TOOLMAKER SOLUTIONS

Compounds& Slurries

Superior diamondslurries, suspensions,and compounds

HYPERION COMPOUNDS, SLURRIES, AND SUSPENSIONSQUALITY STARTS WITH THE DIAMOND IN THE FORMULATION
Hyperion Materials & Technologies is the leader in the manufacturing of diamond micron powders. Hyperion invented
the process to make synthetic diamonds over 60 years ago, and we continue to develop new micron powders,compounds, slurries, and suspensions to solve our customers’ needs.
Hyperion’s micron powders (diamond and cubic boron nitride (CBN)) can be formulated into compounds, slurries,and suspensions. The information contained in this brochure will allow you to choose the best solution for yourpolishing needs. Hyperion defines our offerings as shown below:
COMPOUND = Powder (diamond or CBN) + Carrier (paste)
SLURRY = Powder (diamond or CBN) + Carrier (liquid)
SUSPENSION = Powder (diamond or CBN) + Carrier with Stabilizer (liquid)

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HYPERION COMPOUND OVERVIEWCOMPOUND FORMULATIONSCOMPOUNDIDENTIFICATIONCOMPOUND FORMULATIONS(SOLUBILITIES)RECOMMENDED USES

K700

Water soluble(WS products)

For use where exceptional cleaning
is required and where petroleum
contamination is prohibited. Specimen
prep applications command this product.

Used in specimen preparationand cross section analysis

K210

Oil soluble(OS products)

Recommended for controlled lapping of
carbide drawing dies, cold heading dies,and other polishing applications.

Primarily used in mold and die
polishing

G400

Water/Oil soluble(WOS Products)

Complements the use of oil as well as water
for achieving more productive results andfacilitating cleaning.

 sed where corrosion must beU
minimized but where oil cannot
be tolerated

COMPOUND CONCENTRATIONSLIGHT CONCENTRATIONMEDIUM CONCENTRATION

Finishing

HEAVY CONCENTRATION
RemovalCOMPOUND DIAMOND SIZECOMPOUND PACKAGINGSYRINGE/TUBE SIZES

mm ic 3es ro
h n2
8. 00 40m mic 2es roh n
11 1.0 300

m mic 1es ro
h n
14 0.0 200

m mic 1es ro /2
h n
60 0.0 100

m mic 1es ro /4h n
10 00. 1/200
05 gram
10 gram18 gram
25 gram
50 gram
JAR SIZES

mm icr 10es on
h 8
1. -170 20mm icr 9es on
h 6
1. -180 20mm icr 7.
es on 5h 52. -1
50 00mm ic 6es roh n4
3. 00 80m
m ic 4es ro
h n3
6. 50 505 gram

25 gram
50 gram
100 grammim cro 60
es n 5h 027 -70 0mim cro 45es n 3h 040 -60 0mim cro 30
es n 2h 057 -45 0mim cro 25
es n 2h 060 -30 0mm icro 15
es nh 10
1. 20 200200 gramStandard diamond sizes from 1/4 to 60 µm | Color coded for easy size recognition
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HYPERION SLURRY/SUSPENSION OVERVIEWSLURRY AND SUSPENSION FORMULATIONSSLURRY/SUSPENSIONIDENTIFICATIONSLURRY/SUSPENSIONFORMULATIONS

K400

Oil-Based

SLURRY

Straight oil with petroleum baseand additives

K285T

Water-Based

Straight water, for use where
exceptional cleaning is required
and where petroleum contamination
is prohibited

K450, K1500

Water-/Oil-BasedCompliments the use of oil as wellas water for achieving more productive
results

Water-/Oil-BasedDiamond is dispersed in ultra-puredeionized water to eliminate
agglomerates that can occur
in submicron powders

LDPSUSPENSIONDIAMOND POWDERSDIAMOND
POWDER GRADEDESCRIPTIONSUGGESTEDAPPLICATION

SJK-5

Monocrystal diamond powder used in slurries and suspensions

Lapping

RJK-1

Multi-crystal diamond powder more friable than a monocrystal

Lapping/Polishing

POLY

Polycrystalline diamond powder available in sizes <10 microns (µm)

Polishing

Natural diamond powder available in a variety of sizes

Gem Polishing

NATURAL

INDUSTRY- Aerospace- Ceramics- Glass- Lenses- Optics- Sapphire- Semi-conductor- Silicon carbide- Tungsten carbide

SLURRY/SUSPENSION CONCENTRATIONSLIGHT CONCENTRATION
Finishing

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MEDIUM CONCENTRATIONHEAVY CONCENTRATION
RemovalHYPERION SLURRY/SUSPENSION OVERVIEWSLURRY/SUSPENSION DIAMOND SIZE

Micron0-1/2

Micron0-1

Micron0-2

Micron1-3

Micron2-4

Mesh100.000

Mesh
60.000Mesh
14.000Mesh
15.000

Mesh
3.000

Micron3-5Micron4-8Micron5-10

Micron6-12

Micron
8-12

Mesh
6.500

Mesh
3.000

Mesh
2.500

Mesh
1.800

Mesh
1.700

Micron10-20

Micron20-30

Micron20-40

Micron30-60

Micron
50-70

Mesh
1.200

Mesh
800

Mesh
575

Mesh400

Mesh
270

SLURRY/SUSPENSION PACKAGINGBOTTLE/BUCKET SIZES

PUMP BOTTLE OR SPRAY BOTTLE SIZES

125 mL

4 oz. pump bottle

250 mL

8 oz. spray bottle

CUSTOM FORMULATIONSAVAILABLE TO MEETYOUR REQUIREMENTS

500 mL
1,000 mL
1 gallon
5 gallon bucket
5HOW TO SELECT THE SOLUTION FOR YOUR NEED 5 CRITERIA MUST BE KNOWN
When selecting a Hyperion compound, slurry, or suspension, 5 criteria must be known:

1- DIAMOND TYPE
Determine what type of diamond is needed in the application:• SJK-5 (most popular diamond type used in compounds)• RJK-1• NAT• Also available in cubic boron nitride (CBN) grades

2 - DIAMOND SIZE
Example: 8-16 microns

3 - DIAMOND CONCENTRATION (how much diamond is needed in the formulation?)• L = Light concentration• M = Medium concentration• H = Heavy concentration (used for maximum stock removal)

4 - FORMULATIONCOMPOUND
OS = oil-based formula (K210)
WS = water-based formula (K700)
WOS = water-/oil-based (also called universal, G400)
SLURRY/SUSPENSION
K400 = oil-based formula
K285T = water-based formulaK450, K1500 = water-/oil-based
LDP = liquid diamond powder

5 - CONTAINER TYPE AND SIZECOMPOUNDSyringe:· 5 gm· 10 gm· 18 gm· 25 gm· 50 gm

Jar:· 5 gm· 25 gm· 50 gm· 100 gm
· 200 gm

SLURRY/SUSPENSION
DMS:
DMT:
· 125 mL
· 4 oz. pump bottle· 250 mL
· 8 oz. spray bottle· 500 mL
· 1,000 mL· 1 gallon· 5 gallon bucket

OTHER SIZES ARE AVAILABLE TO MEET YOUR NEEDS

6HOW TO DECODE HYPERION’S NOMENCLATURECOMPOUND SAMPLE
diamondtypecompoundsyringe

SLURRY SAMPLE

heavy
concentrationdiamondsize

size ofcontainer
in grams

oil-based
formulaDMSY SJK-5 5-10 HOS 25

diamondtypeslurry orsuspension
bottlewater-based M=medium
formulaconcentration
diamondsize

size ofcontainer

DMS SJK-5 3-5 K285T M500ml

APPLICATIONS FOR COMPOUNDS, SLURRIES, AND SUSPENSIONSHyperion Materials & Technologies’ compounds, slurries, and suspensions are used to lap, polish, and super-finish:• Ceramics• Electro-optics• Semiconductors• Metalwork• Hard disk drives• Metallurgical

Our compounds, slurries, and suspensions are also used in the following:
MOLD AND DIE POLISHING· Mold and die shops· Polishing houses· Injection molding facilities

SPECIMEN PREPARATION· Metallurgical manufacturers· Universities· R&D laboratories

GENERAL POLISHING· Ball valves· Wire dies
· Stone polishers

POLISHING IS AN ART
There are many ways to achieve the desired results. Although techniques vary, using a consistent, high quality diamondpaste ensures consistent results.

FUNDAMENTAL RULES OF POLISHING
1 - Keep polishing area clean.
2 - Dedicate a polishing tool for each grade size. Each tool should be stored in a separate container.
3 - Polishing tools gradually become impregnated and improve with use.
4 - Clean hands and workpiece carefully between grades.
5 - Apply diamond paste to tool when manual polishing. Apply paste to workpiece when machine polishing.
6 - Polish existing scratch marks at a 90-degree angle. This helps increase stock removal and shows when old marks are gone.
7 - High material removal requires high pressure and coarse grits. Finish polishing requires low pressure and finest grits.

TROUBLESHOOTING TIPSSCRATCHING- Contamination in tooling- Work area and/or workpiece not thoroughly
cleaned from previous grade size (grit)
WAVINESS- Too big of a jump between grade sizes (grit)- Uneven pressure on polishing tool

PITTING- Slag inclusions in steel- Pressure too high on polishing tool
ORANGE PEEL
- Over polishing with machine resultsin overheating a small area
- Reduce pressure for softer steels.

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