Shozo Saito
Chair, ISSM Organizing Committee
Device & System Platform Development Center, Inc.
Shuichi Inoue
Vice-Chairman, ISSM Organizing Committee
Atnerup Corporation
Ayako Shimazaki
Chairman, ISSM Steering Committee
Toshiba Nanoanalysis Corporation

Sponsorship for the 30th International Symposium on Semiconductor Manufacturing (ISSM2024)

We would like to take this opportunity to express our sincere appreciation for your continued support ofthe ISSM (International Symposium on Semiconductor Manufacturing).
Since its inauguration in 1992, ISSM has been recognized as one of the most important international
conferences on semiconductor production technology and has established its position as a major
conference in the field of semiconductor production.

Recently, semiconductor manufacturing technology, the theme of ISSM, has been shifting more andmore from "manufacturing technology" to "usage technology". At a time when it is necessary to evaluate
and select technologies based on a broad view of semiconductor manufacturing technology as a whole,
ISSM will make further contributions to the development of semiconductor manufacturing as the onlyinternational conference that can evaluate systemic approaches that integrate different technologicalfields, taking advantage of its characteristics of covering all semiconductor manufacturing technologies.
In addition to the technological aspect, new changes are also permeating the geographical raw material
procurement and reuse issues on the SCM axis, as well as the issues of responding to production
technologies in accordance with a decarbonized world from end users.

The 30th ISSM2024 will be held on December 9-10, 2024, at KFC Hall (Ryogoku, Tokyo) to promotebeneficial collaboration among the semiconductor industry to address new challenges in semiconductor
production technology, thereby contributing to a new leap forward for the semiconductor industry and its
lasting development and prosperity.

We would like to ask for your kind support for ISSM2024 as sponsors.

Sincerely yours

Outline of ISSM 2024
1. Conference Name: The 30th International Symposium on Semiconductor Manufacturing 2024
(ISSM2024)
2. Sponsor
Co-sponsored by:IEEE Electron Devices Society
Minimal FabSemiconductor Equipment Association of Japan (SEAJ)
Semiconductor Equipment and Materials International (SEMI)
Taiwan Semiconductor Industry Association (TSIA)
Endorsement by：
The Japan Society of Applied Physics
3. Date: Monday, December 9 and Tuesday, December 10, 2024
4. Venue: KFC(Kokusai Fashion Center) Hall
1-6-1 Yokoami Sumida-ku,Tokyo 130-0015 Japan+81-3-5610-5810
https://issm.semiconportal.net/venue/
5. Program
ISSM2024 plans to include:- Keynote speeches- Tutorial sessions- Highlighted sessions- Oral presentation by selected authors- Poster presentation by selected authors
6. Conference Highlight Theme- IoT and AI Solution- Leading-edge semiconductor fabs
- Sustainable Semiconductor Manufacturing and Global Environmental Preservation- Next Generation 3D Packaging and Chiplets Integration Technology: New Horizons fromIntegration to Test
7. Conference Areas- Fab Management- * Factory Design & Automated Material Handling (FD)
- * Manufacturing Strategy and Operation Management (MS)- * Manufacturing Control and Execution (MC)- * Environment, Safety and Health (ES)- * Intelligent Data Management (ID)
- Process Integration- * Process and Material Optimization (PO)- * Yield Enhancement Methodology (YE)
- * Contamination Control and Ultraclean Technology (UC)
- * Process Control and Monitoring (PC)
- * Process and Metrology Equipment (PE)
- * Design for Manufacturing (DM)
- * Manufacturing Technology for Variety Devices (VD)
- Final Manufacturing- * 3D Chiplet & Packaging (TP)8. Expected participants: 250
9. Conference official language: English

ISSM 2024 Sponsorship Selection and Benefit
LevelPlatinum

GoldSilverBronze

Reception

Lanyardーーーー21¥400,000¥200,000

Maximum number of sponsors
Sponsorship fee (10% tax to be added)¥800,000 ¥600,000 ¥400,000 ¥200,000
Participation to ISSM 2024

Free tickets to ISSM 2024

642111

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Yes

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Visibility
Logo on ISSM2024 website

Yes

Yes

1-min PR movie prior to keynote speech

Yes

Yes

Logo appeared on online proceedings

Yes

Yes

Yes

Yes

Yes

Yes

Logo appeared on interval screen

Yes

Yes

Yes

Yes

Yes

Yes

Loto on sponsorship banner at the venue

Yes

Yes

Yes

Yes

Yes

Yes

Logo at reception hallYes

Speech at reception

Yes

Company name on lanyard

Yes

Exhibition
Exhibit Booth

Application deadline: October 31, 2024
■Contact
ISSM 2024 Secretariat
Semiconductor Portal, Inc.
Tel：+81-3-6807-3970
E-mail：issm_2024@semiconportal.com

Yes

Yes

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