Application Note

Assembly Precautions
for the Nichia E13 Series LEDs
Table of Contents
1. LED Outline Dimensions/Tape Dimensions ・ ・ ・ ・ 2
2. Handling Precautions ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 3
3. Design Recommendations for Optimal
Amount of Solder ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 4
4. Precautions for Setting Up a Pick-and-Place
Machine/Nozzle ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 5-8
5. Precautions When Reflow Soldering ・ ・ ・ ・ ・ ・ 8
6. Evaluation of the Effect of Solder Volume ・ ・ ・ 9-13

The Nichia part number NCSWE13A-V1 within this document is merely Nichia’s part number forthis Nichia product and is not related nor bears resemblance to any other company’s productthat might bear a trademark.
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia E13 Series LEDs

1. LED Outline Dimensions/Tape Dimensions
Table 1. Product Specifications
LED

Embossed Carrier Tape

3.5±0.05

Cathode MarkH

(0.02 クロスバー凹部)(0.02 Crossbar Recess)

0.84
0.2

(0.32)

Cathode4±0.1

0.2±0.05

0.5±0.1
Φ0.5±0.05

1.45 ±0.1
Color Temperature/Rank

CRI Rank

H(Height)

1800K-4000K

R9050

0.35

2700K-4000K

R8000

0.30

sm50x

R8000

0.27

5000K-6500K

R9050

0.30

0.84

(0.32)

2±0.051.45 ±0.1

4±0.1

1.25

Φ1.5+0.1-08±0.1

光学的中心位置
Location of the optical center

1.75 ±0.1

1.25

Anode

Weight: typ. 0.0014g

Reel Size: 6,000 LEDs

(Unit: mm, Tolerance: ±0.5mm)(Unit: mm)

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia E13 Series LEDs

2. Handling Precautions
2-1. Handling with bare hands

Do not handle the LEDs with bare hands; this may contaminate the LED surface and have an effect on the
optical characteristics, and/or may cause the LEDs to deform and/or the wire to break causing a catastrophic
failure (i.e. the LED not to illuminate).

Incorrect

2-2. Handling with tweezers

The encapsulating resin of these LEDs is very soft. Handling the LEDs with bare hands or with tweezers may also
cause the LEDs to be damaged and/or fail to illuminate since it may apply force to the resin; do not handle theLEDs with bare hands or tweezers.

2-3. ESD Precautions

The E13 series LEDs are very sensitive to transient excessive voltages (e.g. ESD, lightning surge) since a
protection device (e.g. Zener diode) is not incorporated in them. If this excessive voltage occurs, it may cause
the LEDs to be damaged causing issues (e.g. the LEDs to become dimmer or not to illuminate [i.e. catastrophic
failure]). When handling the LEDs, ensure that necessary measures have been taken to protect them fromtransient excess voltages.

Incorrect

2-4. Stacking assembled PCBs together

Do not stack assembled PCBs together. Otherwise, it may cause damage to the resin (e.g. cut, scratch, chip,
crack, delamination and deformation) and the internal connection to fail causing a catastrophic failure (i.e. the
LED not to illuminate).

Figure 1. Incorrect Examplesof Handling the LED

2-5. Storage

The storage/packaging requirements for this LED are comparable to JEDEC Moisture Sensitivity Level (MSL) 2a
or equivalent. Nichia used IPC/JEDEC STD-020 as a reference to rate the MSL of this LED. Once the moistureproof aluminum bag is opened, ensure that soldering is completed within the storage times detailed below. To
store any remaining unused LEDs, use a hermetically-sealed container with silica gel desiccants. Nichia
recommends placing them back to the original moisture-proof aluminum bag used for shipment and reseal it.

Table 2. Storage Conditions
Conditions
Storage

Temperature

HumidityTime

Before Opening Aluminum Bag≤30℃≤90%RHWithin 1 Year from
Delivery Date

After Opening Aluminum Bag≤30℃≤70%RH≤4 weeksThis document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia E13 Series LEDs

3. Design Recommendations for Optimal Amount of Solder
Soldering Pad Pattern/Metal Solder Stencil Aperture

Table 3. Recommended Soldering Pad Pattern/Metal Solder Stencil Aperture
Recommended Soldering
Pad Pattern

Recommended Metal Solder
Stencil Aperture

0.2

0.22
(Unit: mm)

Item

Recommended Conditions

Metal Solder
Stencil (Thickness)

100 (μm)

Solder Paste(Composition)

Sn-3.0Ag-0.5Cu

0.68

0.31

0.84

1.1

Table 4. Recommended Solder/Metal Solder Stencil Conditions--- LED Outline + Electrodes■ Soldering Pad Pattern■ Metal Solder Stencil Aperture(Unit: mm)

1. Tables 3 and 4 shows the soldering pad pattern and the metal solder stencil aperture Nichia recommends.
2. If a soldering pad pattern that is different from Nichia's recommendation (see Table 3) is used, the distance
between the anode and cathode should be as recommended (i.e. 0.2mm). Otherwise, it may cause a solder joint
failure leading to emission failure and/or a performance/reliability degradation of the LEDs.
3. If high reliability solder paste is used to mount the LEDs onto a PCB and thermal stress occurs due totemperature fluctuation, the stress may be applied to the LED chips causing damage to them.
4. The recommended soldering pad pattern, metal solder stencil aperture, and thickness of the metal solder stencil
provided in Tables 3 and 4 have been determined under Nichia’s conditions; ensure that there are no issues withthe chosen assembly conditions prior to use.
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia E13 Series LEDs

4. Precautions for Setting Up a Pick-and-Place Machine/Nozzle
Table 5. Cautions/Suggestions for Setting Up Equipment
Item

Recommended
Conditions/Specifications

Cautions/Suggestions

Pick-and-Place Machine

Modular mounter

The recommended conditions/specifications herein havebeen determined using YS100 High-Speed GeneralPurpose Modular (manufactured by Yamaha Motor Co.,
Ltd.).

Pick-and-Place Nozzle

Use a nozzle that is smaller thanthe outline dimensions of the LEDs.

See “4.1 Pick-and-Place Nozzle” on Page 6 for details.

Tape-and-Reel Feeder

Electrical (motorized) feeder
Tape width: 8mm
Feeder pitch: 4mm

See “Tape-and-Reel Feeder” on Page 6 for the details.

Nozzle Height for Pickup Operations

The contact surface of the nozzle
head for pick operations should be
adjusted to the height of the edgeof the embossed carrier tapepocket.

See “Recommended Nozzle Height for Pick-up
Operations” on Page 7 for the details.

Nozzle Height forPlacement Operations(i.e. Placement Depth)

0.2mm for placement depth

See “Recommended Nozzle Height for Placement
Operations” on Page 7 for the details.

Imaging-based
Automatic Inspection

To locate the center of the LED,
using the outline as a reference isrecommended.

See "Imaging-based Automatic Inspection" on Page 8
for the details.

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia E13 Series LEDs

4-1. Pick-and-Place Nozzle✔ Correct

Incorrect

Incorrect

1. Use a pick-and-place nozzle that is smaller than the outline
dimensions of the LEDs. Ensure that the LEDs are picked up at thecenter of the emitting surface.

Figure 2. Correct/Incorrect Examples of LED Pick-up Positions

If the size and shape of the nozzle tip are not appropriate for theLEDs or if the nozzle does not pick up the LED at the center of theemitting surface, this may damage the LED (i.e. chipped, deformed,etc.) and/or lead to an incorrect pick up (i.e. the LEDs are picked up ina tilted position).

4-2. Tape-and-Reel Feeder
Pick-andPlace Nozzle
Recommended:
Removing the tape
immediately
before LED pick-up

1. For the tape-and-reel feeder, the tape width is set to 8mm and thefeeder pitch is set to 4mm.
Top Cover Tape
Removal Position

2. Use a tape-and-reel feeder that ensures it does not create excessive
vibrations causing assembly issues.

Top Cover Tape
Feeder Cover

3. If LEDs in the embossed carrier tape pockets are not in the correct
position when picked by the nozzle, reduce the feed speed.
Example: Electrical (motorized) feeder⇐ Feeding Direction of the Embossed Carrier Tape
Removing the tape ata point sufficiently far
away from the LED
pick-up

4. It is recommended to remove the top cover tape at therecommended position shown in Figure 3 (i.e. immediately before
LED pick-up).

Top Cover Tape
Removal Position

5. For some tape-and-reel feeders, removing the top cover tape at apoint sufficiently far away from the LED pick-up position may
reduce the possibility of picking failures. Verification should be
performed before use to determine the optimal conditions for thetape-and-reel feeder being used.

Figure 3. Top Cover Tape Removal Position

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia E13 Series LEDs

4-3. Recommended Nozzle Height for Pick-up Operations
Pick-and-Place
NozzleRecommended
Nozzle Height

1. Ensure that the nozzle goes down only to the height of the edge of theembossed carrier tape pocket.
2. The recommended nozzle height for pick-up operations has been
determined by Nichia under the verification conditions and may not
function as expected with some other pick-and-place machines. If the pickup operations are unstable even with using the recommended nozzle
height, adjust the nozzle height appropriate for the pick-and-placemachine being used.
• If the pick point of the nozzle is too high,- it may cause insufficient suction power leading to picking errors (e.g.
the nozzle’s failure to pick/lift the LED into the air, incorrect picking
causing the LED to tilt when in the air).

Embossed Carrier
Tape
Figure 4. Recommended Nozzle Height for Pick-up Operations• If the pick point of the nozzle is too low,
- it may cause issues (e.g. causing the embossed carrier tape to shake,causing the tape pocket to deform) leading to picking failure.

4-4. Recommended Nozzle Height for Placement Operations (Placement Depth)
Pick-and-Place
Nozzle1. The nozzle should further press the LED 0.2mm onto the PCB from theheight where the LED first touches solder paste.

Placement Depth
0.2mm
PCB

• If the release point of the nozzle is too high,- it may cause placement issues (e.g. the LED to stick to the nozzle after
placement, the LED to be mounted in an incorrect place/rotatedposition, the LED to become soldered to the PCB in a tilted position,etc.).
• If the release point of the nozzle is too low,
- excessive forces may be applied to the LED during placement and it
may cause the LED to become damaged.

Figure 5. Recommended Nozzle Height for Placement (Placement Depth)
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia E13 Series LEDs

4-5. Imaging-based Automatic Inspection
1. Nichia recommends using the outlines of the LED as a reference to locate
the center of the LED.

Outlines of the LED
1.25mm×1.25mm

2. If the imaging device has trouble detecting/recognizing the LED, adjust thesettings (i.e. the brightness of the light, etc.) of the pick-and-place machine.
3. For the E13 series LEDs, the center of the outlines may not match thecenter of the electrodes; there is a tolerance as provided in Table 1. If theelectrodes are used as a reference to locate the center of the LED, theplacement accuracy may be reduced. Misalignment of the LEDs may lookespecially obvious when multiple LEDs are mounted with a small pitch.
Figure 6. Example Image of the LED

5. Precautions When Reflow Soldering

1~5℃/sec
Pre-heat180~200℃

260℃ Max
10sec Max

220℃ Max
60sec Max

120sec Max

Figure 7. Recommended Reflow Soldering Condition(Lead-free Solder)

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1. Reflow soldering must not be performed more than twice.
2. Nichia recommends using the reflow soldering conditions detailed in
Figure 7 to the left; use the recommended reflow conditions specified by
the manufacturer of the solder paste being used if it works better for the
chosen application.
Note: To ensure that these reflow conditions have no negative effect on
the LEDs, perform sufficient verification prior to use.
3. When cooling the LEDs from the peak temperature a gradual cooling slope
is recommended; do not cool the LEDs rapidly.
4. During reflow soldering, the heat and atmosphere in the reflow oven may
cause the optical characteristics to degrade. In particular, reflow soldering
performed with an air atmosphere may have a greater negative effect on
the optical characteristics than if a nitrogen atmosphere is used; Nichia
recommends using a nitrogen reflow atmosphere.
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia E13 Series LEDs

6. Evaluation of the Effect of Solder Volume
Nichia evaluated the effect of solder volume for reflow-soldering the LEDs using different solder volumes (i.e. three aperture ratios andthree thicknesses for the metal solder stencil) including the recommended amount provided in Table 4 in Page 4. For details, see Table 6.
The evaluation results provided herein were obtained under Nichia’s evaluation conditions/environments; Nichia makes no guarantee that
customers will see the same results for their chosen application. Perform a sufficient verification to ensure that there are no issues with thechosen conditions/environments.
Table 6. Solder Volumes and Soldering Pad Patterns
Aperture Ratio1

56%(Nichia’s Recommendation)

45%

Thickness
0.33

0.31

67%
0.29

0.74

120μm

0.2

0.22

0.24

(Unit: mm)(Unit: mm)(Unit: mm)

0.6

100μm
(Nichia’s
Recommendation)

0.68

80μm

1 Aperture Ratio = Area of Aperture/Areas of Electrodes--- LED Outline + Electrodes■ Soldering Pad Pattern■ Metal Solder Stencil ApertureThis document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia E13 Series LEDs

6-1. Placement Accuracy in x and y Directions
Nichia evaluated the placement accuracy of the reflow-soldered LEDs in the x and y directions from the center of the soldering pad patternusing different solder volumes (i.e. three aperture ratios and three thicknesses for the metal solder stencil).
There was no significant difference seen per condition in either the x or y directions.
A

∆y
-

-

∆x

+

0.20

0.10

0.10

× Average

0.00－Average ±3σ-0.10＋：Center of the Soldering
Pad Pattern

Sample Size:
320 LEDs per ConditionΔy (mm)K

Δx (mm)+0.20

× Average

0.00－Average ±3σ-0.10

Sample Size:
320 LEDs per Condition

-0.20

-0.20

45% 56% 67% 45% 56% 67% 45% 56% 67%

45% 56% 67% 45% 56% 67% 45% 56% 67%
80μm

100μm

80μm

120μm

100μm

120μm

Solder Volume (Aperture Ratio and Thickness)

Solder Volume (Aperture Ratio and Thickness)

Figure 8. Placement Accuracy in the x Direction

Figure 9. Placement Accuracy in the y Direction

6-2. Placement Accuracy in the Angular Direction
Nichia evaluated the placement accuracy of the reflow-soldered LEDs in the angular direction from the reference axis of the soldering padpattern using different solder volumes (i.e. three aperture ratios and three thicknesses for the metal solder stencil).
The deviation became smaller as the solder volume increased.
1.5

∆θ
-

1.0

Δθ (°)+

0.5

× Average

0.0－Average ±3σ-0.5＋：Center of the Soldering
Pad Pattern

Sample Size:
320 LEDs per Condition

-1.0

-1.5
45% 56% 67% 45% 56% 67% 45% 56% 67%
80μm

100μm

120μm

Solder Volume (Aperture Ratio and Thickness)

Figure 10. Placement Accuracy in the Angular Direction
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia E13 Series LEDs

6-3. Placement Accuracy in the z Direction (Tilt)

0.15

0.15

0.10

0.10

0.05

× Average

0.00－Average ±3σ-0.05

Sample Size:
320 LEDs per Condition

-0.10

-0.15

Δz in y Direction (mm)Δz in x Direction (mm)Nichia evaluated the placement accuracy of the reflow-soldered LEDs in the z direction (i.e. tilt in the height direction) from the PCB surface(i.e. reference plane) using different solder volumes (i.e. three aperture ratios and three thicknesses for the metal solder stencil).
There was no significant difference seen in the average and the deviation of ∆z of the evaluated LEDs per condition in the x direction; thedeviation of ∆z of the evaluated LEDs became larger in the y direction as the solder volume increased.

0.05

100μm

－Average ±3σ-0.05

Sample Size:
320 LEDs per Condition

-0.10
-0.15

45% 56% 67% 45% 56% 67% 45% 56% 67%
80μm

× Average

0.00

45% 56% 67% 45% 56% 67% 45% 56% 67%

120μm

80μm

100μm

120μm

Solder Volume (Aperture Ratio and Thickness)

Solder Volume (Aperture Ratio and Thickness)

Figure 11. Placement Accuracy in the z-x Direction

Figure 12. Placement Accuracy in the z-y Direction⊿z+
x Direction

x Direction
K
K

A

A

y Direction⊿z+

Top Halfy Direction

Bottom HalfK

In the z-x direction, if the anode side of the LED is
higher, the LED is regarded as being tilted in theplus direction; if the cathode side is higher, the LED
is regarded as being tilted in the minus direction.

A

Bottom Half

In the z-y direction, if the top half of the LED is
higher, the LED is regarded as being tilted in theplus direction; if the bottom half is higher, the LED
is regarded as being tilted in the minus direction.

Top Half

This document contains tentative information, Nichia may change the contents without notice.

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6-4. Self-alignment Performance in the x and y Directions
Nichia evaluated the self-alignment performance of the reflow-soldered LEDs; the evaluation LEDs were placed on specified points (i.e. x=-0.1mm
and y=+0.1mm/x=-0.2mm and y=+0.2mm from the center of the soldering pad pattern).
The higher the aperture ratio was, the better the self-alignment performance was.
【Placement Deviation: ±0.1mm】
0.20

y:+0.1mm
K

Δx (mm)0.10－Average ±3σ

0.00□ Placement

-0.10

A

＋: Center of theSoldering Pad Pattern

0.10

× AverageΔy (mm)x:+0.1mm

0.20

45% 56% 67% 45% 56% 67% 45% 56% 67%

80μm

100μm

－Average ±3σ

0.00□ Placement-0.10

Position of the
Evaluated LED-0.20

× Average

Position of the
Evaluated LED-0.20

Sample Size:
32 LEDs per Condition

45% 56% 67% 45% 56% 67% 45% 56% 67%

120μm

80μm

100μm

Sample Size:
32 LEDs per Condition

120μm

Solder Volume (Aperture Ratio and Thickness)

Solder Volume (Aperture Ratio and Thickness)

Figure 13. Self-alignment Performance in the x Direction
for a Deviation of ±0.1mm

Figure 14. Self-alignment Performance in the y Direction
for a Deviation of ±0.1mm【Placement Deviation: ±0.2mm】
0.40

y:+0.2mm
K

A＋: Center of theSoldering Pad Pattern

Δx (mm)

0.20

0.20

× Average－Average ±3σ

0.00□ Placement-0.20

Position of the
Evaluated LED-0.40

45% 56% 67% 45% 56% 67% 45% 56% 67%
80μm

100μm

Sample Size:
32 LEDs per Condition

120μm

Δy (mm)x:+0.2mm

0.40

× Average－Average ±3σ

0.00□ Placement-0.20

Position of the
Evaluated LED-0.40
45% 56% 67% 45% 56% 67% 45% 56% 67%
80μm

100μm

Sample Size:
32 LEDs per Condition

120μm

Solder Volume (Aperture Ratio and Thickness)

Solder Volume (Aperture Ratio and Thickness)

Figure 15. Self-alignment Performance in the x Direction
for a Deviation of ±0.2mm

Figure 16. Self-alignment Performance in the y Direction
for a Deviation of ±0.2mm
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Assembly Precautions for the Nichia E13 Series LEDs

6-5. Self-alignment Performance in the Angular Direction
Nichia evaluated the self-alignment performance of the reflow-soldered LEDs; the evaluation LEDs were intentionally rotated (i.e. ∆θ=+5/10/30°
from the reference axis whose origin was the center of the soldering pad pattern).
The larger the solder volume was, the better the self-alignment performance was.
15

【Placement Deviation: +5º】

× AverageΔθ (°)10θ=+5°－Average ±3σ

5□ Placement

0

Position of the
Evaluated LED-5
45% 56% 67% 45% 56% 67% 45% 56% 67%＋: Reference Axis of theSoldering Pad Pattern

80μm
100μm
120μm
Solder Volume (Aperture Ratio and Thickness)

Sample Size:
32 LEDs per Condition

Figure 17. Self-alignment Performance in the Angular Direction for a Deviation of +5º【Placement Deviation: +10º】

× Average

15Δθ (°)

θ=+10°

20－Average ±3σ

105□ Placement

0

Position of the
Evaluated LED-5-10
45% 56% 67% 45% 56% 67% 45% 56% 67%＋: Reference Axis of theSoldering Pad Pattern

80μm

100μm

120μm

Sample Size:
32 LEDs per Condition

Solder Volume (Aperture Ratio and Thickness)

Figure 18. Self-alignment Performance in the Angular Direction for a Deviation of +10º
【Placement Deviation: +30º】

40

× Average

30－Average ±3σ

θ=+30°Δθ (°)

20
10
0□ Placement

Position of the
Evaluated LED

-10
-20

＋: Reference Axis of theSoldering Pad Pattern

45% 56% 67% 45% 56% 67% 45% 56% 67%

80μm
100μm
120μm
Solder Volume (Aperture Ratio and Thickness)

Sample Size:
32 LEDs per Condition

Figure 19. Self-alignment Performance in the Angular Direction for a Deviation of +30ºThis document contains tentative information, Nichia may change the contents without notice.

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Disclaimer
This application note is a controlled document of Nichia Corporation (Nichia) published to provide technical information/data forreference purposes only. By using this application note, the user agrees to the following:• This application note has been prepared solely for reference on the subject matters incorporated within it and Nichia makes noguarantee that customers will see the same results for their chosen application.
• The information/data contained herein are only typical examples of performances and/or applications for the product. Nichia
does not provide any guarantees or grant any license under or immunity from any intellectual property rights or other rights
held by Nichia or third parties.
• Nichia makes no representation or warranty, express or implied, as to the accuracy, completeness or usefulness of any
information contained herein. In addition, Nichia shall not be liable for any damages or losses arising out of exploiting, using,or downloading or otherwise this document, or any other acts associated with this document.
• The content of this application note may be changed without any prior or subsequent notice.
• Copyrights and all other rights regarding the content of this document are reserved by Nichia or the right holders who havepermitted Nichia to use the content. Without prior written consent of Nichia, republication, reproduction, and/or redistributionof the content of this document in any form or by any means, whether in whole or in part, including modifications or derivative
works hereof, is strictly prohibited.

491 Oka, Kaminaka-Cho, Anan-Shi,
TOKUSHIMA 774-8601, JAPAN
Phone: +81-884-22-2311 Fax: +81-884-21-0148

NICHIA CORPORATION
http://www.nichia.co.jp

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