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IQM-233
Thin Film Deposition Controller
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Title Page

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IQM-233
Thin Film Deposition Controller
TM

PN 074-584-P1B®

www.inficon.com©2015 INFICON

re achus@inficon.com

A

LTrademarks
The trademarks of the products mentioned in this manual are held by the companies that
produce them.
LabVIEW™ is a trademark of National Instruments.
Z-Match®, IQM-233™, IQS-233™, and SQM-242™ are trademarks of INFICON GmbH.
Windows® and Microsoft® are registered trademarks of Microsoft Corporation.
WinDriver™ is a trademark of Jungo Connectivity Ltd.
All other brand and product names are trademarks or registered trademarks of their respective companies.

Disclaimer
The information contained in this manual is believed to be accurate and reliable. However, INFICON assumes
no responsibility for its use and shall not be liable for any special, incidental, or consequential damages related
to the use of this product.
Due to our continuing program of product improvements, specifications are subject to change without notice.

Copyright©2015 All rights reserved.
Reproduction or adaptation of any part of this document without permission is unlawful.

Warranty
WARRANTY AND LIABILITY - LIMITATION: Seller warrants the products
manufactured by it, or by an affiliated company and sold by it, and described on
the reverse hereof, to be, for the period of warranty coverage specified below, freefrom defects of materials or workmanship under normal proper use and service.
The period of warranty coverage is specified for the respective products in therespective Seller instruction manuals for those products but shall not be less thantwo (2) years from the date of shipment thereof by Seller. Seller's liability under
this warranty is limited to such of the above products or parts thereof as are
returned, transportation prepaid, to Seller's plant, not later than thirty (30) days
after the expiration of the period of warranty coverage in respect thereof and arefound by Seller's examination to have failed to function properly because of
defective workmanship or materials and not because of improper installation or
misuse and is limited to, at Seller's election, either (a) repairing and returning the
product or part thereof, or (b) furnishing a replacement product or part thereof,transportation prepaid by Seller in either case. In the event Buyer discovers or
learns that a product does not conform to warranty, Buyer shall immediately notify
Seller in writing of such non-conformity, specifying in reasonable detail the natureof such non-conformity. If Seller is not provided with such written notification,
Seller shall not be liable for any further damages which could have been avoided if
Seller had been provided with immediate written notification.
THIS WARRANTY IS MADE AND ACCEPTED IN LIEU OF ALL OTHERWARRANTIES, EXPRESS OR IMPLIED, WHETHER OF MERCHANTABILITY OR
OF FITNESS FOR A PARTICULAR PURPOSE OR OTHERWISE, AS BUYER'S
EXCLUSIVE REMEDY FOR ANY DEFECTS IN THE PRODUCTS TO BE SOLDHEREUNDER. All other obligations and liabilities of Seller, whether in contract or
tort (including negligence) or otherwise, are expressly EXCLUDED. In no event
shall Seller be liable for any costs, expenses or damages, whether direct orindirect, special, incidental, consequential, or other, on any claim of any defective
product, in excess of the price paid by Buyer for the product plus returntransportation charges prepaid.
No warranty is made by Seller of any Seller product which has been installed,
used or operated contrary to Seller's written instruction manual or which has been
subjected to misuse, negligence or accident or has been repaired or altered byanyone other than Seller or which has been used in a manner or for a purpose forwhich the Seller product was not designed nor against any defects due to plans or
instructions supplied to Seller by or for Buyer.
This manual is intended for private use by INFICON® Inc. and its customers.
Contact INFICON before reproducing its contents.
NOTE: These instructions do not provide for every contingency that may arise inconnection with the installation, operation or maintenance of this equipment.
Should you require further assistance, please contact INFICON.

www.inficon.com

reachus@inficon.com

IQM-233 Operating Manual

Table Of Contents
Cover Page
Title Page
Trademarks
Disclaimer
Copyright
Declaration Of Conformity
Warranty

Chapter 1

PN 074-584-P1B

Introduction and Specifications
1.1
1.1.1
1.1.2
1.1.3
1.1.4
1.2
1.2.1
1.2.2
1.3
1.3.1
1.4
1.4.1
1.4.2
1.4.3
1.4.4
1.4.5
1.4.6
1.4.7
1.4.8
1.4.8.1

Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
IQM-233 Card Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
IQM-233 Standard Software Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
IQS-233 Codeposition Software Features . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Related Operating Manuals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
Instrument Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
Definition of Notes, Cautions and Warnings. . . . . . . . . . . . . . . . . . . . . . . . . 1-3
General Safety Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
How To Contact INFICON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
Returning Your IQM-233 Card to INFICON . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
IQM-233 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
Source Outputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
Computer Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7
General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7
Operating Environment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8
Warm Up Period . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8
Size. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8
IQM-233 Card (without bracket) H x L . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8

1.4.8.2

IQM-233 Card (standard) H x L x W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8

1.4.8.3

IQM-233 Card (Small Form Factor) H x L x W . . . . . . . . . . . . . . . . . . . . . . . 1-8

1.4.9
1.4.101.5
1.6

Connector Clearances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8
Weight . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8
Unpacking and Inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-9
Configurations and Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-9

TOC - 1

IQM-233 Operating Manual

1.6.1
1.6.2
1.6.2.1

IQM-233 Card Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-9
Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
Software (Optional) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10

1.6.2.2

Cables and Oscillator Kits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10

1.6.2.3

Crystal Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10

Chapter 2
Installation and Interfaces
2.1
2.1.1
2.1.1.1

Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Installation Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
Computer Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2

2.1.1.2

Software Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2

2.1.1.3

Installation Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2

2.1.1.4

Parts Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3

2.1.1.5

Ground Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4

2.1.1.5.1

Earth Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5

2.1.2
2.1.2.1

Installation Procedure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
IQM-233 Card Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6

2.1.2.1.1

IQM-233 Card Installation Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . 2-8

2.1.2.2

Sensor Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9

2.1.2.2.1

Sensor Connection Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-12

2.1.2.3

Source Output Cable and Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-13

2.1.2.4

Source Output Configuration and Verification . . . . . . . . . . . . . . . . . . . . . . 2-15

2.1.2.5

Digital I/O Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-18

IQM-233 Standard Software
3.1
3.2
3.2.1
3.2.1.1

Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
How To Install IQM-233 Standard Software. . . . . . . . . . . . . . . . . . . . . . . . . 3-1
DLL Installation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
DLL Installation Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3

3.2.2
3.2.3
3.3
3.3.1
3.3.1.1

IQM-233 Standard Software Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
IQM-233 Standard Software Update . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
How To Use IQM-233 Standard Software . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
Starting the Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
Starting the Software in Windows XP or Windows 7 . . . . . . . . . . . . . . . . . . 3-6

3.3.1.2

Starting the Software in Windows 8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6

3.3.2
3.3.3

IQM-233 Standard Window Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7
Software Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8

TOC - 2

PN 074-584-P1B

Chapter 3

IQM-233 Operating Manual

3.3.3.1

Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8

3.3.3.1.1

Log . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9

3.3.3.1.2

General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10

3.3.3.1.3

Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12

3.3.3.1.4

Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-14

3.3.3.2

Map Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-15

3.3.3.3

Source Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-16

3.3.3.4

File . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-17

3.3.4
3.3.4.1

IQM-233 Standard Window Description . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18
Sensor Information Pane Readouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-19

3.3.4.2

Source Information Pane Readouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-21

3.3.4.3

Global Operating Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-22

3.3.4.4

Source Control Operating Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-23

3.3.4.5

Simulate Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-24

3.3.4.6

About IQM-233 Standard Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-25

3.3.4.7

Current Configuration File . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-26

3.3.4.8

Exit Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-26

Chapter 4
Remote Communications
4.1
4.2
4.3
4.3.1

Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
DLL Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
LabVIEW VI Sample. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7
Getting Started With The LabVIEW VI Sample . . . . . . . . . . . . . . . . . . . . . . 4-7

PN 074-584-P1B

Chapter 5
Troubleshooting and Maintenance
5.1
5.2
5.3

Troubleshooting Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-11
Spare Parts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-11

Chapter 6
Calibration Procedures
6.1
6.2
6.3
6.4
6.5
6.5.1
6.5.2

Importance of Density, Tooling and Z-Ratio . . . . . . . . . . . . . . . . . . . . . . . . . 6-1
Determining Density . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1
Determining Tooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-2
Determining Z-Ratio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3
Tuning the Control Loop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-5
Identifying a Fast or Slow Source. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-6
Loop Tuning Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-7

TOC - 3

IQM-233 Operating Manual

Chapter 7
Measurement Theory
7.1
7.1.1
7.1.2
7.1.3

Basics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1
Monitor Crystals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-2
Period Measurement Technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-4
Z-Match Technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-5

Appendix A
Material Table
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .A-1

PN 074-584-P1B

A.1

TOC - 4

IQM-233 Operating Manual

Chapter 1
Introduction and Specifications
1.1 Introduction
The IQM-233 card is a thin film deposition controller that installs into a PCI Express
slot within a standard or small form factor computer that runs on the Windows® XP,
Windows 7, or Windows 8 operating system. See Figure 1-1.
Basic features for one IQM-233 card, or one SQM-242 card, are provided with the
IQM-233 Standard software.
NOTE: Advanced features for up to two IQM-233 cards, or two SQM-242 cards,
are provided by the optional IQS-233 Codeposition software.
For designing custom software, the Windows Dynamic Link Library (DLL) fileallows up to six IQM-233 cards or up to six SQM-242 cards to be used.
A LabVIEW™ VI sample is provided to demonstrate programming techniques.

PN 074-584-P1B

Figure 1-1 IQM-233 card

1.1.1 IQM-233 Card FeaturesThree sensor inputs for 5 MHz or 6 MHz quartz crystal sensors

Three analog source outputs

Compatible with the PN 782-900-010 oscillator used with the SQM-242 card

1-1

IQM-233 Operating Manual

1.1.2 IQM-233 Standard Software Features

Basic setup and control of one IQM-233 card or one SQM-242 card
(SAM-242 card not supported)Single layer process setupSingle layer monitoring of up to three quartz crystal sensors(up to four sensors for SQM-242)

Single layer codeposition of up to three sources(up to two sources for SQM-242)

Compatible with all INFICON non-shuttered single sensors:
Front Load, Cool Drawer, Bakeable, and Sputtering
NOTE: Shuttered sensors require a PLC and IQS-233 Codeposition software
for automatic shutter control.
NOTE: Not compatible with CrystalSix, Crystal12, and RSH-600 rotary
sensors.
NOTE: Not compatible with the CrystalTwo switch.



Advanced setup and control of up to two IQM-233 cards or two SQM-242 cards(SAM-242 card not supported)Multi-layer process setup



Codeposition of up to six sources (up to four sources for SQM-242 card)Easy PLC integration for event-selectable relay functions and shutter control

Compatible with all INFICON single and dual sensors:
Front Load, Cool Drawer, Bakeable, Sputtering
NOTE: Shuttered sensors require a PLC for automatic shutter control.
NOTE: Not compatible with CrystalSix, Crystal12, and RSH-600 rotary
sensors.
NOTE: Not compatible with the CrystalTwo switch.

1-2

PN 074-584-P1B

1.1.3 IQS-233 Codeposition Software Features

IQM-233 Operating Manual

1.1.4 Related Operating Manuals
PN 074-154 . . . . . . . . . . . . . . . . . . . Bakeable Crystal Sensor
PN 074-156 . . . . . . . . . . . . . . . . . . . Front Load Single and Dual Sensors
PN 074-157 . . . . . . . . . . . . . . . . . . . Sputtering Crystal Sensor
PN 074-609 . . . . . . . . . . . . . . . . . . . Cool Drawer Single and Dual Sensors
PN 074-585 . . . . . . . . . . . . . . . . . . . IQS-233 Codeposition Software
NOTE: Sensor operating manuals are available on the Thin Film Manuals CD
included with the IQM-233 card. Other related documentation can be
downloaded from www.inficon.com.

1.2 Instrument Safety
1.2.1 Definition of Notes, Cautions and Warnings
When using this manual, please pay attention to the NOTES, CAUTIONS andWARNINGS found throughout. For the purposes of this manual they are defined asfollows:
NOTE: Pertinent information that is useful in achieving maximum IQM-233 card
efficiency when followed.

CAUTIONPN 074-584-P1B

Failure to heed these messages could result in damage
to the IQM-233 card or the loss of data.

WARNING
Failure to heed these messages could result in personal
injury.

WARNING - Risk Of Electric Shock
Dangerous voltages are present which could result inpersonal injury.

1-3

IQM-233 Operating Manual

1.2.2 General Safety Information
WARNING - Risk Of Electric ShockThe IQM-233 card does not have any user serviceable
components.

WARNING - Risk Of Electric Shock
Dangerous voltages may be present whenever thecomputer is turned on or external connections arepresent.

WARNING - Risk Of Electric ShockThe computer in which the IQM-233 card is installed must
be connected to earth ground through a sealed
three-conductor power cable plugged into a socket outlet
with protective ground terminal.
Extension cables must have three conductors including
a protective earth ground.

Failure to operate the IQM-233 card in the mannerintended by INFICON can circumvent the safety
protection provided by the IQM-233 card and may resultin personal injury.

CAUTION - Static Sensitive Device
The IQM-233 card contains circuitry which is susceptible
to transient voltages or static.

1-4

PN 074-584-P1B

WARNINGIQM-233 Operating Manual

1.3 How To Contact INFICONWorldwide customer support information is available under Contact >> Support
Worldwide at www.inficon.com
Sales and Customer ServiceTechnical Support

Repair Service

If you are experiencing a problem with your IQM-233 card or software, please havethe following information readily available:
The Sales Order or PO number for the IQM-233 card purchase, if calling about
the IQM-233 card.

The software version, if calling about IQM-233 Standard or IQS-233
Codeposition software.



A description of the problem.

An explanation of any corrective action already attempted.

The exact wording of any error messages received.

1.3.1 Returning Your IQM-233 Card to INFICON
Do not return any component of your IQM-233 card to INFICON without first
speaking with a Customer Support Representative and obtaining a Return Material
Authorization (RMA) number.

PN 074-584-P1B

Packages delivered to INFICON without an RMA number will be held until thecustomer is contacted. This will result in delays in servicing the IQM-233 card.
If returning an IQM-233 card with a crystal sensor, or other component potentially
exposed to process materials, prior to being given an RMA number you will be
required to complete a Declaration Of Contamination (DOC) form. DOC forms must
be approved by INFICON before an RMA number is issued. INFICON may requirethat the component be sent to a designated decontamination facility, not to thefactory.

1-5

IQM-233 Operating Manual

1.4 IQM-233 Specifications
1.4.1 Measurement
Crystal Frequency Range. . . . . . . . . 4.000 MHz to 6.100 MHz
Frequency Resolution . . . . . . . . . . . 0.05 Hz @ 6 MHz(0.50 s measurement period)
Reference Frequency Stability . . . . . ±50 ppm (0 to 50°C)
Thickness Resolution . . . . . . . . . . . . 0.0613 Å/s/measurement,(density = 1.00, Z-Ratio = 1.000,
measurement period = 0.5 s,
crystal frequency = 6.0 MHz)
Thickness Accuracy . . . . . . . . . . . . . Dependent on process conditions,especially sensor location, material stress,
temperature, and density
Measurement Period . . . . . . . . . . . . 0.1 to 2 s
Measurement Technique . . . . . . . . . Active Oscillation
Number of Sensors . . . . . . . . . . . . . 3

1.4.2 Source Outputs
Number of Outputs . . . . . . . . . . . . . . 3
Output Connector. . . . . . . . . . . . . . . 15-pin high-density D-sub
Output Voltage . . . . . . . . . . . . . . . . . 0 to ±10 V(dc)
Output Impedance . . . . . . . . . . . . . . 50 Ω
PN 074-584-P1B

Output Resolution . . . . . . . . . . . . . . 15-bit plus sign

1-6

IQM-233 Operating Manual

1.4.3 Computer Requirements
Processor . . . . . . . . . . . . . . . . . . . . . 1.5 GHz CPU minimum
RAM . . . . . . . . . . . . . . . . . . . . . . . . . 2 GB RAM minimum
Memory . . . . . . . . . . . . . . . . . . . . . . 200 MB hard disk space minimum
Operating System. . . . . . . . . . . . . . . Windows XP SP3, Windows 7 32/64-bit,
Windows 8 32/64-bit
Screen Resolution . . . . . . . . . . . . . . 800 x 600 minimum
IQM-233 Card Interface . . . . . . . . . . PCI Express x1, x4, x8, x16
Computer Case . . . . . . . . . . . . . . . . Standard or small form factor
Communication Interface . . . . . . . . . RS-232C communications are required
when interfacing an external PLC to theoptional IQS-233 Codeposition software
NOTE: If the computer does not have an
available RS-232 port, a USB-Serial
Adapter can be used instead.

1.4.4 General Specifications
IQM-233 Card Type . . . . . . . . . . . . . PCIe x1

PN 074-584-P1B

IQM-233 Cards/Computer . . . . . . . . One card with IQM-233 Standard software.
Two cards maximum with IQS-233
Codeposition software.
Six cards maximum with customer-designed
software using included Windows DLL.
Power Consumption . . . . . . . . . . . . . <2 W per card

1-7

IQM-233 Operating Manual

1.4.5 Operating Environment
Usage. . . . . . . . . . . . . . . . . . . . . . . . Indoor only
Temperature . . . . . . . . . . . . . . . . . . . 0 to 50°C (32 to 122°F)
Humidity . . . . . . . . . . . . . . . . . . . . . . 0 to 80% RH @ 31°C, non-condensing
Altitude . . . . . . . . . . . . . . . . . . . . . . . 0 to 2000 m (0 to 6561 ft.)
Pollution Degree. . . . . . . . . . . . . . . . 1 per EN 61010-1

1.4.6 Storage Temperature
Storage Temperature . . . . . . . . . . . . –10 to 60°C (14 to 140°F)

1.4.7 Warm Up Period
Warm Up Period. . . . . . . . . . . . . . . . For maximum stability
allow five minutes.

1.4.8 Size
1.4.8.1 IQM-233 Card (without bracket) H x L
6.9 x 18.0 cm (2.7 x 7.1 in.)
1.4.8.2 IQM-233 Card (standard) H x L x W
12.2 x 18.0 x 2.3 cm (4.8 x 7.1 x 0.9 in.)
1.4.8.3 IQM-233 Card (Small Form Factor) H x L x W

1.4.9 Connector Clearances
SMA cable installation/removal . . . . 7.6 cm (3.0 in.) from IQM-233 card bracket
D-sub cable installation/removal . . . 7.6 cm (3.0 in.) from IQM-233 card bracket

1.4.10 Weight782-IQM-233-G1 Kit . . . . . . . . . . . . . 0.18 kg (0.40 lb.)
782-IQM-233-G2 Kit . . . . . . . . . . . . . 0.16 kg (0.35 lb.)
IQM-233 Card (standard) . . . . . . . . . 0.10 kg (0.22 lb.)
IQM-233 Card (small form factor) . . 0.08 kg (0.18 lb.)

1-8

PN 074-584-P1B

8.1 x 18.0 x 2.3 cm (3.2 x 7.1 x 0.9 in.)

IQM-233 Operating Manual

1.5 Unpacking and Inspection
CAUTION - Static Sensitive Device
Observe proper ESD procedures when handling the
IQM-233 card.

1 If the IQM-233 card has not been removed from its packaging, do so now. Do
not discard the packing materials until you have read this section andsuccessfully completed the installation of the IQM-233 card and software as
described by Chapter 2, Installation and Interfaces.

2 Carefully examine the IQM-233 card for damage that may have occurred
during shipping. This is especially important if you notice obvious roughhandling on the outside of the container. Immediately report any damage to thecarrier and to INFICON. Refer to section 1.3 on page 1-5.

3 Take an inventory of your order by referring to the order invoice and theinformation contained in section 1.6.
For additional information or technical assistance, contact INFICON. Refer tosection 1.3 on page 1-5.
To install the IQM-233 card and software, see Chapter 2, Installation andInterfaces.

1.6 Configurations and Accessories
1.6.1 IQM-233 Card Configurations
PN 074-584-P1B



IQM-233 Card (standard) PN 782-IQM-233-G1
or

IQM-233 Card (small form factor) PN 782-IQM-233-G2

Both IQM-233 configurations include:Thin Film Manuals CD containing IQM-233 Standard software, Windows DLL,
IQM-233 VI sample, IQM-233 Operating Manual, and sensor operating
manuals.



SMA/BNC Adapter Cable, PN 600-1441-P1. One adapter cable is included
with each IQM-233 card.



15-pin male high-density D-sub connector and housing.

1-9

IQM-233 Operating Manual

1.6.2 Accessories
1.6.2.1 Software (Optional)
IQS-233 Codeposition Software. . . . . . . . . . . . . . . . PN 782-IQS-233
1.6.2.2 Cables and Oscillator Kits
SMA/BNC Adapter Cable. . . . . . . . . . . . . . . . . . . . . PN 600-1441-P1
Oscillator Kit (3.0 m (10 ft.) cable) . . . . . . . . . . . . . . PN 782-934-003-10
Oscillator Kit (7.6 m (25 ft.) cable) . . . . . . . . . . . . . . PN 782-934-003-25
Oscillator Kit (15.2 m (50 ft.) cable) . . . . . . . . . . . . . PN 782-934-003-50
Oscillator Kit (30.5 m (100 ft.) cable) . . . . . . . . . . . . PN 782-934-003-99
NOTE: One oscillator kit and one SMA/BNC adapter cable are required for eachcrystal sensor that will be connected to the IQM-233 card.
1.6.2.3 Crystal Sensors
NOTE: "X" represents feature selections. Contact INFICON for assistance.
Front Load Single Sensor . . . . . . . . . . . . . . . . . . . . PN SL-XXXXX
Front Load Dual Sensor . . . . . . . . . . . . . . . . . . . . . . PN DL-AXXX
Front Load UHV Bakeable Sensor . . . . . . . . . . . . . . PN BK-AXF
Cool Drawer Single Sensor . . . . . . . . . . . . . . . . . . . PN CDS-XXFXX
Cool Drawer Dual Sensor . . . . . . . . . . . . . . . . . . . . PN CDD-XFXXNOTE: Shuttered sensors require a solenoid valve (PN 750-420-G1), a PLC, andoptional IQS-233 Codeposition software for shutter control. See section
2.1.2.5, Digital I/O Connections, on page 2-18.
NOTE: CrystalSix, Crystal12, and RSH-600 rotary sensors are not compatible with
the IQM-233 card.
NOTE: The CrystalTwo switch is not compatible with the IQM-233 card.

CAUTION
For proper performance of the IQM-233 card, the crystal
sensor in-vacuum cable (Front Load and Sputtering
sensors) or electrical conduit tube (Cool Drawer andBakeable sensors) should not exceed 78.1 cm (30.75 in.).

1 - 10

PN 074-584-P1B

Sputtering Sensor. . . . . . . . . . . . . . . . . . . . . . . . . . . PN 750-618-G1

IQM-233 Operating Manual

Chapter 2
Installation and Interfaces
2.1 Installation
Figure 2-1 shows a typical IQM-233 card system installation.
Refer to the sensor’s operating manual for sensor installation instructions.
To install the IQM-233 card, Dynamic Link Library (DLL), device driver, and
IQM-233 Standard software, read the installation requirements in section 2.1.1,
and then perform the installation procedure, starting at section 2.1.2 on page 2-5.
Figure 2-1 Typical system installation

Computer with
IQM-233 card installed
Substrate

CrystalSensorSMA/BNC
Cable

PN 074-584-P1B

Source6 in.
BNC cable
Oscillator
Earth
GroundLong BNC cable
Source Power Supply

User provided
source output cable2-1

IQM-233 Operating Manual

2.1.1 Installation Requirements
2.1.1.1 Computer Requirements
The computer must meet or exceed the specifications shown in section 1.4.3,
Computer Requirements, on page 1-7.
Each IQM-233 card requires one empty PCI Express slot of any size.
2.1.1.2 Software Requirements
One IQM-233 card requires:

IQM-233 Standard software, oroptional IQS-233 Codeposition software, orcustomer-designed software using the included Windows DLL

Two IQM-233 cards in same computer require:

IQS-233 Codeposition software, orcustomer-designed software using the included Windows DLL

Three to six IQM-233 cards in same computer require customer-designed software
using the included Windows DLL.
2.1.1.3 Installation Precautions

CAUTION - Static Sensitive Device

CAUTION
Refer to the computer’s operating manual for
instructions regarding the installation of
peripheral cards.

2-2

PN 074-584-P1B

Observe proper ESD procedures when handling the
IQM-233 card.

IQM-233 Operating Manual

2.1.1.4 Parts Requirements


IQM-233 card(s).

One to three crystal sensor(s) for each IQM-233 card. See section 1.6.2.3,
Crystal Sensors, on page 1-10.

Up to one user-provided source output cable for each IQM-233 card. A source
output cable is not required if the card will be used only as a monitor. See
section 2.1.2.3, Source Output Cable and Connection, on page 2-13.



One SMA/BNC adapter cable for each crystal sensor.



One oscillator kit for each crystal sensor. See section 1.6.2.2, Cables andOscillator Kits, on page 1-10.



IQM-233 Standard software (located on the Thin Film Manuals CD), or the
optional IQS-233 Codeposition software.

CAUTIONPN 074-584-P1B

For proper performance of the IQM-233 card, the crystal
sensor in-vacuum cable (Front Load and Sputtering
sensors) or electrical conduit tube (Cool Drawer andBakeable sensors) should not exceed 78.1 cm (30.75 in.).
Use only the short BNC cable (15.2 cm (6 in.)) included in
the oscillator kit to connect the oscillator to the crystal
sensor.

2-3

IQM-233 Operating Manual

2.1.1.5 Ground Requirements
Low impedance cables or straps must be used to connect the chassis of all control
components to a common ground point on the vacuum chamber. The common
ground point must be connected to earth ground. See section 2.1.1.5.1 on page 2-5
for the earth ground requirement.
Solid copper straps at least 12.7 mm (0.5 in.) wide and approximately
0.56 mm (0.022 in.) thick (as short as possible) are recommended where RF ispresent. This is particularly important in high-noise e-beam systems.
See Figure 2-2 for the recommended grounding method.
The oscillator is grounded to the IQM-233 card and crystal sensor through the
BNC cables and SMA/BNC adapter.

The crystal sensor is typically grounded to the wall of the vacuum system. If thesensor feedthrough is not properly grounded to earth through the vacuum
system, connect a copper strap between the feedthrough and the common
ground point on the vacuum system.

WARNING - Risk Of Electric ShockThe computer in which the IQM-233 card is installed must
be connected to earth ground through a sealed
three-conductor power cable plugged into a socket outlet
with a protective ground terminal. The computer mustalso be connected to the common ground point, shownin Figure 2-2.
Extension cables must have three conductors including
a protective earth ground.

Computer

SensorFeedthroughIQM-233
Card
3-Conductor
Power Cable

PN 074-584-P1B

Figure 2-2 System grounding diagram

Oscillator
and Cables
Source Output
Cable

Copper Straps toCommon GroundSourcePower Supply
Earth
Ground2-4

Vacuum System

IQM-233 Operating Manual

2.1.1.5.1 Earth Ground

WARNING - Risk Of Electric Shock
It is imperative to follow local electrical regulations andcodes.
If an earth ground is not established, the following grounding method is arecommendation; however, it is imperative to follow local electrical regulations andcodes.

1 Install two 3.0 m (10.0 ft.) long copper-clad steel ground rods into the soil,
spaced at least 1.9 m (6.2 ft.) apart. Ideally, the distance between the rods
should be at least twice the rod length.

2 Pour a solution of magnesium sulfate or copper sulfate around each rod to
reduce the resistance to earth ground.

3 Test the ground rods using a Ground Resistance Tester specifically designed
for that purpose (a common ohmmeter is not recommended).

4 After verifying that a good earth ground has been achieved, connect the rods
together using #6 AWG copper wire.

2.1.2 Installation Procedure
1 Install the DLL, device driver, and WinDriver. See section 3.2.1, DLL
Installation, on page 3-1.

2 Install the IQM-233 Standard software. See section 3.2.2, IQM-233 Standard
Software Installation, on page 3-5.

3 Start the IQM-233 Standard software.
3a Windows 7 users: Click Start >> All Programs >> INFICON >> IQM-233
Standard.
PN 074-584-P1B

3b Windows 8 users: In the Start window, click the IQM-233 Standard icon.
HINT: If the IQM-233 Standard icon is not visible, click Search >> Apps, andthen type IQM-233 in the Search box to locate the icon.

4 The IQM-233 Standard window will display. See Figure 2-3.
Figure 2-3 IQM-233 Standard window

2-5

IQM-233 Operating Manual

2.1.2.1 IQM-233 Card Installation

WARNING - Risk Of Electric Shock
Turn off the computer and disconnect the power cord
before continuing.

CAUTION - Static Sensitive Device
Follow proper ESD precautions.

1 Remove the computer’s cover.
2 Remove the blank panel from the computer’s rear panel adjacent to any empty
PCI Express slot.

3 Align the IQM-233 card’s gold-plated edge connector with the PCI Express slot
while aligning the IQM-233 card’s bracket with the opening in the computer’s
rear panel. See Figure 2-4.

4 Push down on the top of the IQM-233 card until the edge connector is fully
inserted into the PCI Express slot.

PCI Express slot
(any size)

5 Secure the IQM-233 card’s bracket to the computer’s rear panel.
6 Repeat steps 2 through 5 if additional IQM-233 cards are being installed.
7 Replace the computer’s cover.
8 Connect the power cord and turn on the computer.
9 Start the IQM-233 Standard software.
2-6

PN 074-584-P1B

Figure 2-4 IQM-233 card in PCI Express slot

IQM-233 Operating Manual

10 On the menu bar, click Help >> About.
11 In the About IQM-233 Standard window, verify that Card Type is IQM-233 andCard Count is 1 for one installed card (see Figure 2-5). If the Card Type isNone or the Card Count is 0, see section 2.1.2.1.1.
NOTE: IQM-233 Standard software supports one IQM-233 or SQM-242 card;
however, the Card Count will display the quantity of installed IQM-233
or SQM-242 cards (up to six cards of one type). If both IQM-233 andSQM-242 cards are installed, Card Count will display only the quantityof IQM-233 cards.

PN 074-584-P1B

Figure 2-5 About IQM-233 Standard window

2-7

IQM-233 Operating Manual

2.1.2.1.1 IQM-233 Card Installation Troubleshooting
If the IQM-233 card is not detected by the software (the Card Type is None or theCard Count is 0):Make sure all installed cards are fully seated in their slots.



Make sure the IQM-233 device driver and WinDriver™ are properly installed. In
Windows Device Manager, click  next to INFICON and Jungo, and verify
that both drivers are present and no errors are displayed. See Figure 2-6.
Figure 2-6 Device manager - IQM233 device driver and WinDriver

If the IQM-233 device driver and/or WinDriver are missing, install the DLL
again. See section 3.2.1, DLL Installation, on page 3-1.

If “!” or “X” is displayed next to IQM-233 device driver or WinDriver:

1 Right-click IQM233x64 or IQM233x86 and click Uninstall to remove thedevice driver.

2 Right-click WinDriver and click Uninstall to remove WinDriver.
If the problem cannot be resolved, contact INFICON. Refer to section 1.3, How To
Contact INFICON, on page 1-5.

2-8

PN 074-584-P1B

3 Install the DLL again. See section 3.2.1, DLL Installation, on page 3-1.

IQM-233 Operating Manual

2.1.2.2 Sensor Connections

1 Connect the SMA/BNC adapter cable to the desired SMA connector on the
IQM-233 card. See Figure 2-7.

2 Connect one end of the SMA/BNC adapter cable to the long BNC cable.
Figure 2-7 SMA/BNC adapter cable and long BNC cable

Sensor 1
Sensor 2
Sensor 3

SMA/BNC Adapter Cable

Long BNC Cable

3 Connect the other end of the long BNC cable to the oscillator’s INSTRUMENT
BNC connector. See Figure 2-8.

4 Connect one end of the short BNC cable to the oscillator’s FEEDTHRU BNC
connector.

PN 074-584-P1B

Figure 2-8 Cable connections to oscillator
Long BNC cable
to INSTRUMENT

Short BNC cable
to FEEDTHRU

Oscillator

2-9

IQM-233 Operating Manual

5 Connect the other end of the short BNC cable to the feedthrough of the crystal
sensor. See Figure 2-9.

6 Install a new 5 MHz or 6 MHz crystal into the sensor.
NOTE: Refer to the sensor’s operating manual for crystal installation
instructions.
Figure 2-9 Oscillator connection to sensor feedthroughFor proper performance of the IQM-233 card, the crystal
sensor in-vacuum cable (Front Load and Sputtering
sensors) or electrical conduit tube (Cool Drawer andBakeable sensors) should not exceed 78.1 cm (30.75 in.).
Use only the short BNC cable (15.2 cm (6 in.)) included in
the oscillator kit to connect the oscillator to the crystal
sensor.

7 Repeat steps 1 through 6 for any additional sensors to be connected to the
IQM-233 card.

8 Start the IQM-233 Standard software.

2 - 10

PN 074-584-P1B

CAUTIONIQM-233 Operating Manual

9 In the IQM-233 Standard window, on the menu bar, click Setup >> General.
See Figure 2-10.
Figure 2-10 Setup list

10 The Setup window displays. See Figure 2-11.
11 In the Maximum Crystal Freq, Initial Crystal Freq, and Minimum Crystal
Freq boxes, select frequency values appropriate for a 5 MHz or 6 MHz crystal.
See Table 2-1.

12 Make sure the Enable Simulate check box is clear.
13 Click OK to save the configuration.

PN 074-584-P1B

Figure 2-11 Setup window

Table 2-1 Typical frequency settings

New Crystal Starting
Frequency

Maximum Crystal
Frequency

Initial Crystal
Frequency

Minimum Crystal
Frequency

5 MHz

5.100

5.000

4.000

6 MHz

6.100

6.000

5.000

5.5 MHz Test Crystal(included in oscillator kit)

6.100

6.000

5.000

2 - 11

IQM-233 Operating Manual

14 In the IQM-233 Standard window, verify that Freq (Hz) is approximately thestarting frequency of the new crystal for all connected sensors (see Figure2-12). If the Freq (Hz) reading is incorrect or Fail is displayed for a connected
sensor, see section 2.1.2.2.1.
NOTE: Sensors do not need to be under vacuum for frequency verification.
NOTE: The Freq readout for Sensor channels not connected to a sensor
should display Fail.
Figure 2-12 Freq (Hz) readout

2.1.2.2.1 Sensor Connection Troubleshooting
Perform the following steps if the reported frequency is not correct or if Fail isdisplayed for a Sensor channel connected to a sensor.

1 In the Setup window (refer to Figure 2-11), type or select values for Maximum
Crystal Freq, Initial Crystal Freq, and Minimum Crystal Freq appropriate fora 5.5 MHz test crystal (refer to Table 2-1).

3 Disconnect the short BNC cable from the sensor feedthrough.
4 Connect the 5.5 MHz Test Crystal to the short BNC cable. See Figure 2-13.

2 - 12



If the Freq (Hz) reading for the test crystal is close to 5.5 MHz, the sensor,
feedthrough, or the sensor’s crystal is the cause of the incorrect or failed
reading. Refer to the sensor’s operating manual for troubleshooting
information.



If the Freq (Hz) reading for the test crystal is not close to 5.5 MHz or thereading displays Fail, contact INFICON. Refer to section 1.3, How To
Contact INFICON, on page 1-5.

PN 074-584-P1B

2 Click OK to save the configuration.

IQM-233 Operating Manual
Figure 2-13 5.5 MHz test crystal

5.5 MHz Test Crystal

2.1.2.3 Source Output Cable and Connection
NOTE: Source output connections are not required if the IQM-233 card is used
only as a monitor. In this case, the IQM-233 card installation is complete
and the following procedure is not required.

1 Construct a source output cable for one, two, or three source output channels.

PN 074-584-P1B

NOTE: The source output cable is user provided.


A 15-pin male high-density D-sub connector is provided with the IQM-233
card, to be used for the source output cable connection to the IQM-233
card. See Table 2-2 and Figure 2-14 for the source output pin assignments.



The connector type used for the other end of the cable depends upon therequirements of the source power supply or other equipment.

Table 2-2 Source output pin assignments

High-Density D-sub

Function

Pin 1

Output 1

Pin 2

Output 2

Pin 3

Output 3

Pin 4

Not Used

Pin 5

Not UsedPin 6

GroundPin 7

Ground2 - 13

IQM-233 Operating Manual
Table 2-2 Source output pin assignments (continued)

High-Density D-sub

Function

Pin 8

GroundPin 9GroundPin 10GroundPin 11

GroundPin 12GroundPin 13

Not UsedPin 14

Not UsedPin 15

Not Used

Figure 2-14 Source output cable - 15-pin high-density male D-sub connector
Output 1

Output 2

Output 3

Ground2 Connect the D-sub connector end of the source output cable to the
Figure 2-15 Source output cable
Source Output Cable

2 - 14

PN 074-584-P1B

IQM-233 card. See Figure 2-15.

IQM-233 Operating Manual

3 Connect the other end of the cable to the source power supply or otherequipment.

CAUTION
Care must be taken in connecting the IQM-233 cardsource outputs to the source power supply or otherequipment. Failure to follow the equipment
manufacturer’s instructions can result in damage to theequipment and/or the IQM-233 card.

2.1.2.4 Source Output Configuration and Verification
NOTE: The following steps are not required if the IQM-233 card is used only as amonitor.

1 In the IQM-233 Standard window, click Setup >> General. See Figure 2-16.
Figure 2-16 Setup list

2 The Setup window is displayed. See Figure 2-17.
3 Select the Control Enabled check box.
4 Click OK to display the IQM-233 Standard window with Sensor Information
PN 074-584-P1B

and Source Information panes. See Figure 2-18.

2 - 15

IQM-233 Operating Manual
Figure 2-17 Setup - Control Enabled selected

PN 074-584-P1B

Figure 2-18 IQM-233 Standard window - Sensor Information and Source Information

2 - 16

IQM-233 Operating Manual

5 On the menu bar, click Setup >> Source.
6 The Source Setup window displays. See Figure 2-19.
Figure 2-19 Source Setup window

7 For each source output connected to a source power supply, enter a value inthe Full Scale (V) box(es) equal to the maximum input voltage allowed for thesource power supply. Click OK to save the configuration. For detailed
information, see section 3.3.3.1.4, Source, on page 3-14.

8 In the Sensor Information pane of the IQM-233 Standard window, select aconnected Output from the Map Sensor list (see Figure 2-20). For detailed
information, see section 3.3.3.2, Map Sensor, on page 3-15.
Figure 2-20 Map Sensor list

PN 074-584-P1B

9 In the Source Information pane, select Manual from the Source Control list
(refer to Figure 2-18). For detailed information, see section 3.3.4.4, Source
Control Operating Functions, on page 3-23.
Figure 2-21 Source Control list

2 - 17

IQM-233 Operating Manual

10 In the Source Information pane, adjust the value of Manual Power (%) for theconnected output, and then check for an appropriate response from the source
power supply (see Figure 2-22). For detailed information, see section 3.3.4.4,
Source Control Operating Functions, on page 3-23.

11 Repeat steps 8, 9, and 10 for any additional source output channels connected
to source power supplies.
Figure 2-22 Source Control - Manual

2.1.2.5 Digital I/O Connections

PN 074-584-P1B

The IQM-233 card does not have the digital inputs and outputs needed forautomatic control of source and sensor shutters, rotation of source pockets, etc.
A Programmable Logic Controller (PLC) together with the optional IQS-233
Codeposition software can add this capability. The PLC is not available fromINFICON. Refer to the IQS-233 Codeposition Software Operating Manual for
information about interfacing a PLC with IQS-233 Codeposition software.

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IQM-233 Operating Manual

Chapter 3
IQM-233 Standard Software
3.1 Introduction
IQM-233 Standard software is used to monitor or control a simple process using asingle IQM-233 card or SQM-242 card.
Features include:Single layer or codeposition control of up to three materials.



Output parameters for controlling source power supplies.



Saving of setup parameters and deposition data.



Simulation of deposition for developing and testing a deposition process.

3.2 How To Install IQM-233 Standard Software
3.2.1 DLL Installation
The Dynamic Link Library (DLL), device driver for the IQM-233 or SQM-242 card,and WinDriver are installed by the IQM233 DLL or the SQM242 with IQM DLL
setup file. To install the DLL, device driver, and WinDriver:PN 074-584-P1B

NOTE: IQM233 DLL and SQM242 with IQM DLL cannot be installed together on
the same computer.
NOTE: If IQM-233 and SQM-242 cards are installed together in the same
computer, IQM-233 Standard software will detect only one IQM-233 cardand ignore the SQM-242 card(s). The IQM-233 card(s) must be removed
to use IQM-233 Standard software with an SQM-242 card.

1 If the operating system is Windows 7 or 8, click Start >> Control Panel >>System. Note the operating system size (32-bit or 64-bit) displayed under
System type.
If the operating system is Windows XP, click Start >> Settings >> Control
Panel >> System >> System Properties >> General tab. Determine theoperating system size from the operating system name displayed under
System:

Windows XP Home, Windows XP Media Center Edition, and Windows XP
Professional are 32-bit.

Windows XP Professional x64 Edition is 64-bit.

2 Insert the Thin Film Manuals CD into the computer’s CD drive.

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IQM-233 Operating Manual

3 Click Windows Explorer or File Explorer >> Computer >> (CD drive letter:)
INFICON Technical Documentation.


If an IQM-233 card will be used with the IQM-233 Standard software, click
IQM-233 Card >> IQM-233 Drivers.



If an SQM-242 card will be used with the IQM-233 Standard software, click
SQM-242 Card >> Current Software and Installation >> SQM-242
Drivers.

4 Start the DLL installation:
NOTE: If an error message prevents the DLL installation from being
completed, see section 3.2.1.1 on page 3-3.


For an IQM-233 card and a 32-bit operating system, double-click
IQM233 DLL x86 vx.x.x.x Setup.exeFor an IQM-233 card and a 64-bit operating system, double-click
IQM233 DLL x64 vx.x.x.x Setup.exeFor an SQM-242 card and a 32-bit operating system, double-click
SQM242 with IQM DLL x86 vx.x.x.x Setup.exeFor an SQM-242 card and 64-bit operating system, double-click
SQM242 with IQM DLL x64 vx.x.x.x Setup.exe

5 The InstallShield Wizard window will display.
6 Click Next.
7 Click I accept the terms in the license agreement.
8 Click Next.
10 Click Next.
11 Click Install to start the installation of the device driver for the IQM-233 or
SQM-242 card and the DLL required by the IQM-233 Standard software.

12 When Install Wizard Completed is displayed, click Finish to close theInstallShield Wizard.

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9 Type information into the User Name and Organization boxes.

IQM-233 Operating Manual

3.2.1.1 DLL Installation Troubleshooting
If the WDREG Error window displays (see Figure 3-1), an existing version of
WinDriver is preventing the installation of the DLL.
Figure 3-1 WDREG Error

To remove the existing WinDriver and install the required WinDriver:

1 In Windows Device Manager, click  next to Jungo to display WinDriver.
See Figure 3-2.
Figure 3-2 Jungo and WinDriver

2 Right-click WinDriver and click Uninstall. See Figure 3-3.

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Figure 3-3 Uninstall WinDriver

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IQM-233 Operating Manual

3 When the Confirm Device Uninstall window appears, click OK to uninstall
WinDriver. See Figure 3-4.
Figure 3-4 Confirm Device Uninstall

4 In the WDREG Error window, click Retry to continue with the DLL installation.
Refer to Figure 3-1.
If the Windows Installer error message is displayed (see Figure 3-5), another
DLL (IQM233 DLL or SQM242 with IQM DLL) is already installed.
NOTE: IQM233 DLL and SQM242 with IQM DLL cannot be installed together
on the same computer.

PN 074-584-P1B

Figure 3-5 Windows Installer Installation Error

Click OK to keep the previously installed DLL.
or

To remove the previously installed DLL and install a different DLL:

1 Click OK to close the Windows Installer window.
2 Click Control Panel >> Programs to display a list of installed programs.
3 Select the IQM233 DLL or the SQM242 with IQM DLL from the list.
4 Click Uninstall to remove the selected DLL.
5 Install the DLL again. Refer to section 3.2.1, DLL Installation, on page 3-1.

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IQM-233 Operating Manual

3.2.2 IQM-233 Standard Software Installation
To update an existing installation of IQM-233 Standard software to a newer version,see section 3.2.3.

1 Click Windows Explorer or File Explorer >> Computer >> (CD drive letter:)
INFICON Technical Documentation >> IQM-233 Card >> IQM-233
Software.

2 Double-click IQM-233 Standard vx.x.x.x Setup.exe.
3 The InstallShield Wizard will display.
4 Click Next.
5 Click I accept the terms in the license agreement.
6 Click Next.
7 Type information into the User Name and Organization boxes.
8 Click Next.
9 Click Install to start the software installation.
10 When Install Wizard Completed is displayed, click Finish to close theInstallShield Wizard window.

3.2.3 IQM-233 Standard Software Update
To update an existing installation of IQM-233 Standard software to a newer version:

1 Click Control Panel >> Programs to display a list of installed programs.
2 If the IQM-233 Standard software was used with an IQM-233 card, selectPN 074-584-P1B

IQM233 DLL x86 or IQM233 DLL x64 from the list.
If the IQM-233 Standard software was used with an SQM-242 card, selectSQM242 with IQM DLL x86 or SQM242 with IQM DLL x64 from the list.

3 Click Uninstall to remove the DLL.
4 Select IQM-233 Standard from the list.
5 Click Uninstall to remove the IQM-233 Standard software.
6 Install the latest version of DLL. Refer to section 3.2.1.
7 Install the latest version of IQM-233 Standard software. Refer to section 3.2.2.

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IQM-233 Operating Manual

3.3 How To Use IQM-233 Standard Software
3.3.1 Starting the Software
3.3.1.1 Starting the Software in Windows XP or Windows 7
Click Start >> All Programs >> INFICON >> IQM-233 Standard.


If this is the first time the software has been started, the IQM-233 Standard
window with Sensor Information pane is displayed. See Figure 3-6.



If the software has previously been configured to allow source control byselecting the Control Enabled check box in the Setup window, the IQM-233
Standard window with Sensor Information pane and Source Information
pane is displayed. See Figure 3-7.

3.3.1.2 Starting the Software in Windows 8

1 In the Start window, click the IQM-233 Standard icon.
2 If the icon cannot be found:
2a Click Search >> Apps.
2b Type IQM-233 in the Search text box.
2c Click the IQM-233 Standard icon.
 If this is the first time the software has been started, the IQM-233
Standard window with Sensor Information pane will display. See
Figure 3-6.

Figure 3-6 IQM-233 Standard window - Sensor Information pane

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 If the software has previously been configured to allow source control
by selecting the Control Enabled check box in the Setup window, theIQM-233 Standard window with Sensor Information and Source
Information panes will display. See Figure 3-7.

IQM-233 Operating Manual
Figure 3-7 IQM-233 Standard window - Sensor Information and Source Information panes

3.3.2 IQM-233 Standard Window Introduction
The IQM-233 Standard window contains a Sensor Information pane and a
Source Information pane. See Figure 3-8.
NOTE: The Source Information pane is only available when the Control
Enabled check box is selected in the Setup window. Refer to section
3.3.3.1.2, General, on page 3-10.

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Figure 3-8 IQM-233 Standard window

The Sensor Information pane displays material thickness, deposition rate, crystal
frequency, and estimated remaining life of the crystal, for up to three individual
sensors. See section 3.3.4.1, Sensor Information Pane Readouts, on page 3-19.

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IQM-233 Operating Manual

Operating functions allow data logging of thickness, rate, frequency, and life
information, starting and stopping of the readout information, and zeroing of the
thickness values. See section 3.3.4.3, Global Operating Functions, on page 3-22.
In addition to the information displayed by the Sensor Information pane, theSource Information pane displays material thickness, deposition rate, rate
deviation, and source power, for up to three sources. See section 3.3.4.2, Source
Information Pane Readouts, on page 3-21.
When the Source Information pane is displayed, additional operating functions
allow selection of source control mode, starting and stopping of source power,holding and resuming of a process, and zeroing of the thickness values in the
Source Information pane. See section 3.3.4.4, Source Control Operating
Functions, on page 3-23.
NOTE: IQM-233 Standard software must be configured before monitoring orcontrolling a deposition. See section 3.3.3.

3.3.3 Software Configuration
Configure the Setup parameters (see section 3.3.3.1), Map Sensor parameters(see section 3.3.3.2), and Source Control parameters (see section 3.3.3.3). Savethe configured parameters as a configuration file (see section 3.3.3.4).
3.3.3.1 Setup
On the menu bar, click Setup to access options to control Log, General, Sensor,
and Source settings. See Figure 3-9.

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Figure 3-9 Setup list

3-8Log, see section 3.3.3.1.1

General, see section 3.3.3.1.2

Sensor, see section 3.3.3.1.3

Source, see section 3.3.3.1.4

IQM-233 Operating Manual

3.3.3.1.1 Log
Data logging (see section 3.3.4.3, Global Operating Functions, on page 3-22)
allows rate, thickness, frequency, and life data, for individual sensors andmultiple sensors mapped to outputs (sensor averaging), to be saved to a .csv
format data log file.
Click Setup >> Log on the menu bar to display the Save As window. In the Filename: text box, type a name for the data log file and browse for a suitablefolder. Click Save to save the data log file. See Figure 3-10.

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Figure 3-10 Log Save As window

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IQM-233 Operating Manual

3.3.3.1.2 General
Click Setup >> General on the menu bar to display the Setup window, allowing
parameters to be configured for crystal measurement, simulation mode, display
units, and source control. See Figure 3-11.
Figure 3-11 Setup window

Card Setup PaneEnter the highest possible frequency of a new crystal. Frequencies above
this value will display a crystal Fail.
Initial Crystal Freq (MHz) . . . . . 4.900 to 6.099 MHz
Enter the nominal frequency of a new crystal; usually 5 MHz or 6 MHz.
Minimum Crystal Freq (MHz) . . 4.000 to 6.098 MHz
Enter the lowest desired crystal frequency before a crystal Fail message isdisplayed.
NOTE: Maximum Crystal Freq must be set at least 0.001 MHz higher than
Initial Crystal Freq.
Initial Crystal Freq must be set at least 0.001 MHz higher than
Minimum Crystal Freq.

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Maximum Crystal Freq (MHz) . 5.000 to 6.100 MHz

IQM-233 Operating Manual

Measurement Period (sec) . . . .0.10, 0.25, 0.50, 1.00, 2.00 s
Indicates the time period needed for one measurement. Enter a longer
measurement period to provide higher resolution, especially in low rateapplications.
Filter Readings. . . . . . . . . . . . . .1, 2, 3, 4, 5, 6, 7, 8, 9, 10
Indicates the number of unfiltered readings averaged (arithmetic mean)
within the displayed rate. A higher value will help reduce rate noise. For
example, a setting of 1 indicates no averaging while a setting of 10
indicates heavy averaging.
Card Simulate Pane
Enable Simulate
Select the check box to activate simulate mode, allowing a deposition
process to be developed and tested without the need for an IQM-233 or
SQM-242 card to be installed or sensors to be connected to an installedcard. This check box is automatically selected when no cards are installed.
See section 3.3.4.5, Simulate Mode, on page 3-24 for detailed information
about Simulate mode.
Card Type . . . . . . . . . . . . . . . . .IQM-233, SQM-242
Card Type is displayed only when the Enable Simulate check box isselected. Card Type allows an IQM-233 or SQM-242 card to be simulated.
Click ▼ in the Card Type box and then select from the list the card tosimulate. See section 3.3.4.5, Simulate Mode, on page 3-24 for detailed
information about Simulate mode.
Card Assignment PanePN 074-584-P1B

Bus, Device, Function
Read-only parameter that displays the computer bus, device, and function
assignments for an installed IQM-233 or SQM-242 card. IQM-233 Standard
software supports one card only. If multiple cards are installed, thedisplayed assignment is for the card automatically selected by the software.
If IQM-233 and SQM-242 cards are installed together, the software will
select an IQM-233 card.

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IQM-233 Operating Manual

Display Pane
Units . . . . . . . . . . . . . . . . . . . . . Thickness, Mass
Click ▼ and then select from the list the unit of measure for the Rate (Å/s)
and Thickness (kÅ) readouts in the IQM-233 Standard window (refer toFigure 3-8 on page 3-7).
If Thickness is selected:


The Rate (Å/s) value is in units of Å/s

The Thickness (kÅ) value is in units of kÅ

If Mass is selected:


The Rate (Å/s) value is in units of ng/cm2/s



The Thickness (kÅ) value is in units of ug/cm2

NOTE: The desired Rate (Å/s) and Final Thickness (kÅ) parameters in
the Source window are not affected by the Units selection, andthese values are entered as units of Å/s and kÅ, respectively. See
section 3.3.3.1.4, Source, on page 3-14.
Control Enabled
Select the check box to display the Source Information pane in addition to
the Sensor Information pane on the IQM-233 Standard window (refer toFigure 3-8 on page 3-7). The Source Information pane provides additional
operating functions and readouts for PID closed-loop control or manualcontrol of up to three deposition sources.
NOTE: Click OK to save the Setup parameters.

Click Setup >> Sensor on the menu bar to display the Sensor Setup window,
where Density and Z-Ratio values specific to the material to be deposited, and a
Tooling value to compensate for sensor/source geometry, are entered. See Figure
3-12.
Figure 3-12 Sensor Setup window

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3.3.3.1.3 Sensor

IQM-233 Operating Manual

Sensor Fields
The Sensor 1, Sensor 2, and Sensor 3 fields correspond to the sensor(s)connected to the SMA connectors on the IQM-233 card, with Sensor 1
corresponding to the SMA connector closest to the D-sub connector (refer toFigure 2-7 on page 2-9). Each sensor field contains the following parameters:
Density (g/cm3) . . . . . . . . . . . . . . . . 0.4 to 99.99 g/cm3
Enter the density of the material to be deposited using the corresponding
sensor. See Table A-1 for material density values. The default value is 1.00. If
the density value is not available for a material, see section 6.2, Determining
Density, on page 6-1.
Tooling (%) . . . . . . . . . . . . . . . . . . . 0.00 to 999.00
Enter a Tooling value to compensate for differences in the measured deposition
rate and actual deposition rate at the substrate due to the sensor or substrategeometry (see Figure 3-13). The default value is 100.00. To determine theTooling value, see section 6.3, Determining Tooling, on page 6-2.
Figure 3-13 Tooling settings
Substrate
Substrate

Substrate

Substrate

Tooling

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Tooling100%
Overover100%

ToolingToolingunder 100%
Under 100%

Z-Ratio . . . . . . . . . . . . . . . . . . . . . . . 0.100 to 9.999
Enter a Z-Ratio value specific to the material being deposited to compensate
for the mechanical elasticity of the material to the quartz crystal. See Table A-1
for material Z-Ratio values.
If the Z-Ratio of a material is not known, enter the default value of 1.000 for
Z-Ratio. Z-Ratio has a smaller effect when the crystal is relatively new. To
determine Z-Ratio experimentally, see section 6.4, Determining Z-Ratio, on
page 6-3.
NOTE: Click OK to save the Sensor Setup parameters.

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IQM-233 Operating Manual

3.3.3.1.4 Source
Click Setup >> Source on the menu bar to display the Source Setup window
where parameters related to the source power supply characteristics, the desired
material rate, and final thickness can be configured. See Figure 3-14.
NOTE: The Source button is unavailable unless the Control Enabled check box
is selected in the Setup window. Refer to Figure 3-11.
Figure 3-14 Source Setup window

Output Fields
The Output 1, Output 2, and Output 3 fields correspond to the source power
supply or supplies connected to the D-sub connector on the IQM-233 card(refer to Table 2-2 on page 2-13). Each Output field contains the following
parameters:
Full Scale (V). . . . . . . . . . . . . . . . . . 0 to ±10 V

Max Power (%) . . . . . . . . . . . . . . . . 0 to 100%
Enter the maximum voltage allowed for the corresponding IQM-233 cardsource output, as a percentage of the Full Scale (V) setting. For example, if -10
is entered for Full Scale (V) and 75 is entered for Max Power (%), the IQM-233
card source output voltage will not exceed 75% of –10 V, or –7.5 V.
Slew (%) . . . . . . . . . . . . . . . . . . . . . 0 to 100%
Enter the maximum percentage of Full Scale (V) change allowed per second
for a source output using PID closed-loop control.
Rate (Å/s) . . . . . . . . . . . . . . . . . . . . -999.9 to 999.9 Å/sEnter the rate at which the deposition is to be controlled.
Final Thickness (kÅ) . . . . . . . . . . . 0.00 to 999.90 kÅEnter the value that when reached, will set all source output voltages to zero,
ending the deposition.

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Enter the desired value for the source output voltage for 100% power. Thisvalue can be from -10.0 to +10.0 (the + sign is not required), but must notexceed the maximum input voltage allowed for the equipment connected to thesource output.

IQM-233 Operating ManualP . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to 9999
P is the proportional term that sets the gain of the control loop. A value of 0
makes this function unavailable. Enter a high gain for a faster responding (butpotentially unstable) control loop, and a lower gain for a slower responding
control loop. Enter a value of 25, and then gradually increase or decrease thevalue to respond as desired to rate step changes. See section 6.5, Tuning theControl Loop, on page 6-5.
I . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to 999.9
I is the integral term that controls the time constant of the loop. A value of 0
makes this function unavailable. Enter a small I Term, such as 0.5 to 1 second,to smooth the response and minimize overshoot to rate step changes. See
section 6.5, Tuning the Control Loop, on page 6-5.
D. . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to 99.9
D is the derivative term that determines how quickly the control loop responds
to changes. A value of 0 makes this function unavailable. Enter 0 or a verysmall value to avoid rate oscillations, especially with fast sources, such as
electron beam guns. Slow sources, such as resistively heated sources, may
require a large D value. See section 6.5, Tuning the Control Loop, on page 6-5.
NOTE: Click OK to save the Source Setup parameters.
3.3.3.2 Map Sensor
Map Sensor . . . . . . . . . . . . . . . . . . . None, Output 1, Output 2, Output 3
Unavailable (default is None) unless the Control Enabled check box is selectedin the Setup window. Refer to Figure 3-11.

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Select None if monitoring a deposition, or select an Output if controlling adeposition by PID closed-loop or manual source control.
Each sensor can be mapped to a different output for codeposition.
Multiple sensors can be mapped to the same output for rate averaging. The Rate
readouts in the Source Information pane display an aggregate rate when multiple
sensors are mapped to an output. Rate readouts in the Sensor Information pane
are not affected by the Map Sensor configuration and display Rate only for theindividual sensors. If a sensor's rate becomes erratic during deposition, the sensor
can be turned off by changing the Output to None. If any sensor fails, its
measurement is automatically excluded from the aggregate rate.
Click ▼ to view the Map Sensor list. See Figure 3-15.

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IQM-233 Operating Manual
Figure 3-15 Map Sensor list

Select None if no output will be mapped to the corresponding sensor. Thissensor will only monitor the deposition.



Select Output 1, Output 2, or Output 3 to map the output to the corresponding
sensor.
NOTE: If the Control Enabled check box is cleared in the Setup window after
a Map Sensor output is selected, the Map Sensor buttons become
unavailable and display the selected configuration.

3.3.3.3 Source Control
Source Control . . . . . . . . . . . . . . . . Auto, Manual, Off
Click ▼ to view the Source Control list. See Figure 3-15.

3 - 16



Select Auto for PID closed-loop control of the source power supply.



Select Manual for manual control of the source power supply.



Select Off to make the source output unavailable. Sensors mapped to that
output will monitor the deposition.

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Figure 3-16 Source Control list

IQM-233 Operating Manual

3.3.3.4 File
File . . . . . . . . . . . . . . . . . . . . . . . . . . Load, Save As
The parameters for Setup, Map Sensor, and Source Control can be saved to an.xml format configuration file.
Click File >> Save As on the menu bar to display the Save As window. Type aname for the configuration file and browse for a folder to save the file to. Click Saveto save the configuration file. See Figure 3-17.

PN 074-584-P1B

Figure 3-17 Save As window

A previously saved .xml format configuration file can be loaded into the IQM-233
Standard software.
Click File >> Load to display the Open window. Browse for the folder where aconfiguration file was previously saved to. Click the name of the configuration file
to be loaded, and then click Open to load the configuration to the software. See
Figure 3-18.
NOTE: Each time the IQM-233 Standard software is started, factory-default
parameter values in a configuration file named Config.xml areautomatically loaded. The factory-default parameter values will beoverwritten if changes are made to the parameter values and the newparameters are saved to the Config.xml file, or if the check box next to
Save any changes to Config.xml is selected upon exiting the software.

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IQM-233 Operating Manual
Figure 3-18 Open window

3.3.4 IQM-233 Standard Window Description
In the IQM-233 Standard window (see Figure 3-19), only the Sensor Information
pane is displayed when the Control Enabled check box is cleared in the Setup
window (refer to Figure 3-11 on page 3-10). This pane allows a deposition to bemonitored only.

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Figure 3-19 IQM-233 Standard window

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IQM-233 Operating Manual

The Source Information pane is displayed below the Sensor Information pane
when the Control Enabled check box is selected in the Setup window. This paneallows a deposition to be controlled using PID closed-loop or manual source
control.
The readouts on the Sensor Information pane are described by section 3.3.4.1,
Sensor Information Pane Readouts, on page 3-19.
The readouts on the Source Information pane are described by section 3.3.4.2,
Source Information Pane Readouts, on page 3-21.
The operating functions on the IQM-233 Standard window are described bysection 3.3.4.3, Global Operating Functions, on page 3-22 and section 3.3.4.4,
Source Control Operating Functions, on page 3-23.
The About IQM-233 Standard window provides software and hardware
information. See section 3.3.4.6, About IQM-233 Standard Window, on page 3-25.
The IQM-233 Standard software is configured by the Setup list on the menu bar,the Map Sensor list in the Sensor Information pane, and the Source Control listin the Source Information pane. Refer to section 3.3.3, Software Configuration, on
page 3-8.
3.3.4.1 Sensor Information Pane Readouts

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Figure 3-20 Sensor Information pane - readouts

Sensor Fields
The Sensor 1, Sensor 2, and Sensor 3 fields correspond to the crystal
sensor(s) connected to the SMA connector(s) on the IQM-233 card, with
Sensor 1 corresponding to the SMA connector closest to the D-sub connector.
Each Sensor field displays the following readouts:

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IQM-233 Operating Manual

Thickness (kÅ) . . . . . . . . . . . . . . . . 0.0000 to 999.90 kÅ
The calculated thickness of material deposited on the substrate, based on the
thickness measured by the corresponding sensor. The thickness calculation isaffected by the Density, Z-Ratio, and Tooling values displayed in the Sensor
Setup window. Refer to Figure 3-12 on page 3-12.
Rate (Å/s) . . . . . . . . . . . . . . . . . . . . –999.9 to 999.9 Å/s
The calculated rate of deposition at the substrate. The rate calculation isaffected by the Density, Z-Ratio, and Tooling values in the Sensor Setup
window (refer to Figure 3-12 on page 3-12) and the Measurement Period andFilter Readings values displayed in the Setup window (refer to Figure 3-11 on
page 3-10).
Freq (Hz) . . . . . . . . . . . . . . . . . . . . . 4000000.00 to 6100000.00 Hz, FailThe fundamental frequency of the crystal. Fail is displayed when no sensor isconnected, no frequency is detected, or the frequency is not within the limits of
the Crystal Frequency settings in the Setup window. Refer to Figure 3-11 on
page 3-10.
Life (%) . . . . . . . . . . . . . . . . . . . . . . 0 to 100%

PN 074-584-P1B

Represents the maximum possible percentage of crystal life remaining before
a crystal Fail is displayed by the Freq (Hz) readout. The Life (%) value isdependent on material properties and process conditions, and is affected by
the Crystal Frequency settings in the Setup window (refer to Figure 3-11 on
page 3-10). The Life (%) value for a new crystal is at or near 100. When Fail isdisplayed by the Freq (Hz) readout, "?" is displayed by Life (%).

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3.3.4.2 Source Information Pane Readouts
Figure 3-21 Source Information pane - readouts

Output Fields
The Output 1, Output 2, and Output 3 fields display the following readouts:
Thickness (kÅ) . . . . . . . . . . . . . . . . 0.0000 to 999.90 kÅ
The thickness of material deposited on the substrate, based on the thickness
measured by the sensor, or sensors, mapped to the corresponding output. If
multiple sensors are mapped to an output, the thickness readout is an averageof the mapped sensor thicknesses.

PN 074-584-P1B

Rate (Å/s). . . . . . . . . . . . . . . . . . . . . –999.9 to 999.9 Å/s
The rate of deposition at the substrate, based on the rate measured by thesensor, or sensors, mapped to the corresponding output. If more than one
sensor is mapped to an output, the output's displayed rate is an average of the
mapped sensor rates.
Rate Dev (%) . . . . . . . . . . . . . . . . . . –100% to 100%
The percentage deviation of the Rate (Å/s) display from the desired rate settingin the Source Setup window.
Power (%) . . . . . . . . . . . . . . . . . . . . 0 to 100%
The percentage of source output voltage relative to the Full Scale (V) voltage
setting for the corresponding output channel.

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IQM-233 Operating Manual

3.3.4.3 Global Operating Functions
The following operating functions are always available. See Figure 3-22.
Figure 3-22 Operating functions

Logging Off, Logging On
The data log function saves Rate, Thickness, Frequency, and Life data, forindividual sensors and outputs in .csv format. Refer to section 3.3.3.1.1, Log,on page 3-9.

Click Logging On, which changes to Logging Off, to make data logging
unavailable.
Start, Stop
Click Start, which changes to Stop, to zero the thickness readouts of all
sensors, and start the thickness and rate readings. If the Source Information
pane is displayed, source power will be applied if an Output is selected for Map
Sensor and Auto or Manual are selected for Source Control.
Click Stop, which changes to Start, to freeze the values in the thickness andrate readouts. If the Source Information pane is displayed, source power will
be set to zero in addition to freezing the thickness and rate readouts.
Zero All
Click Zero All to zero all thickness readouts in the Sensor Information andSource Information panes.

3 - 22

PN 074-584-P1B

Click Logging Off, which changes to Logging On, to activate data logging.
Data logging may be activated with Start or Stop displayed; however, data is
not collected until Stop is displayed. If data logging was not previously
configured, the Save As window will be displayed to allow selection of a datalog path and file name (refer to section 3.3.3.1.1).

IQM-233 Operating Manual

Zero
Click Zero in the Sensor Information pane to zero the thickness readout of thecorresponding sensor. If an output is mapped to this sensor, the effect of thezero function on the corresponding thickness readout in the Source
Information pane is determined by the sensor mapping (refer to section
3.3.3.2, Map Sensor, on page 3-15).
3.3.4.4 Source Control Operating Functions
In addition to the operating functions described by section 3.3.4.3, the following
operating functions are available when the Source Information pane is displayed.
See Figure 3-23.

PN 074-584-P1B

Figure 3-23 Operating functions - source control

Source Control . . . . . . . . . . . . . . . . Auto, Manual, Off
Click ▼ to view the Source Control list. See Figure 3-24.
Figure 3-24 Source Control list

Select Auto for PID closed-loop control of the source power supply.



Select Manual for manual control of the source power supply.



Select Off to make the source output unavailable. Sensors mapped to that
output will monitor the deposition.

3 - 23

IQM-233 Operating Manual

Manual Power (%) . . . . . . . . . . . . . 0 to 100%Manual must be selected in the Source Control list to use this function.
In the Manual Power (%) cell of the corresponding output field, type or selecta value, and then click another cell or press Enter to accept the value. The
source output voltage and Power (%) will remain at zero until Start is clicked.
Zero
Click Zero in the Source Information pane to zero the thickness readout in thecorresponding output field and zero the thickness readout(s) in the sensor
information pane for any sensor mapped to that output.
Hold, Resume
Hold is available only when Stop is displayed. Click Hold, which changes toResume, to freeze all thickness values and set all source output power levels
to zero.
Click Resume, which changes to Hold, to continue the deposition from thepreviously frozen thickness value.
3.3.4.5 Simulate Mode
Simulate mode allows a deposition process to be developed and tested without theneed for an IQM-233 or SQM-242 card to be installed or sensors to be connected
to an installed card. Simulated values are provided for the thickness, rate, rate
deviation, frequency, life, and power readouts.
To activate and configure Simulate mode:

1 On the menu bar, click Setup >> General.
3 Select the Enable Simulate check box. This check box is automaticallyselected when no cards are installed.

4 In the Card Type box, click ▼ and then select from the list the card type to be
simulated (IQM-233 or SQM-242).

5 Simulation of a deposition process requires the Source Information pane forsource control. Select the Control Enabled check box if the Source
Information pane is not displayed in the IQM-233 Standard window.

6 Click OK to save the parameters.
NOTE: The simulated Rate and Thickness will remain at zero until the Power(%) readout increases to approximately 50%.
NOTE: The factory-default PID values of P = 5, I = 2.0, and D = 0.00 provide
a stable simulated rate. The simulated rate may become unstable if the
PID values are changed. Refer to section 3.3.3.1.4, Source, on page
3-14 for information on configuring the PID values.

3 - 24

PN 074-584-P1B

2 The Setup window will display. See Figure 3-25.

IQM-233 Operating Manual
Figure 3-25 Setup window - simulate settings

3.3.4.6 About IQM-233 Standard Window

PN 074-584-P1B

On the menu bar, click About to display the About IQM-233 Standard window,
which displays the IQM-233 Standard software version, DLL version, software
installation path, installed Card Type (None, IQM-233, SQM-242), and installed
Card Count (0 to 6). See Figure 3-26.
NOTE: IQM-233 Standard software supports one IQM-233 or SQM-242 card;
however, the Card Count will indicate the quantity of installed IQM-233
or SQM-242 cards (up to six cards of one type).
Figure 3-26 About IQM-233 Standard window

3 - 25

IQM-233 Operating Manual

3.3.4.7 Current Configuration File
The name of the currently used configuration file is displayed on the menu bar (seeFigure 3-27). The Config.xml configuration file, containing the factory-default
software configuration parameters, is automatically loaded when the IQM-233
Standard software is started. Other previously saved configuration files can then beloaded using File >> Load (refer to section 3.3.3.4, File, on page 3-17).
Figure 3-27 Configuration file

CAUTION
If the Config.xml file is not found by the IQM-233 software
upon starting, an error will occur and the software willclose. Do not move this file to another folder location orchange the name of this file.

3.3.4.8 Exit Window
When exiting the IQM-233 Standard software, changes made to the current
configuration parameter values can be saved by selecting the Save any changes
to (name).xml check box and clicking Yes. See Figure 3-28.
Figure 3-28 Exit window - Save any changes

3 - 26

PN 074-584-P1B

NOTE: Initially, the Config.xml file contains factory-default parameter values;
however, the factory-default parameter values can be overwritten ifchanges are made to the parameter values and the new values are saved
to the Config.xml file, either by using File >> Save (refer to section
3.3.3.4, File, on page 3-17), or by selecting the check box next to Save anychanges to Config.xml upon exiting the IQM-233 Standard software (seesection 3.3.4.8).

IQM-233 Operating Manual

Chapter 4
Remote Communications
4.1 Introduction
Figure 4-1 illustrates basic concepts for interfacing to the IQM-233 card.
Figure 4-1 Communications diagram

IQM-233 DLL

Sensor Inputs
IQM-233
PCI Express Card(six cards maximum)

Function
Calls

RS-232
Any
Windows-based
Software

IQS-233 Codeposition
Software

PN 074-584-P1B

Digital I/O (PLC)

RS-232Ethernet

Windows
Communication
Foundation

Control Outputs

External Control
Computer

ASCII Commands

Communications with the IQM-233 card are through a provided 32-bit or 64-bit
DLL, placed in the Windows system directory. A description of each DLL function
is listed in section 4.2, DLL Functions, on page 4-2.
A LabVIEW VI sample is provided on the Thin Film Manuals CD to demonstrate thesyntax for calling the DLL. See section 4.3, LabVIEW VI Sample, on page 4-7.
The optional IQS-233 Codeposition software can be used as the user interface.
This software provides multi-layer processes, graphing, data logging, and digital
I/O (with external PLC). IQS-233 Codeposition software can be controlled from
customer-designed software by ASCII text commands. Contact INFICON for more
information regarding the optional IQS-233 Codeposition software.

4-1

IQM-233 Operating Manual

4.2 DLL Functions
In the function descriptions below, long indicates a 32 bit integer, double indicatesa double precision real. Array parameters require a pointer to the first element of
the array (standard C calling convention).
NOTE: These function definitions are for IQM233.DLL, which supports up to
six IQM-233 or six SQM-242 cards. Contact INFICON for information oninterfacing to the older SQM242.DLL (refer to section 1.3, How To Contact
INFICON, on page 1-5).

Sif142Startup2 (long Mode, long CardStatus (0 to 7))
Loads the DLL and initializes the card. Must be called with Mode=0 before anyother function. The card status parameter is an array that returns card
installation status information
Mode . . . . . . . . . . . . . . . . . . . . . -1 unloads the DLL, any other value loads the
DLL.
CardStatus(0) . . . . . . . . . . . . . . DLL and card installation status. Values >900
are errors.
CardStatus (1 to 6) . . . . . . . . . . Firmware revision of card 1 to 6. Zeroindicates no card found.

Sif142Init (double Xfmax, double Xfmin, double Xinit,
double Period)
Initializes the measurement engine. Must be called before readings are taken.

Xfmin . . . . . . . . . . . . . . . . . . . . . Minimum crystal frequency (4.0 MHz
minimum). Any measurement less than thisvalue will return a crystal failure.
Xinit . . . . . . . . . . . . . . . . . . . . . . Initial frequency of a new crystal. Usuallyeither 6.00 MHz or 5.00 MHz. Must be
between Xfmax and Xfmin.
Period . . . . . . . . . . . . . . . . . . . . Sets the time period to collect one
measurement between 0.1 and 2 seconds.

4-2

PN 074-584-P1B

Xfmax. . . . . . . . . . . . . . . . . . . . . Maximum crystal frequency (6.1 MHz Max).
Any measurement greater than this value will
return a crystal failure.

IQM-233 Operating Manual

Sif142Simulate (long Mode)
Sets the operating mode. Normal mode requires the IQM-233 card(s), sensors,
and a source power supply for proper operation. In simulate mode, no IQM-233
card is required. The DLL simulates the frequency readings and power output
required for PID loop control. The initial sensor frequency is fixed at 5.95 MHz
and approximately 50% output power is required to start simulating deposition.
Mode . . . . . . . . . . . . . . . . . . . . . 1 turns on simulate mode
0 turns on normal mode

Sif142StartMeas ()Starts the card measuring frequency and zeros the sensor thickness reading.

Sif142ZeroSensor (long SensorNum)
Sets a sensor (0 to 23) thickness reading to zero.

Sif142Zero2 (long OutputNum)
Sets a control output (0 to 17) thickness reading for each assigned sensor tozero.

Sif142Material (long Sensor, double Density, double
Zfact, double Tooling)

PN 074-584-P1B

Sets up the material-specific parameters for each sensor.
Sensor . . . . . . . . . . . . . . . . . . . . A bit-weighted value for sensor(s). The threelowest bits determine the selected sensor(s).
Add the bits to select multiple sensors, forexample, send 111 to select all three
sensors.
001 = Sensor 1
010 = Sensor 2
100 = Sensor 3
Density. . . . . . . . . . . . . . . . . . . . Sets the density of the material. Values arefrom 0.4 to 99.99 g/cm3. Refer to Appendix
A, Material Table.
Zfact . . . . . . . . . . . . . . . . . . . . . . Z-Ratio (Z-Factor) of the material. This
number has no units, and can be found in
Appendix A, Material Table. Values are from0.100 to 9.999.
Tooling. . . . . . . . . . . . . . . . . . . . Accounts for the difference in deposition rate
at the sensor vs. the substrate. Values are arange from 0 to 9.99, representing 0 to 999%.
Refer to section 6.3, Determining Tooling, on
page 6-2.

4-3

IQM-233 Operating Manual

Sif142GetMaterial (double SensorParams (0 to 23, 0 to 2),
double SystemParams (0 to 4)
Read material parameters: Density, Z-Ratio, and Tooling (0 to 23, 0 to 2) andsystem parameters: max freq, min freq, init freq, period, norm/sim (0 to 4)

Sif142FullScale (long Output, double FullScaleVolts,
double MaxPwr, double SlewRate)
Sets the source output operating parameters.
Output . . . . . . . . . . . . . . . . . . . . The output of these parameters 0 to 17.
FullScaleVolts. . . . . . . . . . . . . . Maximum scaled voltage for the output when
the output is at 100% power. Values from -10
to +10 are valid.
MaxPwr . . . . . . . . . . . . . . . . . . . Maximum power that the loop is allowed to
output, expressed as 0.0 to 1.0, representing
0% to 100%.
SlewRate . . . . . . . . . . . . . . . . . . Maximum rate of change of the output,
expressed as the percent of Full Scale times
0.01 second.

Sif142Auto (long Output)
Exits manual power control and starts the control loop running on the indicatedoutput channel.
Output . . . . . . . . . . . . . . . . . . . . 0-17, indicating the output to place in PID
control.

Sets the control loop parameters for an output. The sensors specified in
Sif142MapSensors are averaged to provide the input parameters to the PID
loop.
Rate . . . . . . . . . . . . . . . . . . . . . . Specifies the rate to control, from -999.9 to999.9 Å/s.
P . . . . . . . . . . . . . . . . . . . . . . . . . Proportional (gain) term of the PID loop, from0 to 9999. This number has no units.
I . . . . . . . . . . . . . . . . . . . . . . . . . Integral term, from 0 to 999.9, expressed inseconds.
D. . . . . . . . . . . . . . . . . . . . . . . . . Derivative term, from 0 to 99.9, expressed inseconds.
Output . . . . . . . . . . . . . . . . . . . . The output (0 to 13) to which the parameters
apply.

4-4

PN 074-584-P1B

Sif142Loop2 (double Rate, double P, double I, double D,
long Output)

IQM-233 Operating Manual

Sif142SetPower (long Output, double Power)
Sets the control voltage value in Manual mode. If an output was in Auto mode,turns off PID control and places the output in Manual mode.
Output . . . . . . . . . . . . . . . . . . . . Specifies the output, from 0 to 17.
Power. . . . . . . . . . . . . . . . . . . . . Between 0.0 and 1.0, representing 0 to 100%of Full Scale.

Sif142MapSensors (long SensLoop(0 to 23))
An array that associates each sensor (0 to 23) with an output (0 to 17) for PID
control. An output value of -1 for a sensor causes the sensor to continue tomonitor deposition, but have no effect on output control.
SensLoop (). . . . . . . . . . . . . . . . Array (0 to 23) of sensor to output
assignments (0 to 17).

Sif142GetReadings (double SensorArray(0 to 23, 0 to 2),
double OutputArray (0 to 17))
Fills two arrays with measurement data. In the second dimension of theSensorArray the elements are Rate (Å/s), Thickness (Å), and Frequency (Hz).
Negative frequency values indicate a sensor error. OutputArray is output
power, 0 to 1.
If a 0 is returned, there are no new readings available. A non-zero value
indicates there is new data, with the returned value indicating the number ofreadings in the buffer. The buffer is 10 readings long. To flush the buffer, keep
reading until there is no new data.

PN 074-584-P1B

Sif142GetPower (double PowerArray(0 to 17))
Fills the array with the current output powers. Unlike Sif142GetReadings
OutputArray, the value is an instantaneous unbuffered value.

SqmSimulate (long Type)
Sets the type of card to simulate.
Type . . . . . . . . . . . . . . . . . . . . . . Type of board to emulate
1 = SQM-242
2 = IQM-233

4-5

IQM-233 Operating Manual

SqmSystemState (long *CardTypeInstalled, long
*ActiveCardType, long *NumCardsInstalled, long
*NumOutputsTotal, long *NumSensorsTotal, long
*NumOutputsPerCard, long *NumSensorsPerCard, long *Sim,long *NumActiveCards)
Sets the material-specific parameters for each of the sensors.
CardTypeInstalled. . . . . . . . . . . Type of card physically installed
0 = No card
1 = SQM-242
2 = IQM-233
ActiveCardType . . . . . . . . . . . . Type of card currently being run or emulated
1 = SQM-242
2 = IQM-233
NumCardsInstalled. . . . . . . . . . Number of actual cards installed
NumOutputsTotal . . . . . . . . . . . Total outputs for all cards, either physical oremulated
NumSensorsTotal . . . . . . . . . . . Total sensors for all cards, either physical oremulated
NumOutputsPerCard . . . . . . . . Number of outputs per card
NumSensorsPerCard . . . . . . . . Number of sensors per card

NumActiveCards . . . . . . . . . . . Number of cards currently running, either
real or emulated

4-6

PN 074-584-P1B

Sim. . . . . . . . . . . . . . . . . . . . . . . Current simulation mode
0 = Not in simulation mode
1 = SQM-242
2 = IQM-233

IQM-233 Operating Manual

IqmGetReadings (double SensorArray(0 to 23, 0 to 2),
double OutputArray (0 to 17), double *Time)
SensorArray . . . . . . . . . . . . . . . Elements are Rate (Å/s), Thickness (Å), andFrequency (Hz)Negative frequency values indicate a sensor error.
OutputArray . . . . . . . . . . . . . . . Output power, 0 to 1
Time . . . . . . . . . . . . . . . . . . . . . . Time since midnight when measurement
readings were taken. If a 0 is returned, no
new readings are available. A non-zero value
indicates there is new data, with the returned
value indicating the number of readings inthe buffer. The buffer is 10 readings long. To
flush it, keep reading until there is no newdata.

4.3 LabVIEW VI Sample
A LabVIEW VI sample file for use with LabVIEW is provided on the Thin Film
Manuals CD. The LabVIEW VI sample aids in creating user-developed software,and interfacing the IQM-233 card with other devices.

4.3.1 Getting Started With The LabVIEW VI Sample

PN 074-584-P1B

Requirements for the LabVIEW VI sample:


LabVIEW software version 6 or higher must be installed on the computer.



The IQM233 DLL must be installed on the computer. Refer to section 3.2.1,
DLL Installation, on page 3-1.

1 Insert the Thin Film Manuals CD into the computer’s CD drive.
2 Click Windows Explorer or File Explorer >> Computer >> (CD drive letter:)
INFICON Technical Documentation >> IQM-233 Card >> IQM-233 Samples.

3 Extract the contents of the IQM-233 VI Sample.zip folder.
4 Double-click the IQM233.vi file to display the IQM-233 VI Sample window. See
Figure 4-2.

5 Click Load DLL and then click Run in LabVIEW software. The DLL LOADED
indicator should now be illuminated.

6 In the Card Setup pane, the Normal Mode indicator is illuminated when the
IQM-233 VI is interfaced to an installed IQM-233 card. To simulate an IQM-233
card, whether or not a card is installed, click Simulate (Simulate Mode
indicator illuminates).

4-7

IQM-233 Operating Manual

7 Click Start Readings to obtain Sensor readings for Rate (Å/s), Thickness (Å),
and Frequency (Hz), and to apply power at the IQM-233 card’s source outputs.

8 Click Unload DLL before exiting the IQM-233 VI Sample window; otherwise, aWindows error will occur.

PN 074-584-P1B

Figure 4-2 IQM-233 VI Sample window

4-8

IQM-233 Operating Manual

Chapter 5
Troubleshooting and Maintenance
5.1 Troubleshooting Guide
If the IQM-233 card does not function as expected, or appears to have diminishedperformance, the following Symptom/Cause/Remedy charts may be helpful (seeTable 5-1). Additional troubleshooting information can be found in the operating
manuals for sensors, located on the Thin Film Manuals CD. If the problem cannot
be resolved, contact INFICON (refer to section 1.3, How To Contact INFICON, on
page 1-5).

CAUTIONThe IQM-233 card has no user serviceable components.
Refer all maintenance to qualified INFICON personnel.

CAUTION - Static Sensitive Device
Use ESD precautions when handling the IQM-233 card.

PN 074-584-P1B

WARNING - Risk Of Electric ShockPotentially lethal voltages are present when the line cord,
Inputs or Outputs are connected.

5-1

IQM-233 Operating Manual

Table 5-1 Symptom/Cause/Remedy Chart

SYMPTOMCAUSE

REMEDY

Freq (Hz) displays unstable Temperature of the crystal is Control the vacuum chamberor drifting frequency.
unstable (an AT-cut crystal temperature.
may drift as much asMove the crystal farther away
10 Hz/°C).
from the source (at least
25.4 cm (10 in.) from source).
Check sensor water coolingfor correct flow andtemperature.
Clean or replace the crystal
holder.
Use SPC-1157-G10 thermal
shock crystals designed tominimize frequency shifts
due to heat load.

Defective in-vacuum cable or Use an ohmmeter to checkcoax cables.
electrical continuity andisolation.
Check crystal and crystal
holder’s crystal seating
surface for scratches orcontamination.
Freq (Hz) displays unstable Excessive cable lengthand incorrect frequency.
between oscillator andcrystal causes a
self-oscillation condition.

5-2

Replace crystal.
Clean or replace crystal
holder.
Use no longer than a 78.1 cm(30.75 in.) in-vacuum cable.
Use only the 15.2 cm (6 in.)cable between oscillator andfeedthrough.

PN 074-584-P1B

Humidity level on the crystal Avoid condensation byis changing. Moisture being turning off cooling water toabsorbed or exuded from the sensor before opening thevacuum chamber to air, andcrystal surface.
then flow heated water above
the room’s dew point throughthe sensor when thechamber is open.

IQM-233 Operating Manual
Table 5-1 Symptom/Cause/Remedy Chart (continued)

SYMPTOM
Freq (Hz) displays Fail.

CAUSE

REMEDY

Failed or defective crystal, or Install a new crystal.
no crystal in sensor.
Two crystals were installed or Remove extra crystal.
crystal is upside down.
Reverse crystal orientation.
Inspect crystal for scratches;
if scratched, replace withnew crystal.
Built-up material at crystal
holder aperture is touching
the crystal.

Clean or replace the crystal
holder.

Crystal frequency is notwithin the frequency range
settings in software.

Use a 5 MHz or 6MHz
crystal.
Check the crystal frequency
range settings in software.

Excessive cable length
between oscillator andcrystal.

Use no longer than a 78.1 cm(30.75 in.) in-vacuum cable.

PN 074-584-P1B

Use only the 15.2 cm (6 in.)cable between oscillator andfeedthrough.

5-3

IQM-233 Operating Manual
Table 5-1 Symptom/Cause/Remedy Chart (continued)

SYMPTOM
Freq (Hz) displays Fail.

CAUSE

REMEDY

Check sensor connections.
Sensor not connected, orbad electrical connection insensor head or feedthrough, Use an ohmmeter to checkor bad cables.
electrical continuity / isolationof sensor head, feedthrough,in-vacuum cable, SMA/BNC
adapter cable, and BNC
cables. Refer to the sensor’s
operating manual for detailed
troubleshooting information.
Substitute a 5.5 MHz test
crystal or a known good
sensor for the suspectsensor. Refer to section
2.1.2.2.1, Sensor
Connection Troubleshooting,on page 2-12.
Use an ohmmeter to check
Bad coax cable between
feedthrough and oscillator, or electrical continuity /isolation.
bad coax cable between
oscillator and IQM-233 card.
Substitute a known goodcoax cable.

Substitute a known good
oscillator.
Substitute a 5.5 MHz test
crystal or a known good
sensor for the sensor. Referto section 2.1.2.2.1, Sensor
Connection Troubleshooting,on page 2-12.

5-4

PN 074-584-P1B

IQM-233 card or oscillator is Substitute a known good
malfunctioning.
IQM-233 card (or other
QCM).

IQM-233 Operating Manual
Table 5-1 Symptom/Cause/Remedy Chart (continued)

SYMPTOM
Freq (Hz) displays Failduring deposition before“normal” life of crystal isexceeded.

CAUSE

REMEDY

Crystal is being hit by small Use a shutter to shield thedroplets of molten material sensor during sourcefrom the evaporation source. conditioning.
Move the crystal farther away
(at least 25.4 cm (10 in.))from the source.
Damaged crystal or
Replace the crystal.
deposited material is causing
stress to crystal.
Use an Alloy crystal if
appropriate for depositedmaterial.

PN 074-584-P1B

Material build-up on crystal
holder is partially masking
the crystal surface.

Clean or replace the crystal
holder.

Freq (Hz) displays Failduring deposition before“normal” life of crystal isexceeded.

Visually check crystal for an
Shutter is partiallyobstructing deposition flux or uneven coating, and if
sensor is poorly positioned, present, correct shutter or
causing uneven distribution sensor positioning problem.
of material on crystal.

Freq (Hz) displays Failwhen vacuum chamber isopened to air.

Crystal was near the end of Replace the crystal.
its life; opening to air causes
film oxidation, which
increases film stress.
Excessive moisture
Avoid condensation byaccumulation on the crystal. turning off cooling water tosensor before opening thevacuum chamber to air, andthen flow heated water above
the room’s dew point throughthe sensor when thechamber is open.

5-5

IQM-233 Operating Manual
Table 5-1 Symptom/Cause/Remedy Chart (continued)

SYMPTOM
Rate, Thickness, andFrequency readings arenoisy.

CAUSE
Excessive cable length
between oscillator andcrystal.

REMEDYUse 78.1 cm (30.75 in.)in-vacuum cable (or shorter).
Use 15.2 cm (6 in.) cablebetween oscillator andfeedthrough.

Electrical noise is being
picked up by the coax cablebetween the oscillator and
IQM-233 card.

Locating the IQM-233 card
sensor / oscillator cables andsource output cables at least
30.5 cm (1 ft.) away from highvoltage / high power cables
and other sources ofelectrical noise significantly
reduces noise pickup.

Inadequate system
grounding.

Ground wires or straps
should connect to an
appropriate earth ground.
Refer to section 2.1.1.5,
Ground Requirements, on
page 2-4.

PN 074-584-P1B

Ground wires or straps
should be short with large
surface area to minimize
impedance to ground.

5-6

IQM-233 Operating Manual
Table 5-1 Symptom/Cause/Remedy Chart (continued)

SYMPTOM
Thickness reading haslarge excursions during
deposition.

CAUSE
Mode hopping due todamaged crystal.

REMEDY
Replace the crystal.

Crystal is near the end of its Replace the crystal.
life.
Scratches or foreign particles Clean the crystal seatingon the crystal holder seating surface inside the crystal
holder or replace crystal
surface.
holder.
Uneven coating onto crystal. A straight line from center ofsource to center of crystal
should be perpendicular to
face of crystal.
Particles on crystal.

Replace crystal.
Remove source of particles.

Intermittent cables orconnections.

Use an ohmmeter to check
electrical continuity / isolationof sensor head, feedthrough,in-vacuum cable, SMA/BNC
adapter cable, and BNC
cables. Refer to the sensor’s
operating manual for detailed
troubleshooting information.

PN 074-584-P1B

Inadequate cooling of crystal. Check water flow rate andtemperature for sensor
cooling.
Crystal not properly seated
Thickness reading has
or dirty crystal holder.
large excursions during
source warm-up or whensource shutter is opened(usually causes Thickness
reading to decrease) andafter the termination ofdeposition (usually causes
Thickness reading toincrease).

Check crystal installation.
Clean the crystal seating
surface inside the crystal
holder or replace crystal
holder.

5-7

IQM-233 Operating Manual
Table 5-1 Symptom/Cause/Remedy Chart (continued)

SYMPTOM

CAUSE

Excessive heat input to theThickness reading has
crystal.
large excursions during
source warm-up or whensource shutter is opened(usually causes Thickness
reading to decrease) andafter the termination ofdeposition (usually causes
Thickness reading toincrease).

REMEDYIf heat is due to radiationfrom the evaporation source,
move sensor farther away (atleast 25.4 cm (10 in.)) fromsource.
Use SPC-1157-G10 thermal
shock crystals designed tominimize frequency shifts
due to heat load.

Inadequate cooling of crystal. Check water flow rate andtemperature for sensor
cooling.
Crystal is being heated byelectron flux.

Use a sputtering sensor for
non-magnetron sputtering.

Crystal is being hit by small Use a shutter to shield thedroplets of molten material sensor during sourcefrom the evaporation source. conditioning.

Intermittent connection
occurring in sensor or
feedthrough with thermalvariation.

5-8

Use an ohmmeter to check
electrical continuity / isolationof sensor head, feedthrough,and in-vacuum cable. Referto the sensor’s operating
manual for detailed
troubleshooting information.

PN 074-584-P1B

Move the crystal farther away
(at least 25.4 cm (10 in.))from the source.

IQM-233 Operating Manual
Table 5-1 Symptom/Cause/Remedy Chart (continued)

SYMPTOM
Thickness reproducibility
is poor.

CAUSE
Erratic evaporation flux
characteristics.

REMEDY
Move sensor to a different
location.
Check the evaporation
source for proper operating
conditions.
Ensure relatively constantpool height and avoid
tunneling into the melt.
Assign multiple sensors to
the source.

Material does not adhere well Check for contamination on
to the crystal.
the crystal’s surface.
Evaporate an intermediate
layer of appropriate material
onto the crystal to improveadhesion.
Use gold, silver, or alloy
crystals, as appropriate.

PN 074-584-P1B

Rate control is poor.

PID control loop parameters Test in Manual mode toare incorrect.
ensure a stable rate ispossible.
Change PID control loop
parameters. Refer to section
6.5.2, Loop Tuning
Procedure, on page 6-7.
Electron beam sweep
frequency “beating” with the
IQM-233 card's
measurement frequency.

Adjust the sweep frequency
so it is not in phase with the
IQM-233 card's
measurement frequency.

Resolution is too low.

Increase the measurement
period.
Use measurement
averaging.

5-9

IQM-233 Operating Manual
Table 5-1 Symptom/Cause/Remedy Chart (continued)

SYMPTOM
Source output of IQM-233
card is not functioning
properly.

CAUSE

REMEDYA voltage is being applied to Remove the cause of thethe source output cable by applied voltage.
the source power supply orother equipment.
Polarity of source output
voltage is reversed or Full
Scale voltage setting insoftware is not appropriate
for source power supply.

Check the required input
polarity and input voltage ofthe source power supply.
Check the source output
wiring of the IQM-233.
Set the appropriate polarityand voltage range in
IQM-233 or IQS-233
software.

Source output cable wiring is Check source output cable
incorrect.
wiring.
IQM-233 card ismalfunctioning.
Software is notrecognizing the IQM-233
card.

Substitute a known good
IQM-233 card (or other
QCM).

Reinstall IQM-233 card.
IQM-233 card is not fully
inserted into the PCI Express
slot.

Remove existing IQM233
DLL, device driver, and
WinDriver. Remove IQM-233
Standard/IQS-233
Codeposition software.
Determine if Windows
operating system is 32-bit or
64-bit, and then install
appropriate (32-bit or 64-bit)
IQM233 DLL and install
software. Refer to section
2.1.2.1.1, IQM-233 Card
Installation Troubleshooting,on page 2-8.

5 - 10

PN 074-584-P1B

IQM-233 device driver is not Verify the operating system isinstalled correctly.
Windows XP SP3, 7, or 8.

IQM-233 Operating Manual

5.2 MaintenanceRoutine maintenance is not required for the IQM-233 card. However, the computer
the IQM-233 card is installed in should be operated in a clean environment. If
cleaning of the inside of the computer (and therefore the IQM-233 card) becomes
necessary due to dust accumulation, follow the computer manufacturer’s cleaning
recommendation.

5.3 Spare Parts
Oscillator . . . . . . . . . . . . . . . . . . . . . PN 782-900-010
SMA/BNC Adapter Cable . . . . . . . . . PN 600-1441-P1
BNC Cable (15.2 cm (6 in.)) . . . . . . . PN 782-902-011
BNC Cable (3.0 m (10 ft.)) . . . . . . . . PN 782-902-012-10
BNC Cable (7.6 m (25 ft.)) . . . . . . . . PN 782-902-012-25
BNC Cable (15.2 m (50 ft.)) . . . . . . . PN 782-902-012-50

PN 074-584-P1B

BNC Cable (30.5 m (100 ft.)) . . . . . . PN 782-902-012-99

5 - 11

IQM-233 Operating Manual

PN 074-584-P1B

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5 - 12

IQM-233 Operating Manual

Chapter 6
Calibration Procedures
6.1 Importance of Density, Tooling and Z-Ratio
The quartz crystal microbalance precisely measures the mass added to the face ofthe oscillating quartz crystal sensor. The IQM-233’s knowledge of the density of thisadded material allows conversion of the mass information into thickness. In someinstances, where highest accuracy is required, it is necessary to make a density
calibration as outlined in section 6.2.
Because the flow of material from a deposition is not uniform, it is necessary to
account for the different amount of material flow onto the sensor compared to thesubstrates. This is accounted for by the Tooling parameter. Tooling can beexperimentally established by following the guidelines in section 6.3 on page 6-2.
The Z-Ratio compensates for the elasticity of the deposited material to the quartz
crystal. If the Z-Ratio is not known, it can be estimated from the procedures outlined
in section 6.4 on page 6-3.

6.2 Determining Density
NOTE: The bulk density values retrieved from Appendix A, Material Table aresufficiently accurate for most applications.
Follow the steps below to determine density value.

PN 074-584-P1B

1 Place a substrate (with proper masking for film thickness measurement)
adjacent to the sensor, so that the same thickness will be accumulated on the
crystal and substrate.

2 Set Density to the bulk value of the film material or to an approximate value.
3 Set Z-Ratio to 1.000 and Tooling to 100.00%.
4 Place a new crystal in the sensor and make a short deposition(1000-5000 Å).

5 After deposition, remove the test substrate and measure the film thickness witha multiple beam interferometer or a stylus-type profilometer.

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IQM-233 Operating Manual

6 Determine the new density value with equation [1]:

 Tx 
3
Density  g  cm  = D i  ------- T m

[1]

where:Di = Initial density setting
Tx = Thickness reading on IQM-233
Tm = Measured thickness
7 Round off density to the nearest 0.01 g/cm3.
8 A quick check of the calculated density may be made by programming the
IQM-233 with the new density value and observing that the displayed thickness
is equal to the measured thickness, provided that the IQM-233's thickness has
not been zeroed between the test deposition and entering the calculated
density.
NOTE: Due to variations in source distribution and other system factors, it isrecommended that a minimum of three separate evaporations be made toobtain an average value for density.
NOTE: Slight adjustment of density may be necessary in order toachieve Tx = Tm.

6.3 Determining Tooling
1 Place a test substrate in the system's substrate holder.
3 Remove the test substrate and measure the film thickness with a multiple beaminterferometer or a stylus-type profilometer.

4 Calculate Tooling from the relationship shown in equation [2]:

 T m
Tooling (%) = TF i  ------- Tx 
where

Tm = Actual thickness at substrate holder
Tx = Thickness reading in the IQM-233 software
TFi = Initial Tooling factor

6-2

[2]

PN 074-584-P1B

2 Make a short deposition.

IQM-233 Operating Manual

5 Enter this new value for Tooling, rounded to the nearest 0.01%, in the Toolingbox of the IQM-233 Standard software; Tm will equal Tx if calculations are done
properly.

NOTE: Due to variations in source distribution and other system factors, it isrecommended that a minimum of three separate evaporations be made toobtain an average value for Tooling.

6.4 Determining Z-Ratio
A list of Z-Ratio values for materials commonly used are available in Appendix A,
Material Table. For other materials, Z-Ratio can be calculated from the following
formula:1-- d q  q 2

Z =  ------------ df f [3]

5

Z = 9.378  10  d f  f 

1
- --2

[4]

where:

df = Density (g/cm3) of deposited film
µf = Shear modulus (dynes/cm2) of deposited film
dq = Density of quartz (crystal) (2.649 g/cm3)

PN 074-584-P1Bµq = Shear modulus of quartz (crystal) (3.32 x 1011 dynes/cm2)
The densities and shear moduli of many materials can be found in a number ofhandbooks.
Laboratory results indicate that Z-Ratio values of materials in thin-film form are very
close to the bulk values. However, for high stress producing materials, Z-Ratio
values of thin films are slightly smaller than those of the bulk materials. For
applications that require more precise calibration, the following direct method issuggested:

1 Establish the correct density value as described in section 6.2 on page 6-1.
2 Install a new crystal and record its starting frequency, Fco. The starting

frequency will be displayed in the Freq (Hz) field of the Sensor-Output window.

3 Make a deposition on a test substrate such that the percent crystal life display
will read approximately 50%, or near the end of crystal life for the particularmaterial, whichever is smaller (the accuracy of the Z-Ratio determination will
improve with increased material thickness).

6-3

IQM-233 Operating Manual

4 Stop the deposition and record the ending crystal frequency Fc.
5 Remove the test substrate and measure the film thickness with either a multiple
beam interferometer or a stylus-type profilometer.

6 Using the density value from step 1 and the recorded values for Fco and Fc,

adjust the Z-Ratio value in thickness equation [5] to bring the calculated
thickness value into agreement with the actual thickness. If the calculated valueof thickness is greater than the actual thickness, increase the Z-Ratio value. If
the calculated value of thickness is less than the actual thickness, decrease the
Z-Ratio value.
4

Z q  10  1
F co
F c 
1
T f = --------------------   -------- ATan  zTan  -----------  –  ----- ATan  zTan  ---------   F q    F c
 Fq  
2zp   F co[5]where:

Tf = Thickness of deposited film (kÅ)
Fco = Starting frequency of the sensor crystal (Hz)Fc = Final frequency of the sensor crystal (Hz)Fq = Nominal blank frequency = 6045000 (Hz)z = Z-Ratio of deposited film material
Zq = Specific acoustic impedance of quartz = 8765000 (kg/(m2 x s))
p = Density of deposited film (g/cm3)

6-4

If the thickness of layer 1 is large compared to layer 2, use the Z-Ratio ofmaterial 1 for both layers.



If the thickness of layer 1 is thin compared to layer 2, use the Z-Ratio of material
2 for both layers.



If the thickness of both layers is similar, use a value for Z-Ratio which is theweighted average of the two Z-Ratios for deposition of layer 2 and subsequent
layers.

PN 074-584-P1B

For multiple layer deposition (for example, two layers), the Z-Ratio used for thesecond layer is determined by the relative thickness of the two layers. For mostapplications the following three rules will provide reasonable accuracies:IQM-233 Operating Manual

6.5 Tuning the Control Loop
The function of the control loop parameters is to match the instrument’s reaction toan error (between the measured deposition rate and the desired rate) to the time
related characteristics of the deposition source and its power supply. There arethree adjustable parameters; P (proportional), I (integral) and D (derivative) used
to accomplish this. It is convenient to think of sources as falling into two categories:"fast" or "slow." The tuning parameters are affected by source level, rate, sweep
range or beam density, Tooling and source condition.
The P parameter is the proportional term that sets the gain of the control loop. Entera higher value for a more responsive (but potentially unstable) control loop and alower value for the less responsive control loop.
The I parameter is defined as the integral term that inversely sets the set point
correction gain (a small number causes more error correction). It can be estimatedas twice the time for the rate to go from 1/3 to 2/3 of the desired rate (see Figure6-1). It instructs the controller on how much attention to pay to the schedule of therate profile.
Figure 6-1 Determining the I value

TIME
CONSTANTTime
from
1/3 to 2/3

Desired Rate

P

R
O
A

63%Rate
POINT
2/3
Point

1/3
Rate
Rate

W

T
E

PN 074-584-P1B

E

Power

R

0

RATE
Rate INCREASE
ChangeTIME

The D parameter is equivalent to the system Dead Time and is used to compensate
for slow responding sources such as boats and induction heated sources. Thisvalue can be estimated from the time difference between a change in % power andthe start of an actual change in rate (see Figure 6-2.) The D parameter instructs thecontroller on how much attention to pay to the Rate Deviation error. A value of zerotells the controller to ignore the Rate Deviation error. A large value tells thecontroller that the source is slow and it is going to be harder to get it going andharder to stop it. Therefore, if the rate starts to fall off, power increases, or if thetarget rate is quickly approaching, power decreases. Measurement rate noise may

6-5

IQM-233 Operating Manual

cause power output instability with larger D values. Use of the Filter Readings
parameter can help reduce a power output instability (refer to section 3.3.3.1.2,
General, on page 3-10).
Figure 6-2 Determining the D value

Dead
ControlTime
DT
P
Rate

R
A

O
W

Power

T
E

E
R

RATE INCREASE

POWER INCREASE

TIMEClassifying a source as being fast or slow is based on the time it takes for the rate
to change from a change in power (delay). It is straight forward to measure thedelay. Using manual power, establish a rate and allow it to become steady.
Increase the source power a few percent (~5% if possible). Allow the source toagain stabilize. If the delay time is greater than 1 second, the source ischaracterized as slow. All other sources are considered fast. In general, electron
beam (e-beam) sources (unless a hearth liner is used), some very small filamentsources, and sputtering sources are considered fast sources. Thermal evaporation
sources are typically considered slow.

6-6

PN 074-584-P1B

6.5.1 Identifying a Fast or Slow Source

IQM-233 Operating Manual

6.5.2 Loop Tuning Procedure
NOTE: Control loop tuning is a trial and error process and there is no "best"procedure to accomplish this task. It may take several adjustments toachieve the desired tune.

1 Set System Parameters
In the Setup window (Setup >> General):

Set Measurement Period to 0.25.



Set Filter Readings to 1 (no filter) to see the noise of the system.



Clear the Enable Simulate check box (if selected).

2 Create a One-Layer Test ProcessIn the Sensor Setup window (Setup >> Sensor), enter the Z-Ratio anddensity of the material being deposited.

In the Source Setup window (Setup >> Source), set the desired rate and a
non-zero Final Thickness (Final Thickness setting must be large enough so
it will not be reached during this procedure).

3 Activate Data Logging
Select the Data Log path by clicking Setup >> Log and choosing thedesired save location.



Click Logging Off (shown in red) on the IQM-233 Standard window.
Logging On will now be displayed in green.

NOTE: Data logging does not collect data until Start is clicked.

PN 074-584-P1B

4 Test the System Setup

Set Source Control to Manual and click Start.



Slowly increase Power to 10% and verify that the power supply output is
10% of Full Scale. If the readings do not agree, verify that the Full Scale
voltage in the Source Setup window (Setup >> Source) agrees with thepower supply input specifications.

Continue to increase power until the desired rate is achieved.



Log the data for a few minutes.



Slowly decrease power to 0%, and then press Stop.



Plot the data in a spreadsheet program. If the system has significant shortterm noise at a fixed power, the control loop will be difficult to adjust,especially at low rates. The source of the noise should be eliminated before
attempting to set the PID values (see section 5.1, Troubleshooting Guide,on page 5-1).

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IQM-233 Operating Manual

5 Set Filter Readings ParameterIn the Setup window (Setup >> General):

Set the Measurement Period to the desired value.



Test the setup following step 4 above.



If rate noise is present with Filter Readings setting of 1, slowly increase thevalue from 1 to a higher value until the rate display noise is minimized.

NOTE: If Filter Readings is set too high, the display will lag the true system
response and may hide significant problems.

6 Determine Max Power

Verify Source Control is set to Manual and click Start.



Slowly increase power until the desired rate is achieved.



Record the Power reading at the desired rate as PWRDR.



Set Max Power (%) to a value 20% higher than PWRDR.



If finished, slowly decrease power to 0%, and then press Stop. Otherwise,
continue to step 7.

Calculate 1/3 of the desired rate (RATE1/3), and 2/3 of the desired rate
(RATE2/3).



Slowly adjust the power until the rate matches RATE1/3 and is steady.



Quickly adjust Power (%) to PWRDR and measure the time for the rate toequal RATE2/3.



Twice the measured time is the step response time, TIMESR.



If finished, slowly decrease power to 0%, and then press Stop. Otherwise,
continue to step 8.

NOTE: TIMESR is typically 0.2 to 1 second for e-beam evaporation and at least
5 seconds for thermal evaporation.
NOTE: It is recommended to repeat this step several times to get an average
response time.

6-8

PN 074-584-P1B

7 Determine Open Loop Response Time (refer to Figure 6-1)

IQM-233 Operating Manual

8 Determine the Dead Time (refer to Figure 6-2)


Slowly increase power until the desired rate is achieved.



Quickly adjust Power by 1 to 2% and measure the time between when the
power is changed and when a change in rate is observed.



The time between the change in power and when the rate starts to change
is the Dead Time.



If finished, slowly decrease power to 0%, and then press Stop. Otherwise,
continue at step 9.

NOTE: It is common for the Dead Time of a fast source, such as an e-beam,
to be very small and possibly immeasurable. In this case, the Dead
Time can be considered zero.

9 Set Initial PID Values

Set the power to zero.

9a For a fast source (refer to section 6.5.1)
In the Source Setup window (Setup >> Source):

Set P to 25.



Set I to the TIMESR value (calculated in step 7) or zero.

Set D to zero.

9b For a slow source (refer to section 6.5.1)

PN 074-584-P1B



In the Source Setup window (Setup >> Source):

Set P to 25.



Set I to the TIMESR value (calculated in step 7).



Set D to the Dead Time value (calculated in step 8).

6-9

IQM-233 Operating Manual

10 Adjust PID Values according to control response

Set Source Control to Auto to activate PID control and observe the power.
The power should rise from 0% and stabilize near PWRDR.



If there is more than 10% overshoot in power or if the curve
appears under damped, lower the P value. If the time to reachPWRDR is very slow (over damped), increase the P value. See
Figure 6-3.



A lower I value will increase response for over damped sources. A
higher value may reduce ringing and rate deviations seen with
under damped sources. See Figure 6-3.

The D value should not need much adjustment, but if underdamped behavior is observed, increase the D value. If it appears
over damped, decrease the D value. See Figure 6-4.

Continue to adjust P and I values, alternating between 0% power in Manualmode and Auto mode until the steady-state response is smooth and thestep response is controlled.



If finished, slowly decrease power to 0%, and then press Stop.

NOTE: Preconditioning will minimize step changes.

PN 074-584-P1B

NOTE: E-beam systems may require additional steps to limit the control loop
response during arcing. First, be sure the Max Power parameter in the
Source Setup window is set to limit the output to a reasonable value forthe material and rate. The Slew setting can further limit aggressive
power changes, see section 3.3.3.1.4 on page 3-14. At rates below 10
Å/s, a Slew of 1 - 2% is common. Increasing the Filter Readings
parameter will limit the PID response to occasional large noise spikes,
such as those from arcing.

6 - 10IQM-233 Operating Manual
Figure 6-3 Examples of Control Loop Damping
NEGATIVE STEP

+40

0

-40

POSITIVE STEP

TIME----------- over damped----------- critically damped----------- under damped
Figure 6-4 Examples of Dead Time Settings

O

PN 074-584-P1B

D
IN ELACR Y
EA TIM
SI E
NG

RATE

SETPOINTA

B

O – under damped
A – critically damped
B – over damped

TIME

6 - 11

IQM-233 Operating Manual

PN 074-584-P1B

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6 - 12

IQM-233 Operating Manual

Chapter 7
Measurement Theory
7.1 Basics
The quartz crystal deposition monitor, or QCM, utilizes the piezoelectric sensitivityof a quartz monitor crystal to added mass. The QCM uses this mass sensitivity tocontrol the deposition rate and final thickness of a vacuum deposition.
When a voltage is applied across the faces of a properly shaped piezoelectric
crystal, the crystal is distorted and changes shape in proportion to the applied
voltage. At certain discrete frequencies of applied voltage, a condition of very sharp
electro-mechanical resonance is encountered.
When mass is added to the face of a resonating quartz crystal, the frequency ofthese resonances is reduced. This change in frequency is very repeatable and isprecisely understood for specific oscillating modes of quartz. This heuristicallyeasy-to-understand phenomenon is the basis of an indispensable measurement
and process control tool that can easily detect the addition of less than an atomic
layer of an adhered foreign material.
In the late 1950s it was noted by Sauerbrey1,2 and Lostis3 that the change infrequency, F = Fq-Fc, of a quartz crystal with coated (or composite) and uncoatedfrequencies, Fc and Fq respectively, is related to the change in mass from theadded material, Mf , as follows:

PN 074-584-P1B

MF -------f = ----------Mq
Fq[1]

where Mq is the mass of the uncoated quartz crystal. Simple substitutions
lead to the equation that was used with the first “frequency measurement”
instruments: F -
Tf = K--------------df[2]

where the film thickness, Tf, is proportional (through K) to the frequency change,
F, and inversely proportional to the density of the film, df. The constant,
K = Natdq/Fq2; where dq (= 2.649 g/cm3) is the density of single crystal quartz andNat (=166100 Hz cm) is the frequency constant of AT cut quartz. A crystal with astarting frequency of 6.0 MHz will display a reduction of its frequency by 2.27 Hz

1.G. Z. Sauerbrey, Phys. Verhand .8, 193 (1957)
2.G. Z. Sauerbrey, Z. Phys. 155,206 (1959)
3.P. Lostis, Rev. Opt. 38,1 (1959)

7-1

IQM-233 Operating Manual

when 1 angstrom of Aluminum (density of 2.77 g/cm3) is added to its surface. In
this manner the thickness of a rigid adlayer is inferred from the precise
measurement of the crystal’s frequency shift. The quantitative knowledge of thiseffect provides a means of determining how much material is being deposited on asubstrate in a vacuum system, a measurement that was not convenient or practicalprior to this understanding.

7.1.1 Monitor Crystals
No matter how sophisticated the electronics surrounding it, the essential device ofthe deposition monitor is the quartz crystal. The quartz resonator shown in Figure7-1 has a frequency response spectrum that is schematically shown in Figure 7-2.
The ordinate represents the magnitude of response, or current flow of the crystal,at the specified frequency.
Figure 7-1 Quartz resonator

1.4 cm (0.55 in.)R+

The responses located slightly higher in frequency are called anharmonics; they
are a combination of the thickness shear and thickness twist modes. The responseat about three times the frequency of the fundamental is called the third
quasiharmonic. There is also a series of anharmonics slightly higher in frequency
associated with the quasiharmonic.
The monitor crystal design depicted in Figure 7-1 is the result of several significant
improvements from the square crystals with fully electroded plane parallel facesthat were first used.
The first improvement was to use circular crystals. This increased symmetry
greatly reduced the number of allowed vibrational modes. The second set of
improvements was to contour one face of the crystal and to reduce the size of theexciting electrode. These improvements have the effect of trapping the acoustic
energy. Reducing the electrode diameter limits the excitation to the central area.

7-2

PN 074-584-P1B

The lowest frequency response is primarily a “thickness shear” mode that is called
the fundamental. The characteristic movement of the thickness shear mode is fordisplacement to take place parallel to the major monitor crystal faces. In otherwords, the faces are displacement antinodes as shown in Figure 7-3.

IQM-233 Operating Manual

Contouring dissipates the energy of the traveling acoustic wave before it
reaches the edge of the crystal. Energy is not reflected back to the center where it
can interfere with other newly launched waves, essentially making a small crystal
appear to behave as though it is infinite in extent. With the crystal’s vibrations
restricted to the center, it is practical to clamp the outer edges of the crystal toa holder and not produce any undesirable effects.
Contouring also reduces the intensity of response of the generally unwanted
anharmonic modes; hence, the potential for an oscillator to sustain an unwanted
oscillation is substantially reduced.

1
10

6

7

17

18.133 MHz 350 ohm

17.957 MHz 311 ohm

17.792 MHz 278 ohm

6.419 MHz 350 ohm

6.333 MHz 142 ohm
6.337 MHz 105 ohm
6.348 MHz 322 ohm

11000

6.153 MHz 50 ohm
6.194 MHz 40 ohm

1100

5.981 MHz 15 ohm

Log of relative intensity (Admittance)

Figure 7-2 Frequency response spectrum

18

PN 074-584-P1B

Frequency (in MHz)The use of an adhesion layer has improved the electrode-to-quartz bonding,
reducing rate spikes caused by micro-tears between the electrode and thequartz as film stress rises. These micro-tears leave portions of the deposited film
unattached and therefore unable to participate in the oscillation. These free
portions are no longer detected and the wrong thickness consequently inferred.
The AT resonator is usually chosen for deposition monitoring because at room
temperature it can be made to exhibit a very small frequency change due totemperature changes. Since there is presently no way to separate the frequencychange caused by added mass (which is negative) or even the frequency changes
caused by temperature gradients across the crystal or film induced stresses, it isessential to minimize these temperature-induced changes. It is only in this way that
small changes in mass can be measured accurately.

7-3

IQM-233 Operating Manual
Figure 7-3 Thickness shear displacement

E

X2

Displacement node

X
1
X
3

7.1.2 Period Measurement Technique
Although instruments using equation [2] were very useful, it was soon noted they
had a very limited range of accuracy, typically holding accuracy for F less than
0.02 Fq. In 1961, it was recognized by Behrndt4 that:M Tc – Tq  F 
-------f = ---------------------= ----------Tq
Mq
Fc

[3]

The period measurement technique was the outgrowth of two factors; first, thedigital implementation of time measurement, and second, the recognition of themathematically rigorous formulation of the proportionality between the crystal’s
thickness, Iq, and the period of oscillation, Tq = 1/Fq.
Electronically, the period measurement technique uses a second crystal oscillator,
or reference oscillator, not affected by the deposition and usually much higher infrequency than the monitor crystal. This reference oscillator is used to generatesmall precision time intervals which are used to determine the oscillation period of
the monitor crystal. This is done by using two pulse accumulators. The first is used
to accumulate a fixed number of cycles, m, of the monitor crystal. The second isturned on at the same time and accumulates cycles from the reference oscillator
until m counts are accumulated in the first.

4.K. H. Behrndt, J. Vac. Sci. Technol. 8, 622 (1961)

7-4

PN 074-584-P1B

where Tc and Tq are the periods of oscillation of the crystal with film (composite)
and the bare crystal respectively.

IQM-233 Operating Manual

Since the frequency of the reference is stable and known, the time to accumulate
the m counts is known to an accuracy equal to ± 2/Fr where Fr is the reference
oscillator’s frequency. The monitor crystal’s period is (n/Fr)/m where n is thenumber of counts in the second accumulator. The precision of the measurement isdetermined by the speed of the reference clock and the length of the gate time
(which is set by the size of m). Increasing one or both of these leads to improved
measurement precision. Having a high frequency reference oscillator is important
for rapid measurements (which require short gating times), low deposition rates
and low density materials.

7.1.3 Z-Match Technique
After learning of fundamental work by Miller and Bolef 5, which rigorously treatedthe resonating quartz and deposited film system as a one-dimensional continuous
acoustic resonator, Lu and Lewis6 developed the simplifying Z-Match® equation in1972. Advances in electronics taking place at the same time, namely the
micro-processor, made it practical to solve the Z-Match equation in “real-time”.
Most deposition process controllers sold today use this sophisticated equation thattakes into account the acoustic properties of the resonating quartz and film system
as shown in equation [4].

PN 074-584-P1B

N at d q  Fq – Fc 
T f =  ------------------ arctan  Z tan ------------------------- Fqd f F c Z[4]

where Z=(dquq/dfuf)1/2 is the acoustic impedance ratio and uq and uf are the shear
moduli of the quartz and film, respectively. Finally, there was a fundamental
understanding of the frequency-to-thickness conversion that could yieldtheoretically correct results in a time frame that was practical for process control.
To achieve this new level of accuracy requires only that the user enter an additional
material parameter, Z, for the film being deposited. This equation has been tested
for a number of materials, and has been found to be valid for frequency shifts
equivalent to Ff = 0.4Fq. Keep in mind that equation [2] was valid to only 0.02Fq
and equation [3] was valid only to ~0.05Fq.

5.J. G. Miller and D. I. Bolef, J. Appl. Phys. 39, 5815, 4589 (1968)
6.C. Lu and O. Lewis, J Appl. Phys. 43, 4385 (1972)

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IQS-233 Operating Manual

Appendix A
Material Table
A.1 Introduction
Table A-1 represents the density and Z-Ratio for various materials. The list isalphabetical by chemical formula.
An * is used to indicate that a Z-Ratio has not been established for a certain
material. A value of 1.000 is defaulted in these situations. To determine the Z-Ratio
where the Z-Ratio for a material has not been established, refer to section 6.4,
Determining Z-Ratio, on page 6-3.

WARNING
Some of these materials are toxic. Consult their material
safety data sheet and safety instructions before use.

PN 074-584-P1B

Table A-1 Material table

FormulaDensity

Z-Ratio

Material Name

Ag

10.5000.529

silver

AgBr

6.470

1.180

silver bromide

AgCl

5.560

1.320

silver chloride

Al

2.700

1.080

aluminum

Al2O3

3.970

0.336

aluminum oxide

Al4C3

2.360

*1.000aluminum carbide

AIF3

3.070

*1.000aluminum fluoride

AIN

3.260

*1.000aluminum nitride

AlSb

4.360

0.743

aluminum antimonide

As

5.730

0.966

arsenic

As2Se34.750*1.000arsenic selenideAu

19.300

0.381

gold

B

2.370

0.389

boron

B 20 31.820*1.000boron oxide

B 4C

2.370

*1.000boron carbide

BN

1.860

*1.000boron nitride

A-1

IQS-233 Operating Manual

A-2

FormulaDensity

Z-Ratio

Material Name

Ba

3.500

2.100

barium

BaF2

4.886

0.793

barium fluoride

BaN2O6

3.244

1.261

barium nitrate

BaO

5.720

*1.000barium oxide

BaTiO3

5.999

0.464

barium titanate (tetr)

BaTiO3

6.035

0.412

barium titanate (cubic)

Be

1.850

0.543

beryllium

BeF2

1.990

*1.000beryllium fluoride

BeO

3.010

*1.000beryllium oxide

Bi

9.800

0.790

bismuth

Bi2O3

8.900

*1.000

bismuth oxide

Bi2S3

7.390

*1.000

bismuth trisulphide

Bi2Se36.820*1.000

bismuth selenide

Bi2Te37.700*1.000

bismuth telluride

BiF3

5.320

*1.000

bismuth fluoride

C

2.250

3.260

carbon (graphite)

C

3.520

0.220

carbon (diamond)C 8H 81.100*1.000parlyene (union carbide)

Ca

1.550

2.620

calcium

CaF2

3.180

0.775

calcium fluoride

CaO

3.350

*1.000calcium oxide

CaO-SiO2

2.900*1.000calcium silicate (3)

CaSO4

2.962

0.955

calcium sulfate

CaTiO34.100*1.000calcium titanate

CaWO4

6.060

*1.000calcium tungstate

Cd

8.640

0.682

cadmium

CdF2

6.640

*1.000

cadmium fluoride

CdO

8.150

*1.000

cadmium oxide

CdS

4.830

1.020

cadmium sulfide

CdSe

5.810

*1.000

cadmium selenide

CdTe

6.200

0.980

cadmium telluride

Ce

6.780

*1.000cerium

CeF3

6.160

*1.000cerium (iii) fluoride

PN 074-584-P1B

Table A-1 Material table (continued)

IQS-233 Operating Manual

PN 074-584-P1B

Table A-1 Material table (continued)

FormulaDensity

Z-Ratio

Material Name

CeO2

7.130

*1.000cerium (iv) dioxide

Co

8.900

0.343

cobalt

CoO

6.440

0.412

cobalt oxide

Cr

7.200

0.305

chromium

Cr2O3

5.210

*1.000chromium (iii) oxide

Cr3C2

6.680

*1.000chromium carbide

CrB

6.170

*1.000chromium boride

Cs

1.870

*1.000cesium

Cs2SO4

4.243

1.212

cesium sulfate

CsBr

4.456

1.410

cesium bromide

CsCI

3.988

1.399

cesium chloride

CsI

4.516

1.542

cesium iodide

Cu

8.930

0.437

copper

Cu2O

6.000

*1.000copper oxide

Cu2S

5.600

0.690

copper (i) sulfide (alpha)

Cu2S

5.800

0.670

copper (i) sulfide (beta)

CuS

4.600

0.820

copper (ii) sulfide

Dy

8.550

0.600

dysprosium

Dy2O3

7.810

*1.000dysprosium oxide

Er

9.050

0.740

erbium

Er2O3

8.640

*1.000erbium oxide

Eu

5.260

*1.000europium

EuF2

6.500

*1.000europium fluoride

Fe

7.860

0.349

iron

Fe2O3

5.240

*1.000iron oxide

FeO

5.700

*1.000iron oxide

FeS

4.840

*1.000iron sulphide

Ga

5.930

0.593

gallium

Ga2O3

5.880

*1.000gallium oxide (b)

GaAs

5.310

1.590

gallium arsenide

GaN

6.100

*1.000gallium nitride

GaP

4.100

*1.000gallium phosphide

GaSb

5.600

*1.000gallium antimonide

A-3

IQS-233 Operating Manual

A-4

FormulaDensity

Z-Ratio

Material Name

Gd

7.890

0.670

gadolinium

Gd2O3

7.410

*1.000gadolinium oxide

Ge

5.350

0.516

germanium

Ge3N2

5.200

*1.000germanium nitride

GeO2

6.240

*1.000germanium oxide

GeTe

6.200

*1.000germanium tellurideHf

13.0900.360

hafnium

HfB2

10.500*1.000hafnium boride

HfC

12.200*1.000hafnium carbide

HfN

13.800*1.000hafnium nitride

HfO2

9.680

*1.000hafnium oxide

HfSi2

7.200

*1.000hafnium silicideHg

13.4600.740

mercury

Ho

8.800

0.580

holminum

Ho2O3

8.410

*1.000holminum oxide

In

7.300

0.841

indium

In2O3

7.180

*1.000

indium sesquioxide

In2Se35.700*1.000

indium selenide

In2Te35.800*1.000

indium telluride

InAs

5.700

*1.000

indium arsenide

InP

4.800

*1.000

indium phosphide

InSb

5.760

0.769

indium antimonide

Ir

22.4000.129

iridiumK

0.860

10.189potassium

KBr

2.750

1.893

potassium bromide

KCI

1.980

2.050

potassium chloride

KF

2.480

*1.000potassium fluoride

KI

3.128

2.077

potassium iodide

La

6.170

0.920

lanthanum

La2O3

6.510

*1.000lanthanum oxide

LaB6

2.610

*1.000lanthanum boride

LaF3

5.940

*1.000lanthanum fluoride

Li

0.530

5.900

lithium

PN 074-584-P1B

Table A-1 Material table (continued)

IQS-233 Operating Manual

PN 074-584-P1B

Table A-1 Material table (continued)

FormulaDensity

Z-Ratio

Material Name

LiBr

3.470

1.230

lithium bromide

LiF

2.638

0.778

lithium fluoride

LiNbO3

4.700

0.463

lithium niobate

Lu

9.840

*1.000lutetium

Mg

1.740

1.610

magnesium

MgAl2O4

3.600*1.000magnesium aluminate

MgAl2O6

8.000*1.000spinel

MgF2

3.180

0.637

magnesium fluoride

MgO

3.580

0.411

magnesium oxide

Mn

7.200

0.377

manganese

MnO

5.390

0.467

manganese oxide

MnS

3.990

0.940

manganese (ii) sulfide

Mo

10.2000.257

molybdenum

Mo2C

9.180

*1.000molybdenum carbide

MoB2

7.120

*1.000molybdenum boride

MoO3

4.700

*1.000molybdenum trioxdide

MoS2

4.800

*1.000molybdenum disulfide

Na

0.970

4.800

sodiumNa3AIF6

2.900*1.000cryolite

Na5Al3F14

2.900*1.000chiolite

NaBr

3.200

*1.000sodium bromide

NaCl

2.170

1.570

sodium chloride

NaCIO3

2.164

1.565

sodium chlorate

NaF

2.558

1.645

sodium fluoride

NaNO3

2.270

1.194

sodium nitrate

Nb

8.578

0.492

niobium (columbium)

Nb2O3

7.500

*1.000niobium trioxide

Nb2O5

4.470

*1.000niobium (v) oxide

NbB2

6.970

*1.000niobium boride

NbC

7.820

*1.000niobium carbide

NbN

8.400

*1.000niobium nitride

Nd

7.000

*1.000neodynium

Nd2O3

7.240

*1.000neodynium oxide

A-5

IQS-233 Operating Manual

A-6

FormulaDensity

Z-Ratio

Material Name

NdF3

6.506

*1.000neodynium fluoride

Ni

8.910

0.331

nickel

NiCr

8.500

*1.000nichrome

NiCrFe8.500*1.000inconel

NiFe

8.700

*1.000permalloy

NiFeMo8.900*1.000supermalloy

NiO

7.450

*1.000nickel oxide

P 3N 52.510*1.000phosphorus nitridePb

11.300

1.130

lead

PbCl2

5.850

*1.000lead chloride

PbF2

8.240

0.661

lead fluoride

PbO

9.530

*1.000lead oxide

PbS

7.500

0.566

lead sulfide

PbSe

8.100

*1.000lead selenide

PbSnO38.100*1.000lead stannate

PbTe

8.160

0.651

lead telluridePd

12.0380.357

palladium

PdO

8.310

*1.000palladium oxide

Po

9.400

*1.000polonium

Pr

6.780

*1.000praseodymium

Pr2O3

6.880

*1.000praseodymium oxidePt21.4000.245

platinum

PtO2

10.200*1.000

platinum oxide

Ra

5.000

*1.000radium

Rb

1.530

2.540

rubidium

RbI

3.550

*1.000rubidium iodide

Re

21.0400.150

rheniumRh

12.4100.210

rhodiumRu

12.362

0.182

ruthenium

S8

2.070

2.290

sulphur

Sb

6.620

0.768

antimony

Sb2O3

5.200

*1.000antimony trioxide

Sb2S3

4.640

*1.000antimony trisulfide

PN 074-584-P1B

Table A-1 Material table (continued)

IQS-233 Operating Manual

PN 074-584-P1B

Table A-1 Material table (continued)

FormulaDensity

Z-Ratio

Material Name

Sc

3.000

0.910

scandium

Sc2O3

3.860

*1.000scandium oxide

Se

4.810

0.864

selenium

Si

2.320

0.712

silicon

Si3N4

3.440

*1.000silicon nitride

SiC

3.220

*1.000silicon carbide

SiO

2.130

0.870

silicon (ii) oxide

SiO2

2.648

1.000

silicon dioxide

Sm

7.540

0.890

samarium

Sm2O3

7.430

*1.000samarium oxide

Sn

7.300

0.724

tin

SnO2

6.950

*1.000tin oxide

SnS

5.080

*1.000tin sulfide

SnSe

6.180

*1.000tin selenide

SnTe

6.440

*1.000tin telluride

Sr

2.600

*1.000strontium

SrF2

4.277

0.727

strontium fluoride

SrO

4.990

0.517

strontium oxide

Ta16.6000.262

tantalum

Ta2O5

8.200

0.300

tantalum (v) oxide

TaB2

11.150*1.000tantalum boride

TaC

13.900*1.000tantalum carbide

TaN

16.300*1.000tantalum nitride

Tb

8.270

0.660

terbiumTc

11.500*1.000technetium

Te

6.250

0.900

tellurium

TeO2

5.990

0.862

tellurium oxideTh

11.694

0.484

thorium

ThF4

6.320

*1.000thorium (iv) fluoride

ThO2

9.860

0.284

thorium dioxide

ThOF2

9.100

*1.000thorium oxyfluoride

Ti

4.500

0.628

titanium

Ti203

4.600

*1.000titanium sesquioxide

A-7

IQS-233 Operating Manual

A-8

FormulaDensity

Z-Ratio

Material Name

TiB2

4.500

*1.000titanium boride

TiC

4.930

*1.000titanium carbide

TiN

5.430

*1.000titanium nitride

TiO

4.900

*1.000titanium oxide

TiO2

4.260

0.400

titanium (iv) oxide

TI

11.8501.550

thallium

TIBr

7.560

*1.000thallium bromide

TICI

7.000

*1.000thallium chloride

TII

7.090

*1.000thallium iodide (b)U

19.0500.238

uranium

U 3O 88.300*1.000

tri uranium octoxide

U 4O 910.9690.348

uranium oxide

UO2

10.970

0.286

uranium dioxide

V

5.960

0.530

vanadium

V 2O 53.360*1.000

vanadium pentoxide

VB2

5.100

*1.000

vanadium boride

VC

5.770

*1.000

vanadium carbide

VN

6.130

*1.000

vanadium nitride

VO2

4.340

*1.000

vanadium dioxide

W19.3000.163

tungsten

WB2

10.770*1.000tungsten borideWC

15.6000.151

tungsten carbide

WO3

7.160

*1.000tungsten trioxide

WS2

7.500

*1.000tungsten disulphide

WSi2

9.400

*1.000tungsten silicide

Y

4.340

0.835

yttrium

Y 20 35.010*1.000yttrium oxide

Yb

6.980

1.130

ytterbium

Yb2O3

9.170

*1.000ytterbium oxide

Zn

7.040

0.514

zinc

Zn3Sb26.300*1.000zinc antimonide

ZnF2

4.950

*1.000zinc fluoride

ZnO

5.610

0.556

zinc oxide

PN 074-584-P1B

Table A-1 Material table (continued)

IQS-233 Operating Manual
Table A-1 Material table (continued)

Density

Z-Ratio

Material Name

ZnS

4.090

0.775

zinc sulfide

ZnSe

5.260

0.722

zinc selenide

ZnTe

6.340

0.770

zinc telluride

Zr

6.490

0.600

zirconium

ZrB2

6.080

*1.000zirconium boride

ZrC

6.730

0.264

zirconium carbide

ZrN

7.090

*1.000zirconium nitride

ZrO2

5.600

*1.000zirconium oxide

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FormulaA-9

IQS-233 Operating Manual

PN 074-584-P1B

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A - 10