DATASHEET

Ensemble® 6000 Series OpenVPX™
Intel Xeon D server-class family module with I/O mezzanine sites LDS6527• Intel Xeon D family SoC processor with AVX2• InfiniBand or Ethernet high-bandwidth switching:		
Ethernet: 10GBASE-KX4, 10GBASE-KR and 40GBASE-KR4
		
Or InfiniBand: DDR and FDR10• BuiltSECURE systems security engineering• MOTS options for extreme environmental protection• Integrated Gen3 PCIe switching infrastructure for on-board and off-board co-processing• One XMC and one XMC/PMC mezzanine sites•

The Ensemble 6000® Series LDS6527 6U OpenVPX™ is a single
board computer (SBC) with options for Modified Off the Shelf(MOTS) extreme durability configurations and BuiltSECURE™
technology. MOTS configurations leverage enhanced commercial components, board fabrication rules, and subsystemdesign techniques for extra ruggedness and withstand extreme
temperature cycles better than other rugged designs.

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BuiltSECURE

For deployment at the tacticalTMedge and export to allies, theEnsemble LDS6527 embeds
BuiltSECURE technology to counter nation-state reverse engineeringwith System Security Engineering (SSE). BuiltSECURE is built-in SSE
that enables turn-key or private and personalized security solutions tobe quickly configured. The extensible nature of Mercury’s SSE delivers
system-wide security that evolves over time, building in future-proofing. As countermeasures are developed to offset emerging threats,
Mercury’s security framework keeps pace, maintaining system-wide
integrity. Please contact Mercury directly for BuiltSECURE and extra
rugged MOTS options.
Ensemble LDS6527 SBCs combine a powerful, 12-core server-classXeon D processor, Mellanox CX-3 bridged Ethernet or InfiniBand highbandwidth switching, and configurable mezzanine I/O. Each SBC has
a next-gen architecture that blends the computational power of an
Mercury Systems is a leading commercial provider of secure processing
subsystems designed and made in the USA. Optimized for customer andmission success, Mercury’s solutions power a wide variety of criticaldefense and intelligence programs.

AVX2-enabled Xeon D processor with fast InfiniBand or 40Gb/s Ethernet
data paths and the versatility of mezzanine-mounted I/O. This scalable
computing architecture is well aligned to EW, next-gen radar, complex
IMINT, multi-functional sensor chain and advanced situational awarenessapplications.

Intel Xeon D Family Server-Class Processor
The Ensemble LDS6527 features a 64-bit Xeon D family processor which
is protected and cooled by Mercury’s fifth generation of server-classpackaging, which has previously been deployed in the full spectrum of
Mercury LDS and HDS 6U OpenVPX processing modules.
The D family of Xeon processors includes a System on Chip (SoC) approach, combining the processor and the Intel Platform Controller Hub(PCH) function within a single device. With two high-speed DDR4-2133
memory controllers, the Xeon processor is supported with 16GB of
RAM. Significant PCIe interface capabilities are built in to the chip,
which enable data interfaces both on-board and off-board.
The on-device PCH functionality enables the Ensemble LDS6527 toaccess additional I/O, including USB and SATA on the backplane. The
D family of Xeon processors has dual 10 Gigabit Ethernet interfaces,
enabling backplane access for sensor data or additional inter-processor
communication, as well as support for the AVX 2.0 instruction set, that
boosts floating-point algorithm performance and is portable to futureIntel architectures.
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ACQUIREPROCESSDIGITIZEACQUIREPROCESSDIGITIZESTORAGEACQUIREPROCESSDIGITIZESTORAGEEXPLOITWARNING: “600 Series” and/or National Security Controls - These commodities, technology, or software are controlled for export from the United Statesin accordance with the Export Administration Act of 1979 as amended (Title 50 U.S.C.; App. 2401, et seq.), through the Export Administration Regulations(EAR). Transfers to foreign persons requires prior approval from the U.S. Department of Commerce, Bureau of Industry and Security.

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High Speed Fabric Interfaces

Multiple I/O Options

The Ensemble LDS6527 complements Mercury’s other OpenVPX
modules that feature dual Mellanox ConnectX-3 host adaptors fordata plane communications. Bridging between the native Gen3 PCIeinterfaces on the Intel processor and the OpenVPX data plane, the ConnectX-3 can be configured to support InfiniBand (DDR or FRD10 rates)or 10/40 Gb/s Ethernet as the data protocol.

In addition to the flexibility offered via the on-board mezzanine sites,
the Ensemble LDS6527 has a variety of additional built-in I/O options:• One 10/100/1000BASE-T Gigabit Ethernet connection can berouted to the front-panel on air-cooled configurations or to the
backplane.

By utilizing Mellanox ConnectX-3 devices and innovative OpenVPX
interconnect technology, the Ensemble LDS6527 is a model for open
architecture high-performance computing throughout the embedded
industry. Mercury OpenVPX subsystems feature robust signal rates that
comfortably exceed the margin of the channel to surpass the rate ofmodern fabrics, delivering the fastest compute solution in the industry
with future proof performance headroom.

PCIe Architecture
The Ensemble LDS6527 provides a single Gen3 PCIe switch for bothon-board switching and off-board expansion. This switch complex
provides an x8 PCIe interface to each of the two VITA-compliant XMC
sites, as well as an x4 connection to a PCIe to PCI-X® bridge for the
single PMC site. This enables the mezzanine sites to operate at fullbandwidth, optimizing the flow of I/O into the processing subsystem.
Externally, the Ensemble LDS6527 implements a full Gen3 x16 PCIeconnection to the OpenVPX expansion plane on the P2 VPX connector,
and a Gen x8 PCIe connection to P5 as well. These expansion planeinterfaces enable the Ensemble LDS6527’s compatibility with Mercury’s GPU or FPGA based co-processing modules. These configuration
options let the module effectively act as an upstream/downstream
PCIe switch to allow the “chaining” of PCIe devices.

Mezzanine Card Flexibility
The Ensemble LDS6527 provides two mezzanine sites: one PMC/ XMC
and one XMC-only. Each of the standard mezzanine sites may be configured with off-the-shelf mezzanine cards to bring additional I/O into
the system for processing or control. PMC cards are supported with a
32-bit or 64-bit PCI/PCI-X interface at up to 133 MHz on the PMC/XMC
site, with PMC user-defined I/O mapped to the backplane. XMCs aresupported with x8 PCIe on the J15/J25 connector per the VITA 42.3
standard. There are 16 differential pairs and 38 single-ended signals of
XMC user I/O mapped to the backplane via the J16/J26 connector.
The Ensemble LDS6527 utilizes VITA 61 XMC connectors for Gen3 PCIe
signal integrity and greater ruggedness.

• One additional 10/100/1000BASE-T Gigabit Ethernet connection
is routed to the backplane.
• Two 1000BASE-BX SERDES Ethernet connections are routed tothe backplane per the OpenVPX control plane specification.
• One TIA-232 serial port is routed to the front-panel on air-cooled
configurations, or to the backplane on conduction-cooled configurations. When routed to the backplane, the serial interface canbe configured for either TIA-232 or TIA-422 signaling.
• One front-panel USB 3.0 interface is available on air-cooled
configurations.
• Two backplane USB interfaces are available (one 2.0, one 3.0)
with both air-cooled and conduction-cooled configurations.
• Two SATA interfaces to the backplane are provided to interface
with storage devices.
• Eight GPIO lines act as discrete I/O usable as input, output, or to
generate interrupts on the module.
• Several additional bussed signals enhance the functionality of
the Ensemble LDS6527 module.

System Management
The Ensemble LDS6527 module implements full compliance to advanced system management functionality architected in the OpenVPX(VITA 46.11) standard to enable remote monitoring, alarm management, and hardware revision and health status. Using the standard I2C
bus and Intelligent Platform Management Controller (IPMC) protocol,
the on-board system management block implements the IPMC. This
allows the Ensemble LDS6527 module to:• Read sensor values• Read and write sensor thresholds, allowing an application toreact to thermal, voltage or current variations that exceed thosethresholds• Reset the entire module• Power up/down the entire module• Retrieve module Field Replaceable Unit (FRU) information• Be managed remotely by a Chassis Management Controller at
the system level, such as implemented on Mercury’s 6U OpenVPX
chassis or system management modules

WARNING: “600 Series” and/or National Security Controls - These commodities, technology, or software are controlled for export from the UnitedStates in accordance with the Export Administration Act of 1979 as amended (Title 50 U.S.C.; App. 2401, et seq.), through the Export Administration
Regulations (EAR). Transfers to foreign persons requires prior approval from the U.S. Department of Commerce, Bureau of Industry and Security.

Figure 1. LDS6527 functional block diagram

VPX-REDI

Additional Features

The VPX (VITA 46) standard defines 6U and 3U board formats with amodern high-performance connector set capable of supporting today’shigh-speed fabric interfaces. VPX is most attractive when paired with
the Ruggedized Enhanced Design Implementation standard — REDI(VITA 48). The Ensemble LDS6527 module is a 6U conduction-cooled/
Air Flow-By implementation of VPX-REDI, with air-cooled variants inthe same VPX form factor available for less rugged environments.

The Ensemble LDS6527 module provides all the features typicallyfound on a single-board computer. In addition to the sophisticatedmanagement subsystem and switched fabric interconnect, the Ensemble LDS6527 module provides users with a toolkit enabling manydifferent application use cases. Features include:• Real-time clock with granularity to 1ms and time measurement of
up to 30 years

Targeted primarily for harsh-environment embedded applications,
VPX-REDI offers extended mechanical configurations supporting higher
functional density, such as two-level maintenance (2LM). 2LM allows
maintenance personnel to replace a failed module and restore thesystem to an operational state in a limited time period.

Air Flow-By
Air-cooled chassis require filters to remove contaminants from their
cooling air streams. Mercury’s Air Flow-By™ technology eliminatesfiltration with the most elegant cooling solution available within asealed and rugged package. Air Flow-By technology is resilient, boosts
SWaP performance, reduces operating temperature, extends MTBF
by an order of magnitude and enables the most powerful processing
solutions.

• General-purpose timers for synchronization• Watchdog timer to support processor interrupt or reset• Multiple boot paths, including netboot, USB boot and boot from
SATA or the on-board 32 GB flash device.

Open Software Environment
Mercury leverages over 35 years of multicomputer software expertise,including recent multicore processor expertise, across its many platforms. This strategy is fully applied to the Ensemble LDS6527 module.
The same Linux® development and run-time environment is implemented on the Ensemble LDS6527 module as on other Intel-based Mercury
platforms across the Ensemble 3000, 5000 and 6000 Series. Off-theshelf open software such as OFED, OpenMPI and MultiCore Plus™ are
fully supported.

WARNING: “600 Series” and/or National Security Controls - These commodities, technology, or software are controlled for export from the United Statesin accordance with the Export Administration Act of 1979 as amended (Title 50 U.S.C.; App. 2401, et seq.), through the Export Administration Regulations(EAR). Transfers to foreign persons requires prior approval from the U.S. Department of Commerce, Bureau of Industry and Security.

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Mercury’s OpenVPX Ecosystem

OpenVPX Multi-Plane Architecture

Sensor chain awareness is having the technical expertise and resources
to design and build capable, interoperable solutions along the wholesensor processor chain. From RF/microwave, digital/analog signal
manipulation to dense, SWaP optimized processing resources to actionable intelligence dissemination; Mercury’s rugged processing subassemblies leverage the best commercial-item technology, enabling prime
contractors to win more business. Modern sensor processing subassemblies are customized assemblies of interoperable building blocks
built to open standard architectures. Mercury’s hardware and software
portfolio of building blocks are physically and electrically interoperable
as defined by international industrial standards, including OpenVPX.

System management via IPMB-A and IPMB-B links on P0 management plane
Support DDR/FDR10 InfiniBand or 10/40 Gb/s Ethernet protocols on P1 data plane
Full x16 or dual x8 Gen3 PCIe expansion plane to P2 connector; x8 Gen3 PCIe to P5
connector
Dual 1000BASE-BX Ethernet control plane

Specifications

PMC/XMC Sites
Mezzanine sites 1 PMC/XMC and 1 XMC
PCI-X to PCIe bridge Connects PMC site to on-board
PMC PCI support 33 and 66 MHz
PMC PCI-X support 66, 100, and 133 MHz
PMC user-defined I/O from J14 to backplane
PCIe XMC sites per VITA 42.3 with XMC user-defined I/O from Jn6 to backplane
VITA 61 XMC connectors

Additional I/O Capabilities

Built-in options

One RS-232 serial interface to front-panel (air-cooled) or backplane (conduction
cooled)Configurable for RS-232 or RS-422 signaling when routed to backplane
One additional RS-232/RS-422 serial interface to backplane
One front-panel USB 2.0 interface (air-cooled configurations only)
One USB 2.0 interface to backplane
One USB 3.0 interface to backplane
Two SATA interfaces to backplane
Eight single-ended GPIO interfaces to backplane
System signals to backplane NVMRO, Chassis Test,
Environmental Bypass, Memory Clear

For extra MOTS ruggedness and/or build-in security SSE, please Consult factory

MechanicalIntelligent Platform Management Interface (IPMI)

Extended MOTS ruggedness – Consult factory
Packages – Commercial and rugged air-cooled, rugged Air Flow-By and conduction
cooled6U OpenVPX - 1.0” slot pitch
OpenVPX and VPX-REDI
VITA 65 module profile MOD6-PAY-4F1Q2U2T-12.2.1-n, where n can vary based onConnectX-3 configuration
VITA 65 slot profile SLT6-PAY-4F1Q2U2T-10.2.1

Processor
Single Intel 12-core, 64 bit, Xeon D-1559
Threads per core: 2 (24 total per CPU)
Processor support:
AVX2, 256 bit vector engine incorporating
Fused Multiple-Add (FMA)
Memory:16GB DDR4-2133
PCIe Gen 3 (x8)On-board IPMI controller
Voltage and temperature monitor
Geographical address monitor
Power/reset control
On-board FRU EEPROM interface
FPGA, CPU and CPLD interfaces

Data Plane PCIe to Switched Fabric Bridge
Dual Mellanox ConnectX-3 VPI host adapters
Support DDR/FDR10 InfiniBand or 10/40 Gb/s Ethernet protocols

Compliance
OpenVPX system standard encompasses VITA 46.0, 46.3, 46.4, 46.6, 46.11
Compatible with VITA 65
VITA 61 (High-speed XMC connectors)
VITA 46.11 (System management)
VITA 46/48.1/48.2 (REDI)
InfiniBand, PCIe, 10 Gigabit Ethernet

WARNING: “600 Series” and/or National Security Controls - These commodities, technology, or software are controlled for export from the UnitedStates in accordance with the Export Administration Act of 1979 as amended (Title 50 U.S.C.; App. 2401, et seq.), through the Export Administration
Regulations (EAR). Transfers to foreign persons requires prior approval from the U.S. Department of Commerce, Bureau of Industry and Security.

Environmental Qualification Levels

Environmental

Air-cooled

Ruggedness

Air Flow-By

Conduction-cooled

Commercial L0

Rugged L1

Rugged L2

Rugged L4

Rugged L3

•

••

••

•••

•••

Moisture/dust protection

•

••

••

•••

•••

Typical cooling performance~140W*~140W*~150W*~200W*~150W**

0ºC to +40ºC-25ºC to +55ºC-45ºC to +70ºC-40ºC to +60ºC-40ºC to +71ºC

N/A

5ºC/min

10ºC/min

10ºC/min

10ºC/min-40ºC to +85ºC-55ºC to +85ºC-55ºC to +125ºC-55ºC to +125ºC-55ºC to +125ºC

Temperature

Operating*Operating temperature
maximum rate of change
Temperature

Storage
Operating*

10-90%,
non-condensing

5-95%,
non-condensing

5-95%,
non-condensing

5-95%, non-condensing
100% condensing

5-95%, non-condensing
100% condensing

Storage10-90%,
non-condensing

5-95%,
non-condensing

5-95%,
non-condensing

5-95%, non-condensing
100% condensing

5-95%, non-condensing
100% condensing

Operating*

0-10,000ft

0-30,000ft

0-30,000ft

0-30,000ft

0-70,000ft

Humidity

AltitudeStorage

0-30,000ft

0-50,000ft

0-70,000ft

0-70,000ft

0-70,000ft

Random

0.003 g2/Hz;
20-2000 Hz, 1 hr/axis

0.04 g2/Hz;
20-2000 Hz, 1 hr/axis

0.04 g2/Hz;
20-2000 Hz, 1 hr/axis

0.1 g2/Hz;
5-2000 Hz, 1 hr/axis

0.1 g2/Hz;
5-2000 Hz, 1 hr/axis

Sine

N/A

N/A

N/A

10G peak;
5-2000 Hz, 1 hr/axis

10G peak;
5-2000 Hz, 1 hr/axis

Shockz-axis: 20g;
x and y-axes: 32g;
(11ms 1/2-sine pulse,
3 positive, 3 negative)z-axis: 50g;
x and y-axes: 80g;
(11ms 1/2-sine pulse,
3 positive, 3 negative)z-axis: 50g;
x and y-axes: 80g;
(11ms 1/2-sine pulse,
3 positive, 3 negative)z-axis: 50g;
x and y-axes: 80g;
(11ms 1/2-sine pulse,
3 positive, 3 negative)z-axis: 50g;
x and y-axes: 80g;
(11ms 1/2-sine
pulse,
3 positive, 3 negative)

N/A

Contact Factory

Contact Factory

10% NaCl

10% NaCl

Vibration

Salt/Fog
VITA 47

Contact Factory* Customer must maintain required cfm level. Consult factory for the required flow rates.
** Card edge should be maintained below 71ºC
Storage Temperature is defined per MIL-STD-810F, Method 502.4, para 4.5.2, where the product under non-operational test is brought to an initial high temperature cycle to remove moisture. Then the unit
under non-operational test will be brought to the low storage temperature. The low temperature test is maintained for 2 hours. The product is then brought to the high storage temperature and is maintainedfor 2 hours. The product is then brought back to ambient temperature. All temperature transitions are at a maximum rate of 10ºC/min. One cold/hot cycle constitutes the complete non-operational storage
temperature test. This assumes that the board level products are individually packaged in accordance with ASTM-D-3951 approved storage containers. These tests are not performed in Mercury shipping
containers, but in an unrestrained condition. Please consult the factory if you would like additional test details.
All products manufactured by Mercury meet elements of the following specifications: MIL-STD-454, MIL-STD-883, MIL-HDBK-217F, and MIL-I-46058 or IPC-CC-830, and various IPC standards. Mercury’s
inspection system has been certified in accordance with MIL-I-45208A.

• Cold Start Testing• Cold Soak Testing• Custom Vibration• CFD Thermal Analysis• Finite Element Analysis• Safety Margin Analysis• Temperature Cycling• Power Cycling• Environmental Stress Screening

Standard Module, Optional Services• Engineering Change Order (ECO) Notification• ECO Control• Custom Certificate of Conformity (CofC)• Custom UID Labeling• Alternate Mean Time Between Failure (MTBF) Calculations• Hazmat Analysis• Diminished Manufacturing Sources (DMS) Management• Longevity of Supply (LOS)• Longevity of Repair (LOR)

Contact factory for additional information

Ensemble, is a registered trademark and Air Flow-By, BuiltSECURE, Innovation That Matters, and Mercury Systems are trademarks of Mercury Systems, Inc. Other product and company names mentioned may be trademarks
and/or registered trademarks of their respective holders. Mercury Systems, Inc. believes this information is accurate as of its publication date and is not responsible for any inadvertent errors. The information contained herein
is subject to change without notice.
Copyright © 2017 Mercury Systems, Inc.										3227-02E-1017-ds-LDS6527
INNOVATION THAT MATTERS ™

Corporate Headquarters
50 Minuteman Road • Andover, MA 01810 USA(978) 967-1401 • (866) 627-6951 • Fax (978) 256-3599

Europe Mercury Systems, LTD
Unit 1 - Easter Park, Benyon Road, Silchester, Reading
RG7 2PQ United Kingdom+ 44 0 1189 702050 • Fax + 44 0 1189 702321

WARNING: “600 Series” and/or National Security Controls - These commodities, technology, or software are controlled for export from the United Statesin accordance with the Export Administration Act of 1979 as amended (Title 50 U.S.C.; App. 2401, et seq.), through the Export Administration Regulations(EAR). Transfers to foreign persons requires prior approval from the U.S. Department of Commerce, Bureau of Industry and Security.

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Additional Services
Optional Environmental Screening and Analysis Services