System Thermal Test Report
Model: The Tower 200
Version: 20230511
1

NO: RS202305110001

Table of Contents

A. Introduction
B. Test Configuration

C. Conclusion

2

NO: RS202305110001

A. Introduction
1. Objective
2. Equipment
3. Procedure

3

NO: RS202305110001

1. Objective

Our objective is to find out if The Tower 200 can efficiently extract the heat generated by the latest
components, so we built a system with an Intel i9-13900K and a ASUS ROG Strix GeForce RTX® 4090 OC andput it to the test. The passing criteria we set was to keep the internal temperature under 43°C while thesystem is running at full load, with five installed fans and a AIO 280 installed.
4NO: RS202305110001

2. Equipment
The equipment we used in the thermal testing includes:
1. Temperature & Humidity Chamber
2. Data Acquisition Device
3. Thermocouple

The Temp. & Humidity Chamber ensures consistency in the testing environment, particularly temperatureand humidity. The temperature was set at 25°C and the humidity at 50% in the chamber.
The Data Acquisition Device helps us to directly collect the data through thermocouples, which is the mostimportant equipment for our testing. We set up the thermocouple inside the case at various points tomeasure the temperature.

We used AIDA64 Extreme and FurMark ROG Edition to push 100% load on the CPU and GPU and tested for
30 minutes.

5NO: RS202305110001

3. Procedure
Testing steps:

1. Ready the systems
2. Place the chassis into the Temp. & Humidity Chamber
3. Set the thermocouple at the specified places
4. Set up the Temp. & Humidity Chamber - temperature at 25 °C and the humidity at 50%
5. Turn on the Temp. & Humidity Chamber and start testing (for 30 minutes)
6. Check the data acquired from the Data Acquisition device
7. End testing6

NO: RS202305110001

B. Test Configuration
1. Laboratory Equipment
2. Chassis Hardware List
3. Chassis Fan Allocation
4. Chassis Thermal Airflow
5. Chassis Measured Points
6. Thermal Stress Test
7. AIDA64 & FurMark Test
8. Graphics Performance Testing

9. Acoustic Test

7

NO: RS202305110001

1. Laboratory Equipment

8Thermocouple

Sound Level Meter

Thermal Imaging Camera

Temperature Data Acquisition

Temperature & Humidity Chamber

NO: RS202305110001

2. Chassis Hardware List
Component

ModelChassis The Tower 200

Motherboard ASUS ROG STRIX Z790-i
CPU Intel® Core™ i9-13900K Processor (TDP 253W)
GPU ASUS ROG Strix GeForce RTX® 4090 OC 24GB GDDR6X
RAM TOUGHRAM XG RGB DDR5 32G (16G x 2)

SSD Seagate SSD 120GPSU Toughpower PF3 1200W - TT Premium Edition
CPU Cooler TOUGHLIQUID Ultra 280 AIO Liquid Cooler
AIO:TOUGHFAN 140mm x 2 (2000rpm)
Fans Chassis: CT 140mm x 3 (1500 rpm)
(Top x 1 , Rear x 2 )9Software

1.
2.
3.
4.

AIDA64 Extreme
FurMark ROG Edition V0.8.14.0
CPU-Z Ver.2.015 x64
Core Temp V1.18

Full load

30 minutes

CameraTesto 885-2 Thermal Imaging Camera

NO: RS202305110001

3. Chassis Fan Allocation

Fan310Fan4

Fan1

Fan5

Fan2

NO: RS202305110001

4. Chassis Thermal Airflow
Cool Airflow Inlets (Active)

Hot Airflow Exhausts
TopRight
Rear

Right

11Rear

NO: RS202305110001

5. Chassis Measured Points
812Measure
Point

Description

Airflow

Thermocouple
Number1

Chassis Right External

Intake101

2Chassis Right Internal

Intake102

3Chassis Left External

Intake103

4GPU Right Fan

Intake104

5Chassis Rear Internal

Exhaust105

6Chassis Rear External

Exhaust106

7Chassis Top Internal

Exhaust108

8Chassis Top External

Exhaust110

9PSU Bottom

Intake111

10PSU Rear

Exhaust112

11AIO Top Cover-113

12VGA Rear Slot

Exhaust

114

7113

42
1

5

6

10

12

9

NO: RS202305110001

6. Thermal Stress Test••••

13Setting up the chamber temperature and humidity
Temperature: 25°C
Humidity: 50%
Recording Data

NO: RS202305110001

6. Thermal Stress Test

Temperature Data Recoding
14NO: RS202305110001

6. Thermal Stress Test
CPU- Intel Core i9-13900K
GPU-ASUS ROG-STRIX-RTX4090
Ambient Temperature: 25°C
Humidity: 50%
Loading with AIDA64 & FurMark

System Thermal Stress Test - The Tower 200
0.9Chassis Rear Internal
Chassis Bottom External

3.7

GPU Left Fan

4.4

28.1

13.7

Chassis Right Internal

13.9

Chassis Top Internal

14.4

AIO Top Cover

14.7
15.7

GPU Right Fan

10ΔT40.3

27.6

PSU Rear

539.1

27.5

12.7

Chassis Top External

36.8

26.9

11.6

Chassis Front Internal

33.5

25.8

9.9

Chassis Bottom Internal

30.4

267.7

029

25.3

Chassis Front External

2915
Load Temp.

27.941.6

27.5

41.4

27.5

41.9

27.6

42.3
43.1

27.4

2025

Ambient Temp.

3035404550

Temperature - Degree CLower is Better

We expected to see higher temperature at the exhaust points and relatively lower temperature at the intake positions. The
highest temperature was found at the AIO exhaust, which is reasonable given the CPU was running at full load. Most of
the intake positions recorded a temperature lower than 43°C since they were drawing air from environment. Two critical
positions we were looking at are NO. 104 GPU Fan and NO. 113 AIO Cover, which were drawing internal air to cool two of
the most important components.
15

NO: RS202305110001

7. AIDA64 & FurMark Test
We used AIDA64 Extreme (stress FPU) and FurMark ROG Edition (resolution: 3840 x 2160) to
push 100% load on the CPU and GPU for 30 minutes.

AIDA64 ExtremeFurMark
16IdleFull load

NO: RS202305110001

7. AIDA64 & FurMark Test
We used AIDA64 Extreme (stress FPU) and FurMark ROG Edition (resolution: 3840 x 2160) to
push 100% load on the CPU and GPU for 30 minutes.

Idle

17

Full load

NO: RS202305110001

7. AIDA64 & FurMark Test
CPU & GPU Thermal Stress Test - The Tower 200

19MB533452

CPU843241GPU78370
CPU- Intel Core i9-13900K
GPU-ASUS ROG-STRIX-RTX4090
Ambient Temperature: 25°C
Humidity: 50%
Loading with AIDA64 & FurMark

1810203040

ΔTLoad Temp.

50

Idle Temp.

60

70

8090

Temperature - Degree CLower is Better

NO: RS202305110001

8. Graphics Performance Testing

19NO: RS202305110001

9. Acoustic Sound Pressure Level Test
Test Environment：Thermaltake Taipei Office
Test Model: TOWER 200
Test Ambience: 21.5 ℃(Temperature) / 64% R.H.(Relative Humidity)
Microphone position: 50 cm / in front of PC system
Background Noise：35.9 dBA.

30°

50CM

Microphone position
20

Test Ambience
NO: RS202305110001

9. Acoustic Sound Pressure Level Test
Fan Speed 600rpm – 37.1dBA

21

Fan Speed 700rpm – 37.8dBA

Fan Speed 850rpm – 39.6dBA

Fan Speed 1500rpm – 54.8dBA

NO: RS202305110001

9. Acoustic Sound Pressure Level Test
Acoustic Sound Pressure Level Test - The Tower 200
0Background Noise35.91.2

Fan Speed 600 rpm (Silent)

37.11.9

Fan Speed 700 rpm (Standard)

37.82.5

3DMARK Test - Fan 800 rpm

38.4

3.7

Fan Speed 850 rpm (Turbo)

39.6

18.9

Fan Speed 1500 rpm (Performance)

19.4

Stress Test Full Load- Fan 1500 rpm
0CPU- Intel Core i9-13900K
GPU-ASUS ROG-STRIX-RTX4090
Ambient Temperature: 25°C
Humidity: 50%
Loading with AIDA64 & FurMark

2254.8

10Diff20

Load dBA

55.3
30Idle dBA

405060Temperature - Degree C
Lower is Better

NO: RS202305110001

C. Conclusion

23NO: RS202305110001

Conclusion
Idle

Front View

Full LoadGPU 78℃

CPU 84℃

AIDA64 Extreme (stress FPU) and FurMark ROG Edition (resolution: 3840 x 2160) to push 100% load on the CPU and GPU
for 30 minutes.

-INTEL i9 13900K / CPU Temp. (Max)：84℃ (TDP 253W)-ASUS ROG Strix GeForce RTX® 4090 OC / GPU Temp. (Max)：78℃

Through the thermal image, we found that the internal heat was effectively directed to designatedexhaustion vents, keeping the system operating at a cooler temperature. This finding validates how
efficient The Tower 200 is regarding cooling performance.
24

NO: RS202305110001

25