DATASHEET

Datasheet T4078 V6
DATE: 4-Sep-19

TDK’S PRODUCT NAMEMMICT4078-00-908

TDK Corporation
SalesEngineering

Electronic Components Sales &Marketing GroupTDK ELECTRONICS AG
TEG MEMS

Sales Manager

SalesEngineering
Manager

A. Leidl

Superior

H. Hayashi

Engineering
Person in Charge

M. WinterFeatures:


Surface Mounted Technology (SMT)
Reflow soldering up to 260 °C
RoHS compatible, Ni/Au-plated terminals suited for lead free soldering
Size of 3.35 × 2.5 mm2Approximate weight of 19 mg
Sound hole on bottom side
Balanced operation
High performance mode (HM) and low power mode (LM)Very high signal to noise ratio of 66 dB(A)Wide dynamic range
Positive polarity

Applications:Microphone designed for mobile phones, headsets, PDAs, notebooks and cameras

Rev.

Date

Revised by

1

17-Apr-18

A. Schober

Initial issue

22-May-18

A. Schober

Mechanical specification updated

326-Sep-18

A. Schober

TDK product name and ordering code changed, electrical andmechanical specification updated, recommended solder stencil
layout updated

45-Feb-19

A. Schober

Product marking updated

530-Jul-19

A. Schober

Chapter 5 updated

04-Sep-19

A. Leidl

Chapter 7 updated

6RevisionNAME

DRAWING No.

DATE

REV.

PAGE

DATASHEET

T4078

4-Sep-19

62 / 15

TDK CORPORATIONTDK Technology – Proprietary and Confidential Information of TDK Group Companies

Contents
1

General description ........................................................................................ 42Marking .......................................................................................................... 4

3

Mechanical specification ................................................................................ 5

4

Electrical specification.................................................................................... 64.1

ELECTRICAL CHARACTERISTICS ....................................................................................................................... 65

Absolute maximum ratings ............................................................................ 76

Application example ...................................................................................... 77

Typical Performance Characteristics .............................................................. 88Packing material ............................................................................................. 9
8.1
8.2
8.3
8.4

9TAPE ........................................................................................................................................................ 9REEL ...................................................................................................................................................... 10
BAG AND BOX .......................................................................................................................................... 11
IDENTIFICATION LABEL (BPL) EXAMPLE......................................................................................................... 12

Assembly recommendations ........................................................................ 12
9.1
9.2
9.3
9.4

RECOMMENDED LANDING AREA................................................................................................................... 12RECOMMENDED SOLDER PASTE STENCIL LAYOUT ............................................................................................. 12
REFLOW PROFILE ...................................................................................................................................... 13
CAUTIONS AND WARNINGS ......................................................................................................................... 1310 Appendix ...................................................................................................... 14
10.1
10.2

ORDERING CODES ..................................................................................................................................... 14
ROHS COMPATIBILITY................................................................................................................................ 14

11 Legal Disclaimer ........................................................................................... 15NAME

DRAWING No.

DATE

REV.

PAGE

DATASHEET

T4078

4-Sep-19

63 / 15

TDK CORPORATIONTDK Technology – Proprietary and Confidential Information of TDK Group Companies

1 General description
The T4078 is an analog, omnidirectional MEMS microphone with internal pre-amplifier. It has positive
polarity and balanced output.

2 MarkingCharacter Area:
1st row:

Pin 1 mark

Example:E

3rd row:
Example:BlankBlank

TDKType and Revision (see below table)
4078Production ID (4 digit)
22644th row:
Example:A

Production status
Engineering Sample
MP release
Product change (PCN)0

Production ID (5 digit)
G5

Product marking“E” + Type
TypeType + PCN revision

9Example
E4078
4078
40781

NAME

DRAWING No.

DATE

REV.

PAGE

DATASHEET

T4078

4-Sep-19

64 / 15

TDK CORPORATIONTDK Technology – Proprietary and Confidential Information of TDK Group Companies

3 Mechanical specification

Pin123,456Name
OUTP
GND
KOAVDD
OUTN

Functionbalanced output ൅groundkeep out area, no structure on PCB recommended
power
balanced output െItem
LengthWidth
HeightNominal
3.35
2.5
0.98

Tolerance
±0.1
±0.1
±0.1

Note: All dimensions in mm unless otherwise statedNAME

DRAWING No.

DATE

REV.

PAGE

DATASHEET

T4078

4-Sep-19

65 / 15

TDK CORPORATIONTDK Technology – Proprietary and Confidential Information of TDK Group Companies

4 Electrical specification
4.1

Electrical characteristics

Ambient temperature of test conditions:
Output load:
Supply voltage:
All voltages refer to ground.

Supply voltage

Min.

Typ.

Max.

Unit

Note or condition

2.3

2.7

3.0V

High performance mode (HM)

1.52

1.8

1.89

V

Low power mode (LM)-39-38-37

dBV/Pa HM, 94 dB SPL-39-38-37

dBV/Pa LM, 94 dB SPL––30msWithin +/- 0.5 dB of final
sensitivity after power-on 2)–

66–dB(A)

HM, A-weighted

–

64.5

–dB(A)

LM, A-weighted

––

0.2%

HM, 94 dB SPL, 1 kHz––

0.2%

LM, 94 dB SPL, 1 kHz–0.50.85%

HM, 121 dB SPL, 1 kHz–0.51%

LM, 121 dB SPL, 1 kHz–14%

HM, 130 dB SPL, 1 kHz––135
128––PSRR1)

80
65

90
75–−dBdB

HM; 1 kHz sine wave; 200 mVpp
LM; 1 kHz sine wave; 200 mVpp

ICC––250µA

HM––85µA

LM

−250−

Ω

HM, OUTP/OUTN to GND,
1kHz

−300−

ΩLM, OUTP/OUTN to GND, 1kHz

Vdd

Sensitivity 1 kHz

S1 kHzSensitivity
settling time
Signal to noise ratio
Total harmonicSNR
THD

distortion

Acoustic Overload Point AOPPower supply rejection
ratio
Current consumption

TA = 25 ˚C
ZL = 200 kΩ
VDD = 2.7V if not otherwise noted

Output impedancedB SPL HM, 10% THD, 1kHz 2)
dB SPL LM, 10% THD, 1kHz 2)

1) PSRR=20 ∙ log VDisturb , 2) verified by design

VOUT

NAME

DRAWING No.

DATE

REV.

PAGE

DATASHEET

T4078

4-Sep-19

66 / 15

TDK CORPORATIONTDK Technology – Proprietary and Confidential Information of TDK Group Companies

5 Absolute maximum ratings
Min.

Max.

Unit

Note or condition

Operable temperature range

T-40+105°CStorage temperature range

TSTG-40+125°C

TSTGT

0+60°C

VDD

1.523.60V1)

VAny pin
Any pinOperable Power supply voltage
ESD capability MM

VESD_MM–200

ESD capability HBM

VESD_HBM–2000 2)V–

10,000g

Mechanical Shockstored in tape1)

According to JESD22-A115A.
According to JESD22-A114E.
Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device.
These are stress ratings only and functional operation of the device at these conditions is not implied.
Exposure to the absolute maximum ratings conditions for extended periods may affect devicereliability.

2)

6 Application example

CLN, CLP, CL: Optional EMI capacitors; maximum value 150pF.
RL: Output load impedance; minimum value 25 kΩ

NAME

DRAWING No.

DATE

REV.

PAGE

DATASHEET

T4078

4-Sep-19

67 / 15

TDK CORPORATIONTDK Technology – Proprietary and Confidential Information of TDK Group Companies

7 Typical Performance Characteristics

Typical Frequency Response (Measured)

THD + N vs. Input Amplitude

Power-Supply Rejection Ratio vs. Frequency

LinearityNAMEDRAWING No.

DATE

REV.

PAGE

DATASHEET

T4078

4-Sep-19

68 / 15

TDK CORPORATIONTDK Technology – Proprietary and Confidential Information of TDK Group Companies

8 Packing material
8.1

Tape

A0

2.70±0.05 mm

K01.20±0.1 mm

B0

3.55±0.05 mm

P1

4.00±0.1 mm

E2min 6.25 mm

W

Ø8.00-0.10 mm

F

3.50±0.05 mm

Gmin 0.75 mm+0.30

Notes:(I) Measured from centerline of sprocket hole to centerline of pocket.
(II) Cumulative tolerance of 10 sprocket holes is ± 0.20.
(III) Measured from centerline of sprocket hole to centerline of pocket.
Orientation of devices in tape:NAME

DRAWING No.

DATEREV.

PAGEDATASHEET

T4078

4-Sep-19

69 / 15

TDK CORPORATIONTDK Technology – Proprietary and Confidential Information of TDK Group Companies

8.2Reel

8.2.1

330mm Reel

Note: All dimensions in mm unless otherwise statedNAME

DRAWING No.

DATE

REV.

PAGE

DATASHEET

T4078

4-Sep-19

610 / 15

TDK CORPORATIONTDK Technology – Proprietary and Confidential Information of TDK Group Companies

8.3

Bag and Box

Reel Size
330 mmWidth B
338 mmLength L335 mm

Height H
36 mm

NAMEDRAWING No.

DATE

REV.

PAGE

DATASHEET

T4078

4-Sep-19

611 / 15

TDK CORPORATIONTDK Technology – Proprietary and Confidential Information of TDK Group Companies

8.4

Identification Label (BPL) Example

9 Assembly recommendations
9.1

Recommended landing area

9.2

Recommended solder paste stencil layout

Note: All dimensions in mm unless otherwise statedNAME

DRAWING No.

DATEREV.

PAGEDATASHEET

T4078

4-Sep-19

612 / 15

TDK CORPORATIONTDK Technology – Proprietary and Confidential Information of TDK Group Companies

9.3

Reflow profile
280240temperature (°C)

20016012080max. recomm. temp
reflow solderingmin. temp
for wetting

400060120180240300

360

420

time (sec)ParameterCondition

Ramp rate≤ 3 K/s

Preheat125°C to 220°C, 150 s to 210 s, 0.4 K/s to 1.0 K/s

T > 220°C

30 s to 70 s

T > 230°C

Min. 10 s

T > 245°C

Max. 20 s

T ≥ 255°C−Peak temperature Tpeak

250°C +0/-5°C

Wetting temperature Tmin

230°C +5/-0°C for 10 s ± 1 s

Cooling rate

≤ 3 K/s

Soldering temperature TMeasured at solder pads

9.4Cautions and warnings
Vacuum on the bottom side of a device with a sound inlet hole has to be avoided
Compressed air and liquid cleaners should not be used around the area of the sound inlet hole
The sound inlet hole must not be covered with solder
The maximum number of reflows should not exceed threeNAME

DRAWING No.

DATE

REV.

PAGE

DATASHEET

T4078

4-Sep-19

613 / 15

TDK CORPORATIONTDK Technology – Proprietary and Confidential Information of TDK Group Companies

10 Appendix
10.1 Ordering codes
Ordering code

Packing units

Reel size

MMICT4078-00-908

9000 pcs

330 mm10.2 RoHS compatibility
ROHS-compatible means that products are compatible with the requirements according to Art. 4(substance restrictions) of Directive 2011/65/EU of the European Parliament and of the Council ofJune 8th, 2011, on the restriction of the use of certain hazardous substances in electrical andelectronic equipment ("Directive") with due regard to the application of exemptions as per Annex III of
the Directive in certain cases.

NAME

DRAWING No.

DATEREV.

PAGEDATASHEET

T4078

4-Sep-19

614 / 15

TDK CORPORATIONTDK Technology – Proprietary and Confidential Information of TDK Group Companies11 Legal Disclaimer
The products listed on this specification sheet are intended for use in general electronic equipment(AV equipment, telecommunications equipment, home appliances, amusement equipment, computerequipment, personal equipment, office equipment, measurement equipment, industrial robots) under anormal operation and use condition.
The products are not designed or warranted to meet the requirements of the applications listed below,
whose performance and/or quality require a more stringent level of safety or reliability, or whosefailure, malfunction or trouble could cause serious damage to society, person or property. Please
understand that we are not responsible for any damage or liability caused by use of the products inany of the applications below or for any other use exceeding the range or conditions set forth in thisspecification sheet.
Aerospace/Aviation equipment
Transportation equipment (cars, electric trains, ships, etc.)
Medical equipment
Power-generation control equipment
Atomic energy-related equipment
Seabed equipment
Transportation control equipment
Public information-processing equipment
Military equipment
Electric heating apparatus, burning equipment
Disaster prevention/crime prevention equipment
Safety equipment
Other applications that are not considered general-purpose applications
When using this product in general-purpose applications, you are kindly requested to take into
consideration securing protection circuit/equipment or providing backup circuits, etc., to ensure highersafety.

NAME

DRAWING No.

DATEREV.

PAGEDATASHEET

T4078

4-Sep-19

615 / 15

TDK CORPORATIONTDK Technology – Proprietary and Confidential Information of TDK Group Companies