VDL Groep & VDL ETG
Strength through cooperation

Introduction

ContentGeneral presentation VDL Groep & VDL ETG

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VDL Groep

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VDL ETG & Locations

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VDL ETG Examples Customer Projects

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VDL ETG Competence Projects

Introduction to VDL Enabling Technologies Group - Company Confidential

VDL GroepFacts & figures
31 December 2018

104 COMPANIESSPREAD ACROSS

20 COUNTRIESTURNOVER€ 5.97 BILLIONPROFIT€ 178 MILLION
16,854 EMPLOYEES

83% EXPORTto 111 COUNTRIESCOMPANY ACTIVITIESDIVIDED AMONG 4 DIVISIONSSTRONG BALANCE SHEET POSITIONSOLVENCY 55%
1,355,000 M²
PRODUCTION SURFACE AREA

2019 (first 6 months)
TO: € 2.9 Billion - Profit: € 76 Million
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Strategy

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Diversity in markets & products

Controlled growth

Strongfinancial position

Global production

VDL Groep is and always will bea family company

Investment& innovation

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Board of Management
President & CEO

Willemvan der Leegte

Executive Vice Presidents
Mr. Wim van der Leegte
was the President & CEO for 50 years.
He retired in 2016.
JanMooren

TheoToussaintPietervan der Leegte

Jennifervan der Leegte

Paul
van Vroonhoven

EdwinWillems

HenkCoppens

Senior Vice Presidents

RémiHenkemans

6HenriKoolenBasvan der Leegte

Jos
van Meijl

Guustaaf
Savenije

Jos
Bax

Introduction to VDL Enabling Technologies Group - Company ConfidentialMarc
van Doorn

Rolf-Jan
Zweep

Paul
van Vuuren

VDL Groep wins Dutch Innovation Award 2019
VDL Groep is the first family owned company within the top 30 ranking of companies with highest R&D investments

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Divisions

Subcontracting

8Car assembly

Buses & coaches

Introduction to VDL Enabling Technologies Group - Company Confidential

Finished products

Subcontracting

Metalworking

9Mechatronic systems
and system supply

Plastics processing

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Surface treatment

VDL ETG is part of the sub-contracting divisionsub-contracting
mechatronic systems
module assemblypart and sheet metal
surface treatments
plastic processing

bus group
touring cars
public transport bus
mini and midi busses
chassis modules
second hand tradefinished products
process installationsconsumer products
production automationtransport handlingvarious products-VDL ETG

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VDL ETG
ETG = Enabling Technologies Group•••••Tier-1 contract manufacturer
System integrator of complex mechatronic (sub) systems and modules
Typical customers: OEMs in the high-tech capital equipment industry
System supplier covering the value chain from (co-) engineering through parts production, assembly and system qualification
Locations in Europe, Asia and USA

VDL ETG is a turn-key supplier with design capability

DesignMachining
Joining
Cleaning &Conditioning
Assembly
Qualification

Packaging

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VDL ETG history

1900 Philips Machine Fabrieken

1980 Also Non-Philips Customers
1990 Integrated Systems
2000 New name: Philips ETG

2006 ETG part of VDL Groep

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VDL ETG facts & figures
7 FACTORIES(+ 2 Development Groups)

SPREAD ACROSS

3 CONTINENTSREVENUE± 1B$± 3000 EMPLOYEES
50% EXPORTCOMPANY ACTIVITIESDIVIDED AMONG 6 MARKETSSTRONG BALANCE SHEET POSITIONSOLVENCY 54%250,000 M²
PRODUCTION SURFACE AREA

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VDL ETG structure & manufacturing sites worldwide

VDL ETG

Employees ± 3000

T&D*EindhovenPrecision:

Projects:

Eindhoven

Eindhoven> 100 Years

AlmeloSuisseSuzhou

Singapore> 70 Years> 30 Years> 45 Years*Technology & Development = Global Development & Engineering Department
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VDL ETG locations worldwide
VDL ETG Eindhoven
VDL ETG Precision
VDL ETG Projects
VDL ETG T&DEindhoven NL

MilpitasAlmelo NL

HengeloSuzhou PRC

BostonSingapore

Manufacturing
Design/Engineering
Business Development/Sales

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Trübbach CH

VDL ETG development & engineering
A versatile point of entry to the VDL ETG Group Types of engagement: Design-to-spec of modules and total equipment

 Early supplier involvement on design for X
 Product lifecycle management and sustaining Roadmap research & development of specific expertise Approximately 400 design engineers in 4 locations
 A systems approach in multidisciplinary teams
 Well networked to universities and other knowledge institutes
 Fellow assignments and joint research programs

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VDL ETG cost optimization opportunities
Phase I-Project transfer• 100% use original supplier• Labor hour saving• Transportation cost saving• Lead time reduction

30% cost reductionin 6 months aftertransfer

Phase II-localization• In-house make parts• Utilize supply chain tolocalize components
together with customer• (Re-)design for cost experience• Global footprint will support relocation (local for local)• VDL size → buying power
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Phase III-Redesign engineering• Smart redesignengineering to achieve
further cost down

VDL ETG has required certificates

ISO 9001

ISO 13485

EN 9100

ISO 3834

ISO 14001

Including Engineering,Manufacturing and Supply
chain Management – forhigh precision component
and modules, machines andequipment

Including Engineering,
Manufacturing and Supply
chain Management – forequipment, sub-assemblies
and high precision parts for
medical related industries

Manufacturer of highprecision mechanicalcomponents for
assemblies andsubassemblies inAviation, Space, Defence
and other technicalindustries.

International institute ofwelding. For the product(s)vacuum chambers,
complex machine framesand structures for medicaldevices

Environmental Management
System19

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Embassy of Japan & JETRO visit to VDL ETG

JETROYoshitoku TAKAHASHI
Executive Director

Embassy of Japan in The Netherlands
Yoshiko KIJIMAMinister
Masahiro YAMAGA
Second Secretary Economic Division

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Examples Customer Projects
Semiconductor Equipment

From sketch to design to (volume) manufacturing
Moving up the value chain: Build to Print (B2P) to Build to Spec (B2S)

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Increasing responsibility and development scope
Trust based on know-how of people, development process and intermediate results

And the transferchamber?

Can you design
the opticalcolumn?

Can you design
a vacuum loadlock?
(with << 1 ppwpof 0.1 µm…)

Sure!

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With someinnovative
optics?

Can you then also
design the processchamber?

Sure!

Introduction to VDL Enabling Technologies Group - Company Confidential

Sure!

Frames
High-tech structures
 Structural dynamics
 Seismic
 Stability
 Acoustics
 Changing loads
 Thermal
 Advanced machining

 Kinematic interfaces
 Tolerances
Vacuum chamber for EUV plasma source Cost24

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Frames: enclosures

Acoustic enclosures
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Semiconductor EFEM

Semiconductor process system

Introduction to VDL Enabling Technologies Group - Company ConfidentialPositioning
Ultimate control
 Motion control
 Machine control
 Reliability
 Contamination Control Tribology
 Actuators
 CostCoil assembly for planar motor

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Introduction to VDL Enabling Technologies Group - Company ConfidentialPositioning: electromagnetic modules
 Design and production
 Functional qualification and lifetime testing High power density, high magnetic uniformity, in-vacuum electromagnetics

 Coil winding, permanent magnet assembly and qualification
 Vacuum potting, vacuum leak tight (laser welding, 3D printing) Thermal control: integrated water cooling and thermal sensors

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Handling
Ultimate control
 Motion control
 Machine logistics
 Reliability
 Contamination control Tribology
 Robots Load locks

 Diagnostics
 CostAtmospheric wafer handler unit

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Vacuum & beam
Cleanliness & high voltage
 Ultra-precision machining Brazing Diffusion bonding RF High-voltage
 Electro-magnetics
 Shielding Contamination control

SwissFEL cavity coupled linac accelerator

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Competence Projects
Semiconductor Equipment

Semiconductor key applications
 Patterning photolithography and etching Metrology: review, inspection critical dimension, overlay, thin film properties
 Deposition: chemical vapor deposition (CVD), epitaxy, ion-implant, physical vapor deposition (PVD),
atomic layer (ALD) Rapid thermal processing (RTP) Substrate positioning and handling: wafer stages, wafer handlers, frames, loadlocks, transfer chambers,
e-beam-columns

Typical modules: vacuum chambers, e-beam columns, e-beam sources, magnet systems,
sample stage and handling

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Road mapping – customer, topic specific
Semiconductor segment

Moore

More-than-Moore

allowable thermalgradients ↓better robot

robot alternatives

powerdissipation ↑more dense
cooling channels

additive manufacturing

structuraldynamics ↑droplet cooling

contamination control

moving mass ↓air flow analysis

ProductivityNew technologies

Generic trends

trends32

uptime ↑MTTR ↓plasma technologies

allowable
contamination ↓plasma cleaning

mK thermal measurement

total cost ↓field data analysis

allowable
charge ↓system availability models

challenges

solutionsIntroduction to VDL Enabling Technologies Group - Company Confidential

programs

Particle Source Analysis
Particle Distribution analysis of wear particles on critical surface

Asperity Fracture (Future)

Contact Mechanics FEM based

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Contact Dynamics

Particle Source Testing
Tribology Testing (Pin-on-Disk, Nano-scratch/indentation)

In Vacuum released Particles Testing

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Atmospheric airborne Particles Testing

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MagLev Stage examples
Other requirements for MagLev concept

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FASTNIMS

Laser Cutter

C-stage

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Competence projects
Analytical Equipment

Vacuum seal particle test setup

Analytical equipment – our focus
 Mass spectrometer XRD and XRF power diffusion
 TEM
Focal areas: contamination control, vacuum, electric field, magnetic field, mechanical positioning

Typical modules: vacuum chambers, e-beam columns, e-beam sources, magnet systems,
sample stage and handling

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Road mapping – customer, topic specificAnalytical segment
Resolution ↑Smart stages

Stages alternatives(Bio-) Tissue
engineering

Structuraldynamics ↑Modular designs

System design

Higher Resolution

More Robotics /Automation ↑Productivity

Nano-structures
engineering

Generic trends

trends38

Vacuum technology

Accurate
Mechanics ↑Ceramics

Conditioning

Samplemanagement ↑(material)coatings

Motion control program

uptime ↑Vacuumoptimized designs

mK thermal measurement
AM manufacturing(Ceramics)

total cost ↓Thermal stability↑

AM designs

challenges

solutionsIntroduction to VDL Enabling Technologies Group - Company Confidential

system availability models
programs

Controlling the environment of the charged particle beam
manufacturing

integration& testingphysics

contamination
controlcleaning

function

electrongunvacuumdeflector/
corrrectormaterials

machining/joininghigh voltage(insulation)discharges

surfacecharge

electric
field

condenser
lenschargedparticle pathmaterial
treatmentmaterial
properties

magneticfield

precisionalignment

objective
lensfiltermechanicalpositionmechanicaltolerances

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temperature
controlmechanicaldeformation

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detector

Prevent contamination – categories
 Molecular Organic cooling fluids, greases, finger prints, glues
 Partial pressures less than 1·10-11 mbar CxHy, H2O, O2
 Ionic
 In-organic water soluble residues of e.g. cleaning processes
 Order 1012 atoms per cm2 F, Cl, NO2, Br, NO3, PO4, SO4, ...
 Particle

 Environmental particle fall out, caused by e.g. milling, human activity, contacts
 Particle size down to 50 nm

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Realize vacuum
Vacuum requirement

Specification[ mbar .L/s]

Permeation
O-ringDesignDiameter & lengthO-ringTotal gas load

Outgassing
VesselSurface area,
Total gas Material
load
selection,roughness , …
Trapped volumes,
Cleaning, …

 Cleanliness, Mechanics, Surfaces, Sealing

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Outgassing
Total gas loadModule …

Introduction to VDL Enabling Technologies Group - Company Confidential

Realize electric fields, without discharges

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Realize magnet fields and provide shielding For magnetic shielding of a charged particle beam often an expensive HyMu material is used
 Reduction of HyMu material leads to cost reduction.

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Validate modeling with measurements
 Simulations are carried out with external magnetic fields to determine the magnetic field on the optical axis.

Flux density distribution
Helmholtz coilelectrongundeflector/corrrector

condenser
lensShielding factor
objectivelensfilter

External field in X &Y-direction
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detector

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Mechanical positioning and alignment
Accelerator technology
 Ultra high precision machining Shape accuracy typically < 1 μm
 Surface roughness typically < 25 nm

 Optical mirror finish without polishing Milling and grinding ceramics, EDM, Brazing
 Reduction of high-voltage breakdown rate due to low
surface roughness
 UHV (< 10-9 mbar) compatibility

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Column Experience
Manufacturing expertise

Vacuum seal particle test setup

Design for Manufacturability / co-design electron optics lens system

 Tolerance analysis
 Design for manufacturability (Parts-NPI-T&D)
 Direct feedback from integration and testing47

Introduction to VDL Enabling Technologies Group - Company Confidential

Electron guns Electron gun is customer core competence No complete gun manufacturing , gun parts for various customers. (housings, lenses,extractors, suppressors, anodes ) We are familiar with operation of SFEG guns on our column test stands. (50pA-3nA @12kV)

LAB6 filament for
6 mA beam for X
ray generation

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Magnetic lenses

 Winding of coils(picture source internet)

 Experience in potting coils, welded coil housings in vacuum Objective lens SEM: pole pieces, cobalt iron core, nickel iron outer pole. Pieces machinedpaired for best concentricity & parallelism, surface finish 32µ”

 Magnetic annealing of outer pole, (vacuum vs hydrogen annealing) ‘tickling’ after magnetic
annealing for ultimate shape/concentricity. Electro less nickel plating
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Electrostatic lenses

 Condenser lenses
 Accelerators
 Wehnelt’s (several customers) Pole pieces
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Deflectors

 Quadrupoles Octopoles Dodecapoles.

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Filters & correctors

 TEM filter
 Mono-chromator Electrostatic corrector
 Mini column

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In-house ‘special’ manufacturing processes Machining Materials

 Ultra-High Precision Turning Ceramics (isolators)

 Fly cutting ( 5 axis, non Ferro, mirror finish) Wire EDM, micro sink EDM (ELID assisted) Laser cutting / welding.

 Conductive coatings

 Precision alignment (rotary) Vacuum / Cleanliness Joining Leak check, bake-out, RGA, GCMS

 Brazing (accelerator tube) Glueing (etching, plasma cleaning, UV-ozoneactivation)
 Micro-TIG welding (bellows) Crimping (no glue, no screws, nobrazing/soldering)
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Ultra-high precision machining Single Point Diamond Turning• Form accuracies < 0.1 µm• Surface finish better than 5 nm Ra• 2/3 axis and freeform capabilities Milling••••

Form accuracies < 1 µm
Surface finish better than 25 nm Ra
Up to 5-axis capabilities
Pallet machining of (sub)micron accuracy parts

 EDM• Wire-EDM (µm-accuracy and Ra 0.1)
• Sink EDM• Micro EDM (holes as small as 20 µm)
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Welding & brazing of precision parts/modules
 Welding technology• TIG/MIG• Laser beam
• E-beam

Bonding testunder Argon atmosphere
Hydrogen bonding in near future Brazing Bonding Glueing Potting

CERN EDMS Nr. 1182511 : No discontinuities and presence of crossing grains in all
the bonding planes means good bonding.

Brazing assembly(SCP / AgCu / AuCu)
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Cleaning / inspection / bake-out / RGA (ISO 6)

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Introduction to VDL Enabling Technologies Group - Company ConfidentialPrecision alignment
 Measurement equipment for alignment electron gun parts in flow bench (class 100: ISO 5), inclean room (class 1000: ISO 6)

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Integration & testing58

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Thank You