Accelerating Digital
Transformation
and Innovation
for semiconductor
electronics

ZEISS Solutions for Semiconductor
Development, Manufacturing,and Analysis

Enabler ofTechnological Progress
How ZEISS is driving
digitalization

Digital technology is used everywhere in our modern economy. The
semiconductor industry faces the challenge of producing ever smaller,
more powerful, and more energy-efficient chips. Key to this chip scaling
challenge is the perpetuation of Moore’s Law, with EUV lithography
acting as a cornerstone of advanced semiconductor manufacturing.
These devices ensure the proper functionality and regulation of many
components in fields ranging from the automotive industry to consumer
markets. There is therefore great demand for high-performance,
defect-free chips. Product development must also be accelerated inorder to achieve faster time to market. As a result, every stage inthe design-to-production cycles of highly complex devices must be
swiftly ramped up to ensure high-yield processes.
ZEISS powers the technology of tomorrow, supporting chip
manufacturers worldwide when it comes to high-precision nanometerscale optics and photomasks for semiconductor production. Intelligent
workflows use advanced microscopy solutions and software to rapidly
resolve critical issues affecting the manufacturing yield and device
performance. And innovative industrial microscopy and metrology
solutions enable inspection and top-level quality assurance for evengreater productivity.

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Photomasks for
EUV lithography

Patterned wafer

Component assembly
on a PCB3

Semiconductor Development,
Manufacturing, and Analysis
ZEISS solutions for every step
Chip manufacturing is a complex process. Each step requires advanced
technology to aid the development, characterization, process optimization,
metrology, and quality assurance needed for the manufacture of reliable
electronics. This is essential for meeting the increasing demands of thedigitalization that touches every aspect of life in our interconnected world.
ZEISS provides a host of solutions across the entire manufacturing chain.
This ranges from the production of perfect photomasks and EUV optics
for lithography through to advanced microscopy and metrology solutions
for process control, inspection, characterization, and quality. As a partner
to numerous companies in the semiconductor industry, ZEISS ensures the
production of reliable high-performance electronic devices.

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Photomask
Manufacturing

Lithography
OpticsWafer/Die Characterization
and Failure Analysis

Page 6 / 7

Page 8 / 9Page 10 / 11

Ø 6.684

11.61

58.74

Package Development
and Failure Analysis

Assembly andIntegration

Metrology andQuality Assurance

Page 12 / 13

Page 14 / 15

Page 16 / 175

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Photomask Manufacturing
The ongoing technological evolution in integrated circuits (IC) is driven
by exponential growth in computing power and data transport. This is
expected to accelerate further in the coming years with the advent of artificial
intelligence. Power consumption and computing performance will be key
drivers for improved architectures and further increases in pattern density.
The photomask is a key element in semiconductor manufacturing. Defect-freestructures are a prerequisite for the production of high-end microchips used
in a wide range of applications.

Challenges• Ever smaller feature sizes and new lithography techniques suchas EUV lead to ever tighter photomask specifications• Photomasks have to be defect-free and in-spec to enable the
manufacturing of high-performance microchips

ZEISS Solutions

Portfolio
Photomask Solutions
ZEISS PROVEZEISS ForTune
ZEISS MeRiTZEISS PRTZEISS AIMS

• ZEISS offers a wide range of solutions along the mask manufacturing
chain to enable the production of defect-free photomasks• Includes mask registration metrology (PROVE), mask tuning (ForTune),repair of hard and soft defects (MeRiT, PRT), mask qualification (AIMS)

Detailed information
on page 18 – 21

Application Examples

Photomask defect before repair: The SEM image captured with ZEISS MeRiT (onleft) indicates the defect in the pattern, while the aerial image from ZEISS AIMS
(on right) shows how this translates to wafer printing on the EUV photomask.

Photomask defect after repair: ZEISS MeRiT supports reliable mask repair anddefect correction via gas-assisted electron beam lithography (on left). The aerial
image captured with ZEISS AIMS (on right) enables the user to verify the qualityof the repaired defect.

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8

Lithography Optics
The perpetuation of Moore’s Law has driven the development of eversmaller transistors in engineering and manufacturing technology. EUV
lithography has been introduced to the market to address the stringent
requirements for manufacturing next-generation logic and memory devices.
The challenges involved in manufacturing the different components for EUV
are pushing the frontiers of technology.

Challenges• EUV lithography tools require mirrors featuring the highest precisionand maximum quality• Only ZEISS can produce the world’s most precise mirrors

Portfolio
Lithography Optics
DUV (deep ultraviolet)
EUV (extreme ultraviolet)• Specialized, uniform, and atomic-scale precision thickness coatings
are needed to increase the efficiency of mirrors

Optics Modules
Laser components and modules

ZEISS Solutions• The EUV scanner from ASML has been described as “the most technically

Optics and modules for wafer
inspection

advanced tool of any kind that’s ever been made” (Mark Phillips, Intel
Fellow and Director of Lithography)• Research into what is now EUV lithography began over 25 years ago,since when ZEISS has applied for more than 2,000 EUV-related patents• Extreme precision in the manufacturing of mirrors and atomic-scaleprecision in coating technology are critical components for thistechnological marvel• ZEISS and ASML are already working on the next EUV generation, ­High-NA, which will enable even more powerful microchips

Application Examples

EUV technology incorporating
high-precision optics with
two functional modules

910Wafer/Die Characterization
and Failure Analysis
Moore’s Law and transistor scaling have continued with breakthroughtechnologies, process improvements, new materials, and complex device
architectures. Ever-shrinking transistors and interconnects have made defectlocation and failure analysis more difficult and laborious. This adds tochallenges in terms of reliability, yield, and manufacturing cycle time.
Microscopy solutions for inspection, characterization, and sample preparation
have become critical analysis tools in determining the success rate andturnaround time for defect identification and root cause failure analysis.

Portfolio

Challenges• Shrinking devices require inspection at the highest resolution with
optimum contrast

Electron Microscopy Solutions
ZEISS Crossbeam• Advanced node devices demand electrical characterization without

ZEISS GeminiSEM

modifying or damaging the transistor properties• Shrinking devices with complex 3D stacked geometries and newmaterials require an advanced sample preparation workflow for

Light Microscopy Solutions
ZEISS Axio Imager

TEM analysis and 3D serial section imaging

ZEISS Solutions

Detailed information• ZEISS GeminiSEM is an industry-leading FE-SEM enabling ultra-low

on page 18 – 21

voltage surface imaging and large field of view nanoprobing for themost demanding imaging and analytical tasks• ZEISS Crossbeam FIB-SEM efficiently delivers high-resolution sample
preparation, imaging, and analytics with unique workflows for 2D
and 3D devices• ZEISS Axio Imager light microscopes enable high quality widefieldand confocal imaging with crisp contrasts and modular upgradability
for handling everything from small components to 300 mm wafers
with clean room compatibility

Application Examples

300 nmPassive voltage contrast at
0.6 kV with Inlens detector
on delayered 7 nm SRAM

Imaging at 80 V for
landing probes on 14 nm
SRAM device with Inlens
detector

3D visualization of FIB-SEM
tomography dataset withvoxel size 1 nm3 of a 5 nm
SRAM device acquired on
ZEISS Crossbeam

Darkfield imaging on a
300 mm wafer with a 10X
objective on a ZEISS Axio
Imager Vario

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12

Package Development
and Failure Analysis
In the “More than Moore” era, transistor scaling alone is no longer
sufficient for increasing performance and system miniaturization.
Innovations in semiconductor packaging – such as wafer-level packaging,heterogeneous integration using TSVs, interposers, and hybrid bonding –have major potential for cutting costs and extending functionality.
At the same time, complex packaging architectures, feature size scaling,
and increasing density of interconnects have introduced new challenges
for reliability and failure analysis.

Portfolio

Challenges• Fault isolation and defect localization are complex and laborious

Electron Microscopy Solutions• Non-destructive techniques do not provide a large field of view withZEISS Crossbeam

sufficient resolution to account for increasing package sizesZEISS GeminiSEM• Physical analysis techniques for targeting defects in the 3D volume are

ZEISS Sigma

slow and challenging• Traditional failure analysis workflows lack the required combination of

X-ray Microscopy Solutions

speed, resolution, and 3D information

ZEISS Xradia Context
ZEISS Xradia Versa

ZEISS Solutions• A unique 3D X-ray microscopy architecture with deep learning based
reconstruction provides high resolution imaging with superior contrast

Detailed information

breaking sample size and throughput limitation

on page 18 – 21

• ZEISS Crossbeam FIB-SEM with integrated femtosecond (fs) laser provides
fast, precise, and targeted sample preparation, shortening the time toresult from days to hours• The ZEISS Sigma and ZEISS GeminiSEM families of FE-SEMs provide
distortion-free large field of view imaging with superior low kV performanceand material contrast, enabling easy routine imaging and analysis

Application Examples

100 nm

Sub-micron resolution 3D
X-ray microscopy of IC
package for non-destructive
imaging of defects in package
interconnects

High-throughput sample
preparation targeting deeply
buried microbumps in a 2.5D
package with a gallium FIB-SEM
and integrated fs laser

Distortion-free large field ofview imaging with high pixel
resolution of microbumps and
RDL layers in 2.5D packages
with ZEISS GeminiSEM

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14

Assembly and Integration
From printed circuit board (PCB) to PCB assembly (PCBA), the manufacturing
process comprises a number of complex procedures. Whether quality control
of incoming substrate materials or surface finishing of PCBs, each step posesa number of quality assurance challenges.
One-stop quality solutions from ZEISS provide full coverage of the entire
process, including substrate quality control, PCB manufacturing, and PCB
assembly.

Portfolio

Challenges• Quality control of surface roughness, morphology, and compositionof incoming materials

Electron Microscopy Solutions
ZEISS EVO

• Inspection and measurement of trace width and via hole during PCBZEISS Sigma

manufacturing• Inspection of solder joint quality, surface defects, and failure analysis

Light Microscopy Solutions
ZEISS LSM 900 Mat

ZEISS Solutions

ZEISS Visioner 1• Optical inspection and measurement of trace width, weld quality,
and metallographic section analysis• Confocal imaging for analyzing surface roughness and throughhole size with ZEISS LSM 900 Mat

X-ray Microscopy Solutions
ZEISS METROTOMZEISS Xradia Versa• Rapid SEM inspection and compositional analysis of incoming
materials, dry films, IMC layers, and corrosion with ZEISS EVO• X-ray CT of pores and cracks in solder joints and laminates

Detailed information
on page 18 – 21

Application Examples

200 µm

SEM inspection of surface
mount passive components

1000 µm

Optical inspection of PCB
components with ZEISSVisioner 1

Surface roughness and profiling
via confocal imaging with ZEISSLSM 900 Mat

Non-destructive X-ray
imaging of a PCB withZEISS METROTOM

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16

Metrology and Quality Assurance
When manufacturing and assembling electronic and structural components
in production environments, metrology and quality assurance are essential
for meeting industry standards in terms of product performance and quality.
Among the critical tasks are dimensional measurements, internal andexternal defect inspection, surface quality analysis, and verification with amaster reference.
Speed and productivity must be complemented by accuracy andrepeatability. ZEISS understands the specific manufacturing requirements
and provides superlative tailored metrology and quality assurance solutions.

Portfolio

Challenges• Highly efficient dimensional measurement for process control, ensuring
the stability of the production line

CMMs and Metrology Solutions
ZEISS CONTURA• High-throughput inspection and measurement of components at different

ZEISS O-DETECT

resolution scales in lens module assemblies and housing assemblies of

ZEISS O-INSPECT

connectors, phones, and wearables• Inspection of internal alignment, dimensions, surface roughness, anddefects such as pores or cracks in housing components and final assembly

X-ray Microscopy Solutions
ZEISS METROTOM• Fast inspection and verification of deviations or deformations affecting
structural and housing components
Detailed information

ZEISS Solutions

on page 18 – 21

• ZEISS CONTURA for high efficiency, accuracy, and repeatability in tactile
dimensional measurements• Multi-sensor metrology with ZEISS O-INSPECT for optimized tactile andoptical measurements of various components in the assembly. Opticalmetrology with ZEISS O-DETECT for excellent optics, fast imaging, andvarious illumination options for every application• Non-destructive X-ray computed tomography inspection with ZEISSMETROTOM provides complete data analysis of components, includinginternal features that are not accessible with traditional optical or tactile
metrology solutions

Application Examples

X-ray computed tomography
imaging and measurementof a base plug with ZEISSMETROTOM

Optical measurement using
ZEISS O-DETECT

Subsequent detailed analysisof the results in ZEISS CALYPSO

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ZEISS Solutions
Portfolio
As a leading provider to the global semiconductor community, ZEISS offers a comprehensive
portfolio of solutions. Powered by core technologies in imaging, precision engineering, andmetrology, these innovations help the semiconductor industry meet the challenges of nextgeneration devices.
ZEISS provides unique photomask solutions for zero-defect operation, in-die metrology, criticaldimension/registration, and overlay. Its light, X-ray, electron, and ion beam microscope systems
support semiconductor manufacturing from wafer fabs through to packaging and assembly.
These are complemented by metrology and quality assurance with CMMs, CT, and opticaltechnologies, which power production monitoring, reliability, and systematic quality control inassembly and integration.
The sophisticated ZEISS software suite enables data correlation for connected instruments inorder to streamline workflows, perform advanced image analysis with AI and machine learning
tools, and deliver actionable insights that improve efficiency, productivity, and turnaround time.

Photomask Solutions

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ZEISS PROVE
Photomask metrology

ZEISS MeRiT
Photomask repair

Measures image placement with
sub-nanometer repeatability
and accuracy. Pattern generator
calibration, mask process control,and in-die metrology.

Single-platform opaque and clear
defect repair on all photomask
materials with top precision.
Superior resolution and accuracy,
no contamination.

ZEISS ForTune
Photomask tuning

ZEISS AIMS
Aerial image measurement

Meets tightest mask registration
specifications, achieving high yields,
preventing excursion, and reducing
process defect probability on wafer.

Unique system for performing
defect review, printability analysis,
and repair verification on current
and future photomask generations.

Electron Microscopy Solutions

ZEISS EVO
Conventional SEM for
failure analysis andquality analysis

ZEISS Sigma
Mid-range FE-SEM for
failure analysis andinspection

Routine inspection and failure
analysis of PCBs, passive
components, and modules.

Offers excellent user experienceand higher productivity. Enhanced
resolution at low voltages. Acquire
analytical data twice as fast andwith added precision.

ZEISS GeminiSEM
FE-SEM for highest
demands in imaging
and analytics

ZEISS Crossbeam
FIB-SEM for highthroughput sample
preparation

Easy imaging with sub-nanometer
resolution and high detection
efficiency. Ideal for nanoprobing
and characterization of materials
requiring low voltages.

High-res sample preparation,
imaging, and analytics. Unique
workflows for 2D and 3D devices.
Failure analysis turnaround inhours with fs laser integration.

Light Microscopy Solutions

ZEISS Stemi Stereo
Microscopes
Routine inspection
made easy
Inspection of PCBs and electronic
components for quality assurance
and failure analysis with large
field of view and up to 50x
magnification.

ZEISS Visioner 1
Digital microscope withrevolutionary technology
100x more usable depth of focus forvisualization of the PCB assemblyand electronic components. All in
focus, every time.

ZEISS LSM 900 Mat
Confocal laser scanningfor 3D surface analysis

ZEISS Axio Imager Vario
Wafer inspection with ­best-in-class optics

Inspection of surface roughness
and 3D profiling on wafers, PCBs,
and electronic components forinspection, quality assurance, andfailure analysis.

Modular platform for inspecting
wafers up to 300 mm and large PCBs.
Upgradable hardware and softwaremodules for diverse inspection
capabilities.

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X-ray Microscopy Solutions

ZEISS BOSELLO
Robust defect detectionZEISS METROTOM
Handles entire components

Automated or manual nondestructive 2D X-ray inspection forhigh productivity, quick loading andunloading, fast cycle times, andflexible applications.

Quality assurance with a single
3D computed tomography scan.
Standard acceptance test, precisionengineering, and sophisticatedcalibration for system traceability.

ZEISS Xradia Context
High-end microCT
for packaging andcomponents

ZEISS Xradia Versa
Industry-leading
resolution and contrast

Failure analysis and 3D inspection
with high-quality imaging andupgradable modular platform.

Outstanding failure analysis forsemiconductor packaging. 3D
X-ray imaging extends the limitsof resolution and contrast.

CMMs and Metrology Solutions

ZEISS MICURATop precision forsmall parts

ZEISS PRISMO
When precision
matters the mostIdeal for meeting increasing
accuracy requirements. Particularly
suited to complex and compact
components with tight tolerances.

High-speed scanning withmaximum accuracy in themeasuring lab, full compliancewith ISO quality standards, andno compromise on precision.

ZEISS CONTURA
Prepared for all
challenges – today
and tomorrow

ZEISS O-INSPECT
Expert in every discipline

Ideal for versatile measuring tasks
thanks to mass technology, whichallows tactile and optical sensors
to be used on the same system.

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For components requiring
tactile precision plus an opticalsolution for surface-sensitive
sections. Optimally measures eachcharacteristic every time.

Software and Digital Solutions

ZEISS ZEN core
Software suite forconnected microscopy

ZEISS arivis
Comprehensive image
analysis platform

From materials lab to production:
the most comprehensive suite ofimaging, segmentation, analysis,
and data connectivity tools for
multi-modal microscopy.

Family of software products for
multi-modal, multi-dimensional
microscopy data that integrates
and connects all image analysis
pipelines.

ZEISS Quality Suite
Platform for metrology
software and much moreZEISS CALYPSO
All-round software fordimensional metrology

Single-platform access to our 3D
software. Read news articles, bookextensive software training courses,
and find add-ons for your metrology
software.

Quick, simple, and reliablemeasurement of geometricalelements. Combines with ZEISS
measuring systems and sensors
for a powerful one-stop solution.

This portfolio is geared toward future growth in the electronics and semiconductor
industry. ZEISS solutions shape the future of technology, powering constant advances in
optics and related fields.
The Carl Zeiss Foundation, one of the largest German foundations committed tothe promotion of science, is the sole owner of holding company Carl Zeiss AG. The
company’s significant sustainable investments in research and development lay thefoundation for furthering its technological success and market leadership.

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Your Global Partner –present in all regions

60

Sales & Service
Organizations

30

Production Sites

Spread across nearly 50 countries, ZEISS’ global operations include
around 60 sales and service companies, 30 production sites, and 30
research and development sites with over 38,000 employees. Our
highly trained application specialists and service engineers maintainhigh standards to help the semiconductor industry meet the latest
requirements. Dedicated application support is also available at every
stage. With our worldwide network of spare parts hubs speeding up
response times and supply chain logistics, priority is given to optimum
system performance and maximum uptime.
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30

R&D Facilities

50

Countries

Find your perfect solution today.
Get in contact with our global experts.

zeiss.com/corporate/en/contact.html

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Carl Zeiss Microscopy GmbH
Carl-Zeiss-Promenade 10
07745 Jena, Germany

Email: microscopy@zeiss.com
www.zeiss.com/semiconductor-microscopy
www.zeiss.com/semiconductor-manufacturing-technology

Not for therapeutic use, treatment or medical diagnostic evidence. Not all products are available in every country. Contact your local ZEISS representative for more information.
EN_40_010_148 | Version 1.0 | CZ 12-2023 | Design, scope of delivery and technical progress subject to change without notice. | © Carl Zeiss Microscopy GmbH