3D X-ray Microscope Field Conversion and Upgrade Options
Protect Your Investment by Updating and Extending Your Capability

3D-package flip chip bumps and 25 µm-diameterCu-pillar microbumps imaged with ZEISS Xradia
620 Versa. The C4 bumps have numerous voids
at the substrate interface.

A lone 25 µm-diameter Cu-pillar microbump
with a single void is identified in a plan-view
virtual XRM cross section from the samedataset as the left image.

Overview
ZEISS X-ray microscopes are designed to be upgradeable and extendible with future innovations and developments so that yourinvestment is protected. This ensures your microscope capabilities evolve with the advancements in leading technology. This is oneof the key differentiators in the 3D X-ray imaging industry. From Xradia Context microCT, to Xradia 510/520 Versa, and now withthe addition of Xradia 610/620 Versa, you can field-convert your system to the latest X-ray microscope products. In addition toinstrument conversions at your facility, new modules that are being continuously developed will be available as field upgrades
to further enhance your instrument with advanced capabilities. Also, periodic major software releases including important newfeatures are developed and rolled out to continuously enhance and extend your ability to gain insights critical to solve problems
and advance your processes and products.

Available Field Conversions

Context microCT510 Versa

520 Versa

610 Versa

620 Versa

3D X-ray Microscope Field Conversion and Upgrade Options
Protect Your Investment by Updating and Extending Your Capability
Value of Converting Existing System to Xradia 620 Versa

Additional Field Upgrade Modules• Higher X-ray flux without loss of resolution
High power (25 W) X-ray source provides significantly higher
X-ray flux and up to 2x faster scans without compromising
resolution compared to its predecessors.

• FPX – Flat Panel Extension
Image large samples at high throughput and create workflow
efficiencies with FPX for industrial applications and research.

• Improved spatial resolution
True spatial resolution of 500 nm with a minimum achievable 		voxel size of 40 nm is achieved with Xradia 600-series Versa.
• Instant source start up and enhanced reliability
A new source control system improves source responsiveness 		
enabling faster scan setup leading to a more satisfying andengaging user experience. The source is also engineered for 		
improved reliability even at higher X-ray power.
• AFC – Automated Filter Changer
The integrated programmable automatic filter changer allows
you to select from a broad range of high and low energy filter
options to optimize image quality.
• WFM – Wide Field Mode
Wide Field Mode (WFM) provides you with either an extended 		lateral field of view for imaging large sample types or higher
resolution imaging using the standard field of view, both in asingle tomography with 0.4x and 4x objectives.
• DSCoVer – Dual Scan Contrast Visualizer
Dual Scan Contrast Visualizer (DSCoVer) provides user-tunable 		visualization, image enhancement, and segmentation using 2D 		
histograms to enable compositional probing for features
normally indistinguishable in a single scan.
• HART – High Aspect Ratio Tomography
HART provides higher throughput imaging for your flat samples
such as those found in semiconductor packages.

• Autoloader
Maximize your instrument’s utilization and increase operator 		
efficiency with Autoloader for improved sample handling.
• In situ kit and environment cells
Perform in situ and 4D (time dependent) studies fornon-destructive characterization of microstructures incontrolled environments with time.
• ORS Dragonfly Pro
Conduct extensive qualitative and quantitative analysis
with advanced 3D visualization and analysis software.
• LabDCT – Laboratory Diffraction Contrast Tomography
Conduct non-destructive 3D crystallographic mapping oforientation and microstructures with first ever laboratory-based
diffraction contrast tomography imaging module.
Please refer to the individual product/accessory flyer for more
information. For information on the latest Scout-and-Scan software
releases, please email info.pcs@zeiss.com.

3D X-ray Microscope Field Conversion and Upgrade Options
Protect Your Investment by Updating and Extending Your Capability
Imaging
Spatial Resolution [a]Resolution at a Distance (RaaD) [a,b]Minimum Achievable Voxel [c]Xradia 410 Versa
0.9 µm
1.5 µm
100 nm

Xradia 510/520 Versa
0.7 µm
1.0 µm
70 nm

Xradia 610 Versa
0.5 µm
1.0 µm
40 nm

Xradia 620 Versa
0.5 µm
1.0 µm
40 nm

Sealed Transmission
Fast Activation
30-160 kV
25 W

Sealed Transmission
Fast Activation
30-160 kV
25 W

X-ray Source
Architecture
Sealed Reflection
Sealed Transmission				Voltage Range
20-90 kV
30-160 kV
Maximum Power Output
8W10 W

Detector System
ZEISS X-ray microscopes feature an innovative detector turret with multiple objectives at different magnifications.
Each objective features optimized scintillators that deliver the highest absorption contrast details.
Standard Objectives
0.4x, 4x, 10x, 20x
Optional Objectives
40x			
StagesSample Stage (load capacity)
Sample Stage Travel (x, y, z)

25 kg
50, 100, 50 mm

Versa Features
Scout-and-Scan™ Control System•
Scout-and-Zoom•
Vertical Stitch•
XRM Python API•
Automated Filter Changer (AFC)		
High Aspect Ratio Tomography (HART)		
Dual Scan Contrast Visualizer (DSCoVer)		
ZEISS LabDCT for Diffraction Contrast Tomography
Wide Field Mode
0.4x
GPU CUDA-based Reconstruction
SingleZEISS Autoloader
Optional
In Situ Interface Kit
Optional
ZEISS OptiRecon
Optional
ZEISS ZEN Intellesis
Optional
ORS Dragonfly Pro
Optional

0.4x, 4x, 20x
40x,
Flat Panel Extension (FPX)

0.4x, 4x, 20x
40x,
Flat Panel Extension (FPX)

0.4x, 4x, 20x
40x,
Flat Panel Extension (FPX)

25 kg
50, 100, 50 mm

25 kg
50, 100, 50 mm

25 kg50, 100, 50 mm••••••••
520 only		
520 only		
520 only		
Optional (520 only)
510 - 0.4x | 520 - 0.4x and 4x0.4x
510 - Single | 520 - Dual
Dual
Optional
Optional
Optional
Optional
Optional
Optional
Optional
Optional
Optional
Optional[a] Spatial resolution measured with ZEISS Xradia 2D resolution target, normal field mode, optional 40x objective.
[b] RaaD™ working distance defined as clearance around axis of rotation.
[c] Voxel is a geometric term that contributes to but does not determine resolution, and is provided here only for comparison.
ZEISS specifies resolution via spatial resolution, the true overall measurement of instrument resolution.

ZEISS Process Control Solutions (PCS)Carl Zeiss SMT, Inc.
4385 Hopyard Road
Pleasanton, CA 94588
USA
www.zeiss.com/pcs
info.pcs@zeiss.com

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Optional
0.4x and 4x
Dual
Optional
Optional
Optional
Optional
Optional

EN-PCS-015-11-2019-US | Design, scope of delivery and technical progress subject to change without notice. | © Carl Zeiss SMT, Inc.

(Voxel size at sample at maximum magnification)