LAMP2025
The 9th International Congresson Laser Advanced Materials Processing

LPM2025 The 26th International Symposium on Laser Precision Microfabrication
HPL2025 The 9th International Symposium on High Power Laser Processing©“Visit ISESHIMA” Bureau

Date

June 10-13, 2025

Venue

Sinfonia Technology Hibiki Hall Ise https://www.ise-kanbun.jp/Ise-city, Mie-prefecture, Japan https://www.iseshima-kanko.jp/en

Organizer

Japan Laser Processing Society (JLPS) http://www.jlps.gr.jp/

Aim and Scope
The International Congress on Laser Advanced Materials Processing (LAMP) deals with the science and technologyof advanced laser materials processing, covering precision microfabrication and high-power laser processing.
LAMP2025 will be held from June 10-13, 2025, in Ise City, Mie Prefecture, Japan.
LAMP2025 consists of two international symposia: Laser Precision Microfabrication (LPM) and High Power Laser
Processing (HPL). It covers hardware and software for fundamental research and industrial applications in both microand macro processing.
LAMP2025 is planned as a four-day event featuring a Plenary Session, Oral and Poster Sessions, LPM Special Sessions
focusing on topical issues, and an exhibition hosting prominent figures in this field worldwide. The aim of this congress
is to provide a forum for discussing fundamental aspects of laser-matter interaction, the state-of-the-art in lasermaterials processing, and next-generation topics with fundamental scientists, end-users, and laser manufacturers.
We anticipate that LAMP2025 will play an important role not only in advancing the understanding of fundamental
laser materials processing but also in forecasting future technologies and trends in the laser market.

Committees▪ General Chair : Yasuhiro Okamoto, Okayama University, Japan▪ Co-Chairs : Mitsuhiro Terakawa, Keio University, Japan (LPM2025 Program Chair)
Masahiro Tsukamoto, JWRI, Osaka University, Japan (HPL2025 Program Chair)
Yongfeng Lu, University of Nebraska-Lincoln, USA
Michael Schmidt, Friedrich-Alexander Universität Erlangen-Nürnberg, Germany▪ Steering Committee Chair : Yoichiroh Hosokawa, Nara Institute of Science and Technology, Japan▪ Treasurer Leader : Yasutaka Hanada, Hirosaki University, Japan▪ Honorary Chairs : Isamu Miyamoto, Emeritus Prof., Osaka University, Japan
Koji Sugioka, RIKEN, Japan; Hiroyuki Niino, AIST, Japan;
Seiji Katayama, Emeritus Prof., Osaka University, Japan©“Visit ISESHIMA” Bureau

Congress website

http://www.jlps.gr.jp/lamp/lamp2025/

LAMP2025 TOPICS
LPM2025 TOPICS

HPL2025 TOPICS

1.	Fundamental aspects (Dynamics, modeling, simulation, etc.)

1.

Fundamentals of laser-materials interactions2.

Laser and photochemistry2.

Laser-induced plasma/plume3.

Ultra-short pulse laser processing3.

Gas laser

4.

Burst ablation

4.

Solid-state laser (YAG, Fiber, Disk, etc.)

5.	Advanced laser processing (Fiber laser, disc laser, FEL, etc.)

5.

Diode laser

6.

Glass/Ceramic processing

6.

Green or blue laser

7.

VUV laser and X-ray processing

7.

Optics8.

Nanotechnology

8.

Beam delivery system

9.

Nano-ripple formation

9.

Monitoring and control (including OCT)

10.	Nano- and micro-particles (including laser synthesis and10. Metallurgical and mechanical aspects

processing in liquids)

11. Modeling and simulation

11. Micro-machining

12. Cleaning

12. Micro-drilling and micro-cutting

13.	Surface modification (Hardening, quenching, alloying, etc.)

13. Micro-welding and micro-bonding

14. Cladding and rapid prototyping

14. Micro-forming

15. Additive manufacturing (3D Printer)

15. Micro-patterning and micro-structuring
16.	Surface processing (Texturing, cleaning, annealing, modification,etc.)

16. Welding
17. Welding of thick plate
18. Welding of high strength steel

17. 3-D micro- and nano-fabrication
18.	Film deposition and synthesis of advanced materials (PLD,CVD, etc.)

19. Welding of light metals and alloys
20. Joining of plastics, glasses or ceramics
21. Joining of dissimilar materials (plastic to metal)

19. Laser-based direct-write techniques
20. Laser-induced forward transfer (LIFT) techniques
21. Lithography (including EUV source and application)
22. Laser devices

22. Joining of battery or fuel cell
23. Remote welding
24. Hybrid welding
25. Brazing and soldering

23. Beam shaping
24. Optics and systems for laser microprocessing
25. Process monitoring and control

26. Drilling (High speed and high quality)
27. Cutting (of CFRP, etc.)
28. Thick plate cutting and dismantling

26. Packaging and mounting process
27. Manufacture of micro devices and systems
28. Medical and biological applications

29. Industrial applications
30. Innovative applications (Sandwich panel, etc.)
31. Present status and future prospects

29. Industrial applications32. Others

30. Others
31. Special Session : TBA

CONTACT
LAMP2025 Secretariat, Japan Laser Processing Society (JLPS)
c/o JWRI, Osaka University, 11-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan
TEL/FAX: +81-6-6879-8642, E-mail: lamp2025@jlps.gr.jp

Congress website

http://www.jlps.gr.jp/lamp/lamp2025/