Advance Program and Registration on-line: www.imaps.org/devicepackaging

IMAPS 9th International Conference and Exhibition on

Device Packaging
March 11 - 14, 2013

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona - USA
in conjunction with the Global Business Council (GBC) Spring Conference
March 10 - 11, 2013 - www.imaps.org/gbc

Courtesy of Rensselaer Polytechnic InstituteCourtesy of U. S. Army RDEDCOM AMRDEC

General Chair:

Device Packaging Program overview

General Chair-Elect (PDC):

Monday, March 11
10 Professional Development Courses - 1/2 Day
Five - 8:00 am - Noon & Five - 1:00 pm - 5:00 pm

James Lu, Rensselaer Polytechnic InstituteRon Huemoeller, Amkor Technology

Past General Chair (Panels):

Tuesday, March 12 - Thursday, March 14
Technical Sessions

Peter Elenius, E&G Technology Partners

Technical Chairs:

Tuesday, March 12
Flip Chip/WLP Panel Discussion: 7:00 pm - 8:30 pm

Rozalia Beica, LAM Research AG
Peter Ramm, Fraunhofer EMFT
Linda Bal, Freescale Semiconductor
Luu Nguyen, Texas Instruments
Tracy Hudson, U. S. Army RDECOM AMRDEC
Russell Shumway, Amkor Technology
Thomas Goodman, E&G Technology Partners
Bob Karlicek, Rensselaer Polytechnic InstituteWednesday, March 13
Poster Session in Exhibit Hall: 2:00 pm - 4:30 pm
3D Panel Discussion: 6:00 pm - 7:30 pm
3D Integration - Applications and Production Challenges

DPC/GBC Premier SPonSorS:

Tuesday, March 12
10:00 am - 7:00 pm

exhibition

Wednesday, March 13
12:00 pm - 4:30 pm

Organized by: International Microelectronics Assembly and Packaging Society (IMAPS)
Bringing Together the Entire Microelectronics Supply Chain!

Hotel Cut-off: February 8, 2013
Early Registration & Exhibit Deadlines: February 8, 2013

A D VA N C E D PA C K A G I N G S I N G L E WA F E R W E T P R O C E S S I N GSolid State Equipment LLC
ADVANCED PACKAGINGSINGLE WAFERWET PROCESSINGTSV RESIST STRIP AND CLEAN

As received – post DRIE

After SSEC Cleaning

After SSEC Cleaning

As received – post DRIEAs received – post DRIE

After SSEC Cleaning

Si ETCH TO REVEAL Cu TSV

OpticalSEM

DRY FILM STRIPISIS 3D

FLUX CLEANINGUBM AND RDL METAL ETCH
Undercut (µ)

Undercut vs Etch Time

1.7µ
1.5µ

0µ

(non-measurable)

WaferChek™

+15 sec
Over-etch+30 sec
Over-etch

Etch TimeUBM Post Etch

ssecusa.com

SSE_363_One pg_ad_v2.indd 1

UBM Post Strip© 2012 SOLID STATE EQUIPMENT LLC

8/17/12 11:55:49 AM

Conference Overview
The 9th annual Device Packaging Conference (DPC2013) will be held in Scottsdale, Arizona, on March 11-14, 2013. It is aninternational event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking
opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry
and academia. It provides a chance for educational interactions across many different functional groups and experiencelevels. People who will benefit from this conference include: scientists, process engineers, product engineers,
manufacturing engineers, professors, students, business managers, sales and marketing.
The 2013 conference will feature technical sessions, panel discussions, a poster session, professional development courses
and a vendor exhibition and technology showcase. The conference provides a focused forum on the latest technologicaldevelopments in 4 topical workshop tracks related to microelectronic packaging: Advanced 3D Packaging; Flip Chip &Wafer Level Packaging; MEMS & Associated Microsystems; and LED Packaging for Future Solid-State Lighting.
The professional development courses offered are also focused on these topical areas of microelectronics and offer an
additional valuable resource to attendees. The Global Business Council (GBC) will co-locate its Spring Conference March
10-11, focusing on the business aspects of these technologies. There will be several networking receptions and gatherings
throughout the week, including the opening reception, meals, and other social events.

Organizing Committee
Advanced 3D Packaging
Technical Chairs:
Rozalia Beica, LAM Research AG
Peter Ramm, Fraunhofer IZM,
MunichCommittee:
Franck Murray, IPDIA
Harry Hedler, Siemens Munich
Jeff Calvert, DOW Electronic
Materials
Keith Cooper, SET NA
Kuan-Neng Chen, National Chiao
Tung University
Muhannad Bakir, Georgia Instituteof Technology
Paul Siblerud, Applied Materials

Flip Chip & Wafer Level
PackagingHigh Brightness LEDs

MEMS

Technical Chairs:
Linda Bal, Freescale
Semiconductor

Technical Chairs:
Tracy Hudson, U.S. Army

Luu Nguyen, Texas Instruments

Russell Shumway, Amkor
Technology

Committee:
Lars Boettcher, Fraunhofer IZMCommittee:
Thomas Baginski, Auburn University

Eric Huenger, Dow Chemical

Robert Dean, Auburn University

Alan Huffman, RTI International

Li-Anne Liew, NIST

Jamin Ling, Kulicke & Soffa Industries, Inc.

Phil Reiner, CGI Federal Systems

Technical Chairs:
Thomas Goodman, E&G Technology
Partners
Bob Karlicek, Rensselaer Polytechnic
Institute
Committee:
Sheng Liu, Huazhong Univ of
Science & Tech
Ricky Lee, HKUST
Jay Liu, Shineon Technology Co.

Peter Tortorici, Medtronics

Gilles Poupon, LETI
Andy Strandjord, PacTech USA

Alexander Trusov, Univ. CA Irvine

Ted Tessier, Flip Chip International

Keith Warren, MEMS Consultant

GBC Speaker Dinner Sponsors:

Phil Garrou, Microelectronic
Consultants of NC
Reinhard Pufall, Inﬁneon Technologies
Subhash Shinde, Sandia National
Laboratories
Thorsten Matthias, EV Group

Monday, March 11th
Welcome Reception: 5:00 pm - 6:30 pm(GBC Attendees Invited)followed by the...

Yann Guillou, SEMI Europe

2013 Texas Hold’em Tournament: 7:00 pm - 10:00 pm

Beneﬁts the IMAPS Microelectronics Foundation
The IMAPS Microelectronic Foundation is holding its third annual charity Texas Hold’em Tournamenton March 11th at 7:00 pm. The number of seats at the tables is limited to the ﬁrst 30 players, and on
a ﬁrst come ﬁrst served basis, so sign up now online at:
http://www.imaps.org/DevicePackaging/holdem2013.htm for more information.
1

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resistance• Superior thermal performance• Pb-free/Low alpha solution

With proven reliability involume manufacturing!

visit amkor technology online for locations andto view the most current product information .

w w w . a m k o r. c o mPreceding the Device Packaging Conference...

9th Annual GBC Spring Conference and Marketing Forum

Covering the Business Side of Microelectronics Assembly and Packaging

March 10 - 11, 2013

Radisson Fort McDowell Resort and Casino

Please visit www.imaps.org/gbc to register for the GBC Conference.

Sunday, March 10
5:30 PM - 7:00 PM - Registration and GBC Welcome Reception (Beverages and Appetizers)
7:00 PM - 9:00 PM - Speaker’s Dinner (by Invitation) Sponsored by: SSEC; Amkor Technology, ASE Group, and Kyocera

Monday, March 11
7:00 AM - 8:00 AM - Continental Breakfast and Registration
7:00 AM - 5:00 PM - Registration
The IMAPS GBC is pleased to announce its 2013 Spring Conference. Key industry leaders will provide important information on the critical role that supply chain management plays in our global industry. Presenters will address how business models, industry collaboration,and market dynamics can have profound impacts on the increasingly interconnected semiconductor supply chains. Participants will gain
valuable industry insight to achieve a competitive advantage in product development, manufacturing, marketing, and sales. The conference will facilitate networking with key decision-makers across our broad industry supply chain.
Co-Chairs: Iris Labadie, Kyocera America; Steve Annas, nMode Solutions
8:00 am - 8:15 am: Opening Remarks

12:00 pm - 1:00 pm: Lunch & Luncheon Keynote“The “New” IC Industry Cycle Model”

Steve Annas, nMode Solutions, Inc.

Bill McClean, President of IC Insights

8:15 am - 11:55 am: Morning Presentations

1:15 pm - 5:10 pm: Afternoon Presentations

Medical Electronics Trends for Evolving Healthcare Ecosystems
Moderators: Peter Tortorici, Medtronic, Inc.;
Iris Labadie, Kyocera America

Trends in Microelectronics & Factors Shaping Enabling Technologies
Moderators: Lee Smith, Plexus Corp.;
David D’Ambra, DuPont Microcircuit Materials

8:15 am - 9:00 am: “Medical Electronics Crossroad – from
Healthcare to Health”
Keith Lindor, Arizona State University

1:15 pm - 2:00 pm: “Saving Lives with MEMS and Sensors:
Advancements in Packaging”

9:00 am - 9:30 am: “Implantable Electronics Technology
Needs for Improved Cost Efficient Care and Emerging
Markets”

2:00 pm - 2:30 pm: “Material Requirements for the Electronics
Industry today and in the Next Decade”

E. Jan Vardaman, TechSearch International

Vern Stygar, AGC Electronics

David Ruben, Medtronic, Inc.

9:30 am - 10:00 am: “Supply Chain Issues With New Electronic
Packaging Technologies”

2:30 pm - 3:15 pm: “Microelectronics: Driving Increased Energy
Productivity”

10:00 am - 10:20 am: Coffee Break

3:15 pm - 3:30 pm: Coffee Break

10:20 am - 10:50 am: “Collaborating to Compete: Biomedical
Sensor Failure Prediction”

3:30 pm - 4:10 pm: “Supply Chain Eco-systems for Next
Generation 3D and High-density Flip Chip Interconnection”

10:50 am - 11:20 am: “Latest Trends in Advanced Packaging
Technologies and Focus on Medical Applications”

4:10 pm - 4:40 pm: “Defense Electronics Today and in the Next
Decade”

11:20 am - 11:55 am: “Opportunities for Microelectronics
Packaging Technologies to Advance Wireless/Mobile Health”

4:40 pm - 5:10 pm: “Virtual Factory: Cloud Based System for
Global Manufacturing & Data Management”

Jeff Perkins, Energy & Resource Solutions

John Dzarnoski, Starkey Hearing Technologies

Jean Trewhella, IBM Corporation

Colin Drummond, Case Western Reserve University

Mark Darrow, Cobham Defense

Lionel Cadix, Yole Développement

Simon Gonzales, Murata - RF Monolithics, Inc.

Mehren Mehrgany, Case Western Reserve University

Device Packaging Welcome Reception (GBC Attendees Invited)
5:15 pm - 6:45 pm (Beverages and Appetizers)
Texas Hold’em Poker Tournament (Limited Seating)
7:00 pm - 10:00 pm: benefits IMAPS Microelectronics Foundation

5:10 pm - 5:20 pm: Closing Remarks, Final Questions, andConference Evaluation
Steve Annas, nMode Solutions, Inc.
3

MONDAY, MARCH 11, 2013

Professional Development Courses (PDCs)

7:00 am – 7:00 pm

Registration

7:00 am – 8:00 am

Continental Breakfast

8:00 am – 12:00 pm

Morning Professional Development Courses (PDCs)
PDC1: 2.5D/3D, Flip Chip WLP,
MEMS & LED Packaging
Trends, Updates & Advances
Course Leader: Phillip G. Creter,
Creter & Associates

PDC2: Recent Advances in
Glass & Silicon Interposers
for 2.5D and 3D Integration
Course Leader: Venky
Sundaram, Georgia Institute ofTechnology (PRC)

PDC3: High-Temperature
Electronics - with an
Emphasis on Assembly &Packaging
Course Leader: Randall
Kirschman, Consultant

PDC4: Hermetic Sealing
and Testing of Small
Volume MEMS Packages

Course Leader: Thomas J.
Green, TJ Green Associates
LLC

10:00 am – 10:20 am

Break

12:00 pm – 1:00 pm

Lunch
Only provided for those attendees registered for both Morning and Afternoon PDCs

1:00 pm – 5:00 pm

PDC5: Failure Mode
Analysis of Flip Chip andAdvanced Package and
Board Assemblies

Course Leader: Daniel Baldwin,
Engent, Inc.

Afternoon Professional Development Courses (PDCs)
PDC6: Fundamentals of Glass
Technology and Applications
for Advanced Semiconductor
Packaging
Course Leader: TJ Kiczenski,
Corning, Inc.

PDC7: Polymers forElectronic Packaging

Course Leader: Jeffrey Gotro,
InnoCentrix, LLC

PDC8: Thermal & Mechanical
Simulation Techniques - An
Introductory Course for 3D
Enablement Professionals
Course Leader: Kamal
Karimanal, Cielution LLC

PDC9: MEMS Reliability
and Packaging

Course Leader: Slobodan
Petrovic, Oregon Institute ofTechnology

PDC10: Basics ofConventional and Advanced
Packaging

Course Leader: Syed Sajid
Ahmad, Center for Nanoscale
Science and Engineering, NDSU

3:00 pm – 3:20 pm

Break

5:15 pm – 6:45 pm

Welcome Reception (All Attendees “GBC & DPC” Are Invited To Attend)

7:00 pm – 10:00 pm

Texas Hold’em Tournament (Limited Seating) - http://www.imaps.org/DevicePackaging/holdem2013.htm
To Benefit the IMAPS Microelectronics Foundation

PDC1: 2.5D/3D, Flip Chip WLP, MEMS & LED Packaging Trends, Updates & Advances
Course Leader: Phillip G. Creter, Creter & Associates

Course Description:
This NEW overview focuses on the four technical topics of this 2013 Device Packaging Conference, independently reviewing leading edge technicaldevelopments featuring the latest in microelectronics updates/trends. Specific topics from 2012-1Q2013 conferences, technical papers, news reports:- 2.5D/3D (Status/market, wide I/O memory stacking, polymer isolated TSVs, silicon bridge TSVs, fusion glass substrates, wafer adhesives, thin stacking,test vehicle demos, self-assembly).
- Flip Chip Wafer Level Packaging (Status/market, fine pitch copper pillars, electromigration, intermetallic compound studies, non-conductive film used inwafer level underfill, low cost FC-PoP, electromigration of lead free solder bumps).
- MEMS (Status/market, challenges, novel approaches, hermetic wafer level packaging, drop reliability, flex adhesive).
- LED Packaging (Status/market, high power heat sinks/die attach material, novel encapsulants, silicon/glass/GaN substrates).
Technical innovations related to the above topics presented with input from leading industrial/academic institutions: Advanced Semiconductor
Engineering/ASE, Altera, Amkor, CEA-Leti, Corning, DELO, Georgia Institute of Technology, Global Foundries, Hitachi, Hong Kong University, IBM, IFTLE,Intel, ITRS, Karlsruhe Institute, Microsystems, NAMICS, National Tsing Hua University, Oracle, Philips Lumileds, Qualcomm, Samsung, Sandia NationalLabs, Sematech, Solid State Technology, Siliconware Precision Industries/SPIL, TechSearch, Tohoku University, Toray, Toshiba, University of California,
Wuhan National Laboratory for Optoelectronics, Xilinx, Yole and others. Emphasis on visual aids (photos, figures, videos) with pass-around microcircuit
samples. An invaluable handout includes over 100 references.
Who Should Attend?
Designed primarily for all engineers, scientists and others interested in an up-to-date overview of new developments in 3D, Flip Chip, MEMS and LED. The
course uses simple terms and many graphics and figures to describe these elements of advanced packaging for those who are new to the field and needinga running start in these four focused areas of packaging technology. Ideal for entry-level technicians and engineers but also for people in quality assurance,
sales, marketing, purchasing, safety, administration and program management since it also includes a short review of current single chip and advanced
wafer levels of 3D packaging.
Phillip Creter is a consultant (Creter & Associates) with 30 years of microelectronics experience at Polymer Flip Chip, Mini-Systems, GTE, Itek Corporation. Past positions at GTE
included Microelectronics Center Manager (received GTE Corporate Lesley Warner Technical Achievement Award), and Principal Investigator of GTE IR&D Projects. Other
positions elsewhere included management in Projects/Process Engineering, Process Development, Materials Engineering/Manufacturing Engineer, receiving many awards of
distinction. Creter has been teaching college-level microelectronics courses since 1997. He has continuously taught PDCs since 2004 for online webinars and national
microelectronics symposia/workshops. He is a well-known presenter having published technical papers in IEEE Transactions, Solid State Technology, High Density Interconnect,
Circuits Manufacturing, Insulation Circuits, others. He has chaired many technical symposia sessions, given numerous technical presentations, is a US patent-holder. He is anactive certified Department of Homeland Security instructor, a Life member of IMAPS, elected Fellow of the Society, and has held several executive committee offices both
locally/nationally.

5

PDC2: Recent Advances in Glass and Silicon Interposers for 2.5D and 3D Integration
Course Leader: Venky Sundaram, Georgia Institute of Technology (PRC)

Course Description:
This course will present a comprehensive review of the latest 2.5D and 3D interposer approaches being developed worldwide. High density interposers are
emerging as a mainstream technology for packaging of heterogeneous ICs and 3D ICs, but also as a simpler and better alternative to 3D ICs with TSV,
eventually providing a path for integration of sub-systems or entire systems. Silicon and glass interposers are emerging as the front-runners to address the
I/O, CTE, warpage and thermal limitations of current organic packages. The topics covered include Electrical & Mechanical Design, Silicon Interposers,
Glass Interposers, Chip Level & Board Level Interconnections, Applications and Markets, and Manufacturing Infrastructure for interposers. Wafer based
BEOL Si interposers as well as emerging panel based glass and other interposer technologies will be described in detail. A variety of materials and process
options for interposer fabrication will be presented. The technical and business challenges that must be addressed for successful implementation ofinterposers in 3D packages will be discussed. Specific examples of key interposer developments such as Xilinx stacked silicon interconnect, MEMS
packaging using glass interposers, silicon interposer for high performance CPU packaging, and logic-memory high bandwidth 3D integration will behighlighted. For 2013, the course materials will be updated to include technology highlights in the past twelve months.
Who Should Attend?
This popular course is a must-attend event for those highly interested in interposer technology advances for the future. The course is intended for a broad
audience including semiconductor and packaging managers, technologists, engineers, industry and academic researchers, and students.
Dr. Venky Sundaram is the Director of Research at the 3D Systems Packaging Research Center (PRC), Georgia Tech. He is the Program Manager for the Silicon and GlassInterposer (SiGI) industry consortium with more than 25 active global industry members. His research expertise is in the areas of System on a Package (SOP) technology, 3D
packaging and integration, ultra-high density interposers, embedded components and systems integration. He is a globally recognized expert in packaging technology and a cofounder of Jacket Micro Devices, an RF/wireless start-up acquired by AVX. Dr. Sundaram is the co-chairman of the IEEE CPMT Technical Committee on Interconnections andSubstrates and is on the Executive Council of IMAPS as Director of Education Programs. Dr. Sundaram has won several best paper awards and has 15+ patents and 100+
publications. He received his BS from IIT Mumbai, and MS and PhD in Materials Science and Engineering from Georgia Tech.

PDC3: High-Temperature Electronics - with an Emphasis on Assembly & Packaging
Course Leader: Randall Kirschman, Consultant

Course Description:
High-Temperature Electronics (HTE) is a valuable option for substantially improving overall system performance. Operating temperature can be an
additional design parameter when justified by system performance requirements. Applications of HTE include many areas of science and technology,
including petroleum and geothermal wells, vehicles, aircraft, Solar System exploration, and electric power. Relocating electronic subsystems to hightemperature can improve overall system efficiency, decrease size and weight, simplify maintenance and improve reliability. At the same time there are manytechnical challenges, related to materials interactions, component behavior, circuit design and interfacing. The focus of this course is semiconductor
electronics assemblies at high temperatures: applications, advantages and drawbacks, technical issues and present situation. Topics include semiconductor
device behavior and capabilities, packaging and assembly materials characteristics as a function of temperature, passive electronic component behavior,practical aspects of choosing packaging and assembly material and techniques. The temperature range covered in this course extends from 125°C upward,
as high as 1000°C, although emphasis is on the more practical range of approximately 125°C to 300°C. The course notes include approximately 160
PowerPoint slides, more than 100 pages of detailed notes, and more than 300 references.
Who Should Attend?
Engineers and technical persons developing, designing or working with electronics for operation at high temperatures. A basic background in electronicmaterials and devices will be helpful.
Dr. Randall Kirschman is an internationally recognized authority on extreme-temperature electronics. He has been consulting to industry, government and academe since 1980 in
the areas of micro-electronic materials and fabrication technology, and electronics for extreme temperatures. Before going into business for himself, he managed an R&D
processing laboratory a division of Eaton Corporation, where he was responsible for the fabrication of microwave thin-film circuits. Prior to that he was on the staff of the Jet
Propulsion Laboratory, performing research on a variety of semiconductor materials and devices. During 1990-91 he was a Visiting Senior Research Fellow at the University ofSouthampton, England. and between 1998-2005 was a member of the Physics Department at Oxford University. He edited the 1999 IEEE Press/Wiley book High-Temperature
Electronics. He completed his undergraduate studies at the Univ. of California, and earned his Ph.D. in Physics & Electrical Engineering at the California Institute of Technology.

PDC4: Hermetic Sealing and Testing of Small Volume MEMS Packages
Course Leader: Thomas J. Green, TJ Green Associates LLC

Course Description:
Reliable packaging of MEMS requires the ability to create and maintain a suitable inert atmosphere or vacuum inside the package cavity for the expected
lifetime of the device. Traditional hermetic ceramic/metal packages are being replaced by wafer level packaging techniques, which present uniquechallenges from a hermeticity testing perspective. This course begins with an overview of traditional hermetic sealing processes along with wafer level
MEMS packaging processes and methods. In some cases near-hermetic packages, such as LCP are suitable for some applications. Testing of small cavity
MEMS packages according to the traditional Mil Spec TM 1014 requirements may not be sufficient to guarantee reliable operation. Difficulties and limitations
in fine leak testing of small volume packages will be addressed. Recent advances in Optical Leak Testing (OLT), Cumulative Helium Leak Detection (CHLD)
along with other hermeticity techniques, such as pirani vacuum sensors, are reviewed in light of the new tighter hermeticity specifications. Gaseous ingress
is of primary concern for a small volume MEMS cavity packages. Moisture level vs. surface area to volume ratio is an important concept, along with material
outgassing and the potential to mitigate these problems with getters. These along with other critical MEMS packaging issues are addressed.
Who Should Attend?
This PDC is intended as an intermediate level course for process engineers, designers, quality engineers, and managers responsible for packaging andhermetic testing of small volume cavity style packages.
Thomas J. Green is the principal at TJ Green Associates LLC (www.tjgreenllc.com), a veteran owned small business specializing in teaching and consulting for the
microelectronics industry. Tom has demonstrated expertise in sealing and hermeticity testing of products intended for high rel military and medical applications. He is currently on
the JEDEC committee helping to revise TM 1014 and has served as an expert witness in medical cases related to hermeticity failures. Tom is an active member of IMAPS and a
Fellow of the Society. He has a B.S. in Materials Engineering from Lehigh University and a Masters in Engineering.

6

PDC5: Failure Mode Analysis of Flip Chip and Advanced Package and Board Assemblies
Course Leader: Daniel Baldwin, Engent, Inc.

Course Description:
Over the past few years, numerous advanced packaging and process technologies have emerged such as flip chip in package, PoP, SiP, WLCSP, 3DWLCSP, QFN, etc.. While a large number of technical publications are available to help with process requirements, understanding failure modes andreliability standards is essential for these technologies to be successfully sustained in production. This course will present reliability test procedures,assembly process defects, and common failure modes that occur in advanced package and board level assemblies. It will focus on process defectidentification and resolution, failure mechanisms and the associated analysis tools needed to identify them such as FTIR, XRF, transmission X-ray analysis,
acoustic microscopy and scanning electron microscopy. Numerous process defects and failure modes will be presented along with extensive visual aids toprovide a more intuitive understanding of the defects and failure modes associated with these advanced assemblies. It will also discuss artifacts leading toprocess defects and how they can contribute to premature failure.
Who Should Attend?
Individuals associated with electronics packaging, package reliability, package failure analysis, and assembly process control/defects are encouraged toattend. The following are encouraged to attend. Managers. Knowledge gained through this course will allow managers to make informed decisions about thetechnical feasibility, implementation factors, performance benefits, reliability, and risks of implementing flip chip technology. Engineers. Manufacturing,
quality, design, and packaging engineers in integrated circuit, equipment, materials, and system design who are challenged to solve process defects andpackaging problems. Knowledge gained through this course will allow engineers and technologists to make informed decisions about the technical feasibility,
implementation factors, performance benefits, reliability, and risks of implementing flip chip technology.
Dr. Daniel F. Baldwin is the President and CEO of Engent, Inc.-Enabling Next Generation Technologies providing enabling manufacturing services and process technologies in
the areas of microelectronics, flip chip, optoelectronics, and MEMS. He is one of the 2003 founding partners of Engent. He recently completed an Adjunct Associate Professor of
Mechanical Engineering position at the Georgia Institute of Technology. He was a tenured Associate and Assistant Professor of Mechanical Engineering at Georgia Tech from1995 through 2005. At Georgia Tech, he headed the Low Cost Flip Chip Processing program for the Packaging Research Center, the Advanced Interconnect Technologies
research program for the Manufacturing Research Center, and the Low Cost Assembly Processing Program for the CBAR. Prior to joining the faculty, he was a Member of theTechnical Staff at Bell Laboratories, Princeton NJ working on electronic product miniaturization. He was formerly the Vice President of Siemens' Advanced Assembly Technology
Division. He also served as a research manager and research assistant at MIT's Laboratory for Manufacturing and Productivity from 1990 to 1994, a Draper Fellow at the Charles
Stark Draper Laboratory in Cambridge MA from 1988 to 1990, and an Engineering Intern for Mitsubishi Electric, Kamakura, Japan in 1987. Dr. Baldwin received his S.M. and
Ph.D. degrees in Mechanical Engineering from MIT in 1990 and 1994, respectively. Dr. Baldwin served as the Technical Program Chair of the IMAPS 2nd International Advanced
Technology Workshop on Flip Chip Technology and the General Chair of the IMAPS 3rd International Advanced Technology Workshop on Flip Chip Technology. Dr. Baldwin was
the recipient of the ASME Electrical and Electronics Packaging Division's Outstanding Young Engineer Award, 1998 and the Milton C. Shaw Outstanding Young Manufacturing
Engineer Award, Society of Manufacturing Engineers, 1999. He has sixteen years of experience in the electronics manufacturing and packaging industries, eight U.S. Patents,
over 230 scholarly publications, and expertise in electronics packaging, MEMS packaging, advanced materials processing and manufacturing systems design. Dr. Baldwin is apast President of the Surface Mount Technology Association (SMTA), and formerly on the Board of Advisors for the Society of Manufacturing Engineers/Electronics Manufacturing
Division (SME/EM). He was on the editorial advisor board of Advanced Packaging magazine and HDI magazine. He is on the Board of Directors of Engent, Inc. and Akrometrix,
LLC, and the Board of Advisors for IC Interconnect. Dr. Baldwin was also on the technical Board of Advisors of RFIDentics Corp. which was acquired by Avery Dennison Corp.

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7

PDC6: Fundamentals of Glass Technology and Applications for Advanced Semiconductor Packaging
Course Leader: TJ Kiczenski, Corning, Inc.

Course Description:
The objective of this course is to build a foundation of understanding of engineered glass as a material that technologists can leverage in the development ofadvanced IC packaging applications. Starting from the fundamental principles of glass structure, composition and properties we will provide a broad
overview of glass with a focus on unique attributes that make glass as an enabling material. Subjects to be covered will include strength and reliability,
chemical durability, thermal behavior, associated thermal relaxation behavior, and electrical properties. Additionally we will review the platform alternatives
as part of the "glass toolkit" available to semiconductor packaging development including various manufacturing (melt & form) approaches, the diversity ofcompositional options and a survey of glass processing options that can be adapted from adjacent glass technology space to advanced semiconductor
packaging. Finally the course will illustrate with case studies how glass is contributing to emerging 3D-IC technologies and explore current and potential
applications in advanced semiconductor packaging. We will focus on its role as a carrier for temporary bonding, integrated wafer for CMOS Image Sensor,
and 2.5D and 3D glass interposers. Relative costs of glass will be discussed as an alternative to other materials for carriers and interposers.
Who Should Attend?
The target audiences include individuals or companies with little or no experience in using glass. Engineers, technical managers, scientists, buyers, andmanagers involved in materials, research and development, and 3D IC packaging.
Dr. TJ Kiczenski is a Research Associate with Corning Incorporated. His work includes investigations of the physics of glass relaxation, liquidus relationships in multicomponent
glass forming systems, metallic glasses, and glass/glass and glass/ceramic composite materials. He is credited as the inventor or co-inventor of several Corning Display
Technology products manufactured by the proprietary fusion process, including Corning Lotus Glass for low-temperature polysilicon display applications. He received his PhD in
Geology and M.S. in Materials Science from Stanford University where he investigated the structure of fluorine in silicate and aluminosilicate glasses and his B.A. degree inPhysics from Coe College where he studied alkali-germanate glasses. Aric Shorey, PhD, is a Sr. Technical Manager at Corning Incorporated working on the Semiconductor Glass
Wafer program. He has BS/MS in Mechanical Engineering and a PhD in Materials Science - all from the University of Rochester. He has spent the majority of his career inmaterial's finishing and characterization for the telecommunications, precision optics and semiconductor industries.

PDC7: Polymers for Electronic Packaging
Course Leader: Jeffrey Gotro, InnoCentrix, LLC

Course Description:
This course will provide a broad overview of polymers and the important structure-property-process-performance relationships for electronic packaging.
Topics to be covered are thermosetting polymers versus thermoplastics, thermosetting polymer curing, curing mechanisms (heat and light cured), network
formation, and an overview of key chemistries used (epoxies, acrylates, polyimides, bismaleimides, curing agents, and catalysts). The course will provide amore in-depth discussion of the chemistries, material properties, and process considerations for adhesives (both paste and film), capillary underfills,
packaging substrate materials, encapsulants (mold compounds), and coatings. In most cases, adhesives, underfills, mold compounds and coatings areapplied as a viscous liquid and then cured. The flow properties are critical to performance in high volume manufacturing. The final portion of the PDC will
provide an introduction to rheological characterization methods (various types of rheometers and viscometers) and the properties of adhesives (shear
thinning, viscosity, time dependence, rheology changes during curing), underfills, and mold compounds.
Who Should Attend?
Packaging engineers and R&D professionals involved in the development, production, and reliability testing of semiconductor packages would benefit fromthe course.
Dr. Jeffrey Gotro has over twenty-six years experience in polymers for electronic applications and composites having held scientific and leadership positions at IBM, AlliedSignal,
Honeywell, and Ablestik Laboratories. He is an accomplished technology professional with demonstrated success solving complex polymer problems, directing new productdevelopment, and enabling clients to improve the financial impact of their polymer technologies. Jeff has consulting experience with companies ranging from early-stage start-ups
to Fortune 50 companies. Jeff is a nationally recognized authority in thermosetting polymers and he has received invitations to present lectures and short courses at national
technical conferences. He has published 60 technical papers (including 4 book chapters) in the field of polymeric materials for advanced electronic packaging applications, holds
13 issued US patents, and has 8 patents pending. Jeff has a Ph.D. in Materials Science from Northwestern University with a specialty in polymer science and a B.S. in MechanicalEngineering/Materials Science from Marquette University.

PDC8: Thermal and Mechanical Simulation Techniques - An Introductory Course for 3D Enablement
Professionals

Course Leader: Kamal Karimanal, Cielution LLC

Course Description:
The industry is becoming increasingly aware of the fact that thermal and mechanical factors are crucial hurdles to the realization of TSV based 3
Dimensionally stacked IC products. These challenges are pervasively felt at all stages of the product development cycle starting from Layout, IC design,
power management, assembly processing strategy, package design, and testing. Due to the need to narrow down from a myriad of costly choices even prior
to test chip or prototype development, engineering simulation is an important tool at the disposal of the engineer. As a result, engineers from all IC design
and packaging background who are tasked with the responsibility of enabling 3D ICs are interested in utilizing thermal and mechanical simulation. This is an
introductory course on thermal and mechanical simulation techniques pertaining to 3D Through Silicon Stacking meant for engineering professionals
involved in the enablement of TSV based 3D stacked SOCs. Thermal Modeling Techniques: Steady-State, Transient, Detailed and Compact. Modeling
Tools and Techniques for 3D IC Thermal Management. Overview of mechanical challenges to 3D stacking: warpage, assembly Yield, CPI effects on Yield &reliability Mechanical Modeling Tools and Techniques for Technology development and Reliability. Mobility/stress distribution: Contributions from package,
TSV and devices.
Who Should Attend?
Any Engineering professional involved in 3D enablement with interest in the Thermal and mechanical challenges. Also suited for technologists andmanagers interested in deploying engineering simulation as a strategic tool for understanding thermo-mechanical feasibility, risks and benefits of costly
technological investments related to 3D TSV based products.
Kamal Karimanal is the Founder of Cielution LLC, which is an engineering simulation software and services company serving the electronics supply chain. Prior to starting
Cielution, Dr. Karimanal has served in several engineering simulation focused roles at Fluent Inc, ANSYS Inc and Globalfoundries. Dr. Karimanal has contributed to several
detailed and compact modeling methodologies which are being widely used by the electronics industry today. He has written several conference and journal papers and online
application notes. Dr. Karimanal received his Ph. D in Mechanical Engineering from The University of Texas at Austin.

8

PDC9: MEMS Reliability and Packaging

Course Leader: Slobodan Petrovic, Oregon Institute of Technology
Course Description:
This course provides a comprehensive discussion of a broad array of MEMS packaging and reliability issues. An overview of the principles of operation,
fabrication methods, and materials used in building MEMS structures will be presented as well. Because each MEMS device requires a distinctive packaging
approach, practical examples and illustrations will be used to demonstrate uniqueness of solutions and interactions between micromachined structures andpackaging. A full range of MEMS devices will be discussed while a particular emphasis will be placed on sensors and actuators used in industrial, medical,
and automotive applications. Extensive case studies that will be used to most effectively demonstrate diverse packaging principles for devices such as
accelerometers, pressure sensors, and digital micromirror devices. The course will be divided in 2 major sections: general MEMS competence; andpackaging and reliability. The following major topics will be covered: fabrication technologies, materials, design and device physics, main MEMS types,
integration aspects, selected industrial application, design considerations, types of packaging, quality control, reliability and failure analysis.
Who Should Attend?
While some prior knowledge by the participants of MEMS in general is helpful, the packaging discussion will include a detailed explanation of the principles
of operation, fabrication methods, and materials used in building MEMS structures. The course is therefore open to participants with no prior MEMS
knowledge and would provide a reasonably broad general introduction into the field. The participants will have the opportunity to gain knowledge about
MEMS in general through the eyes of a packaging and reliability specialist.
Dr. Slobodan Petrovic is an associate professor at the Oregon Institute of Technology in Portland, OR. His research interests are in the areas of MEMS fuel cells, sensor media
compatibility, hydrogen generation and storage, and dye-sensitized solar cells. Prior to that, he was at the Arizona State University, where he taught courses in MEMS, Sensors,
and alternative energy. Dr. Petrovic also held appointments at Clear Edge Power as a Vice President of Engineering; at Neah Power Systems as Director of Systems Integration;and Motorola, Inc. as a Reliability Manager. Dr. Petrovic has over 25 years of experience in MEMS, sensors, energy systems; fuel cells and batteries; and electrochemical solar
cells. He has over 50 journal publications and conference proceedings; 2 book contributions and 24 pending or issued patents.

PDC10: Basics of Conventional and Advanced Packaging

Course Leader: Syed Sajid Ahmad, Center for Nanoscale Science and Engineering, NDSU
Course Description:
The course presents manufacturing, materials, quality and reliability info in terms understandable to engineering and non-engineering personnel. Packaging
characteristics and drivers will be outlined. Types of packages and critical differences among them and their applications will be discussed. The course will
look at the design selection to meet use and application environments. Step-by step manufacturing flow for plastic packages will be presented as an
example to understand the complexity of processes, materials and equipment involved in their manufacture. Advanced packaging will be introduced.
Materials selection with respect to application environments will be discussed. Quality and reliability issues related to chip packaging and SMT and theirsolution will be outlined. Topics: Packaging characteristics and drivers. Types of packages and critical differences among them. Design selection to meet
use and application environment. Step-by step manufacturing flow for plastic packages. Advanced packaging. Materials selection. Quality and reliability
issues.
Who Should Attend?
It will help the attendees understand the effects of package configurations on their work and the effect of their work on chip packages. Personnel entering
the packaging field will have a critical look at the quality, reliability and materials issues related to the development and manufacture of chip pacakages. Nonpackaging personnel will learn ins and outs of chip packaging. Non-technical personnel will learn the material and manufacturing intricacies of simple looking
chip packages.
Syed Sajid Ahmad contributed to quality and reliability enhancement of assembly processes at Intel (1979-89), especially wire bond. Ahmad also contributed to packaging
development at National Semiconductor (1990) and managed quality at GigaBit/TriQuint (1990-91). His major work at Micron Technology (1991-2003) involved the development
and implementation of advanced packaging. At the Center for Nanoscale Science and Engineering, Ahmad's focus is on enhancing research and manufacturing capabilities in theareas of thin film, thick film, chip scale packaging (CSP) and surface mount technology (SMT). Ahmad has 34 international publications & presentations and holds 54 patents.

9DPC/GBC Premier Sponsors:

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TUESDAY, MARCH 12, 2013

Morning Technical Sessions

7:00 am – 7:00 pm

Registration

7:00 am – 8:00 am

Continental Breakfast

8:00 am – 8:20 am

OPENING COMMENTS
KEYNOTE – 3D Packaging

8:20 am – 9:05 am

2.5 and 3D - Scaling Walls

Dr. Sitaram R. Arkalgud, Vice President of 3D Technology
INVENSAS CORPORATION

Abstract: Stacking chips, either on a 2.5D interposer or in true 3D ICs, is an industry game changer since it promises the benefits of higher performance, functionality and density at lower power
consumption. With advent of the first 2.5D products in volume production, the need to reduce cost, particularly for consumer applications, is gaining prominence. Lithographic scaling has driven
performance and cost vectors in the semiconductor industry for decades. Comprehensive models, developed to understand the impact of scaling on device performance, reliability and cost,make it easier to develop scaling roadmaps. In a similar fashion, credible models for 3D interconnects are critical, since these will underpin the development of future 3D technology “nodes” byproviding performance and cost estimates. The roadmaps, in turn, will drive the development of materials, equipment, EDA tools and products. This presentation will examine some of the nearterm manufacturability concerns as well as key areas for 3D scaling, together with the electrical and thermo-mechanical challenges that accompany them.
Dr. Sitaram R. Arkalgud is Vice President of 3D Technology at Invensas Corporation, a complete Interconnectology solutions provider for advanced mobile applications. Previously, Arkalgud
started and led 3D IC development at SEMATECH, where the focus was on delivering manufacturable process technologies for 3D interconnects. In addition, he has worked in a variety of roles
spanning R&D and manufacturing in memory and logic technologies at Infineon/Qimonda and Motorola. Arkalgud holds a doctorate and master’s degree in materials engineering from Rensselaer
Polytechnic Institute in Troy, NY, and a bachelor’s degree in metallurgical engineering from Karnataka Regional Engineering College, Suratkal, India. He is the author of several publications andholds 14 U.S. patents.

KEYNOTE – Flip Chip & Wafer Level Packaging

9:10 am – 9:55 am

Semiconductor Packaging Trends and Materials Challenges

Dr. Mahadevan “Devan” Iyer, Director of Worldwide Semiconductor Packaging operations
TEXAS INSTRUMENTS

Abstract: Semiconductor advancements continue to enable many new applications to enable the Internet of Things, and transform areas such as cloud computing, health care, safety andsecurity, and consumer electronics. As exciting new capabilities emerge, customers are demanding smaller, thinner, faster and more power efficient solutions. In his keynote presentation, Dr.
Mahadevan “Devan” Iyer will discuss these trends, and how packaging technology is playing an increasingly important role in delivering these benefits in IC products. Dr. Iyer will outline thematerials requirements and challenges for increased electrical, thermal and reliability performance.
As Director of TI’s Worldwide Semiconductor Packaging operations, Dr. Mahadevan “Devan” Iyer, oversees a global team that drives a process to determine the packaging design andtechnologies that best meet the requirements of our customers in measures of miniaturization, performance cycle time, and cost. Dr. Iyer joined TI in 2008 to lead the global SC Packaging team.
He has more than 25 years of experience in the microelectronics industry. Dr. Iyer is a recognized authority in semiconductor packaging technologies. He has more than 150 technicalpublications and 28 patents to his credit.

10:00 am – 10:30 am

Break in Exhibit Hall

10:00 am – 7:00 pm

Exhibition and Technology Showcase
Advanced 3D Packaging

10:30 am – 11:00 am

11:00 am – 11:30 am

12:00 pm -12:30 pm

TA2:
Flip Chip & Cu Pillar Assembly Reliability
Chairs: Andrew Strandjord, Pac Tech-USA
Alan Huffman, RTI International

TA3:
MEMS Devices and Processes
Chairs: Tracy Hudson, U. S. Army AMRDEC; PhilipReiner, CGI Federal Systems

Cost Drivers for 2.5D and 3D Applications

Reliability of Die to Wafer Bonding Using Copper-Tin
Interconnections

Control Strategies and Trade-Offs for Micromachined
Vibratory Gyroscopes with High Quality Factors

Thermal Modeling Approach for Enhancing TCNCP
Process for Manufacturing Fine Pitch Copper Pillar
Flip Chip Packages

MEMS Parallel Plate Actuator Pull-in Detection and
Mitigation

Groove Geometry and Mold Shrinkage Effects on Die
Stress in Flip Chip Molded BGAs (FCMBGA)

Design, Simulation and Testing of High Density, High
Current Micro-machined Embedded Capacitors

Chet Palesko, SavanSys Solutions LLC (E. Jan Vardaman
TechSearch International, Inc.; Alan Palesko, SavanSys
Solutions LLC)

Stacked 3d Package with Improved Bandwidth andPower Efficiency

ChipsetT: Embedded Die Substrate Applications

Jon Aday, FlipChip International, LLC (Ted Tessier,
FlipChip International; Kazuhisa Itoi, Satoshi Okude,
Fujikura Ltd.)

Arnaud Garnier, CEA-LETI, MINATEC (Rémi Franiatte
David Bouchu, Romain Anciant, Séverine Chéramy)

Siddharth Bhopte, Amkor Technology (Jesse Galloway,
Kyung-Rok Park, Hyun-Jin Park, Jeong-Han Choi, Ho-Beob
Yu, Sung-Hwan Yang)

Bora Baloglu, Amkor Technology (Miguel Jimarez
Ahmer Syed)

Integration of Passive Components into 3D PoP
Fan-Out Packages

Igor Prikhodko, University of California, Irvine (Alexander
Trusov, Andrei Shkel)

Colin Stevens, Auburn University (Robert Dean)

Aubrey Beal, Auburn University (C. Stevens, T. Baginski, M.
Hamilton, R. Dean)

Flip-Chip Bonding of Au-Au MEMS

Joe Sanford, UTARI - University of Texas Arlington ResearchInstitute (Dan Popa)

Tom Strothmann, STATSChipPAC

12:30 pm – 2:00 pm

MEMS & Microsystems

TA1:
3D Packaging Applications
Chairs: Peter Ramm, Fraunhofer EMFT;Franck Murray, IPDIA

Dev Gupta, APSTL LLC

11:30 am – 12:00 pm

Flip Chip & Wafer Level Packaging

Lunch Break in Exhibit Hall
(Food served from 12:30 pm - 1:30 pm)

11

Exhibition and Technology Showcase:
Tuesday, March 12th
10:00 am - 7:00 pm
Wednesday, March 13th
12:30 pm - 4:30 pm

TUESDAY, MARCH 12, 2013

Afternoon Technical Sessions

Advanced 3D Packaging

2:00 pm - 2:30 pm

Flip Chip & Wafer Level Packaging

TP1:
2.5D Interposer Packages
Chair: Cristina Chu, TEL NEXX; Alan Huffman,
RTI International

TP2:
Topics in Bump and Die Interconnect
Chairs: Gilles Poupon, LETI; Luu Nguyen, Texas
Instruments

TP3:
MEMS Packaging and Testing
Chairs: Russell Shumway, Amkor Technology;
Robert Dean, Auburn University

Assembly Challenges and Learnings for Large
2.5D TSV Products

Development of Plating Process for Micro Bump
Formation

Sealing Dispensing Requirements to Meet MEMS
Packaging and Throughput Impact

3D Integration of System-in-Package (SiP):
Toward SiP-Interposer-SiP for High-End
Electronics

Production of Uniform Dimension Copper Pillars for
Flip Chip CSP

Microfluidic Technology Using SU8 on Top of PCBs

Novel Low-Loss Photodefined Electrical TSVs for
Silicon Interposers

Development of Thick Resist for Bumping

Characterization of Aluminum-Germanium Wafer
Bonding for MEMS Packaging

Michael Kelly, Amkor Technology (Marnie Mattei, Rick
Reed)

2:30 pm - 3:00 pm

Takuma Katase, Mitsubishi Materials Corporation (Koji
Tatsumi, Tekeshi Hatta, Masayuki Ishikawa, Akihiro Masuda)

Rabindra Das, Endicott Interconnect Technologies, Inc.
(Frank Egitto, Steven Rosser, Erich Kopp, Barry Bonitz)

3:00 pm – 3:30 pm

Paragkumar Thadesar, Georgia Institute of Technology(Muhannad Bakir)

4:45 pm – 5:15 pm

Polymer Based Interposer with Si Matched CTE
Karen Shrier, Electronics Polymer Newco Inc

Stefan Gassmann, University of Rostock (Lienhard Pagel)

Sumant Sood, SUSS MicroTec (Robert Hergert, Oliver,
Oliver Treichel, Sean Peng, Mars Chuang)

Semiconductor Fluxes for Wafer Bumping in 3D
Assembly

CoC (Chip on Chip) or FtoF (Face to Face) PossumTM Technology for 3D MEMS and ASIC
Eliminating the Need of TSV or Wire Bonding

Jemmy Sutanto, Amkor Technology (D. H. Kang, J. H. Yoon,
K. S. Oh, Michael Oh, Amkor Technology Korea; R.
Lanzone, R. Huemoeller, Amkor Technology)

Ultra High Density Capacitors Merged withThrough Silicon Vias to Enhance Performances.

Fabrication of Double-Helix Contacts: Compliant
Interconnect Structures for Reworkability

Package Level Self-Test System for Electronic
Compass

3D Packaging- Through Glass Vias TGV with
Alkali Free Glass for Advanced Packaging

Micro-tube Insertion into Aluminum Pads: Simulationand Experimental Validations

A Design Tool Fully Adapted to the Development of
the Thin Film Encapsulation Used for MEMS Devices

Vern Stygar, AGC (Tim Mobley, Shintarou Takahashi)

5:45 pm – 7:00 pm

Jim Chung, JSR Micro, Inc.

Maria Durham, Indium Corporation (Laura Mauer, Solid State
Equipment Corp.; Andy Mackie, Indium Corporation)

Catherine Bunel, IPDIA

5:15 pm – 5:45 pm

Stephen Kenny, Atotech Germany (Kai Matejat, Carsten
Schauer, Sven Lamprecht)

Heakyoung Park, Nordson ASYMTEKBreak in Exhibit Hall

3:30 pm – 4:15 pm
4:15 pm - 4:45 pm

MEMS & Microsystems

Alexander Pfeiffenberger, Auburn University (Michael
Hamilton)

Alexis Bedoin, CEA- LETI, MINATEC (B. Goubault deBrugiere, F. Marion, F. Berger, M. Fendler, M. Volpert, H.
Ribot)

Dario Paci, STMicroelectronics

Souchon Frederic, CEA-LETI, MINATEC (Gervais AnneCharlotte, Thouy Laurent, Saint-Patrice Damien, Pornin JeanLouis)

Reception in Exhibit Hall

Panel Discussion: Flip Chip & Wafer Level Packaging
Moderator: Linda Bal, Freescale; Luu Nguyen, Texas Instruments
7:00 pm – 8:30 pm

Panel Members:

Miguel Jimarez, Amkor Technology, Inc.;John Hunt, ASE USA;
Raj Pendse, STATSChipPAC;
Additional panelists to be announced soon

A SPECIAL THANKSTO THE DEVICE PACKAGING SPONSORS!
YOU ARE THE “GAS” FOR THE IMAPS ENGINE!

12WEDNESDAY, MARCH 13, 2013

Morning Technical Sessions

7:00 am – 6:00 pm

Registration

7:00 am – 8:00 am

Continental Breakfast

8:00 am – 8:45 am

KEYNOTE – MEMS

MEMS and MEMS Packaging for High Temperature and Other Harsh Environments
Dr. F. Patrick McCluskey, Associate Professor
UNIVERSITY OF MARYLAND

Abstract: Recent advances in Microelectromechanical systems (MEMS) technology have resulted in relatively low cost MEMS gyroscopes. Their unique features compared to macro-scale
devices have made them popular in many applications. Nowadays, MEMS gyroscopes are lighter, smaller and consume less power and therefore, are considered to be the best low-cost
solution compared to spinning disk or wheel type mechanical gyroscopes. These low-cost MEMS gyroscopes have opened up a wide variety of applications with environmental conditions
ranging from mild-to-harsh. Many of these harsh environments include high temperature, high humidity, high-G mechanical shock/drop, high-frequency mechanical vibration and high frequency
acoustic noise. This web seminar will review the studies conducted to understand the effect of such harsh environment on MEMS gyroscopes. It also examines the effects of an elevatedtemperature and sustained exposure to temperature combined humidity on the MEMS vibratory gyroscope.
Dr. Patrick McCluskey is an Associate Professor of Mechanical Engineering at the University of Maryland, College Park. He is associated with the CALCE center where he is the principal
investigator for projects related to packaging and reliability of electronic components for high power and high temperature environments. He is the author or co-author of over 100 technicalarticles on his research, and the co-author of three books. He has served as the technical program chair for several symposia and conferences in these research areas. He is a fellow of IMAPS
and is a member of ASME, IEEE, and SAE.

KEYNOTE – LEDs

8:45 am – 9:30 am

Packaging Innovation: The Key to the Future of Solid State Lighting
Robert F. Karlicek, Jr., Professor & Director, Smart Lighting Engineering Research Center
RENSSELAER POLYTECHNIC INSTITUTE

Abstract: LED technology development has progressed very rapidly since the first lighting class blue LEDs were introduced more than 20 years ago. Today, LED chip performance for solidstate lighting is closing in on theoretical limits of performance and high volume manufacturing of LED devices for solid state lighting is rapidly driving down die prices. Increasingly, barriers todelivering cost effective high performance solid state lighting are driven by the limitations of conventional LED packaging technologies where optical management adds complexity toconventional packaging methods and the limitations of conventional pick and place technology add barriers to cost reduction. New approaches to LED packaging are borrowing tricks fromstate-of-the-art silicon device packaging methods, and continued packaging innovation is required to realize the full potential of solid state lighting. This talk reviews the status of LED lightingfrom the chip, packaging and lighting system perspective, and describes some key areas where packaging innovation is still required to drive adoption of solid state lighting systems.
Dr. Robert F. Karlicek, Jr. is the Director of the Smart Lighting Engineering Research Center at Rensselaer Polytechnic Institute, an NSF and industry funded program exploring advanced
applications for next generation solid state lighting systems. Prior to joining RPI, he spent over 30 years in industrial research and R&D management positions with corporations including AT&T
Bell Labs, EMCORE, General Electric, Gore Photonics, Microsemi, Luminus Devices and SolidUV. Dr. Karlicek is well known globally as an LED industry expert, and is a frequent presenter atconferences and workshops. He obtained his Ph.D. in Physical Chemistry from the University of Pittsburgh and has over 40 published technical papers and 26 U.S. patents.

Break in Foyer

9:30 am – 10:00 am
Advanced 3D Packaging

10:00 am - 10:30 am

WA2:
Substrate Effects and Materials
Chairs: Lars Boettcher, Fraunhofer IZM; Linda Bal,
Freescale

WA3:
Packaging for Advanced LED SSL Systems
Chairs: Thomas Goodman, E&G Technology Partners;
Bob Karlicek, Rensselaer Polytechnic Institute

Precision Glass Carriers and Metrology for Wafer
Thinning Operations

Effect of Substrate Layer Variation on Package
Warpage

LEDs for SSL - Market Trends, Drivers, andApplications

Temporary and Permanent Adhesives for Thin
Wafer Handling and Assembly

From Mechanical Adhesion to Chemical Adhesion:
Challenges in Obtaining Sufficient Adhesion Between
Electroless Copper and Dielectrics

A Solder Joint Reliability Model for the Philips
Lumileds LUXEON Rebel LED Carrier Using Physics
of Failure Methodology

Adopt advanced RDL Rule to Apply Flip Chip
Packaging for Next Generation Si Technology:
Feasibility Study

Lithography for Wafer Level Packaging for LED
Manufacturing

Direct Palladium-Gold on Copper as a Surface Finish
for Next Generation Packages

Advanced Passive Thermal Management for LED Bulb
Systems

Mark Oliver, Dow Electronic Materials (Jong-Uk Kim,
Zidong Wang, Janet Okada, Elissei Iagodkine,
Anupam Choubey, Ed Anzures, David Fleming, Avin
Dhoble, Chi Truong, Michael Gallagher; Kai Zoschke,
Matthias Wegner, Michael Töpper, Fraunhofer IZM)

11:00 am - 11:30 am

Versatile Z-Axis Interconnection for High
Performance Electronics

Rabindra Das, Endicott Interconnect Technologies, Inc.
(J. M. Lauffer, F.D. Egitto)

11:30 am - 12:00 pm

Electrografted Insulator Layer as Copper Diffusion
Barrier for TSV Interposers
Vincent Mevellec, ALCHIMER (Dominique Suhr, Thomas
Dequivre, Frederique Raynal)

12:00 pm - 12:30 pm

LED Packaging for Future Solid-State Lighting

WA1:
Substrates & Materials for 3D IC Processing
Chairs: Jeff Calvert, Dow Chemicals;
Phil Garrou, Microelectronic Consultants of NC

Aric Shorey, Corning Inc. (Bor-Kai Wang, Joe Canale,
Windsor Thomas)

10:30 am - 11:00 am

Flip Chip & Wafer Level Packaging

Brendan Wells, Amkor Technology (Wei Lin, HyunJin Park)

Robin Taylor, Atotech USA (Meng Hsieh, Ellina Libman, Lutz
Brandt)Shengmin Wen, Amkor Technology (KyungRok Park, Patrick
Thompson, JeongSeok Lee, HyunJin Park)

Mustafa Özkök, Atotech (Sven Lamprecht, Gustavo Ramos,
Arnd Kilian)

Wafer Level Interconnects for 2.5D/3D Enroute to
Manufacturing
Sesh Ramaswami, Applied Materials

12:30 pm – 2:30 pm

Lunch in Exhibit Hall
(Food served from 12:30 pm - 1:30 pm)

12:00 pm – 4:30 pm

Exhibition and Technology Showcase

13

Vrinda Bhandarkar, PennWell / Strategies Unlimited

Greg Caswell, DfR Solutions (Rudi Hechfellner, Michiel
Kruger, Tewe Heemstra, Philips Lumileds; Nathan Blattau,
Gregg Kittlesen, Vikrant More, DfR Solutions)

Michael Hornung, SUSS MicroTec Lithography GmbHJames Petroski, Rambus

Post-Conference Presentations
USB Drives Sponsor:

Conference Badge
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3D Panel Discussion
Sponsor:WEDNESDAY, MARCH 13, 2013

Interactive Poster Sessions in Exhibit Hall
2:00 pm - 4:30 pm (Poster setup: 1:30 pm to 2:00 pm)

Posters

Development of Embedded High Power Electronics Modules for Automotive Applications
Lars Boettcher, Fraunhofer IZM (S. Karaszkiewicz, D. Manessis, A. Ostmann)
Development of Substrate Embedded Magnetics for DC-DC Buck Converters
Jeff Aggas, Auburn University (Aubrey Beal, Robert Dean)
Singulation Blades and Physics
Edward Perry, Kim & Ed PTE LTD Singapore
A Novel Silicone Material for 3D Flex Package with Multi Chips
Bo Zhang, Institute of Microelectronics Chinese Academy of Sciences (Wen Yin, Yuan Lu, Liao Anmou, Du Tianmin, Dongkai Shangguan, Lixi Wan)

IMAPS Microelectronics Foundation Spring Golf Invitational
Benefits the IMAPS Microelectronics Foundation

Thursday, March 14, 2013 | 1:15 pm - 7:00 pm
1:15 pm Shotgun Start - “Best Ball” Scramble

Desert Canyon Golf Club (www.desertcanyongolf.com)
Separate Registration - Sign up today: www.imaps.org/DevicePackaging/golf2013.htm
Foundation Golf Chair: David Virissimo, Coining Inc/Ametek | david.virissimo@ametek.com or 619-464-5430

Desert Canyon was named 2009 “Best Places to Play” by Golf Digest and has been voted “Best Public Golf Course” in Fountain Hills for six
consecutive years. A shuttle will pick up golfers at the Radisson Fort McDowell at 12:00 pm. Golfers will tee off shortly after arriving at thecourse. Golfers are welcome to drive themselves to arrive earlier. An awards presentation and reception will be held immediately following
golf. Special Awards and Activities tentatively planned: Closest to the Pin and Longest Drive

Sponsorship Opportunities Available, details online at www.imaps.org/DevicePackaging/golf2013.htm.
Premier Golf Sponsors:

Premier - "Eagle" Sponsor:

Premier - "Eagle" Sponsor:

Golf Hole Sponsors:

14

Premier - "Birdie" Sponsor:

WEDNESDAY, MARCH 13, 2013

Afternoon Technical Sessions

Advanced 3D Packaging

2:30 pm - 3:00 pm

3:00 pm - 3:30 pm

Flip Chip & Wafer Level Packaging

Advanced 3D Packaging 2

WP1:
Processing Challenges & Solutions for 3D
Packages
Chairs: Laura Mauer, Solid State Equipment
Corp.; Rozalia Beica, Lam Research

WP2:
Wafer Level Fan-Out Packages & Materials
Chairs: Eric Huenger, Dow Chemical; Curtis Zwenger,
Amkor

WP3:
Stress & Thermal Management in 3D IC Processing
Chairs: Gilles Poupon, CEA Leti; Keith Cooper,
SETNA

Fabrication of 3D-IC Interposers

Robust Reliability Performance of Large Size eWLB
(Fan-out WLP)A Process Dependent Warpage and Stress Model for
3D Packages Considering Incoming Die/Substrate
Warpage and Assembly Process Impacts

John Keech, Corning Inc. (Garret Piech, Scott Pollard)

Reliability and Performance Improvements of 3D
System-in-Packages in Fan-Out Wafer Level
Packaging

The Underfill-Microbump Interaction Mechanism in 3D
ICs: Impact and Mitigation of Induced Stresses

Through Si Vias Using Liquid Metal Conductors
for Re-workable 3D Electronics

Innovative 3D Structures Utilizing Wafer Level Fan-Out(WLFO) Technology

TSV Delamination Risk Reduction and Stress
Optimization through Improved Low-Temperature Cu
Anneal Process

George Hernandez, Auburn University (Daniel Martinez,
Stephen Patenaude, Charles Ellis, Michael Palmer,
Michael Hamilton)

Strain in Electroless Copper Films: Analysis by In
Situ X-Ray Diffraction and Curvature Methods

5:30 pm - 6:00 pm

Curtis Zwenger, Amkor Technology (JinYoung Khim, YoonJoo
Khim, SeWoong Cha, SeungJae Lee, JinHan Kim, Amkor
Technology, Korea)

Andrej Ivankovic, IMEC (V. Cherman, M. Gonzalez, K.J.
Rebibis, A. La Manna, G. Van der Plas, G. Wei, B.
Vandevelde, I. De Wolf, G. Beyer , E. Beyne, D. Vandepitte)

Fengda Sun, Semiconductor Manufacturing International(Guangyu Sun, Hongbo Zhao, Xiaojun Chen, Xuanjie Liu,
Xuejie Shi, He Huang)

A New Embedded Package Structure and Technology
for the Next Generation of WLP, the Wafer level FunOut Package - WFOP (TM)

Thermal & Mechanical Challenges for 3DIC Integration

Thermal Performance Evaluation of xFD Packages

Mani Sobhian, TEL NEXX

Development of a Low Residual Stress and High
Performance Dielectric for WLP (Wafer Level
Packaging) Applications

Copper, Nickel, and Lead-Free Solder
Electroplating Solutions for Pillar and Micro-Pillar
Capping Applications

Lead Free Paste with Under 3um Solder Particles forFine Pitch C4 Bumping and Pre-Coating Solder
Applications

Techniques and Tools for Collaborative Thermal andMechanical Modeling of 3D ICs

Simon Bamberg, Atotech Deutschland GmbH (Tobias
Bernhard ( Laurence Gregoriades, Frank Bruning, Ralf
Broening, Johannes Etzkorn, Wolfgang Friz, Michael
Merschky, Bruce Muir, Laura Perry, Tanu Sharma)

5:00 pm - 5:30 pm

Scott Hayes, Freescale (Tony Gong, Doug Mitchell,
Michael Vincent, Jason Wright, Yap Weng Foong)

Break in Exhibit Hall

4:00 pm – 4:30 pm
4:30 pm - 5:00 pm

Wei Lin, Amkor Technology (Ahmer Syed, KiWook Lee,
Karthikeyan Dhandapani)

Low Temperature MOCVD TiN Barrier Deposition
for High Aspect Ratio TSVs : A Solution for 3D
Integration
Thierry Mourier, CEA-LETI Minatec (Stephane Minoret,
Larissa Djomeni , Sylvain Maitrejean, Anne Roule,
Laurent Vandroux; Sabrina Fadloun, Steve Burgess,Andy Price, Chris Jones, SPTS Technologies SAS)

3:30 pm - 4:00 pm

Seung Wook Yoon, STATSChipPAC, Ltd.

Extending the Strip Window for Advanced
Packaging Photoresists

Séverine Chéramy, CEA-LETI

Akio Katsumata, J-Devices Corporation

Ron Zhang, Invensas Corporation (H. Shaba, J. Tseng, E.
Chau, W. Zohni, L. Mirkarimi)

Raymond Thibault, Dow Electronic Materials (Michael
Gallagher, Kevin Wang, Matthew Yonkey, Duane Romer,
Xiang Qian Liu, Kim Ho, Greg Prokopowicz, Joe Lachowski,
Mark Oliver, Eric Huenger, Seiji Inaoka, Scott Kisting, Lynne
Mills, Sue McNamara, Rosemary Bell)

Julia Woertink, Dow Electronic Materials (ErikReddington, Inho Lee, Yi Qin, Jonathan Prange, Pedro
Lopez Montesinos, Jui-Ching Lin, Masaaki Imanari,
Jianwei Dong, Wataru Tachikawa, Jeff Calvert)

Hironori Uno, Mitsubishi Materials Corporation (Masayuki
Ishikawa, Akihiro Masuda, Hiroki Muraoka, Kanji Kuba)

Kamal Karimanal, Cielution LLC

Panel Discussion: 3D Integration - Applications and Production Challenges

6:00 pm – 7:30 pm

Please join us for an interactive panel discussion on 3D Integration - Applications and Production Challenges. An executive panel has been assembled from several of
the leading microelectronics organizations from around the world to discuss the latest applications, trends in the industry, challenges, reliability, and production
readiness. The panel will be soliciting questions from the audience.
Moderators: Rozalia Beica, Lam Research AG; Peter Ramm, Fraunhofer EMFT
Panelists: Sitaram Arkalgud, Invensas; Rich Rise, ASE US; Arif Rahman, Altera
Additional panelists to be announced soon

Hotel Deadline: February 8, 2013

Rates and availability will not be guaranteed after the deadline – www.imaps.org/devicepackaging

Early Registration Deadline: February 8, 2013
All registration fees increase after the deadline.

$100 “Combo” Discount:

When you register for the "Combo Registration" for Device Packaging & the Global Business Council Conference (GBC).
15

THURSDAY, MARCH 14, 2013

Technical Sessions

7:00 am – 11:30 am

Registration

7:00 am – 8:00 am

Continental Breakfast

8:00 am – 8:45 am

KEYNOTE – 3D

2.5 D Options: Organic Vs. Silicon.Vs Glass; Technologies, Costs and Applications
Dr. Rao R .Tummala, Director PRC
GEORGIA INSTITUTE OF TECHNOLOGY

Abstract: Transistor scaling, starting with the invention of transistor in 1940s, made electronics the largest global industry, serving a variety of individual industries that span computing,communications, consumer, automotive and others . A new industry that integrates all these into so-called Smart Mobile Systems promises to be the next frontier in electronics hardware,
performing every imaginable function in smallest size and lowest cost that every global person could afford. Such revolutionary systems, however, require revolutionary technologies referred toas system scaling, in contrast to transistor scaling during the last 60 years. Current hardware approaches based on organic laminates has four main limitations: 1) lithographic ground rules, 2)
thermal performance, 3) mismatch in TCE-driven, and moisture-driven reliabilities, and 4) warpage, as these are processed as ultra-thin packages. Inorganic packages such as Glass or Siliconaddress these fundamental problems. These can be combined appropriately and selectively with ultra-thin and special polymers as dielectrics, liners and stress-relief members. This
presentation will try to clarify the role and regimes of each of these organic, silicon and glass interposers for 2.5 and 3D applications.
Professor Rao Tummala is a Distinguished and Endowed Chair Professor, and Founding Director of NSF ERC, called PRC at Georgia Tech, known as the world’s premier systems packaging
Center pioneering System Scaling technologies, producing the most cross-disciplinary engineers and transferring both to global industry. Prior to joining Georgia Tech, he was an IBM Fellow,
pioneering the first plasma display and low temperature co-fired(LTCC) multichip electronics for mainframes and servers. Prof. Tummala published about 500 technical papers, holds 90
patents and inventions; authored the first modern Microelectronics Packaging Handbook, the first undergrad textbook, “Fundamentals of Microsystems Packaging”, and first book introducing the
System-On-Package technology. His Georgia Tech PRC Center is considered the number 1 Academic Center having produced more than 1000 Ph.D, MS and BS students, 2000 publications
and collaborating with more than 100 companies in US, Europe, Japan and Korea. He is a Fellow of IEEE, and a member of National Academy of Engineering in US and India . He was a past
President of IEEE-CPMT and the IMAPS Societies.

KEYNOTE – 3D

8:45 am – 9:30 am

Future of Package for Computing Electronics

Ram S. Viswanath, Assembly Technology Planning and Pathfinding
INTEL CORPORATION

Abstract: Computing, communication and entertainment media have rapidly converged creating a wide range of "smart" devices, driven by the Internet and the need and desire to be "always
connected." New device categories are emerging at a rapid pace to bring computing experiences into every aspect of our lives. Consumers are demanding consistency and interoperability
across all of their devices, from phone to PC to tablet to TV to gadget, making computing a seamless experience regardless of where you are, what you are doing or what your needs at the time
may be. This computing continuum or convergence is predicted to result in more than 10B connected devices by 2015 with significant challenges and opportunities for microelectronic
packaging. This presentation will focus on explaining these challenges and potential future solutions with regard to increased demand for memory bandwidth, multi functionality, and higher
wiring density to meet the Si scaling requirements, thinner and smaller form factors, multi-chip and embedded packaging while also addressing the challenges associated with demand for lower
cost and environmental sustainability.
Ram Viswanath leads the Package Architecture and Technology Definition for all Intel products. He has been with the Assembly and Test Technology organization for the past twenty years.
His recent focus is in developing ultra thin small form factor packaging for mobile computing and high performance interconnects for server CPU’s. He has numerous patents in the areas ofthermal sciences, sockets, high speed interconnects and 3D packaging. Ram received his doctorate from Rutgers University in Mechanical and Aerospace Engineering.

Break in Foyer

9:30 am – 9:45 am
Advanced 3D Packaging

9:45 am – 10:15 am

Flip Chip & Wafer Level Packaging

THA1:
Reliability Considerations in 3D Packaging
Chairs: Severine Cheramy, CEA Leti;
James Lu, Rensselaer Polytechnic Institute

THA2:
Applications of FC & WLP Packages
Chairs: Scott Hayes, Freescale; Jon Aday, FlipChip
International

THA3:
3D and WLP Metrology & Inspection
Chairs: Jianwei Dong, Dow Chemicals; Rozalia
Beica, Lam ResearchIntegration, Electrical Performance and Reliability
Investigation of TSVHigh Reliability Fine Pitch WLCSPMulti-Scale Materials Data for 3D TSV Stack
Performance Simulation and Model Validation

The Reliability Study of a High Density Multi Chip
Packaging with Folding Flexible Substrate

RF Devices: from WLSCP to Smart Interposers

Yin Wen, Inst. of Micro., Chinese Academy of Sciences(Bo Zhang, Yuan Lu, Liao Anmou, Du Tianmin, Lixi Wan)

Yann Lamy, CEA-LETI (O. El Bouayadi, C. Ferrandon, S.
Joblot, A. Jouve, L. Dussopt, T. Lacrevaz, C. Bermond, B.
Flachet, G. Simon)

Ultra-Fine Pitch Package on Package Solution forHigh Bandwidth Mobile Applications

Electrical Characterization on a High-Speed WaferLevel Package

Discover, Analyze and Monitor Yield-limiting Eventsin a WLP process

Overview of Critical 3D Integration Challenges toBring Products to Market

Advanced Microelectronics Packaging Solutions for
Miniaturized Medical Devices

An Innovative 2.5D IC Interconnection Reliability
SystemShih-Wei Lee, National Chiao Tung University (Yu-Chen
Hu, Cheng-Hao Chiang, Kuo-Hua Chen, Chi-Tsung Chiu,
Ching-Te Chuang, Wei Hwang, Jin-Chern Chiou, Ho-Ming
Tong, Kuan-Neng Chen)

10:15 am – 10:45 am

10:45 am – 11:15 pm

Rajesh Katkar, Invensas Corp. (Zhijun Zhao, Ron Zhang,
Rey Co, Laura Mirkarimi)

11:15 am – 11:45 am

Douglas Coolbaugh, University of Albany, College Of
Nanoscale Science and Engineering (Daniel Pascual,Colin McDonough, Joseph Piccirillo Jr., Michael Liehr)

11:45 am – 12:00 pm
1:15 pm – 7:00 pm

Advanced 3D Packaging 2

David Lawhead, FlipChip International (Ronnie Yazzie, Tony
Curtis, Guy Burgess, Ted Tessier)Kai Liu, STATSChipPAC (YongTaek Lee, HyunTai Kim,
MaPhooPwint Hlaing, Susan Park, Billy Ahn)

Rabindra Das, Endicott Interconnect Technologies (Steven
Rosser, Frank Egitto)

Ehrenfried Zschech, Fraunhofer IZFP (Kong Boon Yeap,
Christoph Sander, Uwe Mohle, Fraunhofer IZFP-D;
Valeriy Sukharev, Mentor Graphics)

Metrology and Inspection of 3D IC TSV Integration
Processes
G. Fresquet , Fogale NANOTECH

Reza Asgari, Rudolph Technologies

Doug Goodman, Ridgetop Group (Andrew Levy , Hans
Manhaeve, Ridgetop; Ed McBain, ALLVIA)

Closing Remarks (In Main 3D Session Room)IMAPS Microelectronics Foundation Spring Golf Invitational
Desert Canyon Golf Club - 1:15 pm Shotgun Start - “Best Ball” Scramble(Separate Registration - www.imaps.org/DevicePackaging/golf2013.htm)

16Device Packaging Exhibition and Technology Showcase“An opportunity to talk to industry leaders”

Device Packaging 2013 will feature one collective Exhibition and Technology Showcase for vendors andsuppliers who support the many aspects of Device Packaging and each of the topical areas addressed during
this Conference. This venue features an ideal atmosphere for exhibiting companies to showcase their products
and services to key decision making professionals in the industry and for a large focused audience of attendees
to engage these companies about the solutions they need. Full 8' by 10' exhibit booths will be on display.
There is only one exhibit booth still available in the hall – 1 BOOTH REMAINS! The exhibits have sold out eachof the past seven years, and will sell out again this year. If you have questions about exhibiting with IMAPS, or
about getting signed up for the 2013 Device Packaging Conference, contact Brian Schieman atbschieman@imaps.org (202-548-8715). Online at http://www.imaps.org/DevicePackaging/exhibits13.htm.

Exhibit Hours:
Tuesday - March 12

10:00 am - 7:00 pm

Refreshment Breaks, Lunch, and a Reception will be held in the Exhibit Hall.

Wednesday - March 13

12:00 pm - 4:30 pm

Refreshment Breaks, Lunch and a Poster Session will be held in the Exhibit Hall.

For more information, visit:www.imaps.org/devicepackaging or contact IMAPS at 202-548-8715________________________________________________________________________________

Exhibitors on the Device Packaging 2013 USB

IMAPS is offering Exhibiting Companies the opportunity to have an unlimited amount of product promotion
information on the Conference USB. You must submit ONE PDF, Word or Powerpoint file, via e-mail,containing the information you want to appear to bschieman@imaps.org on or before March 14, 2013.
Files must be sent to Brian Schieman (bschieman@imaps.org). Submissions must be as stated and arrive by thedeadline. There is no charge for participation.

Conference USB

Conference HotelIf you are unable to attend the Conference and would like a
copy of the USB of Presentations, you may purchase a copy
by using the registration form. Your copy will be mailed to
you after the event.

RADISSON FORT MCDOWELL RESORT & CASINO

The cost is $200 for members; $300 for nonmembers,* plus
shipping and handling.

By Phone: please reference IMAPS or IMAPS Device Packaging

10438 NORTH FORT MCDOWELL ROAD
SCOTTSDALE/FOUNTAIN HILLS, AZ 85264
PHONE: 480-789-5300 OR 800-333-3333$155/night single/double
Register On-line at:Reserve your copy on-line atwww.imaps.org/devicepackaging or call 202-548-4001.

http://www.radisson.com/reservation/resEntrance.do?pacLink=
Y&promoCode=IMAP13&hotelCode=AZMCDOWE

Hotel Deadline: February 8, 2013

Rates and availability will not be guaranteed after the deadline.

17

Device Packaging Exhibition and Technology Showcase
Exhibiting Companies (as of January 24, 2013)

The exhibit hall is nearly sold out, with only ONE BOOTH still available. The following booths will be on display during Device
Packaging 2013. Please visit the companies’ websites listed below for more information. A floor plan of the exhibit hall can befound on page 19. If you have questions about exhibiting with IMAPS, or about getting signed up for the 2013 Device
Packaging Conference, contact Brian Schieman at bschieman@imaps.org or 202-548-8715.
Company
3D Plus USA

www.3D-plus.com

ACM Research, Inc.
www.acmrcsh.com

AdTech Ceramics

www.adtechceramics.com

AGC Electronics America
www.agcem.com

AI Technology, Inc.

www.aitechnology.com

ALLVIA, Inc.

www.allvia.com

Amicra Microtechnologies GmbHwww.amicra.com

Amkor Technology
www.amkor.com

ASE Group

www.aseglobal.com

ASM Pacific Technology, Ltd.
www.asmpacific.com

Atotech USA, Inc.

www.atotech.com/en/region/americas/usa.html

Axus Technology

www.axustech.com

Azimuth Electronics, Inc.

www.azimuth-electronics.com

Boschman Technologies / Advanced
Packaging Center
www.boschman.com

Chalman Technologies, Inc.
www.cti-rep.com

Cleanlogix LLC

www.cleanlogix.com

CMS Circuit Solutions, Inc.
www.cmscircuitsolutions.com

CPS Technologies Corporationwww.alsic.com

Dow Electronic Materials

www.rohmhaas.com/electronicmaterials

Booth(s)
51
29
26
13
35
39
63

Micro Systems Engineering GmbHwww.endicottinterconnect.com

F&K Delvotec, Inc.
Finetech, Inc.

FRT of America, LLC

16
41
49
03-04
57
65
53
36
15

(shared)07

www.frtofamerica.com

Hesse Mechatronics

01-02

www.hesse-mechatronics.us

IMAT, Inc.

05

www.imatinc.com

Infinite Graphics

19

www.igi.com

Kyocera America, Inc.

33

25

www.finetechusa.com

50

06
58

www.fkdelvotecusa.com

Interconnect Systems, Inc.

62

Booth(s)Endicott Interconnect Technologies

47

DYCONEX AG

www.mst.com/dyconex

Company

48

www.isipkg.com

www.kyocera.com/kai/semiparts

LINTEC OF AMERICA, INC.
www.lintec-usa.com

Micro Hybrid Dimensions, Inc.
www.micro-hybrid.com

Micross Components

22
27
23
64

www.micross.com

Mini-Systems, Inc.

31

www.mini-systemsinc.com

Mitsubishi Materials Corporationwww.mmus.com

NAMICS Corporation

24
42

www.namics.co.jp

nMode Solutions, Inc.

12

www.nmodesolutions.com

Oneida Research Services, Inc.
www.ors-labs.com

Pac Tech Packaging Technologies USA
www.pactech-usa.com

Palomar Technologies, Inc.

28
54
32

www.palomartechnologies.com

www.eastman.com

60

Booth(s)PVA TePla America, Inc.

www.pvateplaamerica.com

Riv, Inc.

www.rivinc.com

Rudolph Technologies, Inc.

www.rudolphtech.com

SANTIERwww.santier.com

Sentec Electro Ceramic & Device Groupwww.sentecee.com

SETNA

www.set-na.com

Sikama International, Inc.

www.sikama.com

Solid State Equipment Corporationwww.ssecusa.com

Sonoscan, Inc.

www.sonoscan.com

STATS ChipPAC, Inc.

www.statschippac.com

Surfx Technologies

www.surfxtechnologies.com

TDI International

www.tdiinternational.com

TechSearch International, Inc.

www.techsearchinc.com

Teledyne Microelectronic Technologies

www.teledynemicro.com

Trace Laboratories, Inc.

www.tracelabs.com

Unisem Groupwww.unisemgroup.com

West Bond, Inc.

www.westbond.com

XIA, LLC

56

www.polysciences.com

Pure Technologies, LLC

20

www.puretechnologies.com

XYZTEC

www.xyztec.com
www.yole.fr

30
55
34
40
45
21
38
61
52
08
11
37
46
09
18
43

44
14

Thank You to the 2013 Exhibitors!

The Exhibit Hall has SOLD OUT for the past
7 years and is expected to sell out again!

Thank you to the Device Packaging Premier Sponsors:

18

59

17

www.xia.com

Yolé Developpement

Polysciences, Inc.

www.mst.com/msegmbh

Dynaloy

Company

Reserve your space today:bschieman@imaps.org

A Decade of
TSV Development*

2000, Solid State Technology Magazine* January
Moore’S Law – The Z DiMenSion“ Investment in technologies that provide both wafer-level vertical miniaturization(wafer thinning) and preparation for vertical integration (through-silicon vias)
makes good sense.” Sergey Savastiouk, Allvia CEO
December 2008, Solid State Technology Magazine

Moore’S Law – The Z DiMenSion: a DecaDe LaTer“There are five steps to be analyzed: feasibility, niche applications,reliability, cost reduction, and high-volume production.” Savastiouk

Through-Silicon Via Foundry
www.allvia.com

Allvia_TenAd_05.indd 1

2/1/12 1:57 PM

IMAPS 2013

46th International Symposium on Microelectronics
Bringing Together the Entire Microelectronics Supply Chain!™

Rosen Centre Hotel, Orlando, Florida - USA

September 29 - October 3, 2013

The 46th International Symposium on Microelectronics will be held at the Rosen Centre Hotel in Orlando, Florida, USA, and is being organized by
the International Microelectronics And Packaging Society (IMAPS). The IMAPS Technical Committee seeks original papers that present progresson technologies throughout the entire microelectronics/packaging supply chain. The 46th Symposium on Microelectronics will cover three tiersof electronics: Systems and Applications; Design and Related Measurements; and Materials, Process and Reliability. IMAPS 2013 will feature
5-6 technical tracks that span the three days of sessions on: 3D IC/Packaging; Modeling, Design & Reliability; Next Generation Materials;
Advanced Technologies; Advanced Packaging; Assembly and Packaging; as well as Invited/Translated Sessions and an Interactive/Academic Poster Session and more.
Sessions are being planned and abstracts will be considered on the topics listed below. Abstracts are rated by the technical committee
members and are selected into the sessions by the session chairs appointed by the technical committee. Authors should identify their preferredsession (topical area) when submitting their abstracts. Abstracts should highlight the major contributions of the work in one or more of theseareas. All abstracts submitted must represent original, previously unpublished work.

General Chair:
Matt Nowak
Qualcomm, Inc.

Technical Chair:

Ivan Ndip
Fraunhofer IZM
Ivan.Ndip@izm.fraunhofer.demnowak@qualcomm.com

Industries Represented

Design and Related Measurements♦ Consumer, Portable, and Wireless♦ Biomedical♦ Telecom♦ Defense and Security♦ Computing and Gaming♦ Automotive, Industrial, Harsh Environment Electronics
Applications♦ 2.5 & 3D Packaging Approaches♦ 3D Simulation and Modeling♦ Electrical Modeling, Signal & Power Integrity♦ Mechanical Modeling and Related Metrology♦ High Performance Interconnects and Boards♦ Embedded and Integrated Passives♦ Wafer Level Packaging / CSP♦ Low Cost Electronics♦ Outsourcing and Supply Chain Management♦ Thermal Management♦ System Packaging♦ Power Management♦ Electromagnetic Interference (EMI)♦ Electrostatic Discharge (ESD) Protection♦ Wireless Sensors and Energy Harvesters♦ Nano-Integrated Packaging♦ Microwave & RF Applications♦ Photonic Packaging♦ Packaging for Harsh Environments♦ MEMS Packaging♦ Biological and Microfluidic Packaging♦ Flip-Chip, Copper Pillar, TSV, Wafer Thinning, Wafer
Bumping♦ 2.5D Silicon/Glass Interposers and 3D Direct Chip
Stacking♦ Polymers, Underfill/Encapsulants and Adhesives♦ Advanced Materials and Novel Assembly Processes♦ Thick / Thin Films♦ Warpage Characterization and Mitigation♦ Pb-Free Solder Materials, RoHS
♦ Packaging Reliability Testing♦ Wirebonding and Stud Bumping

Systems & Applications

Materials, Process, and Reliability“Invited” Sessions

The following special sessions are being considered for IMAPS 2013 and speakers will be invited along these areas:♦ European and Asian Perspectives on Packaging and
System-Integration♦ Microelectronics Activity in the South-East US (Military,
Bio-Medical, Wireless, and other topics)

Interactive Student Poster Session
Student papers will be considered for the interactive session.

Please send your 500 word abstract electronically only using the on-line submittal form at: www.imaps.org/abstracts.htm. All Speakers are required
to pay a reduced registration fee. If you need assistance with the on-line submission form, please email Brian Schieman (bschieman@imaps.org)
or call 202-548-8715.
Final Manuscript Due: July 15, 2013
Abstract Cut-off Date: March 15, 2013
Notice of Acceptance: April 30, 2013

Special Paper Recognition - Cash Awards Offered!

6 “Best of Track” Outstanding Papers - Six $500 Cash Awards
1 “Best Paper of Symposium” - One “best of track” winner receives additional $500 award
Best Paper of Sessions are considered for Best of Symposium and Outstanding Papers

IMAPS Microelectronics Foundation Student Paper Awards
The Foundation is offering cash awards to the best papers submitted and presented by students at IMAPS 2013.
22

IMAPS Calendar of Events (as of January 23, 2013)
Event2013 Conference and Exhibition on
Ceramic Interconnect and Ceramic
Microsystems Technologies(CICMT)

Start Date
4/23/2013

End Date
4/25/2013

2nd Advanced Technology
Workshop and Tabletop Exhibits on
Packaging the Next Generation of
Nano Devices

4/30/2013

5/1/2013

New England Chapter's 40th
Annual Symposium and Exposition

5/7/2013

5/7/2013

Advanced Technology Workshop
and Tabletop Exhibition on
Microelectronic Packaging for
Medical and Hi-Rel Devices

5/13/2013

5/14/2013

Advanced Technology Workshop
and Tabletop Exhibition on
Advanced Electronics for Mobile
Energy Systems (AEMES)

6/6/2013

6/7/2013

HiTEN 2013 - High Temperature
Electronics Network

7/8/2013

7/10/2013

IMAPS 2013 - 46th International
Symposium on Microelectronics

9/29/2013

10/3/201323

Event Description
IMAPS/ACerS 2013 Conference and Exhibition on
Ceramic Interconnect and Ceramic Microsystems
Technologies (CICMT)www.cicmt.org
Early Registration/Hotel Deadline: March 22, 2013
With each new generation of high density devices, thepackaging community faces ever more difficult
challenges. These “nano” topics will be addressed at
this workshop to be held at the College of Nanoscale
Science and Engineering (CNSE) in Albany, New York.
www.imaps.org/nano
Abstract Deadline: March 8, 2013
New England Chapter's 40th Annual Symposium andExposition. Tuesday, May 7, 2013 in Boxborough, MA
www.imapsne.org
This ATW will be held in Downtown Minneapolis. The
combination of advancing demographics (an aging
world population) and an explosion of new microelectronics technology set the stage for significant
improvement and miniaturization in the area of
medical electronics.
www.imaps.org/medical
Abstract Deadline: March 22, 2013
IMAPS and the Space Coast Energy Consortium
present the first annual AEMES Workshop to be heldat the FL Solar Energy Center in Cocoa, Florida.
www.imaps.org/energy
Abstract Deadline: March 29, 2013
HiTEN 2013 International Conference and Exhibition
on High Temperature Electronics Network
www.imaps.org/hiten
Early Registration/Room Deadline: June 14, 2013
IMAPS 2013 will be held at the Rosen Centre, Orlando,
Florida, USA, and is being organized by theInternational Microelectronics Assembly andPackaging Society.
www.imaps2013.org
Abstract Deadline: March 15, 2013

Get Published With IMAPS!

We invite you to submit your technical manuscript(s) for
peer review for an upcoming issue of the Journal of
Microelectronics and Electronic Packaging (JMEP).
The IMAPS Journal is a prestigious, refereed, andarchival publication distributed to a qualified audience
worldwide comprised of IMAPS members, educational
institutions, and corporate libraries. Focused solely on
microelectronics topics and the electronic packaging ofthese technologies, JMEP contains only papers relevant
to your business and industry.
Complete information regarding this publication may be found on the IMAPS website atwww.imaps.org/jmep; however, the key points are:
•
•
•
•
•
•

With such a technically focused publication, you can get to print much faster with JMEP –3-4 months on average from submission to publication.
All submissions must be in electronic format, and should be submitted via E-Mail to
jmep@imaps.org.
Papers should preferably be formatted and submitted in Microsoft Word.
Tables, graphs, and photographs should be submitted at the end of the file and need not
be embedded in the text.
Photographs and other illustrations should preferably be submitted as high resolution files- JPEG, GIF or WMF format preferred.
The Transfer of Copyright form must be filled out on the IMAPS website.
http://www.imaps.org/jmep/copyright.pdf.

Authors of non-published papers that have been printed in other IMAPS publications orpresented at IMAPS workshops are invited to submit updated and/or expanded versions of
their papers for possible publication in the Journal.

Please send all submissions, comments, or questions to
jmep@imaps.org or feel free to contact the phone/e-mailbelow.
IMAPS
611 2nd Street, NE
Washington, DC 20002
Phone: 202-548-8715
E-mail: bschieman@imaps.org
Website: www.imaps.org/jmep24

Program at a Glance
Sunday, March 10

Registration and GBC Welcome Reception: 5:30 pm - 7:00 pm
Speaker Dinner (by Invitation): 7:00 pm - 9:00 pm

Monday, March 11

Registration and Continental Breakfast: 7:00 am - 8:00 am
GBC Conference & PDCs: 8:00 am - 5:00 pm
Device Packaging Conference Professional Development Courses (PDC) - (1/2 Day)
8:00 am - Noon
PDC3
PDC4
PDC5
PDC2
PDC1

2.5D/3D, Flip Chip WLP,
MEMS & LED Packaging
Trends, Updates & Advances
Course Leader: Phillip G.
Creter, Creter & Associates

High-Temperature Electronics - with an Emphasis on
Assembly & Packaging
Course Leader: Randall
Kirschman, Consultant

Recent Advances in Glass &Silicon Interposers for 2.5D
and 3D Integration
Course Leader: Venky
Sundaram, Georgia Instituteof Technology (PRC)

Hermetic Sealing and Testingof Small Volume
MEMS Packages
Course Leader: Thomas J.
Green, TJ Green Associates
LLC

Failure Mode Analysis of Flip
Chip and Advanced Package
and Board Assemblies
Course Leader:
Daniel Baldwin, Engent, Inc.

Device Packaging Conference Professional Development Courses (PDC) - (1/2 Day)
1:00 pm - 5:00 pm
PDC7
PDC8
PDC6
PDC9
PDC10

Fundamentals of Glass
Technology and Applications
for Advanced Semiconductor
Packaging
Course Leader: TJ Kiczenski,
Corning, Inc.

Polymers for Electronic
Packaging
Course Leader: Jeffrey Gotro,
InnoCentrix, LLC

Thermal & Mechanical
Simulation Techniques - An
Introductory Course for 3D
Enablement Professionals
Course Leader: Kamal Karimanal, Cielution LLC

MEMS Reliability andPackaging
Course Leader: Slobodan
Petrovic, Oregon Institute ofTechnology

Basics of Conventional andAdvanced Packaging
Course Leader: Syed Sajid
Ahmad, Center for Nanoscale
Science and Engineering,
NDSU

Welcome Reception: 5:15 pm - 6:45 pm
2013 Texas Hold’em Tournament: 7:00 pm - 10:00 pm
Visit http://www.imaps.org/DevicePackaging/holdem2013.htm for more information. (Limited Seating)

To Benefit the IMAPS Microelectronics Foundation

Tuesday, March 12

Wednesday, March 13

Thursday, March 14

7:00 am - 7:00 pm
Registration

7:00 am - 6:00 pm
Registration

7:00 am - 11:30 am
Registration

8:20 am - 9:55 am
Keynote Presentations

8:00 am - 9:30 am
Keynote Presentations

8:00 am - 9:30 am
Keynote Presentations

10:00 am - 7:00 pm
Exhibits Open

10:00 am - 12:30 pm
Technical Sessions
WA1-WA3

9:45 am - 11:45 am
Technical Sessions
THA1-THA3

12:30 pm - 2:30 pm
Lunch Break In Exhibit Hall
(Food served from 12:30 pm - 1:30 pm)

11:45 am - 12:00 pm
Closing Remarks

10:30 am - 12:30 pm
Technical Session
TA1-TA3
12:30 pm - 2:00 pm
Lunch Break In Exhibit Hall
(Food served from 12:30 pm - 1:30 pm)

12:00 pm - 4:30 pm
Exhibits Open
2:00 pm - 4:30 pm
Poster Session in Exhibit Hall

2:00 pm - 5:45 pm
Technical Sessions
TP1-TP3(Poster setup: 1:30 pm - 2:00 pm)

5:45 pm - 7:00 pm
Reception In Exhibit Hall

2:30 pm - 6:00 pm
Technical Sessions
WP1-WP3

7:00 pm - 8:30 pm
Panel Discussion: Flip Chip &Wafer Level Packaging

6:00 pm - 7:30 pm
Panel Discussion:
3D Integration - Applications
and Production Challenges

25

1:15 pm - 7:00 pm
IMAPS Microelectronics Foundation
Spring Golf Invitational(Separate Registration)
Desert Canyon Golf Club
(www.desertcanyongolf.com)
1:15 pm Shotgun Start“Best Ball” Scramble
See page 14 for more information.

registration Formregister on-Line at www.imaPs.org/DevicePackaging

Device Packaging conference - March 11 - 14, 2013
Member ID# _________________

 Dr.  Mr.  Ms.

First Name________________________________M.I._____________Last Name_______________________________
Company/Affiliation___________________________________________Job Position___________________________
Address___________________________________________________________________________________________
City___________________________ State______ Zip____________ Country____________________________________
Phone________________________ Fax_________________________ Email_____________________________________

Device Conference Fee:GBC Only Fee:
Combo Fee:
Professional Development Course:
Exhibit Booth Fee:
Additional Purchases:

PayMent

DPC13$_____________$_____________$_____________$_____________$_____________$_____________

registration fees: earLy registration enDs 2/8/13
Device conFerence Fees
(On or before 2/8) (After 2/8)

Total Payment Due:$_____________

combo Fees (register For both anD save at Least $100)

Member (IMAPS)*Non-Member*Speaker* Chair* Chapter Officer*
Student*
Exhibits Only (does not include lunch)
Exhibit Lunch (per person/per day) Tuesday Wednesday$675 $775$775 $875$425 $525$275 $375
FREE$30

gbc onLy:

Member (IMAPS)*Non-Member*

$550
$750

$600
$800

Card#______________________________ Exp.___________
Signature ________________________________________

Device & GBC: $100 savings already calculated in price below.
Member (IMAPS)*$1100 $1250
Non-Member*$1400 $1550
Speaker* Chair* Chapter Officer*$850 $1000
Student*$450$600*Includes one-year IMAPS individual membership or membership renewal at no additional charge. Does not apply to corporate or affiliate memberships. Conference Fee
includes access to all technical sessions, all meals listed, welcome reception, and one(1) USB of presentations; USB will contain the extended abstract and presentation as
submitted by the presenter. USB will be mailed 15 business days after the event.

Card billing address, if different from above: (required)

ProFessionaL DeveLoPment courses - 1/2 Day

 Enclosed is a check payable in US funds to IMAPS

Charge my fees to: AMEX  VISA  MC  Discover____________________________________________________________________________________
Email address required to receive confirmation of registration.
For Wire Transfer information call 202-548-4001.
Mail this form with payment to: IMAPS * 611 2nd Street, NE * Washington,
DC 20002-4909. For credit card transactions, register on-line: www.imaps.org;
or register by phone with your credit card by calling 202-548-4001. Additional
information? E-mail: bschieman@imaps.org, or visit our web site: http://www.
imaps.org. Cancellations will be refunded (less a $50 processing fee) only if written notice is postmarked on or before Friday, February 15, 2013. No refunds
will be issued after that date.

Monday, March 11: 8 am - Noon
3D, FC/WLP, MEMS & LED Pckg Trends...PDC1
Glass & Silicon Interposers for 2.5/3D...PDC2
High Temperature Electronics...PDC3
Hermetic Sealing & Testing of MEMS Packages...PDC4
Failure Mode Analysis of Flip Chip & Adv Package...PDC5
Monday, March 11: 1 pm - 5 pm
Fundamentals of Glass Tech & Apps for Semi Pkg...PDC6
Polymers in Semiconductor Packaging...PDC7
Thermal & Mechanical Simulation for 3D...PDC8
MEMS Reliability & Packaging...PDC9
Basics of Conventional & Adv Packaging...PDC10

exhibit booth (march 12 - 13)
IMAPS Corporate MemberNon-Corporate Member

aDDitionaL Purchases

Texas Hold’em Tournament (Limited Seating)USB of Presentations (Member Rate)
USB of Presentations (Non-Member Rate)
Add to Ship

$400
$400
$400
$400
$400

$450
$450
$450
$450
$450

$400
$400
$400
$400
$400

$450
$450
$450
$450
$450

$1300
$2000

$1500
$2200

$50
$50
$200 $200$300 $300$7(US) $25(Int.)

imaPs microeLectronics FounDation sPring goLF invitationaLmarch 14 (Separate regiStration - See page 14)
register on-Line at www.imaPs.org/DevicePackaging/goLF2013.htm

housing (Hotel Cut-off is February 8, 2013)

Radisson Fort McDowell Resort and Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264
Phone: 480-789-5300
By Phone: please mention IMAPS or IMAPS Device Packaging

Online Reservations:www.radisson.com/reservation/resEntrance.do?pacLink=Y&promoCode=IMAP13&hotelCode=AZMCDOWE

Single/Double: $155/night

IMAPS Registration
611 2nd Street, NE
Washington, DC 20002-4909

Presorted
First-Class Mail
U.S. Postage
PAID
Merrifield, VA
Permit No. 6418