HYPERION MATERIALS & TECHNOLOGIES®

Compax PCD
Die BlanksCompax® polycrystalline
diamond die blanks for wiredrawing applications

HYPERION - YOUR POLYCRYSTALLINE DIAMOND PARTNER

HYPERION COMPAX® PCD DIE BLANKS PRODUCT GROUPSHyperion Materials & Technologies, Inc. is an engineering company with decades of experience with hard and superhard materials, including diamonds (mono- and polycrystalline), cemented tungsten carbide, ready-to-press carbide
powders, and cubic boron nitrides (CBNs) for your wire drawing applications. Hyperion’s products are engineered toincrease productivity and improve performance of our customers’ products.

SELF-SUPPORTED COMPAX PCD BLANKS

We are over 2,100 people dedicated to creating solutions for your hard and super-hard material needs throughpartnership, innovation, and invention. Hyperion’s offering includes materials for wire drawing, metal forming,
metal cutting, rotary cutters, mining, oil and gas, hot rolls, can tooling, and a wide range of wear protection applications.
In addition to innovative materials, Hyperion offers our extensive knowledge, unique services, and application
development capabilities to support our customers’ competitive needs.
Our global manufacturing and supply chain organization is supported by in-house tungsten carbide and diamondmanufacturing. With advanced production capabilities in powder processing pressure, sintering, high-pressurehigh-temperature synthesis, coating, and finishing. Hyperion can satisfy all your needs for drawing solutions.

Self-supported PCD cylinders

Hyperion’s technical expertise and global manufacturing facilities are a foundation from which a network of local
sales and customer service teams support our customers in the development of effective solutions.

GRAIN SIZES - AVERAGE PARTICLE SIZE

5 μm

25 μm

PRODUCT DESCRIPTIONTS GRADE- Catalyst metal removed- Thermally stable up to 1050°C in an inert or reducing atmosphere- Can be mounted using high temperature, high strength metal setting powders- Not electrically conductive: electrical discharge machining (EDM) not recommended for piercing/shaping- Use laser, ultrasonic, or needle piercing/shaping methods.
MF GRADE- Metal filled, contains catalyst metal- Thermally stable up to 700°C- Do not exceed 700°C in blank mounting

Production units

Research & development

Sales offices

Sales partners- Electrically conductive: EDM, laser, ultrasonic, or needle methods for piercing/shaping die bore may be used.

RECOMMENDED APPLICATIONSHYPERION - COMPAX® PCD FROM START TO FINISH

2TS OR MF GRADE- Drawing of high carbon steel tire cord
- Drawing of smaller diameter and critical surface finish non-ferrous and ferrous wires.

Hyperion’s diamond micron powders are created in a single, continuous manufacturing process. Starting with thehighest quality of raw materials, Hyperion uses advanced engineering methods to manufacture diamonds withspecific characteristics of strength and toughness. State-of-the-art micronizing techniques assure the diamondmicron powders have precisely defined sizes, shapes, and surface properties.

TS GRADE- High temperature drawing of tungsten/molybdenum.

Hyperion’s high quality micron powders serve as a raw material to produce Compax® polycrystalline diamond(PCD) products. Hyperion’s superior Compax PCD wire drawing products are a result of unprecedented consistency
and uniformity from the initial diamond source to the final product.

- Hyperion diamond micron powder grade SJK-5 or GMM recommended for final die bore shaping and polishing

POLISHING- For superior polish, use 0.25 μm or 0.5 μm graded diamond fines.

3HYPERION COMPAX® - DIMENSIONS & AVAILABILITY CHART

HYPERION COMPAX® PCD DIE BLANKS PRODUCTGROUPSTARGET APPLICATIONSTUNGSTEN CARBIDE SUPPORTED COMPAX PCD BLANKSSELF-SUPPORTED DIE BLANKSNOMINAL
DIAMONDADDMADIAMETER X
NoTHICKNESS(mm)GRAIN SIZE
Sub µm

5 µm

PRODUCT DIMENSIONS [mm]25 µmRECOMMENDEDBORE SIZE*DIAMOND DIAMOND
DIAMETER THICKNESS

D63.1 x 1.05010-MFU 5010-TSU 5010-MF 5010-TS 5010-MFC 5010-TSC 3.1 ± 0.38

1.0 ± 0.13

0.080.130.5

D123.1 x 1.55015-MFU 5015-TSU 5015-MF 5015-TS 5015-MFC 5015-TSC 3.1 ± 0.38

1.5 ± 0.13

0.080.13

1.0D155.2 x 2.55025-MF 5025-TS 5025-MFC 5025-TSC 5.2 ± 0.64

2.5 ± 0.13

0.080.25

1.5D185.2 x 3.55035-MF 5035-TS 5035-MFC 5035-TSC 5.2 ± 0.64

3.5 ± 0.13

0.080.25

2.0D217.0 x 4.07040-MF

7040-MFC

7.0 ± 0.64

4.0 ± 0.130.08

3.5

7.0 x 5.37053-MF

7053-MFC

7.0 ± 0.64

5.3 ± 0.130.08(within 0.25diameterlimits) 0.25

13.0 x 7.01370-MF

1370-MFC

13 ± 0.64

7.0 ± 0.13

0.08

0.25

5.2

13.0 x 8.71387-MF

1387-MFC

13 ± 0.64

8.7 ± 0.13

0.08

0.25

5.8

13.0 x 11.61311-MF

1311-MFC

13 ± 0.64 11.6 ± 0.13

0.08

0.25

7.6

18.6 x 13.5

1813-MF

1813-MFC

18.6 ± 0.64 13.5 ± 0.130.080.25

11.2

D24D27D30

PCD core integrally bonded to a tungsten
carbide support ring

4.6

GRAIN SIZES - AVERAGE PARTICLE SIZE

* Maximum recommended bore size for non-ferrous wire. Hard-ferrous wire die size normally should not exceed 65% of this diameter.

3 μm

ORDERING EXAMPLE: 25337501 5025-TS
HYPERION ITEM #25337501

COMPAX DIE BLANK5025-TS

NOMINAL DIAMOND
DIAMETER (mm)5.2

TOOL BLANK
DIAMETER (mm)NA

THICKNESS(mm)2.55 μm

25 μm

50 μm

DIAMOND GRADE
5 µm

PRODUCT DESCRIPTION- All blanks contain metal catalyst in PCD structure- Do not exceed 700°C in die mounting operations- Electrically conductive: diamond core may be pierced using EDM, laser, ultrasonic, or needle methods- Profiling of die geometry is normally performed using shaped needles with EDM or ultrasonic, machineswith diamond abrasives.

RECOMMENDED APPLICATIONS
25 μm AND 50 μm GRAIN SIZES- Intermediate and rod break down drawing of copper, aluminum, and other non-ferrous materials.
5 μm AND 25 μm GRAIN SIZES- Drawing of non-ferrous and ferrous intermediate and fine wires- Applications where superior surface quality is a must.
3 μm AND 5 μm GRAIN SIZES- Drawing of non-ferrous and ferrous wire in finer sizes- Applications requiring critical surface finish.

POLISHING- Hyperion diamond micron powder grade SJK-5 or GMM recommended for final die bore shaping and polishing- For superior polish, use 0.25 μm or 0.5 μm graded diamond fines.

45

HYPERION COMPAX® - DIMENSIONS & AVAILABILITY CHART

HYPERION SUB-MICRON DIE BLANKS
Hyperion Materials & Technologies is the leading global manufacturer of super-hard materials required for wire
industrial applications. Sub-micron die blanks belong to our Compax® family of products and are one of many
premium products available for the wire industry. Sub-micron die blanks are PCD product with an ultra-fine grain
microstructure.

TUNGSTEN CARBIDE-SUPPORTED DIE BLANKSNOMINAL
DIAMONDADDMADIAMETER X
NoTHICKNESS(mm)

GRAIN SIZE (µm)

35†

1225

D121.5 x 1.55233

D15

4.0 x 2.35823 5523

5123

5223

D184.0 x 2.95829 5529

5129

D217.0 x 4.05840

D24

7.0 x 5.313.0 x 7.0

D27

PRODUCT DIMENSIONS [mm]505235RECOMMENDED
BORE SIZE*

TOOL BLANK DIAMOND DIAMOND
DIAMETER DIAMETER THICKNESSThe unique material properties provide very good abrasion resistance and the ability to achieve a high quality surface
finish.

3.99 ± 0.013

1.4

1.50 ± 0.10

0.05

0.01

0.05

0.20

0.8

5430

8.12 ± 0.013

3.8

2.24 ± 0.05

0.05

0.01

0.08

0.40

1.852295435

8.12 ± 0.013

3.8

2.84 ± 0.05

0.05

0.01

0.10

0.40

2.3- Electrical wire

5140

5240

5530

13.65 ± 0.013

6.8

3.86 ± 0.05

0.05

0.01

0.14

0.50

3.5

- Fine finishing applications

5853
5825

5153
5125

5253
5225

5535
5725

13.65 ± 0.013
24.13 ± 0.025

6.8
12.7

5.13 ± 0.05
6.98 ± 0.25

0.05
0.10

0.01
0.05

0.18
0.30

0.50
0.60

4.6
5.2

- Glass scribing

13.0 x 8.7

5808

5108

5208

5730

24.13 ± 0.025

12.7

8.70 ± 0.25

0.10

0.05

0.30

0.60

5.8

D30

13.0 x 11.6
18.6 x 13.5

5811
5815

5111

5211
5913

5735

24.13 ± 0.025
34.00 ± 0.025

12.718.2

11.60 ± 0.25
13.50 ± 0.50

0.10
0.10

0.05
0.05

0.40
0.45

0.60
0.75

7.6
11.2

D33

18.6 x 15.5
18.6 x 17.5

5816
5817

5915
5917

34.00 ± 0.025
34.00 ± 0.025

18.2
18.2

15.50 ± 0.50
17.50 ± 0.50

0.10
0.10

0.05
0.05

0.52
0.59

0.75
0.75

12.0
12.5

D36

18.6 x 18.5

5818

5918

34.00 ± 0.025

18.2

18.50 ± 0.50

0.10

0.05

0.62

0.75

12.7

TARGET APPLICATIONS- Brass-plated wire

- Sawing wire
- Stainless steel- Tire cord
- Welding wire.

* Maximum recommended bore size for non-ferrous wire. Hard-ferrous wire die size normally should not exceed 65% of this diameter.
† Items with 5 µm grain size shown in blue are new products made to order with a typical lead time of 2 to 3 weeks.
Item with 3 μm grain size shown in red is made to order with a typical lead time of 4 weeks.
New sizes added to the portfolio.

ORDERING EXAMPLE: 11925601 5211
HYPERION ITEM #11925601

COMPAX DIE BLANK
5211

NOMINAL DIAMOND
DIAMETER (mm)13.0TOOL BLANK
DIAMETER (mm)24.13THICKNESS(mm)11.6

PROPERTY

TYPICAL VALUE

UNITS

Diamond content

91% volDiamond grain size

0.9μm
Microstructure

DIAMOND GRADE
25 µm

STANDARD PRODUCT OFFERINGADDMA No

DIAMETER (mm)

THICKNESS (mm)

METAL FILLED

THERMALLY STABLE

MAXIMUM RECOMMEND
BORE SIZE (mm)*D63.1

1.05010-MFU

5010-TSU

0.5

D123.11.55015-MFU

5015-TSU

1.0* Maximum recommended die size for non-ferrous wire. Hard-ferrous wire die size normally should not exceed 65% of this diameter.

ABRASION TEST RESULTS
Wear Rate

Wear Resistance

Wear Rate (mg/min)Wear ResistanceHyperion MT

6Supplier B

Supplier A

7

TS-PCD 2309-005 ENG A4 Copyright © Hyperion Materials & Technologies, Inc. – All rights reserved

www.HyperionMT.com
Hyperion Materials & Technologies, Inc.
6325 Huntley Road / Worthington, Ohio 43229+ 1-800-343-0636 / marketing@hyperionmt.com