System Thermal Test Report
Model: The Tower 300

Version: 20231123A
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Table of Contents

A. Introduction
B. Test Configuration
C. Conclusion

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A. Introduction
1. Objective
2. Equipment
3. Procedure

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1. Objective

Our objective is to find out if The Tower 300 can efficiently extract the heat generated by the latest
components, so we built a system with an Intel i9-13900K and a ASUS ROG Strix GeForce RTX® 4090 OC andput it to the test. The passing criteria we set was to keep the internal temperature under 45°C while thesystem is running at full load, with Eight installed fans and a AIO 420 installed.
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2. Equipment
The equipment we used in the thermal testing includes:
1. Temperature & Humidity Chamber
2. Data Acquisition Device
3. Thermocouple

The Temp. & Humidity Chamber ensures consistency in the testing environment, particularly temperatureand humidity. The temperature was set at 25°C and the humidity at 50% in the chamber.
The Data Acquisition Device helps us to directly collect the data through thermocouples, which is the mostimportant equipment for our testing. We set up the thermocouple inside the case at various points tomeasure the temperature.

We used AIDA64 Extreme and FurMark ROG Edition to push 100% load on the CPU and GPU and tested for
30 minutes.

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3. Procedure
Testing steps:

1. Ready the systems
2. Place the chassis into the Temp. & Humidity Chamber
3. Set the thermocouple at the specified places
4. Set up the Temp. & Humidity Chamber - temperature at 25 °C and the humidity at 50%
5. Turn on the Temp. & Humidity Chamber and start testing (for 30 minutes)

6. Check the data acquired from the Data Acquisition device
7. End testing6

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B. Test Configuration
1. Laboratory Equipment

2. Chassis Hardware List
3. Chassis Fan Allocation
4. Chassis Thermal Airflow
5. Chassis Measured Points
6. Thermal Stress Test
7. AIDA64 & FurMark Test
8. Graphics Performance Testing
9. Acoustic Test

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1. Laboratory Equipment

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Thermocouple

Sound Level Meter

Thermal Imaging Camera

Temperature Data Acquisition

Temperature & Humidity Chamber

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2. Chassis Hardware List
Component

ModelChassis The Tower 300
Motherboard ASUS ROG STRIX B760-G GAMING WIFICPU Intel® Core™ i9-13900K Processor (TDP 253W)
GPU ASUS ROG Strix GeForce RTX® 4090 OC 24GB GDDR6X

RAM TOUGHRAM XG RGB D5(16G x 4)
SSD Seagate SSD 120GPSU Toughpower GF3 1200W - TT Premium Edition
CPU Cooler TOUGHLIQUID Ultra 420 AIO Liquid Cooler
AIO:TOUGHFAN 140mm x 3 (2000rpm)
Fans Chassis: CT 140mm x 5 (1500 rpm)
(Top x 2 , Rear x 2 , Bottom x 1 )9Software

1.
2.
3.
4.

AIDA64 Extreme
FurMark ROG Edition V0.9.1.0
CPU-Z Ver.2.015 x64
Core Temp V1.18

Full load

30 minutes

CameraFLIR E86 Thermal Imaging Camera?
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3. Chassis Fan Allocation
Fan5

Fan6

Fan1
Fan7

Fan2
Fan8
Fan4
Fan310

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4. Chassis Thermal Airflow
Cool Airflow Inlets

Hot Airflow Exhausts

Front

TopTop

Front

Rear

Rear

BottomFront

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5. Chassis Measured Points
761103

MeasurePoint

Description

1

Chassis Right External

Intake101

2Chassis Right Internal

Exhaust102

3Chassis Left External

Intake103

4GPU Right Fan

Exhaust104

5Chassis Bottom Internal Exhaust

105

6Chassis Top Internal

Intake106

7Chassis Top External

Exhaust107

8Chassis Rear Internal

Intake108

9Chassis Rear External

Exhaust109

10AIO Top CoverNature110

11

PSU Bottom

Intake113

12

PSU Rear

Exhaust114

Airflow

Thermocouple
Number2

4

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5. Chassis Measured Points

8912Measure
Point

Description

1

Chassis Right External

Intake101

2Chassis Right Internal

Exhaust102

3Chassis Left External

Intake103

4GPU Right Fan

Exhaust104

5Chassis Bottom Internal Exhaust

105

6Chassis Top Internal

Intake106

7Chassis Top External

Exhaust107

8Chassis Rear Internal

Intake108

9Chassis Rear External

Exhaust109

10AIO Top CoverNature

110

11PSU Bottom

Intake113

12PSU Rear

Exhaust114

Airflow

Thermocouple
Number11

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6. Thermal Stress Test

••
•
•

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Setting up the chamber temperature and humidity
Temperature: 25°C
Humidity: 50%
Recording Data

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6. Thermal Stress Test

Temperature Data Recoding
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6. Thermal Stress Test
CPU- Intel Core i9-13900K
GPU-ASUS ROG-STRIX-RTX4090
Ambient Temperature: 25°C
Humidity: 50%
Loading with AIDA64 & FurMark

System Thermal Stress Test - The Tower 300
Chassis Left External

4.1

PSU Bottom

4.6
7

Chassis Right External
Chassis Bottom Internal

10.4

Chassis Top External

1111.6

Chassis Rear Internal

11.6

PSU Rear

12.4

Chassis Rear External

12.4

Chassis Top Internal

12.5
17.7

GPU Right Fan

510
ΔT

26.1

30.7
33.1
35

26.7

AIO Top Cover

0

30.7

26.1

8.3

Chassis Right Internal

26.6

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Load Temp.

2027.1

37.5

27.1

38.1

27.7

39.3

27.3

38.9

27.5

39.9

27.6

4027.139.645.2

27.5

25Ambient Temp.

3035404550

Temperature - Degree CLower is Better

We expected to see higher temperature at the exhaust points and relatively lower temperature at the intake positions. The
highest temperature was found at the AIO exhaust, which is reasonable given the CPU was running at full load. Most of
the intake positions recorded a temperature lower than 45°C since they were drawing air from environment. Two critical
positions we were looking at are NO. 104 GPU Fan and NO. 110 AIO Cover, which were drawing internal air to cool two ofthe most important components.
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7. AIDA64 & FurMark Test
We used AIDA64 Extreme (stress FPU) and FurMark ROG Edition (resolution: 3840 x 2160) to
push 100% load on the CPU and GPU for 30 minutes.

AIDA64 ExtremeFurMark
17IdleFull load

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7. AIDA64 & FurMark Test
We used AIDA64 Extreme (stress FPU) and FurMark ROG Edition (resolution: 3840 x 2160) to
push 100% load on the CPU and GPU for 30 minutes.

Idle

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Full load

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7. AIDA64 & FurMark Test
CPU & GPU Thermal Stress Test
The Tower 300
7MB38
3155

CPU832844GPU7935010

CPU- Intel Core i9-13900K
GPU-ASUS ROG-STRIX-RTX4090
Ambient Temperature: 25°C
Humidity: 50%Loading with AIDA64 & FurMark

19203040

ΔTLoad Temp.

5060

Idle Temp.

70

80

90

Temperature - Degree CLower is Better

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8. Graphics Performance Testing20

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9. Acoustic Sound Pressure Level Test
Test Environment：Thermaltake Taipei Office
Test Model: The Tower 300
Test Ambience: 25.2 ℃(Temperature) / 54% R.H.(Relative Humidity)
Microphone position: 50 cm / in front of PC system
Background Noise：35.6 dBA.

30°50CM

Microphone position
21Test Ambience
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9. Acoustic Sound Pressure Level Test
Fan Speed 500rpm – 36.5dBA

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Fan Speed 600rpm – 36.9dBA

Fan Speed 800rpm – 37.5dBA

Fan Speed 1500rpm – 54.9dBA

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9. Acoustic Sound Pressure Level Test
Acoustic Sound Pressure Level Test - The Tower 300
0Background Noise35.60.9

Fan Speed 500 rpm (Silent)

35.6
1.3

Fan Speed 600 rpm (Standard)

35.6
1.9

Fan Speed 800 rpm (Turbo)

35.62.93DMARK Test - Fan 900 rpm

35.636.9
37.5
38.5
54.9

35.6
19.5

Stress Test Full Load- Fan 1500 rpm

2336.519.3

Fan Speed 1500 rpm (Performance)

CPU- Intel Core i9-13900K
GPU-ASUS ROG-STRIX-RTX4090
Ambient Temperature: 25°C
Humidity: 50%
Loading with AIDA64 & FurMark

35.6

55.1

35.6
010Diff

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Load dBA

30Idle dBA

405060Sound Pressure - dBA

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C. Conclusion

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Conclusion
Idle

Left View

Full Load

CPU 83℃

GPU 79℃

AIDA64 Extreme (stress FPU) and FurMark ROG Edition (resolution: 3840 x 2160) to push 100% load on the CPU and GPU
for 30 minutes.

-INTEL i9 13900K / CPU Temp. (Max)：83℃ (TDP 253W)-ASUS ROG Strix GeForce RTX® 4090 OC / GPU Temp. (Max)：79℃
Through the thermal image, we found that the internal heat was effectively directed to designatedexhaustion vents, keeping the system operating at a cooler temperature. This finding validates how
efficient The Tower 300 is regarding cooling performance.
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Thank You