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Ensemble® 6000 Series
OpenVPX, Intel 3rd Generation Xeon 12-core,
Infiniband/Ethernet High Density Server-Class Processing Blade
HDS6603 Processing Module
Most Powerful, Rugged, Single Slot Intel Server-Class Processing Power
for Advanced Radar, IMINT and Other Compute Intense Applications• 6U OpenVPX™ single 1-inch slot module• Dual Intel® 1.8GHz 12-core Xeon® (with Haswell architecture) server-class processors• Wellsburg bridge architecture• 1.38 TFLOPS peak processing power• 40 Gigabit Ethernet or InfiniBand high bandwidth switching:– Ethernet ecosystem; 10GBASE-KX4, 10GBASE-KR and 40GBASE-KR4– Or InfiniBand ecosystem; SDR, DDR, QDR and FDR10• Up to 32 GB DDR4-2133 SDRAM (per processor)• Gen3 PCIe co-processing and I/O expansion plane communications• Air-cooled and rugged Air Flow-By™ & Conduction-cooled options

The HDS6603 is Mercury’s fourth generation Intel® Xeon®
server-class, OpenVPXTM processing capability that leverages
over four years of advance IRAD to deliver the first single slot
module to break the 1 TFLOP general processing benchmark.

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Dual Intel Xeon x86 processors, each with 12 cores, Haswellarchitecture and Wellsburg Bridge (collectively called Grantley)
and the support of unrestricted 40Gb/s Ethernet and FDR10 fabricbandwidth deliver scalable and unmatched general processing
horsepower. Mechanical ruggedness and the effective 		
Air Flow-By cooling technology ensure the highest MTBF evenunder full throttle, continuous processing conditions.
The HDS6603 is part of Mercury’s Xeon server-class ecosystem of
OpenVPX building blocks that includes other Intel Haswell and Xeon
processor solutions, 40 Gb/s Ethernet/InfiniBand switches and intelligent mezzanine carrier boards. These may be quickly configured
and developed in the lab using concurrent engineering disciplines
and Mercury’s 6 and 16 slot development chassis. Supporting
Mercury’s Xeon server-class ecosystem is Mellanox’s Connect-X3
40Gb/s enabled fabrics and tuned signal channels for unrestricted
40Gb/s and faster fabrics.

Mercury Systems is the better alternative for affordable, secure processing
subsystems designed and made in the USA. These capabilities make us thefirst commercially based defense electronics company built to meet rapidly
evolving next-generation defense challenges.

Mercury’s Xeon server-class OpenVPX ecosystem is the mostpowerful Open System Architecture (OSA) available for generalprocessing, enabling true on-platform cloud processing at the tacticaledge. Eminently suited to Radar, Electro-Optical/InfraRed (EO/IR) andcomplex Image Intelligence (IMINT) applications, this standard 1-inch,
6U OpenVPX form factor module enables compute capabilities thatwere never previously possible adding new functionality and autonomy
to modern missions.

Haswell Ecosystem
Intel’s Haswell architecture includes Fused, Multiple-Add (FMA)
which is especially valuable for radar processing applications, thatroutinely requires the summing of vast arrays of multiplied numbers.
The inclusion of FMA enables complex radar and similar operations tobe performed approximately twice as quickly as before as Fast Fourier
Transformations (FFTs) and other matrix manipulations are now handled
more efficiently than ever before.

Xeon Server-Class Ecosystem
The HDS6603 features two Intel 64-bit Xeon (E5-2648L v3) 12-coreprocessors. The HDS6603 is Mercury’s fourth generation of Xeon serverclass technology and demonstrates a high Technology Readiness Level(TRL). HDS6603 utilizes unique and robust packaging technologies tosupport two instances of high-pin-count Land Grid Array (LGA)

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processors in a rugged, embedded form factor. The dual 12-coreprocessors are linked via two instances of the high-speed, low-latency
Quick Path Interconnect (QPI) interface, each of which provides a
38 GB/s (bi-directional) data transfer rate, for a staggering total of
76 GB/s of bandwidth between processors. This interconnected
processor architecture is optimized for the intense data movement
needed by high performance processing algorithms, such as all-to-all
corner turn operations. From a software perspective, this QPI architecture allows the HDS6603 to be configured with a single kernel NUMAaware operating system running across both processor devices.
Each processor is capable of delivering a staggering 0.69 TFLOPS(peak), with four high-speed, 15 GB/s DDR4-2133 memory channels
raw bandwidth each, for an incredible total peak of 1.38 TFLOPS and
120 GB/s total raw memory bandwidth. The HDS6603 refines theinnovative standing memory technology first seen on the HDS6600,
HDS6601 and HDS6602 to support up to 128 GB of DRAM on-board
for the ultimate in DRAM density in the OpenVPX family of processing
modules. Native Gen3 PCIe support is also featured on this processor,
linking the processing resources directly to the I/O sources on the module. The HDS6603 also makes use of the Wellsburg Platform Controller
Hub (PCH) chipset, which provides additional I/O bridging between theIntel processor and external devices.

Each E5-2648L v3 processor includes a large 30 MB cache, shared
between the cores, allowing many high performance calculations toremain cache resident. This accelerates processing by eliminating thepotential latency required to access DRAM to fetch upcoming data.
The Haswell Bridge family of processors also supports the proven
AVX2 instruction set, delivering a revolutionary increase in floatingpoint algorithm performance that is portable to future Intel 		architectures.

High Speed Fabric Interfaces
The HDS6603 continues the tradition from Mercury to combine theprocessing power of Intel processors with high speed switchedfabric interfaces.
The HDS6603 compliments Mercury’s other OpenVPX module thatfeature Mellanox’s ConnectX-3 host adaptors for data plane communications. Bridging between the native Gen3 PCIe interfaces on theIntel processors and the OpenVPX data plane, the ConnectX-3 can be
configured to support InfiniBand (DDR, QDR or FRD10) or 10/40 Gigabit
Ethernet as the data protocol. This advancement scales the data plane
bandwidth to up to a peak theoretical rate of up to 5 GB/s per port, or
20 GB/s aggregate across the entire four-port OpenVPX data plane. Byscaling the data plane bandwidth to match the increase in processing
performance, the HDS6603 architecture ensures that the processor isnever starved for data.

Module I/O
Backplane
InfiniBand

DDR/QDR/FDR10

Or Ethernet

4 x XAUI (10Gb)

USB 3.0
USB 2.0
Gen 3 PCIe (8x)12
32 - Dual full x16 or dual x8

1000BASE-T Gigabit Ethernet

1

1000BASE-BX SERDES Ethernet

2

SATA
RS232/RS422

2
2 x RS-422

4 x RS-232

EXPORT CONTROLLED - These commodities, technology, or software are controlled for export from the United States in accordance with the Export Administration Act of 1979 as amended (Title 50
U.S.C.; App 2401, et seq.), through the Export Administration Regulations (EAR). Diversion contrary to U.S. law is prohibited. Restrictions on transfers to foreign persons may apply.

By utilizing the Mellanox ConnectX-3 device and innovative OpenVPX
interconnect technology the HDS6603 is a model for open architecture
high performance computing throughout the embedded industry.
Mercury OpenVPX subsystems feature robust signal rates that
comfortably exceed the margin of the channel to surpass the rate ofmodern fabrics, delivering the fastest compute solution in the industry
with future proof performance headroom.
The HDS6603 module is compliant to the VITA 65 module profile
MOD6-PAY-4F1Q2U2T-12.2.1-n, where n can vary based on ConnectX-3
configuration. The HDS6603 is supported in chassis slots compliant
with VITA 65 slot profile SLT6-PAY-4F1Q2U2T-10.2.1.

Additional Features
The HDS6603 module provides all the features typically found on asingle-board computer. In addition to the sophisticated management
subsystem and fabric interconnect, the HDS6603 module provides users
with a toolkit enabling many different application features including:• Thermal and voltage sensors integrated on-board• Real-time clock with accuracy better than 10ppm<1second per day• General purpose timers• Global clock synchronization capabilities via the OpenVPX utility
plane clock signals

PCIe Architecture• Watchdog timer to support interrupt or reset

The HDS6603 provides high end Gen3 PCIe backplane interfaces via
the native PCIe resources on the E5-2648L v3 processor. In addition
to supporting the processor’s interface to the ConnectX-3 bridges
described above, an additional x16 Gen3 PCIe interface is provided
to the OpenVPX expansion plane interface on both the P2 and P5 VPX
connectors. These interfaces enable the HDS6603’s compatibility with
Mercury’s GPU, FPGA, or mezzanine carrier modules. The interfaces
are user configurable to lower port widths, and can also support Non
Transparent (NT) bridge functionality at run time. These configuration
options support the construction of complex PCIe trees with manyother PCIe-capable devices.

• Multiple boot paths, include netboot, USB boot, boot from SATA,
or from the on-board 8GB flash device

System Management Plane
The HDS6603 module implements the advanced system management
functionality architected in the OpenVPX Standard to enable remotemonitoring, alarm management, and hardware revision and healthstatus.
Using the standard I2C bus, Intelligent Platform Management
Controller (IPMC), and IPMI protocol, the on board system-management
block implementation is designed to comply with VITA 46.11. This
allows the HDS6603 module to:• Read sensor values• Read and write sensor thresholds, allowing an application toreact to thermal, voltage, or current variations that exceed thosethresholds• Reset the entire module• Power up/down the entire module

Open Software Environment
Mercury leverages over 30 years of multicomputing software expertise,including recent multicore processor expertise, across its many
platforms. This strategy is fully applied to the HDS6603 module. The
same Linux® development and run-time environment is implemented
on the HDS6603 module as on other Intel based Mercury OpenVPX
modules across the Ensemble 3000 and 6000 Series. Off-the-shelf open
software such as OFED and OpenMPI are fully supported by the
Mellanox ConnectX-3 data plane.

Mercury’s OpenVPX Ecosystem
Sensor processing chain awareness, building blocks and ecosystem
Sensor chain awareness is having the technical expertise and resources
to design and build capable, compatible solutions along the wholesensor processor chain. From RF/microwave, digital/analog signal
manipulation to dense, SWaP optimized processing resources toactionable intelligence dissemination; Mercury’s rugged processing
subassemblies leverage the best commercial-item technology, enabling
prime contractors to win more business.
Modern sensor processing subassemblies are customized assemblies
of interoperable building blocks built to open standard architectures.
Mercury’s hardware and software portfolio of building blocks are
physically and electrically interoperable as defined by international
industrial standards, including OpenVPX.

• Retrieve module Field Replaceable Unit (FRU) information• Be managed remotely by a Chassis Management Controller at
the system level

EXPORT CONTROLLED - These commodities, technology, or software are controlled for export from the United States in accordance with the Export Administration Act of 1979 as amended (Title 50
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Figure 1. HDS6603 functional block diagram

System Bandwidth – The Effect of Interconnect Performance
Bandwidth is critical and especially applicable to switched fabricresources which dictate the responsiveness of the entire subsystem. All modular solutions, including OpenVPX are to some degree,interconnect-bound; they are restricted by the limitations of the bestindustry interconnect technology. To address this, Mercury fabricatessystem interconnections with innovative technology which mitigatesinsertion-loss and cross-talk while maintaining full VITA/ OpenVPX
compliance. The resulting system performance boost enables the latest fabrics to run at full, unencumbered speed.

Module Packaging
VPX-REDI
The VPX (VITA 46) standard defines 6U and 3U board formats with highperformance interconnects capable of supporting today’s high speed
fabric interfaces. VPX may be paired with the ruggedized enhanced
design implementation standard — REDI (VITA 48). SFM6104 modules
when implemented as conduction-cooled or Air Flow-ByTM are VPX-REDI compatible. Air-cooled equivalents conform to the same OpenVPX form factor and are suitable for less challenging environments.
Targeted for harsh embedded environments, VPX-REDI supports higher
functional density and two-level maintenance (2LM). 2LM allows relatively unskilled maintenance personnel to replace a failed module.
Rugged Air Flow-By
Air- and conduction-cooled subsystems rely on filtration to remove
contaminants from their cooling air streams. Mercury’s Air Flow-By
technology eliminates filtration with the most elegant cooling solution
available within a sealed and rugged package. Fully compliant to VITA
standards (including VITA 48.7), Air Flow-By maintains OpenVPX’s
1-inch pitch requirement, is highly resilient to liquid and particle
contamination, boosts SWaP, reduces operating temperature, extends
MTBF by an order of magnitude and enables embedded deploymentof the most powerful and reliable processing solutions. HDS6603
modules are available as air-cooled (various levels of ruggedness), andrugged Air Flow-By and conduction-cooled variants.

EXPORT CONTROLLED - These commodities, technology, or software are controlled for export from the United States in accordance with the Export Administration Act of 1979 as amended (Title 50
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Specifications

OpenVPX Multi-Plane Architecture

Processors

System Management via IPMB-A and IPMB-B link on P0 management plane

Dual Intel 1.8GHz 12-core E5-2648L v3 (Wellsburg Bridge) server-class processors
Peak performance		

1.38 TFLOPS per module

Threads per core		

2

QPI interface between processors 2 x 9.6 GT/s (or 38 GB/s per processor, 					
per direction, 76 GB/s total) peak performance
Dual Integrated x16 Gen3 PCIe interface

InfiniBand or 40 Gigabit Ethernet interfaces on data plane
Dual full x16 or dual x8 PCIe Gen3 expansion plane
Dual 1000BASE-BX Ethernet control plane

Mechanical
6U OpenVPX
1.0” slot pitch

MemoryOpenVPX and VPX REDI

Up to 64 GB DDR4-2133 with ECC

Power consumption:

Raw memory bandwidth: 60 GB/s per processor~75W per processor~180W per module

BIOS

Weight:

SPI flash: Dual 8 MB partitions

Air-cooled		

2.24lbs

NAND flash: 8 GB, SATA interface

Air Flow-By

3.00lbs

Conduction-cooled

4.1lbsData Plane PCIe to Switched Fabric Bridge
Mellanox ConnectX-3 VPI host adapter

Standard Compliance

Support DDR/QDR/FDR10 InfiniBand or 40 Gigabit Ethernet protocols

OpenVPX System Standard (VITA 65) encompasses:

Ethernet Connections
Ethernet functions supported by the chipset include:
UDP, TCP, SCTP, ARP, IPv4, IPv6, IEEE1588, flow control, 802.1P (priority) and802.1Q (VLAN)

VITA 46.0, 46.3, 46.4, 46.6, 46.11, and VITA 48.1, 48.2 (REDI)VITA 65 module profile MOD6-PAY-4F1Q2U2T-12.2.1-n 		(where n can vary based on ConnectX-3 configuration)

IPMI (Intelligent Platform Management Interface)On-board IPMI controller
Voltage and temperature monitor
Geographical address monitor
Power/reset control
FRU and on-board EEPROM interfaces
FPGA, CPU, and CPLD interfaces

EXPORT CONTROLLED - These commodities, technology, or software are controlled for export from the United States in accordance with the Export Administration Act of 1979 as amended (Title 50
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Environmental

Environmental Qualification Levels
Air-cooled

Air Flow-By

Conduction-cooled

Commercial L0

Rugged L4

Rugged L3

Ruggedness

•

•••

•••

Moisture/dust protection

•

•••

•••

Typical cooling performance
Temperature

Operating*Operating temperature
maximum rate of change
Temperature

Storage~200W*~150W**-40ºC to +60ºC-40ºC to +71ºC

N/A

10ºC/min

10ºC/min-40ºC to +85ºC-55ºC to +125ºC-55ºC to +125ºC

Operating*

10-90%,
non-condensing

5-95%, non-condensing
100% condensing

5-95%, non-condensing
100% condensing

Storage10-90%,
non-condensing

5-95%, non-condensing
100% condensing

5-95%, non-condensing
100% condensing

Operating*

0-10,000ft

0-30,000ft

0-70,000ft

Storage

0-30,000ft

0-70,000ft

0-70,000ft

Random

0.003 g /Hz;
20-2000 Hz, 1 hr/axis

2

0.1 g /Hz;
5-2000 Hz, 1 hr/axis

0.1 g2/Hz;
5-2000 Hz, 1 hr/axis

Sine

N/A

10G peak;
5-2000 Hz, 1 hr/axis

10G peak;
5-2000 Hz, 1 hr/axis

Shockz-axis: 20g;
x and y-axes: 32g;
(11ms 1/2-sine pulse,
3 positive, 3 negative)z-axis: 50g;
x and y-axes: 80g;
(11ms 1/2-sine pulse,
3 positive, 3 negative)z-axis: 50g;
x and y-axes: 80g;
(11ms 1/2-sine pulse,
3 positive, 3 negative)

10% NaCl

10% NaCl

Humidity

Altitude~140W*
0ºC to +40ºC

2

Vibration

Salt/Fog

N/A

VITA 47

Contact Factory* Customer must maintain required cfm level. Consult factory for the required flow rates.
** Card edge should be maintained below 71ºC
Storage Temperature is defined per MIL-STD-810F, Method 502.4, para 4.5.2, where the product under non-operational test is brought to an initial high temperature cycle to remove moisture. Then the unit
under non-operational test will be brought to the low storage temperature. The low temperature test is maintained for 2 hours. The product is then brought to the high storage temperature and is maintainedfor 2 hours. The product is then brought back to ambient temperature. All temperature transitions are at a maximum rate of 10ºC/min. One cold/hot cycle constitutes the complete non-operational storage
temperature test. This assumes that the board level products are individually packaged in accordance with ASTM-D-3951 approved storage containers. These tests are not performed in Mercury shipping
containers, but in an unrestrained condition. Please consult the factory if you would like additional test details.
All products manufactured by Mercury meet elements of the following specifications: MIL-STD-454, MIL-STD-883, MIL-HDBK-217F, and MIL-I-46058 or IPC-CC-830, and various IPC standards. Mercury’s
inspection system has been certified in accordance with MIL-I-45208A.

Additional Services• Cold Start Testing• Cold Soak Testing• Custom Vibration• CFD Thermal Analysis• Finite Element Analysis

Standard Module, Optional Services• Safety Margin Analysis• Temperature Cycling• Power Cycling• Environmental Stress Screening• Engineering Change Order (ECO) Notification• ECO Control• Custom Certificate of Conformity (CofC)• Custom UID Labeling• Alternate Mean Time Between Failure (MTBF) Calculations• Hazmat Analysis• Diminished Manufacturing Sources (DMS) Management• Longevity of Supply (LOS)• Longevity of Repair (LOR)

Contact factory for additional information
EXPORT CONTROLLED - These commodities, technology, or software are controlled for export from the United States in accordance with the Export Administration Act of 1979 as amended (Title 50
U.S.C.; App 2401, et seq.), through the Export Administration Regulations (EAR). Diversion contrary to U.S. law is prohibited. Restrictions on transfers to foreign persons may apply.

Ensemble is a registered trademark and Air Flow-By, Innovation That Matters and Mercury Systems are trademarks of Mercury Systems, Inc. Other product and company names mentioned may be trademarks and/or
registered trademarks of their respective holders. Mercury Systems, Inc. believes this information is accurate as of its publication date and is not responsible for any inadvertent errors. The information contained herein
is subject to change without notice.
									Copyright © 2017 Mercury Systems, Inc.

3047.06E-0517-DS-HDS6603

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Optional Environmental Screening and Analysis Services