[会告が第６回アジア溶射会議

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議 ATSC様

溶射関係者
一昨年 11 月

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来年 2014 年

集いATSC2014

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溶射技術

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ATSC2012

開催

アア溶射会
会員各位

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イ ラ ー 市機会 ぜひ第６回ア ア溶射会議 ATSC2014
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開催
ア ア 溶射 潮流を感 取

い開催 詳細 開催者

講演募集案内 First Call for Paper を 覧く

い 開催

内容 概要 以下 通

1. 会議名：第６回ア ア溶射会議 6th Asian Thermal Spray Conferece
2. 開催日時： 2014 年 11 月 24 日～26 日
3. 開催場所：

イ ラー 市 イン

4. 主催者： International Advanced Research Centre for Powder Metallurgy and New
Materials (ARCI)
5. 講演申込

6. 費用

期日

アブラク 投稿締切

2014 年 5 月 1 日

予稿原稿締 切2014 年 9 月 15 日

講演大会

2014 年 11 月 24-26 日

外国

個人参加者

300US$

外国学生参加者

200US$

First Announcement & Call for Papers
6 Asian Thermal SprayConferenceth

24th-26th November 2014
Hyderabad, India

Organized byInternational Advanced Research Centre
for Powder Metallurgy and New Materials (ARCI)
Hyderabad, India
In association with

Asian Thermal Spray SocietyAbout ATSCThe Asian Thermal Spray Conference (ATSC), following concerted
eforts by all segments of the thermal spray community in the membercountries, has emerged as a lagship event in the Asia-Paciic region.
The major objective of the event is to provide an attractive forum for all
stakeholders (researchers from industry, R&D institutions and academia;
practitioners from thermal spray service providers; equipment andfeedstock manufacturers as well as OEMs and users) from across theregion to interact in order to foster a fruitful interaction during and after the conference. The event is also expected to provide an ideal
platform for young researchers and engineers to familiarize themselves with recent advances in this rapidly evolving, yet industriallywell-entrenched technology as well as for various companies to exhibit relevant products to a dedicated audience. The past editions of
the event organized in Japan, Korea, Singapore and China were extremely successful in realizing the above objectives. The 6th editionof ATSC will be held in India for the irst time in the city of Hyderabad from 24-26th of November 2014.

Call for Papers
The Technical Program at the 6th ATSC will address diverse aspects related to thermal spray science and technology, ranging fromfundamental research to industrial applications. Prospective authors are invited to submit abstracts of papers dealing with, but not
restricted to, any of the several themes listed below:
••
•
•••
•
•

Cold Spray/Kinetic Spray
Solution and Suspension based Spray Processess
Advances in Thermal Spray Processes
Hybrid Spray Processes
Thermal Barrier Coatings
Repair & Refurbishment
Wear & Corrosion Protection
Novel Functional Applications

••
•
•
•
•
•

Modeling & Simulation
Process Control & Diagnostics
Processing-Structure-Property correlations
Advanced Characterization of Coatings
Mechanical Properties of Coatings
Environmental/Occupational Safety
Advanced Material Systems

An abstract of approximately 500 words, in English, together with full contact details, should reach the Conference Secretariat nolater than 1st May 2014. Abstracts received shall be considered for both Oral and Poster Presentation. Those authors speciically
preferring poster presentations should indicate so. Short manuscripts of all accepted papers to be presented at ATSC 2014, orally
or in poster form, will be included in proceedings to be published in a book form. In order to ensure that the publication exercise isaccomplished on schedule to make the proceedings available to the participants during ATSC 2014, complete manuscripts (preparedaccording to guidelines to be issued subsequently) will be due by 15th September 2014. Eforts are also being made to have selected
papers appear as part of a special issue of Journal of Thermal Spray Technology dedicated to ATSC 2014.

Conirmed Speakers
Even before the circulation of the irst call for papers, the conference has enthused considerable all round interest with leading
experts in the ield consenting to deliver Plenary/Invited lectures. Some of the conirmed speakers are listed below:••••••••

Chang Jiu Li, Xi’an Jiaotong University, China•
Changhee Lee, Hanyang University, Korea•Christian Moreau, Concordia University, Canada•
Christopher Berndt, Swinburne Uni. of Technology, Australia •William Clyne, Cambridge University, UK•
KA Khor, NTU, Singapore•
Seiji Kuroda, NIMS, Japan•
Sanjay Sampath, Stony Brook University, USA•

Venue

Richard Schmid, Sulzer Metco, Switzerland
G Sundararajan, ARCI, India
Armelle Vardelle, University of Limoges, France
Arvind Agarwal, Florida International University, USA
Jun Akedo, Advanced Indl. Science & Technology, JapanM Fukumoto, Toyohashi University, JapanJ Karthikeyan, ASB Ind., USAK Ogawa, Tohoku University, JapanCharminarRamoji Film City

ATSC 2014 will be organized in the South Indian city ofHyderabad. Besides having an international airport of its own
with direct lights from many overseas destinations, Hyderabad
is also well-connected with all other Indian cities. One ofthe oldest cities in India with a great and unbroken history,
Hyderabad is a bustling 400 year old metropolis with an urban Golconda Fort
population of well over 4 million. The city is cosmopolitan, andis richly endowed with a variety of cultures. The city presents
an attractive amalgam of old world charm together with theebullience of growth and enterprise. Widely accepted as the“research capital of India” and already a prominent IT hub,Hyderabad is a place where modern sophistication blends
majestically with rich tradition handed down the ages from a
glorious history. Reliving the past is a rejuvenating experiencein this city where old monuments and mausoleums attract the tourists. Opportunities for shopping abound in this “pearl city” andthe famous Hyderabadi cuisine is also certain to tickle any visitor’s palate. Hyderabad is at an altitude of 536 meters above sea levelwith pleasant temperatures ranging between 15-30 degrees Celsius expected during the Conference.

Exhibition
An exhibition will be held in parallel with the conference,
ofering a great opportunity for companies to exhibit theirproducts/equipment or advertise their capabilities to a widecross-section of the surface treatment community. The market
potential in India for surface engineering related products andservices is enormous and ATSC 2014 is a unique event thatwill bring exhibitors face to face with prospective customers
from academic institutes, research organizations and industry.
Attractive sponsorship opportunities are also available. Further
details can be obtained from the Conference Secretariat.

Important Dates
Submission of Abstract
Submission of Short Manuscript forProceedings
Conference

1st May 2014

15th September 201424-26th November 2014

First Announcement & Call for Papers
Registration Charges
Category

Foreign Participant

Indian Participant

Oral presentation/ Poster Presentation/ Participation

300 US$

8000 INR

Student

200 US$

4000 INR

The above indicated registration fee for Indian participants relects the subsidy made possible by funds expected from by Government
sponsoring agencies. The registration fee entitles (a) entry to all technical sessions (b) refreshments & lunches on all conference daysand (c) conference kit. Accommodation is not included. An Early Registration Discount of 10% will be applicable to all participants
who register before June 1, 2014.

Contact Details
Convenor

Co-Convenor

Dr Shrikant V Joshi,

Shri D Srinivasa Rao,

Additional Director, ARCITeam Leader, Centre for Engineered Coatings, ARCI

6th Asian Thermal Spray Conference
International Advanced Research Centre for Powder Metallurgy & New Materials (ARCI)
Balapur Post, Hyderabad - 500 005, INDIA
Phone: 0091-40-24441077, 24452374, 24452470; Fax: 0091-40-24443168
Email: atsc2014@arci.res.in