System Thermal Test Report
Model: CTE E600 MX
Version: 20231123A
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Table of Contents

A. Introduction
B. Test Configuration

C. Conclusion

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A. Introduction
1. Objective
2. Equipment
3. Procedure

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1. Objective

Our objective is to find out if the CTE E600 MX can efficiently extract the heat generated by the latest
components, so we built a system with an Intel i9-13900K and a ASUS ROG Strix GeForce RTX® 4090 OC andput it to the test. The passing criteria we set was to keep the internal temperature under 43°C while thesystem is running at full load, with fourteen installed fans and a AIO 420 installed.
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2. Equipment
The equipment we used in the thermal testing includes:
1. Temperature & Humidity Chamber
2. Data Acquisition Device
3. Thermocouple

The Temp. & Humidity Chamber ensures consistency in the testing environment, particularly temperatureand humidity. The temperature was set at 25°C and the humidity at 50% in the chamber.
The Data Acquisition Device helps us to directly collect the data through thermocouples, which is the mostimportant equipment for our testing. We set up the thermocouple inside the case at various points tomeasure the temperature.

We used AIDA64 Extreme and FurMark ROG Edition to push 100% load on the CPU and GPU and tested for
30 minutes.

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3. Procedure
Testing steps:

1. Ready the systems
2. Place the chassis into the Temp. & Humidity Chamber
3. Set the thermocouple at the specified places
4. Set up the Temp. & Humidity Chamber - temperature at 25 °C and the humidity at 50%
5. Turn on the Temp. & Humidity Chamber and start testing (for 30 minutes)
6. Check the data acquired from the Data Acquisition device
7. End testing6

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B. Test Configuration
1. Laboratory Equipment
2. Chassis Hardware List
3. Chassis Fan Allocation
4. Chassis Thermal Airflow
5. Chassis Measured Points
6. Thermal Stress Test
7. AIDA64 & FurMark Test
8. Graphics Performance Testing

9. Acoustic Test

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1. Laboratory Equipment

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Thermocouple

Sound Level Meter

Thermal Imaging Camera

Temperature Data Acquisition

Temperature & Humidity Chamber

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2. Chassis Hardware List
Component

Model

Chassis CTE E600 MX Snow
Motherboard ASUS ROG MAXIMUS Z790 APEXCPU Intel® Core™ i9-13900K Processor (TDP 253W)
GPU ASUS ROG Strix GeForce RTX® 4090 OC 24GB GDDR6X

RAM TOUGHRAM Z-ONE RGB DDR5 32G (16G x 2)
SSD Seagate SSD 120GPSU Toughpower GF3 1200W - TT Premium Edition
CPU Cooler TOUGHLIQUID Ultra 420 AIO Liquid Cooler

AIO: TOUGHFAN 140mm x 3 (1800rpm)
Chassis: CT 140mm x 9 (1500 rpm)
Fans
CT 120mm x 2 (1500 rpm)
(Front x 3 , Top x 2 , Rear x 3, Bottom x 3 )9Software

1.
2.
3.
4.

AIDA64 Extreme
FurMark ROG EditionCPU-Z
Core Temp

Full load

30 minutes

CameraTesto 885-2 Thermal Imaging Camera

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3. Chassis Fan Allocation

Fan11

Fan7

Fan12

Fan1

Fan8

Fan13

Fan2

Fan9

Fan14

Fan3

Fan610

Fan10

Fan5

Fan4

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4. Chassis Thermal Airflow
Cool Airflow Inlets

Hot Airflow Exhausts
TopTop

Rear

Front

SideRear

Front

SideRear

Front

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Bottom

Bottom

BottomSide

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5. Chassis Measured Points
MeasurePoint
8713934111651212

2

Description

Airflow

Thermocouple
Number1

Chassis Front External

Intake101

2Chassis Front Internal

Exhaust102

3Chassis Rear External

Intake103

4Chassis Rear Internal

Exhaust104

5Chassis Bottom External

Intake105

6Chassis Bottom Internal

Exhaust106

7Chassis Top Internal

Intake107

8Chassis Top External

Exhaust108

9Chassis Right Internal AIO Intake

109

10Chassis Right External AIO Exhaust

110

11GPU Left

Intake113

12GPU Right

Exhaust114

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AIO Top CoverNature115

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PSU Right

Intake116

15

PSU Rear

Exhaust118

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5. Chassis Measured PointsMeasure
Point

Description

Airflow

Thermocouple
Number1

Chassis Front External

Intake101

2Chassis Front Internal

Exhaust102

3Chassis Rear External

Intake103

4Chassis Rear Internal

Exhaust104

5Chassis Bottom External

Intake105

6Chassis Bottom Internal

Exhaust106

7Chassis Top Internal

Intake107

8Chassis Top External

Exhaust108

9Chassis Right Internal AIO Intake

109

10Chassis Right External AIO Exhaust

110

11GPU Left

Intake113

12GPU Right

Exhaust114

13

AIO Top CoverNature115

14

PSU Right

Intake116

15PSU Rear

Exhaust118

10141513

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6. Thermal Stress Test••••

14Setting up the chamber temperature and humidity
Temperature: 25°C
Humidity: 50%
Recording Data

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6. Thermal Stress Test

Temperature Data Recoding
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6. Thermal Stress Test
CPU- Intel Core i9-13900K
GPU-ASUS ROG-STRIX-RTX4090
Ambient Temperature: 25°C
Humidity: 50%
Loading with AIDA64 & FurMark

System Thermal Stress Test - CTE E600 MX-0.15
Chassis Front External
Chassis Bottom External
Chassis Rear External
Chassis Front Internal
Chassis Bottom Internal
Chassis Rear Internal
Chassis Top External
Chassis Top Internal

3.87
4.46

GPU Left
PSU Right

8.52
9.21
10.47

Chassis Right External AIO
Chassis Right Internal AIO
AIO Top Cover

15.78
16.75

GPU Right
PSU Rear-10.0025.00 24.85
24.90 25.13
25.39
24.66
25.95
25.10
26.31
25.00
26.59
24.90
26.75
24.90
26.86
25.00
29.74
25.87
30.21
25.75

0.23
0.73
0.85
1.31
1.69
1.85
1.86

0.00

10.00
ΔT

Load Temp.

35.06
35.50
36.82

26.54
26.29
26.35
27.44
28.91

20.00
Ambient Temp.

43.22
45.66
30.00

40.00

50.00

Temperature - Degree CLower is Better

We expected to see higher temperature at the exhaust points and relatively lower temperature at the intake positions. Thehighest temperature was found at the AIO exhaust, which is reasonable given the CPU was running at full load. Most of
the intake positions recorded a temperature lower than 43°C since they were drawing air from environment. Two critical
positions we were looking at are NO. 114 GPU Fan and NO. 115 AIO Cover, which were drawing internal air to cool two of
the most important components.
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7. AIDA64 & FurMark TestWe used AIDA64 Extreme (stress FPU) and FurMark ROG Edition (resolution: 3840 x 2160) to
push 100% load on the CPU and GPU for 30 minutes.

AIDA64 Extreme

FurMark
17IdleFull load

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7. AIDA64 & FurMark Test
We used AIDA64 Extreme (stress FPU) and FurMark ROG Edition (resolution: 3840 x 2160) to
push 100% load on the CPU and GPU for 30 minutes.

Idle

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Full load

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7. AIDA64 & FurMark Test
CPU & GPU Thermal Stress Test
CTE E600 MX49

CPU81

32

41

GPU

69
28010

CPU- Intel Core i9-13900K
GPU-ASUS ROG-STRIX-RTX4090
Ambient Temperature: 25°CHumidity: 50%
Loading with AIDA64 & FurMark

19203040ΔTLoad Temp.

50Idle Temp.

60708090Temperature - Degree CLower is Better

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8. Graphics Performance Testing

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9. Acoustic Sound Pressure Level Test
Test Environment：Thermaltake Taipei Office
Test Model: CTE E600 MX
Test Ambience: 24.2 ℃(Temperature) / 56% R.H.(Relative Humidity)
Microphone position: 50 cm / in front of PC system
Background Noise：35.7 dBA.

30°50CM

Microphone position
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Test Ambience
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9. Acoustic Sound Pressure Level Test
Fan Speed 500rpm – 36.5dBA

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Fan Speed 650rpm – 37.4dBA

Fan Speed 850rpm – 39.6dBA

Fan Speed 1500rpm – 57.4dBA

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9. Acoustic Sound Pressure Level Test
Acoustic Sound Pressure Level Test - CTE E600 MX
0.8

Fan Speed 500 rpm (Silent)

35.7
0.8

Background Noise

35.7
1.7

Fan Speed 650 rpm (Standard)

35.7
3.9

3DMARK Test - Fan 850 rpm

35.7
3.9

Fan Speed 850 rpm (Turbo)

35.7

37.4
39.6
39.6
57.4

35.7
22.1

Stress Test Full Load- Fan 1500 rpm

57.8

35.7
02336.521.7Fan Speed 1500 rpm (Performance)

CPU- Intel Core i9-13900K
GPU-ASUS ROG-STRIX-RTX4090
Ambient Temperature: 25°C
Humidity: 50%
Loading with AIDA64 & FurMark

36.5

1020Diff

Load dBA

30Idle dBA

40506070

Sound Pressure - dBA

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C. Conclusion

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Conclusion
Idle

Left View

Full Load

CPU 81℃

GPU 69℃

AIDA64 Extreme (stress FPU) and FurMark ROG Edition (resolution: 3840 x 2160) to push 100% load on the CPU and GPU
for 30 minutes.

-INTEL i9 13900K / CPU Temp. (Max)：81℃ (TDP 253W)-ASUS ROG Strix GeForce RTX® 4090 OC / GPU Temp. (Max)：69℃
Through the thermal image, we found that the internal heat was effectively directed to designatedexhaustion vents, keeping the system operating at a cooler temperature. This finding validates how
efficient CTE E600 MX is regarding cooling performance.
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Thank You