Quartz Crystal
Product Catalogue

Contents
Quartz Crystal Products ���������������� 6
Ceramic package
SC-12S����������������������� 7
SC-16S����������������������� 8
SC-20S����������������������� 9
SC-20P���������������������� 10
SC-20T���������������������� 11
SC-20A (For automotive use)������������ 12
SC-32S���������������������� 13
SC-32A (For automotive use)������������ 14
SC-32P (R1=50kΩ max.) Low ESR Series������ 15
SC-32L (R1=40kΩ max.) Low ESR Series������ 16
Plastic mold
SSP-T7-F ��������������������� 17
SSP-T7-FL (SMD type low CL resonator for low-power
microcontrollers)������������������ 18

CylinderVT-200-F �������������������� 19
VT-200-FL(Cylinder type low CL resonator for low-power
microcontrollers)����������������� 20
Oscillator
Crystal Oscillator 32.768kHz SN-20S�������� 21
High accuracy Crystal Oscillator 32.768kHz SH-32R� 23
Check sheet for crystal products selection ������ 25
Environmental Activites ��������������� 26
Quartz Crystal Unit Handling Precautions ������ 27
Oscillation Circuit Design Precautions �������� 30
Packing ���������������������� 32

Creating Time - Optimizing Time - Enriching Time
Seiko Instruments Inc. (SII), founded in 1937 as a member of the Seiko Group specializing in the
manufacture of watches, has leveraged its core competency in high precision watches
to create a wide range of new products and technologies.
Over the years SII has developed high-precision processed parts and machine toolsthat pride themselves on their sub-micron processing capability,
quartz crystals that came about as a result of our quartz watch R&D,
and electronic components such as micro batteries.
Optimizing our extensive experience and expertise, we have since diversified
into such new fields as compact, lightweight, exceedingly quiet thermal printers,
and inkjet printheads, a key component in wide format inkjet printers for corporate use.
SII, in the years to come, will maintain an uncompromised dedication
to its time-honored technologies and innovations of craftsmanship, miniaturization, and efficiency
that meet the needs of our changing society and enrich the lives of those around us.

SEIKO GROUP CORPORATION

3

Product Introduction

B

M

4

The sophisticated metal product, “SPRON”, was born as a material to be used
in a “mainspring” , which is a drive source of mechanical watches. ”SPRON”
has been used for over 50 years as a drive source of watches by utilizing its
high elasticity, high strength, and high heat resistance. Evaluated highly for
its corrosion resistance and durable quality, “SPRON” is used for key devises invarious ﬁelds.

IATF

M

B

5

Quartz Crystal Products
With Precision, we apply our Craftsmanship to provide Miniaturization advantages to customers'
developed products around the world.

Features● Mirror finishing wafer processing technology● Largest Quartz wafer in the industry● Manufacturing capacity for expanded wafer processing● Extensive experience and manufacturing knowledge forQuartz tuning fork crystals

SMD type Quartz Crystal Resonator (Ceramic package)
Parabolic
Coefficient(10-6/℃2)

Load
Capacitance(pF)

Motional
Resistance(kΩ)

Operating
Temp.
(℃)

Storage
Temp.
(℃)

±20

(−0.030±10%)

6, 7, 9, 12.5

70

−40 to +85−55 to +125

3.2×1.5×0.85±20(−0.033±10%)

6, 7, 9, 12.5

50

−40 to +85−55 to +125

Low ESR
type

SC-32L

3.2×1.5×0.85±20(−0.033±10%)

6, 7, 9, 12.5

40

−40 to +85−55 to +125

Low ESR
type

SC-32A

3.2×1.5×0.85±20(−0.030±10%)

6, 7, 9, 12.5

70

−55 to +125

−55 to +125

For automotiveuse

SC-20S

2.0×1.2×0.60±20(−0.030±10%)

6, 7, 9, 12.5

70

−40 to +85−55 to +125

SC-20P

2.0×1.2×0.60±20(−0.030±10%)

6, 7, 9, 12.5

50

−40 to +85−55 to +125

Low ESR
type

SC-20T

2.0×1.2×0.35±20(−0.033±10%)

6, 7, 9, 12.5

75

−40 to +85−55 to +125

Low height

SC-20A

2.0×1.2×0.60±20(−0.028±10%)

6, 7, 9, 12.5

90

−55 to +125

−55 to +125

For automotiveuse

SC-16S

1.6×1.0×0.5±20(−0.036±10%)

6, 7, 9, 12.5

90

−40 to +85−55 to +125

SC-12S

1.2×1.0×0.50±20(−0.036±10%)

6, 7, 9, 12.5

90

−40 to +85−55 to +125

Line up

Size(mm)

SC-32S

3.2×1.5×0.85

SC-32P

Frequency
Tolerance(ppm) (*)

Remarks

2 terminals /4 terminals* Please contact us and specify your requirements.

Cylinder type Quartz Crystal Resonator

SMD type Quartz Crystal Resonator (Plastic mold)
SSP-T7-F

VT-200-F

SSP-T7-FL

VT-200-FL

SMD type Crystal Oscillator (Ceramic package)Line upSize(mm)

Frequency
tolerance(ppm)

Frequency temperature
coefficient−40 to +85℃ (ppm)

Current
consumption
Typ. (μA)

Supply voltage(V)

Temperature
Compensatedvoltage (V)Operating Temp.
(℃)

SH-32R

3.2×1.5×0.9

±3

±50

1.3

1.3 to 3.63

1.5 to 3.63

−40 to +85

SN-20S

2.05×1.2×0.85+5±23+10/−120

0.35

1.2 to 5.5

Car navigation

Smart meter−40 to +105

Application

Smart phone

6

DSC

Note PC

Wireless
communication
moduleHealth caredeviceSurveillancecameraWearable
deviceCeramic
package
Ceramic
package
SC-12SFEATURES• Ultra small size package (1.2 × 1.0 × 0.5mm max.).
• SMD type suitable for high density surface mounting.
• Excellent shock and heat resistance.
• Pb-free.
• Complies with EU RoHS directive.
• Built-in crystal resonator processed by high reliable
photo-lithographic technology.

APPLICATIONS
Mobile Phone, Wearable, Module, Sub-clock function for avariety of Microcontroller, etc.

STANDARD SPECIFICATIONSSpecifications
2 terminals

Nominal Frequency

f_nom

32.768kHz

Frequency Tolerance

f_tol±20×10−6

Turnover TemperatureTi+25±5℃

Parabolic Coefficient

β(−0.036±10%) ×10−6/℃2

Load CapacitanceCL

6.0pF, 7.0pF, 9.0pF, 12.5pF

Motional Resistance (ESR)

R1

90kΩ max.

DLmax.

0.3μW max.

DL

0.1μW typ.

Shunt Capacitance

C0

1.4pF typ.

Frequency Ageing

f_age±5×10−6

Operating Temperature

T_use-40℃ to +85℃

Storage Temperature

T_stg−55℃ to +125℃

#4

#2
#2

0.50MAX
0.50MAX#3 C−0.15
#4
0.35
0.35
#2 C−0.15
1.27±0.03 #1
1.27±0.03#2
C−0.15C−0.15

0.35

#4
#4

1.27±0.03
0.35#11.27±0.03

0.50MAX
1.05±0.05

2 terminals

#4

#1

#1

#1
#1
#1

#2

#2

#1

#2

0.4#1 0.4
0.3

0.3
0.4#2 0.4

0.4

0.4

0.4

0.3
#2
#2

0.3

Unit: mm0.4

Unit: mm
0.4
0.4

0.3
0.3

0.52
0.31

4 terminals
0.52

0.31

#2 #1
0.52 0.31
#2

0.45

#1

#1

0.35
0.35
1.27±0.03
1.27±0.03

#3

0.52

0.45

#4
#4 #1
#4

RECOMMENDED SOLDERINGPATTERN
#3
#4

0.52
0.52

0.25

C−0.15

#2

#4

#2
#2

#1

0.31

#2
#1
#3 #3 #4 #4#1

0.31 #2
0.31

#3

0.25

#3
#3

C−0.15

#4
#4 #4

#4

#1
#1

#3

0.45
0.45

1.05±0.05
1.05±0.05

#3
#3 #2
#3

#1
#1

Unit: mm

#1
#1

#3

#2
#2

#1
#3
#1

0.25
0.25

#3
#3 #3
1.05±0.05

1.05±0.05
1.05±0.05
1.05±0.05

#2
#2

#4

#2
#2

0.50MAX

#1

#3

#2

#1
#4 #1#4

0.45

#1
0.075
#4
0.075

#2 #3
0.4
0.36
#3
0.4
0.36
#21.27±0.03
1.27±0.03

#1

#1

0.25
0.45

0.075

#1

#1

#2
#3#2 #3

#2

1.0

#2 #1

1.27±0.03#2

#1

0.075

#2

#2

0.3

1.27±0.03
0.4
0.36

#2

#1

#1

0.3

#1 #2
#1

0.36
1.05±0.05
1.05±0.05

0.4

#2

#2

#2

0.075

0.075

4 terminals

1.0

0.4
0.4
0.36
1.27±0.03
1.27±0.03

#1

#2
0.36
0.50MAX
0.50MAX#1

Storage as single product2 terminals

0.3
0.3

0.87
0.87

#2

2−C0.102−C0.102−C0.10

4 terminals#2+25±3℃, First Year

INTERNAL LEAD CONNECTION

0.3

#1

#1

0.3
0.50MAX
0.50MAX
0.50MAX

2−C0.100.87 0.87

0.87

0.87

2−C0.102−C0.10

2 terminals

1.05±0.05
1.05±0.05
0.50MAX
1.05±0.05
0.50MAX

0.50MAXDIMENSIONS* Please contact us about available CL.

1.0

Level of Drive* Please contact us about available tolerance.

1.0

Absolute Maximum Drive Level

Conditions / Notes

4 terminals

0.25

Symbol

1.0
1.0

Item

Conditions where not specified (Temperature: 25±2°C, DL: 0.1μW)

#3
#3

#4
#4

#4

#4

Unit: mm0.4
0.4Remark Please make sure there is no pattern under SC-12S on the circuit board.
7

Ceramic package
SC-16SFEATURES• SMD type suitable for high density surface mounting.
• Thin type with height 0.5mm max.
• Excellent shock and heat resistance.
• Pb-free.
• Complies with EU RoHS directive.
• Built-in crystal resonator processed by high reliable
photo-lithographic technology.

APPLICATIONS
Mobile Phone, Wearable, Module, Sub-clock function for avariety of Microcontroller, etc.

STANDARD SPECIFICATIONS
Item

Conditions where not specified (Temperature: 25±2°C, DL: 0.1μW)

SymbolSpecifications

Nominal Frequency

f_nom

32.768kHz

Frequency Tolerance

f_tol±20×10-6

Turnover TemperatureTi+25±5℃

Parabolic Coefficient

β(-0.036±10%)×10-6/℃2

Load CapacitanceCL

6.0pF, 7.0pF, 9.0pF, 12.5pF

Motional Resistance (ESR)* Please contact us about available tolerance.

R1

90kΩ max.

DLmax.

0.5μW max.

Level of DriveDL

0.1μW typ.

Shunt Capacitance

C0

1.2pF typ.

Frequency Ageing

f_age±3×10-6

Operating Temperature

T_use-40℃ to +85℃

Storage Temperature

T_stg-55℃ to +125℃

Absolute Maximum Drive Level

DIMENSIONS

Conditions / Notes* Please contact us about available CL.

+25±3℃, First Year
Storage as single product

INTERNAL LEAD CONNECTION

1.6±0.1#2

1.0±0.1#1

S＊＊＊＊

RECOMMENDED SOLDERING PATTERN

0.87

0.5MAX

2−C0.1

#1

#1

#2
0.69

0.4

Unit: mm

Remark Please make sure there is no pattern under SC-16S on the circuit board.
8#2

Unit: mm

Ceramic package
SC-20SFEATURES• Thin type with height 0.6mm max.
• SMD type suitable for high density surface mounting.
• Excellent shock and heat resistance.
• Pb-free.
• Complies with EU RoHS directive.
• Built-in crystal resonator processed by high reliable
photo-lithographic technology.

APPLICATIONS
Mobile Phone, Wearable, Module, Sub-clock function for avariety of Microcontroller, etc.

STANDARD SPECIFICATIONS
Item

Conditions where not specified (Temperature: 25±2°C, DL: 0.1μW)

SymbolSpecifications

Conditions / Notes

Nominal Frequency

f_nom

32.768kHz

Frequency Tolerance

f_tol±20×10-6

Turnover TemperatureTi+25±5℃

Parabolic Coefficient

β(-0.030±10%)×10-6/℃2

Load CapacitanceCL

6.0pF, 7.0pF, 9.0pF, 12.5pF

Motional Resistance (ESR)

R1

70kΩ max.

DLmax.

1.0μW max.

Level of DriveDL

0.1μW typ.

Shunt Capacitance

C0

1.3pF typ.

Frequency Ageing

f_age±3×10-6

Operating Temperature

T_use-40℃ to +85℃

Storage Temperature

T_stg-55℃ to +125℃

Absolute Maximum Drive Level

DIMENSIONS* Please contact us about available tolerance.

* Please contact us about available CL.

+25±3℃, First Year
Storage as single product

INTERNAL LEAD CONNECTION

＃2

#1

#2

1.0 Typ.

1.4#11.2±0.1＃1

2.05±0.1
1.0 Typ.

2.05±0.1

#2

0.7

0.8

0.7

0.7

0.8

0.7

Unit: mm

1.4

2-C0.15

0.60MAX

2-C0.15#2

RECOMMENDED SOLDERING PATTERN

1.2±0.1

0.60MAX#1

Unit: mm

Remark Please make sure there is no pattern under SC-20S on the circuit board.
9

Ceramic package
SC-20P (R1=50kΩ max.) Low ESR Series
FEATURES• Suitable for Microcontroller with Low ESR (R1=50kΩ max.).
• SMD type suitable for high density surface mounting.
• Excellent shock and heat resistance.
• Pb-free.
• Complies with EU RoHS directive.
• Built-in crystal resonator processed by high reliable
photo-lithographic technology.

APPLICATIONS
PC, Tablet, Module, Wearable, Sub-clock function for avariety of Microcontroller, etc.

STANDARD SPECIFICATIONS
Item

Conditions where not specified (Temperature: 25±2°C, DL: 0.1μW)

SymbolSpecifications

Conditions / Notes

Nominal Frequency

f_nom

32.768kHz

Frequency Tolerance

f_tol±20×10-6

Turnover TemperatureTi+25±5℃

Parabolic Coefficient

β(-0.030±10%)×10-6/℃2

Load CapacitanceCL

6.0pF, 7.0pF, 9.0pF, 12.5pF

Motional Resistance (ESR)

R1

50kΩ max.

DLmax.

1.0μW max.

Level of DriveDL

0.1μW typ.

Shunt Capacitance

C0

1.5pF typ.

Frequency Ageing

f_age±5×10-6

Operating Temperature

T_use-40℃ to +85℃

Storage Temperature

T_stg-55℃ to +125℃

Absolute Maximum Drive Level

DIMENSIONS* Please contact us about available tolerance.

* Please contact us about available CL.

-40℃ to +85℃

+25±3℃, First Year
Storage as single product

INTERNAL LEAD CONNECTION

＃2

#1

#2

1.0 Typ.

1.4#11.2±0.1＃1

2.05±0.1
1.0 Typ.

2.05±0.1

0.7

0.8

0.7

0.7

0.8

0.7

Unit: mm

Remark Please make sure there is no pattern under SC-20P on the circuit board.
10

#2

1.4

2-C0.15

0.60MAX

2-C0.15#2

RECOMMENDED SOLDERING PATTERN

1.2±0.1

0.60MAX#1

Unit: mm

Ceramic package
SC-20T t=0.35mm / 0.33mm
FEATURES• Ultra thin type with height 0.35mm max.
• SMD type suitable for high density surface mounting.
• Excellent shock and heat resistance.
• Pb-free.
• Complies with EU RoHS directive.
• Built-in crystal resonator processed by high reliable
photo-lithographic technology.

APPLICATIONS
Smart card, Wearable, Module, Sub-clock function for avariety of Microcontroller, etc.

STANDARD SPECIFICATIONS
Item

SymbolFrequency Tolerance

f_tol±20×10-6

Turnover TemperatureTi+25±5℃

Parabolic Coefficient

β(-0.033±10%)×10-6/℃2

Load CapacitanceCL

6.0pF, 7.0pF, 9.0pF, 12.5pF

R175kΩ max.

1.0μW max.
0.1μW typ.

1.2±0.1

C0

0.8pF typ.

f_age

±3×10-6

Operating Temperature

T_use-40℃ to +85℃

#1
Storage Temperature

#2
T_stg

-55℃ to +125℃

0.35MAX

Shunt CapacitanceFrequency Ageing

0.45

#2

1.2±0.05#3

0.35MAX
0.35MAX

1.2±0.1

#2

#1

0.7

0.8

#2

4 terminals#12.05±0.05#2#2

0.35 0.55
0.35 0.55

#1
#1
0.7

0.8

0.7

0.7

0.8

0.7

Unit: mm

#1
#1

#3

#4
C−0.15

#2

#2

0.7

#4

0.495

0.9

#3
#4
RECOMMENDED SOLDERINGPATTERN

Unit: mm

#1

0.9

#4
#4

#2

#1

0.7

#2

0.8

1.4

#1
#1

C−0.15

#1

#1

0.65

#3
#3

1.4

#4#3
#4

0.345
0.35
0.345
0.35

0.495

#2
#2

0.35 0.55

2.05±0.05

1

#1
#1

0.7

0.65

0.9

0.65

0.9

#4

#2
#2

#1
#1

#3
#3

#4
#4
#2

#1

#3

#4

0.65

0.35 0.55#4#4

C−0.152.05±0.05#4#2
C−0.15

#4

#1
#1

1.4

#3
#1

#1
#2
#1

t=0.33mm
0.9
0.495

2.05±0.05

0.495

#2
#2

1.4

#3
#3

#4

0.9

#2

4 terminals

0.345

0.45

#1

INTERNAL LEAD CONNECTION#3

0.33MAX1#1#1

0.35MAX
0.35MAX0.45

0.9

2.05±0.1

#2
#2
#3

1

#2
#2

0.45

0.35

#2

Storage as single product
#2

1

0.345

t=0.35mm

1.04
1.2±0.05

1.04

1.04

DIMENSIONS+25±3℃, First Year

0.35

0.35MAX
1.2±0.1
0.35MAX
1.2±0.1

1.04

2.05±0.1* Please contact us about available CL.

80kΩ max.

DL

2.05±0.1

1.2±0.05
1.2±0.05* Please contact us about available tolerance.

DLmax.

Level of Drive

Conditions / Notes

0.33mm

32.768kHz

Absolute Maximum Drive Level#2#2

0.35mmf_nom

2.05±0.1#3#3Specifications

Nominal Frequency

Motional Resistance (ESR)#1#1

Conditions where not specified (Temperature: 25±2°C, DL: 0.1μW)

0.9

Unit: mm

Remark Please make sure there is no pattern under SC-20T on the circuit board.
11

Ceramic package
SC-20A (For automotive use)
FEATURES・Conforms to "AEC-Q200".
• Thin type with height 0.6mm max.
• SMD type suitable for high density surface mounting.
• Excellent shock and heat resistance.
• Pb-free.
• Complies with EU RoHS directive.
• Built-in crystal resonator processed by high reliable
photo-lithographic technology.

APPLICATIONSCar Audio, Car Navigation, ECU sub-clock, In-vehicle
clock etc.

STANDARD SPECIFICATIONS
Item

Conditions where not specified (Temperature: 25±2°C, DL: 0.1μW)

SymbolSpecifications

Conditions / Notes

Nominal Frequency

f_nom

32.768kHz

Frequency Tolerance

f_tol±20×10-6

Turnover TemperatureTi+25±5℃

Parabolic Coefficient

β(-0.028±10%)×10-6/℃2

Load CapacitanceCL

6.0pF, 7.0pF, 9.0pF, 12.5pF

Motional Resistance (ESR)

R1

90kΩ max.

Absolute Maximum Drive Level

DLmax.

1.0μW max.

Level of DriveDL

0.1μW typ.

Shunt Capacitance

C0

1.3pF typ.

Frequency Ageing

f_age±3×10-6

Operating Temperature

T_use-55℃ to +125℃

Storage Temperature

T_stg-55℃ to +125℃

DIMENSIONS* Please contact us about available tolerance.

* Please contact us about available CL.

+25±3℃, First Year
Storage as single product

INTERNAL LEAD CONNECTION＃2

1.0 Typ.

1.0 Typ.
2.05±0.1

1.0 Typ.
2.05±0.1

2.05±0.1

1.2±0.1＃1

RECOMMENDED SOLDERING PATTERN

#1
0.7

0.7

0.7
Unit: mm

Remark Please make sure there is no pattern under SC-20A on the circuit board.
12

#2
0.8

0.7

0.8

0.7

0.8

0.7

1.4 1.4

2-C0.15#2

1.4

2-C0.151.2±0.1
1.2±0.1 0.60MAX
0.60MAX

2-C0.15

0.60MAX#1

Unit: mm

Ceramic package
SC-32SFEATURES• Thin type with height 0.85mm max.
• SMD type suitable for high density surface mounting.
• Excellent shock and heat resistance.
• Pb-free.
• Complies with EU RoHS directive.
• Built-in crystal resonator processed by high reliable
photo-lithographic technology.

APPLICATIONS
Mobile Phone, Wearable, Module, Sub-clock function for avariety of Microcontroller, etc.

STANDARD SPECIFICATIONS
Item

Conditions where not specified (Temperature: 25±2°C, DL: 0.1μW)

SymbolSpecifications

f_nom

Frequency Tolerance

f_tol

Turnover TemperatureTi+25±5℃

Parabolic Coefficient

β(-0.030±10%)×10-6/℃2

Load CapacitanceCL

6.0pF, 7.0pF, 9.0pF, 12.5pF

Motional Resistance (ESR)

R1

70kΩ max.

DLmax.

1.0μW max.

DL

0.1μW typ.

Shunt Capacitance

C0

1.0pF typ.

Frequency Ageing

f_age±3×10-6

Operating Temperature

T_use-40℃ to +85℃

Storage Temperature

T_stg-55℃ to +125℃

Absolute Maximum Drive Level
Level of Drive

32.768kHz

Conditions / Notes

Nominal Frequency

38.4kHz±20×10-6

DIMENSIONS* Please contact us about available tolerance.

* Please contact us about available CL.

+25±3℃, First Year
Storage as single product

INTERNAL LEAD CONNECTION

1.7 Typ.

C0.2
1.7 Typ.
3.2＋0.1

C0.2

3.2＋0.1

1.8

#1
1.5

1.0

1.0

1.7 Typ.
3.2＋0.1#2

1.0
Unit: mm

1.8

C0.2

1.8

#2

1.5±0.1#1#2

RECOMMENDED SOLDERING PATTERN

1.5±0.1
0.75±0.1
1.5±0.1
0.75±0.1

0.75±0.1

#1

1.0

1.5

1.5

1.0

1.0
Unit: mm

Remark Please make sure there is no pattern under SC-32S on the circuit board.
13

Ceramic package
SC-32A (For automotive use)
FEATURES• Conforms to "AEC-Q200".
• SMD type suitable for high density surface mounting.
• Excellent shock and heat resistance.
• Pb-free.
• Complies with EU RoHS directive.
• Built-in crystal resonator processed by high reliable
photo-lithographic technology.

APPLICATIONSCar Audio, Car Navigation, ECU sub-clock, In-vehicle
clock etc.

STANDARD SPECIFICATIONS
Item

Conditions where not specified (Temperature: 25±2°C, DL: 0.1μW)

SymbolSpecifications

Nominal Frequency

f_nom

32.768kHz

Frequency Tolerance

f_tol±20×10-6

Turnover TemperatureTi+25±5℃

Parabolic Coefficient

β(-0.030±10%)×10-6/℃2

Load CapacitanceCL

6.0pF, 7.0pF, 9.0pF, 12.5pF

Motional Resistance (ESR)

R1

70kΩ max.

DLmax.

1.0μW max.

Level of DriveDL

0.1μW typ.

Shunt Capacitance

C0

1.0pF typ.

Frequency Ageing

f_age±3×10-6

Operating Temperature

T_use-55℃ to +125℃

Storage Temperature

T_stg-55℃ to +125℃

Absolute Maximum Drive Level

DIMENSIONS

Conditions / Notes* Please contact us about available tolerance.

* Please contact us about available CL.

+25±3℃, First Year
Storage as single product

INTERNAL LEAD CONNECTION

1.7 Typ.

C0.2
1.7 Typ.
3.2＋0.1

C0.2

3.2＋0.1

1.8

#1
1.5

1.0

1.0

1.7 Typ.
3.2＋0.1#2

1.0
Unit: mm

Remark Please make sure there is no pattern under SC-32A on the circuit board.
14

1.8

C0.2

1.8

#2

1.5±0.1#1#2

RECOMMENDED SOLDERING PATTERN

1.5±0.1
0.75±0.1
1.5±0.1
0.75±0.1

0.75±0.1

#1

1.0

1.5

1.5

1.0

1.0
Unit: mm

Ceramic package
SC-32P (R1=50kΩ max.) Low ESR Series
FEATURES• Suitable for Microcontroller with Low ESR (R1=50kΩ max.).
• SMD type suitable for high density surface mounting.
• Excellent shock and heat resistance.
• Pb-free.
• Complies with EU RoHS directive.
• Built-in crystal resonator processed by high reliable
photo-lithographic technology.

APPLICATIONS
PC, Tablet, Module, Wearable, Sub-clock function for avariety of Microcontroller, etc.

STANDARD SPECIFICATIONS
Item

Conditions where not specified (Temperature: 25±2°C, DL: 0.1μW)

SymbolSpecifications

Nominal Frequency

f_nom

32.768kHz

Frequency Tolerance

f_tol±20×10-6

Conditions / Notes* Please contact us about available tolerance.

Turnover TemperatureTi+25±5℃

Parabolic Coefficient

β(-0.033±10%)×10-6/℃2

Load CapacitanceCL

6.0pF, 7.0pF, 9.0pF, 12.5pF

Motional Resistance (ESR)

R1

50kΩ max.

DLmax.

1.0μW max.

Level of DriveDL

0.1μW typ.

Shunt Capacitance

C0

1.0pF typ.

Frequency Ageing

f_age±3×10−6

Operating Temperature

T_use−40℃ to +85℃

Storage Temperature

T_stg−55℃ to +125℃

Absolute Maximum Drive Level

DIMENSIONS* Please contact us about available CL.

−40℃ to +85℃

+25±3℃, First Year
Storage as single product

INTERNAL LEAD CONNECTION

1.7 Typ.

C0.2
1.7 Typ.
3.2＋0.1

C0.2

3.2＋0.1

1.7 Typ.
3.2＋0.1

1.8

#1

#2
1.5

1.0

1.0

1.0
Unit: mm

1.8

C0.2

1.8

#2

1.5±0.1#1#2

RECOMMENDED SOLDERING PATTERN

1.5±0.1
0.75±0.1
1.5±0.1
0.75±0.1

0.75±0.1

#1

1.0

1.5

1.0

1.5

1.0
Unit: mm

Remark Please make sure there is no pattern under SC-32P on the circuit board.
15

Ceramic package
SC-32L (R1=40kΩ max.) Low ESR Series
FEATURES• Suitable for Microcontroller with Low ESR (R1=40kΩ max.).
• SMD type suitable for high density surface mounting.
• Excellent shock and heat resistance.
• Pb-free.
• Complies with EU RoHS directive.
• Built-in crystal resonator processed by high reliable
photo-lithographic technology.

APPLICATIONS
PC, Tablet, Module, Wearable, Sub-clock function for avariety of Microcontroller, etc.

STANDARD SPECIFICATIONS
Item

Conditions where not specified (Temperature: 25±2°C, DL: 0.1μW)

SymbolSpecifications

Nominal Frequency

f_nom

32.768kHz

Frequency Tolerance

f_tol±20×10-6

Conditions / Notes* Please contact us about available tolerance.

Turnover TemperatureTi+25±5℃

Parabolic Coefficient

β(-0.033±10%)×10-6/℃2

Load CapacitanceCL

6.0pF, 7.0pF, 9.0pF, 12.5pF

Motional Resistance (ESR)

R1

40kΩ max.

DLmax.

1.0μW max.

Level of DriveDL

0.1μW typ.

Shunt Capacitance

C0

1.2pF typ.

Frequency Ageing

f_age±3×10−6

Operating Temperature

T_use−40℃ to +85℃

Storage Temperature

T_stg−55℃ to +125℃

Absolute Maximum Drive Level

DIMENSIONS* Please contact us about available CL.

−40℃ to +85℃

+25±3℃, First Year
Storage as single product

INTERNAL LEAD CONNECTION

1.7 Typ.

C0.2
1.7 Typ.
3.2＋0.1

C0.2

3.2＋0.1

1.7 Typ.
3.2＋0.1

1.8

#1

#2
1.5

1.0

1.0

1.0
Unit: mm

Remark Please make sure there is no pattern under SC-32L on the circuit board.
16

1.8

C0.2

1.8

#2

1.5±0.1#1#2

RECOMMENDED SOLDERING PATTERN

1.5±0.1
0.75±0.1
1.5±0.1
0.75±0.1

0.75±0.1

#1

1.0

1.5

1.0

1.5

1.0
Unit: mmPlastic mold
SSP-T7-F
FEATURES• Thin type with height 1.4mm max.
• SMD type suitable for high density surface mounting.
• Excellent shock and heat resistance.
• Complies with EU RoHS directive.
• Complete Halogen-free.
• Built-in crystal resonator processed by high reliable
photo-lithographic technology.

APPLICATIONSClock for time display and timer, Power/water meter,
Sub-clock function for a variety of Microcontroller, etc

STANDARD SPECIFICATIONS
Item

Conditions where not specified (Temperature: 25±2°C, DL: 0.1μW)

SymbolSpecifications

Nominal Frequency

f_nom

32.768kHz

Frequency Tolerance

f_tol±20×10-6

Turnover TemperatureTi+25±5℃

Parabolic Coefficient

β(-0.033±10%)×10-6/℃2

Load CapacitanceCL

7.0pF, 9.0pF, 12.5pF

Motional Resistance (ESR)

R1

65kΩ max.

DLmax.

1.0μW max.

Level of DriveDL

0.1μW typ.

Shunt Capacitance

C0

0.9pF typ.

Frequency Ageing

f_age±3×10−6

Operating Temperature

T_use−40℃ to +85℃

Storage Temperature

T_stg−55℃ to +125℃

Absolute Maximum Drive Level

#2

#4

#3

#1

#2

#3

#4
#1

0.3

0.6
#2

RECOMMENDED SOLDERING PATTERN

0.6

0.6
1.05

#4

Storage as single product

0.1

0.15

6.7
7.0 max.

0.55#1+25±3℃, First Year#3

1.4 max.

0.3
0.1* Please contact us about available CL.

1.5 max.

#4#1* Please contact us about available tolerance.

INTERNAL LEAD CONNECTION

0.55

0.3

DIMENSIONS

Conditions / Notes

1.2

Unit: mm

#3
#2

5.1

1.2
Unit: mm

Remark Please make sure there is no pattern under SSP-T7-F on the circuit board.
17

Plastic mold
SSP-T7-FL (SMD type low CL resonator for low-power microcontrollers)
FEATURES• Consumes one tenth the standby power of general crystal
resonators (with a load capacitance of 12.5 pF) (*1).
• Excellent low drive characteristics.
• Complies with EU RoHS directive.
• Built-in crystal resonator processed by high reliable
photo-lithographic technology.
(*1) When using a microcontroller that supports low CL.

APPLICATIONS• Consumer electronics products for saving standby
energy consumption.
• The devices which is operated by the battery requiring
a long battery life.

STANDARD SPECIFICATIONS
Item

Conditions where not specified (Temperature: 25±2°C, DL: 0.01μW)

SymbolSpecifications

Nominal Frequency

f_nom

32.768kHz

Frequency Tolerance

f_tol±20×10-6

Turnover TemperatureTi+25±5℃

Parabolic Coefficient

β(-0.033±10%)×10-6/℃2

Load CapacitanceCL

3.7pF, 4.4pF, 6.0pF

Motional Resistance (ESR)* Please contact us about available tolerance.

R1

65kΩ max.

DLmax.

1.0μW max.

Level of DriveDL

0.01μW typ.

Shunt Capacitance

C0

0.9pF typ.

Frequency Ageing

f_age±3×10-6

Operating Temperature

T_use-40℃ to +85℃

Storage Temperature

T_stg-55℃ to +125℃

Absolute Maximum Drive Level

0.1

#3

#1

#2

#3

0.6
#2

RECOMMENDED SOLDERING PATTERN

#4

0.6

0.6
1.05

#4

#4

#1

0.3

#2

0.15

6.7
7.0 max.

0.55#1Storage as single product#3

1.4 max.

#4#1+25±3℃, First Year

1.5 max.

0.3
0.1* Please contact us about available CL.

INTERNAL LEAD CONNECTION

0.55

0.3

DIMENSIONS

Conditions / Notes

1.2

Unit: mm

#3
#2

5.1

1.2
Unit: mm

Remark Please make sure there is no pattern under SSP-T7-FL on the circuit board.

CAUTION

The SSP-T7-FL is designed for use in ultra-low-power microcontrollers. Do not use this resonator in regularmicrocontrollers as it might cause problems with oscillation.
18

Cylinder
VT-200-F
FEATURES• 2.0Φ tubular package.
• Built-in crystal resonator processed by high reliable
photo-lithographic technology.
• Excellent shock resistance and environmental
characteristics.
• Pb-free.
• Complies with EU RoHS directive.

APPLICATIONSClocks, Timers, Water/Electricity Meters,
Remote controllers,
Sub-clock function for a variety of Microcontroller, etc.

STANDARD SPECIFICATIONS
Item

Conditions where not specified (Temperature: 25±2°C, DL: 0.1μW)

SymbolSpecifications

Nominal Frequency

f_nom

32.768kHz

Frequency Tolerance

f_tol±20×10-6

Turnover TemperatureTi+25±5℃

Parabolic Coefficient

β(-0.035±10%)×10-6/℃2

Load CapacitanceCL

7.0pF, 9.0pF, 12.5pF

Motional Resistance (ESR)

R1

50kΩ max.

DLmax.

1.0μW max.

DL

0.1μW typ.

Shunt Capacitance

C0

0.9pF typ.

Frequency Ageing

f_age±3×10-6

Operating Temperature

T_use-40℃ to +85℃

Storage Temperature

T_stg-40℃ to +85℃

Absolute Maximum Drive Level
Level of Drive

Conditions / Notes* Please contact us about available tolerance.

* Please contact us about available CL.

+25±3℃, First Year
Storage as single product

DIMENSIONS+0.10（φ 0.26）（0.65）

5.0 min.

φ 2.0 max.

6.0 −0.15

Unit: mm

Remark Please make sure there is no pattern under VT-200-F on the circuit board.

19

Cylinder
VT-200-FL (Cylinder type low CL resonator for low-power microcontrollers)
FEATURES• Consumes one tenth the standby power of general crystal
resonators (with a load capacitance of 12.5 pF) (*1).
• Built-in crystal resonator processed by high reliable
photo-lithographic technology.
• Excellent low drive characteristics.
• Pb-free.
• Complies with EU RoHS directive.
(*1) When using a microcontroller that supports low CL.

APPLICATIONS• Consumer-electronics products for saving standby
energy consumption.
• The devices which is operated by the battery requiring
a long battery life.

STANDARD SPECIFICATIONS
Item

Conditions where not specified (Temperature: 25±2°C, DL: 0.01μW)

SymbolSpecifications

Nominal Frequency

f_nom

32.768kHz

Frequency Tolerance

f_tol±20×10-6

Turnover TemperatureTi+25±5℃

Parabolic Coefficient

β(-0.035±10%)×10-6/℃2

Load CapacitanceCL

3.7pF, 4.4pF, 6.0pF

Motional Resistance (ESR)

R1

50kΩ max.

DLmax.

1.0μW max.

Level of DriveDL

0.01μW typ.

Shunt Capacitance

C0

0.9pF typ.

Frequency Ageing

f_age±3×10-6

Operating Temperature

T_use-40℃ to +85℃

Storage Temperature

T_stg-40℃ to +85℃

Absolute Maximum Drive Level

Conditions / Notes* Please contact us about available tolerance.

* Please contact us about available CL.

+25±3℃, First Year
Storage as single product

DIMENSIONS+0.10（φ 0.26）（0.65）

5.0 min.

φ 2.0 max.

6.0 −0.15

Unit: mm

Remark Please make sure there is no pattern under VT-200-FL on the circuit board.

CAUTION

The VT-200-FL is designed for use in ultra-low-power microcontrollers. Do not use this resonator in regularmicrocontrollers as it might cause problems with oscillation.

20

Oscillator
Low power crystal oscillator 32.768kHz SN-20S
FEATURES• Small size package (2.0×1.2×0.85mm)• Ultra low current consumption 0.5μA Typ. (VDD=3.3V)• Pb-free• Built-in crystal resonator processed by high reliable
photo-lithographic technology.

APPLICATIONS
Wearable, Module, Sub-clock function for a variety ofMicrocontroller, etc.

STANDARD SPECIFICATIONS
Item

SymbolSpecifications

Unit

Nominal Frequency

f_nom

32.768kHz

Frequency tolerance

f_tol

±20

×10−6

Voltage

VDD

1.2 to 5.5

V

Storage Temperature

T_stg−55 to +125℃

Conditions / Notes

Operating Temperature

T_use−40 to +85℃

Turnover Temperature

Ti

25±5

℃

Parabolic Coefficient

β−0.030±10%×10−6/℃2

f0_VDD±1

×10−6/V

0.35 Typ./0.65 Max.

μA

VDD=1.8V, No load condition

0.50 Typ./0.80 Max.

μA

VDD=3.3V, No load condition

0.25 Typ./0.60 Max.

μA

VDD=1.2 to 5.5V, No load condition

Frequency / voltage coefficient

VDD=1.2 to 5.5V

Current consumption

IDD

Current consumption(sleep)

IDD2

Symmetry

SYM

50±10

%

Load : 15pF

Rise time / Fall time

tr/tf

200 Max.

ns

Load : 15pF, 0.1VDD to 0.9VDD / 0.9VDD to 0.1VDD

VIL

0.2VDD Max.

V

INHN terminal

Input voltage
Output voltage

VIH

0.8VDD Min.

V

INHN terminal

VOL

0.4 Max.

V

Q terminal

VOH

VDD-0.4 Min.

V

Q terminal

CLOUT

15 Max.

pF

CMOS Loading

Start-up time

t_str

0.15 Typ./0.50 Max.

sec

Frequency aging

f_age

±3

×10−6

Output load condition (CMOS)First Year

※Unless otherwise stated, characteristics (specifications) shown in the above table are based on Ta=+25℃±3℃, VDD=3.3V±10%.

DIMENSIONSRECOMMENDED SOLDERING PATTERN

2.05±0.1＃3

0.65

1.2±0.1
＃2

1.1

0.475
＃2

＃4

＃3

INHN

#2

Vss

#3

Q
VDD

#4

0.6

Connection

#1

0.3

Pin #

0.45

0.45

＃1

（0.3）

0.475

0.65

PIN MAP

0.85 max

＃1

1.1

0.6

＃4

Unit: mm

Unit: mm21

Oscillator
Low power crystal oscillator 32.768kHz SN-20S
Maximum rating
Item

SymbolRated value

Unit

VDD

−0.5 to +7.0

V

VDD −VSS

Supply voltage range

Conditions

Input voltage range

Vinl−0.5 to +7.0

V

input terminal (INHN)

Output voltage range

Vout−0.5 to VDD +0.5

V

Output terminal (Q)Output current

Iout

25

mA

Output terminal (Q)*It is a value that should not be exceeded even for a moment.

Input /output waveform

VDD
VDD min.

GND

VIH

INHN
VDD

VIL

VDD

̲str
VDD tmin.

GND

VDD min.

GND

INHN
Q

Hi-Z
VIH

INHN

VIL

t̲str

VIH

VIL

t̲str
Hi-Z

Q

Hi-Z

Q

Circuit connection with MCU
VDD

VDD

Connection example 1

Connection example 2

32kHz Out

Connect the VDD pin and
4 the INHN pin if the
3
32kHz output ON/OFF operation is not to be performed.
VDD
Q
VDD

INHN
4

VSS

1

VDD

Q

INHN

VSS

0.1μF
1
0.1μF

0.1μF
VDD

VDD
32kHz Out

VDD

Q

INHN

VSS

0.1μF

Q

INHN

VSS

Vin
High / Low Input

VinHigh / Low Input

0.1μF

1

32kHz Out

VSS

VDD
0.1μF

1

2

32kHz Out

INHN
4

3

VDD

21

Input High/Low to the INHN pin to turn4
3
ON/OFF the 32kHz output.
VDD
Q

32kHz Out34 232kHz Out

34

2

3

VDD

Q

INHN
21

VSS
2

Vin
High / Low Input

It is recommended that a bypass capacitor (0.01µF to 0.1µF) between VDD and GND be mounted as close as possible to the VDD pins.

Q terminal output setting
Terminal INHN (Vin)22

Terminal Q

RemarksHigh

0.8VDD min.

32kHz Output−

Low

0.2VDD max.

Hi-Z

−

OPEN

−

−

Do not use

Oscillator
High Accuracy Crystal Oscillator 32.768kHz SH-32R
FEATURES• E x c e l l e n t f r e q u e n c y a c c u r a c y a n d Te m p e r a t u r echaracteristics• Low current consumption• Pb-free• Incorporated highly reliable photolithographic crystal
resonator

APPLICATIONS
Smart Meter, IoT, Wearable device, Industry device,High precision timing device, Event data recorder

STANDARD SPECIFICATIONS
Item

SymbolSpecifications

Unit

Conditions / Notes

Nominal Frequency

f_nom

32.768kHz

Frequency Tolerance

f_tol

±3

×10−6

Temperature range

f0-Tc

±50

×10−6

−40 to +85℃ (+25℃ is reference）

Frequency / voltage coefficient

f0_VDD±1

×10−6/V

VDD=1.5 to 3.63V

Voltage

VDD

1.5 to 3.63

V

Storage Temperature

T_stg−40 to +105℃

Operating Temperature

T_use−40 to +85℃

Current consumption

IDD

1.3 Typ.

μA

2.5 Max.

μA

Symmetry

SYM

40/60

%

Load : 30pF

Rise time / Fall time

tr/tf

40 Max.

ns

Load : 30pF, 0.1VDD to 0.9VDD / 0.9VDD to 0.1VDD

Input voltage

No load condition

VIL

0.2VDD Max.

V

INHN terminal

VIH

0.8VDD Min.

V

INHN terminal

VOL

0.1VDD Max.

V

Q terminal

VOH

0.9VDD Min.

V

Q terminal

CLOUT

30 Max.

pF

CMOS Loading

Start-up time

t_str

0.5 Max.

secFrequency aging

f_age

±3

×10−6

Output voltage
Output load condition (CMOS)First Year

※Unless otherwise stated, characteristics (specifications) shown in the above table are based on Ta=+25℃±3℃, VDD=3.3V±10%.

DIMENSIONSTEMPERATURE CHARACTERISTIC

3.2±0.2

#1

#2

1.7

1.0

Temperature characteristic graph(ability example)◆ Crystal■ SH-32R

0.9 max0.8

1.5±0.2

0.3

#3
0.8

1.0

#4

PIN MAP

0.75
#2

0.6

0.6

（1.7）
0.6

#4

#3

（0.3）

0.75
#1

Pin #

Connection

Function#1

INHN

Q terminal output selector

#2

Vss

Connects to GND

#3

Q
VDD

Outputs 32.768kHz#4

Connects to VDD

Unit: mm23

Oscillator
High Accuracy Crystal Oscillator 32.768kHz SH-32R
Maximum rating
Item

SymbolRated value

Unit

VDD

−0.3 to +4.5

V

VDD −VSS

Supply voltage range

Conditions

Input voltage rangeVin−0.3 to VDD +0.3

V

input terminal（INHN）

Output voltage range

Vout−0.3 to VDD +0.3

V

Output terminal（Q）

Output current

Iout

±10

mA

Output terminal（Q）*It is a value that should not be exceeded even for a moment.

Operating condition
Symbol

Min.

Typ.

Max.

Unit

VDD rise time

Item

t VDD

−

−

10

ms/V

VDD OFF time

t OFF

0.5

−

−

msec

VDD OFF voltage

Vbot

−

−

0

V

*In order to start oscillation correctly, VDD must be kept at 0V for 0.5msec or more, and then start up at less than 10ms/V.
Please note that 32.768kHz oscillation will not start if VDD is restarted without dropping to 0V.
tVDD
Timing chart for applying

power supply voltage
VDD

tVDD

tVDD

VDD

VDDVDD=1.5V

Vbot

tVDD
VDD=1.5V

VDD=1.5V

VDD=1.5V

Vbot

Vbot

INHN

Q

t̲STR

Hi-Z

Hi-Z

VDD=1.5V

t OFF

t̲STR

t̲STR
*Oscillation startup time (t_STR)
is operated by the boot circuit,and the oscillation frequency is
not 32.768kHz±3ppm.

VDD=1.5V
t OFF

t OFF

INHN

INHN

tVDD

tVDD

t̲STR

t̲STR

t̲STR

Hi-Z

Q

Q

Circuit connection with MCU
Connection example 1

Connection example 2

Connect the VDD pin and the INHN pin if the 32kHz
VDD
output ON/OFF operation is not to be performed.
VDD

VDD

32kHz out

4

34

VDD

Q VDD

INHN

VSS INHN
0.1μF

1
0.1μF

21

0.1μF

Input High/Low to the INHN pin to turn the 32kHz output
VDD
ON/OFF.

VDD

432kHz out

3

32kHz out
Q

VDD

3

INHN

Q

1

0.1μF

2

VSS
2

VDD
0.1μF
INHN
1

Vin
High / Low Input

4

332kHz out

0.1μF

4

VSS

32kHz out

VDD

34
Q VDD

SS
VVin
INHN

Q

INHN

3
Q

VSS

1

High / Low Input

21
VinHigh / Low Input

32kHz out

VDD

2

VSS
2

Connect a bypass capacitor (0.01μF to 0.1μF) between the power supply pins (VDD -VSS).

Q terminal output setting
Terminal INHN (Vin)24

Terminal Q

RemarksHigh

0.8VDD～VDD+0.3

32.768kHz Output−

Low−0.3V～0.2VDD

Hi-Z

−

OPEN

−

−

Do not use

Check sheet for crystal products selection
When considering our crystal resonator / oscillator, please inform the following items. We
will propose applications, characteristics etc. of the usage conditions.
1. Products of interest(1) Cylinder type resonator□VT-200-F□SSP-T7-F□SSP-T7-FL(3) Ceramic package type resonator□SC-32S□SC-32A□SC-32P□SC-32L□SC-20S□SC-20A□SC-20P□SC-20T□SC-16S(2) Plastic mold type resonator□VT-200-FL□SC-12S(4) Oscillator□SH-32R□SN-20S

2. Applications

3. Semiconductors usage(1) Semiconductors□Microcontroller

□ASIC

□RTC

□Others□Manufactuer product name

(2) Purpose of usage□Timekeeping□Stand-by□Communication□Others
4. Reguired specification for the resonator(1) Nominal Frequency (f_nom)□32.768kHz□Others(2) Operating Temperature (T_use)□−40 to +85℃

□Others□±20ppm□±10ppm□Othersppm(3) Frequency Tolerance (25±2℃) (f_tol)(4) Load Capacitance (CL)
□12.5pF□9pF□Others

pF

kHz℃□±5ppm□7pF□6pF(5) Number of terminals (For SC-12S)□2 terminals□4 terminals

5. Required specification for the oscillator(1) Frequency-temperature coefficient (fo_Tc)□±50ppm (-40 to +85℃)□±30ppm (-10 to +60℃)□±40ppm (-20 to +70℃)□±20ppm (0 to +50℃)

6. Special requiremente.g.) Automotive usage or medical device usage or special quality requirement.

7. Others

25

Environmental Activites
Environmental Policy
The Seiko Group recognizes that the preservation of the global environment is one of the most important issues
in the world today. We will constantly strive to help realize a sustainable society that will benefit everyone.
1. We are committed to a wide range of environmentally responsible activities, and we will continue to make unceasing
efforts to improve our environmental performance, thereby providing increased value for all our stakeholders.
2. We not only comply with all relevant laws and regulations, but also go far beyond legal compliance in our efforts to
reduce environmental risks and prevent pollution.
3. Being acutely aware of the part we have to play in mitigating climate change, we are working hard to reducegreenhouse gas emissions.
4. Because we recognize the limits of our precious natural resources, we are increasing our efforts to reuse and recycle
every resource possible.
5. We are also working to preserve biodiversity, recognizing that our business activities inevitably affect surrounding
ecosystems, and that we also benefit from the health and diversity of those systems.
6. We rigorously ensure proper management of all chemical substances used in production as well as any that arecontained in our finished products.
7. We consider the environment throughout the entire life cycle of our products. We are proud that our products andservices actively contribute to environmental conservation.
8. Environmental responsibility starts as a management imperative, but to effectively carry out that mission requires
the understanding and cooperation of every employee throughout our Group. With that in mind, we are working toraise everyone’s environmental awareness so that all of us can work together to protect and nurture our naturalenvironment.
9. Transparency is another part of our social responsibility. We are therefore promoting active disclosure of material
information about our environmental activities and promoting increased communication with local, regional, andglobal stakeholders.
10. In order to derive maximum benefits from these policies, we establish clear environmental targets and strategies
to attain them. Then we steadily improve our efforts by constantly re-examining both our targets and our progress
towards achieving them.

26

Quartz Crystal Unit Handling Precautions
1. MOUNTING PRECAUTIONS•

Lead Type Crystal Units

Structure

Tubular crystal units (VT) are hermetically sealed using glass (see Figures 1 and 2).
Case

Case
Hermetic
Glass•

Unbending the lead

Hermetic
Glass

Lead

Lead

Figure 1

Figure 2(1) DO NOT pull the lead excessively if unbending a lead or removing a crystal unit. The excessive force may crack
the glass and reduce the degree of vacuum. This may eventually result in deterioration of the characteristics andmay also break the crystal chip (see Figure 3).
(2) Unbend the lead by pressing on the bent part from both the upper and lower sides with fixing the bottom of leadtightly (see Figure 4).
Tweezers orneedle-nose pliers

Breakage

Case
Lead

Figure 3•

Figure 4

Bending the lead

(1) Bend the lead so that the lead will remain straight for more than 0.5mm from the case when soldering a crystal
unit after bending. If not, the glass may be cracked (see Figures 5 and 6).
(2) Always leave a length greater than 2.0mm when bending a lead after soldering (see Figure 7).
D

0.5mm

0.5mm
Solder2.0mm
L＞D

Printed circuitboard

Solder
SolderFigure 5
Soldering directly to the case will reduce the degree of vacuum
and may result in deterioration of the characteristics and may
break the crystal chip.

Figure 6

L

Figure 7
Make the length from the case to the printed circuit board(L) longer than the case diameter (D) so that the lead wire
will not be pulled in case the crystal unit falls over.

2. Precautions for mounting plastic molded products• If the board is deformed such as bending after mounting on the board, peeling of the soldered part between the crystal
resonator and the board, the crack in the plastic molding, destruction of the internal element, etc. may occur. Especiallywhen dividing the board on which it is mounted, there is a possibility that a large stress may be applied at the time ofdivision. Please consider board layout and cutting method to minimize stress on products.
• When the product is automatically mounted on the board, if a large impact is applied to the crystal resonator, there is apossibility that characteristics may change / deteriorate or the product may be broken. When mounting automatically,please set conditions considering the shock to the crystal unit. Also, please conduct the mounting test beforehand andconfirm that there is no influence on the characteristics to the crystal resonator.
27

Quartz Crystal Unit Handling Precautions
3. Precautions for mounting ceramic package products• If the board is deformed such as bending after mounting on the board, peeling of the soldered part between the crystal
resonator and the board, the crack in the ceramic package, destruction of the internal element, etc. may occur. Especiallywhen dividing the board on which it is mounted, there is a possibility that a large stress may be applied at the time ofdivision. Please consider board layout and cutting method to minimize stress on products.
• When the product is automatically mounted on the board, if a large impact is applied to the crystal resonator, there is apossibility that characteristics may change / deteriorate or the product may be broken. When mounting automatically,please set conditions considering the shock to the crystal unit. Also, please conduct the mounting test beforehand andconfirm that there is no influence on the characteristics to the crystal resonator.

• The cracks may be occured in the soldered part by repeating the harsh temperature change for a long time when
mounting the product on a board having a expansion coefficient different from that of the ceramics used in the
crystal package. When using under such circumstances, please conduct test beforehand at your company andconfirm that there is no influence on the crystal unit.
• Ceramic packages are small and thin products. So when you repair the rework after mounting, please give due
consideration to the selection and handling of the tools to be used.

4. SOLDERING• Cylinder	The soldering position has to be at the lead wire more than 1.0mm away from the glass seal.
A long time for heating at high temperature may result in deterioration of the characteristics and may breakthe crystal unit.
If crystal unit is unavoidably heated, heat the lead part at 300℃ or lower for 5 seconds or less and please
make sure to keep the case below 150℃.
• Ceramic package, Plastic mold, Oscillator
An example of the reflow temperature profile is shown as follows (see Figure 8).
Example of SMD product soldering conditions

Temperature (°C)(260°C peak: Lead-free products)
260°C peak.
250±10°C
220°C

250
200

10±1sec170±10°C
50±10sec

150
100

120±20sec

50

Note: the temperature is
the PCB surface temperature.
50

100

150

200

250

Time(sec.)

Figure 8

5. CLEANING• Since a small, thin crystal chip is used for tuning fork crystal units and the frequency approximates that of an
ultrasonic cleaner, the crystal chip may break easily. Therefore, DO NOT perform ultrasonic cleaning.

6. MECHANICAL SHOCK• Quartz crystal units are designed to withstand a drop from 75cm onto a concrete at least 3 times. However, their crys-tal chips may break depending on the conditions when they are dropped. Ensure that the crystal unit functions normally before use if the crystal units have been dropped or subjected to an excessive mechanical shock.
• Unlike chip parts such as resistors, and capacitors, the SMD crystal unit has a crystal chip which is hermetically sealed
inside. Therefore, check the influence of shock during automatic mounting or influence of deposition of case to theboard by ultrasonic vibration before use.
• Avoid mounting crystal unit to the board with mechanical vibration source including ultrasonic vibration source. If thecrystal unit is unavoidably mounted to the same board with mechanical vibration source, check that the crystal unit
functions normally.
28

Quartz Crystal Unit Handling Precautions
7. Handling•

The crystal oscillator has an IC mounted on the backside of the package. Although it is resin-sealed, please
do not directly touch the IC surface with tweezers, rigid tools and fixtures. If you scratch the IC, it may cause a
malfunction, so be very careful.

8. Usage Condition•

Consider temperature and humidity in the product to be used, please use in the environment within thetemperature range. When used in applications exposed to high humidity, malfunction due to dew condensation
is a concern, so please take sufficient measures to prevent dew condensation.

9. Precautions for Oscillator
•
•
•

•
•
•

Mounting
The oscillator has polarity, it may cause malfunctions or destruction. if mounting by the opposite direction.
About the input terminals
Please follow the specifications of each product when use the input terminal.
Board wiring
Power supply line / Ground pattern line should use a thick pattern to reduce the impedance.
Signal line should uses a thick pattern to reduce the impedance. It should be short for the distance to theconnected IC.
For avoid noise effect, please make sure there is no pattern under crystal unit.
Noise
If excessive external noise is applied to the terminals, the issue such as latch-up phenomenon and electrostatic breakdown may be happened.
Heat stress
There is a risk of degradation of the crystal unit / IC due to a sudden temperature change. It should use
under the specification.
Power supply time
For avoid malfunction, it should be careful power-on time.

10. Precautions for handling reels•

Crystal products are degraded in characteristics when exposed for long periods under high or low temperatureenvironments. Then, it should store at normal temperature and normal humidity.
Avoid storing for a long time and mount the crystal units immediately after unpacked.
Normal temperature / humidity conditions： +15 to 35℃ / 25 to 85%RH•

When delivered with tape reel, the tape reel may deform if large impact is applied.

29

Oscillation Circuit Design Precautions
1. DRIVE LEVEL (DL)•The drive level of a crystal unit is shown by the level of the operating power or the current consumption (seeFigures 9, 10, and 11).
Operating the crystal unit at an excessive power level will result in the degradation of its characteristics, which
may cause frequency instability or physical failure of the crystal chip.
Design your circuit within absolute maximum drive level.
Rf

L1

C1

Crystal unit

R1
IX
Cg

C0

Figure 9

Oscillation
circuit
CL

Le

Rd

Drive Level: DL
2
DL: IX • Re
2
Re: R1(1+C0/CL)
IX: Current
Re: Effective resistance

IX
−R

Re

Cd

Figure 11

Figure 10

2. OSCILLATION FREQUENCY AND LOAD CAPACITANCE (C L )•The load capacitance (CL) is a parameter for determining the frequency of the oscillation circuit. The CL isrepresented by an effective equivalent capacitance that is loaded from the oscillation circuit to both ends of thecrystal unit (see Figure 12).
The oscillation frequency varies depending upon the load capacitance of the oscillation circuit. In order to obtain
the desirable frequency accuracy, matching between the load capacitances of the oscillation circuit and the
crystal unit is required. For the use of the crystal unit, match the load capacitances of the oscillation circuit withthe load capacitances of the crystal unit.
Frequency Load Capacitance Characteristics

Load capacitance : CL
Cg Cd
CL=
+Cs
Cg+Cd
Cs=Stray capacitance ofthe circuit
Rd

Cos

Cgs

X'tal
Cg

Cd

Cds

120

Frequency DeviationRf(×10−6)△f/f0

CL=12.5PF

100
80
60
40
20
0
−20

Typ.

−40
5 6

Figure 12

30

8

10

12

14

16

18

20

22

Load Capacitance CL

Figure 13

24

26

28（pF）

Oscillation Circuit Design Precautions
3. OSCILLATION ALLOWANCE
To ensure stable oscillation, the negative resistance of the circuit should be significantly larger than the equivalent
series resistance (the oscillation allowance is large). Ensure that the oscillation allowance is at least five times aslarge as the equivalent series resistance.

Oscillation Allowance Evaluation Method

Add resistor “Rx” to the crystal unit in series and ensurethat the oscillation starts or stops. The approximate negative resistance of the circuit is the value obtained by adding
the effective resistance “Re” to the maximum resistance“Rx” when the oscillation starts or stops after gradually
making Rx value larger.

Rf

Rd

Cg

Negative resistance |-R| = Rx + Re|-R| is a value at least five times as large as the maximum
equivalent series resistance (R1 max.) of the crystal unit.
*Re is the effective resistance value during oscillation.

Rx

Cd

Figure 14

Re = R1 (1+ C0 ) 2

CLFREQUENCY-TEMPERATURE CURVE
Frequency Temperature Characteristics
(×10

−6

Frequency temperature characteristics of tuning fork
crystals is shown by negative quadratic curve which
has a peak at 25°C as per left graph.
Please make sure to consider the temperature range
and frequency accuracy you need since magnitude of
frequency variation becomes larger and larger as thetemperature range becomes wider.

)
0

−10
−20
−30

Frequency
Deviation −40

△f/f0

Typ.

−50

Ti＝25℃
β ＝−3.5×10 −8 /℃2

−60
−20

−10

0

10

20

30

Temperature[Approximation formula of frequency temperature
characteristics]
40

50

60

70(℃)

f_tem=B (T-Ti)2
β : Parabolic coefficient
T : Given temperature
Ti : Turnover temperature

31

Packing
LEAD TYPE PRODUCTS
After products are inserted in polyethylene bags, the bags are placed in boxes for shipping.
Product name

Quantity per lot

Quantity per bag

Quantity per box

10,000 pcs

500 pcs

20 bags

VT-200-F / VT-200-FL

SMD PRODUCTS
Product name

Quantity per reel

SSP-T7-F / SSP-T7-FL
SC-32S / SC-32A / SC-32P / SC-32L / SC-20S /3,000 pcs

SC-20A / SC-20P / SH-32R
SN-20S

4,000 pcs

SC-16S / SC-12S

5,000 pcs

SC-20T

6,000 pcs

TAPE AND REEL CONFIGURATION• Reel configuration
Product name

Reel inner width Reel outer width

SSP-T7-F / SSP-T7-FL

17.0mm

19.4mmProduct name

Reel inner width Reel outer width

SC-32S / SC-32A / SC-32P/ SC-32L / SH-32R

13.0mm

15.4mm
15.4

φ 180
φ 50

φ 180
φ 60

19.4 ±1.0

Product name

Reel inner width Reel outer width

SC-20S / SC-20P / SC-20T / SC-20A /SC-16S / SC-12S / SN-20S

9.0mm

11.4mm

φ 180
φ 60

11.4

3-2

120ﾟ

120ﾟ

φ21

φ13

32

9

120ﾟ

17 +1.0
0

φ21

φ13

13

φ13

120ﾟ

φ21

3-2
120ﾟ

120ﾟ

3-2.2

Packing
Unit: mm

• Emboss tape configuration

2±0.10P4±0.01

16.0±0.3

A

A

B

+0.1

φ1.0 0SC-16S

1.4±0.1
B-B

1.55 ±0.1

5ﾟProduct name

0.3 ±0.05

7.5 ±0.1

B

SC-32S / SC-32A / SC-32P / SC-32L / SH-32R

5ﾟ

P4±0.10

Product name

7.2 ±0.1(4.8)

0φ1.5 +0.1

SSP-T7-F / SSP-T7-FL
1.75 ±0.1

Product name

A-A

SC-20S / SC-20A / SC-20P / SC-20T / SN-20S

0.23 ±0.05

SC-20T

1.45±0.1 5ﾟ
2.25±0.05 5ﾟ

A-A

0.40±0.05

0.85 ±0.07

1.75±0.10

8.0±0.2

1.8±0.05

0.6±0.05

5ﾟMAX

1.2±0.05

B-B

A-A

B-B

B-B

Product nameAB

φ0.5±0.10
2.25 ±0.05 5ﾟ

A-A

SC-12S
2.0±0.05

AA

1.38±0.05

8.0±0.2

B

0.20±0.05

5ﾟMAX

1.75±0.10

P4.0±0.10

φ1.5 +0.10-0

3.5±0.05

4.0±0.10

0.63±0.05

B
φ0.5±0.10A
0.23±0.05

0.23±0.05

3.5±0.05

B

B-B

SN-20S

1.4±0.05 5ﾟ

P4.0±0.10

0.75 ±0.05

B
φ1.0±0.10

2.0±0.05

5ﾟMAXA

4.0±0.10
φ1.5 +0.10-02.25 ±0.05 5ﾟ

3.5 ±0.05

BA

0.23 ±0.05

1.75 ±0.10

P4±0.10 2±0.05 P4±0.10

φ1.5 +0.10
08±0.20

Product name5ﾟMAX

1.18±0.05

B-B

A-A

• Precautions for handling reels(1) Store at normal temperature and normal humidity (refer to standard conditions of JIS Z-8703 laboratory). Avoid
storing for a long time and mount the crystal units immediately after unpacked.
[Normal temperature: +15 to 35°C Normal humidity: 25 to 85%RH](2) Handle outside boxes and reels with care.
Tapes and reels may be deformed by external pressure.
33

MEMO

34

35

(1) Quartz Crystal Division of Seiko Instruments Inc. and affiliates, which is responsible for
manufacturing the products described in this catalogue, holds ISO 9001 and ISO
14001 certification.
(2) SII Crystal Technology Inc. Tochigi site holds IATF 16949 certification.

Electronic Components Sales Head Office

1-8, Nakase, Mihamaku, Chiba-shi, Chiba 261-8507, Japan
Telephone:+81-43-211-1207 Facsimile:+81-43-211-8030
E-mail:component@sii.co.jp<Manufacturer>

SII Crystal Technology Inc.

1110, Hirai-cho, Tochigi-shi, Tochigi 328-0054, Japan

Seiko Instruments Trading (H.K.) Ltd.
4-5/F, Wyler Centre 2, 200 Tai Lin Pai Road,
Kwai Chung, N.T., Hong Kong
Tel: +852 2494-5111
Fax: +852 2424-0901
Email:sales@sih.com.hk
http://www.sih.com.hk

Seiko Instruments (Shanghai) Inc.
Room 2701, Shanghai Plaza,No.138, Mid Huaihai Rd.,
Shanghai 200021, China
Telephone: +86-21-6375-6611
Facsimile: +86-21-6375-6727

Seiko Instruments (Shanghai) Inc.
Shenzhen Branch
Rm 2215, Shun Hing Square,
Di Wang Commerical Center,
5002 Shen Nan Dong Rd, Shenzhen,
China（518001）
Telephone: +86-755-8246-2680
Facsimile: +86-755-8246-5140

Seiko Instruments Taiwan Inc.
2F, No.143, Changchun Rd.,
Zhongshan Dist., Taipei 104, Taiwan
Telephone: +886-2-2563-5001
Facsimile: +886-2-2563-5580
Email:public@sii.co.jp
http://www.sii.com.tw

Seiko Instruments GmbH
Siemensstrasse 9
D-63263 Neu Isenburg, Germany
Telephone: +49-6102-297-0
Facsimile: +49-6102-297-222
Email:info@seiko-instruments.de
http://www.seiko-instruments.de

Seiko Instruments U.S.A., Inc.
21221 S. Western Ave., Suite 250,
Torrance, CA 90501, U.S.A.
Telephone: +1-310-517-7802
Facsimile: +1-310-878-0345
Email:info@seikoinstruments.com
http://www.seikoinstruments.com

Released in May 2023
Copyright©2023 Seiko Instruments Inc. All Right Reserved.

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