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Android (operating system) devicesIn vitro and in vivo evaluation of the bioactivity of iron-doped hydroxyapatite-collagencomposite bone filling materials. We have developed a novel composite material composed of hydroxyapatite (HA) and type I
collagen using a modified wet-mixed method. When implanted subcutaneously in the back of mice, the new material exhibited
osteogenic activity of the HA phase and both bone-forming and osteoclastic activities of the collagen phase. The HA wassuccessfully doped with iron by a simple freeze-drying method, and we found that the bioactivity of the resulting material wasenhanced. These results indicate that the iron-doped HA-collagen composite may be a useful bone repair material.1. Field of theInvention This invention relates to a metallization structure and a method for fabricating the same and, in particular, to ametallization structure formed on the same substrate together with a thin film circuit provided thereon. 2. Description of theRelated Art The fabrication of a semiconductor device requires a metallization structure such as aluminum wiring and a thinfilm circuit such as that of a TFT formed on an insulating substrate. FIG. 1 is a schematic sectional view of a conventional
metallization structure and a thin film circuit. As shown in the drawing, a silicon nitride (SiNx) film 102 is formed on a glass
substrate 101 as an insulating film, followed by a contact hole 103 being formed in the SiNx film 102. On the contact hole 103
formed in the SiNx film 102, an aluminum wiring (not shown) is formed. Meanwhile, as shown in FIG. 2, a p-type a-Si (i-type aSi) film 105 is deposited by the plasma-CVD method on the glass substrate 101 covering the metallization structure including
the aluminum wiring. The deposition of the a 3ef4e8ef8d
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