TECH BRIEF

Innovation That Fits
Mercury High Density Secure Memory

To address the broad range of perils faced by the modern war fighter,

Mercury Systems applies its research and development expertise

defense electronics are growing increasingly sophisticated withtowards the commercialization of innovative technologies addressing

additional sensor subsystems detecting, analyzing, and responding to

the most challenging industry problems, such as the scenario

potentially threatening scenarios. To do so, each of these subsystems

described above. This technical brief examines Mercury’s portfolio ofrequires data acquisition, digitization, processing, and storage

High Density Secure Memory products, a unique offering delivering

modules. These highly complex subsystems together yield a massivehigh-speed, military-hardened memory solutions in the smallest of

volume of data to be processed in short periods of time. From aform factors. The successful commercialization of our packaging

system-level architecture perspective, designers face a dilemma

technology has provided system level designers with additional board

where they must integrate additional components and circuitry into areal estate without sacrificing memory performance requirements.

fixed allocation of board space. Missions requiring smaller and lighter

Although ideally suited for defense electronics, our miniaturization

weight form factors push the designer to the challenging goal oftechnology has also been adopted for commercial avionics andadding even more functionality while reducing overall system size andindustrial applications.

weight. In summary, many mission objectives can only be achieved

A typical system configuration includes at least one processor

with increasingly feature-rich electronic systems more tightly packed

and/or field-programmed gate array (FPGA) with double data rate

into the smallest of physical footprints.

(DDR) memories, as depicted in the image below. In this particularConventional 8GB DDR4 Solution

Mercury 8GB DDR4 Solution
25% of Original DDR4 Footprint

100% of Original DDR4 Footprint

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1
GBFPGAOrProcessor

1
GB

1
GB

1
GB

1
GB

1
GB

1
GB

1
GB75%Free
SpaceFPGAOr
Processor

1
GB

Fly-by Architecture
Mercury Systems is a leading commercial provider of secure
processing subsystems designed and made in the USA. Optimizedfor customer and mission success, Mercury’s solutions power awide variety of critical defense and intelligence programs.

100101010
001101011
110101100

ACQUIREACQUIREDIGITIZE

100101010
001101011
110101100

100101010
001101011
110101100

100101010
001101011
110101100

ACQUIREPROCESSDIGITIZEACQUIREPROCESSDIGITIZESTORAGEACQUIREPROCESSDIGITIZESTORAGEEXPLOIT

100101010
001101011
110101100

ACQUIREPROCESSDIGITIZESTORAGEEXPLOIT
DISSEMINATEexample, nine discrete DDR4 devices of 1GB capacity each are used tomanufactured in a Defense Microelectronics Activity (DMEA) trusted

provide a total of 8GB DRAM supporting the application’s processingfacility. Our facility also maintains AS9100, ISO 9001, JESTD001, andrequirements with error correcting code (ECC). The nine devices are

IPC 610 Class 3 certifications. Mercury’s commitment to industrial

equally distributed over the available two-dimensional board area.

security excellence is evidenced by our 2016 James S. Cogswell

Mercury Systems stacking technology exploits the unused third

Outstanding Security Achievement Award from the Defense Security

dimension by vertically stacking and connecting memory in a low-Service.

profile, ruggedized package. By replacing nine individual 1GB DRAM

Mercury’s memory solutions have been successfully integrated bydevices with one Mercury memory device, space savings of 75% aredefense prime contractor partners into many state-of-the-art militaryachieved in this example, excluding terminations and decoupling. The

programs for more than 30 years. As such, classified data at Mercury’ssystem designer is now free to use the newly available 75% board

facilities is protected using protocols established by the Department

space for placement of other components needed to integrate additionalof Defense (DoD) in full isolation from corporate network and systems.

sensor subsystems.

Furthermore, Mercury recognizes that its electronic records may be ofAlthough this example demonstrates the footprint reduction for a DDR4

interest to foreign entities. As such, we maintain and regularly update

application, Mercury also offers a wide breadth of high-performancea vigilant internal cyber security program modeled after the Center for

space-saving solutions using other classes of memory. These solutions

Internet Security (CIS) Critical Security Controls. Mercury is also an

span from legacy technologies in ceramic packages, such as EEPROM,

active member of the Defense Security Information Exchange (DSIE) andNOR Flash, and SRAM, through DDR2 and DDR3 to 1.2V DDR4

the Advanced Cyber Security Center (ACSC).

SDRAM with speeds up to 3200 Mb/s. To meet application-specific

All companies take security of physical assets seriously. Mercury goesrequirements, three different grades of memory products are available:

farther, embedding security and trust into product design, supply chain

Commercial (0°C to +70°C), Industrial (-40°C to +85°C), and Military

management, manufacturing, and electronic asset protection.

(-55°C to +125°C) grades. Where critical for performance in the smallest
possible footprint, mixed memory and custom memory solutions
meeting design-specific requirements are available.

Additional Benefits of Mercury High Density SecureMemory

Designing Security and Trust Into Memory

Recognizing the challenges faced by system designers today, High

Semiconductor memory is an important commodity used in thespaces without compromising security or performance standards. Ourconstruction of our memory devices. The commercial market has noshortage of suppliers capable of producing commercial-, industrial-, andautomotive-grade memory solutions in chip package form. However,
the majority of these suppliers manufacture their products outside of
the United States. Of particular concern, some are in close proximity
to highly unpredictable foreign governments. Although this is of noconsequence during extended times of peace, supply chain continuity

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is far from assured in the event of a military conflict in or around thesetumultuous regions.
To provide the highest degree of supply chain continuity, Mercury only
sources semiconductor memory from trusted domestic corporations. The
same scrutiny is applied to vendors of other materials and components
used in the construction of our products. Through judicious selectionof supply chain vendors, Mercury builds security and trust into HighDensity Secure Memory products from the moment components andmaterials are selected and incorporated into our designs.
Security of commodity components, however, is insufficient to produce
a truly secure and trusted product for a defense application. As an
additional layer of security, our memory devices are designed andDensity Secure Memories devices are designed to fit into the tightest ofminiaturization technology offers a variety of other benefits, including:• 100% burn-in and electrical test for the highest quality assurance• Military grade product available for the harshest of environmental
conditions; Commercial and industrial grade product for lessharsh operating environments but facing similar physical spaceconstraints• Eutectic solder balls, eliminating the possibility of strain-related
failures associated with lead-free solder used on commercial
memory devices• Increased solder ball pitch, up to 1.0mm, to enhance second levelboard reliability compared to commercial devices with reduced
pitch no greater than 0.8mm• Up to 88% component count reduction, simplifying the supply
chain while enabling higher manufacturing floor throughput• Multiple data widths available, including x8, x16, x32, x64, andx72• Includes address/control terminations and decoupling inside
packages of DDR3 and DDR4 devices• Available component End of Life management to provide long-term
supply continuity

Popular Mercury Systems’ High Density Secure Memory

DDR3 High Density Secure Memory

Mercury’s most popular memory products are based on DDR memory

Mercury memory products manufactured with DDR3 technology providetechnologies. With each successive generation of DDR memory,a ruggedized memory solution to meet the most common performance

we have continued to refine our miniaturization technology to offer

requirements in a highly ruggedized, compact form factor. Space

improved densities without compromising data transfer rates.

savings up to 67% are achieved, basedon data width requirements and selected

0.06

capacity. Other benefits include:

Density(GB per mm2)

0.05

1 GB

0.04

2 GB

0.03

4 GB
8 GB0.02

16 GB
0.01
0DDR(333 Mb/s)

DDR2 DDR3 DDR4(667 Mb/s) (1600 Mb/s) (3200 Mb/s)

DDR4 High Density Secure Memory
DDR4 SDRAM technology offers lower power,
high-speed performance for the most demanding
application requirements. Applying advanced
miniaturization technology to DDR4 memory, wedeliver space savings up to 87% based on double
data width requirements and selected capacity. Other
benefits include:

Mercury Systems is currently engaging with customers in design
opportunities that require DDR4 performance levels in highly
constrained physical environments or harsh operating environments.
Specifications are subject to change as designs are finalized throughcustomer engagements. Please contact Mercury Systems to participate
in our DDR4 design program.

Other Memory Products
For legacy applications designed prior to DDR3 or DDR4 availability,
our product portfolio also includes DDR and DDR2 technologies incapacities ranging from 128MB to 512MB (DDR) or 1GB (DDR2).
SDRAM, SRAM, SSRAM, and NOR Flash memories are also available.
For applications requiring a hermetic seal, Mercury offers ceramicpackages with SRAM, flash, and EEPROM memories. Please note that
SRAM and some ceramic package products are produced off-shore due
to extremely limited volumes and the maturity of the technology.

Custom Capabilities
Though a wide variety of memory products are included in our portfolio,
Mercury specializes in the design and fabrication of custom and mixed
memory solutions meeting the specific criteria demanded by yourapplication environment. We offer a wide range of custom capabilities
to choose from, including:• Thermal, mechanical, and electrical modeling expertise to optimize
package design and performance• Custom environmental test conditions, including extended
temperature qualification• Design and implementation of software test code
• System in Package (SiP) design and fabrication, achieving
highly integrated, compact packages containing of components
commonly found on single board computers, including processors
and memories• Secure Boot SiP, authenticating firmware integrity before systembootwww.mrcy.com• Standard density and high density spacesaving configurations• Up to 16GB capacity• Low profile (≤2.3 mm)• 1.2V supply voltage• 3200 Mb/s data transfer speed• X8, x16, x32, x64, and x72 data widths available• PBGA package with 0.8 to 1.0 mm pitch• Decoupling capacitors included• Calibration resistors included• Address/command terminations optional• Standard density and high density
space-saving configurations• Capacities of 1 to 8GB for standard
density product• 4GB capacity for high density configuration• 1.35V or 1.50V supply voltage• Up to 1600 Mb/s data transfer speeds• x32, x64, and x72 data widths available• PBGA package with up to 1.0 mm pitch• Decoupling capacitors included• Calibration resistors included• Address/command terminations optional

Conclusions• Integration of different interconnection technologies (surface
mount, wire bond, and flip chip) in the same package

Mercury Systems’ heritage of innovation has successfully

Contact Mercury Systems to solve your unique system integrationcommercialized our miniaturization technology for more than 15 years,

challenges with our custom design and fabrication capabilities.

enabling more sensor functionality to be incorporated into smaller andLongevity of Support to Eliminate Obsolescence Risk

more lightweight mission computing subsystems. Integrating security
and trust through all facets of our business, Mercury successfully

As a high-tech electronics company primarily involved in supplying

delivers innovations that matter to our highly valued customers. Youthe defense industry, Mercury is committed to supporting long-can learn more at https://www.mrcy.com/solid-state-drives-storage-term platforms. We also help mitigate concerns around counterfeit
electronics in the supply chain.

memory-sip/memory.

Although Mercury cannot guarantee indefinite availability of all

To review our High Density Secure
Memory product portfolio, click on thethumbnail or link below.

products, every attempt is made to provide supply continuity until raw
materials can no longer be procured. Mercury partners closely with ourMercury System Microelectronic Products
Quick Reference Guide

customers to manage component end of life notifications with last-time
buy opportunities.

Category

PhysicalPerformance

Security And TrustParameter

Mercury 16GB
DDR4 Memory
Device16GB DDR4 FBGA
(8 x 2GB)

Mercury Advantage

Area

96640

85% Reduction

Part Count

1887% Reduction

Solder Ball Pitch

1.0 mm

≤ 0.8 mmSuperior Board-Level
Reliability

Solder Ball Composition

PbSn

SnAgCuSuperior Board-Level
Reliability

Speed3200 Mb/s

3200 Mb/s

Operating Voltage

1.2V

1.2V

Error Correcting Code

Available

Available

Operating Temperature
Range

Military Grade(-55 to +125°C)

Commercial Grade(0 to +95°C)

Wider Temp Range(-55 to +125°C)

DMEA-certified On-Shore
Manufacturing

Yes

No

Manufacturing Continuity

Trusted Supply Chain

Yes

No

Supply Chain Continuity

Copyright © 2017 Mercury Systems, Inc. 										5009.00E-0117-Memory-TB

Innovation That Matters™
Corporate Headquarters
201 Riverneck Road • Chelmsford, MA • 01824-2820 USA(978) 967-1401 • (866) 627-6951
Fax (978) 256-3599
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Armor is a registered trademark and Innovation That Matters and Mercury Systems are trademarks of Mercury Systems, Inc. Other products mentioned may be trademarks or registered trademarks of
their respective holders. Mercury Systems, Inc. believes this information is accurate as of its publication date and is not responsible for any inadvertent errors. The information contained herein is subject tochange without notice.