Tr i path Technol ogy, I nc. - Techni cal I nfor m ati on

TA2020-020
STEREO 20W (4Ω) CLASS-T™ DIGITAL AUDIO AMPLIFIER DRIVER
USING DIGITAL POWER PROCESSING (DPP™) TECHNOLOGYTechnical Information

Revision 7.1 – March 2005

GENERAL DESCRIPTIONThe TA2020-020 is a 20W (4Ω) continuous average per channel Class-T Digital Audio Power Amplifier IC
using Tripath’s proprietary Digital Power Processing (DPPTM) technology. Class-T amplifiers offer both theaudio fidelity of Class-AB and the power efficiency of Class-D amplifiers.
APPLICATIONSFEATURES

DVD Players
Mini/Micro Component Systems
Computer / PC Multimedia
Cable Set-Top Products
Televisions
Battery Powered Systems

Class-T architecture
Single Supply Operation“Audiophile” Quality Sound
0.03% THD+N @ 10W 4Ω
0.1% THD+N @12W 4Ω
0.18% IHF-IM @ 1W 4Ω

BENEFITS

Fully integrated solution with internal FETs
Easier to design-in than Class-D
Reduced system cost with minimal heat sinkrequirement
Dramatically improves efficiency versus Class-AB
amplifiers
Signal fidelity equal to high quality linear
amplifiersHigh dynamic range compatible with digital media
such as CD and DVD, and internet audio

High Power
25W @ 4Ω, 10% THD+N, VDD=14.6V
22W @ 4Ω, 10% THD+N, VDD=13.5V
13W @ 8Ω, 10% THD+N, VDD=13.5V
High Efficiency
88% @ 12W 8Ω
81% @ 20W 4Ω
Dynamic Range = 99dB
Mute and Sleep inputs
Turn-on & turn-off pop suppression
Over-current protection
Over-temperature protection
Bridged outputs
32-pin SSIP package

TYPICAL PERFORMANCE
THD+N versus Output Power
105

THD+N (%)

2

VDD = 13.5V
Av = 12V/V
f = 1kHzBW = 22Hz - 22kHz

1
0.5
0.2

RL= 8Ω

0.1

RL= 4Ω

0.05
0.02
0.01
500m

1

2

3

4

5 6 7 8 9 1020

Output Power (W)1

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A B S O L U T E M A X I M U M R A T I N G S (Note 1)
SYMBOLPARAMETER

Value

UNITS

16

V

6.0

V

-0.3 to 6.0

V

VDD

Supply Voltage

V5

Input Section Supply Voltage

SLEEP

SLEEP Input Voltage

MUTE

MUTE Input Voltage-0.3 to V5+0.3

V

ESDHBM

ESD Susceptibility,
Human Body Model (Note2)

2000
1000

V
V

All pins except 2, 30
Pins 2, 30

ESDMM

ESD Susceptibility, Machine Model (Note 3)

200

V

TSTORE

Storage Temperature Range-40 to 150°CTA

Operating Free-air Temperature Range-40 to 85°C

TJ

Junction Temperature

150

°C

Note 1:
Note 2:
Note 3:Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.
See the table below for Operating Conditions.
Human body model, 100pF discharged through a 1.5KΩ resistor.
Machine model, 220pF discharged through all pins.

O P E R A T I N G C O N D I T I O N S (Note 4)
SYMBOLPARAMETER

MIN.

TYP.

MAX.

VDD

Supply Voltage

8.5

13.5

14.6

VIH

High-level Input Voltage (MUTE, SLEEP)

3.5

VIL

Low-level Input Voltage (MUTE, SLEEP)

Note 4:

UNITS
V
V

1

V

Recommended Operating Conditions indicate conditions for which the device is functional.
See Electrical Characteristics for guaranteed specific performance limits.

THERMAL CHARACTERISTICSSYMBOL

2

VALUE

UNITS

θJC

Junction-to-case Thermal Resistance

PARAMETER

3.5

°C/W

θJA

Junction-to-ambient Thermal Resistance

15

°C/W

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E L E C T R I C A L C H A R A C T E R I S T I C S (Notes 6, 7)

See Test/Application Circuit. Unless otherwise specified, VDD = 13.5V, f = 1kHz,
Measurement Bandwidth = 22kHz, RL = 4Ω, TA = 25 °C.
SYMBOLPO

PARAMETER
Output Power(Continuous Average/Channel)

CONDITIONSTHD+N = 0.1%
THD+N = 10%

PO

Output Power (VDD=14.6V)(Continuous Average/Channel)

THD+N = 0.1%
THD+N = 10%MIN.

RL = 4Ω
RL = 8Ω
RL = 4Ω
RL = 8Ω
RL = 4Ω
RL = 8Ω
RL = 4Ω
RL = 8Ω

TYP.

MAX.

UNITS

11
7
18
10

W
W
W
W

16.5
9.5
25
14.8

W
W
W
W

IDD,MUTE

Mute Supply Current

MUTE = VIH

5.5

7

mA

IDD, SLEEP

Sleep Supply Current

SLEEP = VIH

0.25

2

mA

Iq

Quiescent Current

VIN = 0 V

64

75

mA

THD + NPO = 10W/Channel

0.03

IHF-IM

Total Harmonic Distortion PlusNoise
IHF Intermodulation Distortion

19kHz, 20kHz, 1:1 (IHF)

0.1

SNR

Signal-to-Noise Ratio

A-Weighted, POUT = 20W, RL = 4Ω

99

dB

CS

Channel Separation

0dBr = 1W, RL = 4Ω, f = 1 kHz

70

80

dB

PSRR

Power Supply Rejection Ratio

65ηPower Efficiency

VDD = 9V to 13.2V
Vripple = 100mV, f=1kHz
POUT = 12W/Channel, RL = 8Ω

75
65
88

dB
dB
%

VOFFSET

Output Offset Voltage

No Load, MUTE = Logic low

VOH

High-level output voltage(FAULT & OVERLOADB)
Low-level output voltage(FAULT & OVERLOADB)
Output Noise Voltage

VOL
eOUT

50

%
0.5

150

3.5

mV
V

1
A-Weighted, input AC grounded

%

100

V
µV

Note 6: Minimum and maximum limits are guaranteed but may not be 100% tested.
Note 7: For operation in ambient temperatures greater than 25°C, the device must be derated based on the
maximum junction temperature and the thermal resistance determined by the mounting technique.

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PIN DESCRIPTION
Pin
2, 8
3, 7,
16
4
6
9, 12
10, 13Function
V5D, V5A
AGND1, AGND2,
AGND3
REF
OVERLOADBOAOUT1, OAOUT2
INV1, INV2

11

MUTE

14
17

BIASCAP
SLEEP

18

FAULT

19, 2820
21, 23,26, 2422, 25
1, 5, 1527
29
30
31, 32

PGND2, PGND1
DGND
OUTP2 & OUTM2;
OUTP1 & OUTM1
VDD2, VDD1
NC
VDDA
CPUMP
5VGEN
DCAP2, DCAP1

Description
Digital 5VDC, Analog 5VDC
Analog Ground
Internal reference voltage; approximately 1.0VDC
A logic low output indicates the input signal has overloaded the amplifier.
Input stage output pins
Single-ended inputs. Inputs are a “virtual” ground of an inverting opamp withapproximately 2.4VDC bias.
When set to logic high, both amplifiers are muted and in idle mode. When low(grounded), both amplifiers are fully operational. If left floating, the device stays inthe mute mode. Ground if not used.
Input stage bias voltage (approximately 2.4VDC).
When set to logic high, device goes into low power mode. If not used this pinshould be grounded. Can be pulled-up to VDD with a 1MΩ resistor (100KΩ
minimum).
A logic high output indicates thermal overload, or an output is shorted to ground,or another output.
Power Ground (high current)
Digital Ground. Should be connected to AGND locally at TA2020-020.
Bridged output pairs
Supply pin for high current H-bridges, nominally 13.5VDC.
Not connected
Analog 13.5VDC
Charge pump output (nominally 10V above VDDA)
Regulated 5VDC source used to supply power to the input section (pins 2 & 8).
Charge pump switching pins. DCAP1 (pin 32) is a free running 300kHz squarewave between VDDA and DGND (13.5Vpp nominal). DCAP2 (pin 31) is level
shifted 10 volts above DCAP1 (pin 32) with the same amplitude (13.5Vpp
nominal), frequency, and phase as DCAP1.

TA2020 PINOUT

32-pin SSIP Package(Front View)

NC
V5D
AGND1
REF
NC
OVERLOADBAGND2V5AOAOUT1INV1
MUTE
OAOUT2INV2BIASCAP
NC
AGND3
SLEEP
FAULT
PGND2
DGND
OUTP2
VDD2
OUTM2
OUTM1
VDD1
OUTP1
VDDA
PGND1
CPUMP
5VGEN
DCAP2
DCAP1

4

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32

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APPLICATION / TEST CIRCUITTA2020-020
1

CI
2.2uF
+

OAOUT1
RF
20KΩ

VDD1
NC

Processing&
Modulation

10

CA
0.1uF

BIASCAP

DH

26

9

INV1

RI
20KΩ

VDD1 (pin 25)

14

PGND1
VDD1

(Pin 28)(Pin 28)
VDD1 (pin 25)

DH

24

5V

(Pin 7)

OUTP1 Lo10uH, 3A

DO

OUTM1 Lo
10uH, 3A

11

PGND1

MUTE
OAOUT2
RF
20KΩ

12

RZ
10Ω,
1/2W

CDO
0.01uFRL
4Ω or *8Ω

13

4

FAULT

6

OVERLOADBVDD2 (pin 22)

DH21
Processing&
Modulation

REF

RREF
8.25KΩ, 1%

OUTP2 Lo
10uH, 3A

DO
PGND2
VDD2

(Pin 19)(Pin 19)*Co
0.47uFVDD2 (pin 22)*Co
0.47uFDH

23

32 DCAP1+12V(Pin 28)

18
VDD2

INV2

RI
20KΩ
(Pin 3)*Co
0.47uF

CZ
0.22uF

DO

5V

CI
2.2uF
+

*Co
0.47uF

CZ
0.22uF
RZ
10Ω,
1/2W

CDO
0.01uFRL
4Ω or *8Ω

OUTM2 Lo10uH, 3A

DO
CD
0.1uF
1MΩ

SLEEP

PGND2

31 DCAP2
17

CPUMP

5

0.1uF

2
CS
0.1uF

CS
0.1uF

5V

7
15
16

VDDA
DGND

V5D

3 AGND1
8

To Pin 30

NC

5VGEN
VDD1

V5A
AGND2
NC

PGND1
VDD2

AGND3

PGND2

(Pin 19)

29
27

CP
1uF

20

CS
0.1uF

30

CS
0.1uF

+

To Pin 2,8

25
28

CSW
0.1uF

+

CSW
0.1uF

+

VDD (+13.5V)
CSW

180uF, 16V

22
19

CSW
180uF, 16V

Note: Analog and Digital/Power Grounds must
be connected locally at the TA2020-020
Analog Ground
Digital/Power Ground
Diodes (DO and DH) are Motorola MBRS130T3 (the DH diodes are required for VDD>13.5V)* Use Co = 0.22µF and Cz=0.22uF for 8 Ohm loads

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E X T E R N A L C O M P O N E N T S D E S C R I P T I O N (Refer to the Application/Test Circuit)

Components

Description

RI

Inverting input resistance to provide AC gain in conjunction with RF. This input is biased
at the BIASCAP voltage (approximately 2.4VDC).
Feedback resistor to set AC gain in conjunction with RI A V = 12(RF / RI ) . Please refer tothe Amplifier Gain paragraph, in the Application Information section.
AC input coupling capacitor which, in conjunction with RI, forms a highpass filter at
fC = 1 (2πRICI ) .

RF
CI
RREF
CA
CD
CP

CS
CSW

CZ
RZ

DO

DH

LO

Bias resistor. Locate close to pin 4 and ground at pin 7.
BIASCAP decoupling capacitor. Should be located close to pin 14 and grounded at pin 7.
Charge pump input capacitor. This capacitor should be connected directly between pins
31 and 32 and located physically close to the TA2020-020.
Charge pump output capacitor that enables efficient high side gate drive for the internal
H-bridges. To maximize performance, this capacitor should be connected directly
between pin 29 (CPUMP) and pin 27 (VDDA). Please observe the polarity shown in the
Application/Test Circuit.
Supply decoupling for the low current power supply pins. For optimum performance,these components should be located close to the pin and returned to their respective
ground as shown in the Application/Test Circuit.
Supply decoupling for the high current H-Bridge supply pins. These components must
be located as close to the device as possible to minimize supply overshoot andmaximize device reliability. Both the high frequency bypassing (0.1uF) and bulk
capacitor (180uF) should have good high frequency performance including low ESR and
low ESL. Panasonic HFQ or FC capacitors are ideal for the bulk capacitor.
Zobel capacitor, which in conjunction with RZ, terminates the output filter at highfrequencies
Zobel resistor, which in conjunction with CZ, terminates the output filter at highfrequencies. The combination of RZ and CZ minimizes peaking of the output filter underboth no load conditions or with real world loads, including loudspeakers which usuallyexhibit a rising impedance with increasing frequency. Depending on the program
material, the power rating of RZ may need to be adjusted. The typical value is ½ watt.
Schottky diodes that minimize undershoots of the outputs with respect to power ground
during switching transitions. For maximum effectiveness, these diodes must be locatedclose to the output pins and returned to their respective PGND. Please see
Application/Test Circuit for ground return pin.
Schottky diodes that minimize overshoots of the outputs with respect to VDD duringswitching transitions (required for applications where VDD >13.5V). For maximum
effectiveness, these diodes must be located close to the output pins and returned to theirrespective VDD pins. Please see Application/Test Circuit for VDD return pin.

Output inductor, which in conjunction with CO and CDO, demodulates (filters) theswitching waveform into an audio signal. Forms a second order filter with a cutoff
frequency of f C = 1 ( 2π L O C TOT ) and a quality factor of

Q = R L C TOT
CO
CDO

6

2 L O C TOT where CTOT = CO || 2 * CDO.

Output capacitor.
Differential Output Capacitor. Differential noise decoupling for reduction of
conducted emissions. Must be located near chassis exit point for maximum
effectiveness.

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TYPICAL PERFORMANCE
Channel Separation versus Frequency

Efficiency versus Output Power

100

+0
-10

90

Channel Separation (dBr)

RL = 8Ω

80

Efficiency (%)

70

RL = 4Ω

60
50
40
30

-30
-40
-50
-60
-70
-80

VDD = 13.5V
f = 1kHzAv = 12V/V

20
10

VDD = 13.5V
Pout = 1W/Channel
RLoad = 4Ω
Av = 12V/V
BW = 22Hz - 22kHz

-20

-90
-100

0

20

0

5

10

15

20

25

Output Power (W)

50

100

200

30

1k

2k

5k

10k

20k

2k

5k

10k

20k

5k

10k

20k

Noise Floor

Intermodulation Performance
+0

+0

-10

VDD = 13.5V
Pout =VDD= 1W/Channel
13.5V
RLoad
= 4W
Pout
= 1W/Channel
19kHz, =20kHz,
RLoad
4W 1:10dBr = 12Vrms
19kHz,
20kHz, 1:1
Av = 120dBr= 12Vrms
BW==12V/V
10Hz - 80kHz
Av

-10
-20
-30

VDD = 13.5V
Pout = 0W
Av = 12V/V
RLoad = 4Ω
BW = 20Hz - 22kHz
A-Weighted Filter

-20
-30
-40
-50

Noise FFT (dBV)

BW = 10Hz - 80kHz

-40
-50
-60
-70

-60
-70
-80
-90
-100
-110

-80

-120
-130

-90

-140

-100
1k

50

2k

10k

5k

20k

-150
20

30k

Frequency (Hz)

50

100

200

500

1k

Frequency (Hz)Frequency Response

THD+N versus Frequency
10+3
VDD = 13.5V
Pout = 5W/Channel
Av = 12V/V
BW = 22Hz - 22kHz

2
1
0.5

0.2
0.1

0.05

+1.5
+1
+0.5
+0
-0.5
-1

-2

RL = 8Ω

0.01

10

+2

-1.5

RL = 4Ω

0.02

VDD = 13.5V
Pout = 1W
RLoad = 4Ω
Av = 12V/V+2.5

Output Amplitude (dBr)5

THD+N (%)

FFT (dBr)

500

Frequency (Hz)

-2.5
20

50

100

200

500

1k

Frequency (Hz)

7

2k

5k

10k

20k

-3
10

20

50

100

200

500

1k

2k

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APPLICATION INFORMATION
Circuit Board Layout

The TA2020-020 is a power (high current) amplifier that operates at relatively high switching frequencies.
The outputs of the amplifier switch between the supply voltage and ground at high speeds while driving
high currents. This high-frequency digital signal is passed through an LC low-pass filter to recover theamplified audio signal. Since the amplifier must drive the inductive LC output filter and speaker loads, theamplifier outputs can be pulled above the supply voltage and below ground by the energy in the output
inductance. To avoid subjecting the TA2020-020 to potentially damaging voltage stress, it is critical tohave a good printed circuit board layout. It is recommended that Tripath’s layout and application circuit beused for all applications and only be deviated from after careful analysis of the effects of any changes.
The figure below is the Tripath TA2020-020 evaluation board. The most critical components on the board
are the power supply decoupling capacitors. Capacitors, C674 and C451, must be placed right next topins 22 (VDD2) and 19 (PGND2) as shown. Similarly, capacitors, C673 and C451B, must be placed rightnext to pins 25 (VDD1) and 28 (PGND1) as shown. These power supply decoupling capacitors not only
help reject power supply noise, but more importantly, absorb voltage spikes on the VDD pins caused byovershoots of the outputs of the amplifiers.
Similarly, schottky diodes, D1, D2, D3 and D4, minimize overshoots with respect to VDD and schottky
diodes, D702, D703, D704 and D728, minimize undershoots with respect to power ground. For maximum
effectiveness, these diodes must be located close to the output pins and returned to their respective VDD
or PGND pins. Diodes D1, D2, D3 and D4 are only required for applications where VDD>13.5V. Voltage
overshoots can also be caused by output inductor flyback during high current switching events such as
shorted outputs or driving low impedances at high levels. If these capacitors and diodes are not closeenough to the pins, electrical overstress to the part can occur, possibly resulting in permanent damage to
the TA2020-020.
The output inductors, L389, L390, L398 and L399 should be placed close to the TA2020-020 withoutcompromising the locations of the closely placed supply decoupling capacitors and diodes. The purposeof placing the output inductors close the TA2020-020 output pins is to reduce the trace length of theswitching outputs. Following this guideline will aid in reducing radiated emissions.

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TA2020 Amplifier Gain

The gain of the TA2020-020 is set by the ratio of two external resistors, RI and RF, and is given by thefollowing formula:VOR= − 12 F
VI
RI
where VI is the input signal level and VO is the differential output signal level across the speaker. Please
note that OUTP1 and OUTP2 are 180° out of phase with their corresponding input signals.
20 watts of RMS output power results from an 8.944 V RMS signal across a four-ohm speaker load. If RF= RI, then 20 Watts will be achieved with 0.745 V RMS of input signal.

8.944 VRMS = (R L ∗ PO ) = ( 4Ω ∗ 20 W )Protection Circuits

The TA2020-020 is guarded against over-temperature and over-current conditions. When the device goes
into an over-temperature or over-current state, the FAULT pin goes to a logic HIGH state indicating a fault
condition. When this occurs, the amplifier is muted, all outputs are TRI-STATED, and will float to 1/2 of
VDD.
Over-temperature Protection

An over-temperature fault occurs if the junction temperature of the part exceeds approximately 155°C. The
thermal hysteresis of the part is approximately 45°C, therefore the fault will automatically clear when thejunction temperature drops below 110°C.
Over-current Protection

An over-current fault occurs if more than approximately 7 amps of current flows from any of the amplifier
output pins. This can occur if the speaker wires are shorted together or if one side of the speaker isshorted to ground. An over-current fault sets an internal latch that can only be cleared if the MUTE pin is
toggled or if the part is powered down. Alternately, if the MUTE pin is connected to the FAULT pin, the
HIGH output of the FAULT pin will toggle the MUTE pin and automatically reset the fault condition.
Overload

The OVERLOADB pin is a 5V logic output. When low, it indicates that the level of the input signal has
overloaded the amplifier resulting in increased distortion at the output. The OVERLOADB signal can beused to control a distortion indicator light or LED through a simple buffer circuit.
Sleep Pin

The SLEEP pin is a 5V logic input that when pulled high (>3.5V) puts the part into a low quiescent current
mode. This pin is internally clamped by a zener diode to approximately 6V thus allowing the pin to bepulled up through a large valued resistor (1MΩ recommended, 100KΩ minimum) to VDD. To disable
SLEEP mode, the sleep pin should be grounded

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Fault Pin

The FAULT pin is a 5V logic output that indicates various fault conditions within the device. These
conditions include: low supply voltage, low charge pump voltage, low 5V regulator voltage, over current at
any output, and junction temperature greater than approximately 155°C. The FAULT output is capable ofdirectly driving an LED through a series 2KΩ resistor. If the FAULT pin is connected directly to the MUTE
input an automatic reset will occur in the event of an over-current condition.
Heat Sink Requirements

In some applications it may be necessary to fasten the TA2020-020 to a heat sink. The determining factor
is that the 150°C maximum junction temperature, TJ(max) cannot be exceeded, as specified by thefollowing equation:

PDISS =(T

J ( MAX )− TA )

θ JA

where…
PDISS = maximum power dissipation
TJMAX = maximum junction temperature of TA2020-020
TA = operating ambient temperatureθJC = junction-to-case thermal resistance of TA2020-020

Example:What size heat sink is required to operate the TA2020-020 at 20W per channel into a 4Ω load continuously
in a 70ºC ambient temperature?
PDISS is determined by:
Efficiency = η =

POUT
POUT
=
PIN
POUT − PDISSPDISS (per channel) =POUT
20− POUT =− 20 = 5 Wη
0 .8Thus, PDISS for two channels = 10W
θJA =

(T

J ( MAX )− TA )PDISS=

150 − 70
= 8°C/W
10

The θJA of the TA2020-020 in free air is 15°C/W. The θJC of the TA2020-020 is 3.5°C/W, so a heat sink of
4.5°C/W is required for this example. In actual applications, other factors such as the average PDISS with amusic source (as opposed to a continuous sine wave) and regulatory agency testing requirements will
determine the size of the heat sink required.

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Performance Measurements of the TA2020-020

The TA2020-020 operates by generating a high frequency switching signal based on the audio input. Thissignal is sent through a low-pass filter (external to the Tripath amplifier) that recovers an amplified versionof the audio input. The frequency of the switching pattern is spread spectrum in nature and typically varies
between 100kHz and 1MHz, which is well above the 20Hz – 20kHz audio band. The pattern itself does
not alter or distort the audio input signal, but it does introduce some inaudible components.
The measurements of certain performance parameters, particularly noise related specifications such as
THD+N, are significantly affected by the design of the low-pass filter used on the output as well as the
bandwidth setting of the measurement instrument used. Unless the filter has a very sharp roll-off justbeyond the audio band or the bandwidth of the measurement instrument is limited, some of the inaudible
noise components introduced by the TA2020-020 amplifier switching pattern will degrade themeasurement.
One feature of the TA2020-020 is that it does not require large multi-pole filters to achieve excellent
performance in listening tests, usually a more critical factor than performance measurements. Thoughusing a multi-pole filter may remove high-frequency noise and improve THD+N type measurements (whenthey are made with wide-bandwidth measuring equipment), these same filters degrade frequency
response. The TA2020-020 Evaluation Board uses the Application/Test Circuit of this data sheet, which
has a simple two-pole output filter and excellent performance in listening tests. Measurements in this data
sheet were taken using this same circuit with a limited bandwidth setting in the measurement instrument.

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PACKAGE INFORMATION

32-pin SSIP Package

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Tr i path Technol ogy, I nc. - Techni cal I nfor m ati on

Tripath and Digital Power Processing are trademarks of Tripath Technology. Other trademarks referenced in thisdocument are owned by their respective companies.
Tripath Technology, Inc. reserves the right to make changes without further notice to any products herein to
improve reliability, function or design. Tripath does not assume any liability arising out of the application of use ofany product or circuit described herein; neither does it convey any license under its patent rights nor the rights ofothers.
TRIPATH’S PRODUCT ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORTDEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN CONSENT OF THE PRESIDENT OF TRIPATHTECHONOLOGY, INC. As used herein:
1.

2.

Life support devices or systems are devices or systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordancewith instructions for use provided in this labeling, can be reasonably expected to result in significant
injury of the user.
A critical component is any component of a life support device or system whose failure to perform can bereasonably expected to cause the failure of the life support device or system, or to affect its safety oreffectiveness.

Contact Information
TRIPATH TECHNOLOGY, INC
2560 Orchard Parkway, San Jose, CA 95131
408.750.3000 - P
408.750.3001 - F
For more Sales Information, please visit us @ www.tripath.com/cont_s.htm
For more Technical Information, please visit us @ www.tripath.com/data.htm

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