AN-000232

EV_MOD_CH201 Evaluation Module User Guide

Chirp Microsystems reserves the right to change
specifications and information herein without notice.

Chirp Microsystems
2560 Ninth Street, Ste 200, Berkeley, CA 94710 U.S.A+1(510) 640–8155
www.chirpmicro.com

Document Number: AN-000232
Revision: 1.0
Release Date: 08/18/2020

AN-000232
TABLE OF CONTENTS
1

Scope and Purpose............................................................................................................................................................................. 3

2

EV_MOD_CH201 Evaluation Module Board ...................................................................................................................................... 4
2.1
2.2
2.3
2.4

3

Pin Assignments ......................................................................................................................................................................... 4
Electrical Specifications .............................................................................................................................................................. 4
Schematic ................................................................................................................................................................................... 4Bill of Materials .......................................................................................................................................................................... 5

Configuration, Programming, and Operation .................................................................................................................................... 63.1
3.2

Configuration and Programming................................................................................................................................................ 6Operation ................................................................................................................................................................................... 6

4Mechanical Specifications .................................................................................................................................................................. 75

Beam Patterns.................................................................................................................................................................................... 85.1
5.2

6Beam Patterns............................................................................................................................................................................ 8
Enclosure Mounting ................................................................................................................................................................... 8

Revision History ................................................................................................................................................................................. 9

LIST OF FIGURESFigure 1. EV_MOD_CH201 Evaluation Module .......................................................................................................................................... 3
Figure 2. EV_MOD_CH201 Schematic ........................................................................................................................................................ 4
Figure 3. EV_MOD_CH201 Module Connection (EV_MOD_CH201 acoustic port is facing down) ............................................................ 5
Figure 4. Dimensions of the EV_MOD_CH201 assembly ........................................................................................................................... 7
Figure 5. Representative beam pattern measurements of module (raw linear LSB units left, normalized dB right) ................................ 8

LIST OF TABLESTable 1. EV_MOD_CH201 ZIF Connector Pin-Out ...................................................................................................................................... 4
Table 2. Recommended Flat Flex Cable and Connector ............................................................................................................................ 5
Table 3. Bill of Material .............................................................................................................................................................................. 5
Table 4. Geometric Dimensions for EV_MOD_CH201 ............................................................................................................................... 7

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AN-000232
1 SCOPE AND PURPOSE
This document details the specification, programming and operation of an EV_MOD_CH201-00-01 (referred to as the EV_MOD_CH201
in the remainder of this document) ultrasonic sensor evaluation module. This module board incorporates a CH201 Ultrasonic Sensor
device with a 45° FoV acoustic housing assembly, a capacitor and an FFC connector.

Figure 1. EV_MOD_CH201 Evaluation Module

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2 EV_MOD_CH201 EVALUATION MODULE BOARD
2.1

PIN ASSIGNMENTS
PIN
12345678NAME
INTSCLSDAPROGRESET_N
VSS
VSS
VDD

DESCRIPTIONInterrupt output. Can be switched to input for triggering and calibration functions
SCL Input. I2C clock input. This pin must be pulled up to VDD externally.
SDA Input/Output. I2C data I/O. This pin must be pulled up to VDD externally.
Program Enable. This pin must be pulled down to ground externally.
Active-low reset. This pin must be pulled up to VDD externally.
Power return.
Power return.
Power supply input. Connect to externally regulated 1.8V supply
Table 1. EV_MOD_CH201 ZIF Connector Pin-Out

2.2

ELECTRICAL SPECIFICATIONS

Please refer to DS-000379 CH201 Datasheet for information on the device’s electrical characteristics. Please note that the datasheet
covers CH201 part numbers with different suffixes. Regardless, the electrical specifications in the datasheet still apply.

2.3SCHEMATIC

Electrical connection to the EV_MOD_CH201 module is via an 8-pin 0.5 mm pitch flat flex cable (FFC) connector. Part numbers for theFFC connectors and the recommended FFC cables are shown in Table 2. The electrical schematic of the module, including the connector
pinout and the connections to the EV_MOD_CH201 sensor are shown in Figure 2. Note that the 0.1 μF decoupling capacitor, asrecommended in the CH201 datasheet, is included in the module. Consult the CH201 datasheet and application notes for additional
information on electrical connections and operation.

Figure 2. EV_MOD_CH201 Schematic

Each EV_MOD_CH201 requires its own PROG and INT lines, the remaining connections can be shared. (Refer to the CH201 datasheet
for additional information.)
Module connections using a flat flex cable (FFC) are shown in Figure 3.

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AN-000232

Figure 3. EV_MOD_CH201 Module Connection (EV_MOD_CH201 acoustic port is facing down)
FLAT CABLE CONNECTOR TYPE
RECOMMENDED FLAT CABLE

Molex 503480-0800
Molex 151660073...151660094

Table 2. Recommended Flat Flex Cable and Connector

2.4

BILL OF MATERIALSQUANTITYREFERENCE

1111PCBU1C1J1PARTPCB FOOTPRINT

MANUFACTURER

PCB
CH201-00
100n 6.3V 20% X7R 0402
Connector, FPC-FFC, 8-Pin

NACustom – 8 Pin
0402
8Pin, 0.5 mm Pitch

MANUFACTURERPART NUMBER

TDK
TDKMolex

CH201-00
CGA2B1X7R1C104K050BC
503480-0800

Table 3. Bill of Material

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AN-000232
3 CONFIGURATION, PROGRAMMING, AND OPERATION
Please refer to DS-000379 CH201 Datasheet for information on the device’s electrical characteristics.

3.1

CONFIGURATION AND PROGRAMMING

Please refer to the following documents for configuration and programming information:••

3.2

AN-000154 SmartSonic Hello Chirp Hands-On Document
AN-000175 SonicLib Programmers Guide

OPERATION

Please refer to the following documents for operating information:•••

AN-000155 CHx01 SonicLink Software Quick Start Guide
AN-000180 CH101 and CH201 SmartSonic Evaluation Kit Users Guide
AN-000227 SmartSonic Presence Detection Users Guide

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4 MECHANICAL SPECIFICATIONSDIMENSION

EV_MOD_CH201

UNIT

Acoustic port hole diameter

6mm

Maximum width

8.15mmMaximum height

8.15mmTable 4. Geometric Dimensions for EV_MOD_CH201

The outer dimensions of the EV_MOD_CH201 assembly are shown in Figure 4. The acoustic port has a diameter of 6 mm and is in thecenter of the front face. During transducer operation the port must not be blocked. The port may only be covered by a particle ingressfilter (PIF). Refer to AN-000221 CH201 Mechanical Integration Guide for information on particle ingress filers.

Figure 4. Dimensions of the EV_MOD_CH201 assembly

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5 BEAM PATTERNS
5.1

BEAM PATTERNS

Pulse-echo beam-pattern plots of the EV_MOD_CH201 module are shown in Figure 5. This beam-pattern was measured by placing a1m2 target at a 30 cm distance from the CH201 module and recording the ToF amplitude as the sensor is rotated 180°. The plots areshown in both raw LSB units and normalized dB units, where 0 dB corresponds to the peak amplitude (15000 LSB) recorded on-axis.
Chirp defines the field-of-view (FoV) as the full-width at half-maximum (FWHM) of the beam pattern; in other words, the FoV is therange of angles over which the amplitude remains above half the peak amplitude (or -6 dB). The sensor’s FoV is approximately 45°,and the pulse-echo amplitude diminishes relatively smoothly from 0° to ±22.5°.

Figure 5. Representative beam pattern measurements of module (raw linear LSB units left, normalized dB right)

5.2

ENCLOSURE MOUNTING

To ensure optimum acoustic performance, the front of the module (acoustic housing) should be flush with the enclosure’s surface.
For further detail refer to AN-000221 CH201 Mechanical Integration Guide.

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AN-000232
6 REVISION HISTORYREVISION DATE
08/18/2020

REVISION
1.0

DESCRIPTION
Initial Release

This information furnished by Chirp Microsystems, Inc. (“Chirp Microsystems”) is believed to be accurate and reliable. However, no responsibility is assumed by ChirpMicrosystems for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without
notice. Chirp Microsystems reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance,
without prior notice. Chirp Microsystems makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document.
Chirp Microsystems assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of products and services
detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual propertyrights.
Certain intellectual property owned by Chirp Microsystems and described in this document is patent protected. No license is granted by implication or otherwise under
any patent or patent rights of Chirp Microsystems. This publication supersedes and replaces all information previously supplied. Trademarks that are registeredtrademarks are the property of their respective companies. Chirp Microsystems sensors should not be used or sold in the development, storage, production or utilizationof any conventional or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as
medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime preventionequipment.
©2020 Chirp Microsystems. All rights reserved. Chirp Microsystems and the Chirp Microsystems logo are trademarks of Chirp Microsystems, Inc. The TDK logo is atrademark of TDK Corporation. Other company and product names may be trademarks of the respective companies with which they are associated.

©2020 Chirp Microsystems. All rights reserved.

Document Number: AN-000232
Revision: 1.0

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