ABOUT EPTC
The 26th IEEE Electronics Packaging Technology Conference(EPTC2024) is an international event organized by the IEEE RS/EPS/EDS
Singapore Chapters and co-sponsored by the IEEE Electronics Packaging
Society (EPS). Since its inauguration in 1997, EPTC has been established
as a highly reputable international electronics packaging conference and is
the IEEE EPS flagship conference in the Asia and Pacific Region. It aims
to cover the complete spectrum of electronic packaging technology. Topics
include modules, components, materials, equipment technology, assembly,reliability, interconnect design, device and systems packaging,heterogeneous integration, wafer-level packaging, flexible electronics,LED, IoT, 5G, emerging technologies, 2.5D/3D integration technology,
smart manufacturing, automation, and AI. EPTC2024 will feature
keynotes, technical sessions, invited talks, panels, workshops, exhibitions,and networking activities.
The EPTC technical program committee, with more than 100
experts from diverse semiconductor packaging technology areas, iscommitted to creating an engaging technical program for the international
packaging community. The technical program will be supplemented by anexhibition, which provides an opportunity for leading companies to exhibit
their latest technologies and products. Last year there were 566 attendees.
This year we will continue to have a 4-day program and expect moreattendees.

CONFERENCE TOPICS
You are invited to submit abstract (s) on new research findings anddevelopments in the following packaging topics:
Advanced Packaging: Flip-chip, 2.5D & 3D, embedded passives &actives on substrates, chiplets, System in Packaging, embedded chippackaging technologies, panel-level packaging, RF, microwave &millimeter-wave, Power and Rugged Electronics Packaging, advancedpackaging solutions for 5G, IoT, cloud computing, autonomous vehicles,
antennas, sensors, power transfer, EM shielding, RF to THz
communications.

Materials and Processing: Photoresist, polymer dielectrics, solder, dieattach, underfill, substrates, lead-frames, materials for wafer & panel-levelpackaging; harsh environments, wafer bonding/debond materials;
emerging electronic materials & processes novel solder metallurgies,
molding compounds, thermal interface materials, advanced wire-bonding,conductive adhesives, PCB for advanced packaging, assembly processes
using newer materials.
Assembly and Manufacturing Technology: Embedded/hybrid package
manufacturing processes, warpage control and management in board-level
assembly, thin die/package handling and assembly advance in flexible andprinted electronics, large/ultra-large package (SiP, SIM, MCP) integrationand processing, thermally enhanced packaging and assembly challenges.
Advanced Materials and Process Manufacturing Technology:
Materials for advanced processes, characterization and handling,processing and characterizing materials, substrates in the large/ultra-large
package (SiP, SIM, MCP) integration and processing, panel-levelmanufacturing and assembly, advances in high power, high frequency
5G/RF packaging, new materials and films in 3D stacking – chip to wafer,wafer to wafer bonding, collective die to wafer, challenges inheterogeneous integration and manufacturing, advancement in additive
manufacturing for packaging substrates, equipment parts, chiplets –assembly challenges, materials and integration.
Electrical Simulation & Characterization: Power plane modelling,
signal integrity analysis by simulations and characterization, 2D/2.5D/3D
package level high-speed signal design, characterization, and test
methodologies.
Mechanical Simulation & Characterization: Thermal-mechanicalinteraction study, moisture, fracture, fatigue, dynamic impact modellingand characterization, process modelling.
Thermal Characterization & Management: Thermal characterizationand simulation, component, system and product level thermal management
and characterization.

TSV/Wafer Level Packaging: Wafer-level packaging, embedded chippackaging, 2.5D/3D integration, Silicon, SiC & Glass interposer, CoWoS,FoCoS, InFo, eWLB, Embedded Multi-die Interconnect Bridge (EMIB),
bumping technologies.

Quality, Reliability & Failure Analysis: Silicon, component, board andsystem-level reliability assessment, interfacial adhesion, accelerated
testing, failure characterization.

Interconnection Technologies: Au/Ag/Cu/Al wire-bond / wedge bondtechnology, Flip-Chip & Cu pillar, solder alternatives, Cu to Cu, waferlevel bonding & die attachment (Pb-free), Fan-out, panel-level, chiplets,SiP, micro-bump, high I/O thermo-compression/hybrid bonding, finepitch/multi-layer RDL, printable interconnects, conductive/ nonconductive adhesives, low-temperature solder, interconnects design andtechnology for emerging applications.

Advanced Optoelectronics and Displays: Design， simulation，interconnection， packaging, integration and materials for optoelectronics
and novel displays - micro/mini/nano LED, foldable and flexible
displays， Augmented Reality and Virtual Reality and wearable displays,
Si and III-V photonics, optical sensors, interconnects, interposers, quantum
device packaging, photonics SiP, free-space optical communications,waveguide, automotive photonics, 3D sensing, optoelectronic fiber
coupling assembly, materials and reliability, fiber optic transceivers.

Emerging Technologies: Novel and unique packaging and materialtechnologies for soft and intelligent packaging, flexible hybrid electronics,
implantable biosensors and bioelectronics, packaging for extreme harshenvironments, green/bio-resorbable packaging, packaging of MEMS &NEMS, packaging for wide bandgap devices, quantum computing, electrooptical integration, AI, ML, packaging sensing and communication.

Smart Manufacturing and Packaging Equipment Technology: Smart
Manufacturing in packaging, cycle time, data analytics, advanced
metrology, Machine Learning, AI, and advanced equipment for assembly,packaging and handling.

BEST PAPER AWARDSThe best oral papers from Academia, Industry and Students will receive
cash awards and certificates. A best interactive paper award will also bepresented. More details are available on the EPTC website.

IMPORTANT DATES
Online abstract submission start

March 31, 2024

Closing of abstract submission

June 08, 2024

Notification of acceptance

July 15, 2024

Full Manuscript Submission

Sept 15, 2024

CALL FOR PROFESSIONAL DEVELOPMENT COURSES
Experts in advanced packaging from industry and academia are invited tosubmit proposals for PDCs to pdcchair@eptc-ieee.net.

CALL FOR EXHIBITORS / SPONSORSPlease check the conference website for the latest updates.

ABSTRACT AND PAPER SUBMISSION

Details of the exhibition and sponsorship opportunities areavailable on the conference website. For enquiries, please email
exhibition@eptc-ieee.net or sponsorship@eptc-ieee.net.
STUDENT TRAVEL GRANTS FOR EPTC

You are invited to submit an abstract between 500–750 words
long and clearly state the purpose, methodology, results (which must
include data, drawings, graphs and photographs) and conclusions of thework. Additional details on abstract submission can be found on the EPTC
website. Abstracts must be received by June 08, 2024. Your submission
must be cleared by your management and co-authors as applicable andinclude the authors' affiliations and email addresses. All submissions
should be in English, either in pdf or MS Word. Please select theappropriate technical committee per your abstract content from the dropdown list of technical areas so that the right technical committee canevaluate your submission for acceptance. Accepted abstracts will benotified by Jule 15, 2024. At the technical review committee's or author's
discretion, submitted abstracts may be considered for interactivepresentation. The final manuscript for publication in the conference
proceedings is due on September 15, 2024. The conference proceedings
are an official IEEE publication, and the accepted papers that are registeredand presented (oral and interactive) at EPTC will be uploaded to IEEE
Xplore.

To encourage students in the electronics packaging field to become
members of EPS and actively participate in the flagship conferences of thesociety, up to 6 Student Travel Grants will be offered for EPTC annually.
Also, to widen the representation of female students and students fromunderrepresented countries, at least two grants will be allocated to female
student authors and one to a student from a country historicallyunderrepresented at EPTC. Please find details on the EPTC website.

AFFILIATE MEMBERSHIP SUBSIDY PROGRAM
To encourage EPS membership and engagement with EPS, EPS has
initiated an Affiliate Membership Subsidy Program whereby non-member
conference registrations at EPTC and the other two EPS flagshipconferences will be offered a complimentary EPS Affiliate Membershipfor the following year.
Please find details on the EPTC website.
If you have questions about abstract submission, please send your queriesat techchair@eptc-ieee.net
For other queries, please email secretariat@eptc-ieee.net

Organized byIEEE Singapore RS/EPS/EDS Chapters

Sponsored by