InvenSense Inc.
1197 Borregas Ave, Sunnyvale, CA 94089 U.S.A.
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104
Website: www.invensense.com

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

MPU-6000 and MPU-6050
Product Specification
Revision 3.1

1 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

CONTENTS
1REVISION HISTORY ...................................................................................................................................52

PURPOSE AND SCOPE .............................................................................................................................6

3

PRODUCT OVERVIEW ...............................................................................................................................7
3.1

MPU-60X0 OVERVIEW ........................................................................................................................74

APPLICATIONS...........................................................................................................................................95

FEATURES ................................................................................................................................................10

6

7

5.1

GYROSCOPE FEATURES .....................................................................................................................10

5.2

ACCELEROMETER FEATURES .............................................................................................................10

5.3

ADDITIONAL FEATURES ......................................................................................................................10

5.4

MOTIONPROCESSING .........................................................................................................................11

5.5

CLOCKING .........................................................................................................................................11

ELECTRICAL CHARACTERISTICS .........................................................................................................12
6.1

GYROSCOPE SPECIFICATIONS ............................................................................................................12

6.2

ACCELEROMETER SPECIFICATIONS .....................................................................................................13

6.3

ELECTRICAL AND OTHER COMMON SPECIFICATIONS............................................................................14

6.4

ELECTRICAL SPECIFICATIONS, CONTINUED .........................................................................................15

6.5

ELECTRICAL SPECIFICATIONS, CONTINUED .........................................................................................16

6.6

ELECTRICAL SPECIFICATIONS, CONTINUED .........................................................................................17

6.7

I2C TIMING CHARACTERIZATION..........................................................................................................18

6.8

SPI TIMING CHARACTERIZATION (MPU-6000 ONLY) ...........................................................................19

6.9

ABSOLUTE MAXIMUM RATINGS ...........................................................................................................20

APPLICATIONS INFORMATION ..............................................................................................................21
7.1

PIN OUT AND SIGNAL DESCRIPTION ....................................................................................................21

7.2

TYPICAL OPERATING CIRCUIT.............................................................................................................22

7.3

BILL OF MATERIALS FOR EXTERNAL COMPONENTS ..............................................................................22

7.4

RECOMMENDED POWER-ON PROCEDURE ...........................................................................................23

7.5

BLOCK DIAGRAM ...............................................................................................................................24

7.6

OVERVIEW ........................................................................................................................................24

7.7

THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING ................................25

7.8

THREE-AXIS MEMS ACCELEROMETER WITH 16-BIT ADCS AND SIGNAL CONDITIONING ........................25

7.9

DIGITAL MOTION PROCESSOR ............................................................................................................25

7.10

PRIMARY I2C AND SPI SERIAL COMMUNICATIONS INTERFACES ............................................................25

7.11

AUXILIARY I2C SERIAL INTERFACE ......................................................................................................26

2 of 57

MPU-6000/MPU-6050 Product Specification

8

9

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

7.12

SELF-TEST ........................................................................................................................................27

7.13

MPU-60X0 SOLUTION FOR 9-AXIS SENSOR FUSION USING I2C INTERFACE ..........................................28

7.14

MPU-6000 USING SPI INTERFACE .....................................................................................................29

7.15

INTERNAL CLOCK GENERATION ..........................................................................................................30

7.16

SENSOR DATA REGISTERS .................................................................................................................30

7.17

FIFO ................................................................................................................................................30

7.18

INTERRUPTS ......................................................................................................................................31

7.19

DIGITAL-OUTPUT TEMPERATURE SENSOR ..........................................................................................31

7.20

BIAS AND LDO ..................................................................................................................................31

7.21

CHARGE PUMP ..................................................................................................................................31

PROGRAMMABLE INTERRUPTS............................................................................................................32
8.1

FREE FALL, MOTION, AND ZERO MOTION SIGNAL PATHS .....................................................................33

8.2

FREE FALL INTERRUPT .......................................................................................................................34

8.3

MOTION INTERRUPT ...........................................................................................................................34

8.4

ZERO MOTION INTERRUPT..................................................................................................................35

DIGITAL INTERFACE ...............................................................................................................................36
9.1

I2C AND SPI (MPU-6000 ONLY) SERIAL INTERFACES ..........................................................................36

9.2

I2C INTERFACE ..................................................................................................................................36

9.3

I2C COMMUNICATIONS PROTOCOL ......................................................................................................36

9.4

I2C TERMS ........................................................................................................................................39

9.5

SPI INTERFACE (MPU-6000 ONLY) ....................................................................................................40

10 SERIAL INTERFACE CONSIDERATIONS (MPU-6050) ..........................................................................41
10.1

MPU-6050 SUPPORTED INTERFACES .................................................................................................41

10.2

LOGIC LEVELS ...................................................................................................................................41

10.3

LOGIC LEVELS DIAGRAM FOR AUX_VDDIO = 0 ..................................................................................42

10.4

LOGIC LEVELS DIAGRAM FOR AUX_VDDIO = 1 ..................................................................................43

11 ASSEMBLY ...............................................................................................................................................44
11.1

ORIENTATION OF AXES ......................................................................................................................44

11.2

PACKAGE DIMENSIONS ......................................................................................................................45

11.3

PCB DESIGN GUIDELINES ..................................................................................................................46

11.4

ASSEMBLY PRECAUTIONS ..................................................................................................................47

11.5

STORAGE SPECIFICATIONS.................................................................................................................51

11.6

PACKAGE MARKING SPECIFICATION ....................................................................................................51

11.7

TAPE & REEL SPECIFICATION .............................................................................................................52

3 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

11.8

LABEL ...............................................................................................................................................53

11.9

PACKAGING .......................................................................................................................................54

12 RELIABILITY .............................................................................................................................................55
12.1

QUALIFICATION TEST POLICY .............................................................................................................55

12.2

QUALIFICATION TEST PLAN ................................................................................................................55

13 ENVIRONMENTAL COMPLIANCE...........................................................................................................56

4 of 57

MPU-6000/MPU-6050 Product Specification

1

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

Revision History

Revision
Date

Revision

Description

11/24/2010

1.0

Initial Release

05/19/2011

2.0

For Rev C parts. Clarified wording in sections (3.2, 5.1, 5.2, 6.1-6.4, 6.6, 6.9, 7,
7.1-7.6, 7.11, 7.12, 7.14, 8, 8.2-8.4, 10.3, 10.4, 11, 12.2)

07/28/2011

2.1

Edited supply current numbers for different modes (section 6.4)

08/05/2011

2.2

Unit of measure for accelerometer sensitivity changed from LSB/mg to LSB/g

10/12/2011

2.3

Updated accelerometer self test specifications in Table 6.2. Updated package
dimensions (section 11.2). Updated PCB design guidelines (section 11.3)

10/18/2011

3.0

For Rev D parts. Updated accelerometer specifications in Table 6.2. Updated
accelerometer specification note (sections 8.2, 8.3, & 8.4). Updated qualification
test plan (section 12.2).

3.1

Edits for clarity
Changed operating voltage range to 2.375V-3.46V
Added accelerometer Intelligence Function increment value of 1mg/LSB(Section 6.2)
Updated absolute maximum rating for acceleration (any axis, unpowered) from
0.3ms to 0.2ms (Section 6.9)
Modified absolute maximum rating for Latch-up to Level A and ±100mA (Section
6.9, 12.2)

10/24/2011

5 of 57

MPU-6000/MPU-6050 Product Specification

2

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

Purpose and Scope

This product specification provides advanced information regarding the electrical specification and design
related information for the MPU-6000™ and MPU-6050™ Motion Processing Unit™, collectively called the
MPU-60X0™ or MPU™.
Electrical characteristics are based upon design analysis and simulation results only. Specifications are
subject to change without notice. Final specifications will be updated based upon characterization of
production silicon. For references to register map and descriptions of individual registers, please refer to the
MPU-6000/MPU-6050 Register Map and Register Descriptions document.

6 of 57

MPU-6000/MPU-6050 Product Specification

3

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

Product Overview

3.1 MPU-60X0 Overview
The MPU-60X0 Motion Processing Unit is the world’s first motion processing solution with integrated 9-Axis
sensor fusion using its field-proven and proprietary MotionFusion™ engine for handset and tablet
applications, game controllers, motion pointer remote controls, and other consumer devices. The MPU-60X0
has an embedded 3-axis MEMS gyroscope, a 3-axis MEMS accelerometer, and a Digital Motion
Processor™ (DMP™) hardware accelerator engine with an auxiliary I2C port that interfaces to 3rd party digitalsensors such as magnetometers. When connected to a 3-axis magnetometer, the MPU-60X0 delivers acomplete 9-axis MotionFusion output to its primary I2C or SPI port (SPI is available on MPU-6000 only). The
MPU-60X0 combines acceleration and rotational motion plus heading information into a single data stream
for the application. This MotionProcessing™ technology integration provides a smaller footprint and has
inherent cost advantages compared to discrete gyroscope plus accelerometer solutions. The MPU-60X0 is
also designed to interface with multiple non-inertial digital sensors, such as pressure sensors, on its auxiliary
I2C port. The MPU-60X0 is a 2nd generation motion processor and is footprint compatible with the MPU30X0 family.
The MPU-60X0 features three 16-bit analog-to-digital converters (ADCs) for digitizing the gyroscope outputs
and three 16-bit ADCs for digitizing the accelerometer outputs. For precision tracking of both fast and slow
motions, the parts feature a user-programmable gyroscope full-scale range of ±250, ±500, ±1000, and±2000°/sec (dps) and a user-programmable accelerometer full-scale range of ±2g, ±4g, ±8g, and ±16g.
An on-chip 1024 Byte FIFO buffer helps lower system power consumption by allowing the system processor
to read the sensor data in bursts and then enter a low-power mode as the MPU collects more data. With all
the necessary on-chip processing and sensor components required to support many motion-based use
cases, the MPU-60X0 uniquely supports a variety of advanced motion-based applications entirely on-chip.
The MPU-60X0 thus enables low-power MotionProcessing in portable applications with reduced processing
requirements for the system processor. By providing an integrated MotionFusion output, the DMP in the
MPU-60X0 offloads the intensive MotionProcessing computation requirements from the system processor,
minimizing the need for frequent polling of the motion sensor output.
Communication with all registers of the device is performed using either I2C at 400kHz or SPI at 1MHz(MPU-6000 only). For applications requiring faster communications, the sensor and interrupt registers may
be read using SPI at 20MHz (MPU-6000 only). Additional features include an embedded temperature sensor
and an on-chip oscillator with ±1% variation over the operating temperature range.
By leveraging its patented and volume-proven Nasiri-Fabrication platform, which integrates MEMS wafers
with companion CMOS electronics through wafer-level bonding, InvenSense has driven the MPU-60X0
package size down to a revolutionary footprint of 4x4x0.9mm (QFN), while providing the highest
performance, lowest noise, and the lowest cost semiconductor packaging required for handheld consumer
electronic devices. The part features a robust 10,000g shock tolerance, and has programmable low-passfilters for the gyroscopes, accelerometers, and the on-chip temperature sensor.
For power supply flexibility, the MPU-60X0 operates from VDD power supply voltage range of 2.375V-3.46V.
Additionally, the MPU-6050 provides a VLOGIC reference pin (in addition to its analog supply pin: VDD),
which sets the logic levels of its I2C interface. The VLOGIC voltage may be 1.8V±5% or VDD.
The MPU-6000 and MPU-6050 are identical, except that the MPU-6050 supports the I2C serial interface only,
and has a separate VLOGIC reference pin. The MPU-6000 supports both I2C and SPI interfaces and has asingle supply pin, VDD, which is both the device’s logic reference supply and the analog supply for the part.
The table below outlines these differences:

7 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

Primary Differences between MPU-6000 and MPU-6050
Part / ItemVDD
VLOGIC
Serial Interfaces Supported
Pin 8
Pin 9
Pin 23
Pin 24

MPU-6000
2.375V-3.46V
n/a
I2C, SPI/CS
AD0/SDO
SCL/SCLK
SDA/SDI

8 of 57

MPU-6050
2.375V-3.46V
1.71V to VDD
I2C
VLOGICAD0SCLSDAMPU-6000/MPU-6050 Product Specification

4

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

Applications













BlurFree™ technology (for Video/Still Image Stabilization)
AirSign™ technology (for Security/Authentication)
TouchAnywhere™ technology (for “no touch” UI Application Control/Navigation)
MotionCommand™ technology (for Gesture Short-cuts)
Motion-enabled game and application framework
InstantGesture™ iG™ gesture recognition
Location based services, points of interest, and dead reckoning
Handset and portable gaming
Motion-based game controllers
3D remote controls for Internet connected DTVs and set top boxes, 3D mice
Wearable sensors for health, fitness and sports
Toys

9 of 57

MPU-6000/MPU-6050 Product Specification

5

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

Features

5.1 Gyroscope Features
The triple-axis MEMS gyroscope in the MPU-60X0 includes a wide range of features:










Digital-output X-, Y-, and Z-Axis angular rate sensors (gyroscopes) with a user-programmable fullscale range of ±250, ±500, ±1000, and ±2000°/sec
External sync signal connected to the FSYNC pin supports image, video and GPS synchronization
Integrated 16-bit ADCs enable simultaneous sampling of gyros
Enhanced bias and sensitivity temperature stability reduces the need for user calibration
Improved low-frequency noise performance
Digitally-programmable low-pass filter
Gyroscope operating current: 3.6mAStandby current: 5µA
Factory calibrated sensitivity scale factor

5.2 Accelerometer Features
The triple-axis MEMS accelerometer in MPU-60X0 includes a wide range of features:












Digital-output triple-axis accelerometer with a programmable full scale range of ±2g, ±4g, ±8g and±16g
Integrated 16-bit ADCs enable simultaneous sampling of accelerometers while requiring no external
multiplexer
Accelerometer normal operating current: 500µA
Low power accelerometer mode current: 10µA at 1.25Hz, 20µA at 5Hz, 60µA at 20Hz, 110µA at
40Hz
Orientation detection and signaling
Tap detection
User-programmable interrupts
Free-fall interrupt
High-G interrupt
Zero Motion/Motion interrupt
User self-test

5.3 Additional Features
The MPU-60X0 includes the following additional features:














9-Axis MotionFusion by the on-chip Digital Motion Processor (DMP)
Auxiliary master I2C bus for reading data from external sensors (e.g., magnetometer)
3.9mA operating current when all 6 motion sensing axes and the DMP are enabled
VDD supply voltage range of 2.375V-3.46V
Flexible VLOGIC reference voltage supports multiple I2C interface voltages (MPU-6050 only)
Smallest and thinnest QFN package for portable devices: 4x4x0.9mm
Minimal cross-axis sensitivity between the accelerometer and gyroscope axes
1024 byte FIFO buffer reduces power consumption by allowing host processor to read the data inbursts and then go into a low-power mode as the MPU collects more data
Digital-output temperature sensor
User-programmable digital filters for gyroscope, accelerometer, and temp sensor
10,000 g shock tolerant
400kHz Fast Mode I2C for communicating with all registers
1MHz SPI serial interface for communicating with all registers (MPU-6000 only)

10 of 57

MPU-6000/MPU-6050 Product Specification




5.4

5.5

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

20MHz SPI serial interface for reading sensor and interrupt registers (MPU-6000 only)
MEMS structure hermetically sealed and bonded at wafer level
RoHS and Green compliant

MotionProcessing
Internal Digital Motion Processing™ (DMP™) engine supports 3D MotionProcessing and gesturerecognition algorithms
 The MPU-60X0 collects gyroscope and accelerometer data while synchronizing data sampling at auser defined rate. The total dataset obtained by the MPU-60X0 includes 3-Axis gyroscope data, 3Axis accelerometer data, and temperature data. The MPU’s calculated output to the systemprocessor can also include heading data from a digital 3-axis third party magnetometer.
 The FIFO buffers the complete data set, reducing timing requirements on the system processor byallowing the processor burst read the FIFO data. After burst reading the FIFO data, the systemprocessor can save power by entering a low-power sleep mode while the MPU collects more data.
 Programmable interrupt supports features such as gesture recognition, panning, zooming, scrolling,zero-motion detection, tap detection, and shake detection
 Digitally-programmable low-pass filters
 Low-power pedometer functionality allows the host processor to sleep while the DMP maintains thestep count.



Clocking
On-chip timing generator ±1% frequency variation over full temperature range
Optional external clock inputs of 32.768kHz or 19.2MHz

11 of 57

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

MPU-6000/MPU-6050 Product Specification

6

Electrical Characteristics

6.1 Gyroscope Specifications
VDD = 2.375V-3.46V, VLOGIC (MPU-6050 only) = 1.8V±5% or VDD, TA = 25°C
PARAMETERGYROSCOPE SENSITIVITY
Full-Scale Range

Gyroscope ADC Word Length
Sensitivity Scale Factor

Sensitivity Scale Factor Tolerance
Sensitivity Scale Factor Variation Over
Temperature
Nonlinearity
Cross-Axis Sensitivity
GYROSCOPE ZERO-RATE OUTPUT (ZRO)
Initial ZRO Tolerance
ZRO Variation Over TemperaturePower-Supply Sensitivity (1-10Hz)
Power-Supply Sensitivity (10 - 250Hz)
Power-Supply Sensitivity (250Hz - 100kHz)
Linear Acceleration Sensitivity
GYROSCOPE NOISE PERFORMANCE
Total RMS Noise
Low-frequency RMS noise
Rate Noise Spectral Density

CONDITIONSMIN

FS_SEL=0
FS_SEL=1
FS_SEL=2
FS_SEL=3

TYP

MAX

±250
±500
±1000
±2000
16
131
65.5
32.8
16.4

UNITS

±2

º/s
º/s
º/s
º/s
bits
LSB/(º/s)
LSB/(º/s)
LSB/(º/s)
LSB/(º/s)%%

Best fit straight line; 25°C

0.2
±2

%
%

25°C
-40°C to +85°C
Sine wave, 100mVpp; VDD=2.5V
Sine wave, 100mVpp; VDD=2.5V
Sine wave, 100mVpp; VDD=2.5V
Static
FS_SEL=0
DLPFCFG=2 (100Hz)
Bandwidth 1Hz to10Hz
At 10Hz

±20
±20
0.2
0.2
4
0.1

º/s
º/s
º/s
º/s
º/s
º/s/g

0.05
0.033
0.005

º/s-rmsº/s-rms

FS_SEL=0
FS_SEL=1
FS_SEL=2
FS_SEL=325°C-3GYROSCOPE MECHANICALFREQUENCIES
X-AxisY-AxisZ-AxisLOW PASS FILTER RESPONSE

30
27
24

+3

33
30
27

º/s/√Hz36
33
30

Programmable Range

5256

Programmable
DLPFCFG=0
to ±1º/s of Final

4

8,000

kHz
kHz
kHz
Hz

OUTPUT DATA RATEGYROSCOPE START-UP TIMEZRO Settling30

12 of 57

Hz
ms

NOTES

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

MPU-6000/MPU-6050 Product Specification

6.2 Accelerometer Specifications
VDD = 2.375V-3.46V, VLOGIC (MPU-6050 only) = 1.8V±5% or VDD, TA = 25°C
PARAMETERACCELEROMETER SENSITIVITY
Full-Scale Range

ADC Word Length
Sensitivity Scale Factor

Initial Calibration Tolerance
Sensitivity Change vs. Temperature
Nonlinearity
Cross-Axis Sensitivity
ZERO-G OUTPUT
1
Initial Calibration Tolerance
Zero-G Level Change vs. Temperature

CONDITIONSMIN

AFS_SEL=0
AFS_SEL=1
AFS_SEL=2
AFS_SEL=3
Output in two’s complement format
AFS_SEL=0
AFS_SEL=1
AFS_SEL=2
AFS_SEL=3
AFS_SEL=0, -40°C to +85°C
Best Fit Straight LineX and Y axes
Z axisX and Y axes, 0°C to +70°C
Z axis, 0°C to +70°C

TYP

MAX

UNITS

±2
±4
±8
±16
16
16,384
8,192
4,096
2,048
±3
±0.02
0.5
±2

g
g
g
g
bits
LSB/g
LSB/g
LSB/g
LSB/g
%
%/°C
%
%

±50
±80
±35
±60

mg
mg
mg

0.5

g

400

g/√HzSELF TEST RESPONSE
NOISE PERFORMANCEPower Spectral Density@10Hz, AFS_SEL=0 & ODR=1kHz

LOW PASS FILTER RESPONSE
Programmable Range

5

260

Hz

Programmable Range

4

1,000

Hz

OUTPUT DATA RATEINTELLIGENCE FUNCTION
INCREMENT

1.

1

Typical zero-g initial calibration tolerance value after MSL3 preconditioning

13 of 57mg/LSBNOTESMPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

6.3 Electrical and Other Common Specifications
VDD = 2.375V-3.46V, VLOGIC (MPU-6050 only) = 1.8V±5% or VDD, TA = 25°C
PARAMETERTEMPERATURE SENSOR
Range
Sensitivity
Temperature Offset
Linearity

CONDITIONS

MIN

Untrimmedo
35 C
Best fit straight line (-40°C to+85°C)VDD POWER SUPPLY
Operating Voltages
Normal Operating Current

TYP

Units

-40 to +85
340
-521

°C
LSB/ºC
LSB

±1

°C

2.375
Gyroscope + Accelerometer + DMP

MAX

3.46

V

3.9

mA

3.8

mA

3.7

mA

3.6

mA

(DMP & Gyroscope disabled)

500

µA

1.25 Hz update rate

10µA

5 Hz update rate

20µA

20 Hz update rate

60

µA

40 Hz update rate

110

µA

Gyroscope + Accelerometer(DMP disabled)
Gyroscope + DMP(Accelerometer disabled)
Gyroscope only
(DMP & Accelerometer disabled)
Accelerometer only
Accelerometer Low Power Mode
Current

Full-Chip Idle Mode Supply Current
Power Supply Ramp RateVLOGIC REFERENCE VOLTAGE
Voltage Range
Power Supply Ramp Rate
Normal Operating Current
START-UP TIME FOR REGISTER
READ/WRITETEMPERATURE RANGE
Specified Temperature Range

5
Monotonic ramp. Ramp rate is 10%
to 90% of the final value
MPU-6050 only
VLOGIC must be ≤VDD at all times

1.71

Monotonic ramp. Ramp rate is 10%
to 90% of the final value

µA
100

ms

VDD

V

3

ms

100
20
Performance parameters are notapplicable beyond Specified
Temperature Range

14 of 57

-40

µA
100

ms

+85

°C

Notes

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

6.4 Electrical Specifications, Continued
VDD = 2.375V-3.46V, VLOGIC (MPU-6050 only) = 1.8V±5% or VDD, TA = 25°C
PARAMETERSERIAL INTERFACESPI Operating Frequency, All
Registers Read/Write

SPI Operating Frequency, Sensor
and Interrupt Registers Read Only2
I C Operating Frequency
2

I C ADDRESSCONDITIONSMIN

MPU-6000 only, Low Speed
Characterization
MPU-6000 only, High Speed
Characterization
MPU-6000 only
All registers, Fast-mode
All registers, Standard-mode
AD0 = 0AD0 = 1

TYP

MAX

Units

100 ±10%kHz

1 ±10%

MHz

20 ±10%

MHz
400
100

kHz
kHz

0.3*VDD

V
V
V

1101000
1101001

DIGITAL INPUTS (SDI/SDA, AD0,SCLK/SCL, FSYNC, /CS, CLKIN)
VIH, High Level Input Voltage
VIL, Low Level Input Voltage

MPU-6000
MPU-6050
MPU-6000

0.7*VDD
0.7*VLOGIC

MPU-6050

0.3*VLOGIC

CI, Input Capacitance
DIGITAL OUTPUT (SDO, INT)
VOH, High Level Output Voltage

VOL1, LOW-Level Output Voltage

<5

V
pF

RLOAD=1MΩ; MPU-6000

0.9*VDDV

RLOAD=1MΩ; MPU-6050

0.9*VLOGICV

RLOAD=1MΩ; MPU-6000

0.1*VDDV

RLOAD=1MΩ; MPU-6050

0.1*VLOGIC

V

0.1

V

Output Leakage Current

OPEN=1, 0.3mA sink
Current
OPEN=1

100

nA

tINT, INT Pulse Width

LATCH_INT_EN=050µs

DIGITAL OUTPUT (CLKOUT)
VOH, High Level Output Voltage
VOL1, LOW-Level Output Voltage

RLOAD=1MΩ
RLOAD=1MΩ

VOL.INT1, INT Low-Level Output
Voltage

0.9*VDD
0.1*VDD

15 of 57

V
V

Notes

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

6.5 Electrical Specifications, Continued
Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.46V, VLOGIC (MPU-6050 only) = 1.8V±5% or
VDD, TA = 25°C
Parameters

Conditions

TypicalUnits-0.5 to 0.3*VDD
0.7*VDD to VDD + 0.5V
0.1*VDD-0.5V to 0.3*VLOGIC
0.7*VLOGIC to VLOGIC + 0.5V
0.1*VLOGIC
0 to 0.4
35
100
20+0.1Cb to 250
< 10

V
V
V
V
V
V
V
mA
mA
nA
ns
pF

-0.5V to 0.3*VLOGIC
0.7*VLOGIC to
VLOGIC + 0.5V
0.1*VLOGIC
0 to 0.4
0 to 0.2*VLOGIC
11
100
20+0.1Cb to 250
< 10

V
V
V
V
V
mA
mA
nA
ns
pF

-0.5 to 0.3*VDD
0.7*VDD to VDD+0.5V
0.1*VDD
0 to 0.4
1
1
100
20+0.1Cb to 250
< 10

V
V
V
V
mA
mA
nA
ns
pF

2

Primary I C I/O (SCL, SDA)
VIL, LOW-Level Input Voltage
VIH, HIGH-Level Input Voltage
Vhys, Hysteresis
VIL, LOW Level Input Voltage
VIH, HIGH-Level Input Voltage
Vhys, Hysteresis
VOL1, LOW-Level Output Voltage
IOL, LOW-Level Output Current
Output Leakage Current
tof, Output Fall Time from VIHmax to VILmax
CI, Capacitance for Each I/O pin
2

Auxiliary I C I/O (AUX_CL, AUX_DA)
VIL, LOW-Level Input Voltage
VIH, HIGH-Level Input Voltage
Vhys, Hysteresis
VOL1, LOW-Level Output Voltage
VOL3, LOW-Level Output Voltage
IOL, LOW-Level Output Current
Output Leakage Current
tof, Output Fall Time from VIHmax to VILmax
CI, Capacitance for Each I/O pin
2

Auxiliary I C I/O (AUX_CL, AUX_DA)
VIL, LOW-Level Input Voltage
VIH, HIGH-Level Input Voltage
Vhys, Hysteresis
VOL1, LOW-Level Output Voltage
IOL, LOW-Level Output Current
Output Leakage Current
tof, Output Fall Time from VIHmax to VILmax
CI, Capacitance for Each I/O pin

MPU-6000
MPU-6000
MPU-6000
MPU-6050
MPU-6050
MPU-6050
3mA sink current
VOL = 0.4V
VOL = 0.6V
Cb bus capacitance in pF
MPU-6050: AUX_VDDIO=0

VLOGIC > 2V; 1mA sink current
VLOGIC < 2V; 1mA sink current
VOL = 0.4V
VOL = 0.6V
Cb bus capacitance in pF
MPU-6050: AUX_VDDIO=1;
MPU-6000

1mA sink current
VOL = 0.4V
VOL = 0.6V
Cb bus cap. in pF

16 of 57

Notes

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

6.6 Electrical Specifications, Continued
Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.46V, VLOGIC (MPU-6050 only) = 1.8V±5% or
VDD, TA = 25°C
Parameters

Conditions

INTERNAL CLOCK SOURCE
Gyroscope Sample Rate, Fast

CLK_SEL=0,1,2,3
DLPFCFG=0
SAMPLERATEDIV = 0

Min

Gyroscope Sample Rate, Slow

DLPFCFG=1,2,3,4,5, or 6
SAMPLERATEDIV = 0

Accelerometer Sample Rate
Reference Clock Output
Clock Frequency Initial Tolerance
Frequency Variation over Temperature
PLL Settling Time
EXTERNAL 32.768kHz CLOCK
External Clock Frequency
External Clock Allowable Jitter
Gyroscope Sample Rate, Fast
Gyroscope Sample Rate, Slow

CLKOUTEN = 1
CLK_SEL=0, 25°C
CLK_SEL=1,2,3; 25°C
CLK_SEL=0
CLK_SEL=1,2,3
CLK_SEL=1,2,3

Units
kHz

1

kHz

1

kHz

1.024
+5
+1
-15 to +10
±1
1

10

MHz
%
%
%
%
ms

CLK_SEL=4
Cycle-to-cycle rms
DLPFCFG=0
SAMPLERATEDIV = 0
DLPFCFG=1,2,3,4,5, or 6
SAMPLERATEDIV = 0

Reference Clock Output
PLL Settling Time

CLKOUTEN = 1

EXTERNAL 19.2MHz CLOCK
External Clock Frequency
Gyroscope Sample Rate
Gyroscope Sample Rate, Fast Mode

CLK_SEL=532.7681 to 2
8.192

kHz
µs
kHz

1.024

kHz

1.024

kHz

1.04861

10

19.2
Full programmable range
DLPFCFG=0
SAMPLERATEDIV = 0
DLPFCFG=1,2,3,4,5, or 6
SAMPLERATEDIV = 0

Accelerometer Sample Rate
Reference Clock Output
PLL Settling Time

Max

8

-5
-1

Accelerometer Sample Rate

Gyroscope Sample Rate, Slow Mode

Typical

CLKOUTEN = 1

8

MHz
Hz
kHz

1

kHz

1

kHz

3.9

8000

1.024
1

17 of 57

MHz
ms

10

MHz
ms

Notes

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

6.7 I2C Timing Characterization
Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.46V, VLOGIC (MPU-6050 only) = 1.8V±5% or
VDD, TA = 25°C
Parameters

Conditions

2

I C FAST-MODE

I C TIMINGfSCL, SCL Clock Frequency
tHD.STA, (Repeated) START Condition HoldTime
tLOW, SCL Low PeriodtHIGH, SCL High PeriodtSU.STA, Repeated START Condition Setup
Time
tHD.DAT, SDA Data Hold TimetSU.DAT, SDA Data Setup Timetr, SDA and SCL Rise Timetf, SDA and SCL Fall Time
tSU.STO, STOP Condition Setup TimeMin

Typical

Max

Units

400
0.6

kHz
µs

1.3
0.6
0.6

µs
µs
µs

0
100
20+0.1Cb
20+0.1Cb
0.6

µs
ns
ns
ns
µs

2

Cb bus cap. from 10 to 400pF
Cb bus cap. from 10 to 400pF

tBUF, Bus Free Time Between STOP and
START Condition
Cb, Capacitive Load for each Bus LinetVD.DAT, Data Valid Time
tVD.ACK, Data Valid Acknowledge Time

300
300

1.3

µs
< 400
0.9
0.9

Note: Timing Characteristics apply to both Primary and Auxiliary I2C Bus

I2C Bus Timing Diagram

18 of 57

pF
µs
µs

Notes

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

6.8 SPI Timing Characterization (MPU-6000 only)
Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.46V, VLOGIC (MPU-6050 only) = 1.8V±5% or
VDD,TA = -40°C to +85°C, unless otherwise noted.
Parameters

Conditions

Min

Typical

Max

Units

1

MHz

SPI TIMINGfSCLK, SCLK Clock FrequencytLOW, SCLK Low Period

400

ns

tHIGH, SCLK High Period

400

ns

tSU.CS, CS Setup Time

8ns

tHD.CS, CS Hold Time

500

ns

tSU.SDI, SDI Setup Time

11

nstHD.SDI, SDI Hold Time

7

nstVD.SDO, SDO Valid Time

Cload = 20pF

tHD.SDO, SDO Hold Time

Cload = 20pF

100
4

tDIS.SDO, SDO Output Disable Time

10

SPI Bus Timing Diagram

19 of 57

ns
ns
ns

Notes

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

6.9 Absolute Maximum Ratings
Stress above those listed as “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only and functional operation of the device at these conditions is not implied.
Exposure to the absolute maximum ratings conditions for extended periods may affect device reliability.

Parameter

RatingSupply Voltage, VDD-0.5V to +6V

VLOGIC Input Voltage Level (MPU-6050)-0.5V to VDD + 0.5V

REGOUT-0.5V to 2V

Input Voltage Level (CLKIN, AUX_DA, AD0, FSYNC, INT,
SCL, SDA)CPOUT (2.5V ≤ VDD ≤ 3.6V )-0.5V to VDD + 0.5V
-0.5V to 30V

Acceleration (Any Axis, unpowered)

10,000g for 0.2ms

Operating Temperature Range-40°C to +105°C

Storage Temperature Range-40°C to +125°C
2kV (HBM);
200V (MM)Electrostatic Discharge (ESD) Protection

JEDEC Class II (2),125°C
Level A, ±100mA

Latch-up

20 of 57

MPU-6000/MPU-6050 Product Specification

7

Applications Information

7.1

Pin Out and Signal Description

Pin Number

MPU6000

MPU6050

1

Y

6

Y

7

Y

8

Y

8
9

Pin Name

Pin Description

Y

CLKIN

Optional external reference clock input. Connect to GND if unused.

Y

AUX_DAI C master serial data, for connecting to external sensors

Y

AUX_CLI C Master serial clock, for connecting to external sensors

Y

VLOGIC

Digital I/O supply voltage

AD0 / SDOI C Slave Address LSB (AD0); SPI serial data output (SDO)

/CS

Y

9

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

Y

AD0

2
2

SPI chip select (0=SPI mode)
2
2

I C Slave Address LSB (AD0)

10

Y

Y

REGOUT

Regulator filter capacitor connection

11

Y

Y

FSYNC

Frame synchronization digital input. Connect to GND if unused.

12

Y

Y

INT

Interrupt digital output (totem pole or open-drain)

13

Y

Y

VDD

Power supply voltage and Digital I/O supply voltage

18

Y

Y

GND

Power supply ground19, 21YY

RESVReserved. Do not connect.

20

Y

Y

CPOUT

Charge pump capacitor connection

22

Y

Y

CLKOUT

System clock output

23

Y

SCL / SCLKI C serial clock (SCL); SPI serial clock (SCLK)

23
24

Y
Y

24
2, 3, 4, 5, 14,
15, 16, 17

YSCL
SDA / SDI2
2

I C serial clock (SCL)2

I C serial data (SDA); SPI serial data input (SDI)
2

Y

SDA

I C serial data (SDA)Y

NC

Not internally connected. May be used for PCB trace routing.

21 of 57

MPU-6000/MPU-6050 Product Specification

7.2

Typical Operating Circuit

7.3

Bill of Materials for External Components

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

Component

LabelSpecification

Quantity

Regulator Filter Capacitor (Pin 10)

C1

Ceramic, X7R, 0.1µF ±10%, 2V

1

VDD Bypass Capacitor (Pin 13)

C2

Ceramic, X7R, 0.1µF ±10%, 4V

1Charge Pump Capacitor (Pin 20)

C3

Ceramic, X7R, 2.2nF ±10%, 50V

1

VLOGIC Bypass Capacitor (Pin 8)

C4*

Ceramic, X7R, 10nF ±10%, 4V

1* MPU-6050 Only.

22 of 57

MPU-6000/MPU-6050 Product Specification

7.4

Recommended Power-on Procedure

23 of 57

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

MPU-6000/MPU-6050 Product Specification

7.5

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

Block Diagram

7.6 Overview
The MPU-60X0 is comprised of the following key blocks and functions:














Three-axis MEMS rate gyroscope sensor with 16-bit ADCs and signal conditioning
Three-axis MEMS accelerometer sensor with 16-bit ADCs and signal conditioning
Digital Motion Processor (DMP) engine
Primary I2C and SPI (MPU-6000 only) serial communications interfaces
Auxiliary I2C serial interface for 3rd party magnetometer & other sensors
Clocking
Sensor Data Registers
FIFO
Interrupts
Digital-Output Temperature Sensor
Accelerometer Self-test
Bias and LDO
Charge Pump

24 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

7.7 Three-Axis MEMS Gyroscope with 16-bit ADCs and Signal Conditioning
The MPU-60X0 consists of three independent vibratory MEMS rate gyroscopes, which detect rotation about
the X-, Y-, and Z- Axes. When the gyros are rotated about any of the sense axes, the Coriolis Effect causes
a vibration that is detected by a capacitive pickoff. The resulting signal is amplified, demodulated, and filteredto produce a voltage that is proportional to the angular rate. This voltage is digitized using individual on-chip
16-bit Analog-to-Digital Converters (ADCs) to sample each axis. The full-scale range of the gyro sensors
may be digitally programmed to ±250, ±500, ±1000, or ±2000 degrees per second (dps). The ADC sample
rate is programmable from 8,000 samples per second, down to 3.9 samples per second, and user-selectablelow-pass filters enable a wide range of cut-off frequencies.
7.8 Three-Axis MEMS Accelerometer with 16-bit ADCs and Signal Conditioning
The MPU-60X0’s 3-Axis accelerometer uses separate proof masses for each axis. Acceleration along aparticular axis induces displacement on the corresponding proof mass, and capacitive sensors detect thedisplacement differentially. The MPU-60X0’s architecture reduces the accelerometers’ susceptibility tofabrication variations as well as to thermal drift. When the device is placed on a flat surface, it will measure
0g on the X- and Y-axes and +1g on the Z-axis. The accelerometers’ scale factor is calibrated at the factoryand is nominally independent of supply voltage. Each sensor has a dedicated sigma-delta ADC for providing
digital outputs. The full scale range of the digital output can be adjusted to ±2g, ±4g, ±8g, or ±16g.
7.9 Digital Motion Processor
The embedded Digital Motion Processor (DMP) is located within the MPU-60X0 and offloads computation of
motion processing algorithms from the host processor. The DMP acquires data from accelerometers,
gyroscopes, and additional 3rd party sensors such as magnetometers, and processes the data. The resulting
data can be read from the DMP’s registers, or can be buffered in a FIFO. The DMP has access to one of the
MPU’s external pins, which can be used for generating interrupts.
The purpose of the DMP is to offload both timing requirements and processing power from the hostprocessor. Typically, motion processing algorithms should be run at a high rate, often around 200Hz, in orderto provide accurate results with low latency. This is required even if the application updates at a much lower
rate; for example, a low power user interface may update as slowly as 5Hz, but the motion processing shouldstill run at 200Hz. The DMP can be used as a tool in order to minimize power, simplify timing, simplify thesoftware architecture, and save valuable MIPS on the host processor for use in the application.
7.10 Primary I2C and SPI Serial Communications Interfaces
The MPU-60X0 communicates to a system processor using either a SPI (MPU-6000 only) or an I2C serialinterface. The MPU-60X0 always acts as a slave when communicating to the system processor. The LSB ofthe of the I2C slave address is set by pin 9 (AD0).
The logic levels for communications between the MPU-60X0 and its master are as follows:MPU-6000: The logic level for communications with the master is set by the voltage on VDD
MPU-6050: The logic level for communications with the master is set by the voltage on VLOGICFor further information regarding the logic levels of the MPU-6050, please refer to Section 10.

25 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

7.11 Auxiliary I2C Serial Interface
The MPU-60X0 has an auxiliary I2C bus for communicating to an off-chip 3-Axis digital output magnetometeror other sensors. This bus has two operating modes:

I2C Master Mode: The MPU-60X0 acts as a master to any external sensors connected to theauxiliary I2C bus
Pass-Through Mode: The MPU-60X0 directly connects the primary and auxiliary I2C buses together,allowing the system processor to directly communicate with any external sensors.

Auxiliary I2C Bus Modes of Operation:


I2C Master Mode: Allows the MPU-60X0 to directly access the data registers of external digitalsensors, such as a magnetometer. In this mode, the MPU-60X0 directly obtains data from auxiliary
sensors, allowing the on-chip DMP to generate sensor fusion data without intervention from thesystem applications processor.
For example, In I2C Master mode, the MPU-60X0 can be configured to perform burst reads,
returning the following data from a magnetometer:

X magnetometer data (2 bytes)
Y magnetometer data (2 bytes)
Z magnetometer data (2 bytes)

The I2C Master can be configured to read up to 24 bytes from up to 4 auxiliary sensors. A fifth sensor
can be configured to work single byte read/write mode.
Pass-Through Mode: Allows an external system processor to act as master and directly
communicate to the external sensors connected to the auxiliary I2C bus pins (AUX_DA and
AUX_CL). In this mode, the auxiliary I2C bus control logic (3rd party sensor interface block) of the
MPU-60X0 is disabled, and the auxiliary I2C pins AUX_DA and AUX_CL (Pins 6 and 7) areconnected to the main I2C bus (Pins 23 and 24) through analog switches.
Pass-Through Mode is useful for configuring the external sensors, or for keeping the MPU-60X0 in a
low-power mode when only the external sensors are used.
In Pass-Through Mode the system processor can still access MPU-60X0 data through the I2C
interface.

Auxiliary I2C Bus IO Logic Levels
MPU-6000: The logic level of the auxiliary I2C bus is VDD
MPU-6050: The logic level of the auxiliary I2C bus can be programmed to be either VDD or VLOGICFor further information regarding the MPU-6050’s logic levels, please refer to Section 10.2.

26 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

7.12 Self-Test
Self-test allows for the testing of the mechanical and electrical portions of the accelerometers. The self-test
for each measurement axis can be activated by controlling the bits of the ACCEL_CONFIG control register.
When self-test is activated, the electronics cause the sensors to be actuated and produce an output signal.
The sensor reading is determined by the sum of the sensor output and the self-test response. The self-test
response for each accelerometer axis is defined in the specification table (Section 6) to be nominally 0.5g.
For further information regarding the Accel control register, please refer to the MPU-60X0 Register Map andRegister Descriptions document.

27 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

7.13 MPU-60X0 Solution for 9-axis Sensor Fusion Using I2C Interface
In the figure below, the system processor is an I2C master to the MPU-60X0. In addition, the MPU-60X0 is an
I2C master to the optional external compass sensor. The MPU-60X0 has limited capabilities as an I2C
Master, and depends on the system processor to manage the initial configuration of any auxiliary sensors.
The MPU-60X0 has an interface bypass multiplexer, which connects the system processor I2C bus pins 23
and 24 (SDA and SCL) directly to the auxiliary sensor I2C bus pins 6 and 7 (AUX_DA and AUX_CL).
Once the auxiliary sensors have been configured by the system processor, the interface bypass multiplexer
should be disabled so that the MPU-60X0 auxiliary I2C master can take control of the sensor I2C bus andgather data from the auxiliary sensors.
For further information regarding I2C master control, please refer to Section 10.

28 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

7.14 MPU-6000 Using SPI Interface
In the figure below, the system processor is an SPI master to the MPU-6000. Pins 8, 9, 23, and 24 are used
to support the /CS, SDO, SCLK, and SDI signals for SPI communications. Because these SPI pins areshared with the I2C slave pins (9, 23 and 24), the system processor cannot access the auxiliary I2C bus
through the interface bypass multiplexer, which connects the processor I2C interface pins to the sensor I2C
interface pins.
Since the MPU-6000 has limited capabilities as an I2C Master, and depends on the system processor to
manage the initial configuration of any auxiliary sensors, another method must be used for programming thesensors on the auxiliary sensor I2C bus pins 6 and 7 (AUX_DA and AUX_CL).
When using SPI communications between the MPU-6000 and the system processor, configuration ofdevices on the auxiliary I2C sensor bus can be achieved by using I2C Slaves 0-4 to perform read and write
transactions on any device and register on the auxiliary I2C bus. The I2C Slave 4 interface can be used toperform only single byte read and write transactions.
Once the external sensors have been configured, the MPU-6000 can perform single or multi-byte reads
using the sensor I2C bus. The read results from the Slave 0-3 controllers can be written to the FIFO buffer aswell as to the external sensor registers.
For further information regarding the control of the MPU-60X0’s auxiliary I2C interface, please refer to the
MPU-60X0 Register Map and Register Descriptions document.

29 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

7.15 Internal Clock Generation
The MPU-60X0 has a flexible clocking scheme, allowing a variety of internal or external clock sources to be
used for the internal synchronous circuitry. This synchronous circuitry includes the signal conditioning and
ADCs, the DMP, and various control circuits and registers. An on-chip PLL provides flexibility in theallowable inputs for generating this clock.
Allowable internal sources for generating the internal clock are:

An internal relaxation oscillator
Any of the X, Y, or Z gyros (MEMS oscillators with a variation of ±1% over temperature)

Allowable external clocking sources are:

32.768kHz square wave
19.2MHz square wave

Selection of the source for generating the internal synchronous clock depends on the availability of externalsources and the requirements for power consumption and clock accuracy. These requirements will most
likely vary by mode of operation. For example, in one mode, where the biggest concern is power
consumption, the user may wish to operate the Digital Motion Processor of the MPU-60X0 to processaccelerometer data, while keeping the gyros off. In this case, the internal relaxation oscillator is a good clock
choice. However, in another mode, where the gyros are active, selecting the gyros as the clock source
provides for a more accurate clock source.
Clock accuracy is important, since timing errors directly affect the distance and angle calculations performedby the Digital Motion Processor (and by extension, by any processor).
There are also start-up conditions to consider. When the MPU-60X0 first starts up, the device uses its
internal clock until programmed to operate from another source. This allows the user, for example, to wait
for the MEMS oscillators to stabilize before they are selected as the clock source.
7.16 Sensor Data Registers
The sensor data registers contain the latest gyro, accelerometer, auxiliary sensor, and temperature
measurement data. They are read-only registers, and are accessed via the serial interface. Data from theseregisters may be read anytime. However, the interrupt function may be used to determine when new data isavailable.
For a table of interrupt sources please refer to Section 8.
7.17 FIFOThe MPU-60X0 contains a 1024-byte FIFO register that is accessible via the Serial Interface. The FIFO
configuration register determines which data is written into the FIFO. Possible choices include gyro data,
accelerometer data, temperature readings, auxiliary sensor readings, and FSYNC input. A FIFO counter
keeps track of how many bytes of valid data are contained in the FIFO. The FIFO register supports burst
reads. The interrupt function may be used to determine when new data is available.
For further information regarding the FIFO, please refer to the MPU-60X0 Register Map and Register
Descriptions document.

30 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

7.18 Interrupts
Interrupt functionality is configured via the Interrupt Configuration register. Items that are configurable include
the INT pin configuration, the interrupt latching and clearing method, and triggers for the interrupt. Items that
can trigger an interrupt are (1) Clock generator locked to new reference oscillator (used when switching clock
sources); (2) new data is available to be read (from the FIFO and Data registers); (3) accelerometer event
interrupts; and (4) the MPU-60X0 did not receive an acknowledge from an auxiliary sensor on the secondary
I2C bus. The interrupt status can be read from the Interrupt Status register.
For further information regarding interrupts, please refer to the MPU-60X0 Register Map and Register
Descriptions document.
For information regarding the MPU-60X0’s accelerometer event interrupts, please refer to Section 8.
7.19 Digital-Output Temperature Sensor
An on-chip temperature sensor and ADC are used to measure the MPU-60X0 die temperature.
readings from the ADC can be read from the FIFO or the Sensor Data registers.

The

7.20 Bias and LDO
The bias and LDO section generates the internal supply and the reference voltages and currents required by
the MPU-60X0. Its two inputs are an unregulated VDD of 2.1V to 3.6V and a VLOGIC logic reference supply
voltage of 1.71V to VDD (MPU-6050 only). The LDO output is bypassed by a capacitor at REGOUT. For
further details on the capacitor, please refer to the Bill of Materials for External Components (Section 7.3).
7.21 Charge Pump
An on-board charge pump generates the high voltage required for the MEMS oscillators. Its output is
bypassed by a capacitor at CPOUT. For further details on the capacitor, please refer to the Bill of Materials
for External Components (Section 7.3).

31 of 57

MPU-6000/MPU-6050 Product Specification

8

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

Programmable Interrupts

The MPU-60X0 has a programmable interrupt system which can generate an interrupt signal on the INT pin.
Status flags indicate the source of an interrupt. Interrupt sources may be enabled and disabled individually.
Table of Interrupt Sources
Interrupt Name

ModuleFree Fall Detection

Free Fall

Motion Detection

MotionZero Motion Detection

Zero Motion

FIFO Overflow

FIFO

Data ReadySensor Registers

2

I C Master errors: Lost Arbitration, NACKs

I C Master2

I C Master2
2

I C Slave 4

For information regarding the interrupt enable/disable registers and flag registers, please refer to the MPU6000/MPU-6050 Register Map and Register Descriptions document. Some interrupt sources are explained
below.

32 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

8.1 Free Fall, Motion, and Zero Motion Signal Paths
The diagram below shows the signal path for the gyroscope and accelerometer sensors. Note that each
digital low pass filter (DLPF) is configured identically, as is each sample rate divider and digital high passfilter (DHPF).

33 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

8.2 Free Fall Interrupt
Free fall is detected by checking if the accelerometer measurements from all 3 axes have an absolute value
below a user-programmable threshold (acceleration threshold). For each sample where this condition is true
(a qualifying sample), a counter is incremented. For each sample where this condition is false (a nonqualifying sample), the counter is decremented. Once the counter reaches a user-programmable threshold(the counter threshold), the Free Fall interrupt is triggered and a flag is set. The flag is cleared once thecounter has decremented to zero. The counter does not increment above the counter threshold or decrement
below zero.
The user is given several configuration parameters to fine tune Free Fall detection. Both, the accelerationthreshold and counter threshold are user configurable. The FF_THR register allows the user to set a
threshold in 1 mg increments. The FF_DUR register allows the user to set duration in 1 ms increments.
The decrement rate for non-qualifying samples is also configurable. The MOT_DETECT_CTRL register
allows the user to specify whether a non-qualifying sample makes the counter reset to zero, or decrement insteps of 1, 2, or 4.

The figure above shows a simplified example with just one axis. An example acceleration input signal(simplified to only show one axis), qualifying sample counter, and Free Fall flag are shown.
8.3 Motion Interrupt
The MPU-60X0 provides Motion detection capability with similar functionality to Free Fall detection.
Accelerometer measurements are passed through a configurable digital high pass filter (DHPF) in order toeliminate bias due to gravity. A qualifying motion sample is one where the high passed sample from any axis
has an absolute value exceeding a user-programmable threshold. A counter increments for each qualifying
sample, and decrements for each non-qualifying sample. Once the counter reaches a user-programmablecounter threshold, a motion interrupt is triggered. The axis and polarity which caused the interrupt to be
triggered is flagged in the MOT_DETECT_STATUS register.
Like Free Fall detection, Motion detection has a configurable acceleration threshold MOT_THR specified in 1
mg increments. The counter threshold MOT_DUR is specified in 1 ms increments. The decrement rate has
the same options as Free Fall detection, and is specified in the MOT_DETECT_CTRL register.

34 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

8.4 Zero Motion Interrupt
The Zero Motion detection capability uses the digital high pass filter (DHPF) and a similar threshold scheme
to that of Free Fall detection. Each axis of the high passed accelerometer measurement must have an
absolute value less than a threshold specified in the ZRMOT_THR register, which can be increased in 1 mg
increments. Each time a motion sample meets this condition, a counter increments. When this counterreaches a threshold specified in ZRMOT_DUR, an interrupt is generated.
Unlike Free Fall or Motion detection, Zero Motion detection triggers an interrupt both when Zero Motion is
first detected and when Zero Motion is no longer detected. While Free Fall and Motion are indicated with aflag which clears after being read, reading the state of the Zero Motion detected from the
MOT_DETECT_STATUS register does not clear its status.

35 of 57

MPU-6000/MPU-6050 Product Specification

9

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

Digital Interface

9.1 I2C and SPI (MPU-6000 only) Serial Interfaces
The internal registers and memory of the MPU-6000/MPU-6050 can be accessed using either I2C at 400 kHz
or SPI at 1MHz (MPU-6000 only). SPI operates in four-wire mode.
Serial Interface
Pin Number

MPU-6000

8

Y

8
9

Y
Y
Y

23
24
24

Pin Name
/CS

Y

9
23

MPU-6050

Y

VLOGIC

Digital I/O supply voltage. VLOGIC must be ≤ VDD at all times.
I C Slave Address LSB (AD0); SPI serial data output (SDO)AD0
SCL
SDA / SDIY

SPI chip select (0=SPI enable)

AD0 / SDO
SCL / SCLKYPin Description

SDA

2
2

I C Slave Address LSB
2

I C serial clock (SCL); SPI serial clock (SCLK)2

I C serial clock2

I C serial data (SDA); SPI serial data input (SDI)2

I C serial data

Note:
To prevent switching into I2C mode when using SPI (MPU-6000), the I2C interface should be disabled by
setting the I2C_IF_DIS configuration bit. Setting this bit should be performed immediately after waiting for thetime specified by the “Start-Up Time for Register Read/Write” in Section 6.3.
For further information regarding the I2C_IF_DIS bit, please refer to the MPU-60X0 Register Map andRegister Descriptions document.
9.2 I2C Interface
I2C is a two-wire interface comprised of the signals serial data (SDA) and serial clock (SCL). In general, thelines are open-drain and bi-directional. In a generalized I2C interface implementation, attached devices canbe a master or a slave. The master device puts the slave address on the bus, and the slave device with thematching address acknowledges the master.
The MPU-60X0 always operates as a slave device when communicating to the system processor, which thus
acts as the master. SDA and SCL lines typically need pull-up resistors to VDD. The maximum bus speed is
400 kHz.
The slave address of the MPU-60X0 is b110100X which is 7 bits long. The LSB bit of the 7 bit address isdetermined by the logic level on pin AD0. This allows two MPU-60X0s to be connected to the same I2C bus.
When used in this configuration, the address of the one of the devices should be b1101000 (pin AD0 is logiclow) and the address of the other should be b1101001 (pin AD0 is logic high).
9.3 I2C Communications Protocol
START (S) and STOP (P) Conditions
Communication on the I2C bus starts when the master puts the START condition (S) on the bus, which isdefined as a HIGH-to-LOW transition of the SDA line while SCL line is HIGH (see figure below). The bus isconsidered to be busy until the master puts a STOP condition (P) on the bus, which is defined as a LOW to
HIGH transition on the SDA line while SCL is HIGH (see figure below).

36 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

Additionally, the bus remains busy if a repeated START (Sr) is generated instead of a STOP condition.

START and STOP Conditions

Data Format / Acknowledge
I2C data bytes are defined to be 8-bits long. There is no restriction to the number of bytes transmitted per
data transfer. Each byte transferred must be followed by an acknowledge (ACK) signal. The clock for the
acknowledge signal is generated by the master, while the receiver generates the actual acknowledge signal
by pulling down SDA and holding it low during the HIGH portion of the acknowledge clock pulse.
If a slave is busy and cannot transmit or receive another byte of data until some other task has been
performed, it can hold SCL LOW, thus forcing the master into a wait state. Normal data transfer resumes
when the slave is ready, and releases the clock line (refer to the following figure).

Acknowledge on the I2C Bus

37 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

Communications
After beginning communications with the START condition (S), the master sends a 7-bit slave address
followed by an 8th bit, the read/write bit. The read/write bit indicates whether the master is receiving data fromor is writing to the slave device. Then, the master releases the SDA line and waits for the acknowledge
signal (ACK) from the slave device. Each byte transferred must be followed by an acknowledge bit. To
acknowledge, the slave device pulls the SDA line LOW and keeps it LOW for the high period of the SCL line.
Data transmission is always terminated by the master with a STOP condition (P), thus freeing thecommunications line. However, the master can generate a repeated START condition (Sr), and address
another slave without first generating a STOP condition (P). A LOW to HIGH transition on the SDA line while
SCL is HIGH defines the stop condition. All SDA changes should take place when SCL is low, with the
exception of start and stop conditions.

Complete I2C Data Transfer
To write the internal MPU-60X0 registers, the master transmits the start condition (S), followed by the I2C
address and the write bit (0). At the 9th clock cycle (when the clock is high), the MPU-60X0 acknowledges thetransfer. Then the master puts the register address (RA) on the bus. After the MPU-60X0 acknowledges thereception of the register address, the master puts the register data onto the bus. This is followed by the ACK
signal, and data transfer may be concluded by the stop condition (P). To write multiple bytes after the last
ACK signal, the master can continue outputting data rather than transmitting a stop signal. In this case, theMPU-60X0 automatically increments the register address and loads the data to the appropriate register. The
following figures show single and two-byte write sequences.

Single-Byte Write Sequence
Master

S

AD+W

Slave

RA
ACK

DATA
ACK

P
ACK

Burst Write Sequence
Master
Slave

S

AD+W

RA
ACK

DATA
ACK

DATA
ACK

38 of 57P
ACK

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

To read the internal MPU-60X0 registers, the master sends a start condition, followed by the I2C address anda write bit, and then the register address that is going to be read. Upon receiving the ACK signal from the
MPU-60X0, the master transmits a start signal followed by the slave address and read bit. As a result, theMPU-60X0 sends an ACK signal and the data. The communication ends with a not acknowledge (NACK)
signal and a stop bit from master. The NACK condition is defined such that the SDA line remains high at the
9th clock cycle. The following figures show single and two-byte read sequences.

Single-Byte Read Sequence
Master

S

AD+W

Slave

RA
ACK

S

AD+R

ACK

NACK
ACK

P

DATA

Burst Read Sequence
Master
Slave

S

AD+W

RA
ACK

S
ACK

AD+R

ACK
ACK

DATA

9.4 I2C Terms
Signal Description
S
Start Condition: SDA goes from high to low while SCL is highAD
Slave I2C addressW
Write bit (0)R
Read bit (1)ACK
Acknowledge: SDA line is low while the SCL line is high at the
9th clock cycle
NACK Not-Acknowledge: SDA line stays high at the 9th clock cycle
RA
MPU-60X0 internal register address
DATA Transmit or received dataP
Stop condition: SDA going from low to high while SCL is high39 of 57

NACK
DATA

P

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

9.5 SPI Interface (MPU-6000 only)
SPI is a 4-wire synchronous serial interface that uses two control lines and two data lines. The MPU-6000
always operates as a Slave device during standard Master-Slave SPI operation.
With respect to the Master, the Serial Clock output (SCLK), the Serial Data Output (SDO) and the Serial
Data Input (SDI) are shared among the Slave devices. Each SPI slave device requires its own Chip Select(/CS) line from the master.
/CS goes low (active) at the start of transmission and goes back high (inactive) at the end. Only one /CS line
is active at a time, ensuring that only one slave is selected at any given time. The /CS lines of the nonselected slave devices are held high, causing their SDO lines to remain in a high-impedance (high-z) state
so that they do not interfere with any active devices.
SPI Operational Features
1.
2.
3.
4.
5.

Data is delivered MSB first and LSB last
Data is latched on the rising edge of SCLK
Data should be transitioned on the falling edge of SCLK
The maximum frequency of SCLK is 1MHz
SPI read and write operations are completed in 16 or more clock cycles (two or more bytes). The
first byte contains the SPI Address, and the following byte(s) contain(s) the SPI data. The first
bit of the first byte contains the Read/Write bit and indicates the Read (1) or Write (0) operation.
The following 7 bits contain the Register Address. In cases of multiple-byte Read/Writes, data is
two or more bytes:
SPI Address format
MSB
R/W A6 A5 A4

A3

A2

A1

LSB
A0

SPI Data format
MSB
D7
D6 D5

D3

D2

D1

LSB
D0

D4

6. Supports Single or Burst Read/Writes.

40 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

10 Serial Interface Considerations (MPU-6050)
10.1 MPU-6050 Supported Interfaces
The MPU-6050 supports I2C communications on both its primary (microprocessor) serial interface and its
auxiliary interface.
10.2 Logic Levels
The MPU-6050’s I/O logic levels are set to be either VDD or VLOGIC, as shown in the table below.
I/O Logic Levels vs. AUX_VDDIO
AUX_VDDIOMICROPROCESSOR LOGIC LEVELSAUXILLARY LOGIC LEVELS(Pins: SDA, SCL, AD0, CLKIN, INT)

(Pins: AUX_DA, AUX_CL)

0

VLOGICVLOGIC1

VLOGIC

VDD

Note: The power-on-reset value for AUX_VDDIO is 0.
VLOGIC may be set to be equal to VDD or to another voltage. However, VLOGIC must be ≤ VDD at all
times. When AUX_VDDIO is set to 0 (its power-on-reset value), VLOGIC is the power supply voltage forboth the microprocessor system bus and the auxiliary I2C bus, as shown in the figure of Section 10.3. When
AUX_VDDIO is set to 1, VLOGIC is the power supply voltage for the microprocessor system bus and VDD is
the supply for the auxiliary I2C bus, as shown in the figure of Section 10.4.

41 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

10.3 Logic Levels Diagram for AUX_VDDIO = 0
The figure below depicts a sample circuit with a third party magnetometer attached to the auxiliary I2C bus. It
shows logic levels and voltage connections for AUX_VDDIO = 0. Note: Actual configuration will depend on
the auxiliary sensors used.

I/O Levels and Connections for AUX_VDDIO = 0
Notes:
1. AUX_VDDIO determines the IO voltage levels of AUX_DA and AUX_CL(0 = set output levels relative to VLOGIC)
2. CLKOUT is referenced to VDD.
3. All other MPU-6050 logic IOs are referenced to VLOGIC.

42 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

10.4 Logic Levels Diagram for AUX_VDDIO = 1
The figure below depicts a sample circuit with a 3rd party magnetometer attached to the auxiliary I2C bus. It
shows logic levels and voltage connections for AUX_VDDIO = 1. This configuration is useful when theauxiliary sensor has only one supply for logic and power. Note: Actual configuration will depend on theauxiliary sensors used.

I/O Levels and Connections for Two Example Power Configurations (AUX_VDDIO = 1)
Notes:
1. AUX_VDDIO determines the IO voltage levels of AUX_DA and AUX_CL. AUX_VDDIO = 1 sets
output levels relative to VDD.
2. 3rd-party auxiliary device logic levels are referenced to VDD. Setting INT1 and INT2 to open drain
configuration provides voltage compatibility when VDD ≠ VLOGIC. When VDD = VLOGIC, INT1 and
INT2 may be set to push-pull outputs, and external pull-up resistors are not needed.
3. CLKOUT is referenced to VDD.
4. All other MPU-6050 logic IOs are referenced to VLOGIC.

43 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

11 AssemblyThis section provides general guidelines for assembling InvenSense Micro Electro-Mechanical Systems(MEMS) gyros packaged in Quad Flat No leads package (QFN) surface mount integrated circuits.
11.1 Orientation of Axes
The diagram below shows the orientation of the axes of sensitivity and the polarity of rotation. Note the pin 1
identifier (•) in the figure.

44 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

11.2 Package Dimensions
24 Lead QFN (4x4x0.9) mm NiPdAu Lead-frame finish
24
1

L

c

19
18
PIN 1 IDENTIFIER IS A LASERMARKED FEATURE ON TOP

CO.3
f
E

E2
e
b

13

6
7

D

L1
A1

12

D2

A

s

On 4 corners lead dimensionss

SYMBOLS
A
A1
b
c
D
D2
E
E2
e
f (e‐b)K
L
L1
s

DIMENSIONS IN MILLIMETERS
MIN
NOM
MAX
0.85
0.90
0.95
0.00
0.02
0.05
0.18
0.25
0.30
‐‐‐
0.20 REF
‐‐‐
3.90
4.00
4.10
2.65
2.70
2.75
3.90
4.00
4.10
2.55
2.60
2.65
‐‐‐
0.50
‐‐‐
‐‐‐
0.25
‐‐‐
0.25
0.30
0.35
0.30
0.35
0.40
0.35
0.40
0.45
0.05
‐‐‐
0.15

45 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

11.3 PCB Design Guidelines
The Pad Diagram using a JEDEC type extension with solder rising on the outer edge is shown below. The
Pad Dimensions Table shows pad sizing (mean dimensions) recommended for the MPU-60X0 product.

JEDEC type extension with solder rising on outer edge
D3
D
D2

PIN 1
IDENTIFIER

19

24
1

e

b

18

E2 E E3

c

6

13
7

L3 L1

12

L2
Tout
L

Tout

Tin
PCB Layout Diagram

SYMBOLS
e
b
L
L1
D
E
D2
E2
D3
E3
c
Tout
Tin
L2
L3

DIMENSIONS IN MILLIMETERS
Nominal Package I/O Pad Dimensions
Pad Pitch
Pad Width
Pad Length
Pad Length
Package Width
Package Length
Exposed Pad Width
Exposed Pad Length
I/O Land Design Dimensions (Guidelines )I/O Pad Extent Width
I/O Pad Extent Length
Land Width
Outward Extension
Inward Extension
Land Length
Land Length

NOM
0.50
0.25
0.35
0.40
4.00
4.00
2.70
2.60
4.80
4.80
0.35
0.40
0.05
0.80
0.85

PCB Dimensions Table (for PCB Lay-out Diagram)46 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

11.4 Assembly Precautions
11.4.1 Gyroscope Surface Mount Guidelines
InvenSense MEMS Gyros sense rate of rotation. In addition, gyroscopes sense mechanical stress comingfrom the printed circuit board (PCB). This PCB stress can be minimized by adhering to certain design rules:
When using MEMS gyroscope components in plastic packages, PCB mounting and assembly can cause
package stress. This package stress in turn can affect the output offset and its value over a wide range oftemperatures. This stress is caused by the mismatch between the Coefficient of Linear Thermal Expansion(CTE) of the package material and the PCB. Care must be taken to avoid package stress due to mounting.
Traces connected to pads should be as symmetric as possible. Maximizing symmetry and balance for pad
connection will help component self alignment and will lead to better control of solder paste reduction after
reflow.
Any material used in the surface mount assembly process of the MEMS gyroscope should be free ofrestricted RoHS elements or compounds. Pb-free solders should be used for assembly.
11.4.2 Exposed Die Pad Precautions
The MPU-60X0 has very low active and standby current consumption. The exposed die pad is not requiredfor heat sinking, and should not be soldered to the PCB. Failure to adhere to this rule can induce
performance changes due to package thermo-mechanical stress. There is no electrical connection between
the pad and the CMOS.
11.4.3 Trace Routing
Routing traces or vias under the gyro package such that they run under the exposed die pad is prohibited.
Routed active signals may harmonically couple with the gyro MEMS devices, compromising gyro response.
These devices are designed with the drive frequencies as follows: X = 33±3Khz, Y = 30±3Khz, and
Z=27±3Khz. To avoid harmonic coupling don’t route active signals in non-shielded signal planes directly
below, or above the gyro package. Note: For best performance, design a ground plane under the e-pad to
reduce PCB signal noise from the board on which the gyro device is mounted. If the gyro device is stacked
under an adjacent PCB board, design a ground plane directly above the gyro device to shield active signals
from the adjacent PCB board.
11.4.4 Component Placement
Do not place large insertion components such as keyboard or similar buttons, connectors, or shielding boxes
at a distance of less than 6 mm from the MEMS gyro. Maintain generally accepted industry design practices
for component placement near the MPU-60X0 to prevent noise coupling and thermo-mechanical stress.
11.4.5 PCB Mounting and Cross-Axis Sensitivity
Orientation errors of the gyroscope and accelerometer mounted to the printed circuit board can cause crossaxis sensitivity in which one gyro or accel responds to rotation or acceleration about another axis,
respectively. For example, the X-axis gyroscope may respond to rotation about the Y or Z axes. The
orientation mounting errors are illustrated in the figure below.

47 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

The table below shows the cross-axis sensitivity as a percentage of the gyroscope or accelerometer’ssensitivity for a given orientation error, respectively.
Cross-Axis Sensitivity vs. Orientation Error
Orientation Error
Cross-Axis Sensitivity(θ or Φ)(sinθ or sinΦ)
0º
0%
0.5º
0.87%
1º
1.75%
The specifications for cross-axis sensitivity in Section 6.1 and Section 6.2 include the effect of the dieorientation error with respect to the package.
11.4.6 MEMS Handling Instructions
MEMS (Micro Electro-Mechanical Systems) are a time-proven, robust technology used in hundreds ofmillions of consumer, automotive and industrial products. MEMS devices consist of microscopic moving
mechanical structures. They differ from conventional IC products, even though they can be found in similar
packages. Therefore, MEMS devices require different handling precautions than conventional ICs prior tomounting onto printed circuit boards (PCBs).
The MPU-60X0 has been qualified to a shock tolerance of 10,000g. InvenSense packages its gyroscopes as
it deems proper for protection against normal handling and shipping. It recommends the following handlingprecautions to prevent potential damage.


Do not drop individually packaged gyroscopes, or trays of gyroscopes onto hard surfaces. Components
placed in trays could be subject to g-forces in excess of 10,000g if dropped.

Printed circuit boards that incorporate mounted gyroscopes should not be separated by manuallysnapping apart. This could also create g-forces in excess of 10,000g.

11.4.7 ESD Considerations
Establish and use ESD-safe handling precautions when unpacking and handling ESD-sensitive devices.
Store ESD sensitive devices in ESD safe containers until ready for use. The Tape-and-Reel moisturesealed bag is an ESD approved barrier. The best practice is to keep the units in the original moisturesealed bags until ready for assembly.

48 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

Restrict all device handling to ESD protected work areas that measure less than 200V static charge. Ensurethat all workstations and personnel are properly grounded to prevent ESD.
11.4.8 Reflow Specification
Qualification Reflow: The MPU-60X0 was qualified in accordance with IPC/JEDEC J-STD-020D.01. This
standard classifies proper packaging, storage and handling in order to avoid subsequent thermal andmechanical damage during the solder reflow attachment phase of assembly. The classification specifies asequence consisting of a bake cycle, a moisture soak cycle in a temperature humidity oven, followed bythree solder reflow cycles and functional testing for qualification. All temperatures refer to the topside of the
QFN package, as measured on the package body surface. The peak solder reflow classification temperature
requirement is (260 +5/-0°C) for lead-free soldering of components measuring less than 1.6 mm in thickness.
Production Reflow: Check the recommendations of your solder manufacturer. For optimum results,
production solder reflow processes should reduce exposure to high temperatures, and use lower ramp-up
and ramp-down rates than those used in the component qualification profile shown for reference below.
Production reflow should never exceed the maximum constraints listed in the table and shown in the figure
below that were used for the qualification profile, as these represent the maximum tolerable ratings for thedevice.

Approved IR/Convection Solder Reflow Curve

49 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

Temperature Set Points for IR / Convection Reflow Corresponding to Figure Above
Step

Setting

A
B
C
D
E
F
G

Troom
TSmin
TSmax
TLiquidus
TPmin [255°C, 260°C]
TPmax [ 260°C, 265°C]
TPmin [255°C, 260°C]

Temp (°C)
25
150
200
217
255
260
255

H
I

TLiquidus
Troom

217
25

CONSTRAINTSTime (sec)Rate (°C/sec)

60 < tBC < 120

tAF < 480
10< tEG < 30r(TLiquidus-TPmax) < 3r(TLiquidus-TPmax) < 3r(TLiquidus-TPmax) < 3r(TPmax-TLiquidus) < 4

60 < tDH < 120

Notes:
For users TPmax must not exceed the Classification temperature (260°C).
For suppliers TPmax must equal or exceed the classification temperature.

50 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

11.5 Storage Specifications
The storage specification of the MPU-60X0 conforms to IPC/JEDEC J-STD-020D.01 Moisture Sensitivity
Level (MSL) 3.
Calculated shelf-life in moisture-sealed bag

12 months -- Storage conditions: <40°C and <90% RH

After opening moisture-sealed bag

168 hours -- Storage conditions: ambient ≤30°C at 60%RH

11.6 Package Marking Specification

Package Marking Specification

51 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

11.7 Tape & Reel Specification

Tape Dimensions

Reel Outline Drawing
Reel Dimensions and Package Size
PACKAGEREEL (mm)

SIZE

L

V

W

Z

4x4

330

100

13.2

2.2

52 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

User Direction of
Feed

Package Orientation

Cover Tape
(Anti Static)
Carrier Tape

Label

Pin 1

(Anti Static)
Terminal Tape
Reel
Tape and Reel Specification

Reel Specifications
Quantity Per Reel

5,000

Reels per Box

1

Boxes Per Carton (max)3

Pcs/Carton (max)

15,00011.8 Label

Location of Label

53 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

11.9 Packaging

ESD Anti-static Label
Moisture-Sensitivity
Caution LabelTape & Reel
Barcode Label
Moisture Barrier Bag
With Labels

Reel in Box

Moisture-Sensitive Caution LabelBox with Tape & Reel Label

54 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

12 Reliability
12.1 Qualification Test Policy
InvenSense’s products complete a Qualification Test Plan before being released to production. The
Qualification Test Plan for the MPU-60X0 followed the JEDEC 47G.01 Standard, “Stress-Test-Driven
Qualification of Integrated Circuits,” with the individual tests described below.
12.2 Qualification Test Plan
Accelerated Life Tests
Lot
Quantity

Sample/ Lot

Acc /RejectCriteria

JEDEC JESD22-A108C, Dynamic,
3.63V biased, Tj>125°C[read-points 168, 500, 1000 hours]

3

77

(0/1)

JEDEC JESD22-A118
Condition A, 130°C, 85%RH, 33.3 psia.,
unbiased, [read-point 96 hours]

3

77

(0/1)

77

(0/1)

Lot
Quantity

Sample/ Lot

Acc /RejectCriteria

TEST

Method/Condition

High Temperature
Operating Life (HTOL/LFR)
Highly Accelerated Stress
Test, Unbiased(1) (HAST)
High Temperature Storage
Life (HTS)JEDEC JESD22-A103C, Cond. A, 125°C,
Non-Biased Bake
[read-points 168, 500, 1000 hours]

3

Device Component Level Tests
TEST

Method/Condition

ESD-HBMJEDEC JESD22-A114F, (2KV)

1

3

(0/1)

ESD-MMJEDEC JESD22-A115-A, (200V)

1

3

(0/1)

Latch UpJEDEC JESD78B Class II (2), 125°C;
Level A ±100mA

1

6

(0/1)

Mechanical ShockJEDEC JESD22-B104C,
Mil-Std-883H, method 2002.5,
Cond. E, 10,000g’s, 0.2ms,±X, Y, Z – 6 directions, 5 times/direction

3

5

(0/1)

Vibration

JEDEC JESD22-B103B, Variable Frequency(random), Cond. B, 5-500Hz,
X, Y, Z – 4 times/direction

3

5

(0/1)

Temperature Cycling (TC) (1)

JEDEC JESD22-A104D Condition N,[-40°C to +85°C], Soak Mode 2 [5’], 100 cycles

3

77

(0/1)

Lot
Quantity

Sample/ Lot

Acc /RejectCriteria

1

5

(0/1)

Board Level Tests
TEST

Board Mechanical Shock

Method/Condition
JEDEC JESD22-B104C,
Mil-Std-883H, method 2002.5,
Cond. E, 10000g’s, 0.2ms,±X, Y, Z – 6 directions, 5 times/direction(1) Tests are preceded by MSL3 Preconditioning in accordance with JEDEC JESD22-A113F

55 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

13 Environmental Compliance
The MPU-60X0 is RoHS and Green compliant and is in full environmental compliance as evidenced in report
HS-MPU-6000A, Materials Declaration Data Sheet.
Environmental Declaration Disclaimer:
InvenSense believes this environmental information to be correct but cannot guarantee accuracy or completeness. Conformity
documents for the above component constitutes are on file. InvenSense subcontracts manufacturing and the information contained
herein is based on data received from vendors and suppliers, which has not been validated by InvenSense.

56 of 57

MPU-6000/MPU-6050 Product Specification

Document Number: PS-MPU-6000A-00
Revision: 3.1
Release Date: 10/24/2011

This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense
for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject tochange without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order toimprove its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding
the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arisingfrom information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited
to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.

Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for
any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
InvenSense®, MotionCommand®, TouchAnywhere®, and AirSign® are registered trademarks of InvenSense, Inc. MPU™, MPU6000™, MPU-6050™, MPU-60X0™, Motion Processing Unit™ , MotionFusion™, MotionProcessing™, MotionApps™, Digital Motion
Processor™, Digital Motion Processing™, DMP™, BlurFree™, and InstantGesture™ are trademarks of InvenSense, Inc.

©2011 InvenSense, Inc. All rights reserved.

57 of 57