X8011-II PCBVery Precise Offline X-rays—
Intelligently Networked and			 Future-Oriented!
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Brilliant Quality, Optimized Processes
Fast automatic inspection andhighly precise random sample
checking in one system
Very long service life, flexible use
THTs under angledradiation

Powerful open microfocus
transmission tube; sealed
direct beam tube optional
Highest magnifications andexcellent image quality
Use of high-quality
flat-screen detectors

QFP orthogonalradiation

Intuitive operation andcomprehensive analysis functions:
Viscom XMC and Viscom SIUpgrade possible with Viscom
proprietary computed tomography
EasyClick principle for easy
mounting of handling units
XVR-CT analysis by Viscom

Unique Quality Uplink for simplifiedclassification and process control
QFN orthogonalradiation

BGA under
angled radiation

Worldwide competent on-site service
hotline and remote maintenanceIn modern SMD production, components such as BGA, QFN or QFP are gaining ground. Because their connectors are mostly hidden, many solder joints
can only be reliably checked with an X-ray inspection.The high resolution X-ray
inspection system X8011-II PCB was developed especially for these tasks. Typical applications are, for example, the inspection of electronic assemblies andcomponents, quality assurance in power electronics, or non-destructive special inspections. With the X8011-II PCB, electronics manufacturers candraw on the first-class automatic analysis routines of the Viscom AXI family
X7056 with this off-line solution as well. Through the simultaneous availabilityof the automatic X-ray analysis (Viscom SI) and the manual or semi-automaticinspection (Viscom XMC), this system offers the highest flexibility.

First-class inspection results,the highest versatility
With the X8011-II PCB, Viscom offers a smart and economical X-ray inspection system. The
application scope reaches from random sample analysis and special inspection of individual components up to automatic start-up support and small series inspection.
Thanks to integration of the proven automatic SI inspection analyses, the system isideally suited for high-mix low-volume manufacture.
The heart of the X-ray technology is the open Viscom microfocus transmission tube (up to 200 kV) with high resolution. Optionally, a sealed direct beamtube (up to 130 kV), for example, can also be employed. Both tubes are distinguished by their stable X-ray radiation during continuous operation.
High resolution digital flat panel detectors are used for the highest
magnifications and optimum image quality for evaluation of X-rayimages. The practice-oriented, modular Viscom system concept offers
practically every individual user optimum inspection possibilities.
The Viscom XMC software is available on the system for special
inspections or non-standard components. With the intuitive operation and comprehensive analysis functions, the inspection objects can be easily and precisely checked. In addition, 3D reconstruction with the Viscom proprietary computed tomography isalso possible here. Thus, in addition to the improved localizationof defects, individual slices or section images can also be visualized with this process.
The very special strength of the system is the fully automatic
X-ray analysis with the Viscom SI software. It combines over 30
years of experience in assembly inspection and is especially oriented to SMD production. And so the well-known Viscom inspection
depth of the X7056 inline family is also available for the offline world.
Yet another advantage is the uniform user interface. This saves
training expense and facilitates communication between different inspection systems.

Viscom Quality Uplink:
SPI analyses/3D data

The practical feature Viscom Quality Uplink can be used for the X8011II PCB. By linking the inspection results from SPI, AOI, AXI and MXI, thisfunction provides a simplified classification and effective processcontrol. For example, all inspection data from the Viscom 3D solder paste
inspection can be displayed on the verification station of the X8011-II PCB.
Defect causes are easier to track down and process optimization is simplified. With these features, the system X8011-II PCB offers many possibilities inhigh performance X-ray inspection.

Universal, versatile exchangeable modules for perfect sample handling

Object table

Rotation module

Motorized rotation/tilt axis

CT axisTechnical Specifications
X8011-II PCB eco X8011-II PCB plus X8011-II PCB flex
X-ray technology
X-ray tube
Sealed direct beam tube or open microfocus			transmission tube (optionally also TXD X-ray tube, < 1.5 µm)
High voltage
10–130 kV / 10–160 kV / 10–200 kV
X-ray current
50–300 µA / 5–1000 µA
Target power
max. 20 W / max. 40 W 			max. 40 W
Geometric magnification
max. 35 times / max. 2650 times		
max. 2650 times
Image converter
High resolution				High resolution
Diagonal
7.3" FPD, 14 bit				11" FPD, 14 bit
Proven resolution< 16–50 µm / < 4 µm				< 4 µm
(at 90 kV/80 µA)
Detector swivel range0°		
0–60°			0–60°Additionally via therotation and tilt axis +/- 45° (90°)
X-ray cabinet	Designed to meet requirements for fully protected devices inaccordance with RöV (German X-ray Regulation), CE mark andadditional international standards.
Radiation leakage rate < 1 µSv/hSoftware
User interface
Viscom XMC / Viscom SI optional
Available software packages	BGA analysis software
QFN analysis software
THT analysis software
ACA analysis software (surface analysis)
Fully automatic Viscom SI analysis software
XVR-CT software
Verification station Viscom HARAN
Viscom Quality Uplink to AOI, AXI, and SPI from Viscom
for process optimization
System computer
Operating system
Monitor			

Windows®
High-resolution 24" LED display for special depiction ofgrayscale values in the SMT and electronics sectors

Sample handlingManipulator
X-Y-Z		X-Y-Z plus rotation module
Max. table travel range
Horizontal X/Y-axis: 460 x 435 mm (18.1" x 17.1")			
Vertical Z-axis: 290 mm (11.4")
Max. rotation module travel range		−Horizontal X/Y-axis: 350 x 430 mm (13.8" x 16.9")					Vertical Z-axis: 290 mm (11.4")
					n x 360°
Max. sample weight
10 kg (22 lbs) (with rotation module, 5 kg/11 lbs)
Sample change
Manual or motorized window opening
Optional additional axes available Yes
Other system data

Front view

230 V, 1 P/N/PG, 16 A
Approx. 1144 x 2007 x 1453 mm (W x H x D) (45" x 79" x 57.2")
Approx. 2100 kg (4630 lbs)

Side view

Top view

Dimensions in mm

Headquarters:
Viscom AG
Carl-Buderus-Straße 9–15 · 30455 Hanover · Germany
Tel.: +49 511 94996-0 · Fax: +49 511 94996-900
info@viscom.com · www.viscom.com

You will find our international subsidiaries andrepresentatives in Europe, the USA and Asia at:www.viscom.com

Subject to technical changes. Windows® and Intel® Core™ i7 are registered trademarks. April 2016

# Viscom_SYS_X8011-II_PCB_EN16040002

Connection values
System dimensions
Weight