTHON SYNTAX)
class

InvensensePressureConversion:""" Class for conversion of the pressure and temperature output of the Invensense sensor"""def __init__(self, sensor_constants):""" Initialize customer formula

Arguments:
sensor_constants -- list of 4 integers: [c1, c2, c3, c4]"""
self.sensor_constants = sensor_constants# configuration for ICP-10111 Samples
self.p_Pa_calib = [45000.0, 80000.0, 105000.0]
self.LUT_lower = 3.5 * (2**20)
self.LUT_upper = 11.5 * (2**20)
self.quadr_factor = 1 / 16777216.0
self.offst_factor = 2048.0

def calculate_conversion_constants(self, p_Pa, p_LUT):""" calculate temperature dependent constants

Arguments:
p_Pa -- List of 3 values corresponding to applied pressure in Pa
p_LUT -- List of 3 values corresponding to the measured p_LUT values at the applied pressures.
"""C = (p_LUT[0] * p_LUT[1] * (p_Pa[0] - p_Pa[1]) +p_LUT[1] * p_LUT[2] * (p_Pa[1] - p_Pa[2]) +p_LUT[2] * p_LUT[0] * (p_Pa[2] - p_Pa[0])) / \(p_LUT[2] * (p_Pa[0] - p_Pa[1]) +p_LUT[0] * (p_Pa[1] - p_Pa[2]) +p_LUT[1] * (p_Pa[2] - p_Pa[0]))A = (p_Pa[0] * p_LUT[0] - p_Pa[1] * p_LUT[1] - (p_Pa[1] - p_Pa[0]) * C) / (p_LUT[0] - p_LUT[1])B = (p_Pa[0] - A) * (p_LUT[0] + C)

return [A, B, C]

def get_pressure(self, p_LSB, T_LSB):
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ICP-10111""" Convert an output from a calibrated sensor to a pressure in Pa.

Arguments:
p_LSB -- Raw pressure data from sensor
T_LSB -- Raw temperature data from sensor"""
t = T_LSB - 32768.0
s1 = self.LUT_lower + float(self.sensor_constants[0] * t * t) * self.quadr_factor
s2 = self.offst_factor * self.sensor_constants[3] + float(self.sensor_constants[1] * t * t) * self.quadr_factor
s3 = self.LUT_upper + float(self.sensor_constants[2] * t * t) * self.quadr_factor
A, B, C = self.calculate_conversion_constants(self.p_Pa_calib, [s1, s2, s3])
return A + B / (C + p_LSB)[end of the pseudocode]

5.13 SAMPLE CODE: USING CONVERSION FORMULA (EXAMPLE PYTHON SYNTAX)
def read_otp_from_i2c():# TODO: implement read from I2C# refer to data sheet for I2C commands to read OTP
return 1000, 2000, 3000, 4000

def read_raw_pressure_temp_from_i2c():# TODO: implement read from I2C# refer to data sheet for I2C commands to read pressure and temperature
return 8000000, 32000# Sample code to readfrom

Invensense_pressure_conversion import

Invensense_pressure_conversion# -- initialization
c1, c2, c3, c4 = read_otp_from_i2c()
conversion =Invensense_pressure_conversion([c1, c2, c3, c4])# -- read raw pressure and temp data, calculate pressurep, T = read_raw_pressure_temp_from_i2c()
pressure = conversion.get_pressure(p, T)
print 'Pressure: %f' % pressure[end of the pseudocode]

4

5

6

7

8

S 1 1 0 0 0 1 1 0

I2C address + write

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9

10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28

0 1 0 1 0 0 0 0
Measurement command
MSB

0 1 0 1 1 0 0 1
Measurement command
LSB

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ACK

3

ACK

1 2

ACK

5.14 COMMUNICATION DATA SEQUENCES

P

ICP-10111 measuring

Measurement in progress

ICP-10111

repeated I2C address +read while meas. is inprog. (polling)P

40 41 42 43 44 45 46 47 48 49

ICP-10111
measuringmeasurement
cont’dICP-10111 inSidle state

1 1 0 0 0 1 1 1

measurement
completed

Pressure MMSB

0 0 0 1 1 1 0 0

ACK

0 0 1 1 0 0 1 1

ACK

1 0 1 0 0 0 0 1

ACK

50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76

Pressure CRC
checksum

Pressure MLSB

Pressure LMSB

0 0 0 1 1 1 0 0

ACK

0 0 1 1 0 0 1 1

ACK

1 0 1 0 0 0 0 1

ACK

77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103

Pressure CRC
checksum

Pressure LLSB

Temperature MSB

Temperature LSB

1 1 0 0 0 1 1 1

NACK

1 0 0 0 1 0 1 1

ACK

0 1 1 0 0 1 0 0

ACK

104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131

P

Temperature CRC
checksum

Figure 5. Communication Data Sequences

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I2C address + read

ACK

S 1 1 0 0 0 1 1 1

NACK

29 30 31 32 33 34 35 36 37 38 39

ICP-10111
6 ASSEMBLY
This section provides general guidelines for assembling TDK-InvenSense Micro Electro-Mechanical Systems (MEMS) pressure sensors.

6.1 IMPLEMENTATION AND USAGE RECOMMENDATIONS
Soldering
When soldering, use the standard soldering profile IPC/JEDEC J-STD-020 with peak temperatures of 260°C. ICP-10111 may exhibit apressure offset after soldering, some settling time may be required depending on soldering properties, PCB properties, and ambientconditions.
The ICP-10111 is an open cavity package, it is mandatory to use no-clean solder paste and no board wash should be applied.

Chemical Exposure and Sensor Protection
The ICP-10111 is an open cavity package, and should not be exposed to particulates or liquids. If any type of protective coating must
be applied to the circuit board, the sensor must be protected during the coating process.

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ICP-10111
7 PACKAGE DIMENSIONS
Package dimensions for the ICP-10110 & ICP-10111:

Top View: ICP-10111

Bottom View: ICP-10111

Figure 6. ICP-10111 Package Diagrams

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ICP-10111
SYMBOLS

MIN.
0.84------1.90--2.40----0.35
0.05
0.30
---

A
A3
b
c
E
E1
D
D1
e
L
L1
L3
S

DIMENSIONS IN MILLIMETERS
NOM.
0.92
0.79 REF.
0.35
0.13 REF.
2.00
1.85
2.50
2.35
0.65
0.45
0.10
0.35
0.10

Table 17. ICP-10111 Package Dimensions

Recommended PCB land pattern for the ICP-10111:

Figure 7. ICP-10111 recommended PCB land patternDocument Number: DS-000177
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MAX.
1.00
------2.10--2.60----0.55
0.15
0.40
---

ICP-10111
Product artwork for the ICP-10111:

Package Artwork: ICP-10111

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ICP-10111
8 PART NUMBER PART MARKINGS
The part number part markings for ICP-10111 devices are summarized below:
PART NUMBER
ICP-10111

PART MARKING
P6
Table 18. Part Number Part Markings

TOP VIEW

1-Hole (ICP-10111)

P6
XXXX
YW

Part Number
Lot Traceability Code
Date Code: (Y)Year(W)WorkWeek

Figure 8. Part Number Part Markings for 2x2.5mm (ICP-10111)

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ICP-10111
9 TAPE & REEL SPECIFICATION

Figure 9. ICP-10111 Tape Dimensions

Figure 10. ICP-10111 Tape and Reel Drawing

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ICP-10111
10 ORDERING GUIDEPARTTEMP RANGEPACKAGE BODY

PACKAGE LID

QUANTITY

PACKAGING

ICP-10111†−40°C to +85°C

2x2.5x0.92mm LGA-8L

1-Hole10,00013” Tape and Reel

†Denotes RoHS and Green-Compliant Package

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ICP-10111
11 REFERENCES
Please refer to “InvenSense MEMS Handling Application Note (AN-IVS-0002A-00)” for the following information:• Manufacturing Recommendationso Assembly Guidelines and Recommendationso PCB Design Guidelines and Recommendationso MEMS Handling Instructionso ESD Considerations
o Reflow Specificationo Storage Specificationso Package Marking Specificationo Reel & Pizza Box Labelo Packaging
o Representative Shipping Carton Label• Complianceo Environmental Complianceo DRC Complianceo Compliance Declaration Disclaimer

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ICP-10111
12 REVISION HISTORY
Revision Date

Revision

Description

01/11/2017

0.1

Initial Release

01/17/2017

0.2

Updated Sections 6, 7

10/02/2020

1.0

Updated all sections

10/07/2020

1.1

Updated document title

04/06/2021

1.2

Updated Long-Term Drift specification (Table 3).

05/03/2021

1.3

Added MSL information (Cover Page); Added Tape & Reel Specification (Section 9).

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ICP-10111

This information furnished by InvenSense, Inc. (“InvenSense”) is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use,or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. InvenSense reserves
the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice. InvenSense makes
no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no responsibility for any
claims or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited to,claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or otherwise under any
patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are theproperty of their respective companies. InvenSense sensors should not be used or sold in the development, storage, production or utilization of any conventional or
mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment.
©2021 InvenSense. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, DMP, AAR, and the InvenSense
logo are trademarks of InvenSense, Inc. The TDK logo is a trademark of TDK Corporation. Other company and product names may be trademarks of the respective
companies with which they are associated.

©2021 InvenSense. All rights reserved.

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