DISCRETE SEMICONDUCTORSDATA SHEETBCX71 series
PNP general purpose transistors
Product data sheet
Supersedes data of 1999 Apr 20

2004 Feb 16

NXP Semiconductors

Product data sheet

PNP general purpose transistors

BCX71 series

FEATURESPINNING• Low current (max. 100 mA)

PIN• Low voltage (max. 45 V)

1base• Low noise.

2emitter3collector

DESCRIPTIONAPPLICATIONS• Low level, low noise, low frequency applications inhybrid circuits• General purpose switching and amplification.
DESCRIPTION
handbook, halfpage

3

PNP transistor in a plastic SOT23 package.
NPN complements: BCX70 series.

31

MARKINGTYPE NUMBER

2

MARKING CODE(1)BCX71H

BH*

BCX71J

BJ*

BCX71K

BK*

1Top view

2
MAM256Note
1. * = p : Made in Hong Kong.
* = t : Made in Malaysia.
* = W : Made in China.

Fig.1 Simplified outline (SOT23) and symbol.

ORDERING INFORMATIONPACKAGETYPE
NUMBERNAME

BCX71H−DESCRIPTIONVERSIONplastic surface mounted package; 3 leads

SOT23

BCX71J
BCX71K

2004 Feb 16

2NXP Semiconductors

Product data sheet

PNP general purpose transistors

BCX71 series

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOLPARAMETERCONDITIONS

MIN.

MAX.

UNIT

VCBO

collector-base voltage

open emitter

−−45

V

VCEO

collector-emitter voltage

open base

−−45

V

VEBO

emitter-base voltage

open collector

−−5V

IC

collector current (DC)−−100mA

ICM

peak collector current−−200mAIBM

peak base current−−200mA

Ptot

total power dissipation−250mW

Tstg

storage temperature−65+150°C

Tjjunction temperature−150°C

Tamb

operating ambient temperature−65+150°C

Tamb ≤ 25 °C

THERMAL CHARACTERISTICSSYMBOLRth(j-a)

PARAMETERCONDITIONS

thermal resistance from junction to ambient

note 1Note
1. Transistor mounted on an FR4 printed-circuit board.

2004 Feb 16

3

VALUE

UNIT

500

K/W

NXP Semiconductors

Product data sheet

PNP general purpose transistors

BCX71 series

CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOL
ICBO

PARAMETER

MIN.

TYP.

MAX.

UNIT

IE = 0; VCB = −45 V−−−20nA

IE = 0; VCB = −45 V; Tamb = 150 °C−−−20μA−−−20nA

BCX71H

30−−BCX71J

40−−100−−

BCX71H180−310

BCX71J

250−460

BCX71K380−630

BCX71H80−−BCX71J

100−−BCX71K

110−−

collector-base cut-off current

CONDITIONS

IEBOemitter-base cut-off current

IC = 0; VEB = −4 VhFE

DC current gain

IC = −10 μA; VCE = −5 V

BCX71K
DC current gain

DC current gain

IC = −2 mA; VCE = −5 V

IC = −50 mA; VCE = −1 V; note 1VCEsat

collector-emitter saturation
voltage

IC = −10 mA; IB = −0.25 mA−60−−250mV

IC = −50 mA; IB = −1.25 mA; note 1−120−−550mVVBEsat

base-emitter saturation
voltage

IC = −10 mA; IB = −0.25 mA−600−−850mV

IC = −50 mA; IB = −1.25 mA; note 1−680−−1 050 mV

base-emitter voltage

IC = −2 mA; VCE = −5 V−600−650−750mV

IC = −10 μA; VCE = −5 V−−550−mV

IC = −50 mA; VCE = −1 V; note 1−−720−mV

VBECc

collector capacitance

IE = Ie = 0; VCB = −10 V; f = 1 MHz−4.5−pF

Ceemitter capacitance

IC = Ic = 0; VEB = −0.5 V; f = 1 MHz−11−pF

fTtransition frequency

IC = −10 mA; VCE = −5 V; f = 100 MHz 100−−MHzFnoise figure

IC = −200 μA; VCE = −5 V; RS = 2 kΩ;
f = 1 kHz; B = 200 Hz

26dB

Note
1. Pulse test: tp ≤ 300 μs; δ ≤ 0.02.

2004 Feb 16

4−

NXP Semiconductors

Product data sheet

PNP general purpose transistors

BCX71 series

PACKAGE OUTLINE
Plastic surface-mounted package; 3 leads

SOT23DEBAXHEv M A

3QA
A1

12e1

bpcw M B

Lpedetail X

012 mmscale

DIMENSIONS (mm are the original dimensions)
UNITA

A1max.

bpc

DEee1HE

LpQvw

mm

1.1
0.9

0.1

0.48
0.38

0.15
0.09

3.0
2.8

1.4
1.2

1.9

0.95

2.5
2.1

0.45
0.15

0.55
0.45

0.2

0.1

OUTLINE
VERSION
SOT23

2004 Feb 16

REFERENCES
IEC

JEDEC

JEITA

EUROPEAN
PROJECTION

ISSUE DATE
04-11-04
06-03-16

TO-236AB

5NXP Semiconductors

Product data sheet

PNP general purpose transistors

BCX71 series

DATA SHEET STATUS
DOCUMENTSTATUS(1)PRODUCTSTATUS(2)Objective data sheet

Development

This document contains data from the objective specification for productdevelopment.

Preliminary data sheet

Qualification

This document contains data from the preliminary specification.

Product data sheet

Production

This document contains the product specification.

DEFINITION

Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was publishedand may differ in case of multiple devices. The latest product status information is available on the Internet atURL http://www.nxp.com.
DISCLAIMERS

above those given in the Characteristics sections of thisdocument is not implied. Exposure to limiting values forextended periods may affect device reliability.

General ⎯ Information in this document is believed to beaccurate and reliable. However, NXP Semiconductors
does not give any representations or warranties,
expressed or implied, as to the accuracy or completenessof such information and shall have no liability for theconsequences of use of such information.

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case of any inconsistency or conflict between informationin this document and such terms and conditions, the latter
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reserves the right to make changes to informationpublished in this document, including without limitation
specifications and product descriptions, at any time andwithout notice. This document supersedes and replaces all
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Export control ⎯ This document as well as the item(s)described herein may be subject to export control
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Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values andCharacteristics sections of this document, and as such is
not complete, exhaustive or legally binding.

Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation orwarranty that such applications will be suitable for thespecified use without further testing or modification.
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) may cause permanent damage tothe device. Limiting values are stress ratings only andoperation of the device at these or any other conditions

2004 Feb 166

NXP Semiconductors

Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.

Contact information
For additional information please visit: http://www.nxp.com
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All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any licenseunder patent- or other industrial or intellectual property rights.
Printed in The Netherlands

R75/04/pp7

Date of release: 2004 Feb 16

Document order number: 9397 750 12409