EoSens 1.1 CXP2 EoSens 1.1 CXP2 Key Features:®

Engineered forhighest
Performance®

• 3,660 fps at 1.1 megapixel resolution• Up to 224,600 fps at reduced resolution• High sensitivity• Fast CoaXPress-12 Interface• 80 x 80 x 53 mm small

EoSens 1.1 CXP2®

Performance

Featuring a high-speed CMOS sensor, the EoSens® 1.1CXP2 offers 1,280 x864 pixel at an outstanding speed of 3,660 fps combined with an integrated
CoaXPress Version 2.0 with up to 4 lanes 12.5 Gbps for easy transmissionsof this incredible data rate. Higher frame rates can be achieved by defininga region of interest. Based on the extremely high sensitivity the cameradelivers excellent images even with low exposure times.

Dimensions [mm]Back view
54,38080
Micro BNC 75OHM ST JACK BULKHEAD

45.5

45.5

High Sensitivity

The camera’s extreme sensitivity of 20 V/lux*s @ 550 nm delivers highcontrast images even in very low light conditions. This allows to integrate itin applications where lighting is the crucial point.

Compact Design

Contained with an 80 x 80 x 53 mm in a fanless metal housing with highest data
rates and an extremely fast CoaXPress Version 2.0 Interface, the EoSens®
1.1CXP2 is suited for use in a wide range of industrial applications.

Smart Features• CoaXPress lanes switchable 1, 2 or 4
• Supported link speed
3.125/6.25/12
Gbps
activesensor plane• Gamma Correction
G mount
F mount• FPN Correction

Hirose HR 10A-10R-12Pb

active sensor plane
C mount

w/n mount
54,3
18

45.5

®

Specifications
81.8

EoSens81.8 1.1 CXP2Resolution [px]Frame Rates [fps]Resolution

45.5

1.1 MP1,280 x 864

3,660

1,280 x 864 px

1,280 x 764

4,140

CXP @ 4 x 12.5 Gbit/s

640 x 480

6,560

Frame Rate, 8 bit

3,660 fps

128 x 128

23,810Sensor

LUX13HS

Active Pixels
InterfaceSensor Type

4/3’’

Active sensor area (H x V)

17.50 x 11.80 mm

Pixel Size

13.7 x 13.7 μm

Sensitivity (mono)
Hirose HR 10A-10R-12Pb

active sensor planew/
F mount
C mount

54,3

unt

20 V/lux*s @ 550 nm
10 / 8 bitactive sensor plane

active sensor plane
Pixel Data
WidthF mount
Dynamic Range

G mount
60 dBShutterTime / Steps
81.8

81.8

1 µs

Shutter Time / Range
45.5

45.5

2 µs – 1 s

Max. Jitter via CXP Trigger
Mount Options
Dimensions(W x H x L w/o mount)
Weight w/o mount±4 ns
C mount / F mount
80 x 80 x 53 mm
450 g

Power consumption

11 W

Power supply

active sensor plane

active sensor plane
F mount

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MIKROTRON reserves the right of change without notice.
MIKROTRON is not liable for harm or damage incurred byinformation contained in this document.

12 – 24 VDC

Camera body temp.

+5 °C … +50 °C

Shock / Vibration proof

70 g / 7 grms

Conformity

max. 224,600

CMOS (Global Shutter)

Sensor Format ØSide view

active sensor plane© 2022/03_Mikrotron_Datasheet EoSens1.1CXP2Side view

81.8

81.8

18

active sensor planeCoaXPress / GenICam

G mount
Markets and Application Examples

Melt pool monitoring

Additive Manufacturing

Ball grid inspection

Sorting

PIV measurements

Inspection

Roboter positioning

Microscopy

Germany
Landshuter Str. 20-2285716 Unterschleissheim
T.:+49(0)89-726342-00
www.mikrotron.de
info@mikrotron.deUSA
14032 Hermosillo Way
US-Poway, CA 92064
T.:+1-858-774-1176
www.mikrotron.de/ensteve.farell@mikrotron.de