LEAP® ON-BOARD TRANSCEIVER
300Gb/s High Speed Optical Module
SMALL, FAST AND
POWER EFFICIENT
Amphenol ICC’s 300Gb/s Leap ® High-Speed Optical
Module is faster, smaller, and more cost and power
efficientthanmostconventional
datacenterinterconnects.

§§Capable of speeds up to 25Gb/s and distances up to 100m§§300Gb/s total throughput requires only 1 sq in of board spaceand 5.4W of power§§Optical cable can be routed above or around othercomponents in the design§§Optical cable can be routed above or around othercomponents in the design

TARGET MARKETSFEATURES

BENEFITS§§1” x 1” layout grid§§Transceivers can be placed in 2-dimensional layout grid with 1” pitch

between adjacent transceivers§§Uses 2.5x less board space than QSFP28 (12-channels)§§Ethernet 100GBASE-SR4 compliance (per quad)§§Ethernet transmission distance up to 100m (multi mode fiber)§§Compatible with Amphenol MT optical cables§§Uses off-the-shelf MT optical interface§§Compatible with Amphenol socket§§No through holes to connect transceiver – one side of board only§§Easy to install§§Two wire control and diagnostic interface§§Allows for transceiver optimization and monitoring connection

discovery, channel diagnostics, and signal status monitoring§§Data rate transparent from 1.25Gb/s to 25.8Gb/s§§Supports non-standard protocols in this range of datarates. Note

CDR operational bit rate of 25-25.8Gb/s§§Integrated heat sink design§§Select from a number of pre-fabricated or customized designs tomeet your system needs§§Water cooled compatible version available§§Class 1M laser version available§§Fail safe operation that meets all safety requirements§§Enhanced Bit Error Rate (1e-12) requires no or limited FEC§§Lower system latency and better system performance§§Programmable input equalization§§11dB of signal peaking at 12GHz to compensate for suboptimal signalcondition§§Programmable output amplitude and emphasis

www.amphenol-icc.com§§Compensate for PCB traces loss for proper signal conditioning

Amphenol Information Communications and Commercial Products

LEAP® On-Board Transceiver

TECHNICAL INFORMATION
MATERIALSUPPORTED STANDARDS§§Electrical interface mates with Amphenol§§
100GBASE-SR4 per 802.3 (per channel)

Electrical Socket: 10140369-101LF§§
FDA: 0312716§§Optical interface mates with Amphenol Optical

Cable: 10141993-xxx§§
TUV: 21246478§§
UL: E251142-191

ELECTRICAL PERFORMANCE§§
Proprietary 25Gb/s links§§
Power Supply Voltage: 3.3V§§
PCIe Gen 4§§
Bit Error Rate @ 25.78125 Gb/s, PRBS31 (CDRON): < 10-12§§
SAS 4.0§§
Lanes per device: 12 Transmit and 12 Receive§§
100GBase-SR4§§
Power Consumption: 5.4W (typ.)§§EDR Infiniband§§
Transmitter Type: 850nm VCSEL Laser§§
Receiver Type: PIN Photodiode

TARGET MARKETS/APPLICATIONSENVIRONMENTAL

Industrial Controls & Instruments§§
RoHS 6/6 compliant§§
Laser Class 1M or 3B versions available

Datacenter
Network Storage SystemSupercomputer§§
Case Operating Temperature: 0°C to +70°C

PACKAGING§§
Individual Blister Package

PART NUMBER SELECTOR
2300Gb/s High
speed module10124588

YZ

Laser Class 1M

3

Laser Class 3B

1

No heat sink for customer or water cooled thermal solutions

0

Short height air cooled heat sink – 23.5x23.5x14.6mm (lxlxh)

1

Medium height air cooled heat sink – 23.5x23.5x17.6mm (lxlxh)

2

Pillar based tall height air cooled heat sink – 23.5x23.5x23.4mm (lxlxh)4Large flat air cooled heat sink – 53.0x36.5x12.6mm (lxlxh)

5

Pillar based tall height air cooled heat sink 2 – 23.5x23.5x31.7mm (lxlxh)

6

Fin based tall height air cooled heat sink – 23.5x23.5x31.7mm (lxlxh)

7“Wings” form air cooled heat sink – 33.2x55.4x12.6mm (lxlxh)

8“Block” form air cooled heat sink – 33.2x38.0x15.6mm (lxlxh)

9“Flat adapter” for customized or water cooled – 28.4x28.4x12.0mm (lxlxh)

B“Cubic” form air cooled heat sink – 37.4x49.4x24.4mm (lxlxh)

Cwww.amphenol-icc.com

Disclaimer
Please note that the above information is subject to change without notice.

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