★★★ ＜第23回知的財産翻訳検定試験【第11回英文和訳】＞ ★★★
≪１級課題 -機械工学-≫【解答にあたっての注意】
１．問題の指示により和訳してください。
２．解答語数に特に制限はありません。適切な箇所で改行してください。
３．課題文に段落番号がある場合、これを訳文に記載してください。
４．課題は３題あります。それぞれの課題の指示に従い、３題すべて解答してください。

問１．次の背景技術の記載の抜粋を和訳してください。
英文の細かい表現にとらわれず、正確でわかりやすい翻訳を心がけてください。

In the manufacture of micro-electronic components, it is common to etch the wafer
substrate of those components. Etching is the process of removing silicon-containing
substrate material from the wafer, especially from its surface. Etching commonly
involves removing discrete amounts of silicon or other material from the wafer toexpose other materials layered in the wafer such as buffers, masks, and/or insulation.
Etching is also performed to clean the wafer surface, to polish the wafer surface to adesired degree of smoothness, and/or to create recesses or channels in the substrate forthermal or electrical shielding purposes or into which devices or other materials can beplaced. Etching is a very precise process, performed in accordance with the physicalproperties of the relevant materials, only removing specific targeted material(s) and/ordesired shape in the substrate. Etching can be fully isotropic but sometimes is also
anisotropic.
問 2．次の実施例の記載の抜粋を和訳してください。
英文の細かい表現にとらわれず、正確でわかりやすい翻訳を心がけてください。

A two-hand operated cutting tool according to an embodiment, in the form of a"lopper" having a pair of handles operable to actuate a pair of cutting members, has avariable pivot system, and is characterized with an operator using both hands to grab
each of the handles in order to actuate the tool. The variable pivot system is configured

to control the opening and closing of one of the cutting members and includes a geared
portion and a slide portion that are actuated at different times through the progression of
a cutting stroke of the tool. Herein, the cutting stroke refers to a start position of thehandles (and, correspondingly, the cutting members) being separable by a maximum
distance (full open) and an end position with the handles being separated by a minimum
distance (full closed). Within a first region represented by an approximate one-third of
the cutting stroke, the interaction between the handles and cutting members is provided
by a slide portion of the variable pivot system. After the first region of the cutting stroke,
the variable pivot system transitions to a second region for the remaining approximate
two-thirds of the cutting stroke. In the second region, the interaction is provided by ageared portion of the variable pivot system. As such, during approximately the final
two-thirds of the cutting stroke (where the cutting tool severs an object, such as abranch or tree limb), the variable pivot system provides a leverage profile defined by thegeared portion. Thus, the combination of a geared portion and a slide portion in thevariable pivot system provides for a variable mechanical advantage with the cutting tool.
Further, by providing the geared portion at only a select travel region during the cutting
stroke, human effort to cut objects using the hand operated cutting tool may beminimized at a key location (i.e., where the object is most resistant to being cut) during
the cutting stroke.
問3．次のクレームを日本語に訳して下さい。翻訳にあたっては、FIG.1を参考にして下さい。

1.

An electron-beam welding apparatus using power supplied from ahigh-voltage supply unit, the apparatus comprising:an outer housing (16);a solid dielectric insulator (17) in the outer housing (16), the solid dielectric
insulator (17) containing a plurality of electrical conductors (32);a cathode (19) electrically coupled to the high-voltage supply unit through theplurality of conductors (32) in the solid dielectric insulator (17);an anode (22);a valve (23) configured to seal the cathode (19) and the anode (22) in theouter housing (16) in a first position thereof and to provide an electron-beam paththrough which an electron beam passes in a second position thereof; anda controller configured to control the electron beam, wherein
the solid dielectric insulator (17) has a first liquid flow path (18) at a
proximity of the plurality of electrical conductors (32),the outer housing (16) has a second liquid flow path (21),the first liquid flow path (18) has a portion close to the plurality of conductors(32) for a first liquid to cool the plurality of conductors (32) and the solid dielectric
insulator (17) heated by the cathode (19) using flow of the first liquid in the first liquidflow path (18), andthe second liquid flow path (21) is disposed at a proximity of an outer portionof the solid dielectric insulator (17) and the first liquid flow path (18) for a second
liquid to cool the first liquid.

FIG. 1