FY2012 Results Meeting
Fiscal year ended March 31, 2013

May 29, 2013

Ryosan Company, Limited

Code : 8140 / Stock listings: Tokyo Stock Exchange (First Section)
URL : http://www.ryosan.co.jp/eng/

Results for FY2012 and Forecasts for FY2013
Management Execution Report (FY2011 to FY2012)"Management Efforts" for FY2013[Appendix] Introduction of Technical Activities
NoticeBusiness forecasts and all statement related to the future contained in thispresentation are based on information currently possessed by the Company and on
certain assumptions which we judge to be rational. Actual business performance
may differ greatly depending on a variety of factors. The following is a list ofmajor factors:
・Economic conditions in key markets (Japan and the rest of Asia), rapid changes
in consumption trends and supply-demand balance for products
・Sharp fluctuations in the dollar-yen exchange rate

An Electronics Systems Coordinator・Substantial fluctuation in prices in capital markets

Results for FY2012 and Forecasts for FY2013
Management Execution Report (FY2011 to FY2012)"Management Efforts" for FY2013[Appendix] Introduction of Technical Activities

An Electronics Systems CoordinatorOverview of Consolidated Results
Unit: 100 millions of yen

FY2011

Net sales
Gross margin
SG & A expenses
Operating income
Ordinary income
Net income
Earnings per share

FY2013 (forecasts)

Of T otal

Of T otal

%

%

2,178
167
132
35
44
18

2,065
166
129
36
41
28

7.7
6.1
1.6
2.1
0.9

¥55.90% Chg. YoY

Net sales

Of T otal

2,150
176
130
46
48
30

(5.2)%

8.1(0.6)%

6.3(2.0)%

1.8

+4.6%

2.0

(8.1)%

1.4+48.2%¥84.40

%

+4.1%

8.2

+5.6%

6.0

+0.1%

2.1

+25.2%

2.2+16.7%

1.4+6.6%(100 millions of yen)

Operating income

60% Chg. YoY¥92.41(100 millions of yen)(100 millions of yen)

2,500

FY2012

Net income

40

2,000

30
40

1,500
20
1,000

2,178

2,065

2,150
20

46
35

36

10

500
0

0
FY2011FY2012FY2013(Forecasts)

28

30

FY2012FY2013(Forecasts)

180FY2011An Electronics Systems Coordinator

FY2012-4-FY2013(Forecasts)

FY2011

Change in Net Sales by Business Segment

3,500

Ryosan ProductsElectronic Equipment

3,000Electronic Components(100 millions of yen)

2,500

Semiconductors

2,178

2,065

54

2,000

1,500

48

246

195

2,150
50
190
530

554

510

1,323

1,311

1,380

FY2011FY2012FY2013(Forecasts)

1,000

500

0

An Electronics Systems Coordinator-5-Change in Net Sales for Domestic/Overseas

3,500

Overseas (Other than Japanese companies)
Overseas (Shifting to Japanese companies)

3,000

Domestic(100 millions of yen)

2,500

2,178
2,000

176

2,065
193

2,150
230

510
559

570

1,312

1,350

FY2012FY2013(Forecasts)

1,500

1,000
1,492

500

0
FY2011An Electronics Systems Coordinator-6-

Main Suppliers for FY2012

COSEL
1.9%
NLT
Technologies
1.9%

Other
suppliers
17.6%

NEC TOKIN
2.0%
Elpida Memory
2.3%

Renesas Electronics
51.6%

Japan Aviation
Electronics
Industry
2.6%[Percentage of net sales
by business segment]

NXP
Semiconductors
2.9%
ORTUS
Technologies
3.3%Electronic
Equipment
(10%)

NEC
6.5%
ALPS
Electric
7.4%

Electronic
Components Semicon
ductors
(25%)
(63%)

* Honorifics omitted* Percentage (%) is based on actual sales of products purchased from suppliers for FY2012.
An Electronics Systems Coordinator

Ryosanproducts(2%)-7-

Main Clients for FY2012<<Top 5 companies by net sales foreach business segment>><<Top 40 companies by net sales>>Clients

Top 1-10

Top 11-20

Top 21-30

Top 31-40

CASIO COMPUTERALPINEBLUEWAY (C)ADVANTESTDENSOALPS Electric

Clarion

ARIMA (T)HITACHIBrother Industries

Fuji Xerox

Fujitsu

Mitsubishi Electric

Calsonic Kansei

Hyundai Motor (K)Furuno Electric

NEC

Canon

JABIL (U)NLT Technologies

NIKON

Fuji Film

JVC KENWOOD

Sharp

OMRON

Mamiya-OP

KONICA MINOLTA

Stanley Electric

Panasonic

NINTENDOTOSHIBA TECTAISHODO SEIKOPIONEERSAMSUNG (K)YAMAHA

TOPRO (C)

Wacom

Sumitomo Wiring
Systems

Yazaki Corporation

Yokowo(Top 10)Percentage
sales of allclients

51%(Top 20)

68%(Top 30)76%-8-

Electronic
Equipment

Mitsubishi Electric
NEC
NIKON
PIONEER
Wacom

DENSO
Fuji Xerox
NEC
NIKON
Panasonic(Top 5)49%(Top 5)48%

Electronic
Components

RyosanProducts

Calsonic Kansei
Canon
Mitsubishi Electric
NEC
NINTENDO

DENSO
FANUC
HITACHI
Mitsubishi Electric
Panasonic(Top 5)28%(Top 5)42%(Top 40)80%(Alphabetical order)* Honorifics omitted* Ranking and percentage (%) are based on actual sales for FY2012.
* (K), (T), (C) and (U) represent clients in Korea, Taiwan, China and US, respectively.

An Electronics Systems Coordinator

Semiconductors(Alphabetical order)Results for FY2012 and Forecasts for FY2013
Management Execution Report (FY2011 to FY2012)"Management Efforts" for FY2013[Appendix] Introduction of Technical Activities

An Electronics Systems Coordinator

Management Execution Report <8th Medium-Term Management Plan>

Growth strategy◇Strengthening approach to developing countries of quick growth(China and India)☞In India, start business with local STB manufacturers◇Strengthening dealing with globalizing Japanese customers☞In Europe (Germany), start business with Japanesemanufacturers (in-vehicle electrical component systems)◇ Strengthening exploitation in growing fields (car electronics,
social infrastructure, etc.)☞Continuing expansion of sales with a focus on Japanese clients

An Electronics Systems Coordinator-10-Management Execution Report <8th Medium-Term Management Plan>

Segment strategy<Technological strategy>◇Contribute to semiconductor sales and profit maximization
with our abilities in system technology and development asadded values☞Refer to Appendix<Semiconductors>☞As a new line card, start business with 4 overseas
semiconductor manufacturers☞Expand business with major Korean automotive
manufacturers(in FY2012, approx. 2 times the results of FY2010)
An Electronics Systems Coordinator-11-Management Execution Report <8th Medium-Term Management Plan>

Segment strategy<Electronic Components>☞As a new line card, start business with 2 electric component
manufacturers<Electronic Equipment>☞Conduct business talks for commissioned development ofsoftware/hardware for HEMS (Home Energy Management
System)Commissioned development decided for a portion ofsoftware/hardware<Ryosan Products>☞Introduce new products (fine pitch KBS) for the social
infrastructure market using in-house products (heat sinks)

An Electronics Systems Coordinator-12-Management Execution Report <8th Medium-Term Management Plan>

Infrastructure strategy☞Establish a base (branch office of Singapore Ryosan) in
India (Bangalore)☞Establish a local subsidiary (Ryosan Europe GmbH) in
Germany (Munich)☞June 2012: Select 1 outside director☞Implement full consolidation from FY2013 (implement
new accounting system)

An Electronics Systems Coordinator-13-

Management Execution Report <FY2012 Priority Theme>

Laying the foundation◇Improvement in the profit structure◇収益体質の改善
・Worsening profit structure due to restructuring of businessstructure by major suppliers and stagnation of the Japanese
・売上総利益率は順調に改善しているものの
electronics
industry
売上高の低迷により、営業利益率はわずかな改善に留まる・Although the gross profit margin is improving, it remains at alow level when compared to past levels
・売上総利益率も、過去の水準からすれば低水準
・The
past few years, net sales have stagnated at about 200,000
・売上高がこの数年２,０００億円程度に低迷、成長性に課題
million yen. There are issues with growth potential.
Gross profit margin

Operating income margin

9%

5.0%

9%

8.7%

8.8%

8%

Continue with FY2013 8%
Management Activities 7%
7%

7.7%

2.5%

2.8%

8.1%

3.0%
2.0%

1.6%
1.8%

6%

1.0%

FY2009An Electronics Systems Coordinator

4.0%

-14-

FY2010FY2011FY2012

Management Execution Report <FY2012 Priority Theme>

Laying the foundation◇Improvement in the financial structure◇財務体質の改善
・Inventories amount decreased, but
・棚卸資産回転月数はfailedto reach target for turnovermonths・Decrease in inventories is mainly due to・目標とした１.０ヶ月未満に
stagnating
net sales. Inventory control isinsufficient.

Continue with FY2013
Management Activities
An Electronics Systems Coordinator-15-

Inventories (amount) <100 millions of yen>

Inventories (turnover months) <XX months>

Results for FY2012 and Forecasts for FY2013
Management Execution Report (FY2011 to FY2012)"Management Efforts" for FY2013[Appendix] Introduction of Technical Activities

An Electronics Systems Coordinator

Management Efforts for FY2013[Recognition of current situations]
Changes in external environment◇Changes in the global economic and industrial structure◇Structural changes in the semiconductor industry
・New restructuring of semiconductor manufacturers
・Clear demonstration of the survival of the fittest in semiconductor distributors

The Company's circumstances◇Stagnating net sales◇Issues regarding the profit structure
・Stagnating profit rate (gross margin, operating income)An Electronics Systems Coordinator-17-

Management Efforts for FY2013[Our Basic Stance]
Seek sustainable growth and sound management[Specific Efforts]
Cultivation of businesses to serve as 2nd and 3rd pillars◇Further strengthening of overseas semiconductor device
business[Reference] Editing of 8th Medium-Term Management Plan

Further improvement of corporate structure◇Improvement in the profit structure and financial structure
An Electronics Systems Coordinator-18-

Management Efforts for FY2013

Cultivation of businesses to serve as 2nd and 3rd pillars◇Further strengthening of overseas semiconductor
device business・Implement projects for developing new resources
Objective: Discover new resources for sustainable growth of our company
Goal: ・Quick contribution to performance through new resources which can be
deployed throughout entire group
・Determine whether the new resources can be used to expand our company’sbusiness・Further strengthening of overseas semiconductor device business
Objective: Re-challenge the overseas semiconductor device business as a growthstrategy
Goal: Seek net sales of 20 to 30 billion yen through subsidiaries (Saxis, Gyronics)
which mainly conduct business in overseas semiconductors
An Electronics Systems Coordinator-19-

<Reference>Management Efforts for FY2013

Editing of 8th Medium-Term Management Plan
Addition

Growthstrategies

1. Further strengthening ofoverseas semiconductor device
business

2. Strengthening approach todeveloping countries of quick
growth (China and India)

3. Strengthening dealing with
globalizing Japanesecustomers

4. Strengthening exploitation in
growing fields (car electronics,
social infrastructure, etc.)

An Electronics Systems Coordinator-20-Management Efforts for FY2013

Further improvement of corporate structure◇Improvement in the profit structure
・Continuously challenge for improvement in the profit rate
➥Secure an appropriate gross profit margin byimplementing sales activities with added value such astechnical support◇Improvement in the financial structure
・Proper adjustment of turnover months for inventories:
Target of less than 1 month➥Reduce excess inventory through strict enforcement ofdetailed control for delivery dates
An Electronics Systems Coordinator-21-

Efforts in Semiconductors BusinessChange in Net Sales
by Product

Efforts in FY2013

Memories
System LSIs
Discretesemiconductors
Operating income (%) (100 millionsof yen)(100 millions of yen)

1,600

1,400

80

1,323
79

1,200

1,311
92

1,380

885

858

110
60

600

50

40
40

400

24

◇Specific efforts
Domestic suppliers

800

31

・In-vehicle electrical components
・Social infrastructure
・Communication equipment

70

910

1,000

◇Focused target markets(2.9%)
30(2.4%)(1.8%)

20

・Exploiting and capturing new markets(Smart grids and LED lightening, etc.)
・Deepening relationships with newlytransferred clients・Sales promotion to overseas local clients incooperation with local design houses(China, Korea)

Overseas suppliers
200

357

362

10

360

0

0

FY2011FY2012FY2013 (Forecasts)

An Electronics Systems Coordinator-22-・Strengthening the sales system for current
suppliersEfforts in Electronic Components BusinessChange in Net Sales
by ProductPower Supplies
Mechanical Components(100 millions of yen)

600

Efforts in FY2013

Display Devices

Operating income (%)◇Focused target markets(100
millions of
yen)

50

554
510

530

45

・In-vehicle electrical components
・Social infrastructure
・Communication equipment

500

156

40

110
130

◇Specific efforts

35
400

51

50
30

45

25

300

20
18
200

20

17
(3.8%)(3.3%)

15(3.4%)

10
100

346

335

370
5
0

0

FY2011FY2012FY2013 (Forecasts)

An Electronics Systems Coordinator-23-

・Improving the product lineup(LED, optical track pads, solar cells,
censors, etc.)
・Strengthening sales promotion inoverseas markets(Establish new division dedicated toChinese electronic components)
・Exploiting growth areas(In-vehicle electrical components,social infrastructure, informationand telecommunications)Efforts in Electronic Equipment BusinessChange in Net Sales
by Product

Efforts in FY2013
Systems Equipment◇Focused target markets

Facilities Equipment
Operating income (%)(100 millions of yen)(100
millions of
yen)

300

250

20
18

246

16

195

200

190

12

9

10

8

8
(5.1%)

100(3.6%)

8(4.5%)
6

164

155

4

50

60

2

31

35
0

0

FY2011FY2012FY2013 (Forecasts)

An Electronics Systems Coordinator◇Specific efforts

14

186
150

・In-vehicle related・Social infrastructure
・Environmental energy-24-・Improving the product lineup(Taiwanese and Chinese suppliers, mid-sized
venture companies manufacturing facilities
equipment, etc.)
・Introducing new business models(EOL, commissioned processing services,materials [such as noise suppression sheet],ODD unit, lithium ion batteries for in-vehicle
devices)・Exploiting markets and clients in growth areas(Social infrastructure, environmental energy,
next-generation semiconductors)
・Response to globalization(Exploiting markets in China and Taiwan)

Efforts in Ryosan Products BusinessChange in Net Sales
by AreaEfforts in FY2013

Domestic
Overseas◇Focused target markets

Operating income (%)(100 millionsof yen)(100 millions of yen)

8

80

7

70

Domestic
・Industry/FA・Energy・In-vehicle electrical ・Heavy electricalmachineries
components
・Medical devices
・Elevators

Overseas
60

54
48

50
40

6

50
36

41

35

5

◇Specific efforts

4・Focusing resources on appealing markets
Domestic: In-vehicle electrical components, heavy
electrical machineries, FA, energy,
infrastructure, medical devices, etc.
Overseas: Higher value-added products such as air
conditioners, in-vehicle electrical components
・Business expansion by introducing new products andtechnologies(Liquid cooling, improving Wave Cooler functions, newmaterials, etc.)
・Improving profitability in factories, strengthening theoverall optimum production system, and promoting
globalization

3
3

30

2

2

(7.0%)
220(4.1%)(4.3%)
1

10

13

13

14
0

0

FY2011FY2012FY2013 (Forecasts)

An Electronics Systems Coordinator・Air conditioners ・OA・In-vehicle electrical components-25-Trends in Net Income, Total Amount of Dividends, and Purchase of Treasury Stock(100
millionsof yen)70◇The Company purchased 1,000,000 shares of treasury stock in FY2012.
◇ The Company decided to purchase 1,000,000 shares of treasury stock in
FY2013.

Net income
Total amount ofdividends
Purchase of Treasury
Stock

85% (42%)

Total payout ratio

(71%)

60

（

128%

57

50

(71%)

66%

28

40

(71%)

(66%)

50
67

(72%)

22

72%

20
39

28

27

39

19

21
(Note)

17

41

30

28

28

18

10
0

(64%)

39

30

27

20

140%

161%

30

） Dividend payout ratio

19

13

18

@¥80

@¥80

@¥60

@¥80

@¥40

@¥60

@¥60

FY2007

FY2008FY2009FY2010FY2011FY2012FY2013(Forecasts)<<Trends in Purchase of Treasury Stock>>
FY2007

FY2008FY2009FY2010FY2011FY2012FY2013(Plan)

Amount(￥100 million)

28.8

22.5

―

―

17.2

19.8

21.2 (Note)

Number of stocks(10,000 shares)

100.0

100.0

―

―

100.0

100.0

100.0

(Note) From announcements made on May 24th and 27th, 2013 in relation to acquisition of treasury stock.
An Electronics Systems Coordinator-26-

Consolidated Statements of Cash Flows<Supplementary Material-1>

Major causes for increases/decreases

Cash flow
FY2011FY2012・Income before income taxes and minority interests:(Unit: millions of yen)

Operating CF(8,356)

17,689Investing CF

(936)

2,485

Financing CF

419(4,874)4,146 million yen
・Decrease in notes and accounts receivable-trade:(14,941 million yen)・Decrease in inventories:(6,319 million yen)・Withdrawal of time deposits:

3,000 million yen

・Decrease in short-term loans in foreign currency:

Free CFBalance of cash and cash
equivalents(9,292)
34,113

An Electronics Systems Coordinator

20,17450,463-27-(1,086 million yen)・Payment of year-end dividends:(1,673 million yen)・Purchase of treasury stock:(1,983 million yen)

Trends in Consolidated Financial Position<Supplementary Material-2>(100 millionsof yen)2,000

Total assets

Net assets to total assets

Net assets

Net assets per share (yen)

78.1%
65.6%

68.3%
72.5%

1,832

72.0%

1,740
1,615

69.2%
1,670

1,634

72.9%

1,602

1,489

1,500
1,203

1,189

1,172

1,164

1,177

1,156

1,167

1,000

3,595

3,296

3,348

3,376

3,398

End of Mar.
2008

End of Mar.
2009

End of Mar.
2010

3,413

End of Mar.
2011

3,457

500

0

End of Mar.
2007

An Electronics Systems Coordinator-28-

End of Mar.
2012

End of Mar.
2013

[Appendix]
Introduction of Technical Activities

An Electronics Systems Coordinator

May 29, 2013

Ryosan Company, Limited
Toshifumi Sakata
Director & General Manager of the Engineering Headquarters1[Orientation of technology]
・Expanding the strongest areas and enhancing the system technical capabilities
・Extending the technology for growth markets and expanding globally[Medium-term technology strategy]～Strengthening technology that sells out～
■Strengthening system technical abilities (including elemental
technology) and proposal abilities■Strengthening development abilities through commissioned
development (ASIC/software development)■Strengthening technical support abilities (device applied technicalabilities) for complementing suppliers■Global expansion of in-house technology to growth markets
Promoting design-in for the Korean, Chinese and Indian markets
2

[Position of technology]
Technology for selling out devices＜

Supplier

Device technology

Client＜Position of RS technology

RS technology
System technology(Client set)

Provision/pursuit of practical technology which matches
conditions at each client■Development technical abilities and device applied technical abilities gained
through many years of experience
I. Deep knowledge of characteristics/problems related to device application;technical abilities which maximize the performance of devices.
II. Proposal/realization abilities with in-depth understanding of the client’s uniquedevelopment style and set specifications (system)
3

■Strengthening system technical abilities (including elemental
technology) and proposal abilities
Medium-term accumulated technologies
Systems

System technologies and elemental
technologies

Main targeted clients

In-vehicle
electricalcomponents

In-vehicle LAN (Ethernet AVB control technology),functional security
Various ECU (Body, EPS, ACC), car-mounted cameras
Display audio (MirrorLink, Miracast, Linux)
Immobilize (keyless entry)

Manufacturers of in-vehicle equipment

Home
equipment

Smart grids, household power management systems
Power-saving LAN control technology (for offices)
LED/organic EL lighting technology
Power systems (AC-DC, DC-DC)

Domestic and overseas manufacturers ofsmart meters, manufacturers of LED
lighting & solar cells, etc.

Communicationequipment

Wireless telecommunication technology (LTE, Wi-Fi,
Bluetooth-LowEnergy) router

Manufacturers of cell-phone handsets,
car-mounted navigation system, and OA
equipment

Mobile devices

DSC/surveillance cameras (image processing, noise
reduction, image communication I/F)

Manufacturers of DSC and industrial
camerasShared element
technology

Control technology (analog) for PFC power supply IC
ARM multi-core response technology (Cortex Series)

Power supply clients, OA devices clients4Strengthening value-added areas by improving and enhancing supported systems
Supported areas in FY2011
Condition in FY2012
FY2013 targets for Medium-Term Plan

Turn-key
development

System technicalcapabilities(Value-added areas)

Improving and enhancing
supported systems

Set handling
Reference development

Elemental technology
development
System proposal

Commissioned development(Software development, ASIC development)
Technical support (handling questions regarding
detailed product information at the time of acquiring clients),
development of reference corresponding to devices

Device proposal, technical contact, questions handling
In-vehicle Household LTE
Car
Electricallighting
multimedia components
5

Smartmeters[Improvement of Supported Systems① In-Vehicle Motor Control]
Through cooperation with partners who possess technical know-how in motor
control, acquire motor control technology and develop EPS modify programs
which meet client specifications
Cooperation with partner
Understanding motor control technology

In-vehicle
clients(EPS)

RyosanAcquiring tuning methods[Details of technical support]①Operation verification and modification which matches client motor units②Design of MCAL sample programs, boot programs*MCAL: Driver program in compliance with AUTOSAR
32-bit microcontroller for motor control
Boot Loader

EPS application program

MCAL sample program

Motor
control
program

SENT

6

SSC
communication: Designed by Ryosan

Data
Flash

CAN

PLL

UART

CSI

TIMER

PORT

ADC

・・・

Complex Drivers：Designed by Ryosan + DH

[Improvement of Supported Systems② Power Line Communication (PLC)]
Based on REL’s PLC for LSI, accumulating technology in advance for overseas business
Implementing technology in domestic market and increasing sales in the smart grid market
PLC: Power Line Communication
Overseas manufacturers

Meter clients

Modulesetc

RyosanImplement accumulated technology
Domestic manufacturers

Meter clients

Concentrator

Power companies
Taiwan, Thailand,
Europe, China

Power
companies

Smart MeterMCU
PLC module
32bit
microcontroller

Communications
equipment, etc.

Technical support
Sample software design
Software commissioned development

HEMS(G3/ARIB specifications)

PLC

PLC LSI＋ ARM7

SRAM

DSP

PHY

PLC

・ECHONET Lite: A control protocol and sensor network
protocol for smart homes. International standardization
through ISO and IEC specifications.
・HEMS: Home Energy Management System

ECHONET Lite
7

[Improvement of Supported Systems③ Communications Standard Miracast]
New standard which uses Wi-Fi (wireless) to connect smartphones andin-vehicle equipment
・The screen (function) of a smartphone is displayed on in-vehicle
equipment
・A smartphone is operated by manipulating in-vehicle equipment[Usage example]
Navigation application of a smartphone isused on in-vehicle equipment

Device: manufactured
by Renesas
R-CAR, R-Mobile＋

Network connection
using a smartphone[Usage example]
Information of in-vehicle equipment isdisplayed on a smartphone

Middleware: manufactured
by Partner
Miracast stack
M/W

RyosanTechnical support
8[Usage example]

In-vehicle
equipment
manufactures

[Improvement of Supported Systems④ LTE]
Advanced accumulation of LTE (Long Term Evolution) technology
for next-generation cell-phones (3.9G or after)
Collaborating with module manufactures and currently promoting DI for a wide
range of fields
ClientAutomobiles

Modem platform development
LTE module development

Renesas mobile
Industries
Modem platform software

Company A
moduleDigital consumer equipment

LTE modem chipset
MM
HPA
FEM

RFIC

DBB

PMIC

Memories

Company B
moduleRouters

Single
HPA
Peripheral
components

9

TabletRYOSAN technical support

■Strengthening development abilities through commissioned development(ASIC/software development)[Main development record]
ASIC
development
24
projects

Microcontroller
development
126
projects
10

ClientSet

Process

Notes

Company A

Slot machines

MF2

Company B

DSC

CB40LR

Acquiring technology for image processing circuits(Strengthening design abilities from specifications)Company C

Machine tools
Motion controller

CB40LR
CB40LR

Acquiring technology for communications IP(Giga-Ether)

Company D

LBP

CB40LR

Application of ARM bus I/F technology(Strengthening design abilities from specifications)Company E

MFP

UMC (130nm)

ClientSet

DeviceCompany F

Display audio

R-Mobile

Company G

In-vehicle audio

V850E2/SK4

Expanding commissioned development throughstrengthened DH cooperation

Company H

TabletRL78/G13

Securing clients in new growth fields

Company I

Answerback

RL78/F12

Expansion for field of new in-vehicle electricalcomponents

Company J

Doorlock

RL78/F12

Expansion for field of new in-vehicle electricalcomponents

Securing continual business talks

DI expansion for Faraday ASIC

Notes
Acquiring MirrorLINK new technology

■Strengthening technical support abilities (device applied
technical abilities) for complementing suppliers・Improving device applied technical abilities with the goal of shifting fromdependence on overseas suppliers to self-containment, strengthening claim
analysis abilities and device Q&A response abilities, etc. for high-level application
Action item for strengthening technical abilities

System and productSupplier

Kit (system) proposal

Large household appliances,
lighting, car multimedia

NXP, Micrel

Reference board, software design

Power supply
LED lighting
Speech recognition
Near field communication

NXP, Micrel
NXP, ST
NXP
NXP

Device application evaluation

Gigabit Ethernet PHY
Ripple Blocker
MEMS

MicrelMicrelST

Error analysis and isolation of problems,
proposal of solutions

All handled products

NXP, Micrel, ST

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[Technical Support Example① Touch Panel]
Implementing total technical support for specifications review, software design,
panel/sensor design, FPC design and error analysis. Also implementing
technical support for module manufacturers.
①Set specifications, SW design support②Panel/sensor design support

・Support for tuning work
・Verifying SW operation, etc.

・Reviewing/proposing shape for transparent
electrodes
・Noise reduction measures such as adding ashield, etc.

<Example: Operation
Verification Report>

Silver paste③FPC design support
・Shield design
・Noise reduction measures
for LCD drive, etc.
<Example: Diagram for
proposed layout corrections>
Correct to eliminate intersection

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Silver paste④Error analysis support
・Isolating causes (originating from IC or
panel)
・Identifying/inspecting error location, etc.
<Example: Report on Disconnection Location>
Location of
disconnection

[Technical Support Example② Kit Business]
Kit business with transformers which compose NXP-manufactured
power supply IC + power system
Acquiring commercial rights for transformers through cooperation
with transformer manufacturers
Transformer manufacturer

Acquiring commercial rights

ClientTokyo Parts Industrial Co., Ltd.

Set

TEA173x series
TEA172x series

・Washing machine・Rice cooker
・Microwave oven

Proposal＋Kami Electronics IND. Co., Ltd.

・Vacuum cleaner
・Lighting, etc.

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RYOSAN・Reference board
design・Characteristics
Reference board
evaluation
designed by Ryosan
・TuningCompany A
Company B
Company C

Currently negotiating
commercial rights

・Air conditioning[Technical Support Example③ Reference Board]
Independent development of reference board for realizing client systems
Constructing solutions equipped with products (semiconductors, electronic
components) which are handled by Ryosan and are target for expanded sales
Overview of Board Specifications

Under development
Target application(1) Touch panel display monitor (Example: Solar panel, DPF, etc.)(2) Speech recognition solutions (Example: Microwave ovens,
air conditioning, etc.)

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CPU

Cortex-M4/M0 (dual) 204MHz

MemoryFLASH 1MB (CPU embedded)
8MB (parallel) ＋16MB(serial)SDRAM 16MB

Communic
ation I/F

USB HS Host/Device
10/100Mb Ethernet, RS232C
IrDA, SD Card
Audio I/F (Mic/Line)

LCD

5.7 inch TFT with touch panel

Based on a fundamental display
and touch panel, possesses avariety of I/F functions andenables speedy construction ofdemos through connection to
peripheral circuits

[Promoting Proposal of Kits]
Renesas product + overseas semiconductors + modules
・Promoting proposal of kits to priority systems
Reviewing new items, promoting proposal of kits through reference boards
・Sharing new business talk information and system information
Example of applicable systems

Example of kit proposal

Car navigation systems/audio

SOC, MCU, Power supply (REL) + Eｔher（Micrel)＋DRAM(Winbond)

DSC
Single-lens reflex/interchangeable
lens
Printer/POS

MCU, ASIC(REL)＋MEMS（ST) + Power supply, Ripple Blocker, CLS(Micrel)LCD display module

MCU (REL, NXP) + Memory (Winbond) + Power supply, CLS, Ether (Micrel)
MCU (REL, NXP) + FROM (Macronics)+ DRAM (Winbond) + Power supply, EEEPROM (REL, ST) + Ether (Micrel)[Development of system block diagrams used in proposals, use in sales and FAE]
DSC, air conditioning, refrigerator, IH cooking heater, toilet seats with warm-water
shower, blood glucose meter, electronic piano, sewing machine, LED ceiling light,
power system, memory selection guide, etc.
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[Global expansion to growth markets]■Strengthening technical support system for automotive
clients in Korea
・Currently conducting DI activities/technical support with the goal of sales of 10,000
million yen in 2016.
Engine control microcontrollers, airbag microcontrollers, EPS microcontrollers,
Navigation system SoC, audio microcontrollers, various power devices, etc.

■Promoting DI/DW to Chinese clients
・Deploying advanced technology accumulated in Japan; conducting activities bycooperating with Chinese monopolies
Image processing LSI for mobile cameras, SoC for STB, LSI for smart meters,
ASIC for exchange equipments, in-vehicle microcontrollers, etc.

■Making inroads into Indian market
・STB development for Indian companies, 1-year business trip technical support, startmass production in March 2013
・Entering new fields through cooperation with Ryosan India

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