Annual Technical Report 2019
FY2019Optoelectronics Industry and Technology Development Association

—CONTENTS—
Message from OITDA……………………………………………………………

1

Optoelectronics Industry Trends………………………………………………

2

Technological Strategy Development…………………………………………

9Standardization ………………………………………………………………… 11
Educational and Public Relations Activities ………………………………… 15
Supporting Members…………………………………………………………… 17

Message from OITDA

Yasuhisa Odani
President/Vice Chairman
Optoelectronics Industry and Technology
Development Association (OITDA)

It is my pleasure to issue “Annual Technical Report 2019” which outlines the result of our surveys and R&D activities in
FY2019.
OITDA has been promoting the formulation of a research and development strategy and commercialization strategy
through cooperation among industry, academia and government regarding the optoelectronics technologies. At the sametime, OITDA has engaged in the priority issues such as survey and research on the optoelectronics technology and industry,
promotion of technology development, and promotion of standardization.
You can find the details of our activities in this report. So, I would like to point out noteworthy events in FY 2019. First,
we have set up the sub-committee under the “Technology Strategy Formulation Committee” and developed the “Optical
Imaging and Sensing Technology Roadmap – Seeing the Unseen –.” The results of this activity were presented at the FY2019
Symposium on the Optoelectronics Industry and Technology, which was held at the Rihga Royal Hotel Tokyo on Wednesday,
February 19th, 2020. This roadmap includes technologies for non-invasive measurement of human health status.
With regard to standardization, we actively carried out international standardization activities at IEC, ISO, and otherforums, primarily for the standardization of in-vehicle high-speed optical Ethernet, connectors for interconnection of opticalfibers, and silicon photonics interconnect and optical switches through the governmental project.
In order to support the growth of the optoelectronics industry and technology, OITDA will strengthen and enhance ouractivities in accordance with needs, under the guidance of the Ministry of Economy, Trade and Industry and other governmentalorganizations and with the understanding and cooperation of our supporting members and many other people from thebusiness world and the academic community who are our important partners. We look forward to your continued guidance,
support, and cooperation.

1

Annual Technical Report2019 OITDAOptoelectronics Industry Trends
1. Introduction

rate: −4.8%, component ratio: 69.7%) and 4,022 billion yen for opticalcomponents (growth rate: −5.0%, component ratio: 30.3%).
The shipments by field were:
487 billion yen for the optical communication field (growth rate: −3.3%,
component ratio: 3.7%),735 billion yen for the optical storage field (growth rate: −6.5%,
component ratio: 5.5%),
3,363 billion yen for the I/O field (growth rate: −8.3%, component
ratio: 25.3%),
5,306 billion yen for the display and solid-state lighting field (growth
rate: −5.2%, component ratio: 40.1%),
2,278 billion yen for the photovoltaic energy field (growth rate: −2.4%,
component ratio: 17.1%),
763 billion yen for the laser/optical processing field (growth rate: 4.6%,
component ratio: 5.7%),
and 244 billion yen for the sensing and measuring field (growth rate:
4.9%, component ratio: 1.8%).
● FY 2019 (estimate): 12,847 billion yen, growth rate: −3.3%
Total shipments for the optoelectronics industry in FY 2019 are
estimated to be 12,847 billion yen (growth rate: −3.3%). This breaks
down as: 8,811 billion yen for optoelectronics equipment/systems(growth rate: −4.9%, component ratio: 68.6%) and 4,036 billion yen
for optical components (growth rate: 0.3%, component ratio: 31.4%).
The shipments by field are estimated to be:
516 billion yen for the optical communication field (growth rate: 5.9%,
component ratio: 4.0%),661 billion yen for the optical storage field (growth rate: −10.0%,
component ratio: 5.1%),
3,416 billion yen for the I/O field (growth rate: 1.6%, component ratio:
26.6%),
4,942 billion yen for the display and solid-state lighting field (growth
rate: −6.9%, component ratio: 38.6%),
2,261 billion yen for the photovoltaic energy field (growth rate: −0.8%,
component ratio: 17.6%),
698 billion yen for the laser/optical processing field (growth rate:−8.5%, component ratio: 5.4%),
and 249 billion yen for the sensing and measuring field (growth rate:
2.1%, component ratio: 1.9%).
● FY 2020 (predictions): flat
Total shipments are projected to be flat for the optoelectronics industry
overall, as well as for optoelectronics equipment/systems and opticalcomponents in FY 2020. By field, the optical communication field, theI/O field, the display and solid-state lighting field, the photovoltaic energy
field, the laser/optical processing field, and the sensing and measuring
field will remain steady. The optical storage field will decrease slightly.

OITDA has conducted “Survey of Trends of the Optoelectronics
Industry” annually since its foundation in 1980. The accumulated survey
data of more than 40 years are highly regarded as the basic source forproperly recognizing the trend of optoelectronics industry.
This year, we have set seven research sub-committee under the“Optoelectronic Industry Trends Investigation Committee” and haveconducted survey for getting the statistical data from FY 2018 to FY
2020, including the shipment value and domestic production value ofentire optoelectronic industry.

2.	Total Shipments and Domestic Production for the
Optoelectronics Industry
2.1 Survey Method
1) We have sent the questionnaire for actual results for FY 2018,
estimated values for FY 2019, and qualitative predictions for FY 2020
concerning total shipments and domestic production to the Japanesecompanies which produce optoelectronics-related products(optoelectronics equipment/systems, optical components).
2) In addition to the questionnaire survey, we also referred to the dataof the Japan Photovoltaic Energy Association (JPEA), Japan Lighting
Manufacturers Association (JLMA), Japan Electronics and Information
Technology Industries Association (JEITA), Camera & Imaging
Products Association (CIPA), and Fuji Chimera Research Institute,
Inc. regarding the photovoltaic energy field, solid-state lighting field,
display field, and I/O field.
In the survey in FY2019, we changed the unit used to show thetotal shipments and domestic production in the summary sheet, frommillion yen to 100 million yen.
For the survey, we classified the optoelectronics industry, together
with relevant optical equipment/systems and components, into theseven fields shown below.
1. OpticalCommunication:

Optical transmission equipment/systems, opticalfiber fusion splicer, light emitting devices, photodetectors, optical passive components, opticalfiber, optical connectors, etc.

2. Optical Storage:

Optical disc equipment (read-only, recordable),
optical disc media, laser diodes, etc.

3. Input/Output(I/O):

Optical printers, multifunction printers, digital
cameras, digital video cameras, camera mobile
phones, image sensors, etc.

4. Display and Solid-

Flat panel display devices and equipment, projectors,

state Lighting:solid-state lighting devices and equipment, LED (forlighting and displays), etc.

5. Photovoltaic
Energy:Photovoltaic power generation systems, photovoltaic
cells and modules

6. Laser/Optical

Laser/optical processing equipment, lamp/LD

Processing:lithography, additive manufacturing (3D printers),

7. Sensing andOptical measuring instruments, optical sensing

2.3 Overview of Survey Results of Domestic Production
Table 2 shows the results of FY 2018 (actual), FY 2019 (estimate)and FY 2020 (predictions) for Domestic Production.
● FY 2018 (actual): 6,714 billion yen, growth rate: −7.4%
In FY 2018, the domestic production of the optoelectronics industry(actual) was 6,714 billion yen (growth rate: −7.4%). This breaks down
as: 4,084 billion yen for optoelectronics equipment/systems (growth
rate: −1.8%, component ratio: 60.8%) and 2,630 billion yen for opticalcomponents (growth rate: −15.0%, component ratio: 39.2%).
The domestic production by field was:388 billion yen for the optical communication field (growth rate: −3.7%,
component ratio: 5.8%),
90 billion yen for the optical storage field (growth rate: −31.6%,
component ratio: 1.3%),
941 billion yen for the I/O field (growth rate: −14.0%, component
ratio: 14.0%),

laser oscillators
Measuring:
8. Others:

equipment
Hybrid optical devices, etc.

2.2 Overview of Survey Results of Total Shipments
Table 1 shows the results of FY 2018 (actual), FY 2019 (estimate)and FY 2020 (predictions) for total shipments.
● FY 2018 (actual): 13,285 billion yen, growth rate: −4.8%
In FY 2018, total shipments (actual) for the optoelectronics industry
amounted to 13,285 billion yen (growth rate: −4.8%). This breaks down
as: 9,263 billion yen for optoelectronics equipment/systems (growth
Annual Technical Report2019 OITDA

2

Optoelectronics Industry Trends
2,568 billion yen for the display and solid-state lighting field (growth
rate: −9.0%, component ratio: 38.2%),
1,754 billion yen for the photovoltaic energy field (growth rate: −3.8%,
component ratio: 26.1%),
696 billion yen for the laser/optical processing field (growth rate:−2.6%, component ratio: 10.4%),
and 200 billion yen for the sensing and measuring field (growth rate:
9.3%, component ratio: 3.0%).
● FY 2019 (estimate): 6,347 billion yen, growth rate: −5.5%
The domestic production of the optoelectronics industry in FY 2019is estimated to be 6,347 billion yen (growth rate: −5.5%). This breaks
down as: 3,811 billion yen for optoelectronics equipment/systems(growth rate: −6.7%, component ratio: 60.0%) and 2,536 billion yen
for optical components (growth rate: −3.6%, component ratio: 40.0%).
The domestic production by field was:414 billion yen for the optical communication field (growth rate: 6.7%,
component ratio: 6.5%),75 billion yen for the optical storage field (growth rate: −17.4%,
component ratio: 1.2%),
941 billion yen for the I/O field (growth rate: 0.0%, component ratio:
14.8%),
2,439 billion yen for the display and solid-state lighting field (growth
rate: −5.0%, component ratio: 38.4%),
1,574 billion yen for the photovoltaic energy field (growth rate: −10.2%,
component ratio: 24.8%),626 billion yen for the laser/optical processing field (growth rate:−10.0%, component ratio: 9.9%),
and 200 billion yen for the sensing and measuring field (growth rate:
0.0%, component ratio: 3.2%).
● FY 2020 (predictions): Slight decrease
The domestic production of the optoelectronics industry in FY 2020is projected to decrease slightly. Optoelectronics equipment/systems
will be flat and optical components will decrease slightly.
By field, the optical communication field, the I/O field, thephotovoltaic energy field, the laser/optical processing field, and thesensing and measuring field will remain steady, while the optical storage
field the display and solid-state lighting field will decrease slightly.

decreased since smartphone decreased significantly and the market for
digital cameras also continued to shrink.
In the display and solid-state lighting field, both the total shipments
and domestic production decreased slightly since display elements
decreased significantly although 4K TVs and LED lighting fixtures
were firm.
In the optical storage field, the total shipments decreased slightly anddomestic production decreased due to continuing demand decline.
In the photovoltaic energy field, both the total shipments and domestic
production decreased due to price declines. However, the decrease wasslight since the significant downward trend associated with the change
in the Feed in Tariff (FIT) system had finally been put to a halt.
In the optoelectronics industry as a whole, the total shipments were
13,285 billion (growth rate: −4.8%) and the domestic production was
6,714 billion yen (−7.4%), resulting in a slight decrease.
● FY 2019 (estimate)In the optical communications field, both the total shipments anddomestic production are estimated to increase since optical transmission
equipment and systems as a whole will perform well due to an increasein domestic capital investments for 5G systems, and components suchas light-emitting elements and optical connectors also will stay firm.
In the I/O field, both the total shipments and domestic production are
estimated to be almost flat since a decrease in smartphones and digital
cameras will be compensated by an increase in image sensors and invehicle cameras.
In the laser/optical processing field, although excimer lasers have
performed well, capital investments mainly for semiconductor memories
and flat panel displays is forecast to decelerate. The total shipments anddomestic production will start to show negative growth.
In the sensing and measuring field, sensors such as laser radars are
estimated to stay firm, which will maintain positive growth in the total
shipments.
In the display and solid-state lighting field, price declines for 4K andlarge-screen TVs are likely to be accelerated despite demand increase,and LED lighting fixtures will grow slowly due to widespread use. Thus,
both the total shipments and domestic production are estimated todecrease slightly.
In the optical storage field, both the total shipments and domestic
production are estimated to decrease since demand decline continues
due to the progress of internet distribution.
In the photovoltaic energy field, the total shipments are estimated to
be almost flat due to price declines despite an increase in applications.
The domestic production is expected to decrease due to higher
dependency on overseas production.
In the optoelectronics industry as a whole, the total shipments (12,847
billion yen, growth rate: −3.3%) and domestic production (6,347 billion
yen, growth rate: −5.5%) are expected to decrease slightly following
the previous fiscal year.
● FY 2020 (predictions)
In the optical communications field, the total shipments and domestic
production are projected to remain flat since domestic capital investmentsfor 5G systems will continue.
In the I/O field, the total shipments and domestic production are
projected to remain flat due to the continuing tendency of a decrease insmartphones and digital cameras and an increase in image sensors.
In the laser/optical processing field and the sensing and measuring
field, although a slow recovery for facility capital investments forsemiconductors and others can be forecast, the total shipments anddomestic production are projected to be flat because favorable factors
are insufficient.
In the display and solid-state lighting fields, display elements willcontinue to decrease amid severe competition although high-value-added

2.4 Trend in Optoelectronics Industry
Fig.1 and Fig.2 show changes in the total shipment value of theoptoelectronics industry and trends in each field. Fig.3 and Fig.4 showchanges in the domestic production value of the optoelectronics industry
and changes by field. Fig.1 and Fig.3 show nominal GDP and electronic
industry production in order to compare changes in the scale of theoptoelectronics industry with those of the Japanese economy and otherindustries. Below is a summary of the survey and analysis results of thelatest survey.
● FY2018 (actual)
Due to the solid capital investment primarily in the semiconductor
and automotive industry, the total shipments in the laser/opticalprocessing field as well as the total shipments and domestic productionin the sensing and measuring field maintained a positive growth, whereas
the total shipments and domestic production in the other five fields
decreased or slightly decreased.
In the optical communication field, optical transmission components
for trunk/metro lines and subscriber lines started to increase due to anincrease in domestic facility capital investments for 5G systems, andoptical fibers and optical connectors stayed firm, whereas components
such as optical transmission links decreased due to competition withoverseas manufacturers; as a result, both the total shipments and domestic
production decreased slightly.
In the I/O field, both the total shipments and domestic production

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Annual Technical Report2019 OITDA

Table 1
Product Items

Optical Equipment

Optical Communications Field
Optical Transmission Equipment

Optical Component
Optical Equipment

FY 2019 Shipment Estimate(in 100 million yen) Growth Rate(%)

FY 2020 Shipment
Prediction

5,037

▲ 3.7

4,870

▲ 3.3

5,158

5.9

flat

1,352

▲ 6.6

1,362

0.7

1,585

16.4

flat

▲ 24.2

649

19.7

736

13.4

flat

Subscriber Line

417

8.0

378

▲ 9.4

430

13.8

flat

Router and Switch

326

19.4

261

▲ 19.9264

1.1 slight increase

67

▲ 8.2

Optical Fiber Amplifier
3,471

▲ 2.7

74
3,297

10.4
▲ 5.0

155

109.5 increase
2.4

flat

▲ 8.0

flat

3,376

Optical Transmission Link

806

4.7

553

▲ 31.4509

Light Emitting Device

550▲ 17.5

543

▲ 1.3

642

Photo Detectors

169▲ 28.7

179

5.9

150

▲ 16.2

Optical Passive Component

243

▲ 7.6

236

▲ 2.9

227

▲ 3.8 slight increase

18.2 slight increase

Optical Circuit Component

297

3.1

280

▲ 5.7

277

▲ 1.1

Optical Fiber

981

0.1

1,080

10.1

1,045

▲ 3.2

flat
flat
slight decrease

Optical Connector

269

17.0

271

0.7

312

15.1

flat

Others（Semiconductor Amplifying
Device, etc.）

156

16.4

155

▲ 0.6

214

38.1

flat

Optical Fiber Fusion Splicer
Optical Disk

214

0.9

211

▲ 1.4

197

▲ 6.6

7,861

▲ 5.3

7,349

▲ 6.5

6,611

▲ 10.0

▲ 4.8

7,248

▲ 6.2

6,530

7,729

Equipment

7,329

▲ 5.5

6,889

▲ 6.0

flat
slight decrease▲ 9.9

slight decrease

6,187▲ 10.2slight decrease

Read-only (CD, DVD, BD)

4,984

▲ 2.7

4,689

▲ 5.9

4,063

▲ 13.4slight decrease

Recordable

2,345▲ 11.1

2,200

▲ 6.2

2,124

▲ 3.5

slight decrease

Media

400

9.9

359

▲ 10.3343▲ 4.5

Laser Diode132▲ 26.7101▲ 23.581▲ 19.8Input/Output Field
Optical I/O Equipment

36,681
28,711

Security camera, Car-mounted camera *Image Sensor
Display and Solid-state Lighting Field
Display Equipment

0.3

24,988▲ 8.3

34,156▲ 13.023,307

1.6

decrease
flat

▲ 6.7

flat

▲ 2.1

6,884

▲ 2.4

flat

10,991－9,859▲ 10.38,805▲ 10.7

9,439

3.2

8,211

▲ 13.07,006▲ 14.7

Imaging equipment

Camera Mobile Phone

33,625
7,056

7,207

Digital Camera, Digital Video Camera

3.8

flat

0.0

Optical Printer・Multifunction Printer

Others (Barcode Reader, Image
Scanner, etc.)

Optical Equipment

FY 2018 Shipment Actual(in 100 million yen) Growth Rate(%)

542

Optical Storage Field

Optical Equipment

FY 2017 Shipment Actual(in 100 million yen) Growth Rate(%)

Truck Line and Metro Line

Optical Transmission Components

flatslight decrease

1,552

－

1,648

6.2

1,799

9,690

▲ 0.8

7,443

▲ 23.2

7,088

▲ 4.8

flat

823

▲ 12.6630▲ 23.5530▲ 15.9

flat

7,970

17.4

8.4

8,637

10,8499.2 slight increase

25.6 slight increase

55,967

6.0

53,060▲ 5.2

49,417

▲ 6.9

flat

26,81715.2

26,146▲ 2.5

25,125

▲ 3.9

flat

Flat Panel Display

23,925

15.9

23,594▲ 1.4

22,768

▲ 3.5

flat

Projector

2,741

9.9

2,392

▲ 12.7

2,190

▲ 8.4

flat

Large-scale LED Display

151

Display Device

18,704

Solid-state Lighting

6,937

11.9

160

▲ 2.2

16,326

3.1

6,940

167

6.0
▲ 12.7

14,027

0.0

6,807

4.4

flat

▲ 14.1slight decrease▲ 1.9

slight decrease

LED Device

6,286

5.1

6,422

2.2

6,358

▲ 1.0

slight decrease

LED Lamp

651▲ 12.7518▲ 20.4449▲ 13.3slight decrease

LED
Photovoltaic Energy Field

3,509

▲ 4.5

23,338▲ 17.6

3,648
22,783

3,458

4.0
▲ 2.4

22,605

▲ 5.2

flat

▲ 0.8

flat

Photovoltaic Power System

16,600▲ 16.3

16,374▲ 1.4

15,697

▲ 4.1

flat

Photovoltaic Cell/Module

6,738▲ 20.5

6,409

▲ 4.9

6,908

7.8

flat

▲ 8.5

flat

Laser/Optical Processing Field
Laser and Optical Processing Equipment

Optical Equipment

Shipment of Optoelectronics Industry (Summary)

7,630

6,978

7,297

13.1

6,593

13.8

6,925

5.0

6,375

▲ 7.9

flat

6.5

466

▲ 14.2249▲ 46.6flat

4.6

CO2 Laser

543

Solid State Laser

440

9.5

479

8.9

467

▲ 2.5

flat

Fiber Laser

631

10.5

734

16.3

753

2.6

flat

35

12.9

39

11.4

42

Excimer Laser

Semiconductor Laser Direct Processing Equipment

1,407

▲ 6.9

1,507

7.1

1,990

32.1

Lamp/LD Exposure Machine

3,506

27.7

3,672

4.7

2,852

▲ 22.3

flat

31

34.8

28

▲ 9.7

22

▲ 21.4

flat

705

0.1

603

▲ 14.5

flat

2.1

flat
flat

Additive Manufacturing (3D Printer)
Oscillator
Optical Sensing and Measurement Field

704

6.7

2,325

4.6

2,438

4.9

2,489

7.7 slight increaseflat

Optical Measuring Instrument

123

▲ 3.9

119

▲ 3.3

137

15.1

Optical Sensing Equipment

2,202

5.2

2,319

5.3

2,352

1.4

flat

1,103

0.2

▲ 3.7

flat

Others Field
Product Items

FY 2017 Shipment Actual(in 100 million yen) Growth Rate(%)

1,096

▲ 0.6

FY 2018 Shipment Actual(in 100 million yen) Growth Rate(%)

1,055

FY 2019 Shipment Estimate(in 100 million yen) Growth Rate(%)

FY 2020 Shipment
Prediction

Sub Total for Optoelectronics Equipment

97,2782.2

92,632▲ 4.8

88,112▲ 4.9

Sub Total for Optoelectronics Components

42,331▲ 2.9

40,219▲ 5.0

40,3570.3

flat

Total for Optoelectronics Products

139,6090.6

132,851▲ 4.8

128,469

▲ 3.3

flat

Annual Technical Report2019 OITDA

4

flat

Optoelectronics Industry Trends
Table 2
Product Items

Optical Equipment

Optical Communications Field
Optical Transmission Equipment

Optical Component

FY 2020 Shipment
Prediction

4,033

▲ 8.5

3,883

▲ 3.7

4,142

6.7

flat

1,241

▲ 6.3

1,181

▲ 4.8

1,389

17.6

flat
flat

628

17.2

715

13.9

Subscriber Line

461

23.9

368

▲ 20.2

420

14.1

flat

Router and Switch

191

3.2

125

▲ 34.6

122

▲ 2.4

flat

53

▲ 13.1132

120.0 increase

Optical Fiber Amplifier
2,578

Optical Transmission Link

▲ 10.2
384

60
2,499

13.2
▲ 3.1

▲ 23.8

308

2,566

2.7

▲ 19.8

318

3.2

flat
slight decrease

Light Emitting Device319▲ 26.5277▲ 13.2

325

Photo Detectors

117▲ 36.177▲ 34.258▲ 24.7

Optical Passive Component

228

▲ 4.2

207

▲ 9.2

203

▲ 1.9 slight increase

17.3 slight increase

Optical Circuit Component

238

▲ 9.8

227

▲ 4.6

225

▲ 0.9

Optical Fiber

927

▲ 1.8

1,008

8.7

955

▲ 5.3

slight decreaseflatslight decrease

Optical Connector

223

18.6

250

12.1

277

10.8

flat

Others（Semiconductor Amplifying
Device, etc.）

142

21.4

145

2.1

205

41.4

flat

Optical Disk

214

0.9

203

▲ 5.1

187

▲ 7.9

1,322

▲ 39.6904▲ 31.6747▲ 17.4▲ 40.2877▲ 31.6723

1,283

Equipment

1,169▲ 42.5771▲ 34.0622

flat
slight decrease▲ 17.6slight decrease▲ 19.3slight decrease

Media

114

0.9

106

▲ 7.0

101

▲ 4.7

flat

Laser Diode

39

▲ 4.9

27

▲ 30.824▲ 11.1flat

Input/Output Field
Optical I/O Equipment

10,941

▲ 5.2

9,407

▲ 14.0

9,411

0.0

flat

4,859

▲ 15.0

4,463

▲ 8.1

4,167

▲ 6.6

flat

Optical Printer・Multifunction Printer585▲ 33.5

607

3.8

720

18.6

2,935

－

2,608

▲ 11.1

2,274▲ 12.8slight decrease

Digital Camera, Digital Video Camera

2,619

▲ 0.8

2,279

▲ 13.01,903▲ 16.5slight decrease

Security camera, Car-mounted camera *

316

－

329

4.1

371

12.8 slight increase

1,095▲ 24.2

1,001

▲ 8.6

945

▲ 5.6

slight decrease244▲ 35.8

247

1.2

228

▲ 7.7

slight decrease

Imaging equipment

Camera Mobile Phone
Others (Barcode Reader, Image
Scanner, etc.)
Image Sensor

Display and Solid-state Lighting Field

Optical Equipment

FY 2019 Shipment Estimate(in 100 million yen) Growth Rate(%)▲ 24.2

Optical Fiber Fusion Splicer

Display Equipmentflat

6.1 slight increase

6,082

3.6

4,944

▲ 18.7

5,244

28,218▲ 1.0

25,678▲ 9.0

24,386

▲ 5.0

5,031

▲ 1.2

4,886

▲ 2.9

4,586

▲ 6.1

flat

Flat Panel Display

4,658

▲ 2.3

▲ 2.7

4,250

▲ 6.3

flat
flat

Projector

222

2.3

192

▲ 13.5169▲ 12.0

151

41.1

160

6.0

167

4.4

Display Device

16,550Solid-state Lighting

4,587

▲ 2.9

13,8836.8

4,777

slight decrease

4,534

Large-scale LED Display▲ 16.1

13,063

4.1

4,717

flat

▲ 5.9

slight decrease▲ 1.3

slight decrease

LED Device

4,468

6.7

4,674

4.6

4,627

▲ 1.0

slight decrease

LED Lamp

119

9.2

103

▲ 13.490▲ 12.6slight decrease

LED
Photovoltaic Energy Field

2,050

▲ 0.3

18,226▲ 17.1

2,132
17,535

2,020

4.0
▲ 3.8

15,742

▲ 5.3

flat

▲ 10.2flat
flat

Photovoltaic Power System

16,073▲ 15.8

16,1040.2

14,597▲ 9.4

Photovoltaic Cell/Module

2,153▲ 25.81,431▲ 33.5

1,145▲ 20.0Laser/Optical Processing Field
Laser and Optical Processing Equipment

Optical Equipment

FY 2018 Shipment Actual(in 100 million yen) Growth Rate(%)

536

Optical Storage Field

Optical Equipment

FY 2017 Shipment Actual(in 100 million yen) Growth Rate(%)

Truck Line and Metro Line

Optical Transmission Components

Optical Equipment

Domestic Production of Optoelectronics Industry (Summary)

7,144

13.9

6,447

6,959

▲ 2.6

6,262

decrease▲ 10.0

flat

14.6

6,346

▲ 1.6

5,744

▲ 9.5

flat

CO2 Laser

526

11.7

436

▲ 17.1231▲ 47.0flat

Solid State Laser

386

12.5

422

9.3

415

▲ 1.7

flat

Fiber Laser

557

5.3

622

11.7

610

▲ 1.9

flat

Semiconductor Laser Direct Processing Equipment

34

▲ 2.9

36

5.9

34

▲ 5.6 slight increase

Excimer Laser

1,407

▲ 4.8

1,507

7.1

1,990

32.1

flat

Lamp/LD Exposure Machine

3,506

27.7

3,295

▲ 6.0

2,442

▲ 25.9

flat

31

34.8

28

▲ 9.7

22

▲ 21.4

flat

7.9

613

▲ 12.1518▲ 15.5

flat

0.0

flat

7.3

flat

Additive Manufacturing (3D Printer)
Oscillator

697

Optical Sensing and Measurement Field

1,833

1.6

2,003

9.3

2,003

Optical Measuring Instrument

109

▲ 2.7

109

0.0

117

Optical Sensing Equipment

1,724

2.0

1,894

9.9

1,886

779

2.0

773

▲ 0.8

Others Field
Product Items

FY 2017 Shipment Actual(in 100 million yen) Growth Rate(%)

FY 2018 Shipment Actual(in 100 million yen) Growth Rate(%)

779▲ 0.4 slight increase
0.8

FY 2019 Shipment Estimate(in 100 million yen) Growth Rate(%)

flat
FY 2020 Shipment
Prediction

Sub Total for Optoelectronics Equipment

41,568▲ 7.4

40,840▲ 1.8

38,113▲ 6.7

Sub Total for Optoelectronics Components

30,928▲ 4.0

26,302▲ 15.025,359▲ 3.6

slight decrease

Total for Optoelectronics Products

72,496▲ 5.9

67,142▲ 7.4

63,472▲ 5.5

slight decrease

5

flat

Annual Technical Report2019 OITDA

(1) communications, (2) consumer imaging, (3) security, and (4) life
science
The production in the display field shows a declining tendency
although it makes up a significant proportion (component ratio: about30%). On the contrary, the productions in the information
communications filed and the security-related field increased by 11.1%
and 12.1% over the previous year, respectively, representing high growth.
In addition, the SPIE (Society of Photo-optical Instrumentation
Engineers) counts the sales of the global optoelectronics industry every
four years according to ten fields: optical communication, consumer
and entertainment, sensing, lighting, displays, solar-PV, advanced
manufacturing, biomedical, semiconductors, and defense. In thepredictions in 2020, the following three fields are expected to grow in
the global optoelectronics market:(1) consumer and entertainment, (2) solar-PV, and (3) defense

TVs will increase due to demands for replacement and other factors.
Thus, the total shipments are projected to remain flat and the domestic
production is expected to decrease slightly.
In the optical storage field, both the total shipments and domestic
production are projected to decrease slightly due to continuing demanddecrease although products such as 4K BDs are likely to increase.
In the photovoltaic energy field, both the total shipments and domestic
production will remain flat due to price declines although demand
increase is expected.
In the optoelectronics industry as a whole, the total shipments areprojected to be flat and the domestic production is projected to decreaseslightly. However, there might be a significant gap because the worldʼseconomic outlook is uncertain.

3. Global Trends of Optoelectronics Industry
The global trends of the optoelectronics industry are reported below
based on the materials presented at the annual conference of the IOA (*1).
(*1) IOA stands for International Optoelectronics Association, a coalitionof international optoelectronics-related associations. The current
members are organizations from nine countries and regions (Canada,
EU, Korea, Germany, Japan, USA, Taiwan, Scotland, andSwitzerland), as listed in the right. In the 25th conference in 2020,
observers from France and Finland participated.
The OIDA (Optoelectronic Industry Development Association, USA)counts the production value of the global optoelectronics industry
according to eight fields: communications, consumer imaging, security,
lighting, display, solar, machine tools, and life science. The results showthat the production value of the global optoelectronics industry in 2019
increased in the four fields below:

Total Shipment of Domestic Optoelectronics Companies,
Nominal GDP, Domestic and Overseas Electronics Production
Nominal GDP #1
1.5​

Total Shipment (Trillion Yen)

50

40

2.6

0.1

▲1.1

9.4

2.2

2.8

0.8

2.0

1.8

0.1

2.1

600

500

400

Domestic and Overseas Electronics Production #2
▲11.3
▲8.9

5.2

3.3

1.3

▲12.9

30

6.8

▲1.3

▲4.3

1.6

300

Numeral: Growth ratio compared tothe preceding fiscal year

20
​

▲0.8

▲5.7

14.9

1.5

200

▲6.0
▲16.3

0.6

▲4.8

▲3.3

Total Shipment of Domestic Optoelectronics Companies

10

0

5.8

Nominal GDP (Trillion Yen)

60

100

0
2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020

Fiscal Year

Estimate

Prediction#1 Cabinet Office: National Accounts for 2018/Fiscal 2020 Economic Outlook (Jan. 20, 2020 [Cabinet Decision])#1 Cabinet Office： National Accounts for 2018／Fiscal 2020 Economic Outlook (Jan. 20, 2020 [Cabinet Decision])
Production
Forecasts
for the Global
Electronics
and Information#2 JEITA: Production Forecasts#2
forJEITA:
the Global
Electronics
and Information
Technology
Industries,
Dec., 2019 Technology Industries, Dec., 2019

Fig.1

Total Optoelectronics Shipment, Nominal GDP, and Domestic & Overseas Electronics Production

Optoelectronics Industry and Technology
Development Association

Annual Technical Report2019 OITDA

61

Fig.2

Optoelectronics Industry Trends

Shipment by Product Field

8.0

2.0

Total Shipment (Trillion Yen)

Display and Solid-state Lighting

6.0

1.5

Optical Storage

I/O
4.0

1.0

Laser/Optical
Processing
Optical Communication

Photovoltaic
Energy
0.5

2.0

縦軸
拡大

0.0

Sensing and Measuring0.0

2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019
Estimate2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019
Estimate

Fiscal year

Fiscal year

Fig.3 DomesticFig.2
Optoelectronics
Production,
Shipment by Product Field
Nominal GDP, and Domestic Electronics Production

Optoelectronics Industry and Technology
Development Association

2

30

2.1

Domestic Production (Trillion yen)

25

1.2

▲1.8

9.6

0.6

▲18.2

20
​

7.0

0.6 0.4

0.7

▲0.8

1.5

0.8

0.1

▲4.0
▲3.4 ▲1.1

0.8
2.8

0.1
2.0

1.8

500

2.6

6.5 ▲0.8
2.3▲3.5

Domestic Electronics Production #2

2.2

400
▲7.9

▲12.0

13.7

15

300
​

▲15.0
▲26.7
5.3 0.6

10

Domestic Optoelectronics Production

6.8 ▲2.2▲10.7 ▲2.0

0.4

▲9.8
▲5.5
0.1
29.2
▲1.9
22.2
7.2
▲12.4
1.1
4.4
▲16.7
11.2 2.7▲7.4▲9.5▲10.7 ▲1.8
▲5.9

200

▲5.5

100

▲15.1

5

Numeral: Growth ratio compared tothe preceding fiscal year
​

0

2.6

4.8

Nominal GDP (Trillion yen)

Nominal GDP #1

600

予測
見込

0
80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 00 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 17 18 19 20
Estimate Prediction
年度

Fiscal Year

#1 Cabinet Office： National Accounts for 2018／Fiscal 2020 Economic Outlook (Jan. 20, 2020 [Cabinet Decision])#2 JEITA: Production Forecasts for the Global Electronics and Information Technology Industries, Dec., 2019

#1 Cabinet Office:National
for 2018/Fiscal 2019 Economic Outlook (Jan. 20, 2020 [Cabinet Decision])
Optoelectronics
Industryand Accounts
Technology
Development#2 JEITA: Association
Production Forecasts for the Global Electronics and Information Technology Industries, Dec., 2019

Fig.3

3

Domestic Optoelectronics Production, Nominal GDP, and Domestic Electronics Production

7

Annual Technical Report2019 OITDAFig.4 Domestic Optoelectronics Production by Product Field
4.5

4.0

Domestic Production (Trillion yen)

I/O

Display and
Solid-state Lighting

3.5

Photovoltaic Energy

3.0

2.5

2.0

1.5
Optical Storage
Sensing and
Measuring

1.0

0.5

0.0

OpticalCommunication

Laser/Optical Processing

1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019
Estimate

Fiscal year

Optoelectronics Industry
and Technology
Fig.4
Domestic Optoelectronics Production by Product Field
Development Association

Annual Technical Report2019 OITDA

84Technological Strategy Development
1. Introduction

it is vital to introduce technologies for supporting diagnosis based onmachine learning that uses a large volume of endoscopic images ofmucosal surfaces as training data.
2C deals with observation for external non-invasive diagnosis of organ
tumors about 5 cm below body surfaces, which means that the imaging
devices are expected to be used at facilities without advanced medical
infrastructure and for remote medical care. To meet this demand, a
relatively low-cost and small-sized device also must be developed.
Important issues with 2A to 2C are summarized as follows: developmentof a new molecule probe that will contribute to improving detection
sensitivity, utilization of digital technologies such as machine learning
and XR, and miniaturization of light sources and detectors. In 2D,
technological development is essential to three-dimensionally visualize
the refractive index and spectroscopic information of a fertilized egg
with a high spatial resolution, while maintaining the less-invasive
properties.

OITDA has been developing “Optical Technology Roadmap” since1996 with the aim of identifying the future technologies of the opticalindustry for directing the R&D. This activity has contributed widely tothe development of optical industry as one of the key factors of manynational R&D projects in the fields of information and telecommunication,
recording of information, display device, optical energy and opticalprocessing. In FY2019, the fourth year of the technological strategy
development project that focuses on specific application areas, we havedeveloped the roadmap under the theme of “Optical Imaging and Sensing
Technology Roadmap – Seeing the Unseen –.”2. Optical technology roadmap
In the face of the super-aging society, problems such as the following
have arisen: escalation of medical care costs and labor shortages, whichhave led people to turn to health improvement and productivity increase.
The optical imaging and sensing technology, which offers the advantage
of enabling non-destructive and less-invasive measurement, has enhanced
the performance and reliability of various optical devices. Given thissituation, we selected the following five areas in which the opticalimaging and sensing technology is hoped to be utilized in the 2030s:(1) life science, (2) medical care, (3) health management (4) agriculture
and livestock industry, and (5) infrastructure. We then identified needs
in each area and discussed relevant methods and performance we should
aim to achieve for the future society, while comparing the needs withthe current technological levels. Finally, we put together element
technologies required to realize the goal.

2.3 Health management area
Two segments, “3A: disease prediction” and “3B: mental healthmonitoring,” were selected in the health management area.
In 3A, a small and wearable infrared spectroscopic device is necessary,as is a signal analysis method for accurately deriving vital data such as
blood pressure, expiration, and blood component based on a certain
physical amount (observation signals) obtained from a short-time andsimple measurement. In addition, since technologies for high sensitivity
detection are essential to commercialize the expiration diagnosis, thelight sources, detectors, and optical systems are required to improvetheir performance.
In 3B, the development of a highly reproducible wearable device andthe development of the relevant data processing method are importantin order to achieve mental status estimation from vital data.

2.1 Life science area
In this area, we picked up two segments, “1A: cell and tissue imaging”
and “1B: imaging for cellular and regenerative medicine and drug
discovery research.” In 1A, in order to improve the performances suchas ultra-wide field of vision and deep observation, it is important topromote the sophistication and multi-functionality of optical systems(e.g., ultra-wide-field devices, spatial light modulators, and wavefront
correction systems), high-repetition-rate pulsed lasers, and molecular
probes. In 1B, unlabeled imaging is required because the technology is
hoped to be applied to medical care for clinical use. To this end, it isvital to develop an ultra-wide-field optical system (25 x 25 mm class)as well as an optical system specifically intended for applications suchas 96-well plate imaging. Furthermore, a cell and tissue culture systemthat utilizes technologies including robotics is also important, together
with the combination with machine learning.

2.4 Agriculture and livestock industry area
In the agriculture and livestock industry area, we dealt with twosegments, “4A: disease/growth state monitoring” and “4B: quality
management.”
In 4A, in order to realize large-scale and efficient agriculture, it isimportant to develop technologies for monitoring a growth state by
infrared spectroscopy and other methods, as well as for sensing viruses
and pathogens in real time. 4B focuses on quality management of thesugar content and umami component of agricultural and livestock
products. A multivariate analysis method (a regression model) thatcombines optical observation data with the intended indicators such as
growth state and umami component is necessary, as are the relevant
image processing technologies. In addition, the observation equipment
is required to have an observation wavelength, bandwidth, and accuracy
that are suitable for the intended purposes.

2.2 Medical care area
In this area, we picked up four segments, “2A: intraoperative imaging
and sensing,” “2B: endoscopic imaging for cancer invasion depth,” “2C:
in-vitro optical imaging,” and “2D: fertilized egg imaging.” In 2A, inorder to observe tissues of blood vessels, nerves, and lymphatic vessels
at a depth of about 1 cm with a resolution of about 1 mm, it is necessary
to develop optical technologies enabling deep focusing as well as a newmolecular probe, and to fully utilize digital technologies such as deeplearning.
In 2B, it is required to visualize cancer tissues and tumor vessels at
depths of several millimeters to about 1 centimeter with resolutions ofseveral micrometers to dozens of micrometers to determine the depthof cancer invasion. For this purpose, technologies for focusing light
deep into tissues (including deep focusing technologies that use
ultrasound and light in combination) are necessary, as are opticaltechnologies that can achieve both detection sensitivity improvement
and noise reduction. In addition, a fluorescent probe that has tumor
specificity and assures biological safety must be developed. Furthermore,

2.5 Infrastructure area
This area was serected into two segments, “5A: image andspectroscopic sensing” and “5B: optical fiber sensing.”
In 5A, in order to achieve the risk prediction of structures throughdisplacement, stress, and deterioration evaluation, it is necessary to
improve the performance of image analysis for measuring deformationof structures, measuring the stress distribution not involving
displacement, and evaluating deterioration of materials. Furthermore,
the performance of hybrid measurement of surfaces and inner bodies
must be enhanced. To achieve these improvements, it is important tofuse the measurement with other techniques such as stress distribution
analysis by polarized imaging, deterioration diagnosis of structurematerials by infrared spectroscopy, and ultrasound measurement.
In 5B, it is particularly important to increase the measurement accuracy

9

Annual Technical Report2019 OITDA

of distortion and temperature with distributed optical fiber sensors, inorder to make it possible to monitor social infrastructure and housesecurity.

3. Summary
Through the development of this roadmap, we have reached thefollowing three conclusions regarding the optical imaging and sensing
technology: (1) There are many needs for applications that take advantageof the non-destructive and less-invasive properties; (2) Although there
are many emerging relevant technologies, their practical application isstill highly challenging, and thus it is important to steadily develop
useful technologies while continuing to create such emerging
technologies; (3) It is necessary to combine other imaging and sensing
technologies such as those using ultrasound, develop a molecular probe
to fully utilize the optical technology, and further strengthen thecollaboration with digital technologies including AI.
Finally, the applications of optical imaging and sensing span a wide
range of areas, but there are very many common items in regard to its
element technologies. We hope that this roadmap will help our associates
establish an optical imaging and sensing methodology that will support
the future society, while increasing the levels of these element
technologies with a view to each application.

Annual Technical Report2019 OITDA

10Standardization
1. Introduction

Carolina (USA) in October 2019. Described below is the progress ofdeliberations by each WG.

Standardization has been one of OITDAʼs major activities since its
establishment and has been promoted broadly across the optoelectronics
industry. OITDAʼs standardization efforts are mainly focused on the
optical communication (IEC/TC 86), but they also include several opticalapplications (ISO/IEC JTC 1/SC 32) and lasers (IEC/TC 76 and ISO/TC 172/SC 9).
Besides, working for domestic standardization (JIS, OITDA standards
and Technical papers), OITDA is also working on international
standardization such as IEC and ISO through field-specific sub-meetingsin order to respond rapid change of industrial structure and technologies.
Outlined below are the results and trends of standardization activities
in FY 2019, as well as two international standardization projects
commissioned by the Ministry of Economy, Trade and Industry.

3.1 Optical radiation safety (WG 1)
In the virtual protective housing project, the virtual protective housing
was renamed and redefined as the AEC (Automatic Emission Control:
function to reduce the laser classes allocated to target areas). A
conceptual difference between a physical protective housing and a virtual
protective housing was reviewed and discussed based on the definitionsof the “protective housing” and the “human access” described in IEC
60825-1 (Safety of laser products – Equipment classification andrequirements).
In the moving platform (that changes the position of measuringopening around the moving body including laser equipment dependingon the moving speed) project, the concept defining the humaninaccessible region was discussed to correct the current definition,“cuboid,” used in the NP of IEC 60825-19 (Moving Platform Laser
Products). As a result, it was decided to use the “volume” occupied by
the movement in a specific time (the maximum distance is specified)in a CD.
In the project for intentional beam irradiation for the eye and face,
an NP draft is under discussion and an online meeting is held on amonthly basis.
Regarding outside laser products for distance measurement, a project
has been launched that aims to establish the reference value according
to the ambient brightness.

2. Fiber Optics Standardization Meeting
Established to constantly take the lead in the standardization activities
for fiber optics, the Fiber Optics Standardization Meeting plays a vitalrole in planning and promoting standardization by adjusting the integrity
and overall orientation of the activities while improving the work
efficiency, under the direction of the Optoelectronics Industry Technology
Standardization Meeting.
In the field of internet communications amid further rapid expansion,
5G is gaining attention as the cutting-edge wireless access technology.
Meanwhile, optical access lines are still used in infrastructure thatconnects transmission base stations and local areas, which makes thestandardization of fiber optics increasingly important. Besides, theapplicability is expected to broaden, encompassing a diverse range offields. With such a current trend as a backdrop, it is important to review
the purpose and scope of the standardization of fiber optics, identify
items to be standardized, and create a vision of ideal standardization.
In FY2019, with its awareness of these issues, the Fiber Optics
Standardization Meeting promoted extensive studies and research into
fiber optics, and focused its efforts on addressing problems anddeveloping strategic plans in connection with JIS and international
standardization. Regarding the organizationʼs standards (OITDA
standards) and technical papers (OITDA/TPs) studied and introducedby the meeting to complement JIS and international standards, the Fiber
Optics Standardization Meeting aimed to further enhance these
documents to expedite the standardization.
In this fiscal year, the meeting organized three research submeetings
to conduct its activities: the Administrative Advisory Submeeting, IntraBuilding Optical Wiring Submeeting, and Optical Fiber Sensors
Submeeting.
In addition, eight meetings were set up at the same level as the Fiber
Optics Standardization Meeting: the Optical Fiber Standardization
Meeting, Optical Connector Standardization Meeting, Optical Passive
Components Standardization Meeting, Optical Active Device
Standardization Meeting, Optical Amplifier Standardization Meeting,
Dynamic Module Meeting, Optical Subsystem Standardization Meeting,and Optical Measuring Instrument Standardization Meeting. Thesemeetings worked on JIS development in collaboration with IEC/TC 86,
which is engaged in preparing the international standards that correspondto the standardization of fiber optics.

3.2 Laser radiation measurement (WG 3)
A CD draft is being deliberated at the WG for the revision of IEC/
TR 60825-13 Ed.3 (Measurements for classification of laser products).
3.3 Safety of medical laser equipment (WG 4)
Regarding IEC TR 60825-8 (Guidelines for the safe use of laser beams
on humans), integration with IEC TR 62471-3 (Guidelines for the safeuse of IPL sources on humans) is under consideration.
For IEC 60601-2-57 (Particular requirements for the basic safety andessential performance of non-laser light source equipment intended fortherapeutic, diagnostic, monitoring and cosmetic/aesthetic use), the CD
draft for Ed.2 revision is under consideration.
3.4 Safety of fiber and free space optical communications systems (WG5)Regarding IEC 60825-2 (Safety of optical fiber communication
systems) Ed.4 proposed by Japan, there were strong objections at thecomment deliberation from CDV circulation. To reach a conclusion ina short period, an ad hoc group was set up and then it was decided tosubmit an FDIS draft by the end of June.
IEC 60825-12 (Safety of optical wireless communication systems for
information transmission) Ed.2 proposed by Japan was circulated as anamendment, but a 2CD draft was compiled as Ed.3 revision, instead of
Ed.2 amendment, by the end of the fiscal year.
3.5 High power lasers (WG 7)
The FDIS draft of IEC 60825-4 (Laser guards) Ed.3 was deliberated.
For IEC 60825-18 (Beam delivery system), each countryʼs commentsfrom CD circulation were deliberated.

3. TC 76/Laser Safety Standardization Meeting

3.6 Development and maintenance of basic standards (WG 8)
For IEC TR 60825-3 (Guidance for laser displays and shows) Ed.3
and IEC TR 60825-14 (Safety of laser products–A userʼs guide) Ed.2,
comments from CD circulation were deliberated and measure policies
were agreed.
IEC TR 60825-5 (Manufacturerʼs checklist for IEC 60825-1) Ed.3

The TC 76/Laser Safety Standardization Meeting functions as adomestic deliberation committee that works with IEC/TC 76, theinternational electrotechnical committee for standardization regarding
optical radiation safety and laser equipment, as well as a draft creationcommittee that develops relevant JIS standards.
In FY2019, the IEC/TC 76 international conference was held in North

11

Annual Technical Report2019 OITDA

4.1 Terminology and test methods for electro-optical systems (WG 1)
The deliberations were conducted as follows for each item:- ISO 11146 (Lasers and laser-related equipment -- Test methods forlaser beam widths, divergence angles and beam propagation ratios)-1 (Part 1: Stigmatic and simple astigmatic beams), -2 (Part 2:
General astigmatic beams): It was decided to skip CD stage andproceed to DIS.
- ISO 13696 (Optics and optical instruments -- Test methods forradiation scattered by optical components): CD voting is scheduledaround May 2020. The standard development period was extended
to 48 months.
- ISO 13142 (Electro-optical systems -- Cavity ring-down techniquefor high-reflectance measurement): It was decided to complete thefinal document by around March 2021. In addition, the name wasrevised.
- ISO 12005 (Lasers and laser-related equipment -- Test methods forlaser beam parameters – Polarization): It was decided that Japan
would act as PL and the project would be started through standard
development registration.
- ISO 23701 (Optics and photonics -- Laser and laser-related
equipment -- Photothermal technique for absorption measurement
and mapping of optical laser components): USA voted against it
but it was approved to proceed to NP stage. It was decided to submit
a WD in July 2020.
- ISO 22247 (Optics and Photonics -- Effective numerical apertureof laser lenses -- Definition and verification procedure):
Development project was approved as TS (Technical Specification).

was issued in November.
For IEC TR 60825-14 Ed.2, CD comments were deliberated andmeasure policies were agreed.
3.7 Non coherent sources (WG 9)Regarding IEC TR 62471-2 ED1 (Guidance on manufacturing
requirements relating to non-laser optical radiation safety), revision asa requirement was proposed by the convenor and opinions were
exchanged.
For IEC TR 62471-4 ED1 (Measurement method), it was decided toproceed to DTR circulation.
For IEC 62471-6 ED1 (UV lamp system), comments from NP
circulation were deliberated. It was decided to exclude lamps for suntan
purposes and proceed to CD circulation.
3.8 IEC 62471-1 Special joint TC (JTC 5)
Revision work on CIE S009/IEC 62471 (Photobiological safety oflamps and lamp systems) has been conducted by CIEʼs Div.2 and Div.6
and IECʼs Joint TC (JTC5) of TC 34 and TC 76 since April 2013.
Regarding the procedure for revision to CIE S009/IEC 62471-1, it
was confirmed to conduct deliberation and voting at the JTC as revised
CIE S009 first according to the CIE procedure, and then propose therevised CIE S009 to IEC as the FDIS of IEC 62471-1.
3.9	IEC/TC76/ IEC/ISO - Safety of lasers and laser equipment in anindustrial materials processing environment linked to ISO/TC 172/SC 9(JWG 10)Regarding ISO/IEC 11553-1 (Laser processing machines – Laser
safety requirements) Ed.2, an FDIS was circulated after the meeting,and it was decided to proceed to issuance in FY2020.
For ISO/IEC 11553-2 (Safety requirements for handheld laser
processing devices) Ed.2, it was decided that China would act as PL toresume the revision project in FY2020.

4.2 Laser systems for medical applications (WG 4)- ISO 22248 (Lasers and laser-related equipment -- Test methods forlaser-induced damage threshold -- Classification of medical beam
delivery systems): It was decided to circulate a DIS in around
January 2020.

3.10	Eye and face protection against laser radiation linked to ISO/TC94/SC6(JWG 12)For ISO 19818-1 (Requirements and test methods) Ed.1, a WD wasdeliberated and it was agreed to proceed to issuance by skipping CD
stage.
For ISO/TR 19818-2 (Guidelines on selection and use) Ed.1, the draft
was deliberated and it was agreed to add it as a preparatory work item.

4.3 Electro-optical systems other than lasers (WG 7)- ISO 15902 (Optics and photonics -- Diffractive optics – Vocabulary):
Editorial errors and others were reported from Japan serving as PL.
(Issued in December 2019)- ISO 11807 (Integrated optics – Vocabulary) -1 (Part 1: Basic terms
and symbols), -2 (Part 2: Terms used in classification): It was decided
to submit a DIS document to the secretary in December.
- ISO 14880 (Optics and photonics -- Microlens arrays-1 (Part 1:
Vocabulary): Comments from USA were deliberated and approved.

4.	ISO/TC 172/SC 9 Standardization Meeting (ISO/TC 172/SC
9 Laser and Electro-Optical Systems)

5. Optical Disc Standardization Meeting

The ISO/TC 172/SC 9 Standardization Meeting conducts various
activities including collecting domestic opinions and reviewing draft
international standards proposed by ISO/TC 172/SC 9, which is engaged
in preparing international standards on laser products (composed of WG
1: Terminology and test methods for electro-optical systems, WG 4:
Laser systems for medical applications, WG 7: Electro-optical systems
other than lasers, and JWG 3: Joint work group of ISO/TC 172/SC 9
and IEC/TC 76 on laser equipment safety).
This fiscal year, a deliberation meeting was held before the China
international conference in November 2019. It had been planned toreport at the international conference in March 2020 and deliberate
strategies for the next international conference, but the meeting wascanceled due to the global spread of coronavirus infections. Then,document deliberation was conducted by e-mail.
In FY2019, the international conference was held in China Jiliang
University, Hangzhou. Described below is the progress of deliberations
by each WG.

Annual Technical Report2019 OITDAThe Optical Disc Standardization Meeting is a standardization groupspecializing in the standardization of optical disc related technologies.
Its main tasks are to prepare drafts of domestic standards and to survey
and research the trends in the related technologies.
The Optical Disc Standardization Meeting has functional submeetings
to carry out the activities. The core meeting determines activity policies
by each submeeting, supervises their activities, and deliberates andapproves JIS drafts. The submeetings undertake specific work to promote
the overall activities.
In FY2019, the Application Submeeting was integrated into the Media
Submeeting to transition to a two-submeeting system.
For survey and research, the Media Submeeting conducted a futuretechnology trend survey. In addition, an international standardization
trend survey was also conducted, independent of the submeeting
framework, to provide the latest information to optical disc users.

12

Standardization
5.1 Media Submeeting
From FY2019, the Media Submeeting efficiently conducts the survey
and research activities regarding the standardization of physical formats,applications, and reliability evaluation for all optical discs (magnetooptical discs, phase change optical discs, recordable optical discs, andread-only media [ROM] optical discs).
In the activity area covered by the former Media Submeeting, thesubmeeting is watching the progress of revision work by ISO/IEC/JTC
1/SC 23 regarding the international standard that corresponds to the
new recordable disc format specifications, which had been updated by
the Blu-ray Disc Association (BDA) for 4k/8k broadcast recording.
In the activity area covered by the former Application Submeeting,the submeeting is watching the progress of further revision work by
ISO/IEC/JTC 1/SC 23, which is under deliberation in consideration offurther usersʼ convenience, regarding the specifications in ISO 29121(Data migration method for optical discs for long-term data storage),which had been revised in 2018.

to continue the standardization activities.

7.	International standardization on Reliability of Narrow-Pitch
Multi-Fiber Optic Connectors (NP project)
7.1 Objective
With the acceleration of the globalization of the optical communication
system and component industry, including deploying manufacturingbases in Asia, Japanʼs urgent task is to strengthen the competitive
advantages in fields and technologies at which we excel to enhance ourinternational presence. Japan has traditionally offered the high-levelproduct quality and thus should take the world-leading position inconstructing highly reliable systems and components.
Optical connectors originated from Japan, such as SC connectors,
MU connectors, MT connectors, and MPO connectors have thus far
been internationally standardized and used in the global market,
accounting for a high share (SC connectors account for about 70% of
the global market). The objective of this project is to work on
international standardization regarding high-density connection using
highly reliable optical connectors we have manufactured with our
specialty, thereby establishing standards advantageous to our countryʼs
industry ahead of the USA and Europe, and promoting the narrow-pitch
multi-fiber optic connector industry.
Narrow-pitch multi-fiber optic connectors can be applied to highdensity optical interconnection between the substrates of substrateembedded optical modules, and their target market is the high-density
optical interconnection systems in servers and routers at data centersand other facilities in Japan and overseas. The market began to emerge
around 2018, and owing to this project, the volume of the high-density
optical interconnection is estimated to increase to about several million
units.
Especially in recent years, the volume of information to be processedand communicated at data centers has increased due to the expansionof cloud computing, which has led to the key issue of energy consumption
reduction. In order to solve this problem, the application of high-density
optical interconnection to servers and routers at data centers and otherfacilities is being promoted worldwide. To achieve this high-density
optical interconnection, this project will work on international
standardization of the narrow-pitch multi-fiber optical connector thatuses optical fibers with smaller thicknesses compared to the conventional
fibers.
One international standard NP for narrow-pitch multi-fiber opticalconnectors was proposed to IEC/TC 86. The target was set to register
the NP and circulate a CD by FY2019.
In FY2019, the third year of this three-year project, domestic opinions
on international standardization of narrow-pitch multi-fiber opticalconnectors were collected based on the results of technical surveys andtechnical studies such as prototype testing. Then, opinions on the NP
draft submitted to IEC were coordinated at the IEC conference. As aresult, a CD was circulated and the target was achieved. Furthermore,
CC comments for the CD were solved and a CDV was circulated.

5.2 Format Submeeting
The Format Submeeting conducted the following activities, including
continuing items from FY2018, in the survey and research on volume
and file formats of optical discs.
(1) Development of large capacity file system
Following FY2018, a proposal document including user requests forarchive file systems and issues with implementation was submitted to
the Ecma TC31 conference and discussion was made. The submeeting
also supported joint work being undertaken by Ecma TC31 for IEC/TC
100.
(2) Development of ISO 9660 Amd.2
Regarding ISO 9660, which defines the logical format of a CD-ROM,
ISO 9660/Amd.2 was developed as a revision to include the extended
specification Joliet after the disclosure of the specification contents was
permitted by Microsoft. The final publication proceeding is underway
as of March 2020.
After ISO 9660 Amd.2 is issued, development of ISO 9660 Ed.2 will
be started to reflect the amendment up to Amd.2. Relevant responses toEcma are planned to be started after the content of Ed.2 is confirmed.
In addition, after Ed.2 is confirmed, the revision proceeding for JIS
X 0606 will be started to conduct the revision work in tandem with theEd.2 development.

6.	International standardization on Evaluation of EMC andrelated Characteristics of High-Speed In-Vehicle Ethernet
Physical Layer (V project 3)
While the capacity of in-vehicle communication is expected to increase
drastically due to the development of the advanced driving support
systems and autonomous driving, the in-vehicle Ethernet standards,
which strengthen real-time performance and fail-safe function, requirein-vehicle communication systems to ensure high reliability as acommunication backbone and sensor network that connect between baseunits for self-driving vehicles. Regarding EMC characteristics, a reliable
in-vehicle communication system can be achieved by combining acommunication board having excellent EMC characteristics with an
optical harness that neither generates electromagnetic noise nor has
EMC vulnerability.
This project was adopted and initiated in May 2017 and then completed
in FY2019 (third year). In the project, regarding the in-vehicle Ethernet
serving as the basic in-vehicle communication protocol in the times ofautonomous driving, nine communication standards that satisfy highreliability and cost reduction were prepared by effectively incorporating
Japanese technologies.
In FY2020, a successor project (V project 4) is planned to be launched

7.2 Progress
1) The meeting set up the international standardization proposal
committee regarding reliability and others of narrow-pitch multi-fiber
optical connectors and participated in JWG9 of the IEC Delftconference in April 2019 to deliberate comments on the circulated
NP, which had been proposed as the IEC 62496-4-214 standard(Optical circuit boards - Part 4-214: Interface standards - Terminatedwaveguide OCB assembly using a single-row thirty-two-channel
symmetric PMT connector). It was agreed to prepare a CD. For CD
circulation, it was decided to use “214” for the grandchild number.
2) At JWG9 of the IEC Shanghai conference in October, CC comments

13

Annual Technical Report2019 OITDAon the CD were solved and it was agreed to prepare a CDV. The CDV
was circulated on January 3, 2020.
3) For the measurement system evaluation of narrow-pitch multi-fiber
optical connectors, a connection loss measurement system evaluation
was conducted on a polymer optical waveguide equipped with anarrow-pitch multi-fiber optical connector. A fan-out part was
prepared by attaching 12 GI-50 fibers with an outer diameter of 80µm to a thin-diameter MT ferrule. Then, a polymer waveguideequipped with a both-side PMT connector (core □40 µm) wasconnected to the fan-out part to measure the EAF (encircled angularflux) of the emission light. As a result, it was confirmed that the EAF
could be evaluated at each port of the polymer waveguide whichever
an SLD or LED was used as a light source.
4) For the test evaluation of narrow-pitch multi-fiber optical connectors,
a connection characteristic evaluation was conducted to check the
EAF, connection loss, and crosstalk of a polymer optical waveguideequipped with a narrow-pitch multi-fiber optical connector by using
SLD and LED light sources with a wavelength of 850 nm. The EAF
obtained when two polymer waveguides were connected did not varymuch between cases where the SLD or the LED was used for
excitation. The connection loss was roughly 0.4 dB and tended toincrease slightly at both-side ports. The connection loss also showedno significant variations depending on the excitation conditions. The
crosstalk was roughly -40 dB or less and tended to increase at bothside ports.
By utilizing the test results in 3) and 4), we will aim to realize theinternational standardization smoothly.
5) Technical survey was conducted at the international academic meeting,and due to further volume increase at data centers, the followings are
required: progressing technologies for the photonic integrated circuit(PIC) such as using silicon, developing on-board optics
implementation, and achieving high-density optical interconnection
by applying optical transmission between LSI chips. This has
highlighted that development and standardization regarding the highdensity application of multi-fiber optical connectors will become
increasingly important. It is thus thought that the narrow-pitch highdensity implementation will be promoted to achieve the high-density
application. It was confirmed that collaboration with each relevant
standardization organizations such as the COBO (Consortium for
On-Board Optics) would be the key to the standardization activities.

Annual Technical Report2019 OITDA

14

Educational and Public Relations Activities
1.	FY 2019 Symposium on the Optoelectronics Industry andTechnology

Covering a wide range of exhibition categories, including laser/lightsources, optical devices/modules, materials, optical equipment/
instruments, and services/software related to the optoelectronics industry,
InterOpto exhibited a broad range of technologies from optoelectronicsrelated materials to optical application systems.
InterOpto alone featured 97 booths set up by 74 exhibitors from inand outside Japan, including optoelectronics manufacturers and trading
companies.
A “Notable Optoelectronics Technology and Special Exhibit Zone”
was set up in the Exhibition Hall. In this zone, eight companies
recommended by the working groups of OITDAʼs Optoelectronics
Technology Trend Committee exhibited their technologies and products.
On January 29th, the OITDA seminar “Optical Technology for
Autonomous Driving” was held. The seminar was followed by a lectureby automobile journalist Kenji Momota on the current state and future
outlook of the global market surrounding autonomous driving, followed
by four lectures on the latest optical technology for the realization ofautonomous driving. It was a seminar on the latest optical technology
for autonomous driving, which has great expectations for future
development. A total of 330 people participated in the five lectures.

The FY 2019 Symposium on the Optoelectronics Industry andTechnology was held at the Rihga Royal Hotel Tokyo on Wednesday,
February 19th, 2020. The event was jointly sponsored by OITDA and
the Photonics Electronics Technology Research Association (PETRA),
with support from the Ministry of Economy, Trade and Industry. Under
the theme of “Optical Imaging and Sensing Technologies −Seeing theUnseen”, six important lectures were given as shown in Table 3. witharound 230 participants.

2. InterOpto 2020
InterOpto 2020, an international exhibition of cutting-edge
optoelectronics technology, was held at Tokyo Big Sight for three days
from January 29th to January 31st, 2020, with support and cooperationfrom the Ministry of Economy, Trade and Industry and many otherorganizations.

Table 3

FY 2019 Symposium on the Optoelectronics Industry and Technology

Opening Remarks

Mr. Yasuhisa Odani
President / Vice Chairman, OITDA

Guest Greeting

Mr. Jingo Kikukawa
Director, IT Industry Division, Commerce and Information
Policy Bureau, METI

Keynote Speech:
Imaging the Shadow of a Black Hole with the Event
Horizon Telescope

Dr. Kazuhiro Hada
Assitant Professor, Mizusawa VLBI Observatory, National
Astronomical Observatory of Japan (NAOJ)

Future Society Created by Sensing Technology

Dr. Makoto Fujimaki
Deputy Director, Research Center Team Leader, Sensing
System Research Center, National Institute of Advanced
Industrial Science and Technology (AIST)New Development of Endoscopic Imaging Technology

Mr. Makoto Igarashi
Technology Innovation, Global Office of Chief Technology
Officer, Olympus Corporation

13:45 〜 14:30

Roadmap of Optical Imaging and Sensing Technology− Seeing the Unseen −Dr. Yasuyuki Ozeki
Associate Professor, Department of Electrical Engineering
and Information Systems, The University of Tokyo

14:45 〜 15:30

Recent HPC Development Activities and “Fugaku”
SystemDr. Yuichiro Ajima
Senior Architecht, System Development Division, Platform
Development Unit, Fujitsu Limited

15:30 〜 16:15

Integrated Photonics-Electronics Convergence System
Technology− Ultra-compact Optical Transceivers for 5G Network −Mr. Hiroki Yaegashi
Photonics Electronics Technology Research Association(PETRA)

16:20 〜 17:00

The Award Ceremony of 35th Kenjiro Sakurai Memorial Prize

17:00 〜 19:00

Get-together

10:00 〜 10:05
10:05 〜 10:15

10:15 〜 11:15

11:15 〜 12:00

13:00 〜 13:45

15

Annual Technical Report2019 OITDA3. 35h Kenjiro Sakurai Memorial Prize
The Kenjiro Sakurai prize was established as a memorial to the late
Dr. Kenjiro Sakurai, a former director of OITDA who played a majorrole in developing the optoelectronics industry. Its purpose is to promote
the technological development of the industry. The prize has been givenout 34 times to 24 individuals and 41 groups, for a total of 162 awardees.
This year, the Kenjiro Sakurai Memorial Prize was awarded to one
group out of 14 applications for their pioneering achievements in the
optoelectronics industry and technology since 2009.
The prize was awarded to Dr.Shinji Matsuo, Dr.Takaaki Kakitsuka,
Dr.Tomonari Sato and Dr.Koji Takeda of Nippon Telegraph andTelephone Corporation. “Development of low-threshold and high-speed
semiconductor membrane lasers”
The award ceremony was held on February 19th, 2020 following the
FY 2019 Symposium on the Optoelectronics Industry and Technology.
At the ceremony, Dr.Yasuhiko Arakawa (The University of Tokyo), whois the chairperson of the Kenjiro Sakurai Memorial Prize Committee,
reported on the selection process and results. This was followed by thepresentation of certificates, medals, and extra prizes to the awardees.

Awardees of the 35th Kenjiro Sakurai Memorial Prize
From left: Dr.Koji Takeda, Dr.Takaaki Kakitsuka, Dr.Shinji Matsuo, Dr.Tomonari Sato

Annual Technical Report2019 OITDA

16Supporting Members(As of March 31, 2020)[Chemistry]

Japan Aviation Electronics Industry, Ltd.

[Commercial & Advertisement]

Fujifilm Corporation

Kyocera Corporation

JTB Communication Design, Inc.

Mitsubishi Chemical Holdings Corporation

Lumentum Japan, Inc.

Marubun Corporation

Nissan Chemical Corporation

Mitsubishi Electric Corporation

The Optronics Co., Ltd.

Shin-Etsu Chemical Co., Ltd.

Murata Manufacturing Co., Ltd.

Sumitomo Bakelite Co., Ltd.

NEC Corporation[Electric Power]

Yamamoto Kogaku Co., Ltd.

NTT Electronics Corporation

Central Research Institute

Oki Electric Industry Co., Ltd.

of Electric Power Industry[Glass & Ceramics]

Panasonic Corporation

AGC Inc.

Pioneer Corporation[Other Manufacturing]

Corning International K.K.

Santec Corporation

Adamant Namiki Precision Jewel Co., Ltd.

Nippon Sheet Glass Co., Ltd.

Sanwa Denki Kogyo Co., Ltd.

Dai Nippon Printing Co., Ltd.

Sumitomo Osaka Cement Co., Ltd.

Seiko Epson Corporation

Optoquest Co., Ltd.

Toyo Seikan Group Holdings, Ltd.

Seiwa Electric Mfg. Co., Ltd.
Sharp Corporation[Electric Wire & Cable]
Fujikura Ltd.
Fujikura Dia Cable Ltd.
Furukawa Electric Co., Ltd.
Sumitomo Electric Industries, Ltd.
SWCC Showa Holdings Co., Ltd.

[Others]

Sony Corporation

Granopt Ltd.

Taiyo Yuden Co., Ltd.
Toshiba Corporation
Ushio Inc.

Institute for Laser Technology
Japan Optomechatronics Association
KDDI Research, Inc.

Yamaichi Electronics Co., Ltd.
Yokogawa Electric Corporation

Nippon Telegraph and TelephoneCorporation
NTT Advanced Technology Corporation[Electronics & Electronic Appliances]
Asahi Kasei Microdevices Corporation
Anritsu Corporation
Fujitsu Limited
Hamamatsu Photonics K.K.
Hakusan,Inc.
Hitachi, Ltd.
Honda Tsushin Kogyo Co.,Ltd.
Huawei Technologies Japan K.K.

[Precision Instrument]
Konica Minolta, Inc.

Photonics Electronics Technology
Research Association (PETRA)TOYOTA Central Research andNikon Corporation

Olympus Corporation

Development Labs., Inc.

UL Japan, Inc.

Ricoh Company, Ltd.
Seikoh Giken Co., Ltd.
Sigma Koki Co., Ltd.
Suruga Seiki Co., Ltd.
Topcon Corporation
Seiko Instruments Inc.

17

Annual Technical Report2019 OITDA

1-20-10, Sekiguchi, Bunkyo, Tokyo, Japan, 112-0014
Phone: +81 3 5225 6431
URL: http://www.oitda.or.jp