High Power Resistive Products

021623

IMPORTANT INFORMATION/DISCLAIMER
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet or
made available on the website are subject to change. The customer is responsible for checking and verifying
the extent to which the Information contained in this publication is applicable to an order at the time the order isplaced. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee,
warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KYOCERA AVX’s knowledge of typical operating
conditions for such applications, but are not intended to constitute and KYOCERA AVX specifically disclaims
any warranty concerning suitability for a specific customer application or use.
ANY USE OF PRODUCT OUTSIDE OF SPECIFICATIONS OR ANY STORAGE OR INSTALLATIONINCONSISTENT WITH PRODUCT GUIDANCE VOIDS ANY WARRANTY.
The Information is intended for use only by customers who have the requisite experience and capability todetermine the correct products for their application. Any technical advice inferred from this Information orotherwise provided by KYOCERA AVX with reference to the use of KYOCERA AVX’s products is given without
regard, and KYOCERA AVX assumes no obligation or liability for the advice given or results obtained.
Although KYOCERA AVX designs and manufactures its products to the most stringent quality and safety
standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer
applications which require a high degree of reliability or safety should employ suitable designs or othersafeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of anelectrical component does not result in a risk of personal injury or property damage.
Unless specifically agreed to in writing, KYOCERA AVX has not tested or certified its products, services ordeliverables for use in high risk applications including medical life support, medical device, direct physicalpatient contact, water treatment, nuclear facilities, weapon systems, mass and air transportation control,
flammable environments, or any other potentially life critical uses. Customer understands and agrees that
KYOCERA AVX makes no assurances that the products, services or deliverables are suitable for any highrisk uses. Under no circumstances does KYOCERA AVX warrant or guarantee suitability for any customer
design or manufacturing process.

Although all product–related warnings, cautions and notes must be observed, the customer should not assume
that all safety measures are indicted or that other measures may not be required.

121319– high power resistive products –High Power Resistive Products
Table of Contents
FA1 STYLE............................................................................................................................................................................................................................................... 1
RESISTORS............................................................................................................................................................................................................................................. 5
FLANGE MOUNT TERMINATIONS...............................................................................................................................................................................................12
CHIP RESISTORS – CR1 STYLE................................................................................................................................................................................................... 27
SURFACE MOUNT CHIP RESISTORS – CS1 AND CW STYLE........................................................................................................................................... 28
LEADED CHIP RESISTORS – LR1 STYLE. ................................................................................................................................................................................ 30
CZ1 STYLE ........................................................................................................................................................................................................................................... 31
CT1 STYLE............................................................................................................................................................................................................................................ 33
LT1 STYLE ............................................................................................................................................................................................................................................ 34
JUMPERS.............................................................................................................................................................................................................................................. 35
RESISTIVE PRODUCTS DESIGN KITS. ...................................................................................................................................................................................... 36
RESISTIVE PRODUCTS TAPE AND REEL SPECIFICATIONS............................................................................................................................................ 37
RESISTORS AND TERMINATIONS: MOUNTING AND ATTACHMENT RECOMMENDATIONS............................................................................ 38
RESISTORS AND TERMINATIONS: ENGINEERING GUIDELINES................................................................................................................................... 42

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

– high power resistive products –High Power Resistive Products
FA1 Style
GENERAL INFORMATION
•
•
•
•
•
•
•
•
•
•

Frequency Range: DC to 3 GHz
Input Power*: 150 Watts
Operating Temp Range: -55 to +150°C
Attenuation Stability**: 0.0001 dB/dB/°C, Max.
Mounting Flange: Copper, Pd over Ni; other platings available
Resistive Elements: Tantalum Nitride
Substrate Material: Aluminum Nitride
Tabs: 99.99% Pure Silver, .004 inches thick, Cover: Alumina
RoHS Compliant
Reliability: MIL-PRF-55342.975 (24.77 mm).725 MIN. (18.4 mm).400 (10.16 mm).225 MAX.
(5.76 mm).125
(3.18 mm).125
(3.18 mm)

.188
(4.76 mm).375
(9.53 mm).125 THRU(3.18 mm).170
(4.32 mm).290 TYP.
(7.36 mm).040 TYP.
(1.02 mm).004(.101 mm).305 ± .005
(7.75 mm ±.127 mm).250 TYP.
(6.35 mm).670 (17.02 mm)

Part Number

NominalAttenuation (dB)Frequency
Sensitivity (dB, max.)

Maximum Deviationfrom Nominal (dB)

VSWR
(max.)

FA10975P01DBFBK

1± 0.25+0.45 / -0.15

1.55:1

FA10975P02DBFBK
FA10975P03DBFBK
FA10975P06DBFBK
FA10975P09DBFBK
FA10975P10DBFBK
FA10975P17DBFBK

2
3
6
9
10
17

±0.30
± 0.30± 0.45± 0.35± 0.20± 1.00+0.50 / -0.30+0.60 / -0.30+0.80 / -0.20+0.70 / -0.20+0.40 / -0.30+1.00 / -1.20

1.50:1
1.50:1
1.40:1
1.30:1
1.40:1
1.30:1

FA10975P20DBFBK

20± 1.00+1.00 / -1.20

1.30:1

FA10975P30DBFBK

30± 1.05+1.75 / -1.20

1.25:1

FA1

0300

N

0100

J

BK

Case Style

Packaging

Case Size

BK = Plastic Carrier

Tolerance

Termination

Code
Tol.

*G ±2% available - Consult Factory

Value

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
012219– high power resistive products –

J
±5%

1

High Power Resistive Products
FA1 StyleAttenuator Power Handling vs. Mounting Surface Temperature
350

Notes:
1. Plot refers to incident continuous power of “P” Watts
2. Mounting surface is assumed an isotherm at TM °C
3. Actual testing done at P = 100 Watts, TM = 100 °C
4. Plot based on 1-dimensional heat transfer formula: T = TM + PR, where
T = area-average resistive film temperature, held to 150 °C, max.
R = thermal resistance, mounting surface to resistive film ≈ 0.5 °C/W
for 30- and 20- dB devices (other values will run cooler and therefore
handle more power – consult factory)

300

Power Handling (Watts)

250
200
150
100
50
0
0

25

50

75

100

125

Mounting Surface Temperature (°C)

2

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
031521– high power resistive products –150

High Power Resistive Products
Leaded Chip Attenuators – LA1 Style
GENERAL SPECIFICATIONS
•
•
•
•
•
•
•
•
•

Frequency Range: DC to 3 GHz
Input Power*: 150 Watts
Operating Temp Range: -55ºC to +150ºC
Attenuation Stability**: 0.0001 dB/dB/ºC,
Max. Resistive Elements: Tantalum Nitride
Substrate Material: Aluminum Nitride
Tabs: 99.99% Pure Silver, 0.10 (0.004) thick
Cover: Alumina
RoHS Compliant
Mechanical Tolerance: ±0.25 (0.010)
unless otherwise specified

1.02 (0.040)
2.03 MAX.
(0.800)10.16(0.400)6.35 TYP.
(0.250)9.53(0.375)1.02 TYP.
(0.040)0.10 (0.004)

Part Number

NominalAttenuation (dB)Frequency Sensitivity(dB, max.)

Maximum Deviationfrom Nominal (dB)

VSWR
(max.)

LA13740P01DBFBK

1± 0.20+0.45 / -0.15

1.55

LA13740P02DBFBK

2± 0.300.50 / -0.30

1.50

LA13740P03DBFBK3± 0.300.60 / -0.30

1.50

LA13740P06DBFBK

6± 0.30+0.60 / -0.20

1.30

LA13740P09DBFBK

9± 0.30+0.60 / -0.20

1.30

LA13740P10DBFBK

10± 0.20+0.40 / -0.30

1.25

LA13740P17DBFBK

17± 1.00+1.00 / -1.20

1.30

LA13740P20DBFBK

20± 1.00+1.00 / -1.20

1.25

LA13740P30DBFBK

30± 1.05+1.75 / -1.20

1.25

02DB

F

HOW TO ORDER

LA1

3740

P

BK

Case Style

Packaging

Case Size

BK = Plastic Carrier

Tolerance

Termination

Code
Tol.

Value

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
031521– high power resistive products –

F
±1%

3

High Power Resistive Products
Leaded Chip Attenuators – LA1 Style

Attenuator Power Handling vs. Mounting Surface Temperature
350

Notes:
1. Plot refers to incident continuous power of “P” Watts
2. Mounting surface is assumed an isotherm at TM °C
3. Actual testing done at P = 100 Watts, TM = 100 °C
4. Plot based on 1-dimensional heat transfer formula: T = TM + PR, where
T = area-average resistive film temperature, held to 150 °C, max.
R = thermal resistance, mounting surface to resistive film ≈ 0.5 °C/W
for 30- and 20- dB devices (other values will run cooler and therefore
handle more power – consult factory)

300

Power Handling (Watts)

250
200
150
100
50
0
0

25

50

75

100

125

Mounting Surface Temperature (°C)

4

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
031521– high power resistive products –150

High Power Resistive Products
Resistors
KYOCERA AVX introduces its line of High Power Resistive Products. All
products are designed and manufactured at our ISO 9001 Facilities.

ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•

Resistance: 50 and 100 Ω standard (10 Ω - 200 Ω available)
Resistance Tolerance: ±5% standard (±2% available)
Power: 4 Watts through 250 Watts
Operating Temperature Range: -55˚C - +150˚C
Temperature Coefficient: < 150 ppm/˚C
Low Capacitance

MECHANICAL SPECIFICATIONS
•
•
•
•
•
•
•
•
•
•

Package: Surface Mount Chips, Chips, Leaded Chips, Flanged
Substrate Material: Aluminum Nitride
Process: Thin Film
Resistive Material: Tantalum
Terminals: Silver
Cover: Alumina
Mounting Flange: 100% Cu, Ni or Ag Plated
Mechanical Tolerance: ±.005
SMT and Chip products, supplied on Tape and Reel
Non-Magnetic(exception CS and CW Style Surface Mount Resistors)• Lead-Free, RoHS Compliant

HOW TO ORDER

FR1

0300

N

0100

J

BK

Case Style

Packaging

Case Size

BK = Plastic Carrier

Tolerance

Termination

Code
Tol.

Value

J
±5%

*G ±2% available - Consult Factory

POWER DERATINGPower Dissipation

100%
80
60

Rated Safe Operating Range

40
20
0

-50˚C

-25˚C

0˚C

+25˚C

+50˚C

75˚C

100˚C

125˚C

150˚C

Heat Sink Temperature (°C)

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
111521– high power resistive products –5

High Power Resistive Products
Flange Mount Resistors
P/N: FR10300NXXXXJELECTRICAL SPECIFICATIONS
•
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•
•
•
•
•
•
•

Resistance: 100 Ω standard (other Ω values available)
Resistive Tolerance: ±5% standard (±2% available)
Power: 20 Watts
Capacitance: 1.0 pF
Operating Temperature Range: -55˚C to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant
Non-Magnetic available

1.57 (0.062)

3.81 MAX.
(0.150)7.62(0.300)5.08 (0.200)
2.54 (0.100)

5.08 (0.200)
2.54 (0.100)
3.18 THRU(0.125)2.59 TYP.
(0.102)

6.35 (0.250) TYP.

0.10 (0.004)
1.02 TYP.
(0.040)0.76 TYP.
(0.030)mm (inches)

P/N: FR10302NXXXXJELECTRICAL SPECIFICATIONS
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•
•
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•
•
•

Resistance: 100 Ω standard (other Ω values available)
Resistive Tolerance: ±5% standard (±2% available)
Power: 20 Watts
Capacitance: 1.0pF
Operating Temperature Range: -55 to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant
Non-Magnetic available
1.57 (0.062)

3.81 MAX.
(0.150)3.18 TYP.
(0.125)

2.54 (0.100)

7.62(0.300)2.54 (0.100)

2.54 (0.100)

2.59 (0.102)

0.635 TYP.
(0.025)0.10 (0.004)

6.35 TYP.
(0.250)4.95 MIN.
(0.195)mm (inches)

6

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
031221– high power resistive products –High Power Resistive Products
Flange Mount Resistors
P/N: FR10500NXXXXJELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•
•

Resistance: 100 Ω standard (other Ω values available)
Resistive Tolerance: ±5% standard (±2% available)
Power: 25 Watts
Capacitance: 1.0pF
Operating Temperature Range: -55 to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant
Non-Magnetic available
12.70 (0.500)

3.81 MAX.
(0.150)5.08 MIN.
(0.200)1.57 (0.062)

2.54 (0.100)

5.08(0.200)2.54 (0.100)
3.18 THRU(0.125)2.59 (0.102)010 (0.004)

6.35 TYP. (0.250)
0.76 TYP.
(0.030)1.02 TYP.
(0.040)mm (inches)

P/N: FR10515NXXXXJELECTRICAL SPECIFICATIONS
•
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•
•
•
•
•
•

Resistance: 100 Ω standard (other Ω values available)
Resistive Tolerance: ±5% standard (±2% available)
Power: 60 Watts
Capacitance: 2.0 pF
Operating Temperature Range: -55˚C to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant
Non-Magnetic available
1.57 (0.062)

3.81 MAX.
(0.150)6.35 MIN.
(0.250)13.1 (0.515)

3.18 (0.125)

6.35 (0.250)

3.18 (0.125)
3.18 THRU(0.125)

6.35 TYP.
(0.250)0.10 (0.004)
1.02 (0.040)

2.59 TYP.
(0.102)mm (inches)

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
031221– high power resistive products –7

High Power Resistive Products
Flange Mount Resistors
P/N: FR10517NXXXXJELECTRICAL SPECIFICATIONS
•
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•
•
•
•
•

Resistance: 100 Ω standard (other Ω values available)
Resistive Tolerance: :±5% standard (±2% available)
Power: 60 Watts
Capacitance: 2.2 pF
Operating Temperature Range: -55 to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant
Non-Magnetic available
3.81 MAX.
(0.150)1.57 (0.062)

3.18 (0.125)
3.18 MIN. TYP.
(0.125)6.73(0.265)13.08(0.515)

6.35 (.250)

6.35 TYP.
(0.250)2.59 (0.102)

0.10 (0.004)

0.64 TYP.
(0.025)

6.35 (0.250)

mm (inches)

P/N: FR10560NXXXXJELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•
•

Resistance: 100 Ω standard (other Ω values available)
Resistive Tolerance: ±5% standard (±2% available)
Power: 75 Watts
Capacitance: 4.15 pF
Operating Temperature Range: -55˚C to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant
Non-Magnetic available

1.57 (0.062)

14.22 (0.560)
7.87(0.310)3.81 MAX.
(0.150)3.94 (0.155)

9.52(0.375)
4.78 (0.188)

0.10 (0.004)
2.59 (0.102)

3.96 THRU(0.156)

6.35 TYP.
(0.250)2.41 (0.095)
1.02 (0.040)

mm (inches)

8

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
031221– high power resistive products –High Power Resistive Products
Flange Mount Resistors
P/N: FR10562NXXXXJELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•
•

Resistance: 100 Ω standard (other Ω values available)
Resistive Tolerance: ±5% standard (±2%available)
Power: 75 Watts
Capacitance: 4.15 pF
Operating Temperature Range: -55 to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant
Non-Magnetic available

1.57 (0.062)

3.81 MAX.
(0.150)4.78 (0.188)

3.96 THRU(0.156)7.87(0.310)3.94 (0.155)

14.22(0.560)6.35(0.250)6.35 TYP.
(0.250)2.59 (0.102)

0.10 (0.004)

1.02 TYP.
(0.040)9.52 (0.375)

mm (inches)

P/N: FR10800NXXXXJELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•
•

Resistance: 100 Ω standard (other Ω values available)
Resistive Tolerance: ±5% standard (±2% available)
Power: 100 Watts
Capacitance: 3.10 pF
Operating Temperature Range: -55˚C to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant
Non-Magnetic available
20.3 (0.800)
14.2 (0.560)
1.57 (0.062)

3.81 MAX.
(0.150)8.89 (0.350)
2.92 (0.115)

3.18 THRU(0.125)5.84 (0.230)

2.92 (0.115)

2.59 (0.102)

0.10 (0.004)

6.35 TYP.
(0.250)1.02 TYP.
(0.040)mm (inches)

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
031221– high power resistive products –9High Power Resistive Products
Flange Mount Resistors
P/N: FR10870NXXXXJELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•
•

Resistance: 100 Ω standard (other Ω values available)
Resistive Tolerance: ±5% standard (±2% available)
Power: 150 Watts
Capacitance: 4.15 pF
Operating Temperature Range: -55˚C to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant
Non-Magnetic available.870 (22.1 mm).560 (14.2 mm).150 MAX.
(3.81 mm).250
(6.35 mm).156 THRU(3.96 mm).375
(9.53 mm).188
(4.77 mm).062
(1.57 mm).102
(2.59 mm).004(.101 mm).188
(4.77 mm).

.250 TYP. (6.35 mm).040 TYP(1.02 mm).

mm (inches)

P/N: FR10870NXXXXJ01
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•
•

Resistance: 100 Ω standard (other Ω values available)
Resistive Tolerance: ±5% standard (±2% available)
Power: 150 Watts
Capacitance: 4.15 pF
Operating Temperature Range: -55˚C to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant
Non-Magnetic available.870 (22.1 mm).560 (14.2 mm).150 MAX.
(3.81 mm).250
(6.35 mm).156 THRU(3.96 mm).375
(9.53 mm).188
(4.77 mm).062
(1.57 mm).102
(2.59 mm).004(.101 mm).188
(4.77 mm).

.250 TYP. (6.35 mm).120 TYP(3.06 mm)

mm (inches)

10

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
031221– high power resistive products –High Power Resistive Products
Flange Mount Resistors
P/N: FR10975NXXXXJELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•
•

Resistance: 100 Ω standard (other Ω values available)
Resistive Tolerance: :±5% standard (±2% available)
Power: 250 Watts
Capacitance: 6.5 pF
Operating Temperature Range: -55 to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant
Non-Magnetic available.975 (24.77 mm).725 MIN.( 18.4 mm).375 (9.53 mm).225 MAX.
(5.715 mm).125(3.18 mm)
.188
(4.76 mm).385
(9.779 mm).125 THRU(3.18 mm).170
(4.32 mm).004(.101 mm).300
(7.62 mm).125
(3.18 mm).040 TYP.
(1.02 mm).

.250 TYP(6.35 mm)

mm (inches)

P/N: FR10975N0100J01
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•
•

Resistance: 100 Ω standard (other Ω values available)
Resistive Tolerance: :±5% standard (±2% available)
Power: 250 Watts
Capacitance: 6.5 pF
Operating Temperature Range: -55 to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant
Non-Magnetic available.975 (24.77 mm).725 MIN.( 18.4 mm).375 ( 9.53 mm).225 MAX.
(5.715 mm).125(3.18 mm)
.188
(4.76 mm).385
(9.779 mm).125 THRU(3.18 mm).170
(4.32 mm).004(.101 mm).300
(7.62 mm).125
(3.18 mm).120 TYP.
(3.06 mm).

.250 TYP(6.35 mm)

mm (inches)

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
031221– high power resistive products –11

High Power Resistive Products
Flange Mount Terminations
KYOCERA AVX introduces its complete line of High Power Termination Products. All
Products are designed and manufactured at our ISO 9001 Facilities.

ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•

Resistance: 50 Ω standard (10 Ω - 200 Ω available)
Resistance Tolerance: ±5% standard (±2% available)
Power: 10 Watts through 250 Watts
Operating Temperature Range: -55ºC to +150ºC
Temperature Coefficient: < 150 ppm/ºC
Low VSWR

MECHANICAL SPECIFICATIONS
•
•
•
•
•
•
•
•
•
•

Package: Surface Mount Chips, Chips, Leaded Chips, Flange Mount
Substrate Material: Aluminum Nitride
Process: Thin Film
Resistive Material: Tantalum
Terminals: Silver
Cover: Alumina
Mounting Flange: 100% Cu, Ni or Ag Plated
Mechanical Tolerance: ±0.13 (0.005)
Lead-Free, RoHS Compliant
SMT and Chip products, supplied on Tape and Reel

HOW TO ORDER

FT1

0300

N

0050

J

BK

Case Style

Packaging

Case Size

BK = Plastic Carrier

Tolerance

Termination

Code
Tol.

*G ±2% available - Consult Factory

Value

POWER DERATINGPower Dissipation

100%
80
60

Rated Safe Operating Range

40
20
0

-50˚C

-25˚C

0˚C

+25˚C

+50˚C

75˚C

100˚C

125˚C

150˚C

Heat Sink Temperature (°C)

12

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
031121– high power resistive products –J±5%High Power Resistive Products
Flange Mount Terminations
P/N: FT10300N0050J
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•

Nominal Impedance: 50 Ω ±5% standard (other Ω values available)
Power: 20 Watts
Frequency: DC to 6 GHz
VSWR: 1.15:1 @ 4 GHz, 1.25:1 @ 6 GHz,
Operating Temperature Range: -55ºC to +150ºC
Temperature Coefficient: <150 ppm/ºC
Tabs: Silver
Lead-Free, RoHS Compliant

1.57 (0.062)

7.62 (0.300)

3.81 MAX.
(0.150)5.08 (0.200)
2.54 (0.100)

5.08 (0.200)
2.54 (0.100)
3.18 THRU(0.125)

6.35 TYP.
(0.250)0.10 (0.004)
2.59 (0.102)

0.76 (0.030)
1.02 (0.040)

mm (inches)

P/N: FT10301N0050J
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•

Nominal Impedance: 50 Ω ±5% standard (other Ω values available)
Power: 20 Watts
Frequency: DC to 6 GHz
VSWR: 1.15:1 @ 4 GHz, 1.25:1 @ 6 GHz,
Operating Temperature Range: -55ºC to +150ºC
Temperature Coefficient: <150 ppm/ºC
Tabs: Silver
Lead-Free, RoHS Compliant

1.02 (0.040)

2.59 (0.102)

0.76 (0.030)

0.10 (0.004)

3.18 THRU(0.125)

6.35 TYP.
(0.250)2.54 (0.100)
5.08 (0.200)

1.57 (0.062)
3.81 MAX.
(0.150)2.54 (0.100)
5.08 (0.200)
7.62 (0.300)

mm (inches)

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
031121– high power resistive products –13

High Power Resistive Products
Flange Mount Terminations
P/N: FT10302N0050J
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•

Nominal Impedance: 50 Ω ±5% standard (other Ω values available)
Power: 20 Watts
Frequency: DC to 18 GHz
VSWR: 1.15:1 @ 15 GHz, 1.25:1 @ 18 GHz
Operating Temperature Range: -55ºC to +150ºC
Temperature Coefficient: <150 ppm/ºC
Tabs: Silver
Lead-Free, RoHS Compliant

1.57 (0.062)

3.30 MAX.
(0.130)2.54 (0.100)
3.18 THRU(0.125)5.08 MIN.
(0.200)2.54 (0.100)

7.62 (0.300)

2.54 (0.100)

6.35 (0.250) TYP.
5.08 (0.200)

2.59 (0.102)
0.10 (0.004)

1.02 TYP.
(0.040)mm (inches)

P/N: FT10500N0050J
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•

Nominal Impedance: 50 Ω ±5% standard (other Ω values available)
Power: 25 Watts
Frequency: DC to 6.0 GHz
VSWR: 1.15:1 @ 4 GHz, 1.25:1 @ 6 GHz
Operating Temperature Range: -55ºC to +150ºC
Temperature Coefficient: <150 ppm/ºC
Tabs: Silver
Lead-Free, RoHS Compliant

3.81 MAX.
(0.150)1.57 (0.062)

12.7 (0.500)
5.08 MIN.
(0.200)2.54 (0.100)

5.08 (0.200)

2.54 (0.100)

3.18 THRU(0.125)2.59 (0.102)
0.10 (0.004)

6.35 (0.250) TYP.

0.76 (0.030) TYP.
1.02 (0.040) TYP.

mm (inches)

14

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
031121– high power resistive products –High Power Resistive Products
Flange Mount Terminations
P/N: FT10515N0050J
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•

Nominal Impedance: 50 Ω ±5% standard (other Ω values available)
Power: 60 Watts
Frequency: DC to 6.0 GHz
VSWR: 1.20:1 @ 4 GHz, 1.30:1 @ 6 GHz
Operating Temperature Range: -55ºC to +150ºC
Temperature Coefficient: <150 ppm/ºC
Tabs: Silver
Lead-Free, RoHS Compliant
13.1 (0.515)
3.81 MAX.
(0.150)1.57 (0.062)

6.73(0.265)
3.18 (0.125)
3.18 (0.125)
6.35 (0.250)

3.18 THRU(0.125)

6.35 (0.250) TYP.

2.59 (0.102)
0.10 (0.004)

1.02 TYP.
(0.040)mm (inches)

P/N: FT10515N0050J01
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•

Nominal Impedance: 50 Ω ±5% standard (other Ω values available)
Power: 100 Watts
Frequency: DC to 2.5 GHz
VSWR: 1.15:1
Operating Temperature Range: -55˚C to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant.062(1.57 mm)

.515 (13.1 mm).150 MAX.
(3.81 mm).265
(6.73 mm).125 (3.18 mm).125 (3.18 mm).250 (6.35 mm).125 THRU(3.18 mm).102
(2.59 mm).250 TYP. (6.35 mm).

.004(.101 mm).040 TYP(1.02 mm)

mm (inches)

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
031121– high power resistive products –15

High Power Resistive Products
Flange Mount Terminations
P/N: FT10515N0050J02
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•

Nominal Impedance: 50 Ω ±5% standard (other Ω values available)
Power: 100 Watts
Frequency: DC to 4 GHz
VSWR: 1.20:1
Operating Temperature Range: -55˚C to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant.062(1.57 mm)

.515 (13.1 mm).150 MAX.
(3.81 mm).265
(6.73 mm).125 (3.18 mm).125 (3.18 mm).250 (6.35 mm).125 THRU(3.18 mm).102
(2.59 mm).004(.101 mm).250 TYP. (6.35 mm).040 TYP.
(1.02 mm)

P/N: FT10516N0050J
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•

Nominal Impedance: 50 Ω ±5% standard (other Ω values available)
Power: 60 Watts
Frequency: DC to 6 GHz
VSWR: 1.20:1 @ 4 GHz, 1.30:1 @ 6 GHz
Operating Temperature Range: -55˚C to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant
1.02 TYP.
(0.040)2.59 (0.102)010 (0.004)

6.35 TYP.
(0.250)3.18 THRU(0.125)6.35(0.250)3.18 (0.125)
3.18(0.125)

1.57 (0.062)
6.73 (0.265)
3.81 MAX.
(0.150)16

13.1 (0.515)

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
031121– high power resistive products –High Power Resistive Products
Flange Mount Terminations
P/N: FT10516N0050J01
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•

Nominal Impedance: 50 Ω ±5% standard (other Ω values available)
Power: 100 Watts
Frequency: DC to 2.5 GHz
VSWR: 1.15:1
Operating Temperature Range: -55˚C to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant.102(2.59 mm).040 TYP.
(1.02 mm).004(.101 mm).250 TYP.
(6.35 mm).125 THRU(3.18 mm).250
(6.35 mm).125 (3.18 mm).125(3.18 mm).062
(1.57 mm).150 MAX.
(3.81 mm).265
(6.73 mm)

.515 (13.1 mm)

mm (inches)

P/N: FT10516N0050J02
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•

Nominal Impedance: 50 Ω ±5% standard (other Ω values available)
Power: 100 Watts
Frequency: DC to 4 GHz
VSWR: 1.20:1
Operating Temperature Range: -55˚C to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant.102(2.59 mm).040 TYP.
(1.02 mm).004(.101 mm).250 TYP.
(6.35 mm).125 THRU(3.18 mm).250
(6.35 mm).125 (3.18 mm).125(3.18 mm).062
(1.57 mm).150 MAX.
(3.81 mm).265
(6.73 mm)

.515 (13.1 mm)

mm (inches)

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
031121– high power resistive products –17

High Power Resistive Products
Flange Mount Terminations
P/N: FT10517N0050J
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•

Nominal Impedance: 50 Ω ±5% standard (other Ω values available)
Power: 60 Watts
Frequency: DC to 4 GHz
VSWR: 1.20:1 @ 4 GHz, 1.30:1 @ 6 GHz
Operating Temperature Range: -55˚C to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant

1.57 (0.062)

6.35 (0.250)

3.81 MAX.
(0.150)3.18 (0.125)
3.18 (0.125)
6.73 (0.265)
3.18 THRU(0.125)13.1 (0.515)

2.59 (0.102)

6.35 (0.250) TYP.
0.10 (0.004)
1.02 TYP.
(0.040)mm (inches)

P/N: FT10517N0050J01
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•

Nominal Impedance: 50 Ω ±5% standard (other Ω values available)
Power: 100 Watts
Frequency: DC to 2.5 GHz
VSWR: 1.15:1
Operating Temperature Range: -55˚C to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant.150 MAX.
(3.81 mm).125 (3.18 mm).062(1.57 mm).250
(6.35mm).125(3.18 mm).265
(6.73 mm).125 THRU(3.18 mm).515
(13.1 mm).102
(2.59 mm).250 TYP. (6.35 mm).004(.101 mm).040 TYP.
(1.02 mm)

mm (inches)

18

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
031121– high power resistive products –High Power Resistive Products
Flange Mount Terminations
P/N: FT10517N0050J02
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•

Nominal Impedance: 50 Ω ±5% standard (other Ω values available)
Power: 100 Watts
Frequency: DC to 4 GHz
VSWR: 1.20:1
Operating Temperature Range: -55˚C to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant.150 MAX.
(3.81 mm).250
(6.35mm).125 (3.18 mm).062(1.57 mm).125
(3.18 mm).265
(6.73 mm).125 THRU(3.18 mm).515
(13.1 mm).102
(2.59 mm).250 TYP. (6.35 mm).040 TYP.
(1.02 mm).004(.101 mm)

mm (inches)

P/N: FT10560N0050J
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•

Nominal Impedance: 50 Ω ±5% standard (other Ω values available)
Power: 75 Watts
Frequency: DC to 4 GHz
VSWR: 1.25:1
Operating Temperature Range: -55˚C to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant
0.10 (0.004)
2.59 (0.102)

1.02 TYP.
(0.040)6.35 TYP.
(0.250)3.93 TYP.
(0.155)4.77 TYP.
(0.188)

1.57 (0.062)

3.81 MAX(0.150)6.35 (0.250)
14.2 (0.560)

9.53(0.375)3.96 THRU(0.156)mm (inches)

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
031121– high power resistive products –19

High Power Resistive Products
Flange Mount Terminations
P/N: FT10560N0050J01
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•

Nominal Impedance: 50 Ω ±5% standard (other Ω values available)
Power: 100 Watts
Frequency: DC to 1.1 GHz
VSWR: 1.15:1
Operating Temperature Range: -55˚C to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant.102(2.59 mm).040 TYP.
(1.02 mm).004(.101 mm).

.250 TYP(6.35 mm).155 TYP.
(3.93 mm).

.375
(9.53 mm).188 TYP(4.77 mm).
.150 MAX.
(3.81 mm).062
(1.57 mm).250
(6.35 mm).560 (14.2 mm).156 THRU(3.96 mm)

mm (inches)

P/N: FT10560N0050J02
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•

Nominal Impedance: 50 Ω ±5% standard (other Ω values available)
Power: 100 Watts
Frequency: DC to 2 GHz
VSWR: 1.20:1
Operating Temperature Range: -55˚C to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant.102(2.59 mm).004(.101 mm).040 TYP.
(1.02 mm).

.250 TYP(6.35 mm).155 TYP.
(3.93 mm).

.375
(9.53 mm).188 TYP(4.77 mm).

.062
(1.57 mm)

20.150 MAX.
(3.81 mm).250
(6.35 mm).560 (14.2 mm).156 THRU(3.96 mm)

mm (inches)

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
031121– high power resistive products –High Power Resistive Products
Flange Mount Terminations
P/N: FT10561N0050J
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•

Nominal Impedance: 50 Ω ±5% standard (other Ω values available)• Power: 75 Watts• Frequency: DC to 4.0 GHz• VSWR: 1.25:1• Operating Temperature Range: -55˚C to +150˚C• Temperature Coefficient: <150 ppm/˚C• Tabs: Silver• Lead-Free, RoHS Compliant

1.57 (0.062)

3.81 MAX.
(0.150)14.2 (0.560)
6.35(0.250)3.96 THRU(0.156)9.53(0.375)4.77 TYP.
(0.188)3.93 (0.155) TYP.

6.35 TYP.
(0.250)2.59 (0.102)
0.10 (0.004)

1.02 TYP.
(0.040)mm (inches)

P/N: FT10561N0050J01
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•

Nominal Impedance: 50 Ω ±5% standard (other Ω values available)
Power: 100 Watts
Frequency: DC to 1.1 GHz
VSWR: 1.15:1
Operating Temperature Range: -55˚C to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant.062(1.57 mm).150 MAX.
(3.81 mm).560 (14.2 mm).250(6.35 mm).156 THRU(3.96 mm).

.188 TYP(4.77 mm).

.102
(2.59 mm).155 TYP.
(3.93 mm).250 TYP(6.35 mm).004(.101 mm).375
(9.53 mm).040 TYP.
(1.02 mm)

mm (inches)

For Part Number Code, see page 14.
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
031121– high power resistive products –21

High Power Resistive Products
Flange Mount Terminations
P/N: FT10561N0050J02
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•

Nominal Impedance: 50 Ω ±5% standard (other Ω values available)
Power: 100 Watts
Frequency: DC to 2 GHz
VSWR: 1.20:1
Operating Temperature Range: -55˚C to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant.150 MAX.
(3.81 mm).062
(1.57 mm).560 (14.2 mm).156 THRU(3.96 mm).250
(6.35 mm).188 TYP(4.77 mm).

.

.155 TYP(3.93 mm).250 TYP(6.35 mm).102
(2.59 mm).375
(9.53 mm).004(.101 mm).

.040 TYP(1.02 mm)

mm (inches)

P/N: FT10800N0050J
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•

Nominal Impedance: 50 Ω ±5% standard (other Ω values available)
Power: 50 Watts
Frequency: DC to 6 GHz
VSWR: 1.10:1 @ 4.5 GHz, 1.18:1 @ 6.0GHz
Operating Temperature Range: -55˚C to +150˚C
Tabs: Silver
Lead-Free, RoHS Compliant

1.57 (0.062)

20.3 (0.800)

3.81 MAX.
(0.150)14.2 (0.560)
8.89 (0.350)

3.30 THRU(0.130)5.84 (0.230)

2.92 (0.115)
6.35 (0.250) TYP.

0.10 (0.004)
2.59 (0.102)

22

1.02 TYP.
(0.040)mm (inches)

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
031121– high power resistive products –High Power Resistive Products
Flange Mount Terminations
P/N: FT10800N0050J02
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•

Nominal Impedance: 50 Ω ±5% standard (other Ω values available)
Power: 100 Watts
Frequency: DC to 6 GHz
VSWR: 1.10:1 @ 4.5 GHz, 1.20:1 @ 6.0GHz
Operating Temperature Range: -55˚C to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant

1.57 (0.062)

20.3 (0.800)

3.81 MAX.
(0.150)14.2 (0.560)
8.89 (0.350)

3.30 THRU(0.130)5.84 (0.230)

2.92 (0.115)
6.35 (0.250) TYP.

0.10 (0.004)
2.59 (0.102)

1.02 TYP.
(0.040)mm (inches)

P/N: FT10870N0050J
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•

Nominal Impedance: 50 Ω ±5% standard (other Ω values available)
Power: 100 Watts
Frequency: DC to 4.0 GHz
VSWR: 1.20:1
Operating Temperature Range: -55˚C to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant
22.1 (0.870)

3.81 MAX.
(0.150)1.57 (0.062)

14.2 (0.560)
6.35(0.250)3.96 THRU(0.156)9.53(0.375)4.75(0.188)6.35 TYP.
(0.250)2.59 (0.102)

0.10 (0.004)

1.02 TYP.
(0.040)mm (inches)

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
031121– high power resistive products –23

High Power Resistive Products
Flange Mount Terminations
P/N: FT10870N0050J01
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•

Nominal Impedance: 50 Ω ±5% standard (other Ω values available)
Power: 150 Watts
Frequency: DC to 1.1 GHz
VSWR: 1.15:1
Operating Temperature Range: -55˚C to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant.870 (22.1 mm).150 MAX.
(3.81 mm).062
(1.57 mm).560 (14.2 mm).250(6.35 mm).156 THRU(3.96 mm).375
(9.53 mm).188
(4.75 mm).102
(2.59 mm).250 TYP.
(6.35 mm).004(.101 mm).040 TYP.
(1.02 mm).

mm (inches)

P/N: FT10870N0050J02
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•

Nominal Impedance: 50 Ω ±5% standard (other Ω values available)
Power: 150 Watts
Frequency: DC to 4 GHz
VSWR: 1.20:1
Operating Temperature Range: -55˚C to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant.870 (22.1 mm).150 MAX.
(3.81 mm).062
(1.57 mm).560 (14.2 mm).250(6.35 mm).156 THRU(3.96 mm).375
(9.53 mm).188
(4.75 mm).

.102
(2.59 mm).250 TYP(6.35 mm).004(.101 mm).040 TYP.
(1.02 mm).

mm (inches)

24

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
031121– high power resistive products –High Power Resistive Products
Flange Mount Terminations
P/N: FT10870N0050J03
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•

Nominal Impedance: 50 Ω ±5% standard (other Ω values available)
Power: 150 Watts
Frequency: DC to 4 GHz
VSWR: 1.25:1
Operating Temperature Range: -55˚C to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant.870 (22.1 mm).150 MAX.
(3.81 mm).062
(1.57 mm).560 (14.2 mm).250(6.35 mm).156 THRU(3.96 mm).375
(9.53 mm).188
(4.75 mm).102
(2.59 mm).250 TYP.
(6.35 mm).004(.101 mm).120 TYP.
(3.05 mm).

mm (inches)

P/N: FT10975N0050JBKELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•

Nominal Impedance: 50 Ω ±5% standard (other Ω values available)
Power: 200 Watts
Frequency: DC to 2.2 GHz
VSWR: 1.20:1 @ 2 GHz, 1.30:1 @ 2.2 GHz
Operating Temperature Range: -55˚C to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant.125(3.18 mm).975 (24.8 mm).725 (18.4 mm).375(9.53 mm).225 MAX.
(5.715 mm).188(4.78 mm).385
(9.779 mm).125 THRU(3.18 mm).165
(4.19 mm).004(.101 mm).125
(3.18 mm).040 TYP.
(1.02 mm).250 TYP.
(6.35 mm)

mm (inches)

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
031121– high power resistive products –25

High Power Resistive Products
Flange Mount Terminations
P/N: FT10975N0050J01
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•

Nominal Impedance: 50 Ω ±5% standard (other Ω values available)
Power: 100 Watts
Frequency: DC to 6 GHz
VSWR: 1.10:1 @ 4.5 GHz, 1.20:1 @ 6.0GHz
Operating Temperature Range: -55˚C to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant.125(3.18 mm).975 (24.8 mm).225 MAX.
(5.715 mm).725 (18.4 mm).375(9.53 mm)
.188
(4.78 mm).385
(9.779 mm).125 THRU(3.18 mm).165
(4.19 mm).125
(3.18 mm).004(.101 mm).

.040 TYP(1.02 mm).250 TYP.
(6.35 mm)

mm (inches)

P/N: FT10975N0050J03
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
•
•
•

Nominal Impedance: 50 Ω ±5% standard (other Ω values available)
Power: 100 Watts
Frequency: DC to 4.0 GHz
VSWR: 1.20:1
Operating Temperature Range: -55˚C to +150˚C
Temperature Coefficient: <150 ppm/˚C
Tabs: Silver
Lead-Free, RoHS Compliant.125(3.18 mm).975 (24.8 mm).725 (18.4 mm).375(9.53 mm).225 MAX.
(5.715 mm).188(4.78 mm).385
(9.779 mm).125 THRU(3.18 mm).165
(4.19 mm).004(.101 mm).125
(3.18 mm).

.120 TYP(3.06 mm).250 TYP.
(6.35 mm)

mm (inches)

26

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
031121– high power resistive products –High Power Resistive Products
Chip Resistors – CR1 Style
RP3 Series

GENERAL SPECIFICATIONS
•
•
•
•
•
•
•
•
•
•
•

Resistance: 100 Ω standard, (other Ω values available)
Resistive Tolerance: ±5% standard (2% Available)
Operating Temp Range: -55 to +150°C
Temperature Coefficient: <150 ppm/°C
Resistive Elements: Proprietary Thin Film
Substrate Material: Aluminum Nitride
Terminals: Silver
Lead-Free, RoHS Compliant
Reliability: MIL-PRF-55342
Non-Magnetic
Tape and Reel Specifications:A
Overcoat

Top
View

Resistive
Area

Side
View

Values in Inches

Part Number*

W ± .010

L ± .010

T ± .005

A ± .005

B (Typ.)Capacitance(pF)

Power Max**(Watts)

CR11005TxxxxJ

.050

.100

.025

.045

.020

.75

5W

CR11206TxxxxJ

.060

.120

.025

.055

.020

.90

15W

CR12010TxxxxJ

.100

.200

.040

.090

.020

1.0

30W

CR12525TxxxxJ

.245

.245

.040

.130

.020

2.0

60W

CR12525TxxxxJ01

.245

.245

.040

.130

.020

2.0

100W

CR13725TxxxxJ

.250

.375

.040

.198

.025

4.15

150W

CR13737TxxxxJ

.370

.370

.040

.330

.025

6.0

250W

* xxxx denotes Ohm value.
** Test Condition: Chip soldered to a large copper carrier whose surface is at 100° C; maximum rated power applied.
Specification: The resistance of the film shall change no more than 0.5% during and after a 1000-hr. Burn-in per Mil-PRF-55342.

HOW TO ORDER

CR1

2010

T

xxxx

J

TR

Case Style

Packaging

Case Size

TR = Tape & Reel
(Standard)
BK = Plastic Carrier
TU* (Optional)

Termination
Value

Tolerance

100 Ω = 0100
50 Ω = 0050

Code
Tol.

G

J

±2%

±5%

POWER DERATINGPower Dissipation

100%
80
60

Rated Safe Operating Range

40
20
0

-50˚C

-25˚C

0˚C

+25˚C

+50˚C

75˚C

100˚C

125˚C

150˚C

Heat Sink Temperature (°C)

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-HPRES-0001 | Rev 1– high power resistive products –27

High Power Resistive Products
Surface Mount Chip Resistors – CS1 and CW Style
RP4 Series

GENERAL SPECIFICATIONS
•
•
•
•
•
•
•
•
•
•

Resistance: 2 - 100 Ω standard, (other Ω values available)
Resistive Tolerance: ±2% standard
Operating Temp Range: -55 to +150°C
Temperature Coefficient: <150 ppm/°C
Resistive Elements: Proprietary Thin Film
Substrate Material: Aluminum Nitride
Terminals: Silver over Nickel
Lead-Free, RoHS Compliant
Reliability: MIL-PRF-55342
Tape and Reel Specifications:

RP5 Series

Top
View

Overcoat

Side
View

T

T

L

L

LT

Bottom
View

WT

W

WT

W

LT

LA

Values in Inches

Capacitance(pF)

Power Max**(Watts).095.95 pF

10W.110

1.85 pF

20W

.050

.195

3.0 pF

30W

.050

.195

3.5 pF

40W

Part Number*

W ± 0.010

L ± 0.010

T ± 0.005

WT ± 0.005

LT ±0.005

LA ± 0.005

CS12010TxxxxG

.100

.200

.040

.090

.030

CS12525TxxxxG

.245

.245

.040

.120

.040

CS13725TxxxxG

.250

.375

.040

.120

CS13737TxxxxG

.370

.370

.040

.360

Values in Inches

Part Number*

W ± 0.010

L ± 0.010

T ± 0.005

WT ± 0.005

Power Max**(Watts)LT ±0.005

CW12010TxxxxG

.100

.200

.040

.090

.030

4W

CW12525TxxxxG

.245

.245

.040

.120

.040

6W

CW13725TxxxxG

.250

.375

.040

.120

.050

8W

CW13737TxxxxG

.370

.370

.040

.360

.050

10W

* xxxx denotes Ohm value.
** Test Condition: Chip soldered to a via patch on a 30-mil-thick Rogers RO4350 board; Land surfaces at 100° C; maximum rated power applied.
Specification: The resistance of the film shall change no more than 0.5% during and after a 1000-hr. Burn-in per Mil-PRF-55342.

HOW TO ORDER

CS1

2010

T

xxxx

J

TR

Case Style

Packaging

Case Size

TR = Tape & Reel (Standard)
BK = Plastic Carrier

Termination

Tolerance
Code
Tol.

Value

28

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-HPRES-0002 | Rev 1– high power resistive products –

F

G

J

±1%

±2%

±5%

High Power Resistive Products
Surface Mount Chip Resistors – CS1 and CW Style
POWER DERATINGPower Dissipation

100%
80
60

Rated Safe Operating Range

40
20
0

-25˚C

-50˚C

0˚C

+25˚C

+50˚C

75˚C

100˚C

125˚C

150˚C

Heat Sink Temperature (°C)
TCR CURVE

CW Series Resistor Value Change over Temperature
60

55

Resistance (Ohm)

50

45

40

35

-80

-60

-40

-20

30

0

20

40

60

80

100

120

140

Temperature (°C)
CW1Q036FTICW1Q050GTICW1Q054FTI

Linear (CW1Q036FTI)

Linear (CW1Q050GTI)

Linear (CW1Q054FTI)The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-HPRES-0002 | Rev 1– high power resistive products –29

High Power Resistive Products
Leaded Chip Resistors – LR1 Style
GENERAL SPECIFICATIONS

L• Resistance: 50 and 100 Ω standard(contact factory for custom resistance values)• Resistive Tolerance: ±5% standard (2% available)• Operating Temp. Range: -55ºC to +150ºC• Temperature Coefficient: <150 ppm/ºC• Resistive Elements: Proprietary Thin Film
• Substrate Material: Aluminum Nitride• Lead Terminals: Silver• Cover: Alumina• RoHS Compliant• Non-Magnetic

WA
6.35 (0.250) TYP.

T
0.10 (0.004) TYP.
2.03 (0.080) MAX.

mm (inches)
Values in Inches

Part Number*

W ± .010

L ± .010

T ± .005

A

Capacitance(pF)

Power Max**(Watts)LR12010TxxxxJ

.100

.200

.040

.040

1.0

30W

LR12335TxxxxJ

.350

.230

.040

.040

3.15

50W

LR12525TxxxxJ

.245

.245

.040

.040

2.0

60W

LR12335TxxxxJ01

.350

.230

.040

.040

3.15

100W

LR13725TxxxxJ

.250

.375

.040

.040

4.15

150W

LR13725TxxxxJ01

.250

.375

.040

.120

4.15

150W

LR13737TxxxxJ

.370

.370

.040

.040

6.0

250W

LR13737TxxxxJ01

.370

.370

.040

.120

6.0

250W

* xxxx denotes Ohm value.
** Test Condition: Chip soldered to a large copper carrier whose surface is at 100° C; maximum rated power applied.
Specification: The resistance of the film shall change no more than 0.5% during and after a 1000-hr. Burn-in per MIL-PRF-55342

HOW TO ORDER

LR1

2010

T

xxxx

J

BK

Case Style

Packaging

Case Size

BK = Plastic Carrier

Tolerance

Termination

Code
Tol.

Value

POWER DERATINGPower Dissipation

100%
80
60

Rated Safe Operating Range

40
20
0

-50˚C

-25˚C

0˚C

+25˚C

+50˚C

75˚C

100˚C

125˚C

150˚C

Heat Sink Temperature (°C)

30

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-HPRES-0009 | Rev 1– high power resistive products –

G

J

±2%

±5%

Surface Mount Chip Terminations
CZ1 Style
GENERAL SPECIFICATIONS
•
•
•
•
•
•
•
•
•
•

CZ12010T0050G &CZ12010T0050G02

Nominal Impedance: 50 ΩResistive Tolerance: ±2% standard
Operating Temp Range: -55 to +150˚C
Temperature Coefficient: ±150 ppm/˚C
Resistive Elements: Tantalum, Thin Film Processed
Substrate Material: Aluminum Nitride
Terminals: Silver over Nickel
Lead-Free, RoHS Compliant
Reliability: MIL-PRF-55342
Tape & Reel Specifications:

CZ12525T0050G

Values in Inches

Part Number

W ±.010

L ±.010

T ±.005

LT ±.005

WT ±.005

LA ±.005

Frequency Range
(GHz)

VSWR
(Typ.)

Power Max*
(Watts)CZ12010T0050G

.100

.200

.040

.040

.090

.115

DC - 3.0

1.20:110W

CZ12010T0050G02

.100

.200

.040

.020

.090

.140

DC - 3.0

1.20:110W

CZ12525T0050G

.245

.245

.040

.030

.125

.170

DC - 4.0

1.25:120W* Test Condition: Chip soldered to a via patch on a 30-mil-thick Rogers RO4350 board; Land surfaces at 100° C; maximum rated power applied.
Specification: The resistance of the film shall change no more than 0.5% during and after a 1000-hr. Burn-in per Mil-PRF-55342.

HOW TO ORDER

CZ1

2010

T

0050

J

TR

Case Style

Packaging

Case Size

TR = Tape & Reel
BK = Plastic Carrier

Termination

Tolerance

Value

Code
Tol.

G

J

±2%

±5%

POWER DERATINGPower Dissipation

100%
80
60

Rated Safe Operating Range

40
20
0

-50˚C

-25˚C

0˚C

+25˚C

+50˚C

75˚C

100˚C

125˚C

150˚C

Heat Sink Temperature (°C)

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-HPRES-0004 | Rev 1– high power resistive products –31

Surface Mount Chip Terminations
CZ1 Style
GENERAL SPECIFICATIONS
•
•
•
•
•
•
•
•
•
•

CZ13725T0050G

Nominal Impedance: 50 ΩResistive Tolerance: ±2% standard
Operating Temp Range: -55 to +150˚C
Temperature Coefficient: ±150 ppm/˚C
Resistive Elements: Tantalum, Thin Film Processed
Substrate Material: Aluminum Nitride
Terminals: Silver over Nickel
Lead-Free, RoHS Compliant
Reliability: MIL-PRF-55342
Tape & Reel Specifications:

CZ13737T0050G

Values in Inches

Part Number

W ±.010

L ±.010

T ±.005

LT ±.005

WT ±.005

LA ±.005

Frequency Range
(GHz)

VSWR
(Typ.)

Power Max*
(Watts)

CZ13725T0050G

.250

.375

.040

.050

.125

.260

DC - 2.2

1.20:130W

CZ13737T0050G

.370

.370

.040

.050

.125

.275

DC - 3.0

1.25:140W* Test Condition: Chip soldered to a via patch on a 30-mil-thick Rogers RO4350 board; Land surfaces at 100° C; maximum rated power applied.
Specification: The resistance of the film shall change no more than 0.5% during and after a 1000-hr. Burn-in per Mil-PRF-55342.

HOW TO ORDER

CZ1

2010

T

0050

J

TR

Case Style

Packaging

Case Size

TR = Tape & Reel
BK = Plastic Carrier

Termination

Tolerance

Value

Code
Tol.

POWER DERATINGPower Dissipation

100%
80
60

Rated Safe Operating Range

40
20
0

-50˚C

-25˚C

0˚C

+25˚C

+50˚C

75˚C

100˚C

125˚C

150˚C

Heat Sink Temperature (°C)

32

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-HPRES-0004 | Rev 1– high power resistive products –

G

J

±2%

±5%

Leaded Chip Terminatons
CT1 Style
GENERAL SPECIFICATIONS
•
•
•
•
•
•
•
•
•
•

Nominal Impedance: 50 ΩResistive Tolerance: ±5% standard, ±2% available
Operating Temp Range: -55 to +150˚C
Temperature Coefficient: ±150 ppm/˚C
Resistive Elements: Tantalum, Thin Film Processed
Substrate Material: Aluminum Nitride
Terminals: Silver over Nickel
Lead-Free, RoHS Compliant
Reliability: MIL-PRF-55342
Tape and Reel Specifications:

Top
View

Resistive
Area

Overcoat

Side
View

Values in Inches

Part Number

W ±.010

L ±.010

T ±.005

A ±.005

B (Typ.)Frequency
(GHz)

VSWR
(Typ.)

Power Max*
(Watts)CT11020T0050J

.200

.100

.025

.034

.020

CT12010T0050J

.100

.200

.040

.050

.060

DC to 18.0

1.25:120W

DC to 4.0

1.20:1

CT12525T0050J

.245

.245

.040

.090

30W

.020

DC to 4.0

1.15:1

CT12525T0050J01

.245

.245

.040

60W

.050

.040

DC to 2.5

1.15:1100W

CT12525T0050J02

.245

.245

CT12335T0050J

.350

.230

.040

.090

.020

DC to 4.0

1.20:1

100W

.040

.100

.030

DC to 4.0

1.15:1

CT13725T0050J

.250

100W

.375

.040

.090

.025

DC to 4.0

1.20:1

CT13725T0050J01

125W

.250

.375

.040

.050

.055

DC to 1.1

1.20:1150W

CT13725T0050J02

.250

.375

.040

.090

.025

DC to 4.0

1.25:1150W

CT13737T0050J

.370

.370

.040

.120

.025

DC to 2.0

1.25:1150W

CT13737T0050J01

.370

.370

.040

.130

.065

DC to 1.0

1.20:1250W* Test Condition: Chip soldered to a large copper carrier whose surface is at 100°C; maximum rated power applied.
Specification: The resistance of the film shall change no more than <2% during and after a 1000-hr. Burn-in per MIL-PRF-55342.

HOW TO ORDER

CT1

2010

T

0050

J

TR

Case Style

Packaging

Case Size

TR = Tape & Reel
BK = Plastic Carrier

Termination

Tolerance

Value

Code
Tol.

G

J

±2%

±5%

POWER DERATINGPower Dissipation

100%
80
60

Rated Safe Operating Range

40
20
0

-50˚C

-25˚C

0˚C

+25˚C

+50˚C

75˚C

100˚C

125˚C

150˚C

Heat Sink Temperature (°C)

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-HPRES-0003 | Rev 1– high power resistive products –33

Leaded Chip Terminations
LT1 Style
GENERAL SPECIFICATIONS
•
•
•
•
•
•
•
•
•

L

Nominal Impedance: 50 ΩResistive Tolerance: ±5% standard, ±2% available
Operating Temp Range: -55 to +150°C
Temperature Coefficient: ±150 ppm/°C
Resistive Elements: Tantalum, Thin Film Processed
Substrate Material: Aluminum Nitride
Terminals: Silver over Nickel
Lead-Free, RoHS Compliant
Reliability: MIL-PRF-55342
Part Number

W ±.010

L ±.010

A
W

6.35 (0.250) TYP.

T

0.10 TYP.
(0.004)2.03 MAX.
(0.080)

Values in Inches

T ±.005

A ±.005

Frequency
(GHz)

VSWR
(Typ.)

Power Max*
(Watts)LT11020T0050J

0.200

0.100

0.025

0.040

DC to 18.0

1.25:1

20W

LT12010T0050J

0.100

0.200

0.040

0.040

DC to 4.0

1.20:130W

LT12525T0050J

0.245

0.245

0.040

0.040

DC to 4.0

1.15:160W

LT12525T0050J01

0.245

0.245

0.040

0.040

DC to 2.5

1.15:1100W

LT12525T0050J02

0.245

0.245

0.040

0.040

DC to 4.0

1.20:1100W

LT12335T0050J

0.350

0.230

0.040

0.040

DC to 4.0

1.15:1

100W

LT13725T0050J

0.250

0.375

0.040

0.040

DC to 4.0

1.20:1125W

LT13725T0050J01

0.250

0.375

0.040

0.040

DC to 1.1

1.20:1150W

LT13725T0050J02

0.250

0.375

0.040

0.040

DC to 4.0

1.25:1150W

LT13725T0050J03

0.250

0.375

0.040

0.120

DC to 4.0

1.25:1150W

LT13737T0050J

0.370

0.370

0.040

0.040

DC to 2.0

1.25:1200W

LT13737T0050J01

0.370

0.370

0.040

0.040

DC to 1.0

1.20:1250W

LT13737T0050J02

0.370

0.370

0.040

0.040

DC to 2.0

1.25:1250W

LT13737T0050J03

0.370

0.370

0.040

0.120

DC to 2.0

1.25:1250W* Test Condition: Chip soldered to a large copper carrier whose surface is at 100°C; maximum rated power applied.
Specification: The resistance of the film shall change no more than <2% during and after a 1000-hr. Burn-in per MIL-PRF-55342.

HOW TO ORDER

LT1

2010

T

0050

J

BK

Case Style

Packaging

Case Size

BK = Plastic Carrier

Tolerance

Termination

Code
Tol.

Value
POWER DERATINGPower Dissipation

100%
80
60

Rated Safe Operating Range

40
20
0

-50˚C

-25˚C

0˚C

+25˚C

+50˚C

75˚C

100˚C

125˚C

150˚C

Heat Sink Temperature (°C)

34

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-HPRES-0010 | Rev 1– high power resistive products –

G

J

±2%

±5%

High Power Resistive Products
Jumpers
SPECIFICATIONS••••

Substrate Material: Aluminum Nitride
Terminals: Silver
Operating Temp Range: -55ºC to +150ºC
RoHS Compliant

Top
View

A

Side
View
mm (inches)Part Number
RP31206JXXXXJTTR

W±0.25 (0.010)
1.52 (0.060)

L±0.25 (0.010)
3.05 (0.120)

T±0.13 (0.005)
0.64 (0.025)

A±0.13 (0.005)
1.40 (0.055)

B(Typ.)
0.51 (0.020)
0.51 (0.020)

RP32010JXXXXJTTR

2.54 (0.100)

5.08 (0.200)

1.02 (0.040)

2.29 (0.090)

RP32525JXXXXJTTR

6.22 (0.245)

6.22 (0.245)

1.02 (0.040)

3.30 (0.130)

0.51 (0.020)

RP33725JXXXXJTTR

6.35 (0.250)

9.53 (0.375)

1.02 (0.040)

5.03 (0.198)

0.64 (0.025)

RP33737JXXXXJTTR

9.40 (0.370)

9.40 (0.370)

1.02 (0.040)

8.38 (0.330)

0.64 (0.025)

HOW TO ORDER
RP3

Series1206

Case Size
See chart
above

J

Type

J = Jumper

XXXX

J

T

Value

Tolerance
J = ±5%

Terminal

0100 = 100ΩT = Silver

TR

Packaging

TR = Tape & Reel

Contact factory for custom ratings and sizes.

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

– high power resistive products –35

High Power Resistive Products
Resistive Products Design Kits
KYOCERA AVX’s Resistive Products Design Kits contain a selection of High Power Chip Resistors and Terminations with standard values of 50
Ohm and 100 Ohm. Operating frequencies are from DC to 6 GHz. All designs are manufactured with Non-toxic Aluminum Nitride base substrates.
ORDER BY ITEM # BELOW
mm (inches)

Item #

SeriesDescriptionPart#

Sizes L x W x H

Power HandlingRange

RP92010T0050GTTR

5.08 x 2.54 x 1.02
(0.200 x 0.100 x 0.040)

10 Watt

50 Ohm±2%

2

RP92525T0050GTTR

6.22 x 6.22 x 1.02
(0.245 x 0.245 x 0.040)

20 Watt

50 Ohm±2%

2

RP42525R0050GTTR

6.22 x 6.22 x 1.02
(0.245 x 0.245 x 0.040)

20 Watt

50 Ohm±2%

2

RP43737R0050GTTR

9.40 x 9.40 x 1.02
(0.370 x 0.370 x 0.040)

40 Watt

50 Ohm±2%

2

RP42010R0100GTTR

5.08 x 2.54 x 1.02
(0.200 x 0.100 x 0.040)

10 Watt

100 Ohm±2%2

RP43725R0100GTTR

9.53 x 6.35 x 1.02
(0.375 x 0.250 x 0.040)

30 Watt

100 Ohm±2%2

RP82010T0050JTTR

5.08 x 2.54 x 1.02
(0.200 x 0.100 x 0.040)

30 Watt

50 Ohm±5%

2

RP83737T0050JTTR

9.40 x 9.40 x 1.02
(0.370 x 0.370 x 0.040)

150 Watt

50 Ohm±5%

2

RP31005R0100JTTR

2.54 x 1.27 x 6.35
(0.100 x 0.050 x 0.025)

5 Watt100 Ohm±5%2

RP33737R0100JTTR

9.40 x 9.40 x 1.02
(0.370 x N0.370 x 0.040)

250 Watt

100 Ohm±5%

2

RPA Series Flange
Mount Terminations

RPA0300T0050JNBK

7.62 x 5.08 x 2.59
(0.300 x 0.200 x 0.102)*Add flange dimensions
per catalog

20 Watt

50 Ohm±5%2

RP6 Series
Flange Mount
Resistors

RP60300R0100JNBK

7.62 x 5.08 x 2.59
(0.300 x 0.200 x 0.102)*Add flange dimensions
per catalog

20 Watt

100 Ohm±5%2

RP9 Series Surface
Mount Chip
Terminations

KIT-RP001
RP4 Series Surface
Mount Chip Resistors

RP8 Series
Chip Terminations
KIT-RP002
RP3 Series
Chip Resistors

KIT-RP003

36

Resistance
Value

Tol.

Qty

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

– high power resistive products –High Power Resistive Products
Resistive Products Tape and Reel Specifications
RESISTIVE PRODUCTS QUALITY ASSURANCEKYOCERA AVX is an ISO 9001 registered company that is dedicated to theContinuous Process Improvement for all of its products in order to satisfy theneeds and expectations of its customers.

TAPE AND REEL SPECIFICATIONSAll KYOCERA AVX Resistive Surface Mount and Chip Products are suppliedin tape & reel (1000 chips per reel) and are ideal for automated pick andplace manufacturing applications.

PACKAGINGTAPE DIMENSIONS
Thickness: 0.1 (0.004) Max.

øø

Embossed Cavity

D 0.10(0.004)øøEmbossed Carrier

mm (inches)

Chip
Size

A
Dim.

B
Dim.

C
Dim.

D
Dim.

E
Dim.

F
Dim.

H
Dim.

I
Dim.

Pcs. / per
reel

1206
2010
2525
3725
3737

8.13 (0.320)
11.9 (0.469)
11.9 (0.469)
15.2 (0.598)
24.0 (0.945)

2.03 (0.080)
3.05 (0.120)
7.11 (0.280)
7.11 (0.280)
10.4 (0.409)

4.06 (0.160)
4.06 (0.160)
8.13 (0.320)
8.13 (0.320)
11.9 (0.469)

3.56 (0.140)
5.59 (0.220)
7.11 (0.280)
9.91 (0.390)
10.4 (0.409)

3.56 (0.140)
5.46 (0.215)
5.46 (0.215)
9.91 (0.390)
11.4 (0.449)

1.78 (0.070)
1.78 (0.070)
1.78 (0.070)
1.78 (0.070)
1.78 (0.070)

0.08 (0.003)
1.78 (0.070)
1.78 (0.070)
1.78 (0.070)
1.78 (0.070)

0.254 (0.010)
0.254 (0.010)
0.254 (0.010)
0.254 (0.010)
0.254 (0.010)

1000
1000
1000
1000*
1000*

Orientation – all input terminals face towards the sprocket holes of the tape.
*500 pc. reels are available in these sizes.

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

– high power resistive products –37

High Power Resistive Products
Resistors and Terminations: Mounting and Attachment Recommendations
CHIP ATTACHMENT AND PC BOARD RECOMMENDATIONS
For the mounting of chip or leaded devices, it is important to obtain a good solder joint between the device’s ground plane and the heat sink that is free of voids.
Pre-tinning of the device’s ground plane and the heat sink is recommended. The following are KYOCERA AVX recommendations:
PC board: Rogers Corp. 4350 or FR4; 30 mils thick; 1/2-oz. (0.7-mils-thick) copper cladding

Rectangular via array

Triangular via array

Figure 1: Rectangular and triangular via arrays• Pattern: Rectangular array. Notes – There are two possible uniform patterns, designated Rectangular Array and Triangular Array respectively. For
optimum design, it must be determined which pattern places the most via holes under a chip. This consideration can become fairly complex, since viasthat are even partially under a chip can still contribute significantly to heat conduction. KYOCERA AVX has developed some useful algorithms to aid
in optimum via-patch design; customer assistance is available from the factory. For most – but not all – situations, the rectangular array yields better
results than its triangular counterpart.
CHIP RES. OR TERM.
Cu PLATING

Cu FOILON SUBSTRATESOLDERSOLDER-FILLED
PLATED-THRU HOLE

Cu CARRIER

CROSS SECTION OF TYPICAL VIA HOLE
mm (inches)

ASSUMPTIONS
Hole Dia
0.41 (0.016)
thick_Cu_Plate 0.05 (0.002)
kth_sub
0.02 W/(in ºC)
thick_sub
0.76 (0.030)
k_sol
1.290 W/(in ºC)

thick_sol
kth_cuthick_Cu_foil
theta_1via_hole

0.05 (0.002)
9.9 W/(in ºC)
0.02 (0.0007)
35.1ºC/Watt

Figure 2: Via-hole cross section and parameters

Via holes: See Figure 2. Structure – plated through with 2-mil copper, filled with Sn62, Sn63 or Sn96 solder; Diameter = 16 mils; edge-to-edge spacing =0.5 x diameter = 8 mils; Notes – The minimum via hole diameter is gener-ally a function of board thickness and is related to “walking” or breaking of the drill
bit. The maximum via-hole diameter relates to the ability to wick up solder to the via’s full length. Different PC board fabricators will have different design
rules that apply.

38

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

– high power resistive products –High Power Resistive Products
Resistors and Terminations: Mounting and Attachment Recommendations
VIA HOLE CALCULATIONS FOR SURFACE MOUNT RESISTORS AND TERMINATIONS
The calculated thermal resistance of each via, with the assumptions inFigure 2, is 35ºC/Watt. Table 1 and Table 2 below present calculated
performance parameters of KYOCERA AVX’s standard via patches forvarious sizes of RP9-style SMT chip terminations and RP4-style SMT
chip resistors.

Table 1: Calculated Via-Patch
Performance for RP9-Style Terminations
mm (inches)

Assumptions:
1. No lateral heat transfer on surface.
2. Board is solder attached to an ideal heat sink.
3. Thermal resistance of each via is 35ºC/Watt.
NOTE: The screws shown are not calculated in the tables.

Chip TypeRP9Size (L X W)

Rated
Power
of Chip(Watts)Numberof ViasThermalResistanceof Board(°C/Watt)

5.08 x 2.54 (0.200 x 0.100)
6.35 x 6.35 (0.250 x 0.250)
9.53 x 6.35 (0.375 x 0.250)
9.53 x 9.53(0.375 x 0.375)

10
20
30
40

30
88
132
204

1.17
0.40
0.27
0.17

Temperaturedrop acrossboard at
rated Power
(°C)
11.7
8.0
8.1
6.9

Filled via holes
0.25 (0.010) min. dia.

Surface-mounted chip RP9 Thermination
Conductor pad
5.08 (0.200) typical larger
than the component
Figure 3

Table 2: Calculated Via-Patch
Performance for RP4-Style Resistors

Assumptions:
1. No lateral heat transfer on surface of board.

mm (inches)

2. Board is solder attached to an ideal heat sink.
3. Thermal resistance of each via is 35ºC/Watt.

Chip TypeRP4Size (L X W)

Rated
Power
of Chip(Watts)Numberof ViasThermalResistanceof Board(°C/Watt)

5.08 x 2.54 (0.200 x 0.100)
6.35 x 6.35 (0.250 x 0.250)
9.53 x 6.35 (0.375 x 0.250)
9.53 x 9.53(0.375 x 0.375)

10
20
30
40

20
48
96
144

1.75
0.73
0.36
0.24

Filled via holes
0.25 (0.010) min. dia.

Temperaturedrop acrossboard at
rated Power
(°C)
17.5
14.6
10.8
9.7

Ground plane
Ground plane

Surface-mounted chip RP4 Resistor
Figure 3

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

– high power resistive products –39

High Power Resistive Products
Resistors and Terminations: Mounting and Attachment Recommendations
ATTACHMENT RECOMMENDATIONS FOR LEADED RESISTORS AND TERMINATIONSWhen mounting chips, the solder interface to the mounting surface has a
crucial bearing on performance. Even with very careful soldering technique,voids (porosity) and de-wetting are difficult to avoid. Using Scanning Acoustic
Microscopy (SAM), radiographic analysis, and metallographic sectioning,
KYOCERA AVX has studied solder joints made with a variety of techniques.
One result is that where typical surface mount assembly techniques areused, such as those involving solder paste, porosity levels of 10–25% should
be expected. Note that this directly transfers to the power rating of the part,i.e., its power handling capability will decrease in approximately the same

proportion.
Here are some suggestions to improve solder joint integrity:
Avoid the use of hold-down clamps or springs. Loading the solder incompression during melting forces it out of the bond area and does not
permit the “Z” direction movement required during solidification to reduceshrinkage porosity. Further, the thermal mass of the hold-down fixture may
cause a lag in temperature, resulting in a cooler part and loss of solder inthe bond area when the chip eventually reaches the correct temperature.
(KYOCERA AVX solder type recommendations Sn62 or Sn96.)

Filled via holes
0.25 (0.010) min. dia.

Conductor pad
5.08 (0.200) typical larger
than the component

Ground plane

Heat Sink/Ground plane

Figure 5: PC Board Mounted Chip Resistor

Filled via holes
0.25 (0.010) min. dia.

Conductor pad
5.08 (0.200) typical larger
than the component
Figure 6: PC Board Mounted Chip Termination

40

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

– high power resistive products –High Power Resistive Products
Resistors and Terminations: Mounting and Attachment Recommendations
ATTACHMENT RECOMMENDATIONS TO GROUND PLANE
FOR LEADED AND FLANGED RESISTORS AND TERMINATIONS
Avoid introducing solder to the entire bond area prior to soldering, i.e. do not
use a solder pre-form the same size as the entire resistor chip. Solder preform should be 5-10%smaller in size than the device’s ground plane. Porosity
reduction is enhanced by permitting the solder to wick through the joint area
by capillary action, preferably from a central location.

of the chip, with RMA flux applied to both chip and mounting surface. This
process has been shown to result in porosity levels of 8-12%; optimized
solder volumes may yield even better results.
Table 3: Recommended Solders

Reduce the soldering time (temperature above solder melting point) to 2030 seconds maximum in order to avoid scavenging of the silver plating,intermetallic formations, solder melting point alteration, etc. Reasonably
good results have been achieved at KYOCERA AVX using lengths of solid
Sn96 (Sn96.5/Ag3.5) wire, about 0.030” in diameter, placed in the center

Alloy

Sn62
Sn63
Sn96

Composition

62.5 Sn, 36.1
Pb, 1.4 Ag
63 Sn, 37 Pb
96 Sn, 4 Ag

SolidusLiquidus

179°C

179°C

183°C
221°C

183°C
221°C

Chip resistor

Printed circuit board
copper cladding,
1 oz. min., 2 oz. preferred

Resistive film
Tab
Microstrip substrate

Ground plane

Tab
Chip
Resistor

Microstrip substrate

Ground plane

Figure 7: Ground plane Mounted Chip Resistor

Figure 8: Ground plane Mounted Chip Termination

FLANGED RESISTORS AND TERMINATIONS
Solder
PC board

is dissipated and transferred to the housing and PC board. Seat the device
into the ther-mal grease and install screws with lock and flat washers, torqueas specified.

Tab

Al2O3 cover
AlN chipFlangeHousingFlat, lock washer & screw

The area under the device should be flat to less than 0.001” and free of burrs
and scratches. For maximum heat transfer from the device to the heat sinkuse either thermal grease or a thermal gasket. Keep the thickness of thegrease to less than 0.002”. Be sure to form a small loop in the tab, making
sure you support it while doing so. This will act as a strain relief as the heat

Thread No.

Mounting Torque4-40

6 inch-lbs.

6-32

8 inch-lbs.

8-32

2 inch-lbs.

10-24

18 inch-lbs.

Position the tab over the circuit and solder in place.

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

– high power resistive products –41

High Power Resistive Products
Resistors and Terminations: Engineering Guidelines
DESIGN, MEASUREMENT AND PERFORMANCEAs the wireless revolution extends component requirements upward in
frequency, higher in operating power, and smaller in size, performance
demands on resistive devices grow ever more stringent. Chip terminations
made with resistive films are typically used as dummy loads or to absorb
power that appears at the normally isolated ports of circulators, couplers,and hybrids as a result of mismatches, imperfect directivity, or imbalances
somewhere in the system, while chip resistors perform the same function
in Wilkinson power dividers. Reliable design places conservative limits on
the maximum temperature of the resistive film and uses substrate materials
that closely match the film’s coefficient of thermal expansion (TCE).
Limiting the resistive film’s temperature requires an insulating substrate withhigh thermal conductivity. Other desirable properties include temperatureindependent (over a reasonable range) dielectric constant at microwave
frequencies, physical strength, good adhesion to film resistive materials,
and imperviousness to humidity and processing chemicals used in
microelectronic assembly. For many years in the USA, beryllium oxide (BeO)
has been the substrate of choice to meet these requirements – despite thefact that BeO dust and powder are known to be hazardous and to require
special handling and disposal techniques. The international community,
however, has opposed the use of BeO, and so in recent years an alternatematerial, aluminum nitride (AlN), has found increasing use as a substitute.
Table 1 compares typical properties of AlN to BeO; data for 99%Alumina is
included for reference.
Our focus herein will be on the Aluminum Nitride resistive product line
developed at KYOCERA AVX and will discuss design considerations andtest methodologies for bare chips as well as those mounted in various
configurations.

Thin-film coatings are typically applied by sputtering or evaporation.1 In thelatter process, a source material is heated in an evacuated chamber until
its vapor pressure is close to 10-2 torr and source atoms evaporate onto a
nearby target substrate. In the former process, the substrate to be coatedand a target made of the material to be sputtered are placed in a chamber
filled with inert gas at low pressure. An arc is struck in the gas, with thesubstrate placed at ground electrical potential and the target at a highnegative potential. The target’s high potential causes it to be bombarded
by positive gas ions in the plasma, to the point where atoms (or molecularfragments) are dislodged that migrate and adhere to the substrate. Typical
thicknesses of sputtered materials are in the hundreds or low thousandsof angstroms; greater thicknesses are achieved by plating up, a separate
process. KYOCERA AVX’s current implementation for most resistive
products is in sputtered thin film. Conductors are silver-plated copper; theresistive material is tantalum nitride. Different resistivity values are achievedby controlling the Ta2N thickness and the way in which it is annealed. An
important feature of tantalum nitride is its (so-called) anodic property: By
either electrical or thermal means a surface oxide layer can be created thatacts to seal and protect the underlying film. As with thick film, final resistancevalues are usually achieved by laser trimming.
Figure 2 depicts a chip termination. Terminations usually have two features
not found on simple resistors: an edge wraparound that connects one endof the resistor to the ground plane and a structure or pattern that matches
the impedance of the resistive film to some specified value, most commonly
50 ohms.

A

TABLE 1:
Physical Properties of Aluminum Nitride and Beryllium Oxide
Property
Dielectric constant @ 1 MHz
Loss tangent @ 1 MHz
Thermal conductivity (W/mK) @ 25°C
@ 100°C@ 200°C
Thermal expansion coefficient (10–6/°C)
Density (g/cm3)

AIN

BeO

9.0
0.05
180
150
125
4.2
3.30

6.7
0.04
275
200
15 0
7.2
2.85

Al203,
99%
9.9
0.04
25
—
—
7.1
3.89

Resistive
film
A

Impedancematching
structure

Figure 1 depicts a basic chip resistor consisting of a resistive film between
two conductive terminations. A conductive ground plane covers the chip’s
bottom side. The chip body, or substrate, is comprised of AlN.

Ground planeA

Conductive
contact

Ground plane
Resistive
film
A

WraparoundFigure 2: A Chip Termination

Typical thick-film thicknesses are on the order of 0.5–1.0 mils. Silver,
platinum-silver, or palladium-silver are industry standard conductors;
ruthenium dioxide is a typical core material for the resistive paste. Different
resistivity values are achieved by changing the resistive paste composition– the proportion of resistive particles, glass frit, and organic binder – and byaltering or augmenting the curing cycle. Final resistance values are achievedby active trimming, usually with a laser.

42

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

– high power resistive products –Section A-A

Figure 1: A Chip Resistor

STRUCTURES, IMPLEMENTATIONS, AND
CONFIGURATIONS

In general, the chip’s resistive section and conductors can be implemented
in either thick-film, thin-film, or some combination of technologies. As used
here, the terms thick and thin refer to the fabrication process, as well as
the resultant film depth dimension. In thick-film technology, a conductive or
resistive paste is applied to the substrate using a screen printer. The paste isthen cured according to a prescribed time-temperature cycle.

Conductive
contact

Section A-A

High Power Resistive Products
Resistors and Terminations: Engineering Guidelines
Both resistors and terminations are available in several different package
styles. Those shown in Figs. 1 and 2 are meant to be mounted (usually
by soldering) to a metallic ground plane, either in a cutout in a microstrip
board or adjacent to a board edge (see Figure 3a). The contact area on
the chip has a silver tab parallel-gap welded to it; the free end of the tab
is soldered to the microstrip trace. Heat generated in the resistive film isconducted by the chip substrate to the ground plane. Other configurations
are designed to avoid the necessity of a cutout or proximity to a board
edge; these are so-called surface mount parts and are typically soldered
to a via-patch on the PC board’s top surface. The via patch transfers thegenerated heat to the ground plane (see Figure 3b). A schematic overview
of the various chip configurations and their designations is shown in Figure
4. Note that the RP5 style has no ground conductor; heat from the resistive
film can be removed only through the end contacts, by convection, or byradiation. In practice, all resistive films are covered with a thin layer of a
special epoxy that helps protect against solvents, moisture, handling, andother environmental hazards. Other packaging options (not shown) include
ceramic covers for additional environmental protection and marking, andflange mounts that enable parts to be screwed down to mounting surfaces
rather than soldered.
Resistive film

Tab

Chip
termination

Microstrip substrate
Ground plane

Resistive chip design must simultaneously consider properties (1) through(5) because of the tradeoffs involved. In practice, two problems arise, usuallywith (1), (2), and (5): End-users fail to precisely define the measurement
conditions and vendors do likewise with their specifications.
• Vendor power ratings, for example, are usually given for parts mounted
on “an ideal heat sink” or “an infinite heat sink” without explanation as tohow a user can de-rate the part for operation on a real heat sink – or, forthat matter, how the vendor arrived at the rating in the first place.
• It will be shown that temperatures vary along both film and mounting
surfaces, yet virtually no one states exactly at what point the mounting
surface temperature was, or ought to be, measured.
• Devices with ceramic covers make end-user film temperature
measurements impossible.
• End-users are most often concerned about aging with RF power applied,
whereas vendors typically use DC in their testing – and, in general, it
makes a difference.
• End-users may specify VSWR, but not precisely define the interface
between the resistive device and their board, e.g., Is the board thicker or
thinner than a termination’s substrate? Is the user’s trace wider or narrower
than the termination’s tab? What is the substrate dielectric constant? Is
the tab being bent to provide strain relief? Etcetera. All of the above affectthe actual VSWR that the user will measure. Vendors are often equallyvague about the test conditions under which they determined the device’s
specifications.

Style

DeviceRP9termination

RP8

termination

RP3

resistor

RP4

resistor

RP5

resistor

Figure 3a: Ground plane-mounted chip

Resistive filmChiptermination

Via patch

Microstrip substrate
Ground plane

Figure 3b: Surface-mounted chip

SPECS AND SPECMANSHIPThe thermal and electrical properties of resistive chips are intimately
related, and very often can be traded off against one another. Among thoseimportant to end-users are:
1. Resistance change over time (long term)
2. Maximum temperature reached by the resistive film
3. Resistance change with temperature (short term)
4. Resistance change with applied voltage (short term)
5. Reflection magnitude (VSWR) vs. frequency (terminations)or capacitance (resistors)
Property (1), variously termed “aging” or “stability” or “life,” refers to achange in the value of resistance that typically occurs over hundreds or
thousands of hours of operation. It depends on the temperature reached by
the film (which, among many factors, in turn depends on the properties ofthe mounting surface) and may depend on applied voltage as well. Property(2) may affect the lifetime or behavior of other devices in proximity to theresistive chip. Properties (3) and (4) are generally short-term – e.g., change
occurs over a few minutes – measures of stability, usually presented as
TCR, the Temperature Coefficient of Resistance and VCR, the Voltage
Coefficient of Resistance. Property (5) is a fundamental measure ofelectrical performance needed for operation of the circuit or sub-system inwhich the resistive chip is used.

Figure 4: Resistor and termination styles

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

– high power resistive products –43

High Power Resistive Products
Resistors and Terminations: Engineering Guidelines
In an informal survey of large-volume users of resistive devices, the following
comments were made when respondents were asked what criteria theyused to evaluate vendor claims about the supplied product:“We do no incoming inspection. We just put it in our system, blast it withpower, and see if it survives. Beyond that, we just rely on manufacturers’
test data.”“Regardless of vendor, we operate at a maximum of half their claimed power
rating. Vendors almost never say what the maximum film temperature
should be. For measurements on flanged parts, we put a thermocouple on
top of the flange, as near to the part as possible.”“We are more interested in maximum film temperature than aging. We verify
the film temperature using thermal imaging [camera]. We will sometimes
ask the vendor for de-capped parts. We locate our mounting-surface
thermocouple at some point away from the device.”“We locate our ambient-temperature thermocouple under the part
underneath the heat sink. We apply the maximum rated RF power for several
thousand hours and check the temperature with an IR scanner. Failure isdefined as aging beyond the specified tolerance at room temperature.”
The vagueness and lack of consistency in user requirements and test
methods make it difficult for a meticulous supplier to decide on rational
design and test criteria, and correspondingly makes it easier for lessmeticulous vendors to specify and furnish their product. As a member ofthe meticulous supplier group, KYOCERA AVX has attempted to evolve a setof logical design steps and precisely defined test methodologies that will
facilitate customer evaluation of our products.

DESIGN STEPS: A SUMMARYa) Select a thin- or thick-film implementation of the resistor and specificmaterials.
b) Determine the aging characteristics of the film at various temperatures
and applied voltages.
c) For a given design, determine whether temperature or voltage will be
the limiting factor in aging. Note that the two effects may be interactive:
Voltage aging may have a temperature dependency.
d) If film temperature must be held below a certain value with a specified
maximum applied power, determine, with the known properties of thesubstrate, the minimum film area needed to achieve this. For resistors,
this will also determine the film capacitance to the ground plane.

to be a de facto industry specification, although the governing militaryspec, MIL-pRf-55342 calls out 2000 hours. Measurements were made at
two different temperatures and were repeated on AlN supplied by different
vendors (not shown), and on substrates from the same vendor but having
different average surface roughnesses. In general, resistance change during
aging, ∆R/R when expressed as a percentage of initial resistance, followed
the formula predicted by theory,1

(1)
where
t = time
t0 = a characteristic time that depends on film material
T = film temperature
T0 = a characteristic temperature of the material
RS = sheet resistanceA = a constant dependent on the method of anodizationn = exponent determined by temperature range
There are a few features to note about the plots and about Ta2N resistive
films in general:• The aging mechanism due to heat is caused by oxidation of the film; theoxide layer begins at the surface exposed to the air, deepens with time
and temperature, and forms a tough protective barrier.
• Thinner films, i.e., ones with higher surface resistivities, age more quickly
than thicker films, since a larger percentage of their thickness will oxidize.
• Surface roughness affects aging; the lower the roughness, the less theaging. Since polished substrates are more expensive than lapped or asfired substrates, there is a cost-performance tradeoff.
• From the tests on substrates made by different manufacturers, it was
found that unknown surface properties other than average roughness
affect aging; different brands having identical surface roughnesses
produced different aging. This may relate to the fundamental conduction
mechanism postulated for Ta2N films: substrate-assisted tunneling – andproperties such as grain size, grain agglomeration, and impurities.

e) Determine the film dimensions and impedance matching structureneeded to achieve the specified reflection or capacitance.

20-40 microinch RA, 200ºC< 2 microinch RA, 200ºC
20-40 microinch RA, 150ºC< 2 microinches RA, 150ºCf) Perform design iterations as necessary to accommodate the many
practical product constraints, e.g., overall chip size, space required fortab contact, need for a ceramic cover, film dimensional changes resulting
from trimming operations, etc.
Due to our extensive background in thin-film materials and processes andthe many advantages of thin-films in the areas of uniformity, reliability, andtight-tolerance capability, KYOCERA AVX has chosen this implementation
for its initial group of resistive products. We will proceed with a discussionof design steps B through F above; the motive here is to acquaint the reader
with some of the tradeoffs involved so that one can determine what is and is
not achievable and what specifications may be important in operational use.
Test methodologies will be discussed in separate sections.

Time (hours)

Figure 5: Normalized percent resistance changeof TaN oven-aged resistors

AGING OF TANTALUM NITRIDE THIN FILMS
Oven Aging
Figure 5 shows the average measured change in resistance of four groupsof ten each Ta2N thin-film resistors placed in an oven – no applied power tothe resistors – and aged for 1000 hours. The latter number of hours appears

44

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Resistors and Terminations: Engineering Guidelines
he question may now be asked, is aging under powered conditions the sameas oven aging? We have already alluded to the possibility of an aging effectwith applied DC voltage, but what about AC? The answer is that AC power
aging and oven aging tests have shown that current flow in the resistor does
not appear to contribute to the change of resistance other than by raising thetemperature of the film through the dissipation of heat.

RP32525T0100G Resistance change vs. TimeDC Power applied = 60 Watts; Max. film temp approx 137ºC

Aging with applied AC power
Figure 6 shows the average measured change in resistance of four 100-ohm,
60-Watt resistors selected at random from a production run and 60-cycleAC power-aged for 907 hours. The test was done in accordance with MILPRF-55342, which requires power to be applied for 90-minute intervals
alternating with power-off periods of 30 minutes – except that the Mil spec
requires DC instead of AC. In order to magnify changes, sufficient power
was applied to heat the resistive films to peak temperatures of about 190°C;
this required about 100 watts, well in excess of the 60-watt maximum rating.
The top curve shows the raw data; average resistance change was about
4.9%. The lower curve shows the data normalized to a 50-ohms/square
resistivity, i.e., the resistance change was scaled by the ratio of actual film
resistivity, 72 ohms/square, to 50 ohms/square using equation (1). Since
the substrate used had an average surface roughness of 2040 microinches,
the lower curve should be comparable to the 200°C oven-aged result forthis substrate shown in Figure 5.
The results are indeed close; oven aging (1000 hours, 200°C) produced a
3.4% change, AC power aging (907 hours, 190°C, peak) produced a 3.4%
change. This good agreement, however, is somewhat misleading. In addition
to the slightly different test times, there are uncertainties connected withthe production resistors that make the exact comparison less accurate: (1)Their area-average temperatures were less than the peak temperatures; (2)their exact surface roughness had a range of 20 microinches; and 3) theirwidths were laser trimmed by amounts ranging from 0-20%.
We can conclude this from the experiments: Both oven aging and AC power
aging cause resistance to increase with time; if the respective average film
temperatures are fairly close, the percentage resistance increases are likely
also to be close. It should be noted that when the production resistors areoperated at their maximum rated power of 60 watts, they will age much lessthan they did at the 100 watt level.
RP32525T0100G Resistance change vs. Time.
AC Power applied approx. 100 Watts; Max film temp approx. 190ºC

Figure 7: Percent resistance change of TaN resistors
with applied DC power

Aging with applied DC power
What now of aging effects due to the application of a DC voltage? Figure
7 shows the average measured change in resistance of three 100-ohm,
60-Watt resistors selected at random from a production run and DC poweraged – this time exactly in accordance with MIL-PRF-55342 – for 490 hours.
The top curve shows the raw data; maximum resistance change was about-0.22%. The lower curve shows the data normalized to a 50-ohms/square
resistivity, i.e., the resistance change was scaled by the ratio of actual
film resistivity, 72 ohms/square, to 50 ohms/square using equation (1).
The meaning of the scaling here is ambiguous, since resistance change is
now seen to occur as a result of two separate effects: Heating – to which
resistivity scaling applies by virtue of (1) – and a DC voltage sensitivity
resulting from unknown causes. The latter phenomenon is common in thickfilms and is believed to result from an agglomeration of small conductive
particles, under the application of a DC potential, into lower resistancelarger particles. However, a corresponding thin-film mechanism does notseem to be reported in the available literature. Nevertheless, KYOCERA AVX
has observed it experimentally on substrates from a number of different
vendors and having a variety of surface roughnesses. The salient feature isthat this effect causes resistance to decrease with time, whereas thermal
effects cause it to increase. We can infer from Fig. 7 that the DC aging effectdominates for the first 170 hours, after which the thermal effect becomessignificant. The fact that the two phenomena yield resistance departuresin opposite directions helps to generate good results on the Mil spec test
– although it must be cautioned that AC-only use could produce greaterchanges. Absent specific knowledge of customer use, KYOCERA AVX
performs its standard aging test with DC applied per the Mil spec.

Time (hours)

Figure 6: Percent resistance change of TaN resistors
with applied 60-cycle AC power

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High Power Resistive Products
Resistors and Terminations: Engineering Guidelines
FUNDAMENTAL ELECTRO-THERMAL PERFORMANCE
LIMITATIONSPower handling vs. resistor capacitance-to-ground
Assuming, from the aging tests, that the designer now knows the maximum
film temperature allowable at full applied power, it must now be determined
how to insure it is not exceeded -and what limitations it imposes onelectrical performance. Figure 8 shows the heat flux in a chip termination.
We begin with three simplifications to establish an elementary thermal
model: (1) The heat is generated uniformly everywhere in the film; (2) theheat flow is one-dimensional – no spreading –from the film to the bottomof the chip, which is assumed at ambient (thermal ground); and (3) there
is no convective or radiative heat flow. Concerning (1), we know that thecurrents in the film tend to be edge concentrated – much more so the lower
the resistivity – and so there will be more heat generated at the edges thanat the center. Nevertheless, we expect the approximation to be quite goodfor film geometries where the length and width are substantially greaterthan the substrate thickness and for the range of film resistivities typicallyencountered in RF applications. Additionally, we are not considering tapers,
wherein the width of the film and hence the power dissipated at any crosssection may vary along its length. Concerning (2), it is understood that there
is indeed thermal spreading, not only from the front face of the film -heatflow lines shown dotted in Figure 8 – but from the lateral edges as well.
Thus, the second and third assumptions are thermally conservative – there
will be additional heat paths beyond those accounted for – while the first willneed further investigation since edge-located hot spots could develop at RFthat would not be revealed in DC tests.
L

Let us consider a practical example: We will assume an ambient temperature,TA, of 50°C. We further assume a 40-mil chip thickness – for mechanicalstrength and substrate availability at moderate price – and seek to limit the
maximum film temperature to 150°C. Using the thermal conductivity of AIN
at 200°C (see Table 1), and setting P = 20 watts, we find from (2) that to limit
T to l50°C max. (100°C above specified ambient) requires a film area of 2624
mils2. For P = 200 watts, the film area is 26,240 mils2.
We next examine what conditions insure that our film behaves as a constantresistance through the highest operating frequency. As is well known, skineffect causes currents to decrease inside conductors, thereby increasing
their effective resistance as frequency increases. For a flat plane conductorof finite thickness, D, it may be shown² that if the conductor thickness is 1/2
the skin depth, the conductor will have virtually the same resistance as its
DC value. Skin depth (m.) is given by,

(3)
where
ρ = resistivity of film (ohm-m.)
f = frequency in Hertzµ = permittivity of film (henry/m.)
As noted for thick-film implementations, Tf, the film thickness, is typicallyon the order of 0.5 mils. If we set δ = 2Tf = 1.0 mils = 2.54 x 10-5 m., we may
solve (3) for p at the highest operating frequency, Fhi. Let us choose Fhi =6.0 GHz. The result is that values of ρ ≥ 15.3 x 10-6 ohm-m. yield skin depths≥ 1.0 mil.
The low frequency resistance (ohms) of the film is given by,(4)

W

ceramic chip

resistive film
Tf

D

Heat flow

Figure 8: Chip termination showing heat flux

The basic formula for one-dimensional steady state heat flow is given as:

where
L = film length (m.)
W = film width (m.)
Df = film thickness (m.)
For a 0.5 mil thick square film, this corresponds to RL ≥ 1.5 ohms/square.
Since film pastes are readily available in resistivity values ranging from 10
to 1000 ohms/sq., this does not pose severe limitations for most present
applications. It may also be seen that thin-film implementations, which
typically have film thicknesses ranging from 450-2250 Angstroms, willclearly not exhibit any significant skin effects up to much higher frequencies
than thick films.
In our example, we assumed a 40-mil thick substrate; we may now ask what
would be the consequences if we’d chosen another value. Equation (2), after
all, indicates that with thinner substrates the temperature rise would be less.
The consequences are revealed, however, when we write the expression for(one dimensional, i.e., no electrical fringing fields) film capacitance to theground plane:

(2)

(5)

where
T = Temperature of film (°C)

where

TA = Ambient temperature (°C)ε = relative dielectric constant

D = Substrate thickness (meters)Thus, the thinner the substrate, the greater the film capacitance to ground. If
we now solve (2) for P, the power dissipated in the film, and take the ratio of
dissipated power to capacitance, we get

P = Power dissipated in film (Watts)
A = Area of film (square meters)

Cg = Capacitance to ground plane in pF

k = Thermal conductivity (Watts/m°C)(6)46

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Resistors and Terminations: Engineering Guidelines
This tells us that, for a given temperature rise limit, ∆T, the ratio of
dissipated power to capacitance is a constant, dependent only on two
physical properties of the substrate material, and not on the substrate
thickness or film area. Stated alternately, Power handling is directly
proportional to capacitance to ground. Since, as will be shown below,
capacitance fundamentally limits electrical performance, the quantity M =kε from (6) may be taken as a figure of merit of a substrate. Using the valuesof Table 1 at 200°C, MBeo = 22.4, MAIN = 13.9, and MBBO/MAIN = 1.6. Thus,
beryllia would always be the substrate of choice over aluminum nitride –were it not for the former’s toxicity.

We recognize this as the admittance of the circuit shown in Figure 9. The
inductance and capacitance both impose limits on how well matched we
can make the termination over a given bandwidth.

RTH Cg = 8.85 εk ,where the thermal resistance,

RTH = ΔTP

Figure 9: Low frequency lumped equivalent circuit
for short-circuited lossy line

(7)

thermal ε resistanceThus, the product of the chip's
and electrical
capacitance to ground is a constant inversely proportional to the substrate
figure of merit.
Capacitance-to-ground vs. termination input reflection
We may now examine the effect of capacitance on electrical performance.
This is perhaps done most readily using a termination as an example. We
begin by deriving an equivalent circuit for a shorted section of lossy line.
This given by,

In the late 1940s, H.W. Bode considered the problem of impedance matchingtwo-element RC or RL loads.3 Bode's work was extended and generalized
by Fano4 in 1950; Fano presented the limitations on impedance matching
any load over an angular frequency range, wa to wb. However, for illustrative
purposes, let us consider the case analyzed by Bode, i.e., where the inductive
reactance is so much less than the value of the resistance at the highest
frequency of interest that we can neglect the inductance altogether. For
further simplicity, we take the lower frequency as zero (DC). Then, applying
Bode's formula to the circuit of Fig. 9, the best possible results are limited
as indicated by

(8a)

(8b)
(8c)
R, L, G, and C are respectively the resistance, inductance, conductance, andcapacitance per unit length; w is the angular frequency = 2πf. For a low-loss
substrate such as AlN, G can generally be neglected compared to wC. To
obtain a lumped equivalent circuit for the shorted transmission line, we use
a power series expansion for coth x = 1/x + x/3 - x3/45 +... , where |x| < π.
Then, taking the first two terms of the series, (8a) becomes:(10)
Or, in words, the area under the curve ofvs. w can be no greater than

Substituting from (6),(11)
Equation (11) describes the best tradeoff that can be achieved between
power handling and area under the curve of In|1/Γ| vs. w. For a given
permissible film temperature rise: The higher the applied power, the lessthe area under the curve. If |Γ| is assumed constant over the band,= e -0.169 Tk
fbRoP
(9)

(12)

from DC through fb, and unity everywhere else.
It is seen that: (a) The higher the (applied) power-bandwidth product, thehigher the minimum achievable reflection for a given film temperaturerise; and (b) The higher the figure of substrate merit M = k/ε, the lower thereflection magnitude.
Note that (12) is a theoretical result that can be achieved only with an

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High Power Resistive Products
infinite number of matching elements. Real-world chips are subject to many
additional limitations including (but not limited to) having: (a) space for
only one or at most two matching elements; (b) inductances non-negligible
compared to the terminating resistance; (c) lengths that are not electricallyshort at operating frequencies; (d) tolerances on dielectric constant,thermal conductivity, and physical dimensions of matching elements;(e) film dimensions that require trimming to bring them into resistancespecification; and (f) protective cover films and ceramic lids that add
parasitic reactances. Thus, the reflection magnitude over a given frequency
band will be substantially higher than indicated by (12), but the qualitative
dependencies still apply.

Temperature (ºC)

Resistors and Terminations: Engineering Guidelines

POWER RATING:
DEFINITION AND CONFIRMATION
Before we can do a thermal design, we must first decide on exactly what weshall mean by “power rating” for a chip device. Figure 10 illustrates the heatflow around a mounted chip resistor. The resistive film, assumed to haveconstant power dissipation over its surface, behaves as an isoflux boundary,i.e., a source of uniform heat flux, rather than the isothermal boundary usedin the derivation of equation (2). Were the film to completely cover thechip, the isoflux case would approach the isothermal case, but absent thatcondition the heat spreads out as shown.
The thermal resistance between two points is defined as the temperature
difference between those points divided by the heat flow (typical units aredegrees Centigrade/Watt). It is analogous to electrical resistance, withtemperature corresponding to voltage and heat flux to current. Figure 10
indicates that there is vertical as well as lateral heat flow in both the ceramic
chip and the carrier it is mounted on. This implies that the system must be
represented as a lattice network of thermal resistances rather than a single
thermal resistance.

The above considerations bear importantly on how a chip is designed andcharacterized for power handling and exactly how confirming measurements
are made. Figure 12 indicates temperatures at a number of points on andaround a mounted chip: (a) T0, at the film centroid; (b) T1, at the film edge or
corner; (c) T3, on the mounting surface directly under the film centroid; and(d) T2, on the mounting surface 30 mils away from the chip edge. We canmake the following qualitative observations:

Film
SolderFlange or
carrier

resistive film
ceramic chip

Figure 11: Computer simulation of isotherms
around mounted chip resistor

Heat
flow

T0

T1

T2 , temperature atthermocouple
location
Mounting
hole

AlN

ThermalGreaseT3
30 mils

carrierHeat Sink

Figure 10. Heat flow around a mounted chip resistor(The latter can characterize only the kind of one-dimensional heat flow
assumed for equation (2).) Stated alternately, the temperature will vary
laterally along the film and, also, laterally along the mounting surface. Thisis illustrated in Figure 11, which was made using a “Finite Element Method”(FEM) computer simulation. In actuality, a three-dimensional latticeworkof resistors is needed to describe a mounted resistive chip, and there istemperature variation along all three dimensions.

Figure 12: Temperatures at a number of points on
and around a ground plane-mounted resistive chip

• Thermal aging will likely depend on the area-averaged temperature overthe film. The peak temperature has no particular significance – unless it
is sufficiently extreme to cause catastrophic failure.
• T0 is the temperature at the nominally hottest point on a film disposed
symmetrically on a chip – which is the case for resistors, but notterminations. The actual (as opposed to nominal) hottest film point may
be at a fault location – where the film was laser-trimmed, where there wasa thin spot or substrate pull-out, at the interface to the conductive contact– and can only be determined experimentally.
• Instruments without sufficient resolution, e.g., a thermal camera with a
30-mil diameter spot size, may not be able to accurately measure T0 or
any other hot spot, especially on large films where the temperature ischanging rapidly across the surface.

48

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Resistors and Terminations: Engineering Guidelines
An ideal heat sink has infinite thermal conductivity and, because of this, theinfinite thermal conductivity, T2 would equal T3 in Fig. 12. From Fig. 10 and
Fig. 11, this clearly is not the case for any real mounting surface; in fact, T3> T2.
One strategy for defining power rating might be to measure T3 directly – ordeduce it from a measurement of T2 and a computer FEM model – and thenspecify performance as if an ideal heat sink were held everywhere at thattemperature. By slicing a mounted resistor in half along its longitudinal axis –in Figure 12, perpendicular to the plane of the paper, down the centerline– we were able to take advantage of the lateral heat-flow symmetry tomeasure T2 and T3 for chips of several sizes and input powers. (The slice
plane is an adiabatic boundary, i.e., no heat flows across it.) Results of suchmeasurements are presented in Table 2. All chips were 40 mils thick andall measurements were made on a silver-plated high-conductivity copper
mounting surface (see the table for more information).
TABLE 2:Temperature difference between two points on mounting
surface of sliced resistive chips
Length(mils)
200

Chip

Film

Width
(mils)
84

Power
Applied(Watts)T3 – T2(°C)

Width(mils)
100

Length(mils)
146

30

5.7

250

250

196

112

60

12.9

375

250

321

184

150

15.3

Although measurements of the type made above can be performed in alaboratory environment, this approach is not practical for mass-production
testing. Thermal modeling presents an equal number of practical problems,
not the least of which is the considerable uncertainty in the material constants(thermal conductivity of AlN, solder, heat sink) for any particular mounted
chip. Further, in either case – and perhaps most importantly – the results
would be difficult, tedious, or impossible for end-users to confirm; in mostcases, they would have to “take our word for it,” hardly an enviable position.
Instead, KYOCERA AVX has decided on a set of defined measurement
conditions that are readily reproducible and that yield verifiable results. The
resulting power rating, of course, is lower than it would be on an ideal heatsink.
How we specify power rating• First, we must define the chip mounting conditions: Our tests are
conducted on large (1.2-inch x 1.05-inch, 0.188-inch thick) silver plated
C110 copper alloy carriers.
• Next, since our carrier does not have infinite thermal conductivity, wemust specify the exact location – T2 in Figure 12 – at which we holdthe ambient temperature constant. Typically, we choose this as 30 milsfrom the chip edge along its lateral centerline – an arbitrary, convenient
spot at which to solder a small thermocouple.
• Finally, we specify the measuring instrument: Temperature measurements
are made with a contacting fiber-optic thermometer – Luxtron Model
790 – that does not depend on emissivity for accuracy and that has ameasurement spot size on the order of 10 mils. in diameter.
Having specified the measurement conditions we are now ready to declare
how we establish the power rating of a given device:
With rated power applied and location T2 on the standard carrier held at a
specified ambient temperature, two conditions shall be met: (1) The first,
termed “power handling,” is that maximum film temperature shall not exceed
a specified value; (2) The second, termed “life,” is that the film resistancechange no more than a specified percentage during and after a 1000-hourburn-in per Mil-PRF-55342.
Typical values of parameters are: ambient temperature = 100°C; maximum
spot film temperature = 170°C; percentage resistance change ≤ 0.2%.
Having at last come to a definition of power rating, actual designs can now

be implemented.

THE DESIGN PROCESS
Resistors
The design process for resistors is relatively straightforward. Various chipsizes have become standardized in the industry, e.g., 0.200" x 0.100", 0.250"
x 0.250", etc. Chip thicknesses have become equally standardized; the threemost common are 25, 40, and 60 mils. Contact lengths are determined bymechanical constraints: exposed bonding areas – leaving room for film
coating overlap – needed to insure that tabs have sufficient pull strength.
In general, contact widths should be about the same as the film width;
the contacts are parasitic, that is, they contribute to capacitance (andinductance) without dissipating any heat. With the length of the film now
determined – chip length minus contact length – the width is chosen to yieldan area in accordance with the peak temperature and aging requirements.
There is, however, one complication: Be the implementation thick-film or thinfilm, there is always a spread of resistance values about any given nominal
target. In thin-film, a total spread might be 15%, i.e., if a target resistancewere 100 ohms, actual resistor values might vary from 85 to 100 ohms. For
safety in design, a spread of 20% is typically allowed. Since resistors areoften sold to ± 2% or tighter tolerances, in general, trimming will always be
required. While low-power resistors are often trimmed by cutting notches
perpendicular to the length dimension, current concentrations along theedges of such notches can result in local hot-spots. The result would beburn-out at high power RF inputs. Instead, KYOCERA AVX laser-trims
resistors by narrowing the width dimension symmetrically and uniformly
along the length. Thus, any design must accommodate width dimensions
that vary over a 20% range; i.e., a resistor trimmed to the maximum extent
must still meet all thermal and electrical requirements.
In order of increasing accuracy (and decreasing convenience), film
temperatures can be estimated by: equation (2) herein (no spreading); any
one of several formulas available in the literature that include spreading; oran FEM computer program. The term “constriction resistance” is used todescribe that component of thermal resistance over and above what would
be produced by purely one-dimensional heat flow.
Let us assume a perfectly conducting mounting surface in Figure 10, i.e., asurface along which there can be no lateral temperature variation. Then to
calculate the total thermal resistance from the film to the mounting surface,
one would compute the one-dimensional resistance of the chip with thefilm occupying its entire surface and then add the constriction resistanceto account for the lateral constriction of the heatflow. (Note, from the top
down the heat spreads and so the term “spreading resistance” is frequently
used, but from the bottom up the heat flow constricts.) There are several
expressions available in the literature for the constriction resistance of heatsources mounted on rectangular channels (“flux tubes”) with adiabatic walls,i.e., heat-producing films on chips that have no appreciable heat conduction
perpendicular to their sidewalls. One formula that yields constriction
resistance based on an average film temperature is5.
ψ= 0.475 – 0.62 + 0.13ε3Where,(13)

a dimensionless spreading resistanceRc = spreading resistancek = thermal conductivity
Af = area of film
ε = square root of ratio of film area to chip area
The problem with any of the above methodologies is that it is quite difficult
to accurately match experimental results with their predictions. The principal
reasons are uncertainties in the experimental data: the exact thermal
conductivity of the particular substrate being measured and its variation withtemperature, the exact thermal conductivity of the carrier, the integrity of thesolder joint between chip and carrier (see more about this later), the exact
positions of temperature measuring devices, etc. Thus, insofar as initial

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High Power Resistive Products
Resistors and Terminations: Engineering Guidelines
design efforts, methodologies beyond one-dimensional calculations are of
marginal utility. Of course, other insights that they provide, both qualitativeand quantitative, as well as tolerance study capabilities, may justify the extra
time and effort.
Capacitance to ground can be calculated, again in order of increasing
accuracy, using: (5) herein (no fringing); formulas available in the literature
for microstrip impedance (includes electric field fringing, but not substrate
truncation); or an Electromagnetic (EM) analysis program such as Sonnet
or Eagleware. The second alternative deserves some elaboration. The
standard formulas for the impedance of microstrip line assume an infinitely
wide substrate. A resistive chip, however, is fabricated as a substrate that istruncated at a certain distance from the edge of the trace. Thus, standard
microstrip impedance formulas could be in considerable error for resistive
films whose lateral edges approach the edges of the substrate. In general,
if the trace-edge-to-substrate-edge is greater than half the trace width,
impedance values will be affected by < 0.5%.6 Standard formulas for
microstrip characteristic impedance, Z0M, and group velocity, ν, are widely
available. The total capacitance to ground of the chip is then given by

Terminations
Termination design begins analogously to resistor design – input contact
length and edge-wrap-to-ground length must first be subtracted from thechip length to determine the available working space. But the latter now has
two required functions: to support a means of heat dissipation (i.e., resistivefilm) and to support an impedance-matching network. The resistive film
must then meet the following criteria:(1) Satisfy the peak temperature and aging requirements(2) Have an input impedance that can be readily matched by a simple oneor two-reactance network(3) Leave sufficient room for implementation of the matching network
Z0 sinh ( g l)Z0tanh (g l/2)Z0tanh (g l/2)

(14)
Figure 13a: Pi-equivalent circuit of lossy line

where l = length of film
lc = length of contact (assumed same width as film)
The equivalent circuit for a resistor may be derived by considering it as alength of lossy line. The admittance matrix for such a section is given by7

L1'

R0'

C1'

C1'

R0' = Rl
L1' = L(l + 2lC )C1' = C (l + 2lC )2Figure 13b: Equivalent circuit of chipresistor(15)
The pi-equivalent is shown in Figure 13a; when the electrical length, γl,becomes short and the approximations tanh γl = sinh γl = γl apply, the series(16)
while the shunt impedances are given by(17)

The interplay among (a), (b), and (c) above must usually be done utilizing
a number of iterative back-and-forth trials with both thermal and electrical
CAD programs. The chip layout – a truncated dielectric, protective coating,and (in some cases) ceramic cover – containing matching elements that
couple to each other and have large discontinuities, gives rise to impedancesthat cannot be accurately modeled with circuit-based programs (e.g.,
Touchstone) alone. Similarly, the thermal behavior of the non-centered film
plus wraparound cannot be accurately described by closed-form spreading
equations (e.g., (13) herein). Therefore, CAD suites must be used for bothaspects of design.
Typically, the length-to-width (aspect) ratio of the film is chosen so that its
input impedance can be incorporated into a low-pass filter structure. Figure
14 shows the equivalent circuit of a film plus matching network. The element
immediately preceding the film, L2, is an inductor, generally realized by anelectrically short (but often physically meandered) length of narrow (highimpedance) line. (Note that a strength of thin-film implementation is thatthe tolerance on the line width, and hence its impedance, can be controlled
very tightly; the result is an improved VSWR yield compared to a thick-film
design.) The input element, C2, which incorporates the contact, is a shunt
capacitor.

The equivalent circuit then becomes that shown in Figure 13b. (We neglect,as earlier, G compared to ωC.) Note that the circuit contains both inductanceand capacitance parasitics, though most vendors electrically characterize achip resistor only by the latter. C1' is then given by half the value calculated in(14), while L1' is given by

L2
C2

L1

R0

Cg

(18)
Note that to calculate the thermal and electrical effects of a protective
coating and/or ceramic cover, only an FEM thermal program and an EM
electrical program can do the job.

50

Figure 14: Equivalent circuit for matched termination

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Resistors and Terminations: Engineering Guidelines

Resistive film
Conductive film

WraparoundFigure 16: VSWR of 60-Watt termination

Figure 15: Physical layout of 60-Watt termination

As with resistors, any design must accommodate a film width variationof 20%, as well as the specified range of AlN dielectric constant, which
typically varies from 8.7 to 9.3. These two factors, plus variation of all
physical dimensions and substrate and cover dielectric constants all affectproduction yield to a given VSWR. Figure 15 shows the physical layout of
a 60- watt chip termination; Figure 16 shows typical VSWR-vs.- frequency
plots of 60-watt terminations randomly selected from a production

run. Figure 17 shows thermal scans made using an IR camera with thetermination at full rated power and the mounting surface temperature at
100°C, when measured at a point 30 mils from the termination edge (asdescribed in the section herein titled, How we specify power rating).

Temps of film area outlined
Max

136.4°C

Avg.

128.5°CMin.

114.1°C

Std. Dev.

4.4°C

Figure 17: Thermal scans of 60-watt termination

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

– high power resistive products –51

High Power Resistive Products
Resistors and Terminations: Engineering Guidelines

It was discussed under (10) and (11) that the area under thevs. frequency curve is a constant. Thus, better match at any particularfrequency is always achieved at the expense of match at another frequency.
If a termination VSWR is specified from DC to an upper frequency value,
as is typical practice, optimum designs are mismatched at DC so that
improved match can be achieved across the entire band. KYOCERA AVX
follows this design practice, so users should be aware that, for instance, a
DC measurement of a 50- ohm termination will not necessarily be exactly
50 ohms.
How we measure reflection

Notes – The minimum via hole diameter is generally a function of board
thickness and is related to “walking” or breaking of the drill bit. The maximum
via hole diameter relates to the ability to wick up solder to the via's full length.
Different PC board fabricators will have different design rules that apply.
Pattern: Rectangular array. Notes – There are two possible uniform patterns,
designated Rectangular Array and Triangular Array respectively, and shownin Figure 19. For optimum design, it must be determined which patternplaces the most via holes under a chip. This consideration can become fairly
complex, since vias that are even partially under a chip can still contributesignificantly to heat conduction. Although details are beyond the scope of
this discussion, KYOCERA AVX has developed some useful algorithms toaid in optimum via-patch design; customer assistance is available from thefactory. For most – but not all – situations, the rectangular array yields better
results than its triangular counterpart.

It was alluded to earlier that reflection measurements are subject to anumber of vagueries that include not only the interface to the measuring
equipment – test board thicker or thinner than termination substrate, tracewider or narrower than the termination tab, board dielectric constant – but
also the details of the measurement technique. KYOCERA AVX measurestermination reflection under the following conditions:• Test substrate is Rogers Corp. TMM3, dielectric constant = 3.27
• Board thickness = chip substrate thickness = 40 mils, nominal• Board trace width = 92 mils (for Z0 = 50 ohm line)• Measuring instrument is an Agilent 8722D Vector Network analyzer witha 4-receiver architecture• Measurement is done using standard TRL de-embedding to remove theeffects of connectors and source-load-UUT mismatch interactions• Termination front surface is butted against TMM test board, no strain
relief in tab• Tab length = 90 mils.

Rectangular via array

Triangular via array

Figure 19: Rectangular and Triangular via arrays

The calculated thermal resistance of each via, with the assumptions
above, is 35°C/Watt. Table 3 and Table 4 present calculated performanceparameters of KYOCERA AVX's standard via patches for various sizes ofRP4-style SMT chip resistors and RP9-style SMT chip terminations (seeFigure 4 for style diagrams).
Table 3: Calculated Via-Patch Performance for
RP9-Style Terminations Assumptions:
1. No lateral heat transfer on surface.

VIA PATCHES FOR
SURFACE-MOUNT COMPONENTS

2. Board is solder attached to an ideal heat sink.

As shown in Figure 3b, surface mount (SMT) parts are typically soldered toa via patch in order to transfer the heat generated in the resistive film to aground plane/heat sink. The question of how to rate an SMT part for power
handling is thus intimately connected with the via patch it is to be mounted
on. Among the variables in via patch design are board thickness, and via holediameter, via hole spacing, via hole pattern, via hole plating, and via hole solder
filling. Each end-user will typically have its own preferred set of the above
parameters. In an effort to characterize SMT device performance, KYOCERA
AVX has adopted a standard via patch design and test methodology thatprovides sufficient information for end-users to calculate behavior in theirown operating environments. The design assumptions and parameters of
KYOCERA AVX's standard via patches are presented on the right.
PC board: Rogers Corp. 4350; 30 mils thick; 1/2-oz. (7 mils thick) copper
cladding.
Via holes: See Figure 18. Structure – plated through with 2-mil copper,
filled with Sn63 solder; Diameter =16 mils; edge-to-edge spacing = 0.5 x
diameter = 8 mils.
CHIP RES. OR TERM.

3. Thermal resistance of each via is 35°C/Watt

mm (inches)

5.08 x 2.54 (0.200 x 0.100)

Rated
Power
of Chip(Watts)
1030

ThermalResistanceof Board(°C/Watt)
1.17

6.35 x 6.35 (0.250 x 0.250)

20

88

0.40

8.0

9.53 x 6.35 (0.375 x 0.250)

30

132

0.27

8.1

9.53 x 9.53(0.375 x 0.375)

40

204

0.17

6.9

Chip TypeRP9Size (L X W)

Numberof ViasTable 4: Calculated Via-Patch Performance for
RP4-Style Resistors
Assumptions:
1. No lateral heat transfer on surface of board.
2. Board is solder attached to an ideal heat sink.
3. Thermal resistance of each via is 35°C/Watt
mm (inches)

Cu PLATING

Cu FOILON SUBSTRATESOLDERSOLDER-FILLED
PLATED-THRU HOLE

Cu CARRIER

CROSS SECTION OF TYPICAL VIA HOLE
mm (inches)

ASSUMPTIONS
Hole Dia
0.41 (0.016)
thick_Cu_Plate 0.05 (0.002)
kth_sub
0.02 W/(in ºC)
thick_sub
0.76 (0.030)
k_sol
1.290 W/(in ºC)

thick_sol
kth_cuthick_Cu_foil
theta_1via_hole

0.05 (0.002)
9.9 W/(in ºC)
0.02 (0.0007)
35.1ºC/Watt

5.08 x 2.54 (0.200 x 0.100)

Rated
Power
of Chip(Watts)106.35 x 6.35 (0.250 x 0.250)

20

48

0.73

14.6

9.53 x 6.35 (0.375 x 0.250)

30

96

0.36

10.8

9.53 x 9.53(0.375 x 0.375)

40

144

0.24

9.7

Chip TypeRP4Size (L X W)

Numberof Vias20

ThermalResistanceof Board(°C/Watt)
1.75

Temperaturedrop acrossboard at rated
Power (°C)
17.5

Figure 18: Via-hole cross section and parameters

52

Temperaturedrop acrossboard at rated
Power (°C)
11.7

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

– high power resistive products –High Power Resistive Products
Resistors and Terminations: Engineering Guidelines
An example of via patch tests were those run on four RP4 2010 resistor
chips. The chips were first mounted directly on modified standard large
copper carriers. (The chips actually sat atop a small ridge so that theirbottom sides would not be short circuited.) Referring to Figure 12, withcarrier temperature T2 at 100°C, 10 Watts DC was applied to the chip, andthe resultant peak film temperature rise, T0 – T2, was measured at 15.4°C(average for the 4 chips). Thus, the chip peak thermal resistance measured
as 15.4/10 = 1.54°C/Watt. Next, the same type chips were mounted on astandard (as designed above) via patch board – see Figure 20 – which was
soldered to a carrier. With T2 – now measured on the via patch – held at
100°C, the peak film temperature rise was 34.7°C.
A second experiment was done in which, with the via patch in place, thecarrier temperature T4 directly under point T2 was held at 100°C. The
measured resultant T0 – T2 was 34.5°C. We can compare this to the predictedvalue by adding the chip thermal resistance, 1.54°C/Watt, to the via thermal

Film
SolderFlange, carrier,or via patch

T0

AlN

T2 , thermocouple
location, via patch
T4 , thermocouple
location, chip & flange
Mounting hole
ThermalGrease (flange)

T3
30 mils

Heat Sink
Figure 20: Temperatures at a number of points on andaround a flange- or surface-mounted resistive chip

resistance (from Table 4), 1.75°C/Watt, and multiplying by 10 Watts. The
result, 32.9°C, compares reasonably well with the measurement.
How we specify power rating on SMT parts
The power rating of an SMTpart, mounted on the standard via patch, is
specified in the same way as for nonsurface mounted parts – see herein
under How we specify power rating – except that location T2, the point heldat the specified ambient temperature, is on the surface of the via patch.
Note that we could have equally well required T2 to be on the carrier insteadof atop the via patch, but the latter location seems more practical, in that it
is a point users can readily measure and control through their own heat sinkand via patch design.

FLANGE MOUNTED PARTS
The power rating of flange mounted chips presents problems similar to thoseof SMT chips. In general, flanges are not particularly good conveyers of filmgenerated heat to the mounting surface. The interface is characterized byseveral factors:a) Intimate contact occurs at discrete parts of the nominal interfaceb) A very thin gap exists in the regions where there is no intimate contact,and is usually occupied by a third substance, e.g. air, other gasses,
grease, or other materialc) Heat transfer can take place by conduction through the real contact area,by conduction through the substance in the gap, and by radiation acrossthe gap.
The actual thermal resistance of an interface depends on surface
roughness, waviness and slope of the contacting peaks; thickness of the
non-contact region; type of interstitial fluid (gas, liquid, grease, vacuum);interstitial gas pressure; thermal conductivities of the contacting solids andinterstitial substance; hardness or flow pressure of the contacting peaks(plastic deformation of the highest peaks of the softer solid); modulus ofelasticity of the contacting solids (elastic deformation of the wavy partsof the interface); and average temperature of the interface (radiation andproperty effects). Thus, thermal contact resistance is an extremely complex

problem – which makes characterization and measurement of products
whose performance depends on such an interface equally complex.
Using pressure-sensitive indicating tape, KYOCERA AVX has determinedthat for a flange that is simply bolted to a mounting surface there is reliable
contact only over the area of the mounting hole plus a small surrounding
annulus. Thus, a substantial portion of the heat generated by the chipproceeds in a lateral direction through the flange until it gets to the vicinityof the mounting hole, whence it is redirected vertically through the mounting
bolt to the heat sink. Thermal grease does permit vertical heat flow over theentire flange, but even the best thermal greases have thermal conductivities
far less than metals and are messy to apply and remove. If using thermal
grease, it is important to control the average thickness; this is best doneby controlling the volume and using a spatula or roller to evenly distributeit over the flange surface area. A maximum 2-mil thickness of grease isrecommended.
One-hole flange
An example of flanged-part tests were those run on four RP60515 resistors.
When chips of the type used for this part are soldered directly on standard
large silver-plated copper carriers (surface finish after plating = 10-15 pin.,avg.) and T4 (see Figure 20) is held at 100°C, the peak film temperaturerise, T0 - T4, is typically 35.6°C at the rated 45-watt input power. When thesame type chips are mounted on singlehole flanges, bolted down – without
thermal grease – to the carriers at the recommended torque, the carrier(point T4, Fig. 20) held at 100°C, and the same 45-watts input power applied,the peak film temperature rise increases to 70°C.
When an AlN-based thermal grease (AiT COOL-GREASE™ CGR 7018) wasapplied such that an approximately 2-mil thickness resulted between theflange and mounting surface and the above test was repeated, the peak film
temperature rise was only 49°C.
Two-hole flange
An example of two-hole flange tests were those run on four RP60870
resistors. When chips of the type used for this part are soldered directly
on standard large silver-plated copper carriers (surface finish after plating= 10-15 pin., avg.) and T4 (see Figure 20) is held at 100°C, the peak film
temperature rise, T0 – T4, is typically 66°C at the rated 150-watt input power.
When similar chips are mounted on two-hole flanges, bolted down – without
thermal grease – to the carriers at the recommended torque, and the carrier(point T4) held at 100°C, a 66°C temperature rise occurs for an applied powerof only 106 watts. (Note that to measure the carrier temperature, a small
hole was drilled in the flange at the T2-T4 location and the Luxtron fiber optic
probe inserted in the hole until it contacted the carrier.)
When an AlN-based thermal grease (AiT COOL-GREASE™ CGR 7018) wasapplied such that an approximately 2-mil thickness resulted between theflange and mounting surface and the above test was repeated, the 66°C
peak film temperature rise occurred at an applied power of 120 watts.
How we specify power rating of flange-mounted devices
The power rating of a flanged part is specified in the same way as for chips– see herein under How we specify power rating. Location T4, the point heldat the specified ambient temperature, is on the surface of the carrier. Notethat some vendors specify ambient temperature as T2 on the top surfaceof the flange instead of T4 on the carrier or heat sink. This will produce anapparently higher power rating, since the thermal drop through the flange
is not accounted for in the measurement. KYOCERA AVX believes that end
users can most readily control the temperature of the flange mounting
surface rather than the flange top surface, and thus we specify the power
capacity appropriately.

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

– high power resistive products –53

High Power Resistive Products
Resistors and Terminations: Engineering Guidelines
SOME RECOMMENDATIONSON SOLDERING

References

When mounting chips, the solder interface to the mounting surface has a
crucial bearing on performance. Even with careful soldering technique, voids(porosity) and de-wetting are difficult to avoid. Using Scanning Acoustic
Microscopy (SAM), radiographic analysis, and metallographic sectioning,
KYOCERA AVX has studied solder joints made with a variety of techniques.
One result is that, where typical surface mount assembly techniques areused, such as those involving solder paste, porosity levels of 10-25%
should be expected. Note that this directly transfers to the power rating of
the part, i.e., its power handling capability will decrease in approximately thesame proportion.
Here are some suggestions to improve solder joint integrity:
Avoid the use of hold-down clamps or springs. Loading the solder incompression during melting forces it out of the bond area and does not
permit the “Z” direction movement required during solidification to reduceshrinkage porosity. Further, the thermal mass of the hold-down fixture may
cause a lag in temperature, resulting in a cooler part and loss of solder inthe bond area when the chip eventually reaches the correct temperature.
Avoid introducing solder to the entire bond area prior to soldering, i.e., do not
use a solder pre-form the same size as the entire resistor chip or pre-tin theentire chip bottom. Porosity reduction is enhanced by permitting the solder
to wick through the joint area by capillary action, preferably from a central
location.
Reduce the soldering time (temperature above solder melting point) to 2030 seconds maximum in order to avoid scavenging of the silver plating,intermetallic formations, solder melting point alteration, etc.
Reasonably good results have been achieved at KYOCERA AVX using lengthsof solid Sn96 (Sn96.5/Ag3.5) wire, about 0.030 inches in diameter, placedin the center of the chip, with RMA flux applied to both chip and mounting
surface. This process has been shown to result in porosity levels of 8-12%;
optimized solder volumes may yield even better results.

4

R. Wayne Johnson, Ed., Modular Series in Hybrid Microelectronics, ISHM,
Reston, Va., 1991

5

S. Ramo and J. Whinnery, Fields and Waves in Modern Radio, John Wiley &Sons, Inc., New York, 1953, pp. 251-253

6

H. W. Bode, Network Analysis and Feedback Amplifier Design, Sec. 16.3,
New York, Van Nostrand, 1945

7

R.M. Fano, “Theoretical Limitations on the Broadband Matching of
Arbitrary Impedances,” Journal of the Franklin Institute, Vol. 249, pp. 57-84
and 139-154 (Jan.-Feb. 1950)

8

K.J. Negus, et al., “On the Nondimensionalization of Constriction
Resistance for Semi-infinite Heat Flux Tubes,” Transactions of the ASME,
Vol. 111, August 1989, pp 804-807.

9Smith, Charles E., and Ray-Sun Chang, “Microstrip Transmission Line with
Finite-Width Dielectric and Ground Plane,” IEEE Transactions on Microwave
Theory and Techniques, Vol. MTT-33, No. 9, September 1985, pp. 835-839

10

G. L. Matthei, L. Young, E.M.T. Jones, Microwave Filters, Impedancematching Networks, and Coupling Structures, McGraw Hill, New York,
1964, pp 30

CONCLUSIONSBoth vendors and end-users of high-power microwave resistive chipproducts are frequently guilty of a lack of rigor in specification. A likely
reason is that many of these products see use only during fault conditions.
After all, apart from microwave ovens and dryers, no one wants to spend
a great deal of time turning microwaves into heat. Thus, unlike transistors,
capacitors, or inductors, resistive parts that underperform (or even fail) may
go undetected without catastrophic results – much of the time. However,by understanding actual measurement conditions and fundamental physicalconstraints, users can often save the added cost of an overdesigned part aswell as insure themselves of a more reliable product during those crucial
intervals when it is in use.

54

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

– high power resistive products –FOLLOW US:
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