AXP2101

AXP2101 Single Cell NVDC PMU with E-gauge
DCDC Over-Voltage/Under-Voltage Protection
1 Features
2 Applications
 3.9V–5.5V Input Operating Range and Support

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


single Cell Battery
Battery fuel gauge: E gauge 3.0
Support TWSI(Two Wire Serial Interface) andRSB(Reduced Serial Bus)
100mA-1A Linear charger, CV accuracy +/-0.5%
Single input to support USB input
High battery discharge efficiency with 50
mOhm
High integration includes all MOSFETS, current
sensing and loop compensation
Power off current <20uA（BATFET off，RTCLDO
output on）
5DCDC
DCDC1:1.5~3.4V, IMAX=2A;
DCDC2: 0.5~1.2V, 1.22~1.54V, IMAX=2A;
DCDC3: 0.5~1.2V, 1.22~1.54V, 1.6~3.4V,
IMAX=2A;
DCDC4: 0.5~1.2V, 1.22~1.84V, IMAX=1.5A;
DCDC5: 1.2V, 1.4~3.7V, IMAX=1A.
11 LDOSRTCLDO1/2: 1.8V/2.5V/3V/3.3V, 30mA;
Support RTCLDO1 supplied by backup battery(button battery)
ALDO1~4: analog LDO, 0.5~3.5V, 0.1V/step,
IMAX=300mA
BLDO1/2: analog LDO,0.5~3.5V, 0.1V/step,
IMAX=300mA
CPUSLDO: for CPUs, 0.5~1.4V, IMAX=30mA
DLDO1/2: analog LDO or power switch,
0.5~3.3V/ 0.5~1.4V, IMAX=300mA
startup sequence and default voltage of
DCDC/LDO setting
Protection
Input Over-Voltage Protection
Battery Thermal Sense Hot/Cold Charge
Suspend
Programmable Safety Timer for Charger
Die Thermal Balance for Charger
Thermistor Shutdown3

SDV, CDR, IPC, smart doorbell, smart speaker

Description
AXP2101 is a highly integrated power
management IC (PMIC) targeting at single cell
Li-battery (Li-ion or Li-polymer) applications
that require multi-channel power outputs. It
provides an easy and flexible power
management
solutionfor
multi-coreprocessors to meet the complex and accurate
requirements of power control.
AXP2101 supports Linear charge. Besides, it
supports 16 channel power outputs which
include 5 channel DC-DC and 11 channel LDO.
To ensure the security and stability of thesystem, AXP2101 provides multiple channels
14-bit ADC for voltage/temperature monitor
and integrates protection circuits such as
over-voltage protection (OVP), over-current
protection (OCP) and over-temperature
protection (OTP). Moreover, AXP2101 featuresa unique E-Gauge™ (Fuel Gauge) system,
making power gauge easy and exact.
AXP2101 supports TWSI and RSB for system todynamically adjust output voltages, charge
current and configure interrupt condition.
Device Information
Part Number

Package

Body Size

AXP2101

QFN-405mm * 5mm

Simplified Application Diagram

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AXP2101

Revision History
Revision

Date

AuthorDescription

1.0

May 31, 2021

AWA 1017

Initial version

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AXP2101

Contents
1 Features.................................................................................................................................................................................1
2 Applications...........................................................................................................................................................................1
3 Description............................................................................................................................................................................ 1
Revision History....................................................................................................................................................................... 2Contents...................................................................................................................................................................................3
Figures......................................................................................................................................................................................5
Tables....................................................................................................................................................................................... 6
4 Pin Configuration and Functions.......................................................................................................................................... 7
5 Specifications...................................................................................................................................................................... 10
5.1 Absolute Maximum Ratings (1).................................................................................................................................10
5.2 ESD Ratings.............................................................................................................................................................. 10
5.3 Recommended Operating Conditions.....................................................................................................................11
5.4 Thermal Information............................................................................................................................................... 11
5.5 Electrical Characteristics..........................................................................................................................................11
6 Detail Description............................................................................................................................................................... 16
6.1 Overview.................................................................................................................................................................. 16
6.2 Function Block Diagram...........................................................................................................................................17
6.3 Serial Interface Communication..............................................................................................................................18
6.4 Power Path...............................................................................................................................................................18
6.5 Power On/Off and reset.......................................................................................................................................... 18
6.5.1 Power on reset(POR).................................................................................................................................... 18
6.5.2 Power up from BAT...................................................................................................................................... 18
6.5.3 Power up from VBUS.................................................................................................................................... 18
6.5.4 System power on/off management............................................................................................................. 19
6.6 Multi-Power Outputs...............................................................................................................................................22
6.7 Charger.....................................................................................................................................................................23
6.7.1 Characteristics.............................................................................................................................................. 23
6.7.2 Charging condition........................................................................................................................................23
6.7.3 Charging process...........................................................................................................................................23
6.7.4 Charging protection......................................................................................................................................25
6.7.5 Charging indication.......................................................................................................................................27
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AXP2101
6.8 BATFET..................................................................................................................................................................... 27
6.9 RBFET....................................................................................................................................................................... 28
6.10 ADC.........................................................................................................................................................................28
6.11 E-Gauge..................................................................................................................................................................28
6.12 IRQ /BACKUP..........................................................................................................................................................28
6.12.1 IRQ.............................................................................................................................................................. 28
6.12.2 BACKUP....................................................................................................................................................... 29
6.13 Register.................................................................................................................................................................. 29
6.13.1 Register List.................................................................................................................................................29
6.13.2 Register Description................................................................................................................................... 31
7 Application Information......................................................................................................................................................58
7.1 Typical Application...................................................................................................................................................58
8 Package, Carrier, Storage and Baking Information............................................................................................................ 59
8.1 Package.................................................................................................................................................................... 59
8.2 Carrier...................................................................................................................................................................... 60
8.3 Storage..................................................................................................................................................................... 61
8.3.1 Moisture Sensitivity Level(MSL)................................................................................................................... 61
8.3.2 Bagged Storage Conditions.......................................................................................................................... 61
8.3.3 Out-of-bag Duration..................................................................................................................................... 61
8.4 Baking.......................................................................................................................................................................62
9 Reflow Profile......................................................................................................................................................................63

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AXP2101

FiguresFigure 4-1

Pin Map................................................................................................................................................................7

Figure 6-1

Function Block Diagram.................................................................................................................................... 17

Figure 6-2

Sleep and Wakeup.............................................................................................................................................21

Figure 7-1

Typical Application............................................................................................................................................ 58

Figure 8-1

Package Information......................................................................................................................................... 59

Figure 8-2

AXP2101 marking.............................................................................................................................................. 59

Figure 8-3

AXP2101 Tray Dimension Drawing................................................................................................................... 60

Figure 9-1

AXP2101 Typical Reflow Profile........................................................................................................................ 63

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AXP2101

TablesTable 4-1

Pin Description......................................................................................................................................................7

Table 5-1

Absolute Maximum Ratings............................................................................................................................... 10

Table 5-2

ESD Ratings......................................................................................................................................................... 10

Table 5-3

Recommended Operating Conditions................................................................................................................11

Table 5-4

Thermal Metric................................................................................................................................................... 11

Table 5-5

Electrical Characteristics.....................................................................................................................................11

Table 6-1

Features of Multi-Power Outputs...................................................................................................................... 22

Table 6-2

Charging Parameters.......................................................................................................................................... 24

Table 6-3

Relationship among temperature, equivalent resistance, detected voltage and ADC data............................ 26

Table 6-4

CHGLED Function Control...................................................................................................................................27

Table 6-5

ADC Channel and Data....................................................................................................................................... 28

Table 8-1

AXP2101 Marking Definitions.............................................................................................................................59

Table 8-2

AXP2101 Tray Carrier Information..................................................................................................................... 60

Table 8-3

AXP2101 Packing Quantity Information.............................................................................................................61

Table 8-4

MSL Summary..................................................................................................................................................... 61

Table 8-5

Bagged Storage Conditions................................................................................................................................ 61

Table 8-6Out-of-bag Duration........................................................................................................................................... 62

Table 8-7

Baking Conditions............................................................................................................................................... 62

Table 9-1

AXP2101 Reflow Profile Conditions................................................................................................................... 63

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AXP2101

4

Pin Configuration and Functions
Figure 4-1 Pin Map

Table 4-1 Pin DescriptionNO.

Pin Name

Type

Description

1

CHGLED

AO

Charge status output to indicate various charger operation.

2

VREF

P

Internal reference voltage

3

GND

AI

Analog ground for interrupt analog and digital circuits.

4

FB3

P

DCDC3 feedback pin

5

LX3

P

Inductor pin for DCDC3

6

VIN3

P

DCDC3 input source

7

VIN4

P

DCDC4 input source

8

LX4

P

Inductor pin for DCDC4

9

FB4

P

DCDC4 feedback pin and Switch input source

10

CPULDOSP

Output pin of CPULDOS

11

DLDO2/DC4SW

DO

Output pin of DLDO2,and can be configured as the Output pin of
DC4SW

12

BLDO1

P

Output pin of BLDO1

13

BLDOINPBLDO input source

14

BLDO2

P

Output pin of BLDO2

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AXP2101
15

ALDO4

P

Output pin of ALDO4

16

ALDO3

P

Output pin of ALDO3

17

ALDOINP

ALDO input source

18

ALDO1

P

Output pin of ALDO1

19

ALDO2

P

Output pin of ALDO2

20

DLDO1/DC1SW

P

Output pin of DLDO1,and can be configured as the Output pin of
DC1SW

21

FB1

P

DCDC1 feedback pin

22

LX1

P

Inductor pin for DCDC1

23

VIN1

P

DCDC1 input source

24

VIN2

P

DCDC2 input source

25

LX2

P

Inductor pin for DCDC2

26

FB2

AI

DCDC2 feedback pin

27

VBackup

P

Input pin of backup battery

28

VRTC

P

RTC power output

29

PWROK

DIO

Power good indication output

30

PWRON

DIO

Power On-Off key input，Internal 100k pull up to VINT

31

TS

AI

Temperature qualification voltage input.
Connect a negative temperature coefficient thermistor from TS to
GND.
A current source is injected to TS pin and convert TS voltage to adigital code. Charging suspends when TS pin is out of range.
Besides, TS can be connected to external input signal.

32

33

GPIO1/FB5/RTC
LDO2
BAT

DIO

P

Output pin of GPIO1 and can be configured as the Output pin of
RTCLDO2 or DCDC5 feedback pin.
Battery connection point.
The internal BATFET is connected between BAT and SYS.
Connect a 1uF capacitor closely to the BAT pin.
System connection point.

34

VSYS

P

The internal BATFET is connected between BAT and SYS. Connect two
22uF capacitors closely to the SYS pin.

35

SW

P

Inductor pin for DCDC5

36

VMID

P

VMID Power output

37

VBUS

P

Vbus

DIO

Open-drain interrupt Output.
Connect the IRQ to a logic rail via a 4.7kΩ resistor. The IRQ pin sends a
low level signal to host to report charger device status and fault.

38

IRQ

input

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AXP2101
39

SDA

DIO

Data pin for serial interface, needs a 2.2kΩ Pull High.

40

SCK

DI

SCK pin for serial interface, needs a 2.2kΩ Pull High.

EP

EP

GND

Exposed Pad, needs to be connected to system ground

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AXP21015

Specifications

5.1

Absolute Maximum Ratings (1)Table 5-1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)
SYMBOLDESCRIPTION

VBUS
Others pin (exp VBUS,
PGND, GND)

Voltage range(with respect to GND)PGND to GND

MIN

MAX

UNIT

-0.3

12

V

-0.3

7

V

-0.3

7

V

-0.3

0.3

V

Ta

Operating Temperature Range

-40

85

℃

TJ

Junction Temperature Range

-40

125

℃

Ts

Storage Temperature Range

-65

150

℃

TLEAD

Maximum Soldering Temperature (at300℃

leads，10sec)(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stressratings only. Functional operation of the device at these or any other conditions beyond those indicated under recommended
operating conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device
reliability.

5.2

ESD Ratings
Table 5-2 ESD Ratings

VESD

VALUE

UNIT

Human body model(HBM)(1)

±4000

V

Charged device model(CDM)(2)

±750

V

(1) Reference: ESDA/JEDEC JS-001-2017.
(2) Reference: ESDA/JEDEC JS-002-2018.

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AXP2101

5.3

Recommended Operating Conditions
Table 5-3 Recommended Operating Conditions

5.4

SYMBOLDESCRIPTION

MIN

MAX

UNIT

VIN

Input voltage(VBUS)

3.9

5.5

V

IIN

Input current(VBUS)

2

A

ISYS

Output current

2

A

VBAT

Battery voltage

4.4

V

IBAT

charging current

1

A

Thermal Metric(1)

VALUE

UNIT

θJA

Junction-to-ambient thermal resistance

30

θJB

Junction-to-board thermal resistance

10.8

θJC

Junction-to-case(top) thermal resistance

22.8

Thermal Information
Table 5-4 Thermal Metric℃/W(1)Thermal metrics are calculated refer to JEDEC document JESD51.

5.5

Electrical Characteristics
Table 5-5 Electrical Characteristics
SymbolParameters

Test Conditions

MIN

TYP

MAX

UNIT

QUIESCENT CURRENTS
IBAT

Battery discharge current

no VBUS, BATFET Disabled, with40

only RTCLDO onuA

VBUS/BAT POWER UP
VVBUS

VBUS operating range

VVBUS_UVLOZVBUS under voltage threshold

VVBUS_OVVSLEEPZ

VBUS over-voltage risingthresholdSleep mode rising threshold

3.9

5.5

V

3.75

V

7

V

150

mV

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AXP2101(VBUS-VBAT)VBATVBAT operating range

2.5

4.5

V

VBAT_UVLOZVBAT under voltage threshold

2.4

V

VBAT_DPLZVBAT depletion threshold

2.5

V

Battery Charger
VBATREG_RANGE Typical Charge voltage range

VBATREGICHG_REG_RANGE

ICHG_REG_ACC

Charge voltage resolution
accuracy

VBATREG= 4.0/ 4.1/ 4.2/ 4.35/
4.4V
VBAT = 4.2V, TJ = 25℃

Typical Fast charge current
regulation range
Fast charge current regulation
accuracy

ICHG=800mA,TJ = 25℃

VBATLOWV

Battery low voltage threshold Fast charge to precharge

IPRECHG_RANGE

Precharge current range

IPRECHG_ACC

Precharge current accuracy

ITERM_RANGE

Termination current range

VTRICHG
ITRICHG
VRECHG

Battery trickle charge

IPRECHG = 200mA,TJ = 25℃

4.0

4.4

-0.50%

0.50%

0

1000

-20%

20%
3

V

mA

V

0

200

-50%

50%

0

200

mA

mA

VBAT falling

2

V

Battery trickle charge current VBAT < 2 V

10

mA

100

mV

threshold

Recharge Threshold below
VBATREGVBAT falling

Input Voltage / Current Regulation
VINDPM_RANGE

VINDPM_ACC
IINLIM_RANGE
IINDPM_ACC

Typical Input voltage
regulation range
Input voltage regulation
accuracy

VINDPM=4.36V

Input current regulation range
Input current regulation
accuracyIINLIM =500mA

3.88

5.08

V

-3%

3%

100

2000

mA

350

500

mA

DCDC

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AXP2101
DCDC1/2/3/4
VIN

Input Voltage

2.6

5.5

V

-30

30

mV

-3.00%

3.00%

1.5

3.4

UVP

85%

OVP

130%
Accuracy, PWM mode,

Accuracy

Output Accuracy

VOUT<1V
Accuracy, PWM mode,
VOUT>1V

DCDC1
VOUT

Output Voltage

IOUT

Output Load Current

Output Range
Step Size

V

100

mV

2

A

DCDC2
Output Range
VOUT

IOUT

Output Voltage

0.5

1.54

V

Step Size, VOUT=0.5V~1.2V

10mV

Step Size, VOUT=1.22V~1.54V

20

mV

2

A

Output Load Current

DCDC3
Output Range
VOUT

IOUT

Output Voltage

0.5

3.4

V

Step Size, VOUT=0.5V~1.2V

10mV

Step Size, VOUT=1.22V~1.54V

20mV

Step Size, VOUT=1.6V~3.4V

100

mV

2

A

Output Load Current

DCDC4
Output Range
VOUT

IOUT

Output Voltage

Output Load Current

0.5

1.84

V

Step Size, VOUT=0.5V~1.2V

10mV

Step Size, VOUT=1.22V~1.84V

20

mV

1.5

A

DCDC5

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AXP2101
VOUT

Output Voltage

IOUT

Output Load Current

Output Range

1.2

Step Size, VOUT=1.4V~3.7V

3.7

V

100

mV

1

A

LDO
RTCLDO1/2
VOUT
IOUT

Output Voltage

VOUT=1.8/ 2.5/ 3/ 3.3V

Output voltage accuracy

1.8

3.3

-10%

+10%

Output Load Current

30

V

mA

CPUSLDO
VIN

Input Voltage

Input is DCDC4

0.8

1.84

V

Output Range

0.5

1.4

V

Step size
VOUT

Output Voltage

Accuracy,VIN=0.8V~1.84V,
VOUT<1V, Iload=10mA
Accuracy,VIN=0.8V~1.84V,
VOUT>1V, Iload=10mA

50

mV

-30

30

-3%

3%

mV

IOUT

Output Load Current

30

mA

ILIM

Current Limit

300

mA

ALDO1~4/BLDO1~2
VIN

Input Voltage

VDrop

Dropout

2.6
VOUT=3.3V
Output Range

200
0.5

Step size
VOUT

Output Voltage

5.5

V
mV

3.5
100

V
mV

Accuracy, VOUT<1V, Iload=10mA -30

30

Accuracy, VOUT>1V, Iload=10mA -3%

3%

mV

IOUT

Output Load Current

300

mA

ILIM

Current Limit

500

mA

DLDO1(DC1SW)
VIN

Input Voltage

Input is DCDC1

1.8

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3.4

V
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AXP2101
Output Range
VOUT

Output Voltage

0.5

Step size

3.3
100

V
mV

Accuracy, VOUT<1V, Iload=10mA -30

30

Accuracy, VOUT>1V, Iload=10mA -3%

3%

mV

IOUT

Output Load Current

300

mA

ILIM

Current Limit

500

mA

DLDO2(DC4SW)
VIN

Input Voltage

Input is DCDC4

1.5

1.8

V

VOUT

Output Voltage

Output Range

0.5

1.4

V

Step size

100

mV

Accuracy, VOUT<1V, Iload=10mA -30

30

Accuracy, VOUT>1V, Iload=10mA -3%

3%

mV

IOUT

Output Load Current

300

mA

ILIM

Current Limit

500

mA

TWI&IOTWI INTERFACE (SCL, SDA)
VIH

Input high threshold level, SCL
and SDA

VIL

Input low threshold level

VOL

Output low threshold level

Pull-up rail 1.8V

1.3

Pull-up rail 1.8V
Sink Current = 5mA, sinkcurrent

V
0.8

V

0.4

V

Logic I/O pin Characteristics (IRQ/PWRON/PWROK)
VIH

Input high threshold level

VIL

Input low threshold level

1.3

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V
0.8

V

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AXP2101

6

Detail Description

6.1

Overview
AXP2101 is a highly integrated power management IC(PMIC) targeting at single cell Li-battery (Li-ion or
Li-polymer) applications that require multi-channel power conversion outputs. It provides an easy andflexible power management solution for multi-core processors to meet the complex and accurate
requirements of power control.
AXP2101 supports 100mA-1A Linear charge. Besides, it supports 16 channel power outputs which include 5channel DC-DC and 11 channel LDO. To ensure the security and stability of the system, AXP2101 provides
multiple channels 14-bit ADC for voltage/temperature monitor and integrates protection circuits such as
over-voltage protection(OVP), over-current protection(OCP) and over-temperature protection(OTP).
Moreover, AXP2101 features a unique E-Gauge™ (Fuel Gauge) system, making power gauge easy and exact.
AXP2101 supports TWSI and RSB for system to dynamically adjust output voltages, charge current andconfigure interrupt condition.
AXP2101 is available in 5mm x 5mm 40-pin QFN package.

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AXP2101

6.2

Function Block Diagram
Figure 6-1 Function Block Diagram

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AXP2101

6.3

Serial Interface Communication
AXP2101 supports TWSI protocol and performs as a TWSI slave device with default address 0x68/0x69. When
AXP2101 powers on, SCK/SDA pin of TWSI will be pulled up to IO Power and then Host can adjust andmonitor AXP2101 with rich feedback information.
Besides, AXP2101 supports RSB for Allwinner platform with address 0x01D1 or 0x0273 by customer.
Note: “Host” here refers to system processor.

6.4

Power Path
VBUS as the charger input, connecting to VSYS pin through a Linear charger, provides power to system andcharges battery through BATFET. Charge current can be adjusted automatically according to the feedback
current which is detected with an internal resistor. When system current (ISYS) changes, the detected current
will change, and then the current change signal will feed back to charge loop to adjust the charge current tothe setting value.
When battery voltage is above VSYS, BATFET is turned on and PMU enters supplement mode. When insupplement mode, if the discharge current is lower than 1A, PMU controls the voltage(VDS) between systemand battery and keeps VDS at 30mV to avoid entering and exiting supplement mode repeatedly. As discharge
current increases, PMU adjusts BATFET to be fully on and VDS increases linearly. If an adapter is not inserted,
system current is provided only by battery. At this time, BATFET is at fully on state.

6.5

Power On/Off and reset

6.5.1

Power on reset(POR)
AXP2101 is powered from the higher voltage between VBUS and BAT. When VBUS voltage(VVBUS) is higher
than VVBUS_UVLOZ or BAT voltage(VBAT) is higher than VBAT_UVLOZ, the sleep comparator, battery depletioncomparator and BATFET driver are be activated. All registers are reset to the default value. TWSI
communication is active and Host can communicate with PMU.

6.5.2

Power up from BAT
If only battery is present and VBAT is higher than depletion threshold (VBAT_DPLZ), BATFET, connecting battery tosystem, is off by default and need to be turned on by pressing the PWRON key or inserting an adapter.

6.5.3

Power up from VBUS
When VBUS is inserted, PMU detects the input voltage to start up the reference voltage and the bias circuit.
When VVBUS is higher than VVBUS_UVLOZ, the VBUS insertion IRQ is sent and the register bit reg49H[7] is set to 1
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AXP2101
to indicate VBUS is inserted. Then PMU detects the input source whether it is good or not. If VBUS is good,
the RBFET is open and Vsys is working.
6.5.3.1

Good source condition
PMU needs to check the current capability of the input source. Only when the input source meets thefollowing requirements can it start the buck converter.
a. VBUS voltage is lower than VACOV
b. VBUS voltage is higher than VVBUSMIN when pulling IBADBUS(typical 30mA)
Once the input source meets the requirements above,the register bit reg00H[5](VBUS_GOOD) is set to 1 toindicate the input source is good.

6.5.3.2 Set input voltage limit(VINDPM)
AXP2101 supports wide range of input voltage(3.9V~5.5V). VINDPM can be set through reg15H[3:0]. The rangeof VINDPM is from 3.88V to 5.08V and the step is 80mV.
When VBUS voltage reaches VINDPM, the charge current will decrease automatically until the current is zero. If
ISYS is over the input power supply capability, VSYS will drop. If VBAT is above VSYS, PMU will enter the
supplement mode.
6.5.3.3

Set input current limit(IINLIM)
AXP2101 supports input current limit to avoid adaptor overload. IINLIM can be set as 100mA, 500mA, 900mA,
1A, 1.5A and 2A through reg16H[2:0].

6.5.4

System power on/off management
PMU has power off and power on status. When at off state, all voltage outputs are turned off except RTCLDO .
At this time, if only battery is present, the total power consumption is typically 40uA.

6.5.4.1 Power on-off Key (POK)
EN/PWRON pin can be configured as PWRON pin or EN pin by customization. The default is PWRON pin. The
Power on-off Key (POK) can be connected between PWRON pin and GND of AXP2101. AXP2101 canautomatically identify the four status (Long-press, Short-press, Negative edge, Positive edge) and thencorrespond respectively.
6.5.4.2 Power on
1.

When EN/PWRON pin is configured as PWRON pin, power on sources include:

1)

POK. AXP2101 can be powered on by pressing and holding POK for a period of time that longer than
“ONLEVEL”.

2)

VBUS low go high. The function can be configured by customization.

3)

VBAT low go high. The function can be configured by customization.

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AXP2101
4)

IRQ Low level. IRQ pin is low level for more than 16ms, AXP2101 will be powered on.The function can be
configured by customization.

5)

Battery is charged to normal (Vbat>3.3V and is charging). The function can be configured bycustomization.

2.

When EN/PWRON pin is customized as EN pin, AXP2101 can be powered on by EN pin from low tohigh(0.6V).

After power on, DCDC and LDO will be soft booted in preset timing sequence. When IRQ low level power on,
AXP2101 can be configured for fast power on by REG2B, and the DCDCs/LDOs start sequence can be
configured by REG28H~REG2BH.
6.5.4.3 Power Off
1.

When EN/PWRON pin is configured as PWRON pin, power off sources include:

1)

POK. AXP2101 can be powered off by pressing and holding POK for a period of time that longer than
“OFFLEVEL”. The function can be configured by REG22H[1] and REG22H[3:2] decides whether the PMU
auto turns on or not when it shuts down after OFFLEVEL POK.

2)Write “1” to REG10H[0].

3)

VSYSGOOD high go low. When VSYS<VOFF or VBUS>7V, AXP2101 will be powered off. The default of
VOFF is 2.6V which can be configured by REG24H[2:0].

4)

The output voltage of DCDC is 15% lower than the setting value. The function can be configured by
REG23H[4:0].

5)

The output voltage of DCDC is much larger than their setting. The function can be configured by
REG23H[5].

6)Die temperature is over the warning level2(145℃). The function can be configured by REG22H[2].

2.

When EN/PWRON pin is customized as EN pin, AXP2101 can be powered off by EN pin from high to low.

6.5.4.4 Sleep and wakeup
When the running system needs to enter Sleep mode, Maybe one or several power outputs should bedisabled or changed to other voltage. Wakeup can be initiated by the following sources:
1.

Software wakeup (REG26H[1] is set to 1)

2.

IRQ pin wakeup (REG 26H[4] =1 and IRQ pin is low level for more than 16ms)

These sources will make the all the PMU power outputs resume to the default voltage or the setting voltage,
which is configured by REG26H[2], and all shutdown powers will resume by the startup sequence.
See the control process under sleep and wakeup modes as below.

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AXP2101
Figure 6-2 Sleep and Wakeup

Write “1” to REG26H [0] tostart the Wakeup, and PMU
will record the configuration of
REG80H, REG90H,REG91H

Write REG80H, REG90H,
REG91H, Disable corresponding
power or modify the voltage

Sleep and wait to be Wakeup

N
WakeupsourcesY
All power resume to thedefault or setting voltage
6.5.4.5 Reset
The PMU has system reset and power on reset.
System reset

System reset means the registers will be reset when PMU is powered on. at system reset state, all voltage
outputs are turned off except RTCLDO and VREF. There are three ways of system reset.
PWROK drive low.
The PWROK pin can be used as the reset signal of application system. During AXP2101 startup, PWROK
outputs low level, which will be pulled up to startup the system after output voltage reaches the regulated
value.
When application system works normally, If the PWROK pin is driven low by external key or other reasons,the PMU will be restarted. The function can be configured by REG10H[3].
1.

Write “1” to REG10H[1] to restart the PMU.

2.

Watchdog timeout. The function can be configured by REG18H[0] and REG19H[5:4]
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AXP2101Power on reset

Power on reset means the registers will be reset when PMU is powered up. at power on reset state, allvoltage outputs are turned off including RTCLDO and VREF.

6.6

Multi-Power Outputs
The following table has listed the multi-power outputs and their functions of AXP2101.
Table 6-1 Features of Multi-Power Outputs
Output PathType

Default Voltage

Startup
Sequence

Application
Suggestion

Load
Capacity(Max)

DCDC1

BUCK

3.3V

3

IO/USB

2000mA

DCDC2

BUCK

0.9V

3

CPU

2000mA

DCDC3

BUCK

0.9V

2

VSYS

2000mA

DCDC4

BUCK

1.1V

1

DDR

1500mA

DCDC5

BUCK

1.2V

OFF

N/A

1000mA

ALDO1

LDO

1.8V

3

N/A

300mA

ALDO2

LDO

2.8V

OFF

N/A

300mA

ALDO3

LDO

3.3V

3

N/A

300mA

ALDO4

LDO

2.9V

OFF

N/A

300mA

BLDO1

LDO

1.8V

OFF

N/A

300mA

BLDO2

LDO

2.8V

OFF

N/A

300mA

DLDO1

LDO

3.3V

OFF

N/A

300mA

DLDO2

LDO

1.2V

OFF

N/A

300mA

VCPUS

LDO

0.9V

1

CPUs/Reference of
DDR

30mA

RTC-LDO1

LDO

1.8V

Always on

RTC

30mA

RTC-LDO2

LDO

OFF

OFF

N/A

30mA

AXP2101 includes 5 synchronous step-down DCDCs, 11 LDOs and one switch. The work frequency of DC-DC
1/4 is 3MHz and DCDC2/3/5 is 1.5MHz. External small inductors and capacitors can be connected. In addition,
4-ch DCDCs can be set in fixed PWM mode or auto mode (automatically switchable according to the load).
See register REG81H.

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AXP2101
DCDC2/3 has DVM enable option. In DVM mode, when there is a change in the output voltage, DCDC willchange to the new targeted value step by step. It supports two kinds of DVM slope: 1 step/15.625us and1step/31.250us. The slope can be chosen by REG80H[5].
AXP2101 can configure the default voltage, the startup sequence and other control of all power output.
Startup sequence：The startup sequence has eight levels from 0 to 7. When the sequence is 0, it means theoutput is booted at the first step. When the sequence code is 1, it means the output is booted at the second
step. When the sequence is 7, it means the output is not booted.
Default voltage setting: The default voltage of each channel can be set to each step within the output range.

6.7

Charger

6.7.1

Characteristics


Range of input voltage:3.9V~5.5V, PWM charger, supports single cell Li-batteryPrecharge current settable (IPRECHG, reg61H[3:0]), default:125mA, range: 0mA~200mA,step:25mA

Fast charge current settable (ICHG, reg62H[4:0]), default:300mA, range: 0mA~200mA, step:25mA,
200~1000mA, step:100mA

6.7.2

6.7.3



Target charge voltage settable (VREG, reg64H[2:0]), default:4.2V, range: 4.0V/4.1V/4.2V/4.35V/4.4VAccuracy of target voltage:±0.5%(testing ambient temperature:25℃,target voltage:4.2V)

Charging condition


VBUS is present and available, VVBUS>VBAT+VSLEEPZ

Input source detection finishes (reg00H[5] =1)

Charging is enabled (reg18H[1] =1)



Die temperature is lower than the warning level2(145℃)

When TS pin is used to detect battery temperature, battery temperature is within the chargeable range

VBAT is lower than VBAT_OVPNo charger safety timer fault

Charging process
When PMU meets all charging conditions, it can complete the whole charging process without theparticipation of Host. The charging status can be known from the register bits reg01H[2:0]. The default valuesof charging parameters are shown as following. Host can modify registers to optimize the values through
TWSI.
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AXP2101
Table 6-2 Charging Parameters
Parameter

Default value

Charging voltage

4.2V

Charging current

300mA

Pre-charging current

125mA

Termination current

125mA

Temperature profile

Cold/hot

Safety timer

12hours

6.7.3.1 Pre-charge
When VBAT is lower than VBATLOWV(3V), the charger is under pre-charge mode where charging current is limited
to a value of IPRE-CHG. Safety time is set through reg67H[1:0] and its default value is 50 minutes. If pre-charge
process times out, PMU will stop charging and send a corresponding IRQ to Host. The function of safety timer
can be disabled through reg67H[2].
6.7.3.2 Constant current charge
Once VBAT is higher than VBATLOWV and lower than VREG, the charger is under constant current charge mode. It
will charge with constant current ICHG.
6.7.3.3 Constant voltage charge
When VBAT reaches target voltage (VREG), the charger enters constant voltage charge mode. In this stage, thecharger keeps the output voltage constant and step down charging current gradually, in order to fully charge
battery.
When VBAT is above VRECHG and the charging current reduces under termination current (ITERM), AXP2101
reports charger done, stops charging (charger enable bit is still 1) and turns off BATFET. Meanwhile, IRQ issent to Host.
When AXP2101 is in regulation of input current, input voltage or temperature, the function of charging
termination configured through reg63H[4] is temporarily disabled and the speed of safety timer slows down.
Whether to set safety timer during DPM or thermal regulation depends on reg67H[7].
6.7.3.4 Re-charge
After charge done, if VBAT falls below VRECHG, PMU will automatically enable charger without reinserting
adapter.
No matter whether VBAT is above VRECHG or not, the charger is enabled when an adapter is inserted.

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AXP2101
6.7.3.5 Battery detection
As long as an AC adapter is present and usable, battery detection will be enabled to detect whether battery isconnected. Battery detection function is enabled by default and can be disabled through reg68H[0]. If thefunction is disabled, PMU considers that battery is always present. The detection result is saved in reg00H[3]6.7.4

Charging protection

6.7.4.1 charger safety timer
Once starting pre-charge mode, PMU will enable timer1. If PMU cannot enter constant current charge mode
from pre-charge within 50min (set through reg67H[1:0]), PMU will enter battery safe mode and send IRQ to
indicate the battery may be damaged.
When the charger enters into constant current charge mode, PMU will enable timer2. If PMU cannot finish
the whole charge cycle within 12 hours (set through reg67H[5:4]), PMU will enter battery safe mode andsend IRQ to indicate the battery may be damaged.
Timing speed of timer1 or timer2 is relevant with actual charge current. The smaller the actual charge current,
the slower timing speed is.
6.7.4.2 Battery safe mode
In battery safe mode, the charger always charges with 10mA current. PMU can quit battery safe mode with
one of the following methods:
VBAT>VRECHG



Adapter removal



Charger enable bit (reg18H[1]) is reset to 1



Safety timer1 enable bit or safety timer2 enable bit is reset to 1

6.7.4.3 PMU die temperature protection
AXP2101 has built-in temperature protection function through ADC to monitor internal temperature.
Under charging mode, the temperature point of thermal regulation can be set through reg65H[1:0]. Whendie temperature rises up to the setting point, the charging current will be decreased to decrease heat. Whenthermal regulation works, actual charge current is lower than the setting value and thermal regulation
status(reg00H[1]) is set to 1. If die temperature rises up to TSHUT (145℃), IRQ is sent, PMU is poweroff. Whendie temperature falls below hysteretic threshold (120℃), PMU is not poweron automatically.
6.7.4.4 Battery temperature protection
AXP2101 can monitor battery temperature, when TS pin is used to detect battery temperature and parallelwith charger(reg50H[4]=0). The battery temperature sensitive resistor is connected between TS pin and GND.
The suggestion resistance should be 10Kohm at 25℃ ambient temperature. Through TS pin, PMU outputs
constant current which can set through reg50H[1:0] to adapt different resistance. When the resistance is
10Kohm, the current should be set to 50uA. The enable bit of TS current source is configured throughCopyright©Shenzhen X-Powers Technology Co., Ltd. All Rights Reserved.

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AXP2101
reg50H[3:2]. When current passes through the temperature sensitive resistor, PMU gets a detected voltage
and calculates its value through ADC circuit. Take for example, TH11-3H103F temperature sensitive resistor of
Mitsubishi Company. Using 50uA current source, the relationship among temperature, equivalent resistance,
detected voltage and ADC data is as following.
Table 6-3 Relationship among temperature, equivalent resistance, detected voltage and ADC data
Temperature

equivalent resistancedetected voltage

ADC DATA-20℃

63.00Kohm

3.150V

189Ch

-15℃

50.15Hohm

2.508V

1398h

-10℃

40.26Kohm

2.013V

FBAh-5℃

32.55Kohm

1.628VCB8h

0℃

26.49Kohm

1.325V

A5Ah

5℃

21.68Kohm

1.084V878h

10℃

17.78Kohm

0.889V

6F2h

15℃

14.63Kohm

0.732V

5B8h

20℃

12.07Kohm

0.604V

4B8h

25℃

10.00Kohm

0.500V

3E8h

30℃

8.320Kohm

0.416V340h

35℃

6.954Kohm

0.348V

2B8h

40℃

5.839Kohm

0.292V248h

45℃

4.924Kohm

0.246V

1ECh

50℃

4.171Kohm

0.209V

1A2h

55℃

3.549Kohm

0.177V162h

60℃

3.032Kohm

0.152V130h

During battery charging process, if TS pin voltage is lower than VHTF-CHG or higher than VLTF-CHG(VHTF-CHG and VLTF-CHG can be set through reg55H and reg54H. The default value of VLTF-CHG is set
around 0℃ and VHTF-CHG around 45℃), which indicates battery temperature is too high or too low, thenthe charger is paused and IRQ is sent to notify Host. When battery temperature is back to the normal range,
the charger will recovery automatically.
During battery discharging mode, if TS pin voltage is lower than VHTF-WORK or higher than VLTF-WORK(VHTF-WORK and VLTF-WORK can be set through reg57H and reg56H. The default value of VLTF-WORK is set
around -10℃ and VHTF-WORK around 55℃), which indicates battery temperature is too high or too low,then the boost is paused and IRQ is sent to notify Host. When battery temperature is back to the normal
range, the boost will recovery automatically.

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AXP2101High temperature protection threshold hysteresis for VHTF-CHG and VHTF-WORK can be set through reg53H.
Low temperature protection threshold hysteresis for VLTF-CHG and VLTF-WORK can be set through reg52H.
The range of temperature detection can be expanded by adding more resistors.
Some battery may have no temperature sensitive resistor. Under this situation, TS pin can be pulled down to
GND with a 10Kohm resistor externally or set as external input of ADC through register.

6.7.5

Charging indication
CHGLED pin uses open-drain/push-pull output method. It is internally pulled up to LDO. Its output drive
capability is above 10mA. Detail function control is shown as the following table.
Table 6-4 CHGLED Function Control
Hi-Z

Charger internal abnormal alarm(including timer

REG69H[2:1] = 00
(Type A CHGLED)

25% 1Hz pull low/Hi-Z jump

Open Drain

out、die temperature over temperature、battery
temperature out of charging range)

REG69H[2:1] = 01

25% 4Hz pull low/Hi-Z jump

Input source or battery over voltage

Pull low

Charging

Hi-Z

No VBUS, and power supply by battery

25% 1Hz pull low/Hi-Z jump

Charging

25% 4Hz pull low/Hi-Z jump

Alarm, including input source or battery overvoltage, battery temperature out of charging
range, timer out ,die temperature overtemperature(Type B CHGLED)Open Drain
Pull low
REG69H[2:1]=10
Cfg chgled

No charging(conditions are not met or battery
charged)No battery or charge finished, and power supply
by VBUSThe output status is controlled by REG69H[5:4]

Note: LED is on when CHGLED is low.

6.8

BATFET
BATFET connects system and battery. The on-resistance is low to 50mohm (point to point).

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AXP2101

6.9

RBFET
RBFET connects VMID and VBUS. The on-resistance is low to 100mOhm (point to point). It supports input andoutput current limit function. In charger mode, the input current limit value of RBFET is set throughreg16H[2:0].

6.10 ADCAXP2101 has a low speed 14 Bits SAR ADC for measuring BAT voltage, Vbus voltage, Vsys voltage, TS voltage
and die temperature.
Table 6-5 ADC Channel and Data
No.

Channel function

000H

001H

002H

…

FFFH

0

VBAT voltage

0mV

1mV

2mV

…

8.192V

1

VBUS voltage

0mV

1mV

2mV

…

8.192V

2

VSYS voltage

0mV

1mV

2mV

…

8.192V3

TS voltage

0mV

0.5mV

1mV

…

4.096V4

die temperature

0mV

0.1mV

2mV

…

0.8192V

Note: ADC data is 14 bits. In order to get the complete data, TWSI must read the high 6 bits firstly and thenthe low 8 bits.

6.11 E-Gauge
The Fuel Gauge system is able to export information about battery capacity percentage (regA4H) and Battery
Voltage (reg34H, reg35H). The Fuel Gauge can be enabled or disabled through reg18H[3]. The Battery low
warning level can be set through reg1AH, and IRQ will be sent out to alert the platform when the battery
capacity percentage is lower than the warning level set through reg1AH.
Once a default battery is selected for a particular design, it is highly recommended to program the battery
module to achieve better Fuel Gauge accuracy. Once the battery module data are available, user can writethese information to battery parameter (REGA1H) after brom is enabled on each boot. Additionally, the Fuel
Gauge system is capable to learn the battery characteristic automatically.

6.12 IRQ /BACKUP
6.12.1 IRQ
AXP2101 has an IRQ pin which is used to indicate whether there interrupt events occur.
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AXP2101PMU Interrupt Controller monitors the trigger events such as over voltage, over current, PWRON pin signal,
over temperature and so on. When the events occur and their IRQ enabled bits are set to 1 (Refer to registers
reg40H/41H/42H), corresponding IRQ status will be set to 1 (Refer to registers reg48H/49H/4AH), and IRQ pin
will be pulled down. When Host detects triggered IRQ signal, Host will scan through the IRQ Status registers
and respond accordingly. Meanwhile, Host will reset the IRQ status by writing “1” to status bit.

6.12.2 BACKUPAXP2101 has a backup pin which is used to connect backup battery. It is the source of RTCLDO1 when pmu
has only backup battery.
When PMU is power on, the backup battery also can be charged by configuring reg18H[2] . The charger isworking under linear mode with 100uA charge current and the termination voltage can be configured by
reg6AH in range from 2.6V to 3.3V (default 2.9V).
The backup pin can also be configured for the RTCLDO2 by customization.

6.13 Register
6.13.1 Register List
Address

Description

R/W

0X00

PMU status1

R

0X01

PMU status2

R

0X04-0X07

DATA BUFFER

RW

0X10

PMU common configure

RW

0X12

BATFET control

RW

0X13

Die temperature control

RW

0X14

Minimum system voltage control

RW

0X15

Input voltage limit control

RW

0X16

Input current limit control

RW

0X17

Reset the fuel gauge

RW

0X18

Charger, fuel gauge , watchdog on/off control

RW

0X19

Watch dog control

RW

0X1A

Low Battery warning

0X20

PWRON status

R

0X21

PWROFF status

R

0X22

PWROFF_EN

RW

0X23

PWROFF of DCDC OVP/UVP control

RW

threshold setting

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AXP2101
Address

Description

R/W

0X24

Vsys voltage for PWROFF threshold setting

RW

0X25

PWROK setting and PWROFF sequence control

RW

0X26

Sleep and wakeup control

RW

0X27

IRQLEVEL/OFFLEVEL/ONLEVEL setting

RW

0X28

Fast pwron setting 0

RW

0X29

Fast pwron setting 1

RW

0X2A

Fast pwron setting 2

RW

0X2B

Fast pwron setting and control

RW

0X30

ADC Channel enable control

RW

0X34-3D

ADC data

RW

0X40-0X42

IRQ Enable

RW

0X48-0X4A

IRQ Status

RW

0X50

TS pin CTRL

RW

0X52

TS_HYSL2H setting

RW

0X53

TS_HYSH2L setting

RW

0X54

VLTF_CHG setting

RW

0X55

VHTF_CHG setting

RW

0X56

VLTF_WORK setting

RW

0X57

VHTF_WORK setting

RW

0X58

JIETA standard Enable control

RW

0x59-0X5B

JIETA standard setting

RW

0X61

Iprechg

RW

0X62

ICC charger setting

RW

0X63

Iterm charger setting and control

RW

0X64

CV charger voltage setting

RW

0X65

Thermal regulation threshold setting

RW

0X67

Charger timeout setting and control

RW

0X68

Battery detection control

RW

0X69

CHGLED setting and control

RW

0X6A

Button battery charge termination voltage setting

RW

0X80

DCDCS ON/OFF and DVM control

RW

0X81

DCDCS force PWM control

RW

0X82-0X86

DCDCs voltage setting

RW

charger setting

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AXP2101
Address

Description

R/W

0X90-0X91

LDOS ON/OFF control

RW

0X92-0X9A

LDOS voltage setting

RW

0XA1

Battery parameter

RW

0XA2

Fuel gauge control

RW

0XA4

Battery percentage data

R

6.13.2 Register Description
6.13.2.1 REG 00：PMU status1
Bit

Description

7:6

R/W

Reset

Default

RO

/

0

RO

POR

0

RO

POR

0

VBUS good indication
5

0：not good

1：good4

BATFET state
0: close

1: open3

Battery present state
0: absent
1: present

RO

POR

0

2

Battery in Active Mode
0: in Normal
1: in Active Mode

RO

POR

0

1

Thermal regulation status
0: normal
1: in thermal regulation

RO

POR

0

0

Current Limit state
0: not in current limit state

RO

POR

0

R/W

Reset

Default

RO

/

0

RO

POR

0

RO

POR

0

RO

POR

0

RO

POR

0

1: in current limit state

6.13.2.2 REG 01：PMU status2
Bit

Description

7
6:5

Battery Current Direction
00: Standby
10: discharg

01: charge
11: reserved

4

System status indication
0: System is power off.

1: System is power on.

3

VINDPM status
0: not in VINDPM

1: VINDPM

2:0

charging status
000: tri_charge

001: pre_charge

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AXP2101
010: constant charge(CC)100: charge done
11X: reserved

011: constant voltage(CV)101: not charging

6.13.2.3 REG 04：DATA_BUFFER 0
Bit

Description

R/W

Reset

Default

7:0

data buffer

RW

POR

00h

6.13.2.4 REG 05：DATA_BUFFER 1
Bit

Description

R/W

Reset

Default

7:0

data buffer

RW

POR

00h

6.13.2.5 REG 06：DATA_BUFFER 2
Bit

Description

R/W

Reset

Default

7:0

data buffer

RW

POR

00h

6.13.2.6 REG 07：DATA_BUFFER 3
Bit

Description

R/W

Reset

Default

7:0

data buffer

RW

POR

00h

R/W

Reset

Default

RW

/

0b

RW

POR

1b

RW

/

1b

6.13.2.7 REG 10：PMU common configuration
Bit

Description

7:6
5

Internal off-discharge enable for DCDC & LDO & SWITCH
0: disable
1: enable

4
3

PWROK PIN pull low to Restart the System
0: disable
1: enable

RW

POR

0b

2

PWRON 16s to shut the PMIC enable
0: disable
1: enable

RW

POR

0b

1

Restart the SoC System, POWOFF/POWON and reset the related
registers
0: normal
1: reset

RWAC

POR

0b

0

Soft PWROFF
0: Normal

RWAC

POR

0b

1: PWROFF

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AXP2101
6.13.2.8 REG 12：BATFET control
Bit

Description

R/W

Reset

Default

RO

/

0

2:1

DIE Over Temperature Protection Level1 Configuration
00: 115deg
01: 125deg
10: 135deg
11: reserved

RW

POR

01b

0

DIE Temperature Detect Enable
0: disable
1: enable

RW

POR

1b

R/W

Reset

Default

RO

/

0

2:1

DIE Over Temperature Protection Level1 Configuration
00: 115deg
01: 125deg
10: 135deg
11: reserved

RW

POR

01b

0

DIE Temperature Detect Enable
0: disable
1: enable

RW

POR

1b

R/W

Reset

Default

RO

/

0

RW

POR

110b

RO

/

0

R/W

Reset

Default

RO

/

RW

POR

7:3

6.13.2.9 REG 13：Die temperature control
Bit

Description

7:3

6.13.2.10 REG 14：Minimum system voltage control
Bit

Description

7

6:4

Linear Charger Vsys voltage dpm
4.1+N*0.1 V
000: 4.1V
001: 4.2V
011: 4.4V
100: 4.5V
110: 4.7V
111: 4.8V

010: 4.3V
101: 4.6V

3:0
6.13.2.11 REG 15：Input voltage limit control
Bit

Description

7:4

3:0

VINDPM configuration:
3.88+N*0.08 V
0000: 3.88V
0001: 3.96V
0011: 4.12V
0100: 4.20V
0110: 4.36V
0111: 4.44V
1000: 4.52V

1001: 4.60V

0010: 4.04V
0101: 4.28V

0110b1010: 4.68V

Copyright©Shenzhen X-Powers Technology Co., Ltd. All Rights Reserved.

33

AXP2101
1011: 4.76V

1100: 4.84V

1110: 5.00V

1111: 5.08V

1101: 4.92V

6.13.2.12 REG 16：Input current limit control
Bit

Description

7:3

2:0

Input current limit
000: 100mA
001: 500mA
011: 1000mA
100: 1500mA
110-111: reserved

010: 900mA
101: 2000mA

R/W

Reset

Default

RO

/

RW

POR

100b

R/W

Reset

Default

RO

/

0

RWAC

POR

0b

RW

POR

0b

RO

/

0

R/W

Reset

Default

RO/0

6.13.2.13 REG 17：Reset the fuel gauge
Bit

Description

7:4
3

reset the gauge
0: normal2

reset the gauge besides registers
0: normal
1: reset

1: reset

1:0
6.13.2.14 REG 18：Charger, fuel gauge, watchdog on/off control
Bit

Description

7:4
3

Gauge Module enable
0: disable
1: enable

RW

POR

1b

2

Button Battery charge enable
0: disable
1: enable

RW

System
Reset

0b

1

Cell Battery charge enable
0: disable
1: enable

RW

System
Reset

1b

0

Watchdog Module enable
0: disable
1: enable

RW

System
Reset

0b

R/W

Reset

Default

RO

/

0

RW

POR

0b

6.13.2.15 REG 19：Watchdog control
Bit

Description

7:6
5:4

Watchdog Reset Configuration
00: IRQ only
01: IRQ and System Reset

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34

AXP2101
10: IRQ, System Reset and Pull down PWROK 1s
11: IRQ, System Reset, DCDC/LDO PWROFF & PWRON
3

watchdog clear signal
0: normal
1: clear

2:0

TWSI watchdog timer configuration
000: 1s
001: 2s
011: 8s
100: 16s
110: 64s
111: 128s

010: 4s
101: 32s

RWAC

POR

0b

RW

POR

110b

6.13.2.16 REG 1A：Low Battery warning threshold setting
Bit

Description

R/W

Reset

Default

7:4

low battery warning threshold
5-20%, 1% per step
0000: 5%0001: 6%……
1111: 20%

RW

POR

1010b

3:0

low battery shutdown threshold
0-15%, 1% per step
0000: 0%0001: 1%……
1111: 15%

RW

POR

0001b

R/W

Reset

Default

RO/0

6.13.2.17 REG 20：PWRON status
Bit

Description

7:6
5

POWERON always high when EN Mode as POWERON Source
0: no
1: yesRO

System
Reset

0b

4

Battery Insert and Good as POWERON Source
0: no
1: yesRO

System
Reset

0b

3

Battery Voltage > 3.3V when Charged as Source
0: no
1: yesRO

System
Reset

0b

2

Vbus Insert and Good as POWERON Source
0: no
1: yesRO

System
Reset

0b

1

IRQ PIN Pull-down as POWERON Source
0: no
1: yesRO

System
Reset

0b

0

POWERON low for on level when POWERON Mode as
POWERON Source
0: no
1: yesRO

System
Reset

0b

R/W

Reset

Default

6.13.2.18 REG 21：PWROFF status
Bit

Description

Copyright©Shenzhen X-Powers Technology Co., Ltd. All Rights Reserved.

35

AXP2101
7

Die Over Temperature as POWEROFF Source
0: no
1: yes

RO

POR

0b

6

DCDC Over Voltage as POWEROFF Source
0: no
1: yes

RO

POR

0b

5

DCDC Under Voltage as POWEROFF Source
0: no
1: yes

RO

POR

0b

4

VBUS Over Voltage as POWEROFF Source
0: no
1: yes

RO

POR

0b

3

Vsys Under Voltage as POWEROFF Source
0: no
1: yes

RO

POR

0b

2

POWERON always low when EN Mode as POWEROFF Source
0: no
1: yes

RO

POR

0b

1

Software configuration as POWEROFF Source
0: no
1: yes

RO

POR

0b

0

POWERON Pull down for off level when POWERON Mode as
POWEROFF Source
0: no
1: yes

RO

POR

0b

R/W

Reset

Default

RO/0

6.13.2.19 REG 22：PWROFF_EN
Bit

Description

7:3
2

DIE Over-Temperature(LEVEL2) as POWEROFF Source enable
0: disable
1: enable

RW

POR

1b

1

PWRON > OFFLEVEL as POWEROFF Source enable
0: disable
1: enable

RW

POR

EFUSE

0

Function Select when btn_pwroff_en=1 and button power-off
occur
0: Power-off
1: Restart

RW

POR

EFUSE

R/W

Reset

Default

RO

/

0

RW

POR

1b

RW

POR

1b

6.13.2.20 REG 23：PWROFF of DCDC OVP/UVP control
Bit

Description

7:6
DCDC 120%(130%) high voltage turn off PMIC function
5

0：disable

1：enable

DCDC5 85% low voltage turn off PMIC function
4

0：disable

1：enable

Copyright©Shenzhen X-Powers Technology Co., Ltd. All Rights Reserved.

36

AXP2101
DCDC4 85% low voltage turn off PMIC function
3

RW

POR

1b

RW

POR

1b

RW

POR

1b

RW

POR

1b

R/W

Reset

Default

RO

/

0

RW

POR

EFUSE

R/W

Reset

Default

R0

/

0

4

Check the PWROK Pin enable after all dcdc/ldo output valid
128ms
0: disable
1: enable

RW

POR

1b

3

POWEROFF Delay 4ms after PWROK disable
0: disable
1: enable

RW

POR

1b

2

POWEROFF Sequence Control
0: At the same time
1: the reverse of the Startup

RW

POR

0b

1:0

Delay of PWROK after all power output good
00: 8ms
01: 16ms
10: 32ms
11: 64ms

RW

POR

EFUSE

R/W

Reset

Default

R0/

0

0：disable

1：enable

DCDC3 85% low voltage turn off PMIC function
2

0：disable

1：enable

DCDC2 85% low voltage turn off PMIC function
1

0：disable

1：enable

DCDC1 85% low voltage turn off PMIC function
0

0：disable

1：enable

6.13.2.21 REG 24：Vsys voltage for PWROFF threshold setting
Bit

Description

7:3

2:0

Battery Voltage for POWEROFF
2.6~3.3V,0.1V/step,8steps
000: 2.6V
001: 2.7V……
111: 3.3V

6.13.2.22 REG 25：PWROK setting and PWROFF sequence control
Bit

Description

7:5

6.13.2.23 REG 26：Sleep and wakeup control
Bit
7:5

Description

Copyright©Shenzhen X-Powers Technology Co., Ltd. All Rights Reserved.

37

AXP2101
4

IRQ Pin low to Wakeup
0: disable
1: enable

RW

POR

0b

3

PWROK be low-level enable when Wakeup
0: disable
1: enable

RW

POR

1b

2

DCDC/LDO Voltage Select when Wakeup
0: The Default 1: The voltage before wakeup

RW

POR

0b

1

Wake Up enable
0: disable
1: enable

RWLC

System
Reset

0b

0

SLEEP enable
0: disable

RWLC

System
Reset

0b

R/W

Reset

Default

R0

/

0

5:4

IRQLEVEL configuration
00: 1s01: 1.5s
10: 2s
11: 2.5s

RW

POR

01b

3:2

OFFLEVEL configuration
00: 4s
01: 6s
10: 8s
11: 10s

RW

POR

01b

1:0

ONLEVEL configuration
00: 128ms
01: 512ms
10: 1s
11: 2s

RW

POR

EFUSE

1: enable

6.13.2.24 REG 27：IRQLEVEL/OFFLEVEL/ONLEVEL setting
Bit

Description

7:6

6.13.2.25 REG 28：Fast pwron setting 0
Bit

Description

R/W

Reset

Default

7:6

DCDC4 Fast Power On Start Sequence
00~10: Start Sequence Code
11: disable

RW

POR

0b

5:4

DCDC3 Fast Power On Start Sequence
00~10: Start Sequence Code
11: disable

RW

POR

0b

3:2

DCDC2 Fast Power On Start Sequence
00~10: Start Sequence Code
11: disable

RW

POR

0b

1:0

DCDC1 Fast Power On Start Sequence
00~10: Start Sequence Code
11: disable

RW

POR

0b

6.13.2.26 REG 29：Fast pwron setting 1
Bit

Description

R/W

Reset

Default

7:6

ALDO3 Fast Power On Start Sequence

RW

POR

0b

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38

AXP210100~10: Start Sequence Code

11: disable

5:4

ALDO2 Fast Power On Start Sequence
00~10: Start Sequence Code
11: disable

RW

POR

0b

3:2

ALDO1 Fast Power On Start Sequence
00~10: Start Sequence Code
11: disable

RW

POR

0b

1:0

DCDC5 Fast Power On Start Sequence
00~10: Start Sequence Code
11: disable

RW

POR

0b

6.13.2.27 REG 2A：Fast pwron setting 2
Bit

Description

R/W

Reset

Default

7:6

CPUSLDO Fast Power On Start Sequence
00~10: Start Sequence Code
11: disable

RW

POR

0b

5:4

BLDO2 Fast Power On Start Sequence
00~10: Start Sequence Code
11: disable

RW

POR

0b

3:2

BLDO1 Fast Power On Start Sequence
00~10: Start Sequence Code
11: disable

RW

POR

0b

1:0

ALDO4 Fast Power On Start Sequence
00~10: Start Sequence Code
11: disable

RW

POR

0b

6.13.2.28 REG 2B：Fast pwron setting 3
Bit

Description

R/W

Reset

Default

7

Fast Power On Enable
0: disable
1: enable

RW

POR

0b

6

Fast Wake up Enable
0: disable
1: enable

RW

POR

0b

RO

/

0b

5:4
3:2

DLDO2 Fast Power On Start Sequence
00~10: Start Sequence Code
11: disable

RW

POR

0b

1:0

DLDO1 Fast Power On Start Sequence
00~10: Start Sequence Code
11: disable

RW

POR

0b

R/W

Reset

Default

R0/0

6.13.2.29 REG 30：ADC Channel enable control
Bit0

Description

7:6
5

general purpose ADC channel enable
0: disable
1: enable

RW

POR

0b

4

die temperature measure ADC channel enable

RW

POR

0b

Copyright©Shenzhen X-Powers Technology Co., Ltd. All Rights Reserved.

39

AXP2101
0: disable

1: enable

3

system voltage voltage measure ADC channel enable
0: disable
1: enable

RW

POR

0b

2

vbus voltage measure ADC channel enable
0: disable
1: enable

RW

POR

0b

1

TS pin measure ADC channel enable
0: disable
1: enable

RW

POR

1b

0

battery voltage measure ADC channel enable
0: disable
1: enable

RW

POR

1b

6.13.2.30 REG 34：vbat_h
Bit

Description

R/W

Reset

Default

7:6

ch_dbg_en_l is ch_dbg_en[1:0]ch_dbg_en:
000: disable
001: vbat use all channels
010: ts use all channels
011: vbus use all channels
100: vsys use all channels 101: tdie use all channels
110: gpadc use all channels 111: reserved

RW

POR

0b

5:0

vbat[13:8]

RO

POR

0b

6.13.2.31 REG 35：vbat_l
Bit

Description

R/W

Reset

Default

7:0

vbat[7:0]

RO

POR

0b

6.13.2.32 REG 36：ts_h
Bit

Description

R/W

Reset

Default

7

ADC in low frequency sample mode when PWROFF and Battery
only enable(64s)
0: disable
1: enable

RW

POR

1b

6

ch_dbg_en_h is ch_dbg_en[2]

RW

POR

0b

5:0

ts[13:8]

RO

POR

0b

6.13.2.33 REG 37：ts_l
Bit

Description

R/W

Reset

Default

7:0

ts[7:0]

RO

POR

0b

Copyright©Shenzhen X-Powers Technology Co., Ltd. All Rights Reserved.

40

AXP2101
6.13.2.34 REG 38：vbus_h
Bit

Description

7:6
5:0

vbus[13:8]

R/W

Reset

Default

RO

/

0

RO

POR

0b

6.13.2.35 REG 39：vbus_l
Bit

Description

R/W

Reset

Default

7:0

vbus[7:0]

RO

POR

0b

R/W

Reset

Default

RO

/

0

RO

POR

0b

6.13.2.36 REG 3A：vsys_h
Bit

Description

7:6
5:0

vsys[13:8]

6.13.2.37 REG 3B：vsys_l
Bit

Description

R/W

Reset

Default

7:0

vsys[7:0]

RO

POR

0b

R/W

Reset

Default

RO

/

0

RO

POR

0b

6.13.2.38 REG 3C：tdie_h
Bit

Description

7:6
5:0

tdie[13:8]

6.13.2.39 REG 3D：tdie_l
Bit

Description

R/W

Reset

Default

7:0

tdie[7:0]

RO

POR

0b

6.13.2.40 REG 40：IRQ Enable 0
Bit

Description

R/W

Reset

Default

7

SOC drop to Warning Level2 IRQ(socwl2_irq) enable
0: disable
1: enable

RW

System
Reset

1b

6

SOC drop to Warning Level1 IRQ(socwl1_irq) enable
0: disable
1: enable

RW

SystemReset

1b

Copyright©Shenzhen X-Powers Technology Co., Ltd. All Rights Reserved.

41

AXP2101
5

Gauge Watchdog Timeout IRQ(gwdt_irq) enable
0: disable
1: enable

RW

System
Reset

1b

4

Gauge New SOC IRQ(lowsoc_irq) enable
0: disable
1: enable

RW

System
Reset

1b

3

Battery Over Temperature in Charge mode IRQ(bcot_irq) enable
0: disable
1: enable

RW

System
Reset

1b

2

Battery Under Temperature in Charge mode IRQ(bcut_irq)
enable0: disable
1: enable

RW

System
Reset

1b

1

Battery Over Temperature in Work mode IRQ(bwot_irq) enable
0: disable
1: enable

RW

System
Reset

1b

0

Battery Under Temperature in Work mode IRQ(bwut_irq)
enable0: disable
1: enable

RW

SystemReset

1b

6.13.2.41 REG 41：IRQ Enable 1
Bit

Description

R/W

Reset

Default

7

VBUS Insert IRQ(vinsert_irq) enable
0: disable
1: enable

RW

System
Reset

1b

6

VBUS Remove IRQ(vremove_irq) enable
0: disable
1: enable

RW

System
Reset

1b

5

Battery Insert IRQ(binsert_irq) enable
0: disable
1: enable

RW

System
Reset

1b

4

Battery Remove IRQ(bremove_irq) enable
0: disable
1: enable

RW

System
Reset

1b

3

POWERON Short PRESS IRQ(ponsp_irq_en) enable
0: disable
1: enable

RW

System
Reset

1b

2

POWERON Long PRESS IRQ(ponlp_irq) enable
0: disable
1: enable

RW

System
Reset

1b

1

POWERON Negative Edge IRQ(ponne_irq_en) enable
0: disable
1: enable

RW

System
Reset

0b

0

POWERON Positive Edge IRQ(ponpe_irq_en) enable
0: disable
1: enable

RW

SystemReset

0b6.13.2.42 REG 42：IRQ Enable 2
Bit

Description

R/W

Reset

Default

7

Watchdog Expire IRQ(wdexp_irq) enable
0: disable
1: enable

RW

SystemReset0b

Copyright©Shenzhen X-Powers Technology Co., Ltd. All Rights Reserved.

42

AXP2101
6

LDO Over Current IRQ(ldooc_irq) enable
0: disable
1: enable

RW

System
Reset

1b

5

BATFET Over Current Protection IRQ(bocp_irq) enable
0: disable
1: enable

RW

System
Reset

0b

4

Battery charge done IRQ(chgdn_irq) enable
0: disable
1: enable

RW

System
Reset

1b

3

Charger start IRQ(chgst_irq) enable
0: disable
1: enable

RW

System
Reset

1b

2

DIE Over Temperature level1 IRQ(dotl1_irq) enable
0: disable
1: enable

RW

System
Reset

1b

1

Charger Safety Timer1/2 expire IRQ(chgte_irq) enable
0: disable
1: enable

RW

System
Reset

1b

0

Battery Over Voltage Protection IRQ(bovp_irq) enable
0: disable
1: enable

RW

SystemReset

1b

6.13.2.43 REG 48：IRQ Status 0
Bit

Description

R/W

Reset

Default

7

SOC drop to Warning Level IRQ
0: no irq
1: irqwhen SOC >= Warning Level or SOC < shutdown Level to clear it

RW1C

POR

0b

6

SOC drop to Shutdown Level IRQ
0: no irq
1: irqwhen SOC >= Shutdown Level to clear it

RW1C

POR

0b

5

Gauge Watchdog Timeout IRQ
0: no irq
1: irq

RW1C

POR

0b

4

Gauge New SOC IRQ
0: no irq
1: irq

RW1C

POR

0b

3

Battery Over Temperature in Charge mode IRQ
0: no irq
1: irqBattery Temperature to normal to clear it

RW1C

POR

0b

2

Battery Under Temperature in Charge mode IRQ
0: no irq
1: irqBattery Temperature to normal to clear it

RW1C

POR

0b

1

Battery Over Temperature in Work mode IRQ
0: no irq
1: irqBattery Temperature to normal to clear it

RW1C

System
Reset

0b

0

Battery Under Temperature in Work mode IRQ
0: no irq
1: irqBattery Temperature to normal to clear it

RW1C

SystemReset0b

Copyright©Shenzhen X-Powers Technology Co., Ltd. All Rights Reserved.

43

AXP2101
6.13.2.44 REG 49：IRQ Status 1
Bit

Description

R/W

Reset

Default

7

VBUS Insert IRQ
0: no irq
1: irq
VBUS Remove to clear it

RW1C

POR

0b

6

VBUS Remove IRQ
0: no irq
1: irq
VBUS Insert to clear it

RW1C

POR

0b

5

Battery Insert IRQ
0: no irq
1: irqBattery Remove to clear it

RW1C

POR

0b

4

Battery Remove IRQ
0: no irq
1: irqBattery Insert to clear it

RW1C

POR

0b

3

POWERON Short PRESS IRQ
0: no irq
1: irq

RW1C

System
Reset

0b

2

POWERON Long PRESS IRQ
0: no irq
1: irq

RW1C

System
Reset

0b

1

POWERON Negative Edge IRQ
0: no irq
1: irq

RW1C

System
Reset

0b

0

POWERON Positive Edge IRQ
0: no irq
1: irq

RW1C

SystemReset

0b6.13.2.45 REG 4A：IRQ Status 2
Bit

Description

R/W

Reset

Default

7

Watchdog Expire IRQ
0: no irq
1: irq

RW1C

POR

0b

6

LDO Over Current IRQ
0: no irq
1: irqLDO Current to normal to clear it

RW1C

System
Reset

0b

5

BATFET Over Current Protection IRQ
0: no irq
1: irq

RW1C

POR

0b

4

Battery charge done IRQ
0: no irq
1: irqBattery charge start to clear it

RW1C

POR

0b

3

Battery charge start IRQ
0: no irq
1: irqBattery charge done to clear it

RW1C

POR

0b

Copyright©Shenzhen X-Powers Technology Co., Ltd. All Rights Reserved.

44

AXP2101
2

DIE Over Temperature level1 IRQ
0: no irq
1: irqDIE Temperature to normal to clear it

RW1C

POR

0b

1

Charger Safety Timer1/2 expire IRQ
0: no irq
1: irq

RW1C

POR

0b

0

Battery Over Voltage Protection IRQ
0: no irq
1: irqBattery Voltage to normal to clear it

RW1C

POR

0b

R/W

Reset

Default

RO

/

0

RW

POR

EFUSE

RW

POR

EFUSE

RW

POR

10b

6.13.2.46 REG 50：TS pin CTRL
Bit

Description

7:5

4

TS PIN function select:
0: TS pin is the battery temperature sensor input and will affectthe charger
1: TS pin is the external fixed input and doesn't affect the
charger
TS current source on/off enable
00: off

3:2

01: on when TS channel of ADC is enabled
10: on only when TS channel is working and off when others
channel is working
11: always on

1:0

current source to TS pin configuration
00: 20uA
01: 40uA
10: 50uA
11: 60uA

6.13.2.47 REG 52：TS_HYSL2H setting
Bit

Description

R/W

Reset

Default

7:0

hysteresis for TS from low go to normal
Thys = N*16mV (default 32mV)

RW

POR

2h

6.13.2.48 REG 53：TS_HYSH2L setting
Bit

Description

R/W

Reset

Default

7:0

hysteresis for TS from high go to normal
Thys = N*4mV (default 4mV)

RW

POR

1h

Copyright©Shenzhen X-Powers Technology Co., Ltd. All Rights Reserved.

45

AXP2101
6.13.2.49 REG 54：VLTFCHG setting
Bit

Description

R/W

Reset

Default

7:0

VLTF in voltage of charge configuration
VLTF = N*32 mV (default is about 0deg)
This is also T1 of JEITA

RW

POR

29h

6.13.2.50 REG 55：VHTFCHG setting
Bit

Description

R/W

Reset

Default

7:0

VHTF in voltage of charge configuration
VHTF = N*2 mV (default is about 55deg)
This is also T4 of JEITA

RW

POR

58h

6.13.2.51 REG 56：VLTFWORK setting
Bit

Description

R/W

Reset

Default

7:0

VLTF in voltage of work configuration
VLTF = N*32 mV (default is about -10deg)

RW

POR

3Eh

6.13.2.52 REG 57：VHTFWORK setting
Bit

Description

R/W

Reset

Default

7:0

VHTF in voltage of work configuration
VHTF = N*2 mV (default is about 60deg)

RW

POR

4Ch

R/W

Reset

Default

RO

/

0

RW

POR

EFUSE

R/W

Reset

Default

RO

/

0

RW

POR

0b

RO

/

0

6.13.2.53 REG 58：JIETA standard Enable control
Bit

Description

7:1
0

JEITA Standard Enable
0: disable
1: enable

6.13.2.54 REG 59：JEITA CV configuration
Bit

Description

7
6
5

Current fall of Warm in JEITA Standard
0: 100%
1: 50%

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AXP2101
4

Current fall of Cool in JEITA Standard
0: 100%
1: 50%

RW

POR

1b

RW

POR

01b

RW

POR

00b

Voltage fall of Warm in JEITA Standard
3:2

00: 0mV

01: 4.1/4.2/4.35/4.4V 的 1 档位

10: 4.1/4.2/4.35/4.4V 的 2 档位

11: reserved

Voltage fall of Cool in JEITA Standard
1:0

00: 0mV

01: 4.1/4.2/4.35/4.4V 的 1 档位

10: 4.1/4.2/4.35/4.4V 的 2 档位

11: reserved

6.13.2.55 REG 5A：JIETA Cool configuration
Bit

Description

R/W

Reset

Default

7:0

Cool Temperature(T2) in voltage of charge configuration
VHTF = N*16 mV (default is about 10deg)

RW

POR

37h

6.13.2.56 REG 5B：JIETA Warm configuration
Bit

Description

R/W

Reset

Default

7:0

Warm Temperature(T3) in voltage of charge configuration
VHTF = N*8 mV (default is about 45deg)

RW

POR

1Eh

R/W

Reset

Default

RO

/

0

RW

POR

2h

6.13.2.57 REG 5C：ts_cfg_data_h
Bit

Description

7:6
5:0

ts_cfg_data[13:8]

6.13.2.58 REG 5D：ts_cfg_data_l
Bit

Description

R/W

Reset

Default

7:0

ts_cfg_data[7:0], ts_cfg_data is TS Voltage configured by MCU
when ts_ch_en = 0b

RO

POR

58h

R/W

Reset

Default

RO

/

0

RW

POR

0101b

6.13.2.59 REG 61：Iprechg charger setting
Bit

Description

7:4
3:0

Precharge current limit:

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AXP2101
25*N mA
0000: 0mA
0011: 75mA
0110: 150mA
1001~1111: reserved

0001: 25mA
0100: 100mA
0111: 175mA

0010: 50mA
0101: 125mA
1000: 200mA

6.13.2.60 REG 62：ICC charger setting
Bit

Description

7:5

4:0

constant current charge current limit:
25*N mA if N<=8200+100*(N-8) mA if N>800000: 0mA00100: 100mA
00110: 150mA
00111: 175mA
01001: 300mA
01010: 400mA
01100: 600mA
01101: 700mA
01111: 900mA
10000: 1000mA

00101: 125mA
01000: 200mA
01011: 500mA
01110: 800mA
others: reserved

R/W

Reset

Default

RO

/

0

RW

POR

{EFUSE,
0b,
EFUSE}

R/W

Reset

Default

RO

/

0b

RW

System
Reset

1b

RW

POR

0101b

R/W

Reset

Default

RO

/

0

RW

POR

011b

6.13.2.61 REG 63：Iterm charger setting and control
Bit

Description

7:5
4Charging termination of current enable
0: disable
1: enable

3:0

Termination current limit:
25*N mA
0000: 0mA
0001: 25mA
0011: 75mA
0100: 100mA
0110: 150mA
0111: 175mA
1001~1111: reserved

0010: 50mA
0101: 125mA
1000: 200mA

6.13.2.62 REG 64：CV charger voltage setting
Bit

Description

7:3

2:0

Charge voltage limit
000: reserved
011: 4.2V
11X: reserved001: 4.0V
100: 4.35V

010: 4.1V
101: 4.4V

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AXP2101
6.13.2.63 REG 65：Thermal regulation threshold setting
Bit

Description

7:2
1:0

Thermal regulation threshold
00: 60deg
01: 80deg
10: 100deg
11: 120deg

R/W

Reset

Default

RO

/

0

RW

SystemReset

10b

6.13.2.64 REG 67：Charger timeout setting and control
Bit

Description

R/W

Reset

Default

7

safety timer1/2 setting during DPM or thermal regulation
0: safety timer not slowed during input DPM or thermal
regulation
1: safety timer slowed during input DPM or thermal regulation

RW

POR

1b

6

charge done safe timer enable
0: disable
1: enable

RW

POR

1b

5:4

charge done safety timer configuration
00: 5hours
01: 8hours
10: 12hours
11: 20hours

RW

POR

10b

RO

/

0

3
2

pre-charge safe timer enable
0: disable
1: enable

RW

POR

1b

1:0

pre-charge safe timer configuration
00: 40mins
01: 50mins
10: 60mins
11: 70mins

RW

POR

10b

R/W

Reset

Default

RO

/

0

RW

POR

1b

R/W

Reset

Default

RO

/

0

RW

SystemReset

00b6.13.2.65 REG 68：Battery detection control
Bit

Description

7:1
0

battery detection enable
0: disable
1: enable

6.13.2.66 REG 69：CHGLED setting and control
Bit

Description

7:6
5:4

CHGLED pin output when the register of chgled_func is set to10b00: Hiz;
01: Low/Hiz 25%/75% duty 1Hz;

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AXP2101
10: Low/Hiz 25%/75% duty 4Hz;

11: drive low;

3

2:1

0

CHGLED pin display function configuration
00: display with type A function
01: display with type B function
10: output controlled by the register of chgled_out_ctrl
11: reserved
CHGLED pin enable
0: disable CHGLED pin function

RO

/

0

RW

POR

EFUSE

RW

POR

1b

R/W

Reset

Default

RO

/

0

RW

POR

011b

R/W

Reset

Default

RO/0b

1: enable CHGLED pin function
6.13.2.67 REG 6A：Button battery charge termination voltage setting
Bit

Description

7:3
Button Battery charge termination voltage
2.6~3.3V，100mV/step，8steps
2:0

000: 2.6V
011: 2.9V
110: 3.2V

001: 2.7V
100: 3.0V
111: 3.3V

010: 2.8V
101: 3.1V

6.13.2.68 REG 80：DCDCS ON/OFF and DVM control
Bit

Description

7
6

force DCDC work in CCM mode
0: disable
1: enable

RW

System
Reset

0b

5

DVM voltage ramp control
0: 15.625 us/step
1: 31.250 us/step

RW

System
Reset

0b

4

DCDC5 enable
0: disable

RW

System
Reset

EFUSE

3

DCDC4 enable
0: disable

RW

System
Reset

EFUSE

2

DCDC3 enable
0: disable

RW

System
Reset

EFUSE

1

DCDC2 enable
0: disable

RW

System
Reset

EFUSE

RW

System
Reset

EFUSE

0

1: enable
1: enable
1: enable
1: enable

DCDC1 enable
0: disable

1: enable

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AXP2101
6.13.2.69 REG 81：DCDCS force PWM control
Bit

Description

R/W

Reset

Default

7

DCDC frequency spread enable
0: disable
1: enable

RW

System
Reset

0b

6

DCDC frequency spread range control
0: 50KHz
1: 100kHz

RW

System
Reset

0b

5

DCDC4 PWM/PFM Control
0: Auto Switch
1: Always PWM

RW

System
Reset

0b

4

DCDC3 PWM/PFM Control
0: Auto Switch
1: Always PWM

RW

System
Reset

0b

3

DCDC2 PWM/PFM Control
0: Auto Switch
1: Always PWM

RW

System
Reset

0b

2

DCDC1 PWM/PFM Control
0: Auto Switch
1: Always PWM

RW

System
Reset

0b

1:0

DCDC UVP debounce time configuration
00: 60us
01: 120us
10: 180us
11: 240us

RW

POR

00b

R/W

Reset

Default

RO

/

0

RW

System
Reset

EFUSE

6.13.2.70 REG 82：DCDC1 voltage setting
Bit

Description

7:5

4:0

DCDC1 output voltage configuration
1.5~3.4V,100mV/step,20steps
00000: 1.5V
00001: 1.6V……
10011: 3.4V
10100~11111: reserved

6.13.2.71 REG 83：DCDC2 voltage setting
Bit

Description

R/W

Reset

Default

7

DCDC2 DVM enable control
0: disable
1: enable

RW

System
Reset

0b

RW

System
Reset

EFUSE

6:0

DCDC2 output voltage configuration
0.5~1.2V,10mV/step,71steps
1.22~1.54V,20mV/step,17steps
0000000: 0.50V
0000001: 0.51V……
1000110: 1.20V

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AXP2101
1000111: 1.22V
1001000: 1.24V……
1010111: 1.54V

1011000~1111111: reserved

6.13.2.72 REG 84：DCDC3 voltage setting
Bit

Description

R/W

Reset

Default

7

DCDC3 DVM enable control
0: disable
1: enable

RW

System
Reset

0b

6:0

DCDC3 output voltage configuration
0.5~1.2V,10mV/step,71steps
1.22~1.54V,20mV/step,17steps
1.6~3.4V,100mV/step,19steps
0000000: 0.50V
0000001: 0.51V……
1000110: 1.20V
1000111: 1.22V
1001000: 1.24V……
1010111: 1.54V
1011000: 1.60V
1011001: 1.70V……
1101011: 3.40V
1101100~1111111: reserved

RW

System
Reset

EFUSE

R/W

Reset

Default

RO

/

0

RW

System
Reset

EFUSE

6.13.2.73 REG 85：DCDC4 voltage setting
Bit

Description

7

6:0

DCDC4 output voltage configuration
0.5~1.2V,10mV/step,71steps
1.22~1.84V,20mV/step,32steps
0000000: 0.50V
0000001: 0.51V……
1000110: 1.20V
1000111: 1.22V
1001000: 1.24V……
1100110: 1.84V
1100111~1101000: reserved

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AXP2101
6.13.2.74 REG 86：DCDC5 voltage setting
Bit

Description

7:6
5

slow down dcdc5 frequency compensation enable
0: disable
1: enable

R/W

Reset

Default

RO

/

0

RW

System
Reset

0b

RW

System
Reset

EFUSE

DCDC5 output voltage configuration
1.4~3.7V,100mV/step,24steps
4:0

11001: 1.2V
00000: 1.4V
00001: 1.5V……
10111: 3.7V

11000~11111: reserved

6.13.2.75 REG 90：LDOS ON/OFF control 0
Bit

Description

R/W

Reset

Default7

dldo1 enable
0: disable

RW

System
Reset

EFUSE

6

cpusldo enable
0: disable

RW

System
Reset

EFUSE

5

bldo2 enable
0: disable

RW

System
Reset

EFUSE

4

aldo1 enable
0: disable

RW

System
Reset

EFUSE

3

aldo4 enable
0: disable

RW

System
Reset

EFUSE

2

aldo3 enable
0: disable

RW

System
Reset

EFUSE

1

aldo2 enable
0: disable

RW

System
Reset

EFUSE

RW

System
Reset

EFUSE

R/W

Reset

Default

RO

/

0

RW

System
Reset

EFUSE

0

1: enable
1: enable
1: enable
1: enable
1: enable
1: enable
1: enable

aldo1 enable
0: disable

1: enable

6.13.2.76 REG 91：LDOS ON/OFF control 1
Bit

Description

7:1
0

dldo2 enable
0: disable

1: enable

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AXP2101
6.13.2.77 REG 92：ALDO1 voltage setting
Bit

Description

7:5

R/W

Reset

Default

RO

/

0

RW

System
Reset

EFUSE

R/W

Reset

Default

RO

/

0

RW

System
Reset

EFUSE

R/W

Reset

Default

RO

/

0

RW

System
Reset

EFUSE

R/W

Reset

Default

RO

/

0

RW

System
Reset

EFUSE

aldo1 output voltage configuration
0.5~3.5V，100mV/step，31steps
4:000000: 0.5V
00001: 0.6V……
11110: 3.5V

11111: reserved

6.13.2.78 REG 93：ALDO2 voltage setting
Bit

Description

7:5
aldo2 output voltage configuration
0.5~3.5V，100mV/step，31steps
4:000000: 0.5V
00001: 0.6V……
11110: 3.5V

11111: reserved

6.13.2.79 REG 94：ALDO3 voltage setting
Bit

Description

7:5
aldo3 output voltage configuration
0.5~3.5V，100mV/step，31steps
4:000000: 0.5V
00001: 0.6V……
11110: 3.5V

11111: reserved

6.13.2.80 REG 95：ALDO4 voltage setting
Bit

Description

7:5
4:0

aldo4 output voltage configuration

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AXP2101
0.5~3.5V，100mV/step，31steps
00000: 0.5V
00001: 0.6V……
11110: 3.5V

11111: reserved

6.13.2.81 REG 96：BLDO1 voltage setting
Bit

Description

7:5

R/W

Reset

Default

RO

/

0

RW

System
Reset

EFUSE

R/W

Reset

Default

RO

/

0

RW

System
Reset

EFUSE

R/W

Reset

Default

RO

/

0

RW

System
Reset

EFUSE

bldo1 output voltage configuration
0.5~3.5V，100mV/step，31steps
4:000000: 0.5V
00001: 0.6V……
11110: 3.5V

11111: reserved

6.13.2.82 REG 97：BLDO2 voltage setting
Bit

Description

7:5
bldo2 output voltage configuration
0.5~3.5V，100mV/step，31steps
4:000000: 0.5V
00001: 0.6V……
11110: 3.5V

11111: reserved

6.13.2.83 REG 98：CPUSLDO voltage setting
Bit

Description

7:5
cpusldo output voltage configuration
0.5~1.4V，50mV/step，20steps
4:000000: 0.50V
00001: 0.55V……
10011: 1.40V

10100~11111: reserved

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AXP2101
6.13.2.84 REG 99：DLDO1 voltage setting
Bit

Description

7:5

R/W

Reset

Default

RO

/

0

RW

System
Reset

EFUSE

R/W

Reset

Default

RO

/

0

RW

System
Reset

EFUSE

dldo1 output voltage configuration
0.5~3.4V，100mV/step，29steps
4:000000: 0.5V
00001: 0.6V……
11100: 3.3V

11101~11111: reserved

6.13.2.85 REG 9A：DLDO2 voltage setting
Bit

Description

7:5
dldo2 output voltage configuration
0.5~1.4V，50mV/step，20steps
4:000000: 0.50V
00001: 0.55V……
10011: 1.40V

10100~11111: reserved

6.13.2.86 REG A1：Battery parameter
Bit

Description

R/W

Reset

Default

7:0

Battery parameter ROM

RO

POR

xx

6.13.2.87 REG A2：Fuel gauge control
Bit

Description

R/W

Reset

Default

7:6

reserved

RO

/

0b

5

reserved

RW

POR

0b

RW

POR

0b

RO

/

0b

RW

POR

0b

ROM or SRAM select4

1：select sram;

3:1

reserved0brom writer control
1:enable

0：select rom;

0:disable

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AXP2101
6.13.2.88 REG A4：Battery percentage data
Bit

Description

R/W

Reset

Default

7:0

battery percentage

RO

POR

00h

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AXP2101

7

Application Information

7.1

Typical Application
Figure 7-1 Typical Application

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58

AXP2101

8

Package, Carrier, Storage and Baking Information

8.1

Package
AXP2101 package is QFN5*5, 40-pin. Figure 8-1 shows AXP2101 package.
Figure 8-1 Package Information

Figure 8-2 AXP2101 marking

Table 8-1 describes AXP2101 marking information.
Table 8-1 AXP2101 Marking Definitions
No.

Marking

Description

Fixed/Dynamic

1

AXP2101

Product name

Fixed

2

LLLLLXX

Lot number

Dynamic3

XXX1

Date code

Dynamic

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AXP2101
4
5

8.2

White dot

X-POWERS logo

Fixed

Package pin 1

Fixed

CarrierTable 8-2 AXP2101 Tray Carrier Information
Item

Color

Size

Aluminum foil bags

Silvery white

540mm x 300mm x 0.14mm

Pearl cotton cushion(Vacuum
bag)

White

12mm x 680mm x 185mm

Pearl cotton cushion (The Gap
between vacuum bag and inside Whitebox)

Left-Right:12mm x 180mm x 85mm
Front-Back:12mm x 350mm x 70mm

Inside Box

White

396mm x 196mm x 96mm

Outside Box

White

420mm x 410mm x 320mm

Figure 8-3 AXP2101 Tray Dimension Drawing

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AXP2101
Table 8-3 AXP2101 Packing Quantity Information
Type

Quantity
490pcs/Tray

Tray

10Trays/package

8.3

Storage

8.3.1

Moisture Sensitivity Level(MSL)

Part Number
AXP2101

A package’s MSL indicates its ability to withstand exposure after it is removed from its shipment bag, a low
MSL device sample can be exposed on the factor floor longer than a high MSL device sample. ALL MSL aredefined in Table 8-4.
Table 8-4 MSL Summary
MSL

Out-of-bag floor life

Comments

1

Unlimited≤30℃/85%RH

2

1 year≤30℃/60%RH

2a4 weeks≤30℃/60%RH

3

168 hours≤30℃/60%RH

4

72 hours≤30℃/60%RH

548 hours≤30℃/60%RH

5a

24 hours≤30℃/60%RH

6Time on Label(TOL)≤30℃/60%RH

AXP2101 device samples are classified as MSL3.

8.3.2

Bagged Storage Conditions
The shelf life of AXP2101 are defined in Table 8-5.
Table 8-5 Bagged Storage Conditions

8.3.3

Packing mode

Vacuum packing

Storage temperature

20℃~26℃

Storage humidity

40%~60%RH

Shelf life

6 months

Out-of-bag Duration
It is defined by the device MSL rating. The out-of-bag duration of AXP2101 is as follows.
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AXP2101
Table 8-6 Out-of-bag Duration
Storage temperature

20℃~26℃

Storage humidity

40%~60%RH

Moisture Sensitivity Level(MSL)

3

Floor life

168 hours

For no mention of storage rules in this document, please refer to the latest IPC/JEDEC J-STD-020C.

8.4

Baking
It is not necessary to bake AXP2101 if the conditions specified in Section 8.4.2 and Section 8.4.3 have notbeen exceeded. It is necessary to bake AXP2101 if any condition specified in Section 8.4.2 and Section 8.4.3
have been exceeded.
Table 8-7 Baking Conditions
Surrounding

Condition

Note

Nitrogen

125℃/8 hours

Recommended condition. It is recommended to bakeonce, no more than three times.

CAUTION： If baking is required, the devices must be transferred into trays that can be baked to at least
125°C. Devices should not be baked in tape and reel carriers at any temperature

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AXP2101

9

Reflow Profile
The reflow profile recommended in this document is a lead-free reflow profile that is suitable for purelead-free technology of lead-free solder paste.
Figure 9-1 shows the typical reflow profile of AXP2101 device sample.
Figure 9-1 AXP2101 Typical Reflow Profile

Reflow profile conditions of AXP2101 device sample is given in Table 9-1.
Table 9-1 AXP2101 Reflow Profile Conditions
QTI typical SMT reflow profile conditions (for reference only)
Step

Reflow condition

N2 purge reflow usage (yes/no)

Yes, N2 purge used

If yes, O2 ppm levelO2 < 1500 ppm

A

Preheat ramp up temperature range

25℃ -> 150℃

B

Preheat ramp up rate

1.5-2.5 ℃/sec

C

Soak temperature range

150℃ -> 190℃

D

Soak time

80-110 sec

ELiquidus temperature

217℃

F

Time above liquidus

60-90 sec

G

Peak temperature

240-250℃

H

Cool down temperature rate

≤4℃/sec

Environment

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AXP2101
Copyright©2021 Shenzhen X-Powers Technology Co., Ltd. All Rights Reserved.
This documentation is the original work and copyrighted property of Shenzhen X-Powers Technology Co., Ltd.
(“X-Powers ” ). No part of this document may be reproduced, modify, publish or transmitted in any form or by anymeans without prior written consent of X-Powers .
Trademarks and Permissions
X-Powers and the X-Powers logo (incomplete enumeration) are trademarks of Shenzhen X-Powers Technology Co., Ltd.
All other trademarks, trade names, product or service names mentioned in this document are the property of theirrespective owners.
Important Notice and Disclaimer
The purchased products, services and features are stipulated by the contract made between X-Powers Technology
Co.,Ltd (“X-Powers”) and the customer. All or part of the products, services and features described in this document
may not be within the purchase scope or the usage scope. Please read the terms and conditions of the contract andrelevant instructions carefully before using, and follow the instructions in this documentation strictly. X-Powers
assumes no responsibility for the consequences of improper use (including but not limited to overvoltage, overclock, orexcessive temperature).
The information in this document is provided just as a reference or typical applications, and is subject to change
without notice. Every effort has been made in the preparation of this document to ensure accuracy of the contents.
X-Powers is not responsible for any damage (including but not limited to indirect, incidental or special loss) or any
infringement of third party rights arising from the use of this document. All statements, information, andrecommendations in this document do not constitute a warranty or commitment of any kind, express or implied.
No license is granted by X-Powers herein express or implied or otherwise to any patent or intellectual property of
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