Spec. No.:
Date:

RMPC−K−HTS−0001 /4
2022.8.18

Data sheet
Title:FIXED THICK FILM CHIP RESISTORS;RECTANGULAR TYPE AND Pb<100ppm

Style:

RMPC04,06,10,16,20,32,35

RoHS COMPLIANCE ITEM
Halogen and Antimony Free
Note: ・Stock conditions
Temperature: +5°C ∼ +35°C
Relative humidity: 25% ∼ 75%
The period of guarantee: Within 2 year from shipment by the company.
Solderability shall be satisfied.

・Product specification contained in this data sheet are subject to change at
any time without notice・If you have any questions or a Purchasing Specification for any quality
agreement is necessary, please contact our sales staff.

Hokkaido Research Center
Approval by: T. Sannomiya
Drawing by: M. Shibuya

Title:Drawing No: RMPC−K−HTS−0001/4
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND Pb<100ppm
RMPC04,06,10,16,20,32,35
Page: 1/14

1. Scope
1.1 This specification covers the detail requirements for fixed thick film chip resistors; rectangular type, style of RMPC04, 06, 10,
16, 20, 32, 35.
1.2 Applicable documents
JIS C 5201−1: 2011, JIS C 5201−8: 2014, JIS C 5201−8−1: 2014
IEC60115−1: 2008, IEC60115−8: 2009, IEC60115−8−1: 2014
EIAJ RC−2134C−2010
2. Classification
Type designation shall be the following form.
(Example) 1)
16
RMPC
1
2
Style
2)
RMPC
16
1
2
Style

−

3

123
4

J
5

JP
4

1 Fixed thick film chip resistors; rectangular type & Pb<100ppm
2 Dimension
3 Temperature coefficient of resistanceStandard−(Dash)4 Rated resistance
123
1000
JP

TP
6
TP
6

Style

E24 Series, 3 digit, Ex. 123--> 12kΩ,
E96 Series, 4 digit, Ex. 1000-->100Ω
1022--> 10.2kΩ
Chip jumper

5 Tolerance on rated resistance
F
±1%
J
±5%
6 Packaging form
B
PA
TH
TP
TE

Bulk (loose package)
Press pocket taping
Paper taping
Embossed taping

Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.8.18

Title:Drawing No: RMPC−K−HTS−0001/4
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND Pb<100ppm
RMPC04,06,10,16,20,32,35
Page: 2/14

3. Rating
The ratings shall be in accordance with Table−1.
3.1 Resistor

Style

RMPC04

RMPC06

RMPC10

RMPC16

RMPC20

RMPC32

RMPC35Rated
dissipation
(W)

0.03

0.05

0.063

0.1

0.125

0.25

0.33

Table−1(1)Temperature coefficient ofRated resistanceresistance
range (Ω)
(10−6 / °C)±200
100∼1M+600∼010∼97.6
Standard±200
100∼1M+600∼010∼9.1+800∼-100
1∼9.1
±200
100∼10M+600∼010∼97.6+800∼−1001∼9.76
Standard±200
100∼10M+600∼010∼91+800∼−100
1∼9.1
±200
100∼10M+500∼-200
10∼97.6+800∼−1001∼9.76
Standard±200
100∼10M+500∼-20010∼91+800∼−100
1∼9.1
±200
100∼10M+500∼-200
10∼97.6+800∼−1001∼9.76
Standard±200
100∼10M+500∼-20010∼91+800∼−100
1∼9.1
±200
100∼10M+500∼-200
10∼97.6+800∼−1001∼9.76
Standard±200
100∼10M+500∼-20010∼91+800∼−100
1∼9.1
±200
100∼10M+500∼-200
10∼97.6+800∼−1001∼9.76
Standard±200
100∼10M+500∼-20010∼91+800∼−100
1∼9.1
±200
100∼10M+500∼-200
10∼97.6+800∼−1001∼9.76
Standard±200
100∼10M+500∼-20010∼91+800∼−1001∼9.1

Preferred number
series for resistors

Tolerance on
rated resistance

E24, 96F(±1%)

E24

J(±5%)

E24, 96F(±1%)

E24

J(±5%)

E24, 96F(±1%)

E24

J(±5%)

E24, 96F(±1%)

E24

J(±5%)

E24, 96F(±1%)

E24

J(±5%)

E24, 96F(±1%)

E24

J(±5%)

E24, 96F(±1%)

E24

J(±5%)

Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.8.18

Title:Drawing No: RMPC−K−HTS−0001/4
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND Pb<100ppm
RMPC04,06,10,16,20,32,35
Page: 3/14

Style
RMPC04
RMPC06
RMPC10
RMPC16
RMPC20
RMPC32
RMPC35

Limiting element
voltage (V)15
25

Insulation voltage
(V)

50

100

Category temperature
range (°C)

50−55∼+125

150
500

200

3.2 Chip Jumper
Style
RMPC04
RMPC06
RMPC10
RMPC16
RMPC20
RMPC32
RMPC35Chip jumper symbol

Table−1(2)Resistance value of chip jumperJP

50mΩmax.

3.3 Climatic category
55/125/56

3.4 Stability class5%

Rated current of chip jumper(A)
0.5
1
1
2
2
2
2

Lower category temperature
Upper category temperature
Duration of the damp heat, steady state test

− 55 °C+125 °C
56daysLimits for change of resistance:−for long−term tests±(5%+0.1Ω) Chip jumper: 50 mΩ max.
−for short−term tests±(1%+0.05Ω) Chip jumper: 50 mΩ max.

3.5 Derating
The derated values of dissipation (or current rating in case of chip jumper) at temperature in excess of 70 °C shall be as
indicated by the following curve.
100

Percentage of the
rated dissipation(Current) (%)
0−55

Area of recommended
operation
70

125

Ambient temperature (°C)

Figure−1 Derating curve

Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.8.18

Title:Drawing No: RMPC−K−HTS−0001/4
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND Pb<100ppm
RMPC04,06,10,16,20,32,35
Page: 4/14

3.6 Rated voltage
d. c. or a. c. r. m. s. voltage calculated from the square root of the product of the rated resistance and the rated dissipation.
E : Rated voltage (V)
E =
P · R
P : Rated dissipation (W)R : Rated resistance (Ω)
Limiting element voltage can only be applied to resistors when the resistance value is equal to or higher than the criticalresistance value.
At high value of resistance, the rated voltage may not be applicable.
4. Packaging form
The standard packaging form shall be in accordance with Table−2.
Table−2
Symbol
B
PA
TH
TP
TE

Standard packaging
quantity / units
1,000 pcs.
20,000 pcs.
15,000 pcs.
10,000 pcs.
5,000 pcs.
4,000 pcs.

Packaging form
Bulk (loose package)
Press pocket taping(paper taping)
Paper taping
Paper taping
Embossed taping

8mm width, 2mm pitches
8mm width, 2mm pitches
8mm width, 4mm pitches
8mm width, 4mm pitches

Application
RMPC04,06,10,16,20,32,35
RMPC04
RMPC06
RMPC10
RMPC16,20,32
RMPC35

5. Dimensions
5.1 The resistor shall be of the design and physical dimensions in accordance with Figure−2 and Table−3.

W

L

c

d

d

H

c

Figure−2
Table−3
Style
RMPC04
RMPC06
RMPC10
RMPC16
RMPC20
RMPC32
RMPC35L
0.4±0.02
0.6±0.03
1.0±0.05
1.6±0.1
2.0±0.1
3.1±0.1
3.1±0.15W
0.2±0.02
0.3±0.03
0.5±0.05+0.15
0.8−0.05
1.25±0.10
1.6±0.15
2.5±0.15H
0.13±0.02
0.23±0.03
0.35±0.05
0.45±0.10
0.55±0.10
0.55±0.10
0.55±0.15

Unit : mmcd0.08±0.03
0.1±0.03
0.1±0.05
0.15±0.05+0.05
0.2±0.1
0.25−0.10
0.3±0.1
0.3±0.1
0.4±0.2
0.4±0.2
0.5±0.25
0.5±0.25
0.5±0.25
0.5±0.25

Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.8.18

Title:Drawing No: RMPC−K−HTS−0001/4
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND Pb<100ppm
RMPC04,06,10,16,20,32,35
Page: 5/14

5.2 Net weight (Reference)
Style
Net weight(mg)
RMPC040.035
RMPC06
0.16
RMPC100.6
RMPC162
RMPC205
RMPC32
9
RMPC3516
6. Marking
The Rated resistance of RMPC04,06,10 should not be marked.
6.1 RMPC16,20,32,35
The nominal resistance shall be marked in 3 digits or 4 digits and marked on over coat side.
• RMPC20,32,35: E24 series: 3 digits, E96 series: 4 digits
In case of the resistance value that E96 overlaps with E24, It is marked by either.
• The Rated resistance of RMPC16 should not be marked in 4 digits.
Marking example
Contents
Application
123
RMPC16,20,32,35
12×10 3 ［Ω］ → 12 ［kΩ］Less than 10Ω of RMPC16,20,32,35
2. 2 ［Ω］
2R2
5623
RMPC20,32,35
562×10 3 ［Ω］ → 562［kΩ］
12R7
RMPC20,32,.35
12.7 ［Ω］6.2 Marking example of Jumper Chip
Marking example
Contents
O
JP
000

Application
RMPC16,20,32
RMPC35

Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.8.18

Title:Drawing No: RMPC−K−HTS−0001/4
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND Pb<100ppm
RMPC04,06,10,16,20,32,35
Page: 6/14

7. Performance
7.1 The standard condition for tests shall be in accordance with Sub−clause 4.2, JIS C 5201−1: 2011.
7.2 The performance shall be satisfied in Table−4.
Table−4(1)No.
Test items
Performance requirements
Condition of test (JIS C 5201−1)
1
Visual examination
As in 4.4.1
Sub−clause 4.4.1
The marking shall be legible, as
Checked by visual examination.
checked by visual examination.
2
Dimension
Sub−clause 4.4.2
As specified in Table−3 of thisspecification.
Resistance
As in 4.5.2
Sub−clause 4.5
The
resistance
value
shall
correspond with the rated resistancetaking into account the specified
tolerance.
Chip jumper: 50mΩ max.
3
Voltage proof
Sub−clause 4.7
No breakdown or flash over
Method: 4.6.1.4(See Figure−3)
Test voltage: Alternating voltage with a peakvalue of 1.42 times theinsulation voltage.
Duration: 60 s ± 5 s
R≥1GΩ
Insulation resistance
Test voltage: Insulation voltage
Duration: 1 min.
4
Solderability
As in 4.17.4.5
Sub−clause 4.17
The terminations shall be covered
Without ageing
Flux: The resistors shall be immersed in a with a smooth and bright solder
coating.
non−activated soldering flux for 2s.
Bath temperature: 235 °C ± 5 °C
Immersion time: 2 s ± 0.5 s

Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.8.18

Title:

No
5

6

7

Drawing No: RMPC−K−HTS−0001/4
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND Pb<100ppm
RMPC04,06,10,16,20,32,35
Page: 7/14
Table−4(2)Performance requirements
Condition of test (JIS C 5201−1)
Mounting
Sub−clause 4.31
Substrate material: Epoxide woven glass
Overload
Sub−clause 4.13
(in the mounted state)
The applied voltage shall be 2.5 times the
rated voltage or twice the limiting element
voltage, whichever is the less severe.
Duration: 2 s
No visible damage
Visual examination∆R ≤ ± (1%+0.05Ω)
Resistance
Chip jumper: 50mΩ max.
Solvent resistance of the Sub−clause 4.30
Legible marking
marking
Solvent: 2−propanol
Solvent temperature: 23 °C ± 5 °C
Method 1
Rubbing material: cotton wool
Without recovery
Mounting
Sub−clause 4.31
Substrate material: Epoxide woven glass
Bound strength of the end face Sub−clause 4.33
plating
Bent value: 3 mm
∆R ≤ ± (1%+0.05Ω)
Resistance
Chip jumper: 50mΩ max.
Final measurements
No visible damage
Sub−clause 4.33.6
Visual examination
Resistance to soldering heat
Sub−clause 4.18
Solder temperature: 260 °C ± 5 °C
Immersion time: 10 s ± 0.5 s
As in 4.18.3.4
Visual examination
No sign of damage such as cracks.
∆ R ≤ ± (1%+0.05Ω)
Resistance
Chip jumper: 50mΩ max.
Component solvent resistance Sub−clause 4.29
Solvent: 2−propanol
Solvent temperature: 23 °C ± 5 °C
Method 2
Recovery: 48 h
No visible damage
Visual examination∆R ≤ ± (1%+0.05Ω)
Resistance
Chip jumper: 50mΩ max.
Test items

Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.8.18

Title:No
8

Drawing No: RMPC−K−HTS−0001/4
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND Pb<100ppm
RMPC04,06,10,16,20,32,35
Page: 8/14

Test items
Mounting
Adhesion

Rapid change temperature

9

Climatic sequence−Dry heat−Damp heat, cycle(12+12hour cycle)
First cycle−Cold−Damp heat, cycle(12+12hour cycle)
Remaining cycle−D.C. load

Table−4(3)Condition of test (JIS C 5201−1)
Sub−clause 4.31
Substrate material: Epoxide woven glass
Sub−clause 4.32
Force: 3N(RMPC04: 2N, RMPC06: 3N)
Duration: 10 s ± 1 s
Visual examination
Sub−clause 4.19
Lower category temperature: −55 °C
Upper category temperature: +125 °C
Duration of exposure at each temperature: 30
min.
Number of cycles: 5 cycles.
Visual examination
ResistanceSub−clause 4.23
Sub−clause 4.23.2
Test temperature: +125 °C
Duration: 16 h
Sub−clause 4.23.3
Test method: 2
Test temperature: 55 °C[Severity(2)]Sub−clause 4.23.4
Test temperature −55 °C
Duration: 2h
Sub−clause 4.23.6
Test method: 2
Test temperature: 55 °C[Severity (2)]
Number of cycles: 5 cycles
Sub−clause 4.23.7
The applied voltage shall be the rated voltage
or the limiting element voltage whichever is thesmaller.
Duration: 1 min.
Visual examination
Resistance

Performance requirements

No visible damage

No visible damage∆ R ≤ ±(1%+0.05Ω)
Chip jumper: 50mΩ max.

No visible damage∆ R ≤ ± (5%+0.1Ω)
Chip jumper: 50mΩ max.

Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.8.18

Title:No
10

Drawing No: RMPC−K−HTS−0001/4
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND Pb<100ppm
RMPC04,06,10,16,20,32,35
Page: 9/14

Test items
Mounting
Endurance at 70 °C

11

12Mounting

Table−4(4)Condition of test (JIS C 5201−1)
Sub−clause 4.31
Substrate material: Epoxide woven glass

Performance requirements

Sub−clause 4.25.1
Ambient temperature: 70 °C ± 2 °C
Duration: 1000 h
The voltage shall be applied in cycles of 1.5 h
on and 0.5 h.
The applied voltage shall be the rated voltage
or the limiting element voltage whichever is thesmaller.
Examination at 48 h , 500 h and1000 h:No visible damage
Visual examination∆ R ≤ ± (5%+0.1Ω)
Resistance
Chip jumper: 50mΩ max.
Sub−clause 4.31
Substrate material: Epoxide woven glass
Test substrate: Figure−3

Variation of resistance with Sub−clause 4.8
temperature−55 °C / +20 °C+20 °C / +125°C
Mounting
Sub−clause 4.31
Substrate material: Epoxide woven glass

As in Table−1

Damp heat, steady state

13

Sub−clause 4.24
Ambient temperature: 40 °C ± 2 °C
Relative humidity : 93 +2−3 %a) 1st group: without voltage applied.
b) 2nd group: The d. c. voltage shall be applied
continuously.
The voltage shall be accordance with
Sub−clause 4.24.2.1 b). without polarizing
voltage[4.24.2.1, c)]No visible damage
Visual examination
Legible marking∆ R ≤ ± (5%+0.1Ω)
Resistance
Chip jumper: 50mΩ max.
Dimensions (detail)Sub−clause 4.4.3
As in Table−3
Mounting
Sub−clause 4.31
Substrate material: Epoxide woven glass
Endurance at upper category TSub−clause 4.25.3
temperature
Ambient temperature:125 °C ± 2 °C
Duration: 1000 h
Examination at 48 h, 500 h and1000 h:No visible damage
Visual examination∆ R ≤ ± (5%+0.1Ω)
Resistance
Chip jumper: 50mΩ max.

Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.8.18

Title:Drawing No: RMPC−K−HTS−0001/4
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND Pb<100ppm
RMPC04,06,10,16,20,32,35
Page: 10/14- RMPC10,16,20,32,35⋅ RMPC04,06
Insulation plate

Metal block measurement
Point A

Metal plate

R0.25∼R0.5mm
Measurement
point B
Insulation surface
Component

V

Pressure byspring (1±0.2N)

Figure−3
8. Taping
8.1 Applicable documents JIS C 0806−3: 2014, EIAJ ET−7200C: 2010
8.2 Taping dimensions
8.2.1 Press pocket taping (Paper taping, 8mm width, 2mm pitches)
Taping dimensions shall be in accordance with Figure−4 and Table−5.
Unit: mm4±0.05
Sprocket holet1

φ1.5 +0.101.75±0.1

B

8±0.2

A

t3

2±0.05Carrier cavity

t2

3.5±0.05
Direction of unreeling

Figure−4
Table−5
Style
RMPC04
RMPC06A
0.24±0.03
0.37±0.05

B
0.45±0.03
0.67±0.05

t1
0.31±0.03
0.42±0.03t2
0.36±0.03
0.45±0.05

Unit: mmt3
0.15±0.02
0.27±0.02

Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.8.18

Title:Drawing No: RMPC−K−HTS−0001/4
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND Pb<100ppm
RMPC04,06,10,16,20,32,35
Page: 11/14

8.2.2 Paper taping (8mm width, 2mm pitches)
Taping dimensions shall be in accordance with Figure−5 and Table−6.
4±0.1

t1

Sprocket hole

Unit: mm
1.75±0.1

φ1.5 +000.1

B

8±0.2

A

t2

2±0.05Carrier cavity

3.5±0.05
Direction of unreeling

Style
RMPC10A
0.65+0.05−0.10

Figure−5
Table−6B
1.15 −+0.05
0.10

t1
0.4 ± 0.05

Unit: mmt2
0.5max.

8.2.3 Paper taping (8mm width, 4mm pitches)
Taping dimensions shall be in accordance with Figure−6 and Table−7.
Unit: mm4±0.1
t1

Sprocket hole2±0.05

φ1.5 +0.101.75±0.1

B

8±0.2

A

t2

Carrier cavity

4±0.1

3.5±0.05
Direction of unreeling

Style
RMPC16
RMPC20
RMPC32

Figure−6
Table−7AB
1.15±0.15
1.9±0.2
1.65±0.15
2.5±0.2
2.00±0.15
3.6±0.2t1
0.6±0.1

Unit: mmt2
0.8max.

0.8±0.1

1.0max.

Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.8.18

Title:Drawing No: RMPC−K−HTS−0001/4
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND Pb<100ppm
RMPC04,06,10,16,20,32,35
Page: 12/14

8.2.4 Embossed taping dimensions shall be in accordance with Figure−7 and Table−8.
Unit: mm
0.3 max.
2±0.05
Sprocket hole

φ1.5+0.101.75±0.1

4±0.1

Carrier cavity

t1

Style
RMPC35A
2.85±0.20

W

B

E

A

4±0.1

Direction of unreeling

Figure−7
Table−8BW
3.5±0.2
8.0±0.2E
3.5±0.05

Unit: mmt1
1.0±0.2

1). The cover tapes shall not cover the sprocket holes.
2). Tapes in adjacent layers shall not stick together in the packing.
3). Components shall not stick to the carrier tape or to the cover tape.
4). Pitch tolerance over any 10 pitches ±0.2mm.
5). The peel strength of the top cover tape shall be with in 0.1N to 0.5N on the test method as shown in thefollowing RMPC04,06: Figure−8, RMPC10,16,20,32: Figure−9, RMPC35: Figure−10.
6). When the tape is bent with the minimum radius for 25 mm the tape shall not be damaged and the components shall maintaintheir position and orientation in the tape.
7). In no case shall there be two or more consecutive components missing.
The maximum number of missing components shall be one or 0.1%, whichever is greater.
8). The resistors shall be faced to upward at the over coating side in the carrier cavity.
Top cover tape
Carrier tape
165°to180°

Peel−off( About 300mm/ min)Direction of unreeling

Figure−8
Top cover tape
Carrier tape
165°to180°

Peel−off( About 300mm/ min)Direction of unreeling

Figure−9

Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.8.18

Title:Drawing No: RMPC−K−HTS−0001/4
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND Pb<100ppm
RMPC04,06,10,16,20,32,35
Page: 13/14

Top cover tape
Carrier tape
165°to180°

Peel−off(About 300mm/ min)Direction of unreeling

Figure−10
8.3 Reel dimension
Reel dimensions shall be in accordance with the following Figure−11 and Table−9.
Plastic reel (Based on EIAJ ET−7200C)
Unit: mm

0

+1
φ60 0

φ13±0.22±0.5φ180 −1.5

Marking A

φ21±0.8

Marking B

A

B

Figure−11
Table−9A

Unit: mm
B
Note
Style
Injection molding
11.4±1.0
RMPC04,06,10,16,20,32,35
9 +1.0013±1.0Vacuum forming
Note: Marking label shall be marked on a place of Marking A or two place of marking A and B.
8.4 Leader and trailer tape.
400mm min.
100mm min.

160mm min.
End

Start
Trailer

LeaderDirection of unreeling

Figure−12

Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.8.18

Title:Drawing No: RMPC−K−HTS−0001/4
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND Pb<100ppm
RMPC04,06,10,16,20,32,35
Page: 14/14

9. Marking on package
The label of a minimum package shall be legibly marked with follows.
9.1 Marking A(1) Classification(Style, Temperature coefficient of resistance, Rated resistance, Tolerance on rated resistance, Packaging form)(2) Quantity (3) Lot number (4) Manufacturer’s name or trade mark (5) Others
9.2 Marking B (KAMAYA Control label)

Product specification contained in this specification are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.8.18