Specialty Thin Film Products
Formerly Known as Passive Micro Components

101722

IMPORTANT INFORMATION/DISCLAIMER
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet or
made available on the website are subject to change. The customer is responsible for checking and verifying
the extent to which the Information contained in this publication is applicable to an order at the time the order isplaced. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee,
warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KYOCERA AVX’s knowledge of typical operating
conditions for such applications, but are not intended to constitute and KYOCERA AVX specifically disclaims
any warranty concerning suitability for a specific customer application or use.
ANY USE OF PRODUCT OUTSIDE OF SPECIFICATIONS OR ANY STORAGE OR INSTALLATIONINCONSISTENT WITH PRODUCT GUIDANCE VOIDS ANY WARRANTY.
The Information is intended for use only by customers who have the requisite experience and capability todetermine the correct products for their application. Any technical advice inferred from this Information orotherwise provided by KYOCERA AVX with reference to the use of KYOCERA AVX’s products is given without
regard, and KYOCERA AVX assumes no obligation or liability for the advice given or results obtained.
Although KYOCERA AVX designs and manufactures its products to the most stringent quality and safety
standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer
applications which require a high degree of reliability or safety should employ suitable designs or othersafeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of anelectrical component does not result in a risk of personal injury or property damage.
Unless specifically agreed to in writing, KYOCERA AVX has not tested or certified its products, services ordeliverables for use in high risk applications including medical life support, medical device, direct physicalpatient contact, water treatment, nuclear facilities, weapon systems, mass and air transportation control,
flammable environments, or any other potentially life critical uses. Customer understands and agrees that
KYOCERA AVX makes no assurances that the products, services or deliverables are suitable for any highrisk uses. Under no circumstances does KYOCERA AVX warrant or guarantee suitability for any customer
design or manufacturing process.

Although all product–related warnings, cautions and notes must be observed, the customer should not assume
that all safety measures are indicted or that other measures may not be required.

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

– SPECIALTY THIN FILM PRODUCTS –Specialty Thin Film Products
Table of Contents
Specialty Thin Film Products
General Information....................................................................................................................................................................1

MS Series
MOS (Metal Oxide Semiconductor) Capacitors.................................................................................................................................................................... 2
MIS (Metal Insulator Semiconductor) Capacitors

Thin Film WBR (Wire Bond Resistor)
Top Contact......................................................................................................................................................................................................................... 5

HR02 SeriesHigh Reliability Resistors..................................................................................................................................................................................................... 6UBR Series
Ultra-Broadband Resistors.................................................................................................................................................................................................. 8

Thin Film RF Solutions - Attenuator
AT Series - 0603...............................................................................................................................................................................................................12

Q Bridge Thermal Conductor....................................................................................................................................................................................... 25
Gain Equalizer - RC Network........................................................................................................................................................................................28
Transmission Line MIM Capacitor(Metal-Insulator-Metal).....................................................................................................................................................................................................32

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

– SPECIALTY THIN FILM PRODUCTS –Specialty Thin Film Products
General Information
PROCESS CAPABILITIES ELECTRONIC MATERIALS
Passive Element

Resistors

Material

Capacitors

TaN

SiCr

SiON

Sheet Resistance orSpecific Capacitance

10-100 Ω/sq

700-1400 Ω/sq

100 pf/mm

Inductors

SiO2

BCB

35 pf/mm

2

25 pf/mm

2

CU
N/A

2

Typical Ranges

0.47-1MΩ

47-30MΩ

1-500pF

1-500pF

1-50pF

0.5-20nH

Breakdown Conditions> 350°C> 400°C≤ 600(V/µm)≤ 1000(V/µm)≤ 300(V/µm)NA

Minimum Tolerance± 0.1%± 0.1%> 0.5% trimmed;± 4% untrimmed> 0.5% trimmed;± 4% untrimmed± 10%
untrimmed±5%

Performance
NOTE TCR in ppm/°C

TCR-150 to -100

TCR
Tunable to ±25(±250 Typical)

K 6.1;
TCC 60

K 4.0;
TCC 30K 2.7;
TCC 42

Q≤80

AU WIRE-BOND

SURFACE MOUNT(SINGLE I/O PAIR)

BALL GRID ARRAYAI WIRE-BOND

SURFACE MOUNT(STRIPED, MULTIPLE I/OS

LAND GRID ARRAY

Substrate

Thickness

Comment

Material

Thickness

Comment

P-Si Boron doped

5-25 mil

15 Ω-cmAl

150-40kÂ

Also with 4% Cu or 1% Si

N++ SiArsenic Doped

5-25 mil

0.002 Ω-cm

Glass

5-25 mil

1013 Ω-cm

Aluminum Nitride

10-60 milLapped or Polished

Alumina5-50 milLapped or Polished

Fused Silica

5-25 mil

1014 Ω-cm

BeO

10-60 milLapped or PolishedAu

500-20kÂAu (plated)

0.5-20µm

Electro And Electro-lessCr

150-5kÂ

600Â TypicalCu

2k-25kÂCu (plated)

0.5-100µm

Ni (V)

500-10kÂ

Ni (plated)

0.5 - 4µm

Pd500-5kÂ

Pt

1k-4kÂ

TaN

300-1.5kÂ

2500Â TypicalTi

500-5kÂ

600Â TypicalTiW

300-2kÂ

500Â TypicalThe Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
101722– SPECIALTY THIN FILM PRODUCTS –1

MS Series
MOS (Metal Oxide Semiconductor) Capacitors
MIS (Metal Insulator Semiconductor) Capacitors
GENERAL DESCRIPTION
For applications in RF, microwave, and GHz ranges, KYOCERA AVX now offers MOS and MIS Capacitors.
MOS Capacitors are Single Layer Capacitors (SLCs) that use silicon dioxide to produce small, high Q,
temperature stable, high breakdown voltage, low leakage capacitors. To ease assembly, KYOCERA AVX
offers a wide range of termination styles for epoxy or solder die attach and subsequent Gold or Aluminum
wire thermosonic and ultrasonic bonding. Custom applications and designs are welcome. Please contact
your local representative.

FEATURESAPPLICATIONS

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Small Size: .010 to .070 inches square
Capacitance Range: 1.0 to 1000pF
High Q
DC to 20GHz operation

Hybrid circuits
Bias Networks
Test and Measurement Equipment
Aerospace
TOSA and ROSA applications

HOW TO ORDER
MS

20

3

S

100

M

AUCA

W

Series CodePackaging CodeMetal on Silicon

W = waffle pack
T = Tested whole wafer
D = Tested wafer diced on film frame

Case Size

Square Size in mils 10, 20, 30, 40, 50, 60, 70
OS = Special Order*

Termination CodeTop layers:
Au = gold
Al = aluminum
OS = a custom pad (such as copper)
Bottom layers:
NA = bare silicon(no back side metal)
CA = chrome-gold
OS = (custom back)*Please supply design

Breakdown Voltage
2 = 200 BDV
1 = 100 BDV
5 = 50 BDV
3 = 25 BDVDielectric CodeS = Si02
I = SiON

Capacitance Tolerance

CapacitanceJ = 5%
K = 10% S = Tight tolerance special
order available
M = 20%EIA Cap Code in pF
First two digits = significant figures or “R”
for decimal place.
Third digit = number of zeros or after “R”
significant figures.

MIL TEST METHODSTYPICAL ELECTRICAL SPECIFICATIONSStandard Test Method

MIL Reference

MIL Section

Material MOS(SiO2)

Bond Strength

MIL-STD-883

2011.7

pF/mm2 Typical 85 @ 50V rated
TCC ±30 ppm/°C

Shear Strength

MIL-STD-883

2019

Thermal ShockMIL-STD-202

107

Breakdown Voltage ≤200

Life

MIL-STD-202

108

Peak Voltage at +25°C 1.5 x BDV

Load Humidity (THB)MIL-STD-202

103 @rated VDC

BDV ≤0.1%
Operating Temp. Range -55°C to 125°C
Thickness 0.25mm (9.85mil)
Size Tolerance ±0.076mm (±3mil)

2

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0004 | Rev 1– SPECIALTY THIN FILM PRODUCTS –MS Series
MOS (Metal Oxide Semiconductor) Capacitors
MIS (Metal Insulator Semiconductor) Capacitors
STANDARD VALUESPart Number

Length mil (mm)Width mil (mm)Value (pF)

MS102S0R1MAUCAW

10 (.254)

10 (.254)

0.1

BDV
200

MS102SR15MAUCAW

10 (.254)

10 (.254)

0.15

200

MS102SR22MAUCAW

10 (.254)

10 (.254)

0.22

200

MS102SR33MAUCAW

10 (.254)

10 (.254)

0.33

200

MS102SR47MAUCAW

10 (.254)

10 (.254)

0.47

200

MS102SR68MAUCAW

10 (.254)

10 (.254)

0.68

200

10 (.254)

20 (.508)

1

200

MSOS2S1R5MAUCAW

10 (.254)

20 (.508)

1.5

200

MS202S2R2MAUCAW

20 (.508)

20 (.508)

2.2

200

MS202S3R3MAUCAW

20 (.508)

20 (.508)

3.3

200

MS103S4R7KAUCAW

10 (.254)

10 (.254)

4.7

25

MSOS2S4R7KAUCAW

30 (.762)

20 (.508)

4.7

200

MSOS2S6R8KAUCAW

30 (.762)

20 (.508)

6.8

200

MS103S100KAUCAW

10 (.254)

10 (.254)

1025

MS302S100KAUCAW

30 (.762)

30 (.762)

10

200

MSOS3S220KAUCAW

10 (.254)

20 (.508)

22

25

MS203S470KAUCAW

20 (.508)

20 (.508)

47

25

MS303S101KAUCAW

30 (.762)

30 (.762)

100

25MS503S471KAUCAW

50 (1.27)

50 (1.27)470

25MS703S102KAUCAW

70 (1.778)

70 (1.778)

1000

25

Cap Value

MSOS2S1R0MAUCAW

1000pF
680pF
470pF
330pF
220pF
150pF
100pF
68pF
47pF
33pF
22pF
15pF
10pF
6.8pF
4.7pF
3.3pF
2.2pF
1.5pF
1pF

Breakdown Voltage
200 VDC
100 VDC
50 VDC
25 VDC

10

20

30
40
50
Square Chip Length (mil)60

70

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0004 | Rev 1– SPECIALTY THIN FILM PRODUCTS –3

MS Series
MOS (Metal Oxide Semiconductor) Capacitors
MIS (Metal Insulator Semiconductor) Capacitors
S21 AND Q VERSUS FREQUENCY
Typical MOS Caps: 50MHz-25GHz
Au/TaN bond pad, Cr/Au back side

Tested on Alumina Test Board with Agilent VNA

22pF Q vs. Frequency

Tested on Alumina Test Board with Agilent VNA

4

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0004 | Rev 1– SPECIALTY THIN FILM PRODUCTS –Thin Film WBR (Wire Bond Resistor)
Top Contact
GENERAL DESCRIPTION
Top Contact Precision wire bondable resistors are ultra-stable with high reliability. Resistors are laser trimmed totight tolerance. Customizable value and unique marking of that value. This device is built in 0202 chip outline andis ideal for but not limited to hybrid circuit applications.
These are designed specifically for applications that require thermo-compression, epoxy or ultra-sonic attachment.

APPLICATIONSBENEFITS

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Medical Implantable
Military / Defense
Hybrid Designs
Multi-Chip Module (MCM)
Test & Measurement Instrumentation
High-Rel Microelectronics
RF / Microwave communications

Top Contact/ Bottom Isolated
Ultra High Stability
High Reliability
Extremely Tight Tolerance
Unique Value Marking
250 mW Power Rating
Small package size

HOW TO ORDER
WBR

Series CodeWBR = Wire Bond
Resistor

S

0202

Case Size

0202 = 0202
0S0S = Special Request
Please supply
Design orcontact factory

D

Material

S = Silicon
G = Glass
C = Custom

1R051

TCR (ppm/°C)

D = ±150
S = Special Request
supply design orcontact factory

F

Resistance

1R500 = 1.5 ohm
1R051 = 10.5ohm
1R052 = 105ohm
1R053 = 1,050ohm
2R553 = 2,550ohm
1R054 = 10,500ohm
1R007 = 10Megohm

G

Tolerance

F = 1%
G = 2%
J = 5%
S = Special Request
supply design orcontact factoryW

Termination CodeG = Bondable GoldA = Aluminum

Packaging

W = Waffle Pack

Not standard values, values shownfor intruction purposes only

MECHANICAL DIMENSIONS INCHES (MM)0.002 (0.05)

Size

Length (L)Width(W)

Minimum Bond Area0202

0.020 ± 0.003(0.51 ± 0.076)

0.020 ± 0.003(0.51 ± 0.076)

0.0038 ± 0.0038(0.09 x 0.09)

0.002(0.05)
0.020(0.51)

Other sizes available upon request

GENERAL CHARACTERISTICS
Operating Temperature -55ºC ± 125ºC
Insulation Resistance

106MOhm

STANDARD VALUESPart Number

Value (ohm)

WBR0202SD1R001FGW 10Ω
WBR0202SD2R001FGW 20Ω
WBR0202SD4R701FGW 47Ω

0.004 (0.10)

ENVIRONMENTAL TESTS
Test

LimitsSpecification

Life Test/ Stability±0.25% Max Δ R/R

MIL-STD-202 MTD 108,1000hrs, 125ºC,50mW

Thermal Shock±0.25% Max Δ R/R

MIL-STD-202 MTD 107

High Temperature
Exposure±0.25% Max Δ R/R

100 Hrs @ 150ºC

Moisture Resistance±0.25% Max Δ R/R

MIL-STD-202 MTD 106

Wire Bond Test

4 Gram Min(1.25 Mil Wire)

MIL –PRF-55342

Short Time Overload±0.25% Max Δ R/R

MIL –PRF-55342

WBR0202SD1R002FGW 100ΩWBR0202SD1R302FGW 130Ω
WBR0202SD2R202FGW 220Ω
WBR0202SD3R302FGW 330Ω
WBR0202SD6R802FGW 680Ω
WBR0202SD1R003FGW 1kΩ
WBR0202SD3R013FGW 3.01kΩ
WBR0202SD4R703FGW 4.7kΩ
WBR0202SD5R003FGW 5kΩ
WBR0202SD1R004FGW 10kΩWBR0202SD1R005FGW 100kΩ
WBR0202SD1R006FGW 1MΩ
WBR0202SD1R007FGW 10MΩCustom values available from 1 to 10M Ohm
available upon request
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0007 | Rev 1– SPECIALTY THIN FILM PRODUCTS –5

HR02 SeriesHigh Reliability Resistors
GENERAL DESCRIPTION
The HR Series is the next generation of surface mount High Value Resistors. This product was designed with ourproprietary Glass Sandwich FLEXITERM® Technology. The FLEXITERM® is a surface mountable automotive and medicallyqualified termination that adds an extra margin against damage due to flexture during installation. The HR Series has been
designed with high quality selected materials that yield excellent performance in a small size. Resistor is designed to beembedded in glass sandwich to avoid environmental conditions, and provide low burst noise at high thin film resistancevalues. This product is ideal for use in applications requiring surface mountable small outline EIA resistors.

FEATURESAPPLICATIONS

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EIA 0402 Size
Power Rating: 125 mW
Low Current Consumption
High Voltage
Operating Temperature-40°C to +125°C• Low Burst Noise

Multi Chip Module (MCM)
Bias Networks
Test and Measurement Equipment
Aerospace
MedicalAutomotive

HOW TO ORDER
HR02
Size

HR02 = 0402

A

5R1

D

TCR

Resistance (Ohms)

Tolerance

A = ± 150
S = Special Request
supply design orcontact factory

1R1 = 1.1 Ω
100 = 10 Ω
101 = 100 Ω
102 = 1,000 Ω
103 = 10,000 Ω
104 = 100,000 Ω
105 = 1,000,000 Ω
106 = 10,000,000 Ω

MECHANICAL DIMENSIONS mm (inches)
Length(L)

1.00±0.10(0.039±0.004)

Width
(W)

0.50±0.10(0.020±0.004)

Thickness(T)

0.50±0.10(0.020±0.004)

Terminal(t)0.25±0.15(0.010±0.006)

Z

D = ±0.5%*
F = 1%
G = 2%
J = 5%

TR

Termination

Packaging

7 = Nickel Gold*Z = Nickel Tin

TR = Tape & Reel
W = Waffle Pack

*Non-standard termination
per special request*Non-standard tolerance
values per special request

0402 TYPICAL CHARACTERISTICS
Resistor

DetailOutline

EIA 0402

Package

Glass wafer sandwich

Termination

FLEXITERM® (Ag/Epoxy), plated

Power Rating

125 mW

Operating Temperature Range-40°C to +125°C

Resistors from 1k to 30M Ohms available upon request

STANDARD VALUESPart Number

Value (ohm)

HR02A102FZTR

1000

HR02A222FZTR

2200

HR02A472FZTR

4700

HR02A103FZTR

10000

HR02A223FZTR

22000

HR02A473FZTR

47000

HR02A104FZTR

100000

HR02A224FZTR

220000

HR02A474FZTR

470000

HR02A105FZTR

1000000

HR02A225FZTR

2200000

HR02A475FZTR

4700000

HR02A106FZTR

10000000

HR02A226FZTR

22000000

HR02A306FZTR

30000000

6

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0002 | Rev 1– SPECIALTY THIN FILM PRODUCTS –HR02 SeriesHigh Reliability Resistors
SUGGESTED MOUNTING PAD DIMENSIONSNormal Pads
W = Chip Width

L = Chip Length

T = Chip Thickness

Case Size

A Min.

B Min.

C Min.

D Min.

0402

0.54(0.0213)0.3175(0.0125)0.523(0.0206)

1.107(0.0436)mm (inches)

NOTES:
Mounting will allow the solder fillet to travel up approximately 0.015" of the chip's end and side termination surface. Heavier fillets require a predeposition ofsolder paste and or an increase in pad dimensions. Typical solder paste application is a .008" to 0.01" thickness with >50% of volume in solder alloy. Can bemounted in both vertical and horizontal orientation without changing electrical performance

POWER DERATINGPower Derating Curve
Rated Power [mW]

150
100
50
0

-50

0

50
100
Ambient Temperature [°C]150

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0002 | Rev 1– SPECIALTY THIN FILM PRODUCTS –7

UBR Series
Ultra-Broadband Resistors
GENERAL DESCRIPTION
Passive Micro Component group is pleased to introduce the UBR Series of next generation of surface mount Ultra-Broadband
Resistors. This product was designed utilizing our proprietary Glass Sandwich Flexiterm® Technology, (GSFT). The Flexiterm® is asurface mountable automotive qualified termination that adds an extra margin against damage due to flexture during installation.
The UBR Series has been designed with high quality selected materials that yield excellent performance. This product is ideal
for use in Optical Transceiver Modules or any application requiring excellent ultra-broadband performance. The use of glass
sandwich technology and precision laser triming reduces parasitic noise up to 40 GHz.

FEATURESAPPLICATIONSMARKETS

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Frequency Range: DC to 40 GHz
EIA 0402 Case Size
Power Rating: 125 mW
Operating Temperature: -40°C to +125°C
100% Laser Trimming for Tight Tolerances
RoHS Compliant

Optical Transceiver Modules
Broadband ReceiverTOSA / ROSA
Wideband Test Equipment
Low Noise Amplifier
MMIC Amplifiers• Mixers• Directional Couplers• Ultra-Broadband Splitters
and Combiners

Opto-electronics
Automotive
Telecom
Broadband Jamming for EW
Satellite Communication

HOW TO ORDER
UBR

0402

A

500

F

Z

TR

Series CodePackaging

Case Size

Termination TypeUBR = Ultra-Broadband Resistor

TR = 70402=0402

TCR (ppm/°C)

Z = Flexiterm®
(Ag/Epoxy)
NiSn plated
7 = Gold Termination**Non-standard values per special request*Non-standard termination per special request

A = ±150
E = Special Request Please supply design or contact factory

Resistor Tolerance
D = ±0.5%*
F = ±1%G = ± 2%S = Special Request Please supply
design or contact factory

ResistanceFirst two Significants for Resistance R for decimal point

STANDARD VALUESPart Number*Non-Standard tolerance values per special request

Value(ohm)

UBR0402A250FZTR

25Ω

UBR0402A35R7FZTR

37.5Ω

UBR0402A430FZTR43Ω

UBR0402A500FZTR50Ω

UBR0402A750FZTR75Ω

UBR0402A101FZTR

100Ω

UBR0402A201FZTR

200Ω

CLICK HERE TO DOWNLOADDATA FILES*Data files contain DXF and S2P files
LEAD-FREE COMPATIBLECOMPONENTFor RoHS compliant products, please
select correct termination style

Resistors from 10 to 1k Ohm available upon request

8

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0006 | Rev 1– SPECIALTY THIN FILM PRODUCTS –UBR Series
Ultra-Broadband Resistors
MECHANICAL DIMENSIONS

mm (inches)

Length(L)

1.00±0.10(0.039±0.004)

Width
(W)

0.50±0.10(0.020±0.004)

Thickness(T)

0.50±0.10(0.020±0.004)

Terminal(t)0.25±0.15(0.010±0.006)

0402 TYPICAL CHARACTERISTICS
Resistor

DetailOutline

EIA 0402

Package

Glass wafer sandwich

Maximum Voltage

1 KV

Termination

FLEXITERM® (Ag/Epoxy), plated

Power Rating

125 mW

Operating Temperature Range-40°C to +125°C

SUGGESTED MOUNTING PAD DIMENSIONSNormal Pads
W = Chip Width

L = Chip Length

T = Chip Thickness

Case Size

A Min.

B Min.

C Min.

D Min.

0402

0.54(0.0213)0.3175(0.0125)0.523(0.0206)

1.107(0.0436)

Dimensions are in inches.

NOTES:
Mounting will allow the solder fillet to travel up approximately 0.015" of the chip's end and side termination surface. Heavier fillets require a predeposition ofsolder paste and or an increase in pad dimensions. Typical solder paste application is a .008" to 0.01" thickness with >50% of volume in solder alloy. Can bemounted in both vertical and horizontal orientation without changing electrical performance

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0006 | Rev 1– SPECIALTY THIN FILM PRODUCTS –9UBR Series
Ultra-Broadband Resistors
POWER DERATINGPower Derating Curve
Rated Power [mW]

150
100
50
0

-50

0

50
100
Ambient Temperature [°C]150

ENVIRONMENTAL TEST
Test

LimitsSpecification

Life Test/Stability±0.25% Max Δ R/R

MIL-STD-202
MTD 108, 1000hrs, 125ºC, 50mW
MIL-STD-202 MTD 107

Thermal Shock±0.25% Max Δ R/R

High Temperature Exposure±0.25% Max Δ R/R

100 Hrs @ 150ºC

Moisture Resistance±0.25% Max Δ R/R

MIL-STD-202 MTD 106

10

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0006 | Rev 1– SPECIALTY THIN FILM PRODUCTS –UBR Series
Ultra-Broadband Resistors
INTERNAL IMPEDANCE CURVESNOTES: All testing done by Modelithics
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0006 | Rev 1– SPECIALTY THIN FILM PRODUCTS –11

Thin Film RF Solutions - Attenuator
AT Series - 0603
GENERAL DESCRIPTIONKYOCERA AVX’s new PMC SMT Attenuator Series (AT) is manufactured with the highest quality materials for reliable andrepeatable performance. These devices are constructed with Aluminum Nitride (AIN) and are available in a standard EIA
0603 case size. The AT Series exhibits excellent performance characteristics for the most demanding PMC applications
The AT series provides virtually flat loss over a broad frequency spectrum. Thin film metalization provides for very
stable characteristics over temperature and time. Its balanced PI design provides even current distribution and accurate
attenuation characteristics from DC to 20 GHz. It is designed to meet a wide range of RF and microwave large and small
signal level applications. The AT is ideal for impedance matching, input padding, signal level runing, and many othercritical PMC applications. The AT is rated highest power in class and is suitable for microstrip and CPW applications.
The non-magnetic termination is available to provide bonding with conductive epoxies. The AT is fully compatible withhigh speed automated pick-and-place processing.
Note: Consult Factory for other attenuation values, termination style and case sizes.

HOW TO ORDER

AT

0603

T

03

E

CA

T

D

Product Designation

Quantity

Case Size

D = 1000
B = 500

See mechanical dimensions below

7 = 100

Packaging

Power Rating

T = Tape & Reel: 7” Reel, 1000 pcs.
C = Cap Pack, 100 pcs.

T = 1 W (0 to 6 dB)
C = 3/4 W (7 to 10 dB)

Termination

Attenuation

CA = Non-Mag Gold

0 to 10 dB

Configuration
E = All Terminations wrapped andpatterned ground plane

The above part number refers to an AT 0603 Case Size with an attenuation of 3dB, 1W Power Rating, wrapped andpatterned ground plane configuration with Solderable Gold Termination and tape and reel packaging, 1000 pcs.

APPLICATIONSFEATURES
•
•
•
•
•
•

Thin Film Design
Power Rating Up to 1 Watt
Frequency Response ±0.5dB
Characterized to 20 GHz
CPW and Microstrip Applications
EIA 0603 SMT

•
•
•
•
•

•
•
•
•
•
•
•

Highest Power in ClassAIN construction
Balanced Pi design
Non-Magnetic Versions Available
RoHs compliant

Telecommunications
Satellite Communications
Cellular Base Stations
Microwave RadioISM
RF/Microwave Power
Military/Aerospace

•
•
•
•
•
•

Test and Measurement
Impedance Matching
Input Padding
Signal Level Tuning
Signal Conditioning
MRI

AVAILABLE ATTENUATOR VALUESPart NumberdB

Impedance

Frequency Range

Power

Case Size

AT0603T00ECATD

050

DC - 20 Ghz

1

0603

AT0603T01ECATD

150

DC - 20 Ghz

1

0603

AT0603T02ECATD

250

DC - 20 Ghz

1

0603

AT0603T03ECATD

350

DC - 20 Ghz

1

0603

AT0603T04ECATD

450

DC - 20 Ghz

1

0603

AT0603T05ECATD

550

DC - 20 Ghz

1

0603

AT0603T06ECATD

650

DC - 20 Ghz

1

0603

AT0603C07ECATD

750

DC - 20 Ghz

0.75

0603

AT0603C08ECATD

850

DC - 20 Ghz

0.75

0603

AT0603C09ECATD

950

DC - 20 Ghz

0.75

0603

AT0603C10ECATD

1050

DC - 20 Ghz

0.75

0603

LEAD-FREE COMPATIBLECOMPONENTFor RoHS compliant products, please
select correct termination style

Click on part number to see full specifications

12

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0001 | Rev 1– SPECIALTY THIN FILM PRODUCTS –Thin Film RF Solutions - Attenuator
Performance Data

RF/MICROWAVE ATTENUATOR TEST CONDITION DESCRIPTION
All testing performed on 13.3-mil-thick Rogers RO4350 microstrip board, with the UUT subtending a 44 mil gap in 30 mil-wide center
trace (nominal 50-ohm characteristic impedance). Measurements were made using a four-receiver architecture. Measurements havebeen de-embedded to the edges of the UUT using a standard TRL calibration procedure.

RF/MICROWAVE ATTENUATOR MODELED DATA DESCRIPTION
Models were simulated using Ansoft HFSS version 14 in a perfect 50 ohm environment with ideal ports placed at the edge of thepads to ground. The boundary condition was set to be a radiating boundary in air.

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0001 | Rev 1– SPECIALTY THIN FILM PRODUCTS –13

Thin Film RF Solutions - Attenuator
AT0603T00ECATD - 0dB
QUALIFICATION TEST SUMMARY
Input Power CW: 1W

Tolerance (dB): D.C. to 10 GHz:±0.50 dB >10GHz: ±dB

Frequency Range: DC to 20 GHz

Resistors: Tantalum Nitride

VSMR: 1.25:1 Typical

Terminal: Thin Film Metalstack, Au

Nominal Impedance: 50 Ohms

Substrate Material: AIN

Operating Temperature: -55°C to + 150°C

Inspection: 100% Per MIL-STD-883

Click here to go back to main table

HOW TO ORDER
AT

0603

T

00

E

CA

T

D

Product Designation
Case Size

Quantity
D = 1000
B = 500
7 = 100

See mechanical dimensions below

Power Rating
T = 1W

Packaging

Attenuation
Configuration

Termination

T = Tape & Reel: 7" Reel, 1000 pcs
C = Cap Pack, 100 pcs

E = All Terminations wrapped and patterned ground planned

CA – Non-Mag Gold

MECHAINCAL DIMENSIONS
Dimensions are in mils, Bottom View
24 ± 25 min

25

31 ± 4

LEAD-FREE COMPATIBLECOMPONENTFor RoHS compliant products, please
select correct termination style

GND

46

30

Via to Ground

63 ± 430

20 ± 2

CLICK HERE TO
DOWNLOAD DATA FILES

53*Data files contain DXF, S2P, and HFSS files

Measured 0dB Attenuator on Microstrip Board
0-5

Loss [dB]

-10
-15
-20
-25
-30
-35
-40

0

2

4

6

8

10
12
Frequency [GHz]Insertion Loss [S21]

14

16

18

20

Return Loss [S11]All testing performed on 13.3-mil-thick Rogers RO4350 microstrip board, with the UUT subtending a 44 mil gap in 30 mil-wide center trace (nominal 50-ohm characteristic
impedance). Measurements were made using a four-receiver architecture. Measurements have been de-embedded to the edges of the UUT using a standard TRL calibration
procedure.

14

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0001 | Rev 1– SPECIALTY THIN FILM PRODUCTS –Thin Film RF Solutions - Attenuator
AT0603T01ECATD - 1dB
QUALIFICATION TEST SUMMARY
Input Power CW: 1W

Tolerance (dB): D.C. to 10 GHz:±0.50 dB >10GHz: ±dB

Frequency Range: DC to 20 GHz

Resistors: Tantalum Nitride

VSMR: 1.25:1 Typical

Terminal: Thin Film Metalstack, Au

Nominal Impedance: 50 Ohms

Substrate Material: AIN

Operating Temperature: -55°C to + 150°C

Inspection: 100% Per MIL-STD-883

Click here to go back to main table

HOW TO ORDER
AT

0603

T

01

E

CA

T

D

Product Designation
Case Size

Quantity
D = 1000
B = 500
7 = 100

See mechanical dimensions below

Power Rating
T = 1W

Packaging

Attenuation
Configuration

Termination

T = Tape & Reel: 7" Reel, 1000 pcs
C = Cap Pack, 100 pcs

E = All Terminations wrapped and patterned ground planned

CA = Non-Mag Gold

MECHAINCAL DIMENSIONS
Dimensions are in mils, Bottom View
LEAD-FREE COMPATIBLECOMPONENT

24 ± 25 min

25

31 ± 4For RoHS compliant products, please
select correct termination style

GND

46

30

Via to Ground

63 ± 430

20 ± 2

CLICK HERE TO
DOWNLOAD DATA FILES

53*Data files contain DXF, S2P, and HFSS files

Measured 1dB Attenuator on Microstrip Board
0-5-10
Loss [dB]

-15
-20
-25
-30
-35
-40

0

2

4

6

8

10
12
Frequency [GHz]Insertion Loss [S21]

14

16

18

20

Return Loss [S11]All testing performed on 13.3-mil-thick Rogers RO4350 microstrip board, with the UUT subtending a 44 mil gap in 30 mil-wide center trace (nominal 50-ohm characteristic
impedance). Measurements were made using a four-receiver architecture. Measurements have been de-embedded to the edges of the UUT using a standard TRL calibration
procedure.
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0001 | Rev 1– SPECIALTY THIN FILM PRODUCTS –15

Thin Film RF Solutions - Attenuator
AT0603T02ECATD - 2dB
QUALIFICATION TEST SUMMARY
Input Power CW: 1W

Tolerance (dB): D.C. to 10 GHz:±0.50 dB >10GHz: ±dB

Frequency Range: DC to 20 GHz

Resistors: Tantalum Nitride

VSMR: 1.25:1 Typical

Terminal: Thin Film Metalstack, Au

Nominal Impedance: 50 Ohms

Substrate Material: AIN

Operating Temperature: -55°C to + 150°C

Inspection: 100% Per MIL-STD-883

Click here to go back to main table

HOW TO ORDER
AT

0603

T

02

E

CA

T

D

Product Designation
Case Size

Quantity
D = 1000
B = 500
7 = 100

See mechanical dimensions below

Power Rating
T = 1W

Packaging

Attenuation
Configuration

Termination

T = Tape & Reel: 7" Reel, 1000 pcs
C = Cap Pack, 100 pcs

E = All Terminations wrapped and patterned ground planned

CA = Non-Mag Gold

MECHAINCAL DIMENSIONS
Dimensions are in mils, Bottom View
24 ± 2

5 min

LEAD-FREE COMPATIBLECOMPONENT

25

31 ± 4For RoHS compliant products, please
select correct termination style

GND

46

30

Via to Ground

63 ± 430

20 ± 2

CLICK HERE TO
DOWNLOAD DATA FILES

53*Data files contain DXF, S2P, and HFSS files

Measured 2dB Attenuator on Microstrip Board
0
-5
-10

Loss [dB]

-15
-20
-25
-30
-35
-40

0

2

4

6

8

10
Frequency [GHz]Insertion Loss [S21]

12

14

16

18

20

Return Loss [S11]All testing performed on 13.3-mil-thick Rogers RO4350 microstrip board, with the UUT subtending a 44 mil gap in 30 mil-wide center trace (nominal 50-ohm characteristic
impedance). Measurements were made using a four-receiver architecture. Measurements have been de-embedded to the edges of the UUT using a standard TRL calibration
procedure.

16

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0001 | Rev 1– SPECIALTY THIN FILM PRODUCTS –Thin Film RF Solutions - Attenuator
AT0603T03ECATD - 3dB
QUALIFICATION TEST SUMMARY
Input Power CW: 1W

Tolerance (dB): D.C. to 10 GHz:±0.50 dB >10GHz: ±dB

Frequency Range: DC to 20 GHz

Resistors: Tantalum Nitride

VSMR: 1.25:1 Typical

Terminal: Thin Film Metalstack, Au

Nominal Impedance: 50 Ohms

Substrate Material: AIN

Operating Temperature: -55°C to + 150°C

Inspection: 100% Per MIL-STD-883

Click here to go back to main table

HOW TO ORDER
AT

0603

T

03

E

CA

T

D

Product Designation
Case Size

Quantity
D = 1000
B = 500
7 = 100

See mechanical dimensions below

Power Rating
T = 1W

Packaging

Attenuation
Configuration

Termination

T = Tape & Reel: 7" Reel, 1000 pcs
C = Cap Pack, 100 pcs

E = All Terminations wrapped and patterned ground planned

CA = Non-Mag Gold

MECHAINCAL DIMENSIONS
Dimensions are in mils, Bottom View
24 ± 2

5 min

LEAD-FREE COMPATIBLECOMPONENT

25

31 ± 4For RoHS compliant products, please
select correct termination style

GND

46

30

Via to Ground

63 ± 430

20 ± 2

CLICK HERE TO
DOWNLOAD DATA FILES

53*Data files contain DXF, S2P, and HFSS files

Measured 3dB Attenuator on Microstrip Board
0
-5
-10

Loss [dB]

-15
-20
-25
-30
-35
-40

0

2

4

6

8

10
12
Frequency [GHz]Insertion Loss [S21]

14

16

18

20

Return Loss [S11]All testing performed on 13.3-mil-thick Rogers RO4350 microstrip board, with the UUT subtending a 44 mil gap in 30 mil-wide center trace (nominal 50-ohm characteristic
impedance). Measurements were made using a four-receiver architecture. Measurements have been de-embedded to the edges of the UUT using a standard TRL calibration
procedure.
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0001 | Rev 1– SPECIALTY THIN FILM PRODUCTS –17

Thin Film RF Solutions - Attenuator
AT0603T04ECATD - 4dB
QUALIFICATION TEST SUMMARY
Input Power CW: 1W

Tolerance (dB): D.C. to 10 GHz:±0.50 dB >10GHz: ±dB

Frequency Range: DC to 20 GHz

Resistors: Tantalum Nitride

VSMR: 1.25:1 Typical

Terminal: Thin Film Metalstack, Au

Nominal Impedance: 50 Ohms

Substrate Material: AIN

Operating Temperature: -55°C to + 150°C

Inspection: 100% Per MIL-STD-883

Click here to go back to main table

HOW TO ORDER
AT

0603

T

04

E

CA

T

D

Product Designation
Case Size

Quantity
D = 1000
B = 500
7 = 100

See mechanical dimensions below

Power Rating
T = 1W

Packaging

Attenuation
Configuration

Termination

T = Tape & Reel: 7" Reel, 1000 pcs
C = Cap Pack, 100 pcs

E = All Terminations wrapped and patterned ground planned

CA = Non-Mag Gold

MECHAINCAL DIMENSIONS
Dimensions are in mils, Bottom View
24 ± 2

5 min

LEAD-FREE COMPATIBLECOMPONENT

25

31 ± 4For RoHS compliant products, please
select correct termination style

GND

46

30

Via to Ground

63 ± 420 ± 230

CLICK HERE TO
DOWNLOAD DATA FILES

53*Data files contain DXF, S2P, and HFSS files

Measured 4dB Attenuator on Microstrip Board
0-5-10
Loss [dB]

-15
-20
-25
-30
-35
-40

0

2

4

6

8

10
12
Frequency [GHz]Insertion Loss [S21]

14

16

18

20

Return Loss [S11]All testing performed on 13.3-mil-thick Rogers RO4350 microstrip board, with the UUT subtending a 44 mil gap in 30 mil-wide center trace (nominal 50-ohm characteristic
impedance). Measurements were made using a four-receiver architecture. Measurements have been de-embedded to the edges of the UUT using a standard TRL calibration
procedure.

18

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0001 | Rev 1– SPECIALTY THIN FILM PRODUCTS –Thin Film RF Solutions - Attenuator
AT0603T05ECATD - 5dB
QUALIFICATION TEST SUMMARY
Input Power CW: 1W

Tolerance (dB): D.C. to 10 GHz:±0.50 dB >10GHz: ±dB

Frequency Range: DC to 20 GHz

Resistors: Tantalum Nitride

VSMR: 1.25:1 Typical

Terminal: Thin Film Metalstack, Au

Nominal Impedance: 50 Ohms

Substrate Material: AIN

Operating Temperature: -55°C to + 150°C

Inspection: 100% Per MIL-STD-883

Click here to go back to main table

HOW TO ORDER
AT

0603

T

05

E

CA

T

D

Product Designation
Case Size

Quantity
D = 1000
B = 500
7 = 100

See mechanical dimensions below

Power Rating
T = 1W

Packaging

Attenuation
Configuration

Termination

T = Tape & Reel: 7" Reel, 1000 pcs
C = Cap Pack, 100 pcs

E = All Terminations wrapped and patterned ground planned

CA = Non-Mag Gold

MECHAINCAL DIMENSIONS
Dimensions are in mils, Bottom View
24 ± 2

5 min

LEAD-FREE COMPATIBLECOMPONENT

25

31 ± 4For RoHS compliant products, please
select correct termination style

GND

46

30

Via to Ground

63 ± 430

20 ± 2

CLICK HERE TO
DOWNLOAD DATA FILES

53*Data files contain DXF, S2P, and HFSS files

Measured 5dB Attenuator on Microstrip Board
0-5-10
Loss [dB]

-15
-20
-25
-30
-35
-40

0

2

4

6

8

10
12
Frequency [GHz]Insertion Loss [S21]

14

16

18

20

Return Loss [S11]All testing performed on 13.3-mil-thick Rogers RO4350 microstrip board, with the UUT subtending a 44 mil gap in 30 mil-wide center trace (nominal 50-ohm characteristic
impedance). Measurements were made using a four-receiver architecture. Measurements have been de-embedded to the edges of the UUT using a standard TRL calibration
procedure.
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0001 | Rev 1– SPECIALTY THIN FILM PRODUCTS –19

Thin Film RF Solutions - Attenuator
AT0603T06ECATD - 6dB
QUALIFICATION TEST SUMMARY
Input Power CW: 1W

Tolerance (dB): D.C. to 10 GHz:±0.50 dB >10GHz: ±dB

Frequency Range: DC to 20 GHz

Resistors: Tantalum Nitride

VSMR: 1.25:1 Typical

Terminal: Thin Film Metalstack, Au

Nominal Impedance: 50 Ohms

Substrate Material: AIN

Operating Temperature: -55°C to + 150°C

Inspection: 100% Per MIL-STD-883

Click here to go back to main table

HOW TO ORDER
AT

0603

T

06

E

CA

T

D

Product Designation
Case Size

Quantity
D = 1000
B = 500
7 = 100

See mechanical dimensions below

Power Rating
T = 1W

Packaging

Attenuation
Configuration

Termination

T = Tape & Reel: 7" Reel, 1000 pcs
C = Cap Pack, 100 pcs

E = All Terminations wrapped and patterned ground planned

CA = Non-Mag Gold

MECHAINCAL DIMENSIONS
Dimensions are in mils, Bottom View
24 ± 2

5 min

LEAD-FREE COMPATIBLECOMPONENT

25

31 ± 4For RoHS compliant products, please
select correct termination style

GND

46

30

Via to Ground

63 ± 430

20 ± 2

CLICK HERE TO
DOWNLOAD DATA FILES

53*Data files contain DXF, S2P, and HFSS files

Measured 6dB Attenuator on Microstrip Board
0-5-10
Loss [dB]

-15
-20
-25
-30
-35
-40

0

2

4

6

8

10
12
Frequency [GHz]Insertion Loss [S21]

14

16

18

20

Return Loss [S11]All testing performed on 13.3-mil-thick Rogers RO4350 microstrip board, with the UUT subtending a 44 mil gap in 30 mil-wide center trace (nominal 50-ohm characteristic
impedance). Measurements were made using a four-receiver architecture. Measurements have been de-embedded to the edges of the UUT using a standard TRL calibration
procedure.

20

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0001 | Rev 1– SPECIALTY THIN FILM PRODUCTS –Thin Film RF Solutions - Attenuator
AT0603C07ECATD - 7dB
QUALIFICATION TEST SUMMARY
Input Power CW: 3/4W

Tolerance (dB): D.C. to 10 GHz:±0.50 dB >10GHz: ±dB

Frequency Range: DC to 20 GHz

Resistors: Tantalum Nitride

VSMR: 1.25:1 Typical

Terminal: Thin Film Metalstack, Au

Nominal Impedance: 50 Ohms

Substrate Material: AIN

Operating Temperature: -55°C to + 150°C

Inspection: 100% Per MIL-STD-883

Click here to go back to main table

HOW TO ORDER
AT

0603

C

07

E

CA

T

D

Product Designation
Case Size

Quantity
D = 1000
B = 500
7 = 100

See mechanical dimensions below

Power RatingC = 3/4W

Packaging

Attenuation
Configuration

Termination

T = Tape & Reel: 7" Reel, 1000 pcs
C = Cap Pack, 100 pcs

E = All Terminations wrapped and patterned ground planned

CA = Non-Mag Gold

MECHAINCAL DIMENSIONS
Dimensions are in mils, Bottom View
24 ± 2

5 min

LEAD-FREE COMPATIBLECOMPONENT

25

31 ± 4For RoHS compliant products, please
select correct termination style

GND

46

30

Via to Ground

63 ± 430

20 ± 2

CLICK HERE TO
DOWNLOAD DATA FILES

53*Data files contain DXF, S2P, and HFSS files

Measured 7dB Attenuator on Microstrip Board
0-5-10
Loss [dB]

-15
-20
-25
-30
-35
-40

0

2

4

6

8

10
12
Frequency [GHz]Insertion Loss [S21]

14

16

18

20

Return Loss [S11]All testing performed on 13.3-mil-thick Rogers RO4350 microstrip board, with the UUT subtending a 44 mil gap in 30 mil-wide center trace (nominal 50-ohm characteristic
impedance). Measurements were made using a four-receiver architecture. Measurements have been de-embedded to the edges of the UUT using a standard TRL calibration
procedure.
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0001 | Rev 1– SPECIALTY THIN FILM PRODUCTS –21

Thin Film RF Solutions - Attenuator
AT0603C08ECATD - 8dB
QUALIFICATION TEST SUMMARY
Input Power CW: 3/4W

Tolerance (dB): D.C. to 10 GHz:±0.50 dB >10GHz: ±dB

Frequency Range: DC to 20 GHz

Resistors: Tantalum Nitride

VSMR: 1.25:1 Typical

Terminal: Thin Film Metalstack, Au

Nominal Impedance: 50 Ohms

Substrate Material: AIN

Operating Temperature: -55°C to + 150°C

Inspection: 100% Per MIL-STD-883

Click here to go back to main table

HOW TO ORDER
AT

0603

C

08

E

CA

T

D

Product Designation
Case Size

Quantity
D = 1000
B = 500
7 = 100

See mechanical dimensions below

Power RatingC = 3/4W

Packaging

Attenuation
Configuration

Termination

T = Tape & Reel: 7" Reel, 1000 pcs
C = Cap Pack, 100 pcs

E = All Terminations wrapped and patterned ground planned

CA = Non-Mag Gold

MECHAINCAL DIMENSIONS
Dimensions are in mils, Bottom View
LEAD-FREE COMPATIBLECOMPONENT

24 ± 25 min

For RoHS compliant products, please
select correct termination style25

31 ± 4

GND

46

30

CLICK HERE TO
DOWNLOAD DATA FILES

Via to Ground

63 ± 430

20 ± 253*Data files contain DXF, S2P, and HFSS files

Measured 8dB Attenuator on Microstrip Board
0-5-10
Loss [dB]

-15
-20
-25
-30
-35
-40

0

2

4

6

8

10
12
Frequency [GHz]Insertion Loss [S21]

14

16

18

20

Return Loss [S11]All testing performed on 13.3-mil-thick Rogers RO4350 microstrip board, with the UUT subtending a 44 mil gap in 30 mil-wide center trace (nominal 50-ohm characteristic
impedance). Measurements were made using a four-receiver architecture. Measurements have been de-embedded to the edges of the UUT using a standard TRL calibration
procedure.

22

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0001 | Rev 1– SPECIALTY THIN FILM PRODUCTS –Thin Film RF Solutions - Attenuator
AT0603C09ECATD - 9dB
QUALIFICATION TEST SUMMARY
Input Power CW: 3/4W

Tolerance (dB): D.C. to 10 GHz:±0.50 dB >10GHz: ±dB

Frequency Range: DC to 20 GHz

Resistors: Tantalum Nitride

VSMR: 1.25:1 Typical

Terminal: Thin Film Metalstack, Au

Nominal Impedance: 50 Ohms

Substrate Material: AIN

Operating Temperature: -55°C to + 150°C

Inspection: 100% Per MIL-STD-883

Click here to go back to main table

HOW TO ORDER
AT

0603

C

09

E

CA

T

D

Product Designation
Case Size

Quantity
D = 1000
B = 500
7 = 100

See mechanical dimensions below

Power RatingC = 3/4W

Packaging

Attenuation
Configuration

Termination

T = Tape & Reel: 7" Reel, 1000 pcs
C = Cap Pack, 100 pcs

E = All Terminations wrapped and patterned ground planned

CA = Non-Mag Gold

MECHAINCAL DIMENSIONS
Dimensions are in mils, Bottom View
LEAD-FREE COMPATIBLECOMPONENT

24 ± 25 min

For RoHS compliant products, please
select correct termination style25

31 ± 4

GND

46

30

CLICK HERE TO
DOWNLOAD DATA FILES

Via to Ground

63 ± 430

20 ± 253*Data files contain DXF, S2P, and HFSS files

Measured 9dB Attenuator on Microstrip Board
0-5-10
Loss [dB]

-15
-20
-25
-30
-35
-40

0

2

4

6

8

10
12
Frequency [GHz]Insertion Loss [S21]

14

16

18

20

Return Loss [S11]All testing performed on 13.3-mil-thick Rogers RO4350 microstrip board, with the UUT subtending a 44 mil gap in 30 mil-wide center trace (nominal 50-ohm characteristic
impedance). Measurements were made using a four-receiver architecture. Measurements have been de-embedded to the edges of the UUT using a standard TRL calibration
procedure.
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0001 | Rev 1– SPECIALTY THIN FILM PRODUCTS –23

Thin Film RF Solutions - Attenuator
AT0603C10ECATD - 10dB
QUALIFICATION TEST SUMMARY
Input Power CW: 3/4W

Tolerance (dB): D.C. to 10 GHz:±0.50 dB >10GHz: ±dB

Frequency Range: DC to 20 GHz

Resistors: Tantalum Nitride

VSMR: 1.25:1 Typical

Terminal: Thin Film Metalstack, Au

Nominal Impedance: 50 Ohms

Substrate Material: AIN

Operating Temperature: -55°C to + 150°C

Inspection: 100% Per MIL-STD-883

Click here to go back to main table

HOW TO ORDER
AT

0603

C

10

E

CA

T

D

Product Designation
Case Size

Quantity
D = 1000
B = 500
7 = 100

See mechanical dimensions below

Power RatingC = 3/4W

Packaging

Attenuation
Configuration

Termination

T = Tape & Reel: 7" Reel, 1000 pcs
C = Cap Pack, 100 pcs

E = All Terminations wrapped and patterned ground planned

CA = Non-Mag Gold

MECHAINCAL DIMENSIONS
Dimensions are in mils, Bottom View
24 ± 2

5 min

LEAD-FREE COMPATIBLECOMPONENT

25

31 ± 4For RoHS compliant products, please
select correct termination style

GND

46

30

Via to Ground

63 ± 430

20 ± 2

CLICK HERE TO
DOWNLOAD DATA FILES

53*Data files contain DXF, S2P, and HFSS files

TDS-STFP-0001 | Rev 1

Measured 10dB Attenuator on Microstrip Board
0-5-10
Loss [dB]

-15
-20
-25
-30
-35
-40

0

2

4

6

8

10
12
Frequency [GHz]Insertion Loss [S21]

14

16

18

20

Return Loss [S11]All testing performed on 13.3-mil-thick Rogers RO4350 microstrip board, with the UUT subtending a 44 mil gap in 30 mil-wide center trace (nominal 50-ohm characteristic
impedance). Measurements were made using a four-receiver architecture. Measurements have been de-embedded to the edges of the UUT using a standard TRL calibration
procedure.

24

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0001 | Rev 1– SPECIALTY THIN FILM PRODUCTS –Q Bridge Thermal Conductor
GENERAL DESCRIPTION
Kyocera AVX’s new Q-Bridge Thermal Conductor is manufactured with the highest quality materials for reliable
and repeatable performance providing a cost effective thermal management solution. These devices areconstructed with Aluminum Nitride (AlN) or Beryllium Oxide (BeO) and are available in standard EIA form factors.
Q-Bridge provides the designer with the ability to manage thermal conditions by directing heat to a thermal
ground plane, heat sink or any other specific thermal point of interest. The inherently low capacitance makes
this device virtually transparent at RF/microwave frequencies. This device has the added benefit of offering
additional layers of protection to adjacent components from hot spot thermal loads.
Q-Bridge provides the benefit of increased overall circuit reliability. Kyocera AVX’s Q-Bridge is manufactured
using one-piece construction, providing a RoHS compliant SMT package that is fully compatible with high speed
automated pick-andplace processing. It is available in multiple different EIA case sizes. Custom configurations
are also available

APPLICATIONSFEATURESFUNCTIONAL APPLICATIONS

•
•
•
•
•
•

•
•
•
•
•
•

•
•
•
•
•

High Thermal Conductivity
Low Thermal Resistance
Low Capacitance
Increases Circuit Reliability
RoHS Compliant
More efficient thermal
management

HOW TO ORDERGaN Power AmplifiersHigh RF Power Amplifiers
Filters
Synthesizers
Industrial Computers
Switch Mode Power
Supplies• Pin & Laser Diodes

QB

0603

A

25

W

Between active device and adjacent ground planes
Specific contact pad to caseContact pad to contact pad
Direct component contact to via pad or trace
Edges fully metalizedY

TQ-Bridge

Packaging

Case Size

T = 1000pcs., 7" reelT\500 = 500pcs., 7" reelC = Matrix Tray

Please see 'Case Size' Column of
Typical Characteristics Table Below

Termination

Substrate
A = AIN
B = BeO

Thickness(mils)TDS-STFP-0001 | Rev 1
The above part number refers to a Q-Bridge, (EIA case size 0603), Aluminum Nitride Substrate,
Thickness 25 mils., Style W, Y Termination (Silver Platinum Non-Magnetic Termination),with Tape and Reel Packaging.

Y = Silver Platinum,
Non-Magnetic Termination
S = Silver over Magnetic Termination
J* = 60Sn/40Pb Solder Plated over Nickel over
Silver Platinum
T = Tin plated over Nickel over Silver Platinum* Not RoHS Compliant Consult factory for other termination
options e.g., tin plate and solder plate

Style
W = Edge Wrap
E = No WrapTERMINATION MATERIALS
Termination CodeTermination Materials

T

Tin plated over Nickel over Silver Platinum

RoHS Compliant

Y

Silver Platinum Non-Magnetic Termination

RoHS Compliant

S

Silver over Magnetic Termination

RoHS Compliant

J

Solder Plated over Nickel over Silver Platinum

Not RoHS Compliant

Note: Non-edge wrapped style in all case sizes is supplied with S termination
Edge wrapped style in case sizes 0302 through 1111 is supplied with S termination
Edge wrapped style in case sizes 2010 through 3737 are supplied with S termination

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0008 | Rev 1– SPECIALTY THIN FILM PRODUCTS –25

Q Bridge Thermal Conductor
TYPICAL CHARACTERISTICS Inches (mm)
Case
Size

Length (L)Width (W)Thickness(T)

Terminal(t)

0302.030 ± .002(.77 ± .051).020 ± .002
0.02
(0.51 ± .051) (0.51 ± .05)

0.01
(0.25)

0402.040 ± .002 .020 ± .002
0.02
(1.02 ± .051) (0.51 ± .051) (0.51 ± .05)

0.01
(0.25)

0505.050 ± .002 .050 ± .002
25
(1.27 ± .051) (1.27 ± .051) (0.64 ± .05)

0.015
(0.38)

0603.060 ± .002
(1.52 ± .051)

0.025(0.64 ± .05)

0.015
(0.38)

0805.080 ± .002 .050 ± .002
0.04
(2.03 ± .051) (1.27 ± .051) (1.02 ± .05)

0.02
(0.51)

1005.100 ± .002
.050 ± .002
0.04
(2.54 ± .051) (1.27 ± .051) (1.02 ± .05)

0.02
(0.51)

1020.100 ± .002
.200 ± .002
0.04
(2.54 ± .051) (5.08 ± .051) (1.02 ± .05)

0.02
(0.51)

1111.110 ± .002
.110 ± .002
0.04
(2.79 ± .051) (2.79 ± .051) (1.02 ± .05)

0.02
(0.51).030 ± .002(.77 ± .051)

2010.195 ± .010
.095 ± .010
0.06
(4.95 ± .254) (2.41 ± .254) (1.52 ± .05)

0.03
(0.77)

2525.240 ± .010
.250 ± .010
0.06
(6.10 ± .254) (6.35 ± .254) (1.52 ± .05)

0.04
(1.02)

3725.370 ± .010.245± .010
0.06
(9.40 ± .254) (6.22 ± .254) (1.52 ± .05)

0.05
(1.27)

3737.365 ± .010
.375 ± .010
0.06
(9.27 ± .254) (9.53 ± .254) (1.52 ± .05)

0.05
(1.27)

VoltageRating(V)
100

Thermal Resistance(°C/W)
AIN
19

200

25

250

10

250

20

250

10

500

13

500

3

500

7

2000
3000
4000
4000

10
4
6
4

Thermal Conductivity(mW/°C)

BeO

AIN

12

53

16

40

7

100

13

50

7

100

8

77

2

320

4

153

6

100

3

240

4

160

3

240

BeO
81
61
153
76
153
122
508
240
159
380
254
380

Available
Configurations
Style

Termination

W

Y, T, JE

S

W

Y, T, JE

S

W

Y, T, JE

S

W

Y, T, JE

S

W

Y, T, JE

S

W

Y, T, JE

S

W

Y, T, JE

S

W

Y, T, J

E

S

W

S

E

S

W

S

E

S

W

S

E

S

W

S

E

S

Note: Thermal conductivity is normalized to chip size. All values are approximate. Consult factory for extended thermal conductivity options.

CAPACITANCE
Case Size

0302

0402

0505

0603

0805

1005

26

MECHANICAL CONFIGURATIONSPart Number

Capacitance (pF)

Case Size

Part Number

Capacitance
(pF)
0.204

QB0302A20WY/T/J

0.039

QB1020A40WY/T/J

QB0302A20ES

0.011

QB1020A40ES

0.121

QB0302B20WY/T/J

0.028

QB1020B40WY/T/J

0.158

QB0302B20ES

0.006

QB1020B40ES

0.092

QB0402A20WY/T/J

0.028

QB1111A40WY/T/J

0.096

QB0402A20ES

0.018

QB1111A40ES

0.042

QB0402B20WY/T/J

0.025

QB0402B20ES

0.009

1020

1111

QB1111B40WY/T/J

0.078

QB1111B40ES

0.031

QB0505A20WY/T/J

0.070

QB2010A60WS

0.070

QB0505A20ES

0.032

QB2010A60ES

0.042

QB0505B20WY/T/J

0.061

QB0505B20ES

0.027

2010

QB2010B60WS

0.055

QB2010B60ES

0.086
0.156

QB0603A25/WY/T/J

0.035

QB2525A60WS

QB0603A25ES

0.007

QB2525A60ES

0.114

QB0603B25WY/T/J

0.029

QB2525B60WS

0.122
0.075

2525

QB0603B25ES

0.007

QB2525B60ES

QB0805A40WY/T/J

0.081

QB3725A60WS

0.105

QB0805A40ES

0.018

QB3725A60ES

0.076

QB0805B40WY/T/J

0.055

QB3725B60WS

0.080

QB0805B40ES

0.015

QB3725B60ES

0.058

QB1005A40WY/T/J

0.046

QB3737A60W

0.164

QB1005A40ES

0.008

QB3737A60ES

0.130

QB1005B40WY/T/J

0.038

QB1005B40ES

0.007

3725

3737

QB3737B60WS

0.126

QB3737B60ES

0.099

Partial Wrap

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0008 | Rev 1– SPECIALTY THIN FILM PRODUCTS –Q Bridge Thermal Conductor
RECOMMENDED Q BRIDGE SIZINGFor optimal results in power handling we recommend using a Q Bridge that matches the component footprint that you are attempting to pull heat away from fora standard surface mount component. For a device that has pins that you are attempting to remove heat from, the suggested Q Bridge would match the widthof the Q Bridge with the length of the pad for those pins.

MEASURED Q BRIDGE PERFORMANCESUGGESTED FOOTPRINT

Change in Power of an off the shelf 2010 size 1k ohm Resistor with
Q Bridge
1.75
1.5Power (W)

1.25
1Length is 2x Width Q Bridge
0.75

No Q Bridge
No Qbridge Heat Pad

0.5
0.25
0

25

35

45

55

65

75

85

95

105

115

125

Temperature (°C)

Test performed at room temperature (25C) with resistor mounted on test board as baseline, using
a metal pad heat sync of the same board space required for a Q Bridge, and the Q Bridge thatmatches the footprint of the resistor itself

Resistor without any added heatremoval, power output 841mW

Resistor with added metal heatsync, power output 841mW

Resistor with added 2010 Q
Bridge, power output 841mW

Case Size

A Min.

B Min.

C Min.

D Min.

0302

0.0216(0.55)

0.02(0.51)

0.01(0.25)

0.05(1.27)

0402

0.0216(0.55)

0.02(0.51)

0505

0.0512(1.3)

0.0275
(0.7)

0.02
(0.5)

0.075
(1.9)

0603

0.0315(0.8)

0.0275(0.7)

0.0275(0.7)

0.0825(2.1)

0805

0.0512
(1.3)

0.039
(1)

0.039
(1)

0.118
(3)

1005

0.0512
(1.3)

0.039
(1)

0.059
(1.5)

0.138
(3.5)

1020

0.212
(5.4)

0.039
(1)

0.059
(1.5)

0.138
(3.5)

1111

0.118
(3)

0.039
(1)

0.063
(1.6)

0.142
(3.6)

2010

0.118
(3)

0.059
(1.5)

0.126
(3.2)

0.244
(6.2)

2525

0.252
(6.4)

0.079
(2)

0.15
(3.81)

0.3075(7.81)

3725

0.252
(6.4)

0.1
(2.54)

0.266(6.75)

0.466(11.83)

3737

0.386
(9.8)

0.1
(2.54)

0.266(6.75)

0.466(11.83)0.01970.06
Dimensions
inches.
(0.50) are in(1.52)

Recommend max filled via density for your board in the pad of
the Q Bridge going to ground/heat sync

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0008 | Rev 1– SPECIALTY THIN FILM PRODUCTS –27

Gain Equalizer - RC Network
GENERAL DESCRIPTION
These ruggedly constructed, ultraminiature (EIA 0402, 1005 metric) equalizers combine high-performancetantalum nitride resistive elements and silicon/oxygen/nitrogen capacitive elements with KYOCERA AVX’s
proprietary, glass-sandwich FLEXITERM® surface-mount technology, which provides an extra measure ofprotection against flexure damage during installation. The new GEQ Series equalizers are also manufactured with
100% laser trimming to achieve tight tolerances and offer a low 0.5mm profile, a 125mW power rating, resistancevalues spanning 10–50Ω, and capacitance values extending from 1–50pF.
Rated for a wide range of operating temperatures (-55ºC to +125ºC) and compliant with RoHS, ideal applications
for the series extend across the optoelectronic, telecommunications, broadband, military, electronic warfare,space, test, and instrumentation markets and include optical transceiver modules, broadband receivers, andtransmission and receiver optical subassemblies (TOSA and ROSA).

FEATURESAPPLICATIONSMARKETS

•
•
•
•
•
•
•
•

• Optical Transceiver Modules• Broadband Receiver• TOSA / ROSA

•
•
•
•
•

EIA 0402 Case Size
Resistance Range: 10 to 50 Ω typ.
Capacitance Range: 1 to 50 pF typ.
Parallel Configurations
Power Rating: 125 mW
Operating Temperature: -55°C to +125°C
Laser Trimmed Resistors
RoHS Compliant

Opto-electronics
Telecom
Broadband Jamming for EW
Military
Instrumentation and Test

*For other RC Combinations and EIA Sizes contact factory

CLICK HERE TO
DOWNLOAD DATA FILES

HOW TO ORDER

RCN

25R0

F

05R0

J

T

SeriesResistance
Value (Ω)

ResistanceTolerance

Capacitance
Value (pF)

CapacitanceTolerance

Terminations

Packaging

T = NiSn Plated

TR = Tape & Reel

3 significant digits
R = decimal point

F = 1%

3 significant digits
R= decimal point

J* = 5%
K* = 10%
M* =20%0402

TR*Minimum tolerance =+/- 0.1pF

EQUALIZER GAIN SLOPE TABLE
Part Number

Starting Frequency(Typical)(GHz)

RCN25R0F00R5MTTR
RCN25R0F01R0MTTR
RCN25R0F02R0MTTR
RCN25R0F03R0MTTR
RCN25R0F04R0MTTR
RCN25R0F05R0MTTR
RCN25R0F06R0MTTR
RCN25R0F10R0MTTR

5
0
0
0
0
0
0
0

28

Loss at Starting
Frequency(Typical)
(dB)
-1.5
-1.8
-1.8
-1.8
-1.8
-1.8
-1.8
-1.8

End Frequency(Typical)
(GHz)
16
12
10
7
6
5
4.5
3.5

Loss at End
Frequency(Typical)
(dB)
-0.2
-0.15
-0.15
-0.15
-0.15
-0.15
-0.15
-0.15

Bandwidth(Typical)
(GHz)

Gain
(Typical)
(dB)

11
12
10
7
6
5
4.5
3.5

1.3
1.65
1.65
1.65
1.65
1.65
1.65
1.65

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0005 | Rev 1– SPECIALTY THIN FILM PRODUCTS –Gain Equalizer - RC Network

Tested on Rogers material microstrip board with an Agilent VNA.

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0005 | Rev 1– SPECIALTY THIN FILM PRODUCTS –29

Gain Equalizer - RC Network
SPECIFICATIONSRESISTOR MATERIAL

Package Size: EIA 0402

Thin Film Resistors

Design: Glass wafer sandwich

TaN

Typical Sheet Resistivity (ohm/sq)

10 to 100

Termination: NiSn plated

TCR (ppm/°C, -25 to 125°C)-100 to -150

Power Rating: 125 mW

Stability (Change after 1000 hours @ 125°C)

1.0%

Operating Temperature Range: -55°C to +125°C
Tolerance: Resistor: 1-5%, Capacitor: 5-20%

CAPACITOR MATERIAL

Resistance Range: 10 to 50 Ω (typical)

Material

Capacitance Range: 1 to 50 pF (typical)

pF/mm Typical

DIMENSIONS

SiON
50 to 100

BDV (v/μm)

600

DF

≤0.1%

TCC (ppm/°C, -25 to 125°C)±60

ENVIRONMENTAL TESTS
Reliability Test
Life Test
85/85
Temp./ Humidity Breakdown
Thermal Cycle
Termination Strength

Size (EIA)

Length (L)Width (W)Thickness (T)Termination (t)0402

1.02 ± 0.051(0.040 ± 0.002)

0.51 ± 0.051(0.020 ± 0.002)

0.50 ±0.10(.020 ±.004)

0.25 ± 0.051(0.010 ± 0.002)

Criteria
1000 Hrs. @ 125°C @ 50 mW
1080 Hrs. @ 50 mW
100 cycles @ -40 to 125°C
200 g for 50 seconds(Dage Tester)x

SUGGESTED MOUNTING PAD DIMENSIONSNormal Pads
W = Chip Width

L = Chip Length

T = Chip Thickness

Case Size

A Min.

B Min.

C Min.

D Min.

0402

0.02130.01250.0206

0.0436

Dimensions are in inches.

NOTES:
Mounting will allow the solder fillet to travel up approximately 0.015" of the chip's end and side termination surface. Heavier fillets require a predeposition ofsolder paste and or an increase in pad dimensions. Typical solder paste application is a .008" to 0.01" thickness with >50% of volume in solder alloy. Can bemounted in both vertical and horizontal orientation without changing electrical performance

30

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0005 | Rev 1– SPECIALTY THIN FILM PRODUCTS –Gain Equalizer - RC Network
POWER DERATINGPower Derating Curve
Rated Power [mW]

150
100
50
0

-50

0

50
100
Ambient Temperature [°C]150

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0005 | Rev 1– SPECIALTY THIN FILM PRODUCTS –31

Transmission Line MIM Capacitor(Metal-Insulator-Metal)
GENERAL DESCRIPTION
Thin Film Technologies is pleased to introduce a novel MIM (Metal-Insulator-Metal) capacitor using atransmission line wire bond pad structure with backside ground.
The TL MIM can be supplied on quartz, alumina, glass and other substrates to minimize losses. Copper traces
are used for optimal conductivity. Front and backside gold metalization make this device suitable epoxy, gold
wire bond/ribbon bond attachments.

BENEFITSAPPLICATIONS

•
•
•
•
•

• DC Blocking at UHF• High Frequency Link
• RF Microwave applications

HFSS Design Unique for every device
Gold Wirebondable
Copper Conductor Design for improved Circuit Conductivity
Designs Optimized for RF/Performance
ROHS Compliant

SUBSTRATE MATERIALSCAPACITOR MATERIALS• Alumina (Al2O3)• Quartz

Rated Voltage

Specific CapacitanceDissipation Factor

TCC (ppm/°C)<100

50 - 100 * pf/mm2

<0.1%

±60

*Actual maximum capacitance values depend on transmission line dimensions

MECHANICAL DIMENSIONS
Based on Transmission Line Design Request

TEST METHODSW

MIL-STD-883-2011.10

BOND STRENGTH> 3 gm min. w/0.001” Au Wire

MIL-STD-883-2019.10

SHEAR STRENGTH

Size Dependent See Procedure

MIL-STD-202-108

LIFE1000 hrs @ 125°C

Specification

Limit

L
Length is determined by transmission line

HOW TO ORDER

MV

04

SeriesCode

Substrate
LengthMV = TL MIM

in tensof mils

32

02

C

Substrate Breakdown
VoltageWidthin tens ofmils

C = 100 BDV

A

150

M

Q

A

W

Standard
Impedance

Capacitance

CapacitanceTolerance

Substrate

Substrate
Thickness(mils)

PackagingA = 50Ω
X = Other
Contact
Factory

capacitancecode in pF
First two digits =significant figures
or R for decimal place.
Third digit - number ofzero or after “R”
significant figures.

M = ± 20%

A = Alumina
Q = Quartz
X = Other

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0003 | Rev 1– SPECIALTY THIN FILM PRODUCTS –A = 5 mils
B = 10 mils
C = 15 mils
X = Contact
Factory

W = antistatic waffle
pack
T = tested,
undiced
D = Tested
and diced
on tapeTransmission Line MIM Capacitor(Metal-Insulator-Metal)
GENERAL CHARACTERISTICS
CHARACTERISTICDESIGN DEPENDENTCapacitor Range

0.3 - 15 pF (typical)

Tolerance± 20%

Backing

Gold Metalization

Termination TypeGold Wire Bond

STANDARD
Part Number

Substrate

Length (mils)

Width (mils)

Thickness (mils)

Cap Value (pF)

MV0402CA1R0MQAW

Quartz

40

20

5

1

MV0404CA1R0MQAW

Quartz

40

40

5

1

MV0402CA5R0MQAW

Quartz

40

20

5

5

MV0404CA5R0MQAW

Quartz

40

40

5

5

MV0404CA150MQAW

Quartz

40

40

5

15

MV0402CA150MAAW

Alumina

40

20

5

15

MV0404CA150MABW

Alumina

40

40

10

15

MV0304CA150MABW

Alumina

30

40

10

15

MV0804CA150MABW

Alumina

80

40

10

15

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0003 | Rev 1– SPECIALTY THIN FILM PRODUCTS –33

Transmission Line MIM Capacitor(Metal-Insulator-Metal)
0

0

-0.7

-5

Equivalent Circuit

-1.4

-10

Port 1
20-50

-2.1

TL1
Z=39.3 69
L=1.27C1
C=0.117pfR¹

ESR=0.400

ESL
L=0.015Z

TL2P=50.493
L=29.538”

ort 2
20-50

-20

Substrate: Al203
Size: 1mm x 0.5mm x 0.125mm
Capacitance: 8pF

-3.5

-4.2

-25

-30

-4.9

-35

-5.6

-40

-6.3

-45

-7
100

4090

8080

12070

s21

16060
s11

20060

Frequency (MHz)s11, s11 Eq Circ (dB)s21, s21 Eq. Circ (dB)

-2.8

-15

24040

28030

32020

s21 Eq. Circ

36010

-50
40000

s11 Eq. Circ

0

0

-0.4

-5

Equivalent Circuit

-0.8

-10

Port 1
20-50

-15

-1.2
TL1
Z=39.3 69
L=1.27¹

C1
C=0.117pf

ESR
R=0.400

ESL
L=0.015Z

TL2P=50.493
L=29.538”

ort 2
20-50

-20

Substrate: AI 0
Size: 2mm x 0.5mm x 0.125mm
Capacitance: 15 pF

-2

-2.4

-30

-2.8

-35

-3.2

-40

-3.6

-45

-4

1004

090

s21

34

-25

8080

12070

16060

s11

20060

Frequency (MHz)

24040

28030

s21 Eq. Circ

3202036010

s11 Eq. CircThe Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0003 | Rev 1– SPECIALTY THIN FILM PRODUCTS –

-50
40000

s11, s11 Eq Circ (dB)s21, s21 Eq. Circ (dB)

-1.6

Transmission Line MIM Capacitor(Metal-Insulator-Metal)
0

0

-0.4

Equivalent Circuit

-0.8

-5

-12
Port 1
20-50

TL1
Z=39.3 69
L=1.27

ESR
R=0.400

ESL
L=0.015

TL2
Z=50.493
L=29.538”

Port 2
20-50

-18

-1.6

-24

-2

-30

-2.4

-36

-2.8

-42

Substrate: AI 0
Size: 8.12mm x 1mm x 0.25mm
Capacitance: 15 pF

-3.2

-3.6

-4

100

4090

s21

8080

12070

16060

s11

20060

Frequency (MHz)

24040

28030

s21 Eq. Circ

32020

36010

– SPECIALTY THIN FILM PRODUCTS –

-48

-54

-60
40000

s11 Eq. CircThe Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0003 | Rev 1

s11, s11 Eq Circ (dB)s21, s21 Eq. Circ (dB)C1
C=0.117pf

¹

-1.2

35

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