ZTE TD-LTE Chipset and Terminal
Product Roadmap

> 内部公开

Introduction to ZTE Terminal IC
W/G90nm

2006

China
Xi’an

China

U.S.

Shanghai

San Jose

TD/G90nm

2007

2008

LTE55nm

2009

2010

LTE40nm

2011

TD/G
CS

LTE28nm

2012

2013

LTE/TD/GCS

Catching up with IC and MODEM technology

U.S.
AustinChina
Nanjing

China

U.S.

Shenzheng

San Diego

800+ employees in 7 locations

ChipsetProtocolstack

Reference
DesignSoftwareplatform

Total Solution
Product
ZTE’s Terminal Total Solution Product© ZTE Corporation. All rights reserved.

> 内部公开Roadmap of ZTE LTE Multi‐Mode Chipset
Data

ZX297500
ZX29750055nm
55nm
2011Q1
2011Q1

Terminal

TD-LTE/FDD LTE/TDSCDMA/GSM
LTE Rel-8; CAT3;
TD-S: HSPA 2.8DL/2.2UL
17*17 mm Package;Interface:USB2.0,SDIO,UART;2011

ZX297502
ZX297502
40nm
40nm
2011Q4
2011Q4

ZX297510
28nm
2013/Q1

ZX297800
ZX297800
28nm
28nm
TBD
TBD

TD-LTE/FDD LTE/TD-SCDMA/GSM

TD-LTE/FDD LTE/TD-SCDMA/GSM

LTE: R8/R9(part); CAT3
TD-S: HSPA 2.8DL/2.2UL
15*15 mm Package;Interface: USB2.0,SDIO,UART;

LTE: R9; CAT4
TD-S: HSPA+ 4.2DL/2.2UL
11*11 mm Package;Interface:USB2.0,SDIO,UART;

LTE-Adv/LTE: R10;
UMTS R10;Interface:USB3.0,HSI,SDIO,UART;

2012

2013

2014

Dual-Layer Beamforming;

LTE-Adv/LTE/TDSCDMA/UMTS/GSM

Smartphone

ZX297550
28nm
2014Q1

Released
PlannedPlanning

TD-LTE/FDD LTE/TDSCDMA/UMTS/GSM
LTE: R9; CAT4
TD-S: HSPA+ 4.2DL/2.2UL
UMTS R9: 42DL/11UL
Quad-A9 AP Inside;
12*12 mm Package;© ZTE Corporation. All rights reserved.

Roadmap of ZTE LTE Multi‐Mode Chipset(Band)
Data

ZX297500
ZX297500
55nm
55nm
2011Q1
2011Q1

Terminal

GSM: Quad Band
TD-SCDMA:
B34,B39,B40
TD-LTE: :B38,B39,B40
LTE FDD:
B7

2011

ZX297502
ZX297502
40nm
40nm
2011Q4
2011Q4
GSM: Quad Band
TD-SCDMA:
B34,B39,B40
TD-LTE: :B38,B39,B40,B41
LTE FDD:
B1,B7,B17,B20,B13,B4

2012

ZX297510
28nm
2013/Q1
GSM: Quad Band
TD-SCDMA:
B34,B39,B40
TD-LTE: :B38,B39,B40,B41
LTE FDD:
B1,B7,B17,B20,B13,B4

2013> 内部公开

ZX297800
ZX297800
28nm
28nm
TBD
TBD
GSM: Quad Band
TD-SCDMA:
B34,B39,B40
WCDMA:
B1,B2,B5,B8,B6
TD-LTE: :B38,B39,B40,B41
LTE FDD:
B1,B7,B17,B20,B13,B4

2014

Smartphone

ZX297550
28nm
2014Q1

Released
PlannedPlanning

GSM: Quad Band
TD-SCDMA:
B34,B39,B40
WCDMA:
B1,B2,B5,B8,B6
TD-LTE: :B38,B39,B40,B41
LTE FDD:
B1,B7,B17,B20,B13,B4© ZTE Corporation. All rights reserved.

> 内部公开ZTE LTE Chipset Bringing You Closer to TD‐LTE:• First priority to support 3GPP TDD technology– Ready for LTE Rel‐9 commercialization– Committed efforts for IOTs
– Chip‐Proven SDR technology to support future 3GPP evolution• Mutli‐mode single Baseband chip solution bringing– Low power consumption: Smartphone solution with a single
ZX297502 or ZX29710 MODEM chip
– Flexible Inter‐RAT strategy implementation: Faster TD‐LTE
deployment with current 2G/3G networks– Faster inter‐RAT operations– World‐wide roaming– Support single‐standby and voice/data dual‐standby• Turn‐key solution– Complete chipset and SW platform– Support available at each step from chipset to LTE terminal© ZTE Corporation. All rights reserved.

> 内部公开

TD‐LTE IOTs with ZTE LTE Chipset (1/3)
China MTnet Lab Certification ‐ Stage 1:TD‐LTE Rel‐8 features
2011Q1

Q2

Q3

Q4

IODT

IOT in Lab

Field inHUAIROU

Field in
11/17 Complete
GUANGZHOUIOT in Lab

Field inSUNYIField in
11/26 Complete
HANGZHOU

IOT in Lab

2012Q1

Q2

12/7Complete

IOT in Lab
IOT in Lab

1/16 Complete

2/5 Complete© ZTE Corporation. All rights reserved.

> 内部公开

TD‐LTE IOTs with ZTE LTE Chipset (2/3)
China MTnet Lab Certification ‐ Stage 2:Required R9 feature: Dual‐Layer Beamforming and etc.,
Multi‐mode Inter‐RAT operation with TD‐SCDMA
2011Q2Q3Q4IOT Lab

2012Q1

Q2

Q3

Mulit‐Modein Huairou R9 Huairou 3/5 Complete
IOTLab Beijing

3/14 Complete© ZTE Corporation. All rights reserved.

> 内部公开

TD‐LTE IOTs with ZTE LTE Chipset (3/3)
Field Testing with China Mobile:
R9 Dual‐Layer Beamforming testing with ZTE in Guangzhou
Inter‐RAT testing with Nokia‐Siemens in Hangzhou
IOT with Alcatel‐Lucent planning
2012Q1Q2Q3Q4

2013Q1Q2

R9（Dual‐Layer IOT/Mulit‐Beamfrming
mode Field

Complete 30 April

IOT/Mulit‐mode Field

Complete 30 April

IOT Field

Complete 30 April

Q3© ZTE Corporation. All rights reserved.

Roadmap of Terminal Product with ZTE Chipset
ZTE Ref Design Product

MF820S2Chipset: ZX297502
Product: TD‐LTE/LTE FDD/TD‐
S/GSM Datacard
Milestone: 2012.4

MF97S
Chipset: ZX297502
Product: TD‐LTE/LTE FDD/TD‐
S/GSM uFi
Milestone: 2012H2(TBD)> 内部公开

Product: TD‐LTE/LTE FDD/TD‐ Product: TD‐LTE/LTE FDD/TD‐
S/GSM Smartphone
S/GSM Datacard
Chipset: ZX297510+AP
Chipset: ZX297510
Milestone: TBD
Milestone: TBD

Released
Planned

MF29S
Chipset: ZX297502
Product: TD‐LTE/LTE FDD/TD‐
S/GSM CPE wit WiFi
Milestone: 2012.5

2012Planning
2013

TSP Solution© ZTE Corporation. All rights reserved.

> 内部公开

MF820S2

stWorld’s
World’s11stTD-LTE/TD-S/FDD/GSM
TD-LTE/TD-S/FDD/GSMChipset
ChipsetSpecifications
Protocol

TD‐LTE/LTE‐FDD/TD‐SCDMA/GSM
LTE Rel.8/Rel.9

ChipsetZTE ZX297502

Radio

TD‐LTE
Band38/39/40
LTE‐ FDD Band7
TD‐SCDMA Band34/39/40
GSM
Band 2/3/5/8

Dimensions

91x34x13.5mm

Bandwidth

LTE: 1.4,3,5,10,15, 20MHz

Peak Data Rate

FDD LTE: DL/UL 100/50 Mbps (Cat 3)
TD‐LTE: DL/UL 68/17 Mbps (Cat 3)

DL MIMO

2x2 MIMO,4*2MIMOInterfaceUSB 2.0OS

Win XP, Win 7
Win Vista, Mac

Milestone

2012.4© ZTE Corporation. All rights reserved.

> 内部公开

MF29S (Indoor CPE)Specifications
ChipsetProtocolZTE ZX297502
TD‐LTE/LTE‐FDD/TD‐SCDMA/GSM
LTE: Rel 8, Rel 9
WiFi: 802.11 b/g/n

Radio

TD‐LTE
Band38/Band39/Band40
LTE‐ FDD Band7
TD‐SCDMA Band34/Band39/Band40
GSM
Band2/Band3/Band5/Band8

Bandwidth

LTE: 1.4, 3, 5, 10, 15, 20MHz

Dimensions

202 x 160 x 30.5 mm

Peak Data Rate

FDD LTE: DL/UL 100/50 Mbps (Cat 3)
TD‐LTE: DL/UL 68/17 Mbps (Cat 3)

DL MIMO

2x2 MIMO、4x2 MIMOInterface

4RJ45, 2RJ11, USB 2.0

Web GUI OS
Compatibility

Win XP, Win Vista, Win7, Mac OS

AdvancedFeatures

Web GUI (Customized )Milestone

2012.5© ZTE Corporation. All rights reserved.

> 内部公开

MF97S

Specifications
ChipsetZTE ZX297502

Protocol

LTE: Rel 8, Rel 9
WiFi: 802.11 b/g/n

Radio

TD‐LTE
Band38/Band39/Band40
LTE‐ FDD Band7
TD‐SCDMA Band34/Band39/Band40

Bandwidth

LTE: 10, 20MHz

Dimensions

TBD

Peak Data Rate

FDD LTE: DL/UL 100/50 Mbps (Cat 3)
TD‐LTE: DL/UL 68/17 Mbps (Cat 3)

Interface

MicroUSB port, standard USIM,
Micro SD slot(up to 32GB) ,Power button, WPS button

OS

Win XP, Win Vista, WIN7,Mac OS

Function

Up to 10 WiFi devices

AdvancedFeatures

Auto‐install, VPN, OTABattery

3000 mAh, Li‐Ion battery

Milestone

TBD© ZTE Corporation. All rights reserved.

Thanks!

© ZTE Corporation. All rights reserved.