Amphenol
Printed Circuit Board Technology

NAFI + UHD CONNECTORSSTANDARD. RELIABLE. PROVEN.

NAFIFEATURES & BENEFITS
Available in 2 through 4 rows - Offers maximum design flexibility
Tested and qualified to MIL-C-28859 and MIL-C-28754 - Confirms the product meets specific performance requirements
Tuning fork and blade contact system - A proven technology for high reliability
Low insertion force (2.25oz/contact) - For easy mating
Rugged machined aluminum frames - Ensures excellent performance in harsh environments
Compliant pin press-fit, through-hole and flex circuit termination styles available - Support a variety of design application requirements

Tuning Fork and Blade
Contact System:
A proven technology forhigh reliability.

Originally co-developed with the U.S. Navy, the NAFI Connector productline includes multi-row, through-hole solder blade connectors and press
fit tuning fork backplane connectors. The highlight of the NAFI backplane
technology is its solderless “Dynamic Retention” gas tight, press-fit tuning
fork contact design. Rugged, metal header bodies are machined andfinished with chromate. Available in two, three, or four rows of contacts,
NAFI Connectors offer a high degree of design flexibility in order to meet
specific density and layout requirements.

Connector patterns containing multiple rows of contacts are easily
produced and can include standard NAFI-style features such as guidepins and D-shaped polarizing keys. The mating backplane connectors
feature solderless press-fit tuning fork contacts arranged
on a 0.100” x 0.100” grid.

NAFITECHNICAL REFERENCESOPERATING CHARACTERISTICS
Temperature Range
Current Rating(individual contact)
Current Rating(multiple contacts)
Dielectric Withstanding
Voltage (DWV)
Insulation Resistance (min.)Contact Resistance (max.)
Contact-to-Backplane
Retention Force (min.)Contact Life (durability)
Contact Engagement ForceContact Normal ForceContact Wipe Length (min.)-65°C to +125°C
3 Amps DC at 25°C
1 Amp DC at °C
600 V (RMS) at 60 Hz
10,000 MΩ
30 MΩ
3.0 lbs.
500 cycles
2.25 oz max. average
1.0 N (3.53 oz-f) average
0.053 in.

MATERIALS & FINISHES
Frame Material
Frame Finish
Module Contact Material
Module Contact Tails
Module Contact Finish
Backplane Contact Material
Backplane Contact Finish
Module Insulator
Backplane Insulator
Module Marking
Polarizing Keys and Bushings

ENVIRONMENTAL CHARACTERISTICS
Salt Spray (corrosion)
Thermal Shock
Humidity
Physical ShockVibration (random)

MIL-STD-1344
MIL-STD-1344
MIL-STD-810
MIL-STD-202
MIL-STD-1344

Method 1001, Test Condition B
Method 1003, -55°C to +125°C
Method 507, Procedure 1
Method 213
Method 2005, 10-2000 Hz, 15g Peak

Aluminum Alloy
Gold Chromate per MIL-C-5541
Brass
Pre-tinned using Sn63 (from end ofcontact to mounting surface min.)50µ” min. Gold over 10µ” min. Nickel
Beryllium Copper50µ” min. Gold over 10µ” min. Nickel
High-temperature Nylon 6-6
Polyester, 30% glass-filled (UL 94V-0)
Includes Amphenol part number, logo anddate code
Stainless Steel, PassivatedNAFI

TWO ROW
X

P.174 (4.42).140 (3.56).052 [1.32]
2 PL.015[0.38]-.019[0.48]
DIAMETER TYPICAL.240 [6.10]
SECTION X-X
ROTATED 90° CCW

X.140 [3.56].100 [2.54]
N.200 [5.08]

K EQ SP @ .100[2.54], centered on N

Ø.097 [Ø2.46]
2PL.142 [3.61].580 [14.73]
2 PL(.037 [0.94]) CONTACT
TO MOUNTING SURFACE.470 [11.94]
2 PL

Marking located approximately
where shownM

SEE DETAIL DDETAIL C
CONTACT ORIENTATION.100 [2.54].150 [3.81]

DETAIL D
PIN ORIENTATION(SHOWN IN POSITION A).093 [2.36].286 [7.26].050 [1.27]
2 PL
STANDARD
ORIENTATIONSEE DETAIL C

Daughtercard
Connector
M1001-12927

No. Contacts Mating Backplane
Connector Kit
60
552-2583-000

K

M

N

P

29

2.930

2.940

2.960

M1001-12928

80

552-2584-000

39

3.930

3.940

3.960

M1001-12929

100

552-2585-000

49

4.930

4.940

4.960

M1001-12930

120

552-2586-000

59

5.930

5.940

5.960

NAFI

THREE ROW
X
P
.175 (4.45).015[0.38]-.019[0.48]
DIAMETER TYPICAL.140 (3.56).052 [1.32]
2 PL.340 [8.64].240 [6.10]

SECTION X-X
ROTATED 90° CCW

X.140 [3.56].100 [2.54]

N
K EQ SP @ .100[2.54], centered on N

.200 [5.08]
Ø.097 [Ø2.46] 2 PL.142 [3.61].580 [14.73]
2 PL(.040 [1.02]) CONTACT
TO MOUNTING SURFACE.470 [11.94]
2 PL

Marking located approximately
where shownM

SEE DETAIL DDETAIL C
CONTACT ORIENTATION.150 [3.81]

DETAIL D
PIN ORIENTATION(SHOWN IN POSITION A).193 [4.90].386 [9.80].050 [1.27]
2 PL

STANDARD
ORIENTATION.100 [2.54]
SEE DETAIL C

Daughtercard
Connector
M1001-12931

No. Contacts

K

M

N

P

66

Mating Backplane
Connector Kit
552-2587-000

21

2.130

2.140

2.160

M1001-12932

99

552-2588-000

32

3.230

3.240

3.260

M1001-12933

120

552-2589-000

39

3.930

3.940

3.960

M1001-12934

150

552-2590-000

49

4.930

4.940

4.960

*All dimensions for reference only

NAFI

FOUR ROW.175 (4.45).140 (3.56)

PX.015[0.38]-.019[0.48]
DIAMETER TYPICAL.440 [11.18].052 [1.32]
2 PL.340 [8.64].240 [6.10]

SECTION X-X
ROTATED 90° CCW

X.100 [2.54]

N.140 [3.56]

K EQ SP @ .100[2.54], centered on N
.200 [5.08]
Ø.097 [Ø2.46] 2 PL.142 [3.61].580 [14.73]
2 PL(.040 [1.02]) CONTACT
TO MOUNTING SURFACE.470[11.94]
2 PL

DETAIL C
CONTACT ORIENTATIONDETAIL D
PIN ORIENTATION(SHOWN IN POSITION A)

Marking located approximately
where shownM

SEE DETAIL D.150 [3.81].100 [2.54].200 [5.08].093 [2.35]

STANDARD
ORIENTATION.050 [1.27]
2 PL.485 [12.32].300 [7.62]

SEE DETAIL C

Daughtercard
Connector
M1001-12935

No. Contacts Mating Backplane
Connector Kit
100552-2591-000

K

M

N

P

24

2.430

2.440

2.460

M1001-12936

140

552-2592-000

34

3.430

3.440

3.460

M1001-12937

180

552-2593-000

44

4.430

4.440

4.460

M1001-12938

200

552-2594-000

49

4.930

4.940

4.960

NAFI

BACKPLANE CONNECTOR KITS

.220

.100

4 ROW LEFT VERSION(BOTTOM VIEW).199

4 ROW RIGHT VERSION(BOTTOM VIEW)

4 ROW W/O NAFI VERSION(BOTTOM VIEW).100

3 ROW RIGHT VERSION(BOTTOM VIEW)

3 ROW LEFT VERSION(BOTTOM VIEW)

Backplane
Connector Kit
552-2583-000
552-2584-000
552-2585-000
552-2586-000

No. ofContacts

MatingDaughtercard
Connector
60
M1001-12927
80
M1001-12928
100
M1001-12929
3120
ROW LEFT M1001-12930
VERSION(BOTTOM VIEW)

3 ROW W/O NAFI VERSION(BOTTOM VIEW)

4 ROW RIGHT VERSION(BOTTOM VIEW)

4 ROW LEFT VERSION(BOTTOM VIEW)

2 ROW INSULATOR

2 ROW W/O NAFI VERSION(BOTTOM VIEW)

2 ROW RIGHT NAFI VERSION(BOTTOM VIEW)

2 ROW LEFT NAFI VERSION(BOTTOM VIEW)

3 ROW INSULATOR
MatingDaughtercard
Connector
66
M1001-12931
99
M1001-12932
120
M1001-12933
3
ROW
RIGHT
VERSION
150
M1001-12934

4 ROW W/O NAFI VERSION(BOTTOM VIEW)

4 ROW INSULATOR

Backplane
No. ofConnector Kit Contacts

Backplane
Connector Kit

552-2587-000
552-2588-000
552-2589-000
552-2590-000

552-2591-000
552-2592-000
552-2593-000
552-2594-000(BOTTOM VIEW)

No. ofContacts

MatingDaughtercard
Connector
100
M1001-12935
140
M1001-12936
180
M1001-12937
3 ROW
VERSION
200W/O NAFIM1001-12938(BOTTOM VIEW)UHD
FEATURES & BENEFITS
0.100” x 0.050” staggered grid - High density optimizes trace routing through the backplane
Compliant press-fit termination of backplane connectors - Provides a gas-tight interface with the printed circuit backplane without
the need for soldering
Tuning fork and blade contact system - A proven technology for high reliability
Low insertion force (2.25oz/contact) - For easy mating
Daughtercard connectors feature surface mount termination via rigid pins or flex circuit - Maximum design flexibility depending on
the application requirements
Rugged machined aluminum frames - Ensures excellent performance in harsh environments
Low Insertion Force(2.25oz/contact):
For easy mating.

The Ultra High Density (UHD) interconnect is a high reliability packaging
solution for airborne, space, shipboard, and ground-based applications.
With 80 contacts per linear inch, the UHD connector is tested and qualified
to DSCC 89065. These connectors feature up to 396 surface-mountcontacts in the SEM-E (Standard Electronic Module) format and up to 556
pins in the 10 SU configurations. The mating backplane connectors featuresolderless compliant press-fit tuning fork contacts arranged on a staggeredeight row 0.100” x 0.050” grid for optimized trace routing through the
backplane.

The module connectors are surface mounted to the module using rigid
pin or flex circuit terminations. Designers faced with unique packaging
requirements will appreciate the design flexibility of the UHD connector. A
modular approach allows for straightforward incorporation of signal, power,
coax, and fiber-optic inserts, as well as EMI shielding, all within the sameconnector footprint. The design also enables the production of connectorsthat are either longer or shorter than the basic SEM-E format. The UHD
connector is designed to provide signal integrity and interconnect density
to meet today’s advanced system-level requirements while maintaining arobust design.

UHD

TECHNICAL REFERENCESOPERATING CHARACTERISTICS
Temperature Range
Current Rating(individual contact)
Current Rating(multiple contacts)
Dielectric Withstanding
Voltage (DWV)
Insulation Resistance (min.)Contact Resistance (max.)
Contact-to-Backplane
Retention Force (min.)Contact Life (durability)
Contact Engagement ForceContact Normal ForceContact Wipe Length (min.)-65°C to +125°C
3 Amps DC at 25°C

MATERIALS & FINISHES

10,000 MΩ
30 MΩ
3.0 lbs.

Backplane Contact Material
Backplane Contact Finish
Module Insulator

500 cycles
2.25 oz max. average
1.0 N (3.53 oz-f) average
0.053 in.

Terminal Guide

Aluminum Alloy
Electroless Nickel
Brass50µ" min. Gold over 50µ" min. Nickel
Solderable per MIL-STD-208, Solder coatedtail, 60/40 Tin-Lead"
Beryllium Copper50µ” min. Gold over 50µ” min. Nickel
Polyphenylene Sulfide (PPS), 40% glassfilled
Liquid Crystal Polymer

Backplane Insulator

Polyester, 30% glass-filled (UL 94V-0)

Polarizing Keys and Bushings

Stainless Steel, Passivated

Guide Pin Adhesive

3M Scotch-Weld, DP-190 (gray)1 Amp DC at °C

Frame Material
Frame Finish
Module Contact Material
Module Contact Finish

600 V (RMS) at 60 Hz

ENVIRONMENTAL CHARACTERISTICS
Salt Fog
Thermal Shock
Humidity
Physical ShockResistance to Solder Heat
Vibration (sinusoidal)
Vibration (random)

MIL-STD-810
MIL-STD-202
MIL-STD-1344
MIL-STD-202
EIA-364-56
MIL-DTL-202
MIL-DTL-202

Method 509, Procedure 1
Method 107, Test Condition B
Method 1002
Method 213, Test Condition C
Procedures 3 & 4
Method 204, Test Condition G
Method 214, Test Condition I, Letter E

Additional configurations also available. Visit www.amphenol-abs.com or email nafi_uhd@amphenol-abs.com for more information.

10

UHD

DAUGHTERCARD

M1050-00640

M1050-00640
5.355

5.355

5.195

5.195

2.735
2.735
2.598

3X .160.684

SECTION Z-Z

M1050-00639
3.355
3.195

2X .390
.160

.684

Z

232X .010

.565
.471

2X CENTER CORE
MOUNTING HOLES

4X COVERATTACHMENT HOLES
232X .036

552-2596-000

BETA END

VIEW FROM TOP SIDE OF CONNECTOR

46X (.050) (=2.30)
PLACES46X (.050) 2(=2.30)
2 PLACES

.106

.683

.565
.471

7X .050 (=.875)
.480
1.438

M1050-00641

SECTION Y-Y
3X .390

INTERFACE PLANE.600.200 TYP

BOARD SHOWNFOR ILLUSTRATION

.500

2.735
2.598

3X
.180
INTERFACEPLANE

4X COVERATTACHMENT HOLES
.68

2.735
2.598

3X .390.103

INTERFACE PLANE.100 TYP

372X .0360

M1050-XXXXX
5.150
5.36

SECTION Y-Y

Z

3X .390232

MatingBackplane
Connector Kit
552-2595-000

M1050-00640

300

552-2596-000

M1050-00641

372

552-2597-000

M1050-00642

556

552-2598-000.600(.400)

M1050-00642
7.625

4.000
3.812
4X TIE BARS

Z

3X .165.44.083

556X .0360

Z

4.000
3.812
4X TIE BARS

556X .0360

Z

3X (.086-56 THREADED INSERT)INSTALL FROM FAR SIDE

3X (.086-56 THREADED INSERT)INSTALL FROM FAR SIDE

552-2598-000

556X .010

MARK PIN NUMBERS
APPROX WHERE SHOWN

3X (.086-56 THREADED INSERT)INSTALL FROM FAR SIDEMARK PIN NUMBERS
APPROX WHERE SHOWN

3.755

Z
3.755

556X .010.200 TYP.100 TYPZ

556X .0360

556X .010

7.625

3X .390.44.200 TYP.100 TYP.200 TYP.100 TYP

5.150
5.36

M1050-00642.44(SHOWN INSTALLED IN PCB)ROTATED 90° CW

M1050-00639

7.625
552-2597-000
5.36

3X .165.083

No. Contacts

6X COVERATTACHMENT HOLES

M1050-00642

3X .390

Daughtercard
Connector

3X CENTER CORE
MOUNTING
6X
COVER HOLESATTACHMENT HOLES

5.150

3X .165
.083

.045
.025

372X

.080

552-2597-000

552-2597-000
AMPHENOL

4.000
3.812
4X TIE BARS

7X .050 (=.875)
.480
1.438

BETA END

3X CENTER CORE
MOUNTING HOLES

6X COVERATTACHMENT HOLES

4X TIE BAR

3X .160

M1050-XXXXX

2.598

.683
.500

232X .045

3X CENTER CORE
MOUNTING HOLES

M1050-XXXXX

372X .0360

.425

372X

372X

5.355
5.195

AMPHENOL

3X .180(.400)

4X TIE BAR

M1050-00641

372X .0360 2.735

AMPHENOL

4X TIE BAR

3X .160
5.355
5.195
5.150
5.363X .160
.080

.080

.100 TYP

INTERFACE PLANE.538.100 TYP

3X .390
.045
.025

3.150
(3.362)

5.195

46X (.050) (=2.30)
2 PLACES.200 TYP 3X .180

(SHOWN INSTALLED IN PCB)ROTATED 90° CW

1.250

5.36
4.380
5.150
5.36

5.355
M1050-00641.200 TYP

57X.070(.050) (=2.850).1002 PLACES(.08)

552-2596-000
5.150

.500

.106

552-2595-000
SECTION
Z-Z

6X COVERATTACHMENT HOLES

300X .00720
.106

.425

4.380
M1050-XXXXXAMPHENOL

F/O MATING PLANE

232X .045

2X CENTER CORE
MOUNTING HOLES

3XCOVERCENTER CORE
6X
6X
COVER
ATTACHMENTMOUNTING HOLES
HOLES
ATTACHMENT
HOLES

552-2596-000

INTERFACE PLANE

.500

.538

CONNECTOR PIN ASSIGNMENTS

4X TIE BAR
300X .010

4.380

.103

INTERFACE PLANE

ALPHA END

M1050-00640

3X .160
M1050-XXXXX
M1050-XXXXX.080.200 TYP
300X .00720.100 TYP
300X .00720

3X .180.68

Z

3X CENTER CORE

3X CENTER CORE
MOUNTING
HOLES
MOUNTING
HOLES

300X
300X.010
.010

5.195
2.735
2.598
AMPHENOLAMPHENOLINTERFACE
INTERFACE
PLANE PLANE.684
F/O
MATING PLANE
F/O MATING
PLANE
.610
3X .390(.08)

4X TIE BAR.080.080
5.355

3X .180 3X .180

2X .180

INTERFACE PLANE.200 TYP.200 TYP.100 TYP.100 TYP.610

3X .390 3X .390

1.250
.070
.100

.610

4X TIE BAR

3X .160

2.598

552-2598-000
7.510
7.724

552-2598-000
7.510
7.724

3.755
7.510
7.724

MARK PIN NUMBERS
APPROX WHERE SHOWN

.538.200 TYP

UHD

ALPHA END

3X .390

.106

.683
.610

.500

232X .045

SECTION Z-Z

2.735
2.598

.425

.684

BACKPLANE CONNECTOR KITS
BETA END

CONNECTOR PIN ASSIGNMENTS

3X .390

7X .050 (=.875)
3X .180

2X CENTER CORE
MOUNTING HOLES

1.250
.070
.100

3X .390

.045
.025

5.150

AMPHENOL.683

232X .045
7X .050 (=.875)
.480
1.438

372X .0360
4.000
3.812
4X TIE BARS.200 TYP

5.355
7.625
5.195
2.735
2.598

Z

AMPHENOLINTERFACE PLANE

SECTION Y-Y.44

556X .0360

4.000
3.812
4X TIE BARS

556X .010

M1050-00642

3X CENTER CORE
3X (.086-56
THREADED
INSERT)
MOUNTING
HOLES

INSTALL FROM FAR SIDEMARK PIN NUMBERS
APPROX WHERE SHOWN

7.625.200 TYP.100 TYP

552-2598-000

Z

5.150
5.36

556X .010

3X (.086-56 THREADED INSERT)INSTALL FROM FAR SIDE

M1050-00642

3X .390

7.625
4.000
3.812
4X TIE BARS

3.755
.44

372X

6X COVERATTACHMENT HOLES

552-2597-000

3X .165.083(.400)

4X TIE BAR

5.36

Z

.045
.025

.600

.080

.100 TYP.200 TYP.100 TYP

M1050-XXXXX
5.150

372X .0360(SHOWN INSTALLED IN PCB)ROTATED 90° CW

3X .160552-2597-000

3X .180

3X .390

3X .390ALPH

6X COVERATTACHMENT HOLES

M1050-00641
M1050-00642(.400)

3X .165.083

3X CENTER CORE
MOUNTING HOLES

372X

5.150 5.36
5.36
M1050-XXXXX.600

INTERFACE PLANE

4X TIE BAR

46X (.050) (=2.30)
2 PLACES.106

3X .180.500

INTERF.080.100 TYP.425
BOARD SHOWNFOR ILLUSTRATION

6X COVERATTACHMENT HOLES

552-2597-000 3X .160

2.735
2.598

INTERFACE PLANE.538

6X COVERATTACHMENT HOLES

M1050-00641
5.195

.103

3X CENTER
CORE
3X CENTER
CORE
MOUNTING
HOLES
MOUNTING
HOLES

372X

M1050-XXXXX

4.380.200 TYP

3.150(3.362)300X .010

.080

5.355
552-2596-000(SHOWN INSTALLED IN PCB)ROTATED 90° CW
57X (.050) (=2.850)
2 PLACES

4X TIE BAR

4X TIE BAR

M1050-XXXXX

300X .00720

SECTION Y-Y

A END.100 TYP.100 TYP
46X (.050) (=2.30)
2 PLACES

372X .0360(.08)

4X COVERATTACHMENT HOLES

.500

.080

AMPHENOLAMPHENOLINTERFACE PLANE
F/O MATING PLANE

552-2595-000.68

3X .160
3X .160

5.150
5.36

.480
1.438
INTERFACE PLANE

VIEW FROM TOP SIDE OF CONNECTOR

.565
.471

3X .180

2.735
2.598
.200 TYP

3X .165556X .0360
.083

Z

Z

.200 TYP.100 TYP

7.510

556X .010

7.724

3X (.086-56 THREADED INSERT)INSTALL FROM FAR SIDEMARK PIN NUMBERS
APPROX WHERE SHOWN

3X .390552-2598-000.44556X .0360

Z

MARK PIN NUMBERS
APPROX WHERE SHOWN

552-2598-000

Backplane
Connector Kit

No. Contacts

552-2595-000

232

MatingDaughtercard
Connector
M1050-00639

552-2596-000

300

M1050-00640

552-2597-000

372

M1050-00641

552-2598-000

556

M1050-00642

3.755
7.510
7.724
3.755
7.510
7.724

Amphenol
Printed Circuit Board Technology

Amphenol Printed Circuit Board Technology
Phone: (603) 324-4500
www.amphenol-apcbt.com
New Hampshire Assembly:
18 Celina Ave, Exit 8
Nashua, NH

Panels, Materials, Front End:
91 Northeastern Blvd, Exit 4
Nashua, NH

Mexico Assembly & Connectors:
Optimize Plant 3 & 6
Nogales, Mexico