Datasheet SHT3x-ARP
Humidity and Temperature Sensor IC▪ Fully calibrated, linearized, and temperaturecompensated analog output▪ Wide supply voltage range, from 2.4 V to 5.5 V▪ 10% to 90% ratiometric analog voltage output▪ Typical accuracy of  2%RH and  0.3°C▪ Parallel measurement of temperature and humidity
at separate pins
▪ Tiny 8-Pin DFN package
Product Summary
SHT3x-ARP is the next generation of Sensirion’s
temperature and humidity sensors. It builds on a new
CMOSens® sensor chip that is at the heart of Sensirion’s
new humidity and temperature platform. The SHT3xARP has increased intelligence, reliability and improved
accuracy specifications. Its functionality includes
enhanced signal processing, temperature and humidity

can be read out at different pins. The DFN package has
a footprint of 2.5 x 2.5 mm2 while keeping a height of 0.9
mm. This allows for integration of the SHT3x-ARP into agreat variety of applications. Additionally, the wide
supply voltage range of 2.4 V to 5.5 V guarantees
compatibility with diverse assembly situations. All in all,the SHT3x-ARP incorporates 15 years of knowledge of
Sensirion, the leader in the humidity sensor industry.

Benefits of Sensirion’s CMOSens® Technology▪

High reliability and long-term stability▪

Industry-proven technology with a track record of
more than 15 years▪

Designed for mass production▪

High process capability▪

High signal-to-noise ratio

Content
1

Sensor Performance.............................................2

2

Specifications .......................................................53

Pin Assignment ....................................................7

4

Operation and Communication .............................85

Packaging...........................................................10

6

Shipping Package ..............................................12

7

Quality ................................................................12

8

Ordering Information...........................................13

9

Further Information .............................................13

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Figure 1 Functional block diagram of the SHT3x-ARP. The
sensor signals for humidity and temperature are factory
calibrated, linearized and compensated for temperatureand supply voltage dependencies.

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Datasheet SHT3x-ARP

1

Sensor Performance

Humidity Sensor Specification
Parameter
SHT30 Accuracy tolerance1
SHT31 Accuracy tolerance1
Repeatability2
Resolution
Integrated Non-Linearity3
Hysteresis
Specified range4
Response time6
Long-term drift
Sensitivity

Conditions

Value

Units

Typ.
Max.
Typ.
Max.
Typ.
Typ.
at 25°C
extended5
63%
Typ.7
VDD=2.4 V
VDD=3.3V
VDD=5.0V
VDD=5.5V

3
Figure 2
2
Figure 3
0.1
0.01
0.2
0.8
0 to 100
8
<0.25
19.2
26.4
40.0
44.0

%RH
%RH
%RH
%RH
%RH
%RH
%RH
s
%RH/yrmV/%RHmV/%RHmV/%RHmV/%RH

Table 1 Humidity sensor specification

Temperature Sensor Specification
Parameter

Condition

Value

Units

SHT30 Accuracy tolerance1

Typ., 0°C to 65°C

0.3

°C

SHT31 Accuracy tolerance1

Typ., 0°C to 90°C

0.3
0.06
0.01
-40 to 125

°C

>2

s

<0.03
11.0
15.1
22.9
25.1

°C/yr
mV/°C
mV/°C
mV/°C
mV/°C

Repeatability2
Resolution
Specified Range

Typ.
-

Response time8

63%
Max.
VDD=2.4 V
VDD=3.3V
VDD=5.0V
VDD=5.5V

Long Term Drift

Sensitivity

°C
°C
°C

Table 2 Temperature sensor specification

1 For definition of typical and maximum accuracy tolerance, please refer to the document “Sensirion Humidity Sensor Specification Statement”.
2 The stated repeatability is 3 times the standard deviation (3σ) of multiple consecutive measurements at constant ambient conditions. It is a measure for the noise on

the physical sensor output. It is measured with analog circuit and integrated over 1 second.
3 Maximum deviation from the ideal shape (linear curve)
4 Specified range refers to the range for which the humidity or temperature sensor specification is guaranteed.
5 For details about recommended humidity and temperature operating range, please refer to section 1.1.
6 Time for achieving 63% of a humidity step function, valid at 25°C and 1m/s airflow. Humidity response time in the application depends on the design-in of the sensor.
7 Typical value for operation in normal RH/T operating range, see section 1.1. Maximum value is < 0.5 %RH/yr. Value may be higher in environments with vaporized
solvents, out-gassing tapes, adhesives, packaging materials, etc. For more details please refer to Handling Instructions.
8 Temperature response times strongly depends on the design-in of the sensor in the final application. Minimal response time can be achieved when the thermalized

sensor at T1 is placed on a well conducting surface with temperature T2.

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Datasheet SHT3x-ARP

Humidity Sensor Performance Graphs
SHT30

SHT31

DRH (%RH)±8±8maximal tolerance
typical tolerance±6

DRH (%RH)
maximal tolerance
typical tolerance

±6

±4

±4

±2

±2
±0

±0
0

10

20

30

40

50

SHT30

60 70 80 90 100
Relative Humidity (%RH)

Figure 2 Tolerance of RH at 25°C for SHT30

0
10
SHT31

20

30

40

50

60 70 80 90 100
Relative Humidity (%RH)

Figure 3 Tolerance of RH at 25°C for SHT31

SHT30

SHT31

RH (%RH)
100 ±4.5 ±4.5 ±4.5 ±4.5 ±4.5 ±4.5 ±4.5 ±4.5 ±4.5
90 ±3
±3
±3
±3
±3
±3
±3
±3
±3
80 ±3
±3
±3
±3
±3
±3
±3
±3
±3
70 ±3
±3
±3
±3
±3
±3
±3
±3
±3
60 ±3
±3
±3
±3
±3
±3
±3
±3
±3
50 ±3
±3
±3
±3
±3
±3
±3
±3
±3
40 ±3
±3
±3
±3
±3
±3
±3
±3
±3
30 ±3
±3
±3
±3
±3
±3
±3
±3
±3
20 ±3
±3
±3
±3
±3
±3
±3
±3
±3
10 ±3
±3
±3
±3
±3
±3
±3
±3
±3
0 ±4.5 ±4.5 ±4.5 ±4.5 ±4.5 ±4.5 ±4.5 ±4.5 ±4.5
0
10
20
30
40
50
60
70
80
Temperature (°C)

RH (%RH)
100 ±2
90 ±2
80 ±2
70 ±2
60 ±2
50 ±2
40 ±2
30 ±2
20 ±2
10 ±2
0 ±2
0

Figure 4 Typical tolerance of RH over T for SHT30

Figure 5 Typical tolerance of RH over T for SHT31

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±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
10

±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
20
30
40
50
Temperature (°C)

±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
60

±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
70

±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
±2
80

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Datasheet SHT3x-ARP

Temperature Sensor Performance Graphs
SHT30

SHT31

DT (°C)±1.5

DT (°C)±1.5
maximal tolerance

maximal tolerance

typical tolerance

typical tolerance

±1.0

±1.0

±0.5

±0.5

±0.0
-40

-20

0

20

40

60

80

100

120

±0.0
-40

Temperature (°C)

-20

0

20

40

60

80

100

120

Temperature (°C)

Figure 6 Temperature accuracy of the SHT30 sensor at Figure 7 Temperature accuracy of the SHT31 sensor at
VDD = 4.5V…5.5V.
VDD = 4.5V…5.5V.

1.1

Recommended Operating Condition

The sensor shows best performance when operated within recommended normal temperature and humidity range of 5 –60 °C and 20 – 80 %RH, respectively. Long term exposure to conditions outside normal range, especially at high humidity,
may temporarily offset the RH signal (e.g. +3%RH after 60h at >80%RH). After returning into the normal temperature andhumidity range the sensor will slowly come back to calibration state by itself. Prolonged exposure to extreme conditions
may accelerate ageing. To ensure stable operation of the humidity sensor please consult the document “Handling
Instructions SHT”. Please note as well that this does apply not only to transportation and manufacturing, but also tooperation of the SHT3x-ARP.

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Datasheet SHT3x-ARP

2

Specifications

2.1

Electrical Specifications

Parameter

SymbolSupply voltage
Power-up/down level

VDD
VPOR

Slew rate change of the
supply voltage

IDD

Resistive load to VSS

RL

Min

Typ.

Max

Units Comments

2.4
1.8

3.3
2.3

5.5
2.4

V
V

-

-

20

Voltage changes on the
VDD line between
VDD,min and VDD,max
V/ms should be slower thanthe maximum slew rate;
faster slew rates maylead to reset

Average at T=25°C

-

220

300

A

Average at
T=125°C

-

270

-

A

50

>1000

-

kOhm

VDD,slew

Supply current

Capacitive load

Condition

CL

1

3.9

5

nF

At resistive load 1MOhm

Capacitance that can be
driven by the sensor on
the signal lines. The
typical value isrecommended for
improved EMC
robustness.

Table 3 Electrical specifications, typical values are valid for T=25°C, min. & max. values for T=-40°C … 125°C.

2.2

Timing Specification for the Sensor System

Parameter

SymbolConditions

Min.

Typ.

Max.

Power-up timetPU

After hard reset,
VDD ≥ VPOR

-

-

17

Analog output settling time

AOsettle

For a step of VDD/2-

0.3

Duration of reset pulse

tRESETN

1--

Units Comments
Time between VDD reaching
ms VPOR and first measurement
signal available
Time needed for adapting to achanging supply voltage andmeasurement value. Valuemsdepends on output load.
Typical value is for a load of
1nF.
us See section 3.3

Table 4 System Timing Specification, valid from -40 °C to 125 °C and 2.4 V to 5.5 V.

2.3

Absolute Minimum and Maximum Ratings

Stress levels beyond those listed in Table 5 may cause permanent damage to the device or affect the reliability of thesensor. These are stress ratings only and functional operation of the device at these conditions is not guaranteed. Ratings
are only tested each at a time.

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Datasheet SHT3x-ARP
Parameter
Supply voltage VDD
Max Voltage on pins (pin 1 (RH); pin 2 (R); pin 3 (R); pin 4(T); pin 6 (nRESET))
Input current on any pin
Operating temperature range
Storage temperature range
ESD HBM (human body model)9
ESD CDM (charge device model)10

RatingUnits-0.3 to 6-0.3 to VDD+0.3±100-40 to 125-40 to 150
4
750

V
V
mA
°C
°C
kV
V

Table 5 Minimum and maximum ratings; values may only be applied for short time periods.

9 According to ANSI/ESDA/JEDEC JS-001-2014; AEC-Q100-002
10 According to ANSI/ESD S5.3.1-2009; AEC-Q100-011.

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Datasheet SHT3x-ARP

3

Pin Assignment

The SHT3x-ARP comes in a tiny 8-pin DFN package – see Table 6.
Pin

Name

1
2
3
4
5

RH
R
R
T
VDD

6

nRESET

7
8

R
VSS

Comments
Analog voltage out; output
No electrical function; recommended to connect to VSS
No electrical function; recommended to connect to VSS
Analog voltage out; output
Supply voltage; input
Reset pin active low; input; if not used it is recommended to be left floating; can beconnected to VDD with a series resistor of R ≥2 kΩ
No electrical function; to be connected to VSS
Ground

1

8

2

7

3

6

4

5

Table 6 SHT3x-ARP pin assignment (transparent top view). Dashed lines are only visible if viewed from below. The die pad is internallyconnected to VSS.

3.1

Power Pins (VDD, VSS)

The electrical specifications of the SHT3x-ARP are shown in Table 3. The power supply pins must be decoupled with a
100 nF capacitor that shall be placed as close to the sensor as possible – see Figure 8 for a typical application circuit.

3.2

Temperature and Humidity Pin

The physical output of temperature and humidity can be read out at separated pins, as shown in Table 6. Data is supplied
as ratiometric voltage output. The specification of the analog voltage signal and its conversion to physical values is
explained in Section 4.

3.3

nRESET Pin

The nReset pin may be used to generate a reset of the sensor. A minimum pulse duration of 1 µs is required to reliably
trigger a reset of the sensor. If not used it is recommended to leave the pin floating or to connect it to VDD with a series
resistor of R ≥2 kΩ. In addition, the nRESET pin is internally connected to VDD with a pull up resistor of R = 50 kΩ (typ.).

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Datasheet SHT3x-ARP

VDD

nRESET(6)VDD(5)
T(4)
RH(1)

die
pad

VSS(8)

100nF
1nF
1nF

R(2,3,7)Figure 8 Typical application circuit. Please note that thepositioning of the pins does not reflect the position on thereal sensor. This is shown in Table 6.

3.4

Die Pad (center pad)

The die pad or center pad is visible from below and located in the center of the package. It is electrically connected to
VSS. Hence electrical considerations do not impose constraints on the wiring of the die pad. However, due to mechanicalreasons it is recommended to solder the center pad to the PCB. For more information on design-in, please refer to the
document “SHTxx_STSxx Design Guide”.

4

Operation and Communication

4.1

Start-up of the sensor

The sensor starts up after reaching the power-up threshold voltage VPOR specified in Table 3. After reaching this thresholdvoltage the sensor needs the time tPU until the first measurement signal is available as voltage output on the respective
output pins. During that time the temperature and humidity pins have an undefined state.

4.2

Conversion of the Signal Output

The physical values as measured by the sensor are mapped to a ratiometric voltage output (VT, VRH as 10 to 90% of VDD).
Prior to conversion into a voltage signal, the physical values are linearized and compensated for temperature and supply
voltage effects by the sensor. Additionally, the voltage output is calibrated for each sensor. Hence the relationship between
temperature and humidity and the voltage output is the same for each sensor, within the limits given by the accuracy (Table
1 and Table 2).
This allows to describe the relationship between physical values (RH and T) and the voltage output for temperature andhumidity (VT, VRH) through a generic linear formula given by equations (1), (2) and (3); its graphical representation can befound in Figure 9 & Figure 10.

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Relative Humidity (%)

Datasheet SHT3x-ARP
100
90
80
70
60
50
40
30
20
10
0
0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

Voltage out (VRH/VDD)
Figure 9 Relationship between the ratiometric analog voltage output and the measured relative humidity.

RH = −12.5 + 125 

VRH
10 100 VRH
=−
+

VDD
0.8 0.8 VDD

(1)

251

115
95

201

75

151

55
35

101

15

51

Temperature (°F)

Temperature (°C)

Equation (1) describes the conversion formula for the RH signal.

-5
1

-25
-45
0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

-49
100%

Voltage out (VT/VDD)
Figure 10 Relationship between the ratiometric analog voltage output and the measured temperatureVT
17.5 175 VT= − 45 −+
VDD
0.8 0.8 VDD(2)

VT
31.5 315 VT= − 49 −+
VDD
0.8 0.8 VDD(3)T C = − 66.875 + 218.75 T  F  = − 88.375 + 393.75 Equations (2) and (3) describe the conversion formulae for the temperature signal in °C and °F.
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Datasheet SHT3x-ARP

5

Packaging

SHT3x-ARP sensors are provided in an open-cavity DFN
package. DFN stands for dual flat no leads. The humidity
sensor opening is centered on the top side of the
package.
The sensor chip is made of silicon and is mounted to alead frame. The latter is made of Cu plated with
Ni/Pd/Au. Chip and lead frame are overmolded by anepoxy-based mold compound leaving the central die pad
and I/O pins exposed for mechanical and electricalconnection. Please note that the side walls of the sensor
are diced and therefore these diced lead frame surfaces
are not covered with the respective plating.

The bottom line consists of 6 letters. The first two digits
XY (=AR) describe the output mode. The third letter (A)represents the manufacturing year (4 = 2014, 5 = 2015,etc). The last three digits (BCD) represent analphanumeric tracking code. That code can be decodedby Sensirion only and allows for tracking on batch level
through production, calibration and testing – and will be
provided upon justified request.
If viewed from below pin 1 is indicated by triangularshaped cut in the otherwise rectangular die pad. The
dimensions of the triangular cut are shown in Figure 12
through the labels T1 & T2.

SHT 3 xThe package (except for the humidity sensor opening)
follows JEDEC publication 95, design registration 4.20,
small scale plastic quad and dual inline, square andrectangular, No-LEAD packages (with optional thermalenhancements) small scale (QFN/SON), Issue D.01,
September 2009.

5.1

Traceability

XYABCDAll SHT3x-ARP sensors are laser marked for easy
identification and traceability. The marking on the sensor
top side consists of a pin-1 indicator and two lines of text.
The top line consists of the pin-1 indicator which islocated in the top left corner and the product name. The
small letter x stands for the accuracy class.

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Figure 11 Top View of the SHT3x-ARP illustrating the laser
marking.

.

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Datasheet SHT3x-ARP

5.2

Package Outline

T1 x T2

b

E

E2

e

S

D

A

L

D2

Figure 12 Dimensional drawing of SHT3x-ARP sensor package.

Parameter
Package height
Leadframe height
Pad width
Package widthCenter pad length
Package length
Center pad width
Pad pitch
Pad length

SymbolMin

Nom.

Max Units Comments

A
A3

0.8
-

0.9
0.2

1
-

mm
mm

b
D
D2
E
E2
e
L
S

0.2
2.4
1
2.4
1.7
0.25
-

0.25
2.5
1.1
2.5
1.8
0.5
0.35
-

0.3
2.6
1.2
2.6
1.9
0.45
1.5

mm
mm
mm
mm
mm
mm
mm
mm

Max cavity
Center pad marking

T1xT2

0.3x45°mm

Not shown in the drawing

Only as guidance. This value includes all tolerances,including displacement tolerances. Typically the
opening will be smaller.
indicates the position of pin 1

Table 7 Package outline

5.3

Land PatternFigure 13 shows the land pattern. The land pattern isunderstood to be the open metal areas on the PCB, onto
which the DFN pads are soldered.
The solder mask is understood to be the insulating layer
on top of the PCB covering the copper traces. It is
recommended to design the solder mask as a NonSolder Mask Defined (NSMD) type. For NSMD pads, thesolder mask opening should provide a 60 μm to 75 μm
design clearance between any copper pad and solder
mask. As the pad pitch is only 0.5 mm we recommend tohave one solder mask opening for all 4 I/O pads on one
side.

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For solder paste printing it is recommended to use alaser-cut, stainless steel stencil with electro-polishedtrapezoidal walls and with 0.1 or 0.125 mm stencil
thickness. The length of the stencil apertures for the I/O
pads should be the same as the PCB pads. However,the position of the stencil apertures should have an offset
of 0.1 mm away from the center of the package. The die
pad aperture should cover about 70 – 90 % of the die
pad area –thus it should have a size of about 0.9 mm x
1.6 mm.
For information on the soldering process and further
recommendation on the assembly process please
consult the Handling Instruction SHT, which can befound on the Sensirion webpage.

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Datasheet SHT3x-ARP

Recommended Stencil Aperture

2.35

2.55

0.5

1.6

0.25

0.5

0.5

1.7

0.5

0.25

0.5

0.5

Recommended Land Pattern

0.2

1

0.3

0.55

0.9

0.55

Figure 13 Recommended metal land pattern (left) and stencil apertures (right) for the SHT3x-ARP. The dashed lines represent theouter dimension of the DFN package. The PCB pads (left) and stencil apertures (right) are indicated through the shaded areas.

6

Shipping Package
Ø1.5 +.1 /-0.0
4.00
2.00 ±.05 SEE Note 2

Ø1.00 MIN
1.75 ±.1

4.00 SEE Note 10.30 ±.05

A

5.50 ±.05
SEE NOTE 2

R 0.2 MAX.
B0
B

12.0 +0.3/-0.1
A

R 0.25 TYP.

K0
A0

SECTION A - A

A0 = 2.75
B0 = 2.75
K0 = 1.20
TOLERANCES - UNLESSNOTED 1PL ±.2 2PL ±.10

NOTES:
1. 10 SPROCKET HOLE PITCH CUMULATIVE TOLERANCE ±0.2
2. POCKET POSITION RELATIVE TO SPROCKET HOLE MEASURED
AS TRUE POSITION OF POCKET, NOT POCKET HOLE
3. A0 AND B0 ARE CALCULATED ON A PLANE AT A DISTANCE "R"ABOVE THE BOTTOM OF THE POCKETDETAIL B

Figure 14 Technical drawing of the packaging tape with sensor orientation in tape. Header tape is to the right and trailer tape to theleft on this drawing. Dimensions are given in millimeters.

7

Quality

Qualification of the SHT3x-ARP is performed based on the AEC Q 100 qualification test method.

7.1

Material Contents

The device is fully RoHS and WEEE compliant, e.g. free of Pb, Cd, and Hg.
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Datasheet SHT3x-ARP

8

Ordering Information

The SHT3x-ARP can be ordered in tape and reel packaging with different sizes, see Table 8. The reels are sealed into
antistatic ESD bags. The document “SHT3x shipping package” that shows the details about the shipping package isavailable upon request.
Name

Quantity

Order Number

SHT30-ARP-B2.5kS
SHT30-ARP-B10kS
SHT31-ARP-B2.5kS
SHT31-ARP-B10kS

2500
10000
2500
10000

1-101381-01
1-101175-01
1-101385-01
1-101178-01

Table 8 SHT3x-ARP ordering options.

9

Further Information

For more in-depth information on the SHT3x-ARP and its application please consult the following documents:
Document Name

Description

SourceSHT3x Shipping Package

Information on Tape, Reel and shipping bags
(technical drawing and dimensions)

Available upon request

SHTxx_STSxx Design Guide

Design guidelines for designing SHTxx/STSxx
sensors into applications

Available for download at theSensirion humidity sensors download
center: www.sensirion.com/humiditydownload

SHTxx Handling Instructions

Available for download at the
Guidelines for proper handling of SHTxx humidity Sensirion humidity sensors download
sensors (Reconditioning Procedure)
center: www.sensirion.com/humiditydownload

Sensirion Humidity Sensor
Specification Statement

Available for download at theSensirion humidity sensors download
center: www.sensirion.com/humiditydownload

Definition of sensor specifications.

Table 9 Documents containing further information relevant for theSHT3x-ARP.

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Datasheet SHT3x-ARP

Revision History
Date

VersionPage(s)Changes

October 2015

1

January 2016

2

12

Update ordering information

September 20183

multiple

Typo & formatting correction

December 2022

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4

Initial release2

Added sensitivity at VDD=5.0V in Table 1

2

Added sensitivity at VDD=5.0V and refined resolution in Table 2

4

Limitation of T accuracies to VDD=4.5V...5.5V and refined max. accuracies in
Figure 64Limitation of T accuracies to VDD=4.5V...5.5V and refined max and typ.
accuracies in Figure 7

5

Table 3: Updated VPOR, RL and CL values; replaced “Output current” with
“Resistive load to VSS”; more detailed specification of supply current; refinedtable caption;

5

Updated duration of reset pulse in Table 45Introduced “Ratings are only tested each at a time” in section 2.3.

6

Updated Footnotes 9 and 10

7

Updated nRESET description in Table 6

7Updated nRESET description in section 3.3

8

Updated capacitor values and connect. in typ. application circuit in Figure 8

11

Updated min. & max. values of pad length in Table 7

13

Removed obsolete document from Table 9 as it is covered in handling
instructions

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Datasheet SHT3x-ARP

Important Notices
Warning, Personal Injury
Do not use this product as safety or emergency stop
devices or in any other application where failure of the
product could result in personal injury. Do not use thisproduct for applications other than its intended andauthorized use. Before installing, handling, using orservicing this product, please consult the data sheet andapplication notes. Failure to comply with these instructions
could result in death or serious injury.
If the Buyer shall purchase or use SENSIRION products for any
unintended or unauthorized application, Buyer shall defend,
indemnify and hold harmless SENSIRION and its officers,
employees, subsidiaries, affiliates and distributors against all
claims, costs, damages and expenses, and reasonable attorneyfees arising out of, directly or indirectly, any claim of personal
injury or death associated with such unintended or unauthorizeduse, even if SENSIRION shall be allegedly negligent withrespect to the design or the manufacture of the product.
ESD Precautions
The inherent design of this component causes it to be sensitive
to electrostatic discharge (ESD). To prevent ESD-induced
damage and/or degradation, take customary and statutory ESD
precautions when handling this product.
See application note “ESD, Latchup and EMC” for more
information.
Warranty
SENSIRION warrants solely to the original purchaser of thisproduct for a period of 12 months (one year) from the date ofdelivery that this product shall be of the quality, material andworkmanship defined in SENSIRION’s published specificationsof the product. Within such period, if proven to be defective,
SENSIRION shall repair and/or replace this product, in
SENSIRION’s discretion, free of charge to the Buyer, provided
that:•notice in writing describing the defects shall be given to
SENSIRION within fourteen (14) days after theirappearance;•such defects shall be found, to SENSIRION’s reasonablesatisfaction, to have arisen from SENSIRION’s faulty
design, material, or workmanship;•
the defective product shall be returned to SENSIRION’s
factory at the Buyer’s expense; and•the warranty period for any repaired or replaced productshall be limited to the unexpired portion of the original
period.
This warranty does not apply to any equipment which has notbeen installed and used within the specifications recommended
by SENSIRION for the intended and proper use of theequipment. EXCEPT FOR THE WARRANTIES EXPRESSLYSET FORTH HEREIN, SENSIRION MAKES NO
WARRANTIES, EITHER EXPRESS OR IMPLIED, WITHRESPECT TO THE PRODUCT. ANY AND ALL WARRANTIES,INCLUDING WITHOUT LIMITATION, WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULARPURPOSE, ARE EXPRESSLY EXCLUDED AND DECLINED.
SENSIRION is only liable for defects of this product arisingunder the conditions of operation provided for in the data sheet
and proper use of the goods. SENSIRION explicitly disclaims all
warranties, express or implied, for any period during which thegoods are operated or stored not in accordance with thetechnical specifications.
SENSIRION does not assume any liability arising out of any
application or use of any product or circuit and specificallydisclaims any and all liability, including without limitationconsequential or incidental damages. All operating parameters,
including without limitation recommended parameters, must be
validated for each customer’s applications by customer’s
technical experts. Recommended parameters can and do varyin different applications.
SENSIRION reserves the right, without further notice, (i) tochange the product specifications and/or the information in thisdocument and (ii) to improve reliability, functions and design ofthis product.
Copyright © 2020, by SENSIRION.
CMOSens® is a trademark of Sensirion
All rights reserved

Headquarters and Subsidiaries
SENSIRION AG
Laubisrütistrasse 50
8712 Stäfa
Switzerland

Sensirion Inc. USA
phone: +1 312 690 5858
info-us@sensirion.com
www.sensirion.com

Sensirion Korea Co. Ltd.
phone: +82 31 337 7700~3
info-kr@sensirion.com
www.sensirion.co.kr

phone: +41 44 306 40 00
fax:+41 44 306 40 30
info@sensirion.com
www.sensirion.com

Sensirion Japan Co. Ltd.
phone: +81 3 3444 4940
info-jp@sensirion.com
www.sensirion.co.jp

Sensirion China Co. Ltd.
phone: +86 755 8252 1501
info-cn@sensirion.com
www.sensirion.com.cn/

Sensirion Taiwan Co. Ltd.
phone: +41 44 306 40 00

To find your local representative, please visit www.sensirion.com/contact

info@sensirion.com

www.sensirion.com

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