Microelectronic Products
Quick Reference Guide
NAND FLASH — SSD
TRRUST-Stor® 2.5 in. SATA Secure Storage Device
Size
InterfacePart Number
Read/Write Speed
174/162 MB/s ***128GBSATA
MXX128AS0R-XXXI
161/200 MB/s ***
256GB
SATA
MXX256AM2R-XXXI
161/200 MB/s ***
512GB
SATA
MXX512AM2R-XXXI
200/200 MB/s ***1TB
SATA
MXX01TAM2R-XXXI

Voltage (V)
5.0
5.0
5.0
5.0

Package
2.5"
2.5"
2.5"
2.5"

Dimensions
100.45 MAX × 69.85 × 9.5 mm
100.45 MAX × 69.85 × 9.5 mm
100.45 MAX × 69.85 × 9.5 mm
100.45 MAX × 69.85 × 9.5 mm

Temperature
IIII

NAND SSD BGA
SizeInterface
64GBSATAPart Number
MSM064AM2L-MXXI

Read/Write Speed
66/51 MB/s ***Voltage (V)
3.3-5.0

Package
524 PBGA

Dimensions
32mm x 28mm x 6mm

Temperature
I

mSATA SSD
Size
Interface
SATA
64GB

Part Number
MM3064AM2R-MXXI

Read/Write Speed
66/51 MB/s ***Voltage (V)
3.3-5.0

PackagemSATA

Dimensions
30mm x 50mm

TemperatureI

XMC SSD
Size
Interface
SATA
256GBSATA
512GBPart Number
MXMCM256A2X-XXXIMXMCM512A2X-XXXI

Read/Write Speed175/200 MB/s **175/200 MB/s **Voltage (V)
5.05.0

Package
XMC
XMC

Dimensions
143.75mm x 74mm
143.75mm x 74mm

Temperature
II

Voltage (V)
5.05.0

Package
2.5"
2.5"

Dimensions
100.45 MAX × 69.85 × 9.5 mm
100.45 MAX × 69.85 × 9.5 mm

Temperature
II

ASURRE-Stor™ 2.5in. SATA (FIPS/CSfC) Secure Storage Devices
SizeInterfacePart Number
Read/Write Speed
161/200 MB/s ***SATA
AXX256AM2R-XXXIX *256GB
161/200 MB/s ***SATA
AXX512AM2R-XXXIX *512GB

Extended Temperature Plastics — Memories
DDR4 SDRAM MCPs
SizeOrganization

Part Number
4N512M32T-XBX ∗4N512M64T-XBX ∗4N512M72T-XBX ∗4N1G64T-XBX ∗4N1G72T-XBX ∗Data Rate (Mb/s)
1333-2400 ****
1333-2400 ****
1333-2400 ****
1333-2400 ****
1333-2400 ****

Voltage (V)Package

Dimensions

Temperature

1.2
1.2
1.2
1.2
1.2

143 PBGA
321 PBGA
321 PBGA
321 PBGA
321 PBGA

8mm x 14mm
13mm x 20mm
13mm x 20mm
13mm x 20mm
13mm x 20mm

C, I, M
C, I, M
C, I, M
C, I, M
C, I, M

DDR3 SDRAM MCPs
SizeOrganization1GB
128M x 64
1GB
128M x 72
1GB
128M x 64
1GB
128M x 72
2GB
512M x 32
4GB
512M x 64
4GB
512M x 72
4GB
512M x 64
4GB
512M x 72
4GB HD
512M x 64
4GB HD
512M x 72
8GB
8GB x 64
8GB
8GB x 72

Part Number
W3J128M64X-XPBX
W3J128M72X-XPBX
W3J128M64X-XLBX
W3J128M72X-XLBX
W3J512M32X(T)-XB3X
W3J512M64X-XPB2X
W3J512M72X-XPB2X
W3J512M64X-XLB2X
W3J512M72X-XLB2X
W3J512M64X(T)-XHDX **W3J512M72X(T)-XHDX **W3J1G64X-XPBX **W3J1G72X-XPBXData Rate (Mb/s)
800-1333
800-1333
800-1600
800-1600
800-1333
800-1600
800-1600
800-1600
800-1600
800-1600
800-1600
800-1600
800-1600

Voltage (V)K=1.35, G=1.5
K=1.35, G=1.5
K=1.35, G=1.5
K=1.35, G=1.5
K=1.35, G=1.5
K=1.35, G=1.5
K=1.35, G=1.5
K=1.35, G=1.5
K=1.35, G=1.5
K=1.35, G=1.5
K=1.35, G=1.5
K=1.35, G=1.5
K=1.35, G=1.5

Package
375 PBGA
375 PBGA
375 PBGA
375 PBGA
204 PBGA
543 PBGA
543 PBGA
543 PBGA
543 PBGA
399 PBGA
399 PBGA
543 PBGA
543 PBGA

Dimensions
21.5mm x 20.5mm
21.5mm x 20.5mm
21.5mm x 20.5mm
21.5mm x 20.5mm
10mm x 14.5mm
23mm x 32mm
23mm x 32mm
23mm x 32mm
23mm x 32mm
14mm x 21.5mm
14mm x 21.5mm
24.5mm x 32mm
24.5mm x 32mm

Temperature
C, I, M
C, I, M
C, I, M
C, I, M
C, I, M
C, I, M
C, I, M
C, I, M
C, I, M
C, I, M
C, I, M
C, I, M
C, I, M

DDR2 SDRAM MCPs
SizeOrganization

Part Number

Data Rate (Mb/s)

2GB
4GB
4GB
8GB
8GB512M x 32
512M x 64
512M x 72
512M x 64
512M x 72

Voltage (V)Package

Dimensions

Temperature

128MB
64M x 16
W3H64M16E-XB2X
256MB
2 x 64M x 16
W3H264M16E-XSBX
256MB
2 x 64M x 16
W3H264M16E-XB2X
256MB
32M x 64
W3H32M64E-XBX
256MB
32M x 72
W3H32M72E-XBX
512MB
64M x 64
W3H64M64E-XBX
512MB
64M x 72
W3H64M72E-XBX
1GB
128M x 72
W3H128M72E-XSBX
1GB
128M x 72
W3H128M72E-XNBXRegistered DDR2 SDRAM MCPs
Size
Organization
Part Number
1GB
128M x 72
W3H128M72ER-XNBX ∗400-667
400-667
400-667
400-667
400-667
400-667
400-667
400-667
400-667

1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8

79 PBGA
79 PBGA
79 PBGA
208 PBGA
208 PBGA
208 PBGA
208 PBGA
208 PBGA
208 PBGA

11mm x 14mm
11mm x 14mm
11mm x 14mm
16mm x 20mm
16mm x 20mm
16mm x 22mm
16mm x 22mm
16mm x 22mm
16mm x 22mm

C, I, M
C, I, M
C, I, M
C, I, M
C, I, M
C, I, M
C, I, M
C, I, M
C, I, M

Data Rate (Mb/s)
400-667

Voltage (V)1.8Package255 PBGA

Dimensions
21mm x 23mm

Temperature
C, I, M

DDR SDRAM MCPs
Size
Organization

Part Number

Data Rate (Mb/s)

Voltage (V)Package

Dimensions

Temperature

128MB
128MB
256MB
256MB
256MB
256MB
256MB
256MB
512MB

W3E64M16S-XSBX
W3E64M16S-XBX
W3E32M64S-XB2X
W3E32M64SA-XB2X
W3E32M64S-XB3X
W3E32M72S-XB2X
W3E32M72S-XB3X
W3E32M72SR-XBX
W3E64M72S-XBX

200-333
200-333
200-333
200-333
200-333
200-333
200-333
200-266
200-266

2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5

60 PBGA
60 PBGA
219 PBGA
219 PBGA
208 PBGA
219 PBGA
208 PBGA
208 PBGA
219 PBGA

10mm x 12.5mm x 2.88mm
10mm x 12.5mm x 1.91mm
21mm x 21mm
21mm x 21mm
13mm x 22mm
21mm x 21mm
16mm x 22mm x 2.26mm
16mm x 25mm x 2.27mm
32mm x 25mm

C, I, M
C, I, M
C, I, M
C, I, M
C, I, M
C, I, M
C, I, M
C, I, M
C, I, M

64M x 16
64M x 16
32M x 64
32M x 64
32M x 64
32M x 72
32M x 72
32M x 72
64M x 72

∗ Preliminary product — This product is developmental, is not fully characterized or qualified and is subject to change without notice. Check with factory for availability.
∗* Advanced product — This product is developmental, is not qualified and is subject to change or cancellation without notice.
∗*∗ Performance values based on 128KiB sequential transfers.
**** Proposed data rate.

Mercury Systems reserves the right to change products or specifications without notice.

Mercury Corp. - Microelectronic Secure Solutions • (602) 437-1520 • www.mrcy.com© 2018 Mercury Systems. All rights reserved.
1

Microelectronic Products Quick Reference Guide – 0318 – Rev.38

Microelectronic Products Quick Reference Guide
Extended Temperature Plastics — Memories (continued)
Registered DDR SDRAM MCPs
Size
Organization
Part Number
256MB
32M x 72
W3E32M72SR-XBX
SSRAM MCPs
Size
Organization
2MB
512K x 32
2MB
256K x 72
4MB
512K x 72 NBL
4MB
512K x 72 NBL

Speed (MHz)200-266

Voltage (V)
2.5

Package
208 PBGA

Part Number
WED2DL32512V-XBXWEDPY256K72V-XBXWEDPZ512K72V-XBXWEDPZ512K72S-XBX

Speed (MHz)133-200
100-200
100-150
100-150

Voltage (V)
3.3
3.3
3.3
2.5

Part Number

Speed (ns)

Voltage (V)W72M64VB-XBX

90-150

3.3

Page Mode
32MB
8M x 32
64MB
8M x 64
256MB
64M x 32
512MB
2 x 64M x 32
1GB4 x 64M x 32

W78M32VP-XBX
W78M64VP-XSBX
W764M32V1-XBX
W7264M32V1-XSBX
W7464M32V1-XSBX

110, 120110, 120100, 120110, 120110, 120

3.3
3.3
3.3
3.3
3.3

SDRAM MCPs
Size
Organization
128MB
16M x 64
128MB
16M x 72

Part Number
WEDPN16M64V-XB2X
WEDPN16M72V-XB2X

Speed (MHz)100-133
100-133
Speed (MHz)100-133

NOR Flash MCPs
Size
Organization
Conventional
16MB
2M x 64

Registered SDRAM MCPs
SizeOrganization
Part Number
128MB
16M x 72
WEDPN16M72VR-XB2X

Dimensions
16mm x 25mm

Package
119 PBGA
159 PBGA
152 PBGA
152 PBGA

Temperature
C, I, M

Dimensions
14mm x 22mm
14mm x 22mm
17mm x 23mm
17mm x 23mm

Temperature
C, I, M
C, I, M
C, I, M
C, I, M

Package

Dimensions

Temperature

159 PBGA

13mm x 22mm

C, I, M

159 PBGA
159 PBGA
107 PBGA
107 PBGA
107 PBGA

13mm x 22mm
13mm x 22mm
14mm x 17mm
14mm x 17mm
14mm x 17mm

C, I, M
C, I, M
C, I, M
C, I, M
C, I, M

Voltage (V)
3.3
3.3Package
219 PBGA
219 PBGADimensions
21mm x 21mm
21mm x 25mm

Temperature
C, I, M
C, I, M

Voltage (V)3.3

Package
219 PBGA

Dimensions
25mm x 25mm

Temperature
C, I, M

Ceramics
SRAM

•

Flash

•

EEPROM•

Mixed Memory MCPs

Multiple organizations of flash, SRAM and EE in various hermetic sealed ceramic
packages including 32 CSOJ, 32 CerDIP, 56 CSOP, 68 CQFP, 66 PGA, CBGA. Theseare standard hermetic products available as Class H or K compliant.

•­ Hermetic•

Mil-PRF•

QMLMercury Systems ceramic products are available in industrial, military
temperatures and as SMD-5962 qualified components.

Applications Engineering Performance, Layout & Design Benefits to Customer
This technology reduces PWB real estate, I/O requirements and memory downrounting, by typically 20% to 70%. This frees up real-estate for additional productfeatures and can capture more sales opportunities for the board designer.

Reduced memory-down routing can cut design time by up to ~4 weeks, and savethe associated opportunity cost.
Reduced I/O and routing allows wider pitch on BGA leads and hence easier class
3 PWB rule compliance since 0.5mm - 0.65mm pitch memory parts are not placedon the board.

Reduction of memory-down routing can save 2-4 PWB layers
Improves parasitic performance (L, Z, C) at first and second level. Use of MCP
provides reduced bus capacitance and better signal integrity on the PCB.

BOM maintenance costs are reduced since the MCP interface is consistentdespite part obsolescence issues which are managed by Mercury Systems.

BuiltSECURE™ SiP
SWaP-Optimized: Advanced miniaturization and stacking tech­nology minimizes footprint
Agile customization: Optimize processing and security architec­tures for individualprograms
BootFlash

Advanced thermal management: Dissipate more than 100W of power to meet theprocessing demands of modern processors and FPGA devices.
Embedded Security: Integrated secure boot capability and optional personalized security
solutions to detect and mitigate adversarial attacks.
Trusted design and manufacturing: Designed and manufactured in a DMEA-accredited
facility protected by a vigilant cybersecurity program.

FPGASecureController

NOR
FlashSensors

NVRAMCPU orGPUPowerManagement

Example of a BuiltSECURE block diagram

Mercury Systems reserves the right to change products or specifications without notice.
© 2018 Mercury Systems. All rights reserved.

Mercury Corp. - Microelectronic Secure Solutions • (602) 437-1520 • www.mrcy.com

2Microelectronic Products Quick Reference Guide – 0318 – Rev.38