ZEISS Xradia Versa 3D X-ray Microscope
Accelerate Failure Analysis and Process Development
for Next-generation Electronics
zeiss.com/xrm

Accelerate Failure Analysis and Process Development
for Next-generation Electronics

Advances in electronics and semiconductor packaging are fueled by consumer demands for greater
bandwidth and lower cost in response to market trends of 5G, AI, big data, and autonomous vehicles.
The growing adoption of advanced packages to increase the interconnect density results in complex
package architectures, new manufacturing challenges, and risks of failures. Furthermore, since thephysical fault region is often buried within these complex 3D architectures, conventional methods
for visualizing failure locations are becoming less effective. New techniques are required to isolate
and determine the root cause of failures whether they occur in packages, batteries, or otherelectronic components.
ZEISS Xradia Versa 3D X-ray microscopes (XRM) are an effective solution for non-destructive
visualization and characterization of submicron defects buried within intact 3D packages.
Highest Resolution and Imaging Quality for the Broadest Range of Applications
Xradia Versa has become the industry standard for non-destructive 3D imaging failure analysis and device characterization.
The unique detector design of Versa provide high resolution even for large working distances, enabling analysis of intact samples
in a broad range of applications.
• Perform structural and failure
analysis for process development, 		yield improvement, and construction
analysis of electronic components, 		Cracks100 µmconsumer devices, and 2.5/3D andPCB and substrates

CracksBattery module (Scout-and-Zoom)

Broken vias

other advanced semiconductor 		
packages.
Gyroscope• Non-destructively image fully intact
samples with submicron resolution

10 mm1 mm

for characterization of defects
faster than conventional physicalcross sectioning.

Flip Chip - Level 1
PoP - Level 1

Ball Grid Array - Level 2

Ball Grid Array - Level 2

Camera lens assembly

600 µm• Capture insights about defect100 µmlocations and their distribution by 		viewing unlimited virtual crosssections from any desired angle 		throughout an entire 3D volume.

100 µmLevel 2 interconnect

Level 2 interconnect with void

TSV voids

Bump cracks

Solder bump non wet

Versa XRM 3D images and virtual cross sections of defects deeply buried in a smartphones.

2

X-ray Microscopy Enables Highest Resolution with Fast Data AcquisitionZEISS Xradia Versa 3D XRM use uniquely

Xradia Versa extends the boundaries

designed and patented X-ray detectorsof 3D submicron-resolution imaging.

and microscope objectives to provide

It enables fast data acquisition while

500 nm spatial resolution with minimum

maintaining resolution across the fullachievable voxels of 40 nm.

energy and power range. With fastZEISS Xradia Versa

source activation, high spatial resolution,
Xradia Versa detector technology usesand enhanced contrast-to-noise ratio,

optical magnification combined with

Xradia Versa excels in structural andgeometric magnification to achieve

failure analysis, process development,

unparalleled resolution even for large

yield improvement, and construction

intact samples. This patented two-stage

analysis. In addition, the stable,

magnification technique enables highlong-life source enables maximum

Resolution at a Distance (RaaD) which

uptime, consistent and optimized

Xradia Versa achieves highest resolution while

is required for imaging large samples.

image quality, and high success rates

maintaining fast scan times.

for defect visualization.

Detectors

SampleSourceba

Optical Magniﬁcation

Geometric Magniﬁcation = ( a + b ) / aXradia Versa scintillator-coupled optical detectors enable high resolution and contrast at long working distances.

Optional
phase ring

Detector:
scintillator coupled
optical objective

SampleSource3

Equipped with Flexible Application Modules

ZEISS Xradia Versa expands its industry-leading performance with optional modules for advanced
reconstruction and inspection and measurement.
Advanced Reconstruction Solutions
ZEISS Advanced Reconstruction Toolbox includes two reconstructions solutions – ZEISS DeepRecon Pro and ZEISS OptiRecon. Thesesolutions improve scan speed and image quality for the diverse range of sample types commonly found in electronics packaging.
ZEISS DeepRecon Pro Module
ZEISS DeepRecon Pro implements a newStandard ReconstructionZEISS DeepRecon Pro

deep-learning reconstruction technology
powered by artificial intelligence (AI).
DeepRecon Pro enables up to 4X fasterscans while preserving ZEISS’s unique

Enhanced
CNR

image quality advantages. In addition,DeepRecon Pro delivers superior dataquality by substantially improving image
contrast-to-noise ratio and reducing theTop-down viewaliasing artifacts common in the traditional
Feldkamp-Davis-Kress (FDK) reconstruction
EnhancedCNR

method. The seamlessly integrated one-click
network training solution allows user togenerate deep-learning network models
without the need for a machine-learning
expert. Users can build their own networkmodel library (with unlimited numberof network models) to fit a broad range

300 projections
Scan time: 30 minutesof workflows used in electronics failure
analysis and packaging processdevelopment.

100 µm

X-sectional view

300 projections
Scan time: 30 minutesDeepRecon Pro for electronics failure analysis workflows: Superior image quality for electronics packages.

Standard Reconstruction

OptiRecon

ZEISS OptiRecon Module
ZEISS OptiRecon enables significantly
faster 3D X-ray image acquisition throughan image reconstruction algorithm known
as iterative reconstruction. OptiRecon
provides up to 2X faster scan times,
boosts productivity and image quality, and500 µm

500 µmaids faster understanding of processes anddefects. It is well-suited for failure analysis
and development across a wide variety ofelectronic and semiconductor applications.

44501 projections
24 hour scan time

2251 projections
12 hour scan time

OptiRecon improves 3D X-ray image quality and increases scan speeds by 2X on a commercial smart watch battery.

Inspection and Measurement
ZEISS Xradia Versa RepScan
RepScan is a submicron-resolution,
3D non-destructive imaging solution
for inspection and measurement that
accelerates time to market for advanced
IC packages. Using 3D XRM with
RaaD technology and sophisticatedanalytical software, RepScan provides
rich volumetric and linear measurementsof buried features in the most advanced
semiconductor packages. This cannot
be achieved with existing methods such

40 µm

as physical cross sections, 2D X-ray, andconventional microCT. RepScan generates
higher-accuracy engineering data that

Xradia Versa RepScan results show bond line thickness measurements through stacked dies for a HBM device.
3D and a virtual slice at 0.7 μm/voxel are shown on the left and right, respectively.

can be used to speed learning cycles
and reduce package development times.
RepScan includes customized sample
holders and the ZEISS Autoloader,which are also available as options for
Xradia Versa. ZEISS Autoloader reduces
the frequency of user interaction andincreases productivity by enabling
multiple jobs to run unattended.

ZEISS Autoloader option enables you to program up to 70 samples at a time to run sequentially.

5Other Electronics Applications

Lithium Ion Batteries
Full-field of view

Region of interest

4x20x

The microscopic study of lithium
batteries is essential for understanding
battery performance, aging effects,and cycling lifetime. Working withan intact battery is a requirement forevaluating electrochemical property
variations and underlying failure
mechanisms.
ZEISS Xradia Versa 3D XRM enablenon-destructive battery studies

0.4x

which reveal critical quality and safetyissues over a lifetime of charging anddischarging. This allows the user toacquire highest resolutions without
the need to disassemble the battery.
The figure shows an electronic
device battery that was imaged at
different length scales using ZEISSXRM RaaD capability.
This approach using the non-destructive
power of XRM enables:• Longevity studies of aging effects• Identification of debris, particle 		formation, burrs at the electricalcontact, or damage to the polymer
separator• Inspection of intact samples for
effective supplier control, revealingchanges in recipe or cost savings that
may affect performance or longevity

6Xradia Versa X-ray microscopy workflow on imaging and analyzing of a lithium ion battery.

Smartphone Camera Lenses
The accuracy and precision of theThe figure below shows 3D images

like lens tilt and de-centricity were

optical path in the camera lens play

obtained by Xradia Versa of a camera

extracted from the full field of view

an important role for camera module

module optical lens assembly. The high-(FFOV) image. Repeatability of <3 µm

packaging and assembly. A ZEISS Xradia

resolution image (inset) was acquired at(6 sigma) was achieved through theVersa 3D XRM workflow measures the1.5 µm /voxel to focus on the interlock

repeated measurements of lens tilt andcritical dimensions of the optical lensmechanism of lens stacking. The basic

de-center, as well as other important

assembly found in a smartphone camera

construction information such as lensassembly metrics such as lens thicknessmodule. With the unique RaaD, Xradia

thickness, gap, and 3D parametersand gap between layers.

Versa can measure critical physicaldimensions non-destructively andrepeatably, such as:• Non-destructively characterize lensassembly structures, replacing 		
physical cross sections
850 µm• High-resolution interior tomography
to visualize and examine structural 		integrity of the interfaces between
lens components• Generate tomographic dataset
for measurements: lens thickness,gap, lens tilt and de-centricity ina highly repeatable workflow

High-resolution tomography images and measurement workflow developed by Xradia Versa X-ray microscopy.

ZEISS X-ray microscopes are designed to be upgradeable with future innovations and developments so that your initial investment
is protected. This ensures your microscope’s capabilities evolve with technological advancements. New modules are continuously
developed that will enhance your instrument to provide new imaging modalities and productivity-enhancing workflows. Periodic
software releases enhance and extend the capabilities of your X-ray failure analyses.
Contact us to learn about how X-ray microscopy, related technologies, and correlated workflows withZEISS Crossbeam Laser FIB-SEM can address your challenging failure analysis needs.

7Carl Zeiss Microscopy GmbH07745 Jena, Germany
microscopy@zeiss.com
www.zeiss.com/xrm

Not for therapeutic use, treatment or medical diagnostic evidence. Not all products are available in every country. Contact your local ZEISS representative for more information.
EN_44_010_086 | CZ 08-2021 | Design, scope of delivery and technical progress subject to change without notice. | © Carl Zeiss Microscopy GmbH