PCN – Product Change Notification
MTi 1-series: Components placement change
Author: Product Manager
Date: February 27, 2018

1 Type of Change☒☐☒☒Hardware
Interface
Performance
Supply chain and purchasing

2 Description of Change
To ensure the continuity of the MTi 1-series, the End Of Life components are being replaced and a hardware
Version 2.0 is being released. Due to this change in design, component placement has changed, which may
require a change to assembly reflow processes previously designed for the 1-series, especially automatic
pick and place machine programs. See Figure 1 for component placement details. In addition, the MTi 1series’ part number naming is changing to a new format, which is covered further in Section 3.
MTi-x-8A7G6x
Version 1.1 (PCB no. SM141111)

MTi-xx
Version 2.0 (PCB no. SM171223)(a) MTi 1-series v1.1 dimensions and componentlocations.

(b) MTi 1-series v2.0 dimensions and component
locations.

All dimensions are in mm.
General tolerances are +/- 0.1mm
Figure 1: Components placement for the MTi 1-series v1.1 and v2.0 hardware versions.
Xsens Technologies B.V. Pantheon 6a P.O. Box 559 7500 AN Enschede The Netherlands
T +31 (0) 88 97367 00 F +31 (0) 88 97367 01 E info@xsens.com www.xsens.com

Page 1 of 3

PCN – Product Change Notification
MTi 1-series: Components placement change
Author: Product Manager
Date: February 27, 2018

3 Affected Products
Current

NewSeries

Part Number

HW version

Part Number

HW version

Remarks

MTi-1

MTi-1-8A7G6x*≤ 1.1

MTi-1x*≥ 2.0

Components
placement change

MTi-2

MTi-2-8A7G6x*≤ 1.1

MTi-2x*≥ 2.0

Components
placement change

MTi-3

MTi-3-8A7G6x*≤ 1.1

MTi-3x*≥ 2.0

Components
placement change

DK

MTi-3-8A7G6-DK≤ 1.1

MTi-3-DK≥ 2.0

Shield, Arduino
compatible interface

Table 1: Current and new part numbering

4 Product Identification
The hardware version number is labeled SPEC REV on the TNR Label, see Figure 2.

Figure 2: TNR Label specification* “x” type of packaging, T = tray of 20pcs, R= reel of 250

Xsens Technologies B.V. Pantheon 6a P.O. Box 559 7500 AN Enschede The Netherlands
T +31 (0) 88 97367 00 F +31 (0) 88 97367 01 E info@xsens.com www.xsens.com

Page 2 of 3

PCN – Product Change Notification
MTi 1-series: Components placement change
Author: Product Manager
Date: February 27, 2018

5 Customer Impact
5.1Purchasing

Please update purchasing systems with the new part number as described in Section 3.
If MTi-x-8A7G6x part is ordered, Xsens will deliver the ordered MTi-x-8A7G6x part until the stock runs out,
after which Xsens will deliver the 1-series part with the new part number (MTi-xx).

5.2

Assemble Process

For hardware versions, SPEC REV ≥2.0, check pick and place program to see if it requires adaptation. For
component placement change information, see Section 2.

5.3

Interface

N/A, no change.

5.4

Performance

The MTi 1-series v2.0 performance is equal or better with respect to the MTi 1-series v1.1 hardware. The
components change will lead to an increased performance with respect to- Increased robustness to mechanical stress, the v2.0 hardware and its sensor components are lesssusceptible to torsional stress induced errors on the boards.
- Increased consistency and repeatability among parts with the v2.0 hardware and its sensor
components.
The maximum output rate for the XDI_AccelerationHR and XDI_RateOfTurnHR quantities will differ from thecurrent 1KHz. The new output data rate for the XDI_Acceleration HR and XDI_RateOfTurnHR messages
will not be lower than 800Hz.

6 Schedule
Samples:

May 2018

Estimated First Shipment date:June 2018

Last Time Buy Date:

N/A

Last Ship Date:

N/AXsens Technologies B.V. Pantheon 6a P.O. Box 559 7500 AN Enschede The Netherlands
T +31 (0) 88 97367 00 F +31 (0) 88 97367 01 E info@xsens.com www.xsens.com

Page 3 of 3