HY0020 Application NoteVer. 1.0

Apr.19, 2024

HY0020Bluetooth® low energy modulewith Slot Antenna Built into Shielded Package

Application Note・The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. andany use of such marks by FDK CORPORATION is under license. Other trademarks and trade
names are those of their respective owners.

© 2024 FDK CORPORATION

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HY0020 Application NoteVer. 1.0

Version1.0© 2024 FDK CORPORATION

DateApr.19, 2024

Apr.19, 2024

DescriptionFirst edition issued2

HY0020 Application NoteVer. 1.0

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Apr.19, 2024

Purpose of this document
This document describes the considerations on the usage of HY0020, and the design and themanufacturing of the integration.

2Module footprint
2.1 Overview of the conductor layer pads and the solder resist opening(Unit: mm)
Figure 2-1 The overlaid diagram of the recommended conductor layer pads and the solder resist opening (Top view)© 2024 FDK CORPORATION

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HY0020 Application NoteVer. 1.0

Apr.19, 2024

2.2 Dimensions of the conductor layer pads
(Unit: mm)

Figure 2-2 Recommended dimensions of the module footprint conductor layer pads (Top view)

2.3 Dimensions of the solder resist opening(Unit: mm)

Figure 2-3 Recommended dimensions of the module footprint solder resist opening (Top view)© 2024 FDK CORPORATION

4HY0020 Application NoteVer. 1.0

Apr.19, 2024

2.4 Keep-out zone and surrounding GND pattern(Unit: mm)

Figure 2-4 Pattern of the top layer of the PCB （Top view）⚫
⚫
⚫

No conductor layers or no parts should be placed in the keep-out zone. Please note that the same
keep-out zone is applied to all of the other layers as well as the top layer.
Thinner than 0.10mm GND patterns should be placed on the three sides of the keep-out zone andconnected to the surrounding GND patterns.
The module should be placed along the outline of the PCB. There are no limitations of the clearance
dimensions between the board outlines and the copper foil patterns, but the copper foil patterns
should not be placed between the keep-out zone and the PCB outlines.

© 2024 FDK CORPORATION

5HY0020 Application NoteVer. 1.0Apr.19, 2024

2.5 Pin 1 index, control symbol and test terminal(Unit: mm)
Figure 2-5 Pin 1 index, control symbol and test terminal (top view)⚫

Do not provide metal mask openings for the pin 1 index, control symbols, and test terminals, anddo not connect them to the board by soldering.

© 2024 FDK CORPORATION

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Reflow soldering profile

260°C
255°C
Temperature

t3
220°C
180°C
150°C
t1

t2

Time

Note:

t1

150 to 180°C

60 to 120 sec.

t2

220°C and above

60 sec. or lesst3

255°C and above

5 sec. or lesspeak

260°C Max.

(1)(2)(3)(4)(5)© 2024 FDK CORPORATION

Solder paste: Sn-3.0Ag-0.5Cu
Do not apply vibration to the product during reflow.
The maximum number of times allowed for reflow is 2 times.
After opening the moisture-barrier bag, reflow soldering must be
performed within 168 hours in an environment with a temperatureof +5 to +30℃ and humidity of 60% RH or less.
For safe use, please reflow solder all the products within thespecified storage time. If it is anticipated that the storage time willexceed the specified time, please store the product in a dry box
or in moisture-barrier packaging again.

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Enclosure design(1) Conductive enclosures are recommended such as resin. The distance between the resin and themodule should be more than 0.5mm in the horizontal and vertical directions. The resin should not beattached to the top or the side of the module.
(2) In case the conductive enclosure has to be used, it is recommended to place it on the other side of
the PCB and keep the distance of 1mm and above to the PCB, which makes the radiation
performance better. Any metals on the top or the side may not secure the good antenna performance.

© 2024 FDK CORPORATION

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HY0020 Application NoteVer. 1.0

Apr.19, 2024

Precautions

5・The contents of this document, including information on hardware, software, and systems (hereinafterreferred to as "Products"), are subject to change without notice due to technological progress or otherreasons.

・

Reproduction or reprinting of this material without our written consent is prohibited. Even if you
reproduce or reprint this material with our written consent, please do not change or delete any of thecontents.

・Although we strive to improve the quality and reliability of our products, semiconductor and memory
devices may be subject to malfunctions or failures. When using this product, it is the customer'sresponsibility to ensure that the customer's hardware, software, and systems have the necessary
safety design in place to prevent infringement of life, limb, or property due to malfunction or failure ofthis product. When designing and using this product, please confirm and follow the latest informationon this product (this document, specifications, data sheets, application notes, etc.) as well as theinstruction manuals and operating manuals of the equipment in which this product is used. In addition,
when using information such as product data, diagrams, tables, and other technical content, programs,algorithms, and other application circuit examples shown in the above materials, etc., please fully
evaluate your product alone and as a whole system, and determine its applicability under your own
responsibility.

・This product is not intended or warranted for use in the following equipment (hereinafter referred toas "specific applications"):- equipment that requires a particularly high level of quality and reliability.
- equipment whose malfunction could endanger life or body, cause extensive property damage, orhave a serious impact on society.
Specific applications include nuclear power-related equipment, aerospace equipment, medicalequipment, automotive and transportation equipment, train and ship equipment, traffic signalequipment, combustion and explosion control equipment, various safety-related equipment, elevating
equipment, electric power equipment, and financial-related equipment, but exclude applications thatare individually described in this document. We assume no responsibility for any specific use of theproduct.

・Do not disassemble, analyze, reverse engineer, or duplicate to this product.

・Do not use this product for any product whose manufacture, use, or sale is prohibited by domestic or
foreign laws, regulations, or orders.

・The technical information contained in this document is intended to explain the typical operation andapplication of the product, and its use does not constitute a guarantee or license to any intellectual
property rights or other rights of our company or any third party.

・Unless otherwise agreed to in a separate written contract or specification agreed between you andus, we make no warranties of any kind (including, but not limited to, the warranties of functionality,
merchantability, fitness for a particular purpose, accuracy of information, and non-infringement of third
party rights), either express or implied, with respect to this product and technical information.

・Do not use this product or the technical information contained in this document for the purpose ofdeveloping weapons of mass destruction, for military use, or for any other military purpose. When
exporting, please comply with applicable export laws and regulations such as "Foreign Exchange andForeign Trade Law" of Japan and "U.S. Export Administration Regulations" and follow the necessary
procedures as prescribed by those laws and regulations.

© 2024 FDK CORPORATION

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