System Thermal Test Report
Model: CTE E550 TG
Version: 20240812A
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Table of Contents

A. Introduction
B. Test Configuration
C. Conclusion

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A. Introduction
1. Objective
2. Equipment
3. Procedure

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1. Objective

Our objective is to find out if CTE E550 TG can efficiently extract the heat generated by the latest components,
so we built a system with an Intel i9-13900K and a ASUS ROG Strix GeForce RTX® 4090 OC and put it to thetest. The passing criteria we set was to keep the internal temperature under 46°C while the system is runningat full load, with five installed fans and a AIO 420 installed.
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2. Equipment
The equipment we used in the thermal testing includes:
1. Temperature & Humidity Chamber
2. Data Acquisition Device
3. Thermocouple

The Temp. & Humidity Chamber ensures consistency in the testing environment, particularly temperatureand humidity. The temperature was set at 25°C and the humidity at 50% in the chamber.

The Data Acquisition Device helps us to directly collect the data through thermocouples, which is the mostimportant equipment for our testing. We set up the thermocouple inside the case at various points tomeasure the temperature.

We used AIDA64 Extreme and FurMark ROG Edition to push 100% load on the CPU and GPU and tested for
30 minutes.

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3. Procedure
Testing steps:

1. Ready the systems
2. Place the chassis into the Temp. & Humidity Chamber
3. Set the thermocouple at the specified places

4. Set up the Temp. & Humidity Chamber - temperature at 25 °C and the humidity at 50%
5. Turn on the Temp. & Humidity Chamber and start testing (for 30 minutes)
6. Check the data acquired from the Data Acquisition device
7. End testing6

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B. Test Configuration
1. Laboratory Equipment
2. Chassis Hardware List
3. Chassis Fan Allocation
4. Chassis Thermal Airflow

5. Chassis Measured Points
6. Thermal Stress Test
7. AIDA64 & FurMark Test

8. Graphics Performance Testing
9. Acoustic Test

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1. Laboratory Equipment

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Thermocouple

Sound Level Meter

Thermal Imaging Camera

Temperature Data Acquisition

Temperature & Humidity Chamber

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2. Chassis Hardware List
Component

Model

Chassis CTE E550 TG
Motherboard ASUS TUF Gaming Z790-BTF WIFICPU Intel® Corei9-13900K Processor (TDP 253W)

GPU ASUS ROG Strix GeForce RTX® 4090 OC 24GB GDDR6X

RAM

TOUGHRAM RGB XG D5 Memory DDR5 5600MT/s
32GB (16GB x2)

SSD Seagate SSD 120GPSU Toughpower GF A3 1050W - TT Premium Edition
CPU Cooler TH420 V2 Ultra EX ARGB Sync
AIO:
CT EX 140mm x 3 (2000rpm)
Chassis: SWAFAN EX ARGB 140mm x 3 (2000 rpm)
Fans(Bottom x 3 )SWAFAN EX ARGB 120mm x 2 (2000 rpm)
(Top x 2 )9Software

1.
2.
3.
4.

AIDA64 Extreme
FurMark ROG Edition V0.9.3.0
CPU-Z Ver.2.08.0 x64
Core Temp V1.18.1

Full load

30 minutes

CameraFLIR E86 Thermal Imaging Camera

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3. Chassis Fan Allocation
Fan8

Fan7

Fan1

Fan2

Fan3

Fan610

Fan5

Fan4

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4. Chassis Thermal Airflow
Cool Airflow Inlets

Hot Airflow Exhausts

Bottom

Bottom

Bottom

TopTop11

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5. Chassis Measured Points
4Measure
Point

Description

Airflow

Thermocouple
Number1Chassis Bottom ExternalIntake101

2Chassis Bottom Internal

Exhaust102

3Chassis Top Internal

Intake103

4Chassis Top External

Exhaust104

5Chassis Right Internal

Intake105

6Chassis Right External

Exhaust106

7GPU Left Fan

Intake107

8GPU Right

Exhaust108

9CPU TopCPU Exhaust

109

10PSU Right

Intake110

11PSU Rear

Exhaust

111

395
7
8

2

1

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5. Chassis Measured Points

6101113Measure
Point

Description

Airflow

Thermocouple
Number1

Chassis Bottom External

Intake101

2Chassis Bottom Internal

Intake102

3Chassis Top Internal

Exhaust103

4Chassis Top External

Exhaust104

5Chassis Right Internal

Intake105

6Chassis Right External

Intake106

7GPU Left Fan

Intake107

8GPU RightExhaust

108

9CPU TopCPU Exhaust

109

10PSU Right

Intake110

11PSU Rear

Exhaust111

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6. Thermal Stress Test

••••

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Setting up the chamber temperature and humidity
Temperature: 25°C
Humidity: 50%
Recording Data

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6. Thermal Stress Test

Temperature Data Recoding
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6. Thermal Stress Test
CPU- Intel Core i9-13900K
GPU-ASUS ROG-STRIX-RTX4090
Ambient Temperature: 25°C
Humidity: 50%

System Thermal Stress Test CTE E550 TG
Chassis Bottom External

25.7

0.3

Chassis Bottom Internal

1.98

PSU Right

2.07

GPU Left Fan

26.02

2826.23

28.3

27.08

2.92

Chassis Top External

10.7

Chassis Right Internal

11.3

Chassis Top Internal

12.1

Chassis Right External

12.3

CPU Top

12.4

GPU Right
PSU Rear

19.9
5

1015

Ambient Temp.

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27.5

38.2

2738.3

27.2

39.3

27.2

39.5

27.5

39.9

27.5

14.6

026

42.1

25.8

20

Load Temp.

45.7

2530

ΔT

35

40

4550

Temperature - Degree CLower is Better

We expected to see higher temperature at the exhaust points and relatively lower temperature at the intake positions. Thehighest temperature was found at the AIO exhaust, which is reasonable given the CPU was running at full load. Most of
the intake positions recorded a temperature lower than 46°C since they were drawing air from environment. Two criticalpositions we were looking at are NO. 107 GPU Fan and NO. 109 CPU Top, which were drawing internal air to cool two of
the most important components.
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7. AIDA64 & FurMark Test
We used AIDA64 Extreme (stress FPU) and FurMark ROG Edition (resolution: 3840 x 2160) to
push 100% load on the CPU and GPU for 30 minutes.

AIDA64 ExtremeFurMark
17IdleFull load

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7. AIDA64 & FurMark Test
We used AIDA64 Extreme (stress FPU) and FurMark ROG Edition (resolution: 3840 x 2160) to
push 100% load on the CPU and GPU for 30 minutes.

Idle

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Full load

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7. AIDA64 & FurMark Test
CPU & GPU Thermal Stress Test CTE E550 TG
30MB37732

CPU825034GPU

82
48010

CPU- Intel Core i9-13900K
GPU-ASUS ROG-STRIX-RTX4090
Ambient Temperature: 25°CHumidity: 50%
Loading with AIDA64 & FurMark

192030Idle Temp.

4050Load Temp.

60ΔT

708090Temperature - Degree CLower is Better

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8. Graphics Performance Testing

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9. Acoustic Sound Pressure Level Test
Test Environment：Thermaltake Taipei Office
Test Model: CTE 550 TG
Test Ambience: 25.0 ℃(Temperature) / 50% R.H.(Relative Humidity)
Microphone position: 50 cm / in front of PC system
Background Noise：35.5 dBA.

30°50CM

Microphone position
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Test Ambience
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9. Acoustic Sound Pressure Level Test
Fan Speed 400rpm – 36.3dBA

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Fan Speed 550rpm – 36.8dBA

Fan Speed 750rpm – 37.2dBA

Fan Speed 2000rpm – 52.7dBA

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9. Acoustic Sound Pressure Level Test
Acoustic Sound Pressure Level Test - CTE E550 TG
0.8

Fan Speed 400 rpm (Silent)

36.3
35.5

1.3

Fan Speed 550 rpm (Standard)

36.8
35.5

1.7

Fan Speed 750 rpm (Turbo)

37.2
35.5

23DMARK Test - Fan 800 rpm

37.5
35.5
17.2

Fan Speed 2000 rpm (Performance)

18.1

Stress Test Full Load- Fan 2000 rpm

2353.635.5

0CPU- Intel Core i9-13900K
GPU-ASUS ROG-STRIX-RTX4090
Ambient Temperature: 25°C
Humidity: 50%
Loading with AIDA64 & FurMark

52.7

35.5Diff

10Load dBA

20Idle dBA

30405060

Temperature - Degree CLower is Better

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C. Conclusion

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Conclusion
Idle

Full Load

Left View

CPU 82℃

GPU 82℃

AIDA64 Extreme (stress FPU) and FurMark ROG Edition (resolution: 3840 x 2160) to push 100% load on the CPU and GPU
for 30 minutes.

-INTEL i9 13900K / CPU Temp. (Max)：82℃ (TDP 253W)-ASUS ROG Strix GeForce RTX® 4090 OC / GPU Temp. (Max)：82℃
Through the thermal image, we found that the internal heat was effectively directed to designatedexhaustion vents, keeping the system operating at a cooler temperature. This finding validates how
efficient CTE E550 TG is regarding cooling performance.
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26Thank You