X8068
Versatile X-ray inspection
for SMT/electronics!
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Fast, convenient, high performance

Brilliant image quality,easiest operation,comprehensive analysis

High resolution
X-ray inspection –made by Viscom

The X8068 reliably inspects the entire range of inspection objects up toa diameter of 722 mm (28.4"). The open X-ray tube ensures the highest resolution and detail recognition in first-class image quality.
Thus even the smallest defective structures are reliably detected.
The system delivers with a mature technology which demonstrates its full strength in the interaction of all the hardware andsoftware components. The user-friendly new IPS monitor depicts the X-ray results in the best quality, independent of theviewing angle. In order to attain the largest possible inspection area, the detector swivel range is up to 60 degrees. System operation is easy and convenient.

Two inspection concepts in one system:
Viscom XMC and Viscom SI
BGA overview underangled radiation

Powerful open
microfocus transmission tube
Flat panel detectors forbrilliant image quality

The special strength of the X8068: It combines two inspection concepts, Viscom XMC and Viscom SI, in one inspection system. Therefore the Viscom XMC software is available for special inspections or non-standard components.
Thanks to intuitive operation and comprehensive automatic analysis functions, inspection objects can be quickly
and precisely checked.

Highest magnifications

BGA defect analysis

Large inspection objects up toa diameter of 722 mm (28.4")
can be inspected

The proven SI software of the Viscom X7056 family is employed for the fully automatic X-ray analysis. It culminates
over 30 years‘ experience in assembly inspection and isspecially suited for SMD production. This means the unique
Viscom Quality Uplink can also be used. Through the linkingof inspection results from SPI, AOI, AXI and MXI, this function provides a simplified classification and effective processcontrol. For example, all inspection data from the Viscom 3Dsolder paste inspection can be displayed on the verification station of the X8068. Defect causes are easier to track down andprocess optimization is simplified.

Intuitive operation andcomprehensive analysis functions
Unique Quality Uplink for simplifiedclassification and process control
Worldwide, competent service on-site,
hotline and remote maintenance

QFP under angledradiation

QFP orthogonallyradiated

Customer support areaon the Viscom website

Whether hidden soldered connections in SMD assembly, power electronics
or non-destructive testing of non-standard components – the X-ray inspection system X8068 guarantees the highest flexibility. The application scope
reaches from random sample analysis and special inspection of individualcomponents, up to automatic start-up support and series inspection. Evenlarge inspection objects, such as printed circuit board panels, are inspected
quickly and reliably. The brilliant image quality, automatic analysis routinesand convenient operation make this system the reliable partner in qualitycontrol.

SPI-AOI-/AXI-Uplink

SPI/Print

SPI/P&P

Closed Loop

SPI-MXI-Uplink

Technical Specifications
X8068
X-ray technology
X-ray tube
Open microfocus transmission tube Viscom XT9160-TED
High voltage
10 - 160 kV
Tube current
5 - 1000 µA
Target power
Max. 40 W
Geometric magnification> 2500 times
Resolution< 4 µm (proved by JIMA tests)
Flat panel detector
5,7" x 4,6" FPD 14 Bit
X-ray cabinet	In compliance with the German X-Ray Regulations (RöV)
regarding fully protected devices. Radiation leakage rate < 1 µSv/hSoftware
User interface
Viscom XMC and Viscom SIOptional	BGA analysis software BGA-S
Surface analysis software (voiding calculation) ACA-S
THT analysis software THT-S
Wire sweep analysis software WSA-S
Viscom Quality Uplink (to Viscom AOI, AXI, MXI, SPI)
System computer
Operating system
ProcessorWindows®
Intel® Core™ i7

Sample handling
Manipulator 	5 axes with sample table
Horizontal X/Y-axis
Travel range: 720 x 1000 mm (28.4" x 39.4")
Vertical Z-axis
Travel range: 320 mm (12.6")
Detector axis
0° - 60° pivoting
Rotational axis
n x 360°
Max. test piece size
722 mm (28.4") (diameter)
Max. test piece weight
15 kg (33 Ibs)
Test piece change
Front window (manual/automatic)
Inspection speed		Variable
Other system data
Power requirements
System dimension
WeightFront view

230 V (other voltages on request), 1P/N/PE, 10 A
1859 x 2202 x 2155 mm (73.19" x 86.69 x 84.84") (W x H x D)
< 3200 kg (7055 Ibs)

Side view

Top view

Headquarters:
Viscom AG
Carl-Buderus-Straße 9 - 15 · 30455 Hanover · Germany
Tel.: +49 511 94996-0 · Fax: +49 511 94996-900
info@viscom.com · www.viscom.com

Visit our website to find international subsidiaries andrepresentatives in Europe, USA and Asia:

www.viscom.com

Specifications subject to change without notice. Windows® and Intel® Core™ i7 are registered trademarks. October 2015

# Viscom_SYS_X8068_EN15100004

Dimensions in mm