AN-IVS-0002A-00

MEMS Motion Handling and Assembly
Guide

InvenSense, Inc. reserves the right to change
specifications and information herein without
notice unless the product is in mass production
and the application note has been designated by
InvenSense in writing as subject to a specified
Product / Process Change Notification Method
regulation.

InvenSense, a TDK Group Company
1745 Technology Drive, San Jose, CA 95110 U.S.A+1(408) 988–7339
invensense.tdk.com

Document Number: AN-IVS-0002A-00
Revision: 4.4
Date: 01/24/2024

TABLE OF CONTENTS
1Purpose and scope.................................................................................................................................................32

Document Obsolescence Notice ............................................................................................................................33Revision History .....................................................................................................................................................4Document Number: AN-IVS-0002A-00
Revision: 4.4

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1 PURPOSE AND SCOPE
This document provides general information and reference guidelines for handling and assembling TDK InvenSense
Micro Electro-Mechanical Systems (MEMS) motion sensors. Design rules and soldering recommendations includedin this document represent the best practices to achieve a high level of performance in terms of accuracy and stability.

2 DOCUMENT OBSOLESCENCE NOTICEStarting from the date of the present revision (4.4), this document is deprecated and superseded by:“AN-000393: IMU PCB Design and MEMS Assembly Guidelines for ICM/IAM/IIM-4xxxx, 2xxxx and MPU-6xxx
Products”.

Document Number: AN-IVS-0002A-00
Revision: 4.4

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3 REVISION HISTORY
Revision Date
10/16/2013

Revision
1.0

Description
Initial Release

01/13/2014
02/11/14
05/29/14

2.0
2.1
2.2

07/07/14

2.3

Revised sections 3.1.5, 3.3, 3.7, 3.8, 3.9, and 3.11.
Modified document format and updated shipping label.
Added tape and reel handling guidelines, updated 3x3mm tape and reel spec, updated
packaging section for reels
Revised 3x3mm tape and reel spec to add tolerances

11/06/14
11/17/2014

2.4
2.5

Added section on PCB Mounting Optical Inspection section
Updated Storage Specifications

12/04/2014
02/19/2015
03/01/2016

2.6
2.7
2.8

Updated carrier pocket (Ao, Bo) tolerances to +/-0.05mm.
Added storage specification back in. Added tape and reel spec 3x3x1.25mm.
Added pizza box 2D label example picture.

05/03/2016

2.905/26/2016
11/08/2016

3.0
3.1

Added 2 type 3x3 top marking example.
Updated the front/end empty pocket quantity from 550ea to 50ea for all package types.
Change the front/end empty pocket quantity from 50ea back to 550ea
Added the 2.5x3 tape and reel specifications.

11/09/2016
01/06/2017
07/27/2017

3.2
3.3
3.4

Formatting update
Added the new tape and reel specifications for 2.5x3 Tape Dimensions TYPE II
Updated the tape and reel specification 2.5x3 Tape Dimensions TYPE I

04/17/2018
11/06/2018

3.5
3.6

11/13/2018

3.7

12/19/2018

3.8

Updated the manufacturing recommendations section
1.Adjust PACKAGE MARKING SPECIFICATION of 3x3 to TYPE I~III (Figure 5~7)
2.Add PACKAGE MARKING SPECIFICATION of 2.5x 3 (Figure 9)
3. Remove special marking requirement of special code table 3~4.
4. Combine and revise 3x3 Tape Dimensions for package height 0.9 and 1.0. (Figure 11)
5. Revise Improved Packing (Figure 21.)
6. Add MSL1 label (Figure22)
1.Tabel 3. Add 2.5x3 information
2.Remove product name from this document as general guide
Remove Component Placement Pressure and Pick-and-Place Velocity/Mounter Force

06/14/2019

3.9

10/14/2019

4.0

03/31/2020

4.1

12/01/2020
03/11/2021
01/24/2024

4.2
4.34.4Document Number: AN-IVS-0002A-00
Revision: 4.4

Added package 4.5 x 4.5 x 1.1. Updated mounting recommendations. Added MSL handlingconditions
1. Added the MSL details
2. Added MSL 5 label
Updated PCB design section: no solder musk below the component, die pad must be left
unconnected. Updated soldering recommendation: TDK InvenSense strongly recommend
not to place solder mask below the MEMS component. Updated Figure 4
Updated ESD Considerations
Updated PCB Design and Solder Paste Printing to guarantee proper QFN 4.5 x 4.5 mm2flanks wettability
Updated description of shock tolerance
Updated Figure 24 &32 label logo
Updated pick and place details and MEMS handling instructions section.
Document Superseding

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This information furnished by InvenSense or its affiliates (“TDK InvenSense”) is believed to be accurate and reliable. However, no responsibility
is assumed by TDK InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use.
Specifications are subject to change without notice. TDK InvenSense reserves the right to make changes to this product, including its circuits
and software, in order to improve its design and/or performance, without prior notice. TDK InvenSense makes no warranties, neither expressed
nor implied, regarding the information and specifications contained in this document. TDK InvenSense assumes no responsibility for any claims
or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes, but is
not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication orotherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied.
Trademarks that are registered trademarks are the property of their respective companies. TDK InvenSense sensors should not be used or soldin the development, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or lifethreatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear
instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment.
©2013—2024 InvenSense. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps,DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. The TDK logo is a trademark of TDK Corporation. Other company andproduct names may be trademarks of the respective companies with which they are associated.

©2013—2024 InvenSense. All rights reserved.

Document Number: AN-IVS-0002A-00
Revision: 4.4

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