TITANTAG™ DATA SHEET

PicturePicturePictureTITANTAG™

Smallest TN

Frequency

UHF 902-928MHz

ProtocolISO18000-6-C
EPC Class 1 Gen2

Dimensions (mm)W38 H10 T2.1

Weight (gram)

2.4

RFID chip

Alien Higgs3

PictureTOTAL 800
Memory (bits)

EPC up to 480
User up to 512
1.5(On metal)

Reads (up to meters)
Picture0.7(Off metal)

PictureHuman readable marking
options

1D/2D Barcode, text& image marking bylaser engraving and label printing

Attaching options

Backing adhesive or metal fasteners

Operating temperature-30<>80℃

Storage temperature-40<>150℃IP class

IP68

Year of release2018

Product code

381021U

PicturePicture1

[1] Feature[3] Key materials and processes
Silicon chip Alien Higgs3• Read sensitivity of -20dBm – Best performing among UHF Gen 2 RFID chips• Total 800bits memory – EPC 96bits (extensible to 480bits), User 512bits, TID 64 bits,
Access& Kill password each 32bits and Lock password 64bits• Most widely adopted chip for metal mounting UHF RFID tags
• RFcamp has adopted Alien Higgs3 since year of 2008.
www.alientechnology.com/wp-content/uploads/ALC-360%20Higgs3%202014-12-21.pdf

Antenna PCB FR4, Copper etched, Gold plated[2] Dimensions• FR4 (Fire retardant 4, composed of woven fiberglass cloth with an epoxy resinbinder) – Most stable and widely applied antenna materials in recent 30 years
worldwide, with highest durability and consistent electrical property• Copper etched antenna has much higher accuracy with lower tolerance thanaluminum etched antenna and conductive ink printed antenna, which makes tag
performance more consistent with lower read range variance.
• Gold is plated on chip bonded area of copper etched antenna, in order to enhancechip adhesion on antenna as well as electrical interconnection with antenna.

Packaging Double layer PCBs, laminated under high temperature and pressure• Tag antenna has convoluted structure of two or three layers with copper groundplane, so tag is composed of double layer PCBs, tightly combined and laminatedunder high pressure and temperature of 200℃ for >2 hours.
• Many tag makers copy TITANTAG™ in appearance, but they can not copy tags’
durability and read consistency.
• Surface of PCBs is coated with TOYO (black) PSR, best of kind which can protect itagainst electrical stress and water ingression.

Chip bonding Wire bonded, aluminum or gold
• Unlike other tag makers using flip chip bonding or chip soldering, RFcamp has
adopted wire bonding technology since year of 2004.
• Wire bonding, though most complicated and expensive chip bonding method, ismost stable in electrical interconnection and most durable in mechanical andtemperature stresses. It, with highest precision, is also best fit for working on
complicated antenna patterns of double layer PCBs.

2• Comparison: on vs. off metal[4] Performance

MHzOn metal

900
16.50

905
14.75

910
12.75

915
11.25

920
9.25

925
7.50

930
5.75

935
4.50

*dBm
940
3.75

• Performance table

Off metal

15.75

13.75

12.50

13.50

14.00

14.00

13.25

11.50

10.50

Up to meters*

On metal

Off metal

Fixed reader 2W ERP

1.5

0.7

Handheld reader 0.5W ERP

1.0

0.5

20.00
15.00
On metal

10.00

Off metal

5.00-• Comparison with neighboring tags
MHz
Smallest TNSmallest
Smallest TK

900
16.50
9.25
8.25

905
14.75
7.25
7.00

910
12.75
5.25
4.25

915
11.25
2.75
1.00

920
9.25
1.25
0.25

925
7.50
2.00
1.25

930
5.75
4.00
2.00

935
4.50
6.00
3.50

*dBm
940
3.75
7.75
7.00

900

905

910

915

920

925

930

935

940

•Smallest TN reads 20% shorter off metal (or on non metal surface). It can be appliedfor BOTH metal and off metal application.

• Comparison: with metal bolt in vs. without it inMHz
w/o bolt

900
16.50

905
14.75

910
12.75

915
11.25

920
9.25

925
7.50

930
5.75

935
4.50

*dBm
940
3.75

w/t bolt

16.75

15.00

13.00

11.25

9.50

7.50

5.50

4.25

3.75

20.00
15.00

Smallest TN
10.00

Smallest
Smallest TK

5.00

900905

910

915

920

925

930

935940•Smallest TN reads up to 1.5 meters on metal, 25% shorter than Smallest and 60%
shorter than Smallest TK.
•Its read performance varies upon tag location, orientation, direction, RFenvironments, etc. It performs best when tag is attached on metal surface without
any space or backing adhesive layer between. As space or backing adhesive gets
thicker, read performance lowers. For example, 1mm thick 3M VHB adhesive tapedecreases read range by 20% whereas 0.05mm thick 3M 300LSE tape does notdecrease it at all.

20.00
15.00
w/o bolt

10.00

w/t bolt
5.00
900905910

915920925930935940•Smallest TN reads almost same, regardless of whether it is fastened with metal bolt
in two holes (located at both ends) or not. Though RF interference is minimal withmetal bolts, however, RFcamp recommends not using metal bolts, but 3M 300LSE
adhesive or glue for maintaining optimum read performance.
*dBm : Minimum power tag needs in order to respond to RFID reader.

3[5] Durability• Chemical stress• Temperature stress
Test methods

Descriptions

Chemicals

Pass/Fail150℃, 6hrs

Stored in convection oven at 150C, 6hrs

Pass-45<>85℃, 50 cycles

Stored in temperature shock chamber for 50 cycles– One cycle includes 30 min. at-45C, 30 min,transition, 30min. at 85C and 30min. transition.

Pass

85℃/85%, 24hrs

Stored in humidity chamber at 85C/85%RH for 24hours

Pass

Boling water, 6 hrs

Immersed in boiling water for 6 hours

Pass

Descriptions

Pass/FailAlkali

NaOH (10%, pH13) | Immersed 24 hrs.

PassAcid

Sulfuric acid (10%, pH2) | Immersed 24 hrs.

Pass

Petroleum

Gasoline, Diesel, Kerosene, lubricating oil |Immersed 24 hrs.

Pass

Alcohol

Methanol, Ethanol | Immersed 24 hrs.

Pass

Surfactant

Solvent for metal tool oils | Immersed 24 hrs.

Pass

Salt water

IEC60068-2-11

Pass• Ingression www.dsmt.com/resources/ip-rating-chart
IP ClassIP68

1.5 meter deep immersion, 1hr• Electrical stress
ESD

IEC61000-4-2 (LEVEL4 – 8KV)

PASS• Mechanical stress
Test methodsDescriptions

Pass/FailIron ball fall test

Free fall of 1kg iron ball from 1.5meters height on
any side of tag - 50 times

PassVibration

IEC60068-2-6-64

Pass

Drop& topple

IEC60068-2-31

Pass

Shock (acceleration)

IEC60068-2-27

Pass

Pressure

50 Bar on any side of tag, 50 times

Pass4[6] Service Options• Chip encoding service• Backing adhesive•Encodes EPC memory sector only*.
•Encodes tags with 4 multiple digits - from 16 bits (4 digits decimal or hex or ASCII)
up to 480 bits (120 digits decimal or hex or ASCII) - upon customers’ request.
•Unless requested by customer, all tags are encoded with 24 digits decimal (Date 8digits + Serial 16 digits), before shipped to customers. For example, code
201508140000000000001278 tells that tag was 1278th encoded on August 14, 2015.
•Tag code can be permanently locked with password of 8 digits decimal or hex, uponcustomer’s request.

•Unless requested otherwise, RFcamp recommends and applies 3M468MP or
3M9472LE (Aka. 3M300LSE) double sided adhesive tapes for general applications.
For harsh environments, RFcamp recommends 3M VHB tapes.
• For stronger adhesion, RFcamp suggests glue solutions such as Cemedine’s Super X
or Loctite’s double compound epoxies.
• For special solution, please ask RFcamp.

* For special encoding service (e.g. TID to EPC or user memory encoding), please ask RFcamp.

• Label& printing service•Provides fast and reasonably priced
custom label service with printing
variable data, barcode and logo.
•Label material is water proof and “hardto tear off” polysynthetic.

• Laser engraving& direct printing service•With CO2 laser, tag surface isprecisely and permanently etched
into variable data, barcode andlogo with black and yellow
contrast.
• With silk screen printing or pad
printing method, tag surface ispermanently printed with various
colored logo or text.

• Fasteners& brackets•For some small TITANTAGs,
metal fastener may adversely
affect tag read performance, so
please ask RFcamp for suitablesolution.
•Upon customer’s request,
RFcamp develops metal based
brackets for special applications,with optimal tag performance.

• Encapsulations•For special environment
requiring enhanced chemicaldurability, RFcamp applies special
coating materials over tag.
•Upon customer’s request,
RFcamp develops injection
molded ruggedized case or rubber(polyurethane or silicone) based
encapsulation.

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