S-CMCR

Super-Cu Mo Cu
Supreme Heat Sink Material
Our heat sink material is composed of a multilayer
structure of copper and molybdenum foils. With ourinnovative manufacturing technology, our productachieves higher thermal conductivity while maintaining a
low coeﬃcient of thermal expansion. It ﬁnds applications
in a wide range of ﬁelds, including semiconductors.

Characteristics
Mass production SystemPrecision machining using Wire Electrical Discharge
Machining (Wire EDM) and full automation with robots

Low production costLower molybdenum content with the same performancecompared to the competitor products.
Complete automation from material preparation toinspection and packaging

Various shape processing technologies

No adhesive materials for bonding

With CNC machining and Wire EDM, our S-CMC material

Using a hot press apparatus, copper and molybdenum

can be processed to your speciﬁcation.

foils are directly joined through diﬀusion bonding.

Various laminated structures
Our product has a molybdenum content of
1/5 to 1/10 compared to other companiesʼ
products, making it more cost-eﬀective.
Our technology allows for adjusting the thicknessof the product in increments of 7.5 micrometers.
Various shape machining is possible.

Unique Selling Point
The special award at the 6th innovation
Japan Award sponsored by Japanese
Ministry of Economy, Trade and Industry.
Patents obtained in Japan, USA, EU, China

Cu
MoCu
MoCu

S-CMC

R

Super-Cu Mo Cu
Physical properties
High thermal conductivity and low thermal expansion
thermalconductivity

Super-CMC

Typical Properties
Mo＝5%

Mo＝10%

Mo＝20%

Mo＝40%

Cu＝100%Z-direction

362

335

291

230

394

XY-drection

381

369

344

290

394

RT-250℃

14.8

11.8

7.4

6.6

17RT-400℃

13.5

9.3

6.8

6.2

RT-800℃

9.5

7.5

6.5

6.1

MoContent（％）
Thermalconductivity（W/mk）

ThermalExpansion（×10-6/℃）

Ref.

thermal expansion

Comparing FJC products with the competitorʼsOur product has 1.5 times the thermal conductivity
compared to other companyʼs products, while
maintaining a low coeﬃcient of thermal expansion
ranging from 6 to 10 PPM/°C.

The values of thermal conductivity and coeﬃcientof thermal expansion in various molybdenum contents
The copper-to-molybdenum ratio can be adjusted to yourdesired value.

Applications
Mass production System

Low production cost

Power Control Unit (PCU) for battery electric vehicles

S-CMC plates are employed as spacers to bridge the gap between power semiconductors and circuit boards,and theyplay a role in heat conduction.
An ideal heat sink material for double-sided cooling PCUs with extremely small thickness variation.

AC

heat

heat sinkheat

heat sink

S-CMC: spacer
The product thickness can be adjusted
in increments of 7.5 micrometers.

DCPower Control UnitMotorPowersemiconductor
SolderBatteryS-DBC(ceramic insulated circuit board)Braking friction

5G

Various shape processing technologies

5G mobile communications

Our product is utilized in the 5G communication equipment,
mobile phone base stations, and airplane Wi-Fi systems.
The product is employed as a high-performance heatsink for semiconductor packages used in high-frequency
bands. It provides excellent thermal conductivity.

FJ Comopsite Materials Co.,LTD2-2-3, Kashiwadai-minami, Chitose-shi, Hokkaido, 066-0009, Japan
TEL ： 0123-29-7034 FAX ： 0123-29-7035
JQA-QMA16308

URL ： https://www.fj-composite.com/