Acknowledgement
I would like to express my sincere gratitude to all speakers, chair persons,sponsors, committee members and all participants for their contribution to thesuccess of the workshop.
Tadatomo Suga, Conference Chair2017 5th International Workshop on
Low Temperature Bonding for 3D Integration
Ito International Research Center Symposium
The University of Tokyo
http://www.3dwb.org/

May 16 -18, 2017

General session: May 16 -17
General session & Student session: May 18
The University of Tokyo
Ito International Research Center, Tokyo

Organized by■

Organized by191st Committee on Innovative Interface Bonding Technology,
Japan Society for the Promotion of Science (JSPS)Co-sponsored byIEEE CPMT Society, Japan Chapter■ The Japan Society of Applied Physics■ Institute for Advanced Microsystem Integration (IMSI)■ The Precise Measurement Technology Promotion Foundation (PMTPF)■ Ito International Research Center, The University of Tokyo■

Past meetings
International Workshop on Low Temperature Bonding for 3D Integration■ 1stNovember 8-9, 2007, IEEE-CPMT■ 2nd

January 19-20, 2010, IEEE-CPMT■ 3rd

May 22 -23,

2012, IEEE-CPMT■ 4thJuly 15 -16,

2014, IEEE-CPMT■ 5th

May 16 -18,

2017, JSPS & IEEE-CPMTLTB-3D 2017
■ Oral Sessions■ SURFACE ACTIVATED BONDING (SAB)■ MEMS and SENSOR INTEGRATION■ LOW-TEPMERATURE BONDING and APPLICATIONS■ BONDING PROCESS INTEGRATION■ HETERO-INTEGRATION■ PACKAGING INTEGRATION■ Short presentations & Posters■ Student session■ Tutorial

May 16, Tuesday
8:30 REGISTRATION
9:00 OPENING REMARKS
9:20 SURFACE ACTIVATED BONDING (SAB) I
10:40 SURFACE ACTIVATED BONDING (SAB) II
12:20 LUNCH
13:50 MEMS and SENSOR INTEGRATION
16:50 LOW-TEPMERATURE BONDING and APPLICATIONSMay 17, Wednesday
8:30 BONDING PROCESS INTEGRATION
10:50 SHORT PRESENTAION for Poster11:50 LUNCH / POSTER
13:20 STUDENT SESSION SHORT PRESENTAION for Poster
14:40 POSTER
15:30 HETERO-INTEGRATION
17:30 RECEPTION (Bus Transfer to Tokyo Bay Cruise)
May 18, Thursday
8:30 STUDENT SESSION
11:45 LUNCH
13:40 PACKAGING INTEGRATION
16:30 TUTORIAL
17:30 AWARDS
17:50 CLOSING REMARKS
18:30 STUDENT RECEPTION (Restaurant Abreuvoir)

LTB-3D 2017 summary■Presentations: 85 + Tutorial 1■ Keynotes 6, Oral presentations 38, Short & poster presentation 41■

Participants: 235■ Japan 189, Oversea 46 from Austria, Belgium, Canada, China, Denmark, France,Germany, India, Netherlands, Norway, Korea, Singapore, Taiwan, UK, USA■ Students 39, Univ./Research 62, Industries 134
Student 17%

Industry 57%
Univ./Research 26%

Financial Support / Exhibition

International network

Austria, Belgium, Canada, China, Denmark, France, Germany, India,Netherlands, Norway, Korea, Singapore, Taiwan, UK, USA• JUJUh”Night cruise around Tokyo Bay”

Organizing Committee
Name+Affiliation

Role

Tadatomo Suga

The University of Tokyo

Conferece Chair

Takehito Shimatsu

Tohoku University

Conferece Vice Chair

Hideki Takagi

AIST

Technical Committee Chair

Hiroyuki Ishida

Suss MicroTec AG.

Technical Committee Vice Chair

Noriaki Toyoda

University of Hyogo

Technical Committee Vice Chair

Eiji Higurashi

The University of Tokyo

Publication Committee Chair

Naoki Shigekawa

Osaka City University

Publication Committee Vice Chair

Masahisa Fujino

The University of Tokyo

Publication Committee Vice Chair

Natsuko Kawamata

The University of Tokyo

Finance, Public Relations, Administration+ Hula, Book cover design, Shirts design

Upcoming conferences■ WaferBond ’17■ Leuven (Belgium), November 27-29, 2017

■ ECS 15th International Symposium on

Semiconductor Wafer Bonding: Science, Technology andApplications■ Cancun (Mexico), September 30 – October 4, 2018
■ WaferBond ’19 East - LTB-3D 2019 ■ Kanazawa (Japan), May 22- May 24, 2019

LTB-3D Student Session■Student steering committee
K. Takeuchi, PhD candidate, The University of Tokyo (Committee Chair)
K. Jerchel, PhD candidate, The University of Tokyo (Committee vice Chair)
N. Sekine, Master course 2nd, The University of Tokyo
W. Fu, PhD candidate, Waseda University
S. Yamajou, PhD candidate, Osaka City University
M. Khairi Faiz, PhD candidate, Waseda University
S. Choowitsakunlert, PhD candidate, Shibaura Institute of Technology
S. Yahagi, Master course 2nd, Toyota Technological InstituteB. Miao, PhD candidate, The University of Tokyo
S. Ikeda, Master course 1st, University of Hyogo
K. Watanabe, Master course 2nd, Shibaura Institute of Technology

University-Industry Cooperative Research Committees

The 191st Committee on Innovative Interface Bonding Technology
Established on October 1st, 2015
■ Members: Academia 23MIndustry 31■■

To survey the latest R&D trends in interface bonding so as tonavigate R&D direction in advancing bonding technologies,
systematize the theory for the interface generation and propose newprocesses for achieving them.

26 Academia Members
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