DISCRETE SEMICONDUCTORSDATA SHEETdbook, halfpage

M3D088BCW60 series
NPN general purpose transistors
Product data sheet
Supersedes data of 1997 Mar 101999 Apr 22

NXP Semiconductors

Product data sheet

NPN general purpose transistors

BCW60 series

FEATURESPINNING• Low current (max. 100 mA)

PIN• Low voltage (max. 32 V).

1base

2

emitter3collector

APPLICATIONSDESCRIPTION• General purpose switching and amplification.
DESCRIPTION

handbook, halfpage

33NPN transistor in a SOT23 plastic package.
PNP complements: BCW61 series.
1MARKING
1

MARKING CODE(1)TYPE NUMBER
BCW60BAB∗

BCW60CAC∗

BCW60DAD∗

22Top view

MAM255

Fig.1 Simplified outline (SOT23) and symbol.

Note
1. ∗ = p : Made in Hong Kong.
∗ = t : Made in Malaysia.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOLPARAMETERCONDITIONS

MIN.

MAX.

UNIT

VCBO

collector-base voltage

open emitter

−

32

V

VCEO

collector-emitter voltage

open base

−

32

V

VEBO

emitter-base voltage

open collector−

5V

ICcollector current (DC)

−

100mA

ICMpeak collector current−200mA

IBM

peak base current−200mAPtot

total power dissipation−250mW

Tstg

storage temperature−65+150°C

Tjjunction temperature−150°C

Tamboperating ambient temperature−65+150°C

1999 Apr 22

Tamb ≤ 25 °C

2

NXP Semiconductors

Product data sheet

NPN general purpose transistors

BCW60 series

THERMAL CHARACTERISTICSSYMBOLRth j-a

PARAMETERCONDITIONS

thermal resistance from junction to ambient

VALUE

UNIT

500

K/W

note 1Note
1. Transistor mounted on an FR4 printed-circuit board.
CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOL
ICBO

PARAMETERCONDITIONS

MIN.

TYP.

MAX.

UNIT

IE = 0; VCB = 32 V−−20nA

IE = 0; VCB = 32 V; Tamb = 150 °C−−20μA−−20nA

BCW60B

20−−

BCW60C

40−

−

100−

−

BCW60B

180−

310

BCW60C

250−

460

BCW60D

380−

630

BCW60B70−−

BCW60C90−−

BCW60D100−−

collector cut-off current

IEBO

emitter cut-off current

IC = 0; VEB = 4 VhFE

DC current gain

IC = 10 μA; VCE = 5 V

BCW60D
DC current gain

DC current gain

IC = 2 mA; VCE = 5 V

IC = 50 mA; VCE = 1 V

VCEsatcollector-emitter saturation
voltage

IC = 10 mA; IB = 0.25 mA

50−350mV

IC = 50 mA; IB = 1.25 mA

100−550mV

VBEsatbase-emitter saturation voltage

IC = 10 mA; IB = 0.25 mA

600−850mV

IC = 50 mA; IB = 1.25 mA

0.7−

1.05V

IC = 10 μA; VCE = 5 V−

520−mVIC = 2 mA; VCE = 5 V

550650750mV

IC = 50 mA; VCE = 1 V−780−mV

VBE

base-emitter voltage

Cccollector capacitance

IE = ie = 0; VCB = 10 V; f = 1 MHz−

1.7−pF

Ceemitter capacitance

IC = ic = 0; VEB = 0.5 V; f = 1 MHz −11−pF

fTtransition frequency

IC = 10 mA; VCE = 5 V;
f = 100 MHz; note 1100250−

MHzFnoise figure

IC = 200 μA; VCE = 5 V;
RS = 2 kΩ; f = 1 kHz; B = 200 Hz−

26dB

Note
1. Pulse test: tp ≤ 300 μs; δ ≤ 0.02.

1999 Apr 223NXP Semiconductors

Product data sheet

NPN general purpose transistors

BCW60 series

PACKAGE OUTLINE
Plastic surface mounted package; 3 leads

SOT23

DEB

AX

HEv M A

3Q
A
A112e1

bpcw M B

Lpedetail X

012 mmscale

DIMENSIONS (mm are the original dimensions)
UNIT

A

A1
max.

bp

c

DE

ee1

HE

Lp

Qv

w

mm

1.1
0.9

0.1

0.48
0.38

0.15
0.09

3.0
2.8

1.4
1.2

1.9

0.95

2.5
2.1

0.45
0.15

0.55
0.45

0.2

0.1

OUTLINE
VERSION
SOT23

1999 Apr 22

REFERENCES
IEC

JEDEC

EIAJ

EUROPEAN
PROJECTION

ISSUE DATE
97-02-28
99-09-13

TO-236AB4NXP Semiconductors

Product data sheet

NPN general purpose transistors

BCW60 series

DATA SHEET STATUS
DOCUMENTSTATUS(1)PRODUCTSTATUS(2)Objective data sheet

Development

This document contains data from the objective specification for productdevelopment.

Preliminary data sheet

Qualification

This document contains data from the preliminary specification.

Product data sheet

Production

This document contains the product specification.

DEFINITION

Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was publishedand may differ in case of multiple devices. The latest product status information is available on the Internet atURL http://www.nxp.com.
DISCLAIMERS

above those given in the Characteristics sections of thisdocument is not implied. Exposure to limiting values forextended periods may affect device reliability.

General ⎯ Information in this document is believed to beaccurate and reliable. However, NXP Semiconductors
does not give any representations or warranties,
expressed or implied, as to the accuracy or completenessof such information and shall have no liability for theconsequences of use of such information.

Terms and conditions of sale ⎯ NXP Semiconductors
products are sold subject to the general terms andconditions of commercial sale, as published at
http://www.nxp.com/profile/terms, including thosepertaining to warranty, intellectual property rights
infringement and limitation of liability, unless explicitly
otherwise agreed to in writing by NXP Semiconductors. In
case of any inconsistency or conflict between informationin this document and such terms and conditions, the latter
will prevail.

Right to make changes ⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time andwithout notice. This document supersedes and replaces all
information supplied prior to the publication hereof.

No offer to sell or license ⎯ Nothing in this document
may be interpreted or construed as an offer to sell productsthat is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents orother industrial or intellectual property rights.

Suitability for use ⎯ NXP Semiconductors products are
not designed, authorized or warranted to be suitable foruse in medical, military, aircraft, space or life support
equipment, nor in applications where failure or malfunctionof an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment orapplications and therefore such inclusion and/or use is at
the customer’s own risk.

Export control ⎯ This document as well as the item(s)described herein may be subject to export control
regulations. Export might require a prior authorization fromnational authorities.
Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values andCharacteristics sections of this document, and as such is
not complete, exhaustive or legally binding.

Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation orwarranty that such applications will be suitable for thespecified use without further testing or modification.
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) may cause permanent damage tothe device. Limiting values are stress ratings only andoperation of the device at these or any other conditions
1999 Apr 225

NXP Semiconductors

Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.

Contact information
For additional information please visit: http://www.nxp.com
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All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any licenseunder patent- or other industrial or intellectual property rights.
Printed in The Netherlands

115002/00/03/pp6

Date of release: 1999 Apr 22

Document order number: 9397 750 05715