No.:
Date:

WLP-K-HTS-0001
2017. 4. 21/3

Data sheet
Title:METAL-PLATE CHIP RESISTOR; LOW OHM

Style:WLP63
AEC-Q200 qualified

RoHS COMPLIANCE ITEM
Halogen and Antimony Free
Note: ・Stock conditions
Temperature: +5°C ∼ +35°C
Relative humidity: 25% ∼ 75%
The period of guarantee: Within 2 year from shipmen t by the company.
Solderability shall be satisfied.

・Product specification contained in this data sheet
are subject to change at any time without notice・If you have any questions or a Purchasing Specification for any quality
Agreement is necessary, please contact our sales staff.

Hokkaido Research Center
Approval by: T. Sannomiya
Drawing by: M. Shibuya

No: WLP−K−HTS−0001
Title:METAL−PLATE CHIP RESISTOR; LOW OHM
WLP63

Page:/3
1/6

1. Scope
1.1 This data sheet covers the detail requirements for metal−plate chip resistor ; low ohm, style of WLP63.
1.2 Applicable documents
JIS C 5201−1: 2011, JIS C 5201−8: 2014, JIS C 5201−8−1: 2014
IEC60115−1: 2008, IEC60115−8: 2009, IEC60115−8−1: 2014

2. Classification
Type designation shall be the following form.
3D(Example)
WLP63N
1234
Style
1 Metal-plate chip resistor ; low ohm
2 Size3 Rated dissipation
3DR025
5F6TE
7

Style

2W

4 Temperature coefficient of resistance
N±70×10-6/ °C

5 Rated resistance
R025 R025-->25mΩ
6 Tolerance on rated resistance
F±1%
G±2%
J±5%
7 Packaging form
TE
Plastic tape

3. Rating
3.1 The ratings shall be in accordance with Table−1.
Style

Rated dissipation
(W)

WLP63

2.0

Style
WLP63

Max. working voltage
(V)
0.224

Rated current
(A)
11.5
108.9

Table−1
Temperature coefficient ofresistance (10–6/ °C)
N±70
N±70
N±70Max. Overload voltage
(V)
0.500

Rated resistance(mΩ)
152025Isolation voltage(V)
100Tolerance on ratedresistanceF(±1%)
G(±2%)
J(±5%)

Category temperature range(°C)−55∼+170

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2017.4.21

No: WLP−K−HTS−0001
Title:METAL−PLATE CHIP RESISTOR; LOW OHM
WLP63

Page:

/3
2/6

3.2 Derating
The derated values of dissipation at temperature in excess of 70 °C shall be as indicated by the following curve.
100Percentageof the rateddissipation

Area of recommendedoperation(%)
0−55

70

170

Ambient temperature (°C)

Figure−1 Derating curve
3.3 Rated voltage
d.c. or a.c. r.m.s. voltage calculated from the square root of the product of the rated resistance and the rated dissipation.
E: Rated voltage (V)E =P · R
P: Rated dissipation (W)R: Rated resistance (Ω)
3.4 Rated current
The rated current calculated from the square root of the quotient of the rated resistance and the rated dissipation.
I: Rated current (A)I =P / R
P: Rated dissipation (W)R: Rated resistance (Ω)
The rated current shall be corresponding to rated voltage.
*Power testing with total solder-pad and trace size of 300 mm2
4. Packaging form
The standard packaging form shall be in accordance with Table−2.
Table−2SymbolTEPackaging form
Plastic tape

12mm width, 4mm pitches

Standard packaging
quantity / units
4,000 pcs.

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2017.4.21

No: WLP−K−HTS−0001
Title:METAL−PLATE CHIP RESISTOR; LOW OHM
WLP63

Page:/3
3/6

5. Dimensions
5.1 The resistor shall be of the design and physical dimensions in accordance with Figure−2 and Table−3.

WLcddHcFigure−2Table−3
Style
WLP63

L6.2±0.2

W3.2±0.2

H0.6±0.2

c0.8±0.2

Unit: mmd0.8±0.2

5.2 Net weight (Reference)
Style
Net weight (mg)
WLP63
62.5
6. Marking
The rated resistance shall be marked in 4 characters consisting of 3 figures and a letter and marked on over coat side.
(Example) “R025” → 0.025 [Ω] → 25 [mΩ]

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2017.4.21

No: WLP−K−HTS−0001
Title:METAL−PLATE CHIP RESISTOR; LOW OHM
WLP63

Page:

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4/6

7. Performance
7.1 The standard condition for tests shall be in accordance with Sub−clause 4.2, JIS C 5201−1: 2011.
7.2 The performance shall be satisfied in Table−4.
Table− 4(1)No.
Test items
Performance requirements
Condition of test (JIS C 5201−1)
1
DC ResistanceF(±1%), G(±2%), J(±5%)
4.5
Measure the resistance value
2Short time overload
4.13∆R ≤ ± (1%+0.1mΩ)
5 x Rated power for 5s.
Measure resistance after 30 min.
3Solderability
4.17
Over 95% of termination must be
After immersing flux, dip in the 245±2°C, covered with Solder
molten solder bath for 3±0.5 s.
4Resistance to soldering heat
4.18
∆R ≤ ± (1%+0.1mΩ)
With 260±5°C for 10±1s
No mechanical damage.
5Load life in Humidity
4.24∆R ≤ ± (1%+0.5mΩ)
40 °C±2 °C with relative humidity 90∼95%
D.C. rated voltage for 1.5 h “ON”, 30min“OFF”
Cycle repeated 1,000h
6Temperature coefficient of 4.8
See Table−1.
resistance
Test temperature: T1∼T2: 25°C∼-55°C
T1∼T2: 25°C∼155°C
TCR(ppm/°C)=(R2-R1)/R1x1/(T2-T1)x106
7
Load life
4.25∆R ≤ ± (1%+0.5mΩ)
Rated voltage for 1.5 h for followed by apause 0.5 h at 70±2°C.
Cycle repeated 1,000h
8Insulation resistance
4.6
Between termination and coating must
be over 1000MΩ
Test voltage: 100±15Vdc
9Bending strength4.33∆R ≤ ± (1%+0.5mΩ)
Resistance change after bended on the No mechanical damage
90mm PCB.
Bending: 3mmDuration: 10s

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2017.4.21

No: WLP−K−HTS−0001
Title:METAL−PLATE CHIP RESISTOR; LOW OHM
WLP63

Page:/35/6

8. Taping8.1 Taping dimensions
Taping dimensions shall be in accordance with Figure−3 and Table−5.
Unit: mm2±0.05
Sprocket hole

φ1.5+0.1
01.75±0.1

4±0.1

WBEA

Carrier cavity

4±0.1

Direction of unreeling*Accumulated dimensional tolerance 40±0.2mm
Figure−3
Table−5
StyleABW
WLP63
3.5±0.2
6.75±0.20
12.0±0.3

Unit: mmE5.5±0.05

8.2 Peel strength of top cover tape
The peel speed shall be about 300 mm/min
The peel force of top cover tape shall between 0.1 to 0.7N
Top cover tape

165° to 180°

0.1N∼0.7N

Figure−4

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2017.4.21

No: WLP−K−HTS−0001
Title:METAL−PLATE CHIP RESISTOR; LOW OHM
WLP63

Page:

/3
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8.3 Reel dimension
Reel dimensions shall be in accordance with the following Figure−5 and Table−6.
Unit: mmφ178±2.0

φ13±0.52±0.5

φ60±0.5

Markingφ20 minA

StyleWLP63

Figure−5
Table−6A
13.8±1.5

B

Unit: mmB
16.7 max.

9. Marking on package
The label of a minimum package shall be legibly marked with follows.
(1) Classification(Style, Rated dissipation, Temperature coefficient of resistance, Rated resistance, Tolerance on rated resistance, Packaging form)(2) Lot number (3) Quantity (4) Manufacturer’s name or trade mark (5) Others

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2017.4.21