MRT – Resist & Polymer

NIL Materials
NIL210 (PDMS compatible)

UVCur26SF (Roll to Roll)

PDMS

PDMS
Resistoxygen-insensitive

Hybrid Polymers
Ormo-Series• Excellent transparency• Excellent mechanical properties• High chemical and physical stability • High thermal stability• Excellent replication fidelity

Resistless permeation

1st shot
3.18um
1.76um

OrmoComp® microlenses on
glass for sensing application

150th shot

OrmoStamp® Replica Stamp

3.24um
1.70umResist : mr-NIL210 on sapphire /PDMS stamp
Imprint : 1000 mJ cm-2 @365 nm

Cross-sectional SEM images show highreproducibility through 150 shots

R2R-UV-NIL imprint results
500 nm resolution AR:3 L&S pattern defect free
replicated @ throughput of 10m/min

OrmoComp® Diffractive optics

OrmoComp® Microstructure
scaffolds for biological applications

HTL Co. Japan Ltd.
Techno Bldg. 3F, 2-16-6 Akebono-cho, Tachikawa-city, Tokyo 190-0012 Japan
Tel: 042-523-2871 e-mail: sales@htlco.co.jp URL: http://www.htlco.co.jp

Simprint Nanotechnologies Ltd
Nanoimprint lithography simulation software
Developing processes for nanoimprint
lithography can be expensive in bothmaterials and time. Simulating theimprint process with Simprint
software helps to shorten thisdevelopment phase by letting you
refine crucial process parameterssuch as loading profile, resist droplet
dispensing patterns, and templatemesa edge geometry, before
committing to template fabrication.

NIL process development
without simulation

NIL process developmentwith Simprint simulation

Chip
designChipdesign• Re-design layout• Re-make stamp• 5+ weeks’ delay• Costs >>$10k

We offer software products for mosttypes of NIL, including:• Droplet-dispensed imprint(commonly used in chip-scale
imprint for memory applications)

Experts’time• Thermal NIL (with resist library)

Simprint
simulation

Template
production

Template
production

Processdevelopment

Processdevelopment

Test lot

Test lot• UV-NIL (chip-to-wafer-scale)

Process parameters

Layout design

 Specify process parameters
including loading profile,
template curvature, dwell
times, template material…

Template

Resist/resin model

Simulation Engine

 Choose from a menu of widelyused thermal and UV-curingresists, including micro resist
mr-I 7000E and mr-I 8000E
series materials, whose
temperature-viscositybehaviour is modelled.

 Balances spatial resolution withspeed to meet modelling needs.

 For custom resists, you canenter viscosity, surface tension
and contact angle parameters
directly.

Import GDS template layout files
and droplet dispensing coordinates

Wafer

 Simulation speeds are at least
1000 times faster than finiteelement simulation techniques.
 Simprint Core does not require
every feature to be represented
individually in the simulation,
enabling efficient chip- or waferscale simulation.

Physical predictions
Residual layer thickness
Cross-section
SectionDroplet merging and extrusion at edge of an imprinted field
During bowing relaxation

During dwell
Cavity filling evolution
Times in seconds

Time
Simprint software is available for Windows and Linux with tailored license and maintenance packages.
Telephone +44 117 230 2566 | info@simprintnanotech.com | Representation in Japan: HTL Co. Ltd.