PART NUMBER:± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

KX132-1211
Rev. 4.0
24-Nov-2021

Product Description
The KX132-1211 is a tri-axis ±2g, ±4g, ±8g, or ±16g silicon micromachined
accelerometer featuring a user-configurable 3-stage Advanced Data Path (ADP)
consisting of a low-pass filter, low-pass/high-pass filter, and RMS calculationengine. The KX132-1211 accelerometer also features an advanced Wake-Up andBack-to-Sleep detection with a high-resolution threshold capability configurable
down to 3.9 mg, 512-byte buffer that continues to record data even when being
read, as well as embedded engines for orientation, Directional-TapTM/DoubleTapTM, and Free fall detection. The sense element is fabricated using Kionix’s
proprietary plasma micromachining process technology. Acceleration sensing isbased on the principle of a differential capacitance arising from accelerationinduced motion of the sense element, which further utilizes common mode
cancellation to decrease errors from process variation, temperature, and environmental stress. The sense element ishermetically sealed at the wafer level by bonding a second silicon lid wafer to the device wafer. A separate ASIC device
packaged with the sense element provides signal conditioning and intelligent user-programmable application algorithms.
The KX132-1211 accelerometers offer lower noise and improved linearity over of the entire temperature range. The
accelerometer is delivered in a 2 x 2 x 0.9 mm LGA 12-pin plastic package operating from a 1.7V – 3.6V (VDD) / 1.2V
– 3.6V (IO_VDD) DC supplies. Internal voltage regulators are used to maintain constant internal operating voltages over
the range of input supply voltages. This results in stable operating characteristics even if the supply voltage changes.
I²C or SPI digital protocol is supported to configure the chip, read acceleration outputs, and check for updates to theorientation, Directional-TapTM/Double-TapTM detection, Free fall detection, and activity monitoring algorithms. Twoconfigurable interrupt pins are also available to show the output of the embedded detection algorithms.

Features• Operating temperature range from -40ºC to +105ºC• Small footprint: 2 x 2 x 0.9 mm LGA 12-pin package• User-configurable g-range up to ±16g and Output Data Rateup to 25600Hz• A user-configurable 3-stage Advanced Data Path (ADP)
consisting of a low-pass filter, low-pass/high-pass filter, andRMS calculation engine.
• High resolution Wake-Up / Back-to-Sleep functions withthreshold configurable down to 3.9 mg• User accessible manufacturer and part ID registers• Self-test Function

36 Thornwood Dr. – Ithaca, NY 14850
tel: 607-257-1080 – fax:607-257-1146
www.kionix.com - info@kionix.com• Integrated Free fall, Directional-TapTM / Double-TapTM, andDevice-orientation algorithms• Improved ODR accuracy in Low Power mode overtemperature• Embedded 512-byte FIFO buffer continues to record data
even when being read
• User-selectable Low Power or High-Performance modes• Internal voltage regulator• Digital I2C up to 3.4MHz and Digital SPI up to 10MHz• Excellent temperature performance with high shock
survivability• RoHS / REACH compliant© 2021 Kionix – All Rights Reserved
911-13564-2011301504-0.18
Page 1 of 31

PART NUMBER:± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

KX132-1211
Rev. 4.0
24-Nov-2021

Table of Contents
PRODUCT DESCRIPTION ................................................................................................................................................................... 1
FEATURES ......................................................................................................................................................................................... 1
TABLE OF CONTENTS ........................................................................................................................................................................ 2
FUNCTIONAL DIAGRAM .................................................................................................................................................................... 4
PRODUCT SPECIFICATIONS ............................................................................................................................................................... 5
MECHANICAL ............................................................................................................................................................................................. 5
ELECTRICAL ............................................................................................................................................................................................... 6
Start Up Time Profile ......................................................................................................................................................................... 7
Current Profile ................................................................................................................................................................................... 7
Power-On Procedure ......................................................................................................................................................................... 8
ENVIRONMENTAL ....................................................................................................................................................................................... 9
Handling, Mounting, Soldering ......................................................................................................................................................... 9
Floor Life ............................................................................................................................................................................................ 9
TERMINOLOGY ......................................................................................................................................................................................... 10
g ...................................................................................................................................................................................................... 10
Sensitivity ........................................................................................................................................................................................ 10
Zero-g offset .................................................................................................................................................................................... 10
Self-test ........................................................................................................................................................................................... 10
FUNCTIONALITY ........................................................................................................................................................................................ 11
Sense element ................................................................................................................................................................................. 11
ASIC interface .................................................................................................................................................................................. 11
Factory calibration .......................................................................................................................................................................... 11
APPLICATION SCHEMATIC .......................................................................................................................................................................... 12
PIN DESCRIPTION ..................................................................................................................................................................................... 12
PACKAGE DIMENSIONS AND ORIENTATION .................................................................................................................................................... 13
Dimensions ...................................................................................................................................................................................... 13
Orientation ...................................................................................................................................................................................... 14
DIGITAL INTERFACE ........................................................................................................................................................................ 17
I2C SERIAL INTERFACE................................................................................................................................................................................ 17
I2C Operation ................................................................................................................................................................................... 18
Writing to an 8-bit Register ............................................................................................................................................................. 20
Reading from an 8-bit Register ....................................................................................................................................................... 20
Data Transfer Sequences ................................................................................................................................................................. 21
HS-mode .......................................................................................................................................................................................... 22
I2C Timing Diagram ......................................................................................................................................................................... 23
SPI COMMUNICATIONS ............................................................................................................................................................................. 24
4-Wire SPI Interface......................................................................................................................................................................... 24
4-Wire SPI Timing Diagram ............................................................................................................................................................. 25
4-Wire Read and Write Registers .................................................................................................................................................... 26
3-Wire SPI Interface......................................................................................................................................................................... 27
3-Wire SPI Timing Diagram ............................................................................................................................................................. 28
3-Wire Read and Write Registers .................................................................................................................................................... 29
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Page 2 of 31

PART NUMBER:± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

KX132-1211
Rev. 4.0
24-Nov-2021

REVISION HISTORY ......................................................................................................................................................................... 30
APPENDIX ....................................................................................................................................................................................... 31

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Page 3 of 31

PART NUMBER:
KX132-1211± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

Rev. 4.0
24-Nov-2021

Functional Diagram

X
Accel
DSP and
Buffers

Y
Accel

ChargeAmplifier

ADC

Z
Accel
Digital Interface

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SCLK/SCL

nCS

INT2

INT1

TRIG

SDI/SDASDO/ADDR

IO_VDD

GND

VDD

Power and
References© 2021 Kionix – All Rights Reserved
911-13564-2011301504-0.18
Page 4 of 31

PART NUMBER:
KX132-1211± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

Rev. 4.0
24-Nov-2021

Product Specifications
Mechanical(specifications are for operation at 2.5V and T = 25C unless stated otherwise)
Parameters
Operating Temperature Range

Units

Min

Typical

Max

ºC

-40

-

+105
±90

Zero-g Offset

mg

±25

Zero-g Offset Variation from RT over Temp.

mg/ºC

0.25

GSEL1=0, GSEL0=0 (±2g)
Sensitivity1 (16 bit)

GSEL1=0, GSEL0=1 (±4g)
GSEL1=1, GSEL0=0 (±8g)

counts/g

GSEL1=1, GSEL0=1 (±16g)

15401

16384

17367

7700

8192

8684

3850

4096

4342

1925

2048

2171

GSEL1=0, GSEL0=0 (±2g)
Sensitivity(Buffer 8-bit mode)1,2

GSEL1=0, GSEL0=1 (±4g)
GSEL1=1, GSEL0=0 (±8g)

6432counts/g

16

GSEL1=1, GSEL0=1 (±16g)

80.01 (xy)0.03 (z)Sensitivity Variation from RT over Temperature%/ºC

Positive Self-Test Output change on Activationg

Mechanical Signal Bandwidth (-3dB)3Hz4200 (xy)2900 (z)% of FS

0.5

Non-Linearity
Cross Axis Sensitivity
RMS

Noise4

Density0.25 (xy)0.2 (z)

0.5

%

2

mg

0.7

µg/√Hz130

0.75

Table 1: Mechanical Specifications
Notes:
1.
2.
3.
4.

Resolution and acceleration ranges are user selectable via I2C or SPI. Tolerance specified at ±1g
stimulus.
Sensitivity is proportional to BRES in BUF_CNTL2.
Signal bandwidth varies with Output Data Rate (ODR), and Low Pass Filter setting.
Measured with ODR = 25600Hz, LPRO = 1 settings.
Noise varies with ODR, power mode, and the Average Filter Control (AVC) settings.
Measured with RES = 1, ODR = 50Hz, LPRO = 1, GSEL = 0 settings.

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Page 5 of 31

PART NUMBER:
KX132-1211± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

Rev. 4.0
24-Nov-2021

Electrical(specifications are for operation at 2.5V and T = 25C unless stated otherwise)
Parameters
Supply Voltage (VDD) Operating
I/O Pads Supply
Voltage (IO_VDD)

SPI, I2C (Fast/Standard mode)I2C (High Speed mode)
Operating (High Performance with Wake-up
Detection) ODR=400Hz
Current Consumption Operating (Low power with Wake-up detection)(Accelerometer Only) ODR=0.781Hz1
Operating (Low Power with Wake-up detection
plus Advanced Data Path) ODR=0.781Hz7
Standby Current Consumption

Units

Min

Typical

Max

V

1.7

2.5

3.6

V

1.2

3.6

1.7

3.6
148
0.53

µA

0.67
µA

0.5

(IO_VDD < 2V)

V

-

-

0.2 * IO_VDD(IO_VDD ≥ 2V)

V

-

-

0.4

Output High Voltage (VOH)V

0.8 * IO_VDD--

Input Low Voltage (VIL)

V

-

-

0.2 * IO_VDD

Input High Voltage (VIH)V

0.8 * IO_VDD--Start Up Time3

ms

2

Output Low Voltage(VOL) 2

Power Up Time4

ms

SPI Communication RateMHz

I2C Communication Rate

MHz

1300
20

10
0.4

I2C Slave Address (7-bit)

0x1E / 0x1F

WHO_AM_I register value

0x3D

Output Data Rate (ODR)5
Output Signal Bandwidth (-3dB)6

Hz
Hz

50

0.781

50

3.4

25600

ODR/9 or
ODR/2

Table 2: Electrical Specifications
Notes:
1. Current varies with Output Data Rate (ODR) as shown in Figure 2, types and number of enabled digital engines, the averagefilter control settings, and VDD. Measured with OWUF<2:0> = 0, OSA<3:0> = 0, AVC<2:0> = 1, LPSTPSEL = 1.
2. For I2C communication, this assumes a minimum 1.5kΩ pull-up resistor on SCL and SDA pins.
3. Start up time is from PC1 set to valid outputs. Time varies with ODR, Power Mode, and FSTUP bit setting (see Figure 1).
4. Power up time is from VDD valid to device boot completion.
5. Typical values. ODR is user-selectable via I2C or SPI. See ODCNTL register for details.
6. Refers to accelerometer’s raw output data. Additional bandwidth control is available using the Advanced Data Path (ADP)
engine.
7. Measured with RMS_AVC<2:0> = 1, OADP<3:0> = 0, LPSTPSEL = 0.

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PART NUMBER:± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

KX132-1211
Rev. 4.0
24-Nov-2021

Start Up Time Profile

Figure 1: Start Up Time Diagram

Current Profile

Figure 2: Current as a function of Output Data Rate (ODR) and Power Mode Settings
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PART NUMBER:± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

KX132-1211
Rev. 4.0
24-Nov-2021

Power-On Procedure
Proper functioning of power-on reset (POR) is dependent on the specific VDD, VDDLOW, TVDD (rise time), and
TVDD_OFF profile of individual applications. It is recommended to minimize VDDLOW, and TVDD, and maximize TVDD_OFF.
It is also advised that the VDD ramp up time TVDD be monotonic. Note that the outputs will not be stable until VDD
has reached its final value.
To assure proper POR, the application should be evaluated over the customer specified range of VDD, VDD LOW,
TVDD, TVDD_OFF and temperature as POR performance can vary depending on these parameters.
Please refer to Technical Note TN027 Power-On Procedure for more information.

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Page 8 of 31

PART NUMBER:± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

KX132-1211
Rev. 4.0
24-Nov-2021

Environmental
Units

Min

TypicalMax

Supply Voltage (VDD) Absolute Limits

Parameters

V

-0.3

-

3.60

Operating Temperature Range

ºC

-40

-

+105

Storage Temperature Range

ºC

-55

-

+150

Mech. Shock (powered and unpowered)

g

-

-

5000 for 0.5ms
10000 for 0.2ms

ESD

V

-

-

2000

HBM

Table 3: Environmental Specifications
Caution: ESD Sensitive and Mechanical Shock Sensitive Component, improper handling can cause
permanent damage to the device.

HF

This product is in conformance with RoHS directive, REACH regulation, andis Halogen-Free. For the current certificate of compliance, visit
www.kionix.com website.

Handling, Mounting, Soldering
For package handling, mounting, and soldering guidelines, see TN007 Package Handling, Mounting, andSoldering Guidelines technical note.

Floor Life
Factory floor life exposure of the KX132-1211 reels removed from the moisture barrier bag should not exceed amaximum of 168 hours at 30C/60%RH. If this floor life is exceeded, the parts should be dried per the IPC/JEDEC
J-STD-033D standard (or latest revision).

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Page 9 of 31

PART NUMBER:± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

KX132-1211
Rev. 4.0
24-Nov-2021

TerminologygA unit of acceleration equal to the acceleration of gravity at the earth's surface.
1 g = 9 .8ms2

One thousandth of a g (0.0098 m/ s2) is referred to as 1 milli-g (1 mg).

Sensitivity
The sensitivity of an accelerometer is the change in output per unit of input acceleration at nominal VDD andtemperature. The term is essentially the gain of the sensor expressed in counts per g (counts/g) or LSB’s per g(LSB/g). Occasionally, sensitivity is expressed as a resolution, i.e. milli-g per LSB (mg/LSB) or milli-g per count(mg/count). Sensitivity for a given axis is determined by measurements of the formula:Sensitivity =( Output@ + 1 g − Output@ − 1g )2g

The sensitivity tolerance describes the range of sensitivities that can be expected from a large population of sensors
at room temperature and over life. When the temperature deviates from room temperature (25ºC), the sensitivity
will vary by the amount shown in Table 1.

Zero-g offset
Zero-g offset or 0-g offset describes the actual output of the accelerometer when no acceleration is applied. Ideally,
the output would always be in the middle of the dynamic range of the sensor (content of the OUTX, OUTY, OUTZ
registers = 00, expressed as a 2’s complement number). However, because of mismatches in the sensor, calibration
errors, and mechanical stress, the output can deviate from 00. This deviation from the ideal value is called 0-g offset.
The zero-g offset tolerance describes the range of 0-g offsets of a population of sensors over the operating
temperature range.

Self-test
Self-test allows a functional test of the sensor without applying a physical acceleration to it. When activated, anelectrostatic force is applied to the sensor, simulating an input acceleration. The sensor outputs respond accordingly.
If the output signals change within the amplitude specified in Table 1, then the sensor is working properly and theparameters of the interface chip are within the defined specifications.

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Page 10 of 31

PART NUMBER:± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

KX132-1211
Rev. 4.0
24-Nov-2021

Functionality
Sense element
The sense element is fabricated using Kionix’s proprietary plasma micromachining process technology. This
process technology allows Kionix to create mechanical silicon structures, which are essentially mass-spring
systems that move in the direction of the applied acceleration. Acceleration sensing is based on the principle of adifferential capacitance arising from the acceleration-induced motion. Capacitive plates on the moving mass move
relative to fixed capacitive plates anchored to the substrate. The sense element is hermetically sealed at the wafer
level by bonding a second silicon lid wafer to the device using a glass frit.

ASIC interface
A separate ASIC device packaged with the sense element provides all of the signal conditioning and communication
with the sensor. The complete measurement chain is composed by a low-noise capacitance to voltage amplifier,which converts the differential capacitance of the MEMS sensor into an analog voltage that is sent through ananalog-to-digital converter. The acceleration data may be accessed through the I 2C or SPI digital communications
provided by the ASIC. In addition, the ASIC contains all of the logic to allow the user to choose data rates, g-ranges,
filter settings, and interrupt logic.

Factory calibration
Kionix trims the offset and sensitivity of each accelerometer by adjusting gain (sensitivity) and 0-g offset trim codes
stored in nonvolatile memory (OTP). Additionally, all functional register default values are also programmed into the
nonvolatile memory. Every time the device is turned on or a software reset command is issued, the trimming
parameters and default register values are downloaded into the volatile registers to be used during active operation.
This allows the device to function without further calibration.

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Page 11 of 31

PART NUMBER:± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

KX132-1211
Rev. 4.0
24-Nov-2021

Application Schematic

Pin Description
Description

Pin

Name

1

SDO/ADDR

2

SDI/SDA

3

IO_VDD

4

TRIG

5

INT1

6

INT2

7

VDD

Serial Data Out pin during 4-wire SPI communication and part of the device address during I2C communication. Do not leave
floating.
SPI Data input / I2C Serial Data
The power supply input for the digital communication bus. Optionally decouple this pin to ground with a 0.1uF ceramic
capacitor.
Trigger pin for FIFO buffer control. Connect to GND when not using external trigger option.
Physical Interrupt 1 (Push-Pull). The pin is in High-Z state during POR and is driven LOW following POR. Leave floating if not
used.
Physical Interrupt 2 (Push-Pull). The pin is in High-Z state during POR and is driven LOW following POR. Leave floating if not
used.
The power supply input. Decouple this pin to ground with a 0.1uF ceramic capacitor.

8

GND

Ground9

GND

Ground10nCS

Chip Select (active LOW) for SPI communication. Connect to IO_VDD for I2C communication. Do not leave floating.

11

NC

Not Internally Connected. Can be connected to VDD, IO_VDD, GND or leave floating.

12

SCLK/SCLSPI and I2C Serial Clock

Table 4: Pin Description

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Page 12 of 31

PART NUMBER:± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

KX132-1211
Rev. 4.0
24-Nov-2021

Package Dimensions and Orientation
Dimensions
2 x 2 x 0.9 mm LGA 12-pin

All dimensions and tolerances conform to ASME Y14.5M-1994

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Page 13 of 31

PART NUMBER:
KX132-1211± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

Rev. 4.0
24-Nov-2021

Orientation

When device is accelerated in +X, +Y or +Z direction, the corresponding output will increase.

Static X/Y/Z Output Response versus Orientation to Earth’s surface (1g):
GSEL1=0, GSEL0=0 (±2g)
Position

1

2

3

4

Diagram

5
Top

6
Bottom

BottomTop

Resolution(bits)X (counts)

16

8

16

8

16

8

16

8

16

8

16

8

+16384Y (counts)
Z (counts)

0
0

+64
0
0

0
-1638400-640-16384
0
0

-64
0
0

0
+16384
0

0
+64
0

0
0
+16384

0
0
+64

0
0
-163840
0-64

X-Polarity
Y-Polarity
Z-Polarity

+
0
0

0
0

0
0

0
+
0

0
0
+

0
0
-

(1g)
Earth’s Surface

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PART NUMBER:
KX132-1211± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

Rev. 4.0
24-Nov-2021

Static X/Y/Z Output Response versus Orientation to Earth’s surface (1g):
GSEL1=0, GSEL0=1 (±4g)
Position

1

2

3

4

Diagram

5
Top

6
Bottom

BottomTop

Resolution(bits)X (counts)

16

8

16

8

16

8

16

8

16

8

16

8

+8192

Y (counts)
Z (counts)

0
0

+32
0
0

0
-8192
0

0
-32
0

-8192
0
0

-32
0
0

0
+8192
0

0
+32
0

0
0
+8192

0
0
+32

0
0
-8192

0
0
-32

+
0
0

X-Polarity
Y-Polarity
Z-Polarity

0
0

0
0

0
+
0

0
0
+

0
0
-

(1g)
Earth’s Surface
Static X/Y/Z Output Response versus Orientation to Earth’s surface (1g):
GSEL1=1, GSEL0=0 (±8g)
Position

1

2

3

4

Diagram

5
Top

6
Bottom

BottomTop

Resolution(bits)X (counts)

16

8

16

8

16

8

16

8

16

8

16

8

+4096

Y (counts)
Z (counts)

0
0

+16
0
0

0
-4096
0

0
-16
0

-4096
0
0

-16
0
0

0
+4096
0

0
+16
0

0
0
+4096

0
0
+16

0
0
-4096

0
0
-16

X-Polarity
Y-Polarity
Z-Polarity

+
0
0

0
0

0
0

0
+
0

0
0
+

0
0
-

(1g)
Earth’s Surface

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PART NUMBER:
KX132-1211± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

Rev. 4.0
24-Nov-2021

Static X/Y/Z Output Response versus Orientation to Earth’s surface (1g):
GSEL1=1, GSEL0=1 (±16g)
Position

1

2

3

4

5
Top

6
Bottom

BottomTop

DiagramResolution(bits)X (counts)

16

8

16

8

16

8

16

8

16

8

16

8

+2048

Y (counts)
Z (counts)

0
0

+8
0
0

0
-2048
0

0
-8
0

-2048
0
0

-8
0
0

0
+2048
0

0
+8
0

0
0
+2048

0
0
+8

0
0
-2048

0
0
-8

X-Polarity
Y-Polarity
Z-Polarity

+
0
0

0
0

0
0

0
+
0

0
0
+

0
0
-

(1g)
Earth’s Surface

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Page 16 of 31

PART NUMBER:± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

KX132-1211
Rev. 4.0
24-Nov-2021

Digital Interface
The Kionix KX132-1211 digital accelerometer can communicate via the I2C and SPI digital serial interface protocols. This
allows for easy system integration by eliminating analog-to-digital converter requirements and by providing directcommunication with system micro-controllers. Note that if the KX132-1211 is accessed with incomplete I2C protocol suchas communication without the Stop Condition before SPI communication, it would cause a miss-behavior. For more detail
information, please refer the “KX132-1211-Technical-Reference-Manual”.
The serial interface terms and descriptions as indicated in Table 5 below will be observed throughout this document.
TermTransmitter
Receiver
MasterSlave

Description
The device that transmits data to the bus.
The device that receives data from the bus.
The device that initiates a transfer, generates clock signals, and terminates a transfer.
The device addressed by the Master.
Table 5: Serial Interface Terminologies

I2C Serial Interface
As previously mentioned, the KX132-1211 can communicate on an I2C bus. I2C is primarily used for synchronous serial
communication between a Master device and one or more Slave devices. The Master, typically a micro controller, provides
the serial clock signal and addresses Slave devices on the bus. The KX132-1211 always operates as a Slave device during
standard Master-Slave I2C operation.
I2C is a two-wire serial interface that contains a Serial Clock (SCL) line and a Serial Data (SDA) line. SCL is a serial clockthat is provided by the Master. SDA is a bi-directional line used to transmit and receive data to and from the interface. Datais transmitted MSB (Most Significant Bit) first in 8-bit per byte format, and the number of bytes transmitted per transfer isunlimited. The I2C bus is considered free when both lines are HIGH.
The I2C interface is compliant with high-speed mode, fast mode and standard mode I2C protocols.

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PART NUMBER:
KX132-1211± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

Rev. 4.0
24-Nov-2021

I2C Operation
Transactions on the I2C bus begin after the Master transmits a start condition (S), which is defined as a HIGH-to-LOWtransition on the data line while the SCL line is held HIGH. The bus is considered busy after this condition. The next byte ofdata transmitted after the start condition contains the Slave Address (SAD) in the seven MSBs (Most Significant Bits), andthe LSB (Least Significant Bit) tells whether the Master will be receiving data ‘1’ from the Slave or transmitting data ‘0’ to
the Slave. When a Slave Address is sent, each device on the bus compares the seven MSBs with its internally stored
address. If they match, the device considers itself addressed by the Master. The KX132-1211 Slave Address is comprisedof a user programmable part, a factory programmable part, and a fixed part, which allows for connection of multiple
accelerometers to the same I2C bus. The Slave Address associated with the KX132-1211 is 00111YX, where the user
programmable bit X, is determined by the assignment of ADDR (pin 1) to GND or IO_VDD. Also, the factory programmable
bit Y is set at the factory. For KX132-1211, the factory programmable bit Y is fixed to 1 (contact your Kionix sales
representative for list of available devices). Table 6 lists possible I2C addresses for KX132-1211. As a result, up to four
accelerometers can be implemented on a shared I 2C bus as shown in Figure 3 (e.g. two KX132-1211 accelerometers andtwo other accelerometers with factory programmable bit Y set to 0).

Description
I2C WrI2C RdI2C WrI2C Rd

ADDR
pin
GND
GND
IO_VDD
IO_VDD

7-bit
Address
0x1E
0x1E
0x1F
0x1F

Y

X

Address

<7>

<6>

<5>

<4>

<3>

<2>

<1>

<0>

0x3C
0x3D
0x3E
0x3F

0
0
0
0

0
0
0
0

1
1
1
1

1
1
1
1

1
1
1
1

1
1
1
1

0
0
1
1

0
1
0
1

Table 6: I2C Slave Addresses for KX132-1211
It is mandatory that receiving devices acknowledge (ACK) each transaction. Therefore, the transmitter must release the
SDA line during this ACK pulse. The receiver then pulls the data line LOW so that it remains stable LOW during the HIGH
period of the ACK clock pulse. A receiver that has been addressed, whether it is Master or Slave, is obliged to generate an
ACK after each byte of data has been received. To conclude a transaction, the Master must transmit a stop condition (P)by transitioning the SDA line from LOW to HIGH while SCL is HIGH. The I2C bus is now free. Note that if the KX132-1211
is accessed through I2C protocol before the startup is finished a NACK signal is sent.

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PART NUMBER:
KX132-1211± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

Rev. 4.0
24-Nov-2021

I2C Device

Part
Number

ADDR
Pin

Slave
Address

Bit Y (Bit 1 in 7-bit address)

1
2
3
4

KX132-1211
KX132-1211*KXMMM*KXMMMGND
IO_VDDGND
IO_VDD

0x1E
0x1F
0x1C
0x1D

Factory Set to 1
Factory Set to 1
Factory Set to 0
Factory Set to 0

* KXMMM – contact Kionix sales representative for list of compatible devices

Figure 3: Multiple KX132-1211 Accelerometers on a Shared I2C Bus

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PART NUMBER:± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

KX132-1211
Rev. 4.0
24-Nov-2021

Writing to an 8-bit Register
Upon power up, the Master must write to the KX132’s control registers to set its operational mode. Therefore, when writing
to a control register on the I 2C bus, as shown Sequence 1 on the following page, the following protocol must be observed:
After a start condition, SAD+W transmission, and the KX132-1211 ACK has been returned, an 8-bit Register Address (RA)command is transmitted by the Master. This command is telling the KX132-1211 to which 8-bit register the Master will be
writing the data. Since this is I2C mode, the LSB of the RA command should always be zero (0). The KX132-1211
acknowledges the RA and the Master transmits the data to be stored in the 8-bit register. The KX132-1211 acknowledges
that it has received the data and the Master transmits a stop condition (P) to end the data transfer. The data sent to theKX132-1211 is now stored in the appropriate register. The KX132-1211 automatically increments the received RA
commands and, therefore, multiple bytes of data can be written to sequential registers after each Slave ACK as shown inSequence 2 on the following page.
Note** If a STOP condition is sent on the least significant bit of write data or the following master acknowledge cycle, thelast write operation is not guaranteed and it may alter the content of the affected registers

Reading from an 8-bit Register
When reading data from a KX132-1211 8-bit register on the I2C bus, as shown in Sequence 3 on the next page, the following
protocol must be observed: The Master first transmits a start condition (S) and the appropriate Slave Address (SAD) with
the LSB set at ‘0’ to write. The KX132-1211 acknowledges and the Master transmits the 8-bit RA of the register it wants toread. The KX132-1211 again acknowledges, and the Master transmits a repeated start condition (Sr). After the repeatedstart condition, the Master addresses the KX132-1211 with a ‘1’ in the LSB (SAD+R) to read from the previously selected
register. The Slave then acknowledges and transmits the data from the requested register. The Master does not
acknowledge (NACK) it received the transmitted data, but transmits a stop condition to end the data transfer. Note that the
KX132-1211 automatically increments through its sequential registers, allowing data to be read from multiple registers
following a single SAD+R command as shown below in Sequence 4 on the following page. Reading data from a buffer readregister is a special case because if register address (RA) is set to buffer read register (BUF_READ) in Sequence 4, theregister auto-increment feature is automatically disabled. Instead, the Read Pointer will increment to the next data in thebuffer, thus allowing reading multiple bytes of data from the buffer using a single SAD+R command.
Note** Accelerometer’s output data should be read in a single transaction using the auto-increment feature to prevent output
data from being updated prior to intended completion of the read transaction.

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PART NUMBER:
KX132-1211± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

Rev. 4.0
24-Nov-2021

Data Transfer Sequences
The following information illustrates the variety of data transfers that can occur on the I 2C bus and how the Master and Slave
interact during these transfers. Table 7 defines the I2C terms used during the data transfers.
Term
S
Sr
SAD
W
R
ACK
NACK
RA
Data
P

Definition
Start Condition
Repeated Start Condition
Slave Address
Write Bit
Read Bit
Acknowledge
Not Acknowledge
Register Address
Transmitted/Received Data
Stop Condition
Table 7: I2C Terms

Sequence 1: The Master is writing one byte to the Slave
MasterSlave

S

SAD + W

RA
ACK

DATA
ACK

P
ACK

Sequence 2: The Master is writing multiple bytes to the Slave
MasterSlave

S

SAD + W

RA
ACK

DATA
ACK

DATA
ACK

P
ACK

Sequence 3: The Master is receiving one byte of data from the Slave
MasterSlave

S

SAD + W

RA
ACK

Sr

SAD + R

ACK

NACK
ACK

P

DATA

Sequence 4: The Master is receiving multiple bytes of data from the Slave
MasterSlave

S

SAD + W

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RA
ACK

Sr
ACK

SAD + R

ACK
ACK

DATA

NACK
DATA

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Page 21 of 31

PPART NUMBER:
KX132-1211± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

Rev. 4.0
24-Nov-2021

HS-modeTo enter the 3.4MHz high speed mode of communication, the device must receive the following sequence of conditions
from the master: a Start condition followed by a Master code (00001XXX) and a Master Non-acknowledge. Once recognized,
the device switches to HS-mode communication. Read/write data transfers then proceed as described in the sequences
above. Devices return to the FS-mode after a STOP occurrence on the bus.
Sequence 5: HS-mode data transfer of the Master writing multiple bytes to the Slave
Speed
MasterSlaveS

FS-modeM-code NACKSr

SAD + W
ACK

HS-modeRA
ACK

FS-mode
DATA

P
ACK

n bytes + ack.
Sequence 6: HS-mode data transfer of the Master receiving multiple bytes of data from the Slave
Speed
MasterSlave
Speed
MasterSlaveS

FS-modeM-code NACK

Sr

HS-modeSAD + W
ACK

RA
ACK
FS-modeHS-modeSr

SAD + R

NACK
ACK

DATA

ACK

P

DATA

(n-1) bytes + ack.

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PART NUMBER:
KX132-1211± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

Rev. 4.0
24-Nov-2021

I2C Timing Diagram
t
t0

t2

t1

t3

t4

t6

t5

t7

SCL
bit7
5

SDA

bit6
5

S

bit0

addr_ack

b7

bit7
5
Sr

t8

Number
t0
t1
t2
t3
t4
t5
t6
t7
t8
t9
t10
t11
Note

t9

bit0
5

addr_nackt11
t10

Description
SDA LOW to SCL LOW transition (Start event)SDA LOW to first SCL rising edge
SCL pulse width: HIGH
SCL pulse width: LOW
SCL HIGH before SDA falling edge (Start Repeated)
SCL pulse width: HIGH during a S/Sr/P event
SCL HIGH before SDA rising edge (Stop)
SDA pulse width: HIGH
SDA valid to SCL rising edge
SCL rising edge to SDA invalid
SCL falling edge to SDA valid (when slave is transmitting)
SCL falling edge to SDA invalid (when slave is transmitting)
Recommended I2C CLK
Table 8: I2C Timing (Fast Mode)

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P

MIN
50
100
100
100
50
100
50
25
50
50
0
2.5

MAX
100
-

Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
µs

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Page 23 of 31

PART NUMBER:± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

KX132-1211
Rev. 4.0
24-Nov-2021

SPI Communications
4-Wire SPI Interface
The KX132-1211 also utilizes an integrated 4-Wire Serial Peripheral Interface (SPI) for digital communication. The SPI
interface is primarily used for synchronous serial communication between one Master device and one or more Slave devices.
The Master, typically a micro controller, provides the SPI clock signal (SCLK) and determines the state of Chip Select (nCS).
The KX132-1211 always operates as a Slave device during standard Master-Slave SPI operation.
4-wire SPI is a synchronous serial interface that uses two control and two data lines. With respect to the Master, the Serial
Clock output (SCLK), the Data Output (SDI or MOSI) and the Data Input (SDO or MISO) are shared among the Slave
devices. The Master generates an independent Chip Select (nCS) for each Slave device that goes LOW at the start oftransmission and goes back HIGH at the end. The Slave Data Output (SDO) line, remains in a high-impedance (hi-z) state
when the device is not selected, so it does not interfere with any active devices. This allows multiple Slave devices to sharea master SPI port as shown in Figure 4 below.
NOTE: if the MOSI line has the code 0x3C, 0x3D, 0x3D or 0x3F, it might cause a misbehavior in the KX132-1211.
Please toggle nCS of the KX132-1211 L/H to recover the misbehavior condition.

Figure 4. 4-wire SPI Connections

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PART NUMBER:
KX132-1211± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

Rev. 4.0
24-Nov-2021

4-Wire SPI Timing Diagram
t3

t

nCS
SCLK

t1

t2

t4

t8
８

SDI

bit 7

bit 6

bit 1
5

bit 0

SDO

bit 7
5

t5
t6

Number
t1
t2
t3
t4
t5
t6
t7
t8

bit 7
5

bit 6

bit 1
5

bit 6

bit 0

bit 1
5

bit 0

t7

Description
CLK pulse width: HIGH
CLK pulse width: LOW
nCS LOW to first CLK rising edgenCS LOW after the final CLK rising edge to nCS HIGHSDI valid to CLK rising edge
CLK rising edge to SDI invalid
CLK falling edge to SDO validnCS LOW to first CLK falling edge
Table 9: 4-Wire SPI Timing

MIN
45
45
20
20
10
10

MAX

35
10

Units
ns
ns
ns
ns
ns
ns
ns
ns

Notes
1. t7 is only present during reads.
2. Timings are for VDD of 1.8V to 3.6V with 1k pull-up resistor and maximum 20pF load capacitor on SDO.

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PART NUMBER:
KX132-1211± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

Rev. 4.0
24-Nov-2021

4-Wire Read and Write Registers
The registers embedded in the KX132-1211 accelerometer have 8-bit addresses. Upon power up, the Master must write to
the accelerometer’s control registers to set its operational mode. On the falling edge of nCS, a 2-byte command is written
to the appropriate control register. The first byte initiates the write to the appropriate register, and is followed by the userdefined, data byte. The MSB (Most Significant Bit) of the register address byte will indicate “0” when writing to the registerand “1” when reading from the register. This operation occurs over 16 clock cycles. All commands are sent MSB first. The
host must return nCS HIGH for at least one clock cycle before the next data request. However, when data is being
read from a buffer read register (BUF_READ), the nCS signal can remain LOW until the buffer is read. Figure 5 below
shows the timing diagram for carrying out an 8-bit register write operation.
Write AddressFirst 8 bits

Second 8 bits

Last 8 bits

SCLK
A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5SDI
SDO HI-Z

D2

D1

D0

HI-Z

CS

Figure 5: Timing Diagram for 8-Bit Register Write Operation

In order to read an 8-bit register, an 8-bit register address must be written to the accelerometer to initiate the read. The MSBof this register address byte will indicate “0” when writing to the register and “1” when reading from the register. Upon
receiving the address, the accelerometer returns the 8-bit data stored in the addressed register. This operation also occurs
over 16 clock cycles. All returned data is sent MSB first, and the host must return nCS HIGH for at least one clock cycle
before the next data request. Figure 6 shows the timing diagram for an 8-bit register read operation.

Read AddressFirst 8 bits

Second 8 bits

Last 8 bits

SCLK
A7 A6 A5 A4 A3 A2 A1 A0
SDI
HI-Z
D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5
D3 D2 D1 D0 HI-Z
SDO
CS
Figure 6: Timing Diagram for 8-Bit Register Read Operation

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PART NUMBER:± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

KX132-1211
Rev. 4.0
24-Nov-2021

3-Wire SPI Interface
The KX132-1211 also utilizes an integrated 3-Wire Serial Peripheral Interface (SPI) for digital communication. 3-wire SPI
is a synchronous serial interface that uses two control lines and one data line. With respect to the Master, the Serial Clockoutput (SCLK), the Data Output/Input (SDI) are shared among the Slave devices. The Master generates an independent
Chip Select (nCS) for each Slave device that goes LOW at the start of transmission and goes back HIGH at the end. This
allows multiple Slave devices to share a master SPI port as shown in Figure 7 below.
NOTE: if the MOSI line has the code 0x3C, 0x3D, 0x3D or 0x3F, it might cause a misbehavior in the KX132-1211.
Please toggle nCS of the KX132-1211 L/H to recover the misbehavior condition.

Figure 7: KX132-1211 3-wire SPI Connections

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PART NUMBER:± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

KX132-1211
Rev. 4.0
24-Nov-2021

3-Wire SPI Timing Diagram
t3

nCS
SCLK

t1

t2

t4

t9
８

SDI

bit 7

t5

bit 6

bit 1
5

bit 0

bit 7

t7

t6

Number
t1
t2
t3
t4
t5
t6
t7
t8
t9

Description
CLK pulse width: HIGH
CLK pulse width: LOW
nCS LOW to first CLK rising edgenCS LOW after the final CLK falling edge to nCS HIGHSDI valid to CLK rising edge
CLK rising edge to SDI input invalid
CLK extra clock cycle rising edge to SDI output becomesvalid falling edge to SDI output becomes valid
CLK
nCS LOW to first CLK falling edge
Table 10: 3-Wire SPI Timing

bit 1
5

bit 0

MIN
45
45
20
20
10
10
10

MAX
35

t8

Units
ns
ns
ns
ns
ns
ns
ns
ns
ns

Notes
1. t7 and t8 are only present during reads
2. Timings are for VDD of 1.8V to 3.6V with 1k pull-up resistor and maximum 20pF load
capacitor on SDI.
3. The SDO/ADDR pin is configured in a high-impedance input-state, and must be externallytied to GND or IO_VDD

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PART NUMBER:± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

KX132-1211
Rev. 4.0
24-Nov-2021

3-Wire Read and Write Registers
The registers embedded in the KX132-1211 accelerometer have 8-bit addresses. Upon power up, the Master must write to
the accelerometer’s control registers to set its operational mode. On the falling edge of nCS, a 2-byte command is written
to the appropriate control register. The first byte initiates the write to the appropriate register, and is followed by the userdefined, data byte. The MSB (Most Significant Bit) of the register address byte will indicate “0” when writing to the registerand “1” when reading from the register. A read operation and a write operation occurs over 16 clock cycles. All commands
are sent MSB first. The host must return nCS HIGH for at least one clock cycle before the next data request. However,when data is being read from a buffer read register (BUF_READ), the nCS signal can remain LOW until the buffer is read.
Figure 8 below shows the timing diagram for carrying out an 8-bit register write operation.
NOTE** If a STOP condition is sent on the least significant bit of write data or the following master acknowledge cycle, thelast write operation is not guaranteed and it would cause unexpected register write.

SCLK
SDI

A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0
(MSB)

(MSB)

CS
Figure 8: Timing Diagram for 8-Bit Register Write Operation
In order to read an 8-bit register, an 8-bit register address must be written to the accelerometer to initiate the read. The MSBof this register address byte will indicate “0” when writing to the register and “1” when reading from the register. Upon
receiving the address, the accelerometer returns the 8-bit data stored in the addressed register. All returned data is sent
MSB first, and the host must return nCS HIGH for at least one clock cycle before the next data request. Figure 9 shows thetiming diagram for an 8-bit register read operation.

SCLK
SDI

A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 HI-Z
(MSB)

(MSB)

CS
Figure 9: Timing Diagram for 8-Bit Register Read Operation

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PART NUMBER:± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

KX132-1211
Rev. 4.0
24-Nov-2021

Revision History
Revision
1.0
2.0

3.0

4.0

Description
Production Release.
Added SPI communication maximum rate and I2C communication typical rate inElectrical Specifications table.
Updated Note 1 (Sensitivity) under Mechanical Specifications table to indicate thattolerance specified at ±1g stimulus.
Revised Noise measurement test condition description.
Removed a note under Mechanical Specification table to change the value of STPOL
bit to perform the self-test since the POR value of the bit should be used.
Updated the “Digital Interface” section description to include I2C transaction without
stop condition on a shared bus with another SPI device.
Updated the “4-Wire SPI Timing Diagram” to include SCLK start-H condition.
Added t8 parameter in the “4-Wire SPI Timing” table.
Updated the “Timing Diagram for 8-Bit Register Write Operation” figure to include
SCLK start-H condition.
Updated the “Timing Diagram for 8-Bit Register Read Operation” figure to include
SCLK start-H condition.
Updated the “3-Wire SPI Timing Diagram” timing figure to include start-H condition.
Added t9 parameter in the “3-Wire SPI Timing” table.
Updated description for noise measurement conditions.(GSEL=0)
Removed description of SCL clock stretching in I2C Serial Interface.
Revised t11 description of Table 8 in I2C Timing Diagram.
Revised description and Figure 9 about extra clock in 3-Wire Read and Write
Registers.
Add Note of SPI communication in 3-Wire SPI Interface and 4-Wire SPI Interface.

Date
31-Jul-2019
06-Feb-2020

30-Nov-2020

24-Nov-2021"Kionix" is a registered trademark of Kionix, Inc. Products described herein are protected by patents issued or pending. No license is granted by implication or otherwise under
any patent or other rights of Kionix. The information contained herein is believed to be accurate and reliable but is not guaranteed. Kionix does not assume responsibility for
its use or distribution. Kionix also reserves the right to change product specifications or discontinue this product at any time without prior notice. This publication supersedes
and replaces all information previously supplied.

36 Thornwood Dr. – Ithaca, NY 14850
tel: 607-257-1080 – fax:607-257-1146
www.kionix.com - info@kionix.com© 2021 Kionix – All Rights Reserved
911-13564-2011301504-0.18
Page 30 of 31

PART NUMBER:± 2g / 4g / 8g / 16g Tri-axis Digital
Accelerometer Specifications

KX132-1211
Rev. 4.0
24-Nov-2021

Appendix
The following Notice is included to guide the use of Kionix products in its application and manufacturing processes. Kionix,
Inc., is a ROHM Group company. For purposes of this Notice, the name “ROHM” would also imply Kionix, Inc.

36 Thornwood Dr. – Ithaca, NY 14850
tel: 607-257-1080 – fax:607-257-1146
www.kionix.com - info@kionix.com© 2021 Kionix – All Rights Reserved
911-13564-2011301504-0.18
Page 31 of 31

Notice
Precaution on using ROHM Products
1.

Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ

2.

ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, whicha failure or malfunction of our Products may cause. The following are examples of safety measures:[a] Installation of protection circuits or other protective devices to improve system safety[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3.

Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items[f] Sealing or coating our Products with resin or other coating materials[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering[h] Use of the Products in places subject to dew condensation

4.

The Products are not subject to radiation-proof design.

5.

Please verify and confirm characteristics of the final or mounted products in using the Products.

6.

In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affectproduct performance and reliability.

7.

De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.

8.

Confirm that operation temperature is within the specified range described in the product specification.

9.

ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined inthis document.

Precaution for Mounting / Circuit board design
1.

When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect productperformance and reliability.

2.

In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E© 2015 ROHM Co., Ltd. All rights reserved.

Rev.004

Precautions Regarding Application Examples and External Circuits
1.

If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of thecharacteristics of the Products and external components, including transient characteristics, as well as static
characteristics.

2.

You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not beapplied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation
1.

Product performance and soldered connections may deteriorate if the Products are stored in the places where:[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation[d] the Products are exposed to high Electrostatic

2.

Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time isexceeding the recommended storage time period.

3.

Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.

4.

Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products ofwhich storage time is exceeding the recommended storage time period.

Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights
1.

All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.

2.

ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).

3.

No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution
1.

This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2.

The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior writtenconsent of ROHM.

3.

In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.

4.

The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.

Notice-PGA-E© 2015 ROHM Co., Ltd. All rights reserved.

Rev.004

Datasheet
General Precaution

1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any priornotice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.

3.

The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of orconcerning such information.

Notice – WE

© 2015 ROHM Co., Ltd. All rights reserved.

Rev.001