DISCRETE SEMICONDUCTORSDATA SHEETBCX70 series
NPN general purpose transistors
Product data sheet
Supersedes data of 1999 Apr 152004 Jan 16

NXP Semiconductors

Product data sheet

NPN general purpose transistors

BCX70 series

FEATURESPINNING• Low current (max. 100 mA)

PIN• Low voltage (max. 45 V).

1base

2

emitter

3collector

APPLICATIONSDESCRIPTION• General purpose switching and amplification.
DESCRIPTIONNPN transistor in a SOT23 plastic package.
PNP complements: BCX71 series.

handbook, halfpage

3
3

MARKING
1

MARKING CODE(1)TYPE NUMBER
BCX70GAG*

BCX70H

AH*

BCX70JAJ*

BCX70K

AK*1Top view

22
MAM255Note
1. * = p : Made in Hong Kong.
* = t : Made in Malaysia.
* = W : Made in China.

Fig.1 Simplified outline (SOT23) and symbol.

ORDERING INFORMATIONTYPE
NUMBER
BCX70G

PACKAGENAME−

DESCRIPTIONVERSIONplastic surface mounted package; 3 leads

SOT23

BCX70H
BCX70J
BCX70K

2004 Jan 162NXP Semiconductors

Product data sheet

NPN general purpose transistors

BCX70 series

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOLPARAMETERCONDITIONS

MIN.

MAX.

UNIT

VCBO

collector-base voltage

open emitter

−45V

VCEO

collector-emitter voltage

open base

−45V

VEBO

emitter-base voltage

open collector

−5V

IC

collector current (DC)

−

100mA

ICM

peak collector current−200mA

IBM

peak base current−200mA

Ptot

total power dissipation−250mW

Tstg

storage temperature−65+150°C

Tj

junction temperature−150°C

Tamb

operating ambient temperature−65+150°C

Tamb ≤ 25 °C

THERMAL CHARACTERISTICSSYMBOLRth(j-a)

PARAMETERCONDITIONS

thermal resistance from junction to ambient

note 1Note
1. Transistor mounted on an FR4 printed-circuit board.

2004 Jan 16

3VALUE

UNIT

500K/W

NXP Semiconductors

Product data sheet

NPN general purpose transistors

BCX70 series

CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOL
ICBO

PARAMETER

MIN.

TYP.

MAX.

UNIT

IE = 0; VCB = 45 V

−

−

20nA

IE = 0; VCB = 45 V; Tamb = 150 °C

−−

20μA−

−20nA

BCX70G−−−

BCX70H40−−

BCX70J

30−−

BCX70K

100−−BCX70G

120−220

BCX70H

180−

310

BCX70J

250−

460

BCX70K

380−

630

BCX70G50−−

BCX70H70−−

BCX70J90−−

BCX70K100−−

collector cut-off current

CONDITIONS

IEBOemitter cut-off current

IC = 0; VEB = 4 VhFE

DC current gain

IC = 10 μA; VCE = 5 V

DC current gain

DC current gain

IC = 2 mA; VCE = 5 V

IC = 50 mA; VCE = 1 V

VCEsatcollector-emitter saturation
voltage

IC = 10 mA; IB = 0.25 mA

50−350mV

IC = 50 mA; IB = 1.25 mA

100−550mVVBEsat

base-emitter saturation voltage

IC = 10 mA; IB = 0.25 mA

600−850mV

IC = 50 mA; IB = 1.25 mA

700−1 050mV

IC = 10 μA; VCE = 5 V−

520−mVIC = 2 mA; VCE = 5 V

550650750mV

IC = 50 mA; VCE = 1 V−

780−

mV

VBE

base-emitter voltage

Cccollector capacitance

IE = ie = 0; VCB = 10 V; f = 1 MHz−

1.7−

pF

Ceemitter capacitance

IC = ic = 0; VEB = 0.5 V; f = 1 MHz−11−

pF

fTtransition frequency

IC = 10 mA; VCE = 5 V; f = 100 MHz; 100note 1250−MHzF

noise figure

IC = 200 μA; VCE = 5 V; RS = 2 kΩ;
f = 1 kHz; B = 200 Hz

26dB

Note
1. Pulse test: tp ≤ 300 μs; δ ≤ 0.02.

2004 Jan 164−

NXP Semiconductors

Product data sheet

NPN general purpose transistors

BCX70 series

PACKAGE OUTLINE
Plastic surface-mounted package; 3 leads

SOT23DEBAX

HEv M A

3QA
A112e1bpcw M BLpedetail X012 mmscale

DIMENSIONS (mm are the original dimensions)
UNITAA1max.

bpc

DEee1

HE

LpQv

w

mm

1.1
0.9

0.1

0.48
0.38

0.15
0.09

3.0
2.8

1.4
1.2

1.9

0.95

2.5
2.1

0.45
0.15

0.55
0.45

0.2

0.1

OUTLINE
VERSION
SOT232004 Jan 16

REFERENCES
IEC

JEDEC

JEITA

EUROPEAN
PROJECTION

ISSUE DATE
04-11-04
06-03-16

TO-236AB

5NXP Semiconductors

Product data sheet

NPN general purpose transistors

BCX70 series

DATA SHEET STATUS
DOCUMENTSTATUS(1)PRODUCTSTATUS(2)Objective data sheet

Development

This document contains data from the objective specification for productdevelopment.

Preliminary data sheet

Qualification

This document contains data from the preliminary specification.

Product data sheet

Production

This document contains the product specification.

DEFINITION

Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was publishedand may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DISCLAIMERS

above those given in the Characteristics sections of thisdocument is not implied. Exposure to limiting values forextended periods may affect device reliability.

General ⎯ Information in this document is believed to beaccurate and reliable. However, NXP Semiconductors
does not give any representations or warranties,
expressed or implied, as to the accuracy or completenessof such information and shall have no liability for theconsequences of use of such information.

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products are sold subject to the general terms andconditions of commercial sale, as published at
http://www.nxp.com/profile/terms, including thosepertaining to warranty, intellectual property rights
infringement and limitation of liability, unless explicitly
otherwise agreed to in writing by NXP Semiconductors. In
case of any inconsistency or conflict between informationin this document and such terms and conditions, the latter
will prevail.

Right to make changes ⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time andwithout notice. This document supersedes and replaces all
information supplied prior to the publication hereof.

No offer to sell or license ⎯ Nothing in this document
may be interpreted or construed as an offer to sell productsthat is open for acceptance or the grant, conveyance or
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not designed, authorized or warranted to be suitable foruse in medical, military, aircraft, space or life support
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accepts no liability for inclusion and/or use of NXP
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Export control ⎯ This document as well as the item(s)described herein may be subject to export control
regulations. Export might require a prior authorization fromnational authorities.
Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values andCharacteristics sections of this document, and as such is
not complete, exhaustive or legally binding.

Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation orwarranty that such applications will be suitable for thespecified use without further testing or modification.
Limiting values ⎯ Stress above one or more limitingvalues (as defined in the Absolute Maximum Ratings
System of IEC 60134) may cause permanent damage tothe device. Limiting values are stress ratings only andoperation of the device at these or any other conditions

2004 Jan 166

NXP Semiconductors

Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.

Contact information
For additional information please visit: http://www.nxp.com
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All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any licenseunder patent- or other industrial or intellectual property rights.
Printed in The Netherlands

R75/04/pp7

Date of release: 2004 Jan 16

Document order number: 9397 750 12408