HY0020 Datasheet
Ver. 1.1

Jun.24, 2024

HY0020Bluetooth® low energy modulewith Slot Antenna Built into Shielded Package

・ The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc.
and any use of such marks by FDK CORPORATION is under license. Other trademarks andtrade names are those of their respective owners.
・ Arm and Cortex are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or
elsewhere.
・ FDK Corporation is granted a license to use Slot Antenna on Shielded Package Technology
patented by Toshiba Corporation.

© 2024 FDK CORPORATION

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HY0020 Datasheet
Ver. 1.1

Version
1.0
1.1© 2024 FDK CORPORATION

Date
Apr.19, 2024
Jun.24, 2024

Jun.24, 2024

Description
First edition issued
Figure7-5, Figure7-6 corrected2

HY0020 Datasheet
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Product Overview and Features
1.1 Product Overview
Bluetooth® low energy module with "Slot Antenna on Shielded Package Technology” is a 2.4GHz
wireless communication (Bluetooth®) blank radio module with Nordic Semiconductor nRF52832. A
basic protocol stack can be installed via Flash mounted on the IC, and various applications can be
developed with this module alone. In addition, the module has acquired various radio and SIG
certifications on its own, which simplifies various certifications for customers.

1.2 Features
Slot Antenna on Shielded Package
Ultra-compact module with antenna pattern designed on the shield. Size: 3.5 x 10 x 1 mm
Large keep out areas are not required. World's smallest occupied area for printed circuitboards. (As of September 1, 2023. According to our research.)⚫ Bluetooth® ver.5.4 low energy conformity➢ Low energy 2 Mbps
➢ Output power: +4 dBm to -20 dBm (4 dB step)➢ Sensitivity: -94 dBm (1 Mbps)⚫ Integrated Processor System➢ Arm® Cortex®-M4 32-bit processor with FPU, 64MHz➢ Flash 512KB➢ Soft Device (protocol stack) is offered➢ Serial wire debug (SWD)⚫

➢➢

RAM 64KB⚫

Configurable 16 pin GPIOUART, SPI, TWI (I2C), QDEC
Wake-up function for sleep and deep sleep
4-channel PWM output for LED and buzzer control
PDM input for microphone
12-bit, 200 ksps ADC - 6 configurable channels⚫ Flexible power management, fully automatic LDO and DC/DC regulator system➢ 1.7 V–3.6 V supply voltage range➢ Low power mode
 1.9 μA at 3 V in System ON mode, no RAM retention, wake on RTC
⚫

➢
➢
➢
➢
➢

⚫

Weight: 0.08 g (Typ.)© 2024 FDK CORPORATION

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Outlineunit ： mm

Figure 2-1 Outline© 2024 FDK CORPORATION

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Block Diagram

HY0020
VDD
ANT

DCC
DEC4

nRF52832
RFIO

16

Filter

2

32MHz

GPIO

SWD

32.768kHz

Figure 3-1 Block Diagram

4

Pin Definitions

Figure 4-1 Pinout Diagram (Bottom View)© 2024 FDK CORPORATION

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Jun.24, 2024

Table 4-1 Pinout
Pin

Name

J4

P0.21/nRESET

B3
A3

RFIO
ANT

K4
L4
M4
L1
J1
K1
H1
A1
C3
G1
F1
C1
B1
N3
N2
G4
H4
D1
M1
N1

P0.20
P0.18
P0.16
P0.12
P0.08
P0.07
P0.06
P0.30/AIN6
P0.28/AIN4
P0.05/AIN3
P0.04/AIN2
P0.03/AIN1
P0.02/AIN0
NFC2/P0.10
NFC1/P0.09
SWDCLK
SWDIO
VDD
DCC
DEC4

E1
N4
F4
E4
D3
A2

VSS6
VSS5
VSS4
VSS3
VSS2
VSS1

© 2024 FDK CORPORATIONType

Description

Digital I/O

Digital I/O

General purpose I/O
Configurable as pin reset
RF I/O pin. It should be connected to Pin A3.
Internal antenna I/O pin. It should be connected to
Pin B3.
This product has a built-in 50 Ω matching circuit andantenna, so no additional external elements are
required.
General purpose I/O

Digital I/O
Analog input

General purpose I/O
SAADC/COMP/LPCOMP input

NFC input
Digital I/O
Digital input
Digital I/O
Power
Power
Power

NFC antenna connection
General purpose I/O
Serial wire debug clock input for debug and programming
Serial wire debug I/O for debug and programming
Power supply
DC/DC converter output
1.3 V regulator supply decoupling. Input from
DC/DC converter. Output from 1.3 V LDO.
GroundPower6

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Reference Circuits
Connect the RFIO and ANT terminals with the shortest possible length of 50Ω transmission line. Connect
the DCC and DEC4 pins as shown in Figure 5-1 when using the built-in LDO and Figure 5-2 when using
the built-in DC/DC converter. Regardless of the circuit connection status, a register setting by software isrequired.
HY0020B3

RFIO

P0.21/nRESET
P0.20

A3
VDD

ANT

P0.18
P0.16

0.1uF

D1

VDD

P0.12
P0.08

M1

DCC

P0.07
P0.06

N1

GND

DEC4

P0.30/AIN6
P0.28/AIN4

E1
N4
F4
E4
D3
A2

VSS6

P0.05/AIN3

VSS5

P0.04/AIN2

VSS4

P0.03/AIN1

VSS3

P0.02/AIN0

VSS2

NFC2/P0.10

VSS1

NFC1/P0.09
SWDCLK
SWDIO

J4
K4
L4
M4
L1
J1
K1
H1
A1
C3
G1
F1
C1
B1
N3
N2
G4
H4

GND

Figure 5-1 Built-in LDO regulator circuit example
HY0020B3

RFIO

P0.21/nRESET
P0.20

A3
VDD

ANT

P0.18
P0.16

0.1uF

D1

VDD

P0.12
P0.08

M1

DCC

P0.07
P0.06

N1

GND

DEC4

P0.30/AIN6
P0.28/AIN4

E1
N4
F4
E4
D3
A2

VSS6

P0.05/AIN3

VSS5

P0.04/AIN2

VSS4

P0.03/AIN1

VSS3

P0.02/AIN0

VSS2

NFC2/P0.10

VSS1

NFC1/P0.09
SWDCLK
SWDIO

J4
K4
L4
M4
L1
J1
K1
H1
A1
C3
G1
F1
C1
B1
N3
N2
G4
H4

GND

Figure 5-2 Built-in DC/DC converter circuit example© 2024 FDK CORPORATION

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Electrical specification
6.1 Absolute maximum ratings
Absolute maximum ratings are standards that must not be exceeded even momentarily. Exceeding
the absolute maximum ratings may cause deterioration or damage to internal components and may
also destroy, damage, or degrade external circuits other than the module. The application equipment
should be designed to ensure that the absolute maximum ratings are not exceeded under any
operating conditions.
Table 6-1 Absolute maximum ratings
Parameter
Supply voltage
I/O pin voltage

SymbolVDD
VI/O

RF input level
Storage temperature*1. VSS = GND = 0V

RFIO
Tstg

Condition
VDD≤3.6V
VDD>3.6V

Min.
-0.3
-0.3
-0.3
-40

Max.
+3.9
VDD+0.3
+3.9
+10
+85

Unit
V
V
V
dBm
°C

6.2 Recommended operating conditions
Recommended operating conditions refer to the conditions under which this product operates
normally with a certain level of quality. If any one of the operating conditions is not met, the productmay malfunction. Therefore, please ensure design of the applied equipment is such that the operating
conditions of this product do not exceed the specified range of the operating conditions.
Table 6-2 Recommended operating conditions
Parameter
SymbolCondition
Min.
Typ.
Max.
Unit
Supply voltage
VDD
1.7
3.0
+3.6
V
Supply rise time
tR_VDD
0V to 1.7V
60
ms
Oparating temperature
Ta
-40
+25
+85
°C
*1. VSS = GND = 0V
*2. Be sure to connect a bypass capacitor near the module for use.
*3. The on-chip power-on reset circuitry may not function properly for rise times longer than the specified
maximum.
*4. After power off, it must start up from below 0.3V.

© 2024 FDK CORPORATION

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6.3 DC Specifications
The DC electrical characteristics at ambient operating temperature (Ta) = 25°C, VDD = 3.0 V, and
DC/DC = ON are shown in Table 6-3.
Table 6-3 DC Specifications
Parameter
Input high voltage
Input low voltage
Output high voltage
Output low voltage
Pull-up resistancePull-down resistance
TX only run current

RX only run current
Sleep current*1.

Symbol
VIH
VIL
VOH
VOL
RPU
RPD
ITX1
ITX2
ITX3
ITX4
IRX1
IRX2
IsleepCondition
IOH = 5mA
IOL = 5mA
DC/DC, PRF = +4dBm
DC/DC, PRF = 0dBm
LDO, PRF = +4dBm
LDO, PRF = 0dBm
DC/DC, 1Mbps BLE
LDO, 1Mbps BLE
System Off

Min.
0.7 x VDD
VDD – 0.4
11
11
-

Typ.
13
13
7.5
5.3
16.6
11.6
5.4
11.7
0.3

Max.
0.3 x VDD
0.4
16
16
-

Unit
V
V
V
V
kΩ
kΩ
mA
mA
mA
mA
mA
mA
uA

VSS = GND = 0V

6.4 RF Specifications
The RF electrical characteristics at ambient operating temperature (Ta) = 25°C, VDD = 3.0 V, and
DC/DC = ON are shown in Table 6-4.
Table 6-4 RF Specifications
Parameter
Operating frequencies
Frequency deviation
Maximum output power
RF power control range
1st Adjacent Channel
Transmit Power 2MHz
2nd Adjacent Channel
Transmit Power 4MHz
Receiver sensitivity
1Mbps BLE idealtransmitter
Receiver sensitivity
2Mbps BLE idealtransmitter*1.

SymbolfOP
fDELTA_1M
fDELTA_2M
PRF
PRFC

Condition
BLE 1Mbps
BLE 2Mbps

Min.
2402
-

Typ.
±250
±500
4
24

Max.
2480
6
-

Unit
MHz
kHz
kHz
dBm
dB

PRF1

2Mbps BLE mode

-

-20

-

dBc

PRF2

2Mbps BLE mode

-

-50

-

dBc

PSENS_1M_DCDC

DC/DC

-

-93.5

-

dBm

PSENS_1M_LDO

LDO

PSENS_2M_DCDC

DC/DCPSENS_2M_LDO

LDO

-94.5
-

-90
-91

dBm
-

dBm
dBm

VSS = GND = 0V

© 2024 FDK CORPORATION

9HY0020 Datasheet
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Packaging
7.1 Packaging specifications（1） Packaging materials
Table 7-1 Packaging materials
Name
Embossed carrier tape
Cover tape
Reel
Aluminum moisture barrier bag
DesiccantHumidity indicator card
Label
Inner carton
Outer carton

Materials
Polystyrene
Polyethylene terephthalate
Polyethylene
Polystyrene
Polystyrene
Polyester
Silica gel

Appearance
Figure 7-5

Corrugated paper
Corrugated paper

Figure 7-1
Figure 7-1

Note
Conductivity
Antistatic

Figure 7-6

Conductivity
Antistatic（2） Packaging style
1. Taping

2. Aluminum moisture barrier bag

Packing quantity: 2,000pcs
3. Inner carton

Packing quantity: 2,000pcs
4. Outer carton

unit = mm
Packing quantity: 2,000pcs

unit = mm
Packing quantity: 10,000pcs max.
(5 inner cartons max.)

Figure 7-1 Packaging style© 2024 FDK CORPORATION

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HY0020 Datasheet
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（3） Label
(1)

(2)

(4)
(3)

(1)

Product’s number

HY0020(2)

Packing date(yyyy/mm/dd)

2024/02/07(3)

Quantity

2,000pcs(4)

Packing NO.

40001

(5)

Certification ID
Japan:USA (FCC):
Canada (ISED):

006-001190
2AQ85HY0020
31945-HY0020(6)

Manufacturer

FDK CORPORATION(7)Country of origin

MADE IN JAPAN

(5)

(6)

(7)

Figure 7-2 Label 1

Figure 7-3 Label 2© 2024 FDK CORPORATION

11HY0020 Datasheet
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Jun.24, 2024

7.2 Tape specifications

Figure 7-4 Tape specifications© 2024 FDK CORPORATION

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HY0020 Datasheet
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7.3 Dimensions of Embossed carrier tapeunit ： mm

Figure 7-5 Embossed carrier tape dimensions

7.4 Dimensions of Reel

unit ： mm

Figure 7-6 Reel dimensions© 2024 FDK CORPORATION

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Certification/Qualification information
8.1 Radio Certification
8.1.1 Japan
This product has obtained construction design certification as a radio station for low-power data
communication system based on the Radio Law.
R 006-001190

8.1.2 USA (FCC)
8.1.2.1 FCC Warning
15.19 Statement
This device complies with part 15 of the FCC Rules. Operation is subject to the following two
conditions:(1) This device may not cause harmful interference, and(2) this device must accept any interference received, including interference that may cause
undesired operation.
15.21 Information to user
Warning: Changes or modifications not expressly approved by the party responsible forcompliance could void the user’s authority to operate the equipment.
The Integrator will be responsible to satisfy SAR/ RF Exposure requirements, when themodule integrated into the host device.

8.1.2.2 Limit module procedures
Not applicable

8.1.2.3 Trace antenna designs
Not applicable

8.1.2.4 RF Exposure compliance statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolledenvironment and meets the FCC radio frequency (RF) Exposure Guidelines. This equipment
should be installed and operated keeping the radiator at least 20cm or more away fromperson's body.

8.1.2.5 Labeling instruction for Host product integrator
The end product must carry a physical label or shall use e-labeling followed KDB784748D01
and KDB 784748 stating “Contains Transmitter Module FCC ID: 2AQ85HY0020

8.1.2.6 Additional testing, Part 15 Subpart B disclaimer
The modular transmitter is only FCC authorized for the specific rule parts (FCC Part 15.247)
listed on the grant, and that the host product manufacturer is responsible for compliance toany other FCC rules that apply to the host not covered by the modular transmitter grant ofcertification. The final host product still requires Part 15 Subpart B compliance testing withthe modular transmitter installed when contains digital circuity.

© 2024 FDK CORPORATION

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8.1.2.7 FCC Statement(OEM) Integrator has to assure compliance of the entire end-product incl. the integrated RF
Module. For 15 B (§15.107 and if applicable §15.109) compliance, the host manufacturer isrequired to show compliance with 15 while the module is installed and operating.
Furthermore the module should be transmitting and the evaluation should confirm that themodule's intentional emissions (15C) are compliant (fundamental / out-of-band). Finally the
integrator has to apply the appropriate equipment authorization (e.g. Verification) for the newhost device per definition in §15.101.
Integrator is reminded to assure that these installation instructions will not be made available
to the end-user of the final host device.
The final host device, into which this RF Module is integrated" has to be labeled with an
auxiliary label stating the FCC ID of the RF Module, such as "Contains FCC ID:
2AQ85HY0020"Changes or modifications to this unit not expressly approved by the party responsible forcompliance could void the user’s authority to operate the equipment."
The Integrator will be responsible to satisfy SAR/ RF Exposure requirements, when themodule integrated into the host device.

8.1.2.8 Module statement
The single-modular transmitter is a self-contained, physically delineated, component for
which compliance can be demonstrated independent of the host operating conditions, andwhich complies with all eight requirements of § 15.212(a)(1) as summarized below.
1) The radio elements have the radio frequency circuitry shielded.
2) The module has buffered modulation/data inputs to ensure that the device will comply
with Part 15 requirements with any type of input signal.
3) The module contains power supply regulation on the module.
4) The module contains a permanently attached antenna.
5) The module demonstrates compliance in a stand-alone configuration.
6) The device is too small and therefore the FCC ID is in the manual in accordance with
2.925(f). Doing this complies with the labeling requirements in 15.212.
7) The module complies with all specific rules applicable to the transmitter, including all theconditions provided in the integration instructions by the grantee.
8) The module complies with RF exposure requirements.

8.1.3 Canada (ISED)
8.1.3.1 ISED Statement
The final host device, into which this RF Module is integrated" has to be labeled with an
auxiliary label stating the IC of the RF Module, such as" Contains transmitter module IC:
31945-HY0020
Le périphériquehôte final, danslequelce module RF estintégré "doitêtreétiqueté avec
uneétiquetteauxiliaireindiquant le CI du module RF, tel que" Contient le module émetteur IC:
31945-HY0020
This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation,
Science and Economic Development Canada’s licence-exempt RSS(s). Operation is subject
to the following two conditions:(1) This device may not cause interference.
(2) This device must accept any interference, including interference that may cause
undesired operation of the device.

© 2024 FDK CORPORATION15

HY0020 Datasheet
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L’émetteur/récepteur exempt de licencecontenudans le présentappareilestconforme aux
CNR d’Innovation, Sciences et Développementéconomique Canada applicables aux
appareils radio exempts de licence. L’exploitationestautorisée aux deux conditions
suivantes:(1) L' appareil ne doit pas produire de brouillage;(2) L' appareildoit accepter tout brouillageradioélectriquesubi, mêmesi le brouillageest
susceptible d' encompromettre le fonctionnement.
To maintain compliance with RSS’s RF Exposure guidelines, this equipment should
beinstalled and operated with minimum distance between 20cm the radiator your body: Use
only the supplied antenna.
Pour rester conforme aux directives d'exposition aux radiofréquences de RSS, cetéquipement doit être installé et utilisé à une distance minimale de 20cm du radiateur devotre corps : Utilisez uniquement l'antenne fournie.

8.1.4 EU (CE)This product complies with the following regulation tests.
ETSI EN300 328 V2.2.2
EN 62479: 2010

8.2 Bluetooth® Qualification
QDID: 232479
Product Type: Component (Tested)© 2024 FDK CORPORATION

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HY0020 Datasheet
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Precautions

9
・

The contents of this document, including information on hardware, software, and systems (hereinafterreferred to as "Products"), are subject to change without notice due to technological progress or otherreasons.

・

Reproduction or reprinting of this material without our written consent is prohibited. Even if you
reproduce or reprint this material with our written consent, please do not change or delete any of thecontents.

・

Although we strive to improve the quality and reliability of our products, semiconductor and memory
devices may be subject to malfunctions or failures. When using this product, it is the customer's
responsibility to ensure that the customer's hardware, software, and systems have the necessary
safety design in place to prevent infringement of life, limb, or property due to malfunction or failure ofthis product. When designing and using this product, please confirm and follow the latest informationon this product (this document, specifications, data sheets, application notes, etc.) as well as the
instruction manuals and operating manuals of the equipment in which this product is used. In addition,
when using information such as product data, diagrams, tables, and other technical content,
programs, algorithms, and other application circuit examples shown in the above materials, etc.,
please fully evaluate your product alone and as a whole system, and determine its applicability under
your own responsibility.

・This product is not intended or warranted for use in the following equipment (hereinafter referred toas "specific applications"):- equipment that requires a particularly high level of quality and reliability.
- equipment whose malfunction could endanger life or body, cause extensive property damage, or
have a serious impact on society.
Specific applications include nuclear power-related equipment, aerospace equipment, medical
equipment, automotive and transportation equipment, train and ship equipment, traffic signal
equipment, combustion and explosion control equipment, various safety-related equipment, elevating
equipment, electric power equipment, and financial-related equipment, but exclude applications thatare individually described in this document. We assume no responsibility for any specific use of the
product.

・

Do not disassemble, analyze, reverse engineer, or duplicate to this product.

・Do not use this product for any product whose manufacture, use, or sale is prohibited by domestic or
foreign laws, regulations, or orders.

・The technical information contained in this document is intended to explain the typical operation andapplication of the product, and its use does not constitute a guarantee or license to any intellectual
property rights or other rights of our company or any third party.

・Unless otherwise agreed to in a separate written contract or specification agreed between you andus, we make no warranties of any kind (including, but not limited to, the warranties of functionality,
merchantability, fitness for a particular purpose, accuracy of information, and non-infringement of third
party rights), either express or implied, with respect to this product and technical information.

・Do not use this product or the technical information contained in this document for the purpose ofdeveloping weapons of mass destruction, for military use, or for any other military purpose. When
exporting, please comply with applicable export laws and regulations such as "Foreign Exchange andForeign Trade Law" of Japan and "U.S. Export Administration Regulations" and follow the necessary
procedures as prescribed by those laws and regulations.

© 2024 FDK CORPORATION

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