ISSM2022 – International Symposium on Semiconductor Manufacturing
SPONSORSHIP
December 12-13, 2022, Tokyo, Japan
Shozo SaitoChairman, ISSM2022 Organizing Committee
Device & System Platform Development Center Co., Ltd.
Shuichi Inoue
Vice Chairman, ISSM2022 Organizing Committee
ATONARP INC.
Ayako ShimazakiChairman, ISSM2022 Executive Committee
Toshiba Nanoanalysis Corporation
It is our great pleasure to announce that the 29th annual International Symposium on Semiconductor
Manufacturing (ISSM) 2022 will be held on December 12-13, 2022 at KFC Hall, Ryogoku, Tokyo incooperation with e-Manufacturing & Design Collaboration Symposium (eMDC) which is sponsored by TSIA
with support from SEMI and GSA.
The program will feature keynote speeches by world leading speakers, timely and highlighted topics andnetworking sessions focusing on equipment/materials/software/services with suppliers' exhibits. ISSM
continues to contribute to the growth of the semiconductor industry through its infrastructure for networking,discussion, and information sharing among the world's professionals.
We would like you to cooperate with us by supporting the ISSM 2022.
Please see the benefit of ISSM2022 sponsorship.
Conference Overview

Date:

December 12-13, 2022

Location:

KFC (Kokusai Fashion Center) Hall
1-6-1 Yokoami Sumidaku,
Tokyo 130-0015 Japan+81-3-5610-5810

Co-Sponsored by: IEEE Electron Devices Society
Minimal FabSemiconductor Equipment Association of Japan (SEAJ)
Semiconductor Equipment and Materials International (SEMI)
Taiwan Semiconductor Industry Association (TSIA)
Endorsement by: The Japan Society of Applied Physics
Area of Interest:
Fab Management* Factory Design (FD)* Material Handling Management (MH)* Manufacturing Strategy (MS)* Fab Operation Method (FO)* Environment, Safety and Health, Carbon Neutral(ES)* Worker and WIP Control (WC)* Intelligent Data Management (ID)Material Technology* New Gas, New Liquid, and New ResistTechnologies (NM)* Material Informatics (MI)* New Parts Technology for Process Equipment (NP)Process Integration* Process/Material Optimization (PO)* Process Monitoring & Control Method (PM)* Yield & Defect Control (YD)
* Ultraclean Technology (UT)* New Process/Metrology Equipment (PE)* Manufacturing Technology for Variety Devices(VD)
Final Manufacturing & Packaging*Heterogeneous Integration and Packaging (HI)*Improvement of Conventional Final Manufacturing
Technology (FM)
*Signal and Power Integrity (SI)About ISSMSemiconductor manufacturing technology is reliant on the sum of the total of engineers'experiences and the accumulation of know-how and IP. The complexity of the field preventsa shift to the systematization and universalization of technologies. In order to bringbreakthroughs in semiconductor manufacturing to reflect changing and challenging new
requirements, the International Symposium on Semiconductor Manufacturing (ISSM) waslaunched in 1992.
ISSM is an annual conference of semiconductor manufacturing professionals dedicated tosharing technical solutions and opinions on the advancement of manufacturing science,technologies, and management disciplines. ISSM aims to establish new concepts forsemiconductor manufacturing technologies and to promote them as systemized anduniversalized technologies. ISSM's role has been to challenge the concept of shifting from"know-how" to "science" in semiconductor manufacturing technologies. The past symposia
have helped to shape the course of development of "manufacturing science," as well as tocreate new manufacturing technologies.
The Symposium is held under the joint sponsorship of the IEEE Electron Devices Society,
Minimal Fab, Semiconductor Equipment and Materials International (SEMI), and TaiwanSemiconductor Industry Association (TSIA). ISSM, with its global range, continuously pushes
technological development in order to promote the discovery and utilization of innovativetechnologies.
ISSM's mission is to achieve the continued prosperity of the semiconductor industry bybringing about breakthroughs in semiconductor manufacturing technologies throughnetworking between engineers in research and development fields and their counterparts inthe manufacturing field.

Organization
Japan Organizing Committee
Chairman:Shozo Saito, Device & System Platform Development Center Co., Ltd.
Vice Chairman:
Shuichi Inoue, ATONARP INC.
Treasurer
Hiroaki Kato, TOSHIBA ELECTRONIC DEVICES & STORAGE Corp.
Member:Tadahiro Suhara, JSR Corporation
Michihiro Inoue, National Institute of Advanced Industrial Science and Technology (AIST)
Hiroyuki Umimoto, Panasonic Corporation
Masahiko Nozaki, Renesas Electronics Corporation
Yasutoshi Okuno, SCREEN Semiconductor Solutions Co., Ltd.
Takahito Matsuzawa, Tokyo Electron Ltd.
Tomoyuki Sasaki, Tower Partners Semiconductor Co., Ltd.
Atsuyoshi Koike, Western Digital Japan
Keiji Horioka
Tadashi Nishimura

Japan Executive Committee
Chairman:
Ayako Shimazaki, Toshiba Nanoanalysis Corp.
Member:Kensuke Uriga, Dura Systems, Inc.
Naoyuki Ishiwata, Fujitsu Semiconductor Limited
Takeshi Hattori, Hattori Consulting International
Hiroshi Akahori, KIOXIA Corporation
Toshiyuki Uchino, Kokusai Electric Corporation
Katsutoshi Ozawa, OMRON Corp.
Hiroyuki Umimoto, Panasonic Corporation
Hiroyuki Mori, Renesas Electronics Corporation
Takashi Shimane, Rohm Co., Ltd.
Yasutoshi Okuno, SCREEN Semiconductor Solutions Co., Ltd.
Hiroyuki Chuma, Seijo University
Masahiko Hamajima, SEMI
Kiyoshi Watanabe, Semiconductor Equipment Association of Japan (SEAJ)
Takahito Matsuzawa, Tokyo Electron, Ltd.
Kazuya Okamoto, Yamaguchi University Graduate SchoolKeiji Horioka
Makoto Hirayama

Japan Program Committee
Chairman:Shin-ichi Imai, Hitachi High-Tech Solutions Corp.
Executive Vice Chairman:
Ayako Shimazaki, Toshiba Nanoanalysis Corp.
Committee leader:
Kazunori Kato, Advanced Interface Technology Corp.
Isamu Namose, OMRON Corporation
Akimasa Soyano, JSR Corporation
Kazuhito Matsukawa, SUMCO Corporation
Tomio Otsuka, JX Nippon Mining & Metals Corporation
ISSM Conference Editor for IEEE TSM
Tsuyoshi Moriya, Tokyo Electron Technology Solutions Ltd.
Member:Shinsuke Mizuno, Applied Materials Japan, Inc
Kazunori Nemoto, Hitachi High Technologies America, Inc.
Yuji Yamada, KIOXIA Corp.
Masami Aoki, KLA-Tencor Japan Ltd.
Minoru Akaishi, ON Semiconductor
Masahiro Shimbo, ON Semiconductor
Kenji Miyake, PMT Corporation
Kazuki Yokota, Renesas Electronics Corporation
Shoji Takei, Rohm Co., Ltd.
Kenji Watanabe, Western Digital
Takayuki Hisamatsu, Sony Semiconductor Manufacturing Corp.
Hiroyuki Inoue, Texas Instruments Japan Limited
Shun-ichiro Ohmi, Tokyo Institute of Technology
Toshio Konishi, Toppan Photomask Co., Ltd.
Takatoshi Yasui, Tower Partners Semiconductor Co., Ltd.
Matsumoto Takayuki, United Semiconductor Japan Co., Ltd.
Takahiro Tsuchiya, United Semiconductor Japan Co., Ltd.
Sumika Arima, University of Tsukuba
e-Manufacturing & Design Collaboration Conference (eMCD) Advisory Committee
Dr. Nicky C.C. Lu, Etron Technology, Inc.
Dr. TY Wu, TSIA
Ms. Celia Shih, TSIA
Mr. Thomas Chen, tsmc
Mr. Robert Chien, tsmc
Dr. C. Hsu, tsmc
Prof. SC Chang, National Taiwan University

Sponsorship of ISSM2022 in Tokyo, Japan

PlatinumSponsorSponsorship Fee¥800,000

Gold
Sponsor¥600,000

SilverSponsor¥400,000

BronzeSponsor¥200,000

ISSM2022 Invitation (Free)
Free ticket(s) for ISSM2022

6421Yes

Yes

Yes

Yes

Upper

MiddleLowerLower

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ISSM2022 Website
Company logo placed on ISSM2022
websiteLink to corporate website

ISSM2022 Proceedings
Recognition of sponsorship in meeting
materials along with company logoand link to corporate website

Yes

Yes

Yes

Yes

Company logo printed in color on thebrochure on site

Yes

Yes

Yes

Yes

ISSM2022 Screen at site
Company logo on the screen ofinterval

Yes

Yes

Yes

Yes

Company logo poster
Symposium Room

Yes

Yes

Yes

Yes

Yes

Yes

Yes

attheTable top exhibition
Provide table and white board
at the Room

Yes

Note: If the event is held online due to an infection situation, the exhibiting format and logo coverage will
be changed.

Contact:ISSM Office
C/O Semiconductor Portal, Inc.
6F Urban Toranomon Bldg., 1-16-4 Toranomon, Minato-ku
Tokyo 105-0001 Japan
TEL: +81-3-6807-3970
E-mail: issm_2022@semiconportal.com